A wireless ultrasound probe comprising: a housing ; an acoustic module disposed inside the housing, and configured to transmit an ultrasound signal to an object and receive an echo signal reflected from the object; an image processor disposed in a rear direction of the acoustic module inside the housing, electrically connected to the acoustic module, and configured to generate ultrasound image data from the echo signal received from the acoustic module; a first heat-insulating wall disposed between the acoustic module and the image processor inside the housing; a first heat sink member disposed in a rear direction of the image processor inside the housing; at least one anisotropic heat conductive member passing through the first heat-insulating wall to connect the acoustic module with the first heat sink member, and configured such that a heat conductivity thereof in a lengthwise direction of the housing is greater than a heat conductivity thereof in a direction perpendicular to the lengthwise direction of the housing to transfer heat of the acoustic module to the first heat sink member; a second heat sink member disposed in a rear direction of the image processor inside the housing; and a heat conductive plate connecting the image processor with the second heat sink member, wherein while the ultrasound probe operates, a temperature of the image processor is higher than a temperature of the acoustic module, and a temperature of the second heat sink member is higher than a temperature of the first heat sink member, and wherein the second heat sink member is spaced apart from the first heat sink member. a housing ; an acoustic module disposed inside the housing, and configured to transmit an ultrasound signal to an object and receive an echo signal reflected from the object; an image processor disposed in a rear direction of the acoustic module inside the housing, electrically connected to the acoustic module, and configured to generate ultrasound image data from the echo signal received from the acoustic module; a first heat-insulating wall disposed between the acoustic module and the image processor inside the housing; a first heat sink member disposed in a rear direction of the image processor inside the housing; at least one anisotropic heat conductive member passing through the first heat-insulating wall to connect the acoustic module with the first heat sink member, and configured such that a heat conductivity thereof in a lengthwise direction of the housing is greater than a heat conductivity thereof in a direction perpendicular to the lengthwise direction of the housing to transfer heat of the acoustic module to the first heat sink member; a second heat sink member disposed in a rear direction of the image processor inside the housing; and a heat conductive plate connecting the image processor with the second heat sink member, wherein while the ultrasound probe operates, a temperature of the image processor is higher than a temperature of the acoustic module, and a temperature of the second heat sink member is higher than a temperature of the first heat sink member, and wherein the second heat sink member is spaced apart from the first heat sink member. <EOS>