Device for conditioning semiconductor chips, comprising: a chip temperature control device (TE1, TE2, TE3) for receiving one or a plurality of semiconductor chips, which has a base body, which can be flushed through by a liquid for temperature control and has a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip contact sockets which are introduced into the recesses in thermal contact with the base body, which have a chip receiving region on the front face and which have a wiring device (D1, D2) in the interior which is set up to connect electrical signals from and/or to the semiconductor chip inserted into the chip receiving region; a base circuit board, which is attached to the rear face of the base body in such a way that the wiring device (D1, D2) of the chip contact socket is in an electrical connection to a wiring device of the base circuit board; and a support table, to which the base body and the base circuit board attached thereto are fixed, and which is rotatable about at least one axis in such a way that test measurements are possible in various angular positions of the semiconductor chips; wherein chip holding devices (H1, H2) are provided on the front face of the base body, laterally alongside the respective chip contact sockets, and are each actuable to hold a semiconductor chip in the associated chip receiving region, wherein the chip holding devices (H1, H2) have mechanically, pneumatically or electrically actuable holding arms (A1, A2; A1', A2; A1", A2"), which are can be vertically lifted and laterally rotated with respect to the base body so as to lift up and set down the semiconductor chips; and wherein a handling device for simultaneously loading and unloading the semiconductor chips is provided. a chip temperature control device (TE1, TE2, TE3) for receiving one or a plurality of semiconductor chips, which has a base body, which can be flushed through by a liquid for temperature control and has a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip contact sockets which are introduced into the recesses in thermal contact with the base body, which have a chip receiving region on the front face and which have a wiring device (D1, D2) in the interior which is set up to connect electrical signals from and/or to the semiconductor chip inserted into the chip receiving region; a base circuit board, which is attached to the rear face of the base body in such a way that the wiring device (D1, D2) of the chip contact socket is in an electrical connection to a wiring device of the base circuit board; and a support table, to which the base body and the base circuit board attached thereto are fixed, and which is rotatable about at least one axis in such a way that test measurements are possible in various angular positions of the semiconductor chips; wherein chip holding devices (H1, H2) are provided on the front face of the base body, laterally alongside the respective chip contact sockets, and are each actuable to hold a semiconductor chip in the associated chip receiving region, wherein the chip holding devices (H1, H2) have mechanically, pneumatically or electrically actuable holding arms (A1, A2; A1', A2; A1", A2"), which are can be vertically lifted and laterally rotated with respect to the base body so as to lift up and set down the semiconductor chips; and wherein a handling device for simultaneously loading and unloading the semiconductor chips is provided.