An electrical enclosure system for efficient heat dissipation, comprising: an electrical heat-generating device having at least one hot portion, the hot portion generating more heat than at least one other portion of the heat-generating device; and a ventless housing enclosing the electrical heat-generating device and including a first layer forming a structural portion of the ventless housing, the first layer including a first side and an opposite second side, a second layer covering open area of the first side of the first layer and forming a first heat-flow path of the ventless housing, the second layer being adapted to conduct more heat than the first layer from the hot portion to an environment exterior of the ventless housing, characterized in that each of the first side and second side has one or more open areas near the hot portion of the electrical heat-generating device, and a third layer covering open area of the second side of the first layer and forming a second heat-flow path of the ventless housing, the second heat-flow path conducting heat away from the heat-generating part towards the exterior environment in an opposite direction than the first heat-flow path, the third layer being adapted to conduct more heat than the first layer, wherein the third layer is molded in a substantially parallel and overlapping manner to an internal surface of the second side, the third layer completely covering any open areas of the second side such that heat is conducted through the third layer, and wherein the second layer is molded in a substantially parallel and overlapping manner to an internal surface of the first side, the second layer completely covering any open areas of the first side such that heat is conducted through the second layer. an electrical heat-generating device having at least one hot portion, the hot portion generating more heat than at least one other portion of the heat-generating device; and a ventless housing enclosing the electrical heat-generating device and including a first layer forming a structural portion of the ventless housing, the first layer including a first side and an opposite second side, a second layer covering open area of the first side of the first layer and forming a first heat-flow path of the ventless housing, the second layer being adapted to conduct more heat than the first layer from the hot portion to an environment exterior of the ventless housing, characterized in that each of the first side and second side has one or more open areas near the hot portion of the electrical heat-generating device, and a third layer covering open area of the second side of the first layer and forming a second heat-flow path of the ventless housing, the second heat-flow path conducting heat away from the heat-generating part towards the exterior environment in an opposite direction than the first heat-flow path, the third layer being adapted to conduct more heat than the first layer, wherein the third layer is molded in a substantially parallel and overlapping manner to an internal surface of the second side, the third layer completely covering any open areas of the second side such that heat is conducted through the third layer, and wherein the second layer is molded in a substantially parallel and overlapping manner to an internal surface of the first side, the second layer completely covering any open areas of the first side such that heat is conducted through the second layer.