A metallic material for electronic components, the material comprising: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more metals selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu in the total amount of these of 50 mass% or more, and optionally further including one or two or more metals selected from the group consisting of B, P, Sn and Zn; an intermediate layer formed on the lower layer, the intermediate layer including an alloy constituted with one or two or more metals selected from a constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, wherein the content of the metals of the constituent element group B is 50% by mass or more in terms of the total content of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and optionally the rest alloy component is composed of one or two or more selected from the group consisting of Bi, Cd, Co, Cu, Fe, In, Mn, Mo, Ni, Pb, Sb, Se, Sn, W, Tl and Zn, and one or two metals selected from a constituent element group C, namely, the group consisting of Sn and In, in a content of 10 to 50 at%, wherein the content of the metals of the constituent element group C is 50% by mass or more in terms of the total content of Sn and In, and optionally the rest alloy component is composed of one or two or more selected from the group consisting of Ag, As, Au, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Sb, W and Zn; and an upper layer formed on the intermediate layer, the upper layer being constituted with one or two metals selected from a constituent element group C, namely, the group consisting of Sn and In, wherein the content of the metals of the constituent element group C is 50% by mass or more in terms of the total content of Sn and In, and optionally the rest alloy component is composed of one or two or more selected from the group consisting of Ag, As, Au, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Sb, W and Zn, wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.02 μm or more and less than 0.80 μm; and the thickness of the upper layer is 0.005 μm or more and less than 0.30 μm. a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more metals selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu in the total amount of these of 50 mass% or more, and optionally further including one or two or more metals selected from the group consisting of B, P, Sn and Zn; an intermediate layer formed on the lower layer, the intermediate layer including an alloy constituted with one or two or more metals selected from a constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, wherein the content of the metals of the constituent element group B is 50% by mass or more in terms of the total content of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and optionally the rest alloy component is composed of one or two or more selected from the group consisting of Bi, Cd, Co, Cu, Fe, In, Mn, Mo, Ni, Pb, Sb, Se, Sn, W, Tl and Zn, and one or two metals selected from a constituent element group C, namely, the group consisting of Sn and In, in a content of 10 to 50 at%, wherein the content of the metals of the constituent element group C is 50% by mass or more in terms of the total content of Sn and In, and optionally the rest alloy component is composed of one or two or more selected from the group consisting of Ag, As, Au, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Sb, W and Zn; and an upper layer formed on the intermediate layer, the upper layer being constituted with one or two metals selected from a constituent element group C, namely, the group consisting of Sn and In, wherein the content of the metals of the constituent element group C is 50% by mass or more in terms of the total content of Sn and In, and optionally the rest alloy component is composed of one or two or more selected from the group consisting of Ag, As, Au, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Sb, W and Zn, wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.02 μm or more and less than 0.80 μm; and the thickness of the upper layer is 0.005 μm or more and less than 0.30 μm.