## 5 Discussion
The effectiveness and engineering applicability of the multiphysics coupling are verified. According to the analysis of Figures 11 and 12, as shown in Figure 13, the dynamic effect of heat generation and heat dissipation of the conductor structures under high ampere current is different from that of a small current, and in the case of low-amperage (\(I_{\text{LA}}\)), combined with Equation (8), it can be seen that the temperature change rate of the conductor structures is \(\frac{dT}{dt}>0\), in the 0-\(t_{0}\) stage, that is, the heat generation efficiency is higher than the heat dissipation efficiency, and the heat generation \(Q_{+}\) is greater than the heat dissipation \(Q_{-}\), and the temperature rises. In the \(t_{0}\)-\(t_{1}\) stage, the temperature change rate decreases, that is, the heat dissipation efficiency increases with the instantaneous temperature increase, and the difference between heat generation \(Q_{+}\) and heat dissipation \(Q_{-}\) decreases, resulting in a slow temperature increase. In the \(t_{1}\)-\(t_{2}\) stage, the temperature change rate tends to be 0, the heat dissipation \(Q_{-}\) is close to the heat generation \(Q_{+}\), and the thermal equilibrium appears on the conductor structures, and a stable temperature field is established. Therefore, in the case of low currents, it is common to increase the current-carrying cross-sectional area to significantly increase the current-carrying capacity. In the case of extreme high-amperage current (\(I_{EHA}\)), the temperature change rate increases sharply in the 0-\(t_{0}\) stage, that is, the heat generation efficiency is much higher than the heat dissipation efficiency, and the heat generation 1 is much greater than the heat dissipation 1, and the temperature rises sharply. In the \(t_{0}\)-\(t_{1}\) stage, the temperature change rate decreases slowly, and even though the heat dissipation efficiency increases with the instantaneous temperature increase, the difference between heat generation \(Q_{+}\) and heat dissipation \(Q_{-}\) is too large, resulting in no obvious temperature change. In this case, it is necessary to increase the cross-sectional area of the current-carrying to reduce the heat generation efficiency, and at the same time, it is necessary to reduce the heat difference by increasing the contact area and reducing the heat dissipation efficiency, so as to promote the thermal balance. Based on the experimental verification data shown in Figures 9 and 10, the contact area between the conductor structures directly influences both the cross-sectional area of current flow and the heat dissipation area. This enhancement improves heat dissipation efficiency and strengthens electron transport, verifying the effectiveness and engineering applicability of multiphysics coupling. According to the analysis of Figures 11 and 12, and as further illustrated in Figure 13, the dynamic behavior of heat generation and dissipation in conductor structures under extreme high-amperage conditions differs significantly from that under low current conditions. In the case of low-amperage currents (\(I_{\text{LA}}\)), based on Equation (7), the temperature change rate \(\frac{dT}{dt}>0\) in the stage of 0 to \(t_{0}\), meaning that heat generation exceeds heat dissipation (\(Q_{+}>Q_{-}\)), leading to a temperature rise. During the \(t_{0}\) to \(t_{1}\) stage, the temperature change rate decreases as the heat dissipation efficiency increases with rising instantaneous temperature, reducing the gap between \(Q_{+}\) and \(Q_{-}\), which results in a slower temperature rise. In the stage of \(t_{1}\) to \(t_{2}\), the temperature change rate approaches zero, and heat dissipation \(Q_{-}\) nearly equals heat generation \(Q_{+}\), achieving thermal equilibrium and forming a stable temperature field. Under these conditions, increasing the cross-sectional area of conductor structures effectively enhances current-carrying capacity.