A device, comprising: an acoustic probe having a plurality of acoustic array components (11-1, 11-2, 100-1, 100-2) separated and spaced apart from each other, each of the acoustic array components comprising: an array of acoustic element circuits disposed contiguous to each other at a first pitch in at least a first direction, wherein pitch is an average spacing between the centers of two elements disposed closest to each other; a plurality of pads each corresponding to one of the acoustic element circuits and formed within a circuitry area of the corresponding acoustic element circuit, the pads being arranged at a second pitch in at least the first direction; a plurality of interconnection bumps each corresponding to one of the pads and being disposed on and in electrical contact with the corresponding pad, wherein the interconnection bumps are disposed at a third pitch in at least the first direction; and a plurality of acoustic transducer elements disposed on the interconnection bumps, wherein the acoustic transducer elements are disposed at a fourth pitch in at least the first direction, wherein at least two of the first, second, third, and fourth pitches are different than each other, and wherein each of the interconnection bumps is electrically conductive and provides the electrical connection between the corresponding pad and the corresponding acoustic transducer element. an acoustic probe having a plurality of acoustic array components (11-1, 11-2, 100-1, 100-2) separated and spaced apart from each other, each of the acoustic array components comprising: an array of acoustic element circuits disposed contiguous to each other at a first pitch in at least a first direction, wherein pitch is an average spacing between the centers of two elements disposed closest to each other; a plurality of pads each corresponding to one of the acoustic element circuits and formed within a circuitry area of the corresponding acoustic element circuit, the pads being arranged at a second pitch in at least the first direction; a plurality of interconnection bumps each corresponding to one of the pads and being disposed on and in electrical contact with the corresponding pad, wherein the interconnection bumps are disposed at a third pitch in at least the first direction; and a plurality of acoustic transducer elements disposed on the interconnection bumps, wherein the acoustic transducer elements are disposed at a fourth pitch in at least the first direction, an array of acoustic element circuits disposed contiguous to each other at a first pitch in at least a first direction, wherein pitch is an average spacing between the centers of two elements disposed closest to each other; a plurality of pads each corresponding to one of the acoustic element circuits and formed within a circuitry area of the corresponding acoustic element circuit, the pads being arranged at a second pitch in at least the first direction; a plurality of interconnection bumps each corresponding to one of the pads and being disposed on and in electrical contact with the corresponding pad, wherein the interconnection bumps are disposed at a third pitch in at least the first direction; and a plurality of acoustic transducer elements disposed on the interconnection bumps, wherein the acoustic transducer elements are disposed at a fourth pitch in at least the first direction, wherein at least two of the first, second, third, and fourth pitches are different than each other, and wherein each of the interconnection bumps is electrically conductive and provides the electrical connection between the corresponding pad and the corresponding acoustic transducer element. <EOS>