A receiver device comprising: a first input terminal to which a first broadcast signal of a first frequency band is input; a second input terminal to which a second broadcast signal of a second frequency band is input; a first signal processing unit configured to execute a predetermined frequency conversion process in response to the first or second broadcast signal; a second processing unit configured to execute a predetermined frequency conversion process in response to the first or second broadcast signal; wherein the first broadcast signal is supplied to the first signal processing unit from a first distribution circuit and the second broadcast signal is supplied to the first signal processing unit from a second distribution circuit, wherein the first broadcast signal is supplied to the second signal processing unit from the first distribution circuit and the second broadcast signal is supplied to the second signal processing unit from the second distribution circuit, and wherein the first broadcast signal is a terrestrial broadcast signal and the second broadcast signal is a satellite broadcast signal, characterized in that the first signal processing unit and the second signal processing unit are each a hybrid integrated circuit, IC, each integrating a terrestrial wave reception circuit and a satellite wave reception unit into one unit, and in that the receiver further comprises a multi-layer substrate having a top surface and a bottom surface, wherein the first distribution circuit is located on the top surface of the multi-layer substrate and the second distribution circuit is located on the bottom surface of the multi-layer substrate, wherein the multi-layer substrate includes hard-wired layers and insulating layers therebetween in an alternating manner, and wherein the second distribution circuit is displaced laterally on the bottom surface of the multi-layer substrate with respect to the first distribution circuit so as to not overlap the first distribution circuit as viewed in a direction perpendicular to the multi-layer substrate. a first input terminal to which a first broadcast signal of a first frequency band is input; a second input terminal to which a second broadcast signal of a second frequency band is input; a first signal processing unit configured to execute a predetermined frequency conversion process in response to the first or second broadcast signal; a second processing unit configured to execute a predetermined frequency conversion process in response to the first or second broadcast signal; wherein the first broadcast signal is supplied to the first signal processing unit from a first distribution circuit and the second broadcast signal is supplied to the first signal processing unit from a second distribution circuit, wherein the first broadcast signal is supplied to the second signal processing unit from the first distribution circuit and the second broadcast signal is supplied to the second signal processing unit from the second distribution circuit, and wherein the first broadcast signal is a terrestrial broadcast signal and the second broadcast signal is a satellite broadcast signal, characterized in that the first signal processing unit and the second signal processing unit are each a hybrid integrated circuit, IC, each integrating a terrestrial wave reception circuit and a satellite wave reception unit into one unit, and in that the receiver further comprises a multi-layer substrate having a top surface and a bottom surface, wherein the first distribution circuit is located on the top surface of the multi-layer substrate and the second distribution circuit is located on the bottom surface of the multi-layer substrate, wherein the multi-layer substrate includes hard-wired layers and insulating layers therebetween in an alternating manner, and wherein the second distribution circuit is displaced laterally on the bottom surface of the multi-layer substrate with respect to the first distribution circuit so as to not overlap the first distribution circuit as viewed in a direction perpendicular to the multi-layer substrate.