## 5 Conclusions  
This study presented a systematic approach to analyzing thermal dissipation in mini heat exchangers, highlighting the impact of three main operational variables: power source, ambient temperature, and volumetric flow rate. The use of the full factorial design (FFD) method allowed for the comprehensive evaluation of the individual effects and interactions of these variables on the performance parameters: global thermal resistance (\(G_{TR}\)) and the heat transfer coefficient (\(h\)). The results showed that electrical power was the most significant variable for \(G_{TR}\), while ambient temperature was also a determining factor for the heat transfer coefficient. On the other hand, the volumetric flow rate did not present relevant statistical significance for any of the response variables within the studied range. In addition, the following key findings were observed:* The minimization of global thermal resistance was achieved with the reduced power (30 W), high ambient temperature (29 \({}^{\circ}\)C), and low volumetric flow rate (2.50 L/min).
* The maximization of the heat transfer coefficient was obtained at high power (65 W), high ambient temperature (29 \({}^{\circ}\)C), and a high volumetric flow rate (5 L/min).
* The methodology developed, which included the assembly of a prototype and detailed statistical analysis, establishes a reference standard for future studies. However, it is recommended that other temperature, power, and flow ranges be investigated to validate the results in different contexts and potentially optimize refrigeration systems.
* These findings highlight the importance of striking a balance between thermal performance and energy efficiency, which is a critical factor for optimizing the functionality of miniaturized devices such as high-thermal-density electronic processors.
* Optimized configurations such as the use of modified surfaces or nanostructures represent promising opportunities for future improvements to mitigate the increase in \(G_{\mathrm{TR}}\).  
Future research should explore the application of surface modifications, nanoparticle coatings, and alternative flow channel geometries to increase the dissipation efficiency of these electronic components. Furthermore, advanced measurement techniques, such as infrared thermography and particle image velocimetry (PIV), can be integrated to provide high-resolution thermal analysis in microchannel and minichannel systems.  
Conceptualization, S.d.S.F., A.A.V.O., J.A.P.d.C., K.A.F. and M.V.; methodology, S.d.S.F., A.A.V.O., J.A.P.d.C., A.A.S.L. and M.V.; software, S.d.S.F. and M.V.; validation, S.d.S.F., A.A.V.O. and J.A.P.d.C.; formal analysis S.d.S.F.; investigation, S.d.S.F., A.A.V.O., A.A.S.L., J.A.P.d.C. and M.V.; resources, A.A.V.O., J.A.P.d.C. and G.d.N.P.L.; data curation, A.A.V.O., J.A.P.d.C. and G.d.N.P.L; writing--original draft preparation, S.d.S.F., A.A.V.O., A.A.S.L. and M.V.; writing--review and editing, S.d.S.F., A.A.V.O., J.A.P.d.C., G.d.N.P.L., P.S.A.M. and M.V.; visualization, A.A.V.O., J.A.P.d.C., G.d.N.P.L., P.S.A.M., A.A.S.L. and M.V.; supervision, A.A.V.O., J.A.P.d.C., K.A.F., P.S.A.M. and M.V.; project administration, A.A.V.O., J.A.P.d.C. and K.A.F.; funding acquisition, A.A.V.O., J.A.P.d.C. and G.d.N.P.L. All authors have read and agreed to the published version of the manuscript.  
This research received no external funding.  
Not applicable.  
All the data is in the paper.  
The first author expresses gratitude to the PPGEM/UFPE for his doctoral studies. Additionally, the first, third, fourth, fifth, sixth, and seventh authors extend their appreciation to the IFPE for its support in the development of this work. The third author also thanks CNPq for productivity grant number 3303417/2022-6. Furthermore, the fifth author acknowledges CNPq for productivity grant number 303200/2023-5, and universal call grant number 422051/2023-3.  
The authors declare no conflicts of interest.