A method for manufacturing a mounting board, the method comprising: a first outer shape position acquisition step of imaging a component (D; D3 to D5) from a top-view direction to acquire an upper-surface outer shape position (Cd; Cd1 to Cd5) of the component; a feature portion position acquisition step of imaging the component from the top-view direction to acquire a position (Cs; Cs1; Cs3 to Cs5) of a light emitting portion (S; S3 to S5) formed on the component; a calculation step of calculating a deviation amount (ΔCs) of the position of the light emitting portion with respect to the upper-surface outer shape position from the upper-surface outer shape position and the position of the light emitting portion; a deviation amount determination step of determining whether or not the calculated deviation amount is within a predetermined range; if the deviation amount is determined not being within the predetermined range (ST7: NO), perform - a disposal step of disposing of the component; if the deviation amount is determined being within the predetermined range (ST7: YES), perform - a holding step of holding the component with a holding member; - a second outer shape position acquisition step of imaging, from a bottom-view direction, the component held by the holding member to acquire a lower-surface outer shape position (Ce) of the component; and - a mounting step of mounting the component held by the holding member to a board so that the light emitting portion of the component is positioned on a target position (Cg) of the board based on the lower-surface outer shape position and the deviation amount. a first outer shape position acquisition step of imaging a component (D; D3 to D5) from a top-view direction to acquire an upper-surface outer shape position (Cd; Cd1 to Cd5) of the component; a feature portion position acquisition step of imaging the component from the top-view direction to acquire a position (Cs; Cs1; Cs3 to Cs5) of a light emitting portion (S; S3 to S5) formed on the component; a calculation step of calculating a deviation amount (ΔCs) of the position of the light emitting portion with respect to the upper-surface outer shape position from the upper-surface outer shape position and the position of the light emitting portion; a deviation amount determination step of determining whether or not the calculated deviation amount is within a predetermined range; if the deviation amount is determined not being within the predetermined range (ST7: NO), perform - a disposal step of disposing of the component; - a disposal step of disposing of the component; if the deviation amount is determined being within the predetermined range (ST7: YES), perform - a holding step of holding the component with a holding member; - a second outer shape position acquisition step of imaging, from a bottom-view direction, the component held by the holding member to acquire a lower-surface outer shape position (Ce) of the component; and - a mounting step of mounting the component held by the holding member to a board so that the light emitting portion of the component is positioned on a target position (Cg) of the board based on the lower-surface outer shape position and the deviation amount. - a holding step of holding the component with a holding member; - a second outer shape position acquisition step of imaging, from a bottom-view direction, the component held by the holding member to acquire a lower-surface outer shape position (Ce) of the component; and - a mounting step of mounting the component held by the holding member to a board so that the light emitting portion of the component is positioned on a target position (Cg) of the board based on the lower-surface outer shape position and the deviation amount.