Electroless plating became common around 1965, when plating on plastic objects achieved a significant development. Being advantageous in many respects such as uniform precipitation coating, hardness, abrasion resistance, chemical resistance and corrosion resistance, electroless plating became increasingly common especially in precision-machinery industries. The demand for electroless nickel plating later increased in such applications as automobiles, intelligent office equipment and optical equipment.
Electroless copper plating is essential in the production of printed circuit boards today.
All these plating solutions include organic substances as metal-ion complexing agents and stabilizers. High COD and difficult metal separation may be problematic in wastewater treatment and considerations should be implemented. The treated wastewater should be mixed with other wastewater at a carefully selected position. Complexing agents are essential to produce good plating. As the reducing agent, formalin is common.