## 1 Introduction
Laser processing is a non-traditional processing technique, wherein a high-energy laser beam is focused on the material. Removal of the material occurs by either photothermal ablation or destruction of the material bond [15]. Because there is no contact between the laser beam and the workpiece, the processing method is not limited by the hardness and strength of the workpiece. The workpiece will not be deformed under the mechanical forces during the processing. The technique is suitable for processing hard and brittle materials and workpieces of complex shapes. Therefore, it can be used to address the challenges in processing PCD [15; 16]. In addition, laser processing is not affected by the electrical properties of the material, and the surface quality after processing is better than that in electrical discharge machining [17]. [PERSON] et al. [16] studied the processing of PCD materials with Nd: YAG nanosecond pulse lasers (pulse width of 20 to 200 ns, wavelength of 1064 nm, and maximum average power of 300 W). The study proposed using the reactive fusion cutting mechanism (melt, burn, and blow) with purified air or oxygen to obtain better cutting results. Moreover, it revealed that diamond is converted to graphite during the laser ablation process, and because graphite is very soft, it can be easily removed by high-pressure assisted gas. The optimized laser processing parameters (average power of 300 W, pulse repetition rate of 45 kHz, pulse energy of 6.7 mJ, and peak power density of 120 MW/cm\({}^{2}\)) produced a 24 mm/min cutting speed. Despite this, they could not make a cutting edge of sufficient sharpness and accuracy as reactive fusion cutting produces striations on the cut face. [PERSON] et al. [17] compared the difference between PCD tools after picosecond pulse laser machining (pulse width of 12 ps, wavelength of 1064 nm, and maximum average power of 50 W) and electrical discharge machining. The results indicated that during electrical discharge machining, the binder on the tool surface was preferentially removed and formed numerous voids, contributing to the irregular cutting surface (surface roughness Ra = 0.72 \(\upmu\)m). These voids weaken the strength of the tool structure and lead to breakage after abrasion testing. After surface of the tool after laser processing, the tool's surface was relatively smooth and free of voids (the best surface roughness, Ra = 0.16 \(\upmu\)m), providing sufficient strength to the tool during cutting. However, microcracks were observed after the abrasion test. [PERSON] et al. [12] compared the difference between picosecond pulse laser processing (pulse width = 10 ps; wavelength = 1064 nm; fluence = 5.53 J/cm\({}^{2}\)) and diamond-wheel grinding of PCD tools. The results showed that because the grinding process cannot directly remove the diamond grains, the cutting force would tear the diamond grains out of the surface and leave numerous pits on the cutting edge. On the other hand, laser processing could ablate the diamond grains directly without creating surface pitting. The processing surface quality was uniform after laser processing, and the efficiency was higher than that of the diamond-wheel-grinding process. [PERSON] et al. [18; 19] applied ultrashort-pulsed laser ablation to polish PCD and explored the effects of pulse width and spot overlap percentage on the material removal rate and surface roughness. The study reported that using low-average-power with pulse widths measuring less than 500 fs could avoid diamond graphitization, thereby yielding better surface quality after processing (surface roughness Sa 0.41-0.47 \(\upmu\)m). [PERSON] et al. [20] studied femtosecond laser (150 fs, 780 nm, 1 kHz) cutting and finishing a magnesium alloy plate with a thickness of 125 \(\upmu\)m. The results indicated that the cutting surface uneven when the magnesium alloy sheet was cut by single pass cutting. However, with increase in the number of passes required to cut the workpiece, most of the laser energy is no longer made directly incident on the material.