Optoelectronic module for receiving at least one optical ferrule and for electrically connecting with at least one electrical connector, the optoelectronic module comprising: an opto-electric assembly comprising a transducing component for converting optical signals into electrical signals and for converting electrical signals into optical signals, and a transparent substrate, the transducing component being arranged on a first surface of the transparent substrate, an optical interface for optically connecting said optical ferrule with said opto-electric assembly, the optical interface comprising an optical connector for contacting the optical ferrule, an electrical interface for electrically connecting said electrical connector with said opto-electric assembly, the electrical interface comprising a rigid contact element for contacting said electrical connector, a module casing that at least partly encompasses the opto-electric assembly and the optical and electrical interfaces, said module casing being configured to dissipate heat generated by the opto-electric assembly, wherein the opto-electric assembly is mounted with a side of the transparent substrate on a carrier that is attached to a heat dissipating wall of the module casing in a thermally conductive way, and wherein the optical interface comprises an optical chip connector with at least one lens and a flexible optical connecting element for interconnecting said carrier and said optical connector, the optical chip connector being attached to the second surface of the transparent substrate opposing to the first side, wherein the transparent substrate is mounted at an opening of said carrier, so that the first surface of the transparent substrate carrying the transducing component faces towards said heat dissipating wall, that the opposing second surface of substrate is connected via the at least one lens to the flexible optical connecting element, and that the heat dissipating wall and the transducing component are thermally connected via a thermal bridge the optoelectronic module being characterised in that the electrical interface comprises a flexible connecting element for interconnecting said carrier and said rigid contact element, and in that the opto-electric assembly is mounted with the first side of the transparent substrate on the said carrier such that the opto-electric assembly is connected via the said thermal bridge through the said opening. an opto-electric assembly comprising a transducing component for converting optical signals into electrical signals and for converting electrical signals into optical signals, and a transparent substrate, the transducing component being arranged on a first surface of the transparent substrate, an optical interface for optically connecting said optical ferrule with said opto-electric assembly, the optical interface comprising an optical connector for contacting the optical ferrule, an electrical interface for electrically connecting said electrical connector with said opto-electric assembly, the electrical interface comprising a rigid contact element for contacting said electrical connector, a module casing that at least partly encompasses the opto-electric assembly and the optical and electrical interfaces, said module casing being configured to dissipate heat generated by the opto-electric assembly, wherein the opto-electric assembly is mounted with a side of the transparent substrate on a carrier that is attached to a heat dissipating wall of the module casing in a thermally conductive way, and wherein the optical interface comprises an optical chip connector with at least one lens and a flexible optical connecting element for interconnecting said carrier and said optical connector, the optical chip connector being attached to the second surface of the transparent substrate opposing to the first side, wherein the transparent substrate is mounted at an opening of said carrier, so that the first surface of the transparent substrate carrying the transducing component faces towards said heat dissipating wall, that the opposing second surface of substrate is connected via the at least one lens to the flexible optical connecting element, and that the heat dissipating wall and the transducing component are thermally connected via a thermal bridge the optoelectronic module being characterised in that the electrical interface comprises a flexible connecting element for interconnecting said carrier and said rigid contact element, and in that the opto-electric assembly is mounted with the first side of the transparent substrate on the said carrier such that the opto-electric assembly is connected via the said thermal bridge through the said opening.