A floor panel assembly having a bottom surface and a top surface , the floor panel assembly comprising: a first stack of structural layers adjacent the bottom surface , the first stack of structural layers comprising: a first fiber matrix; and a first high temperature thermoplastic resin infiltrating the first fiber matrix, wherein the first high temperature thermoplastic resin is selected from the group consisting of polyether ether ketone, polyaryletherketones, polycarbonate, polyphenylene sulfide, polyetherimide, polyimide, poly(methyl methacrylate), polyvinyl chloride and polyamideimide; a core layer, adjacent the first stack of structural layers, that absorbs shear stress; a second stack of structural layers between the core layer and the top surface , the second stack of structural layers comprising: a second fiber matrix; and a second high temperature thermoplastic resin infiltrating the second fiber matrix, wherein the second high temperature thermoplastic resin is selected from the group consisting of polyether ether ketone, polyaryletherketones, polycarbonate, polyphenylene sulfide, polyetherimide, polyimide, poly(methyl methacrylate), polyvinyl chloride, and polyamideimide; a heating layer between the core layer and the top surface ; and an impact layer between the heating layer and the top surface , wherein the first stack of structural layers , the core layer , the second stack of structural layers, the heating layer, and the impact layer are bonded together. a first stack of structural layers adjacent the bottom surface , the first stack of structural layers comprising: a first fiber matrix; and a first high temperature thermoplastic resin infiltrating the first fiber matrix, wherein the first high temperature thermoplastic resin is selected from the group consisting of polyether ether ketone, polyaryletherketones, polycarbonate, polyphenylene sulfide, polyetherimide, polyimide, poly(methyl methacrylate), polyvinyl chloride and polyamideimide; a first fiber matrix; and a first high temperature thermoplastic resin infiltrating the first fiber matrix, wherein the first high temperature thermoplastic resin is selected from the group consisting of polyether ether ketone, polyaryletherketones, polycarbonate, polyphenylene sulfide, polyetherimide, polyimide, poly(methyl methacrylate), polyvinyl chloride and polyamideimide; a core layer, adjacent the first stack of structural layers, that absorbs shear stress; a second stack of structural layers between the core layer and the top surface , the second stack of structural layers comprising: a second fiber matrix; and a second high temperature thermoplastic resin infiltrating the second fiber matrix, wherein the second high temperature thermoplastic resin is selected from the group consisting of polyether ether ketone, polyaryletherketones, polycarbonate, polyphenylene sulfide, polyetherimide, polyimide, poly(methyl methacrylate), polyvinyl chloride, and polyamideimide; a heating layer between the core layer and the top surface ; and an impact layer between the heating layer and the top surface , wherein the first stack of structural layers , the core layer , the second stack of structural layers, the heating layer, and the impact layer are bonded together. <EOS>