A liquid ejecting head comprising: a head chip that ejects a liquid from a liquid ejecting surface, in which a liquid connection is disposed on the side opposite to the liquid ejecting surface so that the supply and discharge of the liquid is performed; a first flow path member in which a first flow path for the liquid is disposed; a second flow path member that is bonded to the first flow path member, in which an accommodating space that is open to the side opposite to the first flow path member and accommodates the head chip and a second flow path for the liquid that is open into the accommodating space and is connected to the first flow path are disposed; a pressure generating unit which generates pressure change in a flow path in the head chip; a wiring member that is connected to the pressure generating unit; a wiring substrate that is arranged between the first flow path member and the second flow path member; and a seal member that is arranged between the wiring substrate and the first flow path member to connect the first flow path and the second flow path, wherein a protrusion that protrudes to the second flow path member side and a communicating path that is open to a surface of the protrusion facing the second flow path member to penetrate in the direction intersecting with the liquid ejecting surface are disposed in the seal member, wherein a through-hole, into which the protrusion of the seal member is inserted, is disposed in the wiring substrate, wherein the first flow path and the second flow path communicate with each other via the communicating path that is formed in the protrusion which is inserted into the through-hole, wherein the head chip is accommodated in the accommodating space and the liquid connection is connected to the second flow path, wherein a first insertion hole, into which the wiring member is inserted, is disposed in the wiring substrate, wherein a second insertion hole that is open to the accommodating space and the wiring substrate side for the wiring member to be inserted is formed in the second flow path member, and wherein the wiring member is inserted into the first insertion hole and the second insertion hole to be bonded to the first flow path member side of the wiring substrate, and wherein the seal member includes: a plate-shaped base portion where the protrusion and the communicating path are disposed; and a wall that protrudes from the base portion to the first flow path member side and is formed to have an annular shape, and wherein the first flow path member is in contact with at least an outer side of the wall. a head chip that ejects a liquid from a liquid ejecting surface, in which a liquid connection is disposed on the side opposite to the liquid ejecting surface so that the supply and discharge of the liquid is performed; a first flow path member in which a first flow path for the liquid is disposed; a second flow path member that is bonded to the first flow path member, in which an accommodating space that is open to the side opposite to the first flow path member and accommodates the head chip and a second flow path for the liquid that is open into the accommodating space and is connected to the first flow path are disposed; a pressure generating unit which generates pressure change in a flow path in the head chip; a wiring member that is connected to the pressure generating unit; a wiring substrate that is arranged between the first flow path member and the second flow path member; and a seal member that is arranged between the wiring substrate and the first flow path member to connect the first flow path and the second flow path, wherein a protrusion that protrudes to the second flow path member side and a communicating path that is open to a surface of the protrusion facing the second flow path member to penetrate in the direction intersecting with the liquid ejecting surface are disposed in the seal member, wherein a through-hole, into which the protrusion of the seal member is inserted, is disposed in the wiring substrate, wherein the first flow path and the second flow path communicate with each other via the communicating path that is formed in the protrusion which is inserted into the through-hole, wherein the head chip is accommodated in the accommodating space and the liquid connection is connected to the second flow path, wherein a first insertion hole, into which the wiring member is inserted, is disposed in the wiring substrate, wherein a second insertion hole that is open to the accommodating space and the wiring substrate side for the wiring member to be inserted is formed in the second flow path member, and wherein the wiring member is inserted into the first insertion hole and the second insertion hole to be bonded to the first flow path member side of the wiring substrate, and wherein the seal member includes: a plate-shaped base portion where the protrusion and the communicating path are disposed; and a wall that protrudes from the base portion to the first flow path member side and is formed to have an annular shape, and wherein the first flow path member is in contact with at least an outer side of the wall. a plate-shaped base portion where the protrusion and the communicating path are disposed; and a wall that protrudes from the base portion to the first flow path member side and is formed to have an annular shape, and wherein the first flow path member is in contact with at least an outer side of the wall.