A wave solder nozzle assembly of a wave soldering station configured to perform a wave soldering operation on a printed circuit board, the wave solder nozzle assembly comprising: a nozzle core frame; a solder distribution baffle secured to the nozzle core frame; and characterized by: a sliding plate, which with the nozzle core frame and the solder distribution baffle together define a nozzle, the sliding plate being movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave in a direction of travel of the circuit board through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave in the direction of travel through the solder distribution baffle, an unload support frame secured to the nozzle core frame; an actuating support frame coupled to the unload support frame and configured to move relative to the unload support frame, the sliding plate being secured to the actuating support frame; and an actuator assembly configured to move the actuating support frame, the actuator assembly including an actuator support secured to the reservoir and an actuator secured to and supported by the actuator support. a nozzle core frame; a solder distribution baffle secured to the nozzle core frame; and characterized by: a sliding plate, which with the nozzle core frame and the solder distribution baffle together define a nozzle, the sliding plate being movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave in a direction of travel of the circuit board through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave in the direction of travel through the solder distribution baffle, an unload support frame secured to the nozzle core frame; an actuating support frame coupled to the unload support frame and configured to move relative to the unload support frame, the sliding plate being secured to the actuating support frame; and an actuator assembly configured to move the actuating support frame, the actuator assembly including an actuator support secured to the reservoir and an actuator secured to and supported by the actuator support. a sliding plate, which with the nozzle core frame and the solder distribution baffle together define a nozzle, the sliding plate being movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave in a direction of travel of the circuit board through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave in the direction of travel through the solder distribution baffle, an unload support frame secured to the nozzle core frame; an actuating support frame coupled to the unload support frame and configured to move relative to the unload support frame, the sliding plate being secured to the actuating support frame; and an actuator assembly configured to move the actuating support frame, the actuator assembly including an actuator support secured to the reservoir and an actuator secured to and supported by the actuator support.