An electronic device, comprising: a housing including a front plate, a back plate facing away from the front plate, and a side member surrounding a space between the front plate and the back plate, the side member including a plurality of non-conductive portions and a conductive portion inserted in contact between the non-conductive portions along at least a portion of a side surface of the side member; a display module exposed through the front plate; at least one wireless communication circuit electrically connected with the conductive portion; a printed circuit board, PCB, positioned between the display module and the back plate; and a camera assembly mounted on the PCB such that the camera assembly is interposed between the PCB and the back plate while exposed through a portion of the back plate, wherein the camera assembly includes: an image sensor mounted on the PCB; a plurality of lenses stacked over one another between the image sensor and the portion of the back plate; a barrel positioned between the PCB and the back plate while laterally surrounding the plurality of lenses; a camera bracket positioned between the PCB and the back plate while laterally surrounding at least part of the barrel; a metal case positioned between the PCB and the back plate while laterally surrounding at least part of the camera assembly, the metal case being electrically floating; and a shielding structure interposed between the camera bracket and the metal case while being spaced from the metal case, the shielding structure being electrically connected to ground. a housing including a front plate, a back plate facing away from the front plate, and a side member surrounding a space between the front plate and the back plate, the side member including a plurality of non-conductive portions and a conductive portion inserted in contact between the non-conductive portions along at least a portion of a side surface of the side member; a display module exposed through the front plate; at least one wireless communication circuit electrically connected with the conductive portion; a printed circuit board, PCB, positioned between the display module and the back plate; and a camera assembly mounted on the PCB such that the camera assembly is interposed between the PCB and the back plate while exposed through a portion of the back plate, wherein the camera assembly includes: an image sensor mounted on the PCB; a plurality of lenses stacked over one another between the image sensor and the portion of the back plate; a barrel positioned between the PCB and the back plate while laterally surrounding the plurality of lenses; a camera bracket positioned between the PCB and the back plate while laterally surrounding at least part of the barrel; a metal case positioned between the PCB and the back plate while laterally surrounding at least part of the camera assembly, the metal case being electrically floating; and a shielding structure interposed between the camera bracket and the metal case while being spaced from the metal case, the shielding structure being electrically connected to ground. an image sensor mounted on the PCB; a plurality of lenses stacked over one another between the image sensor and the portion of the back plate; a barrel positioned between the PCB and the back plate while laterally surrounding the plurality of lenses; a camera bracket positioned between the PCB and the back plate while laterally surrounding at least part of the barrel; a metal case positioned between the PCB and the back plate while laterally surrounding at least part of the camera assembly, the metal case being electrically floating; and a shielding structure interposed between the camera bracket and the metal case while being spaced from the metal case, the shielding structure being electrically connected to ground.