## 3 Results and Discussions  
For verification of the numerical model, the temperature calculations were compared with the experimental measurements from [PERSON] et al. [37] at the point located 4 mm away from the deposition line. They measured temperature profiles using K-type thermocouples (diameter 80 mm) for experiments. Following the experiment setup, the deposition speed was set to be 45 cm/min. More details on the experiment setup are available in [37]. As shown in Figure 4, the temperature profiles from the simulation and experiment are in good agreement with each other. In the WAAM process, the localized heat source energy is applied to the wire, leading to an inhomogeneous thermal gradient. That could affect the thermal profiles of the AM deposition such as the temperature distribution and cooling rate. To investigate this issue further, the time evolution of temperature distributions for the different deposition strategies were analyzed as shown in Figure 5. It is worth noting that the alternate and raster patterns follow discontinuous parallel lines with multiple starts and ends. The in-out and out-in patterns consist of continuous spiral depositions. These continuous contours allow the number of tool-path passes to be reduced. However, the in-out and out-in require a large number of turns, which could produce excessive heat input in a small region at the beginning and end of the deposition, respectively. Therefore, in the case of spiral-type patterns, the more concentrated heat energy is applied to the substrate than the line-type patterns due to such characteristics of the scanning paths. As shown in Figure 5, the alternate pattern has the smallest region whose temperature is greater than 390 \({}^{\circ}\)C (green contour) among the deposition pattern considered. This can be explained  
Figure 4: Comparison of the temperature calculations in the present study with the experimental measurements. Figure 3: The FE model used in the present study. The model consists of the substrate (260 mm \(\times\) 260 mm \(\times\) 25 mm) and the deposition layer (120 mm \(\times\) 120 mm \(\times\) 6.0 mm). by the deposition interval between each scanning, which promotes the heat transfer to the surroundings. It is worth noting that the raster is also the line-type scanning pattern, which is the same as the alternate pattern. However, it scans without an interval, which results in a higher thermal gradient than the alternate scanning case. In order to analyze the effects of the deposition pattern on thermal profiles, the temperature history at the center of the deposition layer is analyzed and plotted in Figure 6. Among all the patterns considered, the out-in case has the highest peak temperature. The values of the peak temperature for the raster and the alternate are similar to each other. The in-out case shows the lowest value of peak temperature. As shown in Figure 5c, a circular symmetric temperature distribution is formed in the out-in pattern deposition. This is mainly because heat is concentrated toward the center of the deposition layer, leading to the highest peak temperature. On the contrary, in case of the in-out pattern, heat is dispersed during the deposition. Figure 6 also shows that the difference in the peak temperature between the alternate and the raster patterns is negligible. Note that the alternate pattern has an interval between the deposition while the raster does not. Analysis suggests that the interval between each deposition has no significant effect on the thermal profiles. Figure 7 shows the Mises stress in the diagonal direction for the different deposition patterns. High levels of stress are generated at the corner of the deposition layer for all cases considered. The out-in pattern case leads to the highest residual stress throughout the deposition path and its maximum value was calculated as 235 MPa. Such value is from 16% to 27% higher than other pattern cases (in-out: 27%, altyernate:19%, raster: 16%).