A wave solder nozzle assembly of a wave soldering station configured to perform a wave soldering operation on a printed circuit board , the wave solder nozzle assembly comprising: a nozzle core frame ; a solder distribution baffle secured to the nozzle core frame ; and characterized by : a sliding plate , which with the nozzle core frame and the solder distribution baffle together define a nozzle, the sliding plate being movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave in a direction of travel of the circuit board through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave in the direction of travel through the solder distribution baffle , an unload support frame secured to the nozzle core frame ; an actuating support frame coupled to the unload support frame and configured to move relative to the unload support frame , the sliding plate being secured to the actuating support frame ; and an actuator assembly configured to move the actuating support frame , the actuator assembly including an actuator support secured to the reservoir and an actuator secured to and supported by the actuator support . a nozzle core frame ; a solder distribution baffle secured to the nozzle core frame ; and characterized by : a sliding plate , which with the nozzle core frame and the solder distribution baffle together define a nozzle, the sliding plate being movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave in a direction of travel of the circuit board through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave in the direction of travel through the solder distribution baffle , an unload support frame secured to the nozzle core frame ; an actuating support frame coupled to the unload support frame and configured to move relative to the unload support frame , the sliding plate being secured to the actuating support frame ; and an actuator assembly configured to move the actuating support frame , the actuator assembly including an actuator support secured to the reservoir and an actuator secured to and supported by the actuator support . a sliding plate , which with the nozzle core frame and the solder distribution baffle together define a nozzle, the sliding plate being movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave in a direction of travel of the circuit board through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave in the direction of travel through the solder distribution baffle , an unload support frame secured to the nozzle core frame ; an actuating support frame coupled to the unload support frame and configured to move relative to the unload support frame , the sliding plate being secured to the actuating support frame ; and an actuator assembly configured to move the actuating support frame , the actuator assembly including an actuator support secured to the reservoir and an actuator secured to and supported by the actuator support . <EOS>