A process for the continuous production of flexible copper-clad laminate, characterized in comprising the sequent steps of: conducting a continuous ion implantation to a surface of an organic macromolecular polymer film; conducting a plasma deposition on the ion implanted surface of the organic macromolecular polymer film; and continuously electrocoppering the plasma deposited surface of the organic macromolecular polymer film, wherein said ion implantation is conducted under the conditions of a running speed of said organic macromolecular polymer film of 0.3-2 m/minute, an ion implantation voltage of 1-10 KV, an ion implantation dosage of 0.5x10 13 -1.0x10 17 atom/cm 2; said plasma deposition is conducted under the conditions of a plasma deposition voltage of 100-500 V and an ion beam stream of 20-80 milliampere, wherein said continuous ion implantation and plasma deposition are carried out in an equipment comprising an ion source and a vacuum chamber; the vacuum chamber comprises on the walls a vacuum orifice and at least one opening connecting with said ion source; the vacuum chamber comprises a unreeling roller, a tension adjusting unit, a cooling part, and a wind up roller; said cooling part is placed between said unreeling roller and wind up roller; said tension adjusting unit is displaced at both sides of the cooling part and between said unreeling roller and wind up roller; said cooling part consists of at least one hollow cooling roller free to rotate and in which the cooling medium passes; said cooling roller, unreeling roller and wind up roller are parallel to each other, and the cooling roller is axially perpendicular to the direction along which said plasma is fed into the vacuum chamber. conducting a continuous ion implantation to a surface of an organic macromolecular polymer film; conducting a plasma deposition on the ion implanted surface of the organic macromolecular polymer film; and continuously electrocoppering the plasma deposited surface of the organic macromolecular polymer film, wherein said ion implantation is conducted under the conditions of a running speed of said organic macromolecular polymer film of 0.3-2 m/minute, an ion implantation voltage of 1-10 KV, an ion implantation dosage of 0.5x10 13 -1.0x10 17 atom/cm 2; said plasma deposition is conducted under the conditions of a plasma deposition voltage of 100-500 V and an ion beam stream of 20-80 milliampere, wherein said continuous ion implantation and plasma deposition are carried out in an equipment comprising an ion source and a vacuum chamber; the vacuum chamber comprises on the walls a vacuum orifice and at least one opening connecting with said ion source; the vacuum chamber comprises a unreeling roller, a tension adjusting unit, a cooling part, and a wind up roller; said cooling part is placed between said unreeling roller and wind up roller; said tension adjusting unit is displaced at both sides of the cooling part and between said unreeling roller and wind up roller; said cooling part consists of at least one hollow cooling roller free to rotate and in which the cooling medium passes; said cooling roller, unreeling roller and wind up roller are parallel to each other, and the cooling roller is axially perpendicular to the direction along which said plasma is fed into the vacuum chamber.