A microelectronic assembly, comprising: a circuit panel having contacts exposed at a connection site of a major surface of the circuit panel, the contacts including: first, second, third, and fourth sets (A0, A0', A1', A1) of first contacts, signal assignments of the first set of first contacts being symmetric about a theoretical plane normal to the major surface with signal assignments of the second set of first contacts, signal assignments of the third set (A1') of first contacts being symmetric about the theoretical plane with signal assignments of the fourth set of first contacts, wherein each of the sets of first contacts is configured to carry identical signals; and a microelectronic package having a memory storage array and terminals exposed at a front surface of the microelectronic package, the terminals facing and coupled to the contacts of the circuit panel so that the front surface of the microelectronic package is normal to the theoretical plane, and wherein each of the sets (A0, A0', A1', A1) of first contacts is configured to carry address information sufficient to specify a location within the memory storage array, characterized in that the terminals include first terminals coupled to the first and fourth sets (A0, A1) of first contacts and no-connect terminals coupled to the second and third sets (A0', A1') of first contacts, the position of each first terminal on a first side of the theoretical plane being symmetric about the theoretical plane with a position of a no-connect terminal on a second side of the theoretical plane opposite from the first side, and the position of each first terminal on the second side being symmetric about the theoretical plane with a position of a no-connect terminal on the first side. a circuit panel having contacts exposed at a connection site of a major surface of the circuit panel, the contacts including: first, second, third, and fourth sets (A0, A0', A1', A1) of first contacts, signal assignments of the first set of first contacts being symmetric about a theoretical plane normal to the major surface with signal assignments of the second set of first contacts, signal assignments of the third set (A1') of first contacts being symmetric about the theoretical plane with signal assignments of the fourth set of first contacts, wherein each of the sets of first contacts is configured to carry identical signals; and a microelectronic package having a memory storage array and terminals exposed at a front surface of the microelectronic package, the terminals facing and coupled to the contacts of the circuit panel so that the front surface of the microelectronic package is normal to the theoretical plane, and wherein each of the sets (A0, A0', A1', A1) of first contacts is configured to carry address information sufficient to specify a location within the memory storage array, characterized in that the terminals include first terminals coupled to the first and fourth sets (A0, A1) of first contacts and no-connect terminals coupled to the second and third sets (A0', A1') of first contacts, the position of each first terminal on a first side of the theoretical plane being symmetric about the theoretical plane with a position of a no-connect terminal on a second side of the theoretical plane opposite from the first side, and the position of each first terminal on the second side being symmetric about the theoretical plane with a position of a no-connect terminal on the first side. first, second, third, and fourth sets (A0, A0', A1', A1) of first contacts, signal assignments of the first set of first contacts being symmetric about a theoretical plane normal to the major surface with signal assignments of the second set of first contacts, signal assignments of the third set (A1') of first contacts being symmetric about the theoretical plane with signal assignments of the fourth set of first contacts, wherein each of the sets of first contacts is configured to carry identical signals; and a microelectronic package having a memory storage array and terminals exposed at a front surface of the microelectronic package, the terminals facing and coupled to the contacts of the circuit panel so that the front surface of the microelectronic package is normal to the theoretical plane, and wherein each of the sets (A0, A0', A1', A1) of first contacts is configured to carry address information sufficient to specify a location within the memory storage array, characterized in that the terminals include first terminals coupled to the first and fourth sets (A0, A1) of first contacts and no-connect terminals coupled to the second and third sets (A0', A1') of first contacts, the position of each first terminal on a first side of the theoretical plane being symmetric about the theoretical plane with a position of a no-connect terminal on a second side of the theoretical plane opposite from the first side, and the position of each first terminal on the second side being symmetric about the theoretical plane with a position of a no-connect terminal on the first side.