Photonic component comprising a photonic integrated chip and a fibre mount, which is mechanically connected to the chip, wherein the fibre mount has: - at least one groove into which an optical fibre is inserted, and - at least one mirror surface which specularly reflects radiation of the fibre in the direction of the chip and/or radiation of the chip in the direction of the fibre, wherein - the chip has: - a substrate, the substrate base material of which is a semiconductor material, - an integrated optical waveguide, which is integrated in one or more waveguiding material layers of the chip, said one or more layers being situated on the substrate, and - a coupler, in particular grating coupler, which is embodied in the optical waveguide or is connected to the optical waveguide, and - the at least one groove is introduced into a substrate of the fibre mount, the substrate base material of said substrate corresponding to the substrate base material of the chip, characterized in that - the chip has an optical diffraction and refraction structure, which is integrated in one or more material layers of the chip, said one or more material layers being situated - as viewed from the substrate - above the optical coupler, and carries out beam shaping of the radiation prior to coupling into the waveguide or after coupling out of the waveguide, - the chip is connected to the fibre mount in such a way that the optical diffraction and refraction structure is located in the beam path between the coupler and the mirror surface, and - the optical diffraction and refraction structure has elevated rings embodied in each case in one or more material layers of the chip, said one or more material layers being situated above the optical grating coupler, - wherein the rings have different sizes and each ring encloses in each case all smaller rings in its ring interior, - wherein the rings are each elliptical and are arranged non-concentrically with respect to one another, and - wherein the ellipse centres of the elliptical rings are located on a section which is located - viewed in plan view - above the integrated optical waveguide and extends parallel to the longitudinal axis thereof and one section end of which is formed by the ellipse centre of the smallest ring and the other section end of which is formed by the ellipse centre of the largest ring. - at least one groove into which an optical fibre is inserted, and - at least one mirror surface which specularly reflects radiation of the fibre in the direction of the chip and/or radiation of the chip in the direction of the fibre, wherein - the chip has: - a substrate, the substrate base material of which is a semiconductor material, - an integrated optical waveguide, which is integrated in one or more waveguiding material layers of the chip, said one or more layers being situated on the substrate, and - a coupler, in particular grating coupler, which is embodied in the optical waveguide or is connected to the optical waveguide, and - a substrate, the substrate base material of which is a semiconductor material, - an integrated optical waveguide, which is integrated in one or more waveguiding material layers of the chip, said one or more layers being situated on the substrate, and - a coupler, in particular grating coupler, which is embodied in the optical waveguide or is connected to the optical waveguide, and - the at least one groove is introduced into a substrate of the fibre mount, the substrate base material of said substrate corresponding to the substrate base material of the chip, characterized in that - the chip has an optical diffraction and refraction structure, which is integrated in one or more material layers of the chip, said one or more material layers being situated - as viewed from the substrate - above the optical coupler, and carries out beam shaping of the radiation prior to coupling into the waveguide or after coupling out of the waveguide, - the chip is connected to the fibre mount in such a way that the optical diffraction and refraction structure is located in the beam path between the coupler and the mirror surface, and - the optical diffraction and refraction structure has elevated rings embodied in each case in one or more material layers of the chip, said one or more material layers being situated above the optical grating coupler, - wherein the rings have different sizes and each ring encloses in each case all smaller rings in its ring interior, - wherein the rings are each elliptical and are arranged non-concentrically with respect to one another, and - wherein the ellipse centres of the elliptical rings are located on a section which is located - viewed in plan view - above the integrated optical waveguide and extends parallel to the longitudinal axis thereof and one section end of which is formed by the ellipse centre of the smallest ring and the other section end of which is formed by the ellipse centre of the largest ring. - wherein the rings have different sizes and each ring encloses in each case all smaller rings in its ring interior, - wherein the rings are each elliptical and are arranged non-concentrically with respect to one another, and - wherein the ellipse centres of the elliptical rings are located on a section which is located - viewed in plan view - above the integrated optical waveguide and extends parallel to the longitudinal axis thereof and one section end of which is formed by the ellipse centre of the smallest ring and the other section end of which is formed by the ellipse centre of the largest ring.