An electronic device (101, 200, 300, 900) comprising: a housing (310, 910) including a lateral member (318, 920); and an antenna module (197, 242, 244, 500, 810, 820, 830, 840, 1700) disposed in an inner space of the housing (310, 910) and including: a printed circuit board, PCB, (590, 890) including a first side and a second side perpendicular with respect to the first side, and disposed such that a first surface thereof faces the lateral member (318, 920) of the housing (310, 910), wherein the PCB (590, 890) further includes a second surface facing in a direction opposite to the first surface, a wireless communication circuit (192, 595) disposed on the second surface, and an antenna array including a plurality of conductive patches (510, 520, 530, 540) disposed on the PCB (590, 890) to form beam pattern in a direction that the first surface faces, wherein one of the plurality of conductive patches (510, 520, 530, 540) comprises: a first feeder (511, 8111) disposed to be in contact with a first point of one of the conductive patches (510, 520, 530, 540), and electrically connected to the wireless communication circuit (192, 595), and characterized in that the one of the plurality of conductive patches (510, 520, 530, 540) further comprises: a second feeder (512, 8112) disposed to be in contact with a second point of one of the conductive patches (510, 520, 530, 540), and electrically connected to the wireless communication circuit (192, 595), wherein the first point and the second point are located such that a first virtual line passing through the first point and a center of the one of the conductive patches (510, 520, 530, 540) is substantially perpendicular to a second virtual line passing through the second point and the center, and wherein the first virtual line and the second virtual line are not perpendicular to the first side and the second side of the PCB (590, 890). a housing (310, 910) including a lateral member (318, 920); and an antenna module (197, 242, 244, 500, 810, 820, 830, 840, 1700) disposed in an inner space of the housing (310, 910) and including: a printed circuit board, PCB, (590, 890) including a first side and a second side perpendicular with respect to the first side, and disposed such that a first surface thereof faces the lateral member (318, 920) of the housing (310, 910), wherein the PCB (590, 890) further includes a second surface facing in a direction opposite to the first surface, a wireless communication circuit (192, 595) disposed on the second surface, and an antenna array including a plurality of conductive patches (510, 520, 530, 540) disposed on the PCB (590, 890) to form beam pattern in a direction that the first surface faces, wherein one of the plurality of conductive patches (510, 520, 530, 540) comprises: a first feeder (511, 8111) disposed to be in contact with a first point of one of the conductive patches (510, 520, 530, 540), and electrically connected to the wireless communication circuit (192, 595), and characterized in that the one of the plurality of conductive patches (510, 520, 530, 540) further comprises: a second feeder (512, 8112) disposed to be in contact with a second point of one of the conductive patches (510, 520, 530, 540), and electrically connected to the wireless communication circuit (192, 595), a printed circuit board, PCB, (590, 890) including a first side and a second side perpendicular with respect to the first side, and disposed such that a first surface thereof faces the lateral member (318, 920) of the housing (310, 910), wherein the PCB (590, 890) further includes a second surface facing in a direction opposite to the first surface, a wireless communication circuit (192, 595) disposed on the second surface, and an antenna array including a plurality of conductive patches (510, 520, 530, 540) disposed on the PCB (590, 890) to form beam pattern in a direction that the first surface faces, wherein one of the plurality of conductive patches (510, 520, 530, 540) comprises: a first feeder (511, 8111) disposed to be in contact with a first point of one of the conductive patches (510, 520, 530, 540), and electrically connected to the wireless communication circuit (192, 595), and characterized in that the one of the plurality of conductive patches (510, 520, 530, 540) further comprises: a second feeder (512, 8112) disposed to be in contact with a second point of one of the conductive patches (510, 520, 530, 540), and electrically connected to the wireless communication circuit (192, 595), a first feeder (511, 8111) disposed to be in contact with a first point of one of the conductive patches (510, 520, 530, 540), and electrically connected to the wireless communication circuit (192, 595), and characterized in that the one of the plurality of conductive patches (510, 520, 530, 540) further comprises: a second feeder (512, 8112) disposed to be in contact with a second point of one of the conductive patches (510, 520, 530, 540), and electrically connected to the wireless communication circuit (192, 595), wherein the first point and the second point are located such that a first virtual line passing through the first point and a center of the one of the conductive patches (510, 520, 530, 540) is substantially perpendicular to a second virtual line passing through the second point and the center, and wherein the first virtual line and the second virtual line are not perpendicular to the first side and the second side of the PCB (590, 890).