An orthopedic brace comprising: at least one housing having an internal face and an external face, wherein said internal face is structured to be worn by a subject, in a vicinity of a joint; at least one substantially flat thermoelectric cooler disposed at least partially within the at least one housing, and having an internal TEC face and an external TEC face, wherein the external TEC face is facing the external face of the at least one housing; at least one heat transferring medium coupled to the thermoelectric cooler and comprising a first thermally conductive material, wherein the heat transferring medium has an external face, facing and thermally coupled to the internal TEC face, and an internal face; and a cooling unit comprising: a heat sink coupled to the thermoelectric cooler, and a fan configured and positioned to create air flow in the direction of the heat sink, thereby evacuating heat therefrom wherein upon application of electrical current to the thermoelectric cooler, the temperature of the external TEC face is being either elevated or lowered and the temperature of the internal TEC face is being either lowered or elevated in the opposite direction, thereby lowering or elevating the temperature of the heat transferring medium; characterized in that, lowering the temperature of the heat transferring medium comprises setting the temperature of heat transferring medium at a first temperature, wherein the heat transferring medium is in a non-bendable state when in the first temperature. at least one housing having an internal face and an external face, wherein said internal face is structured to be worn by a subject, in a vicinity of a joint; at least one substantially flat thermoelectric cooler disposed at least partially within the at least one housing, and having an internal TEC face and an external TEC face, wherein the external TEC face is facing the external face of the at least one housing; at least one heat transferring medium coupled to the thermoelectric cooler and comprising a first thermally conductive material, wherein the heat transferring medium has an external face, facing and thermally coupled to the internal TEC face, and an internal face; and a cooling unit comprising: a heat sink coupled to the thermoelectric cooler, and a fan configured and positioned to create air flow in the direction of the heat sink, thereby evacuating heat therefrom wherein upon application of electrical current to the thermoelectric cooler, the temperature of the external TEC face is being either elevated or lowered and the temperature of the internal TEC face is being either lowered or elevated in the opposite direction, thereby lowering or elevating the temperature of the heat transferring medium; characterized in that, lowering the temperature of the heat transferring medium comprises setting the temperature of heat transferring medium at a first temperature, wherein the heat transferring medium is in a non-bendable state when in the first temperature. a heat sink coupled to the thermoelectric cooler, and a fan configured and positioned to create air flow in the direction of the heat sink, thereby evacuating heat therefrom wherein upon application of electrical current to the thermoelectric cooler, the temperature of the external TEC face is being either elevated or lowered and the temperature of the internal TEC face is being either lowered or elevated in the opposite direction, thereby lowering or elevating the temperature of the heat transferring medium; characterized in that, lowering the temperature of the heat transferring medium comprises setting the temperature of heat transferring medium at a first temperature, wherein the heat transferring medium is in a non-bendable state when in the first temperature.