A mounting system comprising a component mounting device configured to mount multiple components on a surface of a board, and a control device, wherein multiple planned mounting sections, at which mounting of multiple components by the component mounting device is planned, and multiple planned electrode sections are composed of multiple wires printed on the surface of the board; wherein the component mounting device comprises an imaging device, being configured to image the surface of the board, and is configured to mount the multiple components on the multiple planned mounting sections when the multiple planned mounting sections of the board surface are at predetermined positions, and wherein the control device is configured to store drawing information depicting the board surface on which the multiple components are to be mounted by the component mounting device, and to compare a specific position in the stored drawing information with a specific position in image information of the board surface imaged by the imaging device, wherein the specific position (91, 92) is a position of a specific planned electrode section, a position of an edge of one of the multiple planned mounting sections or a position of polygonal mark displayed on a corner of the surface of the circuit board, characterized in that the control device is further configured to recognize that the multiple planned mounting sections of the board surface are not at the predetermined positions when the position information of the specific position in the drawing information and the specific position in the image information do not match with each other, causing a positional deviation (Δt) on the circuit board between the specific position in the image information and the specific position in the drawing information, and wherein the control device is capable of generating component mounting information to be used for mounting the multiple components on the board surface based on the stored drawing information, and, is configured to correct the position information indicating the positions of the multiple planned mounting sections for mounting the multiple components to generate the component mounting information when the multiple planned mounting sections of the board surface are not present at the predetermined positions, so as to compensate for the positional deviation (Δt). wherein multiple planned mounting sections, at which mounting of multiple components by the component mounting device is planned, and multiple planned electrode sections are composed of multiple wires printed on the surface of the board; wherein the component mounting device comprises an imaging device, being configured to image the surface of the board, and is configured to mount the multiple components on the multiple planned mounting sections when the multiple planned mounting sections of the board surface are at predetermined positions, and wherein the control device is configured to store drawing information depicting the board surface on which the multiple components are to be mounted by the component mounting device, and to compare a specific position in the stored drawing information with a specific position in image information of the board surface imaged by the imaging device, wherein the specific position (91, 92) is a position of a specific planned electrode section, a position of an edge of one of the multiple planned mounting sections or a position of polygonal mark displayed on a corner of the surface of the circuit board, characterized in that the control device is further configured to recognize that the multiple planned mounting sections of the board surface are not at the predetermined positions when the position information of the specific position in the drawing information and the specific position in the image information do not match with each other, causing a positional deviation (Δt) on the circuit board between the specific position in the image information and the specific position in the drawing information, and wherein the control device is capable of generating component mounting information to be used for mounting the multiple components on the board surface based on the stored drawing information, and, is configured to correct the position information indicating the positions of the multiple planned mounting sections for mounting the multiple components to generate the component mounting information when the multiple planned mounting sections of the board surface are not present at the predetermined positions, so as to compensate for the positional deviation (Δt).