A high voltage device comprising a circuit structure for mitigating voltage stress on a multi-layered printed circuit board, the circuit structure comprising: a plurality of groups of overlapping conductive traces disposed between board layers of the multi-layered PCB, each group of overlapping traces sharing at least one conductive trace with a neighbouring group of overlapping conductive traces, the plurality of groups of overlapping conductive traces forming a multi-terminal condenser structure on an outer lateral end of the multi-layered PCB, wherein the multi-terminal condenser structure further comprises: a corresponding dielectric layer disposed between the plurality of overlapping conductive traces of the board layers, wherein the plurality of groups of overlapping conductive traces comprises: at least a first terminal, a second terminal, a third terminal and a fourth terminal, wherein: the first terminal and the third terminal are disposed on a first layer of the multi-layered PCB, and the second terminal and the fourth terminal are disposed on a bottom layer of the multi-layered PCB; the first terminal and the second terminal are disposed at an edge of the PCB and each connected to a ground point, and the third terminal and the fourth terminal are disposed on an opposite end of the multi-terminal condenser structure away from the first and the second terminals and the third terminal and the fourth terminal are connected to an AC voltage; and the multi-terminal condenser structure mitigates voltage stresses on the multi-layered PCB through bypassing the AC currents to the ground point when an alternating current voltage is applied to power circuitries on the PCB. a plurality of groups of overlapping conductive traces disposed between board layers of the multi-layered PCB, each group of overlapping traces sharing at least one conductive trace with a neighbouring group of overlapping conductive traces, the plurality of groups of overlapping conductive traces forming a multi-terminal condenser structure on an outer lateral end of the multi-layered PCB, wherein the multi-terminal condenser structure further comprises: a corresponding dielectric layer disposed between the plurality of overlapping conductive traces of the board layers, wherein the plurality of groups of overlapping conductive traces comprises: at least a first terminal, a second terminal, a third terminal and a fourth terminal, wherein: the first terminal and the third terminal are disposed on a first layer of the multi-layered PCB, and the second terminal and the fourth terminal are disposed on a bottom layer of the multi-layered PCB; the first terminal and the second terminal are disposed at an edge of the PCB and each connected to a ground point, and the third terminal and the fourth terminal are disposed on an opposite end of the multi-terminal condenser structure away from the first and the second terminals and the third terminal and the fourth terminal are connected to an AC voltage; and the multi-terminal condenser structure mitigates voltage stresses on the multi-layered PCB through bypassing the AC currents to the ground point when an alternating current voltage is applied to power circuitries on the PCB. the first terminal and the third terminal are disposed on a first layer of the multi-layered PCB, and the second terminal and the fourth terminal are disposed on a bottom layer of the multi-layered PCB; the first terminal and the second terminal are disposed at an edge of the PCB and each connected to a ground point, and the third terminal and the fourth terminal are disposed on an opposite end of the multi-terminal condenser structure away from the first and the second terminals and the third terminal and the fourth terminal are connected to an AC voltage; and the multi-terminal condenser structure mitigates voltage stresses on the multi-layered PCB through bypassing the AC currents to the ground point when an alternating current voltage is applied to power circuitries on the PCB.