High-current circuit, in particular motor vehicle high-current circuit, comprising - a printed circuit board made from a non-conductive substrate, a conductor layer applied to the substrate and an insulating layer applied to the conductor layer, wherein - contact pads (8, 10, 12, 20, 22, 24) which break through the insulation layer are arranged on both sides of the conductor plate, and the contact pads (8, 10, 12, 20, 22, 24) are in contact with one another via vias through the substrate, and - the vias are arranged in the area of the contact pads (8, 10, 12, 20, 22, 24), wherein - at least a first one of the contact pads is arranged on a first side of the printed circuit board and multiple semiconductor switches are directly connected to second contact pads (20a-c) on a second side of the printed circuit board, and - at least one semiconductor switch is connected to the first contact pad directly via the vias and the respective second contact pad (20a-c), without further conductor tracks characterized in that - the respectively one of the semiconductor switches is connected with a respective one of the second contact pads with its power terminal, - the second contact pads (20a-c) of power terminals and switching terminals of the semiconductor switches are arranged on the second side of the printed circuit board isolated from each other and neighbouring each other and - corresponding thereto on the first side of the printed circuit board the first contact pad is arranged on the full entire surface, wherein - the second contact pads (20a-c) on the second side of the printed circuit board are connected with the first contact pad on the first side of the printed circuit board via a plurality of vias. - a printed circuit board made from a non-conductive substrate, a conductor layer applied to the substrate and an insulating layer applied to the conductor layer, wherein - contact pads (8, 10, 12, 20, 22, 24) which break through the insulation layer are arranged on both sides of the conductor plate, and the contact pads (8, 10, 12, 20, 22, 24) are in contact with one another via vias through the substrate, and - the vias are arranged in the area of the contact pads (8, 10, 12, 20, 22, 24), wherein - at least a first one of the contact pads is arranged on a first side of the printed circuit board and multiple semiconductor switches are directly connected to second contact pads (20a-c) on a second side of the printed circuit board, and - at least one semiconductor switch is connected to the first contact pad directly via the vias and the respective second contact pad (20a-c), without further conductor tracks - the respectively one of the semiconductor switches is connected with a respective one of the second contact pads with its power terminal, - the second contact pads (20a-c) of power terminals and switching terminals of the semiconductor switches are arranged on the second side of the printed circuit board isolated from each other and neighbouring each other and - corresponding thereto on the first side of the printed circuit board the first contact pad is arranged on the full entire surface, wherein - the second contact pads (20a-c) on the second side of the printed circuit board are connected with the first contact pad on the first side of the printed circuit board via a plurality of vias.