A method of providing a MEMS device comprising a through-hole in a layer of structural material using a multitude of MEMS method steps, wherein an intermediate product is subjected to a plurality of MEMS method steps, said intermediate product - defining a first main side and a second main side, and - at least initially comprising a substrate body having a recess at the first main side, said recess comprising a bottom section and a top section relatively far from the second main side, wherein the bottom section is a recess section that is closest to the second main side, and the top section is a section of the recess closest to the first main side; wherein the method steps comprise the steps of - providing the first main side of the intermediate substrate with a polymeric layer of positive photoresist, said polymeric layer having an outer surface facing away from the body and an inner surface facing the body, - exposing the polymeric layer of positive photoresist in a direction from the outer surface of the positive photoresist towards the body of the intermediate substrate to light resulting in an exposed layer of positive photoresist comprising - relatively strongly depolymerized positive photoresist in the top section of the recess while leaving - relatively less strongly depolymerized positive photoresist in the bottom section of the recess; - removing the relatively strongly depolymerized positive photoresist while leaving the relatively less strongly depolymerized positive photoresist in bottom section of the recess of the body so as to provide a protected area; - providing structural material at the first main side up to the protected area; - selectively etching at the protected area to clear the through-hole in the structural material. - defining a first main side and a second main side, and - at least initially comprising a substrate body having a recess at the first main side, said recess comprising a bottom section and a top section relatively far from the second main side, wherein the bottom section is a recess section that is closest to the second main side, and the top section is a section of the recess closest to the first main side; - providing the first main side of the intermediate substrate with a polymeric layer of positive photoresist, said polymeric layer having an outer surface facing away from the body and an inner surface facing the body, - exposing the polymeric layer of positive photoresist in a direction from the outer surface of the positive photoresist towards the body of the intermediate substrate to light resulting in an exposed layer of positive photoresist comprising - relatively strongly depolymerized positive photoresist in the top section of the recess while leaving - relatively less strongly depolymerized positive photoresist in the bottom section of the recess; - relatively strongly depolymerized positive photoresist in the top section of the recess while leaving - relatively less strongly depolymerized positive photoresist in the bottom section of the recess; - removing the relatively strongly depolymerized positive photoresist while leaving the relatively less strongly depolymerized positive photoresist in bottom section of the recess of the body so as to provide a protected area; - providing structural material at the first main side up to the protected area; - selectively etching at the protected area to clear the through-hole in the structural material.