An electroplating system comprising an anode element and a pressure device for spraying electroplating solution to an object that is placed in an electroplating tank with the electroplating solution for depositing a plating material on the object , the pressure device comprising: a lid having a first surface , a second surface and a plurality of second through holes , the first and second surfaces of the lid being communicated with each other through the second through holes , and a base having a third surface , a plurality of conduction tubes and a plurality of third through holes penetrating through the base , wherein each conduction tube includes a conduction hole connecting to one of the third through holes while each of the second through holes reveals one of the conduction holes and a connecting portion of each of the conduction tubes is inserted in one of the second through holes , wherein the lid has a plurality of first through holes , the first and second surfaces of the lid being communicated with each other through the first through holes , the base has a chamber recessed on the third surface , the third through holes are formed in the chamber , the conduction tubes are positioned in the chamber , the lid covers an opening of the chamber , and the first through holes communicate with the chamber ; wherein the pressure device further comprises a feeding pipe communicating with the chamber , the feeding pipe is configured to supply the electroplating solution to the chamber for allowing the electroplating solution in the chamber to be sprayed through the first through holes ; wherein the conduction holes and the third through holes connected with each other define a passage of electric force line (P) for the electroplating solution within the conduction holes and the third through holes ; wherein the anode element is disposed outside the pressure device and located outside an end (P2) of the passage of electric force line (P). a lid having a first surface , a second surface and a plurality of second through holes , the first and second surfaces of the lid being communicated with each other through the second through holes , and a base having a third surface , a plurality of conduction tubes and a plurality of third through holes penetrating through the base , wherein each conduction tube includes a conduction hole connecting to one of the third through holes while each of the second through holes reveals one of the conduction holes and a connecting portion of each of the conduction tubes is inserted in one of the second through holes , wherein the lid has a plurality of first through holes , the first and second surfaces of the lid being communicated with each other through the first through holes , the base has a chamber recessed on the third surface , the third through holes are formed in the chamber , the conduction tubes are positioned in the chamber , the lid covers an opening of the chamber , and the first through holes communicate with the chamber ; wherein the pressure device further comprises a feeding pipe communicating with the chamber , the feeding pipe is configured to supply the electroplating solution to the chamber for allowing the electroplating solution in the chamber to be sprayed through the first through holes ; wherein the conduction holes and the third through holes connected with each other define a passage of electric force line (P) for the electroplating solution within the conduction holes and the third through holes ; wherein the anode element is disposed outside the pressure device and located outside an end (P2) of the passage of electric force line (P). <EOS>