At a Glance This article presents an overview of the packaging design of MEMS and microsystems such as micro sensors, actuators and fluidics. Technical problems and major issues related to packaging design also are discussed. The advance of micro engineering technology in the last two decades has been impressive in both its pace and the diversity of new applications. Excessive stresses and deformation of these components induced by the operating loads can seriously affect performance. Proper mechanical design and electromechanical packaging of these products will not only ensure the expected performance of the products, but also make them reliable and competitive.
Electromechanical packaging is a critical factor in commercializing microsystems.
Often, the size of a micromachined sensor is dwarfed by the size of its final package. A sensing or actuating element of a few microns can end up in a package with an overall size in centimeters. Consequently, most of the benefits of miniaturization are diminished because of inadequate packaging. The high cost and the undesirable bulky packages have been major stumbling blocks in capitalizing the market potential of micro engineering products. The lack of electromechanical packaging standards and design methodology is the principal reason for the inadequate packaging of microsystems.