A method for changing parameters for controlling a transfer of solder paste through apertures of a stencil onto a printed circuit board (150, 250), the method comprising calculating an area ratio of the apertures of the stencil based on a stencil design data of the stencil and on a printed circuit board design data of the printed circuit board (150, 250), wherein the area ratio for an aperture of the stencil is defined by a ratio between (a) an area of the sidewall of the aperture and (b) a spatial overlap area between the opening of the aperture and a corresponding pad (253, 255, 257, 259) on the printed circuit board (150, 250) to which the aperture is assigned and onto which the solder paste is to be transferred, identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the identified first subareas (256, 258) are assigned to surface areas of the stencil in which the apertures in the stencil have a comparatively small area ratio, identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the identified second subareas (252, 254) are assigned to surface areas of the stencil in which the apertures have a comparatively large area ratio, and wherein the first repeatability is smaller than the second repeatability, transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 254), thereby excluding the amount of solder paste which has been transferred to the first subareas (256, 258). calculating an area ratio of the apertures of the stencil based on a stencil design data of the stencil and on a printed circuit board design data of the printed circuit board (150, 250), wherein the area ratio for an aperture of the stencil is defined by a ratio between (a) an area of the sidewall of the aperture and (b) a spatial overlap area between the opening of the aperture and a corresponding pad (253, 255, 257, 259) on the printed circuit board (150, 250) to which the aperture is assigned and onto which the solder paste is to be transferred, (a) an area of the sidewall of the aperture and (b) a spatial overlap area between the opening of the aperture and a corresponding pad (253, 255, 257, 259) on the printed circuit board (150, 250) to which the aperture is assigned and onto which the solder paste is to be transferred, identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the identified first subareas (256, 258) are assigned to surface areas of the stencil in which the apertures in the stencil have a comparatively small area ratio, identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the identified second subareas (252, 254) are assigned to surface areas of the stencil in which the apertures have a comparatively large area ratio, and wherein the first repeatability is smaller than the second repeatability, transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 254), thereby excluding the amount of solder paste which has been transferred to the first subareas (256, 258).