mhurhangee/patent-ind-claim-en huggingface dataset:
A vibration unit , comprising: a rod member having a coil assembly coupled to the rod member ; a core assembly operable to receive the rod member therein, the core assembly having a plurality of magnet members disposed along the periphery of the core assembly ; wherein the coil assembly and magnet members are operable to impart linear motion to the rod member relative to the core assembly . a rod member having a coil assembly coupled to the rod member ; a core assembly operable to receive the rod member therein, the core assembly having a plurality of magnet members disposed along the periphery of the core assembly ; wherein the coil assembly and magnet members are operable to impart linear motion to the rod member relative to the core assembly .
A tiltable mould holder comprising a supporting surface suitable to support a mould for the production of semi-finished polyurethane products, said mould holder comprises: a rotary table and an assembly of kinematic mechanisms positioned above said rotary table ; said supporting surface being a mould holder surface positioned above said assembly of kinematic mechanisms ; said assembly of kinematic mechanisms comprises means for tilting said mould holder surface with respect to said rotary table ; said rotary table being capable of rotating said assembly of kinematic mechanisms ; characterised in that said mould holder surface is connected to a surface of said rotary table by means of a torsionally rigid joint designed to connect two drive shafts.
A power supply system comprising: a plurality of power converters (2702-1, 2702-2, 2702-N) configured to deliver a system load current to a load , the system load current being a combination of individual load currents provided by the plurality of power converters; and a system performance controller configured to detect a value of the system load current, the system performance controller configured to determine, using power loss information, values for the individual load currents such that a composite efficiency at the detected value of the system load current achieves at least a threshold level, the system performance controller configured to generate control signals to operate the plurality of power converters at the determined values, wherein the power loss information includes a plurality of load current combinations over a range of system load current values, each load current combination being associated with a corresponding composite efficiency, each load current combination corresponding to a separate combination of values for the individual load currents being provided by the plurality of power converters and resulting in a system load current. a plurality of power converters (2702-1, 2702-2, 2702-N) configured to deliver a system load current to a load , the system load current being a combination of individual load currents provided by the plurality of power converters; and a system performance controller configured to detect a value of the system load current, the system performance controller configured to determine, using power loss information, values for the individual load currents such that a composite efficiency at the detected value of the system load current achieves at least a threshold level, the system performance controller configured to generate control signals to operate the plurality of power converters at the determined values, wherein the power loss information includes a plurality of load current combinations over a range of system load current values, each load current combination being associated with a corresponding composite efficiency, each load current combination corresponding to a separate combination of values for the individual load currents being provided by the plurality of power converters and resulting in a system load current.
An isolated NTB-A ectodomain or an agonist thereof for use in treating cancer in a subject in need thereof, wherein said subject is afflicted with a tumor characterized by lack of substantial NTB-A surface expression, and wherein the agonist is an antibody specific to an NTB-A ectodomain.
Layered nonwoven textile containing - a first layer (T) of filaments, which contains endless filaments containing a first carrier polymer (A1) and a first binding polymer (B1), which forms at least a part of surface of said endless filaments and which has a melting temperature at least 5 °C lower than the first carrier polymer (A1), wherein the first layer (T) of filaments contains mutually spaced bonding points, which interconnect the filaments and are formed by the first binding polymer (B1), - a second layer (M) of filaments, which contains filaments containing a carrier material, the stiffness of which is lower than the stiffness of the first carrier polymer (A1), when the stiffness is measured as tensile elasticity modulus CSN EN ISO 527-1 and when the stiffness is measured as the flexural elasticity modulus using norm ISO 178:2010, and a second binding polymer (B2), which has a melting temperature at least 5 °C, preferably at least 10 °C, lower than the carrier material and the first carrier polymer (A1), wherein the second layer (M) of filaments contains mutually spaced bonding points, which interconnect the filaments of the second layer (M) and are formed by the second binding polymer (B1), wherein essentially every intersection of filaments forms a bonding point and wherein a median spacing distance between mutually adjacent bonding points in the first layer (T) of filaments is less than or equal to 8 mm, and/or a median spacing distance between mutually adjacent bonding points in the second layer (M) is less than or equal to 8 mm. - a first layer (T) of filaments, which contains endless filaments containing a first carrier polymer (A1) and a first binding polymer (B1), which forms at least a part of surface of said endless filaments and which has a melting temperature at least 5 °C lower than the first carrier polymer (A1), wherein the first layer (T) of filaments contains mutually spaced bonding points, which interconnect the filaments and are formed by the first binding polymer (B1), - a second layer (M) of filaments, which contains filaments containing a carrier material, the stiffness of which is lower than the stiffness of the first carrier polymer (A1), when the stiffness is measured as tensile elasticity modulus CSN EN ISO 527-1 and when the stiffness is measured as the flexural elasticity modulus using norm ISO 178:2010, and a second binding polymer (B2), which has a melting temperature at least 5 °C, preferably at least 10 °C, lower than the carrier material and the first carrier polymer (A1), wherein the second layer (M) of filaments contains mutually spaced bonding points, which interconnect the filaments of the second layer (M) and are formed by the second binding polymer (B1), wherein essentially every intersection of filaments forms a bonding point and wherein a median spacing distance between mutually adjacent bonding points in the first layer (T) of filaments is less than or equal to 8 mm, and/or a median spacing distance between mutually adjacent bonding points in the second layer (M) is less than or equal to 8 mm.
An apparatus for activation of at least one element, the apparatus comprising a) at least one activation layer that comprises an electrically conducting polymer, wherein the at least one activation layer is arranged on a surface of a substrate that is made of an electrically insulating material; b) at least one migration layer deposited on the at least one activation layer so that the at least one activation layer and the at least migration layer are in contact, wherein the at least one migration layer is permeable to a fluid along a transversal direction across a surface of the at least one migration layer such that a change in doping level of the electrically conductive polymer of the at least one activation layer is achievable, for activating the at least one activation layer along the transversal direction for the portion of the activation layer that is in contact with the fluid ; and c) an encapsulating layer that covers the at least one migration layer , leaving a migration layer edge of the at least one migration layer exposed, so that the migration layer edge is accessible to a fluid for activation of the at least one element. a) at least one activation layer that comprises an electrically conducting polymer, wherein the at least one activation layer is arranged on a surface of a substrate that is made of an electrically insulating material; b) at least one migration layer deposited on the at least one activation layer so that the at least one activation layer and the at least migration layer are in contact, wherein the at least one migration layer is permeable to a fluid along a transversal direction across a surface of the at least one migration layer such that a change in doping level of the electrically conductive polymer of the at least one activation layer is achievable, for activating the at least one activation layer along the transversal direction for the portion of the activation layer that is in contact with the fluid ; and c) an encapsulating layer that covers the at least one migration layer , leaving a migration layer edge of the at least one migration layer exposed, so that the migration layer edge is accessible to a fluid for activation of the at least one element.
A back reamer comprising: a drive stem configured to support a main reamer body , the main reamer body comprising a plurality of receptacles ; a plurality of cutting leg assemblies in positive locking engagement with the plurality of receptacles to restrict radial movement of the cutting leg assemblies ; the positive locking engagement between the plurality of receptacles and the plurality of cutting leg assemblies comprises a cross pin configured to engage a corresponding cutout, wherein the corresponding cutout is partially formed in a back wall of the cutting leg assembly and partially formed in a back wall of the receptacle and wherein the cutting leg assembly is secured to the main reamer body with at least one taper pin inserted in a direction perpendicular to a central axis of the main reamer body characterized in that : the cross pin is inserted in a direction perpendicular to a central axis of the main reamer body. a drive stem configured to support a main reamer body , the main reamer body comprising a plurality of receptacles ; a plurality of cutting leg assemblies in positive locking engagement with the plurality of receptacles to restrict radial movement of the cutting leg assemblies ; the positive locking engagement between the plurality of receptacles and the plurality of cutting leg assemblies comprises a cross pin configured to engage a corresponding cutout, wherein the corresponding cutout is partially formed in a back wall of the cutting leg assembly and partially formed in a back wall of the receptacle and wherein the cutting leg assembly is secured to the main reamer body with at least one taper pin inserted in a direction perpendicular to a central axis of the main reamer body characterized in that : the cross pin is inserted in a direction perpendicular to a central axis of the main reamer body.
A floor guide for single-track or multi-track sliding doors , comprising a guide channel for rails , a central bar for a floor support for laying down a strip-shaped floor covering , wherein the central bar is designed to be detachably connectable to the bottom of the guide channel , characterized in that the central bar is formed in two parts, and a left and a right element of the central bar are formed so as to be able, each individually, to be locked at the bottom of the guide channel into lateral guide means at the bottom of the guide channel . wherein the central bar is designed to be detachably connectable to the bottom of the guide channel , characterized in that the central bar is formed in two parts, and a left and a right element of the central bar are formed so as to be able, each individually, to be locked at the bottom of the guide channel into lateral guide means at the bottom of the guide channel .
Electrical connection device for an insulated metal substrate, the device comprising a substrate, a contact terminal, and at least one rod fixed to a metal plate of the substrate and on which is fixed the contact terminal which is in electrical contact with a conductive track carried by the substrate, the terminal comprising a hole allowing the passage of the rod, the device being characterized in that it further comprises a clamping means and an annular seal made of insulating material, the device comprising an insulating barrel which has a tubular part positioned in the hole and a collar which is kept applied against the terminal by the clamping means integral with the rod, the barrel thus ensuring the electrical insulation of the terminal and the rod, the hole of the terminal comprising a flaring receiving the annular seal which is interposed between the rod and the terminal.
Heat exchanger to direct heat exchange between hot gases of a hot source and a working fluid of an Organic Rankine Cycle system, comprising at least two tube bundles having a plurality of tubes being adapted that inside them the working fluid flows, an inlet manifold from which the working fluid enters and an outlet manifold from which the working fluid in a vapor phase comes out comprising: - a first portion crossed downward along the vertical direction of the heat exchanger by the hot gases - a second portion crossed upward along he vertical direction of the heat exchanger by the hot gases coming from the portion , characterised in that - an intermediate manifold is positioned between a last row of tubes of the second portion and a first row of tubes of the first portion and that said heat exchanger further comprises a plurality of sacrificial tubes, which are tubes or metal sheets made of high temperature resistant material, configured not to be crossed by the working fluid. - a first portion crossed downward along the vertical direction of the heat exchanger by the hot gases - a second portion crossed upward along he vertical direction of the heat exchanger by the hot gases coming from the portion , characterised in that - an intermediate manifold is positioned between a last row of tubes of the second portion and a first row of tubes of the first portion and that said heat exchanger further comprises a plurality of sacrificial tubes, which are tubes or metal sheets made of high temperature resistant material, configured not to be crossed by the working fluid.
A semiconductor device comprising: a base substrate including an upper surface ; a nucleation layer disposed over the upper surface of the base substrate , wherein the nucleation layer comprises a heteroepitaxial layer formed from a material selected from aluminum nitride, gallium nitride, aluminum gallium nitride, indium gallium nitride, and indium aluminum nitride; a first semiconductor layer disposed over the nucleation layer ; a second semiconductor layer disposed over the first semiconductor layer , wherein the first and second semiconductor layers include one or more III-N semiconductor layers; a channel within the second semiconductor layer and proximate to an upper surface of the second semiconductor layer ; and an enhanced resistivity region , in which one or more ion species are implanted, wherein the enhanced resistivity region has an upper boundary located a distance below the channel and the upper surface of the second semiconductor layer , and wherein the enhanced resistivity region extends through the first semiconductor layer , characterized in that the enhanced resistivity region has a disrupted crystal lattice. a base substrate including an upper surface ; a nucleation layer disposed over the upper surface of the base substrate , wherein the nucleation layer comprises a heteroepitaxial layer formed from a material selected from aluminum nitride, gallium nitride, aluminum gallium nitride, indium gallium nitride, and indium aluminum nitride; a first semiconductor layer disposed over the nucleation layer ; a second semiconductor layer disposed over the first semiconductor layer , wherein the first and second semiconductor layers include one or more III-N semiconductor layers; a channel within the second semiconductor layer and proximate to an upper surface of the second semiconductor layer ; and an enhanced resistivity region , in which one or more ion species are implanted, wherein the enhanced resistivity region has an upper boundary located a distance below the channel and the upper surface of the second semiconductor layer , and wherein the enhanced resistivity region extends through the first semiconductor layer , characterized in that the enhanced resistivity region has a disrupted crystal lattice.
A modified conjugated diene polymer satisfying the following conditions (I) to (IV): (I) at least two peaks are observed in a molecular weight distribution curve obtained from measurement by gel permeation chromatography (GPC); (II) when a peak of the highest molecular weight is defined as a peak (B), a peak of the largest peak area except for the peak (B) is defined as a peak (T) in the molecular weight distribution curve, a peak molecular weight of the peak (B) is from 500,000 to 2,500,000 and a peak molecular weight of the peak (T) is from 150,000 to 600,000; (III) an area of the peak (T) is from 30% to 80% and a total value of an area of the peak (B) and the area of the peak (T) is 65% or more when the total area of the molecular weight distribution curve is defined as 100%; and (IV) a proportion of a modified polymer chain in a region ranging from a low-molecular-weight side to a point of 5% cumulative area is from 60% to 99% in the molecular weight distribution curve. (I) at least two peaks are observed in a molecular weight distribution curve obtained from measurement by gel permeation chromatography (GPC); (II) when a peak of the highest molecular weight is defined as a peak (B), a peak of the largest peak area except for the peak (B) is defined as a peak (T) in the molecular weight distribution curve, a peak molecular weight of the peak (B) is from 500,000 to 2,500,000 and a peak molecular weight of the peak (T) is from 150,000 to 600,000; (III) an area of the peak (T) is from 30% to 80% and a total value of an area of the peak (B) and the area of the peak (T) is 65% or more when the total area of the molecular weight distribution curve is defined as 100%; and (IV) a proportion of a modified polymer chain in a region ranging from a low-molecular-weight side to a point of 5% cumulative area is from 60% to 99% in the molecular weight distribution curve.
A method of analyzing a positional relationship between a dental restoration and a dental substructure prepared for receiving the dental restoration, the method comprising the steps of: scanning a reference area and determining the shape of at least a portion of the dental substructure in its positional relationship to the reference area, and thereby providing a virtual dental substructure model ; scanning the reference area along with scanning at least a portion of the dental restoration in fit position with the dental substructure to provide a virtual assembly model ; providing the shape of at least part of an inner surface and the shape of at least part of an outer surface of the dental restoration in the form of a virtual inner surface model and a virtual outer surface model , respectively; wherein the inner surface relates to a surface for fitting with the dental substructure; superposing the virtual dental substructure model and the virtual assembly model based on the reference area; superposing the virtual inner surface model and the virtual outer surface model with the virtual assembly model ; and providing fitting quality information based on a positional relationship between the virtual inner surface model and the virtual dental substructure model . scanning a reference area and determining the shape of at least a portion of the dental substructure in its positional relationship to the reference area, and thereby providing a virtual dental substructure model ; scanning the reference area along with scanning at least a portion of the dental restoration in fit position with the dental substructure to provide a virtual assembly model ; providing the shape of at least part of an inner surface and the shape of at least part of an outer surface of the dental restoration in the form of a virtual inner surface model and a virtual outer surface model , respectively; wherein the inner surface relates to a surface for fitting with the dental substructure; superposing the virtual dental substructure model and the virtual assembly model based on the reference area; superposing the virtual inner surface model and the virtual outer surface model with the virtual assembly model ; and providing fitting quality information based on a positional relationship between the virtual inner surface model and the virtual dental substructure model .
A wall-mountable wireless control device comprising: a yoke configured to mount the control device to an electrical wallbox; a user interface comprising an actuation member configured to receive a user input; an antenna configured to transmit or receive radio-frequency signals; a radio-frequency communication circuit configured to transmit or receive the radio-frequency signals via the antenna; and a control circuit responsive to the radio-frequency communication circuit, characterized in that the antenna comprises a slot antenna, wherein the slot antenna comprises a driven element defining a first elongated slot through which the actuation member of the user interface extends. a yoke configured to mount the control device to an electrical wallbox; a user interface comprising an actuation member configured to receive a user input; an antenna configured to transmit or receive radio-frequency signals; a radio-frequency communication circuit configured to transmit or receive the radio-frequency signals via the antenna; and a control circuit responsive to the radio-frequency communication circuit, characterized in that the antenna comprises a slot antenna, wherein the slot antenna comprises a driven element defining a first elongated slot through which the actuation member of the user interface extends.