A system for detecting an off specification void in an item produced by an additive manufacturing process, the system comprising: a first camera positioned to capture a first plurality of images of deposition of material in an additive manufacturing receptacle from a first angle; a second camera positioned to capture a second plurality of images of deposition the material in the additive manufacturing receptacle from a second angle; averagers (226, 228) configured to perform an averaging of subsets of images of the first plurality of images and an averaging of subsets of images of the second plurality of images; at least one hardware electronic feature detector (218, 220) communicatively coupled to the first camera and to the second camera, the hardware electronic feature detector hard coded to detect features of elements of the material in image data derived from the averaging of a subset of images of the first plurality of images and the averaging of a subset of images of the second plurality of images; at least one electronic triangulator communicatively coupled to the at least one hardware electronic feature detector and configured to: receive feature data from the at least one hardware electronic feature detector; and generate an electronic three-dimensional representation of the material in the additive manufacturing receptacle from the feature data; at least one electronic void detector configured to determine from the electronic three-dimensional representation of the material in the additive manufacturing receptacle that an off specification void exists in the additive manufacturing receptacle; and at least one display configured to provide an alert that an off specification void exists in the additive manufacturing receptacle, wherein the material comprises chopped fiber chips, wherein the at least one hardware electronic feature detector is further configured to detect edges of a plurality of individual chopped fiber chips and wherein the feature data comprises edges of a plurality of individual chopped fiber chips, and wherein the at least one electronic void detector is further configured to: compute volumes of a plurality of chopped fiber chips; and compute void information from the volumes, wherein the void information represents a size of at least one void in the additive manufacturing receptacle. a first camera positioned to capture a first plurality of images of deposition of material in an additive manufacturing receptacle from a first angle; a second camera positioned to capture a second plurality of images of deposition the material in the additive manufacturing receptacle from a second angle; averagers (226, 228) configured to perform an averaging of subsets of images of the first plurality of images and an averaging of subsets of images of the second plurality of images; at least one hardware electronic feature detector (218, 220) communicatively coupled to the first camera and to the second camera, the hardware electronic feature detector hard coded to detect features of elements of the material in image data derived from the averaging of a subset of images of the first plurality of images and the averaging of a subset of images of the second plurality of images; at least one electronic triangulator communicatively coupled to the at least one hardware electronic feature detector and configured to: receive feature data from the at least one hardware electronic feature detector; and generate an electronic three-dimensional representation of the material in the additive manufacturing receptacle from the feature data; at least one electronic void detector configured to determine from the electronic three-dimensional representation of the material in the additive manufacturing receptacle that an off specification void exists in the additive manufacturing receptacle; and at least one display configured to provide an alert that an off specification void exists in the additive manufacturing receptacle, wherein the material comprises chopped fiber chips, wherein the at least one hardware electronic feature detector is further configured to detect edges of a plurality of individual chopped fiber chips and wherein the feature data comprises edges of a plurality of individual chopped fiber chips, and wherein the at least one electronic void detector is further configured to: compute volumes of a plurality of chopped fiber chips; and compute void information from the volumes, wherein the void information represents a size of at least one void in the additive manufacturing receptacle. compute volumes of a plurality of chopped fiber chips; and compute void information from the volumes, wherein the void information represents a size of at least one void in the additive manufacturing receptacle.