A glass plate having a first main surface (212, 312) and a second main surface (214, 314) opposite each other, a plurality of separation lines (220, 320) being formed in the glass plate and on the first main surface (212, 312) by irradiating the glass plate with laser light, the separation lines (220, 320) being configured of at least one product line (230, 330) and at least one release line (240, 340); the product line (230, 330) corresponding to an outline of a glass article (280, 380) to be separated and extracted from the glass plate; and the release line (240, 340) being a part of the separation lines (220, 320) other than the product line (230, 330), the product line (230, 330) including a first in-plane void array configured of a plurality of in-plane voids arranged on the first main surface (212, 312); the product line (230, 330) further including a plurality of internal void arrays for product line, each having an in-plane void of the first in-plane void array, and extending from the first main surface (212, 312) toward the second main surface (214, 314); and the internal void array for product line being configured of a plurality of internal voids for product line, a maximum distance P 1max between centers of the in-plane voids adjacent to each other arranged on the first main surface (212, 312) falling within a range of 1 μm to 10 μm, the release line (240, 340) including a plurality of internal void arrays for release line (260, 260A to 240E), each of the internal void arrays for release line (260, 260A to 260E) being arranged along a line connecting the first main surface (212, 312) and the second main surface (214, 314); and the internal void array for release line (260, 260A to 260E) being configured of a plurality of internal voids for release line, and a maximum distance P 2max between centers of virtual in-plane voids adjacent to each other being greater than 10 μm, the virtual in-plane void being defined to be a position at which an extension line extended from the internal void array for release line (260, 260A to 260E) crosses the first main surface (212, 312), or a void in the internal void array for release line (260, 260A to 260E) on the first main surface (212, 312) when the void is located on the first main surface (212, 312). a plurality of separation lines (220, 320) being formed in the glass plate and on the first main surface (212, 312) by irradiating the glass plate with laser light, the separation lines (220, 320) being configured of at least one product line (230, 330) and at least one release line (240, 340); the product line (230, 330) corresponding to an outline of a glass article (280, 380) to be separated and extracted from the glass plate; and the release line (240, 340) being a part of the separation lines (220, 320) other than the product line (230, 330), the product line (230, 330) including a first in-plane void array configured of a plurality of in-plane voids arranged on the first main surface (212, 312); the product line (230, 330) further including a plurality of internal void arrays for product line, each having an in-plane void of the first in-plane void array, and extending from the first main surface (212, 312) toward the second main surface (214, 314); and the internal void array for product line being configured of a plurality of internal voids for product line, a maximum distance P 1max between centers of the in-plane voids adjacent to each other arranged on the first main surface (212, 312) falling within a range of 1 μm to 10 μm, the release line (240, 340) including a plurality of internal void arrays for release line (260, 260A to 240E), each of the internal void arrays for release line (260, 260A to 260E) being arranged along a line connecting the first main surface (212, 312) and the second main surface (214, 314); and the internal void array for release line (260, 260A to 260E) being configured of a plurality of internal voids for release line, and a maximum distance P 2max between centers of virtual in-plane voids adjacent to each other being greater than 10 μm, the virtual in-plane void being defined to be a position at which an extension line extended from the internal void array for release line (260, 260A to 260E) crosses the first main surface (212, 312), or a void in the internal void array for release line (260, 260A to 260E) on the first main surface (212, 312) when the void is located on the first main surface (212, 312).