## 1 Introduction  
Miniaturization and rising power densities in electronic devices pose significant thermal management challenges, as excessive heat degrades performance, efficiency, and component lifespan [1, 2]. Heatsinks mitigate these issues by transferring heat via conduction and convection [2, 3, 4]. Inadequate thermal management, with thermal fatigue causing over 40% of failures [4, 5, 6], has spurred the development of advanced designs. As power levels increase, conventional heatsinks often fall short, prompting strategies like optimized fin geometries, microchannel configurations, and additive manufacturing to boost efficiency [1, 2, 4, 7]. Studies show that increasing the surface area through structural modifications significantly improves thermal performance and device reliability [2, 3, 4, 8], making efficient design essential [2, 4, 5, 9]. Heatsinks are categorized as passive or active. Passive solutions rely on natural convection and radiation--offering simplicity, reliability, and maintenance-free operation but limited by ambient airflow [2, 4, 5, 8]. Active heatsinks use forced convection via fans, blowers, or liquid cooling to enhance performance at the expense of higher energy consumption and noise [1, 2, 4, 5]. Material selection is crucial: aluminum provides an excellent weight-to-performance ratio, whereas copper, though heavier and costlier, offers superior thermal conductivity [6, 7, 9, 10]. Recent advances in additive manufacturing enable the production of complex geometries that optimize dissipation [3, 4, 10]. Geometric factors--fin shape, height,spacing, and orientation--significantly influence efficiency. Traditional forms (rectangular, circular, and pin-fin) are now complemented by lattice structures, microchannels, and topology-optimized surfaces to maximize convective cooling [1; 2; 5; 10], with ongoing research aiming for an optimal balance between performance, cost, and manufacturability [3; 4; 7]. Heat transfer in heatsinks involves conduction (from the heat source to the sink, dependent on material conductivity [4; 7; 9]), convection (where natural convection relies on buoyancy and forced convection benefits from turbulence [4; 5; 6; 8]), and radiation (generally minor but significant at high temperatures due to surface emissivity [3; 4]). The thermal boundary layer's thickness around fins is critical--thinner layers improve convective transfer. Airflow characteristics, with turbulent flow enhancing mixing compared to laminar flow's lower heat transfer but reduced pressure drop [1; 4; 5], underscore the need for optimized fin geometry and surface structure to ensure efficient cooling under varying loads [3; 4; 8; 9]. Driven by the demand for efficient thermal management, research employs advanced computational methods like CFD for detailed airflow and heat dissipation analysis, allowing design refinements before prototyping [1; 2; 4; 7]. Topology optimization maximizes surface area with minimal material use, reducing weight and cost [2; 3; 5; 11]. Moreover, additive manufacturing--especially SLM--enables the fabrication of complex geometries (lattice structures, microchannels, and optimized fins) unattainable by conventional methods, thereby significantly enhancing heat transfer while preserving structural integrity [3; 4; 8; 9; 10]. Lattice-based heatsinks produced via SLM often outperform traditional designs due to increased convective area and improved airflow [4; 6; 8; 10]. Additionally, AM permits the use of high-performance alloys that offer superior thermal conductivity, reduced weight, and enhanced durability [6; 7; 10]. Heatsinks are vital across various applications, from power electronics (DC-DC converters, inverters, and motor drives [1; 2; 4; 7]) and computer hardware (CPU/GPU cooling with heat pipes or vapor chambers [3; 4; 5; 6]) to LED lighting, automotive battery and power electronics cooling [2; 8; 9; 10], and aerospace/telecommunications, where compact, lightweight designs are critical [1; 2; 3; 4].