A system for use with a lithographic apparatus, the system configured to handle a substrate, wherein the system is adapted to be coupled to a gas source, the system comprising: a space (105, 107) through which the substrate passes; and a thermal shield for thermally insulating the space (105, 107) from a thermal load originating outside the space (105, 107), the thermal shield comprising: a first wall and a second wall with a gap therebetween, the first wall being positioned between the space (105, 107) and the second wall; at least one inlet opening defined by the first wall and the second wall and configured to allow a flow of gas from the gas source to enter the gap from outside the space (105, 107); and at least one outlet opening defined by the first wall and the second wall and configured to allow the flow of gas to exit the gap to outside of the space (105, 107), wherein the system is adapted to direct the flow of gas from the gas source to enter the gap through the at least one inlet opening, to flow through the gap and out of the gap to outside the space (105, 107) through the at least one outlet opening thereby to reduce thermal fluctuations in the space (105, 107) due to the thermal load originating outside the space (105, 107), and wherein the system is configured to pass the flow of gas from the gas source through an array of openings (210, 220), at least one opening of the array of openings (210, 220) being positioned to provide a flow of gas into the at least one inlet opening and at least one opening of the array of openings (210, 220) being positioned to provide a flow of gas into at least a part of the space (105, 107), such that gas flowing into the gap and into the space (105, 107) has substantially the same temperature. a space (105, 107) through which the substrate passes; and a thermal shield for thermally insulating the space (105, 107) from a thermal load originating outside the space (105, 107), the thermal shield comprising: a first wall and a second wall with a gap therebetween, the first wall being positioned between the space (105, 107) and the second wall; at least one inlet opening defined by the first wall and the second wall and configured to allow a flow of gas from the gas source to enter the gap from outside the space (105, 107); and at least one outlet opening defined by the first wall and the second wall and configured to allow the flow of gas to exit the gap to outside of the space (105, 107), a first wall and a second wall with a gap therebetween, the first wall being positioned between the space (105, 107) and the second wall; at least one inlet opening defined by the first wall and the second wall and configured to allow a flow of gas from the gas source to enter the gap from outside the space (105, 107); and at least one outlet opening defined by the first wall and the second wall and configured to allow the flow of gas to exit the gap to outside of the space (105, 107), wherein the system is adapted to direct the flow of gas from the gas source to enter the gap through the at least one inlet opening, to flow through the gap and out of the gap to outside the space (105, 107) through the at least one outlet opening thereby to reduce thermal fluctuations in the space (105, 107) due to the thermal load originating outside the space (105, 107), and wherein the system is configured to pass the flow of gas from the gas source through an array of openings (210, 220), at least one opening of the array of openings (210, 220) being positioned to provide a flow of gas into the at least one inlet opening and at least one opening of the array of openings (210, 220) being positioned to provide a flow of gas into at least a part of the space (105, 107), such that gas flowing into the gap and into the space (105, 107) has substantially the same temperature.