An LED module comprising: an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the LED chip to the wiring circuit, the first bond and the second bond each allowing light emitted from the LED chip to pass therethrough, the submount being a light-transmissive member having light diffusing properties, the LED chip including: a LED structure portion including a n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer; and a transparent substrate being transparent to light emitted from the light-emitting layer, the LED structure portion provided on a main surface of the transparent substrate, the transparent substrate being situated closer to the light-transmissive member than the LED structure portion, the light-transmissive member having a planar size greater than a planar size of the LED chip, the light-transmissive member being a first ceramic layer and a second ceramic layer which are stacked in a thickness direction of the light-transmissive member, the first ceramic layer and the second ceramic layer being arranged from the LED chip in order of the first ceramic layer and the second ceramic layer, the first ceramic layer being thicker than the second ceramic layer, the first ceramic layer including ceramic particles having a greater particle diameter than the second ceramic layer while the second ceramic layer includes ceramic particles having a smaller particle diameter than the first ceramic layer and further includes pores, the first ceramic layer having relatively higher light transmittance, the second ceramic layer having relatively higher light scattering rate and reflectance, out of the first ceramic layer and the second ceramic layer, absorptance of light of the submount being smaller than the absorptance of light of the opaque substrate. an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the LED chip to the wiring circuit, the first bond and the second bond each allowing light emitted from the LED chip to pass therethrough, the submount being a light-transmissive member having light diffusing properties, the LED chip including: a LED structure portion including a n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer; and a transparent substrate being transparent to light emitted from the light-emitting layer, a LED structure portion including a n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer; and a transparent substrate being transparent to light emitted from the light-emitting layer, the LED structure portion provided on a main surface of the transparent substrate, the transparent substrate being situated closer to the light-transmissive member than the LED structure portion, the light-transmissive member having a planar size greater than a planar size of the LED chip, the light-transmissive member being a first ceramic layer and a second ceramic layer which are stacked in a thickness direction of the light-transmissive member, the first ceramic layer and the second ceramic layer being arranged from the LED chip in order of the first ceramic layer and the second ceramic layer, the first ceramic layer being thicker than the second ceramic layer, the first ceramic layer including ceramic particles having a greater particle diameter than the second ceramic layer while the second ceramic layer includes ceramic particles having a smaller particle diameter than the first ceramic layer and further includes pores, the first ceramic layer having relatively higher light transmittance, the second ceramic layer having relatively higher light scattering rate and reflectance, out of the first ceramic layer and the second ceramic layer, absorptance of light of the submount being smaller than the absorptance of light of the opaque substrate.