A force sensor comprising: a package substrate having a plurality of die connecting pads (275, 315) on a top surface and a plurality of dye connecting pads (275, 315) on a bottom surface; a piezo-electric force-sensing die having a bottom surface and a substantially-planar top surface, the substantially-planar top surface having a plurality of electrical interconnects for connection to the plurality of connecting pads (275, 315) on the top surface of the package substrate, force-sensing die has a reduced thickness between the bottom surface and the top surface in a central region of the force-sensing die, wherein the top surface of the force-sensing die is facing the top surface of the package substrate and the plurality of electrical interconnects on the top surface of the force-sensing die are electrically connected to the plurality of connecting pads (275, 315) on the top surface of the package substrate; and a force transfer member in mechanical contact with the central region of the force-sensing die, wherein the central region of the force-sensing die deflects toward the top surface of the substrate in response to an applied force applied to the force transfer member and directed toward the force-sensing die; and a signal-conditioning die having a plurality of electrical interconnects for connection to the plurality of connecting pads (275, 315) on the bottom surface of the package substrate; wherein the die connecting pads on the top surface of the package substrate (275, 315) are electrically connected to the force-sensing die via a solder connection; wherein the solder connection (275, 315) determines the predetermined deflection limit between the top surface of the substrate and the substantially-planar top surface of the force-sensing die; wherein when the applied force exceeds a predetermined value, the top surface of the package substrate limits deflection of the top surface of the force-sensing die through contact between the top surface of the package substrate and the top surface of the force-sensing die such that the force-sensing die is not deflected beyond a predetermined deflection limit. a package substrate having a plurality of die connecting pads (275, 315) on a top surface and a plurality of dye connecting pads (275, 315) on a bottom surface; a piezo-electric force-sensing die having a bottom surface and a substantially-planar top surface, the substantially-planar top surface having a plurality of electrical interconnects for connection to the plurality of connecting pads (275, 315) on the top surface of the package substrate, force-sensing die has a reduced thickness between the bottom surface and the top surface in a central region of the force-sensing die, wherein the top surface of the force-sensing die is facing the top surface of the package substrate and the plurality of electrical interconnects on the top surface of the force-sensing die are electrically connected to the plurality of connecting pads (275, 315) on the top surface of the package substrate; and a force transfer member in mechanical contact with the central region of the force-sensing die, wherein the central region of the force-sensing die deflects toward the top surface of the substrate in response to an applied force applied to the force transfer member and directed toward the force-sensing die; and a signal-conditioning die having a plurality of electrical interconnects for connection to the plurality of connecting pads (275, 315) on the bottom surface of the package substrate; wherein the die connecting pads on the top surface of the package substrate (275, 315) are electrically connected to the force-sensing die via a solder connection; wherein the solder connection (275, 315) determines the predetermined deflection limit between the top surface of the substrate and the substantially-planar top surface of the force-sensing die; wherein when the applied force exceeds a predetermined value, the top surface of the package substrate limits deflection of the top surface of the force-sensing die through contact between the top surface of the package substrate and the top surface of the force-sensing die such that the force-sensing die is not deflected beyond a predetermined deflection limit.