A cooled type semiconductor device comprises: a semiconductor module including metallic heat radiating plates and a semiconductor element chip interposed between the metallic heat radiating plates, a heat sink contacting one of said metallic heat radiating plates; and a biasing-holding member having a heat conducting property and pressing another one of said metallic heat radiating plates, wherein said biasing-holding member is fixed to said heat sink and has a beam portion for pressing and biasing said semiconductor module, and at least a pair of leg portions projecting from both ends of said beam portion onto the heat sink side characterized in that the cooled type semiconductor device further comprises: a circuit part disposed on said semiconductor module; wherein said biasing-holding member presses said semiconductor module against said heat sink through the circuit part, and a terminal member (161, 262) arranged between said another one of the metallic heat radiating plates (151, 252) and a terminal of said circuit part; wherein said semiconductor module constitutes an inverter circuit; said circuit part is constituted by a smoothing capacitor connected to positive and negative direct current terminals of said inverter circuit; and said terminal member is a bus bar that is connected to a direct current power source. a semiconductor module including metallic heat radiating plates and a semiconductor element chip interposed between the metallic heat radiating plates, a heat sink contacting one of said metallic heat radiating plates; and a biasing-holding member having a heat conducting property and pressing another one of said metallic heat radiating plates, wherein said biasing-holding member is fixed to said heat sink and has a beam portion for pressing and biasing said semiconductor module, and at least a pair of leg portions projecting from both ends of said beam portion onto the heat sink side characterized in that the cooled type semiconductor device further comprises: a circuit part disposed on said semiconductor module; wherein said biasing-holding member presses said semiconductor module against said heat sink through the circuit part, and a terminal member (161, 262) arranged between said another one of the metallic heat radiating plates (151, 252) and a terminal of said circuit part; wherein said semiconductor module constitutes an inverter circuit; said circuit part is constituted by a smoothing capacitor connected to positive and negative direct current terminals of said inverter circuit; and said terminal member is a bus bar that is connected to a direct current power source. a circuit part disposed on said semiconductor module; wherein said biasing-holding member presses said semiconductor module against said heat sink through the circuit part, and a terminal member (161, 262) arranged between said another one of the metallic heat radiating plates (151, 252) and a terminal of said circuit part; wherein said semiconductor module constitutes an inverter circuit; said circuit part is constituted by a smoothing capacitor connected to positive and negative direct current terminals of said inverter circuit; and said terminal member is a bus bar that is connected to a direct current power source.