A component mounting method, using a component mounter comprising: a mounting head configured to pick up a component (P1, P2, P21, P22, P23, P24, P25) supplied to a component supply position and mount the component on a board conveyed to a board conveyance position; an imaging device with an optical axis facing upward configured to image the component; a first component holding section provided on the mounting head and capable of holding a first component; and a second component holding section capable of holding a second component (P2, P21, P22, P23, P24, P25) at a position lower than the first component; the component mounting method comprising: a step of picking up the first component with the first component holding section; a step of imaging the first component with the imaging device; a step of picking up the second component (P2, P21, P22, P23, P24, P25) with the second component holding section while the first component holding section holds the first component; and a step of imaging the second component (P2, P21, P22, P23, P24, P25) with the imaging device from below while the first component holding section holds the first component and the second component holding section holds the second component (P2, P21, P22, P23, P24, P25) wherein the component mounting method further comprises a step of causing the second component (P2, P21, P22, P23, P24, P25) to hide the first component as viewed from the imaging device, when the imaging device images the second component (P2, P21, P22, P23, P24, P25), while the first component holding section holds the first component and the second component holding section holds the second component (P2, P21, P22, P23, P24, P25). a mounting head configured to pick up a component (P1, P2, P21, P22, P23, P24, P25) supplied to a component supply position and mount the component on a board conveyed to a board conveyance position; an imaging device with an optical axis facing upward configured to image the component; a first component holding section provided on the mounting head and capable of holding a first component; and a second component holding section capable of holding a second component (P2, P21, P22, P23, P24, P25) at a position lower than the first component; the component mounting method comprising: a step of picking up the first component with the first component holding section; a step of imaging the first component with the imaging device; a step of picking up the second component (P2, P21, P22, P23, P24, P25) with the second component holding section while the first component holding section holds the first component; and a step of imaging the second component (P2, P21, P22, P23, P24, P25) with the imaging device from below while the first component holding section holds the first component and the second component holding section holds the second component (P2, P21, P22, P23, P24, P25) wherein the component mounting method further comprises a step of causing the second component (P2, P21, P22, P23, P24, P25) to hide the first component as viewed from the imaging device, when the imaging device images the second component (P2, P21, P22, P23, P24, P25), while the first component holding section holds the first component and the second component holding section holds the second component (P2, P21, P22, P23, P24, P25). a step of picking up the first component with the first component holding section; a step of imaging the first component with the imaging device; a step of picking up the second component (P2, P21, P22, P23, P24, P25) with the second component holding section while the first component holding section holds the first component; and a step of imaging the second component (P2, P21, P22, P23, P24, P25) with the imaging device from below while the first component holding section holds the first component and the second component holding section holds the second component (P2, P21, P22, P23, P24, P25) wherein the component mounting method further comprises a step of causing the second component (P2, P21, P22, P23, P24, P25) to hide the first component as viewed from the imaging device, when the imaging device images the second component (P2, P21, P22, P23, P24, P25), while the first component holding section holds the first component and the second component holding section holds the second component (P2, P21, P22, P23, P24, P25).