###### Abstract
Implant form should not affect the coating's uniformity, and the coating method should not alter the implant's physical characteristics. Compared with wet chemical methods, preparing TiO\({}_{2}\) films using magnetron sputtering is an intriguing technique since it is an industrial approach used for large-area deposition that produces high-quality films with good adhesion, density, and homogeneity even at low substrate temperatures. The plasma density in front of the substrate is substantially lower for DC discharge than for RF discharge because electrons act near the anode (substrate) rather than the cathode (target) during the positive half-cycle of the RF field [16]. Thus, when sputtering at constant power, the heat burden on substrates will be significantly smaller for DC than for RF sputtering [17]. Because of this, DC magnetron sputtering is preferable to RF magnetron sputtering for low-temperature metal oxide thin film deposition. Little research has been conducted on the sputtering techniques needed to produce highly pure Cu-doped TiO\({}_{2}\) coatings. For most depositions, the formation of anatase or rutile TiO\({}_{2}\) thin films rather than amorphous ones usually requires a high temperature (over 300 \({}^{\circ}\)C) through substrate heating or post-annealing. He and colleagues, for instance, used magnetron sputtering to create intermetallic CuTi films, which were then air-annealed to form CuO-doped TiO\({}_{2}\) coatings [2]. [PERSON] et al. and [PERSON] and his associates used a similar strategy [18; 19]. According to [PERSON] et al. [20], dual-target RF magnetron sputtering at 450 \({}^{\circ}\)C in an Ar/O\({}_{2}\) atmosphere allowed for the successful deposition of Cu-doped TiO\({}_{2}\) film with a major anatase (001) orientation and minor rutile phase. [PERSON] et al. [21] used a dual HiPIMS and DC sputtering system in a reactive O\({}_{2}\)/Ar atmosphere to deposit TiCuO films containing 20%, 40%, and 80% copper and found that films containing 80% Cu moderately lowered human osteoblast survival over 24 and 72 h. Still, by day seven, the cytotoxicity was gone. _Staphylococcus epidermidis_ vitality was lowered by all films in a Cu-dose-dependent manner. However, no structural studies were presented. According to [22; 23], the rutile phase of the TiO\({}_{2}\) film had to be deposited during magnetron sputtering at a temperature higher than 600 \({}^{\circ}\)C or after annealing at a minimum of 800 \({}^{\circ}\)C. However, by applying substrate biasing, the substrates can be in situ heated during sputtering deposition, eliminating additional post-annealing requirements to crystallize the films. Additionally, applying substrate biasing can increase the coating-substrate adhesive strength, which is of prime importance since the bactericidal coating can fail due to inadequate adhesive strength, and the antibacterial property will vanish. Then, it is also necessary to examine the film's durability and mechanical qualities. The current study aims to perform the following:(i) synthesize, by one-step process, nanocrystalline Cu-doped TiO\({}_{2}\) thin films at room temperature using a direct current magnetron sputtering of mosaic Ti-Cu target metal in a pure O\({}_{2}\) atmosphere without substrate heating or post-annealing, and (ii) investigate the effects of sputtering parameters, particularly substrate bias values, on the morphological, structural, mechanical, electrochemical, and antibacterial characteristics of Cu-doped TiO\({}_{2}\) films. With appropriate control over the sputtering conditions, our results suggest that nanocrystalline Cu-doped TiO\({}_{2}\) thin films can be deposited without substrate heating. We discovered that the energetic particle bombardment of the growing films (electrons, ions, atoms, molecules, etc.) is the primary cause of the crystallization of Cu-TiO\({}_{2}\) films with different phase compositions.