A method for manufacturing light emitting devices, comprising: providing a package body including: (i) a reflector cup defining a cavity, wherein the reflector cup is molded over a metal base including two portions (121, 122), and (ii) a plurality of metal pads (123, 124) disposed at a bottom interior surface of the cavity; performing reservoir stencil printing to deposit a respective solder pattern (810, 820) on each of the metal pads (123, 124); and placing an LED die on the solder patterns (810, 820) that are formed on the metal pads (123, 124) and performing reflow soldering to attach the LED die to the metal pads (123, 124); characterized in that: the reservoir stencil printing being performed using a 3D electroform stencil that is placed over the reflector cup, the 3D electroform stencil including a lip configured to engage one or more sidewalls of the reflector cup, and a reservoir extending away from the lip and into the cavity, wherein the reservoir includes a first plurality of apertures and a second plurality of apertures, the first plurality of apertures being formed at a first location in a bottom surface of the reservoir, and the second plurality of apertures being formed at a second location in the bottom surface of the reservoir, wherein the apertures (315, 316) are used for releasing solder from the reservoir onto the metal pads (123, 124), whereby each of the first and the second location on the bottom surface of the reservoir corresponds to a metal pad of the metal pads (123, 124) disposed on the bottom interior surface of the reflector cup in being situated directly above the respective metal pad (123, 124) when the 3D electroform stencil is inserted in the reflector cup, wherein each of the portions (121, 122) includes a metal pad (123, 124) and a plurality of protrusions, wherein the plurality of protrusions are arranged on the outer edges of the metal pads (123, 124) and wherein the protrusions are at least partly engulfed by the molding compound used to form the reflector cup. providing a package body including: (i) a reflector cup defining a cavity, wherein the reflector cup is molded over a metal base including two portions (121, 122), and (ii) a plurality of metal pads (123, 124) disposed at a bottom interior surface of the cavity; performing reservoir stencil printing to deposit a respective solder pattern (810, 820) on each of the metal pads (123, 124); and placing an LED die on the solder patterns (810, 820) that are formed on the metal pads (123, 124) and performing reflow soldering to attach the LED die to the metal pads (123, 124); characterized in that: the reservoir stencil printing being performed using a 3D electroform stencil that is placed over the reflector cup, the 3D electroform stencil including a lip configured to engage one or more sidewalls of the reflector cup, and a reservoir extending away from the lip and into the cavity, wherein the reservoir includes a first plurality of apertures and a second plurality of apertures, the first plurality of apertures being formed at a first location in a bottom surface of the reservoir, and the second plurality of apertures being formed at a second location in the bottom surface of the reservoir, wherein the apertures (315, 316) are used for releasing solder from the reservoir onto the metal pads (123, 124), whereby each of the first and the second location on the bottom surface of the reservoir corresponds to a metal pad of the metal pads (123, 124) disposed on the bottom interior surface of the reflector cup in being situated directly above the respective metal pad (123, 124) when the 3D electroform stencil is inserted in the reflector cup, the reservoir stencil printing being performed using a 3D electroform stencil that is placed over the reflector cup, the 3D electroform stencil including a lip configured to engage one or more sidewalls of the reflector cup, and a reservoir extending away from the lip and into the cavity, wherein the reservoir includes a first plurality of apertures and a second plurality of apertures, the first plurality of apertures being formed at a first location in a bottom surface of the reservoir, and the second plurality of apertures being formed at a second location in the bottom surface of the reservoir, wherein the apertures (315, 316) are used for releasing solder from the reservoir onto the metal pads (123, 124), whereby each of the first and the second location on the bottom surface of the reservoir corresponds to a metal pad of the metal pads (123, 124) disposed on the bottom interior surface of the reflector cup in being situated directly above the respective metal pad (123, 124) when the 3D electroform stencil is inserted in the reflector cup, wherein each of the portions (121, 122) includes a metal pad (123, 124) and a plurality of protrusions, wherein the plurality of protrusions are arranged on the outer edges of the metal pads (123, 124) and wherein the protrusions are at least partly engulfed by the molding compound used to form the reflector cup.