Nitro Carrier TM technology utilizes a special size molding feature that enables components being packaged to be precisely located in the carrier pocket. This pin-point accuracy allows more precise pick and place attributes for circuit board manufacturing. Nitro Carrier TM is also capable of very deep draws without sacrificing strength. Strength features in our Nitro-Carrier TM have been accomplished using existing styrene carrier materials which do not cause cut off knife problems on board machines.
Chip leads hitting sidewalls of carrier pockets causing vision system to give false readings.
Light reflections from carrier tape surface causing inspection image to be misread. Tek Pak Nitro Carrier tape eliminates both of these inspection problems. Our geodesic grid works, on the sides and bottom of the pocket, effectively deflect reflections that produce false inspection readings. The geodesic formation creates a stronger carrier pocket. In addition, the rougher seal surface provides superior adhesion for cover tape.