Headliner with electronic module assembly for vehicles comprising: • a headliner comprising a first side (1.1) configured for facing a vehicle interior in use, and a second side (1.2) configured for facing a vehicle roof in use, wherein the headliner comprises a main surface (1.3), • an electronic module assembly having: o a frame (2.1) connected to the second side (1.2) of the headliner by first attaching means, o an electronic module (2.2) comprising: ▪ a printed circuit board (2.2.1) connected to the frame (2.1) by second attaching means wherein the printed circuit board (2.2.1) is arranged parallel to the main surface (1.3) of the headliner and wherein the printed circuit board (2.2.1) comprises a first side (2.2.1.1) facing the headliner and a second side (2.2.1.2) opposite to the first side (2.2.1.1), ▪ an electric wiring (2.2.2) and an electric connector (2.2.3) configured to connect the printed circuit board (2.2.1) to a main vehicle electronics, wherein the electronic module (2.2) has a junction temperature T J, o a heat absorbing part (2.4) which comprises a casing (2.4.1) comprising a heat conductive material having a thermal conductivity higher than 0.1 W/m.K, and a phase change material (2.4.2) having a melting point in the range between 70% of the junction temperature T J and 105% of the junction temperature T J, wherein the heat absorbing part (2.4) is in contact with the printed circuit board (2.2.1), and wherein the casing (2.4.1) encloses the phase change material (2.4.2), o a mechanical protection cap (2.3) arranged as the outer component of the electronic module assembly, wherein said mechanical protection cap (2.3) covers the components forming the electronic module assembly being between said mechanical protection cap (2.3) and the headliner. • a headliner comprising a first side (1.1) configured for facing a vehicle interior in use, and a second side (1.2) configured for facing a vehicle roof in use, wherein the headliner comprises a main surface (1.3), • an electronic module assembly having: o a frame (2.1) connected to the second side (1.2) of the headliner by first attaching means, o an electronic module (2.2) comprising: ▪ a printed circuit board (2.2.1) connected to the frame (2.1) by second attaching means wherein the printed circuit board (2.2.1) is arranged parallel to the main surface (1.3) of the headliner and wherein the printed circuit board (2.2.1) comprises a first side (2.2.1.1) facing the headliner and a second side (2.2.1.2) opposite to the first side (2.2.1.1), ▪ an electric wiring (2.2.2) and an electric connector (2.2.3) configured to connect the printed circuit board (2.2.1) to a main vehicle electronics, wherein the electronic module (2.2) has a junction temperature T J, o a heat absorbing part (2.4) which comprises a casing (2.4.1) comprising a heat conductive material having a thermal conductivity higher than 0.1 W/m.K, and a phase change material (2.4.2) having a melting point in the range between 70% of the junction temperature T J and 105% of the junction temperature T J, wherein the heat absorbing part (2.4) is in contact with the printed circuit board (2.2.1), and wherein the casing (2.4.1) encloses the phase change material (2.4.2), o a mechanical protection cap (2.3) arranged as the outer component of the electronic module assembly, wherein said mechanical protection cap (2.3) covers the components forming the electronic module assembly being between said mechanical protection cap (2.3) and the headliner. o a frame (2.1) connected to the second side (1.2) of the headliner by first attaching means, o an electronic module (2.2) comprising: ▪ a printed circuit board (2.2.1) connected to the frame (2.1) by second attaching means wherein the printed circuit board (2.2.1) is arranged parallel to the main surface (1.3) of the headliner and wherein the printed circuit board (2.2.1) comprises a first side (2.2.1.1) facing the headliner and a second side (2.2.1.2) opposite to the first side (2.2.1.1), ▪ an electric wiring (2.2.2) and an electric connector (2.2.3) configured to connect the printed circuit board (2.2.1) to a main vehicle electronics, wherein the electronic module (2.2) has a junction temperature T J, ▪ a printed circuit board (2.2.1) connected to the frame (2.1) by second attaching means wherein the printed circuit board (2.2.1) is arranged parallel to the main surface (1.3) of the headliner and wherein the printed circuit board (2.2.1) comprises a first side (2.2.1.1) facing the headliner and a second side (2.2.1.2) opposite to the first side (2.2.1.1), ▪ an electric wiring (2.2.2) and an electric connector (2.2.3) configured to connect the printed circuit board (2.2.1) to a main vehicle electronics, o a heat absorbing part (2.4) which comprises a casing (2.4.1) comprising a heat conductive material having a thermal conductivity higher than 0.1 W/m.K, and a phase change material (2.4.2) having a melting point in the range between 70% of the junction temperature T J and 105% of the junction temperature T J, wherein the heat absorbing part (2.4) is in contact with the printed circuit board (2.2.1), and wherein the casing (2.4.1) encloses the phase change material (2.4.2), o a mechanical protection cap (2.3) arranged as the outer component of the electronic module assembly, wherein said mechanical protection cap (2.3) covers the components forming the electronic module assembly being between said mechanical protection cap (2.3) and the headliner.