A multi-beam chip integration module, comprising a first printing board, at least one set of first-type chips, and at least one set of second-type chips, wherein the at least one set of first-type chips is surface mounted to a first side of the first printing board, wherein the at least one set of second-type chips is surface mounted to a second side of the first printing board, and wherein the second side of the first printing board is an opposite side parallel to the first side of the first printing board; wherein the first-type chips are multi-beam channel chips, while the second-type chips are multi-beam synthesis network chips; the number of the multi-beam synthesis network chips being 1, and the number of the multi-beam channel chips being 4; wherein each set of multi-beam channel chips are respectively connected to different pins in the multi-beam synthesis network chip through a multilayer network constructed by different beam channels in the first printed board; wherein signal pins in each set of multi-beam channel chips are respectively connected to different radio frequency signal channels in the first printed board, so as to be connected to corresponding antenna units; wherein the multi-beam synthesis network chip is configured to perform network synthesis or decomposition of input and output signals of the multi-beam channel chips; wherein there are two layers of multi-beam synthesis network chips, wherein the multi-beam synthesis network chips of the lower layer are respectively connected to corresponding multi-beam channel chips, and the multi-beam synthesis network chips of the upper layer are respectively connected to an external control device and multi-beam synthesis network chips of the lower layer. wherein the at least one set of first-type chips is surface mounted to a first side of the first printing board, wherein the at least one set of second-type chips is surface mounted to a second side of the first printing board, and wherein the second side of the first printing board is an opposite side parallel to the first side of the first printing board; wherein the first-type chips are multi-beam channel chips, while the second-type chips are multi-beam synthesis network chips; the number of the multi-beam synthesis network chips being 1, and the number of the multi-beam channel chips being 4; wherein each set of multi-beam channel chips are respectively connected to different pins in the multi-beam synthesis network chip through a multilayer network constructed by different beam channels in the first printed board; wherein signal pins in each set of multi-beam channel chips are respectively connected to different radio frequency signal channels in the first printed board, so as to be connected to corresponding antenna units; wherein the multi-beam synthesis network chip is configured to perform network synthesis or decomposition of input and output signals of the multi-beam channel chips; wherein there are two layers of multi-beam synthesis network chips, wherein the multi-beam synthesis network chips of the lower layer are respectively connected to corresponding multi-beam channel chips, and the multi-beam synthesis network chips of the upper layer are respectively connected to an external control device and multi-beam synthesis network chips of the lower layer.