A method for fabricating a leadless power amplifier, PA, package, the method comprising: providing electrically-conductive pillar supports (99,100) and a base flange spaced from the electrically-conductive pillar supports (99,100), the base flange having a die mount surface and a lower flange surface opposite the die mount surface in a package height direction; attaching at least a first radio frequency, RF, power die to a die mount surface of the base flange; electrically interconnecting the first RF power die and the electrically-conductive pillar supports (99,100); before or after electrically interconnecting the first RF power die and the electrically-conductive pillar supports (99,100), providing pillar contacts (118,119) electrically coupled to the electrically-conductive pillar supports (99,100) and projecting therefrom in the package height direction; enclosing the first RF power die in a package body defining, at least in substantial part, a package topside surface located opposite the lower flange surface; and forming topside input/output, I/O, terminals (123,124) accessible from the package topside surface and electrically interconnected with the first RF power die through the pillar contacts (118,119) and the electrically-conductive pillar supports (99,100) by exposing terminal end surfaces of the pillar contacts (118,119); providing the electrically-conductive pillar supports (99,100) and the base flange as a part of a leadframe, the leadframe further including a sacrificial leadframe portion joining the electrically-conductive pillar supports (99,100) and the base flange; and after enclosing the first RF power die in the package body, singulating the leadframe to remove the sacrificial leadframe portion and electrically isolate the base flange from the electrically-conductive pillar supports (99,100); and wherein the leadframe is provided as part of a leadframe array further including a plurality of additional interconnected leadframes; wherein the method further comprises plating the terminal end surfaces of the pillar contacts (118,119) utilizing an electroplating process during which an electrical potential is applied to the pillar contacts (118,119) through the leadframe array prior to singulation of the leadframe array. providing electrically-conductive pillar supports (99,100) and a base flange spaced from the electrically-conductive pillar supports (99,100), the base flange having a die mount surface and a lower flange surface opposite the die mount surface in a package height direction; attaching at least a first radio frequency, RF, power die to a die mount surface of the base flange; electrically interconnecting the first RF power die and the electrically-conductive pillar supports (99,100); before or after electrically interconnecting the first RF power die and the electrically-conductive pillar supports (99,100), providing pillar contacts (118,119) electrically coupled to the electrically-conductive pillar supports (99,100) and projecting therefrom in the package height direction; enclosing the first RF power die in a package body defining, at least in substantial part, a package topside surface located opposite the lower flange surface; and forming topside input/output, I/O, terminals (123,124) accessible from the package topside surface and electrically interconnected with the first RF power die through the pillar contacts (118,119) and the electrically-conductive pillar supports (99,100) by exposing terminal end surfaces of the pillar contacts (118,119); providing the electrically-conductive pillar supports (99,100) and the base flange as a part of a leadframe, the leadframe further including a sacrificial leadframe portion joining the electrically-conductive pillar supports (99,100) and the base flange; and after enclosing the first RF power die in the package body, singulating the leadframe to remove the sacrificial leadframe portion and electrically isolate the base flange from the electrically-conductive pillar supports (99,100); and wherein the leadframe is provided as part of a leadframe array further including a plurality of additional interconnected leadframes; wherein the method further comprises plating the terminal end surfaces of the pillar contacts (118,119) utilizing an electroplating process during which an electrical potential is applied to the pillar contacts (118,119) through the leadframe array prior to singulation of the leadframe array.