A method for producing a sandwich arrangement consisting of a first component comprising a contact surface A, a second component comprising a contact surface D, and solder located between the contact surfaces A and D, wherein the solder is produced by melting a solder deposit that is arranged between the two components and that is connected to one of the components at the contact surface A or D, followed by cooling the molten solder below its solidification temperature, wherein the solder deposit is produced previously by melting a solder preform that is fixed to the relevant contact surface A or D by means of a fixing agent applied from a fixing agent composition, followed by cooling the molten solder below its solidification temperature, and wherein the solder deposit is arranged so as to have its free contact surface facing the corresponding contact surface D or A, respectively, of the as of yet unconnected component, wherein the fixing agent composition consists of 0 to 97 wt.% of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285 °C, 3 to 100 wt.% of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable in the range of 30 to 180 °C and (ii) non-polymeric organic compounds that are meltable in the range of 30 to 180 °C, do not have acidic groups and are selected from lactams and fatty alcohols, 0 to 20 wt.% of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable in the range of 30 to 180 °C and (iv) non-polymeric organic compounds that are not meltable in the range of 30 to 180 °C, do not have acidic groups and do not have a boiling point or have a boiling point above 285 °C, and 0 to 30 wt.% of one or more inorganic solid fillers, and wherein the sum of the surface portions provided with the fixing agent, of the contact surfaces A and B or C and D, respectively, which contact surfaces together form a common overlapping area upon placement of the solder preform, is 1500 μm 2 to 50 % by area of the common overlapping area. wherein the solder is produced by melting a solder deposit that is arranged between the two components and that is connected to one of the components at the contact surface A or D, followed by cooling the molten solder below its solidification temperature, wherein the solder deposit is produced previously by melting a solder preform that is fixed to the relevant contact surface A or D by means of a fixing agent applied from a fixing agent composition, followed by cooling the molten solder below its solidification temperature, and wherein the solder deposit is arranged so as to have its free contact surface facing the corresponding contact surface D or A, respectively, of the as of yet unconnected component, wherein the fixing agent composition consists of 0 to 97 wt.% of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285 °C, 3 to 100 wt.% of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable in the range of 30 to 180 °C and (ii) non-polymeric organic compounds that are meltable in the range of 30 to 180 °C, do not have acidic groups and are selected from lactams and fatty alcohols, 0 to 20 wt.% of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable in the range of 30 to 180 °C and (iv) non-polymeric organic compounds that are not meltable in the range of 30 to 180 °C, do not have acidic groups and do not have a boiling point or have a boiling point above 285 °C, and 0 to 30 wt.% of one or more inorganic solid fillers, and 0 to 97 wt.% of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285 °C, 3 to 100 wt.% of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable in the range of 30 to 180 °C and (ii) non-polymeric organic compounds that are meltable in the range of 30 to 180 °C, do not have acidic groups and are selected from lactams and fatty alcohols, 0 to 20 wt.% of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable in the range of 30 to 180 °C and (iv) non-polymeric organic compounds that are not meltable in the range of 30 to 180 °C, do not have acidic groups and do not have a boiling point or have a boiling point above 285 °C, and 0 to 30 wt.% of one or more inorganic solid fillers, and wherein the sum of the surface portions provided with the fixing agent, of the contact surfaces A and B or C and D, respectively, which contact surfaces together form a common overlapping area upon placement of the solder preform, is 1500 μm 2 to 50 % by area of the common overlapping area.