A method of forming a conductive trace on to a substrate, the method comprising: A) selecting a substrate; B) providing a jet dispenser for use in applying a conductive ink to the substrate; C) selecting a conductive ink; D) measuring the viscosity of the conductive ink at a shear rate of 700 sec -1 and a predetermined jetting temperature; E) using the measured viscosity (V m) to select one of the following criteria (i) - (iv) to apply to the jet dispenser: (i) when the measured viscosity (V m) is greater than 2.0 Pa-s, either add a fluid to the conductive ink in order to reduce the viscosity thereof followed by repeating steps D) and E) or select another conductive ink by repeating steps C) - E); (ii) when the measured viscosity (V m) is less than or equal to 2.0 Pa-s and greater than 0.35 Pa-s, use a needle that is at least 3.0 mm in diameter and an orifice or nozzle that is at least 0.15 mm in diameter (d); with the proviso that the ratio of nozzle length to nozzle diameter (d) is ≤ 30; (iii) when the measured viscosity (V m) is less than 0.25 Pa-s, use a needle that is at least 1.0 mm in diameter but less than 3.0 mm in diameter and an orifice or nozzle that is at least 0.15 mm in diameter (d); with the proviso that the ratio of nozzle length to nozzle diameter (d) is ≤ 30; or (iv) when the measured viscosity (V m) is between 0.25 Pa-s and 0.35 Pa-s, use the criteria set forth in either (ii) or (iii); F) applying the selected criteria to the jet dispenser; G) using the jet dispenser to apply the conductive ink on to a surface of the substrate; and H) drying or curing, and optionally annealing the conductive ink to form the conductive trace. A) selecting a substrate; B) providing a jet dispenser for use in applying a conductive ink to the substrate; C) selecting a conductive ink; D) measuring the viscosity of the conductive ink at a shear rate of 700 sec -1 and a predetermined jetting temperature; E) using the measured viscosity (V m) to select one of the following criteria (i) - (iv) to apply to the jet dispenser: (i) when the measured viscosity (V m) is greater than 2.0 Pa-s, either add a fluid to the conductive ink in order to reduce the viscosity thereof followed by repeating steps D) and E) or select another conductive ink by repeating steps C) - E); (ii) when the measured viscosity (V m) is less than or equal to 2.0 Pa-s and greater than 0.35 Pa-s, use a needle that is at least 3.0 mm in diameter and an orifice or nozzle that is at least 0.15 mm in diameter (d); with the proviso that the ratio of nozzle length to nozzle diameter (d) is ≤ 30; (iii) when the measured viscosity (V m) is less than 0.25 Pa-s, use a needle that is at least 1.0 mm in diameter but less than 3.0 mm in diameter and an orifice or nozzle that is at least 0.15 mm in diameter (d); with the proviso that the ratio of nozzle length to nozzle diameter (d) is ≤ 30; or (iv) when the measured viscosity (V m) is between 0.25 Pa-s and 0.35 Pa-s, use the criteria set forth in either (ii) or (iii); (i) when the measured viscosity (V m) is greater than 2.0 Pa-s, either add a fluid to the conductive ink in order to reduce the viscosity thereof followed by repeating steps D) and E) or select another conductive ink by repeating steps C) - E); (ii) when the measured viscosity (V m) is less than or equal to 2.0 Pa-s and greater than 0.35 Pa-s, use a needle that is at least 3.0 mm in diameter and an orifice or nozzle that is at least 0.15 mm in diameter (d); with the proviso that the ratio of nozzle length to nozzle diameter (d) is ≤ 30; (iii) when the measured viscosity (V m) is less than 0.25 Pa-s, use a needle that is at least 1.0 mm in diameter but less than 3.0 mm in diameter and an orifice or nozzle that is at least 0.15 mm in diameter (d); with the proviso that the ratio of nozzle length to nozzle diameter (d) is ≤ 30; or (iv) when the measured viscosity (V m) is between 0.25 Pa-s and 0.35 Pa-s, use the criteria set forth in either (ii) or (iii); F) applying the selected criteria to the jet dispenser; G) using the jet dispenser to apply the conductive ink on to a surface of the substrate; and H) drying or curing, and optionally annealing the conductive ink to form the conductive trace.