# Research on Grinding Force of Ultrasonic Vibration-Assisted Grinding of C/SiC Composite Materials
###### Abstract
From the kinematics perspective, it is proved that the UAMEG can reduce the cutting force and temperature, smooth chip removal, extend the tool life, and improve the machining accuracy. It provides model guidance and theoretical support for the actual ultrasonic-vibration-assisted grinding process. Secondly, some scholars have studied the ultrasonic-vibration-assisted grinding force model. [PERSON] et al. proposed a prediction model of grinding force and power based on undeformed chip thickness probability distribution in grinding wheel grinding [16]. They calculated the dynamic cutting edge density based on kinematics and dynamics. The elastic deformation of the grinding contact length was also considered. Through the chip thickness probability distribution, the normal force and tangential force and power of orthogonal test for the total tangential plane grinding force, and normal force and external circular grinding test were carried out to verify the total grinding power prediction model. It is concluded that the model can effectively predict the grinding wheel grinding chip thickness without deformation of the probability distribution of the conclusion of grinding force and power. [PERSON] et al. conducted experiments on the ultrasonic-vibration-assisted grinding technology of dental zirconia ceramics using the single-factor method [17]. They proposed an exponential prediction model, a BP neural network prediction model, and a theoretical prediction model of the UVAG cutting force. The experiments have verified the prediction accuracy of these three models and revealed the cause of the error. The results show that the BP neural network prediction model has higher accuracy than the other two, and the relative error is only 9.60%. In order to reveal the mechanism of reducing grinding force and improving grinding surface quality in the UVAG process, [PERSON] et al. took \"brittle fracture as the main mechanism of material removal in the UVAG process of brittle materials\" as the starting point, and gradually established the mathematical model of system matching in the UVAG process of brittle materials [18]. The mechanism of surface roughness formation in processing brittle materials by UVAG method and how UVAG helps to reduce grinding force were also discussed. The advantages of UVAG method for brittle materials are pointed out theoretically. The model is also used to predict the impact of input variables on the grinding force, which can provide convenience in developing the brittle material grinding force model in the UVAG process and a useful basis for predicting the surface roughness after using the UVAG method. From the above literature review, although there are some research studies on the grinding force of ultrasonic-vibration-assisted grinding, the characteristics of materials have an important influence on the effect of ultrasonic-vibration-assisted machining, especially with regard to the composites with more complex components and structures. In particular, there are few reports on the grinding force research on ultrasonic-vibration-assisted grinding of C/SiC composite materials. In this paper, an ultrasonic-vibration-assisted grinding force of C/SiC composite materials is experimentally studied. A sintered diamond grinding head is used to process C/SiC composite materials using common grinding and ultrasonic vibration-assisted grinding on the same equipment. The grinding force in the machining process is measured, and the variation law of grinding force is analyzed and summarized to grasp the force characteristics and influencing factors in ultrasonic-vibration-assisted grinding of C/SiC composite materials.