An electronic component, comprising: a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface; at least one I/O contact located on the first surface of the electronic device; a first metal layer disposed on the I/O contact; a removable thermoplastic layer disposed between the first surface of the electronic device and the second surface of the base insulative layer, wherein the removable thermoplastic layer partially covers the first surface of the electronic device, with the at least one I/O contact, the first metal layer and additional areas on the electronic device in addition to the at least one I/O contact being uncovered by the thermoplastic layer; a thermoset adhesive layer having a first side and an opposing second side, the first side disposed to face the second surface of the base insulative layer and the second side disposed to face both the first metal layer and removable thermoplastic layer, wherein the first side of the thermoset adhesive layer is adhered to the second surface of the base insulative layer, with those areas on the second surface corresponding to said additional areas areas on the electronic device being left uncoated by the adhesive layer, and wherein the second side of the thermoset adhesive layer is adhered onto the removable thermoplastic layer and the metal layer; wherein the base insulative layer secures to the electronic device through the first metal layer and removable layer, and the first metal layer and removable thermoplastic layer are capable of releasing the base insulative layer from the electronic device when exposed to a temperature which softens or melts the first metal layer and the removable thermoplastic layer. a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface; at least one I/O contact located on the first surface of the electronic device; a first metal layer disposed on the I/O contact; a removable thermoplastic layer disposed between the first surface of the electronic device and the second surface of the base insulative layer, wherein the removable thermoplastic layer partially covers the first surface of the electronic device, with the at least one I/O contact, the first metal layer and additional areas on the electronic device in addition to the at least one I/O contact being uncovered by the thermoplastic layer; a thermoset adhesive layer having a first side and an opposing second side, the first side disposed to face the second surface of the base insulative layer and the second side disposed to face both the first metal layer and removable thermoplastic layer, wherein the first side of the thermoset adhesive layer is adhered to the second surface of the base insulative layer, with those areas on the second surface corresponding to said additional areas areas on the electronic device being left uncoated by the adhesive layer, and wherein the second side of the thermoset adhesive layer is adhered onto the removable thermoplastic layer and the metal layer; wherein the base insulative layer secures to the electronic device through the first metal layer and removable layer, and the first metal layer and removable thermoplastic layer are capable of releasing the base insulative layer from the electronic device when exposed to a temperature which softens or melts the first metal layer and the removable thermoplastic layer.