An electronic device comprising: a display ; a sensor bonding layer ; and a fingerprint sensor disposed under a specified area of the display , wherein the fingerprint sensor is bonded to an inner surface of the display , through the sensor bonding layer , wherein at least a portion of the sensor bonding layer is expanded to at least a portion of a side surface of the fingerprint sensor and forms a first protrusion structure and a second protrusion structure to surround the at least a portion of the side surface of the fingerprint sensor , wherein the first protruding structure is in contact with a protective layer of the display and the second protruding structure is not in contact with the protective layer of the display , wherein the fingerprint sensor comprises an ultrasonic wave generating layer configured to generate an ultrasonic wave, wherein the first protrusion structure and the second protrusion structure are formed in a process of planarizing adhesive liquid of the sensor bonding layer , wherein the fingerprint sensor is electrically connected with circuitry provided inside the electronic device through a wiring part introduced in the side surface of the fingerprint sensor , the wiring part being disposed adjacent to the second protrusion structure , wherein the fingerprint sensor further comprises a metal layer and a planarizing layer , the planarizing layer being configured to planarize an air layer formed on a rear surface of the fingerprint sensor , wherein the first and second protrusion structures cover at least a portion of a side surface of the metal layer or the planarizing layer . a display ; a sensor bonding layer ; and a fingerprint sensor disposed under a specified area of the display , wherein the fingerprint sensor is bonded to an inner surface of the display , through the sensor bonding layer , wherein at least a portion of the sensor bonding layer is expanded to at least a portion of a side surface of the fingerprint sensor and forms a first protrusion structure and a second protrusion structure to surround the at least a portion of the side surface of the fingerprint sensor , wherein the first protruding structure is in contact with a protective layer of the display and the second protruding structure is not in contact with the protective layer of the display , wherein the fingerprint sensor comprises an ultrasonic wave generating layer configured to generate an ultrasonic wave, wherein the first protrusion structure and the second protrusion structure are formed in a process of planarizing adhesive liquid of the sensor bonding layer , wherein the fingerprint sensor is electrically connected with circuitry provided inside the electronic device through a wiring part introduced in the side surface of the fingerprint sensor , the wiring part being disposed adjacent to the second protrusion structure , wherein the fingerprint sensor further comprises a metal layer and a planarizing layer , the planarizing layer being configured to planarize an air layer formed on a rear surface of the fingerprint sensor , wherein the first and second protrusion structures cover at least a portion of a side surface of the metal layer or the planarizing layer . <EOS>