Use of a film with the thermal adhesion peeling stress defined below being 5.88 N/cm or more and the stress retention at an elongation percentage of 200% defined below being 40% or more: Thermal Adhesion Peeling Stress: A maximum stress when separating a film from a cotton fabric after hot-pressing the film to the cotton fabric at a temperature of 130°C under a pressure of 4 bar for 25 seconds; Stress Retention at an Elongation Percentage of 200%: A ratio of a stress (f R) in recovery to a stress (f S) in stretching at an elongation percentage of 200% in an S-S curve drawn when the film is stretched to an elongation percentage of 300% and then recovered, and a value obtained according to the following formula: Stress Retention % = f R / f S × 100 wherein the thermal adhesion peeling stress and the stress retention at an elongation percentage of 200% are determined as described in the description, the film comprising a polyurethane containing structures obtained from the compounds of (i) and (ii) below, and a structure obtained from a chain extender comprising an active hydrogen-containing compound that reacts with an isocyanate group: (i) an organic polyisocyanate compound, and (ii) a polyalkylene ether diol with a molecular weight of 300 to 30,000, comprising structural units represented by the following structural formula and structural formulae and/or and having a composition satisfying the following formula: (̵CH 2 -CH 2 -CH 2 -CH 2 -O)̵ 0.08 ≤ M B + M C / M A + M B + M C ≤ 0.85 wherein M A, M B and M C are molar numbers of structural units, and present in the polyalkylene ether diol, wherein the chain extender comprises an active hydrogen-containing compound that reacts with an isocyanate group is a diol, as a heat adherent film. A maximum stress when separating a film from a cotton fabric after hot-pressing the film to the cotton fabric at a temperature of 130°C under a pressure of 4 bar for 25 seconds; Stress Retention at an Elongation Percentage of 200%: A ratio of a stress (f R) in recovery to a stress (f S) in stretching at an elongation percentage of 200% in an S-S curve drawn when the film is stretched to an elongation percentage of 300% and then recovered, and a value obtained according to the following formula: Stress Retention % = f R / f S × 100 wherein the thermal adhesion peeling stress and the stress retention at an elongation percentage of 200% are determined as described in the description, the film comprising a polyurethane containing structures obtained from the compounds of (i) and (ii) below, and a structure obtained from a chain extender comprising an active hydrogen-containing compound that reacts with an isocyanate group: (i) an organic polyisocyanate compound, and (ii) a polyalkylene ether diol with a molecular weight of 300 to 30,000, comprising structural units represented by the following structural formula and structural formulae and/or and having a composition satisfying the following formula: (̵CH 2 -CH 2 -CH 2 -CH 2 -O)̵ 0.08 ≤ M B + M C / M A + M B + M C ≤ 0.85 wherein M A, M B and M C are molar numbers of structural units, and present in the polyalkylene ether diol, wherein the chain extender comprises an active hydrogen-containing compound that reacts with an isocyanate group is a diol, as a heat adherent film. wherein the thermal adhesion peeling stress and the stress retention at an elongation percentage of 200% are determined as described in the description, the film comprising a polyurethane containing structures obtained from the compounds of (i) and (ii) below, and a structure obtained from a chain extender comprising an active hydrogen-containing compound that reacts with an isocyanate group: (i) an organic polyisocyanate compound, and (ii) a polyalkylene ether diol with a molecular weight of 300 to 30,000, comprising structural units represented by the following structural formula and structural formulae and/or and having a composition satisfying the following formula: (̵CH 2 -CH 2 -CH 2 -CH 2 -O)̵ 0.08 ≤ M B + M C / M A + M B + M C ≤ 0.85 wherein M A, M B and M C are molar numbers of structural units, and present in the polyalkylene ether diol, wherein the chain extender comprises an active hydrogen-containing compound that reacts with an isocyanate group is a diol, as a heat adherent film. (i) an organic polyisocyanate compound, and (ii) a polyalkylene ether diol with a molecular weight of 300 to 30,000, comprising structural units represented by the following structural formula and structural formulae and/or and having a composition satisfying the following formula: (̵CH 2 -CH 2 -CH 2 -CH 2 -O)̵ 0.08 ≤ M B + M C / M A + M B + M C ≤ 0.85 wherein M A, M B and M C are molar numbers of structural units, and present in the polyalkylene ether diol, wherein the chain extender comprises an active hydrogen-containing compound that reacts with an isocyanate group is a diol, as a heat adherent film. wherein M A, M B and M C are molar numbers of structural units, and present in the polyalkylene ether diol, wherein the chain extender comprises an active hydrogen-containing compound that reacts with an isocyanate group is a diol, as a heat adherent film.