A light emitting device package comprising: a first package body having first and second through holes (TH1, TH2); a light emitting device including first and second bonding parts (121, 122); a second package body having a first opening with the light emitting device being in the first opening; an adhesive layer between the first and second package bodies (113, 117) for coupling the first package body and the second package body; a first resin disposed between the first package body and the light emitting device; and first and second conductive layers (321, 322) disposed in the first through hole and the second through hole, respectively, wherein the first bonding part of the light emitting device overlaps with the first through hole and the second bonding part of the light emitting device overlaps with the second through hole, wherein the first bonding part and the second bonding part are spaced apart from each other, wherein the first and second conductive layers (321, 322) in the first and second through holes (TH1, TH2) respectively contacts the first and second bonding parts (121, 122), and a first side surface of the first bonding part and a second side surface of the second bonding part facing the first side surface contact the first resin, and characterized in that the adhesive layer is disposed at the periphery of the light emitting device to form a cavity, and wherein the light emitting device package further comprises a first conductor and a second conductor, wherein the first conductor is provided in the first through hole and disposed between the first bonding part and the first conductive layer, wherein the first conductor is electrically connected to the first bonding part and the first conductive layer, wherein the second conductor is provided in the second through hole and disposed between the second bonding part and the second conductive layer, wherein the second conductor is electrically connected to the second bonding part and the second conductive layer, wherein the first conductive layer is disposed on a lower surface and a side surface of the first conductor, and wherein the second conductive layer is disposed on a lower surface and a side surface of the second conductor. a first package body having first and second through holes (TH1, TH2); a light emitting device including first and second bonding parts (121, 122); a second package body having a first opening with the light emitting device being in the first opening; an adhesive layer between the first and second package bodies (113, 117) for coupling the first package body and the second package body; a first resin disposed between the first package body and the light emitting device; and first and second conductive layers (321, 322) disposed in the first through hole and the second through hole, respectively, wherein the first bonding part of the light emitting device overlaps with the first through hole and the second bonding part of the light emitting device overlaps with the second through hole, wherein the first bonding part and the second bonding part are spaced apart from each other, wherein the first and second conductive layers (321, 322) in the first and second through holes (TH1, TH2) respectively contacts the first and second bonding parts (121, 122), and a first side surface of the first bonding part and a second side surface of the second bonding part facing the first side surface contact the first resin, and characterized in that the adhesive layer is disposed at the periphery of the light emitting device to form a cavity, and wherein the light emitting device package further comprises a first conductor and a second conductor, wherein the first conductor is provided in the first through hole and disposed between the first bonding part and the first conductive layer, wherein the first conductor is electrically connected to the first bonding part and the first conductive layer, wherein the second conductor is provided in the second through hole and disposed between the second bonding part and the second conductive layer, wherein the second conductor is electrically connected to the second bonding part and the second conductive layer, wherein the first conductive layer is disposed on a lower surface and a side surface of the first conductor, and wherein the second conductive layer is disposed on a lower surface and a side surface of the second conductor.