An x-ray inspection system comprising: an x-ray source; a sample support configured to support a semiconductor wafer to be inspected, wherein the sample support comprises a support surface extending in a horizontal plane, wherein the x-ray source is located above the sample support; an x-ray detector for detecting x-rays that have passed through the sample support and the wafer to record an image of the wafer; a sample support positioning assembly for positioning the sample support relative to the x- ray source or the x-ray detector, wherein the sample positioning assembly comprises a first horizontal positioning mechanism configured to move the sample support in a first horizontal direction and a second horizontal positioning mechanism configured to move the sample support in a second horizontal direction orthogonal to the first horizontal direction; and a detector positioning assembly for positioning the x-ray detector relative to the x-ray source, wherein the detector positioning assembly comprises a horizontal detector positioning mechanism for moving the x-ray detector to different imaging positions in at least two non-parallel directions within the horizontal plane, wherein the at least two non-parallel directions comprise the first horizontal direction and the second horizontal direction, characterised in that: the sample positioning assembly comprises a vertical positioning mechanism configured to move both the second horizontal positioning mechanism and the sample support in a vertical direction, orthogonal to the horizontal plane, wherein the first horizontal positional mechanism is configured to move the vertical sample positioning mechanism and the second horizontal positioning mechanism in the first horizontal direction; and in that the system is configured to perform a tomosynthesis calculation on images recorded by the x-ray detector. an x-ray source; a sample support configured to support a semiconductor wafer to be inspected, wherein the sample support comprises a support surface extending in a horizontal plane, wherein the x-ray source is located above the sample support; an x-ray detector for detecting x-rays that have passed through the sample support and the wafer to record an image of the wafer; a sample support positioning assembly for positioning the sample support relative to the x- ray source or the x-ray detector, wherein the sample positioning assembly comprises a first horizontal positioning mechanism configured to move the sample support in a first horizontal direction and a second horizontal positioning mechanism configured to move the sample support in a second horizontal direction orthogonal to the first horizontal direction; and a detector positioning assembly for positioning the x-ray detector relative to the x-ray source, wherein the detector positioning assembly comprises a horizontal detector positioning mechanism for moving the x-ray detector to different imaging positions in at least two non-parallel directions within the horizontal plane, wherein the at least two non-parallel directions comprise the first horizontal direction and the second horizontal direction, characterised in that: the sample positioning assembly comprises a vertical positioning mechanism configured to move both the second horizontal positioning mechanism and the sample support in a vertical direction, orthogonal to the horizontal plane, wherein the first horizontal positional mechanism is configured to move the vertical sample positioning mechanism and the second horizontal positioning mechanism in the first horizontal direction; and in that the system is configured to perform a tomosynthesis calculation on images recorded by the x-ray detector. the sample positioning assembly comprises a vertical positioning mechanism configured to move both the second horizontal positioning mechanism and the sample support in a vertical direction, orthogonal to the horizontal plane, wherein the first horizontal positional mechanism is configured to move the vertical sample positioning mechanism and the second horizontal positioning mechanism in the first horizontal direction; and in that the system is configured to perform a tomosynthesis calculation on images recorded by the x-ray detector.