An air-cooling heat dissipation device (2, 2a) located near an electronic component for removing heat therefrom, the air-cooling heat dissipation device (2, 2a) comprising: a base comprising: a top surface; a bottom surface opposing to the top surface; four lateral walls (204a, 204b, 204c, 204d) connected between the top surface and the bottom surface; an introduction opening; a guiding chamber; and plural discharge grooves;and an air pump, characterized in that the introduction opening is formed in the top surface; the guiding chamber runs through the bottom surface and is in communication with the introduction opening; and the plural discharge grooves are formed in one of the four lateral walls (204a, 204b, 204c, 204d), and extend along a first direction to communicate with the guiding chamber and to orient toward the electronic component; the air-cooling heat dissipation device (2, 2a) comprises a supporting substrate, wherein a portion of the supporting substrate is connected to the bottom surface of the base to close a bottom side of the guiding chamber, and the electronic component is supported on the supporting substrate; the air pump is disposed on the top surface of the base and seals the edge of the introduction opening, wherein the air pump has a gas inlet plate having at least one inlet, and the at least one inlet extends along a second direction perpendicular to the first direction, wherein the air pump is a piezoelectric air pump, and comprises the gas inlet plate, a resonance plate, a piezoelectric actuator, a first insulation plate, a conducting plate and a second insulation plate, which are stacked on each other sequentially, and wherein when the air pump is enabled, an ambient air along the second direction is introduced into the guiding chamber through the introduction opening and is discharged through the plural discharge grooves such that a lateral air flow along the first direction is generated and passes through the electronic component to remove heat therefrom. a base comprising: a top surface; a bottom surface opposing to the top surface; four lateral walls (204a, 204b, 204c, 204d) connected between the top surface and the bottom surface; an introduction opening; a guiding chamber; and plural discharge grooves;and an air pump, characterized in that the introduction opening is formed in the top surface; the guiding chamber runs through the bottom surface and is in communication with the introduction opening; and the plural discharge grooves are formed in one of the four lateral walls (204a, 204b, 204c, 204d), and extend along a first direction to communicate with the guiding chamber and to orient toward the electronic component; the air-cooling heat dissipation device (2, 2a) comprises a supporting substrate, wherein a portion of the supporting substrate is connected to the bottom surface of the base to close a bottom side of the guiding chamber, and the electronic component is supported on the supporting substrate; the air pump is disposed on the top surface of the base and seals the edge of the introduction opening, wherein the air pump has a gas inlet plate having at least one inlet, and the at least one inlet extends along a second direction perpendicular to the first direction, wherein the air pump is a piezoelectric air pump, and comprises the gas inlet plate, a resonance plate, a piezoelectric actuator, a first insulation plate, a conducting plate and a second insulation plate, which are stacked on each other sequentially, and wherein when the air pump is enabled, an ambient air along the second direction is introduced into the guiding chamber through the introduction opening and is discharged through the plural discharge grooves such that a lateral air flow along the first direction is generated and passes through the electronic component to remove heat therefrom.