A method of manufacturing a plurality of through-holes in a layer of material, wherein an intermediate product is subjected to a plurality of method steps, the intermediate product - defining a first side and a second side, and - comprises a base substrate, said base substrate comprising a base material, wherein at the first side the surface of the base substrate defines a main plane; wherein the plurality of method steps comprises the steps of - providing the base substrate of the intermediate product at the first side with a plurality of pits in said base material, and - providing the base substrate with the layer of first material at the first side of the intermediate product, the first material being different from the base material so as to result in the intermediate product having pits comprising a layer of said first material, - providing a plurality of holes in the layer of first material at the central locations of the pits, - etching the base material at the central locations of the pits of the intermediate product so as to form a cavity separated from the first side by an aperture defining a waist, - depositing a second layer of a second material on the base material in the cavity, the second material being different from the base material, - subjecting the first side of the base substrate provided with the second layer of material as the layer to a step of directional dry etching using the aperture as the opening of a shadow mask, where said directional etching is performed with said direction being at an angle α to the normal to the base main plane of at least 5°, to provide through-holes (1 32) in the second layer of material, and - removing base material at the location of the pyramidal pit. - defining a first side and a second side, and - comprises a base substrate, said base substrate comprising a base material, wherein at the first side the surface of the base substrate defines a main plane; wherein the plurality of method steps comprises the steps of - providing the base substrate of the intermediate product at the first side with a plurality of pits in said base material, and - providing the base substrate with the layer of first material at the first side of the intermediate product, the first material being different from the base material so as to result in the intermediate product having pits comprising a layer of said first material, - providing a plurality of holes in the layer of first material at the central locations of the pits, - etching the base material at the central locations of the pits of the intermediate product so as to form a cavity separated from the first side by an aperture defining a waist, - depositing a second layer of a second material on the base material in the cavity, the second material being different from the base material, - subjecting the first side of the base substrate provided with the second layer of material as the layer to a step of directional dry etching using the aperture as the opening of a shadow mask, where said directional etching is performed with said direction being at an angle α to the normal to the base main plane of at least 5°, to provide through-holes (1 32) in the second layer of material, and - removing base material at the location of the pyramidal pit.