A composition for a sintering film, comprising: a thermosetting resin or thermoplastic resin component in an amount of from 0.1 up to 10 percent by weight of the total solids content of the composition, wherein the thermosetting resin or thermoplastic resin component consists of: i) epoxy resins consisting of one or more epoxy monomers, oligomers, or polymers, and the one or more epoxy monomers, oligomers or polymers comprises an aliphatic backbone, an aromatic backbone, or a mixture thereof; and, optionally ii) one or more of: an acrylic monomer, oligomer, or polymer; a phenolic, a novalac; a polyurethane; a cyanate ester; a polyvinyl alcohol; a polyester; a polyurea; a polyvinyl acetal resin; a phenoxy resin; a maleimide; a bismaleimide; and, a polyimide; wherein said epoxy resins comprise a toughened epoxy resin selected from the group consisting of epoxidized carboxyl-terminated butadiene-acrylonitrile (CTBN) oligomers or polymers, epoxidized polybutadiene diglycidylether oligomers or polymers and heterocyclic epoxy resins; one or more conductive fillers in an amount of at least 65 percent by weight of the total solids content of the composition; and optionally an organic diluent, wherein the composition undergoes lamination onto a wafer at a temperature of 100 °C or lower and a pressure of 0.275 MPa (40 psi) or lower; and wherein the composition, when cured or sintered, has a die shear strength of at least 1.0 kg/mm 2 at 260 °C. a thermosetting resin or thermoplastic resin component in an amount of from 0.1 up to 10 percent by weight of the total solids content of the composition, wherein the thermosetting resin or thermoplastic resin component consists of: i) epoxy resins consisting of one or more epoxy monomers, oligomers, or polymers, and the one or more epoxy monomers, oligomers or polymers comprises an aliphatic backbone, an aromatic backbone, or a mixture thereof; and, optionally ii) one or more of: an acrylic monomer, oligomer, or polymer; a phenolic, a novalac; a polyurethane; a cyanate ester; a polyvinyl alcohol; a polyester; a polyurea; a polyvinyl acetal resin; a phenoxy resin; a maleimide; a bismaleimide; and, a polyimide; wherein said epoxy resins comprise a toughened epoxy resin selected from the group consisting of epoxidized carboxyl-terminated butadiene-acrylonitrile (CTBN) oligomers or polymers, epoxidized polybutadiene diglycidylether oligomers or polymers and heterocyclic epoxy resins; i) epoxy resins consisting of one or more epoxy monomers, oligomers, or polymers, and the one or more epoxy monomers, oligomers or polymers comprises an aliphatic backbone, an aromatic backbone, or a mixture thereof; and, optionally ii) one or more of: an acrylic monomer, oligomer, or polymer; a phenolic, a novalac; a polyurethane; a cyanate ester; a polyvinyl alcohol; a polyester; a polyurea; a polyvinyl acetal resin; a phenoxy resin; a maleimide; a bismaleimide; and, a polyimide; wherein said epoxy resins comprise a toughened epoxy resin selected from the group consisting of epoxidized carboxyl-terminated butadiene-acrylonitrile (CTBN) oligomers or polymers, epoxidized polybutadiene diglycidylether oligomers or polymers and heterocyclic epoxy resins; one or more conductive fillers in an amount of at least 65 percent by weight of the total solids content of the composition; and optionally an organic diluent, wherein the composition undergoes lamination onto a wafer at a temperature of 100 °C or lower and a pressure of 0.275 MPa (40 psi) or lower; and wherein the composition, when cured or sintered, has a die shear strength of at least 1.0 kg/mm 2 at 260 °C. <EOS>