A method of manufacturing electroformed components (4A, 4B, 6A, 6B) comprising: forming a first opening by patterning a first photoresist layer formed on a front surface side of a conductive layer formed on a surface of a substrate, the first opening penetrating the first photoresist layer along a stacking direction of the conductive layer and the first photoresist layer; depositing a first electroformed member on the front surface side of the conductive layer in the first opening by electroforming using the conductive layer as one electrode; forming a first electroformed component (4A, 4B) by planarizing the front surface side of the first electroformed member and the first photoresist layer; removing the first photoresist layer from the conductive layer having the first electroformed component (4A, 4B) formed; forming a film for separation on a surface of the first electroformed component (4A, 4B) exposed by removing the first photoresist layer; forming a second opening by forming on the front surface side of the conductive layer, a second photoresist layer covering the first electroformed component (4A, 4B) from the front surface side and by patterning the second photoresist layer, the second opening penetrating the second photoresist layer along the stacking direction while a portion of the first electroformed component (4A, 4B) projects inward and the second opening partially overlaps the first electroformed component (4A, 4B) when the substrate is viewed in the plate thickness direction of the substrate; depositing a second electroformed member on the front surface side of the conductive layer in the second opening by electroforming using the conductive layer as one electrode; forming a second electroformed component (6A, 6B) by planarizing the front surface side of the second electroformed member and the second photoresist layer; removing the conductive layer from the first electroformed component (4A, 4B), the second electroformed component (6A, 6B), and the second photoresist layer; removing the second photoresist layer from the first electroformed component (4A, 4B) and the second electroformed component (6A, 6B) having the conductive layer removed; and taking out the first electroformed component (4A, 4B) and the second electroformed component (6a, 6B), individually. forming a first opening by patterning a first photoresist layer formed on a front surface side of a conductive layer formed on a surface of a substrate, the first opening penetrating the first photoresist layer along a stacking direction of the conductive layer and the first photoresist layer; depositing a first electroformed member on the front surface side of the conductive layer in the first opening by electroforming using the conductive layer as one electrode; forming a first electroformed component (4A, 4B) by planarizing the front surface side of the first electroformed member and the first photoresist layer; removing the first photoresist layer from the conductive layer having the first electroformed component (4A, 4B) formed; forming a film for separation on a surface of the first electroformed component (4A, 4B) exposed by removing the first photoresist layer; forming a second opening by forming on the front surface side of the conductive layer, a second photoresist layer covering the first electroformed component (4A, 4B) from the front surface side and by patterning the second photoresist layer, the second opening penetrating the second photoresist layer along the stacking direction while a portion of the first electroformed component (4A, 4B) projects inward and the second opening partially overlaps the first electroformed component (4A, 4B) when the substrate is viewed in the plate thickness direction of the substrate; depositing a second electroformed member on the front surface side of the conductive layer in the second opening by electroforming using the conductive layer as one electrode; forming a second electroformed component (6A, 6B) by planarizing the front surface side of the second electroformed member and the second photoresist layer; removing the conductive layer from the first electroformed component (4A, 4B), the second electroformed component (6A, 6B), and the second photoresist layer; removing the second photoresist layer from the first electroformed component (4A, 4B) and the second electroformed component (6A, 6B) having the conductive layer removed; and taking out the first electroformed component (4A, 4B) and the second electroformed component (6a, 6B), individually.