A Doherty amplifier comprising: a module substrate having a top substrate surface; a first surface-mount device coupled to the top substrate surface, wherein the first surface-mount device includes a first amplifier die; a second surface-mount device coupled to the top substrate surface, wherein the second surface-mount device includes a second amplifier die; and an impedance inverter line assembly (172, 772) electrically connected between outputs (138, 158) of the first and second amplifier dies, wherein the impedance inverter line assembly (172, 772) includes: an impedance inverter line coupled to the module substrate, wherein the impedance inverter line has a first end configured to be coupled to the output (138, 158) of one of the first or second amplifier dies and a second end configured to be coupled to the output (158, 138) of the other one of the first or second amplifier dies, and wherein the electrical length of the impedance inverter line has a value that is less than 90 degrees; a first lead of the first surface-mount device with a proximal end electrically coupled to an output of the first amplifier die, and a distal end coupled to the first end of the impedance inverter line, wherein the first lead is a first vertical conductor that conducts a first electrical signal between the proximal and distal ends of the first lead in a direction that is angularly offset from a primary direction of signal conduction through the first amplifier die, and a second lead of the second surface-mount device with a proximal end electrically coupled to an output of the second amplifier die, and a distal end coupled to the second end of the impedance inverter line, wherein the second lead is a second vertical conductor that conducts a second electrical signal between the proximal and distal ends of the second lead in a direction that is angularly offset from a primary direction of signal conduction through the second amplifier die; and wherein the first and second leads are configured as portions of the impedance inverter line assembly to facilitate optimal signal combining. a module substrate having a top substrate surface; a first surface-mount device coupled to the top substrate surface, wherein the first surface-mount device includes a first amplifier die; a second surface-mount device coupled to the top substrate surface, wherein the second surface-mount device includes a second amplifier die; and an impedance inverter line assembly (172, 772) electrically connected between outputs (138, 158) of the first and second amplifier dies, wherein the impedance inverter line assembly (172, 772) includes: an impedance inverter line coupled to the module substrate, wherein the impedance inverter line has a first end configured to be coupled to the output (138, 158) of one of the first or second amplifier dies and a second end configured to be coupled to the output (158, 138) of the other one of the first or second amplifier dies, and wherein the electrical length of the impedance inverter line has a value that is less than 90 degrees; a first lead of the first surface-mount device with a proximal end electrically coupled to an output of the first amplifier die, and a distal end coupled to the first end of the impedance inverter line, wherein the first lead is a first vertical conductor that conducts a first electrical signal between the proximal and distal ends of the first lead in a direction that is angularly offset from a primary direction of signal conduction through the first amplifier die, and a second lead of the second surface-mount device with a proximal end electrically coupled to an output of the second amplifier die, and a distal end coupled to the second end of the impedance inverter line, wherein the second lead is a second vertical conductor that conducts a second electrical signal between the proximal and distal ends of the second lead in a direction that is angularly offset from a primary direction of signal conduction through the second amplifier die; and wherein the first and second leads are configured as portions of the impedance inverter line assembly to facilitate optimal signal combining. an impedance inverter line coupled to the module substrate, wherein the impedance inverter line has a first end configured to be coupled to the output (138, 158) of one of the first or second amplifier dies and a second end configured to be coupled to the output (158, 138) of the other one of the first or second amplifier dies, and wherein the electrical length of the impedance inverter line has a value that is less than 90 degrees; a first lead of the first surface-mount device with a proximal end electrically coupled to an output of the first amplifier die, and a distal end coupled to the first end of the impedance inverter line, wherein the first lead is a first vertical conductor that conducts a first electrical signal between the proximal and distal ends of the first lead in a direction that is angularly offset from a primary direction of signal conduction through the first amplifier die, and a second lead of the second surface-mount device with a proximal end electrically coupled to an output of the second amplifier die, and a distal end coupled to the second end of the impedance inverter line, wherein the second lead is a second vertical conductor that conducts a second electrical signal between the proximal and distal ends of the second lead in a direction that is angularly offset from a primary direction of signal conduction through the second amplifier die; and wherein the first and second leads are configured as portions of the impedance inverter line assembly to facilitate optimal signal combining.