A light emitting element comprising: a semiconductor layered body having a rectangular planar shape and including a first semiconductor layer, a light emitting layer, and a second semiconductor layer in this order, the semiconductor layered body defining a plurality of exposed portions in which the first semiconductor layer is exposed from the second semiconductor layer and the light emitting layer, each of the exposed portions being surrounded by the second semiconductor layer in a plan view; an insulating film covering the semiconductor layered body, and defining a plurality of opening portions respectively above the exposed portions; a first electrode connected to the exposed portions at the opening portions, a portion of the first electrode being disposed on the second semiconductor layer via the insulating film; a second electrode connected to the second semiconductor layer; a first external connection portion connected to the first electrode and spaced apart from the exposed portions in the plan view; and a second external connection portion connected to the second electrode, wherein in the plan view, the first external connection portion includes a plurality of first portions located between the exposed portions in a first direction parallel to one side of the semiconductor layered body, and arrayed in the first direction, with a number of the first portions disposed between adjacent ones of the exposed portions being two or more, and a plurality of second portions not located between the exposed portions in the first direction, and arrayed in the first direction, each of the second portions being different in shape or size from each of the first portions. a semiconductor layered body having a rectangular planar shape and including a first semiconductor layer, a light emitting layer, and a second semiconductor layer in this order, the semiconductor layered body defining a plurality of exposed portions in which the first semiconductor layer is exposed from the second semiconductor layer and the light emitting layer, each of the exposed portions being surrounded by the second semiconductor layer in a plan view; an insulating film covering the semiconductor layered body, and defining a plurality of opening portions respectively above the exposed portions; a first electrode connected to the exposed portions at the opening portions, a portion of the first electrode being disposed on the second semiconductor layer via the insulating film; a second electrode connected to the second semiconductor layer; a first external connection portion connected to the first electrode and spaced apart from the exposed portions in the plan view; and a second external connection portion connected to the second electrode, wherein in the plan view, the first external connection portion includes a plurality of first portions located between the exposed portions in a first direction parallel to one side of the semiconductor layered body, and arrayed in the first direction, with a number of the first portions disposed between adjacent ones of the exposed portions being two or more, and a plurality of second portions not located between the exposed portions in the first direction, and arrayed in the first direction, each of the second portions being different in shape or size from each of the first portions. a plurality of first portions located between the exposed portions in a first direction parallel to one side of the semiconductor layered body, and arrayed in the first direction, with a number of the first portions disposed between adjacent ones of the exposed portions being two or more, and a plurality of second portions not located between the exposed portions in the first direction, and arrayed in the first direction, each of the second portions being different in shape or size from each of the first portions.