Optoelectronic arrangement with - an optoelectronic module - with at least one light-emitting diode chip, which is arranged on a carrier, - with a mounting attachment, which is attached to the carrier and covers the light-emitting diode chip or chips at least in part, - wherein the mounting attachment comprises a flat top remote from the carrier and a structuring on the top, which allows the positioning of an optical element, - an optical element, which is placed on the mounting attachment, wherein - the optical element comprises structuring, which is fitted at least in places into the structuring of the mounting attachment, wherein - the mounting attachment comprises a recess on an underside facing the carrier for the at least one light-emitting diode chip, the dimensions of which recess are greater than those of the light-emitting diode chip or chips, - the structuring of the mounting attachment comprises a raised portion that is graduated from the top of the mounting attachment, - the raised portion is a plateau, - the plateau is arranged in a transmission region of the mounting attachment, through which a majority of the light generated in the at least one light-emitting diode chip is radiated, and - the structuring of the optical element is a recess complementary to the plateau, and a two-dimensional contact exists between the mounting attachment and the optical element in the transmission region of the mounting attachment. - an optoelectronic module - with at least one light-emitting diode chip, which is arranged on a carrier, - with a mounting attachment, which is attached to the carrier and covers the light-emitting diode chip or chips at least in part, - wherein the mounting attachment comprises a flat top remote from the carrier and a structuring on the top, which allows the positioning of an optical element, - with at least one light-emitting diode chip, which is arranged on a carrier, - with a mounting attachment, which is attached to the carrier and covers the light-emitting diode chip or chips at least in part, - wherein the mounting attachment comprises a flat top remote from the carrier and a structuring on the top, which allows the positioning of an optical element, - an optical element, which is placed on the mounting attachment, wherein - the optical element comprises structuring, which is fitted at least in places into the structuring of the mounting attachment, wherein - the mounting attachment comprises a recess on an underside facing the carrier for the at least one light-emitting diode chip, the dimensions of which recess are greater than those of the light-emitting diode chip or chips, - the structuring of the mounting attachment comprises a raised portion that is graduated from the top of the mounting attachment, - the raised portion is a plateau, - the plateau is arranged in a transmission region of the mounting attachment, through which a majority of the light generated in the at least one light-emitting diode chip is radiated, and - the structuring of the optical element is a recess complementary to the plateau, and a two-dimensional contact exists between the mounting attachment and the optical element in the transmission region of the mounting attachment.