An MEMS sensor comprising: a first substrate; a second substrate; and a functional layer including a movable electrode unit and a fixed electrode unit (11, 13) which are interposed between the first substrate and the second substrate, wherein, each of support conductive units (12, 14, 17, 19) of the movable electrode unit and the fixed electrode unit (11, 13) is fixedly supported via a first insulating layer (3a, 3b, 3c) formed on a surface (1 a) of the first substrate, a second insulating layer, a lead layer (34, 35) and a connection electrode unit (31, 32) are formed on a surface of the second substrate, the lead layer (34, 35) being embedded in the second insulating layer, and the connection electrode unit (31, 32) making electrical connection with the lead layer (34, 35) and being individually connected to the support conductive units (12, 14, 17, 19), and the support conductive units (12, 14, 17, 19) are bonded to the connection region (31 b, 32b, 32e) of the connection electrode unit (31, 32); characterized in that a connection metal layer (41, 42) is formed on a surface of each of the support conductive units (12, 14, 17, 19) and is eutectic-bonded or diffusion-bonded to the connection region (31 b, 32b; 32e) of the connection electrode unit (31, 32), a frame layer is formed at the same thickness as the movable electrode unit and the fixed electrode unit (11, 13) and is made of the same material as the movable electrode unit and the fixed electrode unit (11, 13), the frame layer surrounding a movable region of the movable electrode unit, the first substrate is bonded to the frame layer in the outer circumference of the movable region via an insulating layer equal to the first insulating layer (3a, 3b, 3c), a seal electrode unit made of the same metal material as the connection electrode unit (31, 32) is formed on the surface of the second insulating layer, a seal metal layer (43, 45) made of the same metal material as the connection metal layer (41, 42) is formed on a surface of the frame layer, and the seal electrode unit and the seal metal layer (43, 45) are eutectic-bonded or diffusion-bonded to each other to form a seal layer to surround the outer circumference of the movable region, a first concave portion and a second concave portion, which penetrate up to a surface of the lead layer and which are open toward the first substrate, are formed on the surface of the second insulating layer, the connection electrode unit includes a first concave region and a second concave region, which emulate said concave portions (51, 52) and which are connected to the lead layer at an interval, the connection region connecting between the concave regions (32c, 32d) and being arranged on the surface of the second insulating layer located between the first concave portion and the second concave portion. a first substrate; a second substrate; and a functional layer including a movable electrode unit and a fixed electrode unit (11, 13) which are interposed between the first substrate and the second substrate, wherein, each of support conductive units (12, 14, 17, 19) of the movable electrode unit and the fixed electrode unit (11, 13) is fixedly supported via a first insulating layer (3a, 3b, 3c) formed on a surface (1 a) of the first substrate, a second insulating layer, a lead layer (34, 35) and a connection electrode unit (31, 32) are formed on a surface of the second substrate, the lead layer (34, 35) being embedded in the second insulating layer, and the connection electrode unit (31, 32) making electrical connection with the lead layer (34, 35) and being individually connected to the support conductive units (12, 14, 17, 19), and the support conductive units (12, 14, 17, 19) are bonded to the connection region (31 b, 32b, 32e) of the connection electrode unit (31, 32); characterized in that a connection metal layer (41, 42) is formed on a surface of each of the support conductive units (12, 14, 17, 19) and is eutectic-bonded or diffusion-bonded to the connection region (31 b, 32b; 32e) of the connection electrode unit (31, 32), a frame layer is formed at the same thickness as the movable electrode unit and the fixed electrode unit (11, 13) and is made of the same material as the movable electrode unit and the fixed electrode unit (11, 13), the frame layer surrounding a movable region of the movable electrode unit, the first substrate is bonded to the frame layer in the outer circumference of the movable region via an insulating layer equal to the first insulating layer (3a, 3b, 3c), a seal electrode unit made of the same metal material as the connection electrode unit (31, 32) is formed on the surface of the second insulating layer, a seal metal layer (43, 45) made of the same metal material as the connection metal layer (41, 42) is formed on a surface of the frame layer, and the seal electrode unit and the seal metal layer (43, 45) are eutectic-bonded or diffusion-bonded to each other to form a seal layer to surround the outer circumference of the movable region, a first concave portion and a second concave portion, which penetrate up to a surface of the lead layer and which are open toward the first substrate, are formed on the surface of the second insulating layer, the connection electrode unit includes a first concave region and a second concave region, which emulate said concave portions (51, 52) and which are connected to the lead layer at an interval, the connection region connecting between the concave regions (32c, 32d) and being arranged on the surface of the second insulating layer located between the first concave portion and the second concave portion.