Method for quality control during ultrasonic bonding, in which a transducer-bonding tool unit and an ultrasonic generator are used and in which, during bonding, measurement signals of a plurality of parameters, which can vary during bonding, are detected for assessing the quality of the bond and/or for influencing the bonding, wherein - during the time period of bonding procedures, measurement signals of a plurality of parameters are recorded by means of sensors and are respectively provided as a temporal actual profile, - one or a plurality of actual profiles of variables derived from the parameters are formed from measurement signals of a plurality of parameters of the bonding process, - one or a plurality of actual profiles is/are respectively subjected to a computing operation, in particular a comparing operation, with a desired profile which is stored in a memory and is associated with the respective actual profile in relation to the parameter thereof or the derived variable thereof, wherein a deviation profile is determined in each case with respect to the actual profiles, in particular by comparison of individual values of actual and desired profiles which are temporally associated with one another, wherein a confidence interval of a specific magnitude about the distribution maximum is predetermined for the desired profile on the basis of a statistical model at the respective scanning times, wherein in the respective distributions the values at the lower interval boundary and/or upper interval boundary are determined, wherein a lower characteristic boundary curve profile is formed from the values of the lower interval boundary and/or an upper characteristic boundary curve profile is formed from the values of the upper interval boundary, and wherein the actual profiles determined during the production of bonded connections are arithmetically compared with the lower and/or upper characteristic boundary curve, - an individual quality index Qi and/or a quality index Q collectively characterising the quality of an individual bonding procedure or individual bonded connection is respectively calculated by means of suitable computational means from one or a plurality of deviation profiles and is used for controlling or regulating subsequent bonding processes, characterised in that - the plurality of parameters include at least one speed of the tool tip and a generator voltage, and - the plurality of actual profiles of variables derived from the parameters comprise at least the mechanical admittance as a quotient of the two measurement variables of tool speed and generator voltage, and - during the calculation, one or a plurality of deviation profiles are variably weighted temporally or in terms of their profile or in relation to the different elements of the deviation vector. - during the time period of bonding procedures, measurement signals of a plurality of parameters are recorded by means of sensors and are respectively provided as a temporal actual profile, - one or a plurality of actual profiles of variables derived from the parameters are formed from measurement signals of a plurality of parameters of the bonding process, - one or a plurality of actual profiles is/are respectively subjected to a computing operation, in particular a comparing operation, with a desired profile which is stored in a memory and is associated with the respective actual profile in relation to the parameter thereof or the derived variable thereof, wherein a deviation profile is determined in each case with respect to the actual profiles, in particular by comparison of individual values of actual and desired profiles which are temporally associated with one another, wherein a confidence interval of a specific magnitude about the distribution maximum is predetermined for the desired profile on the basis of a statistical model at the respective scanning times, wherein in the respective distributions the values at the lower interval boundary and/or upper interval boundary are determined, wherein a lower characteristic boundary curve profile is formed from the values of the lower interval boundary and/or an upper characteristic boundary curve profile is formed from the values of the upper interval boundary, and wherein the actual profiles determined during the production of bonded connections are arithmetically compared with the lower and/or upper characteristic boundary curve, - an individual quality index Qi and/or a quality index Q collectively characterising the quality of an individual bonding procedure or individual bonded connection is respectively calculated by means of suitable computational means from one or a plurality of deviation profiles and is used for controlling or regulating subsequent bonding processes, characterised in that - the plurality of parameters include at least one speed of the tool tip and a generator voltage, and - the plurality of actual profiles of variables derived from the parameters comprise at least the mechanical admittance as a quotient of the two measurement variables of tool speed and generator voltage, and - during the calculation, one or a plurality of deviation profiles are variably weighted temporally or in terms of their profile or in relation to the different elements of the deviation vector.