## 5 Advanced Setups
### Setups with Robotic Automation
\begin{table}
\begin{tabular}{c c c c} \hline \hline
**Reference** & **Transfer Methods** & **vdW Heterostructures/** & **Key Features/Advantages/Limitations** \\  & **Employed** & **Devices Formed** & -High-quality optics and manipulators, -Glovebox compatible, -Motorized stages required; not suitable \\ \hline \multirow{4}{*}{[PERSON] et al. [96]} & \multirow{2}{*}{Dry} & few-layer graphene/hBN & -High-quality optics and manipulators, -Glovebox compatible, -Motorized stages required; not suitable \\  & & 2L-MoS\({}_{2}\)/Mica & for manual \\  & & hBN/2L-MoS\({}_{2}\)/hBN & operation \\  & & & -High-cost and complexity \\ \hline \multirow{4}{*}{[PERSON] et al. [82]} & \multirow{2}{*}{Dry} & \multirow{2}{*}{hBN/BP/hBN} & -Gloveless glovebox, -User-friendly, manual operation, suitable for air-sensitive materials integration, -High-cost due to commercial glovebox -Upgradeable \\  & & & -Upseradeable \\ \hline \multirow{2}{*}{[PERSON] et al. [81]} & \multirow{2}{*}{Dry} & InSe on Au contacts & -Low-cost (\(-\)USD 1000), -Limited to viscoelastic transfer \\  & & hBN/InSe/InBN & -Limited to viscoelastic transfer \\ \hline \multirow{4}{*}{[PERSON] et al. [102]} & \multirow{2}{*}{Dry} & Sr\({}_{x}\)Bi\({}_{2}\)Se\({}_{3}\) on Au contacts & -Low-cost, -Hated stage control for hot pick-up \\  & & & hBN/MoS\({}_{2}\)/hBN & -Leadet stage control for hot pick-up \\ \hline \multirow{4}{*}{[PERSON] et al. [83]} & \multirow{4}{*}{Dry} & hBN/graphene/hBN & -Low-cost, all-in-one setup \\  & & hBN/BP/hBN & -DIY glovebox integration, -Easy operation, user friendly, -Upgradeable -Versatile vdW heterostructure formation \\  & & & -Upseradeable \\  & & & -Versatile vdW heterostructure formation \\  & & & -including \\ \cline{2-4}  & Combination & graphene/hBN/MoS\({}_{2}\) & air-sensitive materials \\ \hline \multirow{4}{*}{[PERSON] et al. [84]} & \multirow{4}{*}{Dry} & \multirow{4}{*}{HFS\({}_{2}\) FET} & -4-way integrated glovebox with dry -transfer, lithography, metal evaporation, and electrical probing performed under vacuum, -Advanced system, -High cost and complexity \\ \hline \multirow{4}{*}{[PERSON] et al. [86]} & \multirow{4}{*}{Exfoliation} & Bi\({}_{2}\)Sr\({}_{2}\)CaCu\({}_{2}\)O\({}_{8+\delta}\) on Ga\({}_{1-x}\)Mn\({}_{x}\)As & -*Cleanroom in a glovebox” concept, with direct-write lithography, metal evaporation, 2D material transfer, and material characterization, -UHV suitcase for device transfer, -High cost and complexity \\ \hline \multirow{4}{*}{[PERSON] et al. [87]} & \multirow{2}{*}{Dry} & hBN/BP/hBN & -Low-cost version of cleanroom in a glovebox, -Modular, Upgradeable \\  & & EuCuSrFe\({}_{4}\)As\({}_{4}\) (Fe-based superconductor) & -Modular, Upgradeable \\ \hline \multirow{4}{*}{[PERSON] et al. [85]} & \multirow{4}{*}{Dry} & G/hBN vdW superlattice -hBN/tri-layer-graphene/hBN & -Robot automated 2D material searching and stacking, -High throughput, scalable -vdW superlattice stacking \\  & & hBN/WS\({}_{2}\)/hBN & -High throughput, scalable -vdW superlattice stacking \\ \hline \multirow{4}{*}{[PERSON] et al. [88]} & \multirow{2}{*}{Dry} & MoS\({}_{2}\) superlattice -Robot automated stacking, -Wafer scale, precise stacking -High throughput, scalable -vdW superlattice stacking \\ \cline{1-1}  & & MoS\({}_{2}\)/WS\({}_{2}\) superlattice -VdW superlattice stacking \\ \hline \hline \end{tabular}
\end{table} 
Table 1: Summary of 2D material transfer systems reviewed in this work.