A multi-device module , comprising: - a first package including a first substrate and a first covering element coupled together to define a first internal cavity ; - a second package including a second substrate and a second covering element coupled together to define a second internal cavity , wherein the first internal cavity houses a first MEMS transducer and an integrated circuit , which are supported by said substrate ,the first MEMS transducer being configured to detect a first environmental quantity and to generate a first transduced signal as a function of the first environmental quantity detected, and the integrated circuit being operatively coupled to the first MEMS transducer for receiving the first transduced signal, and wherein the second internal cavity houses a second MEMS transducer , which is supported by the second substrate , and is configured to detect a second environmental quantity and generate a second transduced signal as a function of the second environmental quantity detected, - a flexible printed circuit mechanically coupled to the first and the second substrates , the flexible printed circuit being electrically coupled to the integrated circuit and to the second MEMS transducer so that said second transduced signal flows, in use, from the second MEMS transducer to the integrated circuit . - a first package including a first substrate and a first covering element coupled together to define a first internal cavity ; - a second package including a second substrate and a second covering element coupled together to define a second internal cavity , wherein the first internal cavity houses a first MEMS transducer and an integrated circuit , which are supported by said substrate ,the first MEMS transducer being configured to detect a first environmental quantity and to generate a first transduced signal as a function of the first environmental quantity detected, and the integrated circuit being operatively coupled to the first MEMS transducer for receiving the first transduced signal, and wherein the second internal cavity houses a second MEMS transducer , which is supported by the second substrate , and is configured to detect a second environmental quantity and generate a second transduced signal as a function of the second environmental quantity detected, wherein the first internal cavity houses a first MEMS transducer and an integrated circuit , which are supported by said substrate ,the first MEMS transducer being configured to detect a first environmental quantity and to generate a first transduced signal as a function of the first environmental quantity detected, and the integrated circuit being operatively coupled to the first MEMS transducer for receiving the first transduced signal, and wherein the second internal cavity houses a second MEMS transducer , which is supported by the second substrate , and is configured to detect a second environmental quantity and generate a second transduced signal as a function of the second environmental quantity detected, - a flexible printed circuit mechanically coupled to the first and the second substrates , the flexible printed circuit being electrically coupled to the integrated circuit and to the second MEMS transducer so that said second transduced signal flows, in use, from the second MEMS transducer to the integrated circuit . <EOS>