Production device, with - a work level on which objects, particularly printed circuit boards, with joints to be soldered can be supplied to the production device, - a support device arranged above the work level and equipped with a transport system, and - a soldering robot secured on the support device, which can be transported parallel to the work level, beyond said work level, by means of the transport system, wherein the soldering robot features a solder supply and a soldering unit , said unit being a soldering iron with an exchangeable soldering tip , characterized in that - a controller is provided which is configured to control the production device using predefined process parameters in order to produce test solder joints with a predefined solder, wherein one of the predefined process parameters is a predefined standby temperature (T S B ), which is below the predefined soldering temperature (T S L ) and below the melting temperature (T S S ) of the predefined solder, - a temperature measuring device to be arranged in a predefined position on the work level is provided, wherein on said device test solder joints can be produced with the soldering robot , and - an evaluation unit connected to the temperature measuring device is provided, wherein said evaluation unit is designed to use the temperatures (T) measured by the temperature measuring device during the test soldering processes to derive a temperature profile (T(t)) as a function of time (t) and to evaluate said profile, wherein the evaluation unit is designed to check whether the temperature profile T(t) of the test solder joint has a first area (I) in which the measured temperature (T) has an approximately constant value corresponding to the actual standby temperature (T B ) and, if this is the case, the evaluation unit is designed to determine, on the basis of this value, the standby temperature (T B ) which the soldering tip had before the test soldering and, if the temperature profile (T(t)) does not present any such area (I), or if the actual standby temperature (T B ) deviates from the predefined standby temperature (T S B ), the evaluation unit is designed to detect a process error. - a work level on which objects, particularly printed circuit boards, with joints to be soldered can be supplied to the production device, - a support device arranged above the work level and equipped with a transport system, and - a soldering robot secured on the support device, which can be transported parallel to the work level, beyond said work level, by means of the transport system, wherein the soldering robot features a solder supply and a soldering unit , said unit being a soldering iron with an exchangeable soldering tip , - a controller is provided which is configured to control the production device using predefined process parameters in order to produce test solder joints with a predefined solder, - a temperature measuring device to be arranged in a predefined position on the work level is provided, wherein on said device test solder joints can be produced with the soldering robot , and - an evaluation unit connected to the temperature measuring device is provided, wherein said evaluation unit is designed to use the temperatures (T) measured by the temperature measuring device during the test soldering processes to derive a temperature profile (T(t)) as a function of time (t) and to evaluate said profile, <EOS>