Resin particles having a structure formed by depositing resin particles comprising a first resin (a) having an initial softening temperature of 40 to 270 °C, a glass transition temperature of 20 to 250°C, a flow temperature of 60 to 300°C, and difference of the glass transition temperature and the flow temperature in a range of 0 to 120°C or a film comprising the resin (a) on the surfaces of resin particles comprising a second resin (b), wherein the surface coverage of the resin particles with the resin particles or the film is 0.1 to 4.9%, wherein the resin particles comprise the resin (b), a wax (c), and a modified wax (d) grafted with a vinyl polymer chain, whereby the surface coverage is calculated by image analysis of an image obtained by scanning electron microscope of the resin particles according to the following equation: Surface coverage % = surface area of portions covered with resin particles A or film P / surface area of portion covered with resin particles A or film P + surface area of exposed portions of resin particles B × 100, wherein the resin particles for image analysis are obtainable by removing the aqueous medium from the water-based resin dispersion by one of the following methods: • drying the water-based resin dispersion under reduced or normal pressure; • carrying out solid-liquid separation by a centrifuge, a sparkler filter, a filter press and drying the obtained powder; or • freezing the water-based resin dispersion and drying (so-called freeze drying); and wherein the initial softening temperature, the glass transition temperature and the flow temperature are determined by a flow tester measurement method, in which: • an overhead type flow tester CFT 500 model manufactured by Shimadzu Corporation is used, wherein the conditions of the flow tester measurement are: • load: 30 kg/cm 2; temperature increase speed: 3.0 °C/min; die aperture diameter: 0.50 mm; and die length: 10.0 mm; • the temperature at the point where a sample receives compressive load and starts deforming in a flow chart is defined as the glass transition temperature (Tg); • the temperature at the point where the inner voids disappear and a single transparent body or phase with uniform appearance is formed while keeping uneven stress distribution is defined as the initial softening temperature (Ts); and • the temperature at which a piston again clearly starts decreasing after the piston is slightly elevated due to the thermal expansion of the sample is defined as the flow starting temperature (Tfb) and the temperature at the point determined by calculating 1⁄2 of the difference between Smax at the flow finishing point and the minimum value Smin and adding X and Smin is defined as the flow temperature (T1/2). • drying the water-based resin dispersion under reduced or normal pressure; • carrying out solid-liquid separation by a centrifuge, a sparkler filter, a filter press and drying the obtained powder; or • freezing the water-based resin dispersion and drying (so-called freeze drying); • an overhead type flow tester CFT 500 model manufactured by Shimadzu Corporation is used, wherein the conditions of the flow tester measurement are: • load: 30 kg/cm 2; temperature increase speed: 3.0 °C/min; die aperture diameter: 0.50 mm; and die length: 10.0 mm; • the temperature at the point where a sample receives compressive load and starts deforming in a flow chart is defined as the glass transition temperature (Tg); • the temperature at the point where the inner voids disappear and a single transparent body or phase with uniform appearance is formed while keeping uneven stress distribution is defined as the initial softening temperature (Ts); and • the temperature at which a piston again clearly starts decreasing after the piston is slightly elevated due to the thermal expansion of the sample is defined as the flow starting temperature (Tfb) and the temperature at the point determined by calculating 1⁄2 of the difference between Smax at the flow finishing point and the minimum value Smin and adding X and Smin is defined as the flow temperature (T1/2).