A system for thermal management of computing devices comprises: a central supply line coupled to a fluid source of cooling liquid; a central return line coupled to the fluid source; a rack supply manifold coupled to the central supply line; a rack return manifold coupled to the central return line; and a cooling loop assembly coupled to the rack supply manifold and the rack return manifold, the cooling loop assembly coupled to at least one cooling device (130a, 130b, 130c, 130d) electrically connected to a circuit board, the cooling loop assembly further comprising: multiple board supply lines (144a, 144b); multiple inlet connectors (140a, 140b) connected to the rack supply manifold; and multiple outlet connectors (142a, 142b) connected to the rack return manifold; the multiple inlet connectors (140a, 140b) providing a passageway for the cooling liquid from the central supply line into the cooling loop assembly for distribution to the at least one cooling device (130a, 130b, 130c, 130d), and the multiple outlet connectors (142a, 142b) providing a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device (130a, 130b, 130c, 130d), wherein each of the multiple inlet connectors (140a, 140b) is coupled to a corresponding one of the multiple board supply lines (144a, 144b) that feeds fluid from the rack supply manifold into the cooling loop assembly, and wherein the cooling loop assembly comprises a board inlet manifold and secondary supply lines (146a, 146b, 146c, 146d), each board supply line (144a, 144b) connecting a corresponding one of the multiple inlet connectors (140a, 140b) to the board inlet manifold, and the secondary supply lines (146a, 146b, 146c, 146d) connecting the board inlet manifold to the at least one cooling device (130a, 130b, 130c, 130d). a central supply line coupled to a fluid source of cooling liquid; a central return line coupled to the fluid source; a rack supply manifold coupled to the central supply line; a rack return manifold coupled to the central return line; and a cooling loop assembly coupled to the rack supply manifold and the rack return manifold, the cooling loop assembly coupled to at least one cooling device (130a, 130b, 130c, 130d) electrically connected to a circuit board, the cooling loop assembly further comprising: multiple board supply lines (144a, 144b); multiple inlet connectors (140a, 140b) connected to the rack supply manifold; and multiple outlet connectors (142a, 142b) connected to the rack return manifold; the multiple inlet connectors (140a, 140b) providing a passageway for the cooling liquid from the central supply line into the cooling loop assembly for distribution to the at least one cooling device (130a, 130b, 130c, 130d), and the multiple outlet connectors (142a, 142b) providing a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device (130a, 130b, 130c, 130d), multiple board supply lines (144a, 144b); multiple inlet connectors (140a, 140b) connected to the rack supply manifold; and multiple outlet connectors (142a, 142b) connected to the rack return manifold; the multiple inlet connectors (140a, 140b) providing a passageway for the cooling liquid from the central supply line into the cooling loop assembly for distribution to the at least one cooling device (130a, 130b, 130c, 130d), and the multiple outlet connectors (142a, 142b) providing a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device (130a, 130b, 130c, 130d), wherein each of the multiple inlet connectors (140a, 140b) is coupled to a corresponding one of the multiple board supply lines (144a, 144b) that feeds fluid from the rack supply manifold into the cooling loop assembly, and wherein the cooling loop assembly comprises a board inlet manifold and secondary supply lines (146a, 146b, 146c, 146d), each board supply line (144a, 144b) connecting a corresponding one of the multiple inlet connectors (140a, 140b) to the board inlet manifold, and the secondary supply lines (146a, 146b, 146c, 146d) connecting the board inlet manifold to the at least one cooling device (130a, 130b, 130c, 130d).