Printed circuit with a multi-layer structure, characterised in that it comprises: - a first layer which comprises a dielectric material between two metallised faces (11, 12) and which is processed so as to form a spotface extending through the layer over the entirety of its thickness, - a second layer which comprises a dielectric material between two metallised faces (21, 22) and which comprises a first cavity extending through the layer over the entirety of its thickness and which is assembled on the first layer in such a manner that this first cavity is facing the spotface, - a third layer comprising a dielectric material between two metallised faces (31, 32) and comprising, on one face, an electronic component occupying a surface Scomp, the other face being without metal over a section ≥ Scomp, this third layer being assembled on the second layer in such a manner that the component is in the first cavity, - a fourth layer which comprises a dielectric material between two metallised faces (41, 42) and which comprises a second cavity and which is assembled on the third layer in such a manner that this second cavity is facing the first cavity, - a heat-conducting element in two portions: ∘ one which is produced from metal, called a thermal cover, and which is inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, ∘ the other which is produced from a dielectric material with heat conduction > 30 W/(m.K), and which is brazed to the first portion and placed in the first cavity so as to be in contact with the electronic component so as to thereby ensure heat conduction. - a first layer which comprises a dielectric material between two metallised faces (11, 12) and which is processed so as to form a spotface extending through the layer over the entirety of its thickness, - a second layer which comprises a dielectric material between two metallised faces (21, 22) and which comprises a first cavity extending through the layer over the entirety of its thickness and which is assembled on the first layer in such a manner that this first cavity is facing the spotface, - a third layer comprising a dielectric material between two metallised faces (31, 32) and comprising, on one face, an electronic component occupying a surface Scomp, the other face being without metal over a section ≥ Scomp, this third layer being assembled on the second layer in such a manner that the component is in the first cavity, - a fourth layer which comprises a dielectric material between two metallised faces (41, 42) and which comprises a second cavity and which is assembled on the third layer in such a manner that this second cavity is facing the first cavity, - a heat-conducting element in two portions: ∘ one which is produced from metal, called a thermal cover, and which is inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, ∘ the other which is produced from a dielectric material with heat conduction > 30 W/(m.K), and which is brazed to the first portion and placed in the first cavity so as to be in contact with the electronic component so as to thereby ensure heat conduction. ∘ one which is produced from metal, called a thermal cover, and which is inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, ∘ the other which is produced from a dielectric material with heat conduction > 30 W/(m.K), and which is brazed to the first portion and placed in the first cavity so as to be in contact with the electronic component so as to thereby ensure heat conduction.