An image pickup device comprising: a semiconductor substrate having a back surface, serving as a light-incident surface, and a front surface, opposing the back surface and being provided with a charge reading part constituted by a charge coupled device that detects light propagating from the back surface, said semiconductor substrate having a structure such that the thickness of the region at which said charge reading part is disposed is made thinner than the thickness of the remaining region; a fiber optic plate having a light outgoing end surface joined to the back surface of said semiconductor substrate, the light outgoing end surface of said fiber optic plate being joined to a part of the back surface of the semiconductor substrate that corresponds to a region at which said charge reading part is disposed and that is made thin in thickness; a package having a cavity that houses said semiconductor substrate and having one surface whose opening portion is covered by a bottom cover, and the other surface opposing said one surface and whose opening portion is attached with a guide member having a guiding opening, said package being fixed with said semiconductor substrate such that said charge reading part and said bottom cover face each other while said semiconductor substrate is housed; electrical wirings for taking out charge signals output from said charge reading part to the exterior of said package, said electrical wirings including substrate-side electrodes disposed on the front surface of said semiconductor substrate, and package-side electrodes disposed on an inner wall of said package and being electrically connected to said substrate-side electrodes by bonding wires; and a protective plate provided between the front surface of said semiconductor substrate and the said bottom cover of said package, while being joined to the front surface of said semiconductor substrate so as to cover said charge reading part, wherein said fiber optic plate has at least a part housed in said cavity of said package via the guiding opening of said guide member, the light outgoing end surface of said fiber optic plate being joined to the region of the back surface of said semiconductor substrate that is thin in thickness. a semiconductor substrate having a back surface, serving as a light-incident surface, and a front surface, opposing the back surface and being provided with a charge reading part constituted by a charge coupled device that detects light propagating from the back surface, said semiconductor substrate having a structure such that the thickness of the region at which said charge reading part is disposed is made thinner than the thickness of the remaining region; a fiber optic plate having a light outgoing end surface joined to the back surface of said semiconductor substrate, the light outgoing end surface of said fiber optic plate being joined to a part of the back surface of the semiconductor substrate that corresponds to a region at which said charge reading part is disposed and that is made thin in thickness; a package having a cavity that houses said semiconductor substrate and having one surface whose opening portion is covered by a bottom cover, and the other surface opposing said one surface and whose opening portion is attached with a guide member having a guiding opening, said package being fixed with said semiconductor substrate such that said charge reading part and said bottom cover face each other while said semiconductor substrate is housed; electrical wirings for taking out charge signals output from said charge reading part to the exterior of said package, said electrical wirings including substrate-side electrodes disposed on the front surface of said semiconductor substrate, and package-side electrodes disposed on an inner wall of said package and being electrically connected to said substrate-side electrodes by bonding wires; and a protective plate provided between the front surface of said semiconductor substrate and the said bottom cover of said package, while being joined to the front surface of said semiconductor substrate so as to cover said charge reading part, wherein said fiber optic plate has at least a part housed in said cavity of said package via the guiding opening of said guide member, the light outgoing end surface of said fiber optic plate being joined to the region of the back surface of said semiconductor substrate that is thin in thickness.