A light emitting module comprising: a semiconductor light emitting element comprising: a first light emitting surface, second light emitting surfaces bordering the first light emitting surface; and a back surface opposite to the first light emitting surface, an optical wavelength conversion member that converts a wavelength of light emitted from the semiconductor light emitting element; wherein the optical wavelength conversion member is plate-shaped and is disposed such that an incident surface of the optical wavelength conversion member faces the first light emitting surface; a reflecting member disposed to face the incident surface of the optical wavelength conversion member, the reflecting member comprising a reflecting surface; and a mounting substrate comprising a mounting surface, wherein the semiconductor light emitting element and the reflecting member are disposed on the mounting surface of the mounting substrate, wherein the reflecting surface faces the second light emitting surfaces and wherein the reflecting surface is inclined such that a distance between the reflecting surface and the second light emitting surfaces is gradually increased toward the incident surface of the optical wavelength conversion member, characterized in that the reflecting member further comprises: a vertical surface that borders the reflecting surface and extends in a direction substantially perpendicular to the first light emitting surface such that the optical wavelength conversion member is closer to the reflecting surface than to the vertical surface, wherein the height of a gap between the mounting surface of the mounting substrate and the back surface of the semiconductor light emitting element is equal to the height of the vertical surface. a semiconductor light emitting element comprising: a first light emitting surface, second light emitting surfaces bordering the first light emitting surface; and a back surface opposite to the first light emitting surface, a first light emitting surface, second light emitting surfaces bordering the first light emitting surface; and a back surface opposite to the first light emitting surface, an optical wavelength conversion member that converts a wavelength of light emitted from the semiconductor light emitting element; wherein the optical wavelength conversion member is plate-shaped and is disposed such that an incident surface of the optical wavelength conversion member faces the first light emitting surface; a reflecting member disposed to face the incident surface of the optical wavelength conversion member, the reflecting member comprising a reflecting surface; and a mounting substrate comprising a mounting surface, wherein the semiconductor light emitting element and the reflecting member are disposed on the mounting surface of the mounting substrate, wherein the reflecting surface faces the second light emitting surfaces and wherein the reflecting surface is inclined such that a distance between the reflecting surface and the second light emitting surfaces is gradually increased toward the incident surface of the optical wavelength conversion member, a vertical surface that borders the reflecting surface and extends in a direction substantially perpendicular to the first light emitting surface such that the optical wavelength conversion member is closer to the reflecting surface than to the vertical surface,