Wafer Level Packaging For CSPs Compression molding allows packaging to be performed at the wafer level. Calif. At A Glance . . .
Compression molding is used to apply and cure an encapsulant on a bumped wafer.
After dicing and ball transcription, the devices are complete. I C packaging has changed rapidly in the past two years, driven by design requirements for portable computing and mobile communications equipment. In 1997, CSPs gained momentum by their rapid adoption in the flash memory market. Now, the CSP is poised to become a key semiconductor package type for consumer products. To be competitive, the pricing structure of a CSP should be in parity with the conventional package it replaces and use existing assembly infrastructures when possible.