A method for producing a resin molded article which is a method for producing a resin molded article through imprint molding, the method comprising: one or more curable composition application processes from the following to in which a curable composition having a contact angle of 50° or less on a mold having a pattern shaped section is applied to a portion of the mold uncoated with the curable composition; and a curing process in which the curable composition applied to the mold is cured to obtain a resin molded article; a curable composition application process comprising a microparticle application step in which the curable composition is applied such that a particle size of microparticles of the curable composition when adhering to the mold is 0.5 mm or less; a curable composition application process comprising: a conductive substrate coating step in which a conductive substrate is coated with the curable composition; and a voltage application coating step in which a curable composition coated surface of the conductive substrate and a surface of the mold having the pattern shaped section are arranged so as to face each other, and voltage is applied between the conductive substrate and the mold to cause the curable composition applied onto the conductive substrate to contact the portion of the mold uncoated with the curable composition and be applied thereto; a curable composition application process in which the curable composition is applied to the portion of the mold uncoated with the curable composition, the mold having a pattern shaped section that has been subjected to a wettability improvement treatment on a surface; a curable composition application process comprising a heat application step in which the curable composition having a temperature that is 3 to 7°C higher than a surface temperature of the mold having the pattern shaped section is applied to a portion of the mold that is uncoated with the curable composition and has a surface temperature at the pattern shaped section of from 35 to 55°C. one or more curable composition application processes from the following to in which a curable composition having a contact angle of 50° or less on a mold having a pattern shaped section is applied to a portion of the mold uncoated with the curable composition; and a curing process in which the curable composition applied to the mold is cured to obtain a resin molded article; a curable composition application process comprising a microparticle application step in which the curable composition is applied such that a particle size of microparticles of the curable composition when adhering to the mold is 0.5 mm or less; a curable composition application process comprising: a conductive substrate coating step in which a conductive substrate is coated with the curable composition; and a voltage application coating step in which a curable composition coated surface of the conductive substrate and a surface of the mold having the pattern shaped section are arranged so as to face each other, and voltage is applied between the conductive substrate and the mold to cause the curable composition applied onto the conductive substrate to contact the portion of the mold uncoated with the curable composition and be applied thereto; a curable composition application process in which the curable composition is applied to the portion of the mold uncoated with the curable composition, the mold having a pattern shaped section that has been subjected to a wettability improvement treatment on a surface; a curable composition application process comprising a heat application step in which the curable composition having a temperature that is 3 to 7°C higher than a surface temperature of the mold having the pattern shaped section is applied to a portion of the mold that is uncoated with the curable composition and has a surface temperature at the pattern shaped section of from 35 to 55°C. a curable composition application process comprising a microparticle application step in which the curable composition is applied such that a particle size of microparticles of the curable composition when adhering to the mold is 0.5 mm or less; a curable composition application process comprising: a conductive substrate coating step in which a conductive substrate is coated with the curable composition; and a voltage application coating step in which a curable composition coated surface of the conductive substrate and a surface of the mold having the pattern shaped section are arranged so as to face each other, and voltage is applied between the conductive substrate and the mold to cause the curable composition applied onto the conductive substrate to contact the portion of the mold uncoated with the curable composition and be applied thereto; a curable composition application process in which the curable composition is applied to the portion of the mold uncoated with the curable composition, the mold having a pattern shaped section that has been subjected to a wettability improvement treatment on a surface; a curable composition application process comprising a heat application step in which the curable composition having a temperature that is 3 to 7°C higher than a surface temperature of the mold having the pattern shaped section is applied to a portion of the mold that is uncoated with the curable composition and has a surface temperature at the pattern shaped section of from 35 to 55°C.