mhurhangee/ep-ind-claims huggingface dataset:
Machine tool with improved thermal stability comprising: - a workpiece support for supporting at least one workpiece for allowing machining of the workpiece - a support structure comprising a tool carrier support, wherein the tool carrier support supports a tool carrier configured for carrying and driving a tool for machining a workpiece supported by the workpiece support through a relative movement between the workpiece and the tool, - a conduit configured to allow the flow of air in a closed circuit, the conduit comprising a surface part, said surface part being an inner cavity of the support structure, the machine tool being characterised in that it further comprises an underground part, said underground part comprising a piping configured to be buried in the soil beneath the support structure. - a workpiece support for supporting at least one workpiece for allowing machining of the workpiece - a support structure comprising a tool carrier support, wherein the tool carrier support supports a tool carrier configured for carrying and driving a tool for machining a workpiece supported by the workpiece support through a relative movement between the workpiece and the tool, - a conduit configured to allow the flow of air in a closed circuit, the conduit comprising a surface part, said surface part being an inner cavity of the support structure, the machine tool being characterised in that it further comprises an underground part, said underground part comprising a piping configured to be buried in the soil beneath the support structure.
Dental treatment instrument for operating a rotary tool, wherein the treatment instrument has a head drive, which is provided for coupling to a shank of the rotary tool and which has a sleeve-like guide bushing, wherein the guide bushing has a collet chuck for fixing the rotary tool inserted into the guide bushing, and wherein the guide bushing has, in at least a first axial region, surface portions which form parts of a cylindrical form, wherein recesses are provided which face radially outwards from these surface portions and which give the inner contour of the guide bushing a form that deviates from a rotationally symmetrical form.
A quenched-tempered high-strength steel consisting of the following components by weight percentage: C:0.16-0.20%, Si: 0.10-0.30%, Mn: 0.80-1.60%, Cr: 0.20-0.70%, Mo: 0.10-0.45%, Ni: 0.10-0.50%, Nb: 0.010-0.030%, Ti: 0.010-0.030%, V: 0.010-0.050%, B: 0.0005-0.0030%, Al: 0.02-0.06%, Ca: 0.001-0.004%, N: 0.002-0.005%, P≤0.020%, S≤0.010%, O≤0.008%, the balance of Fe and unavoidable impurities, wherein the above elements meet the following relationships: Ceq 0.51-0.60%, Ceq=C+Mn/6+(Cr+Mo+V)/5+(Ni+Cu)/15;0.8%≤Mo+0.8Ni+0.4Cr+6V≤1.3%; 3.7≤Ti/N≤7.0; 1.0≤Ca/S≤3.0; wherein the quenched-tempered high-strength steel has a microstructure of tempered martensite; and wherein the quenched-tempered high-strength steel has a yield strength of 900-1080MPa, a tensile strength of 950-1200MPa, an elongation >10%, and an impact energy at -40°C >40J. Ceq 0.51-0.60%, Ceq=C+Mn/6+(Cr+Mo+V)/5+(Ni+Cu)/15;0.8%≤Mo+0.8Ni+0.4Cr+6V≤1.3%; 3.7≤Ti/N≤7.0; 1.0≤Ca/S≤3.0; wherein the quenched-tempered high-strength steel has a microstructure of tempered martensite; and wherein the quenched-tempered high-strength steel has a yield strength of 900-1080MPa, a tensile strength of 950-1200MPa, an elongation >10%, and an impact energy at -40°C >40J.
An MFI zeolite comprising the following properties: (i) the MFI zeolite includes uniform mesopores having a pore distribution curve in which a peak-width thereof at half height (hw) is at most 20 nm (hw ≤ 20 nm) and a center value (μ) of a maximum peak is 10 nm or more and 20 nm or less (10 nm ≤ μ ≤20 nm), and having a pore volume (pv) of the uniform mesopores of at least 0.05 mL/g (0.05 mL/g ≤ pv); (ii) the MFI zeolite has no peak in a range of 0.1° to 3° in powder X-ray diffraction measurement with a diffraction angle represented by 2θ; (iii) the MFI zeolite has an average particle diameter of at most 100 nm (PD ≤ 100 nm), wherein the average particle diameter is determined from the outer surface area using the following formula: P D = 6 S 1 2.29 × 10 6 + 0.18 × 10 − 6 in the formula, S is the outer surface area (m 2 /g) and PD is the average particle diameter (m), wherein the outer surface area (S (m 2 /g)) in the formula is determined by a t-plot method using a general nitrogen adsorption method; (iv) an SiO 2 /Al 2 O 3 molar ratio is 20 or more and 200 or less (20 ≤ SiO 2 /Al 2 O 3 molar ratio ≤ 200); and (v) an aggregation diameter is 1 μ m or more and 100 μ m or less (1 μ m ≤ PS ≤ 100 μ m) as measured by a dynamic scattering method and represented by a volume average diameter. (i) the MFI zeolite includes uniform mesopores having a pore distribution curve in which a peak-width thereof at half height (hw) is at most 20 nm (hw ≤ 20 nm) and a center value (μ) of a maximum peak is 10 nm or more and 20 nm or less (10 nm ≤ μ ≤20 nm), and having a pore volume (pv) of the uniform mesopores of at least 0.05 mL/g (0.05 mL/g ≤ pv); (ii) the MFI zeolite has no peak in a range of 0.1° to 3° in powder X-ray diffraction measurement with a diffraction angle represented by 2θ; (iii) the MFI zeolite has an average particle diameter of at most 100 nm (PD ≤ 100 nm), wherein the average particle diameter is determined from the outer surface area using the following formula: P D = 6 S 1 2.29 × 10 6 + 0.18 × 10 − 6 in the formula, S is the outer surface area (m 2 /g) and PD is the average particle diameter (m), wherein the outer surface area (S (m 2 /g)) in the formula is determined by a t-plot method using a general nitrogen adsorption method; (iv) an SiO 2 /Al 2 O 3 molar ratio is 20 or more and 200 or less (20 ≤ SiO 2 /Al 2 O 3 molar ratio ≤ 200); and (v) an aggregation diameter is 1 μ m or more and 100 μ m or less (1 μ m ≤ PS ≤ 100 μ m) as measured by a dynamic scattering method and represented by a volume average diameter.
A wireless device including a number of transceiver chains, each of the transceiver chains including an amplifier that comprises: at least one gain transistor including a first terminal, and including a control terminal to receive an input signal; a degeneration inductor coupled between the first terminal of the at least one gain transistor and ground; and a shunt inductor and a first capacitor coupled in series between the control terminal of the at least one gain transistor and ground, wherein the degeneration inductor and the shunt inductor form a transformer configured to provide impedance matching for the amplifier. at least one gain transistor including a first terminal, and including a control terminal to receive an input signal; a degeneration inductor coupled between the first terminal of the at least one gain transistor and ground; and a shunt inductor and a first capacitor coupled in series between the control terminal of the at least one gain transistor and ground, wherein the degeneration inductor and the shunt inductor form a transformer configured to provide impedance matching for the amplifier.
Method for classifying magnetic resonance measurement data acquired from an object under examination by means of a magnetic resonance fingerprinting method comprising the following method steps: - acquiring magnetic resonance measurement data of the object under examination, wherein the magnetic resonance measurement data comprises a plurality of magnetic resonance signal profiles of different voxels acquired by means of a magnetic resonance fingerprinting method, - deriving at least one texture parameter from the magnetic resonance measurement data, - classifying the magnetic resonance measurement data into at least one tissue class using the at least one texture parameter and - providing the classified magnetic resonance measurement data, wherein - deriving the at least one texture parameter involves reconstructing at least one texture parameter map, wherein the magnetic resonance fingerprinting model used for reconstructing the at least one texture parameter map takes account of a spatial context of the plurality of magnetic resonance signal profiles, and - the magnetic resonance measurement data is classified using the at least one texture parameter map. - acquiring magnetic resonance measurement data of the object under examination, wherein the magnetic resonance measurement data comprises a plurality of magnetic resonance signal profiles of different voxels acquired by means of a magnetic resonance fingerprinting method, - deriving at least one texture parameter from the magnetic resonance measurement data, - classifying the magnetic resonance measurement data into at least one tissue class using the at least one texture parameter and - providing the classified magnetic resonance measurement data, - deriving the at least one texture parameter involves reconstructing at least one texture parameter map, wherein the magnetic resonance fingerprinting model used for reconstructing the at least one texture parameter map takes account of a spatial context of the plurality of magnetic resonance signal profiles, and - the magnetic resonance measurement data is classified using the at least one texture parameter map.
Method for producing a motor vehicle component having at least one hot-formed and press-hardened part (8, 9) made from high-strength steel, said motor vehicle component being used as a structural component and/or a safety component for a motor vehicle, said method comprising the following steps: - partially heat-treating zones of the motor vehicle component, wherein the zones are first heated to a heat-up temperature in a temperature range between 550°C and 800°C, particularly between 700°C and 800°C; - maintaining the heat-up temperature for a holding time of less than 30 seconds; - cooling down from the heat-up temperature in at least two phases, the second phase directly following the first phase and the cooling time of the first phase taking place for a longer duration in relation to the cooling time of the second phase, the second phase taking place over a period of up to 120 seconds, preferably up to 60 seconds, the component (8, 9) being cooled by the first phase of the cooling to a temperature of between 500°C and 700°C and the part (8, 9) being cooled by the second phase to a temperature below 200°C, - a transitional zone of between 1 and 50 mm being formed between the hot-formed and press-hardened, non-heat-treated zone and the partially heat-treated zone. - partially heat-treating zones of the motor vehicle component, wherein the zones are first heated to a heat-up temperature in a temperature range between 550°C and 800°C, particularly between 700°C and 800°C; - maintaining the heat-up temperature for a holding time of less than 30 seconds; - cooling down from the heat-up temperature in at least two phases, the second phase directly following the first phase and the cooling time of the first phase taking place for a longer duration in relation to the cooling time of the second phase, the second phase taking place over a period of up to 120 seconds, preferably up to 60 seconds, the component (8, 9) being cooled by the first phase of the cooling to a temperature of between 500°C and 700°C and the part (8, 9) being cooled by the second phase to a temperature below 200°C, - a transitional zone of between 1 and 50 mm being formed between the hot-formed and press-hardened, non-heat-treated zone and the partially heat-treated zone.
A punching device for processing dried samples (36-1,...,36-4) applied to a sample card, in particular of liquids containing DNA such as blood, saliva and the like, comprising: a support structure; at least one punching means mounted removably on the support structure and having a punch and a lower die, wherein the punch is movable between a rest position in which it is away from the lower die and a punching position in which it is close to the lower die, and wherein the punching means has a receiving opening into which a sample card is introducible by means of a movable gripper unit of the punching device and is positionable relative to the punching means, a punching drive which is mounted on the support structure and which is couplable or coupled to the punch of the punching means and by way of which the movement of the punch between the rest position and the punching position is driven, wherein the punching means comprises a structure (141, 142, 144, 146) separate from the punching device, the punch and the lower die being arranged on said separate structure (141, 142, 144, 146), wherein the punching means with its structure (141, 142, 144, 146) is configured such that said punching means forms an exchangeable module that is couplable to the support structure of the punching device and the punching drive, characterized in that the punching device comprises a suction device, by means of which dust particles produced during punching are removable in the region of the lower die, and an actuating element that can be actuated so that an engagement between the punching means and the support structure can be released. a support structure; at least one punching means mounted removably on the support structure and having a punch and a lower die, wherein the punch is movable between a rest position in which it is away from the lower die and a punching position in which it is close to the lower die, and wherein the punching means has a receiving opening into which a sample card is introducible by means of a movable gripper unit of the punching device and is positionable relative to the punching means, a punching drive which is mounted on the support structure and which is couplable or coupled to the punch of the punching means and by way of which the movement of the punch between the rest position and the punching position is driven, wherein the punching means comprises a structure (141, 142, 144, 146) separate from the punching device, the punch and the lower die being arranged on said separate structure (141, 142, 144, 146), wherein the punching means with its structure (141, 142, 144, 146) is configured such that said punching means forms an exchangeable module that is couplable to the support structure of the punching device and the punching drive, characterized in that the punching device comprises a suction device, by means of which dust particles produced during punching are removable in the region of the lower die, and an actuating element that can be actuated so that an engagement between the punching means and the support structure can be released.
Method for operating a charging station for electric vehicles, in which - a charging power is negotiated between a charge control device of the electric vehicle and the charging station and - the charge control device controls a charging current which is transmitted from the charging station to the electric vehicle in accordance with the charging power negotiated, - wherein a continuous power rating and a maximum power of the charging station which is greater than the continuous power rating are determined, characterised in that - a charging power which is above the continuous power rating and which at most corresponds to the maximum power is first negotiated, - in that the temperature in the charging station is monitored, and - in that a new charging power is negotiated in accordance with the temperature. - a charging power is negotiated between a charge control device of the electric vehicle and the charging station and - the charge control device controls a charging current which is transmitted from the charging station to the electric vehicle in accordance with the charging power negotiated, - wherein a continuous power rating and a maximum power of the charging station which is greater than the continuous power rating are determined, - a charging power which is above the continuous power rating and which at most corresponds to the maximum power is first negotiated, - in that the temperature in the charging station is monitored, and - in that a new charging power is negotiated in accordance with the temperature.
Semiconductor layer structure, comprising an active layer and a superlattice composed of stacked layers (9a, 9b) of a first type (a) and of at least one second type (b), wherein - the layers (9a, 9b) of the first type (a) and of the at least one second type (b) are III-V compound semiconductors, - adjacent layers of different types in the superlattice differ in composition in terms of at least one element, - the layers have predefined layer thicknesses, and - the layer thicknesses of the layers of the first type (a) and of the layers of the second type (b) increase from layer to layer with increasing distance from the active layer, characterized in that the content of a material component in at least the layers of an identical type (9a, 9b) increases from layer to layer with increasing distance from the active layer. - the layers (9a, 9b) of the first type (a) and of the at least one second type (b) are III-V compound semiconductors, - adjacent layers of different types in the superlattice differ in composition in terms of at least one element, - the layers have predefined layer thicknesses, and - the layer thicknesses of the layers of the first type (a) and of the layers of the second type (b) increase from layer to layer with increasing distance from the active layer, characterized in that the content of a material component in at least the layers of an identical type (9a, 9b) increases from layer to layer with increasing distance from the active layer.
Method for controlling an AC/DC converter connected, on the one hand, to an AC network and, on the other hand, to a multi-point DC high-voltage network, comprising the steps of: - identification of an electric power setpoint, said setpoint being received from an external device, and identification of the operating point of the converter; - depending on the identified operating point of the converter, set respective power corrective setpoint terminals (MDP11, MDP12, MDP13, NDP11, NDP12, NDP13) for at least two different electrical parameters to be controlled; - generate corrective power setpoints (DP11, DP12) for said at least two different electrical parameters of the converter, each of these corrective power setpoints being between said respective terminals; - apply an electrical power setpoint to the converter, this electrical power setpoint being the sum of the identified electrical power setpoint and the generated corrective setpoints (DP11, DP12). - identification of an electric power setpoint, said setpoint being received from an external device, and identification of the operating point of the converter; - depending on the identified operating point of the converter, set respective power corrective setpoint terminals (MDP11, MDP12, MDP13, NDP11, NDP12, NDP13) for at least two different electrical parameters to be controlled; - generate corrective power setpoints (DP11, DP12) for said at least two different electrical parameters of the converter, each of these corrective power setpoints being between said respective terminals; - apply an electrical power setpoint to the converter, this electrical power setpoint being the sum of the identified electrical power setpoint and the generated corrective setpoints (DP11, DP12).
An image post-processing method for controlling a glossiness of a fixed toner image, the method comprising a glossiness control step of: irradiating the fixed toner image formed with a toner containing a compound that absorbs light and fixed on a recording medium with a glossiness control light that is capable of reducing a glossiness of the fixed toner image, wherein the glossiness control light has a maximum emission wavelength in a wavelength region which is absorbed by the compound, and wherein a light amount of the glossiness control light in the glossiness control step is controlled based on glossiness information designated by a user, characterized in that the light amount of the glossiness control light is controlled based on relational information on a change in the glossiness of the toner image with respect to the light amount of the glossiness control light to be irradiated. irradiating the fixed toner image formed with a toner containing a compound that absorbs light and fixed on a recording medium with a glossiness control light that is capable of reducing a glossiness of the fixed toner image, wherein the glossiness control light has a maximum emission wavelength in a wavelength region which is absorbed by the compound, and wherein a light amount of the glossiness control light in the glossiness control step is controlled based on glossiness information designated by a user, characterized in that the light amount of the glossiness control light is controlled based on relational information on a change in the glossiness of the toner image with respect to the light amount of the glossiness control light to be irradiated.
Method for making a ceramic piece by a rapid prototyping procedure, which comprises operations consisting of depositing a thin layer of a paste composition containing a mixture of a stabilised zirconia powder, a photopolymerisable resin, a photoinitiator, a dispersant and optional adjuvants on a support, polymerising this layer locally in one or several selected zones by the action of suitable radiation, depositing a new layer on the layer thus treated, and recommencing the operations until all of the polymerised parts constitute the desired piece in the unprocessed state, removing the unpolymerised parts, removing the organic constituent of the unprocessed piece by thermal decomposition (debinding), and sintering this piece, characterised in that a plasticising agent is incorporated into the composition in a quantity of 20 to 50% by volume relative to the quantity of polymerisable resin in order to eliminate or minimise the stresses generated in the piece during polymerisation so as to avoid cracking of the piece during sintering and in that a composition is used containing a stabilised zirconia powder in a quantity between 49 and 55% relative to the total volume of the composition to ensure that the composition has a viscosity of at least 10,000 Pa.s at a flow velocity gradient of 0.1 sec -1, such that the paste is self-supporting, that is to say does not flow by itself, and that the unpolymerised parts of one layer can support the following layer.
A substrate handling device for a wafer, comprising: - an end effector, - a straightening ring, and - a suction cup, wherein the suction cup is arranged within the straightening ring, wherein a first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply, wherein the suction cup projects from the straightening ring in a normal pressure state, and wherein the suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is held by the suction cup, so that the straightening ring contacts the substrate, characterised in that the straightening ring is releasably attached to the end effector, and also the suction cup is releasably attached to the end effector. - an end effector, - a straightening ring, and - a suction cup, wherein the suction cup is arranged within the straightening ring, wherein a first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply, wherein the suction cup projects from the straightening ring in a normal pressure state, and wherein the suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is held by the suction cup, so that the straightening ring contacts the substrate, characterised in that the straightening ring is releasably attached to the end effector, and also the suction cup is releasably attached to the end effector.