A light emitting diode package structure for increasing heat-dissipating and light-emitting efficiency, comprising: a substrate unit having a substrate body, at least one first conductive pad, at least one second conductive pad and at least one chip-placing pad, wherein the at least one first conductive pad, the at least one second conductive pad and the at least one chip-placing pad are formed on a top surface of the substrate body, and the substrate body has a circuit substrate, a heat-dissipating layer disposed on a bottom surface of the circuit substrate, and an insulative reflecting layer disposed on the top surface of the circuit substrate to expose the at least one first conductive pad, the at least one second conductive pad and the at least one chip-placing pad; an alloy unit having at least one Ni/Pd alloy formed on the at least one chip-placing pad; a light-emitting unit having at least one LED chip positioned on the at least one Ni/Pd alloy of the alloy unit through a solder ball or solder glue; a conductive unit having at least two conductive wires (Wa), wherein the at least one LED chip is electrically connected to the at least one first conductive pad through one of the at least two conductive wires (Wa), and the at least one LED chip is electrically connected to the at least one second conductive pad through the other conductive wire (Wa); a light-reflecting unit having an annular reflecting gel body surroundingly coated on the top surface of the insulative reflecting layer, wherein the annular reflecting gel body surrounds the at least one LED chip to form a gel position limiting space; and a package unit having a light-transmitting package gel body formed on the top surface of the substrate body to cover the light-emitting unit and the conductive unit, wherein the position of the light-transmitting package gel body is limited in the gel position limiting space. a substrate unit having a substrate body, at least one first conductive pad, at least one second conductive pad and at least one chip-placing pad, wherein the at least one first conductive pad, the at least one second conductive pad and the at least one chip-placing pad are formed on a top surface of the substrate body, and the substrate body has a circuit substrate, a heat-dissipating layer disposed on a bottom surface of the circuit substrate, and an insulative reflecting layer disposed on the top surface of the circuit substrate to expose the at least one first conductive pad, the at least one second conductive pad and the at least one chip-placing pad; an alloy unit having at least one Ni/Pd alloy formed on the at least one chip-placing pad; a light-emitting unit having at least one LED chip positioned on the at least one Ni/Pd alloy of the alloy unit through a solder ball or solder glue; a conductive unit having at least two conductive wires (Wa), wherein the at least one LED chip is electrically connected to the at least one first conductive pad through one of the at least two conductive wires (Wa), and the at least one LED chip is electrically connected to the at least one second conductive pad through the other conductive wire (Wa); a light-reflecting unit having an annular reflecting gel body surroundingly coated on the top surface of the insulative reflecting layer, wherein the annular reflecting gel body surrounds the at least one LED chip to form a gel position limiting space; and a package unit having a light-transmitting package gel body formed on the top surface of the substrate body to cover the light-emitting unit and the conductive unit, wherein the position of the light-transmitting package gel body is limited in the gel position limiting space.