Power module (LM, LM'), specifically for the delivery of a phase current to an electric motor, having the following characteristics: - a circuit carrier having a surface; - at least two first contact surfaces (KF11, KF12) on the surface, on which first contact surfaces respectively a first power transistor (T11, T12) having a body-contact surface is directly arranged and respectively connected in an electrically conductive manner to the respective first contact surface (KF11, KF12) via the body-contact surface thereof; - a second contact surface on the surface, on which second contact surface at least two second power transistors (T21, T22) having a body-contact surface are directly arranged and respectively connected in an electrically conductive manner to the second contact surface via the body-contact surfaces thereof; - at least two third contact surfaces (KF31, KF32) on the surface, wherein the at least two second power transistors (T21, T22) respectively have a two-dimensionally extended reverse side contact (S21, S22) via which they are respectively connected in an electrically conductive manner to one of the at least two third contact surfaces (KF31, KF32); - wherein the at least two first (KF11, KF12) and the at least two third (KF31, KF32) contact surfaces are arranged alternatingly, one after the other, in a reference direction of the power module, and the second contact surface is arranged next to the at least two first (KF11, KF12) and the at least two third (KF31, KF32) contact surfaces, characterized in that - the power module (LM, LM') further comprises at least one connecting surface on the surface, which, as a protrusion on one of the at least two third contact surfaces, extends away from the corresponding third contact surface up to another of the at least two third contact surfaces and directly interconnects said two third contact surfaces (KF31, KF32) in an electrically conductive manner; - wherein the at least one connecting surface and the at least two third contact surfaces (KF31, KF32) are mutually configured in a one-piece arrangement. - a circuit carrier having a surface; - at least two first contact surfaces (KF11, KF12) on the surface, on which first contact surfaces respectively a first power transistor (T11, T12) having a body-contact surface is directly arranged and respectively connected in an electrically conductive manner to the respective first contact surface (KF11, KF12) via the body-contact surface thereof; - a second contact surface on the surface, on which second contact surface at least two second power transistors (T21, T22) having a body-contact surface are directly arranged and respectively connected in an electrically conductive manner to the second contact surface via the body-contact surfaces thereof; - at least two third contact surfaces (KF31, KF32) on the surface, wherein the at least two second power transistors (T21, T22) respectively have a two-dimensionally extended reverse side contact (S21, S22) via which they are respectively connected in an electrically conductive manner to one of the at least two third contact surfaces (KF31, KF32); - wherein the at least two first (KF11, KF12) and the at least two third (KF31, KF32) contact surfaces are arranged alternatingly, one after the other, in a reference direction of the power module, and the second contact surface is arranged next to the at least two first (KF11, KF12) and the at least two third (KF31, KF32) contact surfaces, - the power module (LM, LM') further comprises at least one connecting surface on the surface, which, as a protrusion on one of the at least two third contact surfaces, extends away from the corresponding third contact surface up to another of the at least two third contact surfaces and directly interconnects said two third contact surfaces (KF31, KF32) in an electrically conductive manner; - wherein the at least one connecting surface and the at least two third contact surfaces (KF31, KF32) are mutually configured in a one-piece arrangement.