A cooling device comprising: a housing and a heat dissipation assembly; wherein: a sealed space for accommodating cooling liquid is formed in the housing; the cooling liquid is in contact with a to-be-cooled component; the heat dissipation assembly includes a heat dissipation assembly body and a heat conducting pipe communicating with the heat dissipation assembly body, the heat dissipation assembly body being arranged in the sealed space formed by the housing, and the heat dissipation assembly body being configured to, after the cooling liquid transforms into a gas by absorbing heat of the to-be-cooled component, absorb heat of the gas to convert the gas into liquid, the heat conducting pipe being at least partially located outside of the housing; wherein the heat dissipation assembly body is arranged at a 1/2 to 3/4 position along a height direction of the housing, and the heat dissipation assembly body divides the sealed space into a first space for accommodating the cooling liquid and the to-be-cooled component and a second space for maintaining a pressure, wherein the cooling device further comprises at least one fan, the fan being arranged in the second space and configured to enhance flow of the gas, an air outlet of the fan faces the heat dissipation assembly body; and wherein the cooling device is characterized in that the fan is arranged at the heat dissipation assembly body; the fan adjusts a rotation speed according to the pressure of the sealed space. a housing and a heat dissipation assembly; wherein: a sealed space for accommodating cooling liquid is formed in the housing; the cooling liquid is in contact with a to-be-cooled component; the heat dissipation assembly includes a heat dissipation assembly body and a heat conducting pipe communicating with the heat dissipation assembly body, the heat dissipation assembly body being arranged in the sealed space formed by the housing, and the heat dissipation assembly body being configured to, after the cooling liquid transforms into a gas by absorbing heat of the to-be-cooled component, absorb heat of the gas to convert the gas into liquid, the heat conducting pipe being at least partially located outside of the housing; wherein the heat dissipation assembly body is arranged at a 1/2 to 3/4 position along a height direction of the housing, and the heat dissipation assembly body divides the sealed space into a first space for accommodating the cooling liquid and the to-be-cooled component and a second space for maintaining a pressure, wherein the cooling device further comprises at least one fan, the fan being arranged in the second space and configured to enhance flow of the gas, an air outlet of the fan faces the heat dissipation assembly body; and wherein the cooling device is characterized in that the fan is arranged at the heat dissipation assembly body; the fan adjusts a rotation speed according to the pressure of the sealed space. a sealed space for accommodating cooling liquid is formed in the housing; the cooling liquid is in contact with a to-be-cooled component; the heat dissipation assembly includes a heat dissipation assembly body and a heat conducting pipe communicating with the heat dissipation assembly body, the heat dissipation assembly body being arranged in the sealed space formed by the housing, and the heat dissipation assembly body being configured to, after the cooling liquid transforms into a gas by absorbing heat of the to-be-cooled component, absorb heat of the gas to convert the gas into liquid, the heat conducting pipe being at least partially located outside of the housing; wherein the heat dissipation assembly body is arranged at a 1/2 to 3/4 position along a height direction of the housing, and the heat dissipation assembly body divides the sealed space into a first space for accommodating the cooling liquid and the to-be-cooled component and a second space for maintaining a pressure, a heat dissipation assembly body and a heat conducting pipe communicating with the heat dissipation assembly body, the heat dissipation assembly body being arranged in the sealed space formed by the housing, and the heat dissipation assembly body being configured to, after the cooling liquid transforms into a gas by absorbing heat of the to-be-cooled component, absorb heat of the gas to convert the gas into liquid, the heat conducting pipe being at least partially located outside of the housing; wherein the heat dissipation assembly body is arranged at a 1/2 to 3/4 position along a height direction of the housing, and the heat dissipation assembly body divides the sealed space into a first space for accommodating the cooling liquid and the to-be-cooled component and a second space for maintaining a pressure, wherein the cooling device further comprises at least one fan, the fan being arranged in the second space and configured to enhance flow of the gas, an air outlet of the fan faces the heat dissipation assembly body; and wherein the cooling device is characterized in that the fan is arranged at the heat dissipation assembly body; the fan adjusts a rotation speed according to the pressure of the sealed space.