A system for adaptively scanning a sample during electron beam inspection comprising: an inspection sub-system configured to scan an electron beam across the surface of the sample, the inspection sub-system including: an electron beam source configured to generate an electron beam; a sample stage configured to secure the sample; and a set of electron-optic elements configured to direct the electron beam onto the sample; and a detector assembly including at least an electron collector, the detector configured to detect electrons from the surface of the sample; and a controller communicatively coupled to one or more portions of the inspection sub-system and in communication with a carrier medium containing pre-programmed instructions, the controller including one or more processors that execute the pre-programmed instructions which cause the one or more processors to: assess at least one pattern characteristic or a defect characteristic of one or more portions of an area for inspection; and responsive to the assessed at least one pattern characteristic or defect characteristic, elongating one or more pixels along a selected direction by adjusting one or more scan parameters associated with the scanning of the electron beam of the inspection sub-system across the surface of the sample; wherein the controller is configured to elongate the one or more pixels along a fast scan direction by increasing scan voltage by a select factor. an inspection sub-system configured to scan an electron beam across the surface of the sample, the inspection sub-system including: an electron beam source configured to generate an electron beam; a sample stage configured to secure the sample; and a set of electron-optic elements configured to direct the electron beam onto the sample; and a detector assembly including at least an electron collector, the detector configured to detect electrons from the surface of the sample; and an electron beam source configured to generate an electron beam; a sample stage configured to secure the sample; and a set of electron-optic elements configured to direct the electron beam onto the sample; and a detector assembly including at least an electron collector, the detector configured to detect electrons from the surface of the sample; and a controller communicatively coupled to one or more portions of the inspection sub-system and in communication with a carrier medium containing pre-programmed instructions, the controller including one or more processors that execute the pre-programmed instructions which cause the one or more processors to: assess at least one pattern characteristic or a defect characteristic of one or more portions of an area for inspection; and responsive to the assessed at least one pattern characteristic or defect characteristic, elongating one or more pixels along a selected direction by adjusting one or more scan parameters associated with the scanning of the electron beam of the inspection sub-system across the surface of the sample; wherein the controller is configured to elongate the one or more pixels along a fast scan direction by increasing scan voltage by a select factor. assess at least one pattern characteristic or a defect characteristic of one or more portions of an area for inspection; and responsive to the assessed at least one pattern characteristic or defect characteristic, elongating one or more pixels along a selected direction by adjusting one or more scan parameters associated with the scanning of the electron beam of the inspection sub-system across the surface of the sample; wherein the controller is configured to elongate the one or more pixels along a fast scan direction by increasing scan voltage by a select factor.