An optical component packaging apparatus, comprising an optical component and two packaging substrates disposed opposite to each other, wherein a packaging cavity filled with a protective gas is formed between the two packaging substrates , and the optical component is disposed in the packaging cavity ; and at least one packaging substrate is provided with an optical waveguide , an end face of a first coupling end of each optical waveguide is disposed on an inner surface of the packaging cavity and is coupled to the optical component , and an end face of a second coupling end of each optical waveguide is disposed on a surface that is of a corresponding packaging substrate and that is located outside the packaging cavity ; wherein the packaging cavity is formed through matching by two opposite surfaces of the two packaging substrates and a sealant that is connected to the two opposite surfaces of the two packaging substrates in a sealed manner, and the sealant is disposed around the optical component and forms a closed ring structure; wherein the two opposite surfaces of the two packaging substrates each are provided with a ring pad , each ring pad is disposed around the optical component , and the sealant is a solder and is connected to the two ring pads ; wherein at least one packaging substrate is provided with a power supply circuit, a power output end of the power supply circuit is located in the packaging cavity and is connected to the optical component , and a power input end of the power supply circuit is located outside the packaging cavity ; wherein the power supply circuit is disposed between the packaging substrate on which the power supply circuit is located and the ring pad ; wherein the packaging cavity comprises a first groove disposed on the surface of the first packaging substrate and a second groove disposed on the surface of the second packaging substrate , said first groove and said second groove being configured to accommodate the optical component . a packaging cavity filled with a protective gas is formed between the two packaging substrates , and the optical component is disposed in the packaging cavity ; and at least one packaging substrate is provided with an optical waveguide , an end face of a first coupling end of each optical waveguide is disposed on an inner surface of the packaging cavity and is coupled to the optical component , and an end face of a second coupling end of each optical waveguide is disposed on a surface that is of a corresponding packaging substrate and that is located outside the packaging cavity ; wherein the packaging cavity is formed through matching by two opposite surfaces of the two packaging substrates and a sealant that is connected to the two opposite surfaces of the two packaging substrates in a sealed manner, and the sealant is disposed around the optical component and forms a closed ring structure; wherein the two opposite surfaces of the two packaging substrates each are provided with a ring pad , each ring pad is disposed around the optical component , and the sealant is a solder and is connected to the two ring pads ; wherein at least one packaging substrate is provided with a power supply circuit, a power output end of the power supply circuit is located in the packaging cavity and is connected to the optical component , and a power input end of the power supply circuit is located outside the packaging cavity ; wherein the power supply circuit is disposed between the packaging substrate on which the power supply circuit is located and the ring pad ; wherein the packaging cavity comprises a first groove disposed on the surface of the first packaging substrate and a second groove disposed on the surface of the second packaging substrate , said first groove and said second groove being configured to accommodate the optical component . <EOS>