A contact capable of electrically connecting a first surface and a second surface that is disposed perpendicular to the first surface, the contact comprising: a base portion including a bonding surface configured to be soldered to the first surface; and an elastic contact portion configured to elastically deform to come into pressed contact with the second surface, wherein the elastic contact portion includes: a planar portion configured to be in a planar shape; and characterized in that: the elastic contact portion includes a projection portion that is disposed on one surface of the planar portion and protrudes from the one surface, and wherein the elastic contact portion is configured to come into pressed contact with the second surface at the projection portion, the projection portion is configured such that a dimensional ratio H/L of height H and length L satisfies 0.25 ≤ H/L ≤ 0.44, where H is a dimension in a direction perpendicular to the one surface and L is a dimension in a direction parallel to the one surface, the projection portion is configured such that the height H satisfies 0.089 mm ≤ H ≤ 0.296 mm and the length L satisfies 0.226 mm ≤ L ≤ 0.788 mm, and after a processing in which temperature periodically changes between -40°C and 125°C is performed for 167 cycles by a heat cycle test, a measured DC resistance value is 30 mQ or less. a base portion including a bonding surface configured to be soldered to the first surface; and an elastic contact portion configured to elastically deform to come into pressed contact with the second surface, wherein the elastic contact portion includes: a planar portion configured to be in a planar shape; and characterized in that: the elastic contact portion includes a projection portion that is disposed on one surface of the planar portion and protrudes from the one surface, and wherein the elastic contact portion is configured to come into pressed contact with the second surface at the projection portion, the projection portion is configured such that a dimensional ratio H/L of height H and length L satisfies 0.25 ≤ H/L ≤ 0.44, where H is a dimension in a direction perpendicular to the one surface and L is a dimension in a direction parallel to the one surface, the projection portion is configured such that the height H satisfies 0.089 mm ≤ H ≤ 0.296 mm and the length L satisfies 0.226 mm ≤ L ≤ 0.788 mm, and after a processing in which temperature periodically changes between -40°C and 125°C is performed for 167 cycles by a heat cycle test, a measured DC resistance value is 30 mQ or less. a planar portion configured to be in a planar shape; and characterized in that: the elastic contact portion includes a projection portion that is disposed on one surface of the planar portion and protrudes from the one surface, and wherein the elastic contact portion is configured to come into pressed contact with the second surface at the projection portion, the projection portion is configured such that a dimensional ratio H/L of height H and length L satisfies 0.25 ≤ H/L ≤ 0.44, where H is a dimension in a direction perpendicular to the one surface and L is a dimension in a direction parallel to the one surface, the projection portion is configured such that the height H satisfies 0.089 mm ≤ H ≤ 0.296 mm and the length L satisfies 0.226 mm ≤ L ≤ 0.788 mm, and after a processing in which temperature periodically changes between -40°C and 125°C is performed for 167 cycles by a heat cycle test, a measured DC resistance value is 30 mQ or less. the elastic contact portion includes a projection portion that is disposed on one surface of the planar portion and protrudes from the one surface, and wherein the elastic contact portion is configured to come into pressed contact with the second surface at the projection portion, the projection portion is configured such that a dimensional ratio H/L of height H and length L satisfies 0.25 ≤ H/L ≤ 0.44, where H is a dimension in a direction perpendicular to the one surface and L is a dimension in a direction parallel to the one surface, the projection portion is configured such that the height H satisfies 0.089 mm ≤ H ≤ 0.296 mm and the length L satisfies 0.226 mm ≤ L ≤ 0.788 mm, and after a processing in which temperature periodically changes between -40°C and 125°C is performed for 167 cycles by a heat cycle test, a measured DC resistance value is 30 mQ or less.