In addition, the engine vibrations, road conditions and bumps provide significant mechanical loading conditions. Our approach is to develop composite solders with compatible intermetallic reinforcements produced in-situ. These particulate reinforcements stabilize the solder microstructure during service. Our mechanical tests are carried out with solder joints which are comparable in size to those present in circuit board applications.
Composite solders provide bettre creep resistance without sacrificing ductility.
Microstructural characterization, and microstructural engineering to obtain optimal service performance, are the main goal of our studies. We have three graduate students working in this project since Fall 95. We evaluate microstructural evolution during these deformation processes.