A method for the inspection of wafers (6, 7), comprising the following steps: a) providing an inspection device (2, 8) which includes a passageway through which a wafer (6, 7) can pass in both directions, and which in a first operating mode inspects the front side and/or rear side of a wafer (6, 7) on passage of the same; b) providing a first wafer to be inspected; c) providing a second wafer to be inspected; d) guiding the first wafer to be inspected by means of a first transport device to a first end of the passageway; e) guiding the first wafer by means of the first transport device along the passageway up to a first reversing position after the second end of the passageway; f) guiding the first wafer by means of the first transport device back along the passageway and guiding the second wafer to be inspected by means of a second transport device behind the first wafer to the second end of the passageway; g) guiding the second wafer by means of the second transport device along the passageway up to a second reversing position after the first end of the passageway and meanwhile handing over the inspected first wafer by the first transport device to a take-off station and providing a next first wafer to be inspected; h) guiding the second wafer by means of the second transport device back along the passageway and guiding the first wafer to be inspected by means of the first transport device behind the second wafer to the first end of the passageway; i) guiding the first wafer by means of the first transport device along the passageway up to the first reversing position and meanwhile handing over the inspected second wafer by the second transport device to a take-off station and providing a next second wafer to be inspected; j) repeating the steps f) to i). a) providing an inspection device (2, 8) which includes a passageway through which a wafer (6, 7) can pass in both directions, and which in a first operating mode inspects the front side and/or rear side of a wafer (6, 7) on passage of the same; b) providing a first wafer to be inspected; c) providing a second wafer to be inspected; d) guiding the first wafer to be inspected by means of a first transport device to a first end of the passageway; e) guiding the first wafer by means of the first transport device along the passageway up to a first reversing position after the second end of the passageway; f) guiding the first wafer by means of the first transport device back along the passageway and guiding the second wafer to be inspected by means of a second transport device behind the first wafer to the second end of the passageway; g) guiding the second wafer by means of the second transport device along the passageway up to a second reversing position after the first end of the passageway and meanwhile handing over the inspected first wafer by the first transport device to a take-off station and providing a next first wafer to be inspected; h) guiding the second wafer by means of the second transport device back along the passageway and guiding the first wafer to be inspected by means of the first transport device behind the second wafer to the first end of the passageway; i) guiding the first wafer by means of the first transport device along the passageway up to the first reversing position and meanwhile handing over the inspected second wafer by the second transport device to a take-off station and providing a next second wafer to be inspected; j) repeating the steps f) to i).