An inkjet printhead assembly comprising: an ink supply manifold; one or more printhead integrated circuits, each printhead integrated circuit comprising: a silicon substrate; a frontside having at least one CMOS layer comprising drive circuitry and a MEMS layer comprising a plurality of inkjet nozzle assemblies, said CMOS layer being positioned between said silicon substrate and said MEMS layer; a backside attached to said ink supply manifold; and at least one ink supply channel providing fluid communication between said backside and said inkjet nozzle assemblies; and at least one connector film for supplying power to said drive circuitry, wherein a connection end of said connector film is sandwiched between at least part of said ink supply manifold and said one or more printhead integrated circuits; and wherein each printhead integrated circuit comprises a plurality of through-silicon connectors providing electrical connection between said drive circuitry and said connection end of said connector film, each through-silicon connector extending linearly from a contact pad in said MEMS layer, through said CMOS layer and through a whole thickness of the silicon substrate, said contact pad being electrically connected to said CMOS layer. an ink supply manifold; one or more printhead integrated circuits, each printhead integrated circuit comprising: a silicon substrate; a frontside having at least one CMOS layer comprising drive circuitry and a MEMS layer comprising a plurality of inkjet nozzle assemblies, said CMOS layer being positioned between said silicon substrate and said MEMS layer; a backside attached to said ink supply manifold; and at least one ink supply channel providing fluid communication between said backside and said inkjet nozzle assemblies; and at least one connector film for supplying power to said drive circuitry, wherein a connection end of said connector film is sandwiched between at least part of said ink supply manifold and said one or more printhead integrated circuits; and wherein each printhead integrated circuit comprises a plurality of through-silicon connectors providing electrical connection between said drive circuitry and said connection end of said connector film, each through-silicon connector extending linearly from a contact pad in said MEMS layer, through said CMOS layer and through a whole thickness of the silicon substrate, said contact pad being electrically connected to said CMOS layer. a silicon substrate; a frontside having at least one CMOS layer comprising drive circuitry and a MEMS layer comprising a plurality of inkjet nozzle assemblies, said CMOS layer being positioned between said silicon substrate and said MEMS layer; a backside attached to said ink supply manifold; and at least one ink supply channel providing fluid communication between said backside and said inkjet nozzle assemblies; and at least one connector film for supplying power to said drive circuitry, wherein a connection end of said connector film is sandwiched between at least part of said ink supply manifold and said one or more printhead integrated circuits; and wherein each printhead integrated circuit comprises a plurality of through-silicon connectors providing electrical connection between said drive circuitry and said connection end of said connector film, each through-silicon connector extending linearly from a contact pad in said MEMS layer, through said CMOS layer and through a whole thickness of the silicon substrate, said contact pad being electrically connected to said CMOS layer.