An image capturing module, comprising: a circuit substrate including an upper surface and a lower surface; an image sensing chip disposed on the upper surface of the circuit substrate; a filter element disposed on the image sensing chip; and a lens assembly comprising a holder structure disposed on the circuit substrate and a lens structure disposed on the holder structure; wherein the upper surface of the circuit substrate includes a chip placing area, a first solder area, and a second solder area; the first solder area is connected between a first side of the chip placing area and a first side of the circuit substrate, the second solder area is connected between a second side of the chip placing area and a second side of the circuit substrate, wherein the first side of the chip placing area is opposite the second side of the chip placing area and the first side of the circuit substrate is opposite the second side of the circuit substrate, and a third side of the chip placing area coincides with a third side of the circuit substrate; wherein the upper surface of the image sensing chip includes an image sensing area, a carrier area, a first conductive area and a second conductive area; the first conductive area extends from a first side of the carrier area to a first side of the image sensing chip, the second conductive area extends from a second side of the carrier area to a second side of the image sensing chip, the carrier area surrounds the image sensing area, wherein the first side of the carrier area is opposite the second side of the carrier area and the first side of the image sensing chip is opposite the second side of the image sensing chip, and a third side of the carrier area coincides with a third side of the image sensing chip; wherein the lower surface of the filter element has a light transmitting area and a connecting area surrounding the light transmitting area; wherein the first conductive area and the second conductive of the image sensing chip area are electrically and respectively connected to the first solder area and the second solder area of the circuit substrate, and the connecting area of the filter element corresponds to the carrier area of the image sensing chip; characterized in that the third side of the image sensing chip is vertically above the third side of the circuit substrate. a circuit substrate including an upper surface and a lower surface; an image sensing chip disposed on the upper surface of the circuit substrate; a filter element disposed on the image sensing chip; and a lens assembly comprising a holder structure disposed on the circuit substrate and a lens structure disposed on the holder structure; wherein the upper surface of the circuit substrate includes a chip placing area, a first solder area, and a second solder area; the first solder area is connected between a first side of the chip placing area and a first side of the circuit substrate, the second solder area is connected between a second side of the chip placing area and a second side of the circuit substrate, wherein the first side of the chip placing area is opposite the second side of the chip placing area and the first side of the circuit substrate is opposite the second side of the circuit substrate, and a third side of the chip placing area coincides with a third side of the circuit substrate; wherein the upper surface of the image sensing chip includes an image sensing area, a carrier area, a first conductive area and a second conductive area; the first conductive area extends from a first side of the carrier area to a first side of the image sensing chip, the second conductive area extends from a second side of the carrier area to a second side of the image sensing chip, the carrier area surrounds the image sensing area, wherein the first side of the carrier area is opposite the second side of the carrier area and the first side of the image sensing chip is opposite the second side of the image sensing chip, and a third side of the carrier area coincides with a third side of the image sensing chip; wherein the lower surface of the filter element has a light transmitting area and a connecting area surrounding the light transmitting area; wherein the first conductive area and the second conductive of the image sensing chip area are electrically and respectively connected to the first solder area and the second solder area of the circuit substrate, and the connecting area of the filter element corresponds to the carrier area of the image sensing chip; characterized in that the third side of the image sensing chip is vertically above the third side of the circuit substrate.