A method for supporting analytical work of a solder printing state of a solder printer using accumulated inspection result data, a plurality of boards being sequentially introduced and processed in a production line including the solder printer and a solder printing inspection machine, a unique identification code being provided on the plurality of boards, the solder printing inspection machine producing inspection result data bundled with the identification code on each board and information specifying an inspection order, the inspection result data being accumulated in a solder printing inspection machine or a memory of an external device, the method comprising: a first step of focusing on each of the plurality of boards introduced to the solder printing inspection machine for a purpose of inspection specifying pieces of inspection result data of the plurality of boards that are inspected before the focused board is introduced to the solder printing inspection machine based on the information specifying the inspection order, checking the identification codes bundled with the pieces of inspection result data against the identification code of the focused board, and when the inspection result data bundled with the identification code identical to that of the focused board is detected by the checking, recognizing that the focused board is a board corresponding to the inspection result data bundled with the identical identification code and is reintroduced to the production line; a second step of producing a graph in which pieces of quality data of the plurality of boards are arrayed in time series using the pieces of inspection result data of the plurality of boards inspected by the solder printing inspection machine, the plurality of boards including the board recognized in the first step; and a third step of displaying the graph produced in the second step based on the recognition result in the first step while the quality data corresponding to at least one of the reintroduced board and a board corresponding to the inspection result data bundled with the identification code identical to that of the reintroduced board is explicitly shown. a first step of focusing on each of the plurality of boards introduced to the solder printing inspection machine for a purpose of inspection specifying pieces of inspection result data of the plurality of boards that are inspected before the focused board is introduced to the solder printing inspection machine based on the information specifying the inspection order, checking the identification codes bundled with the pieces of inspection result data against the identification code of the focused board, and when the inspection result data bundled with the identification code identical to that of the focused board is detected by the checking, recognizing that the focused board is a board corresponding to the inspection result data bundled with the identical identification code and is reintroduced to the production line; a second step of producing a graph in which pieces of quality data of the plurality of boards are arrayed in time series using the pieces of inspection result data of the plurality of boards inspected by the solder printing inspection machine, the plurality of boards including the board recognized in the first step; and a third step of displaying the graph produced in the second step based on the recognition result in the first step while the quality data corresponding to at least one of the reintroduced board and a board corresponding to the inspection result data bundled with the identification code identical to that of the reintroduced board is explicitly shown.