Three FET stages with resistive feedback maintain highly repeatable linear phase and amplitude characteristics. The high isolation, low SWR, and unconditional stability of the TGA8061-SCC make it ideal for following or driving mixers and filters. Small size and low external parts count simplify system design and integration into higher- level assemblies. Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as the thermocompression and thermosonic wire bonding processes.
Ground is provided to the circuit through vias to the backside metallization.
TriQuint Semiconductor, Inc.