Measuring device for determining a process variable of a medium, comprising: - a housing, wherein the housing comprises a housing body, in particular a metallic housing body, wherein the housing body has an inner surface; - a temperature measuring device, wherein the temperature measuring device comprises a first temperature sensor, wherein the first temperature sensor is set up to determine a first temperature value, wherein the temperature measuring device comprises an evaluation circuit, wherein the evaluation circuit is set up to determine a medium temperature as a function of the first temperature value; - a rigid printed circuit board, wherein the printed circuit board has a resiliently formed printed circuit board component, wherein the first temperature sensor is arranged on the printed circuit board component, wherein the printed circuit board component at least partially touches the inner surface of the housing body. wherein the printed circuit board component has a spring body, wherein the printed circuit board has a rigid printed circuit board base body, wherein the spring body and the circuit board base body are formed monolithically, wherein the spring body protrudes at least partially from the circuit board base body, wherein the spring body has a contact surface, wherein the spring body has an attachment surface, wherein the first temperature sensor is arranged on the mounting surface, characterized in that the spring body touches the inner surface with the contact surface. - a housing, wherein the housing comprises a housing body, in particular a metallic housing body, wherein the housing body has an inner surface; wherein the housing comprises a housing body, in particular a metallic housing body, wherein the housing body has an inner surface; - a temperature measuring device, wherein the temperature measuring device comprises a first temperature sensor, wherein the first temperature sensor is set up to determine a first temperature value, wherein the temperature measuring device comprises an evaluation circuit, wherein the evaluation circuit is set up to determine a medium temperature as a function of the first temperature value; wherein the temperature measuring device comprises a first temperature sensor, wherein the first temperature sensor is set up to determine a first temperature value, wherein the temperature measuring device comprises an evaluation circuit, wherein the evaluation circuit is set up to determine a medium temperature as a function of the first temperature value; - a rigid printed circuit board, wherein the printed circuit board has a resiliently formed printed circuit board component, wherein the first temperature sensor is arranged on the printed circuit board component, wherein the printed circuit board component at least partially touches the inner surface of the housing body. wherein the printed circuit board component has a spring body, wherein the printed circuit board has a rigid printed circuit board base body, wherein the spring body and the circuit board base body are formed monolithically, wherein the spring body protrudes at least partially from the circuit board base body, wherein the spring body has a contact surface, wherein the spring body has an attachment surface, wherein the first temperature sensor is arranged on the mounting surface, characterized in that the spring body touches the inner surface with the contact surface. wherein the printed circuit board has a resiliently formed printed circuit board component, wherein the first temperature sensor is arranged on the printed circuit board component, wherein the printed circuit board component at least partially touches the inner surface of the housing body. wherein the printed circuit board component has a spring body, wherein the printed circuit board has a rigid printed circuit board base body, wherein the spring body and the circuit board base body are formed monolithically, wherein the spring body protrudes at least partially from the circuit board base body, wherein the spring body has a contact surface, wherein the spring body has an attachment surface, wherein the first temperature sensor is arranged on the mounting surface, characterized in that the spring body touches the inner surface with the contact surface.