Laser cutting apparatus for shielded leads , in particular for laser-cutting of shielding wires and/or shielding foils at shielded leads , comprising the following features: - provision is made of at least one laser device that is embodied to produce a laser beam ; - provision is made of a ring mirror device having a circumferential mirrored wall , which delimits a cutting chamber and through which a central axis passes; - the circumferential mirrored wall is open at its end sides , as a result of which a cable introduction opening is formed at the first end side and a laser inlet opening is formed at the second end side , which lies opposite the first end side , wherein the cutting chamber is accessible from outside of the circumferential mirrored wall by way of these openings ; - a shielded lead to be cut by the laser beam is arrangeable along the central axis in the cutting chamber ; - the circumferential mirrored wall is embodied to reflect the laser beam in the direction of the shielded lead , wherein the circumferential mirrored wall extends through 360° around the central axis ; - provision is moreover made of a laser beam deflection apparatus that is embodied to guide the laser beam in such a way that the laser beam enters the cutting chamber through the laser inlet opening and strikes the circumferential mirrored wall ; - the laser beam deflection apparatus is further embodied to guide the laser beam in such a way that the latter moves on a trajectory along the circumferential mirrored wall through 360° about the central axis , as a result of which the shielded lead , which is arrangeable in the region of the central axis within the cutting chamber , is cuttable along the entire circumference thereof by the laser beam that is reflected at the circumferential mirrored wall ; characterized by the following feature: - the circumferential mirrored wall is segmented, as a result of which the trajectory along which the laser beam is movable along the circumferential mirrored wall through 360° around the central axis is interrupted. - provision is made of at least one laser device that is embodied to produce a laser beam ; - provision is made of a ring mirror device having a circumferential mirrored wall , which delimits a cutting chamber and through which a central axis passes; - the circumferential mirrored wall is open at its end sides , as a result of which a cable introduction opening is formed at the first end side and a laser inlet opening is formed at the second end side , which lies opposite the first end side , wherein the cutting chamber is accessible from outside of the circumferential mirrored wall by way of these openings ; - a shielded lead to be cut by the laser beam is arrangeable along the central axis in the cutting chamber ; - the circumferential mirrored wall is embodied to reflect the laser beam in the direction of the shielded lead , wherein the circumferential mirrored wall extends through 360° around the central axis ; - provision is moreover made of a laser beam deflection apparatus that is embodied to guide the laser beam in such a way that the laser beam enters the cutting chamber through the laser inlet opening and strikes the circumferential mirrored wall ; - the laser beam deflection apparatus is further embodied to guide the laser beam in such a way that the latter moves on a trajectory along the circumferential mirrored wall through 360° about the central axis , as a result of which the shielded lead , which is arrangeable in the region of the central axis within the cutting chamber , is cuttable along the entire circumference thereof by the laser beam that is reflected at the circumferential mirrored wall ; - the circumferential mirrored wall is segmented, as a result of which the trajectory along which the laser beam is movable along the circumferential mirrored wall through 360° around the central axis is interrupted. <EOS>