A method for layer-wise producing of an intermediate printed circuit board product with an antenna structure, comprising the following steps: - Providing a ground layer; - Optionally attaching a release layer with a release layer shape on one exterior side of the ground layer, wherein the release layer is removably positioned on an antenna subarea of the exterior side of the ground layer; - Attaching a dielectric insulating layer directly on one exterior side of the ground layer that is if applicable partly covered by the release layer, wherein the release layer is arranged between the ground layer and the dielectric insulating layer; - Attaching a conducting layer directly on a first exterior side of the dielectric insulating layer opposite to the ground layer wherein the dielectric insulating layer is arranged between the conducting layer and the ground layer; - Laminating layer-wise of the ground layer, the at least one dielectric insulating layer (30, 30'), the at least one conducting layer (40, 40') and if applicable the release layer and - Optionally attaching a layer arrangement on a first exterior side of said conducting layer, said layer arrangement comprising at least one further dielectric insulating layer (30', 30") and at least one further conducting layer (40', 40"), whereby at least one further dielectric insulating layer is attached on said first exterior side of the conducting layer and at least one further conducting layer is attached on a first exterior side of at least one further dielectric insulating layer (30', 30"), to obtain a first semi-finished product; - Manufacturing of at least one antenna cavity within the first semi-finished product starting on its exterior side that is made up of the at least one conducting layer (40, 40') and extending throughout at least one conducting layer as well as at least one dielectric insulating layer with a cavity height equal to the sum of at least one conducting layer height and at least one dielectric insulating layer height, wherein if applicable a cavity projection area corresponds to the release layer shape and is positioned on the antenna subarea covered by the release layer and wherein a ground-plane area of the cavity is made up of the release layer; - Optionally coating of the side walls (67, 68) within the antenna cavity; - Attaching a compound signal layer on the exterior side made up of the conducting layer of the first semi-finished product, wherein the compound signal layer covers the antenna cavity; - Laminating of the first semi-finished product and the compound signal layer to obtain an intermediate printed circuit board product. - Providing a ground layer; - Optionally attaching a release layer with a release layer shape on one exterior side of the ground layer, wherein the release layer is removably positioned on an antenna subarea of the exterior side of the ground layer; - Attaching a dielectric insulating layer directly on one exterior side of the ground layer that is if applicable partly covered by the release layer, wherein the release layer is arranged between the ground layer and the dielectric insulating layer; - Attaching a conducting layer directly on a first exterior side of the dielectric insulating layer opposite to the ground layer wherein the dielectric insulating layer is arranged between the conducting layer and the ground layer; - Laminating layer-wise of the ground layer, the at least one dielectric insulating layer (30, 30'), the at least one conducting layer (40, 40') and if applicable the release layer and - Optionally attaching a layer arrangement on a first exterior side of said conducting layer, said layer arrangement comprising at least one further dielectric insulating layer (30', 30") and at least one further conducting layer (40', 40"), whereby at least one further dielectric insulating layer is attached on said first exterior side of the conducting layer and at least one further conducting layer is attached on a first exterior side of at least one further dielectric insulating layer (30', 30"), to obtain a first semi-finished product; - Manufacturing of at least one antenna cavity within the first semi-finished product starting on its exterior side that is made up of the at least one conducting layer (40, 40') and extending throughout at least one conducting layer as well as at least one dielectric insulating layer with a cavity height equal to the sum of at least one conducting layer height and at least one dielectric insulating layer height, wherein if applicable a cavity projection area corresponds to the release layer shape and is positioned on the antenna subarea covered by the release layer and wherein a ground-plane area of the cavity is made up of the release layer; - Optionally coating of the side walls (67, 68) within the antenna cavity; - Attaching a compound signal layer on the exterior side made up of the conducting layer of the first semi-finished product, wherein the compound signal layer covers the antenna cavity; - Laminating of the first semi-finished product and the compound signal layer to obtain an intermediate printed circuit board product.