A creation method of component mounting coordinates which automatically creates coordinate data of each mounting position of a plurality of components on a circuit board using a component table which associates component identification information with each item of which it is possible to identify each of the plurality of components to be mounted onto the circuit board, and component data names which are attached to component data of the plurality of components, the method comprising: acquiring a pad arrangement image which represents the component identification information which is displayed on the circuit board, and arrangements of pads which are formed on the circuit board and to which connecting sections of the plurality of components are connected; and creating a component template image which represents arrangements of the connecting sections of a relevant component based on shape data of the relevant component which is included in the component data to which the component data name corresponding to the component identification information is attached, and matching the component template image to the pad arrangement image in a vicinity of relevant component identification information to identify the pads to which the connecting sections of the relevant component are to be connected, and to further calculate the coordinate data of the relevant component on a premise of a state in which the connecting sections of the relevant component are caused to overlap the pads which are identified, wherein after carrying out a smoothing process on the component template image and the pad arrangement image, the component template image and the pad arrangement image are matched using a pattern matching process in which the component template image and the pad arrangement image are caused to overlap while being moved relatively, and coordinate data of the relevant component is calculated based on a positional relationship at which a matching degree is greatest, wherein in the smoothing process, with regard to the component template image, brightness is gradually changed according to a change in coordinates such that inner portions of the connecting sections are bright and outer portions become dark, and with regard to the pad arrangement image, a luminance is gradually changed according to a change in coordinates such that inner portions of the pads are bright and outer portions become dark, and wherein in the pattern matching process, the matching degree is calculated using difference values of brightness at same coordinate positions in the component template image and the pad arrangement image. acquiring a pad arrangement image which represents the component identification information which is displayed on the circuit board, and arrangements of pads which are formed on the circuit board and to which connecting sections of the plurality of components are connected; and creating a component template image which represents arrangements of the connecting sections of a relevant component based on shape data of the relevant component which is included in the component data to which the component data name corresponding to the component identification information is attached, and matching the component template image to the pad arrangement image in a vicinity of relevant component identification information to identify the pads to which the connecting sections of the relevant component are to be connected, and to further calculate the coordinate data of the relevant component on a premise of a state in which the connecting sections of the relevant component are caused to overlap the pads which are identified, wherein after carrying out a smoothing process on the component template image and the pad arrangement image, the component template image and the pad arrangement image are matched using a pattern matching process in which the component template image and the pad arrangement image are caused to overlap while being moved relatively, and coordinate data of the relevant component is calculated based on a positional relationship at which a matching degree is greatest, wherein in the smoothing process, with regard to the component template image, brightness is gradually changed according to a change in coordinates such that inner portions of the connecting sections are bright and outer portions become dark, and with regard to the pad arrangement image, a luminance is gradually changed according to a change in coordinates such that inner portions of the pads are bright and outer portions become dark, and wherein in the pattern matching process, the matching degree is calculated using difference values of brightness at same coordinate positions in the component template image and the pad arrangement image.