The semiconductor industry has made tremendous progress in the last few years, and the present problems in the electronic industry are mainly in electronic packaging.
Packaging technology involves both system and materials considerations.
Systems considerations pertain largely to the packaging schemes, whereas material considerations pertain to the improved materials that allow for more demanding packaging schemes to be possible. Examples include higher thermal conductivity to address heat removal, low thermal expansion materials to better survive thermal stresses during temperature cycling in a system, and alternatives to solder to address ozone-depleting and lead content issues. This book examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. The 16 self-contained chapters, contribute by a variety of active researchers from industrial, academic and governmental sectors, is tutorial in nature and provides a broad overview of each topic.