An electronic device, comprising: a display module; a circuit module; and a housing suitable for protecting the display module and the circuit module, the housing comprising: a first transparent cover, at least a part of the first transparent cover presenting a curve; a second transparent cover opposite to the first transparent cover, wherein the display module is disposed between the second transparent cover and the circuit module; and a frame connected between the periphery of the first transparent cover and the periphery of the second transparent cover, wherein the frame forms an accommodation space with the first transparent cover and the second transparent cover for accommodating the display module and the circuit module; characterized by further comprising a first multi-layer stacked structure disposed on a first inner surface of the first transparent cover facing toward the second transparent cover and having a plurality of first optical layers stacked in sequence; and a first tinted layer disposed on the first multi-layer stacked structure; wherein a thickness of the first multi-layer stacked structure on the center of the first transparent layer is greater than a thickness of the first multi-layer stacked structure on the periphery of the first transparent layer. a display module; a circuit module; and a housing suitable for protecting the display module and the circuit module, the housing comprising: a first transparent cover, at least a part of the first transparent cover presenting a curve; a second transparent cover opposite to the first transparent cover, wherein the display module is disposed between the second transparent cover and the circuit module; and a frame connected between the periphery of the first transparent cover and the periphery of the second transparent cover, wherein the frame forms an accommodation space with the first transparent cover and the second transparent cover for accommodating the display module and the circuit module; characterized by further comprising a first multi-layer stacked structure disposed on a first inner surface of the first transparent cover facing toward the second transparent cover and having a plurality of first optical layers stacked in sequence; and a first tinted layer disposed on the first multi-layer stacked structure; wherein a thickness of the first multi-layer stacked structure on the center of the first transparent layer is greater than a thickness of the first multi-layer stacked structure on the periphery of the first transparent layer. a first transparent cover, at least a part of the first transparent cover presenting a curve; a second transparent cover opposite to the first transparent cover, wherein the display module is disposed between the second transparent cover and the circuit module; and a frame connected between the periphery of the first transparent cover and the periphery of the second transparent cover, wherein the frame forms an accommodation space with the first transparent cover and the second transparent cover for accommodating the display module and the circuit module; characterized by further comprising a first multi-layer stacked structure disposed on a first inner surface of the first transparent cover facing toward the second transparent cover and having a plurality of first optical layers stacked in sequence; and a first tinted layer disposed on the first multi-layer stacked structure; wherein a thickness of the first multi-layer stacked structure on the center of the first transparent layer is greater than a thickness of the first multi-layer stacked structure on the periphery of the first transparent layer.