A method of manufacturing a device module, the method comprising: preparing: a. a device comprising a sensor, an electronic device, or a circuit board, b. a flexible external connection including a lead-out portion and an embedded portion, the embedded portion being connected to the device, and c. a base being formed of a flexible film of plastics material and including a base body and an affixed portion contiguous with the base body; characterised by the steps of: fixing the device to the base body with an adhesive; fixing the embedded portion of the flexible external connection to the base body with an adhesive such that the embedded portion extends along the base body from the device to the affixed portion; fixing the lead-out portion of the external connection onto the affixed portion of the base with an adhesive; placing the base body, the device, and the embedded portion of the external connection in a second die; placing the affixed portion of the base and the lead-out portion of the external connection between a split face of a first die and a split face of the second die; closing the first and second dies so as to i. place the base body, the device, and the embedded portion of the flexible external connection in a cavity of the first and second dies and ii. hold the affixed portion of the base and the lead-out portion of the flexible external connection in a gap between the split faces of the first and second dies or between the split face of the first die and the base; and injecting a plastic material onto the base body in the cavity to insert-mould the device and the embedded portion of the flexible external connection in the plastic material. preparing: a. a device comprising a sensor, an electronic device, or a circuit board, b. a flexible external connection including a lead-out portion and an embedded portion, the embedded portion being connected to the device, and c. a base being formed of a flexible film of plastics material and including a base body and an affixed portion contiguous with the base body; a. a device comprising a sensor, an electronic device, or a circuit board, b. a flexible external connection including a lead-out portion and an embedded portion, the embedded portion being connected to the device, and c. a base being formed of a flexible film of plastics material and including a base body and an affixed portion contiguous with the base body; fixing the device to the base body with an adhesive; fixing the embedded portion of the flexible external connection to the base body with an adhesive such that the embedded portion extends along the base body from the device to the affixed portion; fixing the lead-out portion of the external connection onto the affixed portion of the base with an adhesive; placing the base body, the device, and the embedded portion of the external connection in a second die; placing the affixed portion of the base and the lead-out portion of the external connection between a split face of a first die and a split face of the second die; closing the first and second dies so as to i. place the base body, the device, and the embedded portion of the flexible external connection in a cavity of the first and second dies and ii. hold the affixed portion of the base and the lead-out portion of the flexible external connection in a gap between the split faces of the first and second dies or between the split face of the first die and the base; and i. place the base body, the device, and the embedded portion of the flexible external connection in a cavity of the first and second dies and ii. hold the affixed portion of the base and the lead-out portion of the flexible external connection in a gap between the split faces of the first and second dies or between the split face of the first die and the base; and