A die mounting device configured to pick up a die from a sheet to which a wafer divided into multiple dies is affixed using a nozzle and mount the die on a target object, the die mounting device comprising: a board conveyance device for loading and fixing the target object at a mounting position, a tape supply device comprising a reel around which a tape for supplying components to the mounting device is wound; a head including the nozzle configured to be raised and lowered and to pick up die from the sheet or a component supplied from tape supply device; a peeling device configured to peel the die from the sheet by pushing the die to be picked up by the nozzle from underneath the sheet using a pusher pin; a component camera provided between the board conveyance device and the tape supply device and configured to image a die held by suction nozzle when suction nozzle holding the die passes above component camera and to output the image to a control device; a load measuring section configured to measure a load applied to the nozzle or the pusher pin; wherein the control device is configured to control the head and the peeling device such that the die is picked up by the nozzle by being peeled from the sheet with the pusher pin pushing the die from underneath the sheet in a state with the nozzle contacting the die, and determine whether the die has broken based on the load measured by the load measuring section when the die is pushed up by the pusher pin; and wherein the control device is configured to, when determining that the die has broken, control the mounting head to pick up the die using the nozzle and discard the die to a specified discard location remote of the peeling device on a path that avoids going above component camera and target object. a board conveyance device for loading and fixing the target object at a mounting position, a tape supply device comprising a reel around which a tape for supplying components to the mounting device is wound; a head including the nozzle configured to be raised and lowered and to pick up die from the sheet or a component supplied from tape supply device; a peeling device configured to peel the die from the sheet by pushing the die to be picked up by the nozzle from underneath the sheet using a pusher pin; a component camera provided between the board conveyance device and the tape supply device and configured to image a die held by suction nozzle when suction nozzle holding the die passes above component camera and to output the image to a control device; a load measuring section configured to measure a load applied to the nozzle or the pusher pin; wherein the control device is configured to control the head and the peeling device such that the die is picked up by the nozzle by being peeled from the sheet with the pusher pin pushing the die from underneath the sheet in a state with the nozzle contacting the die, and determine whether the die has broken based on the load measured by the load measuring section when the die is pushed up by the pusher pin; and wherein the control device is configured to, when determining that the die has broken, control the mounting head to pick up the die using the nozzle and discard the die to a specified discard location remote of the peeling device on a path that avoids going above component camera and target object.