A light-emitting diode, LED, projector, comprising: an LED display panel including: an LED panel including: a substrate; a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array; and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits; a bonding metal layer formed between the driver circuit array and the LED array and including a plurality of bonding metal pads arranged in an array and isolated from each other, each of the pixel driver circuits corresponding to one of the electrical coupling pads; a dielectric isolation layer arranged between the driver circuit array and the LED array; a micro lens array arranged over the LED array and including a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies; and a projection lens arranged to collect and project light emitted by the LED display panel, characterised in that the dielectric isolation layer includes first protrusion structures and second protrusion structures surrounding each of the first protrusion structures, wherein each first protrusion structure is formed between one of the bonding metal pads and one of the pixel driver circuits, and has a through hole formed from an upper surface of the first protrusion structure to a lower surface of the first protrusion structure, at least a portion of the bonding metal pad being arranged in the through hole, and each of the first protrusion structures and the second protrusion structures surrounding the first protrusion structure define a continuous recess surrounding the first protrusion structure. an LED display panel including: an LED panel including: a substrate; a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array; and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits; a bonding metal layer formed between the driver circuit array and the LED array and including a plurality of bonding metal pads arranged in an array and isolated from each other, each of the pixel driver circuits corresponding to one of the electrical coupling pads; a dielectric isolation layer arranged between the driver circuit array and the LED array; a micro lens array arranged over the LED array and including a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies; and an LED panel including: a substrate; a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array; and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits; a bonding metal layer formed between the driver circuit array and the LED array and including a plurality of bonding metal pads arranged in an array and isolated from each other, each of the pixel driver circuits corresponding to one of the electrical coupling pads; a dielectric isolation layer arranged between the driver circuit array and the LED array; a substrate; a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array; and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits; a bonding metal layer formed between the driver circuit array and the LED array and including a plurality of bonding metal pads arranged in an array and isolated from each other, each of the pixel driver circuits corresponding to one of the electrical coupling pads; a dielectric isolation layer arranged between the driver circuit array and the LED array; a micro lens array arranged over the LED array and including a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies; and a projection lens arranged to collect and project light emitted by the LED display panel, characterised in that the dielectric isolation layer includes first protrusion structures and second protrusion structures surrounding each of the first protrusion structures, wherein each first protrusion structure is formed between one of the bonding metal pads and one of the pixel driver circuits, and has a through hole formed from an upper surface of the first protrusion structure to a lower surface of the first protrusion structure, at least a portion of the bonding metal pad being arranged in the through hole, and each of the first protrusion structures and the second protrusion structures surrounding the first protrusion structure define a continuous recess surrounding the first protrusion structure.