An intelligent lamp comprising: a heat dissipation element having a hollow structure inside; a cover element disposed to cover a side of the heat dissipation element ; a lamp holder assembly disposed at another side of the heat dissipation element ; a light source module disposed in the heat dissipation element , electrically connected to the lamp holder assembly , and comprising a light source board disposed in the heat dissipation element ; and a communications module disposed through the light source module , electrically connected to the lamp holder assembly , and the communications module comprising an antenna and a radio frequency module disposed at two opposite sides of the light source board , wherein a plurality of ground components are disposed on the radio frequency module and the ground components contact the light source board , wherein the light source board , the radio frequency module and the heat dissipation element are coupled together via the ground components , and a ground of the antenna , a ground of the radio frequency module , a ground of the light source board and the heat dissipation element are electrically connected to make the heat dissipation element a part of the antenna , a copper exposed area is disposed on the light source board , and the ground components contact the copper exposed area , one of the ground components comprises a spring leaf coupled between the radio frequency module and the light source board , the antenna and the radio frequency module are disposed on a PCB and a portion of the spring leaf may be coupled to the PCB and an another portion of the spring leaf is coupled to the light source board . a heat dissipation element having a hollow structure inside; a cover element disposed to cover a side of the heat dissipation element ; a lamp holder assembly disposed at another side of the heat dissipation element ; a light source module disposed in the heat dissipation element , electrically connected to the lamp holder assembly , and comprising a light source board disposed in the heat dissipation element ; and a communications module disposed through the light source module , electrically connected to the lamp holder assembly , and the communications module comprising an antenna and a radio frequency module disposed at two opposite sides of the light source board , wherein a plurality of ground components are disposed on the radio frequency module and the ground components contact the light source board , wherein the light source board , the radio frequency module and the heat dissipation element are coupled together via the ground components , and a ground of the antenna , a ground of the radio frequency module , a ground of the light source board and the heat dissipation element are electrically connected to make the heat dissipation element a part of the antenna , a copper exposed area is disposed on the light source board , and the ground components contact the copper exposed area , one of the ground components comprises a spring leaf coupled between the radio frequency module and the light source board , the antenna and the radio frequency module are disposed on a PCB and a portion of the spring leaf may be coupled to the PCB and an another portion of the spring leaf is coupled to the light source board . <EOS>