An electronic display, comprising: a light emitting diode layer including LED chips; a control circuitry layer to provide control signals to the LED chips; and an interposer between the LED layer and the control circuitry layer, the interposer including: a substrate with a first surface facing the LED layer and a second surface facing the control circuitry layer; and an array of conductive pillars extending through the substrate from the first surface to the second surface, first ends of the conductive pillars bonded with contacts of the LED chips and second ends of the conductive pillars bonded with contacts of the control circuitry layer to electrically connect the LED layer with the control circuitry layer, the interposer includes a first polymeric material bonding layer formed on the first surface of the substrate between the first end of the conductive pillars; the LED layer includes a second polymeric material bonding layer formed between the contacts of the LED chips; and the first polymeric material bonding layer and the second polymeric material bonding layer are bonded to each other to mechanically attach the LED layer to the interposer, wherein: the interposer includes a first dielectric material bonding layer between the second end of the conductive pillars on the second surface of the substrate; the control circuitry layer includes a second dielectric material bonding layer between the contacts of the control circuitry layer; and the first dielectric material bonding layer is bonded to the second dielectric material bonding layer to mechanically attach the control circuitry layer to the interposer, wherein the first and second dielectric material bonding layers are silicon oxide or an oxynitride layer. a light emitting diode layer including LED chips; a control circuitry layer to provide control signals to the LED chips; and an interposer between the LED layer and the control circuitry layer, the interposer including: a substrate with a first surface facing the LED layer and a second surface facing the control circuitry layer; and an array of conductive pillars extending through the substrate from the first surface to the second surface, first ends of the conductive pillars bonded with contacts of the LED chips and second ends of the conductive pillars bonded with contacts of the control circuitry layer to electrically connect the LED layer with the control circuitry layer, a substrate with a first surface facing the LED layer and a second surface facing the control circuitry layer; and an array of conductive pillars extending through the substrate from the first surface to the second surface, first ends of the conductive pillars bonded with contacts of the LED chips and second ends of the conductive pillars bonded with contacts of the control circuitry layer to electrically connect the LED layer with the control circuitry layer, the interposer includes a first polymeric material bonding layer formed on the first surface of the substrate between the first end of the conductive pillars; the LED layer includes a second polymeric material bonding layer formed between the contacts of the LED chips; and the first polymeric material bonding layer and the second polymeric material bonding layer are bonded to each other to mechanically attach the LED layer to the interposer, wherein: the interposer includes a first dielectric material bonding layer between the second end of the conductive pillars on the second surface of the substrate; the control circuitry layer includes a second dielectric material bonding layer between the contacts of the control circuitry layer; and the first dielectric material bonding layer is bonded to the second dielectric material bonding layer to mechanically attach the control circuitry layer to the interposer, wherein the first and second dielectric material bonding layers are silicon oxide or an oxynitride layer. the interposer includes a first dielectric material bonding layer between the second end of the conductive pillars on the second surface of the substrate; the control circuitry layer includes a second dielectric material bonding layer between the contacts of the control circuitry layer; and the first dielectric material bonding layer is bonded to the second dielectric material bonding layer to mechanically attach the control circuitry layer to the interposer, wherein the first and second dielectric material bonding layers are silicon oxide or an oxynitride layer.