A method for manufacturing a surface mount electronic device comprising: providing an attachable board with a plurality of window holes at predetermined intervals wherein the attachable board is made of a transparent material, a circuit board including an insulating board and conductor patterns formed on at least a top surface of the circuit board, the circuit board having an electrode mark located thereon, an adhesive sheet having window holes at predetermined intervals to the conductor patterns of the circuit board, and at least one electronic component; attaching the attachable board to the circuit board with the adhesive sheet such that positions of the plurality of window holes of the attachable board correspond to positions to the window holes of the adhesive sheet; disposing the at least one electronic component on the circuit board and in one, or respective ones, of the plurality of window holes of the attachable board; filling a thermosetting resin into each of the plurality of window holes of the attachable board, wherein the circuit board is exposed via the plurality of window holes of the attachable board and the window holes of the adhesive sheet in view from an upward direction of the attachable board toward the top surface of the circuit board, and heating the thusly formed circuit board to thereby encapsulate the at least one electronic component located in the one, or the respective ones, of the plurality of window holes (2, 4) by the thermosetting resin, wherein the thermosetting resin is either a transparent resin or a mixture resin, wherein the mixture resin of the thermosetting resin includes a transparent resin mixed with at least one of a diffuser, a phosphor, and a pigment for selectively absorbing light having a predetermined wavelength; dicing the encapsulating thermosetting resin and the circuit board at predetermined intervals; and separating the circuit board to provide at least one electronic device. providing an attachable board with a plurality of window holes at predetermined intervals wherein the attachable board is made of a transparent material, a circuit board including an insulating board and conductor patterns formed on at least a top surface of the circuit board, the circuit board having an electrode mark located thereon, an adhesive sheet having window holes at predetermined intervals to the conductor patterns of the circuit board, and at least one electronic component; an attachable board with a plurality of window holes at predetermined intervals wherein the attachable board is made of a transparent material, a circuit board including an insulating board and conductor patterns formed on at least a top surface of the circuit board, the circuit board having an electrode mark located thereon, an adhesive sheet having window holes at predetermined intervals to the conductor patterns of the circuit board, and at least one electronic component; attaching the attachable board to the circuit board with the adhesive sheet such that positions of the plurality of window holes of the attachable board correspond to positions to the window holes of the adhesive sheet; disposing the at least one electronic component on the circuit board and in one, or respective ones, of the plurality of window holes of the attachable board; filling a thermosetting resin into each of the plurality of window holes of the attachable board, wherein the circuit board is exposed via the plurality of window holes of the attachable board and the window holes of the adhesive sheet in view from an upward direction of the attachable board toward the top surface of the circuit board, and heating the thusly formed circuit board to thereby encapsulate the at least one electronic component located in the one, or the respective ones, of the plurality of window holes (2, 4) by the thermosetting resin, wherein the thermosetting resin is either a transparent resin or a mixture resin, wherein the mixture resin of the thermosetting resin includes a transparent resin mixed with at least one of a diffuser, a phosphor, and a pigment for selectively absorbing light having a predetermined wavelength; dicing the encapsulating thermosetting resin and the circuit board at predetermined intervals; and separating the circuit board to provide at least one electronic device.