A power converter comprising: a main circuit board configured to allow a power conversion semiconductor module to be mounted thereon; a terminal block arranged above the main circuit board, the terminal block being configured to allow wiring to be connected thereto from outside the power converter; and a resin molded bus bar (10, 210) integrally resin molded such that a plate-shaped first bus bar and a plate-shaped second bus bar, both of which are connected to the terminal block and are electrically connected to the main circuit board, are insulated by an insulating resin (13, 213); wherein the resin molded bus bar has an L-shape including a lateral portion configured to extend along the main circuit board and a vertical portion configured to extend upward from the lateral portion toward the terminal block, wherein the power converter is characterized by further comprising a power supply board arranged above the main circuit board, the power supply board being configured to allow an electronic component configured to generate a control power supply to be mounted thereon; wherein each of the first bus bar and the second bus bar of the resin molded bus bar has an outer surface covered with the insulating resin; the first bus bar is arranged between the main circuit board and the power supply board while being spaced apart by a second separation distance that is smaller than the air insulation distance from the power supply board in the lateral portion covered with the insulating resin; and the second bus bar is arranged between the main circuit board and the power supply board while being spaced apart by a third separation distance that is smaller than the air insulation distance from the main circuit board in the lateral portion covered with the insulating resin, wherein the first bus bar and the second bus bar are electrically connected to the semiconductor module through connection terminals, wherein the first bus bar includes a first main circuit board connector (11b, 211b) exposed from the insulating resin, the first main circuit board connector being connected to the main circuit board, and a power supply board connector exposed from the insulating resin, the power supply board connector being connected to the power supply board. a main circuit board configured to allow a power conversion semiconductor module to be mounted thereon; a terminal block arranged above the main circuit board, the terminal block being configured to allow wiring to be connected thereto from outside the power converter; and a resin molded bus bar (10, 210) integrally resin molded such that a plate-shaped first bus bar and a plate-shaped second bus bar, both of which are connected to the terminal block and are electrically connected to the main circuit board, are insulated by an insulating resin (13, 213); wherein the resin molded bus bar has an L-shape including a lateral portion configured to extend along the main circuit board and a vertical portion configured to extend upward from the lateral portion toward the terminal block, wherein the power converter is characterized by further comprising a power supply board arranged above the main circuit board, the power supply board being configured to allow an electronic component configured to generate a control power supply to be mounted thereon; wherein each of the first bus bar and the second bus bar of the resin molded bus bar has an outer surface covered with the insulating resin; the first bus bar is arranged between the main circuit board and the power supply board while being spaced apart by a second separation distance that is smaller than the air insulation distance from the power supply board in the lateral portion covered with the insulating resin; and the second bus bar is arranged between the main circuit board and the power supply board while being spaced apart by a third separation distance that is smaller than the air insulation distance from the main circuit board in the lateral portion covered with the insulating resin, wherein the first bus bar and the second bus bar are electrically connected to the semiconductor module through connection terminals, wherein the first bus bar includes a first main circuit board connector (11b, 211b) exposed from the insulating resin, the first main circuit board connector being connected to the main circuit board, and a power supply board connector exposed from the insulating resin, the power supply board connector being connected to the power supply board.