Able to handle all SMD of up to 50mm square. Able to remove PGA and BGA of up to 50mm square. Able to use for reflow of QFP, BGA , etc.
Timer is used to prevent damage of PCB and components.
A hollow heater enables optimum insulation. Expect high precision and good efficiency. Various sizes of tips are available for regular to microscopic soldering. This compact and lightweight unit has the capacity equivalent to the station-type. A newly designed high capacity 200W ceramic heater and quick heat control circuit provide excellent quick heat buildup and fast recovery.