A microphone assembly (100, 200) comprising a microphone unit and a mounting element (110, 210), said microphone unit comprising a housing and a base printed circuit board, wherein said housing comprises a first side comprising an audio port, wherein said housing is secured to said base printed circuit board with the audio port facing away from said base printed circuit board; wherein the microphone unit comprises a MEMS microphone package holding a MEMS microphone die, the MEMS microphone die being attached to the base printed circuit board within a chamber formed by the housing and the base printed circuit board, wherein the MEMS microphone die is positioned for alignment with the audio port in the first side of the housing for receiving sound entering through the audio port; wherein said base printed circuit board has a substantially planar first contact side facing away from said first side, said first contact side being provided with a number of first electrical contacts or contact pads for providing electrical contact between the microphone unit and the mounting element (110, 210); said mounting element (110, 210) comprising a rigid body having a mounting side (111, 211), wherein the rigid body is a body substantially unable to bend or be forced out of shape; wherein said mounting side (111, 211) is configured for being mounted or soldered to a device printed circuit board; said mounting element (110, 210) has a substantially planar second contact side (113, 213) facing said first contact side, said second contact side (113, 213) being provided with a number of second electrical contacts or contact pads (114, 214); wherein said mounting element (110, 210) comprises electrical conduits or signal lines for connecting said second electrical contacts or contact pads (114, 214) to electrical contacts or contact pads in said mounting side (111, 211); wherein said first side, said first contact side, and said second contact side (113, 213) are parallel to each other; and wherein each of said first side, said first contact side, and said second contact side (113, 213) are arranged at a right angle to said mounting side (111, 211) such that when the microphone unit is secured to the mounting element, at least part of the second contact pads (114, 214) are facing and are electrically connected to corresponding first contact pads whereby the microphone unit is electrically connected to the device printed circuit board. said microphone unit comprising a housing and a base printed circuit board, wherein said housing comprises a first side comprising an audio port, wherein said housing is secured to said base printed circuit board with the audio port facing away from said base printed circuit board; wherein the microphone unit comprises a MEMS microphone package holding a MEMS microphone die, the MEMS microphone die being attached to the base printed circuit board within a chamber formed by the housing and the base printed circuit board, wherein the MEMS microphone die is positioned for alignment with the audio port in the first side of the housing for receiving sound entering through the audio port; wherein said base printed circuit board has a substantially planar first contact side facing away from said first side, said first contact side being provided with a number of first electrical contacts or contact pads for providing electrical contact between the microphone unit and the mounting element (110, 210); said mounting element (110, 210) comprising a rigid body having a mounting side (111, 211), wherein the rigid body is a body substantially unable to bend or be forced out of shape; wherein said mounting side (111, 211) is configured for being mounted or soldered to a device printed circuit board; said mounting element (110, 210) has a substantially planar second contact side (113, 213) facing said first contact side, said second contact side (113, 213) being provided with a number of second electrical contacts or contact pads (114, 214); wherein said mounting element (110, 210) comprises electrical conduits or signal lines for connecting said second electrical contacts or contact pads (114, 214) to electrical contacts or contact pads in said mounting side (111, 211); wherein said first side, said first contact side, and said second contact side (113, 213) are parallel to each other; and wherein each of said first side, said first contact side, and said second contact side (113, 213) are arranged at a right angle to said mounting side (111, 211) such that when the microphone unit is secured to the mounting element, at least part of the second contact pads (114, 214) are facing and are electrically connected to corresponding first contact pads whereby the microphone unit is electrically connected to the device printed circuit board.