Method for manufacturing a light emitting device, comprising: a first bottom substrate having an electrically conductive surface; a second bottom substrate having an electrically conductive surface: a first bare die light emitting diode device having a top p junction conductor and a bottom n junction conductor, the bottom n junction conductor in electrical communication with the electrically conductive surface of the first bottom conductor; a second bare die light emitting diode device having a top n junction conductor and a bottom p junction conductor, the bottom p junction conductor in electrical communication with the electrically conductive surface of the second bottom conductor; and a top substrate having a conductive surface, said conductive surface in electrical communication with both the top p junction conductor of the first bare die light emitting diode device and the top n junction conductor of the second bare die light emitting diode device, the electrically conductive surface of the top substrate being effective for putting the first bare die light emitting diode device and the second bare die light emitting diode device into a series electrical connection, wherein the light emitting device further comprises an adhesive adhering the top substrate to the first bottom substrate and to the second bottom substrate and encapsulating the first bare die light emitting diode device and the second bare die light emitting diode device, the adhesive adhering the first bare die light emitting diode device to the first bottom substrate and to the top substrate while maintaining the electrical communication between the top p junction conductor of the first bare die light emitting diode device to the conductive surface of the first bottom substrate and maintaining the electrical communication between the bottom n junction conductor of the first bare die light emitting diode device to the conductive surface of the top substrate, the adhesive adhering the second bare die light emitting diode device to the second bottom substrate and to the top substrate while maintaining the electrical communication between the bottom p junction conductor of the second bare die light emitting diode device to the conductive surface of the second bottom substrate and maintaining the electrical communication between the top n junction conductor of the second bare die light emitting diode device to the conductive surface of the top substrate, wherein the first and the second bare die light emitting diode devices are embedded in the adhesive with respective top conductive side and the bottom conductive side left at least partially uncovered by the adhesive so that the adhesive binds the first bottom substrate and the second bottom substrate to the top substrate with the first and the second bare die light emitting diode devices in electrical communication with the respective conductive surfaces, and wherein the electrically conductive surface of at least the first bottom substrate, the second bottom substrate and the top substrate has a predetermined resistance value effective to create a ballast resistor within a desired resistance range in series with the first bare die light emitting diode device and the second bare die light emitting diode device, wherein the equivalent ballast resistor is adjusted through the selection of materials or geometry, so that the first and the second bare die light emitting diode devices can be connected in series even if they do not have the same electrical characteristics.