A method for manufacturing a heat dissipation structure of an electronic element, comprising: placing a substrate having an electronic element in an environment that meets a preset temperature condition; and in the environment that meets the preset temperature condition, covering a periphery of the electronic element with a heat dissipation cover, fixedly connecting the heat dissipation cover to the substrate, and placing a solid-state phase-change thermally conductive material in an accommodation cavity surrounded by the substrate and the heat dissipation cover; the covering a periphery of the electronic element with a heat dissipation cover, fixedly connecting the heat dissipation cover to the substrate, and placing a solid-state phase-change thermally conductive material in an accommodation cavity surrounded by the substrate and the heat dissipation cover comprises: after the phase-change thermally conductive material is constructed into a sheet-like structure, sticking the sheet-like structure to an inner surface of a top wall of the heat dissipation cover, to form an integrated structure; and covering the periphery of the electronic element with the integrated structure, and fixedly connecting the integrated structure to the substrate, wherein an opening is disposed on the top wall, an avoidance hole is disposed on the sheet-like structure, and the manufacturing method further comprises: attaching a heat dissipation module to the top wall, and enabling a protruding thermally conductive column on an outer wall of the heat dissipation module to sequentially pass through the opening and the avoidance hole and extend into the accommodation cavity. placing a substrate having an electronic element in an environment that meets a preset temperature condition; and in the environment that meets the preset temperature condition, covering a periphery of the electronic element with a heat dissipation cover, fixedly connecting the heat dissipation cover to the substrate, and placing a solid-state phase-change thermally conductive material in an accommodation cavity surrounded by the substrate and the heat dissipation cover; the covering a periphery of the electronic element with a heat dissipation cover, fixedly connecting the heat dissipation cover to the substrate, and placing a solid-state phase-change thermally conductive material in an accommodation cavity surrounded by the substrate and the heat dissipation cover comprises: after the phase-change thermally conductive material is constructed into a sheet-like structure, sticking the sheet-like structure to an inner surface of a top wall of the heat dissipation cover, to form an integrated structure; and covering the periphery of the electronic element with the integrated structure, and fixedly connecting the integrated structure to the substrate, wherein an opening is disposed on the top wall, an avoidance hole is disposed on the sheet-like structure, and the manufacturing method further comprises: attaching a heat dissipation module to the top wall, and enabling a protruding thermally conductive column on an outer wall of the heat dissipation module to sequentially pass through the opening and the avoidance hole and extend into the accommodation cavity. after the phase-change thermally conductive material is constructed into a sheet-like structure, sticking the sheet-like structure to an inner surface of a top wall of the heat dissipation cover, to form an integrated structure; and covering the periphery of the electronic element with the integrated structure, and fixedly connecting the integrated structure to the substrate, wherein an opening is disposed on the top wall, an avoidance hole is disposed on the sheet-like structure, and the manufacturing method further comprises: attaching a heat dissipation module to the top wall, and enabling a protruding thermally conductive column on an outer wall of the heat dissipation module to sequentially pass through the opening and the avoidance hole and extend into the accommodation cavity.