Ball Semiconductor of Dallas has developed a technology to integrate ICs on a small silicon sphere.
Plans also call for licensing the technology to other chip makers.
The technology processes 1-mm diameter silicon balls on a narrow pipe and eliminates wafer dicing and cutting processes. Neither does it require a clean room nor assembly. Copyright 1997 Ball Semiconductor, Inc . All rights reserved. For optimal viewing use Netscape Navigator 4.0 or Microsoft Internet Explorer 4.0 or later.