A laser processing machine comprising: a laser oscillating unit ; a polarization rotator unit ; a beam rotator unit ; a condensing optical system ; a rotational driving unit ; and a controlling unit , wherein the laser oscillating unit is configured to emit a linearly polarized laser beam, the laser beam emitted from the laser oscillating unit is configured to be applied to a workpiece via the polarization rotator unit , the beam rotator unit , and the condensing optical system , the polarization rotator unit comprises a wave plate and a first rotation mechanism , the wave plate is configured to change a polarization direction of the laser beam, the first rotation mechanism is configured to rotate the wave plate , the beam rotator unit comprises an irradiation angle adjusting optical system and a second rotation mechanism , the condensing optical system is configured to condense the laser beam on the workpiece, characterized in that the polarization rotator unit and the beam rotator unit are arranged between the laser oscillating unit and the condensing optical system , the irradiation angle adjusting optical system is configured to adjust an irradiation angle of the laser beam to the workpiece by making an incident laser beam eccentric to output and making the laser beam incident on the condensing optical system at a position eccentric from a central axis thereof, the second rotation mechanism is configured to rotate the irradiation angle adjusting optical system, the rotational driving unit supplies rotational driving force to the first rotation mechanism and the second rotation mechanism , the controlling unit is configured to control a rotational speed ratio between the first rotation mechanism and the second rotation mechanism , and a polarized state of the laser beam is configured to be adjusted by controlling the rotational speed ratio. a laser oscillating unit ; a polarization rotator unit ; a beam rotator unit ; a condensing optical system ; a rotational driving unit ; and a controlling unit , wherein the laser oscillating unit is configured to emit a linearly polarized laser beam, the laser beam emitted from the laser oscillating unit is configured to be applied to a workpiece via the polarization rotator unit , the beam rotator unit , and the condensing optical system , the polarization rotator unit comprises a wave plate and a first rotation mechanism , the wave plate is configured to change a polarization direction of the laser beam, the first rotation mechanism is configured to rotate the wave plate , the beam rotator unit comprises an irradiation angle adjusting optical system and a second rotation mechanism , the condensing optical system is configured to condense the laser beam on the workpiece, characterized in that the polarization rotator unit and the beam rotator unit are arranged between the laser oscillating unit and the condensing optical system , the irradiation angle adjusting optical system is configured to adjust an irradiation angle of the laser beam to the workpiece by making an incident laser beam eccentric to output and making the laser beam incident on the condensing optical system at a position eccentric from a central axis thereof, the second rotation mechanism is configured to rotate the irradiation angle adjusting optical system, the rotational driving unit supplies rotational driving force to the first rotation mechanism and the second rotation mechanism , the controlling unit is configured to control a rotational speed ratio between the first rotation mechanism and the second rotation mechanism , and a polarized state of the laser beam is configured to be adjusted by controlling the rotational speed ratio. <EOS>