A solder supply device comprising a solder cutting device (77,160) for cutting solder supplied from a dispensing nozzle using ejection of a gas and characterized by further comprising: a solder cup for housing liquid solder inside, wherein a flange section is formed on an outer circumferential surface at an opening side of the solder cup; an outer tube being a bottomed cylinder with an opening at one end in which the solder cup is slidably stored, wherein the outer tube has a first inner circumferential surface, positioned at the opening side of the outer tube, and a second inner circumferential surface, positioned at the bottom surface of the outer tube; the inside diameter of the first inner circumferential surface is slightly larger than the outer diameter of the flange section of the solder cup; the inside diameter of the second inner circumferential surface is slightly larger than the outer diameter of the tubular section of the solder cup wherein the flange section of the solder cup stored in the outer tube contacts a step surface between the first inner circumferential surface and the second inner circumferential surface of the outer tube, thereby forming a space between the bottom surface of the solder cup and the bottom surface of the outer tube; an inner tube for holding the dispensing nozzle; a fixed lid in form of a ring, removably attached to the opening of the outer tube; wherein the inner tube is fixed to the lid; a dispensing nozzle for dispensing solder housed in the solder cup; an internal pressure changing device for changing the pressure inside the space; and a control device for controlling operation of the solder cutting device (77, 160) and the internal pressure changing device, wherein in use the solder supply device is configured to supply solder from the dispensing nozzle by increasing pressure inside the space using the internal pressure changing device, and wherein the control device includes an internal pressure changing device control section for controlling operation of the internal pressure changing device such that in use pressure inside the space decreases when supply of solder from the dispensing nozzle is stopped, and a solder cutting device control section for controlling the solder cutting device (77, 160) such that in use solder is cut by ejecting a gas as pressure inside the space is decreased by control of the internal pressure changing device control section. a solder cup for housing liquid solder inside, wherein a flange section is formed on an outer circumferential surface at an opening side of the solder cup; an outer tube being a bottomed cylinder with an opening at one end in which the solder cup is slidably stored, wherein the outer tube has a first inner circumferential surface, positioned at the opening side of the outer tube, and a second inner circumferential surface, positioned at the bottom surface of the outer tube; the inside diameter of the first inner circumferential surface is slightly larger than the outer diameter of the flange section of the solder cup; the inside diameter of the second inner circumferential surface is slightly larger than the outer diameter of the tubular section of the solder cup wherein the flange section of the solder cup stored in the outer tube contacts a step surface between the first inner circumferential surface and the second inner circumferential surface of the outer tube, thereby forming a space between the bottom surface of the solder cup and the bottom surface of the outer tube; an inner tube for holding the dispensing nozzle; a fixed lid in form of a ring, removably attached to the opening of the outer tube; wherein the inner tube is fixed to the lid; a dispensing nozzle for dispensing solder housed in the solder cup; an internal pressure changing device for changing the pressure inside the space; and a control device for controlling operation of the solder cutting device (77, 160) and the internal pressure changing device, wherein in use the solder supply device is configured to supply solder from the dispensing nozzle by increasing pressure inside the space using the internal pressure changing device, and wherein the control device includes an internal pressure changing device control section for controlling operation of the internal pressure changing device such that in use pressure inside the space decreases when supply of solder from the dispensing nozzle is stopped, and a solder cutting device control section for controlling the solder cutting device (77, 160) such that in use solder is cut by ejecting a gas as pressure inside the space is decreased by control of the internal pressure changing device control section.