A multilayer wiring board (10, 110, 120, 130) for inspection of electronic components, the multilayer wiring board comprising: a ceramic wiring substrate (20, 114) having a substrate main surface (21, 117) and a substrate rear surface and having a structure in which a plurality of ceramic insulation layers (24, 25, 26) are stacked; substrate-side conductive layers (32, 33, 113) formed on the substrate main surface (21, 117) and including: a plurality of center-portion-side conductive layers; and a plurality of outer-periphery-portion-side conductive layers (33, 113); a resin wiring portion (40, 111, 132) stacked on the substrate main surface (21, 117) so as to cover the substrate-side conductive layers (32, 33, 113) and having a structure in which a plurality of resin insulation layers (41, 42, 43, 44, 45) are stacked; and a plurality of inspection pads (50, 51), for inspection of electronic components, formed on a front surface (49, 133) of the resin wiring portion (40, 111, 132), characterized in that end surfaces of the outer-periphery-portion-side conductive layers (33, 113) are exposed from side surfaces of the multilayer wiring board (10, 110, 120, 130), an outer peripheral edge of a rear surface of the resin wiring portion (40, 111, 132) is in contact with surfaces of the outer-periphery-portion-side conductive layers (33, 113), and end surfaces (52, 112) of the resin wiring portion (40, 111, 132) and the end surfaces of the outer-periphery-portion-side conductive layers (33, 113) are positioned closer to a center of the board than end surfaces (23, 115) of the ceramic wiring substrate (20, 114). a ceramic wiring substrate (20, 114) having a substrate main surface (21, 117) and a substrate rear surface and having a structure in which a plurality of ceramic insulation layers (24, 25, 26) are stacked; substrate-side conductive layers (32, 33, 113) formed on the substrate main surface (21, 117) and including: a plurality of center-portion-side conductive layers; and a plurality of outer-periphery-portion-side conductive layers (33, 113); a plurality of center-portion-side conductive layers; and a plurality of outer-periphery-portion-side conductive layers (33, 113); a resin wiring portion (40, 111, 132) stacked on the substrate main surface (21, 117) so as to cover the substrate-side conductive layers (32, 33, 113) and having a structure in which a plurality of resin insulation layers (41, 42, 43, 44, 45) are stacked; and a plurality of inspection pads (50, 51), for inspection of electronic components, formed on a front surface (49, 133) of the resin wiring portion (40, 111, 132), characterized in that end surfaces of the outer-periphery-portion-side conductive layers (33, 113) are exposed from side surfaces of the multilayer wiring board (10, 110, 120, 130), an outer peripheral edge of a rear surface of the resin wiring portion (40, 111, 132) is in contact with surfaces of the outer-periphery-portion-side conductive layers (33, 113), and end surfaces (52, 112) of the resin wiring portion (40, 111, 132) and the end surfaces of the outer-periphery-portion-side conductive layers (33, 113) are positioned closer to a center of the board than end surfaces (23, 115) of the ceramic wiring substrate (20, 114).