An apparatus for transferring electronic components from a first carrier to a second carrier, wherein - the first carrier carries a plurality of individual components detachably therefrom, and - the second carrier is quasi-endless and carries in its longitudinal extension a plurality of electronic subassemblies to each of which one of the components is to be transferred from the first carrier, and wherein the device comprises: - a first receptacle provided and adapted to receive said first carrier; - a second receptacle provided and adapted to guide said second carrier along its longitudinal extension in a conveying direction of said second carrier; wherein - the first receptacle is provided and arranged to receive the first carrier such that the components carried thereby are oriented towards the second receptacle; - a separating device provided and arranged to separate the components from the first carrier in a contacting or non-contacting manner in order to transfer them to the second carrier; - the second receptacle has a contact surface for the second carrier which is curved in the conveying direction of the second carrier, and - a conveying device (F3, F3', F3") for the second carrier is at least partially associated with the second receptacle, wherein the conveying device (F3, F3', F3") is designed and set up to convey the second carrier in its position relative to a placement position in response to information signalled by a control unit, that an electronic subassembly on the second carrier reaches the placement position on the second receptacle guiding the second carrier, and wherein - a heating acting in the region of the second receptacle is arranged, which is provided and arranged for the purpose of tempering the second carrier before, at or after the placement position from its side remote from the first receptacle by appropriate control of the heating by the control unit as a whole or in sections in the region of the second receptacle as a function of the material properties, the melting point of contact points of the component to be transferred and/or the material properties, the melting point of contact points of the electronic subassembly on the second carrier, and wherein - the heating is designed as a heating strip with one or more heating zones to be heated to different temperatures, which has a shape at least partially following the contour of the second receptacle and which is provided and set up to heat the second carrier in the region of the second receptacle. - the first carrier carries a plurality of individual components detachably therefrom, and - the second carrier is quasi-endless and carries in its longitudinal extension a plurality of electronic subassemblies to each of which one of the components is to be transferred from the first carrier, and wherein the device comprises: - a first receptacle provided and adapted to receive said first carrier; - a second receptacle provided and adapted to guide said second carrier along its longitudinal extension in a conveying direction of said second carrier; wherein - the first receptacle is provided and arranged to receive the first carrier such that the components carried thereby are oriented towards the second receptacle; - a separating device provided and arranged to separate the components from the first carrier in a contacting or non-contacting manner in order to transfer them to the second carrier; - the second receptacle has a contact surface for the second carrier which is - a conveying device (F3, F3', F3") for the second carrier is at least partially associated with the second receptacle, wherein the conveying device (F3, F3', F3") is designed and set up to convey the second carrier in its position relative to a placement position in response to information signalled by a control unit, that an electronic subassembly on the second carrier reaches the placement position on the second receptacle guiding the second carrier, and wherein - a heating acting in the region of the second receptacle is arranged, which is provided and arranged for the purpose of tempering the second carrier before, at or after the placement position from its side remote from the first receptacle by appropriate control of the heating by the control unit as a whole or in sections in the region of the second receptacle as a function of the material properties, the melting point of contact points of the component to be transferred and/or the material properties, the melting point of contact points of the electronic subassembly on the second carrier, and wherein - the heating is designed as a heating strip with one or more heating zones to be heated to different temperatures, which has a shape at least partially following the contour of the second receptacle and which is provided and set up to heat the second carrier in the region of the second receptacle.