An electronic device comprising: a first plate configured to face one surface of the electronic device; a second plate configured to face the opposite surface of the first plate; a side bezel structure configured to be connected to the first plate and the second plate and surround a side of the electronic device; an antenna housing configured to define at least a partial area of the side bezel structure; and a printed circuit board mounted inside the electronic device and configured to be connected to the side bezel structure, wherein the printed circuit board includes: a communication circuit configured to process a signal for performing communication in a radio frequency band; a ground area; a first conductive pad disposed in one area of the printed circuit board and configured to couple between the side bezel structure and the printed circuit board; and a second conductive pad electrically connected to the ground area and disposed between the first conductive pad and the ground area, wherein the first conductive pad and the second conductive pad are spaced from each other by a gap through which a current having a voltage equal to or higher than a threshold voltage, between the first conductive pad and the second conductive pad, can flow; wherein the device further comprises a resistor element disposed between the second conductive pad and the ground area; and a capacitor arranged in parallel with a series of the first conductive pad, the second conductive pad and resistor element. a first plate configured to face one surface of the electronic device; a second plate configured to face the opposite surface of the first plate; a side bezel structure configured to be connected to the first plate and the second plate and surround a side of the electronic device; an antenna housing configured to define at least a partial area of the side bezel structure; and a printed circuit board mounted inside the electronic device and configured to be connected to the side bezel structure, wherein the printed circuit board includes: a communication circuit configured to process a signal for performing communication in a radio frequency band; a ground area; a first conductive pad disposed in one area of the printed circuit board and configured to couple between the side bezel structure and the printed circuit board; and a second conductive pad electrically connected to the ground area and disposed between the first conductive pad and the ground area, a communication circuit configured to process a signal for performing communication in a radio frequency band; a ground area; a first conductive pad disposed in one area of the printed circuit board and configured to couple between the side bezel structure and the printed circuit board; and a second conductive pad electrically connected to the ground area and disposed between the first conductive pad and the ground area, wherein the first conductive pad and the second conductive pad are spaced from each other by a gap through which a current having a voltage equal to or higher than a threshold voltage, between the first conductive pad and the second conductive pad, can flow; wherein the device further comprises a resistor element disposed between the second conductive pad and the ground area; and a capacitor arranged in parallel with a series of the first conductive pad, the second conductive pad and resistor element.