A light emitting device comprising: an LED chip; a mounting substrate mounting said LED chip; a dome-shaped color conversion member made of a transparent resin material and a fluorescent material which is excited by a light emitted from said LED chip to emit a light of a color different from a luminescent color of the LED chip, said dome-shaped color conversion member being bonded on the mounting substrate to surround the LED chip; and an encapsulation member disposed in a space confined between the mounting substrate and the color conversion member to encapsulate the LED chip, said encapsulation member being made of an encapsulation resin material, wherein said encapsulation member has a convex lens-shape such that a light output surface of the encapsulation member is held in an intimate contact with an internal surface of the color conversion member, wherein said mounting substrate includes a heat conductive plate made of a heat conductive material and a dielectric substrate stacked on said heat conductive plate, said dielectric substrate being formed with a pair of lead patterns on its surface opposite to said heat conductive plate for electrical connection respectively with electrodes of said LED chip, wherein said dielectric substrate has a through-opening at a portion corresponding to said LED chip, wherein said LED chip is mounted to said heat conductive plate inside of the through-opening with a planar sub-mount member interposed between said LED chip and said heat conductive plate, wherein said sub-mount member is larger than the LED chip and is configured to thermally couple the LED chip to the heat conductive plate so as to relieve a stress applied to said LED chip due to a difference in linear thermal expansion coefficient between said LED chip and said heat conductive plate; and wherein the sub-mount member has a conductive pattern on a surface facing the LED chip, and a reflecting film formed around the conductive pattern. an LED chip; a mounting substrate mounting said LED chip; a dome-shaped color conversion member made of a transparent resin material and a fluorescent material which is excited by a light emitted from said LED chip to emit a light of a color different from a luminescent color of the LED chip, said dome-shaped color conversion member being bonded on the mounting substrate to surround the LED chip; and an encapsulation member disposed in a space confined between the mounting substrate and the color conversion member to encapsulate the LED chip, said encapsulation member being made of an encapsulation resin material, wherein said encapsulation member has a convex lens-shape such that a light output surface of the encapsulation member is held in an intimate contact with an internal surface of the color conversion member, wherein said mounting substrate includes a heat conductive plate made of a heat conductive material and a dielectric substrate stacked on said heat conductive plate, said dielectric substrate being formed with a pair of lead patterns on its surface opposite to said heat conductive plate for electrical connection respectively with electrodes of said LED chip, wherein said dielectric substrate has a through-opening at a portion corresponding to said LED chip, wherein said LED chip is mounted to said heat conductive plate inside of the through-opening with a planar sub-mount member interposed between said LED chip and said heat conductive plate, wherein said sub-mount member is larger than the LED chip and is configured to thermally couple the LED chip to the heat conductive plate so as to relieve a stress applied to said LED chip due to a difference in linear thermal expansion coefficient between said LED chip and said heat conductive plate; and wherein the sub-mount member has a conductive pattern on a surface facing the LED chip, and a reflecting film formed around the conductive pattern.