A process for increasing the adhesion of a polymeric material to a copper alloy surface, wherein the copper alloy contains iron, the process comprising: a) contacting the copper alloy surface, wherein the copper alloy contains iron, with an adhesion promoting composition consisting of: 1) an oxidizer; 2) a mineral acid; 3) a corrosion inhibitor, wherein the corrosion inhibitor is selected from the group consisting of triazoles, benzotriazoles, imidazoles, benzimidazoles and combinations of one or more of the foregoing; 4) an organic phosphonate, wherein the organic phosphonate is selected from the group consisting of 1-hydroxy-1,1-ethylidene diphosphonate, amino tri (methylene-phosphonic acid), amino tri (methylene-phosphonic acid) pentasodium salt, 1-hydroxyethylene-1,1,-diphosphonic acid, 1-hydroxyethylene-1,1,-diphosphonic acid tetrasodium salt, ethylene diamine tetra(methylene phosphonic acid), ethylene diamine tetra(methylene phosphonic acid) pentasodium salt, hexamethylenediamine tetra(methylene phosphonic acid) potassium salt, diethylenetriamine penta(methylene phosphonic acid), diethylenetriamine penta (methylenephosphonic acid) trisodium salt, diethylenetriamine penta (methylenephosphonic acid) pentasodium salt, diethylenetriamine penta(methylene phosphonic acid) pentasodium salt; bis-hexamethylene triaminepenta(methylenephosphonic acid) chloride salt, 2-phosphonobutane-1,2,4-tricarboxylic acid, tetrasodium salt of 1-hydroxy ethyliden (1,1-diphosphonic acid) and combinations of one or more of the foregoing; 5) optionally, a source of halide ions; 6) optionally, adhesion enhancing species, which species are selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing; 7) optionally, a water soluble polymer; and 8) water; and thereafter b) bonding the polymeric material to the copper alloy surface. a) contacting the copper alloy surface, wherein the copper alloy contains iron, with an adhesion promoting composition consisting of: 1) an oxidizer; 2) a mineral acid; 3) a corrosion inhibitor, wherein the corrosion inhibitor is selected from the group consisting of triazoles, benzotriazoles, imidazoles, benzimidazoles and combinations of one or more of the foregoing; 4) an organic phosphonate, wherein the organic phosphonate is selected from the group consisting of 1-hydroxy-1,1-ethylidene diphosphonate, amino tri (methylene-phosphonic acid), amino tri (methylene-phosphonic acid) pentasodium salt, 1-hydroxyethylene-1,1,-diphosphonic acid, 1-hydroxyethylene-1,1,-diphosphonic acid tetrasodium salt, ethylene diamine tetra(methylene phosphonic acid), ethylene diamine tetra(methylene phosphonic acid) pentasodium salt, hexamethylenediamine tetra(methylene phosphonic acid) potassium salt, diethylenetriamine penta(methylene phosphonic acid), diethylenetriamine penta (methylenephosphonic acid) trisodium salt, diethylenetriamine penta (methylenephosphonic acid) pentasodium salt, diethylenetriamine penta(methylene phosphonic acid) pentasodium salt; bis-hexamethylene triaminepenta(methylenephosphonic acid) chloride salt, 2-phosphonobutane-1,2,4-tricarboxylic acid, tetrasodium salt of 1-hydroxy ethyliden (1,1-diphosphonic acid) and combinations of one or more of the foregoing; 5) optionally, a source of halide ions; 6) optionally, adhesion enhancing species, which species are selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing; 7) optionally, a water soluble polymer; and 8) water; and thereafter 1) an oxidizer; 2) a mineral acid; 3) a corrosion inhibitor, wherein the corrosion inhibitor is selected from the group consisting of triazoles, benzotriazoles, imidazoles, benzimidazoles and combinations of one or more of the foregoing; 4) an organic phosphonate, wherein the organic phosphonate is selected from the group consisting of 1-hydroxy-1,1-ethylidene diphosphonate, amino tri (methylene-phosphonic acid), amino tri (methylene-phosphonic acid) pentasodium salt, 1-hydroxyethylene-1,1,-diphosphonic acid, 1-hydroxyethylene-1,1,-diphosphonic acid tetrasodium salt, ethylene diamine tetra(methylene phosphonic acid), ethylene diamine tetra(methylene phosphonic acid) pentasodium salt, hexamethylenediamine tetra(methylene phosphonic acid) potassium salt, diethylenetriamine penta(methylene phosphonic acid), diethylenetriamine penta (methylenephosphonic acid) trisodium salt, diethylenetriamine penta (methylenephosphonic acid) pentasodium salt, diethylenetriamine penta(methylene phosphonic acid) pentasodium salt; bis-hexamethylene triaminepenta(methylenephosphonic acid) chloride salt, 2-phosphonobutane-1,2,4-tricarboxylic acid, tetrasodium salt of 1-hydroxy ethyliden (1,1-diphosphonic acid) and combinations of one or more of the foregoing; 5) optionally, a source of halide ions; 6) optionally, adhesion enhancing species, which species are selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing; 7) optionally, a water soluble polymer; and 8) water; b) bonding the polymeric material to the copper alloy surface.