Also, due to limited substrate sizes, a large number of thin film structures cannot be processed in a single run, resulting in multiple runs with a corresponding increase in cycle time and cost. The inventors have devised novel methods and materials for simultaneously processing large amounts of thin film structures on several substrates, thereby lowering overall costs. Lower cycle time. Large area processing. Compatible with current MCM-D thin film process and other substrate technologies.
Novel materials minimize structure warpage concerns.
The efficacy of the technology has been successfully demonstrated in the laboratory with advanced modeling.