An antenna packaging module, comprising: an antenna substrate, a first laminated circuit and a ground layer being disposed respectively on two opposite sides of the antenna substrate; a radiator disposed on a side of the first laminated circuit away from the antenna substrate; a second laminated circuit disposed on a side of the ground layer away from the antenna substrate, a side of the second laminated circuit away from the ground layer being configured to dispose a radio frequency chip; a feed structure extending through the second laminated circuit, the ground layer, the antenna substrate and the first laminated circuit, the feed structure being configured to connect the radio frequency chip and the radiator; and a conductive grid comprising a plurality of spaced conductive structures, the conductive structures extending through the antenna substrate and being connected with the ground layer, and a portion of the feed structure being disposed in a space formed by two adjacent conductive structures of the plurality of spaced conductive structures; wherein the first laminated circuit comprises a first conductive layer adjacent to a side of the antenna substrate; wherein each of the conductive structures comprises a conductive column extending through the antenna substrate and a conductive sheet disposed on the first conductive layer, and the conductive sheet is connected to the ground layer via the conductive column; characterized in that, a shape of a cross section of the conductive column along a plane of the antenna substrate is the same as a shape of the conductive sheet connected to the conductive column. an antenna substrate, a first laminated circuit and a ground layer being disposed respectively on two opposite sides of the antenna substrate; a radiator disposed on a side of the first laminated circuit away from the antenna substrate; a second laminated circuit disposed on a side of the ground layer away from the antenna substrate, a side of the second laminated circuit away from the ground layer being configured to dispose a radio frequency chip; a feed structure extending through the second laminated circuit, the ground layer, the antenna substrate and the first laminated circuit, the feed structure being configured to connect the radio frequency chip and the radiator; and a conductive grid comprising a plurality of spaced conductive structures, the conductive structures extending through the antenna substrate and being connected with the ground layer, and a portion of the feed structure being disposed in a space formed by two adjacent conductive structures of the plurality of spaced conductive structures; wherein the first laminated circuit comprises a first conductive layer adjacent to a side of the antenna substrate; wherein each of the conductive structures comprises a conductive column extending through the antenna substrate and a conductive sheet disposed on the first conductive layer, and the conductive sheet is connected to the ground layer via the conductive column; characterized in that, a shape of a cross section of the conductive column along a plane of the antenna substrate is the same as a shape of the conductive sheet connected to the conductive column.