An electronic component bonding device for applying pressure to an electronic component loaded on a bonding section of a circuit board so as to bond the electronic component to the bonding section of the circuit board, the electronic component bonding device comprising: multiple pressing tools configured to apply pressure to the electronic component on the bonding section of the circuit board; a support block configured to support the multiple pressing tools and to support each of the multiple pressing tools via a following mechanism that allows the pressing tool to incline in any direction around 360 degrees; and a drive mechanism configured to drive the support block in a vertical direction, and, via lowering operation, apply pressure to the electronic component on the bonding section of the circuit board using one of the multiple pressing tools and bond the electronic component to the bonding section of the circuit board, the electronic component bonding device is characterized by: the following mechanism including a disc-shaped supporting section fixed horizontally to the lower section of a base section of the following mechanism, a round flange section, which is formed going up from the upper surface side of the pressing tool and is engaged with clearance on the outer circumferential side of the disc-shaped support section so as to be movable vertically and able to be inclined, and a ring-shaped stopper, which is fixed to the pressing tool, and is engageably held on the upper surface side of the outer circumferential section of the disc-shaped support section with a specified clearance to the lower section of the base section so as to be able to be inclined in any direction around 360 degrees, whereby the ring-shaped stopper is biased downwards by a spring attached on the base section. multiple pressing tools configured to apply pressure to the electronic component on the bonding section of the circuit board; a support block configured to support the multiple pressing tools and to support each of the multiple pressing tools via a following mechanism that allows the pressing tool to incline in any direction around 360 degrees; and a drive mechanism configured to drive the support block in a vertical direction, and, via lowering operation, apply pressure to the electronic component on the bonding section of the circuit board using one of the multiple pressing tools and bond the electronic component to the bonding section of the circuit board, the following mechanism including a disc-shaped supporting section fixed horizontally to the lower section of a base section of the following mechanism, a round flange section, which is formed going up from the upper surface side of the pressing tool and is engaged with clearance on the outer circumferential side of the disc-shaped support section so as to be movable vertically and able to be inclined, and a ring-shaped stopper, which is fixed to the pressing tool, and is engageably held on the upper surface side of the outer circumferential section of the disc-shaped support section with a specified clearance to the lower section of the base section so as to be able to be inclined in any direction around 360 degrees, whereby the ring-shaped stopper is biased downwards by a spring attached on the base section.