Method for arranging a circuit carrier comprising at least one semiconductor light source in a specific position relative to an optical system of an illumination device of a motor vehicle, wherein - a target position of a light-emitting region of the at least one semiconductor light source is specified in relation to at least two bores (33, 35) in the circuit carrier, and - the at least one semiconductor light source and the bores (33, 35) are fixed relative to one another depending on the target position, characterized in that - a stop element (140, 142) is inserted into each of the bores (33, 35) and fixed therein, each of the stop elements (140, 142) being assigned to a stop region (26; 28) of the optical system, - the circuit carrier is placed on a stop surface of the optical system that has at least two stop ribs protruding therefrom, such that defined contact regions of the circuit carrier rest on the stop ribs, and - a relative movement of the circuit carrier and the optical system relative to one another is carried out in such a way that the stop elements (140, 142) abut the relevant stop region (26, 28), the optical system has an optical active portion as an integral component, the stop regions and on the optical system are arranged in one piece on a narrow or end face of a base plate of the optical system, which face is arranged in a light exit direction of the optical system, the stop surface of the optical system that has the stop ribs is arranged on an upper face of the base plate of the optical system, the stop surface is used for adhesive bonding to a lower face of the circuit carrier, and in that at least one adhesive platform is formed on the stop surface, which platform is arranged below an adhesive hole or in an edge region of the circuit carrier and which has an adhesive surface which is raised with respect to the stop surface and is arranged closer to the lower face of the circuit carrier than the stop surface. - a target position of a light-emitting region of the at least one semiconductor light source is specified in relation to at least two bores (33, 35) in the circuit carrier, and - the at least one semiconductor light source and the bores (33, 35) are fixed relative to one another depending on the target position, characterized in that - a stop element (140, 142) is inserted into each of the bores (33, 35) and fixed therein, each of the stop elements (140, 142) being assigned to a stop region (26; 28) of the optical system, - the circuit carrier is placed on a stop surface of the optical system that has at least two stop ribs protruding therefrom, such that defined contact regions of the circuit carrier rest on the stop ribs, and - a relative movement of the circuit carrier and the optical system relative to one another is carried out in such a way that the stop elements (140, 142) abut the relevant stop region (26, 28), the optical system has an optical active portion as an integral component, the stop regions and on the optical system are arranged in one piece on a narrow or end face of a base plate of the optical system, which face is arranged in a light exit direction of the optical system, the stop surface of the optical system that has the stop ribs is arranged on an upper face of the base plate of the optical system, the stop surface is used for adhesive bonding to a lower face of the circuit carrier, and in that at least one adhesive platform is formed on the stop surface, which platform is arranged below an adhesive hole or in an edge region of the circuit carrier and which has an adhesive surface which is raised with respect to the stop surface and is arranged closer to the lower face of the circuit carrier than the stop surface.