The product has been subjected to detailed testing by a variety of electronics firms such as Hughes Microelectronics, Molex Switch Group, and Compaq Computer. The product can be used to bond temperature sensitive surfaces such as LCD glass and mylar, and constitutes a direct replacement for traditional lead-tin solder. The most important criteria for this rating, applied to the relevant portion of the product life cycle, are summarized below. A quantitative life cycle assessment on energy inputs for the extraction, processing, and transport of the raw materials required to manufacture the product, and comparing these results with a similar assessment for lead-tin solder, is beyond the scope of this study. Fewer steps in the manufacture of the product compared to lead-tin solder reduce the product's embodied energy further.
Oil production generates less harmful air emissions than the above metals.
Unlike lead-tin solder, the product does not produce any toxic air emissions during application. The product does not present a significant advantage when compared to lead-tin solder when considering the impact on water quality and usage. Both materials can lead to water contamination with heavy metals. The fact that less nickel is used compared to tin and lead is offset by water pollution from oil production. The extent of this pollution depends far more on the specific practices employed than on the resource itself.