Edited sentence: Hermetic packages:.ISOLATED TO220:.LAMINATE CSP:.LAMINATE TCSP:.LAMINATE UCSP:.LLP COL:.LQFP EXP PAD:.MICRO SMD:.MICRO SMDXT:.MINI SOIC EXP PAD:.MINI SOIC:.Plastic packages:.SOIC NARROW:.SOIC WIDE:.TO-247 SINGLE GAUGE:.TO-263 THIN:.TQFP EXP PAD:.TSSOP EXP PAD: