A light emitting device comprising: a substrate including a plurality of lead electrodes (22,23); a mold member including a cavity on the substrate; a light emitting chip in the cavity and on at least one of the plurality of lead electrodes (22, 23); a connecting member for electrically connecting at least one of the plurality of lead electrodes (22, 23) to the light emitting chip; a resin member in the cavity; a spacer part between the plurality of lead electrodes (22, 23), the spacer part including a material different from materials of the mold member and the resin member; and an adhesive film between the mold member and the plurality of lead electrodes (22,23) of the substrate, wherein the mold member includes a resin material different from a material of the resin member, wherein the adhesive film has a width narrower than a width of a bottom surface of the mold member, wherein the adhesive film includes an open region which is formed by opening a portion of a region corresponding to a bottom surface of the mold member, and a protrusion of the mold member is disposed in the open region of the adhesive film, wherein a first and second lead electrodes (22, 23) of the plurality of electrodes include a recess (22I, 23I) disposed at a region corresponding to the protrusion of the mold member, and the protrusion is coupled into the recess (22I, 23I) of the first and second lead electrodes (22, 23), wherein the mold member includes an extension portion disposed on a bottom of the cavity and is disposed adjacent to the light emitting chip, wherein the extension portion includes a first open region in which the light emitting chip is disposed and a second open region in which the connecting member connected to the light emitting chip is disposed on the bottom of the cavity, wherein the adhesive film further extends between the extension portion of the mold member and the first and second lead electrodes (22, 23), wherein the substrate includes a support member supporting the plurality of lead electrodes (22 and 23), wherein outer walls of the mold member are disposed on the same plane as outer walls of the substrate, wherein the adhesive film directly adheres between the mold member and the plurality of lead electrodes (22,23) of the substrate; wherein a bottom of the recess (22I, 23I) is disposed in the plurality of lead electrodes (22, 23); and wherein the protrusion of the mold member is adhered by an adhesive provided into the recess (22I, 23I). a substrate including a plurality of lead electrodes (22,23); a mold member including a cavity on the substrate; a light emitting chip in the cavity and on at least one of the plurality of lead electrodes (22, 23); a connecting member for electrically connecting at least one of the plurality of lead electrodes (22, 23) to the light emitting chip; a resin member in the cavity; a spacer part between the plurality of lead electrodes (22, 23), the spacer part including a material different from materials of the mold member and the resin member; and an adhesive film between the mold member and the plurality of lead electrodes (22,23) of the substrate, wherein the mold member includes a resin material different from a material of the resin member, wherein the adhesive film has a width narrower than a width of a bottom surface of the mold member, wherein the adhesive film includes an open region which is formed by opening a portion of a region corresponding to a bottom surface of the mold member, and a protrusion of the mold member is disposed in the open region of the adhesive film, wherein a first and second lead electrodes (22, 23) of the plurality of electrodes include a recess (22I, 23I) disposed at a region corresponding to the protrusion of the mold member, and the protrusion is coupled into the recess (22I, 23I) of the first and second lead electrodes (22, 23), wherein the mold member includes an extension portion disposed on a bottom of the cavity and is disposed adjacent to the light emitting chip, wherein the extension portion includes a first open region in which the light emitting chip is disposed and a second open region in which the connecting member connected to the light emitting chip is disposed on the bottom of the cavity, wherein the adhesive film further extends between the extension portion of the mold member and the first and second lead electrodes (22, 23), wherein the substrate includes a support member supporting the plurality of lead electrodes (22 and 23), wherein outer walls of the mold member are disposed on the same plane as outer walls of the substrate, wherein the adhesive film directly adheres between the mold member and the plurality of lead electrodes (22,23) of the substrate; wherein a bottom of the recess (22I, 23I) is disposed in the plurality of lead electrodes (22, 23); and wherein the protrusion of the mold member is adhered by an adhesive provided into the recess (22I, 23I).