A touch sensor assembly comprising: a sensor printed circuit board including: an insulating substrate; and a conductive layer forming a printed circuit on a top surface of the insulating substrate, wherein a sensor support portion having a circular shape hole which passes through at least the conductive layer and the insulating substrate is formed in the sensor PCB; a touch sensor including: a circular metal plate provided at an upper side of the conductive layer; and a ceramic disc provided at a top surface of the metal plate; a conductive foil covering the conductive layer and the touch sensor; and elastic members (720, 721, 724) installed at a bottom surface of the sensor PCB corresponding to an outer side of the sensor support portion to support the sensor PCB, configured to be compressed by touch pressure applied to the touch sensor, wherein the touch sensor is a piezo sensor, disposed on an upper surface of the sensor PCB, wherein the metal plate is placed to cover the sensor support portion, wherein the sensor support portion has a diameter less than the diameter of the metal plate and greater than the diameter of the ceramic disc, such that the metal plate is configured to be deformed by a touch pressure applied to the touch sensor, and wherein the conductive foil has a conductive line which is formed on a bottom surface thereof configured to allow a current to flow to the touch sensor. a sensor printed circuit board including: an insulating substrate; and a conductive layer forming a printed circuit on a top surface of the insulating substrate, wherein a sensor support portion having a circular shape hole which passes through at least the conductive layer and the insulating substrate is formed in the sensor PCB; an insulating substrate; and a conductive layer forming a printed circuit on a top surface of the insulating substrate, wherein a sensor support portion having a circular shape hole which passes through at least the conductive layer and the insulating substrate is formed in the sensor PCB; a touch sensor including: a circular metal plate provided at an upper side of the conductive layer; and a ceramic disc provided at a top surface of the metal plate; a circular metal plate provided at an upper side of the conductive layer; and a ceramic disc provided at a top surface of the metal plate; a conductive foil covering the conductive layer and the touch sensor; and elastic members (720, 721, 724) installed at a bottom surface of the sensor PCB corresponding to an outer side of the sensor support portion to support the sensor PCB, configured to be compressed by touch pressure applied to the touch sensor, wherein the touch sensor is a piezo sensor, disposed on an upper surface of the sensor PCB, wherein the metal plate is placed to cover the sensor support portion, wherein the sensor support portion has a diameter less than the diameter of the metal plate and greater than the diameter of the ceramic disc, such that the metal plate is configured to be deformed by a touch pressure applied to the touch sensor, and wherein the conductive foil has a conductive line which is formed on a bottom surface thereof configured to allow a current to flow to the touch sensor.