A power semiconductor module comprising a baseplate being at least in part covered by an encapsulation material, wherein the baseplate comprises a first side, a second side being located opposite to the first side, and an edge side connecting the first side and the second side, wherein the baseplate at its first side is configured for being provided with an electric circuit and wherein the baseplate at its second side is configured for being brought into contact to a heat dissipating element, wherein the baseplate comprises at its first side at least one first region, being located adjacent to the edge side of the baseplate and proceeding in a first plane, wherein at the at least one first region, the baseplate is free of the encapsulation material, and wherein the baseplate is configured for being connected to the heat dissipating element by applying a clamping force with a clamping part to the at least one first region, wherein the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material, characterized in that at least one of features a) and b) is realized, wherein features a) and b) are defined as follows: a) at the edge side, the encapsulating material has a first area of cross section, the first area of cross section proceeding parallel to the first plane, and has a second area of cross section in a second plane, the second plane proceeding parallel to the first plane and being different from the first plane, wherein the first area of cross section is closer to the first plane compared to the second area of cross section, wherein the first area of cross section is smaller than the second area of cross section, and b) in a situation where the baseplate is connected to the heat dissipating element by the clamping force acting on the clamping part and pressing the baseplate to the heat dissipating element, the clamping part has a third area of cross section parallel to the first plane and abutting the first plane, and the clamping part has a fourth area of cross section in a third plane proceeding parallel to the first plane and being different to the first plane, wherein the third area of cross section is smaller than the fourth area of cross section. wherein the baseplate comprises a first side, a second side being located opposite to the first side, and an edge side connecting the first side and the second side, wherein the baseplate at its first side is configured for being provided with an electric circuit and wherein the baseplate at its second side is configured for being brought into contact to a heat dissipating element, wherein the baseplate comprises at its first side at least one first region, being located adjacent to the edge side of the baseplate and proceeding in a first plane, wherein at the at least one first region, the baseplate is free of the encapsulation material, and wherein the baseplate is configured for being connected to the heat dissipating element by applying a clamping force with a clamping part to the at least one first region, wherein the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material, characterized in that at least one of features a) and b) is realized, wherein features a) and b) are defined as follows: a) at the edge side, the encapsulating material has a first area of cross section, the first area of cross section proceeding parallel to the first plane, and has a second area of cross section in a second plane, the second plane proceeding parallel to the first plane and being different from the first plane, wherein the first area of cross section is closer to the first plane compared to the second area of cross section, wherein the first area of cross section is smaller than the second area of cross section, and b) in a situation where the baseplate is connected to the heat dissipating element by the clamping force acting on the clamping part and pressing the baseplate to the heat dissipating element, the clamping part has a third area of cross section parallel to the first plane and abutting the first plane, and the clamping part has a fourth area of cross section in a third plane proceeding parallel to the first plane and being different to the first plane, wherein the third area of cross section is smaller than the fourth area of cross section. a) at the edge side, the encapsulating material has a first area of cross section, the first area of cross section proceeding parallel to the first plane, and has a second area of cross section in a second plane, the second plane proceeding parallel to the first plane and being different from the first plane, wherein the first area of cross section is closer to the first plane compared to the second area of cross section, wherein the first area of cross section is smaller than the second area of cross section, and b) in a situation where the baseplate is connected to the heat dissipating element by the clamping force acting on the clamping part and pressing the baseplate to the heat dissipating element, the clamping part has a third area of cross section parallel to the first plane and abutting the first plane, and the clamping part has a fourth area of cross section in a third plane proceeding parallel to the first plane and being different to the first plane, wherein the third area of cross section is smaller than the fourth area of cross section.