A system for attenuating a differential signal comprising: a differential input comprising a positive side and a negative side; a differential output comprising a positive side and a negative side; a plurality of PIN diodes (830, 840, 850, 860, 835, 845, 855, 865) configured as variable attenuation devices, the system further comprising at least a first semiconductor die and a second semiconductor die electrically connected between the differential input and the differential output; at least two of said plurality of PIN diodes (830, 840, 850, 860, 835, 845, 855, 865) being fabricated on each of said at least first and second semiconductor dies, such that a semiconductor die comprising a first PIN diode (830, 840, 850, 860) electrically connected between the differential input and the differential output on the positive side further comprises a second PIN diode substantially similar to the first PIN diode (835, 845, 855, 865) connected between the differential input and the differential output on the negative side, the second PIN diode having the same function and circuit connections on the negative side as the first PIN diode has on the positive side; and an attenuation control voltage circuit that supplies an attenuation control voltage to the first PIN diodes of the first and second semiconductor dies (830, 840, 850, 860) through a first radio frequency choke and to the second PIN diodes of the first and second semiconductor dies (835, 845, 855, 865) through a second radio frequency choke, the attenuation of the first and second PIN diodes of the first and second semiconductor dies varying as a function of said attenuation control voltage. a differential input comprising a positive side and a negative side; a differential output comprising a positive side and a negative side; a plurality of PIN diodes (830, 840, 850, 860, 835, 845, 855, 865) configured as variable attenuation devices, the system further comprising at least a first semiconductor die and a second semiconductor die electrically connected between the differential input and the differential output; at least two of said plurality of PIN diodes (830, 840, 850, 860, 835, 845, 855, 865) being fabricated on each of said at least first and second semiconductor dies, such that a semiconductor die comprising a first PIN diode (830, 840, 850, 860) electrically connected between the differential input and the differential output on the positive side further comprises a second PIN diode substantially similar to the first PIN diode (835, 845, 855, 865) connected between the differential input and the differential output on the negative side, the second PIN diode having the same function and circuit connections on the negative side as the first PIN diode has on the positive side; and an attenuation control voltage circuit that supplies an attenuation control voltage to the first PIN diodes of the first and second semiconductor dies (830, 840, 850, 860) through a first radio frequency choke and to the second PIN diodes of the first and second semiconductor dies (835, 845, 855, 865) through a second radio frequency choke, the attenuation of the first and second PIN diodes of the first and second semiconductor dies varying as a function of said attenuation control voltage.