A fingerprint identification apparatus being capable of applying to an electronic device having a display screen, wherein the fingerprint identification apparatus comprises: at least one fingerprint sensor chip, wherein an optical path stack layer is disposed above an upper surface of the at least one fingerprint sensor chip; a support plate provided with a first opening window, wherein the at least one fingerprint sensor chip is fixedly disposed in the first opening window through a first fixing adhesive; and a foam layer fixedly disposed on an upper surface of the support plate, wherein the foam layer is provided with a fourth opening window, and the fourth opening window is aligned with the first opening window, and a window size of the fourth opening window is smaller than or equal to a window size of the first opening window; wherein the support plate is capable of being mounted to a middle frame of the electronic device such that the at least one fingerprint sensor chip is located under the display screen of the electronic device and a gap is provided between the optical path stack layer and the display screen of the electronic device, the at least one fingerprint sensor chip is configured to receive a fingerprint detecting signal returned by reflection or scattering via a human finger above the display screen, and the fingerprint detecting signal is used to detect fingerprint information of the finger; wherein the support plate further comprises: a stiffening plate provided with a second opening window; and a circuit board fixedly disposed under the stiffening plate through a first adhesive layer and provided with a third opening window, wherein the first opening window comprises the second opening window and the third opening window, and the at least one fingerprint sensor chip is electrically connected to the circuit board through a gold wire, the first fixing adhesive is also configured to encapsulate the gold wire. at least one fingerprint sensor chip, wherein an optical path stack layer is disposed above an upper surface of the at least one fingerprint sensor chip; a support plate provided with a first opening window, wherein the at least one fingerprint sensor chip is fixedly disposed in the first opening window through a first fixing adhesive; and a foam layer fixedly disposed on an upper surface of the support plate, wherein the foam layer is provided with a fourth opening window, and the fourth opening window is aligned with the first opening window, and a window size of the fourth opening window is smaller than or equal to a window size of the first opening window; wherein the support plate is capable of being mounted to a middle frame of the electronic device such that the at least one fingerprint sensor chip is located under the display screen of the electronic device and a gap is provided between the optical path stack layer and the display screen of the electronic device, the at least one fingerprint sensor chip is configured to receive a fingerprint detecting signal returned by reflection or scattering via a human finger above the display screen, and the fingerprint detecting signal is used to detect fingerprint information of the finger; wherein the support plate further comprises: a stiffening plate provided with a second opening window; and a circuit board fixedly disposed under the stiffening plate through a first adhesive layer and provided with a third opening window, wherein the first opening window comprises the second opening window and the third opening window, and the at least one fingerprint sensor chip is electrically connected to the circuit board through a gold wire, the first fixing adhesive is also configured to encapsulate the gold wire. a stiffening plate provided with a second opening window; and a circuit board fixedly disposed under the stiffening plate through a first adhesive layer and provided with a third opening window, wherein the first opening window comprises the second opening window and the third opening window, and the at least one fingerprint sensor chip is electrically connected to the circuit board through a gold wire, the first fixing adhesive is also configured to encapsulate the gold wire.