The award has been in association with a major electroplating tool suppliers.
Systems are both first time and repeat orders at three leading Asian foundries.
All forecasts for 2001 point to continued growth and capital spending for leading edge technology equipment such as 300mm, low-k and copper. Evidence to this is the growing number of orders taken for Copper 2.0 systems. As the demand for higher levels of performance and functionality in electronic devices continue, the industry must migrate from aluminum to copper based interconnect technology. Microbar s suite of Copper 2.0 products ensures chemical preservation by integrating high purity delivery to, and safe recovery of spent material from the copper deposition tool. For use on pilot as well as high production lines, the Copper 2.0 products are scalable as production volumes increase.