An optical illuminator module comprising: a. a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) comprising a common conductive substrate and being arranged to form a two-dimensional array of VCSELs having a light emitting surface on a first surface and a bonding surface on a second surface which is opposite to the first surface, wherein one terminal of each of the plurality of VCSELs is electrically connected to a first terminal of the array of VCSELs on the first surface and a second terminal of each plurality of VCSELs is electrically connected to a second terminal of the array of VCSELs on the second surface; wherein a trench is located on the second surface, the trench being configured to electrically isolate the second terminal of the array of VCSELs from an electrical contact region located on the second surface, and wherein the conductive substrate is configured to electrically connect directly or via the conductive substrate the electrical contact region on the second surface to the first terminal of the array of VCSELs; and b. a submount including a plurality of bonding pads, including a first and second bonding pad, that are electrically isolated from each other and positioned on a first surface, the first and the second terminal of the array being electrically connected to respective first and second bonding pads on the submount, such that the array is in thermal contact with the submount, the plurality of bonding pads being electrically connected to a corresponding plurality of bonding pads, including a first and second bonding pad, located on a second surface of the submount which is opposite to the first surface of the submount. a. a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) comprising a common conductive substrate and being arranged to form a two-dimensional array of VCSELs having a light emitting surface on a first surface and a bonding surface on a second surface which is opposite to the first surface, wherein one terminal of each of the plurality of VCSELs is electrically connected to a first terminal of the array of VCSELs on the first surface and a second terminal of each plurality of VCSELs is electrically connected to a second terminal of the array of VCSELs on the second surface; wherein a trench is located on the second surface, the trench being configured to electrically isolate the second terminal of the array of VCSELs from an electrical contact region located on the second surface, and wherein the conductive substrate is configured to electrically connect directly or via the conductive substrate the electrical contact region on the second surface to the first terminal of the array of VCSELs; and b. a submount including a plurality of bonding pads, including a first and second bonding pad, that are electrically isolated from each other and positioned on a first surface, the first and the second terminal of the array being electrically connected to respective first and second bonding pads on the submount, such that the array is in thermal contact with the submount, the plurality of bonding pads being electrically connected to a corresponding plurality of bonding pads, including a first and second bonding pad, located on a second surface of the submount which is opposite to the first surface of the submount.