A method for manufacturing in series optical grade polishing tools each including a base configured to be coupled to a polishing machine, a polishing pad configured to be pressed against a surface to be worked and an elastically compressible body attached to the base and attached to polishing pad with said body sandwiched between the base and the polishing pad; said method including for each said tool the step of attaching said body to said base and the step of attaching said body to said polishing pad; characterized in that at least one of said step of attaching said body to said base and said step of attaching said body to said polishing pad includes a step of applying glue in which glue is applied onto one surface of one component and then includes a step of pressing in which said one surface of one component and one surface of another component are applied on each other, said one component and said another component being one of: said base and said body, said body and said base, said body and said polishing pad, and said polishing pad and said body; said method further including: - the step of providing a supporting device including a support (23A-23D, 22A-22D) configured for receiving said one component and another support (23A-23D, 22A-22D) configured for receiving said another component; - the step of providing a pad printing machine having a reservoir, a cliché, a transfer pad (38A, 39A, 38B, 39B) and another transfer pad (38A, 39A, 38B, 39B); - the step of filling said reservoir with liquid glue; said step of applying glue including: - placing said one component into said support; - placing said another component into said another support; and - carrying out with said machine the following sequence of steps: driving said reservoir and cliché relative to one another from a rest position, in which the reservoir is over an etched area (42A, 43A, 42B, 43B) and over another etched area (42A, 43A, 42B, 43B) of the cliché, to a working position, in which the reservoir is away from the etched area and away from the another etched area; then driving simultaneously the transfer pad to a taking position in which the distal surface of the transfer pad is in contact with the etched area of the cliché and the another transfer pad to a taking position in which the distal surface of the another transfer pad is in contact with the another etched area of the cliché; and then driving simultaneously the transfer pad from the taking position to an applying position in which the distal surface of the transfer pad is in contact with said one surface of said one component and the another transfer pad from the taking position to an applying position in which the distal surface of the another transfer pad is in contact with said one surface of said another component, whereby said glue is applied simultaneously to said one surface of said one component and to said one surface of said another component. - the step of providing a supporting device including a support (23A-23D, 22A-22D) configured for receiving said one component and another support (23A-23D, 22A-22D) configured for receiving said another component; - the step of providing a pad printing machine having a reservoir, a cliché, a transfer pad (38A, 39A, 38B, 39B) and another transfer pad (38A, 39A, 38B, 39B); - the step of filling said reservoir with liquid glue; - placing said one component into said support; - placing said another component into said another support; and - carrying out with said machine the following sequence of steps: driving said reservoir and cliché relative to one another from a rest position, in which the reservoir is over an etched area (42A, 43A, 42B, 43B) and over another etched area (42A, 43A, 42B, 43B) of the cliché, to a working position, in which the reservoir is away from the etched area and away from the another etched area; then driving simultaneously the transfer pad to a taking position in which the distal surface of the transfer pad is in contact with the etched area of the cliché and the another transfer pad to a taking position in which the distal surface of the another transfer pad is in contact with the another etched area of the cliché; and then driving simultaneously the transfer pad from the taking position to an applying position in which the distal surface of the transfer pad is in contact with said one surface of said one component and the another transfer pad from the taking position to an applying position in which the distal surface of the another transfer pad is in contact with said one surface of said another component, whereby said glue is applied simultaneously to said one surface of said one component and to said one surface of said another component.