A semiconductor processing system comprising: an immersion station adapted for immersion of a wafer in solvent for removal of material, wherein an opening is formed in the immersion station through which the wafer can be removed from inside the immersion station; and a lift-off station adapted to completely remove material from the surface of the wafer and including a separator adapted to spray solvent at a high pressure spray onto the wafer surface; characterized in that: - the immersion station is self-cleaning and includes a self-cleaning assembly adapted to spray cleaning fluid on internal surfaces of the immersion station; - the immersion station further includes a first sprayer having a plurality of nozzles (131, 133, 135, 137, 139) positioned to spray the wafer as it is transferred out of the immersion station, wherein the first sprayer comprises an elongated spray bar that is disposed proximate the opening formed in the immersion station, includes a plurality of nozzles (131, 133, 135, 137, 139) positioned longitudinally along the spray bar and is configured to spray downward onto the wafer for removing suspended particles and solvent from a surface of the wafer as the wafer is removed from the opening formed in the immersion station; - the lift-off station is self-cleaning and further includes at least one cleaning sprayer adapted to clean internal surfaces of the lift-off station; and - the separator is vacuum-assisted and is adapted to spray the solvent while applying suction in the vicinity of the sprayed wafer surface to capture material dislodged by the spray. an immersion station adapted for immersion of a wafer in solvent for removal of material, wherein an opening is formed in the immersion station through which the wafer can be removed from inside the immersion station; and a lift-off station adapted to completely remove material from the surface of the wafer and including a separator adapted to spray solvent at a high pressure spray onto the wafer surface; characterized in that: - the immersion station is self-cleaning and includes a self-cleaning assembly adapted to spray cleaning fluid on internal surfaces of the immersion station; - the immersion station further includes a first sprayer having a plurality of nozzles (131, 133, 135, 137, 139) positioned to spray the wafer as it is transferred out of the immersion station, wherein the first sprayer comprises an elongated spray bar that is disposed proximate the opening formed in the immersion station, includes a plurality of nozzles (131, 133, 135, 137, 139) positioned longitudinally along the spray bar and is configured to spray downward onto the wafer for removing suspended particles and solvent from a surface of the wafer as the wafer is removed from the opening formed in the immersion station; - the lift-off station is self-cleaning and further includes at least one cleaning sprayer adapted to clean internal surfaces of the lift-off station; and - the separator is vacuum-assisted and is adapted to spray the solvent while applying suction in the vicinity of the sprayed wafer surface to capture material dislodged by the spray. - the immersion station is self-cleaning and includes a self-cleaning assembly adapted to spray cleaning fluid on internal surfaces of the immersion station; - the immersion station further includes a first sprayer having a plurality of nozzles (131, 133, 135, 137, 139) positioned to spray the wafer as it is transferred out of the immersion station, wherein the first sprayer comprises an elongated spray bar that is disposed proximate the opening formed in the immersion station, includes a plurality of nozzles (131, 133, 135, 137, 139) positioned longitudinally along the spray bar and is configured to spray downward onto the wafer for removing suspended particles and solvent from a surface of the wafer as the wafer is removed from the opening formed in the immersion station; - the lift-off station is self-cleaning and further includes at least one cleaning sprayer adapted to clean internal surfaces of the lift-off station; and - the separator is vacuum-assisted and is adapted to spray the solvent while applying suction in the vicinity of the sprayed wafer surface to capture material dislodged by the spray.