A light emitting device package, comprising: a package body forming a first cavity having a step; a submount disposed on a chip mount area of the package body and disposed on a bottom surface of the first cavity; a light emitting device chip disposed on the submount; and a molding member disposed on the package body, wherein the package body comprises: a central area having the chip mount area and a chip non-mount area adjacent to the chip mount area, the molding member being disposed on the central area; and a peripheral area (PA1, PA2) around the central area, wherein the central area comprises the first cavity, wherein a lower surface of the light emitting device chip contacts an upper surface of the submount and a first upper surface of the package body defines the first cavity, and wherein an upper surface of the light emitting device chip is higher than the first upper surface of the package body in the chip non-mount area and than a second upper surface of the package body in the peripheral area, wherein the lower surface of the light emitting device chip is higher than each of the first upper surface of the package body and the second upper surface of the package body in the peripheral area (PA1, PA2), a dam is disposed on the peripheral area (PA1, PA2) on the package body at an interface between the peripheral area (PA1, PA2) and the central area, the dam defining a second cavity over the central area, a top surface of the dam is lower than the upper surface of the light emitting device chip, and the molding member is disposed to extend up to an inner wall of the dam while filling the second cavity, characterized in that the molding member comprises a fluorescent substance, and the top surface of the dam is lower than the lower surface of the light emitting device chip. a package body forming a first cavity having a step; a submount disposed on a chip mount area of the package body and disposed on a bottom surface of the first cavity; a light emitting device chip disposed on the submount; and a molding member disposed on the package body, wherein the package body comprises: a central area having the chip mount area and a chip non-mount area adjacent to the chip mount area, the molding member being disposed on the central area; and a peripheral area (PA1, PA2) around the central area, a central area having the chip mount area and a chip non-mount area adjacent to the chip mount area, the molding member being disposed on the central area; and a peripheral area (PA1, PA2) around the central area, wherein the central area comprises the first cavity, wherein a lower surface of the light emitting device chip contacts an upper surface of the submount and a first upper surface of the package body defines the first cavity, and wherein an upper surface of the light emitting device chip is higher than the first upper surface of the package body in the chip non-mount area and than a second upper surface of the package body in the peripheral area, wherein the lower surface of the light emitting device chip is higher than each of the first upper surface of the package body and the second upper surface of the package body in the peripheral area (PA1, PA2), a dam is disposed on the peripheral area (PA1, PA2) on the package body at an interface between the peripheral area (PA1, PA2) and the central area, the dam defining a second cavity over the central area, a top surface of the dam is lower than the upper surface of the light emitting device chip, and the molding member is disposed to extend up to an inner wall of the dam while filling the second cavity, characterized in that the molding member comprises a fluorescent substance, and the top surface of the dam is lower than the lower surface of the light emitting device chip.