A camera module, comprising: a first PCB ; an image sensor disposed on the first PCB ; a housing unit comprising a base ; a second PCB disposed on the housing unit and including a terminal unit ; a holder module spaced apart from the housing unit , the holder module comprising an outer blade , a bobbin disposed in the outer blade and a spring means connecting the bobbin to the outer blade and comprising first to fourth corner portions; a lens coupled to the bobbin ; a second coil disposed on the bobbin ; four magnets facing the second coil ; four first coils facing the four magnets ; a plurality of wires coupled with the holder module , wherein the wires are disposed on the first to fourth corner portions of the holder module ; characterized by : a buffer unit disposed on a portion of each of the plurality of wires and comprising an adhesive substance , wherein the second PCB comprises a first part disposed over the base and a second part bent and extending from the first part, wherein the second coil is electrically connected to two wires of the plurality of wires , wherein the plurality of wires comprises six wires spaced apart from each other, wherein two wires of the six wires are disposed on the first corner portion and other two wires of the six wires are disposed on the third corner portion diagonal to the first corner portion, wherein the buffer unit is disposed at a position adjacent to a distal end of each of the plurality of wires , and wherein the buffer unit is nearer to the lens than the image sensor . a first PCB ; an image sensor disposed on the first PCB ; a housing unit comprising a base ; a second PCB disposed on the housing unit and including a terminal unit ; a holder module spaced apart from the housing unit , the holder module comprising an outer blade , a bobbin disposed in the outer blade and a spring means connecting the bobbin to the outer blade and comprising first to fourth corner portions; a lens coupled to the bobbin ; a second coil disposed on the bobbin ; four magnets facing the second coil ; four first coils facing the four magnets ; a plurality of wires coupled with the holder module , wherein the wires are disposed on the first to fourth corner portions of the holder module ; characterized by : a buffer unit disposed on a portion of each of the plurality of wires and comprising an adhesive substance , wherein the second PCB comprises a first part disposed over the base and a second part bent and extending from the first part, wherein the second coil is electrically connected to two wires of the plurality of wires , wherein the plurality of wires comprises six wires spaced apart from each other, wherein two wires of the six wires are disposed on the first corner portion and other two wires of the six wires are disposed on the third corner portion diagonal to the first corner portion, wherein the buffer unit is disposed at a position adjacent to a distal end of each of the plurality of wires , and wherein the buffer unit is nearer to the lens than the image sensor . a buffer unit disposed on a portion of each of the plurality of wires and comprising an adhesive substance , wherein the second PCB comprises a first part disposed over the base and a second part bent and extending from the first part, wherein the second coil is electrically connected to two wires of the plurality of wires , wherein the plurality of wires comprises six wires spaced apart from each other, wherein two wires of the six wires are disposed on the first corner portion and other two wires of the six wires are disposed on the third corner portion diagonal to the first corner portion, wherein the buffer unit is disposed at a position adjacent to a distal end of each of the plurality of wires , and wherein the buffer unit is nearer to the lens than the image sensor . <EOS>