An integrated circuit device strip tester that measures temperature of each device under test, comprising: a temperature controlled heater block have a plurality of locations for placement thereon of a plurality of integrated circuit devices under test; wherein the tester is suitable to for testing each of the plurality of integrated circuit devices under test comprising a plurality of electrical connection pads on a first face of the integrated circuit device, an exposed die pad in thermal communications with a die of the integrated circuit device, and a second face of the integrated circuit device in thermal communications with the temperature controlled heater block; a contactor assembly having a plurality of electrical connection test probes and a temperature measuring test probe (116, 120; 116, 336) for each of the plurality of integrated circuit devices under test and arranged to come into contact therewith, wherein each of the plurality of electrical connection test probes is configured to make an electrical connection to a respective one of the plurality of electrical connection pads on the first face of the respective one of the plurality of integrated circuit devices under test and each of the temperature measuring test probes (116, 120; 116, 336) is configured to make a thermal connection to the exposed die pad on the first face of the respective one of the plurality of integrated circuit devices under test; a test board assembly comprising a plurality of electrical connections, each of the plurality of electrical connections coupled to a respective one of the plurality of electrical connection test probes; wherein the plurality of electrical connections provide electrical coupling to the plurality of electrical connection pads of the plurality of integrated circuit devices under test through the respective ones of the plurality of electrical connection test probes; wherein the temperature controlled heater block is configured to control the temperatures of the plurality of integrated circuit devices under test, characterized in that each of the plurality of temperature measuring test probes (116, 120; 116, 336) is configured to measure a respective temperature only through the thermal connection to the exposed die pad of the respective ones of the plurality of integrated circuit devices. a temperature controlled heater block have a plurality of locations for placement thereon of a plurality of integrated circuit devices under test; wherein the tester is suitable to for testing each of the plurality of integrated circuit devices under test comprising a plurality of electrical connection pads on a first face of the integrated circuit device, an exposed die pad in thermal communications with a die of the integrated circuit device, and a second face of the integrated circuit device in thermal communications with the temperature controlled heater block; a contactor assembly having a plurality of electrical connection test probes and a temperature measuring test probe (116, 120; 116, 336) for each of the plurality of integrated circuit devices under test and arranged to come into contact therewith, wherein each of the plurality of electrical connection test probes is configured to make an electrical connection to a respective one of the plurality of electrical connection pads on the first face of the respective one of the plurality of integrated circuit devices under test and each of the temperature measuring test probes (116, 120; 116, 336) is configured to make a thermal connection to the exposed die pad on the first face of the respective one of the plurality of integrated circuit devices under test; a test board assembly comprising a plurality of electrical connections, each of the plurality of electrical connections coupled to a respective one of the plurality of electrical connection test probes; wherein the plurality of electrical connections provide electrical coupling to the plurality of electrical connection pads of the plurality of integrated circuit devices under test through the respective ones of the plurality of electrical connection test probes; wherein the temperature controlled heater block is configured to control the temperatures of the plurality of integrated circuit devices under test, characterized in that each of the plurality of temperature measuring test probes (116, 120; 116, 336) is configured to measure a respective temperature only through the thermal connection to the exposed die pad of the respective ones of the plurality of integrated circuit devices. a plurality of electrical connections, each of the plurality of electrical connections coupled to a respective one of the plurality of electrical connection test probes; wherein the plurality of electrical connections provide electrical coupling to the plurality of electrical connection pads of the plurality of integrated circuit devices under test through the respective ones of the plurality of electrical connection test probes; wherein the temperature controlled heater block is configured to control the temperatures of the plurality of integrated circuit devices under test, characterized in that each of the plurality of temperature measuring test probes (116, 120; 116, 336) is configured to measure a respective temperature only through the thermal connection to the exposed die pad of the respective ones of the plurality of integrated circuit devices.