A quality control system, comprising: an inspection apparatus (Y1, Y2, Y3, Y4) for a surface mounting line, and an analyzer configured to analyze a cause of a defect or quality deterioration based on inspection data obtained by the inspection apparatus (Y1, Y2, Y3, Y4), the inspection apparatus comprising: an imaging unit configured to capture an image of a printed circuit board having a land on which a solder piece has been printed, an image of the printed circuit board having a component mounted on the solder piece, or an image of the printed circuit board having the component soldered to the land; a land determination unit configured to determine a position of an element on the printed circuit board from the image of the printed circuit board captured by the imaging unit, and determine a position of the land included in the image based on the determined position of the element; and an inspection unit configured to inspect the solder piece or the component on the land using the position of the land determined by the land determination unit as a reference; characterized in that the element is a wiring pattern formed on the printed circuit board, the land determination unit estimates the position of the land in the image based on positional relationship information defining a relative positional relationship between the wiring pattern and the land, and the position of the wiring pattern determined from the image, the positional relationship information is information which is generated by measuring a sample printed circuit board on which no solder piece has been printed and which is stored in a positional relationship information table, the positional relationship information includes a template of the wiring pattern generated from an image of the sample printed circuit board, and the land determination unit determines the position of the wiring pattern in the image of the printed circuit board by template matching using the template, wherein the inspection unit is configured to output the inspection data for each of a plurality of measurement items, and the analyzer is configured to identify a cause of a defect or quality deterioration by evaluating process capability indexes of the plurality of measurement items calculated based on the inspection data. an inspection apparatus (Y1, Y2, Y3, Y4) for a surface mounting line, and an analyzer configured to analyze a cause of a defect or quality deterioration based on inspection data obtained by the inspection apparatus (Y1, Y2, Y3, Y4), the inspection apparatus comprising: an imaging unit configured to capture an image of a printed circuit board having a land on which a solder piece has been printed, an image of the printed circuit board having a component mounted on the solder piece, or an image of the printed circuit board having the component soldered to the land; a land determination unit configured to determine a position of an element on the printed circuit board from the image of the printed circuit board captured by the imaging unit, and determine a position of the land included in the image based on the determined position of the element; and an inspection unit configured to inspect the solder piece or the component on the land using the position of the land determined by the land determination unit as a reference; an imaging unit configured to capture an image of a printed circuit board having a land on which a solder piece has been printed, an image of the printed circuit board having a component mounted on the solder piece, or an image of the printed circuit board having the component soldered to the land; a land determination unit configured to determine a position of an element on the printed circuit board from the image of the printed circuit board captured by the imaging unit, and determine a position of the land included in the image based on the determined position of the element; and an inspection unit configured to inspect the solder piece or the component on the land using the position of the land determined by the land determination unit as a reference; the element is a wiring pattern formed on the printed circuit board, the land determination unit estimates the position of the land in the image based on positional relationship information defining a relative positional relationship between the wiring pattern and the land, and the position of the wiring pattern determined from the image, the positional relationship information is information which is generated by measuring a sample printed circuit board on which no solder piece has been printed and which is stored in a positional relationship information table, the positional relationship information includes a template of the wiring pattern generated from an image of the sample printed circuit board, and the land determination unit determines the position of the wiring pattern in the image of the printed circuit board by template matching using the template, wherein the inspection unit is configured to output the inspection data for each of a plurality of measurement items, and the analyzer is configured to identify a cause of a defect or quality deterioration by evaluating process capability indexes of the plurality of measurement items calculated based on the inspection data.