A stacked leaded array comprising: a multiplicity of individual electronic components (214, 230, C1 - C4) in a stacked array, wherein at least one of said individual electronic components is a multilayered ceramic capacitor (MLCC), and wherein each individual electronic component of said multiplicity of individual electronic components comprises a first external termination and a second external termination; a multiplicity of first leads wherein each first lead of said first leads is in electrical contact with at least one said first external termination; and a multiplicity of second leads (131, 166, 212, 215, 233, 258) wherein each second lead of said second leads is in electrical contact with one said second external termination; further comprising at least one flexible circuit interconnect (130, 160, 210, 232) wherein said interconnect is in at least one location selected from between one said first external termination and said first lead and between one said second external termination and said second lead and said interconnect comprises: a first side and a second side; component traces (132, 138, 144, 156, 162, 312, 404, 412) on said first side wherein said component traces are in electrical contact with one of said first external terminations or said second external terminations; lead traces (148, 149, 151, 152, 164, 212, 215, 310, 402, 414) on said second side wherein said lead traces are in electrical contact with one of said first leads or said second leads; and at least one through hole conductor (134, 142, 146, 150, 155, 165, 314, 406, 416) forming an electrical connection between at least one component trace of said component traces and at least one lead trace of said lead traces. a multiplicity of individual electronic components (214, 230, C1 - C4) in a stacked array, wherein at least one of said individual electronic components is a multilayered ceramic capacitor (MLCC), and wherein each individual electronic component of said multiplicity of individual electronic components comprises a first external termination and a second external termination; a multiplicity of first leads wherein each first lead of said first leads is in electrical contact with at least one said first external termination; and a multiplicity of second leads (131, 166, 212, 215, 233, 258) wherein each second lead of said second leads is in electrical contact with one said second external termination; further comprising at least one flexible circuit interconnect (130, 160, 210, 232) wherein said interconnect is in at least one location selected from between one said first external termination and said first lead and between one said second external termination and said second lead and said interconnect comprises: a first side and a second side; component traces (132, 138, 144, 156, 162, 312, 404, 412) on said first side wherein said component traces are in electrical contact with one of said first external terminations or said second external terminations; lead traces (148, 149, 151, 152, 164, 212, 215, 310, 402, 414) on said second side wherein said lead traces are in electrical contact with one of said first leads or said second leads; and at least one through hole conductor (134, 142, 146, 150, 155, 165, 314, 406, 416) forming an electrical connection between at least one component trace of said component traces and at least one lead trace of said lead traces. a first side and a second side; component traces (132, 138, 144, 156, 162, 312, 404, 412) on said first side wherein said component traces are in electrical contact with one of said first external terminations or said second external terminations; lead traces (148, 149, 151, 152, 164, 212, 215, 310, 402, 414) on said second side wherein said lead traces are in electrical contact with one of said first leads or said second leads; and at least one through hole conductor (134, 142, 146, 150, 155, 165, 314, 406, 416) forming an electrical connection between at least one component trace of said component traces and at least one lead trace of said lead traces.