An apparatus comprising: a power semiconductor circuit; a molding compound that at least partially encapsulates the power semiconductor circuit; and a power terminal assembly including: a first power supply terminal aligned along a first plane, the first power supply terminal being operatively coupled with the power semiconductor circuit; a second power supply terminal aligned along a second plane, the second power supply terminal being operatively coupled with the power semiconductor circuit; and a monolithic power supply terminal frame including: an isolation portion disposed between the first power supply terminal and the second power supply terminal; and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal, the retention portion affixing the first power supply terminal to a first side of the isolation portion and affixing the second power supply terminal to a second side of the isolation portion such that the second plane is parallel to the first plane and at least a portion of the first power supply terminal and at least a portion of the isolation portion are vertically aligned with a portion of the second power supply terminal along an axis that is orthogonal to the first plane and the second plane; wherein a first portion of the power terminal assembly is encapsulated in the molding compound and a second portion of the power terminal assembly is disposed outside the molding compound, such that a first portion of the monolithic power supply terminal frame is disposed within the molding compound and a second portion of the monolithic power supply terminal frame is disposed outside the molding compound. a power semiconductor circuit; a molding compound that at least partially encapsulates the power semiconductor circuit; and a power terminal assembly including: a first power supply terminal aligned along a first plane, the first power supply terminal being operatively coupled with the power semiconductor circuit; a second power supply terminal aligned along a second plane, the second power supply terminal being operatively coupled with the power semiconductor circuit; and a monolithic power supply terminal frame including: an isolation portion disposed between the first power supply terminal and the second power supply terminal; and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal, the retention portion affixing the first power supply terminal to a first side of the isolation portion and affixing the second power supply terminal to a second side of the isolation portion such that the second plane is parallel to the first plane and at least a portion of the first power supply terminal and at least a portion of the isolation portion are vertically aligned with a portion of the second power supply terminal along an axis that is orthogonal to the first plane and the second plane; a first power supply terminal aligned along a first plane, the first power supply terminal being operatively coupled with the power semiconductor circuit; a second power supply terminal aligned along a second plane, the second power supply terminal being operatively coupled with the power semiconductor circuit; and a monolithic power supply terminal frame including: an isolation portion disposed between the first power supply terminal and the second power supply terminal; and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal, the retention portion affixing the first power supply terminal to a first side of the isolation portion and affixing the second power supply terminal to a second side of the isolation portion such that the second plane is parallel to the first plane and at least a portion of the first power supply terminal and at least a portion of the isolation portion are vertically aligned with a portion of the second power supply terminal along an axis that is orthogonal to the first plane and the second plane; an isolation portion disposed between the first power supply terminal and the second power supply terminal; and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal, the retention portion affixing the first power supply terminal to a first side of the isolation portion and affixing the second power supply terminal to a second side of the isolation portion such that the second plane is parallel to the first plane and at least a portion of the first power supply terminal and at least a portion of the isolation portion are vertically aligned with a portion of the second power supply terminal along an axis that is orthogonal to the first plane and the second plane; wherein a first portion of the power terminal assembly is encapsulated in the molding compound and a second portion of the power terminal assembly is disposed outside the molding compound, such that a first portion of the monolithic power supply terminal frame is disposed within the molding compound and a second portion of the monolithic power supply terminal frame is disposed outside the molding compound.