Method for producing an electronic sensor module for measuring at least one measured value, in particular for a transmission controller, wherein the method comprises the following steps: providing a printed circuit board element; providing a sensor element; providing a sensor carrier having a sensor receptacle for holding the sensor element, wherein the sensor receptacle has alignment elements for aligning the sensor element in the sensor receptacle, wherein the sensor carrier has electric connecting lines between solder pads of the sensor receptacle and electric solder pads (21, 22, 23) of a printed circuit board element contact side of the sensor carrier, wherein the sensor receptacle is formed on a side of the sensor carrier that faces away from the printed circuit board element contact side; applying first solder material to electric solder pads (21, 22, 23) of the printed circuit board element and/or to the electric solder pads (51, 52, 53) of the printed circuit board element contact side of the sensor carrier; arranging the sensor carrier with the electric solder pads (51, 52, 53) of the printed circuit board element contact side on the electric solder pads (21, 22, 23) of the printed circuit board element to produce a respective electric connection between the connecting line and the printed circuit board element via the first solder material; applying second solder material to electric connecting elements of the sensor element and/or to the solder pads of the sensor receptacle; arranging the sensor element in the sensor receptacle in such a way that the second solder material produces a respective electric connection between the electric connecting elements of the sensor element and the solder pads of the sensor receptacle via the second solder material; and reflow-soldering the first solder material and the second solder material in a common reflow soldering process. providing a printed circuit board element; providing a sensor element; providing a sensor carrier having a sensor receptacle for holding the sensor element, wherein the sensor receptacle has alignment elements for aligning the sensor element in the sensor receptacle, wherein the sensor carrier has electric connecting lines between solder pads of the sensor receptacle and electric solder pads (21, 22, 23) of a printed circuit board element contact side of the sensor carrier, wherein the sensor receptacle is formed on a side of the sensor carrier that faces away from the printed circuit board element contact side; applying first solder material to electric solder pads (21, 22, 23) of the printed circuit board element and/or to the electric solder pads (51, 52, 53) of the printed circuit board element contact side of the sensor carrier; arranging the sensor carrier with the electric solder pads (51, 52, 53) of the printed circuit board element contact side on the electric solder pads (21, 22, 23) of the printed circuit board element to produce a respective electric connection between the connecting line and the printed circuit board element via the first solder material; applying second solder material to electric connecting elements of the sensor element and/or to the solder pads of the sensor receptacle; arranging the sensor element in the sensor receptacle in such a way that the second solder material produces a respective electric connection between the electric connecting elements of the sensor element and the solder pads of the sensor receptacle via the second solder material; and reflow-soldering the first solder material and the second solder material in a common reflow soldering process.