CAE Ultrasonics has overcome these limitations and has made ultrasonic soldering the practical choice for many applications. Benefits and Applications CAE Ultrasonics' ultrasonic solder pots have consistently provided superior results in fluxless lead tinning. Ultrasonic soldering provides many benefits to end users and manufacturers who demand high reliability electronic connections. Ultrasonic soldering has been used in critical applications in laboratories and production lines all over the world. All pots are activated by external transducers which allows large volume multi-part dipping.
Controls are adaptable to automated lines.
CAE Ultrasonics has many years of experience in ultrasonic soldering, dating from the early design and production of some of the first practical equipment for this purpose in the early 1960's. Our experience assures quality and competence in this field. There are some applications that are unsuitable for ultrasonic soldering. For instance, the tinning of unplated strand wire cannot be handled well with ultrasonic soldering because wicking is necessary to thoroughly penetrate the strands with solder. Construction Ultrasonic Transducers CAE Ultrasonics' unique composite piezoelectric transducers are permanently mounted to the outside of the solder pot in such a way that the entire solder volume is ultrasonically activated.