A method of manufacturing a display module including a plurality of pixels (100-1, 100-2), the method comprising: forming a driving circuit layer on a substrate , the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits ; forming an adhesive layer on the driving circuit layer ; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads ; and forming a black matrix layer on the adhesive layer , between the plurality of LEDs , being characterised by : attaching a black matrix formation layer , attached to a film , onto the plurality of LEDs and onto a portion of the adhesive layer formed between the plurality of LEDs , and removing a first portion of the black matrix formation layer , attached on the plurality of LEDs , together with the film such that a second portion of the black matrix formation layer remains between the plurality of LEDs as the black matrix layer , wherein each of the plurality of pixels (100-1, 100-2) includes a plurality of sub pixels, and wherein each of the plurality of electrode pads includes a first area for bonding a first LED corresponding to a sub pixel among the plurality of sub pixels and a second area for bonding a second LED corresponding to the sub pixel based on the first LED being defective. forming a driving circuit layer on a substrate , the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits ; forming an adhesive layer on the driving circuit layer ; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads ; and forming a black matrix layer on the adhesive layer , between the plurality of LEDs , being characterised by : attaching a black matrix formation layer , attached to a film , onto the plurality of LEDs and onto a portion of the adhesive layer formed between the plurality of LEDs , and removing a first portion of the black matrix formation layer , attached on the plurality of LEDs , together with the film such that a second portion of the black matrix formation layer remains between the plurality of LEDs as the black matrix layer , attaching a black matrix formation layer , attached to a film , onto the plurality of LEDs and onto a portion of the adhesive layer formed between the plurality of LEDs , and removing a first portion of the black matrix formation layer , attached on the plurality of LEDs , together with the film such that a second portion of the black matrix formation layer remains between the plurality of LEDs as the black matrix layer , wherein each of the plurality of pixels (100-1, 100-2) includes a plurality of sub pixels, and wherein each of the plurality of electrode pads includes a first area for bonding a first LED corresponding to a sub pixel among the plurality of sub pixels and a second area for bonding a second LED corresponding to the sub pixel based on the first LED being defective. <EOS>