A pressure sensor comprising: pressure measurement circuitry; a pressure sensor die (40, 240, 640) configured to receive a process pressure and provide an output indicative of the process pressure to the process measurement circuitry; a pressure sensor body; and a pressure sensor pedestal (110, 210, 610), coupled to the pressure sensor die (40, 240, 640), the pressure sensor pedestal (110, 210, 610) configured to provide insulation between the pressure sensor die (40, 240, 640) and the pressure sensor body, the pressure sensor pedestal (110, 210, 610) comprising: an insulating layer (110, 210, 610) comprising a brittle material, the insulating layer being configured to isolate the pressure sensor body from the pressure sensor die (40, 240, 640); and a metallization layer (220, 620) disposed on the insulating layer (110, 210, 610), a material joining layer coupling the metallization layer (220, 620) to the pressure sensor die (40, 240, 640), wherein the metallization layer (220, 620) extends beyond a joining area between the insulating layer (110, 210, 610) and the pressure sensor die (40, 640), characterized in that the metallization layer (220, 620) further extends past a convex edge feature of the insulating layer (110, 210, 610), onto an adjacent surface of the insulating layer (110, 210, 610), the adjacent surface not being parallel to the joining surface of the joining area. pressure measurement circuitry; a pressure sensor die (40, 240, 640) configured to receive a process pressure and provide an output indicative of the process pressure to the process measurement circuitry; a pressure sensor body; and a pressure sensor pedestal (110, 210, 610), coupled to the pressure sensor die (40, 240, 640), the pressure sensor pedestal (110, 210, 610) configured to provide insulation between the pressure sensor die (40, 240, 640) and the pressure sensor body, the pressure sensor pedestal (110, 210, 610) comprising: an insulating layer (110, 210, 610) comprising a brittle material, the insulating layer being configured to isolate the pressure sensor body from the pressure sensor die (40, 240, 640); and a metallization layer (220, 620) disposed on the insulating layer (110, 210, 610), a material joining layer coupling the metallization layer (220, 620) to the pressure sensor die (40, 240, 640), wherein the metallization layer (220, 620) extends beyond a joining area between the insulating layer (110, 210, 610) and the pressure sensor die (40, 640), characterized in that the metallization layer (220, 620) further extends past a convex edge feature of the insulating layer (110, 210, 610), onto an adjacent surface of the insulating layer (110, 210, 610), the adjacent surface not being parallel to the joining surface of the joining area. an insulating layer (110, 210, 610) comprising a brittle material, the insulating layer being configured to isolate the pressure sensor body from the pressure sensor die (40, 240, 640); and a metallization layer (220, 620) disposed on the insulating layer (110, 210, 610), a material joining layer coupling the metallization layer (220, 620) to the pressure sensor die (40, 240, 640), wherein the metallization layer (220, 620) extends beyond a joining area between the insulating layer (110, 210, 610) and the pressure sensor die (40, 640), characterized in that the metallization layer (220, 620) further extends past a convex edge feature of the insulating layer (110, 210, 610), onto an adjacent surface of the insulating layer (110, 210, 610), the adjacent surface not being parallel to the joining surface of the joining area.