A fingerprint identification apparatus, wherein the fingerprint identification apparatus is configured to be disposed under a display screen of an electronic device, comprising: a sensor chip, comprising a light detecting array and a chip protection ring, wherein the chip protection ring is disposed around the light detecting array; a light shielding layer, formed on the light detecting array, wherein the light shielding layer is provided with a plurality of light passing apertures corresponding to a plurality of pixel units of the light detecting array one-to-one and an whole region of the light detecting array and at least a partial region of the chip protection ring are covered by the light shielding layer; and a micro-lens array, disposed above the light shielding layer; wherein the micro-lens array is configured to converge a fingerprint light signal, returned after reflection or scattering via a finger above the display screen, to the plurality of light passing apertures of the light shielding layer, and the fingerprint light signal is transmitted to the light detecting array through the plurality of light passing apertures of the light shielding layer for fingerprint identification; and the micro-lens array comprises a plurality of micro-lenses corresponding to the plurality of light passing apertures one-to-one; wherein the fingerprint identification apparatus further includes: a filter layer, disposed between the light shielding layer and the sensor chip, is configured to filter out a light signal in a non-target waveband and transmit a light signal in a target waveband, and the filter layer covers the whole region of the light detecting array and at least covers the partial region of the chip protection ring; wherein the filter layer is a filter material film formed on the light detecting array, a thickness of the filter layer is between 1μm to 10μm, and the filter layer and the light detecting array are integrated in the sensor chip; wherein the fingerprint identification apparatus further comprises: a chip welding region, comprising a plurality of chip welding pads; wherein the chip protection ring is a polygon ring-shaped structure, and the chip welding region is located in the chip protection ring and closer to a first side of the chip protection ring; and the light shielding layer does not cover the chip welding region and the first side of the chip protection ring. a sensor chip, comprising a light detecting array and a chip protection ring, wherein the chip protection ring is disposed around the light detecting array; a light shielding layer, formed on the light detecting array, wherein the light shielding layer is provided with a plurality of light passing apertures corresponding to a plurality of pixel units of the light detecting array one-to-one and an whole region of the light detecting array and at least a partial region of the chip protection ring are covered by the light shielding layer; and a micro-lens array, disposed above the light shielding layer; wherein the micro-lens array is configured to converge a fingerprint light signal, returned after reflection or scattering via a finger above the display screen, to the plurality of light passing apertures of the light shielding layer, and the fingerprint light signal is transmitted to the light detecting array through the plurality of light passing apertures of the light shielding layer for fingerprint identification; and the micro-lens array comprises a plurality of micro-lenses corresponding to the plurality of light passing apertures one-to-one; wherein the fingerprint identification apparatus further includes: a filter layer, disposed between the light shielding layer and the sensor chip, is configured to filter out a light signal in a non-target waveband and transmit a light signal in a target waveband, and the filter layer covers the whole region of the light detecting array and at least covers the partial region of the chip protection ring; wherein the filter layer is a filter material film formed on the light detecting array, a thickness of the filter layer is between 1μm to 10μm, and the filter layer and the light detecting array are integrated in the sensor chip; wherein the fingerprint identification apparatus further comprises: a chip welding region, comprising a plurality of chip welding pads; wherein the chip protection ring is a polygon ring-shaped structure, and the chip welding region is located in the chip protection ring and closer to a first side of the chip protection ring; and the light shielding layer does not cover the chip welding region and the first side of the chip protection ring.