For example, diamond is the preferred candidate for circuit packaging on electronic substrates and high power device heat sinks. Finally, the large silicon fabrication houses would also be targeted, including Toshiba, Hitachi, Mitsubishi, Samsung, Micron, Singapore Technology and Vanguard. On the cost front, the three principle elements are materials, energy, and equipment. The plasma coating is flowing at hypersonic speeds, providing the most rapid process yet attempted. The simplicity of the manufacturing cell affords ease of duplication in one or multiple locations.
Quality is a function of the repeatability, uniformity, and film properties produced by the process.
The steady-state environment achieved in the coating chamber ensures repeatability from one coating run to the next. Thus, chip makers must compete on several fronts, but are looking for breakthrough discriminators primarily in low cost, high rate, high quality coatings. Of the relatively mature processes, the DC-arcjet method currently holds the greatest promise for the lowest relative cost as well as the highest relative deposition rate. The proposed hypersonic process has two distinct advantages over the DC-arcjet. First, the arcjet is a high temperature process that presents potential damage to both coating and substrate.