To this end O-ring devices can be assembled and sealed at room temperature. Electrolyte filling and sealing are carried out in one process step. This is very effective during filling when the high evaporation rate of several electrolytes is taken into account. Problems of air inclusion are mastered by submerging the device during filling. Efficiency demands high power modules to be optimally sized due to the relatively high sheet resistance of the glass electrode.
External interconnections imply an extension of the active module surface area.
In addition, electrical resistance increases due to external wiring and contacting. As a consequence, internal interconnection may be a promising option for the high power application. On the basis of describing the design of a nc-DSC module internal interconnection is explained. A module consists of separately sealed, electrically interrupted cells. The separated cells can be connected in series by means of an internal interconnection which is located inside the module and between the separated cells.