The temperature control system is a patented feature, unique to the Plasma Etch product line. No ramping of temperature occurs during the plasma process. Etch rates are predictable and repeatable, due to steady state process temperature. Etch rates are accelerated by using elevated process temperatures. Start and stop system operation requires no throughput limiting temperature stabilization cycle.
Temperature control is independent of the plasma process.
No temperature control elements are exposed to the plasma process. Any process temperature from 175 F to 300 F may be selected for compatibility with all board materials. Points A and B are the respective starting and the ending points of the plasma process sequence. Processing temperature is essentially constant throughout the plasma sequence. Any temperature within the control range may be selected and is automatically maintained.