Mutual inductance is a bigger problem than mutual capacitance in high-speed digital circuits.
One of the best ways to eliminate ground bounce problem is having many ground pins in the chip packaging. Chips where multiple ground pins used, each ground pin should have a direct path to ground plane. Connecting more than one ground together and then running them through a trace to ground does not make use of having independent ground leads. Inductance of logic device packaging becomes really critical at high speeds. Double clocking of flip-flops can happen when output switching currents flow through a ground pin causing ground bounce.