We recommend that you use the data presented in the table as a starting point, and that you make test cuts on a non-critical section of the device to optimize the procedure for the task required. Clearing metal lines of polyimide and oxide in order to permit micro-probing. Top metal line was also cut to isolate part of the circuit. The exposed metal 2 area could be e-beam probed, also. Each cut was made using two separate, consecutive single-shot 50 x 5um cuts.
Successful laser cutting on semiconductors and LCD devices is wavelength dependent.
Different materials require different techniques. Multiple wavelengths combined with different techniques are often necessary to obtain the desired results. A higher laser pulse repetition rate, such as that offered with the New Wave Research QuikLaze system, is desirable when removing large amounts of material, or cutting across large metal buses. The following table summarizes the optimum wavelengths recommended for cutting and removing common semiconductor materials.