mhurhangee/ep-ind-claims huggingface dataset:
A compound of Formula I: or a pharmaceutically acceptable salt thereof, wherein: each of R 1 and R 2 is independently selected from -H, -C 1-6 alkyl, aryl, 5-10 membered heteroaryl, -C 3-6 cycloaliphatic, 3-8 membered heterocycloaliphatic,-CH 2 -aryl, -CH 2 -5-10 membered heteroaryl, -CH 2 -C 3-6 cycloaliphatic, -CH 2 -3-8 membered heterocycloaliphatic, each of which is optionally substituted with 1-3 groups selected from halo, -OH, or phenyl, or R 1 and R 2 together with the atoms to which they are attached form an optionally substituted 5-8 membered saturated or partially unsaturated heterocyclic ring that includes an N atom, an O atom, and up to 1 additional heteroatom selected from N, 0, or S; R 3 is -C 1-6 alkyl optionally substituted with 1-3 groups selected from halo, -OH, or phenyl; each of R 4 and R 5 is independently selected from -H, -OH, -NH 2, -NHC R 7, -NHC OR 7, -NHS 2 R 7, -C R 7, -C OR 7, -CH 2 OR 7, -CH 2 N(R 7) 2, -C 1-6 alkyl, each of which is optionally substituted with 1-3 groups selected from halo or -OH, or R 4 and R 5 together form oxo or =N-O-R 7; ring A is a 5-8 membered saturated, partially unsaturated, or fully unsaturated ring having 0-3 heteroatoms independently selected from N, 0, or S, wherein ring A is optionally substituted with 1-3 of R 6; each R 6 is independently halo, -H, -CN, -OR 7, -NO 2, -C 1-6 alkyl, aryl, 5-10 membered heteroaryl, -S 2 R 7, or -C R 7, each of which is optionally substituted with 1-3 groups selected from halo or -OH; each R 7 is independently -H, -C 1-6 alkyl, -C 3-8 cycloalkyl, or phenyl; and n is 0 or 1. each of R 1 and R 2 is independently selected from -H, -C 1-6 alkyl, aryl, 5-10 membered heteroaryl, -C 3-6 cycloaliphatic, 3-8 membered heterocycloaliphatic,-CH 2 -aryl, -CH 2 -5-10 membered heteroaryl, -CH 2 -C 3-6 cycloaliphatic, -CH 2 -3-8 membered heterocycloaliphatic, each of which is optionally substituted with 1-3 groups selected from halo, -OH, or phenyl, or R 1 and R 2 together with the atoms to which they are attached form an optionally substituted 5-8 membered saturated or partially unsaturated heterocyclic ring that includes an N atom, an O atom, and up to 1 additional heteroatom selected from N, 0, or S; R 3 is -C 1-6 alkyl optionally substituted with 1-3 groups selected from halo, -OH, or phenyl; each of R 4 and R 5 is independently selected from -H, -OH, -NH 2, -NHC R 7, -NHC OR 7, -NHS 2 R 7, -C R 7, -C OR 7, -CH 2 OR 7, -CH 2 N(R 7) 2, -C 1-6 alkyl, each of which is optionally substituted with 1-3 groups selected from halo or -OH, or R 4 and R 5 together form oxo or =N-O-R 7; ring A is a 5-8 membered saturated, partially unsaturated, or fully unsaturated ring having 0-3 heteroatoms independently selected from N, 0, or S, wherein ring A is optionally substituted with 1-3 of R 6; each R 6 is independently halo, -H, -CN, -OR 7, -NO 2, -C 1-6 alkyl, aryl, 5-10 membered heteroaryl, -S 2 R 7, or -C R 7, each of which is optionally substituted with 1-3 groups selected from halo or -OH; each R 7 is independently -H, -C 1-6 alkyl, -C 3-8 cycloalkyl, or phenyl; and n is 0 or 1.
Domestic appliance with module for displaceably mounting in a holding space of the domestic appliance through or into a holding aperture, wherein the module is a drawer element or a door or a cover or a flap of the domestic appliance, characterised in that the module has at least one first passive display element that is embodied such that in order to provide light it is coupled optically, in at least one first displacement position of the module mounted in the holding space, to a light source (44, 56, 57, 58) arranged in the holding space, and that the module has a second passive display element that is embodied such that in order to provide light it is coupled optically, in at least one second displacement position that differs from the first displacement position of the module mounted in the holding space, to the light source (44, 56, 57, 58).
A method for direct die-to-die wire bonding, comprising: mounting a pressure sense die to a ceramic substrate, wherein said pressure sense die comprises a plurality of wire bond pad patterns (110, 120, 310, 320, 330, 340) associated with a plurality of wire bond pads (135, 145, 155, 165, 170, 175, 185), wherein said pressure sense die comprises a first wire bond pad pattern of the plurality of wire bond pad patterns along a first edge of said pressure sense die, and wherein said pressure sense die comprises a second wire bond pad pattern of the plurality of wire bond pad patterns along a second edge of said pressure sense die; mounting a programmable compensation IC die on the ceramic substrate, wherein the programmable compensation IC die includes a plurality of bonding leads; positioning said pressure sense die and said programmable compensation IC die beside each other, such that said plurality of wire bond pads (135, 145, 155, 165, 170, 175, 185) associated with said pressure sense die and said plurality of bonding leads of said programmable compensation IC die are arranged in a same order; and electrically connecting said plurality of wire bond pads (135, 145, 155, 165, 170, 175, 185) to corresponding said plurality of bonding leads associated with said programmable compensation IC die directly with a plurality of wire bonds (220, 222, 224, 226, 228), thereby reducing a total number of said plurality of wire bonds (220, 222, 224, 226, 228) and improving reliability thereto. mounting a pressure sense die to a ceramic substrate, wherein said pressure sense die comprises a plurality of wire bond pad patterns (110, 120, 310, 320, 330, 340) associated with a plurality of wire bond pads (135, 145, 155, 165, 170, 175, 185), wherein said pressure sense die comprises a first wire bond pad pattern of the plurality of wire bond pad patterns along a first edge of said pressure sense die, and wherein said pressure sense die comprises a second wire bond pad pattern of the plurality of wire bond pad patterns along a second edge of said pressure sense die; mounting a programmable compensation IC die on the ceramic substrate, wherein the programmable compensation IC die includes a plurality of bonding leads; positioning said pressure sense die and said programmable compensation IC die beside each other, such that said plurality of wire bond pads (135, 145, 155, 165, 170, 175, 185) associated with said pressure sense die and said plurality of bonding leads of said programmable compensation IC die are arranged in a same order; and electrically connecting said plurality of wire bond pads (135, 145, 155, 165, 170, 175, 185) to corresponding said plurality of bonding leads associated with said programmable compensation IC die directly with a plurality of wire bonds (220, 222, 224, 226, 228), thereby reducing a total number of said plurality of wire bonds (220, 222, 224, 226, 228) and improving reliability thereto.
A portable computing device, comprising: an interface configured to electrically couple to a cable; and a portable computing device circuitry coupled to the interface and adapted to: establish a connection with a power source via the cable; receive an indication that the power source can supply current at a first level; receive a command from the cable indicating that the cable can supply current at a lower, second level; and draw a current having a limit equal to the lower second level. establish a connection with a power source via the cable; receive an indication that the power source can supply current at a first level; receive a command from the cable indicating that the cable can supply current at a lower, second level; and draw a current having a limit equal to the lower second level.
A device that can be worn in the external ear for masking a tinnitus noise, wherein at least two bodies (2, 3) are provided, which are mounted mobile relative to one another, in order to generate a noise masking the tinnitus noise by striking each other, characterised in that the at least two bodies (2, 3) are constituted as spherical bodies.
A carrier for a labelling machine with a fixed support body, to the contact surface of which an elastic surface element can be attached, wherein the contact surface is facing the container to be palletised and is exerting a force for transferring the label over the same, the carrier is formed in such a manner that the elastic surface element can be exchanged, wherein the support body includes a first connecting means having a first surface contour, and the surface element includes a second connecting means having a second surface contour, wherein the surface contours are formed in such a way that, when pressed together, they engage with each other, whereby the surface element is fixed to the support body, and wherein the first connecting means includes a plurality of projections, and the second connecting means includes a plurality of corresponding openings, wherein, in the connected state, the projections are located within the openings. the contact surface is facing the container to be palletised and is exerting a force for transferring the label over the same, the carrier is formed in such a manner that the elastic surface element can be exchanged, wherein the support body includes a first connecting means having a first surface contour, and the surface element includes a second connecting means having a second surface contour, wherein the surface contours are formed in such a way that, when pressed together, they engage with each other, whereby the surface element is fixed to the support body, and wherein the first connecting means includes a plurality of projections, and the second connecting means includes a plurality of corresponding openings, wherein, in the connected state, the projections are located within the openings.
A distributed base station, comprising a radio frequency system and a baseband processing system, wherein the radio frequency system comprises a radio frequency processing unit and a first return unit, and the baseband processing system comprises a baseband processing unit and a second return unit, wherein the radio frequency processing unit is configured to generate a base station uplink analog signal of a first bandwidth; the first return unit is configured to perform spread spectrum analog modulation on the base station uplink analog signal of the first bandwidth generated by the radio frequency processing unit, to obtain a base station uplink analog signal of a second bandwidth; and send the base station uplink analog signal of the second bandwidth to the second return unit, wherein the second bandwidth is larger than the first bandwidth; the second return unit is configured to receive the base station uplink analog signal of the second bandwidth sent by the first return unit, and perform spread spectrum analog demodulation on the base station uplink analog signal of the second bandwidth to obtain the uplink analog signal of the first bandwidth; and the baseband processing unit is configured to perform baseband processing on the uplink analog signal of the first bandwidth and send the baseband-processed uplink analog signal of the first bandwidth to a core network.
An insulated glass unit comprising: an electrochromic pane comprising a transparent substrate and an electrochromic device disposed thereon; an additional pane comprising a further transparent substrate; a sealing separator between said additional pane and the electrochromic pane, and a window controller configured to control said electrochromic device of the insulated glass unit, the window controller being mounted at least partially between the panes, characterized in that the sealing separator comprises a spacer and a primary seal between the spacer and each pane of the insulated glass unit, in that the insulated glass unit further comprises a secondary seal applied around perimeter edges of the insulated glass unit, in that the window controller is mounted at least partially within the secondary seal of the insulated glass unit, and in that the window controller is positioned outside of the primary seal of the insulated glass unit. an electrochromic pane comprising a transparent substrate and an electrochromic device disposed thereon; an additional pane comprising a further transparent substrate; a sealing separator between said additional pane and the electrochromic pane, and a window controller configured to control said electrochromic device of the insulated glass unit, the window controller being mounted at least partially between the panes, characterized in that the sealing separator comprises a spacer and a primary seal between the spacer and each pane of the insulated glass unit, in that the insulated glass unit further comprises a secondary seal applied around perimeter edges of the insulated glass unit, in that the window controller is mounted at least partially within the secondary seal of the insulated glass unit, and in that the window controller is positioned outside of the primary seal of the insulated glass unit.
Microwave-sending device for emitting microwaves having electronics, a wave coupler, a waveguide and a wave-emitting region, wherien the electronics, the wave coupler and the waveguide have a common casting, wherein at least the electronics, the wave coupler and the waveguide are affixed to one another by means of the casting, characterized in, that - the waveguide and the casting consist of two materials with differing relative permittivities and relative permeabilities, - a boundary layer is formed, since the waveguide and the casting consist of two materials with differing relative permittivities and relative permeabilities, - the boundary layer is formed in such a manner that guiding the microwaves occurs through the boundary layer. - the waveguide and the casting consist of two materials with differing relative permittivities and relative permeabilities, - a boundary layer is formed, since the waveguide and the casting consist of two materials with differing relative permittivities and relative permeabilities, - the boundary layer is formed in such a manner that guiding the microwaves occurs through the boundary layer.
A method for preparing casing material for mushroom production including the steps of providing a body of plant parenchyma tissue extracted from a plant source; mixing the body with water to provide a starting mixture; and allowing the starting mixture to compost to form the casing material.
A method of shaping a flat working material into a composite product having a final shape, the method comprising: (a) consolidating and shaping the working material into a pre-form shape using a hydroforming process that employs a rigid tool and a non-rigid tool; and (b) in the presence of added heat, further consolidating and shaping the working material into the final shape using at least one additional rigid forming tool, wherein the hydroforming process does not employ a mechanical clamping device, wherein a membrane is configured to apply a clamping force to the working material during the hydroforming process, and wherein step (a) is performed in the absence of added heat. (a) consolidating and shaping the working material into a pre-form shape using a hydroforming process that employs a rigid tool and a non-rigid tool; and (b) in the presence of added heat, further consolidating and shaping the working material into the final shape using at least one additional rigid forming tool,
Modified diene elastomer comprising predominantly the entity functionalized in the middle of the chain by an alkoxysilane group, optionally partially or completely hydrolysed to give silanol, bearing a tertiary amine functional group and the silicon atom of which bonds the two pieces of the chain, the chain ends of the modified diene elastomer being functionalized to at least 70 mol%, with respect to the number of moles of chain end, by an amine functional group.
A surface mount laser package for a side-looking semiconductor laser, comprising: an electronic assembly, comprising: a substantially planar leadframe with a component side and a board attach side, the component side further comprising a conductive die attach pad and a plurality of wire bond pads; a laser die comprising an anode surface and a cathode surface, the cathode surface mounted to the conductive die attach pad; and a plurality of bond wires, each bond wire comprising a first end in electrical communication with the laser die anode surface and a second end in electrical communication with a wire bond pad of the plurality of wire bond pads; and a rigid structure consisting of: a cured molding encasing the laser die and the plurality of bond wires on the component side of the leadframe and further disposed between the conductive die attach pad and each of the plurality of wire bond pads within a plane of the leadframe, wherein a bottom surface of the laser package comprises a surface of said cured molding and the leadframe board attach side, and the molding surrounds all surfaces of the leadframe except for the leadframe board attach side. a substantially planar leadframe with a component side and a board attach side, the component side further comprising a conductive die attach pad and a plurality of wire bond pads; a laser die comprising an anode surface and a cathode surface, the cathode surface mounted to the conductive die attach pad; and a plurality of bond wires, each bond wire comprising a first end in electrical communication with the laser die anode surface and a second end in electrical communication with a wire bond pad of the plurality of wire bond pads; and a rigid structure consisting of: a cured molding encasing the laser die and the plurality of bond wires on the component side of the leadframe and further disposed between the conductive die attach pad and each of the plurality of wire bond pads within a plane of the leadframe, wherein a bottom surface of the laser package comprises a surface of said cured molding and the leadframe board attach side, and the molding surrounds all surfaces of the leadframe except for the leadframe board attach side. a cured molding encasing the laser die and the plurality of bond wires on the component side of the leadframe and further disposed between the conductive die attach pad and each of the plurality of wire bond pads within a plane of the leadframe, wherein a bottom surface of the laser package comprises a surface of said cured molding and the leadframe board attach side, and the molding surrounds all surfaces of the leadframe except for the leadframe board attach side.
An electromechanical lock, comprising an electronic circuit configured to read data from an external source and match the data against a predetermined criterion, and an access control mechanism comprising a control component movable by electric power and including a passage, and a lever to receive mechanical power from a user, wherein, if the data does not match the predetermined criterion, the control component remains in the locked state such that the lever advances into a contact with the control component outside of the passage with the mechanical power, or, provided that the data matches the predetermined criterion, the control component first moves with electric power from a locked state to an open state, characterized in that the lever next advances into the passage with the mechanical power and at the same time forces the control component back to the locked state due to shape of the passage, and, finally, as the lever returns to its initial position, the lever bypasses the control component remaining in the locked state.
An apparatus comprising: a first endovascular device comprising a plurality of first electrodes extending along a first length in a distal portion of the first device, the distal portion of the first device being configured for endoluminal navigation into a first cerebral blood vessel; a second endovascular device comprising a plurality of second electrodes extending along a second length in a distal portion of the second device, the distal portion of the second device being configured for endoluminal navigation into a second cerebral blood vessel; means configured to establish a network of a plurality of neurostimulation current pathways between the first electrodes and the second electrodes during a treatment cycle; and means for passing electrostimulative current sequentially along each pathway of the plurality of pathways between the first electrodes and the second electrodes; wherein each pathway of the plurality of pathways is formed by a respective pair of electrodes, each of the pairs of electrodes including an electrode from the first electrodes and an electrode from the second electrodes. a first endovascular device comprising a plurality of first electrodes extending along a first length in a distal portion of the first device, the distal portion of the first device being configured for endoluminal navigation into a first cerebral blood vessel; a second endovascular device comprising a plurality of second electrodes extending along a second length in a distal portion of the second device, the distal portion of the second device being configured for endoluminal navigation into a second cerebral blood vessel; means configured to establish a network of a plurality of neurostimulation current pathways between the first electrodes and the second electrodes during a treatment cycle; and means for passing electrostimulative current sequentially along each pathway of the plurality of pathways between the first electrodes and the second electrodes; wherein each pathway of the plurality of pathways is formed by a respective pair of electrodes, each of the pairs of electrodes including an electrode from the first electrodes and an electrode from the second electrodes.
A plant for separating and concentrating a liquid component from a liquid multicomponent mixture comprising several liquid components with different boiling temperatures, in particular an ethanol-water mixture or an isopropanol-water mixture, comprising: - a concentrator apparatus with two separated columns (5, 7), in which a first column forms an output portion column and a second column forms an intensification portion column and the two columns (5, 7) are adapted for different levels of operating energy consumption, and - a first mechanical vapour compressor delivering operating energy for the output portion column which compresses top alcohol vapours of the output portion column and delivers the operating energy to the bottom part of said output portion column via a first sump evaporator serving as a reboiler, characterized in that a second mechanical vapour compressor delivering operating energy for the intensification portion column compresses top alcohol vapours of the intensification portion column and delivers the operating energy to the bottom part of said intensification portion column via a second sump evaporator serving as a reboiler, that the column with a higher level of operating energy consumption is adapted for a lower temperature difference between the boiling temperature of its column head and the boiling temperature of its column base than the column with the lower level of operating energy consumption, that the mechanical vapour compressor delivering the operating energy for the column designed for the higher level of operating energy consumption is adapted for a lower degree of compression than the mechanical vapour compressor delivering the operating energy for the column adapted for the lower level of operating energy consumption, and that the multicomponent mixture and the vapour and/or condensation product energetically processed in the first sump evaporator can be delivered to the intensification portion column as a feed stream. - a concentrator apparatus with two separated columns (5, 7), in which a first column forms an output portion column and a second column forms an intensification portion column and the two columns (5, 7) are adapted for different levels of operating energy consumption, and - a first mechanical vapour compressor delivering operating energy for the output portion column which compresses top alcohol vapours of the output portion column and delivers the operating energy to the bottom part of said output portion column via a first sump evaporator serving as a reboiler,