Process for fabricating a device for detecting electromagnetic radiation, the detecting device comprising: - a substrate comprising a readout circuit; - at least one thermal detector resting on the substrate, and connected to the readout circuit, comprising a detecting element (80; 60) suspended above the substrate by at least one supporting pillar; the process comprising the following steps: o depositing, on the substrate, a first sacrificial layer (72.1); o producing, on the first sacrificial layer (72.1), at least one intermediate pad intended to form a jut, the intermediate pad being made of at least one material sensitive to a chemical etchant used subsequently to etch sacrificial layers (71, 72.1, 72.2, 73); o depositing, on the first sacrificial layer (72.1) and the intermediate pad, a second sacrificial layer (72.2); o producing, by locally etching the first and second sacrificial layers (72.1, 72.2), at least one vertical orifice that is bounded transversely by a lateral border, said orifice being positioned so that a segment of the intermediate pad protrudes into the vertical orifice, thus forming a jut; o carrying out conformal deposition, on the lateral border of the vertical orifice, of a layer of interest that is intended to form the supporting pillar, which layer of interest then defines an empty internal space of the supporting pillar, the jut causing a local break in the continuity of the layer of interest, forming a lateral through-aperture in the supporting pillar; o depositing a sacrificial filling layer, so as to fill the empty internal space of the supporting pillar; o producing, on the second sacrificial layer (72.2) and the sacrificial filling layer, the detecting element (80; 60), which rests on and in contact with the supporting pillar; o suspending the detecting element (80; 60), by etching said sacrificial layers (72.1, 72.2, 73) and the intermediate pad using said etchant, the sacrificial filling layer then being etched through the lateral through-aperture. - a substrate comprising a readout circuit; - at least one thermal detector resting on the substrate, and connected to the readout circuit, comprising a detecting element (80; 60) suspended above the substrate by at least one supporting pillar; o depositing, on the substrate, a first sacrificial layer (72.1); o producing, on the first sacrificial layer (72.1), at least one intermediate pad intended to form a jut, the intermediate pad being made of at least one material sensitive to a chemical etchant used subsequently to etch sacrificial layers (71, 72.1, 72.2, 73); o depositing, on the first sacrificial layer (72.1) and the intermediate pad, a second sacrificial layer (72.2); o producing, by locally etching the first and second sacrificial layers (72.1, 72.2), at least one vertical orifice that is bounded transversely by a lateral border, said orifice being positioned so that a segment of the intermediate pad protrudes into the vertical orifice, thus forming a jut; o carrying out conformal deposition, on the lateral border of the vertical orifice, of a layer of interest that is intended to form the supporting pillar, which layer of interest then defines an empty internal space of the supporting pillar, the jut causing a local break in the continuity of the layer of interest, forming a lateral through-aperture in the supporting pillar; o depositing a sacrificial filling layer, so as to fill the empty internal space of the supporting pillar; o producing, on the second sacrificial layer (72.2) and the sacrificial filling layer, the detecting element (80; 60), which rests on and in contact with the supporting pillar; o suspending the detecting element (80; 60), by etching said sacrificial layers (72.1, 72.2, 73) and the intermediate pad using said etchant, the sacrificial filling layer then being etched through the lateral through-aperture.