## 1 Introduction  
After one hundred years of development, radar technology has undergone multiple evolutions and is achieving increasingly higher system performances. Compared with the continuous innovations of stealth technology, radar technology has also made new progress. Among them, phase array radar may track targets within a radar cross-sectional area of less than 0.01 m\({}^{2}\) and has been widely used in large ground-to-air defense radar and small airborne radar. Nowadays, phase array radar is developing towards high-power Active Electronic Scanning Arrays (AESA), as the performance requirements of national defense weapon systems continue to increase, meaning that their miniaturization and multifintentioning have become the basic performance items required by contemporary radar systems. With the increasing number of electronic components used in a radar system and the increasing demand for the operating power, a large number of high-power components must operate in a narrow, closed, and convection-free environment. Without a proper heat dissipation mechanism, the internal temperature of the system will rise sharply, which may damage the electronic components, thus affecting the reliability of the system. In other words, a high-performance heat dissipation mechanism is vital for ensuring the normal operation of the system and improving its work efficiency, and it is also a key technology for the effective operation of contemporary weapon systems. Communication and electronic equipment technologies have developed rapidly, and the operating power of electronic modules has continuously increased. However, the product volume has gradually decreased. This has resulted in a steep rise in heat or non-uniform temperature distribution in the system, failing functions, or degraded performances. Therefore, the performance of heat sinking has become a very important key technology in the research and development of electronic equipment. With the improving efficiency of electronic modules, the traditional heat sinking method can no longer meet the requirements of the systems for high power or high heat flux; thus, it is unable to maintain the safe operating temperature of the chips. In order to solve the above problem, high-performance cooling schemes, such as air cooling, liquid cooling, and Phase-Change Materials (PCMs), have been developed and studied. The advantage of a liquid cooling system is that the liquid has a much higher thermal conductivity than air and a better heat transfer stability than PCM. Liquid cooling methods include direct/indirect liquid cooling, liquid-vapor phase cooling, and vertical liquid jet impingement cooling [1; 2]. A liquid cooling system should have a good cooling capacity, but it requires multiple parts with complete functions, including key parts and components such as cold plates, heat exchangers, fans, pumps, and water tanks. Therefore, the challenges involving such a system include complexity, high cost, and potential liquid leak problems. A cold plate performs heat sinking by indirect contact between the heat source and the cooling fluid. It is a feasible scheme for high heat flux electronic modules and it has been extensively used in military and commercial electronic devices. In the case of press-pack and high-power operations, the cooling performance of a cold plate is the key factor in an electronic system's performance, and so the optimal design of a cold plate is of great importance [1]. A cold plate is generally composed of hollow channels that can be installed on the surface of an electronic heat source and that allow the coolant to flow through it, so as to reach the required cooling rate. In addition, single-phase forced convection enhancement techniques (e.g., the jet impingement technique and the multi-domain modeling framework) are used for quick cooling [1; 2; 3; 4].