Electromagnetic wave propagation disruption device with a metamaterial structure comprising: - a plurality of conductive elements (e 1,1,..., e i,j,..., e m,n, e' 1,1,..., e' i,j,..., e' m,n) separated from each other and arranged on a top face of a substrate, - a plurality of interconnection networks (20, 22, 24) electrically interconnecting at least some of these conductive elements (e 1,i,..., e i,j,..., e m,n, e' 1,1,..., e' i,j,..., e' m,n), these interconnection networks (20, 22, 24) not being electrically connected to each other and at least two of these interconnection networks (20, 22, 24) being dimensioned differently to each other, therefore involving distances between interconnected conductive elements that are different from one network to the other, wherein these interconnection networks (20, 22, 24) generate thanks to their different dimensioning phase shifts (Φ 1, Φ 2,..., Φ n/2), between the conductive elements (e 1,i,..., e i,j,..., e m,n, e' 1,1,..., e' i,j,..., e' m,n) interconnected thereby, different from one of these interconnection networks to the other, - a ground plane positioned on a bottom face of the substrate with holes formed in this ground plane, and - a set of metallic vias (v 1,1,..., v i,j,..., v m,n, v' 1,1,..., v' i,j,..., v' m,n) formed in the substrate and passing through the entire thickness thereof, each of these metallic vias (v 1,1,..., v i,j,..., v m,n, v' 1,1,..., v' i,j,..., v' m,n) comprising an upper end in contact with one of the conductive elements (e 1,i,..., e i,j,..., e m,n, e' 1,1,..., e' i,j,..., e' m,n) and a lower end arranged facing one of the holes of the ground plane, with no electrical contact with the ground plane and with electrical contact with one of the interconnection networks. - a plurality of conductive elements (e 1,1,..., e i,j,..., e m,n, e' 1,1,..., e' i,j,..., e' m,n) separated from each other and arranged on a top face of a substrate, - a plurality of interconnection networks (20, 22, 24) electrically interconnecting at least some of these conductive elements (e 1,i,..., e i,j,..., e m,n, e' 1,1,..., e' i,j,..., e' m,n), these interconnection networks (20, 22, 24) not being electrically connected to each other and at least two of these interconnection networks (20, 22, 24) being dimensioned differently to each other, therefore involving distances between interconnected conductive elements that are different from one network to the other, wherein these interconnection networks (20, 22, 24) generate thanks to their different dimensioning phase shifts (Φ 1, Φ 2,..., Φ n/2), between the conductive elements (e 1,i,..., e i,j,..., e m,n, e' 1,1,..., e' i,j,..., e' m,n) interconnected thereby, different from one of these interconnection networks to the other, - a ground plane positioned on a bottom face of the substrate with holes formed in this ground plane, and - a set of metallic vias (v 1,1,..., v i,j,..., v m,n, v' 1,1,..., v' i,j,..., v' m,n) formed in the substrate and passing through the entire thickness thereof, each of these metallic vias (v 1,1,..., v i,j,..., v m,n, v' 1,1,..., v' i,j,..., v' m,n) comprising an upper end in contact with one of the conductive elements (e 1,i,..., e i,j,..., e m,n, e' 1,1,..., e' i,j,..., e' m,n) and a lower end arranged facing one of the holes of the ground plane, with no electrical contact with the ground plane and with electrical contact with one of the interconnection networks.