A display substrate, comprising: a base substrate (1000, 2000), comprising a display region and a bonding region (1200, 2200) located at least one side of the display region; a plurality of sub-pixels (110, 210), located in the display region; a plurality of data lines, located in the display region and configured to provide data signals to the plurality of sub-pixels (110, 210); a plurality of data leads (1220, 2220), located in the bonding region (1200, 2200) and electrically connected with the plurality of data lines; at least one group of contact pads, located in the bonding region (1200, 2200), wherein the at least one group of contact pads comprise a plurality of contact pads (1210, 2210), at least one of the plurality of contact pads (1210, 2210) comprises a first contact pad metal layer (1215, 2215) and a second contact pad metal layer (1217, 2217), the first contact pad metal layer (1215, 2215) is located on a side of the plurality of data leads (1220, 2220) away from the base substrate (1000, 2000) and is electrically connected with one of the plurality of data leads (1220, 2220), the second contact pad metal layer (1217, 2217) is located on a side of the first contact pad metal layer (1215, 2215) away from the base substrate (1000, 2000)and is electrically connected with the first contact pad metal layer (1215, 2215), and the second contact pad metal layer (1217, 2217) covers an edge of the first contact pad metal layer (1215, 2215); and a first insulation layer (1230, 2230), located in the bonding region (1200, 2200), wherein the first insulation layer (1230, 2230) is located in gaps between the plurality of contact pads (1210, 2210) and covers edges of the plurality of contact pads (1210, 2210), and is configured to expose surfaces of the plurality of contact pads (1210, 2210) facing away from the base substrate (1000, 2000); characterized by further comprising: a bonding region third insulation layer, wherein the bonding region third insulation layer is located in the bonding region, and is provided on a side of the first insulation layer and the plurality of contact pads away from the base substrate, and the bonding region third insulation layer comprises third contact pad via holes to expose surfaces of the plurality of the contact pads, and wherein the bonding region third insulation layer covers the first insulation layer and further covers and directly contacts at least portions of the plurality of contact pads. a base substrate (1000, 2000), comprising a display region and a bonding region (1200, 2200) located at least one side of the display region; a plurality of sub-pixels (110, 210), located in the display region; a plurality of data lines, located in the display region and configured to provide data signals to the plurality of sub-pixels (110, 210); a plurality of data leads (1220, 2220), located in the bonding region (1200, 2200) and electrically connected with the plurality of data lines; at least one group of contact pads, located in the bonding region (1200, 2200), wherein the at least one group of contact pads comprise a plurality of contact pads (1210, 2210), at least one of the plurality of contact pads (1210, 2210) comprises a first contact pad metal layer (1215, 2215) and a second contact pad metal layer (1217, 2217), the first contact pad metal layer (1215, 2215) is located on a side of the plurality of data leads (1220, 2220) away from the base substrate (1000, 2000) and is electrically connected with one of the plurality of data leads (1220, 2220), the second contact pad metal layer (1217, 2217) is located on a side of the first contact pad metal layer (1215, 2215) away from the base substrate (1000, 2000)and is electrically connected with the first contact pad metal layer (1215, 2215), and the second contact pad metal layer (1217, 2217) covers an edge of the first contact pad metal layer (1215, 2215); and a first insulation layer (1230, 2230), located in the bonding region (1200, 2200), wherein the first insulation layer (1230, 2230) is located in gaps between the plurality of contact pads (1210, 2210) and covers edges of the plurality of contact pads (1210, 2210), and is configured to expose surfaces of the plurality of contact pads (1210, 2210) facing away from the base substrate (1000, 2000); characterized by further comprising: a bonding region third insulation layer, wherein the bonding region third insulation layer is located in the bonding region, and is provided on a side of the first insulation layer and the plurality of contact pads away from the base substrate, and the bonding region third insulation layer comprises third contact pad via holes to expose surfaces of the plurality of the contact pads, and wherein the bonding region third insulation layer covers the first insulation layer and further covers and directly contacts at least portions of the plurality of contact pads. a bonding region third insulation layer, wherein the bonding region third insulation layer is located in the bonding region, and is provided on a side of the first insulation layer and the plurality of contact pads away from the base substrate, and the bonding region third insulation layer comprises third contact pad via holes to expose surfaces of the plurality of the contact pads, and wherein the bonding region third insulation layer covers the first insulation layer and further covers and directly contacts at least portions of the plurality of contact pads.