A solder printing machine which causes creamy solder to adhere to a board (S) to print a pattern on the board (S) using the solder, the machine comprising: a board holding device configured to hold the board (S); a mask holding device configured to hold a mask (M) provided with multiple openings and coming into contact with a top surface of the board (S) during printing; a squeegee device , including a squeegee , which is configured to cause the creamy solder, being supplied to an upper surface of the mask (M), to adhere to the board (S) held by the board holding device through the multiple openings by causing the squeegee to move over the upper surface of the mask (M); an imaging device configured to image the lower surface of the mask (M) to acquire a board-facing mask position (X, Y, θ), which is a position of the mask (M) held by the mask holding device and is a position along one plane parallel to the top surface of the board (S) held by the board holding device ; a position adjusting device which adjusts the board-facing mask position (X, Y, θ) by moving the mask (M) held by the mask holding device relative to the board holding device during the printing; and a control device for controlling the solder printing machine , characterized in that the control device is configured to acquire an intra-mask positional deviation (ΔR A , ΔR B , ΔR C , ΔP 1 to ΔP 9 ), which is a deviation of a specific location (R A , R B , R C , P1 to P9) on the mask (M), based on captured image data of the imaging device , between any of the multiple openings or a specific mark provided at the specific location (R A , R B , R C , P1 to P9) of the mask (M), and two or more fiducial marks provided on the mask (M). a board holding device configured to hold the board (S); a mask holding device configured to hold a mask (M) provided with multiple openings and coming into contact with a top surface of the board (S) during printing; a squeegee device , including a squeegee , which is configured to cause the creamy solder, being supplied to an upper surface of the mask (M), to adhere to the board (S) held by the board holding device through the multiple openings by causing the squeegee to move over the upper surface of the mask (M); an imaging device configured to image the lower surface of the mask (M) to acquire a board-facing mask position (X, Y, θ), which is a position of the mask (M) held by the mask holding device and is a position along one plane parallel to the top surface of the board (S) held by the board holding device ; a position adjusting device which adjusts the board-facing mask position (X, Y, θ) by moving the mask (M) held by the mask holding device relative to the board holding device during the printing; and a control device for controlling the solder printing machine , characterized in that the control device is configured to acquire an intra-mask positional deviation (ΔR A , ΔR B , ΔR C , ΔP 1 to ΔP 9 ), which is a deviation of a specific location (R A , R B , R C , P1 to P9) on the mask (M), based on captured image data of the imaging device , between any of the multiple openings or a specific mark provided at the specific location (R A , R B , R C , P1 to P9) of the mask (M), and two or more fiducial marks provided on the mask (M). <EOS>