Cu has been hailed as the most effective material for fabricating interconnects to be used in future generations of high-performance ULSI devices. The inherent advantages of Cu metallization include lower resistivity, better reliability, and lower manufacturing cost as compared to present-day Al interconnects. This course covers fundamentals of electrochemistry to practical process integration issues. The instructors are among the foremost scientists and researchers in this field and have plenty of practical working experience in the topics they cover. They break down their specialized information into understandable and concise forms.
Enrollment is limited and advance enrollment is required.
He cofounded CuTek to develop electrochemical Cu deposition processes and equipment to help establish Cu metallization as a mainstream IC technology.