A manufacturing method of a radio wave transmittable sensor cover including micro cracks and laser holes, the manufacturing method comprising: (a) preparing a substrate made of a transparent material; (b) forming a primer coating layer to be located on the upper surface of the substrate by a method of coating, dipping or spraying a mixture containing a polymer resin; and (c) forming a metal layer having an island structure to be located on the upper surface of the primer coating layer by a physical vapor deposition method, characterized in that the metal layer formed in step (c) is deposited and formed on the primer coating layer at a first temperature, the substrate with the metal layer and the primer coating layer is heat-treated at a second temperature lower than the first temperature after deposition of the metal layer, and as a result, micro cracks are formed on the metal layer by a difference in thermal stress between the substrate and the metal layer, and a hole pattern including a plurality of holes which is vertically penetrated by laser punching is formed to correspond to a thickness of the metal layer with the micro cracks to remove bindings between the columnar crystals of the metal layer, and the plurality of holes forming the hole pattern by the laser punching is regularly arranged so as to have predetermined hole diameters and spaces between holes, to have a propagation attenuation rate that is larger than - 1.8 dB in a radio wave wavelength region of 76 to 77 GHz, wherein spaces between the plurality of holes are 5 to 1000 μm, and a diameter of the hole is 1 to 200 μm, and wherein the laminate constituted by the substrate, the primer coating layer, and the metal layer is heat-treated at a temperature lower than a deposition temperature of the metal after forming the metal layer so that the plurality of micro cracks is formed, and a difference between the deposition temperature and the heat treatment temperature is 10°C or higher. (a) preparing a substrate made of a transparent material; (b) forming a primer coating layer to be located on the upper surface of the substrate by a method of coating, dipping or spraying a mixture containing a polymer resin; and (c) forming a metal layer having an island structure to be located on the upper surface of the primer coating layer by a physical vapor deposition method, characterized in that the metal layer formed in step (c) is deposited and formed on the primer coating layer at a first temperature, the substrate with the metal layer and the primer coating layer is heat-treated at a second temperature lower than the first temperature after deposition of the metal layer, and as a result, micro cracks are formed on the metal layer by a difference in thermal stress between the substrate and the metal layer, and a hole pattern including a plurality of holes which is vertically penetrated by laser punching is formed to correspond to a thickness of the metal layer with the micro cracks to remove bindings between the columnar crystals of the metal layer, and the plurality of holes forming the hole pattern by the laser punching is regularly arranged so as to have predetermined hole diameters and spaces between holes, to have a propagation attenuation rate that is larger than - 1.8 dB in a radio wave wavelength region of 76 to 77 GHz, wherein spaces between the plurality of holes are 5 to 1000 μm, and a diameter of the hole is 1 to 200 μm, and wherein the laminate constituted by the substrate, the primer coating layer, and the metal layer is heat-treated at a temperature lower than a deposition temperature of the metal after forming the metal layer so that the plurality of micro cracks is formed, and a difference between the deposition temperature and the heat treatment temperature is 10°C or higher. wherein spaces between the plurality of holes are 5 to 1000 μm, and a diameter of the hole is 1 to 200 μm, and wherein the laminate constituted by the substrate, the primer coating layer, and the metal layer is heat-treated at a temperature lower than a deposition temperature of the metal after forming the metal layer so that the plurality of micro cracks is formed, and a difference between the deposition temperature and the heat treatment temperature is 10°C or higher.