Sn eutectic solder enabled by the Palomar Model 3500-II LD Assembly System. Using a programmable time and temperature controlled process, p-side up InP laser diode is automatically attached to submount with 10 micron precision. Automatic bonding of 0.5 x 3 mil Au ribbon can also be done on the 2470-V. Automatic handling system for modules can be added to augment throughput and reduce operator handling.
Solutions are available for a wide variety of ball and wafer sizes.
5 micron placement accuracy. A controlled temperature profile is provided to ensure sufficient wetting of the eutectic solder while consistently maintaining a maximum safe temperature for the laser device.