An electronic device comprising: a housing including a first plate , a second plate facing away from the first plate , and a side member surrounding a space between the first plate and the second plate ; a first printed circuit board, PCB, disposed in parallel with the first plate in the space between the first plate and the second plate , and including a first face facing the first plate and a second face facing the second plate ; at least one conductive plate formed on the second face ; a first conductive pattern embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate ; a first wireless communication circuit mounted on the first face of the first PCB , electrically coupled to the at least one conductive plate and the first conductive pattern , and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 6GHz to 100GHz by way of the at least one conductive plate and the first conductive pattern ; a dielectric structure disposed on the first face between the conductive plate and the side member when viewed from above the first plate ; a second conductive pattern constructed on one face of the dielectric structure or embedded at least partially inside thereof; a second wireless communication circuit electrically coupled to the second conductive pattern and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 0.5GHz to 6GHz by way of the second conductive pattern ; and a second PCB disposed between the first plate and the second plate , wherein the second wireless communication circuit is mounted to the second PCB . a housing including a first plate , a second plate facing away from the first plate , and a side member surrounding a space between the first plate and the second plate ; a first printed circuit board, PCB, disposed in parallel with the first plate in the space between the first plate and the second plate , and including a first face facing the first plate and a second face facing the second plate ; at least one conductive plate formed on the second face ; a first conductive pattern embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate ; a first wireless communication circuit mounted on the first face of the first PCB , electrically coupled to the at least one conductive plate and the first conductive pattern , and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 6GHz to 100GHz by way of the at least one conductive plate and the first conductive pattern ; a dielectric structure disposed on the first face between the conductive plate and the side member when viewed from above the first plate ; a second conductive pattern constructed on one face of the dielectric structure or embedded at least partially inside thereof; a second wireless communication circuit electrically coupled to the second conductive pattern and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 0.5GHz to 6GHz by way of the second conductive pattern ; and a second PCB disposed between the first plate and the second plate , wherein the second wireless communication circuit is mounted to the second PCB . <EOS>