A light emitting device comprising: a first lead frame including a first bonding region; a second lead frame including a second bonding region; a gap part disposed between the first and second lead frames; a first body coupled to the first and second lead frames (121,131) and including an open region exposing the first and second bonding regions; a second body coupled onto the first body and including a first opening on the open region of the first body; a light emitting chip on the second bonding region of the second lead frame; and a transmissive resin layer surrounding the light emitting chip in the open region of the first body and the first opening of the second body, wherein the first body comprises a material having reflectance higher than reflectance of the second body, the first body comprises an inclined inner part around the open region, characterized in that: an entire top surface of the first body is located at a position lower than a position of a top surface of the light emitting chip, the first lead frame comprises a first hole which is disposed under the inner part of the first body, wherein the first hole has an area greater than an area of a bottom surface of the light emitting chip, wherein a top surface of the inner part of the first body is inclined with respect to top surfaces of the first and second lead frames (121,131), and wherein a top surface of the first body is configured to reflect light emitted from the light emitting chip in a side direction. a first lead frame including a first bonding region; a second lead frame including a second bonding region; a gap part disposed between the first and second lead frames; a first body coupled to the first and second lead frames (121,131) and including an open region exposing the first and second bonding regions; a second body coupled onto the first body and including a first opening on the open region of the first body; a light emitting chip on the second bonding region of the second lead frame; and a transmissive resin layer surrounding the light emitting chip in the open region of the first body and the first opening of the second body, wherein the first body comprises a material having reflectance higher than reflectance of the second body, the first body comprises an inclined inner part around the open region, characterized in that: an entire top surface of the first body is located at a position lower than a position of a top surface of the light emitting chip, the first lead frame comprises a first hole which is disposed under the inner part of the first body, wherein the first hole has an area greater than an area of a bottom surface of the light emitting chip, wherein a top surface of the inner part of the first body is inclined with respect to top surfaces of the first and second lead frames (121,131), and wherein a top surface of the first body is configured to reflect light emitted from the light emitting chip in a side direction. an entire top surface of the first body is located at a position lower than a position of a top surface of the light emitting chip, the first lead frame comprises a first hole which is disposed under the inner part of the first body, wherein the first hole has an area greater than an area of a bottom surface of the light emitting chip, wherein a top surface of the inner part of the first body is inclined with respect to top surfaces of the first and second lead frames (121,131), and wherein a top surface of the first body is configured to reflect light emitted from the light emitting chip in a side direction.