A system, comprising: a photonic chip, comprising: a first plurality of waveguides in the photonic chip having respective first ends optically coupled with an optical component of the photonic chip and respective second ends optically coupled with a first plurality of optical interfaces in the photonic chip, and a first plurality of alignment features disposed in a dielectric layer of the photonic chip, a channel positioned at the first plurality of optical interfaces where the first plurality of waveguides abut the first plurality of alignment features; and a Fiber Array Unit, FAU, mated with the photonic chip, comprising: a second plurality of waveguides having respective first ends optically coupled with a second plurality of optical interfaces in the FAU such that the second ends of the first plurality of waveguides are optically coupled with the first ends of the second plurality of waveguides, and wherein the second plurality of waveguides have respective second ends optically coupled with a third plurality of optical interfaces in the FAU, a second plurality of alignment features mated with the first plurality of alignment features to align the first ends of the first plurality of waveguides with the second plurality of waveguides, and a plurality of optical fibers disposed within a plurality of grooves, wherein the plurality of grooves align the plurality of optical fibers to the third plurality of optical interfaces and the second ends of the second plurality of waveguides; wherein the first plurality of alignment features comprises a plurality of slots, and wherein the second plurality of alignment features comprises a plurality of teeth having dimensions that correspond to the plurality of slots, and wherein the second plurality of optical interfaces are positioned at the end of the plurality of teeth such that each of the second plurality of waveguides corresponds to a respective one of the teeth and extends through the respective teeth; and wherein the channel provides a recess for excess epoxy for attaching the photonic chip to the FAU and for filling gaps between the first plurality of optical interfaces and the second plurality of optical interfaces. a first plurality of waveguides in the photonic chip having respective first ends optically coupled with an optical component of the photonic chip and respective second ends optically coupled with a first plurality of optical interfaces in the photonic chip, and a first plurality of alignment features disposed in a dielectric layer of the photonic chip, a channel positioned at the first plurality of optical interfaces where the first plurality of waveguides abut the first plurality of alignment features; and a second plurality of waveguides having respective first ends optically coupled with a second plurality of optical interfaces in the FAU such that the second ends of the first plurality of waveguides are optically coupled with the first ends of the second plurality of waveguides, and wherein the second plurality of waveguides have respective second ends optically coupled with a third plurality of optical interfaces in the FAU, a second plurality of alignment features mated with the first plurality of alignment features to align the first ends of the first plurality of waveguides with the second plurality of waveguides, and a plurality of optical fibers disposed within a plurality of grooves, wherein the plurality of grooves align the plurality of optical fibers to the third plurality of optical interfaces and the second ends of the second plurality of waveguides; wherein the first plurality of alignment features comprises a plurality of slots, and wherein the second plurality of alignment features comprises a plurality of teeth having dimensions that correspond to the plurality of slots, and wherein the second plurality of optical interfaces are positioned at the end of the plurality of teeth such that each of the second plurality of waveguides corresponds to a respective one of the teeth and extends through the respective teeth; and wherein the channel provides a recess for excess epoxy for attaching the photonic chip to the FAU and for filling gaps between the first plurality of optical interfaces and the second plurality of optical interfaces.