A wireless communication module (1A, 1B, 2, 2A), comprising: an antenna circuit board (11A, 11B, 21A) having (i) a first principal surface (1111, 2111) and at least one antenna element (114_1 - 114_64, 214_1 - 214_64) provided on the first principal surface (1111, 2111) and (ii) a second principal surface (1112, 2112) and at least one feed line (113_1 - 113_4, 213_1 - 213_4) and an integrated circuit (115, 215) which are provided on the second principal surface (1112, 2112), wherein the integrated circuit (115, 215) is connected to the at least one antenna element (114_1 - 114_64, 214_1 - 214_64) via the at least one feed line (113_1 to 113_4, 213_1 to 213_4); the wireless communication module (1A, 1B, 2, 2A) further comprises a support (12, 12B, 22) joined to a pair of opposite sides of the second principal surface (1112, 2112) of the antenna circuit board (11A, 11B, 21A) so as to keep the antenna circuit board (11A, 11B, 21A) flat, the support (12, 12B, 22) is provided (i) so as to face the second principal surface of the antenna circuit board (11A, 11B) and so as to be away from the second principal surface of the antenna circuit board (11A, 11B) by a distance that is not smaller than a wavelength of an electromagnetic wave which is transmitted and received with use of the antenna circuit board (11A, 11B) or (ii) wherein the support has a U-shape, with right or rounded angles, when the antenna circuit board is viewed from above, the support surrounding a substrate of the antenna circuit board on three side surfaces thereof; the first principal surface (1111, 2111) of the antenna circuit board (11A, 11B, 21A) comprises a region in which no antenna element is provided; the region of the first principal surface (1111, 2111) overlaps with the integrated circuit (115, 215) when the antenna circuit board (11A, 11B, 21A) is viewed from above; and the wireless communication module (1A, 1B, 2, 2A) further comprises a heat diffusing plate (118, 218), provided on the region of the first principal surface, which diffuses heat generated by the integrated circuit (115, 215). an antenna circuit board (11A, 11B, 21A) having (i) a first principal surface (1111, 2111) and at least one antenna element (114_1 - 114_64, 214_1 - 214_64) provided on the first principal surface (1111, 2111) and (ii) a second principal surface (1112, 2112) and at least one feed line (113_1 - 113_4, 213_1 - 213_4) and an integrated circuit (115, 215) which are provided on the second principal surface (1112, 2112), wherein the integrated circuit (115, 215) is connected to the at least one antenna element (114_1 - 114_64, 214_1 - 214_64) via the at least one feed line (113_1 to 113_4, 213_1 to 213_4); the wireless communication module (1A, 1B, 2, 2A) further comprises a support (12, 12B, 22) joined to a pair of opposite sides of the second principal surface (1112, 2112) of the antenna circuit board (11A, 11B, 21A) so as to keep the antenna circuit board (11A, 11B, 21A) flat, the support (12, 12B, 22) is provided (i) so as to face the second principal surface of the antenna circuit board (11A, 11B) and so as to be away from the second principal surface of the antenna circuit board (11A, 11B) by a distance that is not smaller than a wavelength of an electromagnetic wave which is transmitted and received with use of the antenna circuit board (11A, 11B) or (ii) wherein the support has a U-shape, with right or rounded angles, when the antenna circuit board is viewed from above, the support surrounding a substrate of the antenna circuit board on three side surfaces thereof; the first principal surface (1111, 2111) of the antenna circuit board (11A, 11B, 21A) comprises a region in which no antenna element is provided; the region of the first principal surface (1111, 2111) overlaps with the integrated circuit (115, 215) when the antenna circuit board (11A, 11B, 21A) is viewed from above; and the wireless communication module (1A, 1B, 2, 2A) further comprises a heat diffusing plate (118, 218), provided on the region of the first principal surface, which diffuses heat generated by the integrated circuit (115, 215).