Sensor for detecting a physical variable , comprising: - a sensor element for detecting an electrical signal that is dependent on the physical variable , - a substrate having a conductor track and carrying the sensor element , - an output interface for outputting the electrical signal to a superordinate device , and - a component for leading the electrical signal from the conductor track of the substrate to the output interface , comprising: - a circuit having at least one first signal path for receiving the electrical signal from the sensor element and for leading the electrical signal to the output interface and a second signal path , different from the first signal path , for receiving the electrical signal from the sensor element and for leading the electrical signal to the output interface , - wherein, depending on a position of the component in the sensor , the first signal path or the second signal path electrically contact-connects the sensor element to the output interface , wherein the circuit is encapsulated in an embedding compound , - pin areas via which the signal paths are exposed to the outside from the embedding compound in order to make contact with the sensor element and the output interface . - a sensor element for detecting an electrical signal that is dependent on the physical variable , - a substrate having a conductor track and carrying the sensor element , - an output interface for outputting the electrical signal to a superordinate device , and - a component for leading the electrical signal from the conductor track of the substrate to the output interface , comprising: - a circuit having at least one first signal path for receiving the electrical signal from the sensor element and for leading the electrical signal to the output interface and a second signal path , different from the first signal path , for receiving the electrical signal from the sensor element and for leading the electrical signal to the output interface , - wherein, depending on a position of the component in the sensor , the first signal path or the second signal path electrically contact-connects the sensor element to the output interface , wherein the circuit is encapsulated in an embedding compound , - pin areas via which the signal paths are exposed to the outside from the embedding compound in order to make contact with the sensor element and the output interface . - a circuit having at least one first signal path for receiving the electrical signal from the sensor element and for leading the electrical signal to the output interface and a second signal path , different from the first signal path , for receiving the electrical signal from the sensor element and for leading the electrical signal to the output interface , - wherein, depending on a position of the component in the sensor , the first signal path or the second signal path electrically contact-connects the sensor element to the output interface , wherein the circuit is encapsulated in an embedding compound , - pin areas via which the signal paths are exposed to the outside from the embedding compound in order to make contact with the sensor element and the output interface . <EOS>