###### Abstract
Experimental results verified that the average temperatures of the pseudo-chips invariably stayed below 85 \({}^{\circ}\)C across all testing conditions. Additionally, a thorough performance analysis was conducted, considering factors such as cooling cycle efficiency, energy recovery, and system controllability. The results showed the systems' extraordinary proficiency in energy utilization, heat recovery, and system management. Nonetheless, room exists for thermodynamic improvements, as the present setup recovers merely about 10% of the supplied exergy in the condenser. [PERSON] et al. [21] introduced the fundamental energy conservation principle of year-round free cooling using a novel loop heat pipe (LHP) chip-level cooling technique. They devised an energy-saving theoretical model rooted in this method to evaluate energy utilization efficiency and energy-saving levels. Their research employed two types of computer servers, each equipped with water-cooling LHPs with a flat evaporator, functioning efficiently with an inlet water temperature of 40 \({}^{\circ}\)C and flow rate of 0.027 m\({}^{3}\)/h. The technique was then implemented in two industrial data centers. The operational data revealed that the energy savings in the cooling system and the overall data center exceeded 82% and 30%, respectively, compared to traditional CRAH cooling technique. These results were consistent with their theoretical model predictions. We also present research advancements in refrigerant pumps, a critical component of the pump flooding two-phase system. [PERSON] et al. [22] proposed a flexible fluidic roller. This novel device employs a simple structure comprised of a pliable, twistable electrohydrodynamic pump combined with a layer of natural latex. Beyond experimental methodologies, simulation-based studies have emerged as a powerful and efficient means of examining the factors that influence the performance and reliability of two-phase cooling systems. Several researchers have concentrated their efforts on simulation-based explorations. [PERSON] et al. [23] proposed a comprehensive model for two-phase thermosyphon loops, employing the simultaneous conservation of momentum, energy, and mass. The findings illustrated that the model could satisfactorily simulate the loop's behavior under minor temperature differences. [PERSON] et al. [24] proposed and simulated a chip-level two-phase cooling cycle, designed to dissipate heat generated by microprocessors and auxiliary electronics in blade servers. A simulation code was developed and employed to examine five scenarios, considering three different working fluids--HFC134a, HFO1234 ze, and water (as utilized in a single-phase cooling cycle)--and variations in the internal diameters of the pipes. The analysis revealed that under conditions with a total pressure drop around 100 kPa, the water-cooling cycle demands an astonishing 16.5 times more pumping power than the two-phase HFC134a cooling cycle. [PERSON] et al. [25] examined the use of passive two-phase thermosyphon technology for cooling data centers at the granularity of individual server racks in their experimental study. They compiled an extensive experimental database of 262 data points to validate the predictive accuracy of their simulation model concerning refrigerant mass flow rate, average chip temperature, and system pressure. Their results indicated a significant level of agreement between the experimental data and predicted values, with the pseudo mean chip temperature prediction demonstrating an approximate error margin of just 1 \({}^{\circ}\)C.  
The previously mentioned studies suggest that the majority of research on chip-level two-phase cooling has primarily focused on designing effective porous-medium heat sinks [17; 26]. Yet, there is a notable lack of studies focusing on a pump-driven chip-level two-phase cooling system (PCTCS). This system emerges as a promising methodology in the field of chip-level cooling systems, fulfilling the heat dissipation requirements of numerous servers.