A patch antenna unit, the patch antenna unit includes: a first support layer , a substrate disposed on the first support layer in a stacked manner, a second support layer disposed on one side that is of the substrate and that is away from the first support layer, and an integrated circuit disposed on one side that is of the second support layer and that is away from the substrate, wherein a first radiation patch is attached to one side that is of the first support layer and that is away from the substrate; a second radiation patch is attached to one side that is of the substrate and that is away from the second support layer, and the first radiation patch and the second radiation patch are center-aligned; a first ground layer is disposed on one side that is of the second support layer and that faces the substrate, a coupling slot is disposed on the first ground layer, a feeder coupled to the first radiation patch and the second radiation patch by means of the coupling slot is disposed on one side that is of the second support layer and that is away from the substrate; and the integrated circuit is electrically connected to the first ground layer and the feeder; and a second ground layer that is disposed on the first support layer and that is disposed on the same layer as the first radiation patch and surrounding the first radiation patch, a first slot is disposed between the second ground layer and the first radiation patch, and the second ground layer is electrically connected to the first ground layer; wherein the first support layer, the substrate and the second support layer are made from resin materials. a substrate disposed on the first support layer in a stacked manner, a second support layer disposed on one side that is of the substrate and that is away from the first support layer, and an integrated circuit disposed on one side that is of the second support layer and that is away from the substrate, wherein a first radiation patch is attached to one side that is of the first support layer and that is away from the substrate; a second radiation patch is attached to one side that is of the substrate and that is away from the second support layer, and the first radiation patch and the second radiation patch are center-aligned; a first ground layer is disposed on one side that is of the second support layer and that faces the substrate, a coupling slot is disposed on the first ground layer, a feeder coupled to the first radiation patch and the second radiation patch by means of the coupling slot is disposed on one side that is of the second support layer and that is away from the substrate; and the integrated circuit is electrically connected to the first ground layer and the feeder; and a second ground layer that is disposed on the first support layer and that is disposed on the same layer as the first radiation patch and surrounding the first radiation patch, a first slot is disposed between the second ground layer and the first radiation patch, and the second ground layer is electrically connected to the first ground layer; wherein the first support layer, the substrate and the second support layer are made from resin materials. <EOS>