A force sensor having a sensor substrate joined to a base substrate, the sensor substrate being provided with a plurality of piezoresistance elements, an electrical resistance of each piezoresistance element changing in accordance with the amount of displacement of a displacement portion that is displaced by an external load applied through a pressure receiving unit, wherein the sensor substrate includes a sensor-side support provided on a surface of the sensor substrate on which the plurality of piezoresistance elements are formed, the surface being on a side opposite to a side on which the pressure receiving unit is provided, the sensor-side support supporting the displacement portion such that the displacement portion is able to be displaced, and a plurality of sensor-side electrically connecting portions positioned closer to a periphery of the substrate than the sensor-side support is, each sensor-side electrically connecting portion electrically connected to a corresponding one of the plurality of piezoresistance elements, the plurality of sensor-side electrically connecting portions provided along the periphery of the sensor substrate so as to surround an outer periphery of the sensor-side support, and the plurality of sensor-side electrically connecting portions separated from one another at positions that do not cross a virtual line passing through a center of the pressure receiving unit and a center of each of the plurality of piezoresistance elements, wherein the base substrate includes a base-side support provided on a surface being on a side that is joined to the sensor substrate, the base-side support joined to the sensor-side support, a plurality of base-side electrically connecting portions positioned closer to a periphery of the substrate than the base-side support is, the plurality of base-side electrically connecting portions being joined to the plurality of sensor-side electrically connecting portions, and a plurality of electrode pads formed at ends of electrical wiring extending from the base-side electrically connecting portions, the plurality of electrode pads capable of being connected to external circuitry, characterized in that at least part of the sensor-side support is positioned so as to be superposed with the plurality of piezoresistance elements in plan view, the sensor-side support is formed to have a shape having a closed inner peripheral edge that surrounds an entire periphery of the displacement portion in plan view, and the base-side support has a shape having a closed inner peripheral edge corresponding to the inner peripheral edge of the sensor-side support in plan view, the sensor-side support being joined to the base-side support so as to seal a space surrounded by the inner peripheral edges. a sensor-side support provided on a surface of the sensor substrate on which the plurality of piezoresistance elements are formed, the surface being on a side opposite to a side on which the pressure receiving unit is provided, the sensor-side support supporting the displacement portion such that the displacement portion is able to be displaced, and a plurality of sensor-side electrically connecting portions positioned closer to a periphery of the substrate than the sensor-side support is, each sensor-side electrically connecting portion electrically connected to a corresponding one of the plurality of piezoresistance elements, the plurality of sensor-side electrically connecting portions provided along the periphery of the sensor substrate so as to surround an outer periphery of the sensor-side support, and the plurality of sensor-side electrically connecting portions separated from one another at positions that do not cross a virtual line passing through a center of the pressure receiving unit and a center of each of the plurality of piezoresistance elements, a base-side support provided on a surface being on a side that is joined to the sensor substrate, the base-side support joined to the sensor-side support, a plurality of base-side electrically connecting portions positioned closer to a periphery of the substrate than the base-side support is, the plurality of base-side electrically connecting portions being joined to the plurality of sensor-side electrically connecting portions, and a plurality of electrode pads formed at ends of electrical wiring extending from the base-side electrically connecting portions, the plurality of electrode pads capable of being connected to external circuitry,