An electronic device housing composed mainly of a first fiber reinforcing member (a) and a second fiber reinforcing member (b), the first fiber reinforcing member (a) containing a first resin and a first fiber, wherein the first fiber is carbon fiber, and wherein the projected area of the first fiber reinforcing member (a) accounts for 60% or more and 95% or less of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face, the second fiber reinforcing member (b) containing a second resin and a second fiber, wherein the second fiber is a non-electrically-conductive fiber, wherein the first fiber is a discontinuous fiber whereas the second fiber is a continuous fiber the first fiber reinforcing member (a) and the second fiber reinforcing member (b) being joined directly without the existence of another layer at the joining face between the first fiber reinforcing member (a) and the second fiber reinforcing member (b), characterized in that the fiber reinforcing members (a) and (b) meeting equations and: 0.5 < A1/B1 < 3 A1: linear expansion coefficient of the first fiber reinforcing member (a) B1: linear expansion coefficient of the second fiber reinforcing member (b) 0.7 < A2/B2 < 1.2 A2: bending elastic modulus of the first fiber reinforcing member (a) B2: bending elastic modulus of the second fiber reinforcing member (b) wherein the linear expansion coefficient of the fiber reinforcing member is measured by taking a test piece having a length of 10 mm and a width of 4 mm from each member of the electronic device housing, polishing the end faces to make them smooth, heating them according to JIS K7197, 2012, from 0°C to 200°C at a heating rate of 5°C/min to determine the linear expansion coefficient in the range of 30°C to 150°C, followed by calculating the arithmetic average of all measurements, and wherein the bending elastic modulus of the fiber reinforcing member is measured by taking a test piece having a length of 80 mm and a width of 10 mm from each member of the electronic device housing and performing a bending test at 23°C according to JIS K7171. 2008. the first fiber reinforcing member (a) containing a first resin and a first fiber, wherein the first fiber is carbon fiber, and wherein the projected area of the first fiber reinforcing member (a) accounts for 60% or more and 95% or less of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face, the second fiber reinforcing member (b) containing a second resin and a second fiber, wherein the second fiber is a non-electrically-conductive fiber, wherein the first fiber is a discontinuous fiber whereas the second fiber is a continuous fiber the first fiber reinforcing member (a) and the second fiber reinforcing member (b) being joined directly without the existence of another layer at the joining face between the first fiber reinforcing member (a) and the second fiber reinforcing member (b), characterized in that the fiber reinforcing members (a) and (b) meeting equations and: 0.5 < A1/B1 < 3 A1: linear expansion coefficient of the first fiber reinforcing member (a) B1: linear expansion coefficient of the second fiber reinforcing member (b) 0.7 < A2/B2 < 1.2 A2: bending elastic modulus of the first fiber reinforcing member (a) B2: bending elastic modulus of the second fiber reinforcing member (b) A1: linear expansion coefficient of the first fiber reinforcing member (a) B1: linear expansion coefficient of the second fiber reinforcing member (b) A2: bending elastic modulus of the first fiber reinforcing member (a) B2: bending elastic modulus of the second fiber reinforcing member (b) wherein the linear expansion coefficient of the fiber reinforcing member is measured by taking a test piece having a length of 10 mm and a width of 4 mm from each member of the electronic device housing, polishing the end faces to make them smooth, heating them according to JIS K7197, 2012, from 0°C to 200°C at a heating rate of 5°C/min to determine the linear expansion coefficient in the range of 30°C to 150°C, followed by calculating the arithmetic average of all measurements, and wherein the bending elastic modulus of the fiber reinforcing member is measured by taking a test piece having a length of 80 mm and a width of 10 mm from each member of the electronic device housing and performing a bending test at 23°C according to JIS K7171. 2008.