Sound transducer assembly with a first substrate, a first and second MEMS sound transducer (21, 31) for generating and/or detecting sound waves in the audible wavelength spectrum, which each comprises a cavity (41, 42), and an ASIC electrically connected to the first MEMS sound transducer, wherein the two cavities (41, 42) of the MEMS sound transducers (21, 31) are separated from one another by an intermediate wall of the first substrate, characterized in that the ASIC is embedded in the first substrate; the first MEMS sound transducer is arranged on a second substrate such that the cavity of the first MEMS sound transducer is at least partially formed in the second substrate, wherein a hollow space of the second substrate forming said cavity is laterally surrounded or delimited by walls of the second substrate while being closed upwardly by a membrane of the first MEMS sound transducer;, the first substrate and the second substrate are connected to one another in such a manner that the ASIC of the first substrate and the first MEMS sound transducer of the second substrate are electrically coupled to one another; the second MEMS sound transducer is arranged on a third substrate, that the cavity of the second MEMS sound transducer is formed at least partially in the third substrate, wherein a hollow space of the third substrate forming said cavity is laterally surrounded or delimited by walls of the third substrate and being closed downwardly by a membrane of the second MEMS sound transducer; the first substrate and the third substrate are connected to one another in an electrically conductive manner; the first substrate is arranged between the second substrate and the third substrate, and the substrates (10, 20, 30) are each in the form of a circuit board or PCB (printed circuit board). with a first substrate, a first and second MEMS sound transducer (21, 31) for generating and/or detecting sound waves in the audible wavelength spectrum, which each comprises a cavity (41, 42), and an ASIC electrically connected to the first MEMS sound transducer, wherein the two cavities (41, 42) of the MEMS sound transducers (21, 31) are separated from one another by an intermediate wall of the first substrate, characterized in that the ASIC is embedded in the first substrate; the first MEMS sound transducer is arranged on a second substrate such that the cavity of the first MEMS sound transducer is at least partially formed in the second substrate, wherein a hollow space of the second substrate forming said cavity is laterally surrounded or delimited by walls of the second substrate while being closed upwardly by a membrane of the first MEMS sound transducer;, the first substrate and the second substrate are connected to one another in such a manner that the ASIC of the first substrate and the first MEMS sound transducer of the second substrate are electrically coupled to one another; the second MEMS sound transducer is arranged on a third substrate, that the cavity of the second MEMS sound transducer is formed at least partially in the third substrate, wherein a hollow space of the third substrate forming said cavity is laterally surrounded or delimited by walls of the third substrate and being closed downwardly by a membrane of the second MEMS sound transducer; the first substrate and the third substrate are connected to one another in an electrically conductive manner; the first substrate is arranged between the second substrate and the third substrate, and the substrates (10, 20, 30) are each in the form of a circuit board or PCB (printed circuit board).