A light emitting substrate comprising: a phosphor substrate; and a plurality of light emitting elements mounted on a front face of the phosphor substrate, formed as a chip scaled package, CSP, and comprising a light emitting diode, LED, being covered with a phosphor sealing layer comprising a first phosphor, the phosphor substrate comprising: an insulating substrate; an electrode layer disposed on a front face of the insulating substrate and comprising a plurality of electrode pairs bonded to the light emitting element; and a phosphor layer which is disposed on the front face of the insulating substrate to form the front face of the phosphor substrate and includes a second phosphor in which a light emission peak wavelength, in a case where light emitted by the light emitting element is used as excitation light, is in a visible light region, wherein a surface of the electrode layer facing an outer side in a thickness direction of the insulating substrate comprises a bonded surface (34A1) being bonded to the light emitting element and a non-bonded surface (34B1) which is a surface other than the bonded surface (34A1), wherein the bonded surface (34A1) is positioned further on the outer side in the thickness direction than the non-bonded surface (34B1), at least a part of the phosphor layer is disposed around the bonded surface (34A1), and the phosphor layer is disposed on a portion of the front face of the insulating substrate and the electrode layer other than the plurality of electrode pairs, and the region of the front face of the insulating substrate where the phosphor layer is disposed is a region that is equal to or more than 80% of the front face of the insulating substrate. a plurality of light emitting elements mounted on a front face of the phosphor substrate, formed as a chip scaled package, CSP, and comprising a light emitting diode, LED, being covered with a phosphor sealing layer comprising a first phosphor, the phosphor substrate comprising: an insulating substrate; an electrode layer disposed on a front face of the insulating substrate and comprising a plurality of electrode pairs bonded to the light emitting element; and a phosphor layer which is disposed on the front face of the insulating substrate to form the front face of the phosphor substrate and includes a second phosphor in which a light emission peak wavelength, in a case where light emitted by the light emitting element is used as excitation light, is in a visible light region, wherein a surface of the electrode layer facing an outer side in a thickness direction of the insulating substrate comprises a bonded surface (34A1) being bonded to the light emitting element and a non-bonded surface (34B1) which is a surface other than the bonded surface (34A1), wherein the bonded surface (34A1) is positioned further on the outer side in the thickness direction than the non-bonded surface (34B1), at least a part of the phosphor layer is disposed around the bonded surface (34A1), and the phosphor layer is disposed on a portion of the front face of the insulating substrate and the electrode layer other than the plurality of electrode pairs, and the region of the front face of the insulating substrate where the phosphor layer is disposed is a region that is equal to or more than 80% of the front face of the insulating substrate. an insulating substrate; an electrode layer disposed on a front face of the insulating substrate and comprising a plurality of electrode pairs bonded to the light emitting element; and a phosphor layer which is disposed on the front face of the insulating substrate to form the front face of the phosphor substrate and includes a second phosphor in which a light emission peak wavelength, in a case where light emitted by the light emitting element is used as excitation light, is in a visible light region, wherein a surface of the electrode layer facing an outer side in a thickness direction of the insulating substrate comprises a bonded surface (34A1) being bonded to the light emitting element and a non-bonded surface (34B1) which is a surface other than the bonded surface (34A1), wherein the bonded surface (34A1) is positioned further on the outer side in the thickness direction than the non-bonded surface (34B1), at least a part of the phosphor layer is disposed around the bonded surface (34A1), and the phosphor layer is disposed on a portion of the front face of the insulating substrate and the electrode layer other than the plurality of electrode pairs, and the region of the front face of the insulating substrate where the phosphor layer is disposed is a region that is equal to or more than 80% of the front face of the insulating substrate.