An electrical power distribution system for a mobile platform, comprising: a non-planar substrate comprising a first panel joined to a second panel , the first panel residing in a first plane and the second panel residing in a second plane that differs from the first plane, wherein the first plane is orthogonal to the second plane; one or more bus bars arranged on an electrically insulating layer on the first panel; one or more power electronic devices arranged on the first panel and connected to the one or more bus bars, wherein the electrically insulating layer on the first panel is disposed between the one or more power electronic devices and the first panel ; one or more connectors arranged on the second panel and electrically connected to the one or more bus bars; one or more thermal relief devices arranged in contact with the substrate; and further comprising a housing containing the substrate, the second panel of the substrate being attached to a wall of the housing; the one or more thermal relief devices includes a thermal interface arranged between the second panel and the wall of the housing; and wherein the one or more thermal relief devices further includes a thermal conduction device connected to the first panel and arranged between the first panel and a first portion of the housing , the thermal conduction device comprising a plurality of structures configured to conduct heat away from the first panel, wherein the first panel is parallel to said first portion of the housing and the second panel is parallel to the second portion of the housing, perpendicular to the first portion, and onto which the second panel is attached. a non-planar substrate comprising a first panel joined to a second panel , the first panel residing in a first plane and the second panel residing in a second plane that differs from the first plane, wherein the first plane is orthogonal to the second plane; one or more bus bars arranged on an electrically insulating layer on the first panel; one or more power electronic devices arranged on the first panel and connected to the one or more bus bars, wherein the electrically insulating layer on the first panel is disposed between the one or more power electronic devices and the first panel ; one or more connectors arranged on the second panel and electrically connected to the one or more bus bars; one or more thermal relief devices arranged in contact with the substrate; and further comprising a housing containing the substrate, the second panel of the substrate being attached to a wall of the housing; the one or more thermal relief devices includes a thermal interface arranged between the second panel and the wall of the housing; and wherein the one or more thermal relief devices further includes a thermal conduction device connected to the first panel and arranged between the first panel and a first portion of the housing , the thermal conduction device comprising a plurality of structures configured to conduct heat away from the first panel, wherein the first panel is parallel to said first portion of the housing and the second panel is parallel to the second portion of the housing, perpendicular to the first portion, and onto which the second panel is attached. <EOS>