A photovoltaic cell comprising: a base substrate comprising silicon and including an upper doped region; a coating layer disposed on said upper doped region of said base substrate and having an outer surface; a plurality of fingers spaced from each other and disposed in said coating layer and each of said fingers having a lower portion in electrical contact with said upper doped region of said base substrate, and an upper portion opposite said lower portion extending outwardly through said outer surface of said coating layer, with each of said fingers comprising a first metal present in each of said fingers in a majority amount; a busbar spaced from said upper doped region of said base substrate such that said upper doped region of said base substrate is free of physical contact with said busbar, with said busbar in electrical contact with said upper portions of said fingers and comprising a second metal present in said busbar in a majority amount, wherein said upper doped region of said base substrate is in electrical communication with said busbar via said fingers, and characterized in that it further comprises: i) a plurality of supplemental fingers disposed over and in electrical contact with said plurality of fingers, with each of said supplemental fingers comprising silver or copper present in each of said supplemental fingers in a majority amount, and wherein said supplemental fingers are different from said plurality of fingers; ii) a supplemental busbar disposed over and in electrical contract with said busbar, and wherein said supplemental busbar is different from said busbar; or iii) both i) and ii). a base substrate comprising silicon and including an upper doped region; a coating layer disposed on said upper doped region of said base substrate and having an outer surface; a plurality of fingers spaced from each other and disposed in said coating layer and each of said fingers having a lower portion in electrical contact with said upper doped region of said base substrate, and an upper portion opposite said lower portion extending outwardly through said outer surface of said coating layer, with each of said fingers comprising a first metal present in each of said fingers in a majority amount; a busbar spaced from said upper doped region of said base substrate such that said upper doped region of said base substrate is free of physical contact with said busbar, with said busbar in electrical contact with said upper portions of said fingers and comprising a second metal present in said busbar in a majority amount, wherein said upper doped region of said base substrate is in electrical communication with said busbar via said fingers, and characterized in that it further comprises: i) a plurality of supplemental fingers disposed over and in electrical contact with said plurality of fingers, with each of said supplemental fingers comprising silver or copper present in each of said supplemental fingers in a majority amount, and wherein said supplemental fingers are different from said plurality of fingers; ii) a supplemental busbar disposed over and in electrical contract with said busbar, and wherein said supplemental busbar is different from said busbar; or iii) both i) and ii). i) a plurality of supplemental fingers disposed over and in electrical contact with said plurality of fingers, with each of said supplemental fingers comprising silver or copper present in each of said supplemental fingers in a majority amount, and wherein said supplemental fingers are different from said plurality of fingers; ii) a supplemental busbar disposed over and in electrical contract with said busbar, and wherein said supplemental busbar is different from said busbar; or iii) both i) and ii).