A wafer-transporting arrangement comprising - a tray-supporting stage (301, 401, 501, 601), and an electrostatic chucking system comprising an electrostatic chuck electrode (306, 406, 506, 602); - a tray (302, 402, 502, 602) mounted on the tray-supporting stage and comprising a base body consisting of either A) an insulating material and comprising the electrostatic chuck electrode (306, 406, 506, 602) embedded in the base body, or of B) an electrically conductive material and an insulating material covering a surface of the electrically conducting material, the electrically conductive material being configured to be used as the electrostatic chuck electrode and the insulating material being configured that a wafer can be placed thereon, - a tray cover (303, 403, 503, 603), and - a load-dispatching or power supply portion for energizing the electrostatic chuck electrode, - wherein a terminal is present at the load-dispatching or power supply portion, the terminal being a spring-type terminal (305a, 405a, 505a, 605a), which is designed that a tip of the same can be rendered in touch with the electrostatic chuck electrode at a contact zone or area between the tip of the spring-type terminal and the electrostatic chuck electrode so that the wafer can be fixed on the tray by the electrostatic chucking system upon passing or when applying an electric current through the same, - wherein a concave portion configured for the placement of the wafer is defined on the surface of the tray by the tray cover (303, 403, 503, 603) placed at an external periphery or edge portion of the tray, and - wherein further a sealing member (305b, 405b, 505b, 605b) is provided at the periphery of the load-dispatching portion so that a heat-exchanging medium is never capable to pass to the contact portion or area. - a tray-supporting stage (301, 401, 501, 601), and an electrostatic chucking system comprising an electrostatic chuck electrode (306, 406, 506, 602); - a tray (302, 402, 502, 602) mounted on the tray-supporting stage and comprising a base body consisting of either A) an insulating material and comprising the electrostatic chuck electrode (306, 406, 506, 602) embedded in the base body, or of B) an electrically conductive material and an insulating material covering a surface of the electrically conducting material, the electrically conductive material being configured to be used as the electrostatic chuck electrode and the insulating material being configured that a wafer can be placed thereon, A) an insulating material and comprising the electrostatic chuck electrode (306, 406, 506, 602) embedded in the base body, or of B) an electrically conductive material and an insulating material covering a surface of the electrically conducting material, the electrically conductive material being configured to be used as the electrostatic chuck electrode and the insulating material being configured that a wafer can be placed thereon, - a tray cover (303, 403, 503, 603), and - a load-dispatching or power supply portion for energizing the electrostatic chuck electrode, - wherein a terminal is present at the load-dispatching or power supply portion, the terminal being a spring-type terminal (305a, 405a, 505a, 605a), which is designed that a tip of the same can be rendered in touch with the electrostatic chuck electrode at a contact zone or area between the tip of the spring-type terminal and the electrostatic chuck electrode so that the wafer can be fixed on the tray by the electrostatic chucking system upon passing or when applying an electric current through the same, - wherein a concave portion configured for the placement of the wafer is defined on the surface of the tray by the tray cover (303, 403, 503, 603) placed at an external periphery or edge portion of the tray, and - wherein further a sealing member (305b, 405b, 505b, 605b) is provided at the periphery of the load-dispatching portion so that a heat-exchanging medium is never capable to pass to the contact portion or area.