Fail mode evaluation using optical and SEM techniques Description of Technique Shear testing of ball bonds on ICs and other electronic devices is performed on the KTC Bondtest-30. The test involves destructive lateral shearing of the ball bond and measuring the force required to shear the ball bond from the bond pad. In addition to tabular and statistical presentation of the test results, qualitative and photographic evaluation, including light microscope and SEM analysis of the bond shear, is available. Keller Technology Co. Tonawanda, NY Sample Information Plastic encapsulated samples intended for wire pull, as well as those that are chemically or mechanically decapsulated, should be prepared in such a way that exposing the lead frame stitch bonds is avoided. To enhance the validity of the test results, care should be taken not to chemically or mechanically attack or undermine the bonds to be evaluated.
Facilities are available to evaluate and open intact devices for wire bond and die shear testing.
For new or special packages, test samples must be provided for development of an appropriate decapsulating technique.