A device for attaching double-sided adhesive onto a printed circuit board, comprising, a driver, a platform and a robot arm provided above the platform, the double-sided adhesive comprising an adhesive layer, a first protective film and a second protective film located respectively at two sides of the adhesive layer; wherein the robot arm is connected with the driver and configured to, under the driving of the driver, place the double-sided adhesive onto a preset position of the platform, strip off the first protective film of the double-sided adhesive at the preset position, press the printed circuit board against the double-sided adhesive with the first protective film having been stripped off, and unload the printed circuit board attached with the double-sided adhesive from the preset position; and wherein the preset position is provided with a positioning structure, which is configured to secure the adhesive layer and the second protective film when the robot arm is stripping off the first protective film, and to release the securing of the adhesive layer and the second protective film when the double-sided adhesive is attached to the printed circuit board; and wherein the platform is connected with the driver to allow the platform to rotate under the driving of the driver; characterized in that the robot arm comprises a first arm for the double-sided adhesive, a second arm for the double-sided adhesive, a first arm for the circuit board, a second arm for the circuit board; the preset position comprises a first position, a second position, a third position and a fourth position; the first arm for the double-sided adhesive is located at the first position to allow double-sided adhesive to be placed on the positioning structure when the platform rotates a positioning structure to the first position; the second arm for the double-sided adhesive is located at the second position to allow the first protective film of the double-sided adhesive at the second position to be stripped off so as to expose the first adhesive surface when the platform rotates the double-sided adhesive at the first position to the second position; the first arm for the circuit board is located at the third position to allow the printed circuit board to be pressed onto the first adhesive surface of the double-sided adhesive at the third position when the platform rotates the double-sided adhesive at the second position to the third position; and the second arm for the circuit board is located at the fourth position to allow the printed circuit board attached with the double-sided adhesive to be unloaded from the fourth position when the platform rotates the double-sided adhesive at the third position to the fourth position. wherein the robot arm is connected with the driver and configured to, under the driving of the driver, place the double-sided adhesive onto a preset position of the platform, strip off the first protective film of the double-sided adhesive at the preset position, press the printed circuit board against the double-sided adhesive with the first protective film having been stripped off, and unload the printed circuit board attached with the double-sided adhesive from the preset position; and wherein the preset position is provided with a positioning structure, which is configured to secure the adhesive layer and the second protective film when the robot arm is stripping off the first protective film, and to release the securing of the adhesive layer and the second protective film when the double-sided adhesive is attached to the printed circuit board; and wherein the platform is connected with the driver to allow the platform to rotate under the driving of the driver; characterized in that the robot arm comprises a first arm for the double-sided adhesive, a second arm for the double-sided adhesive, a first arm for the circuit board, a second arm for the circuit board; the preset position comprises a first position, a second position, a third position and a fourth position; the first arm for the double-sided adhesive is located at the first position to allow double-sided adhesive to be placed on the positioning structure when the platform rotates a positioning structure to the first position; the second arm for the double-sided adhesive is located at the second position to allow the first protective film of the double-sided adhesive at the second position to be stripped off so as to expose the first adhesive surface when the platform rotates the double-sided adhesive at the first position to the second position; the first arm for the circuit board is located at the third position to allow the printed circuit board to be pressed onto the first adhesive surface of the double-sided adhesive at the third position when the platform rotates the double-sided adhesive at the second position to the third position; and the second arm for the circuit board is located at the fourth position to allow the printed circuit board attached with the double-sided adhesive to be unloaded from the fourth position when the platform rotates the double-sided adhesive at the third position to the fourth position.