Using the FMAX Template Traditionally, memory devices have been characterized by individually measuring each timing specification. This approach assumes that all device specs are independent of each other, which sometimes is not the case. How fast a device can operate is probably its most important measurement. At probe test, we abort out the high current fails in part to safeguard expensive probe cards. This strategy assumes a correlation of ICC values with the other tests.
Some products utilize a second power supply for a specialty probe test only pad.
This is not always measured for current and by design assumed to be small. A small program module to monitor ICC during functional tests and shmoos has been developed here. Results, code examples and pitfalls that have been discovered along the way will be shared. Fails Make Fails allow the programmer to be able to check the fail processing mechanisms such as RFL, fail counting, bitmapping, and redundancy, before ever touching the product. With this updated instance based version of Make Fails, you are not limited to one input fail signature from a single file.