Method for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, wherein the product substrate, the interconnect layer and the carrier substrate form a product substrate-carrier substrate-compound, wherein the film is mounted on the film frame in an annular attachment section of the film that surrounds the bonding surface section, and wherein the film comprises a stripping section that is located between the bonding surface section and the attachment section and the stripping section extending from a periphery of the product substrate to an inner periphery of the film frame, - wherein stripping means cause stripping of the product substrate from the carrier substrate from a periphery of the product substrate, wherein the stripping means comprise the film mounted to the film frame and a film frame holder for holding the film frame and acting with a force on the film frame, wherein the product substrate is stripped by deforming the flexible film in the stripping section by means of a force Fs and the force Ff, which is directed against the force Fs, - wherein additionally to the stripping means connection release means are provided for at least partial release of the bond caused by the connection layer between the carrier substrate and the product substrate, - wherein the connection release means comprise fluid means, namely a solvent, which selectively dissolves the connection layer, characterized in that the solvent acts in an area of the periphery of the product substrate for at least partial release of the connection layer, and wherein a solvent reservoir containing the solvent is arranged at the carrier substrate such that the product substrate-carrier substrate-compound is immersed into the fluid in a position in which the forces Fs and Ff are acting on the carrier substrate and in that the force Fs and the force Ff cause displacement of the film frame relative to the carrier substrate, in this way within the film frame a trough being formed that has acoustic wave generating means, formed from a fluid that is held in the trough and an acoustic transmitter immersed into the fluid, wherein the acoustic waves generated by the acoustic wave generating means are transmitted via the film to the solvent, which is arranged on the opposite side of the film, and wherein the stripping of the product substrate is greatly accelerated by the cavitation generated by ultrasound or megasound. - wherein stripping means cause stripping of the product substrate from the carrier substrate from a periphery of the product substrate, wherein the stripping means comprise the film mounted to the film frame and a film frame holder for holding the film frame and acting with a force on the film frame, wherein the product substrate is stripped by deforming the flexible film in the stripping section by means of a force Fs and the force Ff, which is directed against the force Fs, - wherein additionally to the stripping means connection release means are provided for at least partial release of the bond caused by the connection layer between the carrier substrate and the product substrate, - wherein the connection release means comprise fluid means, namely a solvent, which selectively dissolves the connection layer,