Epoxy Adhesive Description Dexter Hysol 1C is a general purpose adhesive and sealant that bonds, seals, and repairs a wide variety of materials including metals, most plastics, and wood. Bonding surfaces should be clean and dry. For optimum surface preparation consult Dexter's Bulletin Preparing the Surface for Adhesive Bonding . Once the adhesive is applied, the bonded parts should be held in contact until the part has developed handling strength. It is not necessary to clamp the parts unless movement during cure is likely.
Complete cure is obtained after three days at room temperature.
Many common solvents and citrus cleaners are suitable for removing uncured adhesive. Tested on etched aluminum per ASTM D 1002. Cure Test Temp. The information supplied in this document is for guidance only and should not be construed as a warranty. All implied warranties are expressly disclaimed.