A method of manufacturing a device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the method comprising: providing a leadframe comprising a plurality of leadframe legs defining a plane, the leadframe legs interconnecting a main leadframe island to a leadframe sub-island, a plurality of input/output pads, and providing a plurality of z-axis sensor die leads arranged in the same or substantially the same plane as the plane defined by the leadframe legs; attaching at least one X-and Y-axis sensor die and at least one integrated circuit to be in physical and/or operational communication with the leadframe, the leadframe legs, the plurality of input/output pads, and the plurality of z-axis sensor die leads; attaching a Z-axis sensor die having a sensing direction, to the leadframe sub-island, the leadframe legs and the plurality of z-axis sensor die leads so that an initial sensing direction is oriented in the plane, or substantially in the plane, defined by the leadframe legs; providing operational communication between the z-axis sensor die and the z-axis die leads and each of the leadframe legs via leads; while the Z-axis sensor die is oriented with the Z-axis sensing direction in the initial Z-axis sensing direction, pre-encapsulating the Z-axis sensor die, some portion of the plurality of z-axis sensor die leads, leads and some portion of the leadframe legs in a pre-molding; after the pre-encapsulating step, re-positioning the pre-molding so that the Z-axis sensor die is oriented with another sensing direction that is oriented orthogonal, or substantially orthogonal, to the plane defined by the leadframe legs; and encapsulating the leadframe, the plurality of input/output pads, the plurality of Z-axis sensor die leads, the at least one X- and Y-axis sensor die, the at least one integrated circuit, and the pre-molding in a final molding. providing a leadframe comprising a plurality of leadframe legs defining a plane, the leadframe legs interconnecting a main leadframe island to a leadframe sub-island, a plurality of input/output pads, and providing a plurality of z-axis sensor die leads arranged in the same or substantially the same plane as the plane defined by the leadframe legs; attaching at least one X-and Y-axis sensor die and at least one integrated circuit to be in physical and/or operational communication with the leadframe, the leadframe legs, the plurality of input/output pads, and the plurality of z-axis sensor die leads; attaching a Z-axis sensor die having a sensing direction, to the leadframe sub-island, the leadframe legs and the plurality of z-axis sensor die leads so that an initial sensing direction is oriented in the plane, or substantially in the plane, defined by the leadframe legs; providing operational communication between the z-axis sensor die and the z-axis die leads and each of the leadframe legs via leads; while the Z-axis sensor die is oriented with the Z-axis sensing direction in the initial Z-axis sensing direction, pre-encapsulating the Z-axis sensor die, some portion of the plurality of z-axis sensor die leads, leads and some portion of the leadframe legs in a pre-molding; after the pre-encapsulating step, re-positioning the pre-molding so that the Z-axis sensor die is oriented with another sensing direction that is oriented orthogonal, or substantially orthogonal, to the plane defined by the leadframe legs; and encapsulating the leadframe, the plurality of input/output pads, the plurality of Z-axis sensor die leads, the at least one X- and Y-axis sensor die, the at least one integrated circuit, and the pre-molding in a final molding.