A contactless connector comprising: a transmitter comprising a first transmit integrated circuit to generate a first signal and a first pick-up antenna adjacent the first transmit integrated circuit to convey the first signal along a first transmission line to a first propagation antenna; a propagation path to receive the first signal from the propagation antenna and convey the signal from a first end to a second end of the propagation path; and a receiver comprising a first receiving antenna to receive the first signal from the propagation path at said second end, a first receiver transmission line coupled to the first receiving antenna to convey the signal to a first re-transmit antenna and a first receiver integrated circuit receiving the first signal from the first re-transmit antenna, characterized in that the transmitter further comprises a second transmitter integrated circuit to generate a second signal and a second pick-up antenna adjacent the second transmit integrated circuit to convey the second signal along a second transmission line to a second propagation antenna, in that the receiver further comprises a second receiving antenna to receive the second signal from the propagation path, a second receiver transmission line coupled to the second receiving antenna to convey the second signal to a second re-transmit antenna and a second receiver integrated circuit to receive the second signal from the second re-transmit antenna, in that the first and second propagation antennae are configured to transmit the first and second signals to the propagation path at different and separable polarizations to allow duplex communication along the propagation path and facilitate relative rotary motion between the transmitter and receiver, and in that the transmitter comprises a circuit board including a dielectric substrate and a ground plane, wherein the first and second pickup antennas (318, 322) are on one side of the substrate, and wherein the first and second propagation antennas (330, 332) and the ground plane are arranged in a stacked configuration as different layers of the circuit board to one another. a transmitter comprising a first transmit integrated circuit to generate a first signal and a first pick-up antenna adjacent the first transmit integrated circuit to convey the first signal along a first transmission line to a first propagation antenna; a propagation path to receive the first signal from the propagation antenna and convey the signal from a first end to a second end of the propagation path; and a receiver comprising a first receiving antenna to receive the first signal from the propagation path at said second end, a first receiver transmission line coupled to the first receiving antenna to convey the signal to a first re-transmit antenna and a first receiver integrated circuit receiving the first signal from the first re-transmit antenna, characterized in that the transmitter further comprises a second transmitter integrated circuit to generate a second signal and a second pick-up antenna adjacent the second transmit integrated circuit to convey the second signal along a second transmission line to a second propagation antenna, in that the receiver further comprises a second receiving antenna to receive the second signal from the propagation path, a second receiver transmission line coupled to the second receiving antenna to convey the second signal to a second re-transmit antenna and a second receiver integrated circuit to receive the second signal from the second re-transmit antenna, in that the first and second propagation antennae are configured to transmit the first and second signals to the propagation path at different and separable polarizations to allow duplex communication along the propagation path and facilitate relative rotary motion between the transmitter and receiver, and in that the transmitter comprises a circuit board including a dielectric substrate and a ground plane, wherein the first and second pickup antennas (318, 322) are on one side of the substrate, and wherein the first and second propagation antennas (330, 332) and the ground plane are arranged in a stacked configuration as different layers of the circuit board to one another.