To ensure reliability under harsh conditions, the diffused wafers are glass-passivated. To enhance solderability, the contact areas of the chips are metalized to provide large, active contact areas for excellent electrical and thermal conduction, low current density and high surge capability. Diamond or laser saws are then used to separate the wafer into chips. Package assembly takes place primarily in the Matamoros plant, which offers complete device assembly for standard and custom applications. One of the most widely used methods is a sophisticated transfer epoxy molding process.
Epoxy molding requires that all parameters be precisely controlled throughout the process.
The result is a mechanically rugged package with a high moisture resistance. Temperature surge and parametric testing, ink or laser marking, electrical and mechanical sampling for quality control and packing are performed on automated in-line equipment. High yields, short cycle times, high productivity and on-time delivery to customers are all attributable to the sophisticated parametric testers and handlers that have been designed to Teccor s specifications, based upon many years of experience. Teccor s in-line process minimizes manufacturing steps through automation by testing, marking and packing devices in one continuous operation, reducing cost, cycle time, handling and defects. Innovation and attention to customers requirements have been the foundations for Teccor s success.