A display device, comprising: a substrate; a first light-emitting diode (102; 302) comprising: a first conductive pad (102c; 302c); a second conductive pad (102d; 302d) adjacent to the first conductive pad; and a first light-emitting portion (102e; 302e) disposed on the first conductive pad; and a second light-emitting diode comprising: a third conductive pad; a fourth conductive pad adjacent to the third conductive pad; and a second light-emitting portion disposed on the third conductive pad, wherein a distance between the first conductive pad (102c; 302c) and the third conductive pad is less than a distance between the second conductive pad (102d; 302d) and the fourth conductive pad, wherein the first light-emitting diode (102; 302) and the second light-emitting diode are disposed corresponding to a pixel of the display device; wherein the substrate further comprises a plurality of bonding pad groups (100A, 100a, 100a'; 100B, 100b, 100b'; 100C, 100c, 100c') and a plurality of redundant bonding pad groups (500A, 500a, 500a'), wherein the bonding pad groups (100A, 100a, 100a'; 100B, 100b, 100b'; 100C, 100c, 100c') and the redundant bonding pad groups (500A, 500a, 500a') are disposed corresponding to the pixel of the display device; wherein the first light-emitting diode (102; 302) is disposed on the substrate and bonded to one of the bonding pad groups (100A, 100a, 100a'); wherein the second light-emitting diode is disposed on the substrate and bonded to another of the bonding pad groups (100B, 100b, 100b'); and wherein at least one of the redundant bonding pad groups (500A, 500a, 500a') is not bonded with any light-emitting diode. a substrate; a first light-emitting diode (102; 302) comprising: a first conductive pad (102c; 302c); a second conductive pad (102d; 302d) adjacent to the first conductive pad; and a first light-emitting portion (102e; 302e) disposed on the first conductive pad; and a first conductive pad (102c; 302c); a second conductive pad (102d; 302d) adjacent to the first conductive pad; and a first light-emitting portion (102e; 302e) disposed on the first conductive pad; and a second light-emitting diode comprising: a third conductive pad; a fourth conductive pad adjacent to the third conductive pad; and a second light-emitting portion disposed on the third conductive pad, wherein a distance between the first conductive pad (102c; 302c) and the third conductive pad is less than a distance between the second conductive pad (102d; 302d) and the fourth conductive pad, wherein the first light-emitting diode (102; 302) and the second light-emitting diode are disposed corresponding to a pixel of the display device; wherein the substrate further comprises a plurality of bonding pad groups (100A, 100a, 100a'; 100B, 100b, 100b'; 100C, 100c, 100c') and a plurality of redundant bonding pad groups (500A, 500a, 500a'), wherein the bonding pad groups (100A, 100a, 100a'; 100B, 100b, 100b'; 100C, 100c, 100c') and the redundant bonding pad groups (500A, 500a, 500a') are disposed corresponding to the pixel of the display device; wherein the first light-emitting diode (102; 302) is disposed on the substrate and bonded to one of the bonding pad groups (100A, 100a, 100a'); wherein the second light-emitting diode is disposed on the substrate and bonded to another of the bonding pad groups (100B, 100b, 100b'); and wherein at least one of the redundant bonding pad groups (500A, 500a, 500a') is not bonded with any light-emitting diode. a third conductive pad; a fourth conductive pad adjacent to the third conductive pad; and a second light-emitting portion disposed on the third conductive pad, wherein a distance between the first conductive pad (102c; 302c) and the third conductive pad is less than a distance between the second conductive pad (102d; 302d) and the fourth conductive pad, wherein the first light-emitting diode (102; 302) and the second light-emitting diode are disposed corresponding to a pixel of the display device; wherein the substrate further comprises a plurality of bonding pad groups (100A, 100a, 100a'; 100B, 100b, 100b'; 100C, 100c, 100c') and a plurality of redundant bonding pad groups (500A, 500a, 500a'), wherein the bonding pad groups (100A, 100a, 100a'; 100B, 100b, 100b'; 100C, 100c, 100c') and the redundant bonding pad groups (500A, 500a, 500a') are disposed corresponding to the pixel of the display device; wherein the first light-emitting diode (102; 302) is disposed on the substrate and bonded to one of the bonding pad groups (100A, 100a, 100a'); wherein the second light-emitting diode is disposed on the substrate and bonded to another of the bonding pad groups (100B, 100b, 100b'); and wherein at least one of the redundant bonding pad groups (500A, 500a, 500a') is not bonded with any light-emitting diode.