An imaging module , comprising: a housing comprising a light inlet ; a reflective element , a mounting base , and an image sensor arranged in the housing ; the reflective element being configured to redirect incident light from the light inlet to the image sensor , and the image sensor sensing the incident light outside the imaging module ; the reflective element arranged on the mounting base ; the mounting base being arranged with a limiting structure connected to the reflective element and configured to limit a position of the reflective element on the mounting base ; a drive mechanism , a moving element , and a first lens assembly , all disposed in the housing , wherein the moving element is disposed between the reflective element and the first image sensor , wherein the first lens assembly is fixed to the moving element , the drive mechanism is connected to the moving element and configured to drive the moving element to move along an optical axis of the first lens assembly between the reflective element and the image sensor ; and the imaging module being characterized by further comprising: a chip circuit board and a drive chip , wherein the chip circuit board is fixed on a side surface of the drive mechanism , the drive chip is fixed on a side of the chip circuit board opposite to the drive mechanism , the drive chip is electrically connected to the drive mechanism through the chip circuit board ; the housing defines an escape hole , the drive chip is at least partially received in the escape hole . a housing comprising a light inlet ; a reflective element , a mounting base , and an image sensor arranged in the housing ; the reflective element being configured to redirect incident light from the light inlet to the image sensor , and the image sensor sensing the incident light outside the imaging module ; the reflective element arranged on the mounting base ; the mounting base being arranged with a limiting structure connected to the reflective element and configured to limit a position of the reflective element on the mounting base ; a drive mechanism , a moving element , and a first lens assembly , all disposed in the housing , wherein the moving element is disposed between the reflective element and the first image sensor , wherein the first lens assembly is fixed to the moving element , the drive mechanism is connected to the moving element and configured to drive the moving element to move along an optical axis of the first lens assembly between the reflective element and the image sensor ; and the imaging module being characterized by further comprising: a chip circuit board and a drive chip , wherein the chip circuit board is fixed on a side surface of the drive mechanism , the drive chip is fixed on a side of the chip circuit board opposite to the drive mechanism , the drive chip is electrically connected to the drive mechanism through the chip circuit board ; the housing defines an escape hole , the drive chip is at least partially received in the escape hole . a chip circuit board and a drive chip , wherein the chip circuit board is fixed on a side surface of the drive mechanism , the drive chip is fixed on a side of the chip circuit board opposite to the drive mechanism , the drive chip is electrically connected to the drive mechanism through the chip circuit board ; the housing defines an escape hole , the drive chip is at least partially received in the escape hole . <EOS>