A radar system comprising: an integrated circuit, IC, including an IC package (120, 220, 320, 420, 520), lead frame (130, 230, 330), and circuitry (140, 240, 340, 440, 540) located in the IC package and configured to communicate signals for radar communications; a waveguide structure (110, 210, 510) coupled to the IC package and having at least one pathway through which electro-magnetic signals are configured to be transmitted, each pathway defined by conductive walls, the circuitry having a plurality of parallel pillars (142, 242, 442) configured to provide a mm wave signal path and having respective first end portions (141, 241, 441) connected to the IC package and second end portions (143, 243, 443) to connect to a waveguide antenna through the waveguide structure, at least one box-shaped waveguide shield (144, 145, 244, 245, 444, 445) aligned with each pathway of the waveguide structure and configured to provide electro-magnetic isolation for the plurality of pillars, and at least one micro-strip connector (146, 246, 446, 546) in the form of a loop and having ends connected to the second end portions of the pillars of the respective pathway to provide a connection between the second end portions of the pillars and to the waveguide antenna through the waveguide structure; wherein the IC package further includes an interface at which the at least micro-strip connector is connected to the respective pathway of the waveguide structure, and wherein the waveguide structure defines a slot for each pathway through which non-galvanic proximity coupling is provided with the micro-strip connector at the interface of the IC package, wherein the at least one box-shaped waveguide shield is located below the respective slot, considering the location of the IC package as the bottom of the IC and the end of the microwave structure configured to be adjacent to the microwave antenna as the top of the IC; and a plurality of bond wires connecting the IC package and the lead frame and configured to carry the signals from the circuitry of the IC to a board on which the IC package is configured to be mounted for transmission via the waveguide antenna. an integrated circuit, IC, including an IC package (120, 220, 320, 420, 520), lead frame (130, 230, 330), and circuitry (140, 240, 340, 440, 540) located in the IC package and configured to communicate signals for radar communications; a waveguide structure (110, 210, 510) coupled to the IC package and having at least one pathway through which electro-magnetic signals are configured to be transmitted, each pathway defined by conductive walls, the circuitry having a plurality of parallel pillars (142, 242, 442) configured to provide a mm wave signal path and having respective first end portions (141, 241, 441) connected to the IC package and second end portions (143, 243, 443) to connect to a waveguide antenna through the waveguide structure, at least one box-shaped waveguide shield (144, 145, 244, 245, 444, 445) aligned with each pathway of the waveguide structure and configured to provide electro-magnetic isolation for the plurality of pillars, and at least one micro-strip connector (146, 246, 446, 546) in the form of a loop and having ends connected to the second end portions of the pillars of the respective pathway to provide a connection between the second end portions of the pillars and to the waveguide antenna through the waveguide structure; wherein the IC package further includes an interface at which the at least micro-strip connector is connected to the respective pathway of the waveguide structure, and wherein the waveguide structure defines a slot for each pathway through which non-galvanic proximity coupling is provided with the micro-strip connector at the interface of the IC package, wherein the at least one box-shaped waveguide shield is located below the respective slot, considering the location of the IC package as the bottom of the IC and the end of the microwave structure configured to be adjacent to the microwave antenna as the top of the IC; and a plurality of bond wires connecting the IC package and the lead frame and configured to carry the signals from the circuitry of the IC to a board on which the IC package is configured to be mounted for transmission via the waveguide antenna.