Method for manufacturing a semiconductor device, said semiconductor device comprising: - an insulated circuit board having a circuit pattern formed on at least one of the surfaces thereof; - at least one semiconductor element mounted on the insulated circuit board; - a plurality of tubular contact elements joined to the circuit pattern on the insulated circuit board; - a plurality of external terminals electrically connected to their respective tubular contact elements; and - a case containing the insulated circuit board, wherein said method comprises: a process of joining a plurality of the tubular contact elements onto the circuit pattern on the insulated circuit board, said process comprising the steps of: - preparing a mounting jig (10, 20), said mounting jig comprising an insulated circuit board positioning jig (11, 21) holding the insulated circuit board at a specified position for positioning, a tubular contact element positioning jig (12, 22) having a plurality of positioning holes at specified positions into each of which holes the tubular contact element can be inserted, and a tubular contact element press-down jig (13, 23) for pressing down a plurality of the tubular contact elements inserted into their respective positioning holes in the tubular contact element positioning jig (12, 22), wherein the tubular contact element press-down jig (13, 23) of the mounting jig is provided with a plurality of projections, each being insertable into the tube of the tubular contact element; - positioning the insulated circuit board by holding the insulated circuit board in a specified position on the insulated circuit board positioning jig (11, 21); - positioning a plurality of the tubular contact elements on the circuit pattern on the insulated circuit board by laying the tubular contact element positioning jig (12, 22) on the insulated circuit board positioning jig (11, 21) and inserting a plurality of the tubular contact elements into their respective positioning holes in the tubular contact element positioning jig; and - laying the tubular contact element press-down jig (13, 23) on the tubular contact element positioning jig (12, 22) and carrying out heating while making the tubular contact element press-down jig (13, 23) press down a plurality of the tubular contact elements toward the insulated circuit board to solder a plurality of the tubular contact elements positioned on the circuit pattern on the insulated circuit board to the circuit pattern on the insulated circuit board positioned in the insulated circuit board positioning jig (11, 21). - an insulated circuit board having a circuit pattern formed on at least one of the surfaces thereof; - at least one semiconductor element mounted on the insulated circuit board; - a plurality of tubular contact elements joined to the circuit pattern on the insulated circuit board; - a plurality of external terminals electrically connected to their respective tubular contact elements; and - a case containing the insulated circuit board, - preparing a mounting jig (10, 20), said mounting jig comprising an insulated circuit board positioning jig (11, 21) holding the insulated circuit board at a specified position for positioning, a tubular contact element positioning jig (12, 22) having a plurality of positioning holes at specified positions into each of which holes the tubular contact element can be inserted, and a tubular contact element press-down jig (13, 23) for pressing down a plurality of the tubular contact elements inserted into their respective positioning holes in the tubular contact element positioning jig (12, 22), wherein the tubular contact element press-down jig (13, 23) of the mounting jig is provided with a plurality of projections, each being insertable into the tube of the tubular contact element; - positioning the insulated circuit board by holding the insulated circuit board in a specified position on the insulated circuit board positioning jig (11, 21); - positioning a plurality of the tubular contact elements on the circuit pattern on the insulated circuit board by laying the tubular contact element positioning jig (12, 22) on the insulated circuit board positioning jig (11, 21) and inserting a plurality of the tubular contact elements into their respective positioning holes in the tubular contact element positioning jig; and - laying the tubular contact element press-down jig (13, 23) on the tubular contact element positioning jig (12, 22) and carrying out heating while making the tubular contact element press-down jig (13, 23) press down a plurality of the tubular contact elements toward the insulated circuit board to solder a plurality of the tubular contact elements positioned on the circuit pattern on the insulated circuit board to the circuit pattern on the insulated circuit board positioned in the insulated circuit board positioning jig (11, 21).