A system comprising: a detector configured to detect an amount and location of debris occurring on a substrate outer surface , and to evaluate actual profile characteristics of the substrate outer surface of a substrate at a specified location on the substrate outer surface ; a memory comprising predetermined profile characteristics of the substrate outer surface, said memory in communication with the detector for receiving the actual profile characteristics from the detector ; a processor configured to access the predetermined profile characteristics of the substrate outer surface from said memory , to compare the actual profile characteristics of the substrate outer surface with the predetermined profile characteristics of the substrate outer surface , and to select an amount of energy required for removing the detected debris, said processor in communication with the detector and the memory for detecting the amount and location of debris; at least one controller in communication with the processor and the memory , and configured to control activation of an energy source ; a positioning mechanism in communication with the controller and configured to move the system relative to the substrate outer surface ; the energy source in communication with the controller , wherein the energy source is configured to emit the selected amount of energy directed from the energy source to the substrate outer surface for dislodging and/or removing the detected amount of debris from the substrate outer surface ; a vacuum device in communication with the controller , and configured to establish a pressure gradient at the substrate outer surface for removing debris; and wherein the system is configured to remove debris from the substrate outer surface (3 8b) while leaving the substrate outer surface (3 8b) intact. a detector configured to detect an amount and location of debris occurring on a substrate outer surface , and to evaluate actual profile characteristics of the substrate outer surface of a substrate at a specified location on the substrate outer surface ; a memory comprising predetermined profile characteristics of the substrate outer surface, said memory in communication with the detector for receiving the actual profile characteristics from the detector ; a processor configured to access the predetermined profile characteristics of the substrate outer surface from said memory , to compare the actual profile characteristics of the substrate outer surface with the predetermined profile characteristics of the substrate outer surface , and to select an amount of energy required for removing the detected debris, said processor in communication with the detector and the memory for detecting the amount and location of debris; at least one controller in communication with the processor and the memory , and configured to control activation of an energy source ; a positioning mechanism in communication with the controller and configured to move the system relative to the substrate outer surface ; the energy source in communication with the controller , wherein the energy source is configured to emit the selected amount of energy directed from the energy source to the substrate outer surface for dislodging and/or removing the detected amount of debris from the substrate outer surface ; a vacuum device in communication with the controller , and configured to establish a pressure gradient at the substrate outer surface for removing debris; and wherein the system is configured to remove debris from the substrate outer surface (3 8b) while leaving the substrate outer surface (3 8b) intact. <EOS>