title: Ð Ð°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ° ÑÐ¸ÑÑÐµÐ¼Ñ Ð¿ÑÐ¸Ð½ÑÐ´Ð¸ÑÐµÐ»ÑÐ½Ð¾Ð³Ð¾ Ð²Ð¾Ð·Ð´ÑÑÐ½Ð¾Ð³Ð¾ Ð¾Ñ Ð»Ð°Ð¶Ð´ÐµÐ½Ð¸Ñ ÑÐ°Ð´Ð¸Ð°ÑÐ¾ÑÐ° ÐÐÐ-273 Ð´Ð»Ñ ÑÑÑÑÐ¾Ð¹ÑÑÐ² ÑÐ¸Ð»Ð¾Ð²Ð¾Ð¹ ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð¸ÐºÐ¸
title: Ð²ÑÐ¿ÑÑÐºÐ½Ð°Ñ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð±Ð°ÐºÐ°Ð»Ð°Ð²ÑÐ°
titleType: Subtitle
title: Development of a forced air cooling system for the AVM-273 radiator for power electronics devices
Creators: name: ÐÐ¾Ð²Ð°Ð»ÐµÐ½ÐºÐ¾, ÐÐ»Ð°Ð´Ð¸Ð¼Ð¸Ñ
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2021
Subjects: Ð¾Ñ Ð»Ð°Ð¶Ð´ÐµÐ½Ð¸Ðµ
IGBT Ð¼Ð¾Ð´ÑÐ»Ñ
ÑÐ°Ð´Ð¸Ð°ÑÐ¾Ñ
Ð¾Ð±Ð´ÑÐ²
ÑÐµÐ¿Ð»Ð¾Ð¾ÑÐ²Ð¾Ð´
ÑÐµÐ¿Ð»Ð¾Ð²Ð¾Ð¹ Ð¿Ð¾ÑÐ¾Ðº
Ð¿ÐµÑÐµÐ³ÑÐµÐ²
cooling
IGBT-module
radiator
blowout
heat sink
heat flux
overheating

description: Ð¢ÐµÐ¼Ð° Ð²ÑÐ¿ÑÑÐºÐ½Ð¾Ð¹ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð¾Ð¹ ÑÐ°Ð±Ð¾ÑÑ: Â«Ð Ð°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ° ÑÐ¸ÑÑÐµÐ¼Ñ Ð¿ÑÐ¸Ð½ÑÐ´Ð¸ÑÐµÐ»ÑÐ½Ð¾Ð³Ð¾ Ð²Ð¾Ð·Ð´ÑÑÐ½Ð¾Ð³Ð¾ Ð¾ÑÐ»Ð°Ð¶Ð´ÐµÐ½Ð¸Ñ ÑÐ°Ð´Ð¸Ð°ÑÐ¾ÑÐ° ÐÐÐ-273 Ð´Ð»Ñ ÑÑÑÑÐ¾Ð¹ÑÑÐ² ÑÐ¸Ð»Ð¾Ð²Ð¾Ð¹ ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð¸ÐºÐ¸Â». ÐÐ°Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¿Ð¾ÑÐ²ÑÑÐµÐ½Ð° ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐµ ÑÐ¸ÑÑÐµÐ¼Ñ Ð¿ÑÐ¸Ð½ÑÐ´Ð¸ÑÐµÐ»ÑÐ½Ð¾Ð³Ð¾ Ð²Ð¾Ð·Ð´ÑÑÐ½Ð¾Ð³Ð¾ Ð¾ÑÐ»Ð°Ð¶Ð´ÐµÐ½Ð¸Ñ ÑÐ¸Ð»Ð¾Ð²ÑÑ IGBT Ð¼Ð¾Ð´ÑÐ»ÐµÐ¹ Ñ ÑÑÐµÑÐ¾Ð¼ Ð²ÑÐµÑ ÑÐ¾Ð²ÑÐµÐ¼ÐµÐ½Ð½ÑÑ ÑÑÐ°Ð½Ð´Ð°ÑÑÐ¾Ð² Ð¸ ÑÑÐµÐ±Ð¾Ð²Ð°Ð½Ð¸Ð¹, ÑÐ°ÐºÐ¸Ñ ÐºÐ°Ðº Ð¸ÑÐ¿Ð¾Ð»ÑÐ·Ð¾Ð²Ð°Ð½Ð¸Ðµ Ð¼Ð¸Ð½Ð¸Ð¼Ð°Ð»ÑÐ½Ð¾Ð¹ Ð¿Ð»Ð¾ÑÐ°Ð´Ð¸ ÑÐ°Ð´Ð¸Ð°ÑÐ¾ÑÐ° Ð´Ð»Ñ Ð¾ÑÐ»Ð°Ð¶Ð´ÐµÐ½Ð¸Ñ Ð½Ð°Ð¸Ð±Ð¾Ð»ÑÑÐµÐ³Ð¾ ÑÐ¸ÑÐ»Ð° ÑÐ¸Ð»Ð¾Ð²ÑÑ Ð¼Ð¾Ð´ÑÐ»ÐµÐ¹. ÐÐ°Ð´Ð°ÑÐ¸, ÐºÐ¾ÑÐ¾ÑÑÐµ ÑÐµÑÐ°Ð»Ð¸ÑÑ Ð² Ð¿ÑÐ¾ÑÐµÑÑÐµ ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ¸: 1. ÐÐ±Ð·Ð¾Ñ Ð¿ÑÐ¸Ð¼ÐµÐ½ÐµÐ½Ð¸Ñ IGBT-Ð¼Ð¾Ð´ÑÐ»ÐµÐ¹ Ð¸ ÑÐ¿Ð¾ÑÐ¾Ð±Ð¾Ð² Ð¸Ñ Ð¾ÑÐ»Ð°Ð¶Ð´ÐµÐ½Ð¸Ñ. 2. Ð Ð°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ° Ð¼Ð¾Ð´ÐµÐ»Ð¸ ÑÐ°Ð´Ð¸Ð°ÑÐ¾ÑÐ° ÐÐÐ-273 Ð´Ð»Ñ Ð¾ÑÐ»Ð°Ð¶Ð´ÐµÐ½Ð¸Ñ IGBT-Ð¼Ð¾Ð´ÑÐ»ÐµÐ¹, Ð±ÐµÐ· ÑÐ°ÑÑÐ¼Ð¾ÑÑÐµÐ½Ð¸Ñ Ð³Ð°Ð·Ð¾Ð´Ð¸Ð½Ð°Ð¼Ð¸ÑÐµÑÐºÐ¸Ñ Ð¿ÑÐ¾ÑÐµÑÑÐ¾Ð². 3. Ð Ð°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ° ÑÐ°Ð·Ð»Ð¸ÑÐ½ÑÑ Ð¼Ð¾Ð´ÐµÐ»ÐµÐ¹ Ð´Ð»Ñ Ð²ÑÐ±Ð¾ÑÐ° ÑÐ°ÑÐ¸Ð¾Ð½Ð°Ð»ÑÐ½Ð¾Ð³Ð¾ ÑÐ°Ð·Ð¼ÐµÑÐµÐ½Ð¸Ñ IGBT-Ð¼Ð¾Ð´ÑÐ»ÐµÐ¹ Ð½Ð° ÑÐ°Ð´Ð¸Ð°ÑÐ¾ÑÐµ Ñ Ð¿Ð¾ÑÑÐ¾ÑÐ½Ð½Ð¾Ð¹ Ð¿Ð»Ð¾ÑÐ°Ð´ÑÑ. 4. Ð Ð°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ° Ð¼Ð¾Ð´ÐµÐ»Ð¸ Ð¿ÑÐ¸Ð½ÑÐ´Ð¸ÑÐµÐ»ÑÐ½Ð¾Ð³Ð¾ Ð²Ð¾Ð·Ð´ÑÑÐ½Ð¾Ð³Ð¾ Ð¾ÑÐ»Ð°Ð¶Ð´ÐµÐ½Ð¸Ñ ÑÐ°Ð´Ð¸Ð°ÑÐ¾ÑÐ° ÐÐÐ-273 5. ÐÑÐ±Ð¾Ñ ÑÐ°ÑÐ¸Ð¾Ð½Ð°Ð»ÑÐ½ÑÑ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² ÑÐ¸ÑÑÐµÐ¼Ñ Ð²Ð¾Ð·Ð´ÑÑÐ½Ð¾Ð³Ð¾ Ð¾ÑÐ»Ð°Ð¶Ð´ÐµÐ½Ð¸Ñ. Ð Ð°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ° Ð½ÐµÐ¾Ð±ÑÐ¾Ð´Ð¸Ð¼ÑÑ ÐºÐ¾Ð¼Ð¿Ð»ÐµÐºÑÑÑÑÐ¸Ñ ÑÐ¸ÑÑÐµÐ¼Ñ. ÐÐ¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ðµ Ð¾ÑÐ½Ð¾Ð²Ð½ÑÑ ÑÐ»ÐµÐ¼ÐµÐ½ÑÐ¾Ð², ÑÐ°ÐºÐ¸Ñ ÐºÐ°Ðº ÑÐ°Ð´Ð¸Ð°ÑÐ¾Ñ, IGBT Ð¼Ð¾Ð´ÑÐ»Ñ Ð¸ Ð¼Ð¾Ð½ÑÐ°Ð¶Ð½Ð°Ñ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ° Ð¼Ð¾Ð´ÑÐ»Ñ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´Ð¸Ð»Ð¾ÑÑ Ð² Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ðµ SolidWorks, ÑÐ°Ðº ÐºÐ°Ðº Ð¾Ð½Ð° Ð¸Ð¼ÐµÐµÑ Ð²ÑÐµ Ð½ÐµÐ¾Ð±ÑÐ¾Ð´Ð¸Ð¼ÑÐµ Ð¸ Ð¿ÑÐ¾ÑÑÑÐµ Ð² Ð¾ÑÐ²Ð¾ÐµÐ½Ð¸Ð¸ Ð¸Ð½ÑÑÑÑÐ¼ÐµÐ½ÑÑ Ð´Ð»Ñ Ð¿ÑÐ¾ÐµÐºÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ Ð¼Ð¾Ð´ÐµÐ»ÐµÐ¹ Ð»ÑÐ±Ð¾Ð¹ ÑÐ»Ð¾Ð¶Ð½Ð¾ÑÑÐ¸. ÐÐ¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ðµ ÑÐ¸Ð·Ð¸ÑÐµÑÐºÐ¸Ñ Ð¿ÑÐ¾ÑÐµÑÑÐ¾Ð² Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´Ð¸Ð»Ð¾ÑÑ Ð² Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ðµ Comsol Multiphysics, Ð¿Ð¾ÑÐ¾Ð¼Ñ ÑÑÐ¾ Ð´Ð°Ð½Ð½Ð°Ñ Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ð° Ð¸Ð¼ÐµÐµÑ Ð½Ð°Ð¸Ð±Ð¾Ð»ÐµÐµ ÑÐ´Ð¾Ð±Ð½ÑÐµ Ð¸Ð½ÑÑÑÑÐ¼ÐµÐ½ÑÑ Ð´Ð»Ñ ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ¸ Ð²ÑÐµÑ ÑÐ¸Ð·Ð¸ÑÐµÑÐºÐ¸Ñ Ð¿ÑÐ¾ÑÐµÑÑÐ¾Ð² Ð½ÐµÐ¾Ð±ÑÐ¾Ð´Ð¸Ð¼ÑÑ Ð´Ð»Ñ Ð½Ð°Ð³Ð»ÑÐ´Ð½Ð¾Ð¹ Ð´ÐµÐ¼Ð¾Ð½ÑÑÑÐ°ÑÐ¸Ð¸ ÑÐ¾Ð³Ð¾, ÑÑÐ¾ Ð¿ÑÐ¾Ð¸ÑÑÐ¾Ð´Ð¸Ñ Ñ Ð¸Ð·ÑÑÐ°ÐµÐ¼Ð¾Ð¹ Ð¼Ð¾Ð´ÐµÐ»ÑÑ.
description: The subject of the graduate qualification work is Â«The development of a forced cooling system for the AVM-273 radiator for power electronic devicesÂ» This work is devoted for development of forced cooling system of radiator where IGBT-modules are placed, taking into account all modern standards and requirements, such as using the smallest heatsink area to cool the largest number of power module. The research set the following goals: 1. An overview of the application of IGBT-modules and methods of their cooling. 2. The development of the AVM-273 radiator model for the cooling IGBT modules, without considering gas-dynamic processes. 3. The development of different models to choose rational placement of IGBT-modules with constant area. 4. The development of forced cooling system of AVM-273 radiator model and the choice of rational parameters of the system. 5. The choice of rational parameters of the air-cooling system. Development of the necessary system components. Modeling of the main elements, such as a radiator, IGBT module and module mounting substrate, was carried out in the SolidWorks software, because it has all the necessary and easy-to-learn tools for designing models of any complexity. Modeling of physical processes was carried out in the Comsol Multiphysics program, because this program has the most convenient tools for developing all the physical processes necessary for a visual demonstration of what is happening with the investigated model.