Contact hotplate PEB processes will concentrate PAC at the resist surface. This will increase surface tension and induction effects during develop. The use of higher normality developers may be considered but only at the risk of reduced process latitude. A gold plating bath or Al 2 O 3 etch bath are typical problem areas. The use of the SJR resists will usually solve this problem.
Problems can come from the spin, bake, or hardbake processes.
As resist thicknesses or target sizes increase, the amount of retained solvent likewise increases. This can substantially reduce thermal stability. Non-uniform resist spreading can cause hearing effects. Softbake Causes Excessively high softbake temperatures can cause non-uniform solvent distribution. Too rapid cooling can cause thermal shock.