A multilayered electromagnetic assembly , the electromagnetic assembly comprising: a plurality of substantially planar, stacked substrate layers (B, C, D, E, F, G, H, I), each substrate layer having a cutaway portion ; one or more heat conducting portions substantially dedicated to heat conduction, said portions being provided as one or more portions on each of said planar substrate layers (B - I) at an overlapping position common to some or all of the other substrate layers and as distinct planar layers positioned between substrate layers (B - I), the conducting portions leaving out the cutaway portions and said heat conducting layers being in contact with the heat conducting portions ; an insulated electrically conductive material arranged in a spiral configuration on at least two of the substrate layers (B - I), the spiral configuration formed between a position adjacent the cutaway portion to a position adjacent the edge (a, b, c, d) of the substrate layer (B - I), the electrically conductive material being formed substantially on and/or partially recessed or beneath the surface of the substrate layer, the spiral configurations having first and second electrical contacts that are operable to pass electric current to electrical contacts of spiral configurations on other substrate layers; and a ferromagnetic core , located through the cutaway portion of the substrate layers (B - I) and heat conducting layers ; wherein an electrical current may be passed sequentially through the two or more spiral configurations thereby generating a magnetic field in the core , with any internal heat generated within the electromagnetic assembly being conducted through the one or more heat conducting layers and out to at least one external surface, wherein the heat conducting portion passes through the substrate layers (B - I) thereby providing a heat conducting surface on both sides of the substrate layer, thereby enabling heat passing through the heat conducting layers to pass through the overlapping common heat conducting portions provided on each substrate layer (B - I) to the top and bottom of the electromagnetic assembly. a plurality of substantially planar, stacked substrate layers (B, C, D, E, F, G, H, I), each substrate layer having a cutaway portion ; one or more heat conducting portions substantially dedicated to heat conduction, said portions being provided as one or more portions on each of said planar substrate layers (B - I) at an overlapping position common to some or all of the other substrate layers and as distinct planar layers positioned between substrate layers (B - I), the conducting portions leaving out the cutaway portions and said heat conducting layers being in contact with the heat conducting portions ; an insulated electrically conductive material arranged in a spiral configuration on at least two of the substrate layers (B - I), the spiral configuration formed between a position adjacent the cutaway portion to a position adjacent the edge (a, b, c, d) of the substrate layer (B - I), the electrically conductive material being formed substantially on and/or partially recessed or beneath the surface of the substrate layer, the spiral configurations having first and second electrical contacts that are operable to pass electric current to electrical contacts of spiral configurations on other substrate layers; and a ferromagnetic core , located through the cutaway portion of the substrate layers (B - I) and heat conducting layers ; <EOS>