A camera module, comprising at least one optical lens; at least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-photosensitive area surrounding around the photosensitive area; a circuit board, wherein the circuit board comprises at least one substrate and at least one electronic component, the substrate has a substrate front surface and a substrate back surface, the substrate front surface and the substrate back surface correspond to each other, wherein the electronic component is conductively connected to the substrate; wherein the photosensitive element is conductively connected with the substrate, wherein the optical lens is held in the photosensitive path of the photosensitive element, wherein the substrate further has at least one substrate channel, which extends from the substrate front surface to the substrate back surface; and at least one molded unit, which comprises at least one back surface molded portion, and wherein the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; characterized in that a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to the substrate channel of the substrate, wherein in a thickness direction of the substrate, at least one part of at least one of the electronic components located on the substrate front surface of the substrate and the non-photosensitive area of the photosensitive element are overlapped with each other. at least one optical lens; at least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-photosensitive area surrounding around the photosensitive area; a circuit board, wherein the circuit board comprises at least one substrate and at least one electronic component, the substrate has a substrate front surface and a substrate back surface, the substrate front surface and the substrate back surface correspond to each other, wherein the electronic component is conductively connected to the substrate; wherein the photosensitive element is conductively connected with the substrate, wherein the optical lens is held in the photosensitive path of the photosensitive element, wherein the substrate further has at least one substrate channel, which extends from the substrate front surface to the substrate back surface; and at least one molded unit, which comprises at least one back surface molded portion, and wherein the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; characterized in that a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to the substrate channel of the substrate, wherein in a thickness direction of the substrate, at least one part of at least one of the electronic components located on the substrate front surface of the substrate and the non-photosensitive area of the photosensitive element are overlapped with each other.