Pane with at least one electrical connection element, comprising: - a substrate, - an electrically conductive structure on a region of the substrate, - a layer of a lead-free solder material on a region of the electrically conductive structure, and - a connection element on the solder material, wherein - the connection element contains a first and a second foot region (7,7'), a first and a second transition region (9,11), and a bridge region between the first and second transition region (9,11), - a first and a second contact surface (8,8') are located on the bottom of the first and second foot regions (7,7'), - the first and second contact surface (8,8') and the surfaces (9',11') of the first and second transition regions (9,11) facing the substrate are connected to the electrically conductive structure by the solder material, and - the angle between the surface of the substrate and each of the tangent planes of the surfaces (9',11') of the transition regions (9,11) facing the substrate is < 90°, characterized in that the substrate contains soda lime glass and the connection element contains a chromium-containing steel with a proportion of chromium greater than or equal to 10.5 wt.-% and a coefficient of thermal expansion of 9 x 10 -6 /°C to 13 x 10 -6 /°C, and wherein the difference between the coefficients of thermal expansion of the substrate and the connection element is smaller than 5 x 10 -6 /°C, and wherein at least one spacer is arranged on each of the contact surfaces (8, 8') which is formed in one piece with the connection element, and wherein on each of the surfaces of the foot regions (7, 7') facing away from the substrate, a contact bump is arranged which is formed in one piece with the connection element. - a substrate, - an electrically conductive structure on a region of the substrate, - a layer of a lead-free solder material on a region of the electrically conductive structure, and - a connection element on the solder material, wherein - the connection element contains a first and a second foot region (7,7'), a first and a second transition region (9,11), and a bridge region between the first and second transition region (9,11), - a first and a second contact surface (8,8') are located on the bottom of the first and second foot regions (7,7'), - the first and second contact surface (8,8') and the surfaces (9',11') of the first and second transition regions (9,11) facing the substrate are connected to the electrically conductive structure by the solder material, and - the angle between the surface of the substrate and each of the tangent planes of the surfaces (9',11') of the transition regions (9,11) facing the substrate is < 90°, characterized in that the substrate contains soda lime glass and the connection element contains a chromium-containing steel with a proportion of chromium greater than or equal to 10.5 wt.-% and a coefficient of thermal expansion of 9 x 10 -6 /°C to 13 x 10 -6 /°C, and wherein the difference between the coefficients of thermal expansion of the substrate and the connection element is smaller than 5 x 10 -6 /°C, and wherein at least one spacer is arranged on each of the contact surfaces (8, 8') which is formed in one piece with the connection element, and wherein on each of the surfaces of the foot regions (7, 7') facing away from the substrate, a contact bump is arranged which is formed in one piece with the connection element.