A method of manufacturing an antenna (18a-e, 100), comprising: providing a sheet of metallic material; and performing a first stamping of the sheet of metallic material to form at least one antenna (18a-e, 100), the at least one antenna (18a-e, 100) including at least one pilot hole (24, 60, 76), traces, contacts, a carrier connected to the traces, and at least one tie-bar connected between the traces; characterized in that the method of manufacturing an antenna (18a-e, 100) further comprises: placing the antenna (18a-e, 100) stamped for a first time on a fixture having at least one fixture pin, the fixture pin being inserted through the at least one pilot hole (24, 60, 76); placing a pressure sensitive adhesive pad including at least one die cut hole on the fixture, the fixture pin being inserted through the at least one die cut hole and aligning the antenna (18a-e, 100) stamped for a first time and the pressure sensitive adhesive pad such that an adhesive region of the pressure sensitive adhesive pad is positioned on the traces of the at least one antenna (18a-e, 100), bonding the pressure sensitive adhesive pad to the traces of the at least one antenna (18a-e, 100); and performing a second stamping of the at least one antenna (18a-e, 100) and the pressure sensitive adhesive pad to remove the at least one carrier and the at least one tie-bar connected to the traces. providing a sheet of metallic material; and performing a first stamping of the sheet of metallic material to form at least one antenna (18a-e, 100), the at least one antenna (18a-e, 100) including at least one pilot hole (24, 60, 76), traces, contacts, a carrier connected to the traces, and at least one tie-bar connected between the traces; characterized in that the method of manufacturing an antenna (18a-e, 100) further comprises: placing the antenna (18a-e, 100) stamped for a first time on a fixture having at least one fixture pin, the fixture pin being inserted through the at least one pilot hole (24, 60, 76); placing a pressure sensitive adhesive pad including at least one die cut hole on the fixture, the fixture pin being inserted through the at least one die cut hole and aligning the antenna (18a-e, 100) stamped for a first time and the pressure sensitive adhesive pad such that an adhesive region of the pressure sensitive adhesive pad is positioned on the traces of the at least one antenna (18a-e, 100), bonding the pressure sensitive adhesive pad to the traces of the at least one antenna (18a-e, 100); and performing a second stamping of the at least one antenna (18a-e, 100) and the pressure sensitive adhesive pad to remove the at least one carrier and the at least one tie-bar connected to the traces. placing the antenna (18a-e, 100) stamped for a first time on a fixture having at least one fixture pin, the fixture pin being inserted through the at least one pilot hole (24, 60, 76); placing a pressure sensitive adhesive pad including at least one die cut hole on the fixture, the fixture pin being inserted through the at least one die cut hole and aligning the antenna (18a-e, 100) stamped for a first time and the pressure sensitive adhesive pad such that an adhesive region of the pressure sensitive adhesive pad is positioned on the traces of the at least one antenna (18a-e, 100), bonding the pressure sensitive adhesive pad to the traces of the at least one antenna (18a-e, 100); and performing a second stamping of the at least one antenna (18a-e, 100) and the pressure sensitive adhesive pad to remove the at least one carrier and the at least one tie-bar connected to the traces.