# Study on Preparation and Processing Properties of Mechano-Chemical Micro-Grinding Tools
## 1 Introduction  
The application of small parts of hard and brittle materials such as single-crystal silicon is increasingly extensive, such as the manufacture of complex surface structure silicon microchannel plates, aspheric microlens molds, and other devices. However, such parts are usually processed with small feature sizes, and the surface quality and dimensional accuracy requirements are very high, usually requiring the surface of the silicon wafer to achieve nanometer roughness while also requiring no damage to the subsurface [1; 2; 3; 4]. Although the current micro-grinding technology can process silicon-based small and complex structural parts, it easily produces cracks, chipping, missing corners, and other damage [5; 6; 7]. Therefore, conducting in-depth research on the efficient and high-precision machining of small parts of complex structures is necessary.  
Mechano-chemical grinding (MCG) technology is an ultra-precision machining method that couples mechanical action and chemical reaction, which was first proposed by the team of [PERSON] of Ibaraki University in Japan [8]. With the proper grinding parameters,MCG technology can produce ultra-high quality surfaces with a surface roughness of Ra < 1 nm [9; 10], and its ground surface quality is comparable to chemical-mechanical polishing (CMP) technology. [PERSON] et al. [11; 12; 13] observed silicon wafers processed by mechanochemical grinding with TEM and found no subsurface damage, proving that MCG can achieve subsurface damage processing under suitable parameters. [PERSON] et al. [14] believed that MCG was a chemical and mechanical interaction process, and only when the two interactions reached a certain equilibrium could a surface without subsurface damage be obtained. When the mechanical action was stronger than the chemical action, a subsurface damage layer of a certain thickness would be produced. [PERSON] et al. [15] used grinding wheels to process silicon wafers with MCG technology, observed the change process of grinding surface morphology and the material removal mechanism of MCG processing, and studied the relationship between material removal rate and surface roughness. The results showed that the MCG process could eliminate the scratches caused by the ordinary grinding process, and the material removal rate decreases with surface roughness. Additionally, MCG technology can eliminate surface defects such as scratches left by diamond grinding wheels on the surface of the workpiece in the previous process. Therefore, it is possible to use diamond grinding wheels for efficient machining with a large margin, and then high-quality machining with MCG to obtain a high-precision surface.  
Although MCG technology can solve the problems of large edge damage and poor surface quality in the processing of small parts, it is mainly used for the backside thinning processing of large-size silicon wafers, and most of the existing research is to analyze the removal mechanism of MCG. It needs more research on micro-grinding tools for mechano-chemical micro-grinding. Therefore, according to the principle of mechano-chemical grinding and the material characteristics of single-crystal silicon, this paper designed and developed mechano-chemical micro-grinding tools, established a theoretical analysis model of grinding force and verified it by experiment, and studied the processing technology and grinding performance of mechano-chemical micro-grinding tools, which made up for the shortcomings of existing research in the field of micro-grinding.