IMPROVEMENTS IN SOLDERING-APPARATUS
Year: 1883

page_text: ETTERS PATENT to Henry Harris Lake, of the firm of Haseltine, Lake,
and Co Patent Agents, Southampton Buildings, London for an Invention of
"IMPROVEMENTS IN SOLDERING-APPARATUS." A communication to him from
abroad by John Joseph Johnston, of Boston, Massachusetts, United States of
America
COMPLETE SPECIFICATION filed by the said Henry Harris Lake at the
Office of the Commissioners of Patents on the 19th March 1883.
"
HENRY HARRIS LAKE, of the firm of Haseltine, Lake, & Co, Patent Agents,
Southampton Buildings, London "IMPROVEMENTS IN SOLDERING-APPARATUS
Communicated to me from abroad by John Joseph Johnston of Boston,
Massachusetts, United States of America.
This Invention relates to soldering apparatus and consists partly in arranging
a solder pot upon a furnace, and providing it with a post or spindle rising from its
bottom and a float adapted to be guided upon the said post or spindle as it rises
and falls with the molten solder in the solder pot. The said Invention also partly
consists in certain details of construction hereinafter described.
In the accompanying Drawing.
- Figure 1 is a perspective view of soldering apparatus constructed according to
this Invention.
Figure 2 is a central vertical section through the furnace, the solder pot or
holder, and the float, showing the action of the said float, and the position of the
can upon it during the operation of soldering
Figure 3 is a detail plan and side view of the float.
A represents. an ordinary solder furnace with its cover removed. Over this
furnace is placed a solder pot or vessel B so that the heat of the fire in the furnace
will melt the solder in the said pot and keep it fluid. The solder pot B is provided
with a central depression or chamber a from the centre of which rises a short post
or spindle C, upon which slides a socket or tubular projection b on the underside of
a float or receptacle D which is guided by the said post or spindle as it rises and
falls with the molten solder in the pot B; one or more suitable apertures 5
extending horizontally from the exterior of the projection b to the interior thereof,
are provided for the escape of any solder that may pass up between the post and
the interior of the projection b. The float D is made of cast iron or other metal
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page_text: that will float on the top of molten solder, and is provided with an annular
downwardly curved flange c, thence preferably extended into a horizontal rim d,
while it is provided upon its inside near the top with an annular depression or
groove i, for the vessel G to be soldered, to rest in, and below this with a con-
cavity e for the reception of any solder which may flow down between the inner
edge of the groove i and the bottom of the vessel G being soldered. --
In preparing the pot for operation, it is first provided with a sufficient quantity
of molten metal or solder. The float D is then placed upon the top of the metal
in such a manner that the end of the post or spindle C will pass up into the socket
or tubular projection b as shown in Figure 2. The float D will cause the displace-
ment of a certain amount of the molten solder, when the latter will rise around the
rim of the float.
The head having been fitted on the can or vessel G to be soldered, and the
necessary acid or flux applied, the said head is placed so that its edge will rest in
the annular depression or groove i at the top of the float D. The float with the
superposed vessel is then depressed until the inolten metal or solder rises around it
and covers the seam or lap of the cover or end piece of the can or vessel, thus
applying the solder which will adhere and, solder the joint, when the can is
reinoved:
The concavity e provides for holding in an isolated position with relation to the
bottom of the can or vessel, any solder that may possibly get into the float D, this
solder being easily removed or scraped out of the concavity e into the solder pot B
by means of a scraper or other suitable 'implement,, whereby any appreciable
amount of solder is prevented from remaining in the float.
For large cans or vessels where a large float is required, a foot treadle may be
employed for depressing the float, and if desired, springs may be applied to raise it
again, but generally its buoyancy will be sufficient.
By the employment of the above described apparatus, tin-cans, or vessels can be.
soldered with great speed and facility.
Having thus fully described the said invention as communicated to me by my
foreign correspondent, and the manner of performing the same, I wish it understood
that I claim.
First In a soldering apparatus, the combination with the furnace A, the solder
pot B, and the post or spindle C, of the float D adapted to slide on the said post or
spindle, substantially as, and for the purpose, specified.
Second In a soldering apparatus, the combination with the furnace A, the solder
pot B, and the post or spindle C, of the float D provided with a concavity e, having
at its upper edge an annular groove or depression i for the reception of the edge of
the can or vessel to be soldered, substantially as described.
Third. In a soldering apparatus, the combination with the furnace A, and the'
solder pot Bhaving central chamber, a, and a post or spindle C rising therefrom,
of the float D, provided with a concavity e and an annular groove or depression i,
and having on its underside a socket or tubular projection b adapted to fit over,
and slide upon, the said post or spindle substantially as, and for the purpose, set.
forth.
In witness whereof I the said Henry Harris Lake have hereunto set my
hand and seal this nineteenth day of March in the year of our Lord
one thousand eight hundred and eighty three.