A camera module, comprising: a flexible circuit board; a chip, stacked on the flexible circuit board; an image sensor, stacked on the chip; a connection wire, wherein one end of the connection wire is connected to a wiring region of the flexible circuit board, the other end of the connection wire is connected to an interface region of a first surface of the chip, and the first surface is a surface of the chip away from the flexible circuit board; a first protective structure, arranged on the interface region of the first surface of the chip; wherein a portion of the connection wire protruding in a direction away from the first surface is located inside the first protective structure; characterized in that the first protective structure comprises: a first protective layer, arranged on the first surface of the chip, wherein the portion of the connection wire protruding in the direction away from the first surface is located inside the first protective layer; and a second protective layer, attached onto a surface of the first protective layer away from the chip, wherein a hardness of the second protective layer is larger than a hardness of the first protective layer; the camera module further comprises a second protective structure arranged in the wiring region on the flexible circuit board; a side surface of the first protective layer facing a side surface of the image sensor and a side surface of the second protective layer facing the side surface of the image sensor are located on a same surface; and a predetermined distance is provided between an orthographic projection of the first protective layer onto the chip and an orthographic projection of the image sensor onto the chip, and between an orthographic projection of the second protective layer onto the chip and the orthographic projection of the image sensor onto the chip. a flexible circuit board; a chip, stacked on the flexible circuit board; an image sensor, stacked on the chip; a connection wire, wherein one end of the connection wire is connected to a wiring region of the flexible circuit board, the other end of the connection wire is connected to an interface region of a first surface of the chip, and the first surface is a surface of the chip away from the flexible circuit board; a first protective structure, arranged on the interface region of the first surface of the chip; wherein a portion of the connection wire protruding in a direction away from the first surface is located inside the first protective structure; characterized in that the first protective structure comprises: a first protective layer, arranged on the first surface of the chip, wherein the portion of the connection wire protruding in the direction away from the first surface is located inside the first protective layer; and a second protective layer, attached onto a surface of the first protective layer away from the chip, wherein a hardness of the second protective layer is larger than a hardness of the first protective layer; the camera module further comprises a second protective structure arranged in the wiring region on the flexible circuit board; a side surface of the first protective layer facing a side surface of the image sensor and a side surface of the second protective layer facing the side surface of the image sensor are located on a same surface; and a predetermined distance is provided between an orthographic projection of the first protective layer onto the chip and an orthographic projection of the image sensor onto the chip, and between an orthographic projection of the second protective layer onto the chip and the orthographic projection of the image sensor onto the chip. a first protective layer, arranged on the first surface of the chip, wherein the portion of the connection wire protruding in the direction away from the first surface is located inside the first protective layer; and a second protective layer, attached onto a surface of the first protective layer away from the chip, wherein a hardness of the second protective layer is larger than a hardness of the first protective layer; the camera module further comprises a second protective structure arranged in the wiring region on the flexible circuit board; a side surface of the first protective layer facing a side surface of the image sensor and a side surface of the second protective layer facing the side surface of the image sensor are located on a same surface; and a predetermined distance is provided between an orthographic projection of the first protective layer onto the chip and an orthographic projection of the image sensor onto the chip, and between an orthographic projection of the second protective layer onto the chip and the orthographic projection of the image sensor onto the chip.