A baking device, in particular a baking oven, for producing moulded bodies baked under overpressure, preferably crispy brittle wafers, from a baking mass, comprising an endless conveyor and a plurality of baking plate devices provided along the endless conveyor and arranged successively, one after the other, passing through: - a baking mass application region for applying a baking mass to an opened baking plate device, in particular to its baking plates, - a closing region for closing the baking plate devices, - a baking chamber for baking the baking masses located in the closed baking plate devices, wherein at least one heating device is provided in the baking chamber for heating the baking plate devices located in the baking chamber, in particular the baking plates, - an opening region for opening the baking plate devices, - and a wafer removal region for removing the baked moulded bodies from the opened baking plate devices, wherein the baking plate devices, in particular the baking tongs, each comprise: two baking plates, and connecting devices arranged on both sides of the baking plates, - wherein the connecting devices are designed in such a way that the baking plate device is openable, closable and lockable in the closed position to form an overpressure baking mould, - wherein the baking plates have a baking surface facing the overpressure baking mould on one side and at least one back surface on the opposite side, in particular the back side of the baking plate, - wherein the baking plate device, in particular the baking plates, is designed in such a way that it is heatable by an induction heating device acting via an inductor gap, - and wherein the at least one back surface of the baking plate device, in particular of the baking plates, is formed as one side of the inductor gap, - wherein the at least one back surface of the baking plates follows a plane and is, in particular, plane-shaped, - wherein the baking plates each have at least one tensioning device for pretensioning the respective baking plate against the pressure arising during baking of the baking mass in the overpressure baking mould, - wherein the heating device comprises at least one induction heating device, - and wherein the at least one induction heating device heats the baking plate, in particular the at least one back surface of the baking plate, via the inductor gap, characterised - in that the at least one tensioning device is arranged between the at least one back surface and the baking surface, in particular within the baking plate, - a baking mass application region for applying a baking mass to an opened baking plate device, in particular to its baking plates, - a closing region for closing the baking plate devices, - a baking chamber for baking the baking masses located in the closed baking plate devices, wherein at least one heating device is provided in the baking chamber for heating the baking plate devices located in the baking chamber, in particular the baking plates, - an opening region for opening the baking plate devices, - and a wafer removal region for removing the baked moulded bodies from the opened baking plate devices, - wherein the connecting devices are designed in such a way that the baking plate device is openable, closable and lockable in the closed position to form an overpressure baking mould, - wherein the baking plates have a baking surface facing the overpressure baking mould on one side and at least one back surface on the opposite side, in particular the back side of the baking plate, - wherein the baking plate device, in particular the baking plates, is designed in such a way that it is heatable by an induction heating device acting via an inductor gap, - and wherein the at least one back surface of the baking plate device, in particular of the baking plates, is formed as one side of the inductor gap, - wherein the at least one back surface of the baking plates follows a plane and is, in particular, plane-shaped, - wherein the baking plates each have at least one tensioning device for pretensioning the respective baking plate against the pressure arising during baking of the baking mass in the overpressure baking mould, - wherein the heating device comprises at least one induction heating device, - and wherein the at least one induction heating device heats the baking plate, in particular the at least one back surface of the baking plate, via the inductor gap, - in that the at least one tensioning device is arranged between the at least one back surface and the baking surface, in particular within the baking plate,