An electronic device comprising: a first printed circuit board including at least one electronic part; a first header mounted on the first printed circuit board; a first module including, on a first surface thereof, a first socket for engagement with the first header and including a second header on a second surface opposite to the first surface, the first module being configured to perform a first function; a second module including, on one surface thereof, a second socket for engagement with the second header, the second module being configured to perform a second function; and a processor electrically connected with the first header, wherein the processor is configured to transfer at least one first signal for control of the first module or at least one second signal for control of the second module to the first header, wherein the first header includes a first plurality of terminals, and the first socket includes a second plurality of terminals electrically connected with the first plurality of terminals, wherein the second header includes a third plurality of terminals, and the second socket includes a fourth plurality of terminals electrically connected with the third plurality of terminals, wherein the first plurality of terminals includes a first terminal subset and a second terminal subset, and the second plurality of terminals includes a third terminal subset electrically connected with the first terminal subset and a fourth terminal subset electrically connected with the second terminal subset, wherein the first terminal subset and the third terminal subset are configured to transfer the at least one first signal from the first header to the first module, and wherein the second terminal subset, the fourth terminal subset, at least one of the third plurality of terminals, and at least one of the fourth plurality of terminals that electrically connected with the at least one of the third plurality of terminals are configured to transfer the at least one second signal the first header to the second module. a first printed circuit board including at least one electronic part; a first header mounted on the first printed circuit board; a first module including, on a first surface thereof, a first socket for engagement with the first header and including a second header on a second surface opposite to the first surface, the first module being configured to perform a first function; a second module including, on one surface thereof, a second socket for engagement with the second header, the second module being configured to perform a second function; and a processor electrically connected with the first header, wherein the processor is configured to transfer at least one first signal for control of the first module or at least one second signal for control of the second module to the first header, wherein the first header includes a first plurality of terminals, and the first socket includes a second plurality of terminals electrically connected with the first plurality of terminals, wherein the second header includes a third plurality of terminals, and the second socket includes a fourth plurality of terminals electrically connected with the third plurality of terminals, wherein the first plurality of terminals includes a first terminal subset and a second terminal subset, and the second plurality of terminals includes a third terminal subset electrically connected with the first terminal subset and a fourth terminal subset electrically connected with the second terminal subset, wherein the first terminal subset and the third terminal subset are configured to transfer the at least one first signal from the first header to the first module, and wherein the second terminal subset, the fourth terminal subset, at least one of the third plurality of terminals, and at least one of the fourth plurality of terminals that electrically connected with the at least one of the third plurality of terminals are configured to transfer the at least one second signal the first header to the second module.