A process to connect, by soldering, at least one electronic component with a mounting plate, the mounting plate having at least one mounting plate contact surface, and the at least one electronic component having at least one component contact surface corresponding to the at least one mounting plate contact surface, the at least one mounting plate contact surface being surrounded by a solder resist layer that borders the at least one mounting plate contact surface, the process comprising: a) applying solder paste onto at least areas of the solder resist layer overlapping with the mounting plate contact surface adjacent to the solder resist layer, b) equipping the mounting plate with the at least one electronic component, the at least one component contact surface at least partly covering the mounting plate contact surface corresponding to the at least one component contact surface; and c) heating the solder paste to produce a soldered connection between the mounting plate and the at least one electronic component, characterized in that the mounting plate contact surface is essentially quadrilateral, in particular rectangular, in shape and the solder paste is applied to the solder resist layer along a long side or a transverse side of the mounting plate contact surface and minimally overlaps with the mounting plate contact surface, wherein the depth of the minimum overlap of the solder paste with the mounting plate contact surface along the long side of the mounting plate contact surface, when the solder paste is applied along the long side of the mounting plate contact surface, lies in a range of about 0.2-0.5 mm; and wherein the depth of the minimum overlap of the solder paste with the mounting plate contact surface along the transverse side of the mounting plate contact surface, when the solder paste is applied along the transverse side of the mounting plate contact surface, lies in a range of about 0.3-0.7 mm; wherein, starting from the minimum overlap, the depth of the overlap of the solder paste with the mounting plate contact surface increases in areas along the long side and the transverse side, respectively, and wherein the largest (maximum) overlap is reached at one end of the long side and the transverse side, respectively. a) applying solder paste onto at least areas of the solder resist layer overlapping with the mounting plate contact surface adjacent to the solder resist layer, b) equipping the mounting plate with the at least one electronic component, the at least one component contact surface at least partly covering the mounting plate contact surface corresponding to the at least one component contact surface; and c) heating the solder paste to produce a soldered connection between the mounting plate and the at least one electronic component, the mounting plate contact surface is essentially quadrilateral, in particular rectangular, in shape and the solder paste is applied to the solder resist layer along a long side or a transverse side of the mounting plate contact surface and minimally overlaps with the mounting plate contact surface, wherein the depth of the minimum overlap of the solder paste with the mounting plate contact surface along the long side of the mounting plate contact surface, when the solder paste is applied along the long side of the mounting plate contact surface, lies in a range of about 0.2-0.5 mm; and wherein the depth of the minimum overlap of the solder paste with the mounting plate contact surface along the transverse side of the mounting plate contact surface, when the solder paste is applied along the transverse side of the mounting plate contact surface, lies in a range of about 0.3-0.7 mm; wherein, starting from the minimum overlap, the depth of the overlap of the solder paste with the mounting plate contact surface increases in areas along the long side and the transverse side, respectively, and wherein the largest (maximum) overlap is reached at one end of the long side and the transverse side, respectively.