A method for assembling a radio base station housing arrangement, the radio base station housing arrangement comprising: - a radio base station housing, - a heat conducting mounting structure for mounting of at least one electronic module, and - an electronic module for a radio base station or a network server or a work-station or a high-power rectifier or a circuit board with an electro-magnetic configuration, wherein the electronic module is to be mounted to the heat conducting mounting structure, said heat conducting mounting structure comprising: - at least one first surface area of a wall, the first surface area facing a second surface area of the electronic module; - at least one cavity means embedded in the wall, the cavity means being placed at a distance from the first surface area, said cavity means being configured to receive a cooling means, wherein the cooling means is a thermosyphon loop comprising: - a condenser; - a cooling device; and - a cooling material configured to be circulated in the cavity means and the condenser; and - at least one attachment means at the first surface area configured to attach to the electronic module, wherein the attachment means transfers heat energy from the electronic module to the heat conducting mounting structure; the method comprising the step of inserting the heat conducting mounting structure from a top opening of the radio base station housing with the condenser and the cooling device situated on top and outside the radio base station housing. - a radio base station housing, - a heat conducting mounting structure for mounting of at least one electronic module, and - an electronic module for a radio base station or a network server or a work-station or a high-power rectifier or a circuit board with an electro-magnetic configuration, wherein the electronic module is to be mounted to the heat conducting mounting structure, said heat conducting mounting structure comprising: - at least one first surface area of a wall, the first surface area facing a second surface area of the electronic module; - at least one cavity means embedded in the wall, the cavity means being placed at a distance from the first surface area, said cavity means being configured to receive a cooling means, wherein the cooling means is a thermosyphon loop comprising: - a condenser; - a cooling device; and - a cooling material configured to be circulated in the cavity means and the condenser; and - at least one attachment means at the first surface area configured to attach to the electronic module, wherein the attachment means transfers heat energy from the electronic module to the heat conducting mounting structure; - at least one first surface area of a wall, the first surface area facing a second surface area of the electronic module; - at least one cavity means embedded in the wall, the cavity means being placed at a distance from the first surface area, said cavity means being configured to receive a cooling means, wherein the cooling means is a thermosyphon loop comprising: - a condenser; - a cooling device; and - a cooling material configured to be circulated in the cavity means and the condenser; and - a condenser; - a cooling device; and - a cooling material configured to be circulated in the cavity means and the condenser; and - at least one attachment means at the first surface area configured to attach to the electronic module, wherein the attachment means transfers heat energy from the electronic module to the heat conducting mounting structure;