A copper alloy wire consisting of at least one selected from the group consisting of: 0.1 to 4 mass% of Ag; and at least one selected from the group consisting of Sn, Mg, Zn, In, Ni, Co, Zr and Cr each at a content of 0.05 to 0.30 mass%, with the balance being Cu and unavoidable impurities, wherein the copper alloy wire has a recrystallized texture, a tensile strength of 260 MPa or more, and an elongation of 30% or more; the wire diameter or wire thickness is 0.1 mm or less and 0.01 mm or more; the area ratio of grains having <101> orientation, when a cross-section perpendicular to the longitudinal direction of the wire is observed by EBSD in a direction normal to the cross-section, is 10% or more of the entire measurement area,, wherein the area ratio of the grains having <101> orientation is obtained by an EBSD method in such a manner that the cross-section perpendicular to the longitudinal direction (transverse cross-section) of a copper alloy wire sample is scanned at a step of 0.02 μm; the orientation of each grain is observed and analyzed; based on the analyzed results, a plane in which a deviation angle with the <101> orientation is within ±10 degrees is defined as a <101> plane; a grain which has a plane in which a deviation angle with the <101> orientation is within ±10 degrees when the cross-section perpendicular to the longitudinal direction of the wire is observed by EBSD in a direction normal to the cross-section, is defined as a grain having the <101> orientation; the area ratio (%) of grains having the <101> orientation with respect to the entire measurement area is calculated based on the measurement results. 0.1 to 4 mass% of Ag; and at least one selected from the group consisting of Sn, Mg, Zn, In, Ni, Co, Zr and Cr each at a content of 0.05 to 0.30 mass%, with the balance being Cu and unavoidable impurities, wherein the copper alloy wire has a recrystallized texture, a tensile strength of 260 MPa or more, and an elongation of 30% or more; the wire diameter or wire thickness is 0.1 mm or less and 0.01 mm or more; the area ratio of grains having <101> orientation, when a cross-section perpendicular to the longitudinal direction of the wire is observed by EBSD in a direction normal to the cross-section, is 10% or more of the entire measurement area,, wherein the area ratio of the grains having <101> orientation is obtained by an EBSD method in such a manner that the cross-section perpendicular to the longitudinal direction (transverse cross-section) of a copper alloy wire sample is scanned at a step of 0.02 μm; the orientation of each grain is observed and analyzed; based on the analyzed results, a plane in which a deviation angle with the <101> orientation is within ±10 degrees is defined as a <101> plane; a grain which has a plane in which a deviation angle with the <101> orientation is within ±10 degrees when the cross-section perpendicular to the longitudinal direction of the wire is observed by EBSD in a direction normal to the cross-section, is defined as a grain having the <101> orientation; the area ratio (%) of grains having the <101> orientation with respect to the entire measurement area is calculated based on the measurement results.