An electronic device comprising: a printed circuit board ; a substrate , wherein the substrate is over the printed circuit board ; at least two heat sources over the substrate ; and a segmented heatsink secured to the printed circuit board , wherein the segmented heatsink comprises: a plurality of securing means , the segmented heatsink being secured to the printed circuit board using the plurality of securing means ; loading arms (122; 134) extending from the securing means; and at least two independent heatsink segments supported by at least two of the loading arms (122; 134), wherein each heatsink segment corresponds to at least one heat source from the at least two heat sources and is configured to draw heat from the corresponding at least one heat source , wherein the at least two heat sources are at a different height relative to each other" a number of the plurality of securing means is equal to or less than twice the amount of the at least two heat sources on the substrate , a height of the plurality of securing means is less than a height of each of the at least two heat sources , and the at least two heatsink segments are at a different height. a printed circuit board ; a substrate , wherein the substrate is over the printed circuit board ; at least two heat sources over the substrate ; and a segmented heatsink secured to the printed circuit board , wherein the segmented heatsink comprises: a plurality of securing means , the segmented heatsink being secured to the printed circuit board using the plurality of securing means ; loading arms (122; 134) extending from the securing means; and at least two independent heatsink segments supported by at least two of the loading arms (122; 134), wherein each heatsink segment corresponds to at least one heat source from the at least two heat sources and is configured to draw heat from the corresponding at least one heat source , wherein the at least two heat sources are at a different height relative to each other" a number of the plurality of securing means is equal to or less than twice the amount of the at least two heat sources on the substrate , a height of the plurality of securing means is less than a height of each of the at least two heat sources , and the at least two heatsink segments are at a different height. a plurality of securing means , the segmented heatsink being secured to the printed circuit board using the plurality of securing means ; loading arms (122; 134) extending from the securing means; and at least two independent heatsink segments supported by at least two of the loading arms (122; 134), wherein each heatsink segment corresponds to at least one heat source from the at least two heat sources and is configured to draw heat from the corresponding at least one heat source , wherein the at least two heat sources are at a different height relative to each other" a number of the plurality of securing means is equal to or less than twice the amount of the at least two heat sources on the substrate , a height of the plurality of securing means is less than a height of each of the at least two heat sources , and the at least two heatsink segments are at a different height. <EOS>