# Industrial Soldering Process Simulator
## 1 Introduction  
Compared to real life, simulations are usually cheaper and faster because they require fewer resources or time. Simulations allow you to test different scenarios in a controlled environment, making identifying potential problems and finding the best solutions easier [1]. For example, simulations can help determine the best solder selection configuration to minimize process time and help determine the rest of the parameters of the technology used. However, in industrial processes, using only the simulation process may not be sufficient and lead to erroneous conclusions. Therefore, the hybrid implementation of comprehensive research seems to be an ideal solution. Combining basic research and then, based on its size, developing simulation processes is the optimal solution [2]. One of the basic parameters in bonding processes is knowledge of the interaction processes at the interface of the liquid and solid phases. Their complete identification makes it possible to obtain an optimal result, especially in technologies using bonding materials. The field of modern materials research and their industrial applications requires the development of new measurement methods that can provide precise and quantitative information on the behavior of materials in various technological processes [3]. To create new materials that meet the desired properties for specific usage conditions, modification of material structures is often necessary. However, the challenge often arises in implementing new technologies in production where modern material components must be assembled with traditional ones [4]. Understanding the physicochemical interactions between liquid and solid substances is crucial in various industries such as metallurgy, electronics, and aviation. It is a vital technological factor that plays a significant role in industrial processes. The bonding process primarily relies on wetting the joined surfaces with liquid metal, characterized by two main interfacial impact parameters--the wetting force and the wetting angle. Experiments using the immersion method can be conducted to gather data on the values and behavior of these parameters. Wetting dynamics is a crucial aspect in soldering and joining technologies, as it governs the behavior of molten solder on the surface of the material being joined. Understanding the wetting dynamics of a particular solderingprocess can significantly improve the process's efficiency, quality, and reliability. Here are some ways in which knowledge of wetting dynamics can be used to optimize and customize existing soldering technologies [5; 6].
* Process time and temperature: By understanding the wetting dynamics, reducing the process time and temperature required for the soldering process is possible. This can lead to significant energy savings and reduced production costs.
* Protection atmosphere: In some cases, the presence of oxygen or other reactive gases in the atmosphere can affect the wetting dynamics of the solder, leading to poor adhesion and weak joints. Controlling the atmosphere in which the soldering process takes place makes it possible to improve the wetting dynamics and achieve better results.
* Fluxes: Fluxes are often used in soldering to improve wetting and prevent oxidation of the joined surfaces. Understanding the wetting dynamics can help select the most appropriate flux for the specific materials and process conditions.
* Surface preparation: The surface preparation of the materials being joined can significantly impact the wetting dynamics. By optimizing the surface preparation process, it is possible to achieve better wetting and stronger joints.
* Material and joining technology development: Knowledge of wetting dynamics is essential in developing new materials and joining technologies based on soldering. By studying the wetting behavior of different materials and solder alloys, it is possible to identify new combinations that offer improved performance and reliability.