A titanium copper containing from 1.5 to 5.0% by mass of Ti, optionally a total amount of from 0 to 1.0% by mass of one or more elements selected from Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr and Zr, and the balance being of Cu and inevitable impurities, the titanium copper being in a form of a foil or strip, wherein the titanium copper has a layered structure of Cu and Ti where in a Ti concentration curve obtained by analyzing a cross section parallel to a rolling direction along a thickness direction by STEM-EDX according to the methods disclosed in the description, a lower concentration Ti layer having a Ti concentration less than an average value of Ti concentrations in the Ti concentration curve and a higher concentration Ti layer having a Ti concentration equal to or higher than the average value of the Ti concentrations in the Ti concentration curve are alternately present in the thickness direction, the layered structure being defined as a structure in which the lower concentration Ti layer and the higher concentration Ti layer are alternately present and each of the lower concentration Ti layer and the higher concentration Ti layer is continuous over 50 nm or more in the rolling direction, wherein in the cross section parallel to the rolling direction, a Ti concentration difference in the layered structure is 3% by mass or more, the Ti concentration difference being a difference between a maximum value of the Ti concentration in the higher concentration Ti layer and a minimum value of the Ti concentration in the lower concentration Ti layer, and wherein the titanium copper has a tensile strength of 1100 MPa or more in the direction parallel to the rolling direction measured in accordance with JIS Z2241: 2011, Metal Material Tensile Test Method. wherein the titanium copper has a layered structure of Cu and Ti where in a Ti concentration curve obtained by analyzing a cross section parallel to a rolling direction along a thickness direction by STEM-EDX according to the methods disclosed in the description, a lower concentration Ti layer having a Ti concentration less than an average value of Ti concentrations in the Ti concentration curve and a higher concentration Ti layer having a Ti concentration equal to or higher than the average value of the Ti concentrations in the Ti concentration curve are alternately present in the thickness direction, the layered structure being defined as a structure in which the lower concentration Ti layer and the higher concentration Ti layer are alternately present and each of the lower concentration Ti layer and the higher concentration Ti layer is continuous over 50 nm or more in the rolling direction, wherein in the cross section parallel to the rolling direction, a Ti concentration difference in the layered structure is 3% by mass or more, the Ti concentration difference being a difference between a maximum value of the Ti concentration in the higher concentration Ti layer and a minimum value of the Ti concentration in the lower concentration Ti layer, and wherein the titanium copper has a tensile strength of 1100 MPa or more in the direction parallel to the rolling direction measured in accordance with JIS Z2241: 2011, Metal Material Tensile Test Method.