An antenna device comprising: an antenna that can radiate a signal with a frequency f 0; and a dielectric substrate for transmitting a signal with the frequency fo, the dielectric substrate comprising: a dielectric; and a first copper film pattern and a second copper film pattern arranged on a first surface of the dielectric, wherein the first copper film pattern has a first dimension L A in a first direction along the dielectric substrate, and the first dimension L A is given by: L A = 1 ε r − 1 k A λ 0 and wherein the second copper film pattern has a second dimension L B in the first direction along the dielectric substrate, and the second dimension L B is given by: L B = 1 ε r − 1 k B λ 0 where ε r represents a relative permittivity of the dielectric, k A, k B represent constants in a range of 0.15 to 0.70, and λ 0 represents a free space wavelength of the signal; wherein the first dimension L A and the second dimension L B in the first direction are different from each other so that a plurality of frequencies can be suppressed or reduced in the first direction in accordance with the first dimension of the first copper film pattern and the second dimension of the second copper film pattern; wherein, in the first direction, a distance between the first copper film pattern and the second copper film pattern is smaller than or equal to λ 0. an antenna that can radiate a signal with a frequency f 0; and a dielectric substrate for transmitting a signal with the frequency fo, the dielectric substrate comprising: a dielectric; and a first copper film pattern and a second copper film pattern arranged on a first surface of the dielectric, wherein the first copper film pattern has a first dimension L A in a first direction along the dielectric substrate, and the first dimension L A is given by: L A = 1 ε r − 1 k A λ 0 and wherein the second copper film pattern has a second dimension L B in the first direction along the dielectric substrate, and the second dimension L B is given by: L B = 1 ε r − 1 k B λ 0 where ε r represents a relative permittivity of the dielectric, k A, k B represent constants in a range of 0.15 to 0.70, and λ 0 represents a free space wavelength of the signal; wherein the first dimension L A and the second dimension L B in the first direction are different from each other so that a plurality of frequencies can be suppressed or reduced in the first direction in accordance with the first dimension of the first copper film pattern and the second dimension of the second copper film pattern; wherein, in the first direction, a distance between the first copper film pattern and the second copper film pattern is smaller than or equal to λ 0. a dielectric; and a first copper film pattern and a second copper film pattern arranged on a first surface of the dielectric, wherein the first copper film pattern has a first dimension L A in a first direction along the dielectric substrate, and the first dimension L A is given by: L A = 1 ε r − 1 k A λ 0 and wherein the second copper film pattern has a second dimension L B in the first direction along the dielectric substrate, and the second dimension L B is given by: L B = 1 ε r − 1 k B λ 0 where ε r represents a relative permittivity of the dielectric, k A, k B represent constants in a range of 0.15 to 0.70, and λ 0 represents a free space wavelength of the signal; wherein the first dimension L A and the second dimension L B in the first direction are different from each other so that a plurality of frequencies can be suppressed or reduced in the first direction in accordance with the first dimension of the first copper film pattern and the second dimension of the second copper film pattern; wherein, in the first direction, a distance between the first copper film pattern and the second copper film pattern is smaller than or equal to λ 0.