A stackable package layer comprising: a dielectric body having a thickness of less than 0.25 millimeters supporting at a first side thereof a die paddle and an electrical contact structure, the die paddle having a first side and a second side opposite the first side facing the supporting dielectric body, wherein the dielectric body forms a frame around a die mounted on the second side of the die paddle through a die adhesive layer; wherein the electrical contact structure (108, 112) comprises a substantially planar conducting strip constituting a top contact and coupled to the dielectric body at the first side thereof via a dielectric adhesive and a curved spring, the curved spring including a proximal end coupled to the conducting strip and arranged in an opening of the dielectric body, wherein a dielectric adhesive layer is arranged on a second side of the dielectric body; wherein the curved spring is curved away from the first surface of the dielectric body and includes a tip end that includes a point separated by a predetermined distance from a plane including the first side of the dielectric body, the predetermined distance being greater than a thickness of the dielectric body, wherein the tip end is arranged opposite the top contact such that it is capable of contacting the top contact of an adjacent stacked package layer structure, wherein the substantially planar conducting strip and the die paddle are substantially in the same plane, and the thickness of the combined dielectric body and adhesive layers (216, 224) on the first and second side thereof is slightly greater than the combined thickness of the die and the die adhesive layer, and wherein a bond wire connects the die with the top contact and a further insulating dielectric layer is formed over the die paddle to prevent electrical shorting of dies in a stacked structure. a dielectric body having a thickness of less than 0.25 millimeters supporting at a first side thereof a die paddle and an electrical contact structure, the die paddle having a first side and a second side opposite the first side facing the supporting dielectric body, wherein the dielectric body forms a frame around a die mounted on the second side of the die paddle through a die adhesive layer; wherein the electrical contact structure (108, 112) comprises a substantially planar conducting strip constituting a top contact and coupled to the dielectric body at the first side thereof via a dielectric adhesive and a curved spring, the curved spring including a proximal end coupled to the conducting strip and arranged in an opening of the dielectric body, wherein a dielectric adhesive layer is arranged on a second side of the dielectric body; wherein the curved spring is curved away from the first surface of the dielectric body and includes a tip end that includes a point separated by a predetermined distance from a plane including the first side of the dielectric body, the predetermined distance being greater than a thickness of the dielectric body, wherein the tip end is arranged opposite the top contact such that it is capable of contacting the top contact of an adjacent stacked package layer structure, wherein the substantially planar conducting strip and the die paddle are substantially in the same plane, and the thickness of the combined dielectric body and adhesive layers (216, 224) on the first and second side thereof is slightly greater than the combined thickness of the die and the die adhesive layer, and wherein a bond wire connects the die with the top contact and a further insulating dielectric layer is formed over the die paddle to prevent electrical shorting of dies in a stacked structure.