A microfluidic processing device, comprising: a substrate comprising a plurality of N components (100 to 118) arranged in an array of logical rows and logical columns, each of the N components (100 to 118) being electrically connected to a respective current flow directional element (215 to 223) in series, said current flow directional elements (215 to 223) being configured to allow current to flow in essentially only one direction through the N components (100 to 118); a plurality of input/output contacts (224, 227) for connecting the substrate to an external controller, the contacts (224, 227) being assigned to the logical rows and logical columns; a plurality of leads for connecting the contacts (224, 227) to the series connected components (100 to 118) and current flow directional elements (215 to 223), arranged such that each series connected component (100 to 118) and current flow directional element (215 to 223) assigned to the same logical row shares a common lead and contact and is electrically connected to the common contact in parallel, and each series connected component and current flow directional element (215 to 223) assigned to the same logical column shares a common lead and contact and is electrically connected to the common contact in parallel, and wherein the controller can thereby control each of the N components (100 to 118) independently of each other component (100 to 118); a reaction chamber; and a thermally actuated valve; wherein: at least one of the N components (100 to 118) is a resistive heating element in thermal communication with the reaction chamber; at least one of the N components (100 to 118) is a resistive heating element in thermal communication with the thermally actuated valve; when a current passes through the resistive heating element in thermal communication with the reaction chamber from the contact (224, 227) and through the lead assigned to one of the logical row or logical column of the resistive heating element and through the lead and to the contact (224, 227)assigned to the other one of the logical column or logical row of the resistive heating element, the resistive heating element causes heating of the reaction chamber; and when a current passes through the resistive heating element in thermal communication with the thermally actuated valve from the contact (224, 227) and through the lead assigned to one of the logical row or logical column of the resistive heating element and through the lead and to the contact (224, 227) assigned to the other one of the logical column or logical row of the resistive heating element, the resistive heating element causes heating of the thermally actuated valve. a substrate comprising a plurality of N components (100 to 118) arranged in an array of logical rows and logical columns, each of the N components (100 to 118) being electrically connected to a respective current flow directional element (215 to 223) in series, said current flow directional elements (215 to 223) being configured to allow current to flow in essentially only one direction through the N components (100 to 118); a plurality of input/output contacts (224, 227) for connecting the substrate to an external controller, the contacts (224, 227) being assigned to the logical rows and logical columns; a plurality of leads for connecting the contacts (224, 227) to the series connected components (100 to 118) and current flow directional elements (215 to 223), arranged such that each series connected component (100 to 118) and current flow directional element (215 to 223) assigned to the same logical row shares a common lead and contact and is electrically connected to the common contact in parallel, and each series connected component and current flow directional element (215 to 223) assigned to the same logical column shares a common lead and contact and is electrically connected to the common contact in parallel, and wherein the controller can thereby control each of the N components (100 to 118) independently of each other component (100 to 118); a reaction chamber; and a thermally actuated valve; at least one of the N components (100 to 118) is a resistive heating element in thermal communication with the reaction chamber; at least one of the N components (100 to 118) is a resistive heating element in thermal communication with the thermally actuated valve; when a current passes through the resistive heating element in thermal communication with the reaction chamber from the contact (224, 227) and through the lead assigned to one of the logical row or logical column of the resistive heating element and through the lead and to the contact (224, 227)assigned to the other one of the logical column or logical row of the resistive heating element, the resistive heating element causes heating of the reaction chamber; and when a current passes through the resistive heating element in thermal communication with the thermally actuated valve from the contact (224, 227) and through the lead assigned to one of the logical row or logical column of the resistive heating element and through the lead and to the contact (224, 227) assigned to the other one of the logical column or logical row of the resistive heating element, the resistive heating element causes heating of the thermally actuated valve.