## 2 Materials and Methods  
### Conditioning Process and Pad Profile Measurement  
Pad conditioning and profiling equipment (G&P Technology, Poli-762, Busan, Korea) was used to measure the pad wear with a contact dial gauge (1 \(\upmu\)m resolution, Keyence, GT2, Osaka, Japan). Figure 1a,b shows the CMP equipment with the conditioner and the profiling system respectively. The moving speed of the dial gauge of the profiler in the radial direction of the pad was 5 mm/s, and the sampling frequency was 25 Hz. An IC1000 series pad of k groove with a diameter of 760 mm was used in the wear experiment. A diamond conditioner disc (Saesol Diamond Co., Ansan, Korea) was used in the experiment. The profiler measuring the pad shape is shown in Videos S1 and S2 (Supplementary files). The wear shape was profiled by measuring the pad shape before and after abrasion and then calculating the difference. Figure 2 is a typical pad profile (center fast change before and after abrasion, and the wear profile. Figure 3a shows a schematic of dividing the sweep zone into equal parts in the radial direction. Figure 3b shows a schematic of the relative occupancy time (ROT) between eight types of occupancy times. The developed simulation and equipment used in the experiments include the function of dividing the zone.  
In the simulation, the distance between the center of the disc and the center of the pad was 480 mm, the length of the conditioning arm was set to 480 mm, the radius of the pad was 381 mm, and the radius of the conditioner was 50 mm. The rotation speed of the conditioner disc was 103 rotations per minute (rpm), the pad rotation speed was 97 rpm, and the sweep speed was 7 cycles/min. The sweep zone was divided into 11 zones in even, linear center fast, linear edge fast, and controlled ROT as listed in Table 1. In the parabolic, inverse parabolic, step edge fast, and step center fast, the sweep zone was divided into 15 zones, and the ROT is listed in Table 2. The number of grit of the diamond disc was 72. The conditioning process was also carried out with the same device configuration and conditions as above, and the pad was conditioned for 10 min with a conditioning load of 40 N, and the pad shape before and after was measured. The starting point of conditioning was 25 mm from the center of the pad, and the return point of the conditioner was 350 mm from the center.  
Figure 1: (**a**) Chemical mechanical polishing (CMP) conditioning equipment (**b**) profiling system.  
\begin{table}
\begin{tabular}{c c c c c c c c c c c c} \hline \hline \multicolumn{2}{c}{**Zone**} & \multicolumn{2}{c}{**2**} & \multicolumn{2}{c}{**3**} & \multicolumn{2}{c}{**4**} & \multicolumn{2}{c}{**5**} & \multicolumn{2}{c}{**6**} & \multicolumn{2}{c}{**7**} & \multicolumn{2}{c}{**8**} & \multicolumn{2}{c}{**9**} & \multicolumn{2}{c}{**10**} & \multicolumn{2}{c}{**11**} \\ \multicolumn{2}{c}{**Case**} & \multicolumn{2}{c}{**1**} & \multicolumn{2}{c}{**2**} & \multicolumn{2}{c}{**3**} & \multicolumn{2}{c}{**4**} & \multicolumn{2}{c}{**5**} & \multicolumn{2}{c}{**6**} & \multicolumn{2}{c}{**7**} & \multicolumn{2}{c}{**8**} & \multicolumn{2}{c}{**9**} & \multicolumn{2}{c}{**10**} & \multicolumn{2}{c}{**11**} \\ \hline Even & 9.1 & 9.1 & 9.1 & 9.1 & 9.1 & 9.1 & 9.1 & 9.1 & 9.1 & 9.1 & 9.1 & 9.1 \\ \hline Linear Center Fast & 13.6 & 12.7 & 11.8 & 10.9 & 10 & 9.1 & 8.2 & 7.3 & 6.4 & 5.5 & 4.5 \\ \hline Linear Edge Fast & 4.5 & 5.5 & 6.4 & 7.3 & 8.2 & 9.1 & 10 & 10.9 & 11.8 & 12.7 & 13.6 \\ \hline Controlled & 3.1 & 6.0 & 8.1 & 9.2 & 9.6 & 9.2 & 9.2 & 9.2 & 9.2 & 9.5 & 11 \\ \hline \hline \end{tabular}
\end{table}
Table 1: Relative occupancy time (ROT, %) of the profile cases; even, linear center fast, linear edge fast, and controlled.  
Figure 2: A typical pad profile (center fast) before and after abrasion, and a wear profile.