mhurhangee/ep-ind-claims huggingface dataset:
A tetrazolinone compound represented by the formula: wherein R 1 is a C1-C3 alkyl group which may have a halogen atom(s) or a halogen atom; R 3 is a hydrogen atom or a methyl group; and R 6 is a C1-C3 alkyl group which may have a halogen atom(s), a C1-C3 alkoxy group which may have a halogen atom(s), a cyclopropyl group, or a halogen atom, R 2, R 4, R 5, R 7, R 8, R 9, and R 11 are each a hydrogen atom; R 10 is a methyl group; X is an oxygen atom; R 12 represents a C1-C6 alkyl group which may have a halogen atom(s), a C3-C6 cycloalkyl group which may have a halogen atom(s), a phenyl group which may have a group selected from the group P 2, or a hydrogen atom, and R 13 represents a C1-C8 alkyl group, a C1-C8 haloalkyl group, a C2-C6 alkenyl group, a C2-C6 haloalkenyl group, a C2-C6 alkynyl group, a C2-C6 haloalkynyl group, a C3-C6 cycloalkyl group, a C3-C6 halocycloalkyl group, a C3-C6 cycloalkenyl group, or a C3-C6 halocycloalkenyl group, or a benzyl group which may have a group selected from the group P 2; Group P 2: Group consisting of a halogen atom, cyano group, amino group, hydroxy group, thiol group, C1-C6 alkyl group, C1-C6 haloalkyl group, C3-C6 cycloalkyl group, C3-C6 halocycloalkyl group, C2-C6 alkenyl group, C2-C6 haloalkenyl group, C2-C6 alkynyl group, C1-C6 alkoxy group, C1-C6 haloalkoxy group, C1-C8 alkylamino group, C1-C6 alkylthio group, C1-C6 haloalkylthio group, C1-C6 alkylsulfinyl group, C1-C6 alkylsulfonyl group, pentafluorosulfanyl group, C3-C12 trialkylsilyl group, C2-C6 alkylcarbonyl group, C2-C6 alkoxycarbonyl group, and C2-C9 alkylaminocarbonyl group. R 1 is a C1-C3 alkyl group which may have a halogen atom(s) or a halogen atom; R 3 is a hydrogen atom or a methyl group; and R 6 is a C1-C3 alkyl group which may have a halogen atom(s), a C1-C3 alkoxy group which may have a halogen atom(s), a cyclopropyl group, or a halogen atom, R 2, R 4, R 5, R 7, R 8, R 9, and R 11 are each a hydrogen atom; R 10 is a methyl group; X is an oxygen atom; R 12 represents a C1-C6 alkyl group which may have a halogen atom(s), a C3-C6 cycloalkyl group which may have a halogen atom(s), a phenyl group which may have a group selected from the group P 2, or a hydrogen atom, and R 13 represents a C1-C8 alkyl group, a C1-C8 haloalkyl group, a C2-C6 alkenyl group, a C2-C6 haloalkenyl group, a C2-C6 alkynyl group, a C2-C6 haloalkynyl group, a C3-C6 cycloalkyl group, a C3-C6 halocycloalkyl group, a C3-C6 cycloalkenyl group, or a C3-C6 halocycloalkenyl group, or a benzyl group which may have a group selected from the group P 2; Group P 2: Group consisting of a halogen atom, cyano group, amino group, hydroxy group, thiol group, C1-C6 alkyl group, C1-C6 haloalkyl group, C3-C6 cycloalkyl group, C3-C6 halocycloalkyl group, C2-C6 alkenyl group, C2-C6 haloalkenyl group, C2-C6 alkynyl group, C1-C6 alkoxy group, C1-C6 haloalkoxy group, C1-C8 alkylamino group, C1-C6 alkylthio group, C1-C6 haloalkylthio group, C1-C6 alkylsulfinyl group, C1-C6 alkylsulfonyl group, pentafluorosulfanyl group, C3-C12 trialkylsilyl group, C2-C6 alkylcarbonyl group, C2-C6 alkoxycarbonyl group, and C2-C9 alkylaminocarbonyl group.
A dual-output electrosurgical generator, comprising: a power supply configured to output a DC waveform; an inverter coupled to the power supply, the inverter including at least one switching element operated at a switching angle; characterised by a controller coupled to the inverter and configured to modulate the switching angle to generate a first waveform at a first frequency and a secondary waveform at a second frequency. a power supply configured to output a DC waveform; an inverter coupled to the power supply, the inverter including at least one switching element operated at a switching angle; characterised by a controller coupled to the inverter and configured to modulate the switching angle to generate a first waveform at a first frequency and a secondary waveform at a second frequency.
Sanitary installation part which has an installation housing or similar installation cage which can be inserted into a housing or cage receptacle of a gas or liquid line and comprises at least one latching means which is formed as a latching cam, protrudes in a latching position on the outer circumference of the installation housing or installation cage and can be moved from this latching position into a zero position in a resiliently-elastic manner, wherein the installation part further comprises at least one spring web and one latching means receptacle which is designed as a slot open on the end edge face, said slot separating the installation housing or the installation cage from at least the spring web which is formed as part of the installation housing or installation cage and supports the at least one latching cam in each case, and wherein the at least one spring web supporting the at least one latching cam in each case is introduced in the zero position into the outer contour of the installation housing or installation cage such that the latching cam is resiliently deflected into this latching means receptacle, characterised in that the transverse edges of the latching cam, oriented transversely with respect to the insertion direction on both sides, are rounded or bevelled.
A photovoltaic module including: - a transparent first layer forming the front face of the photovoltaic module, for receiving a luminous flux, - a plurality of photovoltaic cells disposed side by side and electrically connected to each other, - an assembly encapsulating the plurality of photovoltaic cells, - a second layer forming the rear face of the photovoltaic module, the encapsulating assembly and the plurality of photovoltaic cells being located between the first and second layers, wherein the second layer includes an electrically conductive layer provided with an electrically conductive material, to form an electrically conductive rear face of the photovoltaic module, and electrically insulated from the photovoltaic cells, and wherein at least one electrically conductive connection element extends from the first layer to the electrically conductive layer, in the thickness (e) of the photovoltaic module included between the first layer and the electrically conductive layer, to allow evacuation of electrostatic charges built up at the first layer towards the conductive layer, said at least one conductive connection element being disposed in a zone devoid of electric connectivity connecting the photovoltaic cells to each other. - a transparent first layer forming the front face of the photovoltaic module, for receiving a luminous flux, - a plurality of photovoltaic cells disposed side by side and electrically connected to each other, - an assembly encapsulating the plurality of photovoltaic cells, - a second layer forming the rear face of the photovoltaic module, the encapsulating assembly and the plurality of photovoltaic cells being located between the first and second layers, wherein the second layer includes an electrically conductive layer provided with an electrically conductive material, to form an electrically conductive rear face of the photovoltaic module, and electrically insulated from the photovoltaic cells, and wherein at least one electrically conductive connection element extends from the first layer to the electrically conductive layer, in the thickness (e) of the photovoltaic module included between the first layer and the electrically conductive layer, to allow evacuation of electrostatic charges built up at the first layer towards the conductive layer, said at least one conductive connection element being disposed in a zone devoid of electric connectivity connecting the photovoltaic cells to each other.
A molding method for molding a composite material by disposing a reinforcing base material within a cavity of an openable/closable molding die, injecting resin into the cavity, and curing the resin, comprising: causing a support member to penetrate the reinforcing base material and disposing the support member such that at least one end portion projects from the reinforcing base material; disposing the reinforcing base material and the support member within the cavity; closing the molding die and bringing the at least one end portion of the support member in contact with the wall surfaces of the molding die that form the cavity; and injecting the resin into the cavity from an injection port of the molding die while maintaining the state in which the at least one end portion of the support member is in contact with the wall surface; characterized in that a gap is formed in at least a portion of the space between the reinforcing base material and the wall surfaces of the molding die by the at least one end portion of the support member during the injecting of the resin; wherein the support member is provided with a property of softening with heat, and the molding die is closed further and at least a portion of the support member is crushed in a direction in which the molding die is closed after the injecting of the resin. causing a support member to penetrate the reinforcing base material and disposing the support member such that at least one end portion projects from the reinforcing base material; disposing the reinforcing base material and the support member within the cavity; closing the molding die and bringing the at least one end portion of the support member in contact with the wall surfaces of the molding die that form the cavity; and injecting the resin into the cavity from an injection port of the molding die while maintaining the state in which the at least one end portion of the support member is in contact with the wall surface; characterized in that a gap is formed in at least a portion of the space between the reinforcing base material and the wall surfaces of the molding die by the at least one end portion of the support member during the injecting of the resin; wherein the support member is provided with a property of softening with heat, and the molding die is closed further and at least a portion of the support member is crushed in a direction in which the molding die is closed after the injecting of the resin.
Washer assembly for a screw fastener, with at least one washer (1, 1.1) comprising an opening for the engagement of the male part of a screw fastener, wherein arranged in the opening of the at least one washer (1, 1.1) is a coupling sleeve (3, 3.1, 3.2) with a U-shaped profiling open outwards in the radial direction, formed by two flanges (7, 7.1, 7.2, 7.3) arranged at a distance interval from one another and projecting outwards in the radial direction, by which flanges (7, 7.1, 7.2, 7.3) the coupling sleeve is held in positive fit in the direction of the longitudinal axis of the opening in the at least one washer (1, 1.1), characterised in that the height of the coupling sleeve (3.1, 3.2) is greater than the thickness of the at least one washer (1, 1.1), and the sections of the coupling sleeve (3.1) projecting over the thickness of the at least one washer (1, 1.1) can be deformed such as to provide a seal when the screw fastener is tightened, which coupling sleeve (3, 3.1, 3.2) carries several elastically deformable clamping catches projecting inwards in the radial direction and being elastically adjustable in the direction of the longitudinal extension of the coupling sleeve, these being capable of engaging with their free ends into a clamping groove of a screw fastener which is open in the radial direction to the coupling sleeve (3, 3.1, 3.2).
A thermosetting adhesive composition comprising: a) a prereact composition formed through the reaction of: i) an epoxy resin containing nano-sized core-shell particles having average particle size within the range of 10 nm to 100 nm; and ii) at least one toughening agent chosen from an amine-terminated polyether sulfone, and amine terminated polysulfone; b) at least one multifunctional epoxy resin; and c) at least one amine curing agent to allow full cure of said adhesive composition at temperatures up to 204 °C, wherein each core-shell particle has a core comprised of a polymeric material having elastomeric properties and a shell comprised of a non-elastomeric polymeric material, and wherein upon curing, said adhesive composition is characterized by high glass transition temperature, increased fracture toughness, and increased shear properties at temperatures up to 177 °C. a) a prereact composition formed through the reaction of: i) an epoxy resin containing nano-sized core-shell particles having average particle size within the range of 10 nm to 100 nm; and ii) at least one toughening agent chosen from an amine-terminated polyether sulfone, and amine terminated polysulfone; i) an epoxy resin containing nano-sized core-shell particles having average particle size within the range of 10 nm to 100 nm; and ii) at least one toughening agent chosen from an amine-terminated polyether sulfone, and amine terminated polysulfone; b) at least one multifunctional epoxy resin; and c) at least one amine curing agent to allow full cure of said adhesive composition at temperatures up to 204 °C,
System for displaying ceramic tiles comprising a panel comprising - a base panel having a thin metal sheet applied on one of its sides or both sides by means of an adhesive layer that collates the thin metal sheet where said metal sheet is provided on the side opposite to the one facing the base panel with an adherent paint coating; wherein the adherent paint coating having a sequence of layers comprising polyethylene as a protective layer, acrylic as a top coat, polyester as a primer, chromium as a chemical layer, and a back coating on the thin metal sheet. and an updating kit which contains at least one self adhesive magnetic sheet for each ceramic tiles to be displayed. - a base panel having a thin metal sheet applied on one of its sides or both sides by means of an adhesive layer that collates the thin metal sheet where said metal sheet is provided on the side opposite to the one facing the base panel with an adherent paint coating; acrylic as a top coat, polyester as a primer, chromium as a chemical layer, and a back coating on the thin metal sheet.
An orthodontic appliance comprising: a base having a bonding surface, a body extending outwardly from the base, the body including a mesial-distally extending archwire slot having a bottom wall and a channel in the body oriented generally perpendicular to the slot and having a bottom wall, a deflectable beam extending in a mesial-distal direction across the channel, and a door slidably coupled to the body, the door moveable between an open state in which an archwire can be ligated in the archwire slot and a closed state in which an archwire can be retained in the archwire slot, wherein a lingual surface of the door includes a leading edge region extending substantially the full mesial-distal length of the archwire slot, having a contact surface substantially parallel to the bottom wall of the archwire slot in the closed state and a strut slidably received in the channel and extending towards the bottom wall of the channel from a mesial-distal center of the lingual surface of the door, the strut including a protrusion that extends outwardly from a lingual portion of the strut in a generally lingual direction, whereby the protrusion deflects the beam toward the bottom wall of the channel as the door is urged in a gingival direction to transition from the open state to the closed state. a base having a bonding surface, a body extending outwardly from the base, the body including a mesial-distally extending archwire slot having a bottom wall and a channel in the body oriented generally perpendicular to the slot and having a bottom wall, a deflectable beam extending in a mesial-distal direction across the channel, and a door slidably coupled to the body, the door moveable between an open state in which an archwire can be ligated in the archwire slot and a closed state in which an archwire can be retained in the archwire slot, wherein a lingual surface of the door includes a leading edge region extending substantially the full mesial-distal length of the archwire slot, having a contact surface substantially parallel to the bottom wall of the archwire slot in the closed state and a strut slidably received in the channel and extending towards the bottom wall of the channel from a mesial-distal center of the lingual surface of the door, the strut including a protrusion that extends outwardly from a lingual portion of the strut in a generally lingual direction, whereby the protrusion deflects the beam toward the bottom wall of the channel as the door is urged in a gingival direction to transition from the open state to the closed state.
A gate with a door element incorporated into a gate leaf, wherein the gate leaf and the door element are configured by individual gate elements, which are articulately connected among each other and are location-modifiably guided in lateral rails, wherein, via an intermediate element, the lower gate element at the floor side is connected to a lower terminal element, which extends across the entire gate leaf width, characterized in that the terminal element, at least exceeding the width of the door element, is additionally provided with an insert element, which is entirely or partially enclosed by the terminal element, wherein the insert element is configured as a hollow profile or as a U-profile, and in that the width of the terminal element is larger than the thickness of the gate element and may protrude on one side or on both sides of the gate element, wherein the protrusion with regard to the intermediate element is covered by lateral legs (19, 22).
An article of footwear including an upper, wherein said upper includes a first layer and a second layer of a material, said material comprising a substrate (200a, 200b) and a plurality of compressible projections (300a, 300b) attached to said substrate, at least a portion of said compressible projections having a location adjacent a foot cavity of said upper, said location being selected such that a compressive force directed toward said material from said foot cavity is applied to at least one of said compressible projections, said at least one of said projections compressing upon application of said compressive force and substantially returning to an uncompressed configuration following a removal of said compressive force, wherein said first layer and said second layer are arranged such that: (a) said projections of said first layer contact said projections of said second layer; (b) said substrate of said first layer contacts said substrate of said second layer; or (c) the projections are in an offset configuration, wherein said compressible projections of the first layer are connected to said substrate of said second layer and said compressible projections of the second layer are connected to said substrate of said first layer. (a) said projections of said first layer contact said projections of said second layer; (b) said substrate of said first layer contacts said substrate of said second layer; or (c) the projections are in an offset configuration, wherein said compressible projections of the first layer are connected to said substrate of said second layer and said compressible projections of the second layer are connected to said substrate of said first layer.
A method for implementing error correction control, ECC, in a memory device, the method comprising: receiving a request at a component of a system on a chip, SoC, to write a data line to a memory device in electrical communication with the SoC; determining if the received data line is compressible; determining if there is a hit or a miss for a cache line of an ECC cache of the SoC associated with the received data line; and responsive to a determination that the received data line is compressible: compressing the received data line, generating ECC bits based on the compressed data line, appending the ECC bits to the compressed data line, storing the appended compressed data line in a data portion of the memory device, and responsive to a hit for the ECC cache, deleting the cache line of the ECC cache associated with the received data line, or responsive to a miss for the ECC cache, determining whether to delete a line of an ECC portion of the memory device, or, responsive to a determination that the received data line is not compressible: generating ECC bits based on the uncompressed data line, storing the uncompressed data line in the data portion of the memory device, and writing the generated ECC bits to the ECC cache. receiving a request at a component of a system on a chip, SoC, to write a data line to a memory device in electrical communication with the SoC; determining if the received data line is compressible; determining if there is a hit or a miss for a cache line of an ECC cache of the SoC associated with the received data line; and responsive to a determination that the received data line is compressible: compressing the received data line, generating ECC bits based on the compressed data line, appending the ECC bits to the compressed data line, storing the appended compressed data line in a data portion of the memory device, and responsive to a hit for the ECC cache, deleting the cache line of the ECC cache associated with the received data line, or responsive to a miss for the ECC cache, determining whether to delete a line of an ECC portion of the memory device, responsive to a hit for the ECC cache, deleting the cache line of the ECC cache associated with the received data line, or responsive to a miss for the ECC cache, determining whether to delete a line of an ECC portion of the memory device,