Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, wherein the product substrate, the interconnect layer and the carrier substrate form a product substrate-carrier substrate-compound, - the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and - the film comprising a stripping section that is located between the bonding surface section and the attachment section, and - wherein a carrier substrate holder (7,20) is provided for holding the carrier substrate and for force transmission of a force Fs acting on the carrier substrate, and - wherein the device has stripping means with a film frame holder for holding the film frame and acting a force Ff on the film frame for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate, wherein the stripping means are provided such that the product substrate is strippable by deforming the flexible film by means of the force Fs and the force Ff, which is directed against the force Fs and acting on the film frame, characterized in that connection release means comprising fluid means are provided for at least partial dissolving the interconnect layer and acting exclusively in an area of the periphery of the product substrate, wherein a circular solvent reservoir containing the fluid means is attachable sealingly at the periphery of the carrier substrate such that immersing of the product substrate-carrier substrate-compound into the fluid means is enabled in a position of the carrier substrate acted by the force Fs and Ff. - the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and - the film comprising a stripping section that is located between the bonding surface section and the attachment section, and - wherein a carrier substrate holder (7,20) is provided for holding the carrier substrate and for force transmission of a force Fs acting on the carrier substrate, and - wherein the device has stripping means with a film frame holder for holding the film frame and acting a force Ff on the film frame for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate, wherein the stripping means are provided such that the product substrate is strippable by deforming the flexible film by means of the force Fs and the force Ff, which is directed against the force Fs and acting on the film frame, characterized in that connection release means comprising fluid means are provided for at least partial dissolving the interconnect layer and acting exclusively in an area of the periphery of the product substrate, wherein a circular solvent reservoir containing the fluid means is attachable sealingly at the periphery of the carrier substrate such that immersing of the product substrate-carrier substrate-compound into the fluid means is enabled in a position of the carrier substrate acted by the force Fs and Ff.