## 3 Results
### Influence of the Ambient Temperature and Heat Sink Type on the Heat Flux and Electric Power  
The results of the research into the influence of the ambient temperature and the type of heat sink used on the heat flux transferred by the FTE1-01 flexible module and the electric power supplied to it are presented in the graphs below (Figures 10 and 11).  
Figure 10 indicates that with the increase in the ambient temperature, a decrease in the heat flux can be observed, which is particularly visible in the EP variant, i.e., with the use of the TEGway polymer heat sink. For this variant, at an ambient temperature of 20 \({}^{\circ}\)C, the heat flux was at the level of 2.5 W, while at an ambient temperature of 35 \({}^{\circ}\)C, it reached a value of approx. 1.4 W. The performed statistical analysis confirmed the statistically significant influence of the ambient temperature on the heat flux between 20 \({}^{\circ}\)C, 25 \({}^{\circ}\)C, and 35 \({}^{\circ}\)C. It should be noted, however, that even at the ambient temperature of 35 \({}^{\circ}\)C, the heat flux obtained with the EP variant was still higher than in the case of other variants at lower temperatures. This result shows that the polymer heat sink proposed by TEGway is able to effectively remove heat from the module's hot side, thereby increasing its efficiency in removing heat through the TEC module from the \"skin model\" heating plate. The statistical analysis performed confirmed that the differences observed between the EP and EM variants are statistically significant. On the basis of the obtained test results, it can also be concluded that the difference in heat flux in favor of the polymer heat sink as compared to the metal one becomes greater with the increasing temperature difference between the \"skin model\" heating plate and the environment.  
Figure 10: Heat flux as a function of ambient temperature for different heat sink elements, in non-isothermal conditions, for I = 0.25 A: error bars correspond to standard deviation; \"\" marks the statistically significant difference for \(p\) = 0.05.  
On the basis of Figure 11, it can be concluded that the ambient temperature and the type of the heat sink also affect the electric power supplied to the TEC at a constant current of 0.25 A (corresponding to a TEC voltage of 1.2 V). Along with the increase in ambient temperature, in all the analyzed variants, the electric power increased. However, in the case of the variant with the TEGway metal heat sink, this relationship was linear. In the case of variants with heat sinks using the evaporation effect (EP and ES), the observed increase in the electric power was slower; only after reaching a temperature of approx. 30 \({}^{\circ}\)C was there was a more rapid increase in the electric power consumed. These results indicate that the EP variant, apart from the highest heat flux, requires the lowest electric power in almost all conditions. On the other hand, in the case of the EM variant, except for the ambient temperature of 20 \({}^{\circ}\)C, the dependence of the heat flux and electric power on the ambient temperature is the least favorable. In the case of the ES and EM variants, the differences in electric power between the temperatures of 20 \({}^{\circ}\)C and 35 \({}^{\circ}\)C were statistically significant.