A method for improving heat dissipation in an encapsulated electronic device, the encapsulated device comprising: a carrier having a first surface and an opposing second surface; a plurality of electrically conductive bumps disposed on the first surface of the carrier; a plurality of electrically conductive segments disposed on the second surface of the carrier; a plurality of electrically conductive paths, provided between the first and second surfaces of the carrier, for electrically connecting the bumps to the electrically conductive segments; a die disposed on top of the bumps, electrically connected to the electrically conductive segments via the electrically conductive paths and the bumps; a layer of lamination material provided on top of the die and at least a part of the first surface of the carrier, said method comprising: removing a portion of the lamination material on top of the die to provide in the layer of lamination material a cleared area on top of the die, in which the lamination material is eliminated or reduced, and an uncleared area which surrounds the cleared area; and providing a thermal conducting layer on the cleared area, so as to improve heat dissipation of the encapsulated device through the thermal conducting layer, wherein the encapsulated device with improved heat dissipation comprises, under the thermal conducting layer, a hermetic seal layer covering the cleared area, another part of the first surface of the carrier and the uncleared area of the layer of lamination material. a carrier having a first surface and an opposing second surface; a plurality of electrically conductive bumps disposed on the first surface of the carrier; a plurality of electrically conductive segments disposed on the second surface of the carrier; a plurality of electrically conductive paths, provided between the first and second surfaces of the carrier, for electrically connecting the bumps to the electrically conductive segments; a die disposed on top of the bumps, electrically connected to the electrically conductive segments via the electrically conductive paths and the bumps; a layer of lamination material provided on top of the die and at least a part of the first surface of the carrier, said method comprising: removing a portion of the lamination material on top of the die to provide in the layer of lamination material a cleared area on top of the die, in which the lamination material is eliminated or reduced, and an uncleared area which surrounds the cleared area; and providing a thermal conducting layer on the cleared area, so as to improve heat dissipation of the encapsulated device through the thermal conducting layer, wherein the encapsulated device with improved heat dissipation comprises, under the thermal conducting layer, a hermetic seal layer covering the cleared area, another part of the first surface of the carrier and the uncleared area of the layer of lamination material. removing a portion of the lamination material on top of the die to provide in the layer of lamination material a cleared area on top of the die, in which the lamination material is eliminated or reduced, and an uncleared area which surrounds the cleared area; and providing a thermal conducting layer on the cleared area, so as to improve heat dissipation of the encapsulated device through the thermal conducting layer, wherein the encapsulated device with improved heat dissipation comprises, under the thermal conducting layer, a hermetic seal layer covering the cleared area, another part of the first surface of the carrier and the uncleared area of the layer of lamination material.