A process for mounting a wireless electronic component to a thermoplastic surface of a product which is intended to be in a fluid path during use, comprising the steps of: a) forming a thermoplastic device formed of a housing having a first closed substantially planar inner surface and a first outer surface and at least one recess for holding the electronic component; b) placing the electronic component into the at least one recess; c) overmolding the at least one recess and electronic component with a thermoplastic cover that is a separately molded or pre-formed piece to liquid-tightly seal the cover to the housing to encapsulate the electronic component and form a second outer surface of the device, wherein either the first outer surface or the second outer surface has two or more spaced apart protrusions extending away from the first or second outer surface (4,14) which protrusions form a bulk of necessary sacrificial material for mechanically bonding the device to the surface of the product and which have a lower melting point than the surface of the product; d) holding the two or more protrusions of the device against the thermoplastic surface of the product and at least partially melting the two or more protrusions to form a bond between the thermoplastic surface of the product and the thermoplastic of the device, wherein the protrusions in addition to being stabilizers or centering devices also act as energy directors and preferentially absorb the energy at their surfaces adjacent to the surface of the product against which they have been placed to form a molten thermoplastic plastic bond between the housing of the thermoplastic device and the product, and wherein the sacrificial material of the protrusions is the only deformed component of the thermoplastic device. a) forming a thermoplastic device formed of a housing having a first closed substantially planar inner surface and a first outer surface and at least one recess for holding the electronic component; b) placing the electronic component into the at least one recess; c) overmolding the at least one recess and electronic component with a thermoplastic cover that is a separately molded or pre-formed piece to liquid-tightly seal the cover to the housing to encapsulate the electronic component and form a second outer surface of the device, wherein either the first outer surface or the second outer surface has two or more spaced apart protrusions extending away from the first or second outer surface (4,14) which protrusions form a bulk of necessary sacrificial material for mechanically bonding the device to the surface of the product and which have a lower melting point than the surface of the product; d) holding the two or more protrusions of the device against the thermoplastic surface of the product and at least partially melting the two or more protrusions to form a bond between the thermoplastic surface of the product and the thermoplastic of the device, wherein the protrusions in addition to being stabilizers or centering devices also act as energy directors and preferentially absorb the energy at their surfaces adjacent to the surface of the product against which they have been placed to form a molten thermoplastic plastic bond between the housing of the thermoplastic device and the product, and wherein the sacrificial material of the protrusions is the only deformed component of the thermoplastic device.