A stack type sensor package structure, comprising: a substrate having an upper surface and a lower surface opposite to the upper surface, wherein the substrate includes a plurality of solder pads arranged on the upper surface; at least one semiconductor chip mounted on the substrate; a frame fixed on the upper surface of the substrate and surrounded by the solder pads, wherein the at least one semiconductor chip is in a space defined by the frame and the substrate and does not contact the frame, and the frame has a bearing plane above the at least one semiconductor chip; a sensor chip having a top surface and a bottom surface opposite to the top surface, the sensor chip including a plurality of connecting pads arranged on the top surface thereof, wherein a size of the sensor chip is larger than that of the at least one semiconductor chip, and the bottom surface of the sensor chip is fixed on the bearing plane; a plurality of wires each having a first end and a second end opposite to the first end, wherein the first ends of the wires are respectively connected to the solder pads, and the second ends of the wires are respectively connected to the connecting pads; a transparent layer having a first surface and a second surface opposite to the first surface, wherein the second surface has a central region and a ring-shaped supported region encircling the central region; a support having a ring-shaped structure; characterized in that said support is disposed on at least one of the top surface of the sensor chip and the bearing surface of the frame, wherein a top end of the support abuts against the supported region of the transparent layer; and a package compound disposed on the upper surface of the substrate and covering a lateral side of the frame, at least part of a lateral side of the transparent layer, and a lateral side of the support, wherein at least part of each of the wires is embedded in the package compound, wherein at least part of the support is disposed on the top surface of the sensor chip, and covers the connecting pads and a part of each of the wires. a substrate having an upper surface and a lower surface opposite to the upper surface, wherein the substrate includes a plurality of solder pads arranged on the upper surface; at least one semiconductor chip mounted on the substrate; a frame fixed on the upper surface of the substrate and surrounded by the solder pads, wherein the at least one semiconductor chip is in a space defined by the frame and the substrate and does not contact the frame, and the frame has a bearing plane above the at least one semiconductor chip; a sensor chip having a top surface and a bottom surface opposite to the top surface, the sensor chip including a plurality of connecting pads arranged on the top surface thereof, wherein a size of the sensor chip is larger than that of the at least one semiconductor chip, and the bottom surface of the sensor chip is fixed on the bearing plane; a plurality of wires each having a first end and a second end opposite to the first end, wherein the first ends of the wires are respectively connected to the solder pads, and the second ends of the wires are respectively connected to the connecting pads; a transparent layer having a first surface and a second surface opposite to the first surface, wherein the second surface has a central region and a ring-shaped supported region encircling the central region; a support having a ring-shaped structure;