A copper thermal resistance thin-film temperature sensor chip, comprising a substrate, a temperature sensor and two electrode plates (1, 2) placed on the substrate, wherein the temperature sensor has a detection resistor and a resistance adjustment circuit connected in series, the detection resistor and the resistance adjustment circuit each consist of a plurality of electrically connected resistance elements, all the resistance elements are covered with an insulating passivation layer, and the two electrode plates (1, 2) are connected to a resistance element of the resistance adjustment circuit at one end of the resistance adjustment circuit and to a resistance element of the detection resistor at the other end of the resistance adjustment circuit respectively, wherein all the resistance elements are formed by patterning a temperature-sensitive thin film, and the temperature-sensitive thin film comprises a copper thermal resistance thin-film layer and a passivation protection layer covering the surface of the copper thermal resistance thin-film layer, characterized in that: the copper thermal resistance thin-film layer is made of a thermal sensitive material, which has a nanocrystalline structure with a typical length of crystallites or defects thereof not greater than 500 nm, and the temperature-sensitive thin film further comprises a seed layer of metal oxide or metal nitride located between the substrate and the copper thermal resistance thin-film layer. a substrate, a temperature sensor and two electrode plates (1, 2) placed on the substrate, wherein the temperature sensor has a detection resistor and a resistance adjustment circuit connected in series, the detection resistor and the resistance adjustment circuit each consist of a plurality of electrically connected resistance elements, all the resistance elements are covered with an insulating passivation layer, and the two electrode plates (1, 2) are connected to a resistance element of the resistance adjustment circuit at one end of the resistance adjustment circuit and to a resistance element of the detection resistor at the other end of the resistance adjustment circuit respectively, wherein all the resistance elements are formed by patterning a temperature-sensitive thin film, and the temperature-sensitive thin film comprises a copper thermal resistance thin-film layer and a passivation protection layer covering the surface of the copper thermal resistance thin-film layer, characterized in that: the copper thermal resistance thin-film layer is made of a thermal sensitive material, which has a nanocrystalline structure with a typical length of crystallites or defects thereof not greater than 500 nm, and the temperature-sensitive thin film further comprises a seed layer of metal oxide or metal nitride located between the substrate and the copper thermal resistance thin-film layer. the copper thermal resistance thin-film layer is made of a thermal sensitive material, which has a nanocrystalline structure with a typical length of crystallites or defects thereof not greater than 500 nm, and the temperature-sensitive thin film further comprises a seed layer of metal oxide or metal nitride located between the substrate and the copper thermal resistance thin-film layer.