Method for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, wherein - a nonmetallic plate having at least one conductor structure arranged thereon and at least one first solder connection surface is provided, - at least one contact element made of a ferromagnetic stainless steel and having at least one second solder connection surface is provided, - at least one solder deposit is arranged, at least in sections, on the first solder connection surface or the second solder connection surface or on both, - the second solder connection surface is arranged on the first solder connection surface, wherein the solder deposit is arranged, at least in sections, between the first solder connection surface and the second solder connection surface, - a magnetic field with a predefined frequency is radiated by a soldering tool containing an electrically supplied induction loop into the contact element, in order to heat it by induction and to melt the solder deposit positioned thereon, wherein the soldering tool for inductive soldering, comprises - an induction loop and - an induction generator that is electrically conductively connected to the induction loop, wherein the induction loop - consists of a metal profiled element, - has at least one U-shaped region or two U-shaped regions, and each U-shaped region has in each case two legs and a rounded end region connecting the legs, - the at least one U-shaped region has a length L of at least 3 mm and preferably to 500 mm, and a width B of 2 mm to 30 mm, preferably of 4 mm to 25 mm, wherein the rounded end region serves as the soldering tip of the induction loop, wherein the rounded end region of the induction loop is applied to the contact element on the side of the contact element facing away from the second solder connection surface directly or via an electrically insulating intermediate layer or with a narrow air gap, so that the smallest distance between the induction loop and the contact element is in the end region of the induction loop. - a nonmetallic plate having at least one conductor structure arranged thereon and at least one first solder connection surface is provided, - at least one contact element made of a ferromagnetic stainless steel and having at least one second solder connection surface is provided, - at least one solder deposit is arranged, at least in sections, on the first solder connection surface or the second solder connection surface or on both, - the second solder connection surface is arranged on the first solder connection surface, wherein the solder deposit is arranged, at least in sections, between the first solder connection surface and the second solder connection surface, - a magnetic field with a predefined frequency is radiated by a soldering tool containing an electrically supplied induction loop into the contact element, in order to heat it by induction and to melt the solder deposit positioned thereon, wherein the soldering tool for inductive soldering, comprises - an induction loop and - an induction generator that is electrically conductively connected to the induction loop, - an induction loop and - an induction generator that is electrically conductively connected to the induction loop, wherein the induction loop - consists of a metal profiled element, - has at least one U-shaped region or two U-shaped regions, and each U-shaped region has in each case two legs and a rounded end region connecting the legs, - the at least one U-shaped region has a length L of at least 3 mm and preferably to 500 mm, and a width B of 2 mm to 30 mm, preferably of 4 mm to 25 mm, - consists of a metal profiled element, - has at least one U-shaped region or two U-shaped regions, and each U-shaped region has in each case two legs and a rounded end region connecting the legs, - the at least one U-shaped region has a length L of at least 3 mm and preferably to 500 mm, and a width B of 2 mm to 30 mm, preferably of 4 mm to 25 mm, wherein the rounded end region serves as the soldering tip of the induction loop, wherein the rounded end region of the induction loop is applied to the contact element on the side of the contact element facing away from the second solder connection surface directly or via an electrically insulating intermediate layer or with a narrow air gap, so that the smallest distance between the induction loop and the contact element is in the end region of the induction loop.