A system for applying varnish to a substrate, comprising: a support configured to support the substrate and extending along a first axis and a second axis orthogonal to the first axis; a first array of selectively controllable varnish applicators displaced along the second axis and configured to apply varnish to the substrate as the support relatively moves relative to the first array in a first axis; a second array of varnish applicators, controllable to apply varnish to the substrate as the support relatively moves relative to the second array in the first axis, the second array further relatively movable relative to the support in the second axis, wherein the fluid application width of the varnish applicators of the second array along the first axis is narrower than the fluid application width of the varnish applicators of the first array along the second axis; and a controller configured to: determine a desired pattern of varnish to apply to the substrate, the desired pattern defining at least one desired varnish-free zone to be left free of varnish; control relative movement between the first array of the varnish applicators and the support in the first axis and control the first array of varnish applicators to apply varnish to the substrate to form a first portion of the pattern, such that the varnish-free zone of the first portion of the pattern is at least no smaller than the desired varnish-free zone; and control relative movement between the second array of varnish applicators and the support in the first axis and in a second axis and control the second array of varnish applicators to apply varnish to the substrate to form a second portion of the pattern, wherein the second portion represents a pattern corresponding to the difference between the desired fluid pattern and the first portion of the pattern. a support configured to support the substrate and extending along a first axis and a second axis orthogonal to the first axis; a first array of selectively controllable varnish applicators displaced along the second axis and configured to apply varnish to the substrate as the support relatively moves relative to the first array in a first axis; a second array of varnish applicators, controllable to apply varnish to the substrate as the support relatively moves relative to the second array in the first axis, the second array further relatively movable relative to the support in the second axis, wherein the fluid application width of the varnish applicators of the second array along the first axis is narrower than the fluid application width of the varnish applicators of the first array along the second axis; and a controller configured to: determine a desired pattern of varnish to apply to the substrate, the desired pattern defining at least one desired varnish-free zone to be left free of varnish; control relative movement between the first array of the varnish applicators and the support in the first axis and control the first array of varnish applicators to apply varnish to the substrate to form a first portion of the pattern, such that the varnish-free zone of the first portion of the pattern is at least no smaller than the desired varnish-free zone; and control relative movement between the second array of varnish applicators and the support in the first axis and in a second axis and control the second array of varnish applicators to apply varnish to the substrate to form a second portion of the pattern, wherein the second portion represents a pattern corresponding to the difference between the desired fluid pattern and the first portion of the pattern. determine a desired pattern of varnish to apply to the substrate, the desired pattern defining at least one desired varnish-free zone to be left free of varnish; control relative movement between the first array of the varnish applicators and the support in the first axis and control the first array of varnish applicators to apply varnish to the substrate to form a first portion of the pattern, such that the varnish-free zone of the first portion of the pattern is at least no smaller than the desired varnish-free zone; and control relative movement between the second array of varnish applicators and the support in the first axis and in a second axis and control the second array of varnish applicators to apply varnish to the substrate to form a second portion of the pattern, wherein the second portion represents a pattern corresponding to the difference between the desired fluid pattern and the first portion of the pattern.