A multilayer structured element substrate for an ink discharge head including a heater layer in which a plurality of heaters are formed, and a first wiring layer in which a first common wiring configured to supply, from an outside, a voltage (VH) to the plurality of heaters is formed, comprising: an individual wiring formed in the first wiring layer and individually connected to each of the plurality of heaters; a first conductive plug provided between the heater layer and the first wiring layer and filling an interior of a first through-hole penetrating a first insulation layer that covers the first wiring layer; a second wiring layer formed in a layer on a side of the first wiring layer opposite to the heater layer; and a second conductive plug provided between the first wiring layer and the second wiring layer and filling an interior of a second through-hole penetrating a second insulation layer that covers the second wiring layer; a switching layer in which a plurality of switching elements connected to the plurality of heaters are formed in a layer on a side of the second wiring layer opposite to the first wiring layer; and a second common wiring configured to connect the plurality of switching elements to ground (GND), wherein each of the plurality of heaters is connected to the individual wiring via the first conductive plug, and the individual wiring is connected to the first common wiring via the second conductive plug and a wiring of the second wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole, wherein, (i) in a case that a through-hole has a circular planar shape in a planar view, the aspect ratio is a ratio of a height of the through-hole to a diameter of the through-hole, and, (ii) in a case that a through-hole has a slit shape in the planar view, the aspect ratio is a ratio of a height of the through-hole to a slit width of the through-hole. an individual wiring formed in the first wiring layer and individually connected to each of the plurality of heaters; a first conductive plug provided between the heater layer and the first wiring layer and filling an interior of a first through-hole penetrating a first insulation layer that covers the first wiring layer; a second wiring layer formed in a layer on a side of the first wiring layer opposite to the heater layer; and a second conductive plug provided between the first wiring layer and the second wiring layer and filling an interior of a second through-hole penetrating a second insulation layer that covers the second wiring layer; a switching layer in which a plurality of switching elements connected to the plurality of heaters are formed in a layer on a side of the second wiring layer opposite to the first wiring layer; and a second common wiring configured to connect the plurality of switching elements to ground (GND), wherein each of the plurality of heaters is connected to the individual wiring via the first conductive plug, and the individual wiring is connected to the first common wiring via the second conductive plug and a wiring of the second wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole, wherein, (i) in a case that a through-hole has a circular planar shape in a planar view, the aspect ratio is a ratio of a height of the through-hole to a diameter of the through-hole, and, (ii) in a case that a through-hole has a slit shape in the planar view, the aspect ratio is a ratio of a height of the through-hole to a slit width of the through-hole. (i) in a case that a through-hole has a circular planar shape in a planar view, the aspect ratio is a ratio of a height of the through-hole to a diameter of the through-hole, and, (ii) in a case that a through-hole has a slit shape in the planar view, the aspect ratio is a ratio of a height of the through-hole to a slit width of the through-hole. <EOS>