A heat pump hot water supply apparatus comprising: a heat pump unit having a water refrigerant heat exchanger which heats low temperature water, a hot water reservoir tank unit having a hot water reservoir tank in which high temperature water heated by the water refrigerant heat exchanger is stored, a water pipe through which low temperature water in a lower portion of the hot water reservoir tank is sent to the water refrigerant heat exchanger, a boiling pipe through which high temperature water heated by the water refrigerant heat exchanger is sent to an upper portion of the hot water reservoir tank, wherein the boiling pipe is shorter than the water pipe, wherein an air suction space is formed within a range of a ceiling surface of the hot water reservoir tank unit on the side of a back surface of the heat pump unit, the air sucked into the heat pump unit is blown from a front of the heat pump unit, a high temperature-side connecting pipe connects a high temperature-side pipe connecting tool of the hot water reservoir tank unit and a high temperature-side pipe connecting tool of the heat pump unit, a low temperature-side connecting pipe connects a low temperature-side pipe connecting tool of the hot water reservoir tank unit and a low temperature-side pipe connecting tool of the heat pump unit, the high temperature-side pipe connecting tool of the hot water reservoir tank unit and the low temperature-side pipe connecting tool of the hot water reservoir tank unit are provided on a ceiling surface of the hot water reservoir tank unit, the high temperature-side pipe connecting tool of the heat pump unit and the low temperature-side pipe connecting tool of the heat pump unit are provided on a back surface of the heat pump unit, the high temperature-side connecting pipe and the low temperature-side connecting pipe are disposed within the range of the ceiling surface of the hot water reservoir tank unit and in a space of the side of the back surface of the heat pump unit, characterized in that the heat pump unit is placed on the ceiling surface of the hot water reservoir tank unit and in that the heat pump hot water supply apparatus further comprises a connecting unit which connects the ceiling surface of the hot water reservoir tank unit and a bottom surface of the heat pump unit with each other is disposed on the ceiling surface of the hot water reservoir tank unit. a heat pump unit having a water refrigerant heat exchanger which heats low temperature water, a hot water reservoir tank unit having a hot water reservoir tank in which high temperature water heated by the water refrigerant heat exchanger is stored, a water pipe through which low temperature water in a lower portion of the hot water reservoir tank is sent to the water refrigerant heat exchanger, a boiling pipe through which high temperature water heated by the water refrigerant heat exchanger is sent to an upper portion of the hot water reservoir tank, wherein the boiling pipe is shorter than the water pipe, wherein an air suction space is formed within a range of a ceiling surface of the hot water reservoir tank unit on the side of a back surface of the heat pump unit, the air sucked into the heat pump unit is blown from a front of the heat pump unit, a high temperature-side connecting pipe connects a high temperature-side pipe connecting tool of the hot water reservoir tank unit and a high temperature-side pipe connecting tool of the heat pump unit, a low temperature-side connecting pipe connects a low temperature-side pipe connecting tool of the hot water reservoir tank unit and a low temperature-side pipe connecting tool of the heat pump unit, the high temperature-side pipe connecting tool of the hot water reservoir tank unit and the low temperature-side pipe connecting tool of the hot water reservoir tank unit are provided on a ceiling surface of the hot water reservoir tank unit, the high temperature-side pipe connecting tool of the heat pump unit and the low temperature-side pipe connecting tool of the heat pump unit are provided on a back surface of the heat pump unit, the high temperature-side connecting pipe and the low temperature-side connecting pipe are disposed within the range of the ceiling surface of the hot water reservoir tank unit and in a space of the side of the back surface of the heat pump unit, characterized in that the heat pump unit is placed on the ceiling surface of the hot water reservoir tank unit and in that the heat pump hot water supply apparatus further comprises a connecting unit which connects the ceiling surface of the hot water reservoir tank unit and a bottom surface of the heat pump unit with each other is disposed on the ceiling surface of the hot water reservoir tank unit.