An antenna coupler for connecting a high frequency antenna to a device to which a high voltage may be galvanically applied during operation, comprising - a multilayer printed circuit board having conductor levels that are electrically insulated from one another in the depth direction (z) of the multilayer printed circuit board, - at least one first high frequency line (3a, 3b) that is coupleable or coupled to the high frequency antenna in a first conductor level, - at least one second high frequency line (4a, 4b) that is coupleable or coupled on the device side in a second conductor level of the multilayer printed circuit board, wherein the multilayer printed circuit board has an electrically insulating printed circuit board core layer, - wherein the first and second conductor levels extend on the same side of the two sides of the printed circuit board core layer, - wherein the second high frequency line (4a, 4b) that is coupleable or coupled on the device side is situated at a greater distance from the printed circuit board core layer than is the first high frequency line (3a, 3b), and - wherein the antenna coupler has an electrically conductive shielding structure, part of which extends on the opposite, other of the two sides of the printed circuit board core layer and which is designed for shielding the first high frequency line (3a, 3b) from interaction with the conduction of high frequency signals, characterized in that - the second high frequency line (4a, 4b) is situated on an outer surface of the multilayer printed circuit board, - the shielding structure has a metal surface that partially sheathes the first high frequency line (3a, 3b), - wherein the second high frequency line is electrically conductively connected by its outer conductor, through the printed circuit board core layer, to the metal surface on the opposite, other of the two sides of the printed circuit board core layer, and the first high frequency line (3a, 3b) is at the same time insulated with respect to the second high frequency line (4a, 4b) and with respect to the metal surface. - a multilayer printed circuit board having conductor levels that are electrically insulated from one another in the depth direction (z) of the multilayer printed circuit board, - at least one first high frequency line (3a, 3b) that is coupleable or coupled to the high frequency antenna in a first conductor level, - at least one second high frequency line (4a, 4b) that is coupleable or coupled on the device side in a second conductor level of the multilayer printed circuit board, - wherein the first and second conductor levels extend on the same side of the two sides of the printed circuit board core layer, - wherein the second high frequency line (4a, 4b) that is coupleable or coupled on the device side is situated at a greater distance from the printed circuit board core layer than is the first high frequency line (3a, 3b), and - wherein the antenna coupler has an electrically conductive shielding structure, part of which extends on the opposite, other of the two sides of the printed circuit board core layer and which is designed for shielding the first high frequency line (3a, 3b) from interaction with the conduction of high frequency signals, characterized in that - the second high frequency line (4a, 4b) is situated on an outer surface of the multilayer printed circuit board, - the shielding structure has a metal surface that partially sheathes the first high frequency line (3a, 3b), - wherein the second high frequency line is electrically conductively connected by its outer conductor, through the printed circuit board core layer, to the metal surface on the opposite, other of the two sides of the printed circuit board core layer, and the first high frequency line (3a, 3b) is at the same time insulated with respect to the second high frequency line (4a, 4b) and with respect to the metal surface.