## 6 Outlook and Future Directions
In the context of developing more effective transfer setups, solving the spatial cross-contamination problem of unwanted 2D material crystal flakes on the transfer substrate and yielding good quality flakes is of particular interest. This is a parasitic effect that is often caused by other transfer methods, and eliminating this enables chip-industry-like repeatability [90]. In recent work, [PERSON] et al. [90], introduced a unique two-dimensional material transfer system (2 DMTS) designed to address the persistent challenges in 2D material transfer processes. This innovative system, shown in Figure 13, leverages a viscoelastic polymer combined with a metal micro-transfer stamper, enabling exceptionalprecision and reliability in transferring 2D materials. The micro-stamper offers several key advantages: it allows for selective transfer by ensuring that only the desired material flake is picked up and placed, thereby eliminating cross-contamination. This precision is crucial in applications requiring high purity and accuracy, such as in the fabrication of optoelectronic devices. The high spatial accuracy of the reported system, up to 0.7 \(\upmu\)m, is the highest reported to date without cross-contamination. Additionally, the micro-stamper design facilitates the transfer of flakes of varying sizes and shapes without causing damage, thanks to the controlled and gentle contact pressure. This method also enables rapid prototyping without involving wet chemical processes or thermal steps, preserving the intrinsic properties of the 2D materials. By overcoming the limitations of previous methods, the 2 DMPS system significantly enhances the efficiency and yield of 2D material transfers, making it a vital tool for advancing research and commercial applications in photonics, electronics, and beyond. The potential in developing modified micro-manipulator setups is further highlighted in a more recent work [91], where the authors have created a transfer system for the cryogenic dry exfoliation, pick-up, and transfer of superconducting vdW heterostructures such as BSCCO, CrI3, and NbSe2. These materials are known for their chemical sensitivity, which leads to rapid degradation. For instance, BSCCO quickly deteriorates due to the adsorption of water molecules [129; 130]. Consequently, fabricating heterostructures involving BSCCO using standard PPC/PC and PDMS stamp methods has faced limitations in controlling these conditions, making the fabrication of twisted BSCCO devices particularly challenging [131]. The developed setup (Figure 14) features a low-temperature stage with a copper surface connected to a liquid nitrogen circulation system via PTFE tubes, allowing precise cryogenic control of the sample. The cryogenic exfoliation technique employs a hemispherical PDMS stamp, enabling the re-exfoliation of thicker BSCCO flakes that were initially mechanically exfoliated on a SiO2/Si chip using scotch tape. The re-exfoliated flake is then immediately transferred onto the remaining flake on the substrate to form the twisted BSCCO junction at \(-120\)\({}^{\circ}\)C. This method leverages the glass transition of PDMS for clean cleaving and stacking, avoiding external mechanical force and PDMS residues common in conventional dry transfer methods. The effectiveness of this method in preserving the interfacial and superconducting properties of BSCCO crystals was demonstrated through transport measurements. Additionally, the versatility of the setup was shown by successfully forming twisted CrI3 and NbSe2 heterostructures. Figure 13: _Cont._  
However, this method also presents drawbacks, including the complexity and cost of maintaining cryogenic conditions and the potential for nitrogen condensation, which can affect transfer quality. Moreover, attempts to re-exfoliate other common 2D materials, such as MoS2, WSe2, and GeBi2 Te4, were unsuccessful. Despite these challenges, the setup marks a significant step forward in the reliable fabrication and study of vdW heterostructures.