A radiation shielding integrated circuit device, comprising: a base; a first x-ray shielding tub comprising a bottom portion and a sidewall, said first x-ray shielding tub being coupled to a first side of the base, an integrated circuit die being inside and coupled to the first x-ray shielding tub, the sidewall extending above the die; a second x-ray shielding tub comprising a bottom portion and a sidewall, said second x-ray shielding tub being coupled to the opposite side of the base, a further integrated circuit die being inside and coupled to the second x-ray shielding tub, the sidewall extending above the further integrated circuit die; a first radiation shielding lid shielding x-ray and ionizing radiation coupled to the base, said first radiation shielding lid and first x-ray shielding tub being positioned such that, with said sidewall, there is no line of sight angle at which the x-rays could reach the integrated circuit die and the integrated circuit die is shielded from x-rays from every angle; a second radiation shielding lid shielding x-ray and ionizing radiation coupled to the base, said second radiation shielding lid and second x-ray shielding tub being positioned such that, with said sidewall, there is no line of sight angle at which the x-rays could reach the further integrated circuit die and the further integrated circuit die is shielded from x-rays from every angle; wherein the first and second radiation shielding lids (202, 204) shield the integrated circuit die and the further integrated circuit die from ionizing radiation in excess of the total dose tolerances of the integrated circuit die and the further integrated circuit die and the first x-ray shielding tub and the second x-ray shielding tub are thinner than required to shield the integrated circuit die and the further integrated circuit die from ionizing radiation in excess of the total dose tolerances of the integrated circuit die and the further integrated circuit die, and the first and second x-ray shielding tubs (210, 212) and the first and second radiation shielding lids (202, 204) shield the integrated circuit die and the further integrated circuit die respectively from x-rays in excess of the total dose tolerance and the dose rate tolerance of the respective die. a base; a first x-ray shielding tub comprising a bottom portion and a sidewall, said first x-ray shielding tub being coupled to a first side of the base, an integrated circuit die being inside and coupled to the first x-ray shielding tub, the sidewall extending above the die; a second x-ray shielding tub comprising a bottom portion and a sidewall, said second x-ray shielding tub being coupled to the opposite side of the base, a further integrated circuit die being inside and coupled to the second x-ray shielding tub, the sidewall extending above the further integrated circuit die; a first radiation shielding lid shielding x-ray and ionizing radiation coupled to the base, said first radiation shielding lid and first x-ray shielding tub being positioned such that, with said sidewall, there is no line of sight angle at which the x-rays could reach the integrated circuit die and the integrated circuit die is shielded from x-rays from every angle; a second radiation shielding lid shielding x-ray and ionizing radiation coupled to the base, said second radiation shielding lid and second x-ray shielding tub being positioned such that, with said sidewall, there is no line of sight angle at which the x-rays could reach the further integrated circuit die and the further integrated circuit die is shielded from x-rays from every angle; wherein the first and second radiation shielding lids (202, 204) shield the integrated circuit die and the further integrated circuit die from ionizing radiation in excess of the total dose tolerances of the integrated circuit die and the further integrated circuit die and the first x-ray shielding tub and the second x-ray shielding tub are thinner than required to shield the integrated circuit die and the further integrated circuit die from ionizing radiation in excess of the total dose tolerances of the integrated circuit die and the further integrated circuit die, and the first and second x-ray shielding tubs (210, 212) and the first and second radiation shielding lids (202, 204) shield the integrated circuit die and the further integrated circuit die respectively from x-rays in excess of the total dose tolerance and the dose rate tolerance of the respective die.