A vehicle air-conditioning box, comprising: a main air duct , an air-conditioning air duct , a blower , a first heat dissipation structure , and a semiconductor refrigeration chip , wherein the main air duct is in communication with the air-conditioning air duct ; the blower , the first heat dissipation structure , and the semiconductor refrigeration chip are disposed in the main air duct ; and a first end of the semiconductor refrigeration chip is in contact with the first heat dissipation structure , the vehicle air-conditioning box further comprises a second heat dissipation structure , a heat conducting component , and a first electric control air door , wherein a second end of the semiconductor refrigeration chip is connected to the second heat dissipation structure through the heat conducting component , characterized in that a first air communication opening and a second air communication opening are disposed between the main air duct and the air-conditioning air duct , the first air communication opening is located between a first air duct section of the main air duct and the air-conditioning air duct , and the second air communication opening is located between a second air duct section of the main air duct and the air-conditioning air duct ; the first electric control air door is disposed at the first air communication opening , when the first electric control air door is located at a first position, the first electric control air door blocks the first air duct section from the second air duct section , and the first air duct section is in communication with the air-conditioning air duct , and when the first electric control air door is located at a second position, the first electric control air door blocks the first air duct section from the air-conditioning air duct , and the first air duct section is in communication with the second air duct section ; and the second heat dissipation structure is disposed in the second air duct section . the main air duct is in communication with the air-conditioning air duct ; the blower , the first heat dissipation structure , and the semiconductor refrigeration chip are disposed in the main air duct ; and a first end of the semiconductor refrigeration chip is in contact with the first heat dissipation structure , the vehicle air-conditioning box further comprises a second heat dissipation structure , a heat conducting component , and a first electric control air door , wherein a second end of the semiconductor refrigeration chip is connected to the second heat dissipation structure through the heat conducting component , characterized in that a first air communication opening and a second air communication opening are disposed between the main air duct and the air-conditioning air duct , the first air communication opening is located between a first air duct section of the main air duct and the air-conditioning air duct , and the second air communication opening is located between a second air duct section of the main air duct and the air-conditioning air duct ; the first electric control air door is disposed at the first air communication opening , when the first electric control air door is located at a first position, the first electric control air door blocks the first air duct section from the second air duct section , and the first air duct section is in communication with the air-conditioning air duct , and when the first electric control air door is located at a second position, the first electric control air door blocks the first air duct section from the air-conditioning air duct , and the first air duct section is in communication with the second air duct section ; and the second heat dissipation structure is disposed in the second air duct section . <EOS>