A subsea device, comprising - a subsea enclosure, wherein the subsea enclosure is pressure compensated and dielectric fluid-filled, and - an assembly for subsea use, wherein the assembly is disposed in the dielectric fluid-filled subsea enclosure, the assembly comprising: - a support, - a component mounted to the support, the component being a semiconductor power electronic component, - a protective housing comprising: o a cover that is mounted to the support of the component, the cover being formed so as to enclose the electronic component such that the electronic component is directly located inside a chamber formed by the cover and the support, wherein the chamber formed by the support and the cover is filled with a dielectric liquid, wherein the cover comprises at least o a flexible wall section that is deformable to allow the volume of the chamber to change for providing pressure balancing between a pressure inside the chamber and a pressure outside the chamber, or o a permeable wall section configured to allow a flow of fluid through the permeable wall section, the permeable wall section being further configured to filter fluid flowing through the permeable wall section. - a subsea enclosure, wherein the subsea enclosure is pressure compensated and dielectric fluid-filled, and - an assembly for subsea use, wherein the assembly is disposed in the dielectric fluid-filled subsea enclosure, the assembly comprising: - a support, - a component mounted to the support, the component being a semiconductor power electronic component, - a protective housing comprising: o a cover that is mounted to the support of the component, the cover being formed so as to enclose the electronic component such that the electronic component is directly located inside a chamber formed by the cover and the support, wherein the chamber formed by the support and the cover is filled with a dielectric liquid, wherein the cover comprises at least o a flexible wall section that is deformable to allow the volume of the chamber to change for providing pressure balancing between a pressure inside the chamber and a pressure outside the chamber, or o a permeable wall section configured to allow a flow of fluid through the permeable wall section, the permeable wall section being further configured to filter fluid flowing through the permeable wall section. - a support, - a component mounted to the support, the component being a semiconductor power electronic component, - a protective housing comprising: o a cover that is mounted to the support of the component, the cover being formed so as to enclose the electronic component such that the electronic component is directly located inside a chamber formed by the cover and the support, wherein the chamber formed by the support and the cover is filled with a dielectric liquid, wherein the cover comprises at least o a flexible wall section that is deformable to allow the volume of the chamber to change for providing pressure balancing between a pressure inside the chamber and a pressure outside the chamber, or o a permeable wall section configured to allow a flow of fluid through the permeable wall section, the permeable wall section being further configured to filter fluid flowing through the permeable wall section. o a cover that is mounted to the support of the component, the cover being formed so as to enclose the electronic component such that the electronic component is directly located inside a chamber formed by the cover and the support, wherein the chamber formed by the support and the cover is filled with a dielectric liquid, wherein the cover comprises at least o a flexible wall section that is deformable to allow the volume of the chamber to change for providing pressure balancing between a pressure inside the chamber and a pressure outside the chamber, or o a permeable wall section configured to allow a flow of fluid through the permeable wall section, the permeable wall section being further configured to filter fluid flowing through the permeable wall section.