A direct view display device, comprising: a backplane comprising a plurality of bond pads (421, 422, 423) on the backplane; an array of pixels on the backplane, each pixel comprising a red light emitting diode, a green light emitting diode, and a blue light emitting diode; transparent conductive layers that each contact a respective one of the red, green, and blue light emitting diodes; dielectric material layers that each contact a respective one of the transparent conductive layers and surround a respective one of the red, green, and blue light emitting diodes; reflective metal layers (82, 138) that each contact a respective one of the dielectric material layers and are electrically shorted to a respective one of the red, green, and blue light emitting diodes through a transparent conductive layer; electrically conductive barrier layers (84, 86) contacting a respective one of the reflective metal layers (82, 138); bonding structures (431, 432, 433) that each contact a respective one of the electrically conductive barrier layers (84, 86) and bond the respective one of the red, green and blue light emitting diodes within each pixel to a respective one of the bond pads (421, 422, 423) on the backplane; a dielectric matrix laterally surrounding each of the red, green and blue light emitting diodes within the array of pixels, the dielectric matrix having a planarized top surface; and a common front side transparent conductive oxide layer located on the planarized top surface of the dielectric matrix and electrically connected to contact nodes of each of the red, green, and blue light emitting diode in each pixel, wherein the red light emitting diodes are configured to emit a peak wavelength in a range from 620 nm to 750 nm, the green light emitting diodes are configured to emit a peak wavelength in a range from 495 nm to 570 nm, and the blue light emitting diodes are configured to emit a peak wavelength in a range from 450 nm to 495 nm. a backplane comprising a plurality of bond pads (421, 422, 423) on the backplane; an array of pixels on the backplane, each pixel comprising a red light emitting diode, a green light emitting diode, and a blue light emitting diode; transparent conductive layers that each contact a respective one of the red, green, and blue light emitting diodes; dielectric material layers that each contact a respective one of the transparent conductive layers and surround a respective one of the red, green, and blue light emitting diodes; reflective metal layers (82, 138) that each contact a respective one of the dielectric material layers and are electrically shorted to a respective one of the red, green, and blue light emitting diodes through a transparent conductive layer; electrically conductive barrier layers (84, 86) contacting a respective one of the reflective metal layers (82, 138); bonding structures (431, 432, 433) that each contact a respective one of the electrically conductive barrier layers (84, 86) and bond the respective one of the red, green and blue light emitting diodes within each pixel to a respective one of the bond pads (421, 422, 423) on the backplane; a dielectric matrix laterally surrounding each of the red, green and blue light emitting diodes within the array of pixels, the dielectric matrix having a planarized top surface; and a common front side transparent conductive oxide layer located on the planarized top surface of the dielectric matrix and electrically connected to contact nodes of each of the red, green, and blue light emitting diode in each pixel, wherein the red light emitting diodes are configured to emit a peak wavelength in a range from 620 nm to 750 nm, the green light emitting diodes are configured to emit a peak wavelength in a range from 495 nm to 570 nm, and the blue light emitting diodes are configured to emit a peak wavelength in a range from 450 nm to 495 nm.