A method of making a component, comprising: providing a digital model of a component to a software program, the software program operable to slice the digital model into digital layers and raster each digital layer into digital segments, the digital segments delineated by digital raster lines; depositing a first layer of powdered material onto a platform; compacting the first layer of powdered material into a first compacted layer; sintering the first compacted layer along lines corresponding to the digital raster lines using a laser, wherein the laser operates at a first power and a first scan speed, the first power being between about 200 and 230 W and the first scan speed is between 2000 and 2500 mm/second (78.74 and 98.43 in/second); and sintering the first compacted layer along a perimeter of the first compacted layer using the laser to form a first unitary layer, wherein the laser operates at a second power and a second scan speed, the second power being between about 100 and 200 W, and the second scan speed is between 250 and 750 mm/second (9.84 and 29.53 in/second); and, thereafter, (a) depositing a second layer of powdered material onto the first unitary layer; (b) compacting the second layer of powered material into a second compacted layer; (c) sintering the second compacted layer along lines corresponding to the digital raster lines using the laser, wherein the laser operates at the first power and the first scan speed; and (d) sintering the second compacted layer along a perimeter of the second compacted layer using the laser to form a second unitary layer, wherein the laser operates at the second power and the second scan speed; repeating steps (a) to (d) until the component has the desired shape, thereby forming the component; subjecting the component to heat treatment performed in a hot isostatic press; wherein the first and second layers of powdered material have a first thickness after their respective depositing steps, and wherein the respective compacting steps compact the first and second layers of powdered material to a second thickness that is by between 40% and 60% of the first thickness, and wherein the second thickness is between 20 and 40 μm (0.79 and 1.57 mil); wherein a distance between the raster lines is between 30 μm and 100 μm (1.18 and 3.94 mils); and wherein the offset includes an outline offset of between about -150 and +150 μm (-5.91 to +5.91 mils) and a Heart offset of between about -150 and +150 μm (-5.91 to +5.91 mils). providing a digital model of a component to a software program, the software program operable to slice the digital model into digital layers and raster each digital layer into digital segments, the digital segments delineated by digital raster lines; depositing a first layer of powdered material onto a platform; compacting the first layer of powdered material into a first compacted layer; sintering the first compacted layer along lines corresponding to the digital raster lines using a laser, wherein the laser operates at a first power and a first scan speed, the first power being between about 200 and 230 W and the first scan speed is between 2000 and 2500 mm/second (78.74 and 98.43 in/second); and sintering the first compacted layer along a perimeter of the first compacted layer using the laser to form a first unitary layer, wherein the laser operates at a second power and a second scan speed, the second power being between about 100 and 200 W, and the second scan speed is between 250 and 750 mm/second (9.84 and 29.53 in/second); and, thereafter, (a) depositing a second layer of powdered material onto the first unitary layer; (b) compacting the second layer of powered material into a second compacted layer; (c) sintering the second compacted layer along lines corresponding to the digital raster lines using the laser, wherein the laser operates at the first power and the first scan speed; and (d) sintering the second compacted layer along a perimeter of the second compacted layer using the laser to form a second unitary layer, wherein the laser operates at the second power and the second scan speed; (a) depositing a second layer of powdered material onto the first unitary layer; (b) compacting the second layer of powered material into a second compacted layer; (c) sintering the second compacted layer along lines corresponding to the digital raster lines using the laser, wherein the laser operates at the first power and the first scan speed; and (d) sintering the second compacted layer along a perimeter of the second compacted layer using the laser to form a second unitary layer, wherein the laser operates at the second power and the second scan speed; repeating steps (a) to (d) until the component has the desired shape, thereby forming the component; subjecting the component to heat treatment performed in a hot isostatic press; wherein the first and second layers of powdered material have a first thickness after their respective depositing steps, and wherein the respective compacting steps compact the first and second layers of powdered material to a second thickness that is by between 40% and 60% of the first thickness, and wherein the second thickness is between 20 and 40 μm (0.79 and 1.57 mil); wherein a distance between the raster lines is between 30 μm and 100 μm (1.18 and 3.94 mils); and wherein the offset includes an outline offset of between about -150 and +150 μm (-5.91 to +5.91 mils) and a Heart offset of between about -150 and +150 μm (-5.91 to +5.91 mils).