A light emitting device package comprising: a body comprising a cavity surrounded by wall portions having side surfaces; first and second lead frames (140, 150) mounted in the body; and a light emitting diode electrically connected with the first and second lead frames (140, 150) disposed in the cavity; wherein the light emitting diode is disposed on the first lead frame in the cavity, wherein the first and second lead frames (140, 150) have a heat sink which is extended, respectively, from a portion of the first and the second lead frames (140, 150) in the longitudinal direction of the body while extending along side surfaces of the wall portions of the body, and wherein the body further comprises a recess formed at a bottom surface of the body, and a portion of the heat sink of the first lead frame is bent to extend along the bottom surface of the body and is disposed in the recess, the bottom surface arranged at the opposite to the light emission surface of the light emitting device package with respect to the body, and wherein the recess has a width greater than a width of the heat sink, and the recess has a depth greater than a thickness of the heat sink, wherein the heat sink further comprises a first coupler and the body further comprises a second coupler, to which the first coupler is coupled, wherein the first coupler is a protrusion formed at an inner surface of the heat sink which connects to the side surfaces of the wall portions of the body; wherein the second coupler is a groove formed in order to correspond to the first coupler, and wherein the heat sink has at least a portion on an outer surface thereof on which roughness is formed such that an enhancement in the heat dissipation effect of the heat sink is achieved. a body comprising a cavity surrounded by wall portions having side surfaces; first and second lead frames (140, 150) mounted in the body; and a light emitting diode electrically connected with the first and second lead frames (140, 150) disposed in the cavity; wherein the light emitting diode is disposed on the first lead frame in the cavity, wherein the first and second lead frames (140, 150) have a heat sink which is extended, respectively, from a portion of the first and the second lead frames (140, 150) in the longitudinal direction of the body while extending along side surfaces of the wall portions of the body, and wherein the body further comprises a recess formed at a bottom surface of the body, and a portion of the heat sink of the first lead frame is bent to extend along the bottom surface of the body and is disposed in the recess, the bottom surface arranged at the opposite to the light emission surface of the light emitting device package with respect to the body, and wherein the recess has a width greater than a width of the heat sink, and the recess has a depth greater than a thickness of the heat sink, wherein the heat sink further comprises a first coupler and the body further comprises a second coupler, to which the first coupler is coupled, wherein the first coupler is a protrusion formed at an inner surface of the heat sink which connects to the side surfaces of the wall portions of the body; wherein the second coupler is a groove formed in order to correspond to the first coupler, and wherein the heat sink has at least a portion on an outer surface thereof on which roughness is formed such that an enhancement in the heat dissipation effect of the heat sink is achieved.