Method to produce a high temperature resistant, lead-free solder connection between a PCB and a component (2;2b), in which - a lead-free solder preform (3;3b) is used that exhibits a composite material with a first composite component that is essentially arranged in layers, wherein the solder preform (3;3b) as the first composite component exhibits a solder alloy containing tin with a melting point of below 250°, as well as a metallic matrix as a second composite component; - the solder preform (3;3b) is attached to a solderable surface of the PCB in such a way that the layers of the first composite component essentially extend parallel to the solderable surface; - the component (2;2b) is connected to the solder preform (3;3b), which is itself attached to the solderable surface, wherein the component (2;2b) exhibits a solderable first surface that faces the solder preform (3;3b); and - the component (2;2b) is soldered to the solder preform (3;3b) using a selective bar soldering process that encompasses at least the following steps: ∘ Pressing a bar onto a second surface of the component (2;2b) that faces away from the solder preform (3;3b); ∘ Achieving a specified soldering temperature (Lt) via an electrical current that flows through the bar, wherein a temperature between 250°C and 400°C is used as the specified soldering temperature (Lt), wherein a first surface of the solder preform (3;3b) that faces away from the solderable surface is soldered to the first surface of the component (2;2b) that faces the solder preform (3;3b) at the predefined soldering temperature and wherein the intermetallic phases are formed from the layers of the first composite component, wherein the solder connection (7;71) exhibits a plurality of essentially lamellar intermetallic phases which are essentially arranged parallel to the solderable surface, and wherein the intermetallic phases of the solder connection (7;71) are essentially distributed evenly and arranged in a vertical direction relative to the solderable surface of PCB; and ∘ Moving the bar away from the component (2;2b). - a lead-free solder preform (3;3b) is used that exhibits a composite material with a first composite component that is essentially arranged in layers, wherein the solder preform (3;3b) as the first composite component exhibits a solder alloy containing tin with a melting point of below 250°, as well as a metallic matrix as a second composite component; - the solder preform (3;3b) is attached to a solderable surface of the PCB in such a way that the layers of the first composite component essentially extend parallel to the solderable surface; - the component (2;2b) is connected to the solder preform (3;3b), which is itself attached to the solderable surface, wherein the component (2;2b) exhibits a solderable first surface that faces the solder preform (3;3b); and - the component (2;2b) is soldered to the solder preform (3;3b) using a selective bar soldering process that encompasses at least the following steps: ∘ Pressing a bar onto a second surface of the component (2;2b) that faces away from the solder preform (3;3b); ∘ Achieving a specified soldering temperature (Lt) via an electrical current that flows through the bar, wherein a temperature between 250°C and 400°C is used as the specified soldering temperature (Lt), wherein a first surface of the solder preform (3;3b) that faces away from the solderable surface is soldered to the first surface of the component (2;2b) that faces the solder preform (3;3b) at the predefined soldering temperature and wherein the intermetallic phases are formed from the layers of the first composite component, wherein the solder connection (7;71) exhibits a plurality of essentially lamellar intermetallic phases which are essentially arranged parallel to the solderable surface, and wherein the intermetallic phases of the solder connection (7;71) are essentially distributed evenly and arranged in a vertical direction relative to the solderable surface of PCB; and ∘ Moving the bar away from the component (2;2b). ∘ Pressing a bar onto a second surface of the component (2;2b) that faces away from the solder preform (3;3b); ∘ Achieving a specified soldering temperature (Lt) via an electrical current that flows through the bar, wherein a temperature between 250°C and 400°C is used as the specified soldering temperature (Lt), wherein a first surface of the solder preform (3;3b) that faces away from the solderable surface is soldered to the first surface of the component (2;2b) that faces the solder preform (3;3b) at the predefined soldering temperature and wherein the intermetallic phases are formed from the layers of the first composite component, wherein the solder connection (7;71) exhibits a plurality of essentially lamellar intermetallic phases which are essentially arranged parallel to the solderable surface, and wherein the intermetallic phases of the solder connection (7;71) are essentially distributed evenly and arranged in a vertical direction relative to the solderable surface of PCB; and ∘ Moving the bar away from the component (2;2b).