An LED lighting device (11, 31, 41) comprising: a plurality of light emitting diode elements; a mounting substrate (12, 42) made of a metal material, the plurality of light emitting diode elements being mounted directly on an upper surface of the mounting substrate (12, 42); and a pair of wiring substrates (13, 14) made of an insulating resin located on the upper surface of the mounting substrate (12, 42) and fixed to the mounting substrate (12, 42) via an adhesive, each of the pair of wiring substrates (13, 14) comprising an electrode portion on an upper surface of each of the pair of wiring substrates (13, 14), the electrode portion configured to supply a current to the light emitting diode elements from outside the LED lighting device (11, 31, 41), wherein the upper surface of the mounting substrate (12, 42) comprises: a light emitting region located at a center portion of the mounting substrate (12, 42) and in which the plurality of light emitting diode elements are mounted; an exposed region located at an outer side of the light emitting region and in which the upper surface of the mounting substrate (12, 42) is exposed; and a pair of wiring regions located at an outer side of the light emitting region in an area other than the exposed region and in which the pair of wiring substrates (13, 14) are respectively mounted, the total area of the pair of wiring regions being smaller than the area of the exposed region, wherein the plurality of light emitting diode elements are connected to each other through wires between one of the pair of wiring substrates (13, 14) and the other of the pair of wiring substrates (13, 14), one of the plurality of light emitting diode elements is mounted at a position adjacent to the one of the pair of wiring substrates (13, 14) and connected with the electrode portion on the upper surface of the one of the pair of wiring substrates (13, 14) through a wire, and another of the plurality of light emitting diode elements is mounted at a position adjacent to the other of the pair of wiring substrates (13, 14) and connected with the electrode portion on the upper surface of the other of the pair of wiring substrates (13, 14) through a wire. a plurality of light emitting diode elements; a mounting substrate (12, 42) made of a metal material, the plurality of light emitting diode elements being mounted directly on an upper surface of the mounting substrate (12, 42); and a pair of wiring substrates (13, 14) made of an insulating resin located on the upper surface of the mounting substrate (12, 42) and fixed to the mounting substrate (12, 42) via an adhesive, each of the pair of wiring substrates (13, 14) comprising an electrode portion on an upper surface of each of the pair of wiring substrates (13, 14), the electrode portion configured to supply a current to the light emitting diode elements from outside the LED lighting device (11, 31, 41), wherein the upper surface of the mounting substrate (12, 42) comprises: a light emitting region located at a center portion of the mounting substrate (12, 42) and in which the plurality of light emitting diode elements are mounted; an exposed region located at an outer side of the light emitting region and in which the upper surface of the mounting substrate (12, 42) is exposed; and a pair of wiring regions located at an outer side of the light emitting region in an area other than the exposed region and in which the pair of wiring substrates (13, 14) are respectively mounted, the total area of the pair of wiring regions being smaller than the area of the exposed region, a light emitting region located at a center portion of the mounting substrate (12, 42) and in which the plurality of light emitting diode elements are mounted; an exposed region located at an outer side of the light emitting region and in which the upper surface of the mounting substrate (12, 42) is exposed; and a pair of wiring regions located at an outer side of the light emitting region in an area other than the exposed region and in which the pair of wiring substrates (13, 14) are respectively mounted, the total area of the pair of wiring regions being smaller than the area of the exposed region, wherein the plurality of light emitting diode elements are connected to each other through wires between one of the pair of wiring substrates (13, 14) and the other of the pair of wiring substrates (13, 14), one of the plurality of light emitting diode elements is mounted at a position adjacent to the one of the pair of wiring substrates (13, 14) and connected with the electrode portion on the upper surface of the one of the pair of wiring substrates (13, 14) through a wire, and another of the plurality of light emitting diode elements is mounted at a position adjacent to the other of the pair of wiring substrates (13, 14) and connected with the electrode portion on the upper surface of the other of the pair of wiring substrates (13, 14) through a wire.