An organic light-emitting display device comprising: a substrate comprising an active area and a non-active area; a plurality of thin-film transistors disposed in the active area; a plurality of light-emitting elements connected to the respective thin-film transistors in the active area; an encapsulation layer configured to cover the thin-film transistors and the light-emitting elements; a touch electrode array comprising a plurality of first touch electrodes and second touch electrodes arranged on top of the encapsulation layer to intersect each other in the active area; a plurality of display pads and a plurality of touch pads arranged in the non-active area on a same side of the substrate so as to be parallel to and spaced apart from each other; and a flexible printed circuit board connected to both the display pads and the touch pads, wherein the encapsulation layer includes at least two inorganic encapsulation layers (142, 146) and at least one organic encapsulation layer between the inorganic encapsulation layers (142, 146), wherein the encapsulation layer has a sidewall on the non-active area of the substrate, wherein a plurality of touch link wires above the encapsulation layer are extended along the sidewall of the encapsulation layer and enter the non-active area of the substrate located outside the encapsulation layer to connect the touch pads to the first touch electrodes, and wherein a plurality of display link wires are provided in the non-active area below the encapsulation layer on the substrate and configured to connect the display pads to the thin-film transistors, respectively, wherein each first touch electrode comprises a first touch pattern and a first bridge, wherein each second touch electrode comprises a second touch pattern and a second bridge, wherein the first touch pattern and the second touch pattern are in the same layer, wherein the first bridge is integrated with the first touch pattern, and wherein the second bridge is located in a layer different from the first touch pattern and the second touch pattern, a touch insulation layer being interposed therebetween at an intersection of the first touch electrode and the second touch electrode, wherein the second bridge is connected to the second touch pattern through a touch connection hole formed in the touch insulation layer, wherein each touch pad comprises touch pad electrodes (168, 174) in multiple layers, wherein each touch link wire is located in the same layer as the second bridge, and wherein each touch link wire is lengthened to the touch pads so as to form a first connection pad electrode on a first touch pad electrode of the touch pad electrodes (168, 174) of one of the touch pads. a substrate comprising an active area and a non-active area; a plurality of thin-film transistors disposed in the active area; a plurality of light-emitting elements connected to the respective thin-film transistors in the active area; an encapsulation layer configured to cover the thin-film transistors and the light-emitting elements; a touch electrode array comprising a plurality of first touch electrodes and second touch electrodes arranged on top of the encapsulation layer to intersect each other in the active area; a plurality of display pads and a plurality of touch pads arranged in the non-active area on a same side of the substrate so as to be parallel to and spaced apart from each other; and a flexible printed circuit board connected to both the display pads and the touch pads, wherein the encapsulation layer includes at least two inorganic encapsulation layers (142, 146) and at least one organic encapsulation layer between the inorganic encapsulation layers (142, 146), wherein the encapsulation layer has a sidewall on the non-active area of the substrate, wherein a plurality of touch link wires above the encapsulation layer are extended along the sidewall of the encapsulation layer and enter the non-active area of the substrate located outside the encapsulation layer to connect the touch pads to the first touch electrodes, and wherein a plurality of display link wires are provided in the non-active area below the encapsulation layer on the substrate and configured to connect the display pads to the thin-film transistors, respectively, wherein each first touch electrode comprises a first touch pattern and a first bridge, wherein each second touch electrode comprises a second touch pattern and a second bridge, wherein the first touch pattern and the second touch pattern are in the same layer, wherein the first bridge is integrated with the first touch pattern, and wherein the second bridge is located in a layer different from the first touch pattern and the second touch pattern, a touch insulation layer being interposed therebetween at an intersection of the first touch electrode and the second touch electrode, wherein the second bridge is connected to the second touch pattern through a touch connection hole formed in the touch insulation layer, wherein each touch pad comprises touch pad electrodes (168, 174) in multiple layers, wherein each touch link wire is located in the same layer as the second bridge, and wherein each touch link wire is lengthened to the touch pads so as to form a first connection pad electrode on a first touch pad electrode of the touch pad electrodes (168, 174) of one of the touch pads.