A thick conductor built-in type printed wiring board comprising: a printed wiring board that includes an insulating layer and a circuit provided on one main surface or both main surfaces of the insulating layer, the insulating layer including a cured product of a first resin composition, the circuit including a plurality of conductor wirings each having a thickness ranging from 105 μm to 630 μm, inclusive; an insulating resin layer that covers a surface of the printed wiring board on which the circuit is provided, the insulating resin layer including a cured product of a second resin composition and no fibrous base material; an insulating base material layer that covers the insulating resin layer, the insulating base material layer including a cured product of a third resin composition and a fibrous base material; and a conductor layer that covers the insulating base material layer, wherein a void having a diameter of more than or equal to 10 μm is not included inside the thick conductor built-in type printed wiring board, characterized in that: the second resin composition has a minimum melt viscosity ranging from 1 × 10 2 Pa•s to 1 × 10 6 Pa•s, inclusive, the minimum melt viscosity being obtained at a first temperature ranging from 60°C to 130°C, inclusive, and the third resin composition has a minimum melt viscosity ranging from 1 × 10 2 Pa•s to 1 × 10 5 Pa•s, inclusive, the minimum melt viscosity being obtained at a second temperature of more than the first temperature at which the minimum melt viscosity of the second resin composition is obtained and less than or equal to 170°C. a printed wiring board that includes an insulating layer and a circuit provided on one main surface or both main surfaces of the insulating layer, the insulating layer including a cured product of a first resin composition, the circuit including a plurality of conductor wirings each having a thickness ranging from 105 μm to 630 μm, inclusive; an insulating resin layer that covers a surface of the printed wiring board on which the circuit is provided, the insulating resin layer including a cured product of a second resin composition and no fibrous base material; an insulating base material layer that covers the insulating resin layer, the insulating base material layer including a cured product of a third resin composition and a fibrous base material; and a conductor layer that covers the insulating base material layer, wherein a void having a diameter of more than or equal to 10 μm is not included inside the thick conductor built-in type printed wiring board, characterized in that: the second resin composition has a minimum melt viscosity ranging from 1 × 10 2 Pa•s to 1 × 10 6 Pa•s, inclusive, the minimum melt viscosity being obtained at a first temperature ranging from 60°C to 130°C, inclusive, and the third resin composition has a minimum melt viscosity ranging from 1 × 10 2 Pa•s to 1 × 10 5 Pa•s, inclusive, the minimum melt viscosity being obtained at a second temperature of more than the first temperature at which the minimum melt viscosity of the second resin composition is obtained and less than or equal to 170°C. the second resin composition has a minimum melt viscosity ranging from 1 × 10 2 Pa•s to 1 × 10 6 Pa•s, inclusive, the minimum melt viscosity being obtained at a first temperature ranging from 60°C to 130°C, inclusive, and the third resin composition has a minimum melt viscosity ranging from 1 × 10 2 Pa•s to 1 × 10 5 Pa•s, inclusive, the minimum melt viscosity being obtained at a second temperature of more than the first temperature at which the minimum melt viscosity of the second resin composition is obtained and less than or equal to 170°C.