Electronic equipment comprising: a first electronic circuit substrate; a second electronic circuit substrate; a first coil connected to said first electronic circuit substrate; and a second coil connected to said second electronic circuit substrate, wherein: power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected, said first coil has: a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate, said second coil has: a second power coil that receives power transmitted by said first power coil; and a second communication coil that communicates with said first communication coil, wherein said first coil and said second coil are stacked in a direction orthogonal to a plane in which said first coil and said second coil are arranged, said first power coil and said second power coil are arranged to face each other in the direction; said first communication coil and said second communication coil are arranged to face each other in the direction; and a first set composed of said first power coil and said second power coil and a second set composed of said first communication coil and said second communication coil are stacked in the direction through magnetic substance. a first electronic circuit substrate; a second electronic circuit substrate; a first coil connected to said first electronic circuit substrate; and a second coil connected to said second electronic circuit substrate, wherein: power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected, said first coil has: a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate, said second coil has: a second power coil that receives power transmitted by said first power coil; and a second communication coil that communicates with said first communication coil, wherein said first coil and said second coil are stacked in a direction orthogonal to a plane in which said first coil and said second coil are arranged, said first power coil and said second power coil are arranged to face each other in the direction; said first communication coil and said second communication coil are arranged to face each other in the direction; and a first set composed of said first power coil and said second power coil and a second set composed of said first communication coil and said second communication coil are stacked in the direction through magnetic substance. power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected, said first coil has: a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate, a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate, said second coil has: a second power coil that receives power transmitted by said first power coil; and a second communication coil that communicates with said first communication coil, a second power coil that receives power transmitted by said first power coil; and a second communication coil that communicates with said first communication coil, wherein said first coil and said second coil are stacked in a direction orthogonal to a plane in which said first coil and said second coil are arranged, said first power coil and said second power coil are arranged to face each other in the direction; said first communication coil and said second communication coil are arranged to face each other in the direction; and a first set composed of said first power coil and said second power coil and a second set composed of said first communication coil and said second communication coil are stacked in the direction through magnetic substance.