Test method for testing a connective layer between wafer-shaped samples (5, 6) using a test device (1, 2, 3) for testing a connective layer between wafer-shaped samples (5, 6), whereby the test device comprises: - a layer thickness measuring head, designed for an OCT method, that directs an optical measuring beam onto a composite comprising at least two wafer-shaped samples (5, 6) between which is arranged a connective layer; - an optical beam splitter plane designed to divert an optical reference beam as a reference arm for distance measurements; - an evaluation unit designed to evaluate layer thickness measurements without the reference arm and distance measurements with the reference arm; whereby an optical switching device is designed to switch on and off the reference arm, whereby the test method comprises the following steps: - determining a two-dimensional layer thickness image of the connective layer by means of the OCT method; - setting the layer thickness measurement head to a determined defect region of the connective layer, narrowing a depth measurement region to less than 10 interference maxima; - recording a layer thickness profile along a measurement track in the defect region with the reference arm of the test device (1, 2, 3) masked; - recording a distance measurement profile on the same measurement track with the reference arm of the test device (1, 2, 3) switched on; - recording a profile scan with alternating measurement of the layer thickness with the reference arm masked and the distance with the reference arm switched on at identical scan positions on the measurement track; - comparison of the profile scan with the layer thickness profile and the distance profile to classify measured peak values as thickness measurement values or distance measurement values. - a layer thickness measuring head, designed for an OCT method, that directs an optical measuring beam onto a composite comprising at least two wafer-shaped samples (5, 6) between which is arranged a connective layer; - an optical beam splitter plane designed to divert an optical reference beam as a reference arm for distance measurements; - an evaluation unit designed to evaluate layer thickness measurements without the reference arm and distance measurements with the reference arm; - determining a two-dimensional layer thickness image of the connective layer by means of the OCT method; - setting the layer thickness measurement head to a determined defect region of the connective layer, narrowing a depth measurement region to less than 10 interference maxima; - recording a layer thickness profile along a measurement track in the defect region with the reference arm of the test device (1, 2, 3) masked; - recording a distance measurement profile on the same measurement track with the reference arm of the test device (1, 2, 3) switched on; - recording a profile scan with alternating measurement of the layer thickness with the reference arm masked and the distance with the reference arm switched on at identical scan positions on the measurement track; - comparison of the profile scan with the layer thickness profile and the distance profile to classify measured peak values as thickness measurement values or distance measurement values.