Lead-free solder foil between 50 μm and 600 μm thick, in order to connect metallic structural components and/or metallised/metal-coated structural components, i.e. metallic surface coatings of neighbouring structural components to one another, wherein the solder foil is built up in such a way, that in a soft solder matrix two or more wires are arranged in each case individually, parallel to one another and parallel to the strip edges, characterised in, - that these wires in each case arranged individually in the solder foil are formed as connecting wires, which display a core that is comprised of a higher melting point and at the same time more rigid metal, or metal alloy, compared to the soft solder matrix, such as copper or a copper-based alloy, silver or silver-based alloys, nickel or nickel-based alloys, gold or gold-based alloys, around which a jacket is arranged, made of a different metal or a different metal alloy, such as of pure tin or a tin-based alloy, or of indium or an indium-based alloy, and - that the jacket of the connecting wires, with reference to the overall diameter of the connecting wire has a sheath thickness of between 2 % and 20 %, and - that the connecting wires are arranged longitudinally in the direction of rolling, between two soft solder foils or two soft solder strips using roller cladding or by a "percentage height reduction of the starting strips", determined from the difference between the summary starting height of the strips without adding on the height of the connecting wires and the final height of the connecting foil with embedded connecting wires, with reference to the summary starting height of strips, are roller clad in percentage terms in the region of from more than 30 % to a maximum of 95 % and in this way are arranged firmly bonded in the soft solder matrix, and - that following the roller cladding process, above and below at least one of the cores of the connecting wires roller clad into the soft solder matrix, another sheath of soft solder materials is arranged, which is comprised of the region with the soft solder matrix and the sheath from jacket of connecting wires, which then in total amounts to at least 5 μm at the thinnest point, however to a maximum of 15 μm. - that these wires in each case arranged individually in the solder foil are formed as connecting wires, which display a core that is comprised of a higher melting point and at the same time more rigid metal, or metal alloy, compared to the soft solder matrix, such as copper or a copper-based alloy, silver or silver-based alloys, nickel or nickel-based alloys, gold or gold-based alloys, around which a jacket is arranged, made of a different metal or a different metal alloy, such as of pure tin or a tin-based alloy, or of indium or an indium-based alloy, and - that the jacket of the connecting wires, with reference to the overall diameter of the connecting wire has a sheath thickness of between 2 % and 20 %, and - that the connecting wires are arranged longitudinally in the direction of rolling, between two soft solder foils or two soft solder strips using roller cladding or by a "percentage height reduction of the starting strips", determined from the difference between the summary starting height of the strips without adding on the height of the connecting wires and the final height of the connecting foil with embedded connecting wires, with reference to the summary starting height of strips, are roller clad in percentage terms in the region of from more than 30 % to a maximum of 95 % and in this way are arranged firmly bonded in the soft solder matrix, and - that following the roller cladding process, above and below at least one of the cores of the connecting wires roller clad into the soft solder matrix, another sheath of soft solder materials is arranged, which is comprised of the region with the soft solder matrix and the sheath from jacket of connecting wires, which then in total amounts to at least 5 μm at the thinnest point, however to a maximum of 15 μm.