The primary function of this facility is the development of novel superconducting, optical and other devices. Materials can be grown and patterned by standard lithographic techniques.
Equipment is available to do wet and dry etching as well as wire bonding.
Devices can then be characterized by their electrical properties at both ambient and low temperatures. Nearly all stages of device development and testing are performed in-house. As a result, this allows a great deal of design flexibility, as well as control over design parameters. In addition, a self-contained facility ensures that a device will be processed from its conception stage through testing as quickly as possible. Equipment Lithography and Etching Equipment 1.