A separator (1,10,11,12,13,16) for a conveyance container that houses semiconductor wafers by vertically stacking the semiconductor wafers such that each of the stacked semiconductor wafers does not come into contact with each other, or the semiconductor wafer does not come into contact with an inner top surface or an inner bottom surface of the conveyance container of the semiconductor wafer, the separator being adapted for being interposed: between two of the semiconductor wafers neighboring vertically; between the semiconductor wafer and an inner top surface of the container, or between the semiconductor wafer and an inner bottom surface of the container, wherein the separator comprises: a flat annular body; an annular convex portion with a wafer support surface coming into contact with a peripheral line of the semiconductor wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places, characterized in that the separator has shock-absorbing function pieces neighboring to the cutout portions, the shock-absorbing function piece having a leading edge protruding from the wafer support surface formed on the annular convex portion and extending diagonally upward or diagonally downward from a separator reference plane, the leading edge of the shock-absorbing function piece being arranged such that it comes into contact with the peripheral line of the semiconductor wafer. between two of the semiconductor wafers neighboring vertically; between the semiconductor wafer and an inner top surface of the container, or between the semiconductor wafer and an inner bottom surface of the container, wherein the separator comprises: a flat annular body; an annular convex portion with a wafer support surface coming into contact with a peripheral line of the semiconductor wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places, characterized in that the separator has shock-absorbing function pieces neighboring to the cutout portions, the shock-absorbing function piece having a leading edge protruding from the wafer support surface formed on the annular convex portion and extending diagonally upward or diagonally downward from a separator reference plane, the leading edge of the shock-absorbing function piece being arranged such that it comes into contact with the peripheral line of the semiconductor wafer. a flat annular body; an annular convex portion with a wafer support surface coming into contact with a peripheral line of the semiconductor wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places, characterized in that the separator has shock-absorbing function pieces neighboring to the cutout portions, the shock-absorbing function piece having a leading edge protruding from the wafer support surface formed on the annular convex portion and extending diagonally upward or diagonally downward from a separator reference plane, the leading edge of the shock-absorbing function piece being arranged such that it comes into contact with the peripheral line of the semiconductor wafer.