A manufacturing process for termination injection molding stress control module for cross-linked polyethylene insulated cable body, wherein it comprises the following steps: a. according to the requirements of the manufacturing process, stripping and cutting an outer protection layer and a metal protection layer at the cable termination, stripping an outer semiconducting layer of the cable, and grinding and smoothing the cable insulation, mounting a molding machine at an end of the outer semiconducting layer of the stripped cable, fixing the cable in the center of molding cavity of the insulation molding machine, and connecting a small extruder and a control instrument; when the insulation molding machine is started up and preheated to a temperature at which a cross-linked polyethylene melts, extruding the molten cross-linked polyethylene insulation having the same material as the cable insulation into a cavity of the molding machine, and raising the temperature and performing crosslinking through heating to allow the cable insulation and the cross-linked polyethylene insulation to melt, graft and combine into an integrated insulation after the molding cavity of the molding machine is filled with the cross-linked polyethylene insulation; and removing the insulation molding machine after it is cooled to obtain a molded body of a cable termination stress control module insulation; and b. mounting a filling semiconducting layer molding machine at an end of the outer semiconducting layer of the stripped cable; mounting and fixing the molded body of the stress control module insulation in the center of molding cavity of the filling semiconducting layer molding machine, connecting the small extruder and the control instrument, and preheating the extruder; when the molding machine is started up and preheated to a temperature at which a cross-linked semiconducting material melts, starting the extruder to extrude the molten semiconducting material having the same material as the outer semiconducting layer of the cable into a cavity of the filling semiconducting layer molding machine to form a filling semiconducting layer, stopping the extruder after the cavity of the semiconducting layer molding machine is filled with the molten filling semiconducting material, and then raising the temperature and performing crosslinking through heating to allow the outer semiconducting layer of cable, the cable insulation, the cross-linked polyethylene insulation and the filling semiconducting layer to melt, graft and combine with each other; and removing the insulation molding machine after it is cooled to obtain a molded body of conduction and insulation of a cable termination stress control module. a. according to the requirements of the manufacturing process, stripping and cutting an outer protection layer and a metal protection layer at the cable termination, stripping an outer semiconducting layer of the cable, and grinding and smoothing the cable insulation, mounting a molding machine at an end of the outer semiconducting layer of the stripped cable, fixing the cable in the center of molding cavity of the insulation molding machine, and connecting a small extruder and a control instrument; when the insulation molding machine is started up and preheated to a temperature at which a cross-linked polyethylene melts, extruding the molten cross-linked polyethylene insulation having the same material as the cable insulation into a cavity of the molding machine, and raising the temperature and performing crosslinking through heating to allow the cable insulation and the cross-linked polyethylene insulation to melt, graft and combine into an integrated insulation after the molding cavity of the molding machine is filled with the cross-linked polyethylene insulation; and removing the insulation molding machine after it is cooled to obtain a molded body of a cable termination stress control module insulation; and b. mounting a filling semiconducting layer molding machine at an end of the outer semiconducting layer of the stripped cable; mounting and fixing the molded body of the stress control module insulation in the center of molding cavity of the filling semiconducting layer molding machine, connecting the small extruder and the control instrument, and preheating the extruder; when the molding machine is started up and preheated to a temperature at which a cross-linked semiconducting material melts, starting the extruder to extrude the molten semiconducting material having the same material as the outer semiconducting layer of the cable into a cavity of the filling semiconducting layer molding machine to form a filling semiconducting layer, stopping the extruder after the cavity of the semiconducting layer molding machine is filled with the molten filling semiconducting material, and then raising the temperature and performing crosslinking through heating to allow the outer semiconducting layer of cable, the cable insulation, the cross-linked polyethylene insulation and the filling semiconducting layer to melt, graft and combine with each other; and removing the insulation molding machine after it is cooled to obtain a molded body of conduction and insulation of a cable termination stress control module.