A method performed in a cloud computing system including a host server (110, 120, 130, 200), wherein the host server comprises at least a first plurality of memory modules (222, 224, 226, 228, 230, 232, 234, 236, 238, 240, 242, 244, 360, 370, 380) coupled to a first processor (212, 312) and at least a second plurality of memory modules (262, 264, 266, 268, 270, 272, 274, 276, 278, 280, 282, 284, 360, 370, 380) coupled to a second processor (252, 312), wherein the host server comprises a hypervisor (140, 150, 160) for managing a plurality of compute entities for execution by the first processor or the second processor, the method comprising: maintaining, by the hypervisor, a first temperature profile based on information received from a thermal sensor associated with each of a first plurality of memory chips (363, 364, 365, 366, 367,368, 373, 374, 375, 376, 377, 378, 383, 384, 385, 386, 387, 388) included in at least the first plurality of memory modules; maintaining, by the hypervisor, a second temperature profile based on information received from a thermal sensor associated with each of a second plurality of memory chips (363, 364, 365, 366, 367,368, 373, 374, 375, 376, 377, 378, 383, 384, 385, 386, 387, 388) included in at least the second plurality of memory modules; based on at least the first temperature profile, automatically redirecting, by the hypervisor, a first request to write to memory from a first compute entity being executed by the first processor to a selected one of the first plurality of memory chips, whose temperature does not meet or exceed the temperature threshold, included in at least the first plurality of memory modules; and based on at least the second temperature profile, automatically redirecting, by the hypervisor, a second request to write to memory from a second compute entity being executed by the second processor to a selected one of the second plurality of memory chips, whose temperature does not meet or exceed the temperature threshold, included in at least the second plurality of memory modules. maintaining, by the hypervisor, a first temperature profile based on information received from a thermal sensor associated with each of a first plurality of memory chips (363, 364, 365, 366, 367,368, 373, 374, 375, 376, 377, 378, 383, 384, 385, 386, 387, 388) included in at least the first plurality of memory modules; maintaining, by the hypervisor, a second temperature profile based on information received from a thermal sensor associated with each of a second plurality of memory chips (363, 364, 365, 366, 367,368, 373, 374, 375, 376, 377, 378, 383, 384, 385, 386, 387, 388) included in at least the second plurality of memory modules; based on at least the first temperature profile, automatically redirecting, by the hypervisor, a first request to write to memory from a first compute entity being executed by the first processor to a selected one of the first plurality of memory chips, whose temperature does not meet or exceed the temperature threshold, included in at least the first plurality of memory modules; and based on at least the second temperature profile, automatically redirecting, by the hypervisor, a second request to write to memory from a second compute entity being executed by the second processor to a selected one of the second plurality of memory chips, whose temperature does not meet or exceed the temperature threshold, included in at least the second plurality of memory modules.