A printed circuit board, PCB, module configured for shielding attenuation of an electromagnetic interference emission, comprising: a PCB including: at least one internal PCB element; at least one external PCB element, the at least one internal PCB element being embedded between adjacent layers of the PCB; and a first shielding layer fabricated from a tunable first metamaterial absorber, the first shielding layer being tuned in response to at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement; the tuning of the first shielding layer including determining, based on the EMI emission, the number and/or design of a plurality of adjustable fins of a plurality of elements of the first metamaterial absorber; the first shielding layer being configured to absorb at least a portion of the EMI emission following the tuning of the first shielding layer, the first shielding layer being a ground layer of the PCB located below the at least one external PCB element, the at least one external PCB element and the at least one internal PCB element being coupled to the first shielding layer; and a structure housing the PCB. a PCB including: at least one internal PCB element; at least one external PCB element, the at least one internal PCB element being embedded between adjacent layers of the PCB; and a first shielding layer fabricated from a tunable first metamaterial absorber, the first shielding layer being tuned in response to at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement; the tuning of the first shielding layer including determining, based on the EMI emission, the number and/or design of a plurality of adjustable fins of a plurality of elements of the first metamaterial absorber; the first shielding layer being configured to absorb at least a portion of the EMI emission following the tuning of the first shielding layer, the first shielding layer being a ground layer of the PCB located below the at least one external PCB element, the at least one external PCB element and the at least one internal PCB element being coupled to the first shielding layer; and at least one internal PCB element; at least one external PCB element, the at least one internal PCB element being embedded between adjacent layers of the PCB; and a first shielding layer fabricated from a tunable first metamaterial absorber, the first shielding layer being tuned in response to at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement; the tuning of the first shielding layer including determining, based on the EMI emission, the number and/or design of a plurality of adjustable fins of a plurality of elements of the first metamaterial absorber; the first shielding layer being configured to absorb at least a portion of the EMI emission following the tuning of the first shielding layer, the first shielding layer being a ground layer of the PCB located below the at least one external PCB element, the at least one external PCB element and the at least one internal PCB element being coupled to the first shielding layer; and a structure housing the PCB.