A switching device comprising: a chip package, comprising: a first electrode at least partially disposed within a sealed chamber, the sealed chamber enclosing a quantity of a gas, wherein the sealed chamber includes a base, wherein the base includes a substrate at least partially formed of non-conductive or dielectric material; and a second electrode at least partially disposed within the sealed chamber, the second electrode physically separated from the first electrode by a gap; and a printed circuit board device, comprising: a first connector electrically coupled to the first electrode, the first connector configured to be coupled to a radio frequency, RF, circuit and to receive/transmit a transmit/received signal (360, 361) from/to the radio frequency, RF, circuit and, when the signal is a transmit signal, conduct the transmit signal to first electrode; and a second connector electrically coupled to the second electrode, the second connector configured to be coupled to an antenna interface and to transmit/receive the transmit/received signal (360, 361) to/from the antenna interface and, when the signal is a received signal, conduct the received signal to the second electrode, wherein the antenna interface is connected to an antenna array; wherein, the chip package is coupled to the printed circuit board device; wherein, when the gas is subjected to the transmit/received signal (360, 361), and the transmit/received signal (360, 361) satisfies a threshold, the gas forms a plasma within the sealed chamber, wherein the first electrode is electrically coupled to the second electrode via the plasma when the plasma is formed allowing conduction of the transmit/received signal (360, 361) across the gap between the first and second electrodes (316, 318) and between the radio frequency, RF, circuit and the antenna interface, and wherein the first electrode is electrically isolated from the second electrode when the plasma is not formed. a chip package, comprising: a first electrode at least partially disposed within a sealed chamber, the sealed chamber enclosing a quantity of a gas, wherein the sealed chamber includes a base, wherein the base includes a substrate at least partially formed of non-conductive or dielectric material; and a second electrode at least partially disposed within the sealed chamber, the second electrode physically separated from the first electrode by a gap; and a first electrode at least partially disposed within a sealed chamber, the sealed chamber enclosing a quantity of a gas, wherein the sealed chamber includes a base, wherein the base includes a substrate at least partially formed of non-conductive or dielectric material; and a second electrode at least partially disposed within the sealed chamber, the second electrode physically separated from the first electrode by a gap; and a printed circuit board device, comprising: a first connector electrically coupled to the first electrode, the first connector configured to be coupled to a radio frequency, RF, circuit and to receive/transmit a transmit/received signal (360, 361) from/to the radio frequency, RF, circuit and, when the signal is a transmit signal, conduct the transmit signal to first electrode; and a second connector electrically coupled to the second electrode, the second connector configured to be coupled to an antenna interface and to transmit/receive the transmit/received signal (360, 361) to/from the antenna interface and, when the signal is a received signal, conduct the received signal to the second electrode, wherein the antenna interface is connected to an antenna array; a first connector electrically coupled to the first electrode, the first connector configured to be coupled to a radio frequency, RF, circuit and to receive/transmit a transmit/received signal (360, 361) from/to the radio frequency, RF, circuit and, when the signal is a transmit signal, conduct the transmit signal to first electrode; and a second connector electrically coupled to the second electrode, the second connector configured to be coupled to an antenna interface and to transmit/receive the transmit/received signal (360, 361) to/from the antenna interface and, when the signal is a received signal, conduct the received signal to the second electrode, wherein the antenna interface is connected to an antenna array; wherein, the chip package is coupled to the printed circuit board device; wherein, when the gas is subjected to the transmit/received signal (360, 361), and the transmit/received signal (360, 361) satisfies a threshold, the gas forms a plasma within the sealed chamber, wherein the first electrode is electrically coupled to the second electrode via the plasma when the plasma is formed allowing conduction of the transmit/received signal (360, 361) across the gap between the first and second electrodes (316, 318) and between the radio frequency, RF, circuit and the antenna interface, and wherein the first electrode is electrically isolated from the second electrode when the plasma is not formed.