A semiconductor light-emitting device comprising: a mounting substrate; a plurality of semiconductor light-emitting elements arranged on the mounting substrate, each of the plurality of semiconductor light-emitting elements including: a semiconductor structure layer configured to have a first semiconductor layer having a first conductivity type, a light-emitting layer, and a second semiconductor layer having a second conductivity type, which are stacked in order on the mounting substrate; a first electrode formed on the first semiconductor layer; and a second electrode extending through the first semiconductor layer and the light-emitting layer from a surface of the first semiconductor layer and being connected to the second semiconductor layer; a light absorber that is formed so as to cover an entire region between the plurality of semiconductor light-emitting elements adjacent to each other on the mounting substrate; and a wiring group including a plurality of wirings (15A-15F) wired to each of the first electrodes between the mounting substrate and each of the plurality of semiconductor light-emitting elements, wherein the light absorber has conductivity and is electrically connected to each of the second electrodes between the mounting substrate and each of the plurality of semiconductor light-emitting elements, the light absorber and the wiring group are formed between the mounting substrate and each of the plurality of semiconductor light-emitting elements so as to three-dimensionally overlap with each other via an insulating layer, characterized in that the semiconductor structure layer has a side surface facing the semiconductor light-emitting element adjacent thereto, the side surface having a step shape formed from a recess portion extending from the first semiconductor layer to the second semiconductor layer, the side surface thus including a first side surface (21S1), a bottom surface and a second side surface (21S2), wherein the recess portion is made up of the first side surface (21S1) and the bottom surface and is covered with an insulation film, and wherein the second side surface (21S2) and the recess portion covered by the insulation film are exposed to the outside. a mounting substrate; a plurality of semiconductor light-emitting elements arranged on the mounting substrate, each of the plurality of semiconductor light-emitting elements including: a semiconductor structure layer configured to have a first semiconductor layer having a first conductivity type, a light-emitting layer, and a second semiconductor layer having a second conductivity type, which are stacked in order on the mounting substrate; a first electrode formed on the first semiconductor layer; and a second electrode extending through the first semiconductor layer and the light-emitting layer from a surface of the first semiconductor layer and being connected to the second semiconductor layer; a light absorber that is formed so as to cover an entire region between the plurality of semiconductor light-emitting elements adjacent to each other on the mounting substrate; and a wiring group including a plurality of wirings (15A-15F) wired to each of the first electrodes between the mounting substrate and each of the plurality of semiconductor light-emitting elements, wherein the light absorber has conductivity and is electrically connected to each of the second electrodes between the mounting substrate and each of the plurality of semiconductor light-emitting elements, the light absorber and the wiring group are formed between the mounting substrate and each of the plurality of semiconductor light-emitting elements so as to three-dimensionally overlap with each other via an insulating layer, characterized in that the semiconductor structure layer has a side surface facing the semiconductor light-emitting element adjacent thereto, the side surface having a step shape formed from a recess portion extending from the first semiconductor layer to the second semiconductor layer, the side surface thus including a first side surface (21S1), a bottom surface and a second side surface (21S2), wherein the recess portion is made up of the first side surface (21S1) and the bottom surface and is covered with an insulation film, and wherein the second side surface (21S2) and the recess portion covered by the insulation film are exposed to the outside.