###### Abstract  
The efficient testing and validation of the high-voltage (HV) insulation of small-outline integrated circuit (SOIC) packages presents numerous challenges when trying to achieve faster and more accurate processes. The complex behavior these packages when submerged in diverse physical media with varying densities requires a detailed analysis to understand the factors influencing their behavior. We propose a systematic and scalable mathematical model based on trapezoidal motion patterns and a deterministic analysis of hydrodynamic forces to predict SOIC package misalignment during automated high-voltage testing in a dielectric fluid. Our model incorporates factors known to cause misalignment during the maneuvering of packages, such as surface tension forces, sloshing, cavity formation, surface waves, and bubbles during the insertion, extraction, and displacement of devices while optimizing test speed for minimum testing time. Our model was validated via a full-factorial statistical experiment for different SOIC package sizes on a pick-and-place (PNP) machine with preprogrammed software and a zero-insertion force socket immersed in different dielectric fluids under controlled thermal conditions. Results indicate the model achieves 99.64% reliability with a margin of error of less than 4.78%. Our research deepens the knowledge and understanding of the physical and hydrodynamic factors that impact the automated testing processes of high-voltage insulator SOIC packages of different sizes for different dielectric fluids. It enables improved testing times and higher reliability than traditional trial-and-error methods for high-voltage SOIC packages, leading to more efficient and accurate processes in the electronics industry. high-voltage testing; surface-mount devices (SMDs); dielectric fluid hydrodynamics; SOIC package misalignment +
Footnote †: journal: Applied  
Recent research in electronics manufacturing and testing has made significant strides, particularly in dielectric fluids and IC manipulation studies. [PERSON] et al. studied the breakdown voltage of dielectric oils and underscored the superior performance of FR3 over mineral and vegetable oils in high-voltage applications [7]. [PERSON] et al. complemented this finding with research on the aging of natural vegetable oils, demonstrating that oils like FR3 possess greater dielectric strength and better dissipation factors, albeit with susceptibility to changes due to humidity, oxidation, and viscosity over time [8]. As for integrated circuit testing, [PERSON] et al. delved into the resilience of insulators in FR3 fluid, a crucial step in preventing electrical arcing and IC damage [2]. Likewise, the employment of pick-and-place machines in the manipulation of electronic components has been the focus of numerous studies in technical literature, underscoring the importance of precision, timelines, and speed engineering algorithm manipulation [9; 10; 11; 12; 13; 14]. Parallel advancements in micromanipulation technologies have also helped improve the field. [PERSON] et al. worked on the development of thermodynamic microgrippers, which have played a pivotal role in precise component placement within fluids [15]. Their work sparked further interest in precision studies, such as those led by [PERSON] et al., who explored the integration of vision systems in pick-and-place systems for parallel system assembly [16]. Together, these studies highlight the crucial need for ongoing innovation and refinement in high-voltage IC testing methods, underscoring the importance of material properties, precision engineering, and advanced test methods for reliable and efficient IC test and electronic systems development. The previously reviewed studies, however, do not provide information on how to establish a speed at which a package can travel in a dielectric fluid without exceeding the maximum allowed misalignment to guarantee successful insertion into the test socket or for successful removal, preventing detachment from the pneumatic holder.