The board aspect ratio is limited only by the board manufacturer, not the solder assembly. Benefits of Press-Fit in Board Assembly 1. There is no delamination due to soldering temperatures or improper baking. There is no warping due to stress relief of the inner layers. There is no measeling of the board due to soldering temperatures.
Contacts are gang inserted, reducing assembly time.
No solder joints, so long-term reliability of the assembly is not negatively impacted by the thermal cycle. With aspect ratios on the boards at 10 to 20 and total copper weights exceeding 30 ounces per square foot, it is almost impossible to solder these panels. The solder will not flow reliably up the holes before it freezes off, causing inadequate solder joints. This is the cost of a backplane assembly once it has left the production area. The press-fit contacts are individually replaceable.