A light-emitting diode module comprising:- a printed circuit board having a first surface and a second surface, the printed circuit board defining an x-y plane and the first surface having a plurality of mounting apertures (150, 160) formed therein and positioning apertures (180,190) provided thereon; a light-emitting diode array mounted on the first surface of the printed circuit board, the printed circuit board being configured to provide electrical connections to each light-emitting diode element in the light-emitting diode array; a secondary lens array (210; 310) comprising a plurality of secondary lens elements (220; 320), the secondary lens array being configured for being positioned over the light-emitting diode array; and a lens holder (410; 610; 710) mountable to the printed circuit board and configured for retaining the secondary lens array (210; 310) in position with respect to the light-emitting diode array; characterised in that the secondary lens array (210; 310) is moulded as a single component and comprises an optical grade silicone material; in that one of the secondary lens array and the lens holder (410; 610; 710) comprises positioning pins (280, 290; 780, 790) configured for engaging positioning apertures (180, 190) of the printed circuit board for retaining each secondary lens element (220; 320) of the secondary lens array (210; 310) in alignment in the x-y plane with respect to an associated light-emitting diode element of the light-emitting diode array and for maintaining the secondary lens array (210; 310) at a predetermined distance, in a direction perpendicular to the x-y plane, from the first surface of the printed circuit board; and in that the lens holder (410; 610; 710) comprises at least one clip (450, 460; 650, 660; 750, 760) formed on a surface thereof, each clip (450, 460; 650, 660; 750, 760) being configured for engaging an associated mounting aperture (150, 160) formed in the printed circuit board when mounted thereon. a printed circuit board having a first surface and a second surface, the printed circuit board defining an x-y plane and the first surface having a plurality of mounting apertures (150, 160) formed therein and positioning apertures (180,190) provided thereon; a light-emitting diode array mounted on the first surface of the printed circuit board, the printed circuit board being configured to provide electrical connections to each light-emitting diode element in the light-emitting diode array; a secondary lens array (210; 310) comprising a plurality of secondary lens elements (220; 320), the secondary lens array being configured for being positioned over the light-emitting diode array; and a lens holder (410; 610; 710) mountable to the printed circuit board and configured for retaining the secondary lens array (210; 310) in position with respect to the light-emitting diode array; characterised in that the secondary lens array (210; 310) is moulded as a single component and comprises an optical grade silicone material; in that one of the secondary lens array and the lens holder (410; 610; 710) comprises positioning pins (280, 290; 780, 790) configured for engaging positioning apertures (180, 190) of the printed circuit board for retaining each secondary lens element (220; 320) of the secondary lens array (210; 310) in alignment in the x-y plane with respect to an associated light-emitting diode element of the light-emitting diode array and for maintaining the secondary lens array (210; 310) at a predetermined distance, in a direction perpendicular to the x-y plane, from the first surface of the printed circuit board; and in that the lens holder (410; 610; 710) comprises at least one clip (450, 460; 650, 660; 750, 760) formed on a surface thereof, each clip (450, 460; 650, 660; 750, 760) being configured for engaging an associated mounting aperture (150, 160) formed in the printed circuit board when mounted thereon.