Since the residue-free adhesive seals around each BGA pad, the operator can make as many passes as necessary with the squeegee to assure proper aperture filling. The Flextac Stencil is then peeled up leaving a perfect deposit of solder on each pad. Although Flextac Stencils are disposable, they can be used several times. Application Applying solder paste for BGA rework. Features and Benefits Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed.
Laser cut ensures precise aperture size.
Disposable - eliminates tedious stencil cleaning. Flexible - conforms to board surface. Fold-up sides for easy placement and solder paste containment. Includes Part No. Information Flextac BGA Rework Stencil Kit is packaged in a rugged ESD safe case.