An apparatus for preventing solder paste dripping, comprising: a working platform support apparatus; a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform bearing a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by means of the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle; and a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing, a height adjustment apparatus, with one end of the height adjustment apparatus being connected to the holder, and another end of the height adjustment apparatus being connected to the working platform support apparatus, configured to adjust the height of the holder relative to the working platform support apparatus and characterized in that: the height adjustment apparatus is a flat spiral spring, with a free end of the flat spiral spring being connected to the holder, and a spiral roll part of the flat spiral spring being mounted on the working platform support apparatus. a working platform support apparatus; a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform bearing a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by means of the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle; and a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing, a height adjustment apparatus, with one end of the height adjustment apparatus being connected to the holder, and another end of the height adjustment apparatus being connected to the working platform support apparatus, configured to adjust the height of the holder relative to the working platform support apparatus and characterized in that: the height adjustment apparatus is a flat spiral spring, with a free end of the flat spiral spring being connected to the holder, and a spiral roll part of the flat spiral spring being mounted on the working platform support apparatus.