A method for manufacturing an integrated circuit device in a flat no-leads package and installing the device on a printed circuit board, the method comprising: providing a pre-grooved leadframe; mounting an IC chip onto a center support structure of the pre-grooved leadframe, the pre-grooved leadframe including: a plurality of pins extending from the center support structure; a groove running perpendicular to the individual pins of the plurality of pins around the center support structure; and a bar connecting the plurality of pins remote from the center support structure; bonding the IC chip to at least some of the plurality of pins; encapsulating the pre-grooved leadframe and bonded IC chip, including filling the groove with encapsulation compound; removing the encapsulation compound from the groove, thereby exposing at least a portion of the individual pins of the plurality of pins; plating the exposed portion of the plurality of pins; performing an isolation cut using a second saw width less than a width of the groove to isolate individual pins of the IC package without separating the IC package from the lead frame; performing a circuit test of the isolated individual pins after the isolation cut; cutting the IC package free from the bar by sawing through the encapsulated lead frame along the groove using a first saw width less than a width of the groove; and attaching the flat no-leads IC package to a printed circuit board using a reflow soldering method to join the plurality of pins of the IC package to respective contact points on the printed circuit board; wherein the groove is 0.1 mm to 0.15 mm deep, the pre-grooved leadframe has a thickness of 0.20 mm, and individual pins of the plurality of pins are attached to the printed circuit board with fillet heights of 60% of the exposed surface of the pins. providing a pre-grooved leadframe; mounting an IC chip onto a center support structure of the pre-grooved leadframe, the pre-grooved leadframe including: a plurality of pins extending from the center support structure; a groove running perpendicular to the individual pins of the plurality of pins around the center support structure; and a bar connecting the plurality of pins remote from the center support structure; a plurality of pins extending from the center support structure; a groove running perpendicular to the individual pins of the plurality of pins around the center support structure; and a bar connecting the plurality of pins remote from the center support structure; bonding the IC chip to at least some of the plurality of pins; encapsulating the pre-grooved leadframe and bonded IC chip, including filling the groove with encapsulation compound; removing the encapsulation compound from the groove, thereby exposing at least a portion of the individual pins of the plurality of pins; plating the exposed portion of the plurality of pins; performing an isolation cut using a second saw width less than a width of the groove to isolate individual pins of the IC package without separating the IC package from the lead frame; performing a circuit test of the isolated individual pins after the isolation cut; cutting the IC package free from the bar by sawing through the encapsulated lead frame along the groove using a first saw width less than a width of the groove; and attaching the flat no-leads IC package to a printed circuit board using a reflow soldering method to join the plurality of pins of the IC package to respective contact points on the printed circuit board; wherein the groove is 0.1 mm to 0.15 mm deep, the pre-grooved leadframe has a thickness of 0.20 mm, and individual pins of the plurality of pins are attached to the printed circuit board with fillet heights of 60% of the exposed surface of the pins.