A transparent conductive structure with metal mesh, the transparent conductive structure comprising: a transparent substrate having a top surface and a bottom surface opposite to the top surface; a first mesh structure positioned on the top surface of the transparent substrate, wherein the first mesh structure from the top surface of the transparent substrate sequentially comprises: a first tie coat layer, being made of a nickel-chromium alloy and formed on the top surface of the transparent substrate by way of sputtering; a first dielectric layer, being made of a zinc-copper alloy and formed on the first tie coat layer by way of sputtering; a first metal layer, being made of a copper and positioned on the first dielectric layer by way of electroplating; and a first anti-reflective layer, being made of a nickel zinc sulfide and positioned on the first metal layer by way of electroplating; and a second mesh structure positioned on the bottom surface of the transparent substrate, wherein the second mesh structure from the bottom surface of the transparent substrate sequentially comprises: a second tie coat layer, being made of a nickel-chromium alloy and formed on the bottom surface of the transparent substrate by way of sputtering a second dielectric layer, being made of a zinc-copper alloy and formed on the second tie coat layer by way of sputtering; a second metal layer, being made of a copper and positioned on the second dielectric layer by way of electroplating; and a second anti-reflective layer, being made of a nickel zinc sulfide and positioned on the second metal layer by way of electroplating. a transparent substrate having a top surface and a bottom surface opposite to the top surface; a first mesh structure positioned on the top surface of the transparent substrate, wherein the first mesh structure from the top surface of the transparent substrate sequentially comprises: a first tie coat layer, being made of a nickel-chromium alloy and formed on the top surface of the transparent substrate by way of sputtering; a first dielectric layer, being made of a zinc-copper alloy and formed on the first tie coat layer by way of sputtering; a first metal layer, being made of a copper and positioned on the first dielectric layer by way of electroplating; and a first anti-reflective layer, being made of a nickel zinc sulfide and positioned on the first metal layer by way of electroplating; and a first tie coat layer, being made of a nickel-chromium alloy and formed on the top surface of the transparent substrate by way of sputtering; a first dielectric layer, being made of a zinc-copper alloy and formed on the first tie coat layer by way of sputtering; a first metal layer, being made of a copper and positioned on the first dielectric layer by way of electroplating; and a first anti-reflective layer, being made of a nickel zinc sulfide and positioned on the first metal layer by way of electroplating; and a second mesh structure positioned on the bottom surface of the transparent substrate, wherein the second mesh structure from the bottom surface of the transparent substrate sequentially comprises: a second tie coat layer, being made of a nickel-chromium alloy and formed on the bottom surface of the transparent substrate by way of sputtering a second dielectric layer, being made of a zinc-copper alloy and formed on the second tie coat layer by way of sputtering; a second metal layer, being made of a copper and positioned on the second dielectric layer by way of electroplating; and a second anti-reflective layer, being made of a nickel zinc sulfide and positioned on the second metal layer by way of electroplating. a second tie coat layer, being made of a nickel-chromium alloy and formed on the bottom surface of the transparent substrate by way of sputtering a second dielectric layer, being made of a zinc-copper alloy and formed on the second tie coat layer by way of sputtering; a second metal layer, being made of a copper and positioned on the second dielectric layer by way of electroplating; and a second anti-reflective layer, being made of a nickel zinc sulfide and positioned on the second metal layer by way of electroplating.