A switch module (10, 20) adapted to be electrically connecting a plurality of probes of a test head to a plurality of upper contact points of an upper surface of a test circuit board, wherein the switch module (10, 20) comprises: a base comprising a hollow portion; a microhole plate disposed below the base, wherein the microhole plate comprises a plurality of first microholes facing the hollow portion; a switch plate (13, 23) disposed above the base, wherein an outer diameter of the switch plate (13, 23) is greater than a hole size of the hollow portion, the switch plate (13, 23) comprises a top surface, a bottom surface, and a plurality of vias, the bottom surface of the switch plate (13, 23) faces the base, the top surface of the switch plate (13, 23) comprises a plurality of upper contact points, the vias are extending from the top surface of the switch plate (13, 23) to the bottom surface of the switch plate (13, 23); a plurality of wires respectively passing through the first microholes of the microhole plate and the vias of the switch plate (13, 23), wherein the wires electrically connect the microhole plate to the upper contact points of the top surface of the switch plate (13, 23); a plurality of external circuit traces for respectively and electrically connecting the upper contact points of the switch plate (13, 23) to the upper contact points of the upper surface of the test circuit board; and wherein a distance between two adjacent vias of the switch plate (13, 23) is greater than a distance between two adjacent first microholes of the microhole plate, and a ratio of a length of a longest wire of the wires and a length of a shortest wire of the wires is less than 1.1; characterised in that the switch module (10,20) further comprises: a positioning film, disposed between the microhole plate and the switch plate (13, 23) and above the first microholes of the microhole plate, wherein the positioning film comprises a plurality of second microholes respectively corresponding to the first microholes, the wires respectively pass through the second microholes of the positioning film, a distance between two adjacent vias of the switch plate (13, 23) is greater than a distance between two adjacent second microholes of the positioning film, and the distance between two adjacent second microholes of the positioning film is equal to the distance between two adjacent first microholes of the microhole plate. a base comprising a hollow portion; a microhole plate disposed below the base, wherein the microhole plate comprises a plurality of first microholes facing the hollow portion; a switch plate (13, 23) disposed above the base, wherein an outer diameter of the switch plate (13, 23) is greater than a hole size of the hollow portion, the switch plate (13, 23) comprises a top surface, a bottom surface, and a plurality of vias, the bottom surface of the switch plate (13, 23) faces the base, the top surface of the switch plate (13, 23) comprises a plurality of upper contact points, the vias are extending from the top surface of the switch plate (13, 23) to the bottom surface of the switch plate (13, 23); a plurality of wires respectively passing through the first microholes of the microhole plate and the vias of the switch plate (13, 23), wherein the wires electrically connect the microhole plate to the upper contact points of the top surface of the switch plate (13, 23); a plurality of external circuit traces for respectively and electrically connecting the upper contact points of the switch plate (13, 23) to the upper contact points of the upper surface of the test circuit board; and wherein a distance between two adjacent vias of the switch plate (13, 23) is greater than a distance between two adjacent first microholes of the microhole plate, and a ratio of a length of a longest wire of the wires and a length of a shortest wire of the wires is less than 1.1; characterised in that the switch module (10,20) further comprises: a positioning film, disposed between the microhole plate and the switch plate (13, 23) and above the first microholes of the microhole plate, wherein the positioning film comprises a plurality of second microholes respectively corresponding to the first microholes, the wires respectively pass through the second microholes of the positioning film, a distance between two adjacent vias of the switch plate (13, 23) is greater than a distance between two adjacent second microholes of the positioning film, and the distance between two adjacent second microholes of the positioning film is equal to the distance between two adjacent first microholes of the microhole plate.