A device for self-assembling semiconductor light-emitting diodes on a substrate, the device including: an assembly chamber for accommodating a fluid, a magnetic field forming part disposed above the assembly chamber and including a magnet array of a plurality of magnets, and characterised in that the device further includes a chip supply part disposed within the assembly chamber, the chip supply part comprising: a chip accommodating part for accommodating the semiconductor light-emitting diodes; a vertical moving part configured to move the chip accommodating part in a vertical direction between a first height and a second height; a horizontal moving part configured to move the chip accommodating part in a horizontal plane; and a controller configured to drive the vertical moving part and the horizontal moving part to control a position of the chip accommodating part in the assembly chamber; wherein the controller is configured to move the chip accommodating part along a predetermined path having a plurality of points, each denoting a horizontal position respectively facing one of the magnets; and wherein the second height is a height at which the semiconductor light-emitting diodes on the chip accommodating part are lifted from the chip accommodating part by the magnetic field of the magnets, and the first height is a height at which the semiconductor light-emitting diodes on the chip accommodating part are not moved by the magnetic field of the magnets. an assembly chamber for accommodating a fluid, a magnetic field forming part disposed above the assembly chamber and including a magnet array of a plurality of magnets, and characterised in that the device further includes a chip supply part disposed within the assembly chamber, the chip supply part comprising: a chip accommodating part for accommodating the semiconductor light-emitting diodes; a vertical moving part configured to move the chip accommodating part in a vertical direction between a first height and a second height; a horizontal moving part configured to move the chip accommodating part in a horizontal plane; and a controller configured to drive the vertical moving part and the horizontal moving part to control a position of the chip accommodating part in the assembly chamber; wherein the controller is configured to move the chip accommodating part along a predetermined path having a plurality of points, each denoting a horizontal position respectively facing one of the magnets; and wherein the second height is a height at which the semiconductor light-emitting diodes on the chip accommodating part are lifted from the chip accommodating part by the magnetic field of the magnets, and the first height is a height at which the semiconductor light-emitting diodes on the chip accommodating part are not moved by the magnetic field of the magnets. a chip accommodating part for accommodating the semiconductor light-emitting diodes; a vertical moving part configured to move the chip accommodating part in a vertical direction between a first height and a second height; a horizontal moving part configured to move the chip accommodating part in a horizontal plane; and a controller configured to drive the vertical moving part and the horizontal moving part to control a position of the chip accommodating part in the assembly chamber; wherein the controller is configured to move the chip accommodating part along a predetermined path having a plurality of points, each denoting a horizontal position respectively facing one of the magnets; and wherein the second height is a height at which the semiconductor light-emitting diodes on the chip accommodating part are lifted from the chip accommodating part by the magnetic field of the magnets, and the first height is a height at which the semiconductor light-emitting diodes on the chip accommodating part are not moved by the magnetic field of the magnets.