Ground is provided to the circuitry through vias to the backside metallization.
This general power amplifier is suitable for a variety of wideband applications such as distribution networks, logging stages and oscillator buffers. Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as the thermocompression and thermosonic wirebonding processes. The TGA8334-SCC is supplied in chip form and is readily assembled using automated equipment. TriQuint Semiconductor, Inc.