A method for forming optoelectronic modules connectable to optical fibers, wherein the method at least comprises: a) forming a compound substrate, - the compound substrate comprising a substrate having a plurality of optoelectronic devices constituting a two-dimensional first array in which the optoelectronic devices are lined up along two lateral directions (x, y), - the compound substrate further comprising a cover layer on a side of the substrate, the cover layer having a plurality of fiber endpiece mounting structures for mounting fiber endpieces, the fiber endpiece mounting structures constituting a two-dimensional second array in which the fiber endpiece mounting structures are lined up along the two lateral directions (x,y), - wherein forming the compound substrate comprises arranging the cover layer in an aligned position in relation to the substrate, thereby bringing all fiber endpiece mounting structures in alignment to all optoelectronic devices simultaneously, and b) singulating the compound substrate into pieces, thereby forming a plurality of optoelectronic modules each comprising at least one optoelectronic device covered by an aligned fiber endpiece mounting block shaped to receive at least one fiber endpiece of at least one respective optical fiber in a position self-aligned to the at least one optoelectronic device. a) forming a compound substrate, - the compound substrate comprising a substrate having a plurality of optoelectronic devices constituting a two-dimensional first array in which the optoelectronic devices are lined up along two lateral directions (x, y), - the compound substrate further comprising a cover layer on a side of the substrate, the cover layer having a plurality of fiber endpiece mounting structures for mounting fiber endpieces, the fiber endpiece mounting structures constituting a two-dimensional second array in which the fiber endpiece mounting structures are lined up along the two lateral directions (x,y), - wherein forming the compound substrate comprises arranging the cover layer in an aligned position in relation to the substrate, thereby bringing all fiber endpiece mounting structures in alignment to all optoelectronic devices simultaneously, and - the compound substrate comprising a substrate having a plurality of optoelectronic devices constituting a two-dimensional first array in which the optoelectronic devices are lined up along two lateral directions (x, y), - the compound substrate further comprising a cover layer on a side of the substrate, the cover layer having a plurality of fiber endpiece mounting structures for mounting fiber endpieces, the fiber endpiece mounting structures constituting a two-dimensional second array in which the fiber endpiece mounting structures are lined up along the two lateral directions (x,y), - wherein forming the compound substrate comprises arranging the cover layer in an aligned position in relation to the substrate, thereby bringing all fiber endpiece mounting structures in alignment to all optoelectronic devices simultaneously, and b) singulating the compound substrate into pieces, thereby forming a plurality of optoelectronic modules each comprising at least one optoelectronic device covered by an aligned fiber endpiece mounting block shaped to receive at least one fiber endpiece of at least one respective optical fiber in a position self-aligned to the at least one optoelectronic device.