A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board, the component mounting device comprising: a head having a pickup member which picks up the component; a relative moving device configured to relatively move the head; an upper imaging device configured to image the component from above; a lower imaging device configured to image the component from below; a temporary loading stand configured to temporarily load the component; and characterized by a control device configured to control the head and the relative moving device in such a way that a component supplied from a component supplying device is picked up, control the lower imaging device in such a way that a lower surface of the picked-up component is imaged, correct a target temporary loading position on the temporary loading stand based on a pickup deviation amount of the component that is recognized based on a lower surface image of the imaged component, control the head and the relative moving device in such a way that the picked-up component is temporarily loaded on the corrected target temporary loading position, control the upper imaging device in such a way that an upper surface of the temporarily loaded component is imaged, control the head and the relative moving device in such a way that the temporarily loaded component on the temporary loading stand is picked up again, control the lower imaging device in such a way that the lower surface of the re-picked up component is imaged, correct a target mounting position on the board based on a positional deviation amount of the feature portion recognized based on an upper surface image of the imaged component after being temporarily loaded, and a re-picked up deviation amount of the component that is recognized based on a lower surface image of the imaged component after being re-picked up, and control the head and the relative moving device in such a way that the re-picked up component is mounted at the corrected target mounting position. a head having a pickup member which picks up the component; a relative moving device configured to relatively move the head; an upper imaging device configured to image the component from above; a lower imaging device configured to image the component from below; a temporary loading stand configured to temporarily load the component; and characterized by a control device configured to control the head and the relative moving device in such a way that a component supplied from a component supplying device is picked up, control the lower imaging device in such a way that a lower surface of the picked-up component is imaged, correct a target temporary loading position on the temporary loading stand based on a pickup deviation amount of the component that is recognized based on a lower surface image of the imaged component, control the head and the relative moving device in such a way that the picked-up component is temporarily loaded on the corrected target temporary loading position, control the upper imaging device in such a way that an upper surface of the temporarily loaded component is imaged, control the head and the relative moving device in such a way that the temporarily loaded component on the temporary loading stand is picked up again, control the lower imaging device in such a way that the lower surface of the re-picked up component is imaged, correct a target mounting position on the board based on a positional deviation amount of the feature portion recognized based on an upper surface image of the imaged component after being temporarily loaded, and a re-picked up deviation amount of the component that is recognized based on a lower surface image of the imaged component after being re-picked up, and control the head and the relative moving device in such a way that the re-picked up component is mounted at the corrected target mounting position. control the head and the relative moving device in such a way that a component supplied from a component supplying device is picked up, control the lower imaging device in such a way that a lower surface of the picked-up component is imaged, correct a target temporary loading position on the temporary loading stand based on a pickup deviation amount of the component that is recognized based on a lower surface image of the imaged component, control the head and the relative moving device in such a way that the picked-up component is temporarily loaded on the corrected target temporary loading position, control the upper imaging device in such a way that an upper surface of the temporarily loaded component is imaged, control the head and the relative moving device in such a way that the temporarily loaded component on the temporary loading stand is picked up again, control the lower imaging device in such a way that the lower surface of the re-picked up component is imaged, correct a target mounting position on the board based on a positional deviation amount of the feature portion recognized based on an upper surface image of the imaged component after being temporarily loaded, and a re-picked up deviation amount of the component that is recognized based on a lower surface image of the imaged component after being re-picked up, and control the head and the relative moving device in such a way that the re-picked up component is mounted at the corrected target mounting position.