Federal award (DELIVERY ORDER, fiscal year 2021)
Recipient: RAYTHEON COMPANY
Awarding agency: Department of Defense / Defense Microelectronics Activity
Funding agency: Department of Defense / Department of the Air Force
Period of performance: 2022-04-01 to 2024-07-31
Current total value of award: $199420
Description: DESIGN AND BUILD A MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) THAT INTEGRATES HEXAGONAL BORON NITRIDE (H-BN) WAFERS AND DEMONSTRATE THE SUITABILITY OF THIN FILM H-BN SUBSTRATES.