An electronic device (400; 600), comprising: a housing including a rear housing (410; 610) forming an external shape of the electronic device; a first board (420; 620) disposed in a first direction from the rear housing (410; 610) of the housing, wherein at least one processor is mounted at the first board (420; 620); a second board (440; 640) disposed between the rear housing (410; 610) and the first board (420; 620) and electrically connected with the first board (420; 620), the second board (440; 640) being spatially separated from the rear housing (410; 610); a thermistor (430; 630) mounted on the second board (440; 640), wherein the thermistor (430; 630) is disposed at a surface of the second board (440; 640) in a second direction that is towards the rear housing (410; 610), the second direction being opposite to the first direction; and at least one first structure (451, 452; 651, 652) for securing a disposition space (415; 615) in which the thermistor (430; 630) is disposed, wherein the disposition space (415; 615) is suitable for blocking heat generated at adjacent other spaces of the electronic device (400; 600), wherein the at least one first structure (451, 452; 651, 652) is suitable for supporting a pressure in the first direction and/or the second direction to prevent a physical impact and/or for blocking heat transferred from the outside to the disposition space (415; 615); and wherein the at least one processor is configured to determine, based on an electrical signal from the thermistor (430; 630), a temperature of the rear housing (410; 610) detected by the thermistor (430; 630). a housing including a rear housing (410; 610) forming an external shape of the electronic device; a first board (420; 620) disposed in a first direction from the rear housing (410; 610) of the housing, wherein at least one processor is mounted at the first board (420; 620); a second board (440; 640) disposed between the rear housing (410; 610) and the first board (420; 620) and electrically connected with the first board (420; 620), the second board (440; 640) being spatially separated from the rear housing (410; 610); a thermistor (430; 630) mounted on the second board (440; 640), wherein the thermistor (430; 630) is disposed at a surface of the second board (440; 640) in a second direction that is towards the rear housing (410; 610), the second direction being opposite to the first direction; and at least one first structure (451, 452; 651, 652) for securing a disposition space (415; 615) in which the thermistor (430; 630) is disposed, wherein the disposition space (415; 615) is suitable for blocking heat generated at adjacent other spaces of the electronic device (400; 600), wherein the at least one first structure (451, 452; 651, 652) is suitable for supporting a pressure in the first direction and/or the second direction to prevent a physical impact and/or for blocking heat transferred from the outside to the disposition space (415; 615); and wherein the at least one processor is configured to determine, based on an electrical signal from the thermistor (430; 630), a temperature of the rear housing (410; 610) detected by the thermistor (430; 630). <EOS>