Bond-pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as with thermocompression and thermosonic wire bonding processes. The TGA9083-EEU is supplied in chip form and is readily assembled using automated equipment.
Ground is provided to the circuitry through vias to the backside metallization.
Typical performance parameters are compiled during DC and RF probe as well as fixtured testing. TriQuint Semiconductor, Inc.