An apparatus for performing well logging in a borehole intersecting an earth formation, the apparatus comprising: a carrier conveyable in the borehole; a tool disposed on the carrier characterized in that the tool comprises: a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; at least two circuit elements selected from circuit elements comprising: i) a terminal of a Gold (Au) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a AuSn solder join; ii) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a high melting point Sn/Ag based solder join; iii) a terminal of a Tin (Sn) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a HMP Sn/Ag based solder join; iv) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a sintered Ag join. a carrier conveyable in the borehole; a tool disposed on the carrier characterized in that the tool comprises: a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; at least two circuit elements selected from circuit elements comprising: i) a terminal of a Gold (Au) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a AuSn solder join; ii) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a high melting point Sn/Ag based solder join; iii) a terminal of a Tin (Sn) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a HMP Sn/Ag based solder join; iv) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a sintered Ag join. a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; at least two circuit elements selected from circuit elements comprising: i) a terminal of a Gold (Au) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a AuSn solder join; ii) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a high melting point Sn/Ag based solder join; iii) a terminal of a Tin (Sn) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a HMP Sn/Ag based solder join; iv) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a sintered Ag join.