Solder-joint-forming solder paste adapted for soldering a substrate, the solder paste comprising: a metal powder component comprising: an intermetallic compound powder whose surface is coated with at least one metal selected from the group consisting of Sn and Ni and that consists of Cu and Sn, with a mass ratio of Sn to Cu within a range of 8:2 to 2:8, and including Cu 3 Sn; and a Sn-Bi solder powder containing, as a main component, Sn, and the solder paste also comprising: a flux component, characterized in that 10 to 70% by mass of the intermetallic compound powder consisting of Cu and Sn and 30 to 90% by mass of the Sn-Bi solder powder containing, as a main component, Sn are contained in the metal powder component, and a surface of the intermetallic compound powder consisting of Cu and Sn is coated on its surface with a metal plating containing at least one metal selected from the group consisting of Sn and Ni, wherein the metal powder component has an average particle size of 50 μm or less, wherein the Sn-Bi solder powder has an Sn content of 40 % by mass or more, and optionally comprises one or more elements selected from Ag, Cu, In, Ni, Co, Sb, Ge, Ga, P, Fe, Zn, Al and Ti in a content of each element of 5% by mass or less, wherein the solder paste is made of 80% to 90% metal powder component and 10% to 20% flux. a metal powder component comprising: an intermetallic compound powder whose surface is coated with at least one metal selected from the group consisting of Sn and Ni and that consists of Cu and Sn, with a mass ratio of Sn to Cu within a range of 8:2 to 2:8, and including Cu 3 Sn; and a Sn-Bi solder powder containing, as a main component, Sn, an intermetallic compound powder whose surface is coated with at least one metal selected from the group consisting of Sn and Ni and that consists of Cu and Sn, with a mass ratio of Sn to Cu within a range of 8:2 to 2:8, and including Cu 3 Sn; and a Sn-Bi solder powder containing, as a main component, Sn, and the solder paste also comprising: a flux component, characterized in that 10 to 70% by mass of the intermetallic compound powder consisting of Cu and Sn and 30 to 90% by mass of the Sn-Bi solder powder containing, as a main component, Sn are contained in the metal powder component, and a surface of the intermetallic compound powder consisting of Cu and Sn is coated on its surface with a metal plating containing at least one metal selected from the group consisting of Sn and Ni, a flux component, characterized in that 10 to 70% by mass of the intermetallic compound powder consisting of Cu and Sn and 30 to 90% by mass of the Sn-Bi solder powder containing, as a main component, Sn are contained in the metal powder component, and a surface of the intermetallic compound powder consisting of Cu and Sn is coated on its surface with a metal plating containing at least one metal selected from the group consisting of Sn and Ni, wherein the metal powder component has an average particle size of 50 μm or less, wherein the Sn-Bi solder powder has an Sn content of 40 % by mass or more, and optionally comprises one or more elements selected from Ag, Cu, In, Ni, Co, Sb, Ge, Ga, P, Fe, Zn, Al and Ti in a content of each element of 5% by mass or less, wherein the solder paste is made of 80% to 90% metal powder component and 10% to 20% flux. <EOS>