An LED module comprising: a column-shaped mounting substrate comprising a first metal plate, a second metal plate, and an insulation layer between the first and second metal plates, the mounting substrate having a long side in a surface direction of the first metal plate and the second metal plate, a length of the long side being greater than a thickness in the lamination direction; and a plurality of three or more LED devices connected to the first metal plate and to the second metal plate at a leading end part in the long side direction of the mounting substrate with the first metal plate as a plus-side electrode and the second metal plate as a minus-side electrode, characterized in that the mounting substrate has a structure in which the first metal plate, the insulation layer, and the second metal plate are laminated in order so that the insulation layer is sandwiched between the first metal plate and the second metal plate to be exposed to two side surfaces and an end surface of the leading end part of the mounting substrate, each of the LED devices includes an LED die (30, 50) whose side surface and top surface are coated with fluorescent resin (31, 51), and emits light from the top surface and the side surface thereof, and a part of the LED devices is mounted on both of said two side surfaces of the mounting substrate and a remaining part of the LED devices is mounted on said end surface of the mounting substrate, each of the LED devices being connected to the first metal plate and the second metal plate by solder (21, 22, 21b, 22b) so as to straddle the insulation layer, and on top of the fluorescent resin (31, 51) a semi-transmissive reflective layer is formed which reflects part of light beams emitted in upward direction and emits the part of light beams from the side surface of the LED devices. a column-shaped mounting substrate comprising a first metal plate, a second metal plate, and an insulation layer between the first and second metal plates, the mounting substrate having a long side in a surface direction of the first metal plate and the second metal plate, a length of the long side being greater than a thickness in the lamination direction; and a plurality of three or more LED devices connected to the first metal plate and to the second metal plate at a leading end part in the long side direction of the mounting substrate with the first metal plate as a plus-side electrode and the second metal plate as a minus-side electrode, the mounting substrate has a structure in which the first metal plate, the insulation layer, and the second metal plate are laminated in order so that the insulation layer is sandwiched between the first metal plate and the second metal plate to be exposed to two side surfaces and an end surface of the leading end part of the mounting substrate, each of the LED devices includes an LED die (30, 50) whose side surface and top surface are coated with fluorescent resin (31, 51), and emits light from the top surface and the side surface thereof, and a part of the LED devices is mounted on both of said two side surfaces of the mounting substrate and a remaining part of the LED devices is mounted on said end surface of the mounting substrate, each of the LED devices being connected to the first metal plate and the second metal plate by solder (21, 22, 21b, 22b) so as to straddle the insulation layer, and on top of the fluorescent resin (31, 51) a semi-transmissive reflective layer is formed which reflects part of light beams emitted in upward direction and emits the part of light beams from the side surface of the LED devices.