A semiconductor device package comprising: a substrate; a first electrode unit disposed on the substrate; a second electrode unit electrically disconnected from the first electrode unit and disposed on the substrate; a light emitting device disposed on the first electrode unit, wherein said light emitting device does not vertically overlap said second electrode; an insulating reflection layer disposed between the first electrode unit and the second electrode unit; and an optical lens disposed on the insulating reflection layer including a lens part and a curved part having opposite curvature than the lens part, wherein an upper surface of the insulating reflection layer is provided in a polygonal shape including a plurality of vertexes, the vertexes of the insulating reflection layer include at least one first point where a distance to a center of the substrate is within a first range, an angle (Θ) between the upper surface of the substrate and a contact line circumscribing a curved surface of the optical lens is 60 degrees to 90 degrees, wherein the contact line is tangent to the optical lens into an external contact point of the lens part and passes by an edge portion of the substrate and the at least one first point vertically overlaps a line which connects an external contact point between the contact line and the optical lens to a point at which the contact line contacts the substrate, characterized in that the vertexes of the insulating reflection layer comprise the first point and a second point where a distance to the center of the insulating reflection layer is less than the first range, and in that the first electrode unit includes a first region where the light emitting device is able to be disposed, and wherein a width of the first region of the first electrode unit in a first axis direction is two-fifth (2/5) to three-fifth (3/5) of a width of a first side of the substrate in the first axis direction. a substrate; a first electrode unit disposed on the substrate; a second electrode unit electrically disconnected from the first electrode unit and disposed on the substrate; a light emitting device disposed on the first electrode unit, wherein said light emitting device does not vertically overlap said second electrode; an insulating reflection layer disposed between the first electrode unit and the second electrode unit; and an optical lens disposed on the insulating reflection layer including a lens part and a curved part having opposite curvature than the lens part, wherein an upper surface of the insulating reflection layer is provided in a polygonal shape including a plurality of vertexes, the vertexes of the insulating reflection layer include at least one first point where a distance to a center of the substrate is within a first range, an angle (Θ) between the upper surface of the substrate and a contact line circumscribing a curved surface of the optical lens is 60 degrees to 90 degrees, wherein the contact line is tangent to the optical lens into an external contact point of the lens part and passes by an edge portion of the substrate and the at least one first point vertically overlaps a line which connects an external contact point between the contact line and the optical lens to a point at which the contact line contacts the substrate, characterized in that the vertexes of the insulating reflection layer comprise the first point and a second point where a distance to the center of the insulating reflection layer is less than the first range, and in that the first electrode unit includes a first region where the light emitting device is able to be disposed, and wherein a width of the first region of the first electrode unit in a first axis direction is two-fifth (2/5) to three-fifth (3/5) of a width of a first side of the substrate in the first axis direction.