A modular electronic component, comprising: a circuit board (102, 206) having disposed thereon a plurality of electronic components (400A, 400B, 400C); an enclosure (100, 200, 300) for housing the circuit board (102, 206), the enclosure (100, 200, 300) comprising a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board (102, 206) and being disposed on opposite sides of the circuit board (102, 206) from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board (102, 206) and being disposed on opposite sides of the circuit board (102, 206) from each other, and opposing top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the front and back surfaces and being disposed on opposite sides of the circuit board (102, 206) from each other; and a common thermal shunt comprising a thermally conductive material disposed between the one or more circuit board (102, 206) components (400A, 400B, 400C) and the front surface of the enclosure (100, 200, 300) for providing a thermally conductive path between each of the plurality of electronic components (400A, 400B, 400C) and the front surface of the enclosure (100, 200, 300), wherein the common thermal shunt follows the contours of the plurality of electronic components (400A, 400B, 400C) by extending towards the circuit board (102, 206) when necessary to reach a component (400A, 400B, 400C) and extending away from the circuit board (102, 206) when necessary to avoid or clear other structures that should not make contact with the common thermal shunt, wherein the front surface of the enclosure (100, 200, 300) conducts heat to at least one of the top, left, and right surfaces of the enclosure (100, 200, 300). a circuit board (102, 206) having disposed thereon a plurality of electronic components (400A, 400B, 400C); an enclosure (100, 200, 300) for housing the circuit board (102, 206), the enclosure (100, 200, 300) comprising a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board (102, 206) and being disposed on opposite sides of the circuit board (102, 206) from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board (102, 206) and being disposed on opposite sides of the circuit board (102, 206) from each other, and opposing top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the front and back surfaces and being disposed on opposite sides of the circuit board (102, 206) from each other; and a common thermal shunt comprising a thermally conductive material disposed between the one or more circuit board (102, 206) components (400A, 400B, 400C) and the front surface of the enclosure (100, 200, 300) for providing a thermally conductive path between each of the plurality of electronic components (400A, 400B, 400C) and the front surface of the enclosure (100, 200, 300), wherein the common thermal shunt follows the contours of the plurality of electronic components (400A, 400B, 400C) by extending towards the circuit board (102, 206) when necessary to reach a component (400A, 400B, 400C) and extending away from the circuit board (102, 206) when necessary to avoid or clear other structures that should not make contact with the common thermal shunt, wherein the front surface of the enclosure (100, 200, 300) conducts heat to at least one of the top, left, and right surfaces of the enclosure (100, 200, 300).