A curable composition for production of an optical component by molding using silicone molds, the curable composition comprising: curable compounds; and a cationic initiator, the curable compounds comprising a cycloaliphatic epoxy compound; an oxetane compound; and a glycidyl ether epoxy compound, the cycloaliphatic epoxy compound being a compound represented by Formula (a): wherein R 1 to R 18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group, wherein the linkage group is selected from divalent hydrocarbon groups, alkenylenes with part or all of carbon-carbon double bond(s) being epoxidized, carbonyl, ether bond, ester bond, amido, and groups each including two or more of these groups linked to each other, the cycloaliphatic epoxy compound being present in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition, wherein the cycloaliphatic epoxy compound, the oxetane compound, and the glycidyl ether epoxy compound are present in combination in a total content of 90 weight percent or more of the totality of all the curable compounds contained in the curable composition, wherein of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent are a curable compound or compounds having a molecular weight of 600 to 900, and wherein the curable composition has a viscosity of 100 to 400 mPa·s, as determined at 25°C and a shear rate of 20 s -1. curable compounds; and a cationic initiator, the curable compounds comprising a cycloaliphatic epoxy compound; an oxetane compound; and a glycidyl ether epoxy compound, the cycloaliphatic epoxy compound being a compound represented by Formula (a): wherein R 1 to R 18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group, wherein the linkage group is selected from divalent hydrocarbon groups, alkenylenes with part or all of carbon-carbon double bond(s) being epoxidized, carbonyl, ether bond, ester bond, amido, and groups each including two or more of these groups linked to each other, the cycloaliphatic epoxy compound being present in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition, a cycloaliphatic epoxy compound; an oxetane compound; and a glycidyl ether epoxy compound, wherein R 1 to R 18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group, wherein the linkage group is selected from divalent hydrocarbon groups, alkenylenes with part or all of carbon-carbon double bond(s) being epoxidized, carbonyl, ether bond, ester bond, amido, and groups each including two or more of these groups linked to each other, the cycloaliphatic epoxy compound being present in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition, wherein the cycloaliphatic epoxy compound, the oxetane compound, and the glycidyl ether epoxy compound are present in combination in a total content of 90 weight percent or more of the totality of all the curable compounds contained in the curable composition, wherein of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent are a curable compound or compounds having a molecular weight of 600 to 900, and wherein the curable composition has a viscosity of 100 to 400 mPa·s, as determined at 25°C and a shear rate of 20 s -1.