Other topics cover how to form, attach and solder wires. For multistrand wires, stripping and prepping is presented. Also mechanical assembly for heat sinks is covered. Additional information details solder shapes, fillets and flux residues. The specs for adding jumper wires to terminals or components is covered in this module.
Additional information is on adhesive tacking and other hold-down methods.
The conditions of a board are important. Details here cover the terms, defects, handling and coating applied to the board. Process Control, Inspection and Health Process controls are essential as well as audit, inspection points and recording of defects.