A method for providing integrated circuit chip modules for use in payment objects, comprising: receiving an integrated circuit chip module and positioning the IC chip module at a first position, wherein said IC chip module is one of a plurality of IC chip modules supportably interconnected to a flexible tape, and wherein each of the plurality of IC chip modules comprise an IC chip and interconnected antenna that are fixedly interconnected to a flexible carrier defined by different portions of said flexible tape; powering the IC chip module; unlocking the IC chip module by presenting transport key data to the IC chip module; encoding the following data in the IC chip comprising the IC chip module after the powering: personalization data provided by an issuer payment institution corresponding with a specific account administered by the issuer payment institution; and, issuer key data provided by the issuer payment institution, wherein said issuer key data is encoded by overwriting the transport key data; wherein said encoding further comprises utilizing a non-contact IC chip interface device to interface with the IC chip module located at said first position and, terminating the powering after the encoding, wherein the IC chip module is automatically locked to restrict access to at least the issuer key data; and, packaging the IC chip module, for provision to a third-party payment object provider; wherein said receiving, powering, encoding and terminating are completed with said IC chip module supportably interconnected to the flexible tape, free from fixed interconnection of said IC chip module and said flexible tape to any card body or other support structure; wherein the transport key data is encoded in the received IC chip module, and wherein the method further comprises: utilizing a transport key identifier to obtain the transport key data from a secure server; wherein the transport key data and/or issuer key data are stored in a first predetermined memory portion of the IC chip module, and wherein the unlocking provides for read and/or write access to a second memory portion of the IC chip module. receiving an integrated circuit chip module and positioning the IC chip module at a first position, wherein said IC chip module is one of a plurality of IC chip modules supportably interconnected to a flexible tape, and wherein each of the plurality of IC chip modules comprise an IC chip and interconnected antenna that are fixedly interconnected to a flexible carrier defined by different portions of said flexible tape; powering the IC chip module; unlocking the IC chip module by presenting transport key data to the IC chip module; encoding the following data in the IC chip comprising the IC chip module after the powering: personalization data provided by an issuer payment institution corresponding with a specific account administered by the issuer payment institution; and, issuer key data provided by the issuer payment institution, wherein said issuer key data is encoded by overwriting the transport key data; wherein said encoding further comprises utilizing a non-contact IC chip interface device to interface with the IC chip module located at said first position and, personalization data provided by an issuer payment institution corresponding with a specific account administered by the issuer payment institution; and, issuer key data provided by the issuer payment institution, wherein said issuer key data is encoded by overwriting the transport key data; wherein said encoding further comprises utilizing a non-contact IC chip interface device to interface with the IC chip module located at said first position and, terminating the powering after the encoding, wherein the IC chip module is automatically locked to restrict access to at least the issuer key data; and, packaging the IC chip module, for provision to a third-party payment object provider; wherein said receiving, powering, encoding and terminating are completed with said IC chip module supportably interconnected to the flexible tape, free from fixed interconnection of said IC chip module and said flexible tape to any card body or other support structure; wherein the transport key data is encoded in the received IC chip module, and wherein the method further comprises: utilizing a transport key identifier to obtain the transport key data from a secure server; wherein the transport key data and/or issuer key data are stored in a first predetermined memory portion of the IC chip module, and wherein the unlocking provides for read and/or write access to a second memory portion of the IC chip module. utilizing a transport key identifier to obtain the transport key data from a secure server; wherein the transport key data and/or issuer key data are stored in a first predetermined memory portion of the IC chip module, and wherein the unlocking provides for read and/or write access to a second memory portion of the IC chip module.