DOI: 10.6084/m9.figshare.29053802
title: Dataset supporting Cure kinetics and chemorheological modelling of a transesterification-based epoxy/anhydride vitrimer

description: The dataset consists of experimental results of cure kinetics, glass transition () advancement, chemorheology, and stress relaxation of the DGEBA/MHHPA/TEOA epoxy anhydride vitrimer system. Column headers specify the measured parameters and corresponding units.Cure kinetics dataset (Cure-kinetics-dataset.xlsx) includes time-temperature profiles, degrees of cure, and reaction rates of 5 dynamic DSC experiments (1, 1.5, 2, 2.5, and 3°C/min) and 4 isothermal DSC experiments (100, 110, 120, and 130°C). Data for different experimental conditions are presented in separate spreadsheets.Chemorheology dataset (Chemorheology-dataset.xlsx) comprises time, temperature, and viscosity data of 4 isothermal tests (80, 90, 100, and 110°C), with each temperature condition documented in a separate spreadsheet.Stress relaxation dataset (Stress-relaxation-dataset.xlsx) contains time, temperature, stress, strain, and relaxation modulus data of 4 isothermal experiments (190, 200, 210, and 220°C), each recorded in a separate spreadsheet.advancement dataset (-advancement-dataset.xlsx) reports time, temperature, and heat flow profiles from 10 DSC tests on partially cured samples. Each spreadsheet corresponds to a specific experiment, with prior thermal histories corresponding to:_1°C/min -220°C: DSC of uncured resin.-_1°C-min-86°C: DSC of resin partially cured at 1°C/min from -50°C to 86°C.-_1°C-min-98°C: DSC of resin partially cured at 1°C/min from -50°C to 98°C.-_1°C-min-104.2°C: DSC of resin partially cured at 1°C/min from -50°C to 104.2°C.-_1°C-min-108.7°C: DSC of resin partially cured at 1°C/min from -50°C to 108.7°C.-_1°C-min-112.3°C: DSC of resin partially cured at 1°C/min from -50°C to 112.3°C.-_1°C-min-115.8°C: DSC of resin partially cured at 1°C/min from -50°C to 115.8°C.-_1°C-min-119.5°C: DSC of resin partially cured at 1°C/min from -50°C to 119.5°C.-_1°C-min-123.9°C: DSC of resin partially cured at 1°C/min from -50°C to 123.9°C.-_1°C-min-129.9°C: DSC of resin partially cured at 1°C/min from -50°C to 129.9°C.-_1°C-min-150°C: DSC of resin partially cured at 1°C/min from -50°C to 150°C.The dataset consists of experimental results of cure kinetics, glass transition () advancement, chemorheology, and stress relaxation of the DGEBA/MHHPA/TEOA epoxy anhydride vitrimer system. Column headers specify the measured parameters and corresponding units.Cure kinetics dataset (Cure-kinetics-dataset.xlsx) includes time-temperature profiles, degrees of cure, and reaction rates of 5 dynamic DSC experiments (1, 1.5, 2, 2.5, and 3°C/min) and 4 isothermal DSC experiments (100, 110, 120, and 130°C). Data for different experimental conditions are presented in separate spreadsheets.Chemorheology dataset (Chemorheology-dataset.xlsx) comprises time, temperature, and viscosity data of 4 isothermal tests (80, 90, 100, and 110°C), with each temperature condition documented in a separate spreadsheet.Stress relaxation dataset (Stress-relaxation-dataset.xlsx) contains time, temperature, stress, strain, and relaxation modulus data of 4 isothermal experiments (190, 200, 210, and 220°C), each recorded in a separate spreadsheet.advancement dataset (-advancement-dataset.xlsx) reports time, temperature, and heat flow profiles from 10 DSC tests on partially cured samples. Each spreadsheet corresponds to a specific experiment, with prior thermal histories corresponding to:_1°C/min -220°C: DSC of uncured resin.-_1°C-min-86°C: DSC of resin partially cured at 1°C/min from -50°C to 86°C.-_1°C-min-98°C: DSC of resin partially cured at 1°C/min from -50°C to 98°C.-_1°C-min-104.2°C: DSC of resin partially cured at 1°C/min from -50°C to 104.2°C.-_1°C-min-108.7°C: DSC of resin partially cured at 1°C/min from -50°C to 108.7°C.-_1°C-min-112.3°C: DSC of resin partially cured at 1°C/min from -50°C to 112.3°C.-_1°C-min-115.8°C: DSC of resin partially cured at 1°C/min from -50°C to 115.8°C.-_1°C-min-119.5°C: DSC of resin partially cured at 1°C/min from -50°C to 119.5°C.-_1°C-min-123.9°C: DSC of resin partially cured at 1°C/min from -50°C to 123.9°C.-_1°C-min-129.9°C: DSC of resin partially cured at 1°C/min from -50°C to 129.9°C.-_1°C-min-150°C: DSC of resin partially cured at 1°C/min from -50°C to 150°C.