An integrated device comprising: a printed circuit board, PCB; a package on package, PoP, device (1200, 1600, 1700, 1800, 1900, 2000) coupled to the printed circuit board, PCB, wherein the package on package, PoP, device (1200, 1600) comprises: a first package (1201, 1601, 1701, 1801, 2001) comprising a first electronic package component (1211, 1811), a first encapsulation layer and a gap controller (1270, 1570); and a second package (1202, 1902) coupled, via a plurality of package interconnects (1227, 1627, 2017), to the first package (1201, 1601, 1701, 1801, 2001) such that there is a spacing between the first electronic package component and the second package; the gap controller (1270, 1570) is configured to provide a minimun gap between the first electronic package component (1211, 1811) and the second package, the gap controller includes a spacer (1272, 1572) and an adhesive layer, wherein the height of the gap controller is about 10 to 100 microns, μm, and wherein the gap controller is located between the first electronic package component and the second package; the first encapsulation layer formed between the first electronic package component (1201, 1601, 1701, 1801, 2001) and the second package (1202, 1902), the first encapsulation layer at least partially encapsulates the gap controller (1270, 1570) including the spacer (1272, 1572) and the adhesive layer, and wherein the adhesive layer at least partially surrounds the spacer; and a second encapsulation layer that at least partially encapsulates the package on package, PoP, device (1200, 1600, 1700, 1800, 1900, 2000), wherein the integrated device provides cellular functionality, wireless fidelity, WiFi, functionality and Bluetooth functionality. a printed circuit board, PCB; a package on package, PoP, device (1200, 1600, 1700, 1800, 1900, 2000) coupled to the printed circuit board, PCB, wherein the package on package, PoP, device (1200, 1600) comprises: a first package (1201, 1601, 1701, 1801, 2001) comprising a first electronic package component (1211, 1811), a first encapsulation layer and a gap controller (1270, 1570); and a second package (1202, 1902) coupled, via a plurality of package interconnects (1227, 1627, 2017), to the first package (1201, 1601, 1701, 1801, 2001) such that there is a spacing between the first electronic package component and the second package; the gap controller (1270, 1570) is configured to provide a minimun gap between the first electronic package component (1211, 1811) and the second package, the gap controller includes a spacer (1272, 1572) and an adhesive layer, wherein the height of the gap controller is about 10 to 100 microns, μm, and wherein the gap controller is located between the first electronic package component and the second package; a first package (1201, 1601, 1701, 1801, 2001) comprising a first electronic package component (1211, 1811), a first encapsulation layer and a gap controller (1270, 1570); and a second package (1202, 1902) coupled, via a plurality of package interconnects (1227, 1627, 2017), to the first package (1201, 1601, 1701, 1801, 2001) such that there is a spacing between the first electronic package component and the second package; the gap controller (1270, 1570) is configured to provide a minimun gap between the first electronic package component (1211, 1811) and the second package, the gap controller includes a spacer (1272, 1572) and an adhesive layer, wherein the height of the gap controller is about 10 to 100 microns, μm, and wherein the gap controller is located between the first electronic package component and the second package; the first encapsulation layer formed between the first electronic package component (1201, 1601, 1701, 1801, 2001) and the second package (1202, 1902), the first encapsulation layer at least partially encapsulates the gap controller (1270, 1570) including the spacer (1272, 1572) and the adhesive layer, and wherein the adhesive layer at least partially surrounds the spacer; and a second encapsulation layer that at least partially encapsulates the package on package, PoP, device (1200, 1600, 1700, 1800, 1900, 2000), wherein the integrated device provides cellular functionality, wireless fidelity, WiFi, functionality and Bluetooth functionality.