A component carrier, wherein the component carrier comprises: an interconnected stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure; a diode bridge embedded in laminate material forming said interconnected stack; wherein the diode bridge comprises a plurality of components embedded in the stack and each comprising or consisting of a respective diode; wherein the plurality of components each comprises a cathode pad on one main surface of the component, and an anode pad on an opposing other main surface of the component; and wherein, each of the cathode pads covers the entire main surface of the plurality of components and each of the anode pads covers only part of the opposing other main surface of the plurality of components; at least one heat removal layer (112, 118) configured for removing heat from said diodes and substantially fully covering a whole main surface of the component carrier; wherein the at least one electrically conductive layer structure comprises a first electrically conductive layer structure which is arranged spaced with regard to an electrically conductive layer as one of the at least one heat removal layer (112, 118) by an electrically insulating and thermally conductive layer as another one of the at least one heat removal layer (112, 118); and wherein the first electrically conductive layer structure comprises a plurality of sections each directly electrically contacting an entire first main surface of a respective one of the plurality of components, and wherein individual ones of the plurality of sections are spaced by electrically insulating spacers, wherein the at least one electrically conductive layer structure comprises a second electrically conductive layer structure which is arranged spaced with regard to the first electrically conductive layer structure at least by the component and one of the at least one electrically insulating layer structure, wherein the second electrically conductive layer structure electrically contacts only a part of a second main surface of the components; and comprising at least one second vertical interconnect structure directly contacting both the first electrically conductive layer structure and the second electrically conductive layer structure. an interconnected stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure; a diode bridge embedded in laminate material forming said interconnected stack; wherein the diode bridge comprises a plurality of components embedded in the stack and each comprising or consisting of a respective diode; wherein the plurality of components each comprises a cathode pad on one main surface of the component, and an anode pad on an opposing other main surface of the component; and wherein, each of the cathode pads covers the entire main surface of the plurality of components and each of the anode pads covers only part of the opposing other main surface of the plurality of components; at least one heat removal layer (112, 118) configured for removing heat from said diodes and substantially fully covering a whole main surface of the component carrier; wherein the at least one electrically conductive layer structure comprises a first electrically conductive layer structure which is arranged spaced with regard to an electrically conductive layer as one of the at least one heat removal layer (112, 118) by an electrically insulating and thermally conductive layer as another one of the at least one heat removal layer (112, 118); and wherein the first electrically conductive layer structure comprises a plurality of sections each directly electrically contacting an entire first main surface of a respective one of the plurality of components, and wherein individual ones of the plurality of sections are spaced by electrically insulating spacers, wherein the at least one electrically conductive layer structure comprises a second electrically conductive layer structure which is arranged spaced with regard to the first electrically conductive layer structure at least by the component and one of the at least one electrically insulating layer structure, wherein the second electrically conductive layer structure electrically contacts only a part of a second main surface of the components; and comprising at least one second vertical interconnect structure directly contacting both the first electrically conductive layer structure and the second electrically conductive layer structure.