A method for mounting, in a DMD light module for a motor vehicle headlight , a printed circuit board carrying a DMD chip , the method comprising the following steps: - producing a sub-module of the light module , which sub-module has the printed circuit board , a central carrier element and a clamping element assembly , the central carrier element having a carrier element window and being elastically connected to the clamping element assembly , and the DMD chip being arranged and retained in a base of the printed circuit board , the DMD chip being frictionally clampingly retained between a frame of the carrier element window and the clamping element assembly by a contact pressure, characterized by the following steps: movably retaining the DMD chip in a plane parallel to the printed circuit board plane against the resistance of a frictional force resulting from the clamping contact pressure, - defining a reference system for the orientation and position of the DMD chip relative to the central carrier element by inserting the sub-module into an alignment device having a gripper that can be movably controlled by an actuator , a camera that generates image signals, and a control unit that processes image signals from the camera (40&) to form actuating signals for the actuator , - gripping the printed circuit board using the gripper , - acquiring , through the carrier element window , at least one image of at least one orientation feature and/or at least one position feature of the DMD chip in the alignment device , - calculating the orientation and position of the DMD chip in the reference system of the alignment device according to image signals from the camera , - controlling the position of the gripper according to a deviation of the orientation and position of the DMD chip from a target orientation and target position such that the DMD chip occupies the target position and target orientation, and - securing the DMD chip in the central carrier element when the target position and target orientation has been reached. - producing a sub-module of the light module , which sub-module has the printed circuit board , a central carrier element and a clamping element assembly , the central carrier element having a carrier element window and being elastically connected to the clamping element assembly , and the DMD chip being arranged and retained in a base of the printed circuit board , the DMD chip being frictionally clampingly retained between a frame of the carrier element window and the clamping element assembly by a contact pressure, characterized by the following steps: movably retaining the DMD chip in a plane parallel to the printed circuit board plane against the resistance of a frictional force resulting from the clamping contact pressure, - defining a reference system for the orientation and position of the DMD chip relative to the central carrier element by inserting the sub-module into an alignment device having a gripper that can be movably controlled by an actuator , a camera that generates image signals, and a control unit that processes image signals from the camera (40&) to form actuating signals for the actuator , - gripping the printed circuit board using the gripper , - acquiring , through the carrier element window , at least one image of at least one orientation feature and/or at least one position feature of the DMD chip in the alignment device , - calculating the orientation and position of the DMD chip in the reference system of the alignment device according to image signals from the camera , - controlling the position of the gripper according to a deviation of the orientation and position of the DMD chip from a target orientation and target position such that the DMD chip occupies the target position and target orientation, and - securing the DMD chip in the central carrier element when the target position and target orientation has been reached. <EOS>