A wafer table structure providing a wafer table surface, the wafer table structure comprising: a base tray comprising a plurality of first exposed upper surfaces (108, 122), an interior surface, and a plurality of compartments formed integrally with or attached to the interior surface, the base tray formed of at least one type of material that is gas or fluid impermeable in response to applied negative pressures; a plurality of ridges that separates individual compartments within the plurality of compartments from each other, wherein the plurality of first exposed upper surfaces (108,122) of the base tray includes exposed upper surfaces of the plurality of ridges, and wherein each ridge within the plurality of ridges is dimensioned in a manner corresponding to a standard wafer size and/or a standard film frame size; a single plurality of ejector pin guide members through which a single plurality of ejector pins can travel for handling wafers of multiple standard sizes, wherein each of the single plurality of ejector pin guide members is formed in an innermost ridge within the plurality of ridges, and protrudes into portions of an innermost compartment within the plurality of compartments; at least one type of compartment material disposed within the plurality of compartments, the at least one type of compartment material conformable to the plurality of compartments and hardenable to provide a hardened compartment material in the plurality of compartments that is gas or fluid permeable in response to applied vacuum forces, and which provides a plurality of second exposed upper surfaces; and a plurality of openings formed in the interior surface of the base tray, by which the hardened compartment material is exposable to negative pressures or positive pressures, wherein (a) the plurality of first exposed upper surfaces (108, 122) of the base tray and (b) the plurality of second exposed upper surfaces of the hardened compartment material are simultaneously machinable by way of a common machining process to provide a planar wafer table surface for carrying wafers and film frames, wherein the wafer table surface is suitable for handling wafers, portions of wafers, and/or film frames on which wafers or portions thereof are mounted. a base tray comprising a plurality of first exposed upper surfaces (108, 122), an interior surface, and a plurality of compartments formed integrally with or attached to the interior surface, the base tray formed of at least one type of material that is gas or fluid impermeable in response to applied negative pressures; a plurality of ridges that separates individual compartments within the plurality of compartments from each other, wherein the plurality of first exposed upper surfaces (108,122) of the base tray includes exposed upper surfaces of the plurality of ridges, and wherein each ridge within the plurality of ridges is dimensioned in a manner corresponding to a standard wafer size and/or a standard film frame size; a single plurality of ejector pin guide members through which a single plurality of ejector pins can travel for handling wafers of multiple standard sizes, wherein each of the single plurality of ejector pin guide members is formed in an innermost ridge within the plurality of ridges, and protrudes into portions of an innermost compartment within the plurality of compartments; at least one type of compartment material disposed within the plurality of compartments, the at least one type of compartment material conformable to the plurality of compartments and hardenable to provide a hardened compartment material in the plurality of compartments that is gas or fluid permeable in response to applied vacuum forces, and which provides a plurality of second exposed upper surfaces; and a plurality of openings formed in the interior surface of the base tray, by which the hardened compartment material is exposable to negative pressures or positive pressures, wherein (a) the plurality of first exposed upper surfaces (108, 122) of the base tray and (b) the plurality of second exposed upper surfaces of the hardened compartment material are simultaneously machinable by way of a common machining process to provide a planar wafer table surface for carrying wafers and film frames, wherein the wafer table surface is suitable for handling wafers, portions of wafers, and/or film frames on which wafers or portions thereof are mounted.