mhurhangee/ep-ind-claims huggingface dataset:
A method for manufacturing an integrated circuit, the method comprising: providing a plurality of fuses on the IC, each of the plurality of fuses having an associated value; positioning a configuration logic cell on the IC, the configuration logic cell being coupled to the plurality of fuses, wherein the configuration logic cell configures the IC based upon the values of the plurality of fuses; wherein the plurality of fuses includes at least one of: a physical die fuse present on a die of the IC, wherein the value of the die fuse is permanently set by a process comprising laser cutting before packaging of the IC; a physical substrate fuse present on a substrate of the IC, wherein the value of the substrate fuse is permanently set by a process comprising laser cutting before and after packaging of the IC; a memory component fuse comprising logic values stored in a memory location of the IC; and software fuses comprising logic values written to register bit fields in an internal register of the IC; and logically combining values of at least two of the fuses to configure the IC. providing a plurality of fuses on the IC, each of the plurality of fuses having an associated value; positioning a configuration logic cell on the IC, the configuration logic cell being coupled to the plurality of fuses, wherein the configuration logic cell configures the IC based upon the values of the plurality of fuses; wherein the plurality of fuses includes at least one of: a physical die fuse present on a die of the IC, wherein the value of the die fuse is permanently set by a process comprising laser cutting before packaging of the IC; a physical substrate fuse present on a substrate of the IC, wherein the value of the substrate fuse is permanently set by a process comprising laser cutting before and after packaging of the IC; a memory component fuse comprising logic values stored in a memory location of the IC; and software fuses comprising logic values written to register bit fields in an internal register of the IC; and a physical die fuse present on a die of the IC, wherein the value of the die fuse is permanently set by a process comprising laser cutting before packaging of the IC; a physical substrate fuse present on a substrate of the IC, wherein the value of the substrate fuse is permanently set by a process comprising laser cutting before and after packaging of the IC; a memory component fuse comprising logic values stored in a memory location of the IC; and software fuses comprising logic values written to register bit fields in an internal register of the IC; and logically combining values of at least two of the fuses to configure the IC.
Train control system having pulse-code-modulated cab signalling, in particular for defining travelling speeds, wherein a code generator (7.1, 7.2) applies pulses to a signal generator as a function of the direction of travel, the output signal of said signal generator being fed into a track circuit (4.1, 4.2, 4.3) covering a track section (3.1, 3.2, 3.3), characterised in that the signal generator has a transmitting device for modulating the input signals of the two code generators (7.1, 7.2) and in that the transmitting device is connected via travel-direction-specific outputs (11.1, 11.2) in each case to a track connection adaption device (10.1, 10.2) at one of the two entry ends (5.1, 5.2) of the track section (3.1, 3.2, 3.3).
A carbon baking heat recovery ring furnace, comprising: a plurality of wall elements, each having an internal flue channel, wherein the plurality of wall elements are fluidly coupled to each other such that the internal flue channels form a continuous flow path having, in sequence, a pre-heat zone, a firing zone, and a cooling zone; a bypass conduit fluidly coupled to the flue channel of the cooling zone and the flue channel of at least one of the firing zone and the pre-heat zone such that a portion of a heated cooling air stream in the flue channel of the cooling zone is directly delivered to the at least one of the firing zone and the pre-heat zone; and a plurality of gates coupled to the bypass conduit, wherein the plurality of gates and the bypass conduit are configured to allow flow of the portion of the heated cooling air stream without moving a zero point in the ring furnace. a plurality of wall elements, each having an internal flue channel, wherein the plurality of wall elements are fluidly coupled to each other such that the internal flue channels form a continuous flow path having, in sequence, a pre-heat zone, a firing zone, and a cooling zone; a bypass conduit fluidly coupled to the flue channel of the cooling zone and the flue channel of at least one of the firing zone and the pre-heat zone such that a portion of a heated cooling air stream in the flue channel of the cooling zone is directly delivered to the at least one of the firing zone and the pre-heat zone; and a plurality of gates coupled to the bypass conduit, wherein the plurality of gates and the bypass conduit are configured to allow flow of the portion of the heated cooling air stream without moving a zero point in the ring furnace.
A system for hemodialysis, comprising: a first dialysis system comprising: a dialyzer, a blood circuit configured to receive blood from a patient and circulate the blood through the dialyzer, and a dialysate circuit to circulate dialysate through the dialyzer to receive toxins removed from the blood, wherein the dialysate circuit comprises a filter with a sorbent material including activated carbon; and a second dialysis system, wherein components of the second dialysis system are releasably coupled to the first dialysis system to create a tethered system, the first dialysis system and the second dialysis system configured to be used in combination, in an alternating fashion, over a combined cycle, to provide hemodialysis for the patient, wherein the first dialysis system is configured to be worn by the patient during a first portion of the combined cycle, and wherein the second dialysis system is configured to be positioned on a support independent of the patient during a second portion of the combined cycle. a first dialysis system comprising: a dialyzer, a blood circuit configured to receive blood from a patient and circulate the blood through the dialyzer, and a dialysate circuit to circulate dialysate through the dialyzer to receive toxins removed from the blood, wherein the dialysate circuit comprises a filter with a sorbent material including activated carbon; and a dialyzer, a blood circuit configured to receive blood from a patient and circulate the blood through the dialyzer, and a dialysate circuit to circulate dialysate through the dialyzer to receive toxins removed from the blood, wherein the dialysate circuit comprises a filter with a sorbent material including activated carbon; and a second dialysis system, wherein components of the second dialysis system are releasably coupled to the first dialysis system to create a tethered system, the first dialysis system and the second dialysis system configured to be used in combination, in an alternating fashion, over a combined cycle, to provide hemodialysis for the patient, wherein the first dialysis system is configured to be worn by the patient during a first portion of the combined cycle, and wherein the second dialysis system is configured to be positioned on a support independent of the patient during a second portion of the combined cycle.
A method performed by a personal computer (100, 499), comprising: presenting, by the personal computer (100, 499) basic input/output system (BIOS), a reference to a partial operating system image file containing a function that allows the personal computer (100, 499) to connect to a network; connecting to a mobile device (110, 490) that has retrieved the partial operating system image file from a remote location based on the reference; receiving the partial operating system image file from the mobile device (110, 490); and initiating the partial operating system image file; connecting to a server and obtaining a complete operating system image file from the server. presenting, by the personal computer (100, 499) basic input/output system (BIOS), a reference to a partial operating system image file containing a function that allows the personal computer (100, 499) to connect to a network; connecting to a mobile device (110, 490) that has retrieved the partial operating system image file from a remote location based on the reference; receiving the partial operating system image file from the mobile device (110, 490); and initiating the partial operating system image file; connecting to a server and obtaining a complete operating system image file from the server.
A resin sheet containing a cellulose-based raw material, comprising main raw materials in a ratio in which a total thereof becomes 100 mass pts., the main raw materials consisting of: 50 to 60 mass pts. of a cellulose-based raw material having an average particle size of 20 to 100 μm; 18 to 30 mass pts. of a first polyolefin resin having a melt flow rate of 1 to 3 measured in accordance with JIS K7210-1: 2014 under conditions of a temperature of 230°C and a load of 2.16 kg; 5 to 26 mass pts. of a second polyolefin resin having the melt flow rate of 6 to 11; and 1 to 16 mass pts. of an elastomer having the melt flow rate of 6 to 10, wherein the first polyolefin resin and the second polyolefin resin have a bending elastic modulus measured in accordance with ASTM D790 of not less than 700 MPa, and the elastomer has the bending elastic modulus of not more than 200 MPa. 50 to 60 mass pts. of a cellulose-based raw material having an average particle size of 20 to 100 μm; 18 to 30 mass pts. of a first polyolefin resin having a melt flow rate of 1 to 3 measured in accordance with JIS K7210-1: 2014 under conditions of a temperature of 230°C and a load of 2.16 kg; 5 to 26 mass pts. of a second polyolefin resin having the melt flow rate of 6 to 11; and 1 to 16 mass pts. of an elastomer having the melt flow rate of 6 to 10, wherein the first polyolefin resin and the second polyolefin resin have a bending elastic modulus measured in accordance with ASTM D790 of not less than 700 MPa, and the elastomer has the bending elastic modulus of not more than 200 MPa.
A wheel support bearing assembly including an outer member having an inner periphery formed with a plurality of raceways (3, 4) and an outer periphery formed with a vehicle body mounting portion, an inner member having an outer periphery formed with raceways (5, 6) cooperable and aligned with the raceways (3, 4) in the outer member, rows (Lo, Li) of rolling elements 7, 8) interposed between the raceways (3, 4) in the outer member and the raceways (5, 6) in the inner member, respectively, in which the outer periphery of the inner member is formed with a wheel fitting hub flange defined on an outboard side and the inner member includes a hub axle having an inner race mount defined on an inboard side and radially inwardly stepped to provide a reduced diameter, and an inner race member mounted on the inner race mount, with the raceways (5, 6) in the inner member defined in the hub axle and the inner race member, respectively, wherein an outer diameter of the hub axle as measured at a mid-point between the rows of the rolling elements on the outboard and inboard sides, respectively, is chosen to be greater than a minimum available diameter of the raceway on the inboard side, and the inner race member is formed with, on an outboard side of the inboard raceway thereof, a reduced diameter portion having an outer diameter smaller than the minimum diameter of the raceway on the inboard side.
A semiconductor light emitting device comprising: a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a plurality of isolation layers (120, 124) formed along an outer peripheral portion of the light emitting structure below the light emitting structure; and a second electrode layer formed below the light emitting structure, wherein the isolation layers (120, 124) include: a first isolation layer having an inner portion and an outer portion, wherein the inner portion is provided along an outer peripheral portion of the light emitting structure below the second conductivity type semiconductor layer and the outer portion is exposed to an outside of the light emitting structure and the second conductive semiconductor layer and extends outward the light emitting structure; and wherein the outer region of the light emitting structure is exposed; characterised in that it further comprises a metal layer interposed between the isolation layers (120, 124); wherein the first isolation layer has an inner portion interposed between the outer peripheral portion of the light emitting structure below the second conductivity type semiconductor layer and the metal layer; wherein the second isolation layer is formed below the metal layer; and wherein each of the isolation layers (120, 124) is formed of a conductive transmissive material. a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a plurality of isolation layers (120, 124) formed along an outer peripheral portion of the light emitting structure below the light emitting structure; and a second electrode layer formed below the light emitting structure, wherein the isolation layers (120, 124) include: a first isolation layer having an inner portion and an outer portion, wherein the inner portion is provided along an outer peripheral portion of the light emitting structure below the second conductivity type semiconductor layer and the outer portion is exposed to an outside of the light emitting structure and the second conductive semiconductor layer and extends outward the light emitting structure; and wherein the outer region of the light emitting structure is exposed; a first isolation layer having an inner portion and an outer portion, wherein the inner portion is provided along an outer peripheral portion of the light emitting structure below the second conductivity type semiconductor layer and the outer portion is exposed to an outside of the light emitting structure and the second conductive semiconductor layer and extends outward the light emitting structure; and wherein the outer region of the light emitting structure is exposed;
A method of producing a lighting device, the method comprising: - providing a light transmissive window having a first window side and a second window side; - 3D printing a reflector cavity wall comprising a light reflective material to the first window side, to provide a reflector cavity, the reflector cavity comprising a first reflector cavity side, a reflector cavity exit side, a reflector cavity wall bridging said first reflector cavity side and said reflector cavity exit side; and 3D printing a beam modifying element at the first window side, to provide said beam modifying element within the reflector cavity; and - providing a light source at the first reflector cavity side, the light source being configured to provide light source light within said reflector cavity. - providing a light transmissive window having a first window side and a second window side; - 3D printing a reflector cavity wall comprising a light reflective material to the first window side, to provide a reflector cavity, the reflector cavity comprising a first reflector cavity side, a reflector cavity exit side, a reflector cavity wall bridging said first reflector cavity side and said reflector cavity exit side; and 3D printing a beam modifying element at the first window side, to provide said beam modifying element within the reflector cavity; and - providing a light source at the first reflector cavity side, the light source being configured to provide light source light within said reflector cavity.
A light-emitting device assembly, comprising: a plurality of LED chips, each LED chip comprising a plurality of bonding pads for power input; a plurality of transparent substrates discretely arranged under the plurality of LED chips, and connected to a flexible substrate. a metal seed layer respectively formed on and directly contacting the plurality of substrates; a plurality of contacting electrodes located under the plurality of LED chips, arranged to contact the metal seed layer, and physically and electrically connecting the plurality of LED chips via the plurality of bonding pads; and an extendable metal line located between adjacent LED chips and connected to the plurality of contacting electrodes; wherein the extendable metal line has a portion not overlapping with the plurality of substrates and the metal seed layer, and wherein the metal seed layer has a smaller width than the contacting electrodes. a plurality of LED chips, each LED chip comprising a plurality of bonding pads for power input; a plurality of transparent substrates discretely arranged under the plurality of LED chips, and connected to a flexible substrate. a metal seed layer respectively formed on and directly contacting the plurality of substrates; a plurality of contacting electrodes located under the plurality of LED chips, arranged to contact the metal seed layer, and physically and electrically connecting the plurality of LED chips via the plurality of bonding pads; and an extendable metal line located between adjacent LED chips and connected to the plurality of contacting electrodes; wherein the extendable metal line has a portion not overlapping with the plurality of substrates and the metal seed layer, and wherein the metal seed layer has a smaller width than the contacting electrodes.
A display apparatus, comprising: a power source unit configured to receive power from a power source and generate a panel power voltage and a logic voltage (VDDI); a panel configured to operate in a normal mode or a low power display mode; a power supplying unit adapted to generate a first high voltage (ELVDD1) and a first low voltage (ELVSS1) based on the panel power voltage, wherein the first high voltage and the first low voltage are first power voltages, and output the first power voltages to the panel in the normal mode; and a driving integrated circuit configured to: select at least one input voltage from among a plurality of input voltages according to a display mode and generate a second high voltage (ELVDD2) and a second low voltage (ELVSS2) on the basis of the selected at least one input voltage, wherein the second high voltage and the second low voltage are second power voltages; and output the second power voltages to the panel in the low power display mode, wherein the selected at least one input voltage are the panel power voltage and either the logic voltage or a touch voltage, the touch voltage being output by the power source unit. a power source unit configured to receive power from a power source and generate a panel power voltage and a logic voltage (VDDI); a panel configured to operate in a normal mode or a low power display mode; a power supplying unit adapted to generate a first high voltage (ELVDD1) and a first low voltage (ELVSS1) based on the panel power voltage, wherein the first high voltage and the first low voltage are first power voltages, and output the first power voltages to the panel in the normal mode; and a driving integrated circuit configured to: select at least one input voltage from among a plurality of input voltages according to a display mode and generate a second high voltage (ELVDD2) and a second low voltage (ELVSS2) on the basis of the selected at least one input voltage, wherein the second high voltage and the second low voltage are second power voltages; and output the second power voltages to the panel in the low power display mode, wherein the selected at least one input voltage are the panel power voltage and either the logic voltage or a touch voltage, the touch voltage being output by the power source unit. select at least one input voltage from among a plurality of input voltages according to a display mode and generate a second high voltage (ELVDD2) and a second low voltage (ELVSS2) on the basis of the selected at least one input voltage, wherein the second high voltage and the second low voltage are second power voltages; and output the second power voltages to the panel in the low power display mode, wherein the selected at least one input voltage are the panel power voltage and either the logic voltage or a touch voltage, the touch voltage being output by the power source unit.
A power supply circuit, comprising: an input for receiving a power supply from a battery; a switched capacitor DC/DC converter for supplying a converted voltage to a load having a known, burst mode, current profile; a regulator (110,120) comprising a controller configured to controlling an output resistance of the DC/DC converter by adjusting the DC/DC converter switching frequency and adjusting the DC/DC converter capacitance, thereby controlling the DC/DC converter to reduce a ripple in the current drawn by the converter from the battery; and a charge storage device at the output of the DC/DC converter for delivering a non-constant current (I OUT) to the load. an input for receiving a power supply from a battery; a switched capacitor DC/DC converter for supplying a converted voltage to a load having a known, burst mode, current profile; a regulator (110,120) comprising a controller configured to controlling an output resistance of the DC/DC converter by adjusting the DC/DC converter switching frequency and adjusting the DC/DC converter capacitance, thereby controlling the DC/DC converter to reduce a ripple in the current drawn by the converter from the battery; and a charge storage device at the output of the DC/DC converter for delivering a non-constant current (I OUT) to the load.
A surgical instrument, comprising: (a) a battery pack, wherein the battery pack includes a latching feature; (b) a battery port, wherein the battery port is configured to receive the battery pack, wherein the battery port includes a restraining feature; wherein the restraining feature is configured to securely engage the latching feature when the battery port receives the battery pack such that the battery pack becomes fixedly attached to the battery port; and wherein at least a portion of the battery port is configured to permanently deform or break upon the removal of the battery pack from the battery port such that the surgical instrument becomes inoperable, characterized in that the battery port further comprises a weakened portion, wherein the weakened portion is integral with the battery port, wherein the weakened portion is positioned along a base of the battery port, wherein the weakened portion is configured to permanently deform upon removal of the battery pack from the battery port such that the battery pack and the battery port are jointly detached from the surgical instrument at the weakened portion and along the base. (a) a battery pack, wherein the battery pack includes a latching feature; (b) a battery port, wherein the battery port is configured to receive the battery pack, wherein the battery port includes a restraining feature;
An implantable medical device at least comprising: an acousto-optic transducer; a photodetector; and an optical communication channel connecting an output Of the acousto-optic transducer to an input of the photodetector. an acousto-optic transducer; a photodetector; and an optical communication channel connecting an output Of the acousto-optic transducer to an input of the photodetector.