A camera module, comprising: at least one optical lens; at least one molded unit; at least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-photosensitive area surrounding around the photosensitive area; and a circuit board, wherein the circuit board comprises at least one substrate and at least one electronic component, the substrate has a substrate front surface and a substrate back surface, the substrate front surface and the substrate back surface correspond to each other; wherein the electronic component is conductively connected to the substrate; wherein the photosensitive element is conductively connected with the substrate, and the optical lens is held in the photosensitive path of the photosensitive element, wherein the molded unit comprises at least one back surface molded portion, and wherein the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate, wherein at least one of the electronic components is conductively connected to the substrate on the substrate back surface of the substrate, and the electronic component conductively connected to the substrate on the substrate back surface of the substrate protrudes from the substrate back surface of the substrate, and wherein the back surface molded portion embeds at least one part of at least one of the electronic components protruded from the substrate back surface of the substrate, wherein the substrate further has at least one substrate channel, which extends from the substrate front surface to the substrate back surface, wherein a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to the substrate channel of the substrate, wherein the camera module further comprises a filler, wherein the filler is held between the substrate back surface of the substrate and the non-photosensitive area of the photosensitive element, to fill the gap formed between the substrate back surface of the substrate and the non-photosensitive area of the photosensitive element, and the filler is used to connect the substrate and the photosensitive element, so that the photosensitive element is firmly attached to the substrate back surface of the substrate. at least one optical lens; at least one molded unit; at least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-photosensitive area surrounding around the photosensitive area; and a circuit board, wherein the circuit board comprises at least one substrate and at least one electronic component, the substrate has a substrate front surface and a substrate back surface, the substrate front surface and the substrate back surface correspond to each other; wherein the electronic component is conductively connected to the substrate; wherein the photosensitive element is conductively connected with the substrate, and the optical lens is held in the photosensitive path of the photosensitive element, wherein the molded unit comprises at least one back surface molded portion, and wherein the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate, wherein at least one of the electronic components is conductively connected to the substrate on the substrate back surface of the substrate, and the electronic component conductively connected to the substrate on the substrate back surface of the substrate protrudes from the substrate back surface of the substrate, and wherein the back surface molded portion embeds at least one part of at least one of the electronic components protruded from the substrate back surface of the substrate, wherein the substrate further has at least one substrate channel, which extends from the substrate front surface to the substrate back surface, wherein a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to the substrate channel of the substrate, wherein the camera module further comprises a filler, wherein the filler is held between the substrate back surface of the substrate and the non-photosensitive area of the photosensitive element, to fill the gap formed between the substrate back surface of the substrate and the non-photosensitive area of the photosensitive element, and the filler is used to connect the substrate and the photosensitive element, so that the photosensitive element is firmly attached to the substrate back surface of the substrate.