A component mounting machine which is configured to mount an electronic component onto a circuit substrate , comprising: a conveyance lane which is configured to convey the circuit substrate ; a component feeder which is disposed at a position distanced from the conveyance lane and which is configured to house the electronic component ; a suction nozzle which is configured to pick up the electronic component by suctioning an upper face of the electronic component ; a transfer head which is configured to support the suction nozzle and to move the suction nozzle relative to the component feeder and the circuit substrate conveyed in the conveyance lane such that the suction nozzle is configured to pick up the electronic component supplied from the component feeder and to mount the electronic component picked up by the suction nozzle onto the circuit substrate conveyed by the conveyance lane ; a fixed camera which is configured to monitor an inner portion of the component mounting machine ; a display section which is capable of displaying a captured image of the fixed camera ; and a control device which is configured to control operations of the transfer head , characterized in that the fixed camera is disposed in the inner portion of the component mounting machine on a side more distanced from a mounting position (B), at which the electronic component is mounted onto the circuit substrate , than a pickup position (A), at which the suction nozzle picks up the electronic component which is supplied from the component feeder , in a first direction joining the pickup position (A) and the mounting position (B), so that the pickup position (A) is positioned between the mounting position (B) and the fixed camera , and the fixed camera is capable of imaging a range from the pickup position (A) to the mounting position (B) including the distance between the component feeder and the conveyance lane within a single image. a conveyance lane which is configured to convey the circuit substrate ; a component feeder which is disposed at a position distanced from the conveyance lane and which is configured to house the electronic component ; a suction nozzle which is configured to pick up the electronic component by suctioning an upper face of the electronic component ; a transfer head which is configured to support the suction nozzle and to move the suction nozzle relative to the component feeder and the circuit substrate conveyed in the conveyance lane such that the suction nozzle is configured to pick up the electronic component supplied from the component feeder and to mount the electronic component picked up by the suction nozzle onto the circuit substrate conveyed by the conveyance lane ; a fixed camera which is configured to monitor an inner portion of the component mounting machine ; a display section which is capable of displaying a captured image of the fixed camera ; and a control device which is configured to control operations of the transfer head , characterized in that the fixed camera is disposed in the inner portion of the component mounting machine on a side more distanced from a mounting position (B), at which the electronic component is mounted onto the circuit substrate , than a pickup position (A), at which the suction nozzle picks up the electronic component which is supplied from the component feeder , in a first direction joining the pickup position (A) and the mounting position (B), so that the pickup position (A) is positioned between the mounting position (B) and the fixed camera , and the fixed camera is capable of imaging a range from the pickup position (A) to the mounting position (B) including the distance between the component feeder and the conveyance lane within a single image. <EOS>