A method of fabricating an electronic device housing, the method comprising: positioning (202; 203) a first metal sheet of predetermined size and thickness between a first tool and a first mold; pressing (204; 205) the first metal sheet into the first mold using the first tool to form a first housing of a unitary material structure, the first housing defining a length, a width, and a height that is less than both the length and the width, the first housing having at least five side walls (26, 28, 30, 32, 34) defining an internal cavity and an open end to the cavity that spans the width and height of the first housing, wherein the cavity is for containing electronic components; removing (206; 207) the first housing from the first mold; forming (212; 213) one or more openings (40, 42, 60) in at least one of the side walls of the first housing; and sliding one or more electronic components through the open end into the internal cavity such that the one or more electronic components are contained within the cavity; wherein each of the one or more openings (40, 42, 60) is arranged to expose a respective one of the one or more electronic components; removably affixing a cover over the open end of the first housing, the cover contacting at least one of the electronic components therein, wherein, when the cover is affixed over the open end of the first housing, the electronic components are in continuous contact between the cover and one of the five side walls (26, 28, 30, 32, 34) opposite the cover to help retain at least some of the electronic components in predetermined positions within the housing, wherein the first housing is a base housing for a base assembly of a portable computer, and wherein the cover is a first portion of a hinge assembly; operatively connecting a lid assembly to the base housing by the hinge assembly; configuring the electronic components such that they engage with each other and with the base housing such that the positions of the electronic components are maintained once assembled in a particular manner; and assembling one or more wedge elements within the base housing adjacent one or more of the electronic components such that the use of such wedge elements further helps to retain the desired positions of the internal electronic components within the base housing. positioning (202; 203) a first metal sheet of predetermined size and thickness between a first tool and a first mold; pressing (204; 205) the first metal sheet into the first mold using the first tool to form a first housing of a unitary material structure, the first housing defining a length, a width, and a height that is less than both the length and the width, the first housing having at least five side walls (26, 28, 30, 32, 34) defining an internal cavity and an open end to the cavity that spans the width and height of the first housing, wherein the cavity is for containing electronic components; removing (206; 207) the first housing from the first mold; forming (212; 213) one or more openings (40, 42, 60) in at least one of the side walls of the first housing; and sliding one or more electronic components through the open end into the internal cavity such that the one or more electronic components are contained within the cavity; wherein each of the one or more openings (40, 42, 60) is arranged to expose a respective one of the one or more electronic components; removably affixing a cover over the open end of the first housing, the cover contacting at least one of the electronic components therein, wherein, when the cover is affixed over the open end of the first housing, the electronic components are in continuous contact between the cover and one of the five side walls (26, 28, 30, 32, 34) opposite the cover to help retain at least some of the electronic components in predetermined positions within the housing, wherein the first housing is a base housing for a base assembly of a portable computer, and wherein the cover is a first portion of a hinge assembly; operatively connecting a lid assembly to the base housing by the hinge assembly; configuring the electronic components such that they engage with each other and with the base housing such that the positions of the electronic components are maintained once assembled in a particular manner; and assembling one or more wedge elements within the base housing adjacent one or more of the electronic components such that the use of such wedge elements further helps to retain the desired positions of the internal electronic components within the base housing.