An electronic device , comprising: one or more electronic components ; and a flexible base to provide an electronic device package, the flexible base including: a flexible film including a flexible and electrically insulative material, the flexible film structured to adhere the one or more electronic components on a first side of the flexible film and to include openings spanning from the first side into an interior region of the flexible base , wherein the openings are arranged to align to locations where conductive contacts of the one or more electronic components are positioned; interconnection wires including an electrically conductive material, the interconnection wires disposed in the openings and the interior region of the flexible base in a particular arrangement based on a device design to electrically connect the one or more electronic components ; and a layer of an electrically insulative and flexible material deposited over the interconnection wires on the flexible film to form the flexible base of the electronic device, such that the interconnection wires are encompassed by the flexible base , characterized in that the flexible base has a thickness less than 20 μm. one or more electronic components ; and a flexible base to provide an electronic device package, the flexible base including: a flexible film including a flexible and electrically insulative material, the flexible film structured to adhere the one or more electronic components on a first side of the flexible film and to include openings spanning from the first side into an interior region of the flexible base , wherein the openings are arranged to align to locations where conductive contacts of the one or more electronic components are positioned; interconnection wires including an electrically conductive material, the interconnection wires disposed in the openings and the interior region of the flexible base in a particular arrangement based on a device design to electrically connect the one or more electronic components ; and a layer of an electrically insulative and flexible material deposited over the interconnection wires on the flexible film to form the flexible base of the electronic device, such that the interconnection wires are encompassed by the flexible base , a flexible film including a flexible and electrically insulative material, the flexible film structured to adhere the one or more electronic components on a first side of the flexible film and to include openings spanning from the first side into an interior region of the flexible base , wherein the openings are arranged to align to locations where conductive contacts of the one or more electronic components are positioned; interconnection wires including an electrically conductive material, the interconnection wires disposed in the openings and the interior region of the flexible base in a particular arrangement based on a device design to electrically connect the one or more electronic components ; and a layer of an electrically insulative and flexible material deposited over the interconnection wires on the flexible film to form the flexible base of the electronic device, such that the interconnection wires are encompassed by the flexible base , <EOS>