A wafer optical processing device, for optically processing a sintered wafer, comprising: wafer support devices (140a, 140b), said wafer support devices (140a, 140b) comprising a support piece, said support piece being provided with an upper surface and a lower surface that are disposed facing each other, said support piece being hollowed out in a direction from the upper surface to the lower surface, said support piece being configured to be capable of supporting said wafer above said upper surface; an upper light source device, said upper light source device being disposed above said wafer support devices (140a, 140b) and configured to provide a light source that illuminates the upper surface of said support piece; and a lower light source device, said lower light source device being disposed below said wafer support devices (140a, 140b) and configured to provide a light source that illuminates the lower surface of said support piece, wherein said wafer optical processing assembly further comprises: an upper transparent baffle plate, said upper transparent baffle plate being located between said upper light source device and said wafer support devices (140a, 140b) and separated from said upper light source device, a plurality of holes being disposed in said upper transparent baffle plate; and a lower transparent baffle plate, said lower transparent baffle plate being located between said lower light source device and said wafer support devices (140a, 140b) and separated from said lower light source device, characterised in that the lower transparent baffle plate 503 is provided with no holes. wafer support devices (140a, 140b), said wafer support devices (140a, 140b) comprising a support piece, said support piece being provided with an upper surface and a lower surface that are disposed facing each other, said support piece being hollowed out in a direction from the upper surface to the lower surface, said support piece being configured to be capable of supporting said wafer above said upper surface; an upper light source device, said upper light source device being disposed above said wafer support devices (140a, 140b) and configured to provide a light source that illuminates the upper surface of said support piece; and a lower light source device, said lower light source device being disposed below said wafer support devices (140a, 140b) and configured to provide a light source that illuminates the lower surface of said support piece, wherein said wafer optical processing assembly further comprises: an upper transparent baffle plate, said upper transparent baffle plate being located between said upper light source device and said wafer support devices (140a, 140b) and separated from said upper light source device, a plurality of holes being disposed in said upper transparent baffle plate; and a lower transparent baffle plate, said lower transparent baffle plate being located between said lower light source device and said wafer support devices (140a, 140b) and separated from said lower light source device, characterised in that the lower transparent baffle plate 503 is provided with no holes. an upper transparent baffle plate, said upper transparent baffle plate being located between said upper light source device and said wafer support devices (140a, 140b) and separated from said upper light source device, a plurality of holes being disposed in said upper transparent baffle plate; and a lower transparent baffle plate, said lower transparent baffle plate being located between said lower light source device and said wafer support devices (140a, 140b) and separated from said lower light source device, characterised in that the lower transparent baffle plate 503 is provided with no holes.