A method for the collective manufacture of electronic modules CMS according to the following steps: - manufacturing a wafer, which comprises the following sub-steps: i. assembling, on the face of a provisional support called upper face, electronic units (23, 24), an electronic unit comprising an active component connected to a support, said assembly being encapsulated and provided with external outputs, said external outputs facing said upper face; ii. depositing a layer of resin on the upper face in order to mould the electronic units (23, 24) and thus obtain a wafer; iii. withdrawing the provisional support; iv. dressing or etching, by means of a plasma, the lower face of the wafer opposite the upper face, so as to reveal the external outputs; v. depositing the non-oxidising metal or alloy only on said external outputs by masking or depositing the metal or alloy on said surface provided with the external outputs and withdrawing the metal or alloy out of the external outputs by chemical etching or by laser or by sand blasting, - manufacturing a printed circuit provided with pads made of non-oxidising metal or alloy; - cutting the wafer according to predetermined patterns that allow reconfigured moulded components to be obtained, each reconfigured moulded component comprising at least one electronic unit; - assembling the reconfigured moulded components on the printed circuit, the metallised external outputs of the reconfigured moulded components being arranged opposite the metallised pads of the printed circuit; and - connecting, without adding solder to said external outputs, to the metallised pads of the printed circuit by means of a material based on electrically conductive glue or ink. - manufacturing a wafer, which comprises the following sub-steps: i. assembling, on the face of a provisional support called upper face, electronic units (23, 24), an electronic unit comprising an active component connected to a support, said assembly being encapsulated and provided with external outputs, said external outputs facing said upper face; ii. depositing a layer of resin on the upper face in order to mould the electronic units (23, 24) and thus obtain a wafer; iii. withdrawing the provisional support; iv. dressing or etching, by means of a plasma, the lower face of the wafer opposite the upper face, so as to reveal the external outputs; v. depositing the non-oxidising metal or alloy only on said external outputs by masking or depositing the metal or alloy on said surface provided with the external outputs and withdrawing the metal or alloy out of the external outputs by chemical etching or by laser or by sand blasting, i. assembling, on the face of a provisional support called upper face, electronic units (23, 24), an electronic unit comprising an active component connected to a support, said assembly being encapsulated and provided with external outputs, said external outputs facing said upper face; ii. depositing a layer of resin on the upper face in order to mould the electronic units (23, 24) and thus obtain a wafer; iii. withdrawing the provisional support; iv. dressing or etching, by means of a plasma, the lower face of the wafer opposite the upper face, so as to reveal the external outputs; v. depositing the non-oxidising metal or alloy only on said external outputs by masking or depositing the metal or alloy on said surface provided with the external outputs and withdrawing the metal or alloy out of the external outputs by chemical etching or by laser or by sand blasting, - manufacturing a printed circuit provided with pads made of non-oxidising metal or alloy; - cutting the wafer according to predetermined patterns that allow reconfigured moulded components to be obtained, each reconfigured moulded component comprising at least one electronic unit; - assembling the reconfigured moulded components on the printed circuit, the metallised external outputs of the reconfigured moulded components being arranged opposite the metallised pads of the printed circuit; and - connecting, without adding solder to said external outputs, to the metallised pads of the printed circuit by means of a material based on electrically conductive glue or ink.