An apparatus (200, 300, 400) for transferring a semiconductor die (272, 372, 472) from a first substrate (270, 370, 371, 470, 471) to a second substrate (210, 310, 410), the apparatus comprising: a first rail extending along a first direction; a second rail extending along the first direction; a first bridge structure (230, 330, 430) movably mounted to the first rail and the second rail so as to be movable along the first direction, the first bridge structure including a track (238, 338, 438) extending along a second direction that is substantially perpendicular to the first direction; a transfer mechanism assembly (240, 332, 334, 432, 462) including a needle (276, 376, 377, 476), the transfer mechanism assembly being movably mounted to the track of the first bridge structure to move along the second direction; a second bridge structure (260, 340, 440) movably mounted to the first rail and the second rail so as to be movable along the first direction, the second bridge structure including a track extending along the second direction; a die substrate holder (268, 342, 344, 442, 452) configured to secure the first substrate, the die substrate holder being movably mounted to the track of the second bridge structure to move along the second direction; and a controller configured to: control movements of the first bridge structure, the second bridge structure, the transfer mechanism assembly, and the die substrate holder to align the semiconductor die on the first substrate with the needle of the transfer mechanism assembly with a transfer position on the second substrate where the semiconductor die is to be transferred, and actuate the needle to push the semiconductor die into the transfer position on the second substrate. a first rail extending along a first direction; a second rail extending along the first direction; a first bridge structure (230, 330, 430) movably mounted to the first rail and the second rail so as to be movable along the first direction, the first bridge structure including a track (238, 338, 438) extending along a second direction that is substantially perpendicular to the first direction; a transfer mechanism assembly (240, 332, 334, 432, 462) including a needle (276, 376, 377, 476), the transfer mechanism assembly being movably mounted to the track of the first bridge structure to move along the second direction; a second bridge structure (260, 340, 440) movably mounted to the first rail and the second rail so as to be movable along the first direction, the second bridge structure including a track extending along the second direction; a die substrate holder (268, 342, 344, 442, 452) configured to secure the first substrate, the die substrate holder being movably mounted to the track of the second bridge structure to move along the second direction; and a controller configured to: control movements of the first bridge structure, the second bridge structure, the transfer mechanism assembly, and the die substrate holder to align the semiconductor die on the first substrate with the needle of the transfer mechanism assembly with a transfer position on the second substrate where the semiconductor die is to be transferred, and actuate the needle to push the semiconductor die into the transfer position on the second substrate. control movements of the first bridge structure, the second bridge structure, the transfer mechanism assembly, and the die substrate holder to align the semiconductor die on the first substrate with the needle of the transfer mechanism assembly with a transfer position on the second substrate where the semiconductor die is to be transferred, and actuate the needle to push the semiconductor die into the transfer position on the second substrate.