Method for material-bonded connection of an electronic component to a substrate, comprising a) providing an electronic component having a first surface that is to be connected and a substrate having a second surface that is to be connected; b) applying a copper paste onto at least one of the surfaces that are to be connected by means of screen printing processes, stencil printing processes, jet or dispensing technique, and drying the layer of copper paste; c) applying a soldering agent onto the dried layer of copper paste and arranging the electronic component and the substrate appropriately such that the first surface to be connected of the electronic component contacts the second surface to be connected of the substrate via the two-layer combination of dried copper paste and soldering agent; or c2) arranging the electronic component and the substrate appropriately such that the first surface to be connected of the electronic component contacts the second surface to be connected of the substrate via the dried copper paste, and applying a soldering agent adjacent to the layer of dried copper paste; and d) soldering the arrangement produced in step c1) or c2) at a soldering temperature in the range of 240 - 260°C in order to produce a material-bonded connection between the electronic component and the substrate; whereby the soldering agent used in process step c1) or c2) is a soldering paste or one or more solder form parts made of soldering metal; whereby the application of the soldering paste takes place by means of screen printing processes, stencil printing processes, jet or dispensing technique; whereby the copper paste contains (i) 66 - 99% by weight of at least one type of particles, which each comprise a phosphorus fraction ranging from 0 to ≤ 500 wt-ppm selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 0 - 20% by weight of at least one type of soldering particles selected from the group consisting of tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 1 - 20%by weight of vehicle, whereby the mean particle diameter of the metallic particles (i) and (ii) is ≤ 15 μm; whereby the copper-rich copper/zinc alloys or copper-rich copper/tin alloys comprise a composition ranging from 60 - 99.5% by weight copper and 0.5 - 40% by weight zinc or tin, and whereby the tin-rich tin/copper alloys, tin/silver alloys or tin/copper/silver alloys comprise a composition ranging from 95 - 99.5% by weight tin and 0.5 - 5% by weight copper, silver or copper plus silver. a) providing an electronic component having a first surface that is to be connected and a substrate having a second surface that is to be connected; b) applying a copper paste onto at least one of the surfaces that are to be connected by means of screen printing processes, stencil printing processes, jet or dispensing technique, and drying the layer of copper paste; c) applying a soldering agent onto the dried layer of copper paste and arranging the electronic component and the substrate appropriately such that the first surface to be connected of the electronic component contacts the second surface to be connected of the substrate via the two-layer combination of dried copper paste and soldering agent; or c2) arranging the electronic component and the substrate appropriately such that the first surface to be connected of the electronic component contacts the second surface to be connected of the substrate via the dried copper paste, and applying a soldering agent adjacent to the layer of dried copper paste; and d) soldering the arrangement produced in step c1) or c2) at a soldering temperature in the range of 240 - 260°C in order to produce a material-bonded connection between the electronic component and the substrate; whereby the soldering agent used in process step c1) or c2) is a soldering paste or one or more solder form parts made of soldering metal; whereby the application of the soldering paste takes place by means of screen printing processes, stencil printing processes, jet or dispensing technique; whereby the copper paste contains (i) 66 - 99% by weight of at least one type of particles, which each comprise a phosphorus fraction ranging from 0 to ≤ 500 wt-ppm selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 0 - 20% by weight of at least one type of soldering particles selected from the group consisting of tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 1 - 20%by weight of vehicle, whereby the mean particle diameter of the metallic particles (i) and (ii) is ≤ 15 μm;