An integrated deposition system for fabricating an electrochromic stack, the integrated deposition system comprising: a plurality of deposition stations aligned in series and interconnected and operable to pass a substrate from one station to the next without exposing the substrate to an external environment, wherein the plurality of deposition stations comprise (i) a first deposition station containing one or more material sources for depositing a cathodically coloring layer; (ii) a second deposition station containing one or more material sources for depositing an anodically coloring layer comprising nickel tungsten tantalum oxide, wherein at least one of the one or more material sources for depositing the anodically coloring layer comprise either an elemental metal selected from the group consisting of: nickel, tungsten, and tantalum, or comprise an alloy comprising two or more metals selected from the group consisting of: nickel, tungsten, and tantalum; and a controller containing program instructions for passing the substrate through the plurality of deposition stations in a manner that deposits on the substrate (i) the cathodically coloring layer, and (ii) the anodically coloring layer to form a stack comprising at least the cathodically coloring layer and the anodically coloring layer, and characterized in that the controller contains program instructions for depositing the anodically coloring layer as two or more sub-layers having different compositions and/or morphologies. a plurality of deposition stations aligned in series and interconnected and operable to pass a substrate from one station to the next without exposing the substrate to an external environment, wherein the plurality of deposition stations comprise (i) a first deposition station containing one or more material sources for depositing a cathodically coloring layer; (ii) a second deposition station containing one or more material sources for depositing an anodically coloring layer comprising nickel tungsten tantalum oxide, wherein at least one of the one or more material sources for depositing the anodically coloring layer comprise either an elemental metal selected from the group consisting of: nickel, tungsten, and tantalum, or comprise an alloy comprising two or more metals selected from the group consisting of: nickel, tungsten, and tantalum; and (i) a first deposition station containing one or more material sources for depositing a cathodically coloring layer; (ii) a second deposition station containing one or more material sources for depositing an anodically coloring layer comprising nickel tungsten tantalum oxide, wherein at least one of the one or more material sources for depositing the anodically coloring layer comprise either an elemental metal selected from the group consisting of: nickel, tungsten, and tantalum, or comprise an alloy comprising two or more metals selected from the group consisting of: nickel, tungsten, and tantalum; and a controller containing program instructions for passing the substrate through the plurality of deposition stations in a manner that deposits on the substrate (i) the cathodically coloring layer, and (ii) the anodically coloring layer to form a stack comprising at least the cathodically coloring layer and the anodically coloring layer, and characterized in that the controller contains program instructions for depositing the anodically coloring layer as two or more sub-layers having different compositions and/or morphologies.