An electronic component housing package , comprising: an insulating substrate having a first principal face and a second principal face facing away from each other, the insulating substrate having a lower insulating layer including the second principal face , the lower insulating layer having a mounting section for mounting an electronic component , and a frame-shaped upper insulating layer including the first principal face , the frame-shaped upper insulating layer being provided on the lower insulating layer so as to surround the mounting section ; a plurality of external connection conductors provided on the second principal face ; and connection conductors provided so as to extend from outer peripheral ends of the external connection conductors to outer peripheral ends of the insulating substrate , respectively, the connection conductors being provided so as to be curved convexly toward a first principal face side over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate in a vertical cross-sectional view of the electronic component housing package and so that a distance from each of the connection conductors to the second principal face is gradually increased in a thickness direction of the insulating substrate , insulating bodies being provided so as to cover the connection conductors , respectively, wherein the insulating bodies each have a third principal face lying in the same plane as the second principal face , and inclined sections are provided from respective ones of the third principal faces to the connection conductors on outer peripheral side surfaces of the insulating bodies on a second principal face side, respectively. an insulating substrate having a first principal face and a second principal face facing away from each other, the insulating substrate having a lower insulating layer including the second principal face , the lower insulating layer having a mounting section for mounting an electronic component , and a frame-shaped upper insulating layer including the first principal face , the frame-shaped upper insulating layer being provided on the lower insulating layer so as to surround the mounting section ; a plurality of external connection conductors provided on the second principal face ; and connection conductors provided so as to extend from outer peripheral ends of the external connection conductors to outer peripheral ends of the insulating substrate , respectively, the connection conductors being provided so as to be curved convexly toward a first principal face side over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate in a vertical cross-sectional view of the electronic component housing package and so that a distance from each of the connection conductors to the second principal face is gradually increased in a thickness direction of the insulating substrate , insulating bodies being provided so as to cover the connection conductors , respectively, wherein the insulating bodies each have a third principal face lying in the same plane as the second principal face , and inclined sections are provided from respective ones of the third principal faces to the connection conductors on outer peripheral side surfaces of the insulating bodies on a second principal face side, respectively. <EOS>