An apparatus comprising: a base configured to receive signals; a stack of first dice including conductive paths at least partly through each die of the stack of first dice; a second die arranged in a stack in a first dimension perpendicular to the base with the stack of first dice and the base, wherein the stack of first dice is located between the base and the second die; a stack of second dice arranged side by side in a second dimension, the second dimension perpendicular to the first dimension with the stack of first dice and in a stack in the first dimension with the second die and the base, wherein the stack of second dice is located between the base and the second die; an interposer and a structure (401,402,403) located outside the stacks of first and second dice (461,462) and the second die and configured to transfer at least one subset of the signals between the base and at least one of the stacks of first and second dice (461,462) and the second die, the structure including a first stack of structure portions, a second stack of structure portions, and a third stack of structure portions, wherein: the interposer is located between the second die and each of the stacks of the first and second dice (461, 462), the first stack of structure portions is located at a first side of the stack of first dice and between the base and the second die, the second stack of structure portions is located at a first side of the stack of second dice and between the base and the second die, the third stack of structure portions is located between the base and the second die, the third stack of structure portions is located at a second side of the stack of first dice and at a second side of the stack of second dice, the stack of third structure portions is directly between the stack of first dice and the stack of second dice, and at least one of the first, second, and third stacks of structure portions (401, 402, 403) includes a via and a conductive path going through the via. a base configured to receive signals; a stack of first dice including conductive paths at least partly through each die of the stack of first dice; a second die arranged in a stack in a first dimension perpendicular to the base with the stack of first dice and the base, wherein the stack of first dice is located between the base and the second die; a stack of second dice arranged side by side in a second dimension, the second dimension perpendicular to the first dimension with the stack of first dice and in a stack in the first dimension with the second die and the base, wherein the stack of second dice is located between the base and the second die; an interposer and a structure (401,402,403) located outside the stacks of first and second dice (461,462) and the second die and configured to transfer at least one subset of the signals between the base and at least one of the stacks of first and second dice (461,462) and the second die, the structure including a first stack of structure portions, a second stack of structure portions, and a third stack of structure portions, wherein: the interposer is located between the second die and each of the stacks of the first and second dice (461, 462), the first stack of structure portions is located at a first side of the stack of first dice and between the base and the second die, the second stack of structure portions is located at a first side of the stack of second dice and between the base and the second die, the third stack of structure portions is located between the base and the second die, the third stack of structure portions is located at a second side of the stack of first dice and at a second side of the stack of second dice, the stack of third structure portions is directly between the stack of first dice and the stack of second dice, and at least one of the first, second, and third stacks of structure portions (401, 402, 403) includes a via and a conductive path going through the via. the interposer is located between the second die and each of the stacks of the first and second dice (461, 462), the first stack of structure portions is located at a first side of the stack of first dice and between the base and the second die, the second stack of structure portions is located at a first side of the stack of second dice and between the base and the second die, the third stack of structure portions is located between the base and the second die, the third stack of structure portions is located at a second side of the stack of first dice and at a second side of the stack of second dice, the stack of third structure portions is directly between the stack of first dice and the stack of second dice, and at least one of the first, second, and third stacks of structure portions (401, 402, 403) includes a via and a conductive path going through the via.