Our air cooler concept has evolved in the WSL-375 system to include new features. Cooling is done in two sections as the panels are transported to the post-clean system. First the air bed supports and cools as the wide panels exit the air knife. Then a deflector positions the panel for entry to our roller section. The rollers advance the panel to a centering position that hesitates, centers, and expels the panel to the post-cleaner.
Every panel is preheated and automatically rotated for optimum angle prior to fluxing.
Air knives respond to the position commands of the MMI via stepper motors. Offset and Gap are controlled by a WSL module subscreen allowing precise repeatable positioning and air pressure selection. Usage based on batch style attached solder maintenance device With process cost a consideration, the WSL-375 System is frugal with flux, oil, and solder. Some tolerance in these numbers should be expected based on board types and individual process variations. Therefore the consumption data provided is a guide to what may be achieved and expected based on typical mixed technology printed wiring board panels.