mhurhangee/ep-ind-claims huggingface dataset:
A mobile computing device comprising: a first port configured with a first pinout to support a first data format; a data source (130, 132, 134) configured to provide data in a second data format different from the first data format; a second port configured with a third pinout to support the second data format; an attachment sensor configured to detect a bias asserted on said first port; and a first multiplexer configured to selectively transmit data from said data source to said first port, wherein said first port is reconfigured with a second pinout to support the second data format, wherein said multiplexer transmits data in the second data format to said second port when a bias is not detected, and transmits data in the second data format to said first port when the bias is detected. a first port configured with a first pinout to support a first data format; a data source (130, 132, 134) configured to provide data in a second data format different from the first data format; a second port configured with a third pinout to support the second data format; an attachment sensor configured to detect a bias asserted on said first port; and a first multiplexer configured to selectively transmit data from said data source to said first port, wherein said first port is reconfigured with a second pinout to support the second data format, wherein said multiplexer transmits data in the second data format to said second port when a bias is not detected, and transmits data in the second data format to said first port when the bias is detected.
An image processing method of generating print data to cause a printing apparatus that prints a print image based on image data to execute printing, by repeating a pass operation in which a nozzle set forms dots on a printing medium by ejecting ink droplets while moving relative to the printing medium in a main scanning direction, and a feed operation in which the nozzle set and the printing medium are moved relative to each other in a sub-scanning direction that intersects with the main scanning direction, the method comprising: performing a plurality of halftone processes for a same region of image data, the halftone processes being to generate halftone data to determine a formation state of dots formed by the nozzle set that ejects a same color of ink; and allocating the generated halftone data to pass operations, characterised in that the nozzle set includes a plurality of nozzle groups, and the halftone processes include halftone processes corresponding to the plurality of nozzle groups, respectively. performing a plurality of halftone processes for a same region of image data, the halftone processes being to generate halftone data to determine a formation state of dots formed by the nozzle set that ejects a same color of ink; and allocating the generated halftone data to pass operations, characterised in that the nozzle set includes a plurality of nozzle groups, and the halftone processes include halftone processes corresponding to the plurality of nozzle groups, respectively.
A method for wireless communications, comprising: determining different portions of resources for an assigned downlink channel that are subject to at least one of different levels or different types of interference; and selecting techniques for processing signals received in the different portions of the resources, wherein each technique is selected based at least on a corresponding level or type of interference, wherein the selected technique includes interference cancelation, puncturing and / or rate matching. determining different portions of resources for an assigned downlink channel that are subject to at least one of different levels or different types of interference; and selecting techniques for processing signals received in the different portions of the resources, wherein each technique is selected based at least on a corresponding level or type of interference, wherein the selected technique includes interference cancelation, puncturing and / or rate matching.
A shutter valve for alternatingly allowing and stopping a high pressure water flow, comprising a section having a rectangular cross section with an opening, wherein a multitude of vanes are rotatably mounted in the opening of the section, wherein the vanes have a rectangular longitunal cross section in a first direction, and a rectangular longitunal cross section in a second direction perpendicular to said first direction, wherein the circumferential wall around the axis of each vane forms a closed water impermeable surface, wherein the axes of said multitude of vanes all extend in a parallel manner, wherein the distances between the axes of adjacent vanes are approximately half the distance between the two outermost tips of each vane, seen in the cross section in said third direction, such that when the vanes are rotated to the closed position the lower half of the surfaces on a first side and upper half of the surfaces on a second side of all vanes form a single closed surface on said first side and a single closed surface on said second side respectively, each in substantially a single flat plane perpendicular to the flow axis of the valve, said surfaces closing the opening of said section, characterized in that said vanes have a rhombic cross section in a third direction perpendicular to said first and second directions, said third direction being the axis of the vane, and the upper half of said surfaces on said first side and the lower half of said surfaces on said second side of said vanes rest against each other when the vanes are rotated to the closed position.
A semiconductor pressure sensor assembly suitable for use under an exhaust gas environment of an automobile engine configured to measure a pressure of the exhaust gas which contains corrosive components, the pressure sensor assembly comprising: - a first cavity comprising an opening configured to allow exposure to said exhaust gas; - a pressure sensor arranged in said cavity, the pressure sensor comprising a plurality of first bondpads made of or covered by a first corrosion resistant material; - a CMOS chip mounted on a first substrate, the CMOS chip comprising a plurality of first bondpads without corrosion resistant material on top, the CMOS chip and its first bondpads being protected from exposure to said exhaust gas by encapsulation with a corrosion resistant plastic material, characterized in that the semiconductor pressure sensor assembly further comprises - an interconnection module comprising a second substrate and a plurality of electrically conductive paths made of a second corrosion resistant material, each conductive path having a first bondpad and a second bondpad; - the first bondpads of the pressure sensor being connected via first bonding wires to the first bondpads of the interconnection module, the first bonding wires being made of a third corrosion resistant material; - the first bondpads of the CMOS chip being connected via second bonding wires to the second bondpads of the interconnection module; - the second bondpads of the interconnection module and the second bonding wires and part of the interconnection module are protected from exposure to said exhaust gas by encapsulation with a corrosion resistant plastic material. - a first cavity comprising an opening configured to allow exposure to said exhaust gas; - a pressure sensor arranged in said cavity, the pressure sensor comprising a plurality of first bondpads made of or covered by a first corrosion resistant material; - a CMOS chip mounted on a first substrate, the CMOS chip comprising a plurality of first bondpads without corrosion resistant material on top, the CMOS chip and its first bondpads being protected from exposure to said exhaust gas by encapsulation with a corrosion resistant plastic material, - an interconnection module comprising a second substrate and a plurality of electrically conductive paths made of a second corrosion resistant material, each conductive path having a first bondpad and a second bondpad; - the first bondpads of the pressure sensor being connected via first bonding wires to the first bondpads of the interconnection module, the first bonding wires being made of a third corrosion resistant material; - the first bondpads of the CMOS chip being connected via second bonding wires to the second bondpads of the interconnection module; - the second bondpads of the interconnection module and the second bonding wires and part of the interconnection module are protected from exposure to said exhaust gas by encapsulation with a corrosion resistant plastic material.
A compressor (1, 201) for compressing refrigerant, comprising: a casing accommodating a refrigerant passage (45, 46, 48) in the interior thereof; and a pipe (71; 72; 73; 74) extending from the inside to the outside of the casing, and wherein the pipe includes two ends, one of the ends being a closed end (71 a; 72a; 73a; 74a) disposed in a predetermined position in the refrigerant passage, the other of the ends being an opened end (71b; 72b; 73b; 74b) disposed outside the casing, and a motor disposed below the compression mechanism, the motor functioning as a driving source of the compression mechanism; and characterized by further comprising: a guide plate disposed on the outer periphery of the motor, the guide plate configured to guide the refrigerant compressed and discharged by the compression mechanism, and wherein the predetermined position is between an inner wall of the casing and an outer surface of the guide plate. a casing accommodating a refrigerant passage (45, 46, 48) in the interior thereof; and a pipe (71; 72; 73; 74) extending from the inside to the outside of the casing, and wherein the pipe includes two ends, one of the ends being a closed end (71 a; 72a; 73a; 74a) disposed in a predetermined position in the refrigerant passage, the other of the ends being an opened end (71b; 72b; 73b; 74b) disposed outside the casing, and a motor disposed below the compression mechanism, the motor functioning as a driving source of the compression mechanism; and characterized by further comprising: a guide plate disposed on the outer periphery of the motor, the guide plate configured to guide the refrigerant compressed and discharged by the compression mechanism, and wherein the predetermined position is between an inner wall of the casing and an outer surface of the guide plate. a guide plate disposed on the outer periphery of the motor, the guide plate configured to guide the refrigerant compressed and discharged by the compression mechanism, and wherein the predetermined position is between an inner wall of the casing and an outer surface of the guide plate.
Electronic circuit for providing a digital signal (Sn), an analog signal obtained by digital-to-analog conversion of the digital signal comprising a succession of ramps, the electronic circuit being clocked by a clock signal, the electronic circuit being configured to supply a number Nout of successive digital values of the digital signal at each cycle of the clock signal, Nout being greater than 1, the electronic circuit comprising a first memory in which are stored, for each ramp, first data comprising a start value of the ramp, the slope of the ramp, and a remaining duration of the ramp in the last cycle of the clock signal in which the ramp extends, and a second memory in which are stored second data relative to the numbers of cycles of the clock signal over which some of the ramps extend, and a first circuit configured to read from the first memory the first data relative to a plurality of successive ramps and from the second memory the second data associated with said plurality of successive ramps, and to provide said digital values based on the first and second read data.
A modular multilevel converter, hereinafter abbreviated as MMC, having an AC side and a DC side and comprising multiple converter arms (11a, 11b, 11c), each converter arn including: N submodules connected to each other in series, N being an integer equal to or greater than 2; and a circuit opening unit connected in series to the N submodules and configured to open a circuit of the converter arm, wherein the N submodules are n submodules including full-bridge circuits and N-n submodules including half-bridge circuits, n being less than N, wherein, when DC failure such a short circuit at the DC side of the MMC occurs, power semiconductors in the full-bridge circuits and the half-bridge circuits of the submodules are configured to be turned off and stay off for a a particular time period during which a current, hereinafter referred to as a DC fault current, in the converter arm is zero, characterised in that the circuit opening unit includes one or more power semiconductors connected to each other in series, and the power semiconductors of the circuit opening unit are placed in a reverse direction to the power semiconductors in the submodules, wherein when the DC fault current in the converter arm is within a preset range from zero, the power semiconductors of the circuit opening unit are configured to be turned off, such that the DC fault current in the converter arm is blocked, and wherein the circuit opening unit is configured to open the circuit of the converter arm such that the DC fault current is blocked when a voltage stored in capacitors of the full-bridge circuits is less than a peak value of a three-phase line voltage at an AC side of the MMC. N submodules connected to each other in series, N being an integer equal to or greater than 2; and a circuit opening unit connected in series to the N submodules and configured to open a circuit of the converter arm, wherein the N submodules are n submodules including full-bridge circuits and N-n submodules including half-bridge circuits, n being less than N, wherein, when DC failure such a short circuit at the DC side of the MMC occurs, power semiconductors in the full-bridge circuits and the half-bridge circuits of the submodules are configured to be turned off and stay off for a a particular time period during which a current, hereinafter referred to as a DC fault current, in the converter arm is zero, characterised in that the circuit opening unit includes one or more power semiconductors connected to each other in series, and the power semiconductors of the circuit opening unit are placed in a reverse direction to the power semiconductors in the submodules, wherein when the DC fault current in the converter arm is within a preset range from zero, the power semiconductors of the circuit opening unit are configured to be turned off, such that the DC fault current in the converter arm is blocked, and wherein the circuit opening unit is configured to open the circuit of the converter arm such that the DC fault current is blocked when a voltage stored in capacitors of the full-bridge circuits is less than a peak value of a three-phase line voltage at an AC side of the MMC.
A resin that is the reaction product of: one or more polythiols having between two and ten thiol moieties; one or more polyepoxides having between two and ten epoxy moieties; one or more solid particulate fillers; and one or more amine catalysts of the formula NR 1 R 2 R 3, or a salt thereof, wherein each of R 1, R 2, and R 3 is independently linear or branched C1-20 alkyl or two or more of R 1, R 2, and R 3 combine, with the N to which they are bonded, to form a cyclic moiety, and wherein the resin preferably has a compressive strength of at least 97 Mpa (14 ksi) at 2% offset at 21°C (70°F) and at least 55 Mpa (8 ksi) at 2% offset at 88°C (190°F), said compressive strength being measured in accordance with ASTM 695. one or more polythiols having between two and ten thiol moieties; one or more polyepoxides having between two and ten epoxy moieties; one or more solid particulate fillers; and one or more amine catalysts of the formula NR 1 R 2 R 3, or a salt thereof, wherein each of R 1, R 2, and R 3 is independently linear or branched C1-20 alkyl or two or more of R 1, R 2, and R 3 combine, with the N to which they are bonded, to form a cyclic moiety, and wherein the resin preferably has a compressive strength of at least 97 Mpa (14 ksi) at 2% offset at 21°C (70°F) and at least 55 Mpa (8 ksi) at 2% offset at 88°C (190°F), said compressive strength being measured in accordance with ASTM 695.
A method for reading an optical code, wherein image data with the code are recorded using an image sensor, a first processing unit reads the image data from the image sensor and generates metadata for the image data and/or the code in the course of preprocessing the image data, and a second processing unit reads the code after the preprocessing by the first processing unit, wherein metadata is information about the image data, characterized in that the first processing unit is used to find edge positions of black/white transitions in the image data and pass them on to the second processing unit as metadata, which reads the code solely on the basis of the metadata without accessing the image data for this purpose, in that the edge positions are determined multiple times for several or all rows and/or columns of the image data, in that respective representative edge positions for the horizontal and/or vertical direction are determined from the multiple edge positions for several rows and/or columns, and in that, in order to find representative edge positions, the rows and/or columns are shifted relative to one another in order to align the respective edge positions with one another.
A method for preheating a pumpable food product in a hot filling system with a heater for heating the food product to a filling temperature, a preheater (4, 40) upstream from the heater for preheating the food product, a filler for adding the food product to containers, a cooling tunnel for cooling the hot-filled containers with a coolant which is conducted in a coolant circuit (20, 200) through the preheater (4, 40) and the cooling tunnel, with the preheater (4, 40) that supplies to the food product the thermal energy of the coolant from the cooling tunnel which is heated while cooling the containers, with a separate heat pump which uses the residual thermal energy from the coolant flowing out of the preheater (4, 40) on the primary side to further increase the temperature of the preheated food product with a heat carrier means that is conducted through the heat pump on the secondary side in a heat carrier means circuit, characterized in that the heat carrier means circuit is conducted through a second preheater for the food product downstream from the first preheater and upstream from the heater, wherein the food product is additionally preheated to a temperature below the filling temperature in the second preheater with the thermal energy provided by the heat pump on the secondary side by means of the heat carrier means.
A cleaning composition for removing soils comprising: (a) an aluminum hydroxycarboxylate; (b) an alkalinity source; and wherein the pH of the cleaning composition is between about 9 and about 14, wherein the aluminum hydroxycarboxylate comprises aluminum gluconate, and wherein the aluminum gluconate has a molar ratio of aluminum to gluconate of 1:4. (a) an aluminum hydroxycarboxylate; (b) an alkalinity source; and
A wireless communication method, comprising: receiving, by a user equipment, UE, of a power class supporting a maximum transmit power of 14 dBm, information broadcasted by a base station, wherein the information comprises one or more reference signal receiving power, RSRP, thresholds; determining, by the UE, a wireless coverage level of the UE by comparing a measured RSRP value with an adjusted RSRP threshold, wherein the adjusted RSRP threshold is obtained based on one of the one or more RSRP thresholds and an offset value determined by the UE; and determining, by the UE, a resource for a physical random access channel, PRACH, based on the wireless coverage level. receiving, by a user equipment, UE, of a power class supporting a maximum transmit power of 14 dBm, information broadcasted by a base station, wherein the information comprises one or more reference signal receiving power, RSRP, thresholds; determining, by the UE, a wireless coverage level of the UE by comparing a measured RSRP value with an adjusted RSRP threshold, wherein the adjusted RSRP threshold is obtained based on one of the one or more RSRP thresholds and an offset value determined by the UE; and determining, by the UE, a resource for a physical random access channel, PRACH, based on the wireless coverage level.
A structure for a rear part of a vehicle, comprising: a rear opening provided at the rear part of the vehicle; an openable and closable door for opening and closing the rear opening; a spoiler provided at an upper end portion of the door; and a deflector provided below the spoiler, characterized in that the deflector extends downward from a lower surface of the spoiler along an outer surface of the door and is disposed at a position offset by a predetermined distance from an end in a vehicle width direction of the spoiler toward a central portion in the vehicle width direction of the spoiler. a rear opening provided at the rear part of the vehicle; an openable and closable door for opening and closing the rear opening; a spoiler provided at an upper end portion of the door; and a deflector provided below the spoiler, characterized in that the deflector extends downward from a lower surface of the spoiler along an outer surface of the door and is disposed at a position offset by a predetermined distance from an end in a vehicle width direction of the spoiler toward a central portion in the vehicle width direction of the spoiler.
A fastening device for a sensor at a fitting comprising a first holding part and a second holding part as well as a quick clamping mechanism which clamps the fitting, wherein the quick clamping mechanism is supported at the first holding part which is connected to the second holding part which supports the sensor, with the first holding part and the second holding part (2, 3) forming a clamping device, wherein the first holding part comprises two hoops (5, 6), wherein at least one hoop engages behind a fitting support unit of the second holding part and the quick clamping mechanism is fastened between the two hoops (5, 6) of the first holding part, wherein the quick clamping mechanism is led or rotatably supported at an axle which connects the hoops (5, 6), characterized in that the fitting support unit is rotatably mounted.