A study is in progress to understand the degradation mechanisms. Modeling of microstructural evolution A variety of research projects have constructed analytic and computer simulation models of various aspects of the evolution of microstructure in materials. Of particular interest is the evolution of microstructure within the metallic interconnect lines in advanced integrated circuits, which is very important to their long-term reliability. Conventional semiconductor-grade materials are under investigation, as well as new materials more appropriate for micron scale mechanical, fluidic, optical, and magnetic devices. We are also studying stiction-free release processes for these structures.
Ice Ice is central to a number of issues.
Research focuses on the physical mechanisms underlying the strength and failure of the material and on the influence of environmental factors on these properties. In the physics of ice, the electromagnetic radiation from cracks in ice, proton photoconductivity of ice, and electrical effects in ice friction are being investigated. Ice adhesion Ice strongly adheres to a wide variety of solids. Icing of airplanes, helicopters, ships, and power lines, as well as icy roads, are costly and dangerous problems that call for the development of coatings with very low adhesion to ice. We measure the tensile adhesion strength, shear adhesion strength, the total interfacial energy, and the electrostatic component of this energy, and the thickness, electric charge, and capillary pressure of the liquid-like layer.