Method for determining a deformation of a mould wafer, having the steps of: clamping an inner region of the mould wafer on a clamping device (5, 5a, 15a-c; 5, 5a, 15d) in a first clamping position; determining an eccentricity (δ) of a central axis (M') of the mould wafer from a central axis of the clamping device (5, 5a, 15a-c; 5, 5a, 15d) in the first clamping position; depositing the mould wafer on a supporting device (3a, 3b, 3c); re-clamping the inner region of the mould wafer on the clamping device (5, 5a, 15a-c; 5, 5a, 15d) in a second clamping position on the basis of the determined eccentricity (δ), wherein the eccentricity (δ) in the second clamping position is substantially zero; moving the clamping device (5, 5a, 15a-c; 5, 5a, 15d) into a predetermined height position; measuring a respective deviation of a plurality of measuring points (P1-P8) in a non-clamped outer region of the disk-shaped workpiece from the predetermined height position as per the deformation by means of a fixed-height detector device by rotating the clamping device (5, 5a, 15a-c; 5, 5a, 15d) or the detector device to corresponding angles of rotation (φ1-φ8); wherein the clamping of the inner region of the mould wafer takes place using a plurality of bearing pins (11a, 11b, 11c) and a plurality of vacuum suction elements (20a, 20b, 20c); wherein in each case one bearing pin (11a, 11b, 11c) of the plurality of bearing pins (11a, 11b, 11c) is surrounded by in each case one associated one of the plurality of vacuum suction elements (20a, 20b, 20c); wherein the vacuum suction elements (20a, 20b, 20c) comprise a respective sealing lip that encloses the respective associated bearing pin (11a, 11b, 11c); characterized in that the mould wafer in the clamped state is carried by the bearing pins (11a, 11b, 11c) and the sealing lips. clamping an inner region of the mould wafer on a clamping device (5, 5a, 15a-c; 5, 5a, 15d) in a first clamping position; determining an eccentricity (δ) of a central axis (M') of the mould wafer from a central axis of the clamping device (5, 5a, 15a-c; 5, 5a, 15d) in the first clamping position; depositing the mould wafer on a supporting device (3a, 3b, 3c); re-clamping the inner region of the mould wafer on the clamping device (5, 5a, 15a-c; 5, 5a, 15d) in a second clamping position on the basis of the determined eccentricity (δ), wherein the eccentricity (δ) in the second clamping position is substantially zero; moving the clamping device (5, 5a, 15a-c; 5, 5a, 15d) into a predetermined height position; measuring a respective deviation of a plurality of measuring points (P1-P8) in a non-clamped outer region of the disk-shaped workpiece from the predetermined height position as per the deformation by means of a fixed-height detector device by rotating the clamping device (5, 5a, 15a-c; 5, 5a, 15d) or the detector device to corresponding angles of rotation (φ1-φ8); wherein the clamping of the inner region of the mould wafer takes place using a plurality of bearing pins (11a, 11b, 11c) and a plurality of vacuum suction elements (20a, 20b, 20c); wherein in each case one bearing pin (11a, 11b, 11c) of the plurality of bearing pins (11a, 11b, 11c) is surrounded by in each case one associated one of the plurality of vacuum suction elements (20a, 20b, 20c); wherein the vacuum suction elements (20a, 20b, 20c) comprise a respective sealing lip that encloses the respective associated bearing pin (11a, 11b, 11c); characterized in that the mould wafer in the clamped state is carried by the bearing pins (11a, 11b, 11c) and the sealing lips.