Semiconductor packaging encases the chip, connecting it to the other parts in an electronic product.
The package is built around a unique flexible foundation that compensates for the expansion and contraction that takes places as the chip heats and cools during use. This works like expansion joints in a highway, preventing cracks and failures. IBM's chip packaging breakthrough can extend the life of the entire system, such as a hub, a router or a server. This new packaging offering also features a fluoropolymer dielectric material, which optimizes chip performance by speeding the flow of electrical current from the chip to the rest of the system. IBM's HPCC is designed to support chip speeds in the gigahertz range, as well as high bandwidths.