Test voids are happening with a few units and always fail a test at the next higher level of testing due to failed components . Connectivity failures occur in a few units, during use , and can not be found at test. Virtually all of our test equipment is geared towards finding hard failures only. Technical, engineering and support processes are devoted to hard failures only. Technicians who actually see and understand the problem are given no support or equipment to fix the problem.
Engineers design tests for new systems.
Not familiar with connector science or aging problems. Mistakenly believe that ATE sees all intermittent problems. Don't understand the problem randomness plays in testing for intermittents. Maybe the intermittent won't show up this week. No stress is applied.