A system comprising: a server rack assembly comprising two or more server rack sub-assemblies, at least one of the server rack sub-assemblies comprising: at least one motherboard (115, 205, 305) having a perimeter; a plurality of heat-generating electronic devices (120, 125, 215, 315) mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets (210, 310) coupling the server rack sub-assembly to the server rack assembly, the one or more brackets comprising heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device (230, 335) coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter, wherein the heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the one or more brackets; and one or more fans adapted to circulate cooling air over the heat transfer surfaces to convect heat away from the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. a server rack assembly comprising two or more server rack sub-assemblies, at least one of the server rack sub-assemblies comprising: at least one motherboard (115, 205, 305) having a perimeter; a plurality of heat-generating electronic devices (120, 125, 215, 315) mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets (210, 310) coupling the server rack sub-assembly to the server rack assembly, the one or more brackets comprising heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device (230, 335) coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter, wherein the heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the one or more brackets; and one or more fans adapted to circulate cooling air over the heat transfer surfaces to convect heat away from the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. at least one motherboard (115, 205, 305) having a perimeter; a plurality of heat-generating electronic devices (120, 125, 215, 315) mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets (210, 310) coupling the server rack sub-assembly to the server rack assembly, the one or more brackets comprising heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device (230, 335) coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter, wherein the heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the one or more brackets; and one or more fans adapted to circulate cooling air over the heat transfer surfaces to convect heat away from the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets.