A component mounting machine comprising: a board conveyance device configured to convey a board to a predetermined position; a component supply device configured to accommodate multiple components therein; a component mounting device , on which a mounting head capable of picking up and holding a component by vacuum pumping of a suction nozzle is installed, configured to mount a component taken out from the component supply device onto a board conveyed by the board conveyance device ; and a control device configured to control each of the devices , wherein in the component mounting device , through drive control of the control device , a lowering step of lowering the component, a component release step of releasing the component are performed with respect to the suction nozzle of the mounting head , and subsequently, a first lifting step of lifting the suction nozzle to a middle height is performed, and a component re-pickup step of the suction nozzle is performed at the height of the first lifting step using vacuum pumping such that, if an electronic component is adhering to a distal end of the suction nozzle , it is held again and the state is stabilized, and a second lifting step after the component re-pickup step is performed, characterized in that the component mounting machine further comprising: a component measurement device in which a component is placed inside a component measurement section such that a periphery of the component is surrounded, and then measurement is performed on the component, wherein in the first lifting step, a suction port of the suction nozzle is inside the component measurement section . a board conveyance device configured to convey a board to a predetermined position; a component supply device configured to accommodate multiple components therein; a component mounting device , on which a mounting head capable of picking up and holding a component by vacuum pumping of a suction nozzle is installed, configured to mount a component taken out from the component supply device onto a board conveyed by the board conveyance device ; and a control device configured to control each of the devices , wherein in the component mounting device , through drive control of the control device , a lowering step of lowering the component, a component release step of releasing the component are performed with respect to the suction nozzle of the mounting head , and subsequently, a first lifting step of lifting the suction nozzle to a middle height is performed, and a component re-pickup step of the suction nozzle is performed at the height of the first lifting step using vacuum pumping such that, if an electronic component is adhering to a distal end of the suction nozzle , it is held again and the state is stabilized, and a second lifting step after the component re-pickup step is performed, characterized in that the component mounting machine further comprising: a component measurement device in which a component is placed inside a component measurement section such that a periphery of the component is surrounded, and then measurement is performed on the component, wherein in the first lifting step, a suction port of the suction nozzle is inside the component measurement section . a component measurement device in which a component is placed inside a component measurement section such that a periphery of the component is surrounded, and then measurement is performed on the component, wherein in the first lifting step, a suction port of the suction nozzle is inside the component measurement section . <EOS>