A fixed-focus camera module , suitable for assembly in an electronic device , comprising: a circuit board ; a photosensitive element , which is conductively connected to the circuit board ; a molded base , wherein the molded base is integrally molded on the circuit board and the photosensitive element , and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens , wherein the optical lens is supported on the top side of the molded base and corresponds to the light window formed by the molded base , wherein the circuit board comprises a circuit board substrate and at least one electronic component , wherein the at least one electronic component is electrically connected to the circuit board substrate , wherein the circuit board substrate has a blank side , and when the fixed-focus camera module is assembled in the electronic device , the blank side of the circuit board substrate is adjacent to the edge of the electronic device , and wherein the blank side of the circuit board substrate is free of the at least one electronic component ; wherein the optical lens comprises a lens barrel unit and a group of optical lens sheets , and the optical lens sheets are supported in the lens barrel unit ; wherein the width of the lens barrel unit is smaller than the width of the molded base , so as to define an extension space by the optical lens and the molded base , and wherein when the fixed-focus camera module is assembled in the electronic device , the extension space is used to receive a display screen of the electronic device ; characterized in that the lens barrel unit has a stepped portion, and the stepped portion extends inwardly toward an optical axis direction set by the optical lens and is configured to receive at least a portion of the display screen of the electronic device , so as to increase the extension space by means of the stepped portion. a circuit board ; a photosensitive element , which is conductively connected to the circuit board ; a molded base , wherein the molded base is integrally molded on the circuit board and the photosensitive element , and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens , wherein the optical lens is supported on the top side of the molded base and corresponds to the light window formed by the molded base , wherein the circuit board comprises a circuit board substrate and at least one electronic component , wherein the at least one electronic component is electrically connected to the circuit board substrate , wherein the circuit board substrate has a blank side , and when the fixed-focus camera module is assembled in the electronic device , the blank side of the circuit board substrate is adjacent to the edge of the electronic device , and wherein the blank side of the circuit board substrate is free of the at least one electronic component ; wherein the optical lens comprises a lens barrel unit and a group of optical lens sheets , and the optical lens sheets are supported in the lens barrel unit ; wherein the width of the lens barrel unit is smaller than the width of the molded base , so as to define an extension space by the optical lens and the molded base , and wherein when the fixed-focus camera module is assembled in the electronic device , the extension space is used to receive a display screen of the electronic device ; characterized in that the lens barrel unit has a stepped portion, and the stepped portion extends inwardly toward an optical axis direction set by the optical lens and is configured to receive at least a portion of the display screen of the electronic device , so as to increase the extension space by means of the stepped portion. <EOS>