A MEMS manipulation device , comprising a substrate and a manipulation structure extending on the substrate and including a body formed by a structural layer , a supporting layer on the structural layer, and a thin film piezoelectric layer on the supporting layer, the manipulation structure including: a first manipulation arm (40; 401); a first gripping element carried by the first manipulation arm (40; 401); a second manipulation arm (41; 405); and a second gripping element carried by the second manipulation arm (41; 405) and facing the first gripping element ; wherein the first manipulation arm (40; 401) comprises a first driving arm (2; 302; 402) and a first articulated arm (4; 403) having respective first and second ends (2A, 2B; 4A, 4B), the first end of the first driving arm (2; 302; 402) being constrained to the substrate and the second end of the first driving arm (2; 302; 402) being articulated to the first end of the first articulated arm (4; 403) through a first articulation structure , the first driving arm (2; 302; 402) comprises a first beam element formed by the supporting layer and a first piezoelectric region (29; 129), formed by the thin film piezoelectric layer on or in the first beam element, the first beam element having a main extension in an extension plane and a thickness in a thickness direction, perpendicular to the extension plane, the thickness being smaller than the main extension, the first and the second ends of the first driving arm (2; 302; 402) comprising portions of the supporting layer and portions (192; 192', 192") of the structural layer , and the first articulation structure comprises a first constraint element not deformable in the thickness direction, and a first hinge structure , interposed between the first driving arm (2; 302; 402), the first articulated arm (4; 403), and the first constraint element . a first manipulation arm (40; 401); a first gripping element carried by the first manipulation arm (40; 401); a second manipulation arm (41; 405); and a second gripping element carried by the second manipulation arm (41; 405) and facing the first gripping element ; wherein the first manipulation arm (40; 401) comprises a first driving arm (2; 302; 402) and a first articulated arm (4; 403) having respective first and second ends (2A, 2B; 4A, 4B), the first end of the first driving arm (2; 302; 402) being constrained to the substrate and the second end of the first driving arm (2; 302; 402) being articulated to the first end of the first articulated arm (4; 403) through a first articulation structure , the first driving arm (2; 302; 402) comprises a first beam element formed by the supporting layer and a first piezoelectric region (29; 129), formed by the thin film piezoelectric layer on or in the first beam element, the first beam element having a main extension in an extension plane and a thickness in a thickness direction, perpendicular to the extension plane, the thickness being smaller than the main extension, the first and the second ends of the first driving arm (2; 302; 402) comprising portions of the supporting layer and portions (192; 192', 192") of the structural layer , and the first articulation structure comprises a first constraint element not deformable in the thickness direction, and a first hinge structure , interposed between the first driving arm (2; 302; 402), the first articulated arm (4; 403), and the first constraint element . <EOS>