An integrated circuit package, comprising: an encapsulation; and a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame comprising: a first conductor (396, 397) having a first conductive loop (102, 105, 152, 155, 211, 215, 255, 260, 335, 337, 435, 437) disposed substantially within the encapsulation; a second conductor (396, 397) galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop (102, 105, 152, 155, 211, 215, 255, 260, 335, 337, 435, 437) disposed substantially within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors, and a plurality of external pins (201, 202, 203, 204, 252, 254, 256, 258, 302, 305, 311) that are part of the lead frame and extend from the encapsulation of the integrated circuit package, wherein a first of the pins is coupled to the first conductive loop through the lead frame and second of the pins is coupled to the second conductive loop through the lead frame such that the lead frame provides electrical connectivity to and from internal circuitry within an encapsulated portion of the integrated circuit package. an encapsulation; and a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame comprising: a first conductor (396, 397) having a first conductive loop (102, 105, 152, 155, 211, 215, 255, 260, 335, 337, 435, 437) disposed substantially within the encapsulation; a second conductor (396, 397) galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop (102, 105, 152, 155, 211, 215, 255, 260, 335, 337, 435, 437) disposed substantially within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors, and a plurality of external pins (201, 202, 203, 204, 252, 254, 256, 258, 302, 305, 311) that are part of the lead frame and extend from the encapsulation of the integrated circuit package, wherein a first of the pins is coupled to the first conductive loop through the lead frame and second of the pins is coupled to the second conductive loop through the lead frame such that the lead frame provides electrical connectivity to and from internal circuitry within an encapsulated portion of the integrated circuit package. a first conductor (396, 397) having a first conductive loop (102, 105, 152, 155, 211, 215, 255, 260, 335, 337, 435, 437) disposed substantially within the encapsulation; a second conductor (396, 397) galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop (102, 105, 152, 155, 211, 215, 255, 260, 335, 337, 435, 437) disposed substantially within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors, and a plurality of external pins (201, 202, 203, 204, 252, 254, 256, 258, 302, 305, 311) that are part of the lead frame and extend from the encapsulation of the integrated circuit package, wherein a first of the pins is coupled to the first conductive loop through the lead frame and second of the pins is coupled to the second conductive loop through the lead frame such that the lead frame provides electrical connectivity to and from internal circuitry within an encapsulated portion of the integrated circuit package.