A light emitting device comprising: at least one light emitting chip including: a substrate upon which a light emitting element is situated, wherein: the light emitting element comprises an active region that is sandwiched between an n-type semiconductor and a p-type semiconductor, and light emitted from a first light emitting surface of the light emitting element is emitted from at least one light emitting surface of the substrate; contact pads that are formed on a second surface of the light emitting element that is opposite the first light emitting surface, wherein at least a first contact pad is connected to the n-type semiconductor and a second contact pad is connected to the p-type semiconductor; and a frame arranged to surround the substrate and light emitting element such that at least a portion of the contact pads and at least a portion of the substrate are not obstructed by the frame, characterized in that the light emitting chip is secured within the frame in that: - the frame is pliable and an opening in the frame is sized to provide a friction fit; - walls on the frame or sidewalls of the light emitting chip are coated with an adhesive before the light emitting chip is inserted into the frame; or - the frame is a shrinkable material that is shrunk after the light emitting chip is inserted into the frame.. a substrate upon which a light emitting element is situated, wherein: the light emitting element comprises an active region that is sandwiched between an n-type semiconductor and a p-type semiconductor, and light emitted from a first light emitting surface of the light emitting element is emitted from at least one light emitting surface of the substrate; the light emitting element comprises an active region that is sandwiched between an n-type semiconductor and a p-type semiconductor, and light emitted from a first light emitting surface of the light emitting element is emitted from at least one light emitting surface of the substrate; contact pads that are formed on a second surface of the light emitting element that is opposite the first light emitting surface, wherein at least a first contact pad is connected to the n-type semiconductor and a second contact pad is connected to the p-type semiconductor; and a frame arranged to surround the substrate and light emitting element such that at least a portion of the contact pads and at least a portion of the substrate are not obstructed by the frame, characterized in that the light emitting chip is secured within the frame in that: - the frame is pliable and an opening in the frame is sized to provide a friction fit; - walls on the frame or sidewalls of the light emitting chip are coated with an adhesive before the light emitting chip is inserted into the frame; or - the frame is a shrinkable material that is shrunk after the light emitting chip is inserted into the frame.. - the frame is pliable and an opening in the frame is sized to provide a friction fit; - walls on the frame or sidewalls of the light emitting chip are coated with an adhesive before the light emitting chip is inserted into the frame; or - the frame is a shrinkable material that is shrunk after the light emitting chip is inserted into the frame..