An apparatus, comprising; an electronic controller having a memory device; an extruding device in communication with the electronic controller, said extruding device having a dispensing head configured to selectively dispense a dielectric material though an orifice in the dispensing head in accordance with a command from the electronic controller; a wire feed device in communication with the electronic controller, said wire feed device connected to the extruding device and configured to selectively feed a conductive wire through the orifice in accordance with a command from the electronic controller; a cutting device in communication with the electronic controller, said cutting device connected to the extruding device and configured to selectively sever the conductive wire after it is fed through the orifice in accordance with a command from the electronic controller; and an electromechanical device in communication with the electronic controller, said electromechanical device connected to the extruding device and configured to move the extruding device, the wire feed device, and the cutting device within a 3D space in accordance with a command from the electronic controller, wherein the memory device contains instructions that cause the electronic controller to transmit the command to the extruding device to selectively dispense the dielectric material though the orifice, wherein the memory device contains instructions that cause the electronic controller to transmit the command to the wire feed device to selectively feed the conductive wire through the orifice, and wherein the memory device contains instructions that cause the electronic controller to transmit the command to the cutting device to selectively sever the conductive wire, thereby forming a dielectric substrate encasing a plurality of electrically conductive wires, wherein the memory device further contains instructions that cause the electronic controller to transmit the command to the extruding device to form a location feature in the substrate and an opening defined in the substrate, characterized in that the opening is located with a positional tolerance less than or equal to 1 mm relative to the location feature, the opening having the plurality of electrically conductive wires exposed within. an electronic controller having a memory device; an extruding device in communication with the electronic controller, said extruding device having a dispensing head configured to selectively dispense a dielectric material though an orifice in the dispensing head in accordance with a command from the electronic controller; a wire feed device in communication with the electronic controller, said wire feed device connected to the extruding device and configured to selectively feed a conductive wire through the orifice in accordance with a command from the electronic controller; a cutting device in communication with the electronic controller, said cutting device connected to the extruding device and configured to selectively sever the conductive wire after it is fed through the orifice in accordance with a command from the electronic controller; and an electromechanical device in communication with the electronic controller, said electromechanical device connected to the extruding device and configured to move the extruding device, the wire feed device, and the cutting device within a 3D space in accordance with a command from the electronic controller, wherein the memory device contains instructions that cause the electronic controller to transmit the command to the extruding device to selectively dispense the dielectric material though the orifice, wherein the memory device contains instructions that cause the electronic controller to transmit the command to the wire feed device to selectively feed the conductive wire through the orifice, and wherein the memory device contains instructions that cause the electronic controller to transmit the command to the cutting device to selectively sever the conductive wire, thereby forming a dielectric substrate encasing a plurality of electrically conductive wires, wherein the memory device further contains instructions that cause the electronic controller to transmit the command to the extruding device to form a location feature in the substrate and an opening defined in the substrate, characterized in that the opening is located with a positional tolerance less than or equal to 1 mm relative to the location feature, the opening having the plurality of electrically conductive wires exposed within.