A method for forming a pattern on a board, comprising: a step of providing a base material (2; 2B) for forming the board (1; 1B); a step of forming a first groove (20; 70) and a first liquid-receiving section (22; 71) communicated with the first groove (20; 70), on one surface of the base material (2; 2B); a liquid-charging step of charging a liquid into the first groove (20; 70) communicated with the first liquid-receiving section (22; 71) by landing liquid droplets on the first liquid-receiving section (22; 71), wherein the liquid is composed of a conductive material; and a solidifying step of solidifying the liquid charged into the first groove (20; 70), wherein the first liquid-receiving section (22; 71) has such a size that a circle, which has the same diameter as a diameter of the liquid droplet, is completely included in the first liquid-receiving section (22; 71), and the first groove (20; 70) has a width which is smaller than the diameter of the liquid droplet, such that the first groove (20; 70) is filled with liquid flowing from the first liquid-receiving section (22; 71) into the first groove (20; 70) in accordance with a capillary force, characterized in that in the step of forming the first groove (20; 70), a laser is irradiated onto the one surface of the base material (2; 2B) to form the first groove (20; 70), and to lower the liquid repellence of an inner surface defining the first groove (20; 70) to a value lower than that of the one surface of the base material (2; 2B); wherein the method for forming the pattern further comprises a bump-forming step of forming a protruding bump by further landing conductive liquid droplets on a surface of the conductive material solidified on the first liquid-receiving section (22; 71) after the solidifying step, or in the liquid-charging step, the liquid is landed on the first liquid-receiving section (22; 71) until a liquid surface of the liquid rises to be higher than the one surface of the base material, and then the liquid is solidified to form a protruding bump. a step of providing a base material (2; 2B) for forming the board (1; 1B); a step of forming a first groove (20; 70) and a first liquid-receiving section (22; 71) communicated with the first groove (20; 70), on one surface of the base material (2; 2B); a liquid-charging step of charging a liquid into the first groove (20; 70) communicated with the first liquid-receiving section (22; 71) by landing liquid droplets on the first liquid-receiving section (22; 71), wherein the liquid is composed of a conductive material; and a solidifying step of solidifying the liquid charged into the first groove (20; 70), wherein the first liquid-receiving section (22; 71) has such a size that a circle, which has the same diameter as a diameter of the liquid droplet, is completely included in the first liquid-receiving section (22; 71), and the first groove (20; 70) has a width which is smaller than the diameter of the liquid droplet, such that the first groove (20; 70) is filled with liquid flowing from the first liquid-receiving section (22; 71) into the first groove (20; 70) in accordance with a capillary force, characterized in that in the step of forming the first groove (20; 70), a laser is irradiated onto the one surface of the base material (2; 2B) to form the first groove (20; 70), and to lower the liquid repellence of an inner surface defining the first groove (20; 70) to a value lower than that of the one surface of the base material (2; 2B); wherein the method for forming the pattern further comprises a bump-forming step of forming a protruding bump by further landing conductive liquid droplets on a surface of the conductive material solidified on the first liquid-receiving section (22; 71) after the solidifying step, or in the liquid-charging step, the liquid is landed on the first liquid-receiving section (22; 71) until a liquid surface of the liquid rises to be higher than the one surface of the base material, and then the liquid is solidified to form a protruding bump.