A component mounting machine configured to mount components on a board (S), the component mounting machine comprising: a head configured to hold the component; a head moving device configured to move the head ; an imaging device provided to move together with the head by the head moving device and configured to image the board (S); and a control device configured to execute a lower component mounting operation for controlling the head and the head moving device so that a lower component is mounted on the board (S), an upper component mounting operation for controlling the head and the head moving device so that an upper component is mounted on the lower component mounted on the board (S), and a lower component mounting inspection operation for controlling the imaging device and the head moving device so as to image the board (S) on which the lower component is mounted and for performing a mounting inspection of the lower component based on a captured image of the board (S) after the lower component mounting operation is performed and before the upper component mounting operation is performed, characterized in that in a case where each of the upper components is mounted on different lower components among multiple lower components mounted on the board (S), the control device is configured to execute the lower component mounting inspection operation in an inspection mode selected from multiple inspection modes, including a first inspection mode in which the mounting inspection of the lower component located below the upper component of a mounting target is performed immediately before the upper component mounting operation of each of the upper components is performed as an execution timing of the lower component mounting inspection operation and a second inspection mode in which all mounting inspections of the multiple lower components are performed successively. a head configured to hold the component; a head moving device configured to move the head ; an imaging device provided to move together with the head by the head moving device and configured to image the board (S); and a control device configured to execute a lower component mounting operation for controlling the head and the head moving device so that a lower component is mounted on the board (S), an upper component mounting operation for controlling the head and the head moving device so that an upper component is mounted on the lower component mounted on the board (S), and a lower component mounting inspection operation for controlling the imaging device and the head moving device so as to image the board (S) on which the lower component is mounted and for performing a mounting inspection of the lower component based on a captured image of the board (S) after the lower component mounting operation is performed and before the upper component mounting operation is performed, characterized in that in a case where each of the upper components is mounted on different lower components among multiple lower components mounted on the board (S), the control device is configured to execute the lower component mounting inspection operation in an inspection mode selected from multiple inspection modes, including a first inspection mode in which the mounting inspection of the lower component located below the upper component of a mounting target is performed immediately before the upper component mounting operation of each of the upper components is performed as an execution timing of the lower component mounting inspection operation and a second inspection mode in which all mounting inspections of the multiple lower components are performed successively. <EOS>