An interconnection structure used in an electronic device, comprising a chassis, a first line board, a heat dissipation component, and one or more second line boards, wherein the heat dissipation component is disposed on a first side surface of the chassis, the first side surface comprises a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface comprises a second opening; - wherein the interconnection structure used in the electronic device comprises one second line board, and first line boards comprise one group of switch fabric units, SFUs, and one group of line processing units, LPUs; and the group of SFUs is vertically inserted onto a first side surface of the second line board, the group of LPUs is vertically inserted onto a second side surface of the second line board, the first side surface and the second side surface of the second line board are two opposite side surfaces, and the first side surface and the second side surface of the second line board are perpendicular to the first side surface and the second side surface of the chassis; or - wherein the interconnection structure used in the electronic device comprises at least two second line boards, and first line boards comprise at least one group of SFUs and two groups of LPUs; and each of the at least one group of SFUs is inserted between two of the at least two second line boards, and each of the two groups of LPUs is inserted onto an outer side of one of the at least two second line boards. the heat dissipation component is disposed on a first side surface of the chassis, the first side surface comprises a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface comprises a second opening; - wherein the interconnection structure used in the electronic device comprises one second line board, and first line boards comprise one group of switch fabric units, SFUs, and one group of line processing units, LPUs; and - wherein the interconnection structure used in the electronic device comprises one second line board, and first line boards comprise one group of switch fabric units, SFUs, and one group of line processing units, LPUs; and the group of SFUs is vertically inserted onto a first side surface of the second line board, the group of LPUs is vertically inserted onto a second side surface of the second line board, the first side surface and the second side surface of the second line board are two opposite side surfaces, and the first side surface and the second side surface of the second line board are perpendicular to the first side surface and the second side surface of the chassis; or - wherein the interconnection structure used in the electronic device comprises at least two second line boards, and first line boards comprise at least one group of SFUs and two groups of LPUs; and - wherein the interconnection structure used in the electronic device comprises at least two second line boards, and first line boards comprise at least one group of SFUs and two groups of LPUs; and each of the at least one group of SFUs is inserted between two of the at least two second line boards, and each of the two groups of LPUs is inserted onto an outer side of one of the at least two second line boards.