A flexible display device comprising: a substrate defined by a display area and a non-display area being an outer region of the display area, the non-display area including a link area and a pad area, and the substrate being formed of a flexible material; a plurality of gate lines and a plurality of data lines formed in the display area on the substrate, such that the gate lines and the data lines cross each other to define a plurality of pixel areas in the display area; a plurality of pads formed in the pad area, each pad being connected to an exterior circuit, the exterior circuit being configured to supply a driving signal to a signal line selected from signal lines including the gate line or/and the data line; a plurality of wiring links formed in the link area, the wiring links connecting the respective pads and the respective signal lines; and a plurality of insulation films (102, 103, 104, 105) formed over the surface of the substrate, the insulation films (102, 103, 104, 105) insulating conductive layers from one another; characterized in that the insulation films (102, 103, 104, 105) include a buffer film formed over the entire surface of the substrate, a gate insulation film formed between the buffer film and the gate lines, and an interlayer insulation film formed between the gate insulation film and the data lines, and a protective film formed on the interlayer insulation film, wherein the interlayer insulation film covers the gate lines, the protective film covers the data lines, the plurality of wiring links are formed on the interlayer insulation film, and the pads are formed on the protective film; and a first bending hole is formed in a bending area of the link area of the non-display area, wherein the first bending hole passes through the buffer film, the gate insulation film and the interlayer insulation film between one of the wiring links and the substrate, so that one of the wiring links includes a portion disposed inside the first bending hole, wherein the bending area is bent such that the pads are disposed on a back side of the surface of the substrate. a substrate defined by a display area and a non-display area being an outer region of the display area, the non-display area including a link area and a pad area, and the substrate being formed of a flexible material; a plurality of gate lines and a plurality of data lines formed in the display area on the substrate, such that the gate lines and the data lines cross each other to define a plurality of pixel areas in the display area; a plurality of pads formed in the pad area, each pad being connected to an exterior circuit, the exterior circuit being configured to supply a driving signal to a signal line selected from signal lines including the gate line or/and the data line; a plurality of wiring links formed in the link area, the wiring links connecting the respective pads and the respective signal lines; and a plurality of insulation films (102, 103, 104, 105) formed over the surface of the substrate, the insulation films (102, 103, 104, 105) insulating conductive layers from one another; characterized in that the insulation films (102, 103, 104, 105) include a buffer film formed over the entire surface of the substrate, a gate insulation film formed between the buffer film and the gate lines, and an interlayer insulation film formed between the gate insulation film and the data lines, and a protective film formed on the interlayer insulation film, wherein the interlayer insulation film covers the gate lines, the protective film covers the data lines, the plurality of wiring links are formed on the interlayer insulation film, and the pads are formed on the protective film; and a first bending hole is formed in a bending area of the link area of the non-display area, wherein the first bending hole passes through the buffer film, the gate insulation film and the interlayer insulation film between one of the wiring links and the substrate, so that one of the wiring links includes a portion disposed inside the first bending hole, wherein the bending area is bent such that the pads are disposed on a back side of the surface of the substrate.