A probe device for performing an electrical test of a semiconductor device formed on a semiconductor wafer, the probe device comprising: a mounting table on which the semiconductor wafer is mounted; a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table; and a temperature control mechanism configured to control a temperature of the mounting table, wherein the mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode, and the first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and characterised in that the first electrode, the second electrode and the insulating plate are locked to be movable relative to each other in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction with a gap therebetween, in the locking part, a screw hole is formed in the first electrode and an oblong hole penetrating through the insulating plate and the second electrode in their thickness direction is formed at a position of the insulating plate and the second electrode corresponding to the screw hole, the first electrode, the insulating plate and the second electrode are stacked in that order and a male screw, which is inserted from a side of the second electrode, is screwed to the screw hole, in the fixing part, another screw hole is formed in the first electrode and a circular hole penetrating through the insulating plate and the second electrode in their thickness direction is formed at a position of the insulating plate and the second electrode corresponding to the another screw hole, and collars (130, 135) each having a cylindrical member and a flange portion (131, 136) at one end of the cylindrical member are respectively fitted into the circular hole of the fixing part and the oblong hole of the locking part, and a through hole (132, 137), into which the male screw is inserted, is formed in each of the collars (130, 135) along a central axis of the cylindrical member. a mounting table on which the semiconductor wafer is mounted; a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table; and a temperature control mechanism configured to control a temperature of the mounting table, wherein the mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode, and the first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and characterised in that the first electrode, the second electrode and the insulating plate are locked to be movable relative to each other in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction with a gap therebetween, in the locking part, a screw hole is formed in the first electrode and an oblong hole penetrating through the insulating plate and the second electrode in their thickness direction is formed at a position of the insulating plate and the second electrode corresponding to the screw hole, the first electrode, the insulating plate and the second electrode are stacked in that order and a male screw, which is inserted from a side of the second electrode, is screwed to the screw hole, in the fixing part, another screw hole is formed in the first electrode and a circular hole penetrating through the insulating plate and the second electrode in their thickness direction is formed at a position of the insulating plate and the second electrode corresponding to the another screw hole, and collars (130, 135) each having a cylindrical member and a flange portion (131, 136) at one end of the cylindrical member are respectively fitted into the circular hole of the fixing part and the oblong hole of the locking part, and a through hole (132, 137), into which the male screw is inserted, is formed in each of the collars (130, 135) along a central axis of the cylindrical member.