An electrical circuit structure, comprising: a first trace formed using a first conductive layer; a second trace formed using a second conductive layer; wherein the first trace is vertically aligned with the second trace; a first plurality of via segments formed of conductive material in a third conductive layer between the first conductive layer and the second conductive layer; a first reference plane located below the first trace and the second trace; a first conductor structure (705A, 725A, 710A, 730A) on a first side of the first trace and the second trace, the first conductor structure extending from the first conductive layer to the first reference plane; and a second conductor structure (705D, 725D, 710D, 730D) on a second side of the first trace and the second trace, the second conductor structure extending from the first conductive layer to the first reference plane; a third trace formed using the first conductive layer; a fourth trace formed using the second conductive layer; wherein the third trace is vertically aligned with the fourth trace; a second plurality of via segments formed of conductive material in the third conductive layer between the first conductive layer and the second conductive layer; wherein the first plurality of via segments contact the first trace and the second trace forming a third conductor structure (705B, 725B, 710B) configured to convey an electrical signal in a direction parallel to the first conductive layer; wherein the second plurality of via segments contact the third trace and the fourth trace forming a fourth conductor structure (705C, 725C, 710C); wherein the third conductor structure and the fourth conductor structure form a differential pair between the first conductor structure and the second conductor structure; wherein no reference plane is positioned above the third conductive structure, wherein the reference plane is a conductive layer; wherein each via segment of the first plurality of via segments and the second plurality of via segments is longer in a direction that is parallel to the first trace and the second trace than in a direction perpendicular to the first trace and the second trace; and wherein, for the first plurality of via segments and the second plurality of via segments, a first pair of consecutive via segments has a spacing that is different than a spacing of a second pair of consecutive via segments. a first trace formed using a first conductive layer; a second trace formed using a second conductive layer; wherein the first trace is vertically aligned with the second trace; a first plurality of via segments formed of conductive material in a third conductive layer between the first conductive layer and the second conductive layer; a first reference plane located below the first trace and the second trace; a first conductor structure (705A, 725A, 710A, 730A) on a first side of the first trace and the second trace, the first conductor structure extending from the first conductive layer to the first reference plane; and a second conductor structure (705D, 725D, 710D, 730D) on a second side of the first trace and the second trace, the second conductor structure extending from the first conductive layer to the first reference plane; a third trace formed using the first conductive layer; a fourth trace formed using the second conductive layer; wherein the third trace is vertically aligned with the fourth trace; a second plurality of via segments formed of conductive material in the third conductive layer between the first conductive layer and the second conductive layer; wherein the first plurality of via segments contact the first trace and the second trace forming a third conductor structure (705B, 725B, 710B) configured to convey an electrical signal in a direction parallel to the first conductive layer; wherein the second plurality of via segments contact the third trace and the fourth trace forming a fourth conductor structure (705C, 725C, 710C); wherein the third conductor structure and the fourth conductor structure form a differential pair between the first conductor structure and the second conductor structure; wherein no reference plane is positioned above the third conductive structure, wherein the reference plane is a conductive layer; wherein each via segment of the first plurality of via segments and the second plurality of via segments is longer in a direction that is parallel to the first trace and the second trace than in a direction perpendicular to the first trace and the second trace; and wherein, for the first plurality of via segments and the second plurality of via segments, a first pair of consecutive via segments has a spacing that is different than a spacing of a second pair of consecutive via segments.