A thin film deposition apparatus comprising: a loading unit arranged to fix a substrate that is a deposition target onto an electrostatic chuck; a deposition unit comprising a chamber (731; 731, 732) maintained in a vacuum state and at least one thin film deposition assembly (100, 200, 300, 400) disposed in the chamber (731; 731, 732), separated from the substrate by a predetermined distance, the deposition unit being arranged to deposit by a deposition process a thin film on the substrate fixed on the electrostatic chuck; an unloading unit arranged to separate the substrate from the electrostatic chuck when the deposition process has been completed; a first circulation unit arranged to sequentially move the electrostatic chuck on which the substrate is fixed from the loading unit to the deposition unit and the unloading unit; and a second circulation unit arranged to return the electrostatic chuck separated from the substrate to the loading unit from the unloading unit, wherein the first circulation unit is arranged to pass through the chamber (731; 731, 732) in the deposition unit, and characterised in that the at least one thin film deposition assembly (100, 200, 300, 400) comprises: a deposition source arranged to discharge a deposition material; a deposition source opening unit that is disposed downstream of the deposition source and comprises a plurality of deposition source openings arranged in a first direction; and a patterning member that is disposed downstream of the deposition source opening unit and comprises a plurality of patterning openings arranged in a second direction that is perpendicular to the first direction, wherein the thin film deposition apparatus is arranged to perform the deposition process while the substrate is moved relative to the at least one thin film deposition assembly (100, 200, 300, 400) in the first direction, and wherein the deposition source, the deposition source opening unit, and the patterning member of the at least one thin film deposition assembly (100, 200, 300, 400) are integrally formed and integrally connected as one body by a connection member arranged to guide flow of the deposition material. a loading unit arranged to fix a substrate that is a deposition target onto an electrostatic chuck; a deposition unit comprising a chamber (731; 731, 732) maintained in a vacuum state and at least one thin film deposition assembly (100, 200, 300, 400) disposed in the chamber (731; 731, 732), separated from the substrate by a predetermined distance, the deposition unit being arranged to deposit by a deposition process a thin film on the substrate fixed on the electrostatic chuck; an unloading unit arranged to separate the substrate from the electrostatic chuck when the deposition process has been completed; a first circulation unit arranged to sequentially move the electrostatic chuck on which the substrate is fixed from the loading unit to the deposition unit and the unloading unit; and a second circulation unit arranged to return the electrostatic chuck separated from the substrate to the loading unit from the unloading unit, wherein the first circulation unit is arranged to pass through the chamber (731; 731, 732) in the deposition unit, and characterised in that the at least one thin film deposition assembly (100, 200, 300, 400) comprises: a deposition source arranged to discharge a deposition material; a deposition source opening unit that is disposed downstream of the deposition source and comprises a plurality of deposition source openings arranged in a first direction; and a patterning member that is disposed downstream of the deposition source opening unit and comprises a plurality of patterning openings arranged in a second direction that is perpendicular to the first direction, a deposition source arranged to discharge a deposition material; a deposition source opening unit that is disposed downstream of the deposition source and comprises a plurality of deposition source openings arranged in a first direction; and a patterning member that is disposed downstream of the deposition source opening unit and comprises a plurality of patterning openings arranged in a second direction that is perpendicular to the first direction, wherein the thin film deposition apparatus is arranged to perform the deposition process while the substrate is moved relative to the at least one thin film deposition assembly (100, 200, 300, 400) in the first direction, and wherein the deposition source, the deposition source opening unit, and the patterning member of the at least one thin film deposition assembly (100, 200, 300, 400) are integrally formed and integrally connected as one body by a connection member arranged to guide flow of the deposition material.