A hermetic seal configured to be used in an electronic device comprising an active organic material, the hermetic seal comprising: a) a substrate having an interior substrate surface and an exterior substrate surface, wherein the active organic material is formed within a perimeter of the hermetic seal over the interior substrate surface; b) a first substrate strip having a first surface wettability located on the interior substrate surface between the active organic material and the perimeter of the hermetic seal; c) a second substrate strip having a second surface wettability different from the first surface wettability located on the interior substrate surface between the active organic material and the first substrate strip and in contact with the first substrate strip; d) a cover having an interior cover surface and an exterior cover surface disposed over the substrate, wherein the interior cover surface opposes the interior substrate surface; e) a first cover strip having the first surface wettability located on the interior cover surface opposite the first substrate strip within the perimeter of the hermetic seal; f) a second cover strip having the second surface wettability located on the interior cover surface opposite the second substrate strip and in contact with the first cover strip; and g) a sealing member that wets the first substrate strip and the first cover strip but not the second substrate strip and the second cover strip, adhered to the first substrate strip and the first cover strip having the first surface wettability and not adhered to the second substrate strip and the second cover strip having the second surface wettability, characterized in that the first cover strip and the first substrate strip have a glass surface, the second cover strip and the second substrate strip have an aluminum oxide surface, and the sealing member is an alloy including tin and indium, wherein the first substrate strip and the first cover strip are formed from a material that is different than the material of the cover or the substrate; the first cover strip and the first substrate strip have a metal oxide surface, the second cover strip and the second substrate strip have a glass surface, and the sealing member is a solder alloy; or the first cover strip and the first substrate strip have a silver surface, the second cover strip and the second substrate strip have an aluminum oxide surface, and the sealing member is an alloy including tin and indium, wherein the first substrate strip is an uncoated portion of the substrate or wherein the first cover strip is an uncoated portion of the cover. a) a substrate having an interior substrate surface and an exterior substrate surface, wherein the active organic material is formed within a perimeter of the hermetic seal over the interior substrate surface; b) a first substrate strip having a first surface wettability located on the interior substrate surface between the active organic material and the perimeter of the hermetic seal; c) a second substrate strip having a second surface wettability different from the first surface wettability located on the interior substrate surface between the active organic material and the first substrate strip and in contact with the first substrate strip; d) a cover having an interior cover surface and an exterior cover surface disposed over the substrate, wherein the interior cover surface opposes the interior substrate surface; e) a first cover strip having the first surface wettability located on the interior cover surface opposite the first substrate strip within the perimeter of the hermetic seal; f) a second cover strip having the second surface wettability located on the interior cover surface opposite the second substrate strip and in contact with the first cover strip; and g) a sealing member that wets the first substrate strip and the first cover strip but not the second substrate strip and the second cover strip, adhered to the first substrate strip and the first cover strip having the first surface wettability and not adhered to the second substrate strip and the second cover strip having the second surface wettability, the first cover strip and the first substrate strip have a glass surface, the second cover strip and the second substrate strip have an aluminum oxide surface, and the sealing member is an alloy including tin and indium, wherein the first substrate strip and the first cover strip are formed from a material that is different than the material of the cover or the substrate; the first cover strip and the first substrate strip have a metal oxide surface, the second cover strip and the second substrate strip have a glass surface, and the sealing member is a solder alloy; or the first cover strip and the first substrate strip have a silver surface, the second cover strip and the second substrate strip have an aluminum oxide surface, and the sealing member is an alloy including tin and indium, wherein the first substrate strip is an uncoated portion of the substrate or wherein the first cover strip is an uncoated portion of the cover.