A smart IC module comprising: a smart IC substrate; and a chip disposed on the smart IC substrate, wherein the smart IC substrate comprising: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via. wherein the coil pattern is connected to the chip through the connection circuit pattern exposed by the third via formed in the first region and the first terminal, characterized in that the smart IC module further comprises a second coil pad portion connected to the second terminal, and in that the connection member is in contact with the connection circuit pattern and the second coil pad portion. a smart IC substrate; and a chip disposed on the smart IC substrate, wherein the smart IC substrate comprising: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via. wherein the coil pattern is connected to the chip through the connection circuit pattern exposed by the third via formed in the first region and the first terminal, characterized in that the smart IC module further comprises a second coil pad portion connected to the second terminal, and in that the connection member is in contact with the connection circuit pattern and the second coil pad portion. a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via. wherein the coil pattern is connected to the chip through the connection circuit pattern exposed by the third via formed in the first region and the first terminal, characterized in that the smart IC module further comprises a second coil pad portion connected to the second terminal, and in that the connection member is in contact with the connection circuit pattern and the second coil pad portion.