A semiconductor package, comprising: a lead frame, comprising: a die paddle; a supporting bar connecting to the die paddle, extending in an outward direction from corners of the die paddle; wherein the supporting bar has a ground ring section surrounding the corresponding edges of the die paddle and separated from the die paddle through a plurality of connection portions; a plurality of discrete leads disposed to be separated from the die paddle and the supporting bar, the discrete leads being arranged along corresponding edges of the die paddle and extending in an outward direction from the die paddle and comprising at least two power leads (216, 218), ground leads (220, 222, 224), and signal leads; wherein each of the at least two power leads (216, 218) has a first terminal (216-1, 218-1) extending towards the die paddle and a second terminal opposite to the first terminal (216-1, 218-1) and extending outward from the die paddle; a power bar connecting to the at least two power leads (216, 218), having a supporting portion; and a molding material encapsulating the lead frame leaving the supporting portion exposed; wherein the power bar has a terminal portion (210a, 210b) in contact with the first terminal (216-1, 218-1) of one of the at least two power leads (216, 218), wherein the thickness of the supporting portion is greater than that of the terminal portion (210a, 210b); and wherein the thickness of the supporting portion of the power bar is greater than that of the first terminals (216-1, 218-1); wherein the power bar is disposed between the die paddle and the at least two power leads (216, 218), extending in a direction along a corresponding edge of the die paddle; wherein the power bar is free from contact with any of the ground leads (220, 222, 224); and wherein the ground ring section is in contact with at least some of the ground leads (220, 222, 224). a lead frame, comprising: a die paddle; a supporting bar connecting to the die paddle, extending in an outward direction from corners of the die paddle; wherein the supporting bar has a ground ring section surrounding the corresponding edges of the die paddle and separated from the die paddle through a plurality of connection portions; a plurality of discrete leads disposed to be separated from the die paddle and the supporting bar, the discrete leads being arranged along corresponding edges of the die paddle and extending in an outward direction from the die paddle and comprising at least two power leads (216, 218), ground leads (220, 222, 224), and signal leads; wherein each of the at least two power leads (216, 218) has a first terminal (216-1, 218-1) extending towards the die paddle and a second terminal opposite to the first terminal (216-1, 218-1) and extending outward from the die paddle; a power bar connecting to the at least two power leads (216, 218), having a supporting portion; and a molding material encapsulating the lead frame leaving the supporting portion exposed; wherein the power bar has a terminal portion (210a, 210b) in contact with the first terminal (216-1, 218-1) of one of the at least two power leads (216, 218), wherein the thickness of the supporting portion is greater than that of the terminal portion (210a, 210b); and a die paddle; a supporting bar connecting to the die paddle, extending in an outward direction from corners of the die paddle; wherein the supporting bar has a ground ring section surrounding the corresponding edges of the die paddle and separated from the die paddle through a plurality of connection portions; a plurality of discrete leads disposed to be separated from the die paddle and the supporting bar, the discrete leads being arranged along corresponding edges of the die paddle and extending in an outward direction from the die paddle and comprising at least two power leads (216, 218), ground leads (220, 222, 224), and signal leads; wherein each of the at least two power leads (216, 218) has a first terminal (216-1, 218-1) extending towards the die paddle and a second terminal opposite to the first terminal (216-1, 218-1) and extending outward from the die paddle; a power bar connecting to the at least two power leads (216, 218), having a supporting portion; and a molding material encapsulating the lead frame leaving the supporting portion exposed; wherein the power bar has a terminal portion (210a, 210b) in contact with the first terminal (216-1, 218-1) of one of the at least two power leads (216, 218), wherein the thickness of the supporting portion is greater than that of the terminal portion (210a, 210b); and wherein the thickness of the supporting portion of the power bar is greater than that of the first terminals (216-1, 218-1); wherein the power bar is disposed between the die paddle and the at least two power leads (216, 218), extending in a direction along a corresponding edge of the die paddle; wherein the power bar is free from contact with any of the ground leads (220, 222, 224); and wherein the ground ring section is in contact with at least some of the ground leads (220, 222, 224).