mhurhangee/patent-ind-claim-en huggingface dataset:
MEMS, comprising: a substrate and an element movably suspended relative to the substrate, the element comprising a first main surface and an opposite second main surface ; a first spring element (22 1 ) connected between the substrate and a first column structure (24 1 ) connected to the second main surface , and a second spring element (22 2 ) connected between the substrate and a second column structure (24 2 )connected to the second main surface ; characterized in that the first spring element (22 1 ) and/or the second spring element (22 2 ) comprises, along an axial path of the spring element, a hinge that provides stiffness reduction of the spring element (22 1 , 22 2 ) along a direction parallel to a surface normal of the second main surface . a substrate and an element movably suspended relative to the substrate, the element comprising a first main surface and an opposite second main surface ; a first spring element (22 1 ) connected between the substrate and a first column structure (24 1 ) connected to the second main surface , and a second spring element (22 2 ) connected between the substrate and a second column structure (24 2 )connected to the second main surface ; characterized in that the first spring element (22 1 ) and/or the second spring element (22 2 ) comprises, along an axial path of the spring element, a hinge that provides stiffness reduction of the spring element (22 1 , 22 2 ) along a direction parallel to a surface normal of the second main surface .
Key duplicating machine , preferably of the professional or semi-professional type, comprising: - a support structure , - a front operational area which is accessible by the operator and which is removably covered and separated, at least partially, from the external environment by means of a covering and/or protection crankcase which is movable with respect to said structure of support , in said front operational area being housed at least one cutter , and/or another cutting element, and at least one terminal for locking a key, - a rear containment area which is covered and separated from the external environment by a casing mechanically fixed to said support structure , - a control and command unit of the various components of said machine , said machine further comprising a mechanism for moving said crankcase for covering and/or protecting the front operational area , said crankcase being configured to be mounted on a fixed structure of said duplicating machine so as to be able to be moved with respect to said fixed structure , said mechanism comprising at least one rotating body which is operated in rotation by a motorization unit and which is configured to come into contact and act directly on a portion of said crankcase , or on an integral element to said portion , to thus cause the movement of said crankcase with respect to said fixed structure , said motorization unit and said at least one rotating body being positioned within the overall dimensions of said crankcase to be moved. - a support structure , - a front operational area which is accessible by the operator and which is removably covered and separated, at least partially, from the external environment by means of a covering and/or protection crankcase which is movable with respect to said structure of support , in said front operational area being housed at least one cutter , and/or another cutting element, and at least one terminal for locking a key, - a rear containment area which is covered and separated from the external environment by a casing mechanically fixed to said support structure , - a control and command unit of the various components of said machine ,
A method comprising: turning a handle of an assembly to an OFF position and locked position, the assembly including a handle assembly and a base assembly , where the handle assembly is rotatable relative to the base assembly; moving a cover from a first position to a second position, the cover concealing a locking fixation feature when the cover is in the first position and the cover revealing the locking fixation feature when the cover is in the second position; disposing one or more portions of the cover within at least a portion of the base assembly in the second position and preventing rotation of the handle assembly relative to the base assembly with the one or more portions; disposing a locking structure through at least a portion of the locking fixation feature; locking the handle of the handle assembly in a particular orientation; and moving operable barriers of the base assembly, and moving the cover within the base assembly to lock the handle assembly in multiple handle orientations. turning a handle of an assembly to an OFF position and locked position, the assembly including a handle assembly and a base assembly , where the handle assembly is rotatable relative to the base assembly; moving a cover from a first position to a second position, the cover concealing a locking fixation feature when the cover is in the first position and the cover revealing the locking fixation feature when the cover is in the second position; disposing one or more portions of the cover within at least a portion of the base assembly in the second position and preventing rotation of the handle assembly relative to the base assembly with the one or more portions; disposing a locking structure through at least a portion of the locking fixation feature; locking the handle of the handle assembly in a particular orientation; and moving operable barriers of the base assembly, and moving the cover within the base assembly to lock the handle assembly in multiple handle orientations.
An apparatus comprising: a plurality of beamformer chips , each comprising at least one radiating element and further comprising a control bus interface and a reserve input configured to be remapped into the control bus interface in the event that a signal within the control bus interface fails; a subarray controller configured to control the plurality of beamformer chips ; and a plurality of primary and secondary control buses configured to provide instructions from the subarray controller to the plurality of beamformer chips , and each of the plurality of primary and secondary control buses comprising: a plurality of primary control paths providing communication from the control bus to the control bus interface, and a reserve control path configured to be remapped to provide communication from the control bus to the control bus interface in the event that one of the plurality of primary control paths fails, wherein the primary control buses and the secondary control buses are arranged orthogonally relative to one another such that each of the plurality of beamformer chips is configured to be controlled by either the primary control bus or the secondary control bus . a plurality of beamformer chips , each comprising at least one radiating element and further comprising a control bus interface and a reserve input configured to be remapped into the control bus interface in the event that a signal within the control bus interface fails; a subarray controller configured to control the plurality of beamformer chips ; and a plurality of primary and secondary control buses configured to provide instructions from the subarray controller to the plurality of beamformer chips , and each of the plurality of primary and secondary control buses comprising: a plurality of primary control paths providing communication from the control bus to the control bus interface, and a reserve control path configured to be remapped to provide communication from the control bus to the control bus interface in the event that one of the plurality of primary control paths fails, wherein the primary control buses and the secondary control buses are arranged orthogonally relative to one another such that each of the plurality of beamformer chips is configured to be controlled by either the primary control bus or the secondary control bus .
A moving robot system comprising: a first boundary wire and a second boundary wire respectively defining a first travel area (A1) and a second travel area (A2); and a moving robot which comprises a body defining an exterior, a travelling unit configured to move the body , a boundary signal detector configured to detect a proximity boundary signal generated in a proximity boundary area in which a portion of the first travel area (A1) and a portion of the second travel area (A2) are proximal to each other, and a controller configured to define a proximity boundary line based on the proximity boundary signal and control the travelling unit such that the body performs a homing travel which indicates travelling along the proximity boundary line , characterized in that the controller is configured to: define a first homing boundary line and a second homing boundary line which are parallel to the proximity boundary line positioned therebetween; and control the travelling unit such that, during the homing travel, the body converts a direction of travel on the first and second homing boundary lines and travels in a direction of travel which crosses the proximity boundary line . a first boundary wire and a second boundary wire respectively defining a first travel area (A1) and a second travel area (A2); and a moving robot which comprises a body defining an exterior, a travelling unit configured to move the body , a boundary signal detector configured to detect a proximity boundary signal generated in a proximity boundary area in which a portion of the first travel area (A1) and a portion of the second travel area (A2) are proximal to each other, and a controller configured to define a proximity boundary line based on the proximity boundary signal and control the travelling unit such that the body performs a homing travel which indicates travelling along the proximity boundary line , characterized in that the controller is configured to: define a first homing boundary line and a second homing boundary line which are parallel to the proximity boundary line positioned therebetween; and control the travelling unit such that, during the homing travel, the body converts a direction of travel on the first and second homing boundary lines and travels in a direction of travel which crosses the proximity boundary line . define a first homing boundary line and a second homing boundary line which are parallel to the proximity boundary line positioned therebetween; and control the travelling unit such that, during the homing travel, the body converts a direction of travel on the first and second homing boundary lines and travels in a direction of travel which crosses the proximity boundary line .
A semiconductor light emitting device comprising: a first semiconductor layer , the first semiconductor layer being doped a first conductive type and including dislocations therein; a pit enlarging layer on the first semiconductor layer; an active layer on the pit enlarging layer wherein the active layer has a multiple quantum well (MQW) structure including a plurality of barrier layers and a plurality of quantum well layers that are alternately stacked on each other; an upper surface of the pit enlarging layer and side surfaces of the active layer defining pits having sloped surfaces on the dislocations , the pits being reverse pyramidal spaces; a hole injection layer on a top surface of the active layer and the sloped surfaces of the pits; and a second semiconductor layer on the hole injection layer, the second semiconductor layer being doped a second conductive type that is different than the first conductive type; characterized in that the hole injection layer contacts all of the plurality of quantum well layers of the active layer along the sloped surfaces of the pits . a first semiconductor layer , the first semiconductor layer being doped a first conductive type and including dislocations therein; a pit enlarging layer on the first semiconductor layer; an active layer on the pit enlarging layer wherein the active layer has a multiple quantum well (MQW) structure including a plurality of barrier layers and a plurality of quantum well layers that are alternately stacked on each other; an upper surface of the pit enlarging layer and side surfaces of the active layer defining pits having sloped surfaces on the dislocations , the pits being reverse pyramidal spaces; a hole injection layer on a top surface of the active layer and the sloped surfaces of the pits; and a second semiconductor layer on the hole injection layer, the second semiconductor layer being doped a second conductive type that is different than the first conductive type; characterized in that the hole injection layer contacts all of the plurality of quantum well layers of the active layer along the sloped surfaces of the pits .
A device comprising: a semiconductor substrate ; a doped isolation barrier disposed in the semiconductor substrate and defining a core device area within the doped isolation barrier; an isolation contact region disposed in the semiconductor substrate outside of the core device area and to which a voltage is applied during operation; a depleted well region disposed in the semiconductor substrate outside of the core device area, wherein the depleted well region has a lower interior dopant concentration level for depletion of the depleted well region between the doped isolation barrier and the isolation contact region, wherein the depleted well region electrically couples the isolation contact region and the doped isolation barrier such that the doped isolation barrier is biased during operation at a voltage level lower than the voltage applied to the isolation contact region; and a conductive flap supported by the semiconductor substrate and positioned over the depleted well region, wherein the conductive flap is biased during operation to deplete the depleted well region. a semiconductor substrate ; a doped isolation barrier disposed in the semiconductor substrate and defining a core device area within the doped isolation barrier; an isolation contact region disposed in the semiconductor substrate outside of the core device area and to which a voltage is applied during operation; a depleted well region disposed in the semiconductor substrate outside of the core device area, wherein the depleted well region has a lower interior dopant concentration level for depletion of the depleted well region between the doped isolation barrier and the isolation contact region, wherein the depleted well region electrically couples the isolation contact region and the doped isolation barrier such that the doped isolation barrier is biased during operation at a voltage level lower than the voltage applied to the isolation contact region; and a conductive flap supported by the semiconductor substrate and positioned over the depleted well region, wherein the conductive flap is biased during operation to deplete the depleted well region.
An electronic device comprising: a substrate having opposing top and bottom surfaces ; a ground layer disposed in the substrate between the top surface and the bottom surface ; an electrically conductive chassis having a mounting surface having a plurality of raised dimples to receive the bottom surface of the substrate and in electrical contact with the ground layer by ground stitch vias ; contact pads to which the ground stitch vias are connected that are mounted on the bottom surface of the substrate and that are arranged along a perimeter of the surface ; and an electromagnetic shield defined by the ground layer , the ground stitch vias and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference; and a non-conductive cover having an interior surface with a plurality of posts arranged along a perimeter, wherein the cover is assembled to the substrate in tension so that the plurality of posts applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact between each of the contact pads and the dimples with the ground layer . a substrate having opposing top and bottom surfaces ; a ground layer disposed in the substrate between the top surface and the bottom surface ; an electrically conductive chassis having a mounting surface having a plurality of raised dimples to receive the bottom surface of the substrate and in electrical contact with the ground layer by ground stitch vias ; contact pads to which the ground stitch vias are connected that are mounted on the bottom surface of the substrate and that are arranged along a perimeter of the surface ; and an electromagnetic shield defined by the ground layer , the ground stitch vias and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference; and a non-conductive cover having an interior surface with a plurality of posts arranged along a perimeter, wherein the cover is assembled to the substrate in tension so that the plurality of posts applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact between each of the contact pads and the dimples with the ground layer .
Monument for a cabin of a vehicle, in particular of an aircraft or spacecraft , comprising: an outer housing side ; and a fastening rail for fastening connection elements in a longitudinal direction of the fastening rail in order to fix the monument in position inside the cabin ; wherein the fastening rail has a receiving space extending in the longitudinal direction of the fastening rail , which space is designed to receive and fasten mounting feet of the connection elements to the fastening rail ; characterized in that the fastening rail is integrated in the outer housing side , wherein the fastening rail is designed as a notch in a wall of the outer housing side . an outer housing side ; and a fastening rail for fastening connection elements in a longitudinal direction of the fastening rail in order to fix the monument in position inside the cabin ; wherein the fastening rail has a receiving space extending in the longitudinal direction of the fastening rail , which space is designed to receive and fasten mounting feet of the connection elements to the fastening rail ; characterized in that the fastening rail is integrated in the outer housing side , wherein the fastening rail is designed as a notch in a wall of the outer housing side .
Discharge water temperature control valve for hot water storage installations in which the temperature control valve is suitable for being installed along a high temperature discharge pipe downstream of a relief valve, comprising a valve body having a first inlet suitable for being connected to a cold water supply pipe, a second inlet suitable for being connected to the discharge pipe downstream of the relief valve, and an outlet for discharging water from the valve, wherein in the valve body a non-return valve device is housed at the first inlet that in the closed position prevents the cold water entering, and a thermosensitive actuating device is further housed in the valve body , characterised in that the actuating device is arranged along a path of the high temperature discharge water inside the valve body between the second inlet and the outlet , wherein the actuating device expands and reduces according to the temperature and is connected to the non-return valve device to place the non-return valve device in the open position when the temperature of the discharge water exceeds a set value, wherein the non-return valve device has a shutter that is maintained in the closed position elastically and through the effect of the pressure of the cold water, and the actuating device acts on the shutter , pushing the shutter open when the high temperature of the discharge water exceeds the set value.
An aramid yarn having excellent adhesive properties with a polyurethane matrix resin characterized in that a sizing agent composition is adhered and impregnated to the surface and inside of the aramid yarn, wherein the sizing agent composition is composed of 35 to 45 % by weight of a polyurethane resin, 2 to 5 % by weight of an organic solvent, and 55 to 63 % by weight of water, wherein the polyurethane resin is a reaction product of polytetramethylene ether glycol and isophorone diisocyanate, and wherein the content of the polyurethane resin, as measured by the method in the description, is 1.5 to 7.0 % by weight based on the sum of the weight of the polyurethane resin adhered and impregnated to the surface and inside of the aramid yarn plus the weight of the aramid yarn before the polyurethane resin is adhered and impregnated. a sizing agent composition is adhered and impregnated to the surface and inside of the aramid yarn, wherein the sizing agent composition is composed of 35 to 45 % by weight of a polyurethane resin, 2 to 5 % by weight of an organic solvent, and 55 to 63 % by weight of water, wherein the polyurethane resin is a reaction product of polytetramethylene ether glycol and isophorone diisocyanate, and wherein the content of the polyurethane resin, as measured by the method in the description, is 1.5 to 7.0 % by weight based on the sum of the weight of the polyurethane resin adhered and impregnated to the surface and inside of the aramid yarn plus the weight of the aramid yarn before the polyurethane resin is adhered and impregnated.
A method for use in a base station in a Third Generation Partnership Project, 3GPP, Fifth Generation, 5G, wireless communication system, the method comprising: transmitting a first symbol for a primary synchronization channel, PSC, to a mobile station in a slot of a subframe; and transmitting a second symbol for a secondary synchronization channel, SSC, to the mobile station in the slot of the subframe, wherein the first symbol and the second symbol are separated by one symbol in the slot, the second symbol being transmitted after the first symbol. transmitting a first symbol for a primary synchronization channel, PSC, to a mobile station in a slot of a subframe; and transmitting a second symbol for a secondary synchronization channel, SSC, to the mobile station in the slot of the subframe, wherein the first symbol and the second symbol are separated by one symbol in the slot, the second symbol being transmitted after the first symbol.
A method for chromosomal counting with reduced or eliminated effects of GC bias in sequence information, the method comprising: sequencing a sample to obtain nucleic acid sequence information; correcting the sequence information to account for GC bias by selecting a subset of bins within a given range of GC content values such that average GC content per chromosome is equalized; and analyzing the corrected sequence information by performing chromosomal counting using counts of the selected subset of bins. sequencing a sample to obtain nucleic acid sequence information; correcting the sequence information to account for GC bias by selecting a subset of bins within a given range of GC content values such that average GC content per chromosome is equalized; and analyzing the corrected sequence information by performing chromosomal counting using counts of the selected subset of bins.
High-pressure cleaning apparatus, comprising a motor and a pump drivable by the motor , the pump having a pump inlet and a pump outlet , and comprising a housing at least partially surrounding the motor and the pump , and a pressure hose connectable to the pump outlet , and a retaining strap arranged on an outer side of the housing, characterized in that the retaining strap is variable in length and in that the pressure hose when in the wound-up state is clampable between the retaining strap and the housing .