A driver IC film unit including: a flexible film ; a driver IC on a first surface of the flexible film and configured to receive an input signal and convert the input signal into an image signal for a display panel ; at least first to third pad units , each pad unit including a plurality of pads, on the first surface of the flexible film , configured to electrically connect the driver IC and the flexible film ; a first test pad , a second test pad and a third test pad on the second surface of the flexible film arranged in an outer periphery of the flexible film which is configured to be cut off to form an edge of the flexible film; and at least first to third wire units , each wire unit including a plurality of signal wires, on the first surface of the flexible film , electrically connected to the at least first to third pad units , wherein the first wire unit extends, via a first via hole, to the outer periphery of the flexible film on one side of the flexible film on the second surface and is electrically connected to the first test pad , wherein the first wire unit is configured to be cut along with the flexible film; wherein the second wire unit extends, via a second via hole, to the outer periphery of the flexible film on the other side of the flexible film on the second surface and is electrically connected to the second test pad , wherein the second wire unit is configured to be cut along with the flexible film; wherein the third wire unit extends, via a third via hole, to the outer periphery of the flexible film on the other side of the flexible film on the second surface and is electrically connected to the third test pad , wherein the third wire unit is configured to be cut along with the flexible film, wherein the third via hole is arranged in the outer periphery of the flexible film which is configured to be cut off. a flexible film ; a driver IC on a first surface of the flexible film and configured to receive an input signal and convert the input signal into an image signal for a display panel ; at least first to third pad units , each pad unit including a plurality of pads, on the first surface of the flexible film , configured to electrically connect the driver IC and the flexible film ; a first test pad , a second test pad and a third test pad on the second surface of the flexible film arranged in an outer periphery of the flexible film which is configured to be cut off to form an edge of the flexible film; and at least first to third wire units , each wire unit including a plurality of signal wires, on the first surface of the flexible film , electrically connected to the at least first to third pad units , wherein the first wire unit extends, via a first via hole, to the outer periphery of the flexible film on one side of the flexible film on the second surface and is electrically connected to the first test pad , wherein the first wire unit is configured to be cut along with the flexible film; wherein the second wire unit extends, via a second via hole, to the outer periphery of the flexible film on the other side of the flexible film on the second surface and is electrically connected to the second test pad , wherein the second wire unit is configured to be cut along with the flexible film; wherein the third wire unit extends, via a third via hole, to the outer periphery of the flexible film on the other side of the flexible film on the second surface and is electrically connected to the third test pad , wherein the third wire unit is configured to be cut along with the flexible film, wherein the third via hole is arranged in the outer periphery of the flexible film which is configured to be cut off. <EOS>