An apparatus for joining an adhesive tape for support to a bottom surface of a ring frame (f) and a bottom surface of a semiconductor wafer (w) mounted on a center of the ring frame (f) to integrate the semiconductor wafer (w) with the ring frame (f), the apparatus comprising: a workpiece holding mechanism for holding each of a ring frame (f) and a semiconductor wafer (w) in a predetermined position a tape supplying device for switching between loading a strip-shaped adhesive tape comprising a separator and loading a strip-shaped carrier tape holding a precut adhesive tape corresponding in size to the ring frame (f) and for supplying the strip-shaped adhesive tape toward a bottom surface of the ring frame (f) held by the workpiece holding mechanism a tension mechanism that applies a tension to the supplied strip-shaped adhesive tape in a width direction; a movable joining unit including a joining roller and a separating member, the joining roller being designed for rolling on a non-adhesion surface of the strip-shaped adhesive tape with the tension being applied thereto by the tension mechanism and for rolling on a non-adhesion surface of the precut adhesive tape separated from the carrier tape folded back by the separating member while pressing the non-adhesion surfaces, and joining the strip-shaped adhesive tape or the precut adhesive tape to the ring frame (f) and the semiconductor wafer (w) each held by the workpiece holding mechanism; a tape cutting mechanism for cutting the joined strip-shaped adhesive tape along a contour of the ring frame; a pinch roller and a residual tape collecting section for taking up and collecting a residual tape of the cut strip-shaped adhesive tape, wherein the apparatus is arranged such that - when the strip-shaped adhesive tape is joined, the separator is separated via the pinch roller, the strip-shaped adhesive tape from which the separator is separated is suspended across the pinch roller and the separating unit, and the joining roller presses the strip-shaped adhesive tape against the ring frame and the semiconductor wafer while the joining unit moves along the strip-shaped adhesive tape and - when the precut adhesive tape is joined, the joining roller subsequently presses against the ring frame and the semiconductor wafer the precut adhesive tape fed out from the separating member provided in the joining unit while the joining unit moves. a workpiece holding mechanism for holding each of a ring frame (f) and a semiconductor wafer (w) in a predetermined position a tape supplying device for switching between loading a strip-shaped adhesive tape comprising a separator and loading a strip-shaped carrier tape holding a precut adhesive tape corresponding in size to the ring frame (f) and for supplying the strip-shaped adhesive tape toward a bottom surface of the ring frame (f) held by the workpiece holding mechanism a tension mechanism that applies a tension to the supplied strip-shaped adhesive tape in a width direction; a movable joining unit including a joining roller and a separating member, the joining roller being designed for rolling on a non-adhesion surface of the strip-shaped adhesive tape with the tension being applied thereto by the tension mechanism and for rolling on a non-adhesion surface of the precut adhesive tape separated from the carrier tape folded back by the separating member while pressing the non-adhesion surfaces, and joining the strip-shaped adhesive tape or the precut adhesive tape to the ring frame (f) and the semiconductor wafer (w) each held by the workpiece holding mechanism; a tape cutting mechanism for cutting the joined strip-shaped adhesive tape along a contour of the ring frame; a pinch roller and a residual tape collecting section for taking up and collecting a residual tape of the cut strip-shaped adhesive tape, wherein the apparatus is arranged such that - when the strip-shaped adhesive tape is joined, the separator is separated via the pinch roller, the strip-shaped adhesive tape from which the separator is separated is suspended across the pinch roller and the separating unit, and the joining roller presses the strip-shaped adhesive tape against the ring frame and the semiconductor wafer while the joining unit moves along the strip-shaped adhesive tape and - when the precut adhesive tape is joined, the joining roller subsequently presses against the ring frame and the semiconductor wafer the precut adhesive tape fed out from the separating member provided in the joining unit while the joining unit moves. - when the strip-shaped adhesive tape is joined, the separator is separated via the pinch roller, the strip-shaped adhesive tape from which the separator is separated is suspended across the pinch roller and the separating unit, and the joining roller presses the strip-shaped adhesive tape against the ring frame and the semiconductor wafer while the joining unit moves along the strip-shaped adhesive tape and - when the precut adhesive tape is joined, the joining roller subsequently presses against the ring frame and the semiconductor wafer the precut adhesive tape fed out from the separating member provided in the joining unit while the joining unit moves.