A bus apparatus that is structured to enable a number of circuit interrupters or other devices to be electrically connected with a number of circuits, the bus apparatus comprising: a substrate formed of a material that is structured to be electrically resistive and thermally conductive within the ranges of voltage and temperature in which the bus apparatus is structured to typically operate; and a conductor apparatus comprising: at least a first conductor assembly that comprises an electrically conductive first bus element and a number of electrically conductive first connection elements, at least some of the number of first connection elements each having an electrical connection with the first bus element, the first bus element being embedded within the substrate, the at least some of the number of first connection elements each extending from the electrical connection with the first bus element and having at least one end situated external to the substrate, and a number of electrically conductive additional connection elements extending through the substrate and being electrically unconnected with the first bus element within the substrate, at least some of the number of additional connection elements each having at least one end situated external to the substrate, characterized in that at least some of the additional connection elements are mounted and electrically connected to a circuit board, the circuit board being bonded together with the substrate and including a connector which includes pins that provide one or more data channels which communicate to a remote location data derived by circuits situated on the circuit board. a substrate formed of a material that is structured to be electrically resistive and thermally conductive within the ranges of voltage and temperature in which the bus apparatus is structured to typically operate; and a conductor apparatus comprising: at least a first conductor assembly that comprises an electrically conductive first bus element and a number of electrically conductive first connection elements, at least some of the number of first connection elements each having an electrical connection with the first bus element, the first bus element being embedded within the substrate, the at least some of the number of first connection elements each extending from the electrical connection with the first bus element and having at least one end situated external to the substrate, and a number of electrically conductive additional connection elements extending through the substrate and being electrically unconnected with the first bus element within the substrate, at least some of the number of additional connection elements each having at least one end situated external to the substrate, at least a first conductor assembly that comprises an electrically conductive first bus element and a number of electrically conductive first connection elements, at least some of the number of first connection elements each having an electrical connection with the first bus element, the first bus element being embedded within the substrate, the at least some of the number of first connection elements each extending from the electrical connection with the first bus element and having at least one end situated external to the substrate, and a number of electrically conductive additional connection elements extending through the substrate and being electrically unconnected with the first bus element within the substrate, at least some of the number of additional connection elements each having at least one end situated external to the substrate, characterized in that at least some of the additional connection elements are mounted and electrically connected to a circuit board, the circuit board being bonded together with the substrate and including a connector which includes pins that provide one or more data channels which communicate to a remote location data derived by circuits situated on the circuit board.