A circuit board that is formed to have a rectangular shape when viewed in plan, that is installed with a semiconductor module on an upper face, and that is provided with a plurality of connection terminals on a lower face, wherein a connection pin protruding from the lower face is provided on at least some connection terminals, the connection terminals include a drive terminal for driving the semiconductor module and a function terminal for connecting the semiconductor module and other function units, and the disposition of the drive terminal in each of divided areas (D1,D2,D3,D4) is point-symmetric with respect to the center of the lower face, the divided areas (D1,D2,D3,D4) being the lower face divided into four with two virtual lines (L1,L2) that pass through the middle of each side of the lower face and that intersect at the center of the lower face, characterized in that the drive terminal is disposed at a position closest to a corner (C1,C2,C3,C4) of the lower face; wherein the connection terminals are disposed along each side of the lower face so as to form a plurality of terminal arrays from an outer edge of the lower face, and the drive terminal is disposed over the terminal arrays in a corner portion area (Rc1,Rc2,Rc3,Rc4) including a corner (C1,C2,C3,C4) of the lower face; and wherein the function terminal includes a first function terminal corresponding to a first function unit that is connected to the semiconductor module and a second function terminal corresponding to a second function unit that is connected to the semiconductor module, and the first function terminal and the second function terminal are disposed alternately in a function terminal disposition area of the lower face in which the function terminal is disposed. a connection pin protruding from the lower face is provided on at least some connection terminals, the connection terminals include a drive terminal for driving the semiconductor module and a function terminal for connecting the semiconductor module and other function units, and the disposition of the drive terminal in each of divided areas (D1,D2,D3,D4) is point-symmetric with respect to the center of the lower face, the divided areas (D1,D2,D3,D4) being the lower face divided into four with two virtual lines (L1,L2) that pass through the middle of each side of the lower face and that intersect at the center of the lower face, characterized in that the drive terminal is disposed at a position closest to a corner (C1,C2,C3,C4) of the lower face; wherein the connection terminals are disposed along each side of the lower face so as to form a plurality of terminal arrays from an outer edge of the lower face, and the drive terminal is disposed over the terminal arrays in a corner portion area (Rc1,Rc2,Rc3,Rc4) including a corner (C1,C2,C3,C4) of the lower face; and the connection terminals are disposed along each side of the lower face so as to form a plurality of terminal arrays from an outer edge of the lower face, and the drive terminal is disposed over the terminal arrays in a corner portion area (Rc1,Rc2,Rc3,Rc4) including a corner (C1,C2,C3,C4) of the lower face; and wherein the function terminal includes a first function terminal corresponding to a first function unit that is connected to the semiconductor module and a second function terminal corresponding to a second function unit that is connected to the semiconductor module, and the first function terminal and the second function terminal are disposed alternately in a function terminal disposition area of the lower face in which the function terminal is disposed. the function terminal includes a first function terminal corresponding to a first function unit that is connected to the semiconductor module and a second function terminal corresponding to a second function unit that is connected to the semiconductor module, and the first function terminal and the second function terminal are disposed alternately in a function terminal disposition area of the lower face in which the function terminal is disposed.