A light-emitting device (10, 20, 30, 40, 50, 60) comprising: a metal substrate (2, 22, 32, 42) comprising electrode portions (2a-2g) in a topside of the metal substrate (2, 22, 32, 42); a first recessed groove along a perimeter of the topside of the metal substrate (2, 22, 32, 42); insulative portions each separating corresponding ones of the electrode portions (2a - 2g) from each other so that one of the electrode portions (2a-2g) serves as an anode and another of the electrode portions (2a-2g) serves as a cathode, the insulative portions each comprising an electrode separation groove extending through the metal substrate (2, 22, 32, 42) and an insulative resin filling the electrode separation groove and exposed to a backside of the metal substrate (2, 22, 32, 42); a plurality of LEDs (1a-1f) at the topside of the metal substrate (2, 22, 32, 42), each of the LEDs (1a-1f) straddling a corresponding one of the insulative portions and being electrically coupled to corresponding ones of the electrode portions (2a-2g); a support frame (4, 54) at the perimeter of the topside of the metal substrate (2, 22, 32, 42), the support frame (4, 54) comprising an inner wall portion (4b, 54b) and an outer wall portion (4c, 54c) each being integral with the support frame (4, 54), the inner wall portion (4b, 54b) being disposed within the first recessed groove, the outer wall portion (4c, 54c) covering an outer perimeter surface of the metal substrate (2, 22, 32, 42) in close contact with the outer perimeter surface, and being disposed along an entire perimeter of the metal substrate (2, 22, 32, 42) in close contact with outer lateral surfaces of the metal substrate (2, 22, 32, 42), a backside of the outer wall portion (4c, 54c) being located above the backside of the metal substrate (2, 22, 32, 42), and the support frame (4, 54) being fixedly attached to the perimeter of the topside of the metal substrate (2, 22, 32, 42) via the inner wall portion (4b, 54b) and the outer wall portion (4c, 54c); and an encapsulation resin disposed within the support frame (4, 54) to at least partially encapsulate the LEDs (1a-1f). a metal substrate (2, 22, 32, 42) comprising electrode portions (2a-2g) in a topside of the metal substrate (2, 22, 32, 42); a first recessed groove along a perimeter of the topside of the metal substrate (2, 22, 32, 42); insulative portions each separating corresponding ones of the electrode portions (2a - 2g) from each other so that one of the electrode portions (2a-2g) serves as an anode and another of the electrode portions (2a-2g) serves as a cathode, the insulative portions each comprising an electrode separation groove extending through the metal substrate (2, 22, 32, 42) and an insulative resin filling the electrode separation groove and exposed to a backside of the metal substrate (2, 22, 32, 42); a plurality of LEDs (1a-1f) at the topside of the metal substrate (2, 22, 32, 42), each of the LEDs (1a-1f) straddling a corresponding one of the insulative portions and being electrically coupled to corresponding ones of the electrode portions (2a-2g); a support frame (4, 54) at the perimeter of the topside of the metal substrate (2, 22, 32, 42), the support frame (4, 54) comprising an inner wall portion (4b, 54b) and an outer wall portion (4c, 54c) each being integral with the support frame (4, 54), the inner wall portion (4b, 54b) being disposed within the first recessed groove, the outer wall portion (4c, 54c) covering an outer perimeter surface of the metal substrate (2, 22, 32, 42) in close contact with the outer perimeter surface, and being disposed along an entire perimeter of the metal substrate (2, 22, 32, 42) in close contact with outer lateral surfaces of the metal substrate (2, 22, 32, 42), a backside of the outer wall portion (4c, 54c) being located above the backside of the metal substrate (2, 22, 32, 42), and the support frame (4, 54) being fixedly attached to the perimeter of the topside of the metal substrate (2, 22, 32, 42) via the inner wall portion (4b, 54b) and the outer wall portion (4c, 54c); and an encapsulation resin disposed within the support frame (4, 54) to at least partially encapsulate the LEDs (1a-1f).