A sputtering apparatus comprising: a cylindrical rotatable sputtering target; at least one endblock (3;4) for supporting an end of the cylindrical rotatable sputtering target, the endblock (3;4) including a fixed conductive collector and a rotatable conductive rotor arranged to rotate with the cylindrical sputtering target during sputtering operations; the endblock (3;4) further including an electrical power transfer structure located between the fixed conductive collector and the rotatable rotor and arranged to transfer electrical power from the collector to the rotor; wherein the electrical power transfer structure, the rotor, and the collector are each located in an area under vacuum having pressure less than atmospheric pressure during sputtering operations; a first cooling area arranged such that liquid flows through said first cooling area for cooling the fixed conductive collector, the first cooling area being located around at least a portion of the fixed conductive collector and being substantially concentric with the fixed conductive collector; wherein the first cooling area is further arranged such that the liquid in the first cooling area flows around an axis about which the target and rotor are to rotate; and a second cooling area, separate from the first cooling area, arranged such that liquid flows through said second cooling area for cooling the rotor and target, the second cooling area being at least partially surrounded by the rotor, and wherein the second cooling area is further arranged such that the liquid in the second cooling area flows in at least a direction that is substantially parallel to the axis about which the target and rotor are to rotate. a cylindrical rotatable sputtering target; at least one endblock (3;4) for supporting an end of the cylindrical rotatable sputtering target, the endblock (3;4) including a fixed conductive collector and a rotatable conductive rotor arranged to rotate with the cylindrical sputtering target during sputtering operations; the endblock (3;4) further including an electrical power transfer structure located between the fixed conductive collector and the rotatable rotor and arranged to transfer electrical power from the collector to the rotor; wherein the electrical power transfer structure, the rotor, and the collector are each located in an area under vacuum having pressure less than atmospheric pressure during sputtering operations; a first cooling area arranged such that liquid flows through said first cooling area for cooling the fixed conductive collector, the first cooling area being located around at least a portion of the fixed conductive collector and being substantially concentric with the fixed conductive collector; wherein the first cooling area is further arranged such that the liquid in the first cooling area flows around an axis about which the target and rotor are to rotate; and a second cooling area, separate from the first cooling area, arranged such that liquid flows through said second cooling area for cooling the rotor and target, the second cooling area being at least partially surrounded by the rotor, and wherein the second cooling area is further arranged such that the liquid in the second cooling area flows in at least a direction that is substantially parallel to the axis about which the target and rotor are to rotate.