A security camera comprising a housing, a battery and a thermal-control system integrated into the security camera, the thermal-control system comprising: a first thermal-control subsystem, the first thermal-control subsystem configured to transfer a first quantity of heat to the housing, the first thermal-control subsystem including: a first thermal interface material, the first thermal interface material located between a system-on-chip integrated circuit device of the security camera and a first heat sink of the thermal-control system, the system-on-chip integrated circuit device mounted to a first surface of a first printed circuit board of the security camera; a second thermal interface material, the second thermal interface material located between a memory integrated circuit device and the first heat sink, the memory integrated circuit device mounted to the first surface of the first printed circuit board; and a third thermal interface material, the third thermal interface material located between a second surface of the first printed circuit board and a second heat sink of the thermal-control system, the second surface of the first printed circuit board opposite the first surface of the first printed circuit board; and a second thermal-control subsystem, the second thermal-control subsystem configured to transfer a second quantity of heat to the housing, the second thermal-control subsystem including: a fourth thermal interface material, the fourth thermal interface material located between a second surface of a second printed circuit board of the security camera and a heat spreader of the security camera, the second surface of the second printed circuit board opposite a first surface of the second printed circuit board to which a passive infrared sensor integrated circuit device of the security camera and an image sensor integrated circuit device of the security camera are mounted, wherein the first heat sink is located between the battery and the first printed circuit board. a first thermal-control subsystem, the first thermal-control subsystem configured to transfer a first quantity of heat to the housing, the first thermal-control subsystem including: a first thermal interface material, the first thermal interface material located between a system-on-chip integrated circuit device of the security camera and a first heat sink of the thermal-control system, the system-on-chip integrated circuit device mounted to a first surface of a first printed circuit board of the security camera; a second thermal interface material, the second thermal interface material located between a memory integrated circuit device and the first heat sink, the memory integrated circuit device mounted to the first surface of the first printed circuit board; and a third thermal interface material, the third thermal interface material located between a second surface of the first printed circuit board and a second heat sink of the thermal-control system, the second surface of the first printed circuit board opposite the first surface of the first printed circuit board; and a first thermal interface material, the first thermal interface material located between a system-on-chip integrated circuit device of the security camera and a first heat sink of the thermal-control system, the system-on-chip integrated circuit device mounted to a first surface of a first printed circuit board of the security camera; a second thermal interface material, the second thermal interface material located between a memory integrated circuit device and the first heat sink, the memory integrated circuit device mounted to the first surface of the first printed circuit board; and a third thermal interface material, the third thermal interface material located between a second surface of the first printed circuit board and a second heat sink of the thermal-control system, the second surface of the first printed circuit board opposite the first surface of the first printed circuit board; and a second thermal-control subsystem, the second thermal-control subsystem configured to transfer a second quantity of heat to the housing, the second thermal-control subsystem including: a fourth thermal interface material, the fourth thermal interface material located between a second surface of a second printed circuit board of the security camera and a heat spreader of the security camera, the second surface of the second printed circuit board opposite a first surface of the second printed circuit board to which a passive infrared sensor integrated circuit device of the security camera and an image sensor integrated circuit device of the security camera are mounted, wherein the first heat sink is located between the battery and the first printed circuit board.