title: Introduction to tephra-derived soils and farming, Waikato-Bay of Plenty, North Island, New Zealand. University of Wisconsin-Platteville Education Abroad Program: Winterim Field Trip (15-17 January, 2019).

authors: Lowe, David J.

subjects: tephra

abstract: This tour guide describes the origin of tephras and tephra-derived soils in North Island, New Zealand, including via upbuilding pedogenesis, and their mineralogical and other properties relevant to farming and orcharding in the Waikato-Bay of Plenty regions.

text: Introduction to tephra-derived soils and farming, Waikato-Bay of Plenty, North Island, New Zealand. University of Wisconsin-Platteville Education Abroad Program: Winterim Field Trip (15-17 January, 2019). This tour guide describes the origin of tephras and tephra-derived soils in North Island, New Zealand, including via upbuilding pedogenesis, and their mineralogical and other properties relevant to farming and orcharding in the Waikato-Bay of Plenty regions.

year: 2019

title: Effect of minor titanium addition on copper/diamond composites prepared by hot forging

authors: Yang, Fei

abstract: Copper/diamond composites have great potential to lead the next generation of advanced heat sink materials for use in high-power electronic devices and high-density integrated circuits because of their potential excellent properties of high thermal conductivity and close thermal expansion to the chip materials (e.g., Si, InP, GaAs). However, the poor wettability between copper and diamond presents a challenge for synthesizing copper/diamond composites with effective metallurgical bonding and satisfied thermal performance. In this article, copper/diamond composites were successfully prepared by hot forging of elemental copper and artificial diamond powders with small amounts (0 vol.%, 3 vol.% and 5 vol.%) of titanium additives. Microstructure observation and mechanical tests showed that adding minor titanium additions in the copper/diamond composite resulted in fewer cracks in the composites’ microstructure and significantly improved the bonding between the copper and diamond. The strongest bonding strength was achieved for the copper/diamond composite with 3 vol.% titanium addition, and the possible reasons were discussed.

text: Effect of minor titanium addition on copper/diamond composites prepared by hot forging Copper/diamond composites have great potential to lead the next generation of advanced heat sink materials for use in high-power electronic devices and high-density integrated circuits because of their potential excellent properties of high thermal conductivity and close thermal expansion to the chip materials (e.g., Si, InP, GaAs). However, the poor wettability between copper and diamond presents a challenge for synthesizing copper/diamond composites with effective metallurgical bonding and satisfied thermal performance. In this article, copper/diamond composites were successfully prepared by hot forging of elemental copper and artificial diamond powders with small amounts (0 vol.%, 3 vol.% and 5 vol.%) of titanium additives. Microstructure observation and mechanical tests showed that adding minor titanium additions in the copper/diamond composite resulted in fewer cracks in the composites’ microstructure and significantly improved the bonding between the copper and diamond. The strongest bonding strength was achieved for the copper/diamond composite with 3 vol.% titanium addition, and the possible reasons were discussed.

year: 2018

title: A study of iwi communication between Te Tau Ihu iwi and intergenerational diasporic whānau

authors: Wright, Karamea Moana

subjects: diaspora

abstract: This study looks at the online communication methods used between Te Tau Ihu iwi and intergenerational uri who live in the diaspora. Preferences and perceptions of methods of communication utilized by both iwi, and tāngata who live in the overseas diaspora were explored. Most important are the implications for uri living away from Aotearoa, and their desire to remain connected to iwi in New Zealand. This is a mixed methods study, comprising of a survey of fifty-eight emigrant respondents living abroad, and interviews with one member of the first, second, and third generations of emigrants to the United States, with affiliation to at least one of the eight tribes who claim tāngata whenua status of Te Tau Ihu.

The implications of the findings from the study provide both iwi and tāngata the opportunity to create a synergistic relationship of communicating. Assisting iwi to develop and implement a strategy for relevant communication, and iwi members engaging in a dialogue with iwi about relevance of communication is critical in strengthening ties between iwi and future generations regardless of location. “He aha te mea nui, he tangata, he tangata.”

text: A study of iwi communication between Te Tau Ihu iwi and intergenerational diasporic whānau This study looks at the online communication methods used between Te Tau Ihu iwi and intergenerational uri who live in the diaspora. Preferences and perceptions of methods of communication utilized by both iwi, and tāngata who live in the overseas diaspora were explored. Most important are the implications for uri living away from Aotearoa, and their desire to remain connected to iwi in New Zealand. This is a mixed methods study, comprising of a survey of fifty-eight emigrant respondents living abroad, and interviews with one member of the first, second, and third generations of emigrants to the United States, with affiliation to at least one of the eight tribes who claim tāngata whenua status of Te Tau Ihu.

The implications of the findings from the study provide both iwi and tāngata the opportunity to create a synergistic relationship of communicating. Assisting iwi to develop and implement a strategy for relevant communication, and iwi members engaging in a dialogue with iwi about relevance of communication is critical in strengthening ties between iwi and future generations regardless of location. “He aha te mea nui, he tangata, he tangata.”

year: 2019