A casting-shell mold chamber, wherein, the casting-shell mold chamber comprises a heating coil winding, a first thermal-shield assembly, a first superconducting coil, a second thermal-shield assembly and a second superconducting coil; and the first thermal-shield assembly is provided at an outside of the heating coil winding, the first superconducting coil is provided at an inside of the first thermal-shield assembly, and the second superconducting coil is provided at an inside of the second thermal-shield assembly; the second thermal-shield assembly is provided under the first thermal-shield assembly, the first superconducting coil and the second superconducting coil are configured to generate opposed magnetic fields; and the first superconducting coil and the heating coil winding are configured to form a forward-directional static-magnetic-field heating zone, and the second superconducting coil is configured to form a reverse-directional static-magnetic-field zone; the first thermal-shield assembly comprises first thermal shields that are located at two sides of the first superconducting coil and first thermal-shield cover plates that are located at a top and a bottom of the first superconducting coil, and the first thermal shields and the first thermal-shield cover plates form a space for containing the first superconducting coil; and the second thermal-shield assembly comprises second thermal shields that are located at two sides of the second superconducting coil and second thermal-shield cover plates that are located at a top and a bottom of the second superconducting coil, the second thermal shields and the second thermal-shield cover plates form a space for containing the second superconducting coil, a heating coil is provided at an inside of the first superconducting coil, and an overcooling-treatment crucible is provided at an inside of the heating coil winding; wherein a carbon-fiber thermal-insulation-layer cover plate and a magnetism-receptor thermal-insulation shield are provided respectively over and under the first thermal-shield assembly; and the carbon-fiber thermal-insulation-layer cover plate and the magnetism-receptor thermal-insulation shield are provided respectively at a top and a bottom of an overcooling-treatment device; wherein a graphite loading plate is provided between the first thermal-shield assembly and the second thermal-shield assembly, and the graphite loading plate is provided under the magnetism-receptor thermal-insulation shield; and the first thermal-shield assembly is sleeved by a housing, and the housing is configured to surround the heating coil winding, the thermal-insulation layer, a first cooling pipeline and the first thermal-shield assembly and form a closed space. the casting-shell mold chamber comprises a heating coil winding, a first thermal-shield assembly, a first superconducting coil, a second thermal-shield assembly and a second superconducting coil; and the first thermal-shield assembly is provided at an outside of the heating coil winding, the first superconducting coil is provided at an inside of the first thermal-shield assembly, and the second superconducting coil is provided at an inside of the second thermal-shield assembly; the second thermal-shield assembly is provided under the first thermal-shield assembly, the first superconducting coil and the second superconducting coil are configured to generate opposed magnetic fields; and the first superconducting coil and the heating coil winding are configured to form a forward-directional static-magnetic-field heating zone, and the second superconducting coil is configured to form a reverse-directional static-magnetic-field zone; the first thermal-shield assembly comprises first thermal shields that are located at two sides of the first superconducting coil and first thermal-shield cover plates that are located at a top and a bottom of the first superconducting coil, and the first thermal shields and the first thermal-shield cover plates form a space for containing the first superconducting coil; and the second thermal-shield assembly comprises second thermal shields that are located at two sides of the second superconducting coil and second thermal-shield cover plates that are located at a top and a bottom of the second superconducting coil, the second thermal shields and the second thermal-shield cover plates form a space for containing the second superconducting coil, a heating coil is provided at an inside of the first superconducting coil, and an overcooling-treatment crucible is provided at an inside of the heating coil winding; wherein a carbon-fiber thermal-insulation-layer cover plate and a magnetism-receptor thermal-insulation shield are provided respectively over and under the first thermal-shield assembly; and the carbon-fiber thermal-insulation-layer cover plate and the magnetism-receptor thermal-insulation shield are provided respectively at a top and a bottom of an overcooling-treatment device; wherein a graphite loading plate is provided between the first thermal-shield assembly and the second thermal-shield assembly, and the graphite loading plate is provided under the magnetism-receptor thermal-insulation shield; and the first thermal-shield assembly is sleeved by a housing, and the housing is configured to surround the heating coil winding, the thermal-insulation layer, a first cooling pipeline and the first thermal-shield assembly and form a closed space.