A component mounting machine comprising: multiple component transfer devices (41, 42) that each have a mounting nozzle that is configured to hold and release a component, a movable section (44, 45, 46) that is configured to support the mounting nozzle, and an XY driving mechanism that is configured to drive the movable section in an X-axis direction and a Y-axis direction in a horizontal plane, the component transfer devices (41, 42) being configured to perform a component mounting operation for collecting the component from a component supply device (31, 32) and mounting the component on a positionally aligned board (K1, K2); and a control device that is configured to control the component mounting operation that is performed by the multiple component transfer devices (41, 42) on one board (K1, K2) sequentially positionally aligned by the board conveyance device (21, 22) and to perform thermal correction processing that reduces influence of thermal deformation on the component mounting operation of each of the component transfer devices (41, 42) accompanying temperature change of at least one of the movable section (44, 45, 46) and the XY driving mechanism, wherein the control device includes an implementation period determination section that is configured to individually determine an implementation period of the thermal correction processing for each of the component transfer devices (41, 42) based on operation circumstances of each component transfer device (41, 42), the component mounting machine being characterized in that the control device further includes a thermal correction implementation section that is configured to simultaneously perform the thermal correction processing for the multiple component transfer devices (41, 42) when it is determined by the implementation period determination section that the implementation period of the thermal correction processing has been reached for either of the component transfer devices (41, 42). multiple component transfer devices (41, 42) that each have a mounting nozzle that is configured to hold and release a component, a movable section (44, 45, 46) that is configured to support the mounting nozzle, and an XY driving mechanism that is configured to drive the movable section in an X-axis direction and a Y-axis direction in a horizontal plane, the component transfer devices (41, 42) being configured to perform a component mounting operation for collecting the component from a component supply device (31, 32) and mounting the component on a positionally aligned board (K1, K2); and a control device that is configured to control the component mounting operation that is performed by the multiple component transfer devices (41, 42) on one board (K1, K2) sequentially positionally aligned by the board conveyance device (21, 22) and to perform thermal correction processing that reduces influence of thermal deformation on the component mounting operation of each of the component transfer devices (41, 42) accompanying temperature change of at least one of the movable section (44, 45, 46) and the XY driving mechanism, wherein the control device includes an implementation period determination section that is configured to individually determine an implementation period of the thermal correction processing for each of the component transfer devices (41, 42) based on operation circumstances of each component transfer device (41, 42), the component mounting machine being characterized in that the control device further includes a thermal correction implementation section that is configured to simultaneously perform the thermal correction processing for the multiple component transfer devices (41, 42) when it is determined by the implementation period determination section that the implementation period of the thermal correction processing has been reached for either of the component transfer devices (41, 42). an implementation period determination section that is configured to individually determine an implementation period of the thermal correction processing for each of the component transfer devices (41, 42) based on operation circumstances of each component transfer device (41, 42), the component mounting machine being characterized in that the control device further includes a thermal correction implementation section that is configured to simultaneously perform the thermal correction processing for the multiple component transfer devices (41, 42) when it is determined by the implementation period determination section that the implementation period of the thermal correction processing has been reached for either of the component transfer devices (41, 42).