## 6 Conclusions  
Package integration and a system performance analysis of ultra-thin glass-based passive components for 5G NR mm wave bands are presented. Diplexers and couplers covering bands n257, n258 and n260 are modeled, designed, fabricated and characterized. Hairpin, interdigital and edge-coupled filters are selected for diplexers, and a three-section coupled-line structure is utilized to establish the directional coupler. The panel-scale SAP process is optimized to fabricate these structures on a four-metal-layer stackup. The methodology for their characterization is also discussed, and a dimensional analysis is performed to extract their electrical dimensions from their physical dimensions. Individual filters and diplexers exhibit low insertion loss, low VSWR and high isolation, and the coupler covers the entirety of the 5G NR mm wave bands. Their simulated and measured results are in an excellent agreement. Diplexers and couplers are combined and characterized as an integrated passive component block in a power detection and control circuitry. A co-simulation methodology is introduced to evaluate the effect of component interactions on group delay variation, power variation and distortion in amplitude and phase using EVM as the performance metric. The amplitude and phase variation of this integrated passive component block are extracted in terms of EVM. Moreover, the relationships of filter parameters such as insertion loss, ripple, center frequency and bandwidth with EVM are presented to compare two filters using an RF carrier modulated with a 64-QAM signal. This approach is used to determine whether similar structures to EVM are sensitive to component parameters.  
Figure 20: EVM compared to insertion loss variation and bandwidth of band n257 filter in diplexer using 64–QAM–modulated RF carrier frequency sweep with varying symbol rates: (**a**) filter A and (**b**) filter B.  
**Author Contributions:** Conceptualization, methodology, validation, formal analysis and investigation, M.A.; resources, A.W., T.K., R.R.T. and M.S.; data curation, M.A.; writing--original draft preparation, M.A.; writing--review and editing, A.W., P.M.R. and M.S.; visualization, M.A.; supervision, P.M.R., R.R.T. and M.S.; project administration, M.S.; funding acquisition, M.S. All authors have read and agreed to the published version of the manuscript.  
**Funding:** This research was funded by the 3D Packaging Research Center (PRC) at Georgia Institute of Technology.  
**Data Availability Statement:** The original contributions presented in this study are included in the article. Further inquiries can be directed to the corresponding author.  
**Acknowledgments:** The authors would like to thank Taiyo Ink Mfg. Co., Ltd., for supplying the low-loss dielectric films and AGC Inc. for providing the glass substrates. They also wish to acknowledge the members of the industry consortia program at Georgia Tech Packaging Research Center for their support.  
**Conflicts of Interest:** The author [PERSON] was employed by the company Apple Inc. The author [PERSON] was employed by the company IBM Corporation. The author [PERSON] was employed by the company Taiyo Ink Mfg. Co. The remaining authors declare that the research was conducted in the absence of any commercial or financial relationships that could be construed as a potential conflict of interest.