A resin composition for bonding semiconductors comprising: a binder resin containing a (meth)acrylate-based resin and an epoxy resin; a curing agent; a heat dissipation filler in which a functional group represented by the following Chemical Formula 1 is introduced onto the surface thereof; and a curing catalyst containing an imidazole-based compound and an organic acid compound; wherein, in Chemical Formula 1, Z is one of an aryl having 6 to 30 carbon atoms, epoxy, (meth)acryloyloxy, an alkenyl having 2 to 40 carbon atoms, an alkenylaryl having 8 to 40 carbon atoms, or an alkyl having 1 to 20 carbon atoms, L 1 is one of a direct bond, an alkylene having 1 to 20 carbon atoms, an alkyleneoxy having 1 to 20 carbon atoms, or an alkyleneoxyalkylene having 1 to 20 carbon atoms, and R 1 and R 2 are the same as or different from each other, and are each independently one of hydrogen, an alkyl having 1 to 20 carbon atoms, an alkoxy having 1 to 20 carbon atoms, a hydroxy group, a direct bond, or oxy; wherein the weight ratio of the imidazole-based compound: the organic acid compound is 0.5: 1 to 10: 1; and wherein the heat dissipation filler includes at least one selected from the group consisting of alumina, boron nitride, aluminum nitride, silicon carbide, magnesium oxide, zinc oxide, aluminum hydroxide, calcium carbonate, magnesium hydroxide, aluminum oxide, and talc. a binder resin containing a (meth)acrylate-based resin and an epoxy resin; a curing agent; a heat dissipation filler in which a functional group represented by the following Chemical Formula 1 is introduced onto the surface thereof; and a curing catalyst containing an imidazole-based compound and an organic acid compound; wherein, in Chemical Formula 1, Z is one of an aryl having 6 to 30 carbon atoms, epoxy, (meth)acryloyloxy, an alkenyl having 2 to 40 carbon atoms, an alkenylaryl having 8 to 40 carbon atoms, or an alkyl having 1 to 20 carbon atoms, L 1 is one of a direct bond, an alkylene having 1 to 20 carbon atoms, an alkyleneoxy having 1 to 20 carbon atoms, or an alkyleneoxyalkylene having 1 to 20 carbon atoms, and R 1 and R 2 are the same as or different from each other, and are each independently one of hydrogen, an alkyl having 1 to 20 carbon atoms, an alkoxy having 1 to 20 carbon atoms, a hydroxy group, a direct bond, or oxy; wherein the weight ratio of the imidazole-based compound: the organic acid compound is 0.5: 1 to 10: 1; and wherein the heat dissipation filler includes at least one selected from the group consisting of alumina, boron nitride, aluminum nitride, silicon carbide, magnesium oxide, zinc oxide, aluminum hydroxide, calcium carbonate, magnesium hydroxide, aluminum oxide, and talc. Z is one of an aryl having 6 to 30 carbon atoms, epoxy, (meth)acryloyloxy, an alkenyl having 2 to 40 carbon atoms, an alkenylaryl having 8 to 40 carbon atoms, or an alkyl having 1 to 20 carbon atoms, L 1 is one of a direct bond, an alkylene having 1 to 20 carbon atoms, an alkyleneoxy having 1 to 20 carbon atoms, or an alkyleneoxyalkylene having 1 to 20 carbon atoms, and R 1 and R 2 are the same as or different from each other, and are each independently one of hydrogen, an alkyl having 1 to 20 carbon atoms, an alkoxy having 1 to 20 carbon atoms, a hydroxy group, a direct bond, or oxy; wherein the weight ratio of the imidazole-based compound: the organic acid compound is 0.5: 1 to 10: 1; and wherein the heat dissipation filler includes at least one selected from the group consisting of alumina, boron nitride, aluminum nitride, silicon carbide, magnesium oxide, zinc oxide, aluminum hydroxide, calcium carbonate, magnesium hydroxide, aluminum oxide, and talc.