An electronic device , comprising: a display module ; a circuit module ; and a housing suitable for protecting the display module and the circuit module , the housing comprising: a first transparent cover , at least a part of the first transparent cover presenting a curve; a second transparent cover opposite to the first transparent cover , wherein the display module is disposed between the second transparent cover and the circuit module ; and a frame connected between the periphery of the first transparent cover and the periphery of the second transparent cover , wherein the frame forms an accommodation space (C) with the first transparent cover and the second transparent cover for accommodating the display module and the circuit module ; characterized by further comprising a first multi-layer stacked structure disposed on a first inner surface of the first transparent cover facing toward the second transparent cover and having a plurality of first optical layers stacked in sequence; and a first tinted layer disposed on the first multi-layer stacked structure ; wherein a thickness of the first multi-layer stacked structure on the center of the first transparent layer is greater than a thickness of the first multi-layer stacked structure on the periphery of the first transparent layer . a display module ; a circuit module ; and a housing suitable for protecting the display module and the circuit module , the housing comprising: a first transparent cover , at least a part of the first transparent cover presenting a curve; a second transparent cover opposite to the first transparent cover , wherein the display module is disposed between the second transparent cover and the circuit module ; and a frame connected between the periphery of the first transparent cover and the periphery of the second transparent cover , wherein the frame forms an accommodation space (C) with the first transparent cover and the second transparent cover for accommodating the display module and the circuit module ; characterized by further comprising a first multi-layer stacked structure disposed on a first inner surface of the first transparent cover facing toward the second transparent cover and having a plurality of first optical layers stacked in sequence; and a first tinted layer disposed on the first multi-layer stacked structure ; wherein a thickness of the first multi-layer stacked structure on the center of the first transparent layer is greater than a thickness of the first multi-layer stacked structure on the periphery of the first transparent layer . a first transparent cover , at least a part of the first transparent cover presenting a curve; a second transparent cover opposite to the first transparent cover , wherein the display module is disposed between the second transparent cover and the circuit module ; and a frame connected between the periphery of the first transparent cover and the periphery of the second transparent cover , wherein the frame forms an accommodation space (C) with the first transparent cover and the second transparent cover for accommodating the display module and the circuit module ; characterized by further comprising a first multi-layer stacked structure disposed on a first inner surface of the first transparent cover facing toward the second transparent cover and having a plurality of first optical layers stacked in sequence; and a first tinted layer disposed on the first multi-layer stacked structure ; wherein a thickness of the first multi-layer stacked structure on the center of the first transparent layer is greater than a thickness of the first multi-layer stacked structure on the periphery of the first transparent layer . <EOS>