Heat-curing epoxy resin composition comprising: - a first component K1 containing: - at least one epoxy resin A with, on average, more than one epoxy group per molecule; - a second component K2 containing: - at least one tertiary amine tAM of the formula in which R 1 is an alkylene group with 1 - 20 carbon atoms, which is optionally substituted and optionally exhibits heteroatoms, and n is a value of 1 - 3; - at least one primary amine pAM chosen from the list consisting of 1,3-xylylenediamine (MXDA), 1,4-xylylenediamine (PXDA) and 1,3,5-tris(aminomethyl)benzene, in particular 1,3-xylylenediamine (MXDA), in which the heat-curing epoxy resin composition additionally contains at least one curing agent B for epoxy resins, which is activated by elevated temperature, and in which the ratio of the proportion of tertiary amine tAM in grams per mole of epoxy groups of the epoxy resin A is 2.4 - 19.6 g/mol of epoxy groups, and in which the ratio of the proportion of primary amine pAM in grams per mole of epoxy groups of the epoxy resin A is 6 - 31 g/mol of epoxy groups. - a first component K1 containing: - at least one epoxy resin A with, on average, more than one epoxy group per molecule; - at least one epoxy resin A with, on average, more than one epoxy group per molecule; - a second component K2 containing: - at least one tertiary amine tAM of the formula in which R 1 is an alkylene group with 1 - 20 carbon atoms, which is optionally substituted and optionally exhibits heteroatoms, and n is a value of 1 - 3; - at least one primary amine pAM chosen from the list consisting of 1,3-xylylenediamine (MXDA), 1,4-xylylenediamine (PXDA) and 1,3,5-tris(aminomethyl)benzene, in particular 1,3-xylylenediamine (MXDA), in which the heat-curing epoxy resin composition additionally contains at least one curing agent B for epoxy resins, which is activated by elevated temperature, and in which the ratio of the proportion of tertiary amine tAM in grams per mole of epoxy groups of the epoxy resin A is 2.4 - 19.6 g/mol of epoxy groups, and in which the ratio of the proportion of primary amine pAM in grams per mole of epoxy groups of the epoxy resin A is 6 - 31 g/mol of epoxy groups. - at least one tertiary amine tAM of the formula in which R 1 is an alkylene group with 1 - 20 carbon atoms, which is optionally substituted and optionally exhibits heteroatoms, and n is a value of 1 - 3; - at least one primary amine pAM chosen from the list consisting of 1,3-xylylenediamine (MXDA), 1,4-xylylenediamine (PXDA) and 1,3,5-tris(aminomethyl)benzene, in particular 1,3-xylylenediamine (MXDA), in which the heat-curing epoxy resin composition additionally contains at least one curing agent B for epoxy resins, which is activated by elevated temperature, and in which the ratio of the proportion of tertiary amine tAM in grams per mole of epoxy groups of the epoxy resin A is 2.4 - 19.6 g/mol of epoxy groups, and in which the ratio of the proportion of primary amine pAM in grams per mole of epoxy groups of the epoxy resin A is 6 - 31 g/mol of epoxy groups. in which the heat-curing epoxy resin composition additionally contains at least one curing agent B for epoxy resins, which is activated by elevated temperature, and in which the ratio of the proportion of tertiary amine tAM in grams per mole of epoxy groups of the epoxy resin A is 2.4 - 19.6 g/mol of epoxy groups, and in which the ratio of the proportion of primary amine pAM in grams per mole of epoxy groups of the epoxy resin A is 6 - 31 g/mol of epoxy groups.