A method for transferring micro-LED, comprising: transferring at least one micro-LED from an original substrate to a support body; transferring the at least one micro-LED from the support body to a backup substrate; and transferring the at least one micro-LED from the backup substrate to a receiving substrate, wherein the original substrate is laser-transparent, characterised in that, the support body is transparent and the step of transferring at least one micro-LED from the original substrate to the support body comprises: mounting the original substrate onto the support body, wherein the micro-LEDs are formed on the original substrate, the support body has light-release adhesive on its surface, and the micro-LEDs are adhered to the support body via the light-release adhesive, irradiating the original substrate with laser from the original substrate side, for selectively lifting-off the at least one micro-LED from the original substrate, and irradiating light from the support body side, to release un-lifted-off micro-LEDs; wherein, the step of transferring the at least one micro-LED from the support body to a backup substrate comprises: bonding the support body with the at least one micro-LED to the backup substrate, and fully irradiating light from the support body side, to release the at least one micro-LED. transferring at least one micro-LED from an original substrate to a support body; transferring the at least one micro-LED from the support body to a backup substrate; and transferring the at least one micro-LED from the backup substrate to a receiving substrate, wherein the original substrate is laser-transparent, characterised in that, the support body is transparent and the step of transferring at least one micro-LED from the original substrate to the support body comprises: mounting the original substrate onto the support body, wherein the micro-LEDs are formed on the original substrate, the support body has light-release adhesive on its surface, and the micro-LEDs are adhered to the support body via the light-release adhesive, irradiating the original substrate with laser from the original substrate side, for selectively lifting-off the at least one micro-LED from the original substrate, and irradiating light from the support body side, to release un-lifted-off micro-LEDs; mounting the original substrate onto the support body, wherein the micro-LEDs are formed on the original substrate, the support body has light-release adhesive on its surface, and the micro-LEDs are adhered to the support body via the light-release adhesive, irradiating the original substrate with laser from the original substrate side, for selectively lifting-off the at least one micro-LED from the original substrate, and irradiating light from the support body side, to release un-lifted-off micro-LEDs; wherein, the step of transferring the at least one micro-LED from the support body to a backup substrate comprises: bonding the support body with the at least one micro-LED to the backup substrate, and fully irradiating light from the support body side, to release the at least one micro-LED. bonding the support body with the at least one micro-LED to the backup substrate, and fully irradiating light from the support body side, to release the at least one micro-LED.