A semiconductor module comprising: a semiconductor chip; a cooling portion having a refrigerant passing portion inside, the refrigerant passing portion through which a refrigerant passes; and a laminated substrate having: a first metal interconnection layer closer to the semiconductor chip than to the cooling portion; a second metal interconnection layer closer to the cooling portion than to the semiconductor chip; and an insulation provided between the first metal interconnection layer and the second metal interconnection layer, wherein the cooling portion has: a top plate provided close to the laminated substrate; a bottom plate provided facing the top plate; and a plurality of protruding parts which are provided on a surface of the bottom plate contacting the refrigerant passing portion, and are separated from each other in a flow direction from an upstream to a downstream of the refrigerant, and are respectively provided continuously and entirely across a width direction of the refrigerant passing portion between adjacent side portions provided at ends of the cooling portion in the width direction, the side portions extending in parallel with the flow direction, and the width direction being orthogonal to the flow direction, wherein: the plurality of protruding parts are at least provided at a position overlapping with one end of the second metal interconnection layer and at a position overlapping with the semiconductor chip in the flow direction, the second metal interconnection layer is provided on the top plate, the insulation is provided above the second metal interconnection layer, the first metal interconnection layer is provided above the insulation, the semiconductor chip is provided on the first metal interconnection layer, in two protruding parts among the plurality of protruding parts, height (H23-3) of a protruding part provided at a position close to the downstream is higher than height (H23-1) of a protruding part provided at a position close to the upstream, and an interval (L24-3) between two protruding parts provided at a position close to the downstream among the plurality of protruding parts is narrower than an interval (L24-1) between two protruding parts provided at a position close to the upstream among the plurality of protruding parts. a semiconductor chip; a cooling portion having a refrigerant passing portion inside, the refrigerant passing portion through which a refrigerant passes; and a laminated substrate having: a first metal interconnection layer closer to the semiconductor chip than to the cooling portion; a second metal interconnection layer closer to the cooling portion than to the semiconductor chip; and an insulation provided between the first metal interconnection layer and the second metal interconnection layer, a first metal interconnection layer closer to the semiconductor chip than to the cooling portion; a second metal interconnection layer closer to the cooling portion than to the semiconductor chip; and an insulation provided between the first metal interconnection layer and the second metal interconnection layer, wherein the cooling portion has: a top plate provided close to the laminated substrate; a bottom plate provided facing the top plate; and a plurality of protruding parts which are provided on a surface of the bottom plate contacting the refrigerant passing portion, and are separated from each other in a flow direction from an upstream to a downstream of the refrigerant, and are respectively provided continuously and entirely across a width direction of the refrigerant passing portion between adjacent side portions provided at ends of the cooling portion in the width direction, the side portions extending in parallel with the flow direction, and the width direction being orthogonal to the flow direction, wherein: a top plate provided close to the laminated substrate; a bottom plate provided facing the top plate; and a plurality of protruding parts which are provided on a surface of the bottom plate contacting the refrigerant passing portion, and are separated from each other in a flow direction from an upstream to a downstream of the refrigerant, and are respectively provided continuously and entirely across a width direction of the refrigerant passing portion between adjacent side portions provided at ends of the cooling portion in the width direction, the side portions extending in parallel with the flow direction, and the width direction being orthogonal to the flow direction, wherein: the plurality of protruding parts are at least provided at a position overlapping with one end of the second metal interconnection layer and at a position overlapping with the semiconductor chip in the flow direction, the second metal interconnection layer is provided on the top plate, the insulation is provided above the second metal interconnection layer, the first metal interconnection layer is provided above the insulation, the semiconductor chip is provided on the first metal interconnection layer, in two protruding parts among the plurality of protruding parts, height (H23-3) of a protruding part provided at a position close to the downstream is higher than height (H23-1) of a protruding part provided at a position close to the upstream, and an interval (L24-3) between two protruding parts provided at a position close to the downstream among the plurality of protruding parts is narrower than an interval (L24-1) between two protruding parts provided at a position close to the upstream among the plurality of protruding parts.