An integrated circuit, IC, packaging structure, comprising: a packaging substrate; one die or a plurality of dies disposed on the packaging substrate; an encapsulation material disposed on the packaging substrate and configured to encapsulate the one die or the plurality of dies on the packaging substrate; at least one trench disposed in the encapsulation material; and a heat dissipation structure, wherein the heat dissipation structure is partially disposed in the trench for reducing the distance between the heat dissipation structure and the at least one die encapsulated by the encapsulation material, wherein the heat dissipation structure comprises: a first portion disposed in the at least one trench; and a second portion disposed on a surface of the encapsulation material, wherein a material composition of the second portion is different from a material composition of the first portion, characterized in that the first portion comprises first metal particles, in that the second portion comprises second metal particles and in that a dimension of each of the second metal particles is larger than a dimension of each of the first metal particles, and wherein the second portion of the heat dissipation structure disposed on the top surface of the encapsulation material has an uneven surface for increasing the surface area of the second portion and enhancing the cooling capacity of the heat dissipation structure. a packaging substrate; one die or a plurality of dies disposed on the packaging substrate; an encapsulation material disposed on the packaging substrate and configured to encapsulate the one die or the plurality of dies on the packaging substrate; at least one trench disposed in the encapsulation material; and a heat dissipation structure, wherein the heat dissipation structure is partially disposed in the trench for reducing the distance between the heat dissipation structure and the at least one die encapsulated by the encapsulation material, wherein the heat dissipation structure comprises: a first portion disposed in the at least one trench; and a second portion disposed on a surface of the encapsulation material, wherein a material composition of the second portion is different from a material composition of the first portion, characterized in that the first portion comprises first metal particles, in that the second portion comprises second metal particles and in that a dimension of each of the second metal particles is larger than a dimension of each of the first metal particles, and wherein the second portion of the heat dissipation structure disposed on the top surface of the encapsulation material has an uneven surface for increasing the surface area of the second portion and enhancing the cooling capacity of the heat dissipation structure. a first portion disposed in the at least one trench; and a second portion disposed on a surface of the encapsulation material, wherein a material composition of the second portion is different from a material composition of the first portion, characterized in that the first portion comprises first metal particles, in that the second portion comprises second metal particles and in that a dimension of each of the second metal particles is larger than a dimension of each of the first metal particles, and wherein the second portion of the heat dissipation structure disposed on the top surface of the encapsulation material has an uneven surface for increasing the surface area of the second portion and enhancing the cooling capacity of the heat dissipation structure.