A differential pressure sensor comprising: a header with a first end, a second end, and a side wall and an interior cavity with a central hole extending from the second end to the interior cavity; a first isolator plate with a central hole attached to the first end of the header; a first isolator diaphragm attached to the first isolator plate; a sensor stack in the interior cavity in the header; a second isolator plate with a central hole attached to the second end of the header; a second isolator diaphragm attached to the second isolator plate; characterized by a ULTEM polytherimid chamber positioned in the interior cavity of the header; a ULTEM amorphous thermoplastic polytherimid resin spacer with a central hole over the ULTEM polytherimid chamber; wherein the sensor stack in the interior cavity in the header comprises: a MEMS pressure sensor positioned within the ULTEM polytherimid chamber the MEMS pressure sensor comprising a silicon diaphragm with a top surface and a bottom surface attached to a silicon backup wafer with a central hole; a first pedestal with a central hole; and a second pedestal with a central hole attached to a bottom of the interior cavity in the header; wherein the central holes of the second isolator plate, the header, the second pedestal, the first pedestal, and the silicon backup wafer are aligned such that the bottom surface of the silicon diaphragm has a direct line of sight and is fluidly connected to the second isolator diaphragm and wherein the central holes of the ULTEM amorphous thermoplastic polytherimid resin spacer and the first isolator plate are aligned such that the top surface of the diaphragm has a direct line of sight and is fluidly connected to the first isolator diaphragm; and sensor elements on the diaphragm configured to provide, via sensor circuitry, connected to the sensor to provide an indication of deflection of the diaphragm due to pressure differences between the first and second pressures (P1, P2) applied to the first and second isolator diaphragms (36, 42) respectively, wherein electrical connections and fill fluid connections to the differential pressure sensor are made through radial connections in the wall of the header. a header with a first end, a second end, and a side wall and an interior cavity with a central hole extending from the second end to the interior cavity; a first isolator plate with a central hole attached to the first end of the header; a first isolator diaphragm attached to the first isolator plate; a sensor stack in the interior cavity in the header; a second isolator plate with a central hole attached to the second end of the header; a second isolator diaphragm attached to the second isolator plate; characterized by a ULTEM polytherimid chamber positioned in the interior cavity of the header; a ULTEM amorphous thermoplastic polytherimid resin spacer with a central hole over the ULTEM polytherimid chamber; wherein the sensor stack in the interior cavity in the header comprises: a MEMS pressure sensor positioned within the ULTEM polytherimid chamber the MEMS pressure sensor comprising a silicon diaphragm with a top surface and a bottom surface attached to a silicon backup wafer with a central hole; a first pedestal with a central hole; and a second pedestal with a central hole attached to a bottom of the interior cavity in the header; wherein the central holes of the second isolator plate, the header, the second pedestal, the first pedestal, and the silicon backup wafer are aligned such that the bottom surface of the silicon diaphragm has a direct line of sight and is fluidly connected to the second isolator diaphragm and wherein the central holes of the ULTEM amorphous thermoplastic polytherimid resin spacer and the first isolator plate are aligned such that the top surface of the diaphragm has a direct line of sight and is fluidly connected to the first isolator diaphragm; and a MEMS pressure sensor positioned within the ULTEM polytherimid chamber the MEMS pressure sensor comprising a silicon diaphragm with a top surface and a bottom surface attached to a silicon backup wafer with a central hole; a first pedestal with a central hole; and a second pedestal with a central hole attached to a bottom of the interior cavity in the header; wherein the central holes of the second isolator plate, the header, the second pedestal, the first pedestal, and the silicon backup wafer are aligned such that the bottom surface of the silicon diaphragm has a direct line of sight and is fluidly connected to the second isolator diaphragm and wherein the central holes of the ULTEM amorphous thermoplastic polytherimid resin spacer and the first isolator plate are aligned such that the top surface of the diaphragm has a direct line of sight and is fluidly connected to the first isolator diaphragm; and sensor elements on the diaphragm configured to provide, via sensor circuitry, connected to the sensor to provide an indication of deflection of the diaphragm due to pressure differences between the first and second pressures (P1, P2) applied to the first and second isolator diaphragms (36, 42) respectively, wherein electrical connections and fill fluid connections to the differential pressure sensor are made through radial connections in the wall of the header.