A method for manufacturing a thin film capacitor comprising: forming an insulation film on a substrate; laminating an adhesion layer onto the insulation film; forming a lower electrode, which has a residual stress of -2000 to -100 MPa, on the adhesion layer; dissolving an organic barium compound, an organic strontium compound and a titanium alkoxide in an organic solvent to achieve a molar ratio of Ba:Sr:Ti = 1 - x: x: y, coating the resulting thin film formation Ba 1-x Sr x Ti y O 3 composition onto the lower electrode and drying in the atmosphere of air thereby forming a coating; forming a dielectric thin film by calcining the substrate with the coating formed thereon; and forming an upper electrode on the dielectric thin film, wherein the residual stress is calculated by an isoinclination method using an X-ray diffractometer, using a Poisson ratio of 0.38 and a Young's modulus of 168000 MPa, the x and y value are in the range 0.2<x<0.6 and 0.9<y<1.1; the composition is coated onto the lower electrode without performing an annealing process at a temperature higher than 300°C after forming the lower electrode; the drying temperature is within a range from ambient temperature to 500°C; the calcining temperature is within a range of 550 to 800°C; a thickness of the dielectric thin film formed after the first said calcining is 20 to 600 nm, a thickness of the lower electrode is 50 to 600 nm, the ratio between the thickness of the lower electrode and the thickness of the dielectric thin film formed after the first said calcining step (thickness of lower electrode / thickness of the dielectric thin film) is in the range 2.0 to 15.0, an average crystal grain size in the lower electrode is 100 nm or less, and the lower electrode has a crystal orientation to the face, face or the face. forming an insulation film on a substrate; laminating an adhesion layer onto the insulation film; forming a lower electrode, which has a residual stress of -2000 to -100 MPa, on the adhesion layer; dissolving an organic barium compound, an organic strontium compound and a titanium alkoxide in an organic solvent to achieve a molar ratio of Ba:Sr:Ti = 1 - x: x: y, coating the resulting thin film formation Ba 1-x Sr x Ti y O 3 composition onto the lower electrode and drying in the atmosphere of air thereby forming a coating; forming a dielectric thin film by calcining the substrate with the coating formed thereon; and forming an upper electrode on the dielectric thin film, wherein the residual stress is calculated by an isoinclination method using an X-ray diffractometer, using a Poisson ratio of 0.38 and a Young's modulus of 168000 MPa, the x and y value are in the range 0.2<x<0.6 and 0.9<y<1.1; the composition is coated onto the lower electrode without performing an annealing process at a temperature higher than 300°C after forming the lower electrode; the drying temperature is within a range from ambient temperature to 500°C; the calcining temperature is within a range of 550 to 800°C; a thickness of the dielectric thin film formed after the first said calcining is 20 to 600 nm, a thickness of the lower electrode is 50 to 600 nm, the ratio between the thickness of the lower electrode and the thickness of the dielectric thin film formed after the first said calcining step (thickness of lower electrode / thickness of the dielectric thin film) is in the range 2.0 to 15.0, an average crystal grain size in the lower electrode is 100 nm or less, and the lower electrode has a crystal orientation to the face, face or the face.