A board working device comprising: a board conveyance device which is configured to convey a printed circuit board and to position the printed circuit board at multiple locations in the board working device; multiple heads (1100, 201a to 201c) that are configured to perform work on the printed circuit board positioned at a working position; the board working device being characterized by a selection device which is configured to perform selection of the multiple heads (1100, 201a to 201c) in order of an application head, a high-speed head, a medium-speed head, and a low-speed head; an exchanging device which is configured to exchange the application head, the high-speed head, the medium-speed head, and the low-speed head; and a control device which is configured to perform control such that the printed circuit board is positioned in the multiple locations in order from an upstream side in relation to the progress direction of the printed circuit board, and work to be performed using a first head (1100, 201a to 201c) of the multiple heads (1100, 201a to 201c) is performed, and further, once the work is completed by the first head (1100, 201a to 201c) at the most downstream side position out of the multiple locations in relation to the progress direction of the printed circuit board, is configured to perform control such that work to be performed using a second head (1100, 201a to 201c) of the multiple heads (1100, 201a to 201c) is started, with the work of the second head (1100, 201a to 201c) being performed with the printed circuit board being positioned in order from a downstream side position out of the multiple locations in relation to the progress direction of the printed circuit board, and wherein the control device is configured to perform control such that, once the work of the second head (1100, 201a to 201c) of the multiple heads (1100, 201a to 201c) is completed, the work of a third head (1100, 201a to 201c) of the multiple heads (1100, 201a to 201c) is performed with the printed circuit board being positioned in order from the upstream side position out of the multiple locations in relation to the progress direction of the printed circuit board. a board conveyance device which is configured to convey a printed circuit board and to position the printed circuit board at multiple locations in the board working device; multiple heads (1100, 201a to 201c) that are configured to perform work on the printed circuit board positioned at a working position; the board working device being characterized by a selection device which is configured to perform selection of the multiple heads (1100, 201a to 201c) in order of an application head, a high-speed head, a medium-speed head, and a low-speed head; an exchanging device which is configured to exchange the application head, the high-speed head, the medium-speed head, and the low-speed head; and a control device which is configured to perform control such that the printed circuit board is positioned in the multiple locations in order from an upstream side in relation to the progress direction of the printed circuit board, and work to be performed using a first head (1100, 201a to 201c) of the multiple heads (1100, 201a to 201c) is performed, and further, once the work is completed by the first head (1100, 201a to 201c) at the most downstream side position out of the multiple locations in relation to the progress direction of the printed circuit board, is configured to perform control such that work to be performed using a second head (1100, 201a to 201c) of the multiple heads (1100, 201a to 201c) is started, with the work of the second head (1100, 201a to 201c) being performed with the printed circuit board being positioned in order from a downstream side position out of the multiple locations in relation to the progress direction of the printed circuit board, and wherein the control device is configured to perform control such that, once the work of the second head (1100, 201a to 201c) of the multiple heads (1100, 201a to 201c) is completed, the work of a third head (1100, 201a to 201c) of the multiple heads (1100, 201a to 201c) is performed with the printed circuit board being positioned in order from the upstream side position out of the multiple locations in relation to the progress direction of the printed circuit board.