A sensor package structure, comprising: a substrate having an upper surface and a lower surface opposite to the upper surface, wherein the substrate includes a plurality of welding pads formed on the upper surface; a sensor chip having a top surface, a bottom surface opposite to the top surface, and a surrounding lateral side arranged between the top surface and the bottom surface, the bottom surface of the sensor chip being disposed on the upper surface of the substrate, the top surface having a sensing region and a spacing region arranged around the sensing region, wherein the top surface has a plurality of edges (213, 214), and the sensor chip includes a plurality of connecting pads formed on a portion of the top surface between at least one of the edges and the spacing region; a plurality of metal wires, wherein one ends of the metal wires are respectively connected to the welding pads, and the other ends of the metal wires are respectively connected to the connecting pads; a combining layer disposed on the portion of the top surface between the at least one of the edges of the top surface and the spacing region and adjacent the spacing region, wherein a surrounding lateral side of the combining layer is arranged distant from the spacing region, and a part of each of the metal wires is embedded in the combining layer; a translucent layer having a first surface, a second surface opposite to the first surface, and a surrounding lateral side arranged between the first surface and the second surface, a portion of the second surface of the translucent layer being adhered to the combining layer, wherein the second surface has a fixing region arranged outside the portion of the second surface adhered to the combining layer, and a projecting area defined by orthogonally projecting the sensor chip onto the second surface is entirely located in the second surface; and a packaging compound disposed on the upper surface of the substrate and covering the surrounding lateral side of the sensor chip, the surrounding lateral side of the combining layer, and the surrounding lateral side and the fixing region of the translucent layer, wherein at least part of each of the metal wires and each of the welding pads are embedded in the packaging compound, and characterized in that the surrounding lateral side of the combining layer arranged distant from the spacing region includes an arc surface having a center of circle located in the packaging compound. a substrate having an upper surface and a lower surface opposite to the upper surface, wherein the substrate includes a plurality of welding pads formed on the upper surface; a sensor chip having a top surface, a bottom surface opposite to the top surface, and a surrounding lateral side arranged between the top surface and the bottom surface, the bottom surface of the sensor chip being disposed on the upper surface of the substrate, the top surface having a sensing region and a spacing region arranged around the sensing region, wherein the top surface has a plurality of edges (213, 214), and the sensor chip includes a plurality of connecting pads formed on a portion of the top surface between at least one of the edges and the spacing region; a plurality of metal wires, wherein one ends of the metal wires are respectively connected to the welding pads, and the other ends of the metal wires are respectively connected to the connecting pads; a combining layer disposed on the portion of the top surface between the at least one of the edges of the top surface and the spacing region and adjacent the spacing region, wherein a surrounding lateral side of the combining layer is arranged distant from the spacing region, and a part of each of the metal wires is embedded in the combining layer; a translucent layer having a first surface, a second surface opposite to the first surface, and a surrounding lateral side arranged between the first surface and the second surface, a portion of the second surface of the translucent layer being adhered to the combining layer, wherein the second surface has a fixing region arranged outside the portion of the second surface adhered to the combining layer, and a projecting area defined by orthogonally projecting the sensor chip onto the second surface is entirely located in the second surface; and a packaging compound disposed on the upper surface of the substrate and covering the surrounding lateral side of the sensor chip, the surrounding lateral side of the combining layer, and the surrounding lateral side and the fixing region of the translucent layer, wherein at least part of each of the metal wires and each of the welding pads are embedded in the packaging compound, and characterized in that the surrounding lateral side of the combining layer arranged distant from the spacing region includes an arc surface having a center of circle located in the packaging compound.