A sensor module comprising: a substrate having a top surface and a back surface, the top surface extending in a first direction (x) and a second direction (y) perpendicular to the first direction (x); a sensor element mounted on the top surface of the substrate; an external terminal formed on the back surface of the substrate; and a case fixed to the substrate so as to cover the sensor element, wherein the case has a top plate part having first and second edges extending in the first direction (x), having third and fourth edges extending in the second direction (y), and having a plurality of through holes, and wherein the top plate part has a center area and an outside area each having no through holes and a through hole formation area having the plurality of through holes, the through hole formation area being positioned so as to surround the center area, the outside area being positioned so as to surround the through hole formation area, the through hole formation area has a ring shape, characterized in that a center position of the center area coincides with the center position of the top plate part and the through hole formation area includes four linear parts (41B 1) and four corner parts (41B 2), wherein at least three through holes are arranged in each of the linear parts (41B 1) and each corner part (41B 2) connecting two linear parts (41B 1), and wherein each corner part (41B 2) is positioned in the vicinity of a corner portion of the top plate part and constitutes a clearance area having no through holes, thereby a space between adjacent two through holes belonging to different linear parts (41B 1) is greater than a space between adjacent two through holes belonging to the same linear part (41B 1), and at least one of the through holes overlaps the sensor element as viewed in a third direction (z) perpendicular to the first and second directions (x, y). a substrate having a top surface and a back surface, the top surface extending in a first direction (x) and a second direction (y) perpendicular to the first direction (x); a sensor element mounted on the top surface of the substrate; an external terminal formed on the back surface of the substrate; and a case fixed to the substrate so as to cover the sensor element, wherein the case has a top plate part having first and second edges extending in the first direction (x), having third and fourth edges extending in the second direction (y), and having a plurality of through holes, and wherein the top plate part has a center area and an outside area each having no through holes and a through hole formation area having the plurality of through holes, the through hole formation area being positioned so as to surround the center area, the outside area being positioned so as to surround the through hole formation area, the through hole formation area has a ring shape, a center position of the center area coincides with the center position of the top plate part and the through hole formation area includes four linear parts (41B 1) and four corner parts (41B 2), wherein at least three through holes are arranged in each of the linear parts (41B 1) and each corner part (41B 2) connecting two linear parts (41B 1), and wherein each corner part (41B 2) is positioned in the vicinity of a corner portion of the top plate part and constitutes a clearance area having no through holes, thereby a space between adjacent two through holes belonging to different linear parts (41B 1) is greater than a space between adjacent two through holes belonging to the same linear part (41B 1), and at least one of the through holes overlaps the sensor element as viewed in a third direction (z) perpendicular to the first and second directions (x, y).