This profile evolved with infrared dominant reflow soldering equipment. The reflow soldering profile was driven by equipment capability. The situation changed when convection dominant reflow soldering equipment was introduced. Now it is possible to create and achieve the desired reflow soldering profile. The pre-heat phase should be viewed as the preparatory phase.
All actions leading up to proper soldering happen during pre-heat.
During this phase solvent evaporation commences, flux activation flux occurs and the substrate and components are gradually heated. During the solder joint formation phase substrate, components and solder particles reach soldering temperature, and, as a result, solder joints are formed. The cool down phase helps control dwell time and it cools the substrate back down to room temperature. The format includes a review of related terms, with examples and ideas for future development and study. Each attendee will receive a complete set of all materials used in the lecture, including a list of oven and profiling equipment suppliers.