An electron multiplier comprising: an insulating substrate (11, 311) which includes an electrical wiring pattern (20, 21, 22) and in which a through-hole extending in a thickness direction is formed, wherein the electrical wiring pattern is provided to be stacked on a surface on one side of the insulating substrate in the thickness direction and on a surface on other side of the insulating substrate in the thickness direction; a micro-channel plate arranged on one side of the through-hole of the insulating substrate (11, 311) in the thickness direction and electrically connected to the electrical wiring pattern (20, 21) provided on the surface on the one side of the insulating substrate; a metal plate arranged on one side of the micro-channel plate in the thickness direction and electrically connected to the micro-channel plate; an anode arranged on the other side of the through-hole of the insulating substrate (11, 311) in the thickness direction, and a signal readout terminal for reading a signal from the anode through the electrical wiring pattern (20, 21, 22); wherein the anode is electrically connected to the electrical wiring pattern (20, 22) provided on the surface on the other side of the insulating substrate, the signal readout terminal is fixed to the insulating substrate (11, 311), wherein the metal plate is formed to include the micro-channel plate when viewed in the thickness direction, and a through-hole exposing at least a portion of the micro-channel plate is formed in the metal plate, the insulating substrate (11, 311), the micro-channel plate, the metal plate and the anode are fixed to each other to be integral, the electrical wiring pattern provided on the surface on the one side of the insulating substrate includes a micro-channel plate connection portion provided around the through-hole of the insulating substrate and electrically connected to the micro-channel plate, the electrical wiring pattern provided on the surface on the one side of the insulating substrate includes an anode connection portion provided in a circumferential edge of through-hole of the insulating substrate and electrically connected with the anode, the metal plate contacts with a surface on one side of the micro-channel plate and is electrically connected to said surface, and the micro-channel plate is interposed in the thickness direction between the insulating substrate (11, 311) and the metal plate and fixed to be integral with the insulating substrate (11, 311) and the metal plate. an insulating substrate (11, 311) which includes an electrical wiring pattern (20, 21, 22) and in which a through-hole extending in a thickness direction is formed, wherein the electrical wiring pattern is provided to be stacked on a surface on one side of the insulating substrate in the thickness direction and on a surface on other side of the insulating substrate in the thickness direction; a micro-channel plate arranged on one side of the through-hole of the insulating substrate (11, 311) in the thickness direction and electrically connected to the electrical wiring pattern (20, 21) provided on the surface on the one side of the insulating substrate; a metal plate arranged on one side of the micro-channel plate in the thickness direction and electrically connected to the micro-channel plate; an anode arranged on the other side of the through-hole of the insulating substrate (11, 311) in the thickness direction, and a signal readout terminal for reading a signal from the anode through the electrical wiring pattern (20, 21, 22); wherein the anode is electrically connected to the electrical wiring pattern (20, 22) provided on the surface on the other side of the insulating substrate, the signal readout terminal is fixed to the insulating substrate (11, 311), wherein the metal plate is formed to include the micro-channel plate when viewed in the thickness direction, and a through-hole exposing at least a portion of the micro-channel plate is formed in the metal plate, the insulating substrate (11, 311), the micro-channel plate, the metal plate and the anode are fixed to each other to be integral, the electrical wiring pattern provided on the surface on the one side of the insulating substrate includes a micro-channel plate connection portion provided around the through-hole of the insulating substrate and electrically connected to the micro-channel plate, the electrical wiring pattern provided on the surface on the one side of the insulating substrate includes an anode connection portion provided in a circumferential edge of through-hole of the insulating substrate and electrically connected with the anode, the metal plate contacts with a surface on one side of the micro-channel plate and is electrically connected to said surface, and the micro-channel plate is interposed in the thickness direction between the insulating substrate (11, 311) and the metal plate and fixed to be integral with the insulating substrate (11, 311) and the metal plate.