A component supply device (60, 160) arranged adjacent to a mounter having a mounting head that mounts components on a board which supplies the components to the mounter comprising: a wafer sheet replenishment section which replenishes a wafer sheet on which multiple components are arranged, and a wafer sheet conveyance section which conveys a wafer sheet supplied from the wafer sheet replenishment section; wherein the wafer sheet conveyance section includes a table on which the wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table; wherein the pickup head includes multiple component supply side suction nozzles (114a, 114b), and a switching mechanism which switches the multiple component supply side suction nozzles (114a, 114b) between a pickup position at which the tip of the multiple component supply side suction nozzles (114a, 114b) faces down and a transfer position at which the tip of the multiple component supply side suction nozzles (114a, 114b) faces up; wherein the arrangement of the multiple component supply side suction nozzles (114a, 114b) corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter, wherein the pickup head further includes number one housing and number two housing which is rotatably supported with respect to the number one housing by a rotation axis and to which the multiple component supply side suction nozzles (114a, 114b) are attached; wherein the switching mechanism includes a rack and pinion mechanism (118, 120) which rotates the number two housing with respect to the number one housing; and wherein an intake passage and a groove are provided inside the rotation axis, so that the multiple component supply side suction nozzles (114a, 114b) can be connected to a suction device via the intake passage and the groove. a wafer sheet replenishment section which replenishes a wafer sheet on which multiple components are arranged, and a wafer sheet conveyance section which conveys a wafer sheet supplied from the wafer sheet replenishment section; wherein the wafer sheet conveyance section includes a table on which the wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table; wherein the pickup head includes multiple component supply side suction nozzles (114a, 114b), and a switching mechanism which switches the multiple component supply side suction nozzles (114a, 114b) between a pickup position at which the tip of the multiple component supply side suction nozzles (114a, 114b) faces down and a transfer position at which the tip of the multiple component supply side suction nozzles (114a, 114b) faces up; wherein the arrangement of the multiple component supply side suction nozzles (114a, 114b) corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter, wherein the pickup head further includes number one housing and number two housing which is rotatably supported with respect to the number one housing by a rotation axis and to which the multiple component supply side suction nozzles (114a, 114b) are attached; wherein the switching mechanism includes a rack and pinion mechanism (118, 120) which rotates the number two housing with respect to the number one housing; and wherein an intake passage and a groove are provided inside the rotation axis, so that the multiple component supply side suction nozzles (114a, 114b) can be connected to a suction device via the intake passage and the groove.