Method for producing piezoelectric actuator components, comprising: - providing a multiplicity of stack arrangements of piezoelectric actuator components, wherein the stack arrangements in each case comprise piezoelectric layers and conductive layers (10, 20), and wherein the piezoelectric layers are stacked one above another in a longitudinal direction of the stack arrangement and the conductive layers (10, 20) are arranged between the piezoelectric layers, - providing a multiplicity of receptacle devices for receiving the multiplicity of stack arrangements, wherein each of the receptacle devices has a support surface for supporting one of the multiplicity of stack arrangements, wherein the support surface has openings, wherein the openings are arranged in a distributed fashion in the support surface in such a way that a side surface (S100a) of one of the multiplicity of stack arrangements by which said one of the stack arrangements bears on the support surface is in contact with a gas from the surroundings of the receptacle devices, - arranging the multiplicity of stack arrangements on a carrier apparatus in such a way that the stack arrangements are arranged on the carrier apparatus in a manner lying alongside one another in each case in the longitudinal direction of the stack arrangements, - arranging the multiplicity of stack arrangements in the receptacle devices in each case in such a way that the respective side surface (S100a) of the stack arrangements bears on the support surface, - feeding a process gas to the stack arrangements, - removing binder from and/or sintering the multiplicity of stack arrangements, wherein the stack arrangements are arranged in a manner lying alongside one another on the carrier apparatus during the process of removing binder and/or sintering. - providing a multiplicity of stack arrangements of piezoelectric actuator components, wherein the stack arrangements in each case comprise piezoelectric layers and conductive layers (10, 20), and wherein the piezoelectric layers are stacked one above another in a longitudinal direction of the stack arrangement and the conductive layers (10, 20) are arranged between the piezoelectric layers, - providing a multiplicity of receptacle devices for receiving the multiplicity of stack arrangements, wherein each of the receptacle devices has a support surface for supporting one of the multiplicity of stack arrangements, wherein the support surface has openings, wherein the openings are arranged in a distributed fashion in the support surface in such a way that a side surface (S100a) of one of the multiplicity of stack arrangements by which said one of the stack arrangements bears on the support surface is in contact with a gas from the surroundings of the receptacle devices, - arranging the multiplicity of stack arrangements on a carrier apparatus in such a way that the stack arrangements are arranged on the carrier apparatus in a manner lying alongside one another in each case in the longitudinal direction of the stack arrangements, - arranging the multiplicity of stack arrangements in the receptacle devices in each case in such a way that the respective side surface (S100a) of the stack arrangements bears on the support surface, - feeding a process gas to the stack arrangements, - removing binder from and/or sintering the multiplicity of stack arrangements, wherein the stack arrangements are arranged in a manner lying alongside one another on the carrier apparatus during the process of removing binder and/or sintering.