An imager assembly for a miniature camera head, comprising the following components: a) an imaging sensor having conductive leads emanating from two opposite sides of said sensor, for outputting and/or inputting electric signals and/or power; b) an objective lens system placed on top of said sensor; c) circuitry, located beneath said imaging sensor, for driving said sensor and amplifying said electrical signals, where the components of said circuitry are electrically linked, according to the circuit requirements, to each other and to said sensor leads by conductive wires; d) conductive wires electrically linked to said circuitry and to the leads of the imaging sensor for conducting electrical signals between the electrical circuitry and a remote location; and e) conductive wires electrically linked to said circuitry and to the leads of said imaging sensor to provide them with electrical power from an external power supply wherein: said circuitry is capable of delivering signals produced by said imaging sensor for further processing and the components of said imager, except for the imaging surface of the sensor and said objective lens system, are encapsulated by an isolating material; characterized in that said conductive leads are bent, some of said wires for conducting electric signals and providing electrical power are connected directly to said conductive leads and to some of said wires for conducting electric signals and providing electrical power, and some of said conductive leads are connected directly to said electrical components of said circuitry without the use of a Printed Circuit Board, thereby allowing the dimensions in a plane parallel to the sensor plane of said camera head to be approximately equal to or less than the planar dimensions of said sensor, wherein said sensor has planar dimensions of 2.25mm x 2.25mm or less. a) an imaging sensor having conductive leads emanating from two opposite sides of said sensor, for outputting and/or inputting electric signals and/or power; b) an objective lens system placed on top of said sensor; c) circuitry, located beneath said imaging sensor, for driving said sensor and amplifying said electrical signals, where the components of said circuitry are electrically linked, according to the circuit requirements, to each other and to said sensor leads by conductive wires; d) conductive wires electrically linked to said circuitry and to the leads of the imaging sensor for conducting electrical signals between the electrical circuitry and a remote location; and e) conductive wires electrically linked to said circuitry and to the leads of said imaging sensor to provide them with electrical power from an external power supply wherein: said circuitry is capable of delivering signals produced by said imaging sensor for further processing and the components of said imager, except for the imaging surface of the sensor and said objective lens system, are encapsulated by an isolating material; characterized in that said conductive leads are bent, some of said wires for conducting electric signals and providing electrical power are connected directly to said conductive leads and to some of said wires for conducting electric signals and providing electrical power, and some of said conductive leads are connected directly to said electrical components of said circuitry without the use of a Printed Circuit Board, thereby allowing the dimensions in a plane parallel to the sensor plane of said camera head to be approximately equal to or less than the planar dimensions of said sensor, wherein said sensor has planar dimensions of 2.25mm x 2.25mm or less.