A Radio Frequency, RF device comprising: a semi conductive die having a first portion of an RF circuit (1300, 1500) and a plurality of bond pads formed thereon; wherein the RF circuit (1300, 1500) includes active and passive components; and the RF circuit (1300, 1500) includes an active portion and a tuned portion, the active portion including load inductors (1516A, 1516B); and a package in which the semi conductive die mounts, the package including: a heat slug upon which the semi conductive die resides; a plurality of package pins; a first plurality of bond wires, each of which couples between a corresponding bond pad and a corresponding package pin; a bond wire rail coupled to the heat slug, the bond wire rail serving as a reference ground; and a second plurality of bond wires (1304, 1424, 1426) forming a second portion of the RF circuit (1300, 1500); characterized in that at least one of the second plurality of bond wires (1304, 1424, 1426) couples between one of the plurality of bond pads corresponding to the first portion of the RF circuit (1300, 1500) and a respective location on the bond wire rail; and the at least one of the second plurality of bond wires (1304, 1424, 1426) serves as an inductor in the tuned portion. a semi conductive die having a first portion of an RF circuit (1300, 1500) and a plurality of bond pads formed thereon; wherein the RF circuit (1300, 1500) includes active and passive components; and the RF circuit (1300, 1500) includes an active portion and a tuned portion, the active portion including load inductors (1516A, 1516B); and a package in which the semi conductive die mounts, the package including: a heat slug upon which the semi conductive die resides; a plurality of package pins; a first plurality of bond wires, each of which couples between a corresponding bond pad and a corresponding package pin; a bond wire rail coupled to the heat slug, the bond wire rail serving as a reference ground; and a second plurality of bond wires (1304, 1424, 1426) forming a second portion of the RF circuit (1300, 1500); characterized in that at least one of the second plurality of bond wires (1304, 1424, 1426) couples between one of the plurality of bond pads corresponding to the first portion of the RF circuit (1300, 1500) and a respective location on the bond wire rail; and the at least one of the second plurality of bond wires (1304, 1424, 1426) serves as an inductor in the tuned portion. a heat slug upon which the semi conductive die resides; a plurality of package pins; a first plurality of bond wires, each of which couples between a corresponding bond pad and a corresponding package pin; a bond wire rail coupled to the heat slug, the bond wire rail serving as a reference ground; and a second plurality of bond wires (1304, 1424, 1426) forming a second portion of the RF circuit (1300, 1500); characterized in that at least one of the second plurality of bond wires (1304, 1424, 1426) couples between one of the plurality of bond pads corresponding to the first portion of the RF circuit (1300, 1500) and a respective location on the bond wire rail; and the at least one of the second plurality of bond wires (1304, 1424, 1426) serves as an inductor in the tuned portion.