An integrated Electro Chemical Pattern Replication, ECPR system for performing electrochemical printing of nano or micro structures, using a master, onto a conductive surface of a substrate, comprising: - a housing; - a filling unit (202, 304, 404, 508, 610) and a cleaning unit (406, 512, 612, 704), where the master is an electrode with an insulating patterned layer forming cavities, where the filling unit is configured to deposit a material in the cavities of the master, and the cleaning unit is configured to clean at least one of the surface of the substrate and/or a surface of the master; - an ECPR printing unit (206, 308, 408, 510, 524, 614, 710) configured to electrochemically transfer material, either deposited in the master cavities in a filling unit, as nano or micro structures from the master to the conductive surface of the substrate in electrolyte filled cells, which are formed by the master cavities and the conducting surface of the substrate when placing the master in close contact with the substrate or by dissolving material from the substrate while depositing said material in the master by use of the electrolyte filled cells, which are formed by the master cavities and the conducting surface of the substrate when placing the master in close contact with the substrate; - a tool platform comprising a master and substrate robot unit having at least one end effector (518, 520) configured to grip, fold, transfer and release the master or the substrate, the tool platform further comprising a robot control unit and a scheduler that are configured to control the robot unit for handling the master and the substrate in a single wafer flow, and to provide instructions for handling of masters and substrate to the integrated ECPR system, respectively, wherein the housing is configured to enclose the filing unit, the cleaning unit and the ECPR printing unit, and to provide a confined interior having a sub-environment of the integrated ECPR system - a housing; - a filling unit (202, 304, 404, 508, 610) and a cleaning unit (406, 512, 612, 704), where the master is an electrode with an insulating patterned layer forming cavities, where the filling unit is configured to deposit a material in the cavities of the master, and the cleaning unit is configured to clean at least one of the surface of the substrate and/or a surface of the master; - an ECPR printing unit (206, 308, 408, 510, 524, 614, 710) configured to electrochemically transfer material, either deposited in the master cavities in a filling unit, as nano or micro structures from the master to the conductive surface of the substrate in electrolyte filled cells, which are formed by the master cavities and the conducting surface of the substrate when placing the master in close contact with the substrate or by dissolving material from the substrate while depositing said material in the master by use of the electrolyte filled cells, which are formed by the master cavities and the conducting surface of the substrate when placing the master in close contact with the substrate; - a tool platform comprising a master and substrate robot unit having at least one end effector (518, 520) configured to grip, fold, transfer and release the master or the substrate, the tool platform further comprising a robot control unit and a scheduler that are configured to control the robot unit for handling the master and the substrate in a single wafer flow, and to provide instructions for handling of masters and substrate to the integrated ECPR system, respectively, wherein the housing is configured to enclose the filing unit, the cleaning unit and the ECPR printing unit, and to provide a confined interior having a sub-environment of the integrated ECPR system