The wide pressure range of the ES401 enables specimen to be etched in either isotropic or anisotropic modes. The anisotropic mode is most suitable for etching multi-layer wiring specimen because of its large aspect ratio. The stage temperature is controlled by a Peltier device and the pressure is controlled by an inverter, providing high repeatability and a stable etching rate.
Excellent uniformity is assured through the use of a porous gas nozzle.
The diameter of the stage on which specimens are placed is 230mm. The ES401 is capable of etching wafers up to 8 inches in diameter. The set value of the pressure and gas flow rate is inputted digitally. Up to 96 recipes can be stored in memory and each recipe can be loaded by pressing just one button. The ES401 has various funtions for an easy use including automatic matching and chamber open-close method.