A method of forming an LED package , comprising: - forming an array of integrated circuit LEDs as part of a first semiconductor substrate , the first semiconductor substrate having a first face and an opposite second face, the LEDs being provided at the second face of the first semiconductor substrate , and having LED connection terminals on the first face of the first semiconductor substrate ; - forming an array of switching transistors as part of a second semiconductor substrate , the second semiconductor substrate having a first face and a second opposite face, the second semiconductor substrate comprising LED contact pads on its first face for connection to the LED terminals , the contact pads are connected to the transistor source and drain; package terminals on its second face, which package terminals comprise power line terminals and control terminals , wherein a control terminal is connected to a gate of a switching transistor ; and through vias extending between the first face and second face of the second semiconductor substrate , a through-via providing connection between a power line terminal and an LED contact pad ; - performing wafer bonding to bond the first face of the first semiconductor substrate and the first face of the second semiconductor substrates together, with each LED of the first semiconductor substrate positioned over a corresponding switching transistor of the second semiconductor substrate, thereby making electrical connection between the LED and corresponding switching transistor; - dicing the bonded first and second semiconductor substrates to form individual LED packages or groups of LED packages, wherein each LED package has three package terminals , on only one face, the three package terminals comprising two power line terminals and one control terminal . - forming an array of integrated circuit LEDs as part of a first semiconductor substrate , the first semiconductor substrate having a first face and an opposite second face, the LEDs being provided at the second face of the first semiconductor substrate , and having LED connection terminals on the first face of the first semiconductor substrate ; - forming an array of switching transistors as part of a second semiconductor substrate , the second semiconductor substrate having a first face and a second opposite face, the second semiconductor substrate comprising LED contact pads on its first face for connection to the LED terminals , the contact pads are connected to the transistor source and drain; - performing wafer bonding to bond the first face of the first semiconductor substrate and the first face of the second semiconductor substrates together, with each LED of the first semiconductor substrate positioned over a corresponding switching transistor of the second semiconductor substrate, thereby making electrical connection between the LED and corresponding switching transistor; - dicing the bonded first and second semiconductor substrates to form individual LED packages or groups of LED packages, wherein each LED package has three package terminals , on only one face, the three package terminals comprising two power line terminals and one control terminal . <EOS>