An ultra-miniaturized light-emitting unit for a medical endoscopic instrument, wherein the light-emitting unit defines a main emission direction (H), and has - a semiconductor element extending in a planar manner substantially orthogonally to the main emission direction (H) with a light emission side facing in the main emission direction (H) and a contact side facing away from the main emission direction (H), and - an insulating element , wherein the insulating element has a first portion and a substantially L-shaped second portion laterally encompassing the semiconductor element , so that a part of the L-shaped second portion rests on the light emission side of the semiconductor element , wherein a conductor element is embedded in the insulation element and extends from the first portion of the insulating element through the second portion of the insulating element , wherein a first contact region of the conductor element in the first portion of the insulating element can electrically contact a first connection terminal and a second contact region of the conductor element in the second portion of the insulating element electrically contacts the light emission side of the semiconductor element , and wherein the contact side of the semiconductor element can electrically contact a second connection terminal , wherein the insulating element inclusive of embedded conductor element is flexible and is formed as a folded flexible printed circuit board, wherein the flexible printed circuit board has a first of at least one fold line running substantially orthogonally to the main emission direction (H), wherein the L-shape of the second portion of the insulating element is formed by means of the first fold edge . - a semiconductor element extending in a planar manner substantially orthogonally to the main emission direction (H) with a light emission side facing in the main emission direction (H) and a contact side facing away from the main emission direction (H), and - an insulating element , wherein the insulating element has a first portion and a substantially L-shaped second portion laterally encompassing the semiconductor element , so that a part of the L-shaped second portion rests on the light emission side of the semiconductor element , wherein a conductor element is embedded in the insulation element and extends from the first portion of the insulating element through the second portion of the insulating element , wherein a first contact region of the conductor element in the first portion of the insulating element can electrically contact a first connection terminal and a second contact region of the conductor element in the second portion of the insulating element electrically contacts the light emission side of the semiconductor element , and wherein the contact side of the semiconductor element can electrically contact a second connection terminal , wherein the insulating element inclusive of embedded conductor element is flexible and is formed as a folded flexible printed circuit board, wherein the flexible printed circuit board has a first of at least one fold line running substantially orthogonally to the main emission direction (H), wherein the L-shape of the second portion of the insulating element is formed by means of the first fold edge . <EOS>