An electronic device enclosure, comprising: a glass cover for a top surface for the electronic device enclosure, the glass cover further having sides and a bottom surface; an adhesive deposited around a periphery of the bottom surface of the glass cover; and a peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, characterised in that the peripheral structure includes an inner protective side member and an outer protective side member, the inner protective side member being defined to have an L-shape with a horizontal portion and a vertical portion, the vertical portion being adjacent to a part of the sides of the glass cover and the horizontal portion being secured to the periphery of the bottom surface of the glass cover by the adhesive, wherein: the electronic device enclosure further comprises a support structure; the adhesive is provided where the inner protective side member is secured to the glass cover; the outer protective side member: has a first portion, having a first thickness, that is molded about at least a portion of the sides of the glass cover; has a second portion, having a second thickness, that is molded adjacent or over one or more sides of the inner protective side member; and has a third portion, having a thickness equal to the thickness of the support structure, that is molded between a bottom part of the inner protective side member and the support structure; a gap-free interface is defined between the sides of the glass cover and the first portion of the outer protective side member; the first thickness is less than or equal to 1 mm, and the peripheral structure comprises a polymer, the polymer including polyarylamide strengthened by containing glass fibers. a glass cover for a top surface for the electronic device enclosure, the glass cover further having sides and a bottom surface; an adhesive deposited around a periphery of the bottom surface of the glass cover; and a peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, characterised in that the peripheral structure includes an inner protective side member and an outer protective side member, the inner protective side member being defined to have an L-shape with a horizontal portion and a vertical portion, the vertical portion being adjacent to a part of the sides of the glass cover and the horizontal portion being secured to the periphery of the bottom surface of the glass cover by the adhesive, the electronic device enclosure further comprises a support structure; the adhesive is provided where the inner protective side member is secured to the glass cover; the outer protective side member: has a first portion, having a first thickness, that is molded about at least a portion of the sides of the glass cover; has a second portion, having a second thickness, that is molded adjacent or over one or more sides of the inner protective side member; and has a third portion, having a thickness equal to the thickness of the support structure, that is molded between a bottom part of the inner protective side member and the support structure; has a first portion, having a first thickness, that is molded about at least a portion of the sides of the glass cover; has a second portion, having a second thickness, that is molded adjacent or over one or more sides of the inner protective side member; and has a third portion, having a thickness equal to the thickness of the support structure, that is molded between a bottom part of the inner protective side member and the support structure; a gap-free interface is defined between the sides of the glass cover and the first portion of the outer protective side member; the first thickness is less than or equal to 1 mm, and the peripheral structure comprises a polymer, the polymer including polyarylamide strengthened by containing glass fibers.