Electrical insulation with high dielectric strength allows separate insulating films, washer, etc. to be eliminated in many applications. Transfer tape format means that there is no carrier layer - instead a homogeneous film of adhesive is supported on the protective release liner. Absence of a carrier film allows better gap-filling between rigid parts. This improved contact results in higher bond strength and lower thermal resistance in the actual application. Extended cure times, high temperatures, fixturing, etc.
Tape can be die cut or fashioned to meet specific applications.
Mounting thermoelectric cooling modules. Bonding flex circuit to heat sink. Bonding heat sink to microprocessor. In a given application the percentage of adhesive contact will depend on the flexibility of the parts bonded, and their non-planarity or runout with respect to the thickness and softness of the adhesive. All trademarks used are properties of their respective owners.