A method for manufacturing a shape-retaining non-flat device , comprising: providing (S10) a flat device laminate comprising: a first layer of thermoformable material ; a carrier layer having: a first portion arranged to extend along a periphery of a device region of the flat device laminate in which the shape-retaining non-flat device is to be formed, wherein the first portion defines a frame enclosing an opening in the carrier layer ; and a second portion protruding from the first portion into the opening in the device region to define a free end in the device region ; conductive traces arranged at least on the second portion of the carrier layer ; and a circuit element arranged at the free end of the second portion and electrically connected to the conductive traces ; deforming (S20) the device region of the flat device laminate into the shape-retaining non-flat device by thermoforming (S22) the flat device laminate , wherein the carrier layer is non-stretchable such that the length and shape of the conductive traces remain unchanged after the step of deforming (S20), and the respective shortest distance (d), along the second portion of the carrier layer , between the circuit element and the first portion , prior to and after the step of deforming (S20) the flat device laminate , are equal. providing (S10) a flat device laminate comprising: a first layer of thermoformable material ; a carrier layer having: a first portion arranged to extend along a periphery of a device region of the flat device laminate in which the shape-retaining non-flat device is to be formed, wherein the first portion defines a frame enclosing an opening in the carrier layer ; and a second portion protruding from the first portion into the opening in the device region to define a free end in the device region ; conductive traces arranged at least on the second portion of the carrier layer ; and a circuit element arranged at the free end of the second portion and electrically connected to the conductive traces ; a first layer of thermoformable material ; a carrier layer having: a first portion arranged to extend along a periphery of a device region of the flat device laminate in which the shape-retaining non-flat device is to be formed, wherein the first portion defines a frame enclosing an opening in the carrier layer ; and a second portion protruding from the first portion into the opening in the device region to define a free end in the device region ; a first portion arranged to extend along a periphery of a device region of the flat device laminate in which the shape-retaining non-flat device is to be formed, wherein the first portion defines a frame enclosing an opening in the carrier layer ; and a second portion protruding from the first portion into the opening in the device region to define a free end in the device region ; conductive traces arranged at least on the second portion of the carrier layer ; and a circuit element arranged at the free end of the second portion and electrically connected to the conductive traces ; deforming (S20) the device region of the flat device laminate into the shape-retaining non-flat device by thermoforming (S22) the flat device laminate , wherein the carrier layer is non-stretchable such that the length and shape of the conductive traces remain unchanged after the step of deforming (S20), and the respective shortest distance (d), along the second portion of the carrier layer , between the circuit element and the first portion , prior to and after the step of deforming (S20) the flat device laminate , are equal. <EOS>