Board Version 2.6.0

1. Used a (much!) smaller SOD-523 mounting pad footprint for Diodes D1,
D2, and D3 to fix lots of reflow problems.

2. Added a 5mm part keep-out around connectors MOTOR and BAT to allow
room for selective soldering nozzle.

3. Moved parts D3 and Q1 to get them out of the new keep-outs around
connector MOTOR added above.  In the process...

a) We lost resistor R5 to make room. This resistor was optional and will
not be missed.
b) I had to move test point MISO to make room. This means we will need
new programming jigs, which I will make sure Walter gets before he needs
them.

4. Moved diodes D2 and D4 to get them out of the new keep out around
connector BAT added above.

5. Added dots on the top silk layer to show which end is the cathode for
the RED and WHITE LEDs.

6. Beefed up the traces between U1 and C1 a bit to further reduce
resistance to the decoupling cap.

7. Added a new trace between the THERM pin the battery charging chip
MCP1 to the SCK pin on the MCU U1 to allow the MCU to do some extra
battery charger tests under software control. Note that I had to drop
the trace width down to 0.006” to get it to fit.

8. Added a top silk circle around the upper-left mounting hole boss
keepout to make sure I didn't accidentally intrude on it while moving
stuff around.