An embedded circuit board, characterized by comprising: a first outer wiring board, a base board, and a second outer wiring board, stacking sequentially, wherein the base board defines at least one groove between the first outer wiring board and the second outer wiring board; a through hole is defined in each of the first outer wiring board, the base board, and the second outer wiring board, the through hole in the first outer wiring board, the through hole in the base board, and the through hole in the second outer wiring board are communicated with each other to serve as a resonant chamber; and a minimal distance between a side wall of the at least one groove and a side wall of the through hole adjacent to the at least one groove is in a range of 50um to 500um; and an electronic element, received in the groove, wherein the electronic element is at least one of a mini-microphone, a mini-loudspeaker, an acoustic wave resonator, a microwave resonator, an ultrasonic transducer, a sensor chip, and a digital chip; wherein the resonant chamber comprises two adjacent resonant chambers (110A, 110B) defined by a chamber wall in common; the chamber wall defines a coupling window, and the signals between the two adjacent resonant chambers (110A, 110B) are coupled through the coupling window; and a resonant oscillator is received in each of the two adjacent resonant chambers (110A, 110B), a coupling block is received in the coupling window of the chamber wall; an end face is arranged at each of two end portions of the coupling block, and the end face is parallel to a surface of the resonant oscillator; and an electromagnetic field is generated at an outer periphery of the end face of the coupling block, and a direction of the electromagnetic field is the same as a direction of the surface of the resonant oscillator. a first outer wiring board, a base board, and a second outer wiring board, stacking sequentially, wherein the base board defines at least one groove between the first outer wiring board and the second outer wiring board; a through hole is defined in each of the first outer wiring board, the base board, and the second outer wiring board, the through hole in the first outer wiring board, the through hole in the base board, and the through hole in the second outer wiring board are communicated with each other to serve as a resonant chamber; and a minimal distance between a side wall of the at least one groove and a side wall of the through hole adjacent to the at least one groove is in a range of 50um to 500um; and the base board defines at least one groove between the first outer wiring board and the second outer wiring board; a through hole is defined in each of the first outer wiring board, the base board, and the second outer wiring board, the through hole in the first outer wiring board, the through hole in the base board, and the through hole in the second outer wiring board are communicated with each other to serve as a resonant chamber; and a minimal distance between a side wall of the at least one groove and a side wall of the through hole adjacent to the at least one groove is in a range of 50um to 500um; and an electronic element, received in the groove, wherein the electronic element is at least one of a mini-microphone, a mini-loudspeaker, an acoustic wave resonator, a microwave resonator, an ultrasonic transducer, a sensor chip, and a digital chip; wherein the resonant chamber comprises two adjacent resonant chambers (110A, 110B) defined by a chamber wall in common; the chamber wall defines a coupling window, and the signals between the two adjacent resonant chambers (110A, 110B) are coupled through the coupling window; and a resonant oscillator is received in each of the two adjacent resonant chambers (110A, 110B), a coupling block is received in the coupling window of the chamber wall; an end face is arranged at each of two end portions of the coupling block, and the end face is parallel to a surface of the resonant oscillator; and an electromagnetic field is generated at an outer periphery of the end face of the coupling block, and a direction of the electromagnetic field is the same as a direction of the surface of the resonant oscillator. a resonant oscillator is received in each of the two adjacent resonant chambers (110A, 110B), a coupling block is received in the coupling window of the chamber wall; an end face is arranged at each of two end portions of the coupling block, and the end face is parallel to a surface of the resonant oscillator; and an electromagnetic field is generated at an outer periphery of the end face of the coupling block, and a direction of the electromagnetic field is the same as a direction of the surface of the resonant oscillator.