A method of fabricating a lighting device, said lighting device comprising: an LED chip; a mounting substrate configured to mount said LED chip thereto; an encapsulation member made of an encapsulating resin material to encapsulate said LED chip; and a lens made of a transparent resin material; where said lens is secured to said mounting substrate and is provided in its surface facing said mounting substrate with a recess for receiving therein said encapsulation member so that said lens surrounds said encapsulation member, wherein said lens is provided with an injection port for injecting said encapsulating resin material into said recess, and a discharge port for discharging a residue of said encapsulating resin material, and said method comprising in the following order the steps of: (a) mounting said LED chip to said mounting substrate and subsequently covering said LED chip with an uncured first encapsulating resin material forming a portion of said encapsulation member; (b) securing said lens to said mounting substrate in such a manner that the LED chip covered by said first encapsulating resin material is disposed within said recess; (c) injecting an uncured second encapsulating resin material into said recess of the lens through the injection port of said lens, said second encapsulating resin material being made of the same material as said first encapsulating resin material to form the remainder of said encapsulation member; and (d) curing said individual encapsulating resin materials to form said encapsulation member. an LED chip; a mounting substrate configured to mount said LED chip thereto; an encapsulation member made of an encapsulating resin material to encapsulate said LED chip; and a lens made of a transparent resin material; where said lens is secured to said mounting substrate and is provided in its surface facing said mounting substrate with a recess for receiving therein said encapsulation member so that said lens surrounds said encapsulation member, wherein said lens is provided with an injection port for injecting said encapsulating resin material into said recess, and a discharge port for discharging a residue of said encapsulating resin material, and said method comprising in the following order the steps of: (a) mounting said LED chip to said mounting substrate and subsequently covering said LED chip with an uncured first encapsulating resin material forming a portion of said encapsulation member; (b) securing said lens to said mounting substrate in such a manner that the LED chip covered by said first encapsulating resin material is disposed within said recess; (c) injecting an uncured second encapsulating resin material into said recess of the lens through the injection port of said lens, said second encapsulating resin material being made of the same material as said first encapsulating resin material to form the remainder of said encapsulation member; and (d) curing said individual encapsulating resin materials to form said encapsulation member. (a) mounting said LED chip to said mounting substrate and subsequently covering said LED chip with an uncured first encapsulating resin material forming a portion of said encapsulation member; (b) securing said lens to said mounting substrate in such a manner that the LED chip covered by said first encapsulating resin material is disposed within said recess; (c) injecting an uncured second encapsulating resin material into said recess of the lens through the injection port of said lens, said second encapsulating resin material being made of the same material as said first encapsulating resin material to form the remainder of said encapsulation member; and (d) curing said individual encapsulating resin materials to form said encapsulation member.