MCNC was also to assemble some structures via the flip-chip process. However, MCNC had great difficulty in properly depositing bumps. This resulted in a greatly delayed schedule, and, in the end, MCNC could not meet the bump requirements. A few continuity test assemblies and bumped active devices were delivered in late 1996, more than six months behind schedule. Preliminary continuity tests show that the bump yield is not zero.
More measurements are underway.
Should the yield be sufficient, the active test structures will be irradiated, as planned, and measured, although many months later than expected.