An article comprising a vacuum insulation panel envelope comprising: (a) a polymeric film substrate having two opposing major surfaces; (b) a first layer in direct contact with one of the opposing major surfaces of the substrate, wherein the first layer is a low thermal conductivity organic polymer layer comprised of cross-linked (meth)acrylate monomers or a low thermal conductivity inorganic stack, wherein the low thermal conductivity inorganic stack (44, 46, 48) includes at least a layer having a thickness between 5 and 100 nm and a thermal conductivity of no more than 0.5 W/(m*K) and being comprised of at least one low thermal conductivity non-metallic inorganic material, and a layer having a thermal conductivity of no more than 1 W/(m*K) and being comprised of at least one low thermal conductivity metallic inorganic material; (c) a second layer in direct contact with the first layer, wherein the second layer is a low thermal conductivity organic polymer layer comprised of cross-linked (meth)acrylate monomers or a low thermal conductivity inorganic stack, wherein the low thermal conductivity inorganic stack (44, 46, 48) includes at least a layer having a thickness between 5 and 100 nm and a thermal conductivity of no more than 0.5 W/(m*K) and being comprised of at least one low thermal conductivity non-metallic inorganic material, and a layer having a thermal conductivity of no more than 1 W/(m*K) and being comprised of at least one low thermal conductivity metallic inorganic material, and further wherein when the first layer is a low thermal conductivity organic polymer layer, the second layer is a low thermal conductivity inorganic stack (44, 46, 48), an outer stack layer thereof being in direct contact with the first layer, and when the second layer is a low thermal conductivity organic polymer layer, the first layer is a low thermal conductivity inorganic stack (44, 46, 48), an outer stack layer thereof being in direct contact with the said major surface of the substrate and the other outer stack layer thereof being in direct contact with the second layer. (a) a polymeric film substrate having two opposing major surfaces; (b) a first layer in direct contact with one of the opposing major surfaces of the substrate, wherein the first layer is a low thermal conductivity organic polymer layer comprised of cross-linked (meth)acrylate monomers or a low thermal conductivity inorganic stack, wherein the low thermal conductivity inorganic stack (44, 46, 48) includes at least a layer having a thickness between 5 and 100 nm and a thermal conductivity of no more than 0.5 W/(m*K) and being comprised of at least one low thermal conductivity non-metallic inorganic material, and a layer having a thermal conductivity of no more than 1 W/(m*K) and being comprised of at least one low thermal conductivity metallic inorganic material; (c) a second layer in direct contact with the first layer, wherein the second layer is a low thermal conductivity organic polymer layer comprised of cross-linked (meth)acrylate monomers or a low thermal conductivity inorganic stack, wherein the low thermal conductivity inorganic stack (44, 46, 48) includes at least a layer having a thickness between 5 and 100 nm and a thermal conductivity of no more than 0.5 W/(m*K) and being comprised of at least one low thermal conductivity non-metallic inorganic material, and a layer having a thermal conductivity of no more than 1 W/(m*K) and being comprised of at least one low thermal conductivity metallic inorganic material, and