A process for mounting a light emitting diode (LED) on a wiring board, the process comprising the steps of: a) providing a submount configured for coupling to a wiring board and configured for having coupled thereto a light emitting diode; b) forming a contact on at least a portion of a metal surface of the submount, the contact being formed by the steps of: i) preparing at least the portion of the metal surface of the submount to accept electroless nickel plating thereon; ii) depositing a nickel layer on at least the portion of the metal surface of the submount by an electroless nickel deposition process; and thereafter iii) depositing a silver layer on the electroless nickel layer using an electroless immersion silver plating solution, wherein the immersion silver plating solution comprises: a soluble source of silver ions; an acid; and an oxidant, wherein the oxidant comprises one or more nitro aromatic compounds; wherein the silver layer has a thickness of 0.025 to 2.5 micrometres (1 to 100 microinches); and wherein a reflective nickel-silver contact is formed on at least the portion of the metal surface of the submount that provides a solderable surface for mounting of the light emitting diode thereon; c) coupling a light emitting diode to the nickel-silver layers; and d) coupling the submount to a wiring board by soldering the submount to package leads formed on the wiring board. a) providing a submount configured for coupling to a wiring board and configured for having coupled thereto a light emitting diode; b) forming a contact on at least a portion of a metal surface of the submount, the contact being formed by the steps of: i) preparing at least the portion of the metal surface of the submount to accept electroless nickel plating thereon; ii) depositing a nickel layer on at least the portion of the metal surface of the submount by an electroless nickel deposition process; and thereafter iii) depositing a silver layer on the electroless nickel layer using an electroless immersion silver plating solution, wherein the immersion silver plating solution comprises: a soluble source of silver ions; an acid; and an oxidant, wherein the oxidant comprises one or more nitro aromatic compounds; wherein the silver layer has a thickness of 0.025 to 2.5 micrometres (1 to 100 microinches); and wherein a reflective nickel-silver contact is formed on at least the portion of the metal surface of the submount that provides a solderable surface for mounting of the light emitting diode thereon; i) preparing at least the portion of the metal surface of the submount to accept electroless nickel plating thereon; ii) depositing a nickel layer on at least the portion of the metal surface of the submount by an electroless nickel deposition process; and thereafter iii) depositing a silver layer on the electroless nickel layer using an electroless immersion silver plating solution, wherein the immersion silver plating solution comprises: a soluble source of silver ions; an acid; and an oxidant, wherein the oxidant comprises one or more nitro aromatic compounds; a soluble source of silver ions; an acid; and an oxidant, wherein the oxidant comprises one or more nitro aromatic compounds; c) coupling a light emitting diode to the nickel-silver layers; and d) coupling the submount to a wiring board by soldering the submount to package leads formed on the wiring board. <EOS>