A detection method for wafer level LED chips, wherein a wafer comprises a base substrate and a plurality of LED chips disposed on the base substrate, each of the LED chips comprises at least a testing pad (T1, T2), the detection method comprising: providing a transparent probe card comprising a plurality of contacts (P1, P2) corresponding to the testing pads (T1, T2); covering the wafer with the transparent probe card; characterized by electrically connecting the testing pads (T1, T2) via the contacts of the transparent probe card so as to perform a light-up test on the LED chips; performing an imaging process on light signals of the LED chips when the LED chips are lighted up so to form an image on a sensing element; performing a light filtering process, which comprises: providing a rotary disk on which a first filter, a second filter and a third filter are disposed; rotating the rotary disk for enabling the first filter to be disposed in an optical path of the light signals of the LED chips to form a first sub-image on the sensing element; rotating the rotary disk for enabling the second filter to be disposed in the optical path of the light signals of the LED chips to form a second sub-image on the sensing element; and rotating the rotary disk for enabling the third filter to be disposed in the optical path of the light signals of the LED chips to form a third sub-image on the sensing element; capturing the image and converting the image into an optical field information and a position information corresponding to each of the LED chips; obtaining a spectrum and luminous intensity of each of the LED chips according to the optical field information of each of the LED chips; and classifying the LED chips according to the spectrum and/or luminous intensity of each of the LED chips. providing a transparent probe card comprising a plurality of contacts (P1, P2) corresponding to the testing pads (T1, T2); covering the wafer with the transparent probe card; characterized by electrically connecting the testing pads (T1, T2) via the contacts of the transparent probe card so as to perform a light-up test on the LED chips; performing an imaging process on light signals of the LED chips when the LED chips are lighted up so to form an image on a sensing element; performing a light filtering process, which comprises: providing a rotary disk on which a first filter, a second filter and a third filter are disposed; rotating the rotary disk for enabling the first filter to be disposed in an optical path of the light signals of the LED chips to form a first sub-image on the sensing element; rotating the rotary disk for enabling the second filter to be disposed in the optical path of the light signals of the LED chips to form a second sub-image on the sensing element; and rotating the rotary disk for enabling the third filter to be disposed in the optical path of the light signals of the LED chips to form a third sub-image on the sensing element; capturing the image and converting the image into an optical field information and a position information corresponding to each of the LED chips; obtaining a spectrum and luminous intensity of each of the LED chips according to the optical field information of each of the LED chips; and classifying the LED chips according to the spectrum and/or luminous intensity of each of the LED chips. providing a rotary disk on which a first filter, a second filter and a third filter are disposed; rotating the rotary disk for enabling the first filter to be disposed in an optical path of the light signals of the LED chips to form a first sub-image on the sensing element; rotating the rotary disk for enabling the second filter to be disposed in the optical path of the light signals of the LED chips to form a second sub-image on the sensing element; and rotating the rotary disk for enabling the third filter to be disposed in the optical path of the light signals of the LED chips to form a third sub-image on the sensing element; capturing the image and converting the image into an optical field information and a position information corresponding to each of the LED chips; obtaining a spectrum and luminous intensity of each of the LED chips according to the optical field information of each of the LED chips; and classifying the LED chips according to the spectrum and/or luminous intensity of each of the LED chips.