A Micro ElectroMechanical Systems (MEMS) die, comprising: a heating element bridging a canyon in the surface of the MEMS die, the heating element configured to be substantially in direct thermal coupling with a fluid ambient; a first temperature sensor bridging said canyon in the surface of the MEMS die, the first temperature sensor configured to be substantially in direct thermal coupling with the fluid ambient; a second temperature sensor bridging said canyon in the surface of the MEMS die, the second temperature sensor configured to be substantially in direct thermal coupling with the fluid ambient, wherein the heating element is located between the first temperature sensor and the second temperature sensor, and wherein the heating element is convectively coupled to the first temperature sensor and the second temperature sensor via the fluid ambient; a flow transducer comprising the heating element , the first temperature sensor and the second temperature sensor , and having an output signal indicative of a flow of the fluid ambient, wherein the signal indicative of the flow of the fluid ambient has a temperature disturbance; characterized by a heating-element drive circuit comprising a temperature-varying resistor driven by a constant current source , and an amplifier , the temperature-varying resistor having an output connected to a positive input of the amplifier , and wherein the temperature-varying resistor output varies in response to a substrate temperature of the MEMS die , wherein the heating-element drive circuit provides a temperature-varying drive bias via the output node of the amplifier to the heating element to substantially compensate for the temperature disturbance of the signal indicative of the flow of the fluid ambient; the heating-element drive circuit further comprising a gain/offset compensation circuit , wherein the gain/offset compensation circuit presents a signal at a negative input node of the amplifier . a heating element bridging a canyon in the surface of the MEMS die, the heating element configured to be substantially in direct thermal coupling with a fluid ambient; a first temperature sensor bridging said canyon in the surface of the MEMS die, the first temperature sensor configured to be substantially in direct thermal coupling with the fluid ambient; a second temperature sensor bridging said canyon in the surface of the MEMS die, the second temperature sensor configured to be substantially in direct thermal coupling with the fluid ambient, wherein the heating element is located between the first temperature sensor and the second temperature sensor, and wherein the heating element is convectively coupled to the first temperature sensor and the second temperature sensor via the fluid ambient; a flow transducer comprising the heating element , the first temperature sensor and the second temperature sensor , and having an output signal indicative of a flow of the fluid ambient, wherein the signal indicative of the flow of the fluid ambient has a temperature disturbance; characterized by a heating-element drive circuit comprising a temperature-varying resistor driven by a constant current source , and an amplifier , the temperature-varying resistor having an output connected to a positive input of the amplifier , and wherein the temperature-varying resistor output varies in response to a substrate temperature of the MEMS die , wherein the heating-element drive circuit provides a temperature-varying drive bias via the output node of the amplifier to the heating element to substantially compensate for the temperature disturbance of the signal indicative of the flow of the fluid ambient; the heating-element drive circuit further comprising a gain/offset compensation circuit , wherein the gain/offset compensation circuit presents a signal at a negative input node of the amplifier . <EOS>