A method of assembling a circuit card assembly, the method comprising: forming at least one three dimensional trace by layer-by-layer additive manufacturing, wherein the at least one three dimensional trace comprises a first end and a second end; forming a support structure and a fixture, wherein: the support structure and fixture are configured to hold the at least one three dimensional trace in place for proper alignment with a first receiving feature of a first printed wiring board to be attached during assembly of the circuit card assembly; the support structure is connected to the at least one three dimensional trace and provides support for the at least one three dimensional trace during additive manufacturing of the at least one three dimensional trace; and the fixture is connected to the support structure and to the first end of the at least one three dimensional trace; attaching the at least one three dimensional trace to the first printed wiring board with the first receiving feature by inserting the second end of the at least one three dimensional trace into the first receiving feature; removing the support structure and fixture from the at least one three dimensional trace to expose the first end of the at least one three dimensional trace; and attaching a second printed wiring board to the at least one three dimensional trace by receiving the exposed first end of the at least one three dimensional trace in a second receiving feature of the second printed wiring board to create an electrical connection between the first printed wiring board and the second printed wiring board. forming at least one three dimensional trace by layer-by-layer additive manufacturing, wherein the at least one three dimensional trace comprises a first end and a second end; forming a support structure and a fixture, wherein: the support structure and fixture are configured to hold the at least one three dimensional trace in place for proper alignment with a first receiving feature of a first printed wiring board to be attached during assembly of the circuit card assembly; the support structure is connected to the at least one three dimensional trace and provides support for the at least one three dimensional trace during additive manufacturing of the at least one three dimensional trace; and the fixture is connected to the support structure and to the first end of the at least one three dimensional trace; the support structure and fixture are configured to hold the at least one three dimensional trace in place for proper alignment with a first receiving feature of a first printed wiring board to be attached during assembly of the circuit card assembly; the support structure is connected to the at least one three dimensional trace and provides support for the at least one three dimensional trace during additive manufacturing of the at least one three dimensional trace; and the fixture is connected to the support structure and to the first end of the at least one three dimensional trace; attaching the at least one three dimensional trace to the first printed wiring board with the first receiving feature by inserting the second end of the at least one three dimensional trace into the first receiving feature; removing the support structure and fixture from the at least one three dimensional trace to expose the first end of the at least one three dimensional trace; and attaching a second printed wiring board to the at least one three dimensional trace by receiving the exposed first end of the at least one three dimensional trace in a second receiving feature of the second printed wiring board to create an electrical connection between the first printed wiring board and the second printed wiring board.