An apparatus, comprising: a laser diode package (100; 300) including a rigid thermally conductive base member (102; 302) that includes a base member surface (103; 333) situated to support at least one laser diode assembly (104a, 104b, 104c, 104d; 304a, 304b), at least one electrode standoff (108, 110; 318, 320) secured to the base member surface (103; 333) that has at least one electrical lead (112, 114; 314, 316) having a first end (116a, 118a) and a second end (116b, 118b) with the first end (116a, 118a) secured to a lead surface of the electrode standoff (108, 110; 318, 320), and a lid member (146; 322) that includes a lid portion (148; 324); wherein the lid portion (148; 324) further comprises a plurality of side portions (150a, 150b, 150c, 150d; 326a, 326b, 326c, 326d) integrally formed with and extending from the lid portion (148; 324) and situated to be secured to the base member (102; 302) along at least a portion of a region of contact between edges of the side portions (150a, 150b, 150c, 150d; 326a, 326b, 326c, 326d) and the base member surface (103; 333) so as to define sides of the laser diode package (100; 300) wherein the side portions (150a, 150b, 150c, 150d; 326a, 326b, 326c, 326d) are flexibly secured to the base member (102; 302) at least in part with one or more of an epoxy, a weld, solder, a press-fit, snap-fit, or a braze; wherein at least one of the side portions (150a, 150b, 150c, 150d; 326a, 326b, 326c, 326d) includes a lead aperture (152, 154; 328, 330) situated to receive the second end (116b, 118b) of the secured electrical lead (112, 114; 314, 316) that is insertable through the lead aperture (152, 154; 328, 330) so that the lid member (146; 322) extends over the base member (102; 302) to enclose the laser diode package (100; 300). a laser diode package (100; 300) including a rigid thermally conductive base member (102; 302) that includes a base member surface (103; 333) situated to support at least one laser diode assembly (104a, 104b, 104c, 104d; 304a, 304b), at least one electrode standoff (108, 110; 318, 320) secured to the base member surface (103; 333) that has at least one electrical lead (112, 114; 314, 316) having a first end (116a, 118a) and a second end (116b, 118b) with the first end (116a, 118a) secured to a lead surface of the electrode standoff (108, 110; 318, 320), and a lid member (146; 322) that includes a lid portion (148; 324); wherein the lid portion (148; 324) further comprises a plurality of side portions (150a, 150b, 150c, 150d; 326a, 326b, 326c, 326d) integrally formed with and extending from the lid portion (148; 324) and situated to be secured to the base member (102; 302) along at least a portion of a region of contact between edges of the side portions (150a, 150b, 150c, 150d; 326a, 326b, 326c, 326d) and the base member surface (103; 333) so as to define sides of the laser diode package (100; 300) wherein the side portions (150a, 150b, 150c, 150d; 326a, 326b, 326c, 326d) are flexibly secured to the base member (102; 302) at least in part with one or more of an epoxy, a weld, solder, a press-fit, snap-fit, or a braze; wherein at least one of the side portions (150a, 150b, 150c, 150d; 326a, 326b, 326c, 326d) includes a lead aperture (152, 154; 328, 330) situated to receive the second end (116b, 118b) of the secured electrical lead (112, 114; 314, 316) that is insertable through the lead aperture (152, 154; 328, 330) so that the lid member (146; 322) extends over the base member (102; 302) to enclose the laser diode package (100; 300).