The upshot of all this is the ability to build chips that are smaller and whose circuitry operates more efficiently than previous processes made possible. Essentially, that means faster processors that require less power and generate less heat.
Smaller transistors mean more functionality can be built into a given die size.
Motorola noted the ability to build in analogue technology and radio frequency circuitry onto the die alongside the digital logic, a nod toward cellphone and wireless networking equipment vendors keen to cut down on the number of chips they use. Motorola also highlighted HiP7's modular approach to design, primarily to emphasise how the process can be used for a variety of different kinds of chip. Motorola is currently sampling 0.13 micron versions of its embedded processors, and expects to begin volume production in Q3 at its Austin, Texas fab. That's round about the same time Intel will begin volume shipments of its first 0.13 desktop part, the next generation of the Pentium III, codenamed Tualatin. How soon HiP7 is extended to the PowerPC line remains to be seen.