Sensor device package comprising: a header (102; 202) made of metal and having a first surface and a second surface, the header (102; 202) including a conduit between the first and second surface and an aperture in the first surface, wherein the aperture is in communication with the conduit; and a die pad (104; 300) comprising a material selected from the group consisting of Invar, Kovar, glass, silicon, and ceramic and having a base and a support structure extending from the base, a MEMS device received by the die pad (104; 300) thereon, wherein the base of the die pad (104; 300) is hermetically sealed to the conduit of the header (102; 202), the base has a larger diameter than the support structure, the die pad (104; 300) has a coefficient of thermal expansion which is compliant with a coefficient of thermal expansion of the MEMS device, and characterized in that the base and the support structure of the die pad (104; 300) are made of the same material and formed as one piece, and in that the die pad (104; 300) further comprises a pedestal being located at and protruding from a top surface of the support structure, wherein the pedestal receives the MEMS device, wherein the pedestal and the support structure are integrally formed and made of the same material, wherein the support structure has a diameter which is smaller than a diameter of the base, wherein the support structure protrudes a height above a top surface of the base to ensure that stresses applied to the base are minimized at the MEMS device, wherein the pedestal has a height dimension as well as a diameter which is smaller than the diameter of the support structure. a header (102; 202) made of metal and having a first surface and a second surface, the header (102; 202) including a conduit between the first and second surface and an aperture in the first surface, wherein the aperture is in communication with the conduit; and a die pad (104; 300) comprising a material selected from the group consisting of Invar, Kovar, glass, silicon, and ceramic and having a base and a support structure extending from the base, a MEMS device received by the die pad (104; 300) thereon, wherein the base of the die pad (104; 300) is hermetically sealed to the conduit of the header (102; 202), the base has a larger diameter than the support structure, the die pad (104; 300) has a coefficient of thermal expansion which is compliant with a coefficient of thermal expansion of the MEMS device, and characterized in that the base and the support structure of the die pad (104; 300) are made of the same material and formed as one piece, and in that the die pad (104; 300) further comprises a pedestal being located at and protruding from a top surface of the support structure, wherein the pedestal receives the MEMS device, wherein the pedestal and the support structure are integrally formed and made of the same material, wherein the support structure has a diameter which is smaller than a diameter of the base, wherein the support structure protrudes a height above a top surface of the base to ensure that stresses applied to the base are minimized at the MEMS device, wherein the pedestal has a height dimension as well as a diameter which is smaller than the diameter of the support structure.