A method of inspecting a semiconductor device, comprising the steps of: (a) electrically connecting a semiconductor chip with an external terminal; (b) after the step (a), sealing the semiconductor chip with resin such that a first surface of the external terminal is exposed from a lower surface of a sealing body formed by performing this step; (c) after the step (b), forming a conductor film on the first surfaces of the external terminal; (d) after the step (c), contacting a contact pin (PIN1, PIN2), which is comprised of a first contact pin including a first support portion and a first tip portion connected to the first support portion and a second contact pin including a second support portion and a second tip portion connected to the second support portion, with the external terminal via the conductor film, and performing a wiping operation for rubbing the first and second tip portions (PIN1, PIN2) against the first surface of the external terminal along a second direction (y) in a horizontal plane (xy plane) which is parallel to the lower surface of the sealing body, each of the first support portion and the second support portion being extended in the second direction (y) in plan view; and (e) after the step (d), inspecting electrical characteristics of the semiconductor device by supplying a current to the external terminal through both the first contact pin and the second contact pin, while respectively contacting the first and second contact pins (PIN1, PIN2) with first and second portions in the first surface of the external terminal, wherein the first support potion of the first contact pin and the second support portion of the second contact pin are arranged side by side along a first direction (x) in the horizontal plane (xy plane), that intersecting with the second direction (y), and wherein the amount of shifting in the second direction (y) of the first tip portion of the first contact pin and the second tip portion of the second contact pin is twice or more the wiping amount of the wiping operation. (a) electrically connecting a semiconductor chip with an external terminal; (b) after the step (a), sealing the semiconductor chip with resin such that a first surface of the external terminal is exposed from a lower surface of a sealing body formed by performing this step; (c) after the step (b), forming a conductor film on the first surfaces of the external terminal; (d) after the step (c), contacting a contact pin (PIN1, PIN2), which is comprised of a first contact pin including a first support portion and a first tip portion connected to the first support portion and a second contact pin including a second support portion and a second tip portion connected to the second support portion, with the external terminal via the conductor film, and performing a wiping operation for rubbing the first and second tip portions (PIN1, PIN2) against the first surface of the external terminal along a second direction (y) in a horizontal plane (xy plane) which is parallel to the lower surface of the sealing body, each of the first support portion and the second support portion being extended in the second direction (y) in plan view; and (e) after the step (d), inspecting electrical characteristics of the semiconductor device by supplying a current to the external terminal through both the first contact pin and the second contact pin, while respectively contacting the first and second contact pins (PIN1, PIN2) with first and second portions in the first surface of the external terminal,