A method for manufacturing stress-relief-annealing-resistant, low-iron-loss grain-oriented silicon steel, comprising: subjecting silicon steel to iron smelting, steel smelting, continuous casting, hot rolling, single or double cold rolling, followed by decarburization annealing, coating a MgO-based separation agent on the surface of the steel, high-temperature annealing, and finally, applying an insulating coating on the surface of the steel and performing hot stretching, temper rolling and annealing, thereby obtaining a finished product, wherein the method further comprises: carrying out, by means of pulse laser, scanning grooving on a single surface or both surfaces of the resultant silicon steel sheet after cold rolling, or after decarburizing annealing, or after high temperature annealing or after hot stretching, temper rolling and annealing, and forming grooves parallel with each other in a rolling direction of the silicon steel sheet; wherein a single pulse time width of the pulse laser is 100 ns or less, and the peak energy density of a single pulse is 0.05 J/cm 2 or more; the energy density of a single laser beam in a single scan E s is 1 J/cm 2 to 100 J/cm 2 ; beam spot(s) of the pulse laser is a single beam spot or a combination of a plurality of beams spots, the combination of a plurality of beams spots is composed of a plurality of beam spots linearly arranged along the scanning direction, the number of beam spots is 2~300; in the single beam spot or the combination of a plurality of beams spots, the shape of the beam spot(s) is/are circular or elliptic, and the diameter a of the beam spot(s) in a scanning direction is 5 μm to 1 mm, and the diameter b of the beam spot(s) in a direction perpendicular to the scanning direction is 5 μm to 300 μm; the average value of the spacing d m between the beam spots of the combination of a plurality of beams spots in the scanning direction is between c / 5 and 5c, where c is the average diameter of the beam spots in the scanning direction; and when the scanning grooving is carried out at the same position on the silicon steel sheet, the product of the number of beam spots of the pulse laser and the scan times is 5 or more. wherein a single pulse time width of the pulse laser is 100 ns or less, and the peak energy density of a single pulse is 0.05 J/cm 2 or more; the energy density of a single laser beam in a single scan E s is 1 J/cm 2 to 100 J/cm 2 ; beam spot(s) of the pulse laser is a single beam spot or a combination of a plurality of beams spots, the combination of a plurality of beams spots is composed of a plurality of beam spots linearly arranged along the scanning direction, the number of beam spots is 2~300; in the single beam spot or the combination of a plurality of beams spots, the shape of the beam spot(s) is/are circular or elliptic, and the diameter a of the beam spot(s) in a scanning direction is 5 μm to 1 mm, and the diameter b of the beam spot(s) in a direction perpendicular to the scanning direction is 5 μm to 300 μm; the average value of the spacing d m between the beam spots of the combination of a plurality of beams spots in the scanning direction is between c / 5 and 5c, where c is the average diameter of the beam spots in the scanning direction; and when the scanning grooving is carried out at the same position on the silicon steel sheet, the product of the number of beam spots of the pulse laser and the scan times is 5 or more. <EOS>