I 
119TH CONGRESS 
1ST SESSION H. R. 5287 
To require an annual report on the advanced semiconductor manufacturing 
capabilities of the People’s Republic of China. 
IN THE HOUSE OF REPRESENTATIVES 
SEPTEMBER 10, 2025 
Mr. VINDMAN (for himself and Mr. MOYLAN) introduced the following bill; 
which was referred to the Committee on Foreign Affairs 
A BILL 
To require an annual report on the advanced semiconductor 
manufacturing capabilities of the People’s Republic of China. 
Be it enacted by the Senate and House of Representa-
tives of the United States of America in Congress assembled, 
SECTION 1. SHORT TITLE. 
This Act may be cited as the ‘‘China Advanced Tech-
nology Monitoring Act’’. 
SEC. 2. ANNUAL REPORT ON ADVANCED SEMICONDUCTOR 
MANUFACTURING CAPABILITIES OF CHINA. 
(a) REPORT.—Not later than May 1, 2026, and an-
nually thereafter for 5 years, the Secretary of Defense, 
in consultation with the heads other Federal departments 
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and agencies as appropriate, shall submit to the Commit-
tees on Armed Services of the House of Representatives 
and the Senate a report on the semiconductor manufac-
turing capabilities, including advanced and mature-node 
semiconductors, of the People’s Republic of China. 
(b) ELEMENTS.—The report required by subsection 
(a) shall also include the following: 
(1) A statement of key findings and assess-
ments with respect to the United States strategy to 
counter China and specific policy recommendations 
to Congress regarding China’s goal to advance semi-
conductor manufacturing. 
(2) An assessment of the domestic semicon-
ductor manufacturing capabilities of China. 
(3) A detailed analysis of the industrial policies 
of China and the outcomes of such policies on such 
manufacturing capabilities. 
(4) A year-by-year assessment of technological 
development efforts by China in the fields of semi-
conductor manufacturing and artificial intelligence 
chipmaking, including relevant government plans 
and initiatives, that specifically addresses gains in 
every aspect of manufacturing, such as design, intel-
lectual property, research and development, silicon 
and critical minerals, industrial gases, intermediaries 
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such as photomasks, equipment, tools, and software, 
and advanced packaging techniques. 
(5) A description of engagement between China 
and other foreign countries with respect to semicon-
ductor manufacturing equipment capabilities, includ-
ing— 
(A) coordination with other countries and 
markets to expand semiconductor influence; and 
(B) foreign investment, trade, and research 
ties and partnerships with other countries. 
(6) An analysis of the extent to which there is 
collaboration, joint ventures, or partnerships be-
tween China and other foreign countries with respect 
to semiconductor manufacturing. 
(7) An analysis of the impact of United States 
and allied and partner export controls on covered 
items related to the development of semiconductor 
manufacturing in China, specifically with respect to 
the effectiveness of current United States protec-
tions against— 
(A) export control workarounds and loop-
holes; 
(B) circumvention through foreign invest-
ments or third-party acquisitions; and 
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(C) risks posed by collaborative agree-
ments, partnerships, supplier relocations, and 
contractual relationships that may indirectly 
benefit China. 
(8) An assessment of whether such export con-
trols remain effective in curbing the development of 
semiconductor manufacturing equipment capabilities 
in China and recommendations for enhancing effec-
tiveness of such controls. 
(9) An assessment of the implications of Chi-
nese semiconductor manufacturing dominance on— 
(A) United States global competitiveness; 
(B) United States national security and 
national economic security; and 
(C) the national economy of the United 
States. 
(c) FORM.—The report required by subsection (a) 
shall be submitted in unclassified form and shall include 
a classified annex, providing additional details and sup-
porting intelligence, as available. The unclassified portion, 
or an unclassified synopsis, of the report shall concur-
rently be made available on a publicly available website 
of the Federal Government and a notice to that effect shall 
be concurrently published in the Federal Register. 
Æ 
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