We come together and look for defect density trends on the product wafers. We talk about the actual problems, look for possible root causes, and define the next activities needed to reduce defect density in the line. For troubleshooting, we have more meetings during the week. When a problem in the line comes up, we come together with the responsible process engineers, we have a short meeting, maybe one hour, and we define the next activities. When we make a true correlation and we know OK, we have a problem with one special tool, the process engineer who is responsible for the tool comes to us.
Metrology covers the whole characterization tool set.
We take care of all metrology issues as well as the manufacturing part of the inspections. On the other side, where we have physical parameter measurement, we are somewhat differently organized. There, we have process engineers taking care of metrology tools, not the operators, because those tools are spread around the fab. So metrology is taking care of defect inspection, maintenance of the tools, and the manufacturing and engineering of physical parameter measurements. Belz's comments about the spread of the metrology tools throughout the fab becomes clear as we proceed through the modules.