A chip package structure, comprising: a chip, a substrate, a lead and a lead protection adhesive; wherein the chip is adhered to the upper surface of the substrate by a chip attaching adhesive; the lead is configured to electrically connect the chip and the substrate; and the lead protection adhesive is configured to support the lead, wherein the highest point of the lead protection adhesive is not higher than the highest point of the upper edge of the lead in the direction perpendicular to the upper surface of the substrate; wherein the chip comprises a pin pad and the substrate comprises a substrate pad and the lead is configured to electrically connect the pin pad and the substrate pad; and the lead protection adhesive covers a first solder joint formed on the substrate pad by the lead and a second solder joint formed on the pin pad by the lead, and is configured to protect the first solder joint and the second solder joint; the lead protection adhesive covers the lower edge of the lead, and the highest point of the lead protection adhesive is not lower than the highest point of the lower edge of the lead in the direction perpendicular to the upper surface of the substrate; wherein the chip package structure is disposed in a partial region under a display screen, the chip is an optical fingerprint sensor chip, and is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger and detect fingerprint information of the finger based on the fingerprint detection signal; the upper surface of the substrate extends downward to form a first groove, and at least a portion of the chip is disposed in the first groove; the chip package structure further comprises: a support and a first foam layer, the first foam layer is disposed above the support and provided with an opening penetrating the first foam layer, and the chip receives a fingerprint detection signal returned by reflection or scattering via the finger through the opening of the first foam layer, wherein the first foam layer is in direct contact with the display screen and the first foam layer is in a state of compression, and the support is used to fixedly connect the substrate and the first foam layer; a side wall of the support that is close to the chip is aligned with the side wall of the first groove such that there is a gap between a side wall of the chip and the side wall of the first groove and the support for accommodating the lead and the lead protection adhesive. wherein the chip is adhered to the upper surface of the substrate by a chip attaching adhesive; the lead is configured to electrically connect the chip and the substrate; and the lead protection adhesive is configured to support the lead, wherein the highest point of the lead protection adhesive is not higher than the highest point of the upper edge of the lead in the direction perpendicular to the upper surface of the substrate; wherein the chip comprises a pin pad and the substrate comprises a substrate pad and the lead is configured to electrically connect the pin pad and the substrate pad; and the lead protection adhesive covers a first solder joint formed on the substrate pad by the lead and a second solder joint formed on the pin pad by the lead, and is configured to protect the first solder joint and the second solder joint; the lead protection adhesive covers the lower edge of the lead, and the highest point of the lead protection adhesive is not lower than the highest point of the lower edge of the lead in the direction perpendicular to the upper surface of the substrate; wherein the chip package structure is disposed in a partial region under a display screen, the chip is an optical fingerprint sensor chip, and is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger and detect fingerprint information of the finger based on the fingerprint detection signal; the upper surface of the substrate extends downward to form a first groove, and at least a portion of the chip is disposed in the first groove; the chip package structure further comprises: a support and a first foam layer, the first foam layer is disposed above the support and provided with an opening penetrating the first foam layer, and the chip receives a fingerprint detection signal returned by reflection or scattering via the finger through the opening of the first foam layer, wherein the first foam layer is in direct contact with the display screen and the first foam layer is in a state of compression, and the support is used to fixedly connect the substrate and the first foam layer; a side wall of the support that is close to the chip is aligned with the side wall of the first groove such that there is a gap between a side wall of the chip and the side wall of the first groove and the support for accommodating the lead and the lead protection adhesive.