An ultrasound probe comprising: a housing having a spherical surface recessed inward from the edge of an upper part thereof and a plurality of mounting holes uniformly formed from the outside at a constant radius to the edge in the center of the spherical surface; and a plurality of probe units installed in each of the plurality of mounting holes such that the spherical surface is formed at the upper part of the housing, wherein each of the probe units includes: a connection bar having electric and thermal conductivity; a first connection pin formed on a lower surface of the connection bar and protruding from a lower part of the housing through the mounting hole of the housing; a rear block formed on an upper surface of the connection bar and having an inclined plane for forming the spherical surface; a piezoelectric wafer formed on the inclined plane of the rear block; characterized in that each of the probe units further includes: a plurality of acoustic matching layers formed on an upper surface of the piezoelectric wafer, and each of the mounting holes formed in the housing includes: a first mounting hole formed at the lower part of the housing such that the first connection pin is inserted into the first mounting hole and protrudes from the first mounting hole; a second mounting hole vertically connected to the first mounting hole such that the connection bar is inserted into the second mounting hole; and a third mounting hole vertically connected to the second mounting hole such that the rear block is inserted into the third mounting hole. a housing having a spherical surface recessed inward from the edge of an upper part thereof and a plurality of mounting holes uniformly formed from the outside at a constant radius to the edge in the center of the spherical surface; and a plurality of probe units installed in each of the plurality of mounting holes such that the spherical surface is formed at the upper part of the housing, wherein each of the probe units includes: a connection bar having electric and thermal conductivity; a first connection pin formed on a lower surface of the connection bar and protruding from a lower part of the housing through the mounting hole of the housing; a rear block formed on an upper surface of the connection bar and having an inclined plane for forming the spherical surface; a piezoelectric wafer formed on the inclined plane of the rear block; a connection bar having electric and thermal conductivity; a first connection pin formed on a lower surface of the connection bar and protruding from a lower part of the housing through the mounting hole of the housing; a rear block formed on an upper surface of the connection bar and having an inclined plane for forming the spherical surface; a piezoelectric wafer formed on the inclined plane of the rear block; characterized in that each of the probe units further includes: a plurality of acoustic matching layers formed on an upper surface of the piezoelectric wafer, and each of the mounting holes formed in the housing includes: a first mounting hole formed at the lower part of the housing such that the first connection pin is inserted into the first mounting hole and protrudes from the first mounting hole; a second mounting hole vertically connected to the first mounting hole such that the connection bar is inserted into the second mounting hole; and a third mounting hole vertically connected to the second mounting hole such that the rear block is inserted into the third mounting hole. a plurality of acoustic matching layers formed on an upper surface of the piezoelectric wafer, and each of the mounting holes formed in the housing includes: a first mounting hole formed at the lower part of the housing such that the first connection pin is inserted into the first mounting hole and protrudes from the first mounting hole; a second mounting hole vertically connected to the first mounting hole such that the connection bar is inserted into the second mounting hole; and a third mounting hole vertically connected to the second mounting hole such that the rear block is inserted into the third mounting hole. a first mounting hole formed at the lower part of the housing such that the first connection pin is inserted into the first mounting hole and protrudes from the first mounting hole; a second mounting hole vertically connected to the first mounting hole such that the connection bar is inserted into the second mounting hole; and a third mounting hole vertically connected to the second mounting hole such that the rear block is inserted into the third mounting hole.