A method for fabricating a solar module, the method comprising: - providing a plurality of rear contact solar cells having emitter contacts and base contacts on a rear surface of a semiconductor substrate and soldering pad arrangements (13, 15) applied on emitter contacts and on base contacts, wherein each soldering pad arrangement (13, 15) comprises one or more soldering pads (9, 11) arranged linearly and wherein the soldering pad arrangements (13, 15) are arranged on the rear surface of the semiconductor substrate asymmetrically with respect to a longitudinal axis of the semiconductor substrate; - separating each of the rear contact solar cells into first and second cell portions (19, 21) along a line perpendicular to the longitudinal axis of the semiconductor substrate; - arranging the plurality of first and second cell portions (19, 21) of the rear contact solar cells alternately along a line such that the second cell portions are arranged in a 180° orientation with respect to the first cell portions and such that soldering pad arrangements (13, 15) of emitter contacts and of base contacts of first cell portions are aligned with soldering pad arrangements (15, 13) of base contacts and of emitter contacts of second cell portions, respectively; - electrically connecting the plurality of first and second cell portions (19, 21) of the rear contact solar cells in series by arranging a linear ribbon-type connector strip on top of a linear soldering pad arrangement of an emitter contact of each first cell portion and on top of an aligned linear soldering pad arrangement of a base contact of a second cell portion neighboring the respective first cell portion on one side, and by arranging a linear ribbon-type connector strip on top of a linear soldering pad arrangement of a base contact of the respective first cell portion and on top of an aligned linear soldering pad arrangement of an emitter contact of a second cell portion neighboring the respective first cell portion on an opposite side, and by electrically connecting the connector strips to the underlying soldering pad arrangements (13, 15). - providing a plurality of rear contact solar cells having emitter contacts and base contacts on a rear surface of a semiconductor substrate and soldering pad arrangements (13, 15) applied on emitter contacts and on base contacts, wherein each soldering pad arrangement (13, 15) comprises one or more soldering pads (9, 11) arranged linearly and wherein the soldering pad arrangements (13, 15) are arranged on the rear surface of the semiconductor substrate asymmetrically with respect to a longitudinal axis of the semiconductor substrate; - separating each of the rear contact solar cells into first and second cell portions (19, 21) along a line perpendicular to the longitudinal axis of the semiconductor substrate; - arranging the plurality of first and second cell portions (19, 21) of the rear contact solar cells alternately along a line such that the second cell portions are arranged in a 180° orientation with respect to the first cell portions and such that soldering pad arrangements (13, 15) of emitter contacts and of base contacts of first cell portions are aligned with soldering pad arrangements (15, 13) of base contacts and of emitter contacts of second cell portions, respectively; - electrically connecting the plurality of first and second cell portions (19, 21) of the rear contact solar cells in series by arranging a linear ribbon-type connector strip on top of a linear soldering pad arrangement of an emitter contact of each first cell portion and on top of an aligned linear soldering pad arrangement of a base contact of a second cell portion neighboring the respective first cell portion on one side, and by arranging a linear ribbon-type connector strip on top of a linear soldering pad arrangement of a base contact of the respective first cell portion and on top of an aligned linear soldering pad arrangement of an emitter contact of a second cell portion neighboring the respective first cell portion on an opposite side, and by electrically connecting the connector strips to the underlying soldering pad arrangements (13, 15). arranging a linear ribbon-type connector strip on top of a linear soldering pad arrangement of an emitter contact of each first cell portion and on top of an aligned linear soldering pad arrangement of a base contact of a second cell portion neighboring the respective first cell portion on one side, and by arranging a linear ribbon-type connector strip on top of a linear soldering pad arrangement of a base contact of the respective first cell portion and on top of an aligned linear soldering pad arrangement of an emitter contact of a second cell portion neighboring the respective first cell portion on an opposite side, and by electrically connecting the connector strips to the underlying soldering pad arrangements (13, 15).