A thermoelectric device comprising: a first substrate; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately disposed on the first substrate; a second substrate disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a plurality of first electrodes disposed between the first substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and respectively having a pair of P-type thermoelectric leg and N-type thermoelectric leg disposed therein; and a plurality of second electrodes disposed between the second substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and respectively having a pair of P-type thermoelectric leg and N-type thermoelectric leg disposed therein, wherein a pair of P-type solder layer and N-type solder layer and a barrier layer disposed between the pair of P-type solder layer and N-type solder layer are disposed on each of the plurality of first electrodes, a pair of P-type solder layer and N-type solder layer and a barrier layer disposed between the pair of P-type solder layer and N-type solder layer are disposed on each of the plurality of second electrodes, each of the P-type thermoelectric legs directly comes into contact with each of the P-type solder layers, and each of the N-type thermoelectric legs directly comes into contact with each of the N-type solder layers, characterized in that a melting point of the barrier layer is greater than a melting point of each of the pair of P-type solder layer and N-type solder layer, that each of the barrier layers has an insulation property, and that an adhesive resin layer is further provided between the first substrate and the plurality of first electrodes. a first substrate; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately disposed on the first substrate; a second substrate disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a plurality of first electrodes disposed between the first substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and respectively having a pair of P-type thermoelectric leg and N-type thermoelectric leg disposed therein; and a plurality of second electrodes disposed between the second substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and respectively having a pair of P-type thermoelectric leg and N-type thermoelectric leg disposed therein, wherein a pair of P-type solder layer and N-type solder layer and a barrier layer disposed between the pair of P-type solder layer and N-type solder layer are disposed on each of the plurality of first electrodes, a pair of P-type solder layer and N-type solder layer and a barrier layer disposed between the pair of P-type solder layer and N-type solder layer are disposed on each of the plurality of second electrodes, each of the P-type thermoelectric legs directly comes into contact with each of the P-type solder layers, and each of the N-type thermoelectric legs directly comes into contact with each of the N-type solder layers, characterized in that a melting point of the barrier layer is greater than a melting point of each of the pair of P-type solder layer and N-type solder layer, that each of the barrier layers has an insulation property, and that an adhesive resin layer is further provided between the first substrate and the plurality of first electrodes.