An apparatus, comprising: a first semiconductor die (102, 410); one or more semiconductor dies (208, 440) communicatively coupled to the first semiconductor die; M signal lines (120, 416) on the first semiconductor die; a logic circuit (110, 412) on the first semiconductor die, the logic circuit configured to communicate M data signals, via the M signal lines, with the one or more semiconductor dies; a plurality of contacts on the first semiconductor die including at least N contacts (140, 206), wherein the number of N contacts is less than the number of M signal lines and each contact is coupled to another one of the one or more semiconductor dies via a respective signal path; a plurality of serializer circuits (130, 414) on the first semiconductor die, each configured to serialize data from a respective subset of the plurality of the M signal lines to produce serialized data and provide the serialized data to a respective one of the contacts; wherein the one or more semiconductor dies and the first semiconductor die are disposed in an integrated circuit package (200, 400) having a set of data terminals for communication of data to and from an IC package; and wherein a second semiconductor die (208, 440) included in the one or more semiconductor dies includes: a plurality of communication circuits (442, 444, 446, 448), each configured to communicate data via a respective one of the set of data terminals; and a deserializer circuit coupled to receive the serialized data from the first semiconductor die via a respective one of the signal paths and configured to: deserialize the serialized data to produce a set of parallel data signals; and provide each data signal of the set of parallel data signals to a respective communication circuit of the plurality of communication circuits (442, 444, 446, 448), wherein the respective communication circuit is configured to transmit the data signal on a respective one of the data terminals, wherein at least one of the plurality of communication circuits (442, 444, 446, 448) of the second semiconductor die (208, 440) is coupled to receive serialized data from a respective one of the signal paths and is configured to transmit the serialized data via the respective one of the set of data terminals. a first semiconductor die (102, 410); one or more semiconductor dies (208, 440) communicatively coupled to the first semiconductor die; M signal lines (120, 416) on the first semiconductor die; a logic circuit (110, 412) on the first semiconductor die, the logic circuit configured to communicate M data signals, via the M signal lines, with the one or more semiconductor dies; a plurality of contacts on the first semiconductor die including at least N contacts (140, 206), wherein the number of N contacts is less than the number of M signal lines and each contact is coupled to another one of the one or more semiconductor dies via a respective signal path; a plurality of serializer circuits (130, 414) on the first semiconductor die, each configured to serialize data from a respective subset of the plurality of the M signal lines to produce serialized data and provide the serialized data to a respective one of the contacts; wherein the one or more semiconductor dies and the first semiconductor die are disposed in an integrated circuit package (200, 400) having a set of data terminals for communication of data to and from an IC package; and wherein a second semiconductor die (208, 440) included in the one or more semiconductor dies includes: a plurality of communication circuits (442, 444, 446, 448), each configured to communicate data via a respective one of the set of data terminals; and a deserializer circuit coupled to receive the serialized data from the first semiconductor die via a respective one of the signal paths and configured to: deserialize the serialized data to produce a set of parallel data signals; and provide each data signal of the set of parallel data signals to a respective communication circuit of the plurality of communication circuits (442, 444, 446, 448), wherein the respective communication circuit is configured to transmit the data signal on a respective one of the data terminals, a plurality of communication circuits (442, 444, 446, 448), each configured to communicate data via a respective one of the set of data terminals; and a deserializer circuit coupled to receive the serialized data from the first semiconductor die via a respective one of the signal paths and configured to: deserialize the serialized data to produce a set of parallel data signals; and provide each data signal of the set of parallel data signals to a respective communication circuit of the plurality of communication circuits (442, 444, 446, 448), wherein the respective communication circuit is configured to transmit the data signal on a respective one of the data terminals, deserialize the serialized data to produce a set of parallel data signals; and provide each data signal of the set of parallel data signals to a respective communication circuit of the plurality of communication circuits (442, 444, 446, 448), wherein the respective communication circuit is configured to transmit the data signal on a respective one of the data terminals, wherein at least one of the plurality of communication circuits (442, 444, 446, 448) of the second semiconductor die (208, 440) is coupled to receive serialized data from a respective one of the signal paths and is configured to transmit the serialized data via the respective one of the set of data terminals.