A display device, comprising: a wiring substrate (110, 310, 410, 510, 610) having a first substrate layer (311, 411, 511, 611) and a second substrate layer (312, 412, 512, 612); a conductive adhesive layer (130, 330) configured to cover the wiring substrate; a plurality of semiconductor light emitting devices (150, 350) coupled to the conductive adhesive layer (130, 330), and electrically connected to a first electrode (120, 320, 420, 520, 620) and a second electrode (140, 340, 440, 540, 640), and a connecting line portion (313, 413, 513, 713) for connecting the first and the second electrode to a drive unit of the plurality of semiconductor light emitting devices, wherein the first electrode (120, 320, 420, 520, 620) and the connecting line portion (313, 413, 513, 713) are disposed at the first substrate layer (311, 411, 511, 611), and the second substrate layer (312, 412, 512, 612) comprises one surface facing the conductive adhesive layer (130, 330) and the other surface covering the first electrode (120, 320, 420, 520, 620) and the connecting line portion (313, 413, 513, 713), and an auxiliary electrode (170, 370, 470, 670) is electrically connected to the first electrode (120, 320, 420, 520, 620) by means of a channel passing through the second substrate layer, and the auxiliary electrode (170, 370, 470, 670) and the second electrode (140, 340, 440, 540, 640) are disposed on one surface of the second substrate layer (312, 412, 512, 612), and the plurality of second electrodes (140, 340, 440, 540, 640) is disposed in a direction crossed with the length direction of the first electrode (120, 320, 420, 520, 620), and is electrically connected to the connecting line portion (313, 413, 513, 713) via a through hole (341, 441) on the second substrate layer (312, 412, 512, 612). a wiring substrate (110, 310, 410, 510, 610) having a first substrate layer (311, 411, 511, 611) and a second substrate layer (312, 412, 512, 612); a conductive adhesive layer (130, 330) configured to cover the wiring substrate; a plurality of semiconductor light emitting devices (150, 350) coupled to the conductive adhesive layer (130, 330), and electrically connected to a first electrode (120, 320, 420, 520, 620) and a second electrode (140, 340, 440, 540, 640), and a connecting line portion (313, 413, 513, 713) for connecting the first and the second electrode to a drive unit of the plurality of semiconductor light emitting devices, wherein the first electrode (120, 320, 420, 520, 620) and the connecting line portion (313, 413, 513, 713) are disposed at the first substrate layer (311, 411, 511, 611), and the second substrate layer (312, 412, 512, 612) comprises one surface facing the conductive adhesive layer (130, 330) and the other surface covering the first electrode (120, 320, 420, 520, 620) and the connecting line portion (313, 413, 513, 713), and an auxiliary electrode (170, 370, 470, 670) is electrically connected to the first electrode (120, 320, 420, 520, 620) by means of a channel passing through the second substrate layer, and the auxiliary electrode (170, 370, 470, 670) and the second electrode (140, 340, 440, 540, 640) are disposed on one surface of the second substrate layer (312, 412, 512, 612), and the plurality of second electrodes (140, 340, 440, 540, 640) is disposed in a direction crossed with the length direction of the first electrode (120, 320, 420, 520, 620), and is electrically connected to the connecting line portion (313, 413, 513, 713) via a through hole (341, 441) on the second substrate layer (312, 412, 512, 612).