An apparatus for inspecting a surface of a wafer by a three-dimensional wafer scanning process, the apparatus comprising: at least two thin line illuminators configured to direct thin line illumination to a target location on the surface of the wafer, wherein the at least two thin line illuminators are configured to simultaneously direct (a) an incident first beam of thin line illumination at a first angle of incidence to the target location on the surface of the wafer to produce a first response corresponding to specular reflection of the first beam of thin line illumination off of the surface of the wafer along an illumination response angle, and (b) an incident second beam of thin line illumination at a second angle of incidence to the target location on the surface of the wafer to produce a second response corresponding to non-specular reflection of the second beam of thin line illumination off of the surface wafer along the illumination response angle, such that the first response and the second response are superimposed upon reflection of the first beam of thin line illumination and the second beam of thin line illumination from the surface of the wafer; and an image capture device configured to capture, as a single view, the superimposed first response and second response, wherein the first angle of incidence, the second angle of incidence, and the illumination response angle are each defined relative to a normal axis to the surface of the wafer; wherein the first angle of incidence has a magnitude that matches the magnitude of the illumination response angle and the second angle of incidence has a magnitude that is significantly different from the magnitude of the illumination response angle; and wherein the image capture device comprises a 3D profile camera. at least two thin line illuminators configured to direct thin line illumination to a target location on the surface of the wafer, wherein the at least two thin line illuminators are configured to simultaneously direct (a) an incident first beam of thin line illumination at a first angle of incidence to the target location on the surface of the wafer to produce a first response corresponding to specular reflection of the first beam of thin line illumination off of the surface of the wafer along an illumination response angle, and (b) an incident second beam of thin line illumination at a second angle of incidence to the target location on the surface of the wafer to produce a second response corresponding to non-specular reflection of the second beam of thin line illumination off of the surface wafer along the illumination response angle, (a) an incident first beam of thin line illumination at a first angle of incidence to the target location on the surface of the wafer to produce a first response corresponding to specular reflection of the first beam of thin line illumination off of the surface of the wafer along an illumination response angle, and (b) an incident second beam of thin line illumination at a second angle of incidence to the target location on the surface of the wafer to produce a second response corresponding to non-specular reflection of the second beam of thin line illumination off of the surface wafer along the illumination response angle, such that the first response and the second response are superimposed upon reflection of the first beam of thin line illumination and the second beam of thin line illumination from the surface of the wafer; and an image capture device configured to capture, as a single view, the superimposed first response and second response, wherein the first angle of incidence, the second angle of incidence, and the illumination response angle are each defined relative to a normal axis to the surface of the wafer; wherein the first angle of incidence has a magnitude that matches the magnitude of the illumination response angle and the second angle of incidence has a magnitude that is significantly different from the magnitude of the illumination response angle; and wherein the image capture device comprises a 3D profile camera.