A display device using semiconductor light emitting elements, the display device comprising: a substrate; assembly electrodes (1512,1513) located on the substrate; an insulating layer located on the assembly electrodes (1512,1513); a partition (1415,1515,1815) located on the insulating layer; a first assembly recess (1412,1511,1811) defined by the partition (1415,1515,1815); and a first semiconductor light emitting element (1452, 1550, 1850) assembled with the first assembly recess (1412,1511,1811), and comprising at least one bump part (1551,1851) located in a lateral direction of a surface of the first semiconductor light emitting element (1452, 1550, 1850) to be assembled, wherein the surface of the first semiconductor light emitting element (1452, 1550, 1850) to be assembled other than the at least one bump part (1551,1851) has a circular shape, wherein the partition (1415,1515,1815) configured to surround the first assembly recess (1412,1511,1811) comprises at least one protrusion part (1516,1816) configured to protrude towards an inside of the first assembly recess (1412,1511,1811), wherein the first assembly recess (1412, 1511,1811) defined by the partition (1415,1515,1815) other than the at least one protrusion part (1516,1816) has a circular shape, wherein the first assembly recess (1412, 1511,1811) has a shape corresponding to a shape of the first semiconductor light emitting element (1452, 1550, 1850) so that, a minimum width of the first assembly recess (1412,1511,1811) is equal to or greater than a minimum width of the first semiconductor light emitting element (1452, 1550, 1850); a maximum width of the first assembly recess (1412,1511,1811) is equal to or greater than a maximum width of the first semiconductor light emitting element (1452, 1550, 1850); and the maximum width of the first semiconductor light emitting element (1452, 1550, 1850) is greater than the minimum width of the first assembly recess (1412,1511,1811), wherein the minimum width of the first assembly recess (1412,1511,1811) corresponds to a straight distance from the end of the protrusion part (1516,1816) towards an inside of the first assembly recess (1412,1511,1811) an opposite side of the first assembly recess (1412,1511,1811), wherein the maximum width of the first assembly recess (1412,1511,1811) corresponds to a diameter of the first assembly recess (1412,1511,1811), wherein the minimum width of the first semiconductor light emitting element (1452, 1550, 1850) corresponds to a diameter of the first semiconductor light emitting element (1452, 1550, 1850), wherein the maximum width of the first semiconductor light emitting element (1452, 1550, 1850) corresponds to a distance between a straight line extending perpendicularly from the bump part (1551,1851) and an opposite side of the first semiconductor light emitting element (1452, 1550, 1850). a substrate; assembly electrodes (1512,1513) located on the substrate; an insulating layer located on the assembly electrodes (1512,1513); a partition (1415,1515,1815) located on the insulating layer; a first assembly recess (1412,1511,1811) defined by the partition (1415,1515,1815); and a first semiconductor light emitting element (1452, 1550, 1850) assembled with the first assembly recess (1412,1511,1811), and comprising at least one bump part (1551,1851) located in a lateral direction of a surface of the first semiconductor light emitting element (1452, 1550, 1850) to be assembled, wherein the surface of the first semiconductor light emitting element (1452, 1550, 1850) to be assembled other than the at least one bump part (1551,1851) has a circular shape, wherein the partition (1415,1515,1815) configured to surround the first assembly recess (1412,1511,1811) comprises at least one protrusion part (1516,1816) configured to protrude towards an inside of the first assembly recess (1412,1511,1811), wherein the first assembly recess (1412, 1511,1811) defined by the partition (1415,1515,1815) other than the at least one protrusion part (1516,1816) has a circular shape, wherein the first assembly recess (1412, 1511,1811) has a shape corresponding to a shape of the first semiconductor light emitting element (1452, 1550, 1850) so that, a minimum width of the first assembly recess (1412,1511,1811) is equal to or greater than a minimum width of the first semiconductor light emitting element (1452, 1550, 1850); a maximum width of the first assembly recess (1412,1511,1811) is equal to or greater than a maximum width of the first semiconductor light emitting element (1452, 1550, 1850); and the maximum width of the first semiconductor light emitting element (1452, 1550, 1850) is greater than the minimum width of the first assembly recess (1412,1511,1811), wherein the minimum width of the first assembly recess (1412,1511,1811) corresponds to a straight distance from the end of the protrusion part (1516,1816) towards an inside of the first assembly recess (1412,1511,1811) an opposite side of the first assembly recess (1412,1511,1811), wherein the maximum width of the first assembly recess (1412,1511,1811) corresponds to a diameter of the first assembly recess (1412,1511,1811), wherein the minimum width of the first semiconductor light emitting element (1452, 1550, 1850) corresponds to a diameter of the first semiconductor light emitting element (1452, 1550, 1850), wherein the maximum width of the first semiconductor light emitting element (1452, 1550, 1850) corresponds to a distance between a straight line extending perpendicularly from the bump part (1551,1851) and an opposite side of the first semiconductor light emitting element (1452, 1550, 1850).