A combination of a soldering iron and a soldering iron control device with connection to the soldering iron and for controlling a temperature of a tip of the soldering iron, the soldering iron including: a handle part; being characterised in that the soldering iron further comprises cartridge that is attachable to and detachable from the handle part and includes the tip and a nonvolatile memory, the nonvolatile memory storing dedication information indicating whether the cartridge is dedicated to leaded solder or dedicated to lead-free solder, and in that the soldering iron control device further comprises: an input unit configured to make an input to select whether to use the soldering iron control device for the leaded solder or the lead-free solder; a setting unit configured to make a first setting to use the soldering iron control device for the leaded solder when the input to use the soldering iron control device for the leaded solder is made by using the input unit, the setting unit being configured to make a second setting to use the soldering iron control device for the lead-free solder when the input to use the soldering iron control device for the lead-free solder is made by using the input unit; a communication unit configured to receive the dedication information read from the nonvolatile memory; and a notification unit configured to make a notification when the first setting is made by the setting unit and the dedication information indicates that the cartridge is dedicated to the lead-free solder, or when the second setting is made by the setting unit and the dedication information indicates that the cartridge is dedicated to the leaded solder. the soldering iron including: a handle part; being characterised in that the soldering iron further comprises cartridge that is attachable to and detachable from the handle part and includes the tip and a nonvolatile memory, the nonvolatile memory storing dedication information indicating whether the cartridge is dedicated to leaded solder or dedicated to lead-free solder, and in that the soldering iron control device further comprises: an input unit configured to make an input to select whether to use the soldering iron control device for the leaded solder or the lead-free solder; a setting unit configured to make a first setting to use the soldering iron control device for the leaded solder when the input to use the soldering iron control device for the leaded solder is made by using the input unit, the setting unit being configured to make a second setting to use the soldering iron control device for the lead-free solder when the input to use the soldering iron control device for the lead-free solder is made by using the input unit; a communication unit configured to receive the dedication information read from the nonvolatile memory; and a notification unit configured to make a notification when the first setting is made by the setting unit and the dedication information indicates that the cartridge is dedicated to the lead-free solder, or when the second setting is made by the setting unit and the dedication information indicates that the cartridge is dedicated to the leaded solder. an input unit configured to make an input to select whether to use the soldering iron control device for the leaded solder or the lead-free solder; a setting unit configured to make a first setting to use the soldering iron control device for the leaded solder when the input to use the soldering iron control device for the leaded solder is made by using the input unit, the setting unit being configured to make a second setting to use the soldering iron control device for the lead-free solder when the input to use the soldering iron control device for the lead-free solder is made by using the input unit; a communication unit configured to receive the dedication information read from the nonvolatile memory; and a notification unit configured to make a notification when the first setting is made by the setting unit and the dedication information indicates that the cartridge is dedicated to the lead-free solder, or when the second setting is made by the setting unit and the dedication information indicates that the cartridge is dedicated to the leaded solder.