An electronic assembly comprising: a cooling assembly (120, 220); at least one electronic device (110, 210) heat-generating in operation and including a surface to be cooled, wherein the surface to be cooled includes at least one first region of higher heat flux and at least one second region of lower heat flux; and a thermally conductive composite interface (130, 230) coupling the cooling assembly and the surface to be cooled, the thermally conductive composite interface comprising: a plurality of thermally conductive wires comprising a first material having a first thermal conductivity and; a thermal interface material surrounding the plurality of thermally conductive wires and thermally interfacing the cooling assembly to the surface to be cooled of the at least one heat-generating electronic device, the thermal interface material comprising a second material having a second thermal conductivity, wherein the first thermal conductivity of the first material is greater than the second thermal conductivity of the second material; characterized in that: at least some thermally conductive wires of the plurality of thermally conductive wires (330, 530) are each separately wire-bonded at a first end to the surface to be cooled of the at least one heat-generating electronic device (300, 500) in the at least one first region of higher heat flux (310, 510) so as to increase the thermal conductivity of the thermal interface in the first region of higher heat flux, and a second end of each of the at least some thermally conductive wires is disposed over the at least one second region of lower heat flux (320, 520) so as to reside partially over the at least one first region of higher heat flux and extend partially over the at least one second region of lower heat flux to function as thermal spreaders between the surface to be cooled and the cooling assembly for facilitating heat transfer from the at least one heat-generating electronic device to the cooling assembly. a cooling assembly (120, 220); at least one electronic device (110, 210) heat-generating in operation and including a surface to be cooled, wherein the surface to be cooled includes at least one first region of higher heat flux and at least one second region of lower heat flux; and a thermally conductive composite interface (130, 230) coupling the cooling assembly and the surface to be cooled, the thermally conductive composite interface comprising: a plurality of thermally conductive wires comprising a first material having a first thermal conductivity and; a thermal interface material surrounding the plurality of thermally conductive wires and thermally interfacing the cooling assembly to the surface to be cooled of the at least one heat-generating electronic device, the thermal interface material comprising a second material having a second thermal conductivity, wherein the first thermal conductivity of the first material is greater than the second thermal conductivity of the second material; characterized in that: a plurality of thermally conductive wires comprising a first material having a first thermal conductivity and; a thermal interface material surrounding the plurality of thermally conductive wires and thermally interfacing the cooling assembly to the surface to be cooled of the at least one heat-generating electronic device, the thermal interface material comprising a second material having a second thermal conductivity, wherein the first thermal conductivity of the first material is greater than the second thermal conductivity of the second material; characterized in that: at least some thermally conductive wires of the plurality of thermally conductive wires (330, 530) are each separately wire-bonded at a first end to the surface to be cooled of the at least one heat-generating electronic device (300, 500) in the at least one first region of higher heat flux (310, 510) so as to increase the thermal conductivity of the thermal interface in the first region of higher heat flux, and a second end of each of the at least some thermally conductive wires is disposed over the at least one second region of lower heat flux (320, 520) so as to reside partially over the at least one first region of higher heat flux and extend partially over the at least one second region of lower heat flux to function as thermal spreaders between the surface to be cooled and the cooling assembly for facilitating heat transfer from the at least one heat-generating electronic device to the cooling assembly.