A computing system comprising a two-sided assembly including a symmetric arrangement of substrates, metal preforms, heat sinks and spring boards, the computing system further comprising: a first substrate having a first surface with first plurality of superconducting components attached to the first surface; a second substrate having a second surface with a second plurality of superconducting components attached to the second surface, wherein the second substrate is symmetrically arranged to the first substrate; a first heat sink having a first surface and a first plurality of recesses formed in the first surface such that each of the first plurality of recesses is configured to provide a space to accommodate at least a portion of a first superconducting component from among the first plurality of superconducting components; a second heat sink having a second surface and a second plurality of recesses formed in the second surface such that each of the second plurality of recesses is configured to provide a space to accommodate at least a portion of a second superconducting component from among the second plurality of superconducting components, wherein the second heat sink is symmetrically arranged to the first heat sink; a first metal preform bonded to at least a first portion of the first heat sink, wherein the first metal preform is configured to conform to the at least the portion of the first superconducting component when the first superconducting component is pressed against the first metal preform and hold shape even after a first pressure on the first metal preform is relieved; a second metal preform bonded to at least a second portion of the second heat sink, wherein the second metal preform is configured to conform to the at least the portion of the second superconducting component when the second superconducting component is pressed against the second metal preform and hold shape even after a second pressure on the second metal preform is relieved, wherein the second metal preform is symmetrically arranged to the first metal preform; a first spring board configured to apply a first clamping force on at least a first portion of the first metal preform in direct contact with a first surface of the first superconducting component; and a second spring board configured to apply a second clamping force on at least a second portion of the second metal preform in direct contact with a second surface of the second superconducting component, wherein the second spring board is symmetrically arranged to the first spring board. a first substrate having a first surface with first plurality of superconducting components attached to the first surface; a second substrate having a second surface with a second plurality of superconducting components attached to the second surface, wherein the second substrate is symmetrically arranged to the first substrate; a first heat sink having a first surface and a first plurality of recesses formed in the first surface such that each of the first plurality of recesses is configured to provide a space to accommodate at least a portion of a first superconducting component from among the first plurality of superconducting components; a second heat sink having a second surface and a second plurality of recesses formed in the second surface such that each of the second plurality of recesses is configured to provide a space to accommodate at least a portion of a second superconducting component from among the second plurality of superconducting components, wherein the second heat sink is symmetrically arranged to the first heat sink; a first metal preform bonded to at least a first portion of the first heat sink, wherein the first metal preform is configured to conform to the at least the portion of the first superconducting component when the first superconducting component is pressed against the first metal preform and hold shape even after a first pressure on the first metal preform is relieved; a second metal preform bonded to at least a second portion of the second heat sink, wherein the second metal preform is configured to conform to the at least the portion of the second superconducting component when the second superconducting component is pressed against the second metal preform and hold shape even after a second pressure on the second metal preform is relieved, wherein the second metal preform is symmetrically arranged to the first metal preform; a first spring board configured to apply a first clamping force on at least a first portion of the first metal preform in direct contact with a first surface of the first superconducting component; and a second spring board configured to apply a second clamping force on at least a second portion of the second metal preform in direct contact with a second surface of the second superconducting component, wherein the second spring board is symmetrically arranged to the first spring board.