An endoscope including: a handle including a handle housing including a grip portion and a control portion, wherein the control portion comprises actuating elements for enabling/disabling user controls of a user interface of an external display, the handle housing defining an inner chamber containing: a main board including a processor and memory for system control, data capture, image processing, and video output; a power board including an integrated power chip to manage system power; a button board to enable/disable user controls, wherein the button board is operably associated with the actuating elements of the control portion; and a switch board to power the endoscope on and off; and an elongated body extending distally from the handle, the elongated body including: a camera including an image sensor disposed in a distal portion of the elongated body and a lens disposed at the distal end of the elongated body; a light source; and wherein the processor includes a peripheral controller for controlling the transmission of data between the processor and the camera and a peripheral controller for controlling the transmission of data between the processor and the light source; characterized in that the light source is disposed at a distal end of the elongated body, wherein the light source includes one or more light emitting elements integrated into the distal end of the elongated body and positioned radially outward of the lens; the endoscope further comprising a thermally conductive substrate affixed to the light source, and a heat sink comprising a distal side, wherein the distal side is in contact with the thermally conductive substrate, wherein a thermally conductive adhesive is disposed between the heat sink and the thermally conductive substrate. a handle including a handle housing including a grip portion and a control portion, wherein the control portion comprises actuating elements for enabling/disabling user controls of a user interface of an external display, the handle housing defining an inner chamber containing: a main board including a processor and memory for system control, data capture, image processing, and video output; a power board including an integrated power chip to manage system power; a button board to enable/disable user controls, wherein the button board is operably associated with the actuating elements of the control portion; and a switch board to power the endoscope on and off; and a power board including an integrated power chip to manage system power; a button board to enable/disable user controls, wherein the button board is operably associated with the actuating elements of the control portion; and a switch board to power the endoscope on and off; and an elongated body extending distally from the handle, the elongated body including: a camera including an image sensor disposed in a distal portion of the elongated body and a lens disposed at the distal end of the elongated body; a light source; and wherein the processor includes a peripheral controller for controlling the transmission of data between the processor and the camera and a peripheral controller for controlling the transmission of data between the processor and the light source; a camera including an image sensor disposed in a distal portion of the elongated body and a lens disposed at the distal end of the elongated body; a light source; and wherein the processor includes a peripheral controller for controlling the transmission of data between the processor and the camera and a peripheral controller for controlling the transmission of data between the processor and the light source; characterized in that the light source is disposed at a distal end of the elongated body, wherein the light source includes one or more light emitting elements integrated into the distal end of the elongated body and positioned radially outward of the lens; the endoscope further comprising a thermally conductive substrate affixed to the light source, and a heat sink comprising a distal side, wherein the distal side is in contact with the thermally conductive substrate, wherein a thermally conductive adhesive is disposed between the heat sink and the thermally conductive substrate.