A fingerprint recognition system, comprising: a touch detection module, a control module and a fingerprint sensor; wherein the fingerprint sensor comprises: a sensor die, comprising a detection electrode, which is configured to collect fingerprint information; and a package structure, configured to package the sensor die; wherein the package structure comprises a first metal electrode (12, 21, 46), the first metal electrode (12, 21, 46) is connected with the touch detection module, and the touch detection module is connected with the control module and is configured to feed back a touch signal to the control module, so as to enable the control module to supply power to the fingerprint sensor according to the touch signal, and then enable the sensor die to collect fingerprint information; wherein the package structure further comprises a plastic packaging material and a substrate, wherein the plastic packaging material is located above or covers the sensor die; and the sensor die is located on the substrate, a second metal electrode, wherein the second metal electrode is located at a periphery of the first metal electrode (12, 21, 46); and the second metal electrode is connected with a grounding end of the fingerprint sensor and located in the substrate; wherein the first metal electrode (12, 21, 46) is located in the plastic packaging material; or the first metal electrode (12, 21, 46) is located in the substrate. a touch detection module, a control module and a fingerprint sensor; wherein the fingerprint sensor comprises: a sensor die, comprising a detection electrode, which is configured to collect fingerprint information; and a package structure, configured to package the sensor die; wherein the package structure comprises a first metal electrode (12, 21, 46), the first metal electrode (12, 21, 46) is connected with the touch detection module, and the touch detection module is connected with the control module and is configured to feed back a touch signal to the control module, so as to enable the control module to supply power to the fingerprint sensor according to the touch signal, and then enable the sensor die to collect fingerprint information; wherein the package structure further comprises a plastic packaging material and a substrate, wherein the plastic packaging material is located above or covers the sensor die; and the sensor die is located on the substrate, a second metal electrode, wherein the second metal electrode is located at a periphery of the first metal electrode (12, 21, 46); and the second metal electrode is connected with a grounding end of the fingerprint sensor and located in the substrate; a sensor die, comprising a detection electrode, which is configured to collect fingerprint information; and a package structure, configured to package the sensor die; wherein the package structure comprises a first metal electrode (12, 21, 46), the first metal electrode (12, 21, 46) is connected with the touch detection module, and the touch detection module is connected with the control module and is configured to feed back a touch signal to the control module, so as to enable the control module to supply power to the fingerprint sensor according to the touch signal, and then enable the sensor die to collect fingerprint information; wherein the package structure further comprises a plastic packaging material and a substrate, wherein the plastic packaging material is located above or covers the sensor die; and the sensor die is located on the substrate, a second metal electrode, wherein the second metal electrode is located at a periphery of the first metal electrode (12, 21, 46); and the second metal electrode is connected with a grounding end of the fingerprint sensor and located in the substrate; wherein the first metal electrode (12, 21, 46) is located in the plastic packaging material;