An air-cooling heat dissipation device (2, 2a) for removing heat from an electronic component, the air-cooling heat dissipation device (2, 2a) comprising: a main body comprising a top surface, a bottom surface, a first lateral wall, a second lateral wall, a first airflow-guiding chamber, a second airflow-guiding chamber, an introduction opening, plural communication grooves and plural airflow-exiting grooves, wherein the first lateral wall and the second lateral wall are connected between the top surface and the bottom surface, the first airflow-guiding chamber and the second airflow-guiding chamber are arranged between the first lateral wall and the second lateral wall, the introduction opening is formed in the top surface, the first airflow-guiding chamber runs through the bottom surface and is in communication with the introduction opening, the plural airflow-exiting grooves are formed in one of the first lateral wall and the second lateral wall and in communication with the second airflow-guiding chamber, and the electronic component is accommodated within the second airflow-guiding chamber; an air pump disposed on the main body and sealing the edge of the introduction opening, wherein when the air pump is enabled, an ambient air is introduced into the first airflow-guiding chamber through the introduction opening and transferred to the second airflow-guiding chamber through the plural communication grooves so as to remove the heat from the electronic component, after which the air heated by the electronic component is discharged through the plural airflow-exiting grooves; wherein the air-cooling heat dissipation device (2, 2a) is characterized in: the main body is a plate structure; the first airflow-guiding chamber is formed in the plate structure; the second airflow-guiding chamber is concavely formed in the bottom surface of the plate structure; the depths of the plural communication grooves are smaller than the depth of the first airflow-guiding chamber and the depth of the second airflow-guiding chamber; the first airflow-guiding chamber and the second airflow-guiding chamber are separated from each other by a separation wall and in communication with each other through the plural communication grooves formed in the separation wall. a main body comprising a top surface, a bottom surface, a first lateral wall, a second lateral wall, a first airflow-guiding chamber, a second airflow-guiding chamber, an introduction opening, plural communication grooves and plural airflow-exiting grooves, wherein the first lateral wall and the second lateral wall are connected between the top surface and the bottom surface, the first airflow-guiding chamber and the second airflow-guiding chamber are arranged between the first lateral wall and the second lateral wall, the introduction opening is formed in the top surface, the first airflow-guiding chamber runs through the bottom surface and is in communication with the introduction opening, the plural airflow-exiting grooves are formed in one of the first lateral wall and the second lateral wall and in communication with the second airflow-guiding chamber, and the electronic component is accommodated within the second airflow-guiding chamber; an air pump disposed on the main body and sealing the edge of the introduction opening, wherein when the air pump is enabled, an ambient air is introduced into the first airflow-guiding chamber through the introduction opening and transferred to the second airflow-guiding chamber through the plural communication grooves so as to remove the heat from the electronic component, after which the air heated by the electronic component is discharged through the plural airflow-exiting grooves; wherein the air-cooling heat dissipation device (2, 2a) is characterized in: the main body is a plate structure; the first airflow-guiding chamber is formed in the plate structure; the second airflow-guiding chamber is concavely formed in the bottom surface of the plate structure; the depths of the plural communication grooves are smaller than the depth of the first airflow-guiding chamber and the depth of the second airflow-guiding chamber; the first airflow-guiding chamber and the second airflow-guiding chamber are separated from each other by a separation wall and in communication with each other through the plural communication grooves formed in the separation wall. the main body is a plate structure; the first airflow-guiding chamber is formed in the plate structure; the second airflow-guiding chamber is concavely formed in the bottom surface of the plate structure; the depths of the plural communication grooves are smaller than the depth of the first airflow-guiding chamber and the depth of the second airflow-guiding chamber; the first airflow-guiding chamber and the second airflow-guiding chamber are separated from each other by a separation wall and in communication with each other through the plural communication grooves formed in the separation wall.