A multi-sensor assembly, comprising: a first temperature sensor, having a first thermal profile, the first temperature sensor mounted in a first circuit and coupled to one side of an adhesive layer, the other side of the adhesive layer coupled to a first lead frame; a second temperature sensor, having a second thermal profile different from the first thermal profile, the second temperature sensor mounted in a second circuit and coupled to one side of an isolation layer, the other side of the isolation layer coupled to a second lead frame, thereby forming a side-by-side first and second temperature sensor configuration; wherein the first and second temperature sensors (106, 406) include a first heat path input coupled to an ambient environment, and a second heat path (412, 414) input coupled to a second heat source through the lead-frames (416, 418); wherein the second temperature sensor is coupled to the second heat path (412, 414) input through the isolation layer; wherein the first temperature sensor is not coupled to the second heat path (412, 414) input through the isolation layer; and wherein the first and second temperature sensors (106, 406) are not coupled to the first heat path input through the isolation layer; wherein: a thermal resistance of the isolation layer is greater than that of a thermal resistance of the adhesive layer; and the first circuit has a different area or thickness and resulting heat capacity than the second circuit, such that the thermal profile of the first temperature sensor differs from the thermal profile of the second temperature sensor by at least a ratio of 2-to-1; and wherein the first and second temperature sensors (106, 406) and first and second lead-frames (416, 418) are included in a single multi-sensor assembly. a first temperature sensor, having a first thermal profile, the first temperature sensor mounted in a first circuit and coupled to one side of an adhesive layer, the other side of the adhesive layer coupled to a first lead frame; a second temperature sensor, having a second thermal profile different from the first thermal profile, the second temperature sensor mounted in a second circuit and coupled to one side of an isolation layer, the other side of the isolation layer coupled to a second lead frame, thereby forming a side-by-side first and second temperature sensor configuration; wherein the first and second temperature sensors (106, 406) include a first heat path input coupled to an ambient environment, and a second heat path (412, 414) input coupled to a second heat source through the lead-frames (416, 418); wherein the second temperature sensor is coupled to the second heat path (412, 414) input through the isolation layer; wherein the first temperature sensor is not coupled to the second heat path (412, 414) input through the isolation layer; and wherein the first and second temperature sensors (106, 406) are not coupled to the first heat path input through the isolation layer; wherein: a thermal resistance of the isolation layer is greater than that of a thermal resistance of the adhesive layer; and the first circuit has a different area or thickness and resulting heat capacity than the second circuit, a thermal resistance of the isolation layer is greater than that of a thermal resistance of the adhesive layer; and the first circuit has a different area or thickness and resulting heat capacity than the second circuit, such that the thermal profile of the first temperature sensor differs from the thermal profile of the second temperature sensor by at least a ratio of 2-to-1; and wherein the first and second temperature sensors (106, 406) and first and second lead-frames (416, 418) are included in a single multi-sensor assembly.