Due to the high temperature exposure of particularly small or thin ceramic substrates can warp during the HT refractory metallization processing. We offer a special processing with a special low temperature paste to overcome such a problem. The bonding systems are either ceramic or glass frit. IJ Research shall make a special system for your specific needs if the metallization paste is not commercially available. One example is the Al 2 O 3 to a matching metal alloy component.
Applications are semiconductor substrates, heaters, insulation on metallic parts, etc.
IJ Research, Inc. provides a black coating on various metal window caps.