A long lasting, energy efficient, solid-state lighting apparatus (100; 200; 300; 400; 500; 600; 700; 800; 900) having customizable design, wherein the apparatus comprises: a) a fixture (102; 402; 502; 602; 702; 802; 902) having at least one mounting surface (104; 504), wherein the fixture is made of at least one thermally conductive sheet metal and is manufactured by computerized numerically controlled, CNC, process, i. the entire body of the fixture acting as a first primary heat sink (802; 902), wherein the fixture is designed in a manner, such that the heat dissipation is maximum in x, y coordinates laterally of the fixture due to optimized thickness (z-axis) of the fixture maintained in the range from 0.5 to 6 mm; and ii. anodization for preventing corrosion and scratches thereby increasing thermal conductivity; iii. a power supply unit (116; 216; 416; 516) enclosed in a housing of the fixture, wherein the power supply unit provides required DC or AC voltage to one or more solid state light emitting sources; iv. optimized design enabling maximum light spread in the required area; b) at least one metal core Printed Circuit Board, MCPCB, (118; 318; 418; 518; 618; 718; 818; 918) mounted on the mounting surface; c) at least one solid state light emitting source (120; 220; 420; 520; 620; 720; 820; 920) mounted on the MCPCB; and d) a second primary heat sink (830; 930) is attached to the first primary heat sink through thermal isolators (834; 934) and/or buffer space, wherein the first primary heat sink has a cut-out opening in which a metallic thermal interface (732; 832; 932) is inserted, and wherein the metallic thermal interface connects the area of the MCPCB which is not connected to the first primary heat sink to the second primary heat sink, and wherein the metallic thermal interface is thermally isolated from the first primary heat sink. a) a fixture (102; 402; 502; 602; 702; 802; 902) having at least one mounting surface (104; 504), wherein the fixture is made of at least one thermally conductive sheet metal and is manufactured by computerized numerically controlled, CNC, process, i. the entire body of the fixture acting as a first primary heat sink (802; 902), wherein the fixture is designed in a manner, such that the heat dissipation is maximum in x, y coordinates laterally of the fixture due to optimized thickness (z-axis) of the fixture maintained in the range from 0.5 to 6 mm; and ii. anodization for preventing corrosion and scratches thereby increasing thermal conductivity; iii. a power supply unit (116; 216; 416; 516) enclosed in a housing of the fixture, wherein the power supply unit provides required DC or AC voltage to one or more solid state light emitting sources; iv. optimized design enabling maximum light spread in the required area; i. the entire body of the fixture acting as a first primary heat sink (802; 902), wherein the fixture is designed in a manner, such that the heat dissipation is maximum in x, y coordinates laterally of the fixture due to optimized thickness (z-axis) of the fixture maintained in the range from 0.5 to 6 mm; and ii. anodization for preventing corrosion and scratches thereby increasing thermal conductivity; iii. a power supply unit (116; 216; 416; 516) enclosed in a housing of the fixture, wherein the power supply unit provides required DC or AC voltage to one or more solid state light emitting sources; iv. optimized design enabling maximum light spread in the required area; b) at least one metal core Printed Circuit Board, MCPCB, (118; 318; 418; 518; 618; 718; 818; 918) mounted on the mounting surface; c) at least one solid state light emitting source (120; 220; 420; 520; 620; 720; 820; 920) mounted on the MCPCB; and d) a second primary heat sink (830; 930) is attached to the first primary heat sink through thermal isolators (834; 934) and/or buffer space, wherein the first primary heat sink has a cut-out opening in which a metallic thermal interface (732; 832; 932) is inserted, and wherein the metallic thermal interface connects the area of the MCPCB which is not connected to the first primary heat sink to the second primary heat sink, and wherein the metallic thermal interface is thermally isolated from the first primary heat sink.