The design found wide support in the cellular phone market. The new Stacked MCP mounts flash memory and SRAM vertically, allowing further reduction of the package area on the printed circuit board. Key to the design is a SRAM die with a pin assignment compatible with that of the flash memory, which allows stacking with minimal wiring. This stacked design also enjoys the advantage of compatibility with future generations of high density flash memory. Simplified fabrication is facilitated by an 0.8mm pitch between balls.
Pin compatibility is maintained in all variants.
Fujitsu Limited is a leading provider of information technology products and solutions for the global marketplace. With over 500 group companies, Fujitsu is one of the world's largest suppliers of computers and information systems solutions, telecommunications and semiconductor products, software and services. The Fujitsu Group has over 180,000 employees worldwide and operations in more than 100 countries. The company's integration of these wide-ranging capabilities assures its position as an innovator in multimedia components, products and systems.