Pane with at least one electrical connection element, comprising: - a substrate , - an electrically conductive structure on a region of the substrate , - a layer of a lead-free solder material on a region of the electrically conductive structure , and - a connection element on the solder material , wherein - the connection element contains a first and a second foot region , a first and a second transition region , and a bridge region between the first and second transition region , - a first and a second contact surface are located on the bottom of the first and second foot regions , - the first and second contact surface and the surfaces of the first and second transition regions facing the substrate are connected to the electrically conductive structure by the solder material , and - the angle between the surface of the substrate and each of the tangent planes of the surfaces of the transition regions facing the substrate is < 90°, characterized in that the substrate contains soda lime glass and the connection element contains a chromium-containing steel with a proportion of chromium greater than or equal to 10.5 wt.-% and a coefficient of thermal expansion of 9 x 10 -6 /°C to 13 x 10 -6 /°C, and wherein the difference between the coefficients of thermal expansion of the substrate and the connection element is smaller than 5 x 10 -6 /°C, and wherein at least one spacer is arranged on each of the contact surfaces which is formed in one piece with the connection element , and wherein on each of the surfaces of the foot regions facing away from the substrate , a contact bump is arranged which is formed in one piece with the connection element . - a substrate , - an electrically conductive structure on a region of the substrate , - a layer of a lead-free solder material on a region of the electrically conductive structure , and - a connection element on the solder material , wherein - the connection element contains a first and a second foot region , a first and a second transition region , and a bridge region between the first and second transition region , - a first and a second contact surface are located on the bottom of the first and second foot regions , - the first and second contact surface and the surfaces of the first and second transition regions facing the substrate are connected to the electrically conductive structure by the solder material , and - the angle between the surface of the substrate and each of the tangent planes of the surfaces of the transition regions facing the substrate is < 90°, characterized in that the substrate contains soda lime glass and the connection element contains a chromium-containing steel with a proportion of chromium greater than or equal to 10.5 wt.-% and a coefficient of thermal expansion of 9 x 10 -6 /°C to 13 x 10 -6 /°C, and wherein the difference between the coefficients of thermal expansion of the substrate and the connection element is smaller than 5 x 10 -6 /°C, and wherein at least one spacer is arranged on each of the contact surfaces which is formed in one piece with the connection element , and wherein on each of the surfaces of the foot regions facing away from the substrate , a contact bump is arranged which is formed in one piece with the connection element . <EOS>