An electroplating system comprising an anode element and a pressure device for spraying electroplating solution to an object that is placed in an electroplating tank with the electroplating solution for depositing a plating material on the object, the pressure device comprising: a lid having a first surface, a second surface and a plurality of second through holes, the first and second surfaces (111, 112) of the lid being communicated with each other through the second through holes, and a base having a third surface, a plurality of conduction tubes and a plurality of third through holes penetrating through the base, wherein each conduction tube includes a conduction hole connecting to one of the third through holes while each of the second through holes reveals one of the conduction holes and a connecting portion of each of the conduction tubes is inserted in one of the second through holes, wherein the lid has a plurality of first through holes, the first and second surfaces (111, 112) of the lid being communicated with each other through the first through holes, the base has a chamber recessed on the third surface, the third through holes are formed in the chamber, the conduction tubes are positioned in the chamber, the lid covers an opening of the chamber, and the first through holes communicate with the chamber; wherein the pressure device further comprises a feeding pipe communicating with the chamber, the feeding pipe is configured to supply the electroplating solution to the chamber for allowing the electroplating solution in the chamber to be sprayed through the first through holes; wherein the conduction holes and the third through holes connected with each other define a passage of electric force line for the electroplating solution within the conduction holes and the third through holes; wherein the anode element is disposed outside the pressure device and located outside an end of the passage of electric force line. a lid having a first surface, a second surface and a plurality of second through holes, the first and second surfaces (111, 112) of the lid being communicated with each other through the second through holes, and a base having a third surface, a plurality of conduction tubes and a plurality of third through holes penetrating through the base, wherein each conduction tube includes a conduction hole connecting to one of the third through holes while each of the second through holes reveals one of the conduction holes and a connecting portion of each of the conduction tubes is inserted in one of the second through holes, wherein the lid has a plurality of first through holes, the first and second surfaces (111, 112) of the lid being communicated with each other through the first through holes, the base has a chamber recessed on the third surface, the third through holes are formed in the chamber, the conduction tubes are positioned in the chamber, the lid covers an opening of the chamber, and the first through holes communicate with the chamber; wherein the pressure device further comprises a feeding pipe communicating with the chamber, the feeding pipe is configured to supply the electroplating solution to the chamber for allowing the electroplating solution in the chamber to be sprayed through the first through holes; wherein the conduction holes and the third through holes connected with each other define a passage of electric force line for the electroplating solution within the conduction holes and the third through holes; wherein the anode element is disposed outside the pressure device and located outside an end of the passage of electric force line.