A light emitting module, comprising: a plurality of light emitting diodes; and a module substrate including a wiring portion disposed with the plurality of light emitting diodes, and a heat radiation portion folded from the wiring portion and disposed under the plurality of light emitting diodes, wherein the plurality of light emitting diodes includes a first light emitting diode disposed on a first outer region of the wiring portion, a second light emitting diode disposed on a second outer region of the wiring portion, and a third light emitting diode disposed on a center of the wiring portion, and wherein the first outer region and the second outer region are the regions adjacent to side surfaces opposite to each other in the wiring portion, wherein the heat radiation portion is substantially orthogonal to the wiring portion, wherein the wiring portion of the module substrate includes a metal layer; an insulation layer on the metal layer, and a wiring layer on the insulation layer, and the heat radiation portion is formed of the metal layer, wherein the light emitting diodes are mounted on the wiring layer, wherein the heat radiation portion of the module substrate includes a first side surface, a second side surface opposite to the first side surface, and a third side surface being a surface between the first side surface and the second side surface, wherein the third side surface of the heat radiation portion is arranged opposite to the wiring portion, and the first side surface and the second side surface extend from each end of the third side surface toward the wiring portion, characterized in that a width between the center of the wiring portion and the third side surface of the heat radiation portion is wider than a first width being the width of the first side surface of the heat radiation portion. a plurality of light emitting diodes; and a module substrate including a wiring portion disposed with the plurality of light emitting diodes, and a heat radiation portion folded from the wiring portion and disposed under the plurality of light emitting diodes, wherein the plurality of light emitting diodes includes a first light emitting diode disposed on a first outer region of the wiring portion, a second light emitting diode disposed on a second outer region of the wiring portion, and a third light emitting diode disposed on a center of the wiring portion, and wherein the first outer region and the second outer region are the regions adjacent to side surfaces opposite to each other in the wiring portion, wherein the heat radiation portion is substantially orthogonal to the wiring portion, wherein the wiring portion of the module substrate includes a metal layer; an insulation layer on the metal layer, and a wiring layer on the insulation layer, and the heat radiation portion is formed of the metal layer, wherein the light emitting diodes are mounted on the wiring layer, wherein the heat radiation portion of the module substrate includes a first side surface, a second side surface opposite to the first side surface, and a third side surface being a surface between the first side surface and the second side surface, wherein the third side surface of the heat radiation portion is arranged opposite to the wiring portion, and the first side surface and the second side surface extend from each end of the third side surface toward the wiring portion, characterized in that a width between the center of the wiring portion and the third side surface of the heat radiation portion is wider than a first width being the width of the first side surface of the heat radiation portion.