An adhesive film for encapsulating an organic electronic device, comprising: a curable hot-melt adhesive layer including a curable resin having a water vapor transmission rate (WVTR) of 50 g/m 2 ·day or less when measured in a cured state and a moisture absorbent, wherein the curable hot-melt adhesive layer comprises a first region layer; and a second region layer, and the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer, wherein the moisture absorbent is a moisture-reactive absorbent, a physical absorbent, or a mixture thereof, wherein the moisture-reactive absorbent is a metal oxide, a metal salt, phosphorous pentoxide (P 2 O 5), or a mixture thereof, wherein the metal oxide is at least one selected from the group consisting of Li 2 O, Na 2 O, BaO, CaO and MgO, and the metal salt is at least one selected from the group consisting of Li 2 SO 4, Na 2 SO 4, CaSO 4, MgSO 4, CoSO 4, Ga 2 (SO 4) 3, Ti(SO 4) 2, NiSO 4, CaCl 2, MgCl 2, SrCl 2, YCl 3, CuCl 2, CsF, TaF 5, NbF 5, LiBr, CaBr 2, CeBr 3, SeBr 4, VBr 3, MgBr 2, Bal 2, Mgl 2, Ba(ClO 4) 2 and Mg(ClO 4) 2, wherein the physical absorbent is selected from the group consisting of silica, zeolite, zirconia, and montmorillonite, wherein the WVTR refers to a WVTR of a cured product which is measured according to the ASTM F1249 standard at 38 °C and 100% relative humidity (R.H.) in a transverse direction when the cured product is formed by curing a curable resin and then processed into a film having a thickness of 80 μm, and wherein the curable resin is a silane-modified epoxy resin.. a curable hot-melt adhesive layer including a curable resin having a water vapor transmission rate (WVTR) of 50 g/m 2 ·day or less when measured in a cured state and a moisture absorbent, wherein the curable hot-melt adhesive layer comprises a first region layer; and a second region layer, and the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer, wherein the moisture absorbent is a moisture-reactive absorbent, a physical absorbent, or a mixture thereof, wherein the moisture-reactive absorbent is a metal oxide, a metal salt, phosphorous pentoxide (P 2 O 5), or a mixture thereof, wherein the metal oxide is at least one selected from the group consisting of Li 2 O, Na 2 O, BaO, CaO and MgO, and the metal salt is at least one selected from the group consisting of Li 2 SO 4, Na 2 SO 4, CaSO 4, MgSO 4, CoSO 4, Ga 2 (SO 4) 3, Ti(SO 4) 2, NiSO 4, CaCl 2, MgCl 2, SrCl 2, YCl 3, CuCl 2, CsF, TaF 5, NbF 5, LiBr, CaBr 2, CeBr 3, SeBr 4, VBr 3, MgBr 2, Bal 2, Mgl 2, Ba(ClO 4) 2 and Mg(ClO 4) 2, wherein the physical absorbent is selected from the group consisting of silica, zeolite, zirconia, and montmorillonite, wherein the WVTR refers to a WVTR of a cured product which is measured according to the ASTM F1249 standard at 38 °C and 100% relative humidity (R.H.) in a transverse direction when the cured product is formed by curing a curable resin and then processed into a film having a thickness of 80 μm, and wherein the curable resin is a silane-modified epoxy resin..