A fabrication method of a panel, the method comprising in the following order: forming a first conductive layer on a base substrate by using a patterning process, the first conductive layer including a plurality of first conductive traces provided in a non-working region of the base substrate and a plurality of bridges provided in a working region of the base substrate; forming a plurality of metal traces on the plurality of first conductive traces, wherein, each of the metal traces includes a connection end at an edge of the working region of the base substrate; forming an insulating layer on the base substrate, wherein the insulating layer covers the connection ends of the plurality of metal traces, and a plurality of via holes are formed in the insulating layer to expose the connection ends of the plurality of metal traces; forming a second conductive layer on the base substrate by using a patterning process; wherein the panel comprises a touch panel, the working region of the base substrate is a touch region of the base substrate, and the non-working region of the base substrate is a non-touch region of the base substrate, wherein the insulating layer covers the plurality of bridges, wherein the second conductive layer includes a plurality of first touch electrodes and a plurality of second touch electrodes provided in the touch region of the base substrate, and a plurality of second conductive traces provided in the non-touch region of the base substrate, wherein the insulating layer and the plurality of second conductive traces further cover other portion of each of the plurality of metal traces other than the connection end, wherein the plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected with the plurality of metal traces through the via holes, each of the first touch electrodes includes a plurality of first sub-electrodes, adjacent first sub-electrodes are connected with each other through the bridges, and the plurality of second touch electrodes is insulated from the plurality of bridges by the insulating layer, characterized in that forming the first conductive layer on the base substrate by using a patterning process comprises: forming the plurality of first conductive traces and the plurality of bridges simultaneously from a first conductive layer thin film by using a single patterning process, and the orthographic projection of the metal trace on the base substrate is located within the orthographic projection of the first conductive trace on the base substrate. forming a first conductive layer on a base substrate by using a patterning process, the first conductive layer including a plurality of first conductive traces provided in a non-working region of the base substrate and a plurality of bridges provided in a working region of the base substrate; forming a plurality of metal traces on the plurality of first conductive traces, wherein, each of the metal traces includes a connection end at an edge of the working region of the base substrate; forming an insulating layer on the base substrate, wherein the insulating layer covers the connection ends of the plurality of metal traces, and a plurality of via holes are formed in the insulating layer to expose the connection ends of the plurality of metal traces; forming a second conductive layer on the base substrate by using a patterning process; wherein the panel comprises a touch panel, the working region of the base substrate is a touch region of the base substrate, and the non-working region of the base substrate is a non-touch region of the base substrate, wherein the insulating layer covers the plurality of bridges, wherein the second conductive layer includes a plurality of first touch electrodes and a plurality of second touch electrodes provided in the touch region of the base substrate, and a plurality of second conductive traces provided in the non-touch region of the base substrate, wherein the insulating layer and the plurality of second conductive traces further cover other portion of each of the plurality of metal traces other than the connection end, wherein the plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected with the plurality of metal traces through the via holes, each of the first touch electrodes includes a plurality of first sub-electrodes, adjacent first sub-electrodes are connected with each other through the bridges, and the plurality of second touch electrodes is insulated from the plurality of bridges by the insulating layer, characterized in that forming the first conductive layer on the base substrate by using a patterning process comprises: forming the plurality of first conductive traces and the plurality of bridges simultaneously from a first conductive layer thin film by using a single patterning process, and the orthographic projection of the metal trace on the base substrate is located within the orthographic projection of the first conductive trace on the base substrate.