A wafer transfer device of a semiconductor manufacturing process, for carrying a plurality of wafers (A), and the wafer transfer device comprising: a base , defined with a central axis (Y); a plurality of fixed rings (20A~20D), stacked on the base along the central axis (Y), each fixed ring (20A~20D) comprising a through hole and a channel , each through hole passing through each fixed ring (20A~20D) along the central axis (Y), a ring groove disposed in each fixed ring (20A~20D) along an inner rim of the through hole , and the channel extended from an outer periphery of each fixed ring (20A~20D) and communicating to the ring groove ; a rotating shaft , rotatably coupled to each through hole , and comprising a plurality of flow passages (33A~33D), each flow passage (33A~33D) comprising an interface and a port , and the port arranged corresponding to each fixed ring (20A~20D) and communicating with the ring groove ; a turntable , fixedly connected to the rotating shaft , and comprising a plurality of carriers (41A~41D) disposed on a side thereof away from the base , each carrier (41A~41D) equiangularly installed around the rotating shaft , a top surface of each carrier (41A~41D) carrying each wafer (A), each carrier (41A~41D) comprising a suction passage , two ends of each suction passage coupled to the top surface of the carrier (41A~41D) and the interface correspondingly, a plurality of channels correspondingly communicating with a plurality of ring grooves , the flow passages (33A~33D) and the suction passages to define a plurality of air suction passages ; an air suction pump , coupled to each channel , and configured to extract air from each air suction passage to form a negative pressure to suck each wafer (A); and a driving mechanism , configured to drive the turntable and the rotating shaft to rotate around the central axis (Y); wherein, when the turntable and the rotating shaft rotate, the port rotates relative to each fixed ring (20A~20D) and keeps communicating with each ring groove . a base , defined with a central axis (Y); a plurality of fixed rings (20A~20D), stacked on the base along the central axis (Y), each fixed ring (20A~20D) comprising a through hole and a channel , each through hole passing through each fixed ring (20A~20D) along the central axis (Y), a ring groove disposed in each fixed ring (20A~20D) along an inner rim of the through hole , and the channel extended from an outer periphery of each fixed ring (20A~20D) and communicating to the ring groove ; a rotating shaft , rotatably coupled to each through hole , and comprising a plurality of flow passages (33A~33D), each flow passage (33A~33D) comprising an interface and a port , and the port arranged corresponding to each fixed ring (20A~20D) and communicating with the ring groove ; a turntable , fixedly connected to the rotating shaft , and comprising a plurality of carriers (41A~41D) disposed on a side thereof away from the base , each carrier (41A~41D) equiangularly installed around the rotating shaft , a top surface of each carrier (41A~41D) carrying each wafer (A), each carrier (41A~41D) comprising a suction passage , two ends of each suction passage coupled to the top surface of the carrier (41A~41D) and the interface correspondingly, a plurality of channels correspondingly communicating with a plurality of ring grooves , the flow passages (33A~33D) and the suction passages to define a plurality of air suction passages ; an air suction pump , coupled to each channel , and configured to extract air from each air suction passage to form a negative pressure to suck each wafer (A); and a driving mechanism , configured to drive the turntable and the rotating shaft to rotate around the central axis (Y); wherein, when the turntable and the rotating shaft rotate, the port rotates relative to each fixed ring (20A~20D) and keeps communicating with each ring groove . <EOS>