A component mounting machine (1;1B) comprising: a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head, wherein the control device includes: an implementation timing determination section (71;91) configured to determine an implementation timing of the thermal correction process, and a thermal correction implementation section configured to implement the thermal correction process according to a determination result of the implementation timing determination section (71;91), characterized in that the implementation timing determination section (71;91) includes: an accuracy requirement acquisition section configured to acquire an accuracy requirement level indicating the required level of the mounting accuracy; a thermal influence acquisition section configured to acquire a thermal influence level indicating a level of the influence of the thermal deformation on the mounting accuracy; and a level comparison section configured to determine the implementation timing of the thermal correction process by comparing the accuracy requirement level and the thermal influence level. a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head, wherein the control device includes: an implementation timing determination section (71;91) configured to determine an implementation timing of the thermal correction process, and a thermal correction implementation section configured to implement the thermal correction process according to a determination result of the implementation timing determination section (71;91), an implementation timing determination section (71;91) configured to determine an implementation timing of the thermal correction process, and a thermal correction implementation section configured to implement the thermal correction process according to a determination result of the implementation timing determination section (71;91), characterized in that the implementation timing determination section (71;91) includes: an accuracy requirement acquisition section configured to acquire an accuracy requirement level indicating the required level of the mounting accuracy; a thermal influence acquisition section configured to acquire a thermal influence level indicating a level of the influence of the thermal deformation on the mounting accuracy; and a level comparison section configured to determine the implementation timing of the thermal correction process by comparing the accuracy requirement level and the thermal influence level. an accuracy requirement acquisition section configured to acquire an accuracy requirement level indicating the required level of the mounting accuracy; a thermal influence acquisition section configured to acquire a thermal influence level indicating a level of the influence of the thermal deformation on the mounting accuracy; and a level comparison section configured to determine the implementation timing of the thermal correction process by comparing the accuracy requirement level and the thermal influence level.