title: The role of intuition in social work practice: Differing understandings and attitudes

authors: Curtis, Cate

abstract: There has been a long debate about the use of intuition in helping professions, including social work. Often viewed negatively in professional contexts, intuition is nonetheless used as a form of risk assessment. The current research examined methods of identifying child sexual abuse. A mixed methods approach was taken, with 98 participants completing an online questionnaire and 24 taking part in in-depth interviews. The participants demonstrated varied perceptions of intuition and its usefulness. Although some participants were strongly critical of its use, for others, intuition or ‘gut feelings’ were preferred to formal assessment tools. However, what was discussed as intuition, rather than a form of ‘sixth sense’, was often based on tacit knowledge; for example, abused young people’s observable behaviours combined with known risk factors such as certain family characteristics. Therefore, concerns about the use of intuition may be based on incorrect assumptions.

text: The role of intuition in social work practice: Differing understandings and attitudes There has been a long debate about the use of intuition in helping professions, including social work. Often viewed negatively in professional contexts, intuition is nonetheless used as a form of risk assessment. The current research examined methods of identifying child sexual abuse. A mixed methods approach was taken, with 98 participants completing an online questionnaire and 24 taking part in in-depth interviews. The participants demonstrated varied perceptions of intuition and its usefulness. Although some participants were strongly critical of its use, for others, intuition or ‘gut feelings’ were preferred to formal assessment tools. However, what was discussed as intuition, rather than a form of ‘sixth sense’, was often based on tacit knowledge; for example, abused young people’s observable behaviours combined with known risk factors such as certain family characteristics. Therefore, concerns about the use of intuition may be based on incorrect assumptions.

year: 2024-06-12

title: Investigation on fabrication, interface formation, and properties of hot-processed titanium-doped copper/diamond composites

authors: Ma, Jingnan

abstract: Efficient thermal management is crucial for next-generation high-power electronic devices, driving the need for high-performance heat sink materials. Copper/diamond composites have emerged as promising candidates due to their exceptional thermal conductivity (TC) and tailorable coefficient of thermal expansion (CTE). However, their performance is limited by weak interfacial bonding, caused by the poor chemical affinity between copper and diamond and severe phonon scattering due to mismatched lattice vibrations. To address these challenges, interface engineering strategies such as pre-coating diamond particles or pre-alloying the copper matrix with carbide-forming elements (e.g., Ti, W, Zr, Cr, B) have been extensively explored. Among these, titanium has shown promise through the formation of a stable titanium carbide (TiC) layer, which significantly enhances interfacial bonding and composite performance. This thesis investigates the thermophysical and mechanical performance of titanium-doped copper/diamond composites fabricated via hot-processing techniques, hot-forging and hot-pressing, with focuses on optimizing fabrication parameters, elucidating interface formation mechanisms, and establishing the relationship between the interfacial microstructure and composites performance. 
Ti-coated diamond/Cu composites were successfully fabricated via hot-forging, and the effects of forging temperature, diamond volume fraction, and deformation degree were systematically evaluated. The study highlights the crucial role of hot-forging temperature in optimizing TiC interface formation and enhancing interfacial bonding. 800°C is the optimal hot forging temperature to facilitate the dynamic formation of TiC interface layer and ensure a high interface coverage rate on the diamond particles. Additionally, the volume fraction of diamond affects the interface microstructure and TC of the hot-forged composites by affecting the heating behaviour of the composites during induction heating. The relatively large deformation degree can effectively contribute to the densification and interfacial bonding of the composites. 800 °C hot-forged composite with 45 vol% diamond and 80% deformation degree exhibited excellent TC of 529 W/mK, along with a high tensile strength of 241 MPa, attributed to the synergy of uniform distribution of diamond in the matrix, a rough interface, and strong interfacial bonding between the copper and the diamond.
The fabrication of copper/diamond composites via hot-pressing, was further investigated employing two interfacial engineering strategies: titanium carbide formation through diamond surface metallization and copper matrix alloying with titanium additives. The results show that diamond metallization shows a better effectiveness in enhancing both mechanical and thermophysical performance than matrix alloying. Notably, Cu/50 vol% Ti-coated diamond composite fabricated at 540 MPa achieved an exceptional TC of 565 W/mK and a tensile strength of about 147 MPa. For the copper-Ti/diamond composite containing 0.5 wt% Ti processed at 1050 °C, it exhibited a comparable TC (554 W/mK), but a relatively low tensile strength (93 MPa). The optimal processing pressures for maximizing TC and mechanical strength in hot-pressed Cu/Ti-coated diamond composites differ due to interface microstructure: continuous interface enhances mechanical strength through strong interfacial bonding, whereas jagged interface arranged in parallel on the diamond surface minimizes interfacial thermal resistance. A comparative study between the two processing routes revealed that hot-forging outperforms hot-pressing at high diamond content (55 vol%) due to greater matrix deformation and more uniform diamond distribution, whereas hot-pressing becomes advantageous at lower diamond fractions (45-50 vol%), where applied pressure provides effective densification and interfacial microstructure becomes the dominant factor governing composite performance. 
A detailed investigation into interface formation mechanisms was conducted on 540 MPa hot-pressed composites with 50 vol% Ti-coated diamond. The results revealed that the distinct atomic configuration of individual diamond facets govern the nucleation and growth behaviour of TiC at the interface, giving rise to different interfacial microstructures: a continuous Cu/TiC/diamond structure on diamond-{100} facets, and a multilayered Cu/Cu (Ti)/TiC/diamond structure on diamond-{111} facets. Beyond the formation of TiC interlayer on both facets, the semi-coherent orientation relationships (ORs) were identified between TiC and both diamond-{111} facet and copper: (11 ̅1 ̅) TiC // (11 ̅1 ̅) Diamond and [1 ̅1 ̅0] TiC // [1 ̅1 ̅0] Diamond, (111) TiC// (1 ̅11) Cu, [01 ̅1] TiC// [211] Cu. These ensure a high degree of atomic ordering at the interface, enhancing phonon transmission across the interface. Concurrently, Cu segregation at TiC grain boundaries refines grains and strengthens interfacial bonding, further reducing thermal resistance. Furthermore, sub-stoichiometric TiCx present on both facets introduces a mixed metallic-covalent bonding character, facilitating electron-mediated heat transport and promoting nanotwin formation, which migrates phonon scattering by enhancing dislocation mobility. 
Overall, this work demonstrates that the thermophysical and mechanical performance of copper/diamond composite is governed by the synergistic interplay between processing parameters and interfacial microstructure. The facet-dependent atomic configuration of diamond surface dictate distinct interfacial microstructures, while processing parameters such as temperature and pressure provide effective levers for controlling TiC stoichiometry, interlayer continuity, and interfacial bonding strength. Together, these factors determine the balance between thermal transport efficiency and mechanical strength, establishing a rational framework for interface engineering in high-performance Cu/diamond composites.

text: Investigation on fabrication, interface formation, and properties of hot-processed titanium-doped copper/diamond composites Efficient thermal management is crucial for next-generation high-power electronic devices, driving the need for high-performance heat sink materials. Copper/diamond composites have emerged as promising candidates due to their exceptional thermal conductivity (TC) and tailorable coefficient of thermal expansion (CTE). However, their performance is limited by weak interfacial bonding, caused by the poor chemical affinity between copper and diamond and severe phonon scattering due to mismatched lattice vibrations. To address these challenges, interface engineering strategies such as pre-coating diamond particles or pre-alloying the copper matrix with carbide-forming elements (e.g., Ti, W, Zr, Cr, B) have been extensively explored. Among these, titanium has shown promise through the formation of a stable titanium carbide (TiC) layer, which significantly enhances interfacial bonding and composite performance. This thesis investigates the thermophysical and mechanical performance of titanium-doped copper/diamond composites fabricated via hot-processing techniques, hot-forging and hot-pressing, with focuses on optimizing fabrication parameters, elucidating interface formation mechanisms, and establishing the relationship between the interfacial microstructure and composites performance. 
Ti-coated diamond/Cu composites were successfully fabricated via hot-forging, and the effects of forging temperature, diamond volume fraction, and deformation degree were systematically evaluated. The study highlights the crucial role of hot-forging temperature in optimizing TiC interface formation and enhancing interfacial bonding. 800°C is the optimal hot forging temperature to facilitate the dynamic formation of TiC interface layer and ensure a high interface coverage rate on the diamond particles. Additionally, the volume fraction of diamond affects the interface microstructure and TC of the hot-forged composites by affecting the heating behaviour of the composites during induction heating. The relatively large deformation degree can effectively contribute to the densification and interfacial bonding of the composites. 800 °C hot-forged composite with 45 vol% diamond and 80% deformation degree exhibited excellent TC of 529 W/mK, along with a high tensile strength of 241 MPa, attributed to the synergy of uniform distribution of diamond in the matrix, a rough interface, and strong interfacial bonding between the copper and the diamond.
The fabrication of copper/diamond composites via hot-pressing, was further investigated employing two interfacial engineering strategies: titanium carbide formation through diamond surface metallization and copper matrix alloying with titanium additives. The results show that diamond metallization shows a better effectiveness in enhancing both mechanical and thermophysical performance than matrix alloying. Notably, Cu/50 vol% Ti-coated diamond composite fabricated at 540 MPa achieved an exceptional TC of 565 W/mK and a tensile strength of about 147 MPa. For the copper-Ti/diamond composite containing 0.5 wt% Ti processed at 1050 °C, it exhibited a comparable TC (554 W/mK), but a relatively low tensile strength (93 MPa). The optimal processing pressures for maximizing TC and mechanical strength in hot-pressed Cu/Ti-coated diamond composites differ due to interface microstructure: continuous interface enhances mechanical strength through strong interfacial bonding, whereas jagged interface arranged in parallel on the diamond surface minimizes interfacial thermal resistance. A comparative study between the two processing routes revealed that hot-forging outperforms hot-pressing at high diamond content (55 vol%) due to greater matrix deformation and more uniform diamond distribution, whereas hot-pressing becomes advantageous at lower diamond fractions (45-50 vol%), where applied pressure provides effective densification and interfacial microstructure becomes the dominant factor governing composite performance. 
A detailed investigation into interface formation mechanisms was conducted on 540 MPa hot-pressed composites with 50 vol% Ti-coated diamond. The results revealed that the distinct atomic configuration of individual diamond facets govern the nucleation and growth behaviour of TiC at the interface, giving rise to different interfacial microstructures: a continuous Cu/TiC/diamond structure on diamond-{100} facets, and a multilayered Cu/Cu (Ti)/TiC/diamond structure on diamond-{111} facets. Beyond the formation of TiC interlayer on both facets, the semi-coherent orientation relationships (ORs) were identified between TiC and both diamond-{111} facet and copper: (11 ̅1 ̅) TiC // (11 ̅1 ̅) Diamond and [1 ̅1 ̅0] TiC // [1 ̅1 ̅0] Diamond, (111) TiC// (1 ̅11) Cu, [01 ̅1] TiC// [211] Cu. These ensure a high degree of atomic ordering at the interface, enhancing phonon transmission across the interface. Concurrently, Cu segregation at TiC grain boundaries refines grains and strengthens interfacial bonding, further reducing thermal resistance. Furthermore, sub-stoichiometric TiCx present on both facets introduces a mixed metallic-covalent bonding character, facilitating electron-mediated heat transport and promoting nanotwin formation, which migrates phonon scattering by enhancing dislocation mobility. 
Overall, this work demonstrates that the thermophysical and mechanical performance of copper/diamond composite is governed by the synergistic interplay between processing parameters and interfacial microstructure. The facet-dependent atomic configuration of diamond surface dictate distinct interfacial microstructures, while processing parameters such as temperature and pressure provide effective levers for controlling TiC stoichiometry, interlayer continuity, and interfacial bonding strength. Together, these factors determine the balance between thermal transport efficiency and mechanical strength, establishing a rational framework for interface engineering in high-performance Cu/diamond composites.

year: 2025

title: Wāhine Māori engagement with literacies

authors: Masters-Awatere, Bridgette

subjects: Literacy

abstract: Wāhine Māori engagement with literacies (2023) is a case study report in collaboration with Te Whakaruruhau. It has been undertaken as part of a larger project, The expression, experience and transcendence of low skills in Aotearoa New Zealand (2019–2024), the aim of which is to provide policy recommendations to improve life-course trajectories and socio-economic outcomes for adults with low literacy and numeracy skills in Aotearoa New Zealand. Broadly speaking, Wāhine Māori engagement with literacy examines the framing and application of literacy measures in contemporary New Zealand culture. More specifically, it is about the lives and learning of wāhine (women) Māori (the indigenous peoples of Aotearoa New Zealand) within that culture and their attitudes towards, and complex relationships with, literacy as it is defined in their own lives and in the current setting. The study aims for a holistic understanding of lived literacies in driving the development of educational policies by public institutions and private groups. Reframing literacy as literacies is posited as a means to empower marginalised groups and to challenge the dominance of the Eurocentric education paradigm. Formal learning in English-language schools cannot be the extent of national literacy standards as it disregards Māori epistemological and ontological realities and can discount wāhine, many of whom may prioritise other modes of literacy. Centring their perspectives will bring about a more culturally inclusive future, one that makes space for the development of emotional and cultural literacies—as well as other forms such as digital, media, visual, financial, and health literacies—alongside the conventional version of literacy that has a monopoly in the present system.

text: Wāhine Māori engagement with literacies Wāhine Māori engagement with literacies (2023) is a case study report in collaboration with Te Whakaruruhau. It has been undertaken as part of a larger project, The expression, experience and transcendence of low skills in Aotearoa New Zealand (2019–2024), the aim of which is to provide policy recommendations to improve life-course trajectories and socio-economic outcomes for adults with low literacy and numeracy skills in Aotearoa New Zealand. Broadly speaking, Wāhine Māori engagement with literacy examines the framing and application of literacy measures in contemporary New Zealand culture. More specifically, it is about the lives and learning of wāhine (women) Māori (the indigenous peoples of Aotearoa New Zealand) within that culture and their attitudes towards, and complex relationships with, literacy as it is defined in their own lives and in the current setting. The study aims for a holistic understanding of lived literacies in driving the development of educational policies by public institutions and private groups. Reframing literacy as literacies is posited as a means to empower marginalised groups and to challenge the dominance of the Eurocentric education paradigm. Formal learning in English-language schools cannot be the extent of national literacy standards as it disregards Māori epistemological and ontological realities and can discount wāhine, many of whom may prioritise other modes of literacy. Centring their perspectives will bring about a more culturally inclusive future, one that makes space for the development of emotional and cultural literacies—as well as other forms such as digital, media, visual, financial, and health literacies—alongside the conventional version of literacy that has a monopoly in the present system.

year: 2023-09-28