High-frequency amplifier for coaxial networks, the high-frequency amplifier comprising a high-frequency housing that includes a housing body and a housing cover, having the following features: - the housing body comprises a housing base and a peripheral housing wall between the housing base and the housing cover, as a result of which a receiving space is formed, and as a result of which the housing cover is spaced apart from the housing base of the housing body; - the high-frequency amplifier includes a printed circuit board comprising a plurality of electrical functional units; - a plurality of top-side earth regions are arranged on a top side of the printed circuit board between the electrical functional units; characterised by the following features: - the housing body includes a plurality of base-side supporting partitions that are galvanically connected to the housing base and are integral therewith; - the plurality of base-side supporting partitions extend in the axial direction from the housing base towards the housing cover, as a result of which a plurality of base-side high-frequency chambers are formed; - a plurality of bottom-side earth regions are arranged on a bottom side of the printed circuit board between the electrical functional units; - the printed circuit board rests, predominately by means of the bottom-side earth regions thereof, on the plurality of base-side supporting partitions, as a result of which the individual electrical functional units are separated from one another towards the housing base by the base-side high-frequency chambers; - the high-frequency amplifier includes an intermediate cover which includes a plurality of cover-side supporting partitions that are galvanically connected to the intermediate cover and are integral therewith; - the plurality of cover-side supporting partitions extend in the axial direction from the intermediate cover towards the housing base, as a result of which a plurality of cover-side high-frequency chambers are formed; - the cover-side supporting partitions of the intermediate cover rest predominately on the top-side earth regions of the printed circuit board, as a result of which the individual electrical functional units are separated from one another towards the housing cover by the cover-side high-frequency chambers. - the housing body comprises a housing base and a peripheral housing wall between the housing base and the housing cover, as a result of which a receiving space is formed, and as a result of which the housing cover is spaced apart from the housing base of the housing body; - the high-frequency amplifier includes a printed circuit board comprising a plurality of electrical functional units; - a plurality of top-side earth regions are arranged on a top side of the printed circuit board between the electrical functional units; characterised by the following features: - the housing body includes a plurality of base-side supporting partitions that are galvanically connected to the housing base and are integral therewith; - the plurality of base-side supporting partitions extend in the axial direction from the housing base towards the housing cover, as a result of which a plurality of base-side high-frequency chambers are formed; - a plurality of bottom-side earth regions are arranged on a bottom side of the printed circuit board between the electrical functional units; - the printed circuit board rests, predominately by means of the bottom-side earth regions thereof, on the plurality of base-side supporting partitions, as a result of which the individual electrical functional units are separated from one another towards the housing base by the base-side high-frequency chambers; - the high-frequency amplifier includes an intermediate cover which includes a plurality of cover-side supporting partitions that are galvanically connected to the intermediate cover and are integral therewith; - the plurality of cover-side supporting partitions extend in the axial direction from the intermediate cover towards the housing base, as a result of which a plurality of cover-side high-frequency chambers are formed; - the cover-side supporting partitions of the intermediate cover rest predominately on the top-side earth regions of the printed circuit board, as a result of which the individual electrical functional units are separated from one another towards the housing cover by the cover-side high-frequency chambers.