A cooling structure (10A- 10F) for an electronic device incorporating a heat generating component, the cooling structure (10A- 10F) comprising: a housing provided with an air inlet and an air outlet; a fan for generating, in the housing, a flow of air travelling from the air inlet to the air outlet; a circuit board disposed in the housing, the heat generating component being mounted on one surface of the circuit board; and a heat release member disposed between the heat generating component and a (opposite) wall of the housing facing the heat generating component, the heat release member having fins arranged on the (opposite) wall of the housing forming a flow passage through which the air flowing in the housing passes, and a heat transfer plate for transferring heat generated in the heat generating component to the fins, wherein the heat release member extends, in an arrangement direction of the fins, beyond both sides of the heat generating component, characterised in that the cooling structure (10A- 10F) satisfies one of items to below. Between the (opposite) wall of the housing and the fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component, a resistant layer for suppressing heat transfer from the fins to the (opposite) wall of the housing is formed. Each of the fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component has a through hole penetrating through the fin in a thickness direction of the fin. An arrangement pitch of fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component is larger than an arrangement pitch of fins that are located outside the intermediate zone. a housing provided with an air inlet and an air outlet; a fan for generating, in the housing, a flow of air travelling from the air inlet to the air outlet; a circuit board disposed in the housing, the heat generating component being mounted on one surface of the circuit board; and a heat release member disposed between the heat generating component and a (opposite) wall of the housing facing the heat generating component, the heat release member having fins arranged on the (opposite) wall of the housing forming a flow passage through which the air flowing in the housing passes, and a heat transfer plate for transferring heat generated in the heat generating component to the fins, wherein the heat release member extends, in an arrangement direction of the fins, beyond both sides of the heat generating component, characterised in that the cooling structure (10A- 10F) satisfies one of items to below. Between the (opposite) wall of the housing and the fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component, a resistant layer for suppressing heat transfer from the fins to the (opposite) wall of the housing is formed. Each of the fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component has a through hole penetrating through the fin in a thickness direction of the fin. An arrangement pitch of fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component is larger than an arrangement pitch of fins that are located outside the intermediate zone. Between the (opposite) wall of the housing and the fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component, a resistant layer for suppressing heat transfer from the fins to the (opposite) wall of the housing is formed. Each of the fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component has a through hole penetrating through the fin in a thickness direction of the fin. An arrangement pitch of fins, among the fins, that are located in an intermediate zone including a region corresponding to the heat generating component is larger than an arrangement pitch of fins that are located outside the intermediate zone.