A capacitance type vibration sensor comprising: a substrate including a hollow portion; a vibration electrode plate, which is arranged facing the hollow portion at an upper surface side of the substrate and which performs film vibration upon receiving vibration; and a fixed electrode plate which is arranged facing the vibration electrode plate and which is opened with a plurality of acoustic perforations passing therethrough in a thickness direction; the capacitance type vibration sensor comprising: an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion; wherein an air escape portion (42, 51, 52, 61) for the air in the air path to escape in the thickness direction of the vibration electrode plate is formed at a site of the vibration electrode plate facing the air path, wherein the air escape portion (42, 51, 52, 61) is a through-hole provided in the vibration electrode plate, wherein a diameter of the through-hole is smaller than a diameter of the acoustic perforation provided in a region of the fixed electrode plate arranged above the region where the vibration electrode plate and the substrate overlap, characterized in that the through-hole is arranged at a position not overlapping the acoustic perforation when seen from a direction perpendicular to the vibration electrode plate. a substrate including a hollow portion; a vibration electrode plate, which is arranged facing the hollow portion at an upper surface side of the substrate and which performs film vibration upon receiving vibration; and a fixed electrode plate which is arranged facing the vibration electrode plate and which is opened with a plurality of acoustic perforations passing therethrough in a thickness direction; the capacitance type vibration sensor comprising: an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion; wherein an air escape portion (42, 51, 52, 61) for the air in the air path to escape in the thickness direction of the vibration electrode plate is formed at a site of the vibration electrode plate facing the air path, wherein the air escape portion (42, 51, 52, 61) is a through-hole provided in the vibration electrode plate, wherein a diameter of the through-hole is smaller than a diameter of the acoustic perforation provided in a region of the fixed electrode plate arranged above the region where the vibration electrode plate and the substrate overlap, characterized in that the through-hole is arranged at a position not overlapping the acoustic perforation when seen from a direction perpendicular to the vibration electrode plate. an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion; wherein an air escape portion (42, 51, 52, 61) for the air in the air path to escape in the thickness direction of the vibration electrode plate is formed at a site of the vibration electrode plate facing the air path, wherein the air escape portion (42, 51, 52, 61) is a through-hole provided in the vibration electrode plate, wherein a diameter of the through-hole is smaller than a diameter of the acoustic perforation provided in a region of the fixed electrode plate arranged above the region where the vibration electrode plate and the substrate overlap, characterized in that the through-hole is arranged at a position not overlapping the acoustic perforation when seen from a direction perpendicular to the vibration electrode plate.