Method for diffusion soldering an electronic component on a substrate, in which method - a mounting surface of the component is provided with recesses which are in the form of channels and these channels surround pillar-like structural elements, wherein the structural elements form the mounting surface, wherein the channels and the structural elements together form a coherent metal structure, - the substrate has a coherent contact area which is structured from a metallization, - the component, by way of its mounting surface, is placed onto the contact area of the substrate, wherein a soldering material which extends partially into the channels before the soldering process is used between the substrate and the component, wherein the soldering material incompletely fills the channels and leaves free a base and a middle region of each channel, wherein the middle region extends over the entire depth of the channel as far as its base, - a mounting force is applied to the component, this leading to the distance between the component and the substrate and also the intermediate space between the contact area and the mounting surface being reduced, wherein the soldering material is partially displaced out of the intermediate space and forms beads in the volume which is made available by the channels, and - the soldering material is heated to a temperature which initiates a diffusion process between the soldering material and the component and also the substrate, wherein a soldered connection is formed, which soldered connection has a diffusion zone which bridges the intermediate space between the contact area and the mounting surface and which has an elevated melting point in comparison to the soldering material, - wherein the channels, after the soldered connection is formed, lie outside the diffusion zone which bridges the intermediate space between the contact area and the mounting surface and are only partially filled by an extended soldered connection composed of the soldering material outside the diffusion zone. - a mounting surface of the component is provided with recesses which are in the form of channels and these channels surround pillar-like structural elements, wherein the structural elements form the mounting surface, wherein the channels and the structural elements together form a coherent metal structure, - the substrate has a coherent contact area which is structured from a metallization, - the component, by way of its mounting surface, is placed onto the contact area of the substrate, wherein a soldering material which extends partially into the channels before the soldering process is used between the substrate and the component, wherein the soldering material incompletely fills the channels and leaves free a base and a middle region of each channel, wherein the middle region extends over the entire depth of the channel as far as its base, - a mounting force is applied to the component, this leading to the distance between the component and the substrate and also the intermediate space between the contact area and the mounting surface being reduced, wherein the soldering material is partially displaced out of the intermediate space and forms beads in the volume which is made available by the channels, and - the soldering material is heated to a temperature which initiates a diffusion process between the soldering material and the component and also the substrate, wherein a soldered connection is formed, which soldered connection has a diffusion zone which bridges the intermediate space between the contact area and the mounting surface and which has an elevated melting point in comparison to the soldering material, - wherein the channels, after the soldered connection is formed, lie outside the diffusion zone which bridges the intermediate space between the contact area and the mounting surface and are only partially filled by an extended soldered connection composed of the soldering material outside the diffusion zone.