## 1 Introduction  
Currently, printing technologies are actively developing for the manufacture of sensors [1], antennas [2], fuel cells [3], flexible displays [4], and other electronic devices. The key advantages of printing technologies over silicon electronics are low manufacturing costs, rapid prototyping, and multi-substrate compatibility, including polymer materials [5, 6]. Thus, various methods of direct printing with nanoparticles have been developed in recent decades. Among them are the following: inkjet [7], aerosol jet [8], screen [9], microplotter [10] and electrohydrodynamic [11] printing, focusing of aerosol nanoparticles using aerodynamic lenses [12], electrostatic masks [13], micro-nozzles [14], and others. However, one can note the technology of \"dry\" aerosol jet printing (AJP) [15, 16]. This technology does not require the preparation of nano-ink, and aerosol nanoparticles are synthesized as a result of electrical erosion of electrodes directly during the printing process [17]. In this regard, \"dry\" AJP has a high versatility in the range of used materials (metals and their oxides, semiconductors and carbon) [18]. Wherein, there is not requiredadditional time for the development and optimization of the composition of nano-ink and pastes in comparison, for example, with inkjet or screen printing.  
At the same time, \"dry\" AJP is a relatively new and insufficiently researched technology. Currently, there are no works devoted to studies of the compatibility of this technology with various substrate materials. For this reason, this paper investigates the \"dry\" AJP of functional (current-carrying and gas-sensitive) microstructures on common substrates made of alumina, borosilicate glass, and silicon. These materials are widely used in printed electronics due to their heat resistance, mechanical and dielectric strength. The compatibility of printed microstructures on various substrates is studied using the example of copper nanoparticles synthesized in a spark discharge during electrical erosion of copper electrodes. Printed lines based on copper nanoparticles are promising as current-carrying contacts in solar cells [19], thin film transistors [20], flexible antennas [21], and RFID tags [2; 22]. Copper nanoparticles are competitive alternative to noble metals (Ag, Au, Pt, etc.) due to their low cost (several times less than Ag) and high electrical conductivity (6% less than Ag) [23]. However, copper nanoparticles are subject to significant oxidation under ambient conditions. For this reason, the synthesis and thermal sintering of copper nanoparticles were carried out in a reducing atmosphere of hydrogen.  
In this study, we have successfully printed current-carrying and gas-sensitive microstructures based on metallic and oxidized copper nanoparticles using \"dry\" aerosol jet printing without the use of organic solvents and nano-ink. Based on the results of the work, the effect of the sintering temperature and the type of substrate material on the electrical resistivity of the formed lines from copper-based nanoparticles was determined. Moreover, the initial unsintered lines based on oxidized copper nanoparticles were investigated for the detection of gaseous impurities of ammonia and carbon monoxide.