An apparatus, comprising: one or more processors; and one or more memories configured to store one or more models and commands that cause the one or more processors to perform an operation when executed by the one or more processors, wherein the one or more processors are configured to: acquire solder measurement information indicating a state of a solder printed on a first substrate that includes at least one selected from an orientation, a volume, a height and an area of the solder; determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information; upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using the one or more models so as to minimize a positional offset of the first component with respect to pads on the first substrate after a reflow process for the first substrate and deliver the mounting information to a mounter, and wherein the one or more models are configured to: determine an objective function for predicting a state of the first component after the reflow process for the first substrate from a state of the first component before the reflow process for the first substrate, based on information indicating states of the second component before and after a reflow process for each of the second substrates; and output the mounting information for the first substrate using the objective function. one or more processors; and one or more memories configured to store one or more models and commands that cause the one or more processors to perform an operation when executed by the one or more processors, wherein the one or more processors are configured to: acquire solder measurement information indicating a state of a solder printed on a first substrate that includes at least one selected from an orientation, a volume, a height and an area of the solder; determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information; upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using the one or more models so as to minimize a positional offset of the first component with respect to pads on the first substrate after a reflow process for the first substrate and deliver the mounting information to a mounter, and acquire solder measurement information indicating a state of a solder printed on a first substrate that includes at least one selected from an orientation, a volume, a height and an area of the solder; determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information; upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using the one or more models so as to minimize a positional offset of the first component with respect to pads on the first substrate after a reflow process for the first substrate and deliver the mounting information to a mounter, and wherein the one or more models are configured to: determine an objective function for predicting a state of the first component after the reflow process for the first substrate from a state of the first component before the reflow process for the first substrate, based on information indicating states of the second component before and after a reflow process for each of the second substrates; and output the mounting information for the first substrate using the objective function. determine an objective function for predicting a state of the first component after the reflow process for the first substrate from a state of the first component before the reflow process for the first substrate, based on information indicating states of the second component before and after a reflow process for each of the second substrates; and output the mounting information for the first substrate using the objective function.