Method for the manufacture of a panel with semiconductor chip stacks, which comprises the following method steps: providing a semiconductor wafer, which has semiconductor chip positions arranged in rows and columns with integrated circuits for first semiconductor chips, the semiconductor chip positions each having a central region with central contact areas and an edge region with edge contact areas and the central contact areas being electrically connected to the edge contact areas by way of interconnects, populating the semiconductor wafer with second semiconductor chips in central regions of the semiconductor chip positions while leaving the edge contact areas free, so that the second semiconductor chips are connected to the central contact areas by way of flip-chip contacts, thinning the second semiconductor chips on the semiconductor wafer, applying a levelling compound to the semiconductor wafer while embedding the second semiconductor chips, working the levelling compound to form an even levelling layer, separating the semiconductor wafer into individual semiconductor chip stacks, which each have a first and a second semiconductor chip (4, 10) and also a part of the levelling layer as a levelling layer of the semiconductor stack, applying the semiconductor chip stacks to a substrate, by their levelling layers being adhesively attached to the substrate, in rows and columns for correspondingly provided component positions of the panel, embedding the semiconductor chip stacks in a polymer compound while forming a composite plastic sheet with component positions, removing the substrate from the composite plastic sheet, introducing into the levelling layers passages to the edge contact areas of the first semiconductor chip, filling the passages with copper or a copper alloy to form vias, applying a redistribution layer on the composite plastic sheet with redistribution lines from the vias to outer contact areas of the redistribution layer in the component positions of the panel, applying a solder resist layer to the redistribution layer while leaving the outer contact areas free, applying outer contacts to the outer contact areas, outer contacts being arranged on the polymer compound of the panel. providing a semiconductor wafer, which has semiconductor chip positions arranged in rows and columns with integrated circuits for first semiconductor chips, the semiconductor chip positions each having a central region with central contact areas and an edge region with edge contact areas and the central contact areas being electrically connected to the edge contact areas by way of interconnects, populating the semiconductor wafer with second semiconductor chips in central regions of the semiconductor chip positions while leaving the edge contact areas free, so that the second semiconductor chips are connected to the central contact areas by way of flip-chip contacts, thinning the second semiconductor chips on the semiconductor wafer, applying a levelling compound to the semiconductor wafer while embedding the second semiconductor chips, working the levelling compound to form an even levelling layer, separating the semiconductor wafer into individual semiconductor chip stacks, which each have a first and a second semiconductor chip (4, 10) and also a part of the levelling layer as a levelling layer of the semiconductor stack, applying the semiconductor chip stacks to a substrate, by their levelling layers being adhesively attached to the substrate, in rows and columns for correspondingly provided component positions of the panel, embedding the semiconductor chip stacks in a polymer compound while forming a composite plastic sheet with component positions, removing the substrate from the composite plastic sheet, introducing into the levelling layers passages to the edge contact areas of the first semiconductor chip, filling the passages with copper or a copper alloy to form vias, applying a redistribution layer on the composite plastic sheet with redistribution lines from the vias to outer contact areas of the redistribution layer in the component positions of the panel, applying a solder resist layer to the redistribution layer while leaving the outer contact areas free, applying outer contacts to the outer contact areas, outer contacts being arranged on the polymer compound of the panel.