A method of die and clip attachment comprising: providing a clip , a die and a substrate ; laminating a sinterable silver film on the clip and the die in a first step; depositing a tack agent on a side of the substrate in a second step: placing the die on the tack agent on the substrate in a third step, with the sinterable silver film on a side of the die facing the substrate and placed on the tack agent on the substrate ; placing the clip on the die and on the tack agent on the substrate to create a substrate, die and clip package in a fourth step, with the sinterable silver film on the clip facing the die and the substrate and placed on the tack agent on the substrate and on a side of the die opposite to the side of the die facing the substrate ; moving the substrate, die and clip package to a sintering press; and sintering the substrate, die and clip package in the sintering press in a final step; wherein the tack agent is dispensed on the substrate to place and hold in position the die and the clip on the substrate before the substrate, die and clip package has been moved to the sintering press, wherein the tack agent provides temporary attachment of the die and the clip to the substrate , wherein the tack agent evaporates during the sintering of the substrate, die and clip package without interference with the sintering process. providing a clip , a die and a substrate ; laminating a sinterable silver film on the clip and the die in a first step; depositing a tack agent on a side of the substrate in a second step: placing the die on the tack agent on the substrate in a third step, with the sinterable silver film on a side of the die facing the substrate and placed on the tack agent on the substrate ; placing the clip on the die and on the tack agent on the substrate to create a substrate, die and clip package in a fourth step, with the sinterable silver film on the clip facing the die and the substrate and placed on the tack agent on the substrate and on a side of the die opposite to the side of the die facing the substrate ; moving the substrate, die and clip package to a sintering press; and sintering the substrate, die and clip package in the sintering press in a final step; wherein the tack agent is dispensed on the substrate to place and hold in position the die and the clip on the substrate before the substrate, die and clip package has been moved to the sintering press, wherein the tack agent provides temporary attachment of the die and the clip to the substrate , wherein the tack agent evaporates during the sintering of the substrate, die and clip package without interference with the sintering process. placing the die on the tack agent on the substrate in a third step, with the sinterable silver film on a side of the die facing the substrate and placed on the tack agent on the substrate ; placing the clip on the die and on the tack agent on the substrate to create a substrate, die and clip package in a fourth step, with the sinterable silver film on the clip facing the die and the substrate and placed on the tack agent on the substrate and on a side of the die opposite to the side of the die facing the substrate ; moving the substrate, die and clip package to a sintering press; and sintering the substrate, die and clip package in the sintering press in a final step; wherein the tack agent is dispensed on the substrate to place and hold in position the die and the clip on the substrate before the substrate, die and clip package has been moved to the sintering press, wherein the tack agent provides temporary attachment of the die and the clip to the substrate , wherein the tack agent evaporates during the sintering of the substrate, die and clip package without interference with the sintering process. <EOS>