A conductive liquid composition comprising: containing as a binder resin, from 5 to 25 mass% of a hydroxyl-containing resin with a hydroxyl value from 3 to 100 and a weight-average molecular weight from 4000 to 20000, containing as a solvent, one or two more types of solvents with boiling points of not less than 170°C selected from among isophorone, dibasic acid esters, 3-methoxy-3-methylbutanol, 3-methoxy-3-methylbutyl acetate, ethyleneglycol monobutyl ether acetate, coal tar naphtha with a boiling point of more than 170°C, diethyleneglycol monoethyl ether, diethyleneglycol monoethyl ether acetate, diethyleneglycol monobutyl ether, diethyleneglycol monobutyl ether acetate, triethyleneglycol monobutyl ether, triethyleneglycol monobutyl ether acetate, polyethyleneglycol dimethyl ether, tetraethyleneglycol dimethyl ether and polyethyleneglycol monomethyl ether, at not less than 70 mass% of the total solvent, containing as a curing agent, from 1.5 to 10.0 mass% of polyisocyanate, containing as a curing accelerator, from 0.005 to 0.1 mass% of an organometallic compound, containing as an adhesion reinforcing agent, from 0.2 to 2.5 mass% of a coupling agent, containing as conducting materials: from 2.0 to 10.0 mass% of graphite, from 5.0 to 15.0 mass% of conductive carbon black, and from 20.0 to 50.0 mass% of silica particles with a mean particle size from 1.0 to 7.0 μm and surface-coated with silver, and having a surface resistivity from 1 to 1000 Ω/sq., measured according to JIS K 7194, when the thickness of the cured film of the conductive liquid composition is 8 μm. containing as a binder resin, from 5 to 25 mass% of a hydroxyl-containing resin with a hydroxyl value from 3 to 100 and a weight-average molecular weight from 4000 to 20000, containing as a solvent, one or two more types of solvents with boiling points of not less than 170°C selected from among isophorone, dibasic acid esters, 3-methoxy-3-methylbutanol, 3-methoxy-3-methylbutyl acetate, ethyleneglycol monobutyl ether acetate, coal tar naphtha with a boiling point of more than 170°C, diethyleneglycol monoethyl ether, diethyleneglycol monoethyl ether acetate, diethyleneglycol monobutyl ether, diethyleneglycol monobutyl ether acetate, triethyleneglycol monobutyl ether, triethyleneglycol monobutyl ether acetate, polyethyleneglycol dimethyl ether, tetraethyleneglycol dimethyl ether and polyethyleneglycol monomethyl ether, at not less than 70 mass% of the total solvent, containing as a curing agent, from 1.5 to 10.0 mass% of polyisocyanate, containing as a curing accelerator, from 0.005 to 0.1 mass% of an organometallic compound, containing as an adhesion reinforcing agent, from 0.2 to 2.5 mass% of a coupling agent, containing as conducting materials: from 2.0 to 10.0 mass% of graphite, from 5.0 to 15.0 mass% of conductive carbon black, and from 20.0 to 50.0 mass% of silica particles with a mean particle size from 1.0 to 7.0 μm and surface-coated with silver, and from 2.0 to 10.0 mass% of graphite, from 5.0 to 15.0 mass% of conductive carbon black, and from 20.0 to 50.0 mass% of silica particles with a mean particle size from 1.0 to 7.0 μm and surface-coated with silver, and having a surface resistivity from 1 to 1000 Ω/sq., measured according to JIS K 7194, when the thickness of the cured film of the conductive liquid composition is 8 μm.