An ultraviolet surface mount device, SMD, LED element surface mount-type package comprising a silica glass member for hermetic sealing of an ultraviolet SMD LED element that is configured to emit light in a wavelength range of from 200 nm to 400 nm, in particular from 250 nm to 350 nm, and is placed in a hermetic sealing container having a container outer periphery joining plain surface formed in an outer peripheral portion thereof, the silica glass member for hermetic sealing comprising a silica glass substrate , which is homogeneously and integrally formed without an internal boundary, wherein the silica glass substrate has: a first surface on an inside opposed to the ultraviolet SMD LED element ; and a second surface on an outside corresponding to the first surface , wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface , and wherein the second surface on the outside corresponding to the first surface has formed therein a lens-like convex portion configured to process emitted light from the ultraviolet SMD LED element , characterized in that the silica glass member for hermetic sealing has an internal transmittance at a thickness of 3 mm of 95% to 99% for ultraviolet light having a wavelength of 300 nm to 400 nm and an internal transmittance at a thickness of 3 mm of 92% to 99% for ultraviolet light having a wavelength of 245 nm or more and less than 300 nm, wherein the silica glass member for hermetic sealing contains OH groups at a concentration of 0.1 ppm to 4.6 ppm. a first surface on an inside opposed to the ultraviolet SMD LED element ; and a second surface on an outside corresponding to the first surface , wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface , and wherein the second surface on the outside corresponding to the first surface has formed therein a lens-like convex portion configured to process emitted light from the ultraviolet SMD LED element , characterized in that the silica glass member for hermetic sealing has an internal transmittance at a thickness of 3 mm of 95% to 99% for ultraviolet light having a wavelength of 300 nm to 400 nm and an internal transmittance at a thickness of 3 mm of 92% to 99% for ultraviolet light having a wavelength of 245 nm or more and less than 300 nm, wherein the silica glass member for hermetic sealing contains OH groups at a concentration of 0.1 ppm to 4.6 ppm. wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface , and wherein the second surface on the outside corresponding to the first surface has formed therein a lens-like convex portion configured to process emitted light from the ultraviolet SMD LED element , characterized in that the silica glass member for hermetic sealing has an internal transmittance at a thickness of 3 mm of 95% to 99% for ultraviolet light having a wavelength of 300 nm to 400 nm and an internal transmittance at a thickness of 3 mm of 92% to 99% for ultraviolet light having a wavelength of 245 nm or more and less than 300 nm, wherein the silica glass member for hermetic sealing contains OH groups at a concentration of 0.1 ppm to 4.6 ppm. <EOS>