時域
Figure 1a shows the schematic of our first case study consisting of a triple-stacked die package. The x-ray image of figure 1b is intended to illustrate the challenge of finding the potential short locations represented for failure analysts. In particular, this is one of a set of units that were inconsistently failing and recovering under reliability tests. Time domain reflectometry and X-ray analysis were performed on these units with no success in isolating the defects. Also there was no clear indication of defects that could potentially produce the observed electrical short failure mode. Two of those units were analyzed with SSM.