As the computer and communications industries continue their migration to 3.3V or lower voltage logic, the low voltage and higher efficiency supply markets will become increasingly important.
Modular converters combine the needs of reduced volumetrics, low cost and increased power density.
Regardless of the choice of packaging, modular supplies depend on thermal conduction from device to the case base. The external hard plastic cover is easily removed and reveals a completely potted assembly based on two substrates. The two boards are connected through a series of nine soldered pins. The top PCB contains the bulk of control and switching devices while the IMS substrate is used to mount the power components with a direct conduction path through the base. The conventional PCB uses 2 ounce copper, whereas the IMS substrate uses 4 ounce copper, to thermally cope with the high power SMT devices mounted on it.