A method for making an electronic device, said method comprising in order the steps of: providing a first growth substrate (8401, 8501, 8801) having a first receiving surface; forming a first semiconductor epilayer (8402, 8502, 8802) on said first receiving surface via epitaxial growth, said first semiconductor epilayer (8402, 8502, 8802) having a first contact surface; bonding said first contact surface of said first semiconductor epilayer (8402, 8502, 8802) to a handle substrate (8403, 8503, 8803) having an adhesion layer provided thereon; releasing said first semiconductor epilayer (8402, 8502, 8802) from said first growth substrate (8401, 8501, 8801) wherein said first semiconductor epilayer (8402, 8502, 8802) remains bonded to said handle substrate (8403, 8503, 8803), thereby exposing a second contact surface of said first semiconductor epilayer (8402, 8502, 8802); patterning said second contact surface of said first semiconductor epilayer (8402, 8502, 8802) with a mask (8404, 8504, 8806), thereby generating exposed regions and one or more masked regions of said second contact surface; removing material from said exposed regions by etching said exposed regions, thereby generating one or more semiconductor structures (8405, 8505, 8807) supported by said handle substrate (8403, 8503, 8803); partially releasing said one or more semiconductor structures (8405, 8505, 8807) from said handle substrate (8403, 8503, 8803) by partially detaching the semiconductor structure (8405, 8505, 8807) from the handle substrate (8403, 8503, 8803), thereby generating one or more partially undercut semiconductor structures (8405, 8505, 8807) each connected to said handle substrate (8403, 8503, 8803) by one or more anchors (8406, 8506, 8808); and transferring at least one of said one or more partially undercut semiconductor structures (8405, 8505, 8807) from said handle substrate (8403, 8503, 8803) to a device substrate via dry transfer contact printing, thereby assembling said semiconductor structures (8405, 8505, 8807) on said device substrate to make said electronic device. providing a first growth substrate (8401, 8501, 8801) having a first receiving surface; forming a first semiconductor epilayer (8402, 8502, 8802) on said first receiving surface via epitaxial growth, said first semiconductor epilayer (8402, 8502, 8802) having a first contact surface; bonding said first contact surface of said first semiconductor epilayer (8402, 8502, 8802) to a handle substrate (8403, 8503, 8803) having an adhesion layer provided thereon; releasing said first semiconductor epilayer (8402, 8502, 8802) from said first growth substrate (8401, 8501, 8801) wherein said first semiconductor epilayer (8402, 8502, 8802) remains bonded to said handle substrate (8403, 8503, 8803), thereby exposing a second contact surface of said first semiconductor epilayer (8402, 8502, 8802); patterning said second contact surface of said first semiconductor epilayer (8402, 8502, 8802) with a mask (8404, 8504, 8806), thereby generating exposed regions and one or more masked regions of said second contact surface; removing material from said exposed regions by etching said exposed regions, thereby generating one or more semiconductor structures (8405, 8505, 8807) supported by said handle substrate (8403, 8503, 8803); partially releasing said one or more semiconductor structures (8405, 8505, 8807) from said handle substrate (8403, 8503, 8803) by partially detaching the semiconductor structure (8405, 8505, 8807) from the handle substrate (8403, 8503, 8803), thereby generating one or more partially undercut semiconductor structures (8405, 8505, 8807) each connected to said handle substrate (8403, 8503, 8803) by one or more anchors (8406, 8506, 8808); and transferring at least one of said one or more partially undercut semiconductor structures (8405, 8505, 8807) from said handle substrate (8403, 8503, 8803) to a device substrate via dry transfer contact printing, thereby assembling said semiconductor structures (8405, 8505, 8807) on said device substrate to make said electronic device.