Photonic devices based on III-V semiconductors and lithium niobate. Very high speed detectors and electronics. The center has design, prototyping, and low volume production capabilities for MEMS devices and systems.
Emphasis is on bulk micromachining although some surface micromachined projects have been completed.
Wafer diameters used are two, three, and four inch. 3.0 Fabrication Facilities 1. 4.0 Devices 1. Approximately 30 projects exist per year, with team sizes ranging from 1 to 5.