A flip-chip bonding device, comprising: a supply unit, configured to separate a flip-chip from a carrier and to supply the flip-chip, the supply unit comprising a flipping device for picking up and flipping over the flip-chip separated from the carrier so that the flip-chip is turned downside up; a transfer unit configured to receive and retain the flip-chip from the flipping device, the transfer unit being able to retain multiple flip-chips; a position adjustment unit, configured to adjust positions of the flip-chips on the transfer unit, wherein the position adjustment unit comprises a first measurement system and a position adjustment device, the first measurement system configured to measure the positions of the flip-chips on the transfer unit, the position adjustment device configured to adjust the positions of the flip-chips on the transfer unit; a bonding unit, configured to bond the flip-chips on the transfer unit onto a substrate; a transportation unit, configured to transport the transfer unit in a horizontal X-direction; and a control unit, configured to control movements of the respective units (10,20,30,40,50), wherein the supply unit, the position adjustment unit and the bonding unit are disposed sequentially along the horizontal X-direction, wherein the position adjustment device comprises a support mechanism, a first moving mechanism and a first absorption mechanism, the support mechanism configured to support the first moving mechanism, the first moving mechanism configured to move the first absorption mechanism to a location corresponding to one of the flip-chips on the transfer unit, the first absorption mechanism configured to absorb the flip-chip from the transfer unit. a supply unit, configured to separate a flip-chip from a carrier and to supply the flip-chip, the supply unit comprising a flipping device for picking up and flipping over the flip-chip separated from the carrier so that the flip-chip is turned downside up; a transfer unit configured to receive and retain the flip-chip from the flipping device, the transfer unit being able to retain multiple flip-chips; a position adjustment unit, configured to adjust positions of the flip-chips on the transfer unit, wherein the position adjustment unit comprises a first measurement system and a position adjustment device, the first measurement system configured to measure the positions of the flip-chips on the transfer unit, the position adjustment device configured to adjust the positions of the flip-chips on the transfer unit; a bonding unit, configured to bond the flip-chips on the transfer unit onto a substrate; a transportation unit, configured to transport the transfer unit in a horizontal X-direction; and a control unit, configured to control movements of the respective units (10,20,30,40,50), wherein the supply unit, the position adjustment unit and the bonding unit are disposed sequentially along the horizontal X-direction, wherein the position adjustment device comprises a support mechanism, a first moving mechanism and a first absorption mechanism, the support mechanism configured to support the first moving mechanism, the first moving mechanism configured to move the first absorption mechanism to a location corresponding to one of the flip-chips on the transfer unit, the first absorption mechanism configured to absorb the flip-chip from the transfer unit.