An OLED display panel, comprising: a display region comprising: a first protective layer, a flexible substrate, a substrate wiring layer, and a display element layer which are sequentially stacked and disposed, wherein the flexible substrate and the substrate wiring layer are extended toward a side of the display region; a bending region being a first extending portion of the flexible substrate and the substrate wiring layer; and a driving bonding region being a second extending portion of the flexible substrate and the substrate wiring layer, wherein the second extending portion is located outside the first extending portion; wherein the driving bonding region comprises: a driving chip disposed on a surface of the substrate wiring layer and configured to input a voltage to each pixel; a flexible circuit board configured to achieve a connection between the driving chip and a motherboard; and a reinforcing plate disposed on the surface of the substrate wiring layer of the driving bonding region and covering the surface of the substrate wiring layer of the driving bonding region, wherein a chamber is formed in a bottom portion of the reinforcing plate, and the driving chip is located in the chamber; characterized in that a second opening is disposed in a side of the chamber of the reinforcing plate, the second opening is towards the driving chip and connected to an end of the flexible circuit board, and a top portion of the second opening is slightly higher than an upper surface of the flexible circuit board. a display region comprising: a first protective layer, a flexible substrate, a substrate wiring layer, and a display element layer which are sequentially stacked and disposed, wherein the flexible substrate and the substrate wiring layer are extended toward a side of the display region; a bending region being a first extending portion of the flexible substrate and the substrate wiring layer; and a driving bonding region being a second extending portion of the flexible substrate and the substrate wiring layer, wherein the second extending portion is located outside the first extending portion; wherein the driving bonding region comprises: a driving chip disposed on a surface of the substrate wiring layer and configured to input a voltage to each pixel; a flexible circuit board configured to achieve a connection between the driving chip and a motherboard; and a reinforcing plate disposed on the surface of the substrate wiring layer of the driving bonding region and covering the surface of the substrate wiring layer of the driving bonding region, wherein a chamber is formed in a bottom portion of the reinforcing plate, and the driving chip is located in the chamber; characterized in that a second opening is disposed in a side of the chamber of the reinforcing plate, the second opening is towards the driving chip and connected to an end of the flexible circuit board, and a top portion of the second opening is slightly higher than an upper surface of the flexible circuit board. a driving chip disposed on a surface of the substrate wiring layer and configured to input a voltage to each pixel; a flexible circuit board configured to achieve a connection between the driving chip and a motherboard; and a reinforcing plate disposed on the surface of the substrate wiring layer of the driving bonding region and covering the surface of the substrate wiring layer of the driving bonding region, wherein a chamber is formed in a bottom portion of the reinforcing plate, and the driving chip is located in the chamber; characterized in that a second opening is disposed in a side of the chamber of the reinforcing plate, the second opening is towards the driving chip and connected to an end of the flexible circuit board, and a top portion of the second opening is slightly higher than an upper surface of the flexible circuit board.