An electronic module, comprising: a chassis having a first end and a second end opposite the first end, wherein the chassis comprises: a first side; a second side opposite the first side; a third side connected to at least one of the first and second sides (18, 20); and a fourth side connected to at least one of the first and second sides wherein the fourth side is opposite the third side; a plurality of capacitors positioned within the chassis; and a heat sink positioned between the capacitors and the second end; wherein the electronic module is configured to define at least one path (50, 52, 54) between the first end and the second end for air flowing through the chassis, such that debris resulting from a failure of one of the plurality of capacitors may be carried by air flowing through the chassis toward the heat sink, the heat sink being configured to block a significant portion of such debris, and the second end being configured to block debris which is not blocked by the heat sink, and wherein the chassis is fabricated from a material which stops debris resulting from a failure of one of the plurality of capacitors from passing through the sides of the chassis. a chassis having a first end and a second end opposite the first end, wherein the chassis comprises: a first side; a second side opposite the first side; a third side connected to at least one of the first and second sides (18, 20); and a fourth side connected to at least one of the first and second sides wherein the fourth side is opposite the third side; a plurality of capacitors positioned within the chassis; and a heat sink positioned between the capacitors and the second end; wherein the electronic module is configured to define at least one path (50, 52, 54) between the first end and the second end for air flowing through the chassis, such that debris resulting from a failure of one of the plurality of capacitors may be carried by air flowing through the chassis toward the heat sink, the heat sink being configured to block a significant portion of such debris, and the second end being configured to block debris which is not blocked by the heat sink, and wherein the chassis is fabricated from a material which stops debris resulting from a failure of one of the plurality of capacitors from passing through the sides of the chassis. a first side; a second side opposite the first side; a third side connected to at least one of the first and second sides (18, 20); and a fourth side connected to at least one of the first and second sides wherein the fourth side is opposite the third side; a plurality of capacitors positioned within the chassis; and a heat sink positioned between the capacitors and the second end; wherein the electronic module is configured to define at least one path (50, 52, 54) between the first end and the second end for air flowing through the chassis, such that debris resulting from a failure of one of the plurality of capacitors may be carried by air flowing through the chassis toward the heat sink, the heat sink being configured to block a significant portion of such debris, and the second end being configured to block debris which is not blocked by the heat sink, and wherein the chassis is fabricated from a material which stops debris resulting from a failure of one of the plurality of capacitors from passing through the sides of the chassis.