A printed circuit board, PCB, laminated structure, comprising: a first substrate; a second substrate disposed to overlap with the first substrate; and an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates (220, 230), wherein the interposer assembly comprises: a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate; a plurality of signal vias electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate; and a plurality of ground vias electrically coupled to the housing and configured to serve as a ground, wherein the ground vias are positioned apart from the signal vias, wherein a metal coating layer is disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates (220, 230), and wherein the plurality of signal vias and the plurality of ground vias are arranged at predetermined intervals along a circumference of the closed region, wherein two or more signal vias are consecutively arranged on both sides of each ground via. a first substrate; a second substrate disposed to overlap with the first substrate; and an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates (220, 230), wherein the interposer assembly comprises: a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate; a plurality of signal vias electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate; and a plurality of ground vias electrically coupled to the housing and configured to serve as a ground, wherein the ground vias are positioned apart from the signal vias, wherein a metal coating layer is disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates (220, 230), and wherein the plurality of signal vias and the plurality of ground vias are arranged at predetermined intervals along a circumference of the closed region, wherein two or more signal vias are consecutively arranged on both sides of each ground via. a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate; a plurality of signal vias electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate; and a plurality of ground vias electrically coupled to the housing and configured to serve as a ground, wherein the ground vias are positioned apart from the signal vias, wherein a metal coating layer is disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates (220, 230), and wherein the plurality of signal vias and the plurality of ground vias are arranged at predetermined intervals along a circumference of the closed region, wherein two or more signal vias are consecutively arranged on both sides of each ground via.