A cooling arrangement for a heat-generating component, wherein the cooling arrangement comprises - a heat source, - a heat sink, which is embodied as a metallic cooling body, - and an intermediate part arranged between the heat source and heat sink, wherein the heat source is a heat-generating component which is inserted on a printed circuit board, wherein the intermediate part is manufactured from thermally conductive foam, and wherein the intermediate part connects the heat source to the heat sink, wherein the foam has gas inclusions and/or gas-filled recesses, which are surrounded in each case at least partially or entirely by a base material of the foam, wherein the base material of the foam is a plastics material, in particular polypropylene, to which boron nitride powder is admixed as an additive, wherein the boron nitride has an average grain size of between 0.5 μm and 50 μm, in particular between 1 μm and 10 μm, wherein the foam is electrically insulating, the insulation resistance of the foam being the same as in dry air under normal pressure at 20° Celsius or higher, wherein the volume percent of the additive in the base material of the foam is between 3% and 30%, in particular preferably 5 to 15%, relative to the raw material of the foam prior to the foaming of the foam, characterised in that lines of touching boron nitride particles which lead from the heat source to the heat sink, are present within the base material of the foam, the intermediate part surrounding the populated printed circuit board on either side and the foam surrounding the printed circuit board populated with the heat-generating components in a housing-forming manner, an additive which improves the flameproofing being admixed to the base material of the foam, the thermal resistance from the heat source to the heat sink by way of the foam is less than the thermal resistance by way of any other heat-conduction path from the heat source to the heat sink which does not pass through the foam. wherein the cooling arrangement comprises - a heat source, - a heat sink, which is embodied as a metallic cooling body, - and an intermediate part arranged between the heat source and heat sink, - a heat source, - a heat sink, which is embodied as a metallic cooling body, - and an intermediate part arranged between the heat source and heat sink, wherein the heat source is a heat-generating component which is inserted on a printed circuit board, wherein the intermediate part is manufactured from thermally conductive foam, and wherein the intermediate part connects the heat source to the heat sink, wherein the foam has gas inclusions and/or gas-filled recesses, which are surrounded in each case at least partially or entirely by a base material of the foam, wherein the base material of the foam is a plastics material, in particular polypropylene, to which boron nitride powder is admixed as an additive, wherein the boron nitride has an average grain size of between 0.5 μm and 50 μm, in particular between 1 μm and 10 μm, wherein the foam is electrically insulating, the insulation resistance of the foam being the same as in dry air under normal pressure at 20° Celsius or higher, wherein the volume percent of the additive in the base material of the foam is between 3% and 30%, in particular preferably 5 to 15%, relative to the raw material of the foam prior to the foaming of the foam, characterised in that lines of touching boron nitride particles which lead from the heat source to the heat sink, are present within the base material of the foam, the intermediate part surrounding the populated printed circuit board on either side and the foam surrounding the printed circuit board populated with the heat-generating components in a housing-forming manner, an additive which improves the flameproofing being admixed to the base material of the foam, the thermal resistance from the heat source to the heat sink by way of the foam is less than the thermal resistance by way of any other heat-conduction path from the heat source to the heat sink which does not pass through the foam.