An electronic device , comprising: a housing including a front plate, a back plate facing away from the front plate, and a side member surrounding a space between the front plate and the back plate, the side member including a plurality of non-conductive portions and a conductive portion inserted in contact between the non-conductive portions along at least a portion of a side surface of the side member; a display module exposed through the front plate; at least one wireless communication circuit electrically connected with the conductive portion; a printed circuit board , PCB, positioned between the display module and the back plate; and a camera assembly mounted on the PCB such that the camera assembly is interposed between the PCB and the back plate while exposed through a portion of the back plate, wherein the camera assembly includes: an image sensor mounted on the PCB; a plurality of lenses stacked over one another between the image sensor and the portion of the back plate; a barrel positioned between the PCB and the back plate while laterally surrounding the plurality of lenses; a camera bracket positioned between the PCB and the back plate while laterally surrounding at least part of the barrel; a metal case positioned between the PCB and the back plate while laterally surrounding at least part of the camera assembly, the metal case being electrically floating; and a shielding structure interposed between the camera bracket and the metal case while being spaced from the metal case , the shielding structure being electrically connected to ground. a housing including a front plate, a back plate facing away from the front plate, and a side member surrounding a space between the front plate and the back plate, the side member including a plurality of non-conductive portions and a conductive portion inserted in contact between the non-conductive portions along at least a portion of a side surface of the side member; a display module exposed through the front plate; at least one wireless communication circuit electrically connected with the conductive portion; a printed circuit board , PCB, positioned between the display module and the back plate; and a camera assembly mounted on the PCB such that the camera assembly is interposed between the PCB and the back plate while exposed through a portion of the back plate, wherein the camera assembly includes: an image sensor mounted on the PCB; a plurality of lenses stacked over one another between the image sensor and the portion of the back plate; a barrel positioned between the PCB and the back plate while laterally surrounding the plurality of lenses; a camera bracket positioned between the PCB and the back plate while laterally surrounding at least part of the barrel; a metal case positioned between the PCB and the back plate while laterally surrounding at least part of the camera assembly, the metal case being electrically floating; and a shielding structure interposed between the camera bracket and the metal case while being spaced from the metal case , the shielding structure being electrically connected to ground. an image sensor mounted on the PCB; a plurality of lenses stacked over one another between the image sensor and the portion of the back plate; a barrel positioned between the PCB and the back plate while laterally surrounding the plurality of lenses; a camera bracket positioned between the PCB and the back plate while laterally surrounding at least part of the barrel; a metal case positioned between the PCB and the back plate while laterally surrounding at least part of the camera assembly, the metal case being electrically floating; and a shielding structure interposed between the camera bracket and the metal case while being spaced from the metal case , the shielding structure being electrically connected to ground. <EOS>