An emitter package, comprising: a submount comprising an upper portion and a lower portion, said upper portion having a width smaller than the width of said lower portion, wherein the upper portion comprises a first planar surface having a substantially square shape, said square shape comprising first edges and corners, and said corners comprising notches, and wherein the lower portion comprises a second planar surface, said second planar surface being positioned around said first planar surface and such that the first planar surface is elevated with respect to the second planar surface; a square-shaped solid state emitter mounted to the first planar surface of said upper portion of the submount so that said solid state emitter and said submount are in angular alignment, and such that said notches are positioned around said solid state emitter and an encapsulant matrix on said first planar surface of said upper portion of the submount, and covering said solid state emitter, said encapsulant matrix forming a dome-shape over said solid state emitter, the size and shape of said encapsulant matrix at least partially defined by the width and shape of said first edges and said notches of the first planar surface, said encapsulant matrix comprising conversion materials, wherein said second planar surface comprises second edges, and wherein an intermediate encapsulant over said encapsulant matrix is in a dome-shape, the size and shape of said intermediate encapsulant at least partially defined by the size and shape of said second edges. a submount comprising an upper portion and a lower portion, said upper portion having a width smaller than the width of said lower portion, wherein the upper portion comprises a first planar surface having a wherein the upper portion comprises a first planar surface having a substantially square shape, said square shape comprising first edges and corners, and said corners comprising notches, and wherein the lower portion comprises a second planar surface, said second planar surface being positioned around said first planar surface and such that the first planar surface is elevated with respect to the second planar surface; and wherein the lower portion comprises a second planar surface, said second planar surface being positioned around said first planar surface and such that the first planar surface is elevated with respect to the second planar surface; a square-shaped solid state emitter mounted to the first planar surface of said upper portion of the submount so that said solid state emitter and said submount are in angular alignment, and such that said notches are positioned around said solid state emitter and an encapsulant matrix on said first planar surface of said upper portion of the submount, and covering said solid state emitter, said encapsulant matrix forming a dome-shape over said solid state emitter, the size and shape of said encapsulant matrix at least partially defined by the width and shape of said first edges and said notches of the first planar surface, said encapsulant matrix comprising conversion materials, wherein said second planar surface comprises second edges, and wherein an intermediate encapsulant over said encapsulant matrix is in a dome-shape, the size and shape of said intermediate encapsulant at least partially defined by the size and shape of said second edges.