The agreement between LSI Logic and ChipPAC continues LSI Logic's momentum towards being the provider of the defacto standard of advanced package solutions.
Thermal performance is enhanced by direct attach of the die to the copper heatspreader.
LSI Logic continues to develop high-performance and high ball count packages for deep submicron design. A company needs to be able to provide the total optimized solution. In addition to FlipPAC, ChipPAC's products include a full line of BGA, CSP and leaded products, as well as full test capabilities and prototyping facilities. Low dielectric constant reduces propagation delay, capacitive loading and crosstalk. Wire bond leadframe based package utilizing 'gull wing' leads.