Table automatically traverses to die pick up tray and bond location. Manually positioned die tray holder with single waffle pack capacity. Motorized X, Y and Theta movement for workstage with three inches of X and Y travel from the central point for a total of six inches of travel in each direction. Electronic joystick control. Heated flat faced vacuum pick-up tool with closed loop temperature control to 250 C. Cover gas over heated stage with panel mounted flow control.
Computer controls all temperature, pressure and cycle parameters.
User interface is by keyboard or track ball. Simple menus guide the user. Macros can be created by the user to develop various cycles. Fourteen inch SVGA monitor displays computer menus and the digitized video image. Modular frame with vibration isolation.