mhurhangee/patent-ind-claim-en huggingface dataset:
A retractable center feed injection device for use on a coke drum comprising: a housing configured to couple to a sidewall of a coke drum in alignment with a first opening in the sidewall; an injection nozzle contained within the housing , the injection nozzle having a first end and a second end, the injection nozzle being configured to slide between a retracted position and an extended position in which the first end extends into the coke drum ; and an actuator that is coupled to the second end of the injection nozzle and configured to slide the injection nozzle between the retracted position and the extended position; a feed inlet configured to couple to the sidewall of the coke drum in alignment with a second opening in the sidewall, the second opening being opposite the first opening , the first end of the injection nozzle coupling with the feed inlet when the injection nozzle is in the extended position; and wherein the injection nozzle includes a chamber having an inlet opening (202a1) that aligns with the feed inlet and one or more outlet openings (202a2, 202a3) that are oriented upwardly such that the residual oil fed through the feed inlet when the injection nozzle is in the extended position flows into the chamber through the inlet opening (202a1) and out of the chamber through the one or more outlet openings (202a2, 202a3) with no residual oil passing through the housing . a housing configured to couple to a sidewall of a coke drum in alignment with a first opening in the sidewall; an injection nozzle contained within the housing , the injection nozzle having a first end and a second end, the injection nozzle being configured to slide between a retracted position and an extended position in which the first end extends into the coke drum ; and an actuator that is coupled to the second end of the injection nozzle and configured to slide the injection nozzle between the retracted position and the extended position; a feed inlet configured to couple to the sidewall of the coke drum in alignment with a second opening in the sidewall, the second opening being opposite the first opening , the first end of the injection nozzle coupling with the feed inlet when the injection nozzle is in the extended position; and wherein the injection nozzle includes a chamber having an inlet opening (202a1) that aligns with the feed inlet and one or more outlet openings (202a2, 202a3) that are oriented upwardly such that the residual oil fed through the feed inlet when the injection nozzle is in the extended position flows into the chamber through the inlet opening (202a1) and out of the chamber through the one or more outlet openings (202a2, 202a3) with no residual oil passing through the housing .
A clock generator , comprising: a multi-phase controllable oscillator , having a plurality of phase nodes (P[i]) at which a plurality of clock signals (CKOUT[i]) with a plurality of different phases are generated, respectively, the multi-phase controllable oscillator comprising: a plurality of oscillator core circuits (122[i]), each comprising: a resistive component , coupled between a first phase node and a second phase node of the multi-phase controllable oscillator , wherein clock signals generated at the first phase node and the second phase node have adjacent phases of the multi-phase controllable oscillator; and an inverter , configured to receive an input feedback clock signal from one phase node of the multi-phase controllable oscillator , and generate an output feedback clock signal to the second phase node according to the input feedback clock signal; wherein resistive components (202[n]) of the oscillator core circuits are cascaded in a ring configuration, characterized in that the entirety of inverters of the plurality of oscillator core circuits (122[i]) are connected in series. a multi-phase controllable oscillator , having a plurality of phase nodes (P[i]) at which a plurality of clock signals (CKOUT[i]) with a plurality of different phases are generated, respectively, the multi-phase controllable oscillator comprising: a plurality of oscillator core circuits (122[i]), each comprising: a resistive component , coupled between a first phase node and a second phase node of the multi-phase controllable oscillator , wherein clock signals generated at the first phase node and the second phase node have adjacent phases of the multi-phase controllable oscillator; and an inverter , configured to receive an input feedback clock signal from one phase node of the multi-phase controllable oscillator , and generate an output feedback clock signal to the second phase node according to the input feedback clock signal; a resistive component , coupled between a first phase node and a second phase node of the multi-phase controllable oscillator , wherein clock signals generated at the first phase node and the second phase node have adjacent phases of the multi-phase controllable oscillator; and an inverter , configured to receive an input feedback clock signal from one phase node of the multi-phase controllable oscillator , and generate an output feedback clock signal to the second phase node according to the input feedback clock signal; wherein resistive components (202[n]) of the oscillator core circuits are cascaded in a ring configuration, characterized in that the entirety of inverters of the plurality of oscillator core circuits (122[i]) are connected in series.
A power connection device for a printed circuit board with - a first connecting element , which has an outer contact surface , which can be inserted into a corresponding contact opening of the printed circuit board , and an inner sliding surface , and with - a second connecting element having a thorn-shaped section with an outer sliding surface , which presses the inner sliding surface of the first connecting element inserted into the contact opening of the printed circuit board outwardly to establish an electrical contact between the contact surface of the first connecting element and a contact surface of the contact opening of the printed circuit board , as soon as the outer sliding surface of the thorn-shaped section of the second connecting element is pressed against the inner sliding surface of the first connecting element , characterized in that a predetermined breaking connection is arranged between the thorn-shaped section of the second connecting element and the first connecting element , which breaks open as soon as the thorn-shaped section of the second connecting element is pressed into the first connecting element . - a first connecting element , which has an outer contact surface , which can be inserted into a corresponding contact opening of the printed circuit board , and an inner sliding surface , and with - a second connecting element having a thorn-shaped section with an outer sliding surface , which presses the inner sliding surface of the first connecting element inserted into the contact opening of the printed circuit board outwardly to establish an electrical contact between the contact surface of the first connecting element and a contact surface of the contact opening of the printed circuit board , as soon as the outer sliding surface of the thorn-shaped section of the second connecting element is pressed against the inner sliding surface of the first connecting element ,
A method, comprising: - obtaining depth data indicative of a time-resolved measurement of a 3-D position of a moveable target in a field-of-view of a depth sensor , and - processing the depth data using an interacting multi-model, IMM, tracking algorithm , the IMM tracking algorithm providing, for each one of multiple iterations , tracking data comprising a respective estimate of the 3-D position of the moveable target , wherein the IMM tracking algorithm comprises a first model providing a first output , a second model providing a second output , and a fusion module fusing the first output and the second output to thereby provide the tracking data , wherein the first model models a movement state of the moveable target , wherein the second model models a rest state of the moveable target , wherein the second model determines the second output based on the estimate of the 3-D position of the moveable target with respect to one or more input elements (111-113) of a user interface predefined within the field-of-view , wherein the moveable target is selected from the group consisting of: hand; part of a hand; and handheld pointing device. - obtaining depth data indicative of a time-resolved measurement of a 3-D position of a moveable target in a field-of-view of a depth sensor , and - processing the depth data using an interacting multi-model, IMM, tracking algorithm , the IMM tracking algorithm providing, for each one of multiple iterations , tracking data comprising a respective estimate of the 3-D position of the moveable target , wherein the IMM tracking algorithm comprises a first model providing a first output , a second model providing a second output , and a fusion module fusing the first output and the second output to thereby provide the tracking data , wherein the first model models a movement state of the moveable target , wherein the second model models a rest state of the moveable target , wherein the second model determines the second output based on the estimate of the 3-D position of the moveable target with respect to one or more input elements (111-113) of a user interface predefined within the field-of-view , wherein the moveable target is selected from the group consisting of: hand; part of a hand; and handheld pointing device.
An optic and an optical mount for mounting the optic, wherein the optic is a disk having a first surface, a second surface opposite the first surface, a perimeter having a thickness, and a central axis perpendicular to the first surface of the disk, the optical mount comprising: at least one restraining element for the optic having at least one discrete contact point adjacent to the perimeter of the optic and configured to make contact on the first surface of the optic at the periphery; and at least one force element having at least one discrete contact point adjacent to the perimeter of the optic and configured to make contact on the second surface of the optic at the periphery, wherein each discrete contact point to make contact on the first surface of the optic has a corresponding discrete contact point to make contact on the second surface of the optic at substantially the same radial location, so that the pressure between restraining element and force element maintains the optic in one dimension along the central axis, wherein the at least one restraining element further includes a lateral force generating element which applies lateral force in order to have the optic rest on kinematic contact points maintained in the remaining restraining elements. at least one restraining element for the optic having at least one discrete contact point adjacent to the perimeter of the optic and configured to make contact on the first surface of the optic at the periphery; and at least one force element having at least one discrete contact point adjacent to the perimeter of the optic and configured to make contact on the second surface of the optic at the periphery, wherein each discrete contact point to make contact on the first surface of the optic has a corresponding discrete contact point to make contact on the second surface of the optic at substantially the same radial location, so that the pressure between restraining element and force element maintains the optic in one dimension along the central axis, wherein the at least one restraining element further includes a lateral force generating element which applies lateral force in order to have the optic rest on kinematic contact points maintained in the remaining restraining elements.
A communication device (102; 202; 302) comprising: a millimetre wave antenna arrangement comprising a distributed millimetre wave antenna radiating element and a corresponding fixed millimetre wave antenna radiating element ; a Radio Frequency Integrated Circuit (118; 207; 408); a first substrate , wherein the first substrate is a rigid substrate, and the fixed millimetre wave antenna radiating element and the Radio Frequency Integrated Circuit are arranged on opposite sides of the first substrate ; a second substrate (122; 124) spaced apart from the first substrate , wherein the distributed millimetre wave antenna radiating element is arranged on the second substrate (122; 124); and a flexible transmission line , connecting the second substrate (122; 124) to the first substrate , the flexible transmission line is configured to transmit signals between the Radio Frequency Integrated Circuit on the first substrate and the distributed millimetre wave antenna radiating element on the second substrate (122; 124); and a switching arrangement configured to selectively connect either the distributed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit (118; 208; 408) by the flexible transmission line , or the fixed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit (118; 207; 408). a millimetre wave antenna arrangement comprising a distributed millimetre wave antenna radiating element and a corresponding fixed millimetre wave antenna radiating element ; a Radio Frequency Integrated Circuit (118; 207; 408); a first substrate , wherein the first substrate is a rigid substrate, and the fixed millimetre wave antenna radiating element and the Radio Frequency Integrated Circuit are arranged on opposite sides of the first substrate ; a second substrate (122; 124) spaced apart from the first substrate , wherein the distributed millimetre wave antenna radiating element is arranged on the second substrate (122; 124); and a flexible transmission line , connecting the second substrate (122; 124) to the first substrate , the flexible transmission line is configured to transmit signals between the Radio Frequency Integrated Circuit on the first substrate and the distributed millimetre wave antenna radiating element on the second substrate (122; 124); and a switching arrangement configured to selectively connect either the distributed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit (118; 208; 408) by the flexible transmission line , or the fixed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit (118; 207; 408).
Inflatable component usable during service and/or installation of a wind turbine module , comprising - an inflation structure with an air tight shell and - a sealable passage in the inflation structure for ingress or discharge of air into or from the air tight shell for inflating or deflating the inflation structure , wherein the inflation structure is dimensioned to provide a thermal and/or physical barrier in respect of external fluids and/or physical objects or particles acting upon the inflation structure in case the inflation structure is inflated and inserted in a hollow section of the wind turbine module characterised in that the inflatable component is built substantially from a deformable material. comprising - an inflation structure with an air tight shell and - a sealable passage in the inflation structure for ingress or discharge of air into or from the air tight shell for inflating or deflating the inflation structure , - an inflation structure with an air tight shell and - a sealable passage in the inflation structure for ingress or discharge of air into or from the air tight shell for inflating or deflating the inflation structure , wherein the inflation structure is dimensioned to provide a thermal and/or physical barrier in respect of external fluids and/or physical objects or particles acting upon the inflation structure in case the inflation structure is inflated and inserted in a hollow section of the wind turbine module characterised in that the inflatable component is built substantially from a deformable material.
A method of forming a ceramic from steel slag, comprising: milling steel slag exhibiting a diameter of 5 mm of less to form powder; sieving said powder to retain said powder having a particle size in the range of 20 μm to 400 μm; removing free iron from said powder with a magnet; heat treating said powder at a temperature in the range of 700 °C to 1200 °C for a time period in the range of 1 hour to 10 hours and oxidizing retained iron in said powder; compacting said powder at a compression pressure in the range of 20 MPa to 300 MPa; and sintering said powder at a temperature in the range of 700 °C to 1400 °C for a time period in the range of 0.5 hours to 4 hours to provide a ceramic. milling steel slag exhibiting a diameter of 5 mm of less to form powder; sieving said powder to retain said powder having a particle size in the range of 20 μm to 400 μm; removing free iron from said powder with a magnet; heat treating said powder at a temperature in the range of 700 °C to 1200 °C for a time period in the range of 1 hour to 10 hours and oxidizing retained iron in said powder; compacting said powder at a compression pressure in the range of 20 MPa to 300 MPa; and sintering said powder at a temperature in the range of 700 °C to 1400 °C for a time period in the range of 0.5 hours to 4 hours to provide a ceramic.
A method (M) for manufacturing a fibre metal laminate part , comprising: placing (M1) multiple metal sheets and fibre reinforced plastic plies above one another, the metal sheets being made of AlMgSc alloy and the fibre reinforced plastic plies comprising a thermoplastic matrix material; heating (M2) the metal sheets and the fibre reinforced plastic plies to temperature in a first temperature range to transfer the thermoplastic matrix material of the fibre reinforced plastic plies to a viscous state; pressing (M3) together the heated metal sheets and fibre reinforced plastic plies ; and at least partially solidifying (M4) the thermoplastic matrix material of the fibre reinforced plastic plies by applying a temperature in a second temperature range to the metal sheets and the fibre reinforced plastic plies ; characterized in that the method (M) further includes a preparatory step (M0) in which a surface texture is generated on the metal sheets by at least laser structuring. placing (M1) multiple metal sheets and fibre reinforced plastic plies above one another, the metal sheets being made of AlMgSc alloy and the fibre reinforced plastic plies comprising a thermoplastic matrix material; heating (M2) the metal sheets and the fibre reinforced plastic plies to temperature in a first temperature range to transfer the thermoplastic matrix material of the fibre reinforced plastic plies to a viscous state; pressing (M3) together the heated metal sheets and fibre reinforced plastic plies ; and at least partially solidifying (M4) the thermoplastic matrix material of the fibre reinforced plastic plies by applying a temperature in a second temperature range to the metal sheets and the fibre reinforced plastic plies ; characterized in that the method (M) further includes a preparatory step (M0) in which a surface texture is generated on the metal sheets by at least laser structuring.
A packaged integrated circuit, IC, comprising: an IC die ; a package body encapsulating the IC die, the package body defining a top surface and a bottom surface , and having a thickness dimension between the top and the bottom surfaces, a length dimension , and a width dimension , wherein the length dimension is at least 1.5 times greater than the width dimension, and wherein the length dimension includes a first end and a second end; and a plurality of leadless surface-mount electrical contacts on the bottom surface, including a first cluster of contacts situated proximate the first end and a second cluster of contacts situated proximate the second end, wherein at least a portion of the plurality of leadless surface-mount electrical contacts are electrically coupled to the die, and wherein the electrical contacts of the first cluster are arranged as a first band having a major dimension along the width dimension of the package body and a minor dimension along the length of the package body, wherein the package body has no electrical contacts on the bottom surface between the first cluster and the second cluster to define a span portion (C) of the IC, wherein a ratio of the span portion (C) to the length 2. (L) of the package is between 0.40 and 0.90; and wherein the length and width dimensions of the package body and the span portion cause the package body to undergo cylindrical warpage with deformation of the span portion when the IC is subjected to a reflow soldering process. an IC die ; a package body encapsulating the IC die, the package body defining a top surface and a bottom surface , and having a thickness dimension between the top and the bottom surfaces, a length dimension , and a width dimension , wherein the length dimension is at least 1.5 times greater than the width dimension, and wherein the length dimension includes a first end and a second end; and a plurality of leadless surface-mount electrical contacts on the bottom surface, including a first cluster of contacts situated proximate the first end and a second cluster of contacts situated proximate the second end, wherein at least a portion of the plurality of leadless surface-mount electrical contacts are electrically coupled to the die, and wherein the electrical contacts of the first cluster are arranged as a first band having a major dimension along the width dimension of the package body and a minor dimension along the length of the package body, wherein the package body has no electrical contacts on the bottom surface between the first cluster and the second cluster to define a span portion (C) of the IC, wherein a ratio of the span portion (C) to the length 2. (L) of the package is between 0.40 and 0.90; and wherein the length and width dimensions of the package body and the span portion cause the package body to undergo cylindrical warpage with deformation of the span portion when the IC is subjected to a reflow soldering process.