A method of fabricating optoelectronic modules each of which includes at least one optoelectronic device (76; 76A; 76B) and at least one optical element (62; 62A; 262; 310), the method comprising: providing, on a support surface (68; 51A; 51D; 51E; 70; 122; 222), a plurality of singulated transparent substrates (66; 266) separated laterally from one another and including optical elements; using a vacuum injection technique to cover sidewalls of each of the singulated transparent substrates with a non-transparent material; and forming spacer elements (64; 264; 314; 416) that project away from the support surface to form a wafer-scale structure (72; 72A; 72B; 94; 94A) including optical elements on the transparent substrates separated laterally from one another by portions of the spacer elements, wherein each spacer element has a respective free end, wherein the spacer elements are formed as part of the same vacuum injection process used to cover the sidewalls of the singulated transparent substrates with a non-transparent material, and wherein the method further includes: removing the support surface; either attaching a substrate wafer (74; 174; 320) to the free ends of the spacer elements so as to form a vertical stack (80; 96; 106; 136; 140; 142; 150; 321), wherein a plurality of optoelectronic devices are mounted on the substrate wafer or attaching a structural element to the free ends of the spacer elements so as to form a vertical stack, wherein the structural element is on a surface of a substrate wafer on which are mounted a plurality of optoelectronic devices each of which is surrounded laterally by the structural element; and separating the vertical stack into a plurality of individual modules (20A-G; 201;) each of which includes at least one of the optoelectronic devices. providing, on a support surface (68; 51A; 51D; 51E; 70; 122; 222), a plurality of singulated transparent substrates (66; 266) separated laterally from one another and including optical elements; using a vacuum injection technique to cover sidewalls of each of the singulated transparent substrates with a non-transparent material; and forming spacer elements (64; 264; 314; 416) that project away from the support surface to form a wafer-scale structure (72; 72A; 72B; 94; 94A) including optical elements on the transparent substrates separated laterally from one another by portions of the spacer elements, wherein each spacer element has a respective free end, wherein the spacer elements are formed as part of the same vacuum injection process used to cover the sidewalls of the singulated transparent substrates with a non-transparent material, and wherein the method further includes: removing the support surface; either attaching a substrate wafer (74; 174; 320) to the free ends of the spacer elements so as to form a vertical stack (80; 96; 106; 136; 140; 142; 150; 321), wherein a plurality of optoelectronic devices are mounted on the substrate wafer or attaching a structural element to the free ends of the spacer elements so as to form a vertical stack, wherein the structural element is on a surface of a substrate wafer on which are mounted a plurality of optoelectronic devices each of which is surrounded laterally by the structural element; and separating the vertical stack into a plurality of individual modules (20A-G; 201;) each of which includes at least one of the optoelectronic devices. removing the support surface; either attaching a substrate wafer (74; 174; 320) to the free ends of the spacer elements so as to form a vertical stack (80; 96; 106; 136; 140; 142; 150; 321), wherein a plurality of optoelectronic devices are mounted on the substrate wafer or attaching a structural element to the free ends of the spacer elements so as to form a vertical stack, wherein the structural element is on a surface of a substrate wafer on which are mounted a plurality of optoelectronic devices each of which is surrounded laterally by the structural element; and separating the vertical stack into a plurality of individual modules (20A-G; 201;) each of which includes at least one of the optoelectronic devices.