An apparatus for hole drilling in a substrate, comprising: a laser system configured to apply a laser beam onto the substrate for removing material from a set of areas (10, 20, 25) on the substrate by directing the laser beam onto predefined positions corresponding to the set of areas on the substrate in a sequence, the sequence defining the order in which the areas are subjected to the laser beam, a ventilation system configured to produce a fluid flow along one or more sides of the substrate, the fluid flow being directed in a fluid flow direction; a controller configured to control the laser beam such that the laser beam is sequentially positioned according to a first laser beam movement direction and a second laser beam movement direction with the laser beam being repeatedly directed onto each position corresponding to the set of areas at least three times, with at least half of the subjected areas being allowed to cool for at least 50 ms after each time an area from the set of areas is subjected to the laser beam, wherein the angle between the first laser beam movement direction and the fluid flow direction is defined as q1, the angle between the second laser beam movement direction and the fluid flow direction is defined as q2; wherein either both cos q1 and cos q2 are smaller than or equal to 0; or each of q1 and q2 is larger than 20° and smaller than 340°; or either q1 or q2 is smaller than 20°, or larger than 340°, and the laser beam movement is controlled such that the area which is subjected to the laser beam in the sequence is more than one area distant from the prior area subjected to the laser beam in the sequence. a laser system configured to apply a laser beam onto the substrate for removing material from a set of areas (10, 20, 25) on the substrate by directing the laser beam onto predefined positions corresponding to the set of areas on the substrate in a sequence, the sequence defining the order in which the areas are subjected to the laser beam, a ventilation system configured to produce a fluid flow along one or more sides of the substrate, the fluid flow being directed in a fluid flow direction; a controller configured to control the laser beam such that the laser beam is sequentially positioned according to a first laser beam movement direction and a second laser beam movement direction with the laser beam being repeatedly directed onto each position corresponding to the set of areas at least three times, with at least half of the subjected areas being allowed to cool for at least 50 ms after each time an area from the set of areas is subjected to the laser beam, wherein the angle between the first laser beam movement direction and the fluid flow direction is defined as q1, the angle between the second laser beam movement direction and the fluid flow direction is defined as q2; wherein either both cos q1 and cos q2 are smaller than or equal to 0; or each of q1 and q2 is larger than 20° and smaller than 340°; or either q1 or q2 is smaller than 20°, or larger than 340°, and the laser beam movement is controlled such that the area which is subjected to the laser beam in the sequence is more than one area distant from the prior area subjected to the laser beam in the sequence. both cos q1 and cos q2 are smaller than or equal to 0; or each of q1 and q2 is larger than 20° and smaller than 340°; or either q1 or q2 is smaller than 20°, or larger than 340°, and the laser beam movement is controlled such that the area which is subjected to the laser beam in the sequence is more than one area distant from the prior area subjected to the laser beam in the sequence.