A transient electronic device comprising: an integrated circuit, IC, die including a semiconductor substrate having an electronic circuit formed thereon, and IC contact pads disposed in a first pattern on a surface of the semiconductor substrate, said IC contact pads being operably coupled to said electronic circuit; a package structure including a package substrate, a plurality of first package contact structures disposed in a second pattern on a first surface thereof, a plurality of second package contact structures disposed on a second surface thereof, and a plurality of package conductors extending through the package structure between the first and second surfaces such that each said package conductor forms an electrical path between an associated first package contact structure and an associated second package contact structure; an interposer comprising a glass substrate including a plurality of first contact points disposed in the first pattern on a first surface thereof, a plurality of second contact points disposed on a second surface thereof, said glass substrate defines a plurality of through-glass vias extending between the first surface and the second surface thereof, and a plurality of interposer conductors (117, 118), each said interposer conductor being configured to form an electrical path between an associated first contact point and an associated second contact point, each said electrical path being provided by a metal via structure formed in a respective through-glass via; and a trigger device attached to the interposer and configured to generate and apply an initial fracture force on said glass substrate in response to an externally supplied trigger signal, the trigger device comprising an actuating mechanism configured to control release of said initial fracture force in response to said trigger signal, wherein the interposer is secured to the package substrate such that each of the second contact points disposed on the second surface are electrically connected to corresponding first package contact structures, wherein the glass substrate contains an amount of ions such that secondary fractures (F p) are generated in said glass substrate in response to said initial fracture force and propagate throughout said glass substrate, whereby said glass substrate is powderized, and wherein the IC die is fixedly attached to the glass substrate such that the secondary fractures propagate into said IC die with sufficient energy to powderize said IC die. an integrated circuit, IC, die including a semiconductor substrate having an electronic circuit formed thereon, and IC contact pads disposed in a first pattern on a surface of the semiconductor substrate, said IC contact pads being operably coupled to said electronic circuit; a package structure including a package substrate, a plurality of first package contact structures disposed in a second pattern on a first surface thereof, a plurality of second package contact structures disposed on a second surface thereof, and a plurality of package conductors extending through the package structure between the first and second surfaces such that each said package conductor forms an electrical path between an associated first package contact structure and an associated second package contact structure; an interposer comprising a glass substrate including a plurality of first contact points disposed in the first pattern on a first surface thereof, a plurality of second contact points disposed on a second surface thereof, said glass substrate defines a plurality of through-glass vias extending between the first surface and the second surface thereof, and a plurality of interposer conductors (117, 118), each said interposer conductor being configured to form an electrical path between an associated first contact point and an associated second contact point, each said electrical path being provided by a metal via structure formed in a respective through-glass via; and a trigger device attached to the interposer and configured to generate and apply an initial fracture force on said glass substrate in response to an externally supplied trigger signal, the trigger device comprising an actuating mechanism configured to control release of said initial fracture force in response to said trigger signal, wherein the interposer is secured to the package substrate such that each of the second contact points disposed on the second surface are electrically connected to corresponding first package contact structures, wherein the glass substrate contains an amount of ions such that secondary fractures (F p) are generated in said glass substrate in response to said initial fracture force and propagate throughout said glass substrate, whereby said glass substrate is powderized, and wherein the IC die is fixedly attached to the glass substrate such that the secondary fractures propagate into said IC die with sufficient energy to powderize said IC die.