An electronic device, comprising a housing and/or a display screen, wherein the housing and/or the display screen are/is provided with a camera region, the camera region is provided with a camera module (1, 2, 11, 21), and the camera module (1, 2, 11, 21) has a camera module structure; wherein the camera module structure comprises a mainboard (3, 31), a first camera module (1, 2, 11, 21), a second camera module (1, 2, 11, 21), and a time of flight TOF device (4, 41) including a transmitter and a sensor, wherein the TOF device (4,41) is located between the first camera module (1, 2, 11, 21) and the second camera module (1, 2, 11, 21), the mainboard (3, 31) is provided with a first mounting portion (31, 32) and a second mounting portion (4, 32) that are hollowed-out, and the first camera module (1, 2, 11, 21) and the second camera module (1, 2, 11, 21) each are provided with a bracket (2, 3, 11, 21) and are respectively mounted to the first mounting portion (31, 32) and the second mounting portion (4, 32) via the brackets (2, 3, 11, 21); and the mainboard (3, 31) comprises a spacing portion (5, 6) for separation between the first mounting portion (31, 32) and the second mounting portion (4, 32), the TOF device (4, 41) is disposed on an upper surface of an auxiliary circuit board (6, 61), a width of the auxiliary circuit board (6, 61) is greater than a width of the spacing portion (5, 6), the auxiliary circuit board (6, 61) is located on an upper surface of the mainboard (3, 31), and the auxiliary circuit board (6, 61) is connected to the mainboard (3, 31) and at least partially overlapped with the spacing portion (5, 6); wherein a region in which the auxiliary circuit board (6, 61) is overlapped with the bracket (2, 3, 11, 21) of the first camera module (1, 2, 11, 21) and/or a region in which the auxiliary circuit board (6, 61) is overlapped with the bracket (2, 3, 11, 21) of the second camera module (1, 2, 11, 21) are/is provided with a material removal portion (61, 62) whose depth is less than a thickness of the region on a lower surface of the auxiliary circuit board (6, 61), so that the auxiliary circuit board (6, 61) is partially suspended, and a portion in which the bracket (2, 3, 11, 21) of the first camera module (1, 2, 11, 21) and/or a portion in which the bracket (2, 3, 11, 21) of the second camera module (1, 2, 11, 21) are/is overlapped with the auxiliary circuit board (6, 61) are/is accommodated via the material removal portion (61, 62). the camera module structure comprises a mainboard (3, 31), a first camera module (1, 2, 11, 21), a second camera module (1, 2, 11, 21), and a time of flight TOF device (4, 41) including a transmitter and a sensor, wherein the TOF device (4,41) is located between the first camera module (1, 2, 11, 21) and the second camera module (1, 2, 11, 21), the mainboard (3, 31) is provided with a first mounting portion (31, 32) and a second mounting portion (4, 32) that are hollowed-out, and the first camera module (1, 2, 11, 21) and the second camera module (1, 2, 11, 21) each are provided with a bracket (2, 3, 11, 21) and are respectively mounted to the first mounting portion (31, 32) and the second mounting portion (4, 32) via the brackets (2, 3, 11, 21); and the mainboard (3, 31) comprises a spacing portion (5, 6) for separation between the first mounting portion (31, 32) and the second mounting portion (4, 32), the TOF device (4, 41) is disposed on an upper surface of an auxiliary circuit board (6, 61), a width of the auxiliary circuit board (6, 61) is greater than a width of the spacing portion (5, 6), the auxiliary circuit board (6, 61) is located on an upper surface of the mainboard (3, 31), and the auxiliary circuit board (6, 61) is connected to the mainboard (3, 31) and at least partially overlapped with the spacing portion (5, 6); wherein a region in which the auxiliary circuit board (6, 61) is overlapped with the bracket (2, 3, 11, 21) of the first camera module (1, 2, 11, 21) and/or a region in which the auxiliary circuit board (6, 61) is overlapped with the bracket (2, 3, 11, 21) of the second camera module (1, 2, 11, 21) are/is provided with a material removal portion (61, 62) whose depth is less than a thickness of the region on a lower surface of the auxiliary circuit board (6, 61), so that the auxiliary circuit board (6, 61) is partially suspended, and a portion in which the bracket (2, 3, 11, 21) of the first camera module (1, 2, 11, 21) and/or a portion in which the bracket (2, 3, 11, 21) of the second camera module (1, 2, 11, 21) are/is overlapped with the auxiliary circuit board (6, 61) are/is accommodated via the material removal portion (61, 62).