Pneumatic dispensing systems are more prone to clogging, presumably due to cold welding developed under cyclic pressurizing of the paste. With the rapid advancement in miniaturization of surface mount technology, it has become a great challenge to dispense solder pastes for ultra-fine dot applications, such as chip capacitors within BGA packages. Failure in dispensing fine dots properly often causes either a significant dispensing machine down time or a very high rework cost. As a result, it is extremely important to establish a solder paste dispensing process able to satisfy ultra-fine dot applications. In this study, the essential elements required to achieve ultra-fine dot solder paste dispensing are investigated.
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