A switch device (100, 200) comprising: a housing having a through portion (K1h); a moving member provided with an operation portion exposed from the through portion; a biasing member that returns the moving member to an initial state before operation; a movable contact that moves with the movement of the moving member; a common fixed contact that is always in contact with the movable contact; a first switching fixed contact (15, 35), the first switching fixed contact being in contact with the movable contact in the initial state where the operation portion is not operated, the first switching fixed contact coming out of contact with the movable contact with the operation of the operation portion; a second switching fixed contact (25, 45), the second switching fixed contact being out of contact with the movable contact in the initial state where the operation portion is not operated, the second switching fixed contact coming into contact with the movable contact with the operation of the operation portion; extending portions that extend from at least two of the common fixed contact, the first switching fixed contact, and the second switching fixed contact; at least two terminal members that extend from the housing to the outside; and two resistors (R9, R9a, R9b, R9c, R9d) for obtaining the resistance value between the at least two terminal members, the housing including a box-shaped case that has the through portion and has an open bottom, and a holding member in which the terminal members are embedded and that covers the bottom of the case, some of the extending portions and the terminal members having fixing portions (7A, 7B) to which the resistors are soldered, wherein the holding member includes a bottom wall portion that covers the bottom of the case, and a holding wall portion provided above the bottom wall portion and holding the fixing portions, and wherein the holding wall portion is formed of a first synthetic resin material having heat resistance, characterised in that the bottom wall portion is made of a second synthetic resin material having a heat distortion temperature lower than that of the first synthetic resin material. a housing having a through portion (K1h); a moving member provided with an operation portion exposed from the through portion; a biasing member that returns the moving member to an initial state before operation; a movable contact that moves with the movement of the moving member; a common fixed contact that is always in contact with the movable contact; a first switching fixed contact (15, 35), the first switching fixed contact being in contact with the movable contact in the initial state where the operation portion is not operated, the first switching fixed contact coming out of contact with the movable contact with the operation of the operation portion; a second switching fixed contact (25, 45), the second switching fixed contact being out of contact with the movable contact in the initial state where the operation portion is not operated, the second switching fixed contact coming into contact with the movable contact with the operation of the operation portion; extending portions that extend from at least two of the common fixed contact, the first switching fixed contact, and the second switching fixed contact; at least two terminal members that extend from the housing to the outside; and two resistors (R9, R9a, R9b, R9c, R9d) for obtaining the resistance value between the at least two terminal members, the housing including a box-shaped case that has the through portion and has an open bottom, and a holding member in which the terminal members are embedded and that covers the bottom of the case, some of the extending portions and the terminal members having fixing portions (7A, 7B) to which the resistors are soldered, wherein the holding member includes a bottom wall portion that covers the bottom of the case, and a holding wall portion provided above the bottom wall portion and holding the fixing portions, and wherein the holding wall portion is formed of a first synthetic resin material having heat resistance, characterised in that the bottom wall portion is made of a second synthetic resin material having a heat distortion temperature lower than that of the first synthetic resin material.