###### Abstract  
As a powerful solution for heat dissipation in data centers, chip-level cooling continues to capture escalating attention in research and application domains. To accurately analyze system performance, identify potential avenues for system optimization, and inform future practical applications, we developed a steady-state, one-dimensional mathematical model for a novel pump-driven chip-level two-phase cooling system (PCTCS). This model was constructed based on our previous study and was confirmed against existing experimental data. Our simulations scrutinized PCTCS performance under default conditions and investigated the effects of key parameters, such as refrigerant type, condenser vertical positioning, and cooling water temperature. Results showed that the system could manage an 80 W power output from each CPU while maintaining CPU temperatures around 79 \({}^{\circ}\)C at a cooling water temperature of 45 \({}^{\circ}\)C. We discovered the choice of refrigerant had a significant impact on performance, with R32 outperforming R134a and R113. While the vertical position of the condenser influenced the PCTCS's internal parameters, its overall impact on system performance was negligible. Moreover, provided the chip temperature remained within a safe range, our study found that increasing the cooling water temperature improved the energy efficiency ratio of the refrigerant pump and reduced the temperature difference between the chips and the cold source. p 2023 1 3 7472  
numerous researchers have introduced various methods to enhance the efficiency of CRAC systems, such as minimizing hot and cold air mixing, integrating novel evaporative condensers, and using magnetic levitation compressors [9; 10], the heat transfer capabilities of air are inherently inferior to that of liquid [11; 12]. Furthermore, a liquid cooling system can minimize the heat transfer pathway and lessen the temperature disparity between the hot and cold sources. This extends the effective use period of the natural cooling source, resulting in a considerable reduction in the energy demands of the cooling system [13]. Consequently, liquid cooling systems generally demonstrate higher efficiency when compared to CRAC systems [14]. Presently, CRAC systems primarily employ fans for chip cooling [15]. In a bid to augment cooling efficiency, researchers have suggested numerous liquid cooling methods for chips, including immersion liquid cooling, single-phase water cooling, spray liquid cooling, and two-phase cooling [16]. Among these solutions, using micro heat exchangers for two-phase heat transfer stands out. This method can serve as an effective thermal management strategy, offering a compelling alternative to air cooling solutions [17]. The two-phase flow boiling of the R134a refrigerant in a copper multi-microchannel heat sink, typically used for cooling microelectronic central processing units (CPUs), was scrutinized by [PERSON] et al. [18]. They manipulated the base heat flux in a range of 2.57 to 189 W/cm\({}^{2}\) and the mass flux from 205 to 1000 kg/m\({}^{2}\)s, maintaining a nominal saturation temperature of 63 \({}^{\circ}\)C. They found that with a coolant flow rate of 1000 kg/m\({}^{2}\)s and no inlet subcooling, the heat transfer coefficient could achieve up to 2.7 \(\times\) 10\({}^{5}\) W/m\({}^{2}\)K (with respect to the base area), keeping the chip temperature at 85 \({}^{\circ}\)C and attaining a maximum pressure reduction of 94 kPa. Their investigations also indicated an increasing heat transfer coefficient with heat flux, showing no dependency on the mass flow rate. [PERSON] et al. [19; 20] proposed two unique on-chip two-phase cooling systems, each powered by a liquid pump and a compressor, respectively. These systems were furnished with dedicated controllers for regulating outlet vapor quality, condensing pressure, and the temperature disparity between outlet water flow and the inlet working fluid flow in the condenser.