A device for use in radio frequency communications, comprising: an integrated circuit package (102; 302), which comprises a radio frequency identification (RFID) chip that is adapted to receive and to modulate a radio frequency signal by being configured to include a frontend transmitter circuit that is directly, via a current path, connected to a first antenna structure but not to a second antenna structure; and a processing module that is configured and arranged to process data at a baseband and that is comprised in the IC package (102; 302); wherein the frontend transmitter circuit (a) is configured to communicate via RF signals received from the connected first antenna structure, (b) is configured and arranged to convert data between RF and the baseband, (c) is comprised in the IC package (102; 302), (d) is configured to decode data modulated in an RF carrier during receipt of data and that is configured to encode data by modulating the received RF carrier signal during transmission of data such that a backscattered RF signal can be decoded by a reader device; the device further comprising: - a substrate (104; 304) having: - a first short dipole antenna structure that is connected via the current path to the frontend transmitter circuit and is configured and arranged to backscatter a received RF signal to produce a first radiation pattern having nulls, - a set of connection pads (112, 114; RFN, RFP) configured and arranged to couple the RF signal from the first antenna structure to the frontend transmitter circuit of the RFID chip so as to form the current path, and - the second antenna structure that is (a) electromagnetically coupled to the first antenna structure, (b) is configured to run perpendicular to the first antenna structure and in close enough proximity to provide near-field antenna coupling so as to be configured and arranged to backscatter a received RF signal by electromagnetic coupling to the first antenna structure and so as to produce a second radiation pattern that complements the nulls in the first radiation pattern; the second antenna structure is further configured and arranged to provide a tamper detection by being configured as a continuous conductor between two connection pads (116, 118) so as to provide a current path along the second antenna structure, by connecting the IC package to both of the connection pads (116, 118), and by placing a protection label over the second antenna structure so that the continuous conductor is broken if the label is peeled off or manipulated, thereby configuring and arranging the current path to break in response to tampering with the device, and the IC package further comprises a tamper protection module that is comprised in the IC package (102; 302) and that is configured and arranged to detect physical tampering with the IC package (102; 302) by detecting a break in said current path (116-118; TP 1, TP2) provided by the second antenna structure. an integrated circuit package (102; 302), which comprises a radio frequency identification (RFID) chip that is adapted to receive and to modulate a radio frequency signal by being configured to include a frontend transmitter circuit that is directly, via a current path, connected to a first antenna structure but not to a second antenna structure; and a processing module that is configured and arranged to process data at a baseband and that is comprised in the IC package (102; 302); - a substrate (104; 304) having: - a first short dipole antenna structure that is connected via the current path to the frontend transmitter circuit and is configured and arranged to backscatter a received RF signal to produce a first radiation pattern having nulls, - a set of connection pads (112, 114; RFN, RFP) configured and arranged to couple the RF signal from the first antenna structure to the frontend transmitter circuit of the RFID chip so as to form the current path, and - the second antenna structure that is (a) electromagnetically coupled to the first antenna structure, (b) is configured to run perpendicular to the first antenna structure and in close enough proximity to provide near-field antenna coupling so as to be configured and arranged to backscatter a received RF signal by electromagnetic coupling to the first antenna structure and so as to produce a second radiation pattern that complements the nulls in the first radiation pattern;