An induction light ballast module for powering an induction lamp comprising: a printed circuit board including an upper layer partitioned into an earth ground region and a printed circuit board ground region, wherein the earth ground region is electrically isolated from the printed circuit board ground region; a heat sink disposed on an opposing lower layer of the printed circuit board and electrically connected to the earth ground region of the printed circuit board, the heat sink dimensioned to extend beyond at least one outer edge of the printed circuit board; an alternating current receiving connector and an EMI filter disposed on the earth ground region of the printed circuit board; an elongate capacitive shield sandwiched by a lower insulating pad (140, 142) and an upper insulating pad (140, 142) provided on the outwardly opposing faces of the capacitive shield, wherein the capacitive shield and the upper and lower insulating pads (140, 142) are disposed across a length of the heat sink adjacent the at least one edge of the printed circuit board, wherein the capacitive shield is electrically isolated from the heat sink by the lower insulating pad (140, 142); a damping network electrically connecting the capacitive shield to the printed circuit board ground region; a rectifier connected to the EMI filter, wherein the rectifier is disposed on the upper insulating pad (140, 142) adjacent the capacitive shield and electrically isolated from the capacitive shield and the heat sink; a power factor correction circuit connected to the rectifier and disposed on the printed circuit board ground region, and including switch-mode power converters disposed on the upper insulating pad (140, 142) adjacent the capacitive shield and electrically isolated from the capacitive shield and the heat sink; and an output power inverter circuit connected to the switch-mode power converter, the output power inverter circuit being disposed on the printed circuit board ground region and including switch-mode power converters disposed on the upper insulating pad (140, 142) adjacent the capacitive shield and electrically isolated from the capacitive shield and the heat sink, wherein a parasitic capacitance occurs between the printed circuit board ground region and the heat sink, and wherein the capacitive shield and the damping network provide common mode noise suppression. a printed circuit board including an upper layer partitioned into an earth ground region and a printed circuit board ground region, wherein the earth ground region is electrically isolated from the printed circuit board ground region; a heat sink disposed on an opposing lower layer of the printed circuit board and electrically connected to the earth ground region of the printed circuit board, the heat sink dimensioned to extend beyond at least one outer edge of the printed circuit board; a heat sink disposed on an opposing lower layer of the printed circuit board and electrically connected to the earth ground region of the printed circuit board, the heat sink dimensioned to extend beyond at least one outer edge of the printed circuit board; an alternating current receiving connector and an EMI filter disposed on the earth ground region of the printed circuit board; an elongate capacitive shield sandwiched by a lower insulating pad (140, 142) and an upper insulating pad (140, 142) provided on the outwardly opposing faces of the capacitive shield, wherein the capacitive shield and the upper and lower insulating pads (140, 142) are disposed across a length of the heat sink adjacent the at least one edge of the printed circuit board, wherein the capacitive shield is electrically isolated from the heat sink by the lower insulating pad (140, 142); a damping network electrically connecting the capacitive shield to the printed circuit board ground region; a rectifier connected to the EMI filter, wherein the rectifier is disposed on the upper insulating pad (140, 142) adjacent the capacitive shield and electrically isolated from the capacitive shield and the heat sink; a power factor correction circuit connected to the rectifier and disposed on the printed circuit board ground region, and including switch-mode power converters disposed on the upper insulating pad (140, 142) adjacent the capacitive shield and electrically isolated from the capacitive shield and the heat sink; and an output power inverter circuit connected to the switch-mode power converter, the output power inverter circuit being disposed on the printed circuit board ground region and including switch-mode power converters disposed on the upper insulating pad (140, 142) adjacent the capacitive shield and electrically isolated from the capacitive shield and the heat sink, wherein a parasitic capacitance occurs between the printed circuit board ground region and the heat sink, and wherein the capacitive shield and the damping network provide common mode noise suppression.