A cooling system where a semiconductor component comprising a semiconductor chip and a cooling apparatus are joined, the system comprising: the semiconductor component comprising a substrate, where at least one semiconductor chip is installed on one side thereof, a package housing covering the substrate, and at least one terminal lead electrically connected to the semiconductor chip/chips ohipo and exposed to the outside of the package housing, wherein the other sides of the substrate are partly or entirely exposed to the upper surface, the lower surface, or the upper and lower surfaces of the package housing; and the cooling apparatus comprising a cover body and at least one cooling post, wherein the cover body comprises a coolant flow path in an inner space thereof and at least one opening on one side thereof where the substrate contacts, and the at least one cooling post is arranged vertically across the inner space of the cover body and is formed of a conductive or non-conductive material, wherein the cooling apparatus further comprises at least one inlet, where a coolant flows in, and at least one outle t, from where a coolant is discharged, areas of the upper surfaces or the lower surfaces of the semiconductor components are larger than areas of the opening and the length of the substrates exposed to the surface of the package housing is longer than at least one length of the opening, and heat generated and transmitted from the semiconductor chip to the substrate, which is exposed through the opening, and the cooling post/posts is/are directly cooled by a coolant characterised in that the cooling post/posts is/are formed in a spring structure having an elastic force. the semiconductor component comprising a substrate, where at least one semiconductor chip is installed on one side thereof, a package housing covering the substrate, and at least one terminal lead electrically connected to the semiconductor chip/chips ohipo and exposed to the outside of the package housing, wherein the other sides of the substrate are partly or entirely exposed to the upper surface, the lower surface, or the upper and lower surfaces of the package housing; and the cooling apparatus comprising a cover body and at least one cooling post, wherein the cover body comprises a coolant flow path in an inner space thereof and at least one opening on one side thereof where the substrate contacts, and the at least one cooling post is arranged vertically across the inner space of the cover body and is formed of a conductive or non-conductive material, wherein the cooling apparatus further comprises at least one inlet, where a coolant flows in, and at least one outle t, from where a coolant is discharged, areas of the upper surfaces or the lower surfaces of the semiconductor components are larger than areas of the opening and the length of the substrates exposed to the surface of the package housing is longer than at least one length of the opening, and heat generated and transmitted from the semiconductor chip to the substrate, which is exposed through the opening, and the cooling post/posts is/are directly cooled by a coolant characterised in that the cooling post/posts is/are formed in a spring structure having an elastic force.