An optical module (1A, 1B) which is manufactured from a substrate product having a support substrate and a semiconductor layer disposed on one surface of the support substrate via an insulating layer, the optical module comprising: the support substrate and the semiconductor layer disposed on one surface of the support substrate via the insulating layer; a movable mirror which includes a portion of the semiconductor layer, and in which a mirror surface is formed on a side face intersecting with a predetermined direction, the movable mirror is movable in the predetermined direction along the one surface by the insulating layer between the portion of the semiconductor layer and the support substrate having been eliminated; an optical semiconductor element, which is a light receiving element or a light emitting element, which is provided on the one surface of the support substrate, and is optically coupled to the mirror surface of the movable mirror, an element mounting part (26, 54) including a portion of the semiconductor layer, on which the optical semiconductor element is mounted, characterized by further comprising: a cap member which is provided on the one surface of the support substrate, the cap member airtight-seals the movable mirror and the optical semiconductor element; an element electrode part which is provided through the support substrate and the insulating layer, and is electrically connected to the optical semiconductor element; wherein an end of the element electrode part is in contact with the portion of the semiconductor layer in the element mounting part, and wherein a mirror surface is formed on a surface of a portion of the element mounting part which faces the movable mirror, wherein the mirror surface is inclined to the one surface of the support substrate such that the optical semiconductor element is optically coupled to the mirror surface of the movable mirror. the support substrate and the semiconductor layer disposed on one surface of the support substrate via the insulating layer; a movable mirror which includes a portion of the semiconductor layer, and in which a mirror surface is formed on a side face intersecting with a predetermined direction, the movable mirror is movable in the predetermined direction along the one surface by the insulating layer between the portion of the semiconductor layer and the support substrate having been eliminated; an optical semiconductor element, which is a light receiving element or a light emitting element, which is provided on the one surface of the support substrate, and is optically coupled to the mirror surface of the movable mirror, an element mounting part (26, 54) including a portion of the semiconductor layer, on which the optical semiconductor element is mounted, characterized by further comprising: a cap member which is provided on the one surface of the support substrate, the cap member airtight-seals the movable mirror and the optical semiconductor element; an element electrode part which is provided through the support substrate and the insulating layer, and is electrically connected to the optical semiconductor element; a cap member which is provided on the one surface of the support substrate, the cap member airtight-seals the movable mirror and the optical semiconductor element; an element electrode part which is provided through the support substrate and the insulating layer, and is electrically connected to the optical semiconductor element; wherein an end of the element electrode part is in contact with the portion of the semiconductor layer in the element mounting part, and wherein a mirror surface is formed on a surface of a portion of the element mounting part which faces the movable mirror, wherein the mirror surface is inclined to the one surface of the support substrate such that the optical semiconductor element is optically coupled to the mirror surface of the movable mirror.