The Boeing Microelectronics Center uses automatic and manual lasers to trim active and passive circuit parameters.
Substrates are continuity checked to ensure electrical integrity.
The thick-film printers are used for development and checkout, allowing for easy transfer to production. The innovative Boeing process for controlling ink deposition by weight ensures precise printing. The printing area is separated from the firing area with conveyers connecting the two areas permitting separate ambient controls in each room. Boeing Microelectronics uses automatic lasers to actively and passively trim resistors. Circuit parameters, including offset voltage, gain versus frequency, voltage levels, pulse width, and frequency output, are adjusted on line.