A microelectronic package, comprising: a substrate having first and second opposed surfaces (108 and 110), and having a plurality of substrate contacts (121, 123) exposed at the first surface; a microelectronic element having memory storage array function, the microelectronic element having a rear face facing the first surface, a front face opposite the rear face, and contacts on the front face electrically connected with the substrate contacts (121, 123)through conductive structure extending above the front face; and a plurality of terminals (104, 106) exposed at the second surface configured for connecting the microelectronic package with at least one component external to the microelectronic package, the terminals (104, 106) electrically connected with the substrate contacts (121, 123) and including a plurality of first terminals, the first terminals including a first set thereof disposed on a first side of a theoretical axis and a second set thereof disposed on a second side of the axis opposite from the first side, characterized in that each of the first and second sets (114 and 124) being configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of the memory storage array, the first terminals having signal assignments, wherein the signal assignments of the first terminals in the first set are symmetric about the axis with the signal assignments of the first terminals in the second set, such that of the first terminals of the first set that are configured to carry address information, each of such first terminals is configured to carry the same address information as a corresponding one of the first terminals of the second set at a position symmetric about the axis with respect to such first terminal. a substrate having first and second opposed surfaces (108 and 110), and having a plurality of substrate contacts (121, 123) exposed at the first surface; a microelectronic element having memory storage array function, the microelectronic element having a rear face facing the first surface, a front face opposite the rear face, and contacts on the front face electrically connected with the substrate contacts (121, 123)through conductive structure extending above the front face; and a plurality of terminals (104, 106) exposed at the second surface configured for connecting the microelectronic package with at least one component external to the microelectronic package, the terminals (104, 106) electrically connected with the substrate contacts (121, 123) and including a plurality of first terminals, the first terminals including a first set thereof disposed on a first side of a theoretical axis and a second set thereof disposed on a second side of the axis opposite from the first side, characterized in that each of the first and second sets (114 and 124) being configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of the memory storage array, the first terminals having signal assignments, wherein the signal assignments of the first terminals in the first set are symmetric about the axis with the signal assignments of the first terminals in the second set, such that of the first terminals of the first set that are configured to carry address information, each of such first terminals is configured to carry the same address information as a corresponding one of the first terminals of the second set at a position symmetric about the axis with respect to such first terminal.