A system for manufacturing a composite board, the system comprising: a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board, wherein the pre-bonding apparatus comprises: a coverlay seating unit on which the coverlay supplied from the coverlay supply apparatus is seated; a pickup transfer unit positioned to correspond to the position of the coverlay seating unit and configured to pick up the coverlay seated on the coverlay seating unit and transfer the same onto the printed circuit board supplied from the printed circuit board supply apparatus; an aligning table unit configured to align the coverlay transferred by the pickup transfer unit onto the printed circuit board supplied from the printed circuit board supply apparatus; and a pre-bonding unit configured to pre-bond the coverlay and the printed circuit board aligned in the aligning table unit, and wherein the pre-bonding unit comprises a pre-bonding housing part, an upper support part disposed inside the pre-bonding housing part and configured to move up and down, an upper pre-bonding part mounted under the upper support part and configured to heat and press the entire surface of the coverlay and the printed circuit board aligned in the aligning table unit, a lower support part disposed inside the pre-bonding housing part to face the upper support part, a lower pre-bonding part mounted above the lower support part and configured to heat and press the entire surface of the coverlay and the printed circuit board aligned in the aligning table unit, and a driving part configured to move the upper support member up and down. a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board, wherein the pre-bonding apparatus comprises: a coverlay seating unit on which the coverlay supplied from the coverlay supply apparatus is seated; a pickup transfer unit positioned to correspond to the position of the coverlay seating unit and configured to pick up the coverlay seated on the coverlay seating unit and transfer the same onto the printed circuit board supplied from the printed circuit board supply apparatus; an aligning table unit configured to align the coverlay transferred by the pickup transfer unit onto the printed circuit board supplied from the printed circuit board supply apparatus; and a pre-bonding unit configured to pre-bond the coverlay and the printed circuit board aligned in the aligning table unit, and wherein the pre-bonding unit comprises a pre-bonding housing part, an upper support part disposed inside the pre-bonding housing part and configured to move up and down, an upper pre-bonding part mounted under the upper support part and configured to heat and press the entire surface of the coverlay and the printed circuit board aligned in the aligning table unit, a lower support part disposed inside the pre-bonding housing part to face the upper support part, a lower pre-bonding part mounted above the lower support part and configured to heat and press the entire surface of the coverlay and the printed circuit board aligned in the aligning table unit, and a driving part configured to move the upper support member up and down. a coverlay seating unit on which the coverlay supplied from the coverlay supply apparatus is seated; a pickup transfer unit positioned to correspond to the position of the coverlay seating unit and configured to pick up the coverlay seated on the coverlay seating unit and transfer the same onto the printed circuit board supplied from the printed circuit board supply apparatus; an aligning table unit configured to align the coverlay transferred by the pickup transfer unit onto the printed circuit board supplied from the printed circuit board supply apparatus; and a pre-bonding unit configured to pre-bond the coverlay and the printed circuit board aligned in the aligning table unit, and wherein the pre-bonding unit comprises a pre-bonding housing part, an upper support part disposed inside the pre-bonding housing part and configured to move up and down, an upper pre-bonding part mounted under the upper support part and configured to heat and press the entire surface of the coverlay and the printed circuit board aligned in the aligning table unit, a lower support part disposed inside the pre-bonding housing part to face the upper support part, a lower pre-bonding part mounted above the lower support part and configured to heat and press the entire surface of the coverlay and the printed circuit board aligned in the aligning table unit, and a driving part configured to move the upper support member up and down.