Sensor unit comprising: at least one transducer element (102, 202) for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand; a sensor substrate (104, 204) with a first surface (108, 208) and an opposing second surface (110, 210), said sensor substrate (104, 204) comprising said transducer element (102, 202) and at least one first electrically conductive contact pad (114, 214) arranged on the first surface (108, 208) of the sensor substrate (104, 204), wherein said first electrically conductive contact pad is electrically connected to the transducer element; wherein a recess (116, 216) is provided in the sensor substrate (104, 204), the recess (116, 216) extending from the second surface (110, 210) to the first surface (108, 208), the recess being arranged to allow an electrically conductive material (124, 224, 126, 226) to be filled in wherein said sensor substrate (104, 204) is mounted on a circuit carrier (106, 206) in a way that the first surface (108, 208) faces a surface of the circuit carrier (106, 206); wherein the circuit carrier (106, 206) comprises at least one second electrically conductive pad (118, 218) arranged on the surface of the circuit carrier, wherein the first electrically conductive contact pad (114, 214) and the second electrically conductive contact pad (118, 218) are interconnected by the electrically conductive material (124, 224 126; 226); wherein the at least one transducer element (102, 202) is at least partly encompassed by a protective material (120, 220), the protective material being arranged to form a gap (122, 222) between the first electrically conductive contact pad (114, 214) and the second electrically conductive contact pad (118, 218). at least one transducer element (102, 202) for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand; a sensor substrate (104, 204) with a first surface (108, 208) and an opposing second surface (110, 210), said sensor substrate (104, 204) comprising said transducer element (102, 202) and at least one first electrically conductive contact pad (114, 214) arranged on the first surface (108, 208) of the sensor substrate (104, 204), wherein said first electrically conductive contact pad is electrically connected to the transducer element; wherein a recess (116, 216) is provided in the sensor substrate (104, 204), the recess (116, 216) extending from the second surface (110, 210) to the first surface (108, 208), the recess being arranged to allow an electrically conductive material (124, 224, 126, 226) to be filled in wherein said sensor substrate (104, 204) is mounted on a circuit carrier (106, 206) in a way that the first surface (108, 208) faces a surface of the circuit carrier (106, 206); wherein the circuit carrier (106, 206) comprises at least one second electrically conductive pad (118, 218) arranged on the surface of the circuit carrier, wherein the first electrically conductive contact pad (114, 214) and the second electrically conductive contact pad (118, 218) are interconnected by the electrically conductive material (124, 224 126; 226); wherein the at least one transducer element (102, 202) is at least partly encompassed by a protective material (120, 220), the protective material being arranged to form a gap (122, 222) between the first electrically conductive contact pad (114, 214) and the second electrically conductive contact pad (118, 218).