Method for the manufacturing of dielectric bridges for contactless identification, with a standardised pitch and with a broadened tolerance, or of contactless labels of small width, the method comprising steps of: - provision of a standard silicon wafer with integrated circuits with the active face facing upwards, previously prepared by sawing, for a laser connection of the contact pads of said integrated circuits to contact pads of conductive circuits on the surface of a strip of dielectric medium made of a polyimide which is resistant to heat and to the rays emitted by the lasers; - picking the integrated circuits using a means for gripping of an integrated circuit pick and place machine which flips them over; - input of the integrated circuits positioning data using a vision system for location; - placing of the picked integrated circuits on to the strip of dielectric medium made of polyimide, such that the contact pads of the integrated circuits are positioned facing the contact pads of the conductive circuits; - held in place by a slight contact pressure of the contact pads of the integrated circuits on the contact pads of the conductive circuits, the strip of dielectric medium being immobilised during this operation; - connection of the integrated circuits with the conductive circuits using a laser with one head and one or more beam(s), or with several heads, depending on the configuration and the size of the contact pads, the beam(s) passing through the strip of dielectric medium, for soldering with the heat released the contact pads of the conductive circuit with the contact pads of the integrated circuit; - advance of one pitch of the strip of dielectric medium to undertake the next operation. - provision of a standard silicon wafer with integrated circuits with the active face facing upwards, previously prepared by sawing, for a laser connection of the contact pads of said integrated circuits to contact pads of conductive circuits on the surface of a strip of dielectric medium made of a polyimide which is resistant to heat and to the rays emitted by the lasers; - picking the integrated circuits using a means for gripping of an integrated circuit pick and place machine which flips them over; - input of the integrated circuits positioning data using a vision system for location; - placing of the picked integrated circuits on to the strip of dielectric medium made of polyimide, such that the contact pads of the integrated circuits are positioned facing the contact pads of the conductive circuits; - held in place by a slight contact pressure of the contact pads of the integrated circuits on the contact pads of the conductive circuits, the strip of dielectric medium being immobilised during this operation; - connection of the integrated circuits with the conductive circuits using a laser with one head and one or more beam(s), or with several heads, depending on the configuration and the size of the contact pads, the beam(s) passing through the strip of dielectric medium, for soldering with the heat released the contact pads of the conductive circuit with the contact pads of the integrated circuit; - advance of one pitch of the strip of dielectric medium to undertake the next operation.