A method (S100) of manufacturing a waveguide assembly , comprising the steps of providing at least two waveguide units (S110), wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and combining the waveguide units (S120) by applying at least one adhesive to a dispensing path of the bonding portion to combine the waveguide units into the waveguide assembly, characterized in that the adhesive is a form-in-place adhesive being composed of: 9%-12% of dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; 12%-15% of hydroxy terminated polydimethylsiloxane; 0%-0.2% of dispersant; 3%-5% of dimethyl, methylhydrogen siloxane crosslinking agent; 0%-0.2% of adhesion promoter; 0%-0.2% of Pt catalyst; 1%-3% of forming agent; 0%-10% of hydrocarbon solvent; 50%-70% of Nickel Graphite; 0%-0.2% of thickening agent; 5%-10% of trimethylated silica; and 0%-0.1% of inhibitor; wherein an adhesion strength of the adhesive is larger than 80 N/cm 2 ; the adhesive further having a shielding capability that is larger than 100 dB in the frequency spectrum range from 200 MHz to 20 GHz; the minimum width being 0.4 mm; the minimum height being 0.3 mm; and the filling width of the dispensing path being between 0.4 mm and 2 mm. providing at least two waveguide units (S110), wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and combining the waveguide units (S120) by applying at least one adhesive to a dispensing path of the bonding portion to combine the waveguide units into the waveguide assembly, characterized in that the adhesive is a form-in-place adhesive being composed of: 9%-12% of dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; 12%-15% of hydroxy terminated polydimethylsiloxane; 0%-0.2% of dispersant; 3%-5% of dimethyl, methylhydrogen siloxane crosslinking agent; 0%-0.2% of adhesion promoter; 0%-0.2% of Pt catalyst; 1%-3% of forming agent; 0%-10% of hydrocarbon solvent; 50%-70% of Nickel Graphite; 0%-0.2% of thickening agent; 5%-10% of trimethylated silica; and 0%-0.1% of inhibitor; wherein an adhesion strength of the adhesive is larger than 80 N/cm 2 ; the adhesive further having a shielding capability that is larger than 100 dB in the frequency spectrum range from 200 MHz to 20 GHz; the minimum width being 0.4 mm; the minimum height being 0.3 mm; and the filling width of the dispensing path being between 0.4 mm and 2 mm. 9%-12% of dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; 12%-15% of hydroxy terminated polydimethylsiloxane; 0%-0.2% of dispersant; 3%-5% of dimethyl, methylhydrogen siloxane crosslinking agent; 0%-0.2% of adhesion promoter; 0%-0.2% of Pt catalyst; 1%-3% of forming agent; 0%-10% of hydrocarbon solvent; 50%-70% of Nickel Graphite; 0%-0.2% of thickening agent; 5%-10% of trimethylated silica; and 0%-0.1% of inhibitor; wherein an adhesion strength of the adhesive is larger than 80 N/cm 2 ; the adhesive further having a shielding capability that is larger than 100 dB in the frequency spectrum range from 200 MHz to 20 GHz; the minimum width being 0.4 mm; the minimum height being 0.3 mm; and the filling width of the dispensing path being between 0.4 mm and 2 mm. <EOS>