A system, comprising: a liquid cooling chamber in contact with a heat generating device within a computing device, the liquid cooling chamber to contain a liquid coolant and transfer heat from the heat generating device into a liquid circulation loop, the system being characterised by: the liquid circulation loop extending around a perimeter of the liquid cooling chamber; a comb structure adjacent to the liquid cooling chamber to transfer heat into the liquid circulation loop; and a liquid exit pipe coupled to the liquid circulation loop to direct a flow of the liquid coolant around the liquid cooling chamber; a heat contact pedestal (113, 313) coupled to the liquid cooling chamber, the heat contact pedestal in contact with a voltage regulator; wherein the heat generating device is located in a server within the computing device, and further comprising the liquid exit pipe to direct the flow of the liquid coolant to a location different than the liquid cooling chamber and the liquid circulation loop and external to the server; wherein the heat contact pedestal (113, 313) includes: a first surface having a plane parallel to a plane of the liquid cooling chamber, the first surface in contact with the voltage regulator; and a second surface having a plane parallel to the plane of the liquid cooling chamber and opposite of the first surface, wherein the second surface is in contact with a thermal interface material, wherein the thermal interface material is a gap pad type of material. a liquid cooling chamber in contact with a heat generating device within a computing device, the liquid cooling chamber to contain a liquid coolant and transfer heat from the heat generating device into a liquid circulation loop, the system being characterised by: the liquid circulation loop extending around a perimeter of the liquid cooling chamber; a comb structure adjacent to the liquid cooling chamber to transfer heat into the liquid circulation loop; and a liquid exit pipe coupled to the liquid circulation loop to direct a flow of the liquid coolant around the liquid cooling chamber; the liquid circulation loop extending around a perimeter of the liquid cooling chamber; a comb structure adjacent to the liquid cooling chamber to transfer heat into the liquid circulation loop; and a liquid exit pipe coupled to the liquid circulation loop to direct a flow of the liquid coolant around the liquid cooling chamber; a heat contact pedestal (113, 313) coupled to the liquid cooling chamber, the heat contact pedestal in contact with a voltage regulator; wherein the heat generating device is located in a server within the computing device, and further comprising the liquid exit pipe to direct the flow of the liquid coolant to a location different than the liquid cooling chamber and the liquid circulation loop and external to the server; wherein the heat contact pedestal (113, 313) includes: a first surface having a plane parallel to a plane of the liquid cooling chamber, the first surface in contact with the voltage regulator; and a second surface having a plane parallel to the plane of the liquid cooling chamber and opposite of the first surface, wherein the second surface is in contact with a thermal interface material, wherein the thermal interface material is a gap pad type of material. a first surface having a plane parallel to a plane of the liquid cooling chamber, the first surface in contact with the voltage regulator; and a second surface having a plane parallel to the plane of the liquid cooling chamber and opposite of the first surface, wherein the second surface is in contact with a thermal interface material, wherein the thermal interface material is a gap pad type of material.