A method of forming a glass envelope for an electronic or optoelectronic device comprising: traversing a closed path over a surface of a glass assembly comprising first and second glass plates (12, 14) with a laser beam to heat a frit disposed between the first and second glass plates (12, 14), wherein the heating melts the frit and seals the glass assembly to form a glass envelope, the traversing comprising: a) increasing a power of the laser beam from a first power at a location A to a second power at a location B downstream from location A relative to a direction of the traverse, wherein the method is characterized in that the first and second glass plates (12, 14) have a coefficient of thermal expansion equal to or greater than 50x10 -7 /°C and the frit has a coefficient of thermal expansion equal to or less than 40x10 -7 /°C, and the traversing further comprises: b) maintaining the laser beam at the second power until the beam passes location A and reaches a location C, a predetermined distance past location B relative to the direction of traverse; c) decreasing a power of the laser beam from point C until the beam reaches a third power at location D, a predetermined distance past C relative to the direction of traverse. traversing a closed path over a surface of a glass assembly comprising first and second glass plates (12, 14) with a laser beam to heat a frit disposed between the first and second glass plates (12, 14), wherein the heating melts the frit and seals the glass assembly to form a glass envelope, the traversing comprising: a) increasing a power of the laser beam from a first power at a location A to a second power at a location B downstream from location A relative to a direction of the traverse, wherein the method is characterized in that the first and second glass plates (12, 14) have a coefficient of thermal expansion equal to or greater than 50x10 -7 /°C and the frit has a coefficient of thermal expansion equal to or less than 40x10 -7 /°C, and the traversing further comprises: b) maintaining the laser beam at the second power until the beam passes location A and reaches a location C, a predetermined distance past location B relative to the direction of traverse; c) decreasing a power of the laser beam from point C until the beam reaches a third power at location D, a predetermined distance past C relative to the direction of traverse. a) increasing a power of the laser beam from a first power at a location A to a second power at a location B downstream from location A relative to a direction of the traverse, wherein the method is characterized in that the first and second glass plates (12, 14) have a coefficient of thermal expansion equal to or greater than 50x10 -7 /°C and the frit has a coefficient of thermal expansion equal to or less than 40x10 -7 /°C, and the traversing further comprises: b) maintaining the laser beam at the second power until the beam passes location A and reaches a location C, a predetermined distance past location B relative to the direction of traverse; c) decreasing a power of the laser beam from point C until the beam reaches a third power at location D, a predetermined distance past C relative to the direction of traverse. b) maintaining the laser beam at the second power until the beam passes location A and reaches a location C, a predetermined distance past location B relative to the direction of traverse; c) decreasing a power of the laser beam from point C until the beam reaches a third power at location D, a predetermined distance past C relative to the direction of traverse.