I 
119TH CONGRESS 
1ST SESSION H. R. 6207 
To prohibit purchases of certain semiconductor manufacturing equipment 
from foreign entities of concern or subsidiaries of foreign entities of 
concern, and for other purposes. 
IN THE HOUSE OF REPRESENTATIVES 
NOVEMBER 20, 2025 
Ms. LOFGREN (for herself, Mr. OBERNOLTE, Mr. KRISHNAMOORTHI, Mr. 
MOOLENAAR, Mr. LANDSMAN, and Mrs. HOUCHIN) introduced the fol-
lowing bill; which was referred to the Committee on Energy and Com-
merce, and in addition to the Committee on Science, Space, and Tech-
nology, for a period to be subsequently determined by the Speaker, in 
each case for consideration of such provisions as fall within the jurisdic-
tion of the committee concerned 
A BILL 
To prohibit purchases of certain semiconductor manufac-
turing equipment from foreign entities of concern or 
subsidiaries of foreign entities of concern, and for other 
purposes. 
Be it enacted by the Senate and House of Representa-
tives of the United States of America in Congress assembled, 
SECTION 1. SHORT TITLE. 
This Act may be cited as the ‘‘Chip Equipment Qual-
ity, Usefulness, and Integrity Protection Act of 2025’’ or 
the ‘‘Chip EQUIP Act’’. 
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SEC. 
2. 
PURCHASES 
OF 
SEMICONDUCTOR 
MANUFAC-
TURING EQUIPMENT. 
(a) DEFINITIONS.—Section 9901 of the William M. 
(Mac) Thornberry National Defense Authorization Act for 
Fiscal Year 2021 (15 U.S.C. 4651) is amended by adding 
at the end the following: 
‘‘(14) The term ‘completed, fully assembled’, 
with respect to semiconductor manufacturing equip-
ment, means the state in which all (or substantially 
all) necessary parts, chambers, subsystems, and sub-
components have been put together, resulting in 
such equipment that is— 
‘‘(A) ready-to-use or ready-to-install; and 
‘‘(B) ready to be purchased directly from 
an entity. 
‘‘(15) The term ‘ineligible semiconductor manu-
facturing equipment’— 
‘‘(A) means completed, fully assembled 
equipment that is manufactured, assembled, or 
refurbished by a foreign entity of concern or 
subsidiary thereof and designed for use in the 
fabrication, assembly, testing, advanced pack-
aging, production, or research and development 
of semiconductors; 
‘‘(B) includes— 
‘‘(i) deposition equipment; 
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‘‘(ii) etching equipment; 
‘‘(iii) lithography equipment; 
‘‘(iv) inspection, measuring, and test 
equipment; 
‘‘(v) wafer slicing equipment; 
‘‘(vi) wafer dicing equipment; 
‘‘(vii) wire bonders; 
‘‘(viii) ion implantation equipment; 
‘‘(ix) chemical mechanical polishing; 
‘‘(x) diffusion or oxidation furnaces; 
‘‘(xi) thermal processing equipment; 
and 
‘‘(xii) automated material handling 
systems; and 
‘‘(C) does not include any part, chamber, 
subsystem, or subcomponent that enables or is 
incorporated into such equipment.’’. 
(b) INELIGIBLE USE OF FUNDS.—Section 9909 of 
the William M. (Mac) Thornberry National Defense Au-
thorization Act for Fiscal Year 2021 (15 U.S.C. 4659) 
is amended— 
(1) by redesignating subsection (f) as sub-
section (g); and 
(2) by inserting after subsection (e) the fol-
lowing new subsection: 
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‘‘(f) INELIGIBLE USE OF FUNDS.— 
‘‘(1) IN GENERAL.—Subject to paragraph (2), 
the Secretary shall include in the terms of each 
agreement with a covered entity for the award of 
Federal financial assistance under section 9902, or 
with the recipient of an award made under section 
9906, prohibitions with respect to a project relating 
to the procurement, installation, or use of ineligible 
semiconductor manufacturing equipment, to be ef-
fective for 10 years beginning on the date on which 
the agreement is signed. 
‘‘(2) WAIVER.—The Secretary may waive the 
prohibitions referred to in paragraph (1) if— 
‘‘(A) the ineligible semiconductor manufac-
turing equipment to be purchased by the appli-
cable covered entity is not produced in the 
United States or an allied or partner country in 
sufficient and reasonably available quantities or 
of a satisfactory quality to support established 
or expected production capabilities; 
‘‘(B) the ineligible semiconductor manufac-
turing equipment at issue was manufactured or 
assembled by an entity that is not a foreign en-
tity of concern or subsidiary thereof and was 
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