Method for manufacturing a timepiece component comprising the following steps of: a) taking the substrate , depositing a first electrically conductive layer thereon, and applying a first photoresist layer ; b) irradiating the first photoresist layer through a mask defining a first level of the component and dissolving the non-irradiated areas of the photoresist layer to reveal in places the first electrically conductive layer and to form a photopolymerised photoresist mould defining the first level of the component; c) locally depositing a second electrically conductive layer on the photopolymerised photoresist of the first photoresist layer , the second electrically conductive layer being deposited through a stencil mask or by printing an ink or a conductive resin; d) applying a second photoresist layer covering the structure produced in step c); e) irradiating the second photoresist layer through a mask (4") defining a second level of the component and dissolving the non-irradiated areas of the second photoresist layer to form a mould comprising a first and a second level and to reveal in places the first and the second electrically conductive layer ; f) depositing a metal layer by electroforming in the mould from the first layer and second layer to form the component, the layer substantially reaching the top surface of the second photoresist layer ; g) machining, using a mechanical method, the metal layer to a predefined thickness; h) producing, in wafer form and by mechanical machining, additional shapes (chamfers, spot faces, etc.) on the top face of the component; i) successively removing the substrate, the conductive layers and the photoresist to release the component. a) taking the substrate , depositing a first electrically conductive layer thereon, and applying a first photoresist layer ; b) irradiating the first photoresist layer through a mask defining a first level of the component and dissolving the non-irradiated areas of the photoresist layer to reveal in places the first electrically conductive layer and to form a photopolymerised photoresist mould defining the first level of the component; c) locally depositing a second electrically conductive layer on the photopolymerised photoresist of the first photoresist layer , the second electrically conductive layer being deposited through a stencil mask or by printing an ink or a conductive resin; d) applying a second photoresist layer covering the structure produced in step c); e) irradiating the second photoresist layer through a mask (4") defining a second level of the component and dissolving the non-irradiated areas of the second photoresist layer to form a mould comprising a first and a second level and to reveal in places the first and the second electrically conductive layer ; f) depositing a metal layer by electroforming in the mould from the first layer and second layer to form the component, the layer substantially reaching the top surface of the second photoresist layer ; g) machining, using a mechanical method, the metal layer to a predefined thickness; h) producing, in wafer form and by mechanical machining, additional shapes (chamfers, spot faces, etc.) on the top face of the component; i) successively removing the substrate, the conductive layers and the photoresist to release the component. <EOS>