A MEMS device (21; 61; 91; 101) comprising: - a support body formed at least partially from semiconductor material; - a first cavity extending within the support body; - a membrane (26; 56; 106) including a peripheral portion, which is fixed to the support body, and a suspended portion, which extends above the first cavity; - a first deformable structure, which extends above the suspended portion of the membrane (26; 56; 106), at a distance from a central part of the suspended portion of the membrane (26; 56; 106); - a second deformable structure, which extends partially over the suspended portion of the membrane (26; 56; 106), and is laterally offset from the first deformable structure in the direction of the peripheral portion of the membrane (26; 56; 106); and - a projecting region fixed under the membrane (26; 56; 106); and wherein the second deformable structure (44; 66; 96) is deformable in an electrically controllable way so as to cause a deformation of the suspended portion of the membrane (26; 56; 106) such that the central part of the suspended portion of the membrane (26; 56; 106) is translated along a first direction; and wherein the first deformable structure (45; 68; 98) is deformable in an electrically controllable way; and wherein the first deformable structure (45; 68; 98) projects laterally relative to the projecting region towards the peripheral portion of the membrane (26; 56; 106), the projecting region projecting laterally relative to the first deformable structure (45; 68; 98) towards the central part of the suspended portion of the membrane (26; 56; 106), in such a way that said electrically controlled deformation of the first deformable structure (45; 68; 98) causes a deformation of the suspended portion of the membrane (26; 56; 106) such that the central part of the suspended portion of the membrane (26; 56; 106) is translated along a second direction, which is opposite to the first direction; and wherein the first and the second deformable structure contact a first side of the membrane, and part of the second deformable structure contacts the peripheral portion of the membrane; and wherein the projecting region contacts a second side of the membrane, the second side facing the first cavity; characterized in that the first deformable structure comprises a plurality of inner deformable regions arranged around the central part of the suspended portion of the membrane, the inner deformable regions being formed of piezoelectric material or of a corresponding pair of overlapping regions (94, 95) of materials having different thermal expansion coefficients; and wherein the second deformable structure comprises a plurality of outer deformable regions formed of piezoelectric material or of a corresponding pair of overlapping regions (92, 93) of materials having different thermal expansion coefficients; and wherein the inner deformable regions and the outer deformable regions are angularly interdigitated. - a support body formed at least partially from semiconductor material; - a first cavity extending within the support body; - a membrane (26; 56; 106) including a peripheral portion, which is fixed to the support body, and a suspended portion, which extends above the first cavity; - a first deformable structure, which extends above the suspended portion of the membrane (26; 56; 106), at a distance from a central part of the suspended portion of the membrane (26; 56; 106); - a second deformable structure, which extends partially over the suspended portion of the membrane (26; 56; 106), and is laterally offset from the first deformable structure in the direction of the peripheral portion of the membrane (26; 56; 106); and - a projecting region fixed under the membrane (26; 56; 106);