An optical illuminator module comprising: a) a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) (202, 302) forming a two-dimensional array (111, 209, 309, 409, 509, 609, 709) constructed on a common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701) having a bottom surface comprising a bottom contact forming a first terminal of the two-dimensional array and a top surface comprising a top contact forming a second terminal of the two-dimensional array, the plurality of VCSELs generating an optical output beam (114, 308) that propagates from the top surface of the common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701); and b) a submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) having a first surface comprising a plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) electrically isolated from each other and a second surface that is opposite the first surface, the second surface comprising a plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) electrically isolated from each other, wherein a first respective one of the plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) on the first surface is electrically connected to a first respective one of the plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) on the second surface with a first plurality of via holes (311, 411, 511, 611, 1111, 2005); wherein the bottom contact of the common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701) is electrically connected to the first respective one of the plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) on the first surface of the submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) such that the two-dimensional array is in thermal contact with the submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001), and the top contact of the common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701) is electrically connected to a second respective one of the plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) on the first surface of the submount, characterised in that the second respective one of the plurality of bonding pads on the first surface is electrically connected to a second one of the plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) on the second surface with a second plurality of via holes (311, 411, 511, 611, 1111, 2005). a) a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) (202, 302) forming a two-dimensional array (111, 209, 309, 409, 509, 609, 709) constructed on a common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701) having a bottom surface comprising a bottom contact forming a first terminal of the two-dimensional array and a top surface comprising a top contact forming a second terminal of the two-dimensional array, the plurality of VCSELs generating an optical output beam (114, 308) that propagates from the top surface of the common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701); and b) a submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) having a first surface comprising a plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) electrically isolated from each other and a second surface that is opposite the first surface, the second surface comprising a plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) electrically isolated from each other, wherein a first respective one of the plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) on the first surface is electrically connected to a first respective one of the plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) on the second surface with a first plurality of via holes (311, 411, 511, 611, 1111, 2005);