A method of testing each of a plurality of different circuit assemblies, the circuit assemblies each comprising a component with a cavity and a plurality of pins disposed within the cavity, the method comprising acts of: inserting a sense plate comprised in a probe that is a part of a probe assembly into the cavity of the component, thereby partially inserting the probe assembly into the cavity, wherein the act of partially inserting the probe assembly into the cavity comprises moving the probe assembly in a first direction toward the component, generating a force in a second direction transverse to the first direction by engaging at least one beveled and/or tapered guiding surface between the probe assembly and the component, the beveled and/or tapered guiding surface integrated into the probe assembly, the component, or a surface of a circuit assembly, aligning the sense plate within the cavity by allowing motion of the probe assembly in the second, transverse direction as the probe assembly moves in the first direction, wherein the transverse motion is allowed by a compliance subassembly included in the probe assembly; and restricting further insertion of the probe assembly in the first direction with a spacer so as to position the sense plate between 254 micrometers and 2540 micrometers from the plurality of pins while precluding contact between the sense plate of the probe and the plurality of pins. inserting a sense plate comprised in a probe that is a part of a probe assembly into the cavity of the component, thereby partially inserting the probe assembly into the cavity, wherein the act of partially inserting the probe assembly into the cavity comprises moving the probe assembly in a first direction toward the component, generating a force in a second direction transverse to the first direction by engaging at least one beveled and/or tapered guiding surface between the probe assembly and the component, the beveled and/or tapered guiding surface integrated into the probe assembly, the component, or a surface of a circuit assembly, aligning the sense plate within the cavity by allowing motion of the probe assembly in the second, transverse direction as the probe assembly moves in the first direction, wherein the transverse motion is allowed by a compliance subassembly included in the probe assembly; and moving the probe assembly in a first direction toward the component, generating a force in a second direction transverse to the first direction by engaging at least one beveled and/or tapered guiding surface between the probe assembly and the component, the beveled and/or tapered guiding surface integrated into the probe assembly, the component, or a surface of a circuit assembly, aligning the sense plate within the cavity by allowing motion of the probe assembly in the second, transverse direction as the probe assembly moves in the first direction, wherein the transverse motion is allowed by a compliance subassembly included in the probe assembly; and restricting further insertion of the probe assembly in the first direction with a spacer so as to position the sense plate between 254 micrometers and 2540 micrometers from the plurality of pins while precluding contact between the sense plate of the probe and the plurality of pins.