A method comprising: providing an electronic module comprising an electric terminal, the electric terminal including a press-fit section; providing an electric part comprising a contact hole; and pressing the press-fit section into the contact hole so that the press-fit section is plastically deformed and both mechanically and electrically contacts the electric part; wherein the electronic module comprises a substrate with a dielectric layer and a substrate metallization layer attached to the dielectric layer; and the electric terminal comprises a module connection section at which it is electrically connected to the substrate metallization layer by: electrically and mechanically connecting the module connection section to the substrate metallization layer using a joining layer that adjoins both the module connection section and the substrate metallization layer; or welding the module connection section to the substrate metallization layer; characterized in that the press-fit section comprises one of the following alloys: CuFeP; CuZr; CuCrZr; CuCrTiSi; CuCrAgFeTiSi; CuNiSiMg;wherein CuFeP means Cua Feb Pc Rd with a ≥ 96.82 weight%, b = 2.1 to 2.6 weight%, c = 0.015 to 0.15 weight%, d = 0 to 0.43 weight%, and a+b+c+d = 100 weight%;CuZr means Cua Zrb Rc with a ≥ 99.7 weight%, b = 0.1 to 0.2 weight%, c = 0 to 0.1 weight%, and a+b+c = 100 weight%;CuCrZr means Cua Crb Zrc Rd with a ≥ 98.32 weight%, b = 0.5 to 1.2 weight%, c = 0.03 to 0.3 weight%, d = 0 to 0.18 weight%, and a+b+c+d = 100 weight %;CuCrTiSi means Cua Crb Tic Sid Re with a ≥ 99.0 weight%, b = 0.15 to 0.4 weight%, c = 0.1 to 0.4 weight%, d = 0.02 to 0.07 weight%, e = 0 to 0.82 weight%, and a+b+c+d+e = 100 weight %;CuCrAgFeTiSi means Cua Crb Age Fed Tie Sif Rg with a ≥ 98.73 weight%, b = 0.2 to 0.7 weight%, c = 0.01 to 0.3 weight%, d = 0.02 to 0.2 weight%, e = 0.01 to 0.15 weight%, f = 0.01 to 0.1 weight%, g = 0 to 0.2 weight%, and a+b+c+d+e+f+g = 100 weight%,CuNiSiMg means Cua Nib Sic Mgd Re with a ≥ 93.25 weight%, b = 2.2 to 4.2 weight%, c = 0.25 to 1.2 weight%, d = 0.05 to 0.3 weight%, e = 0 to 3.75 weight%, and a+b+c+d+e = 100 weight%. providing an electronic module comprising an electric terminal, the electric terminal including a press-fit section; providing an electric part comprising a contact hole; and pressing the press-fit section into the contact hole so that the press-fit section is plastically deformed and both mechanically and electrically contacts the electric part; the electronic module comprises a substrate with a dielectric layer and a substrate metallization layer attached to the dielectric layer; and the electric terminal comprises a module connection section at which it is electrically connected to the substrate metallization layer by: electrically and mechanically connecting the module connection section to the substrate metallization layer using a joining layer that adjoins both the module connection section and the substrate metallization layer; or welding the module connection section to the substrate metallization electrically and mechanically connecting the module connection section to the substrate metallization layer using a joining layer that adjoins both the module connection section and the substrate metallization layer; or welding the module connection section to the substrate metallization layer; characterized in that the press-fit section comprises one of the following alloys: CuFeP; CuZr; CuCrZr; CuCrTiSi; CuCrAgFeTiSi; CuNiSiMg;wherein CuFeP means Cua Feb Pc Rd with a ≥ 96.82 weight%, b = 2.1 to 2.6 weight%, c = 0.015 to 0.15 weight%, d = 0 to 0.43 weight%, and a+b+c+d = 100 weight%;CuZr means Cua Zrb Rc with a ≥ 99.7 weight%, b = 0.1 to 0.2 weight%, c = 0 to 0.1 weight%, and a+b+c = 100 weight%;CuCrZr means Cua Crb Zrc Rd with a ≥ 98.32 weight%, b = 0.5 to 1.2 weight%, c = 0.03 to 0.3 weight%, d = 0 to 0.18 weight%, and a+b+c+d = 100 weight %;CuCrTiSi means Cua Crb Tic Sid Re with a ≥ 99.0 weight%, b = 0.15 to 0.4 weight%, c = 0.1 to 0.4 weight%, d = 0.02 to 0.07 weight%, e = 0 to 0.82 weight%, and a+b+c+d+e = 100 weight %;CuCrAgFeTiSi means Cua Crb Age Fed Tie Sif Rg with a ≥ 98.73 weight%, b = 0.2 to 0.7 weight%, c = 0.01 to 0.3 weight%, d = 0.02 to 0.2 weight%, e = 0.01 to 0.15 weight%, f = 0.01 to 0.1 weight%, g = 0 to 0.2 weight%, and a+b+c+d+e+f+g = 100 weight%,CuNiSiMg means Cua Nib Sic Mgd Re with a ≥ 93.25 weight%, b = 2.2 to 4.2 weight%, c = 0.25 to 1.2 weight%, d = 0.05 to 0.3 weight%, e = 0 to 3.75 weight%, and a+b+c+d+e = 100 weight%.