A light emitting device package comprising: a package body including a plurality of first ceramic layers (210a, 210b, 210c, 210d); a plurality of first electrode patterns(281a to 284a) and a plurality of second electrode patterns (281b to 284b) placed on the package body; at least one light emitting device (240a, 240b) electrically connected to the electrode patterns (281a, 281b, 282a, 282b, 283a, 283b, 284a, 284b); a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device (240a, 240b); and an anti-fracture layer placed on the heat dissipation member; a third ceramic layer placed between the heat dissipation member and the anti-fracture layer, said light emitting device (240a, 240b) arranged on the third ceramic layer, characterized by further comprising a plurality of connection electrodes (291a, 291b, 292a, 292b, 293a, 293b) wherein a first plurality of connection electrodes (291a to 293a) and a second plurality of connection electrodes (291b to 293b) are respectively arranged between the plurality of first electrode patterns (281a to 281a) and between the plurality of second electrode patterns (281b to 284b), said plurality of connection electrodes being conductive material filling holes in the third ceramic layer and the anti-fracture layer, wherein said light emitting device is arranged on the bottom surface of a cavity with sidewalls constituted respectively by two of the plurality of first ceramic layers (210c, 210d), wherein the light emitting device (240a, 240b) thermally comes into contact with the heat dissipation member through the third ceramic layer, wherein the at least one light emitting device (240a, 240b) emits UV light, wherein the at least one light emitting device (240a, 240b) is attached through at least one conductive adhesive layer (286a, 286b), wherein the anti-fracture layer vertically overlaps with at least a partial region of the heat dissipation member, and wherein the heat dissipation member includes expanded portions at regions corresponding to a boundary of different first ceramic layers (210a, 210b) and a boundary between the first ceramic layers and the third ceramic layer. a package body including a plurality of first ceramic layers (210a, 210b, 210c, 210d); a plurality of first electrode patterns(281a to 284a) and a plurality of second electrode patterns (281b to 284b) placed on the package body; at least one light emitting device (240a, 240b) electrically connected to the electrode patterns (281a, 281b, 282a, 282b, 283a, 283b, 284a, 284b); a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device (240a, 240b); and an anti-fracture layer placed on the heat dissipation member; a third ceramic layer placed between the heat dissipation member and the anti-fracture layer, said light emitting device (240a, 240b) arranged on the third ceramic layer, characterized by further comprising a plurality of connection electrodes (291a, 291b, 292a, 292b, 293a, 293b) wherein a first plurality of connection electrodes (291a to 293a) and a second plurality of connection electrodes (291b to 293b) are respectively arranged between the plurality of first electrode patterns (281a to 281a) and between the plurality of second electrode patterns (281b to 284b), said plurality of connection electrodes being conductive material filling holes in the third ceramic layer and the anti-fracture layer, wherein said light emitting device is arranged on the bottom surface of a cavity with sidewalls constituted respectively by two of the plurality of first ceramic layers (210c, 210d), wherein the light emitting device (240a, 240b) thermally comes into contact with the heat dissipation member through the third ceramic layer, wherein the at least one light emitting device (240a, 240b) emits UV light, wherein the at least one light emitting device (240a, 240b) is attached through at least one conductive adhesive layer (286a, 286b), wherein the anti-fracture layer vertically overlaps with at least a partial region of the heat dissipation member, and wherein the heat dissipation member includes expanded portions at regions corresponding to a boundary of different first ceramic layers (210a, 210b) and a boundary between the first ceramic layers and the third ceramic layer.