A resistance soldering system, said system comprising: a power input channel, the power input channel receiving an alternating current from a power source; an ac to dc converter in electrical communication with the power input channel, the ac to dc converter converting a portion of the alternating current to a direct current at a converter output; one or more controller circuits in electrical communication with the converter output, the one or more controller circuits controlling a signal indicative of a desired power level delivered for a desired time; being further characterized by: a silicon-controlled-rectifier (SCR, 32) in electrical communication with the power input channel, the converter output, and the signal, the silicon-controlled rectifier controlling an SCR output voltage to an SCR output channel proportional to the signal; and a transformer having a primary side and a secondary side, the primary side in electrical communication with the SCR output channel, the transformer reducing the SCR output voltage from the primary side to a secondary voltage on the secondary side; and a pair of output leads in electrical communication with poles of the secondary side of the transformer, the pair of output leads configured to apply the secondary voltage to a solder joint disposed between the pair of output leads; wherein the one or more controller circuits determine the signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time, thereby melting the solder joint disposed between the pair of output leads. a power input channel, the power input channel receiving an alternating current from a power source; an ac to dc converter in electrical communication with the power input channel, the ac to dc converter converting a portion of the alternating current to a direct current at a converter output; one or more controller circuits in electrical communication with the converter output, the one or more controller circuits controlling a signal indicative of a desired power level delivered for a desired time; being further characterized by: a silicon-controlled-rectifier (SCR, 32) in electrical communication with the power input channel, the converter output, and the signal, the silicon-controlled rectifier controlling an SCR output voltage to an SCR output channel proportional to the signal; and a transformer having a primary side and a secondary side, the primary side in electrical communication with the SCR output channel, the transformer reducing the SCR output voltage from the primary side to a secondary voltage on the secondary side; and a pair of output leads in electrical communication with poles of the secondary side of the transformer, the pair of output leads configured to apply the secondary voltage to a solder joint disposed between the pair of output leads; wherein the one or more controller circuits determine the signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time, thereby melting the solder joint disposed between the pair of output leads. a silicon-controlled-rectifier (SCR, 32) in electrical communication with the power input channel, the converter output, and the signal, the silicon-controlled rectifier controlling an SCR output voltage to an SCR output channel proportional to the signal; and a transformer having a primary side and a secondary side, the primary side in electrical communication with the SCR output channel, the transformer reducing the SCR output voltage from the primary side to a secondary voltage on the secondary side; and a pair of output leads in electrical communication with poles of the secondary side of the transformer, the pair of output leads configured to apply the secondary voltage to a solder joint disposed between the pair of output leads; wherein the one or more controller circuits determine the signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time, thereby melting the solder joint disposed between the pair of output leads.