A multi-die isolated controller integrated circuit package for use in a switch mode power converter, wherein the switch mode power converter comprises a switching circuit (450, 530, 630, 720, 853, 857, 873, 877, 951, 952, 953, 954) coupled between an input of the power supply and an input of an energy transfer element (520, 620, 740, 831, 931), the output of the energy transfer element coupled to an output of the switch mode power converter, comprising: an encapsulation; a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame including a first conductor having a first conductive loop (335, 337, 435, 437) disposed within the encapsulation, wherein the first conductive loop is completed by circuit elements, wherein the lead frame further includes a second conductor galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop (260, 335, 337, 435, 437) disposed within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors, wherein the second conductive loop is completed by circuit elements; a first control die (350, 451, 535, 635, 732, 875, 932, 942) including a first control circuit coupled to the first conductor; and a second control die (360, 452, 565, 665, 736, 871, 931, 941) including a second control circuit coupled to the second conductor, wherein one or more control signals are communicated between the first and second control dice through the communication link. an encapsulation; a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame including a first conductor having a first conductive loop (335, 337, 435, 437) disposed within the encapsulation, wherein the first conductive loop is completed by circuit elements, wherein the lead frame further includes a second conductor galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop (260, 335, 337, 435, 437) disposed within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors, wherein the second conductive loop is completed by circuit elements; a first conductor having a first conductive loop (335, 337, 435, 437) disposed within the encapsulation, wherein the first conductive loop is completed by circuit elements, wherein the lead frame further includes a second conductor galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop (260, 335, 337, 435, 437) disposed within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors, wherein the second conductive loop is completed by circuit elements; a first control die (350, 451, 535, 635, 732, 875, 932, 942) including a first control circuit coupled to the first conductor; and a second control die (360, 452, 565, 665, 736, 871, 931, 941) including a second control circuit coupled to the second conductor, wherein one or more control signals are communicated between the first and second control dice through the communication link.