Method for producing solid-state layers, at least comprising the steps of: providing a solid-state body for the separation of at least one solid-state layer, disposing a receiving layer for holding the solid-state layer on the solid-state body, the receiving layer consisting at least of a polymer and of a further material, the further material having a higher temperature conductivity than the polymer, generating defects in the internal structure of the solid-state body for predefining a detachment plane by means of at least one femtosecond laser, before or after the attachment of the receiving layer on the solid-state body, and subsequently cooling the receiving layer to or below an ambient temperature in such a way that a polymer fraction of the receiving layer undergoes a glass transition for the generation, more particularly mechanical generation, of stresses in the solid-state body, the stresses causing a crack to propagate in the solid-state body along the detachment plane, and the crack causing the solid-state layer to separate from the solid-state body; wherein the further material is applied as a coating on the polymer or the polymer is applied as a coating on the further material; or wherein the further material is provided in the form of elongate elements, more particularly chips, within a layer structure predefined by the polymer, the elements, more particularly the chips, being preferably aligned in such a way that their longitudinal axis extends orthogonally to the direction of layer extent; or wherein the receiving layer has a multiplicity of holes, the holes being lined or filled with the further material. providing a solid-state body for the separation of at least one solid-state layer, disposing a receiving layer for holding the solid-state layer on the solid-state body, the receiving layer consisting at least of a polymer and of a further material, the further material having a higher temperature conductivity than the polymer, generating defects in the internal structure of the solid-state body for predefining a detachment plane by means of at least one femtosecond laser, before or after the attachment of the receiving layer on the solid-state body, and subsequently cooling the receiving layer to or below an ambient temperature in such a way that a polymer fraction of the receiving layer undergoes a glass transition for the generation, more particularly mechanical generation, of stresses in the solid-state body, the stresses causing a crack to propagate in the solid-state body along the detachment plane, and the crack causing the solid-state layer to separate from the solid-state body; wherein the further material is applied as a coating on the polymer or the polymer is applied as a coating on the further material; or wherein the further material is provided in the form of elongate elements, more particularly chips, within a layer structure predefined by the polymer, the elements, more particularly the chips, being preferably aligned in such a way that their longitudinal axis extends orthogonally to the direction of layer extent; or wherein the receiving layer has a multiplicity of holes, the holes being lined or filled with the further material.