A microelectromechanical system, MEMS, microphone comprising: a substrate; a first diaphragm and a first backplate arranged such that: (i) the first diaphragm moves, relative to a first backplate, in response to acoustic pressure waves in an environment of the microphone, and (ii) the first diaphragm also moves, relative to the first backplate, in response to mechanical vibrations of the microphone, wherein movement of the first diaphragm relative to the first backplate causes a first capacitance change between the first diaphragm and the first backplate; and a second diaphragm and a second backplate, wherein the second diaphragm is substantially acoustically isolated from the environment of the microphone such that the second diaphragm does not move substantially, relative to the second backplate, in response to the acoustic pressure waves in the environment, wherein the second diaphragm moves, relative to the second backplate, in response to the mechanical vibrations of the microphone, and wherein movement of the second diaphragm relative to the second backplate causes a second capacitance change between the second diaphragm and the second backplate, characterized in that the substrate has an opening therein configured to receive the acoustic pressure waves in the environment of the microphone and the microphone further comprises common support structures (412A, 412B) which extend from the substrate on either side of the opening therein; wherein each of the first backplate and the second backplate are perforated to allow for reduced air pressure between the backplates and the diaphragms; wherein the second diaphragm includes perforations designed to allow the acoustic pressure waves to pass through the second diaphragm without displacing the second diaphragm relative to the second backplate, wherein the first diaphragm and the second diaphragm are both suspended between and flexibly mounted to the common support structures (412A, 412B), and the first backplate and the second backplate are both suspended between and rigidly mounted to the common support structures, and wherein the first diaphragm, the second diaphragm, the first backplate and the second backplate are each mounted to the common support structures (412A, 412B) at a respective different distance from the substrate, the first diaphragm and first backplate being located between (a) the second diaphragm and second backplate and (b) the substrate. a substrate; a first diaphragm and a first backplate arranged such that: (i) the first diaphragm moves, relative to a first backplate, in response to acoustic pressure waves in an environment of the microphone, and (ii) the first diaphragm also moves, relative to the first backplate, in response to mechanical vibrations of the microphone, wherein movement of the first diaphragm relative to the first backplate causes a first capacitance change between the first diaphragm and the first backplate; and a second diaphragm and a second backplate, wherein the second diaphragm is substantially acoustically isolated from the environment of the microphone such that the second diaphragm does not move substantially, relative to the second backplate, in response to the acoustic pressure waves in the environment, wherein the second diaphragm moves, relative to the second backplate, in response to the mechanical vibrations of the microphone, and wherein movement of the second diaphragm relative to the second backplate causes a second capacitance change between the second diaphragm and the second backplate, characterized in that the substrate has an opening therein configured to receive the acoustic pressure waves in the environment of the microphone and the microphone further comprises common support structures (412A, 412B) which extend from the substrate on either side of the opening therein; wherein each of the first backplate and the second backplate are perforated to allow for reduced air pressure between the backplates and the diaphragms; wherein the second diaphragm includes perforations designed to allow the acoustic pressure waves to pass through the second diaphragm without displacing the second diaphragm relative to the second backplate, wherein the first diaphragm and the second diaphragm are both suspended between and flexibly mounted to the common support structures (412A, 412B), and the first backplate and the second backplate are both suspended between and rigidly mounted to the common support structures, and wherein the first diaphragm, the second diaphragm, the first backplate and the second backplate are each mounted to the common support structures (412A, 412B) at a respective different distance from the substrate, the first diaphragm and first backplate being located between (a) the second diaphragm and second backplate and (b) the substrate.