An implantable control module (102, 102', 402, 702, 1102) for an electrical stimulation system (100, 1200), the control module comprising: a sealed casing (408, 708) defining an outer surface and an inner space, the outer surface of the casing comprising at least one electrically-conductive portion; an electronic subassembly (110, 406, 706, 1210) disposed in the inner space of the casing, the electronic subassembly comprising a pulse generator; a sealed feedthrough housing (430, 730, 1030) disposed along a portion of the casing, the feedthrough housing having an outer surface comprising at least one electrically-conductive portion, wherein the at least one electrically-conductive portion of the feedthrough housing is electrically coupled to the at least one electrically-conductive portion of the casing; a plurality of feedthrough pins (440, 1040) each having a first end and an opposing second end, the plurality of feedthrough pins extending through the feedthrough housing with the first ends of each of the plurality of feedthrough pins disposed external to the casing and the second end of each of the plurality of feedthrough pins extending into the casing; a plurality of conductive pathways (434, 734, 1034) disposed in the casing, each of the plurality of conductive pathways electrically coupling a different one of the plurality of feedthrough pins to the electronic subassembly; a non-conductive substrate disposed in the casing, wherein at least a portion of each of the plurality of conductive pathways extends along at least a portion of the non-conductive substrate; and an RF-diverting assembly (501, 601, 901, 1001) disposed in the casing, the RF-diverting assembly comprising a feedthrough ground (602, 902, 1002) soldered or adhesively coupled to the non-conductive substrate and electrically coupled to the at least one electrically-conductive portion of the feedthrough housing, a plurality of conductive pads (604, 904) attached to the non-conductive substrate, wherein each of the conductive pads is electrically coupled to a different one of the plurality of conductive pathways extending along the non-conductive substrate and comprises an aperture for receiving a portion of one of the feedthrough pins, and a plurality of capacitive elements (606, 906, 1006) each coupling a different one of the plurality of conductive pads to the feedthrough ground. a sealed casing (408, 708) defining an outer surface and an inner space, the outer surface of the casing comprising at least one electrically-conductive portion; an electronic subassembly (110, 406, 706, 1210) disposed in the inner space of the casing, the electronic subassembly comprising a pulse generator; a sealed feedthrough housing (430, 730, 1030) disposed along a portion of the casing, the feedthrough housing having an outer surface comprising at least one electrically-conductive portion, wherein the at least one electrically-conductive portion of the feedthrough housing is electrically coupled to the at least one electrically-conductive portion of the casing; a plurality of feedthrough pins (440, 1040) each having a first end and an opposing second end, the plurality of feedthrough pins extending through the feedthrough housing with the first ends of each of the plurality of feedthrough pins disposed external to the casing and the second end of each of the plurality of feedthrough pins extending into the casing; a plurality of conductive pathways (434, 734, 1034) disposed in the casing, each of the plurality of conductive pathways electrically coupling a different one of the plurality of feedthrough pins to the electronic subassembly; a non-conductive substrate disposed in the casing, wherein at least a portion of each of the plurality of conductive pathways extends along at least a portion of the non-conductive substrate; and an RF-diverting assembly (501, 601, 901, 1001) disposed in the casing, the RF-diverting assembly comprising a feedthrough ground (602, 902, 1002) soldered or adhesively coupled to the non-conductive substrate and electrically coupled to the at least one electrically-conductive portion of the feedthrough housing, a plurality of conductive pads (604, 904) attached to the non-conductive substrate, wherein each of the conductive pads is electrically coupled to a different one of the plurality of conductive pathways extending along the non-conductive substrate and comprises an aperture for receiving a portion of one of the feedthrough pins, and a plurality of capacitive elements (606, 906, 1006) each coupling a different one of the plurality of conductive pads to the feedthrough ground. a feedthrough ground (602, 902, 1002) soldered or adhesively coupled to the non-conductive substrate and electrically coupled to the at least one electrically-conductive portion of the feedthrough housing, a plurality of conductive pads (604, 904) attached to the non-conductive substrate, wherein each of the conductive pads is electrically coupled to a different one of the plurality of conductive pathways extending along the non-conductive substrate and comprises an aperture for receiving a portion of one of the feedthrough pins, and a plurality of capacitive elements (606, 906, 1006) each coupling a different one of the plurality of conductive pads to the feedthrough ground.