DDK v2.0 related checkin #3

+ Updates in the final board layout before fabrication, as per the inputs from the fabricator
	> All vias' (pad) increased - at least 0.045" as in DDK v1.*
		. Triggered a complete recheck & via-track distance fixes in the board
	> Corrected 3mm LED's pad & drill sizes to same as for the normal 5mm LED (it was too small)
		. Got changes generated through module editor but then manually edited in leds module and ddk.brd
	> Increased the clock crystal's pads size a bit (it was too small & would still remain small)
		. Got changes generated through module editor but then manually edited in crystals module and ddk.brd
	> All headers' drill size to be 1mm
		. Got changes generated through module editor but then manually edited in headers module and ddk.brd
+ Consequently, re-plotted the same in .ps format & then converted to .pdf format (using ps2pdf)
	> Front, Back, Mask_Front, Mask_Back, SilkS_Front, SilkS_Back
	> Alongwith generated the drill files as well - also in .drl format
+ And, also got the BOM (in .csv) generated using pcbnew
+ Regenerated the .cmp file for the updates of modules added through pcbnew (esp the logos)
+ Updated the README with all the file name additions/modifications & description changes
+ Renamed ddk_soldering.lst to ddk.bom - yet to be updated w/ the (soldering perspective) BOM of DDK v2.0