An IC chip mounting apparatus for mounting an IC chip (C) at a reference position (Pref) of an inlay antenna (AN) while conveying the antenna, the IC chip (C) mounting apparatus comprising: a nozzle configured to suck an IC chip when located at a first position (PA and to place the IC chip at the reference position of the antenna when located at a second position (PK); a nozzle attachment to which the nozzle is attached; a first rotating unit (M30) configured to rotate the nozzle around an axis; a second rotating unit (M31) configured to rotate the nozzle attachment so that the nozzle moves from the first position to the second position; a moving machine configured to move the nozzle; an image acquisition unit (CA3) configured to acquire an image of the IC chip sucked by the nozzle, when the nozzle is located at a position between the first position and the second position; and a correction amount determination unit configured to determine correction amounts for the IC chip sucked by the nozzle , based on the image acquired by the image acquisition unit (CA3), the correction amounts including a first correction amount for correcting an angle of the nozzle around the axis, a second correction amount for correcting a position of the antenna in a conveying direction (D1) of the antenna, and a third correction amount for correcting the position of the antenna (AN) in a width direction (D2), wherein the first rotating unit (M30) is configured to rotate the nozzle around the axis based on the first correction amount, wherein the second rotating unit (M31) is configured to rotate the nozzle attachment , with an angular velocity adjusted based on the second correction amount, and wherein the moving machine is configured to move the nozzle in the width direction orthogonal to the conveying direction of the antenna, based on the third correction amount. a nozzle configured to suck an IC chip when located at a first position (PA and to place the IC chip at the reference position of the antenna when located at a second position (PK); a nozzle attachment to which the nozzle is attached; a first rotating unit (M30) configured to rotate the nozzle around an axis; a second rotating unit (M31) configured to rotate the nozzle attachment so that the nozzle moves from the first position to the second position; a moving machine configured to move the nozzle; an image acquisition unit (CA3) configured to acquire an image of the IC chip sucked by the nozzle, when the nozzle is located at a position between the first position and the second position; and a correction amount determination unit configured to determine correction amounts for the IC chip sucked by the nozzle , based on the image acquired by the image acquisition unit (CA3), the correction amounts including a first correction amount for correcting an angle of the nozzle around the axis, a second correction amount for correcting a position of the antenna in a conveying direction (D1) of the antenna, and a third correction amount for correcting the position of the antenna (AN) in a width direction (D2), a first correction amount for correcting an angle of the nozzle around the axis, a second correction amount for correcting a position of the antenna in a conveying direction (D1) of the antenna, and a third correction amount for correcting the position of the antenna (AN) in a width direction (D2), wherein the first rotating unit (M30) is configured to rotate the nozzle around the axis based on the first correction amount, wherein the second rotating unit (M31) is configured to rotate the nozzle attachment , with an angular velocity adjusted based on the second correction amount, and wherein the moving machine is configured to move the nozzle in the width direction orthogonal to the conveying direction of the antenna, based on the third correction amount. <EOS>