An apparatus comprising: one or more integrated circuit devices (504, 506, 508); a speaker module comprising a base and a speaker driver; and a passive thermal-control system to conduct heat generated by the speaker module and by the one or more integrated circuit devices (504, 506, 508) to a housing component of the apparatus for external dissipation, the passive thermal-control system comprising: a heat sink, the heat sink generally cylindrical and centered about a central axis, the heat sink including an interior disk-like body that is substantially orthogonal to the central axis and thermally coupled to at least one of the one or more integrated circuit devices (504, 506, 508); a first heat spreader, the first heat spreader generally planar and attached to a first surface of the interior disk-like body; and a second heat spreader, the second heat spreader generally planar and attached to a surface of the speaker module that is substantially orthogonal to the central axis and faces a second surface of the interior disk-like body that is opposite the first surface of the interior disk-like body, wherein the second heat spreader is attached to the base of the speaker module and is located between the surface of the speaker module and a magnet of the speaker driver. one or more integrated circuit devices (504, 506, 508); a speaker module comprising a base and a speaker driver; and a passive thermal-control system to conduct heat generated by the speaker module and by the one or more integrated circuit devices (504, 506, 508) to a housing component of the apparatus for external dissipation, the passive thermal-control system comprising: a heat sink, the heat sink generally cylindrical and centered about a central axis, the heat sink including an interior disk-like body that is substantially orthogonal to the central axis and thermally coupled to at least one of the one or more integrated circuit devices (504, 506, 508); a first heat spreader, the first heat spreader generally planar and attached to a first surface of the interior disk-like body; and a second heat spreader, the second heat spreader generally planar and attached to a surface of the speaker module that is substantially orthogonal to the central axis and faces a second surface of the interior disk-like body that is opposite the first surface of the interior disk-like body, a heat sink, the heat sink generally cylindrical and centered about a central axis, the heat sink including an interior disk-like body that is substantially orthogonal to the central axis and thermally coupled to at least one of the one or more integrated circuit devices (504, 506, 508); a first heat spreader, the first heat spreader generally planar and attached to a first surface of the interior disk-like body; and a second heat spreader, the second heat spreader generally planar and attached to a surface of the speaker module that is substantially orthogonal to the central axis and faces a second surface of the interior disk-like body that is opposite the first surface of the interior disk-like body, wherein the second heat spreader is attached to the base of the speaker module and is located between the surface of the speaker module and a magnet of the speaker driver.