An integrated circuit package comprising: a first memory die having a first set of connections; a second memory die arranged adjacent to the first memory die, the second memory die having a second set of connections; a first substrate having a first opening and a second opening, the first substrate having a third set of connections to connect to the first set of connections of the first memory die by bond wires via the first opening and a fourth set of connections to connect to the second set of connections of the second memory die by bond wires via the second opening; a second substrate having a first integrated circuit disposed on an upper surface of the second substrate, wherein the first substrate is connected to the second substrate with the first integrated circuit disposed between the first substrate and second substrate, wherein the first and second memory dies are disposed on top of an upper surface of the first substrate, and wherein the first substrate is disposed on top of the second substrate; characterized in that the first and second memory dies are disposed on top of the same upper surface of the first substrate; and the integrated circuit package further comprises a third memory die having a fifth set of connections; a fourth memory die arranged adjacent to the third memory die, the fourth memory die having a sixth set of connections; and a third substrate having a third opening and a fourth opening, the third substrate having a seventh set of connections to connect to the fifth set of connections of the third memory die by bond wires via the third opening and an eighth set of connections to connect to the sixth set of connections of the fourth memory die by bond wires via the fourth opening, wherein the third substrate is disposed on top of the first substrate, wherein the first and second memory dies are disposed between the first and third substrate, wherein the third and fourth memory dies are disposed on top of an upper surface of the third substrate, and wherein the third and fourth memory dies are disposed on top of the same upper surface of the third substrate; and a plurality of pillars, wherein the plurality of pillars are used to secure the third substrate on top of the first substrate and provide connections between the first and third substrates. a first memory die having a first set of connections; a second memory die arranged adjacent to the first memory die, the second memory die having a second set of connections; a first substrate having a first opening and a second opening, the first substrate having a third set of connections to connect to the first set of connections of the first memory die by bond wires via the first opening and a fourth set of connections to connect to the second set of connections of the second memory die by bond wires via the second opening; a second substrate having a first integrated circuit disposed on an upper surface of the second substrate, wherein the first substrate is connected to the second substrate with the first integrated circuit disposed between the first substrate and second substrate, wherein the first and second memory dies are disposed on top of an upper surface of the first substrate, and wherein the first substrate is disposed on top of the second substrate; characterized in that the first and second memory dies are disposed on top of the same upper surface of the first substrate; and the integrated circuit package further comprises a third memory die having a fifth set of connections; a fourth memory die arranged adjacent to the third memory die, the fourth memory die having a sixth set of connections; and a third substrate having a third opening and a fourth opening, the third substrate having a seventh set of connections to connect to the fifth set of connections of the third memory die by bond wires via the third opening and an eighth set of connections to connect to the sixth set of connections of the fourth memory die by bond wires via the fourth opening, wherein the third substrate is disposed on top of the first substrate, wherein the first and second memory dies are disposed between the first and third substrate, wherein the third and fourth memory dies are disposed on top of an upper surface of the third substrate, and wherein the third and fourth memory dies are disposed on top of the same upper surface of the third substrate; and a plurality of pillars, wherein the plurality of pillars are used to secure the third substrate on top of the first substrate and provide connections between the first and third substrates.