A substrate , comprising a base and an encapsulation structure , the encapsulation structure being located on the base, the encapsulation structure , comprising: an encapsulation layer, comprising a first encapsulation layer and a second encapsulation layer , wherein the first encapsulation layer and the second encapsulation layer being laminated on the base, the first encapsulation layer being located on a first main surface of the second encapsulation layer ; and a transition layer , juxtaposed with the first encapsulation layer on the first main surface ; wherein the first main surface includes a first region in contact with the first encapsulation layer and a second region in contact with the transition layer , the second region is located at an edge of the first main surface , and a bonding strength between the transition layer and the second encapsulation layer is greater than a bonding strength between the first encapsulation layer and the second encapsulation layer ;wherein a surface of the transition layer in contact with the first main surface is provided with at least one concave-convex structure ; wherein each of the at least one concave-convex structure is protruded towards the second encapsulation layer from an interface of the transition layer and the second encapsulation layer , so that a contact area between the second encapsulation layer and the transition layer increases, characterized in that the materials of the second encapsulation layer and the transition layer both include organic materials, the material of the first encapsulation layer comprise an inorganic material, the at least one concave-convex structure is obtainable by a patterning process performed on a surface of the transition layer in contact with the second region . an encapsulation layer, comprising a first encapsulation layer and a second encapsulation layer , wherein the first encapsulation layer and the second encapsulation layer being laminated on the base, the first encapsulation layer being located on a first main surface of the second encapsulation layer ; and a transition layer , juxtaposed with the first encapsulation layer on the first main surface ; wherein the first main surface includes a first region in contact with the first encapsulation layer and a second region in contact with the transition layer , the second region is located at an edge of the first main surface , and a bonding strength between the transition layer and the second encapsulation layer is greater than a bonding strength between the first encapsulation layer and the second encapsulation layer ;wherein a surface of the transition layer in contact with the first main surface is provided with at least one concave-convex structure ; wherein each of the at least one concave-convex structure is protruded towards the second encapsulation layer from an interface of the transition layer and the second encapsulation layer , so that a contact area between the second encapsulation layer and the transition layer increases, characterized in that the materials of the second encapsulation layer and the transition layer both include organic materials, the material of the first encapsulation layer comprise an inorganic material, the at least one concave-convex structure is obtainable by a patterning process performed on a surface of the transition layer in contact with the second region . <EOS>