# Timing Analyses in FWE Evaluation
## 1 Introduction
The advantage of the AE method is in predicting delamination rise using one sensor without the demand to estimate AE propagation velocity. This approach is a tough technique for detecting and analyzing the crack length. In [15], the authors presented the negative contribution of a few factors (in terms of skew, losses, dispersion, etc.) that can alter the high-speed design performance. The fiber weave effect is statistical in essence and it is challenging to regulate the timing skew, which is defined as the time difference in the arrival of the signal on a differential pair of routes at the end of it. This evaluation does not mean that, inevitably, a deviation of the skew budget will necessarily cause the system to crush, but the authors concluded that more elaborate modeling and simulation of the channel was needed, as well as compensation of the FWE at the receiver end. In [16], the author described and compared the signal transmission on interconnections with various specifications of the fiber weave, finding various approaches to enhance the FWE effect so that high-speed digital developers have a complete evaluation of it. The author concluded that, for high data rates, better results are obtained by using flattened fiber weaves (such as 1078 and 1035) and NE-glass fiber weaves (such as 2116 NE). Also, ref. [11] suggested using long signal lines parallel to the wert direction or rotating the image with a proper angle. If the fiber weave pitch is not known, an angle of 5 degrees should be considered for proper routing and skewing conditions. The authors of [17] presented the results regarding FWE on PCB substrates and the inflicting problems of high-speed and high-frequency signal integrity on different electronic devices. Better outcomes can be observed when using a 3D printer for high-performance Additively Manufactured Electronics (AME) devices; therefore, the DragonFly LDM is recommended for developing AME. In [18], the authors proposed several ways to improve and avoid issues with resonances and insertion loss dips, by accounting for the skew and ensuring the calculated impedance demand and the precise average dielectric constant for utilization in impedance estimations. In [19; 20; 21], the authors explored the result of using PCB weave on signal integrity in terms of mode transformation and differential channel loss to intra-pair skew. The researchers used Keysight ADS 2 DEM transformations to explore the scattering parameters and eye diagram for signal broadcasting at 1 Gbps and 10 Gbps. They concluded that NE-glass fiber with thick weave such as 3313 should be used in PCB substrate to decrease the attenuation and intra-pair skew. The loss due to fiber weave outcome should be kept below 5%, as additional channel loss impacted by different factors like dielectric loss and cooper surface harshness should be also considered. Using the K supercomputer, examiners have identified a new state of graphene that is being investigated for all kinds of applications. In [22], an assessment was conducted on circuits designed using both microstrip and stripline technologies, calculating the time delay difference between them. The study revealed the detrimental impact of FWE on circuit performance. For better performance, it is recommended to use a denser fabric and a new technique for better spreading out the glass cloth. The authors developed a solution to mitigate the impact of the anisotropic dielectric properties of PCBs. A model was designed in HFSS and signal integrity analysis was executed using IBIS-AMI models in ADS with equalization techniques applied at the receiver. A dielectric material with very good qualities can deliver better performance to the whole system, but the fact needs to be considered that with lower Df there is lower Dk, but the cost of the given substrate increases. In [23], the authors aimed to soften the skew contributed by woven glass of PCB dielectrics, by using a combination of low Dk spread glass, laminated with multiple ply glass.