A light emitting device, comprising: a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer provided between the first surface and the second surface; a p-side electrode provided on the semiconductor layer; an n-side electrode provided on the semiconductor layer; a first insulating layer provided on the second surface, the first insulating layer having a first via communicating with the p-side electrode and a second via communicating with the n-side electrode; a p-side interconnect layer including a first p-side interconnect layer electrically connected to the p-side electrode through the first via, and a second p-side interconnect layer electrically connected to the first p-side interconnect layer and provided on an interconnect surface provided on a side of the first insulating layer opposite to the semiconductor layer, the second p-side interconnect layer including a portion having an L-shaped cross section perpendicular to the first surface; an n-side interconnect layer including a first n-side interconnect layer electrically connected to the n-side electrode through the second via, and a second n-side interconnect layer electrically connected to the first n-side interconnect layer, separated from the p-side interconnect layer and provided on the interconnect surface, the second n-side interconnect layer including a portion having an L-shaped cross section perpendicular to the first surface; and a second insulating layer provided between the p-side interconnect layer and the n-side interconnect layer, a portion of the second p-side interconnect layer having a p-side external terminal exposed from the first insulating layer and the second insulating layer at a third surface, a portion of the second n-side interconnect layer having an n-side external terminal exposed from the first insulating layer and the second insulating layer at the third surface, characterized in that the third surface has a plane orientation different from the first surface and the second surface, the p-side external terminal being perpendicular to the first surface and the n-side external terminal being perpendicular to the first surface, and the second p-side interconnect layer has a U-shaped configuration at the cross section of the portion of the second p-side interconnect layer having the L shape, and the second n-side interconnect layer has a U-shaped configuration at the cross section of the portion of the second n-side interconnect layer having the L shape, wherein the device further comprises: a third insulating layer provided inside the U-shaped configuration of the second p-side interconnect layer and inside the U-shaped configuration of the second n-side interconnect layer. a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer provided between the first surface and the second surface; a p-side electrode provided on the semiconductor layer; an n-side electrode provided on the semiconductor layer; a first insulating layer provided on the second surface, the first insulating layer having a first via communicating with the p-side electrode and a second via communicating with the n-side electrode; a p-side interconnect layer including a first p-side interconnect layer electrically connected to the p-side electrode through the first via, and a second p-side interconnect layer electrically connected to the first p-side interconnect layer and provided on an interconnect surface provided on a side of the first insulating layer opposite to the semiconductor layer, the second p-side interconnect layer including a portion having an L-shaped cross section perpendicular to the first surface; an n-side interconnect layer including a first n-side interconnect layer electrically connected to the n-side electrode through the second via, and a second n-side interconnect layer electrically connected to the first n-side interconnect layer, separated from the p-side interconnect layer and provided on the interconnect surface, the second n-side interconnect layer including a portion having an L-shaped cross section perpendicular to the first surface; and a second insulating layer provided between the p-side interconnect layer and the n-side interconnect layer, a portion of the second p-side interconnect layer having a p-side external terminal exposed from the first insulating layer and the second insulating layer at a third surface, a portion of the second n-side interconnect layer having an n-side external terminal exposed from the first insulating layer and the second insulating layer at the third surface,