A multi-chamber semiconductor processing apparatus (700; 800), comprising: at least two micro chambers (720, 740, 760) for receiving and processing a semiconductor wafer, each micro chamber including an upper chamber portion (722, 742, 762) defining an upper working surface and a lower chamber portion (724, 744, 764) defining a lower working surface, the upper chamber portion and the lower chamber portion being movable between an open position for loading or removing the semiconductor wafer and a closed position for receiving and processing the semiconductor wafer, wherein the upper working surface and the lower working surface are configured in such a way, that the semiconductor wafer can be disposed between the upper working surface and the lower working surface to define, between the semiconductor wafer and an inner wall of the micro chamber, one or more gaps that are adapted to process one or more flowing fluids when the upper chamber portion and the lower chamber portion are in the closed position; and wherein the at least two micro chambers including at least an inlet for the one or more processed fluids to enter into the at least two micro chambers and at least an outlet for discharging the one or more processed fluids out of the micro chamber, the multi-chamber semiconductor processing apparatus further comprises a plurality of columns running through the upper chamber portion and the lower chamber portion of each micro chamber of the at least two micro chambers, and wherein the upper chamber portion and the lower chamber portion are movable along the columns between the open position and the closed position, and the multi-chamber semiconductor processing apparatus further comprises a first drive device located below the lower chamber portion of a bottommost micro chamber or a second drive device located above the upper chamber portion of a topmost micro chamber, characterized in that, wherein the upper chamber portions of the at least two micro chambers are fixedly connected and the lower chamber portions of the at least two micro chambers are fixedly connected, wherein in case of presence of the first drive device the lower chamber portions of the at least two micro chambers are adapted to move up when the first drive device drives the lower chamber portion of the bottommost micro chamber to move up, and wherein in case of presence of the second drive device the upper chamber portions of the at least two micro chambers are adapted to move down under a guidance of the columns when the second drive device drives the upper chamber portion of the topmost micro chamber to move down. at least two micro chambers (720, 740, 760) for receiving and processing a semiconductor wafer, each micro chamber including an upper chamber portion (722, 742, 762) defining an upper working surface and a lower chamber portion (724, 744, 764) defining a lower working surface, the upper chamber portion and the lower chamber portion being movable between an open position for loading or removing the semiconductor wafer and a closed position for receiving and processing the semiconductor wafer, wherein the upper working surface and the lower working surface are configured in such a way, that the semiconductor wafer can be disposed between the upper working surface and the lower working surface to define, between the semiconductor wafer and an inner wall of the micro chamber, one or more gaps that are adapted to process one or more flowing fluids when the upper chamber portion and the lower chamber portion are in the closed position; and wherein the at least two micro chambers including at least an inlet for the one or more processed fluids to enter into the at least two micro chambers and at least an outlet for discharging the one or more processed fluids out of the micro chamber, the multi-chamber semiconductor processing apparatus further comprises a plurality of columns running through the upper chamber portion and the lower chamber portion of each micro chamber of the at least two micro chambers, and wherein the upper chamber portion and the lower chamber portion are movable along the columns between the open position and the closed position, and the multi-chamber semiconductor processing apparatus further comprises a first drive device located below the lower chamber portion of a bottommost micro chamber or a second drive device located above the upper chamber portion of a topmost micro chamber, characterized in that, wherein the upper chamber portions of the at least two micro chambers are fixedly connected and the lower chamber portions of the at least two micro chambers are fixedly connected, wherein in case of presence of the first drive device the lower chamber portions of the at least two micro chambers are adapted to move up when the first drive device drives the lower chamber portion of the bottommost micro chamber to move up, and wherein in case of presence of the second drive device the upper chamber portions of the at least two micro chambers are adapted to move down under a guidance of the columns when the second drive device drives the upper chamber portion of the topmost micro chamber to move down.