A method of making a bulb with a three-dimensional LED encapsulation, comprising the following steps: 1) making a three-dimensional LED encapsulation, wherein a plurality of LED chips connected in series and/or in parallel are placed on a substrate, said plurality of LED chips are lead out by electrode lead wires on two ends of substrate, or by an electrode lead wire on one end of substrate and the other end of substrate which serves as another electrode lead wire; wherein said substrate is in spiral lines as a whole, at least one end of said substrate has an electrode lead wire, and said electrode lead wire is connected with said substrate by connective components and/or connective materials; there are gaps between the spiral lines of said substrate, and edges of said substrate are at least partially smooth curves; said substrate comprises a middle part and edge parts clinging to the middle part; or said substrate is concatenated by several components in different materials; or said substrate comprises the substrate body and at least a spot part or a belt part in a material different from the material of the substrate body, the spot part or the belt part being nested or connected with the substrate body; 2) preparing a cooling supporter having two lead wires; 3) connecting the electrode lead wires of said three-dimensional LED encapsulation with said lead wires; 4) putting the three-dimensional LED encapsulation and cooling supporter into the light-transmitting shell, and connecting and fixing the light-transmitting shell and the cooling supporter; 5) connecting the drive with the electric connector by the electric lead wire and connecting lead wires with the drive; 6) putting the drive in the electric connector and connecting the cooling supporter with the electric connector directly or through connective components; wherein said step 1) and step 2) can be implemented in any sequence, or at the same time, said cooling supporter does not touch the three-dimensional LED encapsulation; and said three-dimensional LED encapsulation is supported by lead wires. 1) making a three-dimensional LED encapsulation, wherein a plurality of LED chips connected in series and/or in parallel are placed on a substrate, said plurality of LED chips are lead out by electrode lead wires on two ends of substrate, or by an electrode lead wire on one end of substrate and the other end of substrate which serves as another electrode lead wire; wherein said substrate is in spiral lines as a whole, at least one end of said substrate has an electrode lead wire, and said electrode lead wire is connected with said substrate by connective components and/or connective materials; there are gaps between the spiral lines of said substrate, and edges of said substrate are at least partially smooth curves; said substrate comprises a middle part and edge parts clinging to the middle part; or said substrate is concatenated by several components in different materials; or said substrate comprises the substrate body and at least a spot part or a belt part in a material different from the material of the substrate body, the spot part or the belt part being nested or connected with the substrate body; 2) preparing a cooling supporter having two lead wires; 3) connecting the electrode lead wires of said three-dimensional LED encapsulation with said lead wires; 4) putting the three-dimensional LED encapsulation and cooling supporter into the light-transmitting shell, and connecting and fixing the light-transmitting shell and the cooling supporter; 5) connecting the drive with the electric connector by the electric lead wire and connecting lead wires with the drive; 6) putting the drive in the electric connector and connecting the cooling supporter with the electric connector directly or through connective components; wherein said step 1) and step 2) can be implemented in any sequence, or at the same time, said cooling supporter does not touch the three-dimensional LED encapsulation; and said three-dimensional LED encapsulation is supported by lead wires.