Optoelectronic component, comprising - an optoelectronic chip, - an integrally embodied chip carrier having a central region, on which the chip is fixed, and having exactly four electrical connections (41, 42, 43, 44) running outwards proceeding from the central region of the chip carrier, - exactly two further electrical connections (48, 49) separated from the chip carrier, wherein - the chip and parts of the chip carrier are encapsulated by a body, - the body comprises a housing, which has a depression having a base, - a radiation-transmissive encapsulation is arranged in the depression, the chip being embedded into said encapsulation, - the projection of the encapsulation onto the contact plane between the chip and the chip carrier is point-symmetrical with respect to the projection of the midpoint of the chip, - the projection of the body and of longitudinal sinter axes (61, 62, 63, 64) of the electrical connections (41, 42, 43, 44) of the chip carrier to the contact plane is in each case point-symmetrical with respect to the projection of the midpoint of the chip, - the projection of the connections (41, 42, 43, 44) of the chip carrier and of the further connections (48, 49) onto the contact plane is point-symmetrical with respect to the projection of the midpoint of the chip and is also embodied axially symmetrically with respect to two axes (101, 102) of symmetry, such that the connections (41, 42, 43, 44) of the chip carrier and the further connections (48, 49) also have a double axial symmetry alongside a point symmetry, - the axes (101, 102) of symmetry in projection onto the contact plane are perpendicular to one another and run through the midpoint of the chip, - the chip carrier in projection onto the contact plane is in the shape of a St. Andrew's cross, and - the further connections (48, 49) lie on one of the axes of symmetry. - an optoelectronic chip, - an integrally embodied chip carrier having a central region, on which the chip is fixed, and having exactly four electrical connections (41, 42, 43, 44) running outwards proceeding from the central region of the chip carrier, - exactly two further electrical connections (48, 49) separated from the chip carrier, wherein - the chip and parts of the chip carrier are encapsulated by a body, - the body comprises a housing, which has a depression having a base, - a radiation-transmissive encapsulation is arranged in the depression, the chip being embedded into said encapsulation, - the projection of the encapsulation onto the contact plane between the chip and the chip carrier is point-symmetrical with respect to the projection of the midpoint of the chip, - the projection of the body and of longitudinal sinter axes (61, 62, 63, 64) of the electrical connections (41, 42, 43, 44) of the chip carrier to the contact plane is in each case point-symmetrical with respect to the projection of the midpoint of the chip, - the projection of the connections (41, 42, 43, 44) of the chip carrier and of the further connections (48, 49) onto the contact plane is point-symmetrical with respect to the projection of the midpoint of the chip and is also embodied axially symmetrically with respect to two axes (101, 102) of symmetry, such that the connections (41, 42, 43, 44) of the chip carrier and the further connections (48, 49) also have a double axial symmetry alongside a point symmetry, - the axes (101, 102) of symmetry in projection onto the contact plane are perpendicular to one another and run through the midpoint of the chip, - the chip carrier in projection onto the contact plane is in the shape of a St. Andrew's cross, and - the further connections (48, 49) lie on one of the axes of symmetry.