A method of electroplating indium on nickel comprising: a) providing a substrate comprising a nickel layer; b) contacting the substrate with an indium electroplating composition comprising one or more sources of indium ions, citric acid, salts thereof or mixtures thereof and one or more amine compounds in amounts of 5 ppm to 15 ppm having a formula: where R 1 is chosen from hydrogen; (CH 2) a NR 4 R 5 where R 4 and R 5 are independently chosen from hydrogen and linear or branched (C 1 -C 4)alkyl and a is an integer of 1 to 4; (CH 2 CHR 6 -O) x H or salts thereof where R 6 is chosen from hydrogen or linear or branched (C 1 -C 4)alkyl and x is an integer from 1 to 20; carboxy(C 1 -C 4)alkyl or salts thereof; or (CH 2 CHR 6 -O) p (CH 2 CHR 9 -O) x H or salts thereof where R 9 is hydrogen or linear or branched (C 1 -C 4)alkyl; R 2 is chosen from hydrogen; linear or branched (C 1 -C 4)alkyl; (CH 2 CHR 6 -O) y H of salts thereof where R 6 is defined as above and y is an integer of 1 to 20; carboxy(C 1 -C 4)alkyl or salts thereof; or (CH 2 CHR 6 -O) q (CH 2 CHR 10 -O) y H or salts thereof where R 10 is hydrogen or linear or branched (C 1 -C 4)alkyl; R 3 is chosen from cocoalkyl; R'-O-(CH 2) m where R' is chosen from hydrogen, linear or branched, saturated or unsaturated (C 1 -C 20)alkyl, m is an integer of 1 to 4; (CH 2) m NR 7 R 8 where R 7 is (CH 2 CHR 6 -O) p (CH 2 CHR 9 -O) x H or salts thereof and R 8 is (CH 2 CHR 6 -O) q (CH 2 CHR 10 -O) y H or salts thereof; and G is (CH 2 CHR 6 -O) z H or salts thereof where z is an integer from 1 to 20 or → O and n is 0 or 1, and wherein the indium electroplating composition is free of alloying metals; p and q are independently chosen from integers of 1 to 20; and c) electroplating an indium metal layer on the nickel layer of the substrate with the indium electroplating composition. a) providing a substrate comprising a nickel layer; b) contacting the substrate with an indium electroplating composition comprising one or more sources of indium ions, citric acid, salts thereof or mixtures thereof and one or more amine compounds in amounts of 5 ppm to 15 ppm having a formula: where R 1 is chosen from hydrogen; (CH 2) a NR 4 R 5 where R 4 and R 5 are independently chosen from hydrogen and linear or branched (C 1 -C 4)alkyl and a is an integer of 1 to 4; (CH 2 CHR 6 -O) x H or salts thereof where R 6 is chosen from hydrogen or linear or branched (C 1 -C 4)alkyl and x is an integer from 1 to 20; carboxy(C 1 -C 4)alkyl or salts thereof; or (CH 2 CHR 6 -O) p (CH 2 CHR 9 -O) x H or salts thereof where R 9 is hydrogen or linear or branched (C 1 -C 4)alkyl; R 2 is chosen from hydrogen; linear or branched (C 1 -C 4)alkyl; (CH 2 CHR 6 -O) y H of salts thereof where R 6 is defined as above and y is an integer of 1 to 20; carboxy(C 1 -C 4)alkyl or salts thereof; or (CH 2 CHR 6 -O) q (CH 2 CHR 10 -O) y H or salts thereof where R 10 is hydrogen or linear or branched (C 1 -C 4)alkyl; R 3 is chosen from cocoalkyl; R'-O-(CH 2) m where R' is chosen from hydrogen, linear or branched, saturated or unsaturated (C 1 -C 20)alkyl, m is an integer of 1 to 4; (CH 2) m NR 7 R 8 where R 7 is (CH 2 CHR 6 -O) p (CH 2 CHR 9 -O) x H or salts thereof and R 8 is (CH 2 CHR 6 -O) q (CH 2 CHR 10 -O) y H or salts thereof; and G is (CH 2 CHR 6 -O) z H or salts thereof where z is an integer from 1 to 20 or → O and n is 0 or 1, and wherein the indium electroplating composition is free of alloying metals; p and q are independently chosen from integers of 1 to 20; and c) electroplating an indium metal layer on the nickel layer of the substrate with the indium electroplating composition.