An electronic device comprising: a first printed circuit board, PCB, including a non-conductive region and a conductive region operating as a ground; a first wireless communication circuit disposed on the first PCB; and a 5th generation, 5G, antenna module disposed adjacent to the first PCB, wherein the 5G antenna module includes: at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array; and a second wireless communication circuit electrically connected to the antenna array, wherein the second PCB includes a first portion and a second portion having a predetermined angle with the first portion, wherein the first portion is disposed adjacent to the non-conductive region and at least part of the second portion is disposed adjacent to the conductive region, wherein the first wireless communication circuit is electrically connected to a first point of the conductive layer included in the first portion and configured to transmit or receive a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer, and wherein the second wireless communication circuit is configured to transmit or receive a second RF signal in a second frequency band by using the antenna array. a first printed circuit board, PCB, including a non-conductive region and a conductive region operating as a ground; a first wireless communication circuit disposed on the first PCB; and a 5th generation, 5G, antenna module disposed adjacent to the first PCB, wherein the 5G antenna module includes: at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array; and a second wireless communication circuit electrically connected to the antenna array, wherein the second PCB includes a first portion and a second portion having a predetermined angle with the first portion, wherein the first portion is disposed adjacent to the non-conductive region and at least part of the second portion is disposed adjacent to the conductive region, wherein the first wireless communication circuit is electrically connected to a first point of the conductive layer included in the first portion and configured to transmit or receive a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer, and wherein the second wireless communication circuit is configured to transmit or receive a second RF signal in a second frequency band by using the antenna array. at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array; and a second wireless communication circuit electrically connected to the antenna array, wherein the second PCB includes a first portion and a second portion having a predetermined angle with the first portion, wherein the first portion is disposed adjacent to the non-conductive region and at least part of the second portion is disposed adjacent to the conductive region, wherein the first wireless communication circuit is electrically connected to a first point of the conductive layer included in the first portion and configured to transmit or receive a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer, and wherein the second wireless communication circuit is configured to transmit or receive a second RF signal in a second frequency band by using the antenna array.