An optical system, comprising: an electrical integrated circuit, IC, comprising a bottom surface; a printed circuit board, PCB, comprising a top surface and a bottom surface, a top surface of a portion of the PCB comprising a first plurality of electrical connections to the bottom surface of the electrical IC; and a photonic chip comprising: a top surface and a recessed surface that are both normal to a common direction, wherein the recessed surface is recessed relative to the top surface along the common direction to form an alignment area, wherein a depth of the alignment area is greater than or equal to a thickness of the portion of the PCB disposed in the alignment area, whereby the top surface of the portion of the PCB is substantially aligned with the top surface of the photonic chip, wherein both the top surface of the photonic chip and the recessed surface face the bottom surface of the electrical IC, and wherein the electrical IC overlays both the top surface of the photonic chip and the recessed surface; a bonding region disposed on the top surface of the photonic chip, wherein the bonding region comprises a plurality of bond pads, at least some of which are configured to form electrical connections to the electrical IC; an optical component electrically coupled to at least one of the plurality of bond pads, wherein the optical component is configured to carry an optical signal within the photonic chip; and a raised feature extending from the recessed surface along the common direction and separated from the top surface of the photonic chip by the recessed surface, wherein a bonding surface of the raised feature is substantially within a same plane as the top surface of the photonic chip, wherein the bonding surface is configured to couple to the electrical IC, wherein the portion of the PCB includes one or more surfaces defining an aperture through which the raised feature extends when the portion of the PCB is disposed in the alignment area. an electrical integrated circuit, IC, comprising a bottom surface; a printed circuit board, PCB, comprising a top surface and a bottom surface, a top surface of a portion of the PCB comprising a first plurality of electrical connections to the bottom surface of the electrical IC; and a photonic chip comprising: a top surface and a recessed surface that are both normal to a common direction, wherein the recessed surface is recessed relative to the top surface along the common direction to form an alignment area, wherein a depth of the alignment area is greater than or equal to a thickness of the portion of the PCB disposed in the alignment area, whereby the top surface of the portion of the PCB is substantially aligned with the top surface of the photonic chip, wherein both the top surface of the photonic chip and the recessed surface face the bottom surface of the electrical IC, and wherein the electrical IC overlays both the top surface of the photonic chip and the recessed surface; a bonding region disposed on the top surface of the photonic chip, wherein the bonding region comprises a plurality of bond pads, at least some of which are configured to form electrical connections to the electrical IC; an optical component electrically coupled to at least one of the plurality of bond pads, wherein the optical component is configured to carry an optical signal within the photonic chip; and a top surface and a recessed surface that are both normal to a common direction, wherein the recessed surface is recessed relative to the top surface along the common direction to form an alignment area, wherein a depth of the alignment area is greater than or equal to a thickness of the portion of the PCB disposed in the alignment area, whereby the top surface of the portion of the PCB is substantially aligned with the top surface of the photonic chip, wherein both the top surface of the photonic chip and the recessed surface face the bottom surface of the electrical IC, and wherein the electrical IC overlays both the top surface of the photonic chip and the recessed surface; a bonding region disposed on the top surface of the photonic chip, wherein the bonding region comprises a plurality of bond pads, at least some of which are configured to form electrical connections to the electrical IC; an optical component electrically coupled to at least one of the plurality of bond pads, wherein the optical component is configured to carry an optical signal within the photonic chip; and a raised feature extending from the recessed surface along the common direction and separated from the top surface of the photonic chip by the recessed surface, wherein a bonding surface of the raised feature is substantially within a same plane as the top surface of the photonic chip, wherein the bonding surface is configured to couple to the electrical IC, wherein the portion of the PCB includes one or more surfaces defining an aperture through which the raised feature extends when the portion of the PCB is disposed in the alignment area.