A flow sensor module (FSM1-3) for measuring a flow rate of a gas, comprising: a flow sensor in which a semiconductor chip is sealed with a first resin, the flow sensor including a flow sensing unit formed on a main surface of a semiconductor substrate and a diaphragm formed in a region facing the flow sensing unit of a rear surface opposite to the main surface of the semiconductor substrate, while having the flow sensing unit exposed; a flow path unit for guiding a gas to the flow sensing unit of the flow sensor; a second resin formed so as to cover a further outer side of the first resin sealing the flow sensor and further so as to expose the flow sensing unit; and a cover, wherein the flow path unit is formed so as to be joined to the flow sensing unit of the flow sensor, and is configured such that the gas is guided to the flow sensing unit of the flow sensor by passing through the flow path unit, the flow sensor comprises a pair of air current control units (FCU1, FCU2) integrally formed with the first resin, whereby the pair of air current control units clamps an exposed flow sensing unit and has a rectangular shape in the direction parallel to the gas flow for forming the flow path above the flow sensing unit, and the flow path unit is composed of a groove in the second resin in combination with the cover or is composed of a groove in the cover in combination with the second resin, characterised in that an interface region between the first resin and the flow sensing unit exposed from the first resin is in a tapered shape, and in the interface region, the tapered shape of the interface region orthogonal to the traveling direction of the gas that flows above the flow sensing unit is steeper than the tapered shape of the interface region parallel to the traveling direction of the gas. a flow sensor in which a semiconductor chip is sealed with a first resin, the flow sensor including a flow sensing unit formed on a main surface of a semiconductor substrate and a diaphragm formed in a region facing the flow sensing unit of a rear surface opposite to the main surface of the semiconductor substrate, while having the flow sensing unit exposed; a flow path unit for guiding a gas to the flow sensing unit of the flow sensor; a second resin formed so as to cover a further outer side of the first resin sealing the flow sensor and further so as to expose the flow sensing unit; and a cover, wherein the flow path unit is formed so as to be joined to the flow sensing unit of the flow sensor, and is configured such that the gas is guided to the flow sensing unit of the flow sensor by passing through the flow path unit, the flow sensor comprises a pair of air current control units (FCU1, FCU2) integrally formed with the first resin, whereby the pair of air current control units clamps an exposed flow sensing unit and has a rectangular shape in the direction parallel to the gas flow for forming the flow path above the flow sensing unit, and the flow path unit is composed of a groove in the second resin in combination with the cover or is composed of a groove in the cover in combination with the second resin, characterised in that an interface region between the first resin and the flow sensing unit exposed from the first resin is in a tapered shape, and in the interface region, the tapered shape of the interface region orthogonal to the traveling direction of the gas that flows above the flow sensing unit is steeper than the tapered shape of the interface region parallel to the traveling direction of the gas.