A hybrid integrated module, comprising: a semiconductor die having a top surface; an adhesive mechanically coupled to the top surface of the semiconductor die; and an integrated device, wherein the integrated device includes: a semiconductor layer having a top surface, a bottom surface and a thickness, wherein the top surface of the semiconductor layer is mechanically coupled to the adhesive, and wherein the semiconductor layer includes an optical waveguide configured to convey an optical signal; coupling pads arranged on the top surface of the semiconductor die; coupling pads arranged on the top surface of the semiconductor layer; solder balls electrically coupling the pads on the top surface of the semiconductor die and the pads on the top surface of the semiconductor layer, wherein the adhesive at least in part fills a space between the top surface of the semiconductor die and the top surface of the semiconductor layer; an oxide layer having a top surface, a bottom surface and a thickness, wherein the top surface of the oxide layer is disposed on the bottom surface of the semiconductor layer; and an optical device disposed on the bottom surface of the oxide layer, wherein the thickness of the semiconductor layer and the thickness of the oxide layer are defined so that the optical signal is evanescently coupled between the optical waveguide and the optical device. a semiconductor die having a top surface; an adhesive mechanically coupled to the top surface of the semiconductor die; and an integrated device, wherein the integrated device includes: a semiconductor layer having a top surface, a bottom surface and a thickness, wherein the top surface of the semiconductor layer is mechanically coupled to the adhesive, and wherein the semiconductor layer includes an optical waveguide configured to convey an optical signal; coupling pads arranged on the top surface of the semiconductor die; coupling pads arranged on the top surface of the semiconductor layer; solder balls electrically coupling the pads on the top surface of the semiconductor die and the pads on the top surface of the semiconductor layer, wherein the adhesive at least in part fills a space between the top surface of the semiconductor die and the top surface of the semiconductor layer; an oxide layer having a top surface, a bottom surface and a thickness, wherein the top surface of the oxide layer is disposed on the bottom surface of the semiconductor layer; and an optical device disposed on the bottom surface of the oxide layer, wherein the thickness of the semiconductor layer and the thickness of the oxide layer are defined so that the optical signal is evanescently coupled between the optical waveguide and the optical device. a semiconductor layer having a top surface, a bottom surface and a thickness, wherein the top surface of the semiconductor layer is mechanically coupled to the adhesive, and wherein the semiconductor layer includes an optical waveguide configured to convey an optical signal; coupling pads arranged on the top surface of the semiconductor die; coupling pads arranged on the top surface of the semiconductor layer; solder balls electrically coupling the pads on the top surface of the semiconductor die and the pads on the top surface of the semiconductor layer, wherein the adhesive at least in part fills a space between the top surface of the semiconductor die and the top surface of the semiconductor layer; an oxide layer having a top surface, a bottom surface and a thickness, wherein the top surface of the oxide layer is disposed on the bottom surface of the semiconductor layer; and an optical device disposed on the bottom surface of the oxide layer, wherein the thickness of the semiconductor layer and the thickness of the oxide layer are defined so that the optical signal is evanescently coupled between the optical waveguide and the optical device.