Method of applying a material comprising a fusible polymer, comprising the step of: - applying a filament of the at least partly molten material from a discharge opening of a discharge element to a substrate; wherein the fusible polymer has the following properties: - a melting point, determined by DSC, differential scanning calorimetry; 2nd heating at heating rate 5°C/min, within a range from ≥ 40°C to ≤ 120°C; - a glass transition temperature, determined by DMA, dynamic-mechanical analysis to DIN EN ISO 6721-1:2011, within a range from ≥ -70°C to ≤ 30°C; - a storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, at 20°C above the melting point of ≥ 1·10 4 Pa; - a storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, at 10°C below the melting point with prior heating to a temperature of 20°C above the melting point and subsequent cooling at a cooling rate of 1°C/min of ≤ 1·10 7 Pa; wherein the filament, during the application process, has an application temperature of ≥ 100°C above the melting point of the fusible polymer for ≤ 5 minutes, wherein the fusible polymer also has the property that the storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, of the fusible polymer at the highest application temperature attained during the application process is smaller by a factor of ≥ 10 than the storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, at a temperature of 20°C above the melting point of the fusible polymer, and wherein the fusible polymer is selected from the group consisting of: polyurethane, polyester or a combination thereof. - applying a filament of the at least partly molten material from a discharge opening of a discharge element to a substrate; wherein the fusible polymer has the following properties: - a melting point, determined by DSC, differential scanning calorimetry; 2nd heating at heating rate 5°C/min, within a range from ≥ 40°C to ≤ 120°C; - a glass transition temperature, determined by DMA, dynamic-mechanical analysis to DIN EN ISO 6721-1:2011, within a range from ≥ -70°C to ≤ 30°C; - a storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, at 20°C above the melting point of ≥ 1·10 4 Pa; - a storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, at 10°C below the melting point with prior heating to a temperature of 20°C above the melting point and subsequent cooling at a cooling rate of 1°C/min of ≤ 1·10 7 Pa; - a melting point, determined by DSC, differential scanning calorimetry; 2nd heating at heating rate 5°C/min, within a range from ≥ 40°C to ≤ 120°C; - a glass transition temperature, determined by DMA, dynamic-mechanical analysis to DIN EN ISO 6721-1:2011, within a range from ≥ -70°C to ≤ 30°C; - a storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, at 20°C above the melting point of ≥ 1·10 4 Pa; - a storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, at 10°C below the melting point with prior heating to a temperature of 20°C above the melting point and subsequent cooling at a cooling rate of 1°C/min of ≤ 1·10 7 Pa; wherein the filament, during the application process, has an application temperature of ≥ 100°C above the melting point of the fusible polymer for ≤ 5 minutes, wherein the fusible polymer also has the property that the storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, of the fusible polymer at the highest application temperature attained during the application process is smaller by a factor of ≥ 10 than the storage modulus G', determined with a plate/plate oscillation viscometer to ISO 6721-10:2015 at a frequency of 1/s, at a temperature of 20°C above the melting point of the fusible polymer, and wherein the fusible polymer is selected from the group consisting of: polyurethane, polyester or a combination thereof.