## 1 Introduction  
Glass is widely used in various fields because it is highly light-permeable and biochemically stable. In particular, the recent development of electronic devices has led to an increasing demand for technologies to manufacture conductive circuit patterns on glass surfaces in various fields, including automobiles, shipbuilding, and aviation, as well as optical devices, displays, and biochips. Based on these technologies, a touch screen of a smartphone and a large number of applications such as defrostring of large glass and a transparent antenna is being developed. However, due to the high hardness and chemical stability, which are the advantages of glass, there are many difficulties producing conductive structures [1, 2, 3]. The most widely used method to form a conductive structure on glass is indium tin oxide (ITO). This is because the ITO material itself is conductive and has excellent light permeability, which conforms to the characteristics of glass. In most cases, the entire glass surface is sputtered with ITO material, and then a portion of it is removed by wet etching or laser to produce the desired conductive structure [4]. However, the conductive structure produced by this process has the disadvantage of having low conductivity and complex processes, resulting in many constrains such as size limitations and high costs [5]. On the other hand, paste printing based on inkjet technology has been recently conducted a lot of research because of the advantage of easily forming a large-area conductive pattern. Inparticular, various research cases are being published as it becomes possible to implement fine line widths based on continuous material development [6]. In addition, the process environment is easy to control, and the post-treatment is simple, so it has excellent productivity and economic feasibility. However, due to the limitation of the paste material, adhesion to the smooth base material is low, and the formation of the conductive structure is limited in non-planar shapes. For this reason, a lot of research has been conducted on selectively depositing a metal after fabricating a pattern on glass using a laser [7; 8; 9]. Representatively, there is a case in which a pattern that has a very thin line width is fabricated on glass using a femtosecond laser. Then a conductive structure is deposited using a change in surface roughness caused by laser processing [10; 11]. Since the deposition process is a parallel process, economic large-scale mass production may be possible. In addition, since a very thin line width is possible, it can be used for a micro-total analysis system (\(\mu\)-TAS) or a lab-on-a-chip (LOC) in bio-nano-engineering. However, since an anchor effect performs selective deposition according to roughness change, there is a limitation that it is possible to mainly use materials with high SiO\({}_{2}\) content. There is a limit to practical use due to the high price and low productivity of the femtosecond laser equipment. There is also a case of forming a selective conductive structure after forming a micro pattern and a metal seed on glass through a laser-induced backside wet etching (LIBWE) process based on an inexpensive nanosecond infrared laser [12]. Although the line width was somewhat wider than that of femtoseconds, it could form a more economical and stable conductive structure. However, this process has a disadvantage in that the complexity of the process is high and stability is poor because the process must be carried out in two or more steps. Therefore, laser-induced chemical liquid phase deposition (LCLD), which integrates the deposition process after glass processing into one process, has been widely studied. This is because the process configuration is similar to that of LIBWE, so that some glass processing occurs. At the same time, by using a deposition solution containing a reducing agent as a chemical solution, the deposition of a conductive structure is carried out in one process.