A method for temporary workpiece bonding (100, 700), comprising: performing a combining step (110, 710), wherein an adhesive layer (340, 540) is formed on a surface of at least one substrate (310, 510) and/or at least one workpiece (320, 520); performing a bonding step (120, 720), wherein the at least one substrate (310, 510) and the at least one workpiece (320, 520) are bonded by the adhesive layer (340, 540), wherein one substrate may be bonded to one workpiece, or a plurality of substrates may be bonded to one workpiece, or one substrate may be bonded to a plurality of workpieces; performing a processing step (130, 730), wherein the at least one workpiece (320, 520) is processed; and performing a debonding step (140, 740), wherein the adhesive layer (340, 540) is irradiated with a laser so as to separate the at least one workpiece (320, 520) from the at least one substrate (310, 510); wherein the adhesive layer (340, 540) is formed by an adhesive, wherein the adhesive comprises a polymer and a light absorbing material, the content of the polymer in the solid content of the adhesive is in the range of 50 wt% to 98 wt%, the content of the light absorbing material in the solid content of the adhesive is in the range of 2 wt% to 50 wt%, the polymer is polyimide or a copolymer of amic acid/imide, the light absorbing material is carbon black, titanium black, iron oxide, titanium nitride, an organic pigment or a dye, the content of a hydroxyl-containing unit of the skeleton of the polymer is in the range of 5 wt% to 45 wt%, the content of an aliphatic ether-containing unit of the skeleton of the polymer is in the range of 5 wt% to 40 wt%, and the cyclization ratio of the polymer is greater than or equal to 90%. performing a combining step (110, 710), wherein an adhesive layer (340, 540) is formed on a surface of at least one substrate (310, 510) and/or at least one workpiece (320, 520); performing a bonding step (120, 720), wherein the at least one substrate (310, 510) and the at least one workpiece (320, 520) are bonded by the adhesive layer (340, 540), wherein one substrate may be bonded to one workpiece, or a plurality of substrates may be bonded to one workpiece, or one substrate may be bonded to a plurality of workpieces; performing a processing step (130, 730), wherein the at least one workpiece (320, 520) is processed; and performing a debonding step (140, 740), wherein the adhesive layer (340, 540) is irradiated with a laser so as to separate the at least one workpiece (320, 520) from the at least one substrate (310, 510); wherein the adhesive layer (340, 540) is formed by an adhesive, wherein the adhesive comprises a polymer and a light absorbing material, the content of the polymer in the solid content of the adhesive is in the range of 50 wt% to 98 wt%, the content of the light absorbing material in the solid content of the adhesive is in the range of 2 wt% to 50 wt%, the polymer is polyimide or a copolymer of amic acid/imide, the light absorbing material is carbon black, titanium black, iron oxide, titanium nitride, an organic pigment or a dye, the content of a hydroxyl-containing unit of the skeleton of the polymer is in the range of 5 wt% to 45 wt%, the content of an aliphatic ether-containing unit of the skeleton of the polymer is in the range of 5 wt% to 40 wt%, and the cyclization ratio of the polymer is greater than or equal to 90%.