DOI: 10.17862/cranfield.rd.22890563
title: Dataset for paper "Cure kinetics, glass transition advancement and chemo-rheological modelling of an epoxy vitrimer based on disulphide metathesis"

description: The dataset consists of the results of cure kinetics, glass transition advancement, chemorheology and stress relaxation experiments for the DGEBA/4-APDS epoxy vitrimer. The heading of each column contains the quantity measured and the unit of measurement. <br> The cure kinetics dataset (Cure-kinetics-dataset.xlsx) comprises time-temperature profiles and degrees of cure attained as well as the associated reaction rate data for 4 dynamic DSC experiments (1.25°C/min, 2.5°C/min, 5°C/min and 10°C/min) and 7 isothermal DSC experiments (140°C, 150°C, 160°C, 170°C, 180°C, 190°C and 200°C). Experimental results for each temperature and rate are presented in a separate spreadsheet. <br> The chemorheology dataset (Chemorheology-dataset.xlsx) contains time, temperature and viscosity profile for 5 isothermal experiments (80°C, 90°C, 100°C, 110°C and 120°C). Experimental results for each temperature are presented in a separate spreadsheet. <br> The stress relaxation dataset (Stress-relaxation-dataset.xlsx) contains decay time, temperature, stress, strain and relaxation modulus obtained in 5 isothermal experiments (180°C, 190°C, 200°C, 210°C and 220°C). Each spreadsheet represents an experiment at a particular temperature. <br> The Tg advancement dataset (Tg-advancement-dataset.xlsx) contains time, temperature and heat flow profiles for 18 experiments carried out on partially cured samples. The data are organised in spreadsheets per DSC test; the thermal profile prior to the experiments is as follows: <br> - Tg_1.25°C-min-220°C: DSC of uncured resin. - Tg_1.25°C-min-130°C: DSC of resin partially cured at 1.25°C/min from -50°C to 130°C. - Tg_1.25°C-min-136°C: DSC of resin partially cured at 1.25°C/min from -50°C to 136°C. - Tg_1.25°C-min-140°C: DSC of resin partially cured at 1.25°C/min from -50°C to 140°C. - Tg_1.25°C-min-145°C: DSC of resin partially cured at 1.25°C/min from -50°C to 145°C. - Tg_1.25°C-min-150°C: DSC of resin partially cured at 1.25°C/min from -50°C to 150°C. - Tg_1.25°C-min-160°C: DSC of resin partially cured at 1.25°C/min from -50°C to 160°C. - Tg_1.25°C-min-170°C: DSC of resin partially cured at 1.25°C/min from -50°C to 170°C. - Tg_1.25°C-min-180°C: DSC of resin partially cured at 1.25°C/min from -50°C to 180°C. - Tg_1.25°C-min-190°C: DSC of resin partially cured at 1.25°C/min from -50°C to 190°C. - Tg_2.5°C-min-170°C: DSC of resin partially cured at 2.5°C/min from -50°C to 170°C. - Tg_5°C-min-170°C: DSC of resin partially cured at 5°C/min from -50°C to 170°C. - Tg_10°C-min-170°C: DSC of resin partially cured at 10°C/min from -50°C to 170°C. - Tg_iso10min_150°C: DSC of resin partially cured isothermally at 150°C for 10 minutes. - Tg_iso20min_150°C: DSC of resin partially cured isothermally at 150°C for 20 minutes. - Tg_iso30min_150°C: DSC of resin partially cured isothermally at 150°C for 30 minutes. - Tg_iso40min_150°C: DSC of resin partially cured isothermally at 150°C for 40 minutes. - Tg_iso100min_150°C: DSC of resin partially cured isothermally at 150°C for 100 minutes (fully cured).