The SIA Roadmap predicts a very aggressive path of technologies from 0.35 m to 0.10 m technology design. Increasing frequencies together with decreasing geometries lead to a number of issues which need to be examined.
Testing is clearly one main issue.
Another area of concern is that of signal integrity of the interconnects. The interconnects must not only be analyzed with regard to opens and shorts but also with regard to the signal delays. Furthermore, hazards can occur.