The articles are translations from the company's Japanese language quarterly, Shinnittetsu Giho, which has been published since 1911. In addition to complete translations of some papers, NSTR also contains translations of the abstracts of all the remaining articles from the Japanese quarterly.
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Development of Molded TAB Package Technology Yoshiaki Emoto, etc. Transfer molding, a high- reliability plastic encapsulation process, was investigated for application to TAB, and transfer molding conditions to a package thickness of 1.80 mm were clarified. Packages fabricated as samples by applying the transferred bump TAB method and transfer molding method performed well in terms of both functionality and reliability. Take the civilian electronic equipment field as an example. Personal computers evolved from the laptop type to the notebook type, and a still smaller palmtop type has been announced.