Objectives The “Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level” project (MICROPRINCE) is focused on creation of a pilot line for micro-transfer-print­ ing (µTP) of functional components like processed III/V devices, optical filters, and special sensors. Several EU and national research activities demonstrated successfully the feasibility of µTP technology in a scientific and laboratory environment. The MI­ CROPRINCE consortia has the goal to set up the first worldwide open access foundry pilot for heterogeneous integration by µTP and to demonstrate its capability on five defined target application scenarios:  µTP for special magnetic sensors,  µTP of optical filters on photosensitive sensors,  µTP for LED devices and,  µTP for photonic-based life science applications. Relevance and Impact The consortia consisting of 12 industrial and scientific partners from four different countries combine their expertise along the value chain from materials and equipment, technology and semiconductor processing, integrated circuit and system design, test and application to create a new industrial smart system manufacturing capability in Europe. MICROPRINCE is an excellent project to bridge the gap between research activities and industrial exploitation for innovative smart system integration for future key applications and markets in different sectors. This contributes significantly to the continued development of a strong and competitive electronic component and systems (ECS) industry in the European Union. MICROPRINCE will improve the competitiveness of industrial small, medium and large enterprises and strengthen the position of research institutes. This will influence the long- and medium-term position in key markets leading to economic and employment growth in the European Union. The MICROPRINCE pilot line is acting as a regional and nationwide competence cluster for a novel technology with European dimensions for heterogeneous system integration and supports the ECS industry to reach leadership in key technologies. Project Coordinator Sebastian Wicht Institution X-FAB MEMS FOUNDRY GMBH Email sebastian.wicht@xfab.com Website www.microprince.eu Start Duration 1-4-2017 36 months Total investment €M 14.5 Participating organisations 12 Number of countries 4 Technical Innovation The working principle of the micro-transfer-printing technology is to use a micro- structured elastomer stamp to transfer microscale functional components from their native substrates (e.g. III/V materials) onto non-native substrates (e.g. silicon wafers). The lateral dimensions of the functional components can range from a few microns to a few hundreds of microns with thicknesses of only a few microns. A post- processing is required to electrically connect the printed components with the silicon wafer underneath. This Micro-Transfer-Printing technology enables cost-effective combination of various materials by a massive parallelization reducing the processing time and production costs. Chiplet test designs (100 x 100 um) and confocal microscopy image of release-etched chiplets. Precise device transfer: from dense to dispersed arrays Printed optical filter on top of a silicon photodiode. Printed LED with gold pads on source wafer for wire bonding. MICROPRINCE Micro-Transfer-Printing of Functional Components on Wafer Level Germany X-FAB MEMS FOUNDRY GMBH X-FAB SEMICONDUCTOR FOUNDRIES AG MELEXIS GMBH OPTICS BALZERS JENA GMBH FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DRESDEN UNIVERSITY OF TECHNOLOGY Switzerland MELEXIS TECHNOLOGIES SA Belgium MELEXIS TECHNOLOGIES MELEXIS NV IMEC Ireland X-CELEPRINT LTD. UCC-TYNDALL