A soldering apparatus comprising: first transfer means (13A, 13A) for transferring a printed circuit board; second transfer means (13B, 13B) provided in parallel to a transfer direction of the printed circuit board transferred by the first transfer means (13A, 13A); a first reflow furnace main body for heating the printed circuit board transferred by the first transfer means (13A, 13A); a second reflow furnace main body for heating a printed circuit board transferred by the second transfer means (13B, 13B); and a frame for housing the first reflow furnace main body and the second reflow furnace main body, wherein the frame contains first opening/closing means for opening/closing the first reflow furnace main body and second opening/closing means for opening/closing the second reflow furnace main body, wherein each of the first and second reflow furnace main bodies (20A, 20B) is configured to have an upper main body (20a, 20c) and a lower main body (20b, 20d), characterized in that the first opening/closing means includes cylinders as first lifting/lowering means for lifting/lowering the upper main body of the first reflow furnace main body vertically, without being rotated relative to the lower main body of the first reflow furnace main body, and a driving mechanism for driving the cylinders, and further includes a sub-frame to which the cylinders are attached below and an upper cover provided above the sub-frame to cover the upper side and lateral side of the upper main body, and the second opening/closing means includes cylinders as second lifting/lowering means for lifting/lowering the upper main body of the second reflow furnace main body vertically, without being rotated relative to the lower main body of the second reflow furnace main body and a driving mechanism for driving the cylinders, and further includes a sub-frame to which the cylinders are attached below and an upper cover provided above the sub-frame to cover the upper side and lateral side of the upper main body. first transfer means (13A, 13A) for transferring a printed circuit board; second transfer means (13B, 13B) provided in parallel to a transfer direction of the printed circuit board transferred by the first transfer means (13A, 13A); a first reflow furnace main body for heating the printed circuit board transferred by the first transfer means (13A, 13A); a second reflow furnace main body for heating a printed circuit board transferred by the second transfer means (13B, 13B); and a frame for housing the first reflow furnace main body and the second reflow furnace main body, wherein the frame contains first opening/closing means for opening/closing the first reflow furnace main body and second opening/closing means for opening/closing the second reflow furnace main body, wherein each of the first and second reflow furnace main bodies (20A, 20B) is configured to have an upper main body (20a, 20c) and a lower main body (20b, 20d), characterized in that the first opening/closing means includes cylinders as first lifting/lowering means for lifting/lowering the upper main body of the first reflow furnace main body vertically, without being rotated relative to the lower main body of the first reflow furnace main body, and a driving mechanism for driving the cylinders, and further includes a sub-frame to which the cylinders are attached below and an upper cover provided above the sub-frame to cover the upper side and lateral side of the upper main body, and the second opening/closing means includes cylinders as second lifting/lowering means for lifting/lowering the upper main body of the second reflow furnace main body vertically, without being rotated relative to the lower main body of the second reflow furnace main body and a driving mechanism for driving the cylinders, and further includes a sub-frame to which the cylinders are attached below and an upper cover provided above the sub-frame to cover the upper side and lateral side of the upper main body.