Hence, flip-chip packaging offers the best electrical, thermal, and mechanical advantages. Therefore, manufacturers are opting for CSP based on the perception that it can provide many flip-chip performance advantages in the near term, as well as fit within an SMT infrastructure. It may appear that CSP design integration is an obvious solution for use in SFF products. However, implementing successful assembly integration and process controls is by no means simple. The first consideration should be the diversity of CSP styles.
Many options are available in varying degrees of complexity.
Table I summarizes various characteristics and options. Having such a variety available has contributed to the reasons CSP has not achieved the mainstream deployment enjoyed by kindred BGA devices. The options often confuse even the most knowledgeable product designers and systems developers. Table I. Chip-scale package styles. Selecting a CSP style should be based on required performance as well as on known or anticipated systems reliability concerns.