A semiconductor processing apparatus, comprising: a micro chamber configured to tightly accommodate and process a semiconductor wafer, the micro chamber including an upper chamber portion (122, 124) defining an upper working surface and a lower chamber portion (126,128) defining a lower working surface, the upper chamber portion and the lower chamber portion being relatively movable between an open position for loading and removing the semiconductor wafer and a closed position for tightly accommodating the semiconductor wafer, wherein, when the upper chamber portion or the lower chamber portion is in the closed position, the micro chamber is configured to allow the semiconductor wafer to be disposed between the upper working surface and the lower working surface, wherein an inner wall of the micro chamber includes gaps thereon, the gaps configured to allow a fluid to flow therein, and wherein at least one of the upper chamber portion or the lower chamber portion includes at least one inlet and at least one outlet, the at least one inlet configured to allow the fluid to enter into the micro chamber, the at least one outlet configured to discharge the fluid out of the micro chamber, wherein the semiconductor processing apparatus further comprises a column device, wherein edges of the upper chamber portion and the lower chamber portion include corresponding column holes, and wherein one of the upper chamber portion and the lower chamber portion is moveable between the open position and the closed position under guidance of the column device running through the column holes, wherein the upper chamber portion includes an upper chamber plate and an upper box device fixed on the column device, wherein the upper chamber plate includes an upper portion supported on the upper box device and a lower portion extending downwardly from the upper portion and passing through a middle cavity of the upper box device, and wherein a lower surface of the lower portion defines the upper working surface of the micro chamber, characterized in that, wherein the semiconductor processing apparatus further comprises bolts and a position correction device, wherein the position correction device includes a correction plate disposed above the upper portion of the upper chamber plate and a top plate fixed on the column device, wherein the top plate includes a plurality of threaded holes through which the bolts exert pressure on the correction plate to adjust the position and the shape of the upper chamber plate. a micro chamber configured to tightly accommodate and process a semiconductor wafer, the micro chamber including an upper chamber portion (122, 124) defining an upper working surface and a lower chamber portion (126,128) defining a lower working surface, the upper chamber portion and the lower chamber portion being relatively movable between an open position for loading and removing the semiconductor wafer and a closed position for tightly accommodating the semiconductor wafer, wherein, when the upper chamber portion or the lower chamber portion is in the closed position, the micro chamber is configured to allow the semiconductor wafer to be disposed between the upper working surface and the lower working surface, wherein an inner wall of the micro chamber includes gaps thereon, the gaps configured to allow a fluid to flow therein, and wherein at least one of the upper chamber portion or the lower chamber portion includes at least one inlet and at least one outlet, the at least one inlet configured to allow the fluid to enter into the micro chamber, the at least one outlet configured to discharge the fluid out of the micro chamber, wherein the semiconductor processing apparatus further comprises a column device, wherein edges of the upper chamber portion and the lower chamber portion include corresponding column holes, and wherein one of the upper chamber portion and the lower chamber portion is moveable between the open position and the closed position under guidance of the column device running through the column holes, wherein the upper chamber portion includes an upper chamber plate and an upper box device fixed on the column device, wherein the upper chamber plate includes an upper portion supported on the upper box device and a lower portion extending downwardly from the upper portion and passing through a middle cavity of the upper box device, and wherein a lower surface of the lower portion defines the upper working surface of the micro chamber, characterized in that, wherein the semiconductor processing apparatus further comprises bolts and a position correction device, wherein the position correction device includes a correction plate disposed above the upper portion of the upper chamber plate and a top plate fixed on the column device, wherein the top plate includes a plurality of threaded holes through which the bolts exert pressure on the correction plate to adjust the position and the shape of the upper chamber plate.