An optical module packaging structure comprising: a top cover ; a bottom plate with a cavity configured to receive an electrical connector ; a middle housing including: a surrounding housing comprising a left side wall and a right side wall , which are in relative positional relationship; and a front side wall and a rear side wall which are in relative positional relationship; wherein the top cover is mounted on the top of the surrounding housing and the bottom plate is positioned at the bottom of the surrounding housing ; a traversing plate extending from the inner side of the left side wall of the surrounding housing to the inner side of the right side wall of the surrounding housing to form two strip-shaped mounting holes at relative positions along the extending direction of the traversing plate , wherein the strip-shaped mounting holes are configured to allow the two lateral flex boards of a PCB to pass through and extend from the bottom to the top of the traversing plate as the PCB of the optical module being mounted onto the bottom surface of the traversing plate ; and a chip carrier , which is disposed on the top surface of the traversing plate , configured to bear heat-generating chips as the optical module working; and wherein the surrounding housing , the traversing plate , and the chip carrier is integrally made of metal material. a top cover ; a bottom plate with a cavity configured to receive an electrical connector ; a middle housing including: a surrounding housing comprising a left side wall and a right side wall , which are in relative positional relationship; and a front side wall and a rear side wall which are in relative positional relationship; wherein the top cover is mounted on the top of the surrounding housing and the bottom plate is positioned at the bottom of the surrounding housing ; a traversing plate extending from the inner side of the left side wall of the surrounding housing to the inner side of the right side wall of the surrounding housing to form two strip-shaped mounting holes at relative positions along the extending direction of the traversing plate , wherein the strip-shaped mounting holes are configured to allow the two lateral flex boards of a PCB to pass through and extend from the bottom to the top of the traversing plate as the PCB of the optical module being mounted onto the bottom surface of the traversing plate ; and a chip carrier , which is disposed on the top surface of the traversing plate , configured to bear heat-generating chips as the optical module working; and a surrounding housing comprising a left side wall and a right side wall , which are in relative positional relationship; and a front side wall and a rear side wall which are in relative positional relationship; wherein the top cover is mounted on the top of the surrounding housing and the bottom plate is positioned at the bottom of the surrounding housing ; a traversing plate extending from the inner side of the left side wall of the surrounding housing to the inner side of the right side wall of the surrounding housing to form two strip-shaped mounting holes at relative positions along the extending direction of the traversing plate , wherein the strip-shaped mounting holes are configured to allow the two lateral flex boards of a PCB to pass through and extend from the bottom to the top of the traversing plate as the PCB of the optical module being mounted onto the bottom surface of the traversing plate ; and a chip carrier , which is disposed on the top surface of the traversing plate , configured to bear heat-generating chips as the optical module working; and wherein the surrounding housing , the traversing plate , and the chip carrier is integrally made of metal material. <EOS>