A method of manufacturing a three-dimensional multi-layer electronic device, comprising: a unit forming process of forming multi-layer units (218A, 218B, 218C) including an electronic component (96, 98, 99) and a circuit wiring (228, 232) by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out the multi-layer units (218A, 218B, 218C) integrally in a vertical direction, wherein the unit forming process includes: a resin multi-layer forming step of forming multiple resin layers (220, 230, 236) for each multi-layer unit (218A, 218B, 218C) by ejection of ultraviolet curable resin and subsequent flattening and curing of the ultraviolet curable resin, a conductive terminal forming step of forming a conductive terminal in a multi-layer unit (218B, 218C), which is to be an upper multi-layer unit (218B, 218C), for electrical connection to a lower multi-layer unit (218A, 218B) when the multi-layer units are laid out in the vertical direction, and a circuit wiring forming step of forming a circuit wiring (228, 232) for each multi-layer unit (218A, 218B, 218C) by ejection of metal ink according to a wiring circuit pattern and subsequent sintering of the metal ink, wherein the electronic component (96, 98, 99) of a multi-layer unit (218A, 218B), which is to be a lower multi-layer unit (218A, 218B), includes: a connection pin for electrical connection to a conductive terminal of an upper multi-layer unit (218B, 218C) when the multi-layer units are laid out in the vertical direction. a unit forming process of forming multi-layer units (218A, 218B, 218C) including an electronic component (96, 98, 99) and a circuit wiring (228, 232) by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out the multi-layer units (218A, 218B, 218C) integrally in a vertical direction, wherein the unit forming process includes: a resin multi-layer forming step of forming multiple resin layers (220, 230, 236) for each multi-layer unit (218A, 218B, 218C) by ejection of ultraviolet curable resin and subsequent flattening and curing of the ultraviolet curable resin, a conductive terminal forming step of forming a conductive terminal in a multi-layer unit (218B, 218C), which is to be an upper multi-layer unit (218B, 218C), for electrical connection to a lower multi-layer unit (218A, 218B) when the multi-layer units are laid out in the vertical direction, and a circuit wiring forming step of forming a circuit wiring (228, 232) for each multi-layer unit (218A, 218B, 218C) by ejection of metal ink according to a wiring circuit pattern and subsequent sintering of the metal ink, wherein the electronic component (96, 98, 99) of a multi-layer unit (218A, 218B), which is to be a lower multi-layer unit (218A, 218B), includes: a connection pin for electrical connection to a conductive terminal of an upper multi-layer unit (218B, 218C) when the multi-layer units are laid out in the vertical direction. a resin multi-layer forming step of forming multiple resin layers (220, 230, 236) for each multi-layer unit (218A, 218B, 218C) by ejection of ultraviolet curable resin and subsequent flattening and curing of the ultraviolet curable resin, a conductive terminal forming step of forming a conductive terminal in a multi-layer unit (218B, 218C), which is to be an upper multi-layer unit (218B, 218C), for electrical connection to a lower multi-layer unit (218A, 218B) when the multi-layer units are laid out in the vertical direction, and a circuit wiring forming step of forming a circuit wiring (228, 232) for each multi-layer unit (218A, 218B, 218C) by ejection of metal ink according to a wiring circuit pattern and subsequent sintering of the metal ink, wherein the electronic component (96, 98, 99) of a multi-layer unit (218A, 218B), which is to be a lower multi-layer unit (218A, 218B), includes: a connection pin for electrical connection to a conductive terminal of an upper multi-layer unit (218B, 218C) when the multi-layer units are laid out in the vertical direction.