Method of manufacturing a package carrier suitable for enclosing at least one microelectronic element (60, 61) and having electrically conductive connection pads for electric connection of the package carrier to another device, comprising the following steps: providing a sacrificial carrier having a carrying surface and a pattern of electrically conductive connection pads and electrically conductive tracks at the carrying surface; bending the sacrificial carrier such that an elevated portion and a recessed portion are created in the carrying surface; arranging a covering member having at least one hole on the carrier such that the hole in the covering member and a top portion of the covering member circumfering the hole are present on a portion of the elevated portion of the carrying surface of the carrier, thereby covering at least part of the pattern of electrically conductive connection pads and electrically conductive tracks; forming a body member by applying material to the carrying surface, the pattern of electrically conductive connection pads and electrically conductive tracks and to a part of the covering member, while leaving the top portion of the covering member free, such that the pattern and covering member are transferred to the body member; and removing at least a portion of the sacrificial carrier, therewith creating a recess at a side of the body member where the removed portion of the sacrificial carrier has been and at the location where the elevated portion of the sacrificial carrier has been, and exposing at least one electrically conductive connection pad of the pattern suitable for electrically coupling to a microelectronic element at said side of the body member, which recess extends to the hole in the covering member. providing a sacrificial carrier having a carrying surface and a pattern of electrically conductive connection pads and electrically conductive tracks at the carrying surface; bending the sacrificial carrier such that an elevated portion and a recessed portion are created in the carrying surface; arranging a covering member having at least one hole on the carrier such that the hole in the covering member and a top portion of the covering member circumfering the hole are present on a portion of the elevated portion of the carrying surface of the carrier, thereby covering at least part of the pattern of electrically conductive connection pads and electrically conductive tracks; forming a body member by applying material to the carrying surface, the pattern of electrically conductive connection pads and electrically conductive tracks and to a part of the covering member, while leaving the top portion of the covering member free, such that the pattern and covering member are transferred to the body member; and removing at least a portion of the sacrificial carrier, therewith creating a recess at a side of the body member where the removed portion of the sacrificial carrier has been and at the location where the elevated portion of the sacrificial carrier has been, and exposing at least one electrically conductive connection pad of the pattern suitable for electrically coupling to a microelectronic element at said side of the body member, which recess extends to the hole in the covering member.