The computerized system scans and measures the change in resistance at each sensing cell in order to determine the timing, force, and location of contacts on its surface. Tests can be recorded, stored, played back, and graphically analyzed to provide a pressure profile across the complete sensing surface. The system can be used in conjunction with single- or multispindle heads. Applications include balancing pressure distribution during CMP machine setup, aligning polishing heads, detecting and measuring polishing-pad wear, and performing QC on rebuilt carriers. Measurements are repeatable despite wafer bow or warp up to 2.5 mm.
Proprietary software facilitates data collection at a mouse click.
The x-y stage can be adjusted smoothly by the operator for the collection of readings from different wafer locations. The operator can save measurement data to an exportable table via foot pedal or mouse. The standard configuration for service with liquid oxygen, nitrogen, argon, or liquefied natural gas is a nonbellows design. The valve can be configured with a bellows seal for use with liquid hydrogen and helium. The valve's design reduces heat leak into the valve and maximizes service life.