Film capacitor, comprising - at least one metallised dielectric film with a first and second end face (9, 10) and with a first and second film side (11,12) and - a first and second contact layer (7,8), wherein - the first end face of the metallised dielectric film is connected to the first contact layer and the second end face of the metallised dielectric film is connected to the second contact layer, - the metallised dielectric film has at least a first, second and third metallisation layer (4,5,6), - at least two of the metallisation layers (4,5,6) are applied on the first film side of the metallised dielectric film and at least a further of the metallisation layers (4,5,6) is applied on the second film side of the metallised dielectric film, - the metallisation layers (4,5,6) are arranged on the first and second film side (11,12) of the metallised dielectric film in such a manner that at least a first overlap with a first partial capacitance and a second overlap (34,340) with a second partial capacitance (36,360) are embodied between the metallisation layers (4,5,6) of the two film sides (11,12), and the partial capacitances (35,36,360) form a series connection, - the first metallisation layer is electrically contacted with the first contact layer and the second metallisation layer is electrically contacted with the second contact layer, - the third metallisation layer is embodied as electrical contactless in relation to the first and second contact layer (7,8), - the film capacitor has at least a first and second metallised dielectric film (3a,3b), which are arranged in succession and in each case are embodied as metallised dielectric films, - the respective metallisation layers (4,5) of the first and second metallised dielectric films (3a,3b) are embodied in such a manner that - the first metallisation layer of the first metallised dielectric film lies opposite in relation to the first metallisation layer of the second metallised dielectric film and - the second metallisation layer of the first metallised dielectric film lies opposite in relation to the second metallisation layer of the second metallised dielectric film and - the thicknesses of the third metallisation layer of the first and second metallised dielectric films (3a,3b) taper in the direction toward the contact layers (7,8) in each case along the length over which they are applied. - at least one metallised dielectric film with a first and second end face (9, 10) and with a first and second film side (11,12) and - a first and second contact layer (7,8), wherein - the first end face of the metallised dielectric film is connected to the first contact layer and the second end face of the metallised dielectric film is connected to the second contact layer, - the metallised dielectric film has at least a first, second and third metallisation layer (4,5,6), - at least two of the metallisation layers (4,5,6) are applied on the first film side of the metallised dielectric film and at least a further of the metallisation layers (4,5,6) is applied on the second film side of the metallised dielectric film, - the metallisation layers (4,5,6) are arranged on the first and second film side (11,12) of the metallised dielectric film in such a manner that at least a first overlap with a first partial capacitance and a second overlap (34,340) with a second partial capacitance (36,360) are embodied between the metallisation layers (4,5,6) of the two film sides (11,12), and the partial capacitances (35,36,360) form a series connection, - the first metallisation layer is electrically contacted with the first contact layer and the second metallisation layer is electrically contacted with the second contact layer, - the third metallisation layer is embodied as electrical contactless in relation to the first and second contact layer (7,8), - the film capacitor has at least a first and second metallised dielectric film (3a,3b), which are arranged in succession and in each case are embodied as metallised dielectric films, - the respective metallisation layers (4,5) of the first and second metallised dielectric films (3a,3b) are embodied in such a manner that - the first metallisation layer of the first metallised dielectric film lies opposite in relation to the first metallisation layer of the second metallised dielectric film and - the second metallisation layer of the first metallised dielectric film lies opposite in relation to the second metallisation layer of the second metallised dielectric film and - the first metallisation layer of the first metallised dielectric film lies opposite in relation to the first metallisation layer of the second metallised dielectric film and - the second metallisation layer of the first metallised dielectric film lies opposite in relation to the second metallisation layer of the second metallised dielectric film and - the thicknesses of the third metallisation layer of the first and second metallised dielectric films (3a,3b) taper in the direction toward the contact layers (7,8) in each case along the length over which they are applied.