An electronic device comprising: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate; a first printed circuit board, PCB, disposed in parallel with the first plate in the space between the first plate and the second plate, and including a first face facing the first plate and a second face facing the second plate; at least one conductive plate formed on the second face; a first conductive pattern (431, 441) embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate; a first wireless communication circuit mounted on the first face of the first PCB, electrically coupled to the at least one conductive plate and the first conductive pattern (431, 441), and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 6GHz to 100GHz by way of the at least one conductive plate and the first conductive pattern (431, 441); a dielectric structure disposed on the first face between the conductive plate and the side member when viewed from above the first plate; a second conductive pattern constructed on one face of the dielectric structure or embedded at least partially inside thereof; a second wireless communication circuit electrically coupled to the second conductive pattern and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 0.5GHz to 6GHz by way of the second conductive pattern; and a second PCB disposed between the first plate and the second plate, wherein the second wireless communication circuit is mounted to the second PCB. a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate; a first printed circuit board, PCB, disposed in parallel with the first plate in the space between the first plate and the second plate, and including a first face facing the first plate and a second face facing the second plate; at least one conductive plate formed on the second face; a first conductive pattern (431, 441) embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate; a first wireless communication circuit mounted on the first face of the first PCB, electrically coupled to the at least one conductive plate and the first conductive pattern (431, 441), and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 6GHz to 100GHz by way of the at least one conductive plate and the first conductive pattern (431, 441); a dielectric structure disposed on the first face between the conductive plate and the side member when viewed from above the first plate; a second conductive pattern constructed on one face of the dielectric structure or embedded at least partially inside thereof; a second wireless communication circuit electrically coupled to the second conductive pattern and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 0.5GHz to 6GHz by way of the second conductive pattern; and a second PCB disposed between the first plate and the second plate, wherein the second wireless communication circuit is mounted to the second PCB.