A case for an electronic device, the case (100,..., 900,...) comprising: a fastening part (110, 1110) attachable and detachable to and from at least part of the electronic device (200, 1000); a cover (120, 620, 720, 920, 1120) configured to cover a first surface of the electronic device (200, 1000) that faces a first direction, with the cover (120, 620, 720, 920, 1120) in a closed state; and a connecting part (130, 630, 730, 930, 1130) configured to connect the fastening part (110, 1110) and the cover (120, 620, 720, 920, 1120), wherein the cover includes: a base plate (121, 621, 721, 921, 1221); and a soft material part (122, 622, 722, 922, 1222) disposed in a second direction from the base plate (121, 621, 721, 921, 1221), with the cover in the closed state, the second direction being opposite to the first direction, wherein at least a portion of the soft material part (122, 622, 722, 922, 1222) makes contact with the first surface of the electronic device, wherein at least a portion of a first surface of the base plate that faces the first direction, with the cover in a closed state, has a curved surface shape, and an area of a second surface of the base plate that faces the second direction, with the cover in a closed state, and makes contact with the soft material part (122, 622, 722, 922, 1222) has a flat surface shape; and wherein the cover further includes: an intermediate film (123, 1123) disposed in the first direction from the soft material part (122, 622, 722, 922, 1222), with the cover in the closed state; and an adhesive film (124, 1224) disposed between the base plate (121, 621, 721, 921, 1221) and the intermediate film (123, 1123) and configured to bond the base plate and the intermediate film. a fastening part (110, 1110) attachable and detachable to and from at least part of the electronic device (200, 1000); a cover (120, 620, 720, 920, 1120) configured to cover a first surface of the electronic device (200, 1000) that faces a first direction, with the cover (120, 620, 720, 920, 1120) in a closed state; and a connecting part (130, 630, 730, 930, 1130) configured to connect the fastening part (110, 1110) and the cover (120, 620, 720, 920, 1120), wherein the cover includes: a base plate (121, 621, 721, 921, 1221); and a soft material part (122, 622, 722, 922, 1222) disposed in a second direction from the base plate (121, 621, 721, 921, 1221), with the cover in the closed state, the second direction being opposite to the first direction, wherein at least a portion of the soft material part (122, 622, 722, 922, 1222) makes contact with the first surface of the electronic device, a base plate (121, 621, 721, 921, 1221); and a soft material part (122, 622, 722, 922, 1222) disposed in a second direction from the base plate (121, 621, 721, 921, 1221), with the cover in the closed state, the second direction being opposite to the first direction, wherein at least a portion of the soft material part (122, 622, 722, 922, 1222) makes contact with the first surface of the electronic device, wherein at least a portion of a first surface of the base plate that faces the first direction, with the cover in a closed state, has a curved surface shape, and an area of a second surface of the base plate that faces the second direction, with the cover in a closed state, and makes contact with the soft material part (122, 622, 722, 922, 1222) has a flat surface shape; and wherein the cover further includes: an intermediate film (123, 1123) disposed in the first direction from the soft material part (122, 622, 722, 922, 1222), with the cover in the closed state; and an adhesive film (124, 1224) disposed between the base plate (121, 621, 721, 921, 1221) and the intermediate film (123, 1123) and configured to bond the base plate and the intermediate film. an intermediate film (123, 1123) disposed in the first direction from the soft material part (122, 622, 722, 922, 1222), with the cover in the closed state; and an adhesive film (124, 1224) disposed between the base plate (121, 621, 721, 921, 1221) and the intermediate film (123, 1123) and configured to bond the base plate and the intermediate film.