An integrated radiator suitable to have, when in use, a temperature gradient disposed between an operating high-temperature device and an operating low-temperature device, comprising: a first heat dissipation unit and a second heat dissipation unit which are integrally fixed, wherein the first heat dissipation unit is configured to maintain the high-temperature device within a first temperature range, the second heat dissipation unit is configured to maintain the low-temperature device within a second temperature range, a thermal conductive path of the first heat dissipation unit is isolated from a thermal conductive path of the second heat dissipation unit, and the first heat dissipation unit is physically connected to but thermally separated from the second heat dissipation unit, wherein the first heat dissipation unit and the second heat dissipation unit are successively arranged in a Z direction, the first heat dissipation unit comprises a heat dissipation base and a first heat dissipation fin which are integrally connected, wherein the integrated radiator is suitable to be used in a configuration where a side surface of the first heat dissipation fin facing away from the low-temperature device in a Y direction is configured for being kept in contact with the high-temperature device, and, when the radiator is in use, a temperature gradient of the first heat dissipation unit points to the first heat dissipation fin from the heat dissipation base, and wherein the first heat dissipation fin is kept separated from the second heat dissipation unit, and the heat dissipation base is disposed at a side of the first heat dissipation fin facing away from the second heat dissipation unit in the Z direction, wherein the Y direction is perpendicular to the Z direction. a first heat dissipation unit and a second heat dissipation unit which are integrally fixed, wherein the first heat dissipation unit is configured to maintain the high-temperature device within a first temperature range, the second heat dissipation unit is configured to maintain the low-temperature device within a second temperature range, a thermal conductive path of the first heat dissipation unit is isolated from a thermal conductive path of the second heat dissipation unit, and the first heat dissipation unit is physically connected to but thermally separated from the second heat dissipation unit, wherein the first heat dissipation unit and the second heat dissipation unit are successively arranged in a Z direction, the first heat dissipation unit comprises a heat dissipation base and a first heat dissipation fin which are integrally connected, wherein the integrated radiator is suitable to be used in a configuration where a side surface of the first heat dissipation fin facing away from the low-temperature device in a Y direction is configured for being kept in contact with the high-temperature device, and, when the radiator is in use, a temperature gradient of the first heat dissipation unit points to the first heat dissipation fin from the heat dissipation base, and wherein the first heat dissipation fin is kept separated from the second heat dissipation unit, and the heat dissipation base is disposed at a side of the first heat dissipation fin facing away from the second heat dissipation unit in the Z direction, wherein the Y direction is perpendicular to the Z direction.