A LED light-emitting device, including: a carrier, which is a transparent body, and on carrying surface of which conductors are provided; a plurality of LED chips, which are electrically connected to the conductors by way of eutectic bonding, so as to realize electrical connection among the plurality of LED chips; the number of the LED chips is N, the number of the conductors is N+1, where N is an integer larger than 1, and the N LED chips and the N+1 conductors are alternately arranged along an extension direction of the pair of electrodes (20a, 20b); chip soldering pads are provided at both ends of a bonding surface of each LED chip, circuit soldering pads are correspondingly provided at two ends of two conductors adjacent to the LED chip, and shape of the chip soldering pads corresponds to that of the circuit soldering pads; wherein two protrusions extending to each other are formed on two successively spaced conductors, and the two protrusions are located at both sides of the LED chip between the two successively spaced conductors, and a pair of electrodes (20a, 20b), wherein positive/negative electrodes of the pair of electrodes (20a, 20b) are electrically, by means of the conductors, connected to the LED chips located at the most upstream/most downstream of a current transmission in the plurality of LED chips, and extend to the outside of an encapsulation structural member, the encapsulation structural member, which is a transparent body and encapsulates on the periphery of the carrier and the plurality of LED chips; characterized in that each LED chip and two conductors adjacent thereto are electrically connected by soldering the chip soldering pads with the circuit soldering pads by way of eutectic bonding, and the encapsulation structural member (131,132) only encapsulates the carrying surface of the carrier, the LED chips fixed on the carrying surface, a surface of the carrier far away from the carrying surface, and marginal areas of both side surfaces of the carrier; or, in a section vertical to the extension direction of the pair of electrodes (20a, 20b), the encapsulation structural member only encapsulates, with an encapsulating angle of 180° radius angle and in circumferential direction, the carrying surface of the carrier, the LED chips fixed on the carrying surface, and a surface of the carrier far away from the carrying surface, respectively. a carrier, which is a transparent body, and on carrying surface of which conductors are provided; a plurality of LED chips, which are electrically connected to the conductors by way of eutectic bonding, so as to realize electrical connection among the plurality of LED chips; the number of the LED chips is N, the number of the conductors is N+1, where N is an integer larger than 1, and the N LED chips and the N+1 conductors are alternately arranged along an extension direction of the pair of electrodes (20a, 20b); chip soldering pads are provided at both ends of a bonding surface of each LED chip, circuit soldering pads are correspondingly provided at two ends of two conductors adjacent to the LED chip, and shape of the chip soldering pads corresponds to that of the circuit soldering pads; wherein two protrusions extending to each other are formed on two successively spaced conductors, and the two protrusions are located at both sides of the LED chip between the two successively spaced conductors, and a pair of electrodes (20a, 20b), wherein positive/negative electrodes of the pair of electrodes (20a, 20b) are electrically, by means of the conductors, connected to the LED chips located at the most upstream/most downstream of a current transmission in the plurality of LED chips, and extend to the outside of an encapsulation structural member, the encapsulation structural member, which is a transparent body and encapsulates on the periphery of the carrier and the plurality of LED chips; characterized in that each LED chip and two conductors adjacent thereto are electrically connected by soldering the chip soldering pads with the circuit soldering pads by way of eutectic bonding, and the encapsulation structural member (131,132) only encapsulates the carrying surface of the carrier, the LED chips fixed on the carrying surface, a surface of the carrier far away from the carrying surface, and marginal areas of both side surfaces of the carrier; or, in a section vertical to the extension direction of the pair of electrodes (20a, 20b), the encapsulation structural member only encapsulates, with an encapsulating angle of 180° radius angle and in circumferential direction, the carrying surface of the carrier, the LED chips fixed on the carrying surface, and a surface of the carrier far away from the carrying surface, respectively.