An organic light emitting diode, comprising: a substrate; an organic light emitting part in which a first electrode, an organic material layer, and a second electrode are sequentially laminated on the substrate; and a sealing part covering an outside of the organic light emitting part of the substrate, wherein the sealing part includes a printed circuit board including a base and a metal pattern formed at an edge of one side of the base; an anisotropic conductive film, which bonds the printed circuit board and the substrate to each other and is disposed at a border of the printed circuit board on two opposite sides; and a sealing layer, extending between said opposite sides of the anisotropic conductive film and filling the entire space between the printed circuit board and the outside of the organic emitting part, wherein the metal pattern includes a first metal pattern formed at an edge of one side of the base, and a second metal pattern spaced apart from the first metal pattern and formed at an edge of one side of the base, the first metal pattern electrically connects the first electrode and an external power source, the second metal pattern electrically connects the second electrode and the external power source, and wherein a metal plate which is not connected with the first metal pattern and the second metal pattern is included on one side of the base, and the metal plate is provided on a light emitting area of the organic light emitting part, and characterized in that the printed circuit board includes an insulating layer provided on at least one of between the first metal pattern and the second metal pattern, and on the first metal pattern and the second metal pattern. a substrate; an organic light emitting part in which a first electrode, an organic material layer, and a second electrode are sequentially laminated on the substrate; and a sealing part covering an outside of the organic light emitting part of the substrate, wherein the sealing part includes a printed circuit board including a base and a metal pattern formed at an edge of one side of the base; an anisotropic conductive film, which bonds the printed circuit board and the substrate to each other and is disposed at a border of the printed circuit board on two opposite sides; and a sealing layer, extending between said opposite sides of the anisotropic conductive film and filling the entire space between the printed circuit board and the outside of the organic emitting part, wherein the metal pattern includes a first metal pattern formed at an edge of one side of the base, and a second metal pattern spaced apart from the first metal pattern and formed at an edge of one side of the base, the first metal pattern electrically connects the first electrode and an external power source, the second metal pattern electrically connects the second electrode and the external power source, and wherein a metal plate which is not connected with the first metal pattern and the second metal pattern is included on one side of the base, and the metal plate is provided on a light emitting area of the organic light emitting part, and characterized in that the printed circuit board includes an insulating layer provided on at least one of between the first metal pattern and the second metal pattern, and on the first metal pattern and the second metal pattern.