A method of manufacturing a radio frequency inlay, said method comprising: providing a substrate defining a substrate plane, and an integrated circuit positioned on said substrate or in a recess formed on said substrate, and a pair of terminal areas associated with said integrated circuit; affixing a wire to said substrate, said affixing step including the steps of: (i) positioning a first end portion of said wire on said substrate laterally offset from and not electrically connected to said terminal areas; (ii) affixing a portion of the wire to the substrate to form the windings of an antenna; (iii) positioning a second end portion of said wire on said substrate laterally offset from and not electrically connected to said terminal areas; (iv) repositioning the first end portion of said wire such that at least some of said first end position is positioned over or in contact with a first terminal area of the integrated circuit; (v) repositioning the second end portion of said wire such that at least some portion of said second end portion is positioned over or in contact with a second terminal area of the integrated circuit and (vi) electrically connecting said at least some of said first and second end portions of wire to the corresponding terminal areas. providing a substrate defining a substrate plane, and an integrated circuit positioned on said substrate or in a recess formed on said substrate, and a pair of terminal areas associated with said integrated circuit; affixing a wire to said substrate, said affixing step including the steps of: (i) positioning a first end portion of said wire on said substrate laterally offset from and not electrically connected to said terminal areas; (ii) affixing a portion of the wire to the substrate to form the windings of an antenna; (iii) positioning a second end portion of said wire on said substrate laterally offset from and not electrically connected to said terminal areas; (iv) repositioning the first end portion of said wire such that at least some of said first end position is positioned over or in contact with a first terminal area of the integrated circuit; (v) repositioning the second end portion of said wire such that at least some portion of said second end portion is positioned over or in contact with a second terminal area of the integrated circuit and (vi) electrically connecting said at least some of said first and second end portions of wire to the corresponding terminal areas. (i) positioning a first end portion of said wire on said substrate laterally offset from and not electrically connected to said terminal areas; (ii) affixing a portion of the wire to the substrate to form the windings of an antenna; (iii) positioning a second end portion of said wire on said substrate laterally offset from and not electrically connected to said terminal areas; (iv) repositioning the first end portion of said wire such that at least some of said first end position is positioned over or in contact with a first terminal area of the integrated circuit; (v) repositioning the second end portion of said wire such that at least some portion of said second end portion is positioned over or in contact with a second terminal area of the integrated circuit and (vi) electrically connecting said at least some of said first and second end portions of wire to the corresponding terminal areas.