A wireless Local Area Network (WLAN) device, comprising: a first transceiver, which is configured to communicate on a first frequency band, and which comprises a first Multi-Chip Module comprising a first Radio-Frequency Integrated Circuit (RFIC) for transmitting and receiving on the first frequency band and a first BaseBand Integrated Circuit (BBIC); and a second transceiver, which is configured to communicate on a second frequency band, and which comprises a second MCM comprising a second RFIC for transmitting and receiving on the second frequency band and a second BBIC that is identical to the first BBIC, wherein the first and second RFICs and the first and second BBICs comprise bond pads (54, 56) to provide interfaces, wherein the first RFIC is connected to the first BBIC and the second RFIC is connected to the second BBIC using direct bond wires between the bond pads (54, 56), and wherein the bond pads of each of the first and second RFICs and the first and second BBICs are positioned such that no two of the direct bond wires cross over one another, wherein the first RFIC comprises a basic configuration set of transceiver chains, and wherein the second RFIC comprises a basic configuration set of transceiver chains that correspond respectively to the basic configuration set of transceiver chains of the first RFIC, plus one or more additional transceiver chains, and wherein the interfaces of the transceiver chains in the second RFIC are ordered in the same order as corresponding interfaces of the transceiver chains in the first RFIC, and wherein the one or more additional transceiver chains of the second RFIC are laid on one or more edges of a contiguous block comprising the basic configuration set of transceiver chains. a first transceiver, which is configured to communicate on a first frequency band, and which comprises a first Multi-Chip Module comprising a first Radio-Frequency Integrated Circuit (RFIC) for transmitting and receiving on the first frequency band and a first BaseBand Integrated Circuit (BBIC); and a second transceiver, which is configured to communicate on a second frequency band, and which comprises a second MCM comprising a second RFIC for transmitting and receiving on the second frequency band and a second BBIC that is identical to the first BBIC, wherein the first and second RFICs and the first and second BBICs comprise bond pads (54, 56) to provide interfaces, wherein the first RFIC is connected to the first BBIC and the second RFIC is connected to the second BBIC using direct bond wires between the bond pads (54, 56), and wherein the bond pads of each of the first and second RFICs and the first and second BBICs are positioned such that no two of the direct bond wires cross over one another, wherein the first RFIC comprises a basic configuration set of transceiver chains, and wherein the second RFIC comprises a basic configuration set of transceiver chains that correspond respectively to the basic configuration set of transceiver chains of the first RFIC, plus one or more additional transceiver chains, and wherein the interfaces of the transceiver chains in the second RFIC are ordered in the same order as corresponding interfaces of the transceiver chains in the first RFIC, and wherein the one or more additional transceiver chains of the second RFIC are laid on one or more edges of a contiguous block comprising the basic configuration set of transceiver chains.