[48] investigated the effect of laser pulse duration and feed rate variation on surface polishing. [PERSON] et al. [49] studied the effect of shallow surface melting and surface over melting on the laser polishing process. [PERSON] et al. [50] discussed the general properties of PL machining relevant to solid-state physics such as the initial ablation process and the formation and properties of the plume. [PERSON] et al. [51] performed a fundamental study on laser metal interaction and its application to surface modification without altering the part geometry. [PERSON] et al. [32] developed a numerical model based on a computational fluid dynamic formulation to understand the melt pool dynamics during laser polishing. They identified the input thermal energy as the key parameter affecting melt pool convection and controlling the surface quality. [PERSON] et al. [52] proposed a quadratic model taking into account the initial surface topography and polishing process parameters. Using the model, they predictedthe polished surface quality and also experimentally determined the optimal parameters for polishing. [PERSON] et al. [53] investigated the formation of bulge structure during laser polishing and the influence of processing parameters on the bulge structure through parametric analyses. [PERSON] et al. [54] made use of PL to polish complex geometries, i.e., convex, concave, and slant geometries made of AM CoCr alloy, and achieved a 93% reduction in surface roughness with an 8% hardness enhancement. While PL has been reported to be applied mostly for LAMP, several researchers have also employed continuous wave (CW) lasers alone or combined with PL and demonstrated improvements in surface roughness [40; 55; 56]. [PERSON] et al. [57] investigated the effect of using CW laser and PL on improving the surface roughness of AM 18 Ni (300 grade) Maraging steel. A stable melt pool with fine surface finishing was observed for PL polishing at low power and low speed, while a significant improvement in surface quality was achieved with CW laser at high scan speed and laser power. By utilizing both CW laser and PL together, [PERSON] et al. [58] deployed a dual-beam technology for surface polishing. CW laser was used for preheating the surface and PL polished the preheated surface. The dual-beam polishing process demonstrated a higher reduction in surface roughness in comparison to the conventional laser polishing process. [PERSON] et al. [59] introduced an innovative laser polishing process implementing a wobble amplitude pattern during polishing and applied a convolutional neural network (CNN)-based artificial intelligence technique on polished surface images to identify optimal process parameters for polishing. In previous studies, while different techniques and methods have been presented using both CW laser and/or PL for the laser-aided polishing process [26; 27; 28; 29; 30; 47; 48; 59], further investigation is required to develop a comprehensive and combined process while selecting the scan patterns and types of lasers for machining and polishing AM materials using lasers. In this study, we propose a unique laser-aided machining and polishing (LAMP) process with the combination of CW laser, pulsed laser, and a novel scan pattern that emulates end mills of different sizes while machining and fine polishing the material. For the LAMP process, the Scalmalloy aluminum alloy was fabricated using the DED process and the process parameters were optimized in each step of machining (micro-milling) and polishing (macro-polishing and micro-polishing) to reduce the surface roughness and improve the surface quality of the material.