The encapsulating layer on CEA-Series gages presents a natural solder stop. By placing a minimum amount of solder in only the bottom one-third of the solder tab area, cyclic life may be markedly improved. Such solder control may be achieved by masking the solder location with a piece of drafting tape in the lower one-third tab area. This should be followed by the application of a second piece of drafting tape below the first piece, making a gap about the diameter of the solder wire. This exposes a sufficient area of the copper-coated tab for tinning and lead attachment.
Available solders have a variety of characteristics.
While melt temperatures are most familiar, solders also vary in their stiffness, shrinkage and their resistance to cyclic loads. The higher the melt temperature, the greater the solder's stiffness and shrinkage. Eutectic solders, regardless of composition, provide for the best cyclic endurance for that composition. The solder requires some practice to apply as its wetting and flow characteristics are poor. Regardless of the solder chosen, only a minimum amount of solder should be applied to tin the exposed tab area between the pieces of drafting tape.