A method for manufacturing an electronic product, comprising: - providing a flexible substrate film, - printing (106, 107) a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, - providing substantially non-conductive adhesive to electronic component attachment locations on the substrate film prior to mounting thereon the at least one electronic surface-mountable component; characterized by - after providing the substantially non-conductive adhesive on the substrate film, disposing the at least one electronic surface-mountable component on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween and to retain the at least one electronic surface-mountable component at least temporarily in place, - after disposing the at least one electronic surface-mountable component on the substrate film, 3d-shaping, through thermoforming, the substrate film comprising the conductors, the conductive contact areas, and the at least one component thereon, and - further securing the physical connection between said at least one component and the substrate, wherein said at least one component is overmoulded so as to at least partly encapsulate it in the molded material, the molded material being plastics, to protect and further secure the component, wherein the substantially non-conductive adhesive is provided to secure the at least one component mechanically to the substrate film. - providing a flexible substrate film, - printing (106, 107) a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, - providing substantially non-conductive adhesive to electronic component attachment locations on the substrate film prior to mounting thereon the at least one electronic surface-mountable component; characterized by - after providing the substantially non-conductive adhesive on the substrate film, disposing the at least one electronic surface-mountable component on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween and to retain the at least one electronic surface-mountable component at least temporarily in place, - after disposing the at least one electronic surface-mountable component on the substrate film, 3d-shaping, through thermoforming, the substrate film comprising the conductors, the conductive contact areas, and the at least one component thereon, and - further securing the physical connection between said at least one component and the substrate, wherein said at least one component is overmoulded so as to at least partly encapsulate it in the molded material, the molded material being plastics, to protect and further secure the component, wherein the substantially non-conductive adhesive is provided to secure the at least one component mechanically to the substrate film.