A system comprising electrical components; an enclosure having an interior space divided into at least three chambers for housing the electrical components that generate heat when operating, the enclosure comprising a plurality of heat sinks, the plurality of heat sinks comprises a first heat sink, a second heat sink and a third heat sink; the electrical components comprise: at least one heat generating storage device (204,206) positioned in a first chamber of the at least three chambers, each of the at least one storage device having a heat conductive surface, each of the at least one storage device positioned in the enclosure with the heat conductive surface (220,222) of each engaging the first heat sink forming at least one first heat conductive path; a processor positioned in a second chamber of the at least three chambers, the processor having an integrated heat spreader and a second heat conductive path between the integrated heat spreader and the second heat sink; a power supply positioned in a third chamber of the at least three chambers, the power supply having a third heat conductive path between the power supply and the third heat sink; a barrier provided between the first chamber and the second chamber; and a barrier panel provided between the second chamber and the third chamber. electrical components; an enclosure having an interior space divided into at least three chambers for housing the electrical components that generate heat when operating, the enclosure comprising a plurality of heat sinks, the plurality of heat sinks comprises a first heat sink, a second heat sink and a third heat sink; the electrical components comprise: at least one heat generating storage device (204,206) positioned in a first chamber of the at least three chambers, each of the at least one storage device having a heat conductive surface, each of the at least one storage device positioned in the enclosure with the heat conductive surface (220,222) of each engaging the first heat sink forming at least one first heat conductive path; a processor positioned in a second chamber of the at least three chambers, the processor having an integrated heat spreader and a second heat conductive path between the integrated heat spreader and the second heat sink; a power supply positioned in a third chamber of the at least three chambers, the power supply having a third heat conductive path between the power supply and the third heat sink; a barrier provided between the first chamber and the second chamber; and a barrier panel provided between the second chamber and the third chamber. at least one heat generating storage device (204,206) positioned in a first chamber of the at least three chambers, each of the at least one storage device having a heat conductive surface, each of the at least one storage device positioned in the enclosure with the heat conductive surface (220,222) of each engaging the first heat sink forming at least one first heat conductive path; a processor positioned in a second chamber of the at least three chambers, the processor having an integrated heat spreader and a second heat conductive path between the integrated heat spreader and the second heat sink; a power supply positioned in a third chamber of the at least three chambers, the power supply having a third heat conductive path between the power supply and the third heat sink; a barrier provided between the first chamber and the second chamber; and a barrier panel provided between the second chamber and the third chamber.