We extended this to three dimensions by adding connections to each RLB from above and below. This makes our architecture truly 3-D with each logic block having connections to logic blocks on other layers. The three dimensional technology used in Rothko is developed by the Microfabrication Group at Northeastern University , which is based on transferred circuits with interconnections between layers of active devices.
Interconnections are in metal, and can be placed anywhere on the chip.
Rothko RLB Layout . Routing Structure within a Layer. Vertical Connections between layers. Segmented Routing Channel. We would like to thank Scott Hauck for his help with the Triptych architecture.