Electric power inverter for an electrical machine of an electrically powered drive system, - wherein the electric power inverter incorporates a capacitor board having a plurality of capacitors, and more than one semiconductor board each having a plurality of power semiconductors, and - wherein the capacitor board and the respective semiconductor board are mutually stacked in a stacking direction, with a clearance, in a stack formation, and are electrically interconnected, - wherein the plurality of capacitors on the capacitor board are arranged in the stacking direction, and are fitted to a side thereof facing the semiconductor boards, - wherein the plurality of capacitors are arranged on the capacitor board to form more than one open location space between the capacitors on the capacitor board, each location space positioned to accommodate one of the respective semiconductor boards, - wherein the respective semiconductor board is arranged within the respective location space, with a clearance to the capacitor board, - wherein at least some capacitors are arranged in the middle of the capacitor board and the semiconductor boards are all arranged on the edge of the capacitor board, so that current paths on the capacitor board extend generally radially from the middle to the edge of the capacitor board, characterized in that - the capacitor board and the respective semiconductor board are mutually electrically bonded by means of at least two connecting busbars, - the at least two connecting busbars are arranged in the location space between the capacitor board and the respective semiconductor board, and maintain a clearance between the capacitor board and the respective semiconductor board, - an electrically-insulating busbar guide plate is stacked in the stack formation of the electric power inverter in the stacking direction and arranged in the location space adjacently to the capacitor board and the respective semiconductor board, and - the busbar guide plate cooperates in the stacking direction with the capacitor board and the semiconductor board, and maintains a fixed mutual clearance between the latter. - wherein the electric power inverter incorporates a capacitor board having a plurality of capacitors, and more than one semiconductor board each having a plurality of power semiconductors, and - wherein the capacitor board and the respective semiconductor board are mutually stacked in a stacking direction, with a clearance, in a stack formation, and are electrically interconnected, - wherein the plurality of capacitors on the capacitor board are arranged in the stacking direction, and are fitted to a side thereof facing the semiconductor boards, - wherein the plurality of capacitors are arranged on the capacitor board to form more than one open location space between the capacitors on the capacitor board, each location space positioned to accommodate one of the respective semiconductor boards, - wherein the respective semiconductor board is arranged within the respective location space, with a clearance to the capacitor board, - wherein at least some capacitors are arranged in the middle of the capacitor board and the semiconductor boards are all arranged on the edge of the capacitor board, so that current paths on the capacitor board extend generally radially from the middle to the edge of the capacitor board, - the capacitor board and the respective semiconductor board are mutually electrically bonded by means of at least two connecting busbars, - the at least two connecting busbars are arranged in the location space between the capacitor board and the respective semiconductor board, and maintain a clearance between the capacitor board and the respective semiconductor board, - an electrically-insulating busbar guide plate is stacked in the stack formation of the electric power inverter in the stacking direction and arranged in the location space adjacently to the capacitor board and the respective semiconductor board, and - the busbar guide plate cooperates in the stacking direction with the capacitor board and the semiconductor board, and maintains a fixed mutual clearance between the latter.