A light-emitting device package comprising: a light-emitting device; lead frames electrically connected to the light-emitting device; and a molding member for fixing the light-emitting device and the lead frames; a heat dissipation pad on which the light-emitting device is mounted; and bonding wires for electrically connecting the lead frames to the light-emitting device; wherein: the molding member is formed to surround the entire side of the light- emitting device; the upper surface of the light-emitting device is exposed to the outside of the molding member at the upper surface of the molding member; the lead frames are disposed to be spaced apart from each other at both sides of the heat dissipation pad; the lead frames comprise wire bonding regions connected to the bonding wires and protruded toward the light-emitting device; the wire bonding regions are exposed to the outside of the molding member at the upper surface of the molding member; the bottom surfaces of the lead frames are partially exposed to the outside of the molding member at the bottom surface of the molding member; a level of the upper surface of the molding member is the same as a level of the upper surfaces of the wire bonding regions; and a level of the bottom surface of the molding member is the same as a level of the bottom surface of the heat dissipation pad and a level of the bottom surfaces of the lead frames. a light-emitting device; lead frames electrically connected to the light-emitting device; and a molding member for fixing the light-emitting device and the lead frames; a heat dissipation pad on which the light-emitting device is mounted; and bonding wires for electrically connecting the lead frames to the light-emitting device; wherein: the molding member is formed to surround the entire side of the light- emitting device; the upper surface of the light-emitting device is exposed to the outside of the molding member at the upper surface of the molding member; the lead frames are disposed to be spaced apart from each other at both sides of the heat dissipation pad; the lead frames comprise wire bonding regions connected to the bonding wires and protruded toward the light-emitting device; the wire bonding regions are exposed to the outside of the molding member at the upper surface of the molding member; the bottom surfaces of the lead frames are partially exposed to the outside of the molding member at the bottom surface of the molding member; a level of the upper surface of the molding member is the same as a level of the upper surfaces of the wire bonding regions; and a level of the bottom surface of the molding member is the same as a level of the bottom surface of the heat dissipation pad and a level of the bottom surfaces of the lead frames. the molding member is formed to surround the entire side of the light- emitting device; the upper surface of the light-emitting device is exposed to the outside of the molding member at the upper surface of the molding member; the lead frames are disposed to be spaced apart from each other at both sides of the heat dissipation pad; the lead frames comprise wire bonding regions connected to the bonding wires and protruded toward the light-emitting device; the wire bonding regions are exposed to the outside of the molding member at the upper surface of the molding member; the bottom surfaces of the lead frames are partially exposed to the outside of the molding member at the bottom surface of the molding member; a level of the upper surface of the molding member is the same as a level of the upper surfaces of the wire bonding regions; and a level of the bottom surface of the molding member is the same as a level of the bottom surface of the heat dissipation pad and a level of the bottom surfaces of the lead frames.