A component mounting machine mounting a component , which has a component mark for positioning on an upper face, on a circuit board , comprising: a first suction nozzle that is provided with a suction surface that is configured to suck the upper face of the component ; a transfer head that is configured to support the first suction nozzle and mount the component that is sucked by the first suction nozzle on the circuit board by moving the first suction nozzle relatively to the circuit board ; optical path conversion means that is disposed above the suction surface and converts an optical path of light from the upper face of the component to the side; a first camera that is disposed at a position at which it is possible to receive, from the upper face of the component , light that is changed in the optical path by the optical path conversion means; a camera moving device that is configured to move the first camera relatively to the first suction nozzle ; and a control device that is configured to control operation of the transfer head and the camera moving device , the camera moving device is configured to move the first camera in at least a first direction that is orthogonal to an optical axis of the first camera , characterised in that the first suction nozzle comprises the optical path conversion means ; an imaging region (R1) of the first camera is configured to move in a second direction with respect to the center of the component when the first camera moves in the first direction, and the control device is provided with a memory section that is configured to store in advance positional information of the component mark , suck the component on the first suction nozzle , and the first camera is moved by the camera moving device based on the positional information within the memory section. a first suction nozzle that is provided with a suction surface that is configured to suck the upper face of the component ; a transfer head that is configured to support the first suction nozzle and mount the component that is sucked by the first suction nozzle on the circuit board by moving the first suction nozzle relatively to the circuit board ; optical path conversion means that is disposed above the suction surface and converts an optical path of light from the upper face of the component to the side; a first camera that is disposed at a position at which it is possible to receive, from the upper face of the component , light that is changed in the optical path by the optical path conversion means; a camera moving device that is configured to move the first camera relatively to the first suction nozzle ; and a control device that is configured to control operation of the transfer head and the camera moving device , the camera moving device is configured to move the first camera in at least a first direction that is orthogonal to an optical axis of the first camera , characterised in that the first suction nozzle comprises the optical path conversion means ; an imaging region (R1) of the first camera is configured to move in a second direction with respect to the center of the component when the first camera moves in the first direction, and the control device is provided with a memory section that is configured to store in advance positional information of the component mark , suck the component on the first suction nozzle , and the first camera is moved by the camera moving device based on the positional information within the memory section. <EOS>