A method for hermetically sealing a sensor chip , the method comprising: sealing the sensor chip to an opening of a main package body ; inserting a fiber into the main package body through another opening of the main package body ; aligning an end of the fiber to the sensor chip , locking the fiber inside the main package body and between the sensor chip opening and the fiber opening, and wherein the fiber is locked inside the main body package at a distance from the end of the fiber that is aligned to the sensor chip ; sealing the fiber at the opening of the main package body ; applying a fiber jacket to an end of the fiber opposite the end of the fiber that is aligned to the sensor chip , the method being characterised in that the opening of the main package to which the sensor chip is sealed comprises a front snout with an end to which the sensor chip is sealed, in that the opening of the main package through which the fiber is inserted comprises a back snout , in that a portion of the fiber jacket is located inside of the back snout of the main package body ; in that an internal cavity of the back snout is sealed, in that a fiber boot is attached to the end of the back snout and to at least a portion of the fiber jacket , in that the fiber is locked in its aligned position inside the main package body on a pedestal located between the front snout and the back snout, in that the fiber end is aligned to the sensor chip via an opening in a top side of the main package body, in that the main package body , the sensor chip , the fiber , the fiber pedestal , the fiber jacket , and the fiber boot are out gassed, and in that lid is sealed to the top side of the main package body . sealing the sensor chip to an opening of a main package body ; inserting a fiber into the main package body through another opening of the main package body ; aligning an end of the fiber to the sensor chip , locking the fiber inside the main package body and between the sensor chip opening and the fiber opening, and wherein the fiber is locked inside the main body package at a distance from the end of the fiber that is aligned to the sensor chip ; sealing the fiber at the opening of the main package body ; applying a fiber jacket to an end of the fiber opposite the end of the fiber that is aligned to the sensor chip , the method being characterised in that the opening of the main package to which the sensor chip is sealed comprises a front snout with an end to which the sensor chip is sealed, in that the opening of the main package through which the fiber is inserted comprises a back snout , in that a portion of the fiber jacket is located inside of the back snout of the main package body ; in that an internal cavity of the back snout is sealed, in that a fiber boot is attached to the end of the back snout and to at least a portion of the fiber jacket , in that the fiber is locked in its aligned position inside the main package body on a pedestal located between the front snout and the back snout, in that the fiber end is aligned to the sensor chip via an opening in a top side of the main package body, in that the main package body , the sensor chip , the fiber , the fiber pedestal , the fiber jacket , and the fiber boot are out gassed, and in that lid is sealed to the top side of the main package body . <EOS>