A semiconductor wafer conveying tool (100, 200) which can hold a semiconductor wafer having a predetermined diameter to convey it when heating the semiconductor wafer, wherein the tool comprises: a main body configured to convey the semiconductor wafer while heating the semiconductor wafer in a reflow furnace, the main body defining an enclosed opening having a center and a diameter which is larger than a diameter of the largest semiconductor wafer intended to be conveyed, the main body being rectangular-shaped; and at least three supporting members (3A-D) made of stainless steel, the supporting members being fixed to the main body and stationary at positions around the opening and projecting radially inwardly with respect to the opening and toward the center of the opening, each of the supporting members including a supporting plate having a predetermined length and a plurality of pins (4A-D, 5A-D, 6A-D, 7A-D) mounted on the supporting plate and having respective locations corresponding to the diameter of the semiconductor wafer and including a holding pin (4A-D, 6A-D) located on the supporting plate for supporting the semiconductor wafer from below, and a guide pin (5A-D, 7A-D) located on the supporting plate for preventing misalignment of the wafer, the guide pin being taller than the holding pin and being located on the supporting plate at a greater distance from the centre of the opening than a location of the holding pin on the supporting plate, wherein the enclosed opening is located below the supporting members; and wherein the supporting members constitute a holding mechanism arranged to support the semiconductor wafer in a location that is concentric with the opening, with the semiconductor wafer supported by the holding pins and kept in alignment by the guide pins. a main body configured to convey the semiconductor wafer while heating the semiconductor wafer in a reflow furnace, the main body defining an enclosed opening having a center and a diameter which is larger than a diameter of the largest semiconductor wafer intended to be conveyed, the main body being rectangular-shaped; and at least three supporting members (3A-D) made of stainless steel, the supporting members being fixed to the main body and stationary at positions around the opening and projecting radially inwardly with respect to the opening and toward the center of the opening, each of the supporting members including a supporting plate having a predetermined length and a plurality of pins (4A-D, 5A-D, 6A-D, 7A-D) mounted on the supporting plate and having respective locations corresponding to the diameter of the semiconductor wafer and including a holding pin (4A-D, 6A-D) located on the supporting plate for supporting the semiconductor wafer from below, and a guide pin (5A-D, 7A-D) located on the supporting plate for preventing misalignment of the wafer, the guide pin being taller than the holding pin and being located on the supporting plate at a greater distance from the centre of the opening than a location of the holding pin on the supporting plate, wherein the enclosed opening is located below the supporting members; and wherein the supporting members constitute a holding mechanism arranged to support the semiconductor wafer in a location that is concentric with the opening, with the semiconductor wafer supported by the holding pins and kept in alignment by the guide pins.