A flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object, said flexible ultrasound transducer comprising an integrated circuit structure and a multi-layered structure, said multi-layered structure comprising an array of ultrasound transducing elements, an array of control circuits and flexible layers (8, 9), said array of ultrasound transducing elements being arranged in a first layer structure of the multi-layered structure and configured for generating ultrasonic energy propagating along a positive direction of main transducer axis Z. said array of control circuits being arranged in a second layer structure of the multi-layered structure, said integrated circuit structure comprising a plurality of Application Specific Integrated Circuits (ASIC), wherein at least one ASIC is configured to support a plurality of individual control circuits, said array of control circuits and said integrated circuit structure being configured for operating the array of ultrasound transducing elements arranged in said first layer structure, said flexible layers (8, 9) being arranged in said multi-layer structure so that the multi-layered structure and the whole ultrasound transducer become flexible, thereby permitting the ultrasound transducer to form a continuous contact with said curved object during operation, wherein said first layer structure is arranged at a position that is further along in a positive direction of the main transducer axis Z than said second layer structure, which first layer structure and said second layer structure of said multi-layered structure, respectively, constitute a frontplane and a backplane of the flexible ultrasound transducer, characterized in that said flexible layers (8, 9) comprise a frontplane flexible layer and a backplane flexible layer, which backplane flexible layer is arranged at a position that is further along in a negative direction of the main transducer axis Z than the second layer structure. said flexible ultrasound transducer comprising an integrated circuit structure and a multi-layered structure, said multi-layered structure comprising an array of ultrasound transducing elements, an array of control circuits and flexible layers (8, 9), said array of ultrasound transducing elements being arranged in a first layer structure of the multi-layered structure and configured for generating ultrasonic energy propagating along a positive direction of main transducer axis Z. said array of control circuits being arranged in a second layer structure of the multi-layered structure, said integrated circuit structure comprising a plurality of Application Specific Integrated Circuits (ASIC), wherein at least one ASIC is configured to support a plurality of individual control circuits, said array of control circuits and said integrated circuit structure being configured for operating the array of ultrasound transducing elements arranged in said first layer structure, said flexible layers (8, 9) being arranged in said multi-layer structure so that the multi-layered structure and the whole ultrasound transducer become flexible, thereby permitting the ultrasound transducer to form a continuous contact with said curved object during operation, wherein said first layer structure is arranged at a position that is further along in a positive direction of the main transducer axis Z than said second layer structure, which first layer structure and said second layer structure of said multi-layered structure, respectively, constitute a frontplane and a backplane of the flexible ultrasound transducer, characterized in that said flexible layers (8, 9) comprise a frontplane flexible layer and a backplane flexible layer, which backplane flexible layer is arranged at a position that is further along in a negative direction of the main transducer axis Z than the second layer structure.