An electronic device, comprising: a housing, comprising: a first case, comprising an upper surface and a lower surface that are opposite to each other, a through hole, and a side wall, wherein the through hole runs through the upper surface and the lower surface, and the side wall extends away from the upper surface along a contour of the lower surface; and a second case, disposed at an end of the side wall away from the upper surface; a first heat source, disposed in the housing and corresponding to the through hole; a second heat source, disposed in the housing; and a heat dissipation module, comprising: a first fan, comprising a first air outlet, wherein the first fan is disposed on one side of the first case; a second fan, comprising a second air outlet, wherein the second fan is disposed on the other side of the first case and is adjacent to the second heat source, and the first air outlet and the second air outlet are located on two opposite sides of the side wall; a first heat conduction member, having one end disposed at the first fan and the other end located at a position on a side of the upper surface corresponding to the first heat source; and a second heat conduction member, having one end disposed at the second fan and the other end located on a side of the lower surface and abutting against the second heat source. a housing, comprising: a first case, comprising an upper surface and a lower surface that are opposite to each other, a through hole, and a side wall, wherein the through hole runs through the upper surface and the lower surface, and the side wall extends away from the upper surface along a contour of the lower surface; and a second case, disposed at an end of the side wall away from the upper surface; a first case, comprising an upper surface and a lower surface that are opposite to each other, a through hole, and a side wall, wherein the through hole runs through the upper surface and the lower surface, and the side wall extends away from the upper surface along a contour of the lower surface; and a second case, disposed at an end of the side wall away from the upper surface; a first heat source, disposed in the housing and corresponding to the through hole; a second heat source, disposed in the housing; and a heat dissipation module, comprising: a first fan, comprising a first air outlet, wherein the first fan is disposed on one side of the first case; a second fan, comprising a second air outlet, wherein the second fan is disposed on the other side of the first case and is adjacent to the second heat source, and the first air outlet and the second air outlet are located on two opposite sides of the side wall; a first heat conduction member, having one end disposed at the first fan and the other end located at a position on a side of the upper surface corresponding to the first heat source; and a second heat conduction member, having one end disposed at the second fan and the other end located on a side of the lower surface and abutting against the second heat source. a first fan, comprising a first air outlet, wherein the first fan is disposed on one side of the first case; a second fan, comprising a second air outlet, wherein the second fan is disposed on the other side of the first case and is adjacent to the second heat source, and the first air outlet and the second air outlet are located on two opposite sides of the side wall; a first heat conduction member, having one end disposed at the first fan and the other end located at a position on a side of the upper surface corresponding to the first heat source; and a second heat conduction member, having one end disposed at the second fan and the other end located on a side of the lower surface and abutting against the second heat source.