A deposition device (10, 10A, 10B) comprising: a processing container; an exhaust device configured to depressurize an internal pressure of the processing container; a mounting table (16, 16A) installed inside the processing container and configured to mount a target object thereon; a metal target installed above the mounting table (16, 16A); a first gas supply part configured to supply a gas into the processing container; a power supply (24a, 24b) configured to generate power such that, in use, positive ions in the gas supplied from the first gas supply part collide against the metal target; a second gas supply part configured to supply an oxidizing gas; a head (32, 32A) connected to the second gas supply part and configured to inject the oxidizing gas toward the mounting table (16, 16A); and a head driving mechanism configured to move the head (32, 32A) between a first region that is defined between the metal target and a mounting region where the target object is mounted on the mounting table (16, 16A) and a second region spaced apart from a space defined between the metal target and the mounting region, characterized in that: the head driving mechanism is configured to move the head (32, 32A) in the second region when, in use, the first gas supply part supplies the gas into the processing container and when the power supply (24a, 24b) supplies the power to the metal target, and configured to move the head (32, 32A) in the first region when, in use, the second gas supply part supplies the oxidizing gas into the head (32, 32A); the metal target is obliquely installed such that an upper portion of the metal target is closer to a first axis line, which vertically extends along a central axis line of the mounting table (16, 16A), as the upper portion of the metal target is orientated upward; and the first gas supply part has a gas introduction part that extends along the first axis line. a processing container; an exhaust device configured to depressurize an internal pressure of the processing container; a mounting table (16, 16A) installed inside the processing container and configured to mount a target object thereon; a metal target installed above the mounting table (16, 16A); a first gas supply part configured to supply a gas into the processing container; a power supply (24a, 24b) configured to generate power such that, in use, positive ions in the gas supplied from the first gas supply part collide against the metal target; a second gas supply part configured to supply an oxidizing gas; a head (32, 32A) connected to the second gas supply part and configured to inject the oxidizing gas toward the mounting table (16, 16A); and a head driving mechanism configured to move the head (32, 32A) between a first region that is defined between the metal target and a mounting region where the target object is mounted on the mounting table (16, 16A) and a second region spaced apart from a space defined between the metal target and the mounting region, characterized in that: the head driving mechanism is configured to move the head (32, 32A) in the second region when, in use, the first gas supply part supplies the gas into the processing container and when the power supply (24a, 24b) supplies the power to the metal target, and configured to move the head (32, 32A) in the first region when, in use, the second gas supply part supplies the oxidizing gas into the head (32, 32A); the metal target is obliquely installed such that an upper portion of the metal target is closer to a first axis line, which vertically extends along a central axis line of the mounting table (16, 16A), as the upper portion of the metal target is orientated upward; and the first gas supply part has a gas introduction part that extends along the first axis line. the head driving mechanism is configured to move the head (32, 32A) in the second region when, in use, the first gas supply part supplies the gas into the processing container and when the power supply (24a, 24b) supplies the power to the metal target, and configured to move the head (32, 32A) in the first region when, in use, the second gas supply part supplies the oxidizing gas into the head (32, 32A); the metal target is obliquely installed such that an upper portion of the metal target is closer to a first axis line, which vertically extends along a central axis line of the mounting table (16, 16A), as the upper portion of the metal target is orientated upward; and the first gas supply part has a gas introduction part that extends along the first axis line.