A process for producing a backplane circuit board having an internal face adapted to be connected to connectors of circuit boards and an external face adapted to be connected to an external connector, a series of first blind holes opening on the one hand on the internal face of the backplane circuit board and a series of second blind holes opening on the other hand on the external face of the backplane circuit board, the backplane circuit board comprising: - a first printed circuit having a first face and a second face designed to form the internal face of the backplane circuit board; - a second printed circuit having a first face and a second face designed to form the external face of the backplane circuit board and; - a third printed circuit having a first face facing the first face of the first printed circuit and a second face facing the first face of the second printed circuit, the third printed circuit constituting an electrical insulator between its first face and its second face, said first blind holes passing through the first printed circuit but not passing through the third printed circuit and said second blind holes passing through the second printed circuit but not passing through the third printed circuit; characterised in that the process comprises the following steps: - depositing on the first face of the third printed circuit of a first bonding layer, said first bonding layer having first zones cleared of material distributed on the first face of the third printed circuit, and depositing on the second face of the third printed circuit of a second bonding layer, said second bonding layer having second zones cleared of material distributed on the second face of the third printed circuit; - assembling on the first bonding layer of the first face of the first printed circuit, said first printed circuit having a series of first through-holes designed to form the first blind holes, each first through-hole opening in a first zone cleared of material of the first bonding layer on the first face of the third printed circuit to form the first blind holes, and assembling on the second bonding layer of the first face of the second printed circuit, said second printed circuit having a series of second through-holes designed to form the second blind holes, each second through-hole opening in a second zone cleared of material of the second bonding layer on the second face of the third printed circuit to form the second blind holes. - a first printed circuit having a first face and a second face designed to form the internal face of the backplane circuit board; - a second printed circuit having a first face and a second face designed to form the external face of the backplane circuit board and; - a third printed circuit having a first face facing the first face of the first printed circuit and a second face facing the first face of the second printed circuit, the third printed circuit constituting an electrical insulator between its first face and its second face, said first blind holes passing through the first printed circuit but not passing through the third printed circuit and said second blind holes passing through the second printed circuit but not passing through the third printed circuit; - depositing on the first face of the third printed circuit of a first bonding layer, said first bonding layer having first zones cleared of material distributed on the first face of the third printed circuit, and depositing on the second face of the third printed circuit of a second bonding layer, said second bonding layer having second zones cleared of material distributed on the second face of the third printed circuit; - assembling on the first bonding layer of the first face of the first printed circuit, said first printed circuit having a series of first through-holes designed to form the first blind holes, each first through-hole opening in a first zone cleared of material of the first bonding layer on the first face of the third printed circuit to form the first blind holes, and assembling on the second bonding layer of the first face of the second printed circuit, said second printed circuit having a series of second through-holes designed to form the second blind holes, each second through-hole opening in a second zone cleared of material of the second bonding layer on the second face of the third printed circuit to form the second blind holes.