A gas sensor package comprising: a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a controller provided in the hole of the package substrate; a gas sensor disposed in the hole of the package substrate and stacked on a top surface of the controller; and a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; wherein the package substrate comprises: a signal structure electrically connected to the controller and the gas sensor through the controller; and a ground structure electrically connected to the fixing plate, and characterized in that the gas sensor package further comprises: a protective film attached to the fixing plate, wherein the protective film allows a gas to pass through and overlaps the vent hole when viewed in a plan view; a signal pad directly disposed on the first surface of the package substrate and electrically connected to the signal structure; and a ground pad directly disposed on the first surface of the package substrate and electrically connected to the ground structure, and wherein the ground structure is electrically insulated from the signal structure and electrically connected to the controller and the gas sensor through the controller. a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a controller provided in the hole of the package substrate; a gas sensor disposed in the hole of the package substrate and stacked on a top surface of the controller; and a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; wherein the package substrate comprises: a signal structure electrically connected to the controller and the gas sensor through the controller; and a ground structure electrically connected to the fixing plate, and characterized in that the gas sensor package further comprises: a protective film attached to the fixing plate, wherein the protective film allows a gas to pass through and overlaps the vent hole when viewed in a plan view; a signal pad directly disposed on the first surface of the package substrate and electrically connected to the signal structure; and a ground pad directly disposed on the first surface of the package substrate and electrically connected to the ground structure, and wherein the ground structure is electrically insulated from the signal structure and electrically connected to the controller and the gas sensor through the controller. a signal structure electrically connected to the controller and the gas sensor through the controller; and a ground structure electrically connected to the fixing plate, and characterized in that the gas sensor package further comprises: a protective film attached to the fixing plate, wherein the protective film allows a gas to pass through and overlaps the vent hole when viewed in a plan view; a signal pad directly disposed on the first surface of the package substrate and electrically connected to the signal structure; and a ground pad directly disposed on the first surface of the package substrate and electrically connected to the ground structure, and wherein the ground structure is electrically insulated from the signal structure and electrically connected to the controller and the gas sensor through the controller. a protective film attached to the fixing plate, wherein the protective film allows a gas to pass through and overlaps the vent hole when viewed in a plan view; a signal pad directly disposed on the first surface of the package substrate and electrically connected to the signal structure; and a ground pad directly disposed on the first surface of the package substrate and electrically connected to the ground structure, and wherein the ground structure is electrically insulated from the signal structure and electrically connected to the controller and the gas sensor through the controller.