Method for separating a solid body layer, in particular a solid body wafer, from a solid body, wherein the method comprises: providing a solid body, generating modifications in the interior of the solid body by means of LASER beams which penetrate into the solid body via an irradiation surface, wherein a crack guide region is predefined by the modifications, along which the solid body layer is separated from the solid body, characterized by: removing material of the solid body in the longitudinal direction of the solid body, which is orthogonal or substantially orthogonal to the irradiation surface, wherein the crack guide region is exposed by the material removal, and separating the solid body layer from the solid body, wherein the solid body is weakened in the crack guide region by the modifications in such a way that the solid body layer detaches from the solid body as a result of the material removal, or wherein such a number of modifications is generated after the material removal that the solid body is weakened in the crack guide region in such a way that the solid body layer detaches from the solid body, or wherein a stress-generating layer is generated or arranged on a surface of the solid body oriented at an angle to the circumferential surface and mechanical stresses are generated in the solid body by a thermal application of the solid body layer, wherein a crack for separating a solid body layer arises as a result of the mechanical stresses, which propagates along the modifications starting from the surface of the solid body exposed by the material removal, or wherein the solid body is thermally exposed, in particular cooled, after the generation of the modifications and the solid body layer detaches from the solid body along the crack guide region as a result of the thermal application. providing a solid body, generating modifications in the interior of the solid body by means of LASER beams which penetrate into the solid body via an irradiation surface, wherein a crack guide region is predefined by the modifications, along which the solid body layer is separated from the solid body, characterized by: removing material of the solid body in the longitudinal direction of the solid body, which is orthogonal or substantially orthogonal to the irradiation surface, wherein the crack guide region is exposed by the material removal, and separating the solid body layer from the solid body, wherein the solid body is weakened in the crack guide region by the modifications in such a way that the solid body layer detaches from the solid body as a result of the material removal, or wherein such a number of modifications is generated after the material removal that the solid body is weakened in the crack guide region in such a way that the solid body layer detaches from the solid body, or wherein a stress-generating layer is generated or arranged on a surface of the solid body oriented at an angle to the circumferential surface and mechanical stresses are generated in the solid body by a thermal application of the solid body layer, wherein a crack for separating a solid body layer arises as a result of the mechanical stresses, which propagates along the modifications starting from the surface of the solid body exposed by the material removal, or wherein the solid body is thermally exposed, in particular cooled, after the generation of the modifications and the solid body layer detaches from the solid body along the crack guide region as a result of the thermal application. removing material of the solid body in the longitudinal direction of the solid body, which is orthogonal or substantially orthogonal to the irradiation surface, wherein the crack guide region is exposed by the material removal, and separating the solid body layer from the solid body, wherein the solid body is weakened in the crack guide region by the modifications in such a way that the solid body layer detaches from the solid body as a result of the material removal, or wherein such a number of modifications is generated after the material removal that the solid body is weakened in the crack guide region in such a way that the solid body layer detaches from the solid body, or wherein a stress-generating layer is generated or arranged on a surface of the solid body oriented at an angle to the circumferential surface and mechanical stresses are generated in the solid body by a thermal application of the solid body layer, wherein a crack for separating a solid body layer arises as a result of the mechanical stresses, which propagates along the modifications starting from the surface of the solid body exposed by the material removal, or wherein the solid body is thermally exposed, in particular cooled, after the generation of the modifications and the solid body layer detaches from the solid body along the crack guide region as a result of the thermal application.