Laser cutting apparatus for shielded leads, in particular for laser-cutting of shielding wires and/or shielding foils at shielded leads, comprising the following features: - provision is made of at least one laser device that is embodied to produce a laser beam; - provision is made of a ring mirror device having a circumferential mirrored wall, which delimits a cutting chamber and through which a central axis passes; - the circumferential mirrored wall is open at its end sides (9a, 9b), as a result of which a cable introduction opening is formed at the first end side and a laser inlet opening is formed at the second end side, which lies opposite the first end side, wherein the cutting chamber is accessible from outside of the circumferential mirrored wall by way of these openings (9a, 9b); - a shielded lead to be cut by the laser beam is arrangeable along the central axis in the cutting chamber; - the circumferential mirrored wall is embodied to reflect the laser beam in the direction of the shielded lead, wherein the circumferential mirrored wall extends through 360° around the central axis; - provision is moreover made of a laser beam deflection apparatus that is embodied to guide the laser beam in such a way that the laser beam enters the cutting chamber through the laser inlet opening and strikes the circumferential mirrored wall; - the laser beam deflection apparatus is further embodied to guide the laser beam in such a way that the latter moves on a trajectory along the circumferential mirrored wall through 360° about the central axis, as a result of which the shielded lead, which is arrangeable in the region of the central axis within the cutting chamber, is cuttable along the entire circumference thereof by the laser beam that is reflected at the circumferential mirrored wall; - the laser inlet opening has a diameter of less than 20 cm but of more than 5 cm; characterized by the following features: - provision is made of a transport device; - the transport device is embodied to hold the shielded lead and convey the latter through the cable introduction opening into the cutting chamber; - the transport device and the ring mirror device are arranged a) so as to be non-displaceable relative to one another; and/or b) in stationary fashion during the laser cutting. - provision is made of at least one laser device that is embodied to produce a laser beam; - provision is made of a ring mirror device having a circumferential mirrored wall, which delimits a cutting chamber and through which a central axis passes; - the circumferential mirrored wall is open at its end sides (9a, 9b), as a result of which a cable introduction opening is formed at the first end side and a laser inlet opening is formed at the second end side, which lies opposite the first end side, wherein the cutting chamber is accessible from outside of the circumferential mirrored wall by way of these openings (9a, 9b); - a shielded lead to be cut by the laser beam is arrangeable along the central axis in the cutting chamber; - the circumferential mirrored wall is embodied to reflect the laser beam in the direction of the shielded lead, wherein the circumferential mirrored wall extends through 360° around the central axis; - provision is moreover made of a laser beam deflection apparatus that is embodied to guide the laser beam in such a way that the laser beam enters the cutting chamber through the laser inlet opening and strikes the circumferential mirrored wall; - the laser beam deflection apparatus is further embodied to guide the laser beam in such a way that the latter moves on a trajectory along the circumferential mirrored wall through 360° about the central axis, as a result of which the shielded lead, which is arrangeable in the region of the central axis within the cutting chamber, is cuttable along the entire circumference thereof by the laser beam that is reflected at the circumferential mirrored wall; - the laser inlet opening has a diameter of less than 20 cm but of more than 5 cm; - provision is made of a transport device; - the transport device is embodied to hold the shielded lead and convey the latter through the cable introduction opening into the cutting chamber; - the transport device and the ring mirror device are arranged a) so as to be non-displaceable relative to one another; and/or b) in stationary fashion during the laser cutting. a) so as to be non-displaceable relative to one another; and/or b) in stationary fashion during the laser cutting.