An electrode plate comprising a current collector (10, 20) and an electrode active material layer (12, 22) disposed on at least one surface of the current collector (10, 20), wherein the current collector (10, 20) comprises a support layer (101, 201) and a conductive layer (102, 202) disposed on at least one surface of the support layer(101, 201), the conductive layer (102, 202) has a single-sided thickness D2 that satisfies: 30 nm≤D2 ≤3 μm, the conductive layer (102, 202) is a metal conductive layer, and the metal conductive layer comprises a material that is selected from at least one of aluminum, copper, titanium, silver, and aluminum-zirconium alloy or from a combination of nickel or nickel copper alloy with at least one of aluminum, copper, titanium, silver, and aluminum-zirconium alloy; wherein a conductive primer layer (11, 21) containing a first conductive material and a binder is provided between the current collector (10, 20) and the electrode active material layer (12, 22), and the first conductive material in the conductive primer layer (11, 21) comprises at least one of a one-dimensional conductive material and a two-dimensional conductive material; wherein the first conductive material is present in a weight percentage of 10% to 99%, and the binder is present in a weight percentage of 1% to 90% based on the total weight of the conductive primer layer (11, 21); wherein based on the total weight of the first conductive material, the first conductive material comprises 5 wt% to 50 wt% of at least one of the one-dimensional conductive material and the two-dimensional conductive material, and 50 wt% to 95 wt% of other conductive materials; and wherein the conductive layer (102, 202) is further provided with a protective layer (103, 203) on its surface, the protective layer (103, 203) is a metal protective layer or a metal oxide protective layer, in which the metal protective layer comprises a material that is selected from at least one of nickel, chromium, nickel alloy and chromium alloy, the protective layer (103, 203) being provided on one surface of the conductive layer (102, 202) of the current collector (10, 20) facing the support layer (101, 201) or on both surfaces of the conductive layers (102, 202) of the current collector (10, 20); and wherein the conductive primer layer (11, 21) has a single-side thickness H of 0.1 to 5 μm and H/D2 is 0.5:1 to 5:1. wherein the current collector (10, 20) comprises a support layer (101, 201) and a conductive layer (102, 202) disposed on at least one surface of the support layer(101, 201), the conductive layer (102, 202) has a single-sided thickness D2 that satisfies: 30 nm≤D2 ≤3 μm, the conductive layer (102, 202) is a metal conductive layer, and the metal conductive layer comprises a material that is selected from at least one of aluminum, copper, titanium, silver, and aluminum-zirconium alloy or from a combination of nickel or nickel copper alloy with at least one of aluminum, copper, titanium, silver, and aluminum-zirconium alloy; wherein a conductive primer layer (11, 21) containing a first conductive material and a binder is provided between the current collector (10, 20) and the electrode active material layer (12, 22), and the first conductive material in the conductive primer layer (11, 21) comprises at least one of a one-dimensional conductive material and a two-dimensional conductive material; wherein the first conductive material is present in a weight percentage of 10% to 99%, and the binder is present in a weight percentage of 1% to 90% based on the total weight of the conductive primer layer (11, 21); wherein based on the total weight of the first conductive material, the first conductive material comprises 5 wt% to 50 wt% of at least one of the one-dimensional conductive material and the two-dimensional conductive material, and 50 wt% to 95 wt% of other conductive materials; and wherein the conductive layer (102, 202) is further provided with a protective layer (103, 203) on its surface, the protective layer (103, 203) is a metal protective layer or a metal oxide protective layer, in which the metal protective layer comprises a material that is selected from at least one of nickel, chromium, nickel alloy and chromium alloy, the protective layer (103, 203) being provided on one surface of the conductive layer (102, 202) of the current collector (10, 20) facing the support layer (101, 201) or on both surfaces of the conductive layers (102, 202) of the current collector (10, 20); and wherein the conductive primer layer (11, 21) has a single-side thickness H of 0.1 to 5 μm and H/D2 is 0.5:1 to 5:1.