A device comprising: a region comprising an integrated device; and a heat dissipating device coupled to the region comprising the integrated device, the heat dissipating device configured to dissipate heat away from the region, wherein the heat dissipating device comprises: a fluid ; an evaporator configured to evaporate the fluid ; a condenser configured to condense the fluid ; an inner wall coupled to the evaporator and the condenser , wherein the inner wall is a separation wall that prevents fluid leaving from the evaporator from mixing with fluid leaving from the condenser ; an outer shell encapsulating the fluid , the evaporator , the condenser and the inner wall; an evaporation portion configured to channel the fluid from the evaporator to the condenser; a plurality of evaporation portion walls in the evaporation portion; a collection portion configured to channel the fluid from the condenser to the evaporator ; and at least one piezo structure configured to move fluid inside the heat dissipating device ; and characterized in that the at least one piezo structure is configured to be in contact with the fluid moving inside the heat dissipating device . a region comprising an integrated device; and a heat dissipating device coupled to the region comprising the integrated device, the heat dissipating device configured to dissipate heat away from the region, wherein the heat dissipating device comprises: a fluid ; an evaporator configured to evaporate the fluid ; a condenser configured to condense the fluid ; an inner wall coupled to the evaporator and the condenser , wherein the inner wall is a separation wall that prevents fluid leaving from the evaporator from mixing with fluid leaving from the condenser ; an outer shell encapsulating the fluid , the evaporator , the condenser and the inner wall; an evaporation portion configured to channel the fluid from the evaporator to the condenser; a plurality of evaporation portion walls in the evaporation portion; a collection portion configured to channel the fluid from the condenser to the evaporator ; and at least one piezo structure configured to move fluid inside the heat dissipating device ; and characterized in that the at least one piezo structure is configured to be in contact with the fluid moving inside the heat dissipating device . a fluid ; an evaporator configured to evaporate the fluid ; a condenser configured to condense the fluid ; an inner wall coupled to the evaporator and the condenser , wherein the inner wall is a separation wall that prevents fluid leaving from the evaporator from mixing with fluid leaving from the condenser ; an outer shell encapsulating the fluid , the evaporator , the condenser and the inner wall; an evaporation portion configured to channel the fluid from the evaporator to the condenser; a plurality of evaporation portion walls in the evaporation portion; a collection portion configured to channel the fluid from the condenser to the evaporator ; and at least one piezo structure configured to move fluid inside the heat dissipating device ; and characterized in that the at least one piezo structure is configured to be in contact with the fluid moving inside the heat dissipating device . <EOS>