A process method for bond-packaging an LED using a thermoplastic resin photoconverter by rolling, comprising at least the following continuous process flow: preparation of a photoconversion sheet, roll-shaping and roll-cutting of a photoconversion sheet array, forming of LED package elements by roll-bonding, and curing of the LED package elements, comprising the following basic steps: step 1: preparation of a photoconversion sheet: acquiring a photoconversion sheet formed by at least the thermoplastic resin and a photoconversion material; step 2: roll-shaping and roll-cutting of a photoconversion sheet array: in a vacuum condition, performing roll-shaping and roll-cutting on the photoconversion sheet in step 1 cooperatively by using a first rolling device with a protrusion array and a second rolling device with a recess array that are disposed face-to-face and aligned with each other, to obtain a photoconversion sheet array formed by individual photoconversion sheets with recesses, a slit for separating the individual photoconversion sheets being formed between every two individual photoconversion sheets in the photoconversion sheet array; step 3: forming of LED package elements by roll-bonding: in a vacuum condition, performing roll-bonding on the photoconversion sheet array in step 2 and a flip chip LED array with a carrier sheet, the photoconversion sheet array and the flip chip LED array facing each other and being aligned with each other, such that flip chip LEDs in the flip chip LED array are bonded to and embedded in the recesses on the individual photoconversion sheets of the photoconversion sheet array, to obtain LED package elements, the flip chip LEDs referring to an individual flip chip LED or a flip chip LED assembly, and the flip chip LED assembly being composed of two or more individual flip chip LEDs; and step 4: curing of the LED package elements: in a vacuum condition, curing the LED package elements by cooling, such that the individual photoconversion sheets bonded to the flip chip LED array contract and naturally close up, to obtain finished LED package elements. step 1: preparation of a photoconversion sheet: acquiring a photoconversion sheet formed by at least the thermoplastic resin and a photoconversion material; step 2: roll-shaping and roll-cutting of a photoconversion sheet array: in a vacuum condition, performing roll-shaping and roll-cutting on the photoconversion sheet in step 1 cooperatively by using a first rolling device with a protrusion array and a second rolling device with a recess array that are disposed face-to-face and aligned with each other, to obtain a photoconversion sheet array formed by individual photoconversion sheets with recesses, a slit for separating the individual photoconversion sheets being formed between every two individual photoconversion sheets in the photoconversion sheet array; step 3: forming of LED package elements by roll-bonding: in a vacuum condition, performing roll-bonding on the photoconversion sheet array in step 2 and a flip chip LED array with a carrier sheet, the photoconversion sheet array and the flip chip LED array facing each other and being aligned with each other, such that flip chip LEDs in the flip chip LED array are bonded to and embedded in the recesses on the individual photoconversion sheets of the photoconversion sheet array, to obtain LED package elements, the flip chip LEDs referring to an individual flip chip LED or a flip chip LED assembly, and the flip chip LED assembly being composed of two or more individual flip chip LEDs; and step 4: curing of the LED package elements: in a vacuum condition, curing the LED package elements by cooling, such that the individual photoconversion sheets bonded to the flip chip LED array contract and naturally close up, to obtain finished LED package elements.