A fabrication method for a superconducting circuit, wherein the superconducting circuit comprises a Josephson junction, and the Josephson junction comprises a first superconducting layer electrically connected to a first electrical element and a second superconducting layer electrically connected to a second electrical element; and the fabrication method comprises: determining, on a substrate, a first junction region located between the first electrical element and the second electrical element, and a second junction region located between a first conductive plate and a second conductive plate that are formed in advance; forming the Josephson junction in the second junction region, and enabling the first superconducting layer and the second superconducting layer of the Josephson junction to be electrically connected to the first conductive plate and the second conductive plate respectively; connecting the first conductive plate and the second conductive plate to a detection circuit to detect an electrical parameter of the Josephson junction, and determining whether the electrical parameter is within a target parameter range, and if the electrical parameter is within the target parameter range, separating the Josephson junction from the first conductive plate and the second conductive plate through cutting, moving the Josephson junction to the first junction region, and forming a first connection structure connecting the first superconducting layer to the first electrical element and a second connection structure connecting the second superconducting layer to the second electrical element, characterized in that the step of separating the Josephson junction from the first conductive plate and the second conductive plate through cutting, and moving the Josephson junction to the first junction region comprises: cutting and removing a graft structure comprising a second portion substrate and the Josephson junction, wherein the second portion substrate is a portion of the substrate where the Josephson junction is located; and forming a first junction groove in the first junction region, and moving the graft structure into the first junction groove, wherein microscopic cutting is performed by using a focused ion beam to implement cutting and removing of the graft structure, and after the graft structure is cut and removed from the second junction region, a corresponding second junction groove is synchronously formed in the second junction region. determining, on a substrate, a first junction region located between the first electrical element and the second electrical element, and a second junction region located between a first conductive plate and a second conductive plate that are formed in advance; forming the Josephson junction in the second junction region, and enabling the first superconducting layer and the second superconducting layer of the Josephson junction to be electrically connected to the first conductive plate and the second conductive plate respectively; connecting the first conductive plate and the second conductive plate to a detection circuit to detect an electrical parameter of the Josephson junction, and determining whether the electrical parameter is within a target parameter range, and if the electrical parameter is within the target parameter range, separating the Josephson junction from the first conductive plate and the second conductive plate through cutting, moving the Josephson junction to the first junction region, and forming a first connection structure connecting the first superconducting layer to the first electrical element and a second connection structure connecting the second superconducting layer to the second electrical element, characterized in that the step of separating the Josephson junction from the first conductive plate and the second conductive plate through cutting, and moving the Josephson junction to the first junction region comprises: cutting and removing a graft structure comprising a second portion substrate and the Josephson junction, wherein the second portion substrate is a portion of the substrate where the Josephson junction is located; and forming a first junction groove in the first junction region, and moving the graft structure into the first junction groove, wherein microscopic cutting is performed by using a focused ion beam to implement cutting and removing of the graft structure, and after the graft structure is cut and removed from the second junction region, a corresponding second junction groove is synchronously formed in the second junction region. cutting and removing a graft structure comprising a second portion substrate and the Josephson junction, wherein the second portion substrate is a portion of the substrate where the Josephson junction is located; and forming a first junction groove in the first junction region, and moving the graft structure into the first junction groove, wherein microscopic cutting is performed by using a focused ion beam to implement cutting and removing of the graft structure, and after the graft structure is cut and removed from the second junction region, a corresponding second junction groove is synchronously formed in the second junction region.