An ink composition comprising a P-type semiconductor material, an N-type semiconductor material and two or more solvents including a first solvent and a second solvent, wherein the total amount of the first solvent and the second solvent is 70% by weight or more with respect to 100% by weight of all the solvents contained in the ink composition; the boiling point of the first solvent is lower than the boiling point of the second solvent; the boiling point of the first solvent is 120°C or more and 400°C or less; and the hydrogen bond Hansen solubility parameter H1 (MPa 0.5 ) of the first solvent and the hydrogen bond Hansen solubility parameter H2 (MPa 0.5 ) of the second solvent are in the relation of 0.5 ≤ (H2-H1) ≤ 5.0; the first solvent is an aromatic hydrocarbon solvent; the second solvent is an ether solvent, a ketone solvent or an ester solvent; the amount of the first solvent is the largest among all the solvents; and characterized in that the P-type semiconductor material is a polymer compound comprising a repeating unit represented by the following (I-1) and/or the following formula (II-1) to (II-4) or (II-6) : wherein, Z represents a divalent group represented by (Z-1) to (Z-7), wherein, X 1 and X 2 each independently represent an oxygen atom or a sulfur atom, R represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a mono-valent heterocyclic group, a substituted amino group, an acyl group, an imine residue, a substituted amide group, an acid imide group, a substituted carboxyl group, an alkenyl group, an alkynyl group, a cyano group or a nitro group. the total amount of the first solvent and the second solvent is 70% by weight or more with respect to 100% by weight of all the solvents contained in the ink composition; the boiling point of the first solvent is lower than the boiling point of the second solvent; the boiling point of the first solvent is 120°C or more and 400°C or less; and the hydrogen bond Hansen solubility parameter H1 (MPa 0.5 ) of the first solvent and the hydrogen bond Hansen solubility parameter H2 (MPa 0.5 ) of the second solvent are in the relation of 0.5 ≤ (H2-H1) ≤ 5.0; the first solvent is an aromatic hydrocarbon solvent; the second solvent is an ether solvent, a ketone solvent or an ester solvent; the amount of the first solvent is the largest among all the solvents; and characterized in that the P-type semiconductor material is a polymer compound comprising a repeating unit represented by the following (I-1) and/or the following formula (II-1) to (II-4) or (II-6) : wherein, Z represents a divalent group represented by (Z-1) to (Z-7), wherein, X 1 and X 2 each independently represent an oxygen atom or a sulfur atom, R represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a mono-valent heterocyclic group, a substituted amino group, an acyl group, an imine residue, a substituted amide group, an acid imide group, a substituted carboxyl group, an alkenyl group, an alkynyl group, a cyano group or a nitro group. X 1 and X 2 each independently represent an oxygen atom or a sulfur atom, R represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a mono-valent heterocyclic group, a substituted amino group, an acyl group, an imine residue, a substituted amide group, an acid imide group, a substituted carboxyl group, an alkenyl group, an alkynyl group, a cyano group or a nitro group. <EOS>