A modular service system for servicing an inkjet printhead of an inkjet printing system, the inkjet printhead comprising at least two mutually aligned Multi-Chip Module assemblies arranged on a support and forming a long-swath printhead, wherein each of the at least two MCM assemblies comprises, in a horizontal direction, an upper row of chips and a lower row of chips, the service system comprising: at least two frames with mounted on each of the at least two frames a capping element for capping a corresponding one of the at least two MCM assemblies of the inkjet printhead, and at least two wiping elements for wiping the inkjet printhead, the capping element comprising a sealing ring extending around an outer profile of the capping element, a means for horizontal movement of the inkjet printhead between a printing position and a servicing position, a means for vertical movement of the inkjet printhead, the means for vertical movement configured to enable capping, unclogging or purging processes in respect to the inkjet printhead, and a waste ink tank in hermetic communication with each of the capping elements, wherein the means for horizontal movement is configured to enable a wiping process by bringing in contact a surface of the inkjet printhead and the wiping elements during the horizontal movement of the inkjet printhead back and forth, characterized in that for each of the at least two frames, one of the at least two wiping elements is arranged, in a horizontal direction, at an upper right side of the sealing ring, on a right end of the frame, which corresponds to a right end of the upper row of chips of a corresponding one of the at least two MCM assemblies, and the other one of the at least two wiping elements is arranged, in a horizontal direction, at a lower left side of the sealing ring, on a left end of the frame, which corresponds to a left end of the lower row of chips of the corresponding one of the at least two MCM assemblies, so that when the upper row of chips of one of the at least two MCM assemblies is wiped by one of the at least two wiping elements mounted on a corresponding frame of the at least two frames, the lower row of chips of said one of the at least two MCM assemblies is wiped by one of the at least two wiping elements mounted on an adjacent frame of the at least two frames. at least two frames with mounted on each of the at least two frames a capping element for capping a corresponding one of the at least two MCM assemblies of the inkjet printhead, and at least two wiping elements for wiping the inkjet printhead, the capping element comprising a sealing ring extending around an outer profile of the capping element, a means for horizontal movement of the inkjet printhead between a printing position and a servicing position, a means for vertical movement of the inkjet printhead, the means for vertical movement configured to enable capping, unclogging or purging processes in respect to the inkjet printhead, and a waste ink tank in hermetic communication with each of the capping elements, wherein the means for horizontal movement is configured to enable a wiping process by bringing in contact a surface of the inkjet printhead and the wiping elements during the horizontal movement of the inkjet printhead back and forth, characterized in that for each of the at least two frames, one of the at least two wiping elements is arranged, in a horizontal direction, at an upper right side of the sealing ring, on a right end of the frame, which corresponds to a right end of the upper row of chips of a corresponding one of the at least two MCM assemblies, and the other one of the at least two wiping elements is arranged, in a horizontal direction, at a lower left side of the sealing ring, on a left end of the frame, which corresponds to a left end of the lower row of chips of the corresponding one of the at least two MCM assemblies, so that when the upper row of chips of one of the at least two MCM assemblies is wiped by one of the at least two wiping elements mounted on a corresponding frame of the at least two frames, the lower row of chips of said one of the at least two MCM assemblies is wiped by one of the at least two wiping elements mounted on an adjacent frame of the at least two frames.