A method for producing a printed circuit board with at least one heat radiating structure, comprising the steps of: preparing a printed circuit board having one or more conductor patterns and one or more land portions (16; 17) made of conductive foil formed on one or both surfaces (12a; 12b) of an insulating substrate, having at least one soldering land portion for heat radiation formed on a part of one surface to serve as a mounting surface for an electronic part and at least one land portion for solder absorption formed on the other surface substantially facing the one surface, and formed with one or more viaholes whose opposite ends make openings (24a, 24b) in the soldering land portion for heat radiation and the land portion for solder absorption, placing a metal mask on the one surface and applying cream solder to the one or more land portions (16; 17) and the soldering land portion for heat radiation, placing the electronic part substantially on the one surface, melting the cream solder in a first reflow process to solder-connect lead terminals (20b; 20c) of the electronic part and the one or more respective land portions (16; 17), causing the molten solder at least partly leaking out toward the other surface through the one or more viaholes to at least partly flow to the land portion for solder absorption and substantially adhere to or near the openings in a substantially flat manner, and placing a metal mask on the other surface of the printed circuit board, applying cream solder to the land portion for solder absorption in such a manner as to cover the solder solidified at or near the openings of the viaholes, and the cream solder is melted in a second reflow process to form a solder layer on the land portion for solder absorption, wherein the step of placing the metal mask on the other surface of the printed circuit board comprises: providing the metal mask on the other surface with an opening in a part facing the land portion for solder absorption including the openings of the one or more viaholes, and mounting said metal mask on a solder resist surrounding the land portion for solder absorption, wherein no heat radiating member is being soldered to the land portion for solder absorption by the solder layer on the land portion for solder absorption during the second reflow process. preparing a printed circuit board having one or more conductor patterns and one or more land portions (16; 17) made of conductive foil formed on one or both surfaces (12a; 12b) of an insulating substrate, having at least one soldering land portion for heat radiation formed on a part of one surface to serve as a mounting surface for an electronic part and at least one land portion for solder absorption formed on the other surface substantially facing the one surface, and formed with one or more viaholes whose opposite ends make openings (24a, 24b) in the soldering land portion for heat radiation and the land portion for solder absorption, placing a metal mask on the one surface and applying cream solder to the one or more land portions (16; 17) and the soldering land portion for heat radiation, placing the electronic part substantially on the one surface, melting the cream solder in a first reflow process to solder-connect lead terminals (20b; 20c) of the electronic part and the one or more respective land portions (16; 17), causing the molten solder at least partly leaking out toward the other surface through the one or more viaholes to at least partly flow to the land portion for solder absorption and substantially adhere to or near the openings in a substantially flat manner, and placing a metal mask on the other surface of the printed circuit board, applying cream solder to the land portion for solder absorption in such a manner as to cover the solder solidified at or near the openings of the viaholes, and the cream solder is melted in a second reflow process to form a solder layer on the land portion for solder absorption, providing the metal mask on the other surface with an opening in a part facing the land portion for solder absorption including the openings of the one or more viaholes, and mounting said metal mask on a solder resist surrounding the land portion for solder absorption, wherein no heat radiating member is being soldered to the land portion for solder absorption by the solder layer on the land portion for solder absorption during the second reflow process.