A power module, comprising a substrate, a heat-emitting component, and a temperature sensor, wherein; the heat-emitting component and the temperature sensor are both disposed on a surface of the substrate; the substrate comprises a conductive structure, the heat-emitting component is electrically connected to the conductive structure, and the conductive structure is configured to perform heat exchange with the heat-emitting component electrically connected to the conductive structure; and a projection of the temperature sensor in a thickness dimension of the substrate overlaps at least partially with a projection of the conductive structure in the thickness dimension of the substrate, and the temperature sensor is configured to collect a temperature of the conductive structure; wherein the substrate is a printed circuit board; wherein the substrate comprises at least two conductive layers and an insulation layer that is located between two adjacent conductive layers; the at least two conductive layers comprise a first conductive layer and a second conductive layer that are respectively located on surfaces that are of the substrate and that are on two sides of the substrate in the thickness dimension of the substrate, the temperature sensor is disposed on a surface of the first conductive layer, and the heat-emitting component is disposed on a surface of the second conductive layer; and at least one of the conductive layers other than the first conductive layer comprises the conductive structure, and there is the insulation layer between the conductive layer in which the conductive structure is located and the first conductive layer; wherein the heat-emitting component is provided with a pin, the pin passes through the substrate so as to dispose the heat-emitting component on the surface of the substrate, the heat-emitting component is electrically connected to the conductive structure by using the pin, the conductive structure is configured to perform heat exchange with the heat-emitting component by using the pin, and the temperature sensor and the pin are adjacently disposed. the heat-emitting component and the temperature sensor are both disposed on a surface of the substrate; the substrate comprises a conductive structure, the heat-emitting component is electrically connected to the conductive structure, and the conductive structure is configured to perform heat exchange with the heat-emitting component electrically connected to the conductive structure; and a projection of the temperature sensor in a thickness dimension of the substrate overlaps at least partially with a projection of the conductive structure in the thickness dimension of the substrate, and the temperature sensor is configured to collect a temperature of the conductive structure; wherein the substrate is a printed circuit board; wherein the substrate comprises at least two conductive layers and an insulation layer that is located between two adjacent conductive layers; the at least two conductive layers comprise a first conductive layer and a second conductive layer that are respectively located on surfaces that are of the substrate and that are on two sides of the substrate in the thickness dimension of the substrate, the temperature sensor is disposed on a surface of the first conductive layer, and the heat-emitting component is disposed on a surface of the second conductive layer; and at least one of the conductive layers other than the first conductive layer comprises the conductive structure, and there is the insulation layer between the conductive layer in which the conductive structure is located and the first conductive layer; wherein the heat-emitting component is provided with a pin, the pin passes through the substrate so as to dispose the heat-emitting component on the surface of the substrate, the heat-emitting component is electrically connected to the conductive structure by using the pin, the conductive structure is configured to perform heat exchange with the heat-emitting component by using the pin, and the temperature sensor and the pin are adjacently disposed.