An imaging system comprising: an image sensor comprising: an outer package having an outer surface; and a plurality of solder balls (108a-108d) configured as a two-dimensional ball grid array integrated with the outer surface; and a circuit board connector comprising: a first planar surface; a second planar surface opposite the first planar surface; and a side surface facing the outer surface that intersects the ball grid array; a plurality of electrical connections that electrically connect a plurality of elongate conductive members (128a-128d) of electrical cabling with the plurality of solder balls of the ball grid array, the plurality of electrical connections comprising: a plurality of first connection ends (130a-130d) disposed on the first planar surface and the second planar surface, each first connection end disposed adjacent to, electrically connected to, and bonded to one of the plurality of solder balls; and a plurality of second connection ends (132a-132d) disposed on at least one of the first planar surface or the second planar surface, each second connection end electrically connected and bonded to a respective one of the plurality of elongate conductive members of the electrical cabling, wherein at least one of the first planar surface or the second planar surface forms an angle with the outer surface of the outer package that is greater than zero degrees and less than 180 degrees. an image sensor comprising: an outer package having an outer surface; and a plurality of solder balls (108a-108d) configured as a two-dimensional ball grid array integrated with the outer surface; and an outer package having an outer surface; and a plurality of solder balls (108a-108d) configured as a two-dimensional ball grid array integrated with the outer surface; and a circuit board connector comprising: a first planar surface; a second planar surface opposite the first planar surface; and a side surface facing the outer surface that intersects the ball grid array; a plurality of electrical connections that electrically connect a plurality of elongate conductive members (128a-128d) of electrical cabling with the plurality of solder balls of the ball grid array, the plurality of electrical connections comprising: a plurality of first connection ends (130a-130d) disposed on the first planar surface and the second planar surface, each first connection end disposed adjacent to, electrically connected to, and bonded to one of the plurality of solder balls; and a plurality of second connection ends (132a-132d) disposed on at least one of the first planar surface or the second planar surface, each second connection end electrically connected and bonded to a respective one of the plurality of elongate conductive members of the electrical cabling, wherein at least one of the first planar surface or the second planar surface forms an angle with the outer surface of the outer package that is greater than zero degrees and less than 180 degrees. a first planar surface; a second planar surface opposite the first planar surface; and a side surface facing the outer surface that intersects the ball grid array; a plurality of electrical connections that electrically connect a plurality of elongate conductive members (128a-128d) of electrical cabling with the plurality of solder balls of the ball grid array, the plurality of electrical connections comprising: a plurality of first connection ends (130a-130d) disposed on the first planar surface and the second planar surface, each first connection end disposed adjacent to, electrically connected to, and bonded to one of the plurality of solder balls; and a plurality of second connection ends (132a-132d) disposed on at least one of the first planar surface or the second planar surface, each second connection end electrically connected and bonded to a respective one of the plurality of elongate conductive members of the electrical cabling, a plurality of first connection ends (130a-130d) disposed on the first planar surface and the second planar surface, each first connection end disposed adjacent to, electrically connected to, and bonded to one of the plurality of solder balls; and a plurality of second connection ends (132a-132d) disposed on at least one of the first planar surface or the second planar surface, each second connection end electrically connected and bonded to a respective one of the plurality of elongate conductive members of the electrical cabling, wherein at least one of the first planar surface or the second planar surface forms an angle with the outer surface of the outer package that is greater than zero degrees and less than 180 degrees.