An electronic component evaluation method for evaluating a configuration of an electronic component of which a lower surface comprises a plurality of mounting terminals and a lower base part, the electronic component having: the lower surface facing a mounting substrate; an upper surface; and the plurality of mounting terminals configured to be mounted on the mounting substrate, the method comprising the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals utilizing the terminal position information; and detecting height information of a height of at least one of the upper surface or the lower surface relative to the reference plane, characterized in that in the detecting of the height information: capture an image of the electronic component from the lower base part; obtain image data from the captured image; obtain lower base part position information of a plurality of positions of the lower base part in response to the image data; convert the lower base part position information into converted lower base part position information with respect to the reference plane; and detect the height information of the lower base part or the upper surface relative to the reference plane utilizing the converted lower base part position information. the lower surface facing a mounting substrate; an upper surface; and the plurality of mounting terminals configured to be mounted on the mounting substrate, the method comprising the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals utilizing the terminal position information; and detecting height information of a height of at least one of the upper surface or the lower surface relative to the reference plane, characterized in that in the detecting of the height information: capture an image of the electronic component from the lower base part; obtain image data from the captured image; obtain lower base part position information of a plurality of positions of the lower base part in response to the image data; convert the lower base part position information into converted lower base part position information with respect to the reference plane; and detect the height information of the lower base part or the upper surface relative to the reference plane utilizing the converted lower base part position information. obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals utilizing the terminal position information; and detecting height information of a height of at least one of the upper surface or the lower surface relative to the reference plane, characterized in that in the detecting of the height information: capture an image of the electronic component from the lower base part; obtain image data from the captured image; obtain lower base part position information of a plurality of positions of the lower base part in response to the image data; convert the lower base part position information into converted lower base part position information with respect to the reference plane; and detect the height information of the lower base part or the upper surface relative to the reference plane utilizing the converted lower base part position information. capture an image of the electronic component from the lower base part; obtain image data from the captured image; obtain lower base part position information of a plurality of positions of the lower base part in response to the image data; convert the lower base part position information into converted lower base part position information with respect to the reference plane; and detect the height information of the lower base part or the upper surface relative to the reference plane utilizing the converted lower base part position information.