I am looking for any information on electroplating platinum for microelectronic applications. The application requires a smooth deposit less than a micron thick. I toured Semitool a few years back when you guys were developing the waferplating platform. What a great outfit you run up there.
Platinum is electroplated from two different electrolytes.
Both are touchey and take a bit of experience to run routinely, as neither is inherently stable while operating. They are offered by Technic, Sel-Rex, etc. Nickel is the black bath's mortal enemy. Internal tensile stress in Platinum deposits can run extremely high, and in small devices, just a nick can cause a section of the deposit to spring-delaminate. But proper DOE can identify excellent operating parameters that will yield Pt that won't even orange-peel during 90 deg bend test.