Half-bridge for an electric drive of an electric vehicle or a hybrid vehicle, the half-bridge (110A-C) comprising a substrate, semiconductor switching elements, power connections (214, 216) and signal connections, the power connections (214, 216) comprising a positive DC power connection, a negative DC power connection and an AC power connection, wherein the signal connections are electrically connected to the semiconductor switching elements in such a way that the semiconductor switching elements are able to be switched by means of the signal connections, wherein the power connections (214, 216) are electrically connected to the semiconductor switching elements in such a way that the semiconductor switching elements permit or interrupt an electrical power transmission between the power connections (214, 216), wherein a respective busbar (224, 226) is provided for the positive DC power connection and for the negative DC power connection for the purpose of external contact-connection, said busbar being connected to the respective power connection (214, 216), wherein the busbar (224, 226) of the positive DC power connection and of the negative DC power connection extends along a direction parallel to a main plane of the substrate between a printed circuit board and the substrate, wherein the busbar (224, 226) has a top side and a bottom side, wherein the busbar (224, 226) of the positive DC power connection and/or of the negative DC power connection is at least partially covered with a current-insulating coating, wherein the current-insulating coating is fixed to the top side of the printed circuit board and is fixed to the bottom side of an inverter housing of the electric drive, wherein a screw connection is provided to fix the busbar (224, 226) of the positive DC power connection and/or of the negative DC power connection to the inverter housing, and a hot-swaged plastic dome is provided to connect the printed circuit board to the busbar (224, 226) of the positive DC power connection and/or of the negative DC power connection, wherein the hot-swaged plastic dome is a plastic dome that is designed to extend out of the current-insulating coating through an opening in the printed circuit board. wherein the signal connections are electrically connected to the semiconductor switching elements in such a way that the semiconductor switching elements are able to be switched by means of the signal connections, wherein the power connections (214, 216) are electrically connected to the semiconductor switching elements in such a way that the semiconductor switching elements permit or interrupt an electrical power transmission between the power connections (214, 216), wherein a respective busbar (224, 226) is provided for the positive DC power connection and for the negative DC power connection for the purpose of external contact-connection, said busbar being connected to the respective power connection (214, 216), wherein the busbar (224, 226) of the positive DC power connection and of the negative DC power connection extends along a direction parallel to a main plane of the substrate between a printed circuit board and the substrate, wherein the busbar (224, 226) has a top side and a bottom side, wherein the busbar (224, 226) of the positive DC power connection and/or of the negative DC power connection is at least partially covered with a current-insulating coating, wherein the current-insulating coating is fixed to the top side of the printed circuit board and is fixed to the bottom side of an inverter housing of the electric drive, wherein a screw connection is provided to fix the busbar (224, 226) of the positive DC power connection and/or of the negative DC power connection to the inverter housing, and a hot-swaged plastic dome is provided to connect the printed circuit board to the busbar (224, 226) of the positive DC power connection and/or of the negative DC power connection, wherein the hot-swaged plastic dome is a plastic dome that is designed to extend out of the current-insulating coating through an opening in the printed circuit board.