A deposition mask , comprising: a patterning region (PA) provided with a pattern portion (PT); and a plurality of bonding regions (BA) for bonding the deposition mask to a support frame , the bonding regions being provided towards opposite ends of the patterning region in a first direction (DR1), wherein the pattern portion comprises: a first pattern portion (PT1), in which first pattern holes are defined, wherein the first pattern portion comprises a deposition part (AT) which corresponds to a deposition region through which material is deposited on to a substrate in use; and a plurality of second pattern portions (PT2), in which second pattern holes are defined, and which are located between opposite ends of the first pattern portion and the bonding regions in the first direction such that each of the second pattern portions connects the outermost of the deposition parts of the first pattern portion to one of the bonding regions, wherein a second distance, which is a minimum distance between adjacent ones of the second pattern holes, is larger than a first distance, which is a minimum distance between adjacent ones of the first pattern holes, wherein each of the second pattern portions comprises: a first portion (AR1), which is provided adjacent to a bonding region of the bonding regions, and in which the second pattern holes are defined; and a second portion (AR2), which is provided between the first portion and the first pattern portion, and in which the first pattern holes are defined. a patterning region (PA) provided with a pattern portion (PT); and a plurality of bonding regions (BA) for bonding the deposition mask to a support frame , the bonding regions being provided towards opposite ends of the patterning region in a first direction (DR1), wherein the pattern portion comprises: a first pattern portion (PT1), in which first pattern holes are defined, wherein the first pattern portion comprises a deposition part (AT) which corresponds to a deposition region through which material is deposited on to a substrate in use; and a plurality of second pattern portions (PT2), in which second pattern holes are defined, and which are located between opposite ends of the first pattern portion and the bonding regions in the first direction such that each of the second pattern portions connects the outermost of the deposition parts of the first pattern portion to one of the bonding regions, a first pattern portion (PT1), in which first pattern holes are defined, wherein the first pattern portion comprises a deposition part (AT) which corresponds to a deposition region through which material is deposited on to a substrate in use; and a plurality of second pattern portions (PT2), in which second pattern holes are defined, and which are located between opposite ends of the first pattern portion and the bonding regions in the first direction such that each of the second pattern portions connects the outermost of the deposition parts of the first pattern portion to one of the bonding regions, wherein a second distance, which is a minimum distance between adjacent ones of the second pattern holes, is larger than a first distance, which is a minimum distance between adjacent ones of the first pattern holes, wherein each of the second pattern portions comprises: a first portion (AR1), which is provided adjacent to a bonding region of the bonding regions, and in which the second pattern holes are defined; and a second portion (AR2), which is provided between the first portion and the first pattern portion, and in which the first pattern holes are defined. a first portion (AR1), which is provided adjacent to a bonding region of the bonding regions, and in which the second pattern holes are defined; and a second portion (AR2), which is provided between the first portion and the first pattern portion, and in which the first pattern holes are defined. <EOS>