A microdisplay module comprising: a package substrate; a microdisplay chip disposed over a portion of a front surface of the package substrate; a plurality of conductive vias electrically coupled to the microdisplay chip and disposed through the package substrate to a back surface of the package substrate; a flexible flat circuit connector coupled to the plurality of conductive vias at the back surface of the package substrate; a first plurality of electrical contacts disposed on a front surface of the microdisplay chip that is parallel to the front surface of the package substrate; a second plurality of electrical contacts disposed on a further portion of the front surface of the package substrate; a plurality of electrical connections, each connected between a particular one of the first plurality of electrical contacts and a particular one of the second plurality of electrical contacts; wherein each of the vias is coupled to a particular one of the second plurality of electrical contacts; characterized in that the microdisplay module further comprises an encapsulant layer disposed along a first edge of the front surface of the package substrate and affixed to the flexible flat circuit connector, wherein the encapsulant layer holds the flexible flat circuit connector in a configuration in which the flexible flat circuit connector bends around a second edge of the package substrate, the second edge being an edge at which a side surface of the package substrate meets the back surface of the package substrate, the side surface being perpendicular to the front and back surfaces of the package substrate, wherein the encapsulant layer holds the flexible flat circuit connector in a configuration in which a portion of the flexible flat circuit connector is substantially parallel to and proximate to the side surface of the package substrate, wherein the encapsulant layer holds the flexible flat circuit connector in a configuration in which a portion of the flexible flat circuit connector extends beyond a top surface of the microdisplay chip in a direction substantially perpendicular to the front surface of the package substrate. a package substrate; a microdisplay chip disposed over a portion of a front surface of the package substrate; a plurality of conductive vias electrically coupled to the microdisplay chip and disposed through the package substrate to a back surface of the package substrate; a flexible flat circuit connector coupled to the plurality of conductive vias at the back surface of the package substrate; a first plurality of electrical contacts disposed on a front surface of the microdisplay chip that is parallel to the front surface of the package substrate; a second plurality of electrical contacts disposed on a further portion of the front surface of the package substrate; a plurality of electrical connections, each connected between a particular one of the first plurality of electrical contacts and a particular one of the second plurality of electrical contacts; wherein each of the vias is coupled to a particular one of the second plurality of electrical contacts; characterized in that the microdisplay module further comprises an encapsulant layer disposed along a first edge of the front surface of the package substrate and affixed to the flexible flat circuit connector, wherein the encapsulant layer holds the flexible flat circuit connector in a configuration in which the flexible flat circuit connector bends around a second edge of the package substrate, the second edge being an edge at which a side surface of the package substrate meets the back surface of the package substrate, the side surface being perpendicular to the front and back surfaces of the package substrate, wherein the encapsulant layer holds the flexible flat circuit connector in a configuration in which a portion of the flexible flat circuit connector is substantially parallel to and proximate to the side surface of the package substrate, wherein the encapsulant layer holds the flexible flat circuit connector in a configuration in which a portion of the flexible flat circuit connector extends beyond a top surface of the microdisplay chip in a direction substantially perpendicular to the front surface of the package substrate.