A full-color chip-on-board device, comprising a substrate, wherein a light-emitting region is provided on an upper surface of the substrate, the light-emitting region comprises a white light-emitting region and an atmosphere lighting region, and the atmosphere lighting region is a closed ring-shaped structure; and a plurality of red light-emitting modules, a plurality of green light-emitting modules, and a plurality of blue light-emitting modules are disposed in the atmosphere lighting region, wherein the white light-emitting region is only one white light-emitting region, and the atmosphere lighting region is only one atmosphere lighting region; the only one atmosphere lighting region encloses the only one white light-emitting region; and the red light-emitting modules, the green light-emitting modules, and the blue light-emitting modules are disposed in a staggered mannerto ensure that light emitted by the only one atmosphere lighting region is evenly mixed in color, a plurality of warm light-emitting modules and a plurality of cold light-emitting modules are disposed in the only one white light-emitting region, and the warm light-emitting modules and the cold light-emitting modules are disposed in a staggered manner to improve the effect of mixing cold light and warm light, each warm light-emitting module is a low color temperature chip scale package chip, and a color temperature range of the low color temperature CSP chip is 1800K to 3500K, and each cold light-emitting module is a high color temperature CSP chip, a color temperature of the high color temperature CSP chip is higher than that of the low color temperature CSP chip, and a color temperature range of the high color temperature CSP chip is 3000K to 8000K, or each cold light-emitting module comprises a light emitting diode chip and a fluorescent glue layer, and the fluorescent glue layer covers a top of the LED chip, wherein the fluorescent glue layer is a mixture of silica gel and phosphor, a color temperature of the phosphor is higher than that of the low color temperature CSP chip, and a color temperature range of the phosphor is 3000K to 8000K, and a dam protrudes from the upper surface of the substrate, and the dam is located between the only one white light-emitting region and the only one atmosphere lighting region to effectively separate the only one white light-emitting region from the only one atmosphere lighting region. the white light-emitting region is only one white light-emitting region, and the atmosphere lighting region is only one atmosphere lighting region; the only one atmosphere lighting region encloses the only one white light-emitting region; and the red light-emitting modules, the green light-emitting modules, and the blue light-emitting modules are disposed in a staggered mannerto ensure that light emitted by the only one atmosphere lighting region is evenly mixed in color, a plurality of warm light-emitting modules and a plurality of cold light-emitting modules are disposed in the only one white light-emitting region, and the warm light-emitting modules and the cold light-emitting modules are disposed in a staggered manner to improve the effect of mixing cold light and warm light, each warm light-emitting module is a low color temperature chip scale package chip, and a color temperature range of the low color temperature CSP chip is 1800K to 3500K, and each cold light-emitting module is a high color temperature CSP chip, a color temperature of the high color temperature CSP chip is higher than that of the low color temperature CSP chip, and a color temperature range of the high color temperature CSP chip is 3000K to 8000K, or each cold light-emitting module comprises a light emitting diode chip and a fluorescent glue layer, and the fluorescent glue layer covers a top of the LED chip, wherein the fluorescent glue layer is a mixture of silica gel and phosphor, a color temperature of the phosphor is higher than that of the low color temperature CSP chip, and a color temperature range of the phosphor is 3000K to 8000K, and a dam protrudes from the upper surface of the substrate, and the dam is located between the only one white light-emitting region and the only one atmosphere lighting region to effectively separate the only one white light-emitting region from the only one atmosphere lighting region.