## 4 Analysis and Discussion of Results
### Critical Considerations on the Dissipation Phenomenon in the Prototype  
The prototype developed yielded significant results concerning heat dissipation in mini heat exchangers used in electronic components, enabling a critical analysis of the factors most influencing thermal performance. In terms of practical application, this study investigates various residential processors with a Thermal Design Power (TDP) of 65 W, a value attained only under maximum load conditions. During light tasks, power consumption typically decreases to approximately 30 W. Inadequate cooling of a processor can result in performance degradation or even failure, as documented in the literature [1; 43]. Among the operational parameters evaluated, electrical power stood out as the most relevant factor in estimating \(G_{TR}\). Increasing power from 30 W to 65 W resulted in an approximate increase of 25 \(\times\) 10\({}^{-3}\)\({}^{\circ}\)C\(\cdot\)W\({}^{-1}\) in \(G_{TR}\) (Table 6), a behavior that can be attributed to the higher thermal flux density under high power conditions. This impact had already been identified in previous studies, which highlight the direct relationship between high power and increased \(G_{TR}\)[10; 12]. To mitigate this effect, optimized configurations, such as the use of modified surfaces or nanostructures, represent promising opportunities for future improvements [12]. This study investigates methods to enhance cooling and identifies optimal thermal performance conditions within the analyzed range. Two studies on the thermal performance of heat exchangers, employing factorial analysis and the design of experiments, showed that a higher Reynolds number enhances heat transfer, which is consistent with previous research [10; 44]. The experiment confirmed that the Reynolds number remained within the laminar regime, where heat transfer is mainly limited by weak convection and dominated by conduction within fluid layers that exhibit minimal mixing. However, at higher Reynolds numbers--under a heat transfer rate of 65 W and elevated ambient temperatures--a  
Figure 14: Behavior of the outer wall temperature, power supply, and the ambient temperature. significant reduction in thermal resistance was observed. This suggests a transition from a laminar to a transient flow, influenced by factors such as decreased fluid viscosity due to increased temperature and the heat sink's channel geometry, which features interrupted fins that generate localized vortices. In the transient regime, enhanced fluid mixing leads to improved heat exchange via convection compared to the laminar regime. On the other hand, although ambient temperature was not statistically significant for the \(G_{TR}\), it proved to be a key factor in enhancing the heat transfer coefficient (\(h\)). Under the operating conditions and intervals of the experiment, one viable strategy for improving heat dissipation is to increase the heat transfer coefficient (\(h\)) [7,45]. This approach would help mitigate the rise in power of the electronic component from increasing \(G_{TR}\). The temperature increase from 22 \({}^{\circ}\)C to 29 \({}^{\circ}\)C resulted in an average improvement of 33.46 W\(\cdot\)m\({}^{-2}\cdot\)\({}^{\circ}\)C\({}^{-1}\) (Table 6), which is consistent with studies indicating that higher temperatures reduce fluid viscosity, thereby optimizing the thermophysical properties of the system [10,23]. Another key observation is the impact of ambient temperature. The studied range suggests that higher ambient temperatures, which in turn raise water temperature, can enhance the heat transfer coefficient. This is supported by [PERSON] et al. [46] who demonstrated through a numerical study that increasing a fluid's temperature reduces its viscosity while improving thermal conductivity, ultimately enhancing the heat transfer coefficient (\(h\)).