A laser machining head configured to control an irradiation position of a laser beam on a machining target, the laser machining head comprising: a first parallel plate configured to shift the laser beam incident on the first parallel plate; a first holder holding the first parallel plate, a first motor configured to rotate the first holder around a first rotary axis; a second parallel plate configured to shift the laser beam that has been shifted by the first parallel plate; a second holder holding the second parallel plate, and a second motor configured to rotate the second holder around a second rotary axis, wherein the first parallel plate and the second parallel plate are disposed such that the first rotary axis and the second rotary axis extend in an identical direction, the first motor rotates the first parallel plate and the second motor rotates the second parallel plate to control an irradiation position of the laser beam on the machining target, characterised by the first holder having a first rotation angle identification unit (50, 51, 52, 53) to identify the rotation angle of the first parallel plate, wherein the first parallel plate is fixed in the first holder, wherein the first rotation angle identification unit (50, 51, 52, 53) has a positioning surface in the form of a projection, a hole (51, 52) or a cutout that allows calibration of an origin position angle of the first parallel plate, and the second holder having a second rotation angle identification unit (50, 51, 52, 53) to identify the rotation angle of the second parallel plate, wherein the second parallel plate is fixed in the second holder, wherein the second rotation angle identification unit (50, 51, 52, 53) has a positioning surface in the form of a projection, a hole (51, 52) or a cutout that allows calibration of an origin position angle of the second parallel plate. a first parallel plate configured to shift the laser beam incident on the first parallel plate; a first holder holding the first parallel plate, a first motor configured to rotate the first holder around a first rotary axis; a second parallel plate configured to shift the laser beam that has been shifted by the first parallel plate; a second holder holding the second parallel plate, and a second motor configured to rotate the second holder around a second rotary axis, wherein the first parallel plate and the second parallel plate are disposed such that the first rotary axis and the second rotary axis extend in an identical direction, the first motor rotates the first parallel plate and the second motor rotates the second parallel plate to control an irradiation position of the laser beam on the machining target, characterised by the first holder having a first rotation angle identification unit (50, 51, 52, 53) to identify the rotation angle of the first parallel plate, wherein the first parallel plate is fixed in the first holder, wherein the first rotation angle identification unit (50, 51, 52, 53) has a positioning surface in the form of a projection, a hole (51, 52) or a cutout that allows calibration of an origin position angle of the first parallel plate, and the second holder having a second rotation angle identification unit (50, 51, 52, 53) to identify the rotation angle of the second parallel plate, wherein the second parallel plate is fixed in the second holder, wherein the second rotation angle identification unit (50, 51, 52, 53) has a positioning surface in the form of a projection, a hole (51, 52) or a cutout that allows calibration of an origin position angle of the second parallel plate.