A multi-chip module with inter-chip optical communications capability, comprising: a semiconductor package; a substrate within the semiconductor package; a first semiconductor chip including logic circuitry within the semiconductor package, the first semiconductor chip electrically coupled to the substrate; a second semiconductor chip including logic circuitry within the semiconductor package, the second semiconductor chip electrically coupled to the substrate; a first LED coupled to the first semiconductor chip within the semiconductor package; first circuitry within the semiconductor package for driving the first LED based on signals of the logic circuitry of the first semiconductor chip; at least one waveguide; a first photodetector within the semiconductor package optically coupled to the first LED by the at least one waveguide, the first photodetector electrically coupled to the logic circuitry of the second semiconductor chip; a second LED coupled to the second semiconductor chip within the semiconductor package; second circuitry within the semiconductor package for driving the second LED based on signals of the logic circuitry of the second semiconductor chip; and a second photodetector within the semiconductor package optically coupled to the second LED and electrically coupled to the logic circuitry of the first semiconductor chip; characterised in that the first LED is bonded to the first semiconductor chip and the second LED is bonded to the second semiconductor chip; in that the first photodetector is fabricated in silicon and on a surface of the second semiconductor chip and the second photodetector is fabricated in silicon and on a surface of the first semiconductor, and in that the first LED and the second LED are microLEDs. a semiconductor package; a substrate within the semiconductor package; a first semiconductor chip including logic circuitry within the semiconductor package, the first semiconductor chip electrically coupled to the substrate; a second semiconductor chip including logic circuitry within the semiconductor package, the second semiconductor chip electrically coupled to the substrate; a first LED coupled to the first semiconductor chip within the semiconductor package; first circuitry within the semiconductor package for driving the first LED based on signals of the logic circuitry of the first semiconductor chip; at least one waveguide; a first photodetector within the semiconductor package optically coupled to the first LED by the at least one waveguide, the first photodetector electrically coupled to the logic circuitry of the second semiconductor chip; a second LED coupled to the second semiconductor chip within the semiconductor package; second circuitry within the semiconductor package for driving the second LED based on signals of the logic circuitry of the second semiconductor chip; and a second photodetector within the semiconductor package optically coupled to the second LED and electrically coupled to the logic circuitry of the first semiconductor chip; characterised in that the first LED is bonded to the first semiconductor chip and the second LED is bonded to the second semiconductor chip; in that the first photodetector is fabricated in silicon and on a surface of the second semiconductor chip and the second photodetector is fabricated in silicon and on a surface of the first semiconductor, and in that the first LED and the second LED are microLEDs.