A motherboard module (10, 10C), comprising: a motherboard (11, 11C) comprising a plurality of memory slots; a plurality of memory modules (100, 100A, 100B, 100C) with screens detachably inserted into the memory slots, comprising: a plurality of memory substrates (110, 110A, 110B, 110C), wherein each of the memory substrates (110, 110A, 110B, 110C) comprises a plurality of memory components and a connection interface, and the connection interface is detachably inserted into the corresponding memory slot; and a plurality of screens disposed on the memory substrates (110, 110A, 110B, 110C); a plurality of power conversion modules (120, 120C) disposed on the memory substrates (110, 110A, 110B, 110C) and electrically connected to the connection interface or disposed on the motherboard (11, 11C) and electrically connected to the memory slots; and a plurality of screen control modules (130, 130C) disposed on the memory substrates (110, 110A, 110B, 110C) and electrically connected to the connection interfaces and the power conversion modules (120, 120C) or disposed on the motherboard (11, 11C) and electrically connected to the memory slots and the power conversion modules (120, 120C), a plurality of heat dissipation covers disposed on the memory substrates (110, 110A, 110B, 110C) and thermally coupled to the memory components, wherein each of the heat dissipation covers comprises a surface, the surface being the top surface of each of the heat dissipation covers opposite to the connection interface, wherein each of the plurality of screens is disposed on the top surface of each of the plurality of the heat dissipation covers, and the plurality of screens is thermally coupled to the heat dissipation covers and is not covered by the heat dissipation covers, wherein when the memory modules (100, 100A, 100B, 100C) with the screens are inserted into the memory slots, the plurality of screens is electrically connected to the power conversion modules (120, 120C) and to the screen control modules (130, 130C) to receive voltages output by the power conversion modules (120, 120C) and display signals output by the screen control modules (130, 130C), wherein the plurality of screens of the memory modules with the screens is spliced together into a combined screen, wherein the combined screen is used to display combined text messages and combined images, wherein each of the connection interfaces comprises serial data and serial clock, and each of the screen control modules (130, 130C) is electrically connected to the serial data and serial clock of the corresponding connection interface. a motherboard (11, 11C) comprising a plurality of memory slots; a plurality of memory modules (100, 100A, 100B, 100C) with screens detachably inserted into the memory slots, comprising: a plurality of memory substrates (110, 110A, 110B, 110C), wherein each of the memory substrates (110, 110A, 110B, 110C) comprises a plurality of memory components and a connection interface, and the connection interface is detachably inserted into the corresponding memory slot; and a plurality of screens disposed on the memory substrates (110, 110A, 110B, 110C); a plurality of memory substrates (110, 110A, 110B, 110C), wherein each of the memory substrates (110, 110A, 110B, 110C) comprises a plurality of memory components and a connection interface, and the connection interface is detachably inserted into the corresponding memory slot; and a plurality of screens disposed on the memory substrates (110, 110A, 110B, 110C); a plurality of power conversion modules (120, 120C) disposed on the memory substrates (110, 110A, 110B, 110C) and electrically connected to the connection interface or disposed on the motherboard (11, 11C) and electrically connected to the memory slots; and a plurality of screen control modules (130, 130C) disposed on the memory substrates (110, 110A, 110B, 110C) and electrically connected to the connection interfaces and the power conversion modules (120, 120C) or disposed on the motherboard (11, 11C) and electrically connected to the memory slots and the power conversion modules (120, 120C), a plurality of heat dissipation covers disposed on the memory substrates (110, 110A, 110B, 110C) and thermally coupled to the memory components, wherein each of the heat dissipation covers comprises a surface, the surface being the top surface of each of the heat dissipation covers opposite to the connection interface, wherein each of the plurality of screens is disposed on the top surface of each of the plurality of the heat dissipation covers, and the plurality of screens is thermally coupled to the heat dissipation covers and is not covered by the heat dissipation covers, wherein when the memory modules (100, 100A, 100B, 100C) with the screens are inserted into the memory slots, the plurality of screens is electrically connected to the power conversion modules (120, 120C) and to the screen control modules (130, 130C) to receive voltages output by the power conversion modules (120, 120C) and display signals output by the screen control modules (130, 130C), wherein the plurality of screens of the memory modules with the screens is spliced together into a combined screen, wherein the combined screen is used to display combined text messages and combined images, wherein each of the connection interfaces comprises serial data and serial clock, and each of the screen control modules (130, 130C) is electrically connected to the serial data and serial clock of the corresponding connection interface.