A method of preparing a dual damascene structure, said method comprising the steps of: providing a substrate having a surface comprising a plurality of topography features on said surface, forming a dense region and an isolated region on said substrate, wherein said dense region is defined as a portion of the substrate that has at least 50% of its surface area filled with via holes, and said isolated region is defined as a portion of the substrate that has less than 20% of its surface area filled with via holes; applying a crosslinking composition to at least some of said topography features, said crosslinking composition including a polymer binder, a crosslinking agent and catalyst, partially curing said composition, wherein said partially curing step comprises heating said composition at a temperature of from 140-180°C and wherein said composition is heated for a time period of from 15-90 seconds contacting a solvent with the partially cured composition so as to remove some of the partially cured composition, wherein said solvent is selected from the group consisting of ethyl lactate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and mixtures thereof; and thereafter subjecting the partially cured composition to a second curing step, wherein said second curing step comprises heating the partially cured composition to a temperature of from 195-250°C, wherein said second curing step comprises heating the partially cured composition for a time period of from 30-90 seconds, wherein after said second curing step, said composition is in the form of a layer on said topography features, wherein the difference between the average thickness of the layer over the isolated region and the average thickness of the layer over the dense region is less than 80 nm. providing a substrate having a surface comprising a plurality of topography features on said surface, forming a dense region and an isolated region on said substrate, wherein said dense region is defined as a portion of the substrate that has at least 50% of its surface area filled with via holes, and said isolated region is defined as a portion of the substrate that has less than 20% of its surface area filled with via holes; applying a crosslinking composition to at least some of said topography features, said crosslinking composition including a polymer binder, a crosslinking agent and catalyst, partially curing said composition, wherein said partially curing step comprises heating said composition at a temperature of from 140-180°C and wherein said composition is heated for a time period of from 15-90 seconds contacting a solvent with the partially cured composition so as to remove some of the partially cured composition, wherein said solvent is selected from the group consisting of ethyl lactate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and mixtures thereof; and thereafter subjecting the partially cured composition to a second curing step, wherein said second curing step comprises heating the partially cured composition to a temperature of from 195-250°C, wherein said second curing step comprises heating the partially cured composition for a time period of from 30-90 seconds, wherein after said second curing step, said composition is in the form of a layer on said topography features, wherein the difference between the average thickness of the layer over the isolated region and the average thickness of the layer over the dense region is less than 80 nm.