A light emitting apparatus comprising: a support member; a printed circuit board having an opening and a circuit pattern on the support member; and a light emitting diode device package electrically connected with the printed circuit board and making contact with the support member through the opening, wherein the light emitting diode device package comprises: a package body having a cavity; first and second frames each including a first part exposed in the cavity and a second part exposed to the outside of the package body; a third frame disposed on a bottom surface of the cavity and electrically and physically separated from the first and second frames; a light emitting diode device disposed on the third frame; and wires (51,53) electrically connecting the first and second frames with the light emitting diode device, wherein a bottom surface of the third frame is aligned in line with a bottom surface of the package body, wherein a top surface of the third frame comprises a first plane having a first height, a second plane having a second height lower than the first height, the light emitting device is disposed on the second plane, wherein a part of the package body is inserted in the opening of the printed circuit board, wherein the bottom surface of the package body and the third frame contact with the support member through the opening of the printed circuit board, wherein the second part of the first frame and the second part of the second frame contact with the circuit pattern of the printed circuit board, wherein a thickness between the bottom surface of the package body and the first frame is the same as a thickness of the printed circuit board. a support member; a printed circuit board having an opening and a circuit pattern on the support member; and a light emitting diode device package electrically connected with the printed circuit board and making contact with the support member through the opening, wherein the light emitting diode device package comprises: a package body having a cavity; first and second frames each including a first part exposed in the cavity and a second part exposed to the outside of the package body; a third frame disposed on a bottom surface of the cavity and electrically and physically separated from the first and second frames; a light emitting diode device disposed on the third frame; and wires (51,53) electrically connecting the first and second frames with the light emitting diode device, wherein a bottom surface of the third frame is aligned in line with a bottom surface of the package body, wherein a top surface of the third frame comprises a first plane having a first height, a second plane having a second height lower than the first height, the light emitting device is disposed on the second plane, wherein a part of the package body is inserted in the opening of the printed circuit board, wherein the bottom surface of the package body and the third frame contact with the support member through the opening of the printed circuit board, wherein the second part of the first frame and the second part of the second frame contact with the circuit pattern of the printed circuit board, wherein a thickness between the bottom surface of the package body and the first frame is the same as a thickness of the printed circuit board. a package body having a cavity; first and second frames each including a first part exposed in the cavity and a second part exposed to the outside of the package body; a third frame disposed on a bottom surface of the cavity and electrically and physically separated from the first and second frames; a light emitting diode device disposed on the third frame; and wires (51,53) electrically connecting the first and second frames with the light emitting diode device, wherein a bottom surface of the third frame is aligned in line with a bottom surface of the package body, wherein a top surface of the third frame comprises a first plane having a first height, a second plane having a second height lower than the first height, the light emitting device is disposed on the second plane, wherein a part of the package body is inserted in the opening of the printed circuit board, wherein the bottom surface of the package body and the third frame contact with the support member through the opening of the printed circuit board, wherein the second part of the first frame and the second part of the second frame contact with the circuit pattern of the printed circuit board, wherein a thickness between the bottom surface of the package body and the first frame is the same as a thickness of the printed circuit board.