A method of manufacturing an electroforming mold, comprising: a first photoresist layer formation step of forming a first photoresist layer on an upper surface of a conductive substrate; a first photoresist layer exposure step of exposing the first photoresist layer to light through a first mask pattern disposed above the first photoresist layer to divide the first photoresist layer into a soluble portion and an insoluble portion; an intermediate conductive film formation step of thermally depositing a conductive material by using a vacuum deposition method within a temperature range in which light with a wavelength within a range not causing photoreaction in the first photoresist layer is emitted, to thereby form an intermediate conductive film on an upper surface of the first photoresist layer; a patterning resist formation step of forming a patterning resist on an upper surface of the intermediate conductive film; a patterning step of patterning the intermediate conductive film through the patterning resist; a patterning resist removal step of removing the patterning resist remaining after the patterning step; a second photoresist layer formation step of forming a second photoresist layer on an upper surface of the first photoresist layer exposed by the patterning step and on an upper surface of the intermediate conductive film exposed by the patterning resist removal step; a second photoresist layer exposure step of exposing the second photoresist layer to light through a second mask pattern disposed above the second photoresist layer to divide the second photoresist layer into a second soluble portion and an insoluble portion; and a soluble portion removal step of removing the soluble portion of each of the first and second photoresist layers layer by developing the first photoresist layer and the second photoresist layer. a first photoresist layer formation step of forming a first photoresist layer on an upper surface of a conductive substrate; a first photoresist layer exposure step of exposing the first photoresist layer to light through a first mask pattern disposed above the first photoresist layer to divide the first photoresist layer into a soluble portion and an insoluble portion; an intermediate conductive film formation step of thermally depositing a conductive material by using a vacuum deposition method within a temperature range in which light with a wavelength within a range not causing photoreaction in the first photoresist layer is emitted, to thereby form an intermediate conductive film on an upper surface of the first photoresist layer; a patterning resist formation step of forming a patterning resist on an upper surface of the intermediate conductive film; a patterning step of patterning the intermediate conductive film through the patterning resist; a patterning resist removal step of removing the patterning resist remaining after the patterning step; a second photoresist layer formation step of forming a second photoresist layer on an upper surface of the first photoresist layer exposed by the patterning step and on an upper surface of the intermediate conductive film exposed by the patterning resist removal step; a second photoresist layer exposure step of exposing the second photoresist layer to light through a second mask pattern disposed above the second photoresist layer to divide the second photoresist layer into a second soluble portion and an insoluble portion; and a soluble portion removal step of removing the soluble portion of each of the first and second photoresist layers layer by developing the first photoresist layer and the second photoresist layer.