A device for electrically interconnecting at least one electronic component with an electrical power supply, of the type comprising, during operation: - a first terminal, a second terminal, and a current conducting loop between the first terminal and the second terminal, - a first insulating substrate comprising a top plane surface and a bottom plane surface which are substantially parallel, - a first electrically conductive layer arranged in contact with the top surface of the first insulating substrate and including electrical current tracks and pads for connecting the or each electronic component, the first conductive layer forming a first current conducting plane, the conducting loop including the tracks and having an inductance, the device for electrically interconnecting comprising means for reducing the inductance of the conducting loop, the reduction means including a second electrically conductive layer arranged in contact with the bottom surface of the first insulating substrate, a second insulating substrate comprising a top plane surface and a bottom plane surface which are substantially parallel, and a third electrically conductive layer arranged in contact with the top surface of the second insulating substrate, the third conductive layer being fastened and electrically connected to the second conductive layer, the second and third conductive layers (44, 46) forming a second current conducting plane substantially parallel to the first conducting plane, the second conductive layer substantially being the transpose of the first conductive layer in a direction normal to the first plane, and an electrical link between the two conducting planes (P1, P2), the first terminal being connected to the first conducting plane, and the second terminal being connected to the second conducting plane so that the electrical current is capable of flowing from the first terminal to the second terminal in the two parallel conducting planes (P1, P2) through the electrical link, the flow direction of the current in the second plane being opposite to the flow direction of the current in the first plane, and further comprising at least one plate for connecting the or each electronic component to the corresponding track, the connecting plate comprising a top plane surface, a bottom plane surface substantially parallel, and an electrically conductive layer arranged in contact with the bottom surface, said conductive layer forming an additional current conducting plane, the additional plane being parallel to the first and second conducting planes (P1, P2), the flow direction of the current in the additional plane being the same as the flow direction of the current in the first plane, the electrical link being arranged externally to the or each insulating substrate (28, 30). - a first terminal, a second terminal, and a current conducting loop between the first terminal and the second terminal, - a first insulating substrate comprising a top plane surface and a bottom plane surface which are substantially parallel, - a first electrically conductive layer arranged in contact with the top surface of the first insulating substrate and including electrical current tracks and pads for connecting the or each electronic component, the first conductive layer forming a first current conducting plane, the conducting loop including the tracks and having an inductance, the device for electrically interconnecting comprising means for reducing the inductance of the conducting loop, the reduction means including a second electrically conductive layer arranged in contact with the bottom surface of the first insulating substrate, a second insulating substrate comprising a top plane surface and a bottom plane surface which are substantially parallel, and a third electrically conductive layer arranged in contact with the top surface of the second insulating substrate, the third conductive layer being fastened and electrically connected to the second conductive layer, the second and third conductive layers (44, 46) forming a second current conducting plane substantially parallel to the first conducting plane, the second conductive layer substantially being the transpose of the first conductive layer in a direction normal to the first plane, and an electrical link between the two conducting planes (P1, P2), the first terminal being connected to the first conducting plane, and the second terminal being connected to the second conducting plane so that the electrical current is capable of flowing from the first terminal to the second terminal in the two parallel conducting planes (P1, P2) through the electrical link, the flow direction of the current in the second plane being opposite to the flow direction of the current in the first plane, and further comprising at least one plate for connecting the or each electronic component to the corresponding track, the connecting plate comprising a top plane surface, a bottom plane surface substantially parallel, and an electrically conductive layer arranged in contact with the bottom surface, said conductive layer forming an additional current conducting plane, the additional plane being parallel to the first and second conducting planes (P1, P2), the flow direction of the current in the additional plane being the same as the flow direction of the current in the first plane, the electrical link being arranged externally to the or each insulating substrate (28, 30).