A microelectronic assembly including a microelectronic package and a circuit panel electrically connected with terminals (104, 106) of the microelectronic package, the microelectronic package including: a substrate having first and second opposed surfaces and a plurality of substrate contacts (121, 122) exposed at the first surface; a microelectronic element having memory storage array function, the microelectronic element having a rear face facing the first surface, a front face opposite the rear face, and contacts (111, 113) on the front face electrically connected with the substrate contacts (121, 122) through conductive structure extending above the front face; and the terminals (104,106) of the microelectronic package being exposed at the second surface of the substrate and configured for connecting the microelectronic package with the circuit panel, the terminals (104, 106) of the microelectronic package being electrically connected with the substrate contacts (121, 122) and including a plurality of first terminals including first and second sets thereof disposed on first and second respective sides of a theoretical axis, the first terminals of each of the first and second sets configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array of the microelectronic element, characterized by the first terminals having signal assignments, wherein the signal assignments of the first terminals in the first set are symmetric about the axis with the signal assignments of the first terminals in the second set, such that of the first terminals of the first set that are configured to carry address information, each of such first terminals is configured to carry the same address information as a corresponding one of the first terminals of the second set at a position symmetric about the axis with respect to such first terminal. a substrate having first and second opposed surfaces and a plurality of substrate contacts (121, 122) exposed at the first surface; a microelectronic element having memory storage array function, the microelectronic element having a rear face facing the first surface, a front face opposite the rear face, and contacts (111, 113) on the front face electrically connected with the substrate contacts (121, 122) through conductive structure extending above the front face; and the terminals (104,106) of the microelectronic package being exposed at the second surface of the substrate and configured for connecting the microelectronic package with the circuit panel, the terminals (104, 106) of the microelectronic package being electrically connected with the substrate contacts (121, 122) and including a plurality of first terminals including first and second sets thereof disposed on first and second respective sides of a theoretical axis, the first terminals of each of the first and second sets configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array of the microelectronic element,