A laminated busbar assembly, comprising: a substrate, wherein the substrate is provided with a pad hole group, the pad hole group is electrically connected to copper pour in the substrate, the pad hole group and the copper pour constitute wirings, the pad hole group comprises a first pad hole, a second pad hole, and a third pad hole; a positive metal plate being a layer of the laminated busbar assembly, wherein the positive metal plate is provided with a first pin, the positive metal plate is arranged on a first side of the substrate, the first pin passes through the first pad hole, and a first connecting part is configured at a second side of the substrate by the first pin; the second side is opposite to the first side; a negative metal plate being a layer of the laminated busbar assembly, wherein the negative metal plate is provided with a second pin, the negative metal plate is arranged on the first side of the substrate, the second pin passes through the second pad hole, and a second connecting part is configured at the second side of the substrate by the second pin; and an output current metal plate, wherein the output current metal plate is provided with a third pin, the output current metal plate is arranged on the first side of the substrate, the third pin passes through the third pad hole, and a third connecting part is configured at the second side of the substrate by the third pin; wherein the substrate, the positive metal plate, the negative metal plate, and the output current metal plate are arranged in a laminated manner, the first connecting part is connected to the third connecting part through an intermediate substance, the second connecting part is connected to the third connecting part through the intermediate substance, and the first connecting part is connected to the second connecting part through the intermediate substance; the intermediate substance is a power transistor or a capacitor; an insulation layer group, the insulation layer group is arranged on one side of each of the substrate, the positive metal plate, the negative metal plate, and the output current metal plate; pins of a circuit element pass through the pad holes from the first side of the substrate. a substrate, wherein the substrate is provided with a pad hole group, the pad hole group is electrically connected to copper pour in the substrate, the pad hole group and the copper pour constitute wirings, the pad hole group comprises a first pad hole, a second pad hole, and a third pad hole; a positive metal plate being a layer of the laminated busbar assembly, wherein the positive metal plate is provided with a first pin, the positive metal plate is arranged on a first side of the substrate, the first pin passes through the first pad hole, and a first connecting part is configured at a second side of the substrate by the first pin; the second side is opposite to the first side; a negative metal plate being a layer of the laminated busbar assembly, wherein the negative metal plate is provided with a second pin, the negative metal plate is arranged on the first side of the substrate, the second pin passes through the second pad hole, and a second connecting part is configured at the second side of the substrate by the second pin; and an output current metal plate, wherein the output current metal plate is provided with a third pin, the output current metal plate is arranged on the first side of the substrate, the third pin passes through the third pad hole, and a third connecting part is configured at the second side of the substrate by the third pin; wherein the substrate, the positive metal plate, the negative metal plate, and the output current metal plate are arranged in a laminated manner, the first connecting part is connected to the third connecting part through an intermediate substance, the second connecting part is connected to the third connecting part through the intermediate substance, and the first connecting part is connected to the second connecting part through the intermediate substance; the intermediate substance is a power transistor or a capacitor; an insulation layer group, the insulation layer group is arranged on one side of each of the substrate, the positive metal plate, the negative metal plate, and the output current metal plate; pins of a circuit element pass through the pad holes from the first side of the substrate.