An electronic device comprising: a first printed circuit board, PCB, including a non-conductive region and a conductive region operating as a ground; a first wireless communication circuit disposed on the first PCB ; and a 5th generation, 5G, antenna module disposed adjacent to the first PCB , wherein the 5G antenna module includes: at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array ; and a second wireless communication circuit electrically connected to the antenna array , wherein the second PCB includes a first portion and a second portion having a predetermined angle with the first portion , wherein the first portion is disposed adjacent to the non-conductive region and at least part of the second portion is disposed adjacent to the conductive region , wherein the first wireless communication circuit is electrically connected to a first point of the conductive layer included in the first portion and configured to transmit or receive a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer , and wherein the second wireless communication circuit is configured to transmit or receive a second RF signal in a second frequency band by using the antenna array . a first printed circuit board, PCB, including a non-conductive region and a conductive region operating as a ground; a first wireless communication circuit disposed on the first PCB ; and a 5th generation, 5G, antenna module disposed adjacent to the first PCB , wherein the 5G antenna module includes: at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array ; and a second wireless communication circuit electrically connected to the antenna array , wherein the second PCB includes a first portion and a second portion having a predetermined angle with the first portion , wherein the first portion is disposed adjacent to the non-conductive region and at least part of the second portion is disposed adjacent to the conductive region , wherein the first wireless communication circuit is electrically connected to a first point of the conductive layer included in the first portion and configured to transmit or receive a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer , and wherein the second wireless communication circuit is configured to transmit or receive a second RF signal in a second frequency band by using the antenna array . at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array ; and a second wireless communication circuit electrically connected to the antenna array , wherein the second PCB includes a first portion and a second portion having a predetermined angle with the first portion , wherein the first portion is disposed adjacent to the non-conductive region and at least part of the second portion is disposed adjacent to the conductive region , wherein the first wireless communication circuit is electrically connected to a first point of the conductive layer included in the first portion and configured to transmit or receive a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer , and wherein the second wireless communication circuit is configured to transmit or receive a second RF signal in a second frequency band by using the antenna array . <EOS>