One-component thermosetting epoxy resin adhesive comprising: - 10-60% by weight, especially 30-50% by weight, based on the total weight of the epoxy resin composition, of epoxy resin having an average of more than one epoxy group per molecule; - 1-10% by weight, especially 2-6% by weight, based on the total weight of the epoxy resin composition, of at least one latent curing agent for epoxy resins; - 2-7% by weight, especially 2-6.5% by weight, 2-5% by weight, 2-4% by weight, of aerogel particles, based on the total weight of the one-component thermosetting epoxy resin adhesive; - at least one toughness improver D selected from the group consisting of terminally blocked polyurethane polymers D1, liquid rubbers D2 and core-shell polymers D3, where the proportions are preferably as follows: toughness improver D1 10-60% by weight, especially 20-40% by weight; toughness improver D2 10-30% by weight, especially 20-30% by weight; toughness improver D3 10-30% by weight, especially 20-30% by weight; based on the total weight of the epoxy resin composition; - preferably 5-40% by weight, preferably 5-20% by weight, based on the total weight of the epoxy resin composition, of a filler F selected from the group consisting of calcium carbonate and calcium oxide; - preferably 0.1-15% by weight, preferably 0.1-5% by weight, especially preferably 0.1-2% by weight, more preferably 0.2-1% by weight, based on the total weight of the epoxy resin composition, of an epoxy group-bearing reactive diluent G, wherein the one-component thermosetting epoxy resin adhesive consists of the aforementioned constituents to an extent of more than 95% by weight, based on the total weight of the epoxy resin composition, and wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, especially 1000-3500 Pas, at 25°C, determining the viscosity by oscillography by means of an Anton Paar MCR 301 rheometer with a heatable plate under the following measurement conditions: a gap of 1000 μm, a measurement plate diameter of 25 mm (plate/plate), a deformation of 0.01 at 5 Hz at a temperature of 25°C. - 10-60% by weight, especially 30-50% by weight, based on the total weight of the epoxy resin composition, of epoxy resin having an average of more than one epoxy group per molecule; - 1-10% by weight, especially 2-6% by weight, based on the total weight of the epoxy resin composition, of at least one latent curing agent for epoxy resins; - 2-7% by weight, especially 2-6.5% by weight, 2-5% by weight, 2-4% by weight, of aerogel particles, based on the total weight of the one-component thermosetting epoxy resin adhesive; - at least one toughness improver D selected from the group consisting of terminally blocked polyurethane polymers D1, liquid rubbers D2 and core-shell polymers D3, where the proportions are preferably as follows: toughness improver D1 10-60% by weight, especially 20-40% by weight; toughness improver D2 10-30% by weight, especially 20-30% by weight; toughness improver D3 10-30% by weight, especially 20-30% by weight; based on the total weight of the epoxy resin composition; toughness improver D1 10-60% by weight, especially 20-40% by weight; toughness improver D2 10-30% by weight, especially 20-30% by weight; toughness improver D3 10-30% by weight, especially 20-30% by weight; based on the total weight of the epoxy resin composition; - preferably 5-40% by weight, preferably 5-20% by weight, based on the total weight of the epoxy resin composition, of a filler F selected from the group consisting of calcium carbonate and calcium oxide; - preferably 0.1-15% by weight, preferably 0.1-5% by weight, especially preferably 0.1-2% by weight, more preferably 0.2-1% by weight, based on the total weight of the epoxy resin composition, of an epoxy group-bearing reactive diluent G, wherein the one-component thermosetting epoxy resin adhesive consists of the aforementioned constituents to an extent of more than 95% by weight, based on the total weight of the epoxy resin composition, and wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, especially 1000-3500 Pas, at 25°C, determining the viscosity by oscillography by means of an Anton Paar MCR 301 rheometer with a heatable plate under the following measurement conditions: a gap of 1000 μm, a measurement plate diameter of 25 mm (plate/plate), a deformation of 0.01 at 5 Hz at a temperature of 25°C.