A dicing method for wafer-level packaging, comprising: - providing a semiconductor substrate with integrated circuit regions (2, 20) including integrated circuit components and a wiring layer having structured and interconnected metal layers embedded in intermetal dielectric, - providing the integrated circuit regions (2, 20) with contact pads in or on the wiring layer, - forming trenches in the substrate between the integrated circuit regions (2, 20), - applying a photosensitive polyimide layer as an entire layer above the integrated circuit regions (2, 20) and above the trenches, the polyimide layer being applied as a dry film spanning the trenches, and structuring said photosensitive polyimide layer to uncover the contact pads, - providing the polyimide layer with breaking delimitations near the trenches, using photolithography, the breaking delimitations being formed by gaps in the polyimide layer, - applying an electrically conductive layer on the polyimide layer, sections of the electrically conductive layer contacting the contact pads, - removing the electrically conductive layer from regions including areas above the trenches and from the gaps of the polyimide layer that form the breaking delimitations, - applying a cover layer on the electrically conductive layer and structuring said cover layer to have areas of the electrically conductive layer not being covered by the cover layer, - applying underbump metallizations and bump contacts on the uncovered areas of the electrically conductive layer, - applying a tape layer on the cover layer above the integrated circuit regions (2, 20) and above the trenches, - removing a layer portion of the substrate from a substrate side opposite the tape layer, until the trenches are opened and dicing of the substrate is thus effected, - applying a flexible dicing foil to the substrate side opposite the tape layer, - removing the tape layer, and - severing the polyimide layer by breaking at a section of the polyimide layer that is present above the trenches between the gaps forming the breaking delimitations. - providing a semiconductor substrate with integrated circuit regions (2, 20) including integrated circuit components and a wiring layer having structured and interconnected metal layers embedded in intermetal dielectric, - providing the integrated circuit regions (2, 20) with contact pads in or on the wiring layer, - forming trenches in the substrate between the integrated circuit regions (2, 20), - applying a photosensitive polyimide layer as an entire layer above the integrated circuit regions (2, 20) and above the trenches, the polyimide layer being applied as a dry film spanning the trenches, and structuring said photosensitive polyimide layer to uncover the contact pads, - providing the polyimide layer with breaking delimitations near the trenches, using photolithography, the breaking delimitations being formed by gaps in the polyimide layer, - applying an electrically conductive layer on the polyimide layer, sections of the electrically conductive layer contacting the contact pads, - removing the electrically conductive layer from regions including areas above the trenches and from the gaps of the polyimide layer that form the breaking delimitations, - applying a cover layer on the electrically conductive layer and structuring said cover layer to have areas of the electrically conductive layer not being covered by the cover layer, - applying underbump metallizations and bump contacts on the uncovered areas of the electrically conductive layer, - applying a tape layer on the cover layer above the integrated circuit regions (2, 20) and above the trenches, - removing a layer portion of the substrate from a substrate side opposite the tape layer, until the trenches are opened and dicing of the substrate is thus effected, - applying a flexible dicing foil to the substrate side opposite the tape layer, - removing the tape layer, and - severing the polyimide layer by breaking at a section of the polyimide layer that is present above the trenches between the gaps forming the breaking delimitations.