A package structure, comprising: an insulation layer; an electronic component embedded within the insulation layer, and comprising a first surface, a second surface opposite to the first surface and plural conducting terminals formed on the second surface of the electronic component, wherein the first surface of the electronic component is exposed from the insulation layer and coplanar with a top surface of the insulation layer; at least one thermal conduction structure embedded within the insulation layer, wherein the at least one thermal conduction structure is exposed from the insulation layer; and a first re-distribution block, wherein one part of the first re-distribution block is disposed on a bottom surface of the insulation layer, and the other part of the first re-distribution block is located in the insulation layer and connected with the at least one thermal conduction structure and at least one of the plural conducting terminals; and a heat dissipation device disposed on the top surface of the insulation layer and mounted onto the first surface of the electronic component; wherein the at least one thermal conduction structure surrounds lateral sides of the electronic component; wherein the package structure further comprises: plural mounting parts, wherein some of the mounting parts are disposed on the top surface of the insulation layer, and the other of the mounting parts are disposed on the bottom surface of the insulation layer; and and at least one passive component, wherein the at least one passive component is disposed and fixed on the corresponding mounting part disposed on the bottom surface of the insulation layer by soldering; characterized in that the at least one thermal conduction structure is coplanar with the top surface of the insulation layer; and the package structure further comprises at least two support parts and an inductor, wherein the at least two support parts are made of metallic materials, one terminal of each of the at least two support parts is disposed on the top surface and in contact with the corresponding thermal conduction structure, and the other terminal of each of the at least two support parts is configured to support and fix one side of the inductor, wherein the at least one passive component, the inductor and the at least one of the plural conducting terminals of the electronic component are electrically connected with each other through the first re-distribution block and the thermal conduction structure. an insulation layer; an electronic component embedded within the insulation layer, and comprising a first surface, a second surface opposite to the first surface and plural conducting terminals formed on the second surface of the electronic component, wherein the first surface of the electronic component is exposed from the insulation layer and coplanar with a top surface of the insulation layer; at least one thermal conduction structure embedded within the insulation layer, wherein the at least one thermal conduction structure is exposed from the insulation layer; and a first re-distribution block, wherein one part of the first re-distribution block is disposed on a bottom surface of the insulation layer, and the other part of the first re-distribution block is located in the insulation layer and connected with the at least one thermal conduction structure and at least one of the plural conducting terminals; and a heat dissipation device disposed on the top surface of the insulation layer and mounted onto the first surface of the electronic component; plural mounting parts, wherein some of the mounting parts are disposed on the top surface of the insulation layer, and the other of the mounting parts are disposed on the bottom surface of the insulation layer; and and at least one passive component, wherein the at least one passive component is disposed and fixed on the corresponding mounting part disposed on the bottom surface of the insulation layer by soldering; characterized in that the at least one thermal conduction structure is coplanar with the top surface of the insulation layer; and the package structure further comprises at least two support parts and an inductor, wherein the at least two support parts are made of metallic materials, one terminal of each of the at least two support parts is disposed on the top surface and in contact with the corresponding thermal conduction structure, and the other terminal of each of the at least two support parts is configured to support and fix one side of the inductor, wherein the at least one passive component, the inductor and the at least one of the plural conducting terminals of the electronic component are electrically connected with each other through the first re-distribution block and the thermal conduction structure.