A display device comprising: a display panel; a printed circuit board underneath the display panel and comprising a plurality of insulation layers (111, 113, 115, 117, 119) and a plurality of metal layers (112, 114, 116, 118), each metal layer (112, 114, 116, 118) being disposed between two adjacent insulation layers among the plurality of insulation layers (111, 113, 115, 117, 119), wherein the printed circuit board is formed by alternately stacking the metal layers (112, 114, 116, 118) and the insulation layers (111, 113, 115, 117, 119); and a lower structure between the display panel and the printed circuit board, wherein at least a portion of a metal layer among the plurality of metal layers (112, 114, 116, 118) that is most adjacent to the lower structure is exposed, the exposed portion of the metal layer continuously extending along the entire periphery of the printed circuit board, the lower structure is electrically connected to the exposed portion of the metal layer, wherein the printed circuit board includes a plurality of vias, which overlap with the exposed portion of the metal layer, wherein each of the vias is made up of a metal layer formed along a side surface of a through-hole in the printed circuit board, thereby forming a cylindrical hole in the printed circuit board, and is in contact with all of the metal layers (112, 114, 116, 118) among the plurality of metal layers (112, 114, 116, 118), and wherein the display device further comprises a conductive adhesive pad between the exposed portion of the metal layer and the lower structure, the conductive adhesive pad is a metal paste. a display panel; a printed circuit board underneath the display panel and comprising a plurality of insulation layers (111, 113, 115, 117, 119) and a plurality of metal layers (112, 114, 116, 118), each metal layer (112, 114, 116, 118) being disposed between two adjacent insulation layers among the plurality of insulation layers (111, 113, 115, 117, 119), wherein the printed circuit board is formed by alternately stacking the metal layers (112, 114, 116, 118) and the insulation layers (111, 113, 115, 117, 119); and a lower structure between the display panel and the printed circuit board, wherein at least a portion of a metal layer among the plurality of metal layers (112, 114, 116, 118) that is most adjacent to the lower structure is exposed, the exposed portion of the metal layer continuously extending along the entire periphery of the printed circuit board, the lower structure is electrically connected to the exposed portion of the metal layer, wherein the printed circuit board includes a plurality of vias, which overlap with the exposed portion of the metal layer, wherein each of the vias is made up of a metal layer formed along a side surface of a through-hole in the printed circuit board, thereby forming a cylindrical hole in the printed circuit board, and is in contact with all of the metal layers (112, 114, 116, 118) among the plurality of metal layers (112, 114, 116, 118), and wherein the display device further comprises a conductive adhesive pad between the exposed portion of the metal layer and the lower structure, the conductive adhesive pad is a metal paste.