A display device, comprising: a display panel; a printed circuit board configured to supply a driving signal to the display panel, wherein the PCB has a first surface and a second surface opposing each other, and wherein the second surface is closer to the display panel than the first surface; and a substrate bracket attached to an edge of a surface of the display panel to support the PCB, wherein the substrate bracket is formed of at least one of the following: a metal, ceramic, and resin having a thermal conductivity that is comparatively higher than the PCB, wherein the substrate bracket comprises: a bracket main body portion facing the PCB, wherein the bracket main body portion has i) a first surface that contacts at least part of the second surface of the PCB and ii) a second surface that faces the display panel; characterised in that the substrate bracket further comprises: a bracket coupling ledge bent and extending from the an upper portion of the first surface of the bracket main body portion, wherein the bracket coupling ledge at least partially surrounds an upper portion of the first surface of the PCB; a bracket hook portion protruding from a lower portion of the first surface of the bracket main body portion to pass through part of the PCB and support a lower portion of the PCB; and wherein a plurality of protrusions and depressions for heat dissipation are formed in at least part of the first surface of the substrate bracket main body portion. a display panel; a printed circuit board configured to supply a driving signal to the display panel, wherein the PCB has a first surface and a second surface opposing each other, and wherein the second surface is closer to the display panel than the first surface; and a substrate bracket attached to an edge of a surface of the display panel to support the PCB, wherein the substrate bracket is formed of at least one of the following: a metal, ceramic, and resin having a thermal conductivity that is comparatively higher than the PCB, wherein the substrate bracket comprises: a bracket main body portion facing the PCB, wherein the bracket main body portion has i) a first surface that contacts at least part of the second surface of the PCB and ii) a second surface that faces the display panel; characterised in that the substrate bracket further comprises: a bracket coupling ledge bent and extending from the an upper portion of the first surface of the bracket main body portion, wherein the bracket coupling ledge at least partially surrounds an upper portion of the first surface of the PCB; a bracket hook portion protruding from a lower portion of the first surface of the bracket main body portion to pass through part of the PCB and support a lower portion of the PCB; and wherein a plurality of protrusions and depressions for heat dissipation are formed in at least part of the first surface of the substrate bracket main body portion. a bracket main body portion facing the PCB, wherein the bracket main body portion has i) a first surface that contacts at least part of the second surface of the PCB and ii) a second surface that faces the display panel; characterised in that the substrate bracket further comprises: a bracket coupling ledge bent and extending from the an upper portion of the first surface of the bracket main body portion, wherein the bracket coupling ledge at least partially surrounds an upper portion of the first surface of the PCB; a bracket hook portion protruding from a lower portion of the first surface of the bracket main body portion to pass through part of the PCB and support a lower portion of the PCB; and wherein a plurality of protrusions and depressions for heat dissipation are formed in at least part of the first surface of the substrate bracket main body portion. a bracket coupling ledge bent and extending from the an upper portion of the first surface of the bracket main body portion, wherein the bracket coupling ledge at least partially surrounds an upper portion of the first surface of the PCB; a bracket hook portion protruding from a lower portion of the first surface of the bracket main body portion to pass through part of the PCB and support a lower portion of the PCB; and wherein a plurality of protrusions and depressions for heat dissipation are formed in at least part of the first surface of the substrate bracket main body portion.