Ge has been at RIT for since 2005. Previously, Ge served as the technical director for Pack Solutions Pte Ltd and Senior Engineer in Singapore Institute of Industrial Research , in Singapore. His areas of interest include: barrier packaging material development - nano incorporated adhesive; Smart packaging - RFID application in packaging, active packaging; transport packaging design - cushion foam design and packaging simulation - finite element analysis (FEA) to predict packaging performance. Ge's scholarly work includes: Book