A pressure sensor module apparatus comprising: a pressure sensor device comprising: a pressure sensitive element contained within a moulded device package; connecting leads operably coupled to the pressure sensitive element and protruding through the moulded device package for electrical connection thereto; and an access port formed in the moulded device package and configured to provide fluid communication with the pressure sensitive element; an intermediate carrier comprising an electrical circuit interconnect and an access aperture therethrough, the intermediate carrier comprising electrical contacts; a module portion, the intermediate carrier being disposed adjacent the module portion; and the connecting leads are respectively soldered to the electrical contacts of the electrical circuit interconnect; the apparatus further comprising: the access aperture facing the access port formed in the moulded device package; the module portion comprising an upstanding pressure port; the upstanding pressure port being sealingly coupled to an opposing surface of the moulded device package surrounding the access port of the pressure sensor device; and the upstanding pressure port extending through the access aperture of the intermediate carrier. a pressure sensor device comprising: a pressure sensitive element contained within a moulded device package; connecting leads operably coupled to the pressure sensitive element and protruding through the moulded device package for electrical connection thereto; and an access port formed in the moulded device package and configured to provide fluid communication with the pressure sensitive element; a pressure sensitive element contained within a moulded device package; connecting leads operably coupled to the pressure sensitive element and protruding through the moulded device package for electrical connection thereto; and an access port formed in the moulded device package and configured to provide fluid communication with the pressure sensitive element; an intermediate carrier comprising an electrical circuit interconnect and an access aperture therethrough, the intermediate carrier comprising electrical contacts; a module portion, the intermediate carrier being disposed adjacent the module portion; and the connecting leads are respectively soldered to the electrical contacts of the electrical circuit interconnect; the apparatus further comprising: the access aperture facing the access port formed in the moulded device package; the module portion comprising an upstanding pressure port; the upstanding pressure port being sealingly coupled to an opposing surface of the moulded device package surrounding the access port of the pressure sensor device; and the upstanding pressure port extending through the access aperture of the intermediate carrier. the access aperture facing the access port formed in the moulded device package; the module portion comprising an upstanding pressure port; the upstanding pressure port being sealingly coupled to an opposing surface of the moulded device package surrounding the access port of the pressure sensor device; and the upstanding pressure port extending through the access aperture of the intermediate carrier.