An integrated circuit structure, comprising: a first dielectric material layer above a substrate; a first electrical interconnect feature and a second electrical interconnect feature embedded in the first dielectric material layer, the first and second electrical interconnect feature (210, 211) separated by a lateral distance (CD S); an intervening dielectric layer on the first dielectric material layer and on the first electrical interconnect feature and on the second interconnect feature; a recess between the first electrical interconnect feature and second electrical interconnect feature, the recess being the intervening dielectric and extending in the first dielectric material layer, the recess being on one side of the second electrical interconnect feature; an electrical conductive via post in the intervening dielectric layer, the bottom surface of the electrical conductive via post entirely in lateral contact with a top surface of the second electrical interconnect feature, the electrical conductive via post having a smaller bottom lateral dimension than a top lateral dimension of the second electrical interconnect features; a second dielectric material layer on the intervening dielectric layer and in the recess, the second dielectric material layer embedding the electrical conductive via post; and a third electrical interconnect feature embedded in the second dielectric material layer, the third electrical interconnect feature comprising an electrical conductive conductive fill, the electrical conductive fill having side walls and a bottom wall, the third electrical interconnect feature further comprising an electrical conductive liner along the side walls and the bottom wall of the electrical conductive fill and in electrical contact with the electrical conductive via post; wherein a height of the electrical conductive via post is larger than the lateral distance between the first and the second electrical interconnect feature (210, 211), and the second electrical interconnect feature and the electrical conductive via post and the third electrical interconnect feature are in electrical contact with each other. a first dielectric material layer above a substrate; a first electrical interconnect feature and a second electrical interconnect feature embedded in the first dielectric material layer, the first and second electrical interconnect feature (210, 211) separated by a lateral distance (CD S); an intervening dielectric layer on the first dielectric material layer and on the first electrical interconnect feature and on the second interconnect feature; a recess between the first electrical interconnect feature and second electrical interconnect feature, the recess being the intervening dielectric and extending in the first dielectric material layer, the recess being on one side of the second electrical interconnect feature; an electrical conductive via post in the intervening dielectric layer, the bottom surface of the electrical conductive via post entirely in lateral contact with a top surface of the second electrical interconnect feature, the electrical conductive via post having a smaller bottom lateral dimension than a top lateral dimension of the second electrical interconnect features; a second dielectric material layer on the intervening dielectric layer and in the recess, the second dielectric material layer embedding the electrical conductive via post; and a third electrical interconnect feature embedded in the second dielectric material layer, the third electrical interconnect feature comprising an electrical conductive conductive fill, the electrical conductive fill having side walls and a bottom wall, the third electrical interconnect feature further comprising an electrical conductive liner along the side walls and the bottom wall of the electrical conductive fill and in electrical contact with the electrical conductive via post; wherein a height of the electrical conductive via post is larger than the lateral distance between the first and the second electrical interconnect feature (210, 211), and the second electrical interconnect feature and the electrical conductive via post and the third electrical interconnect feature are in electrical contact with each other.