3D multi-aperture imaging device (70; 1000), comprising: an image sensor with a plurality of image sensor areas (58 11, 58 12, 58 13, 58 14, 58 21, 5822, 58 23, 58 24), wherein each image sensor area includes a plurality of pixels; a first plurality (14 1) of optical channels (16 11, 16 12, 16 13, 1614) for projecting overlapping first partial fields of view (74 11, 74 12, 74 13, 74 14) of a total field of view on first image sensor areas (58 11, 58 12, 58 13, 58 14) of the image sensor; a second plurality (14 2) of optical channels (16 21, 16 22, 16 23, 16 24) for projecting second partial fields of view (74 21, 74 22, 74 23, 74 24) of the total field of view overlapping each other and the first partial fields of view on second image sensor areas (58 21, 58 22, 58 23, 58 24) of the image sensor, wherein the first and second plurality of optical channels are arranged laterally offset from one another by a base distance; a processor that is configured to receive image sensor data (1004 11, 1004 12, 1004 13, 1004 14, 1004 21, 1004 22, 1004 23, 1004 24) from the image sensor comprising information on the first and second partial fields of view (74 11, 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) projected on the first and second plurality of image sensor areas (58 11, 58 12, 58 13, 58 14, 58 21, 58 22, 58 23, 58 24) and that is configured to provide an output signal comprising a data header and payload data, wherein the data header comprises information regarding the structure of the 3D multi-aperture imaging device (70; 1000) and wherein the payload data comprise image information acquired from the pixels of the first image sensor areas and the second image sensor areas; wherein the processor is configured to form the output signal such that the data header comprises information regarding a pressure of an atmosphere surrounding the 3D multi-aperture imaging optics, an environmental temperature of the 3D multi-aperture imaging optics and/or an operating temperature of the 3D multi-aperture imaging optics. an image sensor with a plurality of image sensor areas (58 11, 58 12, 58 13, 58 14, 58 21, 5822, 58 23, 58 24), wherein each image sensor area includes a plurality of pixels; a first plurality (14 1) of optical channels (16 11, 16 12, 16 13, 1614) for projecting overlapping first partial fields of view (74 11, 74 12, 74 13, 74 14) of a total field of view on first image sensor areas (58 11, 58 12, 58 13, 58 14) of the image sensor; a second plurality (14 2) of optical channels (16 21, 16 22, 16 23, 16 24) for projecting second partial fields of view (74 21, 74 22, 74 23, 74 24) of the total field of view overlapping each other and the first partial fields of view on second image sensor areas (58 21, 58 22, 58 23, 58 24) of the image sensor, wherein the first and second plurality of optical channels are arranged laterally offset from one another by a base distance; a processor that is configured to receive image sensor data (1004 11, 1004 12, 1004 13, 1004 14, 1004 21, 1004 22, 1004 23, 1004 24) from the image sensor comprising information on the first and second partial fields of view (74 11, 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) projected on the first and second plurality of image sensor areas (58 11, 58 12, 58 13, 58 14, 58 21, 58 22, 58 23, 58 24) and that is configured to provide an output signal comprising a data header and payload data, wherein the data header comprises information regarding the structure of the 3D multi-aperture imaging device (70; 1000) and wherein the payload data comprise image information acquired from the pixels of the first image sensor areas and the second image sensor areas; wherein the processor is configured to form the output signal such that the data header comprises information regarding a pressure of an atmosphere surrounding the 3D multi-aperture imaging optics, an environmental temperature of the 3D multi-aperture imaging optics and/or an operating temperature of the 3D multi-aperture imaging optics.