A light emitting diode device comprising: a body having a cavity; a plurality of lead frames (13,14) in the cavity; a light emitting diode chip on at least one of the lead frames (13,14); a first molding member around the light emitting chip, in which a first metal oxide material is added to the first molding member; a second molding member on the first molding member and the light emitting chip; and a phosphor layer between the light emitting diode chip and the second molding member, in which a second metal oxide material is added to the second molding member, wherein the light emitting diode chip comprises: a light emitting diode structure including a first and second conductivity type compound semiconductor layers; and a reflective electrode layer under the light emitting diode structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting diode chip and a lateral side of the reflective electrode layer at a predetermined curvature, and has a shape of a concave curved surface, and wherein a bottom surface of the second molding member corresponding to the top surface of the first molding member includes a curved surface which is convex toward the first molding member, and wherein the phosphor layer is contacted with an upper surface of the light emitting diode chip, wherein the second molding member contacts with the first molding member and the top surface and lateral side of the phosphor layer, and wherein the second molding member does not contact with the side surfaces of the light emitting diode chip. a body having a cavity; a plurality of lead frames (13,14) in the cavity; a light emitting diode chip on at least one of the lead frames (13,14); a first molding member around the light emitting chip, in which a first metal oxide material is added to the first molding member; a second molding member on the first molding member and the light emitting chip; and a phosphor layer between the light emitting diode chip and the second molding member, in which a second metal oxide material is added to the second molding member, wherein the light emitting diode chip comprises: a light emitting diode structure including a first and second conductivity type compound semiconductor layers; and a reflective electrode layer under the light emitting diode structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting diode chip and a lateral side of the reflective electrode layer at a predetermined curvature, and has a shape of a concave curved surface, and wherein a bottom surface of the second molding member corresponding to the top surface of the first molding member includes a curved surface which is convex toward the first molding member, and wherein the phosphor layer is contacted with an upper surface of the light emitting diode chip, wherein the second molding member contacts with the first molding member and the top surface and lateral side of the phosphor layer, and wherein the second molding member does not contact with the side surfaces of the light emitting diode chip. a light emitting diode structure including a first and second conductivity type compound semiconductor layers; and a reflective electrode layer under the light emitting diode structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting diode chip and a lateral side of the reflective electrode layer at a predetermined curvature, and has a shape of a concave curved surface, and wherein a bottom surface of the second molding member corresponding to the top surface of the first molding member includes a curved surface which is convex toward the first molding member, and wherein the phosphor layer is contacted with an upper surface of the light emitting diode chip, wherein the second molding member contacts with the first molding member and the top surface and lateral side of the phosphor layer, and wherein the second molding member does not contact with the side surfaces of the light emitting diode chip.