The result is increased process speeds and reduced cycle times. Fast-cure adhesives reach full properties in just 15 minutes. If the devices being bonded are temperature-sensitive, epoxies that cure at room temperature may be desired. Technical Report Extensive information is available on the specification of die-attach adhesives. A detailed approach to expediting the selection process is presented in our Technical paper No. GB 48.
Properties listed are typical, average values, based on tests believed to be accurate.
It is recommended the user perform a thorough evaluation for any application based on their specific requirements.