## 4 Analysis and Discussion of Results
### Critical Considerations on the Dissipation Phenomenon in the Prototype
As contextualized in the state of the art [14,15], a fractional factorial design (FFD) outperforms the classical OFAT method by allowing the simultaneous analysis of factors and their interactions, which the OFAT method does not achieve. An FFD offers greater statistical efficiency, a comprehensive exploration of the experimental space, and more accurate estimates, contributing to more robust predictive models. The analysis of the interactions between the operational factors did not reveal statistical significance, suggesting that the individual optimization of each parameter is sufficient to improve thermal performance. In this sense, the literature highlights the importance of prioritizing energy efficiency and minimizing thermal losses to achieve better results [12]. The temperature difference between the electronic component and its surrounding environment is directly proportional to thermal resistance and the heat transfer rate. Reducing thermal resistance throughout the entire heat transfer circuit is essential for optimizing thermal performance. One approach to enhancing this experiment involves minimizing contact resistance to evaluate its impact on thermal efficiency [43]. Unlike previous experimental approaches which relied on parametric studies [7,15], this proposal identified statistically significant variables affecting the efficiency of mini heat exchangers. It demonstrated that the power supply is the dominant factor influencing the \(G_{TR}\), while the ambient temperature significantly impacts \(h\). These findings are consistent with previous research highlighting the importance of energy-efficient heat dissipation in miniaturized electronic devices [8,14]. Additionally, this study provided experimental validation of theoretical predictions, enhancing previous work that primarily relied on numerical simulations [25, 26, 27]. Finally, the limitations observed in the prototype, particularly under high power conditions (65 W), highlight the need to explore alternatives such as optimized minichannel geometries, higher thermal conductivity materials, and TPMS-based methods (Topologically Optimized Porous Media Structures), as suggested by [7,36]. These approaches can expand the potential for applications in high-thermal-density systems, especially in miniaturized electronic devices. Potential alternatives include modifying the fluid [10,30], increasing the heat exchange area [9], or altering the geometry [9,23,30,35] to improve (\(h\)) and reduce the temperature difference between the fluid and the heat exchanger to enhance the heat transfer coefficient. Advances in Heat Transfer Through Micro/Minichannels for Cooling Integrated Circuits: Emerging Phenomena and Experimental Challenges  
Due to the increasing miniaturization in the integrated circuit industry, microchannels and minichannels are essential solutions for heat dissipation in high-density electronics. The aspect ratio (height/width) influences the flow and heat transfer. Studies indicate that low values reduce thermal efficiency in rectangular and elliptical geometries [47; 48], while high values can compromise the performance of heat exchangers, requiring optimization [47]. In the mini exchanger of this study, heat transfer occurs in a combined manner, with interaction between conduction, convection, and adjacent channels. Recent research proposes strategies to improve heat transfer, such as asymmetric barriers, fins, mixed-wetting surfaces, and nanofluids. When applied to optimized heat sinks, hybrid nanofluids increase efficiency by up to 72% [49]. Three-dimensional heat exchangers with vortex generators perform superiorly to conventional microchannels [50]. The findings of this study corroborate such advances, with global thermal resistance (\(G_{TR}\)) reduced to 606.6 \(\times\) 10\({}^{-3}\)\({}^{\circ}\)C\(\cdot\)W\({}^{-1}\). Minichannels, operating between laminar and turbulent regimes, exhibit distinct thermal behaviors. Structured geometries and textured surfaces improve dissipation by influencing secondary flow [25].