The mechanisms of silver corrosion in polluted dry and humid atmospheres have been studied. The presence of NO 2 with H 2 S greatly enhances silver sulfidation and when high relative humidity is added. The rate of sulfidation is extremely rapid and is limited by gas-phase diffusion even at high flow rates. Therefore, the solid-state transport of silver atoms from the bulk is faster than the interfacial reaction and does not affect the rate. Another phenomenon in electronics degradation is whisker growth, defined as filimentary growth on metallic materials.
Whiskers can be metallic or inorganic compounds.
Although this behavior is still under investigation, it is reported to be a form of induced recrystallization related to metallurgical imperfections and occurs under the influence of stress. Whiskers grow on tin, zinc, cadmium, and silver and can grow long enough to short out circuitry.