A connector having a first conductor and a second conductor for connecting an internal circuit formed in a frame-shaped container and an external circuit provided outside of the container, comprising: a stacked body comprising a plurality of dielectric layers (1a, 1b, 1c, 1d, 1e, 1f) and having a first top surface, a second top surface positioned at a height different from that of the first top surface and a bottom surface positioned opposite to the second top surface; a first conductor comprising a first external connecting terminal (2a-1) disposed on the first top surface of the stacked body and for connecting to the external circuit, and a first internal connecting terminal (2a-2) disposed on the first top surface of the stacked body and for connecting to the internal circuit; and a second conductor comprising a second internal connecting terminal (2b-2) disposed on the second top surface and for connecting to the internal circuit, and a second external connecting terminal (2b-1) disposed on the bottom surface and for connecting to the external circuit, wherein the second conductor includes via hole conductor penetrating the dielectric layer, wherein the second conductor includes a primary second conductor (2b 1) and a secondary second conductor (2b 2), the secondary second conductor (2b 2) having a current capacity lower than that of the primary second conductor (2b 1), and the primary second conductor (2b 1) being disposed on the outside to interpose the secondary second conductor (2b 2), and wherein the second conductor has transmission path longer than that of the first conductor, wherein the first conductor is configured to transmit high-frequency signals, having a frequency of 10 GHz or more, while the second conductor is configured to transmit DC or low-frequency signals, having a frequency of 1 MHz or less, each of which have a lower frequency than those of the high-frequency signals, the connector further comprising a grounding conductor, provided on the first top surface, electrically connected to an external grounding circuit, adjoining the first conductor, and forming a coplanar transmission line of G (ground) - S (signal) - G (ground) or a differential-mode transmission line G (ground) - S (signal) - S (signal) - G (ground). a stacked body comprising a plurality of dielectric layers (1a, 1b, 1c, 1d, 1e, 1f) and having a first top surface, a second top surface positioned at a height different from that of the first top surface and a bottom surface positioned opposite to the second top surface; a first conductor comprising a first external connecting terminal (2a-1) disposed on the first top surface of the stacked body and for connecting to the external circuit, and a first internal connecting terminal (2a-2) disposed on the first top surface of the stacked body and for connecting to the internal circuit; and a first external connecting terminal (2a-1) disposed on the first top surface of the stacked body and for connecting to the external circuit, and a first internal connecting terminal (2a-2) disposed on the first top surface of the stacked body and for connecting to the internal circuit; and a second conductor comprising a second internal connecting terminal (2b-2) disposed on the second top surface and for connecting to the internal circuit, and a second external connecting terminal (2b-1) disposed on the bottom surface and for connecting to the external circuit, a second internal connecting terminal (2b-2) disposed on the second top surface and for connecting to the internal circuit, and a second external connecting terminal (2b-1) disposed on the bottom surface and for connecting to the external circuit, wherein the second conductor includes via hole conductor penetrating the dielectric layer, wherein the second conductor includes a primary second conductor (2b 1) and a secondary second conductor (2b 2), the secondary second conductor (2b 2) having a current capacity lower than that of the primary second conductor (2b 1), and the primary second conductor (2b 1) being disposed on the outside to interpose the secondary second conductor (2b 2), and wherein the second conductor has transmission path longer than that of the first conductor, wherein the first conductor is configured to transmit high-frequency signals, having a frequency of 10 GHz or more, while the second conductor is configured to transmit DC or low-frequency signals, having a frequency of 1 MHz or less, each of which have a lower frequency than those of the high-frequency signals, the connector further comprising a grounding conductor, provided on the first top surface, electrically connected to an external grounding circuit, adjoining the first conductor, and forming a coplanar transmission line of G (ground) - S (signal) - G (ground) or a differential-mode transmission line G (ground) - S (signal) - S (signal) - G (ground).