A modular dispensing system for dispensing a heated liquid onto a substrate, comprising: a plurality of hot air manifolds each respectively coupled to a corresponding dispensing module and each including an air plenum, each of said air plenums having an air inlet capable of receiving process air and an air outlet; each of said hot air manifolds including a top surface, and a recess in said top surface, said recess having a floor surface, each of said air plenums being dimensioned to produce a pressure drop in the process air between said inlet and said outlet of less than about 10% of the initial pressure at said inlet; a plurality of modular manifold segments, each of said modular manifold segments having a supply passage and a distribution passage coupled with said supply passage, each of said modular manifold segments configured to supply the heated liquid from said supply passage to said distribution passage, said manifold segments being interconnected in side-by-side relationship so that said supply passages are in fluid communication, each of said modular manifold segments including a bottom surface coextensive with said top surface and confronting said floor surface, and said bottom surface of said modular manifold segment separated from said floor surface of said hot air manifold to define the depth of the recess to be ranging from about 0,127 mm (5 mils) to about 0,762 mm (30 mils) with a length of less than about 12,7 cm (5 in) and a with of less than about 2,54 cm (1 in); a plurality of nozzles for dispensing the heated liquid; a plurality of dispensing modules, each of said dispensing modules coupled in fluid communication with a respective one of said hot air manifolds, with said distribution passage of a respective one of said modular manifold segments for receiving the heated liquid, and with a respective one of said nozzles, each of said dispensing modules capable of dispensing the heated liquid received from a respective one of said modular manifold segments through a respective one of said nozzles onto the substrate,; and a plurality of heating elements each operative for heating the process air flowing through said air plenum of a respective one of said hot air manifolds from its air inlet to outlet. a plurality of hot air manifolds each respectively coupled to a corresponding dispensing module and each including an air plenum, each of said air plenums having an air inlet capable of receiving process air and an air outlet; each of said hot air manifolds including a top surface, and a recess in said top surface, said recess having a floor surface, each of said air plenums being dimensioned to produce a pressure drop in the process air between said inlet and said outlet of less than about 10% of the initial pressure at said inlet; a plurality of modular manifold segments, each of said modular manifold segments having a supply passage and a distribution passage coupled with said supply passage, each of said modular manifold segments configured to supply the heated liquid from said supply passage to said distribution passage, said manifold segments being interconnected in side-by-side relationship so that said supply passages are in fluid communication, each of said modular manifold segments including a bottom surface coextensive with said top surface and confronting said floor surface, and said bottom surface of said modular manifold segment separated from said floor surface of said hot air manifold to define the depth of the recess to be ranging from about 0,127 mm (5 mils) to about 0,762 mm (30 mils) with a length of less than about 12,7 cm (5 in) and a with of less than about 2,54 cm (1 in); a plurality of nozzles for dispensing the heated liquid; a plurality of dispensing modules, each of said dispensing modules coupled in fluid communication with a respective one of said hot air manifolds, with said distribution passage of a respective one of said modular manifold segments for receiving the heated liquid, and with a respective one of said nozzles, each of said dispensing modules capable of dispensing the heated liquid received from a respective one of said modular manifold segments through a respective one of said nozzles onto the substrate,; and a plurality of heating elements each operative for heating the process air flowing through said air plenum of a respective one of said hot air manifolds from its air inlet to outlet.