Socket assembly comprising: a thermally conductive base frame for holding a light emitter package to a support structure, the light emitter package having a light emitter substrate with a light emitting element mounted thereto, wherein the base frame comprises a base that is configured to be mounted to the support structure and is further configured to mechanically engage the light emitter substrate of the light emitter package, so that the light emitter package is attachable to the support structure with a pre-determined holding force; at least one electrical contact element for electrically contacting said light emitter package; and an isolator printed circuit board, PCB, comprising a plurality of electrically conductive leads, wherein the electrical contact element is arranged on the isolator PCB and configured to electrically connect the isolator PCB to the light emitter substrate, the isolator PCB being configured to be electrically connected to an electrical power supply for supplying electrical power to the light emitting element; wherein the isolator PCB has a first surface and a second surface, the second surface being in heat transmitting contact with the base frame, such that the base frame is configured to absorb heat from the isolator PCB, and wherein the socket assembly further comprises at least one electronic component, which is arranged on said first surface of the isolator PCB and is electrically connectable to said light emitting element, wherein the socket assembly further comprises a cover that includes an opening that is configured to expose the light emitting element, the cover comprising a retention feature that cooperates with a retention member of the base frame to mechanically connect the cover to the base frame, wherein the retention member passes through the isolator PCB. a thermally conductive base frame for holding a light emitter package to a support structure, the light emitter package having a light emitter substrate with a light emitting element mounted thereto, wherein the base frame comprises a base that is configured to be mounted to the support structure and is further configured to mechanically engage the light emitter substrate of the light emitter package, so that the light emitter package is attachable to the support structure with a pre-determined holding force; at least one electrical contact element for electrically contacting said light emitter package; and an isolator printed circuit board, PCB, comprising a plurality of electrically conductive leads, wherein the electrical contact element is arranged on the isolator PCB and configured to electrically connect the isolator PCB to the light emitter substrate, the isolator PCB being configured to be electrically connected to an electrical power supply for supplying electrical power to the light emitting element; wherein the isolator PCB has a first surface and a second surface, the second surface being in heat transmitting contact with the base frame, such that the base frame is configured to absorb heat from the isolator PCB, and wherein the socket assembly further comprises at least one electronic component, which is arranged on said first surface of the isolator PCB and is electrically connectable to said light emitting element, wherein the socket assembly further comprises a cover that includes an opening that is configured to expose the light emitting element, the cover comprising a retention feature that cooperates with a retention member of the base frame to mechanically connect the cover to the base frame, wherein the retention member passes through the isolator PCB.