A switchable transmit and receive phased array antenna, STRPAA, (102, 900), the STRPAA comprising: a housing; a multilayer printed wiring board, MLPWB, (206, 300 908) within the housing, the MLPWB having a top surface and a bottom surface; a plurality of radiating elements (208, 210, 212, 906) located on the top surface of the MLPWB (206, 908); and a plurality of transmit and receive, T/R, modules (214, 216, 218, 904, 1700) attached to the bottom surface of the MLPWB (206, 908), wherein the plurality of T/R modules (214, 216, 218, 904) are in signal communication with the bottom surface of the MLPWB (206, 908), wherein each T/R module of the plurality of T/R modules (214, 216, 218, 904) is located on the bottom surface of the MLPWB (206, 900) opposite a corresponding radiating element of the plurality of radiating elements (208, 210, 212, 906) located on the top surface of the MLPWB (206, 900), and wherein each T/R module (214, 216, 218, 904) is in signal communication with the corresponding radiating element (208, 210, 212, 906) located opposite the T/R module, and wherein the housing includes a pressure plate and a honeycomb aperture plate having a plurality of channels (220, 222, 224), wherein the pressure plate is configured to push the plurality of T/R modules (214, 216, 218) against the bottom surface of the MLPWB, wherein the plurality of radiating elements (208, 210, 212) are configured to be placed approximately against the honeycomb aperture plate, wherein each radiating element of the plurality of radiating elements (208, 210, 212) is located at a corresponding channel of the plurality of channels (220, 222, 224) of the honeycomb aperture; wherein each T/R module (214, 216, 218, 904, 1700) further includes: a top surface and bottom surface. a capacitor located on the top surface and an RF module located on the bottom surface, and a holder including a plurality of signal contacts; wherein the top surface is placed in signal communication with the bottom surface of the MLPWB through the plurality of signal contacts (418, 420, 422, 424, 1702) of the holder. a housing; a multilayer printed wiring board, MLPWB, (206, 300 908) within the housing, the MLPWB having a top surface and a bottom surface; a top surface and a bottom surface; a plurality of radiating elements (208, 210, 212, 906) located on the top surface of the MLPWB (206, 908); and a plurality of transmit and receive, T/R, modules (214, 216, 218, 904, 1700) attached to the bottom surface of the MLPWB (206, 908), wherein the plurality of T/R modules (214, 216, 218, 904) are in signal communication with the bottom surface of the MLPWB (206, 908), wherein each T/R module of the plurality of T/R modules (214, 216, 218, 904) is located on the bottom surface of the MLPWB (206, 900) opposite a corresponding radiating element of the plurality of radiating elements (208, 210, 212, 906) located on the top surface of the MLPWB (206, 900), and wherein each T/R module (214, 216, 218, 904) is in signal communication with the corresponding radiating element (208, 210, 212, 906) located opposite the T/R module, and wherein the plurality of T/R modules (214, 216, 218, 904) are in signal communication with the bottom surface of the MLPWB (206, 908), wherein each T/R module of the plurality of T/R modules (214, 216, 218, 904) is located on the bottom surface of the MLPWB (206, 900) opposite a corresponding radiating element of the plurality of radiating elements (208, 210, 212, 906) located on the top surface of the MLPWB (206, 900), and wherein each T/R module (214, 216, 218, 904) is in signal communication with the corresponding radiating element (208, 210, 212, 906) located opposite the T/R module, and wherein the housing includes a pressure plate and a honeycomb aperture plate having a plurality of channels (220, 222, 224), wherein the pressure plate is configured to push the plurality of T/R modules (214, 216, 218) against the bottom surface of the MLPWB, wherein the plurality of radiating elements (208, 210, 212) are configured to be placed approximately against the honeycomb aperture plate, wherein each radiating element of the plurality of radiating elements (208, 210, 212) is located at a corresponding channel of the plurality of channels (220, 222, 224) of the honeycomb aperture; wherein each T/R module (214, 216, 218, 904, 1700) further includes: a top surface and bottom surface. a capacitor located on the top surface and an RF module located on the bottom surface, and a holder including a plurality of signal contacts; a top surface and bottom surface. a capacitor located on the top surface and an RF module located on the bottom surface, and a holder including a plurality of signal contacts; wherein the top surface is placed in signal communication with the bottom surface of the MLPWB through the plurality of signal contacts (418, 420, 422, 424, 1702) of the holder.