A light emitting diode package having multiple molding resins, comprising: at least one pair of lead terminals (140, 217a, 217b, 217c, 219a, 219b, 219c); a package main body (150, 151) having a depressed portion at the center thereof and a through hole (155, 158) in the bottom thereof, the depressed portion and the through hole (155, 158) forming an opening exposing the at least one pair of lead terminals (140, 217a, 217b, 217c, 219a, 219b, 219c), the package main body (150, 151) further comprising a first and a second stepped portions (159a, 159b) formed on an inner wall of the package main body (150, 151), the package main body (150, 151) embedding at least a portion of the at least one pair of lead terminals (140, 217a, 217b, 217c, 219a, 219b, 219c); a light emitting diode die (160, 240) mounted in the opening so that the light emitting diode die (160, 240) is positioned below the first and second stepped portions (159a, 159b), the light emitting diode die (160, 240) being electrically connected to the at least one pair of lead terminals (140, 217a, 217b, 217c, 219a, 219b, 219c); a first molding resin covering the light emitting diode die (160, 240), extending to the inner wall below the first stepped portion; a second molding resin covering the first molding resin, extending to the inner wall, the second molding resin having higher hardness than the first molding resin; a heat sink (153, 220) coupled to the bottom of the package main body (150, 151) and partially exposed through the opening, wherein the light emitting diode die (160, 240) is mounted on a top surface of the heat sink (153, 220), and a lens (166, 250), mounted on top of the second molding resin and fixed in the second stepped portion. at least one pair of lead terminals (140, 217a, 217b, 217c, 219a, 219b, 219c); a package main body (150, 151) having a depressed portion at the center thereof and a through hole (155, 158) in the bottom thereof, the depressed portion and the through hole (155, 158) forming an opening exposing the at least one pair of lead terminals (140, 217a, 217b, 217c, 219a, 219b, 219c), the package main body (150, 151) further comprising a first and a second stepped portions (159a, 159b) formed on an inner wall of the package main body (150, 151), the package main body (150, 151) embedding at least a portion of the at least one pair of lead terminals (140, 217a, 217b, 217c, 219a, 219b, 219c); a light emitting diode die (160, 240) mounted in the opening so that the light emitting diode die (160, 240) is positioned below the first and second stepped portions (159a, 159b), the light emitting diode die (160, 240) being electrically connected to the at least one pair of lead terminals (140, 217a, 217b, 217c, 219a, 219b, 219c); a first molding resin covering the light emitting diode die (160, 240), extending to the inner wall below the first stepped portion; a second molding resin covering the first molding resin, extending to the inner wall, the second molding resin having higher hardness than the first molding resin; a heat sink (153, 220) coupled to the bottom of the package main body (150, 151) and partially exposed through the opening, wherein the light emitting diode die (160, 240) is mounted on a top surface of the heat sink (153, 220), and a lens (166, 250), mounted on top of the second molding resin and fixed in the second stepped portion.