# A Review of Data Mining with Big Data towards Its Applications in the Electronics Industry
## 4 Data Mining with Big Data Applications in the Electronics Industry
### Application of DM with Big Data in Different Stages
#### 4.2.1 Application of DM and Big Data for Design  
The design stage includes the product design followed by process planning. Product design is to create a new product while process planning is to translate product design requirements to manufacturing process details that act as a bridge between product design and manufacturing. [PERSON] [14] presented a review of the data analysis and machining learning for the design process yield optimization in electronic design and semiconductor manufacturing. Another 17 articles related to DM application in the stage of design have been retrieved and summarized in Table 9, and the following findings can be achieved: \begin{table}
\begin{tabular}{c c c c} \hline \hline
**Knowledge Area** & **Sub-Areas** & **Description** & **Applied Stage** \\ \hline \multirow{6}{*}{QI [4]} & \multirow{2}{*}{Quality classification} & (1) Identifying attributes that affect quality significantly; & \\  & & (2) Comparing the end result of the whole process with the & \\  & product/process & desired specifications, analyzing the root causes of low yield & \\  & & & for adjusting the process parameters to ensure future quality & \\  & & [102], and we call it as post hoc (fault) diagnosis here. & \\  & & & For a given set of input parameters, predicting the class of the & Design and \\  & & & quality output. & \\  & & & Predicting what the resulting quality (yield) characteristic will & \\  & & & be for a given set of input parameters or process values. & \\  & & & Based on the learned features of the cases, yielding & \\  & & & high-quality and finding optimal levels of process/product & \\  & & & parameters that consistently yield target performance. & \\ \hline DTCE & - & Predicting the development time and/or cost. & Design stage \\ \hline \multirow{6}{*}{PMO} & Scheduling & Scheduling optimization or dispatch rules selection. & \\  & Production time & Predicting the production time (cycle time/lead time/due or & \\  & prediction (PTP) & complete date). & \\  & Resource optimization & Resource allocation optimization. & \\ \hline \multirow{6}{*}{AEC/APC [4, 11, 86]} & Fault detection and & Fault detection (FD) is to monitor and analyze the variation in & \\  & classification & equipment, tool or process data and detect anomalies, and the & \\  & & fault classification is to determine its root cause. & \\  & & & Modifying recipe parameters or the selection of control & \\  & & parameters between runs to improve performance. & \\  & & Prediction of post-process metrology variables using process & \\  & & and wafer state. & \\  & & Equipment health & Monitoring tool parameters to assess the tool health as a & \\  & monitoring (EHM) & function of deviation from normal behavior. & \\  & & & Using statistical methods to analyze processes or products to & \\  & & & take appropriate actions to achieve a state of statistical control & \\  & & and continuously improve the process capability. & \\ \hline \multirow{6}{*}{CRM [3]} & Customer identification, & \multirow{2}{*}{Analyzing and understanding customers’ behaviors and } & \multirow{2}{*}{Sale, service and, recycling stage} \\  & attraction, retention, and & & characteristics. & \\ \cline{1-1}  & development & & DM application for the management of the flow of goods and & \\ \cline{1-1}  & & & services & \\ \hline \hline \end{tabular}
\end{table} 
Table 8: The knowledge areas of DM application in the electronics industry. (1) The quality improvement of product design [28], the prediction of development cost and time [34; 37], and the product customization [38; 42] are the main applications of DM in product design. (2) The optimization of the manufacturing process parameter is the main task of process planning, such as the parameter optimization of stencil printing process (SPP) [26; 27; 36], reflow soldering [29; 31; 32], fluid dispensing for microchip encapsulation [33], wave soldering [35; 41], and hot solder dip [39] for component surface mounts on PCBs.