A package (10; 10b-g; 20; 30; 30b; 30d; 400; 1106) having electronics disposed therein, the package (10; 10b-g; 20; 30; 30b; 30d; 400; 1106) being configured to be disposed within a downhole tool and comprising: a first body (12; 22; 32; 32b; 32d; 402) that includes an outer surface and an inner surface; a second body (14; 24; 34; 34b; 34d; 404) that includes an outer surface and an inner surface; a cavity (16; 26; 36; 36b; 36d; 406) that is formed by the inner surface of the first body (12; 22; 32; 32b; 32d; 402) and the inner surface of the second body (14; 24; 34; 34b; 34d; 404), the cavity (16; 26; 36; 36b; 36d; 406) having a characteristic dimension, L, that is a square root of a surface area taken from a face of the cavity (16; 26; 36; 36b; 36d; 406); one or more electronics components (18; 28; 38; 38b; 38d) that are contained within the cavity (16; 26; 36; 36b; 36d); and one or more seal surfaces (13; 23; 33; 33b; 33d) on the first body (12; 22; 32; 32b; 32d; 402) and one or more seal surfaces (15; 25; 35; 35b; 35d) on the second body (14; 24; 34; 34b; 34d; 404) that are arranged to seal the first body (12; 22; 32; 32b; 32d; 402) with the second body (14; 24; 34; 34b; 34d; 404); wherein one or more of the seal surfaces (13, 15; 23, 25; 33, 35; 35b; 35d) include a wall thickness dimension, t, that extends toward the cavity (16; 26; 36; 36b; 36d; 406) from the outer surface of one or more of the first body (12; 22; 32; 32b; 32d; 402) and the second body (14; 24; 34; 34b; 34d; 404), the wall thickness dimension, t, being determined by: t ≥ a * L where a is a coefficient and the face of the cavity is a surface defining a boundary of the cavity (16; 26; 36; 36b; 36d; 406) or an imaginary plane across the volume of the cavity (16; 26; 36; 36b; 36d; 406); wherein the coefficient a, the wall thickness dimension t, or both, are selected based on parameters of the package and conditions expected in a downhole environment, where the parameters and conditions comprise stress, deflection, pressure, temperature, package size, package shape, a size of the one or more electronics components, a material of the package, or combinations thereof; and wherein the selected coefficient a or the selected wall thickness dimension t results in the package being suitable for packaging the one or more electronic components, such that the one or more electronic components remain electrically functional when the package is disposed in the downhole environment. a first body (12; 22; 32; 32b; 32d; 402) that includes an outer surface and an inner surface; a second body (14; 24; 34; 34b; 34d; 404) that includes an outer surface and an inner surface; a cavity (16; 26; 36; 36b; 36d; 406) that is formed by the inner surface of the first body (12; 22; 32; 32b; 32d; 402) and the inner surface of the second body (14; 24; 34; 34b; 34d; 404), the cavity (16; 26; 36; 36b; 36d; 406) having a characteristic dimension, L, that is a square root of a surface area taken from a face of the cavity (16; 26; 36; 36b; 36d; 406); one or more electronics components (18; 28; 38; 38b; 38d) that are contained within the cavity (16; 26; 36; 36b; 36d); and one or more seal surfaces (13; 23; 33; 33b; 33d) on the first body (12; 22; 32; 32b; 32d; 402) and one or more seal surfaces (15; 25; 35; 35b; 35d) on the second body (14; 24; 34; 34b; 34d; 404) that are arranged to seal the first body (12; 22; 32; 32b; 32d; 402) with the second body (14; 24; 34; 34b; 34d; 404); wherein one or more of the seal surfaces (13, 15; 23, 25; 33, 35; 35b; 35d) include a wall thickness dimension, t, that extends toward the cavity (16; 26; 36; 36b; 36d; 406) from the outer surface of one or more of the first body (12; 22; 32; 32b; 32d; 402) and the second body (14; 24; 34; 34b; 34d; 404), the wall thickness dimension, t, being determined by: t ≥ a * L where a is a coefficient and the face of the cavity is a surface defining a boundary of the cavity (16; 26; 36; 36b; 36d; 406) or an imaginary plane across the volume of the cavity (16; 26; 36; 36b; 36d; 406); wherein the coefficient a, the wall thickness dimension t, or both, are selected based on parameters of the package and conditions expected in a downhole environment, where the parameters and conditions comprise stress, deflection, pressure, temperature, package size, package shape, a size of the one or more electronics components, a material of the package, or combinations thereof; and wherein the selected coefficient a or the selected wall thickness dimension t results in the package being suitable for packaging the one or more electronic components, such that the one or more electronic components remain electrically functional when the package is disposed in the downhole environment.