Process for the production of an electronic card formed by: - an external connector (2; 50; 50a) comprising an insulating support (4; 4a) that defines an outside face and an inside face opposite one another and a plurality of external metal contact pads, which are arranged on the outside face of this insulating support; - a card body (22; 22a) having a cavity (26; 26a) for said external connector; - an electronic unit and/or an antenna incorporated in the card body and electrically connected to or having a plurality of internal metal pads (34a, 34b, 34c) arranged under said cavity; wherein this process comprises a step of machining individual cavities (38a, 38b, 38c) in said card body until the internal metal pads are reached or until metal parts (36a, 36b, 36c) arranged on these internal metal pads and in electrical contact therewith are reached, and these metal parts or the internal metal pads can be partially machined; wherein this production process is characterised in that said individual cavities have a cross-section in which at least one dimension is greater than 0.5 mm (500μm) and by the following steps: - forming said external connector with a plurality of metal projections (18a, 18b, 18c) located on the side of said inside face of said insulating support and respectively connected electrically to at least one subassembly of said plurality of external metal contact pads and/or to contact pads linked to a second electronic unit, which is arranged on the inside face of the insulating support and intended to be located in said cavity, wherein these metal projections are arranged in order to respectively face said individual cavities during the placement of the external connector in said cavity and configured to be capable of being inserted into these individual cavities in order to fill them at least for the most part; - subsequent to said forming of said external connector and said machining of individual cavities in the card body, placing this external connector in the cavity of the card body, with said metal projections inserted into the respective individual cavities, and the initial volume of each projection is provided such that, once the connector is in place in its cavity, the volume of this projection is substantially equal to or smaller than the volume of the corresponding individual cavity; - supplying energy at least partially to the metal projections to perform soldering at least on the side of said internal metal pads and form soldered contacts between these and the external connector, wherein electrical junctions are thus obtained between said internal metal pads and said at least one subassembly of the plurality of external metal contact pads and/or said contact pads linked to said second electronic unit. - an external connector (2; 50; 50a) comprising an insulating support (4; 4a) that defines an outside face and an inside face opposite one another and a plurality of external metal contact pads, which are arranged on the outside face of this insulating support; - a card body (22; 22a) having a cavity (26; 26a) for said external connector; - an electronic unit and/or an antenna incorporated in the card body and electrically connected to or having a plurality of internal metal pads (34a, 34b, 34c) arranged under said cavity; - forming said external connector with a plurality of metal projections (18a, 18b, 18c) located on the side of said inside face of said insulating support and respectively connected electrically to at least one subassembly of said plurality of external metal contact pads and/or to contact pads linked to a second electronic unit, which is arranged on the inside face of the insulating support and intended to be located in said cavity, wherein these metal projections are arranged in order to respectively face said individual cavities during the placement of the external connector in said cavity and configured to be capable of being inserted into these individual cavities in order to fill them at least for the most part; - subsequent to said forming of said external connector and said machining of individual cavities in the card body, placing this external connector in the cavity of the card body, with said metal projections inserted into the respective individual cavities, and the initial volume of each projection is provided such that, once the connector is in place in its cavity, the volume of this projection is substantially equal to or smaller than the volume of the corresponding individual cavity; - supplying energy at least partially to the metal projections to perform soldering at least on the side of said internal metal pads and form soldered contacts between these and the external connector, wherein electrical junctions are thus obtained between said internal metal pads and said at least one subassembly of the plurality of external metal contact pads and/or said contact pads linked to said second electronic unit.