An ink composition comprising: a semiconductor nanoparticle which contains a perovskite compound being a compound having a perovskite type crystal structure; a curable resin composition ; wherein the ink composition may further comprise a solvent , a value of Z in Formula (a) is 0.37 or less, wherein Z = O2 + O3 + N2 + N3 / C2 + C3 (O2, N2, and C2 represent the number of O atoms, the number of N atoms, and the number of C atoms, respectively, in the curable resin composition , and O3, N3, and C3 represent the number of O atoms, the number of N atoms, and the number of C atoms, respectively in the solvent , here, in a case where the ink composition does not contain the solvent , O3, N3, and C3 each represent 0), and wherein the curable resin composition contains at least one selected from the group consisting of a low-molecular-weight compound represented by Formula (b-1) and a polymer having a repeating unit represented by Formula (b-2), and wherein the curable resin composition further contains a curing agent and an initiator, and wherein a total content ratio of the low-molecular-weight compound and the polymer is 50% by mass or greater in a case where a total mass of the curable resin composition is set to 100% by mass: (in Formulae (b-1) and (b-2), A represents a hydrogen atom or a methyl group, m1 represents an integer of 0 to 20, m2 represents an integer of 0 to 2, m3 represents an integer of 0 to 20, m4 represents an integer of 0 to 2, m5 represents an integer of 0 to 20, and a total value of m1 to m5 is 20 or less, Ra represents a methylene group, Rb represents a divalent group represented by any of Formulae (b-31) to (b-38), and in a case where a plurality of Rb's are present, Rb's may be the same as or different from one another, and Rc represents a monovalent group represented by any of Formulae (b-41) to (b-48)) a semiconductor nanoparticle which contains a perovskite compound being a compound having a perovskite type crystal structure; a curable resin composition ; wherein the ink composition may further comprise a solvent , a value of Z in Formula (a) is 0.37 or less, wherein Z = O2 + O3 + N2 + N3 / C2 + C3 (O2, N2, and C2 represent the number of O atoms, the number of N atoms, and the number of C atoms, respectively, in the curable resin composition , and O3, N3, and C3 represent the number of O atoms, the number of N atoms, and the number of C atoms, respectively in the solvent , here, in a case where the ink composition does not contain the solvent , O3, N3, and C3 each represent 0), and wherein the curable resin composition contains at least one selected from the group consisting of a low-molecular-weight compound represented by Formula (b-1) and a polymer having a repeating unit represented by Formula (b-2), and wherein the curable resin composition further contains a curing agent and an initiator, and wherein a total content ratio of the low-molecular-weight compound and the polymer is 50% by mass or greater in a case where a total mass of the curable resin composition is set to 100% by mass: (in Formulae (b-1) and (b-2), A represents a hydrogen atom or a methyl group, m1 represents an integer of 0 to 20, m2 represents an integer of 0 to 2, m3 represents an integer of 0 to 20, m4 represents an integer of 0 to 2, m5 represents an integer of 0 to 20, and a total value of m1 to m5 is 20 or less, Ra represents a methylene group, Rb represents a divalent group represented by any of Formulae (b-31) to (b-38), and in a case where a plurality of Rb's are present, Rb's may be the same as or different from one another, and Rc represents a monovalent group represented by any of Formulae (b-41) to (b-48)) <EOS>