The major semiconductor device mounting technology onto the substrate surface is recently starting to move to the bare chip mounting process especially to the flip chip mounting. BB- 300 is developed for this application.
Compact system needs only small limited space in the cleanroom.
Gold balls vibrated and dispersedly floated in the hopper are vacuum sucked by the gold ball suck pattern plate. After lapsing the sucking time which set on the timer, the ball suck head goes up to its home position. Verification of balls presence in all holes on can be done visually by the vision camera from underneath of the suck pattern plate on the monitor. After verifying presence of the balls in all holes, the semiconductor device on the heat stage moves to underneath of the suck pattern plate. Both the semiconductor device on the heat stage and ball position on the suck pattern plate must be aligned using micrometer heads for X,Y and axis adjustment on the heat stage.