An apparatus that is configured to: communicate with a screen printer configured to apply solder paste to a substrate on which a stencil mask is disposed, and communicate with a solder inspection device configured to measure a state of the solder paste applied to the substrate, the apparatus comprising a processor configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a plurality of first regions on the substrate based on the first information, each of the plurality of first regions corresponding to each of the plurality of pads; determine a plurality of second regions on the substrate based on the second information, each of the plurality of second regions corresponding to each piece of the solder paste applied to each of the plurality of pads; determine a plurality of cross regions in which the plurality of first regions and the plurality of second regions overlap each other; determine a first cross area ratio of an entire area of the plurality of cross regions to an entire area of the plurality of first regions; determine a position correction value that maximizes the first cross area ratio; and deliver the position correction value to the screen printer, wherein the plurality of pads on the substrate includes at least two pads having different sizes and shapes. communicate with a screen printer configured to apply solder paste to a substrate on which a stencil mask is disposed, and communicate with a solder inspection device configured to measure a state of the solder paste applied to the substrate, the apparatus comprising a processor configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a plurality of first regions on the substrate based on the first information, each of the plurality of first regions corresponding to each of the plurality of pads; determine a plurality of second regions on the substrate based on the second information, each of the plurality of second regions corresponding to each piece of the solder paste applied to each of the plurality of pads; determine a plurality of cross regions in which the plurality of first regions and the plurality of second regions overlap each other; determine a first cross area ratio of an entire area of the plurality of cross regions to an entire area of the plurality of first regions; determine a position correction value that maximizes the first cross area ratio; and deliver the position correction value to the screen printer, wherein the plurality of pads on the substrate includes at least two pads having different sizes and shapes. obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a plurality of first regions on the substrate based on the first information, each of the plurality of first regions corresponding to each of the plurality of pads; determine a plurality of second regions on the substrate based on the second information, each of the plurality of second regions corresponding to each piece of the solder paste applied to each of the plurality of pads; determine a plurality of cross regions in which the plurality of first regions and the plurality of second regions overlap each other; determine a first cross area ratio of an entire area of the plurality of cross regions to an entire area of the plurality of first regions; determine a position correction value that maximizes the first cross area ratio; and deliver the position correction value to the screen printer, wherein the plurality of pads on the substrate includes at least two pads having different sizes and shapes.