An apparatus (100, 200, 300, 400, 500) for testing an optoelectronic device at a plurality of different temperatures, the apparatus comprising: an optoelectronic device stage (102, 202, 302, 402, 502); a cavity (104, 204, 304, 404) disposed within the optoelectronic device stage (102, 202, 302, 402, 502), the cavity (104, 204, 304, 404) being configured to accommodate the optoelectronic device such that the optoelectronic device is inset within the cavity (104, 204, 304, 404); a plurality of electrical contacts (106, 206, 306, 406, 506) positioned at least partially within the optoelectronic device stage (102, 202, 302, 402, 502) and operable to contact the optoelectronic device electrically, wherein the plurality of electrical contacts (106, 206, 306, 406, 506) are operable to transmit testing commands and testing data between the optoelectronic device and a testing controller; a temperature sensing device (108, 208, 308, 408, 508) positioned within the optoelectronic device stage (102, 202, 302, 402, 502) proximal to the cavity (104, 204, 304, 404) and the optoelectronic device, wherein the temperature sensing device (108, 208, 308, 408, 508)is operable to transmit temperature sensing data to a thermal controller; at least one spring (110, 210, 310, 410, 510) fixedly connected to the optoelectronic device stage (102, 202, 302, 402, 502) and a base (112, 212, 312, 412, 512), the at least one spring (110, 210, 310, 410, 510) being operable to bring the base (112, 212, 312, 412, 512) and the optoelectronic device stage (102, 202, 302, 402, 502) in thermal and mechanical communication; a thermal-adjustment device (114, 214, 314) mounted proximal to the base (112, 212, 312, 412, 512) and in thermal communication with the base (112, 212, 312, 412, 512), the thermal-adjustment device (114, 214, 314) being operable to exchange thermal energy with the base (112, 212, 312, 412, 512) according to temperature adjustment data transmitted from the thermal controller; a target stage (116, 216, 316, 416, 516) mounted proximal to the optoelectronic device stage (102, 202, 302, 402, 502)and operable to mechanically contact the optoelectronic device; and a target (118, 218, 318, 418) mounted within the target stage (116, 216, 316, 416, 516) and aligned with the optoelectronic device. an optoelectronic device stage (102, 202, 302, 402, 502); a cavity (104, 204, 304, 404) disposed within the optoelectronic device stage (102, 202, 302, 402, 502), the cavity (104, 204, 304, 404) being configured to accommodate the optoelectronic device such that the optoelectronic device is inset within the cavity (104, 204, 304, 404); a plurality of electrical contacts (106, 206, 306, 406, 506) positioned at least partially within the optoelectronic device stage (102, 202, 302, 402, 502) and operable to contact the optoelectronic device electrically, wherein the plurality of electrical contacts (106, 206, 306, 406, 506) are operable to transmit testing commands and testing data between the optoelectronic device and a testing controller; a temperature sensing device (108, 208, 308, 408, 508) positioned within the optoelectronic device stage (102, 202, 302, 402, 502) proximal to the cavity (104, 204, 304, 404) and the optoelectronic device, wherein the temperature sensing device (108, 208, 308, 408, 508)is operable to transmit temperature sensing data to a thermal controller; at least one spring (110, 210, 310, 410, 510) fixedly connected to the optoelectronic device stage (102, 202, 302, 402, 502) and a base (112, 212, 312, 412, 512), the at least one spring (110, 210, 310, 410, 510) being operable to bring the base (112, 212, 312, 412, 512) and the optoelectronic device stage (102, 202, 302, 402, 502) in thermal and mechanical communication; a thermal-adjustment device (114, 214, 314) mounted proximal to the base (112, 212, 312, 412, 512) and in thermal communication with the base (112, 212, 312, 412, 512), the thermal-adjustment device (114, 214, 314) being operable to exchange thermal energy with the base (112, 212, 312, 412, 512) according to temperature adjustment data transmitted from the thermal controller; a target stage (116, 216, 316, 416, 516) mounted proximal to the optoelectronic device stage (102, 202, 302, 402, 502)and operable to mechanically contact the optoelectronic device; and a target (118, 218, 318, 418) mounted within the target stage (116, 216, 316, 416, 516) and aligned with the optoelectronic device.