A system for heat transfer in a communication device, the system comprising a dielectric resonator (200, 300, 400, 500, 600) that generates heat when the communication device is active, the dielectric resonator (200, 300, 400, 500, 600) comprising: a puck (210, 310, 410, 510, 610) having a distal top surface away from a temperature compensation structure (220, 320, 420, 520, 620) and a proximal bottom surface close to the temperature compensation structure (220, 320, 420, 520, 620) that is located within a cavity defined by at least one conductive wall, wherein the puck (210, 310, 410, 510, 610) does not contact the at least one conductive wall; the temperature compensation structure (220, 320, 420, 520, 620) having an internal upper surface facing the puck (210, 310, 410, 510, 610) and an external lower surface facing away from the puck (210, 310, 410, 510, 610) that transfers the generated heat away from the dielectric resonator (200, 300, 400, 500, 600) by having the internal upper surface in contact with the proximal bottom surface of the puck (210, 310, 410, 510, 610), wherein the internal upper surface of the temperature compensation structure (220, 320, 420, 520, 620) and the proximal bottom surface of the puck (210, 310, 410, 510, 610) have substantially equal surface areas; and a support (230, 330, 430, 530, 630) adjacent to the temperature compensation structure (220, 320, 420, 520, 620) that receives the transferred heat from the external lower surface of the temperature compensation structure (220, 320, 420, 520, 620), wherein the support (230, 330, 430, 530, 630) contacts the at least one conductive wall and has a vertical axis perpendicular to a horizontal axis in the puck (210, 310, 410, 510, 610). a puck (210, 310, 410, 510, 610) having a distal top surface away from a temperature compensation structure (220, 320, 420, 520, 620) and a proximal bottom surface close to the temperature compensation structure (220, 320, 420, 520, 620) that is located within a cavity defined by at least one conductive wall, wherein the puck (210, 310, 410, 510, 610) does not contact the at least one conductive wall; the temperature compensation structure (220, 320, 420, 520, 620) having an internal upper surface facing the puck (210, 310, 410, 510, 610) and an external lower surface facing away from the puck (210, 310, 410, 510, 610) that transfers the generated heat away from the dielectric resonator (200, 300, 400, 500, 600) by having the internal upper surface in contact with the proximal bottom surface of the puck (210, 310, 410, 510, 610), wherein the internal upper surface of the temperature compensation structure (220, 320, 420, 520, 620) and the proximal bottom surface of the puck (210, 310, 410, 510, 610) have substantially equal surface areas; and a support (230, 330, 430, 530, 630) adjacent to the temperature compensation structure (220, 320, 420, 520, 620) that receives the transferred heat from the external lower surface of the temperature compensation structure (220, 320, 420, 520, 620), wherein the support (230, 330, 430, 530, 630) contacts the at least one conductive wall and has a vertical axis perpendicular to a horizontal axis in the puck (210, 310, 410, 510, 610).