A semiconductor package comprising: a semiconductor element (102; 202; 302; 602) provided with a circuit element (103; 203; 303; 603) on one surface (101a; 201a) of a semiconductor substrate (101; 201; 301; 601), the circuit element comprising a light receiving sensor and a microlens provided on the light receiving sensor; an external wiring region (110; 212; 310; 610) provided on another surface (101b; 201c) of said semiconductor substrate (101; 201; 301; 601); a support substrate (104; 204; 304; 604) disposed on the one surface (101a; 201a) of said semiconductor substrate (101; 201; 301; 601); an adhesive layer (105; 205; 305; 605) provided on the one surface (101a; 201a) of said semiconductor substrate (101; 201; 301; 601), the adhesive layer(105; 205; 305; 605) adhering and securing the one surface (101a; 201a) of said semiconductor substrate (101; 201; 301; 601) to the support substrate (104; 204; 304; 604), the adhesive layer (105; 205; 305; 605) having an adhesive layer pattern (105a; 305a) which has an opening in a region over the circuit element (103; 203; 303; 603), the adhesive layer pattern (105a; 305a) providing a gap (114; 314) over the circuit element (103; 203; 303; 603); an electrode pad (106; 206; 306; 606) disposed on the one surface (101a; 201a) of said semiconductor substrate (101; 201; 301; 601), the electrode pad (106; 206; 306; 606) having a bottom surface (106a; 206a; 606a), the electrode pad (106; 206; 306; 606) being provided in regions of the one surface (101a; 201a) of the semiconductor element (102; 202; 302; 602) where the circuit element is not formed; and a through-electrode (108; 220; 308; 608) which extends from said electrode pad (106; 206; 306; 606) through to the other surface (101b; 201c) of said semiconductor substrate (101; 201; 301; 601), the through-electrode (108; 210; 308; 608) having a section (108b; 208b) contacting the electrode pad (106; 206; 306; 606), the section being provided on the bottom surface (106a; 206a; 606a) of the electrode pad (106; 206; 306; 606). a semiconductor element (102; 202; 302; 602) provided with a circuit element (103; 203; 303; 603) on one surface (101a; 201a) of a semiconductor substrate (101; 201; 301; 601), the circuit element comprising a light receiving sensor and a microlens provided on the light receiving sensor; an external wiring region (110; 212; 310; 610) provided on another surface (101b; 201c) of said semiconductor substrate (101; 201; 301; 601); a support substrate (104; 204; 304; 604) disposed on the one surface (101a; 201a) of said semiconductor substrate (101; 201; 301; 601); an adhesive layer (105; 205; 305; 605) provided on the one surface (101a; 201a) of said semiconductor substrate (101; 201; 301; 601), the adhesive layer(105; 205; 305; 605) adhering and securing the one surface (101a; 201a) of said semiconductor substrate (101; 201; 301; 601) to the support substrate (104; 204; 304; 604), the adhesive layer (105; 205; 305; 605) having an adhesive layer pattern (105a; 305a) which has an opening in a region over the circuit element (103; 203; 303; 603), the adhesive layer pattern (105a; 305a) providing a gap (114; 314) over the circuit element (103; 203; 303; 603); an electrode pad (106; 206; 306; 606) disposed on the one surface (101a; 201a) of said semiconductor substrate (101; 201; 301; 601), the electrode pad (106; 206; 306; 606) having a bottom surface (106a; 206a; 606a), the electrode pad (106; 206; 306; 606) being provided in regions of the one surface (101a; 201a) of the semiconductor element (102; 202; 302; 602) where the circuit element is not formed; and a through-electrode (108; 220; 308; 608) which extends from said electrode pad (106; 206; 306; 606) through to the other surface (101b; 201c) of said semiconductor substrate (101; 201; 301; 601), the through-electrode (108; 210; 308; 608) having a section (108b; 208b) contacting the electrode pad (106; 206; 306; 606), the section being provided on the bottom surface (106a; 206a; 606a) of the electrode pad (106; 206; 306; 606).