An electronic device, characterized by: a heat-generating structure including a substrate, an electronic component disposed on said substrate, and at least one electronic element disposed on said substrate and spaced apart from said electronic component; a heat dissipation structure including: a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body, a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer, a blocking member that is disposed between said substrate and said anti-corrosion layer, that is connected to said substrate, and that surrounds said liquid metal layer and said electronic component, a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member, an insulation layer disposed between said substrate and said anti-corrosion layer; characterized by a cushioning adhesive disposed between said blocking member and said anti-corrosion layer; and an insulation glue disposed between said insulation layer and said substrate and encapsulating said at least one electronic element; wherein said insulation layer extends from said blocking member to said fixing adhesive and covers said insulation glue, and said cushioning adhesive is clamped between said insulation layer and said anti-corrosion layer. a heat-generating structure including a substrate, an electronic component disposed on said substrate, and at least one electronic element disposed on said substrate and spaced apart from said electronic component; a heat dissipation structure including: a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body, a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer, a blocking member that is disposed between said substrate and said anti-corrosion layer, that is connected to said substrate, and that surrounds said liquid metal layer and said electronic component, a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member, an insulation layer disposed between said substrate and said anti-corrosion layer; characterized by a cushioning adhesive disposed between said blocking member and said anti-corrosion layer; and a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body, a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer, a blocking member that is disposed between said substrate and said anti-corrosion layer, that is connected to said substrate, and that surrounds said liquid metal layer and said electronic component, a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member, an insulation layer disposed between said substrate and said anti-corrosion layer; characterized by a cushioning adhesive disposed between said blocking member and said anti-corrosion layer; and an insulation glue disposed between said insulation layer and said substrate and encapsulating said at least one electronic element; wherein said insulation layer extends from said blocking member to said fixing adhesive and covers said insulation glue, and said cushioning adhesive is clamped between said insulation layer and said anti-corrosion layer.