###### Abstract
Glass-based packaging has emerged as a potential solution to address the limitations of low-temperature co-fired ceramic (LTCC) and organic substrates, as it is advantageous in terms of benefits such as silicon-like dimensional stability, a tunable coefficient of thermal expansion (CTE), low-loss through-glass via (TGVs), panel-scale processability and the ability to support fine-feature redistribution layers (RDLs) as a result of low-loss polymer dielectric lamination. Copper can be precisely patterned using a semi-additive patterning (SAP) process on these RDLs. Since the CTE of glass is tunable (3-8 ppm/K), it can be matched to silicon dies for ease of assembly and improved reliability. This provides engineers with a new horizon to explore the flexibility of the electrical and mechanical properties of laminated glass substrates for 5G and mm wave modules. Glass  
Figure 1: Cross-section of a state–of–the–art glass–based 5G module with broadside and/or end–fire radiators for 5G applications. -based packaging solutions for 5G and mm wave applications are widely pursued in academia [12; 13] and industry [14; 15]. This paper presents the packaging implementation and a system performance analysis of glass-based integrated passive components for 5G NR mm wave modules. The bands of interest are in frequency range 2 (FR2), as defined by 3 GPP: n257, n258 and n260 [16; 17]. The frequency range and fractional bandwidth (FBW) of each band are as follows: n257: 26.5-29.5 GHz (10.71%); n258: 24.25-27.5 GHz (12.6%); and n260: 37-40 GHz (7.8%). It is to be noted that band n261 is a subset of band n257, with a frequency range of 27.5-28.35 GHz (3.04%). This study includes miniaturized mm wave diplexers, a broadband coupler, and an integrated passive component block combining both. This integrated passive component block finds its place in a power detection and control circuitry in a modern RF power amplifier (PA) front-end module (FEM), a schematic diagram of which is shown in Figure 2, and it is used as an example in this work [18]. It consists of an amplifier block in conjunction with a diplexer, a directional coupler with a detector and an antenna array. It is typically used in WCDMA and GSM/EDGE systems due to their output power control requirements, especially under mismatched-load conditions [19; 20]. The matching network blocks represent output matching of the amplifiers, and can be formed of LC components, transmission lines, isolators or transformers depending upon the application requirements. The filters in the diplexer act as harmonic filters, and they combine the signals coming from 28 and 39 GHz band amplifiers. The coupler can have a variable or fixed coupling factor depending upon the required level of control over the output power. The transmitter chain in Figure 2 is used to quantify the distortion of the fabricated block as well as to discuss a co-simulation approach to compare passive components using system-level performance metrics such as error vector magnitude (EVM). The choices of modulation schemes are \(\pi/4\) differential quadrature phase shift keying (\(\pi/4\) DQPSK) and 64-state quadrature amplitude modulation (64-QAM), but any desired modulation scheme can be used. Previously, the authors have published work on individual passive components such as filters [21; 22; 23], power dividers [24; 25] and others [26; 27] for 5G and mm wave applications. Unlike in [21; 22], which introduces miniaturized filters covering entire 28 and 39 GHz bands, the focus of this work is on diplexers using filters for 5G NR bands (n257, n258 and n260) and their integration with couplers to implement a passive component block in an RF transmitter chain. The filters, used as building blocks for diplexers, are also designed with several design- and process-level considerations to further improve model-to-hardware correlation: cross-correlation between the simulated and measured results is improved by 5.5% when compared to the authors' previous work.