A wiring board, comprising: a core board having two major surfaces (MP1, MP2) and comprising a core main body, said core board including a sub-core housing portion comprising one of (i) a through-hole penetrating both of the major surfaces of the core board and (ii) a concave portion opening at one of said surfaces of the core board, and a ceramic sub-core having a conductor pad on a main surface thereof and accommodated in the sub-core housing portion, wherein the conductor pad comprises a metal material principally comprised of a metal other than Cu, wherein the conductor pad is principally comprised of at least one metal selected from the group consisting of Ag, Pt, Au, Ni, Mo and W; a laminated wiring portion (L1, L2) located on one major surface (MP1, MP2) of the core board and comprising a plurality of dielectric layers (B11, B14, B21, B24) including a via conductor formed therein and a plurality of conductor layers alternating with said dielectric layers such that the laminated wiring portion (L1, L2) comprises alternating dielectric and conductor layers; and an overcoat layer formed on a surface of the conductor pad, wherein the overcoat layer is a plated layer comprised of Cu, a surface of the overcoat layer having a roughened face, and a said dielectric layer, of the plurality of dielectric layers (B11, B14, B21, B24) of the laminated wiring portion, which is located on the core board, and a said via conductor formed in said dielectric layer, being in electrical contact with the roughened face; wherein a lowest dielectric layer (B11, B21) of the laminated wiring portion (L1, L2) is in contact with the overcoat layer. a core board having two major surfaces (MP1, MP2) and comprising a core main body, said core board including a sub-core housing portion comprising one of (i) a through-hole penetrating both of the major surfaces of the core board and (ii) a concave portion opening at one of said surfaces of the core board, and a ceramic sub-core having a conductor pad on a main surface thereof and accommodated in the sub-core housing portion, wherein the conductor pad comprises a metal material principally comprised of a metal other than Cu, wherein the conductor pad is principally comprised of at least one metal selected from the group consisting of Ag, Pt, Au, Ni, Mo and W; a laminated wiring portion (L1, L2) located on one major surface (MP1, MP2) of the core board and comprising a plurality of dielectric layers (B11, B14, B21, B24) including a via conductor formed therein and a plurality of conductor layers alternating with said dielectric layers such that the laminated wiring portion (L1, L2) comprises alternating dielectric and conductor layers; and an overcoat layer formed on a surface of the conductor pad, wherein the overcoat layer is a plated layer comprised of Cu, a surface of the overcoat layer having a roughened face, and a said dielectric layer, of the plurality of dielectric layers (B11, B14, B21, B24) of the laminated wiring portion, which is located on the core board, and a said via conductor formed in said dielectric layer, being in electrical contact with the roughened face; wherein a lowest dielectric layer (B11, B21) of the laminated wiring portion (L1, L2) is in contact with the overcoat layer.