A flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object, wherein said ultrasound transducer comprises an integrated circuit structure and a multi-layered structure, said multi-layered structure comprising an array of ultrasound transducing elements arranged in a first layer structure and configured for generating ultrasonic energy propagating along a positive direction of a main transducer axis Z and an array of control circuits arranged in a second layer structure, and wherein the array of control circuits and the integrated circuit structure are configured for operating the array of ultrasound transducing elements in said first layer structure; and wherein said multi-layered structure further comprises at least one flexible layer (8, 9) arranged so that the bending flexibility of the multi-layered structure permits the ultrasound transducer to form a continuous contact with said curved object during operation; wherein the second layer structure is arranged at a position that is further along a positive direction of the main transducer axis Z than a backplane flexible layer of the at least one flexible layer; wherein said multi-layered structure further comprises an acoustic backing layer arranged at a position that is further along a negative direction of the main transducer axis Z than said first layer structure for reducing the acoustic transmission directed away from said curved object during operation; wherein said acoustic backing layer is an acoustic damping layer or an acoustic reflection layer in the form of a Bragg stack, wherein said Bragg stack comprises multiple layers of alternating high and low acoustic impedance materials; wherein the integrated circuit structure comprises a plurality of Application Specific Integrated Circuits (ASIC), and wherein at least one ASIC supports a plurality of individual control circuits; and wherein said plurality of Application Specific Integrated Circuits (ASIC) are mounted as discrete elements at a position that is further along a negative direction of the main transducer axis Z than said backplane flexible layer. an array of ultrasound transducing elements arranged in a first layer structure and configured for generating ultrasonic energy propagating along a positive direction of a main transducer axis Z and an array of control circuits arranged in a second layer structure, and wherein the array of control circuits and the integrated circuit structure are configured for operating the array of ultrasound transducing elements in said first layer structure; and wherein said multi-layered structure further comprises at least one flexible layer (8, 9) arranged so that the bending flexibility of the multi-layered structure permits the ultrasound transducer to form a continuous contact with said curved object during operation; wherein the second layer structure is arranged at a position that is further along a positive direction of the main transducer axis Z than a backplane flexible layer of the at least one flexible layer; wherein said multi-layered structure further comprises an acoustic backing layer arranged at a position that is further along a negative direction of the main transducer axis Z than said first layer structure for reducing the acoustic transmission directed away from said curved object during operation; wherein said acoustic backing layer is an acoustic damping layer or an acoustic reflection layer in the form of a Bragg stack, wherein said Bragg stack comprises multiple layers of alternating high and low acoustic impedance materials; wherein the integrated circuit structure comprises a plurality of Application Specific Integrated Circuits (ASIC), and wherein at least one ASIC supports a plurality of individual control circuits; and wherein said plurality of Application Specific Integrated Circuits (ASIC) are mounted as discrete elements at a position that is further along a negative direction of the main transducer axis Z than said backplane flexible layer.