A communications connector comprising: a printed circuit board having a first internal conductive layer, a first external conductive layer and a second external conductive layer, the first and second external conductive layers (132-1, 132-6) and the first internal conductive layer stacked along a vertical axis with dielectric layers therebetween; wherein the printed circuit board includes a plurality of input terminals, a plurality of output terminals and a plurality of signal current carrying conductive paths, each of which electrically connects a respective one of the input terminals to a respective one of the output terminals, the signal current carrying conductive paths arranged in pairs to form a plurality of differential transmission lines, and wherein a first signal current carrying conductive path includes a first segment that is on the first internal conductive layer of the printed circuit board which is routed in a vertically stacked arrangement with a second segment of a second signal current carrying conductive path so that the first and second segments are on different layers of the printed circuit board and at least partially overlapping along an axis that is perpendicular to a major surface of the printed circuit board and extend in the same general direction for a distance that is at least twice an average width of at least one of the first and second segments, the first and second signal current carrying conductive paths forming a first differential transmission line of the plurality of differential transmission lines, wherein the first and second segments are on adjacent conductive layers (132-3, 132-4) of the printed circuit board, characterized in that the first segment has a first average width that exceeds the average width of the entirety of the first signal current carrying conductive path and/or the second segment has a second average width that exceeds the average width of the entirety of the second signal current carrying conductive path. a printed circuit board having a first internal conductive layer, a first external conductive layer and a second external conductive layer, the first and second external conductive layers (132-1, 132-6) and the first internal conductive layer stacked along a vertical axis with dielectric layers therebetween; wherein the printed circuit board includes a plurality of input terminals, a plurality of output terminals and a plurality of signal current carrying conductive paths, each of which electrically connects a respective one of the input terminals to a respective one of the output terminals, the signal current carrying conductive paths arranged in pairs to form a plurality of differential transmission lines, and wherein a first signal current carrying conductive path includes a first segment that is on the first internal conductive layer of the printed circuit board which is routed in a vertically stacked arrangement with a second segment of a second signal current carrying conductive path so that the first and second segments are on different layers of the printed circuit board and at least partially overlapping along an axis that is perpendicular to a major surface of the printed circuit board and extend in the same general direction for a distance that is at least twice an average width of at least one of the first and second segments, the first and second signal current carrying conductive paths forming a first differential transmission line of the plurality of differential transmission lines, wherein the first and second segments are on adjacent conductive layers (132-3, 132-4) of the printed circuit board, characterized in that the first segment has a first average width that exceeds the average width of the entirety of the first signal current carrying conductive path and/or the second segment has a second average width that exceeds the average width of the entirety of the second signal current carrying conductive path.