Process for producing metal patterns on a substrate, comprising the essential following steps: A. optionally preparing the surface of the substrate intended to receive the metal patterns; B. depositing a temporary protection on the surface of the substrate corresponding to the negative of the patterns to be produced by means of a screen printing mask/stencil the cut-outs of which correspond to the negative of the patterns to be produced; and/or by direct printing, preferably by ink jet; C. optionally activating the surface of the substrate, in particular the areas corresponding to the patterns to be produced; D. metallization by depositing at least one metal on the areas corresponding to the patterns to be produced; E. eliminating the temporary protection of step B; F. optionally rinsing the surface of the substrate carrying the metal patterns; G. optionally drying the surface of the substrate carrying the metal patterns; H. optionally finishing treatment on the surface of the substrate carrying the metal patterns; • characterized in that step E of eliminating the temporary protection is carried out during step D, or at least partly during step D and after step D, or at least partly during and after the metallization step D and partly before the metallization step D, • in that step E essentially consists in the dissolution of the temporary protection by at least one solvent contained in at least one metallisation solution, said solvent being preferably alkaline and said temporary protection being preferably alkali-soluble so that it can be dissolved preferably by said solvent, • in that the metallic deposition D is a non-electrolytic metallization by spraying of one or more redox solutions in the form of (an) aerosol(s). • and in that it optionally comprises, before the metallization D, at least one of the following steps, preferably in the following order: I. treatment increasing the surface energy of the substrate, in the knowledge that in the event that the process comprises an activating step C, a step I of increasing the surface energy of the substrate can optionally be provided before the activation C. J. wetting the surface of the substrate; K. rinsing the surface of the substrate. A. optionally preparing the surface of the substrate intended to receive the metal patterns; B. depositing a temporary protection on the surface of the substrate corresponding to the negative of the patterns to be produced by means of a screen printing mask/stencil the cut-outs of which correspond to the negative of the patterns to be produced; and/or by direct printing, preferably by ink jet; C. optionally activating the surface of the substrate, in particular the areas corresponding to the patterns to be produced; D. metallization by depositing at least one metal on the areas corresponding to the patterns to be produced; E. eliminating the temporary protection of step B; F. optionally rinsing the surface of the substrate carrying the metal patterns; G. optionally drying the surface of the substrate carrying the metal patterns; H. optionally finishing treatment on the surface of the substrate carrying the metal patterns; • characterized in that step E of eliminating the temporary protection is carried out during step D, or at least partly during step D and after step D, or at least partly during and after the metallization step D and partly before the metallization step D, • in that step E essentially consists in the dissolution of the temporary protection by at least one solvent contained in at least one metallisation solution, said solvent being preferably alkaline and said temporary protection being preferably alkali-soluble so that it can be dissolved preferably by said solvent, • in that the metallic deposition D is a non-electrolytic metallization by spraying of one or more redox solutions in the form of (an) aerosol(s). • and in that it optionally comprises, before the metallization D, at least one of the following steps, preferably in the following order: I. treatment increasing the surface energy of the substrate, in the knowledge that in the event that the process comprises an activating step C, a step I of increasing the surface energy of the substrate can optionally be provided before the activation C. J. wetting the surface of the substrate; K. rinsing the surface of the substrate. I. treatment increasing the surface energy of the substrate, in the knowledge that in the event that the process comprises an activating step C, a step I of increasing the surface energy of the substrate can optionally be provided before the activation C. J. wetting the surface of the substrate; K. rinsing the surface of the substrate.