A camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; and a second substrate unit disposed inside the housing and connected to the connector, wherein the first substrate unit includes a first substrate portion including a first connecting port disposed at one surface of the first substrate portion, the image sensor disposed at the other surface of the first substrate portion, and a second substrate portion including a second connecting port connected to the first connecting port; wherein the second substrate unit includes a third substrate portion including a third connecting port connected to the second substrate portion through a flexible substrate, and a fourth substrate portion including a fourth connecting port coupled to the third connecting port and connected to the connector, characterized in that the housing includes a first coupling hole, and the first substrate unit includes: a second coupling hole disposed at the first substrate portion and corresponding to the first coupling hole; a first support coupling part including a support portion having a third coupling hole, and a coupling portion extended from the support portion and coupled to the first coupling hole and to the second coupling hole; a fourth coupling hole disposed at the second substrate portion and corresponding to the third coupling hole; and a first coupling part coupled to the third coupling hole and to the fourth coupling hole. a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; and a second substrate unit disposed inside the housing and connected to the connector, wherein the first substrate unit includes a first substrate portion including a first connecting port disposed at one surface of the first substrate portion, the image sensor disposed at the other surface of the first substrate portion, and a second substrate portion including a second connecting port connected to the first connecting port; wherein the second substrate unit includes a third substrate portion including a third connecting port connected to the second substrate portion through a flexible substrate, and a fourth substrate portion including a fourth connecting port coupled to the third connecting port and connected to the connector, characterized in that the housing includes a first coupling hole, and the first substrate unit includes: a second coupling hole disposed at the first substrate portion and corresponding to the first coupling hole; a first support coupling part including a support portion having a third coupling hole, and a coupling portion extended from the support portion and coupled to the first coupling hole and to the second coupling hole; a fourth coupling hole disposed at the second substrate portion and corresponding to the third coupling hole; and a first coupling part coupled to the third coupling hole and to the fourth coupling hole.