A method for registering inspection standard data that is of a standard for a defective determination of a solder fillet in a board inspection apparatus, the board inspection apparatus performing an soldering inspection including imaging a component mounting board to which a plurality of components are soldered under lighting from a plurality of directions, measuring a three-dimensional shape of a solder fillet of each component using a generated image, and performing the defective determination of the solder fillet based on a measurement result, the method including: repeating a step of displaying a setting screen and a step of receiving, from a user, input of a numerical value to an input field to one component on the board of the inspection target or a group including a plurality of identical kind of components, while the target component is changed, in order to set a standard of an inspection for defective determination of a numerical parameter expressing the three-dimensional shape of the solder fillet with respect to the target component, the setting screen including a list of a plurality of inspection items, each item name thereof being correlated with an input field of a standard value used for defective determination of a numerical parameter measured by the respective inspection items, and an image of the component of a setting target; setting the inspection item to which the standard value is input in each setting screen to the item that should be performed in the inspection of the component corresponding to the setting screen, setting the numerical value input in each inspection item to the standard value of the defective determination, and producing inspection standard data by a combination of the inspection item and the standard value; registering a set of the pieces of the produced inspection standard data in the board inspection apparatus; and when a manipulation has been performed to select one of the inspection items in the setting screen for the purpose of reference while the setting screen is displayed, displaying a reference diagram in which a concept of the parameter measured by the selected inspection item is expressed by an image expressing a shape of solder to the component of the processing target in a place that is not overlapped with the display of the currently-selected inspection item, wherein, in the reference diagram, a gauge (Z1 to Z4) is shown that expresses a numerical range in which the numerical parameter is determined to be non-defective and a numerical range in which the numerical parameter is determined to be defective. repeating a step of displaying a setting screen and a step of receiving, from a user, input of a numerical value to an input field to one component on the board of the inspection target or a group including a plurality of identical kind of components, while the target component is changed, in order to set a standard of an inspection for defective determination of a numerical parameter expressing the three-dimensional shape of the solder fillet with respect to the target component, the setting screen including a list of a plurality of inspection items, each item name thereof being correlated with an input field of a standard value used for defective determination of a numerical parameter measured by the respective inspection items, and an image of the component of a setting target; setting the inspection item to which the standard value is input in each setting screen to the item that should be performed in the inspection of the component corresponding to the setting screen, setting the numerical value input in each inspection item to the standard value of the defective determination, and producing inspection standard data by a combination of the inspection item and the standard value; registering a set of the pieces of the produced inspection standard data in the board inspection apparatus; and when a manipulation has been performed to select one of the inspection items in the setting screen for the purpose of reference while the setting screen is displayed, displaying a reference diagram in which a concept of the parameter measured by the selected inspection item is expressed by an image expressing a shape of solder to the component of the processing target in a place that is not overlapped with the display of the currently-selected inspection item, wherein, in the reference diagram, a gauge (Z1 to Z4) is shown that expresses a numerical range in which the numerical parameter is determined to be non-defective and a numerical range in which the numerical parameter is determined to be defective.