A method of manufacturing a deposition mask having a plurality of through-holes formed therein, the method comprising: a step of preparing a metal plate, the metal plate being made of an iron alloy containing 30 to 54% by mass of nickel; an inspection step of analyzing a composition of a first surface of the metal plate by using an X-ray photoelectron spectroscopy; a selection step of selecting the metal plate based on the result of the composition analysis step; a step of attaching a dry film to the first surface of the metal plate; a step of exposing and developing the dry film attached to the first surface of the metal plate to form a first resist pattern; and a step of etching an area of the first surface of the metal plate, the area being not covered with the first resist pattern, so that first recesses to define the through-holes are formed in the first surface of the metal plate, wherein in the composition analysis of the first surface of the metal plate by means of the X-ray photoelectron spectroscopy, an incident angle of an X-ray emitted to the metal plate on the first surface is 45 degrees, and an acceptance angle of photoelectrons discharged from the metal plate is 90 degrees, and wherein the selection step selects the metal plate which satisfies the below condition: a ratio A1/A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is a sum of a peak planar dimension value of nickel oxide and a peak planar dimension value of nickel hydroxide, and A2 is a sum of a peak planar dimension value of iron oxide and a peak planar dimension value of iron hydroxide, wherein the method for calculating the ratio A1/A2 based on the analysis result by means of the XPS method is performed as specified in the description; and wherein calculating the background line is performed by using the Shirley method as specified in the description. a step of preparing a metal plate, the metal plate being made of an iron alloy containing 30 to 54% by mass of nickel; an inspection step of analyzing a composition of a first surface of the metal plate by using an X-ray photoelectron spectroscopy; a selection step of selecting the metal plate based on the result of the composition analysis step; a step of attaching a dry film to the first surface of the metal plate; a step of exposing and developing the dry film attached to the first surface of the metal plate to form a first resist pattern; and a step of etching an area of the first surface of the metal plate, the area being not covered with the first resist pattern, so that first recesses to define the through-holes are formed in the first surface of the metal plate, wherein in the composition analysis of the first surface of the metal plate by means of the X-ray photoelectron spectroscopy, an incident angle of an X-ray emitted to the metal plate on the first surface is 45 degrees, and an acceptance angle of photoelectrons discharged from the metal plate is 90 degrees, and wherein the selection step selects the metal plate which satisfies the below condition: a ratio A1/A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is a sum of a peak planar dimension value of nickel oxide and a peak planar dimension value of nickel hydroxide, and A2 is a sum of a peak planar dimension value of iron oxide and a peak planar dimension value of iron hydroxide, a ratio A1/A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is a sum of a peak planar dimension value of nickel oxide and a peak planar dimension value of nickel hydroxide, and A2 is a sum of a peak planar dimension value of iron oxide and a peak planar dimension value of iron hydroxide, wherein the method for calculating the ratio A1/A2 based on the analysis result by means of the XPS method is performed as specified in the description; and wherein calculating the background line is performed by using the Shirley method as specified in the description.