An electronic device, comprising: a semiconductor wafer (210; 410; 610; 1110); a radio frequency integrated circuit (220; 330; 540; 1040), RFIC, fabricated in the semiconductor wafer; an antenna interposer (240; 420; 620; 1120) disposed on a surface of the semiconductor wafer, wherein the surface of the semiconductor wafer and a surface of the antenna interposer are bonded face to face; and an antenna structure (250; 310; 510; 1010; 1020; 1030) fabricated in the antenna interposer, the antenna structure comprising a first conductive pattern (440; 640A; 710) with a first electrical length; and a first through hole (315; 515; 730) formed in at least part of the semiconductor wafer or the antenna interposer and electrically connecting the RFIC and the antenna structure, characterized in that the antenna structure further comprises a second conductive pattern (450; 650B; 720) with a second electrical length, and in that the electronic device further comprises: a switch (230; 320; 520; 700) formed in the RFIC and configured to electrically connect or disconnect the first conductive pattern and the second conductive pattern to each other based on a frequency band of a signal being transmitted or received by the RFIC; a second through hole (325; 525; 740) formed in between the switch and the antenna structure and electrically connecting said switch to the first and second conductive pattern. a semiconductor wafer (210; 410; 610; 1110); a radio frequency integrated circuit (220; 330; 540; 1040), RFIC, fabricated in the semiconductor wafer; an antenna interposer (240; 420; 620; 1120) disposed on a surface of the semiconductor wafer, wherein the surface of the semiconductor wafer and a surface of the antenna interposer are bonded face to face; and an antenna structure (250; 310; 510; 1010; 1020; 1030) fabricated in the antenna interposer, the antenna structure comprising a first conductive pattern (440; 640A; 710) with a first electrical length; and a first through hole (315; 515; 730) formed in at least part of the semiconductor wafer or the antenna interposer and electrically connecting the RFIC and the antenna structure, characterized in that the antenna structure further comprises a second conductive pattern (450; 650B; 720) with a second electrical length, and in that the electronic device further comprises: a switch (230; 320; 520; 700) formed in the RFIC and configured to electrically connect or disconnect the first conductive pattern and the second conductive pattern to each other based on a frequency band of a signal being transmitted or received by the RFIC; a second through hole (325; 525; 740) formed in between the switch and the antenna structure and electrically connecting said switch to the first and second conductive pattern. a switch (230; 320; 520; 700) formed in the RFIC and configured to electrically connect or disconnect the first conductive pattern and the second conductive pattern to each other based on a frequency band of a signal being transmitted or received by the RFIC; a second through hole (325; 525; 740) formed in between the switch and the antenna structure and electrically connecting said switch to the first and second conductive pattern.