A lamp head module (200, 1400) comprising: an array of light emitting devices (330, 1407), the array having a high aspect ratio in which a length of the array is greater than a width of the array, wherein the light emitting devices are closely spaced to create a high fill factor and includes a plurality of groups of electrically in-series light emitting devices in which the plurality of groups are connected in electrical parallel; a sub mount of monolithic construction including a plurality of L-shaped patterned circuit material layers (1510, 1520), wherein each of the plurality of L-shaped patterned circuit material layers includes an arm portion (1511, 1521) and a stem portion (1512 & 1513, 1522 & 1523), wherein the arm portion functions as a light emitting device bond pad which extends completely below a soldered portion of the light emitting device and the stem portion extends around the light emitting device to form a current trace (1513,1523) and a wire bond pad area (1512, 1522); wherein each light emitting device of a group of electrically in-series light emitting devices of the plurality of groups of electrically in-series light emitting devices is affixed to a corresponding arm portion (1511, 1521) of the submount; and wherein the plurality of stem portions (1512, 1522) are located substantially external to an area defined by the length and width of the array (330, 1407), run substantially parallel to the length of the array and collectively perform a primary current carrying function for current flow between adjacent light emitting devices of the group of electrically in-series light emitting devices; and a multi-layer flex circuit (510, 1403) including an anode layer and a cathode layer, the multi-layer flex circuit having formed therein a rectangular aperture within which the sub mount and the array (330, 1407) are located; wherein the anode layer of the multi-layer flex circuit (510, 1403) is electrically coupled to a light emitting device bond pad associated with a first light emitting device of the group of electrically in-series light emitting devices; and wherein the cathode layer of the multi-layer flex circuit (510, 1403) is electrically coupled to a circuit trace associated with a last light emitting device of the group of electrically in-series light emitting devices. an array of light emitting devices (330, 1407), the array having a high aspect ratio in which a length of the array is greater than a width of the array, wherein the light emitting devices are closely spaced to create a high fill factor and includes a plurality of groups of electrically in-series light emitting devices in which the plurality of groups are connected in electrical parallel; a sub mount of monolithic construction including a plurality of L-shaped patterned circuit material layers (1510, 1520), wherein each of the plurality of L-shaped patterned circuit material layers includes an arm portion (1511, 1521) and a stem portion (1512 & 1513, 1522 & 1523), wherein the arm portion functions as a light emitting device bond pad which extends completely below a soldered portion of the light emitting device and the stem portion extends around the light emitting device to form a current trace (1513,1523) and a wire bond pad area (1512, 1522); wherein each light emitting device of a group of electrically in-series light emitting devices of the plurality of groups of electrically in-series light emitting devices is affixed to a corresponding arm portion (1511, 1521) of the submount; and wherein the plurality of stem portions (1512, 1522) are located substantially external to an area defined by the length and width of the array (330, 1407), run substantially parallel to the length of the array and collectively perform a primary current carrying function for current flow between adjacent light emitting devices of the group of electrically in-series light emitting devices; and a multi-layer flex circuit (510, 1403) including an anode layer and a cathode layer, the multi-layer flex circuit having formed therein a rectangular aperture within which the sub mount and the array (330, 1407) are located; wherein the anode layer of the multi-layer flex circuit (510, 1403) is electrically coupled to a light emitting device bond pad associated with a first light emitting device of the group of electrically in-series light emitting devices; and wherein the cathode layer of the multi-layer flex circuit (510, 1403) is electrically coupled to a circuit trace associated with a last light emitting device of the group of electrically in-series light emitting devices.