An enrollment assistance device, for facilitating biometric enrollment of a user of a contactless smartcard including a biometric arrangement and a wireless power transfer arrangement, the enrollment assistance device comprising: a first conductor spiral in a first conductor layer of the enrollment assistance device, and arranged to form a first wireless power transfer link with a wireless power transfer arrangement of a mobile phone when the mobile phone is arranged on a first surface portion of the enrollment assistance device, the first conductor spiral having a first conductor end inside the first conductor spiral and a second conductor end outside the first conductor spiral, and a second conductor spiral in a second conductor layer of the enrollment assistance device conductively separated from the first conductor layer by an insulating layer, and arranged to form a second wireless power transfer link with the wireless power transfer arrangement of the contactless smartcard when the contactless smartcard is arranged on a second surface portion of the enrollment assistance device, the second conductor spiral having a first conductor end inside the second conductor spiral and a second conductor end outside the second conductor spiral, the enrollment assistance device is characterized in that the first conductor end of the first conductor spiral is conductively connected to a first capacitive coupling pad of the first conductor spiral and the second conductor end of the first conductor spiral is conductively connected to a second capacitive coupling pad of the first conductor spiral, and the first conductor end of the second conductor spiral is conductively connected to a first capacitive coupling pad of the second conductor spiral and the second conductor end of the second conductor spiral is conductively connected to a second capacitive coupling pad of the second conductor spiral, wherein the first capacitive coupling pad of the first conductor spiral overlaps with the second capacitive coupling pad of the second conductor spiral, and the second capacitive coupling pad of the first conductor spiral overlaps with the first capacitive coupling pad of the second conductor spiral. a first conductor spiral in a first conductor layer of the enrollment assistance device, and arranged to form a first wireless power transfer link with a wireless power transfer arrangement of a mobile phone when the mobile phone is arranged on a first surface portion of the enrollment assistance device, the first conductor spiral having a first conductor end inside the first conductor spiral and a second conductor end outside the first conductor spiral, and a second conductor spiral in a second conductor layer of the enrollment assistance device conductively separated from the first conductor layer by an insulating layer, and arranged to form a second wireless power transfer link with the wireless power transfer arrangement of the contactless smartcard when the contactless smartcard is arranged on a second surface portion of the enrollment assistance device, the second conductor spiral having a first conductor end inside the second conductor spiral and a second conductor end outside the second conductor spiral, the enrollment assistance device is characterized in that the first conductor end of the first conductor spiral is conductively connected to a first capacitive coupling pad of the first conductor spiral and the second conductor end of the first conductor spiral is conductively connected to a second capacitive coupling pad of the first conductor spiral, and the first conductor end of the second conductor spiral is conductively connected to a first capacitive coupling pad of the second conductor spiral and the second conductor end of the second conductor spiral is conductively connected to a second capacitive coupling pad of the second conductor spiral, wherein the first capacitive coupling pad of the first conductor spiral overlaps with the second capacitive coupling pad of the second conductor spiral, and the second capacitive coupling pad of the first conductor spiral overlaps with the first capacitive coupling pad of the second conductor spiral.