###### Abstract  
In this paper, package integration of glass-based passive components for 5G new radio (NR) millimeter-wave (mm wave) bands and an analysis of their system performance are presented. Passive components such as diplexers and couplers covering 5G NR mm wave bands n257, n258 and n260 are modeled, designed, fabricated and characterized individually along with their integrated versions. Non-contiguous diplexers are designed using three different types of filters, hairpin, interdigital and edge-coupled, and combined with a broadband coupler to emulate a power detection and control circuitry block in an RF transmitter chain. A panel-compatible semi-additive patterning (SAP) process is utilized to form high-precision redistribution layers (RDLs) on laminated glass substrate, onto which fine features with tight tolerance are added to fabricate these structures. The diplexers exhibit low insertion loss, low VSWR and high isolation, and have a small footprint. A system performance analysis using a co-simulation technique is presented for the first time to quantify the distortion in amplitude and phase produced by the fabricated passive component block in terms of error vector magnitude (EVM). Moreover, the scalability of this approach to compare similar passive components based on their specifications and signatures using a system-level performance metric such as EVM is discussed. 202517  
machine-type communication (mMTC) are the three use-cases of the 5G air interface. Hardware-level implementation of these use-cases relies on the heterogeneous integration of antenna arrays and active and passive devices as one of the key enabling technologies for the next generation of radio solutions such as 5G new radio (NR) [3; 4; 5]. Increased path loss with higher operating frequencies such as 5G mm wave bands requires the use of directed communication to provide Gb/s data rates with high fidelity and low latency. Antenna-in-package (AiP) architecture is almost universally sought for all 5G applications such as user equipment (UE), customer premises equipment (CPE) and base-stations [6; 7; 8; 9]. The research and development in this area has fueled many breakthroughs in related primary and auxiliary technologies, particularly for 5G NR mm wave applications. Specifically, integrating phased arrays in packages poses challenges such as increased complexity and reduced thermo-mechanical reliability,leading to the co-design of passives, ICs and antenna elements [10]. Understanding the system-level specifications and translating them to IC-, package- and component-level requirements can aid in achieving a faster time to market [11]. A cross-section of a modern 5G module with broadband and/or an end-fire antennas is shown in Figure 1. Heterogeneously integrated active and passive components along with high-density layers for digital routing and low-loss, seamless interconnects are key features of this glass-substrate-based module. Implementation on LTCC and organic substrates results in fundamental limitations to achieving high-precision sub-micron features with tight tolerance. Traditional RF passive components and substrates use low-temperature co-fired ceramic (LTCC) technology, which involves multiple layers of ceramic and copper. This mature technology is common in industry for passive components and RF FEMs. However, due to limitations in terms of thickness reduction and scalability to the panel level, LTCC has been surpassed by multilayer organic laminate substrate technology. These organic laminates are popular due to their low cost, ease of processing and large panel manufacturing. They also allow the integration of multiple chips in the same package, increasing functional density and performance while reducing costs. However, organic laminates fall short of miniaturization requirements for emerging electronics, particularly for 3D architectures.