A display device comprising: a first substrate ; a flexible printed circuit disposed on a first area of the first substrate ; and a film disposed on the first substrate and the flexible printed circuit , wherein: the flexible printed circuit comprises: a second substrate ; a pad unit comprising pads disposed on the second substrate , the pads extending in a first direction and spaced apart from one another in a second direction crossing the first direction; and characterized in that the flexible printed circuit further comprises a dummy pad disposed on the second substrate , the dummy pad being spaced apart from the pad unit ; the pads in the pad unit are electrically connected to pads or lines or bumps on the first substrate ; this electrical connection is achieved via an adhesive layer , in particular an anisotropically conductive adhesive layer; the dummy pad is spaced apart from the adhesive layer ; a first air path (AP1) is formed between the dummy pad and the pad unit ; the first air path (AP1) is configured to discharge air bubbles disposed between the first substrate and the film to an ambient environment. a first substrate ; a flexible printed circuit disposed on a first area of the first substrate ; and a film disposed on the first substrate and the flexible printed circuit , wherein: the flexible printed circuit comprises: a second substrate ; a pad unit comprising pads disposed on the second substrate , the pads extending in a first direction and spaced apart from one another in a second direction crossing the first direction; and characterized in that the flexible printed circuit further comprises a dummy pad disposed on the second substrate , the dummy pad being spaced apart from the pad unit ; the pads in the pad unit are electrically connected to pads or lines or bumps on the first substrate ; this electrical connection is achieved via an adhesive layer , in particular an anisotropically conductive adhesive layer; the dummy pad is spaced apart from the adhesive layer ; a first air path (AP1) is formed between the dummy pad and the pad unit ; the first air path (AP1) is configured to discharge air bubbles disposed between the first substrate and the film to an ambient environment. the flexible printed circuit comprises: a second substrate ; a pad unit comprising pads disposed on the second substrate , the pads extending in a first direction and spaced apart from one another in a second direction crossing the first direction; and a second substrate ; a pad unit comprising pads disposed on the second substrate , the pads extending in a first direction and spaced apart from one another in a second direction crossing the first direction; and characterized in that the flexible printed circuit further comprises a dummy pad disposed on the second substrate , the dummy pad being spaced apart from the pad unit ; the pads in the pad unit are electrically connected to pads or lines or bumps on the first substrate ; this electrical connection is achieved via an adhesive layer , in particular an anisotropically conductive adhesive layer; the dummy pad is spaced apart from the adhesive layer ; a first air path (AP1) is formed between the dummy pad and the pad unit ; the first air path (AP1) is configured to discharge air bubbles disposed between the first substrate and the film to an ambient environment. <EOS>