A method of fabricating a semiconductor assembly, comprising: providing a semiconductor element having a front surface, a rear surface remote from the front surface, and a plurality of conductive pads, each pad having a top surface exposed at the front surface and having a bottom surface remote from the top surface; forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface; forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces; forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad, wherein the step of forming at least one conductive element forms at least one conductive interconnect exposed at the rear surface for electrical connection to an external device, the at least one conductive interconnect extending at least into the opening, and at least one conductive via, each via extending within a respective hole and coupled to a respective conductive interconnect and a respective pad; and forming a dielectric region within the opening and forming an aperture extending through the dielectric region, the aperture having constant diameter or tapering in a direction towards the front surface and having a contour not conforming to a contour of the opening, wherein the step of forming the at least one conductive element forms a respective one of the conductive interconnects at least within the aperture, and wherein the step of forming the at least one conductive element forms at least one conductive contact coupled to the respective conductive interconnect and formed on an outer surface of the dielectric region, the at least one conductive contact being exposed at the rear surface, the conductive contact being wholly disposed within an area defined by the opening. providing a semiconductor element having a front surface, a rear surface remote from the front surface, and a plurality of conductive pads, each pad having a top surface exposed at the front surface and having a bottom surface remote from the top surface; forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface; forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces; forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad, wherein the step of forming at least one conductive element forms at least one conductive interconnect exposed at the rear surface for electrical connection to an external device, the at least one conductive interconnect extending at least into the opening, and at least one conductive via, each via extending within a respective hole and coupled to a respective conductive interconnect and a respective pad; and forming a dielectric region within the opening and forming an aperture extending through the dielectric region, the aperture having constant diameter or tapering in a direction towards the front surface and having a contour not conforming to a contour of the opening, wherein the step of forming the at least one conductive element forms a respective one of the conductive interconnects at least within the aperture, and wherein the step of forming the at least one conductive element forms at least one conductive contact coupled to the respective conductive interconnect and formed on an outer surface of the dielectric region, the at least one conductive contact being exposed at the rear surface, the conductive contact being wholly disposed within an area defined by the opening.