An image sensor, the image sensor comprising: a plurality of semiconductor slices (302, 304, 305, 402, 404) having a uniform width, the plurality of semiconductor slices (302, 304, 305, 402, 404) being arranged to form a semi-rectangular shape defining boundaries of the image sensor, each of the plurality of semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices (302, 304, 305, 402, 404), wherein each semiconductor slice of the plurality of semiconductor slices (302, 304, 305, 402, 404) has a slice edge (326A, 326B, 328A, 328B, 340, 426A, 426B, 428A, 428B) defining a side of the semiconductor slice (302, 304, 305, 402, 404), and wherein each semiconductor slice (302, 304, 305, 402, 404) further comprises: a plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) having an uniform pixel pitch; a seal ring (330, 336, 338, 430, 432) enclosing the semiconductor slice (302, 304, 305, 402, 404); a column of row-driver circuitry (332, 334, 434, 436), wherein the column of the row-driver circuitry (332, 334, 434, 436) is positioned proximate to the plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) along a first side of the plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) and between the plurality of pixel arrays and the slice edge, characterized in that the plurality of semiconductor slices is formed of different lengths, each semiconductor slice further comprises a guard ring (325, 337, 342, 425, 427) surrounding the plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) of the semiconductor slice (302, 304, 305, 402, 404), and wherein the guard ring, the row-driver circuitry, the slice edge, the seal ring, a seal ring of another semiconductor slice disposed proximate to the semiconductor slice, a slice edge of the another semiconductor slice, and a guard ring of the another semiconductor slice have a combined width of less than or equal to two pixel pitches. a plurality of semiconductor slices (302, 304, 305, 402, 404) having a uniform width, the plurality of semiconductor slices (302, 304, 305, 402, 404) being arranged to form a semi-rectangular shape defining boundaries of the image sensor, each of the plurality of semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices (302, 304, 305, 402, 404), wherein each semiconductor slice of the plurality of semiconductor slices (302, 304, 305, 402, 404) has a slice edge (326A, 326B, 328A, 328B, 340, 426A, 426B, 428A, 428B) defining a side of the semiconductor slice (302, 304, 305, 402, 404), and wherein each semiconductor slice (302, 304, 305, 402, 404) further comprises: a plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) having an uniform pixel pitch; a seal ring (330, 336, 338, 430, 432) enclosing the semiconductor slice (302, 304, 305, 402, 404); a column of row-driver circuitry (332, 334, 434, 436), wherein the column of the row-driver circuitry (332, 334, 434, 436) is positioned proximate to the plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) along a first side of the plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) and between the plurality of pixel arrays and the slice edge, characterized in that a plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) having an uniform pixel pitch; a seal ring (330, 336, 338, 430, 432) enclosing the semiconductor slice (302, 304, 305, 402, 404); a column of row-driver circuitry (332, 334, 434, 436), wherein the column of the row-driver circuitry (332, 334, 434, 436) is positioned proximate to the plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) along a first side of the plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) and between the plurality of pixel arrays and the slice edge, characterized in that the plurality of semiconductor slices is formed of different lengths, each semiconductor slice further comprises a guard ring (325, 337, 342, 425, 427) surrounding the plurality of pixel arrays (306, 308, 310, 312, 314, 316, 318, 320, 406, 408, 410, 412, 414, 416, 420) of the semiconductor slice (302, 304, 305, 402, 404), and wherein the guard ring, the row-driver circuitry, the slice edge, the seal ring, a seal ring of another semiconductor slice disposed proximate to the semiconductor slice, a slice edge of the another semiconductor slice, and a guard ring of the another semiconductor slice have a combined width of less than or equal to two pixel pitches.