A method to prevent moisture and oxygen ingression into an electronic or optoelectronic device by encapsulating the electronic or optoelectronic device in a curable barrier composition that is later cured, the curable barrier composition comprising (a) an aromatic compound with meta-substituted reactive groups having the structure: in which R 1, R 2, R 3, R 4 are selected from the group consisting hydrogen, halogen, cyano, alkyl, aryl, and substituted alkyl or aryl groups, R 5, R 6 are divalent hydrocarbon linkers having the general structure -C n H 2n -, where n = 0 - 4, in which any two of R 1, R 2, R 3, R 4, R 5 and R 6 may form part of the same cyclic structure; L 1, L 2, L 3, L 4, L 5, L 6 are a direct bond or a divalent linking group selected from the group consisting of RF and RF' are curable functionalities selected from the group consisting of in which the hydrogens on the structures may be substituted by one or more alkyl or halogen groups; (b) a cationic or radical initiator or both, (c) one or more fillers, selected from the group consisting of ground quartz, fused silica, amorphous silica, talc, glass beads, graphite, carbon black, alumina, clays, mica, vermiculite, aluminum nitride, boron nitride; silver, copper, gold, tin, tin/lead alloys, poly(tetrachloroethylene), poly(chlorotriflouroethylene), poly(vinylidene chloride), CaO, BaO, Na 2 SO 4, CaSO 4, MgSO 4, zeolites, silica gel, P 2 O 5, CaCl 2, and Al 2 O 3, (d) optionally one or more adhesion promoters. (a) an aromatic compound with meta-substituted reactive groups having the structure: in which R 1, R 2, R 3, R 4 are selected from the group consisting hydrogen, halogen, cyano, alkyl, aryl, and substituted alkyl or aryl groups, R 5, R 6 are divalent hydrocarbon linkers having the general structure -C n H 2n -, where n = 0 - 4, in which any two of R 1, R 2, R 3, R 4, R 5 and R 6 may form part of the same cyclic structure; L 1, L 2, L 3, L 4, L 5, L 6 are a direct bond or a divalent linking group selected from the group consisting of RF and RF' are curable functionalities selected from the group consisting of in which the hydrogens on the structures may be substituted by one or more alkyl or halogen groups; R 1, R 2, R 3, R 4 are selected from the group consisting hydrogen, halogen, cyano, alkyl, aryl, and substituted alkyl or aryl groups, R 5, R 6 are divalent hydrocarbon linkers having the general structure -C n H 2n -, where n = 0 - 4, in which any two of R 1, R 2, R 3, R 4, R 5 and R 6 may form part of the same cyclic structure; L 1, L 2, L 3, L 4, L 5, L 6 are a direct bond or a divalent linking group selected from the group consisting of RF and RF' are curable functionalities selected from the group consisting of in which the hydrogens on the structures may be substituted by one or more alkyl or halogen groups; (b) a cationic or radical initiator or both, (c) one or more fillers, selected from the group consisting of ground quartz, fused silica, amorphous silica, talc, glass beads, graphite, carbon black, alumina, clays, mica, vermiculite, aluminum nitride, boron nitride; silver, copper, gold, tin, tin/lead alloys, poly(tetrachloroethylene), poly(chlorotriflouroethylene), poly(vinylidene chloride), CaO, BaO, Na 2 SO 4, CaSO 4, MgSO 4, zeolites, silica gel, P 2 O 5, CaCl 2, and Al 2 O 3, (d) optionally one or more adhesion promoters.