An LED lighting device comprising: an LED module; a thermal base coupled with the LED module and configured to absorb heat; and a heat-pipe loop formed in a tubule shape and having working fluid injected thereinto and comprising a heat-absorption portion coupled with the thermal base and configured to absorb heat and a heat-dissipating portion configured to dissipate the heat absorbed by the heat-absorption portion, wherein each coil of the heat-pipe loop is formed in a thin and long shape such that a length of the each coil is greater than a width of the each coil, and one end of the thin-and-long coil is coupled to the thermal base, and the other end of the thin-and-long coil protrudes beyond an edge of the thermal base, the thermal base is formed in a flat plate shape, the LED module is coupled to one surface of the thermal base, and the thin-and-long coil is arranged on the other surface of the thermal base such that a length direction of the thin-and-long coil is parallel to the other surface of the thermal base, thereby constituting the LED lighting device in a thin structure, the heat-pipe loop is radially arranged around the edge of the thermal base such that the heat-dissipating portion of each coil protrudes beyond the edge of the thermal base, characterized in that the LED lighting device further comprises: a rear-face cover disposed on the rear face of the LED lighting device so as to cover the heat-pipe loop, and having a first ventilation hole formed therein; and a front-face cover disposed on the front face of the LED lighting device so as to cover the heat-pipe loop, and having a second ventilation hole formed therein, and wherein the first ventilation hole and the second ventilation hole are disposed to face each other. an LED module; a thermal base coupled with the LED module and configured to absorb heat; and a heat-pipe loop formed in a tubule shape and having working fluid injected thereinto and comprising a heat-absorption portion coupled with the thermal base and configured to absorb heat and a heat-dissipating portion configured to dissipate the heat absorbed by the heat-absorption portion, wherein each coil of the heat-pipe loop is formed in a thin and long shape such that a length of the each coil is greater than a width of the each coil, and one end of the thin-and-long coil is coupled to the thermal base, and the other end of the thin-and-long coil protrudes beyond an edge of the thermal base, the thermal base is formed in a flat plate shape, the LED module is coupled to one surface of the thermal base, and the thin-and-long coil is arranged on the other surface of the thermal base such that a length direction of the thin-and-long coil is parallel to the other surface of the thermal base, thereby constituting the LED lighting device in a thin structure, the heat-pipe loop is radially arranged around the edge of the thermal base such that the heat-dissipating portion of each coil protrudes beyond the edge of the thermal base, characterized in that the LED lighting device further comprises: a rear-face cover disposed on the rear face of the LED lighting device so as to cover the heat-pipe loop, and having a first ventilation hole formed therein; and a front-face cover disposed on the front face of the LED lighting device so as to cover the heat-pipe loop, and having a second ventilation hole formed therein, and wherein the first ventilation hole and the second ventilation hole are disposed to face each other.