Procedure designed to create a connection between two ceramic pieces, comprising: Provision of a first ceramic part and a second ceramic part; Provision of an active brazing solder on at least one surface section of at least one of the ceramic parts; and Heating of the active brazing solder in a vacuum solder process, wherein the entire active brazing solder material for connecting the first and second ceramic part is provided in such a way that at least one surface section of at least one of the ceramic parts, preferably of both ceramic parts, is coated with an alloy of the active brazing solder and/or of its components via chemical vapor deposition, wherein the chemical vapor deposition comprises a sputtering process to transform the components of the active brazing solder to the gas phase, wherein the active brazing solder has several components, and wherein the sputter process uses a sputter target which contains the components of the active brazing solder, wherein the active brazing solder has a specified composition in which components K i of the active brazing are present according to a weight percentage c i, and wherein the difference between the thermal expansion coefficient of the active brazing solder and the thermal expansion coefficient of the material of the ceramic parts, particularly at the given stability of the joint, has a minimum, wherein the sputter target features the components of the active brazing solder in quantity ratios c i, target, which present relative deviations d i: = c i, target − C i, spec. / c i, spec. of the individual components from the specified composition c i, set, for which the following applies: d i < 4 %, preferably not more than 2% and particularly preferably not more than 1%, wherein the ceramic parts contain corundum, wherein the active brazing solder contains a Zr-Ni-Ti alloy, and wherein the active component is Ti or Zr, characterized in that the following applies for the concentrations of the components of the active brazing solder in the specified composition: 61 < c Zr < 63.5, 21.5 < C Ni < 24 and 14.5 < c Ti < 15.5. Provision of a first ceramic part and a second ceramic part; Provision of an active brazing solder on at least one surface section of at least one of the ceramic parts; and Heating of the active brazing solder in a vacuum solder process, wherein the entire active brazing solder material for connecting the first and second ceramic part is provided in such a way that at least one surface section of at least one of the ceramic parts, preferably of both ceramic parts, is coated with an alloy of the active brazing solder and/or of its components via chemical vapor deposition, wherein the chemical vapor deposition comprises a sputtering process to transform the components of the active brazing solder to the gas phase, wherein the active brazing solder has several components, and wherein the sputter process uses a sputter target which contains the components of the active brazing solder, wherein the active brazing solder has a specified composition in which components K i of the active brazing are present according to a weight percentage c i, and wherein the difference between the thermal expansion coefficient of the active brazing solder and the thermal expansion coefficient of the material of the ceramic parts, particularly at the given stability of the joint, has a minimum, wherein the sputter target features the components of the active brazing solder in quantity ratios c i, target, which present relative deviations d i: = c i, target − C i, spec. / c i, spec. of the individual components from the specified composition c i, set, for which the following applies: d i < 4 %, preferably not more than 2% and particularly preferably not more than 1%, wherein the ceramic parts contain corundum, wherein the active brazing solder contains a Zr-Ni-Ti alloy, and wherein the active component is Ti or Zr, characterized in that the following applies for the concentrations of the components of the active brazing solder in the specified composition: 61 < c Zr < 63.5, 21.5 < C Ni < 24 and 14.5 < c Ti < 15.5.