# Research on Grinding Force of Ultrasonic Vibration-Assisted Grinding of C/SiC Composite Materials
## 4 Conclusions  
In this paper, the comparative experimental studies of common grinding and ultrasonic vibration-assisted grinding of C/SiC composites are carried out, and the changes in grinding force and grinding force ratio with different processing methods and processes parameters are analyzed. The main conclusions are as follows:  
1. C/SiC composite material has the characteristics of uneven distribution of the matrix materials. The change in material hardness at different positions very easily leads to damage of the tool in the machining test, which will cause unpredictable adverse effects on the subsequent processing. Using UVAG can effectively weaken the influence of such uneven features on the machining and reduce the grinding force's fluctuation range. This trend is more prominent in the end grinding.
2. In the common and ultrasonic-assisted side grinding of C/SiC composites, the grinding speed, grinding depth, and feed speed have similar effects on the grinding force. Still, UVAG can significantly reduce the grinding force. The maximum reduction range of normal grinding force and tangential grinding force is about 25%.
3. UVAG of C/SiC composite material can significantly reduce the grinding force compared with common grinding. The maximum reduction in normal grinding force is about 53%, and the maximum reduction of tangential grinding force is about 40%.
4. By comparing the grinding force ratio of side grinding and end grinding of C/SiC composite materials, it can be seen that during the side grinding, although UVAG can reduce the grinding force, the grinding force ratio is no different from that of common grinding. The grinding force ratio of UVAG during end grinding is significantly lower than that of common grinding, indicating that ultrasonic vibration can soften materials and sharpen cutting to a certain extent through high-frequency impact during end grinding, which greatly improves the machinability of materials.  
Conceptualization, D.W.; writing--original draft preparation, D.W.; writing--review and editing, D.W., H.F., D.X., and Y.Z.; supervision and project administration, D.X. All authors have read and agreed to the published version of the manuscript.  
This research was funded by the National Natural Science Foundation of China grant number (No. 62073017).  
**Institutional Review Board Statement:** Not applicable.  
\begin{table}
\begin{tabular}{c c c c c c} \hline \hline \multirow{2}{*}{**Serial Number**} & \multicolumn{3}{c}{**Parameters Used for Grinding**} & \multicolumn{3}{c}{**Measured Value**} \\  & \(\mathbf{a_{\text{p}}}\) (\(\mathbf{\mu}\)) & \(\mathbf{v_{\text{S}}}\) (\(\mathbf{m}\)/s) & \(\mathbf{v_{\text{W}}}\) (mm/min) & \(\mathbf{F_{t}}\) (\(\mathbf{N}\)) & \(\mathbf{\log F_{t}}\) \\ \hline Condition 1 & 5 & 1.256 & 50 & 0.6018 & \(-\)0.2205 \\ Condition 2 & 5 & 12.56 & 500 & 0.45885 & \(-\)0.3383 \\ Condition 3 & 20 & 1.256 & 500 & 2.2607 & 0.3542 \\ Condition 4 & 20 & 12.56 & 50 & 0.8763 & \(-\)0.05735 \\ \hline \hline \end{tabular}
\end{table}
Table 9: Grinding force test data of end-ultrasonic-assisted grinding.