A manufacturing method of a semiconductor apparatus, comprising: a step of manufacturing a semiconductor device chip having a semiconductor device unit on an obverse surface and junction terminals on a reverse surface, the junction terminals being connected with the semiconductor device unit via through wirings; a step of manufacturing a wiring board having a rectangular shape and a width smaller than a width of the semiconductor device chip, the wiring board having first terminals and second terminals connected with the first terminals on a first primary surface, the first terminals and the second terminals being disposed on both sides with a flexible portion intervened in between; a step of joining a first junction surface of a heat conductive block to a second primary surface of the wiring board in a second terminal opposing region which is opposite to a region in which the second terminals are disposed on the first primary surface of the wiring board in a planar state, the heat conductive block being made of a material having thermal conductivity not lower than 20 Wm -1 K -1; a step of joining the junction terminals of the semiconductor device chip to the first terminals of the wiring board in the planar state; a step of performing solder joining of core wires of a signal cable to the second terminals of the wiring board by conducting heat generated by a heat tool, which is heated to have a soldering temperature, through the heat conductive block; a step of bending the wiring board at the flexible portion such that a second junction surface of the heat conductive block which is opposite to the first junction surface comes in contact with the second primary surface of the wiring board, and arranging the wiring board within a projected plane of the semiconductor device chip; and a step of housing the semiconductor device chip, the wiring board, the heat conductive block and the signal cable, which are integrated, inside a frame member made of metal, and sealing the semiconductor device chip, the wiring board, the heat conductive block and the signal cable with sealing resin. a step of manufacturing a semiconductor device chip having a semiconductor device unit on an obverse surface and junction terminals on a reverse surface, the junction terminals being connected with the semiconductor device unit via through wirings; a step of manufacturing a wiring board having a rectangular shape and a width smaller than a width of the semiconductor device chip, the wiring board having first terminals and second terminals connected with the first terminals on a first primary surface, the first terminals and the second terminals being disposed on both sides with a flexible portion intervened in between; a step of joining a first junction surface of a heat conductive block to a second primary surface of the wiring board in a second terminal opposing region which is opposite to a region in which the second terminals are disposed on the first primary surface of the wiring board in a planar state, the heat conductive block being made of a material having thermal conductivity not lower than 20 Wm -1 K -1; a step of joining the junction terminals of the semiconductor device chip to the first terminals of the wiring board in the planar state; a step of performing solder joining of core wires of a signal cable to the second terminals of the wiring board by conducting heat generated by a heat tool, which is heated to have a soldering temperature, through the heat conductive block; a step of bending the wiring board at the flexible portion such that a second junction surface of the heat conductive block which is opposite to the first junction surface comes in contact with the second primary surface of the wiring board, and arranging the wiring board within a projected plane of the semiconductor device chip; and a step of housing the semiconductor device chip, the wiring board, the heat conductive block and the signal cable, which are integrated, inside a frame member made of metal, and sealing the semiconductor device chip, the wiring board, the heat conductive block and the signal cable with sealing resin.