A heat dissipation plate (100a, 100b, 100c, 100d, 100e) comprising: a heat-conductive material layer (110a, 110b) having an upper surface (112a, 112b) and a lower surface (114a, 114b) opposite to each other, wherein a material of the heat-conductive material layer (110a, 110b) comprises ceramic or silicon germanium; a first metal layer disposed on the lower surface (114a, 114b) of the heat-conductive material layer (110a, 110b) a metal substrate disposed below the first metal layer; and a metal ring frame disposed between the first metal layer and the metal substrate, wherein the first metal layer has a first rough surface with alternating concave-convex structures; the metal substrate has a second rough surface with alternating concave-convex structures; a respective Rymax of the first and second rough surfaces with alternating concave-convex structures (122, 132) ranges from several micrometers to several centimeters; and wherein the first rough surface with alternating concave-convex structures, the metal ring frame, and the second rough surface with alternating concave-convex structures define a fluid chamber, and a working fluid flows in the fluid chamber; characterized in that the heat-conductive material layer further comprises at least one conductive through hole structure, and the at least one conductive through hole structure exposes a portion of the first metal layer and is electrically connected to the first metal layer; and/or a second metal layer is disposed on the upper surface of the heat-conductive material layer, wherein the second metal layer entirely covers or exposes a portion of the heat-conductive material layer. a heat-conductive material layer (110a, 110b) having an upper surface (112a, 112b) and a lower surface (114a, 114b) opposite to each other, wherein a material of the heat-conductive material layer (110a, 110b) comprises ceramic or silicon germanium; a first metal layer disposed on the lower surface (114a, 114b) of the heat-conductive material layer (110a, 110b) a metal substrate disposed below the first metal layer; and a metal ring frame disposed between the first metal layer and the metal substrate, wherein the first metal layer has a first rough surface with alternating concave-convex structures; the metal substrate has a second rough surface with alternating concave-convex structures; a respective Rymax of the first and second rough surfaces with alternating concave-convex structures (122, 132) ranges from several micrometers to several centimeters; and wherein the first rough surface with alternating concave-convex structures, the metal ring frame, and the second rough surface with alternating concave-convex structures define a fluid chamber, and a working fluid flows in the fluid chamber; characterized in that the heat-conductive material layer further comprises at least one conductive through hole structure, and the at least one conductive through hole structure exposes a portion of the first metal layer and is electrically connected to the first metal layer; and/or a second metal layer is disposed on the upper surface of the heat-conductive material layer, wherein the second metal layer entirely covers or exposes a portion of the heat-conductive material layer.