Fewer reductions due to low friction. Smaller, more uniform ball size on pad. Reduced bonding tool problems. 9002 Certified Elimination of imperfections with extreme pressure that envelops the metal as it passes through the die. Gold Product Solutions Gold Bonding Wire is available with a variety of engineered chemistries.
Gold wire is produced to meet the specifications of virtually all industry bonders and applications.
Long Length wire for today's miniaturized packages. Williams' extrusion process is well suited to achieve the metallurgical consistency and winding requirements of all bonding ribbon applications. Solder Wire Solutions Solder Wire is available in both flux core and fluxless varieties. The hydrostatic pressure used in Williams' process allows soft solders to be reduced to extremely small diameters. Applications include flip chip bumping and fuse assemblies.