A global power distribution network in an integrated circuit comprising: a first layer of conductive material i) coupled to one or more power supplies and ii) configured to form a plurality of first rails of a mesh, wherein said first rails a) supply power to one or more components of a core logic of said integrated circuit, b) are aligned with a first axis of said integrated circuit, and c) have one or more parameters configured such that said mesh has a uniform voltage gradient from a perimeter of the integrated circuit to a center of the integrated circuit along said first axis; and a second layer of conductive material i) coupled to said one or more power supplies and ii) configured to form a plurality of second rails of the mesh, wherein said second rails (a) supply power to one or more components of said core logic, (b) are aligned with a second axis of said integrated circuit, and (c) have one or more parameters configured such that said mesh comprises a uniform voltage gradient from said perimeter of the integrated circuit to said center of the integrated circuit along said second axis, wherein i) said one or more parameters of said plurality of first rails or of said plurality of second rails comprise a width of each of said plurality of first rails, or of said plurality of second rails, respectively, ii) said width of each of said plurality of first rails, or of said plurality of second rails, respectively, is constant for each rail and becomes thinner as the first rails, or the second rails, respectively, are positioned closer to the center of the integrated circuit such that the first rail, or the second rail, respectively, located nearest the center of the integrated circuit has the thinnest width and the first rail, or the second rail, respectively, nearest the perimeter of the integrated circuit has the thickest width. a first layer of conductive material i) coupled to one or more power supplies and ii) configured to form a plurality of first rails of a mesh, wherein said first rails a) supply power to one or more components of a core logic of said integrated circuit, b) are aligned with a first axis of said integrated circuit, and c) have one or more parameters configured such that said mesh has a uniform voltage gradient from a perimeter of the integrated circuit to a center of the integrated circuit along said first axis; and a second layer of conductive material i) coupled to said one or more power supplies and ii) configured to form a plurality of second rails of the mesh, wherein said second rails (a) supply power to one or more components of said core logic, (b) are aligned with a second axis of said integrated circuit, and (c) have one or more parameters configured such that said mesh comprises a uniform voltage gradient from said perimeter of the integrated circuit to said center of the integrated circuit along said second axis, wherein i) said one or more parameters of said plurality of first rails or of said plurality of second rails comprise a width of each of said plurality of first rails, or of said plurality of second rails, respectively, ii) said width of each of said plurality of first rails, or of said plurality of second rails, respectively, is constant for each rail and becomes thinner as the first rails, or the second rails, respectively, are positioned closer to the center of the integrated circuit such that the first rail, or the second rail, respectively, located nearest the center of the integrated circuit has the thinnest width and the first rail, or the second rail, respectively, nearest the perimeter of the integrated circuit has the thickest width.