hot air nozzles for ICs? - e.g. Zephyrtronics vs Hakko - Page 1
Forum section: electronics / general

author: terryk87
author_rank: Contributor
timestamp: February 06, 2013, 05:10:54 pm
content: Hello,I'd like opinions on different techniques for using hot air with ICs, for example as indicated by:(i) the Zephyrtonics ZT-2:http://www.zeph.com/pencil.html(ii) the Hakko FR-801:http://www.hakko.com/english/products/hakko_fr801.htmlZephyrtronics shows their unit being used continuously pad-by-pad to reflow solder ICs (see their video on the product page I gave above, about 1 screen down), whereas Hakko shows in their user manual (https://doc.hakko.com/download.php?_gs=on&l=en&kp=fr-801&d=2404; 2-page 7M pdf) specialized nozzles being used to both solder and desolder ICs “all-at-once”.(For desoldering ICs, Zephyrtronics recommends their own low-temp solder method, and leaves the specialized nozzles to their higher-end benchtop equipment).So, neither the Zephyrtronics unit nor the Hakko are intended to desolder larger ICs by waving a small nozzle around the entire part, but we've all seen online videos of this being done. If this method is reliable enough if you don't mind the fiddling, or are using a preheater, how necessary are specialized nozzles like Hakko's?For soldering larger ICs pad-by-pad (e.g. as shown in the Zephyr video), I assume you have to be well-practiced with amount of paste, temp, airflow so it doesn't take too long and the preheat times for all the pads are still in-range. Is this method reliable, or are specialized nozzles necessary?Thanks,-Terry Karlson

author: terryk87
author_rank: Contributor
timestamp: February 07, 2013, 11:25:56 am
content: Clarification: I originally posted this topic in the wrong board (Chat), later asked to have it moved here, but since it appeared so far down (now on p. 2) I'm afraid most readers of this board would never see it (without me now kicking it back up). -TK

author: nctnico
author_rank: Super Contributor
timestamp: February 07, 2013, 12:45:32 pm
content: I use a hot air station with a round nozzle. I try to heat up the board by waving it around the chip. The board usually need most of the energy to warm up.

author: T4P
author_rank: Super Contributor
timestamp: February 11, 2013, 06:13:20 pm
content: Well IMO i think it's got to do with making use of the thermal mass of hot air stationsSmall openings that can still escape out of the holes to heat all the pads up and using nozzle contact to desolder the whole chip very quickly, if you get a hakko 850 nozzle onto a 858D (The 850 nozzles are clamp types) a 858D becomes a great QFP soldering machine (700W!)

author: richcj10
author_rank: Unknown
timestamp: February 14, 2013, 05:58:17 am
content: I used the Zephyrtonics hot are pencil. It worked good for a bout a year then started acting strange. The heat and air knob wouldn't work correctly and then 5 months latter the heater stopped.My Aoyue works better! I would go with the Hakko. Also, It really depends on what you are working on for nozzles or not. I work on boards with very small components. I use shaped tips to direct the air only on the IC I need to work on. I wouldn't use a hot air tool to assemble a board. I would use a reflow oven or a toaster oven. Much better even heat and components don't go flying!