A polyamide resin composition comprising: a polyamide resin; a carbonate or a bicarbonate of an alkali metal; and at least one or more compounds selected from the group consisting of following to: a copper salt, at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, a crystalline thermoplastic resin having a lower melting point than that of the component and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component, wherein the Vicat softening point is measured according to ISO 306 B50, and an organic acid, wherein a content of the component is 0.03 to 20 parts by mass based on parts by mass in total of the component and the component, and the components to have following respective contents when selected as a component contained therein: component: 0.001 to 0.05 parts by mass in terms of an amount of a metal element based on 100 parts by mass in total of the component and the component, component: 0.8 to 20 parts by mass based on 100 parts by mass in total of the component and the component, and component: 1 to 50 parts by mass based on 100 parts by mass in total of the component and the component. a polyamide resin; a carbonate or a bicarbonate of an alkali metal; and at least one or more compounds selected from the group consisting of following to: a copper salt, at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, a crystalline thermoplastic resin having a lower melting point than that of the component and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component, wherein the Vicat softening point is measured according to ISO 306 B50, and an organic acid, wherein a content of the component is 0.03 to 20 parts by mass based on parts by mass in total of the component and the component, and the components to have following respective contents when selected as a component contained therein: component: 0.001 to 0.05 parts by mass in terms of an amount of a metal element based on 100 parts by mass in total of the component and the component, component: 0.8 to 20 parts by mass based on 100 parts by mass in total of the component and the component, and component: 1 to 50 parts by mass based on 100 parts by mass in total of the component and the component. a copper salt, at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, a crystalline thermoplastic resin having a lower melting point than that of the component and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component, wherein the Vicat softening point is measured according to ISO 306 B50, and an organic acid, wherein a content of the component is 0.03 to 20 parts by mass based on parts by mass in total of the component and the component, and the components to have following respective contents when selected as a component contained therein: component: 0.001 to 0.05 parts by mass in terms of an amount of a metal element based on 100 parts by mass in total of the component and the component, component: 0.8 to 20 parts by mass based on 100 parts by mass in total of the component and the component, and component: 1 to 50 parts by mass based on 100 parts by mass in total of the component and the component. component: 0.001 to 0.05 parts by mass in terms of an amount of a metal element based on 100 parts by mass in total of the component and the component, component: 0.8 to 20 parts by mass based on 100 parts by mass in total of the component and the component, and component: 1 to 50 parts by mass based on 100 parts by mass in total of the component and the component.