A millimeter wave communication device of an electronic device, comprising: an antenna printed circuit board, PCB, including a plurality of layers; an integrated circuit, IC, positioned under the antenna PCB ; a first feed line (144-1) electrically connected with the IC and extending to a first layer through one or more of the plurality of layers of the antenna PCB, wherein a first portion of the first feed line is disposed in the first layer; a second feed line (145-1) spaced from the first portion of the first feed line and disposed in a second layer of the antenna PCB , the second layer being an upper layer of the first layer; and a first antenna element (146-1) electrically connected with the second feed line in a third layer of the antenna PCB, the third layer being an upper layer of the second layer, wherein the IC is configured to transmit and/or receive a millimeter wave (mm-wave) signal using the first feed line (144-1), the second feed line (145-1), and the first antenna element (146-1), wherein the second feed line (145-1) extends to the second layer through one or more of the plurality of layers of the antenna PCB , wherein a second portion of the second feed line (145-1) is disposed in the second layer, wherein the first portion and the second portion are disposed in parallel with each other so as to provide electrical coupling between the first portion and the second portion, and characterized in that the millimeter wave communication device further comprising: a plurality of ground layers disposed in a first group of layers among the plurality of layers of the antenna PCB; and a plurality of vias disposed to penetrate a second group of layers among the plurality of layers of the antenna PCB to electrically connect the plurality of ground layers. an antenna printed circuit board, PCB, including a plurality of layers; an integrated circuit, IC, positioned under the antenna PCB ; a first feed line (144-1) electrically connected with the IC and extending to a first layer through one or more of the plurality of layers of the antenna PCB, wherein a first portion of the first feed line is disposed in the first layer; a second feed line (145-1) spaced from the first portion of the first feed line and disposed in a second layer of the antenna PCB , the second layer being an upper layer of the first layer; and a first antenna element (146-1) electrically connected with the second feed line in a third layer of the antenna PCB, the third layer being an upper layer of the second layer, wherein the IC is configured to transmit and/or receive a millimeter wave (mm-wave) signal using the first feed line (144-1), the second feed line (145-1), and the first antenna element (146-1), wherein the second feed line (145-1) extends to the second layer through one or more of the plurality of layers of the antenna PCB , wherein a second portion of the second feed line (145-1) is disposed in the second layer, wherein the first portion and the second portion are disposed in parallel with each other so as to provide electrical coupling between the first portion and the second portion, and characterized in that the millimeter wave communication device further comprising: a plurality of ground layers disposed in a first group of layers among the plurality of layers of the antenna PCB; and a plurality of vias disposed to penetrate a second group of layers among the plurality of layers of the antenna PCB to electrically connect the plurality of ground layers. a plurality of ground layers disposed in a first group of layers among the plurality of layers of the antenna PCB; and a plurality of vias disposed to penetrate a second group of layers among the plurality of layers of the antenna PCB to electrically connect the plurality of ground layers. <EOS>