Radiation-emitting component comprising: - a semiconductor body, which is provided for emitting electromagnetic radiation from its front side, - a reflective optical element having a plurality of oblique, reflective side surfaces arranged circumferentially around the semiconductor body, and - a refractive optical element, which is disposed downstream of the reflective optical element in the emission direction of the semiconductor body, wherein - a first part of the radiation of the semiconductor body, which is emitted from the front side of the semiconductor body at a shallow angle of less than or equal to 60° relative to the front side, impinges on the reflective element, is directed into an outer region of a target region by the reflective element and in the process passes through an outer region of the refractive optical element, - a second part of the radiation of the semiconductor body, which is emitted from the front side of the semiconductor body at a comparatively steep angle relative to the front side, passes directly through the refractive element without first impinging on the reflective optical element and is concentrated into an inner region of a target region by the refractive element, and - a first and/or second opening (8, 9) of the reflective element, which are/is delimited by the oblique side surfaces of the reflective element, delimits an octagonal surface. - a semiconductor body, which is provided for emitting electromagnetic radiation from its front side, - a reflective optical element having a plurality of oblique, reflective side surfaces arranged circumferentially around the semiconductor body, and - a refractive optical element, which is disposed downstream of the reflective optical element in the emission direction of the semiconductor body, wherein - a first part of the radiation of the semiconductor body, which is emitted from the front side of the semiconductor body at a shallow angle of less than or equal to 60° relative to the front side, impinges on the reflective element, is directed into an outer region of a target region by the reflective element and in the process passes through an outer region of the refractive optical element, - a second part of the radiation of the semiconductor body, which is emitted from the front side of the semiconductor body at a comparatively steep angle relative to the front side, passes directly through the refractive element without first impinging on the reflective optical element and is concentrated into an inner region of a target region by the refractive element, and - a first and/or second opening (8, 9) of the reflective element, which are/is delimited by the oblique side surfaces of the reflective element, delimits an octagonal surface. - a first part of the radiation of the semiconductor body, which is emitted from the front side of the semiconductor body at a shallow angle of less than or equal to 60° relative to the front side, impinges on the reflective element, is directed into an outer region of a target region by the reflective element and in the process passes through an outer region of the refractive optical element, - a second part of the radiation of the semiconductor body, which is emitted from the front side of the semiconductor body at a comparatively steep angle relative to the front side, passes directly through the refractive element without first impinging on the reflective optical element and is concentrated into an inner region of a target region by the refractive element, and - a first and/or second opening (8, 9) of the reflective element, which are/is delimited by the oblique side surfaces of the reflective element, delimits an octagonal surface.