A fingerprint sensing device, characterized by: a flexible substrate unit including a first flexible substrate, a double-sided flexible substrate, and a second flexible substrate which are stacked from top to bottom, said double-sided substrate having a first surface adjacent to said first flexible substrate, and a second surface adjacent to said second flexible substrate; a sensing unit including a plurality of first strip electrodes that are disposed on said first surface and that are disposed between said first flexible substrate and said double-sided substrate, a plurality of second strip electrodes that are disposed on said second surface and that are disposed between said double-sided substrate and said second flexible substrate, a plurality of first electroconductive pads disposed on a bottom surface of said first flexible substrate, and a plurality of connecting pads and a plurality of second electroconductive pads disposed on a top surface of said second flexible substrate, said first strip electrodes being upwardly connected to said first electroconductive pads, said first electroconductive pads being downwardly connected to said connecting pads, said second strip electrodes being downwardly connected to said second electroconductive pads; and a chip unit that is disposed on said second flexible substrate and that is electrically connected to said connecting pads and said second electroconductive pads. a flexible substrate unit including a first flexible substrate, a double-sided flexible substrate, and a second flexible substrate which are stacked from top to bottom, said double-sided substrate having a first surface adjacent to said first flexible substrate, and a second surface adjacent to said second flexible substrate; a sensing unit including a plurality of first strip electrodes that are disposed on said first surface and that are disposed between said first flexible substrate and said double-sided substrate, a plurality of second strip electrodes that are disposed on said second surface and that are disposed between said double-sided substrate and said second flexible substrate, a plurality of first electroconductive pads disposed on a bottom surface of said first flexible substrate, and a plurality of connecting pads and a plurality of second electroconductive pads disposed on a top surface of said second flexible substrate, said first strip electrodes being upwardly connected to said first electroconductive pads, said first electroconductive pads being downwardly connected to said connecting pads, said second strip electrodes being downwardly connected to said second electroconductive pads; and a plurality of first strip electrodes that are disposed on said first surface and that are disposed between said first flexible substrate and said double-sided substrate, a plurality of second strip electrodes that are disposed on said second surface and that are disposed between said double-sided substrate and said second flexible substrate, a plurality of first electroconductive pads disposed on a bottom surface of said first flexible substrate, and a plurality of connecting pads and a plurality of second electroconductive pads disposed on a top surface of said second flexible substrate, said first strip electrodes being upwardly connected to said first electroconductive pads, said first electroconductive pads being downwardly connected to said connecting pads, said second strip electrodes being downwardly connected to said second electroconductive pads; and a chip unit that is disposed on said second flexible substrate and that is electrically connected to said connecting pads and said second electroconductive pads.