An integrated circuit comprising: a first bond pad (120, 122, 124, 126); a dummy bond pad; a multiplexer circuit; and an oscillator circuit, wherein the first bond pad and the dummy bond pad are selectively couplable to the oscillator circuit by the multiplexer circuit, and wherein the oscillator circuit is configured to generate an oscillator signal having: a first frequency when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the first bond pad is coupled to a bond region (130, 132, 134) of a package; a fault reference signal frequency when the dummy bond pad is coupled to the oscillator circuit by the multiplexer circuit; and a second frequency when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the first bond pad is not coupled to the bond region of the package, and wherein the integrated circuit is configured to generate a fault indication when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the generated oscillator signal frequency is approximately the same as the fault reference signal frequency. a first bond pad (120, 122, 124, 126); a dummy bond pad; a multiplexer circuit; and an oscillator circuit, wherein the first bond pad and the dummy bond pad are selectively couplable to the oscillator circuit by the multiplexer circuit, and wherein the oscillator circuit is configured to generate an oscillator signal having: a first frequency when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the first bond pad is coupled to a bond region (130, 132, 134) of a package; a fault reference signal frequency when the dummy bond pad is coupled to the oscillator circuit by the multiplexer circuit; and a second frequency when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the first bond pad is not coupled to the bond region of the package, and wherein the integrated circuit is configured to generate a fault indication when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the generated oscillator signal frequency is approximately the same as the fault reference signal frequency. wherein the oscillator circuit is configured to generate an oscillator signal having: a first frequency when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the first bond pad is coupled to a bond region (130, 132, 134) of a package; a fault reference signal frequency when the dummy bond pad is coupled to the oscillator circuit by the multiplexer circuit; and a second frequency when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the first bond pad is not coupled to the bond region of the package, and a first frequency when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the first bond pad is coupled to a bond region (130, 132, 134) of a package; a fault reference signal frequency when the dummy bond pad is coupled to the oscillator circuit by the multiplexer circuit; and a second frequency when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the first bond pad is not coupled to the bond region of the package, and wherein the integrated circuit is configured to generate a fault indication when the first bond pad is coupled to the oscillator circuit by the multiplexer circuit and the generated oscillator signal frequency is approximately the same as the fault reference signal frequency.