Typical Products CeramTec North America produces lids and substrates typically used as heat sinks and electronic packaging as well as chip carrier packages themselves. Our substrates are employed in such components as photoelectric and thermoelectric sensors. Our materials and processes excel in balancing multiple specifications, such as dielectric, thermal conductivity and mechanical strength. CeramTec North America can engineer and manufacture custom products to exacting surface, performance and dimensional specifications.
Custom metallizing and plating processes are also available.
The full range of CeramTec North America materials and processes is available for quick delivery. If you're interested in improving component specifications or consistency, consider performance-engineered ceramics from CeramTec North America. Call us today-our sales and applications engineers are prepared to deliver the performance you need.