A device for processing an input signal comprising a data header and payload data, wherein the data header comprises information regarding a structure of a 3D multi-aperture imaging device (70; 1000), the data header comprises information regarding a number of a first plurality of optical channels (14 1) of a first module of the 3D multi-aperture imaging device or a second plurality of optical channels (14 2) of a second module of the 3D multi-aperture imaging device, and wherein the payload data comprise image information acquired from pixels of first image sensor areas (58 11, 58 12, 58 13, 58 14) and second image sensor areas (58 21, 58 22, 58 23, 58 24), wherein the image information of the first and second image sensor areas each relate to a plurality of partial fields of view (74 11, 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) of a total field of view; wherein the data header, in the information regarding the structure, comprises information regarding a segmentation of the total field of view into first partial fields of view (74 11, 74 12, 74 13, 74 14) of the first module or second partial fields of view (74 21, 74 22, 74 23, 74 24) of the second module and an association of optical channels to the partial fields of view; wherein the payload data comprise information regarding a total image calculated from assembling partial images of partial fields of view by a stitching method; the device comprising: an input interface for receiving the input signal; and a processor for processing the payload data by considering the information regarding the structure of the 3D multi-aperture imaging device (70; 1000) for at least first image sensor information of a first partial field of view of the plurality of partial fields of view (74 11, 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) of the first module and a second partial field of view of the plurality of partial fields of view (74 11. 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) of the second module; and for performing a correction adapted to the structure of the 3D multi-aperture imaging device. wherein the data header, in the information regarding the structure, comprises information regarding a segmentation of the total field of view into first partial fields of view (74 11, 74 12, 74 13, 74 14) of the first module or second partial fields of view (74 21, 74 22, 74 23, 74 24) of the second module and an association of optical channels to the partial fields of view; wherein the payload data comprise information regarding a total image calculated from assembling partial images of partial fields of view by a stitching method; the device comprising: an input interface for receiving the input signal; and a processor for processing the payload data by considering the information regarding the structure of the 3D multi-aperture imaging device (70; 1000) for at least first image sensor information of a first partial field of view of the plurality of partial fields of view (74 11, 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) of the first module and a second partial field of view of the plurality of partial fields of view (74 11. 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) of the second module; and for performing a correction adapted to the structure of the 3D multi-aperture imaging device. an input interface for receiving the input signal; and a processor for processing the payload data by considering the information regarding the structure of the 3D multi-aperture imaging device (70; 1000) for at least first image sensor information of a first partial field of view of the plurality of partial fields of view (74 11, 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) of the first module and a second partial field of view of the plurality of partial fields of view (74 11. 74 12, 74 13, 74 14, 74 21, 74 22, 74 23, 74 24) of the second module; and for performing a correction adapted to the structure of the 3D multi-aperture imaging device.