Polyamide moulding compound having the following composition: 25 to 84.99% by weight of at least one caprolactam-containing polyamide with a caprolactam content of at least 50% by weight and at least one further polyamide, wherein component is formed from 10 to 40% by weight of at least one caprolactam-containing polyamide and 60 to 90% by weight of at least one polyamide, components and adding up to 100% by weight 15 to 70% by weight of at least one filler and reinforcing means, 0,01 to 5.0% by weight of at least one lanthanoid compound selected from the group consisting of - fluorides, chlorides, bromides, iodides, oxyhalides, sulphates, nitrates, phosphates, chromates, perchlorates, oxalates, the monochalcogenides of sulphur, selenium and tellurium, carbonates, hydroxides, oxides, trifluoromethanesulphonates, acetylacetonates, alcoholates, 2-ethylhexanoates - the lanthanoids, lanthanum, cerium, praesodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium and also - hydrates of the mentioned salt and also - mixtures of the mentioned compounds. 0,01 to 5.0% by weight of at least one heat stabiliser which differs from the lanthanoid compound under which is selected from the group consisting of a) compounds of mono- or bivalent copper, e.g. salts of mono-or bivalent copper with inorganic or organic acids or mono-or bivalent phenols, the oxides of mono- or bivalent copper, or complex compounds of copper salts with ammonia, amines, amides, lactams, cyanides or phosphines, preferably Cu - or Cu salts of hydrohalogen acids, of hydrocyanic acids or the copper salts of aliphatic carboxylic acids, particularly preferably CuCl, CuBr, CuI, CuCN and Cu 2 O, CuCl 2, CuSO 4, CuO, copper acetate or copper stearate, b) stabilisers based on secondary aromatic amines, c) stabilisers based on sterically hindered phenols d) phosphites and phosphonites and also e) mixtures hereof. 0 to 20.0% by weight of at least one additive, components to adding up to 100% by weight. 25 to 84.99% by weight of at least one caprolactam-containing polyamide with a caprolactam content of at least 50% by weight and at least one further polyamide, wherein component is formed from 10 to 40% by weight of at least one caprolactam-containing polyamide and 60 to 90% by weight of at least one polyamide, components and adding up to 100% by weight 15 to 70% by weight of at least one filler and reinforcing means, 0,01 to 5.0% by weight of at least one lanthanoid compound selected from the group consisting of - fluorides, chlorides, bromides, iodides, oxyhalides, sulphates, nitrates, phosphates, chromates, perchlorates, oxalates, the monochalcogenides of sulphur, selenium and tellurium, carbonates, hydroxides, oxides, trifluoromethanesulphonates, acetylacetonates, alcoholates, 2-ethylhexanoates - the lanthanoids, lanthanum, cerium, praesodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium and also - hydrates of the mentioned salt and also - mixtures of the mentioned compounds. - fluorides, chlorides, bromides, iodides, oxyhalides, sulphates, nitrates, phosphates, chromates, perchlorates, oxalates, the monochalcogenides of sulphur, selenium and tellurium, carbonates, hydroxides, oxides, trifluoromethanesulphonates, acetylacetonates, alcoholates, 2-ethylhexanoates - the lanthanoids, lanthanum, cerium, praesodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium and also - hydrates of the mentioned salt and also - mixtures of the mentioned compounds. 0,01 to 5.0% by weight of at least one heat stabiliser which differs from the lanthanoid compound under which is selected from the group consisting of a) compounds of mono- or bivalent copper, e.g. salts of mono-or bivalent copper with inorganic or organic acids or mono-or bivalent phenols, the oxides of mono- or bivalent copper, or complex compounds of copper salts with ammonia, amines, amides, lactams, cyanides or phosphines, preferably Cu - or Cu salts of hydrohalogen acids, of hydrocyanic acids or the copper salts of aliphatic carboxylic acids, particularly preferably CuCl, CuBr, CuI, CuCN and Cu 2 O, CuCl 2, CuSO 4, CuO, copper acetate or copper stearate, b) stabilisers based on secondary aromatic amines, c) stabilisers based on sterically hindered phenols d) phosphites and phosphonites and also e) mixtures hereof. a) compounds of mono- or bivalent copper, e.g. salts of mono-or bivalent copper with inorganic or organic acids or mono-or bivalent phenols, the oxides of mono- or bivalent copper, or complex compounds of copper salts with ammonia, amines, amides, lactams, cyanides or phosphines, preferably Cu - or Cu salts of hydrohalogen acids, of hydrocyanic acids or the copper salts of aliphatic carboxylic acids, particularly preferably CuCl, CuBr, CuI, CuCN and Cu 2 O, CuCl 2, CuSO 4, CuO, copper acetate or copper stearate, b) stabilisers based on secondary aromatic amines, c) stabilisers based on sterically hindered phenols d) phosphites and phosphonites and also e) mixtures hereof. 0 to 20.0% by weight of at least one additive, components to adding up to 100% by weight.