A proximity sensor system , comprising: a sensor article having a sensor sensing surface , wherein the sensor article is configured to sense the magnetic field of a magnetic target article located proximate the sensor sensing surface and generate a sensor signal ; a Temperature Compensation Article, TCA, , wherein the Temperature Compensation Article includes, a first Digital-to-Analog Converter, DAC, , a first thermistor and a first biasing resistor , wherein the first thermistor and the first biasing resistor are connected in a parallel configuration and the first DAC is connect to the first thermistor and the first biasing resistor in a series configuration, a second DAC and a second thermistor , wherein the second DAC and second thermistor are connected in a series configuration, a third DAC and a Resistive Temperature Detector ,RTD, , wherein the third DAC and RTD are connected in a series configuration, a fourth DAC and a second biasing resistor , wherein the fourth DAC and the second biasing resistor are connected in a series configuration, wherein the outputs of the first thermistor and first biasing resistor combination, second thermistor , RTD and the second biasing resistor are connected together to generate a TCA output signal ; and processing circuitry, wherein the processing circuitry is configured to process the sensor signal and the TCA output signal to generate a sensor system output signal . a sensor article having a sensor sensing surface , wherein the sensor article is configured to sense the magnetic field of a magnetic target article located proximate the sensor sensing surface and generate a sensor signal ; a Temperature Compensation Article, TCA, , wherein the Temperature Compensation Article includes, a first Digital-to-Analog Converter, DAC, , a first thermistor and a first biasing resistor , wherein the first thermistor and the first biasing resistor are connected in a parallel configuration and the first DAC is connect to the first thermistor and the first biasing resistor in a series configuration, a second DAC and a second thermistor , wherein the second DAC and second thermistor are connected in a series configuration, a third DAC and a Resistive Temperature Detector ,RTD, , wherein the third DAC and RTD are connected in a series configuration, a fourth DAC and a second biasing resistor , wherein the fourth DAC and the second biasing resistor are connected in a series configuration, wherein the outputs of the first thermistor and first biasing resistor combination, second thermistor , RTD and the second biasing resistor are connected together to generate a TCA output signal ; and a first Digital-to-Analog Converter, DAC, , a first thermistor and a first biasing resistor , wherein the first thermistor and the first biasing resistor are connected in a parallel configuration and the first DAC is connect to the first thermistor and the first biasing resistor in a series configuration, a second DAC and a second thermistor , wherein the second DAC and second thermistor are connected in a series configuration, a third DAC and a Resistive Temperature Detector ,RTD, , wherein the third DAC and RTD are connected in a series configuration, a fourth DAC and a second biasing resistor , wherein the fourth DAC and the second biasing resistor are connected in a series configuration, wherein the outputs of the first thermistor and first biasing resistor combination, second thermistor , RTD and the second biasing resistor are connected together to generate a TCA output signal ; and processing circuitry, wherein the processing circuitry is configured to process the sensor signal and the TCA output signal to generate a sensor system output signal . <EOS>