An electronic apparatus, comprising: an electronic component housing package, comprising: an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section, the plurality of insulating layers each containing a first material as a major constituent; one or more infrared-ray absorbing layers disposed both between the plurality of insulating layers and on an upper surface of the uppermost one of the plurality of insulating layers, the one or more infrared-ray absorbing layers containing a second material which is higher in infrared absorptivity than the first material; wherein the first material is a first metal oxide and the second material is a second metal oxide or the first material is a first metal nitride and the second material is a second metal nitride or the first material is a first metal carbide and the second material is a second metal carbide; an electronic component mounted on the mounting section; and a lidbody joined to the upper surface of the insulating substrate so as to cover the electronic component. an electronic component housing package, comprising: an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section, the plurality of insulating layers each containing a first material as a major constituent; one or more infrared-ray absorbing layers disposed both between the plurality of insulating layers and on an upper surface of the uppermost one of the plurality of insulating layers, the one or more infrared-ray absorbing layers containing a second material which is higher in infrared absorptivity than the first material; wherein the first material is a first metal oxide and the second material is a second metal oxide or the first material is a first metal nitride and the second material is a second metal nitride or the first material is a first metal carbide and the second material is a second metal carbide; an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section, the plurality of insulating layers each containing a first material as a major constituent; one or more infrared-ray absorbing layers disposed both between the plurality of insulating layers and on an upper surface of the uppermost one of the plurality of insulating layers, the one or more infrared-ray absorbing layers containing a second material which is higher in infrared absorptivity than the first material; wherein the first material is a first metal oxide and the second material is a second metal oxide or the first material is a first metal nitride and the second material is a second metal nitride or the first material is a first metal carbide and the second material is a second metal carbide; an electronic component mounted on the mounting section; and a lidbody joined to the upper surface of the insulating substrate so as to cover the electronic component.