An antenna module, comprising: a control substrate having a flat plate shape and configured to house or mount a semiconductor element; a frame substrate bonded to an upper surface of the control substrate via a bonding member (41, 42), and exposing a center portion of the upper surface of the control substrate; and an antenna substrate having a flat plate shape, bonded to an upper surface of the frame substrate via a bonding member (41, 42) so as to face the control substrate and provided with a plurality of antenna patterns disposed along an upper surface and a lower surface of the antenna substrate, wherein the frame substrate comprises: a frame main body having a frame shape along an outer peripheral portion of the control substrate; a crosspiece for reinforcement extending across an area defined by an inner periphery of the frame main body; characterized in that: on the frame main body and the crosspiece, a plurality of projecting portions that come into contact with the control substrate at a fixed height; and a plurality of projecting portions that come into contact with the antenna substrate at a fixed height, wherein the frame substrate is provided with solder-resist layers respectively adhered to the upper and lower surfaces thereof, and the projecting portions are positioned on the solder-resist layers. a control substrate having a flat plate shape and configured to house or mount a semiconductor element; a frame substrate bonded to an upper surface of the control substrate via a bonding member (41, 42), and exposing a center portion of the upper surface of the control substrate; and an antenna substrate having a flat plate shape, bonded to an upper surface of the frame substrate via a bonding member (41, 42) so as to face the control substrate and provided with a plurality of antenna patterns disposed along an upper surface and a lower surface of the antenna substrate, wherein the frame substrate comprises: a frame main body having a frame shape along an outer peripheral portion of the control substrate; a crosspiece for reinforcement extending across an area defined by an inner periphery of the frame main body; characterized in that: on the frame main body and the crosspiece, a plurality of projecting portions that come into contact with the control substrate at a fixed height; and a plurality of projecting portions that come into contact with the antenna substrate at a fixed height, wherein the frame substrate is provided with solder-resist layers respectively adhered to the upper and lower surfaces thereof, and the projecting portions are positioned on the solder-resist layers. a frame main body having a frame shape along an outer peripheral portion of the control substrate; a crosspiece for reinforcement extending across an area defined by an inner periphery of the frame main body; characterized in that: on the frame main body and the crosspiece, a plurality of projecting portions that come into contact with the control substrate at a fixed height; and a plurality of projecting portions that come into contact with the antenna substrate at a fixed height, wherein the frame substrate is provided with solder-resist layers respectively adhered to the upper and lower surfaces thereof, and the projecting portions are positioned on the solder-resist layers. on the frame main body and the crosspiece, a plurality of projecting portions that come into contact with the control substrate at a fixed height; and a plurality of projecting portions that come into contact with the antenna substrate at a fixed height, wherein the frame substrate is provided with solder-resist layers respectively adhered to the upper and lower surfaces thereof, and the projecting portions are positioned on the solder-resist layers.