A signal handling device, comprising: a first substrate; a plurality of first conductors in the first substrate, the first conductors being arranged to form a substrate integrated waveguide; a second substrate; a plurality of second conductors in the second substrate, the second conductors being arranged to form a resonating cavity near one end of the substrate integrated waveguide; and a signal carrier aligned with the one end of the substrate integrated waveguide; wherein the signal handling device further comprises: a first conductive layer on one side of the first substrate, the first conductive layer being in conductive contact with the first conductors, the first conductive layer including a first opening aligned with the one end of the substrate integrated waveguide; a second conductive layer on an oppositely facing side of the first substrate, the second conductive layer being in conductive contact with the first conductors, the second conductive layer including a second opening aligned with the first opening; a third conductive layer on a side of the second substrate that faces away from the first substrate, the third conductive layer being in conductive contact with the second conductors and providing a cap over the resonating cavity established by the second conductors; characterized in that: an adhesive is provided wherein the adhesive is in contact with the second conductive layer, the adhesive securing the second substrate and the second conductive layer together; a conductive ribbon layer is provided, the conductive ribbon being in contact with the adhesive and the second substrate, the conductive ribbon layer being aligned with and in conductive contact with the second conductors. a first substrate; a plurality of first conductors in the first substrate, the first conductors being arranged to form a substrate integrated waveguide; a second substrate; a plurality of second conductors in the second substrate, the second conductors being arranged to form a resonating cavity near one end of the substrate integrated waveguide; and a signal carrier aligned with the one end of the substrate integrated waveguide; wherein the signal handling device further comprises: a first conductive layer on one side of the first substrate, the first conductive layer being in conductive contact with the first conductors, the first conductive layer including a first opening aligned with the one end of the substrate integrated waveguide; a second conductive layer on an oppositely facing side of the first substrate, the second conductive layer being in conductive contact with the first conductors, the second conductive layer including a second opening aligned with the first opening; a third conductive layer on a side of the second substrate that faces away from the first substrate, the third conductive layer being in conductive contact with the second conductors and providing a cap over the resonating cavity established by the second conductors; characterized in that: an adhesive is provided wherein the adhesive is in contact with the second conductive layer, the adhesive securing the second substrate and the second conductive layer together; a conductive ribbon layer is provided, the conductive ribbon being in contact with the adhesive and the second substrate, the conductive ribbon layer being aligned with and in conductive contact with the second conductors. a first conductive layer on one side of the first substrate, the first conductive layer being in conductive contact with the first conductors, the first conductive layer including a first opening aligned with the one end of the substrate integrated waveguide; a second conductive layer on an oppositely facing side of the first substrate, the second conductive layer being in conductive contact with the first conductors, the second conductive layer including a second opening aligned with the first opening; a third conductive layer on a side of the second substrate that faces away from the first substrate, the third conductive layer being in conductive contact with the second conductors and providing a cap over the resonating cavity established by the second conductors; characterized in that: an adhesive is provided wherein the adhesive is in contact with the second conductive layer, the adhesive securing the second substrate and the second conductive layer together; a conductive ribbon layer is provided, the conductive ribbon being in contact with the adhesive and the second substrate, the conductive ribbon layer being aligned with and in conductive contact with the second conductors. an adhesive is provided wherein the adhesive is in contact with the second conductive layer, the adhesive securing the second substrate and the second conductive layer together; a conductive ribbon layer is provided, the conductive ribbon being in contact with the adhesive and the second substrate, the conductive ribbon layer being aligned with and in conductive contact with the second conductors.