Method for manufacturing an electrical or electronic component part, which comprises a conductor element and a plastic structure, wherein the conductor element has two contact points and a longitudinal portion disposed between them and bounded by a multiplicity of peripheral faces and wherein further the plastic structure is bonded securely to the conductor element in such a way that it encapsulates this within an overmolded portion overlapping its longitudinal portion along the entire periphery, with the following method steps: (a) providing a strip-like metal substrate comprising a plurality of conductor element blanks and a carrier structure joining these with one another; (b) making, by means of one or two laser light sources, groove-like depressions on all peripheral faces of the conductor element blanks, respectively on a texturing portion extending within the longitudinal portion of the subsequent conductor element, wherein - by means of one single laser light source, the groove-like depressions (9.I) are made on at least two primary peripheral faces (7.I) adjoining one another and forming a common edge (10.I), in such a way that a plurality of the groove-like depressions (9.I) extends in uninterrupted continuous manner into the at least two primary peripheral faces (7.I), and - one of the primary peripheral faces (7.I) and one further, secondary peripheral face (7.II) of the conductor element adjoin one another with formation of an edge (11, 12) and intersect at an angle smaller than or equal to 90° in cross-sectional view, wherein the groove-like depressions (9.I, 9.II) of the primary and of the secondary peripheral faces (7.I, 7.II) overlap one another in cross-sectional view; (c) separating a conductor element blank machined in method step (b) by detaching it from the carrier structure, especially by stamping; (d) overmolding the conductor element obtained from method step (c) within the overmolding portion on all peripheral faces with plastic to form the plastic structure, wherein the plastic of the plastic structure extends into the groove-like depressions, covered by it, of the conductor element. (a) providing a strip-like metal substrate comprising a plurality of conductor element blanks and a carrier structure joining these with one another; (b) making, by means of one or two laser light sources, groove-like depressions on all peripheral faces of the conductor element blanks, respectively on a texturing portion extending within the longitudinal portion of the subsequent conductor element, wherein - by means of one single laser light source, the groove-like depressions (9.I) are made on at least two primary peripheral faces (7.I) adjoining one another and forming a common edge (10.I), in such a way that a plurality of the groove-like depressions (9.I) extends in uninterrupted continuous manner into the at least two primary peripheral faces (7.I), and - one of the primary peripheral faces (7.I) and one further, secondary peripheral face (7.II) of the conductor element adjoin one another with formation of an edge (11, 12) and intersect at an angle smaller than or equal to 90° in cross-sectional view, wherein the groove-like depressions (9.I, 9.II) of the primary and of the secondary peripheral faces (7.I, 7.II) overlap one another in cross-sectional view; - by means of one single laser light source, the groove-like depressions (9.I) are made on at least two primary peripheral faces (7.I) adjoining one another and forming a common edge (10.I), in such a way that a plurality of the groove-like depressions (9.I) extends in uninterrupted continuous manner into the at least two primary peripheral faces (7.I), and - one of the primary peripheral faces (7.I) and one further, secondary peripheral face (7.II) of the conductor element adjoin one another with formation of an edge (11, 12) and intersect at an angle smaller than or equal to 90° in cross-sectional view, wherein the groove-like depressions (9.I, 9.II) of the primary and of the secondary peripheral faces (7.I, 7.II) overlap one another in cross-sectional view; (c) separating a conductor element blank machined in method step (b) by detaching it from the carrier structure, especially by stamping; (d) overmolding the conductor element obtained from method step (c) within the overmolding portion on all peripheral faces with plastic to form the plastic structure, wherein the plastic of the plastic structure extends into the groove-like depressions, covered by it, of the conductor element.