A layout structure (100, 200, 310, 320, 330, 340, 410, 420, 500, 710, 720), disposed on a circuit board, comprising a conductive layer used to form a power rail (110, 210, 411, 421, 530); and a first connection area (CP1, 414) and a second connection area (CP2, 415) respectively disposed on two terminals (S1, S2) of the power rail (110, 210, 411, 421, 530); characterized in that the layout structure further comprises: at least one external conductive wire (EL1, EL2, EL3, EL4) electrically connected between the first connection area (CP1, 414) and the second connection area (CP2, 415) and coupled with the power rail (110, 210, 411, 421, 530) in parallel; and at least one relay connection area (311, 321, 331, 341, 413, 423), the at least one relay connection area (311, 321, 331, 341, 413, 423) being disposed on the power rail (110, 210, 411, 421, 530) and disposed between the first connection area (CP1, 414) and the second connection area (CP2, 415), the at least one external conductive wire (EL1, EL2, EL3, EL4) comprising a plurality of external sub conductive wires (EL11-EL15, EL21-EL25), wherein the external sub conductive wires (EL11-EL15, EL21-EL25) of a first portion are electrically connected between the at least one relay connection area (311, 321, 331, 341, 413, 423) and the first connection area (CP1, 414); the external sub conductive wires (EL11-EL15, EL21-EL25) of a second portion are electrically connected between the at least one relay connection area (311, 321, 331, 341, 413, 423) and the second connection area (CP2, 415), and wherein the at least one relay connection area (311, 321, 331, 341, 413, 423) comprises a plurality of relay solder joints (MP11-MP14, MP21-MP24, MP31-MP34, MP41-MP44), the relay solder joints (MP11-MP14, MP21-MP24, MP31-MP34, MP41-MP44) being in contact with each other and used to electrically connect the external sub conductive wires (EL11-EL15, EL21-EL25). a conductive layer used to form a power rail (110, 210, 411, 421, 530); and a first connection area (CP1, 414) and a second connection area (CP2, 415) respectively disposed on two terminals (S1, S2) of the power rail (110, 210, 411, 421, 530); at least one external conductive wire (EL1, EL2, EL3, EL4) electrically connected between the first connection area (CP1, 414) and the second connection area (CP2, 415) and coupled with the power rail (110, 210, 411, 421, 530) in parallel; and at least one relay connection area (311, 321, 331, 341, 413, 423), the at least one relay connection area (311, 321, 331, 341, 413, 423) being disposed on the power rail (110, 210, 411, 421, 530) and disposed between the first connection area (CP1, 414) and the second connection area (CP2, 415), the at least one external conductive wire (EL1, EL2, EL3, EL4) comprising a plurality of external sub conductive wires (EL11-EL15, EL21-EL25), wherein the external sub conductive wires (EL11-EL15, EL21-EL25) of a first portion are electrically connected between the at least one relay connection area (311, 321, 331, 341, 413, 423) and the first connection area (CP1, 414); the external sub conductive wires (EL11-EL15, EL21-EL25) of a second portion are electrically connected between the at least one relay connection area (311, 321, 331, 341, 413, 423) and the second connection area (CP2, 415), and wherein the at least one relay connection area (311, 321, 331, 341, 413, 423) comprises a plurality of relay solder joints (MP11-MP14, MP21-MP24, MP31-MP34, MP41-MP44), the relay solder joints (MP11-MP14, MP21-MP24, MP31-MP34, MP41-MP44) being in contact with each other and used to electrically connect the external sub conductive wires (EL11-EL15, EL21-EL25).