A physical quantity measurement sensor mounted to a mount member provided with a fluid introduction passage, the physical quantity measurement sensor comprising: a ceramic package comprising: a plate opposed to the mount member and provided with a flow port through which a fluid to be measured is introduced from the fluid introduction passage; and a wall provided to a periphery of the plate to define a recess in the package; an electronic component housed in the recess of the package, the electronic component comprising a sensing element configured to detect a physical quantity of the fluid to be measured introduced through the flow port; a terminal electrically connected to the electronic component, the terminal being provided on a surface of a thickened portion of the wall of the package; a lid attached to the wall and configured to cover the electronic components; and a metal attachment piece configured to attach the package to the mount member, the attachment piece comprising: a holding piece configured to hold the package; an engaged piece configured to be engaged with the mount member; and an elastically deformable elastic piece having first and second ends respectively integral with the holding piece and the engaged piece, wherein the lid is made of metal and comprises: a lid body configured to cover the electronic component; a lid wall provided integrally with the lid body to be opposed to the wall; and a projecting piece provided integrally with the lid wall, the lid body serves as the holding piece, the lid wall serves as the elastic piece, and the projecting piece serves as the engaged piece. a plate opposed to the mount member and provided with a flow port through which a fluid to be measured is introduced from the fluid introduction passage; and a wall provided to a periphery of the plate to define a recess in the package; an electronic component housed in the recess of the package, the electronic component comprising a sensing element configured to detect a physical quantity of the fluid to be measured introduced through the flow port; a terminal electrically connected to the electronic component, the terminal being provided on a surface of a thickened portion of the wall of the package; a lid attached to the wall and configured to cover the electronic components; and a metal attachment piece configured to attach the package to the mount member, the attachment piece comprising: a holding piece configured to hold the package; an engaged piece configured to be engaged with the mount member; and an elastically deformable elastic piece having first and second ends respectively integral with the holding piece and the engaged piece, wherein the lid is made of metal and comprises: a lid body configured to cover the electronic component; a lid wall provided integrally with the lid body to be opposed to the wall; and a projecting piece provided integrally with the lid wall, the lid body serves as the holding piece, the lid wall serves as the elastic piece, and the projecting piece serves as the engaged piece. a holding piece configured to hold the package; an engaged piece configured to be engaged with the mount member; and an elastically deformable elastic piece having first and second ends respectively integral with the holding piece and the engaged piece, wherein the lid is made of metal and comprises: a lid body configured to cover the electronic component; a lid wall provided integrally with the lid body to be opposed to the wall; and a projecting piece provided integrally with the lid wall, the lid body serves as the holding piece, the lid wall serves as the elastic piece, and the projecting piece serves as the engaged piece. a lid body configured to cover the electronic component; a lid wall provided integrally with the lid body to be opposed to the wall; and a projecting piece provided integrally with the lid wall, the lid body serves as the holding piece, the lid wall serves as the elastic piece, and the projecting piece serves as the engaged piece.