Continuous manufacturing plant for processing a strip-like substrate, comprising: a first drive apparatus for moving the strip-like substrate in a direction of transport; and at least two process zones (110, 120, 130) which the strip-like substrate passes through, so that different regions of the strip-like substrate may be processed simultaneously, wherein the at least two process zones (110, 120, 130) comprise: a first process zone (110, 120), and a second process zone with a reflow soldering process arrangement, wherein the reflow soldering process arrangement comprises at least one source of heat; and a second drive apparatus for moving the source of heat relative to the first process zone (110, 120) along the strip-like substrate which is configured to move the source of heat relative to the first process zone (110, 120) along the strip-like substrate opposed to the direction of transport of the strip-like substrate even if the first drive apparatus is standing still. characterized by: a control device which is configured to control the second drive apparatus such that the source of heat is moved such that a predetermined temperature profile T(t) required for the soldering process is reached over a predetermined region of the strip-like substrate, wherein the predetermined temperature profile T(t) over the predetermined region of the strip-like substrate comprises a region for preheating, a solder region and a cool down region, which depend on a structure of the product, the heat capacity and heat conductivity of the substrate, the solder paste and the components, and wherein the control device is configured to control the intensity of the at least one source of heat depending on the predetermined temperature profile such that a heat field with a predetermined temperature distribution is formed, wherein the source of heat is formed as a screened heat matrix consisting of several individually controllable fields (W a, W b, W c, W d). a first drive apparatus for moving the strip-like substrate in a direction of transport; and at least two process zones (110, 120, 130) which the strip-like substrate passes through, so that different regions of the strip-like substrate may be processed simultaneously, wherein the at least two process zones (110, 120, 130) comprise: a first process zone (110, 120), and a second process zone with a reflow soldering process arrangement, wherein the reflow soldering process arrangement comprises at least one source of heat; and a first process zone (110, 120), and a second process zone with a reflow soldering process arrangement, wherein the reflow soldering process arrangement comprises at least one source of heat; and a second drive apparatus for moving the source of heat relative to the first process zone (110, 120) along the strip-like substrate which is configured to move the source of heat relative to the first process zone (110, 120) along the strip-like substrate opposed to the direction of transport of the strip-like substrate even if the first drive apparatus is standing still. a control device which is configured to control the second drive apparatus such that the source of heat is moved such that a predetermined temperature profile T(t) required for the soldering process is reached over a predetermined region of the strip-like substrate, wherein the predetermined temperature profile T(t) over the predetermined region of the strip-like substrate comprises a region for preheating, a solder region and a cool down region, which depend on a structure of the product, the heat capacity and heat conductivity of the substrate, the solder paste and the components, and wherein the control device is configured to control the intensity of the at least one source of heat depending on the predetermined temperature profile such that a heat field with a predetermined temperature distribution is formed, wherein the source of heat is formed as a screened heat matrix consisting of several individually controllable fields (W a, W b, W c, W d).