Direct cascading without additional components is possible by using the on- chip blocking capacitors.
Ground is provided to the circuitry through vias to the backside metallization.
Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as the thermocompression and thermosonic wire bonding processes. The TGA8226-SCC is available in chip form and is readily assembled using automated equipment. TriQuint Semiconductor, Inc. Go back to top of page. TriQuint Semiconductor, Inc.