## 6 Conclusions  
In this study, we designed a high-performance heat dissipation module for 5G communication systems. Most active cooling systems are mainly designed with a combination of components such as fans, vapor coolers, or liquid coolers. They are not properly integrated with heat-source components, and weight and space constraints are not considered, so they cannot be configured in a small space. In this work, the heat dissipation elements and the heat source elements are integrated, and the system's space limitation is considered so that the proposed heat dissipation mechanism can be applied to a small space and meet performance requirements. The system integrates heat pipes, cooling fans, cooling fins, and thermoelectric cooling chips in limited space conditions in order to optimize heat dissipation design for T/R modules. Cold plates designed with the FEM were simulated and analyzed for heat dissipation performance before using the simulation results to conduct production and experiments for verification. Out of the proposed four types of heat dissipation mechanisms, simulation results showed superior heat dissipation performance of types  
Figure 28: Dummy Heater and cold surface of the TEC temperature response. Figure 29: Thermal Resistance. I and II. During the simulation stage, initial conditions, boundary condition settings, errors in model construction, and wear to the heat transfer efficiency of heat pipes when curved may have led to differences in simulation results and testing of actual systems. In addition, there is also a systematic error (including measurement error and capture Interference) and a random error in the experiment, where the measurement error is based on the Type K Thermocouples coefficients, which is determined according to NIST ITS-90 specification, converted to temperature. The resulting error range is \(\pm\)0.05 \({}^{\circ}\)C in 0 \({}^{\circ}\)C to 500 \({}^{\circ}\)C, and the error rate is 0.01%, while Capture Interference is a temperature data extractor (Ni-9212) in using K type thermocouples precision to 0.01 \({}^{\circ}\)C. This part will also cause the difference between simulation data and experimental data. The comparison between the test results and the numerical simulation results shows that the trend between the experimental and simulation data is consistent. Some errors still exist. The maximum error of the steady-state temperature at the contact point of the heat source (Point 5-8) is 1.8%; however, the initial heat dissipation properties of the designed mechanisms could still be observed to provide a reference for future designs of active heat dissipation mechanisms. Subsequent experimental results in this study show that heat dissipation performances were similar to simulation results. Without the active heat dissipation system, type I achieved a maximum temperature of approximately 83.5 \({}^{\circ}\)C, which is higher compared with the 79.2 \({}^{\circ}\)C of type II; in addition, the temperature difference between the four measurement points of both types revealed a better thermal equalization by type II. The active cooling system was activated. Once the stable state is entered, the maximum temperature of type I was approximately 50 \({}^{\circ}\)C, which is higher than the maximum temperature of 44.4 \({}^{\circ}\)C for type II. It is evident by the increase in the temperature curve that type II entered the stable state at a faster rate. Based on these results, the heat dissipation efficiency of type II is superior to that of type I. From the different design concepts of types I and II, the heat conduction directivity of the heat pipe was found to be a key factor, so that the overall system quickly converged to a steady state. Besides, through the heat pipe embedded in the upper end of the heat transfer plate design difference, type II optimized design exhibited a better uniform temperature effect, clearly suggesting that the heat dissipation configurations depicted in this study are viable in practical applications.