An integrated circuit device , comprising: a package that encapsulates a lead frame and at least one integrated circuit chip , wherein the at least one integrated circuit chip is mounted to a die pad of the lead frame, said lead frame further including a plurality of leads ; wherein the package has, in top view, a square or rectangular perimeter defined by first, second, third and fourth sidewalls ; wherein first and second sidewalls are opposite each other; wherein third and fourth sidewalls are opposite each other; wherein a first set of the plurality of leads extend along the first sidewall and a second set of the plurality of leads extend along the second sidewall; and wherein at least one of the third and fourth sidewalls includes a V-shaped concavity and comprises: a first sidewall portion ; a second sidewall portion joined to the first sidewall portion at a first outside corner ; a third sidewall portion joined to the second sidewall portion at an inside corner ; and a fourth sidewall portion joined to the third sidewall portion at a second outside corner ; wherein the second sidewall portion and the third sidewall portion define the V-shaped concavity; wherein the first sidewall portion extends perpendicularly from the first sidewall , and the fourth sidewall portion extends perpendicularly from the second sidewall , characterized in that the V-shaped concavity has a width (W) between the first and second outside corners that is between 0.35*L and 0.55*L, where L is a length of the third or fourth sidewall, and has a depth (D) from a plane of the third or fourth sidewall that is between 0.15*L and 0.30*L. a package that encapsulates a lead frame and at least one integrated circuit chip , wherein the at least one integrated circuit chip is mounted to a die pad of the lead frame, said lead frame further including a plurality of leads ; wherein the package has, in top view, a square or rectangular perimeter defined by first, second, third and fourth sidewalls ; wherein first and second sidewalls are opposite each other; wherein third and fourth sidewalls are opposite each other; wherein a first set of the plurality of leads extend along the first sidewall and a second set of the plurality of leads extend along the second sidewall; and wherein at least one of the third and fourth sidewalls includes a V-shaped concavity and comprises: a first sidewall portion ; a second sidewall portion joined to the first sidewall portion at a first outside corner ; a third sidewall portion joined to the second sidewall portion at an inside corner ; and a fourth sidewall portion joined to the third sidewall portion at a second outside corner ; wherein the second sidewall portion and the third sidewall portion define the V-shaped concavity; a first sidewall portion ; a second sidewall portion joined to the first sidewall portion at a first outside corner ; a third sidewall portion joined to the second sidewall portion at an inside corner ; and a fourth sidewall portion joined to the third sidewall portion at a second outside corner ; wherein the second sidewall portion and the third sidewall portion define the V-shaped concavity; wherein the first sidewall portion extends perpendicularly from the first sidewall , and the fourth sidewall portion extends perpendicularly from the second sidewall , characterized in that the V-shaped concavity has a width (W) between the first and second outside corners that is between 0.35*L and 0.55*L, where L is a length of the third or fourth sidewall, and has a depth (D) from a plane of the third or fourth sidewall that is between 0.15*L and 0.30*L. <EOS>