For pincounts less than forty-four pins all contacts are located around the periphery of the package. With a standard pad pitch of 0.5mm, the package size increases in 0.5mm increments. For functions with greater than fourteen pins a quad configuration is used. To improve solder joint reliability, a pad pitch of 1.0mm is used for these larger devices. The exposed die attach pad can be soldered to the board to provide superior thermal performance, enhanced solder joint reliability and improved package self-alignment during reflow.
All pins are eutectic solder for simpler printed circuit board placement.
These pins, or contacts, are flush with the bottom of the LLP so coplanarity is never an issue. Describing the micro SMD Micro SMD is a chip scale package. The package is applied at the wafer-level before individual chips are separated. IC functionally is tested only once. With the smallest footprint currently available, the 4-bump micro SMD has a total surface area of roughly 0.8mm 2 .