Illumination device comprising an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is intended for fixing at the optoelectronic component, said optical element having an optical axis, wherein - the optical element has a radiation exit surface, - the radiation exit surface has a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, wherein the optical axis runs through the concavely curved partial region, - the optical element has a planar radiation entrance surface, - an intermediate layer is arranged between the optical element fixed at the optoelectronic component and the semiconductor chip, - an intermediate space is formed between the optical element fixed at the optoelectronic component and the optoelectronic component, wherein the intermediate space is provided as a gap for receiving the intermediate layer in the event of an expansion of the intermediate layer. - the housing body has a cavity, in which the semiconductor chip is arranged and in which an encapsulation, which comprises a silicone or a silicone resin, is arranged, - the semiconductor chip is embedded in the encapsulation, - a side of the encapsulation facing the optical element is concave and the intermediate layer is formed such that it is in direct mechanical contact with the concave encapsulation and the planar radiation entrance surface of the optical element, - the optical element comprises at least one fixing element and the fixing element is provided for fixing the optical element to the optoelectronic component, and - the optoelectronic component has at least one fixing arrangement and the fixing element engages in the fixing arrangement of the optoelectronic component for fixing the optical element. - the optical element has a radiation exit surface, - the radiation exit surface has a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, wherein the optical axis runs through the concavely curved partial region, - the optical element has a planar radiation entrance surface, - an intermediate layer is arranged between the optical element fixed at the optoelectronic component and the semiconductor chip, - an intermediate space is formed between the optical element fixed at the optoelectronic component and the optoelectronic component, wherein the intermediate space is provided as a gap for receiving the intermediate layer in the event of an expansion of the intermediate layer. - the housing body has a cavity, in which the semiconductor chip is arranged and in which an encapsulation, which comprises a silicone or a silicone resin, is arranged, - the semiconductor chip is embedded in the encapsulation, - a side of the encapsulation facing the optical element is concave and the intermediate layer is formed such that it is in direct mechanical contact with the concave encapsulation and the planar radiation entrance surface of the optical element, - the optical element comprises at least one fixing element and the fixing element is provided for fixing the optical element to the optoelectronic component, and - the optoelectronic component has at least one fixing arrangement and the fixing element engages in the fixing arrangement of the optoelectronic component for fixing the optical element.