Federal award (PURCHASE ORDER, fiscal year 2024)
Recipient: COOK AND WEIL, INC.
Awarding agency: National Aeronautics and Space Administration / National Aeronautics and Space Administration
Funding agency: National Aeronautics and Space Administration / National Aeronautics and Space Administration
Period of performance: 2025-07-22 to 2025-09-02
Current total value of award: $30793.2
Description: SILICON WAFER BALL BONDER