10.6.01 Process for forming a semiconductor circuit with wiring lines having an upper cap layer and filling the gaps between the wiring lines with a dielectric material using high density plasma chemical vapor deposition. An integrated process is used to form conductive structures made up of wiring lines having an upper cap layer separated by gaps on a substrate where the gaps between the wiring lines are filled using high density plasma chemical vapor deposition. Edge enhancement device that generates characters with smooth edges on a photoreceptor, the characters formed by using spots of different sizes. Voice Response A system which interfaces callers at remote terminals through a telephone network to provide voice prompts to the callers so that they can provide information to the system. Prepaid wireless cellular phone communications using a Mobile Telephone Switching Office.
Special rules apply to three related bounties.
See the long description below. Calls Prepaid outbound wireless cellular phone communications using a Mobile Telephone Switching Office. Special rules apply to three related bounties. See the long description below. Special rules apply to three related bounties.