## 1 Introduction  
Electrohydrodynamic flow (EHD) [1] caused by corona discharge is the branch of science that studies the movement of a fluid under a non-uniform electric field and develops technology based on these studies. Through the corona discharge, gas molecules near corona electrode are ionized when a high-intensity electric field is applied between a highly curved corona electrode and a ground electrode. There are different corona-discharge configurations according to electrode geometries, the most relevant being wire-to-plane [2; 3; 4], wire-to-cylinder [5], needle-to-plane [6; 7], needle-to-ring [8] or wire/needle-to-grid [9]. Research on corona discharge has been carried out in different media highlighting the investigations in atmospheric air with standard conditions, although more recently, many refrigerants such as R113 [10; 11] R114 [12] R134a [13] have been studied. On the other hand, gases such as nitrogen [14], carbon dioxide, helium or argon [15] were also analyzed. Considering atmospheric air, when the dielectric breakdown of the air is reached (approximately E = \(3\times 106\) V/m), the ionization of the air molecules around the high-voltage electrode induces a corona discharge. Due to the electric field, these ions are subjected to the Coulomb force, creating a movement from the corona electrode to the ground electrode. The set of all these Coulomb forces gives rise to an electrohydrodynamic force field originating in the corona discharge. The presence of the electric field and the multiple collisions between ions and neutral air molecules that are in the area of the discharge produce a fluid flow called \"ionic wind\". This ionized fluid can be used in multiple industrial applications, such as cooling devices [16; 17; 18] and others. In recent years, new advances in electronic systems are producing an increase in the heat flux density generated in equipment. The result of increasing power and miniaturization causes thermal control to be a critical factor in this industry. Due to the generation of local heating areas, these components have a high heat flux for a small heat exchange surface which directly influences the performance of their components. Currently, the microelectronics industry utilizes traditional cooling systems such as rotary fans, heatsinks or heat-pipes. These systems have been valid so far due to their high efficiency, since they represent a mature, well-known and economical technology. However, when the size of these devices is reduced their behavior changes abruptly and, as a result, their performance decreases considerably. In addition, the design of small-scale centrifugal fans and heatsinks, the high manufacturing costs, and the rotation speed are challenges in the industry when it comes to competition and implementation [19; 20; 21]. Therefore, new generation electronic components require alternative cooling systems that can transfer this amount of heat and maintain the useful life and performance of the components. In addition, the requirements demanded by the microelectronic sectors must be achieved to be sufficiently small and noiseless and without adding additional volume or weight to the component. Over the last 10 years, the use of electrohydrodynamic refrigeration has been considered as a technology with potential to replace traditional refrigeration devices due to the large number of advantages it presents and its possible application in several industrial sectors. The first observation on electrohydrodynamic effects took place in 1629 by [PERSON] [22], however, the official discovery of the existence of the EHD force has been attributed to [PERSON] in the 18 th century. Over the new few years, several studies were published by scientists like [PERSON] [23], [PERSON] [24] or [PERSON] [25] who investigated the EHD effect, with [PERSON] [26] being the first to use the term of electric wind.