A wide array of vendors is attempting to crack the recipe required to integrate optical components with all of the associated electronic drivers and circuitry onto a single substrate. The third technology evolution in progress is fabrication. Assembly of optical technology-based products is one of the most difficult challenges facing suppliers and OEMs. A major opportunity to advance the industry lies in the ability to reduce the complexity of those optical connections through higher levels of component integration and through reduced fiber attachments. In addition, most optical products today require hand-assembly operations, but as is well known in the semiconductor industry, automated fabrication and assembly operations are key to driving down costs while dramatically improving consistency and reliability.
Automated operations are also fundamental to the ability to achieve high volumes.
The rapid pace of technological innovation, ever shorter product life cycles and the increasing complexity of network and communication components are leading customers to demand combined optoelectronics and integrated-circuit solutions. Hence, systems designers and OEMs working on the cutting edge of the optoelectronics-based communication systems market need to be looking for multitalented partners with expertise in four separate areas. Not only will new devices like next-generation DWDM push the performance of optical transmissions, but tighter integration with electronics also will push heat, power, size and cost constraints. All rights reserved.