Micro machining and wafer bonding. Microstructures for the measurement of visible and infrared radiation, pressure, acceleration, temperature, gas purity, and ion concentrations. Merged process technologies for sensors and circuits. Data acquisition circuits, microactuators and integrated microsystems. Projects in chip design.
Students handle case examples.
Relevant theories of communication, decision, and control augmented by reading and laboratory demonstrations where appropriate. Analytic stochastic models for the failure of components and systems. Analysis of policies for optimal reliability, including strategies for surveillance, inspection, maintenance, repair, and replacement. Election for dissertation work by doctoral student not yet admitted to status of candidate. Election for dissertation work by doctoral student who has been admitted as a doctoral candidate.