Only 4-metal designs can be submitted for these runs. The process does not have the silicide block or linear capacitor options. The bonding pads on designs submitted to GMOS10QA runs must not have metal3, metal2, metal1, contact, via, via2, or via3 under the glass cut, i.e. they should be close to the edge. If these guidelines are not followed, metal lifting problems can occur. There are no exceptions for pads, logos, or anything else.
Large openings are to be replaced by an array of standard sized openings.