A method for producing a clamp element for a turgor pressure measurement device for measuring the turgor pressure in a plant sample, wherein the clamp element comprises: - a sensor receiving portion with a first contact surface, a surface lying opposite the contact surface, and a peripheral surface connecting the two, wherein the clamp element has a longitudinal axis extending perpendicularly to the first contact surface, and with a recess on the side of the first contact surface, said recess being open towards the first contact surface; - a pressure sensor, which is arranged on a printed circuit board/lead frame, to measure a pressure response signal of the plant sample, wherein the printed circuit board/lead frame is arranged with the pressure sensor in the recess of the sensor receiving portion such that the pressure sensor faces the first contact surface and the printed circuit board/lead frame lies at the bottom of the recess, characterized by the steps: (a) fixing the printed circuit board/lead frame with the pressure sensor arranged thereon at the bottom or at the wall of the recess; (b) filling a first amount of potting material into the recess, wherein the first amount is selected such that only the printed circuit board/lead frame and the pressure sensor are covered and the potting material can be raised at the lower half of the inner wall of the sensor housing; (c) after cross-linking of the first amount of potting material with the printed circuit board/lead frame, the pressure sensor and the inner wall, filling in a second amount of potting material such that, taking into account the expansion during cross-linking of the second amount of potting material with the wall of the recess, the second amount of potting material remains below the upper edge of the recess; and (d) after cross-linking of the second amount of potting material with the recess wall, filling in a third amount of potting material such that the top of the potting material lies flush with the first contact surface. - a sensor receiving portion with a first contact surface, a surface lying opposite the contact surface, and a peripheral surface connecting the two, wherein the clamp element has a longitudinal axis extending perpendicularly to the first contact surface, and with a recess on the side of the first contact surface, said recess being open towards the first contact surface; - a pressure sensor, which is arranged on a printed circuit board/lead frame, to measure a pressure response signal of the plant sample, wherein the printed circuit board/lead frame is arranged with the pressure sensor in the recess of the sensor receiving portion such that the pressure sensor faces the first contact surface and the printed circuit board/lead frame lies at the bottom of the recess, (a) fixing the printed circuit board/lead frame with the pressure sensor arranged thereon at the bottom or at the wall of the recess; (b) filling a first amount of potting material into the recess, wherein the first amount is selected such that only the printed circuit board/lead frame and the pressure sensor are covered and the potting material can be raised at the lower half of the inner wall of the sensor housing; (c) after cross-linking of the first amount of potting material with the printed circuit board/lead frame, the pressure sensor and the inner wall, filling in a second amount of potting material such that, taking into account the expansion during cross-linking of the second amount of potting material with the wall of the recess, the second amount of potting material remains below the upper edge of the recess; and (d) after cross-linking of the second amount of potting material with the recess wall, filling in a third amount of potting material such that the top of the potting material lies flush with the first contact surface.