A method of forming a prelam body (100, 20) of a smart card, the method comprising: preparing at least one contact terminal patch (1, 1a, 1b, 14a, 14b), which is formed by a patch base layer (3, 3a, 3b, 14a-3, 14b-3) and a plurality of conductive pads (5, 5a, 5b) provided on a surface of the patch base layer (3, 3a, 3b, 14a-3, 14b-3), wherein the plurality of conductive pads (5, 5a, 5b) is arranged on the patch base layer (3, 3a, 3b, 14a-3, 14b-3) in accordance with a predefined interconnection design; preparing a covering layer (20a-2, 20b-2) having formed therein a plurality of openings (22a, 22b), each opening (22a, 22b) being formed such that it accommodates for a dedicated one of the conductive pads (5, 5a, 5b); preparing a prelam sheet (20a-1, 20b-1), the prelam sheet (20a-1, 20b-1) having at least one recess formed therein, the at least one recess being formed so as to accommodate the at least one contact terminal patch (1, 1a, 1b, 14a, 14b); and mounting the at least one contact terminal patch (1, 1a, 1b, 14a, 14b) to the prelam sheet (20a-1, 20b-1), characterized in that the preparing of the prelam sheet (20a-1, 20b-1) further comprises: mounting the covering layer (20a-2, 20b-2) to the prelam sheet (20a-1, 20b-1) in alignment with the plurality of openings (22a, 22b) such that the at least one contact terminal patch (1, 1a, 1b, 14a, 14b) accommodated into the at least one recess in the covering layer (20a-2, 20b-2) is aligned with the plurality of openings (22a, 22b) in the prelam sheet (20a-1, 20b-1) so as to accommodate the plurality of conductive pads (5, 5a, 5b) of the at least one contact terminal patch (1, 1a, 1b, 14a, 14b) into the plurality of openings (22a, 22b) of the prelam sheet (20a-1, 20b-1). preparing at least one contact terminal patch (1, 1a, 1b, 14a, 14b), which is formed by a patch base layer (3, 3a, 3b, 14a-3, 14b-3) and a plurality of conductive pads (5, 5a, 5b) provided on a surface of the patch base layer (3, 3a, 3b, 14a-3, 14b-3), wherein the plurality of conductive pads (5, 5a, 5b) is arranged on the patch base layer (3, 3a, 3b, 14a-3, 14b-3) in accordance with a predefined interconnection design; preparing a covering layer (20a-2, 20b-2) having formed therein a plurality of openings (22a, 22b), each opening (22a, 22b) being formed such that it accommodates for a dedicated one of the conductive pads (5, 5a, 5b); preparing a prelam sheet (20a-1, 20b-1), the prelam sheet (20a-1, 20b-1) having at least one recess formed therein, the at least one recess being formed so as to accommodate the at least one contact terminal patch (1, 1a, 1b, 14a, 14b); and mounting the at least one contact terminal patch (1, 1a, 1b, 14a, 14b) to the prelam sheet (20a-1, 20b-1), characterized in that the preparing of the prelam sheet (20a-1, 20b-1) further comprises: mounting the covering layer (20a-2, 20b-2) to the prelam sheet (20a-1, 20b-1) in alignment with the plurality of openings (22a, 22b) such that the at least one contact terminal patch (1, 1a, 1b, 14a, 14b) accommodated into the at least one recess in the covering layer (20a-2, 20b-2) is aligned with the plurality of openings (22a, 22b) in the prelam sheet (20a-1, 20b-1) so as to accommodate the plurality of conductive pads (5, 5a, 5b) of the at least one contact terminal patch (1, 1a, 1b, 14a, 14b) into the plurality of openings (22a, 22b) of the prelam sheet (20a-1, 20b-1).