A die mechanism (110, 210) for shaping a component during creep-age forming, the die mechanism comprising: a first support member (120-1, 220-1) and a second support member (120-2, 220-2), the first and second support members extending in a first direction; a plurality of pin modules (130, 230) between the first and second support members, wherein each of the plurality of pin modules extends in a second direction perpendicular to the first direction, and each pin module comprises a plurality of pins; wherein heights of ends of the plurality of pins within each of the plurality of pin modules together define a shape profile for shaping the component during creep-age forming; and wherein: the plurality of pin modules are configured to be movable along the first and second support members in the first direction, and the plurality of pins are configured to be movable along respective pin modules in the second direction; wherein the plurality of pin modules (130, 230) are configured to be removable from the first and second support members (120, 220); wherein each of the plurality of pins of each pin module is housed in a pin housing (132, 260); wherein each of the plurality of pin modules (130, 230) comprises a first module rack and a second module rack positioned adjacent to each other and extending in the second direction, between which the plurality of pin housings are engaged, further wherein each of the first and second module racks comprises an inward-facing guiding member arranged to guide the movement of the plurality of pin housings along the length of the pin module in the second direction. a first support member (120-1, 220-1) and a second support member (120-2, 220-2), the first and second support members extending in a first direction; a plurality of pin modules (130, 230) between the first and second support members, wherein each of the plurality of pin modules extends in a second direction perpendicular to the first direction, and each pin module comprises a plurality of pins; wherein heights of ends of the plurality of pins within each of the plurality of pin modules together define a shape profile for shaping the component during creep-age forming; and wherein: the plurality of pin modules are configured to be movable along the first and second support members in the first direction, and the plurality of pins are configured to be movable along respective pin modules in the second direction; wherein the plurality of pin modules (130, 230) are configured to be removable from the first and second support members (120, 220); wherein each of the plurality of pins of each pin module is housed in a pin housing (132, 260); wherein each of the plurality of pin modules (130, 230) comprises a first module rack and a second module rack positioned adjacent to each other and extending in the second direction, between which the plurality of pin housings are engaged, further wherein each of the first and second module racks comprises an inward-facing guiding member arranged to guide the movement of the plurality of pin housings along the length of the pin module in the second direction. the plurality of pin modules are configured to be movable along the first and second support members in the first direction, and the plurality of pins are configured to be movable along respective pin modules in the second direction; wherein the plurality of pin modules (130, 230) are configured to be removable from the first and second support members (120, 220); wherein each of the plurality of pins of each pin module is housed in a pin housing (132, 260); wherein each of the plurality of pin modules (130, 230) comprises a first module rack and a second module rack positioned adjacent to each other and extending in the second direction, between which the plurality of pin housings are engaged, further wherein each of the first and second module racks comprises an inward-facing guiding member arranged to guide the movement of the plurality of pin housings along the length of the pin module in the second direction.