An electronic device (200, 500, 600, 800) comprising a substrate having a mating component (228, 628, 828) extending from an interior surface of the substrate, a locking mechanism (202, 602, 802), the locking mechanism comprising: a chassis (204, 504, 604, 804) having a base (206, 506, 606, 806), a first side wall (208, 508, 608, 808) extending from a surface (212, 512, 612, 812) of the base (206, 506, 606, 806), and a second side wall (210, 510, 610, 810) extending from the surface (212, 512, 612, 812) of the base (206, 506 606, 806); a cavity (214, 514, 614, 814) provided in a volume formed by the first side wall (208, 508, 608, 808), the second side wall (210, 510, 610, 810), and the surface (212, 512, 612, 812) of the base (206, 506, 606, 806); and a cantilevered plate (216, 516, 616, 816) having a first end (218, 518, 618, 818) and a second, opposite end (220, 520 620, 820), wherein the cantilevered plate (216, 516, 616, 816) is attached to the first side wall (208, 508, 608, 808) of the chassis (204, 504, 604, 804) at or adjacent to the first end (218, 518, 618, 818), and wherein the second end (220, 520, 620, 820) of the cantilevered plate (216, 516, 616, 816) is positioned within the cavity (214, 514, 614, 814), wherein the cantilevered plate is positioned at an acute angle greater than 0 degrees and less than 90 degrees as measured between a plane formed by the inner surface of the base of the chassis and a plane formed by the cantilevered plate, wherein the cavity (214, 514, 614, 814) is configured to receive the mating component (228, 628, 828) wherein a first side of the mating component (228, 628, 828) is configured to abut the cantilevered plate (216, 516, 616, 816) and a second, opposite side of the mating component (228, 628, 828) is configured to abut a surface of the second side wall (210, 510, 610, 810) extending from the chassis (204, 504, 604, 804), wherein the cantilevered plate (216, 516, 616, 818) is configured to bend at or adjacent to the second end (220, 520, 620, 820) by the application of a force, therein moving between a locked position and an unlocked position, wherein the mating component (228, 528, 628, 828) comprises a notch (234, 634, 834) in the first side of the mating component (228, 628, 828), wherein the notch (234, 634, 834) is configured to receive a portion of the second end (220, 520, 620, 820) of the cantilevered plate (216, 516, 616, 816) and secure the mating component (228, 628, 828) in the locked position, and wherein the mating component (228, 628, 828) of the electronic device (200, 500, 600, 800) is securable in the locked position and removable in the unlocked position. a chassis (204, 504, 604, 804) having a base (206, 506, 606, 806), a first side wall (208, 508, 608, 808) extending from a surface (212, 512, 612, 812) of the base (206, 506, 606, 806), and a second side wall (210, 510, 610, 810) extending from the surface (212, 512, 612, 812) of the base (206, 506 606, 806); a cavity (214, 514, 614, 814) provided in a volume formed by the first side wall (208, 508, 608, 808), the second side wall (210, 510, 610, 810), and the surface (212, 512, 612, 812) of the base (206, 506, 606, 806); and a cantilevered plate (216, 516, 616, 816) having a first end (218, 518, 618, 818) and a second, opposite end (220, 520 620, 820), wherein the cantilevered plate (216, 516, 616, 816) is attached to the first side wall (208, 508, 608, 808) of the chassis (204, 504, 604, 804) at or adjacent to the first end (218, 518, 618, 818), and wherein the second end (220, 520, 620, 820) of the cantilevered plate (216, 516, 616, 816) is positioned within the cavity (214, 514, 614, 814), wherein the cantilevered plate is positioned at an acute angle greater than 0 degrees and less than 90 degrees as measured between a plane formed by the inner surface of the base of the chassis and a plane formed by the cantilevered plate, wherein the cavity (214, 514, 614, 814) is configured to receive the mating component (228, 628, 828) wherein a first side of the mating component (228, 628, 828) is configured to abut the cantilevered plate (216, 516, 616, 816) and a second, opposite side of the mating component (228, 628, 828) is configured to abut a surface of the second side wall (210, 510, 610, 810) extending from the chassis (204, 504, 604, 804), wherein the cantilevered plate (216, 516, 616, 818) is configured to bend at or adjacent to the second end (220, 520, 620, 820) by the application of a force, therein moving between a locked position and an unlocked position, wherein the mating component (228, 528, 628, 828) comprises a notch (234, 634, 834) in the first side of the mating component (228, 628, 828), wherein the notch (234, 634, 834) is configured to receive a portion of the second end (220, 520, 620, 820) of the cantilevered plate (216, 516, 616, 816) and secure the mating component (228, 628, 828) in the locked position, and wherein the mating component (228, 628, 828) of the electronic device (200, 500, 600, 800) is securable in the locked position and removable in the unlocked position.