A proximity sensor system, comprising: a sensor article having a sensor sensing surface, wherein the sensor article is configured to sense the magnetic field of a magnetic target article located proximate the sensor sensing surface and generate a sensor signal; a Temperature Compensation Article, TCA,, wherein the Temperature Compensation Article includes, a first Digital-to-Analog Converter, DAC,, a first thermistor and a first biasing resistor, wherein the first thermistor and the first biasing resistor are connected in a parallel configuration and the first DAC is connect to the first thermistor and the first biasing resistor in a series configuration, a second DAC and a second thermistor, wherein the second DAC and second thermistor are connected in a series configuration, a third DAC and a Resistive Temperature Detector,RTD,, wherein the third DAC and RTD are connected in a series configuration, a fourth DAC and a second biasing resistor, wherein the fourth DAC and the second biasing resistor are connected in a series configuration, wherein the outputs of the first thermistor and first biasing resistor combination, second thermistor, RTD and the second biasing resistor are connected together to generate a TCA output signal; and processing circuitry, wherein the processing circuitry is configured to process the sensor signal and the TCA output signal to generate a sensor system output signal. a sensor article having a sensor sensing surface, wherein the sensor article is configured to sense the magnetic field of a magnetic target article located proximate the sensor sensing surface and generate a sensor signal; a Temperature Compensation Article, TCA,, wherein the Temperature Compensation Article includes, a first Digital-to-Analog Converter, DAC,, a first thermistor and a first biasing resistor, wherein the first thermistor and the first biasing resistor are connected in a parallel configuration and the first DAC is connect to the first thermistor and the first biasing resistor in a series configuration, a second DAC and a second thermistor, wherein the second DAC and second thermistor are connected in a series configuration, a third DAC and a Resistive Temperature Detector,RTD,, wherein the third DAC and RTD are connected in a series configuration, a fourth DAC and a second biasing resistor, wherein the fourth DAC and the second biasing resistor are connected in a series configuration, wherein the outputs of the first thermistor and first biasing resistor combination, second thermistor, RTD and the second biasing resistor are connected together to generate a TCA output signal; and a first Digital-to-Analog Converter, DAC,, a first thermistor and a first biasing resistor, wherein the first thermistor and the first biasing resistor are connected in a parallel configuration and the first DAC is connect to the first thermistor and the first biasing resistor in a series configuration, a second DAC and a second thermistor, wherein the second DAC and second thermistor are connected in a series configuration, a third DAC and a Resistive Temperature Detector,RTD,, wherein the third DAC and RTD are connected in a series configuration, a fourth DAC and a second biasing resistor, wherein the fourth DAC and the second biasing resistor are connected in a series configuration, wherein the outputs of the first thermistor and first biasing resistor combination, second thermistor, RTD and the second biasing resistor are connected together to generate a TCA output signal; and processing circuitry, wherein the processing circuitry is configured to process the sensor signal and the TCA output signal to generate a sensor system output signal.