An X-ray inspection apparatus configured to inspect an object using an X-ray, the object including a substrate and a component that is mounted on the substrate and electrically connected to the substrate by solder applied on the substrate, the X-ray inspection apparatus comprising: an X-ray output unit configured to output the X-ray toward the object; an X-ray detecting unit configured to image a perspective image indicating an intensity distribution of the X-ray being incident to the object from a plurality of directions and transmitted through the object; and a reconstruction unit configured to reconstruct a cross-sectional image of a region between the component and the substrate based on the perspective image of the X-ray from the plurality of directions, the region crossing a normal line to a surface of the substrate on which the component is mounted, characterized by an acquisition unit configured to acquire a thickness of the solder applied on the substrate; a specifying unit configured to specify, based on the thickness of the solder, a position prescribed by a distance in a direction normal to the surface of the substrate on which the component is mounted as an inspection position of the object; a first inspection unit configured to determine whether the connection of the object by the solder is nondefective using the cross-sectional image located in the inspection position; a storage unit in which the thickness of the solder applied on the substrate is stored and correlated with identification information on the substrate; and an identification unit configured to identify the substrate, wherein the specifying unit is configured to read the thickness of the solder, which is correlated with the identification information on the substrate of the object, and to specify the inspection position of the object. an X-ray output unit configured to output the X-ray toward the object; an X-ray detecting unit configured to image a perspective image indicating an intensity distribution of the X-ray being incident to the object from a plurality of directions and transmitted through the object; and a reconstruction unit configured to reconstruct a cross-sectional image of a region between the component and the substrate based on the perspective image of the X-ray from the plurality of directions, the region crossing a normal line to a surface of the substrate on which the component is mounted, characterized by an acquisition unit configured to acquire a thickness of the solder applied on the substrate; a specifying unit configured to specify, based on the thickness of the solder, a position prescribed by a distance in a direction normal to the surface of the substrate on which the component is mounted as an inspection position of the object; a first inspection unit configured to determine whether the connection of the object by the solder is nondefective using the cross-sectional image located in the inspection position; a storage unit in which the thickness of the solder applied on the substrate is stored and correlated with identification information on the substrate; and an identification unit configured to identify the substrate, a first inspection unit configured to determine whether the connection of the object by the solder is nondefective using the cross-sectional image located in the inspection position; a storage unit in which the thickness of the solder applied on the substrate is stored and correlated with identification information on the substrate; and an identification unit configured to identify the substrate, wherein the specifying unit is configured to read the thickness of the solder, which is correlated with the identification information on the substrate of the object, and to specify the inspection position of the object.