###### Abstract
Our research addresses the challenges posed by the automation of the manufacturing and validation processes, especially in SOIC package handling capable of withstanding high stresses. The proposed study aims to improve the efficiency and accuracy of high-stress testing methods by addressing the complex hydrodynamic interactions that develop during the movement of these packages in dielectric fluids and optimizing the testing process. We addressed the problem of establishing the maximum speed at which a DUT can be displaced to prevent exceeding the maximum misalignment allowed for SOIC packages during automated insertion and removal from a zero-insertion force (ZIF) socket immersed in a dielectric fluid. Our approach was to understand and quantify the factors affecting such a misalignment, focusing on the interactions occurring during the DUT movement into, inside, and out from the fluid. We characterized stress forces, splashes, cavity formation, and surface waves that limit the speed and precision of their manipulation. We hypothesize that it is possible to predict the resulting misalignment based on an analysis of the physical properties of the dielectric fluid and its interaction with the SOIC packages. This research used a methodology that involves the creation of an innovative mathematical model for the automated testing of SOIC packages in dielectric fluids, integrating mechanical and hydrodynamic aspects with standardized test procedures and thorough reliability assessments. It includes a comprehensive evaluation of the insertion, extraction, and displacement processes for SOIC packages in various dielectric fluids. The methodology involves the construction of a specialized automated mechanical platform designed for precision testing, incorporating thermal control of the dielectric fluids. It also involves meticulous data collection and the application of comprehensive statistical methods, such as analysis of variance and frequency distribution, through a full factorial experimental design to confirm the validity of the model. This research is an important step forward in high-voltage IC testing, particularly in automated SOIC package handling in dielectric fluids. This study achieves an exceptional reliability of 99.64% with a margin of error of less than 4.78%. This study is notable for the implementation of a forward automated system that achieves vertical movementsat a speed of 0.2882 m/s and is characterized by its ability to consistently manipulate packages quickly and accurately. In addition, this research contributes significantly to the standardization of calculations for optimum test speeds and highlights the limitations of high-speed package handling. The rest of this document is organized as follows: Section 2 establishes the theoretical foundations for the model. Section 3 describes the development of the mathematical model for hydrodynamic force analysis. The following section discusses the statistical model validation and the results from the model application and assesses model consistency and repeatability. The final sections compare misalignment speeds across various models and summarize the essential conclusions and implications.