A chip package assembly comprising: a housing that includes a first stepped terrace, wherein the first stepped terrace includes a sequence of steps (114-1, 114-2,... 114-N) in a vertical direction, wherein each step after a first step in the sequence of steps is offset in a horizontal direction by a first offset value (120-1, 120-2...) from an immediately preceding step in the sequence of steps; and a set of semiconductor dies (210-1, 210-2,...210-N), wherein the housing is configured to mate with the set of semiconductor dies such that the semiconductor dies are arranged in a stack in the vertical direction, which is substantially perpendicular to a first semiconductor die in the vertical stack, wherein each semiconductor die, after the first semiconductor die, is offset in the horizontal direction by a second offset value (214-1, 214-2...) from an immediately preceding semiconductor die in the vertical stack, thereby defining a second stepped terrace at one side of the vertical stack, and wherein each semiconductor die comprises a solder pad on a surface of the semiconductor die that is parallel to the horizontal direction and is on the second stepped terrace, and a ramp component comprising solder pads corresponding to solder pads of the semiconductor dies, wherein the ramp component is rigidly mechanically coupled to the semiconductor dies by means of solder balls coupling the solder pads of the dies to the solder pads of the ramp component and the ramp component is on one side of the vertical stack, and the ramp component is approximately parallel to a direction along the second stepped terrace, which is between the horizontal direction and the vertical direction. a housing that includes a first stepped terrace, wherein the first stepped terrace includes a sequence of steps (114-1, 114-2,... 114-N) in a vertical direction, wherein each step after a first step in the sequence of steps is offset in a horizontal direction by a first offset value (120-1, 120-2...) from an immediately preceding step in the sequence of steps; and a set of semiconductor dies (210-1, 210-2,...210-N), wherein the housing is configured to mate with the set of semiconductor dies such that the semiconductor dies are arranged in a stack in the vertical direction, which is substantially perpendicular to a first semiconductor die in the vertical stack, wherein each semiconductor die, after the first semiconductor die, is offset in the horizontal direction by a second offset value (214-1, 214-2...) from an immediately preceding semiconductor die in the vertical stack, thereby defining a second stepped terrace at one side of the vertical stack, and wherein each semiconductor die comprises a solder pad on a surface of the semiconductor die that is parallel to the horizontal direction and is on the second stepped terrace, and wherein the housing is configured to mate with the set of semiconductor dies such that the semiconductor dies are arranged in a stack in the vertical direction, which is substantially perpendicular to a first semiconductor die in the vertical stack, wherein each semiconductor die, after the first semiconductor die, is offset in the horizontal direction by a second offset value (214-1, 214-2...) from an immediately preceding semiconductor die in the vertical stack, thereby defining a second stepped terrace at one side of the vertical stack, and wherein each semiconductor die comprises a solder pad on a surface of the semiconductor die that is parallel to the horizontal direction and is on the second stepped terrace, and a ramp component comprising solder pads corresponding to solder pads of the semiconductor dies, wherein the ramp component is rigidly mechanically coupled to the semiconductor dies by means of solder balls coupling the solder pads of the dies to the solder pads of the ramp component and the ramp component is on one side of the vertical stack, and the ramp component is approximately parallel to a direction along the second stepped terrace, which is between the horizontal direction and the vertical direction.