A method for large sample analysis of thin film, the method comprising: maintaining a large area thin film at a predetermined angle with respect to a spatially non-scanning infrared radiation source, wherein: the large area thin film has a surface area ranging from about 6.5 square centimeters to about 8 square meters; and is a monolayer or has a film thickness up to about 10 μm; the large area thin film reflects infrared radiation and at least a portion of the large area thin film is electrically conductive; and the predetermined angle is selected from an angle ranging from about 0° to about 45°; while maintaining the large area thin film at the predetermined angle, directly illuminating the large area thin film with infrared radiation from the spatially non-scanning infrared radiation source; and thermal imaging reflected infrared radiation from the large area thin film by an infrared imaging device having an optical axis positioned at a fixed angle with respect to the large area thin film, wherein the fixed angle is selected from an angle ranging from about 0° to about 45°; wherein the spatially non-scanning infrared radiation source includes: an electric heating pad having a heatable surface; and a heat conductive sheet in contact with the heatable surface. maintaining a large area thin film at a predetermined angle with respect to a spatially non-scanning infrared radiation source, wherein: the large area thin film has a surface area ranging from about 6.5 square centimeters to about 8 square meters; and is a monolayer or has a film thickness up to about 10 μm; the large area thin film reflects infrared radiation and at least a portion of the large area thin film is electrically conductive; and the predetermined angle is selected from an angle ranging from about 0° to about 45°; the large area thin film has a surface area ranging from about 6.5 square centimeters to about 8 square meters; and is a monolayer or has a film thickness up to about 10 μm; the large area thin film reflects infrared radiation and at least a portion of the large area thin film is electrically conductive; and the predetermined angle is selected from an angle ranging from about 0° to about 45°; while maintaining the large area thin film at the predetermined angle, directly illuminating the large area thin film with infrared radiation from the spatially non-scanning infrared radiation source; and thermal imaging reflected infrared radiation from the large area thin film by an infrared imaging device having an optical axis positioned at a fixed angle with respect to the large area thin film, wherein the fixed angle is selected from an angle ranging from about 0° to about 45°; wherein the spatially non-scanning infrared radiation source includes: thermal imaging reflected infrared radiation from the large area thin film by an infrared imaging device having an optical axis positioned at a fixed angle with respect to the large area thin film, wherein the fixed angle is selected from an angle ranging from about 0° to about 45°; wherein the spatially non-scanning infrared radiation source includes: an electric heating pad having a heatable surface; and a heat conductive sheet in contact with the heatable surface.