Reliability and Failure of Electronic Materials and Devices
This book introduces the reader to the widely dispersed reliability literature of microelectronic and electro-optical devices.  It integrates a treatment of chip models used to explain degradation, and the statistical handling of lifetime data.  Electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered.  An underlying book thread concerns product defects-their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.  The book can be used as an advanced undergraduate/graduate textbook for materials scientists and electrical engineers, and as a reference for reliability professionals.KEY FEATURES*  Discuss reliability and failure on both the chip and packaging levels*  Handles the role of defects in yield and reliability*  Includes a tutorial chapter on the mathematics of reliability*  Focuses on electomigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage, and the mechanical failure of packages, contacts, and solder joints*  Considers defect detection methods and failure analysis techniquesABOUT THE AUTHORDr. Milton Ohring, author of two previously acclaimed Academic Press books, The Materials Science of Thin Films (1992), and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T; and Lucent Technologies).  From this perspective and the well-written tutorial style of the book, the reader will gain deeper physical understanding of failure mechnanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.