Method for manufacturing integrated infrared emitter elements having an optical filter, comprising: providing a carrier substrate having a target thickness (t B), wherein an insulating material layer and a structured conductive layer are arranged on a first main surface region (220-A) of the carrier substrate, wherein the insulating material layer is arranged between the carrier substrate and the structured conductive layer, back side etching through the carrier substrate for providing cavities extending between the first and second main surface regions of the carrier substrate, wherein the cavities define a frame structure which laterally surrounds the cavities, wherein first portions of the structured conductive layer which span the cavities form active heating regions of the infrared emitter elements, and wherein second and third portions (230-2, 230-3) of the structured conductive layer which are supported by the frame structure form first and second contact pads (230-2, 230-3) of the infrared emitter elements, forming adhesive spacer elements on portions of the structured conductive layer, which are supported by the frame structure, placing a filter substrate having a filter carrier substrate and a filter layer on the adhesive spacer elements, so that the filter layer is arranged between the adhesive spacer elements and the filter carrier substrate, fixing the adhesive spacer elements to the carrier substrate and the filter carrier substrate by curing the material of the adhesive spacer elements, pre-dicing through the filter substrate for exposing the contact pads (230-2, 230-3) of the structured conductive layer, and dicing through the frame structure of the carrier substrate for separating the integrated infrared emitter elements having the optical filter. providing a carrier substrate having a target thickness (t B), wherein an insulating material layer and a structured conductive layer are arranged on a first main surface region (220-A) of the carrier substrate, wherein the insulating material layer is arranged between the carrier substrate and the structured conductive layer, back side etching through the carrier substrate for providing cavities extending between the first and second main surface regions of the carrier substrate, wherein the cavities define a frame structure which laterally surrounds the cavities, wherein first portions of the structured conductive layer which span the cavities form active heating regions of the infrared emitter elements, and wherein second and third portions (230-2, 230-3) of the structured conductive layer which are supported by the frame structure form first and second contact pads (230-2, 230-3) of the infrared emitter elements, wherein first portions of the structured conductive layer which span the cavities form active heating regions of the infrared emitter elements, and wherein second and third portions (230-2, 230-3) of the structured conductive layer which are supported by the frame structure form first and second contact pads (230-2, 230-3) of the infrared emitter elements, forming adhesive spacer elements on portions of the structured conductive layer, which are supported by the frame structure, placing a filter substrate having a filter carrier substrate and a filter layer on the adhesive spacer elements, so that the filter layer is arranged between the adhesive spacer elements and the filter carrier substrate, fixing the adhesive spacer elements to the carrier substrate and the filter carrier substrate by curing the material of the adhesive spacer elements, pre-dicing through the filter substrate for exposing the contact pads (230-2, 230-3) of the structured conductive layer, and dicing through the frame structure of the carrier substrate for separating the integrated infrared emitter elements having the optical filter.