An assembly for cooling a power module, including: a heat sink with a threaded hole formed on its upper surface; a power module provided on the upper surface of the heat sink; and a screw; wherein the power module, comprises: a substrate including an electrical circuit; a cover formed into one piece, including a first part and a second part, wherein the first part covers at least a part of the substrate, the second part is connected to the first part and disposed in an area that does not overlap with the substrate, the second part of the cover includes a lower portion having a base with an upper surface and a lower surface, the base includes a through-hole which is directed from the upper surface of the base to the lower surface of the base, the screw passes through the through-hole of the base and is screwed in the threaded hole of the heat sink so that the screw down force applied by the screw on the base exerts a pressing force onto the substrate and ensures thermal contact between the substrate and the heat sink, and the lower surface of the substrate is in contact with the upper surface of the heat sink, characterized in that a part of the upper surface of the substrate is adhered to a lower portion of the first part of the cover with a flexible glue, the base includes a protrusion at its lower surface, the through-hole is disposed between the protrusion and the first part of the cover, the protrusion on the lower surface of the base is in contact with the upper surface of the heat sink, the second part of the cover includes a bridge (534_1) connecting an upper portion of the second part of the cover and an upper portion of the first part of the cover, and the screw passing through the through-hole and screwed in the threaded hole is the single screw that fixes the power module to the heat sink. a heat sink with a threaded hole formed on its upper surface; a power module provided on the upper surface of the heat sink; and a screw; wherein the power module, comprises: a substrate including an electrical circuit; a cover formed into one piece, including a first part and a second part, wherein the first part covers at least a part of the substrate, the second part is connected to the first part and disposed in an area that does not overlap with the substrate, the second part of the cover includes a lower portion having a base with an upper surface and a lower surface, the base includes a through-hole which is directed from the upper surface of the base to the lower surface of the base, the screw passes through the through-hole of the base and is screwed in the threaded hole of the heat sink so that the screw down force applied by the screw on the base exerts a pressing force onto the substrate and ensures thermal contact between the substrate and the heat sink, and the lower surface of the substrate is in contact with the upper surface of the heat sink, characterized in that a part of the upper surface of the substrate is adhered to a lower portion of the first part of the cover with a flexible glue, the base includes a protrusion at its lower surface, the through-hole is disposed between the protrusion and the first part of the cover, the protrusion on the lower surface of the base is in contact with the upper surface of the heat sink, the second part of the cover includes a bridge (534_1) connecting an upper portion of the second part of the cover and an upper portion of the first part of the cover, and the screw passing through the through-hole and screwed in the threaded hole is the single screw that fixes the power module to the heat sink. a substrate including an electrical circuit; a cover formed into one piece, including a first part and a second part, wherein the first part covers at least a part of the substrate, the second part is connected to the first part and disposed in an area that does not overlap with the substrate, the second part of the cover includes a lower portion having a base with an upper surface and a lower surface, the base includes a through-hole which is directed from the upper surface of the base to the lower surface of the base, the screw passes through the through-hole of the base and is screwed in the threaded hole of the heat sink so that the screw down force applied by the screw on the base exerts a pressing force onto the substrate and ensures thermal contact between the substrate and the heat sink, and the lower surface of the substrate is in contact with the upper surface of the heat sink, characterized in that a part of the upper surface of the substrate is adhered to a lower portion of the first part of the cover with a flexible glue, the base includes a protrusion at its lower surface, the through-hole is disposed between the protrusion and the first part of the cover, the protrusion on the lower surface of the base is in contact with the upper surface of the heat sink, the second part of the cover includes a bridge (534_1) connecting an upper portion of the second part of the cover and an upper portion of the first part of the cover, and the screw passing through the through-hole and screwed in the threaded hole is the single screw that fixes the power module to the heat sink.