# Research on Grinding Force of Ultrasonic Vibration-Assisted Grinding of C/SiC Composite Materials
###### Abstract  
C/SiC composite material is the best choice for important parts such as the hot-end structure of aerospace vehicles. Research and optimization of the cutting force of ultrasonic vibration-assisted grinding are of great significance when it comes to revealing the machining mechanism of C/SiC composites and realizing low-damage and efficient machining. In this paper, the comparative experimental study of ultrasonic vibration-assisted grinding and common grinding of C/SiC composites is carried out; the variation laws of grinding force and grinding force ratio with different machining methods and process parameters are analyzed, and the empirical formulas of ultrasonic-assisted grinding are summarized. The research results show that ultrasonic vibration can soften C/SiC materials and sharpen the cutting to a certain extent through the action of high-frequency impact, greatly reduce the value of the grinding force, and improve the machinability of the material. Thus, ultrasonic-vibration-assisted grinding processing is an effective method to achieve high-efficiency and low-damage processing of C/SiC composites. C/SiC composite; ultrasonic vibration; grinding force +
Footnote †: journal: Applied Sciences  
how to reduce the processing damage of C/SiC composites, improve the processing efficiency, and ensure the processing accuracy has become a bottleneck problem in engineering applications that urgently needs to be resolved. Grinding is a suitable method for processing high-hardness and high-brittleness materials. The grinding wheel with high machining accuracy, small surface roughness, and self-sharpening has a strong removal effect on high-hardness and high-brittleness materials, so it is used in processing materials similar to C/SiC composite materials. In recent years, the ultrasonic-vibration-assisted grinding (UVAG) method has been used increasingly often to process high-hardness and high-brittleness materials such as ceramics and ceramic matrix composites. Scholars have conducted many theoretical and experimental studies on grinding wheel wear [7; 8], abrasive particle motion trajectory [8; 9; 10], and processing damage formation mechanism of ultrasonic vibration-assisted grinding [11; 12]. The results show that ultrasonic vibration is conducive to reduce cutting force and tool wear [13; 14], and the processing efficiency is improved to 6\(\sim\)10 times that of common grinding [15]. At the same time, some scholars have carried out modeling, simulation, experiments, and other related research on the cutting force of ultrasonic-vibration-assisted grinding. Firstly, some scholars analyzed the kinematics of ultrasonic-vibration-assisted grinding, and summarized the kinematics principle that ultrasonic-vibration-assisted cutting can help to improve machining accuracy and surface quality. [PERSON] et al. studied the kinematic characteristics of a two-dimensional vertical ultrasonic-vibration-assisted grinding method [10]. They established a consistent physical model of the ultrasonic-vibration-assisted grinding process based on a kinematics equations to study the interaction between a single abrasive particle and the workpieces. A simulation proved that with the assistance of ultrasonic vibration, the grinding path of the particle becomes longer. The material removal rate of each particle has been improved. In addition to modeling and simulation analysis, they also conducted an ultrasonic-assisted grinding experiment using polysilicon, which proved that the assistance of ultrasonic vibration could indeed change the grinding mechanism of brittle materials. In addition, [PERSON] et al. proposed an ultrasonic-assisted micro end grinding (UAMEG) processing method [9]. They also modeled and simulated the trajectories of two adjacent abrasives, analyzed their kinematics mechanism, and obtained the mathematical critical conditions for the separation of high-frequency abrasive workpieces. The effect of frequency coefficients was studied via the kinematics.