Method for fabricating at least one three-dimensional solid-state layer, in particular for use as wafer, and/or at least one three-dimensional solid-state body comprising the following steps: providing a workpiece for detaching the at least one solid-state layer and/or the at least one solid-state body, wherein the workpiece has a first planar surface portion and a second planar surface portion, wherein the first planar surface portion is aligned substantially or exactly parallel to the second planar surface portion, wherein the workpiece has at least one exposed surface, wherein the exposed surface is formed by the second planar surface portion, producing defects by means of laser beams of a laser within the workpiece, wherein the laser beams penetrate into the solid-state body via the second planar surface portion, wherein the defects predefine at least one crack guiding layer, wherein the crack guiding layer describes at least one three-dimensional contour, attaching or producing a receiving layer at the exposed surface of the workpiece to form a composite structure, regulating the temperature of the receiving layer in order to produce stresses within the workpiece, wherein the stresses cause crack propagation within the workpiece, wherein, as a result of the crack propagation, a three-dimensional solid-state layer or a three-dimensional solid-state body is separated from the workpiece along the crack guiding layer, wherein a surface of the solid-state layer or of the solid-state body corresponds to the three-dimensional contour of the crack guiding layer, wherein the shape of the crack guiding layer has, at least in sections, the contour of a three-dimensionally predetermined object resulting from a mathematically determinable shaped body, in particular of a lens or of a parallelepiped. providing a workpiece for detaching the at least one solid-state layer and/or the at least one solid-state body, wherein the workpiece has a first planar surface portion and a second planar surface portion, wherein the first planar surface portion is aligned substantially or exactly parallel to the second planar surface portion, wherein the workpiece has at least one exposed surface, wherein the exposed surface is formed by the second planar surface portion, producing defects by means of laser beams of a laser within the workpiece, wherein the laser beams penetrate into the solid-state body via the second planar surface portion, wherein the defects predefine at least one crack guiding layer, wherein the crack guiding layer describes at least one three-dimensional contour, attaching or producing a receiving layer at the exposed surface of the workpiece to form a composite structure, regulating the temperature of the receiving layer in order to produce stresses within the workpiece, wherein the stresses cause crack propagation within the workpiece, wherein, as a result of the crack propagation, a three-dimensional solid-state layer or a three-dimensional solid-state body is separated from the workpiece along the crack guiding layer, wherein a surface of the solid-state layer or of the solid-state body corresponds to the three-dimensional contour of the crack guiding layer, wherein the shape of the crack guiding layer has, at least in sections, the contour of a three-dimensionally predetermined object resulting from a mathematically determinable shaped body, in particular of a lens or of a parallelepiped.