A force sensor comprising: a leadframe comprising: a base material, a first side , a second side opposite the first side , a plurality of conductive traces supported by the base material, and a plurality of leads each electrically coupled to one or more of the plurality of conductive traces, each of the plurality of leads having a lead end that is spaced from the base material; a sense die electrically coupled to two or more of the plurality of conductive traces, the sense die comprising: one or more piezoresistive sensing elements for sensing a force applied to the sense die , a diaphragm , a top side , and a bottom side opposite the top side , with a sense die side wall extending between the top side and the bottom side of the sense die , wherein the bottom side of the sense die faces the first side of the leadframe , wherein the sense die is mounted over an opening in the leadframe , and wherein the opening in the leadframe is aligned with the diaphragm ; a first actuation element disposed in contact with the bottom side of the sense die ; a second actuation element disposed in contact with the top side of the sense die ; a plurality of wire bonds for electrically coupling the sense die to the plurality of conductive traces; and an encapsulant configured to overmold both the base material and the sense die for providing structural rigidity to the force sensor , wherein the encapsulant is configured to cover the two or more wire bonds , and wherein the lead end of at least some of the plurality of leads extends outside of the encapsulant to allow for an electrical coupling of the lead end to an external component; wherein the first actuation element comprises a mechanical coupling element configured to mechanically couple an external force with the sense die ; and characterized in that the first actuation element is snap fitted through the opening and retained between the opening and the diaphragm . a leadframe comprising: a base material, a first side , a second side opposite the first side , a plurality of conductive traces supported by the base material, and a plurality of leads each electrically coupled to one or more of the plurality of conductive traces, each of the plurality of leads having a lead end that is spaced from the base material; a sense die electrically coupled to two or more of the plurality of conductive traces, the sense die comprising: one or more piezoresistive sensing elements for sensing a force applied to the sense die , a diaphragm , a top side , and a bottom side opposite the top side , with a sense die side wall extending between the top side and the bottom side of the sense die , wherein the bottom side of the sense die faces the first side of the leadframe , wherein the sense die is mounted over an opening in the leadframe , and wherein the opening in the leadframe is aligned with the diaphragm ; a first actuation element disposed in contact with the bottom side of the sense die ; a second actuation element disposed in contact with the top side of the sense die ; a plurality of wire bonds for electrically coupling the sense die to the plurality of conductive traces; and an encapsulant configured to overmold both the base material and the sense die for providing structural rigidity to the force sensor , wherein the encapsulant is configured to cover the two or more wire bonds , and wherein the lead end of at least some of the plurality of leads extends outside of the encapsulant to allow for an electrical coupling of the lead end to an external component; wherein the first actuation element comprises a mechanical coupling element configured to mechanically couple an external force with the sense die ; and characterized in that the first actuation element is snap fitted through the opening and retained between the opening and the diaphragm . <EOS>