A manufacturing method for a printed circuit board with an insulated micro radiator, the method comprising the following steps: Step A210: providing a high thermal conductivity electrical insulating substrate of which top and bottom surfaces are both clad with copper foils, and cutting the electrical insulating substrate into one or a number of cylindrical insulated micro radiators, of which top and bottom surfaces are both clad with copper foils, according to the predetermined size; Step A220: providing N(N> 1) layers copper clad laminates with one or two surfaces clad with copper foils and (N-1) layers prepregs; cutting them into working panels of the PCB according to predetermined size, and making inner-layer circuits of the PCB on the corresponding copper foils of the copper clad laminates, with adoption of the conventional image transferring method for a PCB copper pattern; Step A230: at the corresponding locations of the copper clad laminates and the prepregs, according to the size of the insulated micro radiators obtained in Step A210, through the adoption of drilling, milling or punching, installation holes of the insulated micro radiator are made, and the shape and size of the installation holes and those of the insulated micro radiators are in one-to-one correspondence; Step A240: alternately laying up the copper clad laminates and the prepregs with the conventional multi-layer PCB laying up method; making two copper clad laminates to be located at the top and the bottom layers respectively, the copper clad laminates located at top and bottom layers are required to be copper foil surfaces outwards to the PCB, and plugging the insulated micro radiators into corresponding installation holes; Step A250: pressing the copper clad laminates and the prepregs together with the standard pressing method of the conventional multi-layer PCB; Step A260: according to the manufacturing method of a conventional PCB, carrying out hole drilling, Plated Through Hole plating, outer-layer image transferring, solder resist printing, surface finishing, outline fabrication for laminated working panels and soldering heating components on top copper patterns of the insulated micro radiators. Step A210: providing a high thermal conductivity electrical insulating substrate of which top and bottom surfaces are both clad with copper foils, and cutting the electrical insulating substrate into one or a number of cylindrical insulated micro radiators, of which top and bottom surfaces are both clad with copper foils, according to the predetermined size; Step A220: providing N(N> 1) layers copper clad laminates with one or two surfaces clad with copper foils and (N-1) layers prepregs; cutting them into working panels of the PCB according to predetermined size, and making inner-layer circuits of the PCB on the corresponding copper foils of the copper clad laminates, with adoption of the conventional image transferring method for a PCB copper pattern; Step A230: at the corresponding locations of the copper clad laminates and the prepregs, according to the size of the insulated micro radiators obtained in Step A210, through the adoption of drilling, milling or punching, installation holes of the insulated micro radiator are made, and the shape and size of the installation holes and those of the insulated micro radiators are in one-to-one correspondence; Step A240: alternately laying up the copper clad laminates and the prepregs with the conventional multi-layer PCB laying up method; making two copper clad laminates to be located at the top and the bottom layers respectively, the copper clad laminates located at top and bottom layers are required to be copper foil surfaces outwards to the PCB, and plugging the insulated micro radiators into corresponding installation holes; Step A250: pressing the copper clad laminates and the prepregs together with the standard pressing method of the conventional multi-layer PCB; Step A260: according to the manufacturing method of a conventional PCB, carrying out hole drilling, Plated Through Hole plating, outer-layer image transferring, solder resist printing, surface finishing, outline fabrication for laminated working panels and soldering heating components on top copper patterns of the insulated micro radiators.