A vehicle air-conditioning box, comprising: a main air duct, an air-conditioning air duct, a blower, a first heat dissipation structure, and a semiconductor refrigeration chip, wherein the main air duct is in communication with the air-conditioning air duct; the blower, the first heat dissipation structure, and the semiconductor refrigeration chip are disposed in the main air duct; and a first end of the semiconductor refrigeration chip is in contact with the first heat dissipation structure, the vehicle air-conditioning box further comprises a second heat dissipation structure, a heat conducting component, and a first electric control air door, wherein a second end of the semiconductor refrigeration chip is connected to the second heat dissipation structure through the heat conducting component, characterized in that a first air communication opening and a second air communication opening are disposed between the main air duct and the air-conditioning air duct, the first air communication opening is located between a first air duct section of the main air duct and the air-conditioning air duct, and the second air communication opening is located between a second air duct section of the main air duct and the air-conditioning air duct; the first electric control air door is disposed at the first air communication opening, when the first electric control air door is located at a first position, the first electric control air door blocks the first air duct section from the second air duct section, and the first air duct section is in communication with the air-conditioning air duct, and when the first electric control air door is located at a second position, the first electric control air door blocks the first air duct section from the air-conditioning air duct, and the first air duct section is in communication with the second air duct section; and the second heat dissipation structure is disposed in the second air duct section. the main air duct is in communication with the air-conditioning air duct; the blower, the first heat dissipation structure, and the semiconductor refrigeration chip are disposed in the main air duct; and a first end of the semiconductor refrigeration chip is in contact with the first heat dissipation structure, the vehicle air-conditioning box further comprises a second heat dissipation structure, a heat conducting component, and a first electric control air door, wherein a second end of the semiconductor refrigeration chip is connected to the second heat dissipation structure through the heat conducting component, characterized in that a first air communication opening and a second air communication opening are disposed between the main air duct and the air-conditioning air duct, the first air communication opening is located between a first air duct section of the main air duct and the air-conditioning air duct, and the second air communication opening is located between a second air duct section of the main air duct and the air-conditioning air duct; the first electric control air door is disposed at the first air communication opening, when the first electric control air door is located at a first position, the first electric control air door blocks the first air duct section from the second air duct section, and the first air duct section is in communication with the air-conditioning air duct, and when the first electric control air door is located at a second position, the first electric control air door blocks the first air duct section from the air-conditioning air duct, and the first air duct section is in communication with the second air duct section; and the second heat dissipation structure is disposed in the second air duct section.