Panda Abstract Clustered or hierarchical interconnections demonstrate advantage in designing large scale multiprocessor systems.
Large systems require several levels of packaging.
Packaging technologies impose various physical constraints on bisection bandwidth and channel width of a system. Pinout technologies and capacity of packaging modules have been ignored in earlier studies, often leading to configurations that are not design-feasible. Similarly, the impact of processor and interconnect technologies on demanded performance has also not been considered. In this paper, we propose a new supply-demand framework for multiprocessor system design by considering packaging, processor, and interconnect technologies in an integrated manner. The elegance of this framework lies in its parameterized representation of different technologies.