A packaging method for a retinal prosthesis implanted chip, comprising the following steps: S1: providing a metal underlayer and processing the metal underlayer to form a stimulation electrode component with a glass substrate, processing the stimulation electrode component to form a plurality of stimulation electrodes and a pad structure to realize the signal connection, and welding an ASIC chip onto the stimulation electrode component; S2: forming a glass cover with a metal feedthrough structure by processing; and S3: covering the glass substrate with the glass cover, aligning the feedthrough structure on the glass cover with the pad structure on the glass substrate and realizing the connection therebetween, and sealing the periphery of the glass cover and the glass substrate to realize the connection and packaging of the glass cover and the glass substrate, characterized in that, in step S1, the metal underlayer is processed by the following specific method:: providing the metal underlayer, and cutting out a plurality of metal pins and the pad structure on the metal underlayer;: filling the cut-out metal pins with glass, so that the cut-out metal pins are completely covered with glass; double-sided thinning of the metal underlayer after molten glass pouring, wherein the glass covering layer on the cut side of the metal underlayer is thinned until the metal pins are exposed, and the metal underlayer on the other side of the metal underlayer is thinned until a glass substrate surface formed by filling is completely exposed; and processing one side of the product obtained by the above steps so that the metal pins in the glass substrate form stimulation portions on the glass surface, and the stimulation electrodes with the glass substrate are formed as a whole. S1: providing a metal underlayer and processing the metal underlayer to form a stimulation electrode component with a glass substrate, processing the stimulation electrode component to form a plurality of stimulation electrodes and a pad structure to realize the signal connection, and welding an ASIC chip onto the stimulation electrode component; S2: forming a glass cover with a metal feedthrough structure by processing; and S3: covering the glass substrate with the glass cover, aligning the feedthrough structure on the glass cover with the pad structure on the glass substrate and realizing the connection therebetween, and sealing the periphery of the glass cover and the glass substrate to realize the connection and packaging of the glass cover and the glass substrate, characterized in that, in step S1, the metal underlayer is processed by the following specific method:: providing the metal underlayer, and cutting out a plurality of metal pins and the pad structure on the metal underlayer;: filling the cut-out metal pins with glass, so that the cut-out metal pins are completely covered with glass; double-sided thinning of the metal underlayer after molten glass pouring, wherein the glass covering layer on the cut side of the metal underlayer is thinned until the metal pins are exposed, and the metal underlayer on the other side of the metal underlayer is thinned until a glass substrate surface formed by filling is completely exposed; and processing one side of the product obtained by the above steps so that the metal pins in the glass substrate form stimulation portions on the glass surface, and the stimulation electrodes with the glass substrate are formed as a whole.: providing the metal underlayer, and cutting out a plurality of metal pins and the pad structure on the metal underlayer;: filling the cut-out metal pins with glass, so that the cut-out metal pins are completely covered with glass; double-sided thinning of the metal underlayer after molten glass pouring, wherein the glass covering layer on the cut side of the metal underlayer is thinned until the metal pins are exposed, and the metal underlayer on the other side of the metal underlayer is thinned until a glass substrate surface formed by filling is completely exposed; and processing one side of the product obtained by the above steps so that the metal pins in the glass substrate form stimulation portions on the glass surface, and the stimulation electrodes with the glass substrate are formed as a whole.