An optical communication module comprising: a first printed circuit board (64, 102) including two first electrode pads; a first sub-mount substrate (62, 105) including two first bottom surface electrodes each respectively bonded to one of the first electrode pads, the first sub-mount substrate (62, 105) including a side surface on which a light-emitting element (61, 107) is mounted, the first sub-mount substrate (62, 105) including two side surface electrodes where a cathode of the light-emitting element (61, 107) is connected to one of the side surface electrodes by wire bonding and an anode of the light-emitting element (61, 107) is connected to the other of the side surface electrodes using conductive paste; a second printed circuit board (74, 103) including two second electrode pads; a second sub-mount substrate (72, 106) including two second bottom surface electrodes each respectively bonded to one of the second electrode pads, the second sub-mount substrate (72, 106) including a side surface on which a light-receiving element (71, 108) is mounted, the second sub-mount substrate (72, 106) including two side surface electrodes where a cathode of the light-receiving element (71, 108) is connected to one of the side surface electrodes by wire bonding and an anode of the light-receiving element (71, 108) is connected to the other of the side surface electrodes using conductive paste; and an optical waveguide (52,109) provided between the light-emitting element (61, 107) and the light-receiving element (71, 108) so as to be able to be optically coupled with the light-emitting element (61, 107) and the light-receiving element (71, 108), wherein the light-emitting element (61, 107) is mounted on the first printed circuit board (64, 102) with the first sub-mount substrate (62, 105) therebetween such that a light-emitting direction of the light-emitting element (71, 107) is not perpendicular to the first printed circuit board (64, 102), the light-receiving element (71, 108) is mounted on the second printed circuit board (74, 103) with the second sub-mount substrate (72, 106) therebetween such that a light-receiving direction of the light-receiving element (71, 108) is not perpendicular to the second printed circuit board (74, 103), the light-emitting element (61, 107) of the first sub-mount substrate (62, 105) and an end of the optical waveguide (52, 109) adjacent to the light-emitting element (61, 107) is covered by a resin (57, 110), and the light-receiving element (71, 108) of the second sub-mount substrate (72, 106) and an end of the optical waveguide (52, 109) adjacent to the light-receiving element (71, 108) is covered by a resin (57, 110). a first printed circuit board (64, 102) including two first electrode pads; a first sub-mount substrate (62, 105) including two first bottom surface electrodes each respectively bonded to one of the first electrode pads, the first sub-mount substrate (62, 105) including a side surface on which a light-emitting element (61, 107) is mounted, the first sub-mount substrate (62, 105) including two side surface electrodes where a cathode of the light-emitting element (61, 107) is connected to one of the side surface electrodes by wire bonding and an anode of the light-emitting element (61, 107) is connected to the other of the side surface electrodes using conductive paste; a second printed circuit board (74, 103) including two second electrode pads; a second sub-mount substrate (72, 106) including two second bottom surface electrodes each respectively bonded to one of the second electrode pads, the second sub-mount substrate (72, 106) including a side surface on which a light-receiving element (71, 108) is mounted, the second sub-mount substrate (72, 106) including two side surface electrodes where a cathode of the light-receiving element (71, 108) is connected to one of the side surface electrodes by wire bonding and an anode of the light-receiving element (71, 108) is connected to the other of the side surface electrodes using conductive paste; and an optical waveguide (52,109) provided between the light-emitting element (61, 107) and the light-receiving element (71, 108) so as to be able to be optically coupled with the light-emitting element (61, 107) and the light-receiving element (71, 108), wherein the light-emitting element (61, 107) is mounted on the first printed circuit board (64, 102) with the first sub-mount substrate (62, 105) therebetween such that a light-emitting direction of the light-emitting element (71, 107) is not perpendicular to the first printed circuit board (64, 102), the light-receiving element (71, 108) is mounted on the second printed circuit board (74, 103) with the second sub-mount substrate (72, 106) therebetween such that a light-receiving direction of the light-receiving element (71, 108) is not perpendicular to the second printed circuit board (74, 103), the light-emitting element (61, 107) of the first sub-mount substrate (62, 105) and an end of the optical waveguide (52, 109) adjacent to the light-emitting element (61, 107) is covered by a resin (57, 110), and the light-receiving element (71, 108) of the second sub-mount substrate (72, 106) and an end of the optical waveguide (52, 109) adjacent to the light-receiving element (71, 108) is covered by a resin (57, 110).