A method for repairing a printed circuit board having at least one defective component, wherein the defective component is mechanically and/or electrically connected to the printed circuit board by means of at least one contact point on the printed circuit board, characterized by: the use of a pen, wherein the pen comprises: - a rod-shaped element with an axis of rotation in the longitudinal direction; - a solder application pad, which consists of a main body with an end face (A S) and a pin projecting from the end face (As), wherein the solder application pad has a longitudinal axis and is mounted on an end region of the rod-shaped element in such a way that the longitudinal axis of the main body lies on an extension of the axis of rotation of the rod-shaped element, wherein the pin has a longitudinal axis and is arranged in such a manner that the longitudinal axis of the pin lies on an extension of the axis of rotation of the rod-shaped element, wherein the end face (A S) is designed with rotational symmetry about the longitudinal axis of the pin, and wherein the pin has a projection area (A V) on a first end region, and wherein the projection area is smaller than the end face (As); wherein the pin is designed to be cylindrical, and wherein the end face (A S) is designed such that the angle (α) between the longitudinal axis of the pin and the end face (A S) is less than 180°, preferably between 60° and 120°, particularly preferably substantially 90°, wherein the method comprises at least the following steps: - removing the defective component from the printed circuit board; - cleaning the at least one contact point on the printed circuit board; - using the pen to apply a solder paste to the at least one cleaned contact point on the printed circuit board, wherein the solder application pad of the pen, in a wetting step for wetting with the solder paste, is firstly at least partially placed in a reservoir containing a solder paste, and the wetted solder application pad is then placed, in a transfer step, on the desired contact point on the printed circuit board so that the solder paste can be applied or transferred to the at least one contact point on the printed circuit board; - equipping the printed circuit board with a replacement component anticipated for the defective component; - soldering on the replacement component. the use of a pen, wherein the pen comprises: - a rod-shaped element with an axis of rotation in the longitudinal direction; - a solder application pad, which consists of a main body with an end face (A S) and a pin projecting from the end face (As), wherein the solder application pad has a longitudinal axis and is mounted on an end region of the rod-shaped element in such a way that the longitudinal axis of the main body lies on an extension of the axis of rotation of the rod-shaped element, wherein the pin has a longitudinal axis and is arranged in such a manner that the longitudinal axis of the pin lies on an extension of the axis of rotation of the rod-shaped element, wherein the end face (A S) is designed with rotational symmetry about the longitudinal axis of the pin, and wherein the pin has a projection area (A V) on a first end region, and wherein the projection area is smaller than the end face (As); - a rod-shaped element with an axis of rotation in the longitudinal direction; - a solder application pad, which consists of a main body with an end face (A S) and a pin projecting from the end face (As), wherein the solder application pad has a longitudinal axis and is mounted on an end region of the rod-shaped element in such a way that the longitudinal axis of the main body lies on an extension of the axis of rotation of the rod-shaped element, wherein the pin has a longitudinal axis and is arranged in such a manner that the longitudinal axis of the pin lies on an extension of the axis of rotation of the rod-shaped element, wherein the end face (A S) is designed with rotational symmetry about the longitudinal axis of the pin, and wherein the pin has a projection area (A V) on a first end region, and wherein the projection area is smaller than the end face (As); wherein the pin has a longitudinal axis and is arranged in such a manner that the longitudinal axis of the pin lies on an extension of the axis of rotation of the rod-shaped element, wherein the end face (A S) is designed with rotational symmetry about the longitudinal axis of the pin, and wherein the pin has a projection area (A V) on a first end region, and wherein the projection area is smaller than the end face (As); wherein the pin is designed to be cylindrical, and wherein the end face (A S) is designed such that the angle (α) between the longitudinal axis of the pin and the end face (A S) is less than 180°, preferably between 60° and 120°, particularly preferably substantially 90°, - removing the defective component from the printed circuit board; - cleaning the at least one contact point on the printed circuit board; - using the pen to apply a solder paste to the at least one cleaned contact point on the printed circuit board, wherein the solder application pad of the pen, in a wetting step for wetting with the solder paste, is firstly at least partially placed in a reservoir containing a solder paste, and the wetted solder application pad is then placed, in a transfer step, on the desired contact point on the printed circuit board so that the solder paste can be applied or transferred to the at least one contact point on the printed circuit board; - equipping the printed circuit board with a replacement component anticipated for the defective component; - soldering on the replacement component.