A high-strength, high-toughness and wear-resistant composite steel plate, comprising a substrate layer and a compounding layer compounded on one or both surfaces of the substrate layer, wherein the substrate layer is a carbon steel layer, and the compounding layer is an ultra-high manganese steel layer, wherein the compounding layer has a Mn element content of 16.00 - 25.00wt%; wherein the substrate layer comprises the following chemical elements in mass percentage: C: 0.10-0.25wt.%; Si: 0.10-1.00wt.%; Mn: 0.40-2.00wt.%; Cr: 0.01-2.00wt.%; Mo: 0.01-1.00wt.%; Ni: 0.01-2.00wt.%; Nb: 0.001-0.080wt.%; B: 0.0005-0.0040wt.%; Al: 0.010-0.080wt.%; optionally at least one of the following chemical elements: 0 <V≤0.080wt.% and 0 <Ti≤0.060wt.%; and the balance of Fe and other unavoidable impurities; wherein the unavoidable impurities are controlled as follows: P <0.030%; S <0.010%; N ≤0.0080%; O≤0.0080%; H≤0.0004%; wherein the substrate layer has a tensile strength of ≥1200MPa, a yield strength of ≥1000MPa, an elongation of ≥14%, a Brinell hardness of ≥400HB, and a Charpy V-notch longitudinal impact energy at -40 °C of ≥60J; wherein the compounding layer comprises the following chemical elements in mass percentage: C: 1.30-1.80wt.%; Si: 0.20-1.50wt.%; Mn: 16.00-25.00wt.%; Cr: 0.01-3.00wt.%; Mo: 0.01-1.00wt.%; Ti: ≤0.060%; Al: 0.010-0.080wt.%; and the balance of Fe and other unavoidable impurities; wherein the unavoidable impurities are controlled as follows: P <0.030%; S <0.010%; wherein the compounding layer has a tensile strength of ≥500MPa, an elongation of ≥12%, a Brinell hardness of ≥170HB, and a Charpy U-notch longitudinal impact energy at -40 °C of ≥40J. wherein the substrate layer comprises the following chemical elements in mass percentage: C: 0.10-0.25wt.%; Si: 0.10-1.00wt.%; Mn: 0.40-2.00wt.%; Cr: 0.01-2.00wt.%; Mo: 0.01-1.00wt.%; Ni: 0.01-2.00wt.%; Nb: 0.001-0.080wt.%; B: 0.0005-0.0040wt.%; Al: 0.010-0.080wt.%; optionally at least one of the following chemical elements: 0 <V≤0.080wt.% and 0 <Ti≤0.060wt.%; and the balance of Fe and other unavoidable impurities; wherein the unavoidable impurities are controlled as follows: P <0.030%; S <0.010%; N ≤0.0080%; O≤0.0080%; H≤0.0004%; wherein the substrate layer has a tensile strength of ≥1200MPa, a yield strength of ≥1000MPa, an elongation of ≥14%, a Brinell hardness of ≥400HB, and a Charpy V-notch longitudinal impact energy at -40 °C of ≥60J; C: 0.10-0.25wt.%; Si: 0.10-1.00wt.%; Mn: 0.40-2.00wt.%; Cr: 0.01-2.00wt.%; Mo: 0.01-1.00wt.%; Ni: 0.01-2.00wt.%; Nb: 0.001-0.080wt.%; B: 0.0005-0.0040wt.%; Al: 0.010-0.080wt.%; optionally at least one of the following chemical elements: 0 <V≤0.080wt.% and 0 <Ti≤0.060wt.%; and the balance of Fe and other unavoidable impurities; wherein the unavoidable impurities are controlled as follows: P <0.030%; S <0.010%; N ≤0.0080%; O≤0.0080%; H≤0.0004%; wherein the substrate layer has a tensile strength of ≥1200MPa, a yield strength of ≥1000MPa, an elongation of ≥14%, a Brinell hardness of ≥400HB, and a Charpy V-notch longitudinal impact energy at -40 °C of ≥60J; wherein the compounding layer comprises the following chemical elements in mass percentage: C: 1.30-1.80wt.%; Si: 0.20-1.50wt.%; Mn: 16.00-25.00wt.%; Cr: 0.01-3.00wt.%; Mo: 0.01-1.00wt.%; Ti: ≤0.060%; Al: 0.010-0.080wt.%; and the balance of Fe and other unavoidable impurities; wherein the unavoidable impurities are controlled as follows: P <0.030%; S <0.010%; wherein the compounding layer has a tensile strength of ≥500MPa, an elongation of ≥12%, a Brinell hardness of ≥170HB, and a Charpy U-notch longitudinal impact energy at -40 °C of ≥40J. C: 1.30-1.80wt.%; Si: 0.20-1.50wt.%; Mn: 16.00-25.00wt.%; Cr: 0.01-3.00wt.%; Mo: 0.01-1.00wt.%; Ti: ≤0.060%; Al: 0.010-0.080wt.%; and the balance of Fe and other unavoidable impurities; wherein the unavoidable impurities are controlled as follows: P <0.030%; S <0.010%; wherein the compounding layer has a tensile strength of ≥500MPa, an elongation of ≥12%, a Brinell hardness of ≥170HB, and a Charpy U-notch longitudinal impact energy at -40 °C of ≥40J.