An active electronically scanned array having a structure for electronic components, comprising: a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings; a frame coupled to the baseplate, the frame comprising: a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums on a first side of the planar support, the planar support configured to support one or more transmit/receive integrated microwave modules on a second side of the planar support; a plurality of frame supports on the first side of the planar support, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums; a ventilated panel along one or more sides of said frame, said ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and one or more thermal interfaces on the second side of the planar support and coupled to the one or more transmit/receive integrated microwave modules configured to dissipate heat therefrom; and one or more electronic interfaces coupled to the planar support on the second side of the planar support, each electronic interface configured to electronically couple to one of the one or more transmit/receive integrated microwave modules, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces. a baseplate having a substantially planar shape, the baseplate defining one or more openings configured to allow air to flow through the openings; a frame coupled to the baseplate, the frame comprising: a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums on a first side of the planar support, the planar support configured to support one or more transmit/receive integrated microwave modules on a second side of the planar support; a plurality of frame supports on the first side of the planar support, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums; a ventilated panel along one or more sides of said frame, said ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and one or more thermal interfaces on the second side of the planar support and coupled to the one or more transmit/receive integrated microwave modules configured to dissipate heat therefrom; and a planar support, the planar support having a substantially planar shape and substantially parallel to the baseplate, the planar support and the baseplate at least partially defining one or more plenums on a first side of the planar support, the planar support configured to support one or more transmit/receive integrated microwave modules on a second side of the planar support; a plurality of frame supports on the first side of the planar support, at least one of the frame supports defining one or more channels for air flow, each of the one or more channels corresponding to one of the one or more plenums; a ventilated panel along one or more sides of said frame, said ventilated panel having a surface defining a plurality of air inlets, the air inlets configured to allow air into one of the one or more plenums; and one or more thermal interfaces on the second side of the planar support and coupled to the one or more transmit/receive integrated microwave modules configured to dissipate heat therefrom; and one or more electronic interfaces coupled to the planar support on the second side of the planar support, each electronic interface configured to electronically couple to one of the one or more transmit/receive integrated microwave modules, and at least a portion of each electronic interface coplanar with at least a portion of the one or more thermal interfaces.