A method, comprising: - providing a support member, - arranging on the support member: - a) at least one first electronic component having opposed first and second surfaces, the at least one first electronic component arranged on the support member with the second surface towards the support member, wherein the at least one first electronic component has a thickness between the opposed first and second surfaces, - b) at least one second electronic component mounted on a substrate, the at least one second electronic component arranged on the support member with the substrate having a substrate surface opposed the at least one second electronic component and facing towards the support member, wherein the substrate and the at least one second electronic component mounted thereon have a joint thickness which is less than the thickness of the at least one first electronic component, - molding package molding material onto the support member having arranged thereon the at least one first electronic component and the at least one second electronic component mounted on the substrate, wherein the package molding material encapsulates the at least one second electronic component leaving exposed the first surface of the at least one first electronic component, and - separating the support member to expose the second surface of the at least one first electronic component and the substrate surface of the substrate opposed the at least one second electronic component, wherein the method comprises: - a) providing electrically-conductive formations (18, 22; 22) between: - the at least one second electronic component and the substrate, and/or - the at least one first electronic component and the substrate, and/or - the at least one first electronic component and the at least one second electronic component, - b) molding the package molding material onto the support member having arranged thereon the at least one first electronic component and the at least one second electronic component mounted on the substrate, wherein the package molding material encapsulates said electrically-conductive formations (18, 22; 22). - providing a support member, - arranging on the support member: - a) at least one first electronic component having opposed first and second surfaces, the at least one first electronic component arranged on the support member with the second surface towards the support member, wherein the at least one first electronic component has a thickness between the opposed first and second surfaces, - b) at least one second electronic component mounted on a substrate, the at least one second electronic component arranged on the support member with the substrate having a substrate surface opposed the at least one second electronic component and facing towards the support member, wherein the substrate and the at least one second electronic component mounted thereon have a joint thickness which is less than the thickness of the at least one first electronic component, - a) at least one first electronic component having opposed first and second surfaces, the at least one first electronic component arranged on the support member with the second surface towards the support member, wherein the at least one first electronic component has a thickness between the opposed first and second surfaces, - b) at least one second electronic component mounted on a substrate, the at least one second electronic component arranged on the support member with the substrate having a substrate surface opposed the at least one second electronic component and facing towards the support member, wherein the substrate and the at least one second electronic component mounted thereon have a joint thickness which is less than the thickness of the at least one first electronic component, - molding package molding material onto the support member having arranged thereon the at least one first electronic component and the at least one second electronic component mounted on the substrate, wherein the package molding material encapsulates the at least one second electronic component leaving exposed the first surface of the at least one first electronic component, and - separating the support member to expose the second surface of the at least one first electronic component and the substrate surface of the substrate opposed the at least one second electronic component, - a) providing electrically-conductive formations (18, 22; 22) between: - the at least one second electronic component and the substrate, and/or - the at least one first electronic component and the substrate, and/or - the at least one first electronic component and the at least one second electronic component, - the at least one second electronic component and the substrate, and/or - the at least one first electronic component and the substrate, and/or - the at least one first electronic component and the at least one second electronic component, - b) molding the package molding material onto the support member having arranged thereon the at least one first electronic component and the at least one second electronic component mounted on the substrate, wherein the package molding material encapsulates said electrically-conductive formations (18, 22; 22).