Interconnect technology is easier because of COB flexibility. COB could enable the designer to reduce the number of layers while providing more space for components. This design feature enables a very high thermal density per cubic inch. It is important to remember that packaging custom ASIC die is expensive. COB lends itself well to high volume low cost production.
Full production can begin within several weeks after approving the prototypes.
How much does it cost each time you or your engineering staff has to fly off to the far east for a meeting when a short cross town drive is all you need when face to face communication is required. If your goal is to reduce footprint and product cost as well as improve performance and accelerate the volume production curve, then COB is your answer.