An installation bracket, configured to carry a process cartridge, comprising: a bracket main body; and a connection portion, disposed on the bracket main body, wherein: the connection portion includes a conductive portion, configured to electrically connect a contact portion of a chip on the process cartridge and an electrical contact portion of an image-forming apparatus; the bracket main body includes a first side plate and a second side plate arranged sequentially along a first direction X, and the connection portion is located on the second side plate; when the installation bracket is installed in the image-forming apparatus, the second side plate is adjacent to the electrical contact portion of the image-forming apparatus relative to the first side plate; and when the installation bracket is configured to carry the process cartridge, the connection portion is capable of being electrically connected to the process cartridge, characterized in that, the connection portion is higher than the second side plate along a third direction Z; and the third direction Z is a height direction of the second side plate and intersects with the first direction X. a bracket main body; and a connection portion, disposed on the bracket main body, wherein: the connection portion includes a conductive portion, configured to electrically connect a contact portion of a chip on the process cartridge and an electrical contact portion of an image-forming apparatus; the bracket main body includes a first side plate and a second side plate arranged sequentially along a first direction X, and the connection portion is located on the second side plate; when the installation bracket is installed in the image-forming apparatus, the second side plate is adjacent to the electrical contact portion of the image-forming apparatus relative to the first side plate; and when the installation bracket is configured to carry the process cartridge, the connection portion is capable of being electrically connected to the process cartridge, characterized in that, the connection portion is higher than the second side plate along a third direction Z; and the third direction Z is a height direction of the second side plate and intersects with the first direction X. the connection portion includes a conductive portion, configured to electrically connect a contact portion of a chip on the process cartridge and an electrical contact portion of an image-forming apparatus; the bracket main body includes a first side plate and a second side plate arranged sequentially along a first direction X, and the connection portion is located on the second side plate; when the installation bracket is installed in the image-forming apparatus, the second side plate is adjacent to the electrical contact portion of the image-forming apparatus relative to the first side plate; and when the installation bracket is configured to carry the process cartridge, the connection portion is capable of being electrically connected to the process cartridge, characterized in that, the connection portion is higher than the second side plate along a third direction Z; and the third direction Z is a height direction of the second side plate and intersects with the first direction X.