An integrated circuit chip package test system comprising: a socket having a recess configured to receive a chip package assembly for testing; and a workpress positioned over the socket , the workpress having a plurality of non-conductive pusher pins that are electrically discontinuous tip to tip, each non-conductive pusher pin of the plurality of non-conductive pusher pins extending from a bottom surface of the workpress , the plurality of non-conductive pusher pins being dynamically conformable to a multi- planar top surface topography of the chip package assembly , the plurality of non-conductive pusher pins of the workpress being arranged to contact the chip package assembly disposed in the recess , the plurality of non-conductive pusher pins comprising: a first pusher pin having a first spring constant and a first length, the first pusher pin configured to generate a first force when the plurality of non-conductive pusher pins contacts the chip package assembly disposed in the recess ; and a second pusher pin having a second spring constant and a second length, the second pusher pin configured to generate a second force when the plurality of non-conductive pusher pins contacts the chip package assembly disposed in the recess , wherein at least one of the first spring constant and the first length is different than the second spring constant and the second length and the first force is different than the second force. a socket having a recess configured to receive a chip package assembly for testing; and a workpress positioned over the socket , the workpress having a plurality of non-conductive pusher pins that are electrically discontinuous tip to tip, each non-conductive pusher pin of the plurality of non-conductive pusher pins extending from a bottom surface of the workpress , the plurality of non-conductive pusher pins being dynamically conformable to a multi- planar top surface topography of the chip package assembly , the plurality of non-conductive pusher pins of the workpress being arranged to contact the chip package assembly disposed in the recess , the plurality of non-conductive pusher pins comprising: a first pusher pin having a first spring constant and a first length, the first pusher pin configured to generate a first force when the plurality of non-conductive pusher pins contacts the chip package assembly disposed in the recess ; and a second pusher pin having a second spring constant and a second length, the second pusher pin configured to generate a second force when the plurality of non-conductive pusher pins contacts the chip package assembly disposed in the recess , wherein at least one of the first spring constant and the first length is different than the second spring constant and the second length and the first force is different than the second force. a first pusher pin having a first spring constant and a first length, the first pusher pin configured to generate a first force when the plurality of non-conductive pusher pins contacts the chip package assembly disposed in the recess ; and a second pusher pin having a second spring constant and a second length, the second pusher pin configured to generate a second force when the plurality of non-conductive pusher pins contacts the chip package assembly disposed in the recess , wherein at least one of the first spring constant and the first length is different than the second spring constant and the second length and the first force is different than the second force. <EOS>