A method of manufacturing a processed device-related member, the method comprising: a step of applying a pressure sensitive adhesive sheet to a surface of a device-related member; a step of performing a process on the device-related member from a surface opposite to the surface to which the pressure sensitive adhesive sheet is applied, thereby obtaining a state in which the pressure sensitive adhesive sheet is applied to the processed device-related member; a step of irradiating light rays to the pressure sensitive adhesive layer of the pressure sensitive adhesive sheet applied to the processed device-related member to progress a polymerization reaction of a polymerizable functional group contained in the pressure sensitive adhesive layer, the light rays including a light ray of which an emission spectrum has a single emission peak with its maximum intensity given at a wavelength within a range of 350 nm or more and 400 nm or less and with its full width at half maximum of 5 nm or more and 30 nm or less; and a step of releasing the processed device-related member from the pressure sensitive adhesive sheet having the cured pressure sensitive adhesive layer, wherein the pressure sensitive adhesive sheet comprises a base material; and a pressure sensitive adhesive layer provided at one main surface side of the base material, the pressure sensitive adhesive layer being formed from a pressure sensitive adhesive composition comprising: a polymer having a polymerizable functional group; and 2 mass parts or less of a photopolymerization initiator with respect to 100 mass parts of the polymer having a polymerizable functional group, the photopolymerization initiator being such that a mass absorption coefficient (unit: ml/g·cm) at a wavelength of 365 nm of a 3 mass% methanol solution thereof is 200 or more and 1,000 or less, wherein the pressure sensitive adhesive sheet is a dicing sheet, and the process includes a cutting process. a step of applying a pressure sensitive adhesive sheet to a surface of a device-related member; a step of performing a process on the device-related member from a surface opposite to the surface to which the pressure sensitive adhesive sheet is applied, thereby obtaining a state in which the pressure sensitive adhesive sheet is applied to the processed device-related member; a step of irradiating light rays to the pressure sensitive adhesive layer of the pressure sensitive adhesive sheet applied to the processed device-related member to progress a polymerization reaction of a polymerizable functional group contained in the pressure sensitive adhesive layer, the light rays including a light ray of which an emission spectrum has a single emission peak with its maximum intensity given at a wavelength within a range of 350 nm or more and 400 nm or less and with its full width at half maximum of 5 nm or more and 30 nm or less; and a step of releasing the processed device-related member from the pressure sensitive adhesive sheet having the cured pressure sensitive adhesive layer, wherein the pressure sensitive adhesive sheet comprises a base material; and a pressure sensitive adhesive layer provided at one main surface side of the base material, the pressure sensitive adhesive layer being formed from a pressure sensitive adhesive composition comprising: a polymer having a polymerizable functional group; and 2 mass parts or less of a photopolymerization initiator with respect to 100 mass parts of the polymer having a polymerizable functional group, the photopolymerization initiator being such that a mass absorption coefficient (unit: ml/g·cm) at a wavelength of 365 nm of a 3 mass% methanol solution thereof is 200 or more and 1,000 or less, wherein the pressure sensitive adhesive sheet is a dicing sheet, and the process includes a cutting process.