A semiconductor device having a package on package structure comprising: a bottom laminate substrate having a laminate window frame portion, wherein the laminate window frame portion is disposed along a periphery of the bottom laminate substrate; a top substrate mounting a top package, the top package having a full matrix footprint, wherein the top substrate includes a polyimide tape affixed to a metal layer, and a top die attached to the metal layer on an opposite side as the polyimide tape; a center cavity enclosed between the bottom laminate substrate, the laminate window frame and the top substrate to house the top die affixed back-to-back to a bottom die, the bottom die being affixed to the bottom laminate substrate; and interconnection patterns (170,172) included in the bottom laminate substrate, the laminate window frame and the center cavity, wherein the interconnection patterns provide electrical coupling between the metal layer, the top die, the bottom die, and a plurality of conductive bumps disposed on a bottom surface of the bottom laminate substrate, wherein the top substrate includes: a plurality of holes formed in the polyimide tape, the plurality of holes being arranged in a full matrix array pattern to match the full matrix footprint; and a plurality of metal lands of the metal layer, wherein each one of the plurality of holes exposes a corresponding one of the plurality of metal lands, wherein the top package having the full matrix footprint is mounted on the plurality of metals lands by means of contact elements. a bottom laminate substrate having a laminate window frame portion, wherein the laminate window frame portion is disposed along a periphery of the bottom laminate substrate; a top substrate mounting a top package, the top package having a full matrix footprint, wherein the top substrate includes a polyimide tape affixed to a metal layer, and a top die attached to the metal layer on an opposite side as the polyimide tape; a center cavity enclosed between the bottom laminate substrate, the laminate window frame and the top substrate to house the top die affixed back-to-back to a bottom die, the bottom die being affixed to the bottom laminate substrate; and interconnection patterns (170,172) included in the bottom laminate substrate, the laminate window frame and the center cavity, wherein the interconnection patterns provide electrical coupling between the metal layer, the top die, the bottom die, and a plurality of conductive bumps disposed on a bottom surface of the bottom laminate substrate, wherein the top substrate includes: a plurality of holes formed in the polyimide tape, the plurality of holes being arranged in a full matrix array pattern to match the full matrix footprint; and a plurality of metal lands of the metal layer, wherein each one of the plurality of holes exposes a corresponding one of the plurality of metal lands, wherein the top package having the full matrix footprint is mounted on the plurality of metals lands by means of contact elements. a plurality of holes formed in the polyimide tape, the plurality of holes being arranged in a full matrix array pattern to match the full matrix footprint; and a plurality of metal lands of the metal layer, wherein each one of the plurality of holes exposes a corresponding one of the plurality of metal lands, wherein the top package having the full matrix footprint is mounted on the plurality of metals lands by means of contact elements.