An inspection device configured to be provided in a mounter that is configured to pick up components supplied by a component supply device and mount the components on a circuit board, the inspection device comprising: a holding table capable of holding a component; a pair of measuring elements (34, 36) capable of moving towards and away from each other and capable of measuring electrical characteristics of a component by gripping the component; a holding table moving device that is configured to move the holding table; a holding table movement control device that is configured to control the holding table moving device, wherein the holding table movement control device includes a measurement control section that is configured to, from a clamping state in which the pair of measuring elements (34, 36) grips the component held on the holding table, separate the holding table from the component by at least a set value, thus changing to a measurement state in which it is possible to measure electrical characteristics of the component, wherein the pair of measuring elements (34, 36) include a pair of opposing surfaces (34f, 36f) that oppose each other and that can contact the component, the component is held by the pair of opposing surfaces (34f, 36f) moving closer to each other, the component is released by the pair of opposing surfaces (34f, 36f) moving away from each other, and the holding table moving device includes a discard control section that changes from the measurement state to a discard state in which the component is caused to drop off from the pair of opposing surfaces (34f, 36f) and the holding table is not below the space between the pair of opposing surfaces (34f, 36f) that have been separated from each other, by moving the holding table. a holding table capable of holding a component; a pair of measuring elements (34, 36) capable of moving towards and away from each other and capable of measuring electrical characteristics of a component by gripping the component; a holding table moving device that is configured to move the holding table; a holding table movement control device that is configured to control the holding table moving device, wherein the holding table movement control device includes a measurement control section that is configured to, from a clamping state in which the pair of measuring elements (34, 36) grips the component held on the holding table, separate the holding table from the component by at least a set value, thus changing to a measurement state in which it is possible to measure electrical characteristics of the component, wherein the pair of measuring elements (34, 36) include a pair of opposing surfaces (34f, 36f) that oppose each other and that can contact the component, the component is held by the pair of opposing surfaces (34f, 36f) moving closer to each other, the component is released by the pair of opposing surfaces (34f, 36f) moving away from each other, and the holding table moving device includes a discard control section that changes from the measurement state to a discard state in which the component is caused to drop off from the pair of opposing surfaces (34f, 36f) and the holding table is not below the space between the pair of opposing surfaces (34f, 36f) that have been separated from each other, by moving the holding table.