A method of manufacturing a display module, the method comprising: forming an epitaxial film comprising a light emitting layer , a first conductivity type semiconductor layer , and a second conductivity type semiconductor layer , wherein the first conductivity type semiconductor layer is provided on a lower portion of the light emitting layer, and the second conductivity type semiconductor layer is provided on an upper portion of the light emitting layer; attaching the epitaxial film onto an intermediate substrate comprising a first conductive portion , a second conductive portion and an adhesive portion provided in different regions, respectively; patterning the epitaxial film to form a light emitting diode, LED, having a vertical structure; and electrically connecting the LED to a driving circuit layer , the driving circuit layer comprising a pixel circuit and a plurality of electrodes configured to be electrically connected to the pixel circuit, wherein the plurality of electrodes comprise a first electrode and a second electrode , wherein electrically connecting the LED to the driving circuit layer comprises: attaching the intermediate substrate onto the driving circuit layer formed on a substrate to electrically connect the first conductivity type semiconductor layer of the LED to the driving circuit layer through the first conductive portion, wherein the intermediate substrate is attached onto the driving circuit layer through the adhesive portion; and forming an upper electrode along an upper portion of the second conductivity type semiconductor layer and a side surface of the LED, wherein the upper electrode electrically connects the second conductivity type semiconductor layer to the second conductive portion of the intermediate substrate, such that the second conductivity type semiconductor layer is electrically connected to the second electrode through the second conductive portion. forming an epitaxial film comprising a light emitting layer , a first conductivity type semiconductor layer , and a second conductivity type semiconductor layer , wherein the first conductivity type semiconductor layer is provided on a lower portion of the light emitting layer, and the second conductivity type semiconductor layer is provided on an upper portion of the light emitting layer; attaching the epitaxial film onto an intermediate substrate comprising a first conductive portion , a second conductive portion and an adhesive portion provided in different regions, respectively; patterning the epitaxial film to form a light emitting diode, LED, having a vertical structure; and electrically connecting the LED to a driving circuit layer , the driving circuit layer comprising a pixel circuit and a plurality of electrodes configured to be electrically connected to the pixel circuit, wherein the plurality of electrodes comprise a first electrode and a second electrode , wherein electrically connecting the LED to the driving circuit layer comprises: attaching the intermediate substrate onto the driving circuit layer formed on a substrate to electrically connect the first conductivity type semiconductor layer of the LED to the driving circuit layer through the first conductive portion, wherein the intermediate substrate is attached onto the driving circuit layer through the adhesive portion; and <EOS>