An electronic component assembly structure comprising: • an electronic component package body, wherein the electronic component package body comprises a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin comprises a first part and a second part connected to the first part, the first part is embedded in the substrate, and the second part protrudes from the substrate; the second part comprises a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate; • a circuit board, wherein the electronic component package body is mounted on the circuit board, and the circuit board is electrically connected to the electronic component, ∘ wherein a side that is of the substrate and that is away from the circuit board comprises a first pad and a second pad, and the first pad and the second pad are disposed at intervals; the electronic component assembly structure further comprises a bonding wire, and the bonding wire is electrically connected between the first pad and the second pad, ∘ wherein the electronic component package body further comprises a package body, the package body is located on the side that is of the substrate and that is away from the circuit board, the bonding wire is packaged inside the package body, and the package body uses a magnetic material; and • a solder joint, wherein the solder joint is connected between the pin and the circuit board and surrounds the bottom surface and the side surface of the second part. • an electronic component package body, wherein the electronic component package body comprises a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin comprises a first part and a second part connected to the first part, the first part is embedded in the substrate, and the second part protrudes from the substrate; the second part comprises a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate; • a circuit board, wherein the electronic component package body is mounted on the circuit board, and the circuit board is electrically connected to the electronic component, ∘ wherein a side that is of the substrate and that is away from the circuit board comprises a first pad and a second pad, and the first pad and the second pad are disposed at intervals; the electronic component assembly structure further comprises a bonding wire, and the bonding wire is electrically connected between the first pad and the second pad, ∘ wherein the electronic component package body further comprises a package body, the package body is located on the side that is of the substrate and that is away from the circuit board, the bonding wire is packaged inside the package body, and the package body uses a magnetic material; and ∘ wherein a side that is of the substrate and that is away from the circuit board comprises a first pad and a second pad, and the first pad and the second pad are disposed at intervals; the electronic component assembly structure further comprises a bonding wire, and the bonding wire is electrically connected between the first pad and the second pad, ∘ wherein the electronic component package body further comprises a package body, the package body is located on the side that is of the substrate and that is away from the circuit board, the bonding wire is packaged inside the package body, and the package body uses a magnetic material; and • a solder joint, wherein the solder joint is connected between the pin and the circuit board and surrounds the bottom surface and the side surface of the second part.