A thermally conductive composition comprising: a curable silicone composition comprising: a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30 to 400 milliPascal*seconds as determined by ASTM D445-21 at 25 degrees Celsius, a silicon-hydride functional crosslinker, and a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1; a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane; and a thermally conductive filler mixture comprising, based on the weight of the thermally conductive composition, from 40 weight-percent to 55 weight-percent of aluminum nitride fillers, comprising a blend of: (c1-a) from 15 weight-percent to 41 weight-percent of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of from 20 to 80 micrometers; spherical aluminum oxide particles having a D50 particle size of from 1 to 5 micrometers; and from 10 weight-percent to 20 weight-percent of irregular zinc oxide particles having a D50 particle size of from 0.1 to 0.5 micrometer; where the total amount of the thermally conductive filler mixture is from 94 weight-percent to 97 weight-percent, based on the weight of the thermally conductive composition; and where D50 particle size is determined using a laser diffraction particle size analyzer as outlined in the description. a curable silicone composition comprising: a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30 to 400 milliPascal*seconds as determined by ASTM D445-21 at 25 degrees Celsius, a silicon-hydride functional crosslinker, and a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1; a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30 to 400 milliPascal*seconds as determined by ASTM D445-21 at 25 degrees Celsius, a silicon-hydride functional crosslinker, and a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1; a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane; and a thermally conductive filler mixture comprising, based on the weight of the thermally conductive composition, from 40 weight-percent to 55 weight-percent of aluminum nitride fillers, comprising a blend of: (c1-a) from 15 weight-percent to 41 weight-percent of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of from 20 to 80 micrometers; spherical aluminum oxide particles having a D50 particle size of from 1 to 5 micrometers; and from 10 weight-percent to 20 weight-percent of irregular zinc oxide particles having a D50 particle size of from 0.1 to 0.5 micrometer; where the total amount of the thermally conductive filler mixture is from 94 weight-percent to 97 weight-percent, based on the weight of the thermally conductive composition; and where D50 particle size is determined using a laser diffraction particle size analyzer as outlined in the description. from 40 weight-percent to 55 weight-percent of aluminum nitride fillers, comprising a blend of: (c1-a) from 15 weight-percent to 41 weight-percent of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of from 20 to 80 micrometers; (c1-a) from 15 weight-percent to 41 weight-percent of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of from 20 to 80 micrometers; spherical aluminum oxide particles having a D50 particle size of from 1 to 5 micrometers; and from 10 weight-percent to 20 weight-percent of irregular zinc oxide particles having a D50 particle size of from 0.1 to 0.5 micrometer; where the total amount of the thermally conductive filler mixture is from 94 weight-percent to 97 weight-percent, based on the weight of the thermally conductive composition; and where D50 particle size is determined using a laser diffraction particle size analyzer as outlined in the description.