A method comprising: a) providing a substrate comprising a layer of photoresist, wherein the layer of photoresist comprises a plurality of apertures; b) providing a copper electroplating bath comprising one or more reaction products of one or more imidazole compounds having formula: wherein R 1, R 2 and R 3 may be the same or different and chosen from hydrogen atom, linear or branched (C 1 -C 10)alkyl; hydroxyl; linear or branched alkoxy; linear or branched hydroxy(C 10 -C 10)alkyl; linear or branched alkoxy(C 1 -C 10)alkyl; linear or branched, carboxy(C 1 -C 10)alkyl; linear or branched amino(C 1 -C 10)alkyl; and substituted or unsubstituted phenyl; one or more bisepoxides having formula: wherein R 4 and R 5 may be the same or different and are chosen from hydrogen and (C 1 -C 4)alkyl; R 6 and R 7 may be the same or different and are chosen from hydrogen, methyl and hydroxyl; m = 1-6 and n = 1-20; and one or more halobenzyl compounds having a formula: wherein R 8, R 9, R 10, R 11, R 12 and R 13 are independently chosen from hydrogen, linear or branched (C 1 -C 10)alkyl halide, and linear or branched (C 1 -C 10)alkyl with the proviso that at least two of R 8, R 9, R 10, R 11, R 12 and R 13 are alkyl halide in the same instance and with the proviso that R 8, R 10, and R 12, or R 9, R 11 and R 13 are not methyl groups in the same instance; an electrolyte; one or more sources of copper ions, one or more accelerators; and one or more suppressors; c) immersing the substrate comprising the layer of photoresist with the plurality of apertures in the copper electroplating bath; and d) electroplating a plurality of copper photoresist defined features in the plurality of apertures, the plurality of photoresist defined features comprise an average %TIR of 5% to 10% wherein %TIR is determined by the following equation: % TIR = height center − height edge / height max × 100 where height center is the height of a feature as measured along its center axis, height edge is the height of the feature as measured along its edge at the highest point on the edge and Height max is the height from the bottom of the feature to its highest point on its top. a) providing a substrate comprising a layer of photoresist, wherein the layer of photoresist comprises a plurality of apertures; b) providing a copper electroplating bath comprising one or more reaction products of one or more imidazole compounds having formula: wherein R 1, R 2 and R 3 may be the same or different and chosen from hydrogen atom, linear or branched (C 1 -C 10)alkyl; hydroxyl; linear or branched alkoxy; linear or branched hydroxy(C 10 -C 10)alkyl; linear or branched alkoxy(C 1 -C 10)alkyl; linear or branched, carboxy(C 1 -C 10)alkyl; linear or branched amino(C 1 -C 10)alkyl; and substituted or unsubstituted phenyl; one or more bisepoxides having formula: wherein R 4 and R 5 may be the same or different and are chosen from hydrogen and (C 1 -C 4)alkyl; R 6 and R 7 may be the same or different and are chosen from hydrogen, methyl and hydroxyl; m = 1-6 and n = 1-20; and one or more halobenzyl compounds having a formula: wherein R 8, R 9, R 10, R 11, R 12 and R 13 are independently chosen from hydrogen, linear or branched (C 1 -C 10)alkyl halide, and linear or branched (C 1 -C 10)alkyl with the proviso that at least two of R 8, R 9, R 10, R 11, R 12 and R 13 are alkyl halide in the same instance and with the proviso that R 8, R 10, and R 12, or R 9, R 11 and R 13 are not methyl groups in the same instance; an electrolyte; one or more sources of copper ions, one or more accelerators; and one or more suppressors; c) immersing the substrate comprising the layer of photoresist with the plurality of apertures in the copper electroplating bath; and d) electroplating a plurality of copper photoresist defined features in the plurality of apertures, the plurality of photoresist defined features comprise an average %TIR of 5% to 10% wherein %TIR is determined by the following equation: % TIR = height center − height edge / height max × 100 where height center is the height of a feature as measured along its center axis, height edge is the height of the feature as measured along its edge at the highest point on the edge and Height max is the height from the bottom of the feature to its highest point on its top.