A microelectronic package comprising: (a) a first microelectronic element; (b) a package substrate having upper and lower surfaces extending in horizontal directions and edges extending between the upper and lower surfaces, (c) electrically conductive elements (62, 64) on the package substrate, the electrically conductive elements including bottom terminals exposed at the lower surface of the package substrate, the microelectronic element being disposed over the upper surface of the package substrate, the microelectronic element being electrically connected to at least some of the conductive elements (62, 64) on the package substrate; (d) a first dielectric mass covering the microelectronic element and at least part of the upper surface of the package substrate, the first dielectric mass defining a top surface remote from the package substrate facing away from the package substrate, at least a part of the top surface extending over the microelectronic element, the first dielectric mass also defining a first edge surface extending downwardly from a top border adjacent the top surface of the first dielectric mass to a bottom border adjacent the package substrate and inside the edges of the package substrate, the first dielectric mass further defining an upwardly-facing first flange surface extending away from the bottom border of the first edge surface in a horizontal direction adjacent the package substrate, the first flange surface being disposed at a vertical distance from the package substrate less than a vertical distance between the package substrate and the top surface; (e) a plurality of top terminals exposed at the top surface of the first dielectric mass; and (f) a plurality of first traces extending from the top terminals along the top surface and extending along the first edge surface, the first traces having bottom portions extending along the first flange surface, the bottom portions being electrically connected to the conductive elements (62, 64) of the package substrate by means of electrically conductive connectors extending through the first flange surface of the first dielectric mass. (a) a first microelectronic element; (b) a package substrate having upper and lower surfaces extending in horizontal directions and edges extending between the upper and lower surfaces, (c) electrically conductive elements (62, 64) on the package substrate, the electrically conductive elements including bottom terminals exposed at the lower surface of the package substrate, the microelectronic element being disposed over the upper surface of the package substrate, the microelectronic element being electrically connected to at least some of the conductive elements (62, 64) on the package substrate; (d) a first dielectric mass covering the microelectronic element and at least part of the upper surface of the package substrate, the first dielectric mass defining a top surface remote from the package substrate facing away from the package substrate, at least a part of the top surface extending over the microelectronic element, the first dielectric mass also defining a first edge surface extending downwardly from a top border adjacent the top surface of the first dielectric mass to a bottom border adjacent the package substrate and inside the edges of the package substrate, the first dielectric mass further defining an upwardly-facing first flange surface extending away from the bottom border of the first edge surface in a horizontal direction adjacent the package substrate, the first flange surface being disposed at a vertical distance from the package substrate less than a vertical distance between the package substrate and the top surface; (e) a plurality of top terminals exposed at the top surface of the first dielectric mass; and (f) a plurality of first traces extending from the top terminals along the top surface and extending along the first edge surface, the first traces having bottom portions extending along the first flange surface, the bottom portions being electrically connected to the conductive elements (62, 64) of the package substrate by means of electrically conductive connectors extending through the first flange surface of the first dielectric mass.