## 1 Introduction
\begin{table}
\begin{tabular}{c c c c c} \hline \hline
**Additive Manufacturing Method** & **Binding Mechanism** & **Forming Method** & \multicolumn{2}{c}{**The Current State of SiC Component Manufacturing**} & **Ref.** \\ \hline SLA & \begin{tabular}{c} Photopolymerization \\ (liquid resin is cured \\ by light) \\ \end{tabular} & Layer-by-layer curing & \begin{tabular}{c} High resolution, suitable for \\ small-scale, high-precision parts. \\ Low density of green parts due to \\ the low solid loading and the opacity \\ of SiC powders to light. \\ \end{tabular} & [22, 23] \\ \hline DLP & \begin{tabular}{c} Photopolymerization \\ (liquid resin is cured by light using digital \\ micromirror devices) \\ \end{tabular} & Layer-by-layer curing & \begin{tabular}{c} Higher resolution and suitable for \\ large-sized parts. \\ The limitations of the binder material \\ result in poor mechanical strength \\ and high-temperature resistance of \\ SiC components. \\ \end{tabular} & [14, 24] \\ \hline SLS & \begin{tabular}{c} Fusion (powder is fused \\ using a laser beam) \\ \end{tabular} & Layer-by-layer sintering & \begin{tabular}{c} Capable of producing high-density \\ and mechanically strong parts. \\ Large thermal stresses may cause \\ deformation of SiC components. \\ \end{tabular} & [25, 26] \\ \hline MEX & \begin{tabular}{c} Fusion (material is \\ extruded and fused layer \\ by layer) \\ \end{tabular} & \
\begin{tabular}{c} Material is extruded and \\ fused layer by layer using \\ a nozzle \\ \end{tabular} &
\begin{tabular}{c} Relatively cost-effective, especially \\ suitable for large-scale production. \\ The precision of small and complex \\ geometric SiC components is \\ relatively low. \\ \end{tabular} & [24, 27] \\ \hline \hline \end{tabular}
\end{table} 
Table 1: Applications of different additive manufacturing technologies in SiC component fabrication. Compared to the aforementioned additive manufacturing technologies, the unique process characteristics of binder jetting 3D printing (as illustrated in Figure 2) endow it with distinctive advantages in the fabrication of SiC components. BJ 3D printing uses raw powder materials in SiC component manufacturing that do not require special processing, greatly enhancing the applicability and efficiency of 3D printing. In printing complex geometries, the BJ process does not require support structures [28]. The powder material can be reused, thus improving powder utilization efficiency. Additionally, the BJ process is typically carried out at ambient temperature [29], which helps prevent defects caused by heat sources during the manufacturing of SiC components. Finally, the flexible configuration of multiple printheads in BJ 3D printing meets the requirements for printing high-precision SiC components. These unique advantages make BJ 3D printing technology a promising solution for SiC material fabrication, with extensive application potential. Significant progress has been made in recent years in manufacturing complex SiC ceramic components using BJ 3D printing technology (as shown in Figure 3). However, with the increasing performance demands for SiC-based ceramic components in aerospace, nuclear energy, and other advanced applications, BJ 3D printing technology must contin  
Figure 2: BJ 3D printing formation process. (**a**). Schematic illustration of part formation in BJ 3D printing, cited from [30]. (**b**). Formation process flowchart of binder jetting 3D printing. uously optimize its printing process to overcome inherent technical bottlenecks, thereby reinforcing its manufacturing advantages in these fields. In BJ 3D printing, the final performance of SiC components is jointly determined by the formation quality of the green body (mechanical strength and accuracy of the SiC green part) and the post-processing densification techniques. Therefore, the key to enhancing the performance of SiC components lies in systematically investigating the synergistic optimization of the green body printing process and post-processing techniques.