This machine is capable of handling thin materials and rigid PCBs. This brochure discusses high speed spray coating, the spray array pattern, and the advantages of spray systems. Process capabilities of the DSA spray technology are discussed. Graphs are included to illustrate the relationships between conductor height, conductor width, ink thickness on the conductors, and the thickness of solder mask on the panel. Teledyne Halco's HSL-175 Standard and Basic configurations are covered in detail, including options and layouts.
Some additional configurations are available to handle thicker backplane-type panels.
The Unicote HSL-350 Horizontal Solder Leveling System is the backbone of the TET Halco solder leveling family. It is a high-volume production system that utilizes manual and relay logic controls. System advantages, design features, and technical specifications are referenced. This paper explores how the angle of the panel during hot air leveling impacts the quality of the product. The purpose of the Capabilities Guidelines is to define solder leveling capabilities by Unicote model number, and meaningful solder thickness measurements.