A transparent display device comprising: a transparent panel comprising pixels configured to generate images; at least one flexible substrate that is bent backwards, the at least one flexible substrate having one end electrically coupled to a pad region (P) of the transparent panel , the at least one flexible substrate comprising at least one integrated circuit (IC) chip configured to apply signals to gates of transistors in the pixels; a back cover at a rear side of the transparent panel , the back cover comprising at least one groove on a rear surface of the back cover to accommodate the at least one IC chip of the at least one flexible substrate ; the transparent display device is characterised in that it further comprises: at least one film housing covering the at least one flexible substrate and pressing the at least one IC chip of the at least one flexible substrate into the at least one groove , wherein the at least one film housing includes a first portion covering part of a front surface the transparent panel facing away from the back cover , a second portion covering part of the rear surface of the back cover , and a third portion connecting the first and second portions, wherein the first portion is configured to press onto the front surface and the second portion is pressed onto the rear surface of the back cover by resilient force. a transparent panel comprising pixels configured to generate images; at least one flexible substrate that is bent backwards, the at least one flexible substrate having one end electrically coupled to a pad region (P) of the transparent panel , the at least one flexible substrate comprising at least one integrated circuit (IC) chip configured to apply signals to gates of transistors in the pixels; a back cover at a rear side of the transparent panel , the back cover comprising at least one groove on a rear surface of the back cover to accommodate the at least one IC chip of the at least one flexible substrate ; the transparent display device is characterised in that it further comprises: at least one film housing covering the at least one flexible substrate and pressing the at least one IC chip of the at least one flexible substrate into the at least one groove , wherein the at least one film housing includes a first portion covering part of a front surface the transparent panel facing away from the back cover , a second portion covering part of the rear surface of the back cover , and a third portion connecting the first and second portions, wherein the first portion is configured to press onto the front surface and the second portion is pressed onto the rear surface of the back cover by resilient force. at least one film housing covering the at least one flexible substrate and pressing the at least one IC chip of the at least one flexible substrate into the at least one groove , wherein the at least one film housing includes a first portion covering part of a front surface the transparent panel facing away from the back cover , a second portion covering part of the rear surface of the back cover , and a third portion connecting the first and second portions, wherein the first portion is configured to press onto the front surface and the second portion is pressed onto the rear surface of the back cover by resilient force. <EOS>