An LED lamp, characterized in that the LED lamp comprises: an LED device having multiple LED chips ; multiple conductive substrates , wherein each of the multiple conductive substrates is a metal foil, the multiple conductive substrates are arranged at intervals, and each of the LED chips is supported by and electrically connected between two adjacent conductive substrates , wherein a length of each LED chip is W1, a distance between two adjacent LED chips is W2, and W2 <2W1; a packaging layer including an upper packaging layer , wherein the upper packaging layer is pervious to light and covers the LED chips and top surfaces of the conductive substrates , wherein the packaging layer , the LED chips and the conductive substrates form a light bar ; and a protective cover being a curved tube mounted around the light bar , wherein the protective cover is pervious to light and is insulative; a fixing block having at least one hole for allowing at least one end of the light bar to pass through so as to mount the LED device to the fixing block ; a circuit board electrically connected to at least one end of the light bar for controlling the LED device ; and a lamp base for holding and mounting the fixing block and the circuit board therein; wherein a width of the conductive substrates is D1, an inner diameter of the protective cover is D3, and 0.3 < (D1 / D3) < 1. an LED device having multiple LED chips ; multiple conductive substrates , wherein each of the multiple conductive substrates is a metal foil, the multiple conductive substrates are arranged at intervals, and each of the LED chips is supported by and electrically connected between two adjacent conductive substrates , wherein a length of each LED chip is W1, a distance between two adjacent LED chips is W2, and W2 <2W1; a packaging layer including an upper packaging layer , wherein the upper packaging layer is pervious to light and covers the LED chips and top surfaces of the conductive substrates , wherein the packaging layer , the LED chips and the conductive substrates form a light bar ; and a protective cover being a curved tube mounted around the light bar , wherein the protective cover is pervious to light and is insulative; multiple LED chips ; multiple conductive substrates , wherein each of the multiple conductive substrates is a metal foil, the multiple conductive substrates are arranged at intervals, and each of the LED chips is supported by and electrically connected between two adjacent conductive substrates , wherein a length of each LED chip is W1, a distance between two adjacent LED chips is W2, and W2 <2W1; a packaging layer including an upper packaging layer , wherein the upper packaging layer is pervious to light and covers the LED chips and top surfaces of the conductive substrates , wherein the packaging layer , the LED chips and the conductive substrates form a light bar ; and a protective cover being a curved tube mounted around the light bar , wherein the protective cover is pervious to light and is insulative; a fixing block having at least one hole for allowing at least one end of the light bar to pass through so as to mount the LED device to the fixing block ; a circuit board electrically connected to at least one end of the light bar for controlling the LED device ; and a lamp base for holding and mounting the fixing block and the circuit board therein; wherein a width of the conductive substrates is D1, an inner diameter of the protective cover is D3, and 0.3 < (D1 / D3) < 1. <EOS>