mhurhangee/patent-ind-claim-en huggingface dataset:
A method comprising: accessing an opening in a housing of a gearbox , the gearbox comprising moving features and fixed features, the gearbox further comprising a first sensor disposed on the moving features , the first sensor having a first battery ; rotating the moving features of the gearbox to align the first sensor with the opening ; inserting a portion of a charging unit in the opening of the housing ; coupling a power transmitter of the charging unit with a first power receiver of the first sensor ; and transmitting power to the first sensor , the transmitted power charging the first battery of the first sensor . accessing an opening in a housing of a gearbox , the gearbox comprising moving features and fixed features, the gearbox further comprising a first sensor disposed on the moving features , the first sensor having a first battery ; rotating the moving features of the gearbox to align the first sensor with the opening ; inserting a portion of a charging unit in the opening of the housing ; coupling a power transmitter of the charging unit with a first power receiver of the first sensor ; and transmitting power to the first sensor , the transmitted power charging the first battery of the first sensor .
A combination product, comprising a limonoid compound or a pharmaceutically acceptable salt thereof, and a DPP-4 inhibitor, wherein the DPP-4 inhibitor is selected from the group consisting of sitagliptin, saxagliptin, vildagliptin, linagliptin, and alogliptin, and the limonoid compound is one or more selected from the group consisting of limonin, isolimonic acid, limonin glycoside, isolimonic acid glycoside, obacunone, isoobacunoic acid, obacunone glycoside, ichangin, ichangensin, ichangin glycoside, nomilin, nomilinic acid, deacetylnomilin, nomilin glycoside, deacetylnomilin glycoside and nomilinic acid glycoside.
A method of forming a semiconductor device , comprising a capacitor; the method comprising: forming a first metal contact element and a laterally adjacent second metal contact element and a first insulating material therebetween directly on a surface of an adjacent layer of the semiconductor device; removing a section of the first insulating material positioned between the first metal contact element and the adjacent second metal contact element to form a channel , wherein removing the section of the first insulating material leaves a layer of the first insulating material covering a first surface of the first metal contact element and a layer of the first insulating material covering a second surface of the second metal contact element , wherein the layers of the first insulating material and the surface of the adjacent layer define the channel; and depositing a second insulating material in the channel between the first metal contact element and the second metal contact element, wherein the second insulating material in the channel between the first metal contact element and the second metal contact element fills the channel , and wherein the second insulating material has a second permittivity value that is greater than a first permittivity value of the first insulating material . forming a first metal contact element and a laterally adjacent second metal contact element and a first insulating material therebetween directly on a surface of an adjacent layer of the semiconductor device; removing a section of the first insulating material positioned between the first metal contact element and the adjacent second metal contact element to form a channel , wherein removing the section of the first insulating material leaves a layer of the first insulating material covering a first surface of the first metal contact element and a layer of the first insulating material covering a second surface of the second metal contact element , wherein the layers of the first insulating material and the surface of the adjacent layer define the channel; and depositing a second insulating material in the channel between the first metal contact element and the second metal contact element, wherein the second insulating material in the channel between the first metal contact element and the second metal contact element fills the channel , and wherein the second insulating material has a second permittivity value that is greater than a first permittivity value of the first insulating material .
An ergonomic leakproof travel container comprising: a body member having a front side, a back side, and a continuous sidewall, wherein the continuous sidewall has an outer surface and inner surface forming a hollow interior; a first lid member hingedly attached to the body member via a first hinge member ; a second lid member independent from the first lid member , wherein the second lid member is hingedly attached to the body member via the first hinge member ; a chambered storage insert sized and shaped to fit in the hollow interior; a latch member attached to a second hinge member on the front side, wherein the latch member is configured to secure the first lid and second lid in a closed position; a first gasket positioned between the body member and the second lid creating a first leakproof seal; and a second gasket positioned between the chambered storage insert and the second lid creating a second leakproof seal. a body member having a front side, a back side, and a continuous sidewall, wherein the continuous sidewall has an outer surface and inner surface forming a hollow interior; a first lid member hingedly attached to the body member via a first hinge member ; a second lid member independent from the first lid member , wherein the second lid member is hingedly attached to the body member via the first hinge member ; a chambered storage insert sized and shaped to fit in the hollow interior; a latch member attached to a second hinge member on the front side, wherein the latch member is configured to secure the first lid and second lid in a closed position; a first gasket positioned between the body member and the second lid creating a first leakproof seal; and a second gasket positioned between the chambered storage insert and the second lid creating a second leakproof seal.
A displaying apparatus, comprising: a panel substrate ; a plurality of light emitting devices (800, 802, 804, 806; 800'; 811; 813; 815) arranged on the panel substrate ; and at least one connection tip disposed on one surface of each of the light emitting devices (800, 802, 804, 806; 800'; 811; 813; 815), wherein each of the light emitting devices (800, 802, 804, 806; 800'; 811; 813; 815) comprises: a light emitting structure comprising a first conductivity type semiconductor layer (23; 2110), a second conductivity type semiconductor layer (27; 2114) and an active layer (25; 2112) interposed between the first and second conductivity type semiconductor layers (23, 27; 2110, 2114); and first and second electrode pads (112, 114; 2122, 2124) disposed on the light emitting structure ; wherein a plurality of connection tips is disposed on each of the light emitting devices ; the plurality of connection tips disposed on each of the light emitting devices have different thicknesses; characterised in that the plurality of connection tips has a light transmission of 90% or more, and a refractive index between 1.4 and 1.7. a panel substrate ; a plurality of light emitting devices (800, 802, 804, 806; 800'; 811; 813; 815) arranged on the panel substrate ; and at least one connection tip disposed on one surface of each of the light emitting devices (800, 802, 804, 806; 800'; 811; 813; 815), wherein each of the light emitting devices (800, 802, 804, 806; 800'; 811; 813; 815) comprises: a light emitting structure comprising a first conductivity type semiconductor layer (23; 2110), a second conductivity type semiconductor layer (27; 2114) and an active layer (25; 2112) interposed between the first and second conductivity type semiconductor layers (23, 27; 2110, 2114); and first and second electrode pads (112, 114; 2122, 2124) disposed on the light emitting structure ; a light emitting structure comprising a first conductivity type semiconductor layer (23; 2110), a second conductivity type semiconductor layer (27; 2114) and an active layer (25; 2112) interposed between the first and second conductivity type semiconductor layers (23, 27; 2110, 2114); and first and second electrode pads (112, 114; 2122, 2124) disposed on the light emitting structure ; wherein a plurality of connection tips is disposed on each of the light emitting devices ; the plurality of connection tips disposed on each of the light emitting devices have different thicknesses; characterised in that the plurality of connection tips has a light transmission of 90% or more, and a refractive index between 1.4 and 1.7.
A contact surface for an object comprising: a base layer having a microstructured area; an adhesive layer affixed to the base layer configured to affix the base layer to the object and a composite microstructure disposed on the microstructured area comprising: a first set of microstructures having a first micro-feature with a first width between 80 μm and 120 μm; and a second set of microstructures having a second micro-feature with a second width less than the first width; characterized in that the second width is between 25% and 41% of the first width; and the composite microstructure further comprises a third set of microstructures having a third micro feature with a third width between 3% and 6% of the first width. a base layer having a microstructured area; an adhesive layer affixed to the base layer configured to affix the base layer to the object and a composite microstructure disposed on the microstructured area comprising: a first set of microstructures having a first micro-feature with a first width between 80 μm and 120 μm; and a second set of microstructures having a second micro-feature with a second width less than the first width; characterized in that the second width is between 25% and 41% of the first width; and a first set of microstructures having a first micro-feature with a first width between 80 μm and 120 μm; and a second set of microstructures having a second micro-feature with a second width less than the first width; characterized in that the second width is between 25% and 41% of the first width; and the composite microstructure further comprises a third set of microstructures having a third micro feature with a third width between 3% and 6% of the first width.
Apparatus for generating a decorrelation signal using an input signal, comprising: a subband filterbank for providing a plurality of subband signals, wherein a subband signal includes a sequence of at least two subband samples, the sequence of the subband samples representing a bandwidth of the subband signal, which is smaller than a bandwidth of the input signal, wherein the input signal includes a block of a predetermined number of input samples, the number of subband samples in a subband signal is smaller than the number of input samples; and a reverberation filter to obtain a plurality of reverberated subband signals from the plurality of subband signals, the filtering of the reverberation filter having an all-pass characteristic, the reverberation filter being operative to apply a fractional delay to each subband signal and being adapted to have different sets of filter coefficients for each subband signal, wherein the plurality of reverberated subband signals together represent the decorrelation signal. a subband filterbank for providing a plurality of subband signals, wherein a subband signal includes a sequence of at least two subband samples, the sequence of the subband samples representing a bandwidth of the subband signal, which is smaller than a bandwidth of the input signal, wherein the input signal includes a block of a predetermined number of input samples, the number of subband samples in a subband signal is smaller than the number of input samples; and a reverberation filter to obtain a plurality of reverberated subband signals from the plurality of subband signals, the filtering of the reverberation filter having an all-pass characteristic, the reverberation filter being operative to apply a fractional delay to each subband signal and being adapted to have different sets of filter coefficients for each subband signal, wherein the plurality of reverberated subband signals together represent the decorrelation signal.
An organic light-emitting display (OLED) device comprising: an organic light-emitting element layer on a substrate; and an encapsulation layer covering the organic light-emitting element layer and configured to block moisture and oxygen from permeating, characterized in that the encapsulation layer comprises a barrier film (150-1), wherein the barrier film (150-1) comprises a barrier coating layer made of a flexible, transparent polymer resin, wherein the barrier coating layer is configured for suppressing oxygen and/or moisture from permeating, and a plurality of transmittance adjusting layers (156-1, 156-2) made of silicon oxide and/or titanium oxide and disposed above and below the barrier coating layer ; and in that each of the transmittance adjusting layers (156-1, 156-2) has a refractive index of 0.2 or higher and a thickness of 0.01 μm to 1 μm, in that a first transmittance adjusting layer (156-1) is configured to transmit light emitted from the organic light-emitting element layer at a transmittance between 70% and 80%, and in that a second transmittance adjusting layer (156-2) is configured to transmit light having passed the first transmittance adjusting layer (156-1) at a transmittance between 40% and 60%. an organic light-emitting element layer on a substrate; and an encapsulation layer covering the organic light-emitting element layer and configured to block moisture and oxygen from permeating, characterized in that the encapsulation layer comprises a barrier film (150-1), wherein the barrier film (150-1) comprises a barrier coating layer made of a flexible, transparent polymer resin, wherein the barrier coating layer is configured for suppressing oxygen and/or moisture from permeating, and a plurality of transmittance adjusting layers (156-1, 156-2) made of silicon oxide and/or titanium oxide and disposed above and below the barrier coating layer ; and
A method of processing an audio signal for replay on an audio device, the method comprising: performing a spectral decomposition of the audio signal into a plurality of subband signals using band pass filters ; for each subband signal of the plurality of subband signals: providing the subband signal to a first processing path that includes a first dynamic range compressor , DRC ; adjusting a dynamic threshold associated with the first DRC ; and feedforward compressing the received subband signal by the first DRC to obtain a feedforward-compressed subband signal, wherein the feedforward-compressed subband signal is obtained based at least in part on the adjusted dynamic threshold of the first DRC ; performing distortion control at the first DRC , wherein the distortion control is performed without the use of an output band pass filter ; and recombining the feedforward-compressed subband signals, wherein performing distortion control at the first DRC comprises applying a soft knee function to the first DRC and slowing the first DRC relative to an instantaneous DRC by oversampling the subband signal, wherein applying the soft knee function smooths a non-linear broken stick compression configuration. performing a spectral decomposition of the audio signal into a plurality of subband signals using band pass filters ; for each subband signal of the plurality of subband signals: providing the subband signal to a first processing path that includes a first dynamic range compressor , DRC ; adjusting a dynamic threshold associated with the first DRC ; and feedforward compressing the received subband signal by the first DRC to obtain a feedforward-compressed subband signal, wherein the feedforward-compressed subband signal is obtained based at least in part on the adjusted dynamic threshold of the first DRC ; providing the subband signal to a first processing path that includes a first dynamic range compressor , DRC ; adjusting a dynamic threshold associated with the first DRC ; and feedforward compressing the received subband signal by the first DRC to obtain a feedforward-compressed subband signal, wherein the feedforward-compressed subband signal is obtained based at least in part on the adjusted dynamic threshold of the first DRC ; performing distortion control at the first DRC , wherein the distortion control is performed without the use of an output band pass filter ; and recombining the feedforward-compressed subband signals, wherein performing distortion control at the first DRC comprises applying a soft knee function to the first DRC and slowing the first DRC relative to an instantaneous DRC by oversampling the subband signal, wherein applying the soft knee function smooths a non-linear broken stick compression configuration.
A compound having the structure of Formula (XI) or a pharmaceutically acceptable enantiomer, diastereomer, racemate, hydrate, solvate, isotope, or salt thereof: wherein R 1 is H, F, or C 1-8 -alkyl; R 2 is H or C 1-8 -alkyl; R 4 is C 1-8 -alkyl; R 8 is halo; R 5 and R 7 are each H; and R 6 is C 1-8 -alkyl, C 1-8 -haloalkyl, C 1-8 -alkoxy, C 1-8 -haloalkoxy, cycloalkoxy, C 2-8 -alkynyl, cycloalkyl, halo or cyano. R 1 is H, F, or C 1-8 -alkyl; R 2 is H or C 1-8 -alkyl; R 4 is C 1-8 -alkyl; R 8 is halo; R 5 and R 7 are each H; and R 6 is C 1-8 -alkyl, C 1-8 -haloalkyl, C 1-8 -alkoxy, C 1-8 -haloalkoxy, cycloalkoxy, C 2-8 -alkynyl, cycloalkyl, halo or cyano.
A sampling chip dividing instrument (2;2') for cutting off a cut portion (130;131;132) from a sampling chip , wherein the sampling chip comprises a channel for collecting a sample therein and one or more of the cut portions (130;131;132) that is cuttable at a position of a cutting slit (128a;128b;128c) provided on an outer surface for cutting off a part of the channel , and the sampling chip is configured to allow to cut off the cut portions (130;131;132) from the sampling chip by bending the sampling chip in a predetermined bending direction at a position of the cutting slit (128a-128c), and wherein the sampling chip dividing instrument (2;2') is comprising: a main body block ; a space (14;18;20) that is provided inside the main body block , has an opening (14a;18a;20a) leading to an outer surface of the main body block , and fits in and contains the cut portion (130;131;132) of the sampling chip through the opening (14a;18a;20a); and a surrounding portion (4;12;16;22;24;26), which is provided outside of the space (14;18;20) so as to surround the opening (14a;18a;20a), for receiving a sample scattered from a break portion of the sampling chip divided near the opening (14a;18a;20a). the sampling chip comprises a channel for collecting a sample therein and one or more of the cut portions (130;131;132) that is cuttable at a position of a cutting slit (128a;128b;128c) provided on an outer surface for cutting off a part of the channel , and the sampling chip is configured to allow to cut off the cut portions (130;131;132) from the sampling chip by bending the sampling chip in a predetermined bending direction at a position of the cutting slit (128a-128c), and wherein the sampling chip dividing instrument (2;2') is comprising: a main body block ; a space (14;18;20) that is provided inside the main body block , has an opening (14a;18a;20a) leading to an outer surface of the main body block , and fits in and contains the cut portion (130;131;132) of the sampling chip through the opening (14a;18a;20a); and a surrounding portion (4;12;16;22;24;26), which is provided outside of the space (14;18;20) so as to surround the opening (14a;18a;20a), for receiving a sample scattered from a break portion of the sampling chip divided near the opening (14a;18a;20a). a main body block ; a space (14;18;20) that is provided inside the main body block , has an opening (14a;18a;20a) leading to an outer surface of the main body block , and fits in and contains the cut portion (130;131;132) of the sampling chip through the opening (14a;18a;20a); and a surrounding portion (4;12;16;22;24;26), which is provided outside of the space (14;18;20) so as to surround the opening (14a;18a;20a), for receiving a sample scattered from a break portion of the sampling chip divided near the opening (14a;18a;20a).
Method for preparing a foamed plastic part , wherein a mixture of plastic granules (G) is provided in that at least first plastic granules (P1) impregnated with a propellant are mixed with second plastic granules (P2), wherein the mixture of plastic granules (G) is melted and molded to prepare at least one foamed plastic part , characterized in that an actual value of at least one control variable that correlates with the foaming level of the at least one foamed plastic part is determined and is regulated by adjusting a mixing ratio of the first and the second plastic granules (P1, P2) such that the actual value approaches a predefined target value.
A method of forming coated composite feedstock strips for additive manufacturing, the method comprising: slitting a sheet into composite feedstock strips , the sheet comprising a first resin and fibers extending parallel to each other within the sheet; slitting being performed along a direction parallel to all of the fibers within the sheet; and coating an outer surface of the composite feedstock strips with a material comprising a second resin thereby forming the coated composite feedstock strips comprising a coating layer disposed over the composite feedstock strips . slitting a sheet into composite feedstock strips , the sheet comprising a first resin and fibers extending parallel to each other within the sheet; slitting being performed along a direction parallel to all of the fibers within the sheet; and the sheet comprising a first resin and fibers extending parallel to each other within the sheet; slitting being performed along a direction parallel to all of the fibers within the sheet; and coating an outer surface of the composite feedstock strips with a material comprising a second resin thereby forming the coated composite feedstock strips comprising a coating layer disposed over the composite feedstock strips .