These applications often work better with memory that exceeds the system's speed and reliability specifications. In general, manufacturers who do in-house design have more control over the quality of the module than those who farm this work out. The quality of the DRAM chips, PC boards, and other components used on the module are critical to the overall quality of the module. In addition to proper handling of components, solder quality affects how reliably information can travel from the chip to the module and back. The temperature and humidity in the assembly and storage areas must be regulated to prevent warping, expansion, and contraction of components during assembly.
ESD damage can result from excessive and inappropriate handling.
The more thoroughly memory has been tested before it is shipped, the less chance of problems during operation. In addition to standard production tests to ensure that the modules have been built correctly, memory can be tested for compatibility in the systems in which it will be used. Some companies perform testing at all levels, and some do less testing. This section contains information that helps make sense of the fluctuations that can occur in the memory market. These time and cost factors directly affect on the ability of the memory market to adjust quickly to fluctuations in supply and demand.