An LED module, comprising: a package, including: a package body having a recess portion, electrode pads (4a, 4b) formed on opposite end surfaces of the package body, an LED chip, a zener diode chip for limiting a voltage applied to the LED chip, wherein the LED chip and the zener diode chip are arranged on a bottom of the recess portion, a through-hole having an inner circumferential surface that is plated with metal and that is electrically connected to one of the electrode pads (4a, 4b), ribs (23a, 23b) provided on the bottom of the recess portion that protrude toward the upper side of the recess portion from a region between the LED chip and the zener diode chip and from a region between the LED chip and the through hole, a conductive pattern that is electrically connected to the through-hole and that is formed in the recess portion of the package body, bonding pads (28a, 28b) that are formed on the ribs (23a, 23b) and that are provided in a continuous relationship with the conductive pattern, wherein the bonding pads (28a, 28b) are connected via bonding wires (25a, 25b) to an upper electrode of the LED chip and to an upper electrode of the zener diode chip; and a substrate on whose upper surface the package is arranged, the substrate including: a base member made of copper-based metal, an insulating layer made of an insulating material and stacked on a surface of the base member, an electrically conductive wiring pattern formed on a surface of the insulating layer and soldered to the electrode pads (4a, 4b), wherein the insulating layer includes a through portion formed by partially removing a region of the insulating layer, and a heat dissipation member made of a solder that is arranged between a bottom surface of the package and the base member, the bottom surface of the package and the base member being opposite to each other through the through portion. a package, including: a package body having a recess portion, electrode pads (4a, 4b) formed on opposite end surfaces of the package body, an LED chip, a zener diode chip for limiting a voltage applied to the LED chip, wherein the LED chip and the zener diode chip are arranged on a bottom of the recess portion, a through-hole having an inner circumferential surface that is plated with metal and that is electrically connected to one of the electrode pads (4a, 4b), ribs (23a, 23b) provided on the bottom of the recess portion that protrude toward the upper side of the recess portion from a region between the LED chip and the zener diode chip and from a region between the LED chip and the through hole, a package body having a recess portion, electrode pads (4a, 4b) formed on opposite end surfaces of the package body, an LED chip, a zener diode chip for limiting a voltage applied to the LED chip, wherein the LED chip and the zener diode chip are arranged on a bottom of the recess portion, a through-hole having an inner circumferential surface that is plated with metal and that is electrically connected to one of the electrode pads (4a, 4b), ribs (23a, 23b) provided on the bottom of the recess portion that protrude toward the upper side of the recess portion from a region between the LED chip and the zener diode chip and from a region between the LED chip and the through hole, a conductive pattern that is electrically connected to the through-hole and that is formed in the recess portion of the package body, bonding pads (28a, 28b) that are formed on the ribs (23a, 23b) and that are provided in a continuous relationship with the conductive pattern, wherein the bonding pads (28a, 28b) are connected via bonding wires (25a, 25b) to an upper electrode of the LED chip and to an upper electrode of the zener diode chip; and a substrate on whose upper surface the package is arranged, the substrate including: a base member made of copper-based metal, an insulating layer made of an insulating material and stacked on a surface of the base member, an electrically conductive wiring pattern formed on a surface of the insulating layer and soldered to the electrode pads (4a, 4b), wherein the insulating layer includes a through portion formed by partially removing a region of the insulating layer, and a heat dissipation member made of a solder that is arranged between a bottom surface of the package and the base member, the bottom surface of the package and the base member being opposite to each other through the through portion. a base member made of copper-based metal, an insulating layer made of an insulating material and stacked on a surface of the base member, an electrically conductive wiring pattern formed on a surface of the insulating layer and soldered to the electrode pads (4a, 4b), wherein the insulating layer includes a through portion formed by partially removing a region of the insulating layer, and a heat dissipation member made of a solder that is arranged between a bottom surface of the package and the base member, the bottom surface of the package and the base member being opposite to each other through the through portion.