An OLED display panel, comprising: a display region comprising: a first protective layer , a flexible substrate , a substrate wiring layer , and a display element layer which are sequentially stacked and disposed, wherein the flexible substrate and the substrate wiring layer are extended toward a side of the display region ; a bending region being a first extending portion of the flexible substrate and the substrate wiring layer ; and a driving bonding region being a second extending portion of the flexible substrate and the substrate wiring layer , wherein the second extending portion is located outside the first extending portion; wherein the driving bonding region comprises: a driving chip disposed on a surface of the substrate wiring layer and configured to input a voltage to each pixel; a flexible circuit board configured to achieve a connection between the driving chip and a motherboard; and a reinforcing plate disposed on the surface of the substrate wiring layer of the driving bonding region and covering the surface of the substrate wiring layer of the driving bonding region , wherein a chamber is formed in a bottom portion of the reinforcing plate , and the driving chip is located in the chamber ; characterized in that a second opening is disposed in a side of the chamber of the reinforcing plate , the second opening is towards the driving chip and connected to an end of the flexible circuit board , and a top portion of the second opening is slightly higher than an upper surface of the flexible circuit board . a display region comprising: a first protective layer , a flexible substrate , a substrate wiring layer , and a display element layer which are sequentially stacked and disposed, wherein the flexible substrate and the substrate wiring layer are extended toward a side of the display region ; a bending region being a first extending portion of the flexible substrate and the substrate wiring layer ; and a driving bonding region being a second extending portion of the flexible substrate and the substrate wiring layer , wherein the second extending portion is located outside the first extending portion; wherein the driving bonding region comprises: a driving chip disposed on a surface of the substrate wiring layer and configured to input a voltage to each pixel; a flexible circuit board configured to achieve a connection between the driving chip and a motherboard; and a reinforcing plate disposed on the surface of the substrate wiring layer of the driving bonding region and covering the surface of the substrate wiring layer of the driving bonding region , wherein a chamber is formed in a bottom portion of the reinforcing plate , and the driving chip is located in the chamber ; characterized in that a second opening is disposed in a side of the chamber of the reinforcing plate , the second opening is towards the driving chip and connected to an end of the flexible circuit board , and a top portion of the second opening is slightly higher than an upper surface of the flexible circuit board . a driving chip disposed on a surface of the substrate wiring layer and configured to input a voltage to each pixel; a flexible circuit board configured to achieve a connection between the driving chip and a motherboard; and a reinforcing plate disposed on the surface of the substrate wiring layer of the driving bonding region and covering the surface of the substrate wiring layer of the driving bonding region , wherein a chamber is formed in a bottom portion of the reinforcing plate , and the driving chip is located in the chamber ; characterized in that a second opening is disposed in a side of the chamber of the reinforcing plate , the second opening is towards the driving chip and connected to an end of the flexible circuit board , and a top portion of the second opening is slightly higher than an upper surface of the flexible circuit board . <EOS>