An electronic board including: - a main printed circuit including tracks; - an interposed printed circuit positioned on the main printed circuit, including: - a substantially rectangular substrate, having a length and a width smaller than the length, including an upper face, a lower face and at least one edge; - at least one metal track located on at least one of the upper face and of the lower face, able to transmit electric signals; - a plurality of half-holes connecting the upper face and the lower face, located at the edge, having a metal layer covering an internal surface of each half-hole; and - at least one electronic component located on the upper face, electrically connected to the tracks of the interposed printed circuit through at least one solder; the interposed printed circuit being connected to the tracks of the main printed circuit through at least one solder made with a first supply material, located on the metal layer of each half-hole, the substrate having a surface area comprised between 4 mm 2 and 1,600 mm 2, the ratio between the length and the width of the substrate being less than or equal to 6, characterized and in that each solder connecting the electronic component to the interposed printed circuit is made with a second supply material including a lead mass content of more than 33%, and in that the combination of the width of the substrate, the length of the substrate and the pitch separating each half-hole from the closest half-hole is selected among the following combinations: (2 mm, 3 mm, 0.5 mm), (2 mm, 3 mm, 0.65 mm), (3 mm, 4 mm, 0.5 mm), (3 mm, 4 mm, 0.65 mm), (3 mm, 4 mm, 0.8 mm), (5 mm, 5 mm, 0.5 mm), (5 mm, 5 mm, 0.65 mm), (5 mm, 5 mm, 0.8 mm), (5 mm, 5 mm, 1 mm), (5 mm, 5 mm, 1.27 mm), (7 mm, 8 mm, 0.5 mm), (7 mm, 8 mm, 0.65 mm), (7 mm, 8 mm, 0.8 mm), (7 mm, 10 mm, 0.5 mm), (7 mm, 10 mm, 0.65 mm), (7 mm, 10 mm, 0.8 mm), (7 mm, 10 mm, 1 mm), (10 mm, 10 mm, 0.65 mm), (10 mm, 10 mm, 0.8 mm), (10 mm, 10 mm, 1 mm), (9 mm, 12 mm, 0.65 mm), (9 mm, 12 mm, 0.8 mm), (9 mm, 12 mm, 1 mm), (10 mm, 18 mm, 0.65 mm), (10 mm, 18 mm, 0.8 mm), (10 mm, 18 mm, 1 mm), (13 mm, 13 mm, 0.8 mm), (13 mm, 13 mm, 1 mm), (15 mm, 15 mm, 0.8 mm), (15 mm, 15 mm, 1 mm), (17 mm, 20 mm, 0.8 mm), (17 mm, 20 mm, 1 mm), (10 mm, 29 mm, 0.8 mm), (10 mm, 29 mm, 1 mm), (20 mm, 27 mm, 0.8 mm), (20 mm, 27 mm, 1 mm), (33 mm, 33 mm, 1.27 mm). - a main printed circuit including tracks; - an interposed printed circuit positioned on the main printed circuit, including: - a substantially rectangular substrate, having a length and a width smaller than the length, including an upper face, a lower face and at least one edge; - at least one metal track located on at least one of the upper face and of the lower face, able to transmit electric signals; - a plurality of half-holes connecting the upper face and the lower face, located at the edge, having a metal layer covering an internal surface of each half-hole; and - a substantially rectangular substrate, having a length and a width smaller than the length, including an upper face, a lower face and at least one edge; - at least one metal track located on at least one of the upper face and of the lower face, able to transmit electric signals; - a plurality of half-holes connecting the upper face and the lower face, located at the edge, having a metal layer covering an internal surface of each half-hole; and - at least one electronic component located on the upper face, electrically connected to the tracks of the interposed printed circuit through at least one solder; the interposed printed circuit being connected to the tracks of the main printed circuit through at least one solder made with a first supply material, located on the metal layer of each half-hole, the substrate having a surface area comprised between 4 mm 2 and 1,600 mm 2, the ratio between the length and the width of the substrate being less than or equal to 6, characterized and in that each solder connecting the electronic component to the interposed printed circuit is made with a second supply material including a lead mass content of more than 33%, and in that the combination of the width of the substrate, the length of the substrate and the pitch separating each half-hole from the closest half-hole is selected among the following combinations: (2 mm, 3 mm, 0.5 mm), (2 mm, 3 mm, 0.65 mm), (3 mm, 4 mm, 0.5 mm), (3 mm, 4 mm, 0.65 mm), (3 mm, 4 mm, 0.8 mm), (5 mm, 5 mm, 0.5 mm), (5 mm, 5 mm, 0.65 mm), (5 mm, 5 mm, 0.8 mm), (5 mm, 5 mm, 1 mm), (5 mm, 5 mm, 1.27 mm), (7 mm, 8 mm, 0.5 mm), (7 mm, 8 mm, 0.65 mm), (7 mm, 8 mm, 0.8 mm), (7 mm, 10 mm, 0.5 mm), (7 mm, 10 mm, 0.65 mm), (7 mm, 10 mm, 0.8 mm), (7 mm, 10 mm, 1 mm), (10 mm, 10 mm, 0.65 mm), (10 mm, 10 mm, 0.8 mm), (10 mm, 10 mm, 1 mm), (9 mm, 12 mm, 0.65 mm), (9 mm, 12 mm, 0.8 mm), (9 mm, 12 mm, 1 mm), (10 mm, 18 mm, 0.65 mm), (10 mm, 18 mm, 0.8 mm), (10 mm, 18 mm, 1 mm), (13 mm, 13 mm, 0.8 mm), (13 mm, 13 mm, 1 mm), (15 mm, 15 mm, 0.8 mm), (15 mm, 15 mm, 1 mm), (17 mm, 20 mm, 0.8 mm), (17 mm, 20 mm, 1 mm), (10 mm, 29 mm, 0.8 mm), (10 mm, 29 mm, 1 mm), (20 mm, 27 mm, 0.8 mm), (20 mm, 27 mm, 1 mm), (33 mm, 33 mm, 1.27 mm).