A liquid panel assembly comprising: a support frame comprising: a first fluid circuit comprising: a first inlet header to supply a first cooling fluid to the liquid panel assembly; and a plurality of first flow channels configured to flow the first cooling fluid through the liquid panel assembly, each of the first flow channels connected to the first inlet header and having a vertical inlet channel connected to a vertical outlet channel through one or more horizontal flow passages, the first fluid circuit configured to use the first cooling fluid to condition an air stream; a second fluid circuit comprising: a second inlet header to supply a second cooling fluid to the liquid panel assembly; and a plurality of second flow channels configured to flow the second cooling fluid through the liquid panel assembly, each of the second flow channels connected to the second inlet header and having a vertical inlet channel connected to a vertical outlet channel through one or more horizontal flow passages, the second fluid circuit configured to use the second cooling fluid to transfer heat to or from the first cooling fluid, the second fluid circuit separate from the first fluid circuit; a first semi-permeable layer secured to a first side of the support frame; and a second semi-permeable layer secured to a second side of the support frame opposite the first side, wherein he first fluid circuit is configured to at least partially offset hydrostatic pressure gain with friction pressure loss of the first cooling fluid to reduce pressure within the liquid panel assembly. a support frame comprising: a first fluid circuit comprising: a first inlet header to supply a first cooling fluid to the liquid panel assembly; and a plurality of first flow channels configured to flow the first cooling fluid through the liquid panel assembly, each of the first flow channels connected to the first inlet header and having a vertical inlet channel connected to a vertical outlet channel through one or more horizontal flow passages, the first fluid circuit configured to use the first cooling fluid to condition an air stream; a second fluid circuit comprising: a second inlet header to supply a second cooling fluid to the liquid panel assembly; and a plurality of second flow channels configured to flow the second cooling fluid through the liquid panel assembly, each of the second flow channels connected to the second inlet header and having a vertical inlet channel connected to a vertical outlet channel through one or more horizontal flow passages, the second fluid circuit configured to use the second cooling fluid to transfer heat to or from the first cooling fluid, the second fluid circuit separate from the first fluid circuit; a first fluid circuit comprising: a first inlet header to supply a first cooling fluid to the liquid panel assembly; and a plurality of first flow channels configured to flow the first cooling fluid through the liquid panel assembly, each of the first flow channels connected to the first inlet header and having a vertical inlet channel connected to a vertical outlet channel through one or more horizontal flow passages, the first fluid circuit configured to use the first cooling fluid to condition an air stream; a first inlet header to supply a first cooling fluid to the liquid panel assembly; and a plurality of first flow channels configured to flow the first cooling fluid through the liquid panel assembly, each of the first flow channels connected to the first inlet header and having a vertical inlet channel connected to a vertical outlet channel through one or more horizontal flow passages, the first fluid circuit configured to use the first cooling fluid to condition an air stream; a second fluid circuit comprising: a second inlet header to supply a second cooling fluid to the liquid panel assembly; and a plurality of second flow channels configured to flow the second cooling fluid through the liquid panel assembly, each of the second flow channels connected to the second inlet header and having a vertical inlet channel connected to a vertical outlet channel through one or more horizontal flow passages, the second fluid circuit configured to use the second cooling fluid to transfer heat to or from the first cooling fluid, the second fluid circuit separate from the first fluid circuit; a second inlet header to supply a second cooling fluid to the liquid panel assembly; and a plurality of second flow channels configured to flow the second cooling fluid through the liquid panel assembly, each of the second flow channels connected to the second inlet header and having a vertical inlet channel connected to a vertical outlet channel through one or more horizontal flow passages, the second fluid circuit configured to use the second cooling fluid to transfer heat to or from the first cooling fluid, the second fluid circuit separate from the first fluid circuit; a first semi-permeable layer secured to a first side of the support frame; and a second semi-permeable layer secured to a second side of the support frame opposite the first side, wherein he first fluid circuit is configured to at least partially offset hydrostatic pressure gain with friction pressure loss of the first cooling fluid to reduce pressure within the liquid panel assembly.