A packaged power electronic device, the device (50; 150) comprising: a first support element having a first and a second face (56', 56"), the first face of the first support element forming a first thermal dissipation surface (50A, 150A) of the device; a second support element having a first and a second face (57', 57"), the first face of the second support element forming a second thermal dissipation surface (50B; 150B) of the device (50; 150), the first and the second support elements (56, 57) being superimposed on each other with the respective second faces (56", 57") facing each other, a first, a second, a third and a fourth power component, the first and third power components (51, 53) being arranged side by side on the second face (57") of the second support element and bonded to the second face (57") of the second support element, the second and the fourth power components (52, 54) being arranged side by side on the second face (56") of the first support element and bonded to the second face (56") of the first support element; a first contacting element superimposed on and in electric contact with the second and the fourth power components (52, 54); a second contacting element superimposed on * and in electric contact with the first power component; a third contacting element superimposed on and in electric contact with the third power component; a plurality of leads (59A-59H, 77A-77F) electrically coupled with the power components through the first and/or the second support elements (56, 57); a thermally conductive body (94; 93) arranged between the first contacting element and the second and the third contacting elements (80, 81), wherein the first, second and third contacting elements (60, 80, 81) and the thermally conductive body (94; 93) form a thermal distribution structure; the second and the third contacting elements (80, 81) being arranged side by side, wherein the first and the second support elements (56, 57) and the first, the second and third contacting elements (60, 80) are electrically insulating and thermally conductive and are formed by multilayers including a first conductive layer (56A, 57A, 60A, 80A, 81A), an insulating layer (56B, 57B, 60B, 80B, 81B) and a second conductive layer (56C, 57C, 60C, 80C, 81C), and wherein the thermally conductive body (94; 93) extends between the second conductive layer of the first contacting element and the second conductive layers (80C, 81C) of the second and third contacting elements (80, 81), whereby the second conductive layers (60C, 80C, 81C) of the first, second and third contacting elements (60, 80, 81) are electrically and thermally connected to each other, but electrically insulated from the rest of the structure due to the insulating layers (60B, 80B, 81B) of the first, second and third contacting elements (60, 80, 81). a first support element having a first and a second face (56', 56"), the first face of the first support element forming a first thermal dissipation surface (50A, 150A) of the device; a second support element having a first and a second face (57', 57"), the first face of the second support element forming a second thermal dissipation surface (50B; 150B) of the device (50; 150), the first and the second support elements (56, 57) being superimposed on each other with the respective second faces (56", 57") facing each other, a first, a second, a third and a fourth power component, the first and third power components (51, 53) being arranged side by side on the second face (57") of the second support element and bonded to the second face (57") of the second support element, the second and the fourth power components (52, 54) being arranged side by side on the second face (56") of the first support element and bonded to the second face (56") of the first support element; a first contacting element superimposed on and in electric contact with the second and the fourth power components (52, 54); a second contacting element superimposed on * and in electric contact with the first power component; a third contacting element superimposed on and in electric contact with the third power component; a plurality of leads (59A-59H, 77A-77F) electrically coupled with the power components through the first and/or the second support elements (56, 57); a thermally conductive body (94; 93) arranged between the first contacting element and the second and the third contacting elements (80, 81), wherein the first, second and third contacting elements (60, 80, 81) and the thermally conductive body (94; 93) form a thermal distribution structure; the second and the third contacting elements (80, 81) being arranged side by side, wherein the first and the second support elements (56, 57) and the first, the second and third contacting elements (60, 80) are electrically insulating and thermally conductive and are formed by multilayers including a first conductive layer (56A, 57A, 60A, 80A, 81A), an insulating layer (56B, 57B, 60B, 80B, 81B) and a second conductive layer (56C, 57C, 60C, 80C, 81C), and wherein the thermally conductive body (94; 93) extends between the second conductive layer of the first contacting element and the second conductive layers (80C, 81C) of the second and third contacting elements (80, 81), whereby the second conductive layers (60C, 80C, 81C) of the first, second and third contacting elements (60, 80, 81) are electrically and thermally connected to each other, but electrically insulated from the rest of the structure due to the insulating layers (60B, 80B, 81B) of the first, second and third contacting elements (60, 80, 81).