A semiconductor device comprising: - a heat dissipation base; - a first substrate, disposed on the heat dissipation base, which has a first conductor pattern (143a, 143b, 143c); - a second substrate, disposed on the heat dissipation base, which has a second conductor pattern (143a, 143b, 143c); - a first semiconductor element, disposed on the first substrate, which has on the first conductor pattern (143a, 143b, 143c) a first collector terminal and a first emitter terminal; - a second semiconductor element, disposed on the second substrate, which has on the second conductor pattern (143a, 143b, 143c) a second collector terminal and a second emitter terminal; and - a plurality of electrode terminals (120, 121, 122, 123) and bonding wires, which are connectable in a first configuration in which said plurality of electrode terminals is connected one each to the first collector terminal, second emitter terminal, and second collector terminal, in which first configuration the first emitter terminal and second collector terminal are wired together by bonding wires, or are alternatively connectable in a second configuration in which said plurality of electrode terminals is connected one each to the first collector terminal, second emitter terminal, in which second configuration the first collector terminal and second collector terminal are wired together and the first emitter terminal and second emitter terminal are wired together by bonding wires; and are connected according to said first or second configuration; the device further comprising a common exterior case which covers the heat dissipation base with one portion of each of the connected electrode terminals exposed in both the first case and second case. - a heat dissipation base; - a first substrate, disposed on the heat dissipation base, which has a first conductor pattern (143a, 143b, 143c); - a second substrate, disposed on the heat dissipation base, which has a second conductor pattern (143a, 143b, 143c); - a first semiconductor element, disposed on the first substrate, which has on the first conductor pattern (143a, 143b, 143c) a first collector terminal and a first emitter terminal; - a second semiconductor element, disposed on the second substrate, which has on the second conductor pattern (143a, 143b, 143c) a second collector terminal and a second emitter terminal; and - a plurality of electrode terminals (120, 121, 122, 123) and bonding wires, which are connectable in a first configuration in which said plurality of electrode terminals is connected one each to the first collector terminal, second emitter terminal, and second collector terminal, in which first configuration the first emitter terminal and second collector terminal are wired together by bonding wires, or are alternatively connectable in a second configuration in which said plurality of electrode terminals is connected one each to the first collector terminal, second emitter terminal, in which second configuration the first collector terminal and second collector terminal are wired together and the first emitter terminal and second emitter terminal are wired together by bonding wires; and are connected according to said first or second configuration; the device further comprising a common exterior case which covers the heat dissipation base with one portion of each of the connected electrode terminals exposed in both the first case and second case. - a plurality of electrode terminals (120, 121, 122, 123) and bonding wires, which are connectable in a first configuration in which said plurality of electrode terminals is connected one each to the first collector terminal, second emitter terminal, and second collector terminal, in which first configuration the first emitter terminal and second collector terminal are wired together by bonding wires, or are alternatively connectable in a second configuration in which said plurality of electrode terminals is connected one each to the first collector terminal, second emitter terminal, in which second configuration the first collector terminal and second collector terminal are wired together and the first emitter terminal and second emitter terminal are wired together by bonding wires; and are connected according to said first or second configuration; the device further comprising a common exterior case which covers the heat dissipation base with one portion of each of the connected electrode terminals exposed in both the first case and second case.