Small socket outline to maximizes burn-in board density and process throughput. Low actuation force. Changeable adapters stage to allow a variety of package sizes. Design Features Mechanical contacts touch each solder ball individually and independently. Contact protrusions pierce oxide on solder ball and give reliable contact.
Contacts touch the upper side of the solder balls to minimize ball damage.
Once the IC package is properly seated in the socket, latches clamp the IC package in position to prevent movement caused by vibration. Since TI's sockets utilize existing test equipment and standard processing, such as burn-in boards and ovens, market adoption should be strong. Texas Instruments Incorporated is a global semiconductor company and the world's leading designer and supplier of digital signal processing and analog technologies, the engines driving the digitization of electronics. Headquartered in Dallas, Texas, the company's businesses also include materials and controls, educational and productivity solutions, and digital imaging. The company has manufacturing or sales operations in more than 25 countries.