A method of manufacturing a component carrier configured as one of the group consisting of a printed circuit board and a substrate, wherein the component carrier comprises an electronic component and the method comprises: galvanically depositing at least part of at least one electrically conductive pillar on the electronic component , wherein the at least one electrically conductive pillar is formed by sputtering a base portion of a first material on the component , and by galvanically depositing a top portion of a second material on the base portion ; and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another: wherein the method either comprises: inserting the at least one electrically conductive pillar into the electrically insulating layer structure so that a free end of the at least one electrically conductive pillar remains within the electrically insulating layer structure and subsequently removing part of the electrically insulating layer structure so that the free end is exposed, or inserting the at least one electrically conductive pillar into the electrically insulating layer structure so deep that a free end of the at least one electrically conductive pillar protrudes beyond the electrically insulating layer structure and is thereby exposed; or attaching a carrier as the electrically insulating layer structure to an electrically insulating layer structure prior to the inserting, and removing at least part of the attached carrier from the electrically insulating layer structure after the inserting. galvanically depositing at least part of at least one electrically conductive pillar on the electronic component , wherein the at least one electrically conductive pillar is formed by sputtering a base portion of a first material on the component , and by galvanically depositing a top portion of a second material on the base portion ; and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another: wherein the method either comprises: inserting the at least one electrically conductive pillar into the electrically insulating layer structure so that a free end of the at least one electrically conductive pillar remains within the electrically insulating layer structure and subsequently removing part of the electrically insulating layer structure so that the free end is exposed, or inserting the at least one electrically conductive pillar into the electrically insulating layer structure so deep that a free end of the at least one electrically conductive pillar protrudes beyond the electrically insulating layer structure and is thereby exposed; or attaching a carrier as the electrically insulating layer structure to an electrically insulating layer structure prior to the inserting, and removing at least part of the attached carrier from the electrically insulating layer structure after the inserting. inserting the at least one electrically conductive pillar into the electrically insulating layer structure so that a free end of the at least one electrically conductive pillar remains within the electrically insulating layer structure and subsequently removing part of the electrically insulating layer structure so that the free end is exposed, or inserting the at least one electrically conductive pillar into the electrically insulating layer structure so deep that a free end of the at least one electrically conductive pillar protrudes beyond the electrically insulating layer structure and is thereby exposed; or attaching a carrier as the electrically insulating layer structure to an electrically insulating layer structure prior to the inserting, and removing at least part of the attached carrier from the electrically insulating layer structure after the inserting. <EOS>