At CDIL quality and reliability are built into the product by rigourous control of all operations encompassing design through customer application support. A list of critical QA gates is given in Table II . Special testing and reliability screening schedules are run on specific customer requests. CDIL has been a leading supplier to India's defence and space programmes . Top of page Brief Description of Various Reliability Tests Done on Discrete Devices.
Device is alternately heated and cooled.
The die bond and wire bond are stressed by thermal fatigue. A pressurised vessel is used to force moisture through the packaging medium revealing deficiencies in passivation and possibility of corrosion. Excellent test for die-package compatibility. Checks for mechanical integrity of packaged device-bond wires, die attach and passivation cracks. Die bond , wire bond and lead integrity is evaluated.