A machining apparatus for the laser machining of a workpiece in a machining zone, in particular for laser cutting, in particular a laser machining head, having a first interface for a machining laser source for generating a machining laser beam, a second interface for a detector device for detecting of a radiation emitted by the machining zone; an outlet opening for the machining laser beam; and a first and a second laser beam guiding devices (20, 22), and being characterized in that: the first laser beam guiding device (20, 20a, 20b) is arranged and designed such that it guides the machining laser beam to the second laser beam guiding device and dynamically moves at a frequency between 10 Hz and 15 kHz, in particular dynamically shapes, the machining laser beam, and the second laser beam guiding device is arranged and designed such that it guides the dynamically moved machining laser beam through the outlet opening and at least partially guides the radiation emitted by the machining zone through the outlet opening to the second interface; wherein the first laser beam guiding device has at least one deflection device (20a; 30; 40; 50; 52) for the machining laser beam, which is at least partially dynamically movable by means of at least one movement unit (20b; 32a; 32b; 32c); wherein the movement unit (32a; 32b; 32c; 71) has at least one element selected from a piezo actuator, an electric motor, a pneumatic motor, a cam, an apparatus for generating an oscillating electromagnetic field, an MEMS oscillator, an oscillating coil, an electrostatically movable actuator, a plurality thereof and/or a combination thereof; and wherein the second laser beam guiding device has at least one second deflection device for the machining laser beam, which is not dynamically movable. a first interface for a machining laser source for generating a machining laser beam, a second interface for a detector device for detecting of a radiation emitted by the machining zone; an outlet opening for the machining laser beam; and a first and a second laser beam guiding devices (20, 22), and being characterized in that: the first laser beam guiding device (20, 20a, 20b) is arranged and designed such that it guides the machining laser beam to the second laser beam guiding device and dynamically moves at a frequency between 10 Hz and 15 kHz, in particular dynamically shapes, the machining laser beam, and the second laser beam guiding device is arranged and designed such that it guides the dynamically moved machining laser beam through the outlet opening and at least partially guides the radiation emitted by the machining zone through the outlet opening to the second interface; wherein the first laser beam guiding device has at least one deflection device (20a; 30; 40; 50; 52) for the machining laser beam, which is at least partially dynamically movable by means of at least one movement unit (20b; 32a; 32b; 32c); wherein the movement unit (32a; 32b; 32c; 71) has at least one element selected from a piezo actuator, an electric motor, a pneumatic motor, a cam, an apparatus for generating an oscillating electromagnetic field, an MEMS oscillator, an oscillating coil, an electrostatically movable actuator, a plurality thereof and/or a combination thereof; and wherein the second laser beam guiding device has at least one second deflection device for the machining laser beam, which is not dynamically movable. the first laser beam guiding device (20, 20a, 20b) is arranged and designed such that it guides the machining laser beam to the second laser beam guiding device and dynamically moves at a frequency between 10 Hz and 15 kHz, in particular dynamically shapes, the machining laser beam, and the second laser beam guiding device is arranged and designed such that it guides the dynamically moved machining laser beam through the outlet opening and at least partially guides the radiation emitted by the machining zone through the outlet opening to the second interface; wherein the first laser beam guiding device has at least one deflection device (20a; 30; 40; 50; 52) for the machining laser beam, which is at least partially dynamically movable by means of at least one movement unit (20b; 32a; 32b; 32c); wherein the movement unit (32a; 32b; 32c; 71) has at least one element selected from a piezo actuator, an electric motor, a pneumatic motor, a cam, an apparatus for generating an oscillating electromagnetic field, an MEMS oscillator, an oscillating coil, an electrostatically movable actuator, a plurality thereof and/or a combination thereof; and wherein the second laser beam guiding device has at least one second deflection device for the machining laser beam, which is not dynamically movable.