A method of forming a temporary wafer bonding structure, said method comprising: - providing a first substrate having front and back surfaces; and - forming a bonding layer formed of bonding material on said front surface of said first substrate; further characterized by: - said bonding layer being on and across said front surface of said first substrate; - providing a second substrate having front and back surfaces, said front surface of said second substrate having a central region and a peripheral region; - applying a protective material to said peripheral region of said front surface of the second substrate to form a layer of a mask adjacent said peripheral region; - depositing a surface modifying composition in said central region to yield a surface-modified region having a surface to which said bonding material cannot strongly adhere, wherein said protective material used to form the mask does not react with said surface modifying composition; said front surface having - said surface-modified region at said central region having a surface to which said bonding material cannot strongly adhere, and - a non-modified region at said peripheral region which is coated with the mask; - contacting said front surface of said second substrate with said bonding layer on said first substrate under heat and pressure, said mask reflowing into said bonding layer to create a uniform bonding layer, to thereby form said temporary bonding structure, said bonding layer: - being distributed substantially uniformly along the front surface of said first substrate and along the front surface of said second substrate, contacting the surface-modified region at said central region, and being bonded with said mask at said peripheral region, said protective material used to form the mask being of the same material, or of a similar or compatible material, as the bonding material, so that said mask and said bonding layer reflow together to form a uniform bonding layer. - providing a first substrate having front and back surfaces; and - forming a bonding layer formed of bonding material on said front surface of said first substrate; - said bonding layer being on and across said front surface of said first substrate; - providing a second substrate having front and back surfaces, said front surface of said second substrate having a central region and a peripheral region; - applying a protective material to said peripheral region of said front surface of the second substrate to form a layer of a mask adjacent said peripheral region; - depositing a surface modifying composition in said central region to yield a surface-modified region having a surface to which said bonding material cannot strongly adhere, wherein said protective material used to form the mask does not react with said surface modifying composition; said front surface having - said surface-modified region at said central region having a surface to which said bonding material cannot strongly adhere, and - a non-modified region at said peripheral region which is coated with the mask; - said surface-modified region at said central region having a surface to which said bonding material cannot strongly adhere, and - a non-modified region at said peripheral region which is coated with the mask; - contacting said front surface of said second substrate with said bonding layer on said first substrate under heat and pressure, said mask reflowing into said bonding layer to create a uniform bonding layer, to thereby form said temporary bonding structure, said bonding layer: - being distributed substantially uniformly along the front surface of said first substrate and along the front surface of said second substrate, contacting the surface-modified region at said central region, and being bonded with said mask at said peripheral region, said protective material used to form the mask being of the same material, or of a similar or compatible material, as the bonding material, so that said mask and said bonding layer reflow together to form a uniform bonding layer. - being distributed substantially uniformly along the front surface of said first substrate and along the front surface of said second substrate, contacting the surface-modified region at said central region, and being bonded with said mask at said peripheral region, said protective material used to form the mask being of the same material, or of a similar or compatible material, as the bonding material, so that said mask and said bonding layer reflow together to form a uniform bonding layer.