###### Abstract  
With the continued development of 5G mobile communications technology, the implementation of high-power communication systems has become a key indicator of developed nations. Communication modules are also trending toward wide bandwidth and high-capacity Multi-Input and Multi-Output systems. As the signal transmission speed and resolution continue with the increasing trend, the power used to operate these communications systems increase, causing extreme heat generation by transmit/receive modules (T/R module). In conditions where computation load increases in micro design systems, chips must operate in environments that are narrow, sealed, and have no convection, which can drastically increase the thermal load within a system. If no proper cooling system is utilized, the system fails or operates at impacted performance due to excessive temperatures. To solve the aforementioned problem, this study aimed to optimize the design of the cooling system in the T/R modules of communications systems by integrating heat pipes, cooling fans, cooling fans, and cooling chips within a limited space. We also proposed four types of cold plates based on the different directional clamp-in configuration methods of heat pipes within copper panels and utilized the finite element method to simulate and analyze the heat dissipation performance. The simulation results reveal that cold plates of types I and II can achieve a better heat dissipation performance. Finally, types I and II cold plates were selected for production and experimental verification. The results show that heat dissipation performances were similar to simulation results. The results also confirmed that type II cold plate has a better temperature uniformity and heat transfer efficiency. Thus, the cooling mechanism depicted in this study is viable in practical applications. The proposed mechanisms can also provide a reference for heat dissipation design patterns in different electronic module settings. communication module; heat dissipation; heat pipe; thermo electric cooler (TEC) 2021 31 May 2021 31 June 2021 31 May 2021 31 June 2021 31 May 2021 31 June 2021 31 May 2021 31 June  
came into existence. To solve the issue of heat dissipation, all types of thermal components are continually developed and launched. Currently, the most common thermal components are aluminum cooling fins, copper base aluminum cooling fins, copper cooling fins, heat pipes, flat plate heat pipes (also known as vapor chambers), directional graphite heat sinks, water-cooling heat sinks, liquid vapor heat exchangers, and other products. The current thermal solutions for electronic components often utilize heat dissipation design mechanisms that integrate various thermal components such as cooling fins and fans. Thermal components utilize contact surfaces to transfer heat to the cooling fins and convection generated by fans and other methods to expel heat to external spaces. One of the key methods to increase thermal performance is increasing the surface area of fins and increasing the revolutions per minute of fans (amount of wind) to achieve the goal of quick heat dissipation. However, the excessive density of cooling fins increases thermal resistance. Faced with his issue, [PERSON] and [PERSON] [1] studied the relationship of cooling fin density and thermal resistance to achieve a suitable fin density, and a suitable expansion of cooling surface area could still effectively reduce thermal resistance in cooling fins. [PERSON], [PERSON], and [PERSON] [2; 3; 4] also tested different fin designs to assess the effect of heat dissipation on electronic components. Other studies have also strived to improve cooling fin design [5; 6; 7] using methods such as increasing flux performance and heat dissipation surface areas to cool the massive amount of thermal energy generated by CPUs or high-performance electronic components.