A photoacoustic compression method for machining a transparent target using a burst pulse laser system configured to generate a programmable train of burst pulses containing from 2 to 50 sub-pulses within a burst pulse envelope and to generate an average power of 1 to 200 watts, the method comprising the following steps: applying the burst pulses of the laser beam, operating at a laser beam repetition rate from a laser beam source having a suitable wavelength, suitable burst pulse repetition rate and suitable burst pulse energy to a transparent target, focusing said laser pulses from said laser beam source through a distributive-focus lens assembly comprising positive and negative lenses while having a positive focusing effect in the aggregate and being capable of producing a weakly convergent, multi foci spatial beam profile whereas the incident fluence at the target material is sufficient to cause Kerr-effect self-focusing and propagation, adjusting the relative distance and/or angle of said distributive focus lens assembly in relation to said laser beam source and said transparent target so as to focus said laser pulses in a distributed focus configuration creating a principal focal waist and at least one secondary focal waist, producing photoacoustic compression machining wherein said laser pulse energy delivered through said principal focal waist to said transparent target exceeds a critical power level necessary to initiate a Kerr-Effect induced self-focusing so that a filament is produced in said transparent target, photoacoustic compression machining, is initiated and then propagated in said transparent target by additional energy input to said transparent target through said secondary focal waist(s), and, total amount of pulse energy or fluence is applied to said transparent target at a spot where said laser pulses contact said transparent target, said spot being the point of initiation of machining on said transparent target, said total pulse energy or fluence is greater than the critical energy level required to initiate and propagate photoacoustic compression machining yet is lower than the threshold critical energy level required to initiate ablative or vaporization based machining. applying the burst pulses of the laser beam, operating at a laser beam repetition rate from a laser beam source having a suitable wavelength, suitable burst pulse repetition rate and suitable burst pulse energy to a transparent target, focusing said laser pulses from said laser beam source through a distributive-focus lens assembly comprising positive and negative lenses while having a positive focusing effect in the aggregate and being capable of producing a weakly convergent, multi foci spatial beam profile whereas the incident fluence at the target material is sufficient to cause Kerr-effect self-focusing and propagation, adjusting the relative distance and/or angle of said distributive focus lens assembly in relation to said laser beam source and said transparent target so as to focus said laser pulses in a distributed focus configuration creating a principal focal waist and at least one secondary focal waist, producing photoacoustic compression machining wherein said laser pulse energy delivered through said principal focal waist to said transparent target exceeds a critical power level necessary to initiate a Kerr-Effect induced self-focusing so that a filament is produced in said transparent target, photoacoustic compression machining, is initiated and then propagated in said transparent target by additional energy input to said transparent target through said secondary focal waist(s), and, total amount of pulse energy or fluence is applied to said transparent target at a spot where said laser pulses contact said transparent target, said spot being the point of initiation of machining on said transparent target, said total pulse energy or fluence is greater than the critical energy level required to initiate and propagate photoacoustic compression machining yet is lower than the threshold critical energy level required to initiate ablative or vaporization based machining.