Process and equipment decisions are critical for optimizating the clean steps. Also reviewed are such specifics as megasonics, dilute chemistries, effects on low k and copper, and new cleaning technologies. Cleaning trends with respect to migration to 300 mm wafers and linewidths of less than 0.18 m are discussed. The course is intended to help you understand the chemistry and physics as well as the theory and practice of cleaning at various process steps. With this knowledge you'll be able to choose an appropriate clean technology to use in the process development of integrated circuit manufacturing.
Enrollment is limited and advance enrollment is required.
This is intended as an introductory course.