A semiconductor device comprising: a semiconductor chip; and a resin package which seals the semiconductor chip; the resin package having a plurality of mounting protrusions covered with metal films on a mounting surface thereof, the mounting surface of the plurality of mounting protrusions forming respective signal terminals; the metal films including: first metal films electrically connected to signal pads on the semiconductor chip by first conductive wires, one of the first metal films forming a grounding terminal, and the first metal films projecting from a bottom surface of the resin package and covering the mounting surface of the corresponding mounting protrusion; and a second metal film in contact with a bottom surface of the semiconductor chip via a conductive adhesive; wherein said first metal films include first flat regions, the first conductive wires being connected to the first metal films at the first flat regions; characterised in that: the first flat region of the first metal film that forms the grounding terminal is connected to the second metal film by a second conductive wire at a second flat region of the second metal film, said second metal film projecting outward from said bottom surface of the resin package; and said first metal films and said second metal film project from said bottom surface of said resin package by an identical distance. a semiconductor chip; and a resin package which seals the semiconductor chip; the resin package having a plurality of mounting protrusions covered with metal films on a mounting surface thereof, the mounting surface of the plurality of mounting protrusions forming respective signal terminals; the metal films including: first metal films electrically connected to signal pads on the semiconductor chip by first conductive wires, one of the first metal films forming a grounding terminal, and the first metal films projecting from a bottom surface of the resin package and covering the mounting surface of the corresponding mounting protrusion; and a second metal film in contact with a bottom surface of the semiconductor chip via a conductive adhesive; wherein said first metal films include first flat regions, the first conductive wires being connected to the first metal films at the first flat regions; characterised in that: the first flat region of the first metal film that forms the grounding terminal is connected to the second metal film by a second conductive wire at a second flat region of the second metal film, said second metal film projecting outward from said bottom surface of the resin package; and said first metal films and said second metal film project from said bottom surface of said resin package by an identical distance. first metal films electrically connected to signal pads on the semiconductor chip by first conductive wires, one of the first metal films forming a grounding terminal, and the first metal films projecting from a bottom surface of the resin package and covering the mounting surface of the corresponding mounting protrusion; and a second metal film in contact with a bottom surface of the semiconductor chip via a conductive adhesive; wherein said first metal films include first flat regions, the first conductive wires being connected to the first metal films at the first flat regions; the first flat region of the first metal film that forms the grounding terminal is connected to the second metal film by a second conductive wire at a second flat region of the second metal film, said second metal film projecting outward from said bottom surface of the resin package; and said first metal films and said second metal film project from said bottom surface of said resin package by an identical distance.