A fluidic dispensing device, comprising: a housing that includes a fluid reservoir suitable for carrying a fluid that contains an acidic component that is reactive with silicon and a tape automated bonding circuit configured to facilitate ejection of the acidic component from the housing, wherein the TAB circuit includes a flex circuit; and a microfluidic ejection head being mechanically and electrically connected to the flex circuit and having a nozzle plate and a microfluidic ejection chip connected to the nozzle plate, wherein the nozzle plate includes a plurality of nozzle holes and a plurality of fluid chambers associated therewith, wherein the microfluidic ejection chip includes a silicon substrate, an operational layer having a device layer and a flow feature layer formed on the device layer, wherein the device layer includes a layer having conductive and insulative features, and fluid ejection elements attached to a device surface of silicon substrate, wherein the fluid ejection elements are respectively associated with the plurality of fluid chambers of the nozzle plate, wherein the silicon substrate has a fluid passageway that is in fluid communication with each of the fluid reservoir and the nozzle plate, the fluid passageway is defined by a silicon sidewall of the silicon substrate, and the silicon sidewall and corners between the device surface and the silicon sidewall next to the fluid ejection elements are covered by a permanent passivation layer, the operational layer is attached to the device surface of silicon substrate and is configured to provide an electrical connection of the fluid ejection elements to the flex circuit, the silicon sidewall and the permanent passivation layer extend continuously around a perimeter of the fluid passageway at silicon substrate. a housing that includes a fluid reservoir suitable for carrying a fluid that contains an acidic component that is reactive with silicon and a tape automated bonding circuit configured to facilitate ejection of the acidic component from the housing, wherein the TAB circuit includes a flex circuit; and a microfluidic ejection head being mechanically and electrically connected to the flex circuit and having a nozzle plate and a microfluidic ejection chip connected to the nozzle plate, wherein the nozzle plate includes a plurality of nozzle holes and a plurality of fluid chambers associated therewith, wherein the microfluidic ejection chip includes a silicon substrate, an operational layer having a device layer and a flow feature layer formed on the device layer, wherein the device layer includes a layer having conductive and insulative features, and fluid ejection elements attached to a device surface of silicon substrate, wherein the fluid ejection elements are respectively associated with the plurality of fluid chambers of the nozzle plate, wherein the silicon substrate has a fluid passageway that is in fluid communication with each of the fluid reservoir and the nozzle plate, the fluid passageway is defined by a silicon sidewall of the silicon substrate, and the silicon sidewall and corners between the device surface and the silicon sidewall next to the fluid ejection elements are covered by a permanent passivation layer, the operational layer is attached to the device surface of silicon substrate and is configured to provide an electrical connection of the fluid ejection elements to the flex circuit, the silicon sidewall and the permanent passivation layer extend continuously around a perimeter of the fluid passageway at silicon substrate.