A dual compartment semiconductor package (200, 300) comprising: a conductive clip (216, 316) having first (222, 324) and second (228, 330) compartments; said first compartment electrically and mechanically connected to a top surface of a first die (202, 302); said second compartment (228, 330) electrically and mechanically connected to a top surface of a second die (204, 304); a groove (240, 340) formed between said first and second compartments, said groove preventing contact between said first and second dies; said dual compartment package electrically connecting said top surface of said first die to said top surface of said second die, wherein said first compartment is defined by a first wall (226a, 326a) and a second wall (226b, 326b) extending from opposing ends of a first web (224, 324) and said second compartment is defined by a third wall (232a, 332a) and a fourth wall (232b, 332b) extending from opposing ends of a second web (230, 330); a first extension portion (234a, 334a) connects and laterally separates a first contact portion (236a, 336a) and the first wall and a second extension portion (234d, 334d) connects and laterally separates a second contact portion (236c, 336c) and the fourth wall, and said groove comprises a trench defined by a third contact portion (236b, 336b), a third extension portion (234b, 334b) that connects and laterally separates the second wall of the first compartment and the third contact portion and a fourth extension portion (234c, 334c) that connects and laterally separates the third wall of the second compartment and the third contact portion, the third contact portion being under said groove, wherein bottom surfaces of the first (236a, 336a) and second (236c, 336c) and third (236b, 336b) contact portions are coplanar with one another. a conductive clip (216, 316) having first (222, 324) and second (228, 330) compartments; said first compartment electrically and mechanically connected to a top surface of a first die (202, 302); said second compartment (228, 330) electrically and mechanically connected to a top surface of a second die (204, 304); a groove (240, 340) formed between said first and second compartments, said groove preventing contact between said first and second dies; said dual compartment package electrically connecting said top surface of said first die to said top surface of said second die, wherein said first compartment is defined by a first wall (226a, 326a) and a second wall (226b, 326b) extending from opposing ends of a first web (224, 324) and said second compartment is defined by a third wall (232a, 332a) and a fourth wall (232b, 332b) extending from opposing ends of a second web (230, 330); a first extension portion (234a, 334a) connects and laterally separates a first contact portion (236a, 336a) and the first wall and a second extension portion (234d, 334d) connects and laterally separates a second contact portion (236c, 336c) and the fourth wall, and said groove comprises a trench defined by a third contact portion (236b, 336b), a third extension portion (234b, 334b) that connects and laterally separates the second wall of the first compartment and the third contact portion and a fourth extension portion (234c, 334c) that connects and laterally separates the third wall of the second compartment and the third contact portion, the third contact portion being under said groove, wherein bottom surfaces of the first (236a, 336a) and second (236c, 336c) and third (236b, 336b) contact portions are coplanar with one another.