An electroluminescent device comprising: a) a plurality of electroluminescent organic light emitting diode (OLED) tiles (D1 - Dn); b) a plurality of load elements (R1 - Rn) which comprises resistor elements, a combination of capacitors and resistors, or a combination of capacitors and current sources, and wherein said current sources are formed by a circuit of resistors, transistors and diodes; c) a common carrier substrate on which said electroluminescent OLED tiles (D1 - Dn) and said load elements (R1 - Rn) are mounted; d) a metal interconnecting structure (40; 85; 95) for connecting said electroluminescent OLED tiles (D1 - Dn) and said load elements (R1 - Rn) and for providing a predetermined heat spreading from hot spots created by said load elements (R1 - Rn); and e) an isolation structure (60; 70; 90) for thermally isolating said electroluminescent OLED tiles (D1 - Dn) from hot spots created by said load elements (R1 - Rn), f) wherein said interconnecting structure (40; 85; 95) and said isolation structure (60; 70; 90) are arranged to combine said predetermined heat spreading and thermal isolation in such a way that local power loss is minimized at hot spots on said common carrier structure and that additional thermal load on an emission layer of said electroluminescent segments (D1 - Dn) is symmetrized with respect to self heating of said light emitting device, characterized in that said isolation structure comprises one of the following features (i), (ii) or (iii): (i) an isolation pad arranged between said electroluminescent OLED tiles (D1 - Dn) and said common carrier substrate, and wherein electrode wires of said electroluminescent OLED tiles (D1 - Dn) are connected to said interconnecting structure, wherein said load elements (R1 - Rn) are provided on the opposite surface of said common carrier substrate as compared to said OLED tiles (D1 - Dn), or (ii) said isolation structure comprises a plurality of holes of the common carrier substrate, by which said OLED tiles (D1 - Dn) are thermally isolated, or (iii) said isolation structure comprises a plurality of glass lids sandwiched between said electroluminescent OLED tiles (D1 - Dn) and said common carrier substrate a) a plurality of electroluminescent organic light emitting diode (OLED) tiles (D1 - Dn); b) a plurality of load elements (R1 - Rn) which comprises resistor elements, a combination of capacitors and resistors, or a combination of capacitors and current sources, and wherein said current sources are formed by a circuit of resistors, transistors and diodes; c) a common carrier substrate on which said electroluminescent OLED tiles (D1 - Dn) and said load elements (R1 - Rn) are mounted; d) a metal interconnecting structure (40; 85; 95) for connecting said electroluminescent OLED tiles (D1 - Dn) and said load elements (R1 - Rn) and for providing a predetermined heat spreading from hot spots created by said load elements (R1 - Rn); and e) an isolation structure (60; 70; 90) for thermally isolating said electroluminescent OLED tiles (D1 - Dn) from hot spots created by said load elements (R1 - Rn), f) wherein said interconnecting structure (40; 85; 95) and said isolation structure (60; 70; 90) are arranged to combine said predetermined heat spreading and thermal isolation in such a way that local power loss is minimized at hot spots on said common carrier structure and that additional thermal load on an emission layer of said electroluminescent segments (D1 - Dn) is symmetrized with respect to self heating of said light emitting device, (i) an isolation pad arranged between said electroluminescent OLED tiles (D1 - Dn) and said common carrier substrate, and wherein electrode wires of said electroluminescent OLED tiles (D1 - Dn) are connected to said interconnecting structure, wherein said load elements (R1 - Rn) are provided on the opposite surface of said common carrier substrate as compared to said OLED tiles (D1 - Dn), or (ii) said isolation structure comprises a plurality of holes of the common carrier substrate, by which said OLED tiles (D1 - Dn) are thermally isolated, or (iii) said isolation structure comprises a plurality of glass lids sandwiched between said electroluminescent OLED tiles (D1 - Dn) and said common carrier substrate