A service system comprising: a first data processing section provided in a first production base; a second data processing section provided in a second production base; and a server connected to the first data processing section and the second data processing section, wherein a component mounter for mounting an electronic component on a board (Bd) is provided in each of the first production base and the second production base, wherein the component mounter includes a supply device configured to supply the electronic component from an accommodation member in which electronic components are accommodated, and is configured to perform a mounting process by mounting the electronic component supplied from the supply device on the board (Bd), and the server is configured to acquire operation information of the component mounter, being obtained in the mounting process, from the first data processing section, generate analyzed result data obtained by analyzing the operation information based on a type of a manufacturer of at least one of the electronic components and the accommodation member, and transmit the generated analyzed result data to the second data processing section, characterized in that the server is configured to acquire, as the operation information, error information regarding the occurrence of an error in which it is not possible to acquire the electronic component from the supply device in the mounting process, from the first data processing section (16a, 16b, 16c), and calculate, as the analyzed result data, an error occurrence rate for each manufacturer of at least one of the electronic component and the accommodation member, and the first data processing system is configured to, when the error in which it is not possible to acquire the electronic component from the supply device in the mounting process occurs, improve the error occurrence rate by changing at least one of setting data of the component mounter in which the error has occurred and a mounting member mounted on the component mounter, and is further configured to transmit to the server, countermeasure information obtained by associating details of the change of the setting data and the mounting member with manufacturers of the electronic component and the accommodation member. a first data processing section provided in a first production base; a second data processing section provided in a second production base; and a server connected to the first data processing section and the second data processing section, wherein a component mounter for mounting an electronic component on a board (Bd) is provided in each of the first production base and the second production base, wherein the component mounter includes a supply device configured to supply the electronic component from an accommodation member in which electronic components are accommodated, and is configured to perform a mounting process by mounting the electronic component supplied from the supply device on the board (Bd), and the server is configured to acquire operation information of the component mounter, being obtained in the mounting process, from the first data processing section, generate analyzed result data obtained by analyzing the operation information based on a type of a manufacturer of at least one of the electronic components and the accommodation member, and transmit the generated analyzed result data to the second data processing section, characterized in that the server is configured to acquire, as the operation information, error information regarding the occurrence of an error in which it is not possible to acquire the electronic component from the supply device in the mounting process, from the first data processing section (16a, 16b, 16c), and calculate, as the analyzed result data, an error occurrence rate for each manufacturer of at least one of the electronic component and the accommodation member, and the first data processing system is configured to, when the error in which it is not possible to acquire the electronic component from the supply device in the mounting process occurs, improve the error occurrence rate by changing at least one of setting data of the component mounter in which the error has occurred and a mounting member mounted on the component mounter, and is further configured to transmit to the server, countermeasure information obtained by associating details of the change of the setting data and the mounting member with manufacturers of the electronic component and the accommodation member.