An electronic device comprising: a shell, having an accommodating space; and a contact member, arranged on the shell, wherein at least part of a surface of the contact member forms an outer surface of the electronic device; a temperature sensor, arranged in the accommodating space and having a positive electrode and a negative electrode; and a circuit board, arranged in the accommodating space, wherein the contact member and the temperature sensor are arranged on two opposite sides of the circuit board; characterized in that: the circuit board is provided with a positive wire and a negative wire, wherein the positive wire is connected to the positive electrode of the temperature sensor, the negative wire is connected to the negative electrode of the temperature sensor, at least one of the positive wire and the negative wire is thermally conductively connected to the contact member, and the temperature sensor is configured to perform temperature measurement according to a temperature transferred from the at least one of the positive wire and the negative wire; the circuit board comprises a multi-layer wire structure formed by a metal layer and insulating dielectric layers that are alternately arranged in sequence; the positive wire comprises a positive wire body and a first metallized via, the positive wire body is formed on the metal layer, the first metallized via extends through surfaces on the two opposite sides of the circuit board, and the positive wire body is electrically connected to the first metallized via; the negative wire comprises a negative wire body and a second metallized via, the negative wire body is formed on the metal layer, the second metallized via extends through the surfaces on the two opposite sides of the circuit board, and the negative wire body is electrically connected to the second metallized via; and at least one of the first metallized via and the second metallized via is thermally conductively connected to the contact member. a shell, having an accommodating space; and a contact member, arranged on the shell, wherein at least part of a surface of the contact member forms an outer surface of the electronic device; a temperature sensor, arranged in the accommodating space and having a positive electrode and a negative electrode; and a circuit board, arranged in the accommodating space, wherein the contact member and the temperature sensor are arranged on two opposite sides of the circuit board; characterized in that: the circuit board is provided with a positive wire and a negative wire, wherein the positive wire is connected to the positive electrode of the temperature sensor, the negative wire is connected to the negative electrode of the temperature sensor, at least one of the positive wire and the negative wire is thermally conductively connected to the contact member, and the temperature sensor is configured to perform temperature measurement according to a temperature transferred from the at least one of the positive wire and the negative wire; wherein the contact member and the temperature sensor are arranged on two opposite sides of the circuit board; characterized in that: the circuit board is provided with a positive wire and a negative wire, wherein the positive wire is connected to the positive electrode of the temperature sensor, the negative wire is connected to the negative electrode of the temperature sensor, at least one of the positive wire and the negative wire is thermally conductively connected to the contact member, and the temperature sensor is configured to perform temperature measurement according to a temperature transferred from the at least one of the positive wire and the negative wire; the circuit board comprises a multi-layer wire structure formed by a metal layer and insulating dielectric layers that are alternately arranged in sequence; the positive wire comprises a positive wire body and a first metallized via, the positive wire body is formed on the metal layer, the first metallized via extends through surfaces on the two opposite sides of the circuit board, and the positive wire body is electrically connected to the first metallized via; the negative wire comprises a negative wire body and a second metallized via, the negative wire body is formed on the metal layer, the second metallized via extends through the surfaces on the two opposite sides of the circuit board, and the negative wire body is electrically connected to the second metallized via; and at least one of the first metallized via and the second metallized via is thermally conductively connected to the contact member.