Process for applying a protective compound to an electrical or electronic component, comprising the steps of i. providing an organosiloxane composition comprising: a) 20 to 98.999989 wt% of at least one linear or branched polyorganosiloxane comprising at least two alkenyl or alkynyl groups, as component A; b) 0.1 to 30 wt% of at least one linear or branched polyorganosiloxane comprising at least 3 Si-H groups, as component B; c) 0.000001 to 1 wt% of at least one UV-activatable, platinum-containing hydrosilylation catalyst, as component C; d) 0.00001 to 5 wt% of at least one alkynol of the general formula, Where R1, R2 and R3 independently of one another are selected from H, C1-C6 alkyl and substituted or unsubstituted C3-C6 cycloalkyl; or R1 is selected from H, C1-C6 alkyl and substituted or unsubstituted C3-C6 cycloalkyl, and R2 and R3 are connected to one another and form a 3- to 8-membered ring which may be substituted by one or more C1-C3 alkyl groups, as component D, wherein the amount of alkynol inhibits the catalyst completely; e) 0 to 79.899989 wt% of one or more polyorganosiloxanes comprising two terminal Si-H groups or one terminal Si-H group and one terminal alkenyl group, as component E; f) 0 to 20 wt% of one or more epoxy organosiloxanes, as component F; g) 0 to 5 wt% of one or more acyclic or cyclic organosiloxanes, different from component A and having 1 to 5 Si atoms, and comprising at least two alkenyl groups, as component G; h) 0 to 79.899989 wt% of one or more silsesquioxanes, as component H; and i) 0 to 75 wt% of one or more additives, as component I; where the sum of components A to I is 100 wt%; ii. applying the organosiloxane composition to an electrical or electronic component, and iii. irradiating the organosiloxane composition with UV light; wherein the inhibition of the catalyst is lifted by means of UV radiation. i. providing an organosiloxane composition comprising: a) 20 to 98.999989 wt% of at least one linear or branched polyorganosiloxane comprising at least two alkenyl or alkynyl groups, as component A; b) 0.1 to 30 wt% of at least one linear or branched polyorganosiloxane comprising at least 3 Si-H groups, as component B; c) 0.000001 to 1 wt% of at least one UV-activatable, platinum-containing hydrosilylation catalyst, as component C; d) 0.00001 to 5 wt% of at least one alkynol of the general formula, Where R1, R2 and R3 independently of one another are selected from H, C1-C6 alkyl and substituted or unsubstituted C3-C6 cycloalkyl; or R1 is selected from H, C1-C6 alkyl and substituted or unsubstituted C3-C6 cycloalkyl, and R2 and R3 are connected to one another and form a 3- to 8-membered ring which may be substituted by one or more C1-C3 alkyl groups, as component D, wherein the amount of alkynol inhibits the catalyst completely; e) 0 to 79.899989 wt% of one or more polyorganosiloxanes comprising two terminal Si-H groups or one terminal Si-H group and one terminal alkenyl group, as component E; f) 0 to 20 wt% of one or more epoxy organosiloxanes, as component F; g) 0 to 5 wt% of one or more acyclic or cyclic organosiloxanes, different from component A and having 1 to 5 Si atoms, and comprising at least two alkenyl groups, as component G; h) 0 to 79.899989 wt% of one or more silsesquioxanes, as component H; and i) 0 to 75 wt% of one or more additives, as component I; where the sum of components A to I is 100 wt%; a) 20 to 98.999989 wt% of at least one linear or branched polyorganosiloxane comprising at least two alkenyl or alkynyl groups, as component A; b) 0.1 to 30 wt% of at least one linear or branched polyorganosiloxane comprising at least 3 Si-H groups, as component B; c) 0.000001 to 1 wt% of at least one UV-activatable, platinum-containing hydrosilylation catalyst, as component C; d) 0.00001 to 5 wt% of at least one alkynol of the general formula, Where R1, R2 and R3 independently of one another are selected from H, C1-C6 alkyl and substituted or unsubstituted C3-C6 cycloalkyl; or R1 is selected from H, C1-C6 alkyl and substituted or unsubstituted C3-C6 cycloalkyl, and R2 and R3 are connected to one another and form a 3- to 8-membered ring which may be substituted by one or more C1-C3 alkyl groups, as component D, wherein the amount of alkynol inhibits the catalyst completely; R1, R2 and R3 independently of one another are selected from H, C1-C6 alkyl and substituted or unsubstituted C3-C6 cycloalkyl; or R1 is selected from H, C1-C6 alkyl and substituted or unsubstituted C3-C6 cycloalkyl, and R2 and R3 are connected to one another and form a 3- to 8-membered ring which may be substituted by one or more C1-C3 alkyl groups, as component D, wherein the amount of alkynol inhibits the catalyst completely; e) 0 to 79.899989 wt% of one or more polyorganosiloxanes comprising two terminal Si-H groups or one terminal Si-H group and one terminal alkenyl group, as component E; f) 0 to 20 wt% of one or more epoxy organosiloxanes, as component F; g) 0 to 5 wt% of one or more acyclic or cyclic organosiloxanes, different from component A and having 1 to 5 Si atoms, and comprising at least two alkenyl groups, as component G; h) 0 to 79.899989 wt% of one or more silsesquioxanes, as component H; and i) 0 to 75 wt% of one or more additives, as component I; where the sum of components A to I is 100 wt%; ii. applying the organosiloxane composition to an electrical or electronic component, and iii. irradiating the organosiloxane composition with UV light; wherein the inhibition of the catalyst is lifted by means of UV radiation.