A processing module for a build plate , comprising - an input station , - a maneuvering station , - a sawing device , and - a control unit, wherein the input station comprises a receptacle for a build plate , the build plate bundling several individual components , the maneuvering station comprising a pivoting device for transporting and pivoting the build plate , and wherein the processing module further comprises a granulate bath which can be pressurized with gas for receiving and fixing the individual components relative to the build plate , wherein the granulate bath is in a quasi-solid state in a resting state and in a quasi-liquid state when pressurized gas is applied, wherein the sawing device comprises a cutting wire configured to separate the individual components from the build plate , wherein the granulate bath is in a quasi-solid state during the separation, characterized in that the sawing device comprises a drive coil and a counter coil , wherein the drive coil is configured to wind the cutting wire in a first direction, and wherein the counter coil is configured to tension the cutting wire in an opposite, second direction, in that the processing module further comprising a wear monitoring device, in that the wear monitoring device being configured to measure a cutting force of the cutting wire during a cutting process and, based on the measured cutting force, to output a statement about current wear of the cutting wire , wherein increasing wire wear can be derived from an increasing cutting force, and in that the control unit being configured to control at least one of the coils for a constant wire tension of the cutting wire during a cutting process. - an input station , - a maneuvering station , - a sawing device , and - a control unit, wherein the input station comprises a receptacle for a build plate , the build plate bundling several individual components , the maneuvering station comprising a pivoting device for transporting and pivoting the build plate , and wherein the processing module further comprises a granulate bath which can be pressurized with gas for receiving and fixing the individual components relative to the build plate , wherein the granulate bath is in a quasi-solid state in a resting state and in a quasi-liquid state when pressurized gas is applied, wherein the sawing device comprises a cutting wire configured to separate the individual components from the build plate , wherein the granulate bath is in a quasi-solid state during the separation, characterized in that the sawing device comprises a drive coil and a counter coil , wherein the drive coil is configured to wind the cutting wire in a first direction, and wherein the counter coil is configured to tension the cutting wire in an opposite, second direction, in that the processing module further comprising a wear monitoring device, in that the wear monitoring device being configured to measure a cutting force of the cutting wire during a cutting process and, based on the measured cutting force, to output a statement about current wear of the cutting wire , wherein increasing wire wear can be derived from an increasing cutting force, and in that the control unit being configured to control at least one of the coils for a constant wire tension of the cutting wire during a cutting process. <EOS>