The use of molding compositions for 3D printing, comprising components A, B1, B2 and C: A: 5 to 100 wt% of at least one vinylaromatic-diene block copolymer A containing: a) 30 to 95 wt% of at least one vinylaromatic, and b) 5 to 70 wt% of at least one diene, where a) and b) add up to 100 wt%, B1: 0 to 95 wt% of at least one polymer B1 selected from the group consisting of: standard polystyrene, high-impact polystyrene (HIPS), styrene-acrylonitrile copolymers, α-methylstyrene-acrylonitrile copolymers, styrene-maleic anhydride copolymers, styrene-phenylmaleimide copolymers, styrene-methyl methacrylate copolymers, styrene-acrylonitrile-maleic anhydride copolymers, styrene-acrylonitrile-phenylmaleimide copolymers, α-methylstyrene-acrylonitrile-methyl methacrylate copolymers, α-methylstyrene-acrylonitrile-tert-butyl methacrylate copolymers, and styrene-acrylonitrile-tert-butyl methacrylate copolymers, B2: 0 to 60 wt% of one or more further polymers B2 selected from: polycarbonates, polyamides, poly(meth)acrylates, polyesters, semicrystalline polyolefins, and polyvinyl chloride, C: 0 to 50 wt% of customary additives and auxiliaries, where the fractions of A, B1, B2, and C are based in each case on the overall molding composition, and their sum makes 100 wt%, characterized in that the viscosity (measured to ISO 11443) of the molding composition at shear rates of 1 to 10 1/s and at temperatures of 250°C is not higher than 1×10 5 Pa*s and the melt volume rate (MVR, measured to ISO 1133 at 220°C and 10 kg load) is more than 6 ml/10 min, the residual monomer content of the molding composition is not more than 1000 ppm, and the solvent content is not more than 1000 ppm. A: 5 to 100 wt% of at least one vinylaromatic-diene block copolymer A containing: a) 30 to 95 wt% of at least one vinylaromatic, and b) 5 to 70 wt% of at least one diene, where a) and b) add up to 100 wt%, a) 30 to 95 wt% of at least one vinylaromatic, and b) 5 to 70 wt% of at least one diene, B1: 0 to 95 wt% of at least one polymer B1 selected from the group consisting of: standard polystyrene, high-impact polystyrene (HIPS), styrene-acrylonitrile copolymers, α-methylstyrene-acrylonitrile copolymers, styrene-maleic anhydride copolymers, styrene-phenylmaleimide copolymers, styrene-methyl methacrylate copolymers, styrene-acrylonitrile-maleic anhydride copolymers, styrene-acrylonitrile-phenylmaleimide copolymers, α-methylstyrene-acrylonitrile-methyl methacrylate copolymers, α-methylstyrene-acrylonitrile-tert-butyl methacrylate copolymers, and styrene-acrylonitrile-tert-butyl methacrylate copolymers, B2: 0 to 60 wt% of one or more further polymers B2 selected from: polycarbonates, polyamides, poly(meth)acrylates, polyesters, semicrystalline polyolefins, and polyvinyl chloride, C: 0 to 50 wt% of customary additives and auxiliaries, where the fractions of A, B1, B2, and C are based in each case on the overall molding composition, and their sum makes 100 wt%, characterized in that the viscosity (measured to ISO 11443) of the molding composition at shear rates of 1 to 10 1/s and at temperatures of 250°C is not higher than 1×10 5 Pa*s and the melt volume rate (MVR, measured to ISO 1133 at 220°C and 10 kg load) is more than 6 ml/10 min, the residual monomer content of the molding composition is not more than 1000 ppm, and the solvent content is not more than 1000 ppm.