A multi-die chip assembly comprising a plurality of dies (110A-110F), the multi-die chip assembly further comprising: at least one detection apparatus configured to detect manipulations of the multi-die chip assembly, the at least one detection apparatus comprising: a distributed circuit comprising a circuit, the circuit comprising a plurality of elements, the plurality of elements (130A-130B) being distributed among the plurality of dies, the distributed circuit comprising a first free running clock; at least one local reference circuit (140A-140F) disposed in at least one of the plurality of dies of the multi-die chip assembly, each of the at least one local reference circuits comprising a local free running clock; and at least one non-volatile memory, in which is stored during manufacture of the multi-die chip assembly, an allowed range of a result of a calibration application of a function having at least two arguments for each of the at least one local reference circuit, the at least two arguments comprising: a value of a frequency of the local free running clock of the at least one local reference circuit as manufactured; and a value of a frequency of the first free running clock of the distributed circuit comprising a single circuit as manufactured, wherein at least one element of the plurality of elements being disposed in each one of the plurality of dies comprising at least one of the at least one local reference circuit. at least one detection apparatus configured to detect manipulations of the multi-die chip assembly, the at least one detection apparatus comprising: a distributed circuit comprising a circuit, the circuit comprising a plurality of elements, the plurality of elements (130A-130B) being distributed among the plurality of dies, the distributed circuit comprising a first free running clock; at least one local reference circuit (140A-140F) disposed in at least one of the plurality of dies of the multi-die chip assembly, each of the at least one local reference circuits comprising a local free running clock; and a distributed circuit comprising a circuit, the circuit comprising a plurality of elements, the plurality of elements (130A-130B) being distributed among the plurality of dies, the distributed circuit comprising a first free running clock; at least one local reference circuit (140A-140F) disposed in at least one of the plurality of dies of the multi-die chip assembly, each of the at least one local reference circuits comprising a local free running clock; and at least one non-volatile memory, in which is stored during manufacture of the multi-die chip assembly, an allowed range of a result of a calibration application of a function having at least two arguments for each of the at least one local reference circuit, the at least two arguments comprising: a value of a frequency of the local free running clock of the at least one local reference circuit as manufactured; and a value of a frequency of the first free running clock of the distributed circuit comprising a single circuit as manufactured, a value of a frequency of the local free running clock of the at least one local reference circuit as manufactured; and a value of a frequency of the first free running clock of the distributed circuit comprising a single circuit as manufactured, wherein at least one element of the plurality of elements being disposed in each one of the plurality of dies comprising at least one of the at least one local reference circuit.