# A Survey on Mission-Profile-Based Stress Testing of Electric Motor Drives
## 5 Conclusions  
This paper provides a survey of scientific literature that deals with mission-profile-based stress testing. To properly test EMD components, it is necessary to develop testing procedures that accurately replicate operational conditions and the stress factors to which the components are exposed throughout their lifetime. By analyzing these factors, methods have been developed to assess and enhance the reliability and longevity of the system. Based on the literature review, there is a lack of comprehensive procedures that test and improve the reliability and useful life of the entire system, as existing solutions primarily focus on testing individual components. An important aspect of the analysis was to identify and categorize the stress factors that make up a mission profile. These factors can be divided into electromagnetic and \begin{table}
\begin{tabular}{c c c c} \hline
**Reference** & **Method** & **Component** & **Results** \\ \hline
[97] & ATC and power routing & VSI (IGBT module) & Lifetime increased from 13.24 to 14.74 years \\ \hline
[98] & ATC, switching frequency, and current control & VSI (IGBT module and diode) & Decreased junction temperature swings \\ \hline
[99] & ATC and switching frequency change & VSI (IGBT module) & Lifetime increased from 3.35 to 9.77 years \\ \hline
[100] & ATC and optimal phase angle & VSI (IGBT module) & Reduced temperature from 77 \({}^{\circ}\)C to 68 \({}^{\circ}\)C and up to 15\% reduction in thermal stress \\ \hline
[101] & ATC and DC-link voltage control & VSI and PMSM & Reduced PMSM and VSI losses and decreased junction temperature swings \\ \hline
[102] & ATC and VSI chip size modification & VSI and semiconductor chip & Chip size reduced to 85.5\% of the original while maintaining the same reliability \\ \hline
[103] & ATC and MPC & VSI (IGBT module) & Thermal cycling reduced by 40\% \\ \hline
[104] & ATC and MPC & VSI (IGBT module and diode) & Decreased junction temperature swings \\ \hline
[106] & Restarting algorithm for IMD and frequency search & Induction motor & Decreased intrusion currents and reduced mechanical stress \\ \hline
[107] & Back-EMF-based current controller for IMD restart & Induction motor & Eliminated restart current and reduced thermal stress \\ \hline
[108] & Restarting of IMD and DC current injection method & Induction motor & Decreased intrusion currents and reduced mechanical stress \\ \hline
[109] & Survivability-based protection & Induction motor & Increased reliability and fault tolerance \\ \hline
[110] & Survivability-based protection & PMSM & Increased reliability and fault tolerance \\ \hline
[111] & Fault index definition related to broken rotor bars & Induction motor & Prediction of broken rotor bars for repair \\ \hline
[112] & Loss minimization for an optimized speed trajectory & Induction motor & Reduced energy losses and improved efficiency \\ \hline
[113] & Loss minimization controller & Induction motor & Loss and torque ripple minimization \\ \hline
[114] & Design and DC-link voltage optimization & PMSM & Extended lifetime and construction cost reduction \\ \hline
[115] & Torque distribution & PMSM & Loss reduction and improved efficiency \\ \hline
[116] & LC filter implementation & VSI & Decreased harmonics and inverter temperature \\ \hline
[117] & Multilevel inverters and line inductance filters & Induction motor (insulation) & Mitigation of voltage surge stress \\ \hline \end{tabular}
\end{table} 
Table 4: Overview of methods for enhancing reliability and lifespan of EMD components. non-electromagnetic stressors. Among these, temperature has been shown to be the most common and is often affected by other factors. Temperature has a significant impact on components, especially in power converters, where it speeds up aging and failure processes. Electrical surges and fluctuations, combined with thermal effects, contribute to material wear and cause mechanical stress.