A semiconductor device comprising: a substrate; a semiconductor element that is mounted on the substrate a lead terminal that is connected to a conductor layer on the substrate via a conductive bonding material; a connector that is connected to a control electrode of the semiconductor element and the conductor layer on the substrate via conductive bonding materials (HG, HX); and a sealing portion that seals the substrate, the semiconductor element, and the connector, characterized in that the includes: a reference portion (Xc) a first inclined portion (Xb) that is inclined downward from one end of the reference portion; a bent portion (Xa) that is connected to the first inclined portion (Xb) and bent so as to project downward; and a second inclined portion (Xe) that is inclined downward from the other end of the reference portion, and wherein the connector is connected to the control electrode via a conductive bonding material in a state where a lower end of the bent portion is in contact with the surface of the control electrode; electrode, and furthermore, the connector is connected to the conductor layer via a conductive bonding material in a state where a tip of the second inclined portion (Xf) is in contact with the surface of the conductor layer on the substrate. a substrate; a semiconductor element that is mounted on the substrate a lead terminal that is connected to a conductor layer on the substrate via a conductive bonding material; a connector that is connected to a control electrode of the semiconductor element and the conductor layer on the substrate via conductive bonding materials (HG, HX); and a sealing portion that seals the substrate, the semiconductor element, and the connector, characterized in that the includes: a reference portion (Xc) a first inclined portion (Xb) that is inclined downward from one end of the reference portion; a bent portion (Xa) that is connected to the first inclined portion (Xb) and bent so as to project downward; and a second inclined portion (Xe) that is inclined downward from the other end of the reference portion, and wherein the connector is connected to the control electrode via a conductive bonding material in a state where a lower end of the bent portion is in contact with the surface of the control electrode; electrode, and furthermore, the connector is connected to the conductor layer via a conductive bonding material in a state where a tip of the second inclined portion (Xf) is in contact with the surface of the conductor layer on the substrate. a reference portion (Xc) a first inclined portion (Xb) that is inclined downward from one end of the reference portion; a bent portion (Xa) that is connected to the first inclined portion (Xb) and bent so as to project downward; and a second inclined portion (Xe) that is inclined downward from the other end of the reference portion, and wherein the connector is connected to the control electrode via a conductive bonding material in a state where a lower end of the bent portion is in contact with the surface of the control electrode; electrode, and furthermore, the connector is connected to the conductor layer via a conductive bonding material in a state where a tip of the second inclined portion (Xf) is in contact with the surface of the conductor layer on the substrate.