An assembly comprising: a substrate; a first integrated device coupled to the substrate; a second integrated device coupled to the substrate; a first thermal interface material, TIM, coupled to the first integrated device; a second TIM coupled to the second integrated device; a frame coupled to the substrate, wherein the frame at least partially surrounds the first integrated device and the second integrated device, wherein the frame is configured to provide a first compartment and a second compartment, wherein at least part of the frame is located between the first integrated device and the second integrated device, and wherein the frame is coupled to the substrate such that the first integrated device is located in the first component of the frame and the second integrated device is located in the second compartment of the frame; a shield coupled to at least part of the frame located between the first integrated device and the second integrated device; a step heat sink coupled to the frame, wherein the step heat sink is located over the first integrated device and the second integrated device, and wherein the step heat sink comprises: a first heat sink portion; a third heat sink portion coupled to the first heat sink portion; and a second heat sink portion coupled to the third heat sink portion; and a heat pipe coupled to the step heat sink, wherein the heat pipe is located over (i) the first integrated device and (ii) the first heat sink portion of the step heat sink, and wherein the top surface of the heat pipe and the top surface of the third heat sink portion of the step heat sink are located in a same horizontal plane. a substrate; a first integrated device coupled to the substrate; a second integrated device coupled to the substrate; a first thermal interface material, TIM, coupled to the first integrated device; a second TIM coupled to the second integrated device; a frame coupled to the substrate, wherein the frame at least partially surrounds the first integrated device and the second integrated device, wherein the frame is configured to provide a first compartment and a second compartment, wherein at least part of the frame is located between the first integrated device and the second integrated device, and wherein the frame is coupled to the substrate such that the first integrated device is located in the first component of the frame and the second integrated device is located in the second compartment of the frame; wherein the frame at least partially surrounds the first integrated device and the second integrated device, wherein the frame is configured to provide a first compartment and a second compartment, wherein at least part of the frame is located between the first integrated device and the second integrated device, and wherein the frame is coupled to the substrate such that the first integrated device is located in the first component of the frame and the second integrated device is located in the second compartment of the frame; a shield coupled to at least part of the frame located between the first integrated device and the second integrated device; a step heat sink coupled to the frame, wherein the step heat sink is located over the first integrated device and the second integrated device, and wherein the step heat sink comprises: a first heat sink portion; a third heat sink portion coupled to the first heat sink portion; and a second heat sink portion coupled to the third heat sink portion; and wherein the step heat sink is located over the first integrated device and the second integrated device, and wherein the step heat sink comprises: a first heat sink portion; a third heat sink portion coupled to the first heat sink portion; and a second heat sink portion coupled to the third heat sink portion; and a first heat sink portion; a third heat sink portion coupled to the first heat sink portion; and a second heat sink portion coupled to the third heat sink portion; and a heat pipe coupled to the step heat sink, wherein the heat pipe is located over (i) the first integrated device and (ii) the first heat sink portion of the step heat sink, and wherein the top surface of the heat pipe and the top surface of the third heat sink portion of the step heat sink are located in a same horizontal plane. wherein the heat pipe is located over (i) the first integrated device and (ii) the first heat sink portion of the step heat sink, and wherein the top surface of the heat pipe and the top surface of the third heat sink portion of the step heat sink are located in a same horizontal plane.