Power module comprising - a power unit having a heat sink, at least one power device disposed on the heat sink, and an insulating layer covering the heat sink and the at least one power device, wherein an underside of the power unit is constituted by an underside of the heat sink and a top side of the power unit is constituted by at least one contact area thermally and/or electrically coupled to the at least one power device and a surface of the insulating layer surrounding the at least one contact area, and - a drive unit for driving the power unit, having at least one contact element corresponding to the at least one contact area of the power unit, which contact element, by the drive unit being disposed on the top side of the power unit, is disposed abutting the at least one contact area of the power unit for making electrical and/or thermal contact with the at least one power device, - wherein the at least one power device is disposed directly on the top side of the heat sink and is force-fit to the top side of the heat sink by applied pressure to the surface of the insulating layer and/or to the at least one contact area by means of spring clips or screwed connections, - wherein the at least one contact element of the drive unit is implemented as a cooling element and/or as an electrical pressure contact element, wherein the force-fitting pressure is applied by the cooling element and/or the pressure contact element being disposed on the at least one contact area for establishing contact with the at least one power device, - wherein the drive unit comprises a circuit board and at least one device (21, 23) for driving the at least one power device of the power unit, - wherein the circuit board has at least two layers and the at least one device (21, 23) is disposed between the at least two layers, and - wherein a first of the at least two layers is deposited directly onto the top side of the power unit and is bonded to the top side of the power unit, the at least one device (21, 23) and/or the at least one sensor element is disposed on the first layer, and a second of the at least two layers is deposited directly on the first layer, wherein the second layer covers the at least one device (21, 23). - a power unit having a heat sink, at least one power device disposed on the heat sink, and an insulating layer covering the heat sink and the at least one power device, wherein an underside of the power unit is constituted by an underside of the heat sink and a top side of the power unit is constituted by at least one contact area thermally and/or electrically coupled to the at least one power device and a surface of the insulating layer surrounding the at least one contact area, and - a drive unit for driving the power unit, having at least one contact element corresponding to the at least one contact area of the power unit, which contact element, by the drive unit being disposed on the top side of the power unit, is disposed abutting the at least one contact area of the power unit for making electrical and/or thermal contact with the at least one power device, - wherein the at least one power device is disposed directly on the top side of the heat sink and is force-fit to the top side of the heat sink by applied pressure to the surface of the insulating layer and/or to the at least one contact area by means of spring clips or screwed connections, - wherein the at least one contact element of the drive unit is implemented as a cooling element and/or as an electrical pressure contact element, wherein the force-fitting pressure is applied by the cooling element and/or the pressure contact element being disposed on the at least one contact area for establishing contact with the at least one power device, - wherein the drive unit comprises a circuit board and at least one device (21, 23) for driving the at least one power device of the power unit, - wherein the circuit board has at least two layers and the at least one device (21, 23) is disposed between the at least two layers, and - wherein a first of the at least two layers is deposited directly onto the top side of the power unit and is bonded to the top side of the power unit, the at least one device (21, 23) and/or the at least one sensor element is disposed on the first layer, and a second of the at least two layers is deposited directly on the first layer, wherein the second layer covers the at least one device (21, 23).