SUSS is a leading supplier of microlithography tools for the telecommunications and optoelectronics industries. What follows are a number of solutions that we currently offer.
Wafers are processed cassette to cassette, dry in, dry out.
Each wafer receives a high temperature presoak to dissolve the underlying polymer followed by an efficient high pressure clean and rinse. The parameters can be dialed in to achieve success over a wide range of metal stack and underlayer conditions. The system is designed to prevent yield killing metal redeposition while providing a robust mechanical design. Contact us for more details. Once mounted the wafers are thinned using a polishing process.