Generally consisting of glass reinforced laminates up to 22 layers with blind and buried via technology, this product allows interconnect and attachment of bare integrated circuit die. Using a refined subtractive process, fine line width and spacing technology along with small hole drilling can be achieved. Multiple methods of attachment of the bare die promote flexibility and reduced cycle times.
Military certification is available.
When high density, low cost interconnections are required MCM-L packaging should be used. MCM-L. While limited to approximately 350 Mhz clock speed, most products can be designed into this lightweight subminiature package. Multiple methods of attaching the bare die are available, e.g. wire bond, TAB, flipchip. Click here to jump to our FTP site. Visit Metro Circuits.