Wafer bonding : applications and technology ; with 372 figures and 25 tables During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state of the art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding based fabrication methods of silicon on insulator photonic crystals VCSELs SiGe based FETs MEMS together with hybrid integration and laser lift off. The non specialist will learn about the basics of wafer bonding and its various application areas while the researcher in the field will find up to date information about this fast moving area including relevant patent information. TOC:Direct Bonding Fusion Bonding Anodic Bonding Wafer Bonding: A Historical Patent Picture of the World Wide Moving Front of the State of the Art of Contact Bonding. Basics of Silicon on Insulator (SOI) Technology. Silicon on Insulator by the Smart CutTM Process. ELTRAN Technology Based on Wafer Bonding and Porous Silicon. Wafer Bonding for High Performance Logic Applications. Application of Bonded Wafers to the Fabrication of Electronic Devices. Compound Semiconductor Heterostructures by Smart CutTM: SiC on Insulator QUASICTM Substrates InP and GaAs Heterostructures on Silicon. Three Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach. Wafer Direct Bonding for High Brightness Light Emitting Diodes and Vertical Cavity Surface Emitting Lasers. High Density Hybrid Integration of III V Compound Optoelectronics with Silicon Integrated Circuits. Layer Transfer by Bonding and Laser Lift off. Single Crystal Lithium Niobate Films by Crystal Ion Slicing. Wafer Bonding of Ferroelectric Materials. Debonding of Wafer bonded Interfaces for Handling and Transfer Applications