These skills are enhanced through group site visits and participation in a team based product design. General Aims Students are presented with aspects of general manufacturing to enable them to better liaise with and participate in the manufacturing industry sector. These skills are enhanced through group site visits and participation in a team based product design. To introduce students to different circuit implementation approaches with considerations of volume. To examine Integrated Circuit Packaging and Bonding approaches.
Students gain an understanding of fundamental concepts.
60 Students must complete tasks which demonstrates their knowledge. Reports oral and written, laboratory and formal examination. 60 Creative Students develop initiative and are encouraged to solve problems in different ways. 20 Projects set are designed to extend students. Staff assessment oral and written presentations.