## 3 Methodology
### Framework for SMS and SMIS
#### 3.1.1 Framework for a Newly Personalized Customization Factory  
The system comprises six distinct layers, namely H-P1, H-P2, H-P3, H-P4, H-P5, and H-P6. H-P1 describes the product design, H-P2 pertains to production planning, H-P3 explains inventory management, H-P4 covers logistics management, H-P5 is related to integration and collaboration, and H-P6 comprises advanced technologies that facilitate personalized customization, as shown in Figure 3. In the product design layer, customized products are designed that meet customer requirements. It integrates advanced design and simulation tools that enable designers to create and test different product designs in a virtual environment. Production planning involves planning the production process, including scheduling, resource allocation, and process optimization. It leverages advanced planning and optimization tools that enable planners to create optimized production plans that balance customer demand, production capacity, and resource availability. Inventory management aids in managing inventory levels and ensuring that the right materials and components are available when needed. It leverages advanced inventory management tools that enable the real-time tracking of inventory levels and automated replenishment of materials and components. Logistics management is responsible for managing the logistics of the product delivery, including transportation and distribution. It leverages advanced logistics management and route optimization tools that enable the efficient and cost-effective delivery of products. The integration and collaboration layer consists of supply chain integration, human-machine collaboration, and a flexible manufacturing system; they collectively contribute to personalized customization. Advanced technologies that incorporate personalized customization include AI and machine learning, additive manufacturing, robotics and automation, IoT and sensor networks, a digital twin, data analytics, visualization, and cybersecurity. 1. Extension of the H-P1 layer. Advanced design and simulation tools play a prominent role in the product design process for a newly personalized customization process. The tools participating in this context are shown in Figure 4a. Autodesk Fusion 360 is a cloud-based CAD, CAM, and CAE tool that is used for the 3D modeling and manufacturing of products. It enables designers to test different design iterations, such as stress analysis, motion study, and thermal analysis. Dassault Systemes CATIA is a leading CAD/CAM/CAE software that offers a comprehensive suite of design and simulation tools, enabling designers to create and test complex, customizable products for personalized manufacturing. Siemens NX is a computer-aided design (CAD)/computer-aided manufacturing (CAM)/computer-aided engineering (CAE) tool that helps designers to test and optimize the design for different parameters, such as strength, durability, and  
Figure 3: Framework for a newly personalized customization factory. thermal performance. It accomplishes the required task by using advanced simulation functionalities. Dassault Systemes SOLIDWORKS is a CAD package that assembles simulation capabilities to conduct various analyses under necessary factors. Finite element analysis (FEA), computational fluid dynamics (CFD), and fatigue studies are examples of these analyses. As a result, it is regarded as a reliable software option for product design. PTC Creo Parametric and Creo Simulate are CAD software programs that help designers create and modify intricate product designs by providing a wide range of simulation tools. Moreover, designers can conduct various assessments of products, such as structural, thermal, and vibrational properties. This results in enhancing the efficiency and reliability of the entire manufacturing scenario. COMSOL Multiphysics is a user-friendly software application that is used in engineering as well as science and academia. It offers two techniques for product design: virtual prototypes and multiphysics analysis.