The PowerPAD thermally enhanced package provides greater design flexibility and increased thermal efficiency in a standard size IC package. PowerPAD's improved performance permits higher clock speeds, more compact systems and more aggressive design criteria.
PowerPAD packages are available in several standard surface mount configurations.
To make optimum use of the thermal efficiencies designed into the PowerPAD package, the PCB must be designed with this technology in mind. This document will focus on the specifics of integrating a PowerPAD package into the PCB design. Texas Instruments Incorporated. All rights reserved.