A film-like wafer mold material for wafer molding, comprising: a multilayer structure constituted of at least a first film layer and a second film layer provided on the first film layer, wherein the first film layer contains a silicone-backbone-containing polymer, a cross-linking agent, and a filler, and wherein the first film layer has a higher filler filling ratio than that of the second film layer, the second film layer contains a silicone-backbone-containing polymer and a cross-linking agent, and further contains a filler in such a manner that a content rate of the filler becomes above 0 and less than 100 when a content rate of the filler contained in the first film layer is assumed to be 100, the silicone-backbone-containing polymer has a repeating unit represented by the following general formula and has a weight average molecular weight of 3,000 to 500,000, wherein R 1 to R 4 may be the same or different and represent univalent hydrocarbon groups having carbon numbers from 1 to 8; m represents an integer number from 1 to 100; each of a, b, c, and d represents 0 or a positive number, and satisfies a+b+c+d=1, provided that b=1 and a, c, and d are 0, or 0.3≤a≤0.7, 0.2≤b≤0.5, 0<c≤0.2, and 0<d≤0.2; further, each of X and Y represents a bivalent organic group represented by the following general formula or the following general formula, wherein Z represents a bivalent organic group selected from the following chemical structures; and n represents 0 or 1; each of R 5 or R 6 represents an alkyl group or an alkoxy group having a carbon number from 1 to 4, and may be the same or different; k represents any one of 0, 1, and 2, wherein V represents a bivalent organic group selected from the following chemical structures; and p represents 0 or 1; each of R 7 and R 8 represents an alkyl group or an alkoxy group having a carbon number from 1 to 4, and may be the same or different; h represents any one of 0, 1, and 2. a multilayer structure constituted of at least a first film layer and a second film layer provided on the first film layer, wherein the first film layer contains a silicone-backbone-containing polymer, a cross-linking agent, and a filler, and wherein the first film layer has a higher filler filling ratio than that of the second film layer, the second film layer contains a silicone-backbone-containing polymer and a cross-linking agent, and further contains a filler in such a manner that a content rate of the filler becomes above 0 and less than 100 when a content rate of the filler contained in the first film layer is assumed to be 100, the silicone-backbone-containing polymer has a repeating unit represented by the following general formula and has a weight average molecular weight of 3,000 to 500,000, wherein R 1 to R 4 may be the same or different and represent univalent hydrocarbon groups having carbon numbers from 1 to 8; m represents an integer number from 1 to 100; each of a, b, c, and d represents 0 or a positive number, and satisfies a+b+c+d=1, provided that b=1 and a, c, and d are 0, or 0.3≤a≤0.7, 0.2≤b≤0.5, 0<c≤0.2, and 0<d≤0.2; further, each of X and Y represents a bivalent organic group represented by the following general formula or the following general formula, wherein Z represents a bivalent organic group selected from the following chemical structures; and n represents 0 or 1; each of R 5 or R 6 represents an alkyl group or an alkoxy group having a carbon number from 1 to 4, and may be the same or different; k represents any one of 0, 1, and 2, wherein V represents a bivalent organic group selected from the following chemical structures; and p represents 0 or 1; each of R 7 and R 8 represents an alkyl group or an alkoxy group having a carbon number from 1 to 4, and may be the same or different; h represents any one of 0, 1, and 2.