A printed circuit board comprising: a core insulating layer comprising a first insulating layer (120, 320) and a second insulating layer (125, 325); at least one via (115, 315) formed through the core insulating layer; an inner circuit layer (111, 112, 311) buried in the core insulating layer; and an outer circuit layer (131, 135, 145, 331, 335, 345) on a top surface or a bottom surface of the core insulating layer, the printed circuit board being characterized in that the via (115, 315) includes a first part (115a, 315a), a second part (115b, 315b) below the first part (115a, 315a), and a third part (115c, 315c) between the first part (115a, 315a) and second part (115b, 315b), and the third part (115c, 315c) includes a metal different from a metal of the first part (115a, 315a) and second part (115b, 315b), wherein the inner circuit layer (111, 112, 311) comprises a first portion buried in a lower part of the first insulating layer (120, 320), wherein the inner circuit layer (111, 112, 311) is spaced apart from the via (115, 315) in a horizontal direction, wherein a sectional shape of the third part (115c, 315c) of the via (115, 315) is same as a sectional shape of the first portion of the inner circuit layer (111, 112, 311), wherein a top surface of the third part (115c, 315c) of the via (115, 315) portions lie in the same plane as a top surface of the first portion of the inner circuit layer (111, 112, 311), wherein a bottom surface of the third part (115c, 315c) of the via (115, 315) portions lie in the same plane as a bottom surface of the first portion of the inner circuit layer (111, 112, 311), wherein the first part (115a, 315a) and second part (115b, 315b) of the via (115, 315) are formed by using a same material, wherein the first portion of the inner circuit layer (111, 112, 311) and the third part (115c, 315c) of the via (115, 315) are formed by using a same material, wherein a bottom surface of the first part (115a, 315a) is directly contacted with a top surface of the third part (115c, 315c), and a bottom surface of the third part (115c, 315c) is directly contacted with a top surface of the second part (115b, 315b), wherein a combined sectional shape of the first part (115a, 315a), the second part (115b, 315b), and the third part (115c, 315c) is hexagonal. a core insulating layer comprising a first insulating layer (120, 320) and a second insulating layer (125, 325); at least one via (115, 315) formed through the core insulating layer; an inner circuit layer (111, 112, 311) buried in the core insulating layer; and an outer circuit layer (131, 135, 145, 331, 335, 345) on a top surface or a bottom surface of the core insulating layer, the printed circuit board being characterized in that the via (115, 315) includes a first part (115a, 315a), a second part (115b, 315b) below the first part (115a, 315a), and a third part (115c, 315c) between the first part (115a, 315a) and second part (115b, 315b), and the third part (115c, 315c) includes a metal different from a metal of the first part (115a, 315a) and second part (115b, 315b), wherein the inner circuit layer (111, 112, 311) comprises a first portion buried in a lower part of the first insulating layer (120, 320), wherein the inner circuit layer (111, 112, 311) is spaced apart from the via (115, 315) in a horizontal direction, wherein a sectional shape of the third part (115c, 315c) of the via (115, 315) is same as a sectional shape of the first portion of the inner circuit layer (111, 112, 311), wherein a top surface of the third part (115c, 315c) of the via (115, 315) portions lie in the same plane as a top surface of the first portion of the inner circuit layer (111, 112, 311), wherein a bottom surface of the third part (115c, 315c) of the via (115, 315) portions lie in the same plane as a bottom surface of the first portion of the inner circuit layer (111, 112, 311), wherein the first part (115a, 315a) and second part (115b, 315b) of the via (115, 315) are formed by using a same material, wherein the first portion of the inner circuit layer (111, 112, 311) and the third part (115c, 315c) of the via (115, 315) are formed by using a same material, wherein a bottom surface of the first part (115a, 315a) is directly contacted with a top surface of the third part (115c, 315c), and a bottom surface of the third part (115c, 315c) is directly contacted with a top surface of the second part (115b, 315b), wherein a combined sectional shape of the first part (115a, 315a), the second part (115b, 315b), and the third part (115c, 315c) is hexagonal.