A capacitor structure, comprising: a first wall means for providing a first terminal that is common to a plurality of capacitors; and a plurality of second wall means, each second wall means of the plurality of second wall means being configured for providing a second terminal for a different one of the capacitors, wherein the first wall means and the plurality of second wall means stand substantially perpendicularly relative to a plane, a height of the first wall means in a dimension perpendicular to the plane is greater than a thickness of the first wall means in a dimension lying in the plane, and a height of each second wall means of the plurality of second wall means in the dimension perpendicular to the plane is greater than a thickness of said each second wall means in the dimension lying in the plane; wherein the first wall means are being constructed of a first continuous electrically conducting medium and each of the plurality of second walls means is being constructed of one of a second continuous electrically conducting medium, or wherein the first wall means comprises a plurality of first conducting layer means for conducting and one or more via means for providing electrical communication between the conducting layer means and the second wall means comprises a plurality of second conducting layer means for conducting and one or more via means for providing electrical communication between the second conducting layer means; and the first wall means includes a first common region and plurality of first finger regions extending from the first common region; and further comprising a substrate in the plane. a first wall means for providing a first terminal that is common to a plurality of capacitors; and a plurality of second wall means, each second wall means of the plurality of second wall means being configured for providing a second terminal for a different one of the capacitors, wherein the first wall means and the plurality of second wall means stand substantially perpendicularly relative to a plane, a height of the first wall means in a dimension perpendicular to the plane is greater than a thickness of the first wall means in a dimension lying in the plane, and a height of each second wall means of the plurality of second wall means in the dimension perpendicular to the plane is greater than a thickness of said each second wall means in the dimension lying in the plane; wherein the first wall means are being constructed of a first continuous electrically conducting medium and each of the plurality of second walls means is being constructed of one of a second continuous electrically conducting medium, or wherein the first wall means comprises a plurality of first conducting layer means for conducting and one or more via means for providing electrical communication between the conducting layer means and the second wall means comprises a plurality of second conducting layer means for conducting and one or more via means for providing electrical communication between the second conducting layer means; and the first wall means includes a first common region and plurality of first finger regions extending from the first common region; and further comprising a substrate in the plane.