mhurhangee/patent-ind-claim-en huggingface dataset:
A telescopic power supply track, comprising: a housing with a hollow cavity, and a sliding device with one end extending into the cavity of the housing and slidingly connected to the housing ; the housing is provided with an input wire at one end and an output wire at the other end, the sliding device is electrically connected to the input wire and the output wire respectively, and the extension length of the output wire relative to the housing changes accordingly during the sliding of the sliding device along the length direction of the housing , wherein the sliding device comprises a casing that extends into the cavity of the housing at one end and can move along the length direction of the housing , and a power taking component that is cooperatively connected to the casing , and the power taking component is electrically connected to the input wire and the output wire respectively, and the output wire extends from other end of the casing , characterized in that the power taking component includes two conductive terminals , and two opposite inner side walls of the housing are provided with power strips respectively connected with positive and negative poles of the input wire , and the conductive terminals are in corresponding contact with the power strip , wherein the casing is an insulated hard tube, the conductive terminals are disposed on one end of the insulated hard tube located in the housing by encapsulation, and the output wire is placed in the insulated hard tube and extends out from other end of the insulated hard tube. a housing with a hollow cavity, and a sliding device with one end extending into the cavity of the housing and slidingly connected to the housing ; the housing is provided with an input wire at one end and an output wire at the other end, the sliding device is electrically connected to the input wire and the output wire respectively, and the extension length of the output wire relative to the housing changes accordingly during the sliding of the sliding device along the length direction of the housing , wherein the sliding device comprises a casing that extends into the cavity of the housing at one end and can move along the length direction of the housing , and a power taking component that is cooperatively connected to the casing , and the power taking component is electrically connected to the input wire and the output wire respectively, and the output wire extends from other end of the casing , the power taking component includes two conductive terminals , and two opposite inner side walls of the housing are provided with power strips respectively connected with positive and negative poles of the input wire , and the conductive terminals are in corresponding contact with the power strip , wherein the casing is an insulated hard tube, the conductive terminals are disposed on one end of the insulated hard tube located in the housing by encapsulation, and the output wire is placed in the insulated hard tube and extends out from other end of the insulated hard tube.
A method for allowing or denying operational access to a trusted accessory (202, 402; 502) from an untrusted device , via the establishment of a secure connection between the trusted accessory and the untrusted device, the method being implemented by the trusted accessory comprising: detecting an accessory-access-request event triggered by a user intending to establish the secure connection between the trusted accessory and the untrusted device ; generating a seed sequence having a first number of seed-sequence elements; outputting a sensorial indication which is perceivable by the user of the generated first number of seed-sequence elements via a user interface of the trusted accessory; receiving from the untrusted device , via the operation of the user on a user interface on the untrusted device , at least one seed-sequence-element-modifier signal for modifying the generated first number of seed-sequence elements; modifying the generated seed sequence in accordance with the at least one received seed-sequence-element-modifier signal; comparing the modified seed sequence with an access sequence stored in the trusted accessory ; and granting operational access of the untrusted device to the trusted accessory when the modified seed sequence matches the stored access sequence; and denying operational access of the untrusted device to the trusted accessory when the modified seed sequence does not match the stored access sequence. detecting an accessory-access-request event triggered by a user intending to establish the secure connection between the trusted accessory and the untrusted device ; generating a seed sequence having a first number of seed-sequence elements; outputting a sensorial indication which is perceivable by the user of the generated first number of seed-sequence elements via a user interface of the trusted accessory; receiving from the untrusted device , via the operation of the user on a user interface on the untrusted device , at least one seed-sequence-element-modifier signal for modifying the generated first number of seed-sequence elements; modifying the generated seed sequence in accordance with the at least one received seed-sequence-element-modifier signal; comparing the modified seed sequence with an access sequence stored in the trusted accessory ; and granting operational access of the untrusted device to the trusted accessory when the modified seed sequence matches the stored access sequence; and denying operational access of the untrusted device to the trusted accessory when the modified seed sequence does not match the stored access sequence.
A method for determining a configuration of a wind turbine of a given wind turbine type, the method comprising the steps of: storing in a database a plurality of combinations of physical and control parameters of the wind turbine that can be varied; determining a plurality of wind flow characteristics at a target location; applying a function which defines a relationship between a performance parameter, a fatigue life estimation, the combination of physical and control parameters and the plurality of wind flow characteristics, to at least some of the plurality of combinations in the database to determine values of the performance parameter and the fatigue life estimation for those combinations; and selecting one of the combinations of physical and control parameters as the configuration of the wind turbine for the target location on the basis of the performance parameter and fatigue life estimation values. storing in a database a plurality of combinations of physical and control parameters of the wind turbine that can be varied; determining a plurality of wind flow characteristics at a target location; applying a function which defines a relationship between a performance parameter, a fatigue life estimation, the combination of physical and control parameters and the plurality of wind flow characteristics, to at least some of the plurality of combinations in the database to determine values of the performance parameter and the fatigue life estimation for those combinations; and selecting one of the combinations of physical and control parameters as the configuration of the wind turbine for the target location on the basis of the performance parameter and fatigue life estimation values.
A base material made of a cemented carbide, the cemented carbide including a first hard phase and a binder phase, the first hard phase consisting of WC particles, the binder phase including at least one element selected from Co and Ni, the base material comprising a body portion, and a surface portion provided on a surface of the body portion, the surface portion having a thickness less than or equal to an average particle size in the first hard phase, the thickness being a distance in the thickness direction measured from the surface of the base material to a portion immediately before a field of view where the area proportion of the binder phase exceeds 0.05 for the first time, using SEM under the conditions defined in the description, and a ratio of an area proportion of the binder phase in a surface of the surface portion to an area proportion of the binder phase in a cross section of the body portion, measured by the method described in the description, being not less than 1.4 and not more than 1.7. the cemented carbide including a first hard phase and a binder phase, the first hard phase consisting of WC particles, the binder phase including at least one element selected from Co and Ni, the base material comprising a body portion, and a surface portion provided on a surface of the body portion, the surface portion having a thickness less than or equal to an average particle size in the first hard phase, the thickness being a distance in the thickness direction measured from the surface of the base material to a portion immediately before a field of view where the area proportion of the binder phase exceeds 0.05 for the first time, using SEM under the conditions defined in the description, and a ratio of an area proportion of the binder phase in a surface of the surface portion to an area proportion of the binder phase in a cross section of the body portion, measured by the method described in the description, being not less than 1.4 and not more than 1.7.
Battery structure having anode and cathode contacts on the front face and on the rear face comprising a battery having anode and cathode contacts on the front face only, this battery being jacketed in a film comprising a conductive layer and an insulating layer , the conductive layer resting on the anode and cathode contacts of the battery and being interrupted between these anode and cathode contacts such that said contacts are not electrically connected by the conductive layer , and the insulating layer comprising openings on the front and rear faces of the battery to form anode and cathode contacts of the battery structure, the battery further comprising a block comprising a set of active layers.
A system, comprising: one of a splice tray , a fiber optic connector having a connector housing , or an optical module having a module housing ; first and second optical fibers (504a and 504b, 260 and 252, 504c and 504d, 916 and 918); and an optical splice package splicing together the first and second optical fibers, the first and second optical fibers having elastic bending characteristics, the optical splice package being installed or stored at the splice tray, or housed in the connector housing or in an interior of the module housing, in a free-floating configuration such that the splice package is not fixated to the splice tray, the fiber optic connector, or the module housing, characterized in the optical splice package comprising: a splice housing including a mechanical alignment feature for co-axially aligning ends of the first and second optical fibers within the splice housing, the splice housing containing adhesive for securing the ends of the first and second optical fibers within the splice housing, the optical splice package having a weight less than: a spring force corresponding to the elastic bending characteristics of the first and second optical fibers, or less than a spring force generated by the inherent elastic bending characteristics of the spliced optical fibers when the spliced optical fibers are bent at their minimum bend radius. one of a splice tray , a fiber optic connector having a connector housing , or an optical module having a module housing ; first and second optical fibers (504a and 504b, 260 and 252, 504c and 504d, 916 and 918); and an optical splice package splicing together the first and second optical fibers, the first and second optical fibers having elastic bending characteristics, the optical splice package being installed or stored at the splice tray, or housed in the connector housing or in an interior of the module housing, in a free-floating configuration such that the splice package is not fixated to the splice tray, the fiber optic connector, or the module housing, characterized in the optical splice package comprising: a splice housing including a mechanical alignment feature for co-axially aligning ends of the first and second optical fibers within the splice housing, the splice housing containing adhesive for securing the ends of the first and second optical fibers within the splice housing, the optical splice package having a weight less than: a spring force corresponding to the elastic bending characteristics of the first and second optical fibers, or less than a spring force generated by the inherent elastic bending characteristics of the spliced optical fibers when the spliced optical fibers are bent at their minimum bend radius.
A filling apparatus , comprising: a plurality of filling nozzles configured to fill a liquid containing solids into a container ; a liquid tank configured to store the liquid containing solids; and a manifold configured to distribute the liquid introduced from an introduction port provided above into the respective filling nozzles from a plurality of distribution ports , the liquid in the liquid tank being introduced into the manifold from the introduction port, the liquid being supplied to the respective filling nozzles through the plurality of distribution ports from the manifold , so that the liquid is filled into the container , characterized in that on an upper surface of a bottom portion in the manifold , guide grooves are formed toward the respective distribution ports , and the solids contained in the liquid which is introduced into the manifold are arranged by the guide grooves and are supplied to the filling nozzles through the respective distribution ports . a plurality of filling nozzles configured to fill a liquid containing solids into a container ; a liquid tank configured to store the liquid containing solids; and a manifold configured to distribute the liquid introduced from an introduction port provided above into the respective filling nozzles from a plurality of distribution ports , the liquid in the liquid tank being introduced into the manifold from the introduction port, the liquid being supplied to the respective filling nozzles through the plurality of distribution ports from the manifold , so that the liquid is filled into the container , characterized in that on an upper surface of a bottom portion in the manifold , guide grooves are formed toward the respective distribution ports , and the solids contained in the liquid which is introduced into the manifold are arranged by the guide grooves and are supplied to the filling nozzles through the respective distribution ports .
Method of determining print defects by means of a computer in a printing operation carried out in an inkjet printing machine to process a print job, wherein printed products created during the printing operation are recorded and digitized by means of a camera system , the camera image generated in this way is fed to a detection algorithm on the computer , and, when print defects are detected, a message is sent to a machine control unit , which then potentially removes the printed product via a waste deflector, characterized in that the detection algorithm separates colour separations of the camera images , detects the print defects in the colour separations, links images of the individual color separations to a candidate image , filters the candidate image , wherein the candidate image is filtered to ensure that only print defects that lead to unusable prints are detected, and subsequently the remaining detected print defects are entered into a list which is then sent to the machine control unit of the printing machine .
A process for synthesizing a compound having the formula : or a solvate or salt thereof, the process comprising the following steps: a) providing a compound of formula : or a solvate or salt thereof, wherein each of R 1 and R 2 is independently selected from the group consisting of -H and an amino protecting group, and at least one of R 1 and R 2 is an amino protecting group; b) reacting the compound of formula or a solvate or salt thereof with one or more reagents to remove the amino protecting group(s) at position R 1 and R 2 to give a compound of formula : or a solvate or salt thereof; c) reacting the compound of formula or a solvate or salt thereof with one or more reagents for introducing (i) a tetrahydropyranyl group and (ii) an acetyl group to give a compound of formula : or a solvate or salt thereof; and d) subjecting the compound of formula or a solvate or salt thereof to an oxidative amination reaction to give the compound of formula (I) or a solvate or salt thereof. a) providing a compound of formula : or a solvate or salt thereof, wherein each of R 1 and R 2 is independently selected from the group consisting of -H and an amino protecting group, and at least one of R 1 and R 2 is an amino protecting group; b) reacting the compound of formula or a solvate or salt thereof with one or more reagents to remove the amino protecting group(s) at position R 1 and R 2 to give a compound of formula : or a solvate or salt thereof; c) reacting the compound of formula or a solvate or salt thereof with one or more reagents for introducing (i) a tetrahydropyranyl group and (ii) an acetyl group to give a compound of formula : or a solvate or salt thereof; and d) subjecting the compound of formula or a solvate or salt thereof to an oxidative amination reaction to give the compound of formula (I) or a solvate or salt thereof.
Cooling section for a continuous line for annealing or galvanizing steel strips arranged to receive a metal strip , said section comprising at least one dry cooling zone arranged to spray a gas onto said steel strip, at least one wet cooling zone arranged to spray a liquid or a mixture of gas and liquid onto said steel strip, and an airlock for separating atmospheres, which airlock is interposed between the dry cooling zone and the wet cooling zone, wherein the airlock for separating atmospheres comprises three pairs of rollers or flaps , each of the pairs being positioned transversely to a direction of travel of the metal strip, said three pairs of rollers or flaps delimiting between them two zones of said airlock: a first zone , which is delimited by the first two pairs of rollers or flaps in the direction of travel of the strip, located on the side of the dry cooling zone , and comprises extraction means , and a second zone , which is delimited by the last two pairs of rollers or flaps in the direction of travel of the strip, located on the side of the wet cooling zone , and comprises means arranged to inject an inert gas.
A chip package device , comprising: a chip , a molding compound, a thermally conductive layer , and a first substrate and a second substrate that are disposed opposite to each other, wherein the chip is disposed on a surface that is of the first substrate and that faces the second substrate ; and the chip is electrically connected to the first substrate through a first conductive part , and the second substrate is electrically connected to the first substrate through a second conductive part ; the thermally conductive layer is disposed between the chip and the second substrate , and the thermally conductive layer is configured to form a heat dissipation passage between the chip and the second substrate ; and the molding compound is configured to wrap the chip , characterized in that the first conductive part comprises: a plurality of metal balls and a plurality of metal columns , wherein the metal column is disposed on a surface that is of the chip and that faces the first substrate , and the metal ball is disposed at an end that is of the metal column and that is close to the first substrate and is configured to electrically connect the metal column to the first substrate . a chip , a molding compound, a thermally conductive layer , and a first substrate and a second substrate that are disposed opposite to each other, wherein the chip is disposed on a surface that is of the first substrate and that faces the second substrate ; and the chip is electrically connected to the first substrate through a first conductive part , and the second substrate is electrically connected to the first substrate through a second conductive part ; the thermally conductive layer is disposed between the chip and the second substrate , and the thermally conductive layer is configured to form a heat dissipation passage between the chip and the second substrate ; and the molding compound is configured to wrap the chip , characterized in that the first conductive part comprises: a plurality of metal balls and a plurality of metal columns , wherein the metal column is disposed on a surface that is of the chip and that faces the first substrate , and the metal ball is disposed at an end that is of the metal column and that is close to the first substrate and is configured to electrically connect the metal column to the first substrate .
A method for decorating in thickness a ceramic slab, comprising the following steps: preparing, on a decoration surface , a first soft decorated layer (L1) of ceramic material endowed with a decoration (V); progressively transferring, by deposition, the soft decorated layer (L1) from the decoration surface to a first deposition surface , situated at a lower height than the decoration surface , thus progressively forming on the first deposition surface a second soft decorated layer (L2) which has a head (H) and a tail (T), the head (H) being formed by the material that is deposited first on the first deposition surface , the tail (T) being formed by the material that is deposited last on the first deposition surface ; progressively transferring, by deposition, the second soft decorated layer (L2) from the first deposition surface to a second deposition surface , situated at a lower height than the first deposition surface , thus progressively forming on the second deposition surface a third soft decorated layer (L3), characterized in that said step of progressively transferring the second soft decorated layer (L2) from the first deposition surface to the second deposition surface is performed by starting from the tail (T) of the second soft decorated layer (L2). preparing, on a decoration surface , a first soft decorated layer (L1) of ceramic material endowed with a decoration (V); progressively transferring, by deposition, the soft decorated layer (L1) from the decoration surface to a first deposition surface , situated at a lower height than the decoration surface , thus progressively forming on the first deposition surface a second soft decorated layer (L2) which has a head (H) and a tail (T), the head (H) being formed by the material that is deposited first on the first deposition surface , the tail (T) being formed by the material that is deposited last on the first deposition surface ; progressively transferring, by deposition, the second soft decorated layer (L2) from the first deposition surface to a second deposition surface , situated at a lower height than the first deposition surface , thus progressively forming on the second deposition surface a third soft decorated layer (L3), characterized in that said step of progressively transferring the second soft decorated layer (L2) from the first deposition surface to the second deposition surface is performed by starting from the tail (T) of the second soft decorated layer (L2).