An electronic device (400, 500, 600), comprising: a housing including a rear housing (410, 510, 610); a first board (420, 520, 620) disposed in a first direction from the rear housing (410, 510, 610) of the housing, wherein at least one processor is mounted at the first board (420, 520, 620); a second board (440; 540; 640) disposed between the rear housing (410, 510, 610) and the first board (420, 520, 620) and electrically connected with the first board (420, 520, 620), the second board (440, 540, 640) being spatially separated from the rear housing (410, 510, 610); a thermistor (430; 530; 630) mounted on the second board (440; 540; 640), wherein the thermistor (430; 530; 630) is disposed at a surface of the second board (440; 540; 640) in a second direction that is towards the rear housing (410, 510, 610), the second direction being opposite to the first direction; wherein a disposition space (415; 515; 615) of the thermistor (430; 530; 630) is secured by forming within the rear housing (410, 610) at least a partial area including a disposition area of the thermistor (430; 530) in a groove form and/or by disposing first structures (451, 452; 651, 652) at a side surface of the thermistor (430; 630), wherein the disposition space (415; 515; 615) is configured to block heat generated at adjacent other spaces of the electronic device (400, 500, 600), wherein the first structures (451, 452; 651, 652) are configured to support a pressure in the first direction and/or the second direction to prevent a physical impact and/or to block heat transferred from the outside to the disposition space (415; 515; 615); and wherein the at least one processor is configured to receive an electrical signal from the thermistor (430; 530; 630) for determining a temperature of the housing. a housing including a rear housing (410, 510, 610); a first board (420, 520, 620) disposed in a first direction from the rear housing (410, 510, 610) of the housing, wherein at least one processor is mounted at the first board (420, 520, 620); a second board (440; 540; 640) disposed between the rear housing (410, 510, 610) and the first board (420, 520, 620) and electrically connected with the first board (420, 520, 620), the second board (440, 540, 640) being spatially separated from the rear housing (410, 510, 610); a thermistor (430; 530; 630) mounted on the second board (440; 540; 640), wherein the thermistor (430; 530; 630) is disposed at a surface of the second board (440; 540; 640) in a second direction that is towards the rear housing (410, 510, 610), the second direction being opposite to the first direction; wherein a disposition space (415; 515; 615) of the thermistor (430; 530; 630) is secured by forming within the rear housing (410, 610) at least a partial area including a disposition area of the thermistor (430; 530) in a groove form and/or by disposing first structures (451, 452; 651, 652) at a side surface of the thermistor (430; 630), wherein the disposition space (415; 515; 615) is configured to block heat generated at adjacent other spaces of the electronic device (400, 500, 600), wherein the first structures (451, 452; 651, 652) are configured to support a pressure in the first direction and/or the second direction to prevent a physical impact and/or to block heat transferred from the outside to the disposition space (415; 515; 615); and wherein the at least one processor is configured to receive an electrical signal from the thermistor (430; 530; 630) for determining a temperature of the housing.