A transceiver, comprising: a plurality of electrical channels configured to transfer electromagnetic signals to a plurality of air waveguides, the plurality of electrical channels each comprising a differential pair of microstrips having first and second microstrips in the form of parallel metallic strips having a constant spacing along their length, the first microstrip connected to a positive terminal of a respective transceiver channel and the second microstrip connected to a negative terminal of the respective transceiver channel, each electrical channel in the plurality of electrical channels comprising an electrical channel that extends from an output of at least one transmitter and / or an input of at least one receiver along an exterior surface of a chip package and terminates at a transition (26, 30) that provides a link between the respective electrical channel and an air waveguide that overlays the transition, the transition comprising a region of an exterior surface of the chip package, the chip package configured to support the at least one transmitter and / or the at least one receiver, the region being overlaid by an end of the air waveguide and surrounded by a solder ball fence configured to provide electromagnetic shielding for the air waveguide, one side of the solder ball fence defining a gap through which the differential pair of microstrips pass, the transition including an arrangement selected from the group consisting of: a pair of opposed solder ball transitions that are in electrical contact with the end of the air waveguide that includes a slot, the slot being positioned between the pair of opposed solder ball transitions; and multiple bowtie transitions comprising opposing triangular metal pads that are in contact with the differential pairs of microstrips, the end of the air waveguide that overlays the region being open. a plurality of electrical channels configured to transfer electromagnetic signals to a plurality of air waveguides, the plurality of electrical channels each comprising a differential pair of microstrips having first and second microstrips in the form of parallel metallic strips having a constant spacing along their length, the first microstrip connected to a positive terminal of a respective transceiver channel and the second microstrip connected to a negative terminal of the respective transceiver channel, each electrical channel in the plurality of electrical channels comprising an electrical channel that extends from an output of at least one transmitter and / or an input of at least one receiver along an exterior surface of a chip package and terminates at a transition (26, 30) that provides a link between the respective electrical channel and an air waveguide that overlays the transition, the transition comprising a region of an exterior surface of the chip package, the chip package configured to support the at least one transmitter and / or the at least one receiver, the region being overlaid by an end of the air waveguide and surrounded by a solder ball fence configured to provide electromagnetic shielding for the air waveguide, one side of the solder ball fence defining a gap through which the differential pair of microstrips pass, the transition including an arrangement selected from the group consisting of: a pair of opposed solder ball transitions that are in electrical contact with the end of the air waveguide that includes a slot, the slot being positioned between the pair of opposed solder ball transitions; and multiple bowtie transitions comprising opposing triangular metal pads that are in contact with the differential pairs of microstrips, the end of the air waveguide that overlays the region being open. a pair of opposed solder ball transitions that are in electrical contact with the end of the air waveguide that includes a slot, the slot being positioned between the pair of opposed solder ball transitions; and multiple bowtie transitions comprising opposing triangular metal pads that are in contact with the differential pairs of microstrips, the end of the air waveguide that overlays the region being open.