A method of assembling a photovoltaic module comprising: a transparent protective top layer; an encapsulant layer; at least one photovoltaic cell comprising electrical contacts on the same side of the cell; a back sheet; a sheet of encapsulant material, comprising holes for interconnections, configured to be assembled between the photovoltaic cell and the back sheet; and conductive circuit elements between the back sheet and the sheet of encapsulant material; the method comprising: placing the encapsulant layer on top of the protective layer; char act e r i zed in that the method comprises: printing at least one layer of interconnecting paste to the electrical contacts of the photovoltaic cell; placing the photovoltaic cell with interconnecting paste on the encapsulant layer lying on the transparent protective top layer; and, then, placing the sheet of encapsulant material, conductive circuit elements and the back sheet on top of the photovoltaic cell so that the interconnecting paste creates an interconnection between the photovoltaic cell and the conductive circuit elements through the holes. a transparent protective top layer; an encapsulant layer; at least one photovoltaic cell comprising electrical contacts on the same side of the cell; a back sheet; a sheet of encapsulant material, comprising holes for interconnections, configured to be assembled between the photovoltaic cell and the back sheet; and conductive circuit elements between the back sheet and the sheet of encapsulant material; the method comprising: placing the encapsulant layer on top of the protective layer; char act e r i zed in that the method comprises: printing at least one layer of interconnecting paste to the electrical contacts of the photovoltaic cell; placing the photovoltaic cell with interconnecting paste on the encapsulant layer lying on the transparent protective top layer; and, then, placing the sheet of encapsulant material, conductive circuit elements and the back sheet on top of the photovoltaic cell so that the interconnecting paste creates an interconnection between the photovoltaic cell and the conductive circuit elements through the holes. placing the encapsulant layer on top of the protective layer; char act e r i zed in that the method comprises: printing at least one layer of interconnecting paste to the electrical contacts of the photovoltaic cell; placing the photovoltaic cell with interconnecting paste on the encapsulant layer lying on the transparent protective top layer; and, then, placing the sheet of encapsulant material, conductive circuit elements and the back sheet on top of the photovoltaic cell so that the interconnecting paste creates an interconnection between the photovoltaic cell and the conductive circuit elements through the holes. printing at least one layer of interconnecting paste to the electrical contacts of the photovoltaic cell; placing the photovoltaic cell with interconnecting paste on the encapsulant layer lying on the transparent protective top layer; and, then, placing the sheet of encapsulant material, conductive circuit elements and the back sheet on top of the photovoltaic cell so that the interconnecting paste creates an interconnection between the photovoltaic cell and the conductive circuit elements through the holes.