A plated steel comprising a plated layer on a surface of a steel, wherein an average chemical composition of the plated layer is formed of, by mass%, 50.00% or more of Zn, more than 10.00% and less than 40.00% of Al, more than 5.00% and less than 12.50% of Mg, 0% or more and 3.00% or less of Sn, 0% or more and 1.00% or less of Bi, 0% or more and 1.00% or less of In, 0.03% or more and 2.00% or less of Ca, 0% or more and 0.50% or less of Y, 0% or more and 0.50% or less of La, 0% or more and 0.50% or less of Ce, 0% or more and 2.50% or less of Si, 0% or more and 0.25% or less of Cr, 0% or more and 0.25% or less of Ti, 0% or more and 0.25% or less of Ni, 0% or more and 0.25% or less of Co, 0% or more and 0.25% or less of V, 0% or more and 0.25% or less of Nb, 0% or more and 0.25% or less of Cu, 0% or more and 0.25% or less of Mn, more than 0% and 5.00% or less of Fe, 0% or more and 0.50% or less of Sr, 0% or more and 0.50% or less of Sb, 0% or more and 0.50% or less of Pb, 0% or more and 0.50% or less of B, 0% or more and 0.50% or less of Li, 0% or more and 0.50% or less of Zr, 0% or more and 0.50% or less of Mo, 0% or more and 0.50% or less of W, 0% or more and 0.50% or less of Ag, 0% or more and 0.50% or less of P, and impurities, the following Expression 1 and Expression 2 are satisfied, and Expression 3 and Expression 6 are further satisfied in an X-ray diffraction pattern of a surface of the plated layer measured using Cu-Kα rays under a condition that an X-ray output is 40 kV and 150 mA: 0 ≤ Cr + Ti + Ni + Co + V + Nb + Cu + Mn ≤ 0.25 0 ≤ Sr + Sb + Pb + B + Li + Zr + Mo + W + Ag + P ≤ 0.50 I MgZn 2 41.31 ° / I ∑ MgZn 2 ≤ 0.265 0.150 ≤ I MgZn 2 20.79 ° + I MgZn 2 42.24 ° / I ∑ MgZn 2 wherein, this is provided that the element symbols in Expression 1 and Expression 2 each indicate an amount, in mass%, of each element by mass% in the plated layer, and 0 is substituted when the element is not contained, and IΣ(MgZn 2), I(MgZn 2 (41.31°)), I(MgZn 2 (20.79°)), and I(MgZn 2 (42.24°)) in Expression 3 and Expression 6 are as follows, and IΣ(Mg 2 Sn) is 0 when the plated layer does not contain Sn: IΣ(MgZn 2): A sum of intensities of diffraction peaks of a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, and a plane of MgZn 2; I(MgZn 2 (41.31°)): An intensity of the diffraction peak of the plane of MgZn 2; I(MgZn 2 (20.79°)): An intensity of the diffraction peak of the plane of MgZn 2; I(MgZn 2 (42.24°)): An intensity of the diffraction peak of the plane of MgZn 2; and wherein I(MgZn 2 (41.31°)), IΣ(MgZn 2), I(MgZn 2 (20.79°)), and I(MgZn 2 (42.24°)) are measured as described in the description. an average chemical composition of the plated layer is formed of, by mass%, 50.00% or more of Zn, more than 10.00% and less than 40.00% of Al, more than 5.00% and less than 12.50% of Mg, 0% or more and 3.00% or less of Sn, 0% or more and 1.00% or less of Bi, 0% or more and 1.00% or less of In, 0.03% or more and 2.00% or less of Ca, 0% or more and 0.50% or less of Y, 0% or more and 0.50% or less of La, 0% or more and 0.50% or less of Ce, 0% or more and 2.50% or less of Si, 0% or more and 0.25% or less of Cr, 0% or more and 0.25% or less of Ti, 0% or more and 0.25% or less of Ni, 0% or more and 0.25% or less of Co, 0% or more and 0.25% or less of V, 0% or more and 0.25% or less of Nb, 0% or more and 0.25% or less of Cu, 0% or more and 0.25% or less of Mn, more than 0% and 5.00% or less of Fe, 0% or more and 0.50% or less of Sr, 0% or more and 0.50% or less of Sb, 0% or more and 0.50% or less of Pb, 0% or more and 0.50% or less of B, 0% or more and 0.50% or less of Li, 0% or more and 0.50% or less of Zr, 0% or more and 0.50% or less of Mo, 0% or more and 0.50% or less of W, 0% or more and 0.50% or less of Ag, 0% or more and 0.50% or less of P, and impurities, the following Expression 1 and Expression 2 are satisfied, and Expression 3 and Expression 6 are further satisfied in an X-ray diffraction pattern of a surface of the plated layer measured using Cu-Kα rays under a condition that an X-ray output is 40 kV and 150 mA: 0 ≤ Cr + Ti + Ni + Co + V + Nb + Cu + Mn ≤ 0.25 0 ≤ Sr + Sb + Pb + B + Li + Zr + Mo + W + Ag + P ≤ 0.50 I MgZn 2 41.31 ° / I ∑ MgZn 2 ≤ 0.265 0.150 ≤ I MgZn 2 20.79 ° + I MgZn 2 42.24 ° / I ∑ MgZn 2 wherein, this is provided that the element symbols in Expression 1 and Expression 2 each indicate an amount, in mass%, of each element by mass% in the plated layer, and 0 is substituted when the element is not contained, and IΣ(MgZn 2), I(MgZn 2 (41.31°)), I(MgZn 2 (20.79°)), and I(MgZn 2 (42.24°)) in Expression 3 and Expression 6 are as follows, and IΣ(Mg 2 Sn) is 0 when the plated layer does not contain Sn: IΣ(MgZn 2): A sum of intensities of diffraction peaks of a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, a plane, and a plane of MgZn 2; I(MgZn 2 (41.31°)): An intensity of the diffraction peak of the plane of MgZn 2; I(MgZn 2 (20.79°)): An intensity of the diffraction peak of the plane of MgZn 2; I(MgZn 2 (42.24°)): An intensity of the diffraction peak of the plane of MgZn 2; and wherein I(MgZn 2 (41.31°)), IΣ(MgZn 2), I(MgZn 2 (20.79°)), and I(MgZn 2 (42.24°)) are measured as described in the description.