An in-vehicle computing apparatus for an intelligent vehicle, comprising: two stacked mainboards (40, 50), each mainboard comprises a plurality of components, the plurality of components are configured to perform driving status control on the intelligent vehicle; a radiator (10, 70) that is disposed between the two mainboards (40, 50) and connected to each mainboard in a thermally conductive manner; and two sealing plates (20, 30), each one corresponding to a respective mainboard and connected to the radiator (10, 70) and each one disposed on a side of the respective mainboard that is away from the radiator (10, 70), wherein each mainboard has at least one first functional component and a first surface facing the radiator (10, 70), wherein the at least one first functional component is disposed on the first surface, and the at least one first functional component is connected to the radiator (10, 70) in a thermally conductive manner, wherein the being connected in a thermally conductive manner comprises: being connected using thermally conductive medium; wherein each mainboard has at least one second functional component and a second surface away from the radiator (10, 70), and wherein the at least one second functional component is disposed on the second surface; and each sealing plate (20, 30) is a heat dissipation plate, and each second functional component of each mainboard is connected to the corresponding heat dissipation plate in a thermally conductive manner; wherein the radiator is an air-cooling radiator, the air-cooling radiator comprises a housing, a heat dissipation channel disposed on the housing, and an air supply module; and the air supply module comprises: a first fan module and a second fan module that are arranged along a length direction of the heat dissipation channel, and the first fan module and the second fan module have a same air supply direction, wherein the first fan module and the second fan module are each detachably and fixedly connected to the housing. two stacked mainboards (40, 50), each mainboard comprises a plurality of components, the plurality of components are configured to perform driving status control on the intelligent vehicle; a radiator (10, 70) that is disposed between the two mainboards (40, 50) and connected to each mainboard in a thermally conductive manner; and two sealing plates (20, 30), each one corresponding to a respective mainboard and connected to the radiator (10, 70) and each one disposed on a side of the respective mainboard that is away from the radiator (10, 70), wherein each mainboard has at least one first functional component and a first surface facing the radiator (10, 70), wherein the at least one first functional component is disposed on the first surface, and the at least one first functional component is connected to the radiator (10, 70) in a thermally conductive manner, wherein the being connected in a thermally conductive manner comprises: being connected using thermally conductive medium; wherein each mainboard has at least one second functional component and a second surface away from the radiator (10, 70), and wherein the at least one second functional component is disposed on the second surface; and each sealing plate (20, 30) is a heat dissipation plate, and each second functional component of each mainboard is connected to the corresponding heat dissipation plate in a thermally conductive manner; wherein the radiator is an air-cooling radiator, the air-cooling radiator comprises a housing, a heat dissipation channel disposed on the housing, and an air supply module; and the air supply module comprises: a first fan module and a second fan module that are arranged along a length direction of the heat dissipation channel, and the first fan module and the second fan module have a same air supply direction, wherein the first fan module and the second fan module are each detachably and fixedly connected to the housing. a first fan module and a second fan module that are arranged along a length direction of the heat dissipation channel, and the first fan module and the second fan module have a same air supply direction, wherein the first fan module and the second fan module are each detachably and fixedly connected to the housing.