A connecting device for connecting a substrate unit and a chip unit, the connecting device comprising: a first flexible connection unit, comprising a first wire for electrically connecting to the substrate unit; and a rigid connection unit, connected to the first flexible connection unit and comprising a second wire for electrically connecting to the first wire; wherein the chip unit is electrically connected to the second wire; a first conductive contact terminal and a second conductive contact terminal are disposed on two ends of the first wire of the first flexible connection unit, respectively; a third conductive contact terminal is disposed on one end of the second wire of the rigid connection unit; the first conductive contact terminal is used for connecting to the substrate unit by anisotropic conductive film bonding or metal-welding; and the second conductive contact terminal and the third conductive contact terminal are connected by anisotropic conductive film bonding or metal-welding; the rigid connection unit further comprises a rigid substrate; a fourth conductive contact terminal is disposed on the other end of the second wire of the rigid connection unit; and the second wire, the third conductive contact terminal and the fourth conductive contact terminal are disposed on the rigid substrate; characterized in that the connecting device further comprises a second flexible connection unit, wherein the second flexible connection unit comprises a fifth conductive contact terminal, a sixth conductive contact terminal and a third wire connecting the fifth conductive contact terminal and sixth conductive contact terminal; the fourth conductive contact terminal and the fifth conductive contact terminal are connected by anisotropic conductive film bonding or metal-welding; the sixth conductive contact terminal is used for connecting to the chip unit by anisotropic conductive film bonding or metal-welding.. a first flexible connection unit, comprising a first wire for electrically connecting to the substrate unit; and a rigid connection unit, connected to the first flexible connection unit and comprising a second wire for electrically connecting to the first wire; wherein the chip unit is electrically connected to the second wire; a first conductive contact terminal and a second conductive contact terminal are disposed on two ends of the first wire of the first flexible connection unit, respectively; a third conductive contact terminal is disposed on one end of the second wire of the rigid connection unit; the first conductive contact terminal is used for connecting to the substrate unit by anisotropic conductive film bonding or metal-welding; and the second conductive contact terminal and the third conductive contact terminal are connected by anisotropic conductive film bonding or metal-welding; the rigid connection unit further comprises a rigid substrate; a fourth conductive contact terminal is disposed on the other end of the second wire of the rigid connection unit; and the second wire, the third conductive contact terminal and the fourth conductive contact terminal are disposed on the rigid substrate; characterized in that the connecting device further comprises a second flexible connection unit, wherein the second flexible connection unit comprises a fifth conductive contact terminal, a sixth conductive contact terminal and a third wire connecting the fifth conductive contact terminal and sixth conductive contact terminal; the fourth conductive contact terminal and the fifth conductive contact terminal are connected by anisotropic conductive film bonding or metal-welding; the sixth conductive contact terminal is used for connecting to the chip unit by anisotropic conductive film bonding or metal-welding..