A low stress encapsulate covers the bond leads, and eutectic solder balls are attached to pads on the tape. Lead-Free application notes available upon request. Lead-Free package available Q1 2001. It uses a dummy die with no electrical connections. 9.28mm sq Parts are packaged in waffle trays.
Parts are daisy-chained.
Call for tape and reel availability. It uses a dummy die with no electrical connections.