These extensions will enable further device scaling to be achieved while still using the same equipment and similar processes from 0.25 m to 0.10 m and beyond. O N HOSP has been successfully integrated through five levels of metal in subtractive aluminum processing. HOSP is applied using standard spin-on coaters followed by hot plate curing. Following a plasma via etch, using traditional oxide etch processing techniques, a photoresist strip ashing step is completed. The ashing step can be completed in-situ after via etch.
Wet strip is completed with conventional strippers after dry ashing.
A degas procedure is recommended before deposition of metal. Once the barrier metal is deposited, metal deposition is completed through standard metal deposition processes. For additional information on HOSP or to obtain samples, please contact your Honeywell representative. Our customers will think of us first because we deliver cost of owner-ship advantages, we have global distribution of consistent high quality products and services and we are easy to work with . Honeywell Electronic Materials, a strategic business unit of Honeywell Inc., provides materials solutions to the global semiconductor and electronics industries, and employs 3,000 people worldwide.