A circuit board assembly of an array imaging module, comprising: a circuit member which comprises a circuit board at least two photosensitive units of the array imaging module located on said circuit board and electrically connecting with said circuit board, at least one electronic element electrically coupled at and protruded from said circuit board , and a mold sealer which is sealed and coupled at said circuit board of said circuit member , wherein said at least one electronic element is enclosed within said mold sealer for preventing an exposure of said electronic element , wherein said mold sealer is integrally formed with the circuit board via a molding process, said mold sealer has at least two optical windows at the position of said photosensitive units to form at least two light channels, said at least one electronic element is enveloped and encapsulated by said mold sealer; and in that a reinforcing layer is overlapped and connected to the circuit board to reinforce a strength of the circuit board ; wherein the mold sealer has an inclined inner surface relative to an optical axis, and each photosensitive unit is electrically connected to the circuit board via at least a lead wire , wherein the mold sealer is molded on the circuit board via the molding process, wherein the mold sealer includes a connecting body and two outer ring bodies , wherein the connecting body is mold-connected between the two outer ring bodies to spacedly separate the outer ring bodies by the connecting body , wherein each outer ring bodies is integrally connected to an outer peripheral edge of the circuit board , and the connecting body is integrally connected at a center portion of the circuit board , wherein the circuit board has a least a reinforcing slot which is an indention cavity, and the mold sealer is extended into the reinforcing slot to enhance the strength of the circuit board . a circuit member which comprises a circuit board at least two photosensitive units of the array imaging module located on said circuit board and electrically connecting with said circuit board, at least one electronic element electrically coupled at and protruded from said circuit board , and a mold sealer which is sealed and coupled at said circuit board of said circuit member , wherein said at least one electronic element is enclosed within said mold sealer for preventing an exposure of said electronic element , wherein said mold sealer is integrally formed with the circuit board via a molding process, said mold sealer has at least two optical windows at the position of said photosensitive units to form at least two light channels, said at least one electronic element is enveloped and encapsulated by said mold sealer; and in that a reinforcing layer is overlapped and connected to the circuit board to reinforce a strength of the circuit board ; wherein the mold sealer has an inclined inner surface relative to an optical axis, and each photosensitive unit is electrically connected to the circuit board via at least a lead wire , wherein the mold sealer is molded on the circuit board via the molding process, wherein the mold sealer includes a connecting body and two outer ring bodies , wherein the connecting body is mold-connected between the two outer ring bodies to spacedly separate the outer ring bodies by the connecting body , wherein each outer ring bodies is integrally connected to an outer peripheral edge of the circuit board , and the connecting body is integrally connected at a center portion of the circuit board , wherein the circuit board has a least a reinforcing slot which is an indention cavity, and the mold sealer is extended into the reinforcing slot to enhance the strength of the circuit board . <EOS>