A power device for surface mounting, comprising: a leadframe including a die-attach support and at least one first lead and one second lead ; a die , of semiconductor material, bonded to the die-attach support; a package , of insulating material and having a parallelepipedal shape, with a first lateral surface , a second lateral surface , a first base and a second base , the first and second lateral surfaces defining a package height (H1), the package surrounding the die and at least in part the die-attach support , wherein the first and second leads have outer portions extending outside the package, respectively from the first lateral surface and from the second lateral surface of the package, the outer portions of the leads having lead heights (H2) greater than the package height (H1), extending throughout the height of the package, and having respective portions projecting from the first base , the first and second lateral surfaces are opposite to each other and not contiguous, the power device forms a three-terminal device including a first terminal (S), a second terminal (D), and a third terminal (G), wherein the first terminal (S) is coupled to the first lead , the second terminal (D) is coupled to the second lead , and the third terminal (G) is coupled to a third lead having an own outer portion; the outer portion of the second lead forms a bar extending generally perpendicular to the first base and to the second base of the package and generally parallel to and along the second lateral surface , and the outer portions of the first and third leads are formed by laminas projecting from the first lateral surface generally perpendicular to the first and second bases of the package , at a distance from each other. a leadframe including a die-attach support and at least one first lead and one second lead ; a die , of semiconductor material, bonded to the die-attach support; a package , of insulating material and having a parallelepipedal shape, with a first lateral surface , a second lateral surface , a first base and a second base , the first and second lateral surfaces defining a package height (H1), the package surrounding the die and at least in part the die-attach support , wherein the first and second leads have outer portions extending outside the package, respectively from the first lateral surface and from the second lateral surface of the package, the outer portions of the leads having lead heights (H2) greater than the package height (H1), extending throughout the height of the package, and having respective portions projecting from the first base , the first and second lateral surfaces are opposite to each other and not contiguous, the power device forms a three-terminal device including a first terminal (S), a second terminal (D), and a third terminal (G), wherein the first terminal (S) is coupled to the first lead , the second terminal (D) is coupled to the second lead , and the third terminal (G) is coupled to a third lead having an own outer portion; the outer portion of the second lead forms a bar extending generally perpendicular to the first base and to the second base of the package and generally parallel to and along the second lateral surface , and the outer portions of the first and third leads are formed by laminas projecting from the first lateral surface generally perpendicular to the first and second bases of the package , at a distance from each other. <EOS>