A semiconductor structure, comprising: an interposer (106, 200) that includes routing circuitry, the routing circuitry including a plurality of signal line segments (206, 208) in one or more routing layers (116, 202) of the semiconductor structure; a plurality of micro-bump contacts (118, 204) disposed on a surface of the interposer and coupled to the routing circuitry; wherein each signal line segment of the plurality of signal line segments connects a pair of the plurality of micro-bump contacts, respectively; and a plurality of test circuits (102, 103, 104, 220) stacked on the interposer, each test circuit coupled to a subset of the plurality of signal line segments via a respective subset of the micro-bump contacts, each test circuit configured to: switchably connect a first pair of micro-bump contacts in the respective subset of micro-bump contacts to at least a second pair of micro-bump contacts in the respective subset of micro-bump contacts to form a first set of daisy chains of the subset of signal line segments and dynamically connect a third pair of micro-bump contacts in the respective subset of micro-bump contacts to at least a fourth pair of micro-bump contacts in the respective subset of micro-bump contacts to form_a second set of daisy chains of the subset of signal line segments; test for short circuits between the first set of daisy chains and the second set of daisy chains; test the first and second sets of daisy chains for open circuits; in response to detecting an open circuit in a daisy chain, determine a portion of the daisy chain in which the open circuit is located; and in response to detecting a short circuit between the first set of daisy chains and the second set of daisy chains, determine a location at which the first set of daisy chains is short circuited to the second set of daisy chains. an interposer (106, 200) that includes routing circuitry, the routing circuitry including a plurality of signal line segments (206, 208) in one or more routing layers (116, 202) of the semiconductor structure; a plurality of micro-bump contacts (118, 204) disposed on a surface of the interposer and coupled to the routing circuitry; wherein each signal line segment of the plurality of signal line segments connects a pair of the plurality of micro-bump contacts, respectively; and a plurality of test circuits (102, 103, 104, 220) stacked on the interposer, each test circuit coupled to a subset of the plurality of signal line segments via a respective subset of the micro-bump contacts, each test circuit configured to: switchably connect a first pair of micro-bump contacts in the respective subset of micro-bump contacts to at least a second pair of micro-bump contacts in the respective subset of micro-bump contacts to form a first set of daisy chains of the subset of signal line segments and dynamically connect a third pair of micro-bump contacts in the respective subset of micro-bump contacts to at least a fourth pair of micro-bump contacts in the respective subset of micro-bump contacts to form_a second set of daisy chains of the subset of signal line segments; test for short circuits between the first set of daisy chains and the second set of daisy chains; test the first and second sets of daisy chains for open circuits; in response to detecting an open circuit in a daisy chain, determine a portion of the daisy chain in which the open circuit is located; and in response to detecting a short circuit between the first set of daisy chains and the second set of daisy chains, determine a location at which the first set of daisy chains is short circuited to the second set of daisy chains. switchably connect a first pair of micro-bump contacts in the respective subset of micro-bump contacts to at least a second pair of micro-bump contacts in the respective subset of micro-bump contacts to form a first set of daisy chains of the subset of signal line segments and dynamically connect a third pair of micro-bump contacts in the respective subset of micro-bump contacts to at least a fourth pair of micro-bump contacts in the respective subset of micro-bump contacts to form_a second set of daisy chains of the subset of signal line segments; test for short circuits between the first set of daisy chains and the second set of daisy chains; test the first and second sets of daisy chains for open circuits; in response to detecting an open circuit in a daisy chain, determine a portion of the daisy chain in which the open circuit is located; and in response to detecting a short circuit between the first set of daisy chains and the second set of daisy chains, determine a location at which the first set of daisy chains is short circuited to the second set of daisy chains.