An arrangement comprising a power semiconductor module, a cooler for cooling the power semiconductor module, and an adhesive for fixing the cooler to the power semiconductor module, wherein the power semiconductor module comprises a baseplate, wherein the power semiconductor module further comprises a cooling structure with a cooling surface, wherein the cooling surface faces the cooler for dissipating heat from the baseplate and the cooling structure is at least in part formed from the baseplate, wherein the cooling structure comprises an inner area and an outer area surrounding the inner area at least in part in lateral directions and comprising a first connecting area in the outer area, wherein the first connecting area is connected to a second connecting area of the cooler via the adhesive, wherein the first connecting area comprises a first connecting structure and the second connecting area comprises a second connecting structure, wherein the first connection structure is arranged opposite to the second connecting structure, wherein at least one of the first connecting structure comprises at least one recession and the second connecting structure comprises at least one protrusion, and the second connecting structure comprises at least one recession and the first connecting structure comprises at least one protrusion, wherein the at least one protrusion and the at least one recession are arranged such that the at least one protrusion is arranged in the at least one recession, wherein the adhesive is placed between the first connecting structure and the second connecting structure, and wherein the first connecting area is part of a mold compound arranged on the baseplate. the power semiconductor module comprises a baseplate, wherein the power semiconductor module further comprises a cooling structure with a cooling surface, wherein the cooling surface faces the cooler for dissipating heat from the baseplate and the cooling structure is at least in part formed from the baseplate, wherein the cooling structure comprises an inner area and an outer area surrounding the inner area at least in part in lateral directions and comprising a first connecting area in the outer area, wherein the first connecting area is connected to a second connecting area of the cooler via the adhesive, wherein the first connecting area comprises a first connecting structure and the second connecting area comprises a second connecting structure, wherein the first connection structure is arranged opposite to the second connecting structure, wherein at least one of the first connecting structure comprises at least one recession and the second connecting structure comprises at least one protrusion, and the second connecting structure comprises at least one recession and the first connecting structure comprises at least one protrusion, wherein the at least one protrusion and the at least one recession are arranged such that the at least one protrusion is arranged in the at least one recession, wherein the adhesive is placed between the first connecting structure and the second connecting structure, and wherein the first connecting area is part of a mold compound arranged on the baseplate.