A process for forming a graphene-coated glass comprising: a. forming a clean ultrathin, flexible glass substrate, comprising: i. applying an O 2 plasma treatment to an ultrathin, flexible glass substrate; ii. applying an organic base and peroxide solution to the ultrathin, flexible glass substrate; and iii. applying an acid and peroxide solution to the ultrathin, flexible glass substrate; wherein the ultrathin, flexible glass substrate has a thickness of from 10 μm to 300 μm; b. contacting a chemical vapor deposition-grown graphene on a formation substrate with a thermal release tape to form a stack; c. applying a pressing force of from 689 kPa to 6890 kPa to the stack for time sufficient to adhere the thermal release tape to the graphene, then removing of the pressing force; d. etching away the formation substrate in an etchant solution; e. contacting the clean ultrathin, flexible glass substrate with the graphene to form a sandwich comprising the thermal release tape, graphene, and ultrathin, flexible glass substrate, and placing the sandwich in a press; f. applying a pressing force of from 517 kPa to 5170 kPa to the sandwich for time sufficient to adhere the graphene to the ultrathin, flexible glass substrate, then removing of the pressing force; g. heating the sandwich to a temperature 1° to 10° C. above the release temperature of the thermal release tape for a time sufficient to allow for removal of the thermal release tape without damage to the graphene or ultrathin, flexible glass substrate, or removal of the graphene from the ultrathin, flexible glass substrate. a. forming a clean ultrathin, flexible glass substrate, comprising: i. applying an O 2 plasma treatment to an ultrathin, flexible glass substrate; ii. applying an organic base and peroxide solution to the ultrathin, flexible glass substrate; and iii. applying an acid and peroxide solution to the ultrathin, flexible glass substrate; wherein the ultrathin, flexible glass substrate has a thickness of from 10 μm to 300 μm; i. applying an O 2 plasma treatment to an ultrathin, flexible glass substrate; ii. applying an organic base and peroxide solution to the ultrathin, flexible glass substrate; and iii. applying an acid and peroxide solution to the ultrathin, flexible glass substrate; b. contacting a chemical vapor deposition-grown graphene on a formation substrate with a thermal release tape to form a stack; c. applying a pressing force of from 689 kPa to 6890 kPa to the stack for time sufficient to adhere the thermal release tape to the graphene, then removing of the pressing force; d. etching away the formation substrate in an etchant solution; e. contacting the clean ultrathin, flexible glass substrate with the graphene to form a sandwich comprising the thermal release tape, graphene, and ultrathin, flexible glass substrate, and placing the sandwich in a press; f. applying a pressing force of from 517 kPa to 5170 kPa to the sandwich for time sufficient to adhere the graphene to the ultrathin, flexible glass substrate, then removing of the pressing force; g. heating the sandwich to a temperature 1° to 10° C. above the release temperature of the thermal release tape for a time sufficient to allow for removal of the thermal release tape without damage to the graphene or ultrathin, flexible glass substrate, or removal of the graphene from the ultrathin, flexible glass substrate. <EOS>