A method for manufacturing an array for a display device comprising: adhering a positive dry film resist, which has a positive photoresist resin layer over a supporting film, to a substrate such that the photoresist resin layer adheres on a surface of the substrate; releasing the supporting film from the photoresist resin layer adhered to the surface of the substrate; exposing the layer to light; and developing and removing exposed regions in the positive type photoresist resin layer, wherein the positive photoresist resin layer was formed from a composition comprising: a thermosetting resin being an alkali soluble resin, a positive diazide based photosensitive compound, a sensitivity enhancer and a first solvent having a boiling point sufficiently high such that a second solvent can be removed from the composition by heating while the first solvent is substantially retained in the composition, the first solvent has a boiling point of not less than 100°C and the second solvent has a boiling point of less than 100°C and the difference of boiling point between the first solvent and the second solvent is not less than 30°C, the method further comprising baking the positive type photoresist resin layer, the baking being performed either before or after the step of exposing the layer to light. adhering a positive dry film resist, which has a positive photoresist resin layer over a supporting film, to a substrate such that the photoresist resin layer adheres on a surface of the substrate; releasing the supporting film from the photoresist resin layer adhered to the surface of the substrate; exposing the layer to light; and developing and removing exposed regions in the positive type photoresist resin layer, wherein the positive photoresist resin layer was formed from a composition comprising: a thermosetting resin being an alkali soluble resin, a positive diazide based photosensitive compound, a sensitivity enhancer and a first solvent having a boiling point sufficiently high such that a second solvent can be removed from the composition by heating while the first solvent is substantially retained in the composition, the first solvent has a boiling point of not less than 100°C and the second solvent has a boiling point of less than 100°C and the difference of boiling point between the first solvent and the second solvent is not less than 30°C, a thermosetting resin being an alkali soluble resin, a positive diazide based photosensitive compound, a sensitivity enhancer and a first solvent having a boiling point sufficiently high such that a second solvent can be removed from the composition by heating while the first solvent is substantially retained in the composition, the first solvent has a boiling point of not less than 100°C and the second solvent has a boiling point of less than 100°C and the difference of boiling point between the first solvent and the second solvent is not less than 30°C, the method further comprising baking the positive type photoresist resin layer, the baking being performed either before or after the step of exposing the layer to light. baking the positive type photoresist resin layer, the baking being performed either before or after the step of exposing the layer to light.