An infrared imaging element, comprising: - a first substrate, comprising: - a supporting leg wiring, - a metal layer provided on the supporting leg wiring; and - an infrared detection part formed of a BOX oxide film and an insulating film and the infrared detection part held on the supporting leg wiring and provided with a diode electrically connected to the metal layer through the supporting leg wiring, and - a second substrate, comprising: - a substrate having a front surface and a back surface and provided with a circuit part; and - an insulating film which is formed on the circuit part, and a wiring portion electrically connected to the circuit part is provided in the insulating film and connected to a metal layer, wherein the metal layer of the first substrate and the metal layer of the second substrate are electrically connected via micro bump bonding such that the front surfaces of the first substrate and the second substrate face each other, and - the infrared imaging element detecting a temperature change of the infrared detection part as a change of an electrical signal of the diode by the circuit part, wherein - the substrate, the supporting leg wiring, and the infrared detection part are stacked in a direction perpendicular to the front surface of the substrate at an interval therebetween, - the supporting leg wiring is disposed above the front surface of the substrate, - the supporting leg wiring has one end connected to the metal layer which is micro bump bonded on the metal layer provided on the front surface of the substrate and another end connected to a metal wiring provided on the infrared detection part, characterised in that: - another metal wiring, is also provided immediately above the portion of the supporting leg wiring connected to the metal layer, and a micro bump bonding strength reinforcing beam having the same structure as the infrared detecting part formed by separating a portion of the infrared detection part is provided thereon, increasing the bonding strength of the micro bump. - a first substrate, comprising: - a supporting leg wiring, - a metal layer provided on the supporting leg wiring; and - an infrared detection part formed of a BOX oxide film and an insulating film and the infrared detection part held on the supporting leg wiring and provided with a diode electrically connected to the metal layer through the supporting leg wiring, and - a second substrate, comprising: - a substrate having a front surface and a back surface and provided with a circuit part; and - an insulating film which is formed on the circuit part, and a wiring portion electrically connected to the circuit part is provided in the insulating film and connected to a metal layer, wherein the metal layer of the first substrate and the metal layer of the second substrate are electrically connected via micro bump bonding such that the front surfaces of the first substrate and the second substrate face each other, and - the infrared imaging element detecting a temperature change of the infrared detection part as a change of an electrical signal of the diode by the circuit part, wherein - a substrate having a front surface and a back surface and provided with a circuit part; and - an insulating film which is formed on the circuit part, and a wiring portion electrically connected to the circuit part is provided in the insulating film and connected to a metal layer, wherein the metal layer of the first substrate and the metal layer of the second substrate are electrically connected via micro bump bonding such that the front surfaces of the first substrate and the second substrate face each other, and - the infrared imaging element detecting a temperature change of the infrared detection part as a change of an electrical signal of the diode by the circuit part, wherein - the substrate, the supporting leg wiring, and the infrared detection part are stacked in a direction perpendicular to the front surface of the substrate at an interval therebetween, - the supporting leg wiring is disposed above the front surface of the substrate, - the supporting leg wiring has one end connected to the metal layer which is micro bump bonded on the metal layer provided on the front surface of the substrate and another end connected to a metal wiring provided on the infrared detection part, - another metal wiring, is also provided immediately above the portion of the supporting leg wiring connected to the metal layer, and a micro bump bonding strength reinforcing beam having the same structure as the infrared detecting part formed by separating a portion of the infrared detection part is provided thereon, increasing the bonding strength of the micro bump.