A curing system for curing a material which requires CO 2 as a curing reagent, comprising: a curing chamber configured to contain a material that consumes CO 2 as a reagent and that does not cure in the absence of CO 2 during curing, said curing chamber having at least one port configured to allow said material to be introduced into said curing chamber and to be removed from said curing chamber, and having at least one closure for said port, said closure configured to provide an atmospheric seal when closed so as to prevent contamination of a gas present in said curing chamber by gas outside said curing chamber; a source of carbon dioxide configured to provide gaseous carbon dioxide to said curing chamber by way of a gas entry port in said curing chamber, said source of carbon dioxide having at least one flow regulation device configured to control a flow rate of said gaseous carbon dioxide into said curing chamber; a gas flow subsystem configured to circulate said gas through said curing chamber during a time period when said material that consumes CO 2 as a reagent is being cured, wherein said gas flow subsystem includes a measurement apparatus configured to measure a gas velocity of said gas present in said curing chamber, and a variable speed blower configured to circulate said gas present in said curing chamber at a desired velocity; a temperature control subsystem configured to control a temperature of said gas within said chamber; a humidity control subsystem configured to control a humidity in said gas within said chamber; and at least one controller in communication with at least one of said source of carbon dioxide, said gas flow subsystem, said temperature control subsystem, and said humidity control subsystem, said at least one controller configured to control independently during a time period when said material that consumes CO 2 as a reagent is being cured at least a respective one of said flow rate of said gaseous carbon dioxide, said circulation of said gas through said curing chamber, said temperature of said gas, and said humidity in said gas. a curing chamber configured to contain a material that consumes CO 2 as a reagent and that does not cure in the absence of CO 2 during curing, said curing chamber having at least one port configured to allow said material to be introduced into said curing chamber and to be removed from said curing chamber, and having at least one closure for said port, said closure configured to provide an atmospheric seal when closed so as to prevent contamination of a gas present in said curing chamber by gas outside said curing chamber; a source of carbon dioxide configured to provide gaseous carbon dioxide to said curing chamber by way of a gas entry port in said curing chamber, said source of carbon dioxide having at least one flow regulation device configured to control a flow rate of said gaseous carbon dioxide into said curing chamber; a gas flow subsystem configured to circulate said gas through said curing chamber during a time period when said material that consumes CO 2 as a reagent is being cured, wherein said gas flow subsystem includes a measurement apparatus configured to measure a gas velocity of said gas present in said curing chamber, and a variable speed blower configured to circulate said gas present in said curing chamber at a desired velocity; a temperature control subsystem configured to control a temperature of said gas within said chamber; a humidity control subsystem configured to control a humidity in said gas within said chamber; and at least one controller in communication with at least one of said source of carbon dioxide, said gas flow subsystem, said temperature control subsystem, and said humidity control subsystem, said at least one controller configured to control independently during a time period when said material that consumes CO 2 as a reagent is being cured at least a respective one of said flow rate of said gaseous carbon dioxide, said circulation of said gas through said curing chamber, said temperature of said gas, and said humidity in said gas.