Use of a grounding assembly in a power semiconductor apparatus comprising: a semiconductor module comprising a semiconductor device, the grounding assembly and associated control circuitry, wherein the grounding assembly comprises: a first conductive layer, a second conductive layer, a substrate disposed between the first conductive layer and the second conductive layer, and a base attached to the second conductive layer; the first conductive layer in electrical contact with the semiconductor device and the substrate being electrically insulated from the second conductive layer by the substrate; and the second conductive layer in electrical contact with the substrate and disposed between the substrate and the base, wherein: the first conductive layer, the substrate and the second conductive layer form a capacitance path between the semiconductor device and the base for reducing circulating currents; the associated control circuitry is mounted on the base; and the base is connected to earth ground; characterized in that the power semiconductor apparatus further comprises a nonconductive heat sink in thermal communication with the base and in fluid communication with a source of liquid, wherein the nonconductive heat sink comprises: a body having a surface configured to receive the semiconductor module; a tub disposed on the surface of the body; and a passageway formed in the body and configured to receive a liquid therethrough, wherein a portion of the liquid flows through the passageway is diverted across the tub in thermal communication with the body, being in direct contact with the base of the semiconductor module, to transfer heat to the liquid coolant from the semiconductor module. a semiconductor module comprising a semiconductor device, the grounding assembly and associated control circuitry, wherein the grounding assembly comprises: a first conductive layer, a second conductive layer, a substrate disposed between the first conductive layer and the second conductive layer, and a base attached to the second conductive layer; the first conductive layer in electrical contact with the semiconductor device and the substrate being electrically insulated from the second conductive layer by the substrate; and the second conductive layer in electrical contact with the substrate and disposed between the substrate and the base, wherein: the first conductive layer, the substrate and the second conductive layer form a capacitance path between the semiconductor device and the base for reducing circulating currents; the associated control circuitry is mounted on the base; and the base is connected to earth ground; a first conductive layer, a second conductive layer, a substrate disposed between the first conductive layer and the second conductive layer, and a base attached to the second conductive layer; the first conductive layer in electrical contact with the semiconductor device and the substrate being electrically insulated from the second conductive layer by the substrate; and the second conductive layer in electrical contact with the substrate and disposed between the substrate and the base, wherein: the first conductive layer, the substrate and the second conductive layer form a capacitance path between the semiconductor device and the base for reducing circulating currents; the associated control circuitry is mounted on the base; and the base is connected to earth ground; the first conductive layer, the substrate and the second conductive layer form a capacitance path between the semiconductor device and the base for reducing circulating currents; the associated control circuitry is mounted on the base; and the base is connected to earth ground; a body having a surface configured to receive the semiconductor module; a tub disposed on the surface of the body; and a passageway formed in the body and configured to receive a liquid therethrough, wherein a portion of the liquid flows through the passageway is diverted across the tub in thermal communication with the body, being in direct contact with the base of the semiconductor module, to transfer heat to the liquid coolant from the semiconductor module.