The SCC-200 from Automation Technology achieves fully automated singulation, cleaning, and cassetting of wire sawn wafers. Ingots are easily and directly transferred from wire saw to the SCC-200 which accepts the wire saw tooling. Using consistent and reliable techniques, all the wafers are simultaneously separated from the beam and then destacked with our patent-pending destacking process.
All wafers undergo a standard high pressure water cleaning to remove slurry residue.
Optional cleaning methods include heated cleaning, megasonic cleaning, and use of surfactant additives. Once cleaned, the wafers are transported on a cushion of DI water to process cassettes. Up to sixteen process cassettes are mounted on the cassette turret providing a storage capacity of up to 400 wafers. When each of the eight dual cassette elevators is full of wafers, the turret rotates allowing for cassette retrieval and removal. Options include automated cassette removal and integration with existing conveyor systems.