An inkjet head comprising: a head chip in which a nozzle board including a plurality of nozzles, each of the nozzles discharging an ink, an intermediate plate provided at an opposite side to a discharge surface to which the ink is discharged through the nozzle of the nozzle board, and allowing the nozzle and a pressure chamber that pressurizes the ink discharged through the nozzle to communicate into each other, a pressure chamber board including the pressure chamber, a spacer board provided with a piezoelectric element for pressurizing the ink in the pressure chamber, and including a passage communicating into the pressure chamber, and a wiring board provided with an ink inflow port at an opposite side to a side being in contact with the spacer board, and allowing the ink inflow port and the passage of the spacer board to communicate into each other are joined in order; and a common ink chamber forming member forming at least a part of a common ink chamber provided at a side of the wiring board of the head chip, characterized by a heater (531, 532) provided to the common ink chamber forming member, wherein the nozzle board is formed smaller than the intermediate plate when the head chip is viewed from a side of the nozzle board in plan view, a thermal conductive member provided in contact with the heater (531, 532), and joined with at least a part of the nozzle board and a part of the wiring board across the head chip, the wiring board and the common ink chamber forming member are joined with each other through the thermal conductive member to form the common ink chamber, and the thermal conductive member is joined with a side surface of the nozzle board, and at least a region of the intermediate plate at a side of the nozzle board, the region being formed larger than the nozzle board when the head chip is viewed from the side of the nozzle board in plan view, and the thermal conductive member includes a heat transfer plate provided in contact with the heater (531, 532), a holding member being in contact with the heat transfer plate, and joined between the common ink chamber forming member and the wiring board to form the common ink chamber together with the common ink chamber forming member and the wiring board, and a top plate member joined with the holding member, and joined with at least a region of the intermediate plate at the side of the nozzle board, the region being formed larger than the nozzle board. a head chip in which a nozzle board including a plurality of nozzles, each of the nozzles discharging an ink, an intermediate plate provided at an opposite side to a discharge surface to which the ink is discharged through the nozzle of the nozzle board, and allowing the nozzle and a pressure chamber that pressurizes the ink discharged through the nozzle to communicate into each other, a pressure chamber board including the pressure chamber, a spacer board provided with a piezoelectric element for pressurizing the ink in the pressure chamber, and including a passage communicating into the pressure chamber, and a wiring board provided with an ink inflow port at an opposite side to a side being in contact with the spacer board, and allowing the ink inflow port and the passage of the spacer board to communicate into each other are joined in order; and a common ink chamber forming member forming at least a part of a common ink chamber provided at a side of the wiring board of the head chip, characterized by a heater (531, 532) provided to the common ink chamber forming member, wherein the nozzle board is formed smaller than the intermediate plate when the head chip is viewed from a side of the nozzle board in plan view, a thermal conductive member provided in contact with the heater (531, 532), and joined with at least a part of the nozzle board and a part of the wiring board across the head chip, the wiring board and the common ink chamber forming member are joined with each other through the thermal conductive member to form the common ink chamber, and the thermal conductive member is joined with a side surface of the nozzle board, and at least a region of the intermediate plate at a side of the nozzle board, the region being formed larger than the nozzle board when the head chip is viewed from the side of the nozzle board in plan view, and the thermal conductive member includes a heat transfer plate provided in contact with the heater (531, 532), a holding member being in contact with the heat transfer plate, and joined between the common ink chamber forming member and the wiring board to form the common ink chamber together with the common ink chamber forming member and the wiring board, and a top plate member joined with the holding member, and joined with at least a region of the intermediate plate at the side of the nozzle board, the region being formed larger than the nozzle board.