A method for manufacturing an array substrate, comprising: providing a first substrate having an array of a plurality of micro light emitting diodes, micro LEDs; providing a target substrate having a bonding layer comprising a plurality of bonding contacts; applying the plurality of bonding contacts with an electrical potential; aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential; and transferring the plurality of micro LEDs in the first substrate onto the target substrate; and characterized in that the method further comprises: moving the first substrate away from the target substrate to form the array substrate having the plurality of micro LEDs transferred to the plurality of bonding contacts; wherein applying the plurality of bonding contacts with the electrical potential comprises applying the electrical potential to a signal line commonly connected to the plurality of bonding contacts; wherein the target substrate comprises an array of a plurality of thin film transistors, each of which comprising a drain electrode electrically connected to one of the plurality of bonding contacts, a source electrode electrically connected to a common electrode, and a gate electrode; wherein applying the electrical potential to the signal line commonly connected to the plurality of bonding contacts comprises: applying a plurality of gate scanning signals respectively to a plurality of gate electrodes of the plurality of thin film transistors to turn on the plurality of thin film transistors; and applying the electrical potential to the common electrode electrically connected to a plurality of source electrode of the plurality of thin film transistors thereby applying the electrical potential to the plurality of bonding contacts. providing a first substrate having an array of a plurality of micro light emitting diodes, micro LEDs; providing a target substrate having a bonding layer comprising a plurality of bonding contacts; applying the plurality of bonding contacts with an electrical potential; aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential; and transferring the plurality of micro LEDs in the first substrate onto the target substrate; and characterized in that the method further comprises: moving the first substrate away from the target substrate to form the array substrate having the plurality of micro LEDs transferred to the plurality of bonding contacts; wherein applying the plurality of bonding contacts with the electrical potential comprises applying the electrical potential to a signal line commonly connected to the plurality of bonding contacts; wherein the target substrate comprises an array of a plurality of thin film transistors, each of which comprising a drain electrode electrically connected to one of the plurality of bonding contacts, a source electrode electrically connected to a common electrode, and a gate electrode; wherein applying the electrical potential to the signal line commonly connected to the plurality of bonding contacts comprises: applying a plurality of gate scanning signals respectively to a plurality of gate electrodes of the plurality of thin film transistors to turn on the plurality of thin film transistors; and applying the electrical potential to the common electrode electrically connected to a plurality of source electrode of the plurality of thin film transistors thereby applying the electrical potential to the plurality of bonding contacts. moving the first substrate away from the target substrate to form the array substrate having the plurality of micro LEDs transferred to the plurality of bonding contacts; wherein applying the plurality of bonding contacts with the electrical potential comprises applying the electrical potential to a signal line commonly connected to the plurality of bonding contacts; wherein the target substrate comprises an array of a plurality of thin film transistors, each of which comprising a drain electrode electrically connected to one of the plurality of bonding contacts, a source electrode electrically connected to a common electrode, and a gate electrode; wherein applying the electrical potential to the signal line commonly connected to the plurality of bonding contacts comprises: applying a plurality of gate scanning signals respectively to a plurality of gate electrodes of the plurality of thin film transistors to turn on the plurality of thin film transistors; and applying the electrical potential to the common electrode electrically connected to a plurality of source electrode of the plurality of thin film transistors thereby applying the electrical potential to the plurality of bonding contacts. applying a plurality of gate scanning signals respectively to a plurality of gate electrodes of the plurality of thin film transistors to turn on the plurality of thin film transistors; and applying the electrical potential to the common electrode electrically connected to a plurality of source electrode of the plurality of thin film transistors thereby applying the electrical potential to the plurality of bonding contacts.