A method of making an OLED device comprising: a) providing a device substrate having a first array of bottom electrodes and a second array of bottom electrodes; b) providing a first undercut lift-off structure over the device substrate having a first pattern of openings corresponding to the first array of bottom electrodes; c) depositing one or more first organic EL medium layers (216, 216') including at least a first light-emitting layer over the first undercut lift-off structure and over the first array of bottom electrodes; d) removing the first undercut lift-off structure and overlying first organic EL medium layer(s) by treatment with a first lift-off agent comprising a fluorinated solvent to form a first intermediate structure; e) providing a second undercut lift-off structure over the first intermediate structure having a second pattern of openings corresponding to the second array of bottom electrodes; f) depositing one or more second organic EL medium layers (226, 226') including at least a second light-emitting layer over the second undercut lift-off structure and over the second array of bottom electrodes; g) removing the second undercut lift-off structure and overlying second organic EL medium layer(s) by treatment with a second lift-off agent comprising a fluorinated solvent to form a second intermediate structure; and h) providing a common top electrode (241, 242) in electrical contact with the first and second organic EL medium layers (216, 226); the method being characterized in that at least one lift-off structure (211, 221) absorbs or blocks underlying layers from at least 80% of imaging radiation used in the formation of the at least one lift-off structure; and in that further including a dry-etch cleaning step between steps (b) and (c) or between steps (e) and (f) or both. a) providing a device substrate having a first array of bottom electrodes and a second array of bottom electrodes; b) providing a first undercut lift-off structure over the device substrate having a first pattern of openings corresponding to the first array of bottom electrodes; c) depositing one or more first organic EL medium layers (216, 216') including at least a first light-emitting layer over the first undercut lift-off structure and over the first array of bottom electrodes; d) removing the first undercut lift-off structure and overlying first organic EL medium layer(s) by treatment with a first lift-off agent comprising a fluorinated solvent to form a first intermediate structure; e) providing a second undercut lift-off structure over the first intermediate structure having a second pattern of openings corresponding to the second array of bottom electrodes; f) depositing one or more second organic EL medium layers (226, 226') including at least a second light-emitting layer over the second undercut lift-off structure and over the second array of bottom electrodes; g) removing the second undercut lift-off structure and overlying second organic EL medium layer(s) by treatment with a second lift-off agent comprising a fluorinated solvent to form a second intermediate structure; and h) providing a common top electrode (241, 242) in electrical contact with the first and second organic EL medium layers (216, 226); the method being characterized in that at least one lift-off structure (211, 221) absorbs or blocks underlying layers from at least 80% of imaging radiation used in the formation of the at least one lift-off structure; and in that further including a dry-etch cleaning step between steps (b) and (c) or between steps (e) and (f) or both.