A light emitting device package comprising: a light emitting device comprising: a light emitting structure comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer 150); a conductive support member under the light emitting structure; a protective member at a peripheral region of an upper surface of the support member; an electrode comprising an upper portion being on the first conductivity type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode, a package body where the light emitting device is disposed; a lead electrode on the package body, the lead electrode being electrically connected to the light emitting device; and a socket electrically connected to the electrode of the light emitting device and the lead electrode, wherein the socket comprises an opening for inserting the light emitting structure. a light emitting device comprising: a light emitting structure comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer 150); a conductive support member under the light emitting structure; a protective member at a peripheral region of an upper surface of the support member; an electrode comprising an upper portion being on the first conductivity type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode, a light emitting structure comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer 150); a conductive support member under the light emitting structure; a protective member at a peripheral region of an upper surface of the support member; an electrode comprising an upper portion being on the first conductivity type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode, a package body where the light emitting device is disposed; a lead electrode on the package body, the lead electrode being electrically connected to the light emitting device; and a socket electrically connected to the electrode of the light emitting device and the lead electrode,