Method for cutting and collecting dissected pieces from specimens, having the following steps: mounting a specimen on a slide of a laser dissection microscope, which is movable in its plane, centring a raised collecting and adhesion device on the optical axis, moving the slide to a position P at which the first piece to be cut is located in the optical axis, lowering the collecting and adhesion device, which is centred on the optical axis, onto the specimen, wherein the collection and adhesion device in the lowered state sticks to the specimen, is freely movable with the slide and is uncoupled from the optical axis of the microscope, and in the raised state is fixed relative to the optical axis, cutting one or more pieces out of the specimen, wherein, when the next piece to be cut is located outside a given collecting radius of the collecting and adhesion device, the following steps are performed: raising the collecting and adhesion device, moving the slide to a position P-D relative to the optical axis of the microscope, wherein the centre of the next piece to be cut is placed off-centre from the optical axis of the microscope by a distance D such that, after lowering of the collecting and adhesion device, the dissected piece does not encounter a section which has already been removed on the collecting and adhesion device, lowering the collecting and adhesion device onto the specimen, moving the slide to a predetermined position at which the piece to be cut is located in the optical axis and cutting one or more of the next pieces, wherein, after each time the device is raised, the position P-D is remote from all previously defined positions by at least the distance D. mounting a specimen on a slide of a laser dissection microscope, which is movable in its plane, centring a raised collecting and adhesion device on the optical axis, moving the slide to a position P at which the first piece to be cut is located in the optical axis, lowering the collecting and adhesion device, which is centred on the optical axis, onto the specimen, wherein the collection and adhesion device in the lowered state sticks to the specimen, is freely movable with the slide and is uncoupled from the optical axis of the microscope, and in the raised state is fixed relative to the optical axis, cutting one or more pieces out of the specimen, wherein, when the next piece to be cut is located outside a given collecting radius of the collecting and adhesion device, the following steps are performed: raising the collecting and adhesion device, moving the slide to a position P-D relative to the optical axis of the microscope, wherein the centre of the next piece to be cut is placed off-centre from the optical axis of the microscope by a distance D such that, after lowering of the collecting and adhesion device, the dissected piece does not encounter a section which has already been removed on the collecting and adhesion device, lowering the collecting and adhesion device onto the specimen, moving the slide to a predetermined position at which the piece to be cut is located in the optical axis and cutting one or more of the next pieces, raising the collecting and adhesion device, moving the slide to a position P-D relative to the optical axis of the microscope, wherein the centre of the next piece to be cut is placed off-centre from the optical axis of the microscope by a distance D such that, after lowering of the collecting and adhesion device, the dissected piece does not encounter a section which has already been removed on the collecting and adhesion device, lowering the collecting and adhesion device onto the specimen, moving the slide to a predetermined position at which the piece to be cut is located in the optical axis and cutting one or more of the next pieces, wherein, after each time the device is raised, the position P-D is remote from all previously defined positions by at least the distance D.