A method of fabricating an optical device, the method comprising: in the following order: (i) exposing a sub-layer of the optical device to an energy source, wherein exposing the sub-layer to the energy source increases absorptive properties of the sub-layer, or changes properties of the sub-layer and an underlying layer so that the sub-layer has higher absorptive properties relative to the underlying layer; (ii) depositing one or more material layers of the optical device on the sub-layer; and (iii) ablating the one or more material layers and the sub-layer with a laser to expose the underlying layer, wherein the energy source used in (i) is one of the laser used in (iii), another laser, or a plasma, and wherein (i) is performed only on a portion of an area of the sub-layer and (iii) is performed substantially on the same portion of the sub-layer; or (i) applying a sacrificial material layer only to a portion of an area of one or more sub-layers of the optical device; (ii) depositing one or more material layers of the optical device on the sacrificial material layer and the one or more sub-layers; and (iii) applying a laser to the portion to ablate the optical device at least down to and into the sacrificial material layer, wherein material and thickness of the sacrificial material layer provide predefined absorptive properties that control thermal flux used in application of the laser in (iii). in the following order: (i) exposing a sub-layer of the optical device to an energy source, wherein exposing the sub-layer to the energy source increases absorptive properties of the sub-layer, or changes properties of the sub-layer and an underlying layer so that the sub-layer has higher absorptive properties relative to the underlying layer; (ii) depositing one or more material layers of the optical device on the sub-layer; and (iii) ablating the one or more material layers and the sub-layer with a laser to expose the underlying layer, wherein the energy source used in (i) is one of the laser used in (iii), another laser, or a plasma, and wherein (i) is performed only on a portion of an area of the sub-layer and (iii) is performed substantially on the same portion of the sub-layer; or (i) exposing a sub-layer of the optical device to an energy source, wherein exposing the sub-layer to the energy source increases absorptive properties of the sub-layer, or changes properties of the sub-layer and an underlying layer so that the sub-layer has higher absorptive properties relative to the underlying layer; (ii) depositing one or more material layers of the optical device on the sub-layer; and (iii) ablating the one or more material layers and the sub-layer with a laser to expose the underlying layer, wherein the energy source used in (i) is one of the laser used in (iii), another laser, or a plasma, and wherein (i) is performed only on a portion of an area of the sub-layer and (iii) is performed substantially on the same portion of the sub-layer; or wherein the energy source used in (i) is one of the laser used in (iii), another laser, or a plasma, and wherein (i) is performed only on a portion of an area of the sub-layer and (iii) is performed substantially on the same portion of the sub-layer; or (i) applying a sacrificial material layer only to a portion of an area of one or more sub-layers of the optical device; (ii) depositing one or more material layers of the optical device on the sacrificial material layer and the one or more sub-layers; and (iii) applying a laser to the portion to ablate the optical device at least down to and into the sacrificial material layer, wherein material and thickness of the sacrificial material layer provide predefined absorptive properties that control thermal flux used in application of the laser in (iii). (i) applying a sacrificial material layer only to a portion of an area of one or more sub-layers of the optical device; (ii) depositing one or more material layers of the optical device on the sacrificial material layer and the one or more sub-layers; and (iii) applying a laser to the portion to ablate the optical device at least down to and into the sacrificial material layer, wherein material and thickness of the sacrificial material layer provide predefined absorptive properties that control thermal flux used in application of the laser in (iii).