A heat dissipation apparatus, comprising: a thermally conductive housing, wherein there is a cuboid vacuum cavity in the thermally conductive housing, and there is a chip placement region on a first surface of the thermally conductive housing; a capillary structure including an evaporation-side capillary structure close to the chip placement region and a condensation-side capillary structure on a side of the thermally conductive housing opposite to the evaporation-side capillary structure, wherein the evaporation-side capillary structure comprises a first capillary structure and a second capillary structure that are connected, wherein the first capillary structure and the second capillary structure are fixedly connected to an inner wall of the thermally conductive housing, the first capillary structure is located on a side close to the first surface, a vertical projection of the first capillary structure on the first surface covers at least a part of a vertical projection of the chip placement region on the first surface, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure; and a working medium disposed in the vacuum cavity, wherein the capillary structure is configured to accommodate and carry the working medium, wherein the thermally conductive housing has a cuboid structure and includes a first slab and a second slab disposed opposite to each other, the first and second slabs being connected in a sealed manner to form the cuboid vacuum cavity, the evaporation-side capillary structure is attached to the first slab close to the chip placement region and the condensation-side capillary structure is attached to the second slab, and the evaporation-side capillary structure is connected to the condensation-side capillary structure - by further capillary structures on side walls of the thermally conductive housing connecting the first and second slabs, and - by at least one support column between the first slab and the second slab, wherein at least one additional capillary structure is disposed on the support column. a thermally conductive housing, wherein there is a cuboid vacuum cavity in the thermally conductive housing, and there is a chip placement region on a first surface of the thermally conductive housing; a capillary structure including an evaporation-side capillary structure close to the chip placement region and a condensation-side capillary structure on a side of the thermally conductive housing opposite to the evaporation-side capillary structure, wherein the evaporation-side capillary structure comprises a first capillary structure and a second capillary structure that are connected, wherein the first capillary structure and the second capillary structure are fixedly connected to an inner wall of the thermally conductive housing, the first capillary structure is located on a side close to the first surface, a vertical projection of the first capillary structure on the first surface covers at least a part of a vertical projection of the chip placement region on the first surface, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure; and a working medium disposed in the vacuum cavity, wherein the capillary structure is configured to accommodate and carry the working medium, wherein the thermally conductive housing has a cuboid structure and includes a first slab and a second slab disposed opposite to each other, the first and second slabs being connected in a sealed manner to form the cuboid vacuum cavity, the evaporation-side capillary structure is attached to the first slab close to the chip placement region and the condensation-side capillary structure is attached to the second slab, and the evaporation-side capillary structure is connected to the condensation-side capillary structure - by further capillary structures on side walls of the thermally conductive housing connecting the first and second slabs, and - by at least one support column between the first slab and the second slab, wherein at least one additional capillary structure is disposed on the support column. - by further capillary structures on side walls of the thermally conductive housing connecting the first and second slabs, and - by at least one support column between the first slab and the second slab, wherein at least one additional capillary structure is disposed on the support column.