A method for manufacturing a circuit board including a wiring board that has a hole in which a body portion of a component is disposed in an inserted state, the method comprising: inserting either first claws or second claws through notches formed by notching one position or a plurality of positions of each of two facing edges included in edges of the hole , the first claws and the second claws being provided on two facing wall portions of a cover member that covers the body portion from a soldering surface side, the first claws and the second claws projecting outward from the two facing wall portions ; holding the cover member on the wiring board , by sliding the cover member relative to the wiring board in a direction along a component mounting surface of the wiring board to position the two facing edges of the hole between the first claws and the second claws provided on a surface of the two facing wall portions identical to a surface on which the first claws are provided; inserting the body portion into the hole , and disposing electrode terminals of the component on the wiring board , wherein attachment holes are formed in the wiring board , and each of the electrode terminals being inserted through one of the attachment holes and projecting from the attachment hole toward the soldering surface side and electrically connected, by solder, with a solder connection portion provided on the soldering surface side of the wiring board ; applying solder, by flow soldering, to the wiring board on which the cover member is held; and detaching the cover member from the wiring board , by sliding the cover member relative to the wiring board to which solder has been applied to shift the first claws from the component mounting surface side to the soldering surface side with the first claws passing through the notches . inserting either first claws or second claws through notches formed by notching one position or a plurality of positions of each of two facing edges included in edges of the hole , the first claws and the second claws being provided on two facing wall portions of a cover member that covers the body portion from a soldering surface side, the first claws and the second claws projecting outward from the two facing wall portions ; holding the cover member on the wiring board , by sliding the cover member relative to the wiring board in a direction along a component mounting surface of the wiring board to position the two facing edges of the hole between the first claws and the second claws provided on a surface of the two facing wall portions identical to a surface on which the first claws are provided; inserting the body portion into the hole , and disposing electrode terminals of the component on the wiring board , wherein attachment holes are formed in the wiring board , and each of the electrode terminals being inserted through one of the attachment holes and projecting from the attachment hole toward the soldering surface side and electrically connected, by solder, with a solder connection portion provided on the soldering surface side of the wiring board ; applying solder, by flow soldering, to the wiring board on which the cover member is held; and detaching the cover member from the wiring board , by sliding the cover member relative to the wiring board to which solder has been applied to shift the first claws from the component mounting surface side to the soldering surface side with the first claws passing through the notches . <EOS>