A resist composition comprising: a resin capable of increasing its solubility in an alkali developer by action of an acid; a compound capable of generating an acid upon irradiation with actinic ray or radiation; a resin having at least one of a fluorine atom and a silicon atom; and a solvent, wherein the resin has a degree of molecular weight dispersion of 1.3 or less and a weight average molecular weight of 1.0× 10 4 or less, provided that the following compositions A1, A2, B1 and C1 are excluded A1) 2g resin 30, 80 mg photo-acid generator Z2, solvent SL-2/SL-4 (60/40 mass ratio), 9 mg basic compound N-2, 10 mg resin C-13, 4 mg surfactant W-1, A2) 2g resin 25, 97 mg photo-acid generator Z71, solvent SL-2/SL-4 (60/40 mass ratio), 8 mg basic compound N-7, 10 mg resin C-13, 3 mg surfactant W-7, B1) 2g resin 16, 80 mg photo-acid generator Z23, solvent SL-2/SL-4/SL-6 (40/59/1 mass ratio), 11 mg basic compound N-7, 100 mg resin C-4-4, 3 mg surfactant W-1 and C1) 1 g resin 16', 1 g resin 17, 90 mg photo-acid generator Z63, solvent SL-2/SL-4(60/49 mass ratio), 10 mg basic compound N-1, 0.7 wt.-% of resin C-46, 2 mg surfactant W-4, wherein resin 16 is having a molar ratio of 40/10/40/10, a weight average molecular weight of 5000 and a dispersity Mw/Mn of 2.6, resin 16' is having a molar ratio of 30/20/40/10, a weight average molecular weight Mw of 8000 and a dispersity Mw/Mn of 2.0, resin 17 is having a molar ratio of 40/10/50, a weight average molecular weight Mw of 6000 and a dispersity Mw/Mn of 1.8, resin 25 is having a molar ratio of 40/10/40/10, a weight average molecular weight Mw of 9500 and a degree of dispersion Mw/Mn of 1.7, resin 30 is having a molar ratio of 40/20/20/20, a weight average molecular weight Mw of 7200 and a degree of dispersion Mw/Mn of 1.6, Z2 is Z23 is z63 is Z71 is N-1 is N,N-Dibutylaniline, N-2 is N,N-Dihexylaniline, N-7 is Triethanolamine, W-1 is Megafac F176 (fluorine surfactant, manufactured by Dainippon Ink and Chemicals Inc.), W-4 is Troysol S-366 (produced by Troy Chemical) W-7 is PF6520 (fluorine surfactant, manufactured by OMNOVA), SL-2 is propylene glycol monomethyl ether acetate and SL-4 is propylene glycol monomethyl ether, SL-6 is propylene carbonate, C-13 is having a molar ratio of 50/50, a weight average molecular weight Mw of 8500 and a degree of molecular weight dispersion Mw/Mn of 1.2, C-4-4 is having a molar ratio of 50/50, an weight average molecular weight of 5000 and a dispersity Mw/Mn of 1.1, C-46 is having a molar ratio of 50/50, a weight average molecular weight Mw of 4500 and a dispersity Mw/Mn of 1.2. a resin capable of increasing its solubility in an alkali developer by action of an acid; a compound capable of generating an acid upon irradiation with actinic ray or radiation; a resin having at least one of a fluorine atom and a silicon atom; and a solvent, wherein the resin has a degree of molecular weight dispersion of 1.3 or less and a weight average molecular weight of 1.0× 10 4 or less, A1) 2g resin 30, 80 mg photo-acid generator Z2, solvent SL-2/SL-4 (60/40 mass ratio), 9 mg basic compound N-2, 10 mg resin C-13, 4 mg surfactant W-1, A2) 2g resin 25, 97 mg photo-acid generator Z71, solvent SL-2/SL-4 (60/40 mass ratio), 8 mg basic compound N-7, 10 mg resin C-13, 3 mg surfactant W-7, B1) 2g resin 16, 80 mg photo-acid generator Z23, solvent SL-2/SL-4/SL-6 (40/59/1 mass ratio), 11 mg basic compound N-7, 100 mg resin C-4-4, 3 mg surfactant W-1 and C1) 1 g resin 16', 1 g resin 17, 90 mg photo-acid generator Z63, solvent SL-2/SL-4(60/49 mass ratio), 10 mg basic compound N-1, 0.7 wt.-% of resin C-46, 2 mg surfactant W-4, wherein resin 16 is having a molar ratio of 40/10/40/10, a weight average molecular weight of 5000 and a dispersity Mw/Mn of 2.6, resin 16' is having a molar ratio of 30/20/40/10, a weight average molecular weight Mw of 8000 and a dispersity Mw/Mn of 2.0, resin 17 is having a molar ratio of 40/10/50, a weight average molecular weight Mw of 6000 and a dispersity Mw/Mn of 1.8, resin 25 is having a molar ratio of 40/10/40/10, a weight average molecular weight Mw of 9500 and a degree of dispersion Mw/Mn of 1.7, resin 30 is having a molar ratio of 40/20/20/20, a weight average molecular weight Mw of 7200 and a degree of dispersion Mw/Mn of 1.6, Z2 is Z23 is z63 is Z71 is N-1 is N,N-Dibutylaniline, N-2 is N,N-Dihexylaniline, N-7 is Triethanolamine, W-1 is Megafac F176 (fluorine surfactant, manufactured by Dainippon Ink and Chemicals Inc.), W-4 is Troysol S-366 (produced by Troy Chemical) W-7 is PF6520 (fluorine surfactant, manufactured by OMNOVA), SL-2 is propylene glycol monomethyl ether acetate and SL-4 is propylene glycol monomethyl ether, SL-6 is propylene carbonate, C-13 is having a molar ratio of 50/50, a weight average molecular weight Mw of 8500 and a degree of molecular weight dispersion Mw/Mn of 1.2, C-4-4 is having a molar ratio of 50/50, an weight average molecular weight of 5000 and a dispersity Mw/Mn of 1.1, C-46 is having a molar ratio of 50/50, a weight average molecular weight Mw of 4500 and a dispersity Mw/Mn of 1.2.