A dual IC card comprising: an IC module including a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna including a coupling coil for electromagnetically coupling with the connecting coil of the IC module, and a main coil connected to the coupling coil to perform contactless communication with an external contactless machine; and a plate-like card body in which a recess is formed for accommodation of the IC module, wherein: the card body has a substrate ; and the coupling coil includes a first coil segment provided to a first surface that serves as an opening side of the recess of the substrate, and a second coil segment provided to a second surface of the substrate, wherein the antenna further comprises a capacitive element , the capacitive element has an electrode plate provided on the first surface of the substrate, and an electrode plate provided on the second surface of the substrate, the electrode plate provided on the second surface of the substrate is connected to a connecting wiring provided on the second surface, the connecting wiring is connected to a second end of the element wire of the second coil segment , characterized in that the electrode plate provided on the first surface of the substrate is connected to an end of the element wire located innermost of the main coil. an IC module including a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna including a coupling coil for electromagnetically coupling with the connecting coil of the IC module, and a main coil connected to the coupling coil to perform contactless communication with an external contactless machine; and a plate-like card body in which a recess is formed for accommodation of the IC module, wherein: the card body has a substrate ; and the coupling coil includes a first coil segment provided to a first surface that serves as an opening side of the recess of the substrate, and a second coil segment provided to a second surface of the substrate, wherein the antenna further comprises a capacitive element , the capacitive element has an electrode plate provided on the first surface of the substrate, and an electrode plate provided on the second surface of the substrate, the electrode plate provided on the second surface of the substrate is connected to a connecting wiring provided on the second surface, the connecting wiring is connected to a second end of the element wire of the second coil segment , characterized in that the electrode plate provided on the first surface of the substrate is connected to an end of the element wire located innermost of the main coil. the card body has a substrate ; and the coupling coil includes a first coil segment provided to a first surface that serves as an opening side of the recess of the substrate, and a second coil segment provided to a second surface of the substrate, wherein the antenna further comprises a capacitive element , the capacitive element has an electrode plate provided on the first surface of the substrate, and an electrode plate provided on the second surface of the substrate, the electrode plate provided on the second surface of the substrate is connected to a connecting wiring provided on the second surface, the connecting wiring is connected to a second end of the element wire of the second coil segment , characterized in that the electrode plate provided on the first surface of the substrate is connected to an end of the element wire located innermost of the main coil. <EOS>