All reworks are fully documented and 100inspected to the applicable criteria. Active components such as transistor, diode and integrated circuit die are handled on the perimeter of the chip without contacting the active surface. Crossover bonds are normally made with 0.7 mil wire on center trace with the wedge on the outer trace. Insufficient loop height of the crossover bond wires that causes shorts are rejected. The applicable assembly drawings are used for orientation of the substrates.
Good wetting is very important to form a fillet around the components.
Preform material visible around four sides is preferred. Hari's Visual Inspection Procedure. Orientation of components are in accordance with the applicable assembly drawing. Component Mounting With Epoxy Components mounting are also accomplished using conductive epoxy and non-conductive epoxy. Epoxy material not visible around two sides of the component is cause for rejection.