An imaging device, comprising a lens group; and an integrated assembly forming a solid state image sensor for the imaging device, the integrated assembly comprising: a pixel array mounted in the integrated assembly; an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials, the optical assembly comprises a glass substrate and an infrared filter formed directly on the glass substrate, the glass substrate is bonded by a transparent adhesive to an imaging surface of the pixel array without forming a cavity between the glass substrate and the pixel array, the light shield is formed on a periphery of the infrared filter such that in a direction of light incident on the pixel array first the light shield, second the infrared filter, and third the glass substrate is formed, the end portion of the light shield and an end portion of the solid state image sensor are lying on a same plane, and in the direction of light incidence first the lens group is formed and then the infrared filter is formed. a lens group; and an integrated assembly forming a solid state image sensor for the imaging device, the integrated assembly comprising: a pixel array mounted in the integrated assembly; an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials, the optical assembly comprises a glass substrate and an infrared filter formed directly on the glass substrate, the glass substrate is bonded by a transparent adhesive to an imaging surface of the pixel array without forming a cavity between the glass substrate and the pixel array, the light shield is formed on a periphery of the infrared filter such that in a direction of light incident on the pixel array first the light shield, second the infrared filter, and third the glass substrate is formed, the end portion of the light shield and an end portion of the solid state image sensor are lying on a same plane, and in the direction of light incidence first the lens group is formed and then the infrared filter is formed. a pixel array mounted in the integrated assembly; an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials, the optical assembly comprises a glass substrate and an infrared filter formed directly on the glass substrate, the glass substrate is bonded by a transparent adhesive to an imaging surface of the pixel array without forming a cavity between the glass substrate and the pixel array, the light shield is formed on a periphery of the infrared filter such that in a direction of light incident on the pixel array first the light shield, second the infrared filter, and third the glass substrate is formed, the end portion of the light shield and an end portion of the solid state image sensor are lying on a same plane, and in the direction of light incidence first the lens group is formed and then the infrared filter is formed.