An electrochromic device, comprising: a single substrate; and a plurality of layers, deposited on the single substrate, which comprises: an EC thin film stack (1910, 1920); two conductive layers (1908, 1940) above and below the EC stack; and two encapsulation layers (1970, 1906) above and below the EC stack and the two conductive layers that resist moisture permeation; wherein the EC device is structured such that the two encapsulation layers (1970, 1906) and the two conductive layers (1908, 1940) collectively restrict moisture permeation between the EC stack and an ambient environment, wherein at least one conductive layer of the two conductive layers and at least one encapsulation layer of the two encapsulation layers are deposited so as to cover edge portions of the EC thin film stack to restrict moisture permeation between the EC thin film stack and the ambient environment, the at least one conductive layer comprising a moisture-resistant portion disposed at an end portion of the at least one conductive layer that is exposed to the ambient environment, and wherein an area, orthogonally projected onto the single substrate, of the EC thin film stack is reduced, relative to respective areas, orthogonally projected onto the single substrate, of the two conductive layers and the two encapsulation layers. a single substrate; and a plurality of layers, deposited on the single substrate, which comprises: an EC thin film stack (1910, 1920); two conductive layers (1908, 1940) above and below the EC stack; and two encapsulation layers (1970, 1906) above and below the EC stack and the two conductive layers that resist moisture permeation; wherein the EC device is structured such that the two encapsulation layers (1970, 1906) and the two conductive layers (1908, 1940) collectively restrict moisture permeation between the EC stack and an ambient environment, wherein at least one conductive layer of the two conductive layers and at least one encapsulation layer of the two encapsulation layers are deposited so as to cover edge portions of the EC thin film stack to restrict moisture permeation between the EC thin film stack and the ambient environment, the at least one conductive layer comprising a moisture-resistant portion disposed at an end portion of the at least one conductive layer that is exposed to the ambient environment, and wherein an area, orthogonally projected onto the single substrate, of the EC thin film stack is reduced, relative to respective areas, orthogonally projected onto the single substrate, of the two conductive layers and the two encapsulation layers. an EC thin film stack (1910, 1920); two conductive layers (1908, 1940) above and below the EC stack; and two encapsulation layers (1970, 1906) above and below the EC stack and the two conductive layers that resist moisture permeation; wherein the EC device is structured such that the two encapsulation layers (1970, 1906) and the two conductive layers (1908, 1940) collectively restrict moisture permeation between the EC stack and an ambient environment, wherein at least one conductive layer of the two conductive layers and at least one encapsulation layer of the two encapsulation layers are deposited so as to cover edge portions of the EC thin film stack to restrict moisture permeation between the EC thin film stack and the ambient environment, the at least one conductive layer comprising a moisture-resistant portion disposed at an end portion of the at least one conductive layer that is exposed to the ambient environment, and wherein an area, orthogonally projected onto the single substrate, of the EC thin film stack is reduced, relative to respective areas, orthogonally projected onto the single substrate, of the two conductive layers and the two encapsulation layers.