A bonding system, comprising: a first holder and a second holder arranged to be spaced apart from each other in a vertical direction, the first holder having, on a surface thereof facing the second holder, an attraction surface configured to attract and hold a first substrate, and the second holder having, on a surface thereof facing the first holder, an attraction surface configured to attract and hold a second substrate; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction (X, Y) between the first substrate held by the first holder and the second substrate held by the second holder; a pressing unit configured to press the first substrate held by the first holder and the second substrate held by the second holder against each other; a measuring unit configured to measure a position deviation between an alignment mark (W1a, W1b, W1c) formed on the first substrate and an alignment mark (W1a, W1b, W1c) formed on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; a distortion generator configured to generate a distortion of the second substrate held by the second holder; characterized by a position adjustment controller configured to control the position adjustment in the horizontal direction (X, Y) in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing; and a distortion controller configured to control the distortion in the currently-performed bonding processing based on the position deviation generated in the previously-performed bonding processing. a first holder and a second holder arranged to be spaced apart from each other in a vertical direction, the first holder having, on a surface thereof facing the second holder, an attraction surface configured to attract and hold a first substrate, and the second holder having, on a surface thereof facing the first holder, an attraction surface configured to attract and hold a second substrate; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction (X, Y) between the first substrate held by the first holder and the second substrate held by the second holder; a pressing unit configured to press the first substrate held by the first holder and the second substrate held by the second holder against each other; a measuring unit configured to measure a position deviation between an alignment mark (W1a, W1b, W1c) formed on the first substrate and an alignment mark (W1a, W1b, W1c) formed on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; a distortion generator configured to generate a distortion of the second substrate held by the second holder; characterized by a position adjustment controller configured to control the position adjustment in the horizontal direction (X, Y) in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing; and a distortion controller configured to control the distortion in the currently-performed bonding processing based on the position deviation generated in the previously-performed bonding processing.