Federal award (DEFINITIVE CONTRACT, fiscal year 2021)
Recipient: IRVINE SENSORS CORPORATION
Awarding agency: National Aeronautics and Space Administration / National Aeronautics and Space Administration
Funding agency: National Aeronautics and Space Administration / National Aeronautics and Space Administration
Period of performance: 2018-06-13 to 2021-12-31
Current total value of award: $746397
Description: EO14042 THE COMPUTING CAPABILITIES OF ONBOARD SPACECRAFT ARE A MAJOR LIMITING FACTOR FOR ACCOMPLISHING MANY CLASSES OF FUTURE MISSIONS. ALTHOUGH TECHNOLOGY DEVELOPMENT EFFORTS ARE UNDERWAY THAT WILL PROVIDE IMPROVEMENTS TO SPACECRAFT CPUS, THEY DO NOT ADDRESS THE LIMITATIONS OF CURRENT ONBOARD MEMORY SYSTEMS. IN ADDITION TO CPU UPGRADES, EFFECTIVE EXECUTION OF DATA-INTENSIVE OPERATIONS SUCH AS TERRAIN RELATIVE NAVIGATION, HAZARD DETECTION AND AVOIDANCE, AUTONOMOUS PLANNING AND SCHEDULING, AND ONBOARD SCIENCE DATA PROCESSING AND ANALYSIS REQUIRE HIGH-BANDWIDTH, HIGH-CAPACITY MEMORY SYSTEMS TO MAXIMIZE DATA STORAGE AND PROVIDE RAPID ACCESS TO OBSERVATIONAL DATA CAPTURED BY HIGH-DATA-RATE INSTRUMENTS (E.G., HYPERSPECTRAL INFRARED IMAGER, INTERFEROMETRIC SYNTHETIC APERTURE RADAR). THREE-DIMENSIONAL ICS, AFTER A LONG WAIT, ARE NOW A REALITY. THE FIRST MAINSTREAM PRODUCTS ARE 3D MEMORY CUBES THAT OFFER MANIFOLD IMPROVEMENTS IN SIZE, CAPACITY, SPEED, AND POWER. UNFORTUNATELY, NONE OF THESE ARE READY FOR SPACE. THE PURPOSE OF THIS RESEARCH AND DEVELOPMENT IS TO PURSUE A NON-VOLATILE, 3D MEMORY MODULE THAT CAN MEET THE HIGH-RELIABILITY REQUIREMENTS OF SPACE AND INTERFACE TO THE HIGH PERFORMANCE SPACE COMPUTER (HPSC) USING A HIGH-SPEED SERIAL INTERFACE. DEVELOPMENT WILL INCLUDE FABRICATING A 3D MEMORY CUBE AND RTL FOR A FPGA BASED MEMORY CONTROLLER WHICH WILL EVENTUALLY BE MIGRATED TO A RAD-HARD ASIC. THE FPGA BASED PLATFORM WILL INTEGRATE A 3D MEMORY CUBE TO PRODUCE A 3D MEMORY MODULE PROTOTYPE THAT WILL VALIDATE AND DEMONSTRATE THE FEATURES, RELIABILITY, AND PERFORMANCE OF THE ENVISIONED 3D MODULE.