An apparatus for bonding a first substrate to a second substrate comprising: a first roller; a second roller configured to engage the first roller to form a nip; a first heater operatively connected to the first roller and configured to heat the first roller to a first temperature that is greater than a second temperature of the second roller; a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously; and a controller operatively connected to the first heater and the substrate transport, the controller being configured to: activate the first heater to heat the first roller to the first temperature; engage the second roller to the first roller to form the nip; operate the substrate transport to move the first substrate and the second substrate through the nip with a predetermined pattern of a hydrophobic material on the first side of the first substrate engaging a first side of the second substrate, a second side of the first substrate engaging the first roller and a second side of the second substrate engaging the second roller to enable the hydrophobic material in the predetermined pattern to bond the first substrate to the second substrate; and operate the first heater to heat the first roller to the first predetermined temperature to produce a temperature gradient in the nip to liquefy the hydrophobic material and enable a first portion of the hydrophobic material to penetrate the first substrate and a second portion of the hydrophobic material to penetrate the second substrate, the first portion being greater than the second portion. a first roller; a second roller configured to engage the first roller to form a nip; a first heater operatively connected to the first roller and configured to heat the first roller to a first temperature that is greater than a second temperature of the second roller; a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously; and a controller operatively connected to the first heater and the substrate transport, the controller being configured to: activate the first heater to heat the first roller to the first temperature; engage the second roller to the first roller to form the nip; operate the substrate transport to move the first substrate and the second substrate through the nip with a predetermined pattern of a hydrophobic material on the first side of the first substrate engaging a first side of the second substrate, a second side of the first substrate engaging the first roller and a second side of the second substrate engaging the second roller to enable the hydrophobic material in the predetermined pattern to bond the first substrate to the second substrate; and activate the first heater to heat the first roller to the first temperature; engage the second roller to the first roller to form the nip; operate the substrate transport to move the first substrate and the second substrate through the nip with a predetermined pattern of a hydrophobic material on the first side of the first substrate engaging a first side of the second substrate, a second side of the first substrate engaging the first roller and a second side of the second substrate engaging the second roller to enable the hydrophobic material in the predetermined pattern to bond the first substrate to the second substrate; and operate the first heater to heat the first roller to the first predetermined temperature to produce a temperature gradient in the nip to liquefy the hydrophobic material and enable a first portion of the hydrophobic material to penetrate the first substrate and a second portion of the hydrophobic material to penetrate the second substrate, the first portion being greater than the second portion.