The quantity detected is a function of radiant power. The variations in performance result from process variances. The products are given product designations based on operating speed ranges. The shorter the spiral flow, measured in a specially designed test mold, the less likely that a production mold for semiconductor packages will completely fill with plastic when that material batch is used. As molding compounds age in storage, the spiral flow becomes shorter.
Spiral flow is measured in inches.
The displaced molecules of the target material are then deposited on the wafer surface. SSA see Semiconductor Safety Association . SSI see small scale integration . SSQA see Standardized Supplier Quality Assessment . The system user or vendor will specify the X and Y directions in this plane for any particular equipment studies.