A method of fabricating an electrical guard structure for providing signal isolation comprising the steps of: providing a substrate having a mounting surface comprising a first area for hosting at least one electronic component; and implementing the electrical guard structure, the electrical guard structure including one or more electrically conductive projections onto the substrate, the one or more electrically conductive projections extending transverse to the mounting surface of the substrate; the one or more electrically conductive projections include one or more wall-like structures; the one or more wall-like structures are elongate parallel to the mounting surface; wherein: the one or more electrically conductive projections are formed by collections of a plurality of thread-like structures, the plurality of thread-like structures collectively forming the one or more electrically conductive projections extending transverse to the mounting surface, wherein the diameter of the thread-like structures ranges from 0.01 nanometer to 500 nanometer, preferably the diameter of the thread-like structures ranges from 0. 1 nanometer to 100 nanometer; the plurality of thread-like structures are implemented on one or more electrically conductive portions on the mounting surface; the one or more electrically conductive projections are coupled to a ground plane on a surface of the substrate opposite to the mounting surface by providing a plurality of vias extending through the substrate; and ends of the plurality of thread-like structures distal to the mounting surface define a surface of the one or more wall-like structures, the method further including a step of forming an electrically conductive layer on said surface of the one or more wall-like structures. providing a substrate having a mounting surface comprising a first area for hosting at least one electronic component; and implementing the electrical guard structure, the electrical guard structure including one or more electrically conductive projections onto the substrate, the one or more electrically conductive projections extending transverse to the mounting surface of the substrate; the one or more electrically conductive projections include one or more wall-like structures; the one or more wall-like structures are elongate parallel to the mounting surface; wherein: the one or more electrically conductive projections are formed by collections of a plurality of thread-like structures, the plurality of thread-like structures collectively forming the one or more electrically conductive projections extending transverse to the mounting surface, wherein the diameter of the thread-like structures ranges from 0.01 nanometer to 500 nanometer, preferably the diameter of the thread-like structures ranges from 0. 1 nanometer to 100 nanometer; the plurality of thread-like structures are implemented on one or more electrically conductive portions on the mounting surface; the one or more electrically conductive projections are coupled to a ground plane on a surface of the substrate opposite to the mounting surface by providing a plurality of vias extending through the substrate; and ends of the plurality of thread-like structures distal to the mounting surface define a surface of the one or more wall-like structures, the method further including a step of forming an electrically conductive layer on said surface of the one or more wall-like structures. the one or more electrically conductive projections are formed by collections of a plurality of thread-like structures, the plurality of thread-like structures collectively forming the one or more electrically conductive projections extending transverse to the mounting surface, wherein the diameter of the thread-like structures ranges from 0.01 nanometer to 500 nanometer, preferably the diameter of the thread-like structures ranges from 0. 1 nanometer to 100 nanometer; the plurality of thread-like structures are implemented on one or more electrically conductive portions on the mounting surface; the one or more electrically conductive projections are coupled to a ground plane on a surface of the substrate opposite to the mounting surface by providing a plurality of vias extending through the substrate; and ends of the plurality of thread-like structures distal to the mounting surface define a surface of the one or more wall-like structures, the method further including a step of forming an electrically conductive layer on said surface of the one or more wall-like structures.