A sound producing package structure configured to produce sound, the sound producing package structure comprising: a substrate; a sound producing component disposed on the substrate, and the sound producing component configured to generate an acoustic wave corresponding to an input audio signal; and a conductive adhesive layer disposed between the substrate and the sound producing component, characterized in that, the conductive adhesive layer is formed via a surface mount technology, and each material contained in the sound producing component has a heat resistant temperature higher than a process temperature of the surface mount technology; and wherein the sound producing component comprises: a base having at least one base opening; at least one membrane connected at its outer edges to an anchor structure, the anchor structure being disposed on the base, the at least one membrane covering each of the at least one base opening; and an actuator disposed on the at least one membrane and configured to actuate the at least one membrane; and wherein one of the at least one base opening is corresponding to a center of one of the at least one membrane in top view; or the at least one base opening comprises a plurality of openings covered by one of the at least one membrane in top view, and a center of a smallest region containing all of the plurality of openings corresponds to a center of this one of the at least one membrane; or the at least one base opening comprises a plurality of openings covered by one of the at least one membrane in top view, and the plurality of openings are arranged in an array. a substrate; a sound producing component disposed on the substrate, and the sound producing component configured to generate an acoustic wave corresponding to an input audio signal; and a conductive adhesive layer disposed between the substrate and the sound producing component, characterized in that, the conductive adhesive layer is formed via a surface mount technology, and each material contained in the sound producing component has a heat resistant temperature higher than a process temperature of the surface mount technology; and wherein the sound producing component comprises: a base having at least one base opening; at least one membrane connected at its outer edges to an anchor structure, the anchor structure being disposed on the base, the at least one membrane covering each of the at least one base opening; and an actuator disposed on the at least one membrane and configured to actuate the at least one membrane; and a base having at least one base opening; at least one membrane connected at its outer edges to an anchor structure, the anchor structure being disposed on the base, the at least one membrane covering each of the at least one base opening; and an actuator disposed on the at least one membrane and configured to actuate the at least one membrane; and wherein one of the at least one base opening is corresponding to a center of one of the at least one membrane in top view; or the at least one base opening comprises a plurality of openings covered by one of the at least one membrane in top view, and a center of a smallest region containing all of the plurality of openings corresponds to a center of this one of the at least one membrane; or the at least one base opening comprises a plurality of openings covered by one of the at least one membrane in top view, and the plurality of openings are arranged in an array. one of the at least one base opening is corresponding to a center of one of the at least one membrane in top view; or the at least one base opening comprises a plurality of openings covered by one of the at least one membrane in top view, and a center of a smallest region containing all of the plurality of openings corresponds to a center of this one of the at least one membrane; or the at least one base opening comprises a plurality of openings covered by one of the at least one membrane in top view, and the plurality of openings are arranged in an array.