SENSOR_BOARD：调整制冷槽位置


从右边移动到左边

Signed-off-by: fanhx <fanfhx@163.com>
SENSOR_BOARD:重新分割地层


Signed-off-by: fanhx <fanfhx@163.com>
SENSOR_BOARD:四个固定孔周围的覆铜挖空

掏空的覆铜面积12mm*12mm

Signed-off-by: fanhx <fanfhx@163.com>
SNESOR_BOARD:修改DRC错误

ADA部分线条过粗，更换过孔，0305过孔全部换成0507的，过孔统一，美观，删除孤岛，
固定孔周围覆铜挖空

Signed-off-by: fanhx <fanfhx@163.com>
SENSOR_BOARD:钻孔，光绘完成

Signed-off-by: fanhx <fanfhx@163.com>
FPGA_BOARD:将覆铜和通网络pins的连接线宽改为0.3mm

原来的0.1mm工艺无法生产

Signed-off-by: fanhx <fanfhx@163.com>
FPGA_BOARD:调整Jtag接口位置，调节RS485接口位置

重新连线，挖空固定孔周围12mm*12mm，删除孤岛，数据库检查，更新DRC

Signed-off-by: fanhx <fanfhx@163.com>
FPGA_BOARD:钻孔，光绘完成

Signed-off-by: fanhx <fanfhx@163.com>