mhurhangee/ep-ind-claims huggingface dataset:
A radiation sensor comprising a plurality of pixels formed in and on a semiconductor substrate, each pixel comprising a microboard suspended above the substrate by thermal insulation arms (105a, 105b), the microboard comprising, in order starting from the upper face of the substrate: a conducting layer adapted to convert incident electromagnetic radiation into thermal energy; a passive optical shutter comprising a heat-sensitive layer covering one of the faces of the conducting layer, the heat-sensitive layer being thermally coupled to the conducting layer and having a reflection coefficient for the radiation to be detected that increases as a function of its temperature; and a thermistor covering the face of the heat-sensitive layer opposite the conducting layer. a conducting layer adapted to convert incident electromagnetic radiation into thermal energy; a passive optical shutter comprising a heat-sensitive layer covering one of the faces of the conducting layer, the heat-sensitive layer being thermally coupled to the conducting layer and having a reflection coefficient for the radiation to be detected that increases as a function of its temperature; and a thermistor covering the face of the heat-sensitive layer opposite the conducting layer.
An image forming system, comprising: an image forming apparatus to perform a plurality of types of jobs; and a host device coupled to the image forming apparatus; characterised in that the host device comprises: a storage unit arranged to store a count of a first type of job and a count of a second type of job, different from the first type of job, from among the plurality of types of jobs; and a controller arranged to increase the count of the first type of job based on the count of the second type of job, and to decrease the count of the second type of job in response to the increase of the count of the first type of job. an image forming apparatus to perform a plurality of types of jobs; and a host device coupled to the image forming apparatus; characterised in that the host device comprises: a storage unit arranged to store a count of a first type of job and a count of a second type of job, different from the first type of job, from among the plurality of types of jobs; and a controller arranged to increase the count of the first type of job based on the count of the second type of job, and to decrease the count of the second type of job in response to the increase of the count of the first type of job. a storage unit arranged to store a count of a first type of job and a count of a second type of job, different from the first type of job, from among the plurality of types of jobs; and a controller arranged to increase the count of the first type of job based on the count of the second type of job, and to decrease the count of the second type of job in response to the increase of the count of the first type of job.
An electrical equipment system, comprising: an electrical equipment component; a thermal management system configured to direct air over features of the electrical equipment component; a rectangular fan housing of the thermal management system; and a centrifugal fan disposed within the fan housing, wherein an axis of rotation of the centrifugal fan is offset relative to a geometric center point of the rectangular fan housing, wherein said offset of the centrifugal fan within the rectangular fan housing is optimized such that a high pressure zone between a first wall and an outer circumference of the centrifugal fan disposed a first distance from said first wall of the rectangular fan housing is larger than a low pressure zone between a second wall and the outer circumference of the centrifugal fan disposed a second distance from said second wall of the rectangular fan housing, wherein the first wall is opposite the second wall and wherein a ratio of the first distance to the second distance is 2.50 to 1.50. an electrical equipment component; a thermal management system configured to direct air over features of the electrical equipment component; a rectangular fan housing of the thermal management system; and a thermal management system configured to direct air over features of the electrical equipment component; a rectangular fan housing of the thermal management system; and a centrifugal fan disposed within the fan housing, wherein an axis of rotation of the centrifugal fan is offset relative to a geometric center point of the rectangular fan housing, wherein said offset of the centrifugal fan within the rectangular fan housing is optimized such that a high pressure zone between a first wall and an outer circumference of the centrifugal fan disposed a first distance from said first wall of the rectangular fan housing is larger than a low pressure zone between a second wall and the outer circumference of the centrifugal fan disposed a second distance from said second wall of the rectangular fan housing, wherein the first wall is opposite the second wall and wherein a ratio of the first distance to the second distance is 2.50 to 1.50.
A resin molded component comprising: a flange having a thickness and having a through-hole through the thickness of the flange; and a concave portion (40, 45) on a surface of the flange that is to face a component on which the flange is to be fitted, the concave portion (40, 45) having a bottom parallel with said surface and a wall extending across the thickness of the flange the bottom having a thickness, the wall having a thinnest portion and the thinnest portion of the wall having a thickness; characterized in that: the thickness of the resin material in the bottom of the concave portion (40, 45) is greater than the thickness of the resin material in the thinnest portion of the wall of the concave portion (40, 45), a sectional area for flowing molten resin material is relatively large in the bottom of the concave portion (40, 45) and a sectional area for flowing molten resin material is relatively small in the thinnest portion of the wall of the concave portion (40, 45), such that, during a molding process of the resin molded component in which the concave portion (40, 45) is upstream of an area in the flange at the periphery of the through-hole where flows of a molten resin material meet, a greater amount of the molten resin material flows along and thus from the bottom of the concave portion (40, 45) than from the thinnest portion of the wall of the concave portion (40, 45) into the area in the periphery of the through-hole where the flows of molten resin material meet. a flange having a thickness and having a through-hole through the thickness of the flange; and a concave portion (40, 45) on a surface of the flange that is to face a component on which the flange is to be fitted, the concave portion (40, 45) having a bottom parallel with said surface and a wall extending across the thickness of the flange the bottom having a thickness, the wall having a thinnest portion and the thinnest portion of the wall having a thickness; characterized in that: the thickness of the resin material in the bottom of the concave portion (40, 45) is greater than the thickness of the resin material in the thinnest portion of the wall of the concave portion (40, 45), a sectional area for flowing molten resin material is relatively large in the bottom of the concave portion (40, 45) and a sectional area for flowing molten resin material is relatively small in the thinnest portion of the wall of the concave portion (40, 45), such that, during a molding process of the resin molded component in which the concave portion (40, 45) is upstream of an area in the flange at the periphery of the through-hole where flows of a molten resin material meet, a greater amount of the molten resin material flows along and thus from the bottom of the concave portion (40, 45) than from the thinnest portion of the wall of the concave portion (40, 45) into the area in the periphery of the through-hole where the flows of molten resin material meet.
Moulded connection piece for installation in front of a wall, having an inlet connection which defines an inlet side of the moulded connection piece and through which water is able to be fed to an inflow channel defining a flow direction, an outflow channel which is arranged downstream of the inflow channel as seen in the flow direction and which has a first outlet connection defining an outlet side of the moulded connection piece, through which first outlet connection water is able to be discharged, and a housing part which defines a front side and a rear side and which serves for accommodating a water meter, wherein the housing part is connected at the inlet side to the inflow channel via a water inlet opening and at the outflow side to the outflow channel via a water outlet opening, and a bypass channel which is connected at one side to a second outlet connection and at the other side to the water outlet opening of the housing part, wherein at least the inflow channel, the outflow channel, the housing part and the bypass channel are formed as a one-piece integral component, characterized in that the bypass channel runs past the housing part such that the second outlet connection is arranged at the inlet side of the housing part, in that a channel wall delimiting the bypass channel is either shared at least sectionally with the housing part or is connected to the housing part via a connecting wall, and in that the inflow channel has a rectilinear channel portion defining a longitudinal axis (L Z), the bypass channel has a rectilinear portion defining a bypass longitudinal axis (L B), and the longitudinal axes (L Z, L B) of the inflow channel and the bypass channel run at least approximately parallel to one another.
Sensor which has a lever unit which is rotationally deflectably mounted in a bearing of a base unit, wherein the lever unit has a shaft, which is mounted by way of its shaft bearing portion in the bearing, and has a lever connected to said shaft, wherein the shaft has an encoder, and wherein the base unit has at least one sensor element which detects the encoder, wherein the bearing of the base unit has multiple detent means, in particular detent hooks and/or detent projections, which are arranged in encircling fashion on the inner shell of the bearing and which are formed as a single piece with the bearing, and wherein said detent means directly or indirectly hold and/or guide the shaft bearing portion, characterized in that in each case two mutually spaced-apart rows of detent means are arranged in encircling fashion on the inner shell of the bearing so as to be formed integrally with the bearing, and in that the shaft bearing portion of the lever unit has a groove in which a snap ring is arranged, which snap ring is configured such that, at the bearing side, it is received substantially in form-fitting fashion by the two rows of detent means. wherein the base unit has at least one sensor element which detects the encoder, wherein the bearing of the base unit has multiple detent means, in particular detent hooks and/or detent projections, which are arranged in encircling fashion on the inner shell of the bearing and which are formed as a single piece with the bearing, and wherein said detent means directly or indirectly hold and/or guide the shaft bearing portion, characterized in that in each case two mutually spaced-apart rows of detent means are arranged in encircling fashion on the inner shell of the bearing so as to be formed integrally with the bearing, and in that the shaft bearing portion of the lever unit has a groove in which a snap ring is arranged, which snap ring is configured such that, at the bearing side, it is received substantially in form-fitting fashion by the two rows of detent means.
A home appliance, comprising: an input device configured to receive an input signal from a user; a control panel, into which the input device is inserted and connected, the control panel including a sound through-hole; and a sound output device (170, 270) disposed at a rear surface of the control panel, that outputs sound information corresponding to product information of the home appliance through the sound through-hole to outside of the home appliance; and a sound guide formed on the rear surface of the control panel that guides the sound information output from the sound output device to the sound through-hole, characterised in that the sound guide comprises at least one sound guide rib (281, 282) formed on the rear surface of the control panel, that guides the sound information from the sound output device to the sound through-hole. an input device configured to receive an input signal from a user; a control panel, into which the input device is inserted and connected, the control panel including a sound through-hole; and a sound output device (170, 270) disposed at a rear surface of the control panel, that outputs sound information corresponding to product information of the home appliance through the sound through-hole to outside of the home appliance; and a sound guide formed on the rear surface of the control panel that guides the sound information output from the sound output device to the sound through-hole,
A method for producing an electrode material, comprising: a provisional sintering step of sintering a mixed powder containing a powder of a heat resistant element having at least one kind selected from elements including Mo, W, Ta, Nb, V, and Zr and a powder of Cr to obtain a solid solution where the heat resistant element and Cr are dissolved, the powder of the heat resistant element having a content of 6 to 76 wt% relative to the electrode material and the powder of Cr having a content of 1.5 to 64 wt% relative to the electrode material, the powder of the heat resistant element and the powder of Cr being mixed such that a weight ratio of Cr to the heat resistant element is 1/3 or less; a pulverizing step of pulverizing the solid solution to obtain a powder of the solid solution; a hot isostatic pressing treatment step of subjecting a molded body formed by molding the powder of the solid solution or a sintered body of the molded body to a hot isostatic pressing treatment; and an infiltration step of infiltrating Cu and/or Ag into an objective body obtained by the hot isostatic pressing treatment after the hot isostatic pressing treatment, Cu and/or Ag having a content of 25 to 60 wt% relative to the electrode material, wherein a filling rate of a molded body or a sintered body of the molded body after the hot isostatic pressing treatment is improved by 10 % or more in the hot isostatic pressing treatment step, as compared with a filling rate of a molded body or a sintered body of the molded body before the hot isostatic pressing treatment. a provisional sintering step of sintering a mixed powder containing a powder of a heat resistant element having at least one kind selected from elements including Mo, W, Ta, Nb, V, and Zr and a powder of Cr to obtain a solid solution where the heat resistant element and Cr are dissolved, the powder of the heat resistant element having a content of 6 to 76 wt% relative to the electrode material and the powder of Cr having a content of 1.5 to 64 wt% relative to the electrode material, the powder of the heat resistant element and the powder of Cr being mixed such that a weight ratio of Cr to the heat resistant element is 1/3 or less; a pulverizing step of pulverizing the solid solution to obtain a powder of the solid solution; a hot isostatic pressing treatment step of subjecting a molded body formed by molding the powder of the solid solution or a sintered body of the molded body to a hot isostatic pressing treatment; and an infiltration step of infiltrating Cu and/or Ag into an objective body obtained by the hot isostatic pressing treatment after the hot isostatic pressing treatment, Cu and/or Ag having a content of 25 to 60 wt% relative to the electrode material, wherein a filling rate of a molded body or a sintered body of the molded body after the hot isostatic pressing treatment is improved by 10 % or more in the hot isostatic pressing treatment step, as compared with a filling rate of a molded body or a sintered body of the molded body before the hot isostatic pressing treatment.
A computer-implemented method comprising: without locking, a reader process of a database management system, DBMS, obtaining, from metadata in persistent memory, PMEM, a first memory address for directly accessing a current version, which is a particular version, of a database block in PMEM; concurrently without locking: the reader process reading the particular version of the database block in the PMEM, and a writer process of the DBMS replacing, in the metadata in PMEM, the first memory address with a second memory address for directly accessing a new version of the database block in the PMEM; detecting that the particular version of the database block is stale by: obtaining, from said metadata in the PMEM, the second memory address for directly accessing the new version of the database block in PMEM, and comparing the first memory address for directly accessing the particular version of the database block in PMEM to the second memory address for directly accessing the new version of the database block in PMEM. without locking, a reader process of a database management system, DBMS, obtaining, from metadata in persistent memory, PMEM, a first memory address for directly accessing a current version, which is a particular version, of a database block in PMEM; concurrently without locking: the reader process reading the particular version of the database block in the PMEM, and a writer process of the DBMS replacing, in the metadata in PMEM, the first memory address with a second memory address for directly accessing a new version of the database block in the PMEM; the reader process reading the particular version of the database block in the PMEM, and a writer process of the DBMS replacing, in the metadata in PMEM, the first memory address with a second memory address for directly accessing a new version of the database block in the PMEM; detecting that the particular version of the database block is stale by: obtaining, from said metadata in the PMEM, the second memory address for directly accessing the new version of the database block in PMEM, and comparing the first memory address for directly accessing the particular version of the database block in PMEM to the second memory address for directly accessing the new version of the database block in PMEM. obtaining, from said metadata in the PMEM, the second memory address for directly accessing the new version of the database block in PMEM, and comparing the first memory address for directly accessing the particular version of the database block in PMEM to the second memory address for directly accessing the new version of the database block in PMEM.
A method comprising: applying a bond coat slurry on a silicon-based substrate, wherein the bond coat slurry comprises a bond coat patching material in a bond coat fluid carrier, wherein the bond coat patching material comprises a silicon-based powder, a bond coat binder, and a bond coat sintering aid, and wherein the silicon-based powder comprises a plurality of small particles with a median particle size less than 1 micrometre, a plurality of medium particles with median particle size in a range from 1 micrometre to 6 micrometres; and a plurality of large particles with median particle size greater than 6 micrometres, wherein the plurality of small particles is present in an amount in a range from 40 volume % to 90 volume %, the plurality of medium particles is present in an amount in a range from 5 volume % to 50 volume %, and the plurality of large particles is present in an amount in a range from 5 volume % to 50 volume % of the volume of the silicon-based powder; drying the bond coat slurry on the silicon-based substrate to form a dried bond coat; and sintering the dried bond coat in an oxidizing atmosphere to form a sintered bond coat on the silicon-based substrate. applying a bond coat slurry on a silicon-based substrate, wherein the bond coat slurry comprises a bond coat patching material in a bond coat fluid carrier, wherein the bond coat patching material comprises a silicon-based powder, a bond coat binder, and a bond coat sintering aid, and wherein the silicon-based powder comprises a plurality of small particles with a median particle size less than 1 micrometre, a plurality of medium particles with median particle size in a range from 1 micrometre to 6 micrometres; and a plurality of large particles with median particle size greater than 6 micrometres, wherein the plurality of small particles is present in an amount in a range from 40 volume % to 90 volume %, the plurality of medium particles is present in an amount in a range from 5 volume % to 50 volume %, and the plurality of large particles is present in an amount in a range from 5 volume % to 50 volume % of the volume of the silicon-based powder; drying the bond coat slurry on the silicon-based substrate to form a dried bond coat; and sintering the dried bond coat in an oxidizing atmosphere to form a sintered bond coat on the silicon-based substrate.
A method of operating a non-volatile memory device, comprising: configuring a charge pump coupled to the memory device to generate a first voltage of a first polarity during a program operation and a second voltage of a second polarity during an erase operation, and characterised in that a magnitude of the second voltage is less than or equal to a magnitude of the first voltage, and wherein the method further comprises configuring the charge pump to output the first voltage in a bypass mode during a stability capacitor charging state, wherein a stability capacitor, having a first terminal and a second terminal, is part of the charge pump and the charge pump is connected to the memory device during the capacitor charging state, and closing a first switch and a second switch during the program operation to conduct the first voltage to the memory device thereby providing the bypass mode, wherein: the first switch has a first terminal connected to a supply input, and a second terminal connected to the first terminal of the stability capacitor; and the second switch has a first terminal connected to the first terminal of the stability capacitor, and a second terminal connected to a positive output terminal. configuring a charge pump coupled to the memory device to generate a first voltage of a first polarity during a program operation and a second voltage of a second polarity during an erase operation, and characterised in that a magnitude of the second voltage is less than or equal to a magnitude of the first voltage, and wherein the method further comprises configuring the charge pump to output the first voltage in a bypass mode during a stability capacitor charging state, wherein a stability capacitor, having a first terminal and a second terminal, is part of the charge pump and the charge pump is connected to the memory device during the capacitor charging state, and closing a first switch and a second switch during the program operation to conduct the first voltage to the memory device thereby providing the bypass mode, wherein: the first switch has a first terminal connected to a supply input, and a second terminal connected to the first terminal of the stability capacitor; and the second switch has a first terminal connected to the first terminal of the stability capacitor, and a second terminal connected to a positive output terminal.