Method for manufacturing integrated infrared emitter elements having an optical filter , comprising: providing a carrier substrate having a target thickness (t B ), wherein an insulating material layer and a structured conductive layer are arranged on a first main surface region (220-A) of the carrier substrate , wherein the insulating material layer is arranged between the carrier substrate and the structured conductive layer , back side etching through the carrier substrate for providing cavities extending between the first and second main surface regions of the carrier substrate , wherein the cavities define a frame structure (220-1) which laterally surrounds the cavities , wherein first portions (230-1) of the structured conductive layer which span the cavities form active heating regions (230-1) of the infrared emitter elements , and wherein second and third portions (230-2, 230-3) of the structured conductive layer which are supported by the frame structure form first and second contact pads (230-2, 230-3) of the infrared emitter elements , forming adhesive spacer elements on portions of the structured conductive layer , which are supported by the frame structure (220-1), placing a filter substrate having a filter carrier substrate and a filter layer on the adhesive spacer elements , so that the filter layer is arranged between the adhesive spacer elements and the filter carrier substrate , fixing the adhesive spacer elements to the carrier substrate and the filter carrier substrate by curing the material of the adhesive spacer elements , pre-dicing through the filter substrate for exposing the contact pads (230-2, 230-3) of the structured conductive layer , and dicing through the frame structure (220-1) of the carrier substrate for separating the integrated infrared emitter elements having the optical filter . providing a carrier substrate having a target thickness (t B ), wherein an insulating material layer and a structured conductive layer are arranged on a first main surface region (220-A) of the carrier substrate , wherein the insulating material layer is arranged between the carrier substrate and the structured conductive layer , back side etching through the carrier substrate for providing cavities extending between the first and second main surface regions of the carrier substrate , wherein the cavities define a frame structure (220-1) which laterally surrounds the cavities , wherein first portions (230-1) of the structured conductive layer which span the cavities form active heating regions (230-1) of the infrared emitter elements , and wherein second and third portions (230-2, 230-3) of the structured conductive layer which are supported by the frame structure form first and second contact pads (230-2, 230-3) of the infrared emitter elements , wherein first portions (230-1) of the structured conductive layer which span the cavities form active heating regions (230-1) of the infrared emitter elements , and wherein second and third portions (230-2, 230-3) of the structured conductive layer which are supported by the frame structure form first and second contact pads (230-2, 230-3) of the infrared emitter elements , forming adhesive spacer elements on portions of the structured conductive layer , which are supported by the frame structure (220-1), placing a filter substrate having a filter carrier substrate and a filter layer on the adhesive spacer elements , so that the filter layer is arranged between the adhesive spacer elements and the filter carrier substrate , fixing the adhesive spacer elements to the carrier substrate and the filter carrier substrate by curing the material of the adhesive spacer elements , pre-dicing through the filter substrate for exposing the contact pads (230-2, 230-3) of the structured conductive layer , and dicing through the frame structure (220-1) of the carrier substrate for separating the integrated infrared emitter elements having the optical filter . <EOS>