A feeding structure for an antenna array comprising: a first circuit board, wherein a first circuit of the feeding structure is formed on the first circuit board; a second circuit board, wherein a second circuit of the feeding structure is formed on the second circuit board; at least three conductive layers, wherein the first and second circuit boards are mounted between different conductive layers; wherein the conductive layers that contact the first and second circuit boards contact the first and second circuit boards such that the conductive layers are separated by a dielectric from the first and second circuits and the conductive layers are configured to act as a microwave ground for the first and second circuits; the feeding structure further comprising: at least one solderable pin wherein the at least one solderable pin electrically connects the first circuit to the second circuit through at least one opening in a middle conductive layer of the conductive layers; and a plurality of connectors coupled to the first circuit through a plurality of openings in an external conductive layer of the-conductive layers; and a lightning rod connected to the conductive layers. a first circuit board, wherein a first circuit of the feeding structure is formed on the first circuit board; a second circuit board, wherein a second circuit of the feeding structure is formed on the second circuit board; at least three conductive layers, wherein the first and second circuit boards are mounted between different conductive layers; wherein the conductive layers that contact the first and second circuit boards contact the first and second circuit boards such that the conductive layers are separated by a dielectric from the first and second circuits and the conductive layers are configured to act as a microwave ground for the first and second circuits; the feeding structure further comprising: at least one solderable pin wherein the at least one solderable pin electrically connects the first circuit to the second circuit through at least one opening in a middle conductive layer of the conductive layers; and a plurality of connectors coupled to the first circuit through a plurality of openings in an external conductive layer of the-conductive layers; and a lightning rod connected to the conductive layers. wherein the conductive layers that contact the first and second circuit boards contact the first and second circuit boards such that the conductive layers are separated by a dielectric from the first and second circuits and the conductive layers are configured to act as a microwave ground for the first and second circuits; the feeding structure further comprising: at least one solderable pin wherein the at least one solderable pin electrically connects the first circuit to the second circuit through at least one opening in a middle conductive layer of the conductive layers; and a plurality of connectors coupled to the first circuit through a plurality of openings in an external conductive layer of the-conductive layers; and a lightning rod connected to the conductive layers. at least one solderable pin wherein the at least one solderable pin electrically connects the first circuit to the second circuit through at least one opening in a middle conductive layer of the conductive layers; and a plurality of connectors coupled to the first circuit through a plurality of openings in an external conductive layer of the-conductive layers; and a lightning rod connected to the conductive layers.