An imaging device, comprising: a first insulating substrate comprising a through hole formed in a center portion thereof, connection electrodes arranged around the through hole on a lower surface of the first insulating substrate, and first wiring conductors comprising one end connected to the respective connection electrodes and the other end led out to an outer peripheral portion on the lower surface of the first insulating substrate; a second insulating substrate comprising a plurality of outside terminals arranged on a lower surface of the second insulating substrate, and second wiring conductors comprising one end connected to the respective outside terminals and the other end led out to an outer peripheral portion on an upper surface of the second insulating substrate; and an imaging element comprising a light-receiving portion arranged at a center portion on an upper surface thereof, and connection terminals arranged at an outer peripheral portion thereof, wherein the upper surface of the second insulating substrate comprises a recess portion, the through hole is located on an inner side of the recess portion in a top view from above the imaging device, the imaging element is arranged below the first insulating substrate such that the light-receiving portion on the upper surface of the imaging element is located within the through hole in a top view from above the imaging device, the connection terminals are electrically connected to the connection electrodes, an outer peripheral portion of the first insulating substrate is joined to an outer peripheral portion of the second insulating substrate so that the first wiring conductors and the second wiring conductors are electrically connected to each other and the imaging element is accommodated inside the recess portion, a joint portion where the outer peripheral portion of the first insulating substrate is joined to the outer peripheral portion of the second insulating substrate is arranged in the thickness direction of the imaging element, on the second insulating substrate side with respect to the light-receiving portion, characterized in that the joint portion is inclined from an outer periphery side of the first insulating substrate and an outer periphery side of the second insulating substrate toward a center of the second insulating substrate to the upper surface of the second insulating substrate in the recess portion. a first insulating substrate comprising a through hole formed in a center portion thereof, connection electrodes arranged around the through hole on a lower surface of the first insulating substrate, and first wiring conductors comprising one end connected to the respective connection electrodes and the other end led out to an outer peripheral portion on the lower surface of the first insulating substrate; a through hole formed in a center portion thereof, connection electrodes arranged around the through hole on a lower surface of the first insulating substrate, and first wiring conductors comprising one end connected to the respective connection electrodes and the other end led out to an outer peripheral portion on the lower surface of the first insulating substrate; a second insulating substrate comprising a plurality of outside terminals arranged on a lower surface of the second insulating substrate, and second wiring conductors comprising one end connected to the respective outside terminals and the other end led out to an outer peripheral portion on an upper surface of the second insulating substrate; and a plurality of outside terminals arranged on a lower surface of the second insulating substrate, and second wiring conductors comprising one end connected to the respective outside terminals and the other end led out to an outer peripheral portion on an upper surface of the second insulating substrate; and an imaging element comprising a light-receiving portion arranged at a center portion on an upper surface thereof, and connection terminals arranged at an outer peripheral portion thereof, wherein a light-receiving portion arranged at a center portion on an upper surface thereof, and connection terminals arranged at an outer peripheral portion thereof, wherein the upper surface of the second insulating substrate comprises a recess portion, the through hole is located on an inner side of the recess portion in a top view from above the imaging device, the imaging element is arranged below the first insulating substrate such that the light-receiving portion on the upper surface of the imaging element is located within the through hole in a top view from above the imaging device, the connection terminals are electrically connected to the connection electrodes, an outer peripheral portion of the first insulating substrate is joined to an outer peripheral portion of the second insulating substrate so that the first wiring conductors and the second wiring conductors are electrically connected to each other and the imaging element is accommodated inside the recess portion, a joint portion where the outer peripheral portion of the first insulating substrate is joined to the outer peripheral portion of the second insulating substrate is arranged in the thickness direction of the imaging element, on the second insulating substrate side with respect to the light-receiving portion, characterized in that the joint portion is inclined from an outer periphery side of the first insulating substrate and an outer periphery side of the second insulating substrate toward a center of the second insulating substrate to the upper surface of the second insulating substrate in the recess portion.