A method for manufacturing a bamboo chip integrated material, comprising the following steps: S1. processing bamboos into bamboo chip units, providing triangular sharp teeth and grooves at both ends of each bamboo chip unit, wherein the sharp teeth include large teeth and a row of a plurality of small teeth, the large teeth are thicker than the small teeth, the large teeth are arranged adjacent to one side edges of the bamboo chip units, and the plurality of small teeth extend to another side edges of the bamboo chip units from the large teeth, the grooves include large slots and small slots respectively matching the large teeth and the small teeth, continuously meshing and butting the plurality of bamboo chip units, wherein continuously meshing and butting the plurality of bamboo chip units includes coating an adhesive onto the sharp teeth and the grooves, and continuously meshing and butting heads and tails of the bamboo chip units with equal width and equal thickness to obtain lengthened bamboo chips through press-roll toothing mechanical equipment; and cutting off the bamboo chip units that reach a preset length to obtain lengthened bamboo chips according to needs; S2. taking the plurality of lengthened bamboo chips obtained in step S1, conducting vertical assembly processing in a thickness direction of the lengthened bamboo chips after the surface of each lengthened bamboo chip is glued with the adhesive, and providing the meshing butt-joint parts of the adjacent lengthened bamboo chips in a staggered mode to obtain blank plates; S3. placing the blank plates obtained in Step S2 in a hot press with positive and lateral pressing functions for positive and lateral non high frequency hot pressing and gluing treatment to obtain the bamboo chip integrated materials; when the adhesive is made of urea resin, the hot pressing and gluing treatment temperature is 90-100°C; when the adhesive is made of phenolic resin, the hot pressing and gluing treatment temperature is 130-140°C; for the hot pressing and gluing treatment, a positive pressure is 0.1-0.5 MPa, and a lateral pressure is 0.3-3.0 MPa. S1. processing bamboos into bamboo chip units, providing triangular sharp teeth and grooves at both ends of each bamboo chip unit, wherein the sharp teeth include large teeth and a row of a plurality of small teeth, the large teeth are thicker than the small teeth, the large teeth are arranged adjacent to one side edges of the bamboo chip units, and the plurality of small teeth extend to another side edges of the bamboo chip units from the large teeth, the grooves include large slots and small slots respectively matching the large teeth and the small teeth, continuously meshing and butting the plurality of bamboo chip units, wherein continuously meshing and butting the plurality of bamboo chip units includes coating an adhesive onto the sharp teeth and the grooves, and continuously meshing and butting heads and tails of the bamboo chip units with equal width and equal thickness to obtain lengthened bamboo chips through press-roll toothing mechanical equipment; and cutting off the bamboo chip units that reach a preset length to obtain lengthened bamboo chips according to needs; S2. taking the plurality of lengthened bamboo chips obtained in step S1, conducting vertical assembly processing in a thickness direction of the lengthened bamboo chips after the surface of each lengthened bamboo chip is glued with the adhesive, and providing the meshing butt-joint parts of the adjacent lengthened bamboo chips in a staggered mode to obtain blank plates; S3. placing the blank plates obtained in Step S2 in a hot press with positive and lateral pressing functions for positive and lateral non high frequency hot pressing and gluing treatment to obtain the bamboo chip integrated materials; when the adhesive is made of urea resin, the hot pressing and gluing treatment temperature is 90-100°C; when the adhesive is made of phenolic resin, the hot pressing and gluing treatment temperature is 130-140°C; for the hot pressing and gluing treatment, a positive pressure is 0.1-0.5 MPa, and a lateral pressure is 0.3-3.0 MPa.