Process for binding a top substrate to a base substrate, in which (a) a liquid optically clear photo-curable adhesive, which comprises: (a) 10 to 30 wt% of an urethane acrylate (b) 30 to 70 wt% of plasticizer chosen from polyisoprene resin, and/or polybutadiene resin, (c) 0. 2 to 2 wt% of photo initiator selected from 2,2-dimethoxy-1,2-diphenylethan-1-one, trimethylbenzoyl diphenylphosphine oxide, 1-hydroxycyclohexyl benzophenone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one and combinations thereof; (d) 0.1 to 10 wt% of a functional (meth)acrylate monomer selected from 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl(meth)acrylate, 4-hydroxybutyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, octyl acrylamide, acrylic acid and combinations thereof, (e) 5 to 40 wt % of (meth)acrylate monomers and/or oligomers; is applied onto the top side of the base substrate, (b) the liquid optically clear photo-curable adhesive is partially cured by exposure to electromagnetic radiation comprising a wavelength ranging from 200 nm to 700 nm, wherein the degree of cure of the liquid optically clear photo-curable adhesive after the partial curing step is 20 to 95%, (c) the top substrate is attached on the partially cured adhesive layer of step (b), (d) the adhesive is fully cured by exposure to electromagnetic radiation comprising a wavelength ranging from 200 nm to 700 nm. (a) a liquid optically clear photo-curable adhesive, which comprises: (a) 10 to 30 wt% of an urethane acrylate (b) 30 to 70 wt% of plasticizer chosen from polyisoprene resin, and/or polybutadiene resin, (c) 0. 2 to 2 wt% of photo initiator selected from 2,2-dimethoxy-1,2-diphenylethan-1-one, trimethylbenzoyl diphenylphosphine oxide, 1-hydroxycyclohexyl benzophenone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one and combinations thereof; (d) 0.1 to 10 wt% of a functional (meth)acrylate monomer selected from 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl(meth)acrylate, 4-hydroxybutyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, octyl acrylamide, acrylic acid and combinations thereof, (e) 5 to 40 wt % of (meth)acrylate monomers and/or oligomers; is applied onto the top side of the base substrate, (a) 10 to 30 wt% of an urethane acrylate (b) 30 to 70 wt% of plasticizer chosen from polyisoprene resin, and/or polybutadiene resin, (c) 0. 2 to 2 wt% of photo initiator selected from 2,2-dimethoxy-1,2-diphenylethan-1-one, trimethylbenzoyl diphenylphosphine oxide, 1-hydroxycyclohexyl benzophenone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one and combinations thereof; (d) 0.1 to 10 wt% of a functional (meth)acrylate monomer selected from 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl(meth)acrylate, 4-hydroxybutyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, octyl acrylamide, acrylic acid and combinations thereof, (e) 5 to 40 wt % of (meth)acrylate monomers and/or oligomers; is applied onto the top side of the base substrate, (b) the liquid optically clear photo-curable adhesive is partially cured by exposure to electromagnetic radiation comprising a wavelength ranging from 200 nm to 700 nm, wherein the degree of cure of the liquid optically clear photo-curable adhesive after the partial curing step is 20 to 95%, (c) the top substrate is attached on the partially cured adhesive layer of step (b), (d) the adhesive is fully cured by exposure to electromagnetic radiation comprising a wavelength ranging from 200 nm to 700 nm.