A method of manufacturing a package having a main body , a peelable flap portion , and a package integrity feature, the method comprising: laminating an outer film layer to an inner film layer , wherein a permanent adhesive is pattern applied to an inner surface of a respective one of the inner film layer or the outer film layer and wherein a pressure sensitive adhesive is applied to the inner surface of a peripheral portion of the respective one of the inner or outer film layer ; forming an outer die cut in a peripheral edge of the peripheral portion of the outer film layer to define a peelable flap portion ; forming a main die cut portion in the inner film layer to define a location of an opening of the package; forming each of first and second die cut portions in the inner film layer continuously with formation of the other of the first and second die cut portions and continuously with formation of the main die cut portion , wherein the first and second die cut portions define a package integrity feature of the package , and wherein forming the first and second die cut portions comprises: defining a neck region of the package integrity feature having a reduced width and configured to tear as an opening force is applied to the package by a user, wherein tearing of the neck region provides access, via the opening , to contents stored within the package in a tamper evident manner, and defining an anchor region configured to resist the opening force applied by the user such that the neck region tears in response to application of the opening force. laminating an outer film layer to an inner film layer , wherein a permanent adhesive is pattern applied to an inner surface of a respective one of the inner film layer or the outer film layer and wherein a pressure sensitive adhesive is applied to the inner surface of a peripheral portion of the respective one of the inner or outer film layer ; forming an outer die cut in a peripheral edge of the peripheral portion of the outer film layer to define a peelable flap portion ; forming a main die cut portion in the inner film layer to define a location of an opening of the package; forming each of first and second die cut portions in the inner film layer continuously with formation of the other of the first and second die cut portions and continuously with formation of the main die cut portion , wherein the first and second die cut portions define a package integrity feature of the package , and wherein forming the first and second die cut portions comprises: defining a neck region of the package integrity feature having a reduced width and configured to tear as an opening force is applied to the package by a user, wherein tearing of the neck region provides access, via the opening , to contents stored within the package in a tamper evident manner, and defining an anchor region configured to resist the opening force applied by the user such that the neck region tears in response to application of the opening force. defining a neck region of the package integrity feature having a reduced width and configured to tear as an opening force is applied to the package by a user, wherein tearing of the neck region provides access, via the opening , to contents stored within the package in a tamper evident manner, and defining an anchor region configured to resist the opening force applied by the user such that the neck region tears in response to application of the opening force. <EOS>