A method of manufacturing an insulation substrate that has a conductive pattern provided on a first surface of a ceramics substrate formed of AIN, Al 2 O 3, Si 3 N 4 or SiC, and a metal layer formed of pure Al or an Al alloy having a thickness of 0.1 to 2 mm provided on a second surface of the ceramics substrate, the method comprising: (a) a conductive pattern member forming process of cutting a plate material formed of pure Al or an Al alloy in its thickness direction by a cutting processing, whereby the cut surface obtained becomes a rising surface, and thereby forming a conductive pattern member having a lower part in rising direction/front side in cutting direction and an upper part in rising direction/rear side in cutting direction, wherein the surface ten point average roughness R Z of the front side in cutting direction/lower part in rising direction is 30 μm or more, and the surface ten point average roughness Rz of the rear side in cutting direction/upper part in rising direction is 30 μm or less, provided that the surface roughness of the lower part in rising direction/front side in cutting direction is larger than the surface roughness of the upper part in rising direction/rear side in cutting direction; (b) a placing process of placing the conductive pattern member on the surface of the ceramics substrate through a brazing filler metal formed of Al-Si or Al-Ge, such that the rising surface rises from the surface of the ceramics substrate from the front side in cutting direction/lower part in rising direction to the rear side in cutting direction/upper part in rising direction, to form a laminate; and (c) a joining process of pressing the laminate in a state where the laminate is heated in lamination direction, and joining the ceramics substrate and the conductive pattern member by the brazing filler metal so that the brazing filler metal is melted in a state where the front end of the front side in the cutting direction/lower part in rising direction at the rising surface of the conductor and the brazing filler metal are closely adhered to each other, wherein the brazing filler metal is melted and then cured, wherein the brazing filler metal in the melted state including the brazing filler metal at a peripheral portion of the front end of the conductor is aggregated by the surface tension at the front side in cutting direction/lower part in rising direction of the rising surface, and wherein the brazing filler metal gradually goes up toward the rear side in cutting direction/upper part in rising direction of the rising surface. (a) a conductive pattern member forming process of cutting a plate material formed of pure Al or an Al alloy in its thickness direction by a cutting processing, whereby the cut surface obtained becomes a rising surface, and thereby forming a conductive pattern member having a lower part in rising direction/front side in cutting direction and an upper part in rising direction/rear side in cutting direction, wherein the surface ten point average roughness R Z of the front side in cutting direction/lower part in rising direction is 30 μm or more, and the surface ten point average roughness Rz of the rear side in cutting direction/upper part in rising direction is 30 μm or less, provided that the surface roughness of the lower part in rising direction/front side in cutting direction is larger than the surface roughness of the upper part in rising direction/rear side in cutting direction; (b) a placing process of placing the conductive pattern member on the surface of the ceramics substrate through a brazing filler metal formed of Al-Si or Al-Ge, such that the rising surface rises from the surface of the ceramics substrate from the front side in cutting direction/lower part in rising direction to the rear side in cutting direction/upper part in rising direction, to form a laminate; and (c) a joining process of pressing the laminate in a state where the laminate is heated in lamination direction, and joining the ceramics substrate and the conductive pattern member by the brazing filler metal so that the brazing filler metal is melted in a state where the front end of the front side in the cutting direction/lower part in rising direction at the rising surface of the conductor and the brazing filler metal are closely adhered to each other,