A materials testing system comprising a materials testing device and an apparatus for controlling pressure in said materials testing device, the apparatus including: - a device configured to receive an electronic command relating to a first target pressure; - a device configured to receive an electronic command relating to a second target pressure, wherein the second target pressure is higher than the first target pressure; - a device configured to generate a command for selectively applying the first target pressure or the second target pressure to an output, the output being received by opposing grips (102, 104) of the materials testing device; - a device (32, 36) configured to receive the command for selectively applying the first target pressure or the second target pressure to the output, wherein the first target pressure is applied in response to a first command and the second target pressure is applied in response to a subsequent command; and - a processing device configured to generate pressure control signals for varying pressure, characterized by a device configured to receive a signal indicating measured pressure in the apparatus; wherein the processing device is configured to compare the measured pressure to the selected first or second pressure and generate the control signals; wherein the opposing grips (102, 104) of the materials testing device are configured to be operated by the first target pressure in a range of greater than 0 to 0.103 MPa (zero to fifteen psi); wherein the second target pressure preferably is in a range of greater than 0.103 to 0.689 MPa (fifteen psi to one hundred psi); and wherein the device configured to generate a command for selectively applying the first target pressure or the second target pressure is manually operated. - a device configured to receive an electronic command relating to a first target pressure; - a device configured to receive an electronic command relating to a second target pressure, wherein the second target pressure is higher than the first target pressure; - a device configured to generate a command for selectively applying the first target pressure or the second target pressure to an output, the output being received by opposing grips (102, 104) of the materials testing device; - a device (32, 36) configured to receive the command for selectively applying the first target pressure or the second target pressure to the output, wherein the first target pressure is applied in response to a first command and the second target pressure is applied in response to a subsequent command; and - a processing device configured to generate pressure control signals for varying pressure, characterized by a device configured to receive a signal indicating measured pressure in the apparatus; wherein the processing device is configured to compare the measured pressure to the selected first or second pressure and generate the control signals; wherein the opposing grips (102, 104) of the materials testing device are configured to be operated by the first target pressure in a range of greater than 0 to 0.103 MPa (zero to fifteen psi); wherein the second target pressure preferably is in a range of greater than 0.103 to 0.689 MPa (fifteen psi to one hundred psi); and wherein the device configured to generate a command for selectively applying the first target pressure or the second target pressure is manually operated.