Our process temperature is regulated by the patented electrode temperature control system. No other plasma offers non-plasma generated chamber heating. The plasma process generates high energy plasma fields at the edge of the electrodes, which causes accelerated etching at these edges. This can be viewed as the bull's eye effect that results in severe process non-uniformity. All vacuum chamber internal surfaces on Plasma Etch's systems are electrostatically shielded to eliminate plasma reactions with the chamber walls.
Plasma activity is then uniform across the electrode surface.
This creates a uniform etch across the entire surface. The physics of a high frequency RF plasma is very different from a low frequency RF plasma. The high frequency generates a much more reactive plasma. This feature is required for processing three dimensional objects or small drilled holes. Additionally, systems that operate at 13.57 MHz are three times as fast as systems that operate at 40 KHz.