A CVD apparatus for forming a coating on a surface of a sheet-like substrate by plasma CVD, comprising: a plurality of deposition chamber units each including deposition rollers and a deposition unit chamber for housing said deposition rollers, said deposition chamber units being arranged so that each deposition roller is aligned in a specific horizontal direction; and a connection chamber unit which is interposed between mutually adjacent deposition chamber units of said deposition chamber units to mutually connect the adjacent deposition chamber units, wherein said connection chamber unit includes a connection unit chamber which connects the adjacent deposition chamber units to each other by being connected to each deposition unit chamber of the adjacent deposition chamber units, and said deposition rollers of each deposition chamber unit are arranged so that the substrate is transferred while being rolled on said respective deposition rollers, and are configured so that plasma for decomposing a source gas (G A) is formed, upon receiving application of a voltage, in the vicinity of said deposition rollers to perform deposition processing on the substrate on said deposition rollers, wherein each deposition chamber unit includes, as said deposition rollers, a pair of opposed rollers which are opposed with a space therebetween for forming the plasma so that the shaft centers thereof are parallel to each other, wherein said deposition chamber unit includes a deposition area partition member which partitions the inside of said deposition unit chamber into a deposition area that is a part or all of the area on the side where said pair of opposed rollers are opposed to each other and a pressurized area that is the peripheral area of the deposition area while allowing the passage of the substrate, the deposition area is filled with the source gas (G A), and the pressurized area is filled with a pressurized discharge gas (G B) higher in pressure than the source gas (G A). a plurality of deposition chamber units each including deposition rollers and a deposition unit chamber for housing said deposition rollers, said deposition chamber units being arranged so that each deposition roller is aligned in a specific horizontal direction; and a connection chamber unit which is interposed between mutually adjacent deposition chamber units of said deposition chamber units to mutually connect the adjacent deposition chamber units, wherein said connection chamber unit includes a connection unit chamber which connects the adjacent deposition chamber units to each other by being connected to each deposition unit chamber of the adjacent deposition chamber units, and said deposition rollers of each deposition chamber unit are arranged so that the substrate is transferred while being rolled on said respective deposition rollers, and are configured so that plasma for decomposing a source gas (G A) is formed, upon receiving application of a voltage, in the vicinity of said deposition rollers to perform deposition processing on the substrate on said deposition rollers, wherein each deposition chamber unit includes, as said deposition rollers, a pair of opposed rollers which are opposed with a space therebetween for forming the plasma so that the shaft centers thereof are parallel to each other, wherein said deposition chamber unit includes a deposition area partition member which partitions the inside of said deposition unit chamber into a deposition area that is a part or all of the area on the side where said pair of opposed rollers are opposed to each other and a pressurized area that is the peripheral area of the deposition area while allowing the passage of the substrate, the deposition area is filled with the source gas (G A), and the pressurized area is filled with a pressurized discharge gas (G B) higher in pressure than the source gas (G A).