A printed circuit board comprising three-phase switch elements and a thermistor element, the printed circuit board further comprising: a copper foil layer to form a circuit pattern on a base layer; and an insulation layer laminated on the copper foil layer, wherein the circuit pattern includes: an inverter unit including three-phase switch elements (s1, s2, s3, s4, s5, s6) each soldered to a solder pattern (sp1, sp2, sp3, sp4, sp5, sp6); the solder pattern (sp1, sp2, sp3, sp4, sp5, sp6), to which an inverter switch element (s1, s2, s3, s4, s5, s6) is soldered to supply drive power to a motor; a heat radiation pattern (hp1, hp2) spaced apart from the solder pattern (sp1, sp2, sp3, sp4, sp5, sp6) and to contact with one surface of the inverter switch element so as to absorb and radiate heat in the inverter switch element; a heat circulation pattern, through which the heat absorbed from the heat radiation pattern is circulated; and an element pattern formed on both sides of the heat circulation pattern where the thermistor element (NTC1 or PTC), a resistance value of which is varied according to the heat, is soldered to the element pattern; characterized by a heat measurement pattern to measure the heat based on the variable resistance value of the thermistor element (NTC1 or PTC), wherein the thermistor element (NTC or PTC) is disposed on the heat circulation pattern so as to vertically overlap the heat circulation pattern, wherein the thermistor element is located close to any one switch element among the three-phase switch elements; wherein the thermistor element (NTC or PTC) includes: first and second conductor portion soldered to the element pattern; and an insulator portion (a) disposed on the heat circulation pattern such that a resistance value thereof is varied by the heat, and wherein a distance between the first and second conductor portions or a width (d) of the insulator portion is greater than a width (b) of the heat circulation pattern. a copper foil layer to form a circuit pattern on a base layer; and an insulation layer laminated on the copper foil layer, wherein the circuit pattern includes: an inverter unit including three-phase switch elements (s1, s2, s3, s4, s5, s6) each soldered to a solder pattern (sp1, sp2, sp3, sp4, sp5, sp6); the solder pattern (sp1, sp2, sp3, sp4, sp5, sp6), to which an inverter switch element (s1, s2, s3, s4, s5, s6) is soldered to supply drive power to a motor; a heat radiation pattern (hp1, hp2) spaced apart from the solder pattern (sp1, sp2, sp3, sp4, sp5, sp6) and to contact with one surface of the inverter switch element so as to absorb and radiate heat in the inverter switch element; a heat circulation pattern, through which the heat absorbed from the heat radiation pattern is circulated; and an element pattern formed on both sides of the heat circulation pattern where the thermistor element (NTC1 or PTC), a resistance value of which is varied according to the heat, is soldered to the element pattern; an inverter unit including three-phase switch elements (s1, s2, s3, s4, s5, s6) each soldered to a solder pattern (sp1, sp2, sp3, sp4, sp5, sp6); the solder pattern (sp1, sp2, sp3, sp4, sp5, sp6), to which an inverter switch element (s1, s2, s3, s4, s5, s6) is soldered to supply drive power to a motor; a heat radiation pattern (hp1, hp2) spaced apart from the solder pattern (sp1, sp2, sp3, sp4, sp5, sp6) and to contact with one surface of the inverter switch element so as to absorb and radiate heat in the inverter switch element; a heat circulation pattern, through which the heat absorbed from the heat radiation pattern is circulated; and an element pattern formed on both sides of the heat circulation pattern where the thermistor element (NTC1 or PTC), a resistance value of which is varied according to the heat, is soldered to the element pattern; characterized by a heat measurement pattern to measure the heat based on the variable resistance value of the thermistor element (NTC1 or PTC), wherein the thermistor element (NTC or PTC) is disposed on the heat circulation pattern so as to vertically overlap the heat circulation pattern, wherein the thermistor element is located close to any one switch element among the three-phase switch elements; wherein the thermistor element (NTC or PTC) includes: first and second conductor portion soldered to the element pattern; and an insulator portion (a) disposed on the heat circulation pattern such that a resistance value thereof is varied by the heat, and wherein a distance between the first and second conductor portions or a width (d) of the insulator portion is greater than a width (b) of the heat circulation pattern. first and second conductor portion soldered to the element pattern; and an insulator portion (a) disposed on the heat circulation pattern such that a resistance value thereof is varied by the heat, and wherein a distance between the first and second conductor portions or a width (d) of the insulator portion is greater than a width (b) of the heat circulation pattern.