A probing system comprising: a device-under-test that includes a plurality of test patterns on a first surface ; a probe device that includes a plurality of tilt angle sensors , wherein the plurality of tilt angle sensors include a plurality of spikes that protrude from a second surface of the probe device ; and a die bonder having a spherical positioner that is adjustable in a plurality of rotational axes , wherein the die bonder is operational to: mount the device-under-test with the first surface facing outward; mount the probe device with the second surface of the probe device facing the first surface of the device-under-test ; compress the probe device and the device-under-test together with a first force that causes a subset of the plurality of spikes to contact the plurality of test patterns ; measure a number of electrical connections formed between the plurality of tilt angle sensors and the plurality of test patterns ; determine a first offset angle and a second offset angle between the first surface of the device-under-test and the second surface of the probe device based on the number of electrical connections; separate the probe device from the device-under-test ; and adjust the spherical positioner in one or more of the plurality of rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the first surface of the device-under-test and the second surface of the probe device . a device-under-test that includes a plurality of test patterns on a first surface ; a probe device that includes a plurality of tilt angle sensors , wherein the plurality of tilt angle sensors include a plurality of spikes that protrude from a second surface of the probe device ; and a die bonder having a spherical positioner that is adjustable in a plurality of rotational axes , wherein the die bonder is operational to: mount the device-under-test with the first surface facing outward; mount the probe device with the second surface of the probe device facing the first surface of the device-under-test ; compress the probe device and the device-under-test together with a first force that causes a subset of the plurality of spikes to contact the plurality of test patterns ; measure a number of electrical connections formed between the plurality of tilt angle sensors and the plurality of test patterns ; determine a first offset angle and a second offset angle between the first surface of the device-under-test and the second surface of the probe device based on the number of electrical connections; separate the probe device from the device-under-test ; and adjust the spherical positioner in one or more of the plurality of rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the first surface of the device-under-test and the second surface of the probe device . mount the device-under-test with the first surface facing outward; mount the probe device with the second surface of the probe device facing the first surface of the device-under-test ; compress the probe device and the device-under-test together with a first force that causes a subset of the plurality of spikes to contact the plurality of test patterns ; measure a number of electrical connections formed between the plurality of tilt angle sensors and the plurality of test patterns ; determine a first offset angle and a second offset angle between the first surface of the device-under-test and the second surface of the probe device based on the number of electrical connections; separate the probe device from the device-under-test ; and adjust the spherical positioner in one or more of the plurality of rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the first surface of the device-under-test and the second surface of the probe device . <EOS>