## 1 Introduction  
In recent years, with the rising status of intelligent manufacturing in national strategies, the large-scale development and application of additive manufacturing (AM) technology have become key drivers of industrial transformation upgrading and sustainable development. Binder jetting (BJ) technology was originally developed in the early 1990s by researchers at the Massachusetts Institute of Technology [1]. With the rise of industry 4.0, modern AM systems integrate computer-aided design and materials processing and encompass various formation technologies, making them a key research area that has been applied in fields such as medical pharmaceuticals [2], aerospace [3], and construction [4]. Numerous cases of and demands for AM applications demonstrate their vast development potential across various sectors. However, strengthening standardization and certification systems to ensure product quality and reliability [5], as well as optimizing printing parameters and strategies to improve efficiency and overcome size constraints while maintaining product quality [6], remain challenges that AM needs to address. Additionally, ongoing exploration of new materials and processes will provide more options and broader applications, ultimately reducing production costs. In recent years, research on AM using ultrafine silicon carbide (SiC) powder has garnered widespread attention. With its outstanding properties, SiC offers more flexible, economical, and efficient solutions compared to traditional manufacturing, showing great potential in the industrialization of AM. Currently, SiC materials are widely used across multiple sectors due to their superior properties [7]. High saturated electron velocity and significantly enhanced thermal conductivity make SiC the foundation of most global production of green, blue, and ultraviolet light-emitting diodes [8], and it has applications in electric vehicles, photovoltaic power generation, rail transportation, data centers, and charging infrastructure. Moreover, SiC's high thermal conductivity, hardness, excellent chemical corrosion resistance, and exceptional temperature tolerance make it suitable for use in high-temperature and harsh environments, such as in cladding for fusion reactors [9] and materials for aerospace engine combustion chamber liners, combustion chamber barrels, and nozzle guide vanes [10; 11]. These achievements align with SiC's outstanding theoretical and practical value, making the future of the SiC industry brighter than ever before. However, conventional SiC manufacturing technologies are mostly based on powder processing techniques such as compression forming and isostatic pressing, which are usually limited to the production of geometrically simple components [12]. For SiC components with complex geometries, conventional technologies require expensive and time-consuming molds. In contrast, AM technology offers a new solution for producing complex SiC components, such as stereolithography (SLA) [13], digital light processing (DLP) [14], selective laser sintering (SLS) [15], material extrusion (MEX) [16], and binder jetting (BJ) [17]. Figure 1 illustrates the schematic diagrams of the forming processes for the SLA, SLS, DLP, and MEX technologies. At the same time, Table 1 presents the printing mechanisms of SLA, DLP, SLS, and MEX, as well as the current status of SiC component manufacturing. Figure 1: Schematic illustration of additive manufacturing processes applicable to SiC component fabrication. (**a**). The forming process of SLA. (**b**). The forming process of SLS. (**c**). The forming process of DLP. (**d**). The forming process of MEX. Cited from [18, 19, 20, 21].