Method of manufacturing a multitude of micro-optoelectronic devices (100 - 400; 700) for light-field photography, comprising: providing a first wafer comprising a semiconductor material; providing a second wafer comprising an optically transparent material; producing a multitude of light sensor arrangements (4A - 4C) in the semiconductor material of the first wafer for each of the micro-optical devices (100 - 400; 700) to be manufactured; structuring the second wafer such that a multitude of micro-optical lenses (1A - 1C; 1A' - 1C') are formed therein for each of the micro-optoelectronic devices (100 - 400; 700) to be manufactured; producing a wafer stack by means of wafer bonding, said wafer stack comprising the first wafer (3, 3', 3") and the second wafer arranged above same, each of the micro-optical lenses (1A - 1C; 1A' - 1C') being arranged and optically structured such that light beams directed from a point of an object onto the micro-optical lens by a main lens at different angles of incidence (9A - 9C, 10A - 10C; 15a - 15c) are directed onto different light sensor elements (4a - 4e) of a light sensor arrangement (4A - 4C) at least partly arranged below said micro-optical lens; and dicing the wafer stack into the multitude of micro-optoelectronic devices (100 - 400; 700), characterized in that the method additionally comprises: producing an optically transparent window in the first wafer so that light of a light source located beyond a side of the first wafer which faces away from the second wafer may pass through the first wafer. providing a first wafer comprising a semiconductor material; providing a second wafer comprising an optically transparent material; producing a multitude of light sensor arrangements (4A - 4C) in the semiconductor material of the first wafer for each of the micro-optical devices (100 - 400; 700) to be manufactured; structuring the second wafer such that a multitude of micro-optical lenses (1A - 1C; 1A' - 1C') are formed therein for each of the micro-optoelectronic devices (100 - 400; 700) to be manufactured; producing a wafer stack by means of wafer bonding, said wafer stack comprising the first wafer (3, 3', 3") and the second wafer arranged above same, each of the micro-optical lenses (1A - 1C; 1A' - 1C') being arranged and optically structured such that light beams directed from a point of an object onto the micro-optical lens by a main lens at different angles of incidence (9A - 9C, 10A - 10C; 15a - 15c) are directed onto different light sensor elements (4a - 4e) of a light sensor arrangement (4A - 4C) at least partly arranged below said micro-optical lens; and dicing the wafer stack into the multitude of micro-optoelectronic devices (100 - 400; 700), characterized in that the method additionally comprises: producing an optically transparent window in the first wafer so that light of a light source located beyond a side of the first wafer which faces away from the second wafer may pass through the first wafer. producing an optically transparent window in the first wafer so that light of a light source located beyond a side of the first wafer which faces away from the second wafer may pass through the first wafer.