A method for fabricating an anti-scatter grid module, the method comprising: providing a mold comprising a plurality of orientation structures arranged in first positions, the orientation structures comprising a plurality of slots, the orientation structures arranged in two or more lines comprising an upper line of the orientation structures and a lower line of the orientation structures, the upper and lower line separated by an interlayer cavity ; placing a plurality of plates comprising a first material into the slots of the plurality of orientation structures , wherein the first material is capable of absorbing a first amount of at least one type of radiation, and wherein the plurality of plates are constrained in second positions by the plurality of orientation structures ; injecting a second material into a first cavity in the mold formed by the plurality of plates and the plurality of orientation structures to form at least a first board interconnecting the plates and forming a first surface of the module, wherein the second material is capable of absorbing a second amount of the at least one type of radiation, and wherein the first amount is greater than the second amount; filling the interlayer cavity with an interlayer material to form an interlayer board to interconnect the plates, and separating the plurality of plates and the hardened second material from the mold to generate a first module, wherein the hardened second material fixes the plurality of plates , wherein the first positions correspond to an offset angle of at least one of the orientation structures relative to a path of the at least one type of radiation incident on the first module. providing a mold comprising a plurality of orientation structures arranged in first positions, the orientation structures comprising a plurality of slots, the orientation structures arranged in two or more lines comprising an upper line of the orientation structures and a lower line of the orientation structures, the upper and lower line separated by an interlayer cavity ; placing a plurality of plates comprising a first material into the slots of the plurality of orientation structures , wherein the first material is capable of absorbing a first amount of at least one type of radiation, and wherein the plurality of plates are constrained in second positions by the plurality of orientation structures ; injecting a second material into a first cavity in the mold formed by the plurality of plates and the plurality of orientation structures to form at least a first board interconnecting the plates and forming a first surface of the module, wherein the second material is capable of absorbing a second amount of the at least one type of radiation, and wherein the first amount is greater than the second amount; filling the interlayer cavity with an interlayer material to form an interlayer board to interconnect the plates, and separating the plurality of plates and the hardened second material from the mold to generate a first module, wherein the hardened second material fixes the plurality of plates , wherein the first positions correspond to an offset angle of at least one of the orientation structures relative to a path of the at least one type of radiation incident on the first module. <EOS>