A metal strip resistor, comprising: a metal strip having a generally planar top surface and a generally planar bottom surface forming a resistive element and providing support for the metal strip resistor without use of a separate substrate, the metal strip having a first end and an opposite second end; a first photolithographically formed termination area on the top surface of the metal strip adjacent the first end of the metal strip; a second photolithographically formed termination area on the top surface of the metal strip adjacent the second end of the metal strip; a third photolithographically formed termination area on the bottom surface of the metal strip adjacent the first end of the metal strip; a fourth photolithographically formed termination area on the bottom surface of the metal strip adjacent the second end of the metal strip; a plating on each of the first, second, third, and fourth termination areas, so as to render the first, second, third, and fourth termination areas conductive; a first plating layer covering the plating of the first termination area, extending along the first end of the metal strip, and covering the plating of the third termination area; a second plating layer covering the plating of the second termination area, extending along the second end of the metal strip, and covering the plating of the fourth termination area; a first insulating material overlaying the top surface of the metal strip between the first and second termination areas; and a second insulating material overlaying the bottom surface of the metal strip between the third and fourth termination areas; wherein the plating of the first termination area and the plating of the second termination area, each, do not overlap the first insulating material, and wherein the plating of the third termination area and the plating of the fourth termination area, each, do not overlap the second insulating material a metal strip having a generally planar top surface and a generally planar bottom surface forming a resistive element and providing support for the metal strip resistor without use of a separate substrate, the metal strip having a first end and an opposite second end; a first photolithographically formed termination area on the top surface of the metal strip adjacent the first end of the metal strip; a second photolithographically formed termination area on the top surface of the metal strip adjacent the second end of the metal strip; a third photolithographically formed termination area on the bottom surface of the metal strip adjacent the first end of the metal strip; a fourth photolithographically formed termination area on the bottom surface of the metal strip adjacent the second end of the metal strip; a plating on each of the first, second, third, and fourth termination areas, so as to render the first, second, third, and fourth termination areas conductive; a first plating layer covering the plating of the first termination area, extending along the first end of the metal strip, and covering the plating of the third termination area; a second plating layer covering the plating of the second termination area, extending along the second end of the metal strip, and covering the plating of the fourth termination area; a first insulating material overlaying the top surface of the metal strip between the first and second termination areas; and a second insulating material overlaying the bottom surface of the metal strip between the third and fourth termination areas; wherein the plating of the first termination area and the plating of the second termination area, each, do not overlap the first insulating material, and wherein the plating of the third termination area and the plating of the fourth termination area, each, do not overlap the second insulating material