Improved pin 1 silkscreen markings on several small packages. Updated PCB with modified footprints.
Moved R6 to not interfere with DDR2 socket. Had to replace a ground via.
Remove "do not manufacture" comments on PCB.
Regenerated netlist.
Resaved component mapping file (.cmp).
Changed mounting holes from plated to non-plated (since the drill and pad sizes were already equal).
Added zone to improve grounding to HSMC ground plane.
Filled PCB zones.
Generated Gerber and drill files.
Added README details about the two drill files.