An ultrasonic probe comprising: a piezoelectric layer configured to generate ultrasonic waves; a sound layer provided on a rear side of the piezoelectric layer ; a flexible printed circuit board provided on a rear side of the sound layer ; and a sound absorption layer configured to absorb the ultrasonic waves generated by the piezoelectric layer and propagating toward a rear surface of the ultrasonic probe, the sound absorption layer being provided on a rear surface of the flexible printed circuit board , wherein the piezoelectric layer comprises a kerf configured to divide the piezoelectric layer in a direction of elevation, the sound layer comprises a funnel extending in a direction extending from a front side of the sound layer to the rear side of the sound layer to divide the sound layer ; and the flexible printed circuit board includes a plurality of divided first electrodes (132-1), a second electrode (132-3), and a polyimide film (132-2) disposed between the plurality of divided first electrodes (132-1) and the second electrode (132-3), the ultrasonic probe being characterized in that the funnel comprises: a first section connected to the piezoelectric layer ; and a second section connected to the flexible printed circuit board , wherein the first section is provided at a location corresponding to the kerf to be connected to the kerf , wherein a width of the kerf is the same as that of the first section and wherein the width of the first section is constant, and less than the width of the second section , which increases as the distance between the second section and the electrodes decreases such that the second section has a semicircular cross section. a piezoelectric layer configured to generate ultrasonic waves; a sound layer provided on a rear side of the piezoelectric layer ; a flexible printed circuit board provided on a rear side of the sound layer ; and a sound absorption layer configured to absorb the ultrasonic waves generated by the piezoelectric layer and propagating toward a rear surface of the ultrasonic probe, the sound absorption layer being provided on a rear surface of the flexible printed circuit board , wherein the piezoelectric layer comprises a kerf configured to divide the piezoelectric layer in a direction of elevation, the sound layer comprises a funnel extending in a direction extending from a front side of the sound layer to the rear side of the sound layer to divide the sound layer ; and the flexible printed circuit board includes a plurality of divided first electrodes (132-1), a second electrode (132-3), and a polyimide film (132-2) disposed between the plurality of divided first electrodes (132-1) and the second electrode (132-3), the ultrasonic probe being characterized in that the funnel comprises: a first section connected to the piezoelectric layer ; and a second section connected to the flexible printed circuit board , wherein the first section is provided at a location corresponding to the kerf to be connected to the kerf , wherein a width of the kerf is the same as that of the first section and wherein the width of the first section is constant, and less than the width of the second section , which increases as the distance between the second section and the electrodes decreases such that the second section has a semicircular cross section. a first section connected to the piezoelectric layer ; and a second section connected to the flexible printed circuit board , wherein the first section is provided at a location corresponding to the kerf to be connected to the kerf , wherein a width of the kerf is the same as that of the first section and wherein the width of the first section is constant, and less than the width of the second section , which increases as the distance between the second section and the electrodes decreases such that the second section has a semicircular cross section. <EOS>