mhurhangee/patent-ind-claim-en huggingface dataset:
A system for additive manufacturing a part , the system comprising: a support including a support surface ; a coating device including a plurality of flat, planar exterior surfaces disposed around an axis, the coating device adapted to deposit a layer of powder over at least a portion of the support surface using one or more of the exterior surfaces as the exterior surfaces revolve around the axis; and a solidification device adapted to solidify at least a portion of the layer of powder to form at least a portion of the part , wherein the coating device is adapted to compact the powder over the support surface using one or more of the exterior surfaces , wherein the solidification device comprises a laser or an electron beam energy source, wherein the coating device includes a belt configured with a plurality of interconnected links , and each of the links includes a respective one of the exterior surfaces , wherein the coating device includes a plurality of rollers (72-74), a first of which is rotatable about the axis, and the belt circumscribes the rollers (72-74) and is engaged with one or more of the rollers (72-74). a support including a support surface ; a coating device including a plurality of flat, planar exterior surfaces disposed around an axis, the coating device adapted to deposit a layer of powder over at least a portion of the support surface using one or more of the exterior surfaces as the exterior surfaces revolve around the axis; and a solidification device adapted to solidify at least a portion of the layer of powder to form at least a portion of the part , wherein the coating device is adapted to compact the powder over the support surface using one or more of the exterior surfaces , wherein the solidification device comprises a laser or an electron beam energy source, wherein the coating device includes a belt configured with a plurality of interconnected links , and each of the links includes a respective one of the exterior surfaces , wherein the coating device includes a plurality of rollers (72-74), a first of which is rotatable about the axis, and the belt circumscribes the rollers (72-74) and is engaged with one or more of the rollers (72-74).
System for producing an orthodontic appliance to replace an orthodontic appliance worn by a patient, the system comprising: - a scanner for producing a digital three-dimensional reference model of at least one part of a patient's arch, or "initial reference model"; - a computer for producing a digital three-dimensional reference model, referred to as an "objective reference model", corresponding to a desired positioning of the teeth of said at least one part of said patient's arch at a time of treatment; - an image acquisition device for acquiring at least one updated two-dimensional image, the image acquisition device being positioned and oriented in space, relative to the patient's teeth, under so-called "real" acquisition conditions; - a computer for deforming the initial reference model, by moving tooth models, until an updated reference model is obtained which corresponds to the positioning of the teeth in the updated two-dimensional image; - a device for producing a new orthodontic appliance if a comparison, carried out by computer, - of the updated reference model with - the objective reference model leads to an unsatisfactory result, the new orthodontic appliance being configured on the basis of said result. - a scanner for producing a digital three-dimensional reference model of at least one part of a patient's arch, or "initial reference model"; - a computer for producing a digital three-dimensional reference model, referred to as an "objective reference model", corresponding to a desired positioning of the teeth of said at least one part of said patient's arch at a time of treatment; - an image acquisition device for acquiring at least one updated two-dimensional image, the image acquisition device being positioned and oriented in space, relative to the patient's teeth, under so-called "real" acquisition conditions; - a computer for deforming the initial reference model, by moving tooth models, until an updated reference model is obtained which corresponds to the positioning of the teeth in the updated two-dimensional image; - a device for producing a new orthodontic appliance if a comparison, carried out by computer, - of the updated reference model with - the objective reference model
A method of forming an axially-mountable package housing a semiconductor chip, comprising: electrically and mechanically connecting a lower die pad to a lower electrical contact of a semiconductor chip , the lower die pad extending in a first plane; electrically and mechanically connecting an upper die pad to an upper electrical contact of the semiconductor chip , the upper die pad extending in a second plane; electrically and mechanically connecting a first axially extending electrical lead to the lower die pad , said first lead extending in a first axial direction parallel to the first and second planes; electrically and mechanically connecting a second axially extending electrical lead to the upper die pad , said second lead extending in a second axial direction that is opposite to the first axial direction; encapsulating the semiconductor chip , the upper and lower die pads and a portion of the first and second axially extending leads in packaging material using a molding process; and wherein the first and second leads extend along a common longitudinal axis, wherein the first and second leads extend from said packaging material. electrically and mechanically connecting a lower die pad to a lower electrical contact of a semiconductor chip , the lower die pad extending in a first plane; electrically and mechanically connecting an upper die pad to an upper electrical contact of the semiconductor chip , the upper die pad extending in a second plane; electrically and mechanically connecting a first axially extending electrical lead to the lower die pad , said first lead extending in a first axial direction parallel to the first and second planes; electrically and mechanically connecting a second axially extending electrical lead to the upper die pad , said second lead extending in a second axial direction that is opposite to the first axial direction; encapsulating the semiconductor chip , the upper and lower die pads and a portion of the first and second axially extending leads in packaging material using a molding process; and
A method of predicting resistance to heart and skeletal muscle inflammation disease (HSMI) in salmonids induced by PRV infection, the method comprising determining the alleles present at a DNA polymorphism in the salmonid and predicting whether or not the salmonid is resistant to HSMI based on the determination of the alleles wherein the DNA polymorphism is in the locus defined by position 78,364,536 bp to 91,273,924 bp (chromosome 3) or 43,552,599 bp to 57,552,882 bp (chromosome 14) in the Atlantic salmon genome; optionally wherein the DNA polymorphism is selected from any one or more of DNA polymorphisms 1-57 provided in any of Tables 1 to 4 or 6, or any combination thereof..
A semiconductor package assembly , comprising: a SOC package , comprising: a logic die having first pads thereon; a first RDL structure coupled to the logic die ; and a molding compound surrounding the logic die , being in contact with the first RDL structure and the logic die ; and a DRAM package stacked on the SOC package , comprising: a body having a die-attach surface and a bump-attach surface opposite to the die-attach surface ; and a DRAM die mounted on the die-attach surface , coupled to the body through bonding wires , wherein the SOC package further comprises an additional DRAM die embedded therein, wherein the additional DRAM die has TSV interconnects formed through the additional DRAM die , wherein the logic die is coupled to the first RDL structure by third vias passing through the molding compound between the logic die and the first RDL structure , wherein the additional DRAM die is surrounded by the third vias . a SOC package , comprising: a logic die having first pads thereon; a first RDL structure coupled to the logic die ; and a molding compound surrounding the logic die , being in contact with the first RDL structure and the logic die ; and a logic die having first pads thereon; a first RDL structure coupled to the logic die ; and a molding compound surrounding the logic die , being in contact with the first RDL structure and the logic die ; and a DRAM package stacked on the SOC package , comprising: a body having a die-attach surface and a bump-attach surface opposite to the die-attach surface ; and a DRAM die mounted on the die-attach surface , coupled to the body through bonding wires , a body having a die-attach surface and a bump-attach surface opposite to the die-attach surface ; and a DRAM die mounted on the die-attach surface , coupled to the body through bonding wires , wherein the SOC package further comprises an additional DRAM die embedded therein, wherein the additional DRAM die has TSV interconnects formed through the additional DRAM die , wherein the logic die is coupled to the first RDL structure by third vias passing through the molding compound between the logic die and the first RDL structure , wherein the additional DRAM die is surrounded by the third vias .
A catalyst compound represented by Formula (I): wherein: M is a group 4 metal, preferably Hf; each of R 1 , R 2 , R 3 , and R 4 is independently hydrogen, alkoxide, C 1 to C 40 substituted or unsubstituted hydrocarbyl, or -R 13 -SiR' 3 or -R 13 -CR' 3 where R 13 is C 1 to C 4 hydrocarbyl, and each R' is independently C 1 to C 20 substituted or unsubstituted hydrocarbyl; each of R 5 , R 6 , R 7 , and R 8 is independently hydrogen, alkoxide, C 1 to C 40 substituted or unsubstituted hydrocarbyl, -R 13 -SiR' 3 or -R 13 -CR' 3 where R 13 is C 1 to C 4 hydrocarbyl, and each R' is independently C 1 to C 20 substituted or unsubstituted hydrocarbyl, or two or more of R 5 , R 6 , R 7 , and R 8 form a substituted or unsubstituted, saturated, partially unsaturated or aromatic, cyclic or polycyclic substituent ring; wherein at least one of R 5 , R 6 , R 7 , and R 8 is independently hydrogen, alkoxide, C 1 to C 40 substituted or unsubstituted hydrocarbyl, or -R 13 -SiR' 3 or -R 13 -CR' 3 -where R 13 is C 1 to C 4 hydrocarbyl, and each R' is independently C 1 to C 20 substituted or unsubstituted hydrocarbyl; wherein at least one of R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , and R 8 is, -R 13 -SiR' 3 where R 13 is C 1 to C 4 hydrocarbyl, and each R' is independently C 1 to C 20 substituted or unsubstituted hydrocarbyl; each of X 1 and X 2 is independently a univalent anionic ligand, a diene ligand, an alkylidene ligand, or X 1 and X 2 are joined to form a metallocyclic ring; each of T 1 and T 2 is Si; each of R 9 , R 10 , R 11 , and R 12 is independently a C 1 -C 20 containing hydrocarbyl. M is a group 4 metal, preferably Hf; each of R 1 , R 2 , R 3 , and R 4 is independently hydrogen, alkoxide, C 1 to C 40 substituted or unsubstituted hydrocarbyl, or -R 13 -SiR' 3 or -R 13 -CR' 3 where R 13 is C 1 to C 4 hydrocarbyl, and each R' is independently C 1 to C 20 substituted or unsubstituted hydrocarbyl; each of R 5 , R 6 , R 7 , and R 8 is independently hydrogen, alkoxide, C 1 to C 40 substituted or unsubstituted hydrocarbyl, -R 13 -SiR' 3 or -R 13 -CR' 3 where R 13 is C 1 to C 4 hydrocarbyl, and each R' is independently C 1 to C 20 substituted or unsubstituted hydrocarbyl, or two or more of R 5 , R 6 , R 7 , and R 8 form a substituted or unsubstituted, saturated, partially unsaturated or aromatic, cyclic or polycyclic substituent ring; wherein at least one of R 5 , R 6 , R 7 , and R 8 is independently hydrogen, alkoxide, C 1 to C 40 substituted or unsubstituted hydrocarbyl, or -R 13 -SiR' 3 or -R 13 -CR' 3 -where R 13 is C 1 to C 4 hydrocarbyl, and each R' is independently C 1 to C 20 substituted or unsubstituted hydrocarbyl; wherein at least one of R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , and R 8 is, -R 13 -SiR' 3 where R 13 is C 1 to C 4 hydrocarbyl, and each R' is independently C 1 to C 20 substituted or unsubstituted hydrocarbyl; each of X 1 and X 2 is independently a univalent anionic ligand, a diene ligand, an alkylidene ligand, or X 1 and X 2 are joined to form a metallocyclic ring; each of T 1 and T 2 is Si; each of R 9 , R 10 , R 11 , and R 12 is independently a C 1 -C 20 containing hydrocarbyl.
A jack unit for attaching a load-bearing skate to an object to be moved, the skate having at least two rolling elements and the object being provided with a coupling slot having slot bearing surfaces that extend parallel to a horizontal axis and a slot latching structure , the jack unit comprising: a jack housing ; an extendable element that is forcibly movable relative to said jack housing along a vertical lift axis ; a tongue affixed so as to extend along a horizontal tongue axis and having, tongue bearing surfaces that extend parallel to the tongue axis , and a tongue latching structure that is engageable with the slot latching structure of the coupling slot when said tongue bearing surfaces are engaged with the slot bearing surfaces , such engagement acting to block slidable motion between said tongue bearing surfaces and the slot bearing surfaces ; means for retracting said tongue latching structure from engagement with the slot latching structure ; and characterized in that the tongue is affixed with respect to said jack housing , and the tongue bearing surfaces are configured to slidably engage the slot bearing surfaces so as to limit motion between said tongue and the coupling slot to translation along the tongue axis , the jack unit further comprising skate attachment means for lockably attaching the skate to said extendable element . a jack housing ; an extendable element that is forcibly movable relative to said jack housing along a vertical lift axis ; a tongue affixed so as to extend along a horizontal tongue axis and having, tongue bearing surfaces that extend parallel to the tongue axis , and a tongue latching structure that is engageable with the slot latching structure of the coupling slot when said tongue bearing surfaces are engaged with the slot bearing surfaces , such engagement acting to block slidable motion between said tongue bearing surfaces and the slot bearing surfaces ; tongue bearing surfaces that extend parallel to the tongue axis , and a tongue latching structure that is engageable with the slot latching structure of the coupling slot when said tongue bearing surfaces are engaged with the slot bearing surfaces , such engagement acting to block slidable motion between said tongue bearing surfaces and the slot bearing surfaces ; means for retracting said tongue latching structure from engagement with the slot latching structure ; and characterized in that the tongue is affixed with respect to said jack housing , and the tongue bearing surfaces are configured to slidably engage the slot bearing surfaces so as to limit motion between said tongue and the coupling slot to translation along the tongue axis , the jack unit further comprising skate attachment means for lockably attaching the skate to said extendable element .
A cutting tool comprising: a cutting insert comprising a female thread and a cutting tool body comprising a pocket configured for securing a cutting insert and in which the cutting insert is seated; the cutting tool body further comprises: a machining end and a tool peripheral surface extending therefrom; a through, non-threaded tool coupling bore opening out to a tool peripheral surface ; a coupling screw having a coupling screw thread and being located in the tool coupling bore and is configured to secure the cutting insert to the pocket ; the tool peripheral surface comprises the pocket ; the pocket comprises an outwardly facing pocket base surface and first and second support walls which extend from the pocket base surface ; the cutting insert comprises opposite insert base surfaces and an insert peripheral surface which extends therebetween; characterised in that the cutting tool body further comprises a holding member which engages the coupling screw thread at least when the coupling screw is not in contact with the cutting insert ; and the holding member is configured to prevent the coupling screw from falling out of the tool coupling bore , and prevent it from moving away from a driving tool during turning. a cutting insert comprising a female thread and a cutting tool body comprising a pocket configured for securing a cutting insert and in which the cutting insert is seated; the cutting tool body further comprises: a machining end and a tool peripheral surface extending therefrom; a through, non-threaded tool coupling bore opening out to a tool peripheral surface ; a coupling screw having a coupling screw thread and being located in the tool coupling bore and is configured to secure the cutting insert to the pocket ; a machining end and a tool peripheral surface extending therefrom; a through, non-threaded tool coupling bore opening out to a tool peripheral surface ; a coupling screw having a coupling screw thread and being located in the tool coupling bore and is configured to secure the cutting insert to the pocket ; the tool peripheral surface comprises the pocket ; the pocket comprises an outwardly facing pocket base surface and first and second support walls which extend from the pocket base surface ; the cutting insert comprises opposite insert base surfaces and an insert peripheral surface which extends therebetween; characterised in that the cutting tool body further comprises a holding member which engages the coupling screw thread at least when the coupling screw is not in contact with the cutting insert ; and the holding member is configured to prevent the coupling screw from falling out of the tool coupling bore , and prevent it from moving away from a driving tool during turning.
An auxiliary-machine control device in a control system including a main-machine control device for controlling a main machine as a power source and an auxiliary-machine control device for controlling an auxiliary machine for assisting an output of the main machine, the auxiliary-machine control device comprising: a command-value acquisition unit that acquires a boost pressure command value for the auxiliary machine calculated by an operation command-value calculation unit of the main-machine control device on the basis of a prediction of an operation amount of control means for controlling an operating state of the auxiliary machine, and an allowable range of the operation amount of the control means calculated by an allowable-range calculation unit of the main-machine control device on the basis of the operation amount; an operation-amount calculation unit that calculates the operation amount of the control means on the basis of the acquired boost pressure command value and a prediction of a change in the boost pressure command value, and an operation-amount determination unit that selects the calculated operation amount in a case where the operation amount calculated by the operation-amount calculation unit is within the allowable range, selects an upper limit value of the allowable range in a case where the calculated operation amount exceeds the allowable range, and selects a lower limit value of the allowable range in a case where the calculated operation amount falls below the allowable range. a command-value acquisition unit that acquires a boost pressure command value for the auxiliary machine calculated by an operation command-value calculation unit of the main-machine control device on the basis of a prediction of an operation amount of control means for controlling an operating state of the auxiliary machine, and an allowable range of the operation amount of the control means calculated by an allowable-range calculation unit of the main-machine control device on the basis of the operation amount; an operation-amount calculation unit that calculates the operation amount of the control means on the basis of the acquired boost pressure command value and a prediction of a change in the boost pressure command value, and an operation-amount determination unit that selects the calculated operation amount in a case where the operation amount calculated by the operation-amount calculation unit is within the allowable range, selects an upper limit value of the allowable range in a case where the calculated operation amount exceeds the allowable range, and selects a lower limit value of the allowable range in a case where the calculated operation amount falls below the allowable range.
Process for the synthesis of 5-fluoro- 1 H -pyrazoles of the general formula (I) by reacting an olefin of the general formula (a) with nucleophiles, and optionally a base, followed by reaction with hydrazines of formula (b) R 1 -NH-NH 2 (b), wherein R 1 is selected from C 1 -C 6 alkyl, cycloalkyl, C 5 -C 10 aryl; R 2 is a trihalomethyl moiety with at least one fluorine atom; and R 3 is selected from C 1 -C 5 haloalkyl as CF 3 , CF 2 Cl, C 2 F 5 , C 3 F 7 , CF 2 CF 2 Cl, CFClCF 3 , and the nucleophile is selected from alcohols, thioles or secondary amines, and in case the nucleophile is an alcohol or a thiol, also in the presence of a base. R 1 is selected from C 1 -C 6 alkyl, cycloalkyl, C 5 -C 10 aryl; R 2 is a trihalomethyl moiety with at least one fluorine atom; and R 3 is selected from C 1 -C 5 haloalkyl as CF 3 , CF 2 Cl, C 2 F 5 , C 3 F 7 , CF 2 CF 2 Cl, CFClCF 3 , and the nucleophile is selected from alcohols, thioles or secondary amines, and in case the nucleophile is an alcohol or a thiol, also in the presence of a base.
Circuitry for adjusting a duty cycle of an RF carrier input signal to a power amplifier (PA), the circuitry comprising: a time-to-digital converter comprising a digital delay line and a time-to-digital converter logic block , the digital delay line for receiving the input signal and comprising a plurality of digital delay elements connected in series, wherein the time-to-digital converter is configured to measure the period of the input signal expressed as a number of the digital delay elements; circuitry for selecting a number of delay elements of the digital delay line required to generate an output signal with a desired duty cycle, and for generating the output signal by combining the input signal with a delayed input signal via a logical AND operation, wherein the delayed input signal is generated by the selected number of delay elements; and a processor having a control register for enabling a HIGH-power mode or a LOW-power mode of the circuitry, wherein the control register is configured to select the HIGH-power mode if the desired duty cycle has a value between 25% and 50% and the LOW-power mode if the desired duty cycle has a value between 5% and 25%. a time-to-digital converter comprising a digital delay line and a time-to-digital converter logic block , the digital delay line for receiving the input signal and comprising a plurality of digital delay elements connected in series, wherein the time-to-digital converter is configured to measure the period of the input signal expressed as a number of the digital delay elements; circuitry for selecting a number of delay elements of the digital delay line required to generate an output signal with a desired duty cycle, and for generating the output signal by combining the input signal with a delayed input signal via a logical AND operation, wherein the delayed input signal is generated by the selected number of delay elements; and a processor having a control register for enabling a HIGH-power mode or a LOW-power mode of the circuitry, wherein the control register is configured to select the HIGH-power mode if the desired duty cycle has a value between 25% and 50% and the LOW-power mode if the desired duty cycle has a value between 5% and 25%.