An electronic device, comprising: a substrate comprising a first surface and a second surface opposite to each other; a thin film circuit disposed on the first surface of the substrate, wherein the thin film circuit comprises at least one thin film transistor (221a, 221b) and at least one conductive trace; at least one first connection pad disposed on the first surface of the substrate, wherein the first connection pad is electrically connected with the thin film transistor (221a, 221b) through the conductive trace; a driving circuit board comprising at least one second connection pad, wherein the second surface of the substrate is disposed on the driving circuit board, and the second connection pad is adjacent to and corresponding to the first connection pad; and a conductive member (11, 11') covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member (11, 11'); wherein the conductive member (11, 11') is disposed on the first surface side of the substrate, wherein a plurality of the substrates are disposed with their second surface on the driving circuit board in an array, each of the substrates comprises a plurality of the thin film circuits on their first surface and a plurality of the first connection pads on their first surface, each of the thin film circuits is electrically connected with corresponding ones of the first connection pads through the conductive traces, wherein the driving circuit board comprises a plurality of the second connection pads adjacent to and corresponding to the first connection pads, wherein a plurality of the conductive members (11, 11') covering at least a part of the second connection pads and the first connection pads are formed, wherein the conductive members (11, 11') are disposed on the first surface side of the substrates, and wherein one of the first connection pads corresponding to one of the thin film circuits and one of the second connection pads of the driving circuit board are electrically connected through one of the conductive members (11, 11'), and two of the thin film circuits disposed on adjacent two of the substrates are electrically connected through connection among two of the first connection pads, at least one of the second connection pads corresponding to the two first connection pads, and one or two of the conductive members (11, 11') corresponding to the two first connection pads. a substrate comprising a first surface and a second surface opposite to each other; a thin film circuit disposed on the first surface of the substrate, wherein the thin film circuit comprises at least one thin film transistor (221a, 221b) and at least one conductive trace; at least one first connection pad disposed on the first surface of the substrate, wherein the first connection pad is electrically connected with the thin film transistor (221a, 221b) through the conductive trace; a driving circuit board comprising at least one second connection pad, wherein the second surface of the substrate is disposed on the driving circuit board, and the second connection pad is adjacent to and corresponding to the first connection pad; and a conductive member (11, 11') covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member (11, 11'); wherein the conductive member (11, 11') is disposed on the first surface side of the substrate, wherein a plurality of the substrates are disposed with their second surface on the driving circuit board in an array, each of the substrates comprises a plurality of the thin film circuits on their first surface and a plurality of the first connection pads on their first surface, each of the thin film circuits is electrically connected with corresponding ones of the first connection pads through the conductive traces, wherein the driving circuit board comprises a plurality of the second connection pads adjacent to and corresponding to the first connection pads, wherein a plurality of the conductive members (11, 11') covering at least a part of the second connection pads and the first connection pads are formed, wherein the conductive members (11, 11') are disposed on the first surface side of the substrates, and wherein one of the first connection pads corresponding to one of the thin film circuits and one of the second connection pads of the driving circuit board are electrically connected through one of the conductive members (11, 11'), and two of the thin film circuits disposed on adjacent two of the substrates are electrically connected through connection among two of the first connection pads, at least one of the second connection pads corresponding to the two first connection pads, and one or two of the conductive members (11, 11') corresponding to the two first connection pads.