A sensor package comprising: a pressure sensor; a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor; a lead frame (141, 142) through which a result of computation performed by the computation unit is output to an outside; a main housing that is formed of resin and that holds the lead frame (141, 142); and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed, wherein the pressure sensor is disposed in the main housing using the sensor housing, wherein the main housing has one surface having a recess, another surface facing the one surface, and a through hole that penetrates from the other surface to the recess, wherein the through hole and the inner space are filled with a pressure transmission medium, and the pressure sensor disposed in the inner space is covered with the pressure transmission medium, and wherein the recess is filled with a resin having a higher Young's modulus than a Young's modulus of the pressure transmission medium, characterized in that the sensor package further comprises: an integrated circuit board that includes the computation unit and that is disposed at a position which is outside the sensor housing and in the main housing wherein the sensor housing covers a region where the through hole is connected to the recess, and the through hole and the inner space of the sensor housing communicate with each other so as to form a space closed to the recess, and wherein the integrated circuit board is disposed at a position which is in the recess and outside the sensor housing wherein the integrated circuit board is covered with the resin having the higher Young's modulus than a Young's modulus of the pressure transmission medium. a pressure sensor; a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor; a lead frame (141, 142) through which a result of computation performed by the computation unit is output to an outside; a main housing that is formed of resin and that holds the lead frame (141, 142); and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed, wherein the pressure sensor is disposed in the main housing using the sensor housing, wherein the main housing has one surface having a recess, another surface facing the one surface, and a through hole that penetrates from the other surface to the recess, wherein the through hole and the inner space are filled with a pressure transmission medium, and the pressure sensor disposed in the inner space is covered with the pressure transmission medium, and wherein the recess is filled with a resin having a higher Young's modulus than a Young's modulus of the pressure transmission medium, characterized in that the sensor package further comprises: an integrated circuit board that includes the computation unit and that is disposed at a position which is outside the sensor housing and in the main housing wherein the sensor housing covers a region where the through hole is connected to the recess, and the through hole and the inner space of the sensor housing communicate with each other so as to form a space closed to the recess, and wherein the integrated circuit board is disposed at a position which is in the recess and outside the sensor housing wherein the integrated circuit board is covered with the resin having the higher Young's modulus than a Young's modulus of the pressure transmission medium. an integrated circuit board that includes the computation unit and that is disposed at a position which is outside the sensor housing and in the main housing wherein the sensor housing covers a region where the through hole is connected to the recess, and the through hole and the inner space of the sensor housing communicate with each other so as to form a space closed to the recess, and wherein the integrated circuit board is disposed at a position which is in the recess and outside the sensor housing wherein the integrated circuit board is covered with the resin having the higher Young's modulus than a Young's modulus of the pressure transmission medium.