A film depositing apparatus by which an organic layer (b) can be formed on a surface (Zf) of an elongated substrate as it is transported along a predetermined transport path in a longitudinal direction and then an inorganic layer (f) can be formed on top of the organic layer (b), the film depositing apparatus comprising: a transport means (21, 50, 54, 24, 28, 31) for transporting the substrate along the predetermined transport path; a first film deposition compartment that is provided with a first film depositing means (62, 64) for forming the organic layer (b) on the surface (Zf) of the substrate; and a second film deposition compartment that is disposed downstream of the first film deposition compartment in the transport path and which is provided with a second film depositing means for forming an inorganic layer (f) on top of the organic layer (b), characterized by: a supply compartment for supplying the elongated substrate; a take-up compartment for winding up the elongated substrate; a differential pressure compartment disposed in the transport path between the first film deposition compartment and the second film deposition compartment; and an evacuating unit that is arranged to reduce the pressures within the first film deposition compartment, the second film deposition compartment, the supply compartment, the take-up compartment and the differential pressure compartment, wherein: the transport means is arranged such that the substrate is transported through the first film deposition compartment, the differential pressure compartment and the second film deposition compartment in that order. a transport means (21, 50, 54, 24, 28, 31) for transporting the substrate along the predetermined transport path; a first film deposition compartment that is provided with a first film depositing means (62, 64) for forming the organic layer (b) on the surface (Zf) of the substrate; and a second film deposition compartment that is disposed downstream of the first film deposition compartment in the transport path and which is provided with a second film depositing means for forming an inorganic layer (f) on top of the organic layer (b), characterized by: a supply compartment for supplying the elongated substrate; a take-up compartment for winding up the elongated substrate; a differential pressure compartment disposed in the transport path between the first film deposition compartment and the second film deposition compartment; and an evacuating unit that is arranged to reduce the pressures within the first film deposition compartment, the second film deposition compartment, the supply compartment, the take-up compartment and the differential pressure compartment, wherein: the transport means is arranged such that the substrate is transported through the first film deposition compartment, the differential pressure compartment and the second film deposition compartment in that order. a supply compartment for supplying the elongated substrate; a take-up compartment for winding up the elongated substrate; a differential pressure compartment disposed in the transport path between the first film deposition compartment and the second film deposition compartment; and an evacuating unit that is arranged to reduce the pressures within the first film deposition compartment, the second film deposition compartment, the supply compartment, the take-up compartment and the differential pressure compartment, wherein: the transport means is arranged such that the substrate is transported through the first film deposition compartment, the differential pressure compartment and the second film deposition compartment in that order. the transport means is arranged such that the substrate is transported through the first film deposition compartment, the differential pressure compartment and the second film deposition compartment in that order.