A method of manufacturing a metal-polymer resin bonded body, comprising: degreasing metal using a degreasing solution; etching the metal (S200, S300) using an etching solution after the degreasing; electrolyzing the metal using an electrolyte solution after the etching; and performing a polymer resin injection to bond a polymer resin to the metal after the electrolyzing, wherein the electrolyte solution includes a compound containing distilled water, oxalic acid, sulfuric acid, and carboxylic acid, wherein the etching of the metal includes a first etching process for etching the metal using a first etching solution and a second etching process for etching the metal using a second etching solution; characterized in that the first etching solution contains distilled water and at least one of oxalic acid, acetic acid, nitric acid, hydrochloric acid and hydrogen peroxide, and the second etching solution contains sodium hydrogen carbonate, sodium hydroxide, sodium tetraborate and distilled water, wherein the compound containing carboxylic acid contains at least one of imidazole-5-carboxylic acid, 1,2,3-thiadiazole carboxylic acid, cyclohexane polycarboxylic acid, heteroaryl carboxylic acid, amino carboxylic acid, benzene polycarboxylic acid, benzoindole carboxylic acid, hydroxycarboxylic acid, pyrazolecarboxylic acid, quinolinecarboxylic acid, polyfluorocarboxylic acid, isothiazole carboxylic acid, pyridonecarboxylic acid, aminothiophenecarboxylic acid, benzophenonetetracarboxylic acid, 3-carbamoylpyrazine-2-carboxylic acid, 3-carboxy-1-adamantaneacetic acid, naphthaleneacetic acid, tetraacetic acid, indole acetic acid and catechol-O,O-diacetic acid. degreasing metal using a degreasing solution; etching the metal (S200, S300) using an etching solution after the degreasing; electrolyzing the metal using an electrolyte solution after the etching; and performing a polymer resin injection to bond a polymer resin to the metal after the electrolyzing, wherein the electrolyte solution includes a compound containing distilled water, oxalic acid, sulfuric acid, and carboxylic acid, wherein the etching of the metal includes a first etching process for etching the metal using a first etching solution and a second etching process for etching the metal using a second etching solution; characterized in that the first etching solution contains distilled water and at least one of oxalic acid, acetic acid, nitric acid, hydrochloric acid and hydrogen peroxide, and the second etching solution contains sodium hydrogen carbonate, sodium hydroxide, sodium tetraborate and distilled water, wherein the compound containing carboxylic acid contains at least one of imidazole-5-carboxylic acid, 1,2,3-thiadiazole carboxylic acid, cyclohexane polycarboxylic acid, heteroaryl carboxylic acid, amino carboxylic acid, benzene polycarboxylic acid, benzoindole carboxylic acid, hydroxycarboxylic acid, pyrazolecarboxylic acid, quinolinecarboxylic acid, polyfluorocarboxylic acid, isothiazole carboxylic acid, pyridonecarboxylic acid, aminothiophenecarboxylic acid, benzophenonetetracarboxylic acid, 3-carbamoylpyrazine-2-carboxylic acid, 3-carboxy-1-adamantaneacetic acid, naphthaleneacetic acid, tetraacetic acid, indole acetic acid and catechol-O,O-diacetic acid.