An electronic device , wherein the electronic device comprises: a metal member , wherein a through hole or slot is disposed on the metal member , and the metal member is a stamped metal member or a forged metal member ; a circuit board , wherein an electronic component is disposed on the circuit board ; and a shielding member , wherein the shielding member comprises a blocking portion and an enclosing portion , the blocking portion is made of an electrically conductive plastic material, the enclosing portion is made of a metal material or an electrically conductive plastic material; the blocking portion is configured to block the through hole or slot , the enclosing portion is disposed around the electronic component , one end of the enclosing portion is electrically connected to the metal member , and the other end of the enclosing portion is electrically connected to ground copper of the circuit board ; wherein the metal member , the enclosing portion , and the circuit board form a shielding space, and the electronic component is located in the shielding space; or the metal member , the blocking portion , the enclosing portion , and the circuit board form a shielding space, and the electronic component is located in the shielding space, wherein the shielding member further comprises a buckling portion connected to the blocking portion , and the buckling portion is buckled in the through hole or slot , and a fastening portion connected to the buckling portion , and a size of the fastening portion is greater than a size of the through hole or slot , wherein an electrically conductive elastic member is disposed between the enclosing portion and the circuit board or between the enclosing portion and the metal member . a metal member , wherein a through hole or slot is disposed on the metal member , and the metal member is a stamped metal member or a forged metal member ; a circuit board , wherein an electronic component is disposed on the circuit board ; and a shielding member , wherein the shielding member comprises a blocking portion and an enclosing portion , the blocking portion is made of an electrically conductive plastic material, the enclosing portion is made of a metal material or an electrically conductive plastic material; the blocking portion is configured to block the through hole or slot , the enclosing portion is disposed around the electronic component , one end of the enclosing portion is electrically connected to the metal member , and the other end of the enclosing portion is electrically connected to ground copper of the circuit board ; wherein the metal member , the enclosing portion , and the circuit board form a shielding space, and the electronic component is located in the shielding space; or the metal member , the blocking portion , the enclosing portion , and the circuit board form a shielding space, and the electronic component is located in the shielding space, wherein the shielding member further comprises a buckling portion connected to the blocking portion , and the buckling portion is buckled in the through hole or slot , and a fastening portion connected to the buckling portion , and a size of the fastening portion is greater than a size of the through hole or slot , wherein an electrically conductive elastic member is disposed between the enclosing portion and the circuit board or between the enclosing portion and the metal member . <EOS>