A flexible emissive display device, comprising: a) a substrate having a display area; b) an adhesion layer thinner than the substrate formed on the substrate surface; c) a plurality of chiplets having a thickness greater than 2 microns and less than 200 microns adhered to the adhesion layer, each chiplet having at least one connection pad, the plurality of chiplets distributed within the display area, and wherein at least a portion of the adhesion layer extends above a portion of the chiplets; d) a plurality of bottom electrodes formed over the adhesion layer in the display area, each bottom electrode electrically connected to a connection pad of one chiplet, whereby the chiplets provide current to each of the bottom electrodes; e) at least one layer of light-emitting material formed over the bottom electrode; f) a top electrode formed over the at least one layer of light- emitting material, wherein the bottom electrodes, the at least one layer of light-emitting material, and the top electrode together are thinner than the adhesion layer; g) a cover thicker than the adhesion layer located over the top electrode and adhered to the substrate; and h) wherein the chiplets, bottom electrodes, at least one layer of light-emitting material, and top electrodes are at a neutral stress plane of a structure formed by the layers substrate, adhesion, chiplet, bottom electrode, light-emitting material, top electrode, and cover, wherein the neutral stress plane is defined as the plane that does not experience stress when the structure is flexed, such that a bending radius of the flexible emissive display device is less than 2 cm. a) a substrate having a display area; b) an adhesion layer thinner than the substrate formed on the substrate surface; c) a plurality of chiplets having a thickness greater than 2 microns and less than 200 microns adhered to the adhesion layer, each chiplet having at least one connection pad, the plurality of chiplets distributed within the display area, and wherein at least a portion of the adhesion layer extends above a portion of the chiplets; d) a plurality of bottom electrodes formed over the adhesion layer in the display area, each bottom electrode electrically connected to a connection pad of one chiplet, whereby the chiplets provide current to each of the bottom electrodes; e) at least one layer of light-emitting material formed over the bottom electrode; f) a top electrode formed over the at least one layer of light- emitting material, wherein the bottom electrodes, the at least one layer of light-emitting material, and the top electrode together are thinner than the adhesion layer; g) a cover thicker than the adhesion layer located over the top electrode and adhered to the substrate; and h) wherein the chiplets, bottom electrodes, at least one layer of light-emitting material, and top electrodes are at a neutral stress plane of a structure formed by the layers substrate, adhesion, chiplet, bottom electrode, light-emitting material, top electrode, and cover, wherein the neutral stress plane is defined as the plane that does not experience stress when the structure is flexed, such that a bending radius of the flexible emissive display device is less than 2 cm.