A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board, the component mounting device comprising: a head having a pickup member which is configured to pick up the component; a relative moving device configured to relatively move the head; a relative rotation device configured to relatively rotate the pickup member; a temporary loading stand on which the component is capable of being loaded; an upper imaging device configured to image the component from above; and a control device configured to control the head, the relative moving device, and the relative rotation device in such a way that the pickup member picks up a component supplied from a component supplying device, control the head and the relative moving device in such a way that the picked-up component is loaded on the temporary loading stand, control the upper imaging device in such a way that an upper surface of the loaded component is imaged, control the head, the relative moving device, and the relative rotation device in such a way that the pickup member picks up again the loaded component, and control the head, the relative moving device, and the relative rotation device in such a way that the component picked up again is mounted, at a target mounting angle to the board, at a target mounting position corrected based on a position deviation amount of the feature portion recognized by an upper surface image of the imaged upper surface, characterized in that the control device is further configured to control the relative rotation device in such a way that the picked-up component is loaded on the temporary loading stand at the angle equal to the target mounting angle to the board. a head having a pickup member which is configured to pick up the component; a relative moving device configured to relatively move the head; a relative rotation device configured to relatively rotate the pickup member; a temporary loading stand on which the component is capable of being loaded; an upper imaging device configured to image the component from above; and a control device configured to control the head, the relative moving device, and the relative rotation device in such a way that the pickup member picks up a component supplied from a component supplying device, control the head and the relative moving device in such a way that the picked-up component is loaded on the temporary loading stand, control the upper imaging device in such a way that an upper surface of the loaded component is imaged, control the head, the relative moving device, and the relative rotation device in such a way that the pickup member picks up again the loaded component, and control the head, the relative moving device, and the relative rotation device in such a way that the component picked up again is mounted, at a target mounting angle to the board, at a target mounting position corrected based on a position deviation amount of the feature portion recognized by an upper surface image of the imaged upper surface, control the head, the relative moving device, and the relative rotation device in such a way that the pickup member picks up a component supplied from a component supplying device, control the head and the relative moving device in such a way that the picked-up component is loaded on the temporary loading stand, control the upper imaging device in such a way that an upper surface of the loaded component is imaged, control the head, the relative moving device, and the relative rotation device in such a way that the pickup member picks up again the loaded component, and control the head, the relative moving device, and the relative rotation device in such a way that the component picked up again is mounted, at a target mounting angle to the board, at a target mounting position corrected based on a position deviation amount of the feature portion recognized by an upper surface image of the imaged upper surface, characterized in that the control device is further configured to control the relative rotation device in such a way that the picked-up component is loaded on the temporary loading stand at the angle equal to the target mounting angle to the board.