A method for producing a plurality of optoelectronic components comprising the following steps: - Providing a connection carrier assembly having a plurality of component regions, wherein at least one electrical connection region is provided in each of the component regions, - Providing a semiconductor body carrier on which a plurality of separate semiconductor bodies connected to the semiconductor body carrier are arranged, wherein the semiconductor bodies each have a semiconductor layer sequence having an active region, - Arranging the connection carrier assembly and the semiconductor body carrier relative to one another such that the semiconductor bodies face the component regions, - Mechanically connecting a plurality of semiconductor bodies to the connection carrier assembly in a mounting region of a component region associated with the respective semiconductor body, electrically conductively connecting the respective semiconductor body to the connection region of the component region associated with the semiconductor body, and separating the semiconductor bodies to be connected to or connected to the connection carrier assembly from the semiconductor body carrier, - Dividing the connection carrier assembly into a plurality of separate optoelectronic components, each of which comprises a connection carrier, which has the component region, and a semiconductor body which is arranged on the connection carrier and is electrically conductively connected to the connection region, characterized in that - a contact conductor is formed which extends from the side of the respective semiconductor body facing away from the mounting region to the connection carrier, - wherein, after the semiconductor bodies have been fastened on the connection carrier assembly and before the connection carrier assembly is divided up, a contact is applied to the side of the respective semiconductor body facing away from the mounting region, wherein the contact has a current distribution structure, which is applied to the side of the semiconductor body which faces away from the mounting region of the semiconductor body, and the contact conductor and the current distribution structure are applied to the connection carrier assembly by means of lithography using a common mask, and - wherein the current distribution structure and the contact conductor have a continuous layer. - Providing a connection carrier assembly having a plurality of component regions, wherein at least one electrical connection region is provided in each of the component regions, - Providing a semiconductor body carrier on which a plurality of separate semiconductor bodies connected to the semiconductor body carrier are arranged, wherein the semiconductor bodies each have a semiconductor layer sequence having an active region, - Arranging the connection carrier assembly and the semiconductor body carrier relative to one another such that the semiconductor bodies face the component regions, - Mechanically connecting a plurality of semiconductor bodies to the connection carrier assembly in a mounting region of a component region associated with the respective semiconductor body, electrically conductively connecting the respective semiconductor body to the connection region of the component region associated with the semiconductor body, and separating the semiconductor bodies to be connected to or connected to the connection carrier assembly from the semiconductor body carrier, - Dividing the connection carrier assembly into a plurality of separate optoelectronic components, each of which comprises a connection carrier, which has the component region, and a semiconductor body which is arranged on the connection carrier and is electrically conductively connected to the connection region, characterized in that - a contact conductor is formed which extends from the side of the respective semiconductor body facing away from the mounting region to the connection carrier, - wherein, after the semiconductor bodies have been fastened on the connection carrier assembly and before the connection carrier assembly is divided up, a contact is applied to the side of the respective semiconductor body facing away from the mounting region, wherein the contact has a current distribution structure, which is applied to the side of the semiconductor body which faces away from the mounting region of the semiconductor body, and the contact conductor and the current distribution structure are applied to the connection carrier assembly by means of lithography using a common mask, and - wherein the current distribution structure and the contact conductor have a continuous layer.