A system for analyzing a sample, comprising: an inspection module including one or more inspection illumination sources configured to sequentially illuminate a back side of the sample with red, green, and blue illumination, and one or more monochromic detectors configured to receive illumination reflected from the backside of the sample in response to the sequential illumination by the one or more inspection illumination sources, wherein the one or more monochromic detectors comprise a monochrome TDI camera or array; a review module including one or more review illumination sources, consisting of one or more pulse width modulated light emitting diodes (LEDs), configured to illuminate the backside of the sample and one or more detectors configured to receive illumination reflected from the backside of the sample in response to the illumination by the one or more review illumination sources, wherein the LEDs are configured to provide a first plurality of illumination pulses and at least a second plurality of illumination pulses sequentially delayed with respect to one another according to the illumination collection time of the monochrome TDI camera or array; a stage assembly configured to support the sample by contacting a selected number of points on the backside of the sample and a selected number of points along an edge of the sample, wherein the backside of the sample is accessible to illumination associated with the inspection module and the review module; and at least one computing system in communication with the inspection module and the review module, the at least one computing system configured to determine a location of a defect of the sample utilizing information associated with the illumination received by the one or more monochromic detectors of the inspection module and further configured to collect an image of a portion of the backside of the sample including the defect utilizing the one or more detectors of the review module and the determined location of the defect, and wherein the review module is further configured to image one or more portions of the backside of the sample including the one or more located defects after illumination by the inspection module, utilizing information collected by the inspection module. an inspection module including one or more inspection illumination sources configured to sequentially illuminate a back side of the sample with red, green, and blue illumination, and one or more monochromic detectors configured to receive illumination reflected from the backside of the sample in response to the sequential illumination by the one or more inspection illumination sources, wherein the one or more monochromic detectors comprise a monochrome TDI camera or array; a review module including one or more review illumination sources, consisting of one or more pulse width modulated light emitting diodes (LEDs), configured to illuminate the backside of the sample and one or more detectors configured to receive illumination reflected from the backside of the sample in response to the illumination by the one or more review illumination sources, wherein the LEDs are configured to provide a first plurality of illumination pulses and at least a second plurality of illumination pulses sequentially delayed with respect to one another according to the illumination collection time of the monochrome TDI camera or array; a stage assembly configured to support the sample by contacting a selected number of points on the backside of the sample and a selected number of points along an edge of the sample, wherein the backside of the sample is accessible to illumination associated with the inspection module and the review module; and at least one computing system in communication with the inspection module and the review module, the at least one computing system configured to determine a location of a defect of the sample utilizing information associated with the illumination received by the one or more monochromic detectors of the inspection module and further configured to collect an image of a portion of the backside of the sample including the defect utilizing the one or more detectors of the review module and the determined location of the defect, and wherein the review module is further configured to image one or more portions of the backside of the sample including the one or more located defects after illumination by the inspection module, utilizing information collected by the inspection module.