A apparatus comprising: a) a first power combiner/divider network configured to split a first electromagnetic signal into a plurality of split electromagnetic signals, at least two of said split electromagnetic signals each connectable to at least one input of a plurality of signal processors (2021 to 2024); b) a second power combiner/divider network configured to combine at least two of a plurality of processed electromagnetic signals into a second electromagnetic signal, at least two of said plurality of processed electromagnetic signals each connectable to at least one output of said plurality of signal processors (2021 to 2024); c) wherein at least a portion of at least one of said first power combiner/divider network and said second power combiner/divider network includes a three-dimensional coaxial microstructure; and d) wherein said apparatus includes at least one of the following: i) at least one tiered portion (2001 to 2005) of at least one of said first power combiner/divider network and said second power combiner/divider network; ii) at least one phase adjuster disposed between said first power combiner/divider network and said second power combiner/divider network; iii) at least one portion of at least one of said first power combiner/divider network and said second power combiner/divider network constructed as a mechanically releasable module; and iv) at least said second power combiner/divider network includes said three-dimensional coaxial microstructure and at least one of the following: a waveguide power combiner/divider; a spatial power combiner/divider; and a electric field probe. a) a first power combiner/divider network configured to split a first electromagnetic signal into a plurality of split electromagnetic signals, at least two of said split electromagnetic signals each connectable to at least one input of a plurality of signal processors (2021 to 2024); b) a second power combiner/divider network configured to combine at least two of a plurality of processed electromagnetic signals into a second electromagnetic signal, at least two of said plurality of processed electromagnetic signals each connectable to at least one output of said plurality of signal processors (2021 to 2024); c) wherein at least a portion of at least one of said first power combiner/divider network and said second power combiner/divider network includes a three-dimensional coaxial microstructure; and d) wherein said apparatus includes at least one of the following: i) at least one tiered portion (2001 to 2005) of at least one of said first power combiner/divider network and said second power combiner/divider network; ii) at least one phase adjuster disposed between said first power combiner/divider network and said second power combiner/divider network; iii) at least one portion of at least one of said first power combiner/divider network and said second power combiner/divider network constructed as a mechanically releasable module; and iv) at least said second power combiner/divider network includes said three-dimensional coaxial microstructure and at least one of the following: a waveguide power combiner/divider; a spatial power combiner/divider; and a electric field probe. i) at least one tiered portion (2001 to 2005) of at least one of said first power combiner/divider network and said second power combiner/divider network; ii) at least one phase adjuster disposed between said first power combiner/divider network and said second power combiner/divider network; iii) at least one portion of at least one of said first power combiner/divider network and said second power combiner/divider network constructed as a mechanically releasable module; and iv) at least said second power combiner/divider network includes said three-dimensional coaxial microstructure and at least one of the following: a waveguide power combiner/divider; a spatial power combiner/divider; and a electric field probe. a waveguide power combiner/divider; a spatial power combiner/divider; and a electric field probe.