mhurhangee/patent-ind-claim-en huggingface dataset:
A method for architectures for wireless avionics communication networks, comprising: detecting, by a primary data controller (108a; 108b) or a standby data controller (108b; 108a), a signal strength of wireless nodes ; assigning, by the network manager , a primary data controller (108a; 108b) and standby data controller (108b; 108a) for each of the wireless nodes based at least in part on the signal strength; generating, by the network manager , a deployment matrix based on the assignment of the primary data controllers and the standby data controllers; broadcasting, by the network manager , the deployment matrix over a wired connection to each primary data controller and each standby data controller, wherein the deployment matrix is used to configure the network of wireless nodes for communication; allocating, by the primary data controller (108a; 108b) and the standby data controller (108b; 108a), a buffer size of the primary data controller and the standby data controller based on data rates of each of the wireless nodes connected to the primary data controller and the standby data controller, wherein wireless nodes having a higher data rate are allocated more memory in the buffer compared to wireless nodes having a lower data rate; and exchanging, by the primary data controller (108a; 108b) and the standby data controller (108b; 108a), data based on the deployment matrix. detecting, by a primary data controller (108a; 108b) or a standby data controller (108b; 108a), a signal strength of wireless nodes ; assigning, by the network manager , a primary data controller (108a; 108b) and standby data controller (108b; 108a) for each of the wireless nodes based at least in part on the signal strength; generating, by the network manager , a deployment matrix based on the assignment of the primary data controllers and the standby data controllers; broadcasting, by the network manager , the deployment matrix over a wired connection to each primary data controller and each standby data controller, wherein the deployment matrix is used to configure the network of wireless nodes for communication; allocating, by the primary data controller (108a; 108b) and the standby data controller (108b; 108a), a buffer size of the primary data controller and the standby data controller based on data rates of each of the wireless nodes connected to the primary data controller and the standby data controller, wherein wireless nodes having a higher data rate are allocated more memory in the buffer compared to wireless nodes having a lower data rate; and exchanging, by the primary data controller (108a; 108b) and the standby data controller (108b; 108a), data based on the deployment matrix.
A mounting system comprising: a displacement pump having threading on an exterior of the displacement pump and a pump rod extending from an end of the displacement pump through a drive opening; and a clamp mounted on the displacement pump for securing the displacement pump to a drive housing, the clamp comprising: an axial ring fixedly mounted on the exterior of the displacement pump proximate the pump rod extending from the displacement pump; and a tightening ring mounted on the threading on the exterior of the displacement pump below the axial ring, such that the axial ring is disposed between the tightening ring and the end of the displacement pump that the pump rod extends from; wherein a gap is disposed between the axial ring and the tightening ring, and the tightening ring is rotatable about the exterior of the displacement pump on the threading and along an axis of the displacement pump such that the axial ring and the tightening ring may exert a clamping force on a portion of the drive housing disposed within the gap. a displacement pump having threading on an exterior of the displacement pump and a pump rod extending from an end of the displacement pump through a drive opening; and a clamp mounted on the displacement pump for securing the displacement pump to a drive housing, the clamp comprising: an axial ring fixedly mounted on the exterior of the displacement pump proximate the pump rod extending from the displacement pump; and a tightening ring mounted on the threading on the exterior of the displacement pump below the axial ring, such that the axial ring is disposed between the tightening ring and the end of the displacement pump that the pump rod extends from; an axial ring fixedly mounted on the exterior of the displacement pump proximate the pump rod extending from the displacement pump; and a tightening ring mounted on the threading on the exterior of the displacement pump below the axial ring, such that the axial ring is disposed between the tightening ring and the end of the displacement pump that the pump rod extends from; wherein a gap is disposed between the axial ring and the tightening ring, and the tightening ring is rotatable about the exterior of the displacement pump on the threading and along an axis of the displacement pump such that the axial ring and the tightening ring may exert a clamping force on a portion of the drive housing disposed within the gap.
A logic circuitry package for a replaceable print apparatus component comprising an interface to communicate with a print apparatus logic circuit, characterised by at least one logic circuit configured to: receive, via the interface , a request to turn on a clock generator of the logic circuitry package; receive, via the interface , a request selecting an internal clock signal to sample; receive, via the interface , a reference clock signal; and transmit, via the interface , a digital value indicating a count of cycles of the selected internal clock signal during a predetermined number of cycles of the reference clock signal. receive, via the interface , a request to turn on a clock generator of the logic circuitry package; receive, via the interface , a request selecting an internal clock signal to sample; receive, via the interface , a reference clock signal; and transmit, via the interface , a digital value indicating a count of cycles of the selected internal clock signal during a predetermined number of cycles of the reference clock signal.
A chemical reaction system comprising: a supply source configured to generate a first carbon compound including at least one of carbon monoxide and carbon dioxide; an electrochemical reaction device configured to generate a second carbon compound by a reduction reaction of carbon dioxide, and oxygen by an oxidation reaction of water, the second carbon compound including carbon monoxide; a reactor configured to generate a product including a third carbon compound by a chemical reaction of a reactant including hydrogen and the first and second carbon compounds; and a flow path through which the second carbon compound is supplied from the electrochemical reaction device to the reactor, wherein the supply source is configured to generate the first carbon compound under an atmosphere including the oxygen generated by and supplied from the electrochemical reaction device. a supply source configured to generate a first carbon compound including at least one of carbon monoxide and carbon dioxide; an electrochemical reaction device configured to generate a second carbon compound by a reduction reaction of carbon dioxide, and oxygen by an oxidation reaction of water, the second carbon compound including carbon monoxide; a reactor configured to generate a product including a third carbon compound by a chemical reaction of a reactant including hydrogen and the first and second carbon compounds; and a flow path through which the second carbon compound is supplied from the electrochemical reaction device to the reactor, wherein the supply source is configured to generate the first carbon compound under an atmosphere including the oxygen generated by and supplied from the electrochemical reaction device.
A terminal apparatus comprising: an acquisition unit configured to acquire first Quality of Service, QoS, control information from a core network according to establishment of a session with the core network ; an identification unit configured to identify an identification code of a particular application from the first QoS control information when a service flow for transmitting an uplink packet in the particular application is initially generated to make a request for the service by the terminal apparatus ; and a transmission unit configured to transmit an uplink grant request including the identification code of the particular application to a Base Station, BS, apparatus , thereby allowing the BS apparatus to process the uplink grant based on a priority of an application level identified by the identification code of the particular application. an acquisition unit configured to acquire first Quality of Service, QoS, control information from a core network according to establishment of a session with the core network ; an identification unit configured to identify an identification code of a particular application from the first QoS control information when a service flow for transmitting an uplink packet in the particular application is initially generated to make a request for the service by the terminal apparatus ; and a transmission unit configured to transmit an uplink grant request including the identification code of the particular application to a Base Station, BS, apparatus , thereby allowing the BS apparatus to process the uplink grant based on a priority of an application level identified by the identification code of the particular application.
A dipped elastomeric article comprising an elastomeric film containing one or more film layers, and at least two types of particles including: (a) magnetic particles, and/or conductive particles having electrical conductivity of at least 3.0 × 10 7 S/m at 20°C, and (b) particles containing one or more high atomic mass elements with an atomic mass of at least 132, dispersed throughout at least one of said film layers. (a) magnetic particles, and/or conductive particles having electrical conductivity of at least 3.0 × 10 7 S/m at 20°C, and (b) particles containing one or more high atomic mass elements with an atomic mass of at least 132,
An application execution apparatus configured to execute an application and including a storage holding • a data acquisition data unit relating to a data acquisition unit configured to acquire data transmitted from an IO device , • a data utilization data unit relating to a data utilization unit configured to utilize the data acquired by the data acquisition unit, • a data linkage data unit relating to a data linkage unit configured to link the data acquired by the data acquisition unit to the data utilization unit, further comprising: an FPGA as a first calculation device configured to implement the data acquisition unit in accordance with said data acquisition data unit in which the application is able to be started after an occurrence of an event for starting the application within a time required for the application; and a second calculation device provided with a general purpose operating system, OS, and configured to implement the data utilization unit in accordance with said data utilization data unit as a hardware different from the FPGA , wherein the application is a real-time application and the processing of the data utilization unit is prioritized so that the deadline of application processing can be met, and the FPGA is configured such that a time difference between a timing at which an event triggering the start of the processing by the application occurs and a timing at which the application starts the processing can be predicted. • a data acquisition data unit relating to a data acquisition unit configured to acquire data transmitted from an IO device , • a data utilization data unit relating to a data utilization unit configured to utilize the data acquired by the data acquisition unit, • a data linkage data unit relating to a data linkage unit configured to link the data acquired by the data acquisition unit to the data utilization unit, further comprising: an FPGA as a first calculation device configured to implement the data acquisition unit in accordance with said data acquisition data unit in which the application is able to be started after an occurrence of an event for starting the application within a time required for the application; and a second calculation device provided with a general purpose operating system, OS, and configured to implement the data utilization unit in accordance with said data utilization data unit as a hardware different from the FPGA , an FPGA as a first calculation device configured to implement the data acquisition unit in accordance with said data acquisition data unit in which the application is able to be started after an occurrence of an event for starting the application within a time required for the application; and a second calculation device provided with a general purpose operating system, OS, and configured to implement the data utilization unit in accordance with said data utilization data unit as a hardware different from the FPGA ,
A system for an insulated boom section of a bucket truck, said system comprising; a. the insulated boom section ; and b. a source of high volume and pressure, dry air; said system characterised by : c. one or more internal air diffusers adapted to be positioned at a first end of said insulated boom section and adapted to be connected to said source of high volume and pressure, dry air to direct a first flow of said air into and along an interior of the insulated boom section from the first end to a second opposite end of the insulated boom section to remove moisture from the interior; and d. one or more external air diffusers adapted to be positioned at the first end of said insulated boom section and adapted to be connected to said source of high volume and pressure, dry air to direct a second flow of said air along an exterior surface of the insulated boom section , from the first end to the second opposite end of the insulated boom section to remove moisture on the exterior surface. a. the insulated boom section ; and b. a source of high volume and pressure, dry air; c. one or more internal air diffusers adapted to be positioned at a first end of said insulated boom section and adapted to be connected to said source of high volume and pressure, dry air to direct a first flow of said air into and along an interior of the insulated boom section from the first end to a second opposite end of the insulated boom section to remove moisture from the interior; and d. one or more external air diffusers adapted to be positioned at the first end of said insulated boom section and adapted to be connected to said source of high volume and pressure, dry air to direct a second flow of said air along an exterior surface of the insulated boom section , from the first end to the second opposite end of the insulated boom section to remove moisture on the exterior surface.
A network entity , comprising: means for determining whether a user equipment is associated with at least one idle-mode preconfigured uplink resource, PUR, configuration; means for transmitting to the user equipment at least one paging message comprising at least one indication that at least one of the at least one idle-mode PUR configuration may be used for transmitting at least one response to the at least one paging message; and means for receiving from the user equipment , at least one radio resource control message based on at least one of the at least one indicated idle-mode PUR configuration. means for determining whether a user equipment is associated with at least one idle-mode preconfigured uplink resource, PUR, configuration; means for transmitting to the user equipment at least one paging message comprising at least one indication that at least one of the at least one idle-mode PUR configuration may be used for transmitting at least one response to the at least one paging message; and means for receiving from the user equipment , at least one radio resource control message based on at least one of the at least one indicated idle-mode PUR configuration.
A method of electrically connecting electrical appliances in a kitchen comprising the steps of: - Provide an electrical socket in the kitchen area, - Providing a flat electrical cable with a plug connector for connection to the socket, - Providing at least one connection adapter for each electrical device to be connected to the flat electrical cable on the flat cable , - Contacting the electrical device with the flat cable by means of a supply cable by connecting the supply cable to the connection adapter - Provide an electrical socket in the kitchen area, - Providing a flat electrical cable with a plug connector for connection to the socket, - Providing at least one connection adapter for each electrical device to be connected to the flat electrical cable on the flat cable , - Contacting the electrical device with the flat cable by means of a supply cable by connecting the supply cable to the connection adapter
A transmission mechanism, comprising: a first sun gear , arranged on a motor output shaft of a driving motor , a first planetary gear assembly, comprising a first planet carrier and a first planetary gear , the first planetary gear being arranged on a side of the first planet carrier and meshing with the first sun gear , a shaft hole being arranged on a gear in the first planetary gear , a first gear shaft being mounted in the shaft hole, an end of the first gear shaft being connected with the first planet carrier , and an output shaft , connected with a side of the first planetary gear away from the first planet carrier characterized in that an inner wall of the shaft hole being provided with a helical groove configured to store lubricant. a first sun gear , arranged on a motor output shaft of a driving motor , a first planetary gear assembly, comprising a first planet carrier and a first planetary gear , the first planetary gear being arranged on a side of the first planet carrier and meshing with the first sun gear , a shaft hole being arranged on a gear in the first planetary gear , a first gear shaft being mounted in the shaft hole, an end of the first gear shaft being connected with the first planet carrier , and an output shaft , connected with a side of the first planetary gear away from the first planet carrier characterized in that an inner wall of the shaft hole being provided with a helical groove configured to store lubricant.
A method of dicing a substrate , the method comprising: providing a plasma process chamber having a plasma source ; providing a work piece support within the plasma process chamber ; providing the substrate having a top surface and a bottom surface, the top surface of the substrate having a plurality of street areas and at least one device structure ; placing the substrate onto a support film on a frame to form a work piece ; placing the work piece onto said work piece support ; generating a plasma from the plasma source in the plasma process chamber ; exposing at least a portion of the support film that is not overlapped by the substrate to the generated plasma ; generating a byproduct from the exposed portion of the support film; and processing the work piece using the generated plasma and the byproduct generated from the exposed portion of the support film, wherein the step of processing the work piece comprises etching a surface of the substrate of the work piece using the generated plasma to remove material from the surface of the substrate and provide exposed surfaces; and depositing a passivation layer comprising the byproduct generated from the support film that is exposed to the generated plasma onto the surfaces that were exposed in the etching step. providing a plasma process chamber having a plasma source ; providing a work piece support within the plasma process chamber ; providing the substrate having a top surface and a bottom surface, the top surface of the substrate having a plurality of street areas and at least one device structure ; placing the substrate onto a support film on a frame to form a work piece ; placing the work piece onto said work piece support ; generating a plasma from the plasma source in the plasma process chamber ; exposing at least a portion of the support film that is not overlapped by the substrate to the generated plasma ; generating a byproduct from the exposed portion of the support film; and processing the work piece using the generated plasma and the byproduct generated from the exposed portion of the support film, wherein the step of processing the work piece comprises etching a surface of the substrate of the work piece using the generated plasma to remove material from the surface of the substrate and provide exposed surfaces; and depositing a passivation layer comprising the byproduct generated from the support film that is exposed to the generated plasma onto the surfaces that were exposed in the etching step.
A solder alloy having an alloy composition consisting of, by mass%, Bi: 30 to 60%, Ag: 0.7 to 2.0%, Cu: 0.01% or more and 1.00% or less, Ni: 0.01 to 1.00%, Sb: 0.2 to 1.5%, and optionally at least one selected from the group consisting of, at least one of P, Ge, Ga, and As: 0.1% or less in total, at least one of Fe, and Co: 0.1% or less in total, Pd: 0.1% or less, Zr: 0.1% or less, Zn: 0.1 % or less, and Pb: 0.02% or less, with the balance being Sn and unavoidable impurities, wherein the alloy composition does not contain In, Ti and Ce, and wherein the alloy composition satisfies at least one of the following relations or : 13.00 ≤ Bi / Ag + Cu + Ni + Sb ≤ 23.27 0.017 ≤ Ag + Cu + Ni / Sn ≤ 0.039 wherein Sn, Bi, Ag, Cu, Ni, and Sb in the relations and each represent the contents by mass% thereof in the solder alloy and wherein the calculations are performed according to the description. Bi: 30 to 60%, Ag: 0.7 to 2.0%, Cu: 0.01% or more and 1.00% or less, Ni: 0.01 to 1.00%, Sb: 0.2 to 1.5%, and optionally at least one selected from the group consisting of, at least one of P, Ge, Ga, and As: 0.1% or less in total, at least one of Fe, and Co: 0.1% or less in total, Pd: 0.1% or less, Zr: 0.1% or less, Zn: 0.1 % or less, and Pb: 0.02% or less, with the balance being Sn and unavoidable impurities, wherein the alloy composition does not contain In, Ti and Ce, and wherein the alloy composition satisfies at least one of the following relations or : 13.00 ≤ Bi / Ag + Cu + Ni + Sb ≤ 23.27 0.017 ≤ Ag + Cu + Ni / Sn ≤ 0.039 wherein Sn, Bi, Ag, Cu, Ni, and Sb in the relations and each represent the contents by mass% thereof in the solder alloy and wherein the calculations are performed according to the description.