A light-emitting or light-receiving semiconductor module comprising: a plurality of semiconductor devices having light-emitting or light-receiving properties, said plurality of semiconductor devices being disposed in a plurality of columns with uniform conductive orientation and being disposed in ring formations at equal intervals along a perimeter, and a conductive connection arrangement connecting the semiconductor devices in each of said columns to be electrically connected in series and connecting the semiconductor devices in each of said rings to be electrically connected in parallel, characterized in that: each of said semiconductor devices is formed from a spherical p-type or n-type semiconductor element with a pn junction formed on a surface section of said spherical p-type or n-type semiconductor element and electrodes (9a, 9b) disposed on said surface respectively in contact with the n-type and p-type ends of said pn junction, said electrodes (9a, 9b) being disposed on either side of a center of said spherical p-type or n-type semiconductor element; said conductive connection arrangement comprises plural metallic lead members, said plural metallic lead members including plural lead members mounted between adjacent rings of said spherical semiconductor devices, a lead member mounted on one side of a ring that is on one end side of said module and a lead member mounted on the other side of a ring that is on the other end side of said module, and forming electrical connections with said electrodes (9a, 9b); and the centers of said spherical semiconductors devices in each ring are between the pair of lead members mounted on both sides of said ring. a plurality of semiconductor devices having light-emitting or light-receiving properties, said plurality of semiconductor devices being disposed in a plurality of columns with uniform conductive orientation and being disposed in ring formations at equal intervals along a perimeter, and a conductive connection arrangement connecting the semiconductor devices in each of said columns to be electrically connected in series and connecting the semiconductor devices in each of said rings to be electrically connected in parallel, characterized in that: each of said semiconductor devices is formed from a spherical p-type or n-type semiconductor element with a pn junction formed on a surface section of said spherical p-type or n-type semiconductor element and electrodes (9a, 9b) disposed on said surface respectively in contact with the n-type and p-type ends of said pn junction, said electrodes (9a, 9b) being disposed on either side of a center of said spherical p-type or n-type semiconductor element; said conductive connection arrangement comprises plural metallic lead members, said plural metallic lead members including plural lead members mounted between adjacent rings of said spherical semiconductor devices, a lead member mounted on one side of a ring that is on one end side of said module and a lead member mounted on the other side of a ring that is on the other end side of said module, and forming electrical connections with said electrodes (9a, 9b); and the centers of said spherical semiconductors devices in each ring are between the pair of lead members mounted on both sides of said ring. each of said semiconductor devices is formed from a spherical p-type or n-type semiconductor element with a pn junction formed on a surface section of said spherical p-type or n-type semiconductor element and electrodes (9a, 9b) disposed on said surface respectively in contact with the n-type and p-type ends of said pn junction, said electrodes (9a, 9b) being disposed on either side of a center of said spherical p-type or n-type semiconductor element; said conductive connection arrangement comprises plural metallic lead members, said plural metallic lead members including plural lead members mounted between adjacent rings of said spherical semiconductor devices, a lead member mounted on one side of a ring that is on one end side of said module and a lead member mounted on the other side of a ring that is on the other end side of said module, and forming electrical connections with said electrodes (9a, 9b); and the centers of said spherical semiconductors devices in each ring are between the pair of lead members mounted on both sides of said ring.