An assembly structure, comprising: a circuit board (21, 61, 101), configured to provide a first power supply; a chip (22, 62, 102); and a power converting module (23, 63, 103, 69'), configured to electrically connect the circuit board (21, 61, 101) and the chip (22, 62, 102), convert the first power supply to a second power supply, and supply the second power supply to the chip (22, 62, 102), wherein the circuit board, (21, 61, 101) the chip (22, 62, 102) and the power converting module (23, 63, 103, 69') are stacked to form the assembly structure, the chip (22, 62, 102) and the power converting module (23, 63, 103, 69') are located at two opposite sides of the circuit board (21, 61, 101) respectively, where: the power converting module (23, 63, 103, 69') has a first electrical connecting surface and a second electrical connecting surface, the first electrical connecting surface is located at an upper surface of the power converting module (23, 63, 103, 69') within the stack, the second electrical connecting surface is located at a lower surface of the power converting module within the stack and is different from the first electrical connecting surface, and the first electrical connecting surface is configured to electrically connect to the circuit board (21, 61, 101) directly, and the assembly structure further comprises a connector, configured to electrically connect the second electrical connecting surface to the circuit board (21, 61, 101). a circuit board (21, 61, 101), configured to provide a first power supply; a chip (22, 62, 102); and a power converting module (23, 63, 103, 69'), configured to electrically connect the circuit board (21, 61, 101) and the chip (22, 62, 102), convert the first power supply to a second power supply, and supply the second power supply to the chip (22, 62, 102), wherein the circuit board, (21, 61, 101) the chip (22, 62, 102) and the power converting module (23, 63, 103, 69') are stacked to form the assembly structure, the chip (22, 62, 102) and the power converting module (23, 63, 103, 69') are located at two opposite sides of the circuit board (21, 61, 101) respectively, where: the power converting module (23, 63, 103, 69') has a first electrical connecting surface and a second electrical connecting surface, the first electrical connecting surface is located at an upper surface of the power converting module (23, 63, 103, 69') within the stack, the second electrical connecting surface is located at a lower surface of the power converting module within the stack and is different from the first electrical connecting surface, and the first electrical connecting surface is configured to electrically connect to the circuit board (21, 61, 101) directly, and the assembly structure further comprises a connector, configured to electrically connect the second electrical connecting surface to the circuit board (21, 61, 101). the power converting module (23, 63, 103, 69') has a first electrical connecting surface and a second electrical connecting surface, the first electrical connecting surface is located at an upper surface of the power converting module (23, 63, 103, 69') within the stack, the second electrical connecting surface is located at a lower surface of the power converting module within the stack and is different from the first electrical connecting surface, and the first electrical connecting surface is configured to electrically connect to the circuit board (21, 61, 101) directly, and the assembly structure further comprises a connector, configured to electrically connect the second electrical connecting surface to the circuit board (21, 61, 101).