An apparatus comprising: • a first die comprising a first device layer and a first dielectric layer over the first device layer, wherein the first device layer comprises a plurality of first die contacts at a bottom surface of the first device layer; • a multilayer redistribution structure comprising at least one first support pad , a plurality of package contacts , and redistribution interconnects , wherein: • the first die resides over a top surface of the multilayer redistribution structure; • the at least one first support pad (52 ) is on a bottom surface of the multilayer redistribution structure and vertically aligned with the first die, such that the at least one first support pad is placed vertically below the first die; • the plurality of package contacts are on the bottom surface of the multilayer redistribution structure and electrically isolated from the at least one first support pad; and • the redistribution interconnects connect the plurality of package contacts to certain ones of the plurality of first die contacts; • a first mold compound residing over the multilayer redistribution structure and around the first die, and extending vertically beyond a top surface of the first die, wherein the top surface of the first die is not covered by the first mold compound; and • a second mold compound in contact with the entire top surface of the first die, wherein at least a first portion of the second mold compound is in contact with the first mold compound and surrounded by the first mold compound. • a first die comprising a first device layer and a first dielectric layer over the first device layer, wherein the first device layer comprises a plurality of first die contacts at a bottom surface of the first device layer; • a multilayer redistribution structure comprising at least one first support pad , a plurality of package contacts , and redistribution interconnects , wherein: • the first die resides over a top surface of the multilayer redistribution structure; • the at least one first support pad (52 ) is on a bottom surface of the multilayer redistribution structure and vertically aligned with the first die, such that the at least one first support pad is placed vertically below the first die; • the plurality of package contacts are on the bottom surface of the multilayer redistribution structure and electrically isolated from the at least one first support pad; and • the redistribution interconnects connect the plurality of package contacts to certain ones of the plurality of first die contacts; • the first die resides over a top surface of the multilayer redistribution structure; • the at least one first support pad (52 ) is on a bottom surface of the multilayer redistribution structure and vertically aligned with the first die, such that the at least one first support pad is placed vertically below the first die; • the plurality of package contacts are on the bottom surface of the multilayer redistribution structure and electrically isolated from the at least one first support pad; and • the redistribution interconnects connect the plurality of package contacts to certain ones of the plurality of first die contacts; • a first mold compound residing over the multilayer redistribution structure and around the first die, and extending vertically beyond a top surface of the first die, wherein the top surface of the first die is not covered by the first mold compound; and • a second mold compound in contact with the entire top surface of the first die, wherein at least a first portion of the second mold compound is in contact with the first mold compound and surrounded by the first mold compound. <EOS>