A package on package (PoP) device comprising: a first package (202, 502, 2102) comprising: a first substrate (220, 2120); and a first die (222, 2122) coupled to the first substrate; a second package (204, 504, 2104) coupled to the first package, the second package comprising: a second substrate (240, 2140); and a second die (242, 2142) coupled to the second substrate; and a bi-directional thermal electric cooler,TEC, (210, 600, 2110) located between the first die and the second substrate, the bi-directional TEC adapted to dynamically dissipate heat back and forth between the first package and the second package, wherein the bi-directional thermal electric cooler, TEC, is configured to: dissipate heat from the first die to the second die when (i) a first temperature reading of the first die, is equal or greater than a first maximum operating temperature of the first die, and (ii) a second temperature reading of the second die, is less than a second maximum operating temperature of the second die; and dissipate heat from the second die to the first die when (i) the second temperature reading is equal or greater than the second maximum operating temperature, and (ii) the first temperature reading is less than the first maximum operating temperature. a first package (202, 502, 2102) comprising: a first substrate (220, 2120); and a first die (222, 2122) coupled to the first substrate; a first substrate (220, 2120); and a first die (222, 2122) coupled to the first substrate; a second package (204, 504, 2104) coupled to the first package, the second package comprising: a second substrate (240, 2140); and a second die (242, 2142) coupled to the second substrate; and a second substrate (240, 2140); and a second die (242, 2142) coupled to the second substrate; and a bi-directional thermal electric cooler,TEC, (210, 600, 2110) located between the first die and the second substrate, the bi-directional TEC adapted to dynamically dissipate heat back and forth between the first package and the second package, wherein the bi-directional thermal electric cooler, TEC, is configured to: dissipate heat from the first die to the second die when (i) a first temperature reading of the first die, is equal or greater than a first maximum operating temperature of the first die, and (ii) a second temperature reading of the second die, is less than a second maximum operating temperature of the second die; and dissipate heat from the second die to the first die when (i) the second temperature reading is equal or greater than the second maximum operating temperature, and (ii) the first temperature reading is less than the first maximum operating temperature. dissipate heat from the first die to the second die when (i) a first temperature reading of the first die, is equal or greater than a first maximum operating temperature of the first die, and (ii) a second temperature reading of the second die, is less than a second maximum operating temperature of the second die; and dissipate heat from the second die to the first die when (i) the second temperature reading is equal or greater than the second maximum operating temperature, and (ii) the first temperature reading is less than the first maximum operating temperature.