A reflowable thermal fuse (10, 100, 200) comprising: a fuse body (12, 112, 212); a conductive composite element (14, 114, 214) disposed within the fuse body (21,112, 212); wherein the conductive composite element (14, 114, 214) is formed of a positive temperature coefficient material including conductive particles suspended in a polymer matrix and/or wherein the conductive composite element (14, 114, 214) is adapted to absorb a solvent element (20, 120, 220) to cause a resistance of the conductive composite element (14, 114, 214) to increase; first and second conductive terminals connected to the conductive composite element (14, 114, 214) and extending out of the fuse body (12, 112, 212); a removable barrier (18, 118, 218) covering a surface of the conductive composite element (14, 114, 214) and in electrical communication with the first and second conductive terminals, wherein the removable barrier (18, 118, 218) is adapted to fuse upon the occurrence of an overcurrent condition in the reflowable thermal fuse (10, 100,200) whereby the solvent element (20, 120, 220) is allowed to come into contact with the conductive composite element (14, 114, 214) and/or wherein the removable barrier (18, 118, 218) is a laminar element formed of a layer of copper disposed on a layer of polyimide, the solvent element (20, 120, 220) being disposed on the removable barrier (18, 118, 218) and separated from the conductive composite element (14, 114, 214) by the removable barrier (18, 118, 218), wherein the solvent element (20, 120, 220) is adapted to melt upon the occurrence of an overcurrent condition in the reflowable thermal fuse (10, 100, 200), wherein the solvent element (20, 120, 220) is formed of a precision melting organic compound (PMOC), wherein the PMOC includes at least one of bisphenol A, triphenylene, tetrabromobisphenol A, bisphenol S, Bisphenol P, 4,4'-Sulfonyldiphenol, 4-Hydroxybenzaldehyde, 4-Nitroaniline, 4-Aminobenzoic acid, 4-Nitrophenol, Resorcinol, Benzoin, and Aspartic acid. a fuse body (12, 112, 212); a conductive composite element (14, 114, 214) disposed within the fuse body (21,112, 212); wherein the conductive composite element (14, 114, 214) is formed of a positive temperature coefficient material including conductive particles suspended in a polymer matrix and/or wherein the conductive composite element (14, 114, 214) is adapted to absorb a solvent element (20, 120, 220) to cause a resistance of the conductive composite element (14, 114, 214) to increase; first and second conductive terminals connected to the conductive composite element (14, 114, 214) and extending out of the fuse body (12, 112, 212); a removable barrier (18, 118, 218) covering a surface of the conductive composite element (14, 114, 214) and in electrical communication with the first and second conductive terminals, wherein the removable barrier (18, 118, 218) is adapted to fuse upon the occurrence of an overcurrent condition in the reflowable thermal fuse (10, 100,200) whereby the solvent element (20, 120, 220) is allowed to come into contact with the conductive composite element (14, 114, 214) and/or wherein the removable barrier (18, 118, 218) is a laminar element formed of a layer of copper disposed on a layer of polyimide, the solvent element (20, 120, 220) being disposed on the removable barrier (18, 118, 218) and separated from the conductive composite element (14, 114, 214) by the removable barrier (18, 118, 218), wherein the solvent element (20, 120, 220) is adapted to melt upon the occurrence of an overcurrent condition in the reflowable thermal fuse (10, 100, 200), wherein the solvent element (20, 120, 220) is formed of a precision melting organic compound (PMOC), wherein the PMOC includes at least one of bisphenol A, triphenylene, tetrabromobisphenol A, bisphenol S, Bisphenol P, 4,4'-Sulfonyldiphenol, 4-Hydroxybenzaldehyde, 4-Nitroaniline, 4-Aminobenzoic acid, 4-Nitrophenol, Resorcinol, Benzoin, and Aspartic acid.