Method for producing an electronic assembly , in particular for a transmission control module, comprising the following steps: providing a printed circuit board having a first side and a second side , facing away from the first side , and having at least one first electronic component arranged on the first side of the printed circuit board ; arranging the printed circuit board with the second side at least partially on a reference surface ; applying a sealing material of high viscosity that is not flowable prior to being cured to the first side , wherein the sealing material does not flow after being applied, so that the area covered by the sealing material does not change after application to the first side of the printed circuit board and before the pressing in of a second component , and wherein the sealing material is applied in such a way that the sealing material surrounds a sub-region of the first side of the printed circuit board ; arranging a second component at least partially on the reference surface in such a way that the second component is partially pressed into the sealing material ; wherein the step of arranging the second component is performed after the step of applying the non-flowable sealing material ; electrically connecting the second component to the printed circuit board by means of an electrical connecting line ; applying a covering material , in particular a covering material that is flowable prior to being cured, to the sub-region of the first side of the printed circuit board that is surrounded by the sealing material and to the first component ; curing the sealing material ; and curing the covering material . providing a printed circuit board having a first side and a second side , facing away from the first side , and having at least one first electronic component arranged on the first side of the printed circuit board ; arranging the printed circuit board with the second side at least partially on a reference surface ; applying a sealing material of high viscosity that is not flowable prior to being cured to the first side , wherein the sealing material does not flow after being applied, so that the area covered by the sealing material does not change after application to the first side of the printed circuit board and before the pressing in of a second component , and wherein the sealing material is applied in such a way that the sealing material surrounds a sub-region of the first side of the printed circuit board ; arranging a second component at least partially on the reference surface in such a way that the second component is partially pressed into the sealing material ; wherein the step of arranging the second component is performed after the step of applying the non-flowable sealing material ; electrically connecting the second component to the printed circuit board by means of an electrical connecting line ; applying a covering material , in particular a covering material that is flowable prior to being cured, to the sub-region of the first side of the printed circuit board that is surrounded by the sealing material and to the first component ; curing the sealing material ; and curing the covering material . <EOS>