###### Abstract
Likewise, [PERSON], [PERSON], [PERSON], and [PERSON] [8] designed a cooling fin with a different aspect ratio (AR) between the slant angle and fin while using comparative analysis under conditions of natural convection to find optimal thermal performance and observed that the conditions of slant angle at -30 degree and AR = 4.0 could achieve optimal thermal performance. As cooling fins utilize the thermal conductivity principles of solid substances for heat dissipation, their thermal performance is limited and are gradually unable to satisfy the heat dissipation requirements of high-power components. To increase thermal performance, the principle of latent heat phase transition has been applied in recent years to increase thermal exchange efficiency and generate fast thermal conductivity; heat pipes broadly apply this principle. Their basic principle is a sealed cavity with a working fluid that utilizes the continuous circulation and two-phase change of liquid-vapor and vapor-liquid convection from liquid at the endotherm and gas at the exothermal ends within the cavity. The surface of the cavity has the characteristic of rapid temperature equalization that achieves the purpose of heat transfer [9]. In 2021, [PERSON], [PERSON], [PERSON], [PERSON], and [PERSON] [10] focused on utilizing miniaturize heat pipes to improve the thermal performance of laptop computers. In 2003, [PERSON], [PERSON] and [PERSON] [11] designed a cooling module that integrated heat pipes, cooling fins, and fans and verified the difference in the benefits of heat dissipation at different fan speeds compared with a traditional PC cooling system (fins + fans). Results showed that the integrated design of the cooling module possessed exceptional cooling performance and retained high-performance cooling even at low fan speeds. It also solved the noise issue caused by the high fan speeds of traditional cooling systems. Many scholars have also continued to study the application of heat pipe designs by exploring the selection of different materials, manufacturing controls, or type designs that can achieve a better cooling [12; 13; 14; 15; 16; 17]. When faced with products that trend toward miniaturization, using single or multiple heat pipes for cooling requirements is no longer suitable in terms of space and performance. Flat plate heat pipes (vapor chambers) are products that were derived through this development. They are cooling components based on a two-dimensional heat transfer system superior in thermal conductivity and efficiency to multiple heat pipe configurations, and because they can quickly transform a point heat source into a surface heat source, the reduction of heat transfer per unit area achieves temperature equalization and avoid heat points that can cause failure or performance issues in electronic components. The flat area and heat source have a higher contact area and can effectively reduce the system's general heat resistance achieving exceptional cooling in combination with cooling fins [18]. Vapor chambers can be designed according to different requirements. Integrated cooling plates are a sealed component that utilizes different manufacturing methods such as metal mesh sintering, trench, or thin metal films to form different capillary structures to allow for gas-liquid phase change within the internal structure's flux to transfer heat while in contact with cooling fins through capillarity. Internal clamp heat pipes are a type of cold plate that utilize several straight or curved heat pipes clamped onto metal panels to achieve high scalability at low cost. In 2020, [PERSON], [PERSON], and [PERSON] [19] verified the convection performance of two different embedded heat pipe radiators in forced convection experiments, and compared with a blank heat sink, the heat dissipation performance increased by 28%. We utilized such a design in this study. With the continued development of communications technology, high-speed transmission, communication quality, and long-distance transmission, the operating power has also increased.