# Augmented Reality for PCB Component Identification and Localization
## 6 Discussion
As such, future research should validate AR performance in representative industrial settings--integrating more complex PCBs, varied ambient conditions, and extended use durations--to ensure system robustness, ergonomic viability, and sustained task accuracy over time. Overall, this study demonstrates the promise of AR systems like the HoloLens(tm) 2 in supporting non-expert users with guided identification tasks on PCBs. However, traditional methods remain faster and more consistent for experienced users. The variability in AR performance across viewing angles and component types highlights the need for targeted improvements to position AR as a viable complement in real-world workflows. While this study focused on the use of a head-mounted AR device (Microsoft(tm) HoloLens(tm) 2), it is essential to contextualize its performance relative to alternative AR platforms, such as tablet- or phone-based systems. Handheld AR devices are generally more affordable and easier to deploy, making them attractive for broader adoption in field-based or cost-sensitive environments. However, they often suffer from reduced spatial anchoring accuracy, lack of hands-free interaction, and ergonomic challenges during prolonged use, which can limit their effectiveness in precision-critical manufacturing and inspection workflows [49]. In contrast, head-mounted displays like the HoloLens(tm) 2 offer hands-free operation, robust spatial mapping, and immersive visualization, which better align with tasks requiring real-time spatial awareness and uninterrupted manual engagement [50]. Comparative studies have further emphasized that HMDs can lead to improved task performance, reduced error rates, and better user experience in guided assembly contexts due to their enhanced interaction capabilities and spatial fidelity [49]. Furthermore, the integration of such devices supports the human-centric vision of Industry 5.0, where seamless collaboration between digital tools and operators is prioritized [51]. Future research should explore hybrid or mobile-first AR frameworks that balance cost, spatial precision, and user comfort for varying industrial needs. Future research should address both the technical and ergonomic challenges identified here. Priorities include enhancing marker stability through hardware and software advances, improving ergonomic design for prolonged use, and developing onboarding resources tailored to novice users. Design enhancements should follow established AR usability heuristics [39], focusing on visibility, feedback, and cognitive load minimization. Additionally, larger, more diverse participant groups and complex PCB layouts should be included to validate and extend current findings. Another limitation to acknowledge is the unbalanced distribution of component sizes used in this study, which restricts the generalizability of size-related observations. Through iterative improvements and focused research, AR systems can evolve into reliable, efficient tools in electronics manufacturing and beyond, effectively bridging the gap between traditional expertise and emerging digital workflows. The following supporting information can be downloaded at: [[https://www.mdpi.com/article/10.3390/app15116331/s1](https://www.mdpi.com/article/10.3390/app15116331/s1)]([https://www.mdpi.com/article/10.3390/app15116331/s1](https://www.mdpi.com/article/10.3390/app15116331/s1)), Questionnaire S1: Participant Feedback Questionnaire-Experiment 1: Component Identification Using AR and Traditional Methods; Questionnaire S2: Participant Feedback Questionnaire-Experiment 2: AR-Based PCB Identification Using HoloLens 2. Conceptualization, S.S.; methodology, S.S., K.C. and A.R. ; application development: A.R. ; investigation Experiment 1: A.R. ; investigation Experiment 2: K.C. ; data analysis Experiment 1: A.R. and K.C. ; data analysis Experiment 2: K.C. and J.A. ; writing--original draft preparation: K.C. ; writing--review and editing, K.C., S.S. and J.A. All authors have read and agreed to the published version of the manuscript.