# TFBN: A Cost Effective High Performance Hierarchical Interconnection Network
## 6 Some Generalization  
Many interesting applications and grand challenging problems are discussed in the Introduction. To solve those problems, we need an MPC system. In addition, the success of an MPC system heavily depends on the reliable and suitable interconnection network. The reliability and suitability of an interconnection network topology are analyzed and assessed from different points of views for the consideration of its pragmatic realization. The very first step of the evaluation of an interconnection  
Figure 5: Comparison of static time cost-effective factors of various interconnection networks considering different values of \(\rho\) (**a**) network size 256 nodes; (**b**) network size 4096 nodes. network is the assessment of its graph-theoretic properties known as static network performance. These static network performance parameters revealed whether the proposed interconnection network will result in a good performance or not in other aspects. For example, node degree indicates the cost of a router used in a node; and each node requires a router. Therefore, the cost of an MPC system depends on the node degree and wiring complexity. The low value of node degree and less wiring complexity clearly indicate the lower manufacturing cost of an MPC system. A low value in the distance parameter such as diameter and average distance indicates the possibility to have good dynamic communication performance. The lower hop distance parameter (low diameter and average distance) results in low latency and high throughput. The actual fault tolerance of an MPC system depends on the reconfiguration and routing with redundant resources. However, the ratio between the arc connectivity and node degree results in the static fault tolerance performance. The higher the ratio, the better the fault-tolerance of that network. The proposed TFBN results in significantly low diameter and average distance and reasonably better fault tolerance with the detriment of high node degree and wiring complexity as compared to other networks considered in this paper. However, the static cost (as portrayed in Table 2) of the TFBN is lower than that of other networks. The feasibility and cost-effectiveness analysis are also imperative for the consideration of any new interconnection network topology. Static assessment and evaluation of cost-effectiveness along with the cost-performance trade-off factor without any capital expenditure are the good criteria to compare and contrast any new interconnection network with other contemporary networks [38]. The better performance in this static evaluation will instigate the next level of investigation for the suitability of the proposed network. As depicted in this paper, the cost-effective factor and time-cost effective factor of the proposed TFBN are lower than all of the networks, especially \(\rho=0.3\) and onward. In addition, the cost performance trade-off factor of TFBN is appreciably higher than all the interconnection networks. The initial investigation instigates us for further exploration of the proposed TFBN; and the static hop distance parameters signify that the dynamic communication performance will also be better in terms of low message latency and high network throughput. However, it seems that TFBN will reveal good performance and will be a good choice for the next generation MPC system to overcome the challenging problem. The only shortcoming is the high wiring complexity. Many short length links in the basic module and their layout in the chip will incur a bit more power consumption. The chip-level layout of these links and the reduction of the capacitive effect between two links can reduce this extra power consumption. The main concept and contribution in the paper is a new HIN called TFBN and its static network performance and cost-effective performance evaluation. With respect to static network performance and cost effective performance evaluation and analysis, the proposed TFB is superior to other conventional and hierarchical interconnection networks.