This unique packaging approach provides the ultimate in size reduction by eliminating a component from the board. The Easy BGA package is the package of choice for these types of applications. The Easy BGA package has a relaxed 1.0-mm ball pitch that allows for easy PCB routing using conventional PCB technology. In addition, the large 0.45-mm ball diameter size and rigid BT laminate substrate package design allows for excellent solder joint reliability over a wide temperature range. While offering a larger ball pitch as compared to other CSPs, the Easy BGA package maintains the size benefits, measuring about one-half the size of its TSOP equivalent package.
Different markets require different packages.
Intel provides a full range of CSPs to best fit your specific application requirement.