A camera module, comprising: an optical lens unit, and a light sensing unit provided along a light outgoing path of said optical lens unit so that said light sensing unit is able to sense light emitted from said optical lens unit, wherein said light sensing unit comprises: a photoelectric converting element, and a conducting unit connected to said photoelectric converting element, wherein said conducting unit transfers electrical signals converted and generated during an operation of said photoelectric converting element, and conducts heat generated during the operation of said photoelectric converting element to the surroundings, said conducting unit further comprises a substrate and a circuit board contacted with said substrate, wherein said substrate and said photoelectric converting element are closely attached to conduct heat generated during the operation of said photoelectric converting element, and said circuit board is electrically coupled with said photoelectric converting element to transfer electrical signals converted and generated during the operation of said photoelectric converting element, wherein said substrate has a first platform surface and a second platform surface parallel to said first platform surface and a height between said first platform surface and said second platform surface is larger than or equal to a thickness of said circuit board, wherein said circuit board is contacted with said second platform surface of said substrate and said photoelectric converting element is contacted with said first platform surface of said substrate. an optical lens unit, and a light sensing unit provided along a light outgoing path of said optical lens unit so that said light sensing unit is able to sense light emitted from said optical lens unit, wherein said light sensing unit comprises: a photoelectric converting element, and a conducting unit connected to said photoelectric converting element, wherein said conducting unit transfers electrical signals converted and generated during an operation of said photoelectric converting element, and conducts heat generated during the operation of said photoelectric converting element to the surroundings, said conducting unit further comprises a substrate and a circuit board contacted with said substrate, wherein said substrate and said photoelectric converting element are closely attached to conduct heat generated during the operation of said photoelectric converting element, and said circuit board is electrically coupled with said photoelectric converting element to transfer electrical signals converted and generated during the operation of said photoelectric converting element, wherein said substrate has a first platform surface and a second platform surface parallel to said first platform surface and a height between said first platform surface and said second platform surface is larger than or equal to a thickness of said circuit board, wherein said circuit board is contacted with said second platform surface of said substrate and said photoelectric converting element is contacted with said first platform surface of said substrate. a photoelectric converting element, and a conducting unit connected to said photoelectric converting element, wherein said conducting unit transfers electrical signals converted and generated during an operation of said photoelectric converting element, and conducts heat generated during the operation of said photoelectric converting element to the surroundings, said conducting unit further comprises a substrate and a circuit board contacted with said substrate, wherein said substrate and said photoelectric converting element are closely attached to conduct heat generated during the operation of said photoelectric converting element, and said circuit board is electrically coupled with said photoelectric converting element to transfer electrical signals converted and generated during the operation of said photoelectric converting element, wherein said substrate has a first platform surface and a second platform surface parallel to said first platform surface and a height between said first platform surface and said second platform surface is larger than or equal to a thickness of said circuit board, wherein said circuit board is contacted with said second platform surface of said substrate and said photoelectric converting element is contacted with said first platform surface of said substrate.