Packaging MEMS is a particularly sensitive problem, however, because of the mechanical components. Working parts must remain properly aligned, and the packaging must prevent contamination that would interfere with operation. In addition to MEMS packaging, HiDEC is also working on the development of new MEMS devices. This includes material development and application as well as MEMS design. As devices become smaller and more densely packed, the problems associated with heat build-up increase dramatically.
Heat can permanently damage or destroy devices.
HiDEC is working on active and passive methods to remove heat, including the use of diamond films. HiDEC has a long history of using polycrystalline diamond films for thermal management. Thin diamond wafers are created by depositing manufactured diamonds in many layers, each only 1.5 microns thick. Polycrystalline diamond does not have the smooth surface required for microelectronic devices. In refining these wafers, HiDEC has developed expertise in the post-deposition processing of diamonds by mechanical and chemical means.