A method for manufacturing a nickel-chromium plated member, comprising: pretreating a surface of a substrate; the surface of the substrate is pretreated by the following steps in sequence including surface deoiling, surface hydrophilic treatment, surface coarsening treatment, surface neutralization treatment, pre-immerse, surface activation treatment and surface dispergation treatment; depositing a pretreatment plating layer over the whole substrate, the pretreatment plating layer is a composite layer of a chemical nickel layer with a basic nickel layer, in which the chemical nickel layer is deposited over the whole substrate, the base nickel layer is deposited over the chemical nickel layer; and forming a copper plating layer on the base nickel layer; and forming a basic layer on the copper plating layer; and forming a functional layer on the basic layer; and forming a decorative layer on the functional layer; wherein, the basic layer comprising a semi-bright nickel layer and a bright nickel layer, the semi-bright nickel layer is formed on the copper plating layer and the bright nickel layer is formed on the semi-bright nickel layer; the functional layer comprising a low potential nickel layer and a microporous nickel layer, in which the low potential nickel layer is formed on the bright nickel layer, the microporous nickel layer is formed on the low potential nickel layer, and potential difference between the microporous nickel layer and the low potential nickel layer is 10-120mV; potential difference between the bright nickel layer and the low potential nickel layer is 60mV; the potential difference between the semi-bright nickel layer and the bright nickel layer is 100-200mV, the potential of the bright nickel layer is lower than the potential of the semi-bright nickel layer; the low potential nickel layer is a micro-crack nickel layer, the micro-crack nickel layer refers to an even plating layer having cracks; the microporous nickel layer refers to an even plating layer having nonconductive particles; the decorative layer formed on the microporous nickel layer, in which the decorative layer is a trivalent chromium plating layer or a hexavalent chromium plating layer. pretreating a surface of a substrate; the surface of the substrate is pretreated by the following steps in sequence including surface deoiling, surface hydrophilic treatment, surface coarsening treatment, surface neutralization treatment, pre-immerse, surface activation treatment and surface dispergation treatment; depositing a pretreatment plating layer over the whole substrate, the pretreatment plating layer is a composite layer of a chemical nickel layer with a basic nickel layer, in which the chemical nickel layer is deposited over the whole substrate, the base nickel layer is deposited over the chemical nickel layer; and forming a copper plating layer on the base nickel layer; and forming a basic layer on the copper plating layer; and forming a functional layer on the basic layer; and forming a decorative layer on the functional layer; wherein, the basic layer comprising a semi-bright nickel layer and a bright nickel layer, the semi-bright nickel layer is formed on the copper plating layer and the bright nickel layer is formed on the semi-bright nickel layer; the functional layer comprising a low potential nickel layer and a microporous nickel layer, in which the low potential nickel layer is formed on the bright nickel layer, the microporous nickel layer is formed on the low potential nickel layer, and potential difference between the microporous nickel layer and the low potential nickel layer is 10-120mV;