A fabrication method of a conductive film, comprising the following steps: S10: selecting a support layer, and plating first metal layers on an upper surface and a lower surface of the support layer, respectively; S20: compounding a first film on a surface of one of the first metal layers (101and compounding a second film on a surface of the other one of the first metal layers; S30: compounding a third film on surfaces of the first film and the second film by a film compounding technology, and etching a plurality of circular holes penetrating through the third film and the second film, wherein a depth of each of the plurality of circular holes is equal to a sum of a thickness of the third film and a thickness of the second film; S40: plating a second metal layer on an outer surface of the third film and an inner wall of the circular holes, by a vacuum coating technology; S50: peeling off the third film from the second film while retaining the second metal layer plated on the inner wall of the circular holes of the second film; filling a first flame retardant in the circular holes, and filling a layer of a first modified paraffin on the first flame retardant for sealing to obtain a composite film; or, filling a first flame retardant in the circular holes, filling a layer of a first modified paraffin on the first flame retardant, refilling a second flame retardant based on the first modified paraffin, and refilling a second modified paraffin for sealing to obtain a composite film; and S60: plating a third metal layer on an upper surface and a lower surface of the composite film by a vacuum coating technology, and rolling to obtain the conductive film, wherein in S50, the modified paraffin (304, 306) comprises the following components: 6 to 7 parts of paraffin, 0.5 to 1 parts of lithium chloride, 0.5 to 3 parts of conductive graphite, and 1 to 3 parts of dodecanoic acid; and the modified paraffin (304,.306) has a softening point of 65°C to 80°C. and wherein the first metal layer and the third metal layer each are a copper or aluminum layer with a thickness of 200 nm to 300 nm, and the second metal layer is a lithium layer with a thickness of 20 nm to 100 nm. S10: selecting a support layer, and plating first metal layers on an upper surface and a lower surface of the support layer, respectively; S20: compounding a first film on a surface of one of the first metal layers (101and compounding a second film on a surface of the other one of the first metal layers; S30: compounding a third film on surfaces of the first film and the second film by a film compounding technology, and etching a plurality of circular holes penetrating through the third film and the second film, wherein a depth of each of the plurality of circular holes is equal to a sum of a thickness of the third film and a thickness of the second film; S40: plating a second metal layer on an outer surface of the third film and an inner wall of the circular holes, by a vacuum coating technology; S50: peeling off the third film from the second film while retaining the second metal layer plated on the inner wall of the circular holes of the second film; filling a first flame retardant in the circular holes, and filling a layer of a first modified paraffin on the first flame retardant for sealing to obtain a composite film; or, filling a first flame retardant in the circular holes, filling a layer of a first modified paraffin on the first flame retardant, refilling a second flame retardant based on the first modified paraffin, and refilling a second modified paraffin for sealing to obtain a composite film; and S60: plating a third metal layer on an upper surface and a lower surface of the composite film by a vacuum coating technology, and rolling to obtain the conductive film, wherein in S50, the modified paraffin (304, 306) comprises the following components: 6 to 7 parts of paraffin, 0.5 to 1 parts of lithium chloride, 0.5 to 3 parts of conductive graphite, and 1 to 3 parts of dodecanoic acid; and the modified paraffin (304,.306) has a softening point of 65°C to 80°C. and wherein the first metal layer and the third metal layer each are a copper or aluminum layer with a thickness of 200 nm to 300 nm, and the second metal layer is a lithium layer with a thickness of 20 nm to 100 nm.