An electronic device, comprising: a heat-generating structure including a substrate, an electronic component disposed on said substrate, and at least one electronic element disposed on said substrate and spaced apart from said electronic component; and a heat dissipation structure including: a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body, a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer, a blocking member that is disposed between said substrate and said anti-corrosion layer, that is connected to said substrate, and that surrounds said liquid metal layer and said electronic component, a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member, an insulation layer disposed between said substrate and said anti-corrosion layer, and a cushioning adhesive disposed between said blocking member and said anti-corrosion layer, characterized in that: said at least one electronic element is embedded in said substrate and is located below said insulation layer and said fixing adhesive; said insulation layer has an outer peripheral edge abutting against said blocking member, and an inner peripheral edge abutting against said fixing adhesive; and said cushioning adhesive is disposed and clamped between said blocking member and said anti-corrosion layer. a heat-generating structure including a substrate, an electronic component disposed on said substrate, and at least one electronic element disposed on said substrate and spaced apart from said electronic component; and a heat dissipation structure including: a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body, a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer, a blocking member that is disposed between said substrate and said anti-corrosion layer, that is connected to said substrate, and that surrounds said liquid metal layer and said electronic component, a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member, an insulation layer disposed between said substrate and said anti-corrosion layer, and a cushioning adhesive disposed between said blocking member and said anti-corrosion layer, a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body, a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer, a blocking member that is disposed between said substrate and said anti-corrosion layer, that is connected to said substrate, and that surrounds said liquid metal layer and said electronic component, a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member, an insulation layer disposed between said substrate and said anti-corrosion layer, and a cushioning adhesive disposed between said blocking member and said anti-corrosion layer, characterized in that: said at least one electronic element is embedded in said substrate and is located below said insulation layer and said fixing adhesive; said insulation layer has an outer peripheral edge abutting against said blocking member, and an inner peripheral edge abutting against said fixing adhesive; and said cushioning adhesive is disposed and clamped between said blocking member and said anti-corrosion layer. said at least one electronic element is embedded in said substrate and is located below said insulation layer and said fixing adhesive; said insulation layer has an outer peripheral edge abutting against said blocking member, and an inner peripheral edge abutting against said fixing adhesive; and said cushioning adhesive is disposed and clamped between said blocking member and said anti-corrosion layer.