A beam delivery system comprising: a package comprising a beam delivery photonic integrated circuit and an optical relay assembly; the beam delivery photonic integrated circuit comprising: one or more optical inputs; a plurality of waveguide outputs, wherein each of the plurality of waveguide outputs is tapered; a plurality of beam paths, each beam path connecting one of the plurality of waveguide outputs to at least one of the one or more optical inputs, wherein at least one of the plurality of waveguide outputs that is connected to a first optical input of the one or more optical inputs is configured to be directed to a photodetector configured to measure the intensity of the waveguide output directed to the photodetector, and wherein each of the plurality of beam paths connected to the first optical input and not connected to the at least one of the plurality of waveguide outputs configured to be directed to the photodetector comprises a respective optical element configured to remove power fluctuations from beams provided via respective waveguide outputs of the plurality of waveguide outputs based on the intensity of the waveguide output directed to the photodetector, wherein the beam delivery photonic integrated circuit is on a chip; the optical relay assembly comprising a plurality of optical elements, the optical relay assembly configured to receive beams provided by at least two of the plurality of waveguide outputs and focus each received beam on a corresponding one of a plurality of positions of an atomic object confinement apparatus by passing the beams provided by each of the at least two of the plurality of waveguide outputs through each of the plurality of optical elements. a package comprising a beam delivery photonic integrated circuit and an optical relay assembly; the beam delivery photonic integrated circuit comprising: one or more optical inputs; a plurality of waveguide outputs, wherein each of the plurality of waveguide outputs is tapered; a plurality of beam paths, each beam path connecting one of the plurality of waveguide outputs to at least one of the one or more optical inputs, wherein at least one of the plurality of waveguide outputs that is connected to a first optical input of the one or more optical inputs is configured to be directed to a photodetector configured to measure the intensity of the waveguide output directed to the photodetector, and wherein each of the plurality of beam paths connected to the first optical input and not connected to the at least one of the plurality of waveguide outputs configured to be directed to the photodetector comprises a respective optical element configured to remove power fluctuations from beams provided via respective waveguide outputs of the plurality of waveguide outputs based on the intensity of the waveguide output directed to the photodetector, wherein the beam delivery photonic integrated circuit is on a chip; one or more optical inputs; a plurality of waveguide outputs, wherein each of the plurality of waveguide outputs is tapered; a plurality of beam paths, each beam path connecting one of the plurality of waveguide outputs to at least one of the one or more optical inputs, wherein at least one of the plurality of waveguide outputs that is connected to a first optical input of the one or more optical inputs is configured to be directed to a photodetector configured to measure the intensity of the waveguide output directed to the photodetector, and wherein each of the plurality of beam paths connected to the first optical input and not connected to the at least one of the plurality of waveguide outputs configured to be directed to the photodetector comprises a respective optical element configured to remove power fluctuations from beams provided via respective waveguide outputs of the plurality of waveguide outputs based on the intensity of the waveguide output directed to the photodetector, wherein the beam delivery photonic integrated circuit is on a chip; the optical relay assembly comprising a plurality of optical elements, the optical relay assembly configured to receive beams provided by at least two of the plurality of waveguide outputs and focus each received beam on a corresponding one of a plurality of positions of an atomic object confinement apparatus by passing the beams provided by each of the at least two of the plurality of waveguide outputs through each of the plurality of optical elements.