A resistive soldering method, comprising: providing a glass and an antenna component which comprises a base structure and a cylindrical structure , wherein the base structure has a first surface to be soldered and a front surface opposite to the first surface to be soldered, and comprises a central portion (I) and an edge portion (II) surrounding the central portion (I), and the cylindrical structure is located on the central portion (I) on the front surface of the base structure , and has a hole penetrating through a thickness of the cylindrical structure ; forming solder on a second surface to be soldered of the glass and/or the first surface to be soldered of the base structure ; performing a resistive soldering process to the second surface to be soldered of the glass and the first surface to be soldered of the base structure to melt the solder therebetween; and after the resistive soldering process , performing a cooling treatment to the glass and the antenna component to cool the glass and the antenna component , characterised in that during the resistive soldering process , a first electrode and a second electrode , which are both connected with a power supply unit , are used to apply a first pressure and provide a heating current to the edge portion (II) on the front surface of the base structure , and a support cylinder is inserted into the hole of the cylindrical structure and adapted to apply to the antenna component a second pressure for attaching the antenna component to the glass , whereby the first electrode , the second electrode and the support cylinder , located between the first electrode and the second electrode , are connected with a resistive soldering joint which is adapted to raise or lower the first electrode , the second electrode and the support cylinder . providing a glass and an antenna component which comprises a base structure and a cylindrical structure , wherein the base structure has a first surface to be soldered and a front surface opposite to the first surface to be soldered, and comprises a central portion (I) and an edge portion (II) surrounding the central portion (I), and the cylindrical structure is located on the central portion (I) on the front surface of the base structure , and has a hole penetrating through a thickness of the cylindrical structure ; forming solder on a second surface to be soldered of the glass and/or the first surface to be soldered of the base structure ; performing a resistive soldering process to the second surface to be soldered of the glass and the first surface to be soldered of the base structure to melt the solder therebetween; and after the resistive soldering process , performing a cooling treatment to the glass and the antenna component to cool the glass and the antenna component , characterised in that during the resistive soldering process , a first electrode and a second electrode , which are both connected with a power supply unit , are used to apply a first pressure and provide a heating current to the edge portion (II) on the front surface of the base structure , and a support cylinder is inserted into the hole of the cylindrical structure and adapted to apply to the antenna component a second pressure for attaching the antenna component to the glass , whereby the first electrode , the second electrode and the support cylinder , located between the first electrode and the second electrode , are connected with a resistive soldering joint which is adapted to raise or lower the first electrode , the second electrode and the support cylinder . <EOS>