A contact configured to electrically connect a conductor pattern of an electronic circuit board and a conductive member other than the electronic circuit board by being soldered to the conductor pattern and coming into contact with the conductive member, the contact comprising: a base portion; a contact portion; and a spring portion, wherein the base portion includes a bonding surface configured to be soldered to the conductor pattern, the contact portion is configured to come into contact with the conductive member, the spring portion is a portion interposed between the base portion and the contact portion, and is configured to press the contact portion toward the conductive member by elastically deforming in a case where the contact portion is in contact with the conductive member, the base portion, the contact portion, and the spring portion are integrally molded with a thin plate formed of a metal, the spring portion includes a first bending portion, a flat plate portion, and a second bending portion, the first bending portion is a portion extending from the base portion, and is configured to bend into a shape that forms a circular arc in which a thickness direction of the thin plate is a radial direction, the flat plate portion is configured to extend in a flat plate shape from a location on a side opposite to the base portion of the first bending portion, the second bending portion is a portion extending from a location on a side opposite to the first bending portion of the flat plate portion, and is configured to bend into a shape that forms a circular arc in which a thickness direction of the thin plate is a radial direction, of two surfaces on a front side and a back side of the thin plate, a surface that forms the bonding surface is defined as a first surface, and a surface on a back side of the first surface is defined as a second surface, the first bending portion is bent such that the first surface is on an outer peripheral side, the second bending portion is bent such that the second surface is on an outer peripheral side, the flat plate portion and the first bending portion are configured such that a ratio L/R1 of a length L between the first bending portion and the second bending portion of the flat plate portion to the curvature radius R1 satisfies 0 < L/R1 ≤ 4, characterised in that, the thin plate has a plate thickness t of from 0.10 to 0.15 mm and the first bending portion has a curvature radius R1 of from 0.6 to 1.0 mm. a base portion; a contact portion; and a spring portion, wherein the base portion includes a bonding surface configured to be soldered to the conductor pattern, the contact portion is configured to come into contact with the conductive member, the spring portion is a portion interposed between the base portion and the contact portion, and is configured to press the contact portion toward the conductive member by elastically deforming in a case where the contact portion is in contact with the conductive member, the base portion, the contact portion, and the spring portion are integrally molded with a thin plate formed of a metal, the spring portion includes a first bending portion, a flat plate portion, and a second bending portion, the first bending portion is a portion extending from the base portion, and is configured to bend into a shape that forms a circular arc in which a thickness direction of the thin plate is a radial direction, the flat plate portion is configured to extend in a flat plate shape from a location on a side opposite to the base portion of the first bending portion, the second bending portion is a portion extending from a location on a side opposite to the first bending portion of the flat plate portion, and is configured to bend into a shape that forms a circular arc in which a thickness direction of the thin plate is a radial direction, of two surfaces on a front side and a back side of the thin plate, a surface that forms the bonding surface is defined as a first surface, and a surface on a back side of the first surface is defined as a second surface, the first bending portion is bent such that the first surface is on an outer peripheral side, the second bending portion is bent such that the second surface is on an outer peripheral side, the flat plate portion and the first bending portion are configured such that a ratio L/R1 of a length L between the first bending portion and the second bending portion of the flat plate portion to the curvature radius R1 satisfies 0 < L/R1 ≤ 4, characterised in that, the thin plate has a plate thickness t of from 0.10 to 0.15 mm and the first bending portion has a curvature radius R1 of from 0.6 to 1.0 mm.