Method for manufacturing an electronic document, comprising the following steps: - obtaining a flat body with a constant thickness, at least 5 times smaller than its length and than its width, in which body is formed a cavity of rectangular overall shape having a deep portion surrounded by a counterbore and that contains an electronic component having connection terminals that are situated on this counterbore, - obtaining a module having a flat carrier with a thickness at most equal to the depth of the counterbore and equipped, on a face termed external face, with a plurality of external contact zones and, on a face termed internal face, with a printed circuit forming connection tracks and having connection pads (4A, 4B), in solid form, at two peripheral locations of the carrier, this printed circuit being connected to at least some of the external contact zones, the carrier furthermore being equipped, on this internal face, with a microcircuit connected to this printed circuit, - inlaying the module into the cavity, such that the connection pads (4A, 4B) of the module face the connection terminals (5A, 5B) of the component and together define an area of coverage/overlap, with interposition, between the module and the counterbore of the cavity, of an electrically conductive anisotropic adhesive formed of a plurality of conductive particles in an adhesive matrix and providing both a mechanical link between the module and the body and an electrical connection between the connection terminals of the component and the connection pads of the module, characterized in that the connection terminals of the component are formed by meanders (5A, 5B, 20) extending parallel to the edges of the counterbore at a distance from the corners of this counterbore, and the anisotropically electrically conductive adhesive is chosen so as to have a coefficient of overlap, by the particles, of the area of overlap, of between 5 and 8%. - obtaining a flat body with a constant thickness, at least 5 times smaller than its length and than its width, in which body is formed a cavity of rectangular overall shape having a deep portion surrounded by a counterbore and that contains an electronic component having connection terminals that are situated on this counterbore, - obtaining a module having a flat carrier with a thickness at most equal to the depth of the counterbore and equipped, on a face termed external face, with a plurality of external contact zones and, on a face termed internal face, with a printed circuit forming connection tracks and having connection pads (4A, 4B), in solid form, at two peripheral locations of the carrier, this printed circuit being connected to at least some of the external contact zones, the carrier furthermore being equipped, on this internal face, with a microcircuit connected to this printed circuit, - inlaying the module into the cavity, such that the connection pads (4A, 4B) of the module face the connection terminals (5A, 5B) of the component and together define an area of coverage/overlap, with interposition, between the module and the counterbore of the cavity, of an electrically conductive anisotropic adhesive formed of a plurality of conductive particles in an adhesive matrix and providing both a mechanical link between the module and the body and an electrical connection between the connection terminals of the component and the connection pads of the module,