A method for manufacturing an LED display panel, the LED display panel comprising a plurality of chip-on-board LEDs (2a, 2b, 2c) arranged and mounted on a substrate, the LEDs (2a, 2b, 2c) each comprising a light-emitting surface on a surface opposite a substrate side, and a plurality of light-transmissive members, each light-transmissive member being disposed on the substrate to cover the light-emitting surface of at least one of the LEDs (2a, 2b, 2c), each light-transmissive member being configured to enhance a directionality of outgoing light emitted from the LEDs (2a, 2b, 2c), the method comprising the steps of: (a) preparing the substrate, on which the plurality of LEDs (2a, 2b, 2c) are mounted; and (b) preparing a light-transmissive-member mold with which each light-transmissive member is formed, the light-transmissive-member mold comprising a light-transmissive substrate, and a partition held by the light-transmissive substrate, the partition being held by the light-transmissive substrate in such a manner that the substrate side of each light-transmissive member to be formed is open, the method further comprising the steps of: (c) filling the light-transmissive-member mold with an ultraviolet-curing resin; (d) after the step (c), detecting positions of the LEDs, which are mounted on the substrate, through the light-transmissive substrate and the ultraviolet-curing resin, the detection being performed by a position detecting sensor, so as to align the light-transmissive-member mold and the substrate, on which the plurality of LEDs (2a, 2b, 2c) are mounted, and to bring the light-transmissive-member mold into close contact with the substrate; (e) after the step (d), irradiating the ultraviolet-curing resin with ultraviolet rays through the light-transmissive substrate to cure the ultraviolet-curing resin to form each light-transmissive member on the substrate; and (f) after the step (e), separating the light-transmissive-member mold from each light-transmissive member, further comprising the step of (g) after the step (f), filling, with a light-blocking material, a gap between the light-transmissive members adjacent to each other to form a light-blocking member filled between the adjacent light-transmissive members. a plurality of chip-on-board LEDs (2a, 2b, 2c) arranged and mounted on a substrate, the LEDs (2a, 2b, 2c) each comprising a light-emitting surface on a surface opposite a substrate side, and a plurality of light-transmissive members, each light-transmissive member being disposed on the substrate to cover the light-emitting surface of at least one of the LEDs (2a, 2b, 2c), each light-transmissive member being configured to enhance a directionality of outgoing light emitted from the LEDs (2a, 2b, 2c), (a) preparing the substrate, on which the plurality of LEDs (2a, 2b, 2c) are mounted; and (b) preparing a light-transmissive-member mold with which each light-transmissive member is formed, the light-transmissive-member mold comprising a light-transmissive substrate, and a partition held by the light-transmissive substrate, the partition being held by the light-transmissive substrate in such a manner that the substrate side of each light-transmissive member to be formed is open, a light-transmissive substrate, and a partition held by the light-transmissive substrate, the partition being held by the light-transmissive substrate in such a manner that the substrate side of each light-transmissive member to be formed is open, (c) filling the light-transmissive-member mold with an ultraviolet-curing resin; (d) after the step (c), detecting positions of the LEDs, which are mounted on the substrate, through the light-transmissive substrate and the ultraviolet-curing resin, the detection being performed by a position detecting sensor, so as to align the light-transmissive-member mold and the substrate, on which the plurality of LEDs (2a, 2b, 2c) are mounted, and to bring the light-transmissive-member mold into close contact with the substrate; (e) after the step (d), irradiating the ultraviolet-curing resin with ultraviolet rays through the light-transmissive substrate to cure the ultraviolet-curing resin to form each light-transmissive member on the substrate; and (f) after the step (e), separating the light-transmissive-member mold from each light-transmissive member, further comprising the step of (g) after the step (f), filling, with a light-blocking material, a gap between the light-transmissive members adjacent to each other to form a light-blocking member filled between the adjacent light-transmissive members.