A method of manufacturing a lead connector for an implantable medical device, the method comprising: connecting proximal ends (46a, 46b, and 46c) of a plurality of conductive pins (46a, 46b, 46c) to a corresponding one of a plurality of ring contacts (38a, 38b, 38c) to form a plurality of ring-pin subassemblies (38a/48a, 38b/48b, 38c/48c); assembling each of the plurality of ring-pin subassemblies (38a/48a, 38b/48b, 38c/48c) on an assembly frame to form a ring-pin assembly, including inserting the plurality of conductive pins (46a, 46b, 46c) in a corresponding plurality of openings (68a, 68b, 68c, 68d) within the assembly frame such that the corresponding plurality of ring contacts (38a, 38b, 38c) are spaced along a longitudinal dimension of the assembly frame, wherein the plurality of openings (68a, 68b, 68c, 68d) are configured as cylindrical lumens with a diameter that accommodates the plurality of conductive pins (46a, 46b, 46c), wherein the assembly frame comprises a plurality of steps (62a, 62b, 62c) and wherein assembling each of the plurality of ring-pin subassemblies (38a/48a, 38b/48b, 38c/48c) on the assembly frame further comprises placing one of the plurality of ring contacts (38a, 38b, 38c) adjacent one of the plurality of steps (62a, 62b, 62c), and wherein the plurality of openings (68a, 68b, 68c, 68d) within the assembly frame are configured to ensure no conductive pin of the plurality of conductive pins (46a, 46b, 46c) contacts any other conductive pin of the plurality of conductive pins (46a, 46b, 46c); arranging the ring-pin assembly within a mold cavity; filling the mold cavity with a mold material that at least partially surrounds the ring-pin assembly; and removing a resulting lead connector from the mold cavity. connecting proximal ends (46a, 46b, and 46c) of a plurality of conductive pins (46a, 46b, 46c) to a corresponding one of a plurality of ring contacts (38a, 38b, 38c) to form a plurality of ring-pin subassemblies (38a/48a, 38b/48b, 38c/48c); assembling each of the plurality of ring-pin subassemblies (38a/48a, 38b/48b, 38c/48c) on an assembly frame to form a ring-pin assembly, including inserting the plurality of conductive pins (46a, 46b, 46c) in a corresponding plurality of openings (68a, 68b, 68c, 68d) within the assembly frame such that the corresponding plurality of ring contacts (38a, 38b, 38c) are spaced along a longitudinal dimension of the assembly frame, wherein the plurality of openings (68a, 68b, 68c, 68d) are configured as cylindrical lumens with a diameter that accommodates the plurality of conductive pins (46a, 46b, 46c), wherein the assembly frame comprises a plurality of steps (62a, 62b, 62c) and wherein assembling each of the plurality of ring-pin subassemblies (38a/48a, 38b/48b, 38c/48c) on the assembly frame further comprises placing one of the plurality of ring contacts (38a, 38b, 38c) adjacent one of the plurality of steps (62a, 62b, 62c), and wherein the plurality of openings (68a, 68b, 68c, 68d) within the assembly frame are configured to ensure no conductive pin of the plurality of conductive pins (46a, 46b, 46c) contacts any other conductive pin of the plurality of conductive pins (46a, 46b, 46c); arranging the ring-pin assembly within a mold cavity; filling the mold cavity with a mold material that at least partially surrounds the ring-pin assembly; and removing a resulting lead connector from the mold cavity.