A display device comprising: a substrate; conductive pads arranged on the substrate, the conductive pads including a first conductive pad, a second conductive pad, a third conductive pad, a fourth conductive pad, a fifth conductive pad, and a sixth conductive pad; and a drive circuit chip including bumps electrically connected with the conductive pads, the bumps including a first bump overlapping the first conductive pad, a second bump overlapping the second conductive pad, a third bump overlapping the third conductive pad, a fourth bump overlapping the fourth conductive pad, a fifth bump overlapping the fifth conductive pad, and a sixth bump overlapping the sixth conductive pad, wherein the first conductive pad, the second conductive pad, the third conductive pad, the fourth conductive pad, the fifth conductive pad, and the sixth conductive pad are arranged aligning with both their upper and lower end along a respective reference line extending in a first direction, wherein at least one of the second conductive pad, the third conductive pad, the fourth conductive pad, and the fifth conductive pad are extended in a second direction intersecting the first direction, wherein the first conductive pad is extended in a third direction which is different from the first direction and the second direction, wherein the sixth conductive pad is extended in a fourth direction which is different from the first direction, the second direction, and the third direction, wherein each of the second bump, the third bump, the fourth bump, and the fifth bump includes a first end and a second end opposite to the first end in the second direction, wherein the first end of one of the second bump, the third bump, the fourth bump, and the fifth bump is shifted in the second direction relative to the first end of another one of the second bump, the third bump, the fourth bump, and the fifth bump, wherein the second conductive pad, the third conductive pad, the fourth conductive pad, and the fifth conductive pad have a rectangular shape, wherein the second bump, the third bump, the fourth bump, and the fifth bump have a rectangular shape, wherein the first conductive pad and the sixth conductive pad have a parallelogram shape, wherein the first bump and the sixth bump have a parallelogram shape, and wherein the first bump, the second bump, the third bump, the fourth bump, the fifth bump, and the sixth bump are extended in the same directions as the first conductive pad, the second conductive pad, the third conductive pad, the fourth conductive pad, the fifth conductive pad, and the sixth conductive pad, respectively. a substrate; conductive pads arranged on the substrate, the conductive pads including a first conductive pad, a second conductive pad, a third conductive pad, a fourth conductive pad, a fifth conductive pad, and a sixth conductive pad; and a drive circuit chip including bumps electrically connected with the conductive pads, the bumps including a first bump overlapping the first conductive pad, a second bump overlapping the second conductive pad, a third bump overlapping the third conductive pad, a fourth bump overlapping the fourth conductive pad, a fifth bump overlapping the fifth conductive pad, and a sixth bump overlapping the sixth conductive pad, wherein the first conductive pad, the second conductive pad, the third conductive pad, the fourth conductive pad, the fifth conductive pad, and the sixth conductive pad are arranged aligning with both their upper and lower end along a respective reference line extending in a first direction, wherein at least one of the second conductive pad, the third conductive pad, the fourth conductive pad, and the fifth conductive pad are extended in a second direction intersecting the first direction, wherein the first conductive pad is extended in a third direction which is different from the first direction and the second direction, wherein the sixth conductive pad is extended in a fourth direction which is different from the first direction, the second direction, and the third direction, wherein each of the second bump, the third bump, the fourth bump, and the fifth bump includes a first end and a second end opposite to the first end in the second direction, wherein the first end of one of the second bump, the third bump, the fourth bump, and the fifth bump is shifted in the second direction relative to the first end of another one of the second bump, the third bump, the fourth bump, and the fifth bump, wherein the second conductive pad, the third conductive pad, the fourth conductive pad, and the fifth conductive pad have a rectangular shape, wherein the second bump, the third bump, the fourth bump, and the fifth bump have a rectangular shape, wherein the first conductive pad and the sixth conductive pad have a parallelogram shape, wherein the first bump and the sixth bump have a parallelogram shape, and wherein the first bump, the second bump, the third bump, the fourth bump, the fifth bump, and the sixth bump are extended in the same directions as the first conductive pad, the second conductive pad, the third conductive pad, the fourth conductive pad, the fifth conductive pad, and the sixth conductive pad, respectively.