These possibilities do not exist when procuring pure commercial parts where the customer base is served through distribution. The issue of part capability is not just a factor for new designs. If the path of upscreening is chosen to gain some form of assurance that parts will perform over temperature other issues exist. As stated earlier, upscreening is costly in low volume. Also there can be a negative impact on reliability.
Mechanical damage can cause moisture issues.
Burn-in can cause lead finish degradation. IC manufacturers will not support upscreening. Few upscreening test facilities have the ability to test complex parts. Finally, upscreening is not a best commercial practice. The user should procure parts that fully meet their electrical and environmental needs as a first priority.