We hope this information will aid die users in selecting the most effective manufacturing approach for their applications. The trend in the electronics industry is toward smaller and lighter with higher performance. Fuelling this trend is continuing silicon integration as well as advanced packaging technologies. The use of unpackaged semiconductors, or die products, is accomplished through direct chip attach on a substrate. In a high speed digital system, the ability to reduce switching noise is critical for proper functioning of the system.
Noise margin is designed into digital devices.
It is the difference between worst-case output signal level from a driver and the minimum signal that is necessary to insure that an input always correctly determines the logic state being transmitted. The rapid demand for smaller and smaller consumer products is pushing designers and manufacturers to reassess their selection of componentry, materials, and assembly methods. In order to produce smaller, lighter, faster, and lower cost end products, consideration must be given to the use of bare die. National Semiconductors broad portfolio of die products support applications that include telecommunications, portable computing, automotive, and avionics. As each of these application segments continues to create smaller, lighter, higher performance systems, the number of bare die in these new designs is increasing.