A photovoltaic module, wherein the photovoltaic module comprises a plurality of surface mount multijunction photovoltaic cells mounted to an interconnection substrate; and wherein at least one of the plurality of surface mount multijunction photovoltaic cells comprises: a substrate having a front substrate surface and a back substrate surface; a heteroepitaxial layer overlying the front substrate surface; an antireflection coating overlying at least a first portion of the heteroepitaxial layer; a patterned cap region overlying a second portion of the heteroepitaxial layer and electrically connected to the heteroepitaxial layer; a front side metal pad overlying and electrically connected to the patterned cap region, wherein the front side metal pad comprises a bottom surface; a back surface solder pad underlying a portion of and electrically connected to the back substrate surface; a front surface solder pad underlying and insulated from the back substrate surface; a through-wafer-via formed through the substrate and heteroepitaxial layer interconnecting the front surface solder pad and the front side metal pad; a passivation layer underlying a portion of the back substrate surface and disposed on sidewalls of the through-wafer-via; wherein at least a portion of the antireflection coating overlying the at least first portion of the heteroepitaxial layer is disposed between the passivation layer on the sidewalls of the through-wafer-via and the patterned cap region and between the front side metal pad and the heteroepitaxial layer an optical adhesive overlying the front side metal pad, the patterned cap region, and the antireflection coating; a coverglass overlying the optical adhesive; wherein the interconnection substrate comprises: interconnects between each of the plurality of surface mount multijunction photovoltaic cells; and a plurality of bypass diodes, wherein each of the plurality of bypass diodes is interconnected to one or more of the plurality of surface mount multijunction photovoltaic cells, and wherein each of the plurality of bypass diodes is mounted to the interconnection substrate. a substrate having a front substrate surface and a back substrate surface; a heteroepitaxial layer overlying the front substrate surface; an antireflection coating overlying at least a first portion of the heteroepitaxial layer; a patterned cap region overlying a second portion of the heteroepitaxial layer and electrically connected to the heteroepitaxial layer; a front side metal pad overlying and electrically connected to the patterned cap region, wherein the front side metal pad comprises a bottom surface; a back surface solder pad underlying a portion of and electrically connected to the back substrate surface; a front surface solder pad underlying and insulated from the back substrate surface; a through-wafer-via formed through the substrate and heteroepitaxial layer interconnecting the front surface solder pad and the front side metal pad; a passivation layer underlying a portion of the back substrate surface and disposed on sidewalls of the through-wafer-via; wherein at least a portion of the antireflection coating overlying the at least first portion of the heteroepitaxial layer is disposed between the passivation layer on the sidewalls of the through-wafer-via and the patterned cap region and between the front side metal pad and the heteroepitaxial layer an optical adhesive overlying the front side metal pad, the patterned cap region, and the antireflection coating; a coverglass overlying the optical adhesive; interconnects between each of the plurality of surface mount multijunction photovoltaic cells; and a plurality of bypass diodes, wherein each of the plurality of bypass diodes is interconnected to one or more of the plurality of surface mount multijunction photovoltaic cells, and wherein each of the plurality of bypass diodes is mounted to the interconnection substrate. <EOS>