A printed circuit board, comprising a substrate and a plurality of heating components embedded in the substrate, wherein the substrate is a board body of the printed circuit board; and a cooling liquid channel is disposed in the substrate, cooling liquid flows in the cooling liquid channel, and the cooling liquid channel passes around the heating components, so that the cooling liquid exchanges heat with the heating components, characterized in that a first heat dissipation component is disposed on a surface of a first heating component, one surface of the first heat dissipation component is in contact with said surface of the first heating component, and the other surface of the first heat dissipation component is in contact with the cooling liquid channel, so that the cooling liquid exchanges heat with said surface of the first heating component by using the first heat dissipation component, a second heat dissipation component is disposed on a surface of a second heating component, one surface of the second heat dissipation component is in contact with said surface of the second heating component, and the other surface of the second heat dissipation component is in contact with the cooling liquid channel, so that the cooling liquid exchanges heat with said surface of the second heating component by using the second heat dissipation component,wherein that the cooling liquid channel passes around the heating components, so that the cooling liquid exchanges heat with the heating components comprises: the cooling liquid channel passes three side surfaces of each heating component, so that the cooling liquid exchanges heat with the three side surfaces of the each heating component, wherein the first heat dissipation component is disposed on three side surfaces of the first heating component, so that the cooling liquid exchanges heat with the three side surfaces of the first heating component by using the first heat dissipation component, wherein the second heat dissipation component is disposed on three side surfaces of the second heating component, so that the cooling liquid exchanges heat with the three side surfaces of the second heating component by using the second heat dissipation component, wherein one side surface of said three side surfaces of the first heating component and one side surface of said three side surfaces of the second heating component are configured to share a same part of the cooling liquid channel. a cooling liquid channel is disposed in the substrate, cooling liquid flows in the cooling liquid channel, and the cooling liquid channel passes around the heating components, so that the cooling liquid exchanges heat with the heating components, characterized in that a first heat dissipation component is disposed on a surface of a first heating component, one surface of the first heat dissipation component is in contact with said surface of the first heating component, and the other surface of the first heat dissipation component is in contact with the cooling liquid channel, so that the cooling liquid exchanges heat with said surface of the first heating component by using the first heat dissipation component, a second heat dissipation component is disposed on a surface of a second heating component, one surface of the second heat dissipation component is in contact with said surface of the second heating component, and the other surface of the second heat dissipation component is in contact with the cooling liquid channel, so that the cooling liquid exchanges heat with said surface of the second heating component by using the second heat dissipation component,wherein that the cooling liquid channel passes around the heating components, so that the cooling liquid exchanges heat with the heating components comprises: the cooling liquid channel passes three side surfaces of each heating component, so that the cooling liquid exchanges heat with the three side surfaces of the each heating component, wherein the first heat dissipation component is disposed on three side surfaces of the first heating component, so that the cooling liquid exchanges heat with the three side surfaces of the first heating component by using the first heat dissipation component, wherein the second heat dissipation component is disposed on three side surfaces of the second heating component, so that the cooling liquid exchanges heat with the three side surfaces of the second heating component by using the second heat dissipation component, wherein one side surface of said three side surfaces of the first heating component and one side surface of said three side surfaces of the second heating component are configured to share a same part of the cooling liquid channel. the cooling liquid channel passes three side surfaces of each heating component, so that the cooling liquid exchanges heat with the three side surfaces of the each heating component, wherein the first heat dissipation component is disposed on three side surfaces of the first heating component, so that the cooling liquid exchanges heat with the three side surfaces of the first heating component by using the first heat dissipation component, wherein the second heat dissipation component is disposed on three side surfaces of the second heating component, so that the cooling liquid exchanges heat with the three side surfaces of the second heating component by using the second heat dissipation component, wherein one side surface of said three side surfaces of the first heating component and one side surface of said three side surfaces of the second heating component are configured to share a same part of the cooling liquid channel.