Thinning can bring the substrate thickness down to 0.001 inches with either a lapped or polished finish. Our lapping process will give any desired thickness tolerance and good flatness. The thicker the finished substrate, the better flatness we can can achieve. Most thick film applications do not require polished substrates. Thinning produces parts as thin as 0.002 inches.
Thin substrates are an excellent material for thick film chip capacitors.
4 by 4 inch plates can be routinely lapped to a thickness of 0.0035 to 0.004 inch with a surface finish of 15 to 20 microinches Ra. Aluminum nitride ceramic substrates have outstanding thermal properties. These nontoxic substrates also offer good electrical, mechanical and chemical properties making them ideal for high power semiconductor applications. AlN is a good choice for high performance chip carrier applications and for both large and high power die. Valley Design's lapping process will produce good surface finishes and meet any flatness and thickness requirements.