A method for manufacturing a molded article , comprising: setting a circuit sheet including a first main surface , a second main surface opposed to the first main surface , and a conductive pattern in a first mold such that a first region (AR1) of the second main surface contacts a plateau portion of the first mold and a second region (AR2) of the second main surface does not contact the first mold ; clamping a second mold to the first mold such that the circuit sheet does not contact the second mold to form a cavity (Cv) where the first main surface and the second region (AR2) of the second main surface of the circuit sheet are exposed; introducing a molten material into the cavity (Cv) to bring the molten material into contact with the first main surface and the second region (AR2) of the second main surface of the circuit sheet ; cooling and solidifying the molten material to form a molded body made of resin having an outer surface opposed to the first main surface and an inner surface opposed to the second region (AR2) of the second main surface of the circuit sheet ; and opening the first mold and the second mold to take out the molded article , wherein in the setting, a first fixed portion of the circuit sheet is arranged in a first portion (Pa1) of the first mold , and a second fixed portion of the circuit sheet including the second region (AR2) is arranged in a second portion (Pa2) of the first mold , the first portion (Pa1) is a portion along at least one of a first protruding portion and a second protruding portion that are higher than the plateau portion and are provided along the plateau portion of the first mold , and the second portion (Pa2) is a portion in which neither the first protruding portion nor the second protruding portion is provided along the plateau portion . setting a circuit sheet including a first main surface , a second main surface opposed to the first main surface , and a conductive pattern in a first mold such that a first region (AR1) of the second main surface contacts a plateau portion of the first mold and a second region (AR2) of the second main surface does not contact the first mold ; clamping a second mold to the first mold such that the circuit sheet does not contact the second mold to form a cavity (Cv) where the first main surface and the second region (AR2) of the second main surface of the circuit sheet are exposed; introducing a molten material into the cavity (Cv) to bring the molten material into contact with the first main surface and the second region (AR2) of the second main surface of the circuit sheet ; cooling and solidifying the molten material to form a molded body made of resin having an outer surface opposed to the first main surface and an inner surface opposed to the second region (AR2) of the second main surface of the circuit sheet ; and opening the first mold and the second mold to take out the molded article , wherein in the setting, a first fixed portion of the circuit sheet is arranged in a first portion (Pa1) of the first mold , and a second fixed portion of the circuit sheet including the second region (AR2) is arranged in a second portion (Pa2) of the first mold , the first portion (Pa1) is a portion along at least one of a first protruding portion and a second protruding portion that are higher than the plateau portion and are provided along the plateau portion of the first mold , and the second portion (Pa2) is a portion in which neither the first protruding portion nor the second protruding portion is provided along the plateau portion . <EOS>