An organic electronic device, comprising: a substrate; an organic electronic element formed on the substrate; and an adhesive film encapsulating the organic electronic element; the adhesive film comprises a curable composition; wherein the curable composition comprises: a curable adhesive resin, a curing agent, and a high-molecular-weight resin of which a weight-average-molecular weight is 20,000 or more, and a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, wherein the high-molecular-weight resin is comprised in an amount of 30 to 100 parts by weight relative to 100 parts by weight with respect to 100 parts by weight of the curable adhesive resin, wherein the curing agent of the curable composition is an imidazole curing agent which starts to cure at a temperature in a range of 50 to 120 °C, selected from the group consisting of 2-undecylimidazole, 2-heptadecylimidazole (2-heptadecylimidazole), 2-phenylimidazole, 2-phenyl-4-methylimidazole (2-phenyl-4-methylimidazole), 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole and 2-phenylimidazoline; wherein the curable adhesive resin of the curable composition is a silane-modified epoxy resin of which a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, or wherein the curable adhesive resin of the curable composition is an epoxy resin of which a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, and wherein the curable composition further comprises a silane coupling agent between 0.01 and 1.5 parts by weight with respect to 100 parts by weight of the curable adhesive resin, and wherein the curable composition satisfies the following Expressions 1 and 2: X ≤ 1,000 ppm Y ≤ 1,000 ppm, wherein X in Equation 1 is an amount of volatile organic compounds, which is measured by preparing a film with the curable composition, maintaining 50 mg of the film sample at 150 °C for 1 hour, and using purge and trap-gas chromatography/mass spectrometry, and Y in Equation 2 is an amount of ionic substances contained in the curable composition, which is obtained by preparing a film with the curable composition, and measuring 50 mg of the film sample according to ASTM D 7359:2008. a substrate; an organic electronic element formed on the substrate; and an adhesive film encapsulating the organic electronic element; the adhesive film comprises a curable composition; wherein the curable composition comprises: a curable adhesive resin, a curing agent, and a high-molecular-weight resin of which a weight-average-molecular weight is 20,000 or more, and a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, a curable adhesive resin, a curing agent, and a high-molecular-weight resin of which a weight-average-molecular weight is 20,000 or more, and a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, wherein the high-molecular-weight resin is comprised in an amount of 30 to 100 parts by weight relative to 100 parts by weight with respect to 100 parts by weight of the curable adhesive resin, wherein the curing agent of the curable composition is an imidazole curing agent which starts to cure at a temperature in a range of 50 to 120 °C, selected from the group consisting of 2-undecylimidazole, 2-heptadecylimidazole (2-heptadecylimidazole), 2-phenylimidazole, 2-phenyl-4-methylimidazole (2-phenyl-4-methylimidazole), 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole and 2-phenylimidazoline; wherein the curable adhesive resin of the curable composition is a silane-modified epoxy resin of which a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, or wherein the curable adhesive resin of the curable composition is an epoxy resin of which a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, and wherein the curable composition further comprises a silane coupling agent between 0.01 and 1.5 parts by weight with respect to 100 parts by weight of the curable adhesive resin, and wherein the curable adhesive resin of the curable composition is a silane-modified epoxy resin of which a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, or wherein the curable adhesive resin of the curable composition is an epoxy resin of which a content of halogen ions is 1,000 ppm or less as measured according to ASTM D 7359:2008, and wherein the curable composition further comprises a silane coupling agent between 0.01 and 1.5 parts by weight with respect to 100 parts by weight of the curable adhesive resin, and wherein the curable composition satisfies the following Expressions 1 and 2: X ≤ 1,000 ppm Y ≤ 1,000 ppm, wherein X in Equation 1 is an amount of volatile organic compounds, which is measured by preparing a film with the curable composition, maintaining 50 mg of the film sample at 150 °C for 1 hour, and using purge and trap-gas chromatography/mass spectrometry, and Y in Equation 2 is an amount of ionic substances contained in the curable composition, which is obtained by preparing a film with the curable composition, and measuring 50 mg of the film sample according to ASTM D 7359:2008.