A printed circuit board comprising: an insulating layer ; a plating seed layer disposed on the insulating layer and formed of copper (Cu); a circuit pattern disposed on the plating seed layer ; and a surface processing layer disposed on the circuit pattern , the circuit pattern includes: a first circuit pattern disposed on the plating seed layer and formed of copper (Cu) and including a corner portion of an upper portion; and a second circuit pattern disposed on the first circuit pattern and formed of copper (CU), and configured to cover an upper surface of the first circuit pattern including the corner portion, characterized in that the corner portion has a predetermined curvature, the surface processing layer is formed of a metal including only gold (Au) or an alloy including gold (Au), and the surface processing layer is in direct physical contact with the second circuit pattern , wherein a width of a lower surface of the surface processing layer is greater than a width of an upper surface of the second circuit pattern , wherein an edge portion of a lower surface of the second circuit pattern is positioned at a lower level than a central portion of the upper surface of the first circuit pattern , wherein the edge portion of the lower surface of the second circuit pattern is in direct physical contact with the first circuit pattern , and wherein the lower surface of the surface processing layer comprises: a central region in contact with the upper surface of the second circuit pattern ; and left and right regions not in contact with the upper surface of the circuit pattern , wherein the second circuit pattern protrudes from the pure upper surface of the first circuit pattern except the corner portion of a predetermined height (b). an insulating layer ; a plating seed layer disposed on the insulating layer and formed of copper (Cu); a circuit pattern disposed on the plating seed layer ; and a surface processing layer disposed on the circuit pattern , the circuit pattern includes: a first circuit pattern disposed on the plating seed layer and formed of copper (Cu) and including a corner portion of an upper portion; and a second circuit pattern disposed on the first circuit pattern and formed of copper (CU), and configured to cover an upper surface of the first circuit pattern including the corner portion, characterized in that the corner portion has a predetermined curvature, the surface processing layer is formed of a metal including only gold (Au) or an alloy including gold (Au), and the surface processing layer is in direct physical contact with the second circuit pattern , wherein a width of a lower surface of the surface processing layer is greater than a width of an upper surface of the second circuit pattern , wherein an edge portion of a lower surface of the second circuit pattern is positioned at a lower level than a central portion of the upper surface of the first circuit pattern , wherein the edge portion of the lower surface of the second circuit pattern is in direct physical contact with the first circuit pattern , and wherein the lower surface of the surface processing layer comprises: a central region in contact with the upper surface of the second circuit pattern ; and left and right regions not in contact with the upper surface of the circuit pattern , wherein the second circuit pattern protrudes from the pure upper surface of the first circuit pattern except the corner portion of a predetermined height (b). a central region in contact with the upper surface of the second circuit pattern ; and left and right regions not in contact with the upper surface of the circuit pattern , wherein the second circuit pattern protrudes from the pure upper surface of the first circuit pattern except the corner portion of a predetermined height (b). <EOS>