Multi-layered structure adapted to be applied to the surface of a back-contact back-sheet for a photovoltaic module comprising back-contact solar cells, said structure comprising: a layer of dielectric material comprising a lower surface facing the outside of said structure and an upper surface opposite said lower surface, said layer of dielectric material having a plurality of through-holes, a layer of encapsulating material coupled to said layer of dielectric material so as to be firmly fixed to said upper surface of said layer of dielectric material, said layer of encapsulating material having a plurality of through-holes, a layer of thermo-adhesive material coupled to said lower surface of said layer of dielectric material so as to allow said layer of dielectric material to steadily adhere to said surface of said back-contact back-sheet, said layer of thermo-adhesive material having a plurality of through-holes, said multi-layered structure being such that: each of said through-holes of said layer of encapsulating material 280) is made in a position corresponding to the position of one of said through-holes of said layer of dielectric material, and each of said through-holes of said layer of said thermal adhesive layer is made in a position corresponding to the position of one of said through-holes of said layer of dielectric material and to the position of one of said through-holes of said layer of encapsulating material, in such a way that said multi-layered structure has a plurality of through-holes. a layer of dielectric material comprising a lower surface facing the outside of said structure and an upper surface opposite said lower surface, said layer of dielectric material having a plurality of through-holes, a layer of encapsulating material coupled to said layer of dielectric material so as to be firmly fixed to said upper surface of said layer of dielectric material, said layer of encapsulating material having a plurality of through-holes, a layer of thermo-adhesive material coupled to said lower surface of said layer of dielectric material so as to allow said layer of dielectric material to steadily adhere to said surface of said back-contact back-sheet, said layer of thermo-adhesive material having a plurality of through-holes, said multi-layered structure being such that: each of said through-holes of said layer of encapsulating material 280) is made in a position corresponding to the position of one of said through-holes of said layer of dielectric material, and each of said through-holes of said layer of said thermal adhesive layer is made in a position corresponding to the position of one of said through-holes of said layer of dielectric material and to the position of one of said through-holes of said layer of encapsulating material, in such a way that said multi-layered structure has a plurality of through-holes. each of said through-holes of said layer of encapsulating material 280) is made in a position corresponding to the position of one of said through-holes of said layer of dielectric material, and each of said through-holes of said layer of said thermal adhesive layer is made in a position corresponding to the position of one of said through-holes of said layer of dielectric material and to the position of one of said through-holes of said layer of encapsulating material, in such a way that said multi-layered structure has a plurality of through-holes.