A light-emitting device package, comprising: a first lead frame; a second lead frame separated from the first lead frame along a y-axis; a package body having a cavity exposing a portion of a front surface of the first and of the second lead frame, wherein the package body includes an insulation layer disposed between the first lead frame and the second lead frame to electrically insulate the first lead frame and the second lead frame from each other; a light-emitting diode disposed in a first device area defined as an area of the exposed portion of the second lead frame and having a first and a second electrode electrically connected to the respective first and second lead frame; a Zener diode disposed in a second device area of a top surface of the first lead frame, wherein the package body further includes a first portion disposed between the Zener diode and the light-emitting diode wherein a thickness of the first portion is greater than a thickness of the Zener diode; a first wire having a first end connected to the light-emitting diode and a second end connected to the first lead frame; a second wire having a first end connected to the light-emitting diode, and a second end connected to the second lead frame; and a third wire having a first end connected to the Zener diode and a second end connected to the second lead frame, the third wire being connected to the second lead frame in a third bonding area, wherein the third bonding area is exposed through a third groove, which is included in the package body, and is extended from the first device area along a x-axis perpendicular to the y-axis, wher ein the cavity has an inclined surface forming a second acute angle (θ2) with the top surface of the second lead frame such that the cavity has a width along the y-axis that increases with increasing distance from the top surface of the second lead frame wherein the lower end of the inclined surface is spaced apart by a predetermined distance from the light-emitting diode, wherein a reflectance of the inclined surface is greater than a reflectance of each of the first lead frame and the second lead frame, wherein a second/third blind hole (TH2, TH3) is formed in the inclined surface of the cavity to expose the Zener diode to which one end of the third wire is connected, the second/third blind hole (TH2, TH3) being formed to be inclined by a first acute angle (θ1) with the top surface of the first lead frame, wherein the second device area is exposed through the second/third blind hole (TH2, TH3), wherein the second/third blind hole (TH2, TH3) is spaced apart from the exposed portion of the second lead frame, along the y-axis, by a distance greater than or equal to 50 μm, wherein the top surface of the first lead frame, the top surface of the second lead frame, and a top surface of the insulation layer are disposed in a same plane, and wherein the third wire is disposed on the first portion of the package body. a first lead frame; a second lead frame separated from the first lead frame along a y-axis; a package body having a cavity exposing a portion of a front surface of the first and of the second lead frame, wherein the package body includes an insulation layer disposed between the first lead frame and the second lead frame to electrically insulate the first lead frame and the second lead frame from each other; a light-emitting diode disposed in a first device area defined as an area of the exposed portion of the second lead frame and having a first and a second electrode electrically connected to the respective first and second lead frame; a Zener diode disposed in a second device area of a top surface of the first lead frame, wherein the package body further includes a first portion disposed between the Zener diode and the light-emitting diode wherein a thickness of the first portion is greater than a thickness of the Zener diode; a first wire having a first end connected to the light-emitting diode and a second end connected to the first lead frame; a second wire having a first end connected to the light-emitting diode, and a second end connected to the second lead frame; and a third wire having a first end connected to the Zener diode and a second end connected to the second lead frame, the third wire being connected to the second lead frame in a third bonding area, wherein the third bonding area is exposed through a third groove, which is included in the package body, and is extended from the first device area along a x-axis perpendicular to the y-axis, wher