A method for manufacturing a semiconductor device comprising steps of: attaching by suction a front surface of a semiconductor wafer onto a surface of an attachment plate of a chuck table; grinding from a back surface of the semiconductor wafer in an inside region thereof with a recessed configuration leaving a ring-shaped stiffening portion at the outer peripheral portion of the semiconductor wafer; and transporting the semiconductor wafer having the ring-shaped stiffening portion from the chuck table while holding the semiconductor wafer; the step of transporting the semiconductor wafer comprising steps of: pressing the semiconductor wafer from the back surface side to the front surface side thereof on a place different from a place at which the semiconductor wafer is to be held, the step of pressing the semiconductor wafer being conducted before holding the semiconductor wafer having the ring-shaped stiffening portion; releasing attachment by suction on the front surface of the semiconductor wafer by supplying a positive pressure to the chuck table; releasing pressing the semiconductor wafer from the back surface side to the front surface side thereof on the place different from the place at which the semiconductor wafer is to be held, the pressing the wafer being conducted in the step of pressing the semiconductor wafer; and picking up the semiconductor wafer having the ring-shaped stiffening portion from the chuck table while holding the semiconductor wafer. attaching by suction a front surface of a semiconductor wafer onto a surface of an attachment plate of a chuck table; grinding from a back surface of the semiconductor wafer in an inside region thereof with a recessed configuration leaving a ring-shaped stiffening portion at the outer peripheral portion of the semiconductor wafer; and transporting the semiconductor wafer having the ring-shaped stiffening portion from the chuck table while holding the semiconductor wafer; the step of transporting the semiconductor wafer comprising steps of: pressing the semiconductor wafer from the back surface side to the front surface side thereof on a place different from a place at which the semiconductor wafer is to be held, the step of pressing the semiconductor wafer being conducted before holding the semiconductor wafer having the ring-shaped stiffening portion; releasing attachment by suction on the front surface of the semiconductor wafer by supplying a positive pressure to the chuck table; releasing pressing the semiconductor wafer from the back surface side to the front surface side thereof on the place different from the place at which the semiconductor wafer is to be held, the pressing the wafer being conducted in the step of pressing the semiconductor wafer; and picking up the semiconductor wafer having the ring-shaped stiffening portion from the chuck table while holding the semiconductor wafer. pressing the semiconductor wafer from the back surface side to the front surface side thereof on a place different from a place at which the semiconductor wafer is to be held, the step of pressing the semiconductor wafer being conducted before holding the semiconductor wafer having the ring-shaped stiffening portion; releasing attachment by suction on the front surface of the semiconductor wafer by supplying a positive pressure to the chuck table; releasing pressing the semiconductor wafer from the back surface side to the front surface side thereof on the place different from the place at which the semiconductor wafer is to be held, the pressing the wafer being conducted in the step of pressing the semiconductor wafer; and picking up the semiconductor wafer having the ring-shaped stiffening portion from the chuck table while holding the semiconductor wafer.