A microelectronic device assembly, comprising: a support member having a support contact, wherein the support member comprises a printed circuit board; and a microelectronic device (210, 310), comprising: a microfeature workpiece (220, 320) having a first side (222a, 322a), a second side (222b, 322b), and a passageway (224a, 324a) extending through the microfeature workpiece between a first aperture in the first side and a second aperture in the second side; a first workpiece contact (230a, 330a) carried by the first side (222a, 322a); a second workpiece contact (230b, 330b) having a first surface (234a, 334a) and a second surface (234b, 334b), the second workpiece contact being carried by the second side and being positioned to cover at least a portion of the second aperture, the second workpiece contact being electrically coupled to an element of the microelectronic device; wherein at least a portion of the first surface of the second workpiece contact is coupled, attached or connected to at least a portion of a bond wire (244, 344) which extends through at least a portion of the passageway out of the first aperture, and is bonded to a support contact of the support member; a support member having a support contact, wherein the support member comprises a printed circuit board; and a microelectronic device (210, 310), comprising: a microfeature workpiece (220, 320) having a first side (222a, 322a), a second side (222b, 322b), and a passageway (224a, 324a) extending through the microfeature workpiece between a first aperture in the first side and a second aperture in the second side; a first workpiece contact (230a, 330a) carried by the first side (222a, 322a); a second workpiece contact (230b, 330b) having a first surface (234a, 334a) and a second surface (234b, 334b), the second workpiece contact being carried by the second side and being positioned to cover at least a portion of the second aperture, the second workpiece contact being electrically coupled to an element of the microelectronic device; wherein at least a portion of the first surface of the second workpiece contact is coupled, attached or connected to at least a portion of a bond wire (244, 344) which extends through at least a portion of the passageway out of the first aperture, and is bonded to a support contact of the support member; a microfeature workpiece (220, 320) having a first side (222a, 322a), a second side (222b, 322b), and a passageway (224a, 324a) extending through the microfeature workpiece between a first aperture in the first side and a second aperture in the second side; a first workpiece contact (230a, 330a) carried by the first side (222a, 322a); a second workpiece contact (230b, 330b) having a first surface (234a, 334a) and a second surface (234b, 334b), the second workpiece contact being carried by the second side and being positioned to cover at least a portion of the second aperture, the second workpiece contact being electrically coupled to an element of the microelectronic device; wherein at least a portion of the first surface of the second workpiece contact is coupled, attached or connected to at least a portion of a bond wire (244, 344) which extends through at least a portion of the passageway out of the first aperture, and is bonded to a support contact of the support member;