An organic light emitting display comprising: an organic light emitting display panel comprising a display unit ; a plurality of pixel power source out lead bonding, OLB, pads located on first, second, third, and fourth external side edges (300a...d) of the display unit; a plurality of pixel power source lines coupled to the pixel power source OLB pads ; a plurality of pixel power source flexible printed circuit boards, FPCBs, bonded to the pixel power source OLB pads ; a plurality of signal OLB pads located on at least one external side edge among the first, second, third, and fourth external side edges (300a...d); a plurality of signal lines coupled to the signal OLB pads ; and a plurality of tape carrier packages, TCPs, mounted with driving integrated circuits, ICs, and bonded to the signal OLB pads , wherein the signal OLB pads and the pixel power source OLB pads are located on a same external side edge characterised in that : the signal OLB pads bonded to the TCPs are arranged along a first line (A), the first line (A) being at a first distance from the display unit , and the pixel power source OLB pads bonded to the pixel power source FPCBs are arranged along a second line (B), the second line (B) being at a second distance from the display unit , wherein the first line (A) is located closer to the display unit than the second line (B) and wherein the signal OLB pads and the pixel power source OLB pads are respectively located in a first region and a second region that are laterally separated from each other in a direction of the first and second lines (A, B). an organic light emitting display panel comprising a display unit ; a plurality of pixel power source out lead bonding, OLB, pads located on first, second, third, and fourth external side edges (300a...d) of the display unit; a plurality of pixel power source lines coupled to the pixel power source OLB pads ; a plurality of pixel power source flexible printed circuit boards, FPCBs, bonded to the pixel power source OLB pads ; a plurality of signal OLB pads located on at least one external side edge among the first, second, third, and fourth external side edges (300a...d); a plurality of signal lines coupled to the signal OLB pads ; and a plurality of tape carrier packages, TCPs, mounted with driving integrated circuits, ICs, and bonded to the signal OLB pads , wherein the signal OLB pads and the pixel power source OLB pads are located on a same external side edge characterised in that : the signal OLB pads bonded to the TCPs are arranged along a first line (A), the first line (A) being at a first distance from the display unit , and the pixel power source OLB pads bonded to the pixel power source FPCBs are arranged along a second line (B), the second line (B) being at a second distance from the display unit , wherein the first line (A) is located closer to the display unit than the second line (B) and wherein the signal OLB pads and the pixel power source OLB pads are respectively located in a first region and a second region that are laterally separated from each other in a direction of the first and second lines (A, B). the signal OLB pads bonded to the TCPs are arranged along a first line (A), the first line (A) being at a first distance from the display unit , and the pixel power source OLB pads bonded to the pixel power source FPCBs are arranged along a second line (B), the second line (B) being at a second distance from the display unit , wherein the first line (A) is located closer to the display unit than the second line (B) and wherein the signal OLB pads and the pixel power source OLB pads are respectively located in a first region and a second region that are laterally separated from each other in a direction of the first and second lines (A, B). <EOS>