Battery cell supervision circuit carrier configured to be mounted to a battery system and comprising: a shunt resistor for performing shunt based current sensing, a circuit carrier board having a first region and a second region , wherein the shunt resistor is surface mounted in the first region , wherein a first shunt contact pad and a second shunt contact pad are disposed in the first region , and wherein the second region is configured to receive further electronic components, wherein the first region and the second region are separated from each other by a third region configured for forming a flexible connection between the first region and the second region and comprising a spring-like structure formed from the circuit carrier board , wherein the circuit carrier board is a multi-layer circuit carrier board comprising at least three electrically isolated carrier layers , providing at least one central voltage path layer that is enclosed via at least two outer layers that are configured for shielding said at least one voltage path, wherein the at least three carrier layers comprise a metallization within the third region for said shielding purpose, wherein the metallization of the at least one inner carrier layer is partially removed in order to create a first conductive path (61.1, 62.1) and a second conductive path (61.2, 62.2) forming the at least one voltage path on the at least third carrier layer , wherein the lateral remainders of the surface metallization of the at least one inner carrier layer are electrically connected to the metallizations of the outer carrier layers via through hole vias in order to contribute to the electromagnetic shielding, wherein said first conductive path (61.1, 62.1) is connected to the first shunt contact pad and said second conductive path (61.2, 62.2) is connected to the second shunt contact pad . a shunt resistor for performing shunt based current sensing, a circuit carrier board having a first region and a second region , wherein the shunt resistor is surface mounted in the first region , wherein a first shunt contact pad and a second shunt contact pad are disposed in the first region , and wherein the second region is configured to receive further electronic components, wherein the first region and the second region are separated from each other by a third region configured for forming a flexible connection between the first region and the second region and comprising a spring-like structure formed from the circuit carrier board , wherein the circuit carrier board is a multi-layer circuit carrier board comprising at least three electrically isolated carrier layers , providing at least one central voltage path layer that is enclosed via at least two outer layers that are configured for shielding said at least one voltage path, wherein the at least three carrier layers comprise a metallization within the third region for said shielding purpose, wherein the metallization of the at least one inner carrier layer is partially removed in order to create a first conductive path (61.1, 62.1) and a second conductive path (61.2, 62.2) forming the at least one voltage path on the at least third carrier layer , wherein the lateral remainders of the surface metallization of the at least one inner carrier layer are electrically connected to the metallizations of the outer carrier layers via through hole vias in order to contribute to the electromagnetic shielding, wherein said first conductive path (61.1, 62.1) is connected to the first shunt contact pad and said second conductive path (61.2, 62.2) is connected to the second shunt contact pad . <EOS>