A material deposition system for depositing material on an electronic substrate, the material deposition system comprising: a frame (20; 202); a support coupled to the frame (20; 202), the support being configured to support an electronic substrate during a deposit operation; a gantry coupled to the frame (20; 202); a deposition head (206, 207) coupled to the gantry, the deposition head (206, 207) including a needle, the deposition head being movable over the support by movement of the gantry; a needle cleaner assembly (218, 300, 900) being a vacuum device and including orifices configured for inserting a tip of the needle of the deposition head (206, 207) to be cleaned; and a controller configured to control the operation of the needle cleaner assembly (218, 300, 900) to perform a needle cleaning operation, characterized in that the material deposition system comprises two deposition heads (206, 207), each including a needle, the needle cleaner assembly (218, 300, 900) being movable on a needle cleaner gantry to clean the needles of the deposition heads (206, 207) simultaneously, wherein the needle cleaner assembly (218, 300, 900) includes a base plate (304, 902) secured to the needle cleaner gantry by two brackets and two needle cleaners (302a, 302b, 906), one for each deposition head (206, 207), secured to the base plate (304, 902), the base plate (304, 902) having a slot formed therein to enable positioning of the two needle cleaners (302a, 302b, 906) during setup and calibration of the system, wherein a spacing between the two needle cleaners (302a, 302b, 906) is adjusted by sliding a first needle cleaner with respect to a second needle cleaner along a length of the base plate (304, 902) to correspond to a spacing between the two needles of the deposition heads (206, 207). a frame (20; 202); a support coupled to the frame (20; 202), the support being configured to support an electronic substrate during a deposit operation; a gantry coupled to the frame (20; 202); a deposition head (206, 207) coupled to the gantry, the deposition head (206, 207) including a needle, the deposition head being movable over the support by movement of the gantry; a needle cleaner assembly (218, 300, 900) being a vacuum device and including orifices configured for inserting a tip of the needle of the deposition head (206, 207) to be cleaned; and a controller configured to control the operation of the needle cleaner assembly (218, 300, 900) to perform a needle cleaning operation, characterized in that the material deposition system comprises two deposition heads (206, 207), each including a needle, the needle cleaner assembly (218, 300, 900) being movable on a needle cleaner gantry to clean the needles of the deposition heads (206, 207) simultaneously, wherein the needle cleaner assembly (218, 300, 900) includes a base plate (304, 902) secured to the needle cleaner gantry by two brackets and two needle cleaners (302a, 302b, 906), one for each deposition head (206, 207), secured to the base plate (304, 902), the base plate (304, 902) having a slot formed therein to enable positioning of the two needle cleaners (302a, 302b, 906) during setup and calibration of the system, wherein a spacing between the two needle cleaners (302a, 302b, 906) is adjusted by sliding a first needle cleaner with respect to a second needle cleaner along a length of the base plate (304, 902) to correspond to a spacing between the two needles of the deposition heads (206, 207).