An electronic component mounting method in which at least one of the component quantity or the component types are different for a first set of electronic components to be mounted on a first board and a second set of electronic components to be mounted on a second board, and using an electronic component mounting system in which multiple component mounters are arranged in series with respective first conveyance lanes of the component mounters connected in series and respective second conveyance lanes of the component mounters connected in series, the component mounters being equipped with a board conveyance device having a first conveyance lane that loads and unloads a first board and a second conveyance lane that loads and unloads a second board, and a component transfer device having a first mounting head, provided adjacent to the first conveyance lane, that is capable of movement and of mounting electronic components on the first board loaded on the first conveyance lane and of mounting electronic components on the second board loaded on the second conveyance lane, and a second mounting head, provided adjacent to the second conveyance lane, that is capable of movement and of mounting electronic components on the first board loaded on the first conveyance lane and of mounting electronic components on the second board loaded on the second conveyance lane, the electronic component mounting method being characterized by: setting a portion of the multiple electronic component mounters as independent production mounters, in which the first mounting head mounts electronic components on the first board loaded on the first conveyance lane and second mounting head mounts electronic components on second board on second conveyance lane using second mounting head, and the remaining portion of the multiple electronic component mounters as second lane dedicated mounters, in which first board is passed through first conveyance lane while the first mounting head and second mounting head mount electronic components on the second board on the second conveyance lane; allocating mounting of the first set of electronic components on the first board to a first mounting head of the independent production mounters; and allocating mounting of the second set of electronic components on the second board to a second mounting head of the independent production mounters and to a first mounting head and a second mounting head of the second lane dedicated mounters. setting a portion of the multiple electronic component mounters as independent production mounters, in which the first mounting head mounts electronic components on the first board loaded on the first conveyance lane and second mounting head mounts electronic components on second board on second conveyance lane using second mounting head, and the remaining portion of the multiple electronic component mounters as second lane dedicated mounters, in which first board is passed through first conveyance lane while the first mounting head and second mounting head mount electronic components on the second board on the second conveyance lane; allocating mounting of the first set of electronic components on the first board to a first mounting head of the independent production mounters; and allocating mounting of the second set of electronic components on the second board to a second mounting head of the independent production mounters and to a first mounting head and a second mounting head of the second lane dedicated mounters.