A method for manufacturing a laminate including a support and a substrate having a back surface to be processed and a non-processed surface, the support and the non-processed surface being bonded via a temporary adhesive material, the method comprising the steps of: (a) laminating the temporary adhesive material on either or both of the support and the non-processed surface of the substrate, the temporary adhesive material being formed as a film; (b) preheating the support and the substrate before the bonding is started; and (c) bonding the support and the substrate via the temporary adhesive material, wherein in the step (b), the substrate is heated to a temperature of 50°C or more and 250°C or less, while the support is heated to a temperature of 50°C or more and 250°C or less but different from that of the substrate, characterized in that in the step (c), the bonding is started with the temperatures of the support and the substrate after the preheating being different, and further in that the temporary adhesive material comprises at least two or more layers of: (i) a first temporary adhesive material layer located at the substrate side; and (ii) a second temporary adhesive material layer located closer to the support side than the first temporary adhesive material layer; wherein the first temporary adhesive material layer and the second temporary adhesive material layer have a melt viscosity ratio α/β of 10 or less at 25°C and a lowest melt viscosity ratio of 100 or more at 100°C or more and 200°C or less. the method comprising the steps of: (a) laminating the temporary adhesive material on either or both of the support and the non-processed surface of the substrate, the temporary adhesive material being formed as a film; (b) preheating the support and the substrate before the bonding is started; and (c) bonding the support and the substrate via the temporary adhesive material, wherein in the step (b), the substrate is heated to a temperature of 50°C or more and 250°C or less, while the support is heated to a temperature of 50°C or more and 250°C or less but different from that of the substrate, characterized in that in the step (c), the bonding is started with the temperatures of the support and the substrate after the preheating being different, (a) laminating the temporary adhesive material on either or both of the support and the non-processed surface of the substrate, the temporary adhesive material being formed as a film; (b) preheating the support and the substrate before the bonding is started; and (c) bonding the support and the substrate via the temporary adhesive material, wherein in the step (b), the substrate is heated to a temperature of 50°C or more and 250°C or less, while the support is heated to a temperature of 50°C or more and 250°C or less but different from that of the substrate, characterized in that in the step (c), the bonding is started with the temperatures of the support and the substrate after the preheating being different, in the step (b), the substrate is heated to a temperature of 50°C or more and 250°C or less, while the support is heated to a temperature of 50°C or more and 250°C or less but different from that of the substrate, characterized in that in the step (c), the bonding is started with the temperatures of the support and the substrate after the preheating being different, and further in that the temporary adhesive material comprises at least two or more layers of: (i) a first temporary adhesive material layer located at the substrate side; and (ii) a second temporary adhesive material layer located closer to the support side than the first temporary adhesive material layer; (i) a first temporary adhesive material layer located at the substrate side; and (ii) a second temporary adhesive material layer located closer to the support side than the first temporary adhesive material layer; wherein the first temporary adhesive material layer and the second temporary adhesive material layer have a melt viscosity ratio α/β of 10 or less at 25°C and a lowest melt viscosity ratio of 100 or more at 100°C or more and 200°C or less.