A process for preparing a three-dimensional molded article by means of a layerwise application of material, wherein geometric data for said molded article, a support part having a base surface for receiving the three-dimensional molded article, a solidifiable liquid, free-flowing or powdery first material, a powdery second material comprising thermoplastic powder particles. and a solvent in which said solidified first material is soluble are provided, a) wherein, for forming a negative mold layer, material portions of said free-flowable, liquid or powdery first material are applied to the base surface, and/or a solidified layer of material covering it, in accordance with the geometric data in such a manner that said negative mold layer has at least one cavity at its surface facing away from said base surface, which cavity has a negative shape of a layer of material to be prepared of said molded article, b) wherein said negative mold layer is solidified, c) wherein at least the bottom of the cavity formed by the base surface or a solidified material layer located thereon is charged to an electrical potential of a first polarity, d) wherein powder particles of the second material are charged to an electrical potential with a second polarity opposite to the first polarity and are applied flatly to a support surface of a particle support, e) wherein the support surface with the powder particles located thereon faces the at least one cavity and is positioned relative to the cavity in such a way that the powder particles are transferred from the support surface into the cavity and form therein a molded article layer with a positive shape matching the negative mold, f) wherein the thus obtained molded article layer is sintered and solidified by the action of heat, g) wherein regions of the solidified negative mold layer and/or of the solidified molded article layer that project over a plane provided at a predetermined distance to the base surface are removed by material ablation in such a way that a planar surface is formed that extends over the negative mold layer and the molded article layer, h) wherein steps a) to g) are repeated at least once, and i) wherein thereafter said negative mold layers are contacted with the solvent in such a way that said solidified first material dissolves in the solvent. a) wherein, for forming a negative mold layer, material portions of said free-flowable, liquid or powdery first material are applied to the base surface, and/or a solidified layer of material covering it, in accordance with the geometric data in such a manner that said negative mold layer has at least one cavity at its surface facing away from said base surface, which cavity has a negative shape of a layer of material to be prepared of said molded article, b) wherein said negative mold layer is solidified, c) wherein at least the bottom of the cavity formed by the base surface or a solidified material layer located thereon is charged to an electrical potential of a first polarity, d) wherein powder particles of the second material are charged to an electrical potential with a second polarity opposite to the first polarity and are applied flatly to a support surface of a particle support, e) wherein the support surface with the powder particles located thereon faces the at least one cavity and is positioned relative to the cavity in such a way that the powder particles are transferred from the support surface into the cavity and form therein a molded article layer with a positive shape matching the negative mold, f) wherein the thus obtained molded article layer is sintered and solidified by the action of heat, g) wherein regions of the solidified negative mold layer and/or of the solidified molded article layer that project over a plane provided at a predetermined distance to the base surface are removed by material ablation in such a way that a planar surface is formed that extends over the negative mold layer and the molded article layer, h) wherein steps a) to g) are repeated at least once, and i) wherein thereafter said negative mold layers are contacted with the solvent in such a way that said solidified first material dissolves in the solvent.