An electronic apparatus comprising: an electronic panel comprising a base substrate a plurality of pixels on the base substrate, and a plurality of pads in an adhesive area, the plurality of pads being spaced apart from the plurality of pixels; a circuit board comprising a base film and a plurality of leads disposed on the base film and overlapping the plurality of pads in a plan view; and a conductive adhesive member disposed on the adhesive area and configured to electrically connect the circuit board and the electronic panel, wherein the plurality of pads comprise: a plurality of pixel pads electrically connected to the plurality of pixels, an arrangement pad spaced apart from the plurality of pixel pads for providing, together with an arrangement lead, a reference for arrangement between the electronic panel and the circuit board when the electronic panel and the circuit board are combined by the adhesive member, and a resistance measurement pad disposed between the arrangement pad and the plurality of pixels pads and insulated from the plurality of pixel pads, wherein the plurality of leads comprise a plurality of pixel leads overlapping the plurality of pixel pads in the plan view, the arrangement lead overlapping the arrangement pad in the plan view, and a resistance measurement lead disposed between the plurality of pixel leads and the arrangement lead insulated from the plurality of pixel leads and electrically connected to the resistance measurement pad; and wherein the resistance measurement lead comprises a plurality of measurement leads disposed between the arrangement lead and the plurality of pixel leads and electrically connected to the resistance measurement pad and a dummy lead spaced apart from each of the plurality of measurement leads in the plan view, wherein the connection of the measurement leads to the resistance measurement pad forms a resistance measurement pattern. an electronic panel comprising a base substrate a plurality of pixels on the base substrate, and a plurality of pads in an adhesive area, the plurality of pads being spaced apart from the plurality of pixels; a circuit board comprising a base film and a plurality of leads disposed on the base film and overlapping the plurality of pads in a plan view; and a conductive adhesive member disposed on the adhesive area and configured to electrically connect the circuit board and the electronic panel, wherein the plurality of pads comprise: a plurality of pixel pads electrically connected to the plurality of pixels, an arrangement pad spaced apart from the plurality of pixel pads for providing, together with an arrangement lead, a reference for arrangement between the electronic panel and the circuit board when the electronic panel and the circuit board are combined by the adhesive member, and a resistance measurement pad disposed between the arrangement pad and the plurality of pixels pads and insulated from the plurality of pixel pads, a plurality of pixel pads electrically connected to the plurality of pixels, an arrangement pad spaced apart from the plurality of pixel pads for providing, together with an arrangement lead, a reference for arrangement between the electronic panel and the circuit board when the electronic panel and the circuit board are combined by the adhesive member, and a resistance measurement pad disposed between the arrangement pad and the plurality of pixels pads and insulated from the plurality of pixel pads, wherein the plurality of leads comprise a plurality of pixel leads overlapping the plurality of pixel pads in the plan view, the arrangement lead overlapping the arrangement pad in the plan view, and a resistance measurement lead disposed between the plurality of pixel leads and the arrangement lead insulated from the plurality of pixel leads and electrically connected to the resistance measurement pad; and wherein the resistance measurement lead comprises a plurality of measurement leads disposed between the arrangement lead and the plurality of pixel leads and electrically connected to the resistance measurement pad and a dummy lead spaced apart from each of the plurality of measurement leads in the plan view, wherein the connection of the measurement leads to the resistance measurement pad forms a resistance measurement pattern.