A printed circuit board package structure comprising: a substrate comprising a first surface, a second surface opposite to the first surface, and at least two gas channels, wherein the first surface and the second surface respectively have a plurality of first metal portions and a plurality of second metal portions, a ring-shaped concave portion is formed on a position that is not covered by the first metal portions of the first surface; a ring-shaped magnetic element placed in the ring-shaped concave portion; an adhesive layer located on the first surface and covering the first metal portions and the ring-shaped magnetic element; a plurality of conductive portions formed on the adhesive layer, and respectively aligned with the second metal portions; and a plurality of conductive channels penetrating the conductive portions, the adhesive layer, and the substrate, wherein the conductive channels are respectively located in an inner wall and out of an outer wall of the ring-shaped concave portion, each of the conductive channels comprising a conductive film which electrically connects to the aligned conductive portion and second metal portion, and the at least two gas channels are formed on the outer wall or the inner wall of the ring-shaped concave portion, such that the two gas channels communicates with the ring-shaped concave portion; a plurality of first protection layers respectively formed in gaps of the conductive channels; and two second protection layers (162, 164), wherein one of the second protection layers is formed on the adhesive layer, the conductive channels, and the conductive portions, and another of the second protection layers is formed on the second metal portions, the conductive channels, and the second surface of the substrate and at least two pressure relief through holes are formed on the adhesive layer and the second protection layers on the adhesive layer, and the two pressure relief through holes are respectively aligned with and communicated with the two gas channels. a substrate comprising a first surface, a second surface opposite to the first surface, and at least two gas channels, wherein the first surface and the second surface respectively have a plurality of first metal portions and a plurality of second metal portions, a ring-shaped concave portion is formed on a position that is not covered by the first metal portions of the first surface; a ring-shaped magnetic element placed in the ring-shaped concave portion; an adhesive layer located on the first surface and covering the first metal portions and the ring-shaped magnetic element; a plurality of conductive portions formed on the adhesive layer, and respectively aligned with the second metal portions; and a plurality of conductive channels penetrating the conductive portions, the adhesive layer, and the substrate, wherein the conductive channels are respectively located in an inner wall and out of an outer wall of the ring-shaped concave portion, each of the conductive channels comprising a conductive film which electrically connects to the aligned conductive portion and second metal portion, and the at least two gas channels are formed on the outer wall or the inner wall of the ring-shaped concave portion, such that the two gas channels communicates with the ring-shaped concave portion; a plurality of first protection layers respectively formed in gaps of the conductive channels; and two second protection layers (162, 164), wherein one of the second protection layers is formed on the adhesive layer, the conductive channels, and the conductive portions, and another of the second protection layers is formed on the second metal portions, the conductive channels, and the second surface of the substrate and at least two pressure relief through holes are formed on the adhesive layer and the second protection layers on the adhesive layer, and the two pressure relief through holes are respectively aligned with and communicated with the two gas channels.