A printed circuit board, PCB, laminated structure, comprising: a first substrate; a second substrate disposed to overlap with the first substrate; and an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates (220, 230), wherein the interposer assembly comprises: a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate; a signal via electrically coupling the first substrate and the second substrate (220, 230) and configured to transmit signals between the first substrate and the second substrate (220, 230); a ground via electrically coupled to the housing and configured to serve as a ground, wherein the ground via is positioned apart from the signal via by a predetermined distance; a metal coating layer disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates (220, 230); and a plurality of signal vias and a plurality of ground vias which are arranged at predetermined intervals along a circumference of the closed region, wherein signal vias are arranged on both sides of each ground via, characterized in that groupings of two consecutive signal vias are arranged with a ground via interposed between each grouping, and wherein each grouping of signal vias is configured to have a phase difference of 180 degrees between electromagnetic signals transmitted by each signal via of the grouping. a first substrate; a second substrate disposed to overlap with the first substrate; and an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates (220, 230), wherein the interposer assembly comprises: a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate; a signal via electrically coupling the first substrate and the second substrate (220, 230) and configured to transmit signals between the first substrate and the second substrate (220, 230); a ground via electrically coupled to the housing and configured to serve as a ground, wherein the ground via is positioned apart from the signal via by a predetermined distance; a metal coating layer disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates (220, 230); and a plurality of signal vias and a plurality of ground vias which are arranged at predetermined intervals along a circumference of the closed region, a housing configured to define a closed region between a top surface of the first substrate and a bottom surface of the second substrate; a signal via electrically coupling the first substrate and the second substrate (220, 230) and configured to transmit signals between the first substrate and the second substrate (220, 230); a ground via electrically coupled to the housing and configured to serve as a ground, wherein the ground via is positioned apart from the signal via by a predetermined distance; a metal coating layer disposed at inner and outer side surfaces of the housing and configured to shield signals, wherein the metal coating layer is non-continuously disposed along both the inner and outer side surfaces of the housing to be adjacent to signal emission devices mounted on the first and second substrates (220, 230); and a plurality of signal vias and a plurality of ground vias which are arranged at predetermined intervals along a circumference of the closed region, wherein signal vias are arranged on both sides of each ground via, characterized in that groupings of two consecutive signal vias are arranged with a ground via interposed between each grouping, and wherein each grouping of signal vias is configured to have a phase difference of 180 degrees between electromagnetic signals transmitted by each signal via of the grouping.