A reradiation repeater, comprising: a dielectric substrate; a ground conductor provided on a first surface of the dielectric substrate; and a plurality of unit cells (102, 202) provided on a second surface of the dielectric substrate, wherein the unit cells (102, 202) are configured to reradiate radio waves in a same direction by directing radio waves which are incident onto the unit cells (102, 202) at different angles to the same direction, and wherein each of the unit cells (102, 202) is assigned to one of a first cell group configured to reradiate a radio wave incident from a first incident angle direction to a first radiation angle direction and a second cell group configured to reradiate a radio wave incident from a second incident angle direction different from the first incident angle direction to the first radiation angle direction and includes a first conductive pattern (121, 221) and a second conductive pattern (123, 223) formed to surround the first conductive pattern (121, 221), wherein the second conductive pattern (123, 223) is spaced apart from the first conductive pattern (121, 221), wherein the first conductive pattern (121, 221) and the second conductive pattern (123, 223) are formed on the second surface of the dielectric substrate, wherein the first conductive pattern has a + shape, characterized in that: each of the unit cells (102, 202) includes at least one conductive protrusion projecting from a surface of the first conductive pattern and at least one conductive protrusion projecting from a surface of the second conductive pattern, wherein the at least one conductive protrusion of the first conductive pattern and the at least one conductive protrusion of the second conductive pattern project to the first surface of the dielectric substrate, wherein the at least one conductive protrusion of the first conductive pattern and the at least one conductive protrusion of the second conductive pattern are formed of a conductor filling a via hole in the dielectric substrate, wherein the at least one conductive protrusion of the first conductive pattern and the at least one conductive protrusion of the second conductive pattern are interconnected by a conductive patch in the dielectric substrate. a dielectric substrate; a ground conductor provided on a first surface of the dielectric substrate; and a plurality of unit cells (102, 202) provided on a second surface of the dielectric substrate, wherein the unit cells (102, 202) are configured to reradiate radio waves in a same direction by directing radio waves which are incident onto the unit cells (102, 202) at different angles to the same direction, and wherein each of the unit cells (102, 202) is assigned to one of a first cell group configured to reradiate a radio wave incident from a first incident angle direction to a first radiation angle direction and a second cell group configured to reradiate a radio wave incident from a second incident angle direction different from the first incident angle direction to the first radiation angle direction and includes a first conductive pattern (121, 221) and a second conductive pattern (123, 223) formed to surround the first conductive pattern (121, 221), wherein the second conductive pattern (123, 223) is spaced apart from the first conductive pattern (121, 221), wherein the first conductive pattern (121, 221) and the second conductive pattern (123, 223) are formed on the second surface of the dielectric substrate, wherein the first conductive pattern has a + shape, characterized in that: each of the unit cells (102, 202) includes at least one conductive protrusion projecting from a surface of the first conductive pattern and at least one conductive protrusion projecting from a surface of the second conductive pattern, wherein the at least one conductive protrusion of the first conductive pattern and the at least one conductive protrusion of the second conductive pattern project to the first surface of the dielectric substrate, wherein the at least one conductive protrusion of the first conductive pattern and the at least one conductive protrusion of the second conductive pattern are formed of a conductor filling a via hole in the dielectric substrate, wherein the at least one conductive protrusion of the first conductive pattern and the at least one conductive protrusion of the second conductive pattern are interconnected by a conductive patch in the dielectric substrate.