Laser cutting apparatus for shielded leads, in particular for laser cutting of shielding wires and/or shielding foils at shielded leads, comprising the following features: - provision is made of at least one laser device which is embodied to produce a laser beam; - provision is made of a ring mirror device having a circumferential mirrored wall, which delimits a cutting chamber and through which a central axis passes; - a shielded lead to be cut by the laser beam is disposable along the central axis in the cutting chamber, - the circumferential mirrored wall is embodied to reflect the laser beam in the direction of the shielded lead, wherein the circumferential mirrored wall extends through 360° about the central axis; - provision is moreover made of a laser beam deflection apparatus which is embodied to guide the laser beam in such a way that the laser beam enters into the cutting chamber through a laser entry opening and strikes the circumferential mirrored wall; - the laser beam deflection apparatus is further embodied to guide the laser beam in such a way that the latter moves on a trajectory along the circumferential mirrored wall through 360° about the central axis, as a result of which the shielded lead, which is disposable in the region of the central axis within the cutting chamber, is cuttable along the entire circumference thereof by the laser beam which is reflected at the circumferential mirrored wall; characterized by the following features: - provision is made of a telescope device which is disposed in the beam path of the laser beam; - provision is made of a control device; - the control device is embodied to drive the telescope device and the laser device; - the control device is embodied to drive the telescope device in such a way that the focusing of the laser beam is altered in such a way that the latter: a) is focusable on the shielded lead with a reduced diameter; and b) is focusable on the shielded lead with an increased diameter. - provision is made of at least one laser device which is embodied to produce a laser beam; - provision is made of a ring mirror device having a circumferential mirrored wall, which delimits a cutting chamber and through which a central axis passes; - a shielded lead to be cut by the laser beam is disposable along the central axis in the cutting chamber, - the circumferential mirrored wall is embodied to reflect the laser beam in the direction of the shielded lead, wherein the circumferential mirrored wall extends through 360° about the central axis; - provision is moreover made of a laser beam deflection apparatus which is embodied to guide the laser beam in such a way that the laser beam enters into the cutting chamber through a laser entry opening and strikes the circumferential mirrored wall; - the laser beam deflection apparatus is further embodied to guide the laser beam in such a way that the latter moves on a trajectory along the circumferential mirrored wall through 360° about the central axis, as a result of which the shielded lead, which is disposable in the region of the central axis within the cutting chamber, is cuttable along the entire circumference thereof by the laser beam which is reflected at the circumferential mirrored wall; - provision is made of a telescope device which is disposed in the beam path of the laser beam; - provision is made of a control device; - the control device is embodied to drive the telescope device and the laser device; - the control device is embodied to drive the telescope device in such a way that the focusing of the laser beam is altered in such a way that the latter: a) is focusable on the shielded lead with a reduced diameter; and b) is focusable on the shielded lead with an increased diameter. a) is focusable on the shielded lead with a reduced diameter; and b) is focusable on the shielded lead with an increased diameter.