The company has received several awards from key clients. A new MEP report documents seven transformed firms, including Dynagear, describing the firm and its problems, the changes that were made, and the results in performance. This report is the latest in a series of case studies on MEP's client companies. The NIST MEP is a nationwide network of manufacturing extension centers helping smaller manufacturers in all 50 states, the District of Columbia and Puerto Rico. This means attaching silicon chips to printed wiring boards with solderballs.
Increased speed is achieved by decreasing the distance between the chip and the substrate.
This technology works well at temperatures from 20 degrees to 120 degrees Celsius but fails at an unacceptable rate when temperatures are reduced to minus 55 degrees Celsius. As temperatures changed, images of the moire fringe patterns were acquired and compared. The package was subjected to 10 complete thermal cycles from minus 55 degrees Celsius to 125 degrees Celsius over several days. Drexler found, after only one complete thermal cycle, that debonding initiated between the solderball and the solder mask where that interface meets the printed circuit board. This debonding continued to grow through the solder mask and into the underfill, then arrested after going one-quarter of the way around the solderball.