A MEMS sensing device (200, 200', 200", 200′′′; 300; 350; 400) for sensing microparticles in an environment external to the MEMS sensing device, the MEMS sensing device comprising: a semiconductor body integrating a sensor and a pump (205; 205 , 205 ; 205 (a), 205 (b), 205 (a), 205 (b)); wherein the sensor includes a sensor cavity , a membrane suspended over the sensor cavity , and a piezoelectric element located over the membrane and configured to cause the membrane to oscillate about an equilibrium position and at a resonance frequency when sensing electric signals are applied to the piezoelectric element during a first operative phase of the MEMS sensing device, the resonance frequency depending on an amount of microparticles located on the membrane; wherein the membrane includes a plurality of through holes configured to establish a fluid communication between the sensor cavity and the environment; and wherein the pump (205; 205 , 205 ; 205 (a), 205 (b), 205 (a), 205 (b)) is adjacent to the sensor , is connected to the sensor through a duct extending in the semiconductor body and is configured to cause air pressure in the sensor cavity to be reduced with respect to the air pressure of the environment during the first operative phase, such that microparticles are caused to adhere onto the membrane by a suction force through the plurality of through holes , and to cause air pressure in the sensor cavity to be increased with respect to the air pressure of the environment during a second operative phase, such that microparticles are caused to be blown away from the membrane by a blowing force through the plurality of through holes , thereby cleaning the membrane . a semiconductor body integrating a sensor and a pump (205; 205 , 205 ; 205 (a), 205 (b), 205 (a), 205 (b)); wherein the sensor includes a sensor cavity , a membrane suspended over the sensor cavity , and a piezoelectric element located over the membrane and configured to cause the membrane to oscillate about an equilibrium position and at a resonance frequency when sensing electric signals are applied to the piezoelectric element during a first operative phase of the MEMS sensing device, the resonance frequency depending on an amount of microparticles located on the membrane; wherein the membrane includes a plurality of through holes configured to establish a fluid communication between the sensor cavity and the environment; and wherein the pump (205; 205 , 205 ; 205 (a), 205 (b), 205 (a), 205 (b)) is adjacent to the sensor , is connected to the sensor through a duct extending in the semiconductor body and is configured to cause air pressure in the sensor cavity to be reduced with respect to the air pressure of the environment during the first operative phase, such that microparticles are caused to adhere onto the membrane by a suction force through the plurality of through holes , and to cause air pressure in the sensor cavity to be increased with respect to the air pressure of the environment during a second operative phase, such that microparticles are caused to be blown away from the membrane by a blowing force through the plurality of through holes , thereby cleaning the membrane . <EOS>