A thermal conductive silicone composition comprising: an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm 2 /s at 25°C, and represented by the following average composition formula R 1 a SiO (4-a)/2 wherein R 1 represents a hydrogen atom, a hydroxy group or a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a represents a number satisfying 1.8 ≤a≤2.2; silver nanoparticles having an average particle size of 3 to 600 nm, the silver nanoparticles being in an amount of 50 to 1,700 parts by mass per 100 parts by mass of the component; a thermal conductive filler other than the component, having an average particle size of 0.7 to 100 μm, as measured according to laser diffraction method, and a thermal conductivity of 10 W/m°C or higher, measured according to the method outlined in the description, the thermal conductive filler being in an amount of 50 to 3,000 parts by mass per 100 parts by mass of the component, wherein the thermal conductive filler has a tap density of 3.0 to 7.0 g/cm 3, the tap density is a value obtained by a method in which 100 g of the thermal conductive filler is weighed out at first, and then gently dropped into a 100 ml graduated cylinder, the 100 ml graduated cylinder is then placed on a tap density measuring device to drop the thermal conductive filler 600 times at a dropping distance of 20 mm and a rate of 60 times/min, and a volume of the thermal conductive filler compacted is measured, and wherein the thermal conductive filler has a specific surface area of 0.08 to 2.0 m 2 /g;, measured according to the BET method and a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction, the catalyst being in an catalytic amount. an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm 2 /s at 25°C, and represented by the following average composition formula R 1 a SiO (4-a)/2 wherein R 1 represents a hydrogen atom, a hydroxy group or a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a represents a number satisfying 1.8 ≤a≤2.2; silver nanoparticles having an average particle size of 3 to 600 nm, the silver nanoparticles being in an amount of 50 to 1,700 parts by mass per 100 parts by mass of the component; a thermal conductive filler other than the component, having an average particle size of 0.7 to 100 μm, as measured according to laser diffraction method, and a thermal conductivity of 10 W/m°C or higher, measured according to the method outlined in the description, the thermal conductive filler being in an amount of 50 to 3,000 parts by mass per 100 parts by mass of the component, wherein the thermal conductive filler has a tap density of 3.0 to 7.0 g/cm 3, the tap density is a value obtained by a method in which 100 g of the thermal conductive filler is weighed out at first, and then gently dropped into a 100 ml graduated cylinder, the 100 ml graduated cylinder is then placed on a tap density measuring device to drop the thermal conductive filler 600 times at a dropping distance of 20 mm and a rate of 60 times/min, and a volume of the thermal conductive filler compacted is measured, and wherein the thermal conductive filler has a specific surface area of 0.08 to 2.0 m 2 /g;, measured according to the BET method and a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction, the catalyst being in an catalytic amount.