A superconductor comprising: a substrate having a tape shape that extends in a first direction and having surfaces which are defined as a top surface, a bottom surface, and both side surfaces; a superconducting layer disposed on the top surface of the substrate ; a first stabilizing layer disposed on the superconducting layer and containing a first metal; a protective layer disposed on the first stabilizing layer and containing a second metal which is different from the first metal; a first alloy layer disposed between the first stabilizing layer and the protective layer , and containing the first and second metals, wherein the protective layer is in contact with opposing side surfaces of each of the substrate , the superconducting layer , the first stabilizing layer and the first alloy layer , and the bottom surface of the substrate , wherein the protective layer surrounds the substrate , the superconducting layer , the first stabilizing layer and the first alloy layer ; a second stabilizing layer disposed only on a top surface, only a bottom surface, or only a top and a bottom surface of the protective layer ; a low melting point metal layer disposed between the protective layer and the second stabilizing layer , the low melting point metal layer containing a third metal which is different from the first metal and the second metal, and a second alloy layer disposed between the protective layer and the low melting point metal layer , the second alloy layer having a surface area larger than a surface area of the first alloy layer and containing the second metal and the third metal, wherein the low melting point metal layer is disposed on a top surface, a bottom surface, and both side walls of the protective layer. a substrate having a tape shape that extends in a first direction and having surfaces which are defined as a top surface, a bottom surface, and both side surfaces; a superconducting layer disposed on the top surface of the substrate ; a first stabilizing layer disposed on the superconducting layer and containing a first metal; a protective layer disposed on the first stabilizing layer and containing a second metal which is different from the first metal; a first alloy layer disposed between the first stabilizing layer and the protective layer , and containing the first and second metals, wherein the protective layer is in contact with opposing side surfaces of each of the substrate , the superconducting layer , the first stabilizing layer and the first alloy layer , and the bottom surface of the substrate , wherein the protective layer surrounds the substrate , the superconducting layer , the first stabilizing layer and the first alloy layer ; a second stabilizing layer disposed only on a top surface, only a bottom surface, or only a top and a bottom surface of the protective layer ; a low melting point metal layer disposed between the protective layer and the second stabilizing layer , the low melting point metal layer containing a third metal which is different from the first metal and the second metal, and a second alloy layer disposed between the protective layer and the low melting point metal layer , the second alloy layer having a surface area larger than a surface area of the first alloy layer and containing the second metal and the third metal, wherein the low melting point metal layer is disposed on a top surface, a bottom surface, and both side walls of the protective layer. <EOS>