A photosensitive assembly (1010; 2010; 3010), comprising: at least one photosensitive element (1011; 2013; 3012), wherein the photosensitive element includes a top surface (10111; 20131; 30121) and a bottom surface (10112; 20132; 30123), with the top surface being suitable for photoelectric conversion; at least one circuit board (1012; 2012; 3011) with a window formed therein; wherein the photosensitive assembly comprises at least one packaging body (1013; 1013C; 20112; 3013) formed of molding material, wherein the photosensitive element and the circuit board are integrally packaged by the packaging body, the packaging body forms a light window (10134; 20111; 30131) corresponding to the photosensitive element, allowing light to pass through the light window to reach the top surface (10111; 20131; 30121) of the photosensitive element (1011; 2013; 3012) for photoelectric conversion, the circuit board comprises a circuit board main body (10121; 20121; 30111), and the circuit board main body has a window (10122; 20122; 301113), in which the photosensitive element is disposed, wherein the circuit board main body (10121; 20121; 30111) has a substrate inner wall to define the window (10122; 20122; 301113), and the photosensitive element has an outer side surface, wherein there is a first safety distance (L) between the outer side surface of the photosensitive element and the substrate inner wall so that the photosensitive element is not in contact with the substrate inner wall of the circuit board and thus a gap (10125; 2014) is formed, characterized in that the packaging body (1013; 20112; 3013) extends into the gap (10125; 2014) between the photosensitive element (1011; 2013; 3012) and the circuit board main body (10121; 20121; 30111), and overmolds the bottom surface of the photosensitive element (1011; 2013; 3012). at least one photosensitive element (1011; 2013; 3012), wherein the photosensitive element includes a top surface (10111; 20131; 30121) and a bottom surface (10112; 20132; 30123), with the top surface being suitable for photoelectric conversion; at least one circuit board (1012; 2012; 3011) with a window formed therein; wherein the photosensitive assembly comprises at least one packaging body (1013; 1013C; 20112; 3013) formed of molding material, wherein the photosensitive element and the circuit board are integrally packaged by the packaging body, the packaging body forms a light window (10134; 20111; 30131) corresponding to the photosensitive element, allowing light to pass through the light window to reach the top surface (10111; 20131; 30121) of the photosensitive element (1011; 2013; 3012) for photoelectric conversion, the circuit board comprises a circuit board main body (10121; 20121; 30111), and the circuit board main body has a window (10122; 20122; 301113), in which the photosensitive element is disposed, wherein the circuit board main body (10121; 20121; 30111) has a substrate inner wall to define the window (10122; 20122; 301113), and the photosensitive element has an outer side surface, wherein there is a first safety distance (L) between the outer side surface of the photosensitive element and the substrate inner wall so that the photosensitive element is not in contact with the substrate inner wall of the circuit board and thus a gap (10125; 2014) is formed, characterized in that the packaging body (1013; 20112; 3013) extends into the gap (10125; 2014) between the photosensitive element (1011; 2013; 3012) and the circuit board main body (10121; 20121; 30111), and overmolds the bottom surface of the photosensitive element (1011; 2013; 3012). <EOS>