A system for immersion cooling electronic components (100, 900, 1000), the system comprising: a cylindrical container (101, 600, 902, 1002) having a circular cross section; two cooling elements (612, 704, 904, 1012) disposed in the cylindrical container, the cooling elements containing a first cooling fluid (120, 121); a volume of a second cooling fluid (102, 211, 302, 702, 909) disposed in the cylindrical container and in contact with each cooling element for exchange of heat between the second cooling fluid and the first cooling fluid, the second cooling fluid comprising an immersion cooling fluid; a plurality of heat generating electronic components disposed within the cylindrical container (109, 305, 709, 1030) and at least partially immersed in the second cooling fluid for exchange of heat between each electronic component and the second cooling fluid; wherein the electronic components are positioned to maintain a gap between adjacent electronic components sufficient enough to allow for separate insertion and removal of each electronic component by sliding the electronic components into and out of the container vertically through an open top of the container; and for each electronic component, a micropump is disposed in the second cooling fluid (304, 710) to direct a flow of the second cooling fluid through said electronic component and over each cooling element, wherein the micropump is integrated into said electronic component and receives power from said electronic component, wherein each electronic component (109, 305, 709, 1030) of the plurality of electronic components comprises a face (128, 1018) comprising power and communication connections (1032, 1034) and a depth extending back from the face (128, 1018); and wherein each electronic component (109, 305, 709, 1030) is disposed in the cylindrical container with the face accessible through the open top (601, 916) of the cylindrical container and the depth extending vertically in the cylindrical container, wherein the plurality of electronic components (109, 305, 709, 1030) are arranged in the cylindrical container as a stack with sides of all of the plurality of electronic components (109, 305, 709, 1030) aligned; wherein each cooling element (612, 704, 904, 1012) is located between the electronic components (109, 305, 709, 1030) and an interior wall of the cylindrical container (101, 600, 902, 1002), and wherein the two cooling elements (612, 704, 904, 1012) are arranged on diametrically opposed sides of the electronic components. a cylindrical container (101, 600, 902, 1002) having a circular cross section; two cooling elements (612, 704, 904, 1012) disposed in the cylindrical container, the cooling elements containing a first cooling fluid (120, 121); a volume of a second cooling fluid (102, 211, 302, 702, 909) disposed in the cylindrical container and in contact with each cooling element for exchange of heat between the second cooling fluid and the first cooling fluid, the second cooling fluid comprising an immersion cooling fluid; a plurality of heat generating electronic components disposed within the cylindrical container (109, 305, 709, 1030) and at least partially immersed in the second cooling fluid for exchange of heat between each electronic component and the second cooling fluid; wherein the electronic components are positioned to maintain a gap between adjacent electronic components sufficient enough to allow for separate insertion and removal of each electronic component by sliding the electronic components into and out of the container vertically through an open top of the container; and for each electronic component, a micropump is disposed in the second cooling fluid (304, 710) to direct a flow of the second cooling fluid through said electronic component and over each cooling element, wherein the micropump is integrated into said electronic component and receives power from said electronic component, wherein each electronic component (109, 305, 709, 1030) of the plurality of electronic components comprises a face (128, 1018) comprising power and communication connections (1032, 1034) and a depth extending back from the face (128, 1018); and wherein each electronic component (109, 305, 709, 1030) is disposed in the cylindrical container with the face accessible through the open top (601, 916) of the cylindrical container and the depth extending vertically in the cylindrical container, wherein the plurality of electronic components (109, 305, 709, 1030) are arranged in the cylindrical container as a stack with sides of all of the plurality of electronic components (109, 305, 709, 1030) aligned; wherein each cooling element (612, 704, 904, 1012) is located between the electronic components (109, 305, 709, 1030) and an interior wall of the cylindrical container (101, 600, 902, 1002), and wherein the two cooling elements (612, 704, 904, 1012) are arranged on diametrically opposed sides of the electronic components.