A light emitting diode device comprising at least one LED, the device comprises two printed circuit boards (PCBs), a first PCB and a second PCB; the PCBs are essentially planar and have a similar size and shape and are provided with circuitry on one side, these circuitry sides are configured to face each other if the PCBs are mounted together, and that said second PCB is mounted above said first PCB in a parallel fashion to define said device, characterized in that - the first PCB comprises high voltage circuitry, e.g. 230 VAC drive circuitry, and said at least one LED, wherein said at least one LED being mounted to generate light in an essentially perpendicular direction in relation to the plane of the first PCB, - the second PCB comprises various low voltage electronic circuitry, e.g. related to signal control and communication, and that said second PCB comprises at least one opening allowing light generated by said at least one LED to pass through said second PCB, and that - the circuitries (10, 12) on the PCBs are designed in three dimensions to achieve high packing density, wherein said three dimensional design has resulted in three dimensional formations of the circuitries on the PCBs that are adapted to each other such that, when said PCBs are mounted together, the formations cooperate with each other by allowing high formations on one PCB to interpose with low formations on the other PCB, and that a predetermined minimum distance d between three dimensional formations on different PCBs are obtained, and wherein said LED device has a flat and thin extension with a height H in the range of 5-20 mm in a perpendicular direction in relation to the planes of the PCBs, wherein the PCBs are mounted together by a distance keeping arrangement such that the predetermined minimum distance d between the three dimensional formations on different PCBs are obtained, and wherein the distance keeping arrangement consists of non-galvanic mounting members, and wherein said predetermined minimum distance d is determined in dependence of regulatory requirements, and is in the range of 2-5 mm, and that the LED device further comprises a non-galvanic communication interface configured to achieve a bidirectional communication channel between the high voltage circuitries and low voltage electronic circuitries on said first and second PCB, respectively, wherein the non-galvanic communication interface being interposed in between the components of said low voltage and high voltage electronic circuitry, on said first and second PCB, respectively. - the first PCB comprises high voltage circuitry, e.g. 230 VAC drive circuitry, and said at least one LED, wherein said at least one LED being mounted to generate light in an essentially perpendicular direction in relation to the plane of the first PCB, - the second PCB comprises various low voltage electronic circuitry, e.g. related to signal control and communication, and that said second PCB comprises at least one opening allowing light generated by said at least one LED to pass through said second PCB, and that - the circuitries (10, 12) on the PCBs are designed in three dimensions to achieve high packing density, wherein said three dimensional design has resulted in three dimensional formations of the circuitries on the PCBs that are adapted to each other such that, when said PCBs are mounted together, the formations cooperate with each other by allowing high formations on one PCB to interpose with low formations on the other PCB, and that a predetermined minimum distance d between three dimensional formations on different PCBs are obtained, and wherein said LED device has a flat and thin extension with a height H in the range of 5-20 mm in a perpendicular direction in relation to the planes of the PCBs, wherein the PCBs are mounted together by a distance keeping arrangement such that the predetermined minimum distance d between the three dimensional formations on different PCBs are obtained, and wherein the distance keeping arrangement consists of non-galvanic mounting members, and wherein said predetermined minimum distance d is determined in dependence of regulatory requirements, and is in the range of 2-5 mm, and that the LED device further comprises a non-galvanic communication interface configured to achieve a bidirectional communication channel between the high voltage circuitries and low voltage electronic circuitries on said first and second PCB, respectively, wherein the non-galvanic communication interface being interposed in between the components of said low voltage and high voltage electronic circuitry, on said first and second PCB, respectively.