A component mounting machine for mounting a component supplied from a component supply device on a pad pattern of a circuit board or a solder printing pattern formed by performing screen printing on the pad pattern, wherein the component mounting machine comprises: a camera that is configured to image an imaging target portion of the circuit board; and control means that is configured to control a component mounting operation by determining whether a mount component is the component to be mounted on the pad pattern or the component to be mounted on the solder printing pattern, and wherein the control means includes means for correcting a mounting position of a component with respect to the pad pattern based on a position of a board mark formed on the circuit board as a fiducial point which is imaged by the camera and is subjected to image processing and mounting the component on the pad pattern when it is determined that the mount component is the component to be mounted on the pad pattern, and means for correcting a mounting position of a component with respect to the solder printing pattern based on a position of a solder mark formed on the circuit board as a fiducial point which is imaged by the camera and is subjected to image processing and mounting the component on the solder printing pattern when it is determined that the mount component is the component to be mounted on the solder printing pattern; wherein the control means is configured to determine that the mount component is the component to be mounted on the pad pattern when screen printing of the solder printing pattern is not performed on the pad pattern existing at a component mounting position or when application of solder is performed on the pad pattern existing at the component mounting position by a method other than screen printing or when the mount component is the component to be mounted after solder or flux is transferred to a terminal portion thereof, and is configured to determine that the mount component is the component to be mounted on the solder printing pattern when screen printing of the solder printing pattern is performed on the pad pattern existing at the component mounting position, wherein the control means is configured to determine that the mount component is the component to be mounted on the pad pattern or the component to be mounted on the solder printing pattern, with reference to image processing component data, mounting position data or the like, said data including data for designating whether the mount component is the component to be mounted on the pad pattern or the component to be mounted on the solder printing pattern. a camera that is configured to image an imaging target portion of the circuit board; and control means that is configured to control a component mounting operation by determining whether a mount component is the component to be mounted on the pad pattern or the component to be mounted on the solder printing pattern, and wherein the control means includes means for correcting a mounting position of a component with respect to the pad pattern based on a position of a board mark formed on the circuit board as a fiducial point which is imaged by the camera and is subjected to image processing and mounting the component on the pad pattern when it is determined that the mount component is the component to be mounted on the pad pattern, and means for correcting a mounting position of a component with respect to the solder printing pattern based on a position of a solder mark formed on the circuit board as a fiducial point which is imaged by the camera and is subjected to image processing and mounting the component on the solder printing pattern when it is determined that the mount component is the component to be mounted on the solder printing pattern; wherein the control means is configured to determine that the mount component is the component to be mounted on the pad pattern when screen printing of the solder printing pattern is not performed on the pad pattern existing at a component mounting position or when application of solder is performed on the pad pattern existing at the component mounting position by a method other than screen printing or when the mount component is the component to be mounted after solder or flux is transferred to a terminal portion thereof, and is configured to determine that the mount component is the component to be mounted on the solder printing pattern when screen printing of the solder printing pattern is performed on the pad pattern existing at the component mounting position, wherein the control means is configured to determine that the mount component is the component to be mounted on the pad pattern or the component to be mounted on the solder printing pattern, with reference to image processing component data, mounting position data or the like, said data including data for designating whether the mount component is the component to be mounted on the pad pattern or the component to be mounted on the solder printing pattern.