A semiconductor package comprising a package main body and an electrically conductive thin film that covers the package main body, wherein: the package main body comprises: a lead frame that comprises first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one electrically conductive post that is disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive post, and the wires; the electrically conductive post is disposed in a central region on a mounting surface of the die pad; each of the integrated circuit chips is disposed in a peripheral region that surrounds the central region on the mounting surface; an upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member; the electrically conductive post is exposed through the upper surface of the package main body; the die pad is exposed through the bottom surface of the package main body; the lead frame further comprises second terminals that are different than the first terminals; the second terminals are exposed through the side surfaces of the package main body; and the electrically conductive thin film is electrically connected to both the electrically conductive post and the second terminals in a state in which the electrically conductive thin film covers the upper surface and the side surfaces of the package main body. the package main body comprises: a lead frame that comprises first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one electrically conductive post that is disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive post, and the wires; a lead frame that comprises first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one electrically conductive post that is disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive post, and the wires; the electrically conductive post is disposed in a central region on a mounting surface of the die pad; each of the integrated circuit chips is disposed in a peripheral region that surrounds the central region on the mounting surface; an upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member; the electrically conductive post is exposed through the upper surface of the package main body; the die pad is exposed through the bottom surface of the package main body; the lead frame further comprises second terminals that are different than the first terminals; the second terminals are exposed through the side surfaces of the package main body; and the electrically conductive thin film is electrically connected to both the electrically conductive post and the second terminals in a state in which the electrically conductive thin film covers the upper surface and the side surfaces of the package main body.