# An FCM-GABPN Ensemble Approach for Material Feeding Prediction of Printed Circuit Board Template
## 2 Variables and Sample
\begin{table}
\begin{tabular}{c c c c c} \hline \hline
**No.** & **Variable Name** & **Symbol** & **Description** & **Value Range** \\ \hline \hline \multicolumn{5}{c}{Overall characteristics} \\ \hline
1 & PCB thickness (mil) & _Pt_ & Thickness of the ordered PCB & 0.3–8 \\ \hline
2 & **Layer number** & _Ln_ & Number of copper layer. & 4–20 \\ \hline
3 & Rogers material & _Ro_ & Whether substrate material is Rogers. & 0/1 \\ \hline
4 & Plating frequency & _Pflr_ & Number of plating operation. & 0–4 \\ \hline
5 & **Number of operations** & _Noo_ &
\begin{tabular}{c} Number of operations to produce \\ the order. \\ \end{tabular} & 16–71 \\ \hline
6 & Number of Prepreg & _NPP_ & Number of Prepreg for lamination & 1–50 \\ \hline
7 & Scrap units in a set & _Sus_ & Allowed maximum scrap units in a set. & 0–8 \\ \hline
8 & Photoelectric board & _Plotb_ & \\ \hline
9 & High frequency board & _Highf\#_ & Whether the order is the specified board. & \\ \hline
10 & Test board & _Semictb_ & 0/1 \\ \hline
11 & Negative film plating & _Nflp_ & Whether the order takes negative film & \\ \hline
12 & Timing copper & _Tinc_ & Whether the order has timing copper. & \\ \hline
13 & IPCIII standard & _IPCIII_ & Whether the order takes IPCIII or Huawei & \\ \hline
14 & Huawei standard & _Huawei_ & standard. & \\ \hline \hline \multicolumn{5}{c}{Feature of internal/outer layer line} \\ \hline
15 &
\begin{tabular}{c} **Minimum line width in internal** \\ layer (mil) \\ \end{tabular} & _Mwil_ & Minimum line width or space in core & 3–100 \\ \hline
16 &
\begin{tabular}{c} **Minimum line space in internal** \\ layer(mil) \\ \end{tabular} & _Mlsil_ & 1–137.66 \\ \hline
17 &
\begin{tabular}{c} **Minimum line width in outer** \\ layer(mil) \\ \end{tabular} & _Mwol_ & Minimum line width or space in outer & 1–157.5 \\ \hline
18 &
\begin{tabular}{c} **Minimum line space in outer** \\ layer (mil) \\ \end{tabular} & _Mlsol_ & 1.2–290 \\ \hline
19 & Average residual rate & _Arcr_ & Average residual rate of copper layer & 0.15\%–94.75\% \\ \hline \hline \multicolumn{5}{c}{Feature and operation information of hole} \\ \hline
20 & Solder resist plug hole & _Srph_ &
\begin{tabular}{c} Whether the order has the specified hole \\ related operation. \\ \end{tabular} & 0/1 \\ \hline
21 & Plug hole with resin & _Pflur_ & Whether the order has the specified hole & \\ \hline
22 & Second drilling & _Sexd_ &
\begin{tabular}{c} related operation. \\ related operation. \\ \end{tabular} & 0/1 \\ \hline
23 & Back drilling & _Bcdr_ & \\ \hline \multicolumn{5}{c}{Operation information of character/solder mask} \\ \hline
24 & Character print & _Chaprt_ &
\begin{tabular}{c} Whether the order has the specified \\ character/solder mask related operation. \\ \end{tabular} & 0/1 \\ \hline
25 & White oil solder mask & _White_ &
\begin{tabular}{c} Whether the order has the specified \\ character/solder mask related operation. \\ \end{tabular} & 0/1 \\ \hline
26 & Blue oil solder mask & _Blue_ & \\ \hline
27 & Black oil solder mask & _Black_ & \\ \hline \multicolumn{5}{c}{Surface finishing operation options} \\ \hline
28 & **Hot-air solder leveling** & _Hasl_ & \\ \hline
29 & **Lead-free hot air solder leveling** & _Lfhasl_ & \\ \hline
30 & **Entek** & _Osp_ & Whether the order takes the specified & 0/1 \\ \hline
31 & **Cu/Ni/Au pattern plating** & _Cnapp_ &
\begin{tabular}{c} Whether the order takes the specified \\ surface finishing operation. \\ \end{tabular} & 0/1 \\ \hline
32 & **Gold finger plating** & Gfig & \\ \hline
33 & **Gold plating** & _Godp_ & \\ \hline
34 & **Soft Ni/Au plating** & _Stap_ & \\ \hline
35 & **Imperson Ag/Sn/Au** & _Isa_ & \\ \hline \hline \end{tabular}
\end{table} 
Table 1: Variables specification. On this basis, 30,117 samples of the orders were collected, multivariate boxplots [2] were conducted to detect the outliers, and, finally, 29,157 samples were left for this study. Performances of the proposed FCM-GABPN are compared to the other five approaches based on the same samples.