A method for manufacturing micro-optic surface relief structure design with complex, variable three-dimensional surface relief forms comprising - obtaining a step embossing, step imprinting, a chip bonding or a corresponding device capable of patterning the surface of a target substrate and capable of moving a stamping tool in relation to a substrate and/or vice versa so as to emboss the selected areas of the substrate with said stamping tool, the device optionally comprising a chip bonding device configured to apply a plurality of stamping tools consecutively for patterning the surface of a target substrate so as to obtain the micro-optic surface design, - obtaining the target substrate whereto the micro-optic surface relief structures shall be patterned, wherein said target substrate optionally includes predetermined micro-optic surface relief forms and new micro-optic surface relief forms are embossed adjacent to or on top of at least some of said predetermined micro-optic surface relief forms, - obtaining information defining an optical design objective in relation to the target substrate (302, 308), - obtaining a plurality of different stamping tools operable with said device, each stamping tool comprising one or more surface relief forms defining one or more micro-optic surface relief structures, - selecting, by said device, a stamping tool from said plurality of stamping tools, optionally adjusting the associated embossing parameters of temperature, position or alignment,, - embossing the target substrate with said selected stamping tool as controlled by said device, wherein said selected stamping tool is optionally heated or assisted by UV (Ultraviolet) source so as to form and/or cure the target substrate during or after the embossing, and - repeating said selecting and embossing steps in accordance with the information until the micro-optic surface relief structure design has been completed on the substrate, wherein said stamping tool is moved in relation to said substrate and/or vice versa so as to emboss a plurality of predetermined areas of the target substrate with said stamping tool, characterized in that the resulting micro-optic surface relief structure design of the obtained micro-optic product defines a larger micro-optic surface relief structure formed on the substrate by and thus comprising a plurality of smaller micro-optic surface relief forms obtained by said repetition of the selecting and embossing steps and in that the embossing depth is controlled by at least one element selected from a group consisting of: pressure, heat and embossing time. - obtaining a step embossing, step imprinting, a chip bonding or a corresponding device capable of patterning the surface of a target substrate and capable of moving a stamping tool in relation to a substrate and/or vice versa so as to emboss the selected areas of the substrate with said stamping tool, the device optionally comprising a chip bonding device configured to apply a plurality of stamping tools consecutively for patterning the surface of a target substrate so as to obtain the micro-optic surface design, - obtaining the target substrate whereto the micro-optic surface relief structures shall be patterned, wherein said target substrate optionally includes predetermined micro-optic surface relief forms and new micro-optic surface relief forms are embossed adjacent to or on top of at least some of said predetermined micro-optic surface relief forms, - obtaining information defining an optical design objective in relation to the target substrate (302, 308), - obtaining a plurality of different stamping tools operable with said device, each stamping tool comprising one or more surface relief forms defining one or more micro-optic surface relief structures, - selecting, by said device, a stamping tool from said plurality of stamping tools, optionally adjusting the associated embossing parameters of temperature, position or alignment,, - embossing the target substrate with said selected stamping tool as controlled by said device, wherein said selected stamping tool is optionally heated or assisted by UV (Ultraviolet) source so as to form and/or cure the target substrate during or after the embossing, and - repeating said selecting and embossing steps in accordance with the information until the micro-optic surface relief structure design has been completed on the substrate, wherein said stamping tool is moved in relation to said substrate and/or vice versa so as to emboss a plurality of predetermined areas of the target substrate with said stamping tool,