A highly conductive transparent laminated glass article, comprising two glass plates and an adhesive film, characterized in that: at least one of the two glass plates is a highly conductive transparent glass-based circuit board with a glass substrate; and the adhesive film has a material of Poly(Vinyl Butyral) resin and is located between the two glass plates, wherein a surface of the glass substrate is not contact with the adhesive film, and a conductive paste, printed on the surface of the glass substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate; wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion; wherein the glass substrate is a glass-tempered substrate, and a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board organic solder-resistant layer; wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75: 3: 5 to 10: 10 to 20: 1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste; and wherein a surface of the glass-tempered substrate faces air, and the conductive paste, printed on the surface of the glass-tempered substrate, is baked at a temperature between 120 and 150 °C for 100 to 200 seconds, placed at a temperature between 550 and 600 °C for 300 to 360 seconds, then placed at a temperature between 710 and 730 °C for 120 to 220 seconds, and finally cooled to form the conductive circuit fused with the surface of the glass-tempered substrate. at least one of the two glass plates is a highly conductive transparent glass-based circuit board with a glass substrate; and the adhesive film has a material of Poly(Vinyl Butyral) resin and is located between the two glass plates, wherein a surface of the glass substrate is not contact with the adhesive film, and a conductive paste, printed on the surface of the glass substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate; wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion; wherein the glass substrate is a glass-tempered substrate, and a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board organic solder-resistant layer; wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75: 3: 5 to 10: 10 to 20: 1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste; and wherein a surface of the glass-tempered substrate faces air, and the conductive paste, printed on the surface of the glass-tempered substrate, is baked at a temperature between 120 and 150 °C for 100 to 200 seconds, placed at a temperature between 550 and 600 °C for 300 to 360 seconds, then placed at a temperature between 710 and 730 °C for 120 to 220 seconds, and finally cooled to form the conductive circuit fused with the surface of the glass-tempered substrate.