Circuit device comprising - a baseplate, - a first substrate arranged on a first outer side of the baseplate, - a second substrate arranged on a second outer side - opposite the first outer side of the baseplate, - at least one electrical connection element that electrically connects the first substrate and the second substrate, - at least one electronic component arranged on or in the first substrate, - at least one electronic component arranged on or in the second substrate, - a mold package molded around the two substrates (3, 4) and the electronic components arranged thereon, - and at least one contacting element for electrically contacting the first substrate and/or second substrate, said at least one contacting element being electrically conductively connected to the first substrate and/or the second substrate and being passed out of the mold package, characterized in that - the mold package is manufactured in the region of the first substrate from a first material (11.1), the thermal expansion coefficient of which is matched to the thermal expansion coefficient of the first substrate, and in the region of the second substrate from a second material (11.2), the thermal expansion coefficient of which is matched to the thermal expansion coefficient of the second substrate, - and in that the baseplate has at least three layers (2.1 to 2.5) of different thermal expansion coefficients arranged one above the other, wherein the first outer side of the baseplate is formed by an outer side of a first layer (2.1), and the second outer side of the baseplate is formed by an outer side of a second layer (2.2), and the thermal expansion coefficients of the at least three layers (2.1 to 2.5) decrease monotonically from the first layer (2.1) to the second layer (2.2), when the thermal expansion coefficient of the first substrate is greater than the thermal expansion coefficient of the second substrate, or increase monotonically, when the thermal expansion coefficient of the first substrate is less than the thermal expansion coefficient of the second substrate and wherein the thermal expansion coefficient of the first layer (2.1) coincides with the thermal expansion coefficient of the first substrate, and the thermal expansion coefficient of the second layer (2.2) coincides with the thermal expansion coefficient of the second substrate. - a baseplate, - a first substrate arranged on a first outer side of the baseplate, - a second substrate arranged on a second outer side - opposite the first outer side of the baseplate, - at least one electrical connection element that electrically connects the first substrate and the second substrate, - at least one electronic component arranged on or in the first substrate, - at least one electronic component arranged on or in the second substrate, - a mold package molded around the two substrates (3, 4) and the electronic components arranged thereon, - and at least one contacting element for electrically contacting the first substrate and/or second substrate, said at least one contacting element being electrically conductively connected to the first substrate and/or the second substrate and being passed out of the mold package, characterized in that - the mold package is manufactured in the region of the first substrate from a first material (11.1), the thermal expansion coefficient of which is matched to the thermal expansion coefficient of the first substrate, and in the region of the second substrate from a second material (11.2), the thermal expansion coefficient of which is matched to the thermal expansion coefficient of the second substrate, - and in that the baseplate has at least three layers (2.1 to 2.5) of different thermal expansion coefficients arranged one above the other, wherein the first outer side of the baseplate is formed by an outer side of a first layer (2.1), and the second outer side of the baseplate is formed by an outer side of a second layer (2.2), and the thermal expansion coefficients of the at least three layers (2.1 to 2.5) decrease monotonically from the first layer (2.1) to the second layer (2.2), when the thermal expansion coefficient of the first substrate is greater than the thermal expansion coefficient of the second substrate, or increase monotonically, when the thermal expansion coefficient of the first substrate is less than the thermal expansion coefficient of the second substrate and wherein the thermal expansion coefficient of the first layer (2.1) coincides with the thermal expansion coefficient of the first substrate, and the thermal expansion coefficient of the second layer (2.2) coincides with the thermal expansion coefficient of the second substrate.