A module-type data center comprising: a casing including a first intake opening, a second intake opening, and an exhaust opening, the first intake opening and the second intake opening being provided on different surfaces of the casing; an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air into direct contact with a refrigerant, wherein the air conditioner includes an element impregnated with the refrigerant and exposed to the outside air; a fan unit provided in the casing and configured to generate a second airflow by taking in outside air through the second intake opening without cooling the outside air; and an electronic device provided in the casing, the electronic device comprising an intake surface adjacent a cold aisle and an exhaust surface adjacent to a hot aisle, the electronic device being configured to be exposed to a mixed airflow of the first airflow and the second airflow and release an exhaust airflow containing the mixed airflow to the exhaust opening, wherein the data center further comprises: a first flow channel which communicates with the hot aisle and with the space provided between the first intake opening and the element, and through which the exhaust airflow flows to the first intake opening; and a first opening-closing portion provided in the first flow channel and configured to open or close the first flow channel, wherein the first opening-closing portion is opened for warming the outside air with the exhaust airflow, when the outside air has a temperature below a temperature at which operation of the electronic device is guaranteed, and when the outside air has a humidity below a humidity at which operation of the electronic device is guaranteed. a casing including a first intake opening, a second intake opening, and an exhaust opening, the first intake opening and the second intake opening being provided on different surfaces of the casing; an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air into direct contact with a refrigerant, wherein the air conditioner includes an element impregnated with the refrigerant and exposed to the outside air; a fan unit provided in the casing and configured to generate a second airflow by taking in outside air through the second intake opening without cooling the outside air; and an electronic device provided in the casing, the electronic device comprising an intake surface adjacent a cold aisle and an exhaust surface adjacent to a hot aisle, the electronic device being configured to be exposed to a mixed airflow of the first airflow and the second airflow and release an exhaust airflow containing the mixed airflow to the exhaust opening, wherein the data center further comprises: a first flow channel which communicates with the hot aisle and with the space provided between the first intake opening and the element, and through which the exhaust airflow flows to the first intake opening; and a first opening-closing portion provided in the first flow channel and configured to open or close the first flow channel, wherein the first opening-closing portion is opened for warming the outside air with the exhaust airflow, when the outside air has a temperature below a temperature at which operation of the electronic device is guaranteed, and when the outside air has a humidity below a humidity at which operation of the electronic device is guaranteed. a first flow channel which communicates with the hot aisle and with the space provided between the first intake opening and the element, and through which the exhaust airflow flows to the first intake opening; and a first opening-closing portion provided in the first flow channel and configured to open or close the first flow channel, wherein the first opening-closing portion is opened for warming the outside air with the exhaust airflow, when the outside air has a temperature below a temperature at which operation of the electronic device is guaranteed, and when the outside air has a humidity below a humidity at which operation of the electronic device is guaranteed.