The Boeing Microelectronics Center maintains resources for comprehensive research, development, production, and testing of multichip microelectronic circuits. Our technical staff includes specialists in the areas of materials and process development, reliability analysis, test development, and design. Computer-aided engineering workstations, automated assembly, and test equipment ensure quality while minimizing cost and turnaround time.
Skilled operators assemble and test multichip modules in a clean-room environment.
Particle count, humidity, electrostatic discharge, and temperature are carefully controlled to maintain consistent quality. Our ASIC Design Center is another advantage of working with our Boeing team that offers a broad spectrum of highly integrated design solutions.