A method for processing a radial electronic component , characterised in that the method comprises: - bending a first lead and/or a second lead of the radial electronic component so that the pitch of the leads , which means a distance between the centres of the ends of the leads , is different from the pitch of holes in a circuit board, into which holes the leads are to be inserted, - cutting the first lead and the second lead obliquely, and - inserting the first lead and the second lead into the holes in the circuit board, wherein: - the first lead and/or the second lead is bent so that the pitch of the leads is smaller than the pitch of the holes, and the first lead and the second lead are cut obliquely so that cutting surfaces of the leads are towards each other, the mathematical relationship between the pitches of the leads and the holes and the diameters of the leads and the holes being expressed by the following equation: p H − d H − d L < p L < p H , wherein p H denotes the pitch of the holes, p L denotes the pitch of the leads, d H denotes the diameter of the hole and d L denotes the diameter of the lead, or - the first lead and/or the second lead is bent so that the pitch of the leads is larger than the pitch of the holes, and the first lead and the second lead are cut obliquely so that the cutting surfaces of the leads are away from each other, the mathematical relationship between the pitches of the leads and the holes and the diameters of the leads and the holes being expressed by the following equation: p H < p L < p H + d H + d L , wherein p H denotes the pitch of the holes, p L denotes the pitch of the leads, d H denotes the diameter of the hole and d L denotes the diameter of the lead. - bending a first lead and/or a second lead of the radial electronic component so that the pitch of the leads , which means a distance between the centres of the ends of the leads , is different from the pitch of holes in a circuit board, into which holes the leads are to be inserted, - cutting the first lead and the second lead obliquely, and - inserting the first lead and the second lead into the holes in the circuit board, - the first lead and/or the second lead is bent so that the pitch of the leads is smaller than the pitch of the holes, and the first lead and the second lead are cut obliquely so that cutting surfaces of the leads are towards each other, the mathematical relationship between the pitches of the leads and the holes and the diameters of the leads and the holes being expressed by the following equation: p H − d H − d L < p L < p H , wherein p H denotes the pitch of the holes, p L denotes the pitch of the leads, d H denotes the diameter of the hole and d L denotes the diameter of the lead, or - the first lead and/or the second lead is bent so that the pitch of the leads is larger than the pitch of the holes, and the first lead and the second lead are cut obliquely so that the cutting surfaces of the leads are away from each other, the mathematical relationship between the pitches of the leads and the holes and the diameters of the leads and the holes being expressed by the following equation: p H < p L < p H + d H + d L , wherein p H denotes the pitch of the holes, p L denotes the pitch of the leads, d H denotes the diameter of the hole and d L denotes the diameter of the lead. <EOS>