A semiconductor device (100, 200, 300, 400, 500, 600) comprising: a first wiring layer including a first interlayer insulating film, first electrode pads, and first dummy electrodes, the first electrode pads being embedded in the first interlayer insulating film and having one surface located on the same plane as one surface of the first interlayer insulating film, and the first dummy electrodes being embedded in the first interlayer insulating film, having one surface located on the same plane as the one surface of the first interlayer insulating film and of the first electrode pads to form a bonding surface (Pj) between the first wiring layer and a second wiring layer, and the first dummy electrodes being disposed between said first electrode pads; the second wiring layer including a second interlayer insulating film, second electrode pads, and second dummy electrodes, the second electrode pads and the second dummy electrodes being embedded in the second interlayer insulating film, the second electrode pads and the second dummy electrodes having one surface located on the same plane as one surface of the second interlayer insulating film located closer to the first interlayer insulating film, said surfaces of the second electrode pads, the second dummy electrodes and the second interlayer insulating film forming said bonding surface (Pj) between the first wiring layer and the second wiring layer, and the second electrode pads being bonded to the first electrode pads, and the second dummy electrodes being disposed between said second electrode pads, and being bonded to the first dummy electrodes; and characterised in that the first electrode pads and the second electrode pads and the first dummy electrodes and the second dummy electrodes are not disposed plane-symmetrically with respect to the bonding surface (Pj) between the first and second wiring layer, and a plurality of first dummy electrodes and first electrode pads is bonded to one second electrode pad and a plurality of first dummy electrodes is bonded to one second dummy electrode. a first wiring layer including a first interlayer insulating film, first electrode pads, and first dummy electrodes, the first electrode pads being embedded in the first interlayer insulating film and having one surface located on the same plane as one surface of the first interlayer insulating film, and the first dummy electrodes being embedded in the first interlayer insulating film, having one surface located on the same plane as the one surface of the first interlayer insulating film and of the first electrode pads to form a bonding surface (Pj) between the first wiring layer and a second wiring layer, and the first dummy electrodes being disposed between said first electrode pads; the second wiring layer including a second interlayer insulating film, second electrode pads, and second dummy electrodes, the second electrode pads and the second dummy electrodes being embedded in the second interlayer insulating film, the second electrode pads and the second dummy electrodes having one surface located on the same plane as one surface of the second interlayer insulating film located closer to the first interlayer insulating film, said surfaces of the second electrode pads, the second dummy electrodes and the second interlayer insulating film forming said bonding surface (Pj) between the first wiring layer and the second wiring layer, and the second electrode pads being bonded to the first electrode pads, and the second dummy electrodes being disposed between said second electrode pads, and being bonded to the first dummy electrodes; and characterised in that the first electrode pads and the second electrode pads and the first dummy electrodes and the second dummy electrodes are not disposed plane-symmetrically with respect to the bonding surface (Pj) between the first and second wiring layer, and a plurality of first dummy electrodes and first electrode pads is bonded to one second electrode pad and a plurality of first dummy electrodes is bonded to one second dummy electrode.