The beams are displaced into contact by a first TiNi actuator, and out of contact by a second TiNi actuator. Sacrificial layers of aluminum are used to release structures from the substrate. TiNi SMA film is sputter-deposited. Nickel beams are electroplated. Patterning uses photoresists, including SU-8.
Electrical connection is by evaporated gold.
The latching microrelay is suited for use wherever current of up to one ampere is to be controlled and where small size is necessary. Power is consumed only during change of state. Relays can be made in a variety of sizes to meet differing requirements. Linear arrays may be placed with individual devices as close as 100 microns, and two dimensional arrays with up to one thousand components in one square centimeter. Thus TiNi MicroRelays may be used for applications as diverse as protection of individual IC components and cross-bar switching networks.