A superconducting current lead suitable for supplying current to a superconducting device, the superconducting current lead comprising: a plurality of electrode members (2, 3); a support rod that is arranged between the plurality of electrode members so as to connect the plurality of electrode members to each other; and a plurality of thin multi-layer rare-earth-based superconducting wires, each of which comprises a main surface and end portions which are connected to each of the plurality of electrode members, and each of the thin multi-layer rare-earth-based superconducting wires is arranged on an outer surface of the support rod and has a tape shape, wherein an angle θ is 40 - 60 degrees that is formed by each of the main surfaces adjacent to each other in a circumferential direction of the support rod on the outer surface of the support rod, wherein: a cross-section of the support rod comprises a multangular shape comprising three or more attachment surfaces on an outer circumferential of the support rod, and among the three or more attachment surfaces, each of the plurality of thin multi-layer rare-earth-based superconducting wires is arranged at two or more of the attachment surfaces; each of the plurality of thin multi-layer rare-earth-based superconducting wires comprises a laminated body in which a multi-layer structure in which an intermediate layer, an oxide superconducting layer, and a first stabilization layer are laminated on a base material, characterised by a second stabilization layer which covers an entire surface of the laminated body; the second stabilization layer consisting of copper; a thickness of the second stabilization layer being 20 μm or more and less than 80 μm; and a solder layer formed on one surface or both surfaces of the second stabilization layer. a plurality of electrode members (2, 3); a support rod that is arranged between the plurality of electrode members so as to connect the plurality of electrode members to each other; and a plurality of thin multi-layer rare-earth-based superconducting wires, each of which comprises a main surface and end portions which are connected to each of the plurality of electrode members, and each of the thin multi-layer rare-earth-based superconducting wires is arranged on an outer surface of the support rod and has a tape shape, wherein an angle θ is 40 - 60 degrees that is formed by each of the main surfaces adjacent to each other in a circumferential direction of the support rod on the outer surface of the support rod, wherein: a cross-section of the support rod comprises a multangular shape comprising three or more attachment surfaces on an outer circumferential of the support rod, and among the three or more attachment surfaces, each of the plurality of thin multi-layer rare-earth-based superconducting wires is arranged at two or more of the attachment surfaces; each of the plurality of thin multi-layer rare-earth-based superconducting wires comprises a laminated body in which a multi-layer structure in which an intermediate layer, an oxide superconducting layer, and a first stabilization layer are laminated on a base material, characterised by a second stabilization layer which covers an entire surface of the laminated body; the second stabilization layer consisting of copper; a thickness of the second stabilization layer being 20 μm or more and less than 80 μm; and a solder layer formed on one surface or both surfaces of the second stabilization layer. a cross-section of the support rod comprises a multangular shape comprising three or more attachment surfaces on an outer circumferential of the support rod, and among the three or more attachment surfaces, each of the plurality of thin multi-layer rare-earth-based superconducting wires is arranged at two or more of the attachment surfaces; each of the plurality of thin multi-layer rare-earth-based superconducting wires comprises a laminated body in which a multi-layer structure in which an intermediate layer, an oxide superconducting layer, and a first stabilization layer are laminated on a base material, characterised by a second stabilization layer which covers an entire surface of the laminated body; the second stabilization layer consisting of copper; a thickness of the second stabilization layer being 20 μm or more and less than 80 μm; and a solder layer formed on one surface or both surfaces of the second stabilization layer.