A wafer optical processing device, for optically processing a sintered wafer, comprising: wafer support devices , said wafer support devices comprising a support piece, said support piece being provided with an upper surface and a lower surface that are disposed facing each other, said support piece being hollowed out in a direction from the upper surface to the lower surface , said support piece being configured to be capable of supporting said wafer above said upper surface ; an upper light source device , said upper light source device being disposed above said wafer support devices and configured to provide a light source that illuminates the upper surface of said support piece ; and a lower light source device , said lower light source device being disposed below said wafer support devices and configured to provide a light source that illuminates the lower surface of said support piece , wherein said wafer optical processing assembly further comprises: an upper transparent baffle plate , said upper transparent baffle plate being located between said upper light source device and said wafer support devices and separated from said upper light source device , a plurality of holes being disposed in said upper transparent baffle plate ; and a lower transparent baffle plate , said lower transparent baffle plate being located between said lower light source device and said wafer support devices and separated from said lower light source device , characterised in that the lower transparent baffle plate 503 is provided with no holes. wafer support devices , said wafer support devices comprising a support piece, said support piece being provided with an upper surface and a lower surface that are disposed facing each other, said support piece being hollowed out in a direction from the upper surface to the lower surface , said support piece being configured to be capable of supporting said wafer above said upper surface ; an upper light source device , said upper light source device being disposed above said wafer support devices and configured to provide a light source that illuminates the upper surface of said support piece ; and a lower light source device , said lower light source device being disposed below said wafer support devices and configured to provide a light source that illuminates the lower surface of said support piece , wherein said wafer optical processing assembly further comprises: an upper transparent baffle plate , said upper transparent baffle plate being located between said upper light source device and said wafer support devices and separated from said upper light source device , a plurality of holes being disposed in said upper transparent baffle plate ; and a lower transparent baffle plate , said lower transparent baffle plate being located between said lower light source device and said wafer support devices and separated from said lower light source device , characterised in that the lower transparent baffle plate 503 is provided with no holes. an upper transparent baffle plate , said upper transparent baffle plate being located between said upper light source device and said wafer support devices and separated from said upper light source device , a plurality of holes being disposed in said upper transparent baffle plate ; and a lower transparent baffle plate , said lower transparent baffle plate being located between said lower light source device and said wafer support devices and separated from said lower light source device , characterised in that the lower transparent baffle plate 503 is provided with no holes. <EOS>