A packaging process comprising steps of: providing a first carrier; forming a first thermal release material on the first carrier; providing at least one electronic component and at least one thermal conduction structure attached on the first thermal release material, wherein the at least one electronic component comprises at least one conducting terminal; forming a first insulation layer on a first surface of the at least one electronic component and a first surface of the at least one thermal conduction structure; removing the first carrier and the first thermal release material; providing a second carrier; forming a second thermal release material on the second carrier; attaching the first insulation layer with the at least one electronic component and the at least one thermal conduction structure on the second thermal release material; grinding at least one of a portion of a second surface of the at least one electronic component, a portion of a second surface of the at least one thermal conduction structure, and a portion of the first insulation layer; forming a second insulation layer on the second surface of the at least one electronic component and the second surface of the at least one thermal conduction structure; removing the second carrier and the second thermal release material; forming plural first openings on the first insulation layer; forming plural second openings through the corresponding first openings, wherein the conducting terminal and the first surface of the at least one thermal conduction structure are exposed through the plural second openings; forming a first metal layer through the plural second openings and disposed on the conducting terminal and the first surface of the at least one thermal conduction structure; forming plural third openings on the second insulation layer; forming plural fourth openings through the plural third openings, wherein the second surface of the at least one thermal conduction structure is exposed through the fourth openings; forming a second metal layer through the plural fourth openings and disposed on the second surface of the at least one thermal conduction structure; grinding a portion of the first metal layer to form at least one first contact pad and at least one second contact pad; and grinding a portion of the second metal layer to form at least one third contact pad, wherein the at least one first contact pad is corresponding to and in contact with the conducting terminal of the at least one electronic component, the at least one second contact pad is corresponding to and in contact with the first surface of the at least one thermal conduction structure, and the at least one third contact pad is corresponding to and in contact with the second surface of the at least one thermal conduction structure. providing a first carrier; forming a first thermal release material on the first carrier; providing at least one electronic component and at least one thermal conduction structure attached on the first thermal release material, wherein the at least one electronic component comprises at least one conducting terminal; forming a first insulation layer on a first surface of the at least one electronic component and a first surface of the at least one thermal conduction structure; removing the first carrier and the first thermal release material; providing a second carrier; forming a second thermal release material on the second carrier; attaching the first insulation layer with the at least one electronic component and the at least one thermal conduction structure on the second thermal release material; grinding at least one of a portion of a second surface of the at least one electronic component, a portion of a second surface of the at least one thermal conduction structure, and a portion of the first insulation layer; forming a second insulation layer on the second surface of the at least one electronic component and the second surface of the at least one thermal conduction structure; removing the second carrier and the second thermal release material; forming plural first openings on the first insulation layer; forming plural second openings through the corresponding first openings, wherein the conducting terminal and the first surface of the at least one thermal conduction structure are exposed through the plural second openings; forming a first metal layer through the plural second openings and disposed on the conducting terminal and the first surface of the at least one thermal conduction structure; forming plural third openings on the second insulation layer; forming plural fourth openings through the plural third openings, wherein the second surface of the at least one thermal conduction structure is exposed through the fourth openings; forming a second metal layer through the plural fourth openings and disposed on the second surface of the at least one thermal conduction structure; grinding a portion of the first metal layer to form at least one first contact pad and at least one second contact pad; and grinding a portion of the second metal layer to form at least one third contact pad, wherein the at least one first contact pad is corresponding to and in contact with the conducting terminal of the at least one electronic component, the at least one second contact pad is corresponding to and in contact with the first surface of the at least one thermal conduction structure, and the at least one third contact pad is corresponding to and in contact with the second surface of the at least one thermal conduction structure.