A display device , comprising: a flexible substrate including a first region (A1), a second region (A2), and a bending area (BA) disposed between the first region and the second region; a first protection film (300 a) disposed on the first region of the substrate ; and a second protection film (300 b) disposed on the second region of the substrate , on the same side of the substrate as the first protection film , wherein the substrate is bent in the bending area (BA), and the first protection film (300 a) and the second protection film (300 b) are disposed on either side of the bending area (BA), wherein at least a portion of space that separates the first protection film from the second protection film is disposed in the bending area (BA), wherein a driving integrated circuit chip is disposed on the first region (A1) of the substrate , the driving integrated circuit chip disposed at a position corresponding to the position of the first protection film (300 a), and a display unit is disposed on the second region (A2) and connected to the driving integrated circuit chip via wires disposed on the substrate, the display device further comprising: a first adhesive layer (30 a) disposed between the first protection film (300 a) and the substrate ; and a second adhesive layer (30 b) disposed between the second protection film (300 b) and the substrate characterized in that a tensile modulus of the first protection film (300 a) is larger than that of the second protection film (300 b), and the storage modulus of the first adhesive layer (30 a) is larger than that of the second adhesive layer (30 b). a flexible substrate including a first region (A1), a second region (A2), and a bending area (BA) disposed between the first region and the second region; a first protection film (300 a) disposed on the first region of the substrate ; and a second protection film (300 b) disposed on the second region of the substrate , on the same side of the substrate as the first protection film , wherein the substrate is bent in the bending area (BA), and the first protection film (300 a) and the second protection film (300 b) are disposed on either side of the bending area (BA), wherein at least a portion of space that separates the first protection film from the second protection film is disposed in the bending area (BA), wherein a driving integrated circuit chip is disposed on the first region (A1) of the substrate , the driving integrated circuit chip disposed at a position corresponding to the position of the first protection film (300 a), and a display unit is disposed on the second region (A2) and connected to the driving integrated circuit chip via wires disposed on the substrate, the display device further comprising: a first adhesive layer (30 a) disposed between the first protection film (300 a) and the substrate ; and a second adhesive layer (30 b) disposed between the second protection film (300 b) and the substrate a first adhesive layer (30 a) disposed between the first protection film (300 a) and the substrate ; and a second adhesive layer (30 b) disposed between the second protection film (300 b) and the substrate characterized in that a tensile modulus of the first protection film (300 a) is larger than that of the second protection film (300 b), and the storage modulus of the first adhesive layer (30 a) is larger than that of the second adhesive layer (30 b). <EOS>