The following sites contain information relevant to package modeling. Abstract A circuit topology is described for modeling a class of plastic surface mount packages. The model consists of three pieces each of which is circuit modeled based on an electromagnetic simulation. A simple model is presented for approximate calculations of the lowest order resonance frequencies of low cost MMIC packages. The model shows the effect of seal ring characteristics such as dielectric constant and via holes.
Experimental results confirm the usefulness of the model.
42, pp.-,September 1994. Abstract At high frequencies, grounded coplanar waveguide MMIC circuits can be prone to destructive inter-circuit coupling effects due to substrate resonances. 1641-1645, September 1993. Abstract A novel formulation is presented for the method of moments solution of shielded, enclosed microstrip MMIC circuits. 406-414, March 1993.