A method of fabricating a device, comprising: forming microelectromechanical (MEMS) structures on a complementary-metal-oxide- semiconductor (CMOS) substrate hosting an application-specific integrated circuit (ASIC), the ASIC including a last interconnect layer and metallic interconnects; and monolithically integrating a cap with the MEMS structures; wherein: forming the MEMS structures comprises the steps of: A. depositing a mold layer on the last interconnect layer; B. patterning the mold layer using lithography and etching to open up windows down to at least one of the metallic interconnects; C. depositing a structural material; D. planarizing the structural material down to the mold layer to form anchor structures for anchoring part of the MEMS structures; repeating the steps A to D with different lithographic masks to define the free standing parts of the MEMS structures, wherein in step A the mold layer is deposited on the structural material and in step B the windows are opened up in the mold layer down to the adjacent layer of structural material; and etching away the mold layer to form the free standing MEMS structures; and monolithically integrating the cap with the MEMS structures comprises the steps of: simultaneously fabricating the cap legs with the MEMS structures; and completing the cap top. forming microelectromechanical (MEMS) structures on a complementary-metal-oxide- semiconductor (CMOS) substrate hosting an application-specific integrated circuit (ASIC), the ASIC including a last interconnect layer and metallic interconnects; and monolithically integrating a cap with the MEMS structures; wherein: forming the MEMS structures comprises the steps of: A. depositing a mold layer on the last interconnect layer; B. patterning the mold layer using lithography and etching to open up windows down to at least one of the metallic interconnects; C. depositing a structural material; D. planarizing the structural material down to the mold layer to form anchor structures for anchoring part of the MEMS structures; repeating the steps A to D with different lithographic masks to define the free standing parts of the MEMS structures, wherein in step A the mold layer is deposited on the structural material and in step B the windows are opened up in the mold layer down to the adjacent layer of structural material; and etching away the mold layer to form the free standing MEMS structures; and monolithically integrating the cap with the MEMS structures comprises the steps of: simultaneously fabricating the cap legs with the MEMS structures; and completing the cap top. forming the MEMS structures comprises the steps of: A. depositing a mold layer on the last interconnect layer; B. patterning the mold layer using lithography and etching to open up windows down to at least one of the metallic interconnects; C. depositing a structural material; D. planarizing the structural material down to the mold layer to form anchor structures for anchoring part of the MEMS structures; repeating the steps A to D with different lithographic masks to define the free standing parts of the MEMS structures, wherein in step A the mold layer is deposited on the structural material and in step B the windows are opened up in the mold layer down to the adjacent layer of structural material; and etching away the mold layer to form the free standing MEMS structures; and A. depositing a mold layer on the last interconnect layer; B. patterning the mold layer using lithography and etching to open up windows down to at least one of the metallic interconnects; C. depositing a structural material; D. planarizing the structural material down to the mold layer to form anchor structures for anchoring part of the MEMS structures; repeating the steps A to D with different lithographic masks to define the free standing parts of the MEMS structures, wherein in step A the mold layer is deposited on the structural material and in step B the windows are opened up in the mold layer down to the adjacent layer of structural material; and etching away the mold layer to form the free standing MEMS structures; and monolithically integrating the cap with the MEMS structures comprises the steps of: simultaneously fabricating the cap legs with the MEMS structures; and completing the cap top. simultaneously fabricating the cap legs with the MEMS structures; and completing the cap top.