A device comprising: a top conductive layer of a printed circuit board, the top conductive layer comprising an inner PCB section and an outer PCB section separated by a gap; a circuit for an electronic device disposed on the inner PCB section of the top conductive layer; a near-field communications chipset disposed on the outer PCB section of the top conductive layer; a substrate layer of the PCB, the substrate layer comprising an inner PCB section and an outer PCB section separated by the gap; a bridge crossing the gap between the inner PCB section of the substrate layer and the outer PCB section of the substrate layer; a lower conductive layer of the PCB, the lower conductive layer comprising an inner PCB section and an outer PCB section separated by the gap; a circuit for the electronic device disposed on the inner PCB section of the lower conductive layer and electrically connected to the circuit for the electronic device disposed on the inner PCB section of the top conductive layer; a circuit for the electronic device disposed on the outer PCB section of the lower conductive layer; a trace disposed on the bridge and electrically connecting the circuit for the electronic device disposed on the inner PCB section of the lower conductive layer with the circuit for the electronic device disposed on the outer PCB section of the lower conductive layer; and an NFC antenna disposed in the gap that separates the inner PCB section of the top conductive layer and the outer PCB section of the top conductive layer such that the NFC antenna crosses over the bridge at an angle that is at or near a right angle and is connected to the NFC chipset to form an NFC reader. a top conductive layer of a printed circuit board, the top conductive layer comprising an inner PCB section and an outer PCB section separated by a gap; a circuit for an electronic device disposed on the inner PCB section of the top conductive layer; a near-field communications chipset disposed on the outer PCB section of the top conductive layer; a substrate layer of the PCB, the substrate layer comprising an inner PCB section and an outer PCB section separated by the gap; a bridge crossing the gap between the inner PCB section of the substrate layer and the outer PCB section of the substrate layer; a lower conductive layer of the PCB, the lower conductive layer comprising an inner PCB section and an outer PCB section separated by the gap; a circuit for the electronic device disposed on the inner PCB section of the lower conductive layer and electrically connected to the circuit for the electronic device disposed on the inner PCB section of the top conductive layer; a circuit for the electronic device disposed on the outer PCB section of the lower conductive layer; a trace disposed on the bridge and electrically connecting the circuit for the electronic device disposed on the inner PCB section of the lower conductive layer with the circuit for the electronic device disposed on the outer PCB section of the lower conductive layer; and an NFC antenna disposed in the gap that separates the inner PCB section of the top conductive layer and the outer PCB section of the top conductive layer such that the NFC antenna crosses over the bridge at an angle that is at or near a right angle and is connected to the NFC chipset to form an NFC reader.