Tools and materials will be added to the e-catalog over the next six months, according to the company. After registering, customers will receive access to a password-protected portal that is customized to meet their specific business needs. In addition, portal users can submit technical support questions, review catalogs and bulletins specific to their needs and hyperlink to any web site on the Internet. Each of our customers is going to have different requirements, so we are making this a very flexible tool for them. Regional Customer Service Centers will support order management, distribution and technical support around the globe.
Any customer can register to use the site, after obtaining a user identification and password.
Chip and wire solutions combine wafer dicing, die bonding and wire bonding equipment with saw blades, die collets, wire and capillaries. Flip chip solutions include wafer bumping technology, die placement equipment and Ultravia TM high density substrates. Chip scale and wafer level packaging solutions include solder sphere attachment systems and Ultra CSP TM technology. Test interconnect solutions include standard and vertical probe cards, ATE interface assemblies and ATE boards for wafer testing, and test sockets and contactors for all types of packages. The company also markets factory management and shop floor control software.