Method for producing an electronics module, in particular a transmission control module, the method comprising the steps of: providing a carrier substrate, wherein electronic components are arranged on an outer surface of the carrier substrate and protrude from the outer surface; and completely covering the electronic components with a protective compound, wherein the covering step comprises the following substeps: providing a mould having depressions (35, 37, 38) made in the mould, wherein the depressions (35, 37, 38) are designed in such a way that they replicate a geometrical form of the electronic components; at least partially filling the depressions (35, 37, 38) with the protective compound; and joining the carrier substrate and the mould together in such a way that the electronic components are completely received in the depressions (35, 37, 38) filled with protective compound; wherein, during the joining together, the mould is arranged in such a way that the protective compound is kept in the depressions (35, 37, 38) by gravity, characterized in that the carrier substrate comprises a carrier board and a circuit board element (14, 18); wherein the carrier board and the circuit board element (14, 18) have an opening that is designed to pass completely through the carrier board and the circuit board element (14, 18), via which excessive protective compound can escape and leave the electronics module during the joining-together step. providing a carrier substrate, wherein electronic components are arranged on an outer surface of the carrier substrate and protrude from the outer surface; and completely covering the electronic components with a protective compound, wherein the covering step comprises the following substeps: providing a mould having depressions (35, 37, 38) made in the mould, wherein the depressions (35, 37, 38) are designed in such a way that they replicate a geometrical form of the electronic components; at least partially filling the depressions (35, 37, 38) with the protective compound; and joining the carrier substrate and the mould together in such a way that the electronic components are completely received in the depressions (35, 37, 38) filled with protective compound; wherein, during the joining together, the mould is arranged in such a way that the protective compound is kept in the depressions (35, 37, 38) by gravity, characterized in that the carrier substrate comprises a carrier board and a circuit board element (14, 18); wherein the carrier board and the circuit board element (14, 18) have an opening that is designed to pass completely through the carrier board and the circuit board element (14, 18), via which excessive protective compound can escape and leave the electronics module during the joining-together step. providing a mould having depressions (35, 37, 38) made in the mould, wherein the depressions (35, 37, 38) are designed in such a way that they replicate a geometrical form of the electronic components; at least partially filling the depressions (35, 37, 38) with the protective compound; and joining the carrier substrate and the mould together in such a way that the electronic components are completely received in the depressions (35, 37, 38) filled with protective compound; wherein, during the joining together, the mould is arranged in such a way that the protective compound is kept in the depressions (35, 37, 38) by gravity, characterized in that the carrier substrate comprises a carrier board and a circuit board element (14, 18); wherein the carrier board and the circuit board element (14, 18) have an opening that is designed to pass completely through the carrier board and the circuit board element (14, 18), via which excessive protective compound can escape and leave the electronics module during the joining-together step.