Circuit arrangement of a phase leg of a three-point converter comprising: - three DC connections (1, 2, 3) for positive, negative and zero potential and an AC connection, - a first pair of series-connected semiconductor switching elements (A, B) connecting the positive DC potential to the AC connection, - a second pair of series-connected semiconductor switching elements (C, D) connecting the negative DC potential to the AC connection, - two circuit means (M1, M2) connecting the DC zero potential to the AC connection via, in each case, one of the series-connected semiconductor switching elements of each pair (B, C), - a heat sink having a first cooling surface, the semiconductor switching elements (A, B, C, D) and the circuit means (M1, M2) being installed in a common plane on the first cooling surface of the heat sink, - connecting bars (11, 12, 13, 14, 15, 16) that extend perpendicularly to the first cooling surface of the heat sink and provide an electrical connection of the semiconductor switching elements (A, B, C, D) to the circuit means (M1, M2), the DC connections (1, 2, 3) and the AC connection of the circuit arrangement, the connecting bars (11, 12, 13, 14, 15, 16) having means for establishing contact with the semiconductor switching elements (A, B, C, D), wherein the individual connecting bars (11, 12, 13, 14, 15, 16) have at least one region (K1, K2, K3) in which at least two connecting bars (11, 12, 13, 14, 15, 16) are arranged parallel and directly adjacent to one another and, during switching over between two switching states, the current flow directions are identical, so that the flux change generated by the current change in one connecting bar can be at least partially compensated by the current change in the other connecting bar, and characterized in that in each case exactly two connecting bars (11, 12, 13, 15, 16), which serve to contact an individual semiconductor switching element (A, B, C, D), are arranged parallel and directly adjacent to one another in the region of the connections of the respective semiconductor switching element. - three DC connections (1, 2, 3) for positive, negative and zero potential and an AC connection, - a first pair of series-connected semiconductor switching elements (A, B) connecting the positive DC potential to the AC connection, - a second pair of series-connected semiconductor switching elements (C, D) connecting the negative DC potential to the AC connection, - two circuit means (M1, M2) connecting the DC zero potential to the AC connection via, in each case, one of the series-connected semiconductor switching elements of each pair (B, C), - a heat sink having a first cooling surface, the semiconductor switching elements (A, B, C, D) and the circuit means (M1, M2) being installed in a common plane on the first cooling surface of the heat sink, - connecting bars (11, 12, 13, 14, 15, 16) that extend perpendicularly to the first cooling surface of the heat sink and provide an electrical connection of the semiconductor switching elements (A, B, C, D) to the circuit means (M1, M2), the DC connections (1, 2, 3) and the AC connection of the circuit arrangement, the connecting bars (11, 12, 13, 14, 15, 16) having means for establishing contact with the semiconductor switching elements (A, B, C, D), wherein