This process is for 3.3 volt applications. Only 3-metal designs can be submitted for these runs. The bonding pads on designs submitted to AMOS14TB runs should have a ring of minimum sized Via2s to connect to Metal2. If these guidelines are not followed, metal lifting problems can occur. There are no exceptions for pads, logos, or anything else.
Large openings are to be replaced by an array of standard sized openings.
HP AMOS14TB runs .