A method of mounting an electronic component on a component carrier, the method comprising optically capturing a first image of a first side of the component at which a first structural feature of the component is recognizable, by means of a first camera, optically capturing a second image of a second side of the component at which a second structural feature of the component is recognizable, by means of a second camera, wherein the first side and the second side are opposing each other and wherein the second structural feature is configured to be connected to a predetermined position on the component carrier, orienting the electronic component, such that a center of the first structural feature is aligned with a desired position relative to the component carrier, wherein the second structural feature may be respectively offset from the predetermined position, measuring a spatial offset (dx) between the second structural feature and the first structural feature based on the first image and the second image, in order to determine the correct spatial position of the first structural feature, and mounting the electronic component on the component carrier, wherein the electronic component is spatially positioned by means of the second structural feature and under consideration of the measured spatial offset (dx), such that the center of the first structural feature is aligned relative to the component carrier, such that the center of the first structural feature is situated at a desired and predetermined position on the component carrier, wherein the second structural feature is offset from the predetermined position, and wherein the electronic component is a surface mounted component, the electronic component is an optoelectronic component, the first structural feature is a light emitting chip or a light receiving chip of the optoelectronic component, and the second structural feature is at least one electrical terminal of the optoelectronic component. optically capturing a first image of a first side of the component at which a first structural feature of the component is recognizable, by means of a first camera, optically capturing a second image of a second side of the component at which a second structural feature of the component is recognizable, by means of a second camera, wherein the first side and the second side are opposing each other and wherein the second structural feature is configured to be connected to a predetermined position on the component carrier, orienting the electronic component, such that a center of the first structural feature is aligned with a desired position relative to the component carrier, wherein the second structural feature may be respectively offset from the predetermined position, measuring a spatial offset (dx) between the second structural feature and the first structural feature based on the first image and the second image, in order to determine the correct spatial position of the first structural feature, and mounting the electronic component on the component carrier, wherein the electronic component is spatially positioned by means of the second structural feature and under consideration of the measured spatial offset (dx), such that the center of the first structural feature is aligned relative to the component carrier, such that the center of the first structural feature is situated at a desired and predetermined position on the component carrier, wherein the second structural feature is offset from the predetermined position, and wherein the electronic component is a surface mounted component, the electronic component is an optoelectronic component, the first structural feature is a light emitting chip or a light receiving chip of the optoelectronic component, and the second structural feature is at least one electrical terminal of the optoelectronic component.