# Reliability Prediction of Mixed-Signal Module Based on Multi-Stress Field Failure Mechanisms
## 7 Conclusions  
This article presents a multi-physics reliability-prediction method for mixed-signal communication modules. By integrating hybrid-precision simulation with multi-stress field coupling modeling, this method extracts model parameters for performance degradation and functional failure, improving the accuracy of reliability prediction under complex operating conditions and in turn enhances the accuracy and applicability of the communication module's reliability analysis. The main contributions are as follows:  
Identification of key components and failure mechanisms: Based on environmental adaptability analysis, the key components in the communication module (resistor, FPGA, SRAM) and their main failure mechanisms are identified. These mechanisms include PMOS threshold voltage degradation due to NBTI effects and solder joint fatigue failure, and the corresponding Physics of Failure models are established. Hybrid precision circuit simulation model: A hybrid-precision circuit simulation model for the communication module is constructed. Verilog is used to model the integrated components and their IBIS ports. Performance degradation and functional failure modes are simulated under electrical stress using a Verilog-SPICE heterogeneous simulation framework. \begin{table}
\begin{tabular}{c c c c c c} \hline \hline \multirow{2}{*}{**Method**} & **Prediction** & \multirow{2}{*}{**Modeling Dimension**} & **Dynamic** & **Component Level** & \multirow{2}{*}{**Applicable Scenarios**} \\  & **Error** & & **Feedback** & & **Failure Mechanism** & \\ \hline MIL-HDBK-217 [11] & \(\pm\)20\% & \begin{tabular}{c} Single stress field \\ (thermal/electrical) \\ \end{tabular} & Not have & Not have & \begin{tabular}{c} General \\ electronic system \\ \end{tabular} \\ \hline Bayesian network [13] & \(\pm\)15\% & \begin{tabular}{c} Multi stress field \\ (probabilistic coupling) \\ \end{tabular} & Static state & Limited & \begin{tabular}{c} Complex \\ system-level analysis \\ \end{tabular} \\ \hline PoF-RBD [10] & \(\pm\)12\% & \begin{tabular}{c} Multi stress field \\ (linear superposition) \\ \end{tabular} & Static state & \begin{tabular}{c} Partial (only performance degradation) \\ \end{tabular} & \begin{tabular}{c} Industrial \\ electronic module \\ \end{tabular} \\ \hline Proposed method & \(<\)10\% & \begin{tabular}{c} Load-transfer multi-stress \\ field coupling \\ \end{tabular} & Dynamics & \
\begin{tabular}{c} Comprehensive \\ (degradation + failure) \\ \end{tabular} &
\begin{tabular}{c} Aerospace \\ communication \\ module \\ \end{tabular} \\ \hline \hline \end{tabular}
\end{table} 
Table 7: Comparison of reliability-prediction methods for communication modules. Electro-thermo-mechanical multi-stress coupling model: A multi-stress field coupling model is developed to simulate the multiple stresses acting on the components. The influence of electrically induced temperature distribution on the stress-strain characteristics of solder joints is studied, and equivalent plastic strain curves are obtained. A coupled simulation is used to transfer thermal and mechanical simulation results to the electrical simulation. Dual-modal reliability prediction process: A dual-modal reliability-prediction process is proposed, combining performance degradation and functional failure. The performance-degradation trend is predicted based on threshold voltage drift, and the functional failure risk is assessed based on solder joint plastic strain accumulation. Reliability prediction for the communication module under a given mission profile shows that the FPGA solder joint becomes the dominant factor for system reliability after an 11-year mission cycle, providing a theoretical basis for targeted reinforcement design. Future research will further expand to more complex failure mode analysis.