A packaging substrate comprising: a core layer, and an upper layer disposed on the core layer, wherein the core layer comprises a glass substrate and a core via, the glass substrate has a first surface and a second surface facing each other, the glass substrate comprises a first area with a first thickness, and a second area close to the first area and with a second thickness thinner than the first thickness, the core via penetrating through the glass substrate in a thickness direction is disposed in a plural number, the core layer comprises a core distribution layer disposed on a surface of the glass substrate or the core via, at least a part of the core distribution layer electrically connects an electrically conductive layer of the first surface and an electrically conductive layer of the second surface, through the core via, and the upper layer is disposed on the first surface and comprises an electrically conductive layer configured to electrically connect the core distribution layer and an external semiconductor element unit; wherein a cavity unit is disposed above or under the second area; the cavity unit comprises an inner space, and a cavity distribution layer electrically connected to the core distribution layer, and a cavity element are disposed in the inner space; wherein the core via comprises a second area core via in contact with an electrode of the cavity element, wherein the second area core via penetrates through the second area, wherein the core via comprises a first opening part in contact with the first surface, a second opening part in contact with the second surface, and a minimum inner diameter part which is an area with the narrowest inner diameter in the entire core via connecting the first opening part and the second opening part, wherein: a first opening part diameter, which is a diameter of the first opening part, and a second opening part diameter, which is a diameter of the second opening part, differ from each other, and the minimum inner diameter part is disposed at the first opening part or the second opening part, or the first opening part diameter and the second opening part diameter are substantially equal, and the minimum inner diameter part is disposed between the first opening part and the second opening part, wherein the core via is disposed at the glass substrate in a pitch of 0.12 to 1.2 mm. a core layer, and an upper layer disposed on the core layer, wherein the core layer comprises a glass substrate and a core via, the glass substrate has a first surface and a second surface facing each other, the glass substrate comprises a first area with a first thickness, and a second area close to the first area and with a second thickness thinner than the first thickness, the core via penetrating through the glass substrate in a thickness direction is disposed in a plural number, the core layer comprises a core distribution layer disposed on a surface of the glass substrate or the core via, at least a part of the core distribution layer electrically connects an electrically conductive layer of the first surface and an electrically conductive layer of the second surface, through the core via, and the upper layer is disposed on the first surface and comprises an electrically conductive layer configured to electrically connect the core distribution layer and an external semiconductor element unit; wherein a cavity unit is disposed above or under the second area; the cavity unit comprises an inner space, and a cavity distribution layer electrically connected to the core distribution layer, and a cavity element are disposed in the inner space; wherein the core via comprises a second area core via in contact with an electrode of the cavity element, wherein the second area core via penetrates through the second area, wherein the core via comprises a first opening part in contact with the first surface, a second opening part in contact with the second surface, and a minimum inner diameter part which is an area with the narrowest inner diameter in the entire core via connecting the first opening part and the second opening part, wherein: a first opening part diameter, which is a diameter of the first opening part, and a second opening part diameter, which is a diameter of the second opening part, differ from each other, and the minimum inner diameter part is disposed at the first opening part or the second opening part, or the first opening part diameter and the second opening part diameter are substantially equal, and the minimum inner diameter part is disposed between the first opening part and the second opening part, wherein the core via is disposed at the glass substrate in a pitch of 0.12 to 1.2 mm. a first opening part diameter, which is a diameter of the first opening part, and a second opening part diameter, which is a diameter of the second opening part, differ from each other, and the minimum inner diameter part is disposed at the first opening part or the second opening part, or the first opening part diameter and the second opening part diameter are substantially equal, and the minimum inner diameter part is disposed between the first opening part and the second opening part, wherein the core via is disposed at the glass substrate in a pitch of 0.12 to 1.2 mm.