S parameters, impedance. Full Electrostatic-structural coupling. Direct coupled structural-electric physics. At release 5.6. Surface Acoustic Wave devices Acoustic - Structural coupling Microstripline components HF electromagnetics.
Mirror array display technology Electrostatic - structural coupling.
Return to Top Release 5.6 MEMS Enhancements Relase 5.6 enhancements for MEMS focussed on improvements to our electrostatics capability and coupled electrorstic - structural physics features. Highlights of these enhancements are shown below. Hybrid Finite - Boundary Element for electrostatics Reduced Order Macro Modeling. Automated multiport capacitance calculations. Two new systems of units suitable for MEMS simulation have been introduced.