An electrical testing system, comprising: a pressure sensor device; a test chamber, accommodating the pressure sensor device; and a testing equipment, arranged in the test chamber and configured to acquire, at different temperature reference values, output signals from the pressure detection structure of the pressure sensor device, wherein the pressure sensor device comprises: a pressure detection structure provided in a first die of semiconductor material; a package, configured to internally accommodate said pressure detection structure in an impermeable manner, said package comprising a base structure and a body structure, arranged on the base structure, having an access opening in contact with an external environment and internally defining a housing cavity, in which said first die is arranged covered with a coating material; and a heating structure, accommodated in said housing cavity and configured to implement heating of said pressure detection structure from the inside of said package, wherein the testing equipment is configured to adjust the temperature of said pressure detection structure from outside of said package, in cooperation and in conjunction with said heating structure; said testing equipment being further operable to heat from the outside, by heat conduction, the pressure detection structure of the pressure sensor device. a pressure sensor device; a test chamber, accommodating the pressure sensor device; and a testing equipment, arranged in the test chamber and configured to acquire, at different temperature reference values, output signals from the pressure detection structure of the pressure sensor device, wherein the pressure sensor device comprises: a pressure detection structure provided in a first die of semiconductor material; a package, configured to internally accommodate said pressure detection structure in an impermeable manner, said package comprising a base structure and a body structure, arranged on the base structure, having an access opening in contact with an external environment and internally defining a housing cavity, in which said first die is arranged covered with a coating material; and a heating structure, accommodated in said housing cavity and configured to implement heating of said pressure detection structure from the inside of said package, wherein the testing equipment is configured to adjust the temperature of said pressure detection structure from outside of said package, in cooperation and in conjunction with said heating structure; said testing equipment being further operable to heat from the outside, by heat conduction, the pressure detection structure of the pressure sensor device. a pressure detection structure provided in a first die of semiconductor material; a package, configured to internally accommodate said pressure detection structure in an impermeable manner, said package comprising a base structure and a body structure, arranged on the base structure, having an access opening in contact with an external environment and internally defining a housing cavity, in which said first die is arranged covered with a coating material; and a heating structure, accommodated in said housing cavity and configured to implement heating of said pressure detection structure from the inside of said package, wherein the testing equipment is configured to adjust the temperature of said pressure detection structure from outside of said package, in cooperation and in conjunction with said heating structure; said testing equipment being further operable to heat from the outside, by heat conduction, the pressure detection structure of the pressure sensor device.