An image capturing module, comprising: at least one optical lens unit; at least one circuit board; at least one light-transmitting protective element; at least one photosensitive element, wherein the photosensitive element is conductively connected to the circuit board, wherein the photosensitive element has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the protective element is disposed on the photosensitive element in an overlapping manner, and the protective element covers at least the photosensitive region of the photosensitive element; wherein the image capturing module comprises at least one frame-shaped supporting element formed of a first medium, at least a part of the supporting element is held between the non-photosensitive region of the photosensitive element and the protective element, wherein the supporting element is resilient and forms a buffer portion held between the photosensitive element and the protective element, and a sealed space is formed among the protective element, the photosensitive element and the supporting element, wherein the photosensitive region of the photosensitive element is held in the sealed space so as to prevent the photosensitive region of the photosensitive element from being contaminated in subsequent molding process; and the image capturing module comprises at least one molded base formed of a second medium, wherein the molded base is integrally bonded to the circuit board, the photosensitive element, and the protective element, wherein at least a part of a top surface of the molded base is removed so that a part of the protective element corresponding to the photosensitive region of the photosensitive element is exposed to form an exposed face of the protective element, and the photosensitive region of the photosensitive element corresponds to the exposed face of the protective element, wherein the optical lens unit is held in a photosensitive path of the photosensitive element; wherein the image capturing module further comprises at least one compensation portion, wherein the compensation portion is formed of a fourth medium applied to an edge region of the circuit board, and the compensation portion is held between the molded base and the edge region of the circuit board and configured to compensate the difference between the deformation amplitude of the molded base and the deformation amplitude of the circuit board in baking process. at least one optical lens unit; at least one circuit board; at least one light-transmitting protective element; at least one photosensitive element, wherein the photosensitive element is conductively connected to the circuit board, wherein the photosensitive element has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the protective element is disposed on the photosensitive element in an overlapping manner, and the protective element covers at least the photosensitive region of the photosensitive element; wherein the image capturing module comprises at least one frame-shaped supporting element formed of a first medium, at least a part of the supporting element is held between the non-photosensitive region of the photosensitive element and the protective element, wherein the supporting element is resilient and forms a buffer portion held between the photosensitive element and the protective element, and a sealed space is formed among the protective element, the photosensitive element and the supporting element, wherein the photosensitive region of the photosensitive element is held in the sealed space so as to prevent the photosensitive region of the photosensitive element from being contaminated in subsequent molding process; and the image capturing module comprises at least one molded base formed of a second medium, wherein the molded base is integrally bonded to the circuit board, the photosensitive element, and the protective element, wherein at least a part of a top surface of the molded base is removed so that a part of the protective element corresponding to the photosensitive region of the photosensitive element is exposed to form an exposed face of the protective element, and the photosensitive region of the photosensitive element corresponds to the exposed face of the protective element, wherein the optical lens unit is held in a photosensitive path of the photosensitive element; wherein the image capturing module further comprises at least one compensation portion, wherein the compensation portion is formed of a fourth medium applied to an edge region of the circuit board, and the compensation portion is held between the molded base and the edge region of the circuit board and configured to compensate the difference between the deformation amplitude of the molded base and the deformation amplitude of the circuit board in baking process.