A molded cavity electronic package, comprising: a substrate; a plurality of leads, each lead being spaced apart from the substrate; a body of a solidified molding compound fixedly attached to the substrate and the plurality of leads; a lid that is fixedly connected to the body, wherein a space in between the lid, body and substrate defines a cavity in which an electronic component is arranged; wherein each lead among the plurality of leads penetrates the body from an inside of the package to an outside of the package; wherein each lead among the plurality of leads comprises: an inner part that extends within the inside of the package and that is substantially free of molding compound to allow one or more bondwires to be bonded thereto; a body part that extends within the body; and an outer part that extends on the outside of the package and that is substantially free of molding compound; wherein the electronic component comprises a semiconductor die mounted to the substrate and a plurality of bondwires extending between the semiconductor die and the inner parts of the plurality of leads; wherein, for each lead among the plurality of leads: a width of a lead end portion of the outer part is substantially smaller than a width of the inner part; the outer part comprises at least a clamping portion arranged directly adjacent the body part, the clamping portion being adapted to be clamped on both sides by a mold; the thickness of the lead lies in the range between 0.1 mm and 0.35 mm; a width of the clamping portion is at least 1.1 times larger than the width of the lead end portion; the width of the inner part lies in the range between 0.75 and 8 mm; the width of the lead end portion is larger than 0.25 mm; the width of the clamping portion, the width of the body part, and the width of the inner part are identical. a substrate; a plurality of leads, each lead being spaced apart from the substrate; a body of a solidified molding compound fixedly attached to the substrate and the plurality of leads; a lid that is fixedly connected to the body, wherein a space in between the lid, body and substrate defines a cavity in which an electronic component is arranged; wherein each lead among the plurality of leads penetrates the body from an inside of the package to an outside of the package; wherein each lead among the plurality of leads comprises: an inner part that extends within the inside of the package and that is substantially free of molding compound to allow one or more bondwires to be bonded thereto; a body part that extends within the body; and an outer part that extends on the outside of the package and that is substantially free of molding compound; an inner part that extends within the inside of the package and that is substantially free of molding compound to allow one or more bondwires to be bonded thereto; a body part that extends within the body; and an outer part that extends on the outside of the package and that is substantially free of molding compound; wherein the electronic component comprises a semiconductor die mounted to the substrate and a plurality of bondwires extending between the semiconductor die and the inner parts of the plurality of leads; wherein, for each lead among the plurality of leads: a width of a lead end portion of the outer part is substantially smaller than a width of the inner part; the outer part comprises at least a clamping portion arranged directly adjacent the body part, the clamping portion being adapted to be clamped on both sides by a mold; the thickness of the lead lies in the range between 0.1 mm and 0.35 mm; a width of the clamping portion is at least 1.1 times larger than the width of the lead end portion; the width of the inner part lies in the range between 0.75 and 8 mm; the width of the lead end portion is larger than 0.25 mm; the width of the clamping portion, the width of the body part, and the width of the inner part are identical. a width of a lead end portion of the outer part is substantially smaller than a width of the inner part; the outer part comprises at least a clamping portion arranged directly adjacent the body part, the clamping portion being adapted to be clamped on both sides by a mold; the thickness of the lead lies in the range between 0.1 mm and 0.35 mm; a width of the clamping portion is at least 1.1 times larger than the width of the lead end portion; the width of the inner part lies in the range between 0.75 and 8 mm; the width of the lead end portion is larger than 0.25 mm; the width of the clamping portion, the width of the body part, and the width of the inner part are identical.