mhurhangee/ep-ind-claims huggingface dataset:
A sliding component comprising a pair of sliding parts (3, 5) for mutually sliding relative to each other, the sliding parts (3, 5) each are having a sealing face, wherein dimples (10, 15, 17) are provided on one sealing face of the pair of sliding parts (3, 5), wherein a cavitation formation area (10a, 15a, 15a', 17a, 17a') on an upstream side of each dimple (10, 15, 17) is positioned closer to a low-pressure fluid side and a positive-pressure generation area (10b, 15b, 15b', 17b, 17b') on a downstream side is positioned closer to a high-pressure fluid side, the cavitation formation area (10a, 15a, 15a', 17a, 17a') and the positive-pressure generation area (10b, 15b, 15b', 17b, 17b') being shaped so to communicate with each other, so that in use, a fluid which has been suctioned in from the low-pressure fluid side of the cavitation formation area (10a, 15a, 15a', 17a, 17a') of each of the dimples (10, 15, 17) travels in the dimple (10, 15, 17) and is returned to the high-pressure fluid side from the positive-pressure generation area (10b, 15b, 15b', 17b, 17b'), characterised in that the dimples (10, 15, 17) do not communicate with the high-pressure fluid side.
Rotor for a wind turbine, comprising a first and a second blade carrier (2, 3) and a first set of at least two rotor blades, wherein the rotor blades of the first set are blade-shaped and extend helically from the first to the second blade carrier (2, 3), characterised in that the rotor comprises at least one further blade carrier and at least one further set of at least two rotor blades, wherein the rotor blades of the further set are blade-shaped and extend helically from the second to the further blade carrier (3, 5), the arrangement of rotor blades of the further set being arranged at an angle offset to the arrangement of the rotor blades of the first set.
Hydrotreating catalyst sulphiding agent, the catalyst including a support based on at least one oxide of a metal or of a semimetal and at least one active metal, characterized in that the sulphiding agent consists essentially of a disulphide chosen from diethyl disulphide (DEDS), dipropyl disulphide(s) (DPDS) and dibutyl disulphide(s) (DBDS), and in that it comprises less than 20 000 ppm of traces of one or more sulphides of formula RSnR' with n representing the mean sulphur value ranging from 1 to 10 and R and R' representing H or a C 1 -C 24 linear or branched, aryl, cycloalkyl or alkyl chain.
Method for producing an object, wherein the method comprises drying the object (24, 12) or a primary product thereof, the object (24, 12) or a primary product thereof being at least partially dried in at least one drying device, wherein at least one of the at least one drying units contains at least one infrared radiator which is at least partially heated by means of biogas, wherein a combustion gas selected from the group consisting of oxygen, air or other oxygen-containing gases is added to the biogas before said biogas is supplied to the at least one infrared radiator in order to heat said at least one infrared radiator, and the oxygen content in the waste gas resulting from the at least one infrared radiator being heated by means of the biogas is measured by means of a measuring device and the amount of combustion gas added to the biogas before said biogas is supplied to the at least one infrared radiator is controlled on the basis of the measured oxygen content.
An adaptive stair system comprising: - a set of stairs, each stair comprising two movable parts, the parts are adapted to be perpendicular to each other in a first position of the stair, and adapted to rotate to be in parallel to each other to form a ramp in a second position; and - an automatic mechanism adapted to move the parts of the stairs between the first position and the second position characterized by - a position sensor placed in the vicinity of each of the stairs, the position sensor being adapted to sense the presence of the wheelchair, and generate wheelchair presence data, - a microcontroller is in communication coupling with the position sensor, the microcontroller adapted to receive the wheelchair presence data from the position sensor, to process the wheelchair presence data, to determine a position of the wheelchair, and adapted to trigger the automatic mechanism to move the parts of the stairs between the positions (5, 6) based on the position of the wheelchair. - a set of stairs, each stair comprising two movable parts, the parts are adapted to be perpendicular to each other in a first position of the stair, and adapted to rotate to be in parallel to each other to form a ramp in a second position; and - an automatic mechanism adapted to move the parts of the stairs between the first position and the second position characterized by - a position sensor placed in the vicinity of each of the stairs, the position sensor being adapted to sense the presence of the wheelchair, and generate wheelchair presence data, - a microcontroller is in communication coupling with the position sensor, the microcontroller adapted to receive the wheelchair presence data from the position sensor, to process the wheelchair presence data, to determine a position of the wheelchair, and adapted to trigger the automatic mechanism to move the parts of the stairs between the positions (5, 6) based on the position of the wheelchair.
A method of grounding a heat spreader/stiffener (108, 160) to a flip chip package comprising the steps of: attaching an adhesive film (104, 162) to a substrate (100, 154), wherein said adhesive film (104, 162) has a number of first holes corresponding with a number of grounding pads (102, 166) on said substrate (100, 154), said grounding pads (102, 166) configured to provide electrical grounding; attaching a stiffener (108, 160) to said adhesive film (104, 162), said stiffener (108, 160) having a number of second holes corresponding with the number of first holes of the adhesive film (104, 162) and the grounding pads (102, 166) of the substrate (100, 154), wherein the grounding pads (102, 166) are exposed through the first and the second holes dispensing solder or solder balls into the first and the second holes (106, 110); attaching a die containing an integrated circuit to the substrate (100, 154); and attaching a heat spreader (112, 168) to said die and said stiffener (108, 160) using electrically conductive materials (170, 172) such that the solder or solder balls electrically connect the stiffener (108, 160) and the heat spreader (112, 168) to the grounding pads (102, 166) via the first and the second holes (106, 110). attaching an adhesive film (104, 162) to a substrate (100, 154), wherein said adhesive film (104, 162) has a number of first holes corresponding with a number of grounding pads (102, 166) on said substrate (100, 154), said grounding pads (102, 166) configured to provide electrical grounding; attaching a stiffener (108, 160) to said adhesive film (104, 162), said stiffener (108, 160) having a number of second holes corresponding with the number of first holes of the adhesive film (104, 162) and the grounding pads (102, 166) of the substrate (100, 154), wherein the grounding pads (102, 166) are exposed through the first and the second holes dispensing solder or solder balls into the first and the second holes (106, 110); attaching a die containing an integrated circuit to the substrate (100, 154); and attaching a heat spreader (112, 168) to said die and said stiffener (108, 160) using electrically conductive materials (170, 172) such that the solder or solder balls electrically connect the stiffener (108, 160) and the heat spreader (112, 168) to the grounding pads (102, 166) via the first and the second holes (106, 110).
Thermally expandable composition, comprising (a) at least one polymer P, cross-linkable by peroxide, and (b) between 1 wt.-% and 2.5 wt.-%, based on the total weight of the composition, of at least one acrylate A, and (c) between 0.2 wt.-% and 2.5 wt.-%, based on the total weight of the composition, of at least one peroxide, and (d) at least one blowing agent, characterised in that the equivalent ratio of said peroxide to said acrylate A is between 0.01 and 0.5, and the weight ratio of said peroxide to said acrylate A is lower than 0.33 and said polymer P comprises or essentially consists of at least two polymers P1 and P2, wherein P1 exhibits a melt flow index of between 100 and 200 g/10 min, and P2 exhibits a melt flow index of between 0.1 and 60 g/ 10 min, wherein MFI is determined by ASTM D1238, and the weight ratio of the two polymers P1: P2 in the composition is 0.7 to 1.3, and said polymer P essentially consists of ethylene-vinyl acetate polymers. (a) at least one polymer P, cross-linkable by peroxide, and (b) between 1 wt.-% and 2.5 wt.-%, based on the total weight of the composition, of at least one acrylate A, and (c) between 0.2 wt.-% and 2.5 wt.-%, based on the total weight of the composition, of at least one peroxide, and (d) at least one blowing agent,
A semiconductor package comprising: a substrate having an upper surface and a lower surface; a housing cover having a sidewall portion attached to the substrate and an outer wall portion extending over the upper surface of the substrate, the substrate and the housing cover forming a housing that surrounds and defines an interior volume; a pressure sensor device mounted onto the substrate within the interior volume, the pressure sensor having a light sensitive side including a flexible membrane, the light sensitive side facing away from the substrate; a humidity sensor device mounted onto the substrate within the interior volume with the pressure sensor and including a moisture-sensitive material; an evaluation circuit device mounted onto the substrate within the interior volume with the pressure sensor and the humidity sensor and electrically connected to the pressure sensor and the humidity sensor; a media opening in the housing that enables gas exchange between the interior volume and an exterior of the housing in order to allow the interior volume to exhibit ambient pressure and humidity conditions; wherein the media opening is positioned closer to the moisture-sensitive material of the humidity sensor than the flexible membrane of the pressure sensor, and wherein the media opening is positioned in the housing at a location that is offset laterally from the pressure sensor device and below the light sensitive side of the pressure sensor device with respect to vertical. a substrate having an upper surface and a lower surface; a housing cover having a sidewall portion attached to the substrate and an outer wall portion extending over the upper surface of the substrate, the substrate and the housing cover forming a housing that surrounds and defines an interior volume; a pressure sensor device mounted onto the substrate within the interior volume, the pressure sensor having a light sensitive side including a flexible membrane, the light sensitive side facing away from the substrate; a humidity sensor device mounted onto the substrate within the interior volume with the pressure sensor and including a moisture-sensitive material; an evaluation circuit device mounted onto the substrate within the interior volume with the pressure sensor and the humidity sensor and electrically connected to the pressure sensor and the humidity sensor; a media opening in the housing that enables gas exchange between the interior volume and an exterior of the housing in order to allow the interior volume to exhibit ambient pressure and humidity conditions; wherein the media opening is positioned closer to the moisture-sensitive material of the humidity sensor than the flexible membrane of the pressure sensor, and wherein the media opening is positioned in the housing at a location that is offset laterally from the pressure sensor device and below the light sensitive side of the pressure sensor device with respect to vertical.
A process for preparing a compound of formula 4: said process comprising contacting a compound of formula 3: with a reducing agent to produce said compound of formula 4, wherein R 1 is selected from the group consisting of hydrogen, branched or unbranched C 1 -C 6 alkyl and C 7 -C 18 aralkyl; R 2 is an amine protecting group; and R 3 is selected from the group consisting of branched or unbranched C 1 -C 6 alkyl and C 7 -C 18 aralkyl, or R 3 and R 1 together form a 4- to 7-membered cyclic group having from 3 to 6 carbon atoms.
A semiconductor device comprising: a first semiconductor chip; a second semiconductor chip; a metal substrate spaced from the first semiconductor chip and the second semiconductor chip in a first, Z, direction crossing a second, X, direction from the first semiconductor chip to the second semiconductor chip, wherein the second, X, direction is orthogonal to the first direction and to a third, Y, direction; an insulating substrate provided between the first semiconductor chip and the metal substrate and between the second semiconductor chip and the metal substrate; a first bonding member provided between the metal substrate and the insulating substrate, at least part of the first bonding member being located between the first semiconductor chip and the metal substrate in the first direction; and a second bonding member provided between the metal substrate and the insulating substrate, at least part of the second bonding member being located between the second semiconductor chip and the metal substrate in the first direction wherein the first semiconductor chip includes a first overlapping region (OAa) overlapping the first bonding member in the first direction, and an area of the first overlapping region in an intersection plane in the XY plane crossing the first direction is 90 percent or more of a first area of the first semiconductor chip in the intersection plane, wherein the first bonding member includes a first bonding piece and a second bonding piece characterized by a resin provided between the first bonding piece and the second bonding piece in the second, X, direction. a first semiconductor chip; a second semiconductor chip; a metal substrate spaced from the first semiconductor chip and the second semiconductor chip in a first, Z, direction crossing a second, X, direction from the first semiconductor chip to the second semiconductor chip, wherein the second, X, direction is orthogonal to the first direction and to a third, Y, direction; an insulating substrate provided between the first semiconductor chip and the metal substrate and between the second semiconductor chip and the metal substrate; a first bonding member provided between the metal substrate and the insulating substrate, at least part of the first bonding member being located between the first semiconductor chip and the metal substrate in the first direction; and a second bonding member provided between the metal substrate and the insulating substrate, at least part of the second bonding member being located between the second semiconductor chip and the metal substrate in the first direction wherein the first semiconductor chip includes a first overlapping region (OAa) overlapping the first bonding member in the first direction, and an area of the first overlapping region in an intersection plane in the XY plane crossing the first direction is 90 percent or more of a first area of the first semiconductor chip in the intersection plane, wherein the first bonding member includes a first bonding piece and a second bonding piece characterized by a resin provided between the first bonding piece and the second bonding piece in the second, X, direction.
A method for manufacturing a high-density integrally-molded inductor, comprising: winding an enameled wire coil to be spiral; mechanically pressing a first ferromagnetic powder into a magnetic core with a density in a range from 6.2 to 6.9 g/cm 3; mounting the magnetic core into a hollow cavity of the enameled wire coil; (4 mounting the enameled wire coil provided with the magnetic core into an injection mold; uniformly mixing and stirring resin glue having a concentration in a range from 70 to 80% wt, a coupling agent having a concentration in a range from 5 to 10% wt, and an accelerant having a concentration in a range from 15 to 20% wt to obtain a high-temperature resin glue; uniformly stirring a second ferromagnetic powder having a concentration in a range from 88 to 94% wt and the high-temperature resin glue having a concentration in a range from 6 to 12% wt to obtain a magnetic composite material; injecting the magnetic composite material into a mold cavity of the injection mold for molding, and solidifying the magnetic composite material for 1.5∼2.5 hours at 125∼140 degrees Celsius to obtain an outer magnet; and cooling and de-molding the outer magnet to obtain a molded inductor; characterized in that: the resin glue is a modified epoxy silicone resin, the coupling agent is a 3-Mercaptopropylmethyldimethoxysilane, the accelerant is an isophthalic diamine. winding an enameled wire coil to be spiral; mechanically pressing a first ferromagnetic powder into a magnetic core with a density in a range from 6.2 to 6.9 g/cm 3; mounting the magnetic core into a hollow cavity of the enameled wire coil; (4 mounting the enameled wire coil provided with the magnetic core into an injection mold; uniformly mixing and stirring resin glue having a concentration in a range from 70 to 80% wt, a coupling agent having a concentration in a range from 5 to 10% wt, and an accelerant having a concentration in a range from 15 to 20% wt to obtain a high-temperature resin glue; uniformly stirring a second ferromagnetic powder having a concentration in a range from 88 to 94% wt and the high-temperature resin glue having a concentration in a range from 6 to 12% wt to obtain a magnetic composite material; injecting the magnetic composite material into a mold cavity of the injection mold for molding, and solidifying the magnetic composite material for 1.5∼2.5 hours at 125∼140 degrees Celsius to obtain an outer magnet; and cooling and de-molding the outer magnet to obtain a molded inductor; characterized in that: the resin glue is a modified epoxy silicone resin, the coupling agent is a 3-Mercaptopropylmethyldimethoxysilane, the accelerant is an isophthalic diamine.
A spinal connector (400; 100; 300), comprising: a first spinal fixation element having a mating feature that defines an opening, the first spinal fixation element comprising: a first elongate portion; a second elongate portion that is parallel to the first elongate portion and offset from the first elongate portion in one or more dimensions; and an intermediate portion connecting the first and second elongate portions; and a connection assembly coupled to the mating feature such that at least a portion of the connection assembly is received within the opening of the mating feature, the connection assembly comprising: a clamp that defines a recess configured to receive a second spinal fixation element; and a locking element configured to selectively lock the clamp to the second spinal fixation element and to lock one or more degrees of freedom of the connection assembly. a first spinal fixation element having a mating feature that defines an opening, the first spinal fixation element comprising: a first elongate portion; a second elongate portion that is parallel to the first elongate portion and offset from the first elongate portion in one or more dimensions; and an intermediate portion connecting the first and second elongate portions; a first elongate portion; a second elongate portion that is parallel to the first elongate portion and offset from the first elongate portion in one or more dimensions; and an intermediate portion connecting the first and second elongate portions; and a connection assembly coupled to the mating feature such that at least a portion of the connection assembly is received within the opening of the mating feature, the connection assembly comprising: a clamp that defines a recess configured to receive a second spinal fixation element; and a locking element configured to selectively lock the clamp to the second spinal fixation element and to lock one or more degrees of freedom of the connection assembly. a clamp that defines a recess configured to receive a second spinal fixation element; and a locking element configured to selectively lock the clamp to the second spinal fixation element and to lock one or more degrees of freedom of the connection assembly.
An antireflection film comprising, on a surface thereof, a moth-eye structure including a plurality of convex portions such that a width between vertices of adjacent convex portions is no greater than a wavelength of visible light, characterized in that a local maximum value on a curve representing a temperature dependency characteristic of a tan δ of a material forming the antireflection film is no greater than 0.4, a half width of a local maximum value on the curve is no smaller than 52°C, an aspect ratio of each of the plurality of convex portions is no smaller than 0.7 and no greater than 1.1, a height of each of the plurality of convex portions is no smaller than 140 nm and no greater than 220 nm, and a density of the number of sticking structures, whose diameter is equal to or greater than 0.3 μm relative to a planar area of the antireflection film is lower than 2.1 units / μm 2, wherein sticking structures are formed by tip end portions of the convex portions being joined to each other. a local maximum value on a curve representing a temperature dependency characteristic of a tan δ of a material forming the antireflection film is no greater than 0.4, a half width of a local maximum value on the curve is no smaller than 52°C, an aspect ratio of each of the plurality of convex portions is no smaller than 0.7 and no greater than 1.1, a height of each of the plurality of convex portions is no smaller than 140 nm and no greater than 220 nm, and a density of the number of sticking structures, whose diameter is equal to or greater than 0.3 μm relative to a planar area of the antireflection film is lower than 2.1 units / μm 2, wherein sticking structures are formed by tip end portions of the convex portions being joined to each other.