A power semiconductor module, comprising: - at least one submodule including - at least one power semiconductor device, wherein said at least one power semiconductor device is connected to at least one press pin and at least one gate pin, - the at least one press pin comprises an upper part and a lower part, - the lower part is in direct contact to the at least one power semiconductor device, - the press pin comprises a spring washer pack being configured to apply a force between the upper part and the lower part, pushing them in opposite directions, and - a housing laterally surrounding the at least one power semiconductor device, the at least one press pin and the at least one gate pin in lateral directions, - a module frame laterally surrounding the at least one submodule in lateral directions, wherein - at least one elastic element is arranged between the module frame and the housing, - the module frame comprises a first protrusion on an inner side surface facing the at least one submodule, - the elastic element is arranged on the first protrusion, - the housing comprises a second protrusion on an outer side surface facing the module frame, - the second protrusion is arranged on the elastic element, and - the elastic element is continuously arranged between the module frame and the housing and such that, due to the elastic element, a freedom of movement of the submodule is reduced within the module frame in vertical direction and lateral direction. - at least one submodule including - at least one power semiconductor device, wherein said at least one power semiconductor device is connected to at least one press pin and at least one gate pin, - the at least one press pin comprises an upper part and a lower part, - the lower part is in direct contact to the at least one power semiconductor device, - the press pin comprises a spring washer pack being configured to apply a force between the upper part and the lower part, pushing them in opposite directions, and - a housing laterally surrounding the at least one power semiconductor device, the at least one press pin and the at least one gate pin in lateral directions, - at least one power semiconductor device, wherein said at least one power semiconductor device is connected to at least one press pin and at least one gate pin, said at least one power semiconductor device is connected to at least one press pin and at least one gate pin, - the at least one press pin comprises an upper part and a lower part, - the lower part is in direct contact to the at least one power semiconductor device, - the press pin comprises a spring washer pack being configured to apply a force between the upper part and the lower part, pushing them in opposite directions, and - a housing laterally surrounding the at least one power semiconductor device, the at least one press pin and the at least one gate pin in lateral directions, - a module frame laterally surrounding the at least one submodule in lateral directions, wherein - at least one elastic element is arranged between the module frame and the housing, - the module frame comprises a first protrusion on an inner side surface facing the at least one submodule, - the elastic element is arranged on the first protrusion, - the housing comprises a second protrusion on an outer side surface facing the module frame, - the second protrusion is arranged on the elastic element, and - the elastic element is continuously arranged between the module frame and the housing and such that, due to the elastic element, a freedom of movement of the submodule is reduced within the module frame in vertical direction and lateral direction.