A modular system, comprising: one or more silicon carbide semiconductor power devices; a first power supply circuit board receiving power from a power source, configured to provide power to a first gate driver circuit board via one or more connectors, and a second power supply circuit board receiving power from a power source, configured to provide power to a second gate driver circuit board via one or more connectors, wherein the first and second gate driver circuit boards each comprise one or more gate driver integrated circuits and wherein the first and second power supply circuit boards each comprise one or more power supplies and one or more isolation transformers configured to isolate the one or more gate driver integrated circuits of the gate driver board from the one or more power supplies; each gate driver circuit of the first and second gate driver circuit boards, is coupled to one of the one or more silicon carbide semiconductor power devices and configured to provide current to drive a gate of the respective silicon carbide semiconductor power device, wherein one or more signal paths of the first gate driver circuit board are coupled to one or more signal paths of the first power supply circuit board via at least one of the one or more connectors and one or more signal paths of the second gate driver circuit board are coupled to one or more signal paths of the second power supply circuit board via at least one of the one or more connectors, and wherein the first gate driver circuit board is separated from the first power supply circuit board and the second gate driver circuit board is separated from the second power supply circuit board; an interconnect circuit board, coupled to the first gate driver circuit board, wherein the interconnect circuit board is configured to couple the one or more signal paths of the first gate driver circuit board to one or more signal paths of a second gate driver circuit board and configured to provide connections between the first and second power supply boards and the first and second gate drive boards via the respective one or more connectors. one or more silicon carbide semiconductor power devices; a first power supply circuit board receiving power from a power source, configured to provide power to a first gate driver circuit board via one or more connectors, and a second power supply circuit board receiving power from a power source, configured to provide power to a second gate driver circuit board via one or more connectors, wherein the first and second gate driver circuit boards each comprise one or more gate driver integrated circuits and wherein the first and second power supply circuit boards each comprise one or more power supplies and one or more isolation transformers configured to isolate the one or more gate driver integrated circuits of the gate driver board from the one or more power supplies; each gate driver circuit of the first and second gate driver circuit boards, is coupled to one of the one or more silicon carbide semiconductor power devices and configured to provide current to drive a gate of the respective silicon carbide semiconductor power device, wherein one or more signal paths of the first gate driver circuit board are coupled to one or more signal paths of the first power supply circuit board via at least one of the one or more connectors and one or more signal paths of the second gate driver circuit board are coupled to one or more signal paths of the second power supply circuit board via at least one of the one or more connectors, and wherein the first gate driver circuit board is separated from the first power supply circuit board and the second gate driver circuit board is separated from the second power supply circuit board; an interconnect circuit board, coupled to the first gate driver circuit board, wherein the interconnect circuit board is configured to couple the one or more signal paths of the first gate driver circuit board to one or more signal paths of a second gate driver circuit board and configured to provide connections between the first and second power supply boards and the first and second gate drive boards via the respective one or more connectors.