A light-emitting device, comprising: - a substrate having a first cavity , a second cavity , a third cavity , a top surface and a bottom surface opposite to the top surface, wherein the second cavity is formed between the first cavity and the third cavity ; - a protruding portion or a pair of isolation portions formed in the first cavity; - a first rectifier diode and a second rectifier diode formed in the first cavity and being separated by the protruding portion or the pair of isolation portions ; - a third rectifier diode and a fourth rectifier diode formed in the third cavity ; - at least one light-emitting diode module arranged in the second cavity and comprising a plurality of light-emitting diodes (106a-106d); - an upper conductive wire layer buried within the substrate for providing electrical connections between the rectifier diodes (104a, ..., 104d) in the first cavity and the third cavity ; - a middle conductive wire layer (26a, ..., 26d) buried within the substrate and arranged between the upper conductive wire layer and the bottom surface for providing electrical connections between the rectifier diodes (104a, ..., 104d) and the light-emitting diode module and for providing electrical connections between the plurality of light-emitting diodes (106a-106d); - a via (30a, ..., 30d) located on the substrate and penetrating the upper conductive wire layer or the middle conductive wire layer (26a, ..., 26d); and - conductive wires for electrically connecting the rectifier diodes (104a, ..., 104d) and the light-emitting diodes (106a-106d) to the upper conductive wire layer or the middle conductive wire layer (26a, ..., 26d). - a substrate having a first cavity , a second cavity , a third cavity , a top surface and a bottom surface opposite to the top surface, wherein the second cavity is formed between the first cavity and the third cavity ; - a protruding portion or a pair of isolation portions formed in the first cavity; - a first rectifier diode and a second rectifier diode formed in the first cavity and being separated by the protruding portion or the pair of isolation portions ; - a third rectifier diode and a fourth rectifier diode formed in the third cavity ; - at least one light-emitting diode module arranged in the second cavity and comprising a plurality of light-emitting diodes (106a-106d); - an upper conductive wire layer buried within the substrate for providing electrical connections between the rectifier diodes (104a, ..., 104d) in the first cavity and the third cavity ; - a middle conductive wire layer (26a, ..., 26d) buried within the substrate and arranged between the upper conductive wire layer and the bottom surface for providing electrical connections between the rectifier diodes (104a, ..., 104d) and the light-emitting diode module and for providing electrical connections between the plurality of light-emitting diodes (106a-106d); - a via (30a, ..., 30d) located on the substrate and penetrating the upper conductive wire layer or the middle conductive wire layer (26a, ..., 26d); and - conductive wires for electrically connecting the rectifier diodes (104a, ..., 104d) and the light-emitting diodes (106a-106d) to the upper conductive wire layer or the middle conductive wire layer (26a, ..., 26d). <EOS>