The optimum package will maximize its performance for all of these criteria. When comparing technologies, it is important that the circuit designer not jump to conclusions regarding the suitability of a package for an application just by reviewing tables of data. The actual packaging application must be analyzed before any decision is made. Today's typical wire bond length is 150 to 200 mils. UFP technology reduces this to 75 to 100 mils, or one-half of the previous length.
Inductance is a linear function by unit length.
Therefore, a wire half as long provides half the inductance. At first glance, the fine pitch substrates appear to have poor electrical performance, especially when viewing the inductance parameters. However, when comparing the numbers based upon real applications, the numbers for fine pitch substrates compare favorably to standard products. As would be expected, the 2S2P structures provide similar inductance. This comparison demonstrates that the new ultra fine pitch technology has favorable electrical comparisons to older, less dense technology.