A method for the production of a circuit board, comprising the following steps: - providing at least one first element, in particular a multi-layered and optionally partially structured element (1, 19, 31), in particular a multi-layered core element of the circuit board to be produced, - applying a material (6, 20, 39) which prevents adhesion or facilitates subsequent removal to a region of the first element (1, 19, 31) to be exposed, after at least one further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") has been put in place, - directly applying the at least one further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") to the first element (1, 19, 31), wherein the further layer is formed from a material which essentially covers the entire area and in particular is non-conductive, - connecting, in particular pressing or laminating, the first element (1, 19, 31) and the at least one further layer (7, 7', 7", 40, 41, 40', 40", 41', 41"), and - removing a portion (13, 44, 45, 44', 45') of the further layer in order to expose the region of the first element (1, 19, 31), - wherein in the further layer (7, 7', 7", 40, 41, 40', 40", 41', 41"), severing of the material of the further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") is carried out so as to match the portion (13, 44, 45, 44', 45') to be subsequently removed, on at least one edge of the portion (13, 44, 45, 44', 45') to be removed prior to application to the first element (1, 19, 31) and/or any connection therewith, - wherein the material of the further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") is formed by a fluid plastic material configured with a reinforcement, in particular a fluid plastic material reinforced with glass fibres, for example a prepreg material, - wherein, during the connection procedure with the first element (1, 19, 31) of the circuit board, the severed region (11, 12, 17, 18, 21, 48, 47, 46', 47') of the further layer is filled by the fluid plastic material of the portions of the further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") that follow the severed region (11, 12, 17, 18, 21, 48, 47, 46', 47') because of the elevated temperature and/or elevated pressure which occurs during the connection process. - providing at least one first element, in particular a multi-layered and optionally partially structured element (1, 19, 31), in particular a multi-layered core element of the circuit board to be produced, - applying a material (6, 20, 39) which prevents adhesion or facilitates subsequent removal to a region of the first element (1, 19, 31) to be exposed, after at least one further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") has been put in place, - directly applying the at least one further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") to the first element (1, 19, 31), wherein the further layer is formed from a material which essentially covers the entire area and in particular is non-conductive, - connecting, in particular pressing or laminating, the first element (1, 19, 31) and the at least one further layer (7, 7', 7", 40, 41, 40', 40", 41', 41"), and - removing a portion (13, 44, 45, 44', 45') of the further layer in order to expose the region of the first element (1, 19, 31), - wherein in the further layer (7, 7', 7", 40, 41, 40', 40", 41', 41"), severing of the material of the further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") is carried out so as to match the portion (13, 44, 45, 44', 45') to be subsequently removed, on at least one edge of the portion (13, 44, 45, 44', 45') to be removed prior to application to the first element (1, 19, 31) and/or any connection therewith, - wherein the material of the further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") is formed by a fluid plastic material configured with a reinforcement, in particular a fluid plastic material reinforced with glass fibres, for example a prepreg material, - wherein, during the connection procedure with the first element (1, 19, 31) of the circuit board, the severed region (11, 12, 17, 18, 21, 48, 47, 46', 47') of the further layer is filled by the fluid plastic material of the portions of the further layer (7, 7', 7", 40, 41, 40', 40", 41', 41") that follow the severed region (11, 12, 17, 18, 21, 48, 47, 46', 47') because of the elevated temperature and/or elevated pressure which occurs during the connection process.