An optoelectronic device for in vivo use, comprising: a first electronic module comprising an electroactive lens; a second electronic module; and an electric interconnect; characterized in that the the electric interconnect comprises a hermetic electric interconnect to provide a hermetically sealed electric coupling between the first and second electronic module; the hermetic electric interconnect comprising: a bottom metal layer; a bottom insulating layer, deposited on the bottom metal layer to insulate the bottom metal layer, and patterned to form a bottom seal ring trench; an interconnect metal layer, deposited on the bottom insulating layer, and deposited to fill the bottom seal ring trench to form a bottom sealing ring; and patterned to form electrical connections between contact pads (234-1, 234-2), and to form a middle sealing ring around the electrical connections, coupled with the bottom sealing ring; a patterned top insulating layer, deposited on the interconnect metal layer to insulate the interconnect metal layer, and to separate the middle sealing ring from the interconnect metal layer; and patterned to form feedthrough holes (242-1, 242-2) for the contact pads, and to form a top seal ring trench coupled with the middle sealing ring; and a top metal layer, deposited on the top insulating layer to start forming contacts by filling the feedthrough holes (242-1, 242-2), and deposited to start forming a top sealing ring by filling the top seal ring trench; and patterned to complete forming contacts (254-1, 254-2) through the feedthrough holes (242-1, 242-2), to form a separate barrier layer, and to complete forming the top sealing ring. a first electronic module comprising an electroactive lens; a second electronic module; and an electric interconnect; characterized in that the the electric interconnect comprises a hermetic electric interconnect to provide a hermetically sealed electric coupling between the first and second electronic module; the hermetic electric interconnect comprising: a bottom metal layer; a bottom insulating layer, deposited on the bottom metal layer to insulate the bottom metal layer, and patterned to form a bottom seal ring trench; an interconnect metal layer, deposited on the bottom insulating layer, and deposited to fill the bottom seal ring trench to form a bottom sealing ring; and patterned to form electrical connections between contact pads (234-1, 234-2), and to form a middle sealing ring around the electrical connections, coupled with the bottom sealing ring; a patterned top insulating layer, deposited on the interconnect metal layer to insulate the interconnect metal layer, and to separate the middle sealing ring from the interconnect metal layer; and patterned to form feedthrough holes (242-1, 242-2) for the contact pads, and to form a top seal ring trench coupled with the middle sealing ring; and a top metal layer, deposited on the top insulating layer to start forming contacts by filling the feedthrough holes (242-1, 242-2), and deposited to start forming a top sealing ring by filling the top seal ring trench; and patterned to complete forming contacts (254-1, 254-2) through the feedthrough holes (242-1, 242-2), to form a separate barrier layer, and to complete forming the top sealing ring. a bottom metal layer; a bottom insulating layer, deposited on the bottom metal layer to insulate the bottom metal layer, and patterned to form a bottom seal ring trench; an interconnect metal layer, deposited on the bottom insulating layer, and deposited to fill the bottom seal ring trench to form a bottom sealing ring; and patterned to form electrical connections between contact pads (234-1, 234-2), and to form a middle sealing ring around the electrical connections, coupled with the bottom sealing ring; a patterned top insulating layer, deposited on the interconnect metal layer to insulate the interconnect metal layer, and to separate the middle sealing ring from the interconnect metal layer; and patterned to form feedthrough holes (242-1, 242-2) for the contact pads, and to form a top seal ring trench coupled with the middle sealing ring; and a top metal layer, deposited on the top insulating layer to start forming contacts by filling the feedthrough holes (242-1, 242-2), and deposited to start forming a top sealing ring by filling the top seal ring trench; and patterned to complete forming contacts (254-1, 254-2) through the feedthrough holes (242-1, 242-2), to form a separate barrier layer, and to complete forming the top sealing ring.