Sub $10k Pick and Place Machine for Die Placement - Page 1
Forum section: electronics / general

author: okie
author_rank: Newbie
timestamp: May 19, 2018, 12:38:56 am
content: Has anyone tried or have opinions about the possibility of pick and placing die with one of the sub $10k pick and place machines?I'd like it to be able to use vision to rotationally align (at least square up, but if the vision is able to detect asymmetric bond pad patterns or any patterns on a component to correct for arbitrary rotational alignment, even better) and pick and place a 1mm x 1mm, 0.1mm thick die from a waffle-pack with an X-Y accuracy of say 0.025mm.Can any of these machines come close without using fiducials (open-loop with respect to vision, relying on stage control)? If not, what types of shapes of fiducials do the softwares support? Could a fiducial be, for example, another die that sits beside the die being placed or the end of a PCB trace that approaches the die or a pad on the die? Do any machines support writing arbitrary or more flexible alignment algorithms? Which machines have people in the world created software for that enables writing your own fiducial-finding/alignment algorithms?Are any of the nozzles that work with these machines and the way the machines operate the Z axis delicate enough to not break a 0.1mm die? Are there any issues with machining custom collets to fit on the end of off-the-shelf nozzles?

author: jmelson
author_rank: Super Contributor
timestamp: May 19, 2018, 04:41:31 pm
content: Quote from: okie on May 19, 2018, 12:38:56 amWOW, you are asking a lot! Is this a bump-bonded die that will be flip-chip soldered to the PC board pads?First, you definitely will need fiducials! I doubt any special software is needed. You can either image the pads the chip will be mounted to or a fiducial near the location. .025 mm XY accuracy? None of the low-end Chinese machines can come CLOSE to this.I suspect you could modify the nozzle, etc to gently handle the chip. You could set up a camera with a shorter focal length lens toaccurately image the 1mm square chip. But, the accuracy is going to be a tough problem to solve.Jon

author: free_electron
author_rank: Super Contributor
timestamp: May 19, 2018, 05:08:45 pm
content: die placement doesnt work that way ( unless these are bump dies )it is not important where the die lands. the bonder will search for the pad centers and bond correctly.for bump dies you need ultrasonic welding anyway and that is a totally different kind of machine.what exactly are you trying to solder on what. ? i may be able to point you at what you need.

author: okie
author_rank: Newbie
timestamp: May 19, 2018, 07:36:02 pm
content: They are not flip-chip ICs; They are wirebonded to microstrip traces on hard substrates and soft RF PCB substrates. The reason the accuracy is needed is that for low loss at microwave frequencies, it’s best to minimize wirebond length to minimize inductance, so the substrates they wirebond to come up very close to the die and end (or have a cutout) so that the die’s pads also sit level with the trace (to minimize bondwire length).

author: CM800
author_rank: Frequent Contributor
timestamp: May 19, 2018, 10:04:29 pm
content: Quote from: okie on May 19, 2018, 12:38:56 amTo do this, I would suggest stages like this:https://www.ebay.co.uk/itm/Parker-MX80L-Linear-Servo-Motor-Actuator-Stage-0-01um-Encoder-ViX-250IH-Drive/321738346387?hash=item4ae9198f93:g:cfcAAOSwYGFUxpuAyou can probibly find some with more travel. IKO do great X-Y linear stages, along with pick and place style systems too.http://www.ikont.com/positioning-stages/linear-motor-drive-positioning-tables#nano-linear-tables-ntThese would be perfect for you. Our company has been looking into distributing them in the UK for some time. I'd recommend Elmo servo drives if you can get ahold of them. PM me if you need any support. I work with them day-to-day. They usually arn't friendly with minimum order quantities however. Fail that, Mitsubishi do some good drives.If you want to do this for under $10k, you're going to have to make it all yourself.I'd suggest using EtherCAT drives and a software based master, you could then control it from your own software via C# and mount a 4k industrial camera on the machine. They can be brought for sub 1k these days.

author: free_electron
author_rank: Super Contributor
timestamp: May 21, 2018, 01:59:46 am
content: Quote from: okie on May 19, 2018, 07:36:02 pmand you think that can be done with a chinese piece of junk ? forget it.you are battling two problems1- positioning the die2- bonding it.your only option is a machine that can do both in one step.Kulicke en Soffa wirebonders.https://www.ebay.com/itm/Kulicke-Soffa-Maxum-Ultra-Bonder-K-and-S-Wire-K-S-Edge-Die-Wafer-Ball-KnS/142794054046?hash=item213f30599e:g:YrEAAOSw4EhahaJF