A system comprising circuits mounted on a printed circuit board, PCB, the system comprising: a first circuit on a first die, for transmitting data; a second circuit on a second die, for receiving the transmitted data; a first electromagnetic interference, EMI, detection circuit on the first die: a first inductive coil coupled to the first circuit for transmitting the data using near field communications; a second inductive coil coupled to the second circuit for receiving the data using near field communications, the second inductive coil being proximate to the first inductive coil for magnetic coupling between the second inductive coil and the first inductive coil; a third inductive coil coupled to the first EMI detection circuit for detecting EMI signals that are also substantially received by the first inductive coil or the second inductive coil; and a fourth inductive coil, the third inductive coil being proximate to the fourth inductive coil for magnetic coupling between the third inductive coil and the fourth inductive coil, wherein the first EMI detection circuit is configured to control the first circuit to improve a signal-to-noise ratio of a data signal based on the EMI signals detected by the third inductive coil, wherein the system further comprises a second EMI detection circuit on the second die and coupled to the fourth inductive coil, wherein the second EMI detection circuit is configured to control the second circuit to improve the signal-to-noise ratio of the data signal based on EMI signals detected by the fourth inductive coil. a first circuit on a first die, for transmitting data; a second circuit on a second die, for receiving the transmitted data; a first electromagnetic interference, EMI, detection circuit on the first die: a first inductive coil coupled to the first circuit for transmitting the data using near field communications; a second inductive coil coupled to the second circuit for receiving the data using near field communications, the second inductive coil being proximate to the first inductive coil for magnetic coupling between the second inductive coil and the first inductive coil; a third inductive coil coupled to the first EMI detection circuit for detecting EMI signals that are also substantially received by the first inductive coil or the second inductive coil; and a fourth inductive coil, the third inductive coil being proximate to the fourth inductive coil for magnetic coupling between the third inductive coil and the fourth inductive coil, wherein the first EMI detection circuit is configured to control the first circuit to improve a signal-to-noise ratio of a data signal based on the EMI signals detected by the third inductive coil, wherein the system further comprises a second EMI detection circuit on the second die and coupled to the fourth inductive coil, wherein the second EMI detection circuit is configured to control the second circuit to improve the signal-to-noise ratio of the data signal based on EMI signals detected by the fourth inductive coil. a first inductive coil coupled to the first circuit for transmitting the data using near field communications; a second inductive coil coupled to the second circuit for receiving the data using near field communications, the second inductive coil being proximate to the first inductive coil for magnetic coupling between the second inductive coil and the first inductive coil; a third inductive coil coupled to the first EMI detection circuit for detecting EMI signals that are also substantially received by the first inductive coil or the second inductive coil; and a fourth inductive coil, the third inductive coil being proximate to the fourth inductive coil for magnetic coupling between the third inductive coil and the fourth inductive coil, wherein the first EMI detection circuit is configured to control the first circuit to improve a signal-to-noise ratio of a data signal based on the EMI signals detected by the third inductive coil, wherein the system further comprises a second EMI detection circuit on the second die and coupled to the fourth inductive coil, wherein the second EMI detection circuit is configured to control the second circuit to improve the signal-to-noise ratio of the data signal based on EMI signals detected by the fourth inductive coil.