An exterior jacket component for a product , the exterior jacket component comprising: a molded resin element wherein a surface of the molded resin element contains a first surface that serves as an outer surface of the exterior jacket component ; and the exterior jacket component further includes: an IC chip embedded in the molded resin element and configured to store identification data identifying the product ; and antenna wiring formed on the first surface and configured to allow the IC chip to perform wireless communication; characterized by an IC-side antenna connected to the IC chip ; and the IC chip and IC-side antenna are integrally configured into an IC module ; the IC module is embedded in the molded resin element ; and the antenna wiring is configured as a booster antenna for electromagnetic coupling with the IC-side antenna ; wherein the surface of the molded resin element includes a second surface that is an inner surface of the exterior jacket component ; the second surface is the reverse side of the first surface ; and the IC module is embedded in the molded resin element so that the IC module is exposed from the second surface ; and the antenna wiring is formed on the first surface to face the IC module . a molded resin element wherein a surface of the molded resin element contains a first surface that serves as an outer surface of the exterior jacket component ; and the exterior jacket component further includes: an IC chip embedded in the molded resin element and configured to store identification data identifying the product ; and antenna wiring formed on the first surface and configured to allow the IC chip to perform wireless communication; characterized by an IC-side antenna connected to the IC chip ; and the IC chip and IC-side antenna are integrally configured into an IC module ; the IC module is embedded in the molded resin element ; and the antenna wiring is configured as a booster antenna for electromagnetic coupling with the IC-side antenna ; wherein the surface of the molded resin element includes a second surface that is an inner surface of the exterior jacket component ; the second surface is the reverse side of the first surface ; and the IC module is embedded in the molded resin element so that the IC module is exposed from the second surface ; and the antenna wiring is formed on the first surface to face the IC module . an IC chip embedded in the molded resin element and configured to store identification data identifying the product ; and antenna wiring formed on the first surface and configured to allow the IC chip to perform wireless communication; characterized by an IC-side antenna connected to the IC chip ; and the IC chip and IC-side antenna are integrally configured into an IC module ; the IC module is embedded in the molded resin element ; and the antenna wiring is configured as a booster antenna for electromagnetic coupling with the IC-side antenna ; wherein the surface of the molded resin element includes a second surface that is an inner surface of the exterior jacket component ; the second surface is the reverse side of the first surface ; and the IC module is embedded in the molded resin element so that the IC module is exposed from the second surface ; and the antenna wiring is formed on the first surface to face the IC module . <EOS>