mhurhangee/ep-ind-claims huggingface dataset:
A compound of formula: wherein Ar is phenyl; m 1 is 1 and m 2 is 2 or m 1 is 2 and m 2 is 1; J is -C(R 21 R 22)-; Y is -C(R 41 R 42)- and Z is -C(R 51 R 52), and n 2 and n 3 are independently selected from 0 or 1 with the proviso that at least one of n 2 and n 3 must be 1; R 41 and R 51 may be combined to form, together with Y and Z, a (C 3 -C 5)cycloalkyl ring which may be optionally substituted by (C 1 -C 3)alkyl or halo; R 1, R 2, R 11, R 12, R 21 and R 22 are hydrogen; R 41, R 42, R 51, and R 52 are independently selected from hydrogen, deuterium, halo, or (C 1 -C 3)alkyl optionally substituted by halo; A is -CO 2 H; G is optionally substituted phenyl; G is optionally substituted one or more times by B, where B is (C 1 -C 10)alkyl, (C 2 -C 10)alkenyl, (C 2 -C 10)alkynyl, (C 1 -C 10)alkoxy, (C 2 -C 10)dialkylamino, (C 1 -C 10)alkylthio, (C 2 -C 10)heteroalkyl, (C 3 -C 10)cycloalkyl, (C 3 -C 10)heterocycloalkyl, halo, (C 1 -C 10)haloalkyl, (C 1 -C 10)perhaloalkyl, optionally substituted aryl, optionally substituted heteroaryl, optionally substituted arylalkyl, cyano, or E-M where E is -O-, -S- or -N(R 4)- and M is optionally substituted (C 1 -C 7)alkyl, (C 3 -C 7)cycloalkyl, fluoro(C 1 -C 3)alkyl, a 5- to 10-membered heterocyclic group or an optionally substituted 6- to 10-membered aryl group, and when G is substituted by a plurality of substituents, each substituent is selected independently; R 4 is hydrogen, deuterium, or (C 1 -C 3)alkyl optionally substituted by halo; or a pharmaceutically acceptable salt or solvate (eg hydrate) thereof, or corresponding N-oxide. wherein Ar is phenyl; m 1 is 1 and m 2 is 2 or m 1 is 2 and m 2 is 1; J is -C(R 21 R 22)-; Y is -C(R 41 R 42)- and Z is -C(R 51 R 52), and n 2 and n 3 are independently selected from 0 or 1 with the proviso that at least one of n 2 and n 3 must be 1; R 41 and R 51 may be combined to form, together with Y and Z, a (C 3 -C 5)cycloalkyl ring which may be optionally substituted by (C 1 -C 3)alkyl or halo; R 1, R 2, R 11, R 12, R 21 and R 22 are hydrogen; R 41, R 42, R 51, and R 52 are independently selected from hydrogen, deuterium, halo, or (C 1 -C 3)alkyl optionally substituted by halo; A is -CO 2 H; G is optionally substituted phenyl; G is optionally substituted one or more times by B, where B is (C 1 -C 10)alkyl, (C 2 -C 10)alkenyl, (C 2 -C 10)alkynyl, (C 1 -C 10)alkoxy, (C 2 -C 10)dialkylamino, (C 1 -C 10)alkylthio, (C 2 -C 10)heteroalkyl, (C 3 -C 10)cycloalkyl, (C 3 -C 10)heterocycloalkyl, halo, (C 1 -C 10)haloalkyl, (C 1 -C 10)perhaloalkyl, optionally substituted aryl, optionally substituted heteroaryl, optionally substituted arylalkyl, cyano, or E-M where E is -O-, -S- or -N(R 4)- and M is optionally substituted (C 1 -C 7)alkyl, (C 3 -C 7)cycloalkyl, fluoro(C 1 -C 3)alkyl, a 5- to 10-membered heterocyclic group or an optionally substituted 6- to 10-membered aryl group, and when G is substituted by a plurality of substituents, each substituent is selected independently; R 4 is hydrogen, deuterium, or (C 1 -C 3)alkyl optionally substituted by halo; or a pharmaceutically acceptable salt or solvate (eg hydrate) thereof, or corresponding N-oxide.
A structure of an underrun protection bound to a plurality of brackets disposed at the front or rear portion of a frame of a vehicle, wherein a hollow having a closed section is defined by a distal face of a longitudinal direction of the vehicle, a proximal face of the longitudinal direction, an upper face, and a lower face, wherein lightening holes (51, 52, 53) are formed on at least one of the upper face and the lower face of the underrun protection, wherein the underrun protection has binder parts between a middle part of a extending direction of the underrun protection and each edge, which binder parts are bound to the respective brackets, wherein in addition to the binder parts the underrun protection is divided into multiple parts, namely edge parts outside the respective binder parts in a width direction of the vehicle and the middle part between the binder parts in the width direction of the vehicle, wherein among multiple lightening holes (51, 52, 53), middle lightening holes (51, 52) formed in the middle part are discriminated from an edge lightening hole formed in the edge part, wherein the underrun protection comprises a distal panel disposed on a distal side of the longitudinal direction of the vehicle and a proximal panel disposed on a proximal side of the longitudinal direction of the vehicle, the distal panel and the proximal panel being engaged with each other to form a hollow having a closed section and wherein at least one edge of flanges (22, 23) of the distal panel extends to a position including a part where the lightening hole (51, 52, 53) is formed; and an inner face of the edge of the flange (22, 23) of the distal panel is in contact with and is engaged with an outer face of an edge of the corresponding flange (32, 33) of the proximal panel by welding.
A method of forming a transaction card having a laser-treatable layer (102a, 102b, 101) for personalization of the card and a hard coat layer (108, 108a) thereover, with an energy absorbing buffer layer (110a, 112a, 808a, 808b, 908) between the laser-treatable layer and the hard coat layer, the method being characterized by the steps of: forming a core subassembly (A, A1, C, D, E, F) comprising two or more layers including the laser-treatable layer and comprising one or more elements (12, 13, 14, 120, 121, 123) defining the functionality of the card; said first core subassembly having a top layer and a bottom layer; forming a hard coat subassembly including the hard coat layer attached to a release layer mounted on a carrier layer; attaching the hard coat subassembly to the top layer of the core subassembly so the hard coat layer is closest to the core subassembly, and disposing the buffer layer (110a, 112a, 808a, 808b, 908) between the core subassembly and the hard coat layer, to form a first card assembly; laminating the first card assembly under predetermined temperature and pressure; and removing the release layer and the carrier layer to form a resultant card. forming a core subassembly (A, A1, C, D, E, F) comprising two or more layers including the laser-treatable layer and comprising one or more elements (12, 13, 14, 120, 121, 123) defining the functionality of the card; said first core subassembly having a top layer and a bottom layer; forming a hard coat subassembly including the hard coat layer attached to a release layer mounted on a carrier layer; attaching the hard coat subassembly to the top layer of the core subassembly so the hard coat layer is closest to the core subassembly, and disposing the buffer layer (110a, 112a, 808a, 808b, 908) between the core subassembly and the hard coat layer, to form a first card assembly; laminating the first card assembly under predetermined temperature and pressure; and removing the release layer and the carrier layer to form a resultant card.
Building comprising an insulated masonry structure that separates the inside of said building from the outside environment, said insulated masonry structure comprising one or more formworks for insulated masonry comprising a first panel, thermally and/or acoustically insulating, made of expanded polystyrene or wood-cement or expanded polypropylene or expanded polyethylene or expanded polyurethane, and a second panel, facing said first panel and connected to the same by one or more crossbeams, wherein said second panel is made of a material having a density comprised between 150 and 2500 kilograms per cubic meter (kg/m 3) and a specific heat capacity comprised between 0.5 kJ/kgK and 2 kJ/kgK, wherein solidified concrete fills the gap between said first panel and said second panel, firmly gripping said first panel and second panel, and said crossbeams that connect them, said insulated masonry structure comprises an opening adapted to place in communication the inside of said building with the outside environment, the building being characterised in that: said one or more formworks are positioned with the respective said second panel turned towards the outside environment, at least partially defining the perimeter edge of said opening, and/or in that said building comprises at least two storeys (55a, 55b) subdivided by a floor, wherein said insulated masonry structure separates said two storeys (55a, 55b) and said floor from the outside environment, wherein said one or more formworks are positioned at said floor and with the respective said second panel turned towards the outside environment. said insulated masonry structure comprises an opening adapted to place in communication the inside of said building with the outside environment, the building being characterised in that: said one or more formworks are positioned with the respective said second panel turned towards the outside environment, at least partially defining the perimeter edge of said opening, and/or in that said building comprises at least two storeys (55a, 55b) subdivided by a floor, wherein said insulated masonry structure separates said two storeys (55a, 55b) and said floor from the outside environment, wherein said one or more formworks are positioned at said floor and with the respective said second panel turned towards the outside environment.
A method for fabricating a light emitting device comprising: providing a flip-chip light emitting diode die on a substrate, wherein the LED is mounted on a submount such that the LED die is between the submount and the substrate, the substrate being wider and longer than the LED die so that edges of the substrate extend over edges of the LED die; providing an insulating underfill between the LED die and the submount and around edges of the LED die and substrate; removing the substrate from the LED die, wherein walls are formed around the LED die by portions of the underfill that were around the edges of the substrate, inner boundaries of the walls being laterally separated from the edges of the LED die; and placing an optical element over an exposed surface of the LED die after the substrate has been removed, at least portions of edges of the optical element being within the walls of the underfill, the optical element having a preformed shape prior to being placed over the exposed surface of the LED die, the optical element having length and width outer dimensions, wherein the length dimension of the optical element is less than a length dimension of the inner boundaries of the walls, and wherein the width dimension of the optical element is less than a width dimension of the inner boundaries of the walls, so that there is a relaxed tolerance when placing the optical element flush over the exposed surface of the LED die, and wherein all edges of the preformed optical element overhang edges of the LED die. providing a flip-chip light emitting diode die on a substrate, wherein the LED is mounted on a submount such that the LED die is between the submount and the substrate, the substrate being wider and longer than the LED die so that edges of the substrate extend over edges of the LED die; providing an insulating underfill between the LED die and the submount and around edges of the LED die and substrate; removing the substrate from the LED die, wherein walls are formed around the LED die by portions of the underfill that were around the edges of the substrate, inner boundaries of the walls being laterally separated from the edges of the LED die; and placing an optical element over an exposed surface of the LED die after the substrate has been removed, at least portions of edges of the optical element being within the walls of the underfill, the optical element having a preformed shape prior to being placed over the exposed surface of the LED die, the optical element having length and width outer dimensions, wherein the length dimension of the optical element is less than a length dimension of the inner boundaries of the walls, and wherein the width dimension of the optical element is less than a width dimension of the inner boundaries of the walls, so that there is a relaxed tolerance when placing the optical element flush over the exposed surface of the LED die, and wherein all edges of the preformed optical element overhang edges of the LED die.
A method for monitoring an arc process carried out by a torch, in particular a welding process, wherein the torch performs a pendular movement with a pendular frequency (f P) and images (P i) of the surroundings of the arc are recorded at an image repetition frequency (f B) by means of a monitoring system connected to the torch and comprising at least one camera, and the images (P i) are displayed on a display device, characterised in that an offset ( Δ d) of the current image (P i) with respect to the previous image (P i-1) is determined, the current image (P i) is offset by the share (Δd') of the determined offset ( Δ d) in the direction of the pendular movement and the offset current image (P i) is displayed.
A control method for processing water circulation in a washing machine comprising, subjecting the washing water of the washing machine drained from the water containing drum to a flocculation treatment and after the flocculation treatment is completed, circulating the treated water for re-use into the water containing drum, characterized in that, according to an amount of detergent in the washing water, an amount of water intake for washing the clothing, and an amount of water detected in each flocculation treatment, a dose of flocculant is calculated for the water in the flocculation treatment wherein, after washing ends, water is drained to a flocculation container for the flocculation treatment, the amount of water in the flocculation treatment is detected and denoted as L1,the amount of detergent is denoted as M, the amount of water intake for washing is denoted as L, the dose of flocculant for the water in the flocculation treatment is N1 =aML1/L, among them, a is a constant, which is related to the type of detergent and flocculant, after the flocculation treatment is completed, treated water is re-drained into a water containing drum for rinsing.
Assembly of a main module and of a terminal block module that are intended to be joined with one another, the main module including: - a main positive busbar, - a main negative busbar, - at least one phase busbar intended to be connected to a respective phase of an electrical machine, - for each phase busbar: - a high-side switch connected between the main positive busbar and the phase busbar, - a low-side switch connected between the phase busbar and the main negative busbar, - an electrical ground, - a first capacitor connected between the main positive busbar and the electrical ground, - a second capacitor connected between the main negative busbar and the electrical ground, and the terminal block module including: - an auxiliary positive busbar having a positive terminal, the auxiliary positive busbar being intended to be connected to the main positive busbar when the terminal block module is joined with the main module, - an auxiliary negative busbar having a negative terminal, the auxiliary negative busbar being intended to be connected to the main negative busbar when the terminal block module is joined with the main module. - a main positive busbar, - a main negative busbar, - at least one phase busbar intended to be connected to a respective phase of an electrical machine, - for each phase busbar: - a high-side switch connected between the main positive busbar and the phase busbar, - a low-side switch connected between the phase busbar and the main negative busbar, - a high-side switch connected between the main positive busbar and the phase busbar, - a low-side switch connected between the phase busbar and the main negative busbar, - an electrical ground, - a first capacitor connected between the main positive busbar and the electrical ground, - a second capacitor connected between the main negative busbar and the electrical ground, - an auxiliary positive busbar having a positive terminal, the auxiliary positive busbar being intended to be connected to the main positive busbar when the terminal block module is joined with the main module, - an auxiliary negative busbar having a negative terminal, the auxiliary negative busbar being intended to be connected to the main negative busbar when the terminal block module is joined with the main module.
A virtual private network system, comprising a network server, an access device, and user equipment, wherein the user equipment is configured to send a first packet to the access device, wherein the first packet comprises an identifier of a first user, and the identifier of the first user is used to identify the first user; the access device is configured to: receive the first packet sent by the user equipment, search an already stored second list for a suppressed state identifier of the first user according to the identifier of the first user, and send the first packet to the network server when the second list does not comprise the suppressed state identifier of the first user, wherein the suppressed state identifier of the first user is used to indicate not to provide services to the first user; and the network server is configured to: receive the first packet sent by the access device, search an already stored first list for the suppressed state identifier of the first user according to the identifier of the first user, and discard the first packet when the first list comprises the suppressed state identifier of the first user, and to send a second packet to the access device when the first list comprises the suppressed state identifier of the first user, wherein the second packet comprises the suppressed state identifier of the first user, so that the access device stops providing services to the first user according to the suppressed state identifier of the first user.
A machine for the production of ceramic products comprising at least: - a mould made up of at least two parts (3, 4) designed to define, in a closed configuration, a cavity for casting the product; - means for clamping and containing the mould acting on the mould in its closed configuration; - a frame for supporting the mould and the clamping and containing means and having a longitudinal axis of extension; - a supporting base, interposed between the supporting frame and a walkable surface, having a first portion pivoted to the frame to allow the supporting frame to rotate relative to the walkable surface and a second portion, spaced from the first portion, comprising at least one actuator element (10, 11) connected to the supporting frame to incline the supporting frame at least from a first limit operating position, where the supporting frame is inclined by a first angle (α or β) relative to the walkable surface, to a second limit operating position, where the supporting frame is inclined by a second angle (α or β) which is different from the first angle (α or β), relative to the walkable surface, wherein the first portion of the supporting base is articulated to the frame with a first axis of rotation lying in a plane passing through the longitudinal axis of extension of the frame to allow a first rotation of the frame, relative to the walkable surface between the two limit operating positions, and characterized in that the first portion of the supporting base is articulated to the frame with a second axis of rotation lying in a plane at right angles to the longitudinal axis of extension of the frame to allow a second rotation of the frame, relative to the walkable surface between the two limit operating positions. - a mould made up of at least two parts (3, 4) designed to define, in a closed configuration, a cavity for casting the product; - means for clamping and containing the mould acting on the mould in its closed configuration; - a frame for supporting the mould and the clamping and containing means and having a longitudinal axis of extension; - a supporting base, interposed between the supporting frame and a walkable surface, having a first portion pivoted to the frame to allow the supporting frame to rotate relative to the walkable surface and a second portion, spaced from the first portion, comprising at least one actuator element (10, 11) connected to the supporting frame to incline the supporting frame at least from a first limit operating position, where the supporting frame is inclined by a first angle (α or β) relative to the walkable surface, to a second limit operating position, where the supporting frame is inclined by a second angle (α or β) which is different from the first angle (α or β), relative to the walkable surface,
Device for coating a substrate, comprising a vacuum chamber, at least one cathode arrangement arranged in the vacuum chamber, and at least one vacuum pump in connection with the vacuum chamber, wherein a suction chamber is formed between the at least one vacuum pump and the vacuum chamber, characterised in that the suction chamber extends transversely to a transport direction of the substrate, the suction chamber being in connection throttled by means of at least one throttling point with the vacuum chamber, and in that the throttling point is formed by at least one slit extending transversely to the transport direction of the substrate, the slit being adjustable so that a throttling effect occurs which causes homogenisation of the gas distribution in the vacuum chamber.
LED light source having one or more LEDs disposed on a printed circuit board, wherein each of the LEDs comprises at least one LED die disposed on an LED PCB by means of a die attach, and the LED PCB comprises electrical rear side contacts on the side opposite the LED die, wherein the rear side contacts cover at least half the surface, preferably, aside from necessary exceptions, the entire surface of the LED PCB, wherein the LED die is cast in a material and the LED die is inserted into a reflector, wherein the LED PCB is a metal core printed circuit board and the LED die is mounted directly on the metal core, wherein the printed circuit board comprises contact surfaces with which the one or more LEDs (s) are in contact, and wherein the rear side contacts of the one or more LEDs are respectively soldered to the contact surfaces on at least half the surface of the LED PCB.
A film mold comprising: a first resin layer having a pattern region including a concavo-convex pattern and constituted by a resin composition; a first glass substrate layer constituted by thin film glass and laminated on a surface on an opposite side to a surface on which the pattern region is formed in the first resin layer; and a second resin layer constituted by a resin composition and laminated on a surface on an opposite side to a surface on the first resin layer side of the first glass substrate layer, wherein (i) the first glass substrate layer is formed of a material having a tensile stress of 50 MPa or lower when bent into a state of a curvature radius of 150 mm or smaller, and/or (ii) the thickness of the first glass substrate layer is 200 μm or smaller. a first resin layer having a pattern region including a concavo-convex pattern and constituted by a resin composition; a first glass substrate layer constituted by thin film glass and laminated on a surface on an opposite side to a surface on which the pattern region is formed in the first resin layer; and a second resin layer constituted by a resin composition and laminated on a surface on an opposite side to a surface on the first resin layer side of the first glass substrate layer, wherein (i) the first glass substrate layer is formed of a material having a tensile stress of 50 MPa or lower when bent into a state of a curvature radius of 150 mm or smaller, and/or (ii) the thickness of the first glass substrate layer is 200 μm or smaller. (i) the first glass substrate layer is formed of a material having a tensile stress of 50 MPa or lower when bent into a state of a curvature radius of 150 mm or smaller, and/or (ii) the thickness of the first glass substrate layer is 200 μm or smaller.