mhurhangee/ep-ind-claims huggingface dataset:
A negative electrode for a lithium secondary battery, the negative electrode comprising: a negative electrode active material layer comprising a carbon-based active material; a LiF layer which comprises amorphous LiF in an amount of 30 mol% or more based on a total number of moles of LiF included in the LiF layer, and optionally a metal oxide layer, wherein: when the metal oxide layer is not present, the LiF layer is formed on the negative electrode active material layer, and when the metal oxide layer is present, the metal oxide layer is formed between the negative electrode active material layer and the LiF layer, and wherein the LiF layer further comprises at least one selected from the group consisting of Li 2 O, Li 2 CO 3, and LiOH in an amount of 3 wt% to 90 wt%. a negative electrode active material layer comprising a carbon-based active material; a LiF layer which comprises amorphous LiF in an amount of 30 mol% or more based on a total number of moles of LiF included in the LiF layer, and optionally a metal oxide layer, wherein: when the metal oxide layer is not present, the LiF layer is formed on the negative electrode active material layer, and when the metal oxide layer is present, the metal oxide layer is formed between the negative electrode active material layer and the LiF layer, and wherein the LiF layer further comprises at least one selected from the group consisting of Li 2 O, Li 2 CO 3, and LiOH in an amount of 3 wt% to 90 wt%. when the metal oxide layer is not present, the LiF layer is formed on the negative electrode active material layer, and when the metal oxide layer is present, the metal oxide layer is formed between the negative electrode active material layer and the LiF layer, and wherein the LiF layer further comprises at least one selected from the group consisting of Li 2 O, Li 2 CO 3, and LiOH in an amount of 3 wt% to 90 wt%.
Bit line structure comprising a substrate (1, 100, 101), in which a deep trench is formed; a first trench insulating layer, which is formed at the trench surface; a first trench filling layer, which is formed at the surface of the first trench insulating layer and fills a lower section of the trench; a second trench insulating layer, which is formed at the surface of the first trench filling layer; a second electrically conductive trench filling layer, which forms a buried bit line which is formed at the surface of the second trench insulating layer and fills an upper section of the trench at least partly up to the substrate surface, wherein the second electrically conductive trench filling layer is insulated from the first trench filling layer by the second trench insulating layer; at least one first doping region (8, S) of the first conduction type (n), which is formed in the surface of the substrate; at least one first electrically conductive connection layer (11; 13A), which is formed for electrically connecting the first doping region to the second trench filling layer (5, SL) at the surface of the first doping region (8, S), the first trench insulating layer and the second trench filling layer (5, SL); at least one second doping region (8, D) of the first conduction type (n), which is formed in the surface of the substrate; a surface dielectric (7, 10, 12; 12A, 12B), which is formed at the surface of the substrate and of the filled trench; a surface bit line, which is formed at the surface of the surface dielectric; and at least one second connection layer, which is formed for connecting the surface bit lines to the at least second doping region (8, D) in the surface dielectric, characterized in that the second trench filling layer is formed in the upper section of the trench at the side with respect to the first doping region to be connected, and the other side of the trench is filled with a third trench insulating layer.
Device for gripping a container made of thermoplastic material, in particular a preform intended to be shaped into a final container, the gripping device comprising: - a lower end nose which has a main axis and which is adapted to be inserted axially into the neck of the container; - a plurality of jaws in the form of ring segments which are distributed regularly about the axis of the nose, which are spaced circumferentially only by a free operational clearance (j), and which are mounted so as to be movable radially in the nose between a retracted position allowing the free axial sliding of the nose in the neck and an expanded position allowing the gripping of the neck with respect to the nose by clamping against the internal wall of the neck; - elastic return means for returning the jaws towards their expanded position; characterized in that the assembly of the jaws is held circumferentially in a defined circumferential position with respect to the nose by individual means for the circumferential immobilization of at least one jaw, the operational clearance (j) being left free. - a lower end nose which has a main axis and which is adapted to be inserted axially into the neck of the container; - a plurality of jaws in the form of ring segments which are distributed regularly about the axis of the nose, which are spaced circumferentially only by a free operational clearance (j), and which are mounted so as to be movable radially in the nose between a retracted position allowing the free axial sliding of the nose in the neck and an expanded position allowing the gripping of the neck with respect to the nose by clamping against the internal wall of the neck; - elastic return means for returning the jaws towards their expanded position;
A composition, comprising: 40-50 wt-% C14 paraffins, based on the total weight of the composition, and 35-45 wt-% C15 paraffins, based on the total weight of the composition, wherein the C14 and C15 paraffins are produced from a biological raw material. 40-50 wt-% C14 paraffins, based on the total weight of the composition, and 35-45 wt-% C15 paraffins, based on the total weight of the composition, wherein the C14 and C15 paraffins are produced from a biological raw material.
An automated process for preparing a moulded article from a plurality of pre-pregs comprising the steps of: (a) providing a mould; (b) disposing a laminar pre-preg into or onto said mould by an automated conveying member which applies a prehensile force to said pre-preg to convey said pre-preg from a starting position to a finishing position in or on said mould; (c) repeating step (b) at least once to dispose one or more further pre-pregs into or onto said mould; wherein said laminar pre-preg is a fibre-reinforced curable composite material, wherein said pre-preg comprises a core layer having a first surface and a second surface and further comprises a surface layer disposed directly on at least one surface of said core layer, wherein said core layer comprises one or more layer(s) of reinforcing fibres impregnated with a first curable resin, and wherein said surface layer comprises a second curable resin; and wherein the prehensile force is applied by said automated conveying member directly to the external surface of said surface layer of said pre-preg, wherein the second curable resin exhibits a viscosity at 21°C of at least 500,000Pa.s, preferably at least 1,000,000Pa.s, preferably at least 5,000,000Pa.s, and/or an uncured Tg of at least 8°C, preferably from about 12 to 30°C and wherein the first curable resin exhibits a viscosity at 21°C of less than 500,000 Pa.s, preferably no more than 300,000 Pa.s, preferably no more than 100,000 Pa.s and/or an uncured Tg of less than 8°C, preferably no more than 6°C, preferably no more than 3°C. (a) providing a mould; (b) disposing a laminar pre-preg into or onto said mould by an automated conveying member which applies a prehensile force to said pre-preg to convey said pre-preg from a starting position to a finishing position in or on said mould; (c) repeating step (b) at least once to dispose one or more further pre-pregs into or onto said mould; wherein said laminar pre-preg is a fibre-reinforced curable composite material, wherein said pre-preg comprises a core layer having a first surface and a second surface and further comprises a surface layer disposed directly on at least one surface of said core layer, wherein said core layer comprises one or more layer(s) of reinforcing fibres impregnated with a first curable resin, and wherein said surface layer comprises a second curable resin; and wherein the prehensile force is applied by said automated conveying member directly to the external surface of said surface layer of said pre-preg, wherein the second curable resin exhibits a viscosity at 21°C of at least 500,000Pa.s, preferably at least 1,000,000Pa.s, preferably at least 5,000,000Pa.s, and/or an uncured Tg of at least 8°C, preferably from about 12 to 30°C and wherein the first curable resin exhibits a viscosity at 21°C of less than 500,000 Pa.s, preferably no more than 300,000 Pa.s, preferably no more than 100,000 Pa.s and/or an uncured Tg of less than 8°C, preferably no more than 6°C, preferably no more than 3°C.
A component (20A, 20B, 20C) of a wireless IC device (1A, 1B, 1C), comprising: a wireless IC; and a feeding circuit substrate provided with a feeding circuit including a resonance circuit including an inductance element (L, L1, L2, 25) that is electrically-connected to the wireless IC, wherein the feeding circuit substrate is a flexible multilayered substrate formed by laminating a plurality of resin layers (41a-41g, 81a-81c), the inductance element is formed by a plurality of electrodes (13, 14, 28a, 28b) including viahole conductors (21, 22), the inductance element is formed of at least one annular electrode formed in an annular shape by using the plurality of viahole conductors (21, 22) and electrodes formed in the feeding circuit substrate, and a winding axis of the annular electrode is perpendicular to a lamination direction of the resin layers, the feeding circuit substrate being further characterized in that, the wireless IC is arranged on an inner side of the annular electrode when the annular electrode is viewed from a direction perpendicular to the lamination direction, and the feeding circuit includes capacitance elements formed by another plurality of electrodes (9a-9c) opposing one another. a wireless IC; and a feeding circuit substrate provided with a feeding circuit including a resonance circuit including an inductance element (L, L1, L2, 25) that is electrically-connected to the wireless IC, wherein the feeding circuit substrate is a flexible multilayered substrate formed by laminating a plurality of resin layers (41a-41g, 81a-81c), the inductance element is formed by a plurality of electrodes (13, 14, 28a, 28b) including viahole conductors (21, 22), the inductance element is formed of at least one annular electrode formed in an annular shape by using the plurality of viahole conductors (21, 22) and electrodes formed in the feeding circuit substrate, and a winding axis of the annular electrode is perpendicular to a lamination direction of the resin layers, the feeding circuit substrate being further characterized in that, the wireless IC is arranged on an inner side of the annular electrode when the annular electrode is viewed from a direction perpendicular to the lamination direction, and the feeding circuit includes capacitance elements formed by another plurality of electrodes (9a-9c) opposing one another.
An antenna module comprising: a circuit board (410, 510); a communication circuit (440, 540) disposed on one surface of the circuit board; one or more antenna elements electrically connected to the communication circuit and arranged in at least a part of the circuit board; a connection circuit board (420, 520, 920) including an at least partially covered opening and being disposed on the one surface of the circuit board such that the communication circuit is disposed in an inner space formed by the opening of the connection circuit board and a shield can; the shield can (470, 570) disposed to be in contact with one surface of the connection circuit board so as to cover the communication circuit; and a thermal interface material configured to radiate heat generated in the communication circuit and disposed between the communication circuit and the shield can (470, 570), wherein the connection circuit board (420, 520) comprises one or more signal wires electrically connected to the communication circuit; wherein a coating is formed on a side surface of the connection circuit board. a circuit board (410, 510); a communication circuit (440, 540) disposed on one surface of the circuit board; one or more antenna elements electrically connected to the communication circuit and arranged in at least a part of the circuit board; a connection circuit board (420, 520, 920) including an at least partially covered opening and being disposed on the one surface of the circuit board such that the communication circuit is disposed in an inner space formed by the opening of the connection circuit board and a shield can; the shield can (470, 570) disposed to be in contact with one surface of the connection circuit board so as to cover the communication circuit; and a thermal interface material configured to radiate heat generated in the communication circuit and disposed between the communication circuit and the shield can (470, 570), wherein the connection circuit board (420, 520) comprises one or more signal wires electrically connected to the communication circuit; wherein a coating is formed on a side surface of the connection circuit board.
A drive assist device comprising: a start signal output unit that outputs a control start signal; a consent confirmation unit that inquires of a driver, when receiving the control start signal from the start signal output unit, whether the driver consents to execution of an emergency evacuation control for stopping a vehicle at a safe position regardless of a driving operation of the driver, and receives a reply to the inquiry from the driver; a control section that executes the emergency evacuation control when receiving a consent reply of the execution of the emergency evacuation control from the driver by the consent confirmation unit; and an erroneous operation determination unit that determines whether the driving operation of the driver is an erroneous operation, wherein the control section limits the driving operation of the driver when it is determined that the driving operation of the driver is an erroneous operation by the erroneous operation determination unit in a period from the time when the control start signal is received by the start signal output unit to the time when the consent reply of execution of the emergency evacuation control is received by the consent confirmation unit. a start signal output unit that outputs a control start signal; a consent confirmation unit that inquires of a driver, when receiving the control start signal from the start signal output unit, whether the driver consents to execution of an emergency evacuation control for stopping a vehicle at a safe position regardless of a driving operation of the driver, and receives a reply to the inquiry from the driver; a control section that executes the emergency evacuation control when receiving a consent reply of the execution of the emergency evacuation control from the driver by the consent confirmation unit; and an erroneous operation determination unit that determines whether the driving operation of the driver is an erroneous operation, wherein the control section limits the driving operation of the driver when it is determined that the driving operation of the driver is an erroneous operation by the erroneous operation determination unit in a period from the time when the control start signal is received by the start signal output unit to the time when the consent reply of execution of the emergency evacuation control is received by the consent confirmation unit.
A blender comprising: a base comprising a top surface; and an enclosure, the enclosure comprising: a body, the body comprising opposed side walls spanned by a rear wall, defining an open front area opposed to the rear wall, the body including a foot at the bottom of the rear wall and the opposed side walls; and a cover, the cover being coupled to said body, such that the cover is moveable between open and closed positions; said cover and said body together defining a bottom edge profile only when the cover is in the closed position; the blender further comprising a vibration dampening gasket positioned between the top surface of the base and the foot of the body; and wherein the enclosure is completely separated from the base by the vibration dampening gasket. a base comprising a top surface; and an enclosure, the enclosure comprising: a body, the body comprising opposed side walls spanned by a rear wall, defining an open front area opposed to the rear wall, the body including a foot at the bottom of the rear wall and the opposed side walls; and a cover, the cover being coupled to said body, such that the cover is moveable between open and closed positions; said cover and said body together defining a bottom edge profile only when the cover is in the closed position; a body, the body comprising opposed side walls spanned by a rear wall, defining an open front area opposed to the rear wall, the body including a foot at the bottom of the rear wall and the opposed side walls; and a cover, the cover being coupled to said body, such that the cover is moveable between open and closed positions; said cover and said body together defining a bottom edge profile only when the cover is in the closed position; the blender further comprising a vibration dampening gasket positioned between the top surface of the base and the foot of the body; and wherein the enclosure is completely separated from the base by the vibration dampening gasket.
A method for manufacturing a semiconductor device comprising: a mounting step of mounting a plurality of semiconductor chips, each semiconductor chip having a solder-tipped electrode, onto an electronic component having a plurality of counter electrodes (32, 42) opposing respective ones of solder-tipped electrodes via an underfill film (2, 20); and a compression bonding and heating step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film (2, 20), wherein the underfill film (2, 20) contains an epoxy resin, an acid anhydride, a (meth)acrylate resin, and an organic peroxide, the underfill film (2, 20) having a minimum melt viscosity of 1,000 to 2,000 Pa ∗ s, characterized in that the underfill film has a melt viscosity gradient of 900 to 3,100 Pa ∗ s/°C from a first temperature 10°C higher than a minimum melt viscosity attainment temperature to a second temperature 10°C higher than the first temperature. a mounting step of mounting a plurality of semiconductor chips, each semiconductor chip having a solder-tipped electrode, onto an electronic component having a plurality of counter electrodes (32, 42) opposing respective ones of solder-tipped electrodes via an underfill film (2, 20); and a compression bonding and heating step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film (2, 20), wherein the underfill film (2, 20) contains an epoxy resin, an acid anhydride, a (meth)acrylate resin, and an organic peroxide, the underfill film (2, 20) having a minimum melt viscosity of 1,000 to 2,000 Pa ∗ s, characterized in that the underfill film has a melt viscosity gradient of 900 to 3,100 Pa ∗ s/°C from a first temperature 10°C higher than a minimum melt viscosity attainment temperature to a second temperature 10°C higher than the first temperature.
Light-emitting diode strip with a U-shaped housing, two legs (S1, S2) and a base, with chip light-emitting diodes mounted at a flexible conductor carrier and two in the emission direction of the chip light-emitting diodes one above the other and between the two legs (S1, S2) of the housing arranged potting compounds (V1, V2), whereas said chip light-emitting diodes are arranged at said base, characterized in that at least the first leg of the U-shaped housing consists of a translucent second potting compound tapered in the wall thickness and passing in a plastic material of the housing passing second potting compound, that said flexible conductor carrier is embedded in a first transparent potting compound and that the light of the chip light-emitting diodes is reflected from the inner surfaces of the housing and diffused by the second potting compound, wherein the light emitting diode strip is vertically elastic in the extension direction.
Method for operating a dryer with a drum for laundry items to be dried, a process air circuit, in which a fan for the conveyance of process air is arranged, a control unit, a heat pump (8,9,10,11) with an evaporator, a condenser, a throttle and a variable-power compressor, and at least one sensor (5,6,22,23), wherein a heating phase, a quasi-stationary drying phase and a transient drying phase are run through in succession over time, wherein in the quasi-stationary drying phase the damp laundry items, which have been heated to a first maximum temperature value T p in the heating phase, are dried and the temperature of the process air rises when it exits the drum at the start of the transient drying phase, wherein a transition from the quasi-stationary to the transient drying phase is ascertained by evaluating sensor signals of the sensor (5,6,22,23), and if a transition is established, a rotational speed u of the fan is reduced and a power consumption p of the compressor is reduced, characterised in that a conductance sensor in the drum is used as the sensor (5,6,22,23), wherein the conductance sensor is used to measure a conductance L w of the laundry items as a function of time t, and the transition from the quasi-stationary to the transient drying phase is established when a predefined lower conductance L w min of the laundry items and/or a predefined minimum value (ΔL w /Δt) min for the amount of the drop in the conductance L w over time is reached, and/or a relative humidity F rel of the process air leaving the drum is measured by a humidity sensor at an outlet of the drum and, when a predefined relative humidity F 1 rel is measured, the rotational speed u of the fan and the power consumption p of the compressor are decreased for a predefined period of time Δt set such that the relative humidity F 1 rel drops by a predefined value ΔF set at a maximum.