A manufacturing method, comprising: configuring a panel plate as an entrance window for x-ray or gamma ray radiation; attaching a bias plate on the panel plate with respect to a z-axis, wherein the bias plate is configured to conduct electricity and pass the radiation through it; attaching an array of tiles (100, 100_1, 100_2, 100_n), wherein each tile comprises a direct conversion compound semiconductor sensor and a readout integrated circuit, IC, layer, on the bias plate with respect to the z-axis so that the direct conversion compound semiconductor sensor is configured on and in contact with the bias plate, wherein the direct conversion compound semiconductor sensor rests directly on a surface of the bias plate by inserting the direct conversion compound semiconductor sensor onto the bias plate during the operation of attaching, and wherein the tiles are placed next to each other with a gap between the tiles; wherein the direct conversion compound semiconductor sensor is configured to convert photons of the x-ray or gamma ray radiation into an electric current; wherein the readout IC layer is situated on an opposite side of the direct conversion compound semiconductor sensor from the bias plate and configured to receive the electric current and process the electric current; characterized by attaching a tile support plate on the panel plate with respect to the z-axis such that the center of said tile support plate is attached onto the tiles and the sides of said tile support plate is attached onto the panel plate and attaching an interconnection board on the tile support plate with respect to the z-axis; wherein the interconnection board comprises spring load connectors that are configured to electrically contact the array of tiles for receiving the processed electric current from the readout IC and to output the received and processed electric current. configuring a panel plate as an entrance window for x-ray or gamma ray radiation; attaching a bias plate on the panel plate with respect to a z-axis, wherein the bias plate is configured to conduct electricity and pass the radiation through it; attaching an array of tiles (100, 100_1, 100_2, 100_n), wherein each tile comprises a direct conversion compound semiconductor sensor and a readout integrated circuit, IC, layer, on the bias plate with respect to the z-axis so that the direct conversion compound semiconductor sensor is configured on and in contact with the bias plate, wherein the direct conversion compound semiconductor sensor rests directly on a surface of the bias plate by inserting the direct conversion compound semiconductor sensor onto the bias plate during the operation of attaching, and wherein the tiles are placed next to each other with a gap between the tiles; wherein the direct conversion compound semiconductor sensor is configured to convert photons of the x-ray or gamma ray radiation into an electric current; wherein the readout IC layer is situated on an opposite side of the direct conversion compound semiconductor sensor from the bias plate and configured to receive the electric current and process the electric current; characterized by attaching a tile support plate on the panel plate with respect to the z-axis such that the center of said tile support plate is attached onto the tiles and the sides of said tile support plate is attached onto the panel plate and attaching an interconnection board on the tile support plate with respect to the z-axis; wherein the interconnection board comprises spring load connectors that are configured to electrically contact the array of tiles for receiving the processed electric current from the readout IC and to output the received and processed electric current. attaching a tile support plate on the panel plate with respect to the z-axis such that the center of said tile support plate is attached onto the tiles and the sides of said tile support plate is attached onto the panel plate and attaching an interconnection board on the tile support plate with respect to the z-axis; wherein the interconnection board comprises spring load connectors that are configured to electrically contact the array of tiles for receiving the processed electric current from the readout IC and to output the received and processed electric current.