An illuminating partition comprising - at least one glass module or glazing unit, - diodes disposed on at least one support device of the PCB type, the PCB or PCBs potentially being on or accommodated in a receiving profiled member, the diodes being disposed facing the edge face of the glazing unit, - at least one lower mounting profiled member and one upper mounting profiled member, each mounting profiled member comprising a central section (20, 90), a first lateral section (21, 91) perpendicular to the central section, and a second lateral section (22, 92) perpendicular to the central section, parallel to and spaced from the first lateral section, and the mounting profiled member bounding an internal volume, characterized in that - the partition comprises at least one carrier element distinct from any element accommodating the diodes, notably distinct from the PCBs or from the receiving profiled member for the PCBs, said carrier element being arranged in the internal volume of the lower and/or upper mounting profiled member, and comprising means of support such as a platen which is at a distance from the central section of the mounting profiled member and situated between the edge face of the glazing unit and the diodes, - the platen of the carrier element is associated with the first lateral section (21, 91) of the profiled member and has a free edge facing the second lateral section (22, 92) of the profiled member, - at the bottom of the partition, the platen supports the glazing unit directly or potentially via a transparent wedge positioned underneath, - and/or at the top, the PCB or PCBs and/or the receiving profiled member for the PCB or PCBs are sitting on the platen, - the PCB or PCBs with the diodes are dissociable from the partition, - the second lateral section (22, 92) of the lower and upper profiled members is mobile or removable. - at least one glass module or glazing unit, - diodes disposed on at least one support device of the PCB type, the PCB or PCBs potentially being on or accommodated in a receiving profiled member, the diodes being disposed facing the edge face of the glazing unit, - at least one lower mounting profiled member and one upper mounting profiled member, each mounting profiled member comprising a central section (20, 90), a first lateral section (21, 91) perpendicular to the central section, and a second lateral section (22, 92) perpendicular to the central section, parallel to and spaced from the first lateral section, and the mounting profiled member bounding an internal volume, - the partition comprises at least one carrier element distinct from any element accommodating the diodes, notably distinct from the PCBs or from the receiving profiled member for the PCBs, said carrier element being arranged in the internal volume of the lower and/or upper mounting profiled member, and comprising means of support such as a platen which is at a distance from the central section of the mounting profiled member and situated between the edge face of the glazing unit and the diodes, - the platen of the carrier element is associated with the first lateral section (21, 91) of the profiled member and has a free edge facing the second lateral section (22, 92) of the profiled member, - at the bottom of the partition, the platen supports the glazing unit directly or potentially via a transparent wedge positioned underneath, - and/or at the top, the PCB or PCBs and/or the receiving profiled member for the PCB or PCBs are sitting on the platen, - the PCB or PCBs with the diodes are dissociable from the partition, - the second lateral section (22, 92) of the lower and upper profiled members is mobile or removable.