A method for applying fluid discharged from a slot die applicator to a substrate and an elastic material, the slot die applicator including a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip; wherein the substrate has a first surface disposed opposite of a second surface and an unconstrained caliper, Hs, and wherein the elastic material has a maximum thickness, Et, the method comprising the steps of: advancing the substrate in a machine direction; advancing the elastic material in the machine direction; positioning the elastic material on the second surface of the substrate; engaging the substrate with a substrate carrier, the substrate carrier comprising: a non-compliant support surface and a pattern element, the pattern element including a pattern surface, the substrate carrier positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip of the slot die applicator that is less than the sum of the unconstrained caliper, Hs, of the substrate and the maximum thickness, Et, of the elastic material; advancing the second surface of the substrate and the elastic material past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; intermittently deflecting a first portion of the pattern surface toward the non-compliant support surface by advancing the substrate and the elastic material between the pattern element and the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and discharging fluid from the slot opening of the slot die applicator onto the elastic material and the second surface of the substrate. advancing the substrate in a machine direction; advancing the elastic material in the machine direction; positioning the elastic material on the second surface of the substrate; engaging the substrate with a substrate carrier, the substrate carrier comprising: a non-compliant support surface and a pattern element, the pattern element including a pattern surface, the substrate carrier positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip of the slot die applicator that is less than the sum of the unconstrained caliper, Hs, of the substrate and the maximum thickness, Et, of the elastic material; advancing the second surface of the substrate and the elastic material past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; intermittently deflecting a first portion of the pattern surface toward the non-compliant support surface by advancing the substrate and the elastic material between the pattern element and the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and discharging fluid from the slot opening of the slot die applicator onto the elastic material and the second surface of the substrate.