A photosensitive assembly, comprising: a circuit board, which includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on a lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium and the circuit board electrical connecting terminals; and a photosensitive chip, wherein an upper surface of the photosensitive chip includes a photosensitive area, a non-photosensitive area located around the photosensitive area, and chip electrical connecting terminals disposed in the non-photosensitive area; wherein the chip electrical connecting terminals of the photosensitive chip correspond to the circuit board electrical connecting terminals, and the chip electrical connecting terminals are in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board; and wherein the photosensitive area of the photosensitive chip corresponds to the through hole, so that external light reach the photosensitive area via the through hole, characterized in that the photosensitive assembly further comprises a shielding case, which is disposed on the lower surface of the circuit board and covers the photosensitive chip therein, for preventing the molding material or the mold pressing material from penetrating into the photosensitive area of the photosensitive chip. a circuit board, which includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on a lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium and the circuit board electrical connecting terminals; and a photosensitive chip, wherein an upper surface of the photosensitive chip includes a photosensitive area, a non-photosensitive area located around the photosensitive area, and chip electrical connecting terminals disposed in the non-photosensitive area; wherein the chip electrical connecting terminals of the photosensitive chip correspond to the circuit board electrical connecting terminals, and the chip electrical connecting terminals are in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board; and wherein the photosensitive area of the photosensitive chip corresponds to the through hole, so that external light reach the photosensitive area via the through hole, characterized in that the photosensitive assembly further comprises a shielding case, which is disposed on the lower surface of the circuit board and covers the photosensitive chip therein, for preventing the molding material or the mold pressing material from penetrating into the photosensitive area of the photosensitive chip.