A heating system component for a heating system for heating a fluid medium, said heating system component comprising: a carrier unit; a heating unit coupled to said carrier unit; wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit, at least one temperature sensor (370a, 370b), in particular an NTC thermistor, wherein said temperature sensor (370a, 370b) is effectively in thermal contact with at least a part of an upper surface of said dry side of the carrier unit wherein the part of the upper side of the carrier unit is in contact with said fluid medium at the wet side and wherein the part of the upper side of the carrier unit is effectively thermally insulated from the heating unit, characterized by a heat conducting plate covering at least a part of the groove, wherein the heat conducting plate comprises a projecting part extending beyond the groove of the carrier unit, the projecting part being in direct contact with the dry side of the carrier unit; wherein at least a part of the heat conducting plate is covered with a insulating layer on top of which the temperature sensor and conductor paths connected to the temperature sensor (370a, 370b) are formed. a carrier unit; a heating unit coupled to said carrier unit; wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit, at least one temperature sensor (370a, 370b), in particular an NTC thermistor, wherein said temperature sensor (370a, 370b) is effectively in thermal contact with at least a part of an upper surface of said dry side of the carrier unit wherein the part of the upper side of the carrier unit is in contact with said fluid medium at the wet side and wherein the part of the upper side of the carrier unit is effectively thermally insulated from the heating unit, characterized by a heat conducting plate covering at least a part of the groove, wherein the heat conducting plate comprises a projecting part extending beyond the groove of the carrier unit, the projecting part being in direct contact with the dry side of the carrier unit; wherein at least a part of the heat conducting plate is covered with a insulating layer on top of which the temperature sensor and conductor paths connected to the temperature sensor (370a, 370b) are formed. wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit, at least one temperature sensor (370a, 370b), in particular an NTC thermistor, wherein said temperature sensor (370a, 370b) is effectively in thermal contact with at least a part of an upper surface of said dry side of the carrier unit wherein the part of the upper side of the carrier unit is in contact with said fluid medium at the wet side and wherein the part of the upper side of the carrier unit is effectively thermally insulated from the heating unit, characterized by a heat conducting plate covering at least a part of the groove, wherein the heat conducting plate comprises a projecting part extending beyond the groove of the carrier unit, the projecting part being in direct contact with the dry side of the carrier unit; wherein at least a part of the heat conducting plate is covered with a insulating layer on top of which the temperature sensor and conductor paths connected to the temperature sensor (370a, 370b) are formed.