Electronic assembly for a transmission control module, comprising a base circuit board with a first side and a second side facing away from the first side and comprising a flexible circuit board, which has a contact side facing the second side of the base circuit board, wherein the contact side of the flexible circuit board is at least in sections spaced from the base circuit board by at least one intermediate space and wherein the base circuit board has at least one conductor track, and the flexible circuit board has at least one further conductor track and a contact-making point electrically connected to the at least one conductor track is formed on the second side of the base circuit board, and a further contact-making point electrically connected to the at least one further conductor track is formed on the contact side of the flexible circuit board, and the further contact-making point on the contact side of the flexible circuit board is connected to the contact-making point on the second side of the base circuit board in an electrically conductive manner by means of a connection means, which is electrically conductive and arranged in the intermediate space, wherein an adhesive compound, which is cured, can flow in the uncured state and can be cured, is arranged in the intermediate space between the second side of the base circuit board and the contact side of the flexible circuit board, said adhesive compound surrounding the periphery of the connection means in the intermediate space and is bonded to both the second side of the base circuit board and to the contact side of the flexible circuit board in a materially bonded manner, wherein the connection means is bonded to the contact-making point arranged on the second side of the base circuit board and/or to the further contact-making point arranged on the contact side of the flexible circuit board in a materially bonded manner, wherein the connection means is a solder, wherein the flexible circuit board comprises a flexible base film, at least one further conductor track arranged on the flexible base film and a protective layer or protective film at least partly covering the at least one further conductor track, and the adhesive compound is bonded at least in regions to the flexible base film in a materially bonded manner, wherein the flowable and curable adhesive compound is made at least partly from an epoxy casting resin, characterized in that the base film comprises an epoxy resin and glass fibres and in that the protective layer or protective film at least partly covering the at least one conductor track is produced at least partly from epoxy resin. wherein the contact side of the flexible circuit board is at least in sections spaced from the base circuit board by at least one intermediate space and wherein the base circuit board has at least one conductor track, and the flexible circuit board has at least one further conductor track and a contact-making point electrically connected to the at least one conductor track is formed on the second side of the base circuit board, and a further contact-making point electrically connected to the at least one further conductor track is formed on the contact side of the flexible circuit board, and the further contact-making point on the contact side of the flexible circuit board is connected to the contact-making point on the second side of the base circuit board in an electrically conductive manner by means of a connection means, which is electrically conductive and arranged in the intermediate space, wherein an adhesive compound, which is cured, can flow in the uncured state and can be cured, is arranged in the intermediate space between the second side of the base circuit board and the contact side of the flexible circuit board, said adhesive compound surrounding the periphery of the connection means in the intermediate space and is bonded to both the second side of the base circuit board and to the contact side of the flexible circuit board in a materially bonded manner, wherein the connection means is bonded to the contact-making point arranged on the second side of the base circuit board and/or to the further contact-making point arranged on the contact side of the flexible circuit board in a materially bonded manner, wherein the connection means is a solder, wherein the flexible circuit board comprises a flexible base film, at least one further conductor track arranged on the flexible base film and a protective layer or protective film at least partly covering the at least one further conductor track, and the adhesive compound is bonded at least in regions to the flexible base film in a materially bonded manner, wherein the flowable and curable adhesive compound is made at least partly from an epoxy casting resin, characterized in that the base film comprises an epoxy resin and glass fibres and in that the protective layer or protective film at least partly covering the at least one conductor track is produced at least partly from epoxy resin.