A package method for packaging a chip on a thin substrate, comprising: providing a carrier; forming at least one metal layer (202, 206, 210) and at least one dielectric layer on the carrier for manufacturing the thin substrate, and the thin substrate comprises at least one package unit for connecting at least one chip; forming pad layers (202, 210) on a top surface and a bottom surface of the thin substrate; parting the thin substrate from the carrier; clamping the thin substrate with a clamp system to reveal the pad layers (202, 210) on the top surface and the bottom surface of the thin substrate (202, 20) simultaneously for test, the clamping system having: a peripheral part, clamp parts clamping edges of the thin substrate, adjustment springs coupled between the clamp parts and the peripheral part for adjusting the position of the thin substrate clamped in the peripheral part by the clamp parts, and fixing screws coupled to the clamp parts, the adjustment springs and the fixing screws providing a controllable tension to the thin substrate; and performing a resistance test to the thin substrate to weed out the package unit with defects in the at least one package unit and select the package units without defects for connecting the chips, wherein the resistance test is performed to the top surface and the bottom surface of the thin substrate which are uncovered, wherein in the resistance test, a resistance of a measured wire net in the thin substrate is compared with a resistance of a normal wire net via two test junctions respectively on the top surface and the bottom surface of the thin substrate; dicing the thin substrate according to the package units to select the package units for connecting the chips; reassembling the selected package units according to a molding panel size and connecting the chips with the selected package units by flip chip bonding respectively; and performing a molding to the chips which are flip chip bonded on the thin substrate to build electronic components. providing a carrier; forming at least one metal layer (202, 206, 210) and at least one dielectric layer on the carrier for manufacturing the thin substrate, and the thin substrate comprises at least one package unit for connecting at least one chip; forming pad layers (202, 210) on a top surface and a bottom surface of the thin substrate; parting the thin substrate from the carrier; clamping the thin substrate with a clamp system to reveal the pad layers (202, 210) on the top surface and the bottom surface of the thin substrate (202, 20) simultaneously for test, the clamping system having: a peripheral part, clamp parts clamping edges of the thin substrate, adjustment springs coupled between the clamp parts and the peripheral part for adjusting the position of the thin substrate clamped in the peripheral part by the clamp parts, and fixing screws coupled to the clamp parts, the adjustment springs and the fixing screws providing a controllable tension to the thin substrate; a peripheral part, clamp parts clamping edges of the thin substrate, adjustment springs coupled between the clamp parts and the peripheral part for adjusting the position of the thin substrate clamped in the peripheral part by the clamp parts, and fixing screws coupled to the clamp parts, the adjustment springs and the fixing screws providing a controllable tension to the thin substrate; and performing a resistance test to the thin substrate to weed out the package unit with defects in the at least one package unit and select the package units without defects for connecting the chips, wherein the resistance test is performed to the top surface and the bottom surface of the thin substrate which are uncovered, wherein in the resistance test, a resistance of a measured wire net in the thin substrate is compared with a resistance of a normal wire net via two test junctions respectively on the top surface and the bottom surface of the thin substrate; dicing the thin substrate according to the package units to select the package units for connecting the chips; reassembling the selected package units according to a molding panel size and connecting the chips with the selected package units by flip chip bonding respectively; and performing a molding to the chips which are flip chip bonded on the thin substrate to build electronic components.