A method for making a sputtering target comprising the steps of: a. making a refractory metal powder using a method comprising the steps of i. locating an initial mass of refractory metal powder having an initial content of oxygen in a reactor; ii. locating within the reactor, spaced apart from the initial mass of refractory metal powder, a mass of a scavenging metal, wherein the mass of the scavenging metal and the initial mass of refractory metal powder are not blended together; iii. heating within the reactor to a scavenging temperature for causing at least a portion of the scavenging metal to at least partially vaporize and react with at least a portion of the initial content of oxygen to form a scavenging metal oxide with at least a portion of the scavenging metal; and iv. separating the scavenging metal oxide from the initial mass of refractory metal powder so that a resulting mass of refractory metal powder is formed that has a resulting content of oxygen that is less than the initial content of oxygen; b. encapsulating the mass of the refractory metal powder that has at least 95% by weight of particles exhibiting a particle size ranging from 10 to 1000 μm, with at least 10 percent by weight of particles having a particle size greater than 150 μm in a container configured for defining at least a portion of a sputtering target body, wherein the powder particle size is determined as pre-consolidation size by screen analysis in accordance with ASTM B214-07; and c. hot isostatically pressing the mass of the refractory metal powder to form a resulting densified mass having an initial crystallographic texture, while the mass of refractory metal powder is in the container, wherein the hot isostatically pressing step is performed under conditions so that the initial crystallographic texture achieved in the resulting densified mass is a theoretically random and generally uniform crystallographic texture, wherein the method is devoid of any step of altering the initial crystallographic texture throughout the resulting densified mass after the step of hot isostatically pressing and prior to sputtering, and wherein the hot isostatically pressing step takes place at a temperature of 950°C to 1400°C, at a pressure of 100 and 300 MPa and for a duration of 1 to 12 hours. a. making a refractory metal powder using a method comprising the steps of i. locating an initial mass of refractory metal powder having an initial content of oxygen in a reactor; ii. locating within the reactor, spaced apart from the initial mass of refractory metal powder, a mass of a scavenging metal, wherein the mass of the scavenging metal and the initial mass of refractory metal powder are not blended together; iii. heating within the reactor to a scavenging temperature for causing at least a portion of the scavenging metal to at least partially vaporize and react with at least a portion of the initial content of oxygen to form a scavenging metal oxide with at least a portion of the scavenging metal; and iv. separating the scavenging metal oxide from the initial mass of refractory metal powder so that a resulting mass of refractory metal powder is formed that has a resulting content of oxygen that is less than the initial content of oxygen; i. locating an initial mass of refractory metal powder having an initial content of oxygen in a reactor; ii. locating within the reactor, spaced apart from the initial mass of refractory metal powder, a mass of a scavenging metal, wherein the mass of the scavenging metal and the initial mass of refractory metal powder are not blended together; iii. heating within the reactor to a scavenging temperature for causing at least a portion of the scavenging metal to at least partially vaporize and react with at least a portion of the initial content of oxygen to form a scavenging metal oxide with at least a portion of the scavenging metal; and iv. separating the scavenging metal oxide from the initial mass of refractory metal powder so that a resulting mass of refractory metal powder is formed that has a resulting content of oxygen that is less than the initial content of oxygen; b. encapsulating the mass of the refractory metal powder that has at least 95% by weight of particles exhibiting a particle size ranging from 10 to 1000 μm, with at least 10 percent by weight of particles having a particle size greater than 150 μm in a container configured for defining at least a portion of a sputtering target body, wherein the powder particle size is determined as pre-consolidation size by screen analysis in accordance with ASTM B214-07; and c. hot isostatically pressing the mass of the refractory metal powder to form a resulting densified mass having an initial crystallographic texture, while the mass of refractory metal powder is in the container, wherein the hot isostatically pressing step is performed under conditions so that the initial crystallographic texture achieved in the resulting densified mass is a theoretically random and generally uniform crystallographic texture, wherein the method is devoid of any step of altering the initial crystallographic texture throughout the resulting densified mass after the step of hot isostatically pressing and prior to sputtering, and wherein the hot isostatically pressing step takes place at a temperature of 950°C to 1400°C, at a pressure of 100 and 300 MPa and for a duration of 1 to 12 hours.