An in-mold electronic component, comprising: a first film layer provided at a top surface of the in-mold electronic component, wherein the first film layer is provided with a decorative layer on a side thereof away from the top surface ; a functional module comprising a circuit layer and an electronic component electrically connected to the circuit layer , wherein the electronic component comprises a display unit and a touch unit , the display unit and the touch unit are both electrically connected to the circuit layer ; the top surface comprises a display area and a touch area that are coincided with each other, the display unit and the touch unit are laminated, and the display unit and the touch unit are provided with an insulating layer therebetween; a plastic layer configured to seal the functional module ; a second film layer provided on a rear surface of the in-mold electronic component, wherein the plastic layer is located between the first film layer and the second film layer , and the circuit layer is located at a side of the second film layer adjacent to the plastic layer ; and a lead-out terminal , one end of the lead-out terminal being electrically connected to the circuit layer , and the other end of the lead-out terminal being led out to the rear surface of the in-mold electronic component; wherein the second film layer is provided with a via hole , the lead-out terminal comprises a flexible printed circuit and a conductive material filled in the via hole , one end of the conductive material is electrically connected to the circuit layer , and the other end of the conductive material is electrically connected to the flexible printed circuit . a first film layer provided at a top surface of the in-mold electronic component, wherein the first film layer is provided with a decorative layer on a side thereof away from the top surface ; a functional module comprising a circuit layer and an electronic component electrically connected to the circuit layer , wherein the electronic component comprises a display unit and a touch unit , the display unit and the touch unit are both electrically connected to the circuit layer ; the top surface comprises a display area and a touch area that are coincided with each other, the display unit and the touch unit are laminated, and the display unit and the touch unit are provided with an insulating layer therebetween; a plastic layer configured to seal the functional module ; a second film layer provided on a rear surface of the in-mold electronic component, wherein the plastic layer is located between the first film layer and the second film layer , and the circuit layer is located at a side of the second film layer adjacent to the plastic layer ; and a lead-out terminal , one end of the lead-out terminal being electrically connected to the circuit layer , and the other end of the lead-out terminal being led out to the rear surface of the in-mold electronic component; wherein the second film layer is provided with a via hole , the lead-out terminal comprises a flexible printed circuit and a conductive material filled in the via hole , one end of the conductive material is electrically connected to the circuit layer , and the other end of the conductive material is electrically connected to the flexible printed circuit . <EOS>