A fixed-focus camera module, suitable for assembly in an electronic device, comprising: a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the top side of the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and when the fixed-focus camera module is assembled in the electronic device, the blank side of the circuit board substrate is adjacent to the edge of the electronic device, and wherein the blank side of the circuit board substrate is free of the at least one electronic component; wherein the optical lens comprises a lens barrel unit and a group of optical lens sheets, and the optical lens sheets are supported in the lens barrel unit; wherein the width of the lens barrel unit is smaller than the width of the molded base, so as to define an extension space by the optical lens and the molded base, and wherein when the fixed-focus camera module is assembled in the electronic device, the extension space is used to receive a display screen of the electronic device; characterized in that the lens barrel unit has a stepped portion, and the stepped portion extends inwardly toward an optical axis direction set by the optical lens and is configured to receive at least a portion of the display screen of the electronic device, so as to increase the extension space by means of the stepped portion. a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the top side of the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and when the fixed-focus camera module is assembled in the electronic device, the blank side of the circuit board substrate is adjacent to the edge of the electronic device, and wherein the blank side of the circuit board substrate is free of the at least one electronic component; wherein the optical lens comprises a lens barrel unit and a group of optical lens sheets, and the optical lens sheets are supported in the lens barrel unit; wherein the width of the lens barrel unit is smaller than the width of the molded base, so as to define an extension space by the optical lens and the molded base, and wherein when the fixed-focus camera module is assembled in the electronic device, the extension space is used to receive a display screen of the electronic device; characterized in that the lens barrel unit has a stepped portion, and the stepped portion extends inwardly toward an optical axis direction set by the optical lens and is configured to receive at least a portion of the display screen of the electronic device, so as to increase the extension space by means of the stepped portion.