A method of manufacturing a luminous panel comprising: - manufacturing a first substrate comprising: ∘ a stack of semiconductor layers forming inorganic semiconductor micro-LEDs; and ∘ an array of electric connections (26, 28) for the micro-LEDs, the manufacturing of the first substrate being carried out in such a way that the electric connections (26, 28) are arranged on a first surface of the first substrate; - manufacturing in a second silicon substrate, independently from the first substrate, an array of circuits for controlling the micro-LEDs based on transistors, said manufacturing being carried out so that: ∘ first connections for the control of the micro-LEDs are arranged on a first surface of the second substrate; ∘ and second connections (32, 42, 46) for the driving of the luminous panel are arranged on a second surface of the second substrate; - placing the first surfaces of the first substrate and of the second substrate one on the other and securing said surfaces to each other, to electrically connect the electric connections of the micro-LEDs with the first electric connections of the control circuits, thus obtaining a third substrate comprising an array of electronic microchips, each formed of the stacking of a micro-LED and of a control circuit; - manufacturing a microchip transfer structure (16, 64) comprising: ∘ a transfer substrate; ∘ and the array of microchips, each microchip being secured to the transfer substrate only by its micro-LED, and individualized by the forming of a trench into the third substrate around the microchip; - manufacturing a fourth substrate, independently from the transfer structure, comprising electric connections for supplying signals for driving the luminous panel, said connections being arranged on a first surface of the fourth substrate; - placing the transfer structure on the first surface of the fourth substrate, securing the microchips to the first surface of the fourth substrate to connect the second connections of the control circuits with the electric connections of the fourth substrate, and separating the microchips from the transfer substrate. - manufacturing a first substrate comprising: ∘ a stack of semiconductor layers forming inorganic semiconductor micro-LEDs; and ∘ an array of electric connections (26, 28) for the micro-LEDs, the manufacturing of the first substrate being carried out in such a way that the electric connections (26, 28) are arranged on a first surface of the first substrate; ∘ a stack of semiconductor layers forming inorganic semiconductor micro-LEDs; and ∘ an array of electric connections (26, 28) for the micro-LEDs, the manufacturing of the first substrate being carried out in such a way that the electric connections (26, 28) are arranged on a first surface of the first substrate; - manufacturing in a second silicon substrate, independently from the first substrate, an array of circuits for controlling the micro-LEDs based on transistors, said manufacturing being carried out so that: ∘ first connections for the control of the micro-LEDs are arranged on a first surface of the second substrate; ∘ and second connections (32, 42, 46) for the driving of the luminous panel are arranged on a second surface of the second substrate; ∘ first connections for the control of the micro-LEDs are arranged on a first surface of the second substrate; ∘ and second connections (32, 42, 46) for the driving of the luminous panel are arranged on a second surface of the second substrate; - placing the first surfaces of the first substrate and of the second substrate one on the other and securing said surfaces to each other, to electrically connect the electric connections of the micro-LEDs with the first electric connections of the control circuits, thus obtaining a third substrate comprising an array of electronic microchips, each formed of the stacking of a micro-LED and of a control circuit; - manufacturing a microchip transfer structure (16, 64) comprising: ∘ a transfer substrate; ∘ and the array of microchips, each microchip being secured to the transfer substrate only by its micro-LED, and individualized by the forming of a trench into the third substrate around the microchip; ∘ a transfer substrate; ∘ and the array of microchips, each microchip being secured to the transfer substrate only by its micro-LED, and individualized by the forming of a trench into the third substrate around the microchip; - manufacturing a fourth substrate, independently from the transfer structure, comprising electric connections for supplying signals for driving the luminous panel, said connections being arranged on a first surface of the fourth substrate; - placing the transfer structure on the first surface of the fourth substrate, securing the microchips to the first surface of the fourth substrate to connect the second connections of the control circuits with the electric connections of the fourth substrate, and separating the microchips from the transfer substrate.