A power module for a medium or high voltage converter, preferably a modular multilevel converter, comprising - at least one power semiconductor module, preferably an IGBT assembly, - at least one energy storage module, preferably a capacitor module, - at least one cooling device, which cooling device is formed as a cooling plate that can be run through by a coolant, in particular flown through by a cooling liquid, and - wherein the at least one power semiconductor module is connected with the cooling plate in a thermally conductive manner, wherein - the at least one power semiconductor module is arranged on an upper side of the cooling plate and the at least one energy storage module is arranged on a bottom side of the cooling plate, wherein - the power module comprises at least one upper-side housing for receiving the power semiconductor module and/or a controller and at least one bottom-side housing for receiving the energy storage module, formed such that they can be mounted on, preferably be coupled to, the cooling plate, and - wherein the cooling plate is provided for load-bearing support on a rack of an assigned receiving space of the medium or high voltage converter when the power module is inserted into the receiving space of the rack with respect to a longitudinal direction, and wherein the cooling plate comprises support surfaces projecting laterally in the transverse direction to the longitudinal direction with respect to at least one energy storage width of the energy storage module, - and wherein the cooling plate comprises at least one connection opening in the vertical direction for leading through and contacting electrical connections of the energy storage module to the power semiconductor module and/or the controller. - at least one power semiconductor module, preferably an IGBT assembly, - at least one energy storage module, preferably a capacitor module, - at least one cooling device, which cooling device is formed as a cooling plate that can be run through by a coolant, in particular flown through by a cooling liquid, and - wherein the at least one power semiconductor module is connected with the cooling plate in a thermally conductive manner, wherein - the at least one power semiconductor module is arranged on an upper side of the cooling plate and the at least one energy storage module is arranged on a bottom side of the cooling plate, wherein - the power module comprises at least one upper-side housing for receiving the power semiconductor module and/or a controller and at least one bottom-side housing for receiving the energy storage module, formed such that they can be mounted on, preferably be coupled to, the cooling plate, and - wherein the cooling plate is provided for load-bearing support on a rack of an assigned receiving space of the medium or high voltage converter when the power module is inserted into the receiving space of the rack with respect to a longitudinal direction, and wherein the cooling plate comprises support surfaces projecting laterally in the transverse direction to the longitudinal direction with respect to at least one energy storage width of the energy storage module, - and wherein the cooling plate comprises at least one connection opening in the vertical direction for leading through and contacting electrical connections of the energy storage module to the power semiconductor module and/or the controller.