A dual-band microstrip antenna, comprising: a substrate, having a front surface and a back surface opposite to the front surface; a first-band microstrip antenna, disposed on the front surface of the substrate and configured to generate first-band resonance; a second-band microstrip antenna, disposed on the back surface of the substrate and configured to generate second-band resonance and high-order resonance of the second-band resonance, the high-order resonance of the second-band resonance being configured to be superposed on the first-band resonance; and a coaxial feeder, disposed on the substrate and configured to feed the first-band microstrip antenna and the second-band microstrip antenna, wherein the first-band microstrip antenna comprises a first grounding plate and a first radio frequency module; and the first grounding plate is electrically connected to a grounding terminal of the coaxial feeder and the first radio frequency module is electrically connected to a feeding terminal of the coaxial feeder, wherein the first radio frequency module comprises: a first microstrip feeder electrically connected to the feeding terminal of the coaxial feeder, an impedance transformation feeding strip electrically connected to the first microstrip feeder and a first oscillator arm electrically connected to the impedance transformation feeding strip; wherein the second-band microstrip antenna comprises a second grounding plate and a second radio frequency module; and a conductive through hole extending through the first grounding plate and the second grounding plate is provided on the substrate, the second grounding plate is electrically connected to the first grounding plate through the conductive through hole; wherein the second radio frequency module comprises: a second microstrip feeder electrically connected to the second grounding plate, a second microstrip electrically connected to the second microstrip feeder and a second oscillator arm electrically connected to the second microstrip. a substrate, having a front surface and a back surface opposite to the front surface; a first-band microstrip antenna, disposed on the front surface of the substrate and configured to generate first-band resonance; a second-band microstrip antenna, disposed on the back surface of the substrate and configured to generate second-band resonance and high-order resonance of the second-band resonance, the high-order resonance of the second-band resonance being configured to be superposed on the first-band resonance; and a coaxial feeder, disposed on the substrate and configured to feed the first-band microstrip antenna and the second-band microstrip antenna, wherein the first-band microstrip antenna comprises a first grounding plate and a first radio frequency module; and the first grounding plate is electrically connected to a grounding terminal of the coaxial feeder and the first radio frequency module is electrically connected to a feeding terminal of the coaxial feeder, wherein the first radio frequency module comprises: a first microstrip feeder electrically connected to the feeding terminal of the coaxial feeder, an impedance transformation feeding strip electrically connected to the first microstrip feeder and a first oscillator arm electrically connected to the impedance transformation feeding strip; wherein the second-band microstrip antenna comprises a second grounding plate and a second radio frequency module; and a conductive through hole extending through the first grounding plate and the second grounding plate is provided on the substrate, the second grounding plate is electrically connected to the first grounding plate through the conductive through hole; a first microstrip feeder electrically connected to the feeding terminal of the coaxial feeder, an impedance transformation feeding strip electrically connected to the first microstrip feeder and a first oscillator arm electrically connected to the impedance transformation feeding strip; wherein the second-band microstrip antenna comprises a second grounding plate and a second radio frequency module; and a conductive through hole extending through the first grounding plate and the second grounding plate is provided on the substrate, the second grounding plate is electrically connected to the first grounding plate through the conductive through hole; wherein the second radio frequency module comprises: a second microstrip feeder electrically connected to the second grounding plate, a second microstrip electrically connected to the second microstrip feeder and a second oscillator arm electrically connected to the second microstrip.