A display device comprising: a base member comprising a first area and a second area disposed adjacent to the first area; a circuit layer (DP-CL) disposed on the base member to cover the first area and to expose the second area; a display layer (DP-OLED) disposed on the circuit layer (DP-CL); a thin film encapsulation layer disposed on the display layer (DP-OLED); and a touch sensor layer comprising a conductive layer (TS-CL2) disposed on the thin film encapsulation layer and an insulating layer (TS-IL2) comprising an organic layer to cover the conductive layer (TS-CL2) characterized in that the display device further comprises a shock-absorbing member (DM-C) disposed in the second area; the shock-absorbing member (DM-C) comprising a plurality of insulating patterns (DM-CP) disposed on the base member and a cover member (DM-CC) covering the plurality of insulating patterns (DM-CP); the cover member (DM-CC) is overlapped with the second area and is partially overlapped with the first area; the insulating layer (TS-IL2) is disposed on the touch sensor layer and covers the second area such that the insulating layer (TS-IL2) covers the shock-absorbing member (DM-C) to relieve a stress generated upon bending the display device; each insulating pattern of the plurality of insulating patterns (DM-CP) is spaced apart from each other in a first direction; the insulating patterns are arranged one behind another along the first direction from the end of the circuit layer (DP-CL) and spaced apart from each other; and the organic layer covers an upper surface and a side surface of the shock-absorbing member (DM-C). a base member comprising a first area and a second area disposed adjacent to the first area; a circuit layer (DP-CL) disposed on the base member to cover the first area and to expose the second area; a display layer (DP-OLED) disposed on the circuit layer (DP-CL); a thin film encapsulation layer disposed on the display layer (DP-OLED); and a touch sensor layer comprising a conductive layer (TS-CL2) disposed on the thin film encapsulation layer and an insulating layer (TS-IL2) comprising an organic layer to cover the conductive layer (TS-CL2) characterized in that the display device further comprises a shock-absorbing member (DM-C) disposed in the second area; the shock-absorbing member (DM-C) comprising a plurality of insulating patterns (DM-CP) disposed on the base member and a cover member (DM-CC) covering the plurality of insulating patterns (DM-CP); the cover member (DM-CC) is overlapped with the second area and is partially overlapped with the first area; the insulating layer (TS-IL2) is disposed on the touch sensor layer and covers the second area such that the insulating layer (TS-IL2) covers the shock-absorbing member (DM-C) to relieve a stress generated upon bending the display device; each insulating pattern of the plurality of insulating patterns (DM-CP) is spaced apart from each other in a first direction; the insulating patterns are arranged one behind another along the first direction from the end of the circuit layer (DP-CL) and spaced apart from each other; and the organic layer covers an upper surface and a side surface of the shock-absorbing member (DM-C).