Micro-Machining, PCB, Embossing, etc. User-friendly software control of the process sequence provides error free developing and fixing of your substrates. Automatic chemical handling maintains the correct ratio of chemical concentrate to water required for processing. An integrated pH sensor monitors the developer mixture. In order to ensure uniform development of the entire plate area, puddle type developing and fixing with agitation are implemented.
Chemistry is temperature controlled to assure high repeatability.
Unlimited process recipe programming at PC interface enables the user to fine tune process parameters. There is a constant flow of liquid over the plate during each process step, resulting in tighter process control and cleaner plates. Wet chemistry modules are equipped with an inline filtration system, and a nitrogen environment can be implemented to prevent aging of the developing solution. The ELHlP also comes with a drying chamber to achieve final drying of the substrate. The Computer interface is shown in the picture below .