## 1 Introduction
The reduction in grinding forces is more pronounced when plasma oxidation is employed. Since the ultrasonic cavitation effect can enhance the plasma intensity, the microhardness of the surface oxidized layer is further decreased. Simultaneously, there is a trend of reducing the surface roughness of the machined surface with an increase in vibration amplitude. The application of ultrasonic vibration assistance improves material removal rates, especially with a more significant effect under plasma oxidation conditions. The increase in material removal rates is attributed to a reduction in grinding forces during the vibration-assisted process, which subsequently diminishes deformations in the machining system. In the context of hybrid-assisted grinding of plasma/vibration, it was observed that the chip size became smaller and more granular. The efficient removal of chips from the grinding zone and the reduction of chip adhesion to the grinding wheel can be assisted by this improvement. With the increase in the vibration amplitude, there is a further promotion of chip adhesion reduction [2]. [PERSON] et al. (2009) presented a novel ultrasonic grinding vibration device and established a theoretical model of surface roughness for ultrasonic vibration-assisted grinding. The impact of grinding parameters on the surface roughness was tested, and the micro-surface characteristics and critical ductile cutting depth with and without ultrasonic assistance were analyzed based on the experimental data and atomic force microscopy images. The experimental results indicate that in ultrasonic grinding, the effects of wheel velocity and grinding depth on surface roughness are similar to conventional grinding. A critical ductile cutting depth greater than that of conventional grinding and traditional ZrO2 engineering ceramics was observed. These findings suggested that the use of nano-class scale ultrasonic assistance is feasible for the machining of nano-ZrO2 ceramics [3]. [PERSON] et al. (2019) employed ultrasonic vibration-assisted grinding as a non-traditional machining method for ceramic materials processing. A theoretical analysis of the trajectories during ultrasonic vibration-assisted machining was conducted. On this basis, the removal mechanism of zirconia in ultrasonic vibration-assisted grinding was investigated. Initially, nano-scratching tests with a single abrasive grain were conducted on ZrO2 ceramic material. Experimental analysis revealed that the removal mode (plastic or brittle) of zirconia ceramic changed with increasing loads. Subsequently, based on the scratching tests and kinematic analysis of the ultrasonic vibration-assisted grinding (UVAG), a grinding force prediction model was established and the effectiveness of the model was validated through design experiments. It was observed that the grinding force decreased as the spindle speed and amplitude increased, while the grinding force increased as the feed rate and grinding depth increased. Furthermore, the grinding force significantly decreased in UVAG as compared to conventional grinding (CG). Experimental analysis also indicated an improvement in the surface quality of the workpiece and wear reduction of the grinding head in UVAG as compared to CG [4]. [PERSON] et al. (2010) proposed a comprehensive approach for integrating dynamic modeling and numerical simulation to support the analysis and optimization of the overall machine dynamics and cutting performance during the early design phase. Based on this approach, the process of designing and modeling an innovative five-axis bench-top ultra-precision micro-milling machine was presented. This modeling and simulation encompass the machine structure, moving components, control system, and the dynamics of the cutting process. It was used to predict the overall machine tool dynamic performance for two typical machine configurations, open-frame and closed-frame.