OMAP4460PLUS Thermal: Thermal framework support

The patch adds kernel thermal framework and on die
CPU governer support.

Change-Id: I9490a545e3c3b3c395bfa044001a0b6741170893
Signed-off-by: Dan Murphy <dmurphy@ti.com>
Signed-off-by: Moiz Sonasath <m-sonasath@ti.com>
Signed-off-by: J Keerthy <j-keerthy@ti.com>
Signed-off-by: Margarita Olaya <magi.olaya@ti.com>

Conflicts:
	drivers/staging/Makefile
TI thermal framework: Remove unused index

This patch removes index information as it is never used.

Change-Id: I621036f68ecef9ea4ec2a8dbd1edc1d53df2f817
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Radhesh Fadnis <radhesh.fadnis@ti.com>
 TI thermal framework: standardize thermal device ops

This patch changes the .process_temp callback of governor
type of thermal devices. The aim is to make all callbacks
standard. Now, all callbacks receive as first parameter
the affected thermal device.

Change-Id: If1765c36e401a9327103be0a5fb36c3dabf7c665
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Radhesh Fadnis <radhesh.fadnis@ti.com>