Title: Laser diode chip and packaging technology :
Authors: Chen, P. C.; Milster, Tom D.; Society of Photo-optical Instrumentation Engineers.
Date: 1996
Publisher: SPIE,
Physical description: vii, 258 pages : illustrations ; 28 cm.
Language: English
LC classification: T
Contents: Study of distortions in CATV DFB laser diodes / J.-C. Froidure, C. Lebrun, P. Megret, V. Moeyaert, P. Goerg, T. Tasia, M. Lamquin and M. Blondel -- Chaotic instabilities in modulated external-cavity semiconductor lasers / B. C. Lam, A. L. Kellner, P. K. L. Yu, M. M. Sushchik and H. D. I. Abarbanel -- Modulation characteristics of multiple quantum-well lasers including coupling effects between wells / A. D. Sarmento -- Rate equation description of carrier transport effects in multiple quantum-well lasers / Y. Chen, M. S. Wartak, H. Lu and T. Makino -- High-reliability nonhermetic 1.3-[mu]m InP-based uncooled lasers / N. Chand, J. W. Osenbach, T. L. Evanosky, R. B. Comizzoli and W. Tsang -- Lens-coupled laser-diode module integrated on silicon platform / G. Nakagawa, K. Miura, K. Tanaka and M. Yano -- Coolerless operation of a high-speed data link at 1 Gb/s over a temperature range from - [actual symbol not reproducible] to [actual symbol not reproducible] / R. Nagarajan, R. Marsland, R. Dato, P. Wen, B. Li, P. Braid, K. M. Dzurko and R. R. Craig -- 1.625-[mu]m high-power lasers for OTDR monitoring systems for optical transmission lines / T. Munakata, Y. Kashima, S. Kusumoto, A. Matoba and H. Takano -- High-power, high-efficiency, and highly uniform 1.3-[mu]m uncooled InGaAsP/InP strained multiquantum-well lasers / K. Kojima, M. W. Focht, J. M. Freund, J. M. Geary, K. G. Glogovsky, G. D. Guth, R. F. Karlicek, L. C. Luther, G. J. Przybylek, C. L. Reynolds, D. M. Romero, L. E. Smith, D. V. Stampone, J. W. Stayt, V. S. Swaminathan, F. S. Walters, K. T. Campbell, J. A. Grenko, J. Levkoff and M. G. Palin -- Extremely low threshold 1.3-[mu]m strained-MQW lasers for parallel high-speed optical interconnections / K. Uomi -- Integrated strained-layer photonic devices by selective area epitaxy / J. J. Coleman -- Performance comparison of 1300-nm semiconductor optical amplifiers with bulk and MQW active layers / Y. Z. Liu, J. M. Chen, J. T. Zhu and P. K. L. Yu -- New technology developments make passive laser/fiber alignment a reality / J. V. Collins, B. M. MacDonald, I. F. Lealman and C. A. Jones -- Demonstration of highly reliable nonhermetic planar InGaAs/InP photodiodes / J. W. Osenbach, T. L. Evanosky, S. B. Phatak, R. B. Comizzoli and N. Chand -- Uncooled laser packaging based on silicon optical bench technology / J. V. Gates, G. Henein, J. Shmulovich, D. J. Muehlner, W. M. MacDonald and R. E. Scotti -- Packaging of photonic devices using laser welding / S. Jang -- Silicon wafer board alignment of laser arrays to single-mode optical fiber for analog optoelectronic module applications / P. O. Haugsjaa, C. A. Armiento, A. J. Negri, J. Mehr, M. J. Tabasky, H. P. Hsu, W. W. Ng, D. Yap and H. W. Yen -- Waveguide coupling optimization using lenses / M. Cote and R. R. Shannon -- Optical design of a low-cost fiber optic coupling device for data communication applications / C.-L. Jiang, A. J. Heiney and W. H. Reysen -- Analysis and compensation of ball-lens-induced pupil distortion and spherical aberration / C. E. Gaebe -- Combination of ray-trace and diffraction modeling to describe coupling laser diodes to fibers and waveguides / T. D. Milster and Z. Chen -- Diffractive optics for photonic packaging of laser diodes and fiber optics / M. R. Feldman, W. Welch, R. D. Te Kolste and J. E. Morris -- Optimization of laser-to-fiber coupling to maximize manufacturing yield / N. Delen and R. B. Hooker -- Silicon microbench heater elements for packaging optoelectronic devices / R. L. Combs, M. D. Pocha and O. T. Strand -- Advances in high-power fiber-coupled laser diodes / R. J. Lang, F. Shum, G. L. Harnagel, R. Parke, S. O'Brien, J. M. Major, D. G. Mehuys, R. R. Craig, D. F. Welch and D. R. Scifres -- High-efficiency coupling for high-aspect-ratio laser diodes / T. K. Oleskevich.
Subject headings (LCSH): Electronic packaging--Congresses.; Semiconductor lasers--Congresses.