A fingerprint recognition system, comprising: a touch detection module , a control module and a fingerprint sensor ; wherein the fingerprint sensor comprises: a sensor die , comprising a detection electrode, which is configured to collect fingerprint information; and a package structure , configured to package the sensor die ; wherein the package structure comprises a first metal electrode , the first metal electrode is connected with the touch detection module , and the touch detection module is connected with the control module and is configured to feed back a touch signal to the control module , so as to enable the control module to supply power to the fingerprint sensor according to the touch signal, and then enable the sensor die to collect fingerprint information; wherein the package structure further comprises a plastic packaging material and a substrate , wherein the plastic packaging material is located above or covers the sensor die ; and the sensor die is located on the substrate , a second metal electrode , wherein the second metal electrode is located at a periphery of the first metal electrode ; and the second metal electrode is connected with a grounding end of the fingerprint sensor and located in the substrate ; wherein the first metal electrode is located in the plastic packaging material; or the first metal electrode is located in the substrate . a touch detection module , a control module and a fingerprint sensor ; wherein the fingerprint sensor comprises: a sensor die , comprising a detection electrode, which is configured to collect fingerprint information; and a package structure , configured to package the sensor die ; wherein the package structure comprises a first metal electrode , the first metal electrode is connected with the touch detection module , and the touch detection module is connected with the control module and is configured to feed back a touch signal to the control module , so as to enable the control module to supply power to the fingerprint sensor according to the touch signal, and then enable the sensor die to collect fingerprint information; wherein the package structure further comprises a plastic packaging material and a substrate , wherein the plastic packaging material is located above or covers the sensor die ; and the sensor die is located on the substrate , a second metal electrode , wherein the second metal electrode is located at a periphery of the first metal electrode ; and the second metal electrode is connected with a grounding end of the fingerprint sensor and located in the substrate ; a sensor die , comprising a detection electrode, which is configured to collect fingerprint information; and a package structure , configured to package the sensor die ; wherein the package structure comprises a first metal electrode , the first metal electrode is connected with the touch detection module , and the touch detection module is connected with the control module and is configured to feed back a touch signal to the control module , so as to enable the control module to supply power to the fingerprint sensor according to the touch signal, and then enable the sensor die to collect fingerprint information; wherein the package structure further comprises a plastic packaging material and a substrate , wherein the plastic packaging material is located above or covers the sensor die ; and the sensor die is located on the substrate , a second metal electrode , wherein the second metal electrode is located at a periphery of the first metal electrode ; and the second metal electrode is connected with a grounding end of the fingerprint sensor and located in the substrate ; wherein the first metal electrode is located in the plastic packaging material; <EOS>