The research in my group bridges the technology and design issues of high speed integrated systems. The various projects concentrate on the development of technologies which overcome the performance limiting factors in devices, interconnections and packages.
Current emphasis is on advanced materials and performance estimation of interconnections.
See recent publications for more details. The switching speed of today's devices is limited not only by the carrier transit time, but more importantly, also by the parasitic capacitors and resistors. In this project, we develop and model novel transistor structures for high speed applications such as RF communication. The integration of power devices with digital and analog electronics promises to revolutionize the power control industry and other related applications. The commonly used aluminum alloy is not expected to meet the future requirements.