To characterize the thermal mechanical properties of new material require the use of multiple metrology toolsets, example, Stress Tools, Thermal Desorption Spectrometers, Ellipsometers, Annealing ovens etc. However, during such development phase, sufficient quantities of identical samples would normally be lacking. The FSM 900TC-vac Integrated Metrology Chamber has been designed to eliminate problems with data interpretation due to such sample to sample and tool to tool variations. The system is based on an RTP type annealing chamber. Various wafer sizes can be accomadated, including wafers up to 300mm.
System have the potential to ensure that the process integration roadmap can be on target.
Quantitative Adhesion Tester . FSM Laminar Quantitative Adhesion Tester . The tool complements the FSM900TC in characterizing the adhesion properties - Fracture Toughness and Debond energy of the thin film stack. The tool help determine and compare the adhesive and cohesive properties of new materials, as a function of their processing conditions.