An OLED lighting apparatus having an active area and a non-active area, the OLED lighting apparatus comprising: a buffer layer; an auxiliary wire on the buffer layer; an organic light emitting device, the organic light emitting device comprising a first electrode on the auxiliary wire to be connected to the auxiliary wire, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer; pads in the non-active area, the pads comprising a first pad connected to the first electrode and a second pad connected to the second electrode; an encapsulation layer disposed on the buffer layer to cover the second electrode; and a via electrode passing through the encapsulation layer in the non-active area to be connected to one of the first pad or the second pad, wherein each of the first and second pads comprises: a pad electrode disposed in the same layer as the auxiliary wire and formed of the same material as the auxiliary wire; and a pad electrode terminal disposed on the pad electrode and formed of the same material as the first electrode; wherein the pad electrode terminal is disposed on upper and side surfaces of the pad electrode to surround the upper and side surfaces of the pad electrode, and wherein the via electrode comprises: a penetration portion disposed to pass through the encapsulation layer, one of the first pad or the second pad, and the buffer layer in the non-active area, the penetration portion being connected to one of the first pad or the second pad; and a connection terminal disposed on an upper surface of the encapsulation layer in the non-active area, the connection terminal being connected to the penetration portion. a buffer layer; an auxiliary wire on the buffer layer; an organic light emitting device, the organic light emitting device comprising a first electrode on the auxiliary wire to be connected to the auxiliary wire, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer; pads in the non-active area, the pads comprising a first pad connected to the first electrode and a second pad connected to the second electrode; an encapsulation layer disposed on the buffer layer to cover the second electrode; and a via electrode passing through the encapsulation layer in the non-active area to be connected to one of the first pad or the second pad, wherein each of the first and second pads comprises: a pad electrode disposed in the same layer as the auxiliary wire and formed of the same material as the auxiliary wire; and a pad electrode terminal disposed on the pad electrode and formed of the same material as the first electrode; wherein the pad electrode terminal is disposed on upper and side surfaces of the pad electrode to surround the upper and side surfaces of the pad electrode, and wherein the via electrode comprises: a penetration portion disposed to pass through the encapsulation layer, one of the first pad or the second pad, and the buffer layer in the non-active area, the penetration portion being connected to one of the first pad or the second pad; and a connection terminal disposed on an upper surface of the encapsulation layer in the non-active area, the connection terminal being connected to the penetration portion. a pad electrode disposed in the same layer as the auxiliary wire and formed of the same material as the auxiliary wire; and a pad electrode terminal disposed on the pad electrode and formed of the same material as the first electrode; wherein the pad electrode terminal is disposed on upper and side surfaces of the pad electrode to surround the upper and side surfaces of the pad electrode, and wherein the via electrode comprises: a penetration portion disposed to pass through the encapsulation layer, one of the first pad or the second pad, and the buffer layer in the non-active area, the penetration portion being connected to one of the first pad or the second pad; and a connection terminal disposed on an upper surface of the encapsulation layer in the non-active area, the connection terminal being connected to the penetration portion. a penetration portion disposed to pass through the encapsulation layer, one of the first pad or the second pad, and the buffer layer in the non-active area, the penetration portion being connected to one of the first pad or the second pad; and a connection terminal disposed on an upper surface of the encapsulation layer in the non-active area, the connection terminal being connected to the penetration portion.