A method of manufacturing an emissive screen comprising three-dimensional LEDs, comprising the steps of: a) depositing a first metal layer on a surface of a control circuit comprising a plurality of metal connection pads (203, 205), the first metal layer extending all over the surface of the control circuit and being electrically connected to the metal connection pads (203, 205) of the control circuit; b) depositing a second metal layer on a surface of an optoelectronic circuit comprising first emission cells capable of emitting an electromagnetic radiation at a first wavelength and second emission cells capable of emitting an electromagnetic radiation at a second wavelength different from the first wavelength, each first emission cell comprising one of a plurality of LEDs, each formed of a three-dimensional semiconductor element (109R, 113R), the second metal layer extending over a surface of the optoelectronic circuit and being electrically connected to a first end of each three-dimensional semiconductor element of the optoelectronic circuit; c) bonding the optoelectronic circuit to the control circuit by direct bonding of the second metal layer to the first metal layer, by aligning the optoelectronic circuit with respect to the control circuit so that the different emission cells (101R, 101G) of the optoelectronic circuit are arranged opposite different metal connection pads of the control circuit; and d) forming, from the surface of the optoelectronic circuit opposite to the control circuit, trenches laterally delimiting each emission cell (101R, 101G) of the optoelectronic circuit, the trenches crossing the second and first metal layers so that the different elementary emission cells (101R, 101G) are connected to different metal connection pads of the control circuit, the method further comprising the forming of lateral insulating walls in the trenches, the lateral insulating walls comprising an insulating layer coating the lateral walls and the bottom of the trenches, and a central conductive wall. a) depositing a first metal layer on a surface of a control circuit comprising a plurality of metal connection pads (203, 205), the first metal layer extending all over the surface of the control circuit and being electrically connected to the metal connection pads (203, 205) of the control circuit; b) depositing a second metal layer on a surface of an optoelectronic circuit comprising first emission cells capable of emitting an electromagnetic radiation at a first wavelength and second emission cells capable of emitting an electromagnetic radiation at a second wavelength different from the first wavelength, each first emission cell comprising one of a plurality of LEDs, each formed of a three-dimensional semiconductor element (109R, 113R), the second metal layer extending over a surface of the optoelectronic circuit and being electrically connected to a first end of each three-dimensional semiconductor element of the optoelectronic circuit; c) bonding the optoelectronic circuit to the control circuit by direct bonding of the second metal layer to the first metal layer, by aligning the optoelectronic circuit with respect to the control circuit so that the different emission cells (101R, 101G) of the optoelectronic circuit are arranged opposite different metal connection pads of the control circuit; and d) forming, from the surface of the optoelectronic circuit opposite to the control circuit, trenches laterally delimiting each emission cell (101R, 101G) of the optoelectronic circuit, the trenches crossing the second and first metal layers so that the different elementary emission cells (101R, 101G) are connected to different metal connection pads of the control circuit, the method further comprising the forming of lateral insulating walls in the trenches, the lateral insulating walls comprising an insulating layer coating the lateral walls and the bottom of the trenches, and a central conductive wall.