An imaging system comprising: a circuit board assembly comprising a generally planar circuit board, the generally planar circuit board comprising a layer of circuit board material formed to provide: a first part carrying a first image sensor (27A, 27B), and a second part spaced apart from the first part and carrying an optical device (24A, 24B), the imaging system further comprising: a rigid support member; a first attachment attaching the first part to the rigid support member; and a second attachment attaching the second part to the rigid support member, characterised in that the layer of circuit board material is further formed to provide a compliant part between the first and the second parts, wherein the compliant part is formed by at least one aperture in the circuit board material extending in a sinuous path and not extending to an edge of the circuit board material, wherein the first part, the second part, and the compliant part of the circuit board are coplanar in a plane of the circuit board, and wherein the compliant part allows the second part to move toward and away from the first part in the plane of the circuit board, wherein the compliant part comprises one or more compliant bridges having portions extending in a direction that is transverse to an axis extending between the first and second parts, such that, when a force is applied on the first part in response to thermal expansion or thermal contraction of the rigid support member, movement of the one or more compliant bridges reduces the force applied on the first part such that the first part is not forced to move relative to the first attachment, wherein each compliant bridge comprises a part wherein the circuit board is cut away to provide thin strips of the circuit board, wherein one or more of the thin strips has a ratio of length-to-width exceeding 4. a circuit board assembly comprising a generally planar circuit board, the generally planar circuit board comprising a layer of circuit board material formed to provide: a first part carrying a first image sensor (27A, 27B), and a second part spaced apart from the first part and carrying an optical device (24A, 24B), a first part carrying a first image sensor (27A, 27B), and a second part spaced apart from the first part and carrying an optical device (24A, 24B), the imaging system further comprising: a rigid support member; a first attachment attaching the first part to the rigid support member; and a second attachment attaching the second part to the rigid support member, a rigid support member; a first attachment attaching the first part to the rigid support member; and a second attachment attaching the second part to the rigid support member, characterised in that the layer of circuit board material is further formed to provide a compliant part between the first and the second parts, wherein the compliant part is formed by at least one aperture in the circuit board material extending in a sinuous path and not extending to an edge of the circuit board material, wherein the first part, the second part, and the compliant part of the circuit board are coplanar in a plane of the circuit board, and wherein the compliant part allows the second part to move toward and away from the first part in the plane of the circuit board, wherein the compliant part comprises one or more compliant bridges having portions extending in a direction that is transverse to an axis extending between the first and second parts, such that, when a force is applied on the first part in response to thermal expansion or thermal contraction of the rigid support member, movement of the one or more compliant bridges reduces the force applied on the first part such that the first part is not forced to move relative to the first attachment, wherein each compliant bridge comprises a part wherein the circuit board is cut away to provide thin strips of the circuit board, wherein one or more of the thin strips has a ratio of length-to-width exceeding 4.