This EN process was designed to produce nickel bumps on an aluminum pad on wafers. Produces uniform bumps with excellent adhesion to aluminum pad. The EN deposit readily accepts gold from immersion or electroless gold. This EN process deposits a low phosphorus, hard nickel deposits which readily accepts immersion or electroless gold. Nickel deposit is compressively stressed which is an added advantage.
Process maintains high deposition rate with excellent bath stability.
A cyanide-free zincate process designed to achieve maximum adhesion of EN deposits to aluminum sputtered areas on a wafer. Will not harm aluminum pad. Sub micron filtered for semiconductor processing.