A method for manufacturing a micromechanical sound transducer, the method comprising: depositing a layer of first membrane support material (402; 512) over a first main surface of a substrate arrangement (10, 504), the first membrane support material (402; 512) having a first etching rate relative to a particular etching agent; depositing a layer of second membrane support material over a main surface of the layer of first membrane support material (402; 512), the second membrane support material having a second etching rate lower than the first etching rate relative to the particular etching agent; depositing a layer of membrane material over a main surface of the layer of second membrane support material; creating a cavity in the substrate arrangement (10, 504) from a side of the substrate arrangement (10, 504) opposite the layer of first membrane support material (402; 512), at least until the cavity extends to the layer of first membrane support material (402; 512); etching the layer of first membrane support material (402; 512) and the layer of second membrane support material by applying the particular etching agent through the cavity, the etching taking place in at least one first region located in an extension of the cavity along a direction substantially perpendicular to the first main surface of the substrate arrangement (10, 504) and also taking place in a second region surrounding the first region, wherein the etching creates a tapered surface on the layer of second membrane support material in the second region; and continuing the etching until the layer of second membrane support material has been removed in the first region to expose the layer of membrane material. depositing a layer of first membrane support material (402; 512) over a first main surface of a substrate arrangement (10, 504), the first membrane support material (402; 512) having a first etching rate relative to a particular etching agent; depositing a layer of second membrane support material over a main surface of the layer of first membrane support material (402; 512), the second membrane support material having a second etching rate lower than the first etching rate relative to the particular etching agent; depositing a layer of membrane material over a main surface of the layer of second membrane support material; creating a cavity in the substrate arrangement (10, 504) from a side of the substrate arrangement (10, 504) opposite the layer of first membrane support material (402; 512), at least until the cavity extends to the layer of first membrane support material (402; 512); etching the layer of first membrane support material (402; 512) and the layer of second membrane support material by applying the particular etching agent through the cavity, the etching taking place in at least one first region located in an extension of the cavity along a direction substantially perpendicular to the first main surface of the substrate arrangement (10, 504) and also taking place in a second region surrounding the first region, wherein the etching creates a tapered surface on the layer of second membrane support material in the second region; and continuing the etching until the layer of second membrane support material has been removed in the first region to expose the layer of membrane material.