A method for fabricating a repair laminate for an in-situ composite part having an exposed surface comprising: applying bonding material to the exposed surface; forming an uncured ply stack assembly that comprises a first ply stack and a second ply stack, the forming of the uncured ply stack assembly including: forming the first uncured ply stack over the exposed surface on the bonding material, the first uncured ply stack including a plurality of uncured plies; applying a vacuum and heat to the thus formed first uncured ply stack prior to forming the second uncured ply stack over the exposed surface, wherein the temperature of the heat applied is below a curing temperature; compacting the first uncured ply stack with the vacuum and heat applied thereto; forming the second uncured ply stack over the compacted first uncured ply stack, the second uncured ply stack including a plurality of uncured plies; applying the vacuum and heat to the thus formed second uncured ply stack, wherein the temperature of the heat applied is below the curing temperature; compacting the second uncured ply stack with the vacuum and heat applied thereto; and curing the uncured ply stack assembly and bonding material. applying bonding material to the exposed surface; forming an uncured ply stack assembly that comprises a first ply stack and a second ply stack, the forming of the uncured ply stack assembly including: forming the first uncured ply stack over the exposed surface on the bonding material, the first uncured ply stack including a plurality of uncured plies; applying a vacuum and heat to the thus formed first uncured ply stack prior to forming the second uncured ply stack over the exposed surface, wherein the temperature of the heat applied is below a curing temperature; compacting the first uncured ply stack with the vacuum and heat applied thereto; forming the second uncured ply stack over the compacted first uncured ply stack, the second uncured ply stack including a plurality of uncured plies; applying the vacuum and heat to the thus formed second uncured ply stack, wherein the temperature of the heat applied is below the curing temperature; compacting the second uncured ply stack with the vacuum and heat applied thereto; and curing the uncured ply stack assembly and bonding material. forming the first uncured ply stack over the exposed surface on the bonding material, the first uncured ply stack including a plurality of uncured plies; applying a vacuum and heat to the thus formed first uncured ply stack prior to forming the second uncured ply stack over the exposed surface, wherein the temperature of the heat applied is below a curing temperature; compacting the first uncured ply stack with the vacuum and heat applied thereto; forming the second uncured ply stack over the compacted first uncured ply stack, the second uncured ply stack including a plurality of uncured plies; applying the vacuum and heat to the thus formed second uncured ply stack, wherein the temperature of the heat applied is below the curing temperature; compacting the second uncured ply stack with the vacuum and heat applied thereto; and curing the uncured ply stack assembly and bonding material.