An endoscope comprising: a tubular housing tube used as a scope tip portion of the endoscope; and an imaging module inserted into the tubular housing tube, the imaging module comprising: an imaging device chip having a first chip connection portion and a second chip connection portion; a flexible substrate having a planar shape to which the imaging device chip is fixed, the flexible substrate having a first substrate connection portion (31a, 32a) located with respect to the first chip connection portion in a direction along a longitudinal direction of the scope tip portion and a second substrate connection portion located with respect to the second chip connection portion in a direction orthogonal to the longitudinal direction of the scope tip portion, the flexible substrate being capable of bending, and bent when the flexible substrate is inserted into the housing tube, near the second substrate connection portion in the direction orthogonal to the longitudinal direction between the second substrate connection portion and the second chip connection portion; a first flexible lead wire (21, 22) connecting the first substrate connection portion (31a, 32a) and the first chip connection portion extending substantially in the direction along the longitudinal direction of the scope tip portion; a second flexible lead wire connecting the second substrate connection portion and the second chip connection portion extending substantially in the direction orthogonal to the longitudinal direction of the scope tip portion; first flexible and non-conductive resin covering an entirety of the first lead wire (21, 22); and second flexible and non-conductive resin covering an entirety of the second lead wire. a tubular housing tube used as a scope tip portion of the endoscope; and an imaging module inserted into the tubular housing tube, the imaging module comprising: an imaging device chip having a first chip connection portion and a second chip connection portion; a flexible substrate having a planar shape to which the imaging device chip is fixed, the flexible substrate having a first substrate connection portion (31a, 32a) located with respect to the first chip connection portion in a direction along a longitudinal direction of the scope tip portion and a second substrate connection portion located with respect to the second chip connection portion in a direction orthogonal to the longitudinal direction of the scope tip portion, the flexible substrate being capable of bending, and bent when the flexible substrate is inserted into the housing tube, near the second substrate connection portion in the direction orthogonal to the longitudinal direction between the second substrate connection portion and the second chip connection portion; a first flexible lead wire (21, 22) connecting the first substrate connection portion (31a, 32a) and the first chip connection portion extending substantially in the direction along the longitudinal direction of the scope tip portion; a second flexible lead wire connecting the second substrate connection portion and the second chip connection portion extending substantially in the direction orthogonal to the longitudinal direction of the scope tip portion; first flexible and non-conductive resin covering an entirety of the first lead wire (21, 22); and second flexible and non-conductive resin covering an entirety of the second lead wire. an imaging device chip having a first chip connection portion and a second chip connection portion; a flexible substrate having a planar shape to which the imaging device chip is fixed, the flexible substrate having a first substrate connection portion (31a, 32a) located with respect to the first chip connection portion in a direction along a longitudinal direction of the scope tip portion and a second substrate connection portion located with respect to the second chip connection portion in a direction orthogonal to the longitudinal direction of the scope tip portion, the flexible substrate being capable of bending, and bent when the flexible substrate is inserted into the housing tube, near the second substrate connection portion in the direction orthogonal to the longitudinal direction between the second substrate connection portion and the second chip connection portion; a first flexible lead wire (21, 22) connecting the first substrate connection portion (31a, 32a) and the first chip connection portion extending substantially in the direction along the longitudinal direction of the scope tip portion; a second flexible lead wire connecting the second substrate connection portion and the second chip connection portion extending substantially in the direction orthogonal to the longitudinal direction of the scope tip portion; first flexible and non-conductive resin covering an entirety of the first lead wire (21, 22); and second flexible and non-conductive resin covering an entirety of the second lead wire.