An electromagnetic interference grounding protection method for a connector assembly using a multi-directional conductive housing with an over-molded silicone seal, the grounding protection method comprising the steps of: mounting said multi-directional conductive housing along with said over-molded silicone seal onto a metallic device by a bolt secured into a metallic compression limiter which is inside a side aperture of the conductive housing, passing a plurality of pads extending from a substantially flat bottom-end portion of a base portion of said multi-directional conductive housing through slits passing through a base of said silicone seal, wherein said pads contact the metallic device, the silicone seal being located between said multi-directional conductive housing and said metallic device, conducting said EMI generated by a source toward a metallic braided shield, said metallic braided shield being secured and mounted onto said multi-directional conductive housing by a metallic clamp; and conducting said EMI through: a first EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing, and thereafter conducting said EMI from said multi-directional conductive housing to said metallic compression limiter and to the bolt, and ultimately to the metallic device, and a second EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing; and thereafter conducting said EMI from said multi-directional conductive housing and through said pads, and ultimately to the metallic device. mounting said multi-directional conductive housing along with said over-molded silicone seal onto a metallic device by a bolt secured into a metallic compression limiter which is inside a side aperture of the conductive housing, passing a plurality of pads extending from a substantially flat bottom-end portion of a base portion of said multi-directional conductive housing through slits passing through a base of said silicone seal, wherein said pads contact the metallic device, the silicone seal being located between said multi-directional conductive housing and said metallic device, conducting said EMI generated by a source toward a metallic braided shield, said metallic braided shield being secured and mounted onto said multi-directional conductive housing by a metallic clamp; and conducting said EMI through: a first EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing, and thereafter conducting said EMI from said multi-directional conductive housing to said metallic compression limiter and to the bolt, and ultimately to the metallic device, and a second EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing; and thereafter conducting said EMI from said multi-directional conductive housing and through said pads, and ultimately to the metallic device. a first EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing, and thereafter conducting said EMI from said multi-directional conductive housing to said metallic compression limiter and to the bolt, and ultimately to the metallic device, and a second EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing; and thereafter conducting said EMI from said multi-directional conductive housing and through said pads, and ultimately to the metallic device.