A buffer device, comprising: a plate (10A, 10B, 10C, 10D, 10E, 10F) having a front side; an insertion hole (11A, 11B, 11C, 11D, 11E, 11F) formed through the plate (10A, 10B, 10C, 10D, 10E, 10F); a retaining hole (13A, 13B, 13C, 13D, 13E, 13F) formed on the plate (10A, 10B, 10C, 10D, 10E, 10F) and above the insertion hole (11A, 11B, 11C, 11D, 11E, 11F) of the plate (10A, 10B, 10C, 10D, 10E, 10F); and characterized in that the plate (10A, 10B, 10C, 10D, 10E, 10F) further comprises a connecting portion (12A, 12B, 12C, 12D, 12E, 12F) formed on the plate (10A, 10B, 10C, 10D, 10E, 10F) and above the insertion hole (11A, 11B, 11C, 11D, 11E, 11F) of the plate (10A, 10B, 10C, 10D, 10E, 10F); the buffer device further comprises a moveable ring that is moveably mounted out of the front side of the plate (10A, 10B, IOC, 10D, 10E, 10F), is moveable outside the plate (10A, 10B, 10C, 10D, 10E, 10F), and has a slot formed through the moveable ring and a top section; and an elastic member connected with the connecting portion (12A, 12B, 12C, 12D, 12E, 12F) of the plate (10A, 10B, 10C, 10D, 10E, 10F) and the moveable ring, and has a top section wound on the connecting portion (12A, 12B, 12C, 12D, 12E, 12F) of the plate (10A, 10B, 10C, 10D, 10E, 10F); and a bottom section wound on the top section of the moveable ring and passing through the slot of the moveable ring. a plate (10A, 10B, 10C, 10D, 10E, 10F) having a front side; an insertion hole (11A, 11B, 11C, 11D, 11E, 11F) formed through the plate (10A, 10B, 10C, 10D, 10E, 10F); a retaining hole (13A, 13B, 13C, 13D, 13E, 13F) formed on the plate (10A, 10B, 10C, 10D, 10E, 10F) and above the insertion hole (11A, 11B, 11C, 11D, 11E, 11F) of the plate (10A, 10B, 10C, 10D, 10E, 10F); and a front side; an insertion hole (11A, 11B, 11C, 11D, 11E, 11F) formed through the plate (10A, 10B, 10C, 10D, 10E, 10F); a retaining hole (13A, 13B, 13C, 13D, 13E, 13F) formed on the plate (10A, 10B, 10C, 10D, 10E, 10F) and above the insertion hole (11A, 11B, 11C, 11D, 11E, 11F) of the plate (10A, 10B, 10C, 10D, 10E, 10F); and characterized in that the plate (10A, 10B, 10C, 10D, 10E, 10F) further comprises a connecting portion (12A, 12B, 12C, 12D, 12E, 12F) formed on the plate (10A, 10B, 10C, 10D, 10E, 10F) and above the insertion hole (11A, 11B, 11C, 11D, 11E, 11F) of the plate (10A, 10B, 10C, 10D, 10E, 10F); the buffer device further comprises a moveable ring that is moveably mounted out of the front side of the plate (10A, 10B, IOC, 10D, 10E, 10F), is moveable outside the plate (10A, 10B, 10C, 10D, 10E, 10F), and has a slot formed through the moveable ring and a top section; and an elastic member connected with the connecting portion (12A, 12B, 12C, 12D, 12E, 12F) of the plate (10A, 10B, 10C, 10D, 10E, 10F) and the moveable ring, and has a top section wound on the connecting portion (12A, 12B, 12C, 12D, 12E, 12F) of the plate (10A, 10B, 10C, 10D, 10E, 10F); and a bottom section wound on the top section of the moveable ring and passing through the slot of the moveable ring. a top section wound on the connecting portion (12A, 12B, 12C, 12D, 12E, 12F) of the plate (10A, 10B, 10C, 10D, 10E, 10F); and a bottom section wound on the top section of the moveable ring and passing through the slot of the moveable ring.