A capacitor, wherein the capacitor comprises: at least one multi-wing structure, wherein each multi-wing structure comprises an axis and M wings, wherein the axis extends along a first direction, and the M wings are a convex structure formed by extending from side walls of the axis toward a direction perpendicular to the first direction, a first wing of the M wings and the axis are formed of a first conductive material, and wings other than the first wing are formed of a second conductive material, where M is an integer greater than or equal to 2, and N is a positive integer; a conductive structure cladding the multi-wing structure; a dielectric layer disposed between the multi-wing structure and the conductive structure to isolate the multi-wing structure from the conductive structure; at least one first external electrode, wherein each first external electrode of the at least one first external electrode is electrically connected to some or all multi-wing structures of the at least one multi-wing structure; and at least one second external electrode, wherein the second external electrode is electrically connected to the conductive structure; wherein the capacitor further comprises: an interlayer dielectric layer, wherein the interlayer dielectric layer is disposed on an upper surface of the conductive structure, a second via structure is disposed in the interlayer dielectric layer and penetrates through the interlayer dielectric layer, the second external electrode is electrically connected to the conductive structure through the second via structure; and wherein the capacitor further comprises: a substrate disposed under the multi-wing structure, and the dielectric layer is further disposed between the conductive structure and the substrate to isolate the conductive structure from the substrate; and an isolation ring located outside the at least one multi-wing structure, wherein the isolation ring is disposed in the conductive structure and extends into the conductive structure along the first direction from an upper surface of the conductive structure to isolate the conductive structure into a first region and a second region, and the second external electrode is only electrically connected to the conductive structure in the first region; wherein the axis extends into the substrate along the first direction from an upper surface of the substrate. at least one multi-wing structure, wherein each multi-wing structure comprises an axis and M wings, wherein the axis extends along a first direction, and the M wings are a convex structure formed by extending from side walls of the axis toward a direction perpendicular to the first direction, a first wing of the M wings and the axis are formed of a first conductive material, and wings other than the first wing are formed of a second conductive material, where M is an integer greater than or equal to 2, and N is a positive integer; a conductive structure cladding the multi-wing structure; a dielectric layer disposed between the multi-wing structure and the conductive structure to isolate the multi-wing structure from the conductive structure; at least one first external electrode, wherein each first external electrode of the at least one first external electrode is electrically connected to some or all multi-wing structures of the at least one multi-wing structure; and at least one second external electrode, wherein the second external electrode is electrically connected to the conductive structure; wherein the capacitor further comprises: an interlayer dielectric layer, wherein the interlayer dielectric layer is disposed on an upper surface of the conductive structure, a second via structure is disposed in the interlayer dielectric layer and penetrates through the interlayer dielectric layer, the second external electrode is electrically connected to the conductive structure through the second via structure; and wherein the capacitor further comprises: a substrate disposed under the multi-wing structure, and the dielectric layer is further disposed between the conductive structure and the substrate to isolate the conductive structure from the substrate; and an isolation ring located outside the at least one multi-wing structure, wherein the isolation ring is disposed in the conductive structure and extends into the conductive structure along the first direction from an upper surface of the conductive structure to isolate the conductive structure into a first region and a second region, and the second external electrode is only electrically connected to the conductive structure in the first region; wherein the axis extends into the substrate along the first direction from an upper surface of the substrate. a substrate disposed under the multi-wing structure, and the dielectric layer is further disposed between the conductive structure and the substrate to isolate the conductive structure from the substrate; and an isolation ring located outside the at least one multi-wing structure, wherein the isolation ring is disposed in the conductive structure and extends into the conductive structure along the first direction from an upper surface of the conductive structure to isolate the conductive structure into a first region and a second region, and the second external electrode is only electrically connected to the conductive structure in the first region; wherein the axis extends into the substrate along the first direction from an upper surface of the substrate.