A system for coupling Nitrogen Vacancy -defects in a quantum computing architecture, the system comprising: - a diamond wafer comprising a plurality of separated implantation sites, at least a portion of which comprise a single NV-defect; - an optical cavity system coupled to the diamond wafer, the optical cavity system comprising a plurality of cavities aligned to the separated implantation sites; - an integrated optics system coupled to the optical cavity system, the integrated optics system comprising: ∘ one or more optical waveguides (1208, 1210, 1212), and ∘ one or more switchable elements (1204, 1206, 1402a, 1402b, 1404a, 1404b, 1404c) associated with each optical waveguide, ∘ one or more photon sources, ∘ one or more photon detectors, and ∘ one or more fiber optic connections coupled to one or more of: one of the photon sources, one of the photon detectors, and one or more of the switchable elements; characterized in that the one or more of the optical waveguides, switchable elements, photon sources, photon detectors and fiber optic connections of the integrated optics system are comprised on a first chip module, that is physically separate from the diamond wafer; wherein a first one of the switchable elements (1204, 1206, 1402a, 1404a, 1404b) of the first chip module couples a first pair of single NV-defects by splitting a beam emitted by one of the photon sources, via a first one of the optical waveguides, to the cavity sites aligned to the implantation sites of the first pair of single NV-defects; and wherein a second one of the switchable elements (1204, 1206, 1402b, 1404b, 1404c) of the first chip module couples a second pair of single NV-defects by splitting a beam emitted by one of the photon sources, via a second one of the optical waveguides, to the cavity sites aligned to the implantation sites of the second pair of single NV-defects. - a diamond wafer comprising a plurality of separated implantation sites, at least a portion of which comprise a single NV-defect; - an optical cavity system coupled to the diamond wafer, the optical cavity system comprising a plurality of cavities aligned to the separated implantation sites; - an integrated optics system coupled to the optical cavity system, the integrated optics system comprising: ∘ one or more optical waveguides (1208, 1210, 1212), and ∘ one or more switchable elements (1204, 1206, 1402a, 1402b, 1404a, 1404b, 1404c) associated with each optical waveguide, ∘ one or more photon sources, ∘ one or more photon detectors, and ∘ one or more fiber optic connections coupled to one or more of: one of the photon sources, one of the photon detectors, and one or more of the switchable elements; ∘ one or more optical waveguides (1208, 1210, 1212), and ∘ one or more switchable elements (1204, 1206, 1402a, 1402b, 1404a, 1404b, 1404c) associated with each optical waveguide, ∘ one or more photon sources, ∘ one or more photon detectors, and ∘ one or more fiber optic connections coupled to one or more of: one of the photon sources, one of the photon detectors, and one or more of the switchable elements; the one or more of the optical waveguides, switchable elements, photon sources, photon detectors and fiber optic connections of the integrated optics system are comprised on a first chip module, that is physically separate from the diamond wafer; wherein a first one of the switchable elements (1204, 1206, 1402a, 1404a, 1404b) of the first chip module couples a first pair of single NV-defects by splitting a beam emitted by one of the photon sources, via a first one of the optical waveguides, to the cavity sites aligned to the implantation sites of the first pair of single NV-defects; and wherein a second one of the switchable elements (1204, 1206, 1402b, 1404b, 1404c) of the first chip module couples a second pair of single NV-defects by splitting a beam emitted by one of the photon sources, via a second one of the optical waveguides, to the cavity sites aligned to the implantation sites of the second pair of single NV-defects.