A method for manufacturing in series optical grade polishing tools each including a base configured to be coupled to a polishing machine, a polishing pad configured to be pressed against a surface to be worked and an elastically compressible body attached to the base and attached to polishing pad with said body sandwiched between the base and the polishing pad; said method including for each said tool the step of attaching said body to said base and the step of attaching said body to said polishing pad; characterized in that at least one of said step of attaching said body to said base and said step of attaching said body to said polishing pad includes a step of applying glue in which glue is applied onto one surface of one component and then includes a step of pressing in which said one surface of one component and one surface of another component are applied on each other, said one component and said another component being one of: said base and said body, said body and said base, said body and said polishing pad, and said polishing pad and said body; said method further including: - the step of providing a supporting device including a support (23A-23D, 22A-22D) configured for receiving said one component; - the step of providing a pad printing machine having a reservoir, a cliché and a transfer pad (38A, 39A, 38B, 39B); and - the step of filling said reservoir with liquid glue; said step of applying glue including: - placing said one component into said support (23A-23D, 22A-22D); - carrying out with said machine the following sequence of steps: driving the reservoir and cliché relative to one another from a rest position in which the reservoir is over an etched area (42A, 43A, 42B, 43B) of the cliché to a working position, in which the reservoir is away from the etched area (42A, 43A, 42B, 43B); then driving the transfer pad (38A, 39A, 38B, 39B) to a taking position in which the distal surface of the transfer pad is in contact with the etched area of the cliché; and then driving the transfer pad from the taking position to an applying position in which the distal surface of the transfer pad is in contact with said one surface of said one component; and - then carrying out again at least once said sequence of steps, whereby said glue is applied at least twice onto said one surface of one component. - the step of providing a supporting device including a support (23A-23D, 22A-22D) configured for receiving said one component; - the step of providing a pad printing machine having a reservoir, a cliché and a transfer pad (38A, 39A, 38B, 39B); and - the step of filling said reservoir with liquid glue; - placing said one component into said support (23A-23D, 22A-22D); - carrying out with said machine the following sequence of steps: driving the reservoir and cliché relative to one another from a rest position in which the reservoir is over an etched area (42A, 43A, 42B, 43B) of the cliché to a working position, in which the reservoir is away from the etched area (42A, 43A, 42B, 43B); then driving the transfer pad (38A, 39A, 38B, 39B) to a taking position in which the distal surface of the transfer pad is in contact with the etched area of the cliché; and then driving the transfer pad from the taking position to an applying position in which the distal surface of the transfer pad is in contact with said one surface of said one component; and - then carrying out again at least once said sequence of steps, whereby said glue is applied at least twice onto said one surface of one component.