A chip package assembly , comprising: a package substrate , comprising an upper conductive layer , a lower conductive layer , and a conductive part connected between the upper conductive layer and the lower conductive layer ; a chip , comprising a front electrode and a back electrode that are disposed opposite to each other, wherein the chip is embedded in the package substrate , the conductive part surrounds the chip , the front electrode is connected to the lower conductive layer , and the back electrode is connected to the upper conductive layer ; and a heat dissipation part , connected to a surface of the upper conductive layer that is away from the chip , wherein the upper conductive layer , the lower conductive layer , and the conductive part each have a heat-conducting property; wherein the heat dissipation part comprises a plurality of heat dissipation units , the plurality of heat dissipation units each are connected to the upper conductive layer , and the plurality of heat dissipation units are spaced from each other; wherein an extension direction of each heat dissipation unit and an extension direction of the upper conductive layer are arranged at an included angle; characterized in that an extension direction of some heat dissipation units is a first direction , an extension direction of some heat dissipation units is a second direction , and the first direction is different from the second direction and wherein, a first refrigeration part is disposed on a periphery of the chip package assembly in the first direction and a second refrigeration part is disposed on a periphery of the chip package assembly in the second direction . a package substrate , comprising an upper conductive layer , a lower conductive layer , and a conductive part connected between the upper conductive layer and the lower conductive layer ; a chip , comprising a front electrode and a back electrode that are disposed opposite to each other, wherein the chip is embedded in the package substrate , the conductive part surrounds the chip , the front electrode is connected to the lower conductive layer , and the back electrode is connected to the upper conductive layer ; and a heat dissipation part , connected to a surface of the upper conductive layer that is away from the chip , wherein the upper conductive layer , the lower conductive layer , and the conductive part each have a heat-conducting property; wherein the heat dissipation part comprises a plurality of heat dissipation units , the plurality of heat dissipation units each are connected to the upper conductive layer , and the plurality of heat dissipation units are spaced from each other; wherein an extension direction of each heat dissipation unit and an extension direction of the upper conductive layer are arranged at an included angle; characterized in that an extension direction of some heat dissipation units is a first direction , an extension direction of some heat dissipation units is a second direction , and the first direction is different from the second direction and wherein, a first refrigeration part is disposed on a periphery of the chip package assembly in the first direction and a second refrigeration part is disposed on a periphery of the chip package assembly in the second direction . <EOS>