Because the prototypes of the FPIX and sensors already require bump bonding, this may be too long. I've given it about 6 months. A short period like that, I think, will make it very tight for all the proposed solutions. The bump bonding schedule isn't very fixed. UC Davis has a bump bonding facility, and they've been doing some of the Atlas prototypes.
More work needs to be done to understand that.
I've put lots of time in for tests. I can do this mostly because the 2003 shutdown date is fairly far in the future from the point of view of the pixels. There are a few notes, however. Economy of personnel if both CDF and D0 opt for this. An external resource for bump bonding would have to be located.