A method for manufacturing a power interface, comprising: T10: providing a pin workblank, and disposing the pin workblank on a first mold; and T20: performing a punching shear process for the pin workblank by a second mold, thereby forming a power pin of the power interface without a process of removing burrs; characterized in that, after forming a plurality of power pins each manufactured by the steps T10∼T20, the method further comprises: embedding the plurality of power pins into a connection body having a first connection surface and a second connection surface opposite to the first connection surface; wherein each of the plurality of power pins is solid, and comprises a first sidewall surface and a second sidewall surface opposite to the first sidewall surface; the first sidewall surface and the second sidewall surface of each of the power pins extend beyond and are exposed outside the connection body, the first sidewall surface is configured as a part of the first connection surface, and the second sidewall surface is configured as a part of the second connection surface; wherein the connection body further comprises a hard frame and a plastic encapsulation portion, and the step of embedding the plurality of power pins into the connection body comprises: arranging the plurality of the power pins into a plurality of receiving grooves of the hard frame respectively; and wrapping the plurality of the power pins and the hard frame by the plastic encapsulation portion, wherein the first sidewall surface and the second sidewall surface of each of the power pins are exposed outside the plastic encapsulation portion. T10: providing a pin workblank, and disposing the pin workblank on a first mold; and T20: performing a punching shear process for the pin workblank by a second mold, thereby forming a power pin of the power interface without a process of removing burrs; characterized in that, after forming a plurality of power pins each manufactured by the steps T10∼T20, the method further comprises: embedding the plurality of power pins into a connection body having a first connection surface and a second connection surface opposite to the first connection surface; wherein each of the plurality of power pins is solid, and comprises a first sidewall surface and a second sidewall surface opposite to the first sidewall surface; the first sidewall surface and the second sidewall surface of each of the power pins extend beyond and are exposed outside the connection body, the first sidewall surface is configured as a part of the first connection surface, and the second sidewall surface is configured as a part of the second connection surface; wherein the connection body further comprises a hard frame and a plastic encapsulation portion, and the step of embedding the plurality of power pins into the connection body comprises: arranging the plurality of the power pins into a plurality of receiving grooves of the hard frame respectively; and wrapping the plurality of the power pins and the hard frame by the plastic encapsulation portion, wherein the first sidewall surface and the second sidewall surface of each of the power pins are exposed outside the plastic encapsulation portion. embedding the plurality of power pins into a connection body having a first connection surface and a second connection surface opposite to the first connection surface; wherein each of the plurality of power pins is solid, and comprises a first sidewall surface and a second sidewall surface opposite to the first sidewall surface; the first sidewall surface and the second sidewall surface of each of the power pins extend beyond and are exposed outside the connection body, the first sidewall surface is configured as a part of the first connection surface, and the second sidewall surface is configured as a part of the second connection surface; wherein the connection body further comprises a hard frame and a plastic encapsulation portion, and the step of embedding the plurality of power pins into the connection body comprises: arranging the plurality of the power pins into a plurality of receiving grooves of the hard frame respectively; and wrapping the plurality of the power pins and the hard frame by the plastic encapsulation portion, wherein the first sidewall surface and the second sidewall surface of each of the power pins are exposed outside the plastic encapsulation portion. arranging the plurality of the power pins into a plurality of receiving grooves of the hard frame respectively; and wrapping the plurality of the power pins and the hard frame by the plastic encapsulation portion, wherein the first sidewall surface and the second sidewall surface of each of the power pins are exposed outside the plastic encapsulation portion.