A method of manufacturing a waveguide assembly, comprising the steps of providing at least two waveguide units, wherein each waveguide unit (110, 120) has at least one bonding portion (111, 121) formed at a position where each two said waveguide units (110, 120) are combined; and combining the waveguide units by applying at least one adhesive to a dispensing path of the bonding portion (111, 121) to combine the waveguide units (110, 120) into the waveguide assembly, characterized in that the adhesive is a form-in-place adhesive being composed of: 9%-12% of dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; 12%-15% of hydroxy terminated polydimethylsiloxane; 0%-0.2% of dispersant; 3%-5% of dimethyl, methylhydrogen siloxane crosslinking agent; 0%-0.2% of adhesion promoter; 0%-0.2% of Pt catalyst; 1%-3% of forming agent; 0%-10% of hydrocarbon solvent; 50%-70% of Nickel Graphite; 0%-0.2% of thickening agent; 5%-10% of trimethylated silica; and 0%-0.1% of inhibitor; wherein an adhesion strength of the adhesive is larger than 80 N/cm 2; the adhesive further having a shielding capability that is larger than 100 dB in the frequency spectrum range from 200 MHz to 20 GHz; the minimum width being 0.4 mm; the minimum height being 0.3 mm; and the filling width of the dispensing path being between 0.4 mm and 2 mm. providing at least two waveguide units, wherein each waveguide unit (110, 120) has at least one bonding portion (111, 121) formed at a position where each two said waveguide units (110, 120) are combined; and combining the waveguide units by applying at least one adhesive to a dispensing path of the bonding portion (111, 121) to combine the waveguide units (110, 120) into the waveguide assembly, characterized in that the adhesive is a form-in-place adhesive being composed of: 9%-12% of dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; 12%-15% of hydroxy terminated polydimethylsiloxane; 0%-0.2% of dispersant; 3%-5% of dimethyl, methylhydrogen siloxane crosslinking agent; 0%-0.2% of adhesion promoter; 0%-0.2% of Pt catalyst; 1%-3% of forming agent; 0%-10% of hydrocarbon solvent; 50%-70% of Nickel Graphite; 0%-0.2% of thickening agent; 5%-10% of trimethylated silica; and 0%-0.1% of inhibitor; wherein an adhesion strength of the adhesive is larger than 80 N/cm 2; the adhesive further having a shielding capability that is larger than 100 dB in the frequency spectrum range from 200 MHz to 20 GHz; the minimum width being 0.4 mm; the minimum height being 0.3 mm; and the filling width of the dispensing path being between 0.4 mm and 2 mm. 9%-12% of dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; 12%-15% of hydroxy terminated polydimethylsiloxane; 0%-0.2% of dispersant; 3%-5% of dimethyl, methylhydrogen siloxane crosslinking agent; 0%-0.2% of adhesion promoter; 0%-0.2% of Pt catalyst; 1%-3% of forming agent; 0%-10% of hydrocarbon solvent; 50%-70% of Nickel Graphite; 0%-0.2% of thickening agent; 5%-10% of trimethylated silica; and 0%-0.1% of inhibitor; wherein an adhesion strength of the adhesive is larger than 80 N/cm 2; the adhesive further having a shielding capability that is larger than 100 dB in the frequency spectrum range from 200 MHz to 20 GHz; the minimum width being 0.4 mm; the minimum height being 0.3 mm; and the filling width of the dispensing path being between 0.4 mm and 2 mm.