A light emitting module comprising: a semiconductor light emitting element; a plate-shaped light wavelength conversion member that is provided so as to face the light emitting surface of the semiconductor light emitting element and is configured to convert the wavelength of the light emitted by the semiconductor light emitting element; and a filter layer that is formed, of the surfaces of the plate-shaped light wavelength conversion member, on at least one of the surface facing the semiconductor light emitting element and the side surface and is configured to transmit the light emitted from the semiconductor light emitting element and to reflect the light whose wavelength has been converted by the light wavelength conversion member; and an adhesive layer that adheres the filter layer and the semiconductor light emitting element, wherein the semiconductor light emitting element is an LED or LD formed such that a ratio of the energy of the emitted light within a range of ±60° with respect to the front direction to the total energy of emitted light is 80% or more, wherein the filter layer is formed, of the surfaces of the light wavelength conversion member, on the surface that faces the semiconductor light emitting element, and the filter layer is formed such that the transmittance, occurring when the light emitted by the semiconductor light emitting element is incident on the filter layer at an incident angle of 60°, is 80% or more, wherein the filter layer functions as a dichroic mirror that is a multi-layered film produced by laminating, one on another, materials each having a refractive index different from those of the others and wherein the adhesive layer contains a material having a refractive index of 1.3 or more. a semiconductor light emitting element; a plate-shaped light wavelength conversion member that is provided so as to face the light emitting surface of the semiconductor light emitting element and is configured to convert the wavelength of the light emitted by the semiconductor light emitting element; and a filter layer that is formed, of the surfaces of the plate-shaped light wavelength conversion member, on at least one of the surface facing the semiconductor light emitting element and the side surface and is configured to transmit the light emitted from the semiconductor light emitting element and to reflect the light whose wavelength has been converted by the light wavelength conversion member; and an adhesive layer that adheres the filter layer and the semiconductor light emitting element, wherein the semiconductor light emitting element is an LED or LD formed such that a ratio of the energy of the emitted light within a range of ±60° with respect to the front direction to the total energy of emitted light is 80% or more, wherein the filter layer is formed, of the surfaces of the light wavelength conversion member, on the surface that faces the semiconductor light emitting element, and the filter layer is formed such that the transmittance, occurring when the light emitted by the semiconductor light emitting element is incident on the filter layer at an incident angle of 60°, is 80% or more, wherein the filter layer functions as a dichroic mirror that is a multi-layered film produced by laminating, one on another, materials each having a refractive index different from those of the others and wherein the adhesive layer contains a material having a refractive index of 1.3 or more.