A printed circuit board assembly having a printed circuit board, said printed circuit board having a first side, a second side and a contact hole, a sleeve-type via being provided in the contact hole, an annular ring (35; 36) being associated with said sleeve-type via on at least one side (33; 34), said annular ring (35; 36) being disposed on the first side or on the second side of the printed circuit board and electrically connected to said sleeve-type via, said annular ring (35; 36) at least in sections comprising an annular ring edge, said printed circuit board module comprising a solder resist layer, the solder resist layer extending at least in sections from outside the annular ring edge over the annular ring edge to an outer region of the annular ring (35; 36), wherein an inner region, which is not covered by the solder resist layer, remains on the annular ring (35; 36), further comprising a component (12; 242) having a contact pin and a solder (51; 53), said contact pin being at least partially disposed in said sleeve-type via, and said solder (51; 53) being mechanically and electrically connected to the contact pin and to the inner region of the annular ring (35; 36). wherein a nickel-containing layer is applied to at least one annular ring (35; 36) and a gold-containing layer is applied to the nickel-containing layer, wherein the nickel-containing layer and the gold-containing layer extend at least in sections into the inner region and into the outer region, wherein a protective layer made of casting resin is provided on at least one side (21; 22) of the printed circuit board to ensure protection of the printed circuit board. said printed circuit board having a first side, a second side and a contact hole, a sleeve-type via being provided in the contact hole, an annular ring (35; 36) being associated with said sleeve-type via on at least one side (33; 34), said annular ring (35; 36) being disposed on the first side or on the second side of the printed circuit board and electrically connected to said sleeve-type via, said annular ring (35; 36) at least in sections comprising an annular ring edge, said printed circuit board module comprising a solder resist layer, the solder resist layer extending at least in sections from outside the annular ring edge over the annular ring edge to an outer region of the annular ring (35; 36), wherein an inner region, which is not covered by the solder resist layer, remains on the annular ring (35; 36), further comprising a component (12; 242) having a contact pin and a solder (51; 53), said contact pin being at least partially disposed in said sleeve-type via, and said solder (51; 53) being mechanically and electrically connected to the contact pin and to the inner region of the annular ring (35; 36). wherein a nickel-containing layer is applied to at least one annular ring (35; 36) and a gold-containing layer is applied to the nickel-containing layer, wherein the nickel-containing layer and the gold-containing layer extend at least in sections into the inner region and into the outer region, wherein a protective layer made of casting resin is provided on at least one side (21; 22) of the printed circuit board to ensure protection of the printed circuit board.