An electronic device , comprising at least the following: a mainboard ; electronic components , disposed on the mainboard ; and a shielding assembly , comprising a shielding case , a capillary structure , and a thermally conductive plate , wherein the electronic components are located in the shielding case and connected to the shielding case , the mainboard is connected to the shielding case to form a shielding space for shielding the electronic components , the thermally conductive plate is located on a side of the shielding case that faces away from the electronic components , the thermally conductive plate is connected to the shielding case to form a sealing cavity , the capillary structure is disposed in the sealing cavity , the sealing cavity is filled with a working substance, the sealing cavity comprises a vaporization zone and a condensation zone , the vaporization zone is located above the electronic components , and the capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone , wherein the electronic device further comprises a housing , the thermally conductive plate is connected to the housing , the electronic device further comprises a first thermally conductive member and a second thermally conductive member , the first thermally conductive member is disposed between the electronic components and the shielding case , and the second thermally conductive member is disposed between the thermally conductive plate and the housing , wherein both the first thermally conductive member and the second thermally conductive member are elastic. a mainboard ; electronic components , disposed on the mainboard ; and a shielding assembly , comprising a shielding case , a capillary structure , and a thermally conductive plate , wherein the electronic components are located in the shielding case and connected to the shielding case , the mainboard is connected to the shielding case to form a shielding space for shielding the electronic components , the thermally conductive plate is located on a side of the shielding case that faces away from the electronic components , the thermally conductive plate is connected to the shielding case to form a sealing cavity , the capillary structure is disposed in the sealing cavity , the sealing cavity is filled with a working substance, the sealing cavity comprises a vaporization zone and a condensation zone , the vaporization zone is located above the electronic components , and the capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone , wherein the electronic device further comprises a housing , the thermally conductive plate is connected to the housing , the electronic device further comprises a first thermally conductive member and a second thermally conductive member , the first thermally conductive member is disposed between the electronic components and the shielding case , and the second thermally conductive member is disposed between the thermally conductive plate and the housing , wherein both the first thermally conductive member and the second thermally conductive member are elastic. <EOS>