A method for manufacturing a leadless solid electrolyte capacitor comprising the following steps: - placing a valve-metal anode slug with its lower side on a substrate with a first conductive pad , a second conductive pad and a, preferably screen printed, non-conductive epoxy target area without solder mask , wherein the non-conductive epoxy target area without solder mask is accommodated in between and electrically isolating the first conductive pad and the second conductive pad , - curing the non-conductive epoxy, - depositing a first conductive layer on the first end-face of the valve-metal anode slug and curing the first conductive layer , thereby electrically connecting the valve-metal anode slug with the first conductive pad , - forming a dielectric on the valve-metal material of the valve-metal anode slug by anodization, thereby providing an oxidized valve-metal anode slug, - depositing and curing a first non-conductive layer to cover an exposed surface of the first conductive layer , - depositing a MnO2 layer, preferably several times, and an electrically conductive coating, preferably Ag or graphite, on the exposed surfaces of the oxidized valve-metal anode slug , - depositing a second conductive layer on the second end-face of the valve-metal anode slug provided with the MnO2 layer and the electrically conductive coating accommodated above the MnO2 layer and curing the second conductive layer, thereby forming a cathode connected with the second conductive pad , - overmolding, and - singulating of each single capacitor and the assembled substrate , in case the above procedure was accomplished for a plurality of valve-metal anode slugs on a single substrate . - placing a valve-metal anode slug with its lower side on a substrate with a first conductive pad , a second conductive pad and a, preferably screen printed, non-conductive epoxy target area without solder mask , wherein the non-conductive epoxy target area without solder mask is accommodated in between and electrically isolating the first conductive pad and the second conductive pad , - curing the non-conductive epoxy, - depositing a first conductive layer on the first end-face of the valve-metal anode slug and curing the first conductive layer , thereby electrically connecting the valve-metal anode slug with the first conductive pad , - forming a dielectric on the valve-metal material of the valve-metal anode slug by anodization, thereby providing an oxidized valve-metal anode slug, - depositing and curing a first non-conductive layer to cover an exposed surface of the first conductive layer , - depositing a MnO2 layer, preferably several times, and an electrically conductive coating, preferably Ag or graphite, on the exposed surfaces of the oxidized valve-metal anode slug , - depositing a second conductive layer on the second end-face of the valve-metal anode slug provided with the MnO2 layer and the electrically conductive coating accommodated above the MnO2 layer and curing the second conductive layer, thereby forming a cathode connected with the second conductive pad , - overmolding, and - singulating of each single capacitor and the assembled substrate , in case the above procedure was accomplished for a plurality of valve-metal anode slugs on a single substrate . <EOS>