A wafer transfer device of a semiconductor manufacturing process, for carrying a plurality of wafers, and the wafer transfer device comprising: a base, defined with a central axis; a plurality of fixed rings (20A~20D), stacked on the base along the central axis, each fixed ring (20A~20D) comprising a through hole and a channel, each through hole passing through each fixed ring (20A~20D) along the central axis, a ring groove disposed in each fixed ring (20A~20D) along an inner rim of the through hole, and the channel extended from an outer periphery of each fixed ring (20A~20D) and communicating to the ring groove; a rotating shaft, rotatably coupled to each through hole, and comprising a plurality of flow passages (33A~33D), each flow passage (33A~33D) comprising an interface and a port, and the port arranged corresponding to each fixed ring (20A~20D) and communicating with the ring groove; a turntable, fixedly connected to the rotating shaft, and comprising a plurality of carriers (41A~41D) disposed on a side thereof away from the base, each carrier (41A~41D) equiangularly installed around the rotating shaft, a top surface of each carrier (41A~41D) carrying each wafer, each carrier (41A~41D) comprising a suction passage, two ends of each suction passage coupled to the top surface of the carrier (41A~41D) and the interface correspondingly, a plurality of channels correspondingly communicating with a plurality of ring grooves, the flow passages (33A~33D) and the suction passages to define a plurality of air suction passages; an air suction pump, coupled to each channel, and configured to extract air from each air suction passage to form a negative pressure to suck each wafer; and a driving mechanism, configured to drive the turntable and the rotating shaft to rotate around the central axis; wherein, when the turntable and the rotating shaft rotate, the port rotates relative to each fixed ring (20A~20D) and keeps communicating with each ring groove. a base, defined with a central axis; a plurality of fixed rings (20A~20D), stacked on the base along the central axis, each fixed ring (20A~20D) comprising a through hole and a channel, each through hole passing through each fixed ring (20A~20D) along the central axis, a ring groove disposed in each fixed ring (20A~20D) along an inner rim of the through hole, and the channel extended from an outer periphery of each fixed ring (20A~20D) and communicating to the ring groove; a rotating shaft, rotatably coupled to each through hole, and comprising a plurality of flow passages (33A~33D), each flow passage (33A~33D) comprising an interface and a port, and the port arranged corresponding to each fixed ring (20A~20D) and communicating with the ring groove; a turntable, fixedly connected to the rotating shaft, and comprising a plurality of carriers (41A~41D) disposed on a side thereof away from the base, each carrier (41A~41D) equiangularly installed around the rotating shaft, a top surface of each carrier (41A~41D) carrying each wafer, each carrier (41A~41D) comprising a suction passage, two ends of each suction passage coupled to the top surface of the carrier (41A~41D) and the interface correspondingly, a plurality of channels correspondingly communicating with a plurality of ring grooves, the flow passages (33A~33D) and the suction passages to define a plurality of air suction passages; an air suction pump, coupled to each channel, and configured to extract air from each air suction passage to form a negative pressure to suck each wafer; and a driving mechanism, configured to drive the turntable and the rotating shaft to rotate around the central axis; wherein, when the turntable and the rotating shaft rotate, the port rotates relative to each fixed ring (20A~20D) and keeps communicating with each ring groove.