Passive devices can be embedded in or mounted onto the substrate. The assembly of a SiP requires additional processes and component logistics over the assembly of standard IC packages. One missing part precludes the assembly of the entire package. By its nature, a SiP is a custom, application-driven device. Unlike traditional IC packaging, where the IC producer is typically the customer of the package assembler, OEMs are usually the assembler's assembler's SiP customer.
Cellular telephones are one application for SiPs.
Both Nokia and Ericsson have used SiPs in their phones. SiP design and assembly is offered by a number of companies, as described below. Alpine Microsystems designs, manufacturers, and markets SiP products based on its patented Microboard substrate and DirectAttach packaging. Additionally, the company offers extensive capabilities in handling GaAs, SOI, SOS,, and other RF and high-speed wafer technologies. The substrate used in the SiP can be either laminate or ceramic.