An endoscope apparatus comprising: an insertion portion configured to be inserted into a body; an optical member as an observation window arranged exposed from an outside surface at a distal end of the insertion portion; an objective optical system (32, 35) configured to condense photographing light impinged from the optical member; an electronic image pickup circuit including a plurality of solid image pickup devices (42, 45) and a plurality of electronic image processing circuits (43, 46), the plurality of solid image pickup devices (42, 45) being configured to detect the photographing light condensed by the objective optical system (32, 35), the plurality of electronic image processing circuits (43, 46) being configured to photoelectrically convert the photographing light detected by the plurality of solid image pickup devices (42, 45); a flexible film member disposed in the insertion portion and formed by an insulating, flexible member; a heat absorbing section (53, 54, 55) constituting one end part of the flexible film member and having a first metal pattern (63, 64, 65) formed thereon, the first metal pattern (63, 64, 65) being arranged in the vicinity of the plurality of solid image pickup devices (42, 45) and the electronic image pickup circuit and configured for absorbing heat generated from the plurality of solid image pickup devices (42, 45) and the electronic image pickup circuit; a heat radiation section constituting the other end part of the flexible film member and having a second metal pattern formed thereon, the second metal pattern being adhered to the optical member in surface contact therewith at a position on a rear surface of the optical member which is opposite to an exposed surface of the optical member, and the second metal pattern being configured for radiating heat transferred from the heat absorbing section (53, 54, 55) to the optical member; and a heat transfer section provided to connect the heat absorbing section (53, 54, 55) and the heat radiation section in the flexible film member and having a third metal pattern formed thereon and adapted to be thermally insulated, the third metal pattern connecting the first metal pattern (63, 64, 64) of the heat absorbing section (53, 54, 55) and the second metal pattern of the heat radiation section to be capable of heat transfer, wherein the heat absorbing section (53, 54, 55) is provided to extend from one side of the heat transfer section, has a plurality of creases formed along a longitudinal direction of the flexible film member and is arranged to cover perimeters of the plurality of solid image pickup devices (42, 45) and the plurality of electronic image processing circuits (43, 46). an insertion portion configured to be inserted into a body; an optical member as an observation window arranged exposed from an outside surface at a distal end of the insertion portion; an objective optical system (32, 35) configured to condense photographing light impinged from the optical member; an electronic image pickup circuit including a plurality of solid image pickup devices (42, 45) and a plurality of electronic image processing circuits (43, 46), the plurality of solid image pickup devices (42, 45) being configured to detect the photographing light condensed by the objective optical system (32, 35), the plurality of electronic image processing circuits (43, 46) being configured to photoelectrically convert the photographing light detected by the plurality of solid image pickup devices (42, 45); a flexible film member disposed in the insertion portion and formed by an insulating, flexible member; a heat absorbing section (53, 54, 55) constituting one end part of the flexible film member and having a first metal pattern (63, 64, 65) formed thereon, the first metal pattern (63, 64, 65) being arranged in the vicinity of the plurality of solid image pickup devices (42, 45) and the electronic image pickup circuit and configured for absorbing heat generated from the plurality of solid image pickup devices (42, 45) and the electronic image pickup circuit; a heat radiation section constituting the other end part of the flexible film member and having a second metal pattern formed thereon, the second metal pattern being adhered to the optical member in surface contact therewith at a position on a rear surface of the optical member which is opposite to an exposed surface of the optical member, and the second metal pattern being configured for radiating heat transferred from the heat absorbing section (53, 54, 55) to the optical member; and a heat transfer section provided to connect the heat absorbing section (53, 54, 55) and the heat radiation section in the flexible film member and having a third metal pattern formed thereon and adapted to be thermally insulated, the third metal pattern connecting the first metal pattern (63, 64, 64) of the heat absorbing section (53, 54, 55) and the second metal pattern of the heat radiation section to be capable of heat transfer, wherein the heat absorbing section (53, 54, 55) is provided to extend from one side of the heat transfer section, has a plurality of creases formed along a longitudinal direction of the flexible film member and is arranged to cover perimeters of the plurality of solid image pickup devices (42, 45) and the plurality of electronic image processing circuits (43, 46).