A method of manufacturing support elements for lighting devices, the method including: - providing an elongated, electrically non-conductive substrate with opposed surfaces, said substrate having an electrically-conductive layer extending along one of said opposed surfaces, - etching said electrically-conductive layer to provide a set of electrically-conductive tracks (141, 142) extending along said non-conductive substrate with at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks (141, 142), - forming at said at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks (141, 142) a network of electrically-conductive lines (301, 302) coupleable with at least one electrically-powered light radiation source, wherein said forming includes printing electrically-conductive material onto said non-conductive substrate, - electrically coupling said set of electrically-conductive tracks (141, 142) and said network of electrically-conductive lines (301, 302), wherein the method comprises: - providing said at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks (141, 142) at said one of said opposed surfaces along which said etched, electrically-conductive layer extends, - electrically coupling said set of electrically-conductive tracks (141, 142) and said network of electrically-conductive lines (301, 302) by means of electrically-conductive elements mounted at said one of said opposed surfaces of the non-conductive substrate wherein said electrically-conductive elements include zero ohm SMD components. - providing an elongated, electrically non-conductive substrate with opposed surfaces, said substrate having an electrically-conductive layer extending along one of said opposed surfaces, - etching said electrically-conductive layer to provide a set of electrically-conductive tracks (141, 142) extending along said non-conductive substrate with at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks (141, 142), - forming at said at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks (141, 142) a network of electrically-conductive lines (301, 302) coupleable with at least one electrically-powered light radiation source, wherein said forming includes printing electrically-conductive material onto said non-conductive substrate, - electrically coupling said set of electrically-conductive tracks (141, 142) and said network of electrically-conductive lines (301, 302), - providing said at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks (141, 142) at said one of said opposed surfaces along which said etched, electrically-conductive layer extends, - electrically coupling said set of electrically-conductive tracks (141, 142) and said network of electrically-conductive lines (301, 302) by means of electrically-conductive elements mounted at said one of said opposed surfaces of the non-conductive substrate wherein said electrically-conductive elements include zero ohm SMD components.