A switch, comprising: a housing having a holding part; a switching mechanism that is housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts (15, 25); and an electronic component that is disposed in the housing and electrically connects the at least two terminals to each other, wherein the switching mechanism includes a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts (15, 25), and includes a first exposed part to which a first electrode (R9e1) of the electronic component is soldered by laser irradiation, and a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts (15, 25), and includes a second exposed part to which a second electrode (R9e2) of the electronic component is soldered by laser irradiation; wherein each of the first metal plate and the second metal plate are held by a holding wall of the holding part such that the first exposed part and the second exposed part are exposed; the first exposed part includes a first electrode mounting part on which the first electrode (R9e1) is placed, and a first soldering part on which solder is placed, and the second exposed part includes a second electrode mounting part on which the second electrode (R9e2) is placed, and a second soldering part on which solder is placed, wherein the first exposed part further includes a first peripheral part disposed along an edge of the first soldering part, the second exposed part further includes a second peripheral part disposed along an edge of the second soldering part;and each of the first peripheral part and the second peripheral part has a U-shape wherein the first exposed part and the second exposed part are arranged symmetrically with respect to the electric component. a housing having a holding part; a switching mechanism that is housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts (15, 25); and an electronic component that is disposed in the housing and electrically connects the at least two terminals to each other, wherein the switching mechanism includes a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts (15, 25), and includes a first exposed part to which a first electrode (R9e1) of the electronic component is soldered by laser irradiation, and a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts (15, 25), and includes a second exposed part to which a second electrode (R9e2) of the electronic component is soldered by laser irradiation; wherein each of the first metal plate and the second metal plate are held by a holding wall of the holding part such that the first exposed part and the second exposed part are exposed; a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts (15, 25), and includes a first exposed part to which a first electrode (R9e1) of the electronic component is soldered by laser irradiation, and a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts (15, 25), and includes a second exposed part to which a second electrode (R9e2) of the electronic component is soldered by laser irradiation; wherein each of the first metal plate and the second metal plate are held by a holding wall of the holding part such that the first exposed part and the second exposed part are exposed; the first exposed part includes a first electrode mounting part on which the first electrode (R9e1) is placed, and a first soldering part on which solder is placed, and the second exposed part includes a second electrode mounting part on which the second electrode (R9e2) is placed, and a second soldering part on which solder is placed, wherein the first exposed part further includes a first peripheral part disposed along an edge of the first soldering part, the second exposed part further includes a second peripheral part disposed along an edge of the second soldering part;and each of the first peripheral part and the second peripheral part has a U-shape wherein the first exposed part and the second exposed part are arranged symmetrically with respect to the electric component.