A method for manufacturing an electrolytic copper foil, the method comprising: allowing a current to flow between an anode plate and a rotational cathode drum to form a copper film on the rotational cathode drum, the anode plate and rotational cathode drum spaced apart from each other in an electrolytic solution contained in an electrolytic bath, the electrolytic solution comprising 50 to 100 g/L of a copper ion, 50 to 150 g/L of sulfuric acid, 50 ppm or less of a chlorine ion and an organic additive which is gelatin, hydroxyethyl cellulose, organic sulfide, organic nitride, a thiourea compound or a mixture of two or more thereof; dipping the copper film in an anticorrosion solution; and taking the copper film out of the anticorrosion solution, wherein the copper film is guided by a guide roll disposed in the anticorrosion solution when the copper film is dipped in and taken out of the anticorrosion solution, the method characterized in that: the anode plate comprises first and second anode plates (31, 32) electrically insulated from each other, the forming the copper film comprises forming a seed layer by allowing a current to flow between the first anode plate and the rotational cathode drum, and then growing the seed layer by allowing a current to flow between the second anode plate and the rotational cathode drum, a current density provided by the first anode plate is 1.5 times or more higher than a current density provided by the second anode plate, and the method further comprises, after taking the copper film out of the anticorrosion solution, spraying an anticorrosion solution onto a surface of the copper film which was in contact with the guide roll during the dipping process. allowing a current to flow between an anode plate and a rotational cathode drum to form a copper film on the rotational cathode drum, the anode plate and rotational cathode drum spaced apart from each other in an electrolytic solution contained in an electrolytic bath, the electrolytic solution comprising 50 to 100 g/L of a copper ion, 50 to 150 g/L of sulfuric acid, 50 ppm or less of a chlorine ion and an organic additive which is gelatin, hydroxyethyl cellulose, organic sulfide, organic nitride, a thiourea compound or a mixture of two or more thereof; dipping the copper film in an anticorrosion solution; and taking the copper film out of the anticorrosion solution, wherein the copper film is guided by a guide roll disposed in the anticorrosion solution when the copper film is dipped in and taken out of the anticorrosion solution, the method characterized in that: the anode plate comprises first and second anode plates (31, 32) electrically insulated from each other, the forming the copper film comprises forming a seed layer by allowing a current to flow between the first anode plate and the rotational cathode drum, and then growing the seed layer by allowing a current to flow between the second anode plate and the rotational cathode drum, a current density provided by the first anode plate is 1.5 times or more higher than a current density provided by the second anode plate, and the method further comprises, after taking the copper film out of the anticorrosion solution, spraying an anticorrosion solution onto a surface of the copper film which was in contact with the guide roll during the dipping process. the anode plate comprises first and second anode plates (31, 32) electrically insulated from each other, the forming the copper film comprises forming a seed layer by allowing a current to flow between the first anode plate and the rotational cathode drum, and then growing the seed layer by allowing a current to flow between the second anode plate and the rotational cathode drum, a current density provided by the first anode plate is 1.5 times or more higher than a current density provided by the second anode plate, and the method further comprises, after taking the copper film out of the anticorrosion solution, spraying an anticorrosion solution onto a surface of the copper film which was in contact with the guide roll during the dipping process.