A piezoelectric wafer, comprising: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion, wherein the piezoelectric vibration piece comprises a base portion, vibrating units (6,7) formed on a first side surface of the base portion, and a junction portion formed on a second side surface of the base portion, wherein the coupling portion has a break-off part formed in a width direction along an interface between the coupling portion and the junction portion of the piezoelectric vibration piece, the break-off part being configured for breaking off the piezoelectric vibration piece from the frame portion at the coupling portion, wherein the break-off part comprises: groove-shaped slits (13c,13d) being formed by etching and extending along a width direction of the coupling portion on front and back surfaces of the coupling portion; wherein the break-off part comprises at least one bridge (13e,13f) being an unetched part having a flat surface and interposed between the groove-shaped slits (13c,13d), wherein the piezoelectric vibration piece further comprises an electrode (20c4,20c5) on at least one of front and back surfaces of the piezoelectric vibration piece, characterized in that the electrode (20c4,20c5) is extracted to the frame-portion by way of the flat surface of the at least one bridge (13e, 13f). a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion, wherein the piezoelectric vibration piece comprises a base portion, vibrating units (6,7) formed on a first side surface of the base portion, and a junction portion formed on a second side surface of the base portion, wherein the coupling portion has a break-off part formed in a width direction along an interface between the coupling portion and the junction portion of the piezoelectric vibration piece, the break-off part being configured for breaking off the piezoelectric vibration piece from the frame portion at the coupling portion, wherein the break-off part comprises: groove-shaped slits (13c,13d) being formed by etching and extending along a width direction of the coupling portion on front and back surfaces of the coupling portion; wherein the break-off part comprises at least one bridge (13e,13f) being an unetched part having a flat surface and interposed between the groove-shaped slits (13c,13d), wherein the piezoelectric vibration piece further comprises an electrode (20c4,20c5) on at least one of front and back surfaces of the piezoelectric vibration piece, characterized in that the electrode (20c4,20c5) is extracted to the frame-portion by way of the flat surface of the at least one bridge (13e, 13f). groove-shaped slits (13c,13d) being formed by etching and extending along a width direction of the coupling portion on front and back surfaces of the coupling portion; wherein the break-off part comprises at least one bridge (13e,13f) being an unetched part having a flat surface and interposed between the groove-shaped slits (13c,13d), wherein the piezoelectric vibration piece further comprises an electrode (20c4,20c5) on at least one of front and back surfaces of the piezoelectric vibration piece, characterized in that the electrode (20c4,20c5) is extracted to the frame-portion by way of the flat surface of the at least one bridge (13e, 13f).