Printed circuit board assembly comprising: - a first outer layer; - a second outer layer; - an integrated circuit mounted on the second outer layer, said integrated circuit having: • a single exposed pad electrically connected to a ground reference of said printed circuit board, • a first supply pin electrically connected to a first power supply, • a second supply pin electrically connected to a second power supply, wherein the first power supply generates a first supply current subject to frequency components higher than the frequency components to which is subject a second supply current generated by the second power supply; said first power supply is connected on a first respective metal region of the first outer layer, said second power supply is connected on a second respective metal region on the first outer layer being electrically separated from the first respective metal region, - a first decoupling capacitor is mounted on the second outer layer in the proximity of the first supply pin, the first decoupling capacitor having a first terminal electrically connected with the first supply pin and having a second terminal; - an inner layer interposed between the first outer layer and the second outer layer, the inner layer comprising a metal layer electrically connected to said ground reference; - a first Via configured to electrically connect the exposed pad with the metal layer of the inner layer; - a second Via configured to electrically connect the second terminal of the first decoupling capacitor with the metal layer of the inner layer; - a second decoupling capacitor mounted on the first outer layer having a first pin electrically connected to the second power supply and having a second pin electrically connected to said ground reference. - a first outer layer; - a second outer layer; - an integrated circuit mounted on the second outer layer, said integrated circuit having: • a single exposed pad electrically connected to a ground reference of said printed circuit board, • a first supply pin electrically connected to a first power supply, • a second supply pin electrically connected to a second power supply, wherein the first power supply generates a first supply current subject to frequency components higher than the frequency components to which is subject a second supply current generated by the second power supply; said first power supply is connected on a first respective metal region of the first outer layer, said second power supply is connected on a second respective metal region on the first outer layer being electrically separated from the first respective metal region, • a single exposed pad electrically connected to a ground reference of said printed circuit board, • a first supply pin electrically connected to a first power supply, • a second supply pin electrically connected to a second power supply, said first power supply is connected on a first respective metal region of the first outer layer, said second power supply is connected on a second respective metal region on the first outer layer being electrically separated from the first respective metal region, - a first decoupling capacitor is mounted on the second outer layer in the proximity of the first supply pin, the first decoupling capacitor having a first terminal electrically connected with the first supply pin and having a second terminal; - an inner layer interposed between the first outer layer and the second outer layer, the inner layer comprising a metal layer electrically connected to said ground reference; - a first Via configured to electrically connect the exposed pad with the metal layer of the inner layer; - a second Via configured to electrically connect the second terminal of the first decoupling capacitor with the metal layer of the inner layer; - a second decoupling capacitor mounted on the first outer layer having a first pin electrically connected to the second power supply and having a second pin electrically connected to said ground reference.