A camera module comprising: a housing comprising a through hole ; a lens module disposed in the through hole ; a connector penetrating the housing and extending to an outside from an inside of the housing ; a first substrate unit located inside the housing and having an image sensor mounted thereon; and a second substrate unit disposed inside the housing and connected to the connector , wherein the first substrate unit includes a first substrate portion including a first connecting port disposed at one surface of the first substrate portion , the image sensor disposed at the other surface of the first substrate portion , and a second substrate portion including a second connecting port connected to the first connecting port ; wherein the second substrate unit includes a third substrate portion including a third connecting port connected to the second substrate portion through a flexible substrate , and a fourth substrate portion including a fourth connecting port coupled to the third connecting port and connected to the connector , characterized in that the housing includes a first coupling hole , and the first substrate unit includes: a second coupling hole disposed at the first substrate portion and corresponding to the first coupling hole ; a first support coupling part including a support portion having a third coupling hole , and a coupling portion extended from the support portion and coupled to the first coupling hole and to the second coupling hole ; a fourth coupling hole disposed at the second substrate portion and corresponding to the third coupling hole ; and a first coupling part coupled to the third coupling hole and to the fourth coupling hole . a housing comprising a through hole ; a lens module disposed in the through hole ; a connector penetrating the housing and extending to an outside from an inside of the housing ; a first substrate unit located inside the housing and having an image sensor mounted thereon; and a second substrate unit disposed inside the housing and connected to the connector , wherein the first substrate unit includes a first substrate portion including a first connecting port disposed at one surface of the first substrate portion , the image sensor disposed at the other surface of the first substrate portion , and a second substrate portion including a second connecting port connected to the first connecting port ; wherein the second substrate unit includes a third substrate portion including a third connecting port connected to the second substrate portion through a flexible substrate , and a fourth substrate portion including a fourth connecting port coupled to the third connecting port and connected to the connector , characterized in that the housing includes a first coupling hole , and the first substrate unit includes: a second coupling hole disposed at the first substrate portion and corresponding to the first coupling hole ; a first support coupling part including a support portion having a third coupling hole , and a coupling portion extended from the support portion and coupled to the first coupling hole and to the second coupling hole ; a fourth coupling hole disposed at the second substrate portion and corresponding to the third coupling hole ; and a first coupling part coupled to the third coupling hole and to the fourth coupling hole . <EOS>