A light emitting device (210, 210a, 214, 215, 216, 218, 218a, 220, 220a, 220b), comprising: a semiconductor light emitting element to emit a first light; a mounting member having a cup-like configuration, the semiconductor light emitting element being placed inside the cup-like configuration and on the mounting member; a first wavelength conversion layer provided between the semiconductor light emitting element and the mounting member in contact with the mounting member, the first wavelength conversion layer absorbing the first light and emitting a second light having a wavelength longer than a wavelength of the first light; a second wavelength conversion layer, the semiconductor light emitting element being disposed between at least a part of the second wavelength conversion layer and the first wavelength conversion layer, the second wavelength conversion layer absorbing the first light and emitting a third light having a wavelength longer than the wavelength of the first light, at least a portion of an end portion of the second wavelength conversion layer contacting the mounting member; and a first transparent layer provided between the semiconductor light emitting element and the second wavelength conversion layer, the first transparent layer being transparent to the first light, the second light, and the third light, at least a portion of an end portion of the first transparent layer contacting the mounting member, the first transparent layer being a resin, and the first transparent layer having an exterior surface with a curved configuration protruding upwards along the direction from the mounting member towards the semiconductor light emitting element, said first transparent layer covering the semiconductor light emitting element and contacting the semiconductor light emitting element over the whole covered surface. a semiconductor light emitting element to emit a first light; a mounting member having a cup-like configuration, the semiconductor light emitting element being placed inside the cup-like configuration and on the mounting member; a first wavelength conversion layer provided between the semiconductor light emitting element and the mounting member in contact with the mounting member, the first wavelength conversion layer absorbing the first light and emitting a second light having a wavelength longer than a wavelength of the first light; a second wavelength conversion layer, the semiconductor light emitting element being disposed between at least a part of the second wavelength conversion layer and the first wavelength conversion layer, the second wavelength conversion layer absorbing the first light and emitting a third light having a wavelength longer than the wavelength of the first light, at least a portion of an end portion of the second wavelength conversion layer contacting the mounting member; and a first transparent layer provided between the semiconductor light emitting element and the second wavelength conversion layer, the first transparent layer being transparent to the first light, the second light, and the third light, at least a portion of an end portion of the first transparent layer contacting the mounting member, the first transparent layer being a resin, and the first transparent layer having an exterior surface with a curved configuration protruding upwards along the direction from the mounting member towards the semiconductor light emitting element, said first transparent layer covering the semiconductor light emitting element and contacting the semiconductor light emitting element over the whole covered surface.