A method of forming a thermally conductive flexible bond for use in an electronic board, the method comprising: a) providing multiple adhesive components, wherein the multiple adhesive components comprise boron nitride particles having organofunctional groups attached to a surface of the boron nitride particles to enhance bonding with the epoxies, an average particle size of the boron nitride particles being between 50 micrometers and 150 micrometers; and wherein the multiple adhesive components comprise a resin and a hardener as two components of a urethane modified epoxy; the boron nitride particles having organofunctional groups being formed by: attaching hydroxyl groups to the surface of the boron nitride particles; exposing the boron nitride particles having the hydroxyl groups on the surface to a water-based solution having a pH level of between 5 and 6 and comprising (3-glycidyloxypropyl) trimethoxysilane, thereby attaching organofunctional groups of the silane to the surface of the boron nitride particles; and washing the boron nitride particles having the organofunctional groups on the surface to remove residual silane that is not bound to the filler particles; b) forming an adhesive material from the multiple adhesive components; c) applying the adhesive material onto a surface of the electronic board; d) forming a contact between an electronic component and the adhesive material applied to the surface of the electric board; and e) forming covalent bonds between the urethane modified epoxy and the organofunctional groups on the surface of the boron nitride particles in curing the adhesive material at a temperature of less than 110°C, thereby forming a cured adhesive structure between the electric board and the electronic component, wherein the cured adhesive structure provides the thermally conductive flexible bond between the electric board and the electronic component. a) providing multiple adhesive components, wherein the multiple adhesive components comprise boron nitride particles having organofunctional groups attached to a surface of the boron nitride particles to enhance bonding with the epoxies, an average particle size of the boron nitride particles being between 50 micrometers and 150 micrometers; and wherein the multiple adhesive components comprise a resin and a hardener as two components of a urethane modified epoxy; the boron nitride particles having organofunctional groups being formed by: attaching hydroxyl groups to the surface of the boron nitride particles; exposing the boron nitride particles having the hydroxyl groups on the surface to a water-based solution having a pH level of between 5 and 6 and comprising (3-glycidyloxypropyl) trimethoxysilane, thereby attaching organofunctional groups of the silane to the surface of the boron nitride particles; and washing the boron nitride particles having the organofunctional groups on the surface to remove residual silane that is not bound to the filler particles; wherein the multiple adhesive components comprise boron nitride particles having organofunctional groups attached to a surface of the boron nitride particles to enhance bonding with the epoxies, an average particle size of the boron nitride particles being between 50 micrometers and 150 micrometers; and wherein the multiple adhesive components comprise a resin and a hardener as two components of a urethane modified epoxy; attaching hydroxyl groups to the surface of the boron nitride particles; exposing the boron nitride particles having the hydroxyl groups on the surface to a water-based solution having a pH level of between 5 and 6 and comprising (3-glycidyloxypropyl) trimethoxysilane, thereby attaching organofunctional groups of the silane to the surface of the boron nitride particles; and washing the boron nitride particles having the organofunctional groups on the surface to remove residual silane that is not bound to the filler particles; b) forming an adhesive material from the multiple adhesive components; c) applying the adhesive material onto a surface of the electronic board; d) forming a contact between an electronic component and the adhesive material applied to the surface of the electric board; and e) forming covalent bonds between the urethane modified epoxy and the organofunctional groups on the surface of the boron nitride particles in curing the adhesive material at a temperature of less than 110°C, thereby forming a cured adhesive structure between the electric board and the electronic component,