An apparatus comprising: a first frame configured to hold a wafer tape having a first side and a second side, a plurality of semiconductor device dies being disposed on the first side of the wafer tape; a second frame configured to hold a product substrate having a circuit trace thereon such that the circuit trace is disposed facing the plurality of semiconductor device dies on the wafer tape when held by the first frame; a needle disposed so as to be adjacent the second side of the wafer tape when held by the first frame, a length of the needle extending in a direction toward the wafer tape; a needle actuator connected to the needle to move the needle to a die transfer position at which the needle presses on the second side of the wafer tape when held by the first frame to press a semiconductor device die of the plurality of semiconductor device dies into contact with the circuit trace on the product substrate held by the second frame; characterised in that: the second frame includes a first clamping member and a second clamping member configured to clamp therebetween a product substrate having a circuit trace thereon; and a laser is provided pointing toward a portion of the product substrate when held by the second frame corresponding to the transfer position at which the semiconductor device die contacts the circuit trace to apply energy to the circuit trace to affix the semiconductor device die to the circuit trace; wherein the laser is positioned within the apparatus such that the energy from the laser may be applied directly on the product substrate during a transfer operation. a first frame configured to hold a wafer tape having a first side and a second side, a plurality of semiconductor device dies being disposed on the first side of the wafer tape; a second frame configured to hold a product substrate having a circuit trace thereon such that the circuit trace is disposed facing the plurality of semiconductor device dies on the wafer tape when held by the first frame; a needle disposed so as to be adjacent the second side of the wafer tape when held by the first frame, a length of the needle extending in a direction toward the wafer tape; a needle actuator connected to the needle to move the needle to a die transfer position at which the needle presses on the second side of the wafer tape when held by the first frame to press a semiconductor device die of the plurality of semiconductor device dies into contact with the circuit trace on the product substrate held by the second frame; characterised in that: the second frame includes a first clamping member and a second clamping member configured to clamp therebetween a product substrate having a circuit trace thereon; and a laser is provided pointing toward a portion of the product substrate when held by the second frame corresponding to the transfer position at which the semiconductor device die contacts the circuit trace to apply energy to the circuit trace to affix the semiconductor device die to the circuit trace; the second frame includes a first clamping member and a second clamping member configured to clamp therebetween a product substrate having a circuit trace thereon; and a laser is provided pointing toward a portion of the product substrate when held by the second frame corresponding to the transfer position at which the semiconductor device die contacts the circuit trace to apply energy to the circuit trace to affix the semiconductor device die to the circuit trace; wherein the laser is positioned within the apparatus such that the energy from the laser may be applied directly on the product substrate during a transfer operation.