An electrical testing system , comprising: a pressure sensor device ; a test chamber , accommodating the pressure sensor device ; and a testing equipment , arranged in the test chamber and configured to acquire, at different temperature reference values, output signals from the pressure detection structure of the pressure sensor device , wherein the pressure sensor device comprises: a pressure detection structure provided in a first die of semiconductor material; a package , configured to internally accommodate said pressure detection structure in an impermeable manner, said package comprising a base structure and a body structure , arranged on the base structure , having an access opening in contact with an external environment and internally defining a housing cavity , in which said first die is arranged covered with a coating material ; and a heating structure , accommodated in said housing cavity and configured to implement heating of said pressure detection structure from the inside of said package , wherein the testing equipment is configured to adjust the temperature of said pressure detection structure from outside of said package , in cooperation and in conjunction with said heating structure ; said testing equipment being further operable to heat from the outside, by heat conduction, the pressure detection structure of the pressure sensor device . a pressure sensor device ; a test chamber , accommodating the pressure sensor device ; and a testing equipment , arranged in the test chamber and configured to acquire, at different temperature reference values, output signals from the pressure detection structure of the pressure sensor device , wherein the pressure sensor device comprises: a pressure detection structure provided in a first die of semiconductor material; a package , configured to internally accommodate said pressure detection structure in an impermeable manner, said package comprising a base structure and a body structure , arranged on the base structure , having an access opening in contact with an external environment and internally defining a housing cavity , in which said first die is arranged covered with a coating material ; and a heating structure , accommodated in said housing cavity and configured to implement heating of said pressure detection structure from the inside of said package , wherein the testing equipment is configured to adjust the temperature of said pressure detection structure from outside of said package , in cooperation and in conjunction with said heating structure ; said testing equipment being further operable to heat from the outside, by heat conduction, the pressure detection structure of the pressure sensor device . a pressure detection structure provided in a first die of semiconductor material; a package , configured to internally accommodate said pressure detection structure in an impermeable manner, said package comprising a base structure and a body structure , arranged on the base structure , having an access opening in contact with an external environment and internally defining a housing cavity , in which said first die is arranged covered with a coating material ; and a heating structure , accommodated in said housing cavity and configured to implement heating of said pressure detection structure from the inside of said package , wherein the testing equipment is configured to adjust the temperature of said pressure detection structure from outside of said package , in cooperation and in conjunction with said heating structure ; said testing equipment being further operable to heat from the outside, by heat conduction, the pressure detection structure of the pressure sensor device . <EOS>