A computing system comprising a housing ; a chassis , arranged inside the housing ; and a blade arranged in a slot of the chassis , wherein the blade comprises a first circuit board having a plurality of components mounted on a substrate ; wherein the chassis is coupled to a cooling system to maintain at least a subset of the plurality of components operating in an environment having a temperature at or below 200 Kelvin; wherein the blade comprises a first heat spreader comprising a metal, wherein the first heat spreader is arranged to transfer heat from the first circuit board to the cooling system via an interface between a first surface of the first heat spreader and a second surface of the chassis , and wherein indium is permanently bonded to either the first surface of the first heat spreader , or the second surface of the chassis , or both the first surface of the first heat spreader and the second surface of the chassis ; and wherein the housing is configured to maintain a lower pressure inside the housing than a pressure outside the housing; the blade further comprises a second circuit board , mounted on an opposite side of the first circuit board , having a second plurality of components mounted on a second substrate and a second heat spreader comprising a metal, wherein the second heat spreader is arranged to transfer heat from the second circuit board to the cooling system via a second interface between a third surface of the second heat spreader and a fourth surface of the chassis , and wherein indium is permanently bonded to either the third surface of the second heat spreader , or the fourth surface of the chassis , or both the third surface of the second heat spreader and the fourth surface of the chassis . a housing ; a chassis , arranged inside the housing ; and a blade arranged in a slot of the chassis , wherein the blade comprises a first circuit board having a plurality of components mounted on a substrate ; wherein the chassis is coupled to a cooling system to maintain at least a subset of the plurality of components operating in an environment having a temperature at or below 200 Kelvin; wherein the blade comprises a first heat spreader comprising a metal, wherein the first heat spreader is arranged to transfer heat from the first circuit board to the cooling system via an interface between a first surface of the first heat spreader and a second surface of the chassis , and wherein indium is permanently bonded to either the first surface of the first heat spreader , or the second surface of the chassis , or both the first surface of the first heat spreader and the second surface of the chassis ; and wherein the housing is configured to maintain a lower pressure inside the housing than a pressure outside the housing; the blade further comprises a second circuit board , mounted on an opposite side of the first circuit board , having a second plurality of components mounted on a second substrate and a second heat spreader comprising a metal, wherein the second heat spreader is arranged to transfer heat from the second circuit board to the cooling system via a second interface between a third surface of the second heat spreader and a fourth surface of the chassis , and wherein indium is permanently bonded to either the third surface of the second heat spreader , or the fourth surface of the chassis , or both the third surface of the second heat spreader and the fourth surface of the chassis . <EOS>