Microchannel heatsinks represent the most compact and efficient method of transferring heat from a power source to a fluid. In most fluid-cooled systems, the dominant thermal resistance is in the fluid. This is due to low thermal conductivity of fluids relative to the crystalline solids that are commonly used to conduct heat away from its source. These microchannel heatsinks may be used to cool solid-state radar systems and mainframe and supercomputers. Materials and coolants We have fabricated and tested microchannel heatsinks for almost a decade and have extensive experience with the processing and bonding technologies involved.
Coolants used include water, air, ethylene glycol, and liquid nitrogen.
Though more difficult to fabricate in small quantities, metal microchannel heatsinks show similarly spectacular performance with these coolants. Air cooling is preferable for certain applications, although its properties as a coolant are far inferior to most liquids. Our technology for fabricating microchannel heatsinks is available now for commercialization. The Industrial Partnerships and Commercialization Office at Lawrence Livermore National Laboratory invites industries to explore the possibility of a match between their technological needs and our Laboratory's multidisciplinary capabilities. Our specialists know how to connect industry representatives with researchers in their field of interest.