A fingerprint sensor, comprising: a chip unit having a first surface and a second surface opposite to the first surface, wherein the first surface is configured to receive a touch operation; a first adhesive layer attached to the second surface directly or indirectly in a peelable manner; a substrate layer having a first side facing the chip unit, and a second side opposite to the first side, wherein the first side is attached to the second surface; a base plate; characterized in that the fingerprint sensor further comprises: a support element attached to the substrate layer to support the chip unit, wherein the support element is configured to be switched between a liquid state and a solid state; wherein, during mounting of the chip unit and the base plate, the support unit is arranged to be in the liquid state, so that the height of the support element is changeable to adapt to a distance between the chip unit and the base plate, and the resistance applied to the chip unit by the support element is smaller than a press force applied to the support element by the chip unit, and wherein the support element is arranged to be in the solid state to support the chip unit when the height of the support element has adapted to the distance between the chip unit and the base plate. a chip unit having a first surface and a second surface opposite to the first surface, wherein the first surface is configured to receive a touch operation; a first adhesive layer attached to the second surface directly or indirectly in a peelable manner; a substrate layer having a first side facing the chip unit, and a second side opposite to the first side, wherein the first side is attached to the second surface; a base plate; characterized in that the fingerprint sensor further comprises: a support element attached to the substrate layer to support the chip unit, wherein the support element is configured to be switched between a liquid state and a solid state; wherein, during mounting of the chip unit and the base plate, the support unit is arranged to be in the liquid state, so that the height of the support element is changeable to adapt to a distance between the chip unit and the base plate, and the resistance applied to the chip unit by the support element is smaller than a press force applied to the support element by the chip unit, and wherein the support element is arranged to be in the solid state to support the chip unit when the height of the support element has adapted to the distance between the chip unit and the base plate. a support element attached to the substrate layer to support the chip unit, wherein the support element is configured to be switched between a liquid state and a solid state; wherein, during mounting of the chip unit and the base plate, the support unit is arranged to be in the liquid state, so that the height of the support element is changeable to adapt to a distance between the chip unit and the base plate, and the resistance applied to the chip unit by the support element is smaller than a press force applied to the support element by the chip unit, and wherein the support element is arranged to be in the solid state to support the chip unit when the height of the support element has adapted to the distance between the chip unit and the base plate.