A capacitor, comprising: a first electrode and a second electrode respectively configured to connect an external circuit; at least one support, the at least one support being a wall-shaped structure; a laminated structure comprising at least one dielectric layer (151, 153, 155) and at least one conductive layer (152, 154, 156); the at least one dielectric layer (151, 153, 155) and the at least one conductive layer (152, 154, 156) covering the at least one support, and the at least one dielectric layer (151, 153, 155)and the at least one conductive layer (152, 154, 156) forming a structure that a dielectric layer and a conductive layer are adjacent to each other; and an interconnection structure configured to electrically connect the first electrode to the at least one support or a first conductive layer of the at least one conductive layer (152, 154, 156), and to electrically connect the second electrode to a second conductive layer of the at least one conductive layer, wherein the second conductive layer is connected to the at least one support or the first conductive layer which is electrically connected to the first electrode, and the second conductive layer and the support or the first conductive layer are separated by a dielectric layer of the at least one dielectric layer; and a base layer, the base layer and the at least one support forming at least one groove structure, the base layer serving as a bottom of the at least one groove structure, the at least one support serving as a side wall of the at least one groove structure, and the laminated structure covering the at least one groove structure; the base layer is provided with at least one opening, the at least one support is provided in the at least one opening, and a lower surface of the base layer and a lower surface of the at least one support are located in a same plane. a first electrode and a second electrode respectively configured to connect an external circuit; at least one support, the at least one support being a wall-shaped structure; a laminated structure comprising at least one dielectric layer (151, 153, 155) and at least one conductive layer (152, 154, 156); the at least one dielectric layer (151, 153, 155) and the at least one conductive layer (152, 154, 156) covering the at least one support, and the at least one dielectric layer (151, 153, 155)and the at least one conductive layer (152, 154, 156) forming a structure that a dielectric layer and a conductive layer are adjacent to each other; and an interconnection structure configured to electrically connect the first electrode to the at least one support or a first conductive layer of the at least one conductive layer (152, 154, 156), and to electrically connect the second electrode to a second conductive layer of the at least one conductive layer, wherein the second conductive layer is connected to the at least one support or the first conductive layer which is electrically connected to the first electrode, and the second conductive layer and the support or the first conductive layer are separated by a dielectric layer of the at least one dielectric layer; and a base layer, the base layer and the at least one support forming at least one groove structure, the base layer serving as a bottom of the at least one groove structure, the at least one support serving as a side wall of the at least one groove structure, and the laminated structure covering the at least one groove structure; the base layer is provided with at least one opening, the at least one support is provided in the at least one opening, and a lower surface of the base layer and a lower surface of the at least one support are located in a same plane.