A method of manufacturing a first component carrier and a second component carrier, the method comprising: providing a separation component comprising a first separation surface and a second separation surface being opposed to the first separation surface; coupling a first base structure having a first cavity with the first separation surface; coupling a second base structure having a second cavity with the second separation surface; placing a first electronic component in the first cavity; connecting the first base structure with the first electronic component to form the first component carrier; placing a second electronic component in the second cavity; connecting the second base structure with the second electronic component to form the second component carrier; separating the first component carrier from the first separation surface of the separation component; separating the second component carrier from the second separation surface of the separation component; forming a first electrically insulating layer on the first separation surface before coupling the first base structure with the first separation surface, and afterwards attaching the first base structure on the first electrically insulating layer; and forming a second electrically insulating layer on the second separation surface before coupling the second base structure with the second separation surface, and afterwards attaching the second base structure on the second electrically insulating layer; characterized in that the electrically insulating layers (130, 140) have a larger area size than the separation component and the separation component is laminated at the sides with the electrically insulating layers (130, 140), such that the sidewalls of the separation component are covered. providing a separation component comprising a first separation surface and a second separation surface being opposed to the first separation surface; coupling a first base structure having a first cavity with the first separation surface; coupling a second base structure having a second cavity with the second separation surface; placing a first electronic component in the first cavity; connecting the first base structure with the first electronic component to form the first component carrier; placing a second electronic component in the second cavity; connecting the second base structure with the second electronic component to form the second component carrier; separating the first component carrier from the first separation surface of the separation component; separating the second component carrier from the second separation surface of the separation component; forming a first electrically insulating layer on the first separation surface before coupling the first base structure with the first separation surface, and afterwards attaching the first base structure on the first electrically insulating layer; and forming a second electrically insulating layer on the second separation surface before coupling the second base structure with the second separation surface, and afterwards attaching the second base structure on the second electrically insulating layer; characterized in that the electrically insulating layers (130, 140) have a larger area size than the separation component and the separation component is laminated at the sides with the electrically insulating layers (130, 140), such that the sidewalls of the separation component are covered.