An optical scanner module, comprising: an optical scanner apparatus configured to scan incident light by oscillating a mirror; and a package on which the optical scanner apparatus is mounted, wherein the optical scanner apparatus includes a displacement sensor (391, 395, 396) configured to detect an oscillation angle of the mirror, wherein a sensor interconnect (P S) connected to the displacement sensor and a drive interconnect (P D) through which a drive signal for oscillating the mirror passes are respectively drawn from the optical scanner apparatus into the package, characterized in that the package includes stacked interconnect layers (L1, L2) in which the sensor interconnect (P S) and the drive interconnect (P D) are formed, in that portions of the sensor interconnect (P S) and the drive interconnect (P D) in the stacked interconnect layers (L1, L2) which extend in substantially the same direction are placed not to overlap in a plan view of the interconnect layers (L1, L2), and in that a GND interconnect (P G) is provided between the sensor interconnect (P S) and the drive interconnect (P D) that are adjacent in a same interconnect layer (L1, L2) wherein in each of the stacked interconnect layers (L1, L2), a GND layer including a GND surface whose entire surface is grounded is sandwiched between the interconnect layers (L1, L2) in each of which the sensor interconnect (P S) and the drive interconnect (P D) are formed, and wherein when the sensor interconnect (P S) and the drive interconnect (P D) that are adjacent in upper and lower directions are crossing with each other, the sensor interconnect (P S) and the drive interconnect (P D) are provided to be perpendicular to each other. an optical scanner apparatus configured to scan incident light by oscillating a mirror; and a package on which the optical scanner apparatus is mounted, wherein the optical scanner apparatus includes a displacement sensor (391, 395, 396) configured to detect an oscillation angle of the mirror, wherein a sensor interconnect (P S) connected to the displacement sensor and a drive interconnect (P D) through which a drive signal for oscillating the mirror passes are respectively drawn from the optical scanner apparatus into the package, characterized in that the package includes stacked interconnect layers (L1, L2) in which the sensor interconnect (P S) and the drive interconnect (P D) are formed, in that portions of the sensor interconnect (P S) and the drive interconnect (P D) in the stacked interconnect layers (L1, L2) which extend in substantially the same direction are placed not to overlap in a plan view of the interconnect layers (L1, L2), and in that a GND interconnect (P G) is provided between the sensor interconnect (P S) and the drive interconnect (P D) that are adjacent in a same interconnect layer (L1, L2) wherein in each of the stacked interconnect layers (L1, L2), a GND layer including a GND surface whose entire surface is grounded is sandwiched between the interconnect layers (L1, L2) in each of which the sensor interconnect (P S) and the drive interconnect (P D) are formed, and wherein when the sensor interconnect (P S) and the drive interconnect (P D) that are adjacent in upper and lower directions are crossing with each other, the sensor interconnect (P S) and the drive interconnect (P D) are provided to be perpendicular to each other.