A light-emitting device (4, 4A, 8) comprising: a package which is translucent; a semiconductor light-emitting element provided in a recess (11, 11A, 13) in the package; a sealing member for sealing said semiconductor light-emitting element and packaging the recess; wherein the recess (11, 11A, 13) includes a bottom surface (11a, 13a) on which said semiconductor light-emitting element is mounted and a side surface surrounding the bottom surface, said sealing member includes a first wavelength conversion material for converting the wavelength of the light emitted by said semiconductor light-emitting element to a predetermined wavelength, characterised by further comprising a sintered material film (40, 40A) formed on a back surface of said package, for converting a wavelength of light emitted by said semiconductor light-emitting element to a predetermined wavelength, wherein said sintered material film (40, 40A) is composed of a second wavelength conversion material for converting, to the predetermined wavelength, the wavelength of the light emitted by said semiconductor light-emitting element and transmitted by said package, and a binder for sintering made of an inorganic material, and by further comprising a groove (12, 12A) formed in the back surface of the package, for holding a third wavelength conversion material for converting the wavelength of the light emitted by said semiconductor light-emitting element to the predetermined wavelength. a package which is translucent; a semiconductor light-emitting element provided in a recess (11, 11A, 13) in the package; a sealing member for sealing said semiconductor light-emitting element and packaging the recess; wherein the recess (11, 11A, 13) includes a bottom surface (11a, 13a) on which said semiconductor light-emitting element is mounted and a side surface surrounding the bottom surface, said sealing member includes a first wavelength conversion material for converting the wavelength of the light emitted by said semiconductor light-emitting element to a predetermined wavelength, characterised by further comprising a sintered material film (40, 40A) formed on a back surface of said package, for converting a wavelength of light emitted by said semiconductor light-emitting element to a predetermined wavelength, wherein said sintered material film (40, 40A) is composed of a second wavelength conversion material for converting, to the predetermined wavelength, the wavelength of the light emitted by said semiconductor light-emitting element and transmitted by said package, and a binder for sintering made of an inorganic material, and by further comprising a groove (12, 12A) formed in the back surface of the package, for holding a third wavelength conversion material for converting the wavelength of the light emitted by said semiconductor light-emitting element to the predetermined wavelength. a sintered material film (40, 40A) formed on a back surface of said package, for converting a wavelength of light emitted by said semiconductor light-emitting element to a predetermined wavelength, wherein said sintered material film (40, 40A) is composed of a second wavelength conversion material for converting, to the predetermined wavelength, the wavelength of the light emitted by said semiconductor light-emitting element and transmitted by said package, and a binder for sintering made of an inorganic material, and by further comprising a groove (12, 12A) formed in the back surface of the package, for holding a third wavelength conversion material for converting the wavelength of the light emitted by said semiconductor light-emitting element to the predetermined wavelength. a groove (12, 12A) formed in the back surface of the package, for holding a third wavelength conversion material for converting the wavelength of the light emitted by said semiconductor light-emitting element to the predetermined wavelength.