A method for producing an infrared light detector, wherein the method comprises the steps: - providing a circuit board and a plurality of connection pins (11, 12) which are arranged parallel to one another, and wherein each of the plurality of connection pins (11, 12) are arranged with one of the longitudinal ends (17, 18) of the connection pins (11, 12) in a horizontal plane, wherein each of the connection pins (11, 12) extend downward from the horizontal plane, and wherein the circuit board has a flat bottom side in that a recess (15, 16) is intended for each of the connection pins (11, 12), wherein the recess (15, 16) is arranged in the portion of the circuit board, wherein on the portion of the circuit board the connection pin (11, 12) corresponding to the recess (15, 16) is to be attached, wherein the recesses (15, 16) respectively have the same shape, wherein a housing floor is provided that is arranged parallel with respect to the horizontal plane, wherein for each of the connection pins (11, 12) a passage (13, 14) is intended in the housing floor, wherein the connection pin (11, 12) that corresponds to the respective passage (13, 14) extends through each of the passages (13, 14) so that the connection pins (11, 12) are held in position inside the passages (13, 14) by the housing floor; - filling the recesses (15, 16) with a solder paste so that in each of the recesses (15, 16) a solder paste body is located with the same solder paste amount; - positioning the circuit board above the connection pins (11, 12) so that the longitudinal end of each of the connection pins (11, 12) extends inside its respective recess (15, 16) and that the longitudinal end of each of the connection pins (11, 12) dips into the respective solder paste body that is located in the respective recess (15, 16); - liquefying the solder paste bodies, wherein a cone-surface-like solder paste body surface is formed around the respective connection pin (11, 12) so that electrically conductive connections between the connection pins (11, 12) and the solder paste bodies are formed as well as the bottom side of the circuit board is aligned in parallel with respect to the horizontal plane because of the surface tension inside the solder paste bodies and the self-weight of the circuit board; - solidifying the solder paste bodies so that mechanically rigid connections between the circuit board and the connection pins (11, 12) are formed with the solder paste bodies, and so that the orientation of the bottom side of the circuit board is fixed parallel with respect to the horizontal plane; - attaching of at least one sensor chip on a top side of the circuit board, wherein the top side is facing away from the bottom side. - providing a circuit board and a plurality of connection pins (11, 12) which are arranged parallel to one another, and wherein each of the plurality of connection pins (11, 12) are arranged with one of the longitudinal ends (17, 18) of the connection pins (11, 12) in a horizontal plane, wherein each of the connection pins (11, 12) extend downward from the horizontal plane, and wherein the circuit board has a flat bottom side in that a recess (15, 16) is intended for each of the connection pins (11, 12), wherein the recess (15, 16) is arranged in the portion of the circuit board, wherein on the portion of the circuit board the connection pin (11, 12) corresponding to the recess (15, 16) is to be attached, wherein the recesses (15, 16) respectively have the same shape, wherein a housing floor is provided that is arranged parallel with respect to the horizontal plane, wherein for each of the connection pins (11, 12) a passage (13, 14) is intended in the housing floor, wherein the connection pin (11, 12) that corresponds to the respective passage (13, 14) extends through each of the passages (13, 14) so that the connection pins (11, 12) are held in position inside the passages (13, 14) by the housing floor; - filling the recesses (15, 16) with a solder paste so that in each of the recesses (15, 16) a solder paste body is located with the same solder paste amount; - positioning the circuit board above the connection pins (11, 12) so that the longitudinal end of each of the connection pins (11, 12) extends inside its respective recess (15, 16) and that the longitudinal end of each of the connection pins (11, 12) dips into the respective solder paste body that is located in the respective recess (15, 16); - liquefying the solder paste bodies, wherein a cone-surface-like solder paste body surface is formed around the respective connection pin (11, 12) so that electrically conductive connections between the connection pins (11, 12) and the solder paste bodies are formed as well as the bottom side of the circuit board is aligned in parallel with respect to the horizontal plane because of the surface tension inside the solder paste bodies and the self-weight of the circuit board; - solidifying the solder paste bodies so that mechanically rigid connections between the circuit board and the connection pins (11, 12) are formed with the solder paste bodies, and so that the orientation of the bottom side of the circuit board is fixed parallel with respect to the horizontal plane; - attaching of at least one sensor chip on a top side of the circuit board, wherein the top side is facing away from the bottom side.