A method of thermoforming comprising the steps of: providing a film comprising: (i) a skin layer forming an outer surface of the film, wherein: the skin layer has a melting point of at least 130°C and at most 150°C, preferably at most 145°C or at most 140°C; and the skin layer comprises one or more propylene/ethylene copolymers; and (ii) a first polyamide layer forming an interior layer of the film, wherein: the first polyamide layer has a melting point of at least 125°C and at most 230°C; and the first polyamide layer comprises one or more polyamides; (iii) an intermediate layer between the skin layer and the first polyamide layer, preferably directly adjacent the skin layer, wherein the intermediate layer has a melting point of at least 105°C and at most 150°C, preferably at most 130°C or at most 120°C or at most 115°C; and the intermediate layer comprises one or more propylene/ethylene copolymers; (iv) a tie layer between the intermediate layer and the first polyamide layer, the tie layer comprising one or more tie polymers; and heating the film, preferably to a temperature of at least 45°C and at most 105°C; and forming the heated film onto a mold. providing a film comprising: (i) a skin layer forming an outer surface of the film, wherein: the skin layer has a melting point of at least 130°C and at most 150°C, preferably at most 145°C or at most 140°C; and the skin layer comprises one or more propylene/ethylene copolymers; and (ii) a first polyamide layer forming an interior layer of the film, wherein: the first polyamide layer has a melting point of at least 125°C and at most 230°C; and the first polyamide layer comprises one or more polyamides; (iii) an intermediate layer between the skin layer and the first polyamide layer, preferably directly adjacent the skin layer, wherein the intermediate layer has a melting point of at least 105°C and at most 150°C, preferably at most 130°C or at most 120°C or at most 115°C; and the intermediate layer comprises one or more propylene/ethylene copolymers; (iv) a tie layer between the intermediate layer and the first polyamide layer, the tie layer comprising one or more tie polymers; and (i) a skin layer forming an outer surface of the film, wherein: the skin layer has a melting point of at least 130°C and at most 150°C, preferably at most 145°C or at most 140°C; and the skin layer comprises one or more propylene/ethylene copolymers; and the skin layer has a melting point of at least 130°C and at most 150°C, preferably at most 145°C or at most 140°C; and the skin layer comprises one or more propylene/ethylene copolymers; and (ii) a first polyamide layer forming an interior layer of the film, wherein: the first polyamide layer has a melting point of at least 125°C and at most 230°C; and the first polyamide layer comprises one or more polyamides; the first polyamide layer has a melting point of at least 125°C and at most 230°C; and the first polyamide layer comprises one or more polyamides; (iii) an intermediate layer between the skin layer and the first polyamide layer, preferably directly adjacent the skin layer, wherein the intermediate layer has a melting point of at least 105°C and at most 150°C, preferably at most 130°C or at most 120°C or at most 115°C; and the intermediate layer comprises one or more propylene/ethylene copolymers; (iv) a tie layer between the intermediate layer and the first polyamide layer, the tie layer comprising one or more tie polymers; and heating the film, preferably to a temperature of at least 45°C and at most 105°C; and forming the heated film onto a mold.