A display apparatus, comprising: a base layer having a first portion, a bend portion extended from the first portion and a second portion extended from the bend portion; an organic light-emitting diode (OLED) display unit disposed on an outer surface of the first portion of the base layer; an encapsulation film over the OLED display unit; a printed circuit film attached to the second portion of the base layer; a micro coating layer disposed over the bend portion of the base layer, wherein the micro coating layer is arranged to cover a part of the encapsulation film disposed on the first portion of the base layer; further comprising a first support layer attached on an inner surface of the first portion of the base layer and a second support layer attached on an inner surface of the second portion of the base layer, wherein the first support layer and the second support layer are separated from each other by the absence of support layer on an inner surface of the bend portion of the base layer, and wherein the first support layer and the encapsulation film are arranged such that the first support layer is extended further out toward the bend portion of the base layer than the encapsulation film; further comprising a support member interposed between the first support layer and the second support layer, the support member having a planar body portion and a rounded end portion which is arranged toward the bend portion of the base layer, wherein the planar body portion of the support member is thinner than the rounded end portion of the support member, and wherein a bottom surface of the planar body portion is in-line with a lowest edge of the rounded end portion for providing the support member with a flat bottom. a base layer having a first portion, a bend portion extended from the first portion and a second portion extended from the bend portion; an organic light-emitting diode (OLED) display unit disposed on an outer surface of the first portion of the base layer; an encapsulation film over the OLED display unit; a printed circuit film attached to the second portion of the base layer; a micro coating layer disposed over the bend portion of the base layer, wherein the micro coating layer is arranged to cover a part of the encapsulation film disposed on the first portion of the base layer; further comprising a first support layer attached on an inner surface of the first portion of the base layer and a second support layer attached on an inner surface of the second portion of the base layer, wherein the first support layer and the second support layer are separated from each other by the absence of support layer on an inner surface of the bend portion of the base layer, and wherein the first support layer and the encapsulation film are arranged such that the first support layer is extended further out toward the bend portion of the base layer than the encapsulation film; further comprising a support member interposed between the first support layer and the second support layer, the support member having a planar body portion and a rounded end portion which is arranged toward the bend portion of the base layer, wherein the planar body portion of the support member is thinner than the rounded end portion of the support member, and wherein a bottom surface of the planar body portion is in-line with a lowest edge of the rounded end portion for providing the support member with a flat bottom.