A power semiconductor module , comprising: - at least one submodule including - at least one power semiconductor device , wherein said at least one power semiconductor device is connected to at least one press pin and at least one gate pin , - the at least one press pin comprises an upper part and a lower part , - the lower part is in direct contact to the at least one power semiconductor device , - the press pin comprises a spring washer pack being configured to apply a force between the upper part and the lower part, pushing them in opposite directions, and - a housing laterally surrounding the at least one power semiconductor device , the at least one press pin and the at least one gate pin in lateral directions, - a module frame laterally surrounding the at least one submodule in lateral directions, wherein - at least one elastic element is arranged between the module frame and the housing , - the module frame comprises a first protrusion on an inner side surface facing the at least one submodule , - the elastic element is arranged on the first protrusion , - the housing comprises a second protrusion on an outer side surface facing the module frame , - the second protrusion is arranged on the elastic element , and - the elastic element is continuously arranged between the module frame and the housing and such that, due to the elastic element , a freedom of movement of the submodule is reduced within the module frame in vertical direction and lateral direction. - at least one submodule including - at least one power semiconductor device , wherein said at least one power semiconductor device is connected to at least one press pin and at least one gate pin , - the at least one press pin comprises an upper part and a lower part , - the lower part is in direct contact to the at least one power semiconductor device , - the press pin comprises a spring washer pack being configured to apply a force between the upper part and the lower part, pushing them in opposite directions, and - a housing laterally surrounding the at least one power semiconductor device , the at least one press pin and the at least one gate pin in lateral directions, - at least one power semiconductor device , wherein said at least one power semiconductor device is connected to at least one press pin and at least one gate pin , said at least one power semiconductor device is connected to at least one press pin and at least one gate pin , - the at least one press pin comprises an upper part and a lower part , - the lower part is in direct contact to the at least one power semiconductor device , - the press pin comprises a spring washer pack being configured to apply a force between the upper part and the lower part, pushing them in opposite directions, and - a housing laterally surrounding the at least one power semiconductor device , the at least one press pin and the at least one gate pin in lateral directions, - a module frame laterally surrounding the at least one submodule in lateral directions, wherein - at least one elastic element is arranged between the module frame and the housing , - the module frame comprises a first protrusion on an inner side surface facing the at least one submodule , - the elastic element is arranged on the first protrusion , - the housing comprises a second protrusion on an outer side surface facing the module frame , - the second protrusion is arranged on the elastic element , and - the elastic element is continuously arranged between the module frame and the housing and such that, due to the elastic element , a freedom of movement of the submodule is reduced within the module frame in vertical direction and lateral direction. <EOS>