Anisotropic conductive film Technology overview Technology overview

| Assembly_Type | Adhesive_Type | TimeSec | Temp_C | Pressure |
|---|---|---|---|---|
| Flex-on-Glass (FOG) | Epoxy | 10–12 | 170–200 | 2-4MPa▲ |
| Chip-on-Glass(COG) | Epoxy | 5–7 | 190–220 | 50-150MPa※ |
| Chip-on-Flex (COF) | Epoxy | 5–10 | 190–220 | 30-150MPa※ |
| Flex-on-Board (FOB) | Epoxy | 10–12 | 170–190 | 1-4MPa▲ |
| Flex-on-Board (FOB) | Acryl | 5–10 | 130–170 | 1-4MPa▲ |
| Flex-on-Flex (FOF) | Epoxy | 10–12 | 170–190 | 1-4MPa▲ |