A camera module, said module comprising: a first Printed Circuit Board (PCB) ; a second Printed Circuit Board (PCB) spaced apart from the first PCB; and an outer shield supporting the first and second PCBs and adapted to shield the first and the second PCBs from electromagnetic interference; wherein the first PCB has a first PCB protrusion and a third PCB protrusion supported by the outer shield and the second PCB has a second PCB protrusion and a fourth protrusion supported by the outer shield , wherein the outer shield comprises a first lateral wall, a first through hole formed through the first lateral wall, a second through hole formed through the first lateral wall directly below the first through hole, and wherein at least a portion of the first PCB protrusion is disposed in the first through hole , and at least a portion of the second PCB protrusion is disposed in the second through hole, and wherein the outer shield further comprises a second lateral wall arranged opposite to the first lateral wall with respect to the first and second PCBs, a third through hole formed through the second lateral wall, a fourth through hole formed through the second lateral wall directly below the third through hole, and wherein at least a portion of the third PCB protrusion is disposed in the third through hole, and at least a portion of the fourth PCB protrusion is disposed in the fourth through hole, and wherein the first lateral wall comprises a first tension spring bent from the first lateral wall and disposed to face the first PCB protrusion passing through the first through hole , and a second tension spring bent from the first lateral wall and disposed to face the second PCB protrusion passing through the second through hole, the first tension spring and the second tension spring are monolithically formed with the first lateral wall. a first Printed Circuit Board (PCB) ; a second Printed Circuit Board (PCB) spaced apart from the first PCB; and an outer shield supporting the first and second PCBs and adapted to shield the first and the second PCBs from electromagnetic interference; wherein the first PCB has a first PCB protrusion and a third PCB protrusion supported by the outer shield and the second PCB has a second PCB protrusion and a fourth protrusion supported by the outer shield , wherein the outer shield comprises a first lateral wall, a first through hole formed through the first lateral wall, a second through hole formed through the first lateral wall directly below the first through hole, and wherein at least a portion of the first PCB protrusion is disposed in the first through hole , and at least a portion of the second PCB protrusion is disposed in the second through hole, and wherein the outer shield further comprises a second lateral wall arranged opposite to the first lateral wall with respect to the first and second PCBs, a third through hole formed through the second lateral wall, a fourth through hole formed through the second lateral wall directly below the third through hole, and wherein at least a portion of the third PCB protrusion is disposed in the third through hole, and at least a portion of the fourth PCB protrusion is disposed in the fourth through hole, and wherein the first lateral wall comprises a first tension spring bent from the first lateral wall and disposed to face the first PCB protrusion passing through the first through hole , and a second tension spring bent from the first lateral wall and disposed to face the second PCB protrusion passing through the second through hole, the first tension spring and the second tension spring are monolithically formed with the first lateral wall. <EOS>