A method for producing a ceramic circuit board having electric printed conductors and contact points on at least one of the two sides and having at least one through-hole contact (via) with the following sequential method steps: a) production of a ceramic substrate of aluminium nitride and introduction of the bore holes at the locations provided for the vias, b) filling of the bore holes with a first adhesive paste of copper, tungsten, molybdenum or their alloys or mixtures thereof, and c) one-pass overprinting, with a first screen printing process, of at least one side of the ceramic substrate with the desired layout of the printed conductors and contact points with a second adhesive paste, d) optionally complete or partial repetition of the overprinting with the second adhesive paste, e) firing of the printed ceramic substrate in a firing oven with N 2 (nitrogen), during which the oxygen content is held in a controlled manner at 0 to 50 ppm O 2, f) printing, with a second screen printing process, of a cover paste with a low glass content onto the second adhesive paste until the desired thickness of the printed conductors and contact points is achieved, g) firing of the printed ceramic substrate in a firing oven with N 2 (nitrogen), during which the oxygen content is held in a controlled manner at 0 to 50 ppm O 2, and wherein h) a highly viscous copper paste is used as the first adhesive paste, the viscosity of which lies between 800 Pa·s and 1200 Pa·s, preferably between 900 Pa·s and 1100 Pa·s and particularly preferably at 1000 Pa·s, i) the copper paste contains CuO or Cu 2 O and an adhesive glass of ZnO-SiO 2 suitable for AlN, and j) the second adhesive paste is identical with the first adhesive paste except for its viscosity, wherein the viscosity of the second adhesive paste is lower by half than that of the first adhesive paste. a) production of a ceramic substrate of aluminium nitride and introduction of the bore holes at the locations provided for the vias, b) filling of the bore holes with a first adhesive paste of copper, tungsten, molybdenum or their alloys or mixtures thereof, and c) one-pass overprinting, with a first screen printing process, of at least one side of the ceramic substrate with the desired layout of the printed conductors and contact points with a second adhesive paste, d) optionally complete or partial repetition of the overprinting with the second adhesive paste, e) firing of the printed ceramic substrate in a firing oven with N 2 (nitrogen), during which the oxygen content is held in a controlled manner at 0 to 50 ppm O 2, f) printing, with a second screen printing process, of a cover paste with a low glass content onto the second adhesive paste until the desired thickness of the printed conductors and contact points is achieved, g) firing of the printed ceramic substrate in a firing oven with N 2 (nitrogen), during which the oxygen content is held in a controlled manner at 0 to 50 ppm O 2, and wherein h) a highly viscous copper paste is used as the first adhesive paste, the viscosity of which lies between 800 Pa·s and 1200 Pa·s, preferably between 900 Pa·s and 1100 Pa·s and particularly preferably at 1000 Pa·s, i) the copper paste contains CuO or Cu 2 O and an adhesive glass of ZnO-SiO 2 suitable for AlN, and j) the second adhesive paste is identical with the first adhesive paste except for its viscosity, wherein the viscosity of the second adhesive paste is lower by half than that of the first adhesive paste.