An active energy ray curable composition comprising: a polymerizable compound composition comprising dicyclopentenyl acrylate, wherein, when the active energy ray curable composition is formed into a film having an average thickness of 10 μm on a substrate and, after a lapse of 15 seconds, the film is irradiated with an active energy ray having a light quantity of 1,500 mJ/cm 2 to become a cured product, the cured product satisfies the following conditions and: when the substrate is a polypropylene substrate, the cured product has a glass transition temperature of 60°C or more; and when the substrate is a polycarbonate substrate, an adhesion between the polycarbonate substrate and the cured product is 70 or more, the adhesion being measured according to a cross-cut adhesion test defined in Japanese Industrial Standards K5400, and wherein the polymerizable compound composition further includes: (i) a polymerizable compound capable of dissolving the polycarbonate substrate, selected from the group consisting of tetrahydrofurfuryl acrylate, benzyl acrylate, cyclohexyl acrylate, acryloyl morpholine, diethylene glycol diacrylate, diethylene glycol dimethacrylate and 1,4-butanediol diacrylate; and (ii) a polyfunctional polymerizable compound having at least two polymerizable ethylenic unsaturated double bonds a polymerizable compound composition comprising dicyclopentenyl acrylate, wherein, when the active energy ray curable composition is formed into a film having an average thickness of 10 μm on a substrate and, after a lapse of 15 seconds, the film is irradiated with an active energy ray having a light quantity of 1,500 mJ/cm 2 to become a cured product, the cured product satisfies the following conditions and: when the substrate is a polypropylene substrate, the cured product has a glass transition temperature of 60°C or more; and when the substrate is a polycarbonate substrate, an adhesion between the polycarbonate substrate and the cured product is 70 or more, the adhesion being measured according to a cross-cut adhesion test defined in Japanese Industrial Standards K5400, and wherein the polymerizable compound composition further includes: (i) a polymerizable compound capable of dissolving the polycarbonate substrate, selected from the group consisting of tetrahydrofurfuryl acrylate, benzyl acrylate, cyclohexyl acrylate, acryloyl morpholine, diethylene glycol diacrylate, diethylene glycol dimethacrylate and 1,4-butanediol diacrylate; and (ii) a polyfunctional polymerizable compound having at least two polymerizable ethylenic unsaturated double bonds when the substrate is a polypropylene substrate, the cured product has a glass transition temperature of 60°C or more; and when the substrate is a polycarbonate substrate, an adhesion between the polycarbonate substrate and the cured product is 70 or more, the adhesion being measured according to a cross-cut adhesion test defined in Japanese Industrial Standards K5400, and wherein the polymerizable compound composition further includes: (i) a polymerizable compound capable of dissolving the polycarbonate substrate, selected from the group consisting of tetrahydrofurfuryl acrylate, benzyl acrylate, cyclohexyl acrylate, acryloyl morpholine, diethylene glycol diacrylate, diethylene glycol dimethacrylate and 1,4-butanediol diacrylate; and (ii) a polyfunctional polymerizable compound having at least two polymerizable ethylenic unsaturated double bonds (i) a polymerizable compound capable of dissolving the polycarbonate substrate, selected from the group consisting of tetrahydrofurfuryl acrylate, benzyl acrylate, cyclohexyl acrylate, acryloyl morpholine, diethylene glycol diacrylate, diethylene glycol dimethacrylate and 1,4-butanediol diacrylate; and (ii) a polyfunctional polymerizable compound having at least two polymerizable ethylenic unsaturated double bonds