No other foundry currently offers an equivalent capability for any process geometry.
Customers can save both time and production costs with the new capability.
The resulting AMI cell is usually smaller than a similar device produced with fusible link technology, so die size can also be reduced. Expensive laser trim equipment is not needed with AMI's unique trimming implementation. The same component can be trimmed repeatedly during probe testing, package testing and during system calibration. Stresses introduced during packaging, which might produce shifts in trimmed and calibrated circuits, can be easily adjusted. The embedded EE logic retains the capacity to be reprogrammed as needed.