A light-mixing LED package structure for increasing color render index and brightness, comprising: a substrate unit having at least one substrate body; a light-emitting unit having at least one first light-emitting module for generating light of a first color temperature and at least one second light-emitting module for generating light of a second color temperature different from the first color temperature, wherein the at least one first light-emitting module has a plurality of first light-emitting chips electrically disposed on the substrate unit, and the at least one second light-emitting module has a plurality of second light-emitting chips electrically disposed on the substrate unit; a frame unit having at least one first annular resin frame and at least one second annular resin frame surroundingly formed on a top surface of the substrate unit, wherein the at least one first annular resin frame surrounds the at least one first light-emitting module in order to form at least one first resin position limiting space above a substrate body of the substrate unit and surrounded by the at least one first annular resin frame, and the at least one second annular resin frame surrounds the at least one second light-emitting module and the at least one first annular resin frame in order to form at least one second resin position limiting space above the substrate body and between the at least one first annular resin frame and the at least one second annular resin frame; and a package unit having at least one first translucent package resin body and at least one second translucent package resin body both disposed on the substrate body and respectively covering the at least one first light-emitting module and the at least one second light-emitting module, wherein the at least one first translucent package resin body is limited in the at least one first resin position limiting space, and the at least one second translucent package resin body is limited in the at least one second resin position limiting space. a substrate unit having at least one substrate body; a light-emitting unit having at least one first light-emitting module for generating light of a first color temperature and at least one second light-emitting module for generating light of a second color temperature different from the first color temperature, wherein the at least one first light-emitting module has a plurality of first light-emitting chips electrically disposed on the substrate unit, and the at least one second light-emitting module has a plurality of second light-emitting chips electrically disposed on the substrate unit; a frame unit having at least one first annular resin frame and at least one second annular resin frame surroundingly formed on a top surface of the substrate unit, wherein the at least one first annular resin frame surrounds the at least one first light-emitting module in order to form at least one first resin position limiting space above a substrate body of the substrate unit and surrounded by the at least one first annular resin frame, and the at least one second annular resin frame surrounds the at least one second light-emitting module and the at least one first annular resin frame in order to form at least one second resin position limiting space above the substrate body and between the at least one first annular resin frame and the at least one second annular resin frame; and a package unit having at least one first translucent package resin body and at least one second translucent package resin body both disposed on the substrate body and respectively covering the at least one first light-emitting module and the at least one second light-emitting module, wherein the at least one first translucent package resin body is limited in the at least one first resin position limiting space, and the at least one second translucent package resin body is limited in the at least one second resin position limiting space.