A display device, comprising: a silicon-based organic light-emitting display panel, comprising a silicon substrate, a first electrode of a display element, an organic light-emitting layer, and a second electrode of the display element that are stacked sequentially; a flexible printed circuit board electrically connected to the silicon substrate; and a heat dissipation layer on a non-display side of the silicon-based organic light-emitting display panel, extending to the flexible printed circuit board to cover at least a part of the flexible printed circuit board, wherein a gate drive circuit, a data drive circuit, and a pixel circuit are integrated on the silicon substrate, and the flexible printed circuit board is configured to transmit electrical signals to the gate drive circuit, the data drive circuit, and the second electrode of the display element; characterized in that the heat dissipation layer comprises: a first heat dissipation layer on the non-display side of the silicon-based organic light-emitting display panel; a second heat dissipation layer on a side of the first heat dissipation layer away from the silicon-based organic light-emitting display panel, wherein an area of an orthographic projection of the second heat dissipation layer on a plane parallel to the first heat dissipation layer is smaller than an area of an orthographic projection of the first heat dissipation layer on the plane, and the orthographic projection of the second heat dissipation layer on the plane is within the orthographic projection of the first heat dissipation layer on the plane; and a third heat dissipation layer on a side of the second heat dissipation layer away from the first heat dissipation layer, and covering all surfaces, that are not in contact with the first heat dissipation layer, of the second heat dissipation layer. a silicon-based organic light-emitting display panel, comprising a silicon substrate, a first electrode of a display element, an organic light-emitting layer, and a second electrode of the display element that are stacked sequentially; a flexible printed circuit board electrically connected to the silicon substrate; and a heat dissipation layer on a non-display side of the silicon-based organic light-emitting display panel, extending to the flexible printed circuit board to cover at least a part of the flexible printed circuit board, wherein a gate drive circuit, a data drive circuit, and a pixel circuit are integrated on the silicon substrate, and the flexible printed circuit board is configured to transmit electrical signals to the gate drive circuit, the data drive circuit, and the second electrode of the display element; characterized in that the heat dissipation layer comprises: a first heat dissipation layer on the non-display side of the silicon-based organic light-emitting display panel; a second heat dissipation layer on a side of the first heat dissipation layer away from the silicon-based organic light-emitting display panel, wherein an area of an orthographic projection of the second heat dissipation layer on a plane parallel to the first heat dissipation layer is smaller than an area of an orthographic projection of the first heat dissipation layer on the plane, and the orthographic projection of the second heat dissipation layer on the plane is within the orthographic projection of the first heat dissipation layer on the plane; and a third heat dissipation layer on a side of the second heat dissipation layer away from the first heat dissipation layer, and covering all surfaces, that are not in contact with the first heat dissipation layer, of the second heat dissipation layer. a first heat dissipation layer on the non-display side of the silicon-based organic light-emitting display panel; a second heat dissipation layer on a side of the first heat dissipation layer away from the silicon-based organic light-emitting display panel, wherein an area of an orthographic projection of the second heat dissipation layer on a plane parallel to the first heat dissipation layer is smaller than an area of an orthographic projection of the first heat dissipation layer on the plane, and the orthographic projection of the second heat dissipation layer on the plane is within the orthographic projection of the first heat dissipation layer on the plane; and a third heat dissipation layer on a side of the second heat dissipation layer away from the first heat dissipation layer, and covering all surfaces, that are not in contact with the first heat dissipation layer, of the second heat dissipation layer.