A method for manufacturing an electronic assembly, comprising the steps of: providing a mold having a first mold portion and a second mold portion (44, 42), wherein the first and second mold portions (44, 42) each include a cavity, and wherein the cavity of the first and second mold portions provides a mold cavity when joined; providing a backplate, the backplate having a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate; providing a substrate with a first side of an integrated circuit die (106A, B) mounted to a first side of the substrate, wherein the IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate, and wherein the substrate has a second side opposite the first side of the substrate; placing the backplate and the substrate within the cavity of the second mold portion, wherein a second side of the backplate is in contact with an inner surface of the second mold portion, and wherein a second side of the IC die is in thermal contact with the heatsink, where the first side of the IC die is opposite the second side of the IC die; joining the first and second mold portions; and filling the mold cavity with an overmold material to provide an overmolded electronic assembly that includes the substrate, the backplate and the overmold material; characterized in that the first mold portion includes a plurality of spaced mold pins extending from an inner surface; in that the support pedestals are in contact with the first side of the substrate; and in that the mold pins contact the second side of the substrate. providing a mold having a first mold portion and a second mold portion (44, 42), wherein the first and second mold portions (44, 42) each include a cavity, and wherein the cavity of the first and second mold portions provides a mold cavity when joined; providing a backplate, the backplate having a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate; providing a substrate with a first side of an integrated circuit die (106A, B) mounted to a first side of the substrate, wherein the IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate, and wherein the substrate has a second side opposite the first side of the substrate; placing the backplate and the substrate within the cavity of the second mold portion, wherein a second side of the backplate is in contact with an inner surface of the second mold portion, and wherein a second side of the IC die is in thermal contact with the heatsink, where the first side of the IC die is opposite the second side of the IC die; joining the first and second mold portions; and filling the mold cavity with an overmold material to provide an overmolded electronic assembly that includes the substrate, the backplate and the overmold material; characterized in that the first mold portion includes a plurality of spaced mold pins extending from an inner surface; in that the support pedestals are in contact with the first side of the substrate; and in that the mold pins contact the second side of the substrate.