Ground is provided to the circuitry through vias to the backside metallization.
The small size and inherent reliability advantages of a monolithic device over a hybrid design make this device attractive for use in a variety of military applications. Used in a balanced configuration, the TGA8014-SCC effectively addresses applications such as driver and power stages in EW amplifiers, local oscillator buffers, and TWT replacement amplifiers. Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as the thermocompression and thermosonic wire bonding processes. The TGA8014-SCC is supplied in chip form and is readily assembled using automated equipment. TriQuint Semiconductor, Inc.