A light emission package adapted for use with at least one solid state light emitter (12A-12F), the package comprising: a leadframe comprising a plurality of electrical leads (51, 61); a heatsink (70, 170, 270) comprising an upper surface (71, 171, 271), a lower surface (72, 172, 272), and a central protrusion (72A, 172A, 272A) extending from the lower surface (72, 172, 272); a body structure encasing at least a portion of the leadframe, the body structure comprising at least one exterior side wall (15, 16); and at least one solid state light emitter (12A-12F) attached to the upper surface (71, 171, 271) of the heatsink (70, 170, 270); wherein the body structure retains the heatsink (70, 170, 270); wherein the heatsink (70, 170, 270) is electrically isolated from each of the plurality of electrical leads (51, 61); wherein a first electrical lead of the plurality of electrical leads (51, 61) comprises a plurality of first electrical lead segments (51A, 51B) extending through the at least one exterior side wall from a center portion of the body structure, wherein each of the plurality of first electrical lead segments (51A, 51B) are separated from each other along the at least one exterior side wall by a at least one first aperture, and wherein at least a portion of the at least one first aperture is disposed outside the at least one exterior wall; wherein the first electrical lead comprises a bent portion that is substantially perpendicular to a lower face of the body structure; wherein the at least one exterior side wall defines at least one recess arranged to receive the bent portion of the first electrical lead, the at least one recess having a depth, relative to the at least one exterior side wall in which the at least one recess is formed, of an average thickness of the plurality of electrical leads (51, 61); wherein the first electrical lead comprises a lead tab portion extending away from a center of the package and from the at least one exterior side wall; and wherein the lower surface (72, 172, 272) and the central protrusion (72A, 172A, 272A) of the heatsink (70, 170, 270) extend from a lower recess of the body structure. a leadframe comprising a plurality of electrical leads (51, 61); a heatsink (70, 170, 270) comprising an upper surface (71, 171, 271), a lower surface (72, 172, 272), and a central protrusion (72A, 172A, 272A) extending from the lower surface (72, 172, 272); a body structure encasing at least a portion of the leadframe, the body structure comprising at least one exterior side wall (15, 16); and at least one solid state light emitter (12A-12F) attached to the upper surface (71, 171, 271) of the heatsink (70, 170, 270); wherein the body structure retains the heatsink (70, 170, 270); wherein the heatsink (70, 170, 270) is electrically isolated from each of the plurality of electrical leads (51, 61); wherein a first electrical lead of the plurality of electrical leads (51, 61) comprises a plurality of first electrical lead segments (51A, 51B) extending through the at least one exterior side wall from a center portion of the body structure, wherein each of the plurality of first electrical lead segments (51A, 51B) are separated from each other along the at least one exterior side wall by a at least one first aperture, and wherein at least a portion of the at least one first aperture is disposed outside the at least one exterior wall; wherein the first electrical lead comprises a bent portion that is substantially perpendicular to a lower face of the body structure; wherein the at least one exterior side wall defines at least one recess arranged to receive the bent portion of the first electrical lead, the at least one recess having a depth, relative to the at least one exterior side wall in which the at least one recess is formed, of an average thickness of the plurality of electrical leads (51, 61); wherein the first electrical lead comprises a lead tab portion extending away from a center of the package and from the at least one exterior side wall; and wherein the lower surface (72, 172, 272) and the central protrusion (72A, 172A, 272A) of the heatsink (70, 170, 270) extend from a lower recess of the body structure.