Following on wafer tests several wafers were diced and the chips mounted in suitable packaging for system tests. Below are images of the packaged device and complete digitiser subsystem. All package manufacture, assembly, wire bonding etc was performed within the ATNF and its workshops.
Digitiser die bonded into package.
Complete digitiser subsystem showing packaged device mounted in a cutout in the PCB to the left. The spectrum below was taken with the complete digitiser connected to the ATNF's wideband correlator. The ATNF WB correlator has a maximum bandwidth capability of 2 GHz. Spectrum of a 950-1800 MHz BPF taken with the ATNF InP Digitiser and WB Correlator. The ATNF now has a 2 GHz digital spectrometer capability which is unavailable in any other astronomical facility.