PC assembly companies have found Thermstrate TC to be an excellent choice for a very low cost high performance thermal interface product. Unlike thermal greases, there is no need to clean up after the application of the TC dry film. TC does not harden or bleed, and exhibits stable, long-term heat transfer properties after installation. Thermstrate TC is the same-patented phase change thermal compound used on our Thermstrate 2000 and Isostrate 2000 superior performance thermal interface pads. In the fluid state, these materials flow to displace air and fill voids with a superior performing thermally conductive compound.
Labor cost is dependent on the application process adopted by the user.
The TC applicator bars are designed in a size that has been highly successful as a low cost application for microprocessor heat sinks. Thermstrate phase change thermal compounds are now used in hundreds of millions of commercial, industrial, and military device installations with highly reliable long-term operation. Power Devices Inc. Thermal cycling test data confirms that Thermstrate 2000 is more stable than thermal greases. Industry experts have long known that silicon based thermal greases migrate away over time. There are non-silicone based thermal greases but they dry out over time.