A wireless charger, wherein the wireless charger comprises: a housing, wherein the housing has a first air inlet, a first air outlet, a second air inlet and a second air outlet, a heat dissipation air channel that communicates with the first air inlet and the first air outlet and that is located inside the housing being formed between the first air inlet and the first air outlet, and a cooling air channel that is configured to communicate with the second air inlet and the second air outlet and that is located inside the housing is formed between the second air inlet and the second air outlet; a circuit board component, wherein the circuit board component is located in the heat dissipation air channel; a heat conduction structure, wherein the heat conduction structure comprises a contact part and a connection part that are connected to each other, at least a part of the contact part is exposed to an outer surface of the housing, the contact part is configured to be in contact with a to-be-charged device, the connection part is located inside the housing and is in contact with the heat dissipation air channel, the contact part, the outer surface of the housing, and the to-be-charged device are configured to cooperate to form a ventilation channel, and the ventilation channel is configured to communicate with the heat dissipation air channel; a heat dissipation structure, wherein the heat dissipation structure is located in the heat dissipation air channel and is connected to the connection part, the heat dissipation structure is adjacent to the circuit board component, and the heat conduction structure is configured to conduct heat; and wherein the heat dissipation air channel and the cooling air channel are respectively located on two opposite sides of the contact part of the heat conduction structure. a housing, wherein the housing has a first air inlet, a first air outlet, a second air inlet and a second air outlet, a heat dissipation air channel that communicates with the first air inlet and the first air outlet and that is located inside the housing being formed between the first air inlet and the first air outlet, and a cooling air channel that is configured to communicate with the second air inlet and the second air outlet and that is located inside the housing is formed between the second air inlet and the second air outlet; a circuit board component, wherein the circuit board component is located in the heat dissipation air channel; a heat conduction structure, wherein the heat conduction structure comprises a contact part and a connection part that are connected to each other, at least a part of the contact part is exposed to an outer surface of the housing, the contact part is configured to be in contact with a to-be-charged device, the connection part is located inside the housing and is in contact with the heat dissipation air channel, the contact part, the outer surface of the housing, and the to-be-charged device are configured to cooperate to form a ventilation channel, and the ventilation channel is configured to communicate with the heat dissipation air channel; a heat dissipation structure, wherein the heat dissipation structure is located in the heat dissipation air channel and is connected to the connection part, the heat dissipation structure is adjacent to the circuit board component, and the heat conduction structure is configured to conduct heat; and wherein the heat dissipation air channel and the cooling air channel are respectively located on two opposite sides of the contact part of the heat conduction structure.