A semiconductor device comprising: a metal base to which an insulating substrate is joined; a semiconductor chip which is joined to said insulating substrate; a case that covers a surface of the insulating substrate to which the semiconductor chip is joined; and a control terminal in which one end portion is electrically connected to the semiconductor chip and the other end portion passes through the case and is exposed to the outside of the case, wherein a portion of the control terminal that is exposed to the outside of the case has formed therein a cut-out section obtained by cutting out part of the exposed portion, and a blocking section that is formed by bending a portion surrounded by the cut-out section and remaining on the control terminal, comes into contact with the case from the outer side of the case, and blocks a movement of the control terminal, wherein the control terminal includes: a through section in which one end portion is exposed to the outside of the case and a portion exposed to the outside of the case is provided with the blocking section; and a linking section that is linked to the other end portion of the through section and has a flat surface that is orthogonal to the through section and parallel to the insulating substrate, the case including: a lid disposed above the surface of the insulating substrate to which the semiconductor chip is joined; a through hole which is provided in the lid and through which the control terminal passes; a step provided at a side section of the through hole from a surface side of the lid that is exposed to the outside of the case, the step being in contact with the blocking section; and a protrusion that is provided on a surface of the lid on the insulating substrate side and is in contact with the flat surface of the linking section; whereby the through hole, which has a substantially rectangular planar shape, has an opening width in a first direction substantially equal to a width of a side surface of the plate-shaped control terminal passing through the through hole, this side surface facing a side of the through hole and an opening width in a second direction perpendicular to the first direction substantially equal to the thickness of the through section. a metal base to which an insulating substrate is joined; a semiconductor chip which is joined to said insulating substrate; a case that covers a surface of the insulating substrate to which the semiconductor chip is joined; and a control terminal in which one end portion is electrically connected to the semiconductor chip and the other end portion passes through the case and is exposed to the outside of the case, wherein a portion of the control terminal that is exposed to the outside of the case has formed therein a cut-out section obtained by cutting out part of the exposed portion, and a blocking section that is formed by bending a portion surrounded by the cut-out section and remaining on the control terminal, comes into contact with the case from the outer side of the case, and blocks a movement of the control terminal, wherein the control terminal includes: a through section in which one end portion is exposed to the outside of the case and a portion exposed to the outside of the case is provided with the blocking section; and a linking section that is linked to the other end portion of the through section and has a flat surface that is orthogonal to the through section and parallel to the insulating substrate, the case including: a through section in which one end portion is exposed to the outside of the case and a portion exposed to the outside of the case is provided with the blocking section; and a linking section that is linked to the other end portion of the through section and has a flat surface that is orthogonal to the through section and parallel to the insulating substrate, the case including: a lid disposed above the surface of the insulating substrate to which the semiconductor chip is joined; a through hole which is provided in the lid and through which the control terminal passes; a step provided at a side section of the through hole from a surface side of the lid that is exposed to the outside of the case, the step being in contact with the blocking section; and a protrusion that is provided on a surface of the lid on the insulating substrate side and is in contact with the flat surface of the linking section; whereby the through hole, which has a substantially rectangular planar shape, has an opening width in a first direction substantially equal to a width of a side surface of the plate-shaped control terminal passing through the through hole, this side surface facing a side of the through hole and an opening width in a second direction perpendicular to the first direction substantially equal to the thickness of the through section.