A board inspecting apparatus, comprising: a measuring section configured to obtain measurement data for at least a portion of a board ; a processing section configured to perform warpage compensation for the board by comparing the measurement data of the board and previously obtained reference data of the board , based on a plurality of feature objects set on the board , and inspect the board in which warpage is compensated; and a display section configured to display ranges for adjusting a first level of an inspection speed according to the warpage compensation and a second level of a precision of the warpage compensation; and an input section configured to receive, from a user, an input for the first level of the inspection speed and the second level of the precision as a predetermined setting combination having a trade-off relationship, wherein the processing section , when the inspection speed and the precision are established, is configured to designate a specific option corresponding to the established inspection speed and the established precision among a plurality options for increasing the precision of the warpage compensation so that the specific option is applied, wherein options for increasing the precision of the distortion compensation include an offset compensation option, an ROI (region of interest) compensation option, an enhancement model option, wherein the offset compensation option is an option to compensate for distortion by correcting an offset after measuring solder, wherein the ROI compensation option is an option to compensate for distortion by correcting an inspection area or a region of interest ROI before measuring solder, wherein the enhancement model option is an option to compensate for distortion by increasing a pixel precision of a compensation model. a measuring section configured to obtain measurement data for at least a portion of a board ; a processing section configured to perform warpage compensation for the board by comparing the measurement data of the board and previously obtained reference data of the board , based on a plurality of feature objects set on the board , and inspect the board in which warpage is compensated; and a display section configured to display ranges for adjusting a first level of an inspection speed according to the warpage compensation and a second level of a precision of the warpage compensation; and an input section configured to receive, from a user, an input for the first level of the inspection speed and the second level of the precision as a predetermined setting combination having a trade-off relationship, wherein the processing section , when the inspection speed and the precision are established, is configured to designate a specific option corresponding to the established inspection speed and the established precision among a plurality options for increasing the precision of the warpage compensation so that the specific option is applied, wherein options for increasing the precision of the distortion compensation include an offset compensation option, an ROI (region of interest) compensation option, an enhancement model option, wherein the offset compensation option is an option to compensate for distortion by correcting an offset after measuring solder, wherein the ROI compensation option is an option to compensate for distortion by correcting an inspection area or a region of interest ROI before measuring solder, wherein the enhancement model option is an option to compensate for distortion by increasing a pixel precision of a compensation model. <EOS>