Kehrig Dr. Chesterfield, Mi. A patented method of rapidly economically applying copper conductors to thermoplastic. This allows a complete circuit configuration to be transferred within seconds. Industrial Advantages New design possibilities thanks to the use of injection molded plastic parts. In some cases separate PC boards and no longer necessary, because supporting plastic parts such as housings and consoles serve as carriers for conductors the same time.
Production is possible directly on the processor's premises.
Approximately level embossing is possible for sliding action contacts. Low cycle times, only one work operation, resulting in rapid availability of the required circuits. Possibility of attachments an automatic production unit to various items of production equipment for substrate materials, e.g. extruders, plastic injection machines, etc. Environmental Advantages No exhaust air or waste problems arise when PC boards are manufactured or when they are applied to functional substrates. The recovery of the copper foil is far simpler then with chemical processes.