Wire cutting apparatus for separating parts from a base plate , comprising: - a wire electrode , configured to separate at least one part from a base plate from which the at least one part protrudes; - a holding device , configured to hold the base plate in at least a separation position relative to the separation device , wherein - the holding device is configured to hold the base plate in the separation position in such a manner, that the at least one part protrudes downward from the base plate , - a collecting element , which is arrangeable underneath the holding device and configured to receive the at least one part , when the at least one part is separated from the base plate by the separation device; characterized in that - the wire cutting apparatus is a fast-wire cutting machine including a wire travelling circuit, which is constituted such that the wire travels back and forth at high speed along the wire travelling direction; - in that the wire electrode is submerged in a separation liquid and the material is removed by a succession of electrical discharge between the wire electrode and the workpiece; and in that - the collecting element comprises at least one segregation element , arranged inside the collecting element and configured to segregate a) at least two distinct groups of the at least one part, and/or b) at least two distinct parts of the at least one part from each other - wherein the segregation element is configured as a wall or a plurality of walls, defining at least one recess adapted to receive a part separated from the base plate. - a wire electrode , configured to separate at least one part from a base plate from which the at least one part protrudes; - a holding device , configured to hold the base plate in at least a separation position relative to the separation device , wherein - the holding device is configured to hold the base plate in the separation position in such a manner, that the at least one part protrudes downward from the base plate , - a collecting element , which is arrangeable underneath the holding device and configured to receive the at least one part , when the at least one part is separated from the base plate by the separation device; - the wire cutting apparatus is a fast-wire cutting machine including a wire travelling circuit, which is constituted such that the wire travels back and forth at high speed along the wire travelling direction; - in that the wire electrode is submerged in a separation liquid and the material is removed by a succession of electrical discharge between the wire electrode and the workpiece; and in that - the collecting element comprises at least one segregation element , arranged inside the collecting element and configured to segregate a) at least two distinct groups of the at least one part, and/or b) at least two distinct parts of the at least one part from each other a) at least two distinct groups of the at least one part, and/or b) at least two distinct parts of the at least one part from each other - wherein the segregation element is configured as a wall or a plurality of walls, defining at least one recess adapted to receive a part separated from the base plate. <EOS>