An optical component packaging apparatus, comprising an optical component and two packaging substrates (20, 30) disposed opposite to each other, wherein a packaging cavity filled with a protective gas is formed between the two packaging substrates (20, 30), and the optical component is disposed in the packaging cavity; and at least one packaging substrate (20, 30) is provided with an optical waveguide, an end face of a first coupling end of each optical waveguide is disposed on an inner surface of the packaging cavity and is coupled to the optical component, and an end face of a second coupling end of each optical waveguide is disposed on a surface that is of a corresponding packaging substrate (20, 30) and that is located outside the packaging cavity; wherein the packaging cavity is formed through matching by two opposite surfaces (200, 300) of the two packaging substrates (20, 30) and a sealant that is connected to the two opposite surfaces (200, 300) of the two packaging substrates (20, 30) in a sealed manner, and the sealant is disposed around the optical component and forms a closed ring structure; wherein the two opposite surfaces (200, 300) of the two packaging substrates (20, 30) each are provided with a ring pad (22, 32), each ring pad (22, 32) is disposed around the optical component, and the sealant is a solder and is connected to the two ring pads (22, 32); wherein at least one packaging substrate is provided with a power supply circuit, a power output end of the power supply circuit is located in the packaging cavity and is connected to the optical component, and a power input end of the power supply circuit is located outside the packaging cavity; wherein the power supply circuit is disposed between the packaging substrate (20, 30) on which the power supply circuit is located and the ring pad (22, 32); wherein the packaging cavity comprises a first groove disposed on the surface of the first packaging substrate and a second groove disposed on the surface of the second packaging substrate, said first groove and said second groove being configured to accommodate the optical component. a packaging cavity filled with a protective gas is formed between the two packaging substrates (20, 30), and the optical component is disposed in the packaging cavity; and at least one packaging substrate (20, 30) is provided with an optical waveguide, an end face of a first coupling end of each optical waveguide is disposed on an inner surface of the packaging cavity and is coupled to the optical component, and an end face of a second coupling end of each optical waveguide is disposed on a surface that is of a corresponding packaging substrate (20, 30) and that is located outside the packaging cavity; wherein the packaging cavity is formed through matching by two opposite surfaces (200, 300) of the two packaging substrates (20, 30) and a sealant that is connected to the two opposite surfaces (200, 300) of the two packaging substrates (20, 30) in a sealed manner, and the sealant is disposed around the optical component and forms a closed ring structure; wherein the two opposite surfaces (200, 300) of the two packaging substrates (20, 30) each are provided with a ring pad (22, 32), each ring pad (22, 32) is disposed around the optical component, and the sealant is a solder and is connected to the two ring pads (22, 32); wherein at least one packaging substrate is provided with a power supply circuit, a power output end of the power supply circuit is located in the packaging cavity and is connected to the optical component, and a power input end of the power supply circuit is located outside the packaging cavity; wherein the power supply circuit is disposed between the packaging substrate (20, 30) on which the power supply circuit is located and the ring pad (22, 32); wherein the packaging cavity comprises a first groove disposed on the surface of the first packaging substrate and a second groove disposed on the surface of the second packaging substrate, said first groove and said second groove being configured to accommodate the optical component.