An electronic device housing comprising a fiber reinforcing member a and a fiber reinforcing member b, the fiber reinforcing member a containing a thermoplastic resin a1 and a fiber a2, the fiber a2 being in the form of discontinuous fibers, characterized in that the fiber reinforcing member b containing a thermosetting resin b1 (2,6) and a fiber b2, wherein the fiber b2 is a non-electrically-conductive fiber, the fiber b2 being in the form of continuous fibers, the projected area of the fiber reinforcing member a accounting for 60% or more and 95% or less of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face, and the thermoplastic resin a1 meeting requirements (i) and/or (ii) given below: (i) the resin a1 is a thermoplastic resin having a melting point of more than 265°C, and (ii) the resin a1 is a thermoplastic resin having a water absorption rate, of 0.4% or less; wherein the melting point is determined by heating a specimen in an inert gas atmosphere in a differential scanning calorimeter at a heating rate of 20°C/min until it is melted, and then cooling to 30°C at a cooling rate of 20°C/min; followed by heated again at a heating rate of 20°C/min; whereby the endothermic peak temperature that appears in this step is adopted as the melting point; and wherein the water absorption rate is determined according to the 23°C, 24-hour water immersion test carried out by Method A specified in JIS K7209. the fiber reinforcing member a containing a thermoplastic resin a1 and a fiber a2, the fiber a2 being in the form of discontinuous fibers, characterized in that the fiber reinforcing member b containing a thermosetting resin b1 (2,6) and a fiber b2, wherein the fiber b2 is a non-electrically-conductive fiber, the fiber b2 being in the form of continuous fibers, the projected area of the fiber reinforcing member a accounting for 60% or more and 95% or less of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face, and the thermoplastic resin a1 meeting requirements (i) and/or (ii) given below: (i) the resin a1 is a thermoplastic resin having a melting point of more than 265°C, and (ii) the resin a1 is a thermoplastic resin having a water absorption rate, of 0.4% or less; wherein the melting point is determined by heating a specimen in an inert gas atmosphere in a differential scanning calorimeter at a heating rate of 20°C/min until it is melted, and then cooling to 30°C at a cooling rate of 20°C/min; followed by heated again at a heating rate of 20°C/min; whereby the endothermic peak temperature that appears in this step is adopted as the melting point; and wherein the water absorption rate is determined according to the 23°C, 24-hour water immersion test carried out by Method A specified in JIS K7209. (i) the resin a1 is a thermoplastic resin having a melting point of more than 265°C, and (ii) the resin a1 is a thermoplastic resin having a water absorption rate, of 0.4% or less; wherein the melting point is determined by heating a specimen in an inert gas atmosphere in a differential scanning calorimeter at a heating rate of 20°C/min until it is melted, and then cooling to 30°C at a cooling rate of 20°C/min; followed by heated again at a heating rate of 20°C/min; whereby the endothermic peak temperature that appears in this step is adopted as the melting point; and wherein the water absorption rate is determined according to the 23°C, 24-hour water immersion test carried out by Method A specified in JIS K7209. wherein the melting point is determined by heating a specimen in an inert gas atmosphere in a differential scanning calorimeter at a heating rate of 20°C/min until it is melted, and then cooling to 30°C at a cooling rate of 20°C/min; followed by heated again at a heating rate of 20°C/min; whereby the endothermic peak temperature that appears in this step is adopted as the melting point; and wherein the water absorption rate is determined according to the 23°C, 24-hour water immersion test carried out by Method A specified in JIS K7209.