## 1 _Eiditorial_
### [PERSON] 1,*(r) and [PERSON] 2,*
This technological breakthrough means that photonic integrated circuits can now process and transmit optical signals in the same way that electronic integrated circuits process and conduct electrical signals. These circuits have the characteristics of large bandwidth, low latency, low power consumption, and low interference. Photonic integrated chips work by using photons to sense, process, and transmit information [9]. Using waveguides to control light, photonic integrated chips are comparable to the wires used to transmit electrical signals through total internal reflection. With waveguide connections, multiple components can be integrated and fabricated on a single substrate, creating robust and miniaturized solutions. Components in photonic integrated circuits can be passive and active. Examples of passive components are switches and multiplexers and filters. Active components include detectors and lasers as well as modulators and detectors. Typically, on-chip integrated photonic waveguide devices include Mach-Zehnder interferometers, microrings/disks, waveguide gratings, couplers and other structures that provide a platform for on-chip photonic manipulation [10]. In the field of communications, array waveguide gratings (AWGs) are typical examples of photonic integrated chips, which are often used for the optical multiplexing and demultiplexing of wavelength division multiplexing (DWDM) fiber optic communication systems. The state-of-the-art on-chip electro-optical modulators are also based on Mach-Zehnder interferometers [11]. In automotive and materials manufacturing, IP can be used to monitor a vehicle's surroundings through sensor systems such as lidar (light detection and ranging). The technology also facilitates communication between vehicles and city infrastructure to improve driver safety. In the field of quantum computing, the proposal and development of optical computers is attributed to their potential advantages. Photons are different from electrons, as photons belong to bosons, do not carry electricity, and beams can pass in parallel or cross each other without affecting each other, with innate giant parallel processing ability [12]. With the gradual development of photonic integration and the increasing demand for photonic integration, the photonic integration of single materials can no longer meet the actual application requirements. At the same time, hybrid photonic integration occupies a place in photonic integration because of its simple and flexible implementation and independent fabrication between devices. It also greatly broadens the development space of photonic integration, meaning that photonic integration systems gain new impetus in technological progress. In silicon-based emission modules, because silicon with an indirect bandgap struggles to emit light, it is often mixed with III-V group or other materials in light-emitting modules. In the future, the advancement of heterogeneous hybrid integration technology will promote the rapid development of photonic chips integrated with multiple functional material platforms. For example, in recent years, a series of new photonic integrated materials have emerged, such as III-V group materials, silicon nitride, lithium niobate, silicon carbide, aluminum nitride and chalcogenide materials [13; 14; 15]. Therefore, photonic integrated devices based on new platform materials have greatly promoted the rapid development of optical information generation, modulation, exchange and processing. Another development direction of IP is on-chip optoelectronic hybrid integration, which not only integrates photonic devices into one module, but also includes electronic de vices.