A method of making an assembly, comprising: juxtaposing a top surface of a first electrically conductive element (934; 1334; 1534; 1634) at a first surface (922; 1322; 1522; 1622) of a first substrate (920; 1320; 1520; 1620) with a top surface of a second electrically conductive element a (932; 1332; 1530; 1630) at a major surface (912; 1312; 1512; 1612) of a second substrate (910; 1310; 1510; 1610), the first surface of the first substrate and the major surface of the second substrate each comprising a dielectric material, wherein either the top surface of the first electrically conductive element is recessed below the first surface of the first substrate, or the top surface of the second electrically conductive element is recessed below the major surface of the second substrate, and electrically conductive nanoparticles (950; 1350; 1550) are disposed between the top surfaces of the first and second electrically conductive elements, the electrically conductive nanoparticles having long dimensions smaller than 100 nanometers; directly bonding the dielectric material of the first surface with the dielectric material of the major surface; and elevating a temperature at least at interfaces of the juxtaposed first and second electrically conductive elements to a joining temperature at which the electrically conductive nanoparticles cause metallurgical joints to form between the juxtaposed first and second electrically conductive elements, being characterized in that the electrically conductive nanoparticles are deposited onto at least one receiving surface by exposing the at least one receiving surface, being at least one of the top surfaces of the first and second electrically conductive elements, to an electrolytic bath at a current density greater than the mass transport limiting current density of the electrolytic bath. juxtaposing a top surface of a first electrically conductive element (934; 1334; 1534; 1634) at a first surface (922; 1322; 1522; 1622) of a first substrate (920; 1320; 1520; 1620) with a top surface of a second electrically conductive element a (932; 1332; 1530; 1630) at a major surface (912; 1312; 1512; 1612) of a second substrate (910; 1310; 1510; 1610), the first surface of the first substrate and the major surface of the second substrate each comprising a dielectric material, wherein either the top surface of the first electrically conductive element is recessed below the first surface of the first substrate, or the top surface of the second electrically conductive element is recessed below the major surface of the second substrate, and electrically conductive nanoparticles (950; 1350; 1550) are disposed between the top surfaces of the first and second electrically conductive elements, the electrically conductive nanoparticles having long dimensions smaller than 100 nanometers; directly bonding the dielectric material of the first surface with the dielectric material of the major surface; and elevating a temperature at least at interfaces of the juxtaposed first and second electrically conductive elements to a joining temperature at which the electrically conductive nanoparticles cause metallurgical joints to form between the juxtaposed first and second electrically conductive elements, being characterized in that the electrically conductive nanoparticles are deposited onto at least one receiving surface by exposing the at least one receiving surface, being at least one of the top surfaces of the first and second electrically conductive elements, to an electrolytic bath at a current density greater than the mass transport limiting current density of the electrolytic bath. <EOS>