A solid state light emitter package (200, 300, 400, 450, 500, 550) comprising - a solid state light emitter die (230, 330, 480), - a first lead frame (210, 410, 460, 560) and a second lead frame (220, 520) being electrically isolated from the first lead frame (210, 410, 460, 560), said lead frames (210, 410, 460, 560, 220, 520) are for receiving power from an external power source and are arranged to provide received power to the solid state light emitter die (230, 330, 480), the solid state light emitter die (230, 330, 480) being at least partially provided on the first lead frame (210, 410, 460, 560), - an electrical insulating material (242, 244, 342, 344, 492, 494, 542, 544, 592, 594), - a thermal element (250, 448, 498, 548, 598) being arranged in between the first lead frame (210, 410, 460, 560) and the second lead frame (220, 520) and being electrically isolated by the electrical insulating material (242, 244, 342, 344, 492, 494, 542, 544, 592, 594) from the first lead frame (210, 410, 460, 560) and from the second lead frame (220, 520) and the thermal element (250, 448, 498, 548, 598) being at least one of a heat absorber or a heat spreader, and - a bridging element (260, 330) bridging the electrical insulating material (242, 244, 342, 344, 492, 494, 542, 544, 592, 594) and the thermal element (250, 448, 498, 548, 598) in between the first lead frame (210, 410, 460, 560) and the second lead frame (220, 520) and the bridging element (260, 330) is for obtaining an electrical connection between the solid state light emitter die (230, 330, 480) and the second lead frame (220, 520) - characterized in the thermal element (250, 448, 498, 548, 598) not being in direct thermal contact with a solid state light emitter die, and, seen in a virtual plane that follows top surfaces of the first lead frame (210, 410, 460, 560) and the second lead frame (220, 520), the thermal element (250, 448, 498, 548, 598) at least partially encloses the first lead frame (210, 410, 460, 560) or the second lead frame (220, 520) to delay heat transfer between the first lead frame (210, 410, 460, 560) and the second lead frame (220, 520). - a solid state light emitter die (230, 330, 480), - a first lead frame (210, 410, 460, 560) and a second lead frame (220, 520) being electrically isolated from the first lead frame (210, 410, 460, 560), said lead frames (210, 410, 460, 560, 220, 520) are for receiving power from an external power source and are arranged to provide received power to the solid state light emitter die (230, 330, 480), the solid state light emitter die (230, 330, 480) being at least partially provided on the first lead frame (210, 410, 460, 560), - an electrical insulating material (242, 244, 342, 344, 492, 494, 542, 544, 592, 594), - a thermal element (250, 448, 498, 548, 598) being arranged in between the first lead frame (210, 410, 460, 560) and the second lead frame (220, 520) and being electrically isolated by the electrical insulating material (242, 244, 342, 344, 492, 494, 542, 544, 592, 594) from the first lead frame (210, 410, 460, 560) and from the second lead frame (220, 520) and the thermal element (250, 448, 498, 548, 598) being at least one of a heat absorber or a heat spreader, and - a bridging element (260, 330) bridging the electrical insulating material (242, 244, 342, 344, 492, 494, 542, 544, 592, 594) and the thermal element (250, 448, 498, 548, 598) in between the first lead frame (210, 410, 460, 560) and the second lead frame (220, 520) and the bridging element (260, 330) is for obtaining an electrical connection between the solid state light emitter die (230, 330, 480) and the second lead frame (220, 520) - characterized in the thermal element (250, 448, 498, 548, 598) not being in direct thermal contact with a solid state light emitter die, and, seen in a virtual plane that follows top surfaces of the first lead frame (210, 410, 460, 560) and the second lead frame (220, 520), the thermal element (250, 448, 498, 548, 598) at least partially encloses the first lead frame (210, 410, 460, 560) or the second lead frame (220, 520) to delay heat transfer between the first lead frame (210, 410, 460, 560) and the second lead frame (220, 520).