mhurhangee/patent-ind-claim-en huggingface dataset:
A method for producing a separator for a power storage device comprising the following steps: a sheet casting step in which polypropylene, polyethylene and a plasticizer are extruded into a sheet using an extruder, cooled to solidification, and processed into a cast sheet; a stretching step in which the cast sheet is stretched to an area increase factor of 20 to 250 to form a stretched sheet; a microporous membrane forming step in which the plasticizer is extracted from the stretched sheet to form a microporous membrane; a heat treatment step in which the microporous membrane is subjected to heat treatment, and stretching and relaxation in the transverse direction to obtain a heat treated microporous membrane; and a winding step in which the heat treated microporous membrane is wound up, wherein the polyethylene is in powder form and the polypropylene is in pellet form; wherein the polyethylene/polypropylene weight ratio is 99/1 to 60/40. a sheet casting step in which polypropylene, polyethylene and a plasticizer are extruded into a sheet using an extruder, cooled to solidification, and processed into a cast sheet; a stretching step in which the cast sheet is stretched to an area increase factor of 20 to 250 to form a stretched sheet; a microporous membrane forming step in which the plasticizer is extracted from the stretched sheet to form a microporous membrane; a heat treatment step in which the microporous membrane is subjected to heat treatment, and stretching and relaxation in the transverse direction to obtain a heat treated microporous membrane; and a winding step in which the heat treated microporous membrane is wound up, wherein the polyethylene is in powder form and the polypropylene is in pellet form; wherein the polyethylene/polypropylene weight ratio is 99/1 to 60/40.
A semiconductor wafer having a plurality of semiconductor device die arranged in a grid pattern, the semiconductor wafer comprising: - a first semiconductor device die ; - a second semiconductor device die , neighboring the first semiconductor device die in the grid pattern and separated from the first semiconductor device die by a dicing lane ; and - a first conductor extending from a side of the first semiconductor device die into the dicing lane and extending toward the second semiconductor device die, entering the second semiconductor device die, and ending within a seal ring region of the second semiconductor device die, wherein the first conductor is formed such that a first region of the first conductor located nearer to the first semiconductor device die in the dicing lane has a lower tensile strength than a second region of the first conductor located nearer to the second semiconductor device die. - a first semiconductor device die ; - a second semiconductor device die , neighboring the first semiconductor device die in the grid pattern and separated from the first semiconductor device die by a dicing lane ; and - a first conductor extending from a side of the first semiconductor device die into the dicing lane and extending toward the second semiconductor device die, entering the second semiconductor device die, and ending within a seal ring region of the second semiconductor device die, wherein the first conductor is formed such that a first region of the first conductor located nearer to the first semiconductor device die in the dicing lane has a lower tensile strength than a second region of the first conductor located nearer to the second semiconductor device die.
A sequence detection method, comprising: Acquiring (S110) i-path data with the degree of parallelism i; forming (S120) an x-th detection data set by joining x-th i-path data and (x+1)-th i-path data; extracting (S130) s paths of data contiguously distributed in the detection data set within each of n detection windows to form n data segments; performing (S140) a correlation operation between each data segment and a local sequence; and determining (S150), according to a result of the correlation operation, whether a data segment is a target sequence, wherein x is an integer not less than 1, x is represented as an x-th input moment, x+1 is represented as an (x+1)-th input moment, and the (x+1)-th input moment is later than the x-th input moment, and i is an integer not less than 2, n is less than or equal to i, and s is an integer not less than 1 and equal to a bit number of the target sequence. Acquiring (S110) i-path data with the degree of parallelism i; forming (S120) an x-th detection data set by joining x-th i-path data and (x+1)-th i-path data; extracting (S130) s paths of data contiguously distributed in the detection data set within each of n detection windows to form n data segments; performing (S140) a correlation operation between each data segment and a local sequence; and determining (S150), according to a result of the correlation operation, whether a data segment is a target sequence, wherein x is an integer not less than 1, x is represented as an x-th input moment, x+1 is represented as an (x+1)-th input moment, and the (x+1)-th input moment is later than the x-th input moment, and i is an integer not less than 2, n is less than or equal to i, and s is an integer not less than 1 and equal to a bit number of the target sequence.
A method of dicing a semiconductor wafer or a substrate comprising a plurality of integrated circuits (ICs), the method comprising: forming a mask over the semiconductor wafer or the substrate covering the plurality of ICs, the plurality of ICs including metal bumps or pads with an oxidation layer; patterning the mask with a laser scribing process to provide a patterned mask with gaps, removing non-silicon materials and exposing a silicon substrate of the semiconductor wafer or the substrate between the ICs; and plasma etching the semiconductor wafer or the substrate through the gaps in the patterned mask to singulate the plurality of ICs and to simultaneously remove the oxidation layer from the metal bumps or pads . forming a mask over the semiconductor wafer or the substrate covering the plurality of ICs, the plurality of ICs including metal bumps or pads with an oxidation layer; patterning the mask with a laser scribing process to provide a patterned mask with gaps, removing non-silicon materials and exposing a silicon substrate of the semiconductor wafer or the substrate between the ICs; and plasma etching the semiconductor wafer or the substrate through the gaps in the patterned mask to singulate the plurality of ICs and to simultaneously remove the oxidation layer from the metal bumps or pads .
Electronic assembly comprising: • a first circuit carrier having a first mounting face for electronic components, • a second circuit carrier having a second mounting face for electronic components, wherein the second circuit carrier with the second mounting face faces the first mounting face of the first circuit carrier and is connected thereto, • at least one electronic component that is connected both to the first mounting face and also to the second mounting face , wherein the component is connected to the first mounting face and to the second mounting face in a firmly bonded manner, wherein the mounting faces each have contact pads so as to provide electrical contact with the at least one electronic component , and the first circuit carrier in a contact region that is formed between the first circuit carrier and the component is configured • in comparison to the first circuit carrier that is surrounding the contact region and • in comparison to the second circuit carrier so as to be elastic in the direction perpendicular with respect to the first mounting face , wherein the material of the first circuit carrier is thinner in the contact region in comparison to the circuit carrier that is surrounding the contact region , characterized in that the first circuit carrier is configured as a laminate having multiple layers that are laminated into the material of the first circuit carrier and wherein one of the layers forms the thinner contact region on which the contact pad together with the component is arranged. • a first circuit carrier having a first mounting face for electronic components, • a second circuit carrier having a second mounting face for electronic components, wherein the second circuit carrier with the second mounting face faces the first mounting face of the first circuit carrier and is connected thereto, • at least one electronic component that is connected both to the first mounting face and also to the second mounting face , wherein wherein the mounting faces each have contact pads so as to provide electrical contact with the at least one electronic component , and the first circuit carrier in a contact region that is formed between the first circuit carrier and the component is configured • in comparison to the first circuit carrier that is surrounding the contact region and • in comparison to the second circuit carrier so as to be elastic in the direction perpendicular with respect to the first mounting face , wherein
A cutting unit for the cutting of a substrate band for an aerosol-generating device, wherein the substrate band has a longitudinally-extending axis (X) and wherein the cutting unit comprises: feed means for feeding the substrate band along a feed direction (Y) parallel to the extension axis (X); and a cutting head comprising a cutting edge having a closed profile for cutting a substrate portion from the substrate band , which cutting head is movable in a movement direction (Z) transversal to the feed direction (Y) between a cutting position, in which it cuts the substrate portion , and a release position (A), in which it releases the substrate portion ; the cutting unit is characterised in that: it comprises conveying means , which are arranged and shaped so as to receive the substrate portion from the cutting head when the cutting head is in the release position (A), and convey the substrate portion towards an output section ; and the conveying means comprise a conveyor belt of the suction type and comprising a release segment at which it receives the substrate portion from the cutting head . feed means for feeding the substrate band along a feed direction (Y) parallel to the extension axis (X); and a cutting head comprising a cutting edge having a closed profile for cutting a substrate portion from the substrate band , which cutting head is movable in a movement direction (Z) transversal to the feed direction (Y) between a cutting position, in which it cuts the substrate portion , and a release position (A), in which it releases the substrate portion ; the cutting unit is characterised in that: it comprises conveying means , which are arranged and shaped so as to receive the substrate portion from the cutting head when the cutting head is in the release position (A), and convey the substrate portion towards an output section ; and the conveying means comprise a conveyor belt of the suction type and comprising a release segment at which it receives the substrate portion from the cutting head . it comprises conveying means , which are arranged and shaped so as to receive the substrate portion from the cutting head when the cutting head is in the release position (A), and convey the substrate portion towards an output section ; and the conveying means comprise a conveyor belt of the suction type and comprising a release segment at which it receives the substrate portion from the cutting head .
Sequential combustor for a gas turbine, comprising a premixing section and a combustion chamber arranged downstream of the premixing section , said premixing section being configured to receive and premix a flow of oxidant and fuel, said premixing section being arranged along one or more convergent ducts which are defined by respective passages formed between a plurality of vanes and comprising fuel injectors and mixing devices distributed along facing sidewalls of adjacent vanes ; wherein each vane has a converging side wall having an angle α of duct contraction which has a maximum value of 30° or less along the duct ; and the fuel injectors and the mixing devices are provided along the convergent ducts on facing sidewalls which form the convergent ducts ; wherein said combustor chamber comprises a diffuser section formed by one or more diverging ducts ; wherein said one or more divergent ducts are passages formed between said plurality of vanes and wherein each divergent duct is arranged downstream a convergent duct , said convergent and divergent ducts formed by a common vane-shaped passage; wherein said at least one divergent duct has an expansion vane angle β equal to 9° or greater.
Airbag module comprising an airbag with a controllable ventilation device, an inflator and a holding element for controlling said controllable ventilation device, said airbag comprising: an outer skin of the airbag, said outer skin having a first opening , a flap being at least indirectly attached to the outer skin , a tether having a first end being attached to the flap and a second end being detachably attached to the holding element , an additional layer , said additional layer having a second opening at least partially overlapping the first opening , and a connection connecting the additional layer and the flap to the outer skin , wherein the flap is located between the outer skin and the additional layer , wherein when the airbag is deployed and the tether is under tension, the flap covers the first opening at least partially such that the ventilation device is in a closed or throttled first state, and wherein when the airbag is deployed and the tether is not under tension, the flap covers the first opening less than in in the first state, such that the ventilation device is in second state, characterized in that the additional layer overlaps the flap only partially such that the additional layer has a section that does not cover the flap and that the flap has a section that is not covered by the additional layer , and in that the connection has at least one section that connects exclusively the flap to the outer skin and no section that connects both, the additional layer and the flap to the outer skin. an outer skin of the airbag, said outer skin having a first opening , a flap being at least indirectly attached to the outer skin , a tether having a first end being attached to the flap and a second end being detachably attached to the holding element , an additional layer , said additional layer having a second opening at least partially overlapping the first opening , and a connection connecting the additional layer and the flap to the outer skin , wherein the flap is located between the outer skin and the additional layer , wherein when the airbag is deployed and the tether is under tension, the flap covers the first opening at least partially such that the ventilation device is in a closed or throttled first state, and wherein when the airbag is deployed and the tether is not under tension, the flap covers the first opening less than in in the first state, such that the ventilation device is in second state, characterized in that the additional layer overlaps the flap only partially such that the additional layer has a section that does not cover the flap and that the flap has a section that is not covered by the additional layer , and in that the connection has at least one section that connects exclusively the flap to the outer skin and no section that connects both, the additional layer and the flap to the outer skin.
A method of monitoring a control signal in a wireless communication system, the method performed by a user equipment, UE, and comprising: based on an overlap between physical downlink control channel, PDCCH, monitoring occasions in a plurality of control resource sets, CORESETs, selecting at least one CORESET among the plurality of CORESETs; and monitoring at least one PDCCH only in the selected at least one CORESET among the plurality of CORESETs, wherein based on the selected at least one CORESET comprising a first CORESET, and based on a first reference signal of the first CORESET and a second reference signal of a second CORESET being related with a same synchronization signal/physical broadcast channel block, SSB: monitoring the at least one PDCCH in both the first CORESET and the second CORESET. based on an overlap between physical downlink control channel, PDCCH, monitoring occasions in a plurality of control resource sets, CORESETs, selecting at least one CORESET among the plurality of CORESETs; and monitoring at least one PDCCH only in the selected at least one CORESET among the plurality of CORESETs, wherein based on the selected at least one CORESET comprising a first CORESET, and based on a first reference signal of the first CORESET and a second reference signal of a second CORESET being related with a same synchronization signal/physical broadcast channel block, SSB: monitoring the at least one PDCCH in both the first CORESET and the second CORESET.
Device for fixing surgical implants in place comprising an anchoring device , a central body presenting an axially hollow upper zone , an axially hollow lower zone , said upper and lower zones forming a single body and being open at the bottom and at the top; a central through cavity extending inside said upper and lower zones, said upper zone comprising two portions (14.1, 14.2) projecting axially from said upper zone , divided from each other by two through U-shaped slots and forming, in conjunction with part of the central cavity, a channel for housing a connection rod, said lower zone comprising a slot for the lateral access to said central cavity of said anchoring device ; said slot having a conformation such as to permit the lateral insertion of said anchoring device inside said central cavity by means of the relative translation of the central body and the anchoring device and the axial alignment of said central body and said anchoring device ; said device presenting an insert suitable to limit the relative translation movement between the anchoring device and the central body , characterised in that the central body has grooves (14.1, 14.2) for access to a surface of the insert .
A compound of formula (I) wherein Xo is bromo, chloro or hydrogen; X 1 is hydrogen; X 2 is cyano; Q is a group selected from Q1, Q2, Q3, Q4 and Q5, where Q1 is a group of formula (IIa) where the substituents W1 are independently selected from hydrogen, halogen, cyano, nitro, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy, and n1 is 0, 1 or 2; Q2 is a group of formula (IIb) where W 2 is selected from hydrogen, halogen, cyano, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; Q3 is a group of formula (IIc) where W 3 is selected from hydrogen, halogen, cyano, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; Q4 is a group of formula (IId) where W 4 is selected from hydrogen, halogen, cyano, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; and Q5 is a group of formula (IIe) where W 5 is selected from hydrogen, halogen, cyano, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C4 alkoxy or C 1 -C 4 haloalkoxy; Y 1 and Y 2 are selected from Cl, Br, I, methyl, ethyl, methoxy, difluoromethoxy, and trifluoromethoxy; R 1 is selected from hydrogen or C 1 -C 2 alkyl; R 2 is selected from hydrogen or C 1 -C 2 alkyl; G 1 and G 2 are both oxygen, or an agrochemically acceptable salt or N-oxide thereof. Xo is bromo, chloro or hydrogen; X 1 is hydrogen; X 2 is cyano; Q is a group selected from Q1, Q2, Q3, Q4 and Q5, where Q1 is a group of formula (IIa) where the substituents W1 are independently selected from hydrogen, halogen, cyano, nitro, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy, and n1 is 0, 1 or 2; Q2 is a group of formula (IIb) where W 2 is selected from hydrogen, halogen, cyano, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; Q3 is a group of formula (IIc) where W 3 is selected from hydrogen, halogen, cyano, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; Q4 is a group of formula (IId) where W 4 is selected from hydrogen, halogen, cyano, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; and Q5 is a group of formula (IIe) where W 5 is selected from hydrogen, halogen, cyano, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C4 alkoxy or C 1 -C 4 haloalkoxy; Y 1 and Y 2 are selected from Cl, Br, I, methyl, ethyl, methoxy, difluoromethoxy, and trifluoromethoxy; R 1 is selected from hydrogen or C 1 -C 2 alkyl; R 2 is selected from hydrogen or C 1 -C 2 alkyl; G 1 and G 2 are both oxygen, or an agrochemically acceptable salt or N-oxide thereof.
A negative electrode slurry comprising: a lithium titanium oxide (LTO); a dispersant comprising a repeating unit derived from a monomer containing a polar OH group and a repeating unit derived from a monomer containing a non-polar alkyl group in a molecular structure of the dispersant; a binder; and an organic solvent; wherein the negative electrode slurry satisfies Equation 1: A B ⋅ C ≥ 0.06 wherein, in Equation 1, A is an amount (wt%) of a repeating unit derived from a monomer containing the polar OH group in the dispersant, B is a weight-average molecular weight (Kg/mol) of the dispersant, and C is a weight (parts by weight) of the dispersant based on 100 parts by weight of the lithium titanium oxide. a lithium titanium oxide (LTO); a dispersant comprising a repeating unit derived from a monomer containing a polar OH group and a repeating unit derived from a monomer containing a non-polar alkyl group in a molecular structure of the dispersant; a binder; and an organic solvent; wherein the negative electrode slurry satisfies Equation 1: A B ⋅ C ≥ 0.06 wherein, in Equation 1, A is an amount (wt%) of a repeating unit derived from a monomer containing the polar OH group in the dispersant, B is a weight-average molecular weight (Kg/mol) of the dispersant, and C is a weight (parts by weight) of the dispersant based on 100 parts by weight of the lithium titanium oxide.
A transmission device , comprising: an information inserting unit configured to insert, into a SupplementaryDescriptor or an audio user data descriptor of a Media Presentation Description, MPD, metafile, identification information in the form of a descriptor indicating whether or not metadata is inserted into an audio stream; and a transmitting unit configured to transmit the MPD metafile including meta information for a reception device to acquire the audio stream into which the metadata is inserted. an information inserting unit configured to insert, into a SupplementaryDescriptor or an audio user data descriptor of a Media Presentation Description, MPD, metafile, identification information in the form of a descriptor indicating whether or not metadata is inserted into an audio stream; and a transmitting unit configured to transmit the MPD metafile including meta information for a reception device to acquire the audio stream into which the metadata is inserted.