## 1 Introduction
Similar results were also obtained by [PERSON] and [PERSON] and [PERSON] (2018) and [PERSON] et al. [PERSON] et al. (2018), who investigated the impact of adherenol roughness in addition to epoxy adhesive layer thickness. However, some research indicates even lower values of the optimal thickness. In their study, [PERSON] et al. [PERSON] et al. (2018) identified an optimal epoxy adhesive thickness of 0.03 mm and noted a significant reduction in strength when the adhesive thickness falls below 0.01 mm. A critical phenomenon associated with bonding is the volumetric shrinkage of the adhesive during curing. This is particularly significant in precise and optical applications, where shrinkage can lead to tilt or displacement of optical elements ([PERSON] et al., 2018) or induce stresses inside the optical elements, degrading the imaging quality of the optical instrument ([PERSON] and [PERSON], 2018). UV-cured adhesives are often preferred due to their nearly instantaneous curing ability, which is especially valuable in assembling micro-optical systems ([PERSON] and [PERSON], 2018). [PERSON] et al. [PERSON] et al. (2018) presented soldering as a possible alternative to bonding lenses with the benefit of lower residual stress values. [PERSON] et al. [PERSON] et al. (2018) addressed the bonding procedure for assemblies requiring accuracy below 1 \(\upmu\)m. Their approach involves compensating for shrinkage effects by precisely dosing and measuring the shrinkage of a specific batch of adhesive. This is because shrinkage is affected not only by the specific batch of adhesive (owing to variations in raw materials) but also by the adhesive's age. For successful automation, both influences must be quantified. During the experimental phase, [PERSON] observes differences in shrinkage of up to 5% for one of the adhesives. To automate this process, accurate volumetric dosing and measuring the shrinkage before a given adhesive batch is always necessary ([PERSON] et al., 2018). A different approach to precision bonding is presented by [PERSON] et al. [PERSON] et al. (2018) focusing on bonding silicon wafers. They suggested employing friction elements to prevent the wafer from sliding during adhesive curing. Through this method, they consistently achieved an accuracy of 5 \(\upmu\)m, surpassing the 15-50 \(\upmu\)m accuracy typically attained using commercially available add-ons. The potential integration of carbon nanotubes (CNTs) represents a promising avenue for enhancing various aspects of composite materials. Carbon nanotubes are renowned for their exceptional mechanical properties and thermal conductivity, rendering them valuable candidates as reinforcing phases in adhesives for optical devices and precision bonding applications. Recent studies by [PERSON] and [PERSON] [PERSON] and [PERSON] (2018); [PERSON] and [PERSON] (2018); [PERSON] and [PERSON] (2018) as well as previous works by [PERSON] and [PERSON] (2018); [PERSON] and [PERSON] (2018); [PERSON] and [PERSON] (2018) have explored the nonlocal behavior of CNTs, demonstrating their unique mechanical characteristics. In the realm of thermal properties, CNTs exhibit remarkable thermal conductivity [49]. Additionally, CNTs have garnered attention in the field of flexible electronics and advanced packaging materials [50], showcasing their versatility in various applications. Furthermore, CNTs have been the subject of extensive research in the field of electrical conductivity within polymer nanocomposites. The work of [PERSON] et al. [51] underscores the potential for improved electrical properties when CNTs are integrated into composite materials. Moreover, the ultra-high optical absorption efficiency of multi-walled carbon nanotube ensembles [52] suggests their potential for use in optical instruments.