A power module for a solid-state circuit breaker comprising an insulating material in which there is arranged a bi-directional power electronics switch and non-power electronics circuits with protective elements, circuits controlling the power electronics switch and sensor circuits, further comprising a heat sink made of a dielectric material having thermal conductivity over 20 W/m/K, having on its surface an electrically conductive power pattern made of silver and/or copper, wherein the electrically conductive power pattern comprises at least two electrically insulated sections, the bi-directional power electronics switch comprising power semiconductor bare dies mutually interconnected with a power conductive connection is placed on the electrically conductive power pattern and connected by the electrically conductive power connection, wherein the power electronics switch is positioned on longitudinal axis of the module, the electrically conductive power pattern is interconnected with output power electric terminals and via a contact layer further joined to auxiliary dielectric substrates where there are electrically conductive non-power patterns made of silver and/or copper interconnecting the non-power electronics circuits placed on the auxiliary dielectric substrates, wherein said contact layer of the auxiliary dielectric substrates comprises an electrically conductive layer applied on the auxiliary dielectric substrates, and the electrically conductive power connection of which full contact surfaces interconnect the electrically conductive layer and the electrically conductive power pattern in a monolithic way, the non-power electronics circuits are interconnected with output non-power electric terminals and with the power electronics switch via a non-power conductive connection, the output power electric terminals and the output non-power electric terminals are interconnected with protective circuits, wherein at least the heat sink, the power electronics switch, the auxiliary dielectric substrates, and the non-power electronics circuits are jointly included in a monolithic multilayer structure, which parts are connected through entire contact surfaces. further comprising a heat sink made of a dielectric material having thermal conductivity over 20 W/m/K, having on its surface an electrically conductive power pattern made of silver and/or copper, wherein the electrically conductive power pattern comprises at least two electrically insulated sections, the bi-directional power electronics switch comprising power semiconductor bare dies mutually interconnected with a power conductive connection is placed on the electrically conductive power pattern and connected by the electrically conductive power connection, wherein the power electronics switch is positioned on longitudinal axis of the module, the electrically conductive power pattern is interconnected with output power electric terminals and via a contact layer further joined to auxiliary dielectric substrates where there are electrically conductive non-power patterns made of silver and/or copper interconnecting the non-power electronics circuits placed on the auxiliary dielectric substrates, wherein said contact layer of the auxiliary dielectric substrates comprises an electrically conductive layer applied on the auxiliary dielectric substrates, and the electrically conductive power connection of which full contact surfaces interconnect the electrically conductive layer and the electrically conductive power pattern in a monolithic way, the non-power electronics circuits are interconnected with output non-power electric terminals and with the power electronics switch via a non-power conductive connection, the output power electric terminals and the output non-power electric terminals are interconnected with protective circuits, wherein at least the heat sink, the power electronics switch, the auxiliary dielectric substrates, and the non-power electronics circuits are jointly included in a monolithic multilayer structure, which parts are connected through entire contact surfaces.