A thermal head, comprising: a head base comprising a substrate; a heat storage layer located on a first surface of the substrate along a longitudinal direction of the substrate; a heat generating unit located on the heat storage layer being constituted by a plurality of elements arranged along the longitudinal direction of the substrate; a plurality of individual electrodes located side by side on one side of the heat generating unit on the first surface side of the substrate, being individually connected to the elements of the heat generating unit one by one; and a common electrode located on the first surface of the substrate so as to surround the remaining three sides of the heat generating unit, being commonly connected to all of the elements of the heat generating unit; a wiring board located adjacent to the head base; a heat dissipation plate located on a second surface side of the substrate, and on a second surface side of the wiring board; a plurality of recessed portions located between the substrate and the wiring board; a contact portion located between adjacent recessed portions of the plurality of recessed portions, the contact portion being configured to come into contact with the substrate and the wiring board; a plurality of drive ICs located on a first surface of the wiring board to face a corresponding each recessed portion of the plurality of recessed portions; a plurality of wire members located across the plurality of recessed portions, the plurality of wire members being configured to electrically connect the substrate and the plurality of drive ICs; and a resin member configured to seal the plurality of wire members and the plurality of drive ICs. a head base comprising a substrate; a heat storage layer located on a first surface of the substrate along a longitudinal direction of the substrate; a heat generating unit located on the heat storage layer being constituted by a plurality of elements arranged along the longitudinal direction of the substrate; a plurality of individual electrodes located side by side on one side of the heat generating unit on the first surface side of the substrate, being individually connected to the elements of the heat generating unit one by one; and a common electrode located on the first surface of the substrate so as to surround the remaining three sides of the heat generating unit, being commonly connected to all of the elements of the heat generating unit; a substrate; a heat storage layer located on a first surface of the substrate along a longitudinal direction of the substrate; a heat generating unit located on the heat storage layer being constituted by a plurality of elements arranged along the longitudinal direction of the substrate; a plurality of individual electrodes located side by side on one side of the heat generating unit on the first surface side of the substrate, being individually connected to the elements of the heat generating unit one by one; and a common electrode located on the first surface of the substrate so as to surround the remaining three sides of the heat generating unit, being commonly connected to all of the elements of the heat generating unit; a wiring board located adjacent to the head base; a heat dissipation plate located on a second surface side of the substrate, and on a second surface side of the wiring board; a plurality of recessed portions located between the substrate and the wiring board; a contact portion located between adjacent recessed portions of the plurality of recessed portions, the contact portion being configured to come into contact with the substrate and the wiring board; a plurality of drive ICs located on a first surface of the wiring board to face a corresponding each recessed portion of the plurality of recessed portions; a plurality of wire members located across the plurality of recessed portions, the plurality of wire members being configured to electrically connect the substrate and the plurality of drive ICs; and a resin member configured to seal the plurality of wire members and the plurality of drive ICs.