A method of manufacturing a three-dimensional multi-layer electronic device , comprising: a unit forming process (P10) of forming multi-layer units including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process (P12) of manufacturing a three-dimensional multi-layer electronic device by laying out the multi-layer units integrally in a vertical direction, wherein the unit forming process (P10) includes: a resin multi-layer forming step (S10) of forming multiple resin layers for each multi-layer unit by ejection of ultraviolet curable resin and subsequent flattening and curing of the ultraviolet curable resin, a conductive terminal forming step (S20) of forming a conductive terminal in a multi-layer unit , which is to be an upper multi-layer unit , for electrical connection to a lower multi-layer unit when the multi-layer units are laid out in the vertical direction, and a circuit wiring forming step (S30) of forming a circuit wiring for each multi-layer unit by ejection of metal ink according to a wiring circuit pattern and subsequent sintering of the metal ink, wherein the electronic component of a multi-layer unit , which is to be a lower multi-layer unit , includes: a connection pin for electrical connection to a conductive terminal of an upper multi-layer unit when the multi-layer units are laid out in the vertical direction. a unit forming process (P10) of forming multi-layer units including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process (P12) of manufacturing a three-dimensional multi-layer electronic device by laying out the multi-layer units integrally in a vertical direction, wherein the unit forming process (P10) includes: a resin multi-layer forming step (S10) of forming multiple resin layers for each multi-layer unit by ejection of ultraviolet curable resin and subsequent flattening and curing of the ultraviolet curable resin, a conductive terminal forming step (S20) of forming a conductive terminal in a multi-layer unit , which is to be an upper multi-layer unit , for electrical connection to a lower multi-layer unit when the multi-layer units are laid out in the vertical direction, and a circuit wiring forming step (S30) of forming a circuit wiring for each multi-layer unit by ejection of metal ink according to a wiring circuit pattern and subsequent sintering of the metal ink, wherein the electronic component of a multi-layer unit , which is to be a lower multi-layer unit , includes: a connection pin for electrical connection to a conductive terminal of an upper multi-layer unit when the multi-layer units are laid out in the vertical direction. a resin multi-layer forming step (S10) of forming multiple resin layers for each multi-layer unit by ejection of ultraviolet curable resin and subsequent flattening and curing of the ultraviolet curable resin, a conductive terminal forming step (S20) of forming a conductive terminal in a multi-layer unit , which is to be an upper multi-layer unit , for electrical connection to a lower multi-layer unit when the multi-layer units are laid out in the vertical direction, and a circuit wiring forming step (S30) of forming a circuit wiring for each multi-layer unit by ejection of metal ink according to a wiring circuit pattern and subsequent sintering of the metal ink, wherein the electronic component of a multi-layer unit , which is to be a lower multi-layer unit , includes: a connection pin for electrical connection to a conductive terminal of an upper multi-layer unit when the multi-layer units are laid out in the vertical direction. <EOS>