A process for manufacturing surface-mount semiconductor devices, in particular of the Quad-Flat No-Leads Multi-Row (QFN_mr) type, comprising: - providing a metal leadframe, in particular a copper leadframe, which includes a plurality of pads, each of which is designed to receive the body (20; 20') of the device, said pads being separated from adjacent pads by one or more rows (R1, R2) of wire-bonding contacting areas, outermost rows from among said one or more rows of wire-bonding contacting areas identifying, together with outermost rows corresponding to the adjacent pads, separation regions of the leadframe, - depositing in said separation regions beads of conductive soldering material with application of filler material, forming upon sintering or re-flowing via thermal process, an inter-metal layer resistant to the process of etching of the copper leadframe, providing a mechanical and electrical contact between the surfaces of the separation regions and said contacting areas with formation of an inter-metal layer, so as to join together wire-bonding contacting areas corresponding to adjacent pads, said wire-bonding contacting areas being partially plated, leaving a portion of their area, which faces the separation region, exposed and the beads being deposited so to cover said exposed area and the separation region; - fixing the devices to the respective pads; and - carrying out a thermal process designed to sinter or re-flow said beads of conductive soldering material to form soldered beads and an inter-metal layer with said contacting areas. - carrying out wire bonding, comprising associating wires between the wire-bonding contacting areas that are joined by the soldered bead and the respective pads; - carrying out a chemical etch on a bottom surface of the leadframe comprising plated bottom contacts (16, 16a), in the position corresponding to the contacting areas and pads, removing the leadframe outside the plated bottom contacts, thus exposing a bottom surface of the soldered bead; - carrying out a moulding of dielectric material on the leadframe; and - carrying out singulation of devices by making vertical cuts along said separation regions so as to cut said soldered bead, leaving exposed lateral surfaces (15a, 15d) of the cut soldered bead on the outside of the singulated device. - providing a metal leadframe, in particular a copper leadframe, which includes a plurality of pads, each of which is designed to receive the body (20; 20') of the device, said pads being separated from adjacent pads by one or more rows (R1, R2) of wire-bonding contacting areas, outermost rows from among said one or more rows of wire-bonding contacting areas identifying, together with outermost rows corresponding to the adjacent pads, separation regions of the leadframe, - depositing in said separation regions beads of conductive soldering material with application of filler material, forming upon sintering or re-flowing via thermal process, an inter-metal layer resistant to the process of etching of the copper leadframe, providing a mechanical and electrical contact between the surfaces of the separation regions and said contacting areas with formation of an inter-metal layer, so as to join together wire-bonding contacting areas corresponding to adjacent pads, said wire-bonding contacting areas being partially plated, leaving a portion of their area, which faces the separation region, exposed and the beads being deposited so to cover said exposed area and the separation region; - fixing the devices to the respective pads; and - carrying out a thermal process designed to sinter or re-flow said beads of conductive soldering material to form soldered beads and an inter-metal layer with said contacting areas. - carrying out wire bonding, comprising associating wires between the wire-bonding contacting areas that are joined by the soldered bead and the respective pads; - carrying out a chemical etch on a bottom surface of the leadframe comprising plated bottom contacts (16, 16a), in the position corresponding to the contacting areas and pads, removing the leadframe outside the plated bottom contacts, thus exposing a bottom surface of the soldered bead; - carrying out a moulding of dielectric material on the leadframe; and - carrying out singulation of devices by making vertical cuts along said separation regions so as to cut said soldered bead, leaving exposed lateral surfaces (15a, 15d) of the cut soldered bead on the outside of the singulated device.