## 2 Literature Review and Research Question  
This section will present, first, an overview of MMS in the context of individualization and, second, tailoring of the EDP. Micro-mechatronics deals with the fabrication of integrated, movable microstructures with electronic components within a 0.1-1000 \(\upmu\)m size range [20]. Another field of MMS is system integration. This means the connection of different MMS components to a complete intelligent system [21; 22], whereby the complete system exceeds the micro range, for example, intelligent individual implants in medical technology or intelligent connecting elements in the industrial sector with individualized geometries. The latter is demonstrated in this article in detail as a real case study. Within the many advantages achieved through MMS, their main and most important feature lies in miniaturization [21; 23]. In order to meet this purpose and to be able to offer a high degree of freedom when it comes to designing complex products, MID technology is recommended [24; 25; 26]. Furthermore, MID offers various technological features that go beyond classical printed circuit board (PCB)-based assemblies. Therefore, this technology should be described in more detail as follows. MID are generally defined as injection-molded plastic substrates that contain conductive circuit patterns and integrate both mechanical and electrical functions [12]. In combination with laser direct structuring (LDS), MID offer the possibility to design electrical and mechanical components on three-dimensional surfaces to increase functionality and integration levels and to reduce costs. For example, transmission lines, antennas, switches and connectors can be integrated on carriers such as the covers of mobile phones or the housings of car wing mirrors [27; 28]. In contrast to classically manufactured electronic assemblies, MID technology enables the functionality of the entire component through freedom of design [24; 25; 26]. MID can be geometrically classified into four categories: 2D (planar process surface), 2.5D (plane-parallel process surface), n \(\times\) 2D (process surfaces in angular position) and 3D (free-form surfaces, ruled surfaces) [12]. Thus, MID technology is a suitable technology for iMMS. However, the main and starting process of MID for manufacturing the 3D substrate is the injection-molding process [12; 25]. Due to the injection-molding process, cost-intensive tools must be manufactured. These costs cannot be defrayed for small batch sizes, and thus, the use of MID is not economically feasible for individualized MMS. Consequently, it is worth considering the application of DMT, such as rapid tooling. There are very few rapid tooling application examples for the production of MID [29]. This is probably why there is a lack of an EDP within the context of iMMS based on MID technologies. However, a contextual EDP is an important requirement for successful project management [30; 31; 32]. There are various sources available that discuss the influence of relevant contextual factors within the EDP. It is generally recognized that there is a need to adapt a process model such as an EDP to the circumstances of a project or other contextual factors [33; 34; 35; 36; 37; 38; 39]. Therefore, several papers that deal with the contextual adaptation of the EDP can be found. [PERSON] and [PERSON] give a general overview of existing tailoring approaches [40]. From this overview, one can conclude that the relevant approaches to support process tailoring are mainly in the field of software engineering. Thus, [PERSON] and [PERSON] suggest that a tailoring approach for interdisciplinary engineering design is desirable [40]. In addition, only one tailoring approach could be identified that is based on case studies. This approach, by [PERSON] and [PERSON], is also specialized for software engineering [41] and uses the case-based reasoning (CBR) technique to tailor software development projects. A CBR technique is used to find structural similarities with different characteristics [42].