An antenna module, comprising: a first base substrate; a plurality of first radiation patterns formed on an upper surface of the first base substrate; a second base substrate disposed below the first base substrate; a plurality of second radiation patterns formed on an upper surface of the second base substrate; a plurality of chipsets disposed on a lower surface of the second base substrate; a first adhesive substrate interposed between the first base substrate and the second base substrate; a second adhesive substrate formed with an accommodation hole that accommodates the plurality of chipsets, and disposed on the lower surface of the second base substrate; an input terminal formed on the lower surface of the second adhesive substrate, and configured to receive a signal from an external circuit substrate; and a plurality of external terminal patterns formed on the lower surface of the second adhesive substrate, and configured to connect the antenna module with the external circuit substrate, wherein the first adhesive substrate is formed with an air gap hole having the plurality of second radiation patterns accommodated therein, wherein the air gap hole forms an air gap between the plurality of first radiation patterns and the plurality of second radiation patterns, wherein the plurality of first radiation patterns are disposed in a matrix on the upper surface of the first base substrate, and the plurality of second radiation patterns are disposed in a matrix on the upper surface of the second base substrate, and wherein the plurality of chipsets are disposed in a matrix on the lower surface of the second base substrate, and each of the plurality of chipsets is connected with two or more second radiation patterns. a first base substrate; a plurality of first radiation patterns formed on an upper surface of the first base substrate; a second base substrate disposed below the first base substrate; a plurality of second radiation patterns formed on an upper surface of the second base substrate; a plurality of chipsets disposed on a lower surface of the second base substrate; a first adhesive substrate interposed between the first base substrate and the second base substrate; a second adhesive substrate formed with an accommodation hole that accommodates the plurality of chipsets, and disposed on the lower surface of the second base substrate; an input terminal formed on the lower surface of the second adhesive substrate, and configured to receive a signal from an external circuit substrate; and a plurality of external terminal patterns formed on the lower surface of the second adhesive substrate, and configured to connect the antenna module with the external circuit substrate, wherein the first adhesive substrate is formed with an air gap hole having the plurality of second radiation patterns accommodated therein, wherein the air gap hole forms an air gap between the plurality of first radiation patterns and the plurality of second radiation patterns, wherein the plurality of first radiation patterns are disposed in a matrix on the upper surface of the first base substrate, and the plurality of second radiation patterns are disposed in a matrix on the upper surface of the second base substrate, and wherein the plurality of chipsets are disposed in a matrix on the lower surface of the second base substrate, and each of the plurality of chipsets is connected with two or more second radiation patterns.