Method for producing a solderable component with a predeterminable contact resistance value (R soll), the solderable component having: a first contact element and a second contact element, each for soldering onto a printed circuit board, a first connection surface electrically connected to the first contact element and a second connection surface electrically connected to the second contact element, wherein the connection surfaces (2a, 2b) are to be electrically contacted with one another during the manufacture of the solderable component, and wherein the method comprises the steps of: - Providing a plurality of nanowires on the first connection surface and on the second connection surface; - Aligning the first connecting surface and the second connecting surface in such a way that the first connecting surface and the second connecting surface face each other; - bringing together the first connection surface with the second connection surface, wherein the plurality of nanowires of the first connection surface is brought into contact with the plurality of nanowires of the second connection surface, characterized in that a non-detachable electrically conductive connection between the first connection surface and the second connection surface is produced, with an actual contact resistance value (R ist) between the first contact element and the second contact element, wherein the actual contact resistance value (R ist) is smaller than a predeterminable nominal contact resistance value (R soll); - Microstructuring (102, 102a, 102b) of the non-detachable electrically conductive connection, wherein during the microstructuring (102, 102a, 102b) the actual contact resistance value (R ist) is increased by a material removal, wherein the actual contact resistance value (R ist) is increased by the microstructuring (102, 102a, 102b) until the actual contact resistance value (R ist) substantially corresponds to a desired contact resistance value (R soll). a first contact element and a second contact element, each for soldering onto a printed circuit board, a first connection surface electrically connected to the first contact element and a second connection surface electrically connected to the second contact element, wherein the connection surfaces (2a, 2b) are to be electrically contacted with one another during the manufacture of the solderable component, and wherein the method comprises the steps of: - Providing a plurality of nanowires on the first connection surface and on the second connection surface; - Aligning the first connecting surface and the second connecting surface in such a way that the first connecting surface and the second connecting surface face each other; - bringing together the first connection surface with the second connection surface, wherein the plurality of nanowires of the first connection surface is brought into contact with the plurality of nanowires of the second connection surface, - Providing a plurality of nanowires on the first connection surface and on the second connection surface; - Aligning the first connecting surface and the second connecting surface in such a way that the first connecting surface and the second connecting surface face each other; - bringing together the first connection surface with the second connection surface, wherein the plurality of nanowires of the first connection surface is brought into contact with the plurality of nanowires of the second connection surface, characterized in that a non-detachable electrically conductive connection between the first connection surface and the second connection surface is produced, with an actual contact resistance value (R ist) between the first contact element and the second contact element, wherein the actual contact resistance value (R ist) is smaller than a predeterminable nominal contact resistance value (R soll); - Microstructuring (102, 102a, 102b) of the non-detachable electrically conductive connection, wherein during the microstructuring (102, 102a, 102b) the actual contact resistance value (R ist) is increased by a material removal, wherein the actual contact resistance value (R ist) is increased by the microstructuring (102, 102a, 102b) until the actual contact resistance value (R ist) substantially corresponds to a desired contact resistance value (R soll). - Microstructuring (102, 102a, 102b) of the non-detachable electrically conductive connection, wherein during the microstructuring (102, 102a, 102b) the actual contact resistance value (R ist) is increased by a material removal, wherein the actual contact resistance value (R ist) is increased by the microstructuring (102, 102a, 102b) until the actual contact resistance value (R ist) substantially corresponds to a desired contact resistance value (R soll).