Less silicon is removed to allow additional reclaim cycles.
This translates into greater value for the customer and increased reclaim vs new test wafers. Surface metal contamination is effectively removed and controlled to very low levels. The process is robust and can reclaim the most difficult multi-layered patterned wafers and still maintain minimal silicon removal. Through a combination of innovative chemistry and precision mechanical processing, there is a substantial reduction of toxic and hazardous chemicals supporting the industry's desire towards more environmental responsibility.