A thermal pad, configured to perform heat dissipation for a heat emitting component, wherein the thermal pad comprises a first heat conducting layer and a second heat conducting layer, a second surface of the second heat conducting layer is in contact with a first surface of the first heat conducting layer; the first heat conducting layer is a heat conducting layer that can be compressed to deform, a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is higher than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer, and the thickness direction of the first heat conducting layer is perpendicular to the plane direction of the first heat conducting layer; and the second heat conducting layer is a heat conducting layer that cannot be compressed to deform, a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is higher than a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer, the heat conduction capability of the second heat conducting layer in the plane direction of the second heat conducting layer is higher than or equal to the heat conduction capability of the first heat conducting layer in the thickness direction of the first heat conducting layer, and the thickness direction of the second heat conducting layer is perpendicular to the plane direction of the second heat conducting layer; wherein the first heat conducting layer comprises an organic matrix and a heat conducting filler, and the heat conducting filler is orientated in the first heat conducting layer in the thickness direction of the first heat conducting layer; wherein the thermal pad further comprises a third heat conducting layer, wherein the third heat conducting layer is disposed between the heat emitting component and the second heat conducting layer, a first surface of the third heat conducting layer is in contact with the surface of the heat emitting component, a second surface of the third heat conducting layer is in contact with a first surface of the second heat conducting layer, and the third heat conducting layer is configured to fill in a micro void on the surface of the heat emitting component. the thermal pad comprises a first heat conducting layer and a second heat conducting layer, a second surface of the second heat conducting layer is in contact with a first surface of the first heat conducting layer; the first heat conducting layer is a heat conducting layer that can be compressed to deform, a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is higher than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer, and the thickness direction of the first heat conducting layer is perpendicular to the plane direction of the first heat conducting layer; and the second heat conducting layer is a heat conducting layer that cannot be compressed to deform, a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is higher than a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer, the heat conduction capability of the second heat conducting layer in the plane direction of the second heat conducting layer is higher than or equal to the heat conduction capability of the first heat conducting layer in the thickness direction of the first heat conducting layer, and the thickness direction of the second heat conducting layer is perpendicular to the plane direction of the second heat conducting layer; wherein the first heat conducting layer comprises an organic matrix and a heat conducting filler, and the heat conducting filler is orientated in the first heat conducting layer in the thickness direction of the first heat conducting layer; wherein the thermal pad further comprises a third heat conducting layer, wherein the third heat conducting layer is disposed between the heat emitting component and the second heat conducting layer, a first surface of the third heat conducting layer is in contact with the surface of the heat emitting component, a second surface of the third heat conducting layer is in contact with a first surface of the second heat conducting layer, and the third heat conducting layer is configured to fill in a micro void on the surface of the heat emitting component.