An inspection system comprising: an inspection position, an illumination setup for supplying a first broadband illumination and a second broadband illumination and directing the first broadband illumination and the second broadband illumination at the inspection position for illuminating a wafer, or a portion thereof, positioned at the inspection position; a first image capture device for receiving the first broadband illumination reflected from the wafer; and a second image capture device for receiving the second broadband illumination reflected from the wafer, wherein the inspection system is configured to perform wafer inspection along a wafer scan motion path while the wafer is in motion, and the wafer inspection being completed with one pass, wherein the wafer scan motion path includes a plurality of image capture positions each of which corresponds to a position on the wafer of which images are to be captured characterized in that the wafer inspection includes capturing by the first image capture device a first image under the first broadband illumination of the wafer at one of the image capture positions and subsequently capturing by the second image capture device a second image under the second broadband illumination of the wafer at the subsequent one of the image capture positions, wherein the wafer is spatially displaced by a distance between capture of the first image and the second image due to the wafer being in motion, and repeating the image capturing while the wafer is in motion at each of the plurality of image capture positions along the wafer scan motion path in order to obtain sets of first images and second images of the semiconductor wafer 12 under the corresponding broadband illumination. an inspection position, an illumination setup for supplying a first broadband illumination and a second broadband illumination and directing the first broadband illumination and the second broadband illumination at the inspection position for illuminating a wafer, or a portion thereof, positioned at the inspection position; a first image capture device for receiving the first broadband illumination reflected from the wafer; and a second image capture device for receiving the second broadband illumination reflected from the wafer, wherein the inspection system is configured to perform wafer inspection along a wafer scan motion path while the wafer is in motion, and the wafer inspection being completed with one pass, wherein the wafer scan motion path includes a plurality of image capture positions each of which corresponds to a position on the wafer of which images are to be captured characterized in that the wafer inspection includes capturing by the first image capture device a first image under the first broadband illumination of the wafer at one of the image capture positions and subsequently capturing by the second image capture device a second image under the second broadband illumination of the wafer at the subsequent one of the image capture positions, wherein the wafer is spatially displaced by a distance between capture of the first image and the second image due to the wafer being in motion, and repeating the image capturing while the wafer is in motion at each of the plurality of image capture positions along the wafer scan motion path in order to obtain sets of first images and second images of the semiconductor wafer 12 under the corresponding broadband illumination.