An integrated circuit, IC, package assembly comprising: an IC die; a printed circuit board, PCB, (604, 903); a first insulated wire (628, 702) having a first end wire bonded with the IC die at a first die pad and a second end wire bonded with the PCB at a first PCB pad; a second insulated wire (630, 704) having an outer cross-sectional diameter and a first end wire bonded with the IC die at a second die pad and a second end wire bonded with the PCB at a second PCB pad; and a third insulated wire (632, 706) having a first end wire bonded with the IC die at a third die pad and a second end wire bonded with the PCB at a third PCB pad, wherein: the first, second, and third die pads are disposed on the IC die and are spaced apart from each other along a direction that extends longitudinally along the plurality of insulated wires; the first, second and third PCB pads are disposed on the PCB and are spaced apart from each other along the direction that extends longitudinally along the plurality of insulated wires; an outer surface of the second insulated wire is located at a distance of less than the outer cross-sectional diameter of the second insulated wire from an outer surface of the first insulated wire at a first location; the outer surface of the second insulated wire is located at a distance of less than the outer cross-sectional diameter of the second insulated wire from an outer surface of the third insulated wire at a second location, wherein the first, second and third insulated wires extend in parallel along a gathered region; and characterized in that the first die pad is the die pad closest to the PCB pads (618, 620, 622) and the first PCB pad is the PCB pad second furthest from the die pads (608, 610, 612) and in that the second die pad is the die pad second furthest from the PCB pads (618, 620, 622) and the second PCB pad is the PCB pad closest to the die pads (608, 610, 612). an IC die; a printed circuit board, PCB, (604, 903); a first insulated wire (628, 702) having a first end wire bonded with the IC die at a first die pad and a second end wire bonded with the PCB at a first PCB pad; a second insulated wire (630, 704) having an outer cross-sectional diameter and a first end wire bonded with the IC die at a second die pad and a second end wire bonded with the PCB at a second PCB pad; and a third insulated wire (632, 706) having a first end wire bonded with the IC die at a third die pad and a second end wire bonded with the PCB at a third PCB pad, wherein: the first, second, and third die pads are disposed on the IC die and are spaced apart from each other along a direction that extends longitudinally along the plurality of insulated wires; the first, second and third PCB pads are disposed on the PCB and are spaced apart from each other along the direction that extends longitudinally along the plurality of insulated wires; an outer surface of the second insulated wire is located at a distance of less than the outer cross-sectional diameter of the second insulated wire from an outer surface of the first insulated wire at a first location; the outer surface of the second insulated wire is located at a distance of less than the outer cross-sectional diameter of the second insulated wire from an outer surface of the third insulated wire at a second location, wherein the first, second and third insulated wires extend in parallel along a gathered region; and characterized in that the first die pad is the die pad closest to the PCB pads (618, 620, 622) and the first PCB pad is the PCB pad second furthest from the die pads (608, 610, 612) and in that the second die pad is the die pad second furthest from the PCB pads (618, 620, 622) and the second PCB pad is the PCB pad closest to the die pads (608, 610, 612). the first, second, and third die pads are disposed on the IC die and are spaced apart from each other along a direction that extends longitudinally along the plurality of insulated wires; the first, second and third PCB pads are disposed on the PCB and are spaced apart from each other along the direction that extends longitudinally along the plurality of insulated wires; an outer surface of the second insulated wire is located at a distance of less than the outer cross-sectional diameter of the second insulated wire from an outer surface of the first insulated wire at a first location; the outer surface of the second insulated wire is located at a distance of less than the outer cross-sectional diameter of the second insulated wire from an outer surface of the third insulated wire at a second location, wherein the first, second and third insulated wires extend in parallel along a gathered region; and characterized in that the first die pad is the die pad closest to the PCB pads (618, 620, 622) and the first PCB pad is the PCB pad second furthest from the die pads (608, 610, 612) and in that the second die pad is the die pad second furthest from the PCB pads (618, 620, 622) and the second PCB pad is the PCB pad closest to the die pads (608, 610, 612).