A semiconductor device configured to provide current and voltage isolation inside an integrated circuit package, the semiconductor device comprising: a lead frame including a first set of leads (220, 222, 224, 226) and a second set of leads (230, 232, 234, 236), the first set of leads being isolated from the second set of leads; a semiconductor die positioned on the lead frame; an isolating block positioned on the semiconductor die; characterized in that a first interconnect coil is formed by a first set of wires (260, 262, 264, 266), the semiconductor die, and the first set of leads (220, 222, 224, 226) in which: the first set of leads (220, 222, 224, 226) includes a first lead and a second lead each of which is conductive and connected to each other at its end tip portion, and the first set of wires (260, 262, 264, 266) includes a first wire and a second wire, at one end connected to each other via the first lead and the second lead and, at another end respectively connected to first and second conductive traces (270, 272) positioned on the top surface of the semiconductor die; and a second interconnect coil isolated from the first interconnect coil is formed by a second set of wires (280, 282, 284, 286), the isolating block, and the second set of leads (230, 232, 234, 236) in which: the second set of leads (230, 232, 234, 236) includes first, second, third, and fourth leads each of which is conductive and the third and fourth leads (234, 236) connect to each other at their end tip portion, the second set of wires (280, 282, 284, 286) includes first, second, third, and fourth wires, the first and second wires (280, 282), at one end connect to each other via a first conductive trace positioned on the top surface of the isolating block and, at another end the first wire connect to the first lead and the second wire connect to the third lead, and the third and fourth wires (284, 286), at one end connect to each other via a second conductive trace positioned on the top surface of the isolating block and, at another end the third wire connect to the fourth lead and the fourth wire being connected to second lead. a lead frame including a first set of leads (220, 222, 224, 226) and a second set of leads (230, 232, 234, 236), the first set of leads being isolated from the second set of leads; a semiconductor die positioned on the lead frame; an isolating block positioned on the semiconductor die; characterized in that a first interconnect coil is formed by a first set of wires (260, 262, 264, 266), the semiconductor die, and the first set of leads (220, 222, 224, 226) in which: the first set of leads (220, 222, 224, 226) includes a first lead and a second lead each of which is conductive and connected to each other at its end tip portion, and the first set of wires (260, 262, 264, 266) includes a first wire and a second wire, at one end connected to each other via the first lead and the second lead and, at another end respectively connected to first and second conductive traces (270, 272) positioned on the top surface of the semiconductor die; and the first set of leads (220, 222, 224, 226) includes a first lead and a second lead each of which is conductive and connected to each other at its end tip portion, and the first set of wires (260, 262, 264, 266) includes a first wire and a second wire, at one end connected to each other via the first lead and the second lead and, at another end respectively connected to first and second conductive traces (270, 272) positioned on the top surface of the semiconductor die; and a second interconnect coil isolated from the first interconnect coil is formed by a second set of wires (280, 282, 284, 286), the isolating block, and the second set of leads (230, 232, 234, 236) in which: the second set of leads (230, 232, 234, 236) includes first, second, third, and fourth leads each of which is conductive and the third and fourth leads (234, 236) connect to each other at their end tip portion, the second set of wires (280, 282, 284, 286) includes first, second, third, and fourth wires, the first and second wires (280, 282), at one end connect to each other via a first conductive trace positioned on the top surface of the isolating block and, at another end the first wire connect to the first lead and the second wire connect to the third lead, and the third and fourth wires (284, 286), at one end connect to each other via a second conductive trace positioned on the top surface of the isolating block and, at another end the third wire connect to the fourth lead and the fourth wire being connected to second lead. the second set of leads (230, 232, 234, 236) includes first, second, third, and fourth leads each of which is conductive and the third and fourth leads (234, 236) connect to each other at their end tip portion, the second set of wires (280, 282, 284, 286) includes first, second, third, and fourth wires, the first and second wires (280, 282), at one end connect to each other via a first conductive trace positioned on the top surface of the isolating block and, at another end the first wire connect to the first lead and the second wire connect to the third lead, and the third and fourth wires (284, 286), at one end connect to each other via a second conductive trace positioned on the top surface of the isolating block and, at another end the third wire connect to the fourth lead and the fourth wire being connected to second lead.