Device for measuring current, comprising a substrate with a first current conductor, which is suitable for recording a first current to be measured, and a current sensor encased in an IC housing, which current sensor comprises a second current conductor extending inside the housing and with molded first and second electric terminal leads (7, 8) and also third electric terminal leads, wherein the housing is mounted above the first current conductor on the substrate, such that the second current conductor extends above and parallel to the first current conductor and the first, second and third terminal leads (7, 8) are bent towards the substrate and fixed onto the substrate, the current sensor comprises a semiconductor chip, which is mounted on a side of the second current conductor facing the substrate and an active surface positioned between the first and second current conductors (3, 5) with a magnetic field sensor and electronic circuits for the operation of the magnetic field sensor, the first and second terminal leads (7, 8) on a first side wall of the housing protrude from the housing and are suitable for recording a second current to be measured coming from the substrate into the second current conductor, the third terminal leads protrude from the housing on a side wall of the housing opposite the first side wall and are connected via bond wires to electric terminals of the semiconductor chip, the magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the active surface of the semiconductor chip and perpendicular to the second current conductor. a substrate with a first current conductor, which is suitable for recording a first current to be measured, and a current sensor encased in an IC housing, which current sensor comprises a second current conductor extending inside the housing and with molded first and second electric terminal leads (7, 8) and also third electric terminal leads, wherein the housing is mounted above the first current conductor on the substrate, such that the second current conductor extends above and parallel to the first current conductor and the first, second and third terminal leads (7, 8) are bent towards the substrate and fixed onto the substrate, the current sensor comprises a semiconductor chip, which is mounted on a side of the second current conductor facing the substrate and an active surface positioned between the first and second current conductors (3, 5) with a magnetic field sensor and electronic circuits for the operation of the magnetic field sensor, the first and second terminal leads (7, 8) on a first side wall of the housing protrude from the housing and are suitable for recording a second current to be measured coming from the substrate into the second current conductor, the third terminal leads protrude from the housing on a side wall of the housing opposite the first side wall and are connected via bond wires to electric terminals of the semiconductor chip, the magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the active surface of the semiconductor chip and perpendicular to the second current conductor. the housing is mounted above the first current conductor on the substrate, such that the second current conductor extends above and parallel to the first current conductor and the first, second and third terminal leads (7, 8) are bent towards the substrate and fixed onto the substrate, the current sensor comprises a semiconductor chip, which is mounted on a side of the second current conductor facing the substrate and an active surface positioned between the first and second current conductors (3, 5) with a magnetic field sensor and electronic circuits for the operation of the magnetic field sensor, the first and second terminal leads (7, 8) on a first side wall of the housing protrude from the housing and are suitable for recording a second current to be measured coming from the substrate into the second current conductor, the third terminal leads protrude from the housing on a side wall of the housing opposite the first side wall and are connected via bond wires to electric terminals of the semiconductor chip, the magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the active surface of the semiconductor chip and perpendicular to the second current conductor.