A microelectronic package, comprising: a first substrate having a first exposed contact at a first side and a first wire bond contact at a second side opposite the first side; a first microelectronic die electrically connecting with the first substrate, the first microelectronic die having an active side and a back side, wherein the second side of the first substrate is attached to the first microelectronic die; a second substrate electrically connecting with the first substrate, the second substrate having a second exposed contact and a second wire bond contact at a first side; a second microelectronic die electrically connecting to the second substrate, the second microelectronic die having an active side and a back side, wherein a second side of the second substrate is attached to the second microelectronic die, and wherein the back side of the second microelectronic die is adhesively attached to the back side of the first microelectronic die; a molding compound at least partially encapsulating the first and second substrates and the first and second dies without covering the first exposed contact or the second exposed contact; a first set of wires connecting the second side of the first substrate to the first side of the second substrate; a second set of wires connecting the first side of the first substrate to a central area of the first microelectronic die; and a third set of wires connecting the first side of the second substrate to the second microelectronic die, wherein the first substrate has a through opening, and wherein the second set of wires extends through the through opening of the first substrate, wherein the second substrate has a through opening, and wherein the third set of wires extends through the through opening of the second substrate, and wherein the first substrate is larger than the second substrate. a first substrate having a first exposed contact at a first side and a first wire bond contact at a second side opposite the first side; a first microelectronic die electrically connecting with the first substrate, the first microelectronic die having an active side and a back side, wherein the second side of the first substrate is attached to the first microelectronic die; a second substrate electrically connecting with the first substrate, the second substrate having a second exposed contact and a second wire bond contact at a first side; a second microelectronic die electrically connecting to the second substrate, the second microelectronic die having an active side and a back side, wherein a second side of the second substrate is attached to the second microelectronic die, and wherein the back side of the second microelectronic die is adhesively attached to the back side of the first microelectronic die; a molding compound at least partially encapsulating the first and second substrates and the first and second dies without covering the first exposed contact or the second exposed contact; a first set of wires connecting the second side of the first substrate to the first side of the second substrate; a second set of wires connecting the first side of the first substrate to a central area of the first microelectronic die; and a third set of wires connecting the first side of the second substrate to the second microelectronic die, wherein the first substrate has a through opening, and wherein the second set of wires extends through the through opening of the first substrate, wherein the second substrate has a through opening, and wherein the third set of wires extends through the through opening of the second substrate, and wherein the first substrate is larger than the second substrate.