A method for manufacturing a chip resistor, said method comprising the following steps of: a) sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer to form a semi-product; b) forming a plurality of resistor sections arranged in an array on the semi-product by forming a plurality of first slots through the semi-product, the first slots extending in a first direction and being arranged in a plurality of rows, each row including a plurality of adjacent pairs of the first slots, and forming a plurality of second slots through the semi-product, the second slots extending in a second direction perpendicular to the first direction and being arranged in a plurality of columns, each adjacent pair of the second slots cooperating with a corresponding adjacent pair of the first slots to surround and define one of the resistor sections, each of the resistor sections having a first layer which is a segment of the electric-conducting material layer, a second layer which is a segment of the heat-dissipating material layer, and a sandwiched layer which is a segment of the electric-insulating material layer; c) for each resistor section, forming a plurality of slits on the first layer of the resistor section to form a resistor main body, the slits extending in the first direction and being arranged and spaced apart from one another in the second direction, the resistor main body having a pair of ends opposite to each other in the second direction and corresponding respectively to a pair of the first slots that define the resistor section; d) for each resistor section, forming at least one dividing slot on the second layer of the resistor section, the dividing slot projectively crossing at least one of the slits of the resistor section and dividing the second layer of the resistor section into at least two portions (233, 234) that are spaced apart from each other in the second direction; e) for each resistor section, forming two electrodes that are electrically and respectively connected to the ends of the resistor main body; and f) after step e) of forming two electrodes for each resistor section, trimming each of the resistor sections from the semi-product to obtain a chip resistor; wherein, in step d), the dividing slot is formed to have at least two segments which form an obtuse angle therebetween; wherein step a) includes the following sub-steps of: coating a heat-conductive polymer material on one of the electric-conducting material layer and the heat-dissipating material layer; stacking the other one of the electric-conducting material layer and the heat-dissipating material layer on the heat-conductive polymer material; and heating the electric-conducting material layer and the heat-dissipating material layer under a vacuum condition to solidify the heat-conductive polymer material serving as the electric-insulating material layer, thereby forming the semi-product. a) sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer to form a semi-product; b) forming a plurality of resistor sections arranged in an array on the semi-product by forming a plurality of first slots through the semi-product, the first slots extending in a first direction and being arranged in a plurality of rows, each row including a plurality of adjacent pairs of the first slots, and forming a plurality of second slots through the semi-product, the second slots extending in a second direction perpendicular to the first direction and being arranged in a plurality of columns, each adjacent pair of the second slots cooperating with a corresponding adjacent pair of the first slots to surround and define one of the resistor sections, each of the resistor sections having a first layer which is a segment of the electric-conducting material layer, a second layer which is a segment of the heat-dissipating material layer, and a sandwiched layer which is a segment of the electric-insulating material layer; c) for each resistor section, forming a plurality of slits on the first layer of the resistor section to form a resistor main body, the slits extending in the first direction and being arranged and spaced apart from one another in the second direction, the resistor main body having a pair of ends opposite to each other in the second direction and corresponding respectively to a pair of the first slots that define the resistor section; d) for each resistor section, forming at least one dividing slot on the second layer of the resistor section, the dividing slot projectively crossing at least one of the slits of the resistor section and dividing the second layer of the resistor section into at least two portions (233, 234) that are spaced apart from each other in the second direction; e) for each resistor section, forming two electrodes that are electrically and respectively connected to the ends of the resistor main body; and f) after step e) of forming two electrodes for each resistor section, trimming each of the resistor sections from the semi-product to obtain a chip resistor; coating a heat-conductive polymer material on one of the electric-conducting material layer and the heat-dissipating material layer; stacking the other one of the electric-conducting material layer and the heat-dissipating material layer on the heat-conductive polymer material; and heating the electric-conducting material layer and the heat-dissipating material layer under a vacuum condition to solidify the heat-conductive polymer material serving as the electric-insulating material layer, thereby forming the semi-product.