A magnetron sputtering device comprising: a planetary drive system having a central rotation axis C for primary rotation, and arranged to support a plurality of planets, each planet having a secondary rotation axis at a planet center point C s, and each planet having a coating area described by a planet radius r W, the planetary drive system having a carrier radius r C from the central rotation axis C to each planet center point C s; a cathode including a ring shaped target comprising material for forming a coating, the cathode having a cathode center point Cc; a chamber arranged to house the cathode and the planetary drive system, adapted to be evacuated in operation; and a gas delivery system arranged to provide, in operation, a flow of sputtering gas into the chamber; wherein the cathode is ring shaped, and has an outer cathode radius r 2 greater than the planet radius r W, r 2 > r W, and an inner cathode radius r 1 of between one quarter of the outer cathode radius r 2 and one times the outer cathode radius r 2, 1/4 ∗ r 2 < r 1 < r 2; wherein, in operation, the cathode center point Cc is disposed at an offset distance r T of between two thirds of the carrier radius r C and four thirds of the carrier radius r C from the central rotation axis C, 2/3 ∗ r C < r T < 4/3 ∗ r C, and the offset distance r T is greater than one half of the outer cathode radius r 2, r T > 1/2 ∗ r 2; and wherein, in operation, a vertical throw distance h from a target surface plane to a planet surface plane is between one third of the outer cathode radius r 2 and one times the outer cathode radius r 2, 1/3 ∗ r 2 < h < r 2. a planetary drive system having a central rotation axis C for primary rotation, and arranged to support a plurality of planets, each planet having a secondary rotation axis at a planet center point C s, and each planet having a coating area described by a planet radius r W, the planetary drive system having a carrier radius r C from the central rotation axis C to each planet center point C s; a cathode including a ring shaped target comprising material for forming a coating, the cathode having a cathode center point Cc; a chamber arranged to house the cathode and the planetary drive system, adapted to be evacuated in operation; and a gas delivery system arranged to provide, in operation, a flow of sputtering gas into the chamber; wherein the cathode is ring shaped, and has an outer cathode radius r 2 greater than the planet radius r W, r 2 > r W, and an inner cathode radius r 1 of between one quarter of the outer cathode radius r 2 and one times the outer cathode radius r 2, 1/4 ∗ r 2 < r 1 < r 2; wherein, in operation, the cathode center point Cc is disposed at an offset distance r T of between two thirds of the carrier radius r C and four thirds of the carrier radius r C from the central rotation axis C, 2/3 ∗ r C < r T < 4/3 ∗ r C, and the offset distance r T is greater than one half of the outer cathode radius r 2, r T > 1/2 ∗ r 2; and wherein, in operation, a vertical throw distance h from a target surface plane to a planet surface plane is between one third of the outer cathode radius r 2 and one times the outer cathode radius r 2, 1/3 ∗ r 2 < h < r 2.