A method of making an integrated circuit device, the method comprising: positioning a reticle and a semiconductor substrate relative to one another, wherein (i) the reticle comprises an array region and a margin region; (ii) the array region comprises patterning that represents a device layer of a plurality of integrated circuit devices to be patterned on the semiconductor substrate and is arranged in a two-dimensional grid that comprises scribe lines separating adjacent device layers of adjacent integrated circuit devices of the plurality of integrated circuit devices; (iii) the array region further comprises a control module die that comprises patterning that represents a first optical control module, OCM, of the device layer; and (iv) the margin region is external the array region and comprises patterning that represents a second OCM of the device layer, patterning that represents a third OCM of the device layer, and patterning that represents a fourth OCM of the device layer; exposing, via the reticle, an initial reticle exposure field on a surface of the semiconductor substrate to pattern an initial array region and an initial margin region on the semiconductor substrate; and exposing, via the reticle, a subsequent reticle exposure field on the surface of the semiconductor substrate to pattern a subsequent array region and a subsequent margin region on the semiconductor substrate, wherein the subsequent reticle exposure field partially overlaps with the initial reticle exposure field such that an initial OCM that is patterned during the exposing the initial reticle exposure field and a subsequent OCM that is patterned during the exposing the subsequent reticle exposure field both are positioned within a single control module die on the semiconductor substrate. positioning a reticle and a semiconductor substrate relative to one another, wherein (i) the reticle comprises an array region and a margin region; (ii) the array region comprises patterning that represents a device layer of a plurality of integrated circuit devices to be patterned on the semiconductor substrate and is arranged in a two-dimensional grid that comprises scribe lines separating adjacent device layers of adjacent integrated circuit devices of the plurality of integrated circuit devices; (iii) the array region further comprises a control module die that comprises patterning that represents a first optical control module, OCM, of the device layer; and (iv) the margin region is external the array region and comprises patterning that represents a second OCM of the device layer, patterning that represents a third OCM of the device layer, and patterning that represents a fourth OCM of the device layer; (i) the reticle comprises an array region and a margin region; (ii) the array region comprises patterning that represents a device layer of a plurality of integrated circuit devices to be patterned on the semiconductor substrate and is arranged in a two-dimensional grid that comprises scribe lines separating adjacent device layers of adjacent integrated circuit devices of the plurality of integrated circuit devices; (iii) the array region further comprises a control module die that comprises patterning that represents a first optical control module, OCM, of the device layer; and (iv) the margin region is external the array region and comprises patterning that represents a second OCM of the device layer, patterning that represents a third OCM of the device layer, and patterning that represents a fourth OCM of the device layer; exposing, via the reticle, an initial reticle exposure field on a surface of the semiconductor substrate to pattern an initial array region and an initial margin region on the semiconductor substrate; and exposing, via the reticle, a subsequent reticle exposure field on the surface of the semiconductor substrate to pattern a subsequent array region and a subsequent margin region on the semiconductor substrate, wherein the subsequent reticle exposure field partially overlaps with the initial reticle exposure field such that an initial OCM that is patterned during the exposing the initial reticle exposure field and a subsequent OCM that is patterned during the exposing the subsequent reticle exposure field both are positioned within a single control module die on the semiconductor substrate.