A power module (1, 8, 9), comprising: a substrate comprising a first conductive layer disposed on a first surface and a second conductive layer disposed on a second surface opposite to the first surface, the first conductive layer comprising a plurality of conductive blocks (710, 711, 712, 713) including a first conductive block, a second conductive block, a third conductive block and a fourth conductive block; a first sub-module disposed on the first conductive layer, the first sub-module comprising a first semiconductor switch and a first diode which is connected in parallel with the first semiconductor switch, wherein the first sub-module further comprises a first electrode, a second electrode, a third electrode and a fourth electrode and the third electrode is electrically connected with the third conductive block; a second sub-module disposed on the first conductive layer, the second sub-module comprising a second semiconductor switch and a second diode which is connected in parallel with the second semiconductor switch, the second semiconductor switch being electrically connected with the first semiconductor switch through the plurality of conductive blocks (710, 711, 712, 713), wherein the second sub-module further comprises a fifth electrode, a sixth electrode and a seventh electrode, and the seventh electrode is electrically connected with the third conductive block; a conductive pin disposed on the first conductive layer and electrically connected with at least one of the conductive blocks wherein a first end of the conductive pin is electrically connected with the first conductive block; a circuit board disposed on the conductive pin and electrically connected with the first semiconductor switch and the second semiconductor switch through the conductive pin; and a heat sink disposed on the second conductive layer, wherein the first sub-module further comprises a first thermal/electrical conduction structure and a first lead electrode, and the second sub-module further comprises a second thermal/electrical conduction structure and a second lead electrode, wherein the first thermal/electrical conduction structure is arranged between the first electrode and the first lead electrode and electrically connected with the first electrode and the first lead electrode, wherein the second thermal/electrical conduction structure is arranged between the sixth electrode and the second lead electrode, and electrically connected with the sixth electrode and the second lead electrode, wherein the first lead electrode is electrically connected with the first conductive block. a substrate comprising a first conductive layer disposed on a first surface and a second conductive layer disposed on a second surface opposite to the first surface, the first conductive layer comprising a plurality of conductive blocks (710, 711, 712, 713) including a first conductive block, a second conductive block, a third conductive block and a fourth conductive block; a first sub-module disposed on the first conductive layer, the first sub-module comprising a first semiconductor switch and a first diode which is connected in parallel with the first semiconductor switch, wherein the first sub-module further comprises a first electrode, a second electrode, a third electrode and a fourth electrode and the third electrode is electrically connected with the third conductive block; a second sub-module disposed on the first conductive layer, the second sub-module comprising a second semiconductor switch and a second diode which is connected in parallel with the second semiconductor switch, the second semiconductor switch being electrically connected with the first semiconductor switch through the plurality of conductive blocks (710, 711, 712, 713), wherein the second sub-module further comprises a fifth electrode, a sixth electrode and a seventh electrode, and the seventh electrode is electrically connected with the third conductive block; a conductive pin disposed on the first conductive layer and electrically connected with at least one of the conductive blocks wherein a first end of the conductive pin is electrically connected with the first conductive block; a circuit board disposed on the conductive pin and electrically connected with the first semiconductor switch and the second semiconductor switch through the conductive pin; and a heat sink disposed on the second conductive layer, wherein the first sub-module further comprises a first thermal/electrical conduction structure and a first lead electrode, and the second sub-module further comprises a second thermal/electrical conduction structure and a second lead electrode, wherein the first thermal/electrical conduction structure is arranged between the first electrode and the first lead electrode and electrically connected with the first electrode and the first lead electrode, wherein the second thermal/electrical conduction structure is arranged between the sixth electrode and the second lead electrode, and electrically connected with the sixth electrode and the second lead electrode, wherein the first lead electrode is electrically connected with the first conductive block.