A process for the preparation of a compound of Formula according to the following reaction scheme: wherein: R is an alkyl or substituted alkyl; R 1 is cyclopropylmethyl; R 2 and R 3 are independently selected from the group consisting of hydrogen, hydrocarbyl and substituted hydrocarbyl; R 4 and R 5 are independently selected from the group consisting of hydrogen, hydrocarbyl, substituted hydrocarbyl, halogen, {-}OH, {-}NH 2, {-}SH, {-}SR 10, and {-}OR 10; R 6 and R 7 are independently selected from the group consisting of hydrogen, a protecting group, hydrocarbyl, and substituted hydrocarbyl; R 8 is methyl; R 9 and R 10 are independently selected from the group consisting of hydrocarbyl and substituted hydrocarbyl; M is selected from the group consisting of a metal cation having a charge of +2, and a metal cation group having a charge of +2; X is a heteroatom; and X 1 is a halogen; the process comprising: (a) contacting a compound of Formula with methyl vinyl ketone as a dienophile in the presence of a solvent selected from the group consisting of methanol, ethanol, isopropanol, n-propanol, isobutanol, t-butanol, n-butanol, or a combination thereof, comprising from 10% to 35% (v/v) of water, wherein the reaction mixture is heated to a temperature of 50° C to 100° C for a period time that is sufficient for the conversion of a substantial portion of the compound of Formula to the compound of Formula; (b) contacting the compound of Formula with an aprotic solvent and a catalyst that catalyzes hydrogen addition to form a compound of Formula; (c) contacting the compound of Formula with R 9 MgX 1 to form the compound of Formula; (d) contacting the compound of Formula with X 1 CN to form the compound of Formula; (e) contacting the compound of Formula with a hydrolysis agent to form the compound of Formula; and (f) contacting the compound of Formula with MCO 3, a catalytic additive selected from the group consisting of potassium iodide, sodium iodide and cesium iodide, and R 1 X 1, the amount of alkenyl impurity in R 1 X 1 being less than 0.15% by weight, and heating the reaction mixture to a temperature of less than 60°C to form the compound of Formula, wherein the alkenyl impurity is a butenyl impurity. R is an alkyl or substituted alkyl; R 1 is cyclopropylmethyl; R 2 and R 3 are independently selected from the group consisting of hydrogen, hydrocarbyl and substituted hydrocarbyl; R 4 and R 5 are independently selected from the group consisting of hydrogen, hydrocarbyl, substituted hydrocarbyl, halogen, {-}OH, {-}NH 2, {-}SH, {-}SR 10, and {-}OR 10; R 6 and R 7 are independently selected from the group consisting of hydrogen, a protecting group, hydrocarbyl, and substituted hydrocarbyl; R 8 is methyl; R 9 and R 10 are independently selected from the group consisting of hydrocarbyl and substituted hydrocarbyl; M is selected from the group consisting of a metal cation having a charge of +2, and a metal cation group having a charge of +2; X is a heteroatom; and X 1 is a halogen; (a) contacting a compound of Formula with methyl vinyl ketone as a dienophile in the presence of a solvent selected from the group consisting of methanol, ethanol, isopropanol, n-propanol, isobutanol, t-butanol, n-butanol, or a combination thereof, comprising from 10% to 35% (v/v) of water, wherein the reaction mixture is heated to a temperature of 50° C to 100° C for a period time that is sufficient for the conversion of a substantial portion of the compound of Formula to the compound of Formula; (b) contacting the compound of Formula with an aprotic solvent and a catalyst that catalyzes hydrogen addition to form a compound of Formula; (c) contacting the compound of Formula with R 9 MgX 1 to form the compound of Formula; (d) contacting the compound of Formula with X 1 CN to form the compound of Formula; (e) contacting the compound of Formula with a hydrolysis agent to form the compound of Formula; and (f) contacting the compound of Formula with MCO 3, a catalytic additive selected from the group consisting of potassium iodide, sodium iodide and cesium iodide, and R 1 X 1, the amount of alkenyl impurity in R 1 X 1 being less than 0.15% by weight, and heating the reaction mixture to a temperature of less than 60°C to form the compound of Formula, wherein the alkenyl impurity is a butenyl impurity.