An adjustment method for adjusting a processing condition of a series of a plurality of substrate processings that include a measurement and/or inspection processing, the method comprising: - a collection process of collecting information on at least two types of measurement and/or inspection results related to at least one substrate; - an optimization process of optimizing a processing condition of at least part of the plurality of substrate processings at least based on the collected information on at least two types of measurement and/or inspection results; and - a transmission process of transmitting information on the optimized processing condition to an apparatus that performs a relevant processing wherein in the optimization process, the processing condition is optimized at least based on information on at least one of a correlation between the at least two types of measurement and/or inspection results and a total of the at least two types of measurement and/or inspection results, characterized in that - the plurality of substrate processings include a film formation processing of forming a film on the substrate and an exposure processing of forming a pattern on the substrate by exposing the substrate, - the information on at least two types of measurement and/or inspection results includes first information on a measurement result of a thickness of the film formed on the substrate by the film formation processing and second information on a measurement result of an alignment mark formed on the substrate before the exposure processing, - a processing condition to be optimized includes at least one of a processing condition related to an alignment condition of the substrate in the exposure processing and a film formation condition of the film on the substrate, and - in the optimization process, in the case when there is a relation between the first information and the second information, at least one of a measurement condition of the alignment mark and a film formation condition is optimized so that a measurement result of the alignment mark of the substrate is not affected by the thickness of the film. - a collection process of collecting information on at least two types of measurement and/or inspection results related to at least one substrate; - an optimization process of optimizing a processing condition of at least part of the plurality of substrate processings at least based on the collected information on at least two types of measurement and/or inspection results; and - a transmission process of transmitting information on the optimized processing condition to an apparatus that performs a relevant processing - the plurality of substrate processings include a film formation processing of forming a film on the substrate and an exposure processing of forming a pattern on the substrate by exposing the substrate, - the information on at least two types of measurement and/or inspection results includes first information on a measurement result of a thickness of the film formed on the substrate by the film formation processing and second information on a measurement result of an alignment mark formed on the substrate before the exposure processing, - a processing condition to be optimized includes at least one of a processing condition related to an alignment condition of the substrate in the exposure processing and a film formation condition of the film on the substrate, and - in the optimization process, in the case when there is a relation between the first information and the second information, at least one of a measurement condition of the alignment mark and a film formation condition is optimized so that a measurement result of the alignment mark of the substrate is not affected by the thickness of the film.