An interconnect structure, comprising: a first insulative web having a first surface and a second surface; a logic device secured to the second surface of the first insulative web; a frame assembly supporting the first insulative web by way of a first insulative adhesive layer and comprising: a frame base having a first surface, a second surface, and an inward facing surface defining a frame aperture extending through the frame base, wherein at least a portion of the logic device is disposed within the aperture; and a first conductive layer located on the frame base first surface; a first connector operable to allow the logic device to communicate therethrough to the first conductive layer; characterised by: the frame assembly further comprising a first frame insulative layer disposed between the frame base first surface and the first insulative web, wherein the first frame insulative layer comprises a first surface and a second surface, and the frame assembly further comprises: a second frame insulative web having a first surface and a second surface, wherein the first insulative web is secured to the second frame insulative web by a second insulating adhesive layer; and a second frame connector between a second electrically conductive layer located on the first insulative web and an electrical conductor located on the second frame insulative web. a first insulative web having a first surface and a second surface; a logic device secured to the second surface of the first insulative web; a frame assembly supporting the first insulative web by way of a first insulative adhesive layer and comprising: a frame base having a first surface, a second surface, and an inward facing surface defining a frame aperture extending through the frame base, wherein at least a portion of the logic device is disposed within the aperture; and a first conductive layer located on the frame base first surface; a frame base having a first surface, a second surface, and an inward facing surface defining a frame aperture extending through the frame base, wherein at least a portion of the logic device is disposed within the aperture; and a first conductive layer located on the frame base first surface; a first connector operable to allow the logic device to communicate therethrough to the first conductive layer; characterised by: the frame assembly further comprising a first frame insulative layer disposed between the frame base first surface and the first insulative web, wherein the first frame insulative layer comprises a first surface and a second surface, and the frame assembly further comprises: a second frame insulative web having a first surface and a second surface, wherein the first insulative web is secured to the second frame insulative web by a second insulating adhesive layer; and a second frame connector between a second electrically conductive layer located on the first insulative web and an electrical conductor located on the second frame insulative web. the frame assembly further comprising a first frame insulative layer disposed between the frame base first surface and the first insulative web, wherein the first frame insulative layer comprises a first surface and a second surface, and the frame assembly further comprises: a second frame insulative web having a first surface and a second surface, wherein the first insulative web is secured to the second frame insulative web by a second insulating adhesive layer; and a second frame connector between a second electrically conductive layer located on the first insulative web and an electrical conductor located on the second frame insulative web. a second frame insulative web having a first surface and a second surface, wherein the first insulative web is secured to the second frame insulative web by a second insulating adhesive layer; and a second frame connector between a second electrically conductive layer located on the first insulative web and an electrical conductor located on the second frame insulative web.