A photonic interconnect comprising: a substrate; a plurality of first waveguides disposed on a surface of the substrate and configured to perform on-chip photonic communication between optoelectronic converters disposed on the surface of the substrate; a plurality of second waveguides (310,620) disposed on the surface of the substrate and configured to provide off-chip photonic communication to at least one external computer system component located outside of the photonic interconnect; a first source disposed on the surface of the substrate and coupled to a first end of each of the first waveguides; a second source disposed on the surface of the substrate and coupled to a second end of each of the first waveguides; and at least one optoelectronic converter disposed on the surface of the substrate, the at least one optoelectronic converter photonically coupled to a portion of the plurality of first waveguides and a portion of the plurality of second waveguides (310,620) and in electronic communication with at least one external computer system component located outside of the photonic interconnect, characterized in that the at least one optoelectronic converter is further configured to: encode information generated by the at least one external computer system component in unmodulated electromagnetic radiation generated by the first and second sources (702, 704); and convert modulated electromagnetic radiation into electrical signals that are processable by the at least one computer system component located outside of the photonic interconnect. a substrate; a plurality of first waveguides disposed on a surface of the substrate and configured to perform on-chip photonic communication between optoelectronic converters disposed on the surface of the substrate; a plurality of second waveguides (310,620) disposed on the surface of the substrate and configured to provide off-chip photonic communication to at least one external computer system component located outside of the photonic interconnect; a first source disposed on the surface of the substrate and coupled to a first end of each of the first waveguides; a second source disposed on the surface of the substrate and coupled to a second end of each of the first waveguides; and at least one optoelectronic converter disposed on the surface of the substrate, the at least one optoelectronic converter photonically coupled to a portion of the plurality of first waveguides and a portion of the plurality of second waveguides (310,620) and in electronic communication with at least one external computer system component located outside of the photonic interconnect, characterized in that the at least one optoelectronic converter is further configured to: encode information generated by the at least one external computer system component in unmodulated electromagnetic radiation generated by the first and second sources (702, 704); and convert modulated electromagnetic radiation into electrical signals that are processable by the at least one computer system component located outside of the photonic interconnect. encode information generated by the at least one external computer system component in unmodulated electromagnetic radiation generated by the first and second sources (702, 704); and convert modulated electromagnetic radiation into electrical signals that are processable by the at least one computer system component located outside of the photonic interconnect.