A ball-grid-array attached radio-frequency integrated-circuit printed-circuit-board assembly configured to propagate a radio-frequency signal and suitable for an automated vehicle, said assembly comprising: a die that includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad, said die operable to output a signal via the signal-out-pad, said signal characterized by a frequency; a plurality of solder-balls used to attach the die; a substrate that defines a plane and includes a plurality of vias oriented normal to the plane and extending from a top-side of the substrate to a bottom-side of the substrate, wherein the plurality of vias are characterized by a via-height that corresponds to a thickness of the substrate; a top-metal layer attached to the top-side of the substrate, said top-metal layer configured to provide solder-pads for the plurality of solder-balls to attach the die to the top-metal layer; and a bottom-metal layer attached to the bottom-side of the substrate, wherein the top-metal layer, the plurality of vias extending through the substrate in two rows, and the bottom-metal layer are configured to cooperate to form a substrate-integrated-waveguide suitable for propagating the signal in a direction parallel to the plane of the substrate, wherein the top-metal layer defines a u-shaped-slot through the top-metal layer, partially surrounding a signal-portion of the top-metal layer, and partially surrounded by a ground-portion of the top-metal layer, the signal-portion is aligned with the signal-out-pad, and the ground-portion is aligned with the plurality of ground-pads, said u-shaped-slot characterized by a slot-length that is based on the frequency of the signal, and a slot-width that is based on the via-height such that the signal generates an electric field directed across the u-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide; characterized in that a ratio defined by the via-height divided by the slot-width is greater than three. a die that includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad, said die operable to output a signal via the signal-out-pad, said signal characterized by a frequency; a plurality of solder-balls used to attach the die; a substrate that defines a plane and includes a plurality of vias oriented normal to the plane and extending from a top-side of the substrate to a bottom-side of the substrate, wherein the plurality of vias are characterized by a via-height that corresponds to a thickness of the substrate; a top-metal layer attached to the top-side of the substrate, said top-metal layer configured to provide solder-pads for the plurality of solder-balls to attach the die to the top-metal layer; and a bottom-metal layer attached to the bottom-side of the substrate, wherein the top-metal layer, the plurality of vias extending through the substrate in two rows, and the bottom-metal layer are configured to cooperate to form a substrate-integrated-waveguide suitable for propagating the signal in a direction parallel to the plane of the substrate, wherein the top-metal layer defines a u-shaped-slot through the top-metal layer, partially surrounding a signal-portion of the top-metal layer, and partially surrounded by a ground-portion of the top-metal layer, the signal-portion is aligned with the signal-out-pad, and the ground-portion is aligned with the plurality of ground-pads, said u-shaped-slot characterized by a slot-length that is based on the frequency of the signal, and a slot-width that is based on the via-height such that the signal generates an electric field directed across the u-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide; characterized in that a ratio defined by the via-height divided by the slot-width is greater than three.