A front opening semiconductor wafer container for large diameter wafers, comprising: a container portion having a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers; a door (42, 406) attachable to the container portion to close the open front and selectively latchable to the container portion; a pair of front wafer restraints (430, 432) attached to an inside surface of the door (42, 406), each front wafer restraint (430, 432) including a plurality of wafer supports; each wafer support having a base portion non-movably secured to the door (42, 406), a wafer engagement pad portion, and an intermediate portion connecting the base portion and the wafer engagement portion; adjacent wafer supports being interconnected at respective base portions whereas adjacent intermediate portions and wafer engagement pad portions are not interconnected such that the wafer engagement pad portions and the intermediate portions are cantilevered from the base portions; the front opening semiconductor wafer container being characterized in that: the base portion of each wafer support is comprising an upper leg and a lower leg; the wafer engagement pad portion of each wafer support is comprising an upper leg and a lower leg that define a horizontal V-shaped groove; the wafer engagement pad portion of each wafer support swoops or is angled downwardly thereby providing an enhanced engagement surface for edges of sagging wafers; and the lower legs is larger than the upper legs due to top portions of the upper legs and the horizontal V-shaped grooves angling toward one another from the intermediate portions to distal ends of the wafer engagement pad portions. a container portion having a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers; a door (42, 406) attachable to the container portion to close the open front and selectively latchable to the container portion; a pair of front wafer restraints (430, 432) attached to an inside surface of the door (42, 406), each front wafer restraint (430, 432) including a plurality of wafer supports; each wafer support having a base portion non-movably secured to the door (42, 406), a wafer engagement pad portion, and an intermediate portion connecting the base portion and the wafer engagement portion; adjacent wafer supports being interconnected at respective base portions whereas adjacent intermediate portions and wafer engagement pad portions are not interconnected such that the wafer engagement pad portions and the intermediate portions are cantilevered from the base portions; the front opening semiconductor wafer container being characterized in that: the base portion of each wafer support is comprising an upper leg and a lower leg; the wafer engagement pad portion of each wafer support is comprising an upper leg and a lower leg that define a horizontal V-shaped groove; the wafer engagement pad portion of each wafer support swoops or is angled downwardly thereby providing an enhanced engagement surface for edges of sagging wafers; and the lower legs is larger than the upper legs due to top portions of the upper legs and the horizontal V-shaped grooves angling toward one another from the intermediate portions to distal ends of the wafer engagement pad portions. the base portion of each wafer support is comprising an upper leg and a lower leg; the wafer engagement pad portion of each wafer support is comprising an upper leg and a lower leg that define a horizontal V-shaped groove; the wafer engagement pad portion of each wafer support swoops or is angled downwardly thereby providing an enhanced engagement surface for edges of sagging wafers; and the lower legs is larger than the upper legs due to top portions of the upper legs and the horizontal V-shaped grooves angling toward one another from the intermediate portions to distal ends of the wafer engagement pad portions.