Pressure sensor, comprising: a semi-conductor pressure transducer with a process isolating diaphragm and a circuit designed to convert a pressure-dependent deformation of the process isolating diaphragm into an electrical signal, a diaphragm seal with a hydraulic path, which extends between a first opening and a second opening through a solid body, wherein the first opening is sealed by a process isolating diaphragm, which can be exposed to a pressure to be measured, in order to introduce the pressure to be measured into the hydraulic path, wherein at the second opening the hydraulic path ends in a transducer chamber in which the pressure transducer is arranged and which is sealed by the process isolating diaphragm of the pressure transducer, wherein the hydraulic path contains a transmission liquid, a filling body, which is arranged in the transducer chamber, in order to fill in cavities between the metal walls of the transducer chamber and the semi-conductor pressure transducer, and an insulation plate, which is arranged in the transducer chamber between the process isolating diaphragm and a wall of the transducer chamber located opposite the process isolating diaphragm, wherein the filling body has an essentially cylindrical basic shape and wherein an opening, notably square, is located inside and accommodates the semi-conductor pressure transducer, characterized in that four axial bore holes extend through the filling body from the body's front face and wherein electrical connections for the semi-conductor pressure transducer can be guided through the bores, wherein four electrical feed-throughs are flush with the bore holes through the filling body, wherein the feed-throughs have contact pins which extend in an axial direction approximately as far as the surface of the filling body, wherein the insulation plate has four recesses on its underside which are there to provide space for connection wires to establish contact with the semi-conductor pressure transducer, and also serve as passages for the transmission liquid, wherein the surface of the semi-conductor pressure transducer is approximately flush with the surface of the filling body and contact areas on the surface of the semi-conductor pressure transducer are connected to the contact pins via bond wires, wherein the insulation plate is fixed on the filling body or is formed as a single piece with the filling body, wherein a front face of the filling body has a sufficiently large, smooth surface to which the filling body can be raised and transported using a suction tool, wherein the filling body and the insulation plate have complementary fasteners which are intermeshed in order to fix the insulation plate to the filling body with a force-fit and/or positive-locking connection. a semi-conductor pressure transducer with a process isolating diaphragm and a circuit designed to convert a pressure-dependent deformation of the process isolating diaphragm into an electrical signal, a diaphragm seal with a hydraulic path, which extends between a first opening and a second opening through a solid body, wherein the first opening is sealed by a process isolating diaphragm, which can be exposed to a pressure to be measured, in order to introduce the pressure to be measured into the hydraulic path, wherein at the second opening the hydraulic path ends in a transducer chamber in which the pressure transducer is arranged and which is sealed by the process isolating diaphragm of the pressure transducer, wherein the hydraulic path contains a transmission liquid, a filling body, which is arranged in the transducer chamber, in order to fill in cavities between the metal walls of the transducer chamber and the semi-conductor pressure transducer, and an insulation plate, which is arranged in the transducer chamber between the process isolating diaphragm and a wall of the transducer chamber located opposite the process isolating diaphragm, wherein the filling body has an essentially cylindrical basic shape and wherein an opening, notably square, is located inside and accommodates the semi-conductor pressure transducer, characterized in that four axial bore holes extend through the filling body from the body's front face and wherein electrical connections for the semi-conductor pressure transducer can be guided through the bores, wherein four electrical feed-throughs are flush with the bore holes through the filling body, wherein the feed-throughs have contact pins which extend in an axial direction approximately as far as the surface of the filling body, wherein the insulation plate has four recesses on its underside which are there to provide space for connection wires to establish contact with the semi-conductor pressure transducer, and also serve as passages for the transmission liquid, wherein the surface of the semi-conductor pressure transducer is approximately flush with the surface of the filling body and contact areas on the surface of the semi-conductor pressure transducer are connected to the contact pins via bond wires, wherein the insulation plate is fixed on the filling body or is formed as a single piece with the filling body, wherein a front face of the filling body has a sufficiently large, smooth surface to which the filling body can be raised and transported using a suction tool, wherein the filling body and the insulation plate have complementary fasteners which are intermeshed in order to fix the insulation plate to the filling body with a force-fit and/or positive-locking connection.