Method for producing an LED luminaire, in which method at least one LED strip is potted with at least one potting compound on all sides in order to form a housing, wherein the LED strip comprises a flexible circuit board width - arranged thereon - chip light-emitting diodes, conductor tracks and electronic components, characterized in that a. in a first method step at least one flexible housing shell accommodating an LED strip in a positively locking manner at the top-side electronic components is moulded, i. wherein an LED strip is inserted in a positively locking manner by its underside into a guide groove having two parallel groove walls, said guide groove corresponding to the length of the LED strip to be potted and being formed in a negative mould of the housing shell in a flexible mould cavity, and the flexible mould cavity is filled with a flexibly curing potting compound in a surface-flush manner in order to form a self-levelled, planar, flat surface forming the light exit surface of the housing, said potting compound attaching in a positively locking manner to the top side of the inserted LED strip, said top side having the electronic components, ii. and, after the curing of the potting compound, the housing shell together with the LED strip encapsulated by moulding on the top side is removed from the flexible mould cavity, b. and in a second method step the moulded flexible housing shell is filled with a flexible potting compound up to its upper edge defined in the first method step, said potting compound attaching to the LED strip in a positively locking manner laterally and on the underside during the filling process, and in that during the process of introducing the potting compound into the negative mould or the flexible mould cavity in the first method step, the potting compound runs into a trench externally surrounding the groove base and the two groove walls, the trench bottom of said trench lying deeper in the mould cavity than the groove base, on which the LED strip lies, and the trench bottom defines the upper edge of the housing shell. a. in a first method step at least one flexible housing shell accommodating an LED strip in a positively locking manner at the top-side electronic components is moulded, i. wherein an LED strip is inserted in a positively locking manner by its underside into a guide groove having two parallel groove walls, said guide groove corresponding to the length of the LED strip to be potted and being formed in a negative mould of the housing shell in a flexible mould cavity, and the flexible mould cavity is filled with a flexibly curing potting compound in a surface-flush manner in order to form a self-levelled, planar, flat surface forming the light exit surface of the housing, said potting compound attaching in a positively locking manner to the top side of the inserted LED strip, said top side having the electronic components, ii. and, after the curing of the potting compound, the housing shell together with the LED strip encapsulated by moulding on the top side is removed from the flexible mould cavity, i. wherein an LED strip is inserted in a positively locking manner by its underside into a guide groove having two parallel groove walls, said guide groove corresponding to the length of the LED strip to be potted and being formed in a negative mould of the housing shell in a flexible mould cavity, and the flexible mould cavity is filled with a flexibly curing potting compound in a surface-flush manner in order to form a self-levelled, planar, flat surface forming the light exit surface of the housing, said potting compound attaching in a positively locking manner to the top side of the inserted LED strip, said top side having the electronic components, ii. and, after the curing of the potting compound, the housing shell together with the LED strip encapsulated by moulding on the top side is removed from the flexible mould cavity, b. and in a second method step the moulded flexible housing shell is filled with a flexible potting compound up to its upper edge defined in the first method step, said potting compound attaching to the LED strip in a positively locking manner laterally and on the underside during the filling process,