A pressure sensor comprising: a substrate including a first side and a second side; a first pressure sensing die mounted on the first side of the substrate, wherein the first pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the first pressure sensing die is positioned over a first opening in the substrate, the first opening extending between the first side and the second side of the substrate; a second pressure sensing die mounted on the first side of the substrate, wherein the second pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the second pressure sensing die is positioned over a second opening in the substrate, the second opening extending between the first side and the second side of the substrate; a first housing member positioned on the first side of the substrate and defining a first cavity around the first pressure sensing die and the second pressure sensing die, wherein the first housing member includes a first pressure opening for exposing the first pressure sensing die and the second pressure sensing die to a first pressure within the first cavity; and a second housing member positioned on the second side of the substrate and defining a second cavity, wherein the second housing member includes a second pressure opening for exposing the first pressure sensing die and the second pressure sensing die to a second pressure within the second cavity; wherein a pressure within the second cavity is transmitted to the first pressure sensing die via the first opening, characterized in that the first pressure sensing die is adapted to provide a first resolution of a sensed pressure and the second pressure sensing die is adapted to provide a second resolution of the sensed pressure, wherein the first resolution is higher than the second resolution. a substrate including a first side and a second side; a first pressure sensing die mounted on the first side of the substrate, wherein the first pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the first pressure sensing die is positioned over a first opening in the substrate, the first opening extending between the first side and the second side of the substrate; a second pressure sensing die mounted on the first side of the substrate, wherein the second pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the second pressure sensing die is positioned over a second opening in the substrate, the second opening extending between the first side and the second side of the substrate; a first housing member positioned on the first side of the substrate and defining a first cavity around the first pressure sensing die and the second pressure sensing die, wherein the first housing member includes a first pressure opening for exposing the first pressure sensing die and the second pressure sensing die to a first pressure within the first cavity; and a second housing member positioned on the second side of the substrate and defining a second cavity, wherein the second housing member includes a second pressure opening for exposing the first pressure sensing die and the second pressure sensing die to a second pressure within the second cavity; wherein a pressure within the second cavity is transmitted to the first pressure sensing die via the first opening, characterized in that the first pressure sensing die is adapted to provide a first resolution of a sensed pressure and the second pressure sensing die is adapted to provide a second resolution of the sensed pressure, wherein the first resolution is higher than the second resolution.