An organic light emitting diode display device comprising: a substrate comprising a display area and a non-display area, wherein the display area includes a plurality of pixel regions and is covered with a first insulation film (113, 213) and the non-display area is an outer area surrounding the display area; a first passivation layer arranged above the substrate; a plurality of organic light emitting diodes formed on the first passivation layer, each organic light emitting diode including: a first electrode formed on the first passivation layer, an organic layer including at least an emission layer, and a second electrode formed on the organic layer; the first insulation film (113, 213) formed between the first electrodes and the organic layers and defining emission regions exposing the first electrodes, wherein the organic layer of an organic light emitting diode is in each case formed on a respective first electrode exposed by the first insulation film (113, 213), and wherein the first insulation film (113, 213) comprises an edge that corresponds to a boundary between the display area and the non-display area and an end portion that extends from the edge towards the inside of the first insulation film; a first adhesion enhancement pattern (300, 400, 600) arranged under the edge of the first insulation film (113, 213) and formed in a closed loop corresponding to the boundary between the display area and the non-display area, and disposed on the first passivation layer, wherein a part of the first adhesion enhancement pattern (300, 400, 600) is formed to overlap with the first insulation film (113, 213) and the rest of the first adhesion enhancement pattern (300, 400, 600) is formed to expand outwardly from the end portion or the edge of the first insulation film (113, 213) and wherein the first adhesion enhancement pattern (300, 400, 600) is configured to prevent the end portion or edge of the first insulation film (113, 213) from directly contacting the first passivation layer and to enhance an interfacial adhesion force between the first passivation layer and the insulation film (113, 213); and a second passivation layer that at least partially covers the organic light emitting diodes, and characterized in that the first adhesion enhancement pattern (300, 400, 600) comprises an uneven upper surface, and the uneven upper surface of the first adhesion enhancement pattern (300, 400, 600) comprises a plurality of slits. a substrate comprising a display area and a non-display area, wherein the display area includes a plurality of pixel regions and is covered with a first insulation film (113, 213) and the non-display area is an outer area surrounding the display area; a first passivation layer arranged above the substrate; a plurality of organic light emitting diodes formed on the first passivation layer, each organic light emitting diode including: a first electrode formed on the first passivation layer, an organic layer including at least an emission layer, and a second electrode formed on the organic layer; a first electrode formed on the first passivation layer, an organic layer including at least an emission layer, and a second electrode formed on the organic layer; the first insulation film (113, 213) formed between the first electrodes and the organic layers and defining emission regions exposing the first electrodes, wherein the organic layer of an organic light emitting diode is in each case formed on a respective first electrode exposed by the first insulation film (113, 213), and wherein the first insulation film (113, 213) comprises an edge that corresponds to a boundary between the display area and the non-display area and an end portion that extends from the edge towards the inside of the first insulation film; a first adhesion enhancement pattern (300, 400, 600) arranged under the edge of the first insulation film (113, 213) and formed in a closed loop corresponding to the boundary between the display area and the non-display area, and disposed on the first passivation layer, wherein a part of the first adhesion enhancement pattern (300, 400, 600) is formed to overlap with the first insulation film (113, 213) and the rest of the first adhesion enhancement pattern (300, 400, 600) is formed to expand outwardly from the end portion or the edge of the first insulation film (113, 213) and wherein the first adhesion enhancement pattern (300, 400, 600) is configured to prevent the end portion or edge of the first insulation film (113, 213) from directly contacting the first passivation layer and to enhance an interfacial adhesion force between the first passivation layer and the insulation film (113, 213); and a second passivation layer that at least partially covers the organic light emitting diodes, and characterized in that the first adhesion enhancement pattern (300, 400, 600) comprises an uneven upper surface, and the uneven upper surface of the first adhesion enhancement pattern (300, 400, 600) comprises a plurality of slits.