A method for manufacturing a bonded article, comprising the steps of: providing a first bonding target member; providing a second bonding target member to be bonded to the first bonding target member, the second bonding target member having a hole portion for receiving a part of the first bonding target member, the first or second bonding target member (3,4) having a relative displacement amount setting portion for setting the distance by which a bonding target portion of the first bonding target member and a bonding target portion of the second bonding target member are relatively displaced during bonding, the second or first bonding target member (3,4) having a setting face that is placed opposed to the relative displacement amount setting portion, either one or both of the relative displacement amount setting portion of the first or second bonding target member (3,4) and the setting face of the second or first bonding target member (3,4) having a current conduction suppressing layer formed thereon for suppressing conduction of current so that the relative displacement amount setting portion can contact the setting face of the first or second bonding target member (3,4) via the current conduction suppressing layer during bonding; applying a pressing force to the first and second bonding target members (3,4); relatively displacing the first and second bonding target members (3,4) until the relative displacement amount setting portion and the setting face contact each other via the current conduction suppressing layer during bonding when a bonding current is applied to the first and second bonding target members (3,4) with the pressing force being applied thereto to form a bonded portion; and applying a post-heating current, after the displacing step, to the first and second bonding target members (3,4) whereby the post-heating current flows substantially only through a bonded portion formed between the first and second bonding target members (3,4) to temper a bonded part of the bonded portion. providing a first bonding target member; providing a second bonding target member to be bonded to the first bonding target member, the second bonding target member having a hole portion for receiving a part of the first bonding target member, the first or second bonding target member (3,4) having a relative displacement amount setting portion for setting the distance by which a bonding target portion of the first bonding target member and a bonding target portion of the second bonding target member are relatively displaced during bonding, the second or first bonding target member (3,4) having a setting face that is placed opposed to the relative displacement amount setting portion, either one or both of the relative displacement amount setting portion of the first or second bonding target member (3,4) and the setting face of the second or first bonding target member (3,4) having a current conduction suppressing layer formed thereon for suppressing conduction of current so that the relative displacement amount setting portion can contact the setting face of the first or second bonding target member (3,4) via the current conduction suppressing layer during bonding; applying a pressing force to the first and second bonding target members (3,4); relatively displacing the first and second bonding target members (3,4) until the relative displacement amount setting portion and the setting face contact each other via the current conduction suppressing layer during bonding when a bonding current is applied to the first and second bonding target members (3,4) with the pressing force being applied thereto to form a bonded portion; and applying a post-heating current, after the displacing step, to the first and second bonding target members (3,4) whereby the post-heating current flows substantially only through a bonded portion formed between the first and second bonding target members (3,4) to temper a bonded part of the bonded portion.