A method of manufacturing a microwave antenna module, comprising the following sequential steps: creating a laminate structure by laminating a plurality of conductive layers (202, 206, 212, 216, 220, 224, 228, 234), wherein the plurality of conductive layers includes ground plane metal layers (202, 212, 224, 234), and dielectric layers (204, 210, 214, 218, 222, 226, 232), said structure comprising a first strip line and a second strip line and a double sided structure interposed between said first and second strip lines (242, 246); creating a plurality of vias (116, 118, 236, 238, 240) within the laminate structure to interconnect the plurality of conductive layers (202, 206, 212, 216, 220, 224, 228, 234) and dielectric layers (204, 210, 214, 218, 222, 226, 232); creating a plurality of cutouts, the cutouts extending from a first side of the laminate structure to a second side of the laminate structure; plating the cutouts from the top side to the bottom side such as to connect the ground plane metal layers (202, 212, 224, 234) to each other; laminating a base plate to a first side of the laminate structure; wherein the baseplate operates as a heat sink; attaching a plurality of standoffs to the baseplate in respective ones of the plurality of cutouts; attaching application specific integrated circuits (ASICs, 106) and monolithic microwave integrated circuits (MMICs, 112) to the standoffs; wirebonding the ASICs and MMICs to an outer conductive layer of the plurality of conductive layers positioned at the first side of the laminate structure; and laminating a seal ring to a periphery of a second side of the laminate structure. creating a laminate structure by laminating a plurality of conductive layers (202, 206, 212, 216, 220, 224, 228, 234), wherein the plurality of conductive layers includes ground plane metal layers (202, 212, 224, 234), and dielectric layers (204, 210, 214, 218, 222, 226, 232), said structure comprising a first strip line and a second strip line and a double sided structure interposed between said first and second strip lines (242, 246); creating a plurality of vias (116, 118, 236, 238, 240) within the laminate structure to interconnect the plurality of conductive layers (202, 206, 212, 216, 220, 224, 228, 234) and dielectric layers (204, 210, 214, 218, 222, 226, 232); creating a plurality of cutouts, the cutouts extending from a first side of the laminate structure to a second side of the laminate structure; plating the cutouts from the top side to the bottom side such as to connect the ground plane metal layers (202, 212, 224, 234) to each other; laminating a base plate to a first side of the laminate structure; wherein the baseplate operates as a heat sink; attaching a plurality of standoffs to the baseplate in respective ones of the plurality of cutouts; attaching application specific integrated circuits (ASICs, 106) and monolithic microwave integrated circuits (MMICs, 112) to the standoffs; wirebonding the ASICs and MMICs to an outer conductive layer of the plurality of conductive layers positioned at the first side of the laminate structure; and laminating a seal ring to a periphery of a second side of the laminate structure.