A method for testing optoelectronic chips arranged on a wafer, with electrical interfaces in the form of contact pads (1.1) and optical interfaces fixed relative thereto in the form of optical deflection elements (1.2), with a specific coupling angle (α), wherein the wafer is received by a positioning table which is adjustable in the x, y and z-directions of a Cartesian coordinate system relative to a contacting module and rotatable about the z-axis, the contacting module having electrical interfaces in the form of needles (2.1) assigned to the contact pads (1.1) and optical interfaces (2.2) assigned to the optical deflecting elements (1.2), and in a first adjustment step, the wafer is fed to the contacting module in such a way that the needles (2.1), in a first adjustment position, are arranged vertically above the centres of the contact pads (1.1) of a first one of the chips, the contacting module having an adjustment distance (a) greater than a free length (l) of the needles (2.1) from the first one of the chips in the z-direction, the relative alignment of the optical deflection elements (1.2) to the optical interfaces (2.2) present on the contacting module is carried out in further adjustment steps, then the positioning table is moved towards the contacting module in the z-direction by a feed path (Δz) to an optical working distance (b) at which the needles (2.1) contact the contact pads (1.1) with a predetermined contact pressure force, and electrical or optical signals are then transmitted via the respective interfaces assigned to one another, characterized in that the relative alignment of the optical deflection elements (1.2) to the optical interfaces (2.2) present on the contacting module is performed by first deflecting the positioning table, in a scan field smaller than the size of the contact pads (1. 1), relative to the first alignment position in the x and y directions into a second alignment position, while an optical signal is conducted via at least one of the optical interfaces of the contacting module (2.2) and one of the optical deflection elements (1.2), the second alignment position being assumed when the optical signal is coupled in with a maximum intensity, and the first of the chips is then deflected over an adjustment path into a third adjustment position in the x-y direction, the adjustment path having been calculated from the feed path (Δz) and the coupling angle (α) of the relevant optical deflection element (1.2), before the positioning table is fed to the contacting module in the z direction by the feed path (Δz) to the optical working distance (b). wherein the wafer is received by a positioning table which is adjustable in the x, y and z-directions of a Cartesian coordinate system relative to a contacting module and rotatable about the z-axis, the contacting module having electrical interfaces in the form of needles (2.1) assigned to the contact pads (1.1) and optical interfaces (2.2) assigned to the optical deflecting elements (1.2), and in a first adjustment step, the wafer is fed to the contacting module in such a way that the needles (2.1), in a first adjustment position, are arranged vertically above the centres of the contact pads (1.1) of a first one of the chips, the contacting module having an adjustment distance (a) greater than a free length (l) of the needles (2.1) from the first one of the chips in the z-direction, the relative alignment of the optical deflection elements (1.2) to the optical interfaces (2.2) present on the contacting module is carried out in further adjustment steps, then the positioning table is moved towards the contacting module in the z-direction by a feed path (Δz) to an optical working distance (b) at which the needles (2.1) contact the contact pads (1.1) with a predetermined contact pressure force, and electrical or optical signals are then transmitted via the respective interfaces assigned to one another, characterized in that the relative alignment of the optical deflection elements (1.2) to the optical interfaces (2.2) present on the contacting module is performed by first deflecting the positioning table, in a scan field smaller than the size of the contact pads (1. 1), relative to the first alignment position in the x and y directions into a second alignment position, while an optical signal is conducted via at least one of the optical interfaces of the contacting module (2.2) and one of the optical deflection elements (1.2), the second alignment position being assumed when the optical signal is coupled in with a maximum intensity, and the first of the chips is then deflected over an adjustment path into a third adjustment position in the x-y direction, the adjustment path having been calculated from the feed path (Δz) and the coupling angle (α) of the relevant optical deflection element (1.2), before the positioning table is fed to the contacting module in the z direction by the feed path (Δz) to the optical working distance (b).