## 1 Introduction
They observed a significant improvement for CPU cooling with and without the TEC system. Additionally, [PERSON] [12] carried out the same experimental study, and the results indicate that the heat transfer rate increased with increasing coolant flow rate and higher channel. [PERSON] et al. [13] investigated the thermal performance of a thermoelectric water-cooling device for the electrical component to analyze the effect of heat load and the cooler's current on the cooling performance of the thermoelectric module. An experimental and theoretical investigation was carried out by [PERSON] and [PERSON] [14] to examine the thermal performance of the pin-fin heat sink. Furthermore, [PERSON] et al. [15] carried out an experimental study to examine heat transfer and connected bubble characteristics of FC-72 on a micro pin-finned silicon chip. The experimental data indicate that adding a micro-pin fin structure to the chip surface effectively improves convection and heat transfer. A theoretical study of a TEC designed for small space cooling applications for the buildings was carried out by [PERSON] et al. [16] to find the maximum operating conditions; also, [PERSON] et al. [17] and [PERSON] [18] evaluate the cooling performance and thermal comfort of TE air conditioner based upon the cooling thermoelectrics. An experimental analysis of a mini-channel water-cooled thermoelectric refrigerator was carried out by [PERSON] and [PERSON] [1] at different voltage and different flow rates of the cooling water in the mini channel. [PERSON] et al. [19] carried out an experimental analysis to examine the application of heat pipes and a phase change material (PCM) in thermoelectric refrigeration. The results indicate that the use of an encapsulated PCM enhances the performance of the system. It also provides storage capacity, which helps handle peak loads. [PERSON] and [PERSON] [3] carried out an experimental study to check TEC applications in electric cooling. To increase the performance of thermoelectric coolers, [PERSON] et al. [20] tried a low thermal resistance heat sink design with water-cooling integrated on the hot side of a thermoelectric refrigerator. In this study, the TEC is integrated with the heat exchanger differently from the traditionally used way to examine the effect of the different parameters on the system performance. Several research studies have been carried out to check the performance of TEC with different types of the heat sink. Moreover, there are many applications and types of thermoelectric cooling systems that have been using so far. However, the authors found limited research work supporting the TEC with the cold plate and heat sink used for the cooling application [21]. In this work, the heat sink was used to spread the cooling effect instead of heat spreading, which is generally used in TEC applications. Apart from that a cold plate heat exchanger was used for the heat removal from the hot side of the TEC module. Moreover, a copper tube heat was used to remove the heat from the hot liquid coming out of the cold plate heat exchanger and release it to a closed insulated room. Therefore, the copper tube heat exchanger was placed inside the closed room. Moreover, the liquid just released some heat to the closed room goes back to the chiller for further cool down. The present work investigates the system's cooling performance by using different parameters such as input current, liquid flow rate, inlet air fan speed, etc.