A sputtering source conceived to sputter coat a substrate comprising: • two plate shaped targets (5, 7) extending along respective plate-planes (E 5, E 7), the sputtering surfaces (S 5, S 7) of said targets (5, 7) facing each other thereby defining, in between, a reaction space, said plate-planes (E 5, E 7) being mutually parallel or mutually inclined by at most 90°; • an anode arrangement (14, 14 5, 14 7); • a magnet arrangement (18 5, 18 7) along each of said targets (5, 7) and opposite to the respective sputtering surfaces (S 5, S 7), each magnet arrangement (18 5, 18 7) generating a magnetic field in said reaction space impinging on and/ or emanating from and distributed along at least a predominant part of the respective sputtering surfaces (S 5, S 7); • an open coating outlet area from said reaction space to a coating space, limited by respective areas of mutually facing rims (9, 10) of said two plate shaped targets (5, 7); • said sputtering surfaces (S 5, S 7) of said targets (5, 7) transiting into respective side surface areas (L 5, L 7) of said targets (5, 7) along said mutually facing rims (9, 10) by respective transition surface (T 5, T 7) areas of said targets (5, 7), said transition surface (T 5, T 7) areas having a smaller radius of curvature than the adjacent areas of the respective sputtering surface (S 5, S 7); • a projecting catcher plate arrangement (20 5, 20 7) along each of said rims (9, 10) and distant from the respective one of said targets (5, 7) and respectively projecting in a direction from said rims (9, 10) towards each other into said open coating outlet area, thereby restricting said open coating outlet area as limited by said mutually facing rims (9, 10) of said two plate shaped targets (5, 7), characterized by the fact that • said projecting catcher plate arrangement (20 5, 20 7) has an overall surface which predominantly consists of a first extended surface area and of an opposite second extended surface area, said first extended surface area being exclusively exposed to said reaction space whereas said second extended surface area being exclusively exposed to said coating space. • two plate shaped targets (5, 7) extending along respective plate-planes (E 5, E 7), the sputtering surfaces (S 5, S 7) of said targets (5, 7) facing each other thereby defining, in between, a reaction space, said plate-planes (E 5, E 7) being mutually parallel or mutually inclined by at most 90°; • an anode arrangement (14, 14 5, 14 7); • a magnet arrangement (18 5, 18 7) along each of said targets (5, 7) and opposite to the respective sputtering surfaces (S 5, S 7), each magnet arrangement (18 5, 18 7) generating a magnetic field in said reaction space impinging on and/ or emanating from and distributed along at least a predominant part of the respective sputtering surfaces (S 5, S 7); • an open coating outlet area from said reaction space to a coating space, limited by respective areas of mutually facing rims (9, 10) of said two plate shaped targets (5, 7); • said sputtering surfaces (S 5, S 7) of said targets (5, 7) transiting into respective side surface areas (L 5, L 7) of said targets (5, 7) along said mutually facing rims (9, 10) by respective transition surface (T 5, T 7) areas of said targets (5, 7), said transition surface (T 5, T 7) areas having a smaller radius of curvature than the adjacent areas of the respective sputtering surface (S 5, S 7); • a projecting catcher plate arrangement (20 5, 20 7) along each of said rims (9, 10) and distant from the respective one of said targets (5, 7) and respectively projecting in a direction from said rims (9, 10) towards each other into said open coating outlet area, thereby restricting said open coating outlet area as limited by said mutually facing rims (9, 10) of said two plate shaped targets (5, 7), characterized by the fact that • said projecting catcher plate arrangement (20 5, 20 7) has an overall surface which predominantly consists of a first extended surface area and of an opposite second extended surface area, said first extended surface area being exclusively exposed to said reaction space whereas said second extended surface area being exclusively exposed to said coating space.