A method of providing a power semiconductor module with a cooler, the method comprising the steps of: a) Providing a power semiconductor module comprising a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side, wherein the second substrate side is connected to a first baseplate side, wherein the baseplate further comprises a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler, which cooler comprises a first casing component and a second casing component, wherein the second baseplate side is equipped with a cooling area which is surrounded by a connecting area; b) Connecting the first casing component to the second baseplate side at the connecting area, wherein the first casing component comprises at least one opening for receiving the cooling area; c) Connecting a second casing component to the first casing component such, that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component; wherein the method comprises at least one of the steps b100) and c100), wherein according to the step b100), step b) comprises the steps of b1) welding the first casing component to the baseplate by an intermittent welding technique along a first mechanical connection path which fully surrounds the opening; and b2) providing a sealing agent along a first sealing path which fully surrounds the opening in order to seal the baseplate against the first casing component; and wherein according to the step c100), step c) comprises the steps of c1) welding the second casing component to the first casing component by an intermittent welding technique along a second mechanical connection path which fully surrounds the cooling channel; and c2) providing a sealing agent along a second sealing path in order to seal the first casing component against the second casing component. a) Providing a power semiconductor module comprising a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side, wherein the second substrate side is connected to a first baseplate side, wherein the baseplate further comprises a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler, which cooler comprises a first casing component and a second casing component, wherein the second baseplate side is equipped with a cooling area which is surrounded by a connecting area; b) Connecting the first casing component to the second baseplate side at the connecting area, wherein the first casing component comprises at least one opening for receiving the cooling area; c) Connecting a second casing component to the first casing component such, that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component; wherein the method comprises at least one of the steps b100) and c100), wherein according to the step b100), step b) comprises the steps of b1) welding the first casing component to the baseplate by an intermittent welding technique along a first mechanical connection path which fully surrounds the opening; and b2) providing a sealing agent along a first sealing path which fully surrounds the opening in order to seal the baseplate against the first casing component; and wherein according to the step c100), step c) comprises the steps of c1) welding the second casing component to the first casing component by an intermittent welding technique along a second mechanical connection path which fully surrounds the cooling channel; and c2) providing a sealing agent along a second sealing path in order to seal the first casing component against the second casing component. the method comprises at least one of the steps b100) and c100), wherein according to the step b100), step b) comprises the steps of b1) welding the first casing component to the baseplate by an intermittent welding technique along a first mechanical connection path which fully surrounds the opening; and b2) providing a sealing agent along a first sealing path which fully surrounds the opening in order to seal the baseplate against the first casing component; and wherein b1) welding the first casing component to the baseplate by an intermittent welding technique along a first mechanical connection path which fully surrounds the opening; and b2) providing a sealing agent along a first sealing path which fully surrounds the opening in order to seal the baseplate against the first casing component; and wherein according to the step c100), step c) comprises the steps of c1) welding the second casing component to the first casing component by an intermittent welding technique along a second mechanical connection path which fully surrounds the cooling channel; and c2) providing a sealing agent along a second sealing path in order to seal the first casing component against the second casing component. c1) welding the second casing component to the first casing component by an intermittent welding technique along a second mechanical connection path which fully surrounds the cooling channel; and c2) providing a sealing agent along a second sealing path in order to seal the first casing component against the second casing component.