Electric power inverter for an electrical machine of an electrically powered drive system, - wherein the electric power inverter incorporates a capacitor board having a plurality of capacitors, and at least one semiconductor board having a plurality of power semiconductors, and - wherein the capacitor board and the at least one semiconductor board are mutually stacked in a stacking direction, with a clearance, in a stack formation, and are electrically interconnected, - wherein the plurality of capacitors on the capacitor board are arranged in the stacking direction, and are fitted to a side thereof facing the at least one semiconductor board, - wherein the plurality of capacitors are arranged on the capacitor board to form at least one open location space between the capacitors on the capacitor board, each location space positioned to accommodate a respective one of the at least one semiconductor board, and - wherein the at least one semiconductor board is arranged within the respective location space, with a clearance to the capacitor board, characterized in that - the capacitor board and the at least one semiconductor board are mutually electrically bonded by means of at least two connecting busbars, - the at least two connecting busbars and an electrically-insulating busbar guide plate are arranged in the location space between the capacitor board and the at least one semiconductor board, and both maintain a clearance between the capacitor board and the at least one semiconductor board, - the electrically-insulating busbar guide plate is stacked in the stack formation of the electric power inverter in the stacking direction, and arranged in the location space adjacently to the capacitor board and the at least one semiconductor board, and - the at least two connecting busbars are fitted to the busbar guide plate, perpendicularly to the stacking direction and the busbar guide plate, in a penetrative manner. - wherein the electric power inverter incorporates a capacitor board having a plurality of capacitors, and at least one semiconductor board having a plurality of power semiconductors, and - wherein the capacitor board and the at least one semiconductor board are mutually stacked in a stacking direction, with a clearance, in a stack formation, and are electrically interconnected, - wherein the plurality of capacitors on the capacitor board are arranged in the stacking direction, and are fitted to a side thereof facing the at least one semiconductor board, - wherein the plurality of capacitors are arranged on the capacitor board to form at least one open location space between the capacitors on the capacitor board, each location space positioned to accommodate a respective one of the at least one semiconductor board, and - wherein the at least one semiconductor board is arranged within the respective location space, with a clearance to the capacitor board, - the capacitor board and the at least one semiconductor board are mutually electrically bonded by means of at least two connecting busbars, - the at least two connecting busbars and an electrically-insulating busbar guide plate are arranged in the location space between the capacitor board and the at least one semiconductor board, and both maintain a clearance between the capacitor board and the at least one semiconductor board, - the electrically-insulating busbar guide plate is stacked in the stack formation of the electric power inverter in the stacking direction, and arranged in the location space adjacently to the capacitor board and the at least one semiconductor board, and - the at least two connecting busbars are fitted to the busbar guide plate, perpendicularly to the stacking direction and the busbar guide plate, in a penetrative manner.