A wiring board (10e; 10f) comprising: a substrate (100e; 100f) having transparency; a plurality of first wiring (200e; 200f) which are arranged on an upper surface of the substrate (100e; 100f) and extend in a first direction and each of which has a back surface (201e; 201f) in contact with the substrate (100e; 100f) and a front surface (202e; 202f) facing an opposite side of the back surface (201e; 201f); and a second wiring (300e; 300f) which is arranged on the upper surface of the substrate (100e; 100f), extends in a second direction intersecting with the first direction, and has a back surface (303e; 303f) in contact with the substrate (100e; 100f) and a front surface (304e; 304f) facing an opposite side of the back surface (303e; 303f), wherein the first wiring (200e; 200f) has a pair of side surfaces (209e, 210e; 209f, 210f) which extend in the first direction and are adjacent to the back surface (201e; 201f) of the first wiring (200e; 200f), the second wiring (300e; 300f) has a pair of side surfaces (305e, 306e; 305f, 306f) which extend in the second direction and are adjacent to the back surface (303e; 303f) of the second wiring (300e; 300f), one side surface (210e; 210f) of the first wiring (200e; 200f) and one side surface of the second wiring (300e; 300f) are continuously connected by a curved surface (e; f) at an intersection between the first wiring (200e; 200f) and the second wiring (300e; 300f), characterized in that a radius of curvature of the curved surface (e; f) of only one of four corners or at only two adjacent corners of the four corners is larger than a radius of curvature at the other corners, the four corners being formed by an upper surface of the substrate (100e; 100f), the pair of side surfaces (209e, 210e; 209f, 210f) of the first wiring (200e; 200f), and the pair of side surfaces (305e, 306e; 305f, 306f) of the second wiring (300e; 300f), a line width of the first wiring (200e; 200f) is in a range of 0.1 μm or more and 5.0 μm or less, and a line width of the second wiring (300e; 300f) is in a range of 0.1 μm or more and 5.0 μm or less. a substrate (100e; 100f) having transparency; a plurality of first wiring (200e; 200f) which are arranged on an upper surface of the substrate (100e; 100f) and extend in a first direction and each of which has a back surface (201e; 201f) in contact with the substrate (100e; 100f) and a front surface (202e; 202f) facing an opposite side of the back surface (201e; 201f); and a second wiring (300e; 300f) which is arranged on the upper surface of the substrate (100e; 100f), extends in a second direction intersecting with the first direction, and has a back surface (303e; 303f) in contact with the substrate (100e; 100f) and a front surface (304e; 304f) facing an opposite side of the back surface (303e; 303f), wherein the first wiring (200e; 200f) has a pair of side surfaces (209e, 210e; 209f, 210f) which extend in the first direction and are adjacent to the back surface (201e; 201f) of the first wiring (200e; 200f), the second wiring (300e; 300f) has a pair of side surfaces (305e, 306e; 305f, 306f) which extend in the second direction and are adjacent to the back surface (303e; 303f) of the second wiring (300e; 300f), one side surface (210e; 210f) of the first wiring (200e; 200f) and one side surface of the second wiring (300e; 300f) are continuously connected by a curved surface (e; f) at an intersection between the first wiring (200e; 200f) and the second wiring (300e; 300f), characterized in that a radius of curvature of the curved surface (e; f) of only one of four corners or at only two adjacent corners of the four corners is larger than a radius of curvature at the other corners, the four corners being formed by an upper surface of the substrate (100e; 100f), the pair of side surfaces (209e, 210e; 209f, 210f) of the first wiring (200e; 200f), and the pair of side surfaces (305e, 306e; 305f, 306f) of the second wiring (300e; 300f), a line width of the first wiring (200e; 200f) is in a range of 0.1 μm or more and 5.0 μm or less, and a line width of the second wiring (300e; 300f) is in a range of 0.1 μm or more and 5.0 μm or less.