A wiring board, comprising: an inorganic insulating layer having a laser drilled through hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the laser drill side of the inorganic insulating layer; and a through conductor which adheres to an inner wall of the through hole and is connected with the conductive layer, the inorganic insulating layer comprising a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the through conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conductor portion composedof part of the through conductor which is located in gaps between the inorganic insulating particles, wherein the wiring board further comprises: a first resin layer, which is smaller in thickness than the inorganic insulating layer, interposed between the inorganic insulating layer and the conductive layer while being kept in contact with the inorganic insulating layer and the conductive layer, wherein one main face of the second section of the inorganic insulating layer located on a conductive layer side is exposed from the first resin layer, and the inner wall of the through hole includes a first region defined by a side face of the first resin layer, a second region defined by the one main face of the inorganic insulating layer exposed from the first resin layer, and a third region defined by a side face of the inorganic insulating layer. an inorganic insulating layer having a laser drilled through hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the laser drill side of the inorganic insulating layer; and a through conductor which adheres to an inner wall of the through hole and is connected with the conductive layer, the inorganic insulating layer comprising a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the through conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conductor portion composedof part of the through conductor which is located in gaps between the inorganic insulating particles, wherein the wiring board further comprises: a first resin layer, which is smaller in thickness than the inorganic insulating layer, interposed between the inorganic insulating layer and the conductive layer while being kept in contact with the inorganic insulating layer and the conductive layer, wherein one main face of the second section of the inorganic insulating layer located on a conductive layer side is exposed from the first resin layer, and the inner wall of the through hole includes a first region defined by a side face of the first resin layer, a second region defined by the one main face of the inorganic insulating layer exposed from the first resin layer, and a third region defined by a side face of the inorganic insulating layer. a first resin layer, which is smaller in thickness than the inorganic insulating layer, interposed between the inorganic insulating layer and the conductive layer while being kept in contact with the inorganic insulating layer and the conductive layer, wherein one main face of the second section of the inorganic insulating layer located on a conductive layer side is exposed from the first resin layer, and the inner wall of the through hole includes a first region defined by a side face of the first resin layer, a second region defined by the one main face of the inorganic insulating layer exposed from the first resin layer, and a third region defined by a side face of the inorganic insulating layer.