A method of manufacturing micromolds for electroforming a micromechanical component having at least two levels, said method comprising the following steps: a) depositing and irradiating through a first photomask, a first photoresist layer applied on a substrate covered by a first conductive layer, said first photoresist layer defining a first level of the micromold, b) polymerizing the first photoresist layer c) depositing and irradiating through a second photomask a second photoresist layer applied on the first photoresist layer, said second photoresist layer defining a second level of the micromold d) polymerizing the second photoresist layer e) removing the unpolymerized photoresist (3a, 5a) from the first photoresist layer and from the second photoresist layer f) obtaining a two-level micromold of polymerized photoresist (3b, 3c and 5b) comprising at least one cavity having a bottom formed by the first conductive layer covering the substrate, upper horizontal surfaces of the first level and vertical flanks g) depositing a second conductive gold layer on the bottom of the cavity, on the upper horizontal surfaces of the first level, on the upper horizontal surfaces of the second level and on the vertical sides of the cavity by a directional vacuum evaporation parallel to the vertical flanks of the cavity in order to minimize the thickness of the gold deposited on these vertical flanks, the thickness of the gold deposited on the vertical flanks being smaller than that of the gold deposited on the horizontal surfaces (7a, 7b and 7c), h) removal of the second conductive layer covering the vertical sides of the cavity by controlled etching, said second conductive layer covering only the bottom of the cavity and the upper horizontal surfaces of the first and second level (7b, 7c). a) depositing and irradiating through a first photomask, a first photoresist layer applied on a substrate covered by a first conductive layer, said first photoresist layer defining a first level of the micromold, b) polymerizing the first photoresist layer c) depositing and irradiating through a second photomask a second photoresist layer applied on the first photoresist layer, said second photoresist layer defining a second level of the micromold d) polymerizing the second photoresist layer e) removing the unpolymerized photoresist (3a, 5a) from the first photoresist layer and from the second photoresist layer f) obtaining a two-level micromold of polymerized photoresist (3b, 3c and 5b) comprising at least one cavity having a bottom formed by the first conductive layer covering the substrate, upper horizontal surfaces of the first level and vertical flanks g) depositing a second conductive gold layer on the bottom of the cavity, on the upper horizontal surfaces of the first level, on the upper horizontal surfaces of the second level and on the vertical sides of the cavity by a directional vacuum evaporation parallel to the vertical flanks of the cavity in order to minimize the thickness of the gold deposited on these vertical flanks, the thickness of the gold deposited on the vertical flanks being smaller than that of the gold deposited on the horizontal surfaces (7a, 7b and 7c), h) removal of the second conductive layer covering the vertical sides of the cavity by controlled etching, said second conductive layer covering only the bottom of the cavity and the upper horizontal surfaces of the first and second level (7b, 7c).