## 1 Introduction
These are the \"Short-time (rapid-rise) test\" in the 10 th section of IEC 60243-1, the \"20 s step-by-step test\" in IEC 60243-1, the \"Slow rate-of-rise test\" in the relevant section of IEC 60243-1, and the Multi-Level Method, in IEC 60060 [28]. In recent years, the interest in 3D printed materials has increased due to their potential to transform the electrical and electronics industry. Conductive and insulating materials produced with 3D printing allow for the creation of materials and devices with the properties required by the industry. In this context, 3D printing (3 DP) technologies accelerate prototyping and facilitate the creation of complex shapes and geometries that are difficult to achieve with traditional manufacturing methods [9]. Multilayer or additive manufacturing technologies have begun to be used as technologies that offer new possibilities for producing customized equipment that is tailored to needs, including conductive and insulating materials. In addition to analyzing numerical values to interpret breakdown voltage or breakdown strength measurements, image processing and inspection technologies have also become increasingly common in recent years. The term image classification simply refers to the process of identifying an unknown object within an image as belonging to a particular group from a set of possible object groups [29]. The field of image processing, in a broad sense, deals with the processing of data that are two-dimensional in nature. Image processing techniques find applications in many areas, especially image enhancement, pictorial image recognition, and the efficient coding of images for transmission or storage [30]. Computer image processing-based methods are being investigated as an alternative to provide solutions for practical measurement, identification, and size distribution analysis [31]. Imaging technology is progressing rapidly, making imaging more affordable, faster, and more sensitive, which drives the need for advanced image processing and analysis techniques. A variety of software is available, ranging from commercial to academic and specialized applications, but accessibility is the most crucial feature for scientific research software. Open-source software is particularly well-suited for scientific studies because it allows for free examination and modification. The open-source platform ImageJ is widely used for this reason, as it is freely accessible [32]. It also runs on major operating systems on the market and is also an open-source image analysis software for processing materials [32]. ImageJ is highly useful for calculating the area, perimeter, or shape of solid objects with defined boundaries [33]. The software allows for a detailed examination of area ratios for different colors within images. In this study, the behavior of solid insulation materials, which can be fabricated using 3D printing technology, was analyzed under high-voltage conditions within the framework of insulation coordination. In this context, PLA, ABS, ASA, PETG, and PC/ABS materials, which are currently used or have potential for use as electrical insulation, were selected. The breakdown strengths of solid insulation materials produced with 3D printing were measured in a high-voltage laboratory within the scope of IEC-60243. The Weibull distribution of the results obtained from the breakdown strength tests was analyzed. The damage analysis of the breakdowns occurring in the test specimens was evaluated in detail with ImageJ software. With the comparative analysis, the behavior of PLA, ABS, ASA, PETG, and PC/ABS solid insulation materials was revealed and their superiority over each other was determined. The results obtained within the scope of the study were presented in terms of 3D printing and breakdown strength parameters of the materials.