Brian Lewis Mr. Brian Lewis is a flip chip process development engineer for Siemens Energy and Automation s Electronic Assembly Equipment Division. Mr. Lewis received his B.S.M.E. from the Georgia Institute of Technology in 1997. He has been involved with flip chip research for the past two years. He is currently involved with the research and development of Siemens new high-speed flip chip machine. Continuing Education accepts payment by a check made payable to Georgia Tech or by credit card with the account number and expiration date of your VISA, MasterCard, American Express, or Discover account.
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