A cooling apparatus (600, 700), for cooling one or more in-line memory modules, comprising: a manifold comprising a plurality of parallel cooling tubes (610, 710) made of heat-conducting material, wherein each of the plurality of cooling tubes is configured to convey a cooling liquid, wherein each of the plurality of cooling tubes has a first end and a second end, and wherein the plurality of cooling tubes are spaced apart from one another so as to receive at least one in-line memory module between adjacent cooling tubes; a first chamber (630, 730) fluidly coupled to the first ends of the plurality of cooling tubes (610, 710) so that cooling liquid dispenses from the chamber (630, 730) into each of the plurality of cooling tubes (610, 710); a second chamber (630, 730) fluidly coupled to the second ends of the plurality of cooling tubes (610, 710) so that cooling liquid collects from the plurality of cooling tubes (610, 710) into the second chamber; a first connector (620, 720) for fluidly connecting the plurality of cooling tubes (610, 710) and the first chamber (630, 730) to a cooling circuit for circulating the cooling liquid through the plurality of cooling tubes (610, 710), wherein the first chamber (630, 730) is positioned between the first connector (620, 720) and the plurality of cooling tubes (610, 710); and a second connector (620, 720) fluidly coupled to the second chamber (630, 730) for fluidly connecting the plurality of cooling tubes (610, 710) and the second chamber (630, 730) to a cooling circuit for circulating the cooling liquid through the plurality of cooling tubes (610, 710), wherein the second chamber (630, 730) is positioned between the second connector (620, 720) and the plurality of cooling tubes (610, 710); characterized in that the height of each of the plurality of cooling tubes (610, 710) is about the height of the one or more in-line memory modules. a manifold comprising a plurality of parallel cooling tubes (610, 710) made of heat-conducting material, wherein each of the plurality of cooling tubes is configured to convey a cooling liquid, wherein each of the plurality of cooling tubes has a first end and a second end, and wherein the plurality of cooling tubes are spaced apart from one another so as to receive at least one in-line memory module between adjacent cooling tubes; a first chamber (630, 730) fluidly coupled to the first ends of the plurality of cooling tubes (610, 710) so that cooling liquid dispenses from the chamber (630, 730) into each of the plurality of cooling tubes (610, 710); a second chamber (630, 730) fluidly coupled to the second ends of the plurality of cooling tubes (610, 710) so that cooling liquid collects from the plurality of cooling tubes (610, 710) into the second chamber; a first connector (620, 720) for fluidly connecting the plurality of cooling tubes (610, 710) and the first chamber (630, 730) to a cooling circuit for circulating the cooling liquid through the plurality of cooling tubes (610, 710), wherein the first chamber (630, 730) is positioned between the first connector (620, 720) and the plurality of cooling tubes (610, 710); and a second connector (620, 720) fluidly coupled to the second chamber (630, 730) for fluidly connecting the plurality of cooling tubes (610, 710) and the second chamber (630, 730) to a cooling circuit for circulating the cooling liquid through the plurality of cooling tubes (610, 710), wherein the second chamber (630, 730) is positioned between the second connector (620, 720) and the plurality of cooling tubes (610, 710); characterized in that the height of each of the plurality of cooling tubes (610, 710) is about the height of the one or more in-line memory modules.