mhurhangee/patent-ind-claim-en huggingface dataset:
A plastic injection molding machine, of the type comprising at least the following components: - A stationary central platen with at least two molding faces on at least two opposite sides of said central platen, and connected to an injection unit that provides the molding material, - Two mobile platens , located on each side of the stationary central platen and movable on a same linear axis in order to face the molding faces , each mobile platen comprising at least - a pressure plate facing the molding face , - a mobile plate , - at least one hydraulic chamber , responsible for pushing the pressure plate to carry out a uniformly distributed clamping force against the molding face of the stationary central platen , characterized by he chamber being located between the mobile plate and the pressure plate , connected to a hydraulic system through at least one duct for the insertion and evacuation of a fluid in said chamber in controlled flow and/or pressure conditions, - a locking system that prevents the linear movement of the mobile plates when the clamping force is applied, - a movement system of said mobile platens . - A stationary central platen with at least two molding faces on at least two opposite sides of said central platen, and connected to an injection unit that provides the molding material, - Two mobile platens , located on each side of the stationary central platen and movable on a same linear axis in order to face the molding faces , each mobile platen comprising at least - a pressure plate facing the molding face , - a mobile plate , - at least one hydraulic chamber , responsible for pushing the pressure plate to carry out a uniformly distributed clamping force against the molding face of the stationary central platen , characterized by he chamber being located between the mobile plate and the pressure plate , connected to a hydraulic system through at least one duct for the insertion and evacuation of a fluid in said chamber in controlled flow and/or pressure conditions, - a locking system that prevents the linear movement of the mobile plates when the clamping force is applied, - a movement system of said mobile platens .
A method of etching one or more of mixed metal and dielectric layer, from an area on the semiconductor device , where the method comprising; defining an area on a semiconductor device to be etched, the area including at least several layers composed of mixed metal and dielectric combined in a semiconductor device ; directing first etching agent toward a defined area on a semiconductor device where the first etching agent comprises the core structure -COO-, -CON-, or -CNN- and further comprises oxidizing element selected from a group fluorine, chlorine, oxygen, nitrogen and reducing element which is carbon in ratio, wherein the quantity of oxidizing elements is one element more than the quantity of reducing elements and the quantity of reducing elements is at most three; and directing an ion beam toward a defined area on a semiconductor device in the presence of the first etching agent , thereby removing at least a portion of mixed metal and dielectric layer and producing a recess with at least one substantially smooth and planar surface in the milled area on object. defining an area on a semiconductor device to be etched, the area including at least several layers composed of mixed metal and dielectric combined in a semiconductor device ; directing first etching agent toward a defined area on a semiconductor device where the first etching agent comprises the core structure -COO-, -CON-, or -CNN- and further comprises oxidizing element selected from a group fluorine, chlorine, oxygen, nitrogen and reducing element which is carbon in ratio, wherein the quantity of oxidizing elements is one element more than the quantity of reducing elements and the quantity of reducing elements is at most three; and directing an ion beam toward a defined area on a semiconductor device in the presence of the first etching agent , thereby removing at least a portion of mixed metal and dielectric layer and producing a recess with at least one substantially smooth and planar surface in the milled area on object.
Optical resonator system , comprising: a multi-strip waveguide structure having a plurality of spaced semiconductor strips (122-#) for guiding an IR radiation (R IR ), a STP resonance structure (STP = slab tamm-plasmon-polariton), wherein the STP resonance structure is implemented as a Bragg mirror structure laterally extending in the system plane, and wherein the STP resonance structure comprises an alternating arrangement of semiconductor strips (142-#) and interjacent dielectric strips (144-#) and comprises a metal strip adjacent to the semiconductor strip (142-2) at a boundary region (140-1) of the STP resonance structure , wherein the metal strip and the adjacent semiconductor strip (142-2) are arranged to provide a metal-semiconductor interface (146-A) at the boundary region (140-1) of the STP resonance structure , and wherein the semiconductor strips (122-#) of the multi-strip waveguide structure and the semiconductor strips (142-#) of the STP resonance structure are arranged perpendicular to each other in a common system plane (180-A), and an optical coupling structure having a semiconductor layer , wherein the semiconductor layer is arranged between the multi-strip waveguide structure and the STP resonance structure for optically coupling the IR radiation (R IR ) between the multi-strip waveguide structure and the STP resonance structure . a multi-strip waveguide structure having a plurality of spaced semiconductor strips (122-#) for guiding an IR radiation (R IR ), a STP resonance structure (STP = slab tamm-plasmon-polariton), wherein the STP resonance structure is implemented as a Bragg mirror structure laterally extending in the system plane, and wherein the STP resonance structure comprises an alternating arrangement of semiconductor strips (142-#) and interjacent dielectric strips (144-#) and comprises a metal strip adjacent to the semiconductor strip (142-2) at a boundary region (140-1) of the STP resonance structure , wherein the metal strip and the adjacent semiconductor strip (142-2) are arranged to provide a metal-semiconductor interface (146-A) at the boundary region (140-1) of the STP resonance structure , and wherein the semiconductor strips (122-#) of the multi-strip waveguide structure and the semiconductor strips (142-#) of the STP resonance structure are arranged perpendicular to each other in a common system plane (180-A), and wherein the metal strip and the adjacent semiconductor strip (142-2) are arranged to provide a metal-semiconductor interface (146-A) at the boundary region (140-1) of the STP resonance structure , and wherein the semiconductor strips (122-#) of the multi-strip waveguide structure and the semiconductor strips (142-#) of the STP resonance structure are arranged perpendicular to each other in a common system plane (180-A), and an optical coupling structure having a semiconductor layer , wherein the semiconductor layer is arranged between the multi-strip waveguide structure and the STP resonance structure for optically coupling the IR radiation (R IR ) between the multi-strip waveguide structure and the STP resonance structure .
A connector system comprising: a female portion having a base body , a channel with a longitudinal opening along one side of the base body , and a protrusion located on the base body and extending into the channel , wherein the channel has a width that is greater than a width of the opening ; a male portion having a base body with a locking portion extending along one longitudinal edge, the locking portion comprising a flange having a width that is greater than a width of the opening in the female portion , characterised in that the male portion has a spring extending along and distanced from the flange, the spring having an aperture for receiving the protrusion ; and an actuating device connected to the spring and being configured for depressing the spring ; wherein the male portion is connected to the female portion by sliding the flange into the channel until the protrusion extends through the aperture in the spring , and the male portion is released from the female portion by pulling the actuating device to depress the spring until the protrusion exits the aperture , and sliding the male portion out of the channel . a female portion having a base body , a channel with a longitudinal opening along one side of the base body , and a protrusion located on the base body and extending into the channel , wherein the channel has a width that is greater than a width of the opening ; a male portion having a base body with a locking portion extending along one longitudinal edge, the locking portion comprising a flange having a width that is greater than a width of the opening in the female portion , characterised in that the male portion has a spring extending along and distanced from the flange, the spring having an aperture for receiving the protrusion ; and an actuating device connected to the spring and being configured for depressing the spring ; wherein the male portion is connected to the female portion by sliding the flange into the channel until the protrusion extends through the aperture in the spring , and the male portion is released from the female portion by pulling the actuating device to depress the spring until the protrusion exits the aperture , and sliding the male portion out of the channel .
A light radiation emitting device comprising: - at least one LED-type device capable of generating a light radiation in a predefined wavelength range and comprising at least two electrical contact pads ; - a support delimited by opposite first and second sides defining together a thickness of the support , said support supporting at least said LED-type device and at least one electrically-conductive track; - the electric track is formed of conductive wires , all or part of the conductive wires having at least one contact portion exposed towards at least one of the first and second sides of the support ; - each of the contact pads of the LED-type device is positioned opposite a contact portion of one of the conductive wires and is electrically connected to said contact portion ; characterized in that : - the LED-type device is formed of a substrate comprising at least one reception structure and at least one pair of connection structures , the reception structure receiving at least one LED chip or module, each connection structure being formed of at least a first portion forming one block with a second portion , said first portion being electrically coupled to one of the electrodes of the LED chip or module, and the second portion forming one of said contact pads connected to one of the contact portions of one of the conductive wires of the conductive track; - each conductive wire is embedded within the thickness of the support from an embedment surface formed by the first or the second side of the support ; - the contact portions of each conductive wire are available to be electrically connected. - at least one LED-type device capable of generating a light radiation in a predefined wavelength range and comprising at least two electrical contact pads ; - a support delimited by opposite first and second sides defining together a thickness of the support , said support supporting at least said LED-type device and at least one electrically-conductive track; - the electric track is formed of conductive wires , all or part of the conductive wires having at least one contact portion exposed towards at least one of the first and second sides of the support ; - each of the contact pads of the LED-type device is positioned opposite a contact portion of one of the conductive wires and is electrically connected to said contact portion ; - the LED-type device is formed of a substrate comprising at least one reception structure and at least one pair of connection structures , the reception structure receiving at least one LED chip or module, each connection structure being formed of at least a first portion forming one block with a second portion , said first portion being electrically coupled to one of the electrodes of the LED chip or module, and the second portion forming one of said contact pads connected to one of the contact portions of one of the conductive wires of the conductive track; - each conductive wire is embedded within the thickness of the support from an embedment surface formed by the first or the second side of the support ; - the contact portions of each conductive wire are available to be electrically connected.
A surface texture of an engine component comprising: multiple dimples of a first geometry on an interior surface of the engine component, multiple dimples of a second geometry that has a smaller surface area than the multiple dimples of the first geometry on the interior surface of the engine component, wherein the first geometry comprises a circle and the second geometry comprises an onto the ellipse, wherein the circular-shaped and elliptical-shaped dimples are incorporated surface to form a pattern with alternating of circle and ellipse with defined areal density, wherein a depth of the multiple circular-shaped dimples is between one micron to eight microns, and a depth of the multiple elliptical-shaped dimples is between one micron to are smaller and deeper eight microns, wherein the multiple elliptical-shaped dimples than the multiple circular-shaped dimples, wherein a size of the circular-shaped dimples and elliptical-shaped dimples is from few microns up to hundreds of microns. multiple dimples of a first geometry on an interior surface of the engine component, multiple dimples of a second geometry that has a smaller surface area than the multiple dimples of the first geometry on the interior surface of the engine component, wherein the first geometry comprises a circle and the second geometry comprises an onto the ellipse, wherein the circular-shaped and elliptical-shaped dimples are incorporated surface to form a pattern with alternating of circle and ellipse with defined areal density, wherein a depth of the multiple circular-shaped dimples is between one micron to eight microns, and a depth of the multiple elliptical-shaped dimples is between one micron to are smaller and deeper eight microns, wherein the multiple elliptical-shaped dimples than the multiple circular-shaped dimples, wherein a size of the circular-shaped dimples and elliptical-shaped dimples is from few microns up to hundreds of microns.
A vehicle headlamp comprising: a light source ; a projection lens that is disposed in front of the light source and which projects light from the light source to the front; a first shield member that is disposed near a rear focal point (F2) of the projection lens and which can switch light distribution patterns between at least one of a right high beam light distribution pattern (HiCR) and a left high beam light distribution pattern (HiCL) in both of which light from the light source is partially cut off and at least one of a normal high beam light distribution pattern (HiC) in which no part of light from the light source is cut off and a low beam pattern; characterized in that a second shield member is disposed in a forward position or rearward position away from the rear focal point (F2) of the projection lens and cuts off light of a high beam which illuminates an upper area (FA), such that a boundary between an illuminated area and an unilluminated area blurs in the upper area (FA) of the high beam. a light source ; a projection lens that is disposed in front of the light source and which projects light from the light source to the front; a first shield member that is disposed near a rear focal point (F2) of the projection lens and which can switch light distribution patterns between at least one of a right high beam light distribution pattern (HiCR) and a left high beam light distribution pattern (HiCL) in both of which light from the light source is partially cut off and at least one of a normal high beam light distribution pattern (HiC) in which no part of light from the light source is cut off and a low beam pattern; characterized in that a second shield member is disposed in a forward position or rearward position away from the rear focal point (F2) of the projection lens and cuts off light of a high beam which illuminates an upper area (FA), such that a boundary between an illuminated area and an unilluminated area blurs in the upper area (FA) of the high beam.
An implantable medical device comprising a metal basal body and a polymer film layer covering the surface of the metal basal body for preventing endothelium growth and for covering the surface, comprising a transitional body located between the metal basal body and the polymer film layer, which covers at least part of the surface of the metal basal body, wherein the transitional body connects the polymer film layer and the metal basal body, characterized in that the transitional body comprises amorphous carbon, and the transitional body and metal basal body are covered with the polymer film layer by chemical vapor deposition.
A method of printing a digital image resulting in an elevated print on a support , said elevated print having a surface of varying height, by a printing system configured to print a number of pass images on top of each other in a number of passes, the method comprising the steps of: - defining (S1) the digital image comprising color data for each pixel of the digital image and height data for indicating a height of each pixel of the digital image, - a raster image processor connected to the printing system rasterizing (S2) the digital image into a raster image, - a digital slicer connected to the printing system deriving (S7) from the raster image a number of pass images to be printed on top of each other, and - printing (S8) the pass images on top of each other by applying a number of recording materials on the support, characterized in that the method comprises the steps of - receiving (S4) digital information related to the print order of the recording materials in the pass images for each pixel, - transferring (S5) the digital information to the digital slicer - deriving (S6) from the digital information the print order of the recording materials in the pass images for each pixel, and - applying (S8) the recording materials for each pixel for each pass image derived by the digital slicer, wherein the step of transferring the digital information to the digital slicer comprises the sub-step of the raster image processor receiving the digital information and transferring the digital information unchanged to the digital slicer by using a spot color image (SPOT1) comprising a QR code or a URL at which details of the digital information are stored. - defining (S1) the digital image comprising color data for each pixel of the digital image and height data for indicating a height of each pixel of the digital image, - a raster image processor connected to the printing system rasterizing (S2) the digital image into a raster image, - a digital slicer connected to the printing system deriving (S7) from the raster image a number of pass images to be printed on top of each other, and - printing (S8) the pass images on top of each other by applying a number of recording materials on the support, - receiving (S4) digital information related to the print order of the recording materials in the pass images for each pixel, - transferring (S5) the digital information to the digital slicer - deriving (S6) from the digital information the print order of the recording materials in the pass images for each pixel, and - applying (S8) the recording materials for each pixel for each pass image derived by the digital slicer, wherein the step of transferring the digital information to the digital slicer comprises the sub-step of the raster image processor receiving the digital information and transferring the digital information unchanged to the digital slicer by using a spot color image (SPOT1) comprising a QR code or a URL at which details of the digital information are stored.
A method of compressing mass spectral data, the method comprising: receiving a first signal output from an ion detector of a mass spectrometer ; processing the first signal to a digital signal, and processing the digital signal to data frames representative of the first signal; temporarily storing the data frames in a memory block ; and reading a data frame from the memory block and determining its data frame type and according to its data frame type compressing the data frame according to one or more compression algorithms to generate a compressed data output stream, characterised in that : the one or more compression algorithms include for each data point, estimating the maximum intensity of a hypothetical mass spectral peak at the data point by calculating the width of a real mass spectral peak of which the data point forms a part, the width measured in a number n of data points and summing intensities of n data points adjacent to said data point; and discarding the data point if the hypothetical mass spectral peak is beneath the predetermined threshold intensity. receiving a first signal output from an ion detector of a mass spectrometer ; processing the first signal to a digital signal, and processing the digital signal to data frames representative of the first signal; temporarily storing the data frames in a memory block ; and reading a data frame from the memory block and determining its data frame type and according to its data frame type compressing the data frame according to one or more compression algorithms to generate a compressed data output stream, characterised in that : the one or more compression algorithms include for each data point, estimating the maximum intensity of a hypothetical mass spectral peak at the data point by calculating the width of a real mass spectral peak of which the data point forms a part, the width measured in a number n of data points and summing intensities of n data points adjacent to said data point; and discarding the data point if the hypothetical mass spectral peak is beneath the predetermined threshold intensity.
An underwater steel catenary pipeline riser (SCR) lifting frame , comprising: a. a lift frame foundation for disposal subsea, comprising an SCR mating surface configured to be connected to an SCR receptacle ; and b. an SCR lifting frame for disposal subsea, comprising: i. a lift frame interface adapted to operatively connect the SCR lifting frame to the lift frame foundation; ii. a foundation interface ; iii. a predetermined set of lifting frame securing fasteners connected to the frame interface and configured to secure the SCR lifting frame to a subsea structure ; iv. a lift guide configured to accept the lift frame foundation; and v. a lift slidably disposed about the lift guide, the lift comprising an SCR pull head interface configured to be connected to an SCR pull head . a. a lift frame foundation for disposal subsea, comprising an SCR mating surface configured to be connected to an SCR receptacle ; and b. an SCR lifting frame for disposal subsea, comprising: i. a lift frame interface adapted to operatively connect the SCR lifting frame to the lift frame foundation; ii. a foundation interface ; iii. a predetermined set of lifting frame securing fasteners connected to the frame interface and configured to secure the SCR lifting frame to a subsea structure ; iv. a lift guide configured to accept the lift frame foundation; and v. a lift slidably disposed about the lift guide, the lift comprising an SCR pull head interface configured to be connected to an SCR pull head . i. a lift frame interface adapted to operatively connect the SCR lifting frame to the lift frame foundation; ii. a foundation interface ; iii. a predetermined set of lifting frame securing fasteners connected to the frame interface and configured to secure the SCR lifting frame to a subsea structure ; iv. a lift guide configured to accept the lift frame foundation; and v. a lift slidably disposed about the lift guide, the lift comprising an SCR pull head interface configured to be connected to an SCR pull head .