A lidless electronic package , comprising: a substrate having a surface ; a die disposed on the surface of the substrate, the die having an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface opposite the bottom surface; and a stiffener disposed on the surface of the substrate and that encloses at least a portion of the outside perimeter of the die, the stiffener including: a first surface that is at a first distance from the surface of the substrate, the first distance being greater than a distance between the surface of the substrate and the top surface of the die; a second surface that is disposed between the die and the first surface, the second surface being at a second distance from the surface of the substrate, wherein the second distance is less than the distance between the surface of the substrate and the top surface of the die; wherein the first surface is above the top surface of the die and the second surface is below the top surface of the die; characterised in that a recessed groove is disposed between the first surface and the second surface, the recessed groove including a third surface that is closer to the surface of the substrate than the second surface. a substrate having a surface ; a die disposed on the surface of the substrate, the die having an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface opposite the bottom surface; and a stiffener disposed on the surface of the substrate and that encloses at least a portion of the outside perimeter of the die, the stiffener including: a first surface that is at a first distance from the surface of the substrate, the first distance being greater than a distance between the surface of the substrate and the top surface of the die; a second surface that is disposed between the die and the first surface, the second surface being at a second distance from the surface of the substrate, wherein the second distance is less than the distance between the surface of the substrate and the top surface of the die; wherein the first surface is above the top surface of the die and the second surface is below the top surface of the die; characterised in that a recessed groove is disposed between the first surface and the second surface, the recessed groove including a third surface that is closer to the surface of the substrate than the second surface. a first surface that is at a first distance from the surface of the substrate, the first distance being greater than a distance between the surface of the substrate and the top surface of the die; a second surface that is disposed between the die and the first surface, the second surface being at a second distance from the surface of the substrate, wherein the second distance is less than the distance between the surface of the substrate and the top surface of the die; wherein the first surface is above the top surface of the die and the second surface is below the top surface of the die; characterised in that a recessed groove is disposed between the first surface and the second surface, the recessed groove including a third surface that is closer to the surface of the substrate than the second surface. <EOS>