A light emitting device package comprising: a body comprising a cavity surrounded by wall portions having side surfaces; first and second lead frames mounted in the body ; and a light emitting diode electrically connected with the first and second lead frames disposed in the cavity; wherein the light emitting diode is disposed on the first lead frame in the cavity, wherein the first and second lead frames have a heat sink which is extended, respectively, from a portion of the first and the second lead frames in the longitudinal direction (Z) of the body while extending along side surfaces of the wall portions of the body , and wherein the body further comprises a recess formed at a bottom surface of the body , and a portion of the heat sink of the first lead frame is bent to extend along the bottom surface of the body and is disposed in the recess , the bottom surface arranged at the opposite to the light emission surface of the light emitting device package with respect to the body , and wherein the recess has a width greater than a width of the heat sink , and the recess has a depth greater than a thickness of the heat sink , wherein the heat sink further comprises a first coupler and the body further comprises a second coupler , to which the first coupler is coupled, wherein the first coupler is a protrusion formed at an inner surface of the heat sink which connects to the side surfaces of the wall portions of the body ; wherein the second coupler is a groove formed in order to correspond to the first coupler, and wherein the heat sink has at least a portion on an outer surface thereof on which roughness is formed such that an enhancement in the heat dissipation effect of the heat sink is achieved. a body comprising a cavity surrounded by wall portions having side surfaces; first and second lead frames mounted in the body ; and a light emitting diode electrically connected with the first and second lead frames disposed in the cavity; wherein the light emitting diode is disposed on the first lead frame in the cavity, wherein the first and second lead frames have a heat sink which is extended, respectively, from a portion of the first and the second lead frames in the longitudinal direction (Z) of the body while extending along side surfaces of the wall portions of the body , and wherein the body further comprises a recess formed at a bottom surface of the body , and a portion of the heat sink of the first lead frame is bent to extend along the bottom surface of the body and is disposed in the recess , the bottom surface arranged at the opposite to the light emission surface of the light emitting device package with respect to the body , and wherein the recess has a width greater than a width of the heat sink , and the recess has a depth greater than a thickness of the heat sink , wherein the heat sink further comprises a first coupler and the body further comprises a second coupler , to which the first coupler is coupled, wherein the first coupler is a protrusion formed at an inner surface of the heat sink which connects to the side surfaces of the wall portions of the body ; wherein the second coupler is a groove formed in order to correspond to the first coupler, and wherein the heat sink has at least a portion on an outer surface thereof on which roughness is formed such that an enhancement in the heat dissipation effect of the heat sink is achieved. <EOS>