An ink composition comprising: a semiconductor nanoparticle which contains a perovskite compound being a compound having a perovskite type crystal structure; a curable resin composition; wherein the ink composition may further comprise a solvent, a value of Z in Formula (a) is 0.37 or less, wherein Z = O2 + O3 + N2 + N3 / C2 + C3 (O2, N2, and C2 represent the number of O atoms, the number of N atoms, and the number of C atoms, respectively, in the curable resin composition, and O3, N3, and C3 represent the number of O atoms, the number of N atoms, and the number of C atoms, respectively in the solvent, here, in a case where the ink composition does not contain the solvent, O3, N3, and C3 each represent 0), and wherein the curable resin composition contains at least one selected from the group consisting of a low-molecular-weight compound represented by Formula (b-1) and a polymer having a repeating unit represented by Formula (b-2), and wherein the curable resin composition further contains a curing agent and an initiator, and wherein a total content ratio of the low-molecular-weight compound and the polymer is 50% by mass or greater in a case where a total mass of the curable resin composition is set to 100% by mass: (in Formulae (b-1) and (b-2), A represents a hydrogen atom or a methyl group, m1 represents an integer of 0 to 20, m2 represents an integer of 0 to 2, m3 represents an integer of 0 to 20, m4 represents an integer of 0 to 2, m5 represents an integer of 0 to 20, and a total value of m1 to m5 is 20 or less, Ra represents a methylene group, Rb represents a divalent group represented by any of Formulae (b-31) to (b-38), and in a case where a plurality of Rb's are present, Rb's may be the same as or different from one another, and Rc represents a monovalent group represented by any of Formulae (b-41) to (b-48)) a semiconductor nanoparticle which contains a perovskite compound being a compound having a perovskite type crystal structure; a curable resin composition; wherein the ink composition may further comprise a solvent, a value of Z in Formula (a) is 0.37 or less, wherein Z = O2 + O3 + N2 + N3 / C2 + C3 (O2, N2, and C2 represent the number of O atoms, the number of N atoms, and the number of C atoms, respectively, in the curable resin composition, and O3, N3, and C3 represent the number of O atoms, the number of N atoms, and the number of C atoms, respectively in the solvent, here, in a case where the ink composition does not contain the solvent, O3, N3, and C3 each represent 0), and wherein the curable resin composition contains at least one selected from the group consisting of a low-molecular-weight compound represented by Formula (b-1) and a polymer having a repeating unit represented by Formula (b-2), and wherein the curable resin composition further contains a curing agent and an initiator, and wherein a total content ratio of the low-molecular-weight compound and the polymer is 50% by mass or greater in a case where a total mass of the curable resin composition is set to 100% by mass: (in Formulae (b-1) and (b-2), A represents a hydrogen atom or a methyl group, m1 represents an integer of 0 to 20, m2 represents an integer of 0 to 2, m3 represents an integer of 0 to 20, m4 represents an integer of 0 to 2, m5 represents an integer of 0 to 20, and a total value of m1 to m5 is 20 or less, Ra represents a methylene group, Rb represents a divalent group represented by any of Formulae (b-31) to (b-38), and in a case where a plurality of Rb's are present, Rb's may be the same as or different from one another, and Rc represents a monovalent group represented by any of Formulae (b-41) to (b-48))