A system for aligning an electronic component, comprising: - an apparatus for aligning the electronic component, comprising: - a carrier (2; 102; 202, 203) with an alignment structure (9, 10, 11; 15, 16; 25) for an electronic component, and - an alignment device (14; 17, 18; 26) for aligning the electronic component at the alignment structure (9, 10, 11; 15, 16; 25), wherein the alignment structure (9, 10, 11; 15, 16; 25) defines a first and a second edge (10, 11; 15, 16; 25) which are at an angle to each other and are complementary to two sides of the electronic component to be aligned, which are at the same angle to each other, wherein the alignment device (14; 17, 18; 26) is adapted to align the electronic component at the alignment structure (9, 10, 11; 15, 16; 25) by bringing into contact sides of the electronic component both with the first and the second edge (10, 11; 15, 16; 25) of the alignment structure (9, 10, 11; 15, 16; 25); and - a submission device which is adapted to submit the electronic component at a submission point via the apparatus for aligning the electronic component near the alignment structure (9, 10, 11; 15, 16; 25); and - an accommodation device (6; 7, 8) which is adapted to accommodate the electronic component which is aligned in the apparatus at the alignment structure (9, 10, 11; 15, 16; 25), wherein the submission device is a laser which is adapted to release the electronic component from a carrier tape applied on a wafer by means of heat generation, wherein the carrier tape is a thermal release tape or a UV radiation release tape; the submission point is spaced from the carrier (2; 102; 202, 203) in such a manner that the electronic component can freely fall in between; and the accommodation device is a transfer tool which is adapted to temporarily accommodate the electronic component, or the accommodation device (7, 8) is a substrate which is adapted to permanently accommodate the aligned electronic component, wherein liquid adhesive is provided as a joining agent. - an apparatus for aligning the electronic component, comprising: - a carrier (2; 102; 202, 203) with an alignment structure (9, 10, 11; 15, 16; 25) for an electronic component, and - an alignment device (14; 17, 18; 26) for aligning the electronic component at the alignment structure (9, 10, 11; 15, 16; 25), wherein the alignment structure (9, 10, 11; 15, 16; 25) defines a first and a second edge (10, 11; 15, 16; 25) which are at an angle to each other and are complementary to two sides of the electronic component to be aligned, which are at the same angle to each other, wherein the alignment device (14; 17, 18; 26) is adapted to align the electronic component at the alignment structure (9, 10, 11; 15, 16; 25) by bringing into contact sides of the electronic component both with the first and the second edge (10, 11; 15, 16; 25) of the alignment structure (9, 10, 11; 15, 16; 25); and - a carrier (2; 102; 202, 203) with an alignment structure (9, 10, 11; 15, 16; 25) for an electronic component, and - an alignment device (14; 17, 18; 26) for aligning the electronic component at the alignment structure (9, 10, 11; 15, 16; 25), wherein the alignment structure (9, 10, 11; 15, 16; 25) defines a first and a second edge (10, 11; 15, 16; 25) which are at an angle to each other and are complementary to two sides of the electronic component to be aligned, which are at the same angle to each other, wherein the alignment device (14; 17, 18; 26) is adapted to align the electronic component at the alignment structure (9, 10, 11; 15, 16; 25) by bringing into contact sides of the electronic component both with the first and the second edge (10, 11; 15, 16; 25) of the alignment structure (9, 10, 11; 15, 16; 25); and - a submission device which is adapted to submit the electronic component at a submission point via the apparatus for aligning the electronic component near the alignment structure (9, 10, 11; 15, 16; 25); and - an accommodation device (6; 7, 8) which is adapted to accommodate the electronic component which is aligned in the apparatus at the alignment structure (9, 10, 11; 15, 16; 25), wherein the submission device is a laser which is adapted to release the electronic component from a carrier tape applied on a wafer by means of heat generation, wherein the carrier tape is a thermal release tape or a UV radiation release tape; the submission point is spaced from the carrier (2; 102; 202, 203) in such a manner that the electronic component can freely fall in between; and the accommodation device is a transfer tool which is adapted to temporarily accommodate the electronic component, or the accommodation device (7, 8) is a substrate which is adapted to permanently accommodate the aligned electronic component, wherein liquid adhesive is provided as a joining agent. the submission device is a laser which is adapted to release the electronic component from a carrier tape applied on a wafer by means of heat generation, wherein the carrier tape is a thermal release tape or a UV radiation release tape; the submission point is spaced from the carrier (2; 102; 202, 203) in such a manner that the electronic component can freely fall in between; and the accommodation device is a transfer tool which is adapted to temporarily accommodate the electronic component, or the accommodation device (7, 8) is a substrate which is adapted to permanently accommodate the aligned electronic component, wherein liquid adhesive is provided as a joining agent.