The new socket, designed for general surface mount applications, incorporates Aries' patented BallLock contact pin technology in a standard socket. Solder balls lock into a two-fingered contact, eliminating the need for a lid. The lower half of the pin is a solder ball, and can be attached to the BGA footprint using normal paste screening. Maximum withdrawal force is approximately 20 grams per contact in all cases.
Delivery is three weeks for prototypes, six weeks for production quantities.