An imaging system comprising: a first image sensor array; a first optical system (207.01) configured to project a first image on the first image sensor array, the first optical system having a first zoom level; a second image sensor array, the first image sensor array and the second image sensor array being fabricated on a single integrated circuit, the first image sensor array employing pixels of a first linear dimension and the second image sensor array employing pixels of a second linear dimension, which is less than the first linear dimension; a second optical system (207.02) configured to project a second image on the second image sensor array, the second optical system having a second zoom level; wherein the second image sensor array and the second optical system are pointed in the same direction as the first image sensor array and the first optical system; wherein the second zoom level is greater than the first zoom level such that the second image projected onto the second image sensor array is a zoomed in portion of the first image projected on the first image sensor array; and wherein the first image sensor array includes at least four megapixels; and wherein the second image sensor array includes one-half or less than the number of pixels in the first image sensor array; the imaging system further comprising: first pixel circuitry (110, 120) for reading image data from the first image sensor array; second pixel circuitry (410, 420) for reading image data from the second image sensor array; an electronic global shutter configured to stop charge integration between the first image sensor array and the first pixel circuitry and between the second image sensor array and the second pixel circuitry within about one millisecond of one another and; a photosensitive layer formed over a substrate with at least one of the first pixel circuitry and the second pixel circuitry being fabricated below at least a portion of the photosensitive layer; where the first image acquired from the first pixel sensor array and the second image acquired from the second pixel sensor array are fused; and the image from the first pixel sensor array has a first spatial resolution, and the second image from the second pixel sensor array has a second, lower spatial resolution. a first image sensor array; a first optical system (207.01) configured to project a first image on the first image sensor array, the first optical system having a first zoom level; a second image sensor array, the first image sensor array and the second image sensor array being fabricated on a single integrated circuit, the first image sensor array employing pixels of a first linear dimension and the second image sensor array employing pixels of a second linear dimension, which is less than the first linear dimension; a second optical system (207.02) configured to project a second image on the second image sensor array, the second optical system having a second zoom level; wherein the second image sensor array and the second optical system are pointed in the same direction as the first image sensor array and the first optical system; wherein the second zoom level is greater than the first zoom level such that the second image projected onto the second image sensor array is a zoomed in portion of the first image projected on the first image sensor array; and wherein the first image sensor array includes at least four megapixels; and wherein the second image sensor array includes one-half or less than the number of pixels in the first image sensor array; the imaging system further comprising: first pixel circuitry (110, 120) for reading image data from the first image sensor array; second pixel circuitry (410, 420) for reading image data from the second image sensor array; an electronic global shutter configured to stop charge integration between the first image sensor array and the first pixel circuitry and between the second image sensor array and the second pixel circuitry within about one millisecond of one another and; a photosensitive layer formed over a substrate with at least one of the first pixel circuitry and the second pixel circuitry being fabricated below at least a portion of the photosensitive layer; where the first image acquired from the first pixel sensor array and the second image acquired from the second pixel sensor array are fused; and the image from the first pixel sensor array has a first spatial resolution, and the second image from the second pixel sensor array has a second, lower spatial resolution. first pixel circuitry (110, 120) for reading image data from the first image sensor array; second pixel circuitry (410, 420) for reading image data from the second image sensor array; an electronic global shutter configured to stop charge integration between the first image sensor array and the first pixel circuitry and between the second image sensor array and the second pixel circuitry within about one millisecond of one another and; a photosensitive layer formed over a substrate with at least one of the first pixel circuitry and the second pixel circuitry being fabricated below at least a portion of the photosensitive layer; where the first image acquired from the first pixel sensor array and the second image acquired from the second pixel sensor array are fused; and the image from the first pixel sensor array has a first spatial resolution, and the second image from the second pixel sensor array has a second, lower spatial resolution.