An electronic device comprising: a communication circuit that is communicatively connected to a solder printing apparatus configured to print solder on each of a plurality of substrates based on a plurality of control parameters and a measurement apparatus configured to measure a state of the solder printed on each of the plurality of substrates transferred from the solder printing apparatus; one or more memories; and one or more processors that are operatively connected to the communication circuit and the one or more memories, wherein the one or more processors are configured to: acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire, from the measurement apparatus, first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield, wherein the plurality of control parameters include a control parameter for adjusting a print pressure of the solder printing apparatus, a control parameter for adjusting a print speed, and a control parameter for adjusting a substrate separating speed, wherein the first parameter set indicates a set of the plurality of control parameters having initial set values, wherein the optimal control parameter set is a control parameter set of the solder printing apparatus that maximizes the first yield. a communication circuit that is communicatively connected to a solder printing apparatus configured to print solder on each of a plurality of substrates based on a plurality of control parameters and a measurement apparatus configured to measure a state of the solder printed on each of the plurality of substrates transferred from the solder printing apparatus; one or more memories; and one or more processors that are operatively connected to the communication circuit and the one or more memories, wherein the one or more processors are configured to: acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire, from the measurement apparatus, first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield, wherein the plurality of control parameters include a control parameter for adjusting a print pressure of the solder printing apparatus, a control parameter for adjusting a print speed, and a control parameter for adjusting a substrate separating speed, wherein the first parameter set indicates a set of the plurality of control parameters having initial set values, wherein the optimal control parameter set is a control parameter set of the solder printing apparatus that maximizes the first yield. acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire, from the measurement apparatus, first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield, wherein the plurality of control parameters include a control parameter for adjusting a print pressure of the solder printing apparatus, a control parameter for adjusting a print speed, and a control parameter for adjusting a substrate separating speed, wherein the first parameter set indicates a set of the plurality of control parameters having initial set values, wherein the optimal control parameter set is a control parameter set of the solder printing apparatus that maximizes the first yield.