Upgrades New ESEM Backscatter Detector For more information, see the complete January 2001 Newsletter online. Plasma-etched silicon wafer, produced from an image of natural sand. The silicon wafer was etched to a depth of 50 micrometers. ESEM image courtesy of Cheema Chomsurin. Department of Civil and Environmental Engineering, University of Illinois.
More information is available.
The Microscopy Suite has a Specialist in Light Microscopy position available. Please see job description for more details. The ITG web servers are undergoing upgrades. Users may experience periodic outages, though everything that can be done to minimize this is being done. The new Leica SP2 Confocal system is up and running.