A method for forming a glass frit on a glass substrate, the method characterized by: providing an ion-exchange strengthened glass substrate comprising a compressive stress layer extending from a surface of the glass substrate into a thickness of the glass substrate, the compressive stress layer having a depth of layer DOL and an initial compressive stress CS i; depositing a glass frit composition on at least a portion of the surface of the glass substrate; heating the glass substrate and the glass frit composition in a furnace to sinter the glass frit composition and bond the glass frit composition to the glass substrate, wherein, after heating, the glass frit composition is fully vitrified and the glass substrate has a fired compressive stress CS f which is greater than or equal to 0.70 ∗ CS i, wherein the glass substrate and the glass frit composition are heated by: heating the glass substrate and the glass frit composition to a first temperature T1; holding the glass substrate and the glass frit composition at the first temperature T1 for a first holding time HT1; heating the glass substrate and the glass frit composition to a second temperature T2; and holding the glass substrate and the glass frit composition at the second temperature T2 for a second holding time HT2, wherein the second temperature T2 is less than or equal to 450°C and the first temperature T1 is less than or equal to the second temperature T2; and wherein the initial compressive stress CS i is greater than or equal to 600 MPa and the depth of layer DOL is greater than or equal to 30 μm. providing an ion-exchange strengthened glass substrate comprising a compressive stress layer extending from a surface of the glass substrate into a thickness of the glass substrate, the compressive stress layer having a depth of layer DOL and an initial compressive stress CS i; depositing a glass frit composition on at least a portion of the surface of the glass substrate; heating the glass substrate and the glass frit composition in a furnace to sinter the glass frit composition and bond the glass frit composition to the glass substrate, wherein, after heating, the glass frit composition is fully vitrified and the glass substrate has a fired compressive stress CS f which is greater than or equal to 0.70 ∗ CS i, wherein the glass substrate and the glass frit composition are heated by: heating the glass substrate and the glass frit composition to a first temperature T1; holding the glass substrate and the glass frit composition at the first temperature T1 for a first holding time HT1; heating the glass substrate and the glass frit composition to a second temperature T2; and holding the glass substrate and the glass frit composition at the second temperature T2 for a second holding time HT2, wherein the second temperature T2 is less than or equal to 450°C and the first temperature T1 is less than or equal to the second temperature T2; and wherein the initial compressive stress CS i is greater than or equal to 600 MPa and the depth of layer DOL is greater than or equal to 30 μm. heating the glass substrate and the glass frit composition to a first temperature T1; holding the glass substrate and the glass frit composition at the first temperature T1 for a first holding time HT1; heating the glass substrate and the glass frit composition to a second temperature T2; and holding the glass substrate and the glass frit composition at the second temperature T2 for a second holding time HT2, wherein the second temperature T2 is less than or equal to 450°C and the first temperature T1 is less than or equal to the second temperature T2; and wherein the initial compressive stress CS i is greater than or equal to 600 MPa and the depth of layer DOL is greater than or equal to 30 μm.