A multichip package structure, comprising: a substrate unit including a substrate body having two first chip-placing regions and a second chip-placing region formed on the top surface of the substrate body; a light-emitting unit including at least one first light-emitting module for generating first color temperature and at least one second light-emitting module for generating second color temperature different from the first color temperature, wherein the first light-emitting module includes a plurality of first light-emitting chips electrically connected to and disposed on one of the first chip-placing regions, and the second light-emitting module includes a plurality of second light-emitting chips electrically connected to and disposed on the other first chip-placing region; a current-limiting unit including at least one current-limiting chip electrically connected to and disposed on the second chip-placing region, wherein the current-limiting chip is electrically connected to the light-emitting unit; a frame unit including two first surrounding colloid frames (30a, 30b) and a second surrounding colloid frame surroundingly formed on the top surface of the substrate body; and a package unit including two distinct first package colloid bodies (40a, 40b) and a second package colloid body wherein one of the first surrounding colloid frames (30a, 30b) surrounds the other first surrounding colloid frame, the two first surrounding colloid frames (30a, 30b) respectively surround the first light-emitting module and the second light-emitting module to respectively form two first colloid position limiting spaces corresponding to the two first chip-placing regions, the second light-emitting module is disposed between the two first surrounding colloid frames (30a, 30b), wherein the plurality of second light emitting chips surround the first light emitting module, and the second surrounding colloid frame surrounds the current-limiting chip to form a second colloid position limiting space corresponding to the second chip-placing region, wherein the two first package colloid bodies (40a, 40b) are respectively filled into the two first colloid position limiting spaces to respectively cover the first light-emitting module and the second light-emitting module, and the second package colloid body is filled into the second colloid position limiting space to enclose the current-limiting chip, wherein the two first surrounding colloid frames (30a, 30b) and the two first package colloid bodies (40a, 40b) are alternatively connected with each other. a substrate unit including a substrate body having two first chip-placing regions and a second chip-placing region formed on the top surface of the substrate body; a light-emitting unit including at least one first light-emitting module for generating first color temperature and at least one second light-emitting module for generating second color temperature different from the first color temperature, wherein the first light-emitting module includes a plurality of first light-emitting chips electrically connected to and disposed on one of the first chip-placing regions, and the second light-emitting module includes a plurality of second light-emitting chips electrically connected to and disposed on the other first chip-placing region; a current-limiting unit including at least one current-limiting chip electrically connected to and disposed on the second chip-placing region, wherein the current-limiting chip is electrically connected to the light-emitting unit; a frame unit including two first surrounding colloid frames (30a, 30b) and a second surrounding colloid frame surroundingly formed on the top surface of the substrate body; and a package unit including two distinct first package colloid bodies (40a, 40b) and a second package colloid body wherein one of the first surrounding colloid frames (30a, 30b) surrounds the other first surrounding colloid frame, the two first surrounding colloid frames (30a, 30b) respectively surround the first light-emitting module and the second light-emitting module to respectively form two first colloid position limiting spaces corresponding to the two first chip-placing regions, the second light-emitting module is disposed between the two first surrounding colloid frames (30a, 30b), wherein the plurality of second light emitting chips surround the first light emitting module, and the second surrounding colloid frame surrounds the current-limiting chip to form a second colloid position limiting space corresponding to the second chip-placing region, wherein the two first package colloid bodies (40a, 40b) are respectively filled into the two first colloid position limiting spaces to respectively cover the first light-emitting module and the second light-emitting module, and the second package colloid body is filled into the second colloid position limiting space to enclose the current-limiting chip, wherein the two first surrounding colloid frames (30a, 30b) and the two first package colloid bodies (40a, 40b) are alternatively connected with each other.