A process method for bond-packaging an LED using an organic silicone resin photoconverter by tandem rolling, comprising step 1: preparation of a semi-cured photoconversion sheet: obtaining the semi-cured photoconversion sheet formed of a first protective film, a semi-cured photoconversion film, and a second protective film, wherein the semi-cured photoconversion film comprises semi-cured organic silicone resin and a photoconversion material; step 2: pseudo-curing of the semi-cured photoconversion sheet: in a vacuum condition, by means of low-temperature freezing, pseudo-curing the semi-cured photoconversion sheet obtained in step 1, to obtain a pseudo-cured photoconversion sheet; step 3: preparation of a flip chip LED array sheet: obtaining the flip chip LED array sheet, flip chip LEDs in the flip chip LED array sheet being arranged on a carrier film in an array manner, wherein the flip chip LEDs being arranged in an array manner means arrangement in an array by using an individual flip chip LED as a unit or arrangement in an array by using a flip chip LED assembly as a unit, and the flip chip LED assembly is formed of two or more individual flip chip LEDs; step 4: forming of LED package elements by dual-roller roll-bonding: in a vacuum condition, removing the second protective film of the pseudo-cured photoconversion sheet in step 2, to obtain the pseudo-cured photoconversion sheet containing no protective film on a single side, then enabling the pseudo-cured photoconversion sheet to turn from a pseudo-cured state to a semi-cured state by means of heating or/and illumination, and subsequently performing dual-roller roll-bonding on the semi-cured photoconversion sheet and the flip chip LED array sheet, such that the flip chip LEDs in the flip chip LED array are bonded to and inserted in the semi-cured photoconversion sheet, to obtain the LED package elements; step 5: curing of the LED package elements: in a vacuum condition, curing the LED package elements by means of heat curing or/and photocuring, to obtain the cured LED package elements; and step 6: cutting of the LED package elements: removing the first protective film of the cured LED package elements in step 5, and cutting the cured LED package elements, to obtain finished LED package elements having slits for splitting into single LED package elements, wherein preparation of the semi-cured photoconversion sheet in step 1, the pseudo-curing of the semi-cured photoconversion sheet in step 2, the preparation of the flip chip LED array sheet in step 3, the forming of LED package elements by dual-roller roll-bonding in step 4, the curing of the LED package elements in step 5, and the cutting of the LED package elements in step 5 constitute a continuous process flow. step 1: preparation of a semi-cured photoconversion sheet: obtaining the semi-cured photoconversion sheet formed of a first protective film, a semi-cured photoconversion film, and a second protective film, wherein the semi-cured photoconversion film comprises semi-cured organic silicone resin and a photoconversion material; step 2: pseudo-curing of the semi-cured photoconversion sheet: in a vacuum condition, by means of low-temperature freezing, pseudo-curing the semi-cured photoconversion sheet obtained in step 1, to obtain a pseudo-cured photoconversion sheet; step 3: preparation of a flip chip LED array sheet: obtaining the flip chip LED array sheet, flip chip LEDs in the flip chip LED array sheet being arranged on a carrier film in an array manner, wherein the flip chip LEDs being arranged in an array manner means arrangement in an array by using an individual flip chip LED as a unit or arrangement in an array by using a flip chip LED assembly as a unit, and the flip chip LED assembly is formed of two or more individual flip chip LEDs; step 4: forming of LED package elements by dual-roller roll-bonding: in a vacuum condition, removing the second protective film of the pseudo-cured photoconversion sheet in step 2, to obtain the pseudo-cured photoconversion sheet containing no protective film on a single side, then enabling the pseudo-cured photoconversion sheet to turn from a pseudo-cured state to a semi-cured state by means of heating or/and illumination, and subsequently performing dual-roller roll-bonding on the semi-cured photoconversion sheet and the flip chip LED array sheet, such that the flip chip LEDs in the flip chip LED array are bonded to and inserted in the semi-cured photoconversion sheet, to obtain the LED package elements; step 5: curing of the LED package elements: in a vacuum condition, curing the LED package elements by means of heat curing or/and photocuring, to obtain the cured LED package elements; and step 6: cutting of the LED package elements: removing the first protective film of the cured LED package elements in step 5, and cutting the cured LED package elements, to obtain finished LED package elements having slits for splitting into single LED package elements,