# Experimental Study of a Novel Prototype of Dual-Cycle Two-Phase Cooling System for a Data Cabinet
A high-performance spray cooling system, designed for the co-optimization of nozzle configuration and thermal management of electronic devices, has been proposed and demonstrated on high-power LEDs. Through both simulations and experiments, the effects of structure, flow rate, and distance on heat transfer characteristics were analyzed. The system achieved a high heat transfer coefficient of 20.7 kW/m\({}^{2}\cdot\)K, enabling the junction temperature to be effectively controlled at 85 \({}^{\circ}\)C [24]. [PERSON] et al. developed a three-dimensional heat transfer model for lithium-ion battery modules using simulation methods. They combined non-conductive hydrofluoroether (HFE) liquid spray with forced air as cooling fluids to analyze the temperature distribution within the battery module. Through structural optimization, the temperature uniformity was improved, resulting in a reduction of 4 \({}^{\circ}\)C [25]. [PERSON] et al. developed a novel spray cooling rack system and investigated its dynamic thermal performance. The study revealed that ambient temperature significantly influences both the cooling efficiency and the pressure within the spray cooling chamber. Additionally, a thermal model was developed to gain deeper insights into the thermal characteristics of the spray cooling rack system, demonstrating its capability to accurately predict the system's thermal performance [26]. By using water as the working medium and changing the surface roughness, spray cooling can control the surface temperature of 1 cm\({}^{2}\) heat source at 120 \({}^{\circ}\)C when the heat flux is 1000 W/cm\({}^{2}\)[27]. [PERSON] et al. [28] developed a laboratory-scale spray cooling rack system for data center cooling applications, designed for a maximum heat load of 5.6 kilowatts and capable of stable operation under coolant at approximately 30 \({}^{\circ}\)C, showcasing a significant energy-saving potential. Spray cooling offers the best heat dissipation performance and uniform cooling, making it particularly suitable for high-power-density scenarios. However, it involves complex systems, high maintenance requirements, and specific spatial layout demands. [PERSON] et al. [29] conducted single-phase immersion experiments on 54 servers with a peak of 400 W, proposing and validating an energy model to analyze system behavior, demonstrating the evolution of thermal characteristics under static and dynamic workloads. [PERSON] et al. [30] conducted a simulation analysis of the temperature of 800 W CPU in single-phase submerged cooling, and achieved an excellent control temperature of 62 \({}^{\circ}\)C. [PERSON] et al. [31] developed a single-phase liquid immersion cooling system using FC-40 dielectric liquid for a 1 U data server, conducting detailed studies on inlet parameters, structure, and flow rates. Two-phase immersion cooling also absorbs the heat of the chip in a variable form, and the chip indicates that the temperature can be maintained at 70 \({}^{\circ}\)C when the power is 600 W [32]. Immersion cooling provides excellent heat dissipation and uniformity, operates quietly, but incurs high fluid costs and complex maintenance, with higher compatibility requirements for equipment. [PERSON] et al. [33] utilized flow boiling of refrigerant R134a in microchannels for central processing unit (CPU) heat dissipation, achieving a heat transfer coefficient as high as 270,000 W/m\({}^{2}\cdot\)K. [PERSON] et al. [34] focused on developing a microchannel liquid-cooling heat sink integrated with a vapor chamber to manage the heat in high-power insulated gate bipolar transistors (IGBTs). Cold plate cooling is characterized by its simple structure, ease of maintenance, and high reliability. Although its heat dissipation capacity is slightly inferior to that of spray cooling, cold plate cooling offers a flexible and deployable solution for liquid cooling systems. As a result, it has become a primary research focus in the field of liquid cooling for data centers.