An electrical connector comprising: a bottom housing; a plurality of circuit wafers disposed within the bottom housing, each circuit wafer including one or more high-frequency traces (305, 310) for communicating high-frequency signals, wherein the plurality of circuit wafers includes a first group of circuit wafers and a second group of circuit wafers, wherein an arrangement of the one or more high-frequency traces on the first group of circuit wafers is different from an arrangement of the one or more high frequency traces on the second group of circuit wafers; and a shroud forming a top of the electrical connector that is configured to engage the bottom housing to secure the plurality of circuit wafers between the bottom housing and the shroud, the shroud comprising: (i) a top wall; (ii) a bottom wall; and (iii) a plurality of vertical members extending between the top and bottom walls that define a plurality of slots for receiving the plurality of circuit wafers, each vertical member including a first side that faces a second side of an adjacent vertical member, wherein the first side defines top and bottom surface regions, characterized in that the first side also defines a single middle surface region, the top, middle, and bottom surface regions being spaced apart from the second side of the adjacent vertical member by a first distance, and first and second recessed surface regions between the top, middle, and bottom surface regions that are spaced apart from the second side of the adjacent vertical member by a second distance that is greater than the first distance, wherein the first and second recessed surface regions of the vertical members are arranged in a same relative position for each vertical member and arranged so as to prevent direct contact between the vertical members and the one or more high-frequency traces (305, 310) disposed on both the first and second group of circuit wafers (40A, 40B). a bottom housing; a plurality of circuit wafers disposed within the bottom housing, each circuit wafer including one or more high-frequency traces (305, 310) for communicating high-frequency signals, wherein the plurality of circuit wafers includes a first group of circuit wafers and a second group of circuit wafers, wherein an arrangement of the one or more high-frequency traces on the first group of circuit wafers is different from an arrangement of the one or more high frequency traces on the second group of circuit wafers; and a shroud forming a top of the electrical connector that is configured to engage the bottom housing to secure the plurality of circuit wafers between the bottom housing and the shroud, the shroud comprising: (i) a top wall; (ii) a bottom wall; and (iii) a plurality of vertical members extending between the top and bottom walls that define a plurality of slots for receiving the plurality of circuit wafers, each vertical member including a first side that faces a second side of an adjacent vertical member, wherein the first side defines top and bottom surface regions, characterized in that the first side also defines a single middle surface region, the top, middle, and bottom surface regions being spaced apart from the second side of the adjacent vertical member by a first distance, and first and second recessed surface regions between the top, middle, and bottom surface regions that are spaced apart from the second side of the adjacent vertical member by a second distance that is greater than the first distance, wherein the first and second recessed surface regions of the vertical members are arranged in a same relative position for each vertical member and arranged so as to prevent direct contact between the vertical members and the one or more high-frequency traces (305, 310) disposed on both the first and second group of circuit wafers (40A, 40B).