An integrated circuit package comprising: a substrate comprising first electric contacts; a first wirebond integrated circuit die mechanically coupled to the substrate and comprising second electric contacts electrically coupled to the first electric contacts of the substrate by first electrically conductive wires; a flip-chip integrated circuit die comprising third electric contacts electrically coupled to the second electric contacts of the first wirebond integrated circuit die by electrically conductive bumps; and a second wirebond integrated circuit die mechanically coupled to the flip-chip integrated circuit die and comprising fourth electric contacts electrically coupled to the second electric contacts of the first wirebond integrated circuit die or to both, the first electric contacts of the substrate and the second electric contacts of the first wirebond integrated circuit die, by second and third electrically conductive wires (124C; 124B); characterized in that the second wirebond integrated circuit die further comprises a redistribution layer comprising: fifth electric contacts disposed near a first edge of the second wirebond integrated circuit die; sixth electric contacts disposed near a second edge of the second wirebond integrated circuit die; and traces electrically coupling the fifth and sixth electric contacts (402; 404); wherein the sixth electric contacts are electrically connected to the fourth electric contacts being disposed near the second edge of the second wirebond integrated circuit die. a substrate comprising first electric contacts; a first wirebond integrated circuit die mechanically coupled to the substrate and comprising second electric contacts electrically coupled to the first electric contacts of the substrate by first electrically conductive wires; a flip-chip integrated circuit die comprising third electric contacts electrically coupled to the second electric contacts of the first wirebond integrated circuit die by electrically conductive bumps; and a second wirebond integrated circuit die mechanically coupled to the flip-chip integrated circuit die and comprising fourth electric contacts electrically coupled to the second electric contacts of the first wirebond integrated circuit die or to both, the first electric contacts of the substrate and the second electric contacts of the first wirebond integrated circuit die, by second and third electrically conductive wires (124C; 124B); characterized in that the second wirebond integrated circuit die further comprises a redistribution layer comprising: fifth electric contacts disposed near a first edge of the second wirebond integrated circuit die; sixth electric contacts disposed near a second edge of the second wirebond integrated circuit die; and traces electrically coupling the fifth and sixth electric contacts (402; 404); wherein the sixth electric contacts are electrically connected to the fourth electric contacts being disposed near the second edge of the second wirebond integrated circuit die. fifth electric contacts disposed near a first edge of the second wirebond integrated circuit die; sixth electric contacts disposed near a second edge of the second wirebond integrated circuit die; and traces electrically coupling the fifth and sixth electric contacts (402; 404); wherein the sixth electric contacts are electrically connected to the fourth electric contacts being disposed near the second edge of the second wirebond integrated circuit die.