Nova has gained in the Integrated Metrology environment during the past six years. The system measures in parallel to processing other wafers, therefore does not affect the Lithography cell throughput time. The Macro Defect Inspection is designed to detect defects down to 40 microns.
Inspection is enabled with a unique whole wafer inspection method.
The system detects particles, coat and develop related defects, and EBR faults. It improves the automation of the critical photolithography operation, contributes to the overall productivity of the fab, and improves yield and cycle time. We offer systems for oxide CMP, copper CMP, and CVD, and now introduce our first process control application for Photolithography. Integrated Metrology is penetrating very rapidly to the production environment, supplying wafer to wafer control solutions that do not exist today and are very much needed for the new process generations and for 300mm wafer processing. Wafers are stationary during measurement, thus not affected by vibrations.