A magnetic power component , comprising: a printed circuit board ; and a magnetic core assembled to the printed circuit board , wherein the magnetic core comprises a magnetic core body and a plurality of heat dissipation teeth , the magnetic core body is bonded to the printed circuit board , the plurality of heat dissipation teeth protruding from at least one outer surface that is of the magnetic core body and that faces away from the printed circuit board , and the plurality of heat dissipation teeth and the magnetic core body are bonded through direct contact, wherein magnetic core body comprises a first magnetic core part and a second magnetic core part that are connected to each other, the first magnetic core part comprises a main body part and at least one support part connected to a surface of the main body part , and the support part penetrates through the printed circuit board to be bonded to the second magnetic core part , wherein the printed circuit board is located between the main body part and the second magnetic core part , wherein the plurality of heat dissipation teeth protrude from an outer surface that is of the first magnetic core part and that faces away from the printed circuit board and an outer surface that is of the second magnetic core part and that faces away from the printed circuit board , wherein the first magnetic core part further comprises at least one bump integrally formed with the main body part , and the at least one bump and the at least one support part are located on the same surface of the main body part ; or the at least one bump is disposed on a surface that is of the second magnetic core part and that faces the printed circuit board , and wherein the at least one bump is bonded to the printed circuit board . a printed circuit board ; and a magnetic core assembled to the printed circuit board , wherein the magnetic core comprises a magnetic core body and a plurality of heat dissipation teeth , the magnetic core body is bonded to the printed circuit board , the plurality of heat dissipation teeth protruding from at least one outer surface that is of the magnetic core body and that faces away from the printed circuit board , and the plurality of heat dissipation teeth and the magnetic core body are bonded through direct contact, wherein magnetic core body comprises a first magnetic core part and a second magnetic core part that are connected to each other, the first magnetic core part comprises a main body part and at least one support part connected to a surface of the main body part , and the support part penetrates through the printed circuit board to be bonded to the second magnetic core part , wherein the printed circuit board is located between the main body part and the second magnetic core part , wherein the plurality of heat dissipation teeth protrude from an outer surface that is of the first magnetic core part and that faces away from the printed circuit board and an outer surface that is of the second magnetic core part and that faces away from the printed circuit board , wherein the first magnetic core part further comprises at least one bump integrally formed with the main body part , and the at least one bump and the at least one support part are located on the same surface of the main body part ; or the at least one bump is disposed on a surface that is of the second magnetic core part and that faces the printed circuit board , and wherein the at least one bump is bonded to the printed circuit board . <EOS>