Jennie Hwang contributes a section devoted to soldering technology with a small section on lead-free. The topic of lead-free will be covered in more detail when she releases her new book devoted to environmentally friendly assembly in a couple of months. Mr. Lau always acknowledges his wife and family in the foreword of his books. I have not had much practical experience with flip chip technology in the past. Recently, I have been involved with a couple of hands-on process projects.
Flip chip is an interesting technology, and there is much to learn.
Like Mr. Lau s previous textbooks, there is a lot to be learned from each of the chapters, particularly the alternative bumping techniques. I feel sure that anyone can easily justify the book s cost. The chapters cover each of the major steps in the process and, of course, the economics of the process, as compared to other well-known chip on board techniques. The text is detailed and very easy to read and understand for a beginner. The formulae in some of the sections are a little heavy, but each of the chapters is well illustrated, which makes the book very understandable and enjoyable.