An oven comprising: - an oven body; - a cooking chamber disposed in the oven body and configured to receive a food product; a door; - a radio frequency, RF, heating system configured to provide RF energy into the cooking chamber using solid state electronic components; and - an air circulation system configured to provide air for cooling the solid state electronic components, - wherein the air circulation system comprises: - an inlet cavity disposed below the cooking chamber, - a region housing the solid state electronic components, and - a cooling fan isolating the inlet cavity from the region housing the solid state electronic components to maintain the inlet cavity at a pressure below ambient pressure to draw cooling air into the inlet cavity via an inlet array, and to maintain the region at a pressure above ambient pressure to discharge air that has cooled the solid state electronic components from the oven body, characterized in that the solid state electronic components are housed in an attic region disposed above the cooking chamber, that an outlet of the cooling fan is operably coupled to a riser duct that carries the cooling air upward from below the cooking chamber to the attic region, that the cooling air exits the riser duct into an inlet header disposed in the attic region and is directed from the inlet header to a heat sink operably coupled to power amplifier electronics configured to generate the RF energy, and that a protruding member is disposed between the power amplifier electronics and a portion of the attic region that is proximate to the door of the oven to prevent air leaving the cooking chamber from direct contact with the power amplifier electronics. - an oven body; - a cooking chamber disposed in the oven body and configured to receive a food product; a door; - a radio frequency, RF, heating system configured to provide RF energy into the cooking chamber using solid state electronic components; and - an air circulation system configured to provide air for cooling the solid state electronic components, - wherein the air circulation system comprises: - an inlet cavity disposed below the cooking chamber, - a region housing the solid state electronic components, and - a cooling fan isolating the inlet cavity from the region housing the solid state electronic components to maintain the inlet cavity at a pressure below ambient pressure to draw cooling air into the inlet cavity via an inlet array, and to maintain the region at a pressure above ambient pressure to discharge air that has cooled the solid state electronic components from the oven body, characterized in that the solid state electronic components are housed in an attic region disposed above the cooking chamber, that an outlet of the cooling fan is operably coupled to a riser duct that carries the cooling air upward from below the cooking chamber to the attic region, that the cooling air exits the riser duct into an inlet header disposed in the attic region and is directed from the inlet header to a heat sink operably coupled to power amplifier electronics configured to generate the RF energy, and that a protruding member is disposed between the power amplifier electronics and a portion of the attic region that is proximate to the door of the oven to prevent air leaving the cooking chamber from direct contact with the power amplifier electronics. - an inlet cavity disposed below the cooking chamber, - a region housing the solid state electronic components, and - a cooling fan isolating the inlet cavity from the region housing the solid state electronic components to maintain the inlet cavity at a pressure below ambient pressure to draw cooling air into the inlet cavity via an inlet array, and to maintain the region at a pressure above ambient pressure to discharge air that has cooled the solid state electronic components from the oven body,