A light emitting device package comprising: a body comprising a cavity with an opened topside, the body comprising a ceramic material; a heat dissipation member (150,151) between a bottom surface of the cavity and a lower surface of the body; a plurality of electrodes (121,123,125) on the bottom surface of the cavity; a plurality of pads (141,143,145) disposed on the lower surface of the body and electrically connected to at least one of the electrodes (121,123,125); a light emitting diode disposed on a first electrode of the electrodes (121,123,125) disposed on the bottom surface of the cavity, the light emitting diode being electrically connected to the electrodes (121,123,125); and a buffer layer (L1,101,103,104) disposed between the heat dissipation member (150,151) and at least one of the pads (141,143,145) and having a thickness thinner than a thickness of the heat dissipation member (150,151), wherein the body is formed of the ceramic material and is disposed around the heat dissipation member (150,151), the first electrode is disposed on the heat dissipation member (150,151) and is electrically connected to the light emitting diode, an area of a lower surface of the heat dissipation member (150,151) is smaller than an area of a top surface of one second pad of the plurality of pads, said second pad being disposed at a centre region of the lower surface of the body, and is greater than the top surface area of the heat dissipation member, the buffer layer (L1,101,103,104) has a width wider than the width of the lower surface of the heat dissipation member (150, 151), the buffer layer (L1,101,103,104) makes contact with the lower surface of the heat dissipation member (150,151) and a top surface of the second pad of the plurality of pads which connects to the first electrode, and a top surface of the buffer layer (L1,101,103,104) is rougher than a lower surface of the buffer layer (L1,101,103,104). a body comprising a cavity with an opened topside, the body comprising a ceramic material; a heat dissipation member (150,151) between a bottom surface of the cavity and a lower surface of the body; a plurality of electrodes (121,123,125) on the bottom surface of the cavity; a plurality of pads (141,143,145) disposed on the lower surface of the body and electrically connected to at least one of the electrodes (121,123,125); a light emitting diode disposed on a first electrode of the electrodes (121,123,125) disposed on the bottom surface of the cavity, the light emitting diode being electrically connected to the electrodes (121,123,125); and a buffer layer (L1,101,103,104) disposed between the heat dissipation member (150,151) and at least one of the pads (141,143,145) and having a thickness thinner than a thickness of the heat dissipation member (150,151), wherein the body is formed of the ceramic material and is disposed around the heat dissipation member (150,151), the first electrode is disposed on the heat dissipation member (150,151) and is electrically connected to the light emitting diode, an area of a lower surface of the heat dissipation member (150,151) is smaller than an area of a top surface of one second pad of the plurality of pads, said second pad being disposed at a centre region of the lower surface of the body, and is greater than the top surface area of the heat dissipation member, the buffer layer (L1,101,103,104) has a width wider than the width of the lower surface of the heat dissipation member (150, 151), the buffer layer (L1,101,103,104) makes contact with the lower surface of the heat dissipation member (150,151) and a top surface of the second pad of the plurality of pads which connects to the first electrode, and a top surface of the buffer layer (L1,101,103,104) is rougher than a lower surface of the buffer layer (L1,101,103,104).