remove solder thieving, shrink through pads to

improve wave, new stackup, fix some trace angles, improve stepper
layout, silk screen fixes,
move analog ext, layout changes, change vias

around mosfets, silk screen fixes, change stack up,
Change SMPS IC to LM22675, SMPS passives changed

accordingly. Shorting SMPS jumper disables SMPS. Change reverse voltage
diodes on low current rails.
change SMPS to prefer 5V version of IC
rerouting split planes and adjusting isolation
move 1 via in HB heatsink
straighten traces, add tplace to some components

more polygon fixes
Add Jordan's e2p adapter, reorganize folders
remove leftover trace, increase PTH cap pad size
fix thermal on bulk caps, minor reroute
reroute n$15, remove mask between 2560 pads

change stack up to match fab capabilities
Clean up 1.2c Schematic
shrink vias around motor drivers for wave proc
update connector image for 1.2
merge 1.2