A display device (DD) comprising: a base member (BSM) comprising a first area (AR1) and a second area (AR2) disposed adjacent to the first area (AR1); a circuit layer (DP-CL) disposed on the base member (BSM) to cover the first area (AR1) and to expose the second area (AR2); a display layer (DP-OLED) disposed on the circuit layer (DP-CL); a thin film encapsulation layer (TFE) disposed on the display layer (DP-OLED); and a touch sensor layer (TS) comprising a conductive layer (TS-CL2) disposed on the thin film encapsulation layer (TFE) and an insulating layer (TS-IL2) comprising an organic layer to cover the conductive layer (TS-CL2) characterized in that the display device (DD) further comprises a shock-absorbing member (DM-C) disposed in the second area (AR2); the shock-absorbing member (DM-C) comprising a plurality of insulating patterns (DM-CP) disposed on the base member (BSM) and a cover member (DM-CC) covering the plurality of insulating patterns (DM-CP); the cover member (DM-CC) is overlapped with the second area (AR2) and is partially overlapped with the first area (AR1); the insulating layer (TS-IL2) is disposed on the touch sensor layer (TS) and covers the second area (AR2) such that the insulating layer (TS-IL2) covers the shock-absorbing member (DM-C) to relieve a stress generated upon bending the display device (DD); each insulating pattern of the plurality of insulating patterns (DM-CP) is spaced apart from each other in a first direction; the insulating patterns are arranged one behind another along the first direction from the end of the circuit layer (DP-CL) and spaced apart from each other; and the organic layer covers an upper surface and a side surface of the shock-absorbing member (DM-C). a base member (BSM) comprising a first area (AR1) and a second area (AR2) disposed adjacent to the first area (AR1); a circuit layer (DP-CL) disposed on the base member (BSM) to cover the first area (AR1) and to expose the second area (AR2); a display layer (DP-OLED) disposed on the circuit layer (DP-CL); a thin film encapsulation layer (TFE) disposed on the display layer (DP-OLED); and a touch sensor layer (TS) comprising a conductive layer (TS-CL2) disposed on the thin film encapsulation layer (TFE) and an insulating layer (TS-IL2) comprising an organic layer to cover the conductive layer (TS-CL2) characterized in that the display device (DD) further comprises a shock-absorbing member (DM-C) disposed in the second area (AR2); the shock-absorbing member (DM-C) comprising a plurality of insulating patterns (DM-CP) disposed on the base member (BSM) and a cover member (DM-CC) covering the plurality of insulating patterns (DM-CP); the cover member (DM-CC) is overlapped with the second area (AR2) and is partially overlapped with the first area (AR1); the insulating layer (TS-IL2) is disposed on the touch sensor layer (TS) and covers the second area (AR2) such that the insulating layer (TS-IL2) covers the shock-absorbing member (DM-C) to relieve a stress generated upon bending the display device (DD); each insulating pattern of the plurality of insulating patterns (DM-CP) is spaced apart from each other in a first direction; the insulating patterns are arranged one behind another along the first direction from the end of the circuit layer (DP-CL) and spaced apart from each other; and the organic layer covers an upper surface and a side surface of the shock-absorbing member (DM-C). <EOS>