An electronic device, comprising: a housing at least partially comprising a conductive portion; an antenna module disposed in an internal space of the housing, wherein the antenna module comprises: a printed circuit board comprising a plurality of insulating layers (5901, 5902), and at least one first conductive patch disposed at a first insulating layer of the plurality of insulating layers (5901, 5902), wherein the at least one first conductive patch comprises: a first feeding point disposed on a first imaginary line passing through the center of the first conductive patch, and a second feeding point disposed on a second imaginary line passing through the center of the first conductive patch and perpendicular to the first imaginary line, wherein the first feeding point and the second feeding point have a same first vertical distance from a first side of the printed circuit board adjacent to the conductive portion, wherein at least one second conductive patch is overlapped at least partially so as to have the same center as that of the first conductive patch when viewed from above the first conductive patch in a second insulating layer different from the first insulating layer, wherein the at least one second conductive patch comprises: a third feeding point disposed on the first imaginary line, and a fourth feeding point disposed on the second imaginary line, and wherein the third feeding point and the fourth feeding point have the same second vertical distance longer than the first vertical distance from the first side; and wherein the antenna module further comprises a wireless communication circuit configured to: transmit and/or receive a first signal of a first frequency band through the at least one first conductive patch, and transmit and/or receive a second signal of a second frequency band lower than the first frequency band through the at least one second conductive patch. a housing at least partially comprising a conductive portion; an antenna module disposed in an internal space of the housing, wherein the antenna module comprises: a printed circuit board comprising a plurality of insulating layers (5901, 5902), and at least one first conductive patch disposed at a first insulating layer of the plurality of insulating layers (5901, 5902), a printed circuit board comprising a plurality of insulating layers (5901, 5902), and at least one first conductive patch disposed at a first insulating layer of the plurality of insulating layers (5901, 5902), wherein the at least one first conductive patch comprises: a first feeding point disposed on a first imaginary line passing through the center of the first conductive patch, and a second feeding point disposed on a second imaginary line passing through the center of the first conductive patch and perpendicular to the first imaginary line, a first feeding point disposed on a first imaginary line passing through the center of the first conductive patch, and a second feeding point disposed on a second imaginary line passing through the center of the first conductive patch and perpendicular to the first imaginary line, wherein the first feeding point and the second feeding point have a same first vertical distance from a first side of the printed circuit board adjacent to the conductive portion, wherein at least one second conductive patch is overlapped at least partially so as to have the same center as that of the first conductive patch when viewed from above the first conductive patch in a second insulating layer different from the first insulating layer, wherein the at least one second conductive patch comprises: a third feeding point disposed on the first imaginary line, and a fourth feeding point disposed on the second imaginary line, and a third feeding point disposed on the first imaginary line, and a fourth feeding point disposed on the second imaginary line, and wherein the third feeding point and the fourth feeding point have the same second vertical distance longer than the first vertical distance from the first side; and wherein the antenna module further comprises a wireless communication circuit configured to: transmit and/or receive a first signal of a first frequency band through the at least one first conductive patch, and transmit and/or receive a second signal of a second frequency band lower than the first frequency band through the at least one second conductive patch. transmit and/or receive a first signal of a first frequency band through the at least one first conductive patch, and transmit and/or receive a second signal of a second frequency band lower than the first frequency band through the at least one second conductive patch.