A pressure sensor (10,10A, 60) comprising: a housing (20, 62, 64); a diaphragm wafer (30, 68) comprising: a fluid contact surface, a diaphragm (12, 69) located along the surface and configured to deflect in response to pressure; a pressure sensing element (11, 74) that is responsive to deflection of the diaphragm (12, 69); and a support portion, wherein the support portion and the diaphragm (12, 69) define a cavity; an isolator (18, 66) extending laterally between the diaphragm wafer (30, 68) and the housing, wherein the isolator is configured to absorb lateral stresses, wherein the isolator (18, 66) is connected between the support portion of the diaphragm wafer and the housing (20, 62, 64) such that an inner portion of the isolator (18, 66) is attached to the support portion and an outer portion of the isolator is attached to the housing, and the isolator (18, 66) is parallel to the fluid contact surface; a topping wafer attached to the diaphragm wafer (30, 68) and configured to provide reference pressure, and the pressure sensor (10, 60) further comprising an over pressure support rigidly attached to the housing (20, 62, 64) and the topping wafer, and configured to prevent over-pressurization of the pressure sensor (10, 60); an over pressure stop in the topping wafer configured to limit deflection of the diaphragm (12, 69); and tubing configured to allow gage pressure measurements where the pressure between the topping wafer and the diaphragm wafer (30, 68) is equal to the reference pressure. a housing (20, 62, 64); a diaphragm wafer (30, 68) comprising: a fluid contact surface, a diaphragm (12, 69) located along the surface and configured to deflect in response to pressure; a pressure sensing element (11, 74) that is responsive to deflection of the diaphragm (12, 69); and a support portion, wherein the support portion and the diaphragm (12, 69) define a cavity; a fluid contact surface, a diaphragm (12, 69) located along the surface and configured to deflect in response to pressure; a pressure sensing element (11, 74) that is responsive to deflection of the diaphragm (12, 69); and a support portion, wherein the support portion and the diaphragm (12, 69) define a cavity; an isolator (18, 66) extending laterally between the diaphragm wafer (30, 68) and the housing, wherein the isolator is configured to absorb lateral stresses, wherein the isolator (18, 66) is connected between the support portion of the diaphragm wafer and the housing (20, 62, 64) such that an inner portion of the isolator (18, 66) is attached to the support portion and an outer portion of the isolator is attached to the housing, and the isolator (18, 66) is parallel to the fluid contact surface; a topping wafer attached to the diaphragm wafer (30, 68) and configured to provide reference pressure, and the pressure sensor (10, 60) further comprising an over pressure support rigidly attached to the housing (20, 62, 64) and the topping wafer, and configured to prevent over-pressurization of the pressure sensor (10, 60); an over pressure stop in the topping wafer configured to limit deflection of the diaphragm (12, 69); and tubing configured to allow gage pressure measurements where the pressure between the topping wafer and the diaphragm wafer (30, 68) is equal to the reference pressure.