In a typical base-oxide removal step for an integrated circuit, includes all base windows, resistor windows, anode windows, base test patterns, and alignment marks that appear on the integrated circuit layout. PCB or PC board see printed circuit board . PDC see passive data collection . PDSA see peroxydisulfuric acid . Also called Pearson Type 1 distribution and beta distribution .
Peeling exposes the underlying material.
Also called flaking . Contrast blister metal . Its purpose is to seal out contaminants and reduce printed defects caused by contamination in the image plane of an optical exposure system. PBET is based on front-end analysis to ensure that qualified participants are able to reach mastery of job skills as described in clearly stated and measurable learning objectives. Also called flake chip or surface chip .