Method for processing and/or for analyzing a sample, wherein a particle beam device is used in the method, the particle beam device comprising - at least one first particle beam column which has a first beam axis and which is designed for generating a first particle beam, - at least one second particle beam column which has a second beam axis and which is designed for generating a second particle beam, wherein the first particle beam column and the second particle beam column are arranged with respect to one another in such a way that the first beam axis and the second beam axis form a first angle which is different from 0° and 180°, - at least one sample carrier which is rotatable about a rotation axis, wherein the rotation axis forms a second angle with the first beam axis, wherein the rotation axis forms a third angle with the second beam axis, wherein both the second angle and the third angle are different from 0° and 180°, and wherein at least one sample having a sample surface to be processed and/or to be analyzed can be arranged on the sample carrier, wherein - the sample carrier is arranged at a first position, - the sample carrier is rotatable from the first position into a second position, in which a sample surface is oriented perpendicular to the second beam axis, wherein the sample surface in the first position is oriented parallel to the first beam axis, - the first beam axis and the second beam axis intersect at a coincidence point, and wherein at least one of the following is further provided: (i) in the first position, a distance between the coincidence point and the first particle beam column is greater than a distance between the sample surface and the first particle beam column, or (ii) in the second position, a distance between the coincidence point and the second particle beam column is greater than a distance between the sample surface and the second particle beam column, characterised in that the method has the following steps: - rotating the sample carrier about the rotation axis into the first position; - processing the sample surface by means of the first particle beam; - rotating the sample carrier about the rotation axis into the second position; and - analyzing the sample surface by means of the second particle beam. - at least one first particle beam column which has a first beam axis and which is designed for generating a first particle beam, - at least one second particle beam column which has a second beam axis and which is designed for generating a second particle beam, wherein the first particle beam column and the second particle beam column are arranged with respect to one another in such a way that the first beam axis and the second beam axis form a first angle which is different from 0° and 180°, - at least one sample carrier which is rotatable about a rotation axis, wherein the rotation axis forms a second angle with the first beam axis, wherein the rotation axis forms a third angle with the second beam axis, wherein both the second angle and the third angle are different from 0° and 180°, and wherein at least one sample having a sample surface to be processed and/or to be analyzed can be arranged on the sample carrier, - the sample carrier is arranged at a first position, - the sample carrier is rotatable from the first position into a second position, in which a sample surface is oriented perpendicular to the second beam axis, wherein the sample surface in the first position is oriented parallel to the first beam axis, - the first beam axis and the second beam axis intersect at a coincidence point, and wherein at least one of the following is further provided: (i) in the first position, a distance between the coincidence point and the first particle beam column is greater than a distance between the sample surface and the first particle beam column, or (ii) in the second position, a distance between the coincidence point and the second particle beam column is greater than a distance between the sample surface and the second particle beam column, (i) in the first position, a distance between the coincidence point and the first particle beam column is greater than a distance between the sample surface and the first particle beam column, or (ii) in the second position, a distance between the coincidence point and the second particle beam column is greater than a distance between the sample surface and the second particle beam column, - rotating the sample carrier about the rotation axis into the first position; - processing the sample surface by means of the first particle beam; - rotating the sample carrier about the rotation axis into the second position; and - analyzing the sample surface by means of the second particle beam.