An electronic device, comprising: a substrate; and a system in package assembly including: a plurality of components (601, 602, 603, 604) mounted on the substrate, one or more subsystems (621, 622), each subsystem including one or more of the plurality of components, an insulating layer disposed between the plurality of components and a shielding layer; a plurality of trenches formed in the insulating layer, a multi-layer thin film stack disposed in the plurality of trenches and on the insulator and conformally coating sides of the assembly including outermost side surfaces of the substrate, the multi-layer thin film stack including the shielding layer configured to shield the one or more subsystems from interference, and an adhesion layer disposed on the insulating layer, a protection layer, and a cosmetic layer, wherein the multi-layer thin film stack contacts the substrate within the plurality of trenches wherein the multi-layer thin film stack is disposed between the one or more subsystems, and wherein the multi-layer thin film stack is configured to shield the one or more subsystems from interference. a substrate; and a system in package assembly including: a plurality of components (601, 602, 603, 604) mounted on the substrate, one or more subsystems (621, 622), each subsystem including one or more of the plurality of components, an insulating layer disposed between the plurality of components and a shielding layer; a plurality of trenches formed in the insulating layer, a multi-layer thin film stack disposed in the plurality of trenches and on the insulator and conformally coating sides of the assembly including outermost side surfaces of the substrate, the multi-layer thin film stack including the shielding layer configured to shield the one or more subsystems from interference, and an adhesion layer disposed on the insulating layer, a protection layer, and a cosmetic layer, wherein the multi-layer thin film stack contacts the substrate within the plurality of trenches wherein the multi-layer thin film stack is disposed between the one or more subsystems, and wherein the multi-layer thin film stack is configured to shield the one or more subsystems from interference. a plurality of components (601, 602, 603, 604) mounted on the substrate, one or more subsystems (621, 622), each subsystem including one or more of the plurality of components, an insulating layer disposed between the plurality of components and a shielding layer; a plurality of trenches formed in the insulating layer, a multi-layer thin film stack disposed in the plurality of trenches and on the insulator and conformally coating sides of the assembly including outermost side surfaces of the substrate, the multi-layer thin film stack including the shielding layer configured to shield the one or more subsystems from interference, and an adhesion layer disposed on the insulating layer, a protection layer, and a cosmetic layer, wherein the multi-layer thin film stack contacts the substrate within the plurality of trenches wherein the multi-layer thin film stack is disposed between the one or more subsystems, and wherein the multi-layer thin film stack is configured to shield the one or more subsystems from interference.