A conductive structure, comprising: a single-layer busbar that is formed in a plate shape and constitutes a conductive path of a vehicle; and a multi-layer busbar that is configured by laminating a plurality of busbars which are formed as plates thinner than the single-layer busbar and that is joined to an end of the single-layer busbar and constitutes the conductive path, wherein the multi-layer busbar includes a main body portion in which at least some of the laminated plurality of busbars are capable of mutual displacement relative to the busbars adjacent thereto, and a joining end located at an end of the main body portion on the single-layer busbar side and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other, the joining end being joined to the end of the single-layer busbar, wherein a length along a direction of extension of the single-layer busbar is longer than a length along the direction of extension of the multi-layer busbar, wherein the conductive structure further comprises: an insulating coating that covers and insulates outer surfaces of the single-layer busbar and the multi-layer busbar, wherein the multi-layer busbar includes an attachment end that is located at the end of the main body portion on the side opposite to the joining end side, and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other. a single-layer busbar that is formed in a plate shape and constitutes a conductive path of a vehicle; and a multi-layer busbar that is configured by laminating a plurality of busbars which are formed as plates thinner than the single-layer busbar and that is joined to an end of the single-layer busbar and constitutes the conductive path, wherein the multi-layer busbar includes a main body portion in which at least some of the laminated plurality of busbars are capable of mutual displacement relative to the busbars adjacent thereto, and a joining end located at an end of the main body portion on the single-layer busbar side and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other, the joining end being joined to the end of the single-layer busbar, wherein a length along a direction of extension of the single-layer busbar is longer than a length along the direction of extension of the multi-layer busbar, wherein the conductive structure further comprises: an insulating coating that covers and insulates outer surfaces of the single-layer busbar and the multi-layer busbar, wherein the multi-layer busbar includes an attachment end that is located at the end of the main body portion on the side opposite to the joining end side, and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other. an insulating coating that covers and insulates outer surfaces of the single-layer busbar and the multi-layer busbar, wherein the multi-layer busbar includes an attachment end that is located at the end of the main body portion on the side opposite to the joining end side, and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other.