An ultrasonic imaging apparatus comprising: an ultrasonic probe arranged at a distal end portion of the ultrasonic imaging apparatus , and a bending part connected to the ultrasonic probe and configured to be bendable, wherein heat generated by the ultrasonic probe is dissipated toward the bending part , wherein the ultrasonic probe includes: an ultrasonic transducer ; an integrated circuit which includes a front surface and a rear surface, the ultrasonic transducer being arranged on the front surface of the integrated circuit ; a printed circuit board which includes a front surface and a rear surface, the rear surface of the integrated circuit being arranged on the front surface of the printed circuit board ; and a heat spreader configured to absorb heat generated by the integrated circuit , the beat spreader being arranged on the rear surface of the printed circuit board ; the ultrasound imaging apparatus further comprising: a heat transferer connected to the heat spreader and configured to transfer heat absorbed by the heat spreader toward the bending part , wherein the heat transferer includes a refrigerant circulation device, wherein the refrigerant circulation device includes a refrigerant circulation tube configured to circulate a refrigerant therethrough, wherein the heat spreader includes: an inner casing coupled to the refrigerant circulation tube and having a passage (P) formed therein configured to circulate the refrigerant therethrough; and an outer casing formed with a coupling recess (C) and having a shape which corresponds to the inner casing . an ultrasonic probe arranged at a distal end portion of the ultrasonic imaging apparatus , and a bending part connected to the ultrasonic probe and configured to be bendable, wherein heat generated by the ultrasonic probe is dissipated toward the bending part , an ultrasonic transducer ; an integrated circuit which includes a front surface and a rear surface, the ultrasonic transducer being arranged on the front surface of the integrated circuit ; a printed circuit board which includes a front surface and a rear surface, the rear surface of the integrated circuit being arranged on the front surface of the printed circuit board ; and a heat spreader configured to absorb heat generated by the integrated circuit , the beat spreader being arranged on the rear surface of the printed circuit board ; a heat transferer connected to the heat spreader and configured to transfer heat absorbed by the heat spreader toward the bending part , wherein the heat transferer includes a refrigerant circulation device, wherein the refrigerant circulation device includes a refrigerant circulation tube configured to circulate a refrigerant therethrough, wherein the heat spreader includes: an inner casing coupled to the refrigerant circulation tube and having a passage (P) formed therein configured to circulate the refrigerant therethrough; and an outer casing formed with a coupling recess (C) and having a shape which corresponds to the inner casing . an inner casing coupled to the refrigerant circulation tube and having a passage (P) formed therein configured to circulate the refrigerant therethrough; and an outer casing formed with a coupling recess (C) and having a shape which corresponds to the inner casing . <EOS>