A method of manufacturing an extendable sensor system (30; 160), the method comprising: additively manufacturing, on a sacrificial substrate (20;120), the extendable sensor system (30;160) by performing the steps of: (a) depositing a first dielectric layer defining a lattice topology, the first dielectric layer comprising a curable material, and the lattice topology defining a perimeter; (b) depositing an electrically-conductive layer over the first dielectric layer, wherein: the electrically-conductive layer comprises a curable electrically-conductive material; the electrically-conductive layer is configured to provide electrical connections to a sensor array; and the electrically-conductive layer defines a pattern of interconnects (26; 122; 166); (c) depositing one or more sensors on the lattice topology, each of the one or more sensors being disposed at a point defined by an intersection of interconnects (26;122;166) and electrically connected to the electrical connections; (d) depositing a second dielectric layer over the electrically-conductive layer; (e) performing a release process, thereby releasing the extendable sensor system from the sacrificial substrate (20;120); (f) at least partially extending the extendible sensor system (30;160) prior to deploying the extendible sensor system (30;160); and (g) deploying the extendible sensor system (30;160) by positioning the system on a surface of an asset and adhering the system to the surface; wherein: the pattern of interconnects (26;122;166) comprises a plurality of extendable interconnects (26;122;166); at least some of the plurality of extendable interconnects (26;122;166) are arranged in a serpentine pattern that is configured to be expanded by straightening of the serpentine pattern, thereby extending the extendable sensor system (30;160); the extended extendable sensor system (30; 160) defines an extended sensor system topology; and the extended sensor system topology is configured to be disposed on the surface of an asset. (a) depositing a first dielectric layer defining a lattice topology, the first dielectric layer comprising a curable material, and the lattice topology defining a perimeter; (b) depositing an electrically-conductive layer over the first dielectric layer, wherein: the electrically-conductive layer comprises a curable electrically-conductive material; the electrically-conductive layer is configured to provide electrical connections to a sensor array; and the electrically-conductive layer defines a pattern of interconnects (26; 122; 166); the electrically-conductive layer comprises a curable electrically-conductive material; the electrically-conductive layer is configured to provide electrical connections to a sensor array; and the electrically-conductive layer defines a pattern of interconnects (26; 122; 166); (c) depositing one or more sensors on the lattice topology, each of the one or more sensors being disposed at a point defined by an intersection of interconnects (26;122;166) and electrically connected to the electrical connections; (d) depositing a second dielectric layer over the electrically-conductive layer; (e) performing a release process, thereby releasing the extendable sensor system from the sacrificial substrate (20;120); (f) at least partially extending the extendible sensor system (30;160) prior to deploying the extendible sensor system (30;160); and (g) deploying the extendible sensor system (30;160) by positioning the system on a surface of an asset and adhering the system to the surface; the pattern of interconnects (26;122;166) comprises a plurality of extendable interconnects (26;122;166); at least some of the plurality of extendable interconnects (26;122;166) are arranged in a serpentine pattern that is configured to be expanded by straightening of the serpentine pattern, thereby extending the extendable sensor system (30;160); the extended extendable sensor system (30; 160) defines an extended sensor system topology; and the extended sensor system topology is configured to be disposed on the surface of an asset.