A method for joining a first and a second joining member, the first and the second joining member being, respectively, a semiconductor substrate and a base plate or a semiconductor body and a semiconductor substrate, the method comprising: arranging a second joining member on a flat contact surface of a first part of a joining arrangement; arranging a first pre-layer on a surface of the second joining member which faces away from the flat contact surface of the first part wherein the first pre-layer comprises a first sublayer and at least one additional sublayer; arranging a first joining member on the first pre-layer such that the first pre-layer is arranged between the first joining member and the second joining member; applying pressure to the stack comprising the first joining member, the second joining member and the first pre-layer by means of a second part of the joining arrangement, thereby pressing the first joining member on the first pre-layer and the second joining member; and directly heating the first pre-layer without directly heating the joining members (10, 20), wherein heat in the first pre-layer is generated contactlessly, wherein contactlessly generating heat in the first pre-layer comprises generating an electromagnetic field, and arranging a first pre-layer on a surface of the second joining member comprises: arranging the first sublayer on a surface of the second joining member which faces away from the flat contact surface of the first part; and arranging the at least one additional sublayer on the first sublayer such that the at least one additional sublayer is arranged between the first joining member 10 and the first sublayer, wherein the at least one additional sublayer comprises ferromagnetic or paramagnetic particles, and wherein contactlessly generating heat in the first pre-layer further comprises stimulating the ferromagnetic or paramagnetic particles of the at least one additional sublayer. arranging a second joining member on a flat contact surface of a first part of a joining arrangement; arranging a first pre-layer on a surface of the second joining member which faces away from the flat contact surface of the first part wherein the first pre-layer comprises a first sublayer and at least one additional sublayer; arranging a first joining member on the first pre-layer such that the first pre-layer is arranged between the first joining member and the second joining member; applying pressure to the stack comprising the first joining member, the second joining member and the first pre-layer by means of a second part of the joining arrangement, thereby pressing the first joining member on the first pre-layer and the second joining member; and directly heating the first pre-layer without directly heating the joining members (10, 20), wherein heat in the first pre-layer is generated contactlessly, wherein contactlessly generating heat in the first pre-layer comprises generating an electromagnetic field, and arranging a first pre-layer on a surface of the second joining member comprises: arranging the first sublayer on a surface of the second joining member which faces away from the flat contact surface of the first part; and arranging the at least one additional sublayer on the first sublayer such that the at least one additional sublayer is arranged between the first joining member 10 and the first sublayer, wherein the at least one additional sublayer comprises ferromagnetic or paramagnetic particles, and wherein contactlessly generating heat in the first pre-layer further comprises stimulating the ferromagnetic or paramagnetic particles of the at least one additional sublayer. arranging the first sublayer on a surface of the second joining member which faces away from the flat contact surface of the first part; and arranging the at least one additional sublayer on the first sublayer such that the at least one additional sublayer is arranged between the first joining member 10 and the first sublayer, wherein the at least one additional sublayer comprises ferromagnetic or paramagnetic particles, and wherein contactlessly generating heat in the first pre-layer further comprises stimulating the ferromagnetic or paramagnetic particles of the at least one additional sublayer.