A method of managing a DLTS measurement apparatus, wherein the DLTS measurement apparatus comprises: a sample stage which has a measurement target sample placement surface and on which a measurement target sample is placed; a first wiring having a tip contacting or being in contact with the measurement target sample; characterized in that the target sample has a semiconductor junction on one surface of a semiconductor sample and an ohmic layer on the other surface and is placed such that the ohmic layer and the measurement target sample placement surface face each other, in that the DLTS measurement apparatus comprises a second wiring having a tip contacting or being in contact with the sample stage; and in that the method comprises: determining whether or not a measurement value measured by the DLTS measurement apparatus is in a preliminarily set allowable range; and performing maintenance processing of exchanging or repairing at least one of a whole or a part of the sample stage, a whole or a part of the first wiring, and a whole or a part of the second wiring, in a case where the measurement value is outside the preliminarily set allowable range as a result of the determination, wherein the maintenance processing comprises subjecting the measurement target sample placement surface of the sample stage and/or a part of the second wiring including the tip to conductive covering film formation processing. a sample stage which has a measurement target sample placement surface and on which a measurement target sample is placed; a first wiring having a tip contacting or being in contact with the measurement target sample; characterized in that the target sample has a semiconductor junction on one surface of a semiconductor sample and an ohmic layer on the other surface and is placed such that the ohmic layer and the measurement target sample placement surface face each other, in that the DLTS measurement apparatus comprises a second wiring having a tip contacting or being in contact with the sample stage; and in that the method comprises: determining whether or not a measurement value measured by the DLTS measurement apparatus is in a preliminarily set allowable range; and performing maintenance processing of exchanging or repairing at least one of a whole or a part of the sample stage, a whole or a part of the first wiring, and a whole or a part of the second wiring, in a case where the measurement value is outside the preliminarily set allowable range as a result of the determination, wherein the maintenance processing comprises subjecting the measurement target sample placement surface of the sample stage and/or a part of the second wiring including the tip to conductive covering film formation processing. determining whether or not a measurement value measured by the DLTS measurement apparatus is in a preliminarily set allowable range; and performing maintenance processing of exchanging or repairing at least one of a whole or a part of the sample stage, a whole or a part of the first wiring, and a whole or a part of the second wiring, in a case where the measurement value is outside the preliminarily set allowable range as a result of the determination, wherein the maintenance processing comprises subjecting the measurement target sample placement surface of the sample stage and/or a part of the second wiring including the tip to conductive covering film formation processing.