A method for manufacturing multi-layer circuit boards, - wherein, within the scope of a production method step, a tool upper part and a tool lower part of a multi-part tool with multiple functional layers and at least one insulation layer of a circuit board to be produced and at least one measurement value sensor provided therebetween are pressed against one another and heated in a thermo-compression chamber and in doing so measured values are captured with the measurement value sensor, - wherein the measured values and/or data obtained therefrom are transmitted to a production control device during the ongoing production method step and that the measured values and/or the data obtained therefrom are processed by the production control device for monitoring the ongoing production method step and/or for controlling the ongoing production method step with respect to a default value for a measurand of the measurement value sensor, characterized in that - before the production method step, first, within the scope of an assembling method step, the multiple functional layers and the at least one insulation layer are arranged in a layered manner between the tool lower part and the tool upper part , and the at least one measurement value sensor is positioned between the tool upper part and the tool lower part such that the measurement value sensor rests against at least one functional layer and/or insulation layer , and - that before the production method step, then, within the scope of an equipping method step, a plurality of preassembled tools with the multiple functional layers and the at least one insulation layer and the measurement value sensor are transported via suitable handling means to a multi-platen heat press and inserted into the thermo-compression chamber of the multi-platen heat press such that each tool is placed with an underside of its tool lower part from above onto a heating plate and positioned relative thereto. - wherein, within the scope of a production method step, a tool upper part and a tool lower part of a multi-part tool with multiple functional layers and at least one insulation layer of a circuit board to be produced and at least one measurement value sensor provided therebetween are pressed against one another and heated in a thermo-compression chamber and in doing so measured values are captured with the measurement value sensor, - wherein the measured values and/or data obtained therefrom are transmitted to a production control device during the ongoing production method step and that the measured values and/or the data obtained therefrom are processed by the production control device for monitoring the ongoing production method step and/or for controlling the ongoing production method step with respect to a default value for a measurand of the measurement value sensor, characterized in that - before the production method step, first, within the scope of an assembling method step, the multiple functional layers and the at least one insulation layer are arranged in a layered manner between the tool lower part and the tool upper part , and the at least one measurement value sensor is positioned between the tool upper part and the tool lower part such that the measurement value sensor rests against at least one functional layer and/or insulation layer , and - that before the production method step, then, within the scope of an equipping method step, a plurality of preassembled tools with the multiple functional layers and the at least one insulation layer and the measurement value sensor are transported via suitable handling means to a multi-platen heat press and inserted into the thermo-compression chamber of the multi-platen heat press such that each tool is placed with an underside of its tool lower part from above onto a heating plate and positioned relative thereto. <EOS>