A window pane comprising: a substrate formed from glass; an electrical conductor comprising silver and disposed across a region of said substrate; a solder joint disposed on said electrical conductor and comprising; bismuth and tin, wherein said solder joint is formed from a first solder composition comprising bismuth and tin, and from a second solder composition comprising tin, wherein said first solder composition of said solder joint comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition and tin in an amount of from 20 to 90 parts by weight based on 100 parts by weight of said first solder composition, and wherein said second solder composition of said solder joint comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition; a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone, wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone, and a plurality of bismuth-rich grains formed from bismuth and dispersed throughout at least said bismuth-rich solder bulk of said solder joint; and an electrical connector disposed on said solder joint with said electrical connector operatively connected to and in electrical communication with said electrical conductor through said solder joint. a substrate formed from glass; an electrical conductor comprising silver and disposed across a region of said substrate; a solder joint disposed on said electrical conductor and comprising; bismuth and tin, wherein said solder joint is formed from a first solder composition comprising bismuth and tin, and from a second solder composition comprising tin, wherein said first solder composition of said solder joint comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition and tin in an amount of from 20 to 90 parts by weight based on 100 parts by weight of said first solder composition, and wherein said second solder composition of said solder joint comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition; a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone, wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone, and a plurality of bismuth-rich grains formed from bismuth and dispersed throughout at least said bismuth-rich solder bulk of said solder joint; and bismuth and tin, wherein said solder joint is formed from a first solder composition comprising bismuth and tin, and from a second solder composition comprising tin, wherein said first solder composition of said solder joint comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition and tin in an amount of from 20 to 90 parts by weight based on 100 parts by weight of said first solder composition, and wherein said second solder composition of said solder joint comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition; a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone, wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone, and a plurality of bismuth-rich grains formed from bismuth and dispersed throughout at least said bismuth-rich solder bulk of said solder joint; and an electrical connector disposed on said solder joint with said electrical connector operatively connected to and in electrical communication with said electrical conductor through said solder joint.