A packaged opto-electronic component module comprising a substrate member forming a bottom wall and vertical side walls of the packaged opto-electronic component; at least one emission member (E1, E2) mounted on said substrate; at least one detecting member mounted on said substrate; an optics member comprising at least one passive optical component, the optics member forming the vertical side walls of the packaged opto-electronic component, wherein said at least one passive optical component comprises at least one optical structure made of a hardened hardenable material and obtained using a replication process; and a non-transparent spacer member arranged between said substrate member and said optics member, the spacer member forming the vertical side walls of the packaged opto-electronic component; characterised in that said packaged opto-electronic component module further comprises a baffle member arranged on a side of the optics member opposite to the spacer member, the baffle member having at least one opening through which light can pass, the baffle member forming the vertical side walls of the packaged opto-electronic component, wherein the baffle member, outside the at least one opening, is made of a material that substantially attenuates or blocks light generally detectable by said at least one detecting member, and wherein a top wall of the packaged opto-electronic component is formed by the baffle member or by the baffle member together with the optics member. a substrate member forming a bottom wall and vertical side walls of the packaged opto-electronic component; at least one emission member (E1, E2) mounted on said substrate; at least one detecting member mounted on said substrate; an optics member comprising at least one passive optical component, the optics member forming the vertical side walls of the packaged opto-electronic component, wherein said at least one passive optical component comprises at least one optical structure made of a hardened hardenable material and obtained using a replication process; and a non-transparent spacer member arranged between said substrate member and said optics member, the spacer member forming the vertical side walls of the packaged opto-electronic component; an optics member comprising at least one passive optical component, the optics member forming the vertical side walls of the packaged opto-electronic component, wherein said at least one passive optical component comprises at least one optical structure made of a hardened hardenable material and obtained using a replication process; and a non-transparent spacer member arranged between said substrate member and said optics member, the spacer member forming the vertical side walls of the packaged opto-electronic component; characterised in that said packaged opto-electronic component module further comprises a baffle member arranged on a side of the optics member opposite to the spacer member, the baffle member having at least one opening through which light can pass, the baffle member forming the vertical side walls of the packaged opto-electronic component, wherein the baffle member, outside the at least one opening, is made of a material that substantially attenuates or blocks light generally detectable by said at least one detecting member, and wherein a top wall of the packaged opto-electronic component is formed by the baffle member or by the baffle member together with the optics member.