A die mounting system comprising: a die supply device that supplies dies formed from a single diced wafer affixed to a dicing sheet and that is set on a component mounter ; a mounting head of the component mounter that picks up a die supplied from the die supply device and mounts the die on a circuit board , wherein the die supply device includes a supply head that picks up a die from the dicing sheet and is then vertically inverted, a camera that images the die on the dicing sheet , and a supply head moving mechanism that moves the supply head as one with the camera , wherein the die mounting system is further provided with a control system that controls operation such that an image captured by the camera is processed to recognize a position of a die on the dicing sheet , the supply head is moved above the die by the supply head moving mechanism , the die is picked up by the supply head , the supply head is vertically inverted, the supply head is moved to a die transfer position by the supply head moving mechanism , and the die held by the supply head is picked up by the mounting head of the component mounter at the component transfer position and mounted on the circuit board , characterized in that the control system is configured such that the die transfer position is set by said supply head moving mechanism at a position such that die transfer operation of picking up the die held by the supply head with the mounting head and die imaging operation of imaging a die on the dicing sheet with the camera are able to be performed in parallel. a die supply device that supplies dies formed from a single diced wafer affixed to a dicing sheet and that is set on a component mounter ; a mounting head of the component mounter that picks up a die supplied from the die supply device and mounts the die on a circuit board , wherein the die supply device includes a supply head that picks up a die from the dicing sheet and is then vertically inverted, a camera that images the die on the dicing sheet , and a supply head moving mechanism that moves the supply head as one with the camera , a supply head that picks up a die from the dicing sheet and is then vertically inverted, a camera that images the die on the dicing sheet , and a supply head moving mechanism that moves the supply head as one with the camera , wherein the die mounting system is further provided with a control system that controls operation such that an image captured by the camera is processed to recognize a position of a die on the dicing sheet , the supply head is moved above the die by the supply head moving mechanism , the die is picked up by the supply head , the supply head is vertically inverted, the supply head is moved to a die transfer position by the supply head moving mechanism , and the die held by the supply head is picked up by the mounting head of the component mounter at the component transfer position and mounted on the circuit board , characterized in that the control system is configured such that the die transfer position is set by said supply head moving mechanism at a position such that die transfer operation of picking up the die held by the supply head with the mounting head and die imaging operation of imaging a die on the dicing sheet with the camera are able to be performed in parallel. <EOS>