## 5 Advanced Setups  
In this section, we highlight recent literature reports on advanced setups for the effective transfer of 2D materials and the formation of van der Waals (vdW) heterostructures. The advancements are primarily in two key areas: the development of \"cleanroom in a glovebox\" systems, where most, if not all, stages of device fabrication are performed entirely  
Figure 6: Low-cost transfer setup with DIY glovebox integration ([PERSON] et al. [83]). (**a**) Photographs captured during placement of the glovebox over the transfer system (**i**) and the front, rear, and top views obtained thereafter (**ii–iv**). The top view was obtained while the glovebox is under operation. The inset shows a schematic of the vent port (for the gas outlet) arrangement. (**b**) BP flakes exfoliated outside (**i**) and inside the glovebox (**ii**) with visible damage seen after 24 h when exfoliation is performed in ambient conditions, and no visible damage on the BP flakes when exfoliation is performed within the glovebox (**c**) Data showing the rate of drop in RH and O2 levels under different nitrogen gas flow conditions of purging and operation of the glovebox. The rise of these parameters post-shutting off the inert gas supply are captured for conditions when the vent valve is left open or close. (**d**) High-resolution optical images of graphene on hBN and MoS2 on hBN, realized using the capillary wetting approach. (**e**) High-resolution optical image of assembled source and drain contacted BP devices (device 1 (**top**) and device 2 (**bottom**)) topped with a protective hBN layer. (**f**) Optical images of encapsulated devices obtained using the hot-pick up approach: (**i**) hBN encapsulated graphene, (**ii**) hBN-encapsulated MoS2, (**iii**) hBN-encapsulated BP, and (**iv**) graphene encapsulated by MoS2 and hBN, obtained via a combination approach. (**g**) Twisted MoS2 devices with various twist angles (**i–iii**), and twisted MoS2 on hBN (**iv**). Adapted from [83] under the CC BY-NC-ND 4.0 license.  
within a controlled glovebox environment, and the development of robotic searching and assembly systems that circumvent the challenges associated with manual methods discussed in previous sections. These advancements are crucial for the future of vdW devices and technologies. While 2D material searching and stacking have become more common, contamination issues during fabrication steps, such as lithography, plasma etching, metal evaporation, sample characterization and probing, remain significant. These issues can degrade sample quality, especially for air-sensitive materials, as samples are inadvertently exposed to the ambient environment between fabrication steps.  
Similarly, robotic automation setups [73; 85] for 2D material searching and stacking play a pivotal role in the fabrication of vdW heterostructures. Traditionally, this process involves manual exfoliation to obtain the desired flakes and manual transfer to build the heterostructures. This manual approach is time-consuming, labor-intensive, and highly dependent on the operator skills, leading to variability in the quality of the resulting structures. Additionally, performing these tasks inside a glovebox system, necessary to maintain an inert atmosphere for certain sensitive materials, further complicates the manual process.  
Automation addresses these issues by utilizing robotic systems equipped with machine vision and artificial intelligence (AI). These systems can identify and select the optimal flakes based on predefined criteria, significantly reducing the time and effort required for material preparation. Furthermore, automated transfer systems ensure consistent and precise placement of flakes, minimizing human error and improving the reproducibility of the heterostructures. The integration of AI and automation in this process allows for the rapid assembly of complex vdW heterostructures, which are essential for various advanced applications in electronics, photonics, and quantum technologies.