The Bonder module includes a Megasonic Clean station for ultrasonic cleaning of wafers before alignment. Using the specially provided bond tool, wafers to be bonded are aligned on the 620 Aligner and then placed in the 501 Bonder for processing. Our current configuration accomodates 100 mm round wafers. Universal vacuum bond chamber design allows for control of voltage, contact pressure, and temperature. Independent control of upper and lower plate temperatures allows for differences in thermal expansion coefficients in different substrate materials.
Software allows full automation of the bonding process, with process control capability.