A solar cell module comprising: a plurality of solar cells, each solar cell including a substrate and an electrode part (114, 117) formed on the substrate; an interconnector electrically connecting adjacent solar cells; and a conductive adhesive film disposed between the electrode part and the interconnector, and electrically connecting the electrode part with the interconnector, wherein the conductive adhesive film includes a resin and an interlayer formed using a plurality of conductive particles; the plurality of conductive particles include a plurality of first particles each including a low melting point metal that melts at a temperature lower than a hardening temperature of the resin and a plurality of second particles each including a high melting point metal having a higher melting point than a melting point of the plurality of first particles, and wherein the plurality of first particles have formed an interlayer by a metal melted connection with the plurality of second particles during a hardening process of the conductive adhesive film, wherein the interconnector includes a conductive metal and a solder, wherein the electrode part (114, 117) includes silver (Ag), wherein the plurality of first particles includes bismuth or a bismuth compound, wherein the interlayer includes at least one of SnPbAgBi, SnCuAgBi, SnCuBi, SnBi and AgBi, and wherein at least one of the second particles is formed in an uneven shape and has at least one thickness which is thicker than a thickness of the resin, such that a part of the plurality of second particles is absorbed inside the electrode part (114, 117) and/or the interconnector. a plurality of solar cells, each solar cell including a substrate and an electrode part (114, 117) formed on the substrate; an interconnector electrically connecting adjacent solar cells; and a conductive adhesive film disposed between the electrode part and the interconnector, and electrically connecting the electrode part with the interconnector, wherein the conductive adhesive film includes a resin and an interlayer formed using a plurality of conductive particles; the plurality of conductive particles include a plurality of first particles each including a low melting point metal that melts at a temperature lower than a hardening temperature of the resin and a plurality of second particles each including a high melting point metal having a higher melting point than a melting point of the plurality of first particles, and wherein the plurality of first particles have formed an interlayer by a metal melted connection with the plurality of second particles during a hardening process of the conductive adhesive film, wherein the interconnector includes a conductive metal and a solder, wherein the electrode part (114, 117) includes silver (Ag), wherein the plurality of first particles includes bismuth or a bismuth compound, wherein the interlayer includes at least one of SnPbAgBi, SnCuAgBi, SnCuBi, SnBi and AgBi, and wherein at least one of the second particles is formed in an uneven shape and has at least one thickness which is thicker than a thickness of the resin, such that a part of the plurality of second particles is absorbed inside the electrode part (114, 117) and/or the interconnector.