Method for producing optical components, comprising the following method steps: - providing a deformation element which, at least in one region, contains or consists of glass and/or a glass-like material, and a carrier, - bringing the deformation element into contact with the carrier, whereby at least one first contact surface is formed between the deformation element and the carrier, - applying a functional element to the deformation element in such a way that at least one second contact surface is formed between the functional element and the deformation element, said at least one second contact surface at least partially overlapping the first contact surface, so that, by way of that region of the deformation element which is formed between the overlapping regions (16a, 16b) of the two contact surfaces (6, 7), at least one deformation region is formed, - heating and deforming at least a part of the deformation region in such a way that the functional element is at least regionally displaced and/or inclined in relation to the carrier, - connecting the functional element to the deformation element during the method step of applying the functional element to the deformation element and/or during the method step of heating and deforming the deformation region, characterized in that A) the deformation element is a wafer, or in that the deformation element is provided by separation from and/or by structuring of a wafer, and B) in that the deformation region is of frame-shaped form and/or there are formed at least two deformation regions which are in contact with the same functional element, and/or in that the overlapping region of the second contact surface corresponds approximately to the second contact surface. - providing a deformation element which, at least in one region, contains or consists of glass and/or a glass-like material, and a carrier, - bringing the deformation element into contact with the carrier, whereby at least one first contact surface is formed between the deformation element and the carrier, - applying a functional element to the deformation element in such a way that at least one second contact surface is formed between the functional element and the deformation element, said at least one second contact surface at least partially overlapping the first contact surface, so that, by way of that region of the deformation element which is formed between the overlapping regions (16a, 16b) of the two contact surfaces (6, 7), at least one deformation region is formed, - heating and deforming at least a part of the deformation region in such a way that the functional element is at least regionally displaced and/or inclined in relation to the carrier, - connecting the functional element to the deformation element during the method step of applying the functional element to the deformation element and/or during the method step of heating and deforming the deformation region, A) the deformation element is a wafer, or in that the deformation element is provided by separation from and/or by structuring of a wafer, and B) in that the deformation region is of frame-shaped form and/or there are formed at least two deformation regions which are in contact with the same functional element, and/or in that the overlapping region of the second contact surface corresponds approximately to the second contact surface.