A wireless communication module comprising: a dielectric substrate; a ground layer (40, 50) that is disposed within the dielectric substrate; an antenna pattern (30, 38) that is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer (40, 50) is and that is configured to operate as an antenna; a high-frequency device that is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface, and that is configured to supply a high-frequency signal to the antenna pattern (30, 38); and a plurality of signal conductor columns and a plurality of ground conductor columns that project from the second surface and that are made of a conductive material, wherein each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, wherein the ground conductor columns are connected to the ground layer (40, 50), and wherein an end of each of the plurality of signal conductor columns and an end of each of the plurality of ground conductor columns are electrically connected to terminals of a mounting substrate, characterized in that the antenna pattern (30, 38) includes a plurality of dipole antennas that are arranged along at least a portion of an outer periphery of the dielectric substrate, the wireless communication module further comprises a reflector pattern that is positioned further inside than the dipole antennas when viewed in plan view and that serves as a reflector of the dipole antennas and an interlayer connection conductor (35, 45, 55) that connects the reflector pattern to the plurality of ground conductor columns, and the ground conductor columns are configured to serve as reflectors of the dipole antennas together with the reflector pattern, the antenna pattern further includes conductor patterns for a plurality of patch antennas, the conductor patterns being positioned further inside than the dipole antennas. a dielectric substrate; a ground layer (40, 50) that is disposed within the dielectric substrate; an antenna pattern (30, 38) that is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer (40, 50) is and that is configured to operate as an antenna; a high-frequency device that is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface, and that is configured to supply a high-frequency signal to the antenna pattern (30, 38); and a plurality of signal conductor columns and a plurality of ground conductor columns that project from the second surface and that are made of a conductive material, wherein each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, wherein the ground conductor columns are connected to the ground layer (40, 50), and wherein an end of each of the plurality of signal conductor columns and an end of each of the plurality of ground conductor columns are electrically connected to terminals of a mounting substrate, characterized in that the antenna pattern (30, 38) includes a plurality of dipole antennas that are arranged along at least a portion of an outer periphery of the dielectric substrate, the wireless communication module further comprises a reflector pattern that is positioned further inside than the dipole antennas when viewed in plan view and that serves as a reflector of the dipole antennas and an interlayer connection conductor (35, 45, 55) that connects the reflector pattern to the plurality of ground conductor columns, and the ground conductor columns are configured to serve as reflectors of the dipole antennas together with the reflector pattern, the antenna pattern further includes conductor patterns for a plurality of patch antennas, the conductor patterns being positioned further inside than the dipole antennas.