An integrally formed vapor chamber configured to conduct heat from at least one electronic heat generating component, the integrally formed vapor chamber comprising: at least one heat frame conductively couplable to the at least one electronic heat generating component to conduct heat from the at least one electronic heat generating component; a working fluid contained within the integrally formed vapor chamber, the working fluid configured to dissipate heat from the at least one heat frame; at least one receptacle on a side of the at least one heat frame and in fluid communication with the at least one heat frame; and a non-uniform wick structure coupled to at least a component side of the integrally formed vapor chamber and configured to direct the working fluid towards the at least one electronic heat generating component; wherein pores of the non-uniform wick structure adjacent the component side of the integrally formed vapor chamber are larger than pores on an opposing vapor side of the integrally formed vapor chamber, wherein the non-uniform wick structure and the at least one heat frame including the component side and the opposing vapor side are integrally and unitarily formed, and the integrally formed vapor chamber is formed between the component side and the opposing vapor side; wherein the non-uniform wick structure is further coupled to the opposing vapor side of the integrally formed vapor chamber, wherein the non-uniform wick structure coupled to the component side and the non-uniform wick structure coupled to the opposing vapor side of the integrally formed vapor chamber form a vapor channel therebetween; wherein the at least one heat frame is conductively coupleable to a top surface and at least one side surface of the at least one electronic heat generating component. at least one heat frame conductively couplable to the at least one electronic heat generating component to conduct heat from the at least one electronic heat generating component; a working fluid contained within the integrally formed vapor chamber, the working fluid configured to dissipate heat from the at least one heat frame; at least one receptacle on a side of the at least one heat frame and in fluid communication with the at least one heat frame; and a non-uniform wick structure coupled to at least a component side of the integrally formed vapor chamber and configured to direct the working fluid towards the at least one electronic heat generating component; wherein pores of the non-uniform wick structure adjacent the component side of the integrally formed vapor chamber are larger than pores on an opposing vapor side of the integrally formed vapor chamber, wherein the non-uniform wick structure and the at least one heat frame including the component side and the opposing vapor side are integrally and unitarily formed, and the integrally formed vapor chamber is formed between the component side and the opposing vapor side; wherein the non-uniform wick structure is further coupled to the opposing vapor side of the integrally formed vapor chamber, wherein the non-uniform wick structure coupled to the component side and the non-uniform wick structure coupled to the opposing vapor side of the integrally formed vapor chamber form a vapor channel therebetween; wherein the at least one heat frame is conductively coupleable to a top surface and at least one side surface of the at least one electronic heat generating component.