A probe head for testing a device under test integrated on a semiconductor wafer, comprising: - a plurality of contact probes, each provided with a first end and a second end, said first end being adapted to contact pads of the device under test; - at least one first lower guide and one second lower guide which are closer to the first end than the second end of the probes, said guides (22, 23) being parallel to each other and provided with a respective plurality of first and second guide holes (22h, 23h) for slidingly housing said contact probes, wherein said second guide holes of said second lower guide are shifted with respect to said first guide holes of said first lower guide along a first direction; and - at least one third lower guide, which is substantially parallel to said first lower guide and to said second lower guide and is provided with a plurality of third guide holes for slidingly housing said contact probes, wherein said second lower guide is arranged between said first lower guide and said third lower guide, and wherein the third guide holes of said third lower guide are shifted with respect to the second guide holes of said second lower guide along a second direction opposite said first direction, and wherein each contact probe comprises a body extending along a longitudinal axis (H-H) between the first end and the second end, characterized in that the first end of all the contact probes is shifted with respect to the second end according to a specific direction, said shift being measured with reference to the longitudinal axis (H-H) of the contact probes and determining the direction (Dscrub) of the scrub movement of said first end, wherein the shift of said third guide holes is such that a first wall of the contact probes is adapted to contact a corresponding first wall of the third guide holes of the third lower guide, which is configured to counteract a transversal force exerted by said probes and to exert an opposite reaction force, resulting in a null scrub movement of said first ends of each contact probe of said probe head. - a plurality of contact probes, each provided with a first end and a second end, said first end being adapted to contact pads of the device under test; - at least one first lower guide and one second lower guide which are closer to the first end than the second end of the probes, said guides (22, 23) being parallel to each other and provided with a respective plurality of first and second guide holes (22h, 23h) for slidingly housing said contact probes, wherein said second guide holes of said second lower guide are shifted with respect to said first guide holes of said first lower guide along a first direction; and - at least one third lower guide, which is substantially parallel to said first lower guide and to said second lower guide and is provided with a plurality of third guide holes for slidingly housing said contact probes, wherein said second lower guide is arranged between said first lower guide and said third lower guide, and wherein the third guide holes of said third lower guide are shifted with respect to the second guide holes of said second lower guide along a second direction opposite said first direction, and wherein each contact probe comprises a body extending along a longitudinal axis (H-H) between the first end and the second end, characterized in that the first end of all the contact probes is shifted with respect to the second end according to a specific direction, said shift being measured with reference to the longitudinal axis (H-H) of the contact probes and determining the direction (Dscrub) of the scrub movement of said first end, wherein the shift of said third guide holes is such that a first wall of the contact probes is adapted to contact a corresponding first wall of the third guide holes of the third lower guide, which is configured to counteract a transversal force exerted by said probes and to exert an opposite reaction force, resulting in a null scrub movement of said first ends of each contact probe of said probe head.