Method for determining a deformation of a mould wafer, having the steps of: clamping an inner region (IB) of the mould wafer on a clamping device (5, 5a, 15a-c; 5, 5a, 15d) in a first clamping position; determining an eccentricity (δ) of a central axis (M') of the mould wafer from a central axis (M) of the clamping device (5, 5a, 15a-c; 5, 5a, 15d) in the first clamping position; depositing the mould wafer on a supporting device ; re-clamping the inner region (IB) of the mould wafer on the clamping device (5, 5a, 15a-c; 5, 5a, 15d) in a second clamping position on the basis of the determined eccentricity (δ), wherein the eccentricity (δ) in the second clamping position is substantially zero; moving the clamping device (5, 5a, 15a-c; 5, 5a, 15d) into a predetermined height position (Z0); measuring a respective deviation (WR) of a plurality of measuring points (P1-P8) in a non-clamped outer region (AB) of the disk-shaped workpiece from the predetermined height position (Z0) as per the deformation by means of a fixed-height detector device by rotating the clamping device (5, 5a, 15a-c; 5, 5a, 15d) or the detector device to corresponding angles of rotation (φ1-φ8); wherein the clamping of the inner region (IB) of the mould wafer takes place using a plurality of bearing pins and a plurality of vacuum suction elements ; wherein in each case one bearing pin of the plurality of bearing pins is surrounded by in each case one associated one of the plurality of vacuum suction elements ; wherein the vacuum suction elements comprise a respective sealing lip that encloses the respective associated bearing pin ; characterized in that the mould wafer in the clamped state is carried by the bearing pins and the sealing lips. clamping an inner region (IB) of the mould wafer on a clamping device (5, 5a, 15a-c; 5, 5a, 15d) in a first clamping position; determining an eccentricity (δ) of a central axis (M') of the mould wafer from a central axis (M) of the clamping device (5, 5a, 15a-c; 5, 5a, 15d) in the first clamping position; depositing the mould wafer on a supporting device ; re-clamping the inner region (IB) of the mould wafer on the clamping device (5, 5a, 15a-c; 5, 5a, 15d) in a second clamping position on the basis of the determined eccentricity (δ), wherein the eccentricity (δ) in the second clamping position is substantially zero; moving the clamping device (5, 5a, 15a-c; 5, 5a, 15d) into a predetermined height position (Z0); measuring a respective deviation (WR) of a plurality of measuring points (P1-P8) in a non-clamped outer region (AB) of the disk-shaped workpiece from the predetermined height position (Z0) as per the deformation by means of a fixed-height detector device by rotating the clamping device (5, 5a, 15a-c; 5, 5a, 15d) or the detector device to corresponding angles of rotation (φ1-φ8); wherein the clamping of the inner region (IB) of the mould wafer takes place using a plurality of bearing pins and a plurality of vacuum suction elements ; wherein in each case one bearing pin of the plurality of bearing pins is surrounded by in each case one associated one of the plurality of vacuum suction elements ; wherein the vacuum suction elements comprise a respective sealing lip that encloses the respective associated bearing pin ; characterized in that the mould wafer in the clamped state is carried by the bearing pins and the sealing lips. <EOS>