A method of processing a material-specimen containing an object of interest inside the material-specimen, wherein the method comprises: disposing the material-specimen in a processing region of a particle beam column and orienting the material-specimen relative to the particle beam column in a first orientation; generating a substantially smooth, first surface region of the material-specimen by removing a first material-volume from the material-specimen by particle beam etching using a particle beam generated by the particle beam column, wherein the first material-volume is partially defined by the first surface region and wherein an angle (β) between a beam direction of the particle beam and a surface normal of the first surface region at an intersection of the particle beam and the first surface region is greater than 80° and smaller than 90°; disposing the material-specimen in the processing region of the particle beam column and orienting the material-specimen relative to the particle beam column in a second orientation so that the angle (β) between the beam direction of the particle beam and the surface normal of the first surface region at the intersection of the particle beam and the first surface region is smaller than 70°; generating a substantially smooth, second surface region of the material-specimen by removing a second material-volume from the material-specimen by particle beam etching using the particle beam generated by the particle beam column, wherein the second material-volume is partially defined by the first surface region and is partially defined by the second surface region and wherein an angle (α) between the beam direction of the particle beam and a surface normal of the second surface region at an intersection of the particle beam and the second surface region is smaller than 60°, wherein the generating of the second surface region by the particle beam etching comprises controlling a particle dose per unit area directed onto the material-specimen and removing a fourth material-volume from the material-specimen by particle beam etching using the particle beam generated by the particle beam column by controlling the particle dose directed onto the second surface region so that a surface of the object of interest is exposed. disposing the material-specimen in a processing region of a particle beam column and orienting the material-specimen relative to the particle beam column in a first orientation; generating a substantially smooth, first surface region of the material-specimen by removing a first material-volume from the material-specimen by particle beam etching using a particle beam generated by the particle beam column, wherein the first material-volume is partially defined by the first surface region and wherein an angle (β) between a beam direction of the particle beam and a surface normal of the first surface region at an intersection of the particle beam and the first surface region is greater than 80° and smaller than 90°; disposing the material-specimen in the processing region of the particle beam column and orienting the material-specimen relative to the particle beam column in a second orientation so that the angle (β) between the beam direction of the particle beam and the surface normal of the first surface region at the intersection of the particle beam and the first surface region is smaller than 70°; generating a substantially smooth, second surface region of the material-specimen by removing a second material-volume from the material-specimen by particle beam etching using the particle beam generated by the particle beam column, wherein the second material-volume is partially defined by the first surface region and is partially defined by the second surface region and wherein an angle (α) between the beam direction of the particle beam and a surface normal of the second surface region at an intersection of the particle beam and the second surface region is smaller than 60°, wherein the generating of the second surface region by the particle beam etching comprises controlling a particle dose per unit area directed onto the material-specimen and removing a fourth material-volume from the material-specimen by particle beam etching using the particle beam generated by the particle beam column by controlling the particle dose directed onto the second surface region so that a surface of the object of interest is exposed.