A surface plasmon resonance fluorescence analysis device to which an analysis chip including a dielectric having a metal film on one surface of the dielectric is attached and in which the metal film is irradiated with excitation light through the dielectric to excite a fluorescent material for labelling a detection target substance on the metal film, and then fluorescence emitted from the fluorescent material is detected to thereby detect the presence or amount of the detection target substance, the surface plasmon resonance fluorescence analysis device comprising: a chip holder configured to detachably hold the analysis chip; a light source configured to emit excitation light; an angle adjusting section configured to adjust an incident angle of the excitation light with respect to the metal film to irradiate the metal film with the excitation light through the dielectric at a predetermined incident angle; a light sensor configured to detect light emitted from the vicinity of a surface of the metal film, the surface facing away from the dielectric; a light-reception optical system (141, 145) configured to guide the light emitted from the vicinity of the metal film to the light sensor; an excitation-light cut filter (144, 344) disposed in the light-reception optical system (141, 145) and including a fluorescent transmitting region that allows fluorescence emitted from the metal film to pass through the region but blocks at least light having a certain wavelength of the excitation light; a filter holder (143, 343) configured to hold the excitation-light cut filter (144, 344); a scattering-light transmitting section disposed at the excitation-light cut filter (144, 344) or the filter holder (143, 343) and configured to allow plasmon scattering light emitted from the metal film to pass through the section; and a transmission adjusting section (147, 247) configured to adjust whether to allow the plasmon scattering light to pass through via the scattering-light transmitting section, characterized in that the area of the scattering-light transmitting section in a plan view is smaller than the area of the fluorescent transmitting region of the excitation-light cut filter (144, 344) in a plan view, the scattering-light transmitting section is disposed within the fluorescent transmitting region or disposed at a position distant from the fluorescent transmitting region, wherein the distance from an end portion of the fluorescent transmitting region to the position is shorter than the diameter of the fluorescent transmitting region, such that when the transmission adjusting section (147, 247) allows the plasmon scattering light to pass through via the scattering-light transmitting section, a part of the fluorescent transmitting region is disposed on the light path in the light-reception optical system (141, 145). a chip holder configured to detachably hold the analysis chip; a light source configured to emit excitation light; an angle adjusting section configured to adjust an incident angle of the excitation light with respect to the metal film to irradiate the metal film with the excitation light through the dielectric at a predetermined incident angle; a light sensor configured to detect light emitted from the vicinity of a surface of the metal film, the surface facing away from the dielectric; a light-reception optical system (141, 145) configured to guide the light emitted from the vicinity of the metal film to the light sensor; an excitation-light cut filter (144, 344) disposed in the light-reception optical system (141, 145) and including a fluorescent transmitting region that allows fluorescence emitted from the metal film to pass through the region but blocks at least light having a certain wavelength of the excitation light; a filter holder (143, 343) configured to hold the excitation-light cut filter (144, 344); a scattering-light transmitting section disposed at the excitation-light cut filter (144, 344) or the filter holder (143, 343) and configured to allow plasmon scattering light emitted from the metal film to pass through the section; and a transmission adjusting section (147, 247) configured to adjust whether to allow the plasmon scattering light to pass through via the scattering-light transmitting section, characterized in that the area of the scattering-light transmitting section in a plan view is smaller than the area of the fluorescent transmitting region of the excitation-light cut filter (144, 344) in a plan view, the scattering-light transmitting section is disposed within the fluorescent transmitting region or disposed at a position distant from the fluorescent transmitting region, wherein the distance from an end portion of the fluorescent transmitting region to the position is shorter than the diameter of the fluorescent transmitting region, such that when the transmission adjusting section (147, 247) allows the plasmon scattering light to pass through via the scattering-light transmitting section, a part of the fluorescent transmitting region is disposed on the light path in the light-reception optical system (141, 145).