A solar cell module comprising: a plurality of back contact solar cells each including a crystalline semiconductor substrate having a first conductivity type; a passivation layer on a back surface of the crystalline semiconductor substrate; a plurality of emitter regions positioned on the passivation layer and forming a pn junction and a hetero junction with the crystalline semiconductor substrate; a plurality of back surface field regions positioned on the passivation layer, spaced apart from the plurality of emitter regions and forming a hetero junction with the crystalline semiconductor substrate; a plurality of first electrodes electrically connected to the plurality of emitter regions and extending in a first direction; and a plurality of second electrodes electrically connected to the plurality of back surface field regions and extending in the first direction; an interconnector which is positioned between two adjacent back contact solar cells, extends in a direction perpendicular to the first direction and electrically connects the plurality of first electrodes of one cell of the two adjacent back contact solar cells and the plurality of second electrodes of the other cell of the two adjacent back contact solar cells; a plurality of first conductive adhesive films positioned between a contact part of the plurality of first electrodes of one of the two adjacent back contact solar cells and the interconnector; a plurality of second conductive adhesive films positioned between a contact part of the plurality of second electrodes of the other of the two adjacent back contact solar cells and the interconnector; a front encapsulant and a back encapsulant configured to protect the plurality of back contact solar cells; a transparent member positioned on the front encapsulant on front surfaces of the substrates of the plurality of back contact solar cells; and a back sheet positioned under the back encapsulant on the back surfaces of the substrates of the plurality of back contact solar cells, characterized in that, the plurality of emitter regions and the plurality of back surface field regions are formed of amorphous silicon, each of the first conductive adhesive film and the second conductive adhesive film is formed of conductive particles dispersed into a resin, and the interconnector is electrically contacted with the first conductive adhesive film and the second conductive adhesive film. a plurality of back contact solar cells each including a crystalline semiconductor substrate having a first conductivity type; a passivation layer on a back surface of the crystalline semiconductor substrate; a plurality of emitter regions positioned on the passivation layer and forming a pn junction and a hetero junction with the crystalline semiconductor substrate; a plurality of back surface field regions positioned on the passivation layer, spaced apart from the plurality of emitter regions and forming a hetero junction with the crystalline semiconductor substrate; a plurality of first electrodes electrically connected to the plurality of emitter regions and extending in a first direction; and a plurality of second electrodes electrically connected to the plurality of back surface field regions and extending in the first direction; an interconnector which is positioned between two adjacent back contact solar cells, extends in a direction perpendicular to the first direction and electrically connects the plurality of first electrodes of one cell of the two adjacent back contact solar cells and the plurality of second electrodes of the other cell of the two adjacent back contact solar cells; a plurality of first conductive adhesive films positioned between a contact part of the plurality of first electrodes of one of the two adjacent back contact solar cells and the interconnector; a plurality of second conductive adhesive films positioned between a contact part of the plurality of second electrodes of the other of the two adjacent back contact solar cells and the interconnector; a front encapsulant and a back encapsulant configured to protect the plurality of back contact solar cells; a transparent member positioned on the front encapsulant on front surfaces of the substrates of the plurality of back contact solar cells; and a back sheet positioned under the back encapsulant on the back surfaces of the substrates of the plurality of back contact solar cells, characterized in that, the plurality of emitter regions and the plurality of back surface field regions are formed of amorphous silicon, each of the first conductive adhesive film and the second conductive adhesive film is formed of conductive particles dispersed into a resin, and the interconnector is electrically contacted with the first conductive adhesive film and the second conductive adhesive film.