Initial color value. Our line of wafer prep equipment and accessories is just another example of our commitment to providing the most complete and comprehensive dicing solutions in the industry. Constructed of hardened magnetic stainless steel with an electro-polished finish, special models are available upon request.
Cassettes are also available in styles and sizes to accommodate all film frames.
These versatile systems accept film frames from all manufacturers and include a manual tape feed and tensioner. Tape Cutter Model 950 UV Tape Curing System Increase yields by optimizing tape adhesion with the Model 950 Curing System. UV curable tape exhibits stronger bond strength to facilitate dicing and eliminate flying die. After curing, adhesive strength is significantly reduced for faster die removal. The MicroWash Wafer Cleaning Stations are ideal for submicron cleaning of photomasks, wafers and a variety of diced materials.