A thermal bonding sheet comprising a precursor layer that is to become a sintered layer by heating, wherein a weight reduction rate ΔW 0 (%) and a weight reduction rate ΔW 24 (%) satisfy a relationship of a formula below, the weight reduction rate ΔW 0 (%) being represented by a formula below when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10°C/min from 23°C to 400°C with a differential thermal balance before the thermal bonding sheet is exposed to an atmosphere having a temperature of 23 ± 2°C and a humidity of 50 ± 20%, the weight reduction rate ΔW 24 (%) being represented by a formula below when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10°C/min from 23°C to 400°C with a differential thermal balance after the thermal bonding sheet is exposed to an atmosphere having a temperature of 23 ± 2°C and a humidity of 50 ± 20% for 24 hours, Δ W 0 = W 400 − W 23 / W 23 × 100 % wherein W 23 is a weight of the thermal bonding sheet at 23°C before the thermal bonding sheet is exposed to the atmosphere; and W 400 is a weight of the thermal bonding sheet at 400°C before the thermal bonding sheet is exposed to the atmosphere, Δ W 24 = W ′ 400 − W ′ 23 / W ′ 23 × 100 % wherein W' 23 is a weight of the thermal bonding sheet at 23°C after the thermal bonding sheet is exposed to the atmosphere; and W' 400 is a weight of the thermal bonding sheet at 400°C after the thermal bonding sheet is exposed to the atmosphere, − 1 % ≤ Δ W 0 − Δ W 24 ≤ 0.5 % wherein the precursor layer contains a thermally decomposable binder which is a solid at 23°C, wherein the thermally decomposable binder which is a solid at 23°C is at least one selected from the group consisting of a polycarbonate resin and an acrylic resin, and wherein the precursor layer contains 1,6-hexanediol. the weight reduction rate ΔW 0 (%) being represented by a formula below when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10°C/min from 23°C to 400°C with a differential thermal balance before the thermal bonding sheet is exposed to an atmosphere having a temperature of 23 ± 2°C and a humidity of 50 ± 20%, the weight reduction rate ΔW 24 (%) being represented by a formula below when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10°C/min from 23°C to 400°C with a differential thermal balance after the thermal bonding sheet is exposed to an atmosphere having a temperature of 23 ± 2°C and a humidity of 50 ± 20% for 24 hours, Δ W 0 = W 400 − W 23 / W 23 × 100 % wherein W 23 is a weight of the thermal bonding sheet at 23°C before the thermal bonding sheet is exposed to the atmosphere; and W 400 is a weight of the thermal bonding sheet at 400°C before the thermal bonding sheet is exposed to the atmosphere, Δ W 24 = W ′ 400 − W ′ 23 / W ′ 23 × 100 % wherein W' 23 is a weight of the thermal bonding sheet at 23°C after the thermal bonding sheet is exposed to the atmosphere; and W' 400 is a weight of the thermal bonding sheet at 400°C after the thermal bonding sheet is exposed to the atmosphere, − 1 % ≤ Δ W 0 − Δ W 24 ≤ 0.5 % W 23 is a weight of the thermal bonding sheet at 23°C before the thermal bonding sheet is exposed to the atmosphere; and W 400 is a weight of the thermal bonding sheet at 400°C before the thermal bonding sheet is exposed to the atmosphere, Δ W 24 = W ′ 400 − W ′ 23 / W ′ 23 × 100 % wherein W' 23 is a weight of the thermal bonding sheet at 23°C after the thermal bonding sheet is exposed to the atmosphere; and W' 400 is a weight of the thermal bonding sheet at 400°C after the thermal bonding sheet is exposed to the atmosphere, − 1 % ≤ Δ W 0 − Δ W 24 ≤ 0.5 % W' 23 is a weight of the thermal bonding sheet at 23°C after the thermal bonding sheet is exposed to the atmosphere; and W' 400 is a weight of the thermal bonding sheet at 400°C after the thermal bonding sheet is exposed to the atmosphere, − 1 % ≤ Δ W 0 − Δ W 24 ≤ 0.5 % wherein the precursor layer contains a thermally decomposable binder which is a solid at 23°C, wherein the thermally decomposable binder which is a solid at 23°C is at least one selected from the group consisting of a polycarbonate resin and an acrylic resin, and wherein the precursor layer contains 1,6-hexanediol.