A method of manufacturing a resized liquid crystal display panel by cutting a ready-made liquid crystal display panel comprising a color filter substrate and a thin film transistor substrate to a desired size, the method comprising: cutting the TFT substrate to a desired size; cutting the color filter substrate so as to have a length smaller than a length of the TFT substrate such that a pixel exposure portion, from which horizontal pixel lines are exposed along the cutting direction of the color filter and TFT substrate, is formed at the TFT substrate; forming an open-circuit line for open-circuiting a portion defined between an exposed horizontal pixel line that is located at an end of the TFT substrate and another horizontal pixel line adjacent thereto in order to prevent electrical noise due to the horizontal pixel lines being exposed at the end of the TFT substrate in the pixel exposure portion; and forming a reinforcement seal for covering the pixel exposure portion using a reinforcement material in order to prevent occurrence of short circuit due to introduction of foreign matter into a gap defined between the horizontal pixel line and the other horizontal pixel line and at the same time to increase rigidity of the pixel exposure portion, wherein the step of forming the reinforcement seal comprises applying the reinforcement material through an application nozzle for applying the reinforcement material, the application nozzle being disposed at an end of the color filter substrate so as to be inclined toward the end of the TFT substrate in order to spray the reinforcement material, such that the reinforcement material moves from the end of the color filter substrate toward the end of the TFT substrate and such that foreign matter on the pixel exposure portion is pushed to the end of the TFT substrate by the reinforcement material that is applied and is thus removed, and further comprising: applying a sealing material for preventing foreign matter from flowing into a gap defined between the color filter substrate and the TFT substrate when the open-circuit line is formed in order to form a hermetically sealing seal, wherein the step of forming the hermetically sealing seal is performed between the step of cutting the color filter substrate so as to have the smaller length and the step of forming the open-circuit line. cutting the TFT substrate to a desired size; cutting the color filter substrate so as to have a length smaller than a length of the TFT substrate such that a pixel exposure portion, from which horizontal pixel lines are exposed along the cutting direction of the color filter and TFT substrate, is formed at the TFT substrate; forming an open-circuit line for open-circuiting a portion defined between an exposed horizontal pixel line that is located at an end of the TFT substrate and another horizontal pixel line adjacent thereto in order to prevent electrical noise due to the horizontal pixel lines being exposed at the end of the TFT substrate in the pixel exposure portion; and forming a reinforcement seal for covering the pixel exposure portion using a reinforcement material in order to prevent occurrence of short circuit due to introduction of foreign matter into a gap defined between the horizontal pixel line and the other horizontal pixel line and at the same time to increase rigidity of the pixel exposure portion, wherein the step of forming the reinforcement seal comprises applying the reinforcement material through an application nozzle for applying the reinforcement material, the application nozzle being disposed at an end of the color filter substrate so as to be inclined toward the end of the TFT substrate in order to spray the reinforcement material, such that the reinforcement material moves from the end of the color filter substrate toward the end of the TFT substrate and such that foreign matter on the pixel exposure portion is pushed to the end of the TFT substrate by the reinforcement material that is applied and is thus removed, and further comprising: applying a sealing material for preventing foreign matter from flowing into a gap defined between the color filter substrate and the TFT substrate when the open-circuit line is formed in order to form a hermetically sealing seal, wherein the step of forming the hermetically sealing seal is performed between the step of cutting the color filter substrate so as to have the smaller length and the step of forming the open-circuit line. applying a sealing material for preventing foreign matter from flowing into a gap defined between the color filter substrate and the TFT substrate when the open-circuit line is formed in order to form a hermetically sealing seal, wherein the step of forming the hermetically sealing seal is performed between the step of cutting the color filter substrate so as to have the smaller length and the step of forming the open-circuit line.