A chip package assembly, comprising: a package substrate, comprising an upper conductive layer, a lower conductive layer, and a conductive part connected between the upper conductive layer and the lower conductive layer; a chip, comprising a front electrode and a back electrode that are disposed opposite to each other, wherein the chip is embedded in the package substrate, the conductive part surrounds the chip, the front electrode is connected to the lower conductive layer, and the back electrode is connected to the upper conductive layer; and a heat dissipation part, connected to a surface of the upper conductive layer that is away from the chip, wherein the upper conductive layer, the lower conductive layer, and the conductive part each have a heat-conducting property; wherein the heat dissipation part comprises a plurality of heat dissipation units, the plurality of heat dissipation units each are connected to the upper conductive layer, and the plurality of heat dissipation units are spaced from each other; wherein an extension direction of each heat dissipation unit and an extension direction of the upper conductive layer are arranged at an included angle; characterized in that an extension direction of some heat dissipation units is a first direction, an extension direction of some heat dissipation units is a second direction, and the first direction is different from the second direction and wherein, a first refrigeration part is disposed on a periphery of the chip package assembly in the first direction and a second refrigeration part is disposed on a periphery of the chip package assembly in the second direction. a package substrate, comprising an upper conductive layer, a lower conductive layer, and a conductive part connected between the upper conductive layer and the lower conductive layer; a chip, comprising a front electrode and a back electrode that are disposed opposite to each other, wherein the chip is embedded in the package substrate, the conductive part surrounds the chip, the front electrode is connected to the lower conductive layer, and the back electrode is connected to the upper conductive layer; and a heat dissipation part, connected to a surface of the upper conductive layer that is away from the chip, wherein the upper conductive layer, the lower conductive layer, and the conductive part each have a heat-conducting property; wherein the heat dissipation part comprises a plurality of heat dissipation units, the plurality of heat dissipation units each are connected to the upper conductive layer, and the plurality of heat dissipation units are spaced from each other; wherein an extension direction of each heat dissipation unit and an extension direction of the upper conductive layer are arranged at an included angle; characterized in that an extension direction of some heat dissipation units is a first direction, an extension direction of some heat dissipation units is a second direction, and the first direction is different from the second direction and wherein, a first refrigeration part is disposed on a periphery of the chip package assembly in the first direction and a second refrigeration part is disposed on a periphery of the chip package assembly in the second direction.