Method for producing a multi-layer body, wherein the method comprises the following steps: providing a single-layered or multi-layered substrate with a first surface and a second surface, providing one or more sensor films, which each comprise at least one sensor region and have a first surface and a second surface facing away from the first surface, applying the one or more sensor films onto the second surface of the substrate in such a way that the first surface of the respective sensor film lies at least in regions on the second surface of the substrate, thermoforming a layer sequence comprising the substrate and the one or more sensor films applied to the second surface of the substrate in such a way that a surface relief is formed on the first surface of the substrate during thermoforming, which surface relief is determined by the shaping, in particular contour and/or elevation relief, of one or more of the one or more sensor films, wherein the one or more sensor films each have one or more capacitive and/or resistive sensor elements in the at least one sensor region, and wherein the one or more sensor films each has at least one connection region and/or contact region for contacting one or more of the sensor elements, characterised in that, when providing at least one sensor film of the one or more sensor films, the elevation relief of the at least one sensor film is modified, wherein a substrate is provided as a substrate, which, after thermoforming, has a layer thickness, in particular an average layer thickness, between 125 μm and 3500 μm, in particular between 400 μm and 1500 μm, preferably between 600 μm and 1100 μm, and wherein the surface relief formed on the first surface of the substrate has a maximum elevation difference and/or an average elevation difference between a local minimum of the surface relief or a global minimum of the surface relief and a local maximum of the surface relief or a global maximum of the surface relief which is less than 5000 μm, in particular less than 2000 μm, preferably less than 1000 μm. providing a single-layered or multi-layered substrate with a first surface and a second surface, providing one or more sensor films, which each comprise at least one sensor region and have a first surface and a second surface facing away from the first surface, applying the one or more sensor films onto the second surface of the substrate in such a way that the first surface of the respective sensor film lies at least in regions on the second surface of the substrate, thermoforming a layer sequence comprising the substrate and the one or more sensor films applied to the second surface of the substrate in such a way that a surface relief is formed on the first surface of the substrate during thermoforming, which surface relief is determined by the shaping, in particular contour and/or elevation relief, of one or more of the one or more sensor films, wherein the one or more sensor films each have one or more capacitive and/or resistive sensor elements in the at least one sensor region, and wherein the one or more sensor films each has at least one connection region and/or contact region for contacting one or more of the sensor elements, characterised in that, when providing at least one sensor film of the one or more sensor films, the elevation relief of the at least one sensor film is modified, wherein a substrate is provided as a substrate, which, after thermoforming, has a layer thickness, in particular an average layer thickness, between 125 μm and 3500 μm, in particular between 400 μm and 1500 μm, preferably between 600 μm and 1100 μm, and wherein the surface relief formed on the first surface of the substrate has a maximum elevation difference and/or an average elevation difference between a local minimum of the surface relief or a global minimum of the surface relief and a local maximum of the surface relief or a global maximum of the surface relief which is less than 5000 μm, in particular less than 2000 μm, preferably less than 1000 μm.