A mounting structure, comprising: a semiconductor device comprising an external connection terminal disposed at each of both ends in a longitudinal direction; and a mounting substrate for mounting the semiconductor device thereon, wherein the external connection terminal has a metal region on a mounting surface for mounting the semiconductor device on the mounting substrate, wherein the mounting substrate has on a mounting surface side thereof a land pattern made of an electrically conductive material on an insulating region to connect the external connection terminal, and wherein the land pattern is formed in a shape surrounding an end portion of the semiconductor device which is surrounded by the external connection terminal, and characterized in that the semiconductor device has a device-side mounting insulating region on a region defined by the metal region, and the land pattern includes a land-side insulating region which has a shape corresponding to a periphery of the device-side mounting insulating region; the metal region on the mounting surface is exposed at each of the both ends of the semiconductor device, the metal region includes a linear region formed of an edge of the external connection terminal, and is configured to surround the device-side mounting insulating region with the linear region; the linear region is formed in a U-shape having two parallel sides on the mounting surface, and the semiconductor device further comprises an insulating base body extended in one direction, the linear region surrounds three sides of a front side, an end side, and a back side of the edge of the base body and further to have a projecting piece (36A, 36B, 36C, or 36D) which is projected from the front side, the end side, or the back side of the base body into the mounting insulating region. a semiconductor device comprising an external connection terminal disposed at each of both ends in a longitudinal direction; and a mounting substrate for mounting the semiconductor device thereon, the external connection terminal has a metal region on a mounting surface for mounting the semiconductor device on the mounting substrate, wherein the mounting substrate has on a mounting surface side thereof a land pattern made of an electrically conductive material on an insulating region to connect the external connection terminal, and wherein the land pattern is formed in a shape surrounding an end portion of the semiconductor device which is surrounded by the external connection terminal, and the semiconductor device has a device-side mounting insulating region on a region defined by the metal region, and the land pattern includes a land-side insulating region which has a shape corresponding to a periphery of the device-side mounting insulating region; the metal region on the mounting surface is exposed at each of the both ends of the semiconductor device, the metal region includes a linear region formed of an edge of the external connection terminal, and is configured to surround the device-side mounting insulating region with the linear region; the linear region is formed in a U-shape having two parallel sides on the mounting surface, and the semiconductor device further comprises an insulating base body extended in one direction, the linear region surrounds three sides of a front side, an end side, and a back side of the edge of the base body and further to have a projecting piece (36A, 36B, 36C, or 36D) which is projected from the front side, the end side, or the back side of the base body into the mounting insulating region. the metal region on the mounting surface is exposed at each of the both ends of the semiconductor device, the metal region includes a linear region formed of an edge of the external connection terminal, and is configured to surround the device-side mounting insulating region with the linear region; the linear region is formed in a U-shape having two parallel sides on the mounting surface, and the semiconductor device further comprises an insulating base body extended in one direction, the linear region surrounds three sides of a front side, an end side, and a back side of the edge of the base body and further to have a projecting piece (36A, 36B, 36C, or 36D) which is projected from the front side, the end side, or the back side of the base body into the mounting insulating region.