A server, comprising: a power supply, a fan, a backplane, at least two node boxes, each node box comprising a motherboard and a transition board, the node box being in pluggable connection with the backplane through the transition board; wherein each transition board is disposed with power interfaces and fan interfaces, and the power interfaces and the fan interfaces on each transition board are connected to a standardized power interface and a standardized fan interface on each motherboard respectively; the number of the power interfaces on each transition board and the number of the fan interfaces on each transition board are not smaller than the maximum number of power interfaces in a commonly-used server motherboard and the maximum number of fan interfaces in the commonly-used server motherboard respectively; the power interfaces and the fan interfaces on each transition board are connected to the power supply and the fan through the backplane respectively, so that the power interfaces and the fan interfaces on each motherboard are connected to the power supply and the fan through the power interfaces and the fan interfaces on each transition board respectively; a first control unit is further disposed in each transition board and configured to acquire fan speed information of the motherboard, the motherboard being configured to obtain the fan speed information according to its own temperature, wherein the higher the temperature, the higher the fan speed, wherein the first control unit is further configured to acquire a maximum fan speed of the motherboard according to the fan speed information of the motherboard; and the server further comprises a control board, wherein the control board is disposed with a second control unit; wherein the second control unit is connected to the fan through the backplane, and configured to obtain the maximum fan speed of these maximum fan speeds according to the acquired maximum fan speed information of each motherboard, to control the fan speed, so as to satisfy a heat dissipation demand of each motherboard. a power supply, a fan, a backplane, at least two node boxes, each node box comprising a motherboard and a transition board, the node box being in pluggable connection with the backplane through the transition board; wherein each transition board is disposed with power interfaces and fan interfaces, and the power interfaces and the fan interfaces on each transition board are connected to a standardized power interface and a standardized fan interface on each motherboard respectively; the number of the power interfaces on each transition board and the number of the fan interfaces on each transition board are not smaller than the maximum number of power interfaces in a commonly-used server motherboard and the maximum number of fan interfaces in the commonly-used server motherboard respectively; the power interfaces and the fan interfaces on each transition board are connected to the power supply and the fan through the backplane respectively, so that the power interfaces and the fan interfaces on each motherboard are connected to the power supply and the fan through the power interfaces and the fan interfaces on each transition board respectively; a first control unit is further disposed in each transition board and configured to acquire fan speed information of the motherboard, the motherboard being configured to obtain the fan speed information according to its own temperature, wherein the higher the temperature, the higher the fan speed, wherein the first control unit is further configured to acquire a maximum fan speed of the motherboard according to the fan speed information of the motherboard; and the server further comprises a control board, wherein the control board is disposed with a second control unit; wherein the second control unit is connected to the fan through the backplane, and configured to obtain the maximum fan speed of these maximum fan speeds according to the acquired maximum fan speed information of each motherboard, to control the fan speed, so as to satisfy a heat dissipation demand of each motherboard.