An integrated circuit module (30a, 30b, 30c, 70, 80, 90) for a smart card with both contact and contactless interfaces, the IC module comprising: a non-conductive substrate having a plurality of single-bond holes and a pair of multi-bond holes, both extending from a first to a second side of the substrate, wherein each multi-bond hole is larger than each single-bond hole and is configured to receive multiple conductive elements, wherein each single-bond hole is configured to receive a single conductive element; a plurality of conductive contact pads (24a, 24b, 24c, 24e, 24f, 24g, 25a, 25b), including a first pair thereof (25a, 25b), arranged on the first side of the substrate; a first IC chip arranged on the second side of the substrate; a plurality of first conductive elements traversing the single-bond and the pair of multi-bond holes (23, 22), and electrically connecting at least some of the contact pads (24a, 24b, 24c, 24e, 24f, 24g, 25a, 25b) to the first IC chip, wherein the first conductive elements include a first pair of first conductive elements respectively traversing the pair of multi-bond holes and electrically connecting the first pair of contact pads (25a, 25b) to the first IC chip; and characterised by an encapsulant deposited on the first IC chip, the first conductive elements and the first pair of contact pads (25a, 25b), wherein an edge of the encapsulant deposited on the first pair of contact pads (25a, 25b) apportions each of the pair of multi-bond holes into an encapsulated first bonding channel and an adjoining unencapsulated second bonding channel respectively terminating at a first and an adjoining second bonding area (241, 242) on each of the first pair of contact pads (25a, 25b) such that the first pair of first conductive elements respectively traverse the first bonding channel of the pair of multi-bond holes and further such that the encapsulant seals the first bonding area and exposes the second bonding area through the second bonding channel to provide a surface for establishing electrical connection to the first IC chip, wherein the encapsulant partitions the first and the second bonding area (241, 242) from each other without requiring a presence of the substrate therebetween. a non-conductive substrate having a plurality of single-bond holes and a pair of multi-bond holes, both extending from a first to a second side of the substrate, wherein each multi-bond hole is larger than each single-bond hole and is configured to receive multiple conductive elements, wherein each single-bond hole is configured to receive a single conductive element; a plurality of conductive contact pads (24a, 24b, 24c, 24e, 24f, 24g, 25a, 25b), including a first pair thereof (25a, 25b), arranged on the first side of the substrate; a first IC chip arranged on the second side of the substrate; a plurality of first conductive elements traversing the single-bond and the pair of multi-bond holes (23, 22), and electrically connecting at least some of the contact pads (24a, 24b, 24c, 24e, 24f, 24g, 25a, 25b) to the first IC chip, wherein the first conductive elements include a first pair of first conductive elements respectively traversing the pair of multi-bond holes and electrically connecting the first pair of contact pads (25a, 25b) to the first IC chip; and characterised by an encapsulant deposited on the first IC chip, the first conductive elements and the first pair of contact pads (25a, 25b), wherein an edge of the encapsulant deposited on the first pair of contact pads (25a, 25b) apportions each of the pair of multi-bond holes into an encapsulated first bonding channel and an adjoining unencapsulated second bonding channel respectively terminating at a first and an adjoining second bonding area (241, 242) on each of the first pair of contact pads (25a, 25b) such that the first pair of first conductive elements respectively traverse the first bonding channel of the pair of multi-bond holes and further such that the encapsulant seals the first bonding area and exposes the second bonding area through the second bonding channel to provide a surface for establishing electrical connection to the first IC chip, wherein the encapsulant partitions the first and the second bonding area (241, 242) from each other without requiring a presence of the substrate therebetween.