mhurhangee/ep-ind-claims huggingface dataset:
An integrated energy system, comprising: a nuclear reactor, the nuclear reactor on a nuclear site; a nuclear site boundary surrounding the nuclear reactor, the nuclear site boundary defined by one or more barriers inhibiting access to the nuclear site; a thermal energy storage system (208,702) located outside the nuclear site boundary, the thermal energy storage system in thermal communication with the nuclear reactor; and a power generator in thermal communication with the thermal energy storage system, the power generator situated outside the nuclear site boundary, wherein the power generator is configured to receive thermal energy from the thermal energy storage system and to convert the thermal energy to electricity; wherein the thermal energy storage system is coupled to an energy conversion system that requires a thermal power input greater than the thermal power output that the nuclear reactor is configured to produce. a nuclear reactor, the nuclear reactor on a nuclear site; a nuclear site boundary surrounding the nuclear reactor, the nuclear site boundary defined by one or more barriers inhibiting access to the nuclear site; a thermal energy storage system (208,702) located outside the nuclear site boundary, the thermal energy storage system in thermal communication with the nuclear reactor; and a power generator in thermal communication with the thermal energy storage system, the power generator situated outside the nuclear site boundary, wherein the power generator is configured to receive thermal energy from the thermal energy storage system and to convert the thermal energy to electricity; wherein the thermal energy storage system is coupled to an energy conversion system that requires a thermal power input greater than the thermal power output that the nuclear reactor is configured to produce.
A media tray assembly for use in an imaging device, the media tray assembly comprising: a media width adjuster having a bottom portion and a top portion, the top portion extendable between first and second stable positions; the media tray assembly characterised by a tension spring to drive the top portion to the stable positions; and a uniform motion mechanism to elevate and lower the top portion evenly between the stable positions, wherein the uniform motion mechanism comprises a four-bar linkage, the four-bar linkage comprising: a coupler link; and two arms (132, 134) that are each rotatably coupled at a first axis to the bottom portion, at a second axis to the top portion, and at a third axis to the coupler link. a media width adjuster having a bottom portion and a top portion, the top portion extendable between first and second stable positions; the media tray assembly characterised by a tension spring to drive the top portion to the stable positions; and a uniform motion mechanism to elevate and lower the top portion evenly between the stable positions, wherein the uniform motion mechanism comprises a four-bar linkage, the four-bar linkage comprising: a coupler link; and two arms (132, 134) that are each rotatably coupled at a first axis to the bottom portion, at a second axis to the top portion, and at a third axis to the coupler link. a coupler link; and two arms (132, 134) that are each rotatably coupled at a first axis to the bottom portion, at a second axis to the top portion, and at a third axis to the coupler link.
A terahertz system for producing and coherently detecting terahertz radiation, comprising: a laser light source (1; 1') and two THz antennas, which are each optically coupled to the laser light source (1; 1') via an optical fiber and can be activated by light of this laser light source (1; 1'), of which a first THz antenna serves as a transmitting antenna (2; 2') and a second THz antenna serves as a receiving antenna, each of the THz antennas comprising a semiconductor chip that is contacted by antenna conductors (9; 9') and comprises at least one active layer (12; 12') having a band edge wavelength that is greater than a wavelength of the laser light source (1; 1'), and at least two layers (13; 13'; 13") abutting the active layer (12; 12') and having a band edge wavelength that is smaller than the wavelength of the laser light source (1; 1'), the at least one active layer (12; 12') of at least of one of the THz antennas being arranged between two of the abutting layers (13; 13'; 13") and having a thickness that corresponds to no more than a penetration depth of the light of the laser light source (1; 1'), the penetration depth being defined by a drop in intensity to a share of 1/e of an incident radiation intensity, a semiconductor material forming this at least one active layer (12; 12') having a band edge wavelength of at least 1600 nm, characterized in that the band edge wavelength of at least this at least one active layer (12; 12') of at least one of the THz antennas is at least 250 nm greater than the wavelength of the laser light source (1; 1'). a laser light source (1; 1') and two THz antennas, which are each optically coupled to the laser light source (1; 1') via an optical fiber and can be activated by light of this laser light source (1; 1'), of which a first THz antenna serves as a transmitting antenna (2; 2') and a second THz antenna serves as a receiving antenna, each of the THz antennas comprising a semiconductor chip that is contacted by antenna conductors (9; 9') and comprises at least one active layer (12; 12') having a band edge wavelength that is greater than a wavelength of the laser light source (1; 1'), and at least two layers (13; 13'; 13") abutting the active layer (12; 12') and having a band edge wavelength that is smaller than the wavelength of the laser light source (1; 1'), the at least one active layer (12; 12') of at least of one of the THz antennas being arranged between two of the abutting layers (13; 13'; 13") and having a thickness that corresponds to no more than a penetration depth of the light of the laser light source (1; 1'), the penetration depth being defined by a drop in intensity to a share of 1/e of an incident radiation intensity, a semiconductor material forming this at least one active layer (12; 12') having a band edge wavelength of at least 1600 nm, characterized in that the band edge wavelength of at least this at least one active layer (12; 12') of at least one of the THz antennas is at least 250 nm greater than the wavelength of the laser light source (1; 1').
An electronic throttle, comprising: a throttle housing and, located inside the throttle housing: an electric machine; a torque transfer means meshed with a gear on an output shaft of the electric machine; a throttle shaft connected in a fixed manner to the torque transfer means, the throttle shaft passing through a throttle throat, and being supported by being inserted into a first mounting hole and a second mounting hole in the throttle housing, wherein the first mounting hole and the second mounting hole are located in the throttle housing on two sides of the throttle throat respectively, the second mounting hole being located on that side which is closer to the torque transfer means; a butterfly valve which is mounted on the throttle shaft and located inside the throttle throat; wherein the first mounting hole and second mounting hole have hole inner diameters of the same size, characterized in that a first locating pin mounting groove is formed on the throttle housing; a second locating pin mounting groove is formed on the throttle shaft; a space between the first locating pin mounting groove and the second locating pin mounting groove forms a locating pin mounting hole, wherein the electronic throttle also comprises a locating pin mounted inside the locating pin mounting hole. an electric machine; a torque transfer means meshed with a gear on an output shaft of the electric machine; a throttle shaft connected in a fixed manner to the torque transfer means, the throttle shaft passing through a throttle throat, and being supported by being inserted into a first mounting hole and a second mounting hole in the throttle housing, wherein the first mounting hole and the second mounting hole are located in the throttle housing on two sides of the throttle throat respectively, the second mounting hole being located on that side which is closer to the torque transfer means; a butterfly valve which is mounted on the throttle shaft and located inside the throttle throat; wherein the first mounting hole and second mounting hole have hole inner diameters of the same size, characterized in that a first locating pin mounting groove is formed on the throttle housing; a second locating pin mounting groove is formed on the throttle shaft; a space between the first locating pin mounting groove and the second locating pin mounting groove forms a locating pin mounting hole, wherein the electronic throttle also comprises a locating pin mounted inside the locating pin mounting hole.
A wearable device comprising: a device body comprising: a touch-sensitive display; and a processor; a band coupled to the device body; and a camera in or on the band, wherein the camera faces outward from the band and is configured to capture an image and the processor is configured to communicate with the camera to process the captured image; wherein the camera has an angle of view corresponding to a volume within which the image of an object is captured by the camera and which diverges from a volume within which the touch-sensitive display can be viewed by a user such that a user may view the touch-sensitive display without the touch-sensitive display blocking the user's view to the object; and wherein the processor is arranged to: recognize the object from the image of the object captured by the camera; determine information about the recognized object; and control the touch-sensitive display to display at least a part of the determined information on the object. a device body comprising: a touch-sensitive display; and a processor; a touch-sensitive display; and a processor; a band coupled to the device body; and a camera in or on the band, wherein the camera faces outward from the band and is configured to capture an image and the processor is configured to communicate with the camera to process the captured image; wherein the camera has an angle of view corresponding to a volume within which the image of an object is captured by the camera and which diverges from a volume within which the touch-sensitive display can be viewed by a user such that a user may view the touch-sensitive display without the touch-sensitive display blocking the user's view to the object; and wherein the processor is arranged to: recognize the object from the image of the object captured by the camera; determine information about the recognized object; and control the touch-sensitive display to display at least a part of the determined information on the object. recognize the object from the image of the object captured by the camera; determine information about the recognized object; and control the touch-sensitive display to display at least a part of the determined information on the object.
A method for predicting subject's responsiveness to a glucocorticosteroid medical regimen, prior to the start of said medical regimen, the method comprising the step of determining the amount of miR218-5p in a test sample of the subject, isolated prior to starting the medical regimen, wherein: (a) if no miR218-5p amount is present in the sample, it is indicative that the subject will be responder to the medical regimen, and (b) if miR218-5p is detected in the test sample it is indicative that the subject will not respond to the medical regimen, and wherein - the subject suffers from ulcerative colitis; - the isolated test sample is selected from: plasma, serum, and blood, particularly plasma; (a) if no miR218-5p amount is present in the sample, it is indicative that the subject will be responder to the medical regimen, and (b) if miR218-5p is detected in the test sample it is indicative that the subject will not respond to the medical regimen, and - the subject suffers from ulcerative colitis; - the isolated test sample is selected from: plasma, serum, and blood, particularly plasma;
Fluid product dispenser comprising: - a fluid product reservoir provided with a threaded neck forming at least one external helical thread and an annular upper edge, - a closure element mounted on the threaded neck of the reservoir and comprising a fastening member (F; F') comprising a threaded skirt forming at least one internal helical thread, the closure element also comprising a band which engages with a clamping action around the threaded skirt, the skirt comprising several tabs (F11, F11') each forming a segment of the internal helical thread, characterised in that: - the fastening member (F, F') comprises angular indexing means (F11', F33) for positioning it with respect to the external helical thread of the neck with a determined angular orientation, and - the internal helical thread segments of the threaded skirt comes into corresponding threaded engagement with the external helical thread of the neck in the final assembly position. - a fluid product reservoir provided with a threaded neck forming at least one external helical thread and an annular upper edge, - a closure element mounted on the threaded neck of the reservoir and comprising a fastening member (F; F') comprising a threaded skirt forming at least one internal helical thread, the closure element also comprising a band which engages with a clamping action around the threaded skirt, the skirt comprising several tabs (F11, F11') each forming a segment of the internal helical thread, - the fastening member (F, F') comprises angular indexing means (F11', F33) for positioning it with respect to the external helical thread of the neck with a determined angular orientation, and - the internal helical thread segments of the threaded skirt comes into corresponding threaded engagement with the external helical thread of the neck in the final assembly position.
A machine tool, having a workpiece holder for receiving a workpiece to be machined, and having a tool holder for holding a tool needed for the workpiece machining, wherein in the machine tool a hardness measuring device is integrated, with the help of which a hardness measurement is performable on the workpiece in an automated manner, characterized in that the hardness measuring device can be automatically placed onto the workpiece with the help of the tool holder and automatically pressed against the workpiece with a defined force, and in that in the tool holder or on the machine side in a clamping device for the tool holder a pressure measuring device or a force measuring device is integrated, with the help of which the force, with which the hardness measuring device can be pressed against the workpiece, is automatically measurable.
An apparatus, said apparatus is an application-specific integrated circuit-apparatus, comprising: a network of matrix processing units, MPUs, wherein each MPU is connected to at least one other MPU in the network, and each MPU is to perform matrix multiplication operations; a memory (830a-i) to store tensor data; and a master control central processing unit, MCC, to: receive an instruction from a host device, wherein the instruction comprises one or more tensor operands based on the tensor data; invoke a set of operations on one or more of the MPUs based on the instruction, wherein the set of operations comprises operations on the tensor operands; and output a result of the set of operations, wherein the result comprises a tensor value; characterized in that the each MPU comprises of a pre- and post-arithmetic operation (910a, 910b, 910c) and a matrix-wide operation, wherein the pre- and post-arithmetic operations are performed before on input tensor data prior to matrix multiplication and after on output data post-matrix multiplication and wherein the matrix-wide operation provides to process data among the elements of a single tensor data a network of matrix processing units, MPUs, wherein each MPU is connected to at least one other MPU in the network, and each MPU is to perform matrix multiplication operations; a memory (830a-i) to store tensor data; and a master control central processing unit, MCC, to: receive an instruction from a host device, wherein the instruction comprises one or more tensor operands based on the tensor data; invoke a set of operations on one or more of the MPUs based on the instruction, wherein the set of operations comprises operations on the tensor operands; and output a result of the set of operations, wherein the result comprises a tensor value; receive an instruction from a host device, wherein the instruction comprises one or more tensor operands based on the tensor data; invoke a set of operations on one or more of the MPUs based on the instruction, wherein the set of operations comprises operations on the tensor operands; and output a result of the set of operations, wherein the result comprises a tensor value; a pre- and post-arithmetic operation (910a, 910b, 910c) and a matrix-wide operation,
An imaging lens system, consisting of: three lens groups having a first lens, a second lens, a third lens, and a fourth lens arranged in order from an object side; and an aperture stop arranged between the first lens and the second lens, wherein the second lens and the third lens are joined to each other; the first lens is a negative meniscus lens having a convex surface at an object side; the second lens is a positive lens having a convex surface having a large curvature at an image side; the third lens is a negative lens having a concave surface having a large curvature at an object side; the fourth lens is a positive lens having a convex surface having a large curvature at an image side; the following conditions are satisfied: 1.4 < f 1 / F < 2.2 0.4 < f 1 / f 23 < 1.6 where F is a focal length of the entire imaging lens system, f1 is a focal length of the first lens, and f23 is a combined focal length of the second lens and the third lens which are joined each other; the following condition is satisfied: 1.80 < N 1 where N1 is a refractive index of material of the first lens for a d line, and the first lens is a spherical lens, wherein aberrations occurring in the first lens to the third lens are sufficiently corrected by an aspheric image side surface of the fourth lens. three lens groups having a first lens, a second lens, a third lens, and a fourth lens arranged in order from an object side; and an aperture stop arranged between the first lens and the second lens, wherein the second lens and the third lens are joined to each other; the first lens is a negative meniscus lens having a convex surface at an object side; the second lens is a positive lens having a convex surface having a large curvature at an image side; the third lens is a negative lens having a concave surface having a large curvature at an object side; the fourth lens is a positive lens having a convex surface having a large curvature at an image side; the following conditions are satisfied: 1.4 < f 1 / F < 2.2 0.4 < f 1 / f 23 < 1.6 where F is a focal length of the entire imaging lens system, f1 is a focal length of the first lens, and f23 is a combined focal length of the second lens and the third lens which are joined each other; the following condition is satisfied: 1.80 < N 1 where N1 is a refractive index of material of the first lens for a d line, and the first lens is a spherical lens, wherein aberrations occurring in the first lens to the third lens are sufficiently corrected by an aspheric image side surface of the fourth lens.
Use of a forming mold for yielding a molded product made from a slurry containing a ceramic powder material, a dispersion medium, a gelling agent and a dispersing agent, the use including the step of casting the slurry in the forming mold, the forming mold comprising: a base member formed of metal, a resin layer which is bonded to the base member and which serves as a forming surface, wherein the base member has a rigidity higher than that of the resin layer characterized by a bonding layer which intervenes between the base member and the resin layer and which bonds the base member to the resin, layer wherein: the resin layer is formed of a resin material having a glass transition point of 130°C or higher; and the bonding layer is formed of a material having a glass transition point of 80°C or higher, and wherein the bonding layer is formed of a material containing no metallic element. a base member formed of metal, a resin layer which is bonded to the base member and which serves as a forming surface, wherein the base member has a rigidity higher than that of the resin layer characterized by a bonding layer which intervenes between the base member and the resin layer and which bonds the base member to the resin, layer wherein: the resin layer is formed of a resin material having a glass transition point of 130°C or higher; and the bonding layer is formed of a material having a glass transition point of 80°C or higher, and wherein the bonding layer is formed of a material containing no metallic element.
A cross-linkable rubber composition, the cross-linkable rubber composition comprising, per hundred parts by weight of rubber (phr): ≥ 1 phr to ≤ 99 phr of a styrene-butadiene rubber component; ≥ 1 phr to ≤ 99 phr of a polybutadiene rubber component; ≥ 5 phr to ≤ 35 phr of a polyterpene resin component; characterised in that the polybutadiene rubber has a branching index G (defined as the tan δ value in a dynamic mechanical test at a frequency of 0.05 Hz) of ≥ 0.7 to ≤ 0.85 and a polydispersity index Mw/Mn of ≥ 3.5 and ≤ 4.5 and the polyterpene resin has a molecular weight Mw of ≥ 900 to ≤ 1200 g/mol. ≥ 1 phr to ≤ 99 phr of a styrene-butadiene rubber component; ≥ 1 phr to ≤ 99 phr of a polybutadiene rubber component; ≥ 5 phr to ≤ 35 phr of a polyterpene resin component;
A semiconductor diode module comprising a light emitting structure that comprises at least a plurality of semiconductor layers including at least a p-type layer and an n-type layer, the light emitting structure having a first surface that is a first surface of the semiconductor diode module, the semiconductor diode module having a second surface opposite the first surface of the semiconductor diode module a metal pattern disposed on the second surface of the semiconductor diode module, the metal pattern comprising: a cathode electrode electrically connected to the n-type layer; an anode electrode electrically connected to the p-type layer; and an thermal pad configuration (54,56), characterized in that the thermal pad configuration comprises two thermal pads (54, 56), electrically isolated from the cathode electrode and anode electrode, the two thermal pads being located along opposite sides of the second surface of the semiconductor diode module and having identical shapes. a cathode electrode electrically connected to the n-type layer; an anode electrode electrically connected to the p-type layer; and an thermal pad configuration (54,56), characterized in that the thermal pad configuration comprises two thermal pads (54, 56), electrically isolated from the cathode electrode and anode electrode, the two thermal pads being located along opposite sides of the second surface of the semiconductor diode module and having identical shapes.