A method for manufacturing a thermoelectric half-cell, wherein the method comprises: a) providing more than one element of a semiconducting thermoelectric conversion material, where each of the provided elements is either of p-type conductivity or n-type conductivity and comprises a side surface, a first end surface, and a second end surface, and where the first and second end surfaces are opposite each other and substantially planar and parallel, and substantially perpendicular to the side surface, b) providing a first and a second contact substrate, where the first and the second contact substrate are made of a metal A and have a substantially planar upper (11, 13) and lower (12, 14) end surface which are opposite each other and substantially mutually parallel, c) depositing a first adhesion layer covering the first end surface of each of the provided elements of a semiconducting thermoelectric conversion material, and a second adhesion layer covering the second end surface of each of the provided elements of a semiconducting thermoelectric conversion material, d) arranging the provided elements of a semiconducting thermoelectric conversion material onto the first contact substrate at a distance from each other, and enabling thermal and electric contact between the upper end surface of the first contact substrate and the second adhesion layer of each of the provided elements of a semiconducting thermoelectric conversion material, e) arranging the second contact substrate onto each of the provided elements of a semiconducting thermoelectric conversion material being arranged onto the first contact substrate and enabling thermal and electric contact between the lower end surface of the second contact substrate and the first adhesion layer of each of the provided elements of a semiconducting thermoelectric conversion material being arranged onto the first contact substrate, and f) depositing a first dielectric layer onto the upper surface of the second contact substrate and a second dielectric layer onto the lower surface of the first contact substrate. a) providing more than one element of a semiconducting thermoelectric conversion material, where each of the provided elements is either of p-type conductivity or n-type conductivity and comprises a side surface, a first end surface, and a second end surface, and where the first and second end surfaces are opposite each other and substantially planar and parallel, and substantially perpendicular to the side surface, b) providing a first and a second contact substrate, where the first and the second contact substrate are made of a metal A and have a substantially planar upper (11, 13) and lower (12, 14) end surface which are opposite each other and substantially mutually parallel, c) depositing a first adhesion layer covering the first end surface of each of the provided elements of a semiconducting thermoelectric conversion material, and a second adhesion layer covering the second end surface of each of the provided elements of a semiconducting thermoelectric conversion material, d) arranging the provided elements of a semiconducting thermoelectric conversion material onto the first contact substrate at a distance from each other, and enabling thermal and electric contact between the upper end surface of the first contact substrate and the second adhesion layer of each of the provided elements of a semiconducting thermoelectric conversion material, e) arranging the second contact substrate onto each of the provided elements of a semiconducting thermoelectric conversion material being arranged onto the first contact substrate and enabling thermal and electric contact between the lower end surface of the second contact substrate and the first adhesion layer of each of the provided elements of a semiconducting thermoelectric conversion material being arranged onto the first contact substrate, and f) depositing a first dielectric layer onto the upper surface of the second contact substrate and a second dielectric layer onto the lower surface of the first contact substrate.