A ball grid array packaged device, comprising: an integrated circuit, IC, die; an integrated circuit carrier substrate to which the IC die is attached and which comprises a bottom interconnect surface on which is formed one or more first conductive signal contact pads surrounded by a first plurality of shielding contact pads (321A, 321C) formed in an array around the one or more first conductive signal contact pads; the integrated circuit carrier substrate further comprising: (i) a conductive through hole structure affixed to each of the one or more first conductive signal contact pads and extending from the bottom interconnect surface and into the integrated circuit carrier substrate; and (ii) an array of shielding conductive through hole structures (322B, 322D) surrounding each conductive through hole structure in an isolation array, and extending from the bottom interconnect surface and into the integrated circuit carrier substrate, the first plurality of shielding contact pads (321A, 321C) surrounding the shielding conductive through hole structures (322B, 322D); an array of conductors comprising one or more signal feed solder balls, each of which is non-peripheral, affixed to the one or more first conductive signal contact pads, and an array of shielding solder balls (311A, 311C) surrounding the one or more signal feed solder balls, in an isolation array and affixed to the first plurality of shielding contact pads (321A, 321C); and an interconnect structure comprising a top interconnect surface, one or more second conductive signal contact pads formed on the top interconnect surface and affixed to the one or more signal feed solder balls, a second plurality of shielding contact pads (305A, 305C) formed on the top interconnect surface in an array around the one or more second conductive signal contact pads and affixed to the array of shielding solder balls (311A, 311C), and a plurality of interconnect structures which define routing paths from the one or more conductive signal contact pads and the second plurality of shielding contact pads (305A, 305C) wherein the one or more routing paths from the respective one or more conductive signal contact pads are different from the routing paths from the second plurality of shielding contact pads (305A, 305C). an integrated circuit, IC, die; an integrated circuit carrier substrate to which the IC die is attached and which comprises a bottom interconnect surface on which is formed one or more first conductive signal contact pads surrounded by a first plurality of shielding contact pads (321A, 321C) formed in an array around the one or more first conductive signal contact pads; the integrated circuit carrier substrate further comprising: (i) a conductive through hole structure affixed to each of the one or more first conductive signal contact pads and extending from the bottom interconnect surface and into the integrated circuit carrier substrate; and (ii) an array of shielding conductive through hole structures (322B, 322D) surrounding each conductive through hole structure in an isolation array, and extending from the bottom interconnect surface and into the integrated circuit carrier substrate, the first plurality of shielding contact pads (321A, 321C) surrounding the shielding conductive through hole structures (322B, 322D); (i) a conductive through hole structure affixed to each of the one or more first conductive signal contact pads and extending from the bottom interconnect surface and into the integrated circuit carrier substrate; and (ii) an array of shielding conductive through hole structures (322B, 322D) surrounding each conductive through hole structure in an isolation array, and extending from the bottom interconnect surface and into the integrated circuit carrier substrate, the first plurality of shielding contact pads (321A, 321C) surrounding the shielding conductive through hole structures (322B, 322D); an array of conductors comprising one or more signal feed solder balls, each of which is non-peripheral, affixed to the one or more first conductive signal contact pads, and an array of shielding solder balls (311A, 311C) surrounding the one or more signal feed solder balls, in an isolation array and affixed to the first plurality of shielding contact pads (321A, 321C); and an interconnect structure comprising a top interconnect surface, one or more second conductive signal contact pads formed on the top interconnect surface and affixed to the one or more signal feed solder balls, a second plurality of shielding contact pads (305A, 305C) formed on the top interconnect surface in an array around the one or more second conductive signal contact pads and affixed to the array of shielding solder balls (311A, 311C), and a plurality of interconnect structures which define routing paths from the one or more conductive signal contact pads and the second plurality of shielding contact pads (305A, 305C) wherein the one or more routing paths from the respective one or more conductive signal contact pads are different from the routing paths from the second plurality of shielding contact pads (305A, 305C).