A laser processing method performed in a laser processing system, the laser processing system comprising a laser processing device, pattern storage means, pattern creation means, the method comprising: irradiating, with the laser processing device, an object to be processed with laser light modulated by a spatial light modulator so as to form a modified region (7, SD1-SD7) in the object; storing, in the pattern storage means, a plurality of kinds of element patterns to become elements for a modulation pattern for subjecting the laser light to a predetermined modulation in the spatial light modulator; and acquiring, with the pattern creation means, one or a plurality of kinds of element patterns for the modified region from the pattern storage means according to a condition for forming the modified region for the object, wherein the laser processing device is provided either with the one kind of element pattern as the modulation pattern for forming the modified region corresponding thereto, or with a composite pattern combining the plurality of element patterns as the modulation pattern for forming the modified region corresponding thereto, the laser processing method further comprising: relatively moving a converging point of the laser light along a line to cut the object having a planar form while using one main face of the object as a laser light entrance surface, so as to form modified regions to become a starting point region for cutting at a position closer to the other main face of the object, a position closer to the one main face, and an intermediate position between the position closer to the other main face and the position closer to the one main face, and storing, with the pattern storage means, a quality pattern (J-01-J-10) as the element pattern, the quality pattern (J-01-J-10) having a first brightness region extending in a direction intersecting the line and second brightness regions located on both sides of the first brightness region in an extending direction of the line, and using the quality pattern for forming the modified region at the intermediate position after forming the modified region at the position closer to the other main face but before forming the modified region at the position closer to the one main face. irradiating, with the laser processing device, an object to be processed with laser light modulated by a spatial light modulator so as to form a modified region (7, SD1-SD7) in the object; storing, in the pattern storage means, a plurality of kinds of element patterns to become elements for a modulation pattern for subjecting the laser light to a predetermined modulation in the spatial light modulator; and acquiring, with the pattern creation means, one or a plurality of kinds of element patterns for the modified region from the pattern storage means according to a condition for forming the modified region for the object, wherein the laser processing device is provided either with the one kind of element pattern as the modulation pattern for forming the modified region corresponding thereto, or with a composite pattern combining the plurality of element patterns as the modulation pattern for forming the modified region corresponding thereto, the laser processing method further comprising: relatively moving a converging point of the laser light along a line to cut the object having a planar form while using one main face of the object as a laser light entrance surface, so as to form modified regions to become a starting point region for cutting at a position closer to the other main face of the object, a position closer to the one main face, and an intermediate position between the position closer to the other main face and the position closer to the one main face, and storing, with the pattern storage means, a quality pattern (J-01-J-10) as the element pattern, the quality pattern (J-01-J-10) having a first brightness region extending in a direction intersecting the line and second brightness regions located on both sides of the first brightness region in an extending direction of the line, and using the quality pattern for forming the modified region at the intermediate position after forming the modified region at the position closer to the other main face but before forming the modified region at the position closer to the one main face. relatively moving a converging point of the laser light along a line to cut the object having a planar form while using one main face of the object as a laser light entrance surface, so as to form modified regions to become a starting point region for cutting at a position closer to the other main face of the object, a position closer to the one main face, and an intermediate position between the position closer to the other main face and the position closer to the one main face, and storing, with the pattern storage means, a quality pattern (J-01-J-10) as the element pattern, the quality pattern (J-01-J-10) having a first brightness region extending in a direction intersecting the line and second brightness regions located on both sides of the first brightness region in an extending direction of the line, and using the quality pattern for forming the modified region at the intermediate position after forming the modified region at the position closer to the other main face but before forming the modified region at the position closer to the one main face.