A method of manufacturing a multilayer device sealed on a textile substrate, the method comprising the steps of: - (a) sizing a first layer of a thermo-bi-adhesive dielectric impermeable material by means of mechanical cutting, laser cutting, shearing, die-cutting, waterjet, plasma cutting, ultrasound cutting or other cutting processes, or (b) unrolling a first layer of a thermo-bi-adhesive dielectric impermeable material; - (c) positioning and gluing an electronic element by means of CNC control machines, mechanical arms or positioning masks on said first layer; the method being characterized by the steps of: - (d) sizing a second layer of an impermeable thermo-adhesive dielectric material by means of mechanical cutting, laser cutting, shearing, diecutting, waterjet, plasma cutting, ultrasound cutting or other cutting processes, or (e) unrolling a second layer of an impermeable thermo-adhesive dielectric material; - (f) enclosing the electronic element between the first and second layers (1, 3), thereby obtaining said multilayer device; - (g) thermic or thermopressing treatment of said multilayer device to adhere the first and second layers (1, 3) and to give them stability; - if the first and second layers (1, 3) were unrolled before: (h) trimming said multilayer device by means of mechanical cutting, laser cutting, shearing or die-cutting; - (i) positioning said multilayer device directly on said textile substrate; - (j) thermopressing said multilayer device on said textile substrate or (k) applying ultrasonic heating to said multilayer device, thereby sealing said multilayer device on said textile substrate; - if the first and/or second layers (1, 3) comprise a protective film: removing said film from said first and/or second layers (1, 3). A method of manufacturing a multilayer device sealed on a textile substrate, the method comprising the steps of: - (a) sizing a first layer of a thermo-bi-adhesive dielectric impermeable material by means of mechanical cutting, laser cutting, shearing, die-cutting, waterjet, plasma cutting, ultrasound cutting or other cutting processes, or (b) unrolling a first layer of a thermo-bi-adhesive dielectric impermeable material; - (c) positioning and gluing an electronic element by means of CNC control machines, mechanical arms or positioning masks on said first layer; - (a) sizing a first layer of a thermo-bi-adhesive dielectric impermeable material by means of mechanical cutting, laser cutting, shearing, die-cutting, waterjet, plasma cutting, ultrasound cutting or other cutting processes, or (b) unrolling a first layer of a thermo-bi-adhesive dielectric impermeable material; - (c) positioning and gluing an electronic element by means of CNC control machines, mechanical arms or positioning masks on said first layer; the method being characterized by the steps of: - (d) sizing a second layer of an impermeable thermo-adhesive dielectric material by means of mechanical cutting, laser cutting, shearing, diecutting, waterjet, plasma cutting, ultrasound cutting or other cutting processes, or (e) unrolling a second layer of an impermeable thermo-adhesive dielectric material; - (f) enclosing the electronic element between the first and second layers (1, 3), thereby obtaining said multilayer device; - (g) thermic or thermopressing treatment of said multilayer device to adhere the first and second layers (1, 3) and to give them stability; - if the first and second layers (1, 3) were unrolled before: (h) trimming said multilayer device by means of mechanical cutting, laser cutting, shearing or die-cutting; - (i) positioning said multilayer device directly on said textile substrate; - (j) thermopressing said multilayer device on said textile substrate or (k) applying ultrasonic heating to said multilayer device, thereby sealing said multilayer device on said textile substrate; - if the first and/or second layers (1, 3) comprise a protective film: removing said film from said first and/or second layers (1, 3). - (d) sizing a second layer of an impermeable thermo-adhesive dielectric material by means of mechanical cutting, laser cutting, shearing, diecutting, waterjet, plasma cutting, ultrasound cutting or other cutting processes, or (e) unrolling a second layer of an impermeable thermo-adhesive dielectric material; - (f) enclosing the electronic element between the first and second layers (1, 3), thereby obtaining said multilayer device; - (g) thermic or thermopressing treatment of said multilayer device to adhere the first and second layers (1, 3) and to give them stability; - if the first and second layers (1, 3) were unrolled before: (h) trimming said multilayer device by means of mechanical cutting, laser cutting, shearing or die-cutting; - (i) positioning said multilayer device directly on said textile substrate; - (j) thermopressing said multilayer device on said textile substrate or (k) applying ultrasonic heating to said multilayer device, thereby sealing said multilayer device on said textile substrate; - if the first and/or second layers (1, 3) comprise a protective film: removing said film from said first and/or second layers (1, 3).