A method of forming a flexible array of piezoelectric micromechanical ultrasonic transducers, PMUTs, comprising: providing a carrier configured to support the flexible array of PMUTs; providing a release layer configured to adhere the flexible array of PMUTs to the carrier; forming the flexible array of PMUTs over the release layer, comprising: for each PMUT in the flexible array of PMUTs, laminating a first polymer layer configured to support the PMUT; depositing, over the first polymer layer, a sacrificial material configured to pattern a cavity of the PMUT; depositing a mechanical layer (110, 112) configured to provide planarization to the PMUT; depositing, over the mechanical layer (110, 112), a first electrode configured to be coupled to a circuit ground plane; depositing a piezoelectric layer configured to separate the first electrode and a second electrode; depositing the second electrode configured to be coupled to a signal; and creating patterns on the first electrode, the piezoelectric material, and the second electrode configured to route control signals of the PMUT; and removing the release layer to separate the flexible array of PMUTs from the carrier. providing a carrier configured to support the flexible array of PMUTs; providing a release layer configured to adhere the flexible array of PMUTs to the carrier; forming the flexible array of PMUTs over the release layer, comprising: for each PMUT in the flexible array of PMUTs, laminating a first polymer layer configured to support the PMUT; depositing, over the first polymer layer, a sacrificial material configured to pattern a cavity of the PMUT; depositing a mechanical layer (110, 112) configured to provide planarization to the PMUT; depositing, over the mechanical layer (110, 112), a first electrode configured to be coupled to a circuit ground plane; depositing a piezoelectric layer configured to separate the first electrode and a second electrode; depositing the second electrode configured to be coupled to a signal; and creating patterns on the first electrode, the piezoelectric material, and the second electrode configured to route control signals of the PMUT; and removing the release layer to separate the flexible array of PMUTs from the carrier. for each PMUT in the flexible array of PMUTs, laminating a first polymer layer configured to support the PMUT; depositing, over the first polymer layer, a sacrificial material configured to pattern a cavity of the PMUT; depositing a mechanical layer (110, 112) configured to provide planarization to the PMUT; depositing, over the mechanical layer (110, 112), a first electrode configured to be coupled to a circuit ground plane; depositing a piezoelectric layer configured to separate the first electrode and a second electrode; depositing the second electrode configured to be coupled to a signal; and creating patterns on the first electrode, the piezoelectric material, and the second electrode configured to route control signals of the PMUT; and laminating a first polymer layer configured to support the PMUT; depositing, over the first polymer layer, a sacrificial material configured to pattern a cavity of the PMUT; depositing a mechanical layer (110, 112) configured to provide planarization to the PMUT; depositing, over the mechanical layer (110, 112), a first electrode configured to be coupled to a circuit ground plane; depositing a piezoelectric layer configured to separate the first electrode and a second electrode; depositing the second electrode configured to be coupled to a signal; and creating patterns on the first electrode, the piezoelectric material, and the second electrode configured to route control signals of the PMUT; and removing the release layer to separate the flexible array of PMUTs from the carrier.