A method of manufacturing micromolds for electroforming a micromechanical component having at least two levels, said method comprising the following steps: a) applying to a substrate, illuminating and developing at least two layers of photoresist, namely a first layer and a top layer to obtain a micromould with at least two levels of polymerized photoresist (3, 3b, 5 and 5b) comprising at least one cavity having a bottom formed by a first conductive layer covering the substrate, upper horizontal surfaces of the first level, upper horizontal surfaces of the top layer and vertical flanks, b) depositing a conductive layer on the bottom of the cavity and on the upper horizontal surfaces of the first level, the deposition of which comprises the steps: i) applying an ink to all or part of the horizontal surfaces of the top photoresist layer by mechanical transfer from an inker, ii) depositing a second conductive layer on the micromould by directional vacuum evaporation parallel to the vertical flanks of the cavity in order to minimize the thickness of metal deposited on these vertical flanks, the thickness of metal deposited on the vertical flanks being smaller than that deposited on the horizontal surfaces (7a, 7b and 7c), iii) removing the second conductive layer covering the vertical sides of the cavity by controlled chemical etching, said second conductive layer covering only the bottom of the cavity and the upper horizontal surfaces of the first level and top layer (7b, 7c). iv) removing the ink, thereby removing the conductive layer on top of said ink. a) applying to a substrate, illuminating and developing at least two layers of photoresist, namely a first layer and a top layer to obtain a micromould with at least two levels of polymerized photoresist (3, 3b, 5 and 5b) comprising at least one cavity having a bottom formed by a first conductive layer covering the substrate, upper horizontal surfaces of the first level, upper horizontal surfaces of the top layer and vertical flanks, b) depositing a conductive layer on the bottom of the cavity and on the upper horizontal surfaces of the first level, the deposition of which comprises the steps: i) applying an ink to all or part of the horizontal surfaces of the top photoresist layer by mechanical transfer from an inker, ii) depositing a second conductive layer on the micromould by directional vacuum evaporation parallel to the vertical flanks of the cavity in order to minimize the thickness of metal deposited on these vertical flanks, the thickness of metal deposited on the vertical flanks being smaller than that deposited on the horizontal surfaces (7a, 7b and 7c), iii) removing the second conductive layer covering the vertical sides of the cavity by controlled chemical etching, said second conductive layer covering only the bottom of the cavity and the upper horizontal surfaces of the first level and top layer (7b, 7c). iv) removing the ink, thereby removing the conductive layer on top of said ink. i) applying an ink to all or part of the horizontal surfaces of the top photoresist layer by mechanical transfer from an inker, ii) depositing a second conductive layer on the micromould by directional vacuum evaporation parallel to the vertical flanks of the cavity in order to minimize the thickness of metal deposited on these vertical flanks, the thickness of metal deposited on the vertical flanks being smaller than that deposited on the horizontal surfaces (7a, 7b and 7c), iii) removing the second conductive layer covering the vertical sides of the cavity by controlled chemical etching, said second conductive layer covering only the bottom of the cavity and the upper horizontal surfaces of the first level and top layer (7b, 7c). iv) removing the ink, thereby removing the conductive layer on top of said ink.