## 3 Results and Discussion
### Numerical Results  
The laser power and sintering speed are essential parameters in the PBSLP of SiC. Using a low laser power with high sintering speed may lead to un-sintered powder particles, and using a high laser power with low sintering speed may lead to the decomposition of SiC and build failure. Therefore, using suitable laser power values and sintering speed is the key factor for successful D-PBSLP of SiC. The developed model was used to determine the suitable laser power values for different sintering speeds of 500, 250, and 100 mm/s using 22 um layer thickness. The recommended laser power values were selected based on achieving full sintering of the layer thickness and adhering it with the layer below. Additionally, the predicted laser power should give a maximum temperature below the decomposition point of SiC. SiC starts to decompose when the temperature exceeds 2800 \({}^{\circ}\)C to form liquid silicon and carbon [37]. Therefore, it is recommended to keep the maximum temperature during PBSLP below the decomposition point of SiC. For sintering speeds of 500 mm/s, it was found that using a laser power of 15% (45 W) of the printer, maximum power (300 W) was able to sinter the layer thickness, but without adhering it to the layer below. Increasing the laser power to 20% (60 W) was found to sinter the layer thickness, adhere it to the baseplate and give a maximum temperature distribution below the decomposition point of SiC, as can be seen in Table 3. Therefore, it is recommended to use a laser power of 20% (60 W) with 500 mm/s sintering speed. The same procedure was followed with other sintering speeds, and the recommended laser power values are summarized in Table 4. Figure 9 gives the laser power range for different scanning speeds of 500, 250, and 100 mm/s.  
\begin{table}
\begin{tabular}{c c c c} \hline
**Sintering** & **Laser** & **Sintering Contour** & **Temperature Contour, K** \\
**Speed, mm/s** & **Power, W** & **S  
Hatching distance is another critical parameter that controls the contact between adjacent paths. Using a high hatching distance value leads to unconnected scanning paths that affect the printed part's mechanical properties. Additionally, small hatching distance values increase the building time and heat accumulated inside the part during the building. Therefore, it is crucial to use a suitable hatching distance value. The developed model was used to predict the hatching distance value by calculating the sintering path width for each scanning speed with the recommended laser power. The hatching distance should be less than the scanning path width to connect the adjacent paths. Table 5 summarizes the width of the scanning path for each sintering speed with the laser power, according to the results obtained in Tables 3 and 4. The sintering path widths were 38, 43, and 48 \(\upmu\)m for 500, 250, and 100 mm/s sintering speeds, respectively. It can be noted that using a low sintering speed led to an increased sintering path width as the interaction time between the laser and the powder increased and, therefore, more particles were sintered. In order to connect the adjacent sintering paths together, it is recommended to select the hatching distance to be 35 \(\upmu\)m (half the laser spot size) for all the sintering speeds.