A multilayer film for electronic circuitry applications, comprising: A. a first outer layer comprising: i. a first outer layer base polymer in an amount from 45 to 98.9 weight % based upon a total weight of the first outer layer; ii. a first outer layer carbon black filler in an amount from 1 to 15 weight % based upon the total weight of the first outer layer; iii. a first outer layer dielectric filler in an amount from 0.1 to 40 weight % based upon the total weight of the first outer layer, B. a core layer comprising a core layer base polymer, said core layer base polymer being present in an amount of at least 95 weight percent based upon a total weight of the core layer; and C. a second outer layer comprising; i. a second outer layer base polymer In an amount from 45 to 98.9 weight % based upon a total weight of the second outer layer; ii. a second outer layer low conductivity carbon black filler in an amount from 1 to 15 weight % based upon the total weight of the second outer layer, wherein the low conductivity carbon black filler is a carbon black filler having a volatile content greater than or equal to 13% or a channel type black. iii. a second outer layer dielectric filler in an amount from 0.1 to 40 weight % based upon the total weight of the second outer layer, wherein: a. the first outer layer base polymer, b. the core layer base polymer, and c. the second outer layer base polymer, can each be the same or different and each comprise one or more members of the group consisting of: polyesters, polyimides, liquid crystalline polymers, fluoropolymers, polyetherketones, polyetheretherketones, polyetherketoneketones, polyamides, polyaramides, polysutfonamides and derivatives or combinations thereof; wherein both the first outer layer dielectric filler and the second outer layer dielectric filler are selected from the group consisting of: silicon dioxide, calcium carbonate, magnesium carbonate, bone black, magnesium calcium carbonate, calcium oxide, magnesium oxide, silica, talc, magnesium silicates, aluminum silicates, magnesium aluminum silicates, calcium silicates, clay, mica, barium sulfate, boron nitride, aluminum nitride, barium titanate, strontium titanate, alumina trihydrate, calcium sulphate, aluminum hydroxide, magnesium hydroxide, huntite, basic magnesium carbonate, melamine polyphosphate, and mixtures thereof. and wherein the multilayer film thickness is in a range from 6 to 200 microns. A. a first outer layer comprising: i. a first outer layer base polymer in an amount from 45 to 98.9 weight % based upon a total weight of the first outer layer; ii. a first outer layer carbon black filler in an amount from 1 to 15 weight % based upon the total weight of the first outer layer; iii. a first outer layer dielectric filler in an amount from 0.1 to 40 weight % based upon the total weight of the first outer layer, i. a first outer layer base polymer in an amount from 45 to 98.9 weight % based upon a total weight of the first outer layer; ii. a first outer layer carbon black filler in an amount from 1 to 15 weight % based upon the total weight of the first outer layer; iii. a first outer layer dielectric filler in an amount from 0.1 to 40 weight % based upon the total weight of the first outer layer, B. a core layer comprising a core layer base polymer, said core layer base polymer being present in an amount of at least 95 weight percent based upon a total weight of the core layer; and C. a second outer layer comprising; i. a second outer layer base polymer In an amount from 45 to 98.9 weight % based upon a total weight of the second outer layer; ii. a second outer layer low conductivity carbon black filler in an amount from 1 to 15 weight % based upon the total weight of the second outer layer, wherein the low conductivity carbon black filler is a carbon black filler having a volatile content greater than or equal to 13% or a channel type black. iii. a second outer layer dielectric filler in an amount from 0.1 to 40 weight % based upon the total weight of the second outer layer, wherein: a. the first outer layer base polymer, b. the core layer base polymer, and c. the second outer layer base polymer, i. a second outer layer base polymer In an amount from 45 to 98.9 weight % based upon a total weight of the second outer layer; ii. a second outer layer low conductivity carbon black filler in an amount from 1 to 15 weight % based upon the total weight of the second outer layer, wherein the low conductivity carbon black filler is a carbon black filler having a volatile content greater than or equal to 13% or a channel type black. iii. a second outer layer dielectric filler in an amount from 0.1 to 40 weight % based upon the total weight of the second outer layer, wherein: a. the first outer layer base polymer, b. the core layer base polymer, and c. the second outer layer base polymer, a. the first outer layer base polymer, b. the core layer base polymer, and c. the second outer layer base polymer,