An image-capturing unit comprising: a transparent substrate on which light is incident, and that has a first wire pattern; an image-capturing chip that includes a first surface on which a plurality of pixels that perform photoelectric conversion on incident light are arranged, and a second surface on which an output terminal for outputting a pixel signal read from each of the plurality of pixels is arranged, the second surface being on the opposite side of the first surface; a mounting substrate, on which the image-capturing chip is arranged, and that has a third wire pattern provided on a surface of the mounting substrate facing the image-capturing chip, said third wire pattern being electrically connected to the output terminal; a connecting section that is arranged on the mounting substrate and that surrounds a periphery of the image-capturing chip, the connecting section having a first bump which electrically connects the first wire pattern to the third wire pattern, the connecting section further having an adhesive agent surrounding the first bump and surrounding the periphery of the image-capturing chip, the connecting section being attached to the transparent substrate by said adhesive agent; a plurality of signal processing chips arranged in parallel with the image-capturing chip, each signal processing chip being connected to the first wire pattern via a respective second bump and including a processing circuit that processes the pixel signal input through the first wire pattern, the signal processing chips being arranged in a peripheral region of the transparent substrate outside a region covered by the pixels and the mounting substrate, wherein the signal processing chips are arranged at a position distanced from the image-capturing chip, wherein the transparent substrate, the image-capturing chip and the mounting substrate have different heat expansion coefficients with each other, and a difference between a heat expansion coefficient of the mounting substrate and a heat expansion coefficient of the transparent substrate is less than a difference between a heat expansion coefficient of the image-capturing chip and the heat expansion coefficient of the transparent substrate. a transparent substrate on which light is incident, and that has a first wire pattern; an image-capturing chip that includes a first surface on which a plurality of pixels that perform photoelectric conversion on incident light are arranged, and a second surface on which an output terminal for outputting a pixel signal read from each of the plurality of pixels is arranged, the second surface being on the opposite side of the first surface; a mounting substrate, on which the image-capturing chip is arranged, and that has a third wire pattern provided on a surface of the mounting substrate facing the image-capturing chip, said third wire pattern being electrically connected to the output terminal; a connecting section that is arranged on the mounting substrate and that surrounds a periphery of the image-capturing chip, the connecting section having a first bump which electrically connects the first wire pattern to the third wire pattern, the connecting section further having an adhesive agent surrounding the first bump and surrounding the periphery of the image-capturing chip, the connecting section being attached to the transparent substrate by said adhesive agent; a plurality of signal processing chips arranged in parallel with the image-capturing chip, each signal processing chip being connected to the first wire pattern via a respective second bump and including a processing circuit that processes the pixel signal input through the first wire pattern, the signal processing chips being arranged in a peripheral region of the transparent substrate outside a region covered by the pixels and the mounting substrate, wherein the signal processing chips are arranged at a position distanced from the image-capturing chip, wherein the transparent substrate, the image-capturing chip and the mounting substrate have different heat expansion coefficients with each other, and a difference between a heat expansion coefficient of the mounting substrate and a heat expansion coefficient of the transparent substrate is less than a difference between a heat expansion coefficient of the image-capturing chip and the heat expansion coefficient of the transparent substrate.