mhurhangee/ep-ind-claims huggingface dataset:
A method for authorizing a portable device to communicate with an implantable medical device, the method comprising: performing a test that determines whether at least one device configuration parameter respectively corresponding to at least one feature to be tested on the portable device is fulfilled by the portable device, wherein the at least one feature is one or more features selected from the group consisting of: a storage memory of the portable device, a random access memory of the portable device, a screen height of the portable device, a screen width of the portable device, a model of the portable device, a speed of central processing unit of the portable device, a USB capability of the portable device, a near field communication capability of the portable device, a Bluetooth® capability of the portable device, a sensitivity of a touchscreen of the portable device, and an accuracy of the touchscreen of the portable device; authorizing the portable device to communicate with the implantable medical device only if the at least one feature is fulfilled by the portable device; and denying authorization of the portable device to communicate with the implantable medical device if the at least one feature is not fulfilled by the portable device. performing a test that determines whether at least one device configuration parameter respectively corresponding to at least one feature to be tested on the portable device is fulfilled by the portable device, wherein the at least one feature is one or more features selected from the group consisting of: a storage memory of the portable device, a random access memory of the portable device, a screen height of the portable device, a screen width of the portable device, a model of the portable device, a speed of central processing unit of the portable device, a USB capability of the portable device, a near field communication capability of the portable device, a Bluetooth® capability of the portable device, a sensitivity of a touchscreen of the portable device, and an accuracy of the touchscreen of the portable device; authorizing the portable device to communicate with the implantable medical device only if the at least one feature is fulfilled by the portable device; and denying authorization of the portable device to communicate with the implantable medical device if the at least one feature is not fulfilled by the portable device.
A splitter module arranged for mounting in a pocket of a cover of an enclosure, the splitter module comprising: a housing defining an interior, the housing including a first major surface and a second major surface, the housing having a major axis extending along the major surfaces (142, 143) from a first end of the housing to a second end of the housing, the housing also having a minor axis extending along the major surfaces (142, 143) orthogonal to the major axis, the housing being contoured about the minor axis; a splitter disposed within the interior of the housing; an input fiber coupled to a first end of the splitter, the input fiber extending out of the housing; and a plurality of output pigtails coupled to a second end of the splitter, each output pigtail extending out of the housing; characterized in that: the first major surface has a concave curvature and the second major surface has a convex curvature, wherein the convex curvature of the second surface of the splitter module is arranged for fitting against an interior side of a contoured surface of the cover and the concave curvature of the first surface of the splitter module is arranged for accommodating optical adapters. a housing defining an interior, the housing including a first major surface and a second major surface, the housing having a major axis extending along the major surfaces (142, 143) from a first end of the housing to a second end of the housing, the housing also having a minor axis extending along the major surfaces (142, 143) orthogonal to the major axis, the housing being contoured about the minor axis; a splitter disposed within the interior of the housing; an input fiber coupled to a first end of the splitter, the input fiber extending out of the housing; and a plurality of output pigtails coupled to a second end of the splitter, each output pigtail extending out of the housing; characterized in that: the first major surface has a concave curvature and the second major surface has a convex curvature, wherein the convex curvature of the second surface of the splitter module is arranged for fitting against an interior side of a contoured surface of the cover and the concave curvature of the first surface of the splitter module is arranged for accommodating optical adapters. the first major surface has a concave curvature and the second major surface has a convex curvature, wherein the convex curvature of the second surface of the splitter module is arranged for fitting against an interior side of a contoured surface of the cover and the concave curvature of the first surface of the splitter module is arranged for accommodating optical adapters.
An energy system (1, 1', 1") comprising a mechanical vapor compression (MVC/MVR) subsystem arranged to receive a liquid supplied to an evaporator of the MVC/MVR-subsystem through a liquid supply line and arranged to produce compressed vapor from said liquid and to heat the liquid being received, wherein the MVC/MVR-subsystem is arranged as a closed loop vapor MVC/MVR-subsystem comprising a compressed vapor line and being arranged to reuse the produced compressed vapor being produced in a compressor of the MVC/MVR-subsystem and being provided back through the compressed vapor line to evaporate the liquid and to condense to form a condensed liquid being transported through a heated liquid line, wherein the energy system (1, 1', 1") comprises an energy subsystem (5, 5', 5") connected to said MVC/MVR-subsystem and being arranged to receive a portion of said compressed vapor provided to the energy subsystem (5, 5', 5") through a compressed vapor portion line connected to the compressed vapor line and/or being arranged to use at least a portion of said liquid being heated and being transported through the heated liquid line or through a further heated liquid line 6', characterized in that the energy subsystem (5, 5', 5") is arranged to convert energy in said portion of the compressed vapor and/or in at least said portion of the liquid being heated into cooling by a cooling apparatus comprised by the energy subsystem (5, 5', 5"), wherein said cooling apparatus is an absorption chiller or an adsorption chiller. the energy system (1, 1', 1") comprises an energy subsystem (5, 5', 5") connected to said MVC/MVR-subsystem and being arranged to receive a portion of said compressed vapor provided to the energy subsystem (5, 5', 5") through a compressed vapor portion line connected to the compressed vapor line and/or being arranged to use at least a portion of said liquid being heated and being transported through the heated liquid line or through a further heated liquid line 6', characterized in that the energy subsystem (5, 5', 5") is arranged to convert energy in said portion of the compressed vapor and/or in at least said portion of the liquid being heated into cooling by a cooling apparatus comprised by the energy subsystem (5, 5', 5"), wherein said cooling apparatus is an absorption chiller or an adsorption chiller.
Container for cooking food, of the type usable on electromagnetic induction sources, comprising a first substantially concave element, made of a first material, e.g. aluminium, or aluminium alloy, or another metal material, or metal alloy, distinguishable for high thermal conductivity and good processability, and comprising an upper surface intended to accommodate the food to be cooked, a side wall defining the side surface of the same container, said upper surface and said side surface constituting the inner surface of said container, a lower surface for resting said container on an electromagnetic induction source or other heat sources, a second element attached to said lower surface and at least partially included within the thickness of said first element, said second element being made of a second material suitable for heating when immersed in the magnetic field generated by an electromagnetic induction source, a third element attached to said upper surface and at least partially included within the thickness of said first element, said third element being made of said second material or of a third material, said container presenting an interface area, arranged on the upper surface, wherein said first element and said third element are adjacent, characterized in that at least said upper surface comprises a layer of corrosion-resistant material, wherein said layer of corrosion-resistant material is obtained by applying said corrosion-resistant material on the upper surface of the container with a plasma torch via the technique named thermal plasma spray, i.e. plasma spray in the presence of a controlled atmosphere. a second element attached to said lower surface and at least partially included within the thickness of said first element, said second element being made of a second material suitable for heating when immersed in the magnetic field generated by an electromagnetic induction source, a third element attached to said upper surface and at least partially included within the thickness of said first element, said third element being made of said second material or of a third material, said container presenting an interface area, arranged on the upper surface, wherein said first element and said third element are adjacent, characterized in that at least said upper surface comprises a layer of corrosion-resistant material, wherein said layer of corrosion-resistant material is obtained by applying said corrosion-resistant material on the upper surface of the container with a plasma torch via the technique named thermal plasma spray, i.e. plasma spray in the presence of a controlled atmosphere.
A fluid discriminator for use with a subterranean well, the fluid discriminator comprising: a structure which displaces in response to a flow of a fluid composition, whereby an outlet flow path (46, 48) of a majority of the fluid composition changes in response to a change in a ratio of fluids in the fluid composition; characterised in that the fluid discriminator further comprises a fluid switch which directs the flow of the fluid composition to at least first and second inlet flow paths (44a, 44b) wherein the fluid switch comprises a blocking device which at least partially blocks the flow of the fluid composition through at least one of the first and second inlet flow paths (44a, 44b), and further wherein the blocking device increasingly blocks one of the first and second inlet flow paths (44a, 44b), in response to the flow of the fluid composition toward the other of the first and second inlet flow paths (44a, 44b). a structure which displaces in response to a flow of a fluid composition, whereby an outlet flow path (46, 48) of a majority of the fluid composition changes in response to a change in a ratio of fluids in the fluid composition; characterised in that the fluid discriminator further comprises a fluid switch which directs the flow of the fluid composition to at least first and second inlet flow paths (44a, 44b) wherein the fluid switch comprises a blocking device which at least partially blocks the flow of the fluid composition through at least one of the first and second inlet flow paths (44a, 44b), and further wherein the blocking device increasingly blocks one of the first and second inlet flow paths (44a, 44b), in response to the flow of the fluid composition toward the other of the first and second inlet flow paths (44a, 44b).
A semiconductor device, comprising: a semiconductor die (210, 306); a plurality of lead-free solder bumps (304, 606, 806) that contain tin and silver and are disposed on a surface of the semiconductor die; a substrate (100, 202, 310) including a plurality of metal layers and a plurality of dielectric layers, wherein one of the plurality of metal layers includes a plurality of contact pads corresponding to the plurality of lead-free solder bumps, and one of the plurality of dielectric layers is an exterior dielectric layer having a plurality of respective openings for the plurality of contact pads; a plurality of respective copper posts (302, 602) disposed on the plurality of contact pads, wherein the respective copper post for each contact pad extends from the contact pad through the respective opening for the contact pad; and wherein the semiconductor die is mounted on the substrate with connections between the plurality of lead-free solder bumps and the plurality of copper posts; and a coating of a tin and copper alloy on the plurality of respective copper posts, wherein each of the plurality of lead-free solder bumps and the coating on the respective copper post are together reflow soldered onto the respective copper post on the contact pad corresponding to the lead-free solder bump; wherein each lead-free solder bump and the coating reflowed together have a reduced silver content in the vicinity of the respective copper post. a semiconductor die (210, 306); a plurality of lead-free solder bumps (304, 606, 806) that contain tin and silver and are disposed on a surface of the semiconductor die; a substrate (100, 202, 310) including a plurality of metal layers and a plurality of dielectric layers, wherein one of the plurality of metal layers includes a plurality of contact pads corresponding to the plurality of lead-free solder bumps, and one of the plurality of dielectric layers is an exterior dielectric layer having a plurality of respective openings for the plurality of contact pads; a plurality of respective copper posts (302, 602) disposed on the plurality of contact pads, wherein the respective copper post for each contact pad extends from the contact pad through the respective opening for the contact pad; and wherein the semiconductor die is mounted on the substrate with connections between the plurality of lead-free solder bumps and the plurality of copper posts; and a coating of a tin and copper alloy on the plurality of respective copper posts, wherein each of the plurality of lead-free solder bumps and the coating on the respective copper post are together reflow soldered onto the respective copper post on the contact pad corresponding to the lead-free solder bump; wherein each lead-free solder bump and the coating reflowed together have a reduced silver content in the vicinity of the respective copper post.
A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole (α) which is formed in the first main surface and has a predetermined depth, a first grounding conductor layer that is formed on the first main surface and a second grounding conductor layer that is formed on the second main surface; an insulating portion with a substantially constant thickness which is provided on the first grounding conductor layer, the insulating portion being formed from photosensitive resin and comprising an opening portion; a plane circuit that is formed on the insulating portion and is configured to transmit a high-frequency signal, and a pin that is formed so as to cover an inner surface of the micro hole wherein the pin comprises a circular ring portion formed at the first main surface, wherein an upper surface of the circular ring portion is covered with a first conductor which extends from the plane circuit through the opening portion, and an inner surface of the pin is covered with a second conductor connected to the first conductor provided in the inner circumference of the pin thereby electrically connecting the pin to the plane circuit, the method comprising: irradiating the substrate with laser light and thereby forming a first modified portion to the predetermined depth from the first main surface of the substrate, the predetermined depth corresponding to a length such that a closed leading end of the pin does not come into contact with the second grounding conductor layer; removing the first modified portion and thereby forming the micro hole; filling the micro hole with a conductive material and thereby forming the pin; and applying the liquid photosensitive resin onto the first grounding conductor layer, and forming the insulating portion by a photolithography method. irradiating the substrate with laser light and thereby forming a first modified portion to the predetermined depth from the first main surface of the substrate, the predetermined depth corresponding to a length such that a closed leading end of the pin does not come into contact with the second grounding conductor layer; removing the first modified portion and thereby forming the micro hole; filling the micro hole with a conductive material and thereby forming the pin; and applying the liquid photosensitive resin onto the first grounding conductor layer, and forming the insulating portion by a photolithography method.
Vehicle, in particular a rail vehicle, having a car body with a tread plate, wherein a footboard that can be extended at least substantially transversely to the direction of travel is provided below the tread plate, characterised in that a surface of the footboard that can be stepped on is formed by transverse profiles running in parallel to the direction of travel, a pivot axis running at least substantially in parallel to the direction of travel is provided at the end region of the footboard remote from the vehicle on at least one longitudinal member of the footboard, around which pivot axis at least two pivot members (18, 20), which each bear a transverse profile, are pivotably mounted, each of the pivot members (18, 20) is only fixed to the transverse profile assigned to it and ends there, while the transverse profiles remote from the vehicle lie on it freely, and a lifting mechanism for transverse profiles of the footboard is provided fixed to the vehicle, either consisting of a rotary element and a linear drive or consisting of a linear drive and expansion elements, said lifting mechanism lifting the transverse profile located directly in front of the tread plate.
An ice cream stick for ice cream, formed from a solid paper profile, wherein the paper profile has an elongated shape, wherein the paper profile is formed from a plurality of round or almost round flexurally rigid, solid paper rods, whereby the flexural rigidity of the paper profile corresponds in at least one bending direction at least to the flexural rigidity of one of the flexurally rigid paper rods, wherein by bending the paper profile at least in sections a restoring force counteracting the bending direction is able to be generated, characterized in that each paper rod is manufactured from a paper web, that the paper rods (3, 3') have an identical or almost identical diameter, and that the flexural rigidity of the paper profile exceeds the flexural rigidity of one of the paper rods in at least one bending direction.
A method performed by a controller device, comprising: transmitting information that identifies a characteristic of an accessory device about which to report status information; transmitting a device identifier to the accessory device; maintaining a controller device state counter value; receiving, from the accessory device, a broadcast notification that includes at least the device identifier, an accessory device state counter value, and the status information of the accessory device; decrypting a payload of the broadcast notification using a key and the controller device state counter value; extracting the status information; and performing an operation based at least in part on the status information. transmitting information that identifies a characteristic of an accessory device about which to report status information; transmitting a device identifier to the accessory device; maintaining a controller device state counter value; receiving, from the accessory device, a broadcast notification that includes at least the device identifier, an accessory device state counter value, and the status information of the accessory device; decrypting a payload of the broadcast notification using a key and the controller device state counter value; extracting the status information; and performing an operation based at least in part on the status information.
A pitot tube comprising: a substantially cylindrical body portion having an interior defining a flow passage; and a tip portion extending along a pitot tube axis from the body portion, and characterised by the tip portion including: a disk in thermal contact with a heating element; a tip cover pressed against the disk; and a high thermal conductive insert disposed between the disk and the tip cover and in thermal contact with both, wherein the high thermal conductive insert has higher thermal conductivity than the body portion, the disk, and the tip cover. a substantially cylindrical body portion having an interior defining a flow passage; and a tip portion extending along a pitot tube axis from the body portion, and characterised by the tip portion including: a disk in thermal contact with a heating element; a tip cover pressed against the disk; and a high thermal conductive insert disposed between the disk and the tip cover and in thermal contact with both, wherein the high thermal conductive insert has higher thermal conductivity than the body portion, the disk, and the tip cover. a disk in thermal contact with a heating element; a tip cover pressed against the disk; and a high thermal conductive insert disposed between the disk and the tip cover and in thermal contact with both, wherein the high thermal conductive insert has higher thermal conductivity than the body portion, the disk, and the tip cover.