A method of manufacturing a display device, comprising steps of: S1: providing a substrate, and sequentially forming an array circuit, an anode layer and a light-emitting layer on the substrate; S2: forming a first cathode layer upon the light-emitting layer with cathode material processed by evaporation coating; S3: forming a mounting hole in a non-display area by etching; S4: using a mask assembly to shield the area where the mounting hole is located, and forming a second cathode layer with cathode material processed by evaporation coating; wherein the second cathode layer covers both a transitional-display area and a display area, and the first cathode layer produced in the step S2 and the second cathode layer produced in the step S4 together constitute a cathode layer of the display device, wherein the mask assembly used in the step S4 comprises: a mask frame, having an open area, said mask frame being supported on a surface of the substrate during evaporation coating in the step S4; a plurality of island shelters, located in the open area, said plurality of island shelters being in contact with the surface of the substrate during evaporation coating in the step S4; and at least one connection bridge, spaced apart from and suspended above the surface of the substrate to form a gap between the connection bridge and the surface of the substrate during evaporation coating in the step S4, wherein at least one of the island shelters is connected to the mask frame or a neighboring island shelter via the connection bridge, and the connection bridge of the mask assembly used in step S4 has a thickness smaller than that of the island shelter. S1: providing a substrate, and sequentially forming an array circuit, an anode layer and a light-emitting layer on the substrate; S2: forming a first cathode layer upon the light-emitting layer with cathode material processed by evaporation coating; S3: forming a mounting hole in a non-display area by etching; S4: using a mask assembly to shield the area where the mounting hole is located, and forming a second cathode layer with cathode material processed by evaporation coating; wherein the second cathode layer covers both a transitional-display area and a display area, and the first cathode layer produced in the step S2 and the second cathode layer produced in the step S4 together constitute a cathode layer of the display device, wherein the mask assembly used in the step S4 comprises: a mask frame, having an open area, said mask frame being supported on a surface of the substrate during evaporation coating in the step S4; a plurality of island shelters, located in the open area, said plurality of island shelters being in contact with the surface of the substrate during evaporation coating in the step S4; and at least one connection bridge, spaced apart from and suspended above the surface of the substrate to form a gap between the connection bridge and the surface of the substrate during evaporation coating in the step S4, wherein at least one of the island shelters is connected to the mask frame or a neighboring island shelter via the connection bridge, and the connection bridge of the mask assembly used in step S4 has a thickness smaller than that of the island shelter. a mask frame, having an open area, said mask frame being supported on a surface of the substrate during evaporation coating in the step S4; a plurality of island shelters, located in the open area, said plurality of island shelters being in contact with the surface of the substrate during evaporation coating in the step S4; and at least one connection bridge, spaced apart from and suspended above the surface of the substrate to form a gap between the connection bridge and the surface of the substrate during evaporation coating in the step S4, wherein at least one of the island shelters is connected to the mask frame or a neighboring island shelter via the connection bridge, and the connection bridge of the mask assembly used in step S4 has a thickness smaller than that of the island shelter.