Holding device intended to accept at least one wafer for the purposes of storing or transporting said wafer, the device defining an internal space intended to be occupied by the wafers, the device comprising: - at least one upright, extending parallel to a transverse axis from a base (11 b), the upright delimiting the internal space; - several supports, each support being fixed to the upright, each support extending, from the upright, towards the internal space, between a proximal end (10 p), connected to the upright, and a distal end (10 d); the device being such that: - (i) each support comprises a bearing zone (10 c), situated between the proximal end and the distal end, or at the distal end; - (ii) the bearing zone (10 c) is situated at an extension distance (d) from the proximal end (10 p), the extension distance being considered perpendicular to the transverse axis; - (iii) the bearing zone of each support defines a bearing height (h) relative to the base (11 b), the bearing height being greater than a height between the proximal end and the base, the supports fixed to the upright being positioned in such a way as to define several bearing heights (h), such that each support is configured to support the wafer, the wafer resting on the bearing zone of the support; the device being characterized in that it comprises a holding block, such that - the holding block is connected to the same upright as at least two successive supports; - the holding block extends, between the two successive supports, from the upright to which it is connected toward the internal space as far as a holding end (30 c); such that the holding end bears against the wafer when the latter is placed on a support. - at least one upright, extending parallel to a transverse axis from a base (11 b), the upright delimiting the internal space; - several supports, each support being fixed to the upright, each support extending, from the upright, towards the internal space, between a proximal end (10 p), connected to the upright, and a distal end (10 d); - (i) each support comprises a bearing zone (10 c), situated between the proximal end and the distal end, or at the distal end; - (ii) the bearing zone (10 c) is situated at an extension distance (d) from the proximal end (10 p), the extension distance being considered perpendicular to the transverse axis; - (iii) the bearing zone of each support defines a bearing height (h) relative to the base (11 b), the bearing height being greater than a height between the proximal end and the base, the supports fixed to the upright being positioned in such a way as to define several bearing heights (h), such that each support is configured to support the wafer, the wafer resting on the bearing zone of the support; the device being characterized in that it comprises a holding block, such that - the holding block is connected to the same upright as at least two successive supports; - the holding block extends, between the two successive supports, from the upright to which it is connected toward the internal space as far as a holding end (30 c); such that the holding end bears against the wafer when the latter is placed on a support. - the holding block is connected to the same upright as at least two successive supports; - the holding block extends, between the two successive supports, from the upright to which it is connected toward the internal space as far as a holding end (30 c);