Method for producing an optoelectronic device with a radiation-receiving or radiation-emitting semiconductor chip which is mounted to or on a base part and is connected with at least two electrode terminals (2, 3) of an electrically conductive terminal material serving in electrical contacting of the device, wherein - the electrode terminals are formed by a patterned, thin coating deposited on the outer surfaces of the base part, - the base part is a plastics base part, into which a heat sink of thermally conductive material has been incorporated, - the heat sink is situated in thermal contact with the semiconductor chip, - a first electrode terminal of the electrode terminals (2, 3) extends from a portion on a top of the base part facing the semiconductor chip over peripheral portions as far as portions on the bottom of the base part, a second electrode terminal of the electrode terminals (2, 3) extends from the top of the base part facing the semiconductor chip over peripheral portions of the base part as far as the bottom of the base part, and the semiconductor chip is mounted on the portion on the top of the first electrode terminal, - the base part is coated with the thin coating of the electrically conductive terminal material by chemical deposition from a liquid without the action of an external electric current flow, - the thin coating on the base part is patterned, resulting in the fabrication of individual, electrically mutually insulated regions (18, 19) of the coating, - a further thin layer of an auxiliary material is deposited selectively on a number of predetermined ones of the accordingly fabricated regions of the thin coating by electrodeposition under the action of an external electric current flow, whereby the layer thickness of these predetermined regions of the coating is increased, - the regions of the base part coating not of increased thickness are selectively removed by etching, and - a plurality of optoelectronic devices are fabricated simultaneously, and in each case a lens is applied, wherein to fabricate the lenses a mold plate is used to cast the lenses which is configured such that the individual lens molds, which form the bodies of the lenses, are connected together, such that on casting of the lenses leveling of the casting compound may take place, singulation into the optoelectronic devices proceeding thereafter. - the electrode terminals are formed by a patterned, thin coating deposited on the outer surfaces of the base part, - the base part is a plastics base part, into which a heat sink of thermally conductive material has been incorporated, - the heat sink is situated in thermal contact with the semiconductor chip, - a first electrode terminal of the electrode terminals (2, 3) extends from a portion on a top of the base part facing the semiconductor chip over peripheral portions as far as portions on the bottom of the base part, a second electrode terminal of the electrode terminals (2, 3) extends from the top of the base part facing the semiconductor chip over peripheral portions of the base part as far as the bottom of the base part, and the semiconductor chip is mounted on the portion on the top of the first electrode terminal, - the base part is coated with the thin coating of the electrically conductive terminal material by chemical deposition from a liquid without the action of an external electric current flow, - the thin coating on the base part is patterned, resulting in the fabrication of individual, electrically mutually insulated regions (18, 19) of the coating, - a further thin layer of an auxiliary material is deposited selectively on a number of predetermined ones of the accordingly fabricated regions of the thin coating by electrodeposition under the action of an external electric current flow, whereby the layer thickness of these predetermined regions of the coating is increased, - the regions of the base part coating not of increased thickness are selectively removed by etching, and - a plurality of optoelectronic devices are fabricated simultaneously, and in each case a lens is applied, wherein to fabricate the lenses a mold plate is used to cast the lenses which is configured such that the individual lens molds, which form the bodies of the lenses, are connected together, such that on casting of the lenses leveling of the casting compound may take place, singulation into the optoelectronic devices proceeding thereafter.