A light-emitting or light-receiving semiconductor module comprising: a plurality of spherical semiconductor devices having light-emitting or light-receiving properties, each formed from a spherical p-type or n-type semiconductor element with a pn junction formed on a surface section of said spherical p-type or n-type semiconductor element and electrodes (9a, 9b) disposed on said surface respectively in contact with the n-type and p-type ends of said pn junction, said electrodes (9a, 9b) being disposed on either side of a center of said spherical p-type or n-type semiconductor element, said plurality of spherical semiconductor devices being disposed in plural rows and plural columns with uniform conductive orientation, and a conductive connection arrangement connecting the spherical semiconductor devices in each of said columns to be electrically connected in series, characterized in that: said conductive connection arrangement is configured to connect the spherical semiconductor devices in each of said rows to be electrically connected in parallel; said conductive connection arrangement comprises plural metallic lead members, said plural metallic lead members including plural lead members mounted between adjacent rows of said spherical semiconductor devices, a lead member mounted on one side of a row that is on one end side of said module and a lead member mounted on the other side of a row that is on the other end side of said module and said plural lead members forming electrical connections with said electrodes (9a, 9b); and the centers of said spherical semiconductor devices in each row are between the pair of lead members mounted on both sides of said row. a plurality of spherical semiconductor devices having light-emitting or light-receiving properties, each formed from a spherical p-type or n-type semiconductor element with a pn junction formed on a surface section of said spherical p-type or n-type semiconductor element and electrodes (9a, 9b) disposed on said surface respectively in contact with the n-type and p-type ends of said pn junction, said electrodes (9a, 9b) being disposed on either side of a center of said spherical p-type or n-type semiconductor element, said plurality of spherical semiconductor devices being disposed in plural rows and plural columns with uniform conductive orientation, and a conductive connection arrangement connecting the spherical semiconductor devices in each of said columns to be electrically connected in series, characterized in that: said conductive connection arrangement is configured to connect the spherical semiconductor devices in each of said rows to be electrically connected in parallel; said conductive connection arrangement comprises plural metallic lead members, said plural metallic lead members including plural lead members mounted between adjacent rows of said spherical semiconductor devices, a lead member mounted on one side of a row that is on one end side of said module and a lead member mounted on the other side of a row that is on the other end side of said module and said plural lead members forming electrical connections with said electrodes (9a, 9b); and the centers of said spherical semiconductor devices in each row are between the pair of lead members mounted on both sides of said row. said conductive connection arrangement is configured to connect the spherical semiconductor devices in each of said rows to be electrically connected in parallel; said conductive connection arrangement comprises plural metallic lead members, said plural metallic lead members including plural lead members mounted between adjacent rows of said spherical semiconductor devices, a lead member mounted on one side of a row that is on one end side of said module and a lead member mounted on the other side of a row that is on the other end side of said module and said plural lead members forming electrical connections with said electrodes (9a, 9b); and