An information page of a security document including an information portion and a connecting portion for attachment to the security document, said information page comprising: a core layer having a net-like structure and flexibility, said core layer having a body portion and a connecting portion, an intermediate layer; an IC module holding layer provided on a first surface of the body portion of the core layer via the intermediate layer; an IC module housed in an IC module housing space of the IC module holding layer, characterized in that the connecting portion of the information page is constituted solely of the connecting portion of the core layer and in that the IC module includes a substrate, and an IC chip provided on the substrate, and the information page comprising an additional intermediate layer; wherein: the first surface of the body portion of the core layer is bonded to a first surface of the intermediate layer; a first surface of the IC module holding layer is bonded to a second surface of the intermediate layer; a second surface of the IC module holding layer is bonded to the additional intermediate layer; the IC module housing space is surrounded by the intermediate layer, the IC module holding layer and the additional intermediate layer; and wherein the intermediate layer, the additional intermediate layer (14, 14a) and the IC module holding layer are made of polycarbonate. a core layer having a net-like structure and flexibility, said core layer having a body portion and a connecting portion, an intermediate layer; an IC module holding layer provided on a first surface of the body portion of the core layer via the intermediate layer; an IC module housed in an IC module housing space of the IC module holding layer, characterized in that the connecting portion of the information page is constituted solely of the connecting portion of the core layer and in that the IC module includes a substrate, and an IC chip provided on the substrate, and the information page comprising an additional intermediate layer; wherein: the first surface of the body portion of the core layer is bonded to a first surface of the intermediate layer; a first surface of the IC module holding layer is bonded to a second surface of the intermediate layer; a second surface of the IC module holding layer is bonded to the additional intermediate layer; the IC module housing space is surrounded by the intermediate layer, the IC module holding layer and the additional intermediate layer; and wherein the intermediate layer, the additional intermediate layer (14, 14a) and the IC module holding layer are made of polycarbonate. the first surface of the body portion of the core layer is bonded to a first surface of the intermediate layer; a first surface of the IC module holding layer is bonded to a second surface of the intermediate layer; a second surface of the IC module holding layer is bonded to the additional intermediate layer; the IC module housing space is surrounded by the intermediate layer, the IC module holding layer and the additional intermediate layer; and wherein the intermediate layer, the additional intermediate layer (14, 14a) and the IC module holding layer are made of polycarbonate.