A method of forming an interconnect circuit for interconnecting an array of battery cells, the method comprising: forming a set of conductive layer openings in a conductive layer, wherein the conductive layer openings in the set are separated from each other by two or more connecting tabs, wherein the set of the conductive layer openings and the two or more connecting tabs surround and define a region of the conductive layer, and wherein, after forming the set of the conductive layer openings, the two or more connecting tabs mechanically support and maintain registration of the region of the conductive layer relative to other portions of the conductive layer; laminating the conductive layer comprising the set of the conductive layer openings to a support layer, wherein, after laminating the conductive layer to the support layer, the support layer mechanically supports and maintains registration of the region of the conductive layer relative to the other portions of the conductive layer; and removing at least one of the two or more connecting tabs while retaining one of the connecting tabs, wherein removing the at least one of the two or more connecting tabs converts the set of the conductive layer openings into a continuous conductive layer channel at least partially surrounding and defining the region of the conductive layer and extending to the retained one of the connecting tabs; after removing the at least one of the two or more connecting tabs, laminating a first insulating layer to the conductive layer such that the conductive layer is disposed between the first insulating layer and the support layer; wherein the first insulating layer comprises an insulating layer opening overlapping with the region of the conducting layer, and an insulating layer slot disposed within the boundaries of the continuous conductive layer channel; and after laminating the first insulating layer to the conductive layer, removing the support layer from the conductive layer. forming a set of conductive layer openings in a conductive layer, wherein the conductive layer openings in the set are separated from each other by two or more connecting tabs, wherein the set of the conductive layer openings and the two or more connecting tabs surround and define a region of the conductive layer, and wherein, after forming the set of the conductive layer openings, the two or more connecting tabs mechanically support and maintain registration of the region of the conductive layer relative to other portions of the conductive layer; wherein the conductive layer openings in the set are separated from each other by two or more connecting tabs, wherein the set of the conductive layer openings and the two or more connecting tabs surround and define a region of the conductive layer, and wherein, after forming the set of the conductive layer openings, the two or more connecting tabs mechanically support and maintain registration of the region of the conductive layer relative to other portions of the conductive layer; laminating the conductive layer comprising the set of the conductive layer openings to a support layer, wherein, after laminating the conductive layer to the support layer, the support layer mechanically supports and maintains registration of the region of the conductive layer relative to the other portions of the conductive layer; and removing at least one of the two or more connecting tabs while retaining one of the connecting tabs, wherein removing the at least one of the two or more connecting tabs converts the set of the conductive layer openings into a continuous conductive layer channel at least partially surrounding and defining the region of the conductive layer and extending to the retained one of the connecting tabs; after removing the at least one of the two or more connecting tabs, laminating a first insulating layer to the conductive layer such that the conductive layer is disposed between the first insulating layer and the support layer; wherein the first insulating layer comprises an insulating layer opening overlapping with the region of the conducting layer, and an insulating layer slot disposed within the boundaries of the continuous conductive layer channel; and after laminating the first insulating layer to the conductive layer, removing the support layer from the conductive layer. wherein, after laminating the conductive layer to the support layer, the support layer mechanically supports and maintains registration of the region of the conductive layer relative to the other portions of the conductive layer; and removing at least one of the two or more connecting tabs while retaining one of the connecting tabs, wherein removing the at least one of the two or more connecting tabs converts the set of the conductive layer openings into a continuous conductive layer channel at least partially surrounding and defining the region of the conductive layer and extending to the retained one of the connecting tabs; after removing the at least one of the two or more connecting tabs, laminating a first insulating layer to the conductive layer such that the conductive layer is disposed between the first insulating layer and the support layer; wherein the first insulating layer comprises an insulating layer opening overlapping with the region of the conducting layer, and an insulating layer slot disposed within the boundaries of the continuous conductive layer channel; and after laminating the first insulating layer to the conductive layer, removing the support layer from the conductive layer.