A multilayer printed wiring board comprising: a plurality of insulating layers; a plurality of ground layers on the respective insulating layers, the ground layers including: a wiring layer including: a solid conductor having an opening and a passage, the passage communicating with the opening, and a conductive line inside the opening and the passage, and a plurality of first impedance adjustment layers (L12, L12') each including a solid conductor (L121, L121'), the solid conductor of each first impedance adjustment layer having a respective opening (L122, L122'); and a via hole in the wiring layer, the first impedance adjustment layers (L12, L12'), the insulating layer on the wiring layer and the insulating layers on the first impedance adjustment layers, the via hole being located inside the opening of the wiring layer and inside the respective openings of the first impedance adjustment layers and being connected to the conductive line, wherein the via hole includes: a hole; a connection conductor of tuboid shape along the circumference of the hole; a first land provided inside the opening of the wiring layer and connected to the connection conductor; and a plurality of respective second lands each provided inside a respective opening (L122, L122') of one of the first impedance adjustment layers (L12, L12') and connected to the connection conductor; a first distance is smaller than each of a plurality of second distances and all of the second distances are equal, where the first distance is a distance in a first direction (Y-Y') from an outline (α1) of the opening of the wiring layer to the first land of the via hole, and each second distance is a distance in the same direction (Y-Y') as the direction of the first distance from an outline (α2, α2') of the opening of each first impedance adjustment layer (L12, L12') to the corresponding second land of the via hole, and the first direction (Y-Y') is a plane direction of the multilayer printed wiring board extending radially from the central axis of the via hole. a plurality of insulating layers; a plurality of ground layers on the respective insulating layers, the ground layers including: a wiring layer including: a solid conductor having an opening and a passage, the passage communicating with the opening, and a conductive line inside the opening and the passage, and a plurality of first impedance adjustment layers (L12, L12') each including a solid conductor (L121, L121'), the solid conductor of each first impedance adjustment layer having a respective opening (L122, L122'); and a wiring layer including: a solid conductor having an opening and a passage, the passage communicating with the opening, and a conductive line inside the opening and the passage, and a solid conductor having an opening and a passage, the passage communicating with the opening, and a conductive line inside the opening and the passage, and a plurality of first impedance adjustment layers (L12, L12') each including a solid conductor (L121, L121'), the solid conductor of each first impedance adjustment layer having a respective opening (L122, L122'); and a via hole in the wiring layer, the first impedance adjustment layers (L12, L12'), the insulating layer on the wiring layer and the insulating layers on the first impedance adjustment layers, the via hole being located inside the opening of the wiring layer and inside the respective openings of the first impedance adjustment layers and being connected to the conductive line, wherein a hole; a connection conductor of tuboid shape along the circumference of the hole; a first land provided inside the opening of the wiring layer and connected to the connection conductor; and a plurality of respective second lands each provided inside a respective opening (L122, L122') of one of the first impedance adjustment layers (L12, L12') and connected to the connection conductor; a first distance is smaller than each of a plurality of second distances and all of the second distances are equal, where the first distance is a distance in a first direction (Y-Y') from an outline (α1) of the opening of the wiring layer to the first land of the via hole, and each second distance is a distance in the same direction (Y-Y') as the direction of the first distance from an outline (α2, α2') of the opening of each first impedance adjustment layer (L12, L12') to the corresponding second land of the via hole, and a first distance is smaller than each of a plurality of second distances and all of the second distances are equal, where the first distance is a distance in a first direction (Y-Y') from an outline (α1) of the opening of the wiring layer to the first land of the via hole, and each second distance is a distance in the same direction (Y-Y') as the direction of the first distance from an outline (α2, α2') of the opening of each first impedance adjustment layer (L12, L12') to the corresponding second land of the via hole, and the first direction (Y-Y') is a plane direction of the multilayer printed wiring board extending radially from the central axis of the via hole.