A display device comprising: a plurality of light-emitting cabinets each including a plurality of light-emitting modules and each including a respective support frame for supporting lower surfaces of the plurality of light-emitting modules , wherein each of the plurality of light-emitting modules includes a substrate , a light-emitting unit on the substrate , and a black matrix (BM) disposed on the substrate to surround the light-emitting unit, and the light-emitting unit has a width of less than 500 μ m, wherein the light-emitting unit includes: a first light-emitting device mounted directly on the substrate and emitting a red wavelength; a second light-emitting device mounted directly on the substrate and emitting a green wavelength; a third light-emitting device mounted directly on the substrate and emitting a blue wavelength; and a molding part covering the first to third light-emitting devices, wherein each of the first to third light-emitting devices has a width of 200 μ m or less, the light-emitting unit and the black matrix are a chip on board (COB) type, and wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is lower than 50% of that of a sapphire substrate of each of the first to third light-emitting devices. a plurality of light-emitting cabinets each including a plurality of light-emitting modules and each including a respective support frame for supporting lower surfaces of the plurality of light-emitting modules , wherein each of the plurality of light-emitting modules includes a substrate , a light-emitting unit on the substrate , and a black matrix (BM) disposed on the substrate to surround the light-emitting unit, and the light-emitting unit has a width of less than 500 μ m, wherein the light-emitting unit includes: a first light-emitting device mounted directly on the substrate and emitting a red wavelength; a second light-emitting device mounted directly on the substrate and emitting a green wavelength; a third light-emitting device mounted directly on the substrate and emitting a blue wavelength; and a molding part covering the first to third light-emitting devices, wherein each of the first to third light-emitting devices has a width of 200 μ m or less, the light-emitting unit and the black matrix are a chip on board (COB) type, and wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is lower than 50% of that of a sapphire substrate of each of the first to third light-emitting devices. a first light-emitting device mounted directly on the substrate and emitting a red wavelength; a second light-emitting device mounted directly on the substrate and emitting a green wavelength; a third light-emitting device mounted directly on the substrate and emitting a blue wavelength; and a molding part covering the first to third light-emitting devices, wherein each of the first to third light-emitting devices has a width of 200 μ m or less, the light-emitting unit and the black matrix are a chip on board (COB) type, and wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is lower than 50% of that of a sapphire substrate of each of the first to third light-emitting devices. <EOS>