updates octave scripts: trigger initial Corblivar run only when no solution file is found, (re)introduced TSV density as command line parameter
updates class FloorPlanner: delete solution file in case no valid solution was generated
udate octave script: cleanup and minor fixes optimization.m
updates octave scripts: drop validity check for phase 2, so that any solution can be found
for layouts w/ large temperature gradients; further minor updates parameters and cleanups
update class IO: dropped IO modes (regular, thermal-analyser run); two bin compilation
deprecated, now handled within Corblivar bin; related updates
minor edits Makefile
minor update classes IO, Math: moved SCALE_UM_M to Math; related updates
update IO::writeFloorplanGP, add plotting of TSV groups into floorplan
minor fix ThermalAnalyzer::adaptPowerMaps, use of local copies of TSVs groups
cleanup/restructuring class FloorPlanner: put several related variables into sets of structs; related updates
minor update README; pointed out standard folder for HotSpot
added exp/run*.sh scripts; batch-mode template scripts
added technology file, to distinguish config and technology values; related updates
dropped deprecated class Chip, technology parameters are now found in Technology.conf;
related updates
minor update IO::parseParametersFiles, fix help on optional command-line parameter
fix IO::parseParametersFiles, consider relative paths for technology file
update/fix octave scripts; parsing of layer count from new Technology.conf
update IO::parseBlocks, drop up-scaling of power-density values
minor fix FloorPlanner::evaluateLayout, fix calculation of final cost for scenarios where
not all parameters are optimized
fix IO::writeHotSpotFiles, scaled dies' layer dimensions to m as required by HotSpot