The choice of fillers will influence the adhesives electrical conductivity, electrical insulation, and thermal conductivity. Levels of hydrolyzable ions outgassing, and moisture absorption are also important considerations for various package types. Each method - needle dispensing, stamping or pin transfer, and screen or stencil printing offers advantages and has specific implications for adhesive design. Dispensing, the most common method, provides a uniform amount of material on a variety of substrates at relatively high speeds. Stamping or pin transfer allows large areas to be bonded with a single application.
Printing is often a preferred method to achieve small depostion sizes.
Optimal adhesive curing requires full realization of the desired physical properties while maximizing manufacturing efficiency. Conventional epoxies are cured in box ovens at temperatures up to 225 C for times as long as several hours. The result is increased process speeds and reduced cycle times. Fast-cure adhesives reach full properties in just 15 minutes. If the devices being bonded are temperature-sensitive, epoxies that cure at room temperature may be desired.