Reflowing my first BGA: Tips needed - Page 1
Forum section: electronics / general

author: lawrence11
author_rank: Frequent Contributor
timestamp: September 17, 2019, 02:41:33 pm
content: So I have my controleo3 all ready, its been "learned", the profile program has been tested.I am reflowing on 1 chip ATM due to them being the only leadfree BGA of the gang, a 216 bga .8mm with no balls in the middle.Should I risk aligning manually? Or should I contatc somebody with an xray to help? Is manually best I can good enough?Should I put some flux on the pcb copper pads of the bga?This my fluxhttps://www.amazon.com/Solder-Welding-Electronic-Soldering-Lead-free/dp/B076M49M63/ref=sr_1_47?keywords=solder+flux&qid=1568731253&s=gateway&sr=8-47

author: lawrence11
author_rank: Frequent Contributor
timestamp: September 17, 2019, 06:11:10 pm
content: I need an answer.

author: spongle
author_rank: Regular Contributor
timestamp: September 17, 2019, 07:01:46 pm
content: yes

author: lawrence11
author_rank: Frequent Contributor
timestamp: September 17, 2019, 07:07:44 pm
content: yes to what exactly?any other details?

author: asmi
author_rank: Super Contributor
timestamp: September 17, 2019, 07:46:56 pm
content: I always manually align BGAs and place them on top of a solder paste. Precision is not required because BGAs will self-align once solder melts.

author: lawrence11
author_rank: Frequent Contributor
timestamp: September 17, 2019, 08:00:45 pm
content: Some people say to tin them instead.Would like to see a video of people tinning bga pads, what tips they use etc...I hav a good soldering iron hakko fx-888 and some various tips I bought.Problem: I never really soldered these ypes of things, I m noobie. But I want to get better, Im ready.I even got my magnifier helmet type thing 3.5x with a LED.I have a stencil, but I cut off the bga section with a razor blade as I thought the chip was going to get in my way when I wanted to apply paste for the other components and I read we shouldnt mix.What I have is a tiny bga stencil, barely bigger than the holes. Yeah... Its complicated...Please help me get through this

author: asmi
author_rank: Super Contributor
timestamp: September 17, 2019, 09:01:18 pm
content: Quote from: lawrence11 on September 17, 2019, 08:00:45 pmWho says that?For BGAs you need as flat surface as you can get. OSP/ENIG/immersion silver are the best. If you have to replace the chip, you need to clean pads from old solder before you place a new one. Add some flux, place a part and apply heat. Just make sure you don't blow the part in the process.Quote from: lawrence11 on September 17, 2019, 08:00:45 pmYou need hot air gun, not iron.Quote from: lawrence11 on September 17, 2019, 08:00:45 pmLike I said, add some flux and use heat gun. It's good enough for a one-off board.

author: lawrence11
author_rank: Frequent Contributor
timestamp: September 17, 2019, 09:12:34 pm
content: I dont know asmi... That seems dangerous for a 27$ ARM chip that I only have 1.What about my controleo 3?

author: asmi
author_rank: Super Contributor
timestamp: September 17, 2019, 09:49:50 pm
content: Quote from: lawrence11 on September 17, 2019, 09:12:34 pmYou probably spend more for a dinner... If you will somehow destroy that one - buy another one. I routinely reflow significantly more expensive FPGAs.Quote from: lawrence11 on September 17, 2019, 09:12:34 pmI dunnow. There is a lot of folks promoting it over here. I'm not one of them.Like I said, for just a single part I would use hot air gun. I use reflow oven only for complete boards.