As a result, Intel can build a single chip that includes an XScale processor core, flash memory and a MicroSignal Architecture DSP core. A DSP serves to refine signals, such as a voice, coming into a cell phone. What we've done is taken what was previously a minimum of three chips, and possibly as many as five, and brought it all into one chip. However, it's likely that device makers will start with chips with a lower clock speed. At the same time, Intel said the chip will consume less power by eliminating the buses, or data pipelines, that connect the three chips.
Buses burn a relatively large amount of power.
TI recently began sending samples of its first OMAP chip to manufacturers. TI's emphasis, as shown in a recent speech by executive office, Tom Engibous, is on ensuring that the connection between a phone or handheld and a network is strong. Intel, for its part, may be more focused on processing power than on communications. However, it plans to begin shipping its first chips based on the three-way technology in the first half of 2002. Because of the onboard memory, Intel predicts its new integrated chip will double the performance of its current, separate chips for handhelds and cell phones.