The attenuation step is 0.5-dB and is controlled by 10 input lines. The small size and reliability advantage of a monolithic attenuator over a hybrid design make this device attractive for use in electronic warfare, radar, telecommunication, and navigation systems for level set, modulation and switching functions. Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment method as well as the thermocompression and thermosonic wire bonding processes.
Ground is provided to the circuitry through vias to the backside metallization.
TriQuint Semiconductor, Inc.