An inkjet head comprising: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed in a first direction (x); a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element; an adhesive agent that bonds the pressure chamber-forming plate and the circuit board; an individual metallic layer part of which is stacked on the first electrode layer, which is formed outside of the one end of the piezoelectric element; a common metallic layer stacked on the second electrode layer, wherein an element end on at least one side of the piezoelectric element is formed outside of the defining region and covered by the adhesive agent in a second direction (y) orthogonal to the first direction (x); the bump electrode includes an individual bump electrode and a common bump electrode; the individual bump electrode is electrically connected with the individual metallic layer on the piezoelectric layer formed in a region outside of the defining region; and the common bump electrode is electrically connected with the common metallic layer on the piezoelectric layer formed in a region outside of the defining region. a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed in a first direction (x); a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element; an adhesive agent that bonds the pressure chamber-forming plate and the circuit board; an individual metallic layer part of which is stacked on the first electrode layer, which is formed outside of the one end of the piezoelectric element; a common metallic layer stacked on the second electrode layer, wherein an element end on at least one side of the piezoelectric element is formed outside of the defining region and covered by the adhesive agent in a second direction (y) orthogonal to the first direction (x); the bump electrode includes an individual bump electrode and a common bump electrode; the individual bump electrode is electrically connected with the individual metallic layer on the piezoelectric layer formed in a region outside of the defining region; and the common bump electrode is electrically connected with the common metallic layer on the piezoelectric layer formed in a region outside of the defining region.