An electronic module for a data carrier , said electronic module defining an extension direction (E) from a contact side of the electronic module towards a bonding side thereof; the electronic module comprising: - at least one substrate , the substrate preferably being dielectric; and - at least one indication device , wherein the indication device is configured to communicate with at least one integrated circuit chip , wherein the indication device is configured to receive at least one state signal being indicative of at least one state, wherein the indication device is further configured to yield at least one indication signal in response to the state signal, the at least one indication signal being indicative of the at least one state, and wherein the indication device is arranged below the substrate with respect to the extension direction (E), or wherein the indication device is comprised within the substrate ; characterized in that the electronic module further comprises at least one contact element being configured to establish a contact with an external contacting device, and wherein the at least one contact element delimits or comprises at least one opening that enables a passage of the indication signal yielded by the indication device . - at least one substrate , the substrate preferably being dielectric; and - at least one indication device , wherein the indication device is configured to communicate with at least one integrated circuit chip , wherein the indication device is configured to receive at least one state signal being indicative of at least one state, wherein the indication device is further configured to yield at least one indication signal in response to the state signal, the at least one indication signal being indicative of the at least one state, and wherein the indication device is arranged below the substrate with respect to the extension direction (E), or wherein the indication device is comprised within the substrate ; characterized in that the electronic module further comprises at least one contact element being configured to establish a contact with an external contacting device, and wherein the at least one contact element delimits or comprises at least one opening that enables a passage of the indication signal yielded by the indication device . wherein the indication device is configured to communicate with at least one integrated circuit chip , wherein the indication device is configured to receive at least one state signal being indicative of at least one state, wherein the indication device is further configured to yield at least one indication signal in response to the state signal, the at least one indication signal being indicative of the at least one state, and wherein the indication device is arranged below the substrate with respect to the extension direction (E), or wherein the indication device is comprised within the substrate ; characterized in that the electronic module further comprises at least one contact element being configured to establish a contact with an external contacting device, and wherein the at least one contact element delimits or comprises at least one opening that enables a passage of the indication signal yielded by the indication device . <EOS>