An antenna module comprising: a multilayer board; a wiring pattern that includes a plurality of antenna elements arranged on an outer face of a second laminate part included in the multilayer board and that includes microstrip lines electrically coupled to the corresponding antenna elements , wherein the antenna module is configured to adjust one or more beam directions of the plurality of antenna elements by controlling a phase of each of radio frequency signals transmitted from the plurality of antenna elements; a radio frequency, RF, chip that is arranged on an outer face of a first laminate part included in the multilayer board and is configured to output the radio frequency signals, the first laminate part comprising a plurality of laminate plates laminated together; a matching circuit that is arranged on the outer face of the first laminate part and is configured to adjust matching between impedance of the plurality of antenna elements and impedance of the RF chip ; a through hole that couples the first laminate part and the second laminate part and is connected to the matching circuit ; and a plurality of non-penetrating vias that are on an outer side in a diameter direction of the through hole and each of the plurality of non-penetrating vias penetrates all of the plurality of first laminate plates and do not couple the second laminate part , wherein the plurality of non-penetrating vias are arranged with respect to the through hole so as to surround the through hole ; wherein the microstrip lines are coupled to the outer face of the first laminate part through the through hole . a multilayer board; a wiring pattern that includes a plurality of antenna elements arranged on an outer face of a second laminate part included in the multilayer board and that includes microstrip lines electrically coupled to the corresponding antenna elements , wherein the antenna module is configured to adjust one or more beam directions of the plurality of antenna elements by controlling a phase of each of radio frequency signals transmitted from the plurality of antenna elements; a radio frequency, RF, chip that is arranged on an outer face of a first laminate part included in the multilayer board and is configured to output the radio frequency signals, the first laminate part comprising a plurality of laminate plates laminated together; a matching circuit that is arranged on the outer face of the first laminate part and is configured to adjust matching between impedance of the plurality of antenna elements and impedance of the RF chip ; a through hole that couples the first laminate part and the second laminate part and is connected to the matching circuit ; and a plurality of non-penetrating vias that are on an outer side in a diameter direction of the through hole and each of the plurality of non-penetrating vias penetrates all of the plurality of first laminate plates and do not couple the second laminate part , wherein the plurality of non-penetrating vias are arranged with respect to the through hole so as to surround the through hole ; wherein the microstrip lines are coupled to the outer face of the first laminate part through the through hole . <EOS>