An electronic device comprising: a housing that includes: a first surface, a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces (111, 112); a printed circuit board, PCB, that is disposed inside the housing and includes at least one antenna unit; and a communication circuit that is disposed at least one of inside the PCB or between the PCB and the housing, wherein the PCB includes: a first substrate, a second substrate facing the first substrate, and a spacer disposed between the first and second substrates (121, 123), the spacer including an opening extending from the first substrate to the second substrate, and wherein a side surface of an inner space of the opening of the spacer is plated or surrounded by a conductive material, wherein each of the at least one antenna unit (124, 125) includes: a first conductive member (124-1, 125-1) formed on the first substrate, a second conductive member (124-2, 125-2) formed on the second substrate and facing the first conductive member (124-1, 125-1) through the opening, and a feeder (124-3, 125-3) connecting the second conductive member (124-2, 125-2) to the communication circuit, and wherein the communication circuit is configured to feed to the feeder (124-3, 125-3) and is configured to at least one of transmit or receive a signal of a specified frequency band through an electrical path formed through the feeder (124-3, 125-3) and the second conductive member (124-2, 125-2). a housing that includes: a first surface, a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces (111, 112); a first surface, a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces (111, 112); a printed circuit board, PCB, that is disposed inside the housing and includes at least one antenna unit; and a communication circuit that is disposed at least one of inside the PCB or between the PCB and the housing, wherein the PCB includes: a first substrate, a second substrate facing the first substrate, and a spacer disposed between the first and second substrates (121, 123), the spacer including an opening extending from the first substrate to the second substrate, and wherein a side surface of an inner space of the opening of the spacer is plated or surrounded by a conductive material, a first substrate, a second substrate facing the first substrate, and a spacer disposed between the first and second substrates (121, 123), the spacer including an opening extending from the first substrate to the second substrate, and wherein a side surface of an inner space of the opening of the spacer is plated or surrounded by a conductive material, wherein each of the at least one antenna unit (124, 125) includes: a first conductive member (124-1, 125-1) formed on the first substrate, a second conductive member (124-2, 125-2) formed on the second substrate and facing the first conductive member (124-1, 125-1) through the opening, and a feeder (124-3, 125-3) connecting the second conductive member (124-2, 125-2) to the communication circuit, and a first conductive member (124-1, 125-1) formed on the first substrate, a second conductive member (124-2, 125-2) formed on the second substrate and facing the first conductive member (124-1, 125-1) through the opening, and a feeder (124-3, 125-3) connecting the second conductive member (124-2, 125-2) to the communication circuit, and wherein the communication circuit is configured to feed to the feeder (124-3, 125-3) and is configured to at least one of transmit or receive a signal of a specified frequency band through an electrical path formed through the feeder (124-3, 125-3) and the second conductive member (124-2, 125-2).