Component comprising a first substrate and a second substrate, wherein - at least one optoelectronic component containing at least one organic material is arranged on the first substrate, - the first substrate and the second substrate are arranged relative to one another such that the optoelectronic component is arranged between the first substrate and the second substrate, - a bonding material is arranged between the first substrate and the second substrate, which encloses the optoelectronic component and bonds the first and second substrates (1, 2) together mechanically, - the bonding material comprises silver oxide in a proportion of 20 to 70 wt.% inclusive, - the bonding material comprises at least one filler material, which reduces the coefficient of thermal expansion of the bonding material, wherein the filler material has a negative coefficient of thermal expansion and a proportion of the filler material in the bonding material is below 30 vol.%, - the bonding material comprises a lead-free glass and one component of said glass is vanadium oxide, - the substrates (1, 2) are produced from a soda lime glass - electrical feeds (8, 9) of the optoelectronic component take place on a surface of the first substrate facing the optoelectronic component, and one of the electrical feeds (8, 9) is guided from a contact of the optoelectronic component, which is located on the side of the optoelectronic component facing away from the first substrate, via a side face of the optoelectronic component to the first substrate, - the electrical feeds (8, 9) of the optoelectronic component are guided out of the bonding material, so that the bonding material is guided over the electrical feeds (8, 9) on the first substrate, and - the first substrate projects laterally beyond the second substrate, in a plan view of the second substrate, so that the first substrate has a larger base area than the second substrate. - at least one optoelectronic component containing at least one organic material is arranged on the first substrate, - the first substrate and the second substrate are arranged relative to one another such that the optoelectronic component is arranged between the first substrate and the second substrate, - a bonding material is arranged between the first substrate and the second substrate, which encloses the optoelectronic component and bonds the first and second substrates (1, 2) together mechanically, - the bonding material comprises silver oxide in a proportion of 20 to 70 wt.% inclusive, - the bonding material comprises at least one filler material, which reduces the coefficient of thermal expansion of the bonding material, wherein the filler material has a negative coefficient of thermal expansion and a proportion of the filler material in the bonding material is below 30 vol.%, - the bonding material comprises a lead-free glass and one component of said glass is vanadium oxide, - the substrates (1, 2) are produced from a soda lime glass - electrical feeds (8, 9) of the optoelectronic component take place on a surface of the first substrate facing the optoelectronic component, and one of the electrical feeds (8, 9) is guided from a contact of the optoelectronic component, which is located on the side of the optoelectronic component facing away from the first substrate, via a side face of the optoelectronic component to the first substrate, - the electrical feeds (8, 9) of the optoelectronic component are guided out of the bonding material, so that the bonding material is guided over the electrical feeds (8, 9) on the first substrate, and - the first substrate projects laterally beyond the second substrate, in a plan view of the second substrate, so that the first substrate has a larger base area than the second substrate.