A temperature-measurement probe, comprising: a probe body; a first circuit segment residing within said temperature-measurement probe and having an electrical characteristic sensitive to a probe temperature at a location within said probe body, said first circuit segment generating circuit measurement data and including a memory configured to store temperature-correlation information, wherein said temperature-correlation information includes a first customized procedural model correlating said circuit-measurement data with said probe temperature and a target temperature, wherein said first customized procedural model includes a mathematical expression comprising a temperature prediction variable determined as a function of a plurality of circuit measurement data values, each circuit measurement data value associated with a coefficient value variable (474a - 474d) and a time value variable (476b - 476d); characterized in that the first circuit segment further includes a communication node, wherein said communication node is configured for communication with a second circuit segment, said second circuit segment being configured to receive said temperature-correlation information including said first customized procedural model and said circuit measurement data from said first circuit segment to estimate said probe temperature and said target temperature, and wherein the second circuit segment is configured to process a second customized procedural model of a second temperature measurement probe interchangeable with the first temperature-measurement probe, wherein the second customized procedural model is different from the first customized procedural model. a probe body; a first circuit segment residing within said temperature-measurement probe and having an electrical characteristic sensitive to a probe temperature at a location within said probe body, said first circuit segment generating circuit measurement data and including a memory configured to store temperature-correlation information, wherein said temperature-correlation information includes a first customized procedural model correlating said circuit-measurement data with said probe temperature and a target temperature, wherein said first customized procedural model includes a mathematical expression comprising a temperature prediction variable determined as a function of a plurality of circuit measurement data values, each circuit measurement data value associated with a coefficient value variable (474a - 474d) and a time value variable (476b - 476d); characterized in that the first circuit segment further includes a communication node, wherein said communication node is configured for communication with a second circuit segment, said second circuit segment being configured to receive said temperature-correlation information including said first customized procedural model and said circuit measurement data from said first circuit segment to estimate said probe temperature and said target temperature, and wherein the second circuit segment is configured to process a second customized procedural model of a second temperature measurement probe interchangeable with the first temperature-measurement probe, wherein the second customized procedural model is different from the first customized procedural model.