mhurhangee/ep-ind-claims huggingface dataset:
A LED package, comprising: a package body (506, 509) including an upper package body and a lower package body; a heat sink, a pair of lead frames spaced apart from each other and located between the upper package body and the lower package body; a submount mounted on the upper portion of the heat sink and having electrode patterns; light emitting cells (100a, 100b, 100c) bonded to the electrode patterns of the submount and coupled to one another in series through the electrode patterns; wherein each light emitting cell (100a, 100b, 100c) comprises a first-type semiconductor layer and a second-type semiconductor layer interposed between a portion of the first-type semiconductor layer and the electrode patterns, and a molding member (521, 523) covering the light emitting cells (100a, 100b, 100c), wherein each light emitting cell (100a, 100b, 100c) comprises a surface exposed to the molding member (521, 523), the exposed surface being opposite to, and not facing, the submount, and the exposed surface comprises the first-type semiconductor layer or a buffer layer. wherein the package body (506, 509) supports the pair of lead frames and the heat sink and has an opening for exposing a portion of each of the lead frames and an upper portion of the heat sink, wherein each of the pair of lead frames comprises: an inner frame outer frames extending from the inner frame and protruding to the outside of the package body (506, 509), and supports extending from the inner frame and protruding to the outside of the package body (506, 509), wherein the supports extend in a direction substantially perpendicular with respect to the outer frames. wherein inner frame-receiving grooves are formed in an upper face of the lower package body to receive the inner frames, the outer frames and the supports of the pair of lead frames. a package body (506, 509) including an upper package body and a lower package body; a heat sink, a pair of lead frames spaced apart from each other and located between the upper package body and the lower package body; a submount mounted on the upper portion of the heat sink and having electrode patterns; light emitting cells (100a, 100b, 100c) bonded to the electrode patterns of the submount and coupled to one another in series through the electrode patterns; wherein each light emitting cell (100a, 100b, 100c) comprises a first-type semiconductor layer and a second-type semiconductor layer interposed between a portion of the first-type semiconductor layer and the electrode patterns, and a molding member (521, 523) covering the light emitting cells (100a, 100b, 100c), wherein each light emitting cell (100a, 100b, 100c) comprises a surface exposed to the molding member (521, 523), the exposed surface being opposite to, and not facing, the submount, and the exposed surface comprises the first-type semiconductor layer or a buffer layer. an inner frame outer frames extending from the inner frame and protruding to the outside of the package body (506, 509), and supports extending from the inner frame and protruding to the outside of the package body (506, 509),
A support apparatus of an ultrasonic probe, the support apparatus comprising: a housing comprising an accommodation unit capable of accommodating the ultrasound probe and an adhesion unit capable of contacting a target object; and a first control unit configured to control an adhesive force of the adhesion unit being adhered to the target object according to whether a user touches at least one of the ultrasound probe and the housing; a second control unit configured to control a movement of the ultrasound probe according to whether the user touches at least one of the ultrasound probe and the housing; wherein the first control unit is configured to control the adhesive force to be smaller than a first reference value when a user touch is detected and to control the adhesive force to be greater than the first reference value when a user touch is not detected; wherein the second control unit comprises an actuator that is capable of moving such that the actuator contacts the ultrasound probe or is spaced apart from the ultrasound probe; and wherein the actuator is configured, when a user touch is not detected, to move the ultrasound probe in correspondence to a user command to move the ultrasound probe. a housing comprising an accommodation unit capable of accommodating the ultrasound probe and an adhesion unit capable of contacting a target object; and a first control unit configured to control an adhesive force of the adhesion unit being adhered to the target object according to whether a user touches at least one of the ultrasound probe and the housing; a second control unit configured to control a movement of the ultrasound probe according to whether the user touches at least one of the ultrasound probe and the housing; wherein the first control unit is configured to control the adhesive force to be smaller than a first reference value when a user touch is detected and to control the adhesive force to be greater than the first reference value when a user touch is not detected; wherein the second control unit comprises an actuator that is capable of moving such that the actuator contacts the ultrasound probe or is spaced apart from the ultrasound probe; and wherein the actuator is configured, when a user touch is not detected, to move the ultrasound probe in correspondence to a user command to move the ultrasound probe.
A method of controlling a gain of an optical amplifier comprising a gain medium (12; 38) and a pump light source, said method comprising the following steps: - determining or predicting a change of input signal power to the amplifier, and reacting to said determined or predicted change of input signal power by means of feed forward control comprising - changing the pump power from an initial pump power level to a new pump power level at a first time instant, the initial pump power level being the pump power level applied to the amplifier prior to the change in input signal power, - setting the pump power to a second pump power level at a second time instant, characterized in that the pump power level is varied in an oscillatory manner for at least one period of time starting at a third time instant and ending at a fourth time instant, wherein said third time instant is identical with or later than said first time instant and said fourth time instant is identical with or earlier than said second time instant. - determining or predicting a change of input signal power to the amplifier, and reacting to said determined or predicted change of input signal power by means of feed forward control comprising - changing the pump power from an initial pump power level to a new pump power level at a first time instant, the initial pump power level being the pump power level applied to the amplifier prior to the change in input signal power, - setting the pump power to a second pump power level at a second time instant, characterized in that the pump power level is varied in an oscillatory manner for at least one period of time starting at a third time instant and ending at a fourth time instant, wherein said third time instant is identical with or later than said first time instant and said fourth time instant is identical with or earlier than said second time instant.
A device for biometric identification of an object comprising: an optical image sensor element at least sensitive to an infrared spectrum to take at least one picture of the object under ambient light conditions with additional infrared light conditions, an infrared light source, wherein the infrared light source is a VCSEL, to provide additional infrared light for the infrared light conditions, and a processing unit to provide an image or image code for the biometric identification obtained from the picture, where the VCSEL emits a narrow infrared light spectrum with a peak wavelength of 940 nm and with a full width of half maximum of less than 5nm, and where an infrared bandpass filter is arranged in the light path between the object and a sensor array of the optical image sensor element having a transmission window covering at least the peak wavelength of the VCSEL, wherein the transmission window of the bandpass filter has a width of 10nm
A preparation method for curved glass, comprising: melting a glass batch into a glass liquid, and clearing the glass liquid; introducing the cleared glass liquid into a mold cavity with a preset shape, and forming, by using a compression molding process, a glass product with a shape corresponding to that of the curved glass, wherein a size of the glass product is greater than a size of the curved glass, wherein the curved glass is glass ceramics and a difference between a temperature of the cleared glass liquid and a temperature of the mold is greater than or equal to 500°C and less than or equal to 800°C; wherein the glass batch further comprises a nucleation agent; and after the introducing the cleared glass liquid into a mold cavity with a preset shape, and forming, by using a compression molding process, a glass product with a shape corresponding to that of the curved glass, the method further comprises: performing crystallization on the molded glass product; after performing crystallization on the molded glass product, annealing the molded glass product; and processing the annealed glass product into the curved glass based on the shape and the size of the curved glass. melting a glass batch into a glass liquid, and clearing the glass liquid; introducing the cleared glass liquid into a mold cavity with a preset shape, and forming, by using a compression molding process, a glass product with a shape corresponding to that of the curved glass, wherein a size of the glass product is greater than a size of the curved glass, wherein the curved glass is glass ceramics and a difference between a temperature of the cleared glass liquid and a temperature of the mold is greater than or equal to 500°C and less than or equal to 800°C; wherein the glass batch further comprises a nucleation agent; and after the introducing the cleared glass liquid into a mold cavity with a preset shape, and forming, by using a compression molding process, a glass product with a shape corresponding to that of the curved glass, the method further comprises: performing crystallization on the molded glass product; after performing crystallization on the molded glass product, annealing the molded glass product; and processing the annealed glass product into the curved glass based on the shape and the size of the curved glass. performing crystallization on the molded glass product; after performing crystallization on the molded glass product, annealing the molded glass product; and processing the annealed glass product into the curved glass based on the shape and the size of the curved glass.
A hinge comprising: a first and a second conductive pin element, wherein opposite ends of the first and second conductive pin elements are configured to mechanically engage an electronic device; and an insulator between portions of the first and second conductive pin elements, wherein the end of at least the first conductive pin element is configured to be in electrical communication with radio frequency circuitry of the electronic device such that the first conductive pin element operates as a radiating element, wherein the insulator is formed of a non-conductive material, characterized in that the first and second conductive pin elements each comprise an outer conductor that defines an interior passageway that extends in a lengthwise direction and wherein at least the first conductive pin element comprises an inner conductor that extends at least partially through the interior passageway of the first conductive pin element, wherein at least the first conductive pin element further comprises a shielding within the interior passageway between the outer conductor and the inner conductor, and wherein the shielding is electrically isolated from the inner conductor of the first conductive pin element. a first and a second conductive pin element, wherein opposite ends of the first and second conductive pin elements are configured to mechanically engage an electronic device; and an insulator between portions of the first and second conductive pin elements, wherein the end of at least the first conductive pin element is configured to be in electrical communication with radio frequency circuitry of the electronic device such that the first conductive pin element operates as a radiating element, wherein the insulator is formed of a non-conductive material, characterized in that the first and second conductive pin elements each comprise an outer conductor that defines an interior passageway that extends in a lengthwise direction and wherein at least the first conductive pin element comprises an inner conductor that extends at least partially through the interior passageway of the first conductive pin element, wherein at least the first conductive pin element further comprises a shielding within the interior passageway between the outer conductor and the inner conductor, and wherein the shielding is electrically isolated from the inner conductor of the first conductive pin element.
A data processing method for addition of a load applying body, wherein the method is applied to a computer device, the computer device is connected with a three-dimensional laser scanning device, and the method comprises: acquiring first rigging model data to which a load applying body has been added; wherein the first rigging model data is model data generated by adding the load applying body using three-dimensional modeling software; controlling a three-dimensional laser scanning device to aim at predefined mark points arranged on a surface of a rigging model entity, and to move along with the predefined mark points; wherein the rigging model entity is a model entity corresponding to the first rigging model data; acquiring movement data of the three-dimensional laser scanning device moving along with the predefined mark points, and determining, according to the movement data, deformation data generated by the rigging model entity when bearing stress; analysing, according to the deformation data, arrangement accuracy of the load applying body which has been added to the first rigging model data; and adjusting an arrangement position of the added load applying body, based on the arrangement accuracy and data of the load applying body, to obtain the adjusted second rigging model data. acquiring first rigging model data to which a load applying body has been added; wherein the first rigging model data is model data generated by adding the load applying body using three-dimensional modeling software; controlling a three-dimensional laser scanning device to aim at predefined mark points arranged on a surface of a rigging model entity, and to move along with the predefined mark points; wherein the rigging model entity is a model entity corresponding to the first rigging model data; acquiring movement data of the three-dimensional laser scanning device moving along with the predefined mark points, and determining, according to the movement data, deformation data generated by the rigging model entity when bearing stress; analysing, according to the deformation data, arrangement accuracy of the load applying body which has been added to the first rigging model data; and adjusting an arrangement position of the added load applying body, based on the arrangement accuracy and data of the load applying body, to obtain the adjusted second rigging model data.
An evaluation method, comprising measuring infrared absorption spectra on a rubber specimen under application of no tensile force and under application of a tensile force, using the infrared absorption spectra to calculate an amount of peak shift of the infrared absorption spectra caused by a change in a distance between bonded atoms of the rubber specimen under application of the tensile force, and evaluating stress in the rubber specimen from the amount of peak shift. measuring infrared absorption spectra on a rubber specimen under application of no tensile force and under application of a tensile force, using the infrared absorption spectra to calculate an amount of peak shift of the infrared absorption spectra caused by a change in a distance between bonded atoms of the rubber specimen under application of the tensile force, and evaluating stress in the rubber specimen from the amount of peak shift.
A method of mitigating the effects of speckle in a laser-based vibration/velocity sensor, the method comprising the steps of: a) generating at least one light beam from at least one coherent light source; b) splitting the at least one light beam into a first component and a second component; c) directing the first component of the at least one light beam to an optical transmitting antenna; d) transmitting the first component of the at least one light beam from the optical transmitting antenna towards a moving target surface; e) receiving at least one reflected light beam from the moving target surface at an optical receiving antenna; f) combining the at least one reflected light beam with the second component of the at least one light beam to form at least one combined beam; g) converting the at least one combined light beam into at least one electrical signal; and h) processing the at least one electrical signal to derive an output signal indicative of motion of the moving target surface; characterised in that step d) comprises scanning the first component of the at least one light beam over the moving target surface such that a scanning beam is directed towards the moving target surface and/or step e) comprises scanning the at least one reflected beam onto the optical receiving antenna to generate scanned signals; and in that step h) comprises: averaging the electrical signals corresponding to the reflected scanned beams and/or the scanned signals; and demodulating the averaged electrical signals. a) generating at least one light beam from at least one coherent light source; b) splitting the at least one light beam into a first component and a second component; c) directing the first component of the at least one light beam to an optical transmitting antenna; d) transmitting the first component of the at least one light beam from the optical transmitting antenna towards a moving target surface; e) receiving at least one reflected light beam from the moving target surface at an optical receiving antenna; f) combining the at least one reflected light beam with the second component of the at least one light beam to form at least one combined beam; g) converting the at least one combined light beam into at least one electrical signal; and h) processing the at least one electrical signal to derive an output signal indicative of motion of the moving target surface; averaging the electrical signals corresponding to the reflected scanned beams and/or the scanned signals; and demodulating the averaged electrical signals.
An additive composition for polymer comprising components A, B and C, wherein it comprises: a component A: 80wt% - 99.99wt% of dialkyl phosphinates with structures shown as Formula: wherein, R1 and R2 are the same or different, representing ethyl, propyl and/or butyl; M is Mg, Ca, Al, Zn or Fe; m is 2 or 3; a component B: up to 20wt% of components with structures shown as Formula: wherein, R3 represents ethyl, propyl and/or butyl; M is Mg, Ca, Al, Zn or Fe; m is 2 or 3; and a component C: up to 0.9wt% of phosphites with structures shown as Formula: wherein, M is Mg, Ca, Al, Zn or Fe; m is 2 or 3; and a total sum of the components A, B and C is always 100wt%. a component A: 80wt% - 99.99wt% of dialkyl phosphinates with structures shown as Formula: wherein, R1 and R2 are the same or different, representing ethyl, propyl and/or butyl; M is Mg, Ca, Al, Zn or Fe; m is 2 or 3; a component B: up to 20wt% of components with structures shown as Formula: wherein, R3 represents ethyl, propyl and/or butyl; M is Mg, Ca, Al, Zn or Fe; m is 2 or 3; and a component C: up to 0.9wt% of phosphites with structures shown as Formula: wherein, M is Mg, Ca, Al, Zn or Fe; m is 2 or 3; and a total sum of the components A, B and C is always 100wt%.
A process for polymerization comprising: (i) providing a polyolefin product stream, wherein the polyolefin product stream comprises polyolefin product and unreacted monomer; (ii) quenching the polyolefin product stream with a quenching agent selected from water, a C 1 to C 8 alcohol, and mixtures thereof, to produce a quenched polyolefin stream, (iii) separating the quenched polyolefin stream into polyolefin product and a recycle stream; and (iv) contacting at least a portion of the recycle stream with an adsorbent bed to produce a treated recycle stream, wherein the recycle stream comprises quenching agent, one or more C 6 to C 12 conjugated or non-conjugated diene monomers, and one or more C 1 to C 40 oxygenates, and wherein the adsorbent bed comprises at least two adsorbents to remove the quenching agent and the C 1 to C 40 oxygenates. (i) providing a polyolefin product stream, wherein the polyolefin product stream comprises polyolefin product and unreacted monomer; (ii) quenching the polyolefin product stream with a quenching agent selected from water, a C 1 to C 8 alcohol, and mixtures thereof, to produce a quenched polyolefin stream, (iii) separating the quenched polyolefin stream into polyolefin product and a recycle stream; and (iv) contacting at least a portion of the recycle stream with an adsorbent bed to produce a treated recycle stream, wherein the recycle stream comprises quenching agent, one or more C 6 to C 12 conjugated or non-conjugated diene monomers, and one or more C 1 to C 40 oxygenates, and wherein the adsorbent bed comprises at least two adsorbents to remove the quenching agent and the C 1 to C 40 oxygenates.
A separation device for separating a crop mixture from root crops and admixtures, comprising at least one conveyor element circulating during operation and designed as a conveyor belt at least for feeding the crop mixture to a separation area or for discharging the root crops from the separation area in a conveying direction, as well as at least one fluid-flow generator, and at least one guiding device for guiding a fluid flow in a direction of the fluid flow to the separation area, wherein the guiding device is formed in at least one guide section by the conveying element, characterized in that the conveying element is designed as a substantially fluid-impermeable conveyor belt and the guide section is formed by a section of a conveying side of the conveyor belt, which delimits the fluid flow upward in a vertical direction.