Method for solder connecting at least one electronic component to at least one carrier plate, the carrier plate having at least one carrier plate contact face (2, 2a, 2b) and the electronic component having at least one component contact face corresponding thereto, the at least one carrier plate contact face (2, 2a, 2b) being surrounded by at least one solder resist layer which delimits the at least one carrier plate contact face (2, 2a, 2b), wherein in the solder resist layer at least one channel-like recess is provided, having at least one auxiliary contact face (3a, 3b) formed therethrough, which contacts the at least one carrier plate contact face (2, 2a, 2b), wherein at least the carrier plate contact face (2, 2a, 2b), the component contact face and the auxiliary contact face (3a, 3b) have wettable surfaces, the method comprising the following steps: a) applying solder paste to the at least one carrier plate contact face (2, 2a, 2b) and beyond the latter, wherein the entire auxiliary contact face (3a, 3b) is covered with solder paste and solder paste is applied beyond the auxiliary contact face (3a, 3b), wherein the area that is covered with solder paste beyond the auxiliary contact face (3a, 3b) has an area of at least 100%, more preferably at least 200%, of the area of the auxiliary contact face (3a, 3b), b) equipping the carrier plate (2, 2a, 2b) with the at least one electronic component, the component contact face at least partially covering the carrier plate contact face (2, 2a, 2b) corresponding thereto, and the auxiliary contact face extending beyond the region thus covered, the carrier plate contact face (2, 2a, 2b) being completely covered by the electronic component, c) heating the solder material so as to produce a solder connection between the carrier plate and the at least one electronic component, characterized in that during or after step b) the at least one electronic component is additionally fixed to the carrier plate by means of adhesive dots on at least one corner of the electronic component, wherein the hardening temperature of the adhesive dots is below the melting temperature of a solder paste applied to the carrier plate contact face, wherein the electronic component comprises a QFN housing. a) applying solder paste to the at least one carrier plate contact face (2, 2a, 2b) and beyond the latter, wherein the entire auxiliary contact face (3a, 3b) is covered with solder paste and solder paste is applied beyond the auxiliary contact face (3a, 3b), wherein the area that is covered with solder paste beyond the auxiliary contact face (3a, 3b) has an area of at least 100%, more preferably at least 200%, of the area of the auxiliary contact face (3a, 3b), b) equipping the carrier plate (2, 2a, 2b) with the at least one electronic component, the component contact face at least partially covering the carrier plate contact face (2, 2a, 2b) corresponding thereto, and the auxiliary contact face extending beyond the region thus covered, the carrier plate contact face (2, 2a, 2b) being completely covered by the electronic component, c) heating the solder material so as to produce a solder connection between the carrier plate and the at least one electronic component, characterized in that during or after step b) the at least one electronic component is additionally fixed to the carrier plate by means of adhesive dots on at least one corner of the electronic component, wherein the hardening temperature of the adhesive dots is below the melting temperature of a solder paste applied to the carrier plate contact face, wherein the electronic component comprises a QFN housing.