Method for producing a multiplicity of electronic sensor apparatuses for detecting chemical or biological species (12, 12', 12"), comprising the following steps: - embedding a multiplicity of semiconductor chips prefabricated in each case from a semiconductor substrate in a respective first region of a substrate surface of a substrate produced from a melt-mouldable material by: - positioning the multiplicity of prefabricated semiconductor chips on an adhesive film such that a respective chip surface of the prefabricated semiconductor chips faces the adhesive film, wherein each of the semiconductor chips is configured for one or more functions selected from a group comprising the following: amplifying and/or evaluating an electrical voltage, amplifying and/or evaluating an electrical current, amplifying and/or evaluating an electrical charge and amplifying and/or reading out capacitance changes; - encapsulating the multiplicity of semiconductor chips positioned on the adhesive film by injection moulding with the melt-mouldable material in order to form a moulding compound substrate; and - removing the adhesive film from the moulding compound substrate with the multiplicity of semiconductor chips embedded therein; - applying a photoresist as a photoresist passivation layer on the moulding compound substrate with the multiplicity of semiconductor chips embedded therein and opening the photoresist passivation layer above predetermined contact areas (38, 38') on the chip surfaces of the semiconductor chips; - applying a multiplicity of sensor devices (40, 40') per semiconductor chip and a multiplicity of electrically conductive connections (44, 44') between the multiplicity of sensor devices (40, 40') and the assigned semiconductor chip on the photoresist passivation layer by means of a thin-film technology or by means of a printing method; - simulating the electronic sensor apparatuses from the moulding compound substrate; and - forming the multiplicity of sensor devices (40, 40') of the singulated electronic sensor apparatuses with a respective active sensor surface on and/or in at least one second region of the substrate surface of the substrate produced from the melt-mouldable material, wherein the respective active sensor surface is configured to detect chemical or biological species (12, 12', 12") and, on account of an interaction with the active sensor surface that is characteristic of the species, to generate an electrical signal selected from a group comprising the following: an electrical voltage, an electrical current, an electrical charge and a capacitance change. - embedding a multiplicity of semiconductor chips prefabricated in each case from a semiconductor substrate in a respective first region of a substrate surface of a substrate produced from a melt-mouldable material by: - positioning the multiplicity of prefabricated semiconductor chips on an adhesive film such that a respective chip surface of the prefabricated semiconductor chips faces the adhesive film, wherein each of the semiconductor chips is configured for one or more functions selected from a group comprising the following: amplifying and/or evaluating an electrical voltage, amplifying and/or evaluating an electrical current, amplifying and/or evaluating an electrical charge and amplifying and/or reading out capacitance changes; - encapsulating the multiplicity of semiconductor chips positioned on the adhesive film by injection moulding with the melt-mouldable material in order to form a moulding compound substrate; and - removing the adhesive film from the moulding compound substrate with the multiplicity of semiconductor chips embedded therein; - applying a photoresist as a photoresist passivation layer on the moulding compound substrate with the multiplicity of semiconductor chips embedded therein and opening the photoresist passivation layer above predetermined contact areas (38, 38') on the chip surfaces of the semiconductor chips; - applying a multiplicity of sensor devices (40, 40') per semiconductor chip and a multiplicity of electrically conductive connections (44, 44') between the multiplicity of sensor devices (40, 40') and the assigned semiconductor chip on the photoresist passivation layer by means of a thin-film technology or by means of a printing method; - simulating the electronic sensor apparatuses from the moulding compound substrate; and - forming the multiplicity of sensor devices (40, 40') of the singulated electronic sensor apparatuses with a respective active sensor surface on and/or in at least one second region of the substrate surface of the substrate produced from the melt-mouldable material, wherein the respective active sensor surface is configured to detect chemical or biological species (12, 12', 12") and, on account of an interaction with the active sensor surface that is characteristic of the species, to generate an electrical signal selected from a group comprising the following: an electrical voltage, an electrical current, an electrical charge and a capacitance change.