A thermosetting resin composite for a metal clad laminate, having a thermal stress factor of 25 Mpa or less calculated by the following General Formula 1: Thermal Stress Factor = ∫ Storage Modulus × CTE dT in General Formula 1, the thermal stress factor is calculated from the storage modulus and the CTE (coefficient of thermal expansion) measured at a temperature range of 30 °C to 260 °C, respectively, the storage modulus is measured at a heating rate of 5 °C/min in a tensile mode using a dynamic mechanical analyzer, and the CTE is measured at a heating rate of 10 °C/min using a thermomechanical analyzer, wherein the thermosetting resin composite comprises a thermosetting resin composition and a fabric substrate, the thermosetting resin composition comprises: an amine compound containing one or more of at least one kind of functional group selected from the group consisting of a sulfone group; a carbonyl group; a halogen group; a C1 to C20 alkyl group substituted or unsubstituted with a nitro group, a cyano group or a halogen group; a C6 to C20 aryl group substituted or unsubstituted with a nitro group, a cyano group or a halogen group; a C2 to C30 heteroaryl group substituted or unsubstituted with a nitro group, a cyano group or a halogen group; and a C1 to C20 alkylene group substituted or unsubstituted with a nitro group, a cyano group or a halogen group, a thermosetting resin including an epoxy resin and a bismaleimide resin, a thermoplastic resin, and an inorganic filler, the thermosetting resin composition comprises the thermosetting resin in an amount of 400 parts by weight or less based on 100 parts by weight of the amine compound, the thermosetting resin composition comprises 50 to 150 parts by weight of the inorganic filler based on 100 parts by weight of a total amount of the thermosetting resin, the thermoplastic resin and the amine compound, and the thermosetting resin composition has an equivalent ratio of 1.4 or more calculated by the following Equation 1: Equivalent ratio = total active hydrogen equivalent contained in the amine compound / total curable functional group equivalent contained in the thermosetting resin. the thermal stress factor is calculated from the storage modulus and the CTE (coefficient of thermal expansion) measured at a temperature range of 30 °C to 260 °C, respectively, the storage modulus is measured at a heating rate of 5 °C/min in a tensile mode using a dynamic mechanical analyzer, and the CTE is measured at a heating rate of 10 °C/min using a thermomechanical analyzer, wherein the thermosetting resin composite comprises a thermosetting resin composition and a fabric substrate, the thermosetting resin composition comprises: an amine compound containing one or more of at least one kind of functional group selected from the group consisting of a sulfone group; a carbonyl group; a halogen group; a C1 to C20 alkyl group substituted or unsubstituted with a nitro group, a cyano group or a halogen group; a C6 to C20 aryl group substituted or unsubstituted with a nitro group, a cyano group or a halogen group; a C2 to C30 heteroaryl group substituted or unsubstituted with a nitro group, a cyano group or a halogen group; and a C1 to C20 alkylene group substituted or unsubstituted with a nitro group, a cyano group or a halogen group, a thermosetting resin including an epoxy resin and a bismaleimide resin, a thermoplastic resin, and an inorganic filler, the thermosetting resin composition comprises the thermosetting resin in an amount of 400 parts by weight or less based on 100 parts by weight of the amine compound, the thermosetting resin composition comprises 50 to 150 parts by weight of the inorganic filler based on 100 parts by weight of a total amount of the thermosetting resin, the thermoplastic resin and the amine compound, and the thermosetting resin composition has an equivalent ratio of 1.4 or more calculated by the following Equation 1: Equivalent ratio = total active hydrogen equivalent contained in the amine compound / total curable functional group equivalent contained in the thermosetting resin.