A device comprising: a back side comprising a non-conducting chassis having an interior and an exterior; a first exterior radiating arm located on the exterior of the non-conducting chassis; a second exterior radiating arm located on the exterior of the non-conducting chassis; characterised in that the device further comprises a first microstrip line located on the interior of the non-conducting chassis, the first exterior radiating arm and the first microstrip line electrically connected through the non-conducting chassis, the first exterior radiating arm and the first microstrip line configured to resonate together in a first frequency range; a first interior radiating arm located inside the device, and configured to resonate in one or more second frequency ranges higher than the first frequency range; a second microstrip line located on the interior of the non-conducting chassis, the second exterior radiating arm and the second microstrip line electrically connected through the non-conducting chassis, the second exterior radiating arm and second microstrip line configured to resonate together in the first frequency range; a second interior radiating arm located inside the device, and configured to resonate in the one or more of second frequency ranges; a ground plane located on the exterior of the non-conducting chassis, each of the first exterior radiating arm, the second exterior radiating arm and the ground plane being electrically separated from each other on the exterior of the non-conducting chassis; and one or more antenna feeds configured to connect to each of the first microstrip line the second microstrip line, the first interior radiating arm and the second interior radiating arm. a back side comprising a non-conducting chassis having an interior and an exterior; a first exterior radiating arm located on the exterior of the non-conducting chassis; a second exterior radiating arm located on the exterior of the non-conducting chassis; characterised in that the device further comprises a first microstrip line located on the interior of the non-conducting chassis, the first exterior radiating arm and the first microstrip line electrically connected through the non-conducting chassis, the first exterior radiating arm and the first microstrip line configured to resonate together in a first frequency range; a first interior radiating arm located inside the device, and configured to resonate in one or more second frequency ranges higher than the first frequency range; a second microstrip line located on the interior of the non-conducting chassis, the second exterior radiating arm and the second microstrip line electrically connected through the non-conducting chassis, the second exterior radiating arm and second microstrip line configured to resonate together in the first frequency range; a second interior radiating arm located inside the device, and configured to resonate in the one or more of second frequency ranges; a ground plane located on the exterior of the non-conducting chassis, each of the first exterior radiating arm, the second exterior radiating arm and the ground plane being electrically separated from each other on the exterior of the non-conducting chassis; and one or more antenna feeds configured to connect to each of the first microstrip line the second microstrip line, the first interior radiating arm and the second interior radiating arm.