A thermal-type flowmeter comprising: a sub-path adapted to take in a fluid under measurement, a sensor element configured to measure a flow-rate of the fluid under measurement in the sub-path, a temperature detection element configured to detect a temperature of the fluid under measurement, a drive circuit for controlling a heating temperature of the sensor element, and a protection circuit configured to protect the drive circuit from noise, a cavity being formed on a substrate of the sensor element, an exothermic resistor being provided on a thin-film part on the cavity through the intermediary of an electrically insulating film, and in use, a flow rate being detected on the basis of temperature distribution in the thin-film part, wherein the sensor element and the drive circuit are mounted on a metal lead frame via an adhesive, wherein the entire periphery of the sensor element, the drive circuit, and the lead frame has been encapsulated with a thermosetting resin to thereby complete a chip package, wherein the thin-film part is partially exposed out of the thermosetting resin, wherein the lead frame includes input-output terminals, the input-output terminals having input-output terminal portions for receiving power from and outputting a signal to an outside of the thermosetting resin and a mount portion on which the drive circuit is mounted wherein the input-output terminal portions protrude out of the thermosetting resin at one end of the chip package and the input-output terminals include a terminal integrally formed with the mount portion and terminals formed separately of the mount portion, each of the later being electrically coupled to the drive circuit via a bonding wire, wherein the thermal-type flowmeter is characterized in that: the temperature detection element is directly mounted on the metal lead frame via an electrically conductive adhesive, at least one of a chip component of the protection circuit and the air-temperature detection element is consolidated inside the chip package, and wherein the protection circuit is a plurality of chip capacitors, each one being directly mounted on the lead frame via the electrically conductive adhesive for linking the terminal integrally formed with the mount portion and one of the terminals formed separately of the mount portion. a sub-path adapted to take in a fluid under measurement, a sensor element configured to measure a flow-rate of the fluid under measurement in the sub-path, a temperature detection element configured to detect a temperature of the fluid under measurement, a drive circuit for controlling a heating temperature of the sensor element, and a protection circuit configured to protect the drive circuit from noise, a cavity being formed on a substrate of the sensor element, an exothermic resistor being provided on a thin-film part on the cavity through the intermediary of an electrically insulating film, and in use, a flow rate being detected on the basis of temperature distribution in the thin-film part, wherein the sensor element and the drive circuit are mounted on a metal lead frame via an adhesive, wherein the entire periphery of the sensor element, the drive circuit, and the lead frame has been encapsulated with a thermosetting resin to thereby complete a chip package, wherein the thin-film part is partially exposed out of the thermosetting resin, wherein the lead frame includes input-output terminals, the input-output terminals having input-output terminal portions for receiving power from and outputting a signal to an outside of the thermosetting resin and a mount portion on which the drive circuit is mounted wherein the input-output terminal portions protrude out of the thermosetting resin at one end of the chip package and the input-output terminals include a terminal integrally formed with the mount portion and terminals formed separately of the mount portion, each of the later being electrically coupled to the drive circuit via a bonding wire, wherein the thermal-type flowmeter is characterized in that: the temperature detection element is directly mounted on the metal lead frame via an electrically conductive adhesive, at least one of a chip component of the protection circuit and the air-temperature detection element is consolidated inside the chip package, and wherein the protection circuit is a plurality of chip capacitors, each one being directly mounted on the lead frame via the electrically conductive adhesive for linking the terminal integrally formed with the mount portion and one of the terminals formed separately of the mount portion. the temperature detection element is directly mounted on the metal lead frame via an electrically conductive adhesive, at least one of a chip component of the protection circuit and the air-temperature detection element is consolidated inside the chip package, and wherein the protection circuit is a plurality of chip capacitors, each one being directly mounted on the lead frame via the electrically conductive adhesive for linking the terminal integrally formed with the mount portion and one of the terminals formed separately of the mount portion.