An electronic device comprising: a discrete transistor comprising a semiconductor chip encapsulated in a package made of an insulating material leaving access to a first pad of connection to a first conduction terminal (S) of the transistor, a second pad of connection to a second conduction terminal (D) of the transistor, and a third pad of connection to a control terminal (G) of the transistor ; and a printed circuit board comprising first , second , third and fourth separate connection pads, wherein : - the transistor is assembled on the printed circuit board so that the first connection pad of the transistor is in contact with the first and second pads of connection of the printed circuit board and the second and third connection pads of the transistor are respectively in contact with the third and fourth connection pads of the printed circuit board ; characterized in that - the device further comprises, assembled on the printed circuit board , a circuit of control of the transistor, connected to the control terminal (G) of the transistor via the fourth connection pad of the printed circuit board and to the first conduction terminal (S) of the transistor via the second connection pad of the printed circuit board; and - the first connection pad of the printed circuit board is connected to a power conduction terminal (A2) of the device. a discrete transistor comprising a semiconductor chip encapsulated in a package made of an insulating material leaving access to a first pad of connection to a first conduction terminal (S) of the transistor, a second pad of connection to a second conduction terminal (D) of the transistor, and a third pad of connection to a control terminal (G) of the transistor ; and a printed circuit board comprising first , second , third and fourth separate connection pads, wherein : - the transistor is assembled on the printed circuit board so that the first connection pad of the transistor is in contact with the first and second pads of connection of the printed circuit board and the second and third connection pads of the transistor are respectively in contact with the third and fourth connection pads of the printed circuit board ; characterized in that - the device further comprises, assembled on the printed circuit board , a circuit of control of the transistor, connected to the control terminal (G) of the transistor via the fourth connection pad of the printed circuit board and to the first conduction terminal (S) of the transistor via the second connection pad of the printed circuit board; and - the first connection pad of the printed circuit board is connected to a power conduction terminal (A2) of the device. - the transistor is assembled on the printed circuit board so that the first connection pad of the transistor is in contact with the first and second pads of connection of the printed circuit board and the second and third connection pads of the transistor are respectively in contact with the third and fourth connection pads of the printed circuit board ; characterized in that - the device further comprises, assembled on the printed circuit board , a circuit of control of the transistor, connected to the control terminal (G) of the transistor via the fourth connection pad of the printed circuit board and to the first conduction terminal (S) of the transistor via the second connection pad of the printed circuit board; and - the first connection pad of the printed circuit board is connected to a power conduction terminal (A2) of the device. <EOS>