mhurhangee/ep-ind-claims huggingface dataset:
A method of Czochralski growth of a silicon ingot comprising a dopant material in a concentration C and having a segregation coefficient of k, the method comprising the steps of: i) providing a crucible having an inner growth zone in fluid communication with an outer feed zone; ii) pre-charging the inner growth zone with silicon and the dopant material to form a mixture, wherein the mixture, when melted, has a concentration of the dopant material of C / k; iii) melting the mixture; iv) prior to initiating growth of the first silicon ingot, pre-charging the outer feed zone with silicon and the dopant material in a concentration of C, when melted v) initiating growth of the silicon ingot from the inner growth zone; vi) delivering a solid feed of silicon and the dopant material into the outer feed zone while growing the silicon ingot, the feed having an average concentration of the dopant material C when melted; and vii) removing the silicon ingot comprising the dopant material in concentration C. i) providing a crucible having an inner growth zone in fluid communication with an outer feed zone; ii) pre-charging the inner growth zone with silicon and the dopant material to form a mixture, wherein the mixture, when melted, has a concentration of the dopant material of C / k; iii) melting the mixture; iv) prior to initiating growth of the first silicon ingot, pre-charging the outer feed zone with silicon and the dopant material in a concentration of C, when melted v) initiating growth of the silicon ingot from the inner growth zone; vi) delivering a solid feed of silicon and the dopant material into the outer feed zone while growing the silicon ingot, the feed having an average concentration of the dopant material C when melted; and vii) removing the silicon ingot comprising the dopant material in concentration C.
A master batch comprising: 40 to 90% by mass of at least one thermoplastic resin selected from the group consisting of polycarbonate, polyester, polyarylene sulfide, polyamide, polyoxymethylene, polyether imide, polyether sulfone, polyether ketone, polyether ether ketone and polyether ketone ketone as the component; and 10 to 60% by mass of a polycarbodiimide compound having two or more carbodiimide groups in one molecule as the component (B'), the master batch having a morphology of a sea-island structure in which the component (B') is dispersed in the component, and the average particle size of the dispersed particles of the component (B') is 1 to 100 μm, wherein the average particle size of the dispersed particles of the component (B') is measured as outlined in the specification.
A method for metal plating which is characterized in that the method comprises treating an article to be plated with a pretreatment agent containing a silane coupling agent having a metal-capturing functional group in its molecule which is the reaction product of a nitrogen-containing azole compound and an epoxysilane, a precious metal compound as a high activity catalyst, and a reducing agent, wherein the metal-capturing functional group is a nitrogen-containing heterocyclic azole, and then performing electroless plating.
A solid state light emitting device, comprising: a light emitting stack of a plurality of semiconductor layers; a metallization disposed directly on the light emitting stack including at least one metallization layer (32,34,36) and comprising a guard layer of metal, wherein the guard layer is a Ti layer, TiW layer, TiN layer or a TiW/TiW:N/TiW multilayer; a dielectric layer on the guard layer of the metallization; a plurality of stress-relief elements (62,64) and/or anchor elements (66,68) in an edge region of the metallization and/or dielectric layer, the edge region being the region of the solid state light emitting device adjacent to the edge of the solid state light emitting device, wherein the stress-relief elements (62, 64) are formed by regions of increased thickness or reduced thickness in the guard layer, characterized in that holes in the guard layer in the edge region form at least some of the stress relief elements; and/or the metallization comprises: an ohmic contact layer on the light emitting stack having through holes; and the guard layer over the ohmic contact layer extending into the through holes as the anchor elements for anchoring the guard layer; and/or the metallization comprises an ohmic contact layer on the light emitting stack and extending into anchor trenches extending into the light emitting stack as the anchor elements for anchoring the ohmic contact layer. a light emitting stack of a plurality of semiconductor layers; a metallization disposed directly on the light emitting stack including at least one metallization layer (32,34,36) and comprising a guard layer of metal, wherein the guard layer is a Ti layer, TiW layer, TiN layer or a TiW/TiW:N/TiW multilayer; a dielectric layer on the guard layer of the metallization; a plurality of stress-relief elements (62,64) and/or anchor elements (66,68) in an edge region of the metallization and/or dielectric layer, the edge region being the region of the solid state light emitting device adjacent to the edge of the solid state light emitting device, wherein the stress-relief elements (62, 64) are formed by regions of increased thickness or reduced thickness in the guard layer, characterized in that holes in the guard layer in the edge region form at least some of the stress relief elements; and/or the metallization comprises: an ohmic contact layer on the light emitting stack having through holes; and the guard layer over the ohmic contact layer extending into the through holes as the anchor elements for anchoring the guard layer; and/or an ohmic contact layer on the light emitting stack having through holes; and the guard layer over the ohmic contact layer extending into the through holes as the anchor elements for anchoring the guard layer; and/or the metallization comprises an ohmic contact layer on the light emitting stack and extending into anchor trenches extending into the light emitting stack as the anchor elements for anchoring the ohmic contact layer.
A surgical device, comprising: a housing; a closure actuator coupled to the housing and configured to pivot with respect to the housing; an elongate shaft extending distally from the housing, the elongate shaft having a loading zone located at a distal end of the elongate shaft, the loading zone being configured to receive an end effector; and a locking member operably coupled to one or more actuation components disposed within the housing, the one or more actuation components also being coupled to the closure actuator such that movement of the locking member effects movement of the closure actuator, characterised in that the locking member is configured to move to a load position which causes the closure actuator to move to a fixed location with respect to the housing, wherein when the locking member is in the load position the closure actuator is held at the fixed location with respect to the housing such that an end effector can be loaded onto the distal end of the elongate shaft at the loading zone. a housing; a closure actuator coupled to the housing and configured to pivot with respect to the housing; an elongate shaft extending distally from the housing, the elongate shaft having a loading zone located at a distal end of the elongate shaft, the loading zone being configured to receive an end effector; and a locking member operably coupled to one or more actuation components disposed within the housing, the one or more actuation components also being coupled to the closure actuator such that movement of the locking member effects movement of the closure actuator, characterised in that the locking member is configured to move to a load position which causes the closure actuator to move to a fixed location with respect to the housing, wherein when the locking member is in the load position the closure actuator is held at the fixed location with respect to the housing such that an end effector can be loaded onto the distal end of the elongate shaft at the loading zone.
A coating composition comprising: a) a chain-extended aspartate prepolymer, wherein the chain-extended aspartate prepolymer x) is free of isocyanate groups, xi) has an NH equivalent weight of from 250 to 1,000 g, and xii) is a reaction product of i) a mixture comprising at least one di-aspartic acid ester and at least one amino-functional mono-aspartic acid ester, wherein the molar ratio between the at least one di-aspartic acid ester and the at least one amino-functional mono-aspartic acid ester is from 99.5:0.5 to 50:50, and ii) at least one cycloaliphatic polyisocyanate, and b) at least one curing agent having free isocyanate groups. a) a chain-extended aspartate prepolymer, wherein the chain-extended aspartate prepolymer x) is free of isocyanate groups, xi) has an NH equivalent weight of from 250 to 1,000 g, and xii) is a reaction product of i) a mixture comprising at least one di-aspartic acid ester and at least one amino-functional mono-aspartic acid ester, wherein the molar ratio between the at least one di-aspartic acid ester and the at least one amino-functional mono-aspartic acid ester is from 99.5:0.5 to 50:50, and ii) at least one cycloaliphatic polyisocyanate, and x) is free of isocyanate groups, xi) has an NH equivalent weight of from 250 to 1,000 g, and xii) is a reaction product of i) a mixture comprising at least one di-aspartic acid ester and at least one amino-functional mono-aspartic acid ester, wherein the molar ratio between the at least one di-aspartic acid ester and the at least one amino-functional mono-aspartic acid ester is from 99.5:0.5 to 50:50, and ii) at least one cycloaliphatic polyisocyanate, and i) a mixture comprising at least one di-aspartic acid ester and at least one amino-functional mono-aspartic acid ester, wherein the molar ratio between the at least one di-aspartic acid ester and the at least one amino-functional mono-aspartic acid ester is from 99.5:0.5 to 50:50, and ii) at least one cycloaliphatic polyisocyanate, and b) at least one curing agent having free isocyanate groups.
Fastening system for a machine element (41, 43, 61), in particular for an elongate machine element (41, 43), in particular for a toothed rack or a linear bearing, for fastening in an abutment (45, 145), in particular a machine bed or a flange, comprising: - an eccentric bolt which comprises a pin portion for being received in a receiving opening in an abutment (45, 145), and comprises a joining portion, and - an eccentric sleeve for being pushed onto the joining portion, - the eccentric bolt comprising a head portion, - the head portion having a torque transmission means, and - the diameter of the head portion of the eccentric bolt being less than or equal to the diameter of the joining portion, characterised in that the joining portion is arranged eccentrically with respect to the pin portion such that an eccentrically widening step is formed from the pin portion to the joining portion. - an eccentric bolt which comprises a pin portion for being received in a receiving opening in an abutment (45, 145), and comprises a joining portion, and - an eccentric sleeve for being pushed onto the joining portion, - the eccentric bolt comprising a head portion, - the head portion having a torque transmission means, and - the diameter of the head portion of the eccentric bolt being less than or equal to the diameter of the joining portion,
Handle adapter for a hand tool, in particular a snow-pusher, said adapter having a first adapter part which is to be arranged on a tool and a second adapter part which is to be arranged on a handle, wherein the one adapter part is designed with at least two grooves and the other adapter part with at least two matching tongues for producing a fixed connection to the at least two grooves, characterised in that the other adapter part is designed with a shell section for attachment to the tool in a fixed manner.
A system (430; 432) for decoding a symbol that represents a data set on an object, comprising: an imaging assembly comprising an imaging device configured to capture a plurality of image frames of the symbol; wherein the plurality of the image frames are each characterized by discrete, differing image parameters from at least one of another of the plurality of the image frames; a processor, operatively connected to the imaging assembly constructed and arranged to process the plurality of image frames of the symbol, wherein at least one of the plurality of the image frames are characterized by discrete, differing image parameters from another of the plurality of the image frames, and the processor being further constructed and arranged to decode predetermined code data from at least some of the plurality of image frames and to combine the predetermined code data from the at least some of the plurality of image frames to define a decodable version of the data set represented by the symbol; characterized in that the discrete, differing image parameters comprise image parameters other than orientation of the symbol relative to the imaging device. an imaging assembly comprising an imaging device configured to capture a plurality of image frames of the symbol; wherein the plurality of the image frames are each characterized by discrete, differing image parameters from at least one of another of the plurality of the image frames; a processor, operatively connected to the imaging assembly constructed and arranged to process the plurality of image frames of the symbol, wherein at least one of the plurality of the image frames are characterized by discrete, differing image parameters from another of the plurality of the image frames, and the processor being further constructed and arranged to decode predetermined code data from at least some of the plurality of image frames and to combine the predetermined code data from the at least some of the plurality of image frames to define a decodable version of the data set represented by the symbol; characterized in that the discrete, differing image parameters comprise image parameters other than orientation of the symbol relative to the imaging device.
A foot support system (200, 260, 280, 300), comprising: a first fluid-filled bladder chamber including a first major surface, a second major surface opposite the first major surface, and a first interior chamber; a second fluid-filled bladder chamber including a third major surface, a fourth major surface opposite the third major surface, and a second interior chamber, wherein the third major surface faces the second major surface; a first fluid flow line placing the first interior chamber and the second interior chamber in fluid communication with one another; a pump device; a second fluid flow line placing the first interior chamber in fluid communication with the pump device; a third fluid flow line placing the pump device in fluid communication with the second interior chamber; and a fluid flow control system to selectively change the first fluid flow line between an open configuration in which fluid flow between the first interior chamber and the second interior chamber occurs and a closed configuration in which fluid flow between the first interior chamber and the second interior chamber is stopped. a first fluid-filled bladder chamber including a first major surface, a second major surface opposite the first major surface, and a first interior chamber; a second fluid-filled bladder chamber including a third major surface, a fourth major surface opposite the third major surface, and a second interior chamber, wherein the third major surface faces the second major surface; a first fluid flow line placing the first interior chamber and the second interior chamber in fluid communication with one another; a pump device; a second fluid flow line placing the first interior chamber in fluid communication with the pump device; a third fluid flow line placing the pump device in fluid communication with the second interior chamber; and a fluid flow control system to selectively change the first fluid flow line between an open configuration in which fluid flow between the first interior chamber and the second interior chamber occurs and a closed configuration in which fluid flow between the first interior chamber and the second interior chamber is stopped.
An audio capture apparatus comprising: a first beamformer arranged to generate a beamformed audio output signal; an adapter for adapting beamform parameters of the first beamformer; a detector for detecting an attack of speech in the beamformed audio output signal; and a controller for controlling the adaptation of the beamform parameters to occur in a predetermined adaptation time interval determined in response to the detection of the attack of speech. a first beamformer arranged to generate a beamformed audio output signal; an adapter for adapting beamform parameters of the first beamformer; a detector for detecting an attack of speech in the beamformed audio output signal; and a controller for controlling the adaptation of the beamform parameters to occur in a predetermined adaptation time interval determined in response to the detection of the attack of speech.
A process for preparing the micronisable salmeterol xinafoate polymorph I, wherein the micronisable salmeterol xinafoate polymorph I is characterized by a mean particle size between 5 and 15 μm and a bulk density between 0.1 and 0.2 g/mL, said process comprising: a. seeding a solution of salmeterol xinafoate in an organic solvent with salmeterol xinafoate polymorph I at a temperature approximately between 40 and 50°C; b. subjecting the seeded solution of step a) to a stepwise profile cooling process comprising between 2 and 5 steps, wherein the stepwise profile cooling process starts at a temperature between 40°C and 50°C and ends at a temperature between 5°C and -10°C and wherein the temperature is kept constant in each step during a time between 30 minutes and 2 hours. a. seeding a solution of salmeterol xinafoate in an organic solvent with salmeterol xinafoate polymorph I at a temperature approximately between 40 and 50°C; b. subjecting the seeded solution of step a) to a stepwise profile cooling process comprising between 2 and 5 steps, wherein the stepwise profile cooling process starts at a temperature between 40°C and 50°C and ends at a temperature between 5°C and -10°C and wherein the temperature is kept constant in each step during a time between 30 minutes and 2 hours.
An oral appliance fixable to lower jaw teeth of a patient comprising: a body having a shape corresponding to a teeth arrangement; a lower teeth recess formed in a lower portion of the body to allow the lower jaw teeth to be inserted therein; an upper teeth recess formed in an upper portion of the body to allow upper jaw teeth to be inserted therein and allowing the lower jaw to move backward by a predetermined distance; and an upper teeth guide part formed to extend from the body to face a side surface of the upper jaw teeth, wherein the lower teeth recess further comprises a lower molar fixing recess formed to strongly engage with at least a portion of left and right molars of the lower jaw teeth by a frictional force and a lower incisor recess formed to allow other lower jaw teeth except the left and right molars to position therein, wherein the lower incisor recess is formed to be spaced apart from lower incisors, and thus the lower incisor recess does not contact to the lower incisors, wherein the upper teeth recess is formed to be spaced apart from upper jaw teeth, and thus the upper teeth recess does not strongly engage with the upper jaw teeth, wherein the upper teeth recess and the lower teeth recess are formed such that the lower jaw teeth of the patient move forward further than before wearing the oral appliance fixed to the lower jaw teeth. a body having a shape corresponding to a teeth arrangement; a lower teeth recess formed in a lower portion of the body to allow the lower jaw teeth to be inserted therein; an upper teeth recess formed in an upper portion of the body to allow upper jaw teeth to be inserted therein and allowing the lower jaw to move backward by a predetermined distance; and an upper teeth guide part formed to extend from the body to face a side surface of the upper jaw teeth, wherein the lower teeth recess further comprises a lower molar fixing recess formed to strongly engage with at least a portion of left and right molars of the lower jaw teeth by a frictional force and a lower incisor recess formed to allow other lower jaw teeth except the left and right molars to position therein, wherein the lower incisor recess is formed to be spaced apart from lower incisors, and thus the lower incisor recess does not contact to the lower incisors, wherein the upper teeth recess is formed to be spaced apart from upper jaw teeth, and thus the upper teeth recess does not strongly engage with the upper jaw teeth, wherein the upper teeth recess and the lower teeth recess are formed such that the lower jaw teeth of the patient move forward further than before wearing the oral appliance fixed to the lower jaw teeth.
An AC-DC converter, designed to be connected by three main inputs to a supply of three-phase voltage of given amplitude Va, comprising an autotransformer with three main inputs (E1, E2, E3) and more than three outputs (A1, A2, A3, B1, etc.) and a rectifier bridge with more than three phases connected to the outputs of the autotransformer, the autotransformer comprising a magnetic core with three branches (M12, M23, M31) and on each branch a main winding (B12, B23, B31) and auxiliary windings (X12, X23, X31, etc.), the auxiliary windings of one branch being electrically connected at one end to terminals of the main windings of this branch or of another branch and at the other to a respective output of the autotransformer, all of the connections exhibiting a circular permutational symmetry allowing a balanced three-phase operation, this converter being characterized in that it comprises three auxiliary power supply terminals (M1, M2, M3), each one on a respective winding according to a three-phase permutational symmetry, at a location where the amplitude of the voltage is Va/g when the power supply voltage present on its main inputs is Va, and in that these three auxiliary power supply terminals (M1, M2, M3) are connected to a three-phase connector (CAUX) in order to form an auxiliary three-phase input allowing AC electrical power to be occasionally received at a voltage Va/g of different amplitude from the amplitude Va to be applied to the main inputs.