Semiconductor assembly , comprising - a carrier element with a first carrier element conductor path , - a semiconductor , - an electrically insulating element , having a first insulating element conductor path , - a first spacer element and - at least one further spacer element , wherein - the semiconductor is connected electrically and mechanically on a first semiconductor side by means of a first connecting material to the first carrier element conductor path , - the semiconductor is connected electrically and mechanically on a second semiconductor side , which faces away from the first semiconductor side of the semiconductor , by means of a second connecting material to the first insulating element conductor path , which is arranged on a first insulating element side of the electrically insulating element , - the first spacer element is arranged for maintaining a distance between the carrier element and an assembly element which faces towards the second semiconductor side of the semiconductor , and is connected mechanically to the carrier element and the assembly element respectively, - the further spacer element is also arranged for maintaining the distance between the carrier element and the assembly element which faces towards the second semiconductor side of the semiconductor , and is connected mechanically to the carrier element and the assembly element respectively, - the first spacer element and the further spacer element are embodied as a common spacer element, characterised in that - the common spacer element comprises at least two segments and forms a closed or at least almost closed frame. - a carrier element with a first carrier element conductor path , - a semiconductor , - an electrically insulating element , having a first insulating element conductor path , - a first spacer element and - at least one further spacer element , - the semiconductor is connected electrically and mechanically on a first semiconductor side by means of a first connecting material to the first carrier element conductor path , - the semiconductor is connected electrically and mechanically on a second semiconductor side , which faces away from the first semiconductor side of the semiconductor , by means of a second connecting material to the first insulating element conductor path , which is arranged on a first insulating element side of the electrically insulating element , - the first spacer element is arranged for maintaining a distance between the carrier element and an assembly element which faces towards the second semiconductor side of the semiconductor , and is connected mechanically to the carrier element and the assembly element respectively, - the further spacer element is also arranged for maintaining the distance between the carrier element and the assembly element which faces towards the second semiconductor side of the semiconductor , and is connected mechanically to the carrier element and the assembly element respectively, - the first spacer element and the further spacer element are embodied as a common spacer element, characterised in that - the common spacer element comprises at least two segments and forms a closed or at least almost closed frame. <EOS>