A solder bump forming method comprising: loading, onto a work stage, a component to be formed with a solder bump on an upper surface thereof, a mask being disposed over the upper surface of the component, the mask having an opening at a position corresponding to a position where the bump is to be formed; preheating the component with a first heater unit; lowering an injection head into contact with an upper surface of the mask disposed over the component, the injection head being configured to hold molten solder therein and supply the molten solder from a nozzle at a bottom thereof; bringing an upper surface of a second heater unit and a lower surface of the component into contact with each other to heat the component, which has already been preheated, to a working temperature thereof; heating the solder in the injection head to a working temperature thereof with a third heater unit; allowing the injection head to slide over the mask while discharging the molten solder heated to the working temperature from the nozzle to flow into the opening in the mask and scraping surplus molten solder off the upper surface of the mask, thereby filling the molten solder into the opening in the mask, and thus supplying a predetermined amount of molten solder onto the component; stopping respective operations of the second heater unit and the third heater unit after completion of supply of molten solder by the injection head; bringing an upper surface of a first cooling unit into contact with a lower surface of the second heater unit, whose operation has already been stopped, to forcedly cool the injection head by heat transfer from the first cooling unit through the second heater unit, the component, and the mask, thereby lowering a temperature of the molten solder in the injection head to a temperature at which the molten solder does not drool from the nozzle; raising the injection head to separate from the mask after the temperature of the molten solder in the injection head has lowered to the temperature at which the molten solder does not drool from the nozzle; forcedly cooling and solidifying the molten solder supplied onto the component with a second cooling unit to form a bump; and unloading the component having the bump formed on the upper surface from the work stage. loading, onto a work stage, a component to be formed with a solder bump on an upper surface thereof, a mask being disposed over the upper surface of the component, the mask having an opening at a position corresponding to a position where the bump is to be formed; preheating the component with a first heater unit; lowering an injection head into contact with an upper surface of the mask disposed over the component, the injection head being configured to hold molten solder therein and supply the molten solder from a nozzle at a bottom thereof; bringing an upper surface of a second heater unit and a lower surface of the component into contact with each other to heat the component, which has already been preheated, to a working temperature thereof; heating the solder in the injection head to a working temperature thereof with a third heater unit; allowing the injection head to slide over the mask while discharging the molten solder heated to the working temperature from the nozzle to flow into the opening in the mask and scraping surplus molten solder off the upper surface of the mask, thereby filling the molten solder into the opening in the mask, and thus supplying a predetermined amount of molten solder onto the component; stopping respective operations of the second heater unit and the third heater unit after completion of supply of molten solder by the injection head; bringing an upper surface of a first cooling unit into contact with a lower surface of the second heater unit, whose operation has already been stopped, to forcedly cool the injection head by heat transfer from the first cooling unit through the second heater unit, the component, and the mask, thereby lowering a temperature of the molten solder in the injection head to a temperature at which the molten solder does not drool from the nozzle; raising the injection head to separate from the mask after the temperature of the molten solder in the injection head has lowered to the temperature at which the molten solder does not drool from the nozzle; forcedly cooling and solidifying the molten solder supplied onto the component with a second cooling unit to form a bump; and unloading the component having the bump formed on the upper surface from the work stage.