DOI: 10.5061/dryad.k98sf7mk9
title: Data from: Two-phase immersion cooler for medium-voltage silicon carbide MOSFETs

description: Medium-voltage (MV) silicon carbide (SiC) MOSFETs play a pivotal role in
 various industrial applications, including electrical vehicles, DC fast
 charging stations, and renewable energy conversion systems, among others.
 Compared to their silicon counterparts, the MV SiC MOSFETs feature higher
 efficiency, faster switching speeds, lower heat generation, and higher
 power density. Despite their advantages, SiC MOSFETs also lead to higher
 cooling demands. To address this challenge, we have developed a two-phase
 immersion cooler, in which the base plate is immersed in the liquid pool,
 and vapor generated from coolant boiling on the base plate is condensed on
 the top surface of the immersion cooler under external air cooling. To
 further improve the cooling capacity, the base plates are textured with
 microchannels. Experimental tests have been performed to characterize the
 thermal performance of the two-phase immersion cooler with a
 state-of-the-art 6.5kV SiC device. The immersion cooler with microchannels
 exhibits decreasing thermal resistance with the power load and is shown to
 be superior to conventional air-cooled heat sinks when the power loads are
 beyond 70 W. Leveraging the feature of reduced thermal resistance with the
 power load, the fan power can be tuned based on the power load to increase
 the lifetime of the fans.
description: # Data from: Two-phase immersion cooler for medium-voltage silicon carbide
 MOSFETs Dataset DOI: [10.5061/dryad.k98sf7mk9](10.5061/dryad.k98sf7mk9) ##
 Description of the data and file structure This dataset includes the
 temperature histories captured during two-phase immersion cooling of a
 medium-voltage silicon carbide MOSFET. The immersion cooler is pre-filled
 with 10 mL of deionized water (~ 54% of the volume of the chamber). During
 the thermal tests, the MOSFET is charged with a power supply (TDK-Lambda
 GEN300W), and the PWM fan is connected to a power supply (BK Precision
 1671A) and an Arduino UNO R3 board for duty cycle control. A T-type
 bolt-on thermocouple (McMaster-Carr 3648K26) is mounted on a bolt
 connected to the base plate (*T*bolt). Three T-type probe thermocouples
 (OMEGA Engineering TJ36-CPSS-032U-6) are used to measure the ambient
 temperature (*T*amb) and the temperatures of the source of the MOSFET
 (*T*source) and PCB (*T*PCB), respectively. All thermocouples are
 connected to a National Instruments (NI) data acquisition system
 consisting of a cDAQ-9174 chassis and a NI 9210 DAQ card. An infrared
 camera (Teledyne FLIR A655c) is used to measure the temperature field on
 the base plate at a frame rate of 50 fps. Figure 3 shows a representative
 IR image captured during the tests. The maximum temperature from the IR
 camera is used to represent the base plate temperature (*T*bp). To examine
 the effect of the PCB on IR measurement, a calibration test was performed
 to measure the base plate temperature with and without the PCB in between,
 which revealed unnoticeable differences in measured *T*bp. A direct
 air-cooling test was also performed using a conventional air-cooled heat
 sink (Awxlumv 40 × 40 × 20mm) directly installed on the MOSFET with
 thermal paste (SYY 157). ### Files and variables This dataset
 (ned3-008_ImmersionCooling.zip) includes five folders. Among them, the
 following three folders include the raw data from three representative
 cases.   * Immersion_cooler_50W_HFE-7100_flat: A representative test using
 HFE 7100 as the working fluid under a heat load of 50 W with a 100% fan
 duty cycle * Immersion_cooler_50W_water_flat: A representative test using
 deionized water as the working fluid under a heat load of 50 W with a 100%
 fan duty cycle * Immersion_cooler_100W_water_flat: A representative test
 using deionized water as the working fluid under a heat load of 100 W with
 a 100% fan duty cycle Each of these three folders includes four files,
 i.e., 1. A LabVIEW measurement file (.lvm) for temperatures of the PCB
 (ambient), MOSFET source, and the bolt measured using thermocouples 2. A
 video (.mp4) for the temperature field evolution of the two-phase
 immersion cooling measuring using IR imaging 3. A spreadsheet (.csv) for
 the maximum temperature on the base plate from the IR imaging (hotspot) 4.
 A MATLAB code (.m) for plotting the temperature histories during the
 tests. The following two folders include maximum base plate temperatures
 from IR imaging for parametric study tests:  *
 Base_plate_temperature_from_IR_water_flat: Data from immersion cooling
 tests with a flat base plate under varying heat loads (10 W - 110 W) and
 with varying fan duty cycles (0%, 50%, 100%).  *
 Base_plate_temperature_from_IR_water_microchannels: Data from immersion
 cooling tests with a microchannel base plate under varying heat loads (10
 W - 110 W) and with varying fan duty cycles (0%, 50%, 100%).  Each of
 these two folders includes two types of files, i.e.,  1. Spreadsheets
 (.csv) for the temporal evolution of the maximum temperature on the base
 plate. The naming convention for the spreadsheets follows
 "Max_T_#W_Fan_#" where the first # represents the power load
 (unit: W) and the second # represents the fan duty cycle (unit: %). The
 keyword "No_Fan" is used for a 0% fan duty cycle. Each
 spreadsheet has four columns, representing frame number (dimensionless),
 physical time (mm:ss.ss), relative time (unit: s), and temperature (unit:
 centigrade). 2. A MATLAB code to read, process, and plot the temperature
 data in the spreadsheets. The codes
 "Immersion_cooling_temp_analysis_flat.m" and
 "Immersion_cooling_temp_analysis_MC.m" are for analyzing the
 temperature data for the flat base plate and microchanneled base plate,
 respectively.  ## Code/software The .m file can be opened using MATLAB.
 The .lvm and .csv files can be processed using the MATLAB code provided in
 the dataset. The .mp4 files can be opened using a video player.