Method for producing a reconstituted plate which comprises chips which have connection pins, this method comprising in sequence the following steps of: - producing a first plate of chips, characterised in that it further comprises the following steps: - producing on this plate a stack of at least one metal layer for redistribution of the pins of the chips on conductive tracks which connect the pins of the chips as far as the periphery of the chips and which are intended to interconnect the chips, this stack being referred to as the main RDL layer, - cutting this plate in order to obtain individual chips which are each provided with their RDL layer, - transferring the individual chips with their RDL layer on a support which is sufficiently rigid to remain flat during the following steps and which is provided with a layer of adhesive, with the RDL layer on the adhesive layer, - depositing a resin in order to encapsulate the chips, - polymerisation of the resin, - removal of the rigid support, - depositing a single redistribution layer referred to as a mini RDL in order to connect the conductive tracks of the main RDL layer as far as the interconnection contacts, via openings which are formed in the layer of adhesive before the chips are transferred on the rigid support and using conductors which are wider than the conductive tracks, the plate comprising the polymerised resin, the chips with their RDL layer, and the mini RDL being the reconstituted plate. - producing a first plate of chips, characterised in that it further comprises the following steps: - producing on this plate a stack of at least one metal layer for redistribution of the pins of the chips on conductive tracks which connect the pins of the chips as far as the periphery of the chips and which are intended to interconnect the chips, this stack being referred to as the main RDL layer, - cutting this plate in order to obtain individual chips which are each provided with their RDL layer, - transferring the individual chips with their RDL layer on a support which is sufficiently rigid to remain flat during the following steps and which is provided with a layer of adhesive, with the RDL layer on the adhesive layer, - depositing a resin in order to encapsulate the chips, - polymerisation of the resin, - removal of the rigid support, - depositing a single redistribution layer referred to as a mini RDL in order to connect the conductive tracks of the main RDL layer as far as the interconnection contacts, via openings which are formed in the layer of adhesive before the chips are transferred on the rigid support and using conductors which are wider than the conductive tracks, the plate comprising the polymerised resin, the chips with their RDL layer, and the mini RDL being the reconstituted plate. - producing on this plate a stack of at least one metal layer for redistribution of the pins of the chips on conductive tracks which connect the pins of the chips as far as the periphery of the chips and which are intended to interconnect the chips, this stack being referred to as the main RDL layer, - cutting this plate in order to obtain individual chips which are each provided with their RDL layer, - transferring the individual chips with their RDL layer on a support which is sufficiently rigid to remain flat during the following steps and which is provided with a layer of adhesive, with the RDL layer on the adhesive layer, - depositing a resin in order to encapsulate the chips, - polymerisation of the resin, - removal of the rigid support, - depositing a single redistribution layer referred to as a mini RDL in order to connect the conductive tracks of the main RDL layer as far as the interconnection contacts, via openings which are formed in the layer of adhesive before the chips are transferred on the rigid support and using conductors which are wider than the conductive tracks, the plate comprising the polymerised resin, the chips with their RDL layer, and the mini RDL being the reconstituted plate.