All of these solutions yield films of approximately 1000 Angstroms thick when applied at 3000 rpm spin speed. Thinner films may be obtained by diluting the solution with ethyl alcohol or by increasing the spin speed. Application Titaniumsilicafilm will wet all glass substrates as well as silicon. However, best results will be obtained on silicon wafers when the surface of the wafer is hydrophilic. After spinning, the substrate should be baked at 200 o C for 15 minutes, followed by a 400 o C bake for 15 minutes.
Air is a suitable ambient.