An imprint apparatus configured to execute imprint processing including a contact process of bringing imprint material (IM) on a substrate (S) and a mold (M) in contact with each other, an alignment process of performing alignment of the substrate and the mold after the contact process, and a curing process of curing the imprint material after the alignment process, the imprint material being in a state in which the imprint material and the mold are in contact with each other, the imprint apparatus comprising: a modulator configured to modulate incident light; a first optical system configured to guide first light from a first light source to the modulator , and second light from a second light source to the modulator , the second light having a wavelength different from a wavelength of the first light; and a second optical system configured to guide modulated light modulated by the modulator to the substrate (S), wherein, by guiding first modulated light obtained by the modulator modulating the first light to the substrate (S), the substrate (S) is deformed for alignment of the substrate (S) and the mold (M), wherein by guiding second modulated light that partially cures the imprint material and is generated by the modulator modulating the second light to the substrate (S), the viscosity of imprint material (IM) supplied onto the substrate (S) is increased, and wherein the imprint apparatus is configured to perform an operation (D) of guiding the first modulated light and an operation (C) of guiding the second modulated light at different timing from each other, and to perform the operation (C) of guiding the second modulated light during an alignment process of performing alignment of the substrate (S) and the mold (M), after the imprint material (IM) on the substrate (S) and the mold (M) are brought in contact with each other. a contact process of bringing imprint material (IM) on a substrate (S) and a mold (M) in contact with each other, an alignment process of performing alignment of the substrate and the mold after the contact process, and a curing process of curing the imprint material after the alignment process, the imprint material being in a state in which the imprint material and the mold are in contact with each other, a modulator configured to modulate incident light; a first optical system configured to guide first light from a first light source to the modulator , and second light from a second light source to the modulator , the second light having a wavelength different from a wavelength of the first light; and a second optical system configured to guide modulated light modulated by the modulator to the substrate (S), wherein, by guiding first modulated light obtained by the modulator modulating the first light to the substrate (S), the substrate (S) is deformed for alignment of the substrate (S) and the mold (M), wherein by guiding second modulated light that partially cures the imprint material and is generated by the modulator modulating the second light to the substrate (S), the viscosity of imprint material (IM) supplied onto the substrate (S) is increased, and wherein the imprint apparatus is configured to perform an operation (D) of guiding the first modulated light and an operation (C) of guiding the second modulated light at different timing from each other, and to perform the operation (C) of guiding the second modulated light during an alignment process of performing alignment of the substrate (S) and the mold (M), after the imprint material (IM) on the substrate (S) and the mold (M) are brought in contact with each other. <EOS>