An ultrasound imaging transducer comprising: an array of electro-acoustic elements; a backing block with a planar, non-recessed distal surface on which the array is mounted; and at least one acoustic matching layer (140, 142) on a transmitting surface of the electro-acoustic element; the ultrasound imaging transducer being CHARACTERISED BY: for each electro-acoustic element, an area (125, 126) of electrically conductive material on a corresponding portion of a contact surface of either the backing block or of the electro-acoustic element, or of both, in electrical contact with the electro-acoustic element; a substantially rigid printed circuit board secured to the backing block and extending in a longitudinal direction substantially perpendicular to the contact surface; for each electro-acoustic element, at least one electrically conductive trace (104, 105) on the PCB and in solder-free electrical contact with the corresponding contact surface portion (125, 126) and thereby with the electro-acoustic element, such that a solder-free electrical signal path is formed through the trace (104, 105) to the electro-acoustic element; at least one metallic member (120, 121) located on at least one side surface of the backing block, extending longitudinally at least as far as the array, and extend in contact with most lateral edges of said electro-acoustic elements of said array; said at least one metallic member (120,121)is forming a common electrical ground contact; and a thermally conductive, metallic layer between the matching layer and each respective electro-acoustic element and in contact with the metallic member (120, 121), an edge region of each metallic member (120, 121) being in thermal contact with a respective edge portion of the matching layer (140, 142), a direct thermal path thereby being formed from the matching layer and each electro-acoustic element to the metallic member, the metallic member thereby providing both electrical grounding and heat sinking. an array of electro-acoustic elements; a backing block with a planar, non-recessed distal surface on which the array is mounted; and at least one acoustic matching layer (140, 142) on a transmitting surface of the electro-acoustic element; the ultrasound imaging transducer being CHARACTERISED BY: for each electro-acoustic element, an area (125, 126) of electrically conductive material on a corresponding portion of a contact surface of either the backing block or of the electro-acoustic element, or of both, in electrical contact with the electro-acoustic element; a substantially rigid printed circuit board secured to the backing block and extending in a longitudinal direction substantially perpendicular to the contact surface; for each electro-acoustic element, at least one electrically conductive trace (104, 105) on the PCB and in solder-free electrical contact with the corresponding contact surface portion (125, 126) and thereby with the electro-acoustic element, such that a solder-free electrical signal path is formed through the trace (104, 105) to the electro-acoustic element; at least one metallic member (120, 121) located on at least one side surface of the backing block, extending longitudinally at least as far as the array, and extend in contact with most lateral edges of said electro-acoustic elements of said array; said at least one metallic member (120,121)is forming a common electrical ground contact; and a thermally conductive, metallic layer between the matching layer and each respective electro-acoustic element and in contact with the metallic member (120, 121), an edge region of each metallic member (120, 121) being in thermal contact with a respective edge portion of the matching layer (140, 142), a direct thermal path thereby being formed from the matching layer and each electro-acoustic element to the metallic member, the metallic member thereby providing both electrical grounding and heat sinking. for each electro-acoustic element, an area (125, 126) of electrically conductive material on a corresponding portion of a contact surface of either the backing block or of the electro-acoustic element, or of both, in electrical contact with the electro-acoustic element; a substantially rigid printed circuit board secured to the backing block and extending in a longitudinal direction substantially perpendicular to the contact surface; for each electro-acoustic element, at least one electrically conductive trace (104, 105) on the PCB and in solder-free electrical contact with the corresponding contact surface portion (125, 126) and thereby with the electro-acoustic element, such that a solder-free electrical signal path is formed through the trace (104, 105) to the electro-acoustic element; at least one metallic member (120, 121) located on at least one side surface of the backing block, extending longitudinally at least as far as the array, and extend in contact with most lateral edges of said electro-acoustic elements of said array; said at least one metallic member (120,121)is forming a common electrical ground contact; and a thermally conductive, metallic layer between the matching layer and each respective electro-acoustic element and in contact with the metallic member (120, 121), an edge region of each metallic member (120, 121) being in thermal contact with a respective edge portion of the matching layer (140, 142), a direct thermal path thereby being formed from the matching layer and each electro-acoustic element to the metallic member, the metallic member thereby providing both electrical grounding and heat sinking.