title: Ð ÐµÐ°Ð»Ð¸Ð·Ð°ÑÐ¸Ñ Ð¼Ð½Ð¾Ð³Ð¾ÑÐ»Ð¾Ð¹Ð½ÑÑ Ð¼Ð¸ÐºÑÐ¾Ð¿Ð¾Ð»Ð¾ÑÐºÐ¾Ð²ÑÑ Ð¿Ð¾Ð»Ð¾ÑÐ¾Ð²ÑÑ ÑÐ¸Ð»ÑÑÑÐ¾Ð²
title: Ð²ÑÐ¿ÑÑÐºÐ½Ð°Ñ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¼Ð°Ð³Ð¸ÑÑÑÐ°
titleType: Subtitle
title: Implementation of multilayer microstrip bandpass filters
Creators: name: ÐÐ¸ÑÐ°Ð¹Ð»Ð¾Ð², ÐÐ¸ÑÐ¸Ð»Ð»
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2021
Subjects: Ð¤Ð¸Ð»ÑÑÑÑ ÑÐ»ÐµÐºÑÑÐ¸ÑÐµÑÐºÐ¸Ðµ Ð¿Ð¾Ð»Ð¾ÑÐ¾Ð²ÑÐµ
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description: ÐÐ°Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¿Ð¾ÑÐ²ÑÑÐµÐ½Ð° ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐµ ÑÑÐµÐ¼Ñ Ð¼Ð½Ð¾Ð³Ð¾ÑÐ»Ð¾Ð¹Ð½Ð¾Ð³Ð¾ Ð¼Ð¸ÐºÑÐ¾Ð¿Ð¾Ð»Ð¾ÑÐºÐ¾Ð²Ð¾Ð³Ð¾ Ð¿Ð¾Ð»Ð¾ÑÐ¾Ð²Ð¾Ð³Ð¾ ÑÐ¸Ð»ÑÑÑÐ° Ñ Ð³Ð°Ð»ÑÐ²Ð°Ð½Ð¸ÑÐµÑÐºÐ¸Ð¼ Ð¼ÐµÐ¶ÑÐ¾ÐµÐ´Ð¸Ð½ÐµÐ½Ð¸ÐµÐ¼ Ð½Ð° Ð¾ÑÐ½Ð¾Ð²Ðµ ÑÐ°ÑÑÑÑÐ° ÐºÐ»Ð°ÑÑÐ¸ÑÐµÑÐºÐ¾Ð³Ð¾ ÑÐ¸Ð»ÑÑÑÐ° Ñ ÑÐµÑÐ²ÐµÑÑÑÐ²Ð¾Ð»Ð½Ð¾Ð²ÑÐ¼Ð¸ ÑÐ²ÑÐ·ÑÐ¼Ð¸. ÐÐ·ÑÑÐµÐ½Ð¾ Ð²Ð»Ð¸ÑÐ½Ð¸Ðµ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸ Ð½Ð° ÑÐ°ÑÐ°ÐºÑÐµÑÐ¸ÑÑÐ¸ÐºÐ¸ ÑÐ¸Ð»ÑÑÑÐ°, Ð° ÑÐ°ÐºÐ¶Ðµ Ð²Ð¾Ð·Ð¼Ð¾Ð¶Ð½Ð¾ÑÑÑ ÑÐ¾ÐµÐ´Ð¸Ð½ÐµÐ½Ð¸Ñ ÑÐ¸Ð³Ð½Ð°Ð»ÑÐ½ÑÑ ÑÐ»Ð¾ÑÐ² Ñ Ð¿Ð¾Ð¼Ð¾ÑÑÑ ÑÐ°Ð·Ð»Ð¸ÑÐ½ÑÑ Ð²Ð°ÑÐ¸Ð°Ð½ÑÐ¾Ð² Ð³Ð°Ð»ÑÐ²Ð°Ð½Ð¸ÑÐµÑÐºÐ¸Ñ ÑÐ¾ÐµÐ´Ð¸Ð½ÐµÐ½Ð¸Ð¹. Ð Ð°ÑÑÐ¼Ð¾ÑÑÐµÐ½Ð° Ð²Ð¾Ð·Ð¼Ð¾Ð¶Ð½Ð¾ÑÑÑ ÑÐ¾ÐµÐ´Ð¸Ð½ÐµÐ½Ð¸Ñ ÑÐ»Ð¾ÑÐ² Ñ Ð¿Ð¾Ð¼Ð¾ÑÑÑ Ð½ÐµÑÐºÐ¾Ð»ÑÐºÐ¸Ñ ÑÑÐ½ÐºÑÐ¸Ð¾Ð½Ð°Ð»ÑÐ½ÑÑ ÑÐ»ÐµÐ¼ÐµÐ½ÑÐ¾Ð² Ð¸ Ð²Ð¾Ð·Ð¼Ð¾Ð¶Ð½Ð¾ÑÑÑ ÑÐ¾ÐµÐ´Ð¸Ð½ÐµÐ½Ð¸Ñ ÑÐºÐ²Ð¾Ð·Ñ ÑÐ¾Ð»ÑÑ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸. ÐÑÐ¾Ð²ÐµÐ´ÐµÐ½Ð° Ð¾Ð¿ÑÐ¸Ð¼Ð¸Ð·Ð°ÑÐ¸Ñ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² Ð²ÑÐµÑ ÑÑÐµÐ¼, Ð¿Ð¾Ð»ÑÑÐµÐ½Ð½ÑÑ Ð² ÑÐ¾Ð´Ðµ Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ñ. Ð¡Ð¾ÑÑÐ°Ð²Ð»ÐµÐ½Ñ ÑÐºÐ²Ð¸Ð²Ð°Ð»ÐµÐ½ÑÐ½ÑÐµ ÑÑÐµÐ¼Ñ ÑÐ¾ÐµÐ´Ð¸Ð½ÐµÐ½Ð¸Ð¹ Ð¼Ð½Ð¾Ð³Ð¾ÑÐ»Ð¾Ð¹Ð½Ð¾Ð³Ð¾ Ð¼Ð¸ÐºÑÐ¾Ð¿Ð¾Ð»Ð¾ÑÐºÐ¾Ð²Ð¾Ð³Ð¾ Ð¿Ð¾Ð»Ð¾ÑÐ¾Ð²Ð¾Ð³Ð¾ ÑÐ¸Ð»ÑÑÑÐ°. ÐÑÐ¾Ð²ÐµÐ´ÐµÐ½Ð¾ ÑÑÐ°Ð²Ð½ÐµÐ½Ð¸Ðµ Ð¿ÑÐ°ÐºÑÐ¸ÑÐµÑÐºÐ¾Ð¹ Ð¸ ÑÑÐµÐ¼Ð½Ð¾Ð¹ ÑÐµÐ°Ð»Ð¸Ð·Ð°ÑÐ¸ÑÐ¼Ð¸ ÑÐ¾ÐµÐ´Ð¸Ð½Ð¸ÑÐµÐ»ÑÐ½ÑÑ ÑÑÑÑÐºÑÑÑ. ÐÐ¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ðµ Ð¿ÑÐ¾Ð²Ð¾Ð´Ð¸Ð»Ð¾ÑÑ Ñ Ð¸ÑÐ¿Ð¾Ð»ÑÐ·Ð¾Ð²Ð°Ð½Ð¸ÐµÐ¼ ÑÐ¸ÑÑÐµÐ¼Ñ Ð°Ð²ÑÐ¾Ð¼Ð°ÑÐ¸Ð·Ð¸ÑÐ¾Ð²Ð°Ð½Ð½Ð¾Ð³Ð¾ Ð¿ÑÐ¾ÐµÐºÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ Advanced Design System ÐºÐ¾Ð¼Ð¿Ð°Ð½Ð¸Ð¸ Keysight Technologies, Ð° ÑÐ°ÐºÐ¶Ðµ ANSYS High Frequency Structural Simulator. Ð£Ð»ÑÑÑÐµÐ½Ð¸Ðµ ÑÐ°ÑÐ°ÐºÑÐµÑÐ¸ÑÑÐ¸Ðº Ð² Ð¾Ð±Ð»Ð°ÑÑÐ¸ Ð²Ð½Ð¾ÑÐ¸Ð¼ÑÑ Ð¿Ð¾ÑÐµÑÑ, ÑÑÐ¸ÑÑÐ²Ð°ÐµÑÑÑ ÑÐ°ÑÑÐ¼Ð¾ÑÑÐµÐ½Ð¸ÐµÐ¼ Ð²Ð»Ð¸ÑÐ½Ð¸Ñ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸ Ð¸ Ð²Ð°ÑÐ¸Ð°Ð½ÑÐ¾Ð² Ð¼ÐµÐ¶ÑÐ¾ÐµÐ´Ð¸Ð½ÐµÐ½Ð¸Ñ ÑÐ¸Ð³Ð½Ð°Ð»ÑÐ½ÑÑ ÑÐ»Ð¾ÑÐ².
description: The paper presents the schemes of a multi-layer microstrip band-pass filter with galvanic interaction based on the calculations of a classical filter with quarter-wave connections. The influence of the substrate parameters on the filter characteristics, as well as the possibility of connecting signal layers using various options of galvanic connections, has been studied. The possibility of connecting layers using several functional elements and the possibility of connecting through the thickness of the substrate is considered. Optimization of the parameters of all circuits obtained during the study was carried out. Equivalent diagrams of connections of a multilayer microstrip bandpass filter are compiled. A comparison is made between practical and circuit implementations of the connecting structures. The simulation was carried out using Keysight Technologies Advanced Design System and ANSYS High-Frequency Structural Simulator. Improvement of characteristics in the field of insertion loss is taken into account by considering the influence of the substrate parameters.