## 1 Introduction  
Greenhouse gases (GHGs) make up about 1% of all atmospheric gases. Many types of GHGs can trap heat in the atmosphere, the most active of which are carbon dioxide, methane, and nitrous oxide. Water vapor is the gas most significant in building the Earth's greenhouse effect. Its concentration alone in the atmosphere, however, does not cause climate change. However, water vapor is an amplifier of these changes because it is responsible for the strongest positive feedback in the climate system. The stronger the feedback, the more heat is trapped, and the feedback increases as other greenhouse gases increase. Water vapor is the only greenhouse gas that is highly dependent on air temperature. The higher it is, the more of it there is in the atmosphere. For this reason, water vapor has been used for many years as an energy carrier in industrial and equipment production processes. It can contain five or six times more potential energy than water of the same mass. It allows energy storage, and the process is easy to control. For years, research has been conducted on a laboratory and industrial scale on the use of vapor for heat transfer. Reasons include the high heat transfer efficiency of steam with a relatively small heat transfer surface area. Silica gel (SG) is an adsorbent often used in commercial applications such as adsorption cooling [1], drying [2; 3; 4], and desalination [5; 6; 7]. It has a low desorption temperature (<373 K) [8; 9; 10], which makes this material very suitable for use in adsorption chillers to utilize waste heat. Water vapor adsorption on silica gel is a physical adsorption phenomenon, and SG adsorption ability is very stable even with a long time of use. SG is also used as an adsorbent due to its high adsorption capacity, reliability, and low cost compared to other adsorbents [11]. Besides, the silica gel-water adsorption system is suitable for the low grade of heat sources [12]. The analysis of the thermal behavior of devices using silica gel was studied by [PERSON] et al. [13; 14]. The authors showed that silica gel is very sensitive to heat and mass transfer inside the adsorbent beds. Several modifications are used to improve the thermal properties of silica gels. Mixtures with various compounds, including nanomaterials, graphite, crystals, or chemical modifications involving the introduction of functional groups [15], can increase silica gels' adsorption capacity to gases. This dependence also applies to thermal and mechanical changes in other mesoporous and macroporous materials [16; 17]. The literature describes the possibility of improving the thermal properties by using an SG composition and materials with high thermal conductivity. To improve the thermal properties of SG as an adsorption bed, some authors analyzed the effect of metallic additives on the adsorption bed. In the paper by [PERSON] et al. [18], the authors noted an increase in cooling capacity and COP of modified chillers caused by metallic additives to the silica bed. In [PERSON] et al. [19], the authors used SG as the basis of the mixture and added helical pieces of metal made of copper, brass, and aluminum and sieved to separate into two fractions: 1.0-2.8 mm and 2.8-4.75 mm. They observed that the addition of 15 wt.% of aluminum chips significantly improved the silica gel bed's thermal diffusivity. In [PERSON] et al. [20], the authors demonstrated a positive effect of the addition of aluminum powder, copper powder, and carbon nanotubes on the thermal diffusivity of the adsorption bed. Due to the nature of adsorption aggregates' work, it was essential to study the possibility of water vapor adsorption. Vapor adsorption by RD silica gel was investigated by [PERSON] [21]. The test results showed the maximum sorption capacity at the tested temperature (300 K) of about 0.315 wt.%. The results of other authors also reported poor adsorption of vapor [22; 23; 24].