# A Survey on Mission-Profile-Based Stress Testing of Electric Motor Drives
## 3 Mission-Profile-Based Stress Testing Methods  
As outlined in Section 1, the mission profile serves as a simplified representation of all significant static and dynamic load conditions that the components of the EMD encounter over their entire operational lifespan. To evaluate the impact of various stress factors and dynamic events within the mission profile on the degradation and reliability  
\begin{table}
\begin{tabular}{c c c c} \hline \hline
**Stress Factor** & **Power Converter** & **Electric Motor** & **Insulation and Cables** \\ \hline \multirow{3}{*}{Electric field} & Insulation breakdown, voltage overload, PDs, EMC, overheating & Induced voltage, PDs, overheating, EMC & PDs, dielectric breakdown, thermal degradation, EMC, induced voltage \\ \hline \multirow{3}{*}{Magnetic field} & Magnetic saturation, EMC, induced voltage and current, overheating & EMC, residual flux, induced voltage, magnetic forces, torque ripples & Thermal degradation, dielectric breakdown, EMC, magnetic forces \\ \hline \multirow{3}{*}{Current} & Current spikes, overload, overheating, EMC, harmonics, transient currents & Current spikes, eddy currents, bearing currents, harmonics, overheating, efficiency drop & Current spikes, overheating, EMC, corona effect, short circuits, insulation breakdown \\ \hline \multirow{3}{*}{Temperature} & Semiconductor failure, capacitor degradation, reduced efficiency, voltage instability & Overheating, reduced efficiency, speed fluctuations, vibration, increased resistance & Overheating, deformation, increased resistance, short circuits, deterioration of shielding \\ \hline \multirow{3}{*}{Humidity} & Corrosion damage, short circuits, reduced efficiency, electrical arcing & Corrosion damage, increased friction, reduced efficiency, bearing failures & Moisture absorption, chemical deterioration, degraded flexibility, voltage breakdown \\ \hline \multirow{3}{*}{Mechanical} & Semiconductor fatigue, increased wear, bond fracture & Friction, torque ripples, overheating, bearing wear, vibrations & Cracks, deformation, contact breakdown, conductor wear, short circuits \\ \hline \hline \end{tabular}
\end{table}
Table 2: Most common effects of stress factors on EMD components.  
Figure 4: Classification of environmental stress.  
of the EMD, specialized stress testing methods have been developed. These procedures define trajectories that simulate operational conditions and stress factors to which the components are exposed throughout their lifecycle [57]. The aim of this approach is to ensure a reliable replication of real-world operating conditions in a laboratory environment, providing insights into the dynamics of damage formation under various load scenarios. Repetition of these predefined trajectories within an accelerated timeframe makes it possible to produce damage that is equivalent in type and severity to what would occur throughout the entire lifespan of a component under real operating conditions. This methodological approach enables faster testing, an evaluation of long-term reliability evaluation, and a better understanding of the degradation processes of materials and components under various stress conditions, which is essential for optimizing their design and longevity.  
As noted in Section 1, combining speed and load profiles with the stress factors mentioned in Section 2 leads to the development of testing procedures designed to evaluate the entire integrated drive system. In Figure 5, the flowchart diagram for mission-profile-based stress testing is presented.  
To obtain an appropriate mission profile, it is first necessary to define speed profiles, load profiles, and stress factors. Once the mission profile is defined, a mathematical interpretation of stress should be conducted. The next step is to perform an experiment based on accelerated testing. The results of the experiment provide information about reliability, lifespan, and insights into the parameters of the EMD that require optimization.