Method of releasing a plate made of brittle material, which is able to withstand elastic deformation until the point of failure, from a support arrangement using a peeling arrangement, wherein the thickness of the plate is more than 100 times smaller than its width or length, and is supported by the support arrangement substantially along its surface, wherein the peeling arrangement comprises an abutting arrangement, having an abutting surface (C, C1, C2), for abutting the plate, wherein the abutting surface (C, C1, C2) is a curved shape that is rolled along the plate or is automatically and/or manually curved from straight into a curved shape, the method comprising: the abutting arrangement sucking or adhering the plate to its abutting surface (C, C1, C2) at the opposite side of the plate to the support arrangement, exerting a pulling force to a first area of the plate from an area of the abutting surface (C, C1, C2) to which the first area of the plate is being sucked or adhered such that the first area is moved in a direction away from the support arrangement, while a second area of the plate adjacent the first area abuts the support arrangement, subsequently exerting a pulling force to the second area from an area of the abutting surface (C, C1, C2) to which the second area of the plate is being sucked or adhered such that the second area is moved in a direction away from the support arrangement, while a third area of the plate adjacent the second area abuts the support arrangement, and in the same manner the abutting arrangement moving sequentially further areas (Pn) in a direction away from the support arrangement, while respective adjacent areas (Pn+1) abut the support arrangement, wherein the abutting arrangement sequentially moves said areas in a direction away from the support arrangement in accordance with the curved shape of the abutting surface (C, C1, C2) such that the plate is peeled from the support arrangement. the abutting arrangement sucking or adhering the plate to its abutting surface (C, C1, C2) at the opposite side of the plate to the support arrangement, exerting a pulling force to a first area of the plate from an area of the abutting surface (C, C1, C2) to which the first area of the plate is being sucked or adhered such that the first area is moved in a direction away from the support arrangement, while a second area of the plate adjacent the first area abuts the support arrangement, subsequently exerting a pulling force to the second area from an area of the abutting surface (C, C1, C2) to which the second area of the plate is being sucked or adhered such that the second area is moved in a direction away from the support arrangement, while a third area of the plate adjacent the second area abuts the support arrangement, and in the same manner the abutting arrangement moving sequentially further areas (Pn) in a direction away from the support arrangement, while respective adjacent areas (Pn+1) abut the support arrangement, wherein the abutting arrangement sequentially moves said areas in a direction away from the support arrangement in accordance with the curved shape of the abutting surface (C, C1, C2) such that the plate is peeled from the support arrangement.