This two-day course discusses vital issues such as the economics, design, materials, processes, equipment, quality, and reliability relating specifically to this growing industry. If you are involved with any aspect of the electronics industry, you should attend this course. The content is recommended for component, packaging, design, material, process, equipment, reliability, quality control, manufacturing, marketing, and sales engineers and managers.
Enrollment is limited and advance enrollment is required.
JOHN H. LAU, Ph.D., P.E., is an interconnection technology scientist at Agilent Technologies, San Jose. Previously, he was president of Express Packaging Systems and a senior individual contributor at Hewlett-Packard Laboratories.