A polyamide-imide film which is manufactured by imidizing a polyamide-imide precursor, the method for manufacturing the polyamide-imide precursor consisting of the following steps to: solution polymerizing bistrifluoromethylbenzidine (TFDB) and biphenyltetracarboxylic acid dianhydride (BPDA), adding to the solution of step and solution polymerizing 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride to obtain a first block, adding to the solution of step an aromatic diamine, adding Propylene oxide to the solution of step and then adding an aromatic dicarbonyl compound to solution polymerizing to obtain a second block; wherein the aromatic diamine is one or more selected from the group consisting of 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane (HFBAPP), bis(4-(3-minophenoxy)phenyl)sulfone (BAPSM), 4,4'-diaminodiphenylsulfone, and 3,3'-diaminodiphenylsulfone, and wherein the aromatic dicarbonyl compound is one or more selected from the group consisting of terephthaloyl chloride (p-terephthaloyl chloride, TPC) and iso-phthaloyl dichloride, and wherein a molar ratio of the Propylene oxide to the aromatic dicarbonyl compound is 4:1, and wherein a molar ratio of the first block to the second block is 5: 1 to 1: 1, and wherein a molar ratio of the TFDB to the aromatic diamine is 4: 1 to 1: 1, and wherein a molar ratio of the "BPDA and 6FDA" to the aromatic dicarbonyl compound is 4: 1 to 1: 1, and wherein a molar ratio of the BPDA to the 6FDA is 1: 3 to 3: 1, and wherein the polyimide film has an elongation at break of 7% or more, which is measured based on ASTM D882 based on a film thickness of 10 to 50 μm, and wherein a polyimide film has the dimension change difference ΔDC of 100 μm or less, which is defined by a difference |A-B| between a minimum value on a first heat increasing curve, a dimension change value measured at 50°C, A, and a minimum value on a cooling curve, a dimension change value measured at 50°C, B, when repeatedly measured one to three times in a section at 50 to 250°C using a thermomechanical analysis method based on a film thickness of 10 to 50 μm. solution polymerizing bistrifluoromethylbenzidine (TFDB) and biphenyltetracarboxylic acid dianhydride (BPDA), adding to the solution of step and solution polymerizing 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride to obtain a first block, adding to the solution of step an aromatic diamine, adding Propylene oxide to the solution of step and then adding an aromatic dicarbonyl compound to solution polymerizing to obtain a second block; wherein the aromatic diamine is one or more selected from the group consisting of 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane (HFBAPP), bis(4-(3-minophenoxy)phenyl)sulfone (BAPSM), 4,4'-diaminodiphenylsulfone, and 3,3'-diaminodiphenylsulfone, and wherein the aromatic dicarbonyl compound is one or more selected from the group consisting of terephthaloyl chloride (p-terephthaloyl chloride, TPC) and iso-phthaloyl dichloride, and wherein a molar ratio of the Propylene oxide to the aromatic dicarbonyl compound is 4:1, and wherein a molar ratio of the first block to the second block is 5: 1 to 1: 1, and wherein a molar ratio of the TFDB to the aromatic diamine is 4: 1 to 1: 1, and wherein a molar ratio of the "BPDA and 6FDA" to the aromatic dicarbonyl compound is 4: 1 to 1: 1, and wherein a molar ratio of the BPDA to the 6FDA is 1: 3 to 3: 1, and wherein the polyimide film has an elongation at break of 7% or more, which is measured based on ASTM D882 based on a film thickness of 10 to 50 μm, and wherein a polyimide film has the dimension change difference ΔDC of 100 μm or less, which is defined by a difference |A-B| between a minimum value on a first heat increasing curve, a dimension change value measured at 50°C, A, and a minimum value on a cooling curve, a dimension change value measured at 50°C, B, when repeatedly measured one to three times in a section at 50 to 250°C using a thermomechanical analysis method based on a film thickness of 10 to 50 μm.