A package for housing an electronic component, comprising: an insulating substrate including a plurality of insulating layers stacked on top of each other and defining a recess, an upper surface of the insulating substrate being provided with an electronic component mounting section at the bottom of the recess, the plurality of insulating layers each containing a first metal oxide as a major constituent, the insulating substrate further including a first metal layer having a frame-like form surrounding the recess and being disposed on an upper surface of an uppermost one of the plurality of insulating layers, the first metal layer containing a second metal oxide which is higher in infrared absorptivity than the first metal oxide, wherein the first metal layer is configured such that a lid body may be joined to the first metal layer by a brazing: material so as to cover over the electronic component mounting section, characterized in that the electronic component housing package further comprises: a first absorbing layer disposed on a side surface or a lower surface of the insulating substrate, the first absorbing layer containing the same insulating material as the insulating material contained in the plurality of insulating layers or the same metal material as the metal material contained in the first metal layer, the first absorbing layer containing the second metal oxide; and/or a second absorbing layer disposed between the plurality of insulating layers, the second absorbing layer containing either the same insulating material as the insulating material contained in the plurality of insulating layers or the same metal material as the metal material contained in the first metal layer, and further containing the second metal oxide. an insulating substrate including a plurality of insulating layers stacked on top of each other and defining a recess, an upper surface of the insulating substrate being provided with an electronic component mounting section at the bottom of the recess, the plurality of insulating layers each containing a first metal oxide as a major constituent, the insulating substrate further including a first metal layer having a frame-like form surrounding the recess and being disposed on an upper surface of an uppermost one of the plurality of insulating layers, the first metal layer containing a second metal oxide which is higher in infrared absorptivity than the first metal oxide, wherein the first metal layer is configured such that a lid body may be joined to the first metal layer by a brazing: material so as to cover over the electronic component mounting section, characterized in that the electronic component housing package further comprises: a first absorbing layer disposed on a side surface or a lower surface of the insulating substrate, the first absorbing layer containing the same insulating material as the insulating material contained in the plurality of insulating layers or the same metal material as the metal material contained in the first metal layer, the first absorbing layer containing the second metal oxide; and/or a second absorbing layer disposed between the plurality of insulating layers, the second absorbing layer containing either the same insulating material as the insulating material contained in the plurality of insulating layers or the same metal material as the metal material contained in the first metal layer, and further containing the second metal oxide. a first absorbing layer disposed on a side surface or a lower surface of the insulating substrate, the first absorbing layer containing the same insulating material as the insulating material contained in the plurality of insulating layers or the same metal material as the metal material contained in the first metal layer, the first absorbing layer containing the second metal oxide; and/or a second absorbing layer disposed between the plurality of insulating layers, the second absorbing layer containing either the same insulating material as the insulating material contained in the plurality of insulating layers or the same metal material as the metal material contained in the first metal layer, and further containing the second metal oxide.