A multi-beam laser debonding apparatus for debonding an electronic component from a substrate, the apparatus comprising: at least one first laser module, with a power supply unit, configured to emit a first laser beam to a first substrate area including attachment positions of debonding target electronic components and neighboring electronic components to thereby heat the solder of the electronic components to reach a predetermined pre-heat temperature; and being characterised by: at least one second laser module, with a power supply unit, configured to emit a second laser beam, the second laser beam having a lower output power than and a different wavelength from the first laser beam, to a second substrate area smaller than the first substrate area to overlap the first laser beam, the second substrate area including only an attachment position of the debonding target electronic components to thereby further heat the solder of the debonding target electronic components to reach a debonding temperature at which the solder commences melting; a camera unit comprised of at least one camera module configured to capture a debonding process of the electronic component by the respective laser beam; and a laser output control unit configured to generate a control signal for independently controlling the beam shape, overlap area, beam emission angle, output power, wavelength, and temperature of the laser beams from the respective laser modules based on the output signal from the camera unit, wherein: the at least first laser module and the at least second laser module are configured to provide in use an emission surface having a quadrangular or circular shape, the first laser beam from the first laser module increases the temperature of the first substrate area to the predetermined pre-heat temperature lower than the melting point of solder, and the second laser beam from the second laser module further increases the temperature of the second substrate to the level of debonding temperature to thereby induce the melting of the solder only in the attachment position of the debonding target electronic components to melt the solders within only the attachment position of the debonding target electronic components, and the beam shape, overlap area, edge trimming, beam emission angle, output power, wavelength, and temperature of the laser beams from the respective laser modules are controlled so as not to overheat the neighboring electronic components located outside the second substrate area. at least one first laser module, with a power supply unit, configured to emit a first laser beam to a first substrate area including attachment positions of debonding target electronic components and neighboring electronic components to thereby heat the solder of the electronic components to reach a predetermined pre-heat temperature; at least one second laser module, with a power supply unit, configured to emit a second laser beam, the second laser beam having a lower output power than and a different wavelength from the first laser beam, to a second substrate area smaller than the first substrate area to overlap the first laser beam, the second substrate area including only an attachment position of the debonding target electronic components to thereby further heat the solder of the debonding target electronic components to reach a debonding temperature at which the solder commences melting; a camera unit comprised of at least one camera module configured to capture a debonding process of the electronic component by the respective laser beam; and a laser output control unit configured to generate a control signal for independently controlling the beam shape, overlap area, beam emission angle, output power, wavelength, and temperature of the laser beams from the respective laser modules based on the output signal from the camera unit, wherein: the at least first laser module and the at least second laser module are configured to provide in use an emission surface having a quadrangular or circular shape, the first laser beam from the first laser module increases the temperature of the first substrate area to the predetermined pre-heat temperature lower than the melting point of solder, and the second laser beam from the second laser module further increases the temperature of the second substrate to the level of debonding temperature to thereby induce the melting of the solder only in the attachment position of the debonding target electronic components to melt the solders within only the attachment position of the debonding target electronic components, and the beam shape, overlap area, edge trimming, beam emission angle, output power, wavelength, and temperature of the laser beams from the respective laser modules are controlled so as not to overheat the neighboring electronic components located outside the second substrate area.