A fluid cooled enclosure ( 101, 501) for a circuit module apparatus ( 103, 503) comprising: a housing with a first side and a second side; a fluid conduit ( 111, 401, 403, 505) including a first end portion ( 201, 601) positioned at the first side of the housing and a second end portion ( 203, 603) positioned at the second side of the housing, wherein the fluid conduit ( 111, 401, 403, 505) provides a fluid coolant path (301, 301a, 301b, 311, 311a, 311b, 701, 705, 709) between the first side and the second side of the housing; a first interface block configured to be mounted along the first end portion ( 201, 601) of the fluid conduit ( 111, 401, 403, 505) and with respect to the housing such that a first interface surface of the first interface block engages a first interface surface of the first end portion of the fluid conduit, characterized in that the fluid cooled enclosure (101, 501) for the circuit module apparatus (103, 503) further comprises: a second interface block configured to be mounted along the second end portion ( 203, 603) of the fluid conduit ( 111, 401, 403, 505) and with respect to the housing such that a first interface surface of the second interface block engages a second interface surface of the second end portion ( 203, 603) of the fluid conduit; a conduction plate in contact with the first and second interface blocks; a first biasing member configured to bias a first portion of the conduction plate such that the first interface block is compressed between the first end portion of the fluid conduit ( 111, 401, 403, 505) and the first portion of the conduction plate; a second biasing member configured to bias a second portion of the conduction plate such that the second interface block is compressed between the second end portion of the fluid conduit ( 111, 401, 403, 505) and the second portion of the conduction plate; and a circuit board with electrical components, the circuit board mounted to the conduction plate such that heat may freely travel from the electrical components to the conduction plate, through the conduction plate to the first and second interface blocks and be carried away by a fluid coolant passing through the fluid conduit ( 111, 401, 403, 505). a housing with a first side and a second side; a fluid conduit ( 111, 401, 403, 505) including a first end portion ( 201, 601) positioned at the first side of the housing and a second end portion ( 203, 603) positioned at the second side of the housing, wherein the fluid conduit ( 111, 401, 403, 505) provides a fluid coolant path (301, 301a, 301b, 311, 311a, 311b, 701, 705, 709) between the first side and the second side of the housing; a first interface block configured to be mounted along the first end portion ( 201, 601) of the fluid conduit ( 111, 401, 403, 505) and with respect to the housing such that a first interface surface of the first interface block engages a first interface surface of the first end portion of the fluid conduit, characterized in that the fluid cooled enclosure (101, 501) for the circuit module apparatus (103, 503) further comprises: a second interface block configured to be mounted along the second end portion ( 203, 603) of the fluid conduit ( 111, 401, 403, 505) and with respect to the housing such that a first interface surface of the second interface block engages a second interface surface of the second end portion ( 203, 603) of the fluid conduit; a conduction plate in contact with the first and second interface blocks; a first biasing member configured to bias a first portion of the conduction plate such that the first interface block is compressed between the first end portion of the fluid conduit ( 111, 401, 403, 505) and the first portion of the conduction plate; a second biasing member configured to bias a second portion of the conduction plate such that the second interface block is compressed between the second end portion of the fluid conduit ( 111, 401, 403, 505) and the second portion of the conduction plate; and a circuit board with electrical components, the circuit board mounted to the conduction plate such that heat may freely travel from the electrical components to the conduction plate, through the conduction plate to the first and second interface blocks and be carried away by a fluid coolant passing through the fluid conduit ( 111, 401, 403, 505). a second interface block configured to be mounted along the second end portion ( 203, 603) of the fluid conduit ( 111, 401, 403, 505) and with respect to the housing such that a first interface surface of the second interface block engages a second interface surface of the second end portion ( 203, 603) of the fluid conduit; a conduction plate in contact with the first and second interface blocks; a first biasing member configured to bias a first portion of the conduction plate such that the first interface block is compressed between the first end portion of the fluid conduit ( 111, 401, 403, 505) and the first portion of the conduction plate; a second biasing member configured to bias a second portion of the conduction plate such that the second interface block is compressed between the second end portion of the fluid conduit ( 111, 401, 403, 505) and the second portion of the conduction plate; and a circuit board with electrical components, the circuit board mounted to the conduction plate such that heat may freely travel from the electrical components to the conduction plate, through the conduction plate to the first and second interface blocks and be carried away by a fluid coolant passing through the fluid conduit ( 111, 401, 403, 505).