A printed circuit board comprising: an integrated circuit package comprising: a first integrated circuit die having one or more output terminals, wherein the first integrated circuit die comprises one or more transistors; a first output package lead; a first output connection comprising one or more bond wires between the one or more output terminals and the first output package lead, the first output package lead comprising a first portion having a low impedance, and a second portion having a high impedance, wherein the first and second portions are coupled together and the first portion is further coupled to the one or more output terminals, the first portion comprising a first coupling portion and a first extending portion, the second portion comprising a second coupling portion and a second extending portion, and the first and second coupling portions being directly coupled together; the printed circuit board further comprising: a RF decoupling capacitor coupled in between the second extending portion and ground, and a baseband decoupling capacitor coupled in between the second extending portion and ground, wherein the RF decoupling capacitor acts as an electrical short for RF frequencies and wherein the baseband decoupling capacitor acts as an electrical short at baseband frequencies. an integrated circuit package comprising: a first integrated circuit die having one or more output terminals, wherein the first integrated circuit die comprises one or more transistors; a first output package lead; a first output connection comprising one or more bond wires between the one or more output terminals and the first output package lead, the first output package lead comprising a first portion having a low impedance, and a second portion having a high impedance, wherein the first and second portions are coupled together and the first portion is further coupled to the one or more output terminals, the first portion comprising a first coupling portion and a first extending portion, the second portion comprising a second coupling portion and a second extending portion, and the first and second coupling portions being directly coupled together; a first integrated circuit die having one or more output terminals, wherein the first integrated circuit die comprises one or more transistors; a first output package lead; a first output connection comprising one or more bond wires between the one or more output terminals and the first output package lead, the first output package lead comprising a first portion having a low impedance, and a second portion having a high impedance, wherein the first and second portions are coupled together and the first portion is further coupled to the one or more output terminals, the first portion comprising a first coupling portion and a first extending portion, the second portion comprising a second coupling portion and a second extending portion, and the first and second coupling portions being directly coupled together; the printed circuit board further comprising: a RF decoupling capacitor coupled in between the second extending portion and ground, and a baseband decoupling capacitor coupled in between the second extending portion and ground, wherein the RF decoupling capacitor acts as an electrical short for RF frequencies and wherein the baseband decoupling capacitor acts as an electrical short at baseband frequencies.