# Modeling and Control Simulation of Power Converters in Automotive Applications
## 1 Introduction
### Related Works  
In [44], the description of a unidirectional onboard charger (OBC) configuration includes modeling and design aspects. This configuration incorporates a step-up DC/DC converter following an AC/DC diode rectifier stage to achieve power factor correction (PFC). The system connects to the vehicle's battery through a phase-shifted full-bridge (PSFB) type DC/DC converter. The control algorithm relies on electrical circuit modeling to primarily define transfer functions. In contrast, the current work incorporates a model that integrates the complexities of a dual active bridge (DAB) circuit and a totem pole circuit into the control algorithm. Additionally, a detailed examination of the thermal behavior of SiC/GaN MOSFETs, a critical aspect absent from the cited paper, is included. In contrast, ref. [45] introduces an alternative control approach employing a step-up converter following a diode rectifier for the AC/DC conversion stage. However, their simulation experiments primarily concentrate on diverse operating scenarios. In contrast, the present study integrates the intrinsic properties of the switching components and conducts thermal evaluations during simulations, employing a more comprehensive modeling method for onboard chargers (OBCs). Subsequently, in [46], a thermal study of a \(\sim\)7 kW onboard charger (OBC) is conducted using a multi-stage output DC/DC converter and finite element method software. The circuit analysis is based on a rudimentary linear approximation, while the thermal analysis is thorough. In contrast to the benefits of the proposed model-based design (MBD) approach, the disadvantage of segregating dynamic and thermal simulations into separate software environments, resulting in heightened computing costs, remains significant, particularly for predictive diagnostics. Similarly, unlike the thorough method employed in this study, ref. [47] does not consider the thermal properties of the components and instead focuses on modeling the electrical behavior of the onboard charger (OBC) at lower power and voltage outputs. Furthermore, neither ref. [48] nor ref. [49] includes comprehensive modeling of the thermal behavior of electronic components, an essential aspect integrated into the suggested framework in this study; moreover, they do not provide specific design details of the OBC device. Similar to this, ref. [50] employs an MBD technique for the validation of control techniques in onboard chargers (OBCs). In contrast to the all-inclusive technique applied in this study, it solely addresses the analysis of electrical behavior, disregarding thermal behavior. Likewise, refs. [51; 52] primarily concentrate on energy efficiency and simulations without incorporating a comprehensive model of the thermal behavior of electronic devices, another crucial aspect of the suggested work. Based on the literature study, it is evident that the majority of published research focuses on the dynamics of electrical quantities, ignoring the important connection to the thermal behavior of the SiC/GaN MOSFETs in the energy conversion stages. Furthermore, even energy-efficient works neglect to represent temperature elements, which are essential for confirming the physical boundaries of simulated electronic devices, including the transistors that make up electronic converters.