IMPROVEMENTS IN COM- BINING SHEETS OF COPPER OR ITS ALLOYS WITH LEAD, TIN, ZINC, NICKLE, GOLD, SILVER, PLATINUM, OR ALLOYS CONTAINING THESE METALS, OR SOME OF THEM, WITH OB WITHOUT THE ADDITION OF COPPER, ANTIMONY, BISMUTH, ARSENIC, MANGANESE, OR MERCURY
Year: 1855

page_text: COMPLETE SPECIFICATION filed by Arthur Warner at the Office of
the Commissioners of Patents, with his Petition and Declaration, on
the 12th May 1855, pursuant to the 9th Section of the Patent Law.
Amendment Act, 1852.
TO ALL TO WHOM THESE PRESENTS SHALL COME, I, ARTHUR
WARNER, of 11, New Broad Street, in the City of London, send greeting.
WHEREAS I am in possession of an Invention for "IMPROVEMENTS IN COM-
BINING SHEETS OF COPPER OR ITS ALLOYS WITH LEAD, TIN, ZINC, NICKLE, GOLD,
SILVER, PLATINUM, OR ALLOYS CONTAINING THESE METALS, OR SOME OF THEM, WITH
OB WITHOUT THE ADDITION OF COPPER, ANTIMONY, BISMUTH, ARSENIC, MANGANESE,
OR MERCURY," and have petitioned Her Majesty to grant unto me, my exc-
cutors, administrators, and assigns, Her Royal Letters Patent for the same,
and have made solemn declaration that I verily believe myself to be the first
and true Inventor thereof:
NOW KNOW YE, that I, the said Arthur Warner, do hereby declare that
the following Complete Specification, under my hand and seal, fully describes
and ascertains the nature of my said Invention, and the manner in which

page_text: the same is to be performed, in and by the following statement, that is
to say :-
This Invention consists of combining sheets of copper or its alloys with
sheets of the other metals mentioned, and this I do, by preference, by flushing
or coating one surface of a sheet of copper or its alloys with suitable solder,
and then causing such surfaco to adhero to a sheet of one or other of the
other metals mentioned, by heat applied through the sheet of copper or its
alloys with suitable solder, and then causing such surface to adhere to a sheet
of one or other of the other metals mentioned, by heat applied through the
sheet of copper or its alloys, aided by pressure, to keep the two surfaces in
contact when the melting of the solder and the cooling of it between the
surfaces are taking place. When the sheets of metal are bard enough, they
may have one of their surfaces coated with solder, as well as or in place of the
copper, and heat to melt the solder may be applied externally to such hard
sheets, as well as or in place of to the external surfaces of the sheets of copper
or its alloys.
Having thus stated the nature of my said Invention, I will proceed to
describe the manner of performing the same.
In combining sheets of copper or alloys of copper with sheets of lead or
alloys of lead, I cause the sheets of copper or alloys of copper to be flushed
over or coated with solder on ono side. This soldered surfaco and the surfaco
of the sheet of lead are to bo moistened with the ordinary solution used when
soldering, and the two sheets are to be pressed closely together in all parts by
a screw or other suitable press, and the sheet of copper or of alloyed copper
is to be heated so as to melt the solder; and this may be conveniently done
by means of an iron metal table, capable of having introduced under it a
metal heater, somewhat larger than the sheets of metal to be soldered together.
This heater is to be heated in an oven or furnace to a temperature suitable
for melting the solder through the table and through the sheets of copper or
alloys of copper, and when the solder is found to run at the edges, the pressure
on the surface of the sheets is to be increased, the heater is to be withdrawn,
and the whole allowed to cool, retaining the pressure till the solder is set.
It is preferred that the sheet of copper or alloy of copper should be first
coated with tin before applying the solder, and in place of flushing the surface
with solder, a thin sheet of solder may be used between the two sheets which
are to be soldered together. In combining sheets of copper or of alloys of
copper with sheets of tin, I cause the tin to be slightly alloyed, as is well
understood, to harden it and increase its fusing point, and I combine a sheet

page_text: of tin and a sheet of copper or alloy of copper in the same manner as above
described in respect to sheets of lead or its alloys.
In combining sheets of copper or alloys of copper with sheets of zinc or of
alloyed zinc, I cause the sheet of copper or alloy of copper to be flushed or
coated with solder as above described, preferring first to apply a coat of tin
or lead, or an alloy of these metals, to the surface of the copper or alloy of
copper before flushing it with solder; or I employ a sheet of solder, and having
moistened the surface of the solder and the surface of the zinc or alloyed' zino
(which is to be clean) with the ordinary solution used when soldering, I
cause the two sheets of metal to be pressed together, as above described, and
soldered together, by melting the solder which is between them, as before
explained. I would here remark that in the Specification of a former Patent
I described the soldering of the sheets of zinc which has been previously
tinned or coated with lead to sheets of copper and alloys of copper; this part
of my Invention, therefore, consists of soldering sheets of zinc or of alloyed
zinc, which have not been first coated with tin or with lead, on to sheets of
copper or of alloyed copper.
In combining sheets of copper or of alloyed copper with alloys of nickle,
I employ any of those alloys of nickle which will roll into sheets, and I proceed
in like manner by preparing the sheets of copper by coating or flushing them
with solder, preparing first to coat the surface with tin, and I moisten the
surfaces which are to be soldered together with the ordinary solution used
when soldering. The sheets are then pressed together and subjected to heat
through the sheets of copper or alloys of copper, as before explained, and the
soldering is to be completed as before described. When combining sheets
of copper or alloys of copper with gold, silver, or platinum, I first prepare
the surface of each of the sheets of copper or alloys of copper by coating
or flushing it with solder, and I moisten the surfaces which are to be
soldered together, and subject the sheets to pressure and heat, and allow
them to cool, as before explained. I would state that in each case the solder
I prefer to use is one which will melt slightly below the melting point of the
most readily melting metal of which the two sheets which are to be soldered
together consists. I would also state, that in alloying the above metals I
sometimes use copper, bismuth, antimony, arsenic, manganese, or mercury in
the same manner as they have heretofore been employed for alloying the
above metals, and to which, separately, I make no claim.
Having thus described the nature of my Invention, and the manner of
performing the same, I would have it understood that what I claim is, the

page_text: combining of sheets of copper or alloys of copper with sheets of the metals
and alloys of metals above mentioned by soldering, as herein described.
In witness whereof, I, the said Arthur Warner, have hereunto set my
hand and seal, this Twelfth day of May, in the year of our Lord
One thousand eight hundred and fifty-five.
ARTHUR WARNER. (L.B.)