A method for producing a wired circuit board, the method comprising the steps of: preparing a metal supporting board; forming a metal foil on the metal supporting board; forming an insulating base layer on the metal supporting board to cover the metal foil; forming an opening in the insulating base layer to expose the metal foil; forming a conductive pattern having a terminal portion and a plating lead connected to the terminal portion on the insulating base layer; forming an electrolytic plating layer on a surface of the terminal portion by electrolytic plating for causing conduction in the wired circuit board via the plating lead; and, determining whether or not the electrolytic plating layer is formed on a surface of the metal foil exposed from the opening after forming the electrolytic plating layer to inspect conduction between the metal foil and the conductive pattern, characterized in that the determining step can confirm: that when the electrolytic plating layer is formed on the surface of the metal foil exposed form the opening, the wired circuit board is determined as a defective product in assuming that the metal foil and the conductive pattern are conducted; and that when the electrolytic plating layer is not formed on the surface of the metal foil exposed from the opening, the wired circuit board is determined as a nondefective product in assuming that the metal foil and the conductive pattern are not conducted. preparing a metal supporting board; forming a metal foil on the metal supporting board; forming an insulating base layer on the metal supporting board to cover the metal foil; forming an opening in the insulating base layer to expose the metal foil; forming a conductive pattern having a terminal portion and a plating lead connected to the terminal portion on the insulating base layer; forming an electrolytic plating layer on a surface of the terminal portion by electrolytic plating for causing conduction in the wired circuit board via the plating lead; and, determining whether or not the electrolytic plating layer is formed on a surface of the metal foil exposed from the opening after forming the electrolytic plating layer to inspect conduction between the metal foil and the conductive pattern, characterized in that the determining step can confirm: that when the electrolytic plating layer is formed on the surface of the metal foil exposed form the opening, the wired circuit board is determined as a defective product in assuming that the metal foil and the conductive pattern are conducted; and that when the electrolytic plating layer is not formed on the surface of the metal foil exposed from the opening, the wired circuit board is determined as a nondefective product in assuming that the metal foil and the conductive pattern are not conducted. that when the electrolytic plating layer is formed on the surface of the metal foil exposed form the opening, the wired circuit board is determined as a defective product in assuming that the metal foil and the conductive pattern are conducted; and that when the electrolytic plating layer is not formed on the surface of the metal foil exposed from the opening, the wired circuit board is determined as a nondefective product in assuming that the metal foil and the conductive pattern are not conducted.