A die mounting system comprising: a die supply device that supplies dies formed from a single diced wafer affixed to a dicing sheet and that is set on a component mounter; a mounting head of the component mounter that picks up a die supplied from the die supply device and mounts the die on a circuit board, wherein the die supply device includes a supply head that picks up a die from the dicing sheet and is then vertically inverted, a camera that images the die on the dicing sheet, and a supply head moving mechanism that moves the supply head as one with the camera, wherein the die mounting system is further provided with a control system that controls operation such that an image captured by the camera is processed to recognize a position of a die on the dicing sheet, the supply head is moved above the die by the supply head moving mechanism, the die is picked up by the supply head, the supply head is vertically inverted, the supply head is moved to a die transfer position by the supply head moving mechanism, and the die held by the supply head is picked up by the mounting head of the component mounter at the component transfer position and mounted on the circuit board, characterized in that the control system is configured such that the die transfer position is set by said supply head moving mechanism at a position such that die transfer operation of picking up the die held by the supply head with the mounting head and die imaging operation of imaging a die on the dicing sheet with the camera are able to be performed in parallel. a die supply device that supplies dies formed from a single diced wafer affixed to a dicing sheet and that is set on a component mounter; a mounting head of the component mounter that picks up a die supplied from the die supply device and mounts the die on a circuit board, wherein the die supply device includes a supply head that picks up a die from the dicing sheet and is then vertically inverted, a camera that images the die on the dicing sheet, and a supply head moving mechanism that moves the supply head as one with the camera, a supply head that picks up a die from the dicing sheet and is then vertically inverted, a camera that images the die on the dicing sheet, and a supply head moving mechanism that moves the supply head as one with the camera, wherein the die mounting system is further provided with a control system that controls operation such that an image captured by the camera is processed to recognize a position of a die on the dicing sheet, the supply head is moved above the die by the supply head moving mechanism, the die is picked up by the supply head, the supply head is vertically inverted, the supply head is moved to a die transfer position by the supply head moving mechanism, and the die held by the supply head is picked up by the mounting head of the component mounter at the component transfer position and mounted on the circuit board, characterized in that the control system is configured such that the die transfer position is set by said supply head moving mechanism at a position such that die transfer operation of picking up the die held by the supply head with the mounting head and die imaging operation of imaging a die on the dicing sheet with the camera are able to be performed in parallel.