A heat dissipation circuit board comprising: a metal substrate ; an insulating layer which is disposed on at least one surface of the metal substrate ; and a circuit layer which is disposed on a surface of the insulating layer opposite to the metal substrate , wherein: the insulating layer includes a resin formed of a polyimide, a polyamide-imide, or a mixture thereof, and ceramic particles, and the ceramic particles form agglomerated particles, an amount of the ceramic particles is in a range of 5 vol% or more and 60 vol% or less, a mass average molecular weight of the resin is 100,000 or more and 500,000 or less, a specific surface area of the ceramic particles is 50 m 2 /g or more and 300 m 2 /g or less, a BET diameter of the ceramic particles is 1 nm or more and 200 nm or less, an average particle diameter of the agglomerated particles is 5 times or more and 100 times or less the BET diameter, the specific surface area is a BET specific surface area measured by a BET method defined in JIS 8830, the BET diameter is calculated from a BET specific surface area and a density using the following equation: BET diameter = 6 / density × BET specific surface area an average particle diameter of the agglomerated particles is a value of Dv50 measured by a laser diffraction type particle size distribution measuring device in an ultrasonic dispersion state of the ceramic particles in an NMP solvent together with a dispersant, and the ceramic particles are a mixture of one or two or more kinds selected from silica particles, alumina particles, titanium oxide particles, alumina-doped silica particles, and alumina hydrate particles, and the agglomerated particles are agglomerates, aggregates or a particle assembly. a metal substrate ; an insulating layer which is disposed on at least one surface of the metal substrate ; and a circuit layer which is disposed on a surface of the insulating layer opposite to the metal substrate , wherein: the insulating layer includes a resin formed of a polyimide, a polyamide-imide, or a mixture thereof, and ceramic particles, and the ceramic particles form agglomerated particles, an amount of the ceramic particles is in a range of 5 vol% or more and 60 vol% or less, a mass average molecular weight of the resin is 100,000 or more and 500,000 or less, a specific surface area of the ceramic particles is 50 m 2 /g or more and 300 m 2 /g or less, a BET diameter of the ceramic particles is 1 nm or more and 200 nm or less, an average particle diameter of the agglomerated particles is 5 times or more and 100 times or less the BET diameter, the specific surface area is a BET specific surface area measured by a BET method defined in JIS 8830, the BET diameter is calculated from a BET specific surface area and a density using the following equation: BET diameter = 6 / density × BET specific surface area an average particle diameter of the agglomerated particles is a value of Dv50 measured by a laser diffraction type particle size distribution measuring device in an ultrasonic dispersion state of the ceramic particles in an NMP solvent together with a dispersant, and the ceramic particles are a mixture of one or two or more kinds selected from silica particles, alumina particles, titanium oxide particles, alumina-doped silica particles, and alumina hydrate particles, and the agglomerated particles are agglomerates, aggregates or a particle assembly. <EOS>