An injection molding machine comprising: a first ejector unit configured to eject a molding product molded in cavity spaces formed between a first die and a second die , from the second die ; a second ejector unit configured to eject the molding product molded in the cavity spaces formed between the first die and the second die , from the second die ; and a control device configured to control the first ejector unit and control the second ejector unit , characterized in that the control device includes a first setting unit configured to set a first ejection condition for controlling the first ejector unit , a second setting unit configured to set a second ejection condition for controlling the second ejector unit , a control unit configured to control the first ejector unit under the first ejection condition and control the second ejector unit under the same condition as the first ejection condition, for the same molding product, when a predetermined condition is satisfied, and a display processing unit configured to perform display in a state where a setting change in the first ejection condition is allowed and a setting change in the second ejection condition is suppressed, or to perform display in a state where a setting change in the second ejection condition is allowed and a setting change in the first ejection condition is suppressed, when the predetermined condition is satisfied. a first ejector unit configured to eject a molding product molded in cavity spaces formed between a first die and a second die , from the second die ; a second ejector unit configured to eject the molding product molded in the cavity spaces formed between the first die and the second die , from the second die ; and a control device configured to control the first ejector unit and control the second ejector unit , characterized in that the control device includes a first setting unit configured to set a first ejection condition for controlling the first ejector unit , a second setting unit configured to set a second ejection condition for controlling the second ejector unit , a control unit configured to control the first ejector unit under the first ejection condition and control the second ejector unit under the same condition as the first ejection condition, for the same molding product, when a predetermined condition is satisfied, and a display processing unit configured to perform display in a state where a setting change in the first ejection condition is allowed and a setting change in the second ejection condition is suppressed, or to perform display in a state where a setting change in the second ejection condition is allowed and a setting change in the first ejection condition is suppressed, when the predetermined condition is satisfied. a first setting unit configured to set a first ejection condition for controlling the first ejector unit , a second setting unit configured to set a second ejection condition for controlling the second ejector unit , a control unit configured to control the first ejector unit under the first ejection condition and control the second ejector unit under the same condition as the first ejection condition, for the same molding product, when a predetermined condition is satisfied, and a display processing unit configured to perform display in a state where a setting change in the first ejection condition is allowed and a setting change in the second ejection condition is suppressed, or to perform display in a state where a setting change in the second ejection condition is allowed and a setting change in the first ejection condition is suppressed, when the predetermined condition is satisfied. <EOS>