We went to their new manufacturing facility in Dresden and took a look behind the curtain. Due to the persistent boom for semiconductor products, it has become very difficult to get all tool sets quickly.
Some devices have delivery times of more than a year.
Even if you can get everything faster, it is still very difficult to speed up the chip production radiply, as the yield will most likely be afflicted with it. As a matter of fact, the yield is one of the most important issues. Each wafer has to undergo 500 single production steps, before the dies will be finished. But afterwards, you still don't have the final processor, as it still has to be packaged and bonded. The final assembly is not done in Dresden or in Austin, but in another facility situated in Malaysia.