A computer system, comprising: a support structure comprising an air inlet and an air outlet; a first air-cooled server assembly housed in the support structure, the first air-cooled assembly having a first server blade and a first enclosure configured to receive cooling air that removes heat from heat producing components on the first server blade; and a second immersion-cooled server assembly housed in the support structure with the first air-cooled server assembly, the second immersion-cooled server assembly having a second enclosure housing: a second server blade having a printed circuit board carrying one or more heat producing components; a dielectric coolant in the interior space of the enclosure and submerging the heat producing components on the PCB; and a condenser assembly in the interior space of the enclosure the condenser assembly having: a vapor inlet and a liquid outlet proximate the PCB of the server blade; a condenser coil in fluid communication with a vapor gap in the interior space via the vapor inlet, the condenser coil being configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap and condenses the vapor into a liquid to be returned to the heat producing components mounted on the PCB via the liquid outlet and a heat exchanger in fluid communication with the cooling air received via the air inlet of the support structure, the heat exchanger being configured to receive the coolant with the removed heat from the condenser coil and transfer the removed heat from the coolant to the cooling air before exhausting the cooling air via the air outlet. a support structure comprising an air inlet and an air outlet; a first air-cooled server assembly housed in the support structure, the first air-cooled assembly having a first server blade and a first enclosure configured to receive cooling air that removes heat from heat producing components on the first server blade; and a second immersion-cooled server assembly housed in the support structure with the first air-cooled server assembly, the second immersion-cooled server assembly having a second enclosure housing: a second server blade having a printed circuit board carrying one or more heat producing components; a dielectric coolant in the interior space of the enclosure and submerging the heat producing components on the PCB; and a condenser assembly in the interior space of the enclosure the condenser assembly having: a vapor inlet and a liquid outlet proximate the PCB of the server blade; a condenser coil in fluid communication with a vapor gap in the interior space via the vapor inlet, the condenser coil being configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap and condenses the vapor into a liquid to be returned to the heat producing components mounted on the PCB via the liquid outlet and a heat exchanger in fluid communication with the cooling air received via the air inlet of the support structure, the heat exchanger being configured to receive the coolant with the removed heat from the condenser coil and transfer the removed heat from the coolant to the cooling air before exhausting the cooling air via the air outlet. a second server blade having a printed circuit board carrying one or more heat producing components; a dielectric coolant in the interior space of the enclosure and submerging the heat producing components on the PCB; and a condenser assembly in the interior space of the enclosure the condenser assembly having: a vapor inlet and a liquid outlet proximate the PCB of the server blade; a condenser coil in fluid communication with a vapor gap in the interior space via the vapor inlet, the condenser coil being configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap and condenses the vapor into a liquid to be returned to the heat producing components mounted on the PCB via the liquid outlet and a heat exchanger in fluid communication with the cooling air received via the air inlet of the support structure, the heat exchanger being configured to receive the coolant with the removed heat from the condenser coil and transfer the removed heat from the coolant to the cooling air before exhausting the cooling air via the air outlet. a vapor inlet and a liquid outlet proximate the PCB of the server blade; a condenser coil in fluid communication with a vapor gap in the interior space via the vapor inlet, the condenser coil being configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap and condenses the vapor into a liquid to be returned to the heat producing components mounted on the PCB via the liquid outlet and a heat exchanger in fluid communication with the cooling air received via the air inlet of the support structure, the heat exchanger being configured to receive the coolant with the removed heat from the condenser coil and transfer the removed heat from the coolant to the cooling air before exhausting the cooling air via the air outlet.