Method for packaging at least one microelectronic device in at least one hermetically sealed cavity and managing an atmosphere of the cavity with at least one dedicated hole, comprising at least the following steps: - making said cavity between a support and at least one cap layer such that a sacrificial material and the microelectronic device are arranged in the cavity; - removing the sacrificial material through at least one release hole made through the cap layer, and hermetically sealing the release hole; characterized in that the method further comprises at least the steps of: - making a portion of wettable material on the cap layer, around a blind hole intended to form said dedicated hole, said blind hole being made through an outside surface of the cap layer before the making of the portion of wettable material, or around a part of said outside surface of the cap layer corresponding to a location of said dedicated hole intended to be made; - making a portion of fuse material at least on the portion of wettable material; - making the dedicated hole by etching at least the cap layer either through a bottom wall of the blind hole or through said part of the outside surface of the cap layer, said dedicated hole emerging into the cavity; - reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole, an atmosphere inside the cavity corresponding to said controlled atmosphere. - making said cavity between a support and at least one cap layer such that a sacrificial material and the microelectronic device are arranged in the cavity; - removing the sacrificial material through at least one release hole made through the cap layer, and hermetically sealing the release hole; characterized in that the method further comprises at least the steps of: - making a portion of wettable material on the cap layer, around a blind hole intended to form said dedicated hole, said blind hole being made through an outside surface of the cap layer before the making of the portion of wettable material, or around a part of said outside surface of the cap layer corresponding to a location of said dedicated hole intended to be made; - making a portion of fuse material at least on the portion of wettable material; - making the dedicated hole by etching at least the cap layer either through a bottom wall of the blind hole or through said part of the outside surface of the cap layer, said dedicated hole emerging into the cavity; - reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole, an atmosphere inside the cavity corresponding to said controlled atmosphere. - making a portion of wettable material on the cap layer, around a blind hole intended to form said dedicated hole, said blind hole being made through an outside surface of the cap layer before the making of the portion of wettable material, or around a part of said outside surface of the cap layer corresponding to a location of said dedicated hole intended to be made; - making a portion of fuse material at least on the portion of wettable material; - making the dedicated hole by etching at least the cap layer either through a bottom wall of the blind hole or through said part of the outside surface of the cap layer, said dedicated hole emerging into the cavity; - reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole, an atmosphere inside the cavity corresponding to said controlled atmosphere.