Friction and wear effects in tribological studies. Wear out of masters and sub-generations in compact disk stamping. In Addition, the Dimension 5000 is available in fully automated systems for LZT bump analysis, PTR measurements, and for other high-throughput applications. It also supports wafer-level development applications. Monitor substrate materials, from electro-optics to flat panel displays.
Measure scratches, pits, digs, and grooves.
Monitor grain size and morphology of all optical films using a variety of roughness parameters including power spectral density, bearing ratio, surface area, and all of the amplitude-only parameters. Gratings and other patterned features. Measure feature sizes on these structures. Measure microroughness of finished product surfaces. TappingMode combines the best of both contact and non-contact techniques.