A method of forming an adhesive bond, comprising the steps of: a) providing a first epoxy adhesive, wherein the first epoxy adhesive is a single component adhesive, which exhibits a curing onset temperature of at least 130°C, as measured by differential scanning calorimetry using a heating rate of 10°C/minute the curing onset temperature being at the intersection of the temperature axis with a line tangent to the midpoint (half-height) of the upslope of the heat flow curve, that when cured exhibits an elongation E 1 and an elastic modulus M 1; b) providing a second epoxy adhesive, wherein the second epoxy adhesive is a single component adhesive, which exhibits a curing onset temperature of at least 130°C, as measured by differential scanning calorimetry using a heating rate of 10°C/minute the curing onset temperature being at the intersection of the temperature axis with a line tangent to the midpoint (half-height) of the upslope of the heat flow curve, that when cured exhibits an elongation E 2 and an elastic modulus M 2 such that E 2 >E 1 and M 2 <M 1; c) combining the first and second epoxy adhesives at a volume ratio of 1:99 to 99:1 in a two-component dispensing apparatus, to form an adhesive mixture that when cured exhibits an elongation E 3 and an elastic modulus M 3 such that E 2 >E 3 >E 1 and M 2 <M 3 <M 1; d) dispensing the adhesive mixture from the two-component dispensing apparatus and applying the dispensed adhesive mixture to form an adhesive bond at a bondline between at least one pair of substrates; e) curing the adhesive mixture at an elevated temperature to form a cured adhesive layer at the bondline; and f) cooling the cured adhesive and at least one pair of substrates to below 40°C; wherein the first and second epoxy adhesives comprise one or more epoxy resins and one or more epoxy resin hardeners; wherein each of the first and second epoxy adhesives contains at least one non-rubber-modified epoxy resin that, prior to curing the epoxy resin is not chemically bonded to rubber; wherein at least one of the first and second epoxy adhesives contains at least one toughener component that has at least one glass transition temperature (measured by differential scanning calorimetry) of -20°C or lower, the at least one toughener component being selected from one or more reactive urethane group- and/or urea group-containing polyethers having a number average molecular weight of up to 35,000, at least one polyether or diene rubber segment having a weight of at least 1000 atomic mass units, and capped isocyanate groups, one or more core-shell rubbers, and one or more rubber-modified epoxy resins; and wherein the second epoxy adhesive contains a higher proportion of toughener by weight than does the first epoxy adhesive. a) providing a first epoxy adhesive, wherein the first epoxy adhesive is a single component adhesive, which exhibits a curing onset temperature of at least 130°C, as measured by differential scanning calorimetry using a heating rate of 10°C/minute the curing onset temperature being at the intersection of the temperature axis with a line tangent to the midpoint (half-height) of the upslope of the heat flow curve, that when cured exhibits an elongation E 1 and an elastic modulus M 1; b) providing a second epoxy adhesive, wherein the second epoxy adhesive is a single component adhesive, which exhibits a curing onset temperature of at least 130°C, as measured by differential scanning calorimetry using a heating rate of 10°C/minute the curing onset temperature being at the intersection of the temperature axis with a line tangent to the midpoint (half-height) of the upslope of the heat flow curve, that when cured exhibits an elongation E 2 and an elastic modulus M 2 such that E 2 >E 1 and M 2 <M 1; c) combining the first and second epoxy adhesives at a volume ratio of 1:99 to 99:1 in a two-component dispensing apparatus, to form an adhesive mixture that when cured exhibits an elongation E 3 and an elastic modulus M 3 such that E 2 >E 3 >E 1 and M 2 <M 3 <M 1; d) dispensing the adhesive mixture from the two-component dispensing apparatus and applying the dispensed adhesive mixture to form an adhesive bond at a bondline between at least one pair of substrates; e) curing the adhesive mixture at an elevated temperature to form a cured adhesive layer at the bondline; and f) cooling the cured adhesive and at least one pair of substrates to below 40°C; wherein the first and second epoxy adhesives comprise one or more epoxy resins and one or more epoxy resin hardeners; wherein each of the first and second epoxy adhesives contains at least one non-rubber-modified epoxy resin that, prior to curing the epoxy resin is not chemically bonded to rubber; wherein at least one of the first and second epoxy adhesives contains at least one toughener component that has at least one glass transition temperature (measured by differential scanning calorimetry) of -20°C or lower, the at least one toughener component being selected from one or more reactive urethane group- and/or urea group-containing polyethers having a number average molecular weight of up to 35,000, at least one polyether or diene rubber segment having a weight of at least 1000 atomic mass units, and capped isocyanate groups, one or more core-shell rubbers, and one or more rubber-modified epoxy resins; and wherein the second epoxy adhesive contains a higher proportion of toughener by weight than does the first epoxy adhesive.