A degradable resin composition, characterized in that the resin composition comprises an epoxy resin, a degradable amine curing agent, a degradable thiol curing agent, and an inorganic filler, wherein the degradable amine curing agent has the following structure: the degradable thiol curing agent has the following structure: wherein R 1 and R 2 are independently anyone selected from the group consisting of hydrogen atom, alkyl group, cycloalkyl group, heterocyclic group, heterocycloalkyl group, alkenyl group, cycloalkenyl group, aromatic group, heteroaromatic group, alkyl heteroalkyl group, alkynyl group, alkylene group, alkylene heteroalkylene, alkenylene group, alkylene heteroalkenylene, alkynylene group or alkylene heteroalkynylene; R 3 and R 4 are independently anyone selected from the group consisting of alkylene group, alkylene heteroalkylene, alkenylene group, alkenylene heteroalkenylene, alkylene heteroalkenylene, alkynylene group, cycloalkylene group, alkylene cycloalkylene, alkylene cycloalkylene alkylene, alkenylene cycloalkylene, alkenylene cycloalkylene alkenylene, alkylene cycloalkylene alkenylene, alkynylene cycloalkylene, alkynylene cycloalkylene alkynylene, heterocycloalkylene group, alkylene heterocycloalkylene, alkylene heterocycloalkyl alkylene, alkenylene heterocycloalkylene, alkenylene heterocycloalkyl alkenylene, alkylene heterocycloalkyl alkenylene, alkynylene heterocycloalkylene, alkynylene heterocycloalkyl alkynylene, cycloalkenylene, alkylene cycloalkenylene, alkylene cycloalkenylene alkylene, alkenylene cycloalkenylene, alkenylene cycloalkenylene alkenylene, alkylene cycloalkenylene alkenylene, alkynylene cycloalkenylene, alkynylene cycloalkenylene alkynylene, heterocycloalkenylene, alkylene heterocycloalkenylene, alkylene heterocycloalkenyl alkylene, alkenylene heterocycloalkenylene, alkenylene heterocycloalkenyl alkenylene, alkylene heterocycloalkenyl alkenylene, alkynylene heterocycloalkenylene, alkynylene heterocycloalkenyl alkynylene, arylene group, alkylene arylene group, alkylene arylene alkylene, alkenylene arylene group, alkenylene arylene alkenylene, alkylene arylene alkenylene, alkynylene arylene group, alkynylene arylene alkynylene, heteroarylene group, alkylene heteroarylene group, alkylene heteroarylene alkylene, alkenylene heteroarylene group, alkenylene heteroarylene alkenylene, alkylene heteroarylene alkenylene, alkynylene heteroarylene group, alkynylene heteroarylene alkynylene, 1,4-alkyl substituted piperazine, carbonyl group and thiocarbonyl group; wherein the epoxy groups in the epoxy resin and the active hydrogen in the degradable amine and thiol curing agents have a molar ratio of 0.8-1.2; the active hydrogen in the degradable amine curing agent and the active hydrogen in the degradable thiol curing agent have a molar ratio of 0.5-4.0. wherein R 1 and R 2 are independently anyone selected from the group consisting of hydrogen atom, alkyl group, cycloalkyl group, heterocyclic group, heterocycloalkyl group, alkenyl group, cycloalkenyl group, aromatic group, heteroaromatic group, alkyl heteroalkyl group, alkynyl group, alkylene group, alkylene heteroalkylene, alkenylene group, alkylene heteroalkenylene, alkynylene group or alkylene heteroalkynylene; R 3 and R 4 are independently anyone selected from the group consisting of alkylene group, alkylene heteroalkylene, alkenylene group, alkenylene heteroalkenylene, alkylene heteroalkenylene, alkynylene group, cycloalkylene group, alkylene cycloalkylene, alkylene cycloalkylene alkylene, alkenylene cycloalkylene, alkenylene cycloalkylene alkenylene, alkylene cycloalkylene alkenylene, alkynylene cycloalkylene, alkynylene cycloalkylene alkynylene, heterocycloalkylene group, alkylene heterocycloalkylene, alkylene heterocycloalkyl alkylene, alkenylene heterocycloalkylene, alkenylene heterocycloalkyl alkenylene, alkylene heterocycloalkyl alkenylene, alkynylene heterocycloalkylene, alkynylene heterocycloalkyl alkynylene, cycloalkenylene, alkylene cycloalkenylene, alkylene cycloalkenylene alkylene, alkenylene cycloalkenylene, alkenylene cycloalkenylene alkenylene, alkylene cycloalkenylene alkenylene, alkynylene cycloalkenylene, alkynylene cycloalkenylene alkynylene, heterocycloalkenylene, alkylene heterocycloalkenylene, alkylene heterocycloalkenyl alkylene, alkenylene heterocycloalkenylene, alkenylene heterocycloalkenyl alkenylene, alkylene heterocycloalkenyl alkenylene, alkynylene heterocycloalkenylene, alkynylene heterocycloalkenyl alkynylene, arylene group, alkylene arylene group, alkylene arylene alkylene, alkenylene arylene group, alkenylene arylene alkenylene, alkylene arylene alkenylene, alkynylene arylene group, alkynylene arylene alkynylene, heteroarylene group, alkylene heteroarylene group, alkylene heteroarylene alkylene, alkenylene heteroarylene group, alkenylene heteroarylene alkenylene, alkylene heteroarylene alkenylene, alkynylene heteroarylene group, alkynylene heteroarylene alkynylene, 1,4-alkyl substituted piperazine, carbonyl group and thiocarbonyl group; wherein the epoxy groups in the epoxy resin and the active hydrogen in the degradable amine and thiol curing agents have a molar ratio of 0.8-1.2; the active hydrogen in the degradable amine curing agent and the active hydrogen in the degradable thiol curing agent have a molar ratio of 0.5-4.0.