A method for forming an adhesively bonded article, comprising the steps of: a) providing at least one first article having at least one first surface; b) electrostatically delivering, using an electromagnetic brush printing apparatus, particles for forming a precursor layer to the at least one first surface, the particles including precursors for defining a latent curing polymeric material that exhibits adhesive characteristics upon curing wherein the particles of the precursor layer have an average size in the range of 20 to 300 microns, and the particles being characterized as a one component substantially solid precursor formulation that is substantially free of any solvent and which contains an epoxy resin; c) heating the particles of the precursor layer, to a temperature at which the precursor composition softens and flows as a thermoplastic material, but below which it will cross-link for forming a thermoset material, to form a substantially non-oriented fused precursor layer film that is tack-free and dry to the touch while on the at least one first surface and substantially entirely throughout the period to which it remains unexposed to a reaction activation condition and having a generally uniform thickness of less than 0.3mm; d) applying at least one second substrate to contact at least a portion of the precursor layer film; and e) subjecting the precursor layer film to a reaction activation condition to cause crosslinking and to define a cross-linked reaction product material that adhesively bonds the at least one first substrate with the at least one second substrate, characterized by the step of electrostatically delivering the precursor formulation is repeated in one or more specific areas of the first substrate so that the thickness of the precursor layer film is increased in the one or more specific areas. a) providing at least one first article having at least one first surface; b) electrostatically delivering, using an electromagnetic brush printing apparatus, particles for forming a precursor layer to the at least one first surface, the particles including precursors for defining a latent curing polymeric material that exhibits adhesive characteristics upon curing wherein the particles of the precursor layer have an average size in the range of 20 to 300 microns, and the particles being characterized as a one component substantially solid precursor formulation that is substantially free of any solvent and which contains an epoxy resin; c) heating the particles of the precursor layer, to a temperature at which the precursor composition softens and flows as a thermoplastic material, but below which it will cross-link for forming a thermoset material, to form a substantially non-oriented fused precursor layer film that is tack-free and dry to the touch while on the at least one first surface and substantially entirely throughout the period to which it remains unexposed to a reaction activation condition and having a generally uniform thickness of less than 0.3mm; d) applying at least one second substrate to contact at least a portion of the precursor layer film; and e) subjecting the precursor layer film to a reaction activation condition to cause crosslinking and to define a cross-linked reaction product material that adhesively bonds the at least one first substrate with the at least one second substrate,