A method of fabricating a display panel, comprising: forming a first substrate; forming a second substrate; and assembling the first substrate and the second substrate in a cell; wherein forming the first substrate comprises forming a passivation layer on a base substrate, the passivation layer is formed to comprise a base portion and a protruding portion on a side of the base portion distal to the base substrate; wherein the protruding portion is formed in a peripheral area of the display panel and encloses a display area of the display panel, and the base portion is formed to extend throughout the display area and the peripheral area, wherein forming the second substrate comprises forming a sealant material layer on a second base substrate, the sealant material layer is formed in a peripheral area (B') of the second substrate and enclosing a display area (A') of the second substrate; and assembling the first substrate and the second substrate in the cell comprises adhering the sealant material layer onto the protruding portion, thereby forming a sealant layer sealing the display area of the display panel; wherein the sealant layer is formed to have a thickness less than 50% of a thickness of the protruding portion, the thickness of the sealant layer being a height of the sealant layer between a top surface of the protruding portion distal to the base portion and a bottom surface of the second base substrate proximate to the base substrate, the thickness of the protruding portion being a height of the protruding portion between a top surface of the base portion distal to the base substrate and the top surface of the protruding portion distal to the base portion, wherein forming the passivation layer comprises: forming a passivation material layer on the base substrate; forming a first photoresist layer on a side of the passivation material layer distal to the base substrate, the first photoresist layer being in a first region corresponding to the protruding portion; reducing a thickness of the passivation material layer outside the first region, thereby forming the base portion; and removing the first photoresist layer subsequent to reducing the thickness of the passivation material layer outside the first region, thereby forming the protruding portion. forming a first substrate; forming a second substrate; and assembling the first substrate and the second substrate in a cell; wherein forming the first substrate comprises forming a passivation layer on a base substrate, the passivation layer is formed to comprise a base portion and a protruding portion on a side of the base portion distal to the base substrate; wherein the protruding portion is formed in a peripheral area of the display panel and encloses a display area of the display panel, and the base portion is formed to extend throughout the display area and the peripheral area, wherein forming the second substrate comprises forming a sealant material layer on a second base substrate, the sealant material layer is formed in a peripheral area (B') of the second substrate and enclosing a display area (A') of the second substrate; and assembling the first substrate and the second substrate in the cell comprises adhering the sealant material layer onto the protruding portion, thereby forming a sealant layer sealing the display area of the display panel; wherein the sealant layer is formed to have a thickness less than 50% of a thickness of the protruding portion, the thickness of the sealant layer being a height of the sealant layer between a top surface of the protruding portion distal to the base portion and a bottom surface of the second base substrate proximate to the base substrate, the thickness of the protruding portion being a height of the protruding portion between a top surface of the base portion distal to the base substrate and the top surface of the protruding portion distal to the base portion, wherein forming the passivation layer comprises: forming a passivation material layer on the base substrate; forming a first photoresist layer on a side of the passivation material layer distal to the base substrate, the first photoresist layer being in a first region corresponding to the protruding portion; reducing a thickness of the passivation material layer outside the first region, thereby forming the base portion; and removing the first photoresist layer subsequent to reducing the thickness of the passivation material layer outside the first region, thereby forming the protruding portion. forming a passivation material layer on the base substrate; forming a first photoresist layer on a side of the passivation material layer distal to the base substrate, the first photoresist layer being in a first region corresponding to the protruding portion; reducing a thickness of the passivation material layer outside the first region, thereby forming the base portion; and removing the first photoresist layer subsequent to reducing the thickness of the passivation material layer outside the first region, thereby forming the protruding portion.