A method for preparing a surface-mounted RGB-LED packaging module, comprising the following steps: step 1: cladding two sides of a plate with copper to form a substrate, drilling holes through the substrate, and forming multiple groups of metal vias penetrating up and down the substrate to electrically connect the front and reverse sides of the substrate; step 2: etching multiple groups of upper pads on the front side of the substrate corresponding to the multiple groups of metal vias, etching multiple groups of lower pads on the reverse side of the substrate corresponding to the multiple groups of metal vias, and etching electroplating circuits on the substrate to electrically connect all the upper pads with all the lower pads on the substrate through the metal vias; step 3: electroplating the substrate to fill and seal the metal vias; step 4: die-bonding a group of RGB LED chips onto any one of the upper pads of each group of upper pads of the multiple groups of upper pads, and welding wires from the RGB LED chips to the other upper pa of the each group of upper pads of the multiple groups of upper pads to form multiple light emitting units on the substrate; and step 5: cutting the substrate according to the number of the light emitting units as needed to form packaging modules having a plurality of light emitting units and cutting off the electroplating circuits during the cutting so that all the upper pads of each light emitting unit of the plurality of light emitting units are independent from each other and all the lower pads of the each light emitting unit of the plurality of light emitting units are independent from each other. step 1: cladding two sides of a plate with copper to form a substrate, drilling holes through the substrate, and forming multiple groups of metal vias penetrating up and down the substrate to electrically connect the front and reverse sides of the substrate; step 2: etching multiple groups of upper pads on the front side of the substrate corresponding to the multiple groups of metal vias, etching multiple groups of lower pads on the reverse side of the substrate corresponding to the multiple groups of metal vias, and etching electroplating circuits on the substrate to electrically connect all the upper pads with all the lower pads on the substrate through the metal vias; step 3: electroplating the substrate to fill and seal the metal vias; step 4: die-bonding a group of RGB LED chips onto any one of the upper pads of each group of upper pads of the multiple groups of upper pads, and welding wires from the RGB LED chips to the other upper pa of the each group of upper pads of the multiple groups of upper pads to form multiple light emitting units on the substrate; and step 5: cutting the substrate according to the number of the light emitting units as needed to form packaging modules having a plurality of light emitting units and cutting off the electroplating circuits during the cutting so that all the upper pads of each light emitting unit of the plurality of light emitting units are independent from each other and all the lower pads of the each light emitting unit of the plurality of light emitting units are independent from each other.