An integrated circuit device, comprising: a package that encapsulates a lead frame and at least one integrated circuit chip (112, 114), wherein the at least one integrated circuit chip is mounted to a die pad (118, 120) of the lead frame, said lead frame further including a plurality of leads (122, 124); wherein the package has, in top view, a square or rectangular perimeter defined by first, second, third and fourth sidewalls; wherein first and second sidewalls are opposite each other; wherein third and fourth sidewalls are opposite each other; wherein a first set of the plurality of leads extend along the first sidewall and a second set of the plurality of leads extend along the second sidewall; and wherein at least one of the third and fourth sidewalls includes a V-shaped concavity and comprises: a first sidewall portion; a second sidewall portion joined to the first sidewall portion at a first outside corner; a third sidewall portion joined to the second sidewall portion at an inside corner; and a fourth sidewall portion joined to the third sidewall portion at a second outside corner; wherein the second sidewall portion and the third sidewall portion define the V-shaped concavity; wherein the first sidewall portion extends perpendicularly from the first sidewall, and the fourth sidewall portion extends perpendicularly from the second sidewall, characterized in that the V-shaped concavity has a width between the first and second outside corners that is between 0.35*L and 0.55*L, where L is a length of the third or fourth sidewall, and has a depth from a plane of the third or fourth sidewall that is between 0.15*L and 0.30*L. a package that encapsulates a lead frame and at least one integrated circuit chip (112, 114), wherein the at least one integrated circuit chip is mounted to a die pad (118, 120) of the lead frame, said lead frame further including a plurality of leads (122, 124); wherein the package has, in top view, a square or rectangular perimeter defined by first, second, third and fourth sidewalls; wherein first and second sidewalls are opposite each other; wherein third and fourth sidewalls are opposite each other; wherein a first set of the plurality of leads extend along the first sidewall and a second set of the plurality of leads extend along the second sidewall; and wherein at least one of the third and fourth sidewalls includes a V-shaped concavity and comprises: a first sidewall portion; a second sidewall portion joined to the first sidewall portion at a first outside corner; a third sidewall portion joined to the second sidewall portion at an inside corner; and a fourth sidewall portion joined to the third sidewall portion at a second outside corner; wherein the second sidewall portion and the third sidewall portion define the V-shaped concavity; a first sidewall portion; a second sidewall portion joined to the first sidewall portion at a first outside corner; a third sidewall portion joined to the second sidewall portion at an inside corner; and a fourth sidewall portion joined to the third sidewall portion at a second outside corner; wherein the second sidewall portion and the third sidewall portion define the V-shaped concavity; wherein the first sidewall portion extends perpendicularly from the first sidewall, and the fourth sidewall portion extends perpendicularly from the second sidewall, characterized in that the V-shaped concavity has a width between the first and second outside corners that is between 0.35*L and 0.55*L, where L is a length of the third or fourth sidewall, and has a depth from a plane of the third or fourth sidewall that is between 0.15*L and 0.30*L.