Method for inspection of a wafer, the wafer having a crack formed therein and comprising a first surface extending substantially parallel to a plane and a second surface substantially outwardly opposed by the first surface, the method comprising the steps of: directing infrared light substantially along a first axis towards the second surface of the wafer to pass through the wafer and thereby provide light emanating along the first axis from the first surface of the wafer and directing infrared light substantially along a second axis towards the second surface of the wafer to pass through the wafer and thereby provide light emanating along the second axis from the first surface of the wafer, receiving the light emanating from the first surface of the wafer substantially along the first axis for obtaining a first image of the first surface therefrom, the first image containing at least one first portion of the crack, and receiving the light emanating from the first surface of the wafer substantially along the second axis for obtaining a second image of the first surface therefrom, the second image containing at least one second portion of the crack, wherein the orthographic projection of the first axis on the plane is substantially perpendicular to the orthographic projection of the second axis on the plane; conveying the wafer along the orthographic projection of each of the first axis and the second axis on the plane so that the first portion or portions of the crack in the first image are those in the direction along the orthographic projection of the first axis and the second portion or portions of the crack in the second image are those in the direction along the orthographic projection of the second axis and constructing a third image, which contains both the first and second portions of the crack, from the first and second images, wherein the third image is substantially processible for inspecting the crack in the wafer. directing infrared light substantially along a first axis towards the second surface of the wafer to pass through the wafer and thereby provide light emanating along the first axis from the first surface of the wafer and directing infrared light substantially along a second axis towards the second surface of the wafer to pass through the wafer and thereby provide light emanating along the second axis from the first surface of the wafer, receiving the light emanating from the first surface of the wafer substantially along the first axis for obtaining a first image of the first surface therefrom, the first image containing at least one first portion of the crack, and receiving the light emanating from the first surface of the wafer substantially along the second axis for obtaining a second image of the first surface therefrom, the second image containing at least one second portion of the crack, wherein the orthographic projection of the first axis on the plane is substantially perpendicular to the orthographic projection of the second axis on the plane; conveying the wafer along the orthographic projection of each of the first axis and the second axis on the plane so that the first portion or portions of the crack in the first image are those in the direction along the orthographic projection of the first axis and the second portion or portions of the crack in the second image are those in the direction along the orthographic projection of the second axis and constructing a third image, which contains both the first and second portions of the crack, from the first and second images, wherein the third image is substantially processible for inspecting the crack in the wafer.