The interface design from a thermal and physical point of view presents the biggest challenge. Moreover, the reduction in device size and the increase in power have compounded this issue. Therefore, understanding general package types and thermal interface design is an area that requires coverage. Secondly, in order to compensate for the temperature rise across the interface, continual improvement in heat sink performance is sought. Hence, this course emphasizes heat sink design with reference to performance and overall system design.
Many options exist in transferring heat from the chip to the environment.
This course provides insight into the overall cooling design for the wide range of power dissipation encountered in the electronics field. The instructors bring their combined 19 years of experience in research and development for industrial applications in presenting a targeted but broad approach to thermal design. The course leads participants through the application of heat transfer and fluid mechanics fundamentals in the design of practical electronics cooling solutions. The experimental and modeling techniques used in physical design and analysis of industrial electronics cooling. The course is intended for mechanical and electrical engineers engaged in the design and manufacture of electronic systems and packages.