# Prediction of Microwave Characteristic Parameters Based on MMIC Gold Wire Bonding
## 2 Model and Analysis
### Simulation Results and Analysis  
The return loss is the ratio between the energy lost due to the reflection of the signal in the transmission process and the energy of the input signal [25]. A comparison of the return loss simulation results is shown in Figure 3 below. This conclusion can be obtained from the comparison result graph: as the arch height and span increase, the resonance point is shifted to the lower frequency, and the return loss is below \(-15\) dB in the X-band (8-12 GHz), and at the resonance point near the center frequency of 10 GHz, it reaches \(-52\) dB, which indicates a good matching performance. Figure 3: Comparison of simulation results of return loss of bonded alloy wires under different arch heights and spans, they should be listed as: (**left**) Comparison of simulation results of return loss of bonded alloy wires with different spans schematic diagrams. (**right**) Comparison of simulation results of return loss of bonded alloy wires with different arch heights schematic diagram. Figure 2: Diagram of the structural model of wire bonding interconnect. They should be listed as: (**above**) A top view of the model. (**below**) A section view of the model. Insertion loss is the ratio of the output signal to the input signal, the larger the value, the smaller the transmission loss of the signal and the better the electromagnetic shielding effect [26]. A comparison of the insertion loss simulation results is shown in Figure 4 below. The conclusion can be obtained from the comparison result graph: with the increase in arch height and span, the loss increases gradually, especially in 10-12 GHz is more obvious, but its microwave transmission characteristics still meet the design requirements, and at the resonance point near the center frequency of 10 GHz, it reaches \(-0.07\) dB. The closer the VSWR is to 1 indicates that most of the energy is transmitted to the T-match network through our designed gold filament, and only a small portion of the energy stays in the chip in the form of standing waves [27]. The VSWR comparison results are schematically shown in Figure 5 below: with the increase in arch height and span, the VSWR is better than 1.45 dB throughout the X-band (8-12 GHz), in the close to the center frequency of 10 GHz At the resonance point near the center frequency of 10 GHz, it is even closer to 1.05 dB, which is an excellent performance. Figure 4: Comparison of the simulation results of insertion loss of bonded alloy wires under different arch heights and spans, they should be listed as: (**left**) Comparison of simulation results of insertion loss of bonding alloy wires in different spans. (**right**) Comparison of simulation results of insertion loss of bonding alloy wires under different arch heights schematic diagram. Figure 5: Comparison of simulation results of VSWR of bonded alloy wires under different arch heights and spans, they should be listed as: (**left**) Comparison of VSWR simulation results of bonded alloy wires with different spans schematic diagram. (**right**) Comparison of simulation results of VSWR of bonded alloy wires with different arch heights. Bonded wire interconnect circuit is a two-port reciprocal network, according to the microwave network theory can be obtained from the conclusion: S11 = S22, S12 = S21, there are different cases, in high-speed circuit design used in microstrip line or ribbon line, have a reference plane, for the asymmetric structure (but the parallel two-conductor line is a symmetric structure), so the S11 is not equal to the S22, but to meet the conditions of reciprocity, there is always S12 = S21 [28].