A method for manufacturing an equipment part (10, 110) comprising first and second portions, said first portion comprising a thin plate (12, 112) having a main surface (16, 116), the second portion being formed by elements, an end surface of each of said elements being attached to the main surface, the main surface having large dimensions, that is to say, greater than a sum of all of the end surfaces of the elements of the second portion, the upper surface (42, 142) of the substrate having a contour (52, 152) delimiting the main surface (16, 116), said upper face comprising a groove (46, 146) forming the contour of the main surface, a depth of said groove being less than the first thickness of the substrate, said method comprising the following steps: - providing a substrate (40, 140) having a first thickness greater than a second thickness of the thin plate, an upper face (42, 142) of said substrate including the main surface, said upper face being oriented upward; - providing a computer model comprising spatial coordinates of said main surface (16, 116) and said second portion of the equipment part; then - additive manufacturing of the second portion from the main surface, so as to secure said main surface and said second portion, said manufacturing being done to a series of layers deposited above the main surface; then - cutting in the first thickness of the substrate in order to obtain the thin plate (12, 112) having the second thickness, said thin plate including the main surface secured to the second portion of the equipment part. the main surface having large dimensions, that is to say, greater than a sum of all of the end surfaces of the elements of the second portion, the upper surface (42, 142) of the substrate having a contour (52, 152) delimiting the main surface (16, 116), said upper face comprising a groove (46, 146) forming the contour of the main surface, a depth of said groove being less than the first thickness of the substrate, said method comprising the following steps: - providing a substrate (40, 140) having a first thickness greater than a second thickness of the thin plate, an upper face (42, 142) of said substrate including the main surface, said upper face being oriented upward; - providing a computer model comprising spatial coordinates of said main surface (16, 116) and said second portion of the equipment part; then - additive manufacturing of the second portion from the main surface, so as to secure said main surface and said second portion, said manufacturing being done to a series of layers deposited above the main surface; then - cutting in the first thickness of the substrate in order to obtain the thin plate (12, 112) having the second thickness, said thin plate including the main surface secured to the second portion of the equipment part. - providing a substrate (40, 140) having a first thickness greater than a second thickness of the thin plate, an upper face (42, 142) of said substrate including the main surface, said upper face being oriented upward; - providing a computer model comprising spatial coordinates of said main surface (16, 116) and said second portion of the equipment part; then - additive manufacturing of the second portion from the main surface, so as to secure said main surface and said second portion, said manufacturing being done to a series of layers deposited above the main surface; then - cutting in the first thickness of the substrate in order to obtain the thin plate (12, 112) having the second thickness, said thin plate including the main surface secured to the second portion of the equipment part.