A camera apparatus, comprising: a housing having a front end and a back end; a lens, wherein the lens is disposed in the front end of the housing; and a thermal core, wherein the thermal core is disposed between the lens and the back end of the housing, the thermal core further comprising: an electrical cable; at least one substrate (310-1, 310-2, 310-3) electrically connected to the electrical cable, wherein the at least one substrate includes at least a first substrate and a second substrate, the first substrate and the second substrate being spaced apart from each other, wherein the second substrate is electrically connected to the electrical cable; an infrared imager configured to capture an infrared video stream, wherein the infrared imager is affixed to one of the at least one substrate, wherein the infrared imager is disposed on the first substrate; at least one thermally conductive member, (320-1, 320-2) wherein the at least one thermally conductive member: is thermally connected to one of the at least one substrate and is disposed between the at least the first substrate and the second substrate; and at least one thermal connection member comprising a locating pin that connects the at least the first substrate with the at least the second substrate together with the at least one thermally conductive member together to extend to the housing, along an outer periphery of the at least a first substrate, the at least a second substrate, and the at least one thermally conductive member, wherein: the at least one thermally conductive member (320-1, 320-2) is configured to divert heat from the at least one substrate to the housing via the at least one thermal connection member; and the at least one substrate is a Printed Circuit Board. a housing having a front end and a back end; a lens, wherein the lens is disposed in the front end of the housing; and a thermal core, wherein the thermal core is disposed between the lens and the back end of the housing, the thermal core further comprising: an electrical cable; at least one substrate (310-1, 310-2, 310-3) electrically connected to the electrical cable, wherein the at least one substrate includes at least a first substrate and a second substrate, the first substrate and the second substrate being spaced apart from each other, wherein the second substrate is electrically connected to the electrical cable; an infrared imager configured to capture an infrared video stream, wherein the infrared imager is affixed to one of the at least one substrate, wherein the infrared imager is disposed on the first substrate; at least one thermally conductive member, (320-1, 320-2) wherein the at least one thermally conductive member: is thermally connected to one of the at least one substrate and is disposed between the at least the first substrate and the second substrate; and is thermally connected to one of the at least one substrate and is disposed between the at least the first substrate and the second substrate; and at least one thermal connection member comprising a locating pin that connects the at least the first substrate with the at least the second substrate together with the at least one thermally conductive member together to extend to the housing, along an outer periphery of the at least a first substrate, the at least a second substrate, and the at least one thermally conductive member, wherein: the at least one thermally conductive member (320-1, 320-2) is configured to divert heat from the at least one substrate to the housing via the at least one thermal connection member; and the at least one substrate is a Printed Circuit Board. the at least one thermally conductive member (320-1, 320-2) is configured to divert heat from the at least one substrate to the housing via the at least one thermal connection member; and the at least one substrate is a Printed Circuit Board.