An integrated circuit package, comprising: a package substrate; an interposer structure formed at a top surface of the package substrate, wherein the interposer structure comprises a plurality of interposer layers; and an integrated circuit die formed on the package substrate, wherein the interposer structure surrounds the integrated circuit die; a transmission line formed on at least one of the plurality of interposer layers, wherein the transmission line is configured to convey signals between the package substrate and a printed circuit board; characterized in that the package substrate is a multi-tiered package substrate with a plurality of steps, which are formed by edges, wherein a respective transmission line is formed on each of the plurality of steps coupled to a corresponding transmission line of the interposer structure, the printed circuit board is a multi-tiered printed circuit board with a plurality of steps, which are formed by edges, forming a stepped cavity, wherein the package substrate is formed within the stepped cavity of the printed circuit board, wherein a respective conductive line is formed at the top surface of each of the steps of printed circuit board to convey a respective signal between the package substrate and the printed circuit board via a corresponding transmission line of the interposer structure; and the interposer structure is a multi-tiered interposer structure with a plurality of steps, which are formed by edges, wherein a respective transmission line is formed on each of the plurality of steps, and wherein the interposer structure has a first portion formed over the top surface of the package substrate and a second portion formed over a top surface of the printed circuit board, wherein the interposer structure rests on the steps of the printed circuit board. a package substrate; an interposer structure formed at a top surface of the package substrate, wherein the interposer structure comprises a plurality of interposer layers; and an integrated circuit die formed on the package substrate, wherein the interposer structure surrounds the integrated circuit die; a transmission line formed on at least one of the plurality of interposer layers, wherein the transmission line is configured to convey signals between the package substrate and a printed circuit board; characterized in that the package substrate is a multi-tiered package substrate with a plurality of steps, which are formed by edges, wherein a respective transmission line is formed on each of the plurality of steps coupled to a corresponding transmission line of the interposer structure, the printed circuit board is a multi-tiered printed circuit board with a plurality of steps, which are formed by edges, forming a stepped cavity, wherein the package substrate is formed within the stepped cavity of the printed circuit board, wherein a respective conductive line is formed at the top surface of each of the steps of printed circuit board to convey a respective signal between the package substrate and the printed circuit board via a corresponding transmission line of the interposer structure; and the interposer structure is a multi-tiered interposer structure with a plurality of steps, which are formed by edges, wherein a respective transmission line is formed on each of the plurality of steps, and wherein the interposer structure has a first portion formed over the top surface of the package substrate and a second portion formed over a top surface of the printed circuit board, wherein the interposer structure rests on the steps of the printed circuit board.