Process for manufacturing at least one 3D electronic module each comprising a stack in a Z direction of electronic packages and/or printed wiring boards, which stack is placed on a system for electrically interconnecting the 3D module with the exterior comprising metal leads each having two ends, the process being characterized in that it includes the following steps: - starting with a lead frame that comprises metal leads each having two ends, one toward the interior of the frame and the other toward the exterior of the frame, folding by about 180° the interior ends of the leads in order to obtain what is referred to as an internal frame portion including the folded ends, which are intended to be moulded, the other portion, which is referred to as an external portion, including the unfolded exterior ends, the two ends of each lead being intended to emerge from the 3D module on a same face cut along Z, - depositing on the leads thus folded a metal coating compatible with subsequent steps of adhesive bonding and/or soldering of the external portion, - placing the external portion of the metallized frame between a lower protective element and an upper protective element while leaving the internal portion free, and placing the frame and the protective elements (21, 22) on a carrier; - placing each stack of packages and/or printed wiring boards equipped each with at least one electronic component and exterior tabs for electrically interconnecting packages and/or printed wiring boards, so as to superpose the exterior tabs on the internal portion; - moulding, in an epoxy resin, the stack, the exterior tabs and the internal portion by partially covering the upper protective element; - cutting the resin along Z by leaving flush the conductive sections of the exterior tabs and of the ends of the leads of the internal portion and thereby forming faces cut along Z, and removing the resin from the upper protective element; - metallizing the cut faces presenting the conductive sections; - removing the carrier; - removing the protective elements (21, 22) in order to expose the leads of the external portion. - starting with a lead frame that comprises metal leads each having two ends, one toward the interior of the frame and the other toward the exterior of the frame, folding by about 180° the interior ends of the leads in order to obtain what is referred to as an internal frame portion including the folded ends, which are intended to be moulded, the other portion, which is referred to as an external portion, including the unfolded exterior ends, the two ends of each lead being intended to emerge from the 3D module on a same face cut along Z, - depositing on the leads thus folded a metal coating compatible with subsequent steps of adhesive bonding and/or soldering of the external portion, - placing the external portion of the metallized frame between a lower protective element and an upper protective element while leaving the internal portion free, and placing the frame and the protective elements (21, 22) on a carrier; - placing each stack of packages and/or printed wiring boards equipped each with at least one electronic component and exterior tabs for electrically interconnecting packages and/or printed wiring boards, so as to superpose the exterior tabs on the internal portion; - moulding, in an epoxy resin, the stack, the exterior tabs and the internal portion by partially covering the upper protective element; - cutting the resin along Z by leaving flush the conductive sections of the exterior tabs and of the ends of the leads of the internal portion and thereby forming faces cut along Z, and removing the resin from the upper protective element; - metallizing the cut faces presenting the conductive sections; - removing the carrier; - removing the protective elements (21, 22) in order to expose the leads of the external portion.