# Effect of Nanofluids on Boiling Heat Transfer Performance
## 1 Introduction  
In 1756, [PERSON] [1] dropped droplets on two aluminum plates of different temperatures, and it was found that the water droplets evaporate faster on the low temperature plates. This phenomenon has laid a milestone in the development of boiling heat transfer. In 1931, [PERSON] used a high-speed camera to study the generation and development of bubbles [2; 3]. In 1936, the roughness effect on boiling heat transfer was investigated [4]. However, [PERSON] [5; 6] used fluid dynamics to study the boiling critical heat flux in 1950, which promoted the theoretically research process of boiling heat transfer. In the early 1970s, the rapid development of industry further promoted the study of two-phase flow boiling heat transfer. In 1995, the Argonne National Laboratory proposed to disperse metal or nonmetal particles in water or organic solvents to form a stable suspension solution, which can improve the thermal conductivity of the base liquid. It has been verified by many scholars such as [PERSON] [7], [PERSON] [8], [PERSON] [9], [PERSON] [10], and so on. The nanofluids stability is affected by the nanoparticles, base fluid, and dispersant. In order to improve the dispersibility of nanoparticles, the dispersant with appropriate concentration and type was added in nanofluids and then oscillated in the oscillator [11; 12]. At present, the development of electronic devices in the direction of high integration and high computing speed has brought about the \"thermal barrier\" and \"thermal management\" problems that have become a hidden danger for the safe operation of equipment. Therefore, the search for high-efficiency heat conduction material and heat-dissipating methods has become the hot focus in industry [13; 14; 15; 16]. During the boiling heat transfer process, bubbles are formed at the vaporization core point, and continuously absorb heat to disengage, float, and escape the water surface. The bubble detachment cause severe disturbance to the liquid of the heating surface, so that the boiling heattransfer is stronger than the convective heat transfer of a single-phase fluid. Therefore, boiling heat transfer is widely used in heat dissipation and cooling of many industrial fields, such as electronic equipment, because of its small temperature difference and high heat transfer capacity [17; 18; 19]. [PERSON] [20] et al. carried out the bubble operation of the classic pool boiling curve at different boiling stages from the Figure 1. There is no bubble generation in the natural convection stage. The nuclear boiling phase can be divided into partial development stages and full development stages. There are relatively few bubbles in partial development stages and significant bubble coalescence has not yet occurred. During the full development stage, the bubbles appear to slip on the heated surface and merge into a mushroom-like and then escape from the water surface [21; 22]. During the transitional boiling phase and the film boiling phase, the bubbles gradually form a gas film on the heating surface, and the heat transfer is carried out by means of heat conduction and radiation, which is likely to cause the device to burn out. [PERSON] [23] et al. investigated experimentally the convective boiling heat transfer coefficient of spherical CuO(II) nanoparticles dispersed in water inside the vertical heat exchanger. Results show that by increasing heat and mass fluxes, the heat transfer coefficient considerably increases for both heat transfer regions, while by increasing the nanoparticle weight concentration the heat transfer coefficient increases in convective heat transfer (\(\sim\)35% at the maximum concentration) and deteriorates the heat transfer coefficient (\(\sim\)9% at the maximum concentration) in nucleate boiling region due to the formation of nanoparticle deposition of heating surface. [PERSON] [24] et al. experimentally performed the flow boiling heat transfer characteristics of MgO/therminol 66 nanofluid at wt.% = 0.1 and wt.% = 0.3 as a potential coolant on a copper-made disc.