Copper has exceptional conductivity for wire and wafers, which enables faster processing speeds.
It also supports wafer line widths narrower than 0.15 microns, for higher density packaging. Until recently, the assembly of copper wafers into packages presented manufacturing challenges. Our processes are thoroughly tested on a variety of wafers, including electro-deposited copper and vapor deposited copper. This new blade ensures a clean cut, eliminates loading, and has already helped our customers achieve excellent results in dicing copper wafers.