A board module including: a printed wiring board, an electronic component and a case wherein: the printed wiring board comprises: a substrate including a component mounting surface and a board mounting surface, which is located at an opposite side of the component mounting surface; a component-side pattern formed on the component mounting surface, wherein the component-side pattern includes a pad to be electrically connected to an electronic component; and a board-side pattern formed on the board mounting surface, wherein the board-side pattern includes an electrode pad to be electrically connected to a control board, wherein the substrate includes a through hole via that electrically connects the component-side pattern and the board-side pattern, the electronic component is electrically connected to the component-side pattern of the printed wiring board; and the case covers the electronic component, wherein the substrate includes a case coupling hole (21 C) that opens in at least the component mounting surface, and the case includes a fastener inserted into the case coupling hole (21 C) from the component mounting surface and engaged with the substrate, the board module being characterized by an electric insulation sheet adhered to the board mounting surface of the substrate to cover the through hole via in the board mounting surface, wherein the electric insulation sheet includes a heat resistant material with a heatproof temperature between 200°C and 400°C. a printed wiring board, an electronic component and a case wherein: the printed wiring board comprises: a substrate including a component mounting surface and a board mounting surface, which is located at an opposite side of the component mounting surface; a component-side pattern formed on the component mounting surface, wherein the component-side pattern includes a pad to be electrically connected to an electronic component; and a board-side pattern formed on the board mounting surface, wherein the board-side pattern includes an electrode pad to be electrically connected to a control board, wherein the substrate includes a through hole via that electrically connects the component-side pattern and the board-side pattern, the electronic component is electrically connected to the component-side pattern of the printed wiring board; and the case covers the electronic component, wherein the substrate includes a case coupling hole (21 C) that opens in at least the component mounting surface, and the case includes a fastener inserted into the case coupling hole (21 C) from the component mounting surface and engaged with the substrate, the board module being characterized by an electric insulation sheet adhered to the board mounting surface of the substrate to cover the through hole via in the board mounting surface, wherein the electric insulation sheet includes a heat resistant material with a heatproof temperature between 200°C and 400°C. the printed wiring board comprises: a substrate including a component mounting surface and a board mounting surface, which is located at an opposite side of the component mounting surface; a component-side pattern formed on the component mounting surface, wherein the component-side pattern includes a pad to be electrically connected to an electronic component; and a board-side pattern formed on the board mounting surface, wherein the board-side pattern includes an electrode pad to be electrically connected to a control board, wherein the substrate includes a through hole via that electrically connects the component-side pattern and the board-side pattern, a substrate including a component mounting surface and a board mounting surface, which is located at an opposite side of the component mounting surface; a component-side pattern formed on the component mounting surface, wherein the component-side pattern includes a pad to be electrically connected to an electronic component; and a board-side pattern formed on the board mounting surface, wherein the board-side pattern includes an electrode pad to be electrically connected to a control board, wherein the substrate includes a through hole via that electrically connects the component-side pattern and the board-side pattern, the electronic component is electrically connected to the component-side pattern of the printed wiring board; and the case covers the electronic component, wherein the substrate includes a case coupling hole (21 C) that opens in at least the component mounting surface, and the case includes a fastener inserted into the case coupling hole (21 C) from the component mounting surface and engaged with the substrate, the board module being characterized by an electric insulation sheet adhered to the board mounting surface of the substrate to cover the through hole via in the board mounting surface, wherein the electric insulation sheet includes a heat resistant material with a heatproof temperature between 200°C and 400°C.