A fluid application device for forming a coated portion on a workpiece of an electronic component, the fluid application device comprising: a discharge head including a tank capable of accommodating a fluid, and a nozzle formed at one end of the discharge head, the discharge head being configured to be positioned above the workpiece, and configured to position the nozzle above the workpiece, the discharge head being configured to be movable relative to the workpiece; a heater unit for keeping the fluid in the tank at a desired temperature; positive pressure supply means, including a positive pressure supply source, for supplying a first, positive pressure into the tank and ejecting the fluid in the tank onto the workpiece from an opening of the nozzle; negative pressure supply means, including a negative pressure supply source, for supplying a second, negative pressure into the tank and holding the fluid in the tank without ejecting the fluid from the opening of the nozzle; a pressure sensor for monitoring the pressure in the tank; and a control device for controlling a pressure to be supplied into the tank based on a signal from the pressure sensor, where the fluid is a molten solder, and the positive pressure supply means and the negative pressure supply means are connected to the tank via a valve and a common pipeline, the valve switches between a state in which only fluid communication between the positive pressure supply means and the common pipeline is allowed and a state in which only fluid communication between the negative pressure supply means and the common pipeline is allowed, in order to supply the first pressure or the second pressure to the tank, characterized in that the fluid application device further comprises a solder supply device coupled to the tank to automatically supply an additional solder into the tank so that the amount of the molten solder in the tank is kept substantially constant when the molten solder in the tank is consumed during operation, and the control device is configured to input data related to an amount of the fluid in the tank. a discharge head including a tank capable of accommodating a fluid, and a nozzle formed at one end of the discharge head, the discharge head being configured to be positioned above the workpiece, and configured to position the nozzle above the workpiece, the discharge head being configured to be movable relative to the workpiece; a heater unit for keeping the fluid in the tank at a desired temperature; positive pressure supply means, including a positive pressure supply source, for supplying a first, positive pressure into the tank and ejecting the fluid in the tank onto the workpiece from an opening of the nozzle; negative pressure supply means, including a negative pressure supply source, for supplying a second, negative pressure into the tank and holding the fluid in the tank without ejecting the fluid from the opening of the nozzle; a pressure sensor for monitoring the pressure in the tank; and a control device for controlling a pressure to be supplied into the tank based on a signal from the pressure sensor, where the fluid is a molten solder, and the positive pressure supply means and the negative pressure supply means are connected to the tank via a valve and a common pipeline, the valve switches between a state in which only fluid communication between the positive pressure supply means and the common pipeline is allowed and a state in which only fluid communication between the negative pressure supply means and the common pipeline is allowed, in order to supply the first pressure or the second pressure to the tank, characterized in that the fluid application device further comprises a solder supply device coupled to the tank to automatically supply an additional solder into the tank so that the amount of the molten solder in the tank is kept substantially constant when the molten solder in the tank is consumed during operation, and the control device is configured to input data related to an amount of the fluid in the tank.