A battery module of a vehicle comprising: - a multi-layered printed circuit board, PCB, comprising: - a plurality of internal layers comprising: - a distributed power layer ; - a distributed ground layer ; and - one or more inner signal layers disposed between the distributed power layer and the distributed ground layer , wherein the one or more inner signal layers comprises circuitry for routing circuit signals; - a first external ground cage layer disposed on a side of the distributed power layer opposite the one or more inner signal layers forming a first external layer of the multi-layered PCB ; and - a second external ground cage layer disposed on a side of the distributed ground layer opposite the one or more inner signal layers forming a second external layer of the multi-layered PCB , wherein the first and second external ground cage layers are configured to shield the circuitry from electrical noise, and wherein the first and second external cage layers are made from a conductive material and comprise a layer of insulative material on top of the conductive material. - a multi-layered printed circuit board, PCB, comprising: - a plurality of internal layers comprising: - a distributed power layer ; - a distributed ground layer ; and - one or more inner signal layers disposed between the distributed power layer and the distributed ground layer , wherein the one or more inner signal layers comprises circuitry for routing circuit signals; - a first external ground cage layer disposed on a side of the distributed power layer opposite the one or more inner signal layers forming a first external layer of the multi-layered PCB ; and - a second external ground cage layer disposed on a side of the distributed ground layer opposite the one or more inner signal layers forming a second external layer of the multi-layered PCB , wherein the first and second external ground cage layers are configured to shield the circuitry from electrical noise, and wherein the first and second external cage layers are made from a conductive material and comprise a layer of insulative material on top of the conductive material. - a plurality of internal layers comprising: - a distributed power layer ; - a distributed ground layer ; and - one or more inner signal layers disposed between the distributed power layer and the distributed ground layer , wherein the one or more inner signal layers comprises circuitry for routing circuit signals; - a distributed power layer ; - a distributed ground layer ; and - one or more inner signal layers disposed between the distributed power layer and the distributed ground layer , wherein the one or more inner signal layers comprises circuitry for routing circuit signals; - a first external ground cage layer disposed on a side of the distributed power layer opposite the one or more inner signal layers forming a first external layer of the multi-layered PCB ; and - a second external ground cage layer disposed on a side of the distributed ground layer opposite the one or more inner signal layers forming a second external layer of the multi-layered PCB , wherein the first and second external ground cage layers are configured to shield the circuitry from electrical noise, and wherein the first and second external cage layers are made from a conductive material and comprise a layer of insulative material on top of the conductive material. <EOS>