Copper interconnects are much more difficult to scale to higher bandwidths than optical interconnects. Until that time, the Labs did not engage in government-funded research, primarily because company objectives require research to be linked to a business and customer need. The Labs was foresighted in recognizing the value of parallel optics to the communications industry. While parallel optics is simple in theory, its implementation is difficult. Agilent Labs' design integrates optics, electronics, and packaging to optimize performance, manufacturability, and cost.
Packaging is a key challenge for parallel optics.
As data rates are increased, thermal effects begin to impact performance. Agilent Labs engineers developed a packaging platform whose geometry includes an electrical turn that dissipates excess heat to the air rather than the circuit board. Key to the packaging is a flexible printed circuit board laminated on to a copper base. More Information Agilent's PONI web page , which provides links to the product data sheet and two articles.