An antenna device, the device comprising: a radiating slot plane comprising: a radiating slot array comprising a plurality of radiating slots; a printed circuit board, PCB, comprising a first plated layer, a second plated layer, and a substrate layer, wherein each radiating slot of the radiating slot array includes an interior surface, wherein: the interior surface of each radiating slot extends from the first plated layer to the second plated layer through the substrate layer, the interior surface of each radiating slot comprises a conductive plated material, wherein the conductive plated material electrically connects the first plated layer to the second plated layer; a radiating waveguide comprising: a radio frequency, RF, conducting path, wherein the RF conducting path of the radiating waveguide comprises a gas; a third plated layer; a conductive outer plated layer; and the second plated layer, wherein: the second plated layer and the third plated layer comprise a conductive material, the second plated layer is electrically connected to the third plated layer and is electrically connected to the first plated layer of the radiating plane; the third plated layer is electrically connected to the first plated layer of the radiating slot plane, characterized in that the radiating waveguide is further comprising: a plurality of through-holes, wherein the plurality of through-holes electrically connects to the first plated layer and the outer plated layer, a termination edge configured to partially cover an end of the RF conducting path such that the end of the RF conducting path is configured to release moisture and particles. a radiating slot plane comprising: a radiating slot array comprising a plurality of radiating slots; a printed circuit board, PCB, comprising a first plated layer, a second plated layer, and a substrate layer, wherein each radiating slot of the radiating slot array includes an interior surface, wherein: the interior surface of each radiating slot extends from the first plated layer to the second plated layer through the substrate layer, the interior surface of each radiating slot comprises a conductive plated material, wherein the conductive plated material electrically connects the first plated layer to the second plated layer; a radiating slot array comprising a plurality of radiating slots; a printed circuit board, PCB, comprising a first plated layer, a second plated layer, and a substrate layer, wherein each radiating slot of the radiating slot array includes an interior surface, wherein: the interior surface of each radiating slot extends from the first plated layer to the second plated layer through the substrate layer, the interior surface of each radiating slot comprises a conductive plated material, wherein the conductive plated material electrically connects the first plated layer to the second plated layer; the interior surface of each radiating slot extends from the first plated layer to the second plated layer through the substrate layer, the interior surface of each radiating slot comprises a conductive plated material, wherein the conductive plated material electrically connects the first plated layer to the second plated layer; a radiating waveguide comprising: a radio frequency, RF, conducting path, wherein the RF conducting path of the radiating waveguide comprises a gas; a third plated layer; a conductive outer plated layer; and the second plated layer, wherein: the second plated layer and the third plated layer comprise a conductive material, the second plated layer is electrically connected to the third plated layer and is electrically connected to the first plated layer of the radiating plane; the third plated layer is electrically connected to the first plated layer of the radiating slot plane, a radio frequency, RF, conducting path, wherein the RF conducting path of the radiating waveguide comprises a gas; a third plated layer; a conductive outer plated layer; and the second plated layer, wherein: the second plated layer and the third plated layer comprise a conductive material, the second plated layer is electrically connected to the third plated layer and is electrically connected to the first plated layer of the radiating plane; the third plated layer is electrically connected to the first plated layer of the radiating slot plane, the second plated layer and the third plated layer comprise a conductive material, the second plated layer is electrically connected to the third plated layer and is electrically connected to the first plated layer of the radiating plane; the third plated layer is electrically connected to the first plated layer of the radiating slot plane, characterized in that the radiating waveguide is further comprising: a plurality of through-holes, wherein the plurality of through-holes electrically connects to the first plated layer and the outer plated layer, a termination edge configured to partially cover an end of the RF conducting path such that the end of the RF conducting path is configured to release moisture and particles. a plurality of through-holes, wherein the plurality of through-holes electrically connects to the first plated layer and the outer plated layer, a termination edge configured to partially cover an end of the RF conducting path such that the end of the RF conducting path is configured to release moisture and particles.