A printed circuit board, PCB, laminated structure , comprising: a first substrate ; a second substrate disposed to overlap with the first substrate ; and an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates , wherein the interposer assembly comprises: a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate ; a plurality of signal vias electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate ; and a plurality of ground vias electrically coupled to the housing and configured to serve as a ground, wherein the ground vias are positioned apart from the signal vias , wherein a metal coating layer is disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates , and wherein the plurality of signal vias and the plurality of ground vias are arranged at predetermined intervals along a circumference of the closed region, wherein two or more signal vias are consecutively arranged on both sides of each ground via . a first substrate ; a second substrate disposed to overlap with the first substrate ; and an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates , wherein the interposer assembly comprises: a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate ; a plurality of signal vias electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate ; and a plurality of ground vias electrically coupled to the housing and configured to serve as a ground, wherein the ground vias are positioned apart from the signal vias , wherein a metal coating layer is disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates , and wherein the plurality of signal vias and the plurality of ground vias are arranged at predetermined intervals along a circumference of the closed region, wherein two or more signal vias are consecutively arranged on both sides of each ground via . a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate ; a plurality of signal vias electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate ; and a plurality of ground vias electrically coupled to the housing and configured to serve as a ground, wherein the ground vias are positioned apart from the signal vias , wherein a metal coating layer is disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates , and wherein the plurality of signal vias and the plurality of ground vias are arranged at predetermined intervals along a circumference of the closed region, wherein two or more signal vias are consecutively arranged on both sides of each ground via . <EOS>