An induction heating device, comprising: a case; a working coil disposed inside the case, the working coil comprising a conducting wire that is annularly wound; a base plate that is disposed vertically below the working coil, the base plate having an upper surface that supports the working coil; an indicator substrate support that is coupled to the case and that is disposed vertically below the base plate; an indicator substrate that is disposed on an upper surface of the indicator substrate support, that is disposed vertically below the base plate, and that is spaced apart from the base plate, characterised by an inverter substrate (IV_PCB) disposed at a lower surface of the indicator substrate support, the inverter substrate (IV_PCB) comprising an inverter configured to apply a resonance current to the working coil through a switching operation; and a resonance substrate (R_PCB) that is disposed at the lower surface of the indicator substrate support and that is connected to the working coil, the resonance substrate (R_PCB) comprising a resonance capacitor configured to generate the resonance current based on the switching operation of the inverter, wherein the base plate defines a plate hole at a position corresponding to an annular inner side of the working coil, the indicator substrate defines a substrate hole at a position corresponding to the plate hole, and the indicator substrate support defines a support hole at a position corresponding to the substrate hole, wherein the plate hole, the substrate hole, and the support hole are arranged along a height direction of the case, and wherein the working coil comprises: a common terminal (WCT_C) connected to a connector; and an individual terminal (WCT_P) connected to the resonance capacitor through the plate hole, the substrate hole, and the support hole. a case; a working coil disposed inside the case, the working coil comprising a conducting wire that is annularly wound; a base plate that is disposed vertically below the working coil, the base plate having an upper surface that supports the working coil; an indicator substrate support that is coupled to the case and that is disposed vertically below the base plate; an indicator substrate that is disposed on an upper surface of the indicator substrate support, that is disposed vertically below the base plate, and that is spaced apart from the base plate, characterised by an inverter substrate (IV_PCB) disposed at a lower surface of the indicator substrate support, the inverter substrate (IV_PCB) comprising an inverter configured to apply a resonance current to the working coil through a switching operation; and a resonance substrate (R_PCB) that is disposed at the lower surface of the indicator substrate support and that is connected to the working coil, the resonance substrate (R_PCB) comprising a resonance capacitor configured to generate the resonance current based on the switching operation of the inverter, wherein the base plate defines a plate hole at a position corresponding to an annular inner side of the working coil, the indicator substrate defines a substrate hole at a position corresponding to the plate hole, and the indicator substrate support defines a support hole at a position corresponding to the substrate hole, wherein the plate hole, the substrate hole, and the support hole are arranged along a height direction of the case, and wherein the working coil comprises: a common terminal (WCT_C) connected to a connector; and an individual terminal (WCT_P) connected to the resonance capacitor through the plate hole, the substrate hole, and the support hole. a common terminal (WCT_C) connected to a connector; and an individual terminal (WCT_P) connected to the resonance capacitor through the plate hole, the substrate hole, and the support hole.