Cu-11 makes it possible to combine previously dispersed elements like processors, DRAM, SRAM, analog functions, and multivoltage interfaces onto a single device with improved performance, power, cost effectiveness, and time to market. The high level of integration required for ASICs of this complexity is made possible by the raw performance and power efficiency of the underlying transistor and interconnect technologies. IBM's proven high-density design methodology and tool set have been further enhanced to meet the challenge of the increased integration. This unique combination of capabilities makes our Blue Logic Cu-11 a powerful solution for any ASIC application. After nearly 15 years of research, IBM scientists announced in September 1997 a new advance in semiconductor process that entails replacing aluminum with copper.
Copper has less resistance than aluminum and, therefore, transmits electrical signals faster.
However, it doesn't mix as well with silicon, the base material of semiconductor chips. IBM researchers found a way to put a microscopic barrier between the copper and silicon so that the number of steps needed to complete a chip was actually reduced. A second set of higher-voltage transistors is also available. By applying these transistors in tandem, Cu-11 circuit families can be defined to provide optimal performance for any function. As ASIC technologies continue to scale, the performance impacts due to high-RC circuit interconnects continue to increasingly dominate path delays.