A front opening semiconductor wafer container for large diameter wafers, comprising: a container portion having a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers; a door attachable to the container portion to close the open front and selectively latchable to the container portion; the container portion comprising a means for accommodating the large diameter wafers, said means for accommodating large diameter wafers including a back wafer restraint inside the container, and a front wafer restraint disposed on an inside surface of the door, characterized by the back wafer restraint and/or the front wafer restraint including a plurality of V-shaped slots (424 and/or 434), wherein each V-shaped slot (424 and/or 434) of the back wafer restraint and/or the front wafer restraint comprises: an upper leg extending angularly upwardly and having a wafer engaging surface upwardly extending in direction of one engaged wafer and a lower leg extending angularly downwardly and having a wafer engaging surface downwardly extending in direction of the engaged wafer, the downward extension in direction of the engaged wafer of the lower leg wafer engaging surface being longer than the upward extension in direction of the engaged wafer of the upper leg wafer engaging surface, and the upper leg overhangs the lower leg wafer engaging surface defining a horizontally extending inverted ledge portion with a downwardly facing ledge surface. a container portion having a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers; a door attachable to the container portion to close the open front and selectively latchable to the container portion; the container portion comprising a means for accommodating the large diameter wafers, said means for accommodating large diameter wafers including a back wafer restraint inside the container, and a front wafer restraint disposed on an inside surface of the door, characterized by the back wafer restraint and/or the front wafer restraint including a plurality of V-shaped slots (424 and/or 434), wherein each V-shaped slot (424 and/or 434) of the back wafer restraint and/or the front wafer restraint comprises: an upper leg extending angularly upwardly and having a wafer engaging surface upwardly extending in direction of one engaged wafer and a lower leg extending angularly downwardly and having a wafer engaging surface downwardly extending in direction of the engaged wafer, the downward extension in direction of the engaged wafer of the lower leg wafer engaging surface being longer than the upward extension in direction of the engaged wafer of the upper leg wafer engaging surface, and the upper leg overhangs the lower leg wafer engaging surface defining a horizontally extending inverted ledge portion with a downwardly facing ledge surface. an upper leg extending angularly upwardly and having a wafer engaging surface upwardly extending in direction of one engaged wafer and a lower leg extending angularly downwardly and having a wafer engaging surface downwardly extending in direction of the engaged wafer, the downward extension in direction of the engaged wafer of the lower leg wafer engaging surface being longer than the upward extension in direction of the engaged wafer of the upper leg wafer engaging surface, and the upper leg overhangs the lower leg wafer engaging surface defining a horizontally extending inverted ledge portion with a downwardly facing ledge surface.