Frank Greenhalgh says . . . Combine power and control. Use surface mount technology. Replace heatsinks and other hardware. Replace fragile ceramic substrates.
Power supplies can offer more watts per cubic inch.
Look for the potential to eliminate discrete devices and replace them at the board level. Wire bond connections to nickel plated traces complete the design. Keep things cool by eliminating thermal interfaces and by using thermally efficient solder joints. Similar results are obtained when the D3 Pak, and SO10 power packages are considered. You may save hardware and improve heat transfer.