A radiant heat circuit board for mounting a plurality of heat generating devices, the radiant heat circuit board comprising: a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached; a first insulation layer disposed on the metal plate and exposing the integrated metal projection, and a second insulation layer disposed on the first insulation layer and exposing the integrated metal projection, a plurality of electrode pads (311, 313) disposed on the first insulation layer, the plurality of electrode pads (311, 313) applying a voltage into each of the heat generating devices, wherein the plurality of heat generating devices are attached on the one integrated metal projection; wherein the integrated metal projection extends between the heat generating device and the adjacent heat generating device; wherein each of the plurality of electrode pads (311, 313) comprises: a first electrode pad disposed on one side of the integrated metal projection and receiving a first voltage, a second electrode pad separated from the first electrode pad, receiving a second voltage and disposed on the one side of the integrated metal projection with the first electrode pad; and a connection part connecting the second electrode pad to an adjacent first electrode pad, wherein the first electrode pad and the second electrode pad are exposed by the second insulation layer, and wherein the connection part is buried by the second insulation layer. a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached; a first insulation layer disposed on the metal plate and exposing the integrated metal projection, and a second insulation layer disposed on the first insulation layer and exposing the integrated metal projection, a plurality of electrode pads (311, 313) disposed on the first insulation layer, the plurality of electrode pads (311, 313) applying a voltage into each of the heat generating devices, wherein the plurality of heat generating devices are attached on the one integrated metal projection; wherein the integrated metal projection extends between the heat generating device and the adjacent heat generating device; wherein each of the plurality of electrode pads (311, 313) comprises: a first electrode pad disposed on one side of the integrated metal projection and receiving a first voltage, a second electrode pad separated from the first electrode pad, receiving a second voltage and disposed on the one side of the integrated metal projection with the first electrode pad; and a connection part connecting the second electrode pad to an adjacent first electrode pad, a first electrode pad disposed on one side of the integrated metal projection and receiving a first voltage, a second electrode pad separated from the first electrode pad, receiving a second voltage and disposed on the one side of the integrated metal projection with the first electrode pad; and a connection part connecting the second electrode pad to an adjacent first electrode pad, wherein the first electrode pad and the second electrode pad are exposed by the second insulation layer, and wherein the connection part is buried by the second insulation layer.