Method for producing a cooling arrangement for an electronic circuit arrangement comprising heat-generating power semiconductors which are pressed against a cooling body by means of at least one spring element, the method containing the following method steps in this order: a) providing a multilayer printed circuit board of the electronic circuit arrangement; b) machining the printed circuit board - removing printed circuit board regions around at least one printed circuit board piece and forming webs which connect a portion of the printed circuit board and the at least one printed circuit board piece; and - forming a flexible connecting region between the at least one printed circuit board piece and a portion of the printed circuit board by milling out a region of the printed circuit board, leading to the exposure of a film of the printed circuit board on which electrical conductor tracks are provided, which electrical conductor tracks electrically connect the at least one printed circuit board piece and a portion of the printed circuit board located around the webs, the connecting region and the at least one printed circuit board piece; c1) equipping the printed circuit board piece with power semiconductors if only one printed circuit board piece is created in step b), or c2) equipping each printed circuit board piece with a power semiconductor if a plurality of printed circuit board pieces are created in step b); d) breaking out the webs; e) providing a cooling body and at least one spring element, the cooling body and the at least one spring element being arranged in such a way that the at least one printed circuit board piece is pressed by means of the at least one spring element, the power semiconductors being pressed against the cooling body. a) providing a multilayer printed circuit board of the electronic circuit arrangement; b) machining the printed circuit board - removing printed circuit board regions around at least one printed circuit board piece and forming webs which connect a portion of the printed circuit board and the at least one printed circuit board piece; and - forming a flexible connecting region between the at least one printed circuit board piece and a portion of the printed circuit board by milling out a region of the printed circuit board, leading to the exposure of a film of the printed circuit board on which electrical conductor tracks are provided, which electrical conductor tracks electrically connect the at least one printed circuit board piece and a portion of the printed circuit board located around the webs, the connecting region and the at least one printed circuit board piece; - removing printed circuit board regions around at least one printed circuit board piece and forming webs which connect a portion of the printed circuit board and the at least one printed circuit board piece; and - forming a flexible connecting region between the at least one printed circuit board piece and a portion of the printed circuit board by milling out a region of the printed circuit board, leading to the exposure of a film of the printed circuit board on which electrical conductor tracks are provided, which electrical conductor tracks electrically connect the at least one printed circuit board piece and a portion of the printed circuit board located around the webs, the connecting region and the at least one printed circuit board piece; c1) equipping the printed circuit board piece with power semiconductors if only one printed circuit board piece is created in step b), or c2) equipping each printed circuit board piece with a power semiconductor if a plurality of printed circuit board pieces are created in step b); d) breaking out the webs; e) providing a cooling body and at least one spring element, the cooling body and the at least one spring element being arranged in such a way that the at least one printed circuit board piece is pressed by means of the at least one spring element, the power semiconductors being pressed against the cooling body.