An electronic device comprising: a housing comprising a first surface directed in a first direction and a second surface directed in a second direction opposite the first direction; a printed circuit board included in the housing and comprising a first surface directed in the first direction and a second surface directed in the second direction and a side surface that is perpendicular to the first or second surface; at least one electronic component disposed on the first surface of the printed circuit board; and at least one shield structure (200, 300, 400, 500, 600, 900) configured to electro-magnetically shield the at least one electronic component, wherein the shield structure comprises: a flexible sheet (230, 330, 430, 530, 610, 930) comprising a first sheet (231, 331, 431, 531, 611, 931) that covers the at least one electronic component and a second sheet (232, 332, 432, 532, 612, 932) that at least partially covers the space between, on the one hand, the first sheet and the first surface of the printed circuit board and, on the other hand, the side surface of the printed circuit board; and at least one frame structure (210, 310, 410, 510, 630, 910) that supports the first and second sheets, wherein the first sheet (231, 331, 431, 531, 611, 931) and second sheet (232, 332, 432, 532, 612, 932) of the flexible sheet (230, 330, 430, 530, 610, 930) comprise: an adhesive layer that makes contact with at least a part of the at least one frame structure; an insulation layer at least partially spaced apart from the adhesive layer; and at least one metal layer disposed between the adhesive layer and the insulation layer. a housing comprising a first surface directed in a first direction and a second surface directed in a second direction opposite the first direction; a printed circuit board included in the housing and comprising a first surface directed in the first direction and a second surface directed in the second direction and a side surface that is perpendicular to the first or second surface; at least one electronic component disposed on the first surface of the printed circuit board; and at least one shield structure (200, 300, 400, 500, 600, 900) configured to electro-magnetically shield the at least one electronic component, wherein the shield structure comprises: a flexible sheet (230, 330, 430, 530, 610, 930) comprising a first sheet (231, 331, 431, 531, 611, 931) that covers the at least one electronic component and a second sheet (232, 332, 432, 532, 612, 932) that at least partially covers the space between, on the one hand, the first sheet and the first surface of the printed circuit board and, on the other hand, the side surface of the printed circuit board; and at least one frame structure (210, 310, 410, 510, 630, 910) that supports the first and second sheets, wherein the first sheet (231, 331, 431, 531, 611, 931) and second sheet (232, 332, 432, 532, 612, 932) of the flexible sheet (230, 330, 430, 530, 610, 930) comprise: an adhesive layer that makes contact with at least a part of the at least one frame structure; an insulation layer at least partially spaced apart from the adhesive layer; and at least one metal layer disposed between the adhesive layer and the insulation layer. an adhesive layer that makes contact with at least a part of the at least one frame structure; an insulation layer at least partially spaced apart from the adhesive layer; and at least one metal layer disposed between the adhesive layer and the insulation layer.