A method for repairing micro-LED defects, comprising: obtaining micro-LED defect pattern on a receiving substrate; forming micro-LEDs corresponding to the defect pattern on a laser-transparent repair carrier substrate; aligning the micro-LEDs on the repair carrier substrate with the defect positions on the receiving substrate, and bringing the micro-LEDs into contact with the pads at the defect positions; and irradiating the repair carrier substrate with laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate, wherein the step of forming micro-LEDs corresponding to the defect pattern comprises: mounting the micro-LEDs onto a temporary substrate in the defect pattern; and transferring the micro-LEDs on the temporary substrate to the repair carrier substrate, wherein an adhesive is coated on the temporary substrate, and the step of mounting the micro-LEDs onto a temporary substrate comprises: bringing micro-LEDs on a laser-transparent original substrate into contact with the adhesive; irradiating the original substrate with laser in the defect pattern, to lift-off the micro-LEDs from the original substrate; and keeping the lifted-off micro-LEDs in the defect pattern on the temporary substrate while releasing the un-lifted-off micro-LEDs through a partial adhesive releasing, wherein the step of transferring the micro-LEDs on the temporary substrate to the repair carrier substrate comprises: bonding the micro-LEDs on the temporary substrate onto the repair carrier substrate; and lifting-off the micro-LEDs from the temporary substrate through a complete adhesive releasing. obtaining micro-LED defect pattern on a receiving substrate; forming micro-LEDs corresponding to the defect pattern on a laser-transparent repair carrier substrate; aligning the micro-LEDs on the repair carrier substrate with the defect positions on the receiving substrate, and bringing the micro-LEDs into contact with the pads at the defect positions; and irradiating the repair carrier substrate with laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate, wherein the step of forming micro-LEDs corresponding to the defect pattern comprises: mounting the micro-LEDs onto a temporary substrate in the defect pattern; and transferring the micro-LEDs on the temporary substrate to the repair carrier substrate, mounting the micro-LEDs onto a temporary substrate in the defect pattern; and transferring the micro-LEDs on the temporary substrate to the repair carrier substrate, wherein an adhesive is coated on the temporary substrate, and the step of mounting the micro-LEDs onto a temporary substrate comprises: bringing micro-LEDs on a laser-transparent original substrate into contact with the adhesive; irradiating the original substrate with laser in the defect pattern, to lift-off the micro-LEDs from the original substrate; and keeping the lifted-off micro-LEDs in the defect pattern on the temporary substrate while releasing the un-lifted-off micro-LEDs through a partial adhesive releasing, bringing micro-LEDs on a laser-transparent original substrate into contact with the adhesive; irradiating the original substrate with laser in the defect pattern, to lift-off the micro-LEDs from the original substrate; and keeping the lifted-off micro-LEDs in the defect pattern on the temporary substrate while releasing the un-lifted-off micro-LEDs through a partial adhesive releasing, wherein the step of transferring the micro-LEDs on the temporary substrate to the repair carrier substrate comprises: bonding the micro-LEDs on the temporary substrate onto the repair carrier substrate; and lifting-off the micro-LEDs from the temporary substrate through a complete adhesive releasing. bonding the micro-LEDs on the temporary substrate onto the repair carrier substrate; and lifting-off the micro-LEDs from the temporary substrate through a complete adhesive releasing.