Integrated multilayer structure (100, 500, 900, 1000, 1400, 1900, 2000), comprising a flexible substrate film having a first side and an opposite second side, said substrate film comprising electrically substantially insulating material, wherein the substrate film exhibits at least locally an essentially three-dimensional shape, a circuit design comprising a number of electrically conductive areas (106, 306) of electrically conductive material on said first and/or second sides (102A, 102B) of the substrate film, characterized in that the integrated multilayer structure (100, 500, 900, 1000, 1400, 1900, 2000) comprises a connector (110, 210, 710, 1110, 1610, 1910, 2010, 2610) comprising an electrically insulating body member (111, 711) accommodating a number of electrically conductive contact elements (118, 118B, 118C, 2110A, 2110B, 2110C, 2210A, 2210B, 2310A, 2310B, 2510A, 2510B), said connector being provided to the substrate film so that the body member (111, 711) and the contact elements (118, 118B, 118C, 2110A, 2110B, 2110C, 2210A, 2210B, 2310A, 2310B, 2510A, 2510B) accommodated therein extend through the substrate film to both said first and second sides (102A, 102B) of said substrate film and said number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on said first or second side of or adjacent to the substrate film, and at least one plastic layer (104, 105) molded onto said first and/or second side (102A, 102B) of the substrate film so as to fully embed a portion of the body member (111, 711) of the connector that is on a side of the substrate facing away from an opposing connection side of the external connecting element, and enhance securing of the connector (110, 210, 710, 1110, 1610, 1910, 2010, 2610) to the substrate film. a flexible substrate film having a first side and an opposite second side, said substrate film comprising electrically substantially insulating material, wherein the substrate film exhibits at least locally an essentially three-dimensional shape, a circuit design comprising a number of electrically conductive areas (106, 306) of electrically conductive material on said first and/or second sides (102A, 102B) of the substrate film, characterized in that the integrated multilayer structure (100, 500, 900, 1000, 1400, 1900, 2000) comprises a connector (110, 210, 710, 1110, 1610, 1910, 2010, 2610) comprising an electrically insulating body member (111, 711) accommodating a number of electrically conductive contact elements (118, 118B, 118C, 2110A, 2110B, 2110C, 2210A, 2210B, 2310A, 2310B, 2510A, 2510B), said connector being provided to the substrate film so that the body member (111, 711) and the contact elements (118, 118B, 118C, 2110A, 2110B, 2110C, 2210A, 2210B, 2310A, 2310B, 2510A, 2510B) accommodated therein extend through the substrate film to both said first and second sides (102A, 102B) of said substrate film and said number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on said first or second side of or adjacent to the substrate film, and at least one plastic layer (104, 105) molded onto said first and/or second side (102A, 102B) of the substrate film so as to fully embed a portion of the body member (111, 711) of the connector that is on a side of the substrate facing away from an opposing connection side of the external connecting element, and enhance securing of the connector (110, 210, 710, 1110, 1610, 1910, 2010, 2610) to the substrate film.