A laser processing system comprising: at least one powder supply device; and a laser processing head including; a laser emission unit which irradiates a workpiece with laser light, a powder supply unit which receives powder supplied from at least one powder supply device to the laser processing head, can supply at least one type of powder to a laser spot on the workpiece, and includes a powder discharge unit which discharges the powder on the laser spot on the workpiece, characterized in that: the powder supply unit further includes: at least one powder-supply control mechanism (130, 130A, 130B) which controls the amount of the powder to be supplied to the powder discharge unit, by distributing to the powder discharge unit at least a part of a flow of the powder supplied from the powder supply device; and the laser processing system further comprises a controller which controls the distributing by the at least one powder-supply control mechanism (130, 130A, 130B); a powder recovery container, wherein the powder-supply control mechanism (130, 130A, 130B) includes: i. a plurality of branches (134a, 135a) arranged on a downstream side of a powder supply channel through which the powder is supplied from the powder supply device to the powder-supply control mechanism (130, 130A, 130B), ii. a supply pipe arrangement which connects at least one of the plurality of branches (134a, 135a) to the powder discharge unit, iii. a return pipe arrangement (135A, 135B) which connects one or more of the plurality of branches (134a, 135a) other than the at least one of the plurality of branches (134a, 135a) to the powder recovery container, and iv. a distribution-ratio control mechanism which controls a distribution ratio between the plurality of branches (134a, 135a). at least one powder supply device; and a laser processing head including; a laser emission unit which irradiates a workpiece with laser light, a powder supply unit which receives powder supplied from at least one powder supply device to the laser processing head, can supply at least one type of powder to a laser spot on the workpiece, and includes a powder discharge unit which discharges the powder on the laser spot on the workpiece, characterized in that: the powder supply unit further includes: at least one powder-supply control mechanism (130, 130A, 130B) which controls the amount of the powder to be supplied to the powder discharge unit, by distributing to the powder discharge unit at least a part of a flow of the powder supplied from the powder supply device; and the laser processing system further comprises at least one powder-supply control mechanism (130, 130A, 130B) which controls the amount of the powder to be supplied to the powder discharge unit, by distributing to the powder discharge unit at least a part of a flow of the powder supplied from the powder supply device; and a controller which controls the distributing by the at least one powder-supply control mechanism (130, 130A, 130B); i. a plurality of branches (134a, 135a) arranged on a downstream side of a powder supply channel through which the powder is supplied from the powder supply device to the powder-supply control mechanism (130, 130A, 130B), ii. a supply pipe arrangement which connects at least one of the plurality of branches (134a, 135a) to the powder discharge unit, iii. a return pipe arrangement (135A, 135B) which connects one or more of the plurality of branches (134a, 135a) other than the at least one of the plurality of branches (134a, 135a) to the powder recovery container, and iv. a distribution-ratio control mechanism which controls a distribution ratio between the plurality of branches (134a, 135a).