A cooling system for use in a vehicle with a power electronics assembly comprising an array of line-replaceable units, said cooling system comprising: a first manifold coupled in flow communication with the array of line-replaceable units; and a fluid supply coupled in flow communication with said first manifold, said fluid supply configured to channel cooling fluid towards said first manifold such that the cooling fluid is discharged towards the line-replaceable units in the array substantially simultaneously; characterized by further comprising: a second manifold coupled in flow communication with the array of line-replaceable units, wherein said second manifold is configured to collect the cooling fluid discharged towards the line-replaceable units, the collected cooling fluid comprising a flow of vaporized cooling liquid and a flow of residual cooling fluid remaining in liquid form, the second manifold being configured to recycle the flow of residual liquid towards the fluid supply; and a condenser coupled in flow communication with said second manifold via a return line which is configured to receive the flow of vaporized cooling fluid and channel it towards the condenser, wherein said condenser is configured to: receive the flow of vaporized cooling fluid from said second manifold through said return line, condense the vaporized cooling fluid and form condensed cooling fluid, and recycle the condensed cooling fluid towards the fluid supply. a first manifold coupled in flow communication with the array of line-replaceable units; and a fluid supply coupled in flow communication with said first manifold, said fluid supply configured to channel cooling fluid towards said first manifold such that the cooling fluid is discharged towards the line-replaceable units in the array substantially simultaneously; characterized by further comprising: a second manifold coupled in flow communication with the array of line-replaceable units, wherein said second manifold is configured to collect the cooling fluid discharged towards the line-replaceable units, the collected cooling fluid comprising a flow of vaporized cooling liquid and a flow of residual cooling fluid remaining in liquid form, the second manifold being configured to recycle the flow of residual liquid towards the fluid supply; and a condenser coupled in flow communication with said second manifold via a return line which is configured to receive the flow of vaporized cooling fluid and channel it towards the condenser, wherein said condenser is configured to: receive the flow of vaporized cooling fluid from said second manifold through said return line, condense the vaporized cooling fluid and form condensed cooling fluid, and recycle the condensed cooling fluid towards the fluid supply. a second manifold coupled in flow communication with the array of line-replaceable units, wherein said second manifold is configured to collect the cooling fluid discharged towards the line-replaceable units, the collected cooling fluid comprising a flow of vaporized cooling liquid and a flow of residual cooling fluid remaining in liquid form, the second manifold being configured to recycle the flow of residual liquid towards the fluid supply; and a condenser coupled in flow communication with said second manifold via a return line which is configured to receive the flow of vaporized cooling fluid and channel it towards the condenser, wherein said condenser is configured to: receive the flow of vaporized cooling fluid from said second manifold through said return line, condense the vaporized cooling fluid and form condensed cooling fluid, and recycle the condensed cooling fluid towards the fluid supply. receive the flow of vaporized cooling fluid from said second manifold through said return line, condense the vaporized cooling fluid and form condensed cooling fluid, and recycle the condensed cooling fluid towards the fluid supply.