title: Review: Marine natural products

authors: Blunt, John W.

subjects: marine natural products

abstract: This review covers the literature published in 2003 for marine natural products, with 619 citations (413 for the period January to December 2003) referring to compounds isolated from marine microorganisms and phytoplankton, green algae, brown algae, red algae, sponges, coelenterates, bryozoans, molluscs, tunicates and echinoderms. The emphasis is on new compounds (656 for 2003), together with their relevant biological activities, source organisms and country of origin. Biosynthetic studies or syntheses that lead to the revision of structures or stereochemistries have been included (78), including any ﬁrst total syntheses of a marine natural product.

text: Review: Marine natural products This review covers the literature published in 2003 for marine natural products, with 619 citations (413 for the period January to December 2003) referring to compounds isolated from marine microorganisms and phytoplankton, green algae, brown algae, red algae, sponges, coelenterates, bryozoans, molluscs, tunicates and echinoderms. The emphasis is on new compounds (656 for 2003), together with their relevant biological activities, source organisms and country of origin. Biosynthetic studies or syntheses that lead to the revision of structures or stereochemistries have been included (78), including any ﬁrst total syntheses of a marine natural product.

year: 2005

title: Investigation on fabrication, interface formation, and properties of hot-processed titanium-doped copper/diamond composites

authors: Ma, Jingnan

abstract: Efficient thermal management is crucial for next-generation high-power electronic devices, driving the need for high-performance heat sink materials. Copper/diamond composites have emerged as promising candidates due to their exceptional thermal conductivity (TC) and tailorable coefficient of thermal expansion (CTE). However, their performance is limited by weak interfacial bonding, caused by the poor chemical affinity between copper and diamond and severe phonon scattering due to mismatched lattice vibrations. To address these challenges, interface engineering strategies such as pre-coating diamond particles or pre-alloying the copper matrix with carbide-forming elements (e.g., Ti, W, Zr, Cr, B) have been extensively explored. Among these, titanium has shown promise through the formation of a stable titanium carbide (TiC) layer, which significantly enhances interfacial bonding and composite performance. This thesis investigates the thermophysical and mechanical performance of titanium-doped copper/diamond composites fabricated via hot-processing techniques, hot-forging and hot-pressing, with focuses on optimizing fabrication parameters, elucidating interface formation mechanisms, and establishing the relationship between the interfacial microstructure and composites performance. 
Ti-coated diamond/Cu composites were successfully fabricated via hot-forging, and the effects of forging temperature, diamond volume fraction, and deformation degree were systematically evaluated. The study highlights the crucial role of hot-forging temperature in optimizing TiC interface formation and enhancing interfacial bonding. 800°C is the optimal hot forging temperature to facilitate the dynamic formation of TiC interface layer and ensure a high interface coverage rate on the diamond particles. Additionally, the volume fraction of diamond affects the interface microstructure and TC of the hot-forged composites by affecting the heating behaviour of the composites during induction heating. The relatively large deformation degree can effectively contribute to the densification and interfacial bonding of the composites. 800 °C hot-forged composite with 45 vol% diamond and 80% deformation degree exhibited excellent TC of 529 W/mK, along with a high tensile strength of 241 MPa, attributed to the synergy of uniform distribution of diamond in the matrix, a rough interface, and strong interfacial bonding between the copper and the diamond.
The fabrication of copper/diamond composites via hot-pressing, was further investigated employing two interfacial engineering strategies: titanium carbide formation through diamond surface metallization and copper matrix alloying with titanium additives. The results show that diamond metallization shows a better effectiveness in enhancing both mechanical and thermophysical performance than matrix alloying. Notably, Cu/50 vol% Ti-coated diamond composite fabricated at 540 MPa achieved an exceptional TC of 565 W/mK and a tensile strength of about 147 MPa. For the copper-Ti/diamond composite containing 0.5 wt% Ti processed at 1050 °C, it exhibited a comparable TC (554 W/mK), but a relatively low tensile strength (93 MPa). The optimal processing pressures for maximizing TC and mechanical strength in hot-pressed Cu/Ti-coated diamond composites differ due to interface microstructure: continuous interface enhances mechanical strength through strong interfacial bonding, whereas jagged interface arranged in parallel on the diamond surface minimizes interfacial thermal resistance. A comparative study between the two processing routes revealed that hot-forging outperforms hot-pressing at high diamond content (55 vol%) due to greater matrix deformation and more uniform diamond distribution, whereas hot-pressing becomes advantageous at lower diamond fractions (45-50 vol%), where applied pressure provides effective densification and interfacial microstructure becomes the dominant factor governing composite performance. 
A detailed investigation into interface formation mechanisms was conducted on 540 MPa hot-pressed composites with 50 vol% Ti-coated diamond. The results revealed that the distinct atomic configuration of individual diamond facets govern the nucleation and growth behaviour of TiC at the interface, giving rise to different interfacial microstructures: a continuous Cu/TiC/diamond structure on diamond-{100} facets, and a multilayered Cu/Cu (Ti)/TiC/diamond structure on diamond-{111} facets. Beyond the formation of TiC interlayer on both facets, the semi-coherent orientation relationships (ORs) were identified between TiC and both diamond-{111} facet and copper: (11 ̅1 ̅) TiC // (11 ̅1 ̅) Diamond and [1 ̅1 ̅0] TiC // [1 ̅1 ̅0] Diamond, (111) TiC// (1 ̅11) Cu, [01 ̅1] TiC// [211] Cu. These ensure a high degree of atomic ordering at the interface, enhancing phonon transmission across the interface. Concurrently, Cu segregation at TiC grain boundaries refines grains and strengthens interfacial bonding, further reducing thermal resistance. Furthermore, sub-stoichiometric TiCx present on both facets introduces a mixed metallic-covalent bonding character, facilitating electron-mediated heat transport and promoting nanotwin formation, which migrates phonon scattering by enhancing dislocation mobility. 
Overall, this work demonstrates that the thermophysical and mechanical performance of copper/diamond composite is governed by the synergistic interplay between processing parameters and interfacial microstructure. The facet-dependent atomic configuration of diamond surface dictate distinct interfacial microstructures, while processing parameters such as temperature and pressure provide effective levers for controlling TiC stoichiometry, interlayer continuity, and interfacial bonding strength. Together, these factors determine the balance between thermal transport efficiency and mechanical strength, establishing a rational framework for interface engineering in high-performance Cu/diamond composites.

text: Investigation on fabrication, interface formation, and properties of hot-processed titanium-doped copper/diamond composites Efficient thermal management is crucial for next-generation high-power electronic devices, driving the need for high-performance heat sink materials. Copper/diamond composites have emerged as promising candidates due to their exceptional thermal conductivity (TC) and tailorable coefficient of thermal expansion (CTE). However, their performance is limited by weak interfacial bonding, caused by the poor chemical affinity between copper and diamond and severe phonon scattering due to mismatched lattice vibrations. To address these challenges, interface engineering strategies such as pre-coating diamond particles or pre-alloying the copper matrix with carbide-forming elements (e.g., Ti, W, Zr, Cr, B) have been extensively explored. Among these, titanium has shown promise through the formation of a stable titanium carbide (TiC) layer, which significantly enhances interfacial bonding and composite performance. This thesis investigates the thermophysical and mechanical performance of titanium-doped copper/diamond composites fabricated via hot-processing techniques, hot-forging and hot-pressing, with focuses on optimizing fabrication parameters, elucidating interface formation mechanisms, and establishing the relationship between the interfacial microstructure and composites performance. 
Ti-coated diamond/Cu composites were successfully fabricated via hot-forging, and the effects of forging temperature, diamond volume fraction, and deformation degree were systematically evaluated. The study highlights the crucial role of hot-forging temperature in optimizing TiC interface formation and enhancing interfacial bonding. 800°C is the optimal hot forging temperature to facilitate the dynamic formation of TiC interface layer and ensure a high interface coverage rate on the diamond particles. Additionally, the volume fraction of diamond affects the interface microstructure and TC of the hot-forged composites by affecting the heating behaviour of the composites during induction heating. The relatively large deformation degree can effectively contribute to the densification and interfacial bonding of the composites. 800 °C hot-forged composite with 45 vol% diamond and 80% deformation degree exhibited excellent TC of 529 W/mK, along with a high tensile strength of 241 MPa, attributed to the synergy of uniform distribution of diamond in the matrix, a rough interface, and strong interfacial bonding between the copper and the diamond.
The fabrication of copper/diamond composites via hot-pressing, was further investigated employing two interfacial engineering strategies: titanium carbide formation through diamond surface metallization and copper matrix alloying with titanium additives. The results show that diamond metallization shows a better effectiveness in enhancing both mechanical and thermophysical performance than matrix alloying. Notably, Cu/50 vol% Ti-coated diamond composite fabricated at 540 MPa achieved an exceptional TC of 565 W/mK and a tensile strength of about 147 MPa. For the copper-Ti/diamond composite containing 0.5 wt% Ti processed at 1050 °C, it exhibited a comparable TC (554 W/mK), but a relatively low tensile strength (93 MPa). The optimal processing pressures for maximizing TC and mechanical strength in hot-pressed Cu/Ti-coated diamond composites differ due to interface microstructure: continuous interface enhances mechanical strength through strong interfacial bonding, whereas jagged interface arranged in parallel on the diamond surface minimizes interfacial thermal resistance. A comparative study between the two processing routes revealed that hot-forging outperforms hot-pressing at high diamond content (55 vol%) due to greater matrix deformation and more uniform diamond distribution, whereas hot-pressing becomes advantageous at lower diamond fractions (45-50 vol%), where applied pressure provides effective densification and interfacial microstructure becomes the dominant factor governing composite performance. 
A detailed investigation into interface formation mechanisms was conducted on 540 MPa hot-pressed composites with 50 vol% Ti-coated diamond. The results revealed that the distinct atomic configuration of individual diamond facets govern the nucleation and growth behaviour of TiC at the interface, giving rise to different interfacial microstructures: a continuous Cu/TiC/diamond structure on diamond-{100} facets, and a multilayered Cu/Cu (Ti)/TiC/diamond structure on diamond-{111} facets. Beyond the formation of TiC interlayer on both facets, the semi-coherent orientation relationships (ORs) were identified between TiC and both diamond-{111} facet and copper: (11 ̅1 ̅) TiC // (11 ̅1 ̅) Diamond and [1 ̅1 ̅0] TiC // [1 ̅1 ̅0] Diamond, (111) TiC// (1 ̅11) Cu, [01 ̅1] TiC// [211] Cu. These ensure a high degree of atomic ordering at the interface, enhancing phonon transmission across the interface. Concurrently, Cu segregation at TiC grain boundaries refines grains and strengthens interfacial bonding, further reducing thermal resistance. Furthermore, sub-stoichiometric TiCx present on both facets introduces a mixed metallic-covalent bonding character, facilitating electron-mediated heat transport and promoting nanotwin formation, which migrates phonon scattering by enhancing dislocation mobility. 
Overall, this work demonstrates that the thermophysical and mechanical performance of copper/diamond composite is governed by the synergistic interplay between processing parameters and interfacial microstructure. The facet-dependent atomic configuration of diamond surface dictate distinct interfacial microstructures, while processing parameters such as temperature and pressure provide effective levers for controlling TiC stoichiometry, interlayer continuity, and interfacial bonding strength. Together, these factors determine the balance between thermal transport efficiency and mechanical strength, establishing a rational framework for interface engineering in high-performance Cu/diamond composites.

year: 2025

title: Restoring Indigneous Law and Justice Traditions

authors: Cook, Michelle Lynn

subjects: Indigenous peoples

abstract: Restoring indigenous people's law and their ability to practice their justice traditions is a fundamental aspect of non-discrimination, decolonization, self-governance, self-determination, and social justice. The critical application and interpretation of indigenous people's law has revolutionary potentiality to transform, confront, and heal multiple forms of oppression such as environmental destruction, patriarchy, and the prison/criminal justice system. The sovereign jurisgenerative (law making) power of indigenous peoples is a site of profound hope for the revitalization of indigenous law and justice traditions restores legal principles and values of sacredness, harmony, balance, and interconnectivity within human relationships and with the natural world. Revitalizing indigenous law is a way to re-construct the self and society while also finding and re-connecting to new/old ways of being human. This thesis focuses on both Navajo and Māori practices and visions of law and justice; the challenges and, successes they have faced and the hopes they have of living by their law. Indigenous peoples, their ways of being, their wisdom, laws, and philosophies, must be respected, protected, and preserved not only because they contribute to humanity's richness and cultural diversity but also because they are living examples of  a more just, dignified, and ecologically sustainable society, which can serve all humanity.

text: Restoring Indigneous Law and Justice Traditions Restoring indigenous people's law and their ability to practice their justice traditions is a fundamental aspect of non-discrimination, decolonization, self-governance, self-determination, and social justice. The critical application and interpretation of indigenous people's law has revolutionary potentiality to transform, confront, and heal multiple forms of oppression such as environmental destruction, patriarchy, and the prison/criminal justice system. The sovereign jurisgenerative (law making) power of indigenous peoples is a site of profound hope for the revitalization of indigenous law and justice traditions restores legal principles and values of sacredness, harmony, balance, and interconnectivity within human relationships and with the natural world. Revitalizing indigenous law is a way to re-construct the self and society while also finding and re-connecting to new/old ways of being human. This thesis focuses on both Navajo and Māori practices and visions of law and justice; the challenges and, successes they have faced and the hopes they have of living by their law. Indigenous peoples, their ways of being, their wisdom, laws, and philosophies, must be respected, protected, and preserved not only because they contribute to humanity's richness and cultural diversity but also because they are living examples of  a more just, dignified, and ecologically sustainable society, which can serve all humanity.

year: 2010