Method of fixing a heat resistant component on a surface of a heat exposed component, by brazing of at least a part of a surface of the heat resistant component limited by a peripheral boundary edge on the surface of the heat exposed component using a molten solder, comprising - metalizing the surface of the heat resistant component and characterized in that, in combination: - the metalizing is carried out with the exception of an edge area (r) of the surface of the heat resistant component, the edge area (r) comprising the peripheral boundary edge, - at least the surface of the heat resistant component consists is of a ceramic material which has a physico-chemical property concerning wettability such that the ceramic material is not wettable by the molten solder, - a metal alloy is used for metalizing which has a physico-chemical property concerning wettability such that the metalizing and the heat exposed component are both wettable by the molten solder, and - structuring the contact surface of the heat resistant component and/or the surface of the heat exposed component such that the edge area (r) of the heat resistant component comprising the peripheral boundary edge does not have a contact to the surface of the heat exposed component after contacting both, wherein the layer thickness and the surface dimension of the solder material correspond with the recess volume of the structured surface, - brazing said metalized surface to the surface of the heat exposed component by using the molten solder, the layer thickness and the surface dimension of the solder material filling out the space enclosed by both surfaces, so that after brazing the surfaces of the heat resistant component and the heat exposed component are in contact with each other, and so that the edge area (r) of the heat resistant component remains free from the molten solder and spaced apart by a gap (g) from the heat exposed component. - metalizing the surface of the heat resistant component and - the metalizing is carried out with the exception of an edge area (r) of the surface of the heat resistant component, the edge area (r) comprising the peripheral boundary edge, - at least the surface of the heat resistant component consists is of a ceramic material which has a physico-chemical property concerning wettability such that the ceramic material is not wettable by the molten solder, - a metal alloy is used for metalizing which has a physico-chemical property concerning wettability such that the metalizing and the heat exposed component are both wettable by the molten solder, and - structuring the contact surface of the heat resistant component and/or the surface of the heat exposed component such that the edge area (r) of the heat resistant component comprising the peripheral boundary edge does not have a contact to the surface of the heat exposed component after contacting both, - brazing said metalized surface to the surface of the heat exposed component by using the molten solder, the layer thickness and the surface dimension of the solder material filling out the space enclosed by both surfaces, so that after brazing the surfaces of the heat resistant component and the heat exposed component are in contact with each other, and so that the edge area (r) of the heat resistant component remains free from the molten solder and spaced apart by a gap (g) from the heat exposed component.