A light emitting diode, LED,, comprising: a substrate that comprises: a body having a first surface and a second surface opposite to the first surface; a plurality of third pads disposed on the first surface; a fourth pad disposed on the first surface; a first electrode disposed on the second surface; a second electrode disposed on the second surface; a plurality of first vias traversing through the body and electrically coupling the third pads and the first electrode; and a second via traversing through the body and electrically coupling the fourth pad and the second electrode; and an LED chip that is flip-chip bonded to the substrate, the LED chip comprising: a transparent substrate; a first type semiconductor layer disposed on the transparent substrate; an active semiconductor layer disposed on the first type semiconductor layer; a second type semiconductor layer disposed on the active semiconductor layer; a first pad disposed on the second type semiconductor layer and electrically coupled to the third pads; a second pad disposed on the second type semiconductor layer and electrically coupled to the fourth pad; and a plurality of third vias; wherein the plurality of third vias traverse through the second type semiconductor layer and the active semiconductor layer, and wherein the plurality of third vias electrically couple the first pad and the first type semiconductor layer; the LED being characterized in that a peripheral side of the LED chip is flush with a peripheral side of the body of the substrate. a substrate that comprises: a body having a first surface and a second surface opposite to the first surface; a plurality of third pads disposed on the first surface; a fourth pad disposed on the first surface; a first electrode disposed on the second surface; a second electrode disposed on the second surface; a plurality of first vias traversing through the body and electrically coupling the third pads and the first electrode; and a second via traversing through the body and electrically coupling the fourth pad and the second electrode; and a body having a first surface and a second surface opposite to the first surface; a plurality of third pads disposed on the first surface; a fourth pad disposed on the first surface; a first electrode disposed on the second surface; a second electrode disposed on the second surface; a plurality of first vias traversing through the body and electrically coupling the third pads and the first electrode; and a second via traversing through the body and electrically coupling the fourth pad and the second electrode; and an LED chip that is flip-chip bonded to the substrate, the LED chip comprising: a transparent substrate; a first type semiconductor layer disposed on the transparent substrate; an active semiconductor layer disposed on the first type semiconductor layer; a second type semiconductor layer disposed on the active semiconductor layer; a first pad disposed on the second type semiconductor layer and electrically coupled to the third pads; a second pad disposed on the second type semiconductor layer and electrically coupled to the fourth pad; and a plurality of third vias; wherein the plurality of third vias traverse through the second type semiconductor layer and the active semiconductor layer, and wherein the plurality of third vias electrically couple the first pad and the first type semiconductor layer; the LED being characterized in that a peripheral side of the LED chip is flush with a peripheral side of the body of the substrate. a transparent substrate; a first type semiconductor layer disposed on the transparent substrate; an active semiconductor layer disposed on the first type semiconductor layer; a second type semiconductor layer disposed on the active semiconductor layer; a first pad disposed on the second type semiconductor layer and electrically coupled to the third pads; a second pad disposed on the second type semiconductor layer and electrically coupled to the fourth pad; and a plurality of third vias; wherein the plurality of third vias traverse through the second type semiconductor layer and the active semiconductor layer, and wherein the plurality of third vias electrically couple the first pad and the first type semiconductor layer; the LED being characterized in that a peripheral side of the LED chip is flush with a peripheral side of the body of the substrate.