Rambus memory components are widely supported by the semiconductor industry. Endorsed by Intel and leading OEMs, Rambus memory devices are expected to attain over 30 and 50 percent of the DRAM market share in 2000 and 2001, respectively. Reliable pinching action contact minimizes solder ball damage. Small socket outline to maximizes burn-in board density and process throughput. Low actuation force.
Changeable adapters stage to allow a variety of package sizes.
Design Features Mechanical contacts touch each solder ball individually and independently. Contact protrusions pierce oxide on solder ball and give reliable contact. Contacts touch the upper side of the solder balls to minimize ball damage. Once the IC package is properly seated in the socket, latches clamp the IC package in position to prevent movement caused by vibration. Since TI's sockets utilize existing test equipment and standard processing, such as burn-in boards and ovens, market adoption should be strong.