Cost Analysis of Electronic Systems (Wspc Series in Advanced Integration and Packaging)
Peter Sandborn is a Professor in the CALCE Electronic Products and Systems Center at the University of Maryland. Dr. Sandborn s group develops obsolescence forecasting algorithms, performs strategic design refresh planning, and lifetime buy quantity optimization. Dr. Sandborn is the developer of the MOCA refresh planning tool. MOCA has been used by private and government organizations worldwide to perform optimized refresh planning for systems subject to technology obsolescence. Dr. Sandborn also performs research in several other life cycle cost modeling areas including maintenance planning and return on investment analysis for the application of prognostics and health management (PHM) to systems, total cost of ownership of electronic parts, transition from tin-lead to lead-free electronics, and general technology tradeoff analysis for electronic systems.Dr. Sandborn has also developed and implemented part selection and management benchmarking and part obsolescence management benchmarking for Nortel, Schlumberger, Microsoft, Motorola, Honeywell, Lucas Aerospace and others. Dr. Sandborn has taught industry short courses on electronic systems cost modeling and obsolescence management to Ericsson, Harris, IBM, StorageTek, Motorola, United Defense, FAA, UK Ministry of Defense, the U.S. Navy and other organizations. Dr. Sandborn is a member of the U.S. Navy TRENT Shareholder Council and is the author of the U.S. DoD s DMSMS working group s DMSMS tool/data taxonomy. Dr. Sandborn has been the principle investigator on programs for the U.S. Air Force, Army and Navy; the Defense Logistics Agency, Lockheed Martin, Northrop Grumman, Motorola, Argon ST, Ericsson, the Naval Surface Warfare Centers, and others.Dr. Sandborn is an Associate Editor of the IEEE Transactions on Electronics Packaging Manufacturing and a member of the editorial board of the International Journal of Performability Engineering. He is a past conference chair and program chair of the ASME Design for Manufacturing and Life Cycle Conference. He is the author of over 150 technical publications and several books on electronic packaging and electronic systems cost analysis and was the winner of the 2004 SOLE Proceedings and 2006 Eugene L. Grant awards. He has a B.S. degree in engineering physics from the University of Colorado, Boulder, in 1982, and the M.S. degree in electrical science and Ph.D. degree in electrical engineering, both from the University of Michigan, Ann Arbor, in 1983 and 1987, respectively.