A thermoelectric module, comprising: a pair of support substrates (11,12) comprising mutually opposed regions; wiring conductors (21,22) disposed on one principal surface of one support substrate of the pair of support substrates (11,12) and one principal surface of another support substrate of the pair of support substrates (11,12), respectively, the one principal surface of the one support substrate and the one principal surface of the other support substrate being opposed to each other; a plurality of thermoelectric elements disposed between the one principal surface of the one support substrate of the pair of support substrates (11,12) and the one principal surface of the other support substrate of the pair of support substrates (11,12); a lead member joined to one wiring conductor of the wiring conductors (21,22), the one wiring conductor located on either the one support substrate or the other support substrate of the pair of support substrates (11,12), the lead member comprising a core, and a covering layer which covers a rear end-side part of the core, and which does not cover a front end-side part of the core; and an electrically conductive joining material which joins the one wiring conductor and the lead member together, wherein a bonding interface between the electrically conductive joining material and the one wiring conductor is smaller in width on a side of the bonding interface which is close to the thermoelectric elements than on a side of the bonding interface which is away from the thermoelectric elements, as viewed in a respective section in a direction perpendicular to an axial direction of the lead member, and wherein the lead member is inclined relative to a direction parallel to the pair of support substrates (11,12), so that a front end of the lead member is directed away from the one wiring conductor in a direction from the rear end-side part of the core to the front end-side part of the core, as viewed in a section of the thermoelectric module perpendicular to the pair of support substrates (11,12) and along the axial direction of the lead member. a pair of support substrates (11,12) comprising mutually opposed regions; wiring conductors (21,22) disposed on one principal surface of one support substrate of the pair of support substrates (11,12) and one principal surface of another support substrate of the pair of support substrates (11,12), respectively, the one principal surface of the one support substrate and the one principal surface of the other support substrate being opposed to each other; a plurality of thermoelectric elements disposed between the one principal surface of the one support substrate of the pair of support substrates (11,12) and the one principal surface of the other support substrate of the pair of support substrates (11,12); a lead member joined to one wiring conductor of the wiring conductors (21,22), the one wiring conductor located on either the one support substrate or the other support substrate of the pair of support substrates (11,12), the lead member comprising a core, and a covering layer which covers a rear end-side part of the core, and which does not cover a front end-side part of the core; and an electrically conductive joining material which joins the one wiring conductor and the lead member together, wherein a bonding interface between the electrically conductive joining material and the one wiring conductor is smaller in width on a side of the bonding interface which is close to the thermoelectric elements than on a side of the bonding interface which is away from the thermoelectric elements, as viewed in a respective section in a direction perpendicular to an axial direction of the lead member, and wherein the lead member is inclined relative to a direction parallel to the pair of support substrates (11,12), so that a front end of the lead member is directed away from the one wiring conductor in a direction from the rear end-side part of the core to the front end-side part of the core, as viewed in a section of the thermoelectric module perpendicular to the pair of support substrates (11,12) and along the axial direction of the lead member.