A ceramic-copper composite having a flat plate shape, comprising: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, wherein the following Expression is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S % is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of plane is within 10°, S % is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of plane is within 10°, S % is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of plane is within 10°, and S % is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of plane is within 10°, S 102 + S 101 > S 111 + S 112, wherein the orientation is measured according to the description; wherein S is 1% or more and 40% or less, S is 0.1% or more and 30% or less, S is 0.1% or more and 25% or less, and S is 0.1% or more and 25% or less, wherein the copper layer is formed of a rolled copper plate having a first surface facing the ceramic layer and a second surface opposite to the first surface, wherein the rolled copper plate has an Ag content of 5 ppm or more and 100 ppm or less, wherein the rolled copper plate has an Al content of 2.0 ppm or less, wherein the brazing material layer includes Ag, Cu and Ti, and either Sn or In, or both Sn and In, and wherein the brazing material layer includes 85 parts by mass or more and 93.1 parts by mass or less of Ag, 5.0 parts by mass or more and 13 parts by mass or less of Cu, 1.5 parts by mass or more and 5.0 parts by mass or less of Ti, and 0.40 parts by mass or more and 3.5 parts by mass or less of Sn and In in total. a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, wherein the following Expression is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S % is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of plane is within 10°, S % is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of plane is within 10°, S % is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of plane is within 10°, and S % is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of plane is within 10°, S 102 + S 101 > S 111 + S 112, wherein the orientation is measured according to the description; wherein S is 1% or more and 40% or less, S is 0.1% or more and 30% or less, S is 0.1% or more and 25% or less, and S is 0.1% or more and 25% or less, wherein the copper layer is formed of a rolled copper plate having a first surface facing the ceramic layer and a second surface opposite to the first surface, wherein the rolled copper plate has an Ag content of 5 ppm or more and 100 ppm or less, wherein the rolled copper plate has an Al content of 2.0 ppm or less, wherein the brazing material layer includes Ag, Cu and Ti, and either Sn or In, or both Sn and In, and wherein the brazing material layer includes 85 parts by mass or more and 93.1 parts by mass or less of Ag, 5.0 parts by mass or more and 13 parts by mass or less of Cu, 1.5 parts by mass or more and 5.0 parts by mass or less of Ti, and 0.40 parts by mass or more and 3.5 parts by mass or less of Sn and In in total.