A dissipating interconnection module for an M.2 form-factor expansion card , said expansion card needing to be connected to a first electronic board comprising a fluidic cooling system , said expansion card comprising a first heat-exchange surface , a second heat-exchange surface and at least one first M.2 connector , configured to be connected to at least one second M.2 connector , said dissipating interconnection module being characterized in that: - the dissipating interconnection module comprises a heat sink, said heat sink comprising: ∘ an envelope comprising an upper wall configured to be in thermal contact with the first heat-exchange surface of the expansion card , the envelope further comprising two tabs , each tab being configured to be in thermal contact with the upper wall of the heat sink and to be in thermal contact with the fluidic cooling system of the first electronic board , the upper wall and the two tabs of the envelope being arranged so as to form a space capable of receiving the expansion card ; ∘ a mechanical attachment system configured to removably mechanically attach the expansion card to the heat sink; - the dissipating interconnection module comprises an interconnection electronic card , said interconnection electronic card comprising the second M.2 connector , at least one third electric connector configured to be connected to at least one fourth electric connector of the first electronic board , the interconnection electronic card being configured to be removably mechanically attached to the heat sink, - the dissipating interconnection module is configured to be removably mechanically attached to the first electronic board . - the dissipating interconnection module comprises a heat sink, said heat sink comprising: ∘ an envelope comprising an upper wall configured to be in thermal contact with the first heat-exchange surface of the expansion card , the envelope further comprising two tabs , each tab being configured to be in thermal contact with the upper wall of the heat sink and to be in thermal contact with the fluidic cooling system of the first electronic board , the upper wall and the two tabs of the envelope being arranged so as to form a space capable of receiving the expansion card ; ∘ a mechanical attachment system configured to removably mechanically attach the expansion card to the heat sink; ∘ an envelope comprising an upper wall configured to be in thermal contact with the first heat-exchange surface of the expansion card , the envelope further comprising two tabs , each tab being configured to be in thermal contact with the upper wall of the heat sink and to be in thermal contact with the fluidic cooling system of the first electronic board , the upper wall and the two tabs of the envelope being arranged so as to form a space capable of receiving the expansion card ; ∘ a mechanical attachment system configured to removably mechanically attach the expansion card to the heat sink; - the dissipating interconnection module comprises an interconnection electronic card , said interconnection electronic card comprising the second M.2 connector , at least one third electric connector configured to be connected to at least one fourth electric connector of the first electronic board , the interconnection electronic card being configured to be removably mechanically attached to the heat sink, - the dissipating interconnection module is configured to be removably mechanically attached to the first electronic board . <EOS>