translate English to German: For a long time, the design of these component groups was characterised by complicated solder connections and complex wire harnesses. Today, these applications can be produced in a significantly more compact way, with a high level of process reliability and more cost-effectiveness through intelligent integration of ICS press-fit technology.
Lange Zeit war die Bauweise von Backplanes geprägt von aufwändigen Lötverbindungen und unübersichtlichen Kabelbäumen.