An RFID device for integration into a tire, comprising: a printed circuit board (PCB, 102, 202) having top and bottom surfaces delineated by opposed end portions and opposed side portions; a plurality of conductive traces (104, 204) on the top surface of said PCB (102, 202); a plated through via (134A, 134B) piercing the PCB (102, 202) from the top surface to the bottom surface; a conductive trace element (130A, 130B) surrounding said via (134A, 134B) at the top surface of said PCB (102, 202), the trace element (130A, 130B) electrically coupled to the plurality of conductive traces (104, 204); and a conductive solder pad (130C, 130D) surrounding said via (134A, 134B) at the bottom surface of said PCB (102, 202) and extending substantially between the side portions of the PCB (102, 202); characterized by a notch (120A, 120B) formed in one end of said PCB (102, 202); and an antenna element (110, 112, 310, 312) having an end portion positioned within said notch (120A, 120B) and within a plane defined by the top surface of the PCB (102, 202), wherein said end portion continues in an unbroken pattern through the via (134A, 134B) and around until it touches the conductive solder pad (130C, 130D) surrounding said via (134A, 134B) at the bottom surface of the PCB (102, 202) and passes through the via (134A, 134B) from the top surface to the bottom surface and is electrically connected to the conductive solder pad (130C, 130D) surrounding said via (134A, 134B) at the bottom surface of the PCB (102, 202); wherein the antenna element (110, 112, 310, 312) comprises a helically wound conductor; wherein the helically wound conductor is wound with a single pitch between turns; wherein the notch (120A, 120B) is provided with portions matching the pitch of the helically wound conductor. a printed circuit board (PCB, 102, 202) having top and bottom surfaces delineated by opposed end portions and opposed side portions; a plurality of conductive traces (104, 204) on the top surface of said PCB (102, 202); a plated through via (134A, 134B) piercing the PCB (102, 202) from the top surface to the bottom surface; a plated through via (134A, 134B) piercing the PCB (102, 202) from the top surface to the bottom surface; a conductive trace element (130A, 130B) surrounding said via (134A, 134B) at the top surface of said PCB (102, 202), the trace element (130A, 130B) electrically coupled to the plurality of conductive traces (104, 204); and a conductive solder pad (130C, 130D) surrounding said via (134A, 134B) at the bottom surface of said PCB (102, 202) and extending substantially between the side portions of the PCB (102, 202); a notch (120A, 120B) formed in one end of said PCB (102, 202); and an antenna element (110, 112, 310, 312) having an end portion positioned within said notch (120A, 120B) and within a plane defined by the top surface of the PCB (102, 202), wherein said end portion continues in an unbroken pattern through the via (134A, 134B) and around until it touches the conductive solder pad (130C, 130D) surrounding said via (134A, 134B) at the bottom surface of the PCB (102, 202) and passes through the via (134A, 134B) from the top surface to the bottom surface and is electrically connected to the conductive solder pad (130C, 130D) surrounding said via (134A, 134B) at the bottom surface of the PCB (102, 202); wherein the antenna element (110, 112, 310, 312) comprises a helically wound conductor; wherein the helically wound conductor is wound with a single pitch between turns; wherein the notch (120A, 120B) is provided with portions matching the pitch of the helically wound conductor.