Radiofrequency signal transmission and/or receiving device comprising at least: • a microelectronic circuit extending over a main extension plane defined by a main extension direction and another direction; • a first antenna borne by a first zone of said microelectronic circuit and extending along a first extension plane; • a second antenna borne by a second zone of said microelectronic circuit extending along a second extension plane; the device further comprising an electromagnetic decoupling module between the first antenna and the second antenna, borne by a third zone of said microelectronic circuit disposed between the first zone and the second zone; the electromagnetic decoupling module comprising at least one raised structure relative to said microelectronic circuit and at least one connection element of said raised structure to said microelectronic circuit, the device being characterised in that: - it comprises an overmoulding of the microelectronic circuit configured in such a way as to cover at least partially the at least connection element and the microelectronic circuit so as to define a surface, preferably planar, extending substantially along a third extension plane; - the connection element comprises a plurality of electric conductive vias electrically connected to said raised structure and to said microelectronic circuit and extending from said microelectronic circuit to the raised structure; - the raised structure is a deposition of at least one metallic conductive element of the electromagnetic decoupling module located on said surface. • a microelectronic circuit extending over a main extension plane defined by a main extension direction and another direction; • a first antenna borne by a first zone of said microelectronic circuit and extending along a first extension plane; • a second antenna borne by a second zone of said microelectronic circuit extending along a second extension plane; the device further comprising an electromagnetic decoupling module between the first antenna and the second antenna, borne by a third zone of said microelectronic circuit disposed between the first zone and the second zone; the electromagnetic decoupling module comprising at least one raised structure relative to said microelectronic circuit and at least one connection element of said raised structure to said microelectronic circuit, the device being characterised in that: - it comprises an overmoulding of the microelectronic circuit configured in such a way as to cover at least partially the at least connection element and the microelectronic circuit so as to define a surface, preferably planar, extending substantially along a third extension plane; - the connection element comprises a plurality of electric conductive vias electrically connected to said raised structure and to said microelectronic circuit and extending from said microelectronic circuit to the raised structure; - the raised structure is a deposition of at least one metallic conductive element of the electromagnetic decoupling module located on said surface. the device further comprising an electromagnetic decoupling module between the first antenna and the second antenna, borne by a third zone of said microelectronic circuit disposed between the first zone and the second zone; the electromagnetic decoupling module comprising at least one raised structure relative to said microelectronic circuit and at least one connection element of said raised structure to said microelectronic circuit, the device being characterised in that: - it comprises an overmoulding of the microelectronic circuit configured in such a way as to cover at least partially the at least connection element and the microelectronic circuit so as to define a surface, preferably planar, extending substantially along a third extension plane; - the connection element comprises a plurality of electric conductive vias electrically connected to said raised structure and to said microelectronic circuit and extending from said microelectronic circuit to the raised structure; - the raised structure is a deposition of at least one metallic conductive element of the electromagnetic decoupling module located on said surface. - it comprises an overmoulding of the microelectronic circuit configured in such a way as to cover at least partially the at least connection element and the microelectronic circuit so as to define a surface, preferably planar, extending substantially along a third extension plane; - the connection element comprises a plurality of electric conductive vias electrically connected to said raised structure and to said microelectronic circuit and extending from said microelectronic circuit to the raised structure; - the raised structure is a deposition of at least one metallic conductive element of the electromagnetic decoupling module located on said surface.