A method, comprising: arranging at least one semiconductor chip on a die pad in a substrate, the substrate comprising at least one electrically conductive pad adjacent to the die pad, positioning at least one electrically conductive clip in a bridge-like position between the at least one semiconductor chip and the at least one electrically conductive pad, wherein, in said bridge-like position, the at least one electrically conductive clip has coupling surfaces facing towards the at least one semiconductor chip and the at least one electrically conductive pad, and soldering the at least one electrically conductive clip in said bridge-like position to the at least one semiconductor chip and to the at least one electrically conductive pad to provide electrical coupling therebetween, wherein soldering is via soldering material at said coupling surfaces, wherein the method comprises, prior to positioning the at least one electrically conductive clip in a bridge-like position between the at least one semiconductor chip and the at least one electrically conductive pad, providing at least one pair of complementary positioning formations (100, 102) including a cavity in the at least one electrically conductive clip and a protrusion in at least one of the at least one semiconductor chip and the at least one electrically conductive pad, wherein, with the at the least one electrically conductive clip in said bridge-like position, the complementary positioning formations (100, 102) are mutually engaged and maintain the at least one electrically conductive clip in said bridge-like position during said soldering, characterised in that the protrusion in the at least one pair of complementary positioning formations (100, 102) includes a plurality of stacked stud bumps. arranging at least one semiconductor chip on a die pad in a substrate, the substrate comprising at least one electrically conductive pad adjacent to the die pad, positioning at least one electrically conductive clip in a bridge-like position between the at least one semiconductor chip and the at least one electrically conductive pad, wherein, in said bridge-like position, the at least one electrically conductive clip has coupling surfaces facing towards the at least one semiconductor chip and the at least one electrically conductive pad, and soldering the at least one electrically conductive clip in said bridge-like position to the at least one semiconductor chip and to the at least one electrically conductive pad to provide electrical coupling therebetween, wherein soldering is via soldering material at said coupling surfaces, wherein the method comprises, prior to positioning the at least one electrically conductive clip in a bridge-like position between the at least one semiconductor chip and the at least one electrically conductive pad, providing at least one pair of complementary positioning formations (100, 102) including a cavity in the at least one electrically conductive clip and a protrusion in at least one of the at least one semiconductor chip and the at least one electrically conductive pad, wherein, with the at the least one electrically conductive clip in said bridge-like position, the complementary positioning formations (100, 102) are mutually engaged and maintain the at least one electrically conductive clip in said bridge-like position during said soldering, characterised in that the protrusion in the at least one pair of complementary positioning formations (100, 102) includes a plurality of stacked stud bumps.