A display device comprising: subpixels (SPn) on a first substrate, each subpixel comprising: an emission area comprising an organic light emitting diode (OLED) configured to emit light; and a circuit area comprising a circuit configured to drive the organic light emitting diode (OLED); a source drain metal layer (VREF_SD) constituting a sensing line (VREF) between the subpixels having a first direction; and a first electrode layer (VREFC_E1) constituting a sensing connection line (VREFC) in the circuit area having a second direction, wherein the second direction is transverse to the first direction, the sensing connection line (VREFC) above the sensing line (VREF), wherein the sensing connection line is configured to electrically connect the subpixels to the sensing line, wherein the circuit area further comprises transistors, the transistors each comprising a source electrode and a drain electrode, the source electrodes, drain electrodes and the sensing line being formed in the source drain metal layer (VREF_SD), the transistors comprising a sensing transistor and a driving transistor, the sensing transistor being connected between the sensing line (VREF) and a sensing node electrically coupled to both a source electrode of the driving transistor and to an anode electrode of the organic light emitting diode (OLED) of a subpixel (SPn), wherein the circuit area further comprises at least one scan line (GL1b) disposed in a layer between the source drain metal layer (VREF_SD) and the first substrate, the at least one scan line (GL1b) arranged to receive a scan signal from a scan driver, wherein each subpixel comprises two insulating layers (PAS, OC), the insulating layers being positioned between the source drain metal layer (VREF_SD) and the first electrode layer (VREFC_E1), and wherein the sensing connection line (VREFC) at least partially overlaps a scan line of the at least one scan line (GL1b) having said two insulating layers (PAS, OC) provided therebetween. subpixels (SPn) on a first substrate, each subpixel comprising: an emission area comprising an organic light emitting diode (OLED) configured to emit light; and a circuit area comprising a circuit configured to drive the organic light emitting diode (OLED); an emission area comprising an organic light emitting diode (OLED) configured to emit light; and a circuit area comprising a circuit configured to drive the organic light emitting diode (OLED); a source drain metal layer (VREF_SD) constituting a sensing line (VREF) between the subpixels having a first direction; and a first electrode layer (VREFC_E1) constituting a sensing connection line (VREFC) in the circuit area having a second direction, wherein the second direction is transverse to the first direction, the sensing connection line (VREFC) above the sensing line (VREF), wherein the sensing connection line is configured to electrically connect the subpixels to the sensing line, wherein the circuit area further comprises transistors, the transistors each comprising a source electrode and a drain electrode, the source electrodes, drain electrodes and the sensing line being formed in the source drain metal layer (VREF_SD), the transistors comprising a sensing transistor and a driving transistor, the sensing transistor being connected between the sensing line (VREF) and a sensing node electrically coupled to both a source electrode of the driving transistor and to an anode electrode of the organic light emitting diode (OLED) of a subpixel (SPn), wherein the circuit area further comprises at least one scan line (GL1b) disposed in a layer between the source drain metal layer (VREF_SD) and the first substrate, the at least one scan line (GL1b) arranged to receive a scan signal from a scan driver, wherein each subpixel comprises two insulating layers (PAS, OC), the insulating layers being positioned between the source drain metal layer (VREF_SD) and the first electrode layer (VREFC_E1), and wherein the sensing connection line (VREFC) at least partially overlaps a scan line of the at least one scan line (GL1b) having said two insulating layers (PAS, OC) provided therebetween.