This initial offering is the latest example of Intersil innovation contributing to next generation communications networks. Intersil has engineered the devices to increase battery life and to more efficiently use power by reducing the amount of power lost during switching. Efficient use of power is vital to the operation of new, high-current microprocessors in desktop and portable applications. The UltraFET Trench devices utilize Intersil s DenseTrench technology, so that only a minimal amount of the surface area of the printed circuit board is used. UltraFET Trench devices utilize trench technology that differs from the planar technology traditionally used in Intersil s standard UltraFET products.
Lower resistance equates to better system and device efficiency.
In portable applications, this manifests itself in longer battery life. In desktop PCs and network servers, power efficiency is increased. Intersil designs and produces semiconductors tailored for high efficiency, high reliability integrated communications applications. When combined with the company s power integrated circuits, Intersil s power product portfolio provides unique power management solutions for next generation portable and desktop PCs, network servers supporting the Internet and information appliances. UltraFET Trench offerings, the ISL9N310AD3ST, ISL9N310AS3ST and ISL9N310AP3, are currently available in Dpak, D2pak and TO220 packages respectively.