High-throughput production applications are being addressed by integrating pattern recognition and increasing automation. Film thickness is on the order of 2 nm precision. Current spot size is under 1 mm, and later in the year testing will begin on hardware capable of making a measurement on a 100 m test area. The analysis is being applied to DUV photoresist, spin-on dielectric thin films and other materials. Because the system focuses on the chemical bond vibrational spectrum, anything that affects this is fair game for the technology.
Prototypes are in beta, and discussions are underway with equipment vendors.
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