A circuit board (10; 10a - 10d) comprising: a laminated body composed of a laminate of a plurality of insulating-material layers (16a - 16h) made of a flexible thermoplastic resin material; a first external electrode (12a - 12d) which is provided on a top surface of the laminated body and on which an electronic component is to be mounted; and a plurality of internal conductors (20a - 20f; 28a - 28c; 30a - 30f) fabricated using metal foil, which, when viewed in plan in a lamination direction, are overlaid on the first external electrode (12a - 12d) and are not connected to one another through via hole conductors in regions where the internal conductors (20a - 20f; 28a - 28c; 30a - 30f) are overlaid on the first external electrode (12a - 12d), wherein insulating-material layers (16a - 16h) and the plurality of internal conductors (20a - 20f; 28a - 28c; 30a - 30f.) are press-bonded together so that no chemical bonding is formed between the insulating-material layers (16a - 16h) and one main surface of the internal conductors (20a - 20f; 28a - 28c; 30a - 30f) so that the insulating-material layers (16a - 16h) and the internal conductors (20a - 20f; 28a - 28c; 30a - 30f) can be displaced from each other, and other main surfaces of the internal conductors (20a - 20f; 28a - 28c; 30a - 30f) opposite to the one main surfaces are bonded to the insulating-material layers (16a - 16h) by anchor effect; a second external electrode (14a - 14f) provided on a bottom surface or a side surface of the laminated body; and a via hole conductor (b6 -b11) which is connected to the second external electrode (14a - 14f) and is not overlaid on the first external electrode (12a - 12d) when viewed in plan in the lamination direction, wherein the second external electrode (14a -14f) is not overlaid on the first external electrode (12a - 12d) when viewed in plan in the lamination direction, and wherein the circuit board (10; 10a - 10d) comprises a plurality of first external electrodes (12a - 12d) and a plurality of second external electrodes (14a - 14f), wherein each of the second plurality of second external electrodes is not overlaid with on any of the plurality of first external electrodes (12a - 12d) when viewed in plan in the lamination direction. a laminated body composed of a laminate of a plurality of insulating-material layers (16a - 16h) made of a flexible thermoplastic resin material; a first external electrode (12a - 12d) which is provided on a top surface of the laminated body and on which an electronic component is to be mounted; and a plurality of internal conductors (20a - 20f; 28a - 28c; 30a - 30f) fabricated using metal foil, which, when viewed in plan in a lamination direction, are overlaid on the first external electrode (12a - 12d) and are not connected to one another through via hole conductors in regions where the internal conductors (20a - 20f; 28a - 28c; 30a - 30f) are overlaid on the first external electrode (12a - 12d), wherein insulating-material layers (16a - 16h) and the plurality of internal conductors (20a - 20f; 28a - 28c; 30a - 30f.) are press-bonded together so that no chemical bonding is formed between the insulating-material layers (16a - 16h) and one main surface of the internal conductors (20a - 20f; 28a - 28c; 30a - 30f) so that the insulating-material layers (16a - 16h) and the internal conductors (20a - 20f; 28a - 28c; 30a - 30f) can be displaced from each other, and other main surfaces of the internal conductors (20a - 20f; 28a - 28c; 30a - 30f) opposite to the one main surfaces are bonded to the insulating-material layers (16a - 16h) by anchor effect; a second external electrode (14a - 14f) provided on a bottom surface or a side surface of the laminated body; and a via hole conductor (b6 -b11) which is connected to the second external electrode (14a - 14f) and is not overlaid on the first external electrode (12a - 12d) when viewed in plan in the lamination direction, wherein the second external electrode (14a -14f) is not overlaid on the first external electrode (12a - 12d) when viewed in plan in the lamination direction, and wherein the circuit board (10; 10a - 10d) comprises a plurality of first external electrodes (12a - 12d) and a plurality of second external electrodes (14a - 14f), wherein each of the second plurality of second external electrodes is not overlaid with on any of the plurality of first external electrodes (12a - 12d) when viewed in plan in the lamination direction.