High-viscosity silicone rubber composition for the 3D printing of silicone components in the ballistic additive DOD method having a viscosity η 1 (in each case at 25°C and 0.5 s -1) in the range from 300 Pa·s to 10 kPa·s, comprising: 50% to 95% by weight of at least one organosilicon compound having an average of at least two aliphatically unsaturated groups per molecule, 1% to 10% by weight of at least one organosilicon compound having an average of at least two SiH groups per molecule, or, in addition to and, 0%-95% by weight of at least one organosilicon compound having an average of at least two aliphatically unsaturated groups and at least two SiH groups per molecule, or, in place of +, 50%-95% by weight of at least one organosilicon compound having at least two aliphatically unsaturated groups and at least two SiH groups per molecule, 0.1 to 500 ppm by weight of at least one hydrosilylation catalyst, based on the content of the metal relative to the overall silicone composition, 10% to 50% by weight of at least one reinforcing material, where component is selected from the group consisting of fumed silicas, titanium dioxides, aluminum oxides, aerogels and carbon blacks having a high specific surface area between 50 and 1000 m 2 /g, measured by the BET method to DIN 66131 and DIN 66132, and nanoparticles consisting of SiO2, TiO2, exfoliated sheet silicates or carbon nanotubes, 0% to 30% by weight of auxiliaries other than the other constituents of the composition, where component is selected from the group consisting of inhibitors, heat stabilizers, solvents, plasticizers, color pigments, sensitizers, photoinitiators, adhesion promoters, non-reinforcing fillers, thixotropic agents, conductivity additives and silicone resins, characterized in that the nominal melt flow index n of the silicone rubber composition is within the following range: − 1.00 < n < − 0.40, where n is calculated from formula: log η=log K + n * log v where η represents the viscosity at shear rate v, K represents the nominal consistency index, v represents the shear rate and log represents the decadic logarithm, and the viscosity η 1, the nominal melt flow index n and the nominal consistency index K in formula are determined by the rheological test method disclosed in the description. 50% to 95% by weight of at least one organosilicon compound having an average of at least two aliphatically unsaturated groups per molecule, 1% to 10% by weight of at least one organosilicon compound having an average of at least two SiH groups per molecule, or, in addition to and, 0%-95% by weight of at least one organosilicon compound having an average of at least two aliphatically unsaturated groups and at least two SiH groups per molecule, or, in place of +, 50%-95% by weight of at least one organosilicon compound having at least two aliphatically unsaturated groups and at least two SiH groups per molecule, 0.1 to 500 ppm by weight of at least one hydrosilylation catalyst, based on the content of the metal relative to the overall silicone composition, 10% to 50% by weight of at least one reinforcing material, where component is selected from the group consisting of fumed silicas, titanium dioxides, aluminum oxides, aerogels and carbon blacks having a high specific surface area between 50 and 1000 m 2 /g, measured by the BET method to DIN 66131 and DIN 66132, and nanoparticles consisting of SiO2, TiO2, exfoliated sheet silicates or carbon nanotubes, 0% to 30% by weight of auxiliaries other than the other constituents of the composition, where component is selected from the group consisting of inhibitors, heat stabilizers, solvents, plasticizers, color pigments, sensitizers, photoinitiators, adhesion promoters, non-reinforcing fillers, thixotropic agents, conductivity additives and silicone resins, η represents the viscosity at shear rate v, K represents the nominal consistency index, v represents the shear rate and log represents the decadic logarithm,