A resin-sealing apparatus used for manufacturing an electronic unit by collectively resin-sealing a plurality of components on a pre-sealed substrate having a circuit substrate and the plurality of components mounted on the circuit substrate, the components including at least a connector with a projection, comprising: a tray on which the aforementioned one or more pre-sealed substrates can be placed; a preheating mechanism for pre-heating the tray on which the aforementioned one or more pre-sealed substrates are placed; a first transfer mechanism for transferring the tray on which the aforementioned one or more pre-sealed substrates are placed to the preheating mechanism and placing the tray on the preheating mechanism; a resin-sealing mold having a cavity which is to be filled with fluid resin and aforementioned one or more substrate setting portions on which the aforementioned one or more pre-sealed substrate can be placed; a carry-in mechanism for taking out the pre-heated one or more pre-sealed substrates from the tray and placing the aforementioned one or more pre-sealed substrates respectively to the substrate setting portions of the resin-sealing mold; and a taking-out mechanism for taking out, from the resin-sealing mold, one or more resin-sealed products formed by resin-sealing each of the aforementioned one or more pre-sealed substrates with a cured resin which is formed by curing the fluid resin filling the cavity, wherein: a recess corresponding to the projection of each of the aforementioned one ore more pre-sealed substrate is provided in the tray; and the aforementioned one or more pre-sealed substrates can be placed on the tray, with the projection and the recess being aligned. a tray on which the aforementioned one or more pre-sealed substrates can be placed; a preheating mechanism for pre-heating the tray on which the aforementioned one or more pre-sealed substrates are placed; a first transfer mechanism for transferring the tray on which the aforementioned one or more pre-sealed substrates are placed to the preheating mechanism and placing the tray on the preheating mechanism; a resin-sealing mold having a cavity which is to be filled with fluid resin and aforementioned one or more substrate setting portions on which the aforementioned one or more pre-sealed substrate can be placed; a carry-in mechanism for taking out the pre-heated one or more pre-sealed substrates from the tray and placing the aforementioned one or more pre-sealed substrates respectively to the substrate setting portions of the resin-sealing mold; and a taking-out mechanism for taking out, from the resin-sealing mold, one or more resin-sealed products formed by resin-sealing each of the aforementioned one or more pre-sealed substrates with a cured resin which is formed by curing the fluid resin filling the cavity, wherein: a recess corresponding to the projection of each of the aforementioned one ore more pre-sealed substrate is provided in the tray; and the aforementioned one or more pre-sealed substrates can be placed on the tray, with the projection and the recess being aligned. a recess corresponding to the projection of each of the aforementioned one ore more pre-sealed substrate is provided in the tray; and the aforementioned one or more pre-sealed substrates can be placed on the tray, with the projection and the recess being aligned.