mhurhangee/ep-ind-claims huggingface dataset:
A method of making a device including a transponder antenna connected to contact pads, said method comprising the steps of: - making an antenna having connection end portions (7b, 8b) resting on a substrate; - transferring the contact pads (5, 6) to the substrate and connecting them to the end portions (7b, 8b) of the antenna, the connection being made in the form of bonding by applying energy between the pads (5, 6) and the end portions (7b, 8b); said method being characterized in that the pads (5, 6) are transferred in such a manner that each of them has a surface facing a respective connection end portion (7b, 8b) of the antenna, the bonding energy being applied directly to the pads (5, 6). - making an antenna having connection end portions (7b, 8b) resting on a substrate; - transferring the contact pads (5, 6) to the substrate and connecting them to the end portions (7b, 8b) of the antenna, the connection being made in the form of bonding by applying energy between the pads (5, 6) and the end portions (7b, 8b);
Slide fastening device for a roller shutter system intended to be installed in front of an opening of a building and provided with a profile and at least one slide attached to the profile intended to receive a part of a shutter when the latter is deployed, said slide fastening device including a first fastening element provided with a first fastening section intended to be fastened to the profile and/or to the slide and a first connecting section, and a second fastening element provided with a second fastening section intended to be attached to a wall of the building adjoining the opening and a second connecting section being intended to be connected to the first connecting section, the first connecting section and the second connecting section being adapted to be connected to one another in several connection positions distinct from one another, said fastening device including means for securing the first connecting section of the first fastening element to the second connecting section of the second fastening element, characterised in that said securing means are designed to adjust the position of the second connecting section of the second fastening element with respect to the first connecting section of the first fastening element in the depth P and width L dimensions extending in a plane perpendicular to the profile and/or the slide.
A generator stator, comprising: a housing arranged along a rotation axis; a sleeve seated in the housing and extending about the rotation axis; an armature body with a current coil, the armature body seated within the sleeve; and a shim including an annular body arranged between the sleeve and the housing, wherein the shim fixes the sleeve radially relative to the housing to reduce diameter of a housing bore defined by the stator housing; wherein the interior of the housing defines a coolant circuit with at least one outlet in fluid communication with the housing bore, wherein the housing defines a plurality of circumferential grooves within the surface of the housing and bounding the housing bore for circulating coolant and removing heat from the current coil through the armature body, the sleeve and the shim; and characterized in that the annular body of the shim is interrupted by a longitudinal slot, wherein the slot is arranged on a side of the rotation axis opposite the coolant outlet. a housing arranged along a rotation axis; a sleeve seated in the housing and extending about the rotation axis; an armature body with a current coil, the armature body seated within the sleeve; and a shim including an annular body arranged between the sleeve and the housing, wherein the shim fixes the sleeve radially relative to the housing to reduce diameter of a housing bore defined by the stator housing; wherein the interior of the housing defines a coolant circuit with at least one outlet in fluid communication with the housing bore, wherein the housing defines a plurality of circumferential grooves within the surface of the housing and bounding the housing bore for circulating coolant and removing heat from the current coil through the armature body, the sleeve and the shim; and characterized in that the annular body of the shim is interrupted by a longitudinal slot, wherein the slot is arranged on a side of the rotation axis opposite the coolant outlet.
A triboelectric generator comprising: a first electrode and a second electrode spaced apart from each other; a first charging part and a second charging part, the first charging part being on the first electrode, the first charging part being configured to be charged a first polarity due to contact with the second charging part, the second charging part being configured to slide on a surface of the first charging part, the second charging part being configured to be charged with a second polarity that opposite to the first polarity through contact with the first charging part; characterized in comprising also a grounding unit configured to intermittently connect the second charging part to a charge reservoir according to movement of the second charging part. a first electrode and a second electrode spaced apart from each other; a first charging part and a second charging part, the first charging part being on the first electrode, the first charging part being configured to be charged a first polarity due to contact with the second charging part, the second charging part being configured to slide on a surface of the first charging part, the second charging part being configured to be charged with a second polarity that opposite to the first polarity through contact with the first charging part; characterized in comprising also the second charging part being configured to slide on a surface of the first charging part, the second charging part being configured to be charged with a second polarity that opposite to the first polarity through contact with the first charging part; characterized in comprising also a grounding unit configured to intermittently connect the second charging part to a charge reservoir according to movement of the second charging part.
A female connector (20; 120) for supplying received power, comprising a recess configured to receive a male connector (10; 110) in an axial insertion direction; a plurality of terminals (21, 22) including power terminals for supplying the power; and a locking mechanism (80; 180) configured to lock the male connector that is inserted into the recess in a mated state, and a switching mechanism configured to supply the received power to the power terminals in an ON state and to insulate the power terminals from the received power in an OFF state, wherein the switching mechanism is permitted to make a transition to the ON state only when the locking mechanism is locking the male connector in the mated state; characterized in that the locking mechanism locks the male connector, and the switching mechanism switches on, in response to the said axial insertion of the male connector into the recess.
A fluorine-containing polymer aqueous dispersion in which a fluorine-containing polymer is dispersed using, as an emulsifier, a polyfluoroalkylphosphonic acid salt represented by the general formula: C n F 2n+1 (CH 2 CF 2) a (CF 2 CF 2) b (CH 2 CH 2) c P (OM 1)(OM 2) wherein M 1 is a hydrogen atom, an alkali metal, an ammonium base, or an organic amine base, M 2 is an alkali metal, an ammonium base, or an organic amine base, n is an integer of 1 to 6, a is an integer of 1 to 4, b is an integer of 1 to 3, and c is an integer of 1 to 3.
A solid-state back illuminated imaging sensor comprising: a substrate; and an imaging element layer having a plurality of imaging elements, the imaging element layer located between the substrate and a wiring layer having a plurality of wiring lines (31, 41, 41') comprising wiring lines which are electrically connected and dummy wiring lines (41, 41') which are not electrically connected, wherein the dummy wiring lines (41, 41') of the wiring layer are arranged in pixel regions below one or more imaging elements configured to receive light having a wavelength less than a predetermined wavelength, the predetermined wavelength being any wavelength of 400 to 600 nm, the wiring lines which are electrically connected are arranged in a peripheral portion of the pixel regions, the wiring lines which are electrically connected are located in an upper most layer of the wiring layer, where upper most refers to the direction in which the substrate, the imaging element layer and the wiring layer are stacked on each other, and the dummy wiring lines (41, 41') of the wiring layer are not arranged in pixel regions configured to receive light having a wavelength greater than the predetermined wavelength, the solid-state back illuminated imaging sensor being characterized in that the dummy wiring lines (41, 41') are located in the upper most layer of the wiring layer, and the dummy wiring lines (41, 41') of the upper most layer of the wiring layer are distributed within the wiring layer such that a wiring density is equal. a substrate; and an imaging element layer having a plurality of imaging elements, the imaging element layer located between the substrate and a wiring layer having a plurality of wiring lines (31, 41, 41') comprising wiring lines which are electrically connected and dummy wiring lines (41, 41') which are not electrically connected, wherein the dummy wiring lines (41, 41') of the wiring layer are arranged in pixel regions below one or more imaging elements configured to receive light having a wavelength less than a predetermined wavelength, the predetermined wavelength being any wavelength of 400 to 600 nm, the wiring lines which are electrically connected are arranged in a peripheral portion of the pixel regions, the wiring lines which are electrically connected are located in an upper most layer of the wiring layer, where upper most refers to the direction in which the substrate, the imaging element layer and the wiring layer are stacked on each other, and the dummy wiring lines (41, 41') of the wiring layer are not arranged in pixel regions configured to receive light having a wavelength greater than the predetermined wavelength, the solid-state back illuminated imaging sensor being characterized in that the dummy wiring lines (41, 41') are located in the upper most layer of the wiring layer, and the dummy wiring lines (41, 41') of the upper most layer of the wiring layer are distributed within the wiring layer such that a wiring density is equal.
Measurement tool for measuring the interior of an article of clothing, comprising at least one inner support member, at least one inlet opening, arranged in a first plane of the measurement tool and extending into the support member, at least one outlet opening, arranged in a second plane of the measurement tool and extending out of the support member, wherein the at least one outlet opening is connected to the at least one inlet opening via at least one connecting passage, further comprising at least one holding member enclosing the support member, and a cavity, which is arranged inbetween the at least one support member and the at least one holding member, and which is connected fluidically to the at least one outlet opening.
A transistor arrangement comprising; an electrically conductive substrate; a semiconductor body including a transistor structure, the transistor structure including a source terminal connected to said substrate; a bond pad (6,9) providing a connection to the transistor structure configured to receive a bond wire (5,8); wherein the semiconductor body includes an RF-return current path (12,13) for carrying return current associated with said bond wire, said RF-return current path comprising a strip of metal arranged on said body, said strip configured such that it extends beneath said bond pad and is connected to said source terminal of the transistor structure.
Disassemblable hinge comprising: - a fixed assembly adapted to be associated with a frame, and comprising a pin defining an axis of rotation of the hinge; and - a movable assembly adapted to be associated with a door, rotatably mounted on said fixed assembly with reference to said axis of rotation of the hinge; said movable assembly comprising: - an engagement portion adapted to be fastened to the door, - a first rotatable member rotatably constrained to the engagement portion, - a first slide slidably mounted to the engagement portion; wherein said movable assembly is configured to take: - a hinged configuration, in which the first slide and the engagement portion form a seat for the pin, wherein the movable assembly is only rotatable about said pin; - a fully open configuration, in which the movable assembly is removable from the fixed assembly; - a partially open configuration, in which the movable assembly can translate transversally to the pin with a limited stroke; wherein the first rotatable member is configured to move the first slide, thereby moving said movable assembly from the hinged configuration to the partially open configuration; characterized in that said movable assembly comprises a second slide slidably mounted to the engagement portion; in the partially open configuration, said pin is held between the second slide and the engagement portion; in order to reach the fully open condition, a user must drag the second slide by acting against a preload or by acting against retaining means adapted to counter the transition towards said fully open condition. - a fixed assembly adapted to be associated with a frame, and comprising a pin defining an axis of rotation of the hinge; and - a movable assembly adapted to be associated with a door, rotatably mounted on said fixed assembly with reference to said axis of rotation of the hinge; said movable assembly comprising: - an engagement portion adapted to be fastened to the door, - a first rotatable member rotatably constrained to the engagement portion, - a first slide slidably mounted to the engagement portion; - a hinged configuration, in which the first slide and the engagement portion form a seat for the pin, wherein the movable assembly is only rotatable about said pin; - a fully open configuration, in which the movable assembly is removable from the fixed assembly; - a partially open configuration, in which the movable assembly can translate transversally to the pin with a limited stroke;
Process for producing a polycarbonate by the melt transesterification process comprising at least the following steps: (a)dissolving a monophenol in an aqueous phase and dissolving a carbonyl halide in an organic solvent, (b)reacting the monophenol dissolved in the aqueous phase with the carbonyl halide dissolved in the organic solvent to give a diaryl carbonate dissolved in the organic solvent, (c)feeding this diaryl carbonate dissolved in the organic solvent to step (d), (d)removing the organic solvent from the diaryl carbonate obtained in step (b) and feeding this diaryl carbonate to step (e) and recycling the organic solvent to step (a), (e) reacting one or more diphenols with the diaryl carbonate from step (d) to give a polycarbonate and a monophenol, wherein the organic solvent comprises the following components: Methylene chloride 0 to 99.65% by weight, Chlorobenzene 0 to 99.65% by weight Chloroform 0 to 99.65% by weight Chloroethane 0.3 to 10% by weight, Tetrachloromethane 0.05 to 7.0% by weight, other components 0 to 2.0% by weight, wherein the sum total of the contents of methylene chloride, chlorobenzene and chloroform is at least 81.00% by weight and at most 99.65% by weight, and wherein the sum total of the contents of methylene chloride, chlorobenzene and chloroform is made up to 100% by weight by the sum total of the contents of chloroethane, tetrachloromethane and the other components. (a)dissolving a monophenol in an aqueous phase and dissolving a carbonyl halide in an organic solvent, (b)reacting the monophenol dissolved in the aqueous phase with the carbonyl halide dissolved in the organic solvent to give a diaryl carbonate dissolved in the organic solvent, (c)feeding this diaryl carbonate dissolved in the organic solvent to step (d), (d)removing the organic solvent from the diaryl carbonate obtained in step (b) and feeding this diaryl carbonate to step (e) and recycling the organic solvent to step (a), (e) reacting one or more diphenols with the diaryl carbonate from step (d) to give a polycarbonate and a monophenol, wherein the organic solvent comprises the following components: Methylene chloride 0 to 99.65% by weight, Chlorobenzene 0 to 99.65% by weight Chloroform 0 to 99.65% by weight Chloroethane 0.3 to 10% by weight, Tetrachloromethane 0.05 to 7.0% by weight, other components 0 to 2.0% by weight, wherein the sum total of the contents of methylene chloride, chlorobenzene and chloroform is at least 81.00% by weight and at most 99.65% by weight, and wherein the sum total of the contents of methylene chloride, chlorobenzene and chloroform is made up to 100% by weight by the sum total of the contents of chloroethane, tetrachloromethane and the other components. wherein the sum total of the contents of methylene chloride, chlorobenzene and chloroform is at least 81.00% by weight and at most 99.65% by weight, and wherein the sum total of the contents of methylene chloride, chlorobenzene and chloroform is made up to 100% by weight by the sum total of the contents of chloroethane, tetrachloromethane and the other components.
A power converter comprising: a first rectifier circuit comprising a first positive output terminal (140A, 240A) and a first negative output terminal and a second rectifier circuit comprising a second positive output terminal and a second negative output terminal (140B, 240B); a snubber circuit (130A, 130B; 230A, 230B; 330A, 330B) comprising a first diode, and a first capacitor connected to each other at a first node and connecting the first positive output terminal (140A, 240A) and the first negative output terminal, a second diode and a second capacitor connected to each other at a second node and connecting the second positive output terminal and the second negative output terminal (140B, 240B), a third diode connecting the first node to the second negative output terminal (140B, 240B); and a fourth diode connecting the second node to the first positive output terminal (140A, 240A); I wherein the first diode and the first capacitor are connected in series; the second diode and the second capacitor are connected in series; and a first filter inductor, comprising a first and a second terminal, configured to connect the first negative output terminal directly to a midpoint node, with said first and second terminal respectively, and a second filter inductor, comprising a third and a fourth terminal, configured to connect the second positive output terminal directly to the midpoint node, with said third and fourth terminal respectively. a first rectifier circuit comprising a first positive output terminal (140A, 240A) and a first negative output terminal and a second rectifier circuit comprising a second positive output terminal and a second negative output terminal (140B, 240B); a snubber circuit (130A, 130B; 230A, 230B; 330A, 330B) comprising a first diode, and a first capacitor connected to each other at a first node and connecting the first positive output terminal (140A, 240A) and the first negative output terminal, a second diode and a second capacitor connected to each other at a second node and connecting the second positive output terminal and the second negative output terminal (140B, 240B), a third diode connecting the first node to the second negative output terminal (140B, 240B); and a fourth diode connecting the second node to the first positive output terminal (140A, 240A); I wherein the first diode and the first capacitor are connected in series; the second diode and the second capacitor are connected in series; and a first filter inductor, comprising a first and a second terminal, configured to connect the first negative output terminal directly to a midpoint node, with said first and second terminal respectively, and a second filter inductor, comprising a third and a fourth terminal, configured to connect the second positive output terminal directly to the midpoint node, with said third and fourth terminal respectively.
A method for drilling a borehole into a subterranean formation while continuously treating for lost returns, the method comprising: determining a width of a fracture in a wellbore wall of a wellbore in a formation; preparing a drilling fluid, the drilling fluid comprising an initial solids content of at least about 10 percent by volume in a carrier fluid, wherein the solids content and the carrier fluid are selected such that the drilling fluid API spurt loss is greater than 10 ml concentrating the solids content of the drilling fluid into an immobile mass in the fracture; wherein the solids content consists essentially of substantially impermeable particles greater than about 30 microns and permeable particles of any size, wherein the solids have a size distribution selected based at least in part on the determined width of the fracture; and wherein at least 50 percent of the solids have a size less than the determined width of the fracture; and drilling while continuously treating for lost returns the wellbore into the formation using the drilling fluid. determining a width of a fracture in a wellbore wall of a wellbore in a formation; preparing a drilling fluid, the drilling fluid comprising an initial solids content of at least about 10 percent by volume in a carrier fluid, wherein the solids content and the carrier fluid are selected such that the drilling fluid API spurt loss is greater than 10 ml concentrating the solids content of the drilling fluid into an immobile mass in the fracture; wherein the solids content consists essentially of substantially impermeable particles greater than about 30 microns and permeable particles of any size, wherein the solids have a size distribution selected based at least in part on the determined width of the fracture; and wherein at least 50 percent of the solids have a size less than the determined width of the fracture; and drilling while continuously treating for lost returns the wellbore into the formation using the drilling fluid.
A method of treating a sheet of semiconducting material, comprising: forming a sinterable first layer over each major surface of a sheet of semiconducting material; forming a second layer over each of the first layers to form a particle-coated semiconductor sheet; placing the particle-coated sheet between end members; heating the particle-coated sheet to a temperature effective to at least partially sinter the first layer and at least partially melt the semiconducting material; and cooling the particle-coated sheet to solidify the semiconducting material and form a treated sheet of semiconducting material. forming a sinterable first layer over each major surface of a sheet of semiconducting material; forming a second layer over each of the first layers to form a particle-coated semiconductor sheet; placing the particle-coated sheet between end members; heating the particle-coated sheet to a temperature effective to at least partially sinter the first layer and at least partially melt the semiconducting material; and cooling the particle-coated sheet to solidify the semiconducting material and form a treated sheet of semiconducting material.