HyComp - Flip Chip HyComp Flip Chip Flip chip assembly gives the closest chip spacing of any microelectronics packaging method. Instead of placing the chips in space-wasting individual packages, flip chip places them face down onto matching connections on the substrate or board. Since the connections are under the chip, no additional space is required for bond wires. Connections can be made anywhere on the surface of the chip, using the whole chip area instead of just the edges.
Shorter connections eliminate the high speed performance penalties of conventional bond wires.
HyComp's Chip Flip approach is an adhesive flip chip manufacturing process that starts with bumping individual chips, rather than wafers. Bumping single chips eliminates the cost and complexity of starting with an entire wafer. Our process is very efficient for prototypes, samples, and production startup, and scales up easily to volume production. Additional information on adhesive flip chip can be found in our flip chip papers , or other flip chip web sites . Also be sure to visit our flip chip photo gallery .