A method for laser processing a laminate workpiece stack, the method comprising: positioning the laminate workpiece stack such that a first transparent workpiece is located upstream a second transparent workpiece along a beam pathway, forming a contour line in the first transparent workpiece of the laminate workpiece stack comprising a resin layer disposed between the first transparent workpiece and the second transparent workpiece, being characterised in that forming the contour line comprises: focusing a pulsed laser beam output by a beam source into a pulsed laser beam focal line oriented along the beam pathway and directed into the first transparent workpiece, the pulsed laser beam focal line generating an induced absorption within the first transparent workpiece; and translating the laminate workpiece stack and the pulsed laser beam focal line relative to each other along a first workpiece separation line, thereby laser forming the contour line comprising a plurality of defects along the first workpiece separation line; and separating the resin layer along a resin separation line, wherein separating the resin layer comprises: focusing the pulsed laser beam into the pulsed laser beam focal line oriented along the beam pathway and directed into the resin layer; and translating the laminate workpiece stack and the pulsed laser beam focal line relative to each other along the resin separation line, thereby laser ablating the resin layer along the resin separation line; further comprising, separating the first transparent workpiece along the first workpiece separation line; and positioning the laminate workpiece stack such that the first transparent workpiece is located downstream the second transparent workpiece along the beam pathway subsequent to separating the first transparent workpiece along the first workpiece separation line and prior to separating the resin layer along the resin separation line, wherein upstream and downstream refer to the relative position of two locations or components along the beam pathway with respect to the beam source. positioning the laminate workpiece stack such that a first transparent workpiece is located upstream a second transparent workpiece along a beam pathway, forming a contour line in the first transparent workpiece of the laminate workpiece stack comprising a resin layer disposed between the first transparent workpiece and the second transparent workpiece, being characterised in that forming the contour line comprises: focusing a pulsed laser beam output by a beam source into a pulsed laser beam focal line oriented along the beam pathway and directed into the first transparent workpiece, the pulsed laser beam focal line generating an induced absorption within the first transparent workpiece; and translating the laminate workpiece stack and the pulsed laser beam focal line relative to each other along a first workpiece separation line, thereby laser forming the contour line comprising a plurality of defects along the first workpiece separation line; and focusing a pulsed laser beam output by a beam source into a pulsed laser beam focal line oriented along the beam pathway and directed into the first transparent workpiece, the pulsed laser beam focal line generating an induced absorption within the first transparent workpiece; and translating the laminate workpiece stack and the pulsed laser beam focal line relative to each other along a first workpiece separation line, thereby laser forming the contour line comprising a plurality of defects along the first workpiece separation line; and separating the resin layer along a resin separation line, wherein separating the resin layer comprises: focusing the pulsed laser beam into the pulsed laser beam focal line oriented along the beam pathway and directed into the resin layer; and translating the laminate workpiece stack and the pulsed laser beam focal line relative to each other along the resin separation line, thereby laser ablating the resin layer along the resin separation line; focusing the pulsed laser beam into the pulsed laser beam focal line oriented along the beam pathway and directed into the resin layer; and translating the laminate workpiece stack and the pulsed laser beam focal line relative to each other along the resin separation line, thereby laser ablating the resin layer along the resin separation line; further comprising, separating the first transparent workpiece along the first workpiece separation line; and positioning the laminate workpiece stack such that the first transparent workpiece is located downstream the second transparent workpiece along the beam pathway subsequent to separating the first transparent workpiece along the first workpiece separation line and prior to separating the resin layer along the resin separation line, wherein upstream and downstream refer to the relative position of two locations or components along the beam pathway with respect to the beam source.