Electronic-component mounting machine comprising: a suction nozzle (60; 350; 406) configured to suck and hold an electronic component (220; 436) using negative pressure; and a nozzle advancing device comprising at least an actuator (84, 192), the electronic-component mounting machine being configured to: have the nozzle advancing device advance the suction nozzle holding the electronic component to press the electronic component against a substrate; and eliminate the negative pressure in the suction nozzle to release the electronic component and mount the electronic component on the substrate, the electronic-component mounting machine further comprising: a valve device provided between (i) the suction nozzle and (ii) a negative-pressure supply source configured to supply the negative pressure and a negative-pressure eliminating source (124, 125) configured to eliminate the negative pressure, the valve device being configured to control at least one of supply of the negative pressure to the suction nozzle and elimination of the negative pressure; and a control device (202; 252; 271; 543) configured to control the valve device and the nozzle advancing device, the control device comprising: a negative pressure eliminator (214; 254; 282; 544) configured to control the valve device to have the suction nozzle (60; 350; 406) release the electronic component (220; 436); and an elimination effect reducer (216; 256; 272; 546) configured to control the nozzle advancing device to eliminate at least a portion of effect of the negative-pressure elimination caused by the negative pressure eliminator, on a pressing force with which the electronic component is pressed against the substrate. a valve device provided between (i) the suction nozzle and (ii) a negative-pressure supply source configured to supply the negative pressure and a negative-pressure eliminating source (124, 125) configured to eliminate the negative pressure, the valve device being configured to control at least one of supply of the negative pressure to the suction nozzle and elimination of the negative pressure; and a control device (202; 252; 271; 543) configured to control the valve device and the nozzle advancing device, the control device comprising: a negative pressure eliminator (214; 254; 282; 544) configured to control the valve device to have the suction nozzle (60; 350; 406) release the electronic component (220; 436); and an elimination effect reducer (216; 256; 272; 546) configured to control the nozzle advancing device to eliminate at least a portion of effect of the negative-pressure elimination caused by the negative pressure eliminator, on a pressing force with which the electronic component is pressed against the substrate. a negative pressure eliminator (214; 254; 282; 544) configured to control the valve device to have the suction nozzle (60; 350; 406) release the electronic component (220; 436); and an elimination effect reducer (216; 256; 272; 546) configured to control the nozzle advancing device to eliminate at least a portion of effect of the negative-pressure elimination caused by the negative pressure eliminator, on a pressing force with which the electronic component is pressed against the substrate.