Sensor device package comprising: a header (102; 202) made of metal and having a first surface and a second surface, the header (102; 202) including a conduit between the first and second surface and an aperture in the first surface, wherein the aperture is in communication with the conduit ; and a die pad (104; 300) comprising a material selected from the group consisting of Invar, Kovar, glass, silicon, and ceramic and having a base and a support structure extending from the base , a MEMS device received by the die pad (104; 300) thereon, wherein the base of the die pad (104; 300) is hermetically sealed to the conduit of the header (102; 202), the base has a larger diameter than the support structure , the die pad (104; 300) has a coefficient of thermal expansion which is compliant with a coefficient of thermal expansion of the MEMS device, and characterized in that the base and the support structure of the die pad (104; 300) are made of the same material and formed as one piece, and in that the die pad (104; 300) further comprises a pedestal being located at and protruding from a top surface of the support structure , wherein the pedestal receives the MEMS device, wherein the pedestal and the support structure are integrally formed and made of the same material, wherein the support structure has a diameter which is smaller than a diameter of the base , wherein the support structure protrudes a height above a top surface of the base to ensure that stresses applied to the base are minimized at the MEMS device, wherein the pedestal has a height dimension as well as a diameter which is smaller than the diameter of the support structure . a header (102; 202) made of metal and having a first surface and a second surface, the header (102; 202) including a conduit between the first and second surface and an aperture in the first surface, wherein the aperture is in communication with the conduit ; and a die pad (104; 300) comprising a material selected from the group consisting of Invar, Kovar, glass, silicon, and ceramic and having a base and a support structure extending from the base , a MEMS device received by the die pad (104; 300) thereon, wherein the base of the die pad (104; 300) is hermetically sealed to the conduit of the header (102; 202), the base has a larger diameter than the support structure , the die pad (104; 300) has a coefficient of thermal expansion which is compliant with a coefficient of thermal expansion of the MEMS device, and characterized in that the base and the support structure of the die pad (104; 300) are made of the same material and formed as one piece, and in that the die pad (104; 300) further comprises a pedestal being located at and protruding from a top surface of the support structure , wherein the pedestal receives the MEMS device, wherein the pedestal and the support structure are integrally formed and made of the same material, wherein the support structure has a diameter which is smaller than a diameter of the base , wherein the support structure protrudes a height above a top surface of the base to ensure that stresses applied to the base are minimized at the MEMS device, wherein the pedestal has a height dimension as well as a diameter which is smaller than the diameter of the support structure . <EOS>