A method of transferring devices (10B, 10G, 10R, 10S) comprising, comprising: providing a combination of a transfer substrate and a device layer thereupon; forming a first metal bonding material layer on a top surface of the device layer; forming channels through the first metal bonding material layer and the device layer, wherein devices (10B, 10G, 10R, 10S) comprising remaining portions of the device layer are laterally isolated from one another by the channels, and a patterned portion of the first metal bonding material layer is present on each of the devices (10B, 10G, 10R, 10S); forming and patterning a second metal bonding material layer on a surface of a target substrate, wherein patterned portions of the second metal bonding material layer have a mirror pattern of the pattern of the patterned portions of the first metal bonding material layer; bonding the devices (10B, 10G, 10R, 10S) on the transfer substrate to the target substrate through an adhesion layer that includes multiple bonded pairs of a respective patterned portion of the first metal bonding material layer and a respective patterned portion of the second metal bonding material layer that is bonded to the respective patterned portion of the first metal bonding material layer; removing surface portions of the devices (10B, 10G, 10R, 10S) from an interface region between the transfer substrate and the devices (10B, 10G, 10R, 10S) by irradiating a laser beam through the transfer substrate onto the devices (10B, 10G, 10R, 10S) while the patterned portions of the first metal bonding material layer contact the respective patterned portions of the second metal bonding material layer; and separating the transfer substrate from a bonded assembly including the target substrate and remaining portions of the devices (10B, 10G, 10R, 10S). providing a combination of a transfer substrate and a device layer thereupon; forming a first metal bonding material layer on a top surface of the device layer; forming channels through the first metal bonding material layer and the device layer, wherein devices (10B, 10G, 10R, 10S) comprising remaining portions of the device layer are laterally isolated from one another by the channels, and a patterned portion of the first metal bonding material layer is present on each of the devices (10B, 10G, 10R, 10S); forming and patterning a second metal bonding material layer on a surface of a target substrate, wherein patterned portions of the second metal bonding material layer have a mirror pattern of the pattern of the patterned portions of the first metal bonding material layer; bonding the devices (10B, 10G, 10R, 10S) on the transfer substrate to the target substrate through an adhesion layer that includes multiple bonded pairs of a respective patterned portion of the first metal bonding material layer and a respective patterned portion of the second metal bonding material layer that is bonded to the respective patterned portion of the first metal bonding material layer; removing surface portions of the devices (10B, 10G, 10R, 10S) from an interface region between the transfer substrate and the devices (10B, 10G, 10R, 10S) by irradiating a laser beam through the transfer substrate onto the devices (10B, 10G, 10R, 10S) while the patterned portions of the first metal bonding material layer contact the respective patterned portions of the second metal bonding material layer; and separating the transfer substrate from a bonded assembly including the target substrate and remaining portions of the devices (10B, 10G, 10R, 10S).