A method of packaging Chip Scale Package (CSP) LED, comprising the following successive steps: (i) placing a layer of fixed film for fixing the position of LED chips on a carrier plate ; (ii) distributing some LED chips on the surface of the fixed film , the LED chips being in array distribution, there being a space left between adjacent LED chips ; an electrode being arranged on the bottom surface of the LED chip , and the bottom surface of the LED chip being against the fixed film ; (iii) coating a layer of light-blocking glue on the LED chips array, light emitting surfaces of each LED chip being fully covered by the light-blocking glue ; (iv) grinding to remove a surface of the light-blocking glue after solidification of the light-blocking glue to expose the top surfaces of the LED chips , the height of the top surfaces of the LED chips being leveled with that of the light-blocking glue on the side surfaces; (v) coating a fluorescent glue layer on the LED chips array with a smooth surface so that the top surfaces of the LED chips and that of the light-blocking glue are fully covered by the fluorescent glue layer ; (vi) cutting between adjacent LED chips with a combined cutter, the combined cutter including a primary cutter and a secondary cutter , by cutting the space between adjacent LED chips with the primary cutter with a cutting depth up to the fixed film , so that the fluorescent glue layer and the light-blocking glue layer are cut off, and by cutting with the secondary cutter to remove the fluorescent glue layer between the LED chips and to expose the top surface of the light-blocking glue ; (vii) separating single LED chips . (i) placing a layer of fixed film for fixing the position of LED chips on a carrier plate ; (ii) distributing some LED chips on the surface of the fixed film , the LED chips being in array distribution, there being a space left between adjacent LED chips ; an electrode being arranged on the bottom surface of the LED chip , and the bottom surface of the LED chip being against the fixed film ; (iii) coating a layer of light-blocking glue on the LED chips array, light emitting surfaces of each LED chip being fully covered by the light-blocking glue ; (iv) grinding to remove a surface of the light-blocking glue after solidification of the light-blocking glue to expose the top surfaces of the LED chips , the height of the top surfaces of the LED chips being leveled with that of the light-blocking glue on the side surfaces; (v) coating a fluorescent glue layer on the LED chips array with a smooth surface so that the top surfaces of the LED chips and that of the light-blocking glue are fully covered by the fluorescent glue layer ; (vi) cutting between adjacent LED chips with a combined cutter, the combined cutter including a primary cutter and a secondary cutter , by cutting the space between adjacent LED chips with the primary cutter with a cutting depth up to the fixed film , so that the fluorescent glue layer and the light-blocking glue layer are cut off, and by cutting with the secondary cutter to remove the fluorescent glue layer between the LED chips and to expose the top surface of the light-blocking glue ; (vii) separating single LED chips . <EOS>