A manufacturing method of flexible array substrate, wherein the method comprises: (a) providing a rigid support plate and a flexible substrate, adhering the flexible substrate to the rigid support plate with an adhesive layer so that the back side of the flexible substrate facing away from the rigid support plate; (b) forming a back side driver circuit on the back side of the flexible substrate and covering a protective layer on the back side driver circuit; (c) separating the flexible substrate from the rigid support plate, turning the flexible substrate over and adhering the flexible substrate to the rigid support plate with the adhesive layer so that the front side of the flexible substrate facing away from the rigid support plate, with the protective layer contacting the adhesive layer; (d) forming holes penetrating the flexible substrate in a predefined non-active area on the front side of the flexible substrate, exposing the back side driver circuit on the back side of the flexible substrate; (e) forming a front side driver circuit and a display circuit respectively on the predefined non-active area and active area on the front side of the flexible substrate to form the flexible array substrate, the front side driver circuit being electrically connected to the display circuit, and the back side driver circuit being electrically connected to the display circuit through the holes wherein the display circuit comprises a plurality of data lines and a plurality of scan lines intersecting perpendicularly to form a plurality of pixel units; (f) separating the flexible substrate from the rigid support plate to obtain the flexile array substrate. (a) providing a rigid support plate and a flexible substrate, adhering the flexible substrate to the rigid support plate with an adhesive layer so that the back side of the flexible substrate facing away from the rigid support plate; (b) forming a back side driver circuit on the back side of the flexible substrate and covering a protective layer on the back side driver circuit; (c) separating the flexible substrate from the rigid support plate, turning the flexible substrate over and adhering the flexible substrate to the rigid support plate with the adhesive layer so that the front side of the flexible substrate facing away from the rigid support plate, with the protective layer contacting the adhesive layer; (d) forming holes penetrating the flexible substrate in a predefined non-active area on the front side of the flexible substrate, exposing the back side driver circuit on the back side of the flexible substrate; (e) forming a front side driver circuit and a display circuit respectively on the predefined non-active area and active area on the front side of the flexible substrate to form the flexible array substrate, the front side driver circuit being electrically connected to the display circuit, and the back side driver circuit being electrically connected to the display circuit through the holes wherein the display circuit comprises a plurality of data lines and a plurality of scan lines intersecting perpendicularly to form a plurality of pixel units; (f) separating the flexible substrate from the rigid support plate to obtain the flexile array substrate.