A method for forming a resin-based composite structure, the method comprising: providing a prepreg layup, wherein the prepreg layup comprises an epoxy resin-carbon fiber composite material; covering a thermal-fusion material on a surface of the prepreg layup, wherein the thermal-fusion material is in a structure of a non-woven or a woven; and performing a molding and curing process to fuse the thermal-fusion material with the prepreg layup, wherein the thermal-fusion material is in a solid state at a room temperature, the thermal-fusion material is tack-free at the room temperature, and the molding and curing process comprises: heating the thermal-fusion material and the prepreg layup, wherein the thermal-fusion material and the prepreg layup are heated up from the room temperature to a first temperature, the thermal-fusion material remains in the solid state and tack-free before the first temperature, and then the thermal-fusion material is heated at the first temperature to melt, soften and fuse with the prepreg layup, wherein the thermal-fusion material is transferred from the solid state to a gel state after the first temperature; and heating at a second temperature to solidify the prepreg layup for forming the resin-based composite structure, wherein the prepreg layup and the thermal-fusion material are fully fused with each other before the second temperature, and the prepreg layup fully fused with the thermal-fusion material is transferred from the gel state to the solid state after the second temperature; wherein the first temperature is lower than the second temperature, and a viscosity of the thermal-fusion material is decreased while raised from the first temperature to the second temperature. providing a prepreg layup, wherein the prepreg layup comprises an epoxy resin-carbon fiber composite material; covering a thermal-fusion material on a surface of the prepreg layup, wherein the thermal-fusion material is in a structure of a non-woven or a woven; and performing a molding and curing process to fuse the thermal-fusion material with the prepreg layup, wherein the thermal-fusion material is in a solid state at a room temperature, the thermal-fusion material is tack-free at the room temperature, and the molding and curing process comprises: heating the thermal-fusion material and the prepreg layup, wherein the thermal-fusion material and the prepreg layup are heated up from the room temperature to a first temperature, the thermal-fusion material remains in the solid state and tack-free before the first temperature, and then the thermal-fusion material is heated at the first temperature to melt, soften and fuse with the prepreg layup, wherein the thermal-fusion material is transferred from the solid state to a gel state after the first temperature; and heating at a second temperature to solidify the prepreg layup for forming the resin-based composite structure, wherein the prepreg layup and the thermal-fusion material are fully fused with each other before the second temperature, and the prepreg layup fully fused with the thermal-fusion material is transferred from the gel state to the solid state after the second temperature; wherein the first temperature is lower than the second temperature, and a viscosity of the thermal-fusion material is decreased while raised from the first temperature to the second temperature. heating the thermal-fusion material and the prepreg layup, wherein the thermal-fusion material and the prepreg layup are heated up from the room temperature to a first temperature, the thermal-fusion material remains in the solid state and tack-free before the first temperature, and then the thermal-fusion material is heated at the first temperature to melt, soften and fuse with the prepreg layup, wherein the thermal-fusion material is transferred from the solid state to a gel state after the first temperature; and heating at a second temperature to solidify the prepreg layup for forming the resin-based composite structure, wherein the prepreg layup and the thermal-fusion material are fully fused with each other before the second temperature, and the prepreg layup fully fused with the thermal-fusion material is transferred from the gel state to the solid state after the second temperature; wherein the first temperature is lower than the second temperature, and a viscosity of the thermal-fusion material is decreased while raised from the first temperature to the second temperature.