An exposure apparatus for exposing a substrate with exposure light via a projection optical system, comprising: a first stage arranged above the projection optical system to hold a mask illuminated with the exposure light; a second stage arranged below the projection optical system to hold the substrate; a drive system having a first motor for driving the first stage and a second motor for driving the second stage; an alignment sensor arranged to detect a mark on the substrate; and a controller configured to control the drive system based on detection information of the mark with the alignment sensor, wherein the alignment sensor is configured to irradiate a plurality of different wavelengths of light onto the substrate, in order to detect first marks (My1, My2, My3, My4) at a first layer among a plurality of layers formed on the substrate by use of a first wavelength of light and in order to detect second marks (Mx1, Mx2, Mx3, Mx4) at a second layer, which is different from the first layer, among the plurality of layers by use of a second wavelength of light, the second wavelength being different from the first wavelength, the controller is configured to control the drive system such that the first marks and the second marks are detected by the alignment sensor, and to control the drive system such that, based on detection information of the first marks detected by use of the first wavelength and on detection information of the second marks detected by use of the second wavelength, an alignment between the substrate and a pattern image of the mask projected via the projection optical system in exposure process for the substrate is executed, the exposure apparatus being characterized in that the alignment sensor is configured to irradiate the plurality of different wavelengths of light by irradiating a plurality of coherent beams, having wavelengths different from each other, onto the marks and to detect diffracted light, of each of the different wavelengths, arising from the marks. a first stage arranged above the projection optical system to hold a mask illuminated with the exposure light; a second stage arranged below the projection optical system to hold the substrate; a drive system having a first motor for driving the first stage and a second motor for driving the second stage; an alignment sensor arranged to detect a mark on the substrate; and a controller configured to control the drive system based on detection information of the mark with the alignment sensor, wherein the alignment sensor is configured to irradiate a plurality of different wavelengths of light onto the substrate, in order to detect first marks (My1, My2, My3, My4) at a first layer among a plurality of layers formed on the substrate by use of a first wavelength of light and in order to detect second marks (Mx1, Mx2, Mx3, Mx4) at a second layer, which is different from the first layer, among the plurality of layers by use of a second wavelength of light, the second wavelength being different from the first wavelength, the controller is configured to control the drive system such that the first marks and the second marks are detected by the alignment sensor, and to control the drive system such that, based on detection information of the first marks detected by use of the first wavelength and on detection information of the second marks detected by use of the second wavelength, an alignment between the substrate and a pattern image of the mask projected via the projection optical system in exposure process for the substrate is executed,