Radio-frequency assembly, RF assembly, , having: a signal source having a semiconductor amplifier output ; an impedance matching filter with a first interface and a second interface ; and a radio-frequency waveguide, RF waveguide, ; wherein the first interface is communicatively coupled to the signal source by means of one or more lines and a transmission path of the RF assembly in order to be able to transmit a radio-frequency signal, RF signal, from the signal source to the impedance matching filter ; wherein the second interface is communicatively coupled to the RF waveguide in order to be able to transmit an RF signal from the impedance matching filter to the RF waveguide ; wherein a first impedance value at the first interface corresponds to an impedance value at the semiconductor amplifier output ; wherein a second impedance value at the second interface corresponds to an impedance value at the RF waveguide ; wherein the first impedance value and the second impedance value have different values; wherein the RF assembly furthermore has a baseplate ; wherein the semiconductor amplifier output is arranged on the baseplate ; and characterized in that the semiconductor amplifier output , for the purpose of direct-current energy supply, is galvanically coupled via said one or more lines to the transmission path on the baseplate ; wherein the transmission path has a capacitive coupling element situated opposite the first interface and arranged for capacitively coupling radio-frequency signals into the first interface ; wherein the capacitive coupling element is galvanically isolated from the first interface and spaced apart therefrom by a gap . a signal source having a semiconductor amplifier output ; an impedance matching filter with a first interface and a second interface ; and a radio-frequency waveguide, RF waveguide, ; wherein the first interface is communicatively coupled to the signal source by means of one or more lines and a transmission path of the RF assembly in order to be able to transmit a radio-frequency signal, RF signal, from the signal source to the impedance matching filter ; wherein the second interface is communicatively coupled to the RF waveguide in order to be able to transmit an RF signal from the impedance matching filter to the RF waveguide ; wherein a first impedance value at the first interface corresponds to an impedance value at the semiconductor amplifier output ; wherein a second impedance value at the second interface corresponds to an impedance value at the RF waveguide ; wherein the first impedance value and the second impedance value have different values; wherein the RF assembly furthermore has a baseplate ; wherein the semiconductor amplifier output is arranged on the baseplate ; and characterized in that the semiconductor amplifier output , for the purpose of direct-current energy supply, is galvanically coupled via said one or more lines to the transmission path on the baseplate ; wherein the transmission path has a capacitive coupling element situated opposite the first interface and arranged for capacitively coupling radio-frequency signals into the first interface ; wherein the capacitive coupling element is galvanically isolated from the first interface and spaced apart therefrom by a gap . <EOS>