An ultrasound imaging device, comprising: a flexible elongate member; and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member in a rolled form, the ultrasound scanner assembly including: a single and continuous semiconductor substrate having a thickness of 10 μm or less; a plurality of transistors of a control circuitry formed upon the semiconductor substrate in a control region; and a plurality of ultrasound transducers of a transducer array formed upon the semiconductor substrate in a transducer region, wherein the ultrasound transducers are electrically coupled to the control circuitry; wherein the ultrasound scanner assembly is configured to assume rolled form around a longitudinal axis of the flexible elongate member, and in the rolled form the semiconductor substrate is configured to be curved around the longitudinal axis of the flexible elongate member, assuming a substantially cylindrical form; wherein in the rolled form each of the plurality of transistors and the plurality of ultrasound transducers are arranged in cylindrical arrangement respectively; wherein, in rolled form each of the transducer region and the control region have circular cross-sectional shape respectively, transverse to the longitudinal axis of the flexible elongate member; wherein the transistors of the control circuitry are provided directly on the semiconductor substrate in a manner without being partitioned in separated dies and without gap space therebetween. a flexible elongate member; and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member in a rolled form, the ultrasound scanner assembly including: a single and continuous semiconductor substrate having a thickness of 10 μm or less; a plurality of transistors of a control circuitry formed upon the semiconductor substrate in a control region; and a plurality of ultrasound transducers of a transducer array formed upon the semiconductor substrate in a transducer region, wherein the ultrasound transducers are electrically coupled to the control circuitry; a single and continuous semiconductor substrate having a thickness of 10 μm or less; a plurality of transistors of a control circuitry formed upon the semiconductor substrate in a control region; and a plurality of ultrasound transducers of a transducer array formed upon the semiconductor substrate in a transducer region, wherein the ultrasound transducers are electrically coupled to the control circuitry; wherein the ultrasound scanner assembly is configured to assume rolled form around a longitudinal axis of the flexible elongate member, and in the rolled form the semiconductor substrate is configured to be curved around the longitudinal axis of the flexible elongate member, assuming a substantially cylindrical form; wherein in the rolled form each of the plurality of transistors and the plurality of ultrasound transducers are arranged in cylindrical arrangement respectively; wherein, in rolled form each of the transducer region and the control region have circular cross-sectional shape respectively, transverse to the longitudinal axis of the flexible elongate member; wherein the transistors of the control circuitry are provided directly on the semiconductor substrate in a manner without being partitioned in separated dies and without gap space therebetween.