A laminate having a resin film base material and an adhesive layer placed on one side of the resin film base material, wherein the adhesive layer comprises: an acid modified polypropylene-based resin; a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, an alkyl methacrylate, and an alkyl acrylate; and a flame retardant; wherein the adhesive layer contains a resin composition having a melt mass flow rate of 1 to 60 g/10 minutes as measured in accordance with JIS K 7210:1999 under the conditions of 190°C and 21.18 N; wherein the laminate satisfies the following conditions and: an adhesive strength between a test piece and a copper wire in a sample is 0.7 N/mm or more as measured in a 180-degree peeling test under a condition of a 100 mm/minute test rate, wherein the test piece, 50 mm in width and 150 mm in length, is cut out of the laminate such that the machine running direction of the laminate is the longitudinal direction of the test piece; a bare copper wire (annealed copper wire), 0.7 mm in conductor width and 0.035 mm in thickness, is placed on the adhesive layer of the test piece such that the longitudinal direction of the copper wire agrees with the longitudinal direction of the test piece; a pressing machine is used to sandwich the test piece with the copper wire placed thereon between a metal plate and a silicone rubber sheet each preheated to a temperature of 190°C, such that the copper wire side faces the silicone rubber sheet side; the resulting piece is pressed under the conditions of a 0.3 MPa pressure and a 8-second time to produce the sample; and the sample is treated for 1000 hours in a thermohygrostat set to a temperature of 85°C and a relative humidity of 85%; an adhesive strength between the test piece and the copper wire is 0.7 N/mm or more as measured in the same manner as in the above-mentioned, wherein the sample obtained in the same manner as in the above-mentioned is placed in a gear oven set to a temperature of 151°C and is treated for 168 hours. wherein the adhesive layer comprises: an acid modified polypropylene-based resin; a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, an alkyl methacrylate, and an alkyl acrylate; and a flame retardant; an acid modified polypropylene-based resin; a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, an alkyl methacrylate, and an alkyl acrylate; and a flame retardant; wherein the adhesive layer contains a resin composition having a melt mass flow rate of 1 to 60 g/10 minutes as measured in accordance with JIS K 7210:1999 under the conditions of 190°C and 21.18 N; wherein the laminate satisfies the following conditions and: an adhesive strength between a test piece and a copper wire in a sample is 0.7 N/mm or more as measured in a 180-degree peeling test under a condition of a 100 mm/minute test rate, wherein the test piece, 50 mm in width and 150 mm in length, is cut out of the laminate such that the machine running direction of the laminate is the longitudinal direction of the test piece; a bare copper wire (annealed copper wire), 0.7 mm in conductor width and 0.035 mm in thickness, is placed on the adhesive layer of the test piece such that the longitudinal direction of the copper wire agrees with the longitudinal direction of the test piece; a pressing machine is used to sandwich the test piece with the copper wire placed thereon between a metal plate and a silicone rubber sheet each preheated to a temperature of 190°C, such that the copper wire side faces the silicone rubber sheet side; the resulting piece is pressed under the conditions of a 0.3 MPa pressure and a 8-second time to produce the sample; and the sample is treated for 1000 hours in a thermohygrostat set to a temperature of 85°C and a relative humidity of 85%; an adhesive strength between the test piece and the copper wire is 0.7 N/mm or more as measured in the same manner as in the above-mentioned, wherein the sample obtained in the same manner as in the above-mentioned is placed in a gear oven set to a temperature of 151°C and is treated for 168 hours. an adhesive strength between a test piece and a copper wire in a sample is 0.7 N/mm or more as measured in a 180-degree peeling test under a condition of a 100 mm/minute test rate, wherein the test piece, 50 mm in width and 150 mm in length, is cut out of the laminate such that the machine running direction of the laminate is the longitudinal direction of the test piece; a bare copper wire (annealed copper wire), 0.7 mm in conductor width and 0.035 mm in thickness, is placed on the adhesive layer of the test piece such that the longitudinal direction of the copper wire agrees with the longitudinal direction of the test piece; a pressing machine is used to sandwich the test piece with the copper wire placed thereon between a metal plate and a silicone rubber sheet each preheated to a temperature of 190°C, such that the copper wire side faces the silicone rubber sheet side; the resulting piece is pressed under the conditions of a 0.3 MPa pressure and a 8-second time to produce the sample; and the sample is treated for 1000 hours in a thermohygrostat set to a temperature of 85°C and a relative humidity of 85%; an adhesive strength between the test piece and the copper wire is 0.7 N/mm or more as measured in the same manner as in the above-mentioned, wherein the sample obtained in the same manner as in the above-mentioned is placed in a gear oven set to a temperature of 151°C and is treated for 168 hours.