An electronic device comprising: a substrate including an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate; wherein the shield can mounted on the electric element includes a first opening formed at a part facing the electric element; the shielding member mounted around the part in which the first opening is formed on a first surface of the shield can, and includes a second opening electrically connected to the shield can; wherein the metal plate is mounted on the shielding member, with the first opening covered, and electrically connected to the shielding member; the heat conductive member is mounted in the first opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate, wherein the electronic device further comprises at least one insulation film, wherein the metal plate is included on a first surface of the at least one insulation film, and at least one cooling member is included on a second surface of the at least one insulation film opposite to the first surface of the at least one insulation film, wherein the insulation film includes a mounting insulation film for mounting a first cooling member thereon which is engaged with the first cooling member, and characterized in that the at least one cooling member comprises a first cooling member and a second cooling member, wherein the first cooling member includes a heat pipe engaged with the at least one insulation film included in the electronic device, for receiving heat generated from the electric element through the metal plate and the heat conductive member, and cooling the received heat, and wherein the second cooling member includes a bracket engaged with the first cooling member, while being supported by the first cooling member, for absorbing and dissipating the heat of the first cooling member. a substrate including an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate; wherein the shield can mounted on the electric element includes a first opening formed at a part facing the electric element; the shielding member mounted around the part in which the first opening is formed on a first surface of the shield can, and includes a second opening electrically connected to the shield can; wherein the metal plate is mounted on the shielding member, with the first opening covered, and electrically connected to the shielding member; the heat conductive member is mounted in the first opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate, wherein the electronic device further comprises at least one insulation film, wherein the metal plate is included on a first surface of the at least one insulation film, and at least one cooling member is included on a second surface of the at least one insulation film opposite to the first surface of the at least one insulation film, wherein the insulation film includes a mounting insulation film for mounting a first cooling member thereon which is engaged with the first cooling member, and characterized in that the at least one cooling member comprises a first cooling member and a second cooling member, wherein the first cooling member includes a heat pipe engaged with the at least one insulation film included in the electronic device, for receiving heat generated from the electric element through the metal plate and the heat conductive member, and cooling the received heat, and wherein the second cooling member includes a bracket engaged with the first cooling member, while being supported by the first cooling member, for absorbing and dissipating the heat of the first cooling member.