A power transducer for controlling an industrial alternating current motor, the power transducer having a wall hanging structure so as to attach vertically to a wall surface and comprising: a main circuit board that is oriented vertically in a state in which the power transducer is attached to the wall surface and that is provided with a main circuit terminal connector on a lower side of the power transducer, the main circuit board including a copper foil pattern having one end electrically connected to the main circuit terminal connector; and a power semiconductor module provided with lead terminals for electrical connection to the main circuit terminal connector; wherein: the main circuit board is formed with through holes (18U, 18V, 18W) and the power semiconductor module includes a partition wall, wherein in a state in which the power transducer is attached to the wall surface the lead terminals extend through the through holes (18U, 18V, 18W) between the other end of the copper foil pattern and a lower end of the main circuit board at a side for input and output of wiring in the main circuit terminal connector, and the partition wall is located above the lead terminals on the power semiconductor module and extending from the power semiconductor module to cover an upper side of the lead terminals, the partition wall being vertically spaced from the lead terminals so that is does not contact the lead terminals. a main circuit board that is oriented vertically in a state in which the power transducer is attached to the wall surface and that is provided with a main circuit terminal connector on a lower side of the power transducer, the main circuit board including a copper foil pattern having one end electrically connected to the main circuit terminal connector; and a power semiconductor module provided with lead terminals for electrical connection to the main circuit terminal connector; wherein: the main circuit board is formed with through holes (18U, 18V, 18W) and the power semiconductor module includes a partition wall, wherein in a state in which the power transducer is attached to the wall surface the lead terminals extend through the through holes (18U, 18V, 18W) between the other end of the copper foil pattern and a lower end of the main circuit board at a side for input and output of wiring in the main circuit terminal connector, and the partition wall is located above the lead terminals on the power semiconductor module and extending from the power semiconductor module to cover an upper side of the lead terminals, the partition wall being vertically spaced from the lead terminals so that is does not contact the lead terminals. the main circuit board is formed with through holes (18U, 18V, 18W) and the power semiconductor module includes a partition wall, wherein in a state in which the power transducer is attached to the wall surface the lead terminals extend through the through holes (18U, 18V, 18W) between the other end of the copper foil pattern and a lower end of the main circuit board at a side for input and output of wiring in the main circuit terminal connector, and the partition wall is located above the lead terminals on the power semiconductor module and extending from the power semiconductor module to cover an upper side of the lead terminals, the partition wall being vertically spaced from the lead terminals so that is does not contact the lead terminals.