Sound transducer assembly with a first substrate , a first and second MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum, which each comprises a cavity , and an ASIC electrically connected to the first MEMS sound transducer , wherein the two cavities of the MEMS sound transducers are separated from one another by an intermediate wall of the first substrate , characterized in that the ASIC is embedded in the first substrate ; the first MEMS sound transducer is arranged on a second substrate such that the cavity of the first MEMS sound transducer is at least partially formed in the second substrate , wherein a hollow space of the second substrate forming said cavity is laterally surrounded or delimited by walls of the second substrate while being closed upwardly by a membrane of the first MEMS sound transducer ; , the first substrate and the second substrate are connected to one another in such a manner that the ASIC of the first substrate and the first MEMS sound transducer of the second substrate are electrically coupled to one another; the second MEMS sound transducer is arranged on a third substrate , that the cavity of the second MEMS sound transducer is formed at least partially in the third substrate , wherein a hollow space of the third substrate forming said cavity is laterally surrounded or delimited by walls of the third substrate and being closed downwardly by a membrane of the second MEMS sound transducer ; the first substrate and the third substrate are connected to one another in an electrically conductive manner; the first substrate is arranged between the second substrate and the third substrate , and the substrates are each in the form of a circuit board or PCB (printed circuit board). with a first substrate , a first and second MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum, which each comprises a cavity , and an ASIC electrically connected to the first MEMS sound transducer , wherein the two cavities of the MEMS sound transducers are separated from one another by an intermediate wall of the first substrate , characterized in that the ASIC is embedded in the first substrate ; the first MEMS sound transducer is arranged on a second substrate such that the cavity of the first MEMS sound transducer is at least partially formed in the second substrate , wherein a hollow space of the second substrate forming said cavity is laterally surrounded or delimited by walls of the second substrate while being closed upwardly by a membrane of the first MEMS sound transducer ; , the first substrate and the second substrate are connected to one another in such a manner that the ASIC of the first substrate and the first MEMS sound transducer of the second substrate are electrically coupled to one another; the second MEMS sound transducer is arranged on a third substrate , that the cavity of the second MEMS sound transducer is formed at least partially in the third substrate , wherein a hollow space of the third substrate forming said cavity is laterally surrounded or delimited by walls of the third substrate and being closed downwardly by a membrane of the second MEMS sound transducer ; the first substrate and the third substrate are connected to one another in an electrically conductive manner; the first substrate is arranged between the second substrate and the third substrate , and the substrates are each in the form of a circuit board or PCB (printed circuit board). <EOS>