A method for manufacturing a nickel-chromium plated member, comprising: pretreating a surface of a substrate ; the surface of the substrate is pretreated by the following steps in sequence including surface deoiling, surface hydrophilic treatment, surface coarsening treatment, surface neutralization treatment, pre-immerse, surface activation treatment and surface dispergation treatment; depositing a pretreatment plating layer over the whole substrate , the pretreatment plating layer is a composite layer of a chemical nickel layer with a basic nickel layer , in which the chemical nickel layer is deposited over the whole substrate , the base nickel layer is deposited over the chemical nickel layer ; and forming a copper plating layer on the base nickel layer ; and forming a basic layer on the copper plating layer ; and forming a functional layer on the basic layer ; and forming a decorative layer on the functional layer ; wherein, the basic layer comprising a semi-bright nickel layer and a bright nickel layer , the semi-bright nickel layer is formed on the copper plating layer and the bright nickel layer is formed on the semi-bright nickel layer ; the functional layer comprising a low potential nickel layer and a microporous nickel layer , in which the low potential nickel layer is formed on the bright nickel layer , the microporous nickel layer is formed on the low potential nickel layer , and potential difference between the microporous nickel layer and the low potential nickel layer is 10-120mV; potential difference between the bright nickel layer and the low potential nickel layer is 60mV; the potential difference between the semi-bright nickel layer and the bright nickel layer is 100-200mV, the potential of the bright nickel layer is lower than the potential of the semi-bright nickel layer ; the low potential nickel layer is a micro-crack nickel layer, the micro-crack nickel layer refers to an even plating layer having cracks; the microporous nickel layer refers to an even plating layer having nonconductive particles; the decorative layer formed on the microporous nickel layer , in which the decorative layer is a trivalent chromium plating layer or a hexavalent chromium plating layer. pretreating a surface of a substrate ; the surface of the substrate is pretreated by the following steps in sequence including surface deoiling, surface hydrophilic treatment, surface coarsening treatment, surface neutralization treatment, pre-immerse, surface activation treatment and surface dispergation treatment; depositing a pretreatment plating layer over the whole substrate , the pretreatment plating layer is a composite layer of a chemical nickel layer with a basic nickel layer , in which the chemical nickel layer is deposited over the whole substrate , the base nickel layer is deposited over the chemical nickel layer ; and forming a copper plating layer on the base nickel layer ; and forming a basic layer on the copper plating layer ; and forming a functional layer on the basic layer ; and forming a decorative layer on the functional layer ; wherein, the basic layer comprising a semi-bright nickel layer and a bright nickel layer , the semi-bright nickel layer is formed on the copper plating layer and the bright nickel layer is formed on the semi-bright nickel layer ; the functional layer comprising a low potential nickel layer and a microporous nickel layer , in which the low potential nickel layer is formed on the bright nickel layer , the microporous nickel layer is formed on the low potential nickel layer , and potential difference between the microporous nickel layer and the low potential nickel layer is 10-120mV; <EOS>