A molded photosensitive assembly, comprising: at least one circuit board having at least one chip mounting area; at least one photosensitive element, provided on said at least one chip mounting area of said at least one circuit board, having a photosensitive area and a non-photosensitive area; at least a set of wires, wherein two ends of each of said set of wires are respectively connected to said at least one photosensitive element and said at least one circuit board; at least one supporting member formed by a first substance, wherein each of the at least one supporting member comprises a frame-shaped supporting body and has a through hole, wherein the supporting body is disposed outside the photosensitive area of the photosensitive element to cover at least a part of each of the wires, wherein the photosensitive area of the photosensitive element is corresponding to the through hole of the supporting member; and at least one molded base formed by a second substance, wherein said at least one molded base comprises a molded body and has at least one light window, wherein said set of wires and said at least one photosensitive element are protected by said at least one supporting member when and after said at least one molded body is molded by a molding-die supported by the supporting member, wherein said at least one molded body is integrally coupled to cover at least a part of said at least one circuit board and at least a part of said non-photosensitive area of said at least one photosensitive element, wherein said photosensitive area of said at least one photosensitive element is positioned corresponding said at least one light window of said at least one molded base, wherein the molded base covers an outer surface of the supporting body and at least a part of a top surface after being molded. at least one circuit board having at least one chip mounting area; at least one photosensitive element, provided on said at least one chip mounting area of said at least one circuit board, having a photosensitive area and a non-photosensitive area; at least a set of wires, wherein two ends of each of said set of wires are respectively connected to said at least one photosensitive element and said at least one circuit board; at least one supporting member formed by a first substance, wherein each of the at least one supporting member comprises a frame-shaped supporting body and has a through hole, wherein the supporting body is disposed outside the photosensitive area of the photosensitive element to cover at least a part of each of the wires, wherein the photosensitive area of the photosensitive element is corresponding to the through hole of the supporting member; and at least one molded base formed by a second substance, wherein said at least one molded base comprises a molded body and has at least one light window, wherein said set of wires and said at least one photosensitive element are protected by said at least one supporting member when and after said at least one molded body is molded by a molding-die supported by the supporting member, wherein said at least one molded body is integrally coupled to cover at least a part of said at least one circuit board and at least a part of said non-photosensitive area of said at least one photosensitive element, wherein said photosensitive area of said at least one photosensitive element is positioned corresponding said at least one light window of said at least one molded base, wherein the molded base covers an outer surface of the supporting body and at least a part of a top surface after being molded.