## 5 Simulation and Experimental Results Verification
### Deformation Comparison and Verification  
Table 4 presents the experimental and simulated deformation values at four measurement points on the mounting ring under ambient temperature. As shown in the table, the mounting ring exhibits compressive deformation when subjected solely to molding force, and the magnitude of deformation increases proportionally with the applied molding force.  
Table 5 provides the deformation values at four measurement points on the mounting ring under actual working conditions, where both molding force and thermal load are applied. By comparing Tables 3 and 4, it is evident that the mounting ring exhibits expansion deformation under the coupled effects of molding force and thermal load. In this scenario, the influence of thermal load on the deformation of the mounting ring is approximately 5 to 7 times greater than that of the molding force.  
Table 6 presents the experimental and simulated deformation values at three measurement points on the guide ring under ambient temperature. As shown in the table, the deformation of the guide ring is minimal when subjected solely to molding force. Additionally, the deformation change is not significant when the molding force increases from 70 T to 80 T. This is attributed to the large structure of the guide ring and the fact that the measurement points are located on the lower part of its outer surface.  
Table 7 provides the deformation values at three measurement points on the guide ring under actual working conditions, where both molding force and thermal load are applied. By comparing Tables 5 and 6, it is evident that the guide ring exhibits significant expansion  
\begin{table}
\begin{tabular}{c c c c c c} \hline \hline  & \multicolumn{3}{c}{**70 T**} & \multicolumn{3}{c}{**80 T**} \\ \cline{2-7}  & **Test** & **Simulation** & **Error** & **Test** & **Simulation** & **Error** \\ \hline
1 & 0.020 & 0.021 & 5\% & 0.021 & 0.022 & 4.8\% \\
2 & 0.018 & 0.019 & 6\% & 0.020 & 0.021 & 5\% \\
3 & 0.019 & 0.020 & 5\% & 0.019 & 0.020 & 5.3\% \\
4 & 0.020 & 0.021 & 5\% & 0.021 & 0.022 & 4.8\% \\ \hline \hline \end{tabular}
\end{table}
Table 6: Experimental and simulated deformation values at three measurement points on the guide ring under ambient temperature (Unit: mm).  
\begin{table}
\begin{tabular}{c c c c c c c} \hline \hline  & \multicolumn{3}{c}{**70 T**} & \multicolumn{3}{c}{**80 T**} \\ \cline{2-7}  & **Test** & **Simulation** & **Error** & **Test** & **Simulation** & **Error** \\ \hline
1 & \(-\)0.17 & \(-\)0.18 & 6\% & \(-\)0.21 & \(-\)0.21 & 0\% \\
2 & \(-\)0.21 & \(-\)0.22 & 5\% & \(-\)0.24 & \(-\)0.24 & 4\% \\
3 & \(-\)0.16 & \(-\)0.17 & 6\% & \(-\)0.19 & \(-\)0.19 & 5\% \\
4 & \(-\)deformation under the coupled effects of molding force and thermal load, reaching 1.1 mm, which is approximately 50 times greater than the deformation observed under ambient temperature conditions.  
The comprehensive analysis of the above data indicates that the errors between simulated and experimental values under ambient temperature are controlled within 6%. This demonstrates that the simulation model established in this study aligns with the actual working conditions of the mold. Furthermore, thermal loads have a more substantial impact on mold deformation than external mechanical loads, underscoring the critical influence of temperature factors in mold design and operational processes.