A packaged sensor assembly comprising: a packaging structure (2; 102; 202; 302), having at least one opening (18; 118; 218; 318); a humidity sensor (5; 105; 205; 305) and a pressure sensor (10; 110; 210; 310), which are based upon MEMS technology and are housed inside the packaging structure (2; 102; 202; 302) and fluidically communicate with the outside through the opening (18; 118; 218; 318); a control circuit (7; 107; 207; 307), operatively coupled to the humidity sensor (5; 105; 205; 305) and to the pressure sensor (10; 110; 210; 310); wherein the humidity sensor (5; 105; 205; 305) and the control circuit (7; 107; 207; 307) are integrated in a first chip (3; 103; 203; 303), and the pressure sensor (10; 110; 210; 310) is integrated in a second chip (8; 108; 208; 308), distinct from the first chip (3; 103; 203; 303) and bonded to the first chip (3; 103; 203; 303); wherein the packaging structure (2; 102; 202; 302) comprises a substrate (11; 111; 211; 311) and a first cap (13; 113; 203; 313); and wherein the pressure sensor (10; 110; 210; 310) comprises a membrane (22; 122; 222; 322) delimiting a cavity (21; 121; 221; 321) in the second chip (8; 108; 208; 308); characterized in that the second chip (8; 108; 208; 308) is bonded to one of the substrate (11; 111; 211; 311) and the first cap (13; 113; 203; 313) by bonding regions (24; 124; 225; 324) and the opening (18; 118; 218; 318) is provided at a distance from the pressure sensor such that direct exposure of the pressure sensor (10; 110; 210; 310) to light radiation is prevented, whereby the pressure sensor (10; 110; 210; 310) communicates with the outside only through a gap between the second chip (8; 108; 208; 308) and the one of the substrate (11; 111; 211; 311) and the first cap (13; 113; 203; 313) and only a fraction of the light radiation that enters from the opening (18; 118; 218; 318) can reach the pressure sensor (10; 110; 210; 310) through multiple reflections along the gap, the gap having a thickness equal to a thickness of the bonding regions (24; 124; 224; 324). a packaging structure (2; 102; 202; 302), having at least one opening (18; 118; 218; 318); a humidity sensor (5; 105; 205; 305) and a pressure sensor (10; 110; 210; 310), which are based upon MEMS technology and are housed inside the packaging structure (2; 102; 202; 302) and fluidically communicate with the outside through the opening (18; 118; 218; 318); a control circuit (7; 107; 207; 307), operatively coupled to the humidity sensor (5; 105; 205; 305) and to the pressure sensor (10; 110; 210; 310); wherein the humidity sensor (5; 105; 205; 305) and the control circuit (7; 107; 207; 307) are integrated in a first chip (3; 103; 203; 303), and the pressure sensor (10; 110; 210; 310) is integrated in a second chip (8; 108; 208; 308), distinct from the first chip (3; 103; 203; 303) and bonded to the first chip (3; 103; 203; 303); wherein the packaging structure (2; 102; 202; 302) comprises a substrate (11; 111; 211; 311) and a first cap (13; 113; 203; 313); and wherein the pressure sensor (10; 110; 210; 310) comprises a membrane (22; 122; 222; 322) delimiting a cavity (21; 121; 221; 321) in the second chip (8; 108; 208; 308); characterized in that the second chip (8; 108; 208; 308) is bonded to one of the substrate (11; 111; 211; 311) and the first cap (13; 113; 203; 313) by bonding regions (24; 124; 225; 324) and the opening (18; 118; 218; 318) is provided at a distance from the pressure sensor such that direct exposure of the pressure sensor (10; 110; 210; 310) to light radiation is prevented, whereby the pressure sensor (10; 110; 210; 310) communicates with the outside only through a gap between the second chip (8; 108; 208; 308) and the one of the substrate (11; 111; 211; 311) and the first cap (13; 113; 203; 313) and only a fraction of the light radiation that enters from the opening (18; 118; 218; 318) can reach the pressure sensor (10; 110; 210; 310) through multiple reflections along the gap, the gap having a thickness equal to a thickness of the bonding regions (24; 124; 224; 324).