A barrier chemical mechanical planarization polishing composition comprising: ≥ 15 wt.% of abrasive; ≤ 10 wt.% of chemical additive; 0.001 wt.% to 1.0 wt.% corrosion inhibitor, water soluble solvent; wherein the abrasive is selected from the group consisting of high purity colloidal silica, nano-sized colloidal silica, alumina, ceria, germania, silica, titania, zirconia, alumina dopes colloidal silica in lattices, and combinations thereof; the chemical additive comprising at least one polyprotic acid or its salt selected from the group consisting of phosphonoacetic acid, its derivatives and their salts; phosphonic acid, its derivatives and their salts; phenylphosphonic acid, its derivatives and their salts; molybdenum diacid, its derivatives and their salts; oxalic acid, its derivatives and their salts; sulfurous acid, its derivative and their salts; arsenic acid, its derivatives and their salts; nitrobenzoic acid, its derivatives and their salts; malonic acid, its derivative and their salts;; silicic acid, its derivative and their salts; carbonic acid, its derivative and their salts; and combinations thereof, at least one polyprotic acid or its salt having more than one Pka and having Pka1 from 0 to 12; the corrosion inhibitor is selected from the group consisting of benzotriazole, 3-amino-1, 2, 4-triazole, 3, 5-diamine-1, 2, 4-triazole, and combinations thereof the water soluble solvent is selected from the group consisting of DI water, a polar solvent and a mixture of DI water and polar solvent; wherein the polar solvent is selected from the group consisting of alcohol, ether, ketone, or other polar reagent; and wherein the polishing composition has a pH of 2 to 12. ≥ 15 wt.% of abrasive; ≤ 10 wt.% of chemical additive; 0.001 wt.% to 1.0 wt.% corrosion inhibitor, water soluble solvent; wherein the abrasive is selected from the group consisting of high purity colloidal silica, nano-sized colloidal silica, alumina, ceria, germania, silica, titania, zirconia, alumina dopes colloidal silica in lattices, and combinations thereof; the chemical additive comprising at least one polyprotic acid or its salt selected from the group consisting of phosphonoacetic acid, its derivatives and their salts; phosphonic acid, its derivatives and their salts; phenylphosphonic acid, its derivatives and their salts; molybdenum diacid, its derivatives and their salts; oxalic acid, its derivatives and their salts; sulfurous acid, its derivative and their salts; arsenic acid, its derivatives and their salts; nitrobenzoic acid, its derivatives and their salts; malonic acid, its derivative and their salts;; silicic acid, its derivative and their salts; carbonic acid, its derivative and their salts; and combinations thereof, at least one polyprotic acid or its salt having more than one Pka and having Pka1 from 0 to 12; the corrosion inhibitor is selected from the group consisting of benzotriazole, 3-amino-1, 2, 4-triazole, 3, 5-diamine-1, 2, 4-triazole, and combinations thereof the water soluble solvent is selected from the group consisting of DI water, a polar solvent and a mixture of DI water and polar solvent; wherein the polar solvent is selected from the group consisting of alcohol, ether, ketone, or other polar reagent; and wherein the polishing composition has a pH of 2 to 12.