A patterning method using an imprint mold, for forming an imprinted pattern structure, the patterning method comprising: providing a resist layer comprising thermoplastic polymer from which the imprinted pattern structure is formed; performing a first imprint process on a first area of the resist layer using the imprint mold to form a first pattern of the pattern structure through deformation of the resist layer in the first area, by heating the first area to a predetermined temperature, contacting and pressing the imprint mold to the resist layer in the first area, and detaching the imprint mold from the resist layer in the first area; and performing a second imprint process on a second area of the resist layer using the imprint mold to form a second pattern of the pattern structure through deformation of the resist layer in the second area, by heating the second area to the predetermined temperature, contacting and pressing the imprint mold to the resist layer in the second area, and detaching the imprint mold from the resist layer in the second area; wherein the first and second areas (A1,A2) are overlapped with each other in a third area of the resist layer, and the performing the second imprint process deforms a first portion of the first pattern in the third area to form the second pattern; characterised in that the imprint mold comprises: a support plate having a flat panel shape; and a soft stamp attached on the support plate, comprising a material softer than a material of the support plate, and comprising a mold pattern defined on a surface thereof, wherein the performing the first or second imprint process respectively comprises: locating the imprint mold above the first or second area (A1,A2) of the resist layer; heating the first or second area (A1,A2) to the predetermined temperature; via the support plate, contacting and pressing the imprint mold to the resist layer in the first or second area, to form the first or second pattern; separating the support plate from the soft stamp to maintain the soft stamp in contact with the first or second pattern; and detaching the soft stamp from the first or second pattern. providing a resist layer comprising thermoplastic polymer from which the imprinted pattern structure is formed; performing a first imprint process on a first area of the resist layer using the imprint mold to form a first pattern of the pattern structure through deformation of the resist layer in the first area, by heating the first area to a predetermined temperature, contacting and pressing the imprint mold to the resist layer in the first area, and detaching the imprint mold from the resist layer in the first area; and performing a second imprint process on a second area of the resist layer using the imprint mold to form a second pattern of the pattern structure through deformation of the resist layer in the second area, by heating the second area to the predetermined temperature, contacting and pressing the imprint mold to the resist layer in the second area, and detaching the imprint mold from the resist layer in the second area; wherein the first and second areas (A1,A2) are overlapped with each other in a third area of the resist layer, and the performing the second imprint process deforms a first portion of the first pattern in the third area to form the second pattern; characterised in that the imprint mold comprises: a support plate having a flat panel shape; and a soft stamp attached on the support plate, comprising a material softer than a material of the support plate, and comprising a mold pattern defined on a surface thereof, a support plate having a flat panel shape; and a soft stamp attached on the support plate, comprising a material softer than a material of the support plate, and comprising a mold pattern defined on a surface thereof, wherein the performing the first or second imprint process respectively comprises: locating the imprint mold above the first or second area (A1,A2) of the resist layer; heating the first or second area (A1,A2) to the predetermined temperature; via the support plate, contacting and pressing the imprint mold to the resist layer in the first or second area, to form the first or second pattern; separating the support plate from the soft stamp to maintain the soft stamp in contact with the first or second pattern; and detaching the soft stamp from the first or second pattern. locating the imprint mold above the first or second area (A1,A2) of the resist layer; heating the first or second area (A1,A2) to the predetermined temperature; via the support plate, contacting and pressing the imprint mold to the resist layer in the first or second area, to form the first or second pattern; separating the support plate from the soft stamp to maintain the soft stamp in contact with the first or second pattern; and detaching the soft stamp from the first or second pattern.