The document that will be produced will recommend ways of interconnecting system components. The purpose of the activity is to make the power electronics modules interchangeable and interoperable. In doing so the ability to provide the users a wider availability of manufacturers products without a major redesign of the system components such as cold plate, heat exchanger, buss-bars, intelligent interface. Each manufacturer may achieve a proliferation of sales volume. The intent is to recommend the interfaces for modules not to invent a technology.
Any activity needs to be technology neutral.
It is not the intent of to help any particular semiconductor business. Whether small or large the activity needs to be business neutral. It is also not the intention of the activity to dilute that specification so that any one can build the module. It must be remembered that the intent is to develop an enabler not a solution. The standard specification may recommend that if a coolant system is used it must retain a specific cleanliness specification such as maximum contaminant particle size as well as how many parts per million is acceptable.