projected production number for the year 
proceeding submission of such report; 
(ii) the foundries used in the produc-
tion of the integrated circuits; 
(iii) the software ecosystem, including 
any parallel computing platforms, pro-
gramming models, or development frame-
works that enable accelerated computing 
for artificial intelligence training or infer-
ence; 
(iv) the method and extent to which 
such integrated circuits are used in other 
countries, including in the United States; 
and 
(v) the manufacturer’s ability to 
produce a software application layer re-
quired to achieve an improved token per 
seconds and cost per token rate. 
(2) An assessment of leading semiconductor 
fabrication facilities in China that produce logic inte-
grated circuits for use in advanced artificial intel-
ligence training or inference, including such facilities 
owned or operated by the Semiconductor Manufac-
turing International Corporation, that includes, with 
respect to such facilities, the— 
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(A) total monthly production capacity per 
advanced process node with non-planar transis-
tors or 16⁄14 nm and below and the percentage 
of that monthly production capacity dedicated 
to production of logic integrated circuits for use 
in advanced artificial training or inference; 
(B) yield for producing such logic inte-
grated circuits for use in advanced artificial in-
telligence training or inference at each facility 
with an assessment of that yield in industry rel-
evant terms, such as compared to Chinese 
firms, compared to non-Chinese firms, or how 
many 
are 
in 
current 
industry-leading 
datacenters; 
(C) most advanced process node under pro-
duction; 
(D) types and volume of semiconductor 
manufacturing equipment used, the country of 
origin for such equipment, and the export con-
trol regulatory regime under which such equip-
ment was procured; 
(E) collaborations, licit or illicit, between 
Chinese firms or their subsidiaries and non-Chi-
nese firms and the advancements those collabo-
rations produce for the Chinese firm; 
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(F) progress Chinese firms are making at 
indigenizing export controlled technologies; 
(G) market share Chinese firms have in 
China and internationally; and 
(H) year-over-year trends in leading semi-
conductor fabrication facilities during at least 
the preceding 5-year period; 
(3) An assessment of leading semiconductor 
fabrication facilities in China that produce memory 
integrated circuits used for advanced artificial intel-
ligence training or inference, including such facilities 
owned or operated by ChangXin Memory Tech-
nologies or Yangtze Memory Technologies Corp., 
that includes— 
(A) with respect to such circuits, the— 
(i) most advanced generation of high- 
bandwidth memory, including the technical 
specifications and stack height; 
(ii) smallest half-pitch and the per-die 
capacity of other dynamic random access 
memory integrated circuits; and 
(iii) highest number of layers in three- 
dimensional 
NOT–AND 
memory 
inte-
grated circuits; 
(B) with respect to such facilities, the— 
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(i) yield and total monthly production 
capacity for memory integrated circuits, in-
cluding dynamic random access memory 
such as high-bandwidth memory, and 
NOT–AND memory; and 
(ii) types and volume of semicon-
ductor manufacturing equipment used, in-
cluding the country of origin of such equip-
ment and the export control regulatory re-
gime such equipment was procured under. 
(C) collaborations, licit or illicit, between 
Chinese firms or their subsidiaries and non-Chi-
nese firms and the advancements those collabo-
rations produce for the Chinese firm; 
(D) progress Chinese firms are making at 
indigenizing export controlled technologies; 
(E) market share Chinese firms have in 
China and internationally; and 
(F) year-over-year trends in China’s ad-
vanced memory integrated circuit production 
for a minimum of the 5 previous years. 
(4) An assessment of leading semiconductor 
manufacturing equipment companies in China, in-
cluding NAURA Technology Group, KINGSEMI, 
Advanced Micro-Fabrication Equipment Inc., Shang-
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hai Micro Electronics Equipment, and Shenzhen 
SiCarrier Technologies Co., Ltd, that includes— 
(A) a categorical breakdown of annual unit 
production volume and technical specifications, 
including minimum feature size, throughput, 
and defect rate, of all major equipment classes 
installed or under development for wafer pro-
duction in foundries in China, including— 
(i) lithography tools, including photo-
lithography, nanoimprint, and electron 
beam lithography tools; 
(ii) etch equipment, including wet 
etching and dry etching; 
(iii) deposition equipment, including 
chemical vapor deposition, physical vapor 
deposition, and atomic layer deposition; 
(iv) cleaning systems; 
(v) chemical mechanical planarization 
tools; 
(vi) ion implantation and diffusion 
systems; 
(vii) wafer inspection, metrology, and 
process control tools; 
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(viii) back-end packaging equipment, 
including wafer dicing equipment and wire 
bonders; 
(ix) capabilities and advancements in 
advanced packaging technologies; 
(x) thermal processing equipment; 
(xi) bonding equipment, including 
thermo compression bonders and hybrid 
bonders; 
(xii) environmental control systems; 
(xiii) laser systems; and 
(xiv) reticle and photomask writing 
and inspection tools; 
(B) the country of origin and supplier 
company for each piece of semiconductor manu-
facturing equipment used in foundries in China 
for advanced-node logic or high-bandwidth 
memory production by such companies; 
(C) the foreign-sourced subcomponents in-
tegrated into the semiconductor manufacturing 
equipment produced by such companies, includ-
ing precision motion stages, lasers, electrostatic 
chucks, optical systems, radio frequency genera-
tors, or extreme-purity gas handling systems; 
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(D) collaborations, licit or illicit, between 
Chinese firms or their subsidiaries and non-Chi-
nese firms and the advancements those collabo-
rations produce for the Chinese firm; 
(E) progress Chinese firms are making at 
indigenizing export controlled technologies; 
(F) market share Chinese firms have in 
China and internationally; and 
(G) year-over-year trends in leading semi-
conductor manufacturing equipment companies 
in China for a minimum of the 5 previous 
years. 
(5) An assessment of electronic design automa-
tion (EDA) software used in the design of integrated 
circuits for advanced artificial intelligence applica-
tions in China, including software developed or pro-
vided by leading Chinese EDA companies such as 
Empyrean Technology Co., Ltd. and Primarius 
Technologies Co., Ltd., that includes— 
(A) with respect to such software tools, 
the— 
(i) range of design stages supported, 
including front-end design such as archi-
tecture and register-transfer level design, 
logic synthesis, verification, physical de-
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sign, place-and-route, timing closure, and 
final signoff; 
(ii) compatibility with advanced proc-
ess nodes, including sub-7 nanometer tech-
nologies, 
gate-all-around 
devices, 
and 
three-dimensional integration; 
(iii) capabilities for designing artificial 
intelligence-specific components of such in-
tegrated circuits, including tensor proc-
essing cores, systolic array processing 
units, matrix multiplier units, and high- 
bandwidth memory interfaces; 
(iv) ability to model and optimize for 
power, performance, and thermal con-
straints in artificial intelligence workloads; 
(v) scale and performance of the soft-
ware in handling large designs, such as 
chips exceeding 50–100 billion transistors; 
and 
(vi) integration with cloud compute 
resources or distributed workflows for 
large-scale artificial intelligence chip devel-
opment; 
(B) with respect to such companies, the— 
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(i) total market share within China 
and internationally, including the share of 
advanced-node integrated circuits designed 
or optimized for advanced artificial intel-
ligence training or inference designs sup-
ported by each company; and 
(ii) types, volume, and origin of crit-
ical technology components used in soft-
ware development, including intellectual 
property 
cores, 
third-party 
libraries, 
verification suites, and artificial intel-
ligence-assisted optimization algorithms; 
(C) progress Chinese firms are making at 
indigenizing export-controlled or foreign-origin 
technologies used in EDA, including high-per-
formance 
computing 
integration, 
advanced 
verification engines, and proprietary intellectual 
property cores; 
(D) year-over-year trends for China’s EDA 
industry over a minimum of the previous 5 
years, including technology adoption, market 
share, and software capability evolution; and 
(E) identification of technical gaps relative 
to leading global EDA providers, particularly in 
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relation to artificial intelligence-focused design, 
advanced nodes, and large-scale verification. 
(6) An assessment of the advanced artificial in-
telligence models determined by the Secretary to be 
the most relevant to the national security of the 
United States that were developed by artificial intel-
ligence laboratories or companies based in China, es-
pecially those laboratories and companies affiliated 
with the People’s Liberation Army or any university 
in China, including the most advanced models, open- 
weight and closed-weight models, based on model 
size, total compute used during training, benchmark 
performance, and any other advanced capabilities 
the Secretary determines relevant, that includes, 
with respect to each such model— 
(A) the number of model parameters; 
(B) the total training compute used, meas-
ured in floating-point operations and their rel-
evant precision level; 
(C) the model performance on benchmark 
tasks; 
(D) an evaluation of the extent to which 
the model exhibits advanced cyber offensive ca-
pabilities, an advanced understanding of biologi-
cal and virological application domains, and the 
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ability to substantially automate or accelerate 
artificial intelligence research, and a compari-
son of such models to the most advanced artifi-
cial intelligence models from United States de-
velopers; 
(E) if the model is open-weight, an evalua-
tion of the files provided and the security impli-
cations of following the developer’s deployment 
instructions; 
(F) a description of the algorithmic align-
ment training used; 
(G) the type and scale of compute infra-
structure used in training and inference, includ-
ing the cluster configurations, the number and 
type of integrated circuits specifically designed 
or optimized for advanced artificial intelligence 
training or inference, how such integrated cir-
cuits were acquired and from which companies, 
where those clusters are located, and how they 
are being accessed; 
(H) the manner and extent to which the 
model is used throughout society in China, in-
cluding throughout the following industries or 
sectors: 
(i) the People’s Liberation Army; 
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(ii) the surveillance and intelligence 
collection functions of the Chinese Com-
munist Party (CCP), including the geno-
cide of Uyghur Muslims and other reli-
gious and ethnic minorities in the Xinjiang 
Uyghur Autonomous Region; 
(iii) the Government of China; 
(iv) business and finance; 
(v) education; 
(vi) healthcare; 
(vii) critical infrastructure sectors, in-
cluding the power grid and transportation; 
and 
(viii) any other sectors that the Sec-
retary determines to be relevant, such as 
high-risk industries where artificial intel-
ligence failure would have outsized safety 
or mission consequences. 
(I) whether and where such models are de-
ployed for public use, including API access or 
mobile app deployment; 
(J) the manner and extent to which such 
models are diffused in other countries, including 
the United States; 
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(K) the alignment of those models to CCP 
propaganda; 
(L) the potential of those models to inject 
or create vulnerabilities for users or other ways 
they could be used to further CCP national se-
curity objectives; 
(M) an assessment of global market share 
of Chinese models and the effect that global 
market share is enabling China to set artificial 
intelligence hardware or software standards; 
and 
(N) the total number of tokens inferenced 
globally using the model, the types of hardware 
utilized for such inference and the percent 
breakdown between company of origin for such 
hardware, 
and 
the 
percentage 
of 
global 
inferenced tokens attributable to the model. 
(7) An assessment of emerging artificial intel-
ligence research in China, based on indicators such 
as academic publications, patent filings, and re-
search funding, including— 
(A) the development of novel artificial in-
telligence algorithms and techniques, including 
advancements in reinforcement learning, nat-
ural language processing, or computer vision, 
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with a focus on algorithms and techniques most 
relevant for developing or deploying the most 
advanced artificial intelligence systems; 
(B) advancements in hardware designed to 
enhance artificial intelligence capabilities, in-
cluding custom integrated circuits, quantum 
computing technologies, or neuromorphic com-
puting systems, with a focus on hardware ad-
vancements most relevant for developing or de-
ploying the most advanced artificial intelligence 
systems; 
(C) the scale and focus of research efforts, 
including the number of researchers, institu-
tions, and collaborations involved, and the fund-
ing levels and sources, with a focus on those 
most relevant for developing or deploying the 
most advanced frontier artificial intelligence 
systems; 
(D) an evaluation of the potential impact 
of such research on future artificial intelligence 
capabilities relevant to national security com-
petitiveness; and 
(E) a description of licit or illicit methods 
or tactics such as unauthorized model distilla-
tion used by Chinese entities to steal non-Chi-
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nese artificial intelligence related intellectual 
property. 
(8) An assessment of the aggregate public fund-
ing and capital flows supporting artificial intel-
ligence development in China, including— 
(A) the sum total of China’s national, pro-
vincial, and municipal investment in artificial 
intelligence; 
(B) subsidies that are underwriting the 
costs of artificial intelligence development in 
areas such as compute, infrastructure, water, 
and energy; 
(C) an assessment of foreign capital invest-
ments, including the total amount invested and 
a breakdown by entity, including the country of 
origin and the amount invested; and 
(D) an assessment of the PRC-based enti-
ties that have received the funding, including 
the name of the entity and the amount of fund-
ing received. 
(9) The aggregate artificial intelligence com-
putational capacity in China, including— 
(A) a detailed analysis of computational 
capacity of the 5 most capable entities in 
China, including the number and types of inte-
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grated circuits and server systems used and 
their aggregate computational power; 
(B) the countries and companies with re-
spect to which China sourced their computa-
tional capacity; and 
(C) the locations and specifications, includ-
ing energy and computational capacity, of 
datacenters used for advanced artificial intel-
ligence training and inference. 
(10) An assessment of leading humanoid robot 
manufacturers in China, including Unitree Robotics 
and Fourier, that includes— 
(A) with respect to such manufacturers, 
the— 
(i) production capacity per year; and 
(ii) unit cost and pricing trends for 
such robots intended for commercial de-
ployment; and 
(B) with respect to the humanoid robots 
produced by such manufactures— 
(i) the number, type, and country and 
company of origin of the semiconductor 
components, including integrated circuits, 
used to build, run, or train such robots; 
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(ii) the country and company of origin 
and the technical specifications of critical 
components used in such robots, including 
actuators, sensors, and battery systems, 
and if not Chinese, the progress toward 
indigenization; 
(iii) a description of the tasks such ro-
bots can perform; 
(iv) whether such robots are teleoper-
ated, operated through hard-coded instruc-
tions, or function autonomously using arti-
ficial intelligence models; 
(v) whether inference is performed lo-
cally or via remote cloud services; 
(vi) the number of such robots de-
ployed across China, including in the mili-
tary, manufacturing, logistics, health care, 
security, and personal assistance sectors; 
(vii) the extent to which, and ways in 
which, such robots are diffused in other 
countries, including in the United States; 
and 
(viii) an assessment of the cybersecu-
rity and other vulnerabilities of Chinese or-
igin robotic systems. 
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(11) An assessment of the most advanced or 
widely used artificial intelligence-powered applica-
tions developed by Chinese entities or built on Chi-
nese artificial intelligence models, including— 
(A) the artificial intelligence models used 
to power these applications, including the com-
pany and country of origin for each model and 
whether the models are open-weight or closed- 
weight; 
(B) the means of deployment and the ex-
tent to which such applications are used, in-
cluding in the United States; 
(C) the purposes, capabilities, and pro-
moted uses of the applications; 
(D) an analysis of how data collected or 
generated by the applications is used, including 
for artificial intelligence model training, surveil-
lance, or other national security-relevant pur-
poses; and 
(E) an evaluation of the potential risks 
posed by these applications to United States 
national security, foreign policy objectives, or 
data privacy. 
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