10 X. Eliminate long drying time of wet processes. Polysilicon and Nitride Deposit Removal Replaces HF wet etch cleaning processes with a clean, safe and dry process.
Quartz boat wafer slots are unaffected by plasma treatment.
Reduce toxic HF exposure to workers. Tungsten Deposit Removal Replace heated H2O2 wet etch cleaning process with clean, safe and dry process. Improved quality by complete removal of tungsten. Reduce clean time by 5 X. Eliminate long drying time of wet process. Reduce toxic exposure to workers.