A method of making a CMP polishing pad that comprises the steps of: providing a first assembly of a non-liquid, partially cured thermoset polyurethane or polyurea local area transparency intermediate material having one surface affixed to at least one support member; positioning said first assembly in a polishing pad making apparatus whereby the affixed surface of the partially cured thermoset polyurethane or polyurea LAT intermediate material is located between the polishing surface and bottom surface of the polishing pad that will be formed in the apparatus; introducing opaque thermoset polyurethane or polyurea intermediate material into said polishing pad making apparatus; co-curing the partially cured thermoset polyurethane or polyurea LAT intermediate material and the opaque thermoset polyurethane or polyurea intermediate material by compression molding to form a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured closed cell, opaque thermoset polyurethane or polyurea region and at least one aperture region; said at least one cured closed cell, opaque thermoset polyurethane or polyurea region having a porosity from 10% to 55% by volume; said at least one aperture region having (a) a top opening positioned below the polishing surface that is surrounded by a plateau plane, (b) a bottom opening that is co-planar with said back surface and (c) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region containing a plug of cured thermoset polyurethane or polyurea LAT material, formed from the partially cured thermoset polyurethane or polyurea LAT intermediate material, that is chemically bonded directly to an opaque thermoset polyurethane or polyurea area. providing a first assembly of a non-liquid, partially cured thermoset polyurethane or polyurea local area transparency intermediate material having one surface affixed to at least one support member; positioning said first assembly in a polishing pad making apparatus whereby the affixed surface of the partially cured thermoset polyurethane or polyurea LAT intermediate material is located between the polishing surface and bottom surface of the polishing pad that will be formed in the apparatus; introducing opaque thermoset polyurethane or polyurea intermediate material into said polishing pad making apparatus; co-curing the partially cured thermoset polyurethane or polyurea LAT intermediate material and the opaque thermoset polyurethane or polyurea intermediate material by compression molding to form a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured closed cell, opaque thermoset polyurethane or polyurea region and at least one aperture region; said at least one cured closed cell, opaque thermoset polyurethane or polyurea region having a porosity from 10% to 55% by volume; said at least one aperture region having (a) a top opening positioned below the polishing surface that is surrounded by a plateau plane, (b) a bottom opening that is co-planar with said back surface and (c) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region containing a plug of cured thermoset polyurethane or polyurea LAT material, formed from the partially cured thermoset polyurethane or polyurea LAT intermediate material, that is chemically bonded directly to an opaque thermoset polyurethane or polyurea area.