A computer-controlled apparatus for laser scribing at least one line segment via hole in a thin-film device that comprises on a first side of at least one substrate , at least: - one front-contact layer ; - one semiconductive optoelectronically active layer ; - one back-contact layer ; wherein the apparatus comprising: - at least one laser source emitting at least one laser beam ; - means comprising at least one mirror that cooperates with said at least one laser beam to form at least one laser spot on the first side of said device; - at least one actuator configured to move at least one laser spot for laser scribing the thin-film device along at least one direction by delivering laser power to said thin-film device ; - at least one optical sensor configured to acquire imaging data of said first side of said at least one line segment via hole , and - at least one control system , comprising a processing unit and a memory unit, for executing instructions for processing said imaging data, characterized in that said control system is operative to execute: - image processing instructions for measuring in the imaging data, along a direction that is orthogonal to at least one direction of laser scribing said at least one line segment via hole : - a first characteristic of a line segment via hole, namely the width of a curl-up of the back-contact layer ; - a second characteristic of a line segment via hole, namely the width of a lip of conductive alloy resulting from a permanent change in the chemical composition of the semiconductive optoelectronically active layer where the line segment via hole is drilled. - one front-contact layer ; - one semiconductive optoelectronically active layer ; - one back-contact layer ; - at least one laser source emitting at least one laser beam ; - means comprising at least one mirror that cooperates with said at least one laser beam to form at least one laser spot on the first side of said device; - at least one actuator configured to move at least one laser spot for laser scribing the thin-film device along at least one direction by delivering laser power to said thin-film device ; - at least one optical sensor configured to acquire imaging data of said first side of said at least one line segment via hole , and - at least one control system , comprising a processing unit and a memory unit, for executing instructions for processing said imaging data, characterized in that said control system is operative to execute: - image processing instructions for measuring in the imaging data, along a direction that is orthogonal to at least one direction of laser scribing said at least one line segment via hole : - a first characteristic of a line segment via hole, namely the width of a curl-up of the back-contact layer ; - a second characteristic of a line segment via hole, namely the width of a lip of conductive alloy resulting from a permanent change in the chemical composition of the semiconductive optoelectronically active layer where the line segment via hole is drilled. - image processing instructions for measuring in the imaging data, along a direction that is orthogonal to at least one direction of laser scribing said at least one line segment via hole : - a first characteristic of a line segment via hole, namely the width of a curl-up of the back-contact layer ; - a second characteristic of a line segment via hole, namely the width of a lip of conductive alloy resulting from a permanent change in the chemical composition of the semiconductive optoelectronically active layer where the line segment via hole is drilled. <EOS>