A method, comprising: providing a sculptured electrically conductive laminar structure having spaces therein, the laminar structure including at least one die pad having a first die pad surface configured to have at least one semiconductor chip mounted thereon as well as a second die pad surface opposite the first die pad surface, and molding pre-mold material onto the laminar structure, wherein the pre-mold material penetrates into said spaces and provides a laminar pre-molded substrate (PLF, 10, 12) including said first die pad surface left exposed by the pre-mold material with the peripheral edge of the at least one die pad bordering on the pre-mold material molded onto the laminar structure, characterized in that the method comprises providing along the peripheral edge of the at least one die pad an alternation of: first anchoring formations of the at least one die pad to the pre-mold material, the first anchoring formations configured to counter first detachment forces inducing displacement of the at least one die pad with respect to the pre-mold material in a first direction from the second die pad surface to the first die pad surface; and second anchoring formations of the at least one die pad to the pre-mold material, the second anchoring formations configured to counter second detachment forces inducing displacement of the at least one die pad with respect to the pre-mold material in a second direction from the first die pad surface to the second die pad surface. providing a sculptured electrically conductive laminar structure having spaces therein, the laminar structure including at least one die pad having a first die pad surface configured to have at least one semiconductor chip mounted thereon as well as a second die pad surface opposite the first die pad surface, and molding pre-mold material onto the laminar structure, wherein the pre-mold material penetrates into said spaces and provides a laminar pre-molded substrate (PLF, 10, 12) including said first die pad surface left exposed by the pre-mold material with the peripheral edge of the at least one die pad bordering on the pre-mold material molded onto the laminar structure, characterized in that the method comprises providing along the peripheral edge of the at least one die pad an alternation of: first anchoring formations of the at least one die pad to the pre-mold material, the first anchoring formations configured to counter first detachment forces inducing displacement of the at least one die pad with respect to the pre-mold material in a first direction from the second die pad surface to the first die pad surface; and second anchoring formations of the at least one die pad to the pre-mold material, the second anchoring formations configured to counter second detachment forces inducing displacement of the at least one die pad with respect to the pre-mold material in a second direction from the first die pad surface to the second die pad surface. first anchoring formations of the at least one die pad to the pre-mold material, the first anchoring formations configured to counter first detachment forces inducing displacement of the at least one die pad with respect to the pre-mold material in a first direction from the second die pad surface to the first die pad surface; and second anchoring formations of the at least one die pad to the pre-mold material, the second anchoring formations configured to counter second detachment forces inducing displacement of the at least one die pad with respect to the pre-mold material in a second direction from the first die pad surface to the second die pad surface.