A server comprising: an outer housing defining a first air vent and a second air vent; and an inner housing disposed within the outer housing such that an air channel is defined between the inner housing and the outer housing, the air channel having a first end and a second end, the first air vent being positioned adjacent to the first end of the air channel and the second air vent being positioned adjacent to the second end of the air channel, wherein the inner housing is water-tight and particulate-tight, characterized by further comprising: one or more high-power electronic components positioned in the inner housing; one or more low-power electronic components positioned in the inner housing, the one or more high-power electronic components generating more heat than the one or more low-power electronic components; a first heat sink positioned at least partially in the air channel such that the first heat sink is in thermal exchange with the one or more low-power electronic components in the inner housing; a second heat sink disposed in the air channel outside of the inner housing; one or more heat pipes extending through the inner housing, a first end of the one or more heat pipes being coupled to the second heat sink, and a second end of the one or more heat pipes being coupled to the one or more high-power electronic component within the inner housing; and a second fan positioned and configured to cause air to enter the air channel via the first air vent, flow through at least a portion of the air channel, and through at least a portion of the second heat sink, and exit the air channel via the second air vent; and a first fan positioned within the inner housing, wherein the one or more low-power electronic components is positioned between the one or more high-power electronic components and the first fan. an outer housing defining a first air vent and a second air vent; and an inner housing disposed within the outer housing such that an air channel is defined between the inner housing and the outer housing, the air channel having a first end and a second end, the first air vent being positioned adjacent to the first end of the air channel and the second air vent being positioned adjacent to the second end of the air channel, wherein the inner housing is water-tight and particulate-tight, characterized by further comprising: one or more high-power electronic components positioned in the inner housing; one or more low-power electronic components positioned in the inner housing, the one or more high-power electronic components generating more heat than the one or more low-power electronic components; a first heat sink positioned at least partially in the air channel such that the first heat sink is in thermal exchange with the one or more low-power electronic components in the inner housing; a second heat sink disposed in the air channel outside of the inner housing; one or more heat pipes extending through the inner housing, a first end of the one or more heat pipes being coupled to the second heat sink, and a second end of the one or more heat pipes being coupled to the one or more high-power electronic component within the inner housing; and a second fan positioned and configured to cause air to enter the air channel via the first air vent, flow through at least a portion of the air channel, and through at least a portion of the second heat sink, and exit the air channel via the second air vent; and a first fan positioned within the inner housing, wherein the one or more low-power electronic components is positioned between the one or more high-power electronic components and the first fan. one or more high-power electronic components positioned in the inner housing; one or more low-power electronic components positioned in the inner housing, the one or more high-power electronic components generating more heat than the one or more low-power electronic components; a first heat sink positioned at least partially in the air channel such that the first heat sink is in thermal exchange with the one or more low-power electronic components in the inner housing; a second heat sink disposed in the air channel outside of the inner housing; one or more heat pipes extending through the inner housing, a first end of the one or more heat pipes being coupled to the second heat sink, and a second end of the one or more heat pipes being coupled to the one or more high-power electronic component within the inner housing; and a second fan positioned and configured to cause air to enter the air channel via the first air vent, flow through at least a portion of the air channel, and through at least a portion of the second heat sink, and exit the air channel via the second air vent; and a first fan positioned within the inner housing, wherein the one or more low-power electronic components is positioned between the one or more high-power electronic components and the first fan.