A light emitting device comprising: a plurality of semiconductor laser elements including a first semiconductor laser element; a base comprising a bottom surface and a frame part surrounding the bottom surface on which the plurality of semiconductor laser elements are disposed, the frame part having a pair of first inner lateral surfaces facing each other; a light-reflective member disposed on the bottom surface inside of a frame formed by the frame part, and configured to reflect laser light traveling from the first semiconductor laser element toward one of the first inner lateral surfaces of the frame part; a step part formed along a second inner lateral surface of the frame part, the second inner lateral surface extending along a plane intersecting with a plane along which the one of the first inner lateral surfaces extends, the step part being disposed inside of the frame; a plurality of metal films provided on an upper surface of the step part; a plurality of wires electrically connecting the plurality of semiconductor laser elements respectively to the plurality of metal films; and one or a plurality of protective elements including a protective element disposed across two of the metal films on the upper surface of the step part; wherein no wires are bonded on a light traveling side of the laser light from the semiconductor laser elements with respect to a line including a side being an upper edge of a light-reflective surface of the light-reflective member as seen in a top view, wherein the plurality of the wires include wires bonded on the two of the metal films where the protective element is disposed. a plurality of semiconductor laser elements including a first semiconductor laser element; a base comprising a bottom surface and a frame part surrounding the bottom surface on which the plurality of semiconductor laser elements are disposed, the frame part having a pair of first inner lateral surfaces facing each other; a light-reflective member disposed on the bottom surface inside of a frame formed by the frame part, and configured to reflect laser light traveling from the first semiconductor laser element toward one of the first inner lateral surfaces of the frame part; a step part formed along a second inner lateral surface of the frame part, the second inner lateral surface extending along a plane intersecting with a plane along which the one of the first inner lateral surfaces extends, the step part being disposed inside of the frame; a plurality of metal films provided on an upper surface of the step part; a plurality of wires electrically connecting the plurality of semiconductor laser elements respectively to the plurality of metal films; and one or a plurality of protective elements including a protective element disposed across two of the metal films on the upper surface of the step part; wherein no wires are bonded on a light traveling side of the laser light from the semiconductor laser elements with respect to a line including a side being an upper edge of a light-reflective surface of the light-reflective member as seen in a top view, wherein the plurality of the wires include wires bonded on the two of the metal films where the protective element is disposed.