An electronic system comprising at least one electronic cell, said at least one electronic cell comprising: - a first elementary power electronic module, called first elementary module, - a second elementary power electronic module, called second elementary module, said first and second elementary modules (1, 2) being adjacent and connected to each other by an electrical module connection, each of these first and second elementary modules (1, 2) comprising: - at least one power component (100, 200), preferably integrated on or in a printed circuit, - a first electrically conductive heat sink (11, 21), called anode heatsink, connected to a first electrode called anode of the power component (100, 200), and - a second electrically conductive heat sink (12, 22), called cathode heatsink, connected to a second electrode called cathode of the power component (100, 200), in said electronic system, each cathode heatsink (12, 22) has a first connection surface called central cathode surface and at least one second connection surface (121, 122, 222) called cathode side surface, and each anode heatsink (11, 21) has a first connection surface (110, 210) called central anode surface and at least one second connection surface (111, 112, 212) called anode side surface, and: the electrical module connection between the first and second adjacent elementary modules (1, 2) comprises at least one conductive side electrical connection (1121c, 1222c) between: at least one of the anode and cathode side surfaces (111, 121) of the first elementary module, and at least one of the anode and cathode side surfaces (212, 222) of the second elementary module. - a first elementary power electronic module, called first elementary module, - a second elementary power electronic module, called second elementary module, said first and second elementary modules (1, 2) being adjacent and connected to each other by an electrical module connection, each of these first and second elementary modules (1, 2) comprising: - at least one power component (100, 200), preferably integrated on or in a printed circuit, - a first electrically conductive heat sink (11, 21), called anode heatsink, connected to a first electrode called anode of the power component (100, 200), and - a second electrically conductive heat sink (12, 22), called cathode heatsink, connected to a second electrode called cathode of the power component (100, 200), in said electronic system, each cathode heatsink (12, 22) has a first connection surface called central cathode surface and at least one second connection surface (121, 122, 222) called cathode side surface, and each anode heatsink (11, 21) has a first connection surface (110, 210) called central anode surface and at least one second connection surface (111, 112, 212) called anode side surface, and: the electrical module connection between the first and second adjacent elementary modules (1, 2) comprises at least one conductive side electrical connection (1121c, 1222c) between: at least one of the anode and cathode side surfaces (111, 121) of the first elementary module, and at least one of the anode and cathode side surfaces (212, 222) of the second elementary module. said first and second elementary modules (1, 2) being adjacent and connected to each other by an electrical module connection, each of these first and second elementary modules (1, 2) comprising: - at least one power component (100, 200), preferably integrated on or in a printed circuit, - a first electrically conductive heat sink (11, 21), called anode heatsink, connected to a first electrode called anode of the power component (100, 200), and - a second electrically conductive heat sink (12, 22), called cathode heatsink, connected to a second electrode called cathode of the power component (100, 200), - at least one power component (100, 200), preferably integrated on or in a printed circuit, - a first electrically conductive heat sink (11, 21), called anode heatsink, connected to a first electrode called anode of the power component (100, 200), and - a second electrically conductive heat sink (12, 22), called cathode heatsink, connected to a second electrode called cathode of the power component (100, 200), in said electronic system, each cathode heatsink (12, 22) has a first connection surface called central cathode surface and at least one second connection surface (121, 122, 222) called cathode side surface, and each anode heatsink (11, 21) has a first connection surface (110, 210) called central anode surface and at least one second connection surface (111, 112, 212) called anode side surface, and: the electrical module connection between the first and second adjacent elementary modules (1, 2) comprises at least one conductive side electrical connection (1121c, 1222c) between: at least one of the anode and cathode side surfaces (111, 121) of the first elementary module, and at least one of the anode and cathode side surfaces (212, 222) of the second elementary module. at least one of the anode and cathode side surfaces (111, 121) of the first elementary module, and at least one of the anode and cathode side surfaces (212, 222) of the second elementary module.