A thermoelectric module comprising: a first metal substrate including a first through-hole; a first insulating layer disposed on the first metal substrate; a first electrode part disposed on the first insulating layer and including a plurality of first electrodes; a plurality of thermoelectric legs (140, 150) disposed on the first electrode part; a second electrode part disposed on the plurality of thermoelectric legs (140, 150) and including a plurality of second electrodes; a second insulating layer disposed on the second electrode part; and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, wherein the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, wherein the first through-hole is disposed in the effective region of the first metal substrate, wherein the first through-hole and the second through-hole are formed at positions corresponding to each other, characterized in that, the first metal substrate includes a first hole arrangement region which is a space formed by virtual lines (201, 202, 203, 204) connecting surfaces of the first electrodes which are closest to the first through-hole and are disposed adjacent to each other, an area of the first hole arrangement region is four times or more an area of one of the plurality of first electrodes (130a, 130b), and a withstand voltage is 1kV or more. a first metal substrate including a first through-hole; a first insulating layer disposed on the first metal substrate; a first electrode part disposed on the first insulating layer and including a plurality of first electrodes; a plurality of thermoelectric legs (140, 150) disposed on the first electrode part; a second electrode part disposed on the plurality of thermoelectric legs (140, 150) and including a plurality of second electrodes; a second insulating layer disposed on the second electrode part; and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, wherein the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, wherein the first through-hole is disposed in the effective region of the first metal substrate, wherein the first through-hole and the second through-hole are formed at positions corresponding to each other, characterized in that, the first metal substrate includes a first hole arrangement region which is a space formed by virtual lines (201, 202, 203, 204) connecting surfaces of the first electrodes which are closest to the first through-hole and are disposed adjacent to each other, an area of the first hole arrangement region is four times or more an area of one of the plurality of first electrodes (130a, 130b), and a withstand voltage is 1kV or more.