A method for providing clustered position control information for controlling an impingement position of a laser beam on a side of a donor material opposite a side facing a chip die for application of electrically conductive elements in the chip die in a chip manufacturing process using the clustered position control information, in which chip manufacturing process said chip die is moved in time with respect to a predetermined two-dimensional spatial range corresponding to a field of view of said laser beam, and wherein the donor is moved in a transport direction, comprising the steps of a) receiving a specification of a set of feature positions (x,y) indicating where the electrically conductive elements are to be formed on the chip die, the feature positions having a first coordinate along a first direction (x) and a second coordinate (y) along a second direction in a plane defined by the chip die, said first and second direction being mutually transverse to each other, the set of feature positions (x,y) initially being the remaining feature positions, a1) calculating a temporal position for the remaining feature positions of said set of feature positions based on a current position of the chip die b) selecting from said remaining feature positions a cluster of feature positions that is within the predetermined two-dimensional spatial range, wherein each pair of feature positions in the cluster at least has a first minimum difference in their first coordinates or a second minimum difference in their second coordinates to achieve that feature positions in each pair of feature positions correspond to mutually different source positions of the donor when it is moved in the chip manufacturing process, and removing the feature positions selected for said cluster from the set of remaining feature positions, c) calculating the relative positions of the remaining feature positions with respect to the two-dimensional spatial range in accordance with an expected time needed to deposit electrically conductive material on the feature positions in the cluster of feature positions to form the electrically conductive elements specified for said feature positions in said cluster, and a speed with which a wafer comprising the chip die is to be moved during the chip manufacturing process, d) repeating steps b-d until each of the feature positions in said set of feature positions is assigned to a cluster. a) receiving a specification of a set of feature positions (x,y) indicating where the electrically conductive elements are to be formed on the chip die, the feature positions having a first coordinate along a first direction (x) and a second coordinate (y) along a second direction in a plane defined by the chip die, said first and second direction being mutually transverse to each other, the set of feature positions (x,y) initially being the remaining feature positions, a1) calculating a temporal position for the remaining feature positions of said set of feature positions based on a current position of the chip die b) selecting from said remaining feature positions a cluster of feature positions that is within the predetermined two-dimensional spatial range, wherein each pair of feature positions in the cluster at least has a first minimum difference in their first coordinates or a second minimum difference in their second coordinates to achieve that feature positions in each pair of feature positions correspond to mutually different source positions of the donor when it is moved in the chip manufacturing process, and removing the feature positions selected for said cluster from the set of remaining feature positions, c) calculating the relative positions of the remaining feature positions with respect to the two-dimensional spatial range in accordance with an expected time needed to deposit electrically conductive material on the feature positions in the cluster of feature positions to form the electrically conductive elements specified for said feature positions in said cluster, and a speed with which a wafer comprising the chip die is to be moved during the chip manufacturing process, d) repeating steps b-d until each of the feature positions in said set of feature positions is assigned to a cluster.