An installation bracket , configured to carry a process cartridge , comprising: a bracket main body ; and a connection portion , disposed on the bracket main body , wherein: the connection portion includes a conductive portion , configured to electrically connect a contact portion of a chip on the process cartridge and an electrical contact portion of an image-forming apparatus ; the bracket main body includes a first side plate and a second side plate arranged sequentially along a first direction X, and the connection portion is located on the second side plate ; when the installation bracket is installed in the image-forming apparatus , the second side plate is adjacent to the electrical contact portion of the image-forming apparatus relative to the first side plate ; and when the installation bracket is configured to carry the process cartridge , the connection portion is capable of being electrically connected to the process cartridge , characterized in that , the connection portion is higher than the second side plate along a third direction Z; and the third direction Z is a height direction of the second side plate and intersects with the first direction X. a bracket main body ; and a connection portion , disposed on the bracket main body , wherein: the connection portion includes a conductive portion , configured to electrically connect a contact portion of a chip on the process cartridge and an electrical contact portion of an image-forming apparatus ; the bracket main body includes a first side plate and a second side plate arranged sequentially along a first direction X, and the connection portion is located on the second side plate ; when the installation bracket is installed in the image-forming apparatus , the second side plate is adjacent to the electrical contact portion of the image-forming apparatus relative to the first side plate ; and when the installation bracket is configured to carry the process cartridge , the connection portion is capable of being electrically connected to the process cartridge , characterized in that , the connection portion is higher than the second side plate along a third direction Z; and the third direction Z is a height direction of the second side plate and intersects with the first direction X. the connection portion includes a conductive portion , configured to electrically connect a contact portion of a chip on the process cartridge and an electrical contact portion of an image-forming apparatus ; the bracket main body includes a first side plate and a second side plate arranged sequentially along a first direction X, and the connection portion is located on the second side plate ; when the installation bracket is installed in the image-forming apparatus , the second side plate is adjacent to the electrical contact portion of the image-forming apparatus relative to the first side plate ; and when the installation bracket is configured to carry the process cartridge , the connection portion is capable of being electrically connected to the process cartridge , characterized in that , the connection portion is higher than the second side plate along a third direction Z; and the third direction Z is a height direction of the second side plate and intersects with the first direction X. <EOS>