A chip packaging structure (2000, 2000A, 2000B, 2000C, 2000D, 2000E, 2000G, 2000H, 4000), comprising: a first antenna (21, 41); a radio frequency identification chip (22, 42) electrically connected to the first antenna (21, 41); a packaging member (23, 43) encapsulating the first antenna (21, 41) and the radio frequency identification chip (22, 42), wherein the packaging member (23, 43) has a top surface, a bottom surface, and a plurality of lateral surfaces (233, 234, 235, 236); the top surface is opposite to the bottom surface, and the lateral surfaces (233, 234, 235, 236) all connect the top surface and the bottom surface; the top surface, the bottom surface, and the lateral surfaces (233, 234, 235, 236) substantially form a hexahedron; and a second antenna (24, 24A, 24B, 24C, 24D, 24E, 24F, 24G, 24H, 44), which comprises a first extension portion (241, 241A, 241B, 241C, 241D, 241E, 241F, 241G, 241H, 441), a second extension portion (242, 242A, 242B, 242C, 242D, 242E, 242F, 242G, 242H, 442), and a winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443), wherein the first extension portion (241, 241A, 241B, 241C, 241D, 241E, 241F, 241G, 241H, 441) is linked to the winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443), the second extension portion (242, 242A, 242B, 242C, 242D, 242E, 242F, 242G, 242H, 442) is linked to the winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443), and the winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443) winds around the lateral surfaces (233, 234, 235, 236) of the packaging member (23, 43); wherein a junction of each two adjacent ones of the lateral surfaces (233, 234, 235, 236) is defined as a corner portion (C1, C2, C3, C4); the first extension portion (241, 241A, 241B, 241C, 241D, 241E, 241F, 241G, 241H, 441) and the second extension portion (242, 242A, 242B, 242C, 242D, 242E, 242F, 242G, 242H, 442) respectively leave the packaging member (23, 43) from one of the corner portions (C1, C2, C3, C4); characterized in that the chip packaging structure further comprises an adhesive (25A, 25B, 25C, 25D, 25E, 25F), which is adapted to adhere the winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443) of the second antenna (24, 24A, 24B, 24C, 24D, 24E, 24F, 24G, 24H, 44) to the packaging member (23, 43), wherein the adhesive (25A, 25B, 25C, 25D, 25E, 25F) covers at least a part of one of the lateral surfaces (233, 234, 235, 236) and at least one of the corner portions (C1, C2, C3, C4). a first antenna (21, 41); a radio frequency identification chip (22, 42) electrically connected to the first antenna (21, 41); a packaging member (23, 43) encapsulating the first antenna (21, 41) and the radio frequency identification chip (22, 42), wherein the packaging member (23, 43) has a top surface, a bottom surface, and a plurality of lateral surfaces (233, 234, 235, 236); the top surface is opposite to the bottom surface, and the lateral surfaces (233, 234, 235, 236) all connect the top surface and the bottom surface; the top surface, the bottom surface, and the lateral surfaces (233, 234, 235, 236) substantially form a hexahedron; and a second antenna (24, 24A, 24B, 24C, 24D, 24E, 24F, 24G, 24H, 44), which comprises a first extension portion (241, 241A, 241B, 241C, 241D, 241E, 241F, 241G, 241H, 441), a second extension portion (242, 242A, 242B, 242C, 242D, 242E, 242F, 242G, 242H, 442), and a winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443), wherein the first extension portion (241, 241A, 241B, 241C, 241D, 241E, 241F, 241G, 241H, 441) is linked to the winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443), the second extension portion (242, 242A, 242B, 242C, 242D, 242E, 242F, 242G, 242H, 442) is linked to the winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443), and the winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443) winds around the lateral surfaces (233, 234, 235, 236) of the packaging member (23, 43); wherein a junction of each two adjacent ones of the lateral surfaces (233, 234, 235, 236) is defined as a corner portion (C1, C2, C3, C4); the first extension portion (241, 241A, 241B, 241C, 241D, 241E, 241F, 241G, 241H, 441) and the second extension portion (242, 242A, 242B, 242C, 242D, 242E, 242F, 242G, 242H, 442) respectively leave the packaging member (23, 43) from one of the corner portions (C1, C2, C3, C4); characterized in that the chip packaging structure further comprises an adhesive (25A, 25B, 25C, 25D, 25E, 25F), which is adapted to adhere the winding portion (243, 243A, 243B, 243C, 243D, 243E, 243F, 243G, 243H, 443) of the second antenna (24, 24A, 24B, 24C, 24D, 24E, 24F, 24G, 24H, 44) to the packaging member (23, 43), wherein the adhesive (25A, 25B, 25C, 25D, 25E, 25F) covers at least a part of one of the lateral surfaces (233, 234, 235, 236) and at least one of the corner portions (C1, C2, C3, C4).