Method for forming solder joints (8a'-8f') between components (1a-1f) to be soldered and a substrate that has an electrically non-conductive insulation layer and a metal layer arranged on the insulation layer and structured to form conductor tracks (4a-4f), wherein the components (1a-1f) are arranged on the metal layer and a solder (8a-8f) is arranged in each case between the components (1a-1f) and the metal layer, said method having the following method steps: a) carrying out a relative movement of the substrate with respect to an energizable winding such that, after the relative movement has been carried out, a central region of a winding surface enclosed by the winding is arranged in alignment in the normal direction of the substrate with a first component to be soldered, b) heating the solder arranged between the first component and the metal layer by induction of eddy currents in the region (Ba) of the first component by means of a magnetic field generated by the winding, and contactlessly measuring a temperature in the region (Ba) of the first component by means of a pyrometer, wherein the measurement is effected in the normal direction of the substrate in alignment with the region (Ba) of the first component, in particular in alignment with the first component, on a surface region of the substrate arranged on a side of the substrate that is remote from the first component, wherein, if the temperature in the region (Ba) of the first component exceeds a limit temperature, which is at least as high as the liquidus temperature of the solder, a relative movement of the substrate with respect to the winding is carried out, immediately or after a given waiting time, such that, after the relative movement has been carried out, the central region of the winding surface is arranged in alignment in the normal direction of the substrate with a second component to be soldered, c) heating the solder arranged between the second component and the metal layer by induction of eddy currents in the region of the second component by means of a magnetic field generated by the winding, and contactlessly measuring the temperature by means of a pyrometer in the region of the second component, wherein the measurement is effected in the normal direction of the substrate in alignment with the region (Bb) of the second component, in particular in alignment with the second component, on a surface region of the substrate arranged on a side of the substrate that is remote from the second component, wherein, if the temperature in the region of the second component (Bb) exceeds the limit temperature, heating of the solder by induction of eddy currents in the region (Bb) of the second component by means of a magnetic field generated by the winding is ended immediately or after a given waiting time. a) carrying out a relative movement of the substrate with respect to an energizable winding such that, after the relative movement has been carried out, a central region of a winding surface enclosed by the winding is arranged in alignment in the normal direction of the substrate with a first component to be soldered, b) heating the solder arranged between the first component and the metal layer by induction of eddy currents in the region (Ba) of the first component by means of a magnetic field generated by the winding, and contactlessly measuring a temperature in the region (Ba) of the first component by means of a pyrometer, wherein the measurement is effected in the normal direction of the substrate in alignment with the region (Ba) of the first component, in particular in alignment with the first component, on a surface region of the substrate arranged on a side of the substrate that is remote from the first component, wherein, if the temperature in the region (Ba) of the first component exceeds a limit temperature, which is at least as high as the liquidus temperature of the solder, a relative movement of the substrate with respect to the winding is carried out, immediately or after a given waiting time, such that, after the relative movement has been carried out, the central region of the winding surface is arranged in alignment in the normal direction of the substrate with a second component to be soldered, c) heating the solder arranged between the second component and the metal layer by induction of eddy currents in the region of the second component by means of a magnetic field generated by the winding, and contactlessly measuring the temperature by means of a pyrometer in the region of the second component, wherein the measurement is effected in the normal direction of the substrate in alignment with the region (Bb) of the second component, in particular in alignment with the second component, on a surface region of the substrate arranged on a side of the substrate that is remote from the second component, wherein, if the temperature in the region of the second component (Bb) exceeds the limit temperature, heating of the solder by induction of eddy currents in the region (Bb) of the second component by means of a magnetic field generated by the winding is ended immediately or after a given waiting time.