## 3 Results
### ITO Film Structure  
Figure 4 illustrates the X-ray diffraction patterns of ITO film before oxygen plasma treatment (As-deposited: ASD) and after oxygen plasma treatment at a flow rate of 20,  
Figure 3: Processing of oxygen plasma bombardment to the ITO\(-\)nanorod surfaces driving under bias\(-\)magnetron RF sputtering method with different gas conditions of 20, 40, 60, 80, and 100 sccm. Figure 2: Bias-magnetron RF sputtering mechanism used for oxygen plasma treatment on ITO-nanorod film under different oxygen gas flow rates of 20, 40, 60, 80, and 100 sccm. 60, 80, and 100 sccm as can be seen in the figure; the X-ray diffraction patterns of the ITO surface show diffraction planes at (222) and (440) with 2 of 30.70 and 51.30, respectively. XRD diffraction clearly shows that the formation of ITO films on the substrate become polycrystalline and crystallize in a cubic bixbyite structure, which is referring to the Joint Committee on Powder Diffraction Standards (JCPDS) no. 01-089-4198 [39]. However, the preferred growth of ITO films is the (222) plane, which this orientation depends on the deposition conditions [40]. When considering the intensity of the peaks from all apparent planes (222 and 440), it was found that when the oxygen gas flow rate increased, the crystal structure after plasma treatment changed slightly. The surface analysis of ITO films grown on plasma treatment under different oxygen gas supplies at a flow rate of 20, 40, 60, 80, and 100 sccm was performed using the scanning electron microscopy analysis method. The results of cross-sectional photographs are shown in Figure 5. The photographs show the structure of the films grown on the substrate as nanorods or ITO-nanorods, relating to Figure 3. Similarly, Figure 6 displays the photograph characteristics of the top film surface. The figure shows the apparent changes in the ITO-nanorod surface treated with oxygen plasma. When the oxygen gas flow rate increases to 100 sccm, the crystal size becomes smaller and separated compared to a lower oxygen gas flow rate. The result is due to the influence of plasma etching on the ITO-nanorod surface, which results in breaking ITO bonds and changing the top film layer. Figure 4: X-ray diffraction patterns of ITO films prepared with E-beam evaporation with glancing angle deposition and treated with oxygen plasma of varying oxygen gas, such as 20, 40, 60, 80, and 100 sccm. Figure 5: Cross-section images of FE-SEM analysis on ITO-nanorod deposited on glass substrate treated with oxygen plasma of varying gas flow rates compared with ASD film: (**a**) ASD; (**b**) 20 sccm; (**c**) 40 sccm; (**d**) 60 sccm; (**e**) 80 sccm; (**f**) 100 sccm. Figure 6: Top-image of FE-SEM analysis (top view) of an ITO-nanorod deposited on glass substrate treated with oxygen plasma of varying gas flow rates compared with as-deposited film: (**a**) ASD\({}_{2}\) (**b**) 20 sccm; (**c**) 40 sccm; (**d**) 60 sccm; (**e**) 80 sccm; (**f**) 100 sccm. To further investigate the topography of the ITO-nanorod surface treated with oxygen plasma, Figure 7 illustrates the AFM images. The AFM images in Figure 7 show the formation of nanorod structures in the different variations of film roughness with sizes of 1.00 \(\upmu\)m \(\times\) 1.00 \(\upmu\)m. As can be seen, there has been a deep hole and roughness on the surface of ITO films. To explore in more detail, a convex area is formed by the deposition of a high-density ITO-nanorod film prepared by E-beam evaporation with the glancing angle deposition method, and the dark color is formed by the treatment of the film surface with oxygen plasma, thus forming a concave area on the film surface. According to Figure 6, the size of the nanorod decreases with the increasing oxygen flow rate, especially at 100 sccm with the size of 49 nm.