A method of manufacturing MEMS microphone packages, comprising: Providing a frame having a plurality of ports, the frame includes portions that form a plurality of lids; mounting of MEMS microphone dies on the frame to form a first portion of the MEMS microphone package by attaching a first side of the MEMS microphone dies to the top surface of the frame, wherein the MEMS microphone dies span the respective port, the MEMS microphone dies having die landing pads disposed on a second side of the MEMS microphone dies opposite the first side; providing interconnects on the die landing pads, wherein first ends of the interconnects are attached to the die landing pads, and wherein the interconnects extend away from the die landing pads; attaching a control chip to a first side of a substrate and electrically connecting the control chip to a first landing pad disposed at the first side of the substrate, the substrate further comprising a second landing pad disposed at the first side of the substrate and an interconnect structure disposed in a body of the substrate and electrically coupled to the second landing pad, wherein a conductive connector is applied to the second landing pad; affixing the first portion over the substrate, wherein the affixing forms an interior cavity between the lids and the substrate that is bounded by sidewalls having a molding compound, and wherein the affixing causes a second end of the interconnects, opposite the first end of the interconnects, to be attached to the second landing pads and affixed by the conductive connector; performing a singulation process to form the MEMS microphone packages; and for each singulated MEMS microphone package, forming an external contact pad and a trace on an exposed surface (509a2) of the sidewalls having the molding compound, wherein a first end of the trace is coupled to the external contact pad and a second end of the trace is coupled to the interconnect structure. Providing a frame having a plurality of ports, the frame includes portions that form a plurality of lids; mounting of MEMS microphone dies on the frame to form a first portion of the MEMS microphone package by attaching a first side of the MEMS microphone dies to the top surface of the frame, wherein the MEMS microphone dies span the respective port, the MEMS microphone dies having die landing pads disposed on a second side of the MEMS microphone dies opposite the first side; providing interconnects on the die landing pads, wherein first ends of the interconnects are attached to the die landing pads, and wherein the interconnects extend away from the die landing pads; attaching a control chip to a first side of a substrate and electrically connecting the control chip to a first landing pad disposed at the first side of the substrate, the substrate further comprising a second landing pad disposed at the first side of the substrate and an interconnect structure disposed in a body of the substrate and electrically coupled to the second landing pad, wherein a conductive connector is applied to the second landing pad; affixing the first portion over the substrate, wherein the affixing forms an interior cavity between the lids and the substrate that is bounded by sidewalls having a molding compound, and wherein the affixing causes a second end of the interconnects, opposite the first end of the interconnects, to be attached to the second landing pads and affixed by the conductive connector; performing a singulation process to form the MEMS microphone packages; and for each singulated MEMS microphone package, forming an external contact pad and a trace on an exposed surface (509a2) of the sidewalls having the molding compound, wherein a first end of the trace is coupled to the external contact pad and a second end of the trace is coupled to the interconnect structure.