A hybrid microwave attenuator configured to operate in a temperature range of a refrigeration stage, the attenuator comprising: a circuit having two ports (Port 1, Port 2), the circuit comprising: a resistive component configured to attenuate a plurality of frequencies in an input signal, and a dispersive component (304, 306, 404, 406, 604, 704) configured to attenuate a second plurality of frequencies within a frequency range, wherein the resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit, characterized in that: the dispersive component comprising an inductive element (L2, L3, L6) configured to provide an electrical-thermal path between a center conductor of the hybrid microwave attenuator and a ground of the hybrid microwave attenuator, the inductive element being formed of a first material that exhibits at least a first threshold level of therma conductivity, wherein the first threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates; and a housing, the housing comprising: a closable structure (902, 904, 906) in which the circuit is positioned, the structure being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at the cryogenic temperature range; and a pair of microwave connectors (908, 910), the pair of connectors thermally coupled to the housing. a resistive component configured to attenuate a plurality of frequencies in an input signal, and a dispersive component (304, 306, 404, 406, 604, 704) configured to attenuate a second plurality of frequencies within a frequency range, wherein the resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit, characterized in that: the dispersive component comprising an inductive element (L2, L3, L6) configured to provide an electrical-thermal path between a center conductor of the hybrid microwave attenuator and a ground of the hybrid microwave attenuator, the inductive element being formed of a first material that exhibits at least a first threshold level of therma conductivity, wherein the first threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates; and a housing, the housing comprising: a closable structure (902, 904, 906) in which the circuit is positioned, the structure being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at the cryogenic temperature range; and a pair of microwave connectors (908, 910), the pair of connectors thermally coupled to the housing. the dispersive component comprising an inductive element (L2, L3, L6) configured to provide an electrical-thermal path between a center conductor of the hybrid microwave attenuator and a ground of the hybrid microwave attenuator, the inductive element being formed of a first material that exhibits at least a first threshold level of therma conductivity, wherein the first threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates; and a housing, the housing comprising: a closable structure (902, 904, 906) in which the circuit is positioned, the structure being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at the cryogenic temperature range; and a pair of microwave connectors (908, 910), the pair of connectors thermally coupled to the housing.