A heat sink, comprising: a heat dissipation substrate, a connector, and a fastener, wherein the heat dissipation substrate is configured to be suitable to dissipate heat for a packaged chip using multi-chip package technology located on a circuit board, and the heat dissipation substrate is suitable to be located on a surface that is of the packaged chip and that is opposite to the circuit board; and the heat dissipation substrate comprises a first heat dissipation substrate and a second heat dissipation substrate, the first heat dissipation substrate and the second heat dissipation substrate each have a heat conduction surface that is suitable to conduct heat with a chip in the packaged chip, different heat conduction surfaces are suitable to correspond to different chips in the packaged chip, a first end of the connector is fastened to the first heat dissipation substrate, a second end of the connector suspends on an outer side of the second heat dissipation substrate, and the fastener presses against an outer side of the first heat dissipation substrate, to prevent the first heat dissipation substrate from moving far away from the second heat dissipation substrate; wherein the heat conduction surfaces of the first heat dissipation substrate and the second heat dissipation substrate are both in a same plane; the heat sink is characterized in that: a heat conduction rate of a material that the connector is made of is less than a heat conduction rate of a material that the heat dissipation substrate is made of; the material that the connector is made of is stainless steel or zinc alloy. a heat dissipation substrate, a connector, and a fastener, wherein the heat dissipation substrate is configured to be suitable to dissipate heat for a packaged chip using multi-chip package technology located on a circuit board, and the heat dissipation substrate is suitable to be located on a surface that is of the packaged chip and that is opposite to the circuit board; and the heat dissipation substrate comprises a first heat dissipation substrate and a second heat dissipation substrate, the first heat dissipation substrate and the second heat dissipation substrate each have a heat conduction surface that is suitable to conduct heat with a chip in the packaged chip, different heat conduction surfaces are suitable to correspond to different chips in the packaged chip, a first end of the connector is fastened to the first heat dissipation substrate, a second end of the connector suspends on an outer side of the second heat dissipation substrate, and the fastener presses against an outer side of the first heat dissipation substrate, to prevent the first heat dissipation substrate from moving far away from the second heat dissipation substrate; wherein the heat conduction surfaces of the first heat dissipation substrate and the second heat dissipation substrate are both in a same plane; the heat sink is characterized in that: a heat conduction rate of a material that the connector is made of is less than a heat conduction rate of a material that the heat dissipation substrate is made of; the material that the connector is made of is stainless steel or zinc alloy.