Add new io tex files
Merge pull request #1 from dmpro2014/IOstart

Add new io tex files
Ignore swp files
Switch to report doc class

Use chapters instead of sections
Merge pull request #6 from dmpro2014/chapterize-report

Switch to report doc class
Setup report structure
Merge pull request #7 from dmpro2014/major-structure

Setup report structure
Correct efm naming
Restructure subsections and make bare Solder file

Split Process into PCB design and Soldering
as they are divided between design
and physical implementation respectively
Begin making solder & power test plan
Start making 3.3V line test
Add the 1.2V and 3.3V no the table.

Add the 1.2V and 3.3V steps for the table.
Add row for BGA components and electrical circuit

Add teh next steps of the solderingplan, may be better to have them on a
different table, but placed them there for the moment.
Add the solder stage for major components.
Add expected result after soldering BGA components

Added the expected results after the soldering of the BGA components(FPGA
and EFM32). Might need to discuss if the table is both the solder plan and
the test plan.
Clean up and finalize solderplan draft.