A plasma processing apparatus comprising: a processing chamber configured in a vertically two-divided configuration of an upper chamber and a lower chamber, the lower chamber having a substrate disposed therein; gas supply means configured for supplying a processing gas into the upper chamber; plasma generating means (30, 31) configured for forming a plasma from a processing gas supplied into the upper chamber; and voltage applying means configured for applying high-frequency voltage to the plasma generating means (30, 31), the lower chamber having an inner space open at the top thereof, the upper chamber having an inner space open at the bottom thereof, said inner spaces communicating with each other, characterized in that: the upper chamber is configured from at least an annular plate, the lower surface on the outer peripheral side of which is in contact with the upper portion of the lower chamber, a sidewall member which is formed in a hollow cylindrical shape and the lower end portion of which is placed on the annual plate, and a top plate which is placed on the upper end portion of the sidewall member; the plasma processing apparatus further comprises an elevating board which is disposed horizontally and provided to be vertically movable and which is configured so that at least one of the annular plate and the top plate configuring the upper chamber can be attached thereto, elevating means configured for supporting and moving up and down the elevating board, and at least three fixing means, first, second and third fixing means (48, 49, 50, 51), configured for fixing the upper chamber; the elevating board has a vertically penetrating through hole having such a size that the top plate can pass therethrough; the plasma generating means is disposed outside the sidewall member and fixed on the lower surface of the elevating board; the first fixing means (48, 49) is configured to connect and fix the elevating board and the top plate and to be capable of releasing the connection and fixing; the second fixing means is configured to connect and fix the elevating board and the annular plate and to be capable of releasing the connection and fixing; and the third fixing means is configured to fix the annular plate to the lower chamber and to be capable of releasing the fixing. a processing chamber configured in a vertically two-divided configuration of an upper chamber and a lower chamber, the lower chamber having a substrate disposed therein; gas supply means configured for supplying a processing gas into the upper chamber; plasma generating means (30, 31) configured for forming a plasma from a processing gas supplied into the upper chamber; and voltage applying means configured for applying high-frequency voltage to the plasma generating means (30, 31), the upper chamber is configured from at least an annular plate, the lower surface on the outer peripheral side of which is in contact with the upper portion of the lower chamber, a sidewall member which is formed in a hollow cylindrical shape and the lower end portion of which is placed on the annual plate, and a top plate which is placed on the upper end portion of the sidewall member; the plasma processing apparatus further comprises an elevating board which is disposed horizontally and provided to be vertically movable and which is configured so that at least one of the annular plate and the top plate configuring the upper chamber can be attached thereto, elevating means configured for supporting and moving up and down the elevating board, and at least three fixing means, first, second and third fixing means (48, 49, 50, 51), configured for fixing the upper chamber; the elevating board has a vertically penetrating through hole having such a size that the top plate can pass therethrough; the plasma generating means is disposed outside the sidewall member and fixed on the lower surface of the elevating board; the first fixing means (48, 49) is configured to connect and fix the elevating board and the top plate and to be capable of releasing the connection and fixing; the second fixing means is configured to connect and fix the elevating board and the annular plate and to be capable of releasing the connection and fixing; and the third fixing means is configured to fix the annular plate to the lower chamber and to be capable of releasing the fixing.