A module for insertion in a fluid-flow-through cooled chassis , the module comprising a conduction-cooled card assembly and an adaptor frame mounted thereon, wherein the card assembly comprises: a primary card , a secondary card and a conduction cooling frame , the primary card comprising a motherboard connector for establishing a connection with a motherboard of the chassis , the primary card and secondary card being both mounted to the conduction cooling frame with a cavity formed between them, the conduction cooling frame including thermal management interfaces on opposite sides of the conduction cooling frame; and wherein the adaptor frame comprises: first and second thermally conductive portions to engage the respective thermal management interfaces for conduction of heat from the thermal management interfaces to the first and second thermally conductive portions, whereby the first and second thermally conductive portions comprise first and second openings on either side, respectively; and the adaptor frame further comprises a passageway extending between the first and second openings in the adaptor frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening for dissipation of heat conducted to the first and second thermally conductive portions; wherein the module is arranged to be removably installable between opposing interior walls of the chassis so that the first and second openings mate with corresponding openings on the opposing interior walls of the chassis when the module is installed in the chassis; whereby the first and second thermally conductive portions of the adapter frame are tapered such that the one end of the adapter frame that is further away from the motherboard connector is wider than the other end of the frame that is closer to the motherboard connectors , thus creating a force that holds the module in place within the chassis . a primary card , a secondary card and a conduction cooling frame , the primary card comprising a motherboard connector for establishing a connection with a motherboard of the chassis , the primary card and secondary card being both mounted to the conduction cooling frame with a cavity formed between them, the conduction cooling frame including thermal management interfaces on opposite sides of the conduction cooling frame; and first and second thermally conductive portions to engage the respective thermal management interfaces for conduction of heat from the thermal management interfaces to the first and second thermally conductive portions, whereby the first and second thermally conductive portions comprise first and second openings on either side, respectively; and the adaptor frame further comprises a passageway extending between the first and second openings in the adaptor frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening for dissipation of heat conducted to the first and second thermally conductive portions; wherein the module is arranged to be removably installable between opposing interior walls of the chassis so that the first and second openings mate with corresponding openings on the opposing interior walls of the chassis when the module is installed in the chassis; whereby the first and second thermally conductive portions of the adapter frame are tapered such that the one end of the adapter frame that is further away from the motherboard connector is wider than the other end of the frame that is closer to the motherboard connectors , thus creating a force that holds the module in place within the chassis . <EOS>