A flip-chip bonding device, comprising: a supply unit , configured to separate a flip-chip from a carrier and to supply the flip-chip , the supply unit comprising a flipping device for picking up and flipping over the flip-chip separated from the carrier so that the flip-chip is turned downside up; a transfer unit configured to receive and retain the flip-chip from the flipping device , the transfer unit being able to retain multiple flip-chips ; a position adjustment unit , configured to adjust positions of the flip-chips on the transfer unit , wherein the position adjustment unit comprises a first measurement system and a position adjustment device , the first measurement system configured to measure the positions of the flip-chips on the transfer unit , the position adjustment device configured to adjust the positions of the flip-chips on the transfer unit ; a bonding unit , configured to bond the flip-chips on the transfer unit onto a substrate ; a transportation unit , configured to transport the transfer unit in a horizontal X-direction; and a control unit , configured to control movements of the respective units , wherein the supply unit , the position adjustment unit and the bonding unit are disposed sequentially along the horizontal X-direction, wherein the position adjustment device comprises a support mechanism , a first moving mechanism and a first absorption mechanism , the support mechanism configured to support the first moving mechanism , the first moving mechanism configured to move the first absorption mechanism to a location corresponding to one of the flip-chips on the transfer unit , the first absorption mechanism configured to absorb the flip-chip from the transfer unit . a supply unit , configured to separate a flip-chip from a carrier and to supply the flip-chip , the supply unit comprising a flipping device for picking up and flipping over the flip-chip separated from the carrier so that the flip-chip is turned downside up; a transfer unit configured to receive and retain the flip-chip from the flipping device , the transfer unit being able to retain multiple flip-chips ; a position adjustment unit , configured to adjust positions of the flip-chips on the transfer unit , wherein the position adjustment unit comprises a first measurement system and a position adjustment device , the first measurement system configured to measure the positions of the flip-chips on the transfer unit , the position adjustment device configured to adjust the positions of the flip-chips on the transfer unit ; a bonding unit , configured to bond the flip-chips on the transfer unit onto a substrate ; a transportation unit , configured to transport the transfer unit in a horizontal X-direction; and a control unit , configured to control movements of the respective units , wherein the supply unit , the position adjustment unit and the bonding unit are disposed sequentially along the horizontal X-direction, wherein the position adjustment device comprises a support mechanism , a first moving mechanism and a first absorption mechanism , the support mechanism configured to support the first moving mechanism , the first moving mechanism configured to move the first absorption mechanism to a location corresponding to one of the flip-chips on the transfer unit , the first absorption mechanism configured to absorb the flip-chip from the transfer unit . <EOS>