Combining P lated C opper Metalization with T hick F ilms for Custom Metalized Ceramic Substrates, Chip Carriers and Packages . PCTF Technology is based on plating copper on to Thick Films on a ceramic substrate, in single or multiple up image arrays.
Copper is plated to the required thickness and configuration.
Detailed Design Guidelines and a graphical representation of the design rules and recommendations may be obtained by requesting them on the Additional Information Request Form .