An electronic device (101, 300) comprising: a housing; and a camera module (180, 312, 400), at least a portion of which is disposed in the housing, wherein the camera module includes: a fixed part including a first circuit board; a moving part including a lens (210, 405), an image sensor (230, 442), and a second circuit board electrically connected with the image sensor and configured to face at least a portion of the first circuit board, the moving part being at least partially accommodated in the fixed part and coupled to the fixed part so as to be rotatable; and a connecting structure disposed between the first circuit board and the second circuit board, the connecting structure including a plurality of flexible substrates configured to electrically connect the first circuit board and the second circuit board, and wherein each flexible substrate of the plurality of flexible substrates includes a first portion (510, 610) including a first conductive pad (511, 601) coupled with a first conductive region of the first circuit board, a second portion (520, 620) including a second conductive pad (521, 602) coupled with a second conductive region of the second circuit board, and at least one VIA (531,532,603) configured to electrically connect the first portion and the second portion, wherein the plurality of flexible substrates includes a first flexible substrate (500-1, 550) and a second flexible substrate (500-3, 560), and wherein the first flexible substrate and the second flexible substrate are disposed to be symmetrical to each other with respect to an optical axis of the lens. a housing; and a camera module (180, 312, 400), at least a portion of which is disposed in the housing, wherein the camera module includes: a fixed part including a first circuit board; a moving part including a lens (210, 405), an image sensor (230, 442), and a second circuit board electrically connected with the image sensor and configured to face at least a portion of the first circuit board, the moving part being at least partially accommodated in the fixed part and coupled to the fixed part so as to be rotatable; and a connecting structure disposed between the first circuit board and the second circuit board, the connecting structure including a plurality of flexible substrates configured to electrically connect the first circuit board and the second circuit board, and wherein each flexible substrate of the plurality of flexible substrates includes a first portion (510, 610) including a first conductive pad (511, 601) coupled with a first conductive region of the first circuit board, a second portion (520, 620) including a second conductive pad (521, 602) coupled with a second conductive region of the second circuit board, and at least one VIA (531,532,603) configured to electrically connect the first portion and the second portion, wherein the plurality of flexible substrates includes a first flexible substrate (500-1, 550) and a second flexible substrate (500-3, 560), and wherein the first flexible substrate and the second flexible substrate are disposed to be symmetrical to each other with respect to an optical axis of the lens. a fixed part including a first circuit board; a moving part including a lens (210, 405), an image sensor (230, 442), and a second circuit board electrically connected with the image sensor and configured to face at least a portion of the first circuit board, the moving part being at least partially accommodated in the fixed part and coupled to the fixed part so as to be rotatable; and a connecting structure disposed between the first circuit board and the second circuit board, the connecting structure including a plurality of flexible substrates configured to electrically connect the first circuit board and the second circuit board, and wherein each flexible substrate of the plurality of flexible substrates includes a first portion (510, 610) including a first conductive pad (511, 601) coupled with a first conductive region of the first circuit board, a second portion (520, 620) including a second conductive pad (521, 602) coupled with a second conductive region of the second circuit board, and at least one VIA (531,532,603) configured to electrically connect the first portion and the second portion, wherein the plurality of flexible substrates includes a first flexible substrate (500-1, 550) and a second flexible substrate (500-3, 560), and wherein the first flexible substrate and the second flexible substrate are disposed to be symmetrical to each other with respect to an optical axis of the lens.