An electric machine comprising a heat sink ; a cap , the heat sink being defined by the cap of the electric machine; an electronic module comprising a printed circuit board having a first thermally and electrically conductive layer defining, at least partly, a first face , or top face, of the printed circuit board, a second face , or bottom face, of the printed circuit board, a plurality of vias which pass through the printed circuit board between the top face, in contact with the first thermally and electrically conductive layer , and the bottom face, the electronic module comprising at least one electronic component soldered to the printed circuit board on the first thermally and electrically conductive layer by its own base and disposed, at least partly, on top of at least a first part of the vias , a thermally conductive mass , soldered to the printed circuit board in proximity to the electronic component and disposed, at least partly, on top of at least a second part of the vias, the thermally conductive mass and the electronic component being in heat exchange relationship through a thermal and electrical connection , the second face of the printed circuit board being in heat exchange relationship with the heat sink , the electronic component and the thermally conductive mass being in heat exchange relationship with the heat sink through the first thermally and electrically conductive layer and at least the first and the second part of the vias , the printed circuit board being placed in contact with the cap of the electric machine by interposing a thermally conductive and electrically insulating paste. a heat sink ; a cap , the heat sink being defined by the cap of the electric machine; an electronic module comprising a printed circuit board having a first thermally and electrically conductive layer defining, at least partly, a first face , or top face, of the printed circuit board, a second face , or bottom face, of the printed circuit board, a plurality of vias which pass through the printed circuit board between the top face, in contact with the first thermally and electrically conductive layer , and the bottom face, the electronic module comprising at least one electronic component soldered to the printed circuit board on the first thermally and electrically conductive layer by its own base and disposed, at least partly, on top of at least a first part of the vias , a thermally conductive mass , soldered to the printed circuit board in proximity to the electronic component and disposed, at least partly, on top of at least a second part of the vias, the thermally conductive mass and the electronic component being in heat exchange relationship through a thermal and electrical connection , the second face of the printed circuit board being in heat exchange relationship with the heat sink , the electronic component and the thermally conductive mass being in heat exchange relationship with the heat sink through the first thermally and electrically conductive layer and at least the first and the second part of the vias , the printed circuit board being placed in contact with the cap of the electric machine by interposing a thermally conductive and electrically insulating paste. <EOS>