Billerica, MA This location houses administrative, finance and engineering functions. Although no positions are currently open, we are accepting resumes for future consideration.
Key deliverables are yield, cycletime, cost reduction, and package quality.
Responsible for material selection, qualification and introduction of new assembly processes into volume manufacturing. Minimum of 7 years experience in high volume semiconductor package engineering. Experience with offshore subcontract assembly houses. 2-3 Years experience in an engineering leadership position. BS Mechanical Engineering or BS Electrical Engineering.