CONTACTS project-matel project_matel www.project-matel.eu Next generation of OEIC-based devices: wide-bandwidth, minimized losses & multifunctionality in miniaturized form factors Strengthening the EU's industrial capability in photonics and microelectronics Green and digital manufacturing approach fostering chemicals and waste minimization European strategic autonomy in OEICs Lowering the barriers for OEIC uptake by high- tech SMEs Expected Impacts To demonstrate and validate at TRL5 advanced OEICs for two applications: i) Display & Recreation: AR display featuring a 2D light source ii) Health: Biophotonic sensors. The EU-funded project “MatEl” consists of four pillars encompassing new integration schemes for (i) chip manufacturing (WP2), (ii) advanced materials integration on OEIC (WP3), (iii) Hybrid integration of advanced materials using laser based technologies (WP4) and (iv) PIC & IC packaging and assembly technologies in order to enable the development of two use applications (WP5). This will be achieved by consistently pursuing the following objectives: TECHNICAL OBJECTIVES AR AR display featuring a 2D light source for light-field with on-chip RGB lasers and OEIC-based demultiplexer. Bio-photonic sensors for reliable and low-cost detection of Covid-19 featuring integrated on-chip VCSEL at 850 nm and Graphene-based photodetector. BIO sensing APPLICATIONS Europe’s leading position in photonics and electronics can only be secured by adapting to the next generation of optoelectronic devices requirements: high performance, multi- functionality and cost efficiency in miniaturized footprint. These can only be achieved if novel schemes for on-chip integration emerge. Silicon nitride (Si3N4) is a promising candidate for optoelectronics applications; next to silicon photonics and indium phosphide, Si3N4 photonic integrated circuits have broad spectral coverage and low propagation losses. Still, Si3N4 itself has no active effect (except thermal tuning) and active functionality can be demonstrated either by integrating active components or active materials. The on-chip integration of III-V and II-VI semiconductors on Si3N4 is complicated and costly. The EU-funded project “MatEl” introduces a novel, on-chip integration scheme enabling accurate and fast alignment and bonding of any type of chip package on Si3N4. MatEl will combine laser transfer (LIFT) and laser soldering processes to demonstrate next-gen applications, which will accelerate the industrial adoption of hybrid optoelectronic integrated circuits (OEICs) - offering high-performance, multi-functionality and cost efficiency in a miniaturized footprint. MatEl’s innovative solution, enhanced by the monolithic integration of advanced materials – graphene and high-quality PZT, will thus be demonstrated for two selected next-gen devices at TRL5: CONSORTIUM 1- National Technical University of Athens, Heroon Polytechniou 9 Zographou Campus, 157 80 Athens, Greece 2- LIONIX INTERNATIONAL BV, Hengelosestraat 500, 7521 AN Enschede, Netherlands 3- PHIX BV, De Veldmaat 17, 7522 NM Enschede, Netherlands 4- GRAPHENEA SEMICONDUCTOR SL, Ps Mikeletegi 83, 20009 Donostia, Spain 5- SURFIX BV, Agro Business Park 2, 6708 PW Wageningen, Netherlands 6- AMIRES SRO, Na Okraji 335/42, 162 00, Praha 6, Czech Republic 7- PIEMACS SARL, Epfl Innovation Park, Batiment C, 1015, Lausanne, Switzerland 8- CREAL SA, Chemin De La Dent D'oche 1a, 1024, Ecublens, Switzerland K. Andritsos , M. Makrygianni , F. Zacharatos , S. Kamyar , E. Schreuder , R. Dekker , K. Obara , M. Milosevic , A. Centeno , A. Zurutuza , W. Knoben , M. Messina , M. Chopart , R. Pašek , S. Bagdzevicius , R. Matloub , P. Muralt , J. Gamet , A. Kvasov , I. Zergioti 1 1 1 1 2 2 3 3 4 4 5 6 6 6 7 7 7 7 8 2 MatEl: PZT and Graphene MATerials innovations for advanced opto-Electronic applications in AR and biosensing Acknowledgements: The authors would like to acknowledge funding from the EU Horizon Europe R&I programme under grant agreement 1010