A system for controlling a component mounting machine, the system setting a wafer component supply device, which supplies a wafer component formed by dicing one wafer attached onto a dicing sheet, and a feeder, which supplies an electronic component, in the component mounting machine and controlling operations of the component mounting machine, the wafer component supply device, and the feeder according to a production job to suck any one of the wafer component supplied from the wafer component supply device and the electronic component (hereinafter, referred to as a "feeder component") supplied from the feeder and mount any one of the wafer component and the feeder component on a circuit substrate, wherein the component mounting machine includes a mounting head that sucks any one of the wafer component and the feeder component supplied from the wafer component supply device and the feeder and mounts any one of the wafer component and the feeder component on the circuit substrate, the system being characterized in that: the wafer component supply device includes a supply head that sucks and inverts the wafer component and a vertical movement mechanism that moves the supply head in a vertical direction integrally with a stage on which a pallet for the wafer component is set, when the wafer component is to be inverted and mounted on the circuit substrate, the wafer component present on the inverted supply head is sucked by the mounting head of the component mounting machine at a position where the supply head and the stage are moved down by the vertical movement mechanism, and when the wafer component is to be mounted on the circuit substrate without being inverted, the wafer component present on the stage is sucked by the mounting head of the component mounting machine at a position where the supply head and the stage are moved up by the vertical movement mechanism, the system comprising: control means for setting an order of an operation for inverting the wafer component and mounting the wafer component on the circuit substrate and an operation for mounting the feeder component on the circuit substrate so that the supply head and the mounting head do not interfere with each other and for performing an operation for moving down the supply head and the stage, allowing the wafer component to be sucked by the supply head, and inverting the wafer component so that the operation overlaps with an operation for sucking and mounting the feeder component by the mounting head. the wafer component supply device includes a supply head that sucks and inverts the wafer component and a vertical movement mechanism that moves the supply head in a vertical direction integrally with a stage on which a pallet for the wafer component is set, when the wafer component is to be inverted and mounted on the circuit substrate, the wafer component present on the inverted supply head is sucked by the mounting head of the component mounting machine at a position where the supply head and the stage are moved down by the vertical movement mechanism, and when the wafer component is to be mounted on the circuit substrate without being inverted, the wafer component present on the stage is sucked by the mounting head of the component mounting machine at a position where the supply head and the stage are moved up by the vertical movement mechanism, the system comprising: control means for setting an order of an operation for inverting the wafer component and mounting the wafer component on the circuit substrate and an operation for mounting the feeder component on the circuit substrate so that the supply head and the mounting head do not interfere with each other and for performing an operation for moving down the supply head and the stage, allowing the wafer component to be sucked by the supply head, and inverting the wafer component so that the operation overlaps with an operation for sucking and mounting the feeder component by the mounting head. control means for setting an order of an operation for inverting the wafer component and mounting the wafer component on the circuit substrate and an operation for mounting the feeder component on the circuit substrate so that the supply head and the mounting head do not interfere with each other and for performing an operation for moving down the supply head and the stage, allowing the wafer component to be sucked by the supply head, and inverting the wafer component so that the operation overlaps with an operation for sucking and mounting the feeder component by the mounting head.