In addition to proper handling of components, solder quality affects how reliably information can travel from the chip to the module and back. The temperature and humidity in the assembly and storage areas must be regulated to prevent warping, expansion, and contraction of components during assembly. ESD damage can result from excessive and inappropriate handling. The more thoroughly memory has been tested before it is shipped, the less chance of problems during operation. In addition to standard production tests to ensure that the modules have been built correctly, memory can be tested for compatibility in the systems in which it will be used.
Some companies perform testing at all levels, and some do less testing.
This section contains information that helps make sense of the fluctuations that can occur in the memory market. These time and cost factors directly affect on the ability of the memory market to adjust quickly to fluctuations in supply and demand. When demand for memory chips increases, chip manufacturers typically do not respond immediately because the investment required to add more capacity is substantial and may not pay off, especially if all the competitors are doing so at the same time. Therefore, the immediate effect is that prices rise as manufacturers assess whether the increase on demand is temporary or substantial enough to warrant investment. By the same token, when there is an oversupply situation in the market, chip manufacturers are willing to sustain losses for a long time while prices fall to below breakeven levels.