A dynamic pattern transfer printing system comprising: at least one laser scanner configured to illuminate with at least one laser beam a source substrate that comprises a plurality of trenches arranged in a first pattern and holding printing paste, wherein the source substrate is configured to release the printing paste from the trenches and onto a receiving substrate upon the illumination by the laser beam, a moveable stage supporting the receiving substrate, wherein the receiving substrate is affixed to the moveable stage during the releasing of the printing paste from the source substrate, and a controller configured to control the laser beam illumination along the trenches, and at a scanning direction across the trenches, characterised in that the controller is further configured to move the moveable stage to yield a second pattern of deposited paste on the receiving substrate, which is different from the first pattern of trenches on the source substrate wherein the first pattern of trenches on the source substrate has a first pitch (p 1) and the second pattern of deposited paste on the receiving substrate has a second pitch (p 2) and wherein the controller is configured to move the moveable stage in at least one of: the scanning direction, to yield the second pattern on the receiving substrate, wherein the first pitch (p 1), the second pitch (p 2), a forward speed of the moveable stage (v F) and a scanner speed across the trenches (v S) are configured to have the relation p 2 =p 1 ·(v S -v F)/v S to make the second pitch smaller than the first pitch (p 2 <p 1); and/or against the scanning direction, to yield the second pattern on the receiving substrate, wherein the first pitch (p 1), the second pitch (p 2), a backward speed of the moveable stage (v B) and a scanner speed across the trenches (v S) are configured to have the relation p 2 =p 1 ·(v S +v B)/v S to make the second pitch larger than the first pitch (p 2 >p 1). at least one laser scanner configured to illuminate with at least one laser beam a source substrate that comprises a plurality of trenches arranged in a first pattern and holding printing paste, wherein the source substrate is configured to release the printing paste from the trenches and onto a receiving substrate upon the illumination by the laser beam, a moveable stage supporting the receiving substrate, wherein the receiving substrate is affixed to the moveable stage during the releasing of the printing paste from the source substrate, and a controller configured to control the laser beam illumination along the trenches, and at a scanning direction across the trenches, characterised in that the controller is further configured to move the moveable stage to yield a second pattern of deposited paste on the receiving substrate, which is different from the first pattern of trenches on the source substrate wherein the first pattern of trenches on the source substrate has a first pitch (p 1) and the second pattern of deposited paste on the receiving substrate has a second pitch (p 2) and wherein the controller is configured to move the moveable stage in at least one of: the scanning direction, to yield the second pattern on the receiving substrate, wherein the first pitch (p 1), the second pitch (p 2), a forward speed of the moveable stage (v F) and a scanner speed across the trenches (v S) are configured to have the relation p 2 =p 1 ·(v S -v F)/v S to make the second pitch smaller than the first pitch (p 2 <p 1); and/or against the scanning direction, to yield the second pattern on the receiving substrate, wherein the first pitch (p 1), the second pitch (p 2), a backward speed of the moveable stage (v B) and a scanner speed across the trenches (v S) are configured to have the relation p 2 =p 1 ·(v S +v B)/v S to make the second pitch larger than the first pitch (p 2 >p 1). the scanning direction, to yield the second pattern on the receiving substrate, wherein the first pitch (p 1), the second pitch (p 2), a forward speed of the moveable stage (v F) and a scanner speed across the trenches (v S) are configured to have the relation p 2 =p 1 ·(v S -v F)/v S to make the second pitch smaller than the first pitch (p 2 <p 1); and/or against the scanning direction, to yield the second pattern on the receiving substrate, wherein the first pitch (p 1), the second pitch (p 2), a backward speed of the moveable stage (v B) and a scanner speed across the trenches (v S) are configured to have the relation p 2 =p 1 ·(v S +v B)/v S to make the second pitch larger than the first pitch (p 2 >p 1).