Method for processing of material by use of a pulsed laser, the material being transparent or semi-transparent regarding a wavelength of the pulsed laser, comprising • generating a series of ultra-short laser pulses (22,22'), in particular with pulse durations of less than 1 ns, in particular pico- or femtosecond laser pulses, • directing each laser pulse to the material with defined reference to a respectively assigned processing point of a processing path, • focussing each laser pulse so that respective focal points of the focussed laser pulses comprise pre-defined spatial relations to a first surface of the material, wherein each emitted laser pulse effects a respective crack within the material, • shaping each laser pulse regarding its beam profile so that a cross sectional area (11,31), which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of elongated shape, preferably of elliptical shape, and defines a main extension axis as to its elongated extension, • effecting one major micro-crack (12,24) by each laser pulse, the major micro-crack (12,24) having a lateral extension basically oriented according to the orientation of the main extension axis of the respective pulse in the focal point, and • emitting each laser pulse so that the orientation of its main extension axis in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path at the assigned processing point, characterised in that each laser pulse is emitted with a pre-defined orientation of its main extension axis which corresponds to an angular deviation from the orientation of the respective tangent of up to 20°, in particular wherein a pre-defined time-delay with respect to crack-propagation in the material is adjusted by correspondingly setting the angular deviation of the orientation of the main extension axis of the laser pulses relative to the respectively assigned tangent. • generating a series of ultra-short laser pulses (22,22'), in particular with pulse durations of less than 1 ns, in particular pico- or femtosecond laser pulses, • directing each laser pulse to the material with defined reference to a respectively assigned processing point of a processing path, • focussing each laser pulse so that respective focal points of the focussed laser pulses comprise pre-defined spatial relations to a first surface of the material, wherein each emitted laser pulse effects a respective crack within the material, • shaping each laser pulse regarding its beam profile so that a cross sectional area (11,31), which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of elongated shape, preferably of elliptical shape, and defines a main extension axis as to its elongated extension, • effecting one major micro-crack (12,24) by each laser pulse, the major micro-crack (12,24) having a lateral extension basically oriented according to the orientation of the main extension axis of the respective pulse in the focal point, and • emitting each laser pulse so that the orientation of its main extension axis in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path at the assigned processing point,