Method for positionally stable soldering of at least one component contact surface of an electronic component to at least one corresponding carrier plate contact surface of a carrier plate, the at least one electronic component having a lower and upper surface (6 and 4) and at least one side surface (5a, 5b, 5c, 5d) connecting the lower surface to the upper surface, the at least one component contact surface being formed on the lower surface and the at least one carrier plate contact surface having at least partially soldering material, namely soldering paste, which is deformable prior to its melting, so that the position of a component in electrical contact with the carrier plate contact surface can be changed without the electrical contact being interrupted, wherein the electronic component is an optoelectronic component which has a coupling surface on its upper surface, which coupling surface can be, for example, a sensor surface for receiving external signals or a light-emitting surface of an LED, the method comprising the following steps: a) attaching at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) to the carrier board, the position of each adhesive point (3a, 3b, 8a, 8b, 9a, 9b) being predetermined, the carrier board already having the solder material before step b), b) equipping the carrier plate with the at least one electronic component, the position of the adhesive points (3a, 3b, 8a, 8b, 9a, 9b) being predetermined in step a) in such a way that the at least one electronic component substantially covers the at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b), 9a, 9b) substantially in an edge region formed by the at least one side surface (5a, 5b, 5c, 5d) and the bottom surface 6, and the at least one component contact surface at least partially overlaps with the at least one carrier plate contact surface, c) waiting for the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) to cure for a predeterminable period of time t in order to prevent the electronic component from becoming blurred during the soldering process, d) heating the solder material to establish an electrical, mechanical and/or thermal connection between the at least one component contact surface and the at least one carrier plate contact surface. a) attaching at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) to the carrier board, the position of each adhesive point (3a, 3b, 8a, 8b, 9a, 9b) being predetermined, the carrier board already having the solder material before step b), b) equipping the carrier plate with the at least one electronic component, the position of the adhesive points (3a, 3b, 8a, 8b, 9a, 9b) being predetermined in step a) in such a way that the at least one electronic component substantially covers the at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b), 9a, 9b) substantially in an edge region formed by the at least one side surface (5a, 5b, 5c, 5d) and the bottom surface 6, and the at least one component contact surface at least partially overlaps with the at least one carrier plate contact surface, c) waiting for the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) to cure for a predeterminable period of time t in order to prevent the electronic component from becoming blurred during the soldering process, d) heating the solder material to establish an electrical, mechanical and/or thermal connection between the at least one component contact surface and the at least one carrier plate contact surface.