A light emitting die package comprising: a leadframe including a plurality of leads, said leadframe having a top side and a bottom side, and a portion of said leadframe defining a mounting pad; a two-part heatsink, the two parts sandwiching said leadframe, the two-part heatsink comprising: a first part being a bottom heatsink composed of a thermally conductive material coupled to the bottom side of said leadframe, said bottom heatsink having a top surface thermally coupled to but electrically separated from said leadframe; and a second part being a top heatsink composed of a thermally conductive material coupled to the top side of said leadframe, said top heatsink defining an opening, the opening extending from a main surface of the top heatsink to the opposite main surface of the top heatsink and generally surrounding the mounting pad; and at least one dielectric layer positioned between said leadframe and at least one of the top heatsink and the bottom heatsink; said top heatsink and said bottom heatsink having similar lateral dimensions (33, 35) in first and second directions, wherein first and second directions are defined by adjacent edges of a main surface of said top or bottom heatsinks; and said leadframe having lateral dimensions that are larger than the lateral dimensions of said top heatsink and said bottom heatsink in the first direction; characterized in that said leadframe has lateral dimensions that are approximately the same as the lateral dimensions of said top heatsink and said bottom heatsink in the second direction; and said bottom heatsink has a metalized bottom surface. a leadframe including a plurality of leads, said leadframe having a top side and a bottom side, and a portion of said leadframe defining a mounting pad; a two-part heatsink, the two parts sandwiching said leadframe, the two-part heatsink comprising: a first part being a bottom heatsink composed of a thermally conductive material coupled to the bottom side of said leadframe, said bottom heatsink having a top surface thermally coupled to but electrically separated from said leadframe; and a second part being a top heatsink composed of a thermally conductive material coupled to the top side of said leadframe, said top heatsink defining an opening, the opening extending from a main surface of the top heatsink to the opposite main surface of the top heatsink and generally surrounding the mounting pad; and at least one dielectric layer positioned between said leadframe and at least one of the top heatsink and the bottom heatsink; said top heatsink and said bottom heatsink having similar lateral dimensions (33, 35) in first and second directions, wherein first and second directions are defined by adjacent edges of a main surface of said top or bottom heatsinks; and said leadframe having lateral dimensions that are larger than the lateral dimensions of said top heatsink and said bottom heatsink in the first direction; characterized in that said leadframe has lateral dimensions that are approximately the same as the lateral dimensions of said top heatsink and said bottom heatsink in the second direction; and said bottom heatsink has a metalized bottom surface. a first part being a bottom heatsink composed of a thermally conductive material coupled to the bottom side of said leadframe, said bottom heatsink having a top surface thermally coupled to but electrically separated from said leadframe; and a second part being a top heatsink composed of a thermally conductive material coupled to the top side of said leadframe, said top heatsink defining an opening, the opening extending from a main surface of the top heatsink to the opposite main surface of the top heatsink and generally surrounding the mounting pad; and at least one dielectric layer positioned between said leadframe and at least one of the top heatsink and the bottom heatsink; said top heatsink and said bottom heatsink having similar lateral dimensions (33, 35) in first and second directions, wherein first and second directions are defined by adjacent edges of a main surface of said top or bottom heatsinks; and said leadframe having lateral dimensions that are larger than the lateral dimensions of said top heatsink and said bottom heatsink in the first direction; characterized in that said leadframe has lateral dimensions that are approximately the same as the lateral dimensions of said top heatsink and said bottom heatsink in the second direction; and said bottom heatsink has a metalized bottom surface.