An endoscope (200, 300) comprising: an imaging module (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H); a connector (210, 310); an insulating tube; and an outer cable (220, 320), wherein the imaging module (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H) comprises: a support substrate (10, 110, 120) that includes a first surface (10T, 110T, 120T), a second surface (10B, 110B, 120B) located on an opposite side of the first surface (10T, 110T, 120T), and a first mounting terminal provided on the first surface (10T, 110T, 120T); a planar light emitter (20, 20A, 20B, 20C, 20D, 20G, 20R) that includes a light-emitting face and a light-emitter terminal connected to the first mounting terminal, and is mounted on the first surface (10T, 110T, 120T) of the support substrate (10, 110, 120); a solid-state image sensing device including a glass member and a light-incident surface which is located at an upper surface of the glass member and is formed in a quadrangular shape in plan view, being disposed adjacent to the planar light emitter (20, 20A, 20B, 20C, 20D, 20G, 20R), and capturing an image of an imaging object to be irradiated with light emitted from the light-emitting face; and a cover member that is provided on the first surface (10T, 110T, 120T) of the support substrate (10, 110, 120), is formed of a transparent material, and covers the planar light emitter (20, 20A, 20B, 20C, 20D, 20G, 20R) and the solid-state image sensing device, the cover member of the imaging module (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H) comprises an outer surface (42, 42A, 42B) that reaches an edge of the support substrate (10, 110, 120) from an outer-periphery of the light-incident surface in a cross-sectional view in a direction perpendicular to the light-incident surface, and the insulating tube covers: the support substrate (10, 110, 120) of the imaging module (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H); the connector (210, 310) positioned between the support substrate (10, 110, 120) and the outer cable (220, 320); and the outer cable (220, 320) connected to the connector (210, 310) when seen in the cross-sectional view, a distance from the first surface (10T, 110T, 120T) to the light-incident surface is greater than a distance from the first surface (10T, 110T, 120T) to the light-emitting face, the cover member includes an exposed area at which the light-incident surface is exposed, the light-incident surface is not covered with the cover member, but is exposed at the exposed area, and forms a front-end of the imaging module (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H), and a periphery of the glass member except for light-incident surface is coated with a light-shielding material that blocks light from the planar light emitter (20, 20A, 20B, 20C, 20D, 20G, 20R), and a light-shielding portion is thereby formed. a support substrate (10, 110, 120) that includes a first surface (10T, 110T, 120T), a second surface (10B, 110B, 120B) located on an opposite side of the first surface (10T, 110T, 120T), and a first mounting terminal provided on the first surface (10T, 110T, 120T); a planar light emitter (20, 20A, 20B, 20C, 20D, 20G, 20R) that includes a light-emitting face and a light-emitter terminal connected to the first mounting terminal, and is mounted on the first surface (10T, 110T, 120T) of the support substrate (10, 110, 120); a solid-state image sensing device including a glass member and a light-incident surface which is located at an upper surface of the glass member and is formed in a quadrangular shape in plan view, being disposed adjacent to the planar light emitter (20, 20A, 20B, 20C, 20D, 20G, 20R), and capturing an image of an imaging object to be irradiated with light emitted from the light-emitting face; and a cover member that is provided on the first surface (10T, 110T, 120T) of the support substrate (10, 110, 120), is formed of a transparent material, and covers the planar light emitter (20, 20A, 20B, 20C, 20D, 20G, 20R) and the solid-state image sensing device, the cover member of the imaging module (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H) comprises an outer surface (42, 42A, 42B) that reaches an edge of the support substrate (10, 110, 120) from an outer-periphery of the light-incident surface in a cross-sectional view in a direction perpendicular to the light-incident surface, and the insulating tube covers: the support substrate (10, 110, 120) of the imaging module (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H); the connector (210, 310) positioned between the support substrate (10, 110, 120) and the outer cable (220, 320); and the outer cable (220, 320) connected to the connector (210, 310) when seen in the cross-sectional view, a distance from the first surface (10T, 110T, 120T) to the light-incident surface is greater than a distance from the first surface (10T, 110T, 120T) to the light-emitting face, the cover member includes an exposed area at which the light-incident surface is exposed, the light-incident surface is not covered with the cover member, but is exposed at the exposed area, and forms a front-end of the imaging module (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H), and a periphery of the glass member except for light-incident surface is coated with a light-shielding material that blocks light from the planar light emitter (20, 20A, 20B, 20C, 20D, 20G, 20R), and a light-shielding portion is thereby formed.