A semiconductor package (100, 200, 300, 400), comprising: a package substrate (110, 210, 310, 410) including a die side (111, 211, 311, 411) and a land side (109, 309, 409); a ring-in-ring stiffener comprising an inner ring stiffener (112, 212, 312, 412) and a subsequent ring stiffener (114, 214, 314, 414) disposed outside the inner ring stiffener (112, 212, 312, 412), wherein each ring stiffener (112, 114, 212, 214, 312, 314, 412, 414) is affixed to the die side (111, 211, 311, 411) by an electrically conductive adhesive (146, 148, 346, 348, 446, 448) which is electrically coupled to an electrical routing (152, 154, 252, 254, 352, 354, 452, 454) within the package substrate (110, 210, 310, 410), wherein each ring stiffener (112, 114, 212, 214, 312, 314, 412, 414) is a metal ring stiffener wherein a ledge is formed in each of the inner ring stiffener and the subsequent ring stiffener, the ledges of the inner ring stiffener and the subsequent ring stiffener opposing each other to form a passive-device seat upon which a first passive device (120, 220, 320, 420) is seated, the first passive device (120, 220, 320, 420) electrically contacting electrical connections (140, 240, 142, 242, 340, 342, 440, 442) formed at the passive device seat of the inner ring stiffener and the subsequent ring stiffener, wherein the electrical connections (140, 142, 240, 242, 340, 342, 440, 442) are formed between the passive device and the ring stiffeners (112, 114, 212, 214, 312, 314, 412, 414), wherein the subsequent ring stiffener (114, 214, 314, 414) is electrically coupled to electrical routing (152, 252, 352, 452) in the package substrate (110, 210, 310, 410) associated with ground (Vss), and the inner ring stiffener (112, 212, 312, 412) is electrically coupled to electrical routing (154, 254, 354, 454) in the package substrate (110, 210, 310, 410) associated with a power connection (Vcc). a package substrate (110, 210, 310, 410) including a die side (111, 211, 311, 411) and a land side (109, 309, 409); a ring-in-ring stiffener comprising an inner ring stiffener (112, 212, 312, 412) and a subsequent ring stiffener (114, 214, 314, 414) disposed outside the inner ring stiffener (112, 212, 312, 412), wherein each ring stiffener (112, 114, 212, 214, 312, 314, 412, 414) is affixed to the die side (111, 211, 311, 411) by an electrically conductive adhesive (146, 148, 346, 348, 446, 448) which is electrically coupled to an electrical routing (152, 154, 252, 254, 352, 354, 452, 454) within the package substrate (110, 210, 310, 410), wherein each ring stiffener (112, 114, 212, 214, 312, 314, 412, 414) is a metal ring stiffener wherein a ledge is formed in each of the inner ring stiffener and the subsequent ring stiffener, the ledges of the inner ring stiffener and the subsequent ring stiffener opposing each other to form a passive-device seat upon which a first passive device (120, 220, 320, 420) is seated, the first passive device (120, 220, 320, 420) electrically contacting electrical connections (140, 240, 142, 242, 340, 342, 440, 442) formed at the passive device seat of the inner ring stiffener and the subsequent ring stiffener, wherein the electrical connections (140, 142, 240, 242, 340, 342, 440, 442) are formed between the passive device and the ring stiffeners (112, 114, 212, 214, 312, 314, 412, 414), wherein the subsequent ring stiffener (114, 214, 314, 414) is electrically coupled to electrical routing (152, 252, 352, 452) in the package substrate (110, 210, 310, 410) associated with ground (Vss), and the inner ring stiffener (112, 212, 312, 412) is electrically coupled to electrical routing (154, 254, 354, 454) in the package substrate (110, 210, 310, 410) associated with a power connection (Vcc).