A system comprising: a board including a first surface , a second surface , and a midpoint between the first surface and the second surface , the board configured to support an electrical component on the first surface ; a cooling member , extending along the second surface of the board , configured to: deliver cooling liquid to the electrical component by routing along the second surface of the board and crossing the midpoint of the board from the second surface to the first surface ; and route, along the second surface of the board, heated liquid from the electrical component by crossing back over the midpoint of the board from the first surface to the second surface ; a heat exchanger configured to transfer heat from the electrical component to the cooling liquid, mounted above the electrical component on the first surface of the board , the heat exchanger comprising: an inlet configured to receive the cooling liquid from the cooling member ; and an outlet configured to egress the heated liquid to the cooling member , wherein the cooling member comprises a first member configured to deliver cooling liquid into the heat exchanger and a second member configured to route heated liquid, wherein the inlet is connected to the first member and the outlet is connected to the second member ; and a connector coupled to the first member and the second member and configured to provide an ingress of the cooling liquid through the first member and an egress of the heated liquid from the second member . a board including a first surface , a second surface , and a midpoint between the first surface and the second surface , the board configured to support an electrical component on the first surface ; a cooling member , extending along the second surface of the board , configured to: deliver cooling liquid to the electrical component by routing along the second surface of the board and crossing the midpoint of the board from the second surface to the first surface ; and route, along the second surface of the board, heated liquid from the electrical component by crossing back over the midpoint of the board from the first surface to the second surface ; deliver cooling liquid to the electrical component by routing along the second surface of the board and crossing the midpoint of the board from the second surface to the first surface ; and route, along the second surface of the board, heated liquid from the electrical component by crossing back over the midpoint of the board from the first surface to the second surface ; a heat exchanger configured to transfer heat from the electrical component to the cooling liquid, mounted above the electrical component on the first surface of the board , the heat exchanger comprising: an inlet configured to receive the cooling liquid from the cooling member ; and an outlet configured to egress the heated liquid to the cooling member , wherein the cooling member comprises a first member configured to deliver cooling liquid into the heat exchanger and a second member configured to route heated liquid, wherein the inlet is connected to the first member and the outlet is connected to the second member ; and an inlet configured to receive the cooling liquid from the cooling member ; and an outlet configured to egress the heated liquid to the cooling member , wherein the cooling member comprises a first member configured to deliver cooling liquid into the heat exchanger and a second member configured to route heated liquid, wherein the inlet is connected to the first member and the outlet is connected to the second member ; and a connector coupled to the first member and the second member and configured to provide an ingress of the cooling liquid through the first member and an egress of the heated liquid from the second member . <EOS>