An inline substrate processing system for processing a plurality of substrates, comprising: a vacuum processing chamber (100, 400, 1300, 250); a first loadlock chamber (110, 410) coupled to a first side of the vacuum processing chamber (100, 400, 1300, 250); a first exchange station coupled to the first loadlock chamber (110, 410) opposite the vacuum processing chamber (100, 400, 1300, 250); a second loadlock chamber (115, 415) coupled to a second side of the vacuum processing chamber (100, 400, 1300, 250), opposite the first side; a second exchange station coupled to the second loadlock chamber (115, 415) opposite the vacuum processing chamber (100, 400, 1300, 250); a first exchange mechanism positioned in the first exchange station and operable to load fresh substrates into the first exchange station and remove processed substrates from the first exchange station; an upper hanger (416, 418, 905, 1305, 1740) comprising drive rails (505, 510) and a plate structured to support a plurality of substrates; a lower hanger (417, 419, 500, 800, 907, 1945, 2045, 2145) comprising drive rails (505, 510) and a plate structured to a plurality of substrates, and a transport mechanism structured to move the upper hanger (416, 418, 905, 1305, 1740) and the lower hanger (417, 419, 500, 800, 907, 1945, 2045, 2145) into and out of the vacuum processing chamber (100, 400, 1300, 250); a susceptor (408, 750, 860, 1320, 1420, 1520, 1820) positioned on a pedestal within the vacuum processing chamber (100, 400, 1300, 250), the pedestal comprising a heater; an exchanger structured to exchange a plurality of substrates between the upper hanger (416, 418, 905, 1305, 1740) and the susceptor (408, 750, 860, 1320, 1420, 1520, 1820) and between the lower hanger (417, 419, 500, 800, 907, 1945, 2045, 2145) and the susceptor (408, 750, 860, 1320, 1420, 1520, 1820), the exchanger comprising a plurality of lift pins, one lift pin for each substrate position, such that the plurality of lift pins are positioned for lifting each individual substrate of the plurality of substrates from the upper or lower hanger, and deposit the plurality of substrates onto the susceptor. a vacuum processing chamber (100, 400, 1300, 250); a first loadlock chamber (110, 410) coupled to a first side of the vacuum processing chamber (100, 400, 1300, 250); a first exchange station coupled to the first loadlock chamber (110, 410) opposite the vacuum processing chamber (100, 400, 1300, 250); a second loadlock chamber (115, 415) coupled to a second side of the vacuum processing chamber (100, 400, 1300, 250), opposite the first side; a second exchange station coupled to the second loadlock chamber (115, 415) opposite the vacuum processing chamber (100, 400, 1300, 250); a first exchange mechanism positioned in the first exchange station and operable to load fresh substrates into the first exchange station and remove processed substrates from the first exchange station; an upper hanger (416, 418, 905, 1305, 1740) comprising drive rails (505, 510) and a plate structured to support a plurality of substrates; a lower hanger (417, 419, 500, 800, 907, 1945, 2045, 2145) comprising drive rails (505, 510) and a plate structured to a plurality of substrates, and a transport mechanism structured to move the upper hanger (416, 418, 905, 1305, 1740) and the lower hanger (417, 419, 500, 800, 907, 1945, 2045, 2145) into and out of the vacuum processing chamber (100, 400, 1300, 250); a susceptor (408, 750, 860, 1320, 1420, 1520, 1820) positioned on a pedestal within the vacuum processing chamber (100, 400, 1300, 250), the pedestal comprising a heater; an exchanger structured to exchange a plurality of substrates between the upper hanger (416, 418, 905, 1305, 1740) and the susceptor (408, 750, 860, 1320, 1420, 1520, 1820) and between the lower hanger (417, 419, 500, 800, 907, 1945, 2045, 2145) and the susceptor (408, 750, 860, 1320, 1420, 1520, 1820), the exchanger comprising a plurality of lift pins, one lift pin for each substrate position, such that the plurality of lift pins are positioned for lifting each individual substrate of the plurality of substrates from the upper or lower hanger, and deposit the plurality of substrates onto the susceptor.