A method of manufacturing a light emitting module, the method comprising: providing a light guiding plate having a first main surface serving as a light emitting surface, and a second main surface opposite to the first main surface, the second main surface defining a plurality of recesses formed thereon, and a plurality of light emitting element units, each bonded to the plurality of recesses of the light guiding plate to bond the plurality of light emitting element units at predetermined positions on the light guiding plate, and each comprising a light emitting element having a light emission surface and comprising an electrode, a light adjustment portion containing a fluorescent material, the light emitting element being integrally bonded to the light adjustment portion, and a first encapsulating resin which has outer lateral surfaces flush with outer lateral surfaces of the light adjustment portion, the first encapsulating resin embedding the light emitting element; fixing the light emitting element units to the light guiding plate by bonding the light adjustment portions to the recesses, the light emission surface of the light emitting elements being flush with the second main surface of the light guiding plate, forming a bonding wall with a bonding agent supplied in a ring gap formed between inner lateral surfaces of the recess and outer lateral surfaces of an insertion portion of the light emitting element unit disposed in the recess, the insertion portion having an outline smaller than an inner surface outline of the recess, a second encapsulating resin for embedding the light emitting element unit being provided on the second main surface of the light guiding plate, the second encapsulating resin being provided between the first encapsulating resins of adjacent light emitting element units; and forming an electrically conductive film on the electrodes of the light emitting elements, on the surface of the first encapsulating resin and on the surface of the second encapsulating resin. providing a light guiding plate having a first main surface serving as a light emitting surface, and a second main surface opposite to the first main surface, the second main surface defining a plurality of recesses formed thereon, and a plurality of light emitting element units, each bonded to the plurality of recesses of the light guiding plate to bond the plurality of light emitting element units at predetermined positions on the light guiding plate, and each comprising a light emitting element having a light emission surface and comprising an electrode, a light adjustment portion containing a fluorescent material, the light emitting element being integrally bonded to the light adjustment portion, and a first encapsulating resin which has outer lateral surfaces flush with outer lateral surfaces of the light adjustment portion, the first encapsulating resin embedding the light emitting element; a light emitting element having a light emission surface and comprising an electrode, a light adjustment portion containing a fluorescent material, the light emitting element being integrally bonded to the light adjustment portion, and a first encapsulating resin which has outer lateral surfaces flush with outer lateral surfaces of the light adjustment portion, the first encapsulating resin embedding the light emitting element; fixing the light emitting element units to the light guiding plate by bonding the light adjustment portions to the recesses, the light emission surface of the light emitting elements being flush with the second main surface of the light guiding plate, forming a bonding wall with a bonding agent supplied in a ring gap formed between inner lateral surfaces of the recess and outer lateral surfaces of an insertion portion of the light emitting element unit disposed in the recess, the insertion portion having an outline smaller than an inner surface outline of the recess, a second encapsulating resin for embedding the light emitting element unit being provided on the second main surface of the light guiding plate, the second encapsulating resin being provided between the first encapsulating resins of adjacent light emitting element units; and forming an electrically conductive film on the electrodes of the light emitting elements, on the surface of the first encapsulating resin and on the surface of the second encapsulating resin.