A method of manufacturing a light emitting device comprising: disposing a group of electrically conductive members on a support substrate , the group of the electrically conductive members forming a plurality of mounting portions arranged in two or more columns and two or more rows with the mounting portions respectively corresponding to a plurality of light emitting elements , each light emitting element comprising a substrate , a first element electrode and a second element electrode , the first and second element electrodes being arranged on the same surface side of the substrate in triangular shapes created by diagonally dividing a quadrangular shape into approximately halves, along a corresponding one of hypothetical lines extending in radial directions from an approximate center of the group of the electrically conductive members , in a planar view, wherein the shape of each one of the electrically conductive members forming the group of electrically conductive members corresponds to the shape of the first element electrode and the second element electrode of the light emitting element , which are arranged totally separated or partly divided; mounting the light emitting elements in a flip-chip manner on the group of the electrically conductive members with a bonding member being disposed between the light emitting elements and the electrically conductive members , each of the light emitting elements being shifted from a corresponding one of the mounting portions along a corresponding one of hypothetical lines extending in radial directions from an approximate center of the group of the electrically conductive members ; and melting the bonding member to mount the light emitting elements respectively on the mounting portions by self-alignment effect generated by the melting of the bonding member . disposing a group of electrically conductive members on a support substrate , the group of the electrically conductive members forming a plurality of mounting portions arranged in two or more columns and two or more rows with the mounting portions respectively corresponding to a plurality of light emitting elements , each light emitting element comprising a substrate , a first element electrode and a second element electrode , the first and second element electrodes being arranged on the same surface side of the substrate in triangular shapes created by diagonally dividing a quadrangular shape into approximately halves, along a corresponding one of hypothetical lines extending in radial directions from an approximate center of the group of the electrically conductive members , in a planar view, wherein the shape of each one of the electrically conductive members forming the group of electrically conductive members corresponds to the shape of the first element electrode and the second element electrode of the light emitting element , which are arranged totally separated or partly divided; mounting the light emitting elements in a flip-chip manner on the group of the electrically conductive members with a bonding member being disposed between the light emitting elements and the electrically conductive members , each of the light emitting elements being shifted from a corresponding one of the mounting portions along a corresponding one of hypothetical lines extending in radial directions from an approximate center of the group of the electrically conductive members ; and melting the bonding member to mount the light emitting elements respectively on the mounting portions by self-alignment effect generated by the melting of the bonding member . <EOS>