A circuit board for a camera module, comprising: a rigid circuit board layer , wherein the rigid circuit board layer includes a first part of rigid circuit board layer ; a flexible circuit board layer , wherein the rigid circuit board layer is arranged on a front side of the flexible circuit board layer , and the flexible circuit board layer includes a first part of flexible circuit board layer and a second part of flexible circuit board layer (10A"), and the first part of flexible circuit board layer extends to the second part of flexible circuit board layer (10A"); a chip connection portion , wherein the chip connection portion includes the first part of rigid circuit board layer and a part of the first part of flexible circuit board layer overlapping the first part of rigid circuit board layer ; and a bending portion , wherein the bending portion includes at least part of the second part of flexible circuit board layer (10A"), wherein the rigid circuit board layer further includes a second part of rigid circuit board layer (10B") disposed on the second part of flexible circuit board layer (10A"), wherein the bending portion includes the second part of rigid circuit board layer (10B"), characterized in that the bending portion is connected to the chip connection portion in an invertible manner and can be inverted relative to the chip connection portion , so that the bending portion overlaps and is adjacent to the chip connection portion when the flexible circuit board layer is bent, and a rear side of the first part of flexible circuit board layer and a rear side of second part of flexible circuit board layer (10A") face each other directly, wherein the first part of flexible circuit board layer and second part of flexible circuit board layer (10A") are located between the second part of rigid circuit board layer (10B") and the first part of rigid circuit board layer which are overlapping each other. a rigid circuit board layer , wherein the rigid circuit board layer includes a first part of rigid circuit board layer ; a flexible circuit board layer , wherein the rigid circuit board layer is arranged on a front side of the flexible circuit board layer , and the flexible circuit board layer includes a first part of flexible circuit board layer and a second part of flexible circuit board layer (10A"), and the first part of flexible circuit board layer extends to the second part of flexible circuit board layer (10A"); a chip connection portion , wherein the chip connection portion includes the first part of rigid circuit board layer and a part of the first part of flexible circuit board layer overlapping the first part of rigid circuit board layer ; and a bending portion , wherein the bending portion includes at least part of the second part of flexible circuit board layer (10A"), wherein the rigid circuit board layer further includes a second part of rigid circuit board layer (10B") disposed on the second part of flexible circuit board layer (10A"), wherein the bending portion includes the second part of rigid circuit board layer (10B"), characterized in that the bending portion is connected to the chip connection portion in an invertible manner and can be inverted relative to the chip connection portion , so that the bending portion overlaps and is adjacent to the chip connection portion when the flexible circuit board layer is bent, and a rear side of the first part of flexible circuit board layer and a rear side of second part of flexible circuit board layer (10A") face each other directly, wherein the first part of flexible circuit board layer and second part of flexible circuit board layer (10A") are located between the second part of rigid circuit board layer (10B") and the first part of rigid circuit board layer which are overlapping each other. <EOS>