A light emitting device package comprising: a substrate with an upper surface and a lower surface; a light emitting part disposed on the upper surface of the substrate ; a first metal layer on the upper surface of the substrate electrically connected to a first electrode of said light emitting part ; a second metal layer on the upper surface of the substrate electrically connected to a second electrode of said light emitting part ; wherein the substrate comprises a first cavity recessed from the upper surface of the substrate; wherein the substrate comprises a first via hole and a second via hole , wherein the light emitting device comprises a third metal layer and a fourth metal layer on the lower surface of the substrate, and wherein the first metal layer is electrically connected to the third metal layer through said first via hole and the second metal layer is electrically connected to said fourth metal layer through the second via hole ; characterized in that, said first cavity has a bottom surface recessed from the upper surface of the substrate formed in a concave-convex shape from a top view and in that the substrate comprises a second cavity recessed from said first cavity, wherein the light emitting part is placed on a bottom surface of the second cavity and a top surface of the light emitting part is lower than a bottom surface of the first cavity, and wherein the first metal layer comprises a first portion on the first cavity, a second portion on the second cavity, and a third portion between the first portion and the second portion, wherein the third portion is connected to the first portion, and wherein the third portion is not perpendicular to the bottom surface of the first cavity. a substrate with an upper surface and a lower surface; a light emitting part disposed on the upper surface of the substrate ; a first metal layer on the upper surface of the substrate electrically connected to a first electrode of said light emitting part ; a second metal layer on the upper surface of the substrate electrically connected to a second electrode of said light emitting part ; wherein the substrate comprises a first cavity recessed from the upper surface of the substrate; wherein the substrate comprises a first via hole and a second via hole , wherein the light emitting device comprises a third metal layer and a fourth metal layer on the lower surface of the substrate, and wherein the first metal layer is electrically connected to the third metal layer through said first via hole and the second metal layer is electrically connected to said fourth metal layer through the second via hole ; characterized in that, said first cavity has a bottom surface recessed from the upper surface of the substrate formed in a concave-convex shape from a top view and in that the substrate comprises a second cavity recessed from said first cavity, wherein the light emitting part is placed on a bottom surface of the second cavity and a top surface of the light emitting part is lower than a bottom surface of the first cavity, and wherein the first metal layer comprises a first portion on the first cavity, a second portion on the second cavity, and a third portion between the first portion and the second portion, wherein the third portion is connected to the first portion, and wherein the third portion is not perpendicular to the bottom surface of the first cavity. <EOS>