Release system configured for space systems, including a segmented structural element that comprises a first segment configured to be coupled to a first structure and a second segment configured to be coupled to a second structure, wherein said first and second structures are respectively: • a satellite/spacecraft and a deployable appendage/apparatus of said satellite/spacecraft; or • a launch vehicle and a satellite/spacecraft to be launched by said launch vehicle; or • a first component/apparatus and a second component/apparatus of a satellite/spacecraft/launch vehicle designed to fragment before or during re-entry into the Earth's atmosphere; wherein the segmented structural element further comprises a solder joint joining respective ends of said first and second segments, thus holding down the first and second structures with respect to one another; wherein said solder joint is electromagnetically heatable and includes a solder alloy having a predefined melting temperature; characterized by further including magnetic field generating means (13;PW1;PW2;PW3;PW4;PW5;PW5a;PW5b;PW5c) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first and second segments is caused, thus enabling release of the first and second structures from one another. • a satellite/spacecraft and a deployable appendage/apparatus of said satellite/spacecraft; or • a launch vehicle and a satellite/spacecraft to be launched by said launch vehicle; or • a first component/apparatus and a second component/apparatus of a satellite/spacecraft/launch vehicle designed to fragment before or during re-entry into the Earth's atmosphere; wherein the segmented structural element further comprises a solder joint joining respective ends of said first and second segments, thus holding down the first and second structures with respect to one another; wherein said solder joint is electromagnetically heatable and includes a solder alloy having a predefined melting temperature; characterized by further including magnetic field generating means (13;PW1;PW2;PW3;PW4;PW5;PW5a;PW5b;PW5c) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first and second segments is caused, thus enabling release of the first and second structures from one another. wherein the segmented structural element further comprises a solder joint joining respective ends of said first and second segments, thus holding down the first and second structures with respect to one another; wherein said solder joint is electromagnetically heatable and includes a solder alloy having a predefined melting temperature; characterized by further including magnetic field generating means (13;PW1;PW2;PW3;PW4;PW5;PW5a;PW5b;PW5c) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first and second segments is caused, thus enabling release of the first and second structures from one another. <EOS>