A method for producing electrodes in a pattern, said method comprising: (a) providing an ultrasound array transducer stack comprising a piezoelectric layer and a plurality of first kerf slots that extend a predetermined depth therein the stack, and wherein the plurality of first kerf slots define a plurality of ultrasonic array elements; (b) placing a connector having an electrical connection for each of the plurality of ultrasonic array elements in proximity to the stack; (c) depositing a composite dielectric material on a bottom surface of the stack and a portion of the connector; (d) laser ablating at least a portion of the composite dielectric material to expose the plurality of ultrasonic array elements and to form a plurality of trenches in the dielectric material, each of the plurality of trenches extending from one of the ultrasonic array elements to one electrical connection in the connector; (e) depositing a conductive metal on the plurality of ultrasonic array elements and the plurality of trenches after laser ablating the composite dielectric material; (f) depositing a resist on the conductive metal, wherein the resist is thicker over each array element and trench compared to over the plurality of first kerf slots; and (g) removing a portion of the resist to expose a portion of the conductive metal in a pattern that is a negative of a desired pattern of the electrodes and etching the exposed portion of the conductive metal to produce the electrodes in the pattern; the method characterized in that: the composite dielectric material comprises a matrix material and a particulate material; the matrix material ablates at a fluence insufficient to ablate the particulate material such that laser ablating the composite dielectric material at the fluence removes at least a portion of the matrix material from the composite dielectric material and retains the particulate material; and laser ablating the composite dielectric material includes removing matrix material and increasing a surface area of the composite dielectric material. (a) providing an ultrasound array transducer stack comprising a piezoelectric layer and a plurality of first kerf slots that extend a predetermined depth therein the stack, and wherein the plurality of first kerf slots define a plurality of ultrasonic array elements; (b) placing a connector having an electrical connection for each of the plurality of ultrasonic array elements in proximity to the stack; (c) depositing a composite dielectric material on a bottom surface of the stack and a portion of the connector; (d) laser ablating at least a portion of the composite dielectric material to expose the plurality of ultrasonic array elements and to form a plurality of trenches in the dielectric material, each of the plurality of trenches extending from one of the ultrasonic array elements to one electrical connection in the connector; (e) depositing a conductive metal on the plurality of ultrasonic array elements and the plurality of trenches after laser ablating the composite dielectric material; (f) depositing a resist on the conductive metal, wherein the resist is thicker over each array element and trench compared to over the plurality of first kerf slots; and (g) removing a portion of the resist to expose a portion of the conductive metal in a pattern that is a negative of a desired pattern of the electrodes and etching the exposed portion of the conductive metal to produce the electrodes in the pattern; the composite dielectric material comprises a matrix material and a particulate material; the matrix material ablates at a fluence insufficient to ablate the particulate material such that laser ablating the composite dielectric material at the fluence removes at least a portion of the matrix material from the composite dielectric material and retains the particulate material; and laser ablating the composite dielectric material includes removing matrix material and increasing a surface area of the composite dielectric material.