A system comprising a component mounting machine and a die supply apparatus (12,51), the component mounting machine comprising a mounting head provided with one or a plurality of suction nozzles, and the die supply apparatus (12, 51) comprising: a supply head (33, 54) and a supply head for replacement that are each configured to hold one or a plurality of suction nozzles configured to suction a die which is formed by dicing a wafer attached on a dicing sheet, wherein the supply head (33, 54) and the supply head for replacement have a different number of nozzles; a head moving mechanism (34, 52) that is configured to move any of the supply head (33, 54) and the supply head for replacement; and a head holding unit (40, 53) which is configured to be moved by the head moving mechanism (34, 52), wherein the die supply apparatus (12, 51) is configured to supply a die suctioned by a nozzle of the die supply apparatus (12, 51) to the component mounting machine, wherein each of the supply head (33, 54) and the supply head for replacement is respectively configured to be detachably held by the head holding unit (40, 53), and the supply head (33, 54) held by the head holding unit (40, 53) is configured to be replaceable with the supply head for replacement which has the same number of nozzles as the number of nozzles of the mounting head of the component mounting machine. the component mounting machine comprising a mounting head provided with one or a plurality of suction nozzles, and the die supply apparatus (12, 51) comprising: a supply head (33, 54) and a supply head for replacement that are each configured to hold one or a plurality of suction nozzles configured to suction a die which is formed by dicing a wafer attached on a dicing sheet, wherein the supply head (33, 54) and the supply head for replacement have a different number of nozzles; a head moving mechanism (34, 52) that is configured to move any of the supply head (33, 54) and the supply head for replacement; and a head holding unit (40, 53) which is configured to be moved by the head moving mechanism (34, 52), a supply head (33, 54) and a supply head for replacement that are each configured to hold one or a plurality of suction nozzles configured to suction a die which is formed by dicing a wafer attached on a dicing sheet, wherein the supply head (33, 54) and the supply head for replacement have a different number of nozzles; a head moving mechanism (34, 52) that is configured to move any of the supply head (33, 54) and the supply head for replacement; and a head holding unit (40, 53) which is configured to be moved by the head moving mechanism (34, 52), wherein the die supply apparatus (12, 51) is configured to supply a die suctioned by a nozzle of the die supply apparatus (12, 51) to the component mounting machine, wherein each of the supply head (33, 54) and the supply head for replacement is respectively configured to be detachably held by the head holding unit (40, 53), and the supply head (33, 54) held by the head holding unit (40, 53) is configured to be replaceable with the supply head for replacement which has the same number of nozzles as the number of nozzles of the mounting head of the component mounting machine.