A metrology system comprising: a controller communicatively coupled to a metrology tool and a lithography tool, the controller including one or more processors configured to execute program instructions causing the one or more processors to: receive metrology data associated with a field-sensitive overlay metrology target fabricated according to a metrology target design, wherein the metrology target design includes at least a first feature to be formed on the sample by exposing a first exposure field on a first layer of the sample with the lithography tool, wherein the field-sensitive overlay metrology target design further includes at least a second feature to be formed by exposing a second exposure field on a second layer of the sample different than the first layer with the lithography tool, wherein the second exposure field partially overlaps the first exposure field, wherein the second exposure field overlaps the first exposure field at a location of the field-sensitive overlay metrology target on the sample; generating metrology data associated with the field-sensitive overlay metrology target with the metrology tool; determine one or more fabrication errors during fabrication of the field-sensitive overlay metrology target based on the metrology data; characterized by the process step to generate one or more correctables to adjust one or more fabrication parameters of the lithography tool in one or more subsequent lithography steps based on the one or more fabrication errors, wherein the one or more correctables comprise feed-forward correctables which are provided to the lithography tool, during the exposure of subsequent layers of the same sample to compensate for fabrication errors on a current sample layer. a controller communicatively coupled to a metrology tool and a lithography tool, the controller including one or more processors configured to execute program instructions causing the one or more processors to: receive metrology data associated with a field-sensitive overlay metrology target fabricated according to a metrology target design, wherein the metrology target design includes at least a first feature to be formed on the sample by exposing a first exposure field on a first layer of the sample with the lithography tool, wherein the field-sensitive overlay metrology target design further includes at least a second feature to be formed by exposing a second exposure field on a second layer of the sample different than the first layer with the lithography tool, wherein the second exposure field partially overlaps the first exposure field, wherein the second exposure field overlaps the first exposure field at a location of the field-sensitive overlay metrology target on the sample; generating metrology data associated with the field-sensitive overlay metrology target with the metrology tool; determine one or more fabrication errors during fabrication of the field-sensitive overlay metrology target based on the metrology data; characterized by the process step to generate one or more correctables to adjust one or more fabrication parameters of the lithography tool in one or more subsequent lithography steps based on the one or more fabrication errors, wherein the one or more correctables comprise feed-forward correctables which are provided to the lithography tool, during the exposure of subsequent layers of the same sample to compensate for fabrication errors on a current sample layer.