Lighting device with a front carrier, a rear carrier and a plurality of light-emitting diode chips, which when the lighting device is in operation emit light and release waste heat, wherein - the rear carrier is covered at least in places by the front carrier, - the light-emitting diode chips are arranged in such a way between the rear carrier and the front carrier that they form an array, - the light-emitting diodes are contacted electrically by means of the rear and/or of the front carrier (1, 2) and immobilised mechanically by the rear carrier and the front carrier, and - the front carrier is coupled thermally conductively to the light-emitting diode chips and comprises a light outcoupling face remote from the light-emitting diode chips, which light outcoupling face is constructed to release some of the waste heat released by the light-emitting diode chips into the surrounding environment, characterized in that - each light-emitting diode chip is provided for actuation with an electrical nominal power of 100 mW or less when the lighting device is in operation and has a light yield of 100 lm/W or more, - the distances (d C) between mutually adjacent light-emitting diode chips are selected to be sufficiently large for the array formed by the light-emitting diode chips to have an electrical power consumption relative to its base, on actuation of the light-emitting diode chips with the electrical nominal power, of less than or equal to 450 W/m 2, when the lighting device is in operation, and - the distances (d C) between mutually adjacent light-emitting diode chips are selected to be sufficiently small for the array formed by the light-emitting diode chips to emit light, in plan view onto the light outcoupling face, with an average luminance of greater than or equal to 2000 Cd/m 2, on actuation of the light-emitting diode chips with the electrical nominal power when the lighting device is in operation and the distances (d C) are less than or equal to 2.5 times a distance (d L) between the light outcoupling face and the light-emitting diode chips. - the rear carrier is covered at least in places by the front carrier, - the light-emitting diode chips are arranged in such a way between the rear carrier and the front carrier that they form an array, - the light-emitting diodes are contacted electrically by means of the rear and/or of the front carrier (1, 2) and immobilised mechanically by the rear carrier and the front carrier, and - the front carrier is coupled thermally conductively to the light-emitting diode chips and comprises a light outcoupling face remote from the light-emitting diode chips, which light outcoupling face is constructed to release some of the waste heat released by the light-emitting diode chips into the surrounding environment, - each light-emitting diode chip is provided for actuation with an electrical nominal power of 100 mW or less when the lighting device is in operation and has a light yield of 100 lm/W or more, - the distances (d C) between mutually adjacent light-emitting diode chips are selected to be sufficiently large for the array formed by the light-emitting diode chips to have an electrical power consumption relative to its base, on actuation of the light-emitting diode chips with the electrical nominal power, of less than or equal to 450 W/m 2, when the lighting device is in operation, and - the distances (d C) between mutually adjacent light-emitting diode chips are selected to be sufficiently small for the array formed by the light-emitting diode chips to emit light, in plan view onto the light outcoupling face, with an average luminance of greater than or equal to 2000 Cd/m 2, on actuation of the light-emitting diode chips with the electrical nominal power when the lighting device is in operation and the distances (d C) are less than or equal to 2.5 times a distance (d L) between the light outcoupling face and the light-emitting diode chips.