In an effort to expand our product offering, Epoxy Technology has developed several materials for b-stage, film, and preform applications. Our customers have been requiring b-stage adhesives for several years. Some of these customers have expressed the convenience of not having to handle the epoxy paste altogether. We have responded to their feedback by essentially taking our proven b-stage materials which can be integrated into film products.
Epoxy films offer several advantages of conventional paste adhesives.
A simple pick and place process is used to bond components. Simply place the preform onto the preheated substrate, pick and place the die, and cure with pressure in one continuous process. Conductive Rigid General Purpose EE149-5 Elect. Purpose EE149-6 Elect. Conductive Semi-rigid Mil.