An optoelectronic device comprising a monolithic substrate delimiting a first face and a second face opposite to one another along the thickness of the substrate, and a plurality of sets (D i) of light-emitting diodes (LED i) where the light-emitting diodes (LED i) of a given set (D i) are electrically associated together in which each set (D i) of light-emitting diodes (LED i) comprises: a plurality of light-emitting diodes (LED i) arranged, on the side of the first face of the substrate, over a corresponding first portion (14 i, 14' i) of the substrate, each light-emitting diode (LED i) comprising semiconductor elements including a first doped portion, an active portion and a second doped portion; a first lower electrode in contact with the first doped portions of all of the light-emitting diodes (LED i) of the set (D i); a second upper electrode in contact with the second doped portions of all of the light-emitting diodes (LED i) of the set (D i), the second upper electrode being electrically-insulated with respect to the first lower electrode and comprising an upper conductive electrode layer covering at least one portion of each light-emitting diode (LED i) of said set (D i) so as to contact with each diode (LED i); an electronic component of an electronic circuit (16 i) formed in the first portion (14i, 14' i) of the substrate, on the side of the second face of the substrate; a first conductive means formed through the first portion (14 i, 14' i) and electrically connecting a first terminal of the electronic component to one amongst the first and second electrodes, the first conductive means of a given set (D i) of light-emitting diodes (LED i) being electrically-insulated from the first conductive means of the other sets (D i) of light-emitting diodes (LED i); in which the substrate is composed by at least one semiconductor material adapted to serve as a base material for the formation of at least one portion of the electronic component and in which said at least one portion of said electronic component is formed from the semiconductor material of the substrate in the first portion (14 i, 14' i) of the substrate, on the side of the second face of the substrate. in which each set (D i) of light-emitting diodes (LED i) comprises: a plurality of light-emitting diodes (LED i) arranged, on the side of the first face of the substrate, over a corresponding first portion (14 i, 14' i) of the substrate, each light-emitting diode (LED i) comprising semiconductor elements including a first doped portion, an active portion and a second doped portion; a first lower electrode in contact with the first doped portions of all of the light-emitting diodes (LED i) of the set (D i); a second upper electrode in contact with the second doped portions of all of the light-emitting diodes (LED i) of the set (D i), the second upper electrode being electrically-insulated with respect to the first lower electrode and comprising an upper conductive electrode layer covering at least one portion of each light-emitting diode (LED i) of said set (D i) so as to contact with each diode (LED i); an electronic component of an electronic circuit (16 i) formed in the first portion (14i, 14' i) of the substrate, on the side of the second face of the substrate; a first conductive means formed through the first portion (14 i, 14' i) and electrically connecting a first terminal of the electronic component to one amongst the first and second electrodes, the first conductive means of a given set (D i) of light-emitting diodes (LED i) being electrically-insulated from the first conductive means of the other sets (D i) of light-emitting diodes (LED i); a plurality of light-emitting diodes (LED i) arranged, on the side of the first face of the substrate, over a corresponding first portion (14 i, 14' i) of the substrate, each light-emitting diode (LED i) comprising semiconductor elements including a first doped portion, an active portion and a second doped portion; a first lower electrode in contact with the first doped portions of all of the light-emitting diodes (LED i) of the set (D i); a second upper electrode in contact with the second doped portions of all of the light-emitting diodes (LED i) of the set (D i), the second upper electrode being electrically-insulated with respect to the first lower electrode and comprising an upper conductive electrode layer covering at least one portion of each light-emitting diode (LED i) of said set (D i) so as to contact with each diode (LED i); an electronic component of an electronic circuit (16 i) formed in the first portion (14i, 14' i) of the substrate, on the side of the second face of the substrate; a first conductive means formed through the first portion (14 i, 14' i) and electrically connecting a first terminal of the electronic component to one amongst the first and second electrodes, the first conductive means of a given set (D i) of light-emitting diodes (LED i) being electrically-insulated from the first conductive means of the other sets (D i) of light-emitting diodes (LED i); in which the substrate is composed by at least one semiconductor material adapted to serve as a base material for the formation of at least one portion of the electronic component and in which said at least one portion of said electronic component is formed from the semiconductor material of the substrate in the first portion (14 i, 14' i) of the substrate, on the side of the second face of the substrate.