A radiation detecting unit comprising: a photoelectric conversion section arranged in proximity to a scintillator and including a plurality of photoelectric conversion elements arrayed along a first surface opposed to the scintillator, and a plurality of electrodes for output of signals arrayed on a second surface opposite to the first surface corresponding to the plurality of photoelectric conversion elements; a signal processing circuit for processing signals from the plurality of photoelectric conversion elements; a flexible substrate on which the photoelectric conversion section and the signal processing circuit are mounted and which electrically connects the plurality of electrodes of the photoelectric conversion section to the signal processing circuit; and a radiation shield plate provided opposite to the second surface of the photoelectric conversion section with the flexible substrate in between and formed so that an end in a direction along the second surface is located inside the photoelectric conversion section, wherein the plurality of electrodes have an array pitch on the second surface made shorter than an array pitch of the photoelectric conversion elements by a wiring member, wherein the flexible substrate is folded along the end of the radiation shield plate, at an intermediate region between a mounting region of the photoelectric conversion section and a mounting region of the signal processing circuit, whereby the signal processing circuit is arranged on the opposed side to the photoelectric conversion elements with the radiation shield plate in between, wherein electromagnetic shield films are formed in the intermediate region of the flexible substrate on both sides of the flexible substrate, and wherein the flexible substrate is formed so that a thickness of the intermediate region is smaller than a thickness of the mounting region of the photoelectric conversion section and the mounting region of the signal processing circuit; and the electromagnetic shield films are provided in the intermediate region separately instead of metal layers (31A, 31B, 31C, 31D) formed on both sides of the flexible substrate; said metal layers (31A, 31B, 31C, 31D) forming a wiring pattern for connection between the photoelectric conversion section and signal processing circuit. a photoelectric conversion section arranged in proximity to a scintillator and including a plurality of photoelectric conversion elements arrayed along a first surface opposed to the scintillator, and a plurality of electrodes for output of signals arrayed on a second surface opposite to the first surface corresponding to the plurality of photoelectric conversion elements; a signal processing circuit for processing signals from the plurality of photoelectric conversion elements; a flexible substrate on which the photoelectric conversion section and the signal processing circuit are mounted and which electrically connects the plurality of electrodes of the photoelectric conversion section to the signal processing circuit; and a radiation shield plate provided opposite to the second surface of the photoelectric conversion section with the flexible substrate in between and formed so that an end in a direction along the second surface is located inside the photoelectric conversion section, wherein the plurality of electrodes have an array pitch on the second surface made shorter than an array pitch of the photoelectric conversion elements by a wiring member, wherein the flexible substrate is folded along the end of the radiation shield plate, at an intermediate region between a mounting region of the photoelectric conversion section and a mounting region of the signal processing circuit, whereby the signal processing circuit is arranged on the opposed side to the photoelectric conversion elements with the radiation shield plate in between, wherein electromagnetic shield films are formed in the intermediate region of the flexible substrate on both sides of the flexible substrate, and wherein the flexible substrate is formed so that a thickness of the intermediate region is smaller than a thickness of the mounting region of the photoelectric conversion section and the mounting region of the signal processing circuit; and the electromagnetic shield films are provided in the intermediate region separately instead of metal layers (31A, 31B, 31C, 31D) formed on both sides of the flexible substrate; said metal layers (31A, 31B, 31C, 31D) forming a wiring pattern for connection between the photoelectric conversion section and signal processing circuit.