A human body implant device comprising: a first unit including a transmission unit; and a second unit (200, 1200) configured to communicate with the first unit, wherein the second unit (200, 1200) includes: a second package (205, 1205) including a reception unit configured to receive power or an electrical signal from the transmission unit; a first package (201, 1201) comprising, a circuit configured to process the electrical signal and generate a stimulation signal; and an electrode array (210, 1230) configured to apply a current signal in response to the stimulation signal, a connector (208, 1208) configured to electrically connect the first package and the second package; a cover configured to package the first package, the second package, and the connector, wherein the electrode array (210, 1230) includes: a substrate extending in a first direction; a plurality of lead wires disposed on a surface of the substrate; a plurality of electrodes disposed on the surface of the substrate, and connected to the plurality of lead wires; a cover disposed on the surface of the substrate to cover the plurality of lead wires; a mold member configured to cover the substrate, and the plurality of electrodes, wherein each electrode comprises a first end portion inserted in the mold member and electrically connected to the plurality of lead wires, and a second end portion inserted in the mold member and wherein the plurality of electrodes are exposed to the outside of the mold member. a first unit including a transmission unit; and a second unit (200, 1200) configured to communicate with the first unit, wherein the second unit (200, 1200) includes: a second package (205, 1205) including a reception unit configured to receive power or an electrical signal from the transmission unit; a first package (201, 1201) comprising, a circuit configured to process the electrical signal and generate a stimulation signal; and an electrode array (210, 1230) configured to apply a current signal in response to the stimulation signal, a connector (208, 1208) configured to electrically connect the first package and the second package; a cover configured to package the first package, the second package, and the connector, wherein the electrode array (210, 1230) includes: a substrate extending in a first direction; a plurality of lead wires disposed on a surface of the substrate; a plurality of electrodes disposed on the surface of the substrate, and connected to the plurality of lead wires; a cover disposed on the surface of the substrate to cover the plurality of lead wires; a mold member configured to cover the substrate, and the plurality of electrodes, wherein each electrode comprises a first end portion inserted in the mold member and electrically connected to the plurality of lead wires, and a second end portion inserted in the mold member and wherein the plurality of electrodes are exposed to the outside of the mold member. a second package (205, 1205) including a reception unit configured to receive power or an electrical signal from the transmission unit; a first package (201, 1201) comprising, a circuit configured to process the electrical signal and generate a stimulation signal; and an electrode array (210, 1230) configured to apply a current signal in response to the stimulation signal, a circuit configured to process the electrical signal and generate a stimulation signal; and an electrode array (210, 1230) configured to apply a current signal in response to the stimulation signal, a connector (208, 1208) configured to electrically connect the first package and the second package; a cover configured to package the first package, the second package, and the connector, wherein the electrode array (210, 1230) includes: a substrate extending in a first direction; a plurality of lead wires disposed on a surface of the substrate; a plurality of electrodes disposed on the surface of the substrate, and connected to the plurality of lead wires; a cover disposed on the surface of the substrate to cover the plurality of lead wires; a mold member configured to cover the substrate, and the plurality of electrodes, wherein each electrode comprises a first end portion inserted in the mold member and electrically connected to the plurality of lead wires, and a second end portion inserted in the mold member and wherein the plurality of electrodes are exposed to the outside of the mold member. a substrate extending in a first direction; a plurality of lead wires disposed on a surface of the substrate; a plurality of electrodes disposed on the surface of the substrate, and connected to the plurality of lead wires; a cover disposed on the surface of the substrate to cover the plurality of lead wires; a mold member configured to cover the substrate, and the plurality of electrodes, wherein each electrode comprises a first end portion inserted in the mold member and electrically connected to the plurality of lead wires, and a second end portion inserted in the mold member and wherein the plurality of electrodes are exposed to the outside of the mold member.