A heat spreader, for use in a device, comprising: a spring, coupled to a heat plate, the spring comprising: a first spring member configured to attach the spring to the heat plate at a first location; and a second spring member, connected to the first spring member, configured to attach the spring to the heat plate; the heat plate comprising: a first fastener configured to attach the spring to the heat plate at the first location; and a second fastener configured to attach the second spring member to the heat plate, wherein in an assembled state of the device, a top enclosure of the device is fixed to a bottom enclosure of the device and configured such that the spring applies a vertical pressure to a component of the device; wherein the second spring member attaches the spring to the heat plate at a second location when the device is in an unassembled state and at a third location when the device is in the assembled state in which the pressure between the spring member and the component is absorbed at least in part by the spring vertically deflecting and horizontally extending, and wherein the second fastener is a tab extending above a top surface of the heat plate and between the second location and the third location and the second spring member comprises a tab slot (314A,B) configured to accept the tab at each of the second and third locations, wherein the second spring member is configured to extend under the tab such that the tab slot on the spring shifts from the second location to the third location when the device 400 is transitioned from the unassembled state to the assembled state. a first spring member configured to attach the spring to the heat plate at a first location; and a second spring member, connected to the first spring member, configured to attach the spring to the heat plate; the heat plate comprising: a first fastener configured to attach the spring to the heat plate at the first location; and a second fastener configured to attach the second spring member to the heat plate, wherein in an assembled state of the device, a top enclosure of the device is fixed to a bottom enclosure of the device and configured such that the spring applies a vertical pressure to a component of the device; wherein the second spring member attaches the spring to the heat plate at a second location when the device is in an unassembled state and at a third location when the device is in the assembled state in which the pressure between the spring member and the component is absorbed at least in part by the spring vertically deflecting and horizontally extending, and wherein the second fastener is a tab extending above a top surface of the heat plate and between the second location and the third location and the second spring member comprises a tab slot (314A,B) configured to accept the tab at each of the second and third locations, wherein the second spring member is configured to extend under the tab such that the tab slot on the spring shifts from the second location to the third location when the device 400 is transitioned from the unassembled state to the assembled state. a first fastener configured to attach the spring to the heat plate at the first location; and a second fastener configured to attach the second spring member to the heat plate, wherein in an assembled state of the device, a top enclosure of the device is fixed to a bottom enclosure of the device and configured such that the spring applies a vertical pressure to a component of the device; wherein the second spring member attaches the spring to the heat plate at a second location when the device is in an unassembled state and at a third location when the device is in the assembled state in which the pressure between the spring member and the component is absorbed at least in part by the spring vertically deflecting and horizontally extending, and wherein the second fastener is a tab extending above a top surface of the heat plate and between the second location and the third location and the second spring member comprises a tab slot (314A,B) configured to accept the tab at each of the second and third locations, wherein the second spring member is configured to extend under the tab such that the tab slot on the spring shifts from the second location to the third location when the device 400 is transitioned from the unassembled state to the assembled state.