A semiconductor package, comprising: a lead frame including one or more anodes and one or more cathodes which are spaced apart from each other; and a molding part which seals the anode and the cathode; wherein the lead frame further includes terminal parts (90, 91) which are disposed at distal ends of the anode and the cathode, respectively; wherein one or more heat radiating holes are formed in an upper portion and a lower portion of the semiconductor package, and which simultaneously pass through the anode and/or the cathode, and through the molding part; wherein one or more semiconductor chip attachment parts are formed in the upper portion of the semiconductor package; wherein one or more first upper openings are formed in the upper portion of the molding part; wherein one or more second upper openings are formed in the upper portion of the molding part; wherein one or more first lower openings are formed in the lower portion of the molding part at positions corresponding to the semiconductor chip attachment parts, and which expose the anode or the cathode to the outside; wherein one or more second lower openings are formed in the lower portion of the molding part at positions corresponding to the second upper openings, and which expose the anode or the cathode to the outside; wherein each of the one or more first and second lower openings (60, 80) have sufficient surface area to discharge heat so that the semiconductor package itself functions as a heat sink when power is applied; and wherein the one or more heat radiating holes simultaneously pass through each of the one or more second upper openings and each of the one or more second lower openings, characterised in that the one or more first upper openings expose the anode or the cathode to the outside; the one or more second upper openings expose the anode or the cathode to the outside; and each of the one or more first and second upper openings (70, 71) have sufficient surface area to discharge heat so that the semiconductor package itself functions as a heat sink when power is applied. a lead frame including one or more anodes and one or more cathodes which are spaced apart from each other; and a molding part which seals the anode and the cathode; wherein the lead frame further includes terminal parts (90, 91) which are disposed at distal ends of the anode and the cathode, respectively; wherein one or more heat radiating holes are formed in an upper portion and a lower portion of the semiconductor package, and which simultaneously pass through the anode and/or the cathode, and through the molding part; wherein one or more semiconductor chip attachment parts are formed in the upper portion of the semiconductor package; wherein one or more first upper openings are formed in the upper portion of the molding part; wherein one or more second upper openings are formed in the upper portion of the molding part; wherein one or more first lower openings are formed in the lower portion of the molding part at positions corresponding to the semiconductor chip attachment parts, and which expose the anode or the cathode to the outside; wherein one or more second lower openings are formed in the lower portion of the molding part at positions corresponding to the second upper openings, and which expose the anode or the cathode to the outside; wherein each of the one or more first and second lower openings (60, 80) have sufficient surface area to discharge heat so that the semiconductor package itself functions as a heat sink when power is applied; and wherein the one or more heat radiating holes simultaneously pass through each of the one or more second upper openings and each of the one or more second lower openings, characterised in that the one or more first upper openings expose the anode or the cathode to the outside; the one or more second upper openings expose the anode or the cathode to the outside; and each of the one or more first and second upper openings (70, 71) have sufficient surface area to discharge heat so that the semiconductor package itself functions as a heat sink when power is applied.