The need for quicker, more efficient ways to dispense adhesives, sealants, and brazing or solder pastes has over the years led assemblers to abandon sticks and brushes in favor of more advanced dispensing equipment. Whether the dispenser is as simple as a handheld manual gun, a computer-controlled automated system or something in between, the speed and quality of the dispensing process is affected by the parameters of both the material and the system itself. Optimum performance is obtained by matching the application and material to the correct equipment. Adhesive Curing Choosing the correct curing system for adhesive bonding starts with knowing the basics. Joining materials with adhesives can offer an assembler significant benefits that can t be found with mechanical joining methods.
Adhesives distribute load more evenly, making a joint more resistant to stress.
Adhesives seal as well as bond, which eliminates the corrosion that can occur in a mechanically fastened joint. Adhesives more easily join irregularly shaped surfaces. And adhesives add no appreciable change in part weight or geometry. The possible drawbacks of using adhesives include the time it takes for strength to be achieved, the need for surface preparation and the potential need for future disassembly.