## 5 Discussion  
Dynamic Effect of Heat Generation and Heat Dissipation of Conductor Structures Under Extreme High-Ampergage Condition  
As shown in Table 4, the current-carrying durations of different conductor configurations were compared using both simulation and experimental data. To ensure a conservative and reliable interpretation, the minimum experimental values in each group were selected to account for measurement variability. This comparison highlights the performance differences among the configurations and provides insight into the reliability of the simulation model. The T2 configuration exhibited the longest current-carrying duration in both simulation and experimental results, which confirms the effectiveness of the proposed structural optimization. Although the experimental values for the C0 and T1 groups were higher than their simulated counterparts, this is likely attributed to the simplifications and idealized conditions within the model. Nevertheless, the consistent trend across all configurations indicates that the simulation model has practical predictive value and offers meaningful guidance for optimizing conductor structures under extreme high-current conditions. As shown in Figure 11, which compares the simulated temperature rise curves over time for unthickened and thickened connecting pieces, increasing the cross-sectional area of the conductor structures effectively reduces the temperature change rate and extends the current-carrying duration under high-ampergage conditions, given a fixed welding area. The cross-sectional area directly influences the resistance of the connecting piece, thereby reducing Joule heating and affecting the overall temperature variation. However, the observed increase in current-carrying time remains limited. This is due to the nature of kiloampere-level currents, which behave differently from conventional high currents. Under such extreme conditions, Joule heating is significantly amplified, leading to rapid temperature surges. Therefore, to achieve a substantial improvement in current-carrying time, heat dissipation must also be optimized. In other words, increasing the contact area between conductor structures is essential for enhancing heat dissipation efficiency and mitigating thermal buildup. \begin{table}
\begin{tabular}{c c c} \hline
**Configuration Group** & **Test Current-Carrying Time (s)** & **Simulated Current-Carrying Time (s)** \\ \hline \multirow{3}{*}{Control Group (C0)} & 0.75 & \multirow{3}{*}{0.44} \\  & 0.98 & \\  & 0.79 & \\ \hline \multirow{3}{*}{Test Group 1 (T1)} & 0.80 & \multirow{3}{*}{0.68} \\  & 1.2 & \\  & 0.95 & \\ \hline \multirow{3}{*}{Test Group 2 (T2)} & 1.73 & \multirow{3}{*}{1.73} \\  & 1.89 & \\ \cline{1-1}  & 1.74 & \\ \hline \end{tabular}
\end{table} 
Table 4: Current-carrying time for different conductor configurations. The comparison of simulated temperature rise curves over time between unconfigured and configured welded reinforcement structures is shown in Figure 12. Building upon the demonstration in Figure 11, the welded reinforcement structural part effectively expands both the contact area and cross-sectional area between the conductor structures. The increased contact area at the same instantaneous temperature enhances heat dissipation efficiency, significantly delaying the temperature rise and reducing the rate of temperature change [53]. Consequently, the current-carrying time is notably extended. Figure 11: Comparison of temperature rise curves over time between unthickened and thickened connecting piece. Figure 12: Comparison of temperature rise curves over time between unconfigured and configured welded reinforcement structural part. According to the experimental verification data, as shown in Figures 9 and 10, the change in the contact area between the conductor structures directly affects the change in the cross-sectional area of the current-carrying and the heat dissipation area, which improves the heat dissipation area between the conductor structures and strengthens the effectiveness of electron transport.