Use of a process for the manufacture of encapsulated or embedded electronic devices having a multilayer silicone structure, said multilayer silicone structure is prepared by a process, comprising the steps of: a) Applying a first curable silicone composition 1) to the surface of a first substrate, wherein said first silicone composition 1) comprises: 1-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule; 1-B) one or more oxidic fillers, said oxidic fillers being selected from silicas, optionally hydrophobized by reaction with one or more hydrophobing agents 1-C); 1-D) one or more a metal catalysts; 1-E) one or more polyorganosiloxanes having at least two SiH groups per molecule; wherein (i) the molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) is from > 1 to 4; (ii) the molar ratio of the difference: (molar amount of all SiH-groups in the composition 1) - molar amount of all alkenyl groups in the composition 1)) to the molar amount of the oxidic filler 1-B) is < 0.035; b) optionally curing said first curable silicone composition 1) on the surface of said first substrate; c) applying a second curable silicone composition 2) to the surface of said first silicone composition 1), wherein said second curable silicone composition 2) comprises: 2-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule; 2-B) optionally one or more oxidic fillers, said oxidic fillers being selected from silicas, optionally hydrophobized by reaction with one or more hydrophobing agents 2-C); 2-D) one or more a metal catalysts; 2-E) one or more polyorganosiloxanes having at least two SiH groups per molecule; wherein the molar ratio of all SiH groups in the composition 2) to all alkenyl groups in the composition 2) is from > 1 to 10; d) curing said second curable silicone composition 2), optionally together with said first curable silicone composition 1). a) Applying a first curable silicone composition 1) to the surface of a first substrate, wherein said first silicone composition 1) comprises: 1-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule; 1-B) one or more oxidic fillers, said oxidic fillers being selected from silicas, optionally hydrophobized by reaction with one or more hydrophobing agents 1-C); 1-D) one or more a metal catalysts; 1-E) one or more polyorganosiloxanes having at least two SiH groups per molecule; wherein (i) the molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) is from > 1 to 4; (ii) the molar ratio of the difference: (molar amount of all SiH-groups in the composition 1) - molar amount of all alkenyl groups in the composition 1)) to the molar amount of the oxidic filler 1-B) is < 0.035; 1-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule; 1-B) one or more oxidic fillers, said oxidic fillers being selected from silicas, optionally hydrophobized by reaction with one or more hydrophobing agents 1-C); 1-D) one or more a metal catalysts; 1-E) one or more polyorganosiloxanes having at least two SiH groups per molecule; wherein (i) the molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) is from > 1 to 4; (ii) the molar ratio of the difference: (molar amount of all SiH-groups in the composition 1) - molar amount of all alkenyl groups in the composition 1)) to the molar amount of the oxidic filler 1-B) is < 0.035; (i) the molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) is from > 1 to 4; (ii) the molar ratio of the difference: (molar amount of all SiH-groups in the composition 1) - molar amount of all alkenyl groups in the composition 1)) to the molar amount of the oxidic filler 1-B) is < 0.035; (molar amount of all SiH-groups in the composition 1) - molar amount of all alkenyl groups in the composition 1)) to the molar amount of the oxidic filler 1-B) is < 0.035; b) optionally curing said first curable silicone composition 1) on the surface of said first substrate; c) applying a second curable silicone composition 2) to the surface of said first silicone composition 1), wherein said second curable silicone composition 2) comprises: 2-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule; 2-B) optionally one or more oxidic fillers, said oxidic fillers being selected from silicas, optionally hydrophobized by reaction with one or more hydrophobing agents 2-C); 2-D) one or more a metal catalysts; 2-E) one or more polyorganosiloxanes having at least two SiH groups per molecule; wherein the molar ratio of all SiH groups in the composition 2) to all alkenyl groups in the composition 2) is from > 1 to 10; 2-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule; 2-B) optionally one or more oxidic fillers, said oxidic fillers being selected from silicas, optionally hydrophobized by reaction with one or more hydrophobing agents 2-C); 2-D) one or more a metal catalysts; 2-E) one or more polyorganosiloxanes having at least two SiH groups per molecule; wherein the molar ratio of all SiH groups in the composition 2) to all alkenyl groups in the composition 2) is from > 1 to 10; d) curing said second curable silicone composition 2), optionally together with said first curable silicone composition 1).