An exterior jacket component (10, 110, 210) for a product (1, 101, 201), the exterior jacket component (10, 110, 210) comprising: a molded resin element (11, 211) wherein a surface of the molded resin element (11, 211) contains a first surface that serves as an outer surface of the exterior jacket component (10, 110, 210); and the exterior jacket component (10, 110, 210) further includes: an IC chip embedded in the molded resin element (11, 211) and configured to store identification data identifying the product (1, 101, 201); and antenna wiring formed on the first surface and configured to allow the IC chip to perform wireless communication; characterized by an IC-side antenna connected to the IC chip; and the IC chip and IC-side antenna are integrally configured into an IC module; the IC module is embedded in the molded resin element (11, 211); and the antenna wiring is configured as a booster antenna for electromagnetic coupling with the IC-side antenna; wherein the surface of the molded resin element (11, 211) includes a second surface that is an inner surface of the exterior jacket component (10, 110, 210); the second surface is the reverse side of the first surface; and the IC module is embedded in the molded resin element (11, 211) so that the IC module is exposed from the second surface; and the antenna wiring is formed on the first surface to face the IC module. a molded resin element (11, 211) wherein a surface of the molded resin element (11, 211) contains a first surface that serves as an outer surface of the exterior jacket component (10, 110, 210); and the exterior jacket component (10, 110, 210) further includes: an IC chip embedded in the molded resin element (11, 211) and configured to store identification data identifying the product (1, 101, 201); and antenna wiring formed on the first surface and configured to allow the IC chip to perform wireless communication; characterized by an IC-side antenna connected to the IC chip; and the IC chip and IC-side antenna are integrally configured into an IC module; the IC module is embedded in the molded resin element (11, 211); and the antenna wiring is configured as a booster antenna for electromagnetic coupling with the IC-side antenna; wherein the surface of the molded resin element (11, 211) includes a second surface that is an inner surface of the exterior jacket component (10, 110, 210); the second surface is the reverse side of the first surface; and the IC module is embedded in the molded resin element (11, 211) so that the IC module is exposed from the second surface; and the antenna wiring is formed on the first surface to face the IC module. an IC chip embedded in the molded resin element (11, 211) and configured to store identification data identifying the product (1, 101, 201); and antenna wiring formed on the first surface and configured to allow the IC chip to perform wireless communication; characterized by an IC-side antenna connected to the IC chip; and the IC chip and IC-side antenna are integrally configured into an IC module; the IC module is embedded in the molded resin element (11, 211); and the antenna wiring is configured as a booster antenna for electromagnetic coupling with the IC-side antenna; wherein the surface of the molded resin element (11, 211) includes a second surface that is an inner surface of the exterior jacket component (10, 110, 210); the second surface is the reverse side of the first surface; and the IC module is embedded in the molded resin element (11, 211) so that the IC module is exposed from the second surface; and the antenna wiring is formed on the first surface to face the IC module.