Original sentence: Since then a number of alternatives to the solder bumps have been introduced, including gold balls or molded studs, electrically conductive plastics, and the "plated bump" process that removes an insulating plating by chemical means
Edited sentence: Since the flip chip's introduction a number of alternatives to the solder bumps have been introduced, including gold balls or molded studs, electrically conductive plastics, and the "plated bump" process that removes an insulating plating by chemical means