A method for adhesively bonding two substrates S, comprising the steps: a) applying a moisture-curable adhesive composition A onto at least one of the two substrates S; b) joining the two substrates S together such that the applied moisture-curable adhesive composition A forms an interlayer between the two substrates S such that the substrates S are directly connected by said interlayer; and c) curing the moisture-curable adhesive composition A by means of moisture; characterized in that at least one of the substrates S is a substrate S1, said substrate S1 comprising: - at least 40 wt.-%, based on the total weight of substrate S1, of a mixture E, said mixture E consisting of: - between 15 and 99 wt.-% of at least one thermoplastic polymer E1, - between 1 and 85 wt.-% of at least one elastomer E2, said proportions being based on the total weight of mixture E; and wherein the moisture-curable adhesive composition A comprises: - at least one polymer P containing silane groups, - between 10 and 40 wt.-%, based on the total composition, of at least one polymeric plasticizer PL, - between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric amino-functional alkoxysilane AS1, - between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric C3 - C20-alkyl-functional alkoxysilane AS2, and wherein the at least one elastomer E2 is selected from the group consisting of butyl rubber and halogenated butyl rubber and/or the at least one thermoplastic polymer E1 is at least one thermoplastic polyolefin elastomer (TPE-O). a) applying a moisture-curable adhesive composition A onto at least one of the two substrates S; b) joining the two substrates S together such that the applied moisture-curable adhesive composition A forms an interlayer between the two substrates S such that the substrates S are directly connected by said interlayer; and c) curing the moisture-curable adhesive composition A by means of moisture; at least one of the substrates S is a substrate S1, said substrate S1 comprising: - at least 40 wt.-%, based on the total weight of substrate S1, of a mixture E, said mixture E consisting of: - between 15 and 99 wt.-% of at least one thermoplastic polymer E1, - between 1 and 85 wt.-% of at least one elastomer E2, said proportions being based on the total weight of mixture E; and wherein - at least 40 wt.-%, based on the total weight of substrate S1, of a mixture E, said mixture E consisting of: - between 15 and 99 wt.-% of at least one thermoplastic polymer E1, - between 1 and 85 wt.-% of at least one elastomer E2, said proportions being based on the total weight of mixture E; - between 15 and 99 wt.-% of at least one thermoplastic polymer E1, - between 1 and 85 wt.-% of at least one elastomer E2, said proportions being based on the total weight of mixture E; the moisture-curable adhesive composition A comprises: - at least one polymer P containing silane groups, - between 10 and 40 wt.-%, based on the total composition, of at least one polymeric plasticizer PL, - between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric amino-functional alkoxysilane AS1, - between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric C3 - C20-alkyl-functional alkoxysilane AS2, - at least one polymer P containing silane groups, - between 10 and 40 wt.-%, based on the total composition, of at least one polymeric plasticizer PL, - between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric amino-functional alkoxysilane AS1, - between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric C3 - C20-alkyl-functional alkoxysilane AS2, and wherein the at least one elastomer E2 is selected from the group consisting of butyl rubber and halogenated butyl rubber and/or the at least one thermoplastic polymer E1 is at least one thermoplastic polyolefin elastomer (TPE-O).