A minimum amount of bonding material would be between the bonding pieces, with most of the holding power in the groove spaces. This condition would also be helpful during any changes in temperature. In the second approach, to minimize bond material spring-back, the amount of readjustment should be reduced as the curing occurs. This procedure requires the optical observation of the mirror as the readjustment is performed. This method has been successfully used when positioning optical encoder disks on the encoder shaft.
Properties vary from container to container and batch to batch.
This can affect curing times and curing temperatures. The damper consists of a damping medium contained in an insert carrier pocket. The pocket cavity is less than filled with a particle medium. This impingement absorbs energy for the carrier when bellows vibration starts. A piezoelectric strain gauge exposed to piston displacement pressure.