In 1987, Novellus introduced new technology that increased yields in wafer production, and made them cheaper to produce. We called it multistation sequential deposition , and it resulted in an entirely new way of building insulating layers on chips that ensured improved repeatability and uniformity in the deposited films. In 1998, we were the first company to introduce a suite of deposition equipment for copper interconnects into production ramps for sub-0.24 micron applications. Performance is paramount Our top-performing products have generated an impressive stream of financial results. In the semiconductor manufacturing industry, performance is measured in productivity and throughput.
Reliability is critical.
Novellus' gapfill and sequential processing techniques deliver more flawless wafers more efficiently than any other equipment. Inc. All rights reserved.