Method for positioning what is termed a surface-mounted integrated circuit comprising a plurality of output pins and for soldering said output pins to a plurality of metal pads produced on a substrate forming an insulating support, said plurality of metal pads including a first and a second metal pad that are electrically insulated from one another, having two mutually facing linear edges that are spaced apart by a first given distance, said integrated circuit comprising a first and a second output pin and a plurality of additional output pins, said first and second output pins having a given width, being spaced apart by a second given distance and being intended to be soldered to said first and second electrically insulated metallized pads, respectively, the method comprising at least the following steps: - depositing, on what is termed an upper face of said substrate, forming an insulating support, said plurality of metal pads comprising said first and second metallized pads, which are deposited in predetermined areas, such that said first distance is substantially equal to said second distance (L 7) and the width (L 6) of said first metallized pad is at least equal to said given width (L 5) of the first output pin; - depositing a strip of insulating material in the entirety of an area delineated by the mutually facing edges of said first and second metallized pads, said strip of insulating material providing electrical insulation between said first and second metallized pads (50, 51) and forming a first index marker; - depositing, for each pair of additional output pins, an additional strip (41 to 43) of insulating material in areas situated between the pins of each pair, said additional strips (41 to 43) of insulating material forming second index markers; and - positioning and aligning, using an optical method, the mutually facing edges of said first and second output pins (31, 32) on the mutually facing edges of said first and second metallized pads (50, 51) using said first index marker and said second index markers, and soldering the output pins to the corresponding metallized pads. - depositing, on what is termed an upper face of said substrate, forming an insulating support, said plurality of metal pads comprising said first and second metallized pads, which are deposited in predetermined areas, such that said first distance is substantially equal to said second distance (L 7) and the width (L 6) of said first metallized pad is at least equal to said given width (L 5) of the first output pin; - depositing a strip of insulating material in the entirety of an area delineated by the mutually facing edges of said first and second metallized pads, said strip of insulating material providing electrical insulation between said first and second metallized pads (50, 51) and forming a first index marker; - depositing, for each pair of additional output pins, an additional strip (41 to 43) of insulating material in areas situated between the pins of each pair, said additional strips (41 to 43) of insulating material forming second index markers; and - positioning and aligning, using an optical method, the mutually facing edges of said first and second output pins (31, 32) on the mutually facing edges of said first and second metallized pads (50, 51) using said first index marker and said second index markers, and soldering the output pins to the corresponding metallized pads.