A manufacturing method of a bonded body, the method comprising: a step of preparing a first member, a second member, and a film-shaped bonding material, wherein each of the first member and the second member is a carbon material and wherein the film-shaped bonding material includes at least 0.1 wt% to at most 5 wt% of at least one element which can form a compound along with tin and carbon, wherein elements which can form a compound along with tin and carbon are selected from the group consisting of Ti, V and Zr, and wherein the total amount of elements which can form a compound along with tin and carbon is at least 0.1 wt% to at most 5 wt%, to the total weight of the film-shaped bonding material; and Sn as single remainder; a step of bonding the first member and the second member to each other, the bonding step including: disposing the film-shaped bonding material between the first member and the second member; hot pressing on first member, second member, and bonding material under a nitrogen atmosphere at 250°C or higher and 1500°C or lower for a suitable time; and then cooling; thereby forming a junction configured by a bonding material layer and compound layer, wherein the compound layer is configured from a compound of the at least one element, tin, and carbon, at an interface between the first member and the bonding material layer and an interface between the second member and the bonding material layer. a step of preparing a first member, a second member, and a film-shaped bonding material, wherein each of the first member and the second member is a carbon material and wherein the film-shaped bonding material includes at least 0.1 wt% to at most 5 wt% of at least one element which can form a compound along with tin and carbon, wherein elements which can form a compound along with tin and carbon are selected from the group consisting of Ti, V and Zr, and wherein the total amount of elements which can form a compound along with tin and carbon is at least 0.1 wt% to at most 5 wt%, to the total weight of the film-shaped bonding material; and Sn as single remainder; wherein each of the first member and the second member is a carbon material and wherein the film-shaped bonding material includes at least 0.1 wt% to at most 5 wt% of at least one element which can form a compound along with tin and carbon, wherein elements which can form a compound along with tin and carbon are selected from the group consisting of Ti, V and Zr, and wherein the total amount of elements which can form a compound along with tin and carbon is at least 0.1 wt% to at most 5 wt%, to the total weight of the film-shaped bonding material; and Sn as single remainder; a step of bonding the first member and the second member to each other, the bonding step including: disposing the film-shaped bonding material between the first member and the second member; hot pressing on first member, second member, and bonding material under a nitrogen atmosphere at 250°C or higher and 1500°C or lower for a suitable time; and then cooling; thereby forming a junction configured by a bonding material layer and compound layer, wherein the compound layer is configured from a compound of the at least one element, tin, and carbon, at an interface between the first member and the bonding material layer and an interface between the second member and the bonding material layer. disposing the film-shaped bonding material between the first member and the second member; hot pressing on first member, second member, and bonding material under a nitrogen atmosphere at 250°C or higher and 1500°C or lower for a suitable time; and then cooling; thereby forming a junction configured by a bonding material layer and compound layer, wherein the compound layer is configured from a compound of the at least one element, tin, and carbon, at an interface between the first member and the bonding material layer and an interface between the second member and the bonding material layer. thereby forming a junction configured by a bonding material layer and compound layer, wherein the compound layer is configured from a compound of the at least one element, tin, and carbon, at an interface between the first member and the bonding material layer and an interface between the second member and the bonding material layer.