A wafer detection method carried out by a computer comprising: receiving an original wafer picture to be detected; performing (S 102) picture segmentation on the original wafer picture to acquire a plurality of first pictures, the plurality of first pictures being partially overlapped, characterized in that the wafer detection method further comprises: performing picture zooming on the original wafer picture to acquire a second picture; performing (S 104) the picture zooming on the plurality of first pictures to acquire a plurality of third pictures; sequentially (S 105) inputting the second picture and the plurality of third pictures into a wafer detection model to acquire a first detection result corresponding to the second picture and a second detection result corresponding to each third picture; and determining (S 106) a total detection result of the original wafer picture according to the first detection result and the plurality of second detection results; wherein the first detection result comprises a first defect position where a wafer defect exists in the second picture, and the second detection result comprises a second defect position where the wafer defect exists in each third picture; wherein determining the total detection result of the original wafer picture according to the first detection result and the plurality of second detection results comprises: mapping the first defect position in the first detection result and the second defect position in each second detection result into a coordinate system of the original wafer picture to acquire a plurality of third defect positions; and determining a total defect position where the wafer defect exists in the original wafer picture according to the plurality of third defect positions. receiving an original wafer picture to be detected; performing (S 102) picture segmentation on the original wafer picture to acquire a plurality of first pictures, the plurality of first pictures being partially overlapped, characterized in that the wafer detection method further comprises: performing picture zooming on the original wafer picture to acquire a second picture; performing (S 104) the picture zooming on the plurality of first pictures to acquire a plurality of third pictures; sequentially (S 105) inputting the second picture and the plurality of third pictures into a wafer detection model to acquire a first detection result corresponding to the second picture and a second detection result corresponding to each third picture; and determining (S 106) a total detection result of the original wafer picture according to the first detection result and the plurality of second detection results; performing picture zooming on the original wafer picture to acquire a second picture; performing (S 104) the picture zooming on the plurality of first pictures to acquire a plurality of third pictures; sequentially (S 105) inputting the second picture and the plurality of third pictures into a wafer detection model to acquire a first detection result corresponding to the second picture and a second detection result corresponding to each third picture; and determining (S 106) a total detection result of the original wafer picture according to the first detection result and the plurality of second detection results; wherein the first detection result comprises a first defect position where a wafer defect exists in the second picture, and the second detection result comprises a second defect position where the wafer defect exists in each third picture; wherein determining the total detection result of the original wafer picture according to the first detection result and the plurality of second detection results comprises: mapping the first defect position in the first detection result and the second defect position in each second detection result into a coordinate system of the original wafer picture to acquire a plurality of third defect positions; and determining a total defect position where the wafer defect exists in the original wafer picture according to the plurality of third defect positions. mapping the first defect position in the first detection result and the second defect position in each second detection result into a coordinate system of the original wafer picture to acquire a plurality of third defect positions; and determining a total defect position where the wafer defect exists in the original wafer picture according to the plurality of third defect positions.