An LED package structure, comprising: a multilayered circuit board including a base layer, a plurality of testing pads (151, 152, 153), a first electrical connecting pad, a plurality of second electrical connecting pads and a solder mask layer disposed on a bottom surface of the base layer, a plurality of lighting elements (21, 22, 23) disposed on a top surface of the base layer; a control unit embedded in the base layer and electrically connected to the lighting elements (21, 22, 23); a reflecting unit disposed on a top surface of the multilayered circuit board and surrounding the lighting elements (21, 22, 23); a package unit covering the lighting elements (21, 22, 23); a plurality of test paths each in electrical connection with the first electrical connecting pad, one of the lighting elements (21, 22, 23) and one of the testing pads (151, 152, 153); and a plurality of operation paths each in electrical connection with the first electrical connecting pad, the control unit, one of the lighting elements (21, 22, 23) and one of the second electrical connecting pads, wherein a portion of the testing pads (151, 152, 153) is exposed from the solder mask layer to provide an outside electrical connection to each of the lighting elements (21, 22, 23) by the corresponding testing pad (151, 152, 153), such that the LED package structure is configured to be tested for obtaining respective characteristic parameter values of the lighting elements (21, 22, 23) after being packaged; and wherein the control unit is configured to record the characteristic parameter values of each of the lighting elements (21, 22, 23) and to calibrate the driving condition of each of the lighting elements (21, 22, 23) accordingly. a multilayered circuit board including a base layer, a plurality of testing pads (151, 152, 153), a first electrical connecting pad, a plurality of second electrical connecting pads and a solder mask layer disposed on a bottom surface of the base layer, a plurality of lighting elements (21, 22, 23) disposed on a top surface of the base layer; a control unit embedded in the base layer and electrically connected to the lighting elements (21, 22, 23); a reflecting unit disposed on a top surface of the multilayered circuit board and surrounding the lighting elements (21, 22, 23); a package unit covering the lighting elements (21, 22, 23); a plurality of test paths each in electrical connection with the first electrical connecting pad, one of the lighting elements (21, 22, 23) and one of the testing pads (151, 152, 153); and a plurality of operation paths each in electrical connection with the first electrical connecting pad, the control unit, one of the lighting elements (21, 22, 23) and one of the second electrical connecting pads, wherein a portion of the testing pads (151, 152, 153) is exposed from the solder mask layer to provide an outside electrical connection to each of the lighting elements (21, 22, 23) by the corresponding testing pad (151, 152, 153), such that the LED package structure is configured to be tested for obtaining respective characteristic parameter values of the lighting elements (21, 22, 23) after being packaged; and wherein the control unit is configured to record the characteristic parameter values of each of the lighting elements (21, 22, 23) and to calibrate the driving condition of each of the lighting elements (21, 22, 23) accordingly.