A polyamideimide resin composition comprising a polyamideimide resin, a solvent and a coupling agent, wherein the polyamideimide resin contains a structural unit (Ia) represented by a formula shown below, a structural unit (IIa) represented by a formula shown below, a structural unit (IIIa) represented by a formula shown below, and a structural unit (IVa) represented by a formula shown below, a glass transition temperature of a film obtained by applying and then heating and drying the polyamideimide resin composition is 300°C or higher, determined as described in the description: wherein in formula (Ia), each X independently represents a hydrogen atom, or at least one substituent selected from the group consisting of halogen atoms, alkyl groups of 1 to 9 carbon atoms, and alkoxy groups and hydroxyalkyl groups of 1 to 9 carbon atoms, and in formula (IIa), each R independently represents a hydrogen atom or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms and halogen atoms, and n represents an integer of 1 to 6, in formula (IIIa), A represents an oxygen atom, a sulfur atom, one group selected from the group consisting of a carbonyl group, sulfonyl group, methylene group, dimethylmethylene group, hexafluoroisopropylidene group, amide group, ester group, diphenyl ketone group, 1,4-phenyleneoxy group, 1,4-biphenyleneoxy group, sulfonyl-bis(1,4-phenyleneoxy) group, isopropylidene-bis(1,4-phenyleneoxy) group and hexafluoroisopropylidene-bis(1,4-phenyleneoxy) group, or a single bond, and each B independently represents a hydrogen atom, or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms, a trifluoromethyl group, carboxylic acid groups, a hydroxy group, and halogen atoms. the polyamideimide resin contains a structural unit (Ia) represented by a formula shown below, a structural unit (IIa) represented by a formula shown below, a structural unit (IIIa) represented by a formula shown below, and a structural unit (IVa) represented by a formula shown below, a glass transition temperature of a film obtained by applying and then heating and drying the polyamideimide resin composition is 300°C or higher, determined as described in the description: wherein in formula (Ia), each X independently represents a hydrogen atom, or at least one substituent selected from the group consisting of halogen atoms, alkyl groups of 1 to 9 carbon atoms, and alkoxy groups and hydroxyalkyl groups of 1 to 9 carbon atoms, and in formula (IIa), each R independently represents a hydrogen atom or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms and halogen atoms, and n represents an integer of 1 to 6, in formula (IIIa), A represents an oxygen atom, a sulfur atom, one group selected from the group consisting of a carbonyl group, sulfonyl group, methylene group, dimethylmethylene group, hexafluoroisopropylidene group, amide group, ester group, diphenyl ketone group, 1,4-phenyleneoxy group, 1,4-biphenyleneoxy group, sulfonyl-bis(1,4-phenyleneoxy) group, isopropylidene-bis(1,4-phenyleneoxy) group and hexafluoroisopropylidene-bis(1,4-phenyleneoxy) group, or a single bond, and each B independently represents a hydrogen atom, or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms, a trifluoromethyl group, carboxylic acid groups, a hydroxy group, and halogen atoms. <EOS>