An LED illumination apparatus comprising: a conductive plate, being stamped to form a structure with 3D space, and having at least one electrode slot and a plurality of isolation slots, and each isolation slot dividing the conductive plate into a plurality of strip structures, and each strip structure forming a fixed planar structure and a plurality of fixing holes provided for mold pressing, wherein the fixed planar structure is disposed across the electrode slot, and each fixing hole is formed adjacent to an edge of the fixed planar structure; a plurality of LED chips, coupled and installed into the fixed planar structure of the conductive plate and across the electrode slot, and provided for dividing each strip structure into a plurality of parallel circuit areas of the LED chip, and a plurality of connecting portions or a strip structure being provided for connecting each parallel circuit area in series to form a series-parallel circuit; and a support frame with an insulating effect, comprised of a plurality of strip support ribs, each support rib comprising a plurality of fixing columns thereon, and disposed in an internal space under the conductive plate, so that each fixing column is passed and coupled to a fixing hole of the conductive plate, and a ventilation hole is formed between adjacent support ribs, and each support rib is configured to be corresponsive to a strip structure of the conductive plate; and wherein the support frame comprises a support surface, extended between the support rib and each fixing column, and provided for attaching the bottom of each plane of the conductive plate, and used for mold pressing, and each fixing column being passed and extended to both sides of each LED chip to form an LED chip soldering point protection mechanism for protecting an electrode soldering point of each LED chip during a manufacturing process of the LED chip. a conductive plate, being stamped to form a structure with 3D space, and having at least one electrode slot and a plurality of isolation slots, and each isolation slot dividing the conductive plate into a plurality of strip structures, and each strip structure forming a fixed planar structure and a plurality of fixing holes provided for mold pressing, wherein the fixed planar structure is disposed across the electrode slot, and each fixing hole is formed adjacent to an edge of the fixed planar structure; a plurality of LED chips, coupled and installed into the fixed planar structure of the conductive plate and across the electrode slot, and provided for dividing each strip structure into a plurality of parallel circuit areas of the LED chip, and a plurality of connecting portions or a strip structure being provided for connecting each parallel circuit area in series to form a series-parallel circuit; and a support frame with an insulating effect, comprised of a plurality of strip support ribs, each support rib comprising a plurality of fixing columns thereon, and disposed in an internal space under the conductive plate, so that each fixing column is passed and coupled to a fixing hole of the conductive plate, and a ventilation hole is formed between adjacent support ribs, and each support rib is configured to be corresponsive to a strip structure of the conductive plate; and wherein the support frame comprises a support surface, extended between the support rib and each fixing column, and provided for attaching the bottom of each plane of the conductive plate, and used for mold pressing, and each fixing column being passed and extended to both sides of each LED chip to form an LED chip soldering point protection mechanism for protecting an electrode soldering point of each LED chip during a manufacturing process of the LED chip.