An apparatus comprising: a four-braid resistive heater (100, 200) comprising a conductive structure (104, 204) configured to transport electrical currents and to generate heat based on the electrical currents; the conductive structure comprising first, second, third, and fourth electrical conductors (106, 108, 110, 112) and first, second, third, and fourth dielectric layers (206a-206d); wherein the first and second electrical conductors (106, 108) comprise resistive paths in or on the first and third dielectric layers (206a, 206c) and conductive vias between the first and third dielectric layers (206a, 206c), wherein the first and second electrical conductors (106, 108) twist around each other and loop around the third and fourth electrical conductors (110, 112) along a length of the conductive structure (104, 204), wherein the third and fourth electrical conductors (110, 112) comprise resistive paths in or on the second and fourth dielectric layers (206b, 206d) and conductive vias between the second and fourth dielectric layers (206b, 206d), wherein the third and fourth electrical conductors (110, 112) twist around each other and loop around the first and second electrical conductors (106, 108) along the length of the conductive structure (104, 204); wherein loops formed with the first and second electrical conductors (106, 108) are interleaved with loops formed with the third and fourth electrical conductors (110, 112) along the length of the conductive structure (104, 204); wherein the first and second electrical conductors (106, 108) are configured to be coupled to a first side of a power supply (102, 202); and wherein the third and fourth electrical conductors (110, 112) are configured to be coupled to a second side of the power supply (102, 202). a four-braid resistive heater (100, 200) comprising a conductive structure (104, 204) configured to transport electrical currents and to generate heat based on the electrical currents; the conductive structure comprising first, second, third, and fourth electrical conductors (106, 108, 110, 112) and first, second, third, and fourth dielectric layers (206a-206d); wherein the first and second electrical conductors (106, 108) comprise resistive paths in or on the first and third dielectric layers (206a, 206c) and conductive vias between the first and third dielectric layers (206a, 206c), wherein the first and second electrical conductors (106, 108) twist around each other and loop around the third and fourth electrical conductors (110, 112) along a length of the conductive structure (104, 204), wherein the third and fourth electrical conductors (110, 112) comprise resistive paths in or on the second and fourth dielectric layers (206b, 206d) and conductive vias between the second and fourth dielectric layers (206b, 206d), wherein the third and fourth electrical conductors (110, 112) twist around each other and loop around the first and second electrical conductors (106, 108) along the length of the conductive structure (104, 204); wherein loops formed with the first and second electrical conductors (106, 108) are interleaved with loops formed with the third and fourth electrical conductors (110, 112) along the length of the conductive structure (104, 204); wherein the first and second electrical conductors (106, 108) are configured to be coupled to a first side of a power supply (102, 202); and wherein the third and fourth electrical conductors (110, 112) are configured to be coupled to a second side of the power supply (102, 202).