An electro-optic device package comprising: a. an electro-optic element comprising an electro-optic body having a top surface and a bottom surface, with an optical waveguide formed in the top surface, an optical fiber input to the optical waveguide, an optical fiber output from the optical waveguide, and electrodes (13a, 13b) on the top surface of the electro-optic body for impressing an electric field on the optical waveguide; b. a substrate, the electro-optic element being attached to said substrate; wherein the substrate is a printed circuit board and comprises a top interconnect level, wherein the electro-optic body is flip-chip mounted on the top interconnect level, and the electrodes (13a, 13b) are soldered to the top interconnect level of the printed circuit board, characterised in that the package further comprises: c. a housing enclosing the electro-optic element, the housing comprising a bottom and a cover, wherein the bottom consists of the printed circuit board which is a laminated resin multi-level printed circuit board comprising at least two levels that include the top interconnect level and at least one lower interconnect level (21 a), and wherein the cover is attached to the multi-level printed circuit board; d. a plurality of conductive runners (34a,34b, 35a, 35b) on the lower interconnect level, with the conductive runners electrically interconnected through interlevel vias to the electrodes (13a, 13b) soldered to the top interconnect level, wherein the multi-level printed circuit board is moulded to form a ledge portion on the lower interconnect level that extends from the side of the multi-level printed circuit board and beyond the cover, with the conductive runners (34a, 34b, 35a, 35b) on the lower interconnect level of the multi-level printed circuit board extending onto a top surface of the ledge portion and accessible from the outside of the electro-optical device package. a. an electro-optic element comprising an electro-optic body having a top surface and a bottom surface, with an optical waveguide formed in the top surface, an optical fiber input to the optical waveguide, an optical fiber output from the optical waveguide, and electrodes (13a, 13b) on the top surface of the electro-optic body for impressing an electric field on the optical waveguide; b. a substrate, the electro-optic element being attached to said substrate; wherein the substrate is a printed circuit board and comprises a top interconnect level, c. a housing enclosing the electro-optic element, the housing comprising a bottom and a cover, wherein the bottom consists of the printed circuit board which is a laminated resin multi-level printed circuit board comprising at least two levels that include the top interconnect level and at least one lower interconnect level (21 a), and wherein the cover is attached to the multi-level printed circuit board; d. a plurality of conductive runners (34a,34b, 35a, 35b) on the lower interconnect level, with the conductive runners electrically interconnected through interlevel vias to the electrodes (13a, 13b) soldered to the top interconnect level, wherein the multi-level printed circuit board is moulded to form a ledge portion on the lower interconnect level that extends from the side of the multi-level printed circuit board and beyond the cover, with the conductive runners (34a, 34b, 35a, 35b) on the lower interconnect level of the multi-level printed circuit board extending onto a top surface of the ledge portion and accessible from the outside of the electro-optical device package.