A method of inhibiting copper deposition on hair and facilitating the removal of copper deposited on hair comprising: a. applying to the hair a shampoo composition comprising: i. from 0.025% to 0.25% of a compound selected from the group consisting of ethylenediamine-N,N'-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N'-disuccinic acid (EDDS), salts of ethylenediamine-N,N'-disuccinic acid (EDDS), histidine, and mixtures thereof, by weight of the shampoo composition; ii. from 2% to 50% of one or more detersive surfactants, by weight of the shampoo composition; and iii. from 20% to 95% of a first aqueous carrier, by weight of the shampoo composition; b. rinsing the shampoo composition from the hair; c. applying to the hair a conditioner composition comprising: i. from 0.025% to 0.25% histidine, by weight of the conditioner composition; ii. a conditioner gel matrix comprising: 1. from 0.1% to 20% of one or more high melting point fatty compounds, by weight of the gel matrix; 2. from 0.1% to 10% of a cationic surfactant system, by weight of the gel matrix; and 3. at least 20% of a second aqueous carrier, by weight of the gel matrix; d. rinsing the conditioner composition from the hair; and e. applying to the hair a leave-on treatment comprising: i. from 0.025% to 0.25% of a compound selected from the group consisting of ethylenediamine-N,N'-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N'-disuccinic acid (EDDS), salts of ethylenediamine-N,N'-disuccinic acid (EDDS), and mixtures thereof, by weight of the leave-on treatment; ii. one or more rheology modifiers; and iii. at least 20% of a third aqueous carrier, by weight of the leave-on treatment. a. applying to the hair a shampoo composition comprising: i. from 0.025% to 0.25% of a compound selected from the group consisting of ethylenediamine-N,N'-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N'-disuccinic acid (EDDS), salts of ethylenediamine-N,N'-disuccinic acid (EDDS), histidine, and mixtures thereof, by weight of the shampoo composition; ii. from 2% to 50% of one or more detersive surfactants, by weight of the shampoo composition; and iii. from 20% to 95% of a first aqueous carrier, by weight of the shampoo composition; i. from 0.025% to 0.25% of a compound selected from the group consisting of ethylenediamine-N,N'-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N'-disuccinic acid (EDDS), salts of ethylenediamine-N,N'-disuccinic acid (EDDS), histidine, and mixtures thereof, by weight of the shampoo composition; ii. from 2% to 50% of one or more detersive surfactants, by weight of the shampoo composition; and iii. from 20% to 95% of a first aqueous carrier, by weight of the shampoo composition; b. rinsing the shampoo composition from the hair; c. applying to the hair a conditioner composition comprising: i. from 0.025% to 0.25% histidine, by weight of the conditioner composition; ii. a conditioner gel matrix comprising: 1. from 0.1% to 20% of one or more high melting point fatty compounds, by weight of the gel matrix; 2. from 0.1% to 10% of a cationic surfactant system, by weight of the gel matrix; and 3. at least 20% of a second aqueous carrier, by weight of the gel matrix; i. from 0.025% to 0.25% histidine, by weight of the conditioner composition; ii. a conditioner gel matrix comprising: 1. from 0.1% to 20% of one or more high melting point fatty compounds, by weight of the gel matrix; 2. from 0.1% to 10% of a cationic surfactant system, by weight of the gel matrix; and 3. at least 20% of a second aqueous carrier, by weight of the gel matrix; 1. from 0.1% to 20% of one or more high melting point fatty compounds, by weight of the gel matrix; 2. from 0.1% to 10% of a cationic surfactant system, by weight of the gel matrix; and 3. at least 20% of a second aqueous carrier, by weight of the gel matrix; d. rinsing the conditioner composition from the hair; and e. applying to the hair a leave-on treatment comprising: i. from 0.025% to 0.25% of a compound selected from the group consisting of ethylenediamine-N,N'-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N'-disuccinic acid (EDDS), salts of ethylenediamine-N,N'-disuccinic acid (EDDS), and mixtures thereof, by weight of the leave-on treatment; ii. one or more rheology modifiers; and iii. at least 20% of a third aqueous carrier, by weight of the leave-on treatment. i. from 0.025% to 0.25% of a compound selected from the group consisting of ethylenediamine-N,N'-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N'-disuccinic acid (EDDS), salts of ethylenediamine-N,N'-disuccinic acid (EDDS), and mixtures thereof, by weight of the leave-on treatment; ii. one or more rheology modifiers; and iii. at least 20% of a third aqueous carrier, by weight of the leave-on treatment.