A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application, comprising: a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application, said body further including a generally cylindrical socket having a longitudinal length; a fluid passageway defined in said body connecting said inlet and said outlet and configured to receive the flow of liquid adhesive material, said fluid passageway including a thin slit section having a length along a fluid flow direction between said inlet and said outlet , said thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction, the first dimension and the length being substantially greater than the second dimension, wherein a profile of said thin slit section is a ring, the first dimension is a circumference of the ring, and the second dimension is a radial thickness of the ring; characterized by an interior body member extending within said generally cylindrical socket and along the longitudinal length so as to define said thin slit section at an annular gap located between said generally cylindrical socket and said interior body member , said interior body including a plurality of projections , configured to maintain said interior body member centered within said cylindrical socket , and extending radially outwardly into contact with said generally cylindrical socket , with gaps for flow of liquid adhesive material into said thin slit section located between said plurality of projections ; and at least one heating element thermally coupled with said body and configured for heating the liquid adhesive material flowing through said fluid passageway to the application temperature. a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application, said body further including a generally cylindrical socket having a longitudinal length; a fluid passageway defined in said body connecting said inlet and said outlet and configured to receive the flow of liquid adhesive material, said fluid passageway including a thin slit section having a length along a fluid flow direction between said inlet and said outlet , said thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction, the first dimension and the length being substantially greater than the second dimension, wherein a profile of said thin slit section is a ring, the first dimension is a circumference of the ring, and the second dimension is a radial thickness of the ring; characterized by an interior body member extending within said generally cylindrical socket and along the longitudinal length so as to define said thin slit section at an annular gap located between said generally cylindrical socket and said interior body member , said interior body including a plurality of projections , configured to maintain said interior body member centered within said cylindrical socket , and extending radially outwardly into contact with said generally cylindrical socket , with gaps for flow of liquid adhesive material into said thin slit section located between said plurality of projections ; and at least one heating element thermally coupled with said body and configured for heating the liquid adhesive material flowing through said fluid passageway to the application temperature. <EOS>