A wafer bonding and debonding method comprising: providing a stack comprising first and second substrates bonded together via a bonding layer by: coating one of the first and second substrates with a spin-coatable bonding composition, the spin-coatable bonding composition comprising: a tackifier; and a compound selected from the group consisting of rubbers, styrene-isoprene-styrene, styrene-butadiene-styrene, halogenated butyl rubber, and mixtures thereof, said tackifier and said compound being dissolved or dispersed in a solvent system; said bonding composition comprising at least about 30% by weight said solvent system, based upon the total weight of the composition taken as 100% by weight; baking said one of said first and second substrates coated with said bonding composition to evaporate the solvents and form the bonding layer; and contacting and bonding the other of said first and second substrates with the bonding layer; subjecting said stack to a temperature of at least about 190°C so as to soften said bonding layer; and applying a force to at least one of said first and second substrates while causing the other of said first and second substrates to resist said force, said force being applied in a sufficient amount so as to separate said first and second substrates. providing a stack comprising first and second substrates bonded together via a bonding layer by: coating one of the first and second substrates with a spin-coatable bonding composition, the spin-coatable bonding composition comprising: a tackifier; and a compound selected from the group consisting of rubbers, styrene-isoprene-styrene, styrene-butadiene-styrene, halogenated butyl rubber, and mixtures thereof, said tackifier and said compound being dissolved or dispersed in a solvent system; said bonding composition comprising at least about 30% by weight said solvent system, based upon the total weight of the composition taken as 100% by weight; baking said one of said first and second substrates coated with said bonding composition to evaporate the solvents and form the bonding layer; and contacting and bonding the other of said first and second substrates with the bonding layer; coating one of the first and second substrates with a spin-coatable bonding composition, the spin-coatable bonding composition comprising: a tackifier; and a compound selected from the group consisting of rubbers, styrene-isoprene-styrene, styrene-butadiene-styrene, halogenated butyl rubber, and mixtures thereof, said tackifier and said compound being dissolved or dispersed in a solvent system; said bonding composition comprising at least about 30% by weight said solvent system, based upon the total weight of the composition taken as 100% by weight; a tackifier; and a compound selected from the group consisting of rubbers, styrene-isoprene-styrene, styrene-butadiene-styrene, halogenated butyl rubber, and mixtures thereof, said tackifier and said compound being dissolved or dispersed in a solvent system; said bonding composition comprising at least about 30% by weight said solvent system, based upon the total weight of the composition taken as 100% by weight; baking said one of said first and second substrates coated with said bonding composition to evaporate the solvents and form the bonding layer; and contacting and bonding the other of said first and second substrates with the bonding layer; subjecting said stack to a temperature of at least about 190°C so as to soften said bonding layer; and applying a force to at least one of said first and second substrates while causing the other of said first and second substrates to resist said force, said force being applied in a sufficient amount so as to separate said first and second substrates.