Added TI ISO1050 CAN Xceiver
Aaron's BS changes for component standards
Merge pull request #12 from aeozyalcin/TI_ISO1050

Ti iso1050
Moved Molex_Aaron.lbr to Molex.lbr and add Micro-Clasp 26-pin connector to Molex.lbr
Merge pull request #13 from aaronbeekay/Molex_MicroClasp_26

Moved Molex_Aaron.lbr to Molex.lbr and add Micro-Clasp 26-pin connector ...
Added DR331-513AE Common Mode Choke
Added SMBJ30CA TVS Bidir Zener Diode
Added TI LP38693MP-3.3/NOPBCT-ND 3.3V Fixed output LDO to TI lib
Created Zener Diode DO-41 in Diodes.lbr
Merge pull request #14 from kimconcillado/master

Created Zener Diode DO-41 in Diodes.lbr
Merge pull request #15 from aeozyalcin/TI_ISO1050

Add Magic CAN Node 3V3 ckt and CAN ckt components
Add Visio templates and stencil library for drawings
Merge pull request #18 from aaronbeekay/master

Add Visio templates and stencil library for drawings
Change schematic symbol to match datasheet symbol. Change PARTNO attribute to match manufacturer part number. (closes #16). Remove "NC" pin.
Make text smaller in SOT-223-5.pac (TI.lbr). Move LP38693MP-3.3.dev to LP38693.dev, and add the "MP" package and "-3.3" technology.
Merge pull request #19 from aaronbeekay/TI_LP38693MP-3.3

Fixes to LP38693 device
create TLV2764.dev with TSSOP-14 package
add TLV2764 to partsdb.txt
Merge pull request #20 from aaronbeekay/TI_TLV2760

Add TLV2764 to TI.lbr
Change SMBJ30CA in Diodes.lbr: reduce component symbol size, add component prefix, other symbol layout adjustments