An electronic device comprising: a display; a sensor bonding layer; and a fingerprint sensor disposed under a specified area of the display, wherein the fingerprint sensor is bonded to an inner surface of the display, through the sensor bonding layer, wherein at least a portion of the sensor bonding layer is expanded to at least a portion of a side surface of the fingerprint sensor and forms a first protrusion structure and a second protrusion structure to surround the at least a portion of the side surface of the fingerprint sensor, wherein the first protruding structure is in contact with a protective layer of the display and the second protruding structure is not in contact with the protective layer of the display, wherein the fingerprint sensor comprises an ultrasonic wave generating layer configured to generate an ultrasonic wave, wherein the first protrusion structure and the second protrusion structure are formed in a process of planarizing adhesive liquid of the sensor bonding layer, wherein the fingerprint sensor is electrically connected with circuitry provided inside the electronic device through a wiring part introduced in the side surface of the fingerprint sensor, the wiring part being disposed adjacent to the second protrusion structure, wherein the fingerprint sensor further comprises a metal layer and a planarizing layer, the planarizing layer being configured to planarize an air layer formed on a rear surface of the fingerprint sensor, wherein the first and second protrusion structures (145a, 145b) cover at least a portion of a side surface of the metal layer or the planarizing layer. a display; a sensor bonding layer; and a fingerprint sensor disposed under a specified area of the display, wherein the fingerprint sensor is bonded to an inner surface of the display, through the sensor bonding layer, wherein at least a portion of the sensor bonding layer is expanded to at least a portion of a side surface of the fingerprint sensor and forms a first protrusion structure and a second protrusion structure to surround the at least a portion of the side surface of the fingerprint sensor, wherein the first protruding structure is in contact with a protective layer of the display and the second protruding structure is not in contact with the protective layer of the display, wherein the fingerprint sensor comprises an ultrasonic wave generating layer configured to generate an ultrasonic wave, wherein the first protrusion structure and the second protrusion structure are formed in a process of planarizing adhesive liquid of the sensor bonding layer, wherein the fingerprint sensor is electrically connected with circuitry provided inside the electronic device through a wiring part introduced in the side surface of the fingerprint sensor, the wiring part being disposed adjacent to the second protrusion structure, wherein the fingerprint sensor further comprises a metal layer and a planarizing layer, the planarizing layer being configured to planarize an air layer formed on a rear surface of the fingerprint sensor, wherein the first and second protrusion structures (145a, 145b) cover at least a portion of a side surface of the metal layer or the planarizing layer.