A method of assembling an implantable electrode array including the steps of: providing a coupon formed from plastically deformable material, wherein the coupon lies in a plane; characterized by the steps of: shaping at least one section of the coupon to define at least one carrier, wherein as part of said step of defining the carrier, the at least one section of the coupon is shaped to extend out of the plane of the coupon so as to have a curved shape; after said step of defining the carrier, mounting the coupon to a substrate, so that, as a consequence of said step of mounting the coupon, the at least one carrier is flexed back into the plane of the coupon; after the at least one carrier is flexed back into the plane of the coupon, bonding insulating material and conductive material on the at least one carrier to form on the at least one carrier at least one electrode and at least one conductor; and after the at least one electrode and the at least one conductor are formed on the at least one carrier, separating the at least one carrier from the rest of the coupon, removing the carrier from the substrate and lifting off the assembly consisting of the carrier, the at least one electrode and the at least one conductor from the substrate so that as a result of the lifting off of the assembly, the assembly forms the implantable electrode array with a curved shape. providing a coupon formed from plastically deformable material, wherein the coupon lies in a plane; characterized by the steps of: shaping at least one section of the coupon to define at least one carrier, wherein as part of said step of defining the carrier, the at least one section of the coupon is shaped to extend out of the plane of the coupon so as to have a curved shape; after said step of defining the carrier, mounting the coupon to a substrate, so that, as a consequence of said step of mounting the coupon, the at least one carrier is flexed back into the plane of the coupon; after the at least one carrier is flexed back into the plane of the coupon, bonding insulating material and conductive material on the at least one carrier to form on the at least one carrier at least one electrode and at least one conductor; and after the at least one electrode and the at least one conductor are formed on the at least one carrier, separating the at least one carrier from the rest of the coupon, removing the carrier from the substrate and lifting off the assembly consisting of the carrier, the at least one electrode and the at least one conductor from the substrate so that as a result of the lifting off of the assembly, the assembly forms the implantable electrode array with a curved shape. shaping at least one section of the coupon to define at least one carrier, wherein as part of said step of defining the carrier, the at least one section of the coupon is shaped to extend out of the plane of the coupon so as to have a curved shape; after said step of defining the carrier, mounting the coupon to a substrate, so that, as a consequence of said step of mounting the coupon, the at least one carrier is flexed back into the plane of the coupon; after the at least one carrier is flexed back into the plane of the coupon, bonding insulating material and conductive material on the at least one carrier to form on the at least one carrier at least one electrode and at least one conductor; and after the at least one electrode and the at least one conductor are formed on the at least one carrier, separating the at least one carrier from the rest of the coupon, removing the carrier from the substrate and lifting off the assembly consisting of the carrier, the at least one electrode and the at least one conductor from the substrate so that as a result of the lifting off of the assembly, the assembly forms the implantable electrode array with a curved shape.