An ink composition comprising a P-type semiconductor material, an N-type semiconductor material and two or more solvents including a first solvent and a second solvent, wherein the total amount of the first solvent and the second solvent is 70% by weight or more with respect to 100% by weight of all the solvents contained in the ink composition; the boiling point of the first solvent is lower than the boiling point of the second solvent; the boiling point of the first solvent is 120°C or more and 400°C or less; and the hydrogen bond Hansen solubility parameter H1 (MPa 0.5) of the first solvent and the hydrogen bond Hansen solubility parameter H2 (MPa 0.5) of the second solvent are in the relation of 0.5 ≤ (H2-H1) ≤ 5.0; the first solvent is an aromatic hydrocarbon solvent; the second solvent is an ether solvent, a ketone solvent or an ester solvent; the amount of the first solvent is the largest among all the solvents; and characterized in that the P-type semiconductor material is a polymer compound comprising a repeating unit represented by the following (I-1) and/or the following formula (II-1) to (II-4) or (II-6): wherein, Z represents a divalent group represented by (Z-1) to (Z-7), wherein, X 1 and X 2 each independently represent an oxygen atom or a sulfur atom, R represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a mono-valent heterocyclic group, a substituted amino group, an acyl group, an imine residue, a substituted amide group, an acid imide group, a substituted carboxyl group, an alkenyl group, an alkynyl group, a cyano group or a nitro group. the total amount of the first solvent and the second solvent is 70% by weight or more with respect to 100% by weight of all the solvents contained in the ink composition; the boiling point of the first solvent is lower than the boiling point of the second solvent; the boiling point of the first solvent is 120°C or more and 400°C or less; and the hydrogen bond Hansen solubility parameter H1 (MPa 0.5) of the first solvent and the hydrogen bond Hansen solubility parameter H2 (MPa 0.5) of the second solvent are in the relation of 0.5 ≤ (H2-H1) ≤ 5.0; the first solvent is an aromatic hydrocarbon solvent; the second solvent is an ether solvent, a ketone solvent or an ester solvent; the amount of the first solvent is the largest among all the solvents; and characterized in that the P-type semiconductor material is a polymer compound comprising a repeating unit represented by the following (I-1) and/or the following formula (II-1) to (II-4) or (II-6): wherein, Z represents a divalent group represented by (Z-1) to (Z-7), wherein, X 1 and X 2 each independently represent an oxygen atom or a sulfur atom, R represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a mono-valent heterocyclic group, a substituted amino group, an acyl group, an imine residue, a substituted amide group, an acid imide group, a substituted carboxyl group, an alkenyl group, an alkynyl group, a cyano group or a nitro group. X 1 and X 2 each independently represent an oxygen atom or a sulfur atom, R represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a mono-valent heterocyclic group, a substituted amino group, an acyl group, an imine residue, a substituted amide group, an acid imide group, a substituted carboxyl group, an alkenyl group, an alkynyl group, a cyano group or a nitro group.