Substrate treatment system with at least one substrate carrier (2, 2a-k) carrying at least one plate-like substrate (31, 32, 33) and comprising at least one dielectric region (41, 42, 43, 44, 41'), wherein a front side of the dielectric region (41, 42, 43, 44, 41') is opposite to a back side of the substrate (31, 32, 33), and with an electrically conductive electrode provided on the back side of the substrate carrier (2, 2a-k) or being formed by the substrate carrier (2, 2a-k), characterized in that the substrate carrier (2, 2a-k) carries at least two of the substrates (31, 32, 33) and comprises at least two of the dielectric regions (41, 42, 43, 44, 41') being spaced and electrically disconnected from each other by a base material of the substrate carrier (2, 2a-k) and being allocated to at least two of the substrates (31, 32, 33), respectively, wherein the substrate carrier (2, 2a-k) is movable along a transport direction in order to transport the at least two substrates (31, 32, 33) into or out off a PECVD system, and wherein - a distance (d) between the respective back side of each of the at least two substrates (31, 32, 33) and a respective back side of each of the at least two dielectric regions (41, 42, 43, 44, 41') varies over the width (w) of the respective dielectric region (41, 42, 43, 44, 41') and/or varies from one of the dielectric regions to another of the dielectric regions, and/or the electrically conductive electrode comprises at least two additional dielectric regions (51, 52, 53) being allocated to the at least two dielectric regions (41, 42, 43, 44, 41'), respectively, and a distance (d a) between the respective back side of each of the at least two substrates (31, 32, 33) and a respective back side of each of the at least two additional dielectric regions (51, 52, 53) varies over the width (w a) of the respective additional dielectric region (51, 52, 53) and/or varies from one of the additional dielectric regions to another of the additional dielectric regions. the substrate carrier (2, 2a-k) carries at least two of the substrates (31, 32, 33) and comprises at least two of the dielectric regions (41, 42, 43, 44, 41') being spaced and electrically disconnected from each other by a base material of the substrate carrier (2, 2a-k) and being allocated to at least two of the substrates (31, 32, 33), respectively, wherein the substrate carrier (2, 2a-k) is movable along a transport direction in order to transport the at least two substrates (31, 32, 33) into or out off a PECVD system, and wherein - a distance (d) between the respective back side of each of the at least two substrates (31, 32, 33) and a respective back side of each of the at least two dielectric regions (41, 42, 43, 44, 41') varies over the width (w) of the respective dielectric region (41, 42, 43, 44, 41') and/or varies from one of the dielectric regions to another of the dielectric regions, and/or - a distance (d) between the respective back side of each of the at least two substrates (31, 32, 33) and a respective back side of each of the at least two dielectric regions (41, 42, 43, 44, 41') varies over the width (w) of the respective dielectric region (41, 42, 43, 44, 41') and/or varies from one of the dielectric regions to another of the dielectric regions, and/or the electrically conductive electrode comprises at least two additional dielectric regions (51, 52, 53) being allocated to the at least two dielectric regions (41, 42, 43, 44, 41'), respectively, and a distance (d a) between the respective back side of each of the at least two substrates (31, 32, 33) and a respective back side of each of the at least two additional dielectric regions (51, 52, 53) varies over the width (w a) of the respective additional dielectric region (51, 52, 53) and/or varies from one of the additional dielectric regions to another of the additional dielectric regions.