A printed circuit board comprising: a core insulating layer comprising a first insulating layer and a second insulating layer ; at least one via formed through the core insulating layer; an inner circuit layer buried in the core insulating layer; and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, the printed circuit board being characterized in that the via includes a first part , a second part below the first part , and a third part between the first part and second part , and the third part includes a metal different from a metal of the first part and second part , wherein the inner circuit layer comprises a first portion buried in a lower part of the first insulating layer , wherein the inner circuit layer is spaced apart from the via in a horizontal direction, wherein a sectional shape of the third part of the via is same as a sectional shape of the first portion of the inner circuit layer , wherein a top surface of the third part of the via portions lie in the same plane as a top surface of the first portion of the inner circuit layer , wherein a bottom surface of the third part of the via portions lie in the same plane as a bottom surface of the first portion of the inner circuit layer , wherein the first part and second part of the via are formed by using a same material, wherein the first portion of the inner circuit layer and the third part of the via are formed by using a same material, wherein a bottom surface of the first part is directly contacted with a top surface of the third part , and a bottom surface of the third part is directly contacted with a top surface of the second part , wherein a combined sectional shape of the first part , the second part , and the third part is hexagonal. a core insulating layer comprising a first insulating layer and a second insulating layer ; at least one via formed through the core insulating layer; an inner circuit layer buried in the core insulating layer; and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, the printed circuit board being characterized in that the via includes a first part , a second part below the first part , and a third part between the first part and second part , and the third part includes a metal different from a metal of the first part and second part , wherein the inner circuit layer comprises a first portion buried in a lower part of the first insulating layer , wherein the inner circuit layer is spaced apart from the via in a horizontal direction, wherein a sectional shape of the third part of the via is same as a sectional shape of the first portion of the inner circuit layer , wherein a top surface of the third part of the via portions lie in the same plane as a top surface of the first portion of the inner circuit layer , wherein a bottom surface of the third part of the via portions lie in the same plane as a bottom surface of the first portion of the inner circuit layer , wherein the first part and second part of the via are formed by using a same material, wherein the first portion of the inner circuit layer and the third part of the via are formed by using a same material, wherein a bottom surface of the first part is directly contacted with a top surface of the third part , and a bottom surface of the third part is directly contacted with a top surface of the second part , wherein a combined sectional shape of the first part , the second part , and the third part is hexagonal. <EOS>