6-Layer attempt to shrink board, have parts mostly placed in this commit.
Doing the signal routing from top of board down, it looks like this approach will work but may take a while to finish.
Finished half of the routing from one edge to the other
Finished routing 6-layer version of Test Beam Amp. PCB, looks ok, still need to check everything though.
Changed the size of the board to match the pade board, starting on re-routing everything...again.
Finished layout with change in size to match PADE board and power connector moved to middle
Made all of the component values visible, cleaned up some traces
Added COMM_N2
Separated out traces to attempt to reduce crosstalk
Version sent for manufacturing