A method for fabricating an organic light emitting display, the organic light emitting display comprising: light emitting elements disposed on a substrate; an encapsulation unit disposed on the light emitting elements and including a first inorganic encapsulation layer, a second inorganic encapsulation layer and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer; a touch buffer film disposed on the encapsulation unit, covering the top of the encapsulation unit and the side surface of the encapsulation unit;; and a plurality of lines (152, 154) disposed on the touch buffer film comprising touch driving lines spaced apart from each other in the Y-axis direction, and touch sensing lines- spaced apart from each other in the X-axis direction, wherein the touch sensing lines and the touch driving lines intersect each other with the touch insulating film interposed therebetween, wherein the touch driving lines include first bridges connecting adjacent first touch electrodes and the touch sensing lines include second bridges connecting adjacent second touch electrodes, wherein the lines (152, 154) are formed of a transparent conductive layer, routing lines (156, 186) for connecting the plurality of lines (152, 154) to touch pads (170, 180), the routing lines disposed on the touch buffer film, and the touch pads (170, 180) are located on an area of the substrate that is not covered by the encapsulation unit, the routing lines (156, 186) comprise a first and a second routing layer (156a, 156b), wherein the first routing layer is made of an inorganic conductive material and the second routing layer is made of a transparent conductive layer, wherein the second routing layer is fully covering the top and side surfaces of the first routing layer, wherein the touch pads (170, 180) comprise a pad electrode made of the same material as the first routing layer and a pad cover electrode, wherein the pad cover electrode is located on the pad electrode, wherein the pad cover electrode, the second bridges and the second routing layer are made of the same material and are fabricated in the same step. light emitting elements disposed on a substrate; an encapsulation unit disposed on the light emitting elements and including a first inorganic encapsulation layer, a second inorganic encapsulation layer and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer; a touch buffer film disposed on the encapsulation unit, covering the top of the encapsulation unit and the side surface of the encapsulation unit;; and a plurality of lines (152, 154) disposed on the touch buffer film comprising touch driving lines spaced apart from each other in the Y-axis direction, and touch sensing lines- spaced apart from each other in the X-axis direction, wherein the touch sensing lines and the touch driving lines intersect each other with the touch insulating film interposed therebetween, wherein the touch driving lines include first bridges connecting adjacent first touch electrodes and the touch sensing lines include second bridges connecting adjacent second touch electrodes, wherein the lines (152, 154) are formed of a transparent conductive layer, routing lines (156, 186) for connecting the plurality of lines (152, 154) to touch pads (170, 180), the routing lines disposed on the touch buffer film, and the touch pads (170, 180) are located on an area of the substrate that is not covered by the encapsulation unit, the routing lines (156, 186) comprise a first and a second routing layer (156a, 156b), wherein the first routing layer is made of an inorganic conductive material and the second routing layer is made of a transparent conductive layer, wherein the second routing layer is fully covering the top and side surfaces of the first routing layer, wherein the touch pads (170, 180) comprise a pad electrode made of the same material as the first routing layer and a pad cover electrode, wherein the pad cover electrode is located on the pad electrode, wherein the pad cover electrode, the second bridges and the second routing layer are made of the same material and are fabricated in the same step.