An imaging apparatus comprising: an imaging optical system including at least one optical element (21, 22); a holding member holding the imaging optical system; an image sensor configured to capture a subject image formed by the imaging optical system; a substrate having the image sensor mounted thereon; a substrate portion including the image sensor and the substrate as one unit; and a bonding member fixing the substrate portion to the holding member, the bonding member being partly in contact with a surface of the substrate portion, and at at least two positions in a part of the surface of the substrate portion in contact with the bonding member, the surface of the substrate portion faces different directions, wherein the bonding member includes a first bonding member and a second bonding member different from the first bonding member, the first bonding member and the second bonding member are respectively in contact with a first contact portion and a second contact portion of the surface of the substrate portion, the second contact portion being different from the first contact portion, the first bonding member and the second bonding member are respectively in contact with a third contact portion and a fourth contact portion of the holding member, the fourth contact portion being different from the third contact portion, and a direction from the first contact portion to the third contact portion and a direction from the second contact portion to the fourth contact portion are different, characterized in that the first bonding member and the second bonding member differ from each other in a shrinkage ratio in curing or an elastic modulus after curing, the first bonding member has a lower shrinkage ratio or elastic modulus than the second bonding member, and a volume of the first bonding member between the first contact portion and the third contact portion is larger than a volume of the second bonding member between the second contact portion and the fourth contact portion. an imaging optical system including at least one optical element (21, 22); a holding member holding the imaging optical system; an image sensor configured to capture a subject image formed by the imaging optical system; a substrate having the image sensor mounted thereon; a substrate portion including the image sensor and the substrate as one unit; and a bonding member fixing the substrate portion to the holding member, the bonding member being partly in contact with a surface of the substrate portion, and at at least two positions in a part of the surface of the substrate portion in contact with the bonding member, the surface of the substrate portion faces different directions, wherein the bonding member includes a first bonding member and a second bonding member different from the first bonding member, the first bonding member and the second bonding member are respectively in contact with a first contact portion and a second contact portion of the surface of the substrate portion, the second contact portion being different from the first contact portion, the first bonding member and the second bonding member are respectively in contact with a third contact portion and a fourth contact portion of the holding member, the fourth contact portion being different from the third contact portion, and a direction from the first contact portion to the third contact portion and a direction from the second contact portion to the fourth contact portion are different, characterized in that the first bonding member and the second bonding member differ from each other in a shrinkage ratio in curing or an elastic modulus after curing, the first bonding member has a lower shrinkage ratio or elastic modulus than the second bonding member, and a volume of the first bonding member between the first contact portion and the third contact portion is larger than a volume of the second bonding member between the second contact portion and the fourth contact portion.