A resistor (10, 30) comprising: a chip resistive element formed on one surface of a ceramic substrate, wherein the chip resistive element includes a resistive element, a first metal electrode, and a second metal electrode, and the resistor (10, 30) further comprises: a first metal terminal and a second metal terminal electrically and respectively connected to the first metal electrode and the second metal electrode; and an Al member formed on the other surface of the ceramic substrate, wherein the ceramic substrate and the Al member are joined together using an Al-Si-based brazing filler material, one surface of the resistive element contacts with the ceramic substrate, the first metal electrode and the second metal electrode are formed on the other surface of the resistive element, the first metal electrode and the first metal terminal are respectively joined to a first end and a second end of a first metal member, thereby being electrically connected to each other, the second metal electrode and the second metal terminal are respectively joined to a first end and a second end of a second metal member, thereby being electrically connected to each other, and the first metal member and the second metal member have a melting point of 450°C or higher. a chip resistive element formed on one surface of a ceramic substrate, wherein the chip resistive element includes a resistive element, a first metal electrode, and a second metal electrode, and the resistor (10, 30) further comprises: a first metal terminal and a second metal terminal electrically and respectively connected to the first metal electrode and the second metal electrode; and an Al member formed on the other surface of the ceramic substrate, wherein the ceramic substrate and the Al member are joined together using an Al-Si-based brazing filler material, one surface of the resistive element contacts with the ceramic substrate, the first metal electrode and the second metal electrode are formed on the other surface of the resistive element, the first metal electrode and the first metal terminal are respectively joined to a first end and a second end of a first metal member, thereby being electrically connected to each other, the second metal electrode and the second metal terminal are respectively joined to a first end and a second end of a second metal member, thereby being electrically connected to each other, and the first metal member and the second metal member have a melting point of 450°C or higher. a first metal terminal and a second metal terminal electrically and respectively connected to the first metal electrode and the second metal electrode; and an Al member formed on the other surface of the ceramic substrate, wherein the ceramic substrate and the Al member are joined together using an Al-Si-based brazing filler material, one surface of the resistive element contacts with the ceramic substrate, the first metal electrode and the second metal electrode are formed on the other surface of the resistive element, the first metal electrode and the first metal terminal are respectively joined to a first end and a second end of a first metal member, thereby being electrically connected to each other, the second metal electrode and the second metal terminal are respectively joined to a first end and a second end of a second metal member, thereby being electrically connected to each other, and the first metal member and the second metal member have a melting point of 450°C or higher.