A method of producing a photonic chip comprising a connecting means for aligning and connecting an optical fiber to a photonic integrated waveguide provided on the photonic chip, (i) wherein the photonic chip at least comprises a substrate and a waveguide layer, which is provided on or within an upper portion of the substrate and which defines the photonic integrated waveguide, (ii) wherein the photonic integrated waveguide and the optical fiber each have a front end portion (8, 9), each front end portion (8, 9) having an optical axis and a front surface, (iii) wherein the connecting means comprises a groove configured to receive a front end portion of the optical fiber, in such a way that the front surfaces of the photonic integrated waveguide and the optical fiber are positioned opposite each other and that the optical axes of the photonic integrated waveguide and the optical fiber are essentially aligned with each other, (iv) wherein the groove is essentially U-shaped in its cross section, wherein the groove has a bottom surface and two inner side surfaces, and wherein at least one of the both inner side surfaces of the U-shaped groove has a coating of an elastic material configured to hold in place the optical fiber after it is inserted into the groove, the method comprising the following steps: (a) providing the photonic chip; (b) etching the U-shaped groove into the photonic chip, the groove essentially extending from the front surface of the front end portion of the photonic integrated waveguide in the direction of the optical axis of the front end portion of the photonic integrated waveguide; and (c) applying the coating of an elastic material on at least one of the inner side surfaces of the U-shaped groove, wherein the step of applying the coating of an elastic material on at least one of the inner side surfaces of the U-shaped groove is carried out by filling the groove with the elastic material and subsequently removing a central portion of the elastic material by etching in such a way that the coating remains on at least one of the inner side surfaces (d) wherein the groove and the coating(s) of the inner side surfaces are configured to receive and hold in place a front end portion of an optical fiber. (i) wherein the photonic chip at least comprises a substrate and a waveguide layer, which is provided on or within an upper portion of the substrate and which defines the photonic integrated waveguide, (ii) wherein the photonic integrated waveguide and the optical fiber each have a front end portion (8, 9), each front end portion (8, 9) having an optical axis and a front surface, (iii) wherein the connecting means comprises a groove configured to receive a front end portion of the optical fiber, in such a way that the front surfaces of the photonic integrated waveguide and the optical fiber are positioned opposite each other and that the optical axes of the photonic integrated waveguide and the optical fiber are essentially aligned with each other, (iv) wherein the groove is essentially U-shaped in its cross section, wherein the groove has a bottom surface and two inner side surfaces, and wherein at least one of the both inner side surfaces of the U-shaped groove has a coating of an elastic material configured to hold in place the optical fiber after it is inserted into the groove, (a) providing the photonic chip; (b) etching the U-shaped groove into the photonic chip, the groove essentially extending from the front surface of the front end portion of the photonic integrated waveguide in the direction of the optical axis of the front end portion of the photonic integrated waveguide; and (c) applying the coating of an elastic material on at least one of the inner side surfaces of the U-shaped groove, wherein the step of applying the coating of an elastic material on at least one of the inner side surfaces of the U-shaped groove is carried out by filling the groove with the elastic material and subsequently removing a central portion of the elastic material by etching in such a way that the coating remains on at least one of the inner side surfaces (d) wherein the groove and the coating(s) of the inner side surfaces are configured to receive and hold in place a front end portion of an optical fiber.