A semiconductor device sub-assembly comprising: a plurality of semiconductor units laterally spaced to one another; a plurality of conductive blocks operatively coupled with the plurality of semiconductor units; a conductive malleable layer operatively coupled with the plurality of conductive blocks, wherein the conductive malleable layer is a continuous layer, and wherein the plurality of conductive blocks are located between the conductive malleable layer and the plurality of semiconductor units; a conductive stand-off plate operatively connected with an opposing surface of the conductive malleable layer compared to a surface of the conductive malleable layer to which the conductive block is coupled, wherein the stand-off plate comprises a plurality of holes, each of which is substantially aligned with a corresponding conductive block; and means for applying a mechanical load to the sub-assembly; wherein, in use, the plurality of conductive blocks apply a pressure on the conductive malleable layer, when a predetermined pressure is applied by the mechanical means to the semiconductor units and the stand-off plate of the semiconductor device sub-assembly such that the conductive malleable layer is flexed into the holes of the stand-off plate by the plurality of conductive blocks, and wherein the sub-assembly is configured such that when the predetermined pressure is applied a conductive path is established through the semiconductor unit, conductive block, conductive malleable layer, and stand-off plate. a plurality of semiconductor units laterally spaced to one another; a plurality of conductive blocks operatively coupled with the plurality of semiconductor units; a conductive malleable layer operatively coupled with the plurality of conductive blocks, wherein the conductive malleable layer is a continuous layer, and wherein the plurality of conductive blocks are located between the conductive malleable layer and the plurality of semiconductor units; a conductive stand-off plate operatively connected with an opposing surface of the conductive malleable layer compared to a surface of the conductive malleable layer to which the conductive block is coupled, wherein the stand-off plate comprises a plurality of holes, each of which is substantially aligned with a corresponding conductive block; and means for applying a mechanical load to the sub-assembly; wherein, in use, the plurality of conductive blocks apply a pressure on the conductive malleable layer, when a predetermined pressure is applied by the mechanical means to the semiconductor units and the stand-off plate of the semiconductor device sub-assembly such that the conductive malleable layer is flexed into the holes of the stand-off plate by the plurality of conductive blocks, and wherein the sub-assembly is configured such that when the predetermined pressure is applied a conductive path is established through the semiconductor unit, conductive block, conductive malleable layer, and stand-off plate. wherein, in use, the plurality of conductive blocks apply a pressure on the conductive malleable layer, when a predetermined pressure is applied by the mechanical means to the semiconductor units and the stand-off plate of the semiconductor device sub-assembly such that the conductive malleable layer is flexed into the holes of the stand-off plate by the plurality of conductive blocks, and wherein the sub-assembly is configured such that when the predetermined pressure is applied a conductive path is established through the semiconductor unit, conductive block, conductive malleable layer, and stand-off plate.