A conductive leadframe for a lateral conduction die, wherein the lateral conduction die includes a plurality of parallel spaced and interleaved electrode openings on a surface of the die, the conductive leadframe comprising: a first plane of the conductive leadframe and a second plane of the conductive leadframe, the first plane and the second plane being different planes and being vertically separated from one another, a plurality of parallel spaced and interleaved conductive pads (108, 112) on the first plane of the conductive leadframe connectable to the electrode openings of the lateral conduction die, wherein the conductive pads (108, 112) have a longer dimension and a shorter dimension and the longer dimension of a respective conductive pad of the plurality of conductive pads (108, 112) defines a major axis of the respective conductive pad, and a plurality of parallel conductors (94, 96) on the second plane of the conductive leadframe, wherein the conductors (94, 96) have a longer dimension and a shorter dimension and the longer dimension of a respective conductor of the plurality of parallel conductors (94, 96) defines a major axis of the respective conductor, wherein the major axis of each respective pad of the plurality of pads (108, 110, 112) is on the first plane and the major axis of each respective conductor of the plurality of conductors (94, 96) is on the second plane, and wherein the major axis of the respective conductive pad is orthogonal to the major axis of the respective conductor at a location where the respective conductive pad electrically connects to the respective conductor, wherein the plurality of parallel spaced and interleaved conductive pads (108, 112) is arranged in an interdigited pattern wherein a major axis of a first respective conductive pad is parallel and adjacent to a major axis of a second respective conductive pad, and the pitch distance between the major axis of a first respective conductive pad and the major axis of a second respective conductive pad is 150 μm - 400 μm, wherein the conductive leadframe further comprises a conductive segment on the first plane of the conductive leadframe, wherein the conductive segment electrically connects a first respective conductive pad to at least a second respective conductive pad, wherein the conductive segment does not correspond to the electrode opening. a first plane of the conductive leadframe and a second plane of the conductive leadframe, the first plane and the second plane being different planes and being vertically separated from one another, a plurality of parallel spaced and interleaved conductive pads (108, 112) on the first plane of the conductive leadframe connectable to the electrode openings of the lateral conduction die, wherein the conductive pads (108, 112) have a longer dimension and a shorter dimension and the longer dimension of a respective conductive pad of the plurality of conductive pads (108, 112) defines a major axis of the respective conductive pad, and a plurality of parallel conductors (94, 96) on the second plane of the conductive leadframe, wherein the conductors (94, 96) have a longer dimension and a shorter dimension and the longer dimension of a respective conductor of the plurality of parallel conductors (94, 96) defines a major axis of the respective conductor, wherein the major axis of each respective pad of the plurality of pads (108, 110, 112) is on the first plane and the major axis of each respective conductor of the plurality of conductors (94, 96) is on the second plane, and wherein the major axis of the respective conductive pad is orthogonal to the major axis of the respective conductor at a location where the respective conductive pad electrically connects to the respective conductor, wherein the plurality of parallel spaced and interleaved conductive pads (108, 112) is arranged in an interdigited pattern wherein a major axis of a first respective conductive pad is parallel and adjacent to a major axis of a second respective conductive pad, and the pitch distance between the major axis of a first respective conductive pad and the major axis of a second respective conductive pad is 150 μm - 400 μm, wherein the conductive leadframe further comprises a conductive segment on the first plane of the conductive leadframe, wherein the conductive segment electrically connects a first respective conductive pad to at least a second respective conductive pad, wherein the conductive segment does not correspond to the electrode opening.