A method for forming a sensor assembly comprising: retaining a sensor package in a cavity of a mold tool, the sensor package including a sensor die, connector pins (32, 34) electrically connected to the sensor die, and a housing in which the sensor die is located, the housing having first and second surfaces (44, 46) spaced apart from one another by first, second, third, and fourth sidewalls (48, 50, 52, 54), wherein the connector pins extend from the first sidewall of the housing, and the housing includes a notch region extending into the first surface of the housing such that a material portion of the housing is absent at the first sidewall and at the first surface of the housing, the retaining operation comprising receiving an alignment bar of an alignment tool in the notch region; and performing (110, 116) an overmolding process to fill the cavity with an overmold material to form the sensor assembly, wherein the alignment bar is configured to hold the sensor package in the mold tool during the overmolding process; wherein the performing operation comprises: executing an initial phase of the overmolding process to secure the sensor package in the mold tool with the overmold material; retracting the alignment bar away from the sensor package following the initial phase of the overmolding process; and executing a subsequent phase of the overmolding process following the retracting operation, the subsequent phase being performed to fill the cavity of the mold tool with the overmold material, and the subsequent phase partially overmolding the alignment bar with the overmold material. retaining a sensor package in a cavity of a mold tool, the sensor package including a sensor die, connector pins (32, 34) electrically connected to the sensor die, and a housing in which the sensor die is located, the housing having first and second surfaces (44, 46) spaced apart from one another by first, second, third, and fourth sidewalls (48, 50, 52, 54), wherein the connector pins extend from the first sidewall of the housing, and the housing includes a notch region extending into the first surface of the housing such that a material portion of the housing is absent at the first sidewall and at the first surface of the housing, the retaining operation comprising receiving an alignment bar of an alignment tool in the notch region; and performing (110, 116) an overmolding process to fill the cavity with an overmold material to form the sensor assembly, wherein the alignment bar is configured to hold the sensor package in the mold tool during the overmolding process; wherein the performing operation comprises: executing an initial phase of the overmolding process to secure the sensor package in the mold tool with the overmold material; retracting the alignment bar away from the sensor package following the initial phase of the overmolding process; and executing a subsequent phase of the overmolding process following the retracting operation, the subsequent phase being performed to fill the cavity of the mold tool with the overmold material, and the subsequent phase partially overmolding the alignment bar with the overmold material. executing an initial phase of the overmolding process to secure the sensor package in the mold tool with the overmold material; retracting the alignment bar away from the sensor package following the initial phase of the overmolding process; and executing a subsequent phase of the overmolding process following the retracting operation, the subsequent phase being performed to fill the cavity of the mold tool with the overmold material, and the subsequent phase partially overmolding the alignment bar with the overmold material.