Optoelectronic semiconductor device, having - at least one carrier film, which has a first surface and a second surface opposite said first surface; - at least one electrically conductive contact layer which is arranged on the first surface, covers the first surface in places and contains at least one metal; - at least one radiation-emitting, optoelectronic semiconductor component which is arranged on an outer face, remote from the carrier film, of the electrically conductive contact layer, - the radiation-emitting, optoelectronic semiconductor component being electrically conductively connected to the at least one electrically conductive contact layer, - the carrier film being formed with at least one polymer or containing at least one polymer, one monomer of the polymer in each case being formed with at least one C-F bond, where C denotes carbon and F fluorine, - the electromagnetic radiation generated by the radiation-emitting, optoelectronic semiconductor component when in operation impinging on the first surface of the carrier film, the first surface being formed with the polymer, - the carrier film being of self-supporting construction, - the electrically conductive contact layer forming at least one first contact point and at least one second contact point on the first surface, - the radiation-emitting, optoelectronic semiconductor device being electrically conductively connected by way of the two contact points (2A, 2B), characterized in that - the carrier film has a film thickness of at most 500 μm and in this respect is flexible and may be rolled up and unrolled, - at least two connection points (A1, A2) are arranged on the second surface of the carrier film and are electrically conductively connected to the contact points (2A, 2B), - the first contact point is constructed in one piece with the connection point associated therewith and forms a first contacting group, - the second contact point is constructed in one piece with the connection point associated therewith and forms a second contacting group, - the contacting groups (G1, G2) grip around the carrier film at least in places at outer edge faces. - at least one carrier film, which has a first surface and a second surface opposite said first surface; - at least one electrically conductive contact layer which is arranged on the first surface, covers the first surface in places and contains at least one metal; - at least one radiation-emitting, optoelectronic semiconductor component which is arranged on an outer face, remote from the carrier film, of the electrically conductive contact layer, - the radiation-emitting, optoelectronic semiconductor component being electrically conductively connected to the at least one electrically conductive contact layer, - the carrier film being formed with at least one polymer or containing at least one polymer, one monomer of the polymer in each case being formed with at least one C-F bond, where C denotes carbon and F fluorine, - the electromagnetic radiation generated by the radiation-emitting, optoelectronic semiconductor component when in operation impinging on the first surface of the carrier film, the first surface being formed with the polymer, - the carrier film being of self-supporting construction, - the electrically conductive contact layer forming at least one first contact point and at least one second contact point on the first surface, - the radiation-emitting, optoelectronic semiconductor device being electrically conductively connected by way of the two contact points (2A, 2B), - the carrier film has a film thickness of at most 500 μm and in this respect is flexible and may be rolled up and unrolled, - at least two connection points (A1, A2) are arranged on the second surface of the carrier film and are electrically conductively connected to the contact points (2A, 2B), - the first contact point is constructed in one piece with the connection point associated therewith and forms a first contacting group, - the second contact point is constructed in one piece with the connection point associated therewith and forms a second contacting group, - the contacting groups (G1, G2) grip around the carrier film at least in places at outer edge faces.