A method of joining dissimilar metals, comprising: providing an interlayered structure, comprising: a first metal substrate (110, 210, 810, 1010, 1110, 1210, 1310); a second metal substrate (120, 220, 820, 1020, 1120, 1220, 1320) having a composition dissimilar from a composition of the first metal substrate; and a plurality of interlayers disposed between the first metal substrate and the second metal substrate, including a first interlayer (132, 232, 830, 1030, 1130, 1230, 1330) nearest to the first metal substrate and at least a second interlayer (120, 220, 840, 1040, 1140, 1240, 1340) nearest to the second metal substrate, wherein the first interlayer (132, 232, 830, 1030, 1130, 1230, 1330) has a composition selected to have a maximum solid solubility within the composition of the first material substrate (110, 210, 810, 1010, 1110, 1210, 1310) that is greater than or equal to the other interlayers within the composition of the first material substrate, and wherein the at least a second interlayer (120, 220, 840, 1040, 1140, 1240, 1340) has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate; and joining the first metal substrate (110, 210, 810, 1010, 1110, 1210, 1310) and a second metal substrate (120, 220, 820, 1020, 1120, 1220, 1320) by heat of friction derived from relative movement between the first metal substrate and the second metal substrate. providing an interlayered structure, comprising: a first metal substrate (110, 210, 810, 1010, 1110, 1210, 1310); a second metal substrate (120, 220, 820, 1020, 1120, 1220, 1320) having a composition dissimilar from a composition of the first metal substrate; and a plurality of interlayers disposed between the first metal substrate and the second metal substrate, including a first interlayer (132, 232, 830, 1030, 1130, 1230, 1330) nearest to the first metal substrate and at least a second interlayer (120, 220, 840, 1040, 1140, 1240, 1340) nearest to the second metal substrate, wherein the first interlayer (132, 232, 830, 1030, 1130, 1230, 1330) has a composition selected to have a maximum solid solubility within the composition of the first material substrate (110, 210, 810, 1010, 1110, 1210, 1310) that is greater than or equal to the other interlayers within the composition of the first material substrate, and wherein the at least a second interlayer (120, 220, 840, 1040, 1140, 1240, 1340) has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate; and a first metal substrate (110, 210, 810, 1010, 1110, 1210, 1310); a second metal substrate (120, 220, 820, 1020, 1120, 1220, 1320) having a composition dissimilar from a composition of the first metal substrate; and a plurality of interlayers disposed between the first metal substrate and the second metal substrate, including a first interlayer (132, 232, 830, 1030, 1130, 1230, 1330) nearest to the first metal substrate and at least a second interlayer (120, 220, 840, 1040, 1140, 1240, 1340) nearest to the second metal substrate, wherein the first interlayer (132, 232, 830, 1030, 1130, 1230, 1330) has a composition selected to have a maximum solid solubility within the composition of the first material substrate (110, 210, 810, 1010, 1110, 1210, 1310) that is greater than or equal to the other interlayers within the composition of the first material substrate, and wherein the at least a second interlayer (120, 220, 840, 1040, 1140, 1240, 1340) has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate; and joining the first metal substrate (110, 210, 810, 1010, 1110, 1210, 1310) and a second metal substrate (120, 220, 820, 1020, 1120, 1220, 1320) by heat of friction derived from relative movement between the first metal substrate and the second metal substrate.