An ultrasonic sensor comprising: a ceramic element, the ceramic element being planar and having a first side and a second side opposite the first side, the ceramic element having a first metal layer disposed on the first side thereof and a second metal layer disposed on the second side thereof; a first flex circuit comprising an insulating layer (50,58) and a metal contact layer disposed on the insulating layer (50,58), the first flex circuit being attached to the ceramic element such that the contact layer is placed in contact with the first metal layer on the ceramic element; and a second flex circuit comprising an insulating layer and a metal contact layer disposed on the insulating layer (50,58), the second flex circuit being attached to the ceramic element such that the contact layer is placed in contact with the second metal layer on the ceramic element; characterized in that the metal contact layer of the first flex circuit includes a contact pad for making electrical contact with the ceramic element and a portion extending from the contact pad to form an electrical lead of the ultrasonic sensor, wherein the contact pad includes holes formed through the metal contact layer and the contact pad is attached to the first metal layer on the ceramic element; and the metal contact layer of the second flex circuit includes a contact pad for making electrical contact with the ceramic element and a portion extending from the contact pad to form an electrical lead of the ultrasonic sensor, wherein the contact pad includes holes formed through the metal contact layer; said contact pad is attached to the second metal layer of the ceramic element; wherein the first flex circuit is attached to the first side of the ceramic element with adhesive and wherein the second flex circuit is attached to the second side of the ceramic element with adhesive. a ceramic element, the ceramic element being planar and having a first side and a second side opposite the first side, the ceramic element having a first metal layer disposed on the first side thereof and a second metal layer disposed on the second side thereof; a first flex circuit comprising an insulating layer (50,58) and a metal contact layer disposed on the insulating layer (50,58), the first flex circuit being attached to the ceramic element such that the contact layer is placed in contact with the first metal layer on the ceramic element; and a second flex circuit comprising an insulating layer and a metal contact layer disposed on the insulating layer (50,58), the second flex circuit being attached to the ceramic element such that the contact layer is placed in contact with the second metal layer on the ceramic element; characterized in that the metal contact layer of the first flex circuit includes a contact pad for making electrical contact with the ceramic element and a portion extending from the contact pad to form an electrical lead of the ultrasonic sensor, wherein the contact pad includes holes formed through the metal contact layer and the contact pad is attached to the first metal layer on the ceramic element; and the metal contact layer of the second flex circuit includes a contact pad for making electrical contact with the ceramic element and a portion extending from the contact pad to form an electrical lead of the ultrasonic sensor, wherein the contact pad includes holes formed through the metal contact layer; said contact pad is attached to the second metal layer of the ceramic element; wherein the first flex circuit is attached to the first side of the ceramic element with adhesive and wherein the second flex circuit is attached to the second side of the ceramic element with adhesive.