A system for additive manufacture, the system comprising: a. mechanized stripping apparatus configured to (i) receive pre-stripping substrate comprising substrate-waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; and (ii) to transform the pre-stripping substrate into post-stripping substrate by selectively stripping away the substrate-waste portion(s) from the substrate-retained portion(s); b. a stacking station configured to add an object-layer of the post-stripping substrate to a stack of previously-stacked object-layers so as to grow the stack of object-layers; and c. a substrate handling arrangement configured to: (i) transport previously-cut substrate to the mechanized stripping apparatus; and (ii) to transport post-stripping substrate from the mechanized stripping apparatus to the stacking station, wherein the mechanized stripping apparatus, the stacking station and the stacking handling arrangement are configured to repeat the stripping, the substrate-transporting and the adding to further grow the stack, and wherein the system further comprises a bonding device configured to bond the stacked object-layers to build a three-dimensional object therefrom, characterized in that, (i) the substrate handling arrangement is adapted to horizontally support a flat, thin substrate so as to define a substrate-plane; and (ii) the stripping apparatus includes at least one flexible and/or soft impact-element and a rotation-drive positioned and configured to rotate the flexible impact-element around a rotation-axis so as to repeatedly drive a peripheral portion of the impact-element across the substrate-plane. a. mechanized stripping apparatus configured to (i) receive pre-stripping substrate comprising substrate-waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; and (ii) to transform the pre-stripping substrate into post-stripping substrate by selectively stripping away the substrate-waste portion(s) from the substrate-retained portion(s); (i) receive pre-stripping substrate comprising substrate-waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; and (ii) to transform the pre-stripping substrate into post-stripping substrate by selectively stripping away the substrate-waste portion(s) from the substrate-retained portion(s); b. a stacking station configured to add an object-layer of the post-stripping substrate to a stack of previously-stacked object-layers so as to grow the stack of object-layers; and c. a substrate handling arrangement configured to: (i) transport previously-cut substrate to the mechanized stripping apparatus; and (ii) to transport post-stripping substrate from the mechanized stripping apparatus to the stacking station, wherein the mechanized stripping apparatus, the stacking station and the stacking handling arrangement are configured to repeat the stripping, the substrate-transporting and the adding to further grow the stack, and wherein the system further comprises a bonding device configured to bond the stacked object-layers to build a three-dimensional object therefrom, characterized in that, (i) the substrate handling arrangement is adapted to horizontally support a flat, thin substrate so as to define a substrate-plane; and (ii) the stripping apparatus includes at least one flexible and/or soft impact-element and a rotation-drive positioned and configured to rotate the flexible impact-element around a rotation-axis so as to repeatedly drive a peripheral portion of the impact-element across the substrate-plane. (i) transport previously-cut substrate to the mechanized stripping apparatus; and (ii) to transport post-stripping substrate from the mechanized stripping apparatus to the stacking station, (i) the substrate handling arrangement is adapted to horizontally support a flat, thin substrate so as to define a substrate-plane; and (ii) the stripping apparatus includes at least one flexible and/or soft impact-element and a rotation-drive positioned and configured to rotate the flexible impact-element around a rotation-axis so as to repeatedly drive a peripheral portion of the impact-element across the substrate-plane.