A power supply device comprising: a substrate on which an electric component is mounted; a chassis having a chassis surface to be a surface facing one surface of the substrate; and a chassis-side resin part to be a cured insulating resin to be placed between the one surface of the substrate and the chassis surface so as to be connected to the one surface and the chassis surface, the cured insulating resin having a thermal conductivity between 1 W/mK and 10 W/mK inclusive, wherein the chassis includes a raised part (14d, 14-1) raised from the chassis surface toward the one surface in the chassis-side resin part and including an end part with respect to a raising direction being in contact with the one surface, wherein the electric component is placed on the other surface that is on a back side of the one surface so that the substrate is interposed between the electric component and an end surface of the end part of the raised part (14d, 14-1) and is kept so as to have a potential differing from a potential of the chassis, wherein the substrate includes a plurality of filled through-holes which are formed through the substrate from the one surface to the other surface, the plurality of filled through-holes being filled with a heat transfer material, wherein one end part of the heat transfer material appears on the one surface and the other end part of the heat transfer material appears on the other surface, wherein the other end part of each of the plurality of filled through-holes appearing on the other surface is covered with the electric component, wherein the chassis-side resin part is connected to the one end part of each of the filled through-holes appearing on the one surface, wherein the end surface of the end part of the raised part (14d, 14-1) is in contact with a nonconductive region that is a region in the one surface where the one end part of each of the filled through-holes does not appear and that is a region where the substrate has no electrical conductivity, and wherein a potential of the raised part (14d, 14-1) and a potential of the plurality of filled through-holes are kept different. a substrate on which an electric component is mounted; a chassis having a chassis surface to be a surface facing one surface of the substrate; and a chassis-side resin part to be a cured insulating resin to be placed between the one surface of the substrate and the chassis surface so as to be connected to the one surface and the chassis surface, the cured insulating resin having a thermal conductivity between 1 W/mK and 10 W/mK inclusive, wherein the chassis includes a raised part (14d, 14-1) raised from the chassis surface toward the one surface in the chassis-side resin part and including an end part with respect to a raising direction being in contact with the one surface, wherein the electric component is placed on the other surface that is on a back side of the one surface so that the substrate is interposed between the electric component and an end surface of the end part of the raised part (14d, 14-1) and is kept so as to have a potential differing from a potential of the chassis, wherein the substrate includes a plurality of filled through-holes which are formed through the substrate from the one surface to the other surface, the plurality of filled through-holes being filled with a heat transfer material, wherein one end part of the heat transfer material appears on the one surface and the other end part of the heat transfer material appears on the other surface, wherein the other end part of each of the plurality of filled through-holes appearing on the other surface is covered with the electric component, wherein the chassis-side resin part is connected to the one end part of each of the filled through-holes appearing on the one surface, wherein the end surface of the end part of the raised part (14d, 14-1) is in contact with a nonconductive region that is a region in the one surface where the one end part of each of the filled through-holes does not appear and that is a region where the substrate has no electrical conductivity, and wherein a potential of the raised part (14d, 14-1) and a potential of the plurality of filled through-holes are kept different.