A power module comprising: a housing assembly defining an enclosed space; an electrical assembly including an AC input assembly, a DC input assembly, a number of AC feeder layers, a number of DC feeder layers, and a number of electrical components; said number of electrical components includes a number of AC electrical components and a number of DC electrical components; each AC feeder layer including a generally planar body that is non-conductive and an embedded conductor, the embedded conductor of each of the AC feeder layers being embedded in the generally planar body of the respective AC feeder layer; each DC feeder layer including a generally planar body that is non-conductive and an embedded conductor, the embedded conductor of each of the DC feeder layers being embedded in the generally planar body of the respective DC feeder layer; each AC feeder layer conductor coupled to, and in electrical communication with, said AC input assembly; each DC feeder layer conductor coupled to, and in electrical communication with, said DC input assembly; each AC electrical component coupled to, and in electrical communication with, an AC feeder layer conductor; and each DC electrical component coupled to, and in electrical communication with, a DC feeder layer conductor, wherein said number of AC feeder layers includes a first AC feeder layer, a second AC feeder layer, and a third AC feeder layer; said number of DC feeder layers includes a single DC feeder layer; and the first AC feeder layer, the second AC feeder layer, the third AC feeder layer, and the single DC feeder layer are disposed in a direct contact stack such that the generally planar bodies of the AC and the DC feeder layers directly contact one another. a housing assembly defining an enclosed space; an electrical assembly including an AC input assembly, a DC input assembly, a number of AC feeder layers, a number of DC feeder layers, and a number of electrical components; said number of electrical components includes a number of AC electrical components and a number of DC electrical components; each AC feeder layer including a generally planar body that is non-conductive and an embedded conductor, the embedded conductor of each of the AC feeder layers being embedded in the generally planar body of the respective AC feeder layer; each DC feeder layer including a generally planar body that is non-conductive and an embedded conductor, the embedded conductor of each of the DC feeder layers being embedded in the generally planar body of the respective DC feeder layer; each AC feeder layer conductor coupled to, and in electrical communication with, said AC input assembly; each DC feeder layer conductor coupled to, and in electrical communication with, said DC input assembly; each AC electrical component coupled to, and in electrical communication with, an AC feeder layer conductor; and each DC electrical component coupled to, and in electrical communication with, a DC feeder layer conductor, wherein said number of AC feeder layers includes a first AC feeder layer, a second AC feeder layer, and a third AC feeder layer; said number of DC feeder layers includes a single DC feeder layer; and the first AC feeder layer, the second AC feeder layer, the third AC feeder layer, and the single DC feeder layer are disposed in a direct contact stack such that the generally planar bodies of the AC and the DC feeder layers directly contact one another.