An electronic device, wherein the electronic device comprises: a metal member, wherein a through hole or slot is disposed on the metal member, and the metal member is a stamped metal member or a forged metal member; a circuit board, wherein an electronic component is disposed on the circuit board; and a shielding member, wherein the shielding member comprises a blocking portion and an enclosing portion, the blocking portion is made of an electrically conductive plastic material, the enclosing portion is made of a metal material or an electrically conductive plastic material; the blocking portion is configured to block the through hole or slot, the enclosing portion is disposed around the electronic component, one end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to ground copper of the circuit board; wherein the metal member, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space; or the metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space, wherein the shielding member further comprises a buckling portion connected to the blocking portion, and the buckling portion is buckled in the through hole or slot, and a fastening portion connected to the buckling portion, and a size of the fastening portion is greater than a size of the through hole or slot, wherein an electrically conductive elastic member is disposed between the enclosing portion and the circuit board or between the enclosing portion and the metal member. a metal member, wherein a through hole or slot is disposed on the metal member, and the metal member is a stamped metal member or a forged metal member; a circuit board, wherein an electronic component is disposed on the circuit board; and a shielding member, wherein the shielding member comprises a blocking portion and an enclosing portion, the blocking portion is made of an electrically conductive plastic material, the enclosing portion is made of a metal material or an electrically conductive plastic material; the blocking portion is configured to block the through hole or slot, the enclosing portion is disposed around the electronic component, one end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to ground copper of the circuit board; wherein the metal member, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space; or the metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space, wherein the shielding member further comprises a buckling portion connected to the blocking portion, and the buckling portion is buckled in the through hole or slot, and a fastening portion connected to the buckling portion, and a size of the fastening portion is greater than a size of the through hole or slot, wherein an electrically conductive elastic member is disposed between the enclosing portion and the circuit board or between the enclosing portion and the metal member.