A housing assembly comprising: a dielectric substrate having a first transmittance for a radio frequency signal in a preset frequency band; and a radio-wave transparent structure comprising a first radio-wave transparent layer and a second radio-wave transparent layer coupled with the first radio-wave transparent layer, wherein the first radio-wave transparent layer and the second radio-wave transparent layer are indirectly stacked together, and the radio-wave transparent structure at least partially covers the dielectric substrate, wherein a region of the housing assembly corresponding to the radio-wave transparent structure has a second transmittance for the radio frequency signal in the preset frequency band, wherein the second transmittance is larger than the first transmittance, wherein the radio-wave transparent structure further comprises a third radio-wave transparent layer, wherein the third radio-wave transparent layer is disposed at a side of the second radio-wave transparent layer away from the first radio-wave transparent layer, wherein the third radio-wave transparent layer and the second radio-wave transparent layer are indirectly stacked together, and wherein the third radio-wave transparent layer is coupled with the first radio-wave transparent layer and the second radio-wave transparent layer respectively, and wherein the dielectric substrate comprises a first surface and a second surface opposite the first surface, characterized in that: either: the first surface forms at least part of an exterior surface of the housing assembly, and a surface of the first radio-wave transparent layer away from the second radio-wave transparent layer forms at least part of the exterior surface of the housing assembly, and the second radio-wave transparent layer and the third radio-wave transparent layer are embedded in the dielectric substrate; or the first radio-wave transparent layer, the second radio-wave transparent layer, and the third radio-wave transparent layer are all embedded in the dielectric substrate and sandwiched between the first surface and the second surface. a dielectric substrate having a first transmittance for a radio frequency signal in a preset frequency band; and a radio-wave transparent structure comprising a first radio-wave transparent layer and a second radio-wave transparent layer coupled with the first radio-wave transparent layer, wherein the first radio-wave transparent layer and the second radio-wave transparent layer are indirectly stacked together, and the radio-wave transparent structure at least partially covers the dielectric substrate, wherein a region of the housing assembly corresponding to the radio-wave transparent structure has a second transmittance for the radio frequency signal in the preset frequency band, wherein the second transmittance is larger than the first transmittance, wherein the radio-wave transparent structure further comprises a third radio-wave transparent layer, wherein the third radio-wave transparent layer is disposed at a side of the second radio-wave transparent layer away from the first radio-wave transparent layer, wherein the third radio-wave transparent layer and the second radio-wave transparent layer are indirectly stacked together, and wherein the third radio-wave transparent layer is coupled with the first radio-wave transparent layer and the second radio-wave transparent layer respectively, and wherein the dielectric substrate comprises a first surface and a second surface opposite the first surface, characterized in that: either: the first surface forms at least part of an exterior surface of the housing assembly, and a surface of the first radio-wave transparent layer away from the second radio-wave transparent layer forms at least part of the exterior surface of the housing assembly, and the second radio-wave transparent layer and the third radio-wave transparent layer are embedded in the dielectric substrate; or the first radio-wave transparent layer, the second radio-wave transparent layer, and the third radio-wave transparent layer are all embedded in the dielectric substrate and sandwiched between the first surface and the second surface. the first surface forms at least part of an exterior surface of the housing assembly, and a surface of the first radio-wave transparent layer away from the second radio-wave transparent layer forms at least part of the exterior surface of the housing assembly, and the second radio-wave transparent layer and the third radio-wave transparent layer are embedded in the dielectric substrate; or the first radio-wave transparent layer, the second radio-wave transparent layer, and the third radio-wave transparent layer are all embedded in the dielectric substrate and sandwiched between the first surface and the second surface.