Results of this workshop are expected to be used in development of SEMI Wafer Specification Standards. Speakers were invited from several IC makers and Wafer suppliers. The Annealed Wafer Task Force held its first meeting during the recent Winter meetings. Guide to the Use of Edge Exclusion in Metrology, since it failed technical review at the previous meeting. Chemical Mechanical Polishing Subcommittee and Thin Bonded Wafer Task Force are currently in need of leaders.
All interested members are welcome to attend.