A battery module of a vehicle comprising: - a multi-layered printed circuit board, PCB, comprising: - a plurality of internal layers comprising: - a distributed power layer; - a distributed ground layer; and - one or more inner signal layers disposed between the distributed power layer and the distributed ground layer, wherein the one or more inner signal layers comprises circuitry for routing circuit signals; - a first external ground cage layer disposed on a side of the distributed power layer opposite the one or more inner signal layers forming a first external layer of the multi-layered PCB; and - a second external ground cage layer disposed on a side of the distributed ground layer opposite the one or more inner signal layers forming a second external layer of the multi-layered PCB, wherein the first and second external ground cage layers are configured to shield the circuitry from electrical noise, and wherein the first and second external cage layers are made from a conductive material and comprise a layer of insulative material on top of the conductive material. - a multi-layered printed circuit board, PCB, comprising: - a plurality of internal layers comprising: - a distributed power layer; - a distributed ground layer; and - one or more inner signal layers disposed between the distributed power layer and the distributed ground layer, wherein the one or more inner signal layers comprises circuitry for routing circuit signals; - a first external ground cage layer disposed on a side of the distributed power layer opposite the one or more inner signal layers forming a first external layer of the multi-layered PCB; and - a second external ground cage layer disposed on a side of the distributed ground layer opposite the one or more inner signal layers forming a second external layer of the multi-layered PCB, wherein the first and second external ground cage layers are configured to shield the circuitry from electrical noise, and wherein the first and second external cage layers are made from a conductive material and comprise a layer of insulative material on top of the conductive material. - a plurality of internal layers comprising: - a distributed power layer; - a distributed ground layer; and - one or more inner signal layers disposed between the distributed power layer and the distributed ground layer, wherein the one or more inner signal layers comprises circuitry for routing circuit signals; - a distributed power layer; - a distributed ground layer; and - one or more inner signal layers disposed between the distributed power layer and the distributed ground layer, wherein the one or more inner signal layers comprises circuitry for routing circuit signals; - a first external ground cage layer disposed on a side of the distributed power layer opposite the one or more inner signal layers forming a first external layer of the multi-layered PCB; and - a second external ground cage layer disposed on a side of the distributed ground layer opposite the one or more inner signal layers forming a second external layer of the multi-layered PCB, wherein the first and second external ground cage layers are configured to shield the circuitry from electrical noise, and wherein the first and second external cage layers are made from a conductive material and comprise a layer of insulative material on top of the conductive material.