A manufacturing method for manufacturing a molded circuit board assembly (10; 920) of a camera module, comprising the steps of: (a) transporting at least one substrate board array with at least one substrate board to a position between an upper mould (363; 9101) and a lower mould (364; 9102) of a manufacturing equipment; (b) forming a molding cavity (3600; 9103) after closing said upper mould with said lower mould in a closed-mould state, wherein said molding cavity provides at least one supporting frame forming groove and at least one light window forming element is provided in said molding cavity; (c) filling a molding material into said molding cavity; and (d) solidifying said molding material within said molding cavity to form at least one module supporting frame (12; 923) which is molded on said substrate board to form said molded circuit board assembly of said camera module, wherein said module supporting frame is formed at a position corresponding to said supporting frame forming groove, wherein said module supporting frame has at least one light window formed corresponding to said light window forming element; characterized in that before the step (a), the method comprises: - a step of providing the substrate board array with at least one substrate board, wherein each of the substrate boards comprises a circuit board (112; 9212) and one or more integral circuit electronic components (113; 9215) and a photosensitive element (111; 9211) electrically connected to the circuit board; and - a step of providing a molding unit comprising upper mould and lower mould, wherein the molding unit further comprises a separating element provided in the upper mould or lower mould, which separating element extends in the molding cavity formed by the upper mould and the lower mould in the closed-mould state; in the step (b), the separating element is overlappedly attached to an upper side of the photosensitive element to seal the photosensitive element, wherein the separating element comprises a main separating body and an inclined side portion integrally formed at a side portion of the main separating body, and the separating element further comprises an extension portion integrally formed at a bottom side of the main separating body and extending from the inclined side portion, wherein the extension portion is sealedly overlapped with the photosensitive element to seal at least a photosensitive region of the photosensitive element; in the step (c), the separating element prevents the molding material flowing into the photosensitive element. (a) transporting at least one substrate board array with at least one substrate board to a position between an upper mould (363; 9101) and a lower mould (364; 9102) of a manufacturing equipment; (b) forming a molding cavity (3600; 9103) after closing said upper mould with said lower mould in a closed-mould state, wherein said molding cavity provides at least one supporting frame forming groove and at least one light window forming element is provided in said molding cavity; (c) filling a molding material into said molding cavity; and (d) solidifying said molding material within said molding cavity to form at least one module supporting frame (12; 923) which is molded on said substrate board to form said molded circuit board assembly of said camera module, wherein said module supporting frame is formed at a position corresponding to said supporting frame forming groove, wherein said module supporting frame has at least one light window formed corresponding to said light window forming element; before the step (a), the method comprises: - a step of providing the substrate board array with at least one substrate board, wherein each of the substrate boards comprises a circuit board (112; 9212) and one or more integral circuit electronic components (113; 9215) and a photosensitive element (111; 9211) electrically connected to the circuit board; and - a step of providing a molding unit comprising upper mould and lower mould, wherein the molding unit further comprises a separating element provided in the upper mould or lower mould, which separating element extends in the molding cavity formed by the upper mould and the lower mould in the closed-mould state; - a step of providing the substrate board array with at least one substrate board, wherein each of the substrate boards comprises a circuit board (112; 9212) and one or more integral circuit electronic components (113; 9215) and a photosensitive element (111; 9211) electrically connected to the circuit board; and - a step of providing a molding unit comprising upper mould and lower mould, wherein the molding unit further comprises a separating element provided in the upper mould or lower mould, which separating element extends in the molding cavity formed by the upper mould and the lower mould in the closed-mould state; in the step (b), the separating element is overlappedly attached to an upper side of the photosensitive element to seal the photosensitive element, wherein the separating element comprises a main separating body and an inclined side portion integrally formed at a side portion of the main separating body, and the separating element further comprises an extension portion integrally formed at a bottom side of the main separating body and extending from the inclined side portion, wherein the extension portion is sealedly overlapped with the photosensitive element to seal at least a photosensitive region of the photosensitive element; in the step (c), the separating element prevents the molding material flowing into the photosensitive element.