mhurhangee/patent-ind-claim-en huggingface dataset:
A power semiconductor module arrangement comprising: a substrate comprising a dielectric insulation layer , and a first metallization layer attached to the dielectric insulation layer ; at least one semiconductor body mounted on the first metallization layer ; and a first layer comprising an encapsulant , the first layer being arranged on the substrate and covering the first metallization layer and the at least one semiconductor body , wherein the first layer is configured to release liquid or oil at temperatures exceeding a defined threshold temperature, characterized in that at least one of the following applies: the viscosity of the liquid or oil released from the encapsulant is lower than 1 mPas; and a surface tension of the liquid or oil released from the encapsulant at room temperature is less than 25 mNm -1 . a substrate comprising a dielectric insulation layer , and a first metallization layer attached to the dielectric insulation layer ; at least one semiconductor body mounted on the first metallization layer ; and a first layer comprising an encapsulant , the first layer being arranged on the substrate and covering the first metallization layer and the at least one semiconductor body , wherein the first layer is configured to release liquid or oil at temperatures exceeding a defined threshold temperature, characterized in that at least one of the following applies: the viscosity of the liquid or oil released from the encapsulant is lower than 1 mPas; and a surface tension of the liquid or oil released from the encapsulant at room temperature is less than 25 mNm -1 . the viscosity of the liquid or oil released from the encapsulant is lower than 1 mPas; and a surface tension of the liquid or oil released from the encapsulant at room temperature is less than 25 mNm -1 .
An orientation system for installation on a vehicle, the orientation system comprising: an orientation sensor configured to generate orientation data; a distance sensor (102, 102-102d, 302a-N, 304a-304N) configured to generate relative distance data measuring relative distances to objects external to the vehicle; and a vehicle processing unit configured to receive the orientation data from the orientation sensor and the relative distance data from the distance sensor (102, 102-102d, 302a-N, 304a-304N), wherein the vehicle processing unit detects orientation errors based on the relative distance data, wherein the vehicle processing unit is configured to detect planar surfaces based on the received relative distance data and to define one or more axes associated with the detected planar surface, characterised in that the vehicle processing unit compares an orientation axis derived from the orientation data to the one or more axes associated with the detected planar surface, wherein the vehicle processing unit generates orientation feedback in response to a variance between the compared axes being less than a threshold value. an orientation sensor configured to generate orientation data; a distance sensor (102, 102-102d, 302a-N, 304a-304N) configured to generate relative distance data measuring relative distances to objects external to the vehicle; and a vehicle processing unit configured to receive the orientation data from the orientation sensor and the relative distance data from the distance sensor (102, 102-102d, 302a-N, 304a-304N), wherein the vehicle processing unit detects orientation errors based on the relative distance data, wherein the vehicle processing unit is configured to detect planar surfaces based on the received relative distance data and to define one or more axes associated with the detected planar surface, characterised in that the vehicle processing unit compares an orientation axis derived from the orientation data to the one or more axes associated with the detected planar surface, wherein the vehicle processing unit generates orientation feedback in response to a variance between the compared axes being less than a threshold value.
A heat dissipation apparatus comprising: a base and a plurality of first heat sink fins arranged in parallel on the base; characterized in that : on a top of each first heat sink fin of the plurality of first heat sink fins , a first heat dissipation component and a second heat dissipation component are sequentially arranged along the parallel direction of the plurality of first heat sink fins; the first heat dissipation component comprises a bottom plate and a plurality of second heat sink fins which are arranged at intervals along the parallel direction on a top face of the bottom plate , wherein each second heat sink fin has a shape of a comb having three or more comb teeth; and the second heat dissipation component comprises a plurality of third heat sink fins which are arranged at intervals along the parallel direction, wherein each third heat sink fin has a shape of a comb having three or more comb teeth. a base and a plurality of first heat sink fins arranged in parallel on the base; characterized in that : on a top of each first heat sink fin of the plurality of first heat sink fins , a first heat dissipation component and a second heat dissipation component are sequentially arranged along the parallel direction of the plurality of first heat sink fins; the first heat dissipation component comprises a bottom plate and a plurality of second heat sink fins which are arranged at intervals along the parallel direction on a top face of the bottom plate , wherein each second heat sink fin has a shape of a comb having three or more comb teeth; and the second heat dissipation component comprises a plurality of third heat sink fins which are arranged at intervals along the parallel direction, wherein each third heat sink fin has a shape of a comb having three or more comb teeth. on a top of each first heat sink fin of the plurality of first heat sink fins , a first heat dissipation component and a second heat dissipation component are sequentially arranged along the parallel direction of the plurality of first heat sink fins; the first heat dissipation component comprises a bottom plate and a plurality of second heat sink fins which are arranged at intervals along the parallel direction on a top face of the bottom plate , wherein each second heat sink fin has a shape of a comb having three or more comb teeth; and the second heat dissipation component comprises a plurality of third heat sink fins which are arranged at intervals along the parallel direction, wherein each third heat sink fin has a shape of a comb having three or more comb teeth.
A catheter comprising: an elongated catheter body extending along a longitudinal axis, the elongated catheter body having a proximal end and a distal end; a flexible wire assembly positioned at the distal end of the elongated catheter body formed from a shape memory material, the flexible wire assembly having a plurality of flexible wires , each flexible wire having a proximal end and a distal end and wherein at least one of the flexible wires has a variable cross-section; a plurality of spines formed from the plurality of flexible wires; and a plurality of electrodes and cabling attached to each spine, wherein the distal ends of the plurality of flexible wires are joined at a distal hub to form a basket-shaped multi-electrode device, wherein the at least one flexible wire has a variable thickness where a middle portion of the flexible wire has a first thickness and a proximal portion of the flexible wire has a second thickness, wherein the second thickness is greater than the first thickness, wherein the at least one flexible wire has a distal portion with a third thickness, wherein the third thickness is greater than the first thickness, characterised in that the thickness of the at least one flexible wire tapers from the third thickness at a distal end towards the middle portion and also from the second thickness at a proximal end to the middle portion. an elongated catheter body extending along a longitudinal axis, the elongated catheter body having a proximal end and a distal end; a flexible wire assembly positioned at the distal end of the elongated catheter body formed from a shape memory material, the flexible wire assembly having a plurality of flexible wires , each flexible wire having a proximal end and a distal end and wherein at least one of the flexible wires has a variable cross-section; a plurality of spines formed from the plurality of flexible wires; and a plurality of electrodes and cabling attached to each spine, wherein the distal ends of the plurality of flexible wires are joined at a distal hub to form a basket-shaped multi-electrode device, wherein the at least one flexible wire has a variable thickness where a middle portion of the flexible wire has a first thickness and a proximal portion of the flexible wire has a second thickness, wherein the second thickness is greater than the first thickness, wherein the at least one flexible wire has a distal portion with a third thickness, wherein the third thickness is greater than the first thickness, characterised in that the thickness of the at least one flexible wire tapers from the third thickness at a distal end towards the middle portion and also from the second thickness at a proximal end to the middle portion.
A battery system comprising: a housing that defines an internal volume and a vent that fluidly couples said internal volume with an atmosphere surrounding said housing; and a support structure within said internal volume, said support structure being configured to support a plurality of battery cell modules in said internal volume ; wherein the system further comprises a charging system electrically connectable to said plurality of battery cell modules , wherein said charging system comprises electronics configured to identify malfunctioning cell modules and non-malfunctioning cell modules within said plurality of battery cell modules, the charging system further being configured to electrically isolate said malfunctioning cell modules from said non-malfunctioning cell modules, to supply a charging voltage to said non-malfunctioning cell modules and to increase said charging voltage within a safe battery charge range when said malfunctioning cell modules are isolated. a housing that defines an internal volume and a vent that fluidly couples said internal volume with an atmosphere surrounding said housing; and a support structure within said internal volume, said support structure being configured to support a plurality of battery cell modules in said internal volume ; wherein the system further comprises a charging system electrically connectable to said plurality of battery cell modules , wherein said charging system comprises electronics configured to identify malfunctioning cell modules and non-malfunctioning cell modules within said plurality of battery cell modules, the charging system further being configured to electrically isolate said malfunctioning cell modules from said non-malfunctioning cell modules, to supply a charging voltage to said non-malfunctioning cell modules and to increase said charging voltage within a safe battery charge range when said malfunctioning cell modules are isolated.
Power semiconductor module comprising: - a bottom electrode-baseplate , wherein the bottom electrode-baseplate is electrically and thermally conductive, - a top electrode-baseplate , wherein the top electrode-baseplate is electrically and thermally conductive, - a power semiconductor chip (104a-f, 504a, b), - and a first preform (106a-f, 506a, 506b), wherein - the power semiconductor chip (104a-f, 504a, b) comprises a bottom electrode and a top electrode, - the first preform (106a-f, 506a, b) is made of material configured for supporting a creation of an electrically conductive alloy when being melted, the first preform (106a-f, 506a, 506b) provides in combination with the power semiconductor chip (104a-f, 504a, 504b) a short circuit failure mode capability of the power semiconductor module, and wherein the bottom electrode of the power semiconductor chip (104a-f, 504a, b) is thermally and electrically connected to the bottom electrode-baseplate via a first bonding layer , and wherein the top electrode of the power semiconductor chip (104a-f, 504a, b) is thermally and electrically connected to a first side of the first preform (106a-f, 506a, b) via a second bonding layer , wherein the second side of the first preform (106a-f, 506a, b) is thermally and electrically connected to the top electrode-baseplate via a third bonding layer , and wherein the first and second bonding layers are sintered bonds characterised in that the third bonding layer is configured as a layer of solder. - a bottom electrode-baseplate , wherein the bottom electrode-baseplate is electrically and thermally conductive, - a top electrode-baseplate , wherein the top electrode-baseplate is electrically and thermally conductive, - a power semiconductor chip (104a-f, 504a, b), - and a first preform (106a-f, 506a, 506b), wherein - the power semiconductor chip (104a-f, 504a, b) comprises a bottom electrode and a top electrode, - the first preform (106a-f, 506a, b) is made of material configured for supporting a creation of an electrically conductive alloy when being melted, the first preform (106a-f, 506a, 506b) provides in combination with the power semiconductor chip (104a-f, 504a, 504b) a short circuit failure mode capability of the power semiconductor module, and wherein the bottom electrode of the power semiconductor chip (104a-f, 504a, b) is thermally and electrically connected to the bottom electrode-baseplate via a first bonding layer , and wherein the top electrode of the power semiconductor chip (104a-f, 504a, b) is thermally and electrically connected to a first side of the first preform (106a-f, 506a, b) via a second bonding layer , wherein the second side of the first preform (106a-f, 506a, b) is thermally and electrically connected to the top electrode-baseplate via a third bonding layer , and wherein the first and second bonding layers are sintered bonds characterised in that the third bonding layer is configured as a layer of solder.
Apparatus for processing data, comprising: processing circuitry to perform processing operations under control of program instructions; and a decoder to decode program instructions to generate control signals to control said processing circuitry to perform said processing operations; wherein said decoder is responsive to a given program instruction and a rounding position input operand to generate control signals to control said processing circuitry to process a floating point input operand having a significand value to generate an output result dependent upon a value from rounding said floating point input operand using a variable rounding point within said significand of said floating point input operand specified by said rounding position input operand. processing circuitry to perform processing operations under control of program instructions; and a decoder to decode program instructions to generate control signals to control said processing circuitry to perform said processing operations; wherein said decoder is responsive to a given program instruction and a rounding position input operand to generate control signals to control said processing circuitry to process a floating point input operand having a significand value to generate an output result dependent upon a value from rounding said floating point input operand using a variable rounding point within said significand of said floating point input operand specified by said rounding position input operand.
A packet parsing method, wherein the method comprises: receiving a packet, wherein the packet comprises at least a first packet header and a second packet header, and the second packet header is a next-level packet header of the first packet header; obtaining a configuration of the first packet header, wherein the configuration of the first packet header comprises a protocol type of the first packet header; obtaining first configuration information from the first packet header based on the configuration of the first packet header, wherein the first configuration information comprises a next packet header field, NHF, and an additional field of the first packet header; searching a first table based on the additional field to obtain a protocol type corresponding to the additional field, and searching a second table based on the NHF to obtain a protocol type corresponding to the NHF; when there is the protocol type corresponding to the additional field in the first table, obtaining a protocol type of the second packet header based on the protocol type corresponding to the additional field; and when there is no protocol type corresponding to the additional field in the first table, obtaining the protocol type of the second packet header based on the protocol type corresponding to the NHF. receiving a packet, wherein the packet comprises at least a first packet header and a second packet header, and the second packet header is a next-level packet header of the first packet header; obtaining a configuration of the first packet header, wherein the configuration of the first packet header comprises a protocol type of the first packet header; obtaining first configuration information from the first packet header based on the configuration of the first packet header, wherein the first configuration information comprises a next packet header field, NHF, and an additional field of the first packet header; searching a first table based on the additional field to obtain a protocol type corresponding to the additional field, and searching a second table based on the NHF to obtain a protocol type corresponding to the NHF; when there is the protocol type corresponding to the additional field in the first table, obtaining a protocol type of the second packet header based on the protocol type corresponding to the additional field; and when there is no protocol type corresponding to the additional field in the first table, obtaining the protocol type of the second packet header based on the protocol type corresponding to the NHF.
An electric heating device comprising: a housing having a partition wall separating a connection chamber from a heating chamber for emitting heat from which at least one receiving pocket projects into the heating chamber as a heating rib , in which a PTC heating means having at least one PTC element and conductive tracks are accommodated which are electrically conducting connected to the PTC element with different polarity for energizing the same and are electrically connected in the connection chamber , wherein the PTC element and at least one of the conductive tracks are accommodated in a heater housing , characterized in that the heater housing is pressed into the receiving pocket with plastic deformation of the heater housing and/or the receiving pocket . a housing having a partition wall separating a connection chamber from a heating chamber for emitting heat from which at least one receiving pocket projects into the heating chamber as a heating rib , in which a PTC heating means having at least one PTC element and conductive tracks are accommodated which are electrically conducting connected to the PTC element with different polarity for energizing the same and are electrically connected in the connection chamber , wherein the PTC element and at least one of the conductive tracks are accommodated in a heater housing , characterized in that the heater housing is pressed into the receiving pocket with plastic deformation of the heater housing and/or the receiving pocket .
A method of plugging channels of a permeable porous cellular body comprising: contacting a permeable porous cellular body with a plugging mixture , the permeable porous cellular body defining a plurality of channels ; forcing the plugging mixture into the plurality of channels utilizing the application of a constant pressure over time until a maximum, self-limiting, depth of the plugging mixture is disposed within the plurality of channels ; and maintaining the constant pressure applied to the plugging mixture until flow of the plugging mixture into the plurality of channels decays from an initial flow rate to a predetermined flow rate, wherein the predetermined flow rate is 50% or less of the initial flow rate. contacting a permeable porous cellular body with a plugging mixture , the permeable porous cellular body defining a plurality of channels ; forcing the plugging mixture into the plurality of channels utilizing the application of a constant pressure over time until a maximum, self-limiting, depth of the plugging mixture is disposed within the plurality of channels ; and maintaining the constant pressure applied to the plugging mixture until flow of the plugging mixture into the plurality of channels decays from an initial flow rate to a predetermined flow rate, wherein the predetermined flow rate is 50% or less of the initial flow rate.
An organic light emitting display device comprising: an anode; an organic layer on the anode; and a cathode on the organic layer, wherein the organic layer comprises a compound including a carbazole group having hole characteristics and a heteroaryl group having electron characteristics, characterized in that the compound is one among the following compounds: an anode; an organic layer on the anode; and a cathode on the organic layer, wherein the organic layer comprises a compound including a carbazole group having hole characteristics and a heteroaryl group having electron characteristics, characterized in that the compound is one among the following compounds:
A three-dimensional molding apparatus comprising two molding materials for constructing a molded product, the materials being a material A and a material B, wherein material A is a photo-curable resin material and wherein material B is a thermoplastic resin or a thermoplastic resin composition, the apparatus further comprising: - reservoir portions for storing the molding materials, - a light irradiation portion , - nozzle portions for dispensing the two or more molding materials, wherein a nozzle curing prevention portion is further provided to the nozzle portion for dispensing the material A, - liquid-sending units for transporting the materials from the reservoir portions to the nozzle portions , temperature control units, - a molding stage , - a relative movement mechanism for three-dimensionally relatively moving the molding stage and the two or more nozzle portions , and - a computer for controlling the liquid-sending units, the temperature control units, and the relative movement mechanism; wherein the nozzle curing prevention portion limits an irradiation area of a light emitted from the light irradiation portion , and the not irradiated area is a circle concentric with an end of the nozzle portion for dispensing the material A, said circle having a diameter ranging from more than 1 to 100 times the diameter of the end of the nozzle portion for dispensing the material A. - reservoir portions for storing the molding materials, - a light irradiation portion , - nozzle portions for dispensing the two or more molding materials, wherein a nozzle curing prevention portion is further provided to the nozzle portion for dispensing the material A, - liquid-sending units for transporting the materials from the reservoir portions to the nozzle portions , temperature control units, - a molding stage , - a relative movement mechanism for three-dimensionally relatively moving the molding stage and the two or more nozzle portions , and - a computer for controlling the liquid-sending units, the temperature control units, and the relative movement mechanism;