An electronic component, comprising: a package that houses an electronic device, wherein the package includes a base body having a central region to which the electronic device is fixed and a peripheral region located at a side of an outer edge of the base body with respect to the central region in a first direction, a lid body that faces the electronic device to form a space between the base body and the lid body in a second direction, the second direction being perpendicular to the first direction, wherein the space has a dimension in the second direction defined by a distance between an inner surface of the lid body and a front surface of the electronic device facing the lid body, and a frame body that encloses at least the space between the base body and the lid body, wherein the frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in the first direction from the inner edge of the frame body toward the outer edge of the frame body, wherein the first portion is arranged between the peripheral region of the base body and the lid body in the second direction, wherein the second portion has a greater length in the first direction than a length of the first portion in the first direction, wherein the frame body has a greater thermal conductivity than a thermal conductivity of the lid body, and wherein a thickness of the first portion in the second direction is less than the length of the first portion in the first direction. a package that houses an electronic device, wherein the package includes a base body having a central region to which the electronic device is fixed and a peripheral region located at a side of an outer edge of the base body with respect to the central region in a first direction, a lid body that faces the electronic device to form a space between the base body and the lid body in a second direction, the second direction being perpendicular to the first direction, wherein the space has a dimension in the second direction defined by a distance between an inner surface of the lid body and a front surface of the electronic device facing the lid body, and a frame body that encloses at least the space between the base body and the lid body, wherein the frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in the first direction from the inner edge of the frame body toward the outer edge of the frame body, wherein the first portion is arranged between the peripheral region of the base body and the lid body in the second direction, wherein the second portion has a greater length in the first direction than a length of the first portion in the first direction, wherein the frame body has a greater thermal conductivity than a thermal conductivity of the lid body, and wherein a thickness of the first portion in the second direction is less than the length of the first portion in the first direction.