mhurhangee/patent-ind-claim-en huggingface dataset:
Infrared sensor device (100; 200; 300), comprising: - a semiconductor substrate ; - a multiplicity of row lines and a multiplicity of column lines ; - at least one micromechanically formed sensor element , which is connected to the semiconductor substrate by means of a suspension arrangement of the sensor element , wherein the suspension arrangement of the sensor element comprises conductor tracks for the electrical supply of the sensor element , said conductor tracks being electrically connected to at least one of the multiplicity of row lines and/or of the multiplicity of column lines ; and - at least one micromechanically formed calibration element for the sensor element , which is connected to the semiconductor substrate by means of a suspension arrangement of the calibration element , wherein the suspension arrangement of the calibration element comprises conductor tracks for the electrical supply of the calibration element , said conductor tracks being electrically connected to at least one of the multiplicity of row lines and/or of the multiplicity of column lines ; wherein in each case at least one diode correspondingly associated with the sensor element and the calibration element is formed for the sensor element and for the calibration element , wherein an absorber material is arranged at least on the diodes of the sensor element and of the calibration element ; wherein a respective cavity is formed in the semiconductor substrate substantially below the sensor element and substantially below the calibration element , wherein the sensor element and the calibration element are separated from the rest of the semiconductor substrate by means of the cavities ; wherein the calibration element is thermally coupled to the semiconductor substrate by thermal bridges directly on the shortest path between a column or respectively row line region and a region with the at least one diode ; and wherein the thermal bridges contain a metal structure for increasing the thermal conductivity of the thermal bridges . - a semiconductor substrate ; - a multiplicity of row lines and a multiplicity of column lines ; - at least one micromechanically formed sensor element , which is connected to the semiconductor substrate by means of a suspension arrangement of the sensor element , wherein the suspension arrangement of the sensor element comprises conductor tracks for the electrical supply of the sensor element , said conductor tracks being electrically connected to at least one of the multiplicity of row lines and/or of the multiplicity of column lines ; and - at least one micromechanically formed calibration element for the sensor element , which is connected to the semiconductor substrate by means of a suspension arrangement of the calibration element , wherein the suspension arrangement of the calibration element comprises conductor tracks for the electrical supply of the calibration element , said conductor tracks being electrically connected to at least one of the multiplicity of row lines and/or of the multiplicity of column lines ;
A management server comprising: a controller configured to control an audio client system , wherein the audio client system includes: a speaker ; an input end configured to receive a supply of an audio signal; and a first signal path from the input end to the speaker , the management server further comprising: an acquirer configured to acquire a first transfer function measured for a portion of or for all of the first signal path in the audio client system ; a calculator configured to generate a virtual second signal path for a portion of or for all of the first signal path in the audio client system , and calculate a second transfer function for a portion of or for all of the generated virtual second signal path; and a determiner configured to determine a condition of the audio client system , based on a result of a comparison between the first transfer function and the second transfer function. a speaker ; an input end configured to receive a supply of an audio signal; and a first signal path from the input end to the speaker , the management server further comprising: an acquirer configured to acquire a first transfer function measured for a portion of or for all of the first signal path in the audio client system ; a calculator configured to generate a virtual second signal path for a portion of or for all of the first signal path in the audio client system , and calculate a second transfer function for a portion of or for all of the generated virtual second signal path; and a determiner configured to determine a condition of the audio client system , based on a result of a comparison between the first transfer function and the second transfer function. an acquirer configured to acquire a first transfer function measured for a portion of or for all of the first signal path in the audio client system ; a calculator configured to generate a virtual second signal path for a portion of or for all of the first signal path in the audio client system , and calculate a second transfer function for a portion of or for all of the generated virtual second signal path; and a determiner configured to determine a condition of the audio client system , based on a result of a comparison between the first transfer function and the second transfer function.
Process for the production of a multilayer fabric comprising the steps of: (a) feeding at least a first fabric and a second fabric to a constraining device , wherein the first fabric is a non-woven fabric, comprising a plurality of filaments adapted to be crimped, preferably bicomponent filaments; (b) constraining said first and said second fabric to each other, so that to define a plurality of constraining points or zones (P) between said first fabric and said second fabric , and so that said first and second fabric are superimposed; (c) heating said first and second fabric , so that the filaments of the first fabric develop a crimp, thus increasing the thickness of the first fabric and shrinking the length and the width of the first fabric , the shrinking of the first fabric being greater than the shrinking of the second fabric , wherein the tensile strength of the first fabric is lower than the tensile strength of the second fabric . (a) feeding at least a first fabric and a second fabric to a constraining device , wherein the first fabric is a non-woven fabric, comprising a plurality of filaments adapted to be crimped, preferably bicomponent filaments; (b) constraining said first and said second fabric to each other, so that to define a plurality of constraining points or zones (P) between said first fabric and said second fabric , and so that said first and second fabric are superimposed; (c) heating said first and second fabric , so that the filaments of the first fabric develop a crimp, thus increasing the thickness of the first fabric and shrinking the length and the width of the first fabric , the shrinking of the first fabric being greater than the shrinking of the second fabric ,
A method for remoistening a web of a printing stock after an application of water-impermeable application elements , wherein the moistening is executed in a structured manner, wherein the structuring is adapted to position and size of the application elements , and regions in which the application elements are applied to the web are left out upon the moistening.
A lithium electrode comprising: a lithium metal or lithium alloy layer, and a surface treatment layer formed on the lithium metal or lithium alloy layer; wherein the surface treatment layer comprises a surface treatment compound which comprises at least one functional group capable of bonding with lithium metal and comprises a hydrocarbon group substituted with at least one fluorine, the at least one functional group capable of bonding with lithium metal being selected from a thiol group, an amine group and a hydroxyl group; and wherein the surface treatment layer is formed by reacting a surface treatment solution comprising the surface treatment compound and a solvent with the lithium metal or lithium alloy layer under an inert atmosphere and drying the result. a lithium metal or lithium alloy layer, and a surface treatment layer formed on the lithium metal or lithium alloy layer; wherein the surface treatment layer comprises a surface treatment compound which comprises at least one functional group capable of bonding with lithium metal and comprises a hydrocarbon group substituted with at least one fluorine, the at least one functional group capable of bonding with lithium metal being selected from a thiol group, an amine group and a hydroxyl group; and wherein the surface treatment layer is formed by reacting a surface treatment solution comprising the surface treatment compound and a solvent with the lithium metal or lithium alloy layer under an inert atmosphere and drying the result.
A porous ceramic honeycomb body , comprising: a substrate of porous walls forming channels extending from a first end face to a second end face ; an in wall zeolite catalyst disposed inside pores of a first portion of the walls; and a three way catalyst (TWC) disposed on wall surfaces of the first portion of the walls, wherein the first portion of the walls is spaced apart from the first end face by a second portion of the walls, wherein the second portion of the walls is substantially free of zeolite catalyst inside pores of the walls, and wherein the first end face is an inlet side of the porous ceramic honeycomb body . a substrate of porous walls forming channels extending from a first end face to a second end face ; an in wall zeolite catalyst disposed inside pores of a first portion of the walls; and a three way catalyst (TWC) disposed on wall surfaces of the first portion of the walls, wherein the first portion of the walls is spaced apart from the first end face by a second portion of the walls, wherein the second portion of the walls is substantially free of zeolite catalyst inside pores of the walls, and wherein the first end face is an inlet side of the porous ceramic honeycomb body .
Tool for chipless production or reworking of a thread, in particular a ball screw thread, in or on a workpiece, in particular a thread cutter or thread former, comprising at least one forming region which can be rotated or rotates about a tool axis (A) for chipless production or reworking of the thread, in particular an internal thread, wherein the forming region has a plurality of pressing studs projecting radially outwards away from the tool axis (A) for producing or reworking the thread by pressing the pressing studs into the workpiece surface, wherein the pressing studs are arranged in succession along a shaping curve spiraling around the tool axis (A), and whereby the gradient of the shaping curve corresponds to the gradient of the thread to be produced or reworked, wherein the shaping curve has a slope angle (α), and wherein a profile of at least one pressing stud is at least in sections round-arched or ogival in an axial section containing the tool axis (A), wherein the pressing studs are arranged in at least two pressing webs , characterized in that one of the at least two pressing webs is a first pressing web and another is a second pressing web , wherein the second pressing web is longer along the shaping curve than the first pressing web or webs , wherein the second pressing web has a length of 1.5 - 2.5 times the swept angle θ than the shorter first pressing webs . wherein the forming region has a plurality of pressing studs projecting radially outwards away from the tool axis (A) for producing or reworking the thread by pressing the pressing studs into the workpiece surface, wherein the pressing studs are arranged in succession along a shaping curve spiraling around the tool axis (A), and whereby the gradient of the shaping curve corresponds to the gradient of the thread to be produced or reworked, wherein the shaping curve has a slope angle (α), and wherein a profile of at least one pressing stud is at least in sections round-arched or ogival in an axial section containing the tool axis (A), wherein the pressing studs are arranged in at least two pressing webs , characterized in that one of the at least two pressing webs is a first pressing web and another is a second pressing web , wherein the second pressing web is longer along the shaping curve than the first pressing web or webs , wherein the second pressing web has a length of 1.5 - 2.5 times the swept angle θ than the shorter first pressing webs .
A system for determining when an object detected by a collision avoidance sensor on one member (12 or 14) of an articulated vehicle comprises another member (14 or 12) of the vehicle , comprising: a collision avoidance sensor disposed on a first member (12 or 14) of the vehicle , the collision avoidance sensor configured to detect an object within a field of view of the sensor on a side of the first member (12 or 14) of the vehicle ; characterized by a controller configured to determine an articulation angle between the first member (12 or 14) of the vehicle and a second member (14 or 12) of the vehicle ; and, determine , in response to the articulation angle, whether the second member (14 or 12) of the vehicle is the object within the field of view of the collision avoidance sensor on the first member (12 or 14) of the vehicle . a collision avoidance sensor disposed on a first member (12 or 14) of the vehicle , the collision avoidance sensor configured to detect an object within a field of view of the sensor on a side of the first member (12 or 14) of the vehicle ; characterized by a controller configured to determine an articulation angle between the first member (12 or 14) of the vehicle and a second member (14 or 12) of the vehicle ; and, determine , in response to the articulation angle, whether the second member (14 or 12) of the vehicle is the object within the field of view of the collision avoidance sensor on the first member (12 or 14) of the vehicle . determine an articulation angle between the first member (12 or 14) of the vehicle and a second member (14 or 12) of the vehicle ; and, determine , in response to the articulation angle, whether the second member (14 or 12) of the vehicle is the object within the field of view of the collision avoidance sensor on the first member (12 or 14) of the vehicle .
A fairing arrangement for a motor vehicle, in particular for a motorcycle or a motor vehicle similar to a motorcycle, with at least two sheet-like fairing elements , wherein a first fairing element has a first outer face and the second fairing element has a second outer face which in the installed state form at least part of an outer fairing of the motor vehicle and are arranged next to one another and also are separated from each other by a gap , wherein the first fairing element has a transition portion which is formed angled by a first angle (α) relative to the first outer face and is extended at least with a first end under the second fairing element , wherein the second fairing element has on a second end which faces the transition portion a chamfer which is formed parallel to the transition portion , characterised in that the second fairing element in the region of the second end and outside the chamfer has a wall thickness d, the second end of the second fairing element and the first end of the transition portion being formed overlapping each other and an overlapping length (I) being at least d/2.
Method for reading information from a one- or multi-dimensional coding field , the information being stored within boundaries of the coding field , and the information being available in the one- or multi-dimensional coding field by means of a magnetic and/or magnetisable medium , and a magnetically sensitive sensor device being used to read the information, comprising the steps of: a) locally bringing together the one- or multi-dimensional coding field and the sensor device to a distance (d) less than or equal to a maximum sensing distance (d max ); b) orientating the sensor device relative to the coding field such that a sensor device field of vision captures at least one part of a portion of the one- or multi-dimensional coding field , which portion contains all the required information to be sensed; c) sensing all the required information either at once or sequentially in at least one suitable orientation position using the sensor device in at least one or more point captures, line captures and/or at least one matrix capture for all the required information that is to be sensed; d) the required data being captured during the capture-reading operation in such a way that no relative readout movement of a point sensor, line sensor or matrix sensor of the sensor device relative to the coding field is performed, characterised in that a bias field is generated along at least one sensor device field of vision limit at least after the orientation and before the sensing, said bias field acting on the magnetic and/or magnetisable material. a) locally bringing together the one- or multi-dimensional coding field and the sensor device to a distance (d) less than or equal to a maximum sensing distance (d max ); b) orientating the sensor device relative to the coding field such that a sensor device field of vision captures at least one part of a portion of the one- or multi-dimensional coding field , which portion contains all the required information to be sensed; c) sensing all the required information either at once or sequentially in at least one suitable orientation position using the sensor device in at least one or more point captures, line captures and/or at least one matrix capture for all the required information that is to be sensed; d) the required data being captured during the capture-reading operation in such a way that no relative readout movement of a point sensor, line sensor or matrix sensor of the sensor device relative to the coding field is performed, characterised in that a bias field is generated along at least one sensor device field of vision limit at least after the orientation and before the sensing, said bias field acting on the magnetic and/or magnetisable material.
A photovoltaic module comprising at least one photovoltaic element and at least one backsheet element, the backsheet element comprising at least one layer which comprises a crosslinked polymer composition, which comprises - a polymer of ethylene (a) which bears functional group(s) containing units; and - silane group(s) containing units (b); wherein the polymer (a) is a polymer of ethylene comprising functional group(s) containing units which are the silane group(s) containing units (b) as comonomer in the polymer of ethylene, and wherein the polymer of ethylene (a) is crosslinked via the silane group(s) containing units (b) . - a polymer of ethylene (a) which bears functional group(s) containing units; and - silane group(s) containing units (b); wherein the polymer (a) is a polymer of ethylene comprising functional group(s) containing units which are the silane group(s) containing units (b) as comonomer in the polymer of ethylene, and wherein the polymer of ethylene (a) is crosslinked via the silane group(s) containing units (b) .
A printed circuit board arrangement comprising at least one printed circuit board, a carrier and a contacting circuit board, the printed circuit board comprising a top side and a bottom side and at least two electrically conductive layers for transmitting electrical current and at least one electrically insulating layer comprising electrically insulating material, wherein the electrically conductive layers and the electrically insulating layer are arranged in an alternating assembly such that the two electrically conductive layers are electrically insulated with respect to each other by means of the electrically insulating layer , wherein each of the electrically conductive layers is adapted to be coupled to a bond wire independently from the other electrically conductive layer at a side surface of the printed circuit board, said side surface being inclined with respect to the top side of the printed circuit board, wherein the printed circuit board is coupled to a first side of the carrier and the contacting circuit board is coupled to a second side of the carrier being inclined to the first side of the carrier, wherein at least one electrically conductive layer of the printed circuit board is coupled to a bond wire at the side surface of the printed circuit board, and wherein the bond wire provides a connection to an electrically conductive trace of the contacting circuit board for exchanging electrical current between the printed circuit board and the contacting circuit board.
A radiation imaging apparatus comprising a detection unit configured to generate an image signal according to radiation emitted by a radiation source , an image processing unit , and a control unit , wherein the control unit performs first imaging and second imaging performed after the first imaging using radiations of different energies, the image processing unit generates an energy subtraction image using a first image signal generated by the detection unit in the first imaging and a second image signal generated by the detection unit in the second imaging, and characterized in that the control unit decides a noise amount included in the first image signal based on an image signal of a predetermined region of the first image signal in the first imaging, decides a radiation irradiation condition of the second imaging in accordance with the noise amount, and performs the second imaging under the decided radiation irradiation condition. the control unit performs first imaging and second imaging performed after the first imaging using radiations of different energies, the image processing unit generates an energy subtraction image using a first image signal generated by the detection unit in the first imaging and a second image signal generated by the detection unit in the second imaging, and characterized in that the control unit decides a noise amount included in the first image signal based on an image signal of a predetermined region of the first image signal in the first imaging, decides a radiation irradiation condition of the second imaging in accordance with the noise amount, and performs the second imaging under the decided radiation irradiation condition.