An electronic device comprising: a housing including: a frame structure configured to form a portion of a surface of the electronic device, a plate structure surrounded by the frame structure, the plate structure including a first opening or recess, and a metal portion containing a metallic material; a support plate; a printed circuit board;a camera module disposed in the first opening or recess; and a heat dissipating structure configured to transfer heat generated from the camera module to the metal portion included in the housing, wherein the heat dissipating structure includes a heat transfer member, characterized in that the support plate is configured to face the plate structure and includes a polymer area formed of a polymer material; the printed circuit board is disposed between the plate structure and the support plate and is configured to make contact with part of the metal portion of the housing; the housing further comprises a polymer portion containing a polymer material; the camera module disposed between a part of the polymer portion included in the plate structure of the housing and the polymer area included in the support plate, wherein the camera module includes a camera bracket disposed on the polymer area of the support plate, a camera PCB disposed on the camera bracket, a light emitting unit and a light receiving unit, wherein the light emitting unit and the light receiving unit are disposed on the camera PCB; and the heat transfer member is formed between the camera bracket and the polymer area of the support plate and extends between the printed circuit board and the support plate; wherein the heat dissipating structure is configured to form a heat transfer path that passes through the camera PCB, the heat transfer member, the printed circuit board, and the metal portion of the housing. a housing including: a frame structure configured to form a portion of a surface of the electronic device, a plate structure surrounded by the frame structure, the plate structure including a first opening or recess, and a metal portion containing a metallic material; a frame structure configured to form a portion of a surface of the electronic device, a plate structure surrounded by the frame structure, the plate structure including a first opening or recess, and a metal portion containing a metallic material; a support plate; a printed circuit board;a camera module disposed in the first opening or recess; and a heat dissipating structure configured to transfer heat generated from the camera module to the metal portion included in the housing, wherein the heat dissipating structure includes a heat transfer member, characterized in that the support plate is configured to face the plate structure and includes a polymer area formed of a polymer material; the printed circuit board is disposed between the plate structure and the support plate and is configured to make contact with part of the metal portion of the housing; the housing further comprises a polymer portion containing a polymer material; the camera module disposed between a part of the polymer portion included in the plate structure of the housing and the polymer area included in the support plate, wherein the camera module includes a camera bracket disposed on the polymer area of the support plate, a camera PCB disposed on the camera bracket, a light emitting unit and a light receiving unit, wherein the light emitting unit and the light receiving unit are disposed on the camera PCB; and the heat transfer member is formed between the camera bracket and the polymer area of the support plate and extends between the printed circuit board and the support plate; wherein the heat dissipating structure is configured to form a heat transfer path that passes through the camera PCB, the heat transfer member, the printed circuit board, and the metal portion of the housing.