An electronic device comprising: a housing including: a frame structure configured to form a portion of a surface of the electronic device , a plate structure surrounded by the frame structure , the plate structure including a first opening or recess, and a metal portion containing a metallic material; a support plate ; a printed circuit board ;a camera module disposed in the first opening or recess; and a heat dissipating structure configured to transfer heat generated from the camera module to the metal portion included in the housing , wherein the heat dissipating structure includes a heat transfer member , characterized in that the support plate is configured to face the plate structure and includes a polymer area formed of a polymer material; the printed circuit board is disposed between the plate structure and the support plate and is configured to make contact with part of the metal portion of the housing ; the housing further comprises a polymer portion containing a polymer material; the camera module disposed between a part of the polymer portion included in the plate structure of the housing and the polymer area included in the support plate , wherein the camera module includes a camera bracket disposed on the polymer area of the support plate , a camera PCB disposed on the camera bracket , a light emitting unit and a light receiving unit , wherein the light emitting unit and the light receiving unit are disposed on the camera PCB ; and the heat transfer member is formed between the camera bracket and the polymer area of the support plate and extends between the printed circuit board and the support plate ; wherein the heat dissipating structure is configured to form a heat transfer path that passes through the camera PCB , the heat transfer member , the printed circuit board , and the metal portion of the housing . a housing including: a frame structure configured to form a portion of a surface of the electronic device , a plate structure surrounded by the frame structure , the plate structure including a first opening or recess, and a metal portion containing a metallic material; a frame structure configured to form a portion of a surface of the electronic device , a plate structure surrounded by the frame structure , the plate structure including a first opening or recess, and a metal portion containing a metallic material; a support plate ; a printed circuit board ;a camera module disposed in the first opening or recess; and a heat dissipating structure configured to transfer heat generated from the camera module to the metal portion included in the housing , wherein the heat dissipating structure includes a heat transfer member , characterized in that the support plate is configured to face the plate structure and includes a polymer area formed of a polymer material; the printed circuit board is disposed between the plate structure and the support plate and is configured to make contact with part of the metal portion of the housing ; the housing further comprises a polymer portion containing a polymer material; the camera module disposed between a part of the polymer portion included in the plate structure of the housing and the polymer area included in the support plate , wherein the camera module includes a camera bracket disposed on the polymer area of the support plate , a camera PCB disposed on the camera bracket , a light emitting unit and a light receiving unit , wherein the light emitting unit and the light receiving unit are disposed on the camera PCB ; and the heat transfer member is formed between the camera bracket and the polymer area of the support plate and extends between the printed circuit board and the support plate ; wherein the heat dissipating structure is configured to form a heat transfer path that passes through the camera PCB , the heat transfer member , the printed circuit board , and the metal portion of the housing . <EOS>