A fretting-resistant connector, comprising: at least one male terminal and at least one female terminal, wherein said male terminal comprises a part for connection in order to be connected to said female terminal thereto; and an organic coating that is formed of an organic compound, wherein the organic compound is an ether compound selected from the group consisting of dipropyl ether, allyl phenyl ether, ethyl isobutyl ether, ethylene glycol diphenyl ether, nonyldiphenyl ether, triphenyl ether and tetraphenyl ether; wherein said organic coating is formed on to at least a part of a surface of an electrically conductive metal material that forms said male terminal and said part for connection as well; wherein a thickness of said organic coating is between 0.0001 μm and 0.1 μm; wherein said electrically conductive metal material comprises an electrically conductive surface layer on to an electrically conductive substance, wherein the electrically conductive surface layer is formed of tin, a tin-copper alloy, a tin-silver alloy, or a tin-silver-copper alloy, or wherein the electrically conductive surface layer is formed of a metal composition in which there is designed for tin to be dispersed at a side of a surface of a layer that is formed of any one of an intermetallic compound of copper and tin, an intermetallic compound of nickel and tin, or an intermetallic compound of tin and silver; and wherein the organic coating is provided into the tin, the tin-copper alloy, the tin-silver alloy, or the tin-silver-copper alloy with adsorption of the organic coating. at least one male terminal and at least one female terminal, wherein said male terminal comprises a part for connection in order to be connected to said female terminal thereto; and an organic coating that is formed of an organic compound, wherein the organic compound is an ether compound selected from the group consisting of dipropyl ether, allyl phenyl ether, ethyl isobutyl ether, ethylene glycol diphenyl ether, nonyldiphenyl ether, triphenyl ether and tetraphenyl ether; wherein said organic coating is formed on to at least a part of a surface of an electrically conductive metal material that forms said male terminal and said part for connection as well; wherein a thickness of said organic coating is between 0.0001 μm and 0.1 μm; wherein said electrically conductive metal material comprises an electrically conductive surface layer on to an electrically conductive substance, wherein the electrically conductive surface layer is formed of tin, a tin-copper alloy, a tin-silver alloy, or a tin-silver-copper alloy, or wherein the electrically conductive surface layer is formed of a metal composition in which there is designed for tin to be dispersed at a side of a surface of a layer that is formed of any one of an intermetallic compound of copper and tin, an intermetallic compound of nickel and tin, or an intermetallic compound of tin and silver; and wherein the organic coating is provided into the tin, the tin-copper alloy, the tin-silver alloy, or the tin-silver-copper alloy with adsorption of the organic coating. said organic coating is formed on to at least a part of a surface of an electrically conductive metal material that forms said male terminal and said part for connection as well; wherein a thickness of said organic coating is between 0.0001 μm and 0.1 μm; wherein said electrically conductive metal material comprises an electrically conductive surface layer on to an electrically conductive substance, wherein the electrically conductive surface layer is formed of tin, a tin-copper alloy, a tin-silver alloy, or a tin-silver-copper alloy, or wherein the electrically conductive surface layer is formed of a metal composition in which there is designed for tin to be dispersed at a side of a surface of a layer that is formed of any one of an intermetallic compound of copper and tin, an intermetallic compound of nickel and tin, or an intermetallic compound of tin and silver; and wherein the organic coating is provided into the tin, the tin-copper alloy, the tin-silver alloy, or the tin-silver-copper alloy with adsorption of the organic coating.