A lidless electronic package , comprising: a substrate having a surface ; a die disposed on the surface of the substrate , the die having an outside perimeter, a bottom surface adjacent to the surface of the substrate , and a top surface opposite the bottom surface; and a stiffener disposed on the surface of the substrate and that encloses at least a portion of the outside perimeter of the die , the stiffener including: a first surface that is at a first distance from the surface of the substrate , the first distance being greater than a distance between the surface of the substrate and the top surface of the die ; and a second surface that is disposed between the die and the first surface , the second surface being at a second distance from the surface of the substrate , wherein the second distance is less than the distance between the surface of the substrate and the top surface of the die ; wherein the first surface is above the top surface of the die and the second surface is below the top surface of the die ; characterised in that the stiffener comprises a sloped surface that extends from the first surface to the second surface, the sloped surface being at a more than ninety-degree angle with respect to the second surface . a substrate having a surface ; a die disposed on the surface of the substrate , the die having an outside perimeter, a bottom surface adjacent to the surface of the substrate , and a top surface opposite the bottom surface; and a stiffener disposed on the surface of the substrate and that encloses at least a portion of the outside perimeter of the die , the stiffener including: a first surface that is at a first distance from the surface of the substrate , the first distance being greater than a distance between the surface of the substrate and the top surface of the die ; and a second surface that is disposed between the die and the first surface , the second surface being at a second distance from the surface of the substrate , wherein the second distance is less than the distance between the surface of the substrate and the top surface of the die ; wherein the first surface is above the top surface of the die and the second surface is below the top surface of the die ; characterised in that the stiffener comprises a sloped surface that extends from the first surface to the second surface, the sloped surface being at a more than ninety-degree angle with respect to the second surface . a first surface that is at a first distance from the surface of the substrate , the first distance being greater than a distance between the surface of the substrate and the top surface of the die ; and a second surface that is disposed between the die and the first surface , the second surface being at a second distance from the surface of the substrate , wherein the second distance is less than the distance between the surface of the substrate and the top surface of the die ; wherein the first surface is above the top surface of the die and the second surface is below the top surface of the die ; characterised in that the stiffener comprises a sloped surface that extends from the first surface to the second surface, the sloped surface being at a more than ninety-degree angle with respect to the second surface . <EOS>