A multilayer wiring board comprising: at least one basic material layer (30, 32, 34) including a first ceramic material and at least one constrained layer (40, 42, 44, 46) including a second ceramic material that are alternately stacked, the constrained layer (40, 42, 44, 46) restricting contraction thereof in a surface direction with respect to the basic material layer (30, 32, 34); a conductor pattern (16x-z, 19, 20-25) disposed on the basic material layer (30, 32, 34) or the constrained layer (40, 42, 44, 46), the conductor pattern (16x-z, 19, 20-25) extending in the surface direction in which the basic material layer (30, 32, 34) and the constrained layer (40, 42, 44, 46) extend; a via-hole conductor extending inside at least the basic material layer (30, 32, 34) in a direction in which the basic material layer (30, 32, 34) and the constrained layer (40, 42, 44, 46) are stacked, the via-hole conductor being connected to the conductor pattern (16x-z); and an intermediate conductor pattern disposed inside the basic material layer (30, 32, 34), wherein the via-hole conductor is connected to the intermediate conductor pattern and includes a via body and an extended portion disposed on either side of the intermediate conductor pattern, wherein the via body is connected to the intermediate conductor pattern, wherein the extended portion is formed by extending the via body in a direction towards the constrained layer (40, 42, 44, 46) and away from the via body, and a first end of the extended portion is connected to the intermediate conductor pattern, and wherein a second end of the extended portion of the via-hole conductor is in contact with the constrained layer (40, 42, 44, 46), characterized in that an end surface of the extended portion is in contact with a surface of the constrained layer adjacent to the basic material layer having the via-hole conductor provided therein. at least one basic material layer (30, 32, 34) including a first ceramic material and at least one constrained layer (40, 42, 44, 46) including a second ceramic material that are alternately stacked, the constrained layer (40, 42, 44, 46) restricting contraction thereof in a surface direction with respect to the basic material layer (30, 32, 34); a conductor pattern (16x-z, 19, 20-25) disposed on the basic material layer (30, 32, 34) or the constrained layer (40, 42, 44, 46), the conductor pattern (16x-z, 19, 20-25) extending in the surface direction in which the basic material layer (30, 32, 34) and the constrained layer (40, 42, 44, 46) extend; a via-hole conductor extending inside at least the basic material layer (30, 32, 34) in a direction in which the basic material layer (30, 32, 34) and the constrained layer (40, 42, 44, 46) are stacked, the via-hole conductor being connected to the conductor pattern (16x-z); and an intermediate conductor pattern disposed inside the basic material layer (30, 32, 34), wherein the via-hole conductor is connected to the intermediate conductor pattern and includes a via body and an extended portion disposed on either side of the intermediate conductor pattern, wherein the via body is connected to the intermediate conductor pattern, wherein the extended portion is formed by extending the via body in a direction towards the constrained layer (40, 42, 44, 46) and away from the via body, and a first end of the extended portion is connected to the intermediate conductor pattern, and wherein a second end of the extended portion of the via-hole conductor is in contact with the constrained layer (40, 42, 44, 46), characterized in that an end surface of the extended portion is in contact with a surface of the constrained layer adjacent to the basic material layer having the via-hole conductor provided therein.