A method of manufacturing a plurality of MEMS devices , the method comprising the steps of: - providing an assembly of a substrate plate and MEMS devices mounted thereon, each MEMS device having a certain footprint on the substrate plate, and the substrate plate having a pattern of electrically conductive leads connected to electric components of the MEMS devices , said pattern forming signal contact pads and ground contact pads within the respective footprints of the MEMS devices , wherein each signal contact pad is connected to one of said ground contacts pads via an electric component of the MEMS devices , and said pattern comprising at least one lead structure that extends on the substrate plate outside of the footprints of the MEMS devices , and connects a number of said contact pads to an extra contact pad for applying a common voltage to each of said electric components , wherein at least a major part of said extra contact pad is formed within one of the footprints of the MEMS devices , said lead structure being a shunt bar that interconnects a plurality of said signal contact pads of the MEMS devices ; - applying a voltage to each of a plurality of said electric components of the MEMS devices ,wherein said extra contact pad is used for applying said voltage to said lead structure that is connected to said electric components ; and subsequently - dicing the substrate plate to separate the substrate plate into a plurality of chip-size units , wherein the lead structure extends inside an area of a dicing cut , such that by cutting the substrate plate along said dicing cut the signal pads of the chip size units are isolated from one another and from the extra contact pad . - providing an assembly of a substrate plate and MEMS devices mounted thereon, each MEMS device having a certain footprint on the substrate plate, and the substrate plate having a pattern of electrically conductive leads connected to electric components of the MEMS devices , said pattern forming signal contact pads and ground contact pads within the respective footprints of the MEMS devices , wherein each signal contact pad is connected to one of said ground contacts pads via an electric component of the MEMS devices , and said pattern comprising at least one lead structure that extends on the substrate plate outside of the footprints of the MEMS devices , and connects a number of said contact pads to an extra contact pad for applying a common voltage to each of said electric components , wherein at least a major part of said extra contact pad is formed within one of the footprints of the MEMS devices , said lead structure being a shunt bar that interconnects a plurality of said signal contact pads of the MEMS devices ; - applying a voltage to each of a plurality of said electric components of the MEMS devices ,wherein said extra contact pad is used for applying said voltage to said lead structure that is connected to said electric components ; and subsequently - dicing the substrate plate to separate the substrate plate into a plurality of chip-size units , wherein the lead structure extends inside an area of a dicing cut , such that by cutting the substrate plate along said dicing cut the signal pads of the chip size units are isolated from one another and from the extra contact pad . <EOS>