A method comprising: providing an electronic module comprising an electric terminal, the electric terminal including a press-fit section that comprises one of the following alloys: CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; CuNiSiMg; wherein, where R designates one ore more alloying constituents not explicitly mentioned in the respective alloy, CuFeP means Cu a Fe b P c R d with a ≥ 96.82 weight%, b = 2.1 to 2.6 weight%, c = 0.015 to 0.15 weight%, d = 0 to 0.43 weight%, and a+b+c+d = 100 weight%; CuZr means Cu a Zr b R c with a ≥ 99.7 weight%, b = 0.1 to 0.2 weight%, c = 0 to 0.1 weight%, and a+b+c = 100 weight%; CuCrZr means Cu a Cr b Zr c R d with a ≥ 98.32 weight%, b = 0.5 to 1.2 weight%, c = 0.03 to 0.3 weight%, d = 0 to 0.18 weight%, and a+b+c+d = 100 weight%; CuMg means Cu a Mg b R c with a ≥ 98.6 weight%, b = 0.08 to 0.8 weight%, c = 0 to 0.6 weight%, and a+b+c = 100 weight%; CuCrTiSi means Cu a Cr b Ti c Si d R e with a ≥ 99.0 weight%, b = 0.15 to 0.4 weight%, c = 0.1 to 0.4 weight%, d = 0.02 to 0.07 weight%, e = 0 to 0.82 weight%, and a+b+c+d+e = 100 weight%; CuCrAgFeTiSi means Cu a Cr b Ag c Fe d Ti e Si f R g with a ≥ 98.73 weight%, b = 0.2 to 0.7 weight%, c = 0.01 to 0.3 weight%, d = 0.02 to 0.2 weight%, e = 0.01 to 0.15 weight%, f = 0.01 to 0.1 weight%, g = 0 to 0.2 weight%, and a+b+c+d+e+f+g = 100 weight%, CuNiSiMg means Cu a Ni b Si c Mg d R e with a ≥ 93.25 weight%, b = 2.2 to 4.2 weight%, c = 0.25 to 1.2 weight%, d = 0.05 to 0.3 weight%, e = 0 to 3.75 weight%, and a+b+c+d+e = 100 weight%; providing an electric part comprising a contact hole; and pressing the press-fit section into the contact hole so that the press-fit section is plastically deformed and both mechanically and electrically contacts the electric part; wherein the electronic module comprises a substrate with a dielectric layer and a substrate metallization layer attached to the dielectric layer; and the electric terminal comprises a module connection section at which it is electrically connected to the substrate metallization layer by inserting the module connection section in an electrically conductive sleeve mounted on and electrically connected to the substrate metallization layer. providing an electronic module comprising an electric terminal, the electric terminal including a press-fit section that comprises one of the following alloys: CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; CuNiSiMg; wherein, where R designates one ore more alloying constituents not explicitly mentioned in the respective alloy, CuFeP means Cu a Fe b P c R d with a ≥ 96.82 weight%, b = 2.1 to 2.6 weight%, c = 0.015 to 0.15 weight%, d = 0 to 0.43 weight%, and a+b+c+d = 100 weight%; CuZr means Cu a Zr b R c with a ≥ 99.7 weight%, b = 0.1 to 0.2 weight%, c = 0 to 0.1 weight%, and a+b+c = 100 weight%; CuCrZr means Cu a Cr b Zr c R d with a ≥ 98.32 weight%, b = 0.5 to 1.2 weight%, c = 0.03 to 0.3 weight%, d = 0 to 0.18 weight%, and a+b+c+d = 100 weight%; CuMg means Cu a Mg b R c with a ≥ 98.6 weight%, b = 0.08 to 0.8 weight%, c = 0 to 0.6 weight%, and a+b+c = 100 weight%; CuCrTiSi means Cu a Cr b Ti c Si d R e with a ≥ 99.0 weight%, b = 0.15 to 0.4 weight%, c = 0.1 to 0.4 weight%, d = 0.02 to 0.07 weight%, e = 0 to 0.82 weight%, and a+b+c+d+e = 100 weight%; CuCrAgFeTiSi means Cu a Cr b Ag c Fe d Ti e Si f R g with a ≥ 98.73 weight%, b = 0.2 to 0.7 weight%, c = 0.01 to 0.3 weight%, d = 0.02 to 0.2 weight%, e = 0.01 to 0.15 weight%, f = 0.01 to 0.1 weight%, g = 0 to 0.2 weight%, and a+b+c+d+e+f+g = 100 weight%, CuNiSiMg means Cu a Ni b Si c Mg d R e with a ≥ 93.25 weight%, b = 2.2 to 4.2 weight%, c = 0.25 to 1.2 weight%, d = 0.05 to 0.3 weight%, e = 0 to 3.75 weight%, and a+b+c+d+e = 100 weight%; providing an electric part comprising a contact hole; and pressing the press-fit section into the contact hole so that the press-fit section is plastically deformed and both mechanically and electrically contacts the electric part; wherein the electronic module comprises a substrate with a dielectric layer and a substrate metallization layer attached to the dielectric layer; and the electric terminal comprises a module connection section at which it is electrically connected to the substrate metallization layer by inserting the module connection section in an electrically conductive sleeve mounted on and electrically connected to the substrate metallization layer.