A light emitting device package comprising: a package body having an upper surface, side surfaces and a cavity at the upper surface; a first lead frame including a first upper surface part exposed to the cavity, and a first side surface part passing through the package body, connected to a first side portion of the first upper surface part, and bent from the first side portion of the first upper surface part and exposed to a first side surface of the package body; a second lead frame including a second upper surface part exposed to the cavity, and a second side surface part bent from the second upper surface part and exposed to the first side surface of the package body; and at least one light emitting chip (642, 644) including a first semiconductor layer, an active layer and a second semiconductor layer, and arranged on the first upper surface part of the first lead frame, wherein the second upper surface part includes first to third portions (742-1, 742-2, 742-3) arranged corresponding to the remaining side portions of the first upper surface part (712,, wherein the second side surface part includes: a first portion bent from the first portion of the second upper surface part; and a second portion bent from the third portion of the second upper surface part, wherein the first lead frame further includes at least one first through hole formed adjacent to a boundary part between the first upper surface part and the first side surface part, and wherein the first lead frame further includes connection parts (732, 734, 736) connecting the first upper surface part and the first side surface part, the at least one first through hole is located between the connection parts, and the length of at least one of the connection parts differ from the length of the remainder. a package body having an upper surface, side surfaces and a cavity at the upper surface; a first lead frame including a first upper surface part exposed to the cavity, and a first side surface part passing through the package body, connected to a first side portion of the first upper surface part, and bent from the first side portion of the first upper surface part and exposed to a first side surface of the package body; a second lead frame including a second upper surface part exposed to the cavity, and a second side surface part bent from the second upper surface part and exposed to the first side surface of the package body; and at least one light emitting chip (642, 644) including a first semiconductor layer, an active layer and a second semiconductor layer, and arranged on the first upper surface part of the first lead frame, wherein the second upper surface part includes first to third portions (742-1, 742-2, 742-3) arranged corresponding to the remaining side portions of the first upper surface part (712,, wherein the second side surface part includes: a first portion bent from the first portion of the second upper surface part; and a second portion bent from the third portion of the second upper surface part, wherein the first lead frame further includes at least one first through hole formed adjacent to a boundary part between the first upper surface part and the first side surface part, and wherein the first lead frame further includes connection parts (732, 734, 736) connecting the first upper surface part and the first side surface part, the at least one first through hole is located between the connection parts, and the length of at least one of the connection parts differ from the length of the remainder. a first portion bent from the first portion of the second upper surface part; and a second portion bent from the third portion of the second upper surface part, wherein the first lead frame further includes at least one first through hole formed adjacent to a boundary part between the first upper surface part and the first side surface part, and wherein the first lead frame further includes connection parts (732, 734, 736) connecting the first upper surface part and the first side surface part, the at least one first through hole is located between the connection parts, and the length of at least one of the connection parts differ from the length of the remainder.