# Study on Preparation and Processing Properties of Mechano-Chemical Micro-Grinding Tools
## 6 Conclusions and Outlook  
In this paper, the development of micro-grinding tools and the research on their mechano-chemical grinding mechanism was carried out. The results showed that when the self-made micro-grinding tools grind single-crystal silicon, the chemical activity of the particles was first improved under the cumulative action of grinding force and grinding temperature. Then, the solid-solid phase chemical reaction occurred between the abrasives, additives, and the sharp points on the surface of the silicon wafer, and then the soft reactants generated were removed under the mechanical grinding of the micro-grinding tools to achieve high-quality and low-damage processing. This paper concluded as follows.  
1. The \(\varepsilon\) deformation coefficient of the contact geometry of the abrasive and silicon wafer was introduced. The grinding depth model was established by considering the geometric characteristics of the abrasive grain processing trajectory. Based on the established grinding depth model, the contact area grinding force model of single-crystal silicon grinding by the micro-grinding tools was established. The model showed that changes in the characteristics of the abrasive itself, including the abrasive diameter, elastic modulus, abrasive volume ratio, and other factors, would affect the grinding force. At the same time, changes in grinding parameters such as abrasive speed and cutting depth would also affect the change in grinding force;
2. Self-made mechano-chemical micro-grinding tools could process single-crystal silicon into a very smooth mirror effect, and the surface roughness reached Ra1.332 nm. And the surface quality was close to that of the silicon wafer after chemical mechanical polishing (CMP) processing, and the surface was free of scratches, crushing pits, and other defects. The surface roughness of the silicon wafer after the diamond grinding tool processing was Ra96.363 nm, and there were obvious scratches on the surface and defects such as crushing. The processing effect of self-made mechano-chemical micro-grinding tools is much better than that of diamond grinding tools;
3. In the process of grinding mechano-chemical micro-grinding tools, the instantaneous temperature of the surface of the silicon wafer could reach about 150 \({}^{\circ}\)C, which met the  
Figure 16: Scanning electron microscopy of the micro-grinding tool.  
temperature threshold conditions for solid-solid phase chemical reactions between cerium oxide and additives and single-crystal silicon. A soft compound was formed on the surface of the silicon wafer through a chemical reaction between silicon and cerium oxide abrasives and was removed by mechanical wear in the subsequent process, and ultra-low damage processing of single-crystal silicon was realized under the synergy of machinery and chemistry.  
Conceptualization, X.S. and Y.R.; methodology, X.S.; validation, K.Z.; formal analysis, F.K.; investigation, J.Z.; resources, W.L.; data curation, K.Z.; writing--original draft preparation, F.K.; writing--review and editing, X.S.; visualization, F.K.; supervision, W.L.; project administration, X.S. and Y.R. All authors have read and agreed to the published version of the manuscript.  
The authors would like to appreciate the Special Sub-task of Strategic Leading Science and Technology of the Chinese Academy of Sciences (XDA25020317-05), Excellent Youth Project of Educational Committee of Hunan Province (2022 JJ10010), Key Research and Development Program of Hunan Province (2022 WK2003), the Natural Science Foundation of Hunan Province (2020 JJ4193, 2021 JJ40064) and the Natural Science Foundation of Changsha City (kq2014048).  
Not applicable.  
The authors declare no conflict of interest.