Laying die for picking up and laying of substrates by means of pressurized gas, comprising: - an attaching element having an upper side and a lower side and comprising an inlet port for receiving positively pressurized gas and an outlet port; and - a carrier body made from an elastically deformable material and attached on the lower side of the attaching element; wherein the carrier body comprises a plurality of passages enabling a gas flow between the attaching element and the lower side of the carrier body opposed to the attaching element; wherein the attaching element houses a flow path arranged to receive pressurized gas from the inlet port and a longitudinal pathway extending from the lower side of the attaching element towards the upper side of the attaching element; wherein the flow path discharges into the longitudinal pathway at a junction section; and the junction section is arranged such that pressurized gas discharging into the longitudinal pathway creates a negative pressure in the longitudinal pathway on the lower side of the attaching element and comprises a curved deflection surface curved towards the upper side of the attaching element, characterized in that on the lower side of the carrier body a substrate receiving structure is attached which is also made from an elastically deformable material, wherein both the carrier body and the substrate receiving structure are designed and intended to bend following a shape of the substrate once it is received on a lower face of the substrate receiving structure in a gastight manner or following a shape of a tool on which the substrate is to be placed. - an attaching element having an upper side and a lower side and comprising an inlet port for receiving positively pressurized gas and an outlet port; and - a carrier body made from an elastically deformable material and attached on the lower side of the attaching element; wherein the carrier body comprises a plurality of passages enabling a gas flow between the attaching element and the lower side of the carrier body opposed to the attaching element; wherein the attaching element houses a flow path arranged to receive pressurized gas from the inlet port and a longitudinal pathway extending from the lower side of the attaching element towards the upper side of the attaching element; wherein the flow path discharges into the longitudinal pathway at a junction section; and the junction section is arranged such that pressurized gas discharging into the longitudinal pathway creates a negative pressure in the longitudinal pathway on the lower side of the attaching element and comprises a curved deflection surface curved towards the upper side of the attaching element, characterized in that on the lower side of the carrier body a substrate receiving structure is attached which is also made from an elastically deformable material, wherein both the carrier body and the substrate receiving structure are designed and intended to bend following a shape of the substrate once it is received on a lower face of the substrate receiving structure in a gastight manner or following a shape of a tool on which the substrate is to be placed. wherein the carrier body comprises a plurality of passages enabling a gas flow between the attaching element and the lower side of the carrier body opposed to the attaching element; wherein the attaching element houses a flow path arranged to receive pressurized gas from the inlet port and a longitudinal pathway extending from the lower side of the attaching element towards the upper side of the attaching element; wherein the flow path discharges into the longitudinal pathway at a junction section; and the junction section is arranged such that pressurized gas discharging into the longitudinal pathway creates a negative pressure in the longitudinal pathway on the lower side of the attaching element and comprises a curved deflection surface curved towards the upper side of the attaching element, characterized in that on the lower side of the carrier body a substrate receiving structure is attached which is also made from an elastically deformable material, wherein both the carrier body and the substrate receiving structure are designed and intended to bend following a shape of the substrate once it is received on a lower face of the substrate receiving structure in a gastight manner or following a shape of a tool on which the substrate is to be placed.