A radar system for detecting surroundings, comprising - a circuit board (5.3, 7.3, 8.3), which carries at least one high-frequency component (5.6) having at least one element (5.7) for directly emitting or receiving, and - a molded part (5.2, 6.2, 7.2, 8.2, 9.2), which comprises one or more individual antennas for emitting and/or receiving radar signals on its upper side, - wherein the connection between the at least one emitting or receiving element (5.7) of the high-frequency component (5.6) and the at least one individual antenna on the upper side of the molded part (5.2, 6.2, 7.2, 8.2, 9.2) is at least partially implemented by internal waveguides, wherein - the at least one emitting or receiving element (5.7) of the high-frequency component (5.6) is designed such that it emits in the direction of the circuit board (5.3, 7.3, 8.3) or receives from the direction of the circuit board (5.3), - the circuit board (5.3, 7.3, 8.3) is transmissive for radar waves in the area of the at least one emitting or receiving element (5.7), - the molded part (5.2, 6.2, 7.2, 8.2, 9.2) is arranged on the side of the circuit board (5.3, 7.3, 8.3) opposite to the at least one high-frequency component (5.6) and is connected thereto at least partially and conductively, wherein - at least one hollow waveguide (5.13) is formed by a depression on the side of the molded part (5.2, 6.2, 7.2, 8.2, 9.2) facing toward the circuit board and a metallized surface of the side of the circuit board (5.3, 7.3, 8.3) opposite to the at least one high-frequency component (5.6), and - this at least one waveguide (5.13) is fed from a transmissive point of the circuit board (5.3, 7.3, 8.3). - a circuit board (5.3, 7.3, 8.3), which carries at least one high-frequency component (5.6) having at least one element (5.7) for directly emitting or receiving, and - a molded part (5.2, 6.2, 7.2, 8.2, 9.2), which comprises one or more individual antennas for emitting and/or receiving radar signals on its upper side, - wherein the connection between the at least one emitting or receiving element (5.7) of the high-frequency component (5.6) and the at least one individual antenna on the upper side of the molded part (5.2, 6.2, 7.2, 8.2, 9.2) is at least partially implemented by internal waveguides, wherein - wherein the connection between the at least one emitting or receiving element (5.7) of the high-frequency component (5.6) and the at least one individual antenna on the upper side of the molded part (5.2, 6.2, 7.2, 8.2, 9.2) is at least partially implemented by internal waveguides, wherein - the at least one emitting or receiving element (5.7) of the high-frequency component (5.6) is designed such that it emits in the direction of the circuit board (5.3, 7.3, 8.3) or receives from the direction of the circuit board (5.3), - the circuit board (5.3, 7.3, 8.3) is transmissive for radar waves in the area of the at least one emitting or receiving element (5.7), - the molded part (5.2, 6.2, 7.2, 8.2, 9.2) is arranged on the side of the circuit board (5.3, 7.3, 8.3) opposite to the at least one high-frequency component (5.6) and is connected thereto at least partially and conductively, wherein - at least one hollow waveguide (5.13) is formed by a depression on the side of the molded part (5.2, 6.2, 7.2, 8.2, 9.2) facing toward the circuit board and a metallized surface of the side of the circuit board (5.3, 7.3, 8.3) opposite to the at least one high-frequency component (5.6), and - this at least one waveguide (5.13) is fed from a transmissive point of the circuit board (5.3, 7.3, 8.3). <EOS>