A method of manufacturing a flexible array substrate, comprising Step S1: providing a rigid support plate , forming an adhesive layer on the rigid support plate , and forming a passivation layer on the adhesive layer ; wherein the method further comprises the following steps: Step S2: forming a back-side drive circuit on the passivation layer and covering the back-side drive circuit with a planarization layer ; Step S3: forming a flexible backing plate on the planarization layer ; Step S4: forming a via in the flexible backing plate and the planarization layer to extend through the flexible backing plate and the planarization layer ; Step S5: forming a front-side drive circuit and a display circuit that is in electrical connection with the front-side drive circuit on the flexible backing plate , such that the front-side drive circuit is electrically connected, through the via , to the back-side drive circuit , wherein the display circuit comprises a plurality of data lines and a plurality of scan lines, wherein the plurality of data lines and the plurality of scan lines perpendicularly intersect to form a plurality of pixel units; and Step S6: peeling off the rigid support plate and the adhesive layer to obtain a flexible array substrate. Step S1: providing a rigid support plate , forming an adhesive layer on the rigid support plate , and forming a passivation layer on the adhesive layer ; wherein the method further comprises the following steps: Step S2: forming a back-side drive circuit on the passivation layer and covering the back-side drive circuit with a planarization layer ; Step S3: forming a flexible backing plate on the planarization layer ; Step S4: forming a via in the flexible backing plate and the planarization layer to extend through the flexible backing plate and the planarization layer ; Step S5: forming a front-side drive circuit and a display circuit that is in electrical connection with the front-side drive circuit on the flexible backing plate , such that the front-side drive circuit is electrically connected, through the via , to the back-side drive circuit , wherein the display circuit comprises a plurality of data lines and a plurality of scan lines, wherein the plurality of data lines and the plurality of scan lines perpendicularly intersect to form a plurality of pixel units; and Step S6: peeling off the rigid support plate and the adhesive layer to obtain a flexible array substrate. Step S2: forming a back-side drive circuit on the passivation layer and covering the back-side drive circuit with a planarization layer ; Step S3: forming a flexible backing plate on the planarization layer ; Step S4: forming a via in the flexible backing plate and the planarization layer to extend through the flexible backing plate and the planarization layer ; Step S5: forming a front-side drive circuit and a display circuit that is in electrical connection with the front-side drive circuit on the flexible backing plate , such that the front-side drive circuit is electrically connected, through the via , to the back-side drive circuit , wherein the display circuit comprises a plurality of data lines and a plurality of scan lines, wherein the plurality of data lines and the plurality of scan lines perpendicularly intersect to form a plurality of pixel units; and Step S6: peeling off the rigid support plate and the adhesive layer to obtain a flexible array substrate. <EOS>