Thin Films Mechanical Behavior of Thin Films Techniques for characterizing the mechanical behavior of thin films are being developed and applied. Because the films are formed by physical vapor deposition, their microstructures, and hence their mechanical properties, are quite different from those of bulk materials of the same chemical composition. While the general principles of conventional mechanical testing are applicable to thin films, special test equipment and techniques are required. The ultimate goal of this project is to test specimens produced by semiconductor fabrication equipment and similar in size to features on integrated circuit chips.
Thin films are an essential component of all advanced electronic devices.
Understanding of failure modes in these devices, especially interfacial delamination, requires knowledge of the mechanical behavior of the films. Techniques for chacterizing the mechanical behavior of thin films are being developed and applied. Because the films are formed by physical vapor deposition, their microstructures, and hence their mechanical properties, are quite different from those of bulk materials of the same chemical composition. While the general principles of conventional mechanical testing are applicable to thin films, conventional test equipment and techniques are not. We have continued to support one such apparatus at NIST and one at Motorola in Tempe.