A method for collective bending of microelectronic components , including the following steps: ∘ making an initial structure , including: • a plurality of microelectronic components , having an upper face and a lower face , opposite to each other, spaced laterally apart from each other by a non-zero distance lt; • a same temporary handle substrate , made of a rigid material, which extends continuously opposite the microelectronic components , and to which all microelectronic components are assembled by their upper face ; ∘ providing a shaping support , having an upper face and an opposite lower face , the upper face including a plurality of bent surfaces surrounded by lateral walls ; ∘ depositing an adhesive interlayer covering the lower face of the microelectronic components or the upper face of the shaping support ; ∘ affixing the initial structure onto the shaping support , so that the microelectronic components rest and adhere at the level of a bearing area of their lower face over an upper surface of the lateral walls ; ∘ removing the temporary handle substrate ; ∘ bending the microelectronic components , so that they are curved, and adhere over the bent surfaces by the adhesive interlayer , the latter then being in contact with the lower face of each microelectronic component and of the corresponding bent surface ; ∘ cutting the set thus obtained, so as to individualise the microelectronic components , each then being assembled to a portion of the shaping support . ∘ making an initial structure , including: • a plurality of microelectronic components , having an upper face and a lower face , opposite to each other, spaced laterally apart from each other by a non-zero distance lt; • a same temporary handle substrate , made of a rigid material, which extends continuously opposite the microelectronic components , and to which all microelectronic components are assembled by their upper face ; • a plurality of microelectronic components , having an upper face and a lower face , opposite to each other, spaced laterally apart from each other by a non-zero distance lt; • a same temporary handle substrate , made of a rigid material, which extends continuously opposite the microelectronic components , and to which all microelectronic components are assembled by their upper face ; ∘ providing a shaping support , having an upper face and an opposite lower face , the upper face including a plurality of bent surfaces surrounded by lateral walls ; ∘ depositing an adhesive interlayer covering the lower face of the microelectronic components or the upper face of the shaping support ; ∘ affixing the initial structure onto the shaping support , so that the microelectronic components rest and adhere at the level of a bearing area of their lower face over an upper surface of the lateral walls ; ∘ removing the temporary handle substrate ; ∘ bending the microelectronic components , so that they are curved, and adhere over the bent surfaces by the adhesive interlayer , the latter then being in contact with the lower face of each microelectronic component and of the corresponding bent surface ; ∘ cutting the set thus obtained, so as to individualise the microelectronic components , each then being assembled to a portion of the shaping support . <EOS>