A fingerprint sensing device , characterized by : a flexible substrate unit including a first flexible substrate , a double-sided flexible substrate , and a second flexible substrate which are stacked from top to bottom, said double-sided substrate having a first surface adjacent to said first flexible substrate , and a second surface adjacent to said second flexible substrate ; a sensing unit including a plurality of first strip electrodes that are disposed on said first surface and that are disposed between said first flexible substrate and said double-sided substrate , a plurality of second strip electrodes that are disposed on said second surface and that are disposed between said double-sided substrate and said second flexible substrate , a plurality of first electroconductive pads disposed on a bottom surface of said first flexible substrate , and a plurality of connecting pads and a plurality of second electroconductive pads disposed on a top surface of said second flexible substrate , said first strip electrodes being upwardly connected to said first electroconductive pads , said first electroconductive pads being downwardly connected to said connecting pads , said second strip electrodes being downwardly connected to said second electroconductive pads ; and a chip unit that is disposed on said second flexible substrate and that is electrically connected to said connecting pads and said second electroconductive pads . a flexible substrate unit including a first flexible substrate , a double-sided flexible substrate , and a second flexible substrate which are stacked from top to bottom, said double-sided substrate having a first surface adjacent to said first flexible substrate , and a second surface adjacent to said second flexible substrate ; a sensing unit including a plurality of first strip electrodes that are disposed on said first surface and that are disposed between said first flexible substrate and said double-sided substrate , a plurality of second strip electrodes that are disposed on said second surface and that are disposed between said double-sided substrate and said second flexible substrate , a plurality of first electroconductive pads disposed on a bottom surface of said first flexible substrate , and a plurality of connecting pads and a plurality of second electroconductive pads disposed on a top surface of said second flexible substrate , said first strip electrodes being upwardly connected to said first electroconductive pads , said first electroconductive pads being downwardly connected to said connecting pads , said second strip electrodes being downwardly connected to said second electroconductive pads ; and a plurality of first strip electrodes that are disposed on said first surface and that are disposed between said first flexible substrate and said double-sided substrate , a plurality of second strip electrodes that are disposed on said second surface and that are disposed between said double-sided substrate and said second flexible substrate , a plurality of first electroconductive pads disposed on a bottom surface of said first flexible substrate , and a plurality of connecting pads and a plurality of second electroconductive pads disposed on a top surface of said second flexible substrate , said first strip electrodes being upwardly connected to said first electroconductive pads , said first electroconductive pads being downwardly connected to said connecting pads , said second strip electrodes being downwardly connected to said second electroconductive pads ; and a chip unit that is disposed on said second flexible substrate and that is electrically connected to said connecting pads and said second electroconductive pads . <EOS>