An angular velocity and/or acceleration sensor, comprising: a first structure having a fixed portion with an opening, a displaceable portion disposed in the opening and displaceable relative to the fixed portion, and a connection portion connecting the fixed portion and the displaceable portion to each other, the first structure being made of a first semiconductor material in a flat plate shape; a second structure having a weight portion which is joined to the displaceable portion and a pedestal which surrounds the weight portion and is joined to the fixed portion, the second structure being made of a second semiconductor material and being stacked on the first structure; a joining part joining the first and second structures; a first base having a first driving electrode which applies stack-direction vibration to the displaceable portion, is disposed on a surface facing the displaceable portion, and is made of a conductive material containing Al and Nd, the first base being made of an insulating material and being stacked on the first structure while being connected to the fixed portion; and a second base having a second driving electrode which applies stack-direction vibration to the displaceable portion, is disposed on a surface facing the weight portion, and is made of the conductive material, the second base being made of an insulating material and being stacked on the second structure while being connected to the pedestal, characterized in that the first base further has a first wiring whose one end is connected to the first driving electrode and which is made of the conductive material, the first structure further has a first block upper layer portion connected to the other end of the first wiring, disposed in the opening, and having conductivity; the second base further has a second wiring whose one end is connected to the second driving electrode and which is made of the conductive material; and the second structure further has a first block lower layer portion connected to the other end of the second wiring, surrounded by the pedestal, having conductivity, and electrically connected to the first block upper layer portion. a first structure having a fixed portion with an opening, a displaceable portion disposed in the opening and displaceable relative to the fixed portion, and a connection portion connecting the fixed portion and the displaceable portion to each other, the first structure being made of a first semiconductor material in a flat plate shape; a second structure having a weight portion which is joined to the displaceable portion and a pedestal which surrounds the weight portion and is joined to the fixed portion, the second structure being made of a second semiconductor material and being stacked on the first structure; a joining part joining the first and second structures; a first base having a first driving electrode which applies stack-direction vibration to the displaceable portion, is disposed on a surface facing the displaceable portion, and is made of a conductive material containing Al and Nd, the first base being made of an insulating material and being stacked on the first structure while being connected to the fixed portion; and a second base having a second driving electrode which applies stack-direction vibration to the displaceable portion, is disposed on a surface facing the weight portion, and is made of the conductive material, the second base being made of an insulating material and being stacked on the second structure while being connected to the pedestal, characterized in that the first base further has a first wiring whose one end is connected to the first driving electrode and which is made of the conductive material, the first structure further has a first block upper layer portion connected to the other end of the first wiring, disposed in the opening, and having conductivity; the second base further has a second wiring whose one end is connected to the second driving electrode and which is made of the conductive material; and the second structure further has a first block lower layer portion connected to the other end of the second wiring, surrounded by the pedestal, having conductivity, and electrically connected to the first block upper layer portion.