A display device comprising: a plurality of light-emitting cabinets (1000a, 1000b) each including a plurality of light-emitting modules (10a, 10b) and each including a respective support frame for supporting lower surfaces of the plurality of light-emitting modules (10a, 10b), wherein each of the plurality of light-emitting modules (10a, 10b) includes a substrate (120, 220), a light-emitting unit (100, 200, 300, 400) on the substrate (120, 220), and a black matrix disposed on the substrate to surround the light-emitting unit, and the light-emitting unit has a width of less than 500 μ m, wherein the light-emitting unit includes: a first light-emitting device (151, 251, 351, 451) mounted directly on the substrate and emitting a red wavelength; a second light-emitting device (152, 252, 352, 452) mounted directly on the substrate and emitting a green wavelength; a third light-emitting device (153, 253, 353, 453) mounted directly on the substrate and emitting a blue wavelength; and a molding part covering the first to third light-emitting devices, wherein each of the first to third light-emitting devices has a width of 200 μ m or less, the light-emitting unit and the black matrix are a chip on board type, and wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is lower than 50% of that of a sapphire substrate of each of the first to third light-emitting devices. a plurality of light-emitting cabinets (1000a, 1000b) each including a plurality of light-emitting modules (10a, 10b) and each including a respective support frame for supporting lower surfaces of the plurality of light-emitting modules (10a, 10b), wherein each of the plurality of light-emitting modules (10a, 10b) includes a substrate (120, 220), a light-emitting unit (100, 200, 300, 400) on the substrate (120, 220), and a black matrix disposed on the substrate to surround the light-emitting unit, and the light-emitting unit has a width of less than 500 μ m, wherein the light-emitting unit includes: a first light-emitting device (151, 251, 351, 451) mounted directly on the substrate and emitting a red wavelength; a second light-emitting device (152, 252, 352, 452) mounted directly on the substrate and emitting a green wavelength; a third light-emitting device (153, 253, 353, 453) mounted directly on the substrate and emitting a blue wavelength; and a molding part covering the first to third light-emitting devices, wherein each of the first to third light-emitting devices has a width of 200 μ m or less, the light-emitting unit and the black matrix are a chip on board type, and wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is lower than 50% of that of a sapphire substrate of each of the first to third light-emitting devices. a first light-emitting device (151, 251, 351, 451) mounted directly on the substrate and emitting a red wavelength; a second light-emitting device (152, 252, 352, 452) mounted directly on the substrate and emitting a green wavelength; a third light-emitting device (153, 253, 353, 453) mounted directly on the substrate and emitting a blue wavelength; and a molding part covering the first to third light-emitting devices, wherein each of the first to third light-emitting devices has a width of 200 μ m or less, the light-emitting unit and the black matrix are a chip on board type, and wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is lower than 50% of that of a sapphire substrate of each of the first to third light-emitting devices.