An integrated device package comprising: a laminate substrate having a front side and a back side, the laminate substrate comprising a plurality of layers (LM1... LMn); an integrated device die mounted to the front side of the laminate substrate, the integrated device die comprising radio frequency, RF, circuitry (17, 18) and having a first impedance, the integrated device die operating at one or more operational frequencies; a plurality of conductive bumps disposed between the integrated device die and the front side of the laminate substrate, the conductive bumps electrically connecting the integrated device die and the laminate substrate; a bump launch structure defined at least in part by one or more layers (LM1, LM2) at or near the front side of the laminate substrate, the bump launch structure comprising one or more first metallic traces and vias and a first insulating material arranged in a first pattern having a second impedance that is configured to match the first impedance based at least in part on a shape, size and/or spacing of the one or more first traces and vias, such that a voltage standing wave ratio, VSWR, of the bump launch structure is less than 4:1; a ball launch structure defined at least in part by one or more layers at or near the back side of the laminate substrate, the ball launch structure comprising one or more second metallic traces and vias and a second insulating material arranged in a second pattern having a third impedance; and one or more additional layers (LM3, LM4, LM5) that electrically connect the first pattern of the bump launch structure and the second pattern of the ball launch structure, the one or more additional layers comprising one or more additional traces and vias; characterized in that at least one of the bump launch structure and the ball launch structure comprises a serpentine metallic trace (12a-12d) within the laminate substrate, the serpentine metallic trace being electrically connected with a third metallic via (13a-13d), the third metallic via extending through one or more layers of the laminate substrate. a laminate substrate having a front side and a back side, the laminate substrate comprising a plurality of layers (LM1... LMn); an integrated device die mounted to the front side of the laminate substrate, the integrated device die comprising radio frequency, RF, circuitry (17, 18) and having a first impedance, the integrated device die operating at one or more operational frequencies; a plurality of conductive bumps disposed between the integrated device die and the front side of the laminate substrate, the conductive bumps electrically connecting the integrated device die and the laminate substrate; a bump launch structure defined at least in part by one or more layers (LM1, LM2) at or near the front side of the laminate substrate, the bump launch structure comprising one or more first metallic traces and vias and a first insulating material arranged in a first pattern having a second impedance that is configured to match the first impedance based at least in part on a shape, size and/or spacing of the one or more first traces and vias, such that a voltage standing wave ratio, VSWR, of the bump launch structure is less than 4:1; a ball launch structure defined at least in part by one or more layers at or near the back side of the laminate substrate, the ball launch structure comprising one or more second metallic traces and vias and a second insulating material arranged in a second pattern having a third impedance; and one or more additional layers (LM3, LM4, LM5) that electrically connect the first pattern of the bump launch structure and the second pattern of the ball launch structure, the one or more additional layers comprising one or more additional traces and vias; characterized in that at least one of the bump launch structure and the ball launch structure comprises a serpentine metallic trace (12a-12d) within the laminate substrate, the serpentine metallic trace being electrically connected with a third metallic via (13a-13d), the third metallic via extending through one or more layers of the laminate substrate.