An adhesive film for processing a semiconductor wafer and for protecting a surface of a semiconductor wafer or fixing the semiconductor wafer comprising: a base material layer and an ultraviolet-curable adhesive resin layer provided on one surface side of the base material layer, wherein the adhesive resin layer includes an ultraviolet-curable adhesive resin, wherein a saturated electrostatic potential V 1 of the adhesive resin layer surface after ultraviolet curing, which is measured using a method described below, is equal to or less than 2.0 kV, (method) ultraviolet rays having a main wavelength of 365 nm are radiated to the adhesive resin layer using a high-pressure mercury lamp in an environment of 25°C at a radiation intensity of 100 mW/cm 2 and an ultraviolet amount of 1,080 mJ/cm 2 , thereby photocuring the adhesive resin layer, and then a voltage is applied to a surface of the adhesive resin layer for 30 seconds under conditions of an applied voltage of 10 kV, a distance between a specimen and electrodes of 20 mm, 25°C, and 50%RH, and the saturated electrostatic potential (V 1 ) of the surface of the adhesive resin layer is computed according to JIS L1094, wherein the adhesive resin layer has an antistatic layer and an adhesive layer in this order from the base material layer side, wherein the adhesive resin layer further has an unevenness-absorbing resin layer between the base material layer and the antistatic layer, and a thickness of the adhesive layer is less than 30 um, wherein the ultraviolet-curable adhesive resin includes a (meth)acrylic adhesive resin having a photopolymerizable carbon-carbon double bond in a molecule, and wherein the resin constituting the unevenness-absorbing resin layer includes one, two or more selected from the group consisting of olefin-based resins, ethylene·polar monomer copolymers, ABS resins, vinyl chloride resins, vinylidene chloride resins, (meth)acrylic resins, polyamide resins, and fluorine-based resins. wherein the adhesive resin layer includes an ultraviolet-curable adhesive resin, wherein a saturated electrostatic potential V 1 of the adhesive resin layer surface after ultraviolet curing, which is measured using a method described below, is equal to or less than 2.0 kV, (method) ultraviolet rays having a main wavelength of 365 nm are radiated to the adhesive resin layer using a high-pressure mercury lamp in an environment of 25°C at a radiation intensity of 100 mW/cm 2 and an ultraviolet amount of 1,080 mJ/cm 2 , thereby photocuring the adhesive resin layer, and then a voltage is applied to a surface of the adhesive resin layer for 30 seconds under conditions of an applied voltage of 10 kV, a distance between a specimen and electrodes of 20 mm, 25°C, and 50%RH, and the saturated electrostatic potential (V 1 ) of the surface of the adhesive resin layer is computed according to JIS L1094, wherein the adhesive resin layer has an antistatic layer and an adhesive layer in this order from the base material layer side, wherein the adhesive resin layer further has an unevenness-absorbing resin layer between the base material layer and the antistatic layer, and a thickness of the adhesive layer is less than 30 um, wherein the ultraviolet-curable adhesive resin includes a (meth)acrylic adhesive resin having a photopolymerizable carbon-carbon double bond in a molecule, and wherein the resin constituting the unevenness-absorbing resin layer includes one, two or more selected from the group consisting of olefin-based resins, ethylene·polar monomer copolymers, ABS resins, vinyl chloride resins, vinylidene chloride resins, (meth)acrylic resins, polyamide resins, and fluorine-based resins. <EOS>