A power semiconductor module comprising: two or more common units, each having: a ceramic substrate provided with a circuit surface and a radiation surface opposed to said circuit surface, said circuit surface is disposed with a semiconductor element; and a package formed by resin molding processing with heat resistant resin to seal said circuit surface and to expose said radiation surface, and a module casing configured to retain said common units and having: a radiator fitting surface facing to a radiator fitted thereon; a unit abutting contact part that is in abutting contact with said common unit; and an opening for exposing the radiation surface of said common unit, the opening being formed on said radiator fitting surface; and wherein each of said common units is sandwiched between said unit abutting contact part and said radiator so that said radiation surface of each of said common units is brought into close contact with said radiator, wherein said package has a step part, and wherein the step part opens toward a side opposite to said radiation surface, characterized in that each of said common units has a first electrode terminal extending toward a side opposite to said radiation surface; and a second electrode terminal extending along a top surface of said package and capable of fastening a metal plate, said top surface of said package being a surface opposite to said radiation surface on said package, that each of said common units is fastened to said metal plate, that said package is formed to seal a part of said first electrode terminal and said second electrode terminal, and that said first electrode terminal and said second electrode terminal are exposed outside said package from a valley line of the step part to extend outward along said top surface of said package - the valley line being a deepest part of a concave portion on said package formed by said top surface and a side surface - and said first electrode terminal is bent toward the side opposite to said radiation surface around said valley line in an outer side of said package, and said second electrode terminal is bent at an angle of 180 degrees around said valley line in an outer side of said package. two or more common units, each having: a ceramic substrate provided with a circuit surface and a radiation surface opposed to said circuit surface, said circuit surface is disposed with a semiconductor element; and a package formed by resin molding processing with heat resistant resin to seal said circuit surface and to expose said radiation surface, and a ceramic substrate provided with a circuit surface and a radiation surface opposed to said circuit surface, said circuit surface is disposed with a semiconductor element; and a package formed by resin molding processing with heat resistant resin to seal said circuit surface and to expose said radiation surface, and a module casing configured to retain said common units and having: a radiator fitting surface facing to a radiator fitted thereon; a unit abutting contact part that is in abutting contact with said common unit; and an opening for exposing the radiation surface of said common unit, the opening being formed on said radiator fitting surface; and a radiator fitting surface facing to a radiator fitted thereon; a unit abutting contact part that is in abutting contact with said common unit; and an opening for exposing the radiation surface of said common unit, the opening being formed on said radiator fitting surface; and wherein each of said common units is sandwiched between said unit abutting contact part and said radiator so that said radiation surface of each of said common units is brought into close contact with said radiator, wherein said package has a step part, and wherein the step part opens toward a side opposite to said radiation surface, characterized in that each of said common units has a first electrode terminal extending toward a side opposite to said radiation surface; and a second electrode terminal extending along a top surface of said package and capable of fastening a metal plate, said top surface of said package being a surface opposite to said radiation surface on said package, a second electrode terminal extending along a top surface of said package and capable of fastening a metal plate, said top surface of said package being a surface opposite to said radiation surface on said package, that each of said common units is fastened to said metal plate, that said package is formed to seal a part of said first electrode terminal and said second electrode terminal, and that said first electrode terminal and said second electrode terminal are exposed outside said package from a valley line of the step part to extend outward along said top surface of said package - the valley line being a deepest part of a concave portion on said package formed by said top surface and a side surface - and said first electrode terminal is bent toward the side opposite to said radiation surface around said valley line in an outer side of said package, and said second electrode terminal is bent at an angle of 180 degrees around said valley line in an outer side of said package.