A four-in-one mini-LED module, comprising: a substrate and four RGB-LED chip sets arranged in an array on the substrate ; light-transmissive glue layers are sealed on the substrate and the RGB-LED chip sets ; each RGB-LED chip set comprises an R chip , a G chip and a B chip , each chip having a first electrode and a second electrode , all the first electrodes having the same polarity, and the first electrode and the second electrode having opposite polarities; a patterned line layer is set on the front surface of the substrate and used for placement of chips and/or for electrical connection of the chips , the patterned line layer is provided with a plurality of conductive holes penetrating through the substrate ; bonding-pads are set at the bottom of the substrate , the bonding-pads being electrically connected to the patterned line layer through the conductive holes ; the bonding-pads are used for achieving an electrical connection with an external circuit; the first electrodes of all the chips of the same row in the module are electrically connected, the second electrodes of all the R chips of the same column are electrically connected, the second electrodes of all the G chips of the same column are electrically connected, and the second electrodes of all the B chips of the same column are electrically connected; characterized in that the number of the bonding-pads is 8; an optical virtual isolation region is set among the RGB-LED chip sets , the optical virtual isolation region comprising a black light absorption layer set on the substrate ; the light-transmissive glue layers are transparent/semitransparent epoxy resin layer or organic silica gel layer doped with industrial melanin and diffusion powder. a substrate and four RGB-LED chip sets arranged in an array on the substrate ; light-transmissive glue layers are sealed on the substrate and the RGB-LED chip sets ; each RGB-LED chip set comprises an R chip , a G chip and a B chip , each chip having a first electrode and a second electrode , all the first electrodes having the same polarity, and the first electrode and the second electrode having opposite polarities; a patterned line layer is set on the front surface of the substrate and used for placement of chips and/or for electrical connection of the chips , the patterned line layer is provided with a plurality of conductive holes penetrating through the substrate ; bonding-pads are set at the bottom of the substrate , the bonding-pads being electrically connected to the patterned line layer through the conductive holes ; the bonding-pads are used for achieving an electrical connection with an external circuit; the first electrodes of all the chips of the same row in the module are electrically connected, the second electrodes of all the R chips of the same column are electrically connected, the second electrodes of all the G chips of the same column are electrically connected, and the second electrodes of all the B chips of the same column are electrically connected; characterized in that the number of the bonding-pads is 8; an optical virtual isolation region is set among the RGB-LED chip sets , the optical virtual isolation region comprising a black light absorption layer set on the substrate ; the light-transmissive glue layers are transparent/semitransparent epoxy resin layer or organic silica gel layer doped with industrial melanin and diffusion powder. <EOS>