A chip package assembly comprising: a package substrate having a first surface and a second surface coupled by a side wall; at least one integrated circuit, IC, die disposed on the first surface of the package substrate; a stiffener having a first surface disposed outward of and bonded to the side wall of the package substrate, the stiffener having a second surface bonded to the first surface of the package substrate, the stiffener circumscribing the IC die, the stiffener further including: a third surface disposed opposite the first surface of the stiffener and parallel thereto; an inner wall parallel to the first and third surfaces (160,152) and coupled to the third surface by a top wall; and a bottom wall coupled to the third surface and the first surface; an adapter coupled to the stiffener, the adapter including: an outer wall aligned with the third surface of the stiffener, a top wall, a bottom wall, an inner wall, an outer mounting surface and a bottom mounting surface, whereby: the outer wall, the outer mounting surface and the inner wall are parallel; the inner wall is coupled to the outer wall by the top wall; the bottom wall being aligned with the second surface of the stiffener; the inner wall coupling the top wall and the bottom wall; and whereby the bottom mounting surface extends from the inner wall of the stiffener to the third surface of the stiffener; at least one of the outer mounting surface and the bottom mounting surface of the adapter is bonded or mechanically coupled to the respective adjacent inner wall or the top wall of the stiffener; whereby the interface between the outer mounting surface of the adapter and the inner wall of the stiffener precisely locates the adapter on the stiffener; and a plurality of solder balls disposed on the second surface of the package substrate. a package substrate having a first surface and a second surface coupled by a side wall; at least one integrated circuit, IC, die disposed on the first surface of the package substrate; a stiffener having a first surface disposed outward of and bonded to the side wall of the package substrate, the stiffener having a second surface bonded to the first surface of the package substrate, the stiffener circumscribing the IC die, the stiffener further including: a third surface disposed opposite the first surface of the stiffener and parallel thereto; an inner wall parallel to the first and third surfaces (160,152) and coupled to the third surface by a top wall; and a bottom wall coupled to the third surface and the first surface; an adapter coupled to the stiffener, the adapter including: an outer wall aligned with the third surface of the stiffener, a top wall, a bottom wall, an inner wall, an outer mounting surface and a bottom mounting surface, whereby: the outer wall, the outer mounting surface and the inner wall are parallel; the inner wall is coupled to the outer wall by the top wall; the bottom wall being aligned with the second surface of the stiffener; the inner wall coupling the top wall and the bottom wall; and whereby the bottom mounting surface extends from the inner wall of the stiffener to the third surface of the stiffener; at least one of the outer mounting surface and the bottom mounting surface of the adapter is bonded or mechanically coupled to the respective adjacent inner wall or the top wall of the stiffener; whereby the interface between the outer mounting surface of the adapter and the inner wall of the stiffener precisely locates the adapter on the stiffener; and a plurality of solder balls disposed on the second surface of the package substrate. an outer wall aligned with the third surface of the stiffener, a top wall, a bottom wall, an inner wall, an outer mounting surface and a bottom mounting surface, whereby: the outer wall, the outer mounting surface and the inner wall are parallel; the inner wall is coupled to the outer wall by the top wall; the bottom wall being aligned with the second surface of the stiffener; the inner wall coupling the top wall and the bottom wall; and whereby the bottom mounting surface extends from the inner wall of the stiffener to the third surface of the stiffener; at least one of the outer mounting surface and the bottom mounting surface of the adapter is bonded or mechanically coupled to the respective adjacent inner wall or the top wall of the stiffener; whereby the interface between the outer mounting surface of the adapter and the inner wall of the stiffener precisely locates the adapter on the stiffener; and a plurality of solder balls disposed on the second surface of the package substrate.