A method for forming a touch sensor, comprising: a step of forming light-shielding metal layers on two surfaces of a base film having a UV-blocking function and first photosensitive resin layers on the light-shielding metal layers; a light exposure step of irradiating the first photosensitive resin layers on the light-shielding metal layers with ultraviolet light through different pattern masks (10, 11) over the two surfaces; a step of forming resist patterns by developing the first photosensitive resin layers subjected to light exposure; an etching step of forming routed circuit patterns by removing portions of the light-shielding metal layers not covered with the resist patterns; a step of removing the first photosensitive resin layers covering the routed circuit patterns at at least portions corresponding to connection portions; a step of laminating, on the two surfaces of the base film on which the routed circuit patterns are formed, photosensitive electrically conductive films, each including a support film, an electrically conductive layer and containing an electrically conductive fiber, and a second photosensitive resin layer; a light exposure step of irradiating the second photosensitive resin layers of the photosensitive electrically conductive films laminated on the two surfaces of the base film with ultraviolet light through different pattern masks (12, 13) over the two surfaces; and a development step of developing the second photosensitive resin layers subjected to light exposure to concurrently remove portions of the electrically conductive layers laminated on portions of the second photosensitive resin layers that are to be removed and to form electrode patterns electrically connected to the routed circuit patterns. a step of forming light-shielding metal layers on two surfaces of a base film having a UV-blocking function and first photosensitive resin layers on the light-shielding metal layers; a light exposure step of irradiating the first photosensitive resin layers on the light-shielding metal layers with ultraviolet light through different pattern masks (10, 11) over the two surfaces; a step of forming resist patterns by developing the first photosensitive resin layers subjected to light exposure; an etching step of forming routed circuit patterns by removing portions of the light-shielding metal layers not covered with the resist patterns; a step of removing the first photosensitive resin layers covering the routed circuit patterns at at least portions corresponding to connection portions; a step of laminating, on the two surfaces of the base film on which the routed circuit patterns are formed, photosensitive electrically conductive films, each including a support film, an electrically conductive layer and containing an electrically conductive fiber, and a second photosensitive resin layer; an etching step of forming routed circuit patterns by removing portions of the light-shielding metal layers not covered with the resist patterns; a step of removing the first photosensitive resin layers covering the routed circuit patterns at at least portions corresponding to connection portions; a step of laminating, on the two surfaces of the base film on which the routed circuit patterns are formed, photosensitive electrically conductive films, each including a support film, an electrically conductive layer and containing an electrically conductive fiber, and a second photosensitive resin layer; a light exposure step of irradiating the second photosensitive resin layers of the photosensitive electrically conductive films laminated on the two surfaces of the base film with ultraviolet light through different pattern masks (12, 13) over the two surfaces; and a development step of developing the second photosensitive resin layers subjected to light exposure to concurrently remove portions of the electrically conductive layers laminated on portions of the second photosensitive resin layers that are to be removed and to form electrode patterns electrically connected to the routed circuit patterns.