An electronics module for utilization onboard an airborne object, the electronics module comprising: a housing (16/18) having a cavity therein; a first printed circuit board 'PCB' disposed in the cavity and mounting first electronic devices; a second PCB disposed in the cavity spaced from the first PCB and mounting second electronic devices; a third PCB disposed in the cavity spaced from the second PCB and mounting third electronic devices; wherein the first electronic devices are mounted on a face of the first PCB facing the second PCB and the second electronic devices are mounted on a face of the second PCB facing the third PCB; and the electronics module further comprising: a first supportive interconnect structure, comprising: a first annular insulative body extending around an inner circumferential portion of the housing (16/18) between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB; and a first plurality of vias formed through the first annular insulative body and electrically coupling the first PCB to the second PCB; and a second supportive interconnect structure, comprising: a second annular insulative body extending around an inner circumferential portion of the housing (16/18) between the second PCB and the third PCB to support the third PCB and to axially space the third PCB from the second PCB; and a second plurality of vias formed through the second annular insulative body and electrically coupling the second PCB to the third PCB; wherein a first axial height of the first annular insulative body is greater than a height of the first electronic devices, and a second axial height of the second annular insulative body is greater than a height of the second electronic devices, the first axial height of the first annular insulative body being different from the second axial height of the second annular insulative body. a housing (16/18) having a cavity therein; a first printed circuit board 'PCB' disposed in the cavity and mounting first electronic devices; a second PCB disposed in the cavity spaced from the first PCB and mounting second electronic devices; a third PCB disposed in the cavity spaced from the second PCB and mounting third electronic devices; wherein the first electronic devices are mounted on a face of the first PCB facing the second PCB and the second electronic devices are mounted on a face of the second PCB facing the third PCB; and the electronics module further comprising: a first supportive interconnect structure, comprising: a first annular insulative body extending around an inner circumferential portion of the housing (16/18) between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB; and a first plurality of vias formed through the first annular insulative body and electrically coupling the first PCB to the second PCB; and a first annular insulative body extending around an inner circumferential portion of the housing (16/18) between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB; and a first plurality of vias formed through the first annular insulative body and electrically coupling the first PCB to the second PCB; and a second supportive interconnect structure, comprising: a second annular insulative body extending around an inner circumferential portion of the housing (16/18) between the second PCB and the third PCB to support the third PCB and to axially space the third PCB from the second PCB; and a second plurality of vias formed through the second annular insulative body and electrically coupling the second PCB to the third PCB; a second annular insulative body extending around an inner circumferential portion of the housing (16/18) between the second PCB and the third PCB to support the third PCB and to axially space the third PCB from the second PCB; and a second plurality of vias formed through the second annular insulative body and electrically coupling the second PCB to the third PCB; wherein a first axial height of the first annular insulative body is greater than a height of the first electronic devices, and a second axial height of the second annular insulative body is greater than a height of the second electronic devices, the first axial height of the first annular insulative body being different from the second axial height of the second annular insulative body.