An integrated optical transceiver, comprising a laser component, in turn comprising an array of VCSEL, Vertical-Cavity Surface-Emitting Laser, diodes formed on a laser diode substrate; a laser driving component, in turn comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, in turn comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, in turn comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; which optical transceiver further comprises a first heat sink in the form of a connected piece of material arranged to transport excess heat away from the integrated optical transceiver, which first heat sink is connected to both the laser component, the laser driving component and the photodiode driving component; an electrically insulating material separating the photodiode substrate from the first heat sink, which electrically insulating material is either air or a dielectric material with a relative dielectric constant ε < 10, wherein the electrically insulating material provides an electric gap between the photodiode substrate and the first heat sink, the effective electrical distance of said electric gap is at least 80 μm; and a thermally conducting material arranged between, at a first side of the thermally conducting material, the laser component, the laser driving component and the photodiode driving component, and, at a second side of the thermally conducting material, the first heat sink, said thermally conducting material being arranged to absorb thermally induced mechanical movements between the first heat sink, the laser component, the laser driving component and the photodiode driving component, wherein the thermally conducting material is either electrically conductive or a dielectric, and an effective electrical thickness of the thermally conducting dielectric material being at the most 10 μm. a laser component, in turn comprising an array of VCSEL, Vertical-Cavity Surface-Emitting Laser, diodes formed on a laser diode substrate; a laser driving component, in turn comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, in turn comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, in turn comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; a first heat sink in the form of a connected piece of material arranged to transport excess heat away from the integrated optical transceiver, which first heat sink is connected to both the laser component, the laser driving component and the photodiode driving component; an electrically insulating material separating the photodiode substrate from the first heat sink, which electrically insulating material is either air or a dielectric material with a relative dielectric constant ε < 10, wherein the electrically insulating material provides an electric gap between the photodiode substrate and the first heat sink, the effective electrical distance of said electric gap is at least 80 μm; and a thermally conducting material arranged between, at a first side of the thermally conducting material, the laser component, the laser driving component and the photodiode driving component, and, at a second side of the thermally conducting material, the first heat sink, said thermally conducting material being arranged to absorb thermally induced mechanical movements between the first heat sink, the laser component, the laser driving component and the photodiode driving component, wherein the thermally conducting material is either electrically conductive or a dielectric, and an effective electrical thickness of the thermally conducting dielectric material being at the most 10 μm.