A fingerprint sensing module comprising: a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads arranged on said first side of said fingerprint sensor device for connecting said fingerprint sensor device to external circuitry; a fingerprint sensor device cover structure arranged to cover said fingerprint sensor device, said cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of said sensing module, and a second side facing said sensing array, wherein said cover structure comprises conductive traces arranged on the second side of the cover structure, for electrically connecting said fingerprint sensing module to external circuitry, and wherein a surface area of said cover structure is larger than a surface area of said sensor device; wherein said fingerprint sensor device further comprises: a carrier having a first side attached to a second side of said fingerprint sensor device, opposite of said first side of said fingerprint sensor device; characterized in that the fingerprint sensor device comprises: wire-bonds between said connection pads of said fingerprint sensor device and said first side of said carrier; and wire-bonds arranged between a second side of said carrier, opposite of said first side of said carrier, and said conductive traces of said cover structure and in that an electrical connection between said fingerprint sensor device and said conductive traces is formed through the carrier, wherein the electrical connection comprises said wire-bonds between said connection pads and said first side of said carrier, and said wire bonds between said second side of said carrier and said conductive traces of said cover structure. a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads arranged on said first side of said fingerprint sensor device for connecting said fingerprint sensor device to external circuitry; a fingerprint sensor device cover structure arranged to cover said fingerprint sensor device, said cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of said sensing module, and a second side facing said sensing array, wherein said cover structure comprises conductive traces arranged on the second side of the cover structure, for electrically connecting said fingerprint sensing module to external circuitry, and wherein a surface area of said cover structure is larger than a surface area of said sensor device; wherein said fingerprint sensor device further comprises: a carrier having a first side attached to a second side of said fingerprint sensor device, opposite of said first side of said fingerprint sensor device; characterized in that the fingerprint sensor device comprises: wire-bonds between said connection pads of said fingerprint sensor device and said first side of said carrier; and wire-bonds arranged between a second side of said carrier, opposite of said first side of said carrier, and said conductive traces of said cover structure and in that an electrical connection between said fingerprint sensor device and said conductive traces is formed through the carrier, wherein the electrical connection comprises said wire-bonds between said connection pads and said first side of said carrier, and said wire bonds between said second side of said carrier and said conductive traces of said cover structure. wire-bonds between said connection pads of said fingerprint sensor device and said first side of said carrier; and wire-bonds arranged between a second side of said carrier, opposite of said first side of said carrier, and said conductive traces of said cover structure and in that an electrical connection between said fingerprint sensor device and said conductive traces is formed through the carrier, wherein the electrical connection comprises said wire-bonds between said connection pads and said first side of said carrier, and said wire bonds between said second side of said carrier and said conductive traces of said cover structure.