Method for producing a carrier card with detachable integrated chip-module card with the following steps: - providing a carrier card in the ID-1 format consisting of a single-layer or multilayer paper, wherein the individual layers (PL1, PL2, PL3) exhibit predetermined material properties, and the individual layers have been connected with water-resistant adhesive, - a- producing a cavity, the cavity having one or more stages, so that at least an outer (ÄTK) and an inner partial cavity are formed, by - a1- first notching of the carrier card along a contour of the outer partial cavity (ÄTK) to be introduced into the carrier card; - a2- removing paper material within the first contour for the purpose of producing the outer partial cavity (ÄTK) to be introduced into the carrier card; - a4- removing paper material within a second contour of the inner partial cavity to be introduced into the carrier card; - b- shaping the detachable integrated chip-module card(s) in the mini-SIM, micro-SIM, nano-SIM and/or embedded-SIM format with notches or through-notches and/or ridges (St) between each detachable integrated chip-module card and the rest of the carrier card; and - c- gluing an integrated chip module (ChM) into the cavity. - providing a carrier card in the ID-1 format consisting of a single-layer or multilayer paper, wherein the individual layers (PL1, PL2, PL3) exhibit predetermined material properties, and the individual layers have been connected with water-resistant adhesive, - a- producing a cavity, the cavity having one or more stages, so that at least an outer (ÄTK) and an inner partial cavity are formed, by - a1- first notching of the carrier card along a contour of the outer partial cavity (ÄTK) to be introduced into the carrier card; - a2- removing paper material within the first contour for the purpose of producing the outer partial cavity (ÄTK) to be introduced into the carrier card; - a4- removing paper material within a second contour of the inner partial cavity to be introduced into the carrier card; - b- shaping the detachable integrated chip-module card(s) in the mini-SIM, micro-SIM, nano-SIM and/or embedded-SIM format with notches or through-notches and/or ridges (St) between each detachable integrated chip-module card and the rest of the carrier card; and - c- gluing an integrated chip module (ChM) into the cavity. - a- producing a cavity, the cavity having one or more stages, so that at least an outer (ÄTK) and an inner partial cavity are formed, by - a1- first notching of the carrier card along a contour of the outer partial cavity (ÄTK) to be introduced into the carrier card; - a2- removing paper material within the first contour for the purpose of producing the outer partial cavity (ÄTK) to be introduced into the carrier card; - a4- removing paper material within a second contour of the inner partial cavity to be introduced into the carrier card; - a1- first notching of the carrier card along a contour of the outer partial cavity (ÄTK) to be introduced into the carrier card; - a2- removing paper material within the first contour for the purpose of producing the outer partial cavity (ÄTK) to be introduced into the carrier card; - a4- removing paper material within a second contour of the inner partial cavity to be introduced into the carrier card; - b- shaping the detachable integrated chip-module card(s) in the mini-SIM, micro-SIM, nano-SIM and/or embedded-SIM format with notches or through-notches and/or ridges (St) between each detachable integrated chip-module card and the rest of the carrier card; and - c- gluing an integrated chip module (ChM) into the cavity.