A method for forming a conductive circuit comprising the steps of: printing an ink composition on a first substrate to form a green circuit pattern of predetermined configuration, placing the green circuit pattern in contact with a solder electrode serving as a metal electrode on a second substrate, firing and curing the green circuit pattern in the contact state for thereby forming a cured conductive circuit pattern, thus yielding a structure wherein the cured circuit pattern is bonded to the solder electrode, heating to melt the solder electrode, allowing the cured conductive circuit pattern to be separated from the solder electrode, and recovering the first substrate having the cured conductive circuit pattern for rewording, providing the recovered substrate, without removing the cured circuit pattern used for bonding, printing the ink composition on the substrate to form a further green circuit pattern of predetermined configuration, and placing the further green circuit pattern in contact with a metal electrode on another substrate, or printing the ink composition on a metal electrode on another substrate to form a further green circuit pattern, and placing the further green circuit pattern in contact with the cured circuit pattern on the substrate recovered by the reworking method, firing and curing the further green circuit pattern in the contact state for thereby forming a conductive circuit and bonding the substrates together, said ink composition being a substantially solvent-free, liquid, addition curable, conductive circuit-forming ink composition comprising an organopolysiloxane having at least two silicon-bonded alkenyl, groups, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms, conductive particles, a thixotropic agent selected from the group consisting of carbon black, zinc white, tin oxide, tin-antimony oxide, and silicon carbide, and a hydrosilylation catalyst. printing an ink composition on a first substrate to form a green circuit pattern of predetermined configuration, placing the green circuit pattern in contact with a solder electrode serving as a metal electrode on a second substrate, firing and curing the green circuit pattern in the contact state for thereby forming a cured conductive circuit pattern, thus yielding a structure wherein the cured circuit pattern is bonded to the solder electrode, heating to melt the solder electrode, allowing the cured conductive circuit pattern to be separated from the solder electrode, and recovering the first substrate having the cured conductive circuit pattern for rewording, providing the recovered substrate, without removing the cured circuit pattern used for bonding, printing the ink composition on the substrate to form a further green circuit pattern of predetermined configuration, and placing the further green circuit pattern in contact with a metal electrode on another substrate, or printing the ink composition on a metal electrode on another substrate to form a further green circuit pattern, and placing the further green circuit pattern in contact with the cured circuit pattern on the substrate recovered by the reworking method, firing and curing the further green circuit pattern in the contact state for thereby forming a conductive circuit and bonding the substrates together, said ink composition being a substantially solvent-free, liquid, addition curable, conductive circuit-forming ink composition comprising an organopolysiloxane having at least two silicon-bonded alkenyl, groups, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms, conductive particles, a thixotropic agent selected from the group consisting of carbon black, zinc white, tin oxide, tin-antimony oxide, and silicon carbide, and a hydrosilylation catalyst. an organopolysiloxane having at least two silicon-bonded alkenyl, groups, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms, conductive particles, a thixotropic agent selected from the group consisting of carbon black, zinc white, tin oxide, tin-antimony oxide, and silicon carbide, and a hydrosilylation catalyst.