We can tailor a solution to meet the varying needs of each of our customers, and standardized designs are also available for less demanding applications. IBM's vast portfolio of proprietary processes include innovations in assembly technology, thermal management, underfill materials, wafer finishing, substrate materials as well as many other areas. Assembly Services Our manufacturing engineers can deliver proven, affordable standardized solutions and routinely develop assembly processes for complex, leading edge electronic packaging. The IBM Microelectronics assembly facilities use the latest generation of chip placement, underfill and lid attach equipment, as well as automated balling and column attach processes. Extensive analytical lab capability and complete reliability testing on site Module rework process available for both BGA and CGA Component selection and procurement Priority Service IBM's standard manufacturing cycle times are among the best in the industry.
Flexible arrangements are available for special production requirements.
A variety of chip attach metallurgy is offered and underfill processes can accommodate IBM or customer-specified chip passivation. Our vast experience in flip-chip manufacturing allows us to adapt processes to your needs and material set. Technical Excellence Custom Design Engineering IBM Microelectronics engineering teams draw from experience and standards developed across the Corporation to create product designs that provide performance and reliability at an affordable cost. We can deliver a solution incorporating proprietary features to reduce package size, maximize thermal dissipation and extend reliability. Whether you want to integrate our flip- chip assembly services with your own design or take advantage of IBM Microelectronics' design and modeling capabilities, we can meet your needs.