## 3 Thermogravity Differential Thermal Analysis (TG-DSC) and Heating Curve  
Since the ceramic green bodies contain photosensitive resin and other polymeric binders, a precise high-temperature sintering process needs to be developed. Prior to sintering, TG-DSC analysis (as shown in Figure 1) was conducted on the ceramic green bodies to establish a debinding and sintering curve (as shown in Figure 2). A small sample was placed in a thermogravimetric-differential thermal analyzer (equipment model: Shimadzu DTG-60H, Japan). The relevant parameters were set as follows: test temperature (from room temperature to 1000 \({}^{\circ}\)C), test atmosphere: air, and heating rate: 25 \({}^{\circ}\)C/min.  
Figure 1: Thermogravimetric-differential scanning calorimetry (TG-DSC) diagram of the ceramic green body.  
As shown in Figure 1, the thermogravimetric (TG) and differential thermal (DTG) analysis of the ceramic green body indicates that the mass loss near 91.57 \({}^{\circ}\)C is due to the evaporation of a small amount of moisture. The mass loss in the temperature range of 100 \({}^{\circ}\)C to around 300 \({}^{\circ}\)C is primarily caused by the thermal decomposition of small organic compounds, such as the dispersant and TPO, which have a lower molecular weight compared to the photosensitive resin. By observing the DTG curve (rate of mass loss of the ceramic green body), a sharp mass reduction at 309.82 \({}^{\circ}\)C indicates the thermal decomposition of large organic polymers formed during the polymerization of the photopolymer resin. Additionally, a significant peak at 399.42 \({}^{\circ}\)C corresponds to the most intense decomposition stage of the resin, where the decomposition occurs most vigorously. Between 455.24 \({}^{\circ}\)C and 683.37 \({}^{\circ}\)C, there is a gradual and steady reduction in mass, attributed to the further decomposition of resin compounds and the stable release of gases. The TG curve reveals a gradual decrease in mass with increasing temperature, stabilizing at 683.37 \({}^{\circ}\)C. At this point, the thermogravimetric percentage settles at 69.03%, indicating a 30% mass loss. This observation aligns closely with the initial 70 Wt% solid content used during the preparation process, confirming the consistency of the material's decomposition behavior with its intended formulation.  
Based on the thermogravimetric-differential thermal analysis (TG-DSC) results, the high-temperature sintering heating curve (Figure 2) was developed. The sintering process is divided into three stages: First Stage (Drying Stage): The temperature is increased at a rate of 2.5 \({}^{\circ}\)C/min for 30 min until reaching 100 \({}^{\circ}\)C. This step removes any moisture in the sample, ensuring thorough drying. The temperature is held at 100 \({}^{\circ}\)C for 30 min. Second Stage (Debinding Stage): The temperature is raised at a rate of 2 \({}^{\circ}\)C/min for 150 min to reach 400 \({}^{\circ}\)C. This gradual heating allows the resin to release slowly, preventing cracks on the sample surface caused by rapid gas release. The temperature is held at 400 \({}^{\circ}\)C for 1 h to allow full decomposition and to ensure smooth progression to high-temperature sintering. Additionally, the temperature is held at 600 \({}^{\circ}\)C for 1 h to allow any remaining resin gases to escape, reducing gas pressure between the ceramic particles. Third Stage (High-Temperature Sintering Stage): The temperature is quickly increased at a rate of 6.25 \({}^{\circ}\)C/min to 1350 \({}^{\circ}\)C. The sample is held at 1350 \({}^{\circ}\)C for 5 h to complete the sintering process. Afterward, the sample is furnace-cooled to room temperature, resulting in the formation of the silicon-based ceramic. This process ensures optimal material properties and structural integrity in the final ceramic product.  
Figure 2: Heating curve of high-temperature sintering.