title: Ð¦Ð¸ÑÑÐ¾Ð²ÑÐµ Ð´Ð²Ð¾Ð¹Ð½Ð¸ÐºÐ¸ Ð² Ð²ÑÑÐ¾ÐºÐ¾ÑÐµÑ Ð½Ð¾Ð»Ð¾Ð³Ð¸ÑÐ½Ð¾Ð¹ Ð¿ÑÐ¾Ð¼ÑÑÐ»ÐµÐ½Ð½Ð¾ÑÑÐ¸
title: Ð¼Ð¾Ð½Ð¾Ð³ÑÐ°ÑÐ¸Ñ
titleType: Subtitle
title: Digital Twins in the High-Technology Manufacturing Industry
Creators: name: ÐÐ¾ÑÐ¾Ð²ÐºÐ¾Ð², ÐÐ»ÐµÐºÑÐµÐ¹
name: Ð ÑÐ±Ð¾Ð², Ð®ÑÐ¸Ð¹
name: Ð©ÐµÑÐ±Ð¸Ð½Ð°, ÐÑÐ´Ð¼Ð¸Ð»Ð°
name: ÐÐ°ÑÑÑÐ½ÐµÑ, ÐÐºÐ°ÑÐµÑÐ¸Ð½Ð°
name: ÐÐ¾ÑÑÐµÐ²ÑÐºÐ°Ñ, ÐÐ½Ð°ÑÑÐ°ÑÐ¸Ñ
name: Ð¥ÑÑÐ¾ÑÑÐ¾Ð²Ð°, ÐÐ½Ð°ÑÑÐ°ÑÐ¸Ñ
name: ÐÑÐºÑÑÐºÐ¸Ð½, ÐÑÐ·ÑÐ¼Ð°
name: ÐÐ°Ð¼Ð·Ð¸ÐºÐ¾Ð²Ð°, ÐÐ½Ð½Ð°
Publisher: name: ÐÐÐÐÐ¢ÐÐ¥-ÐÐ ÐÐ¡Ð¡
Year: 2022
Subjects: ÐÐ½ÑÐ¾ÑÐ¼Ð°ÑÐ¸Ð¾Ð½Ð½ÑÐµ ÑÐµÑ Ð½Ð¾Ð»Ð¾Ð³Ð¸Ð¸

description: ÐÐ¾Ð½Ð¾Ð³ÑÐ°ÑÐ¸Ñ Ð¿Ð¾Ð´Ð³Ð¾ÑÐ¾Ð²Ð»ÐµÐ½Ð° ÑÐ¾ÑÑÑÐ´Ð½Ð¸ÐºÐ°Ð¼Ð¸ ÐÐµÑÐµÐ´Ð¾Ð²Ð¾Ð¹ Ð¸Ð½Ð¶ÐµÐ½ÐµÑÐ½Ð¾Ð¹ ÑÐºÐ¾Ð»Ñ Ð¡ÐÐ±ÐÐ£ Â«Ð¦Ð¸ÑÑÐ¾Ð²Ð¾Ð¹ Ð¸Ð½Ð¶Ð¸Ð½Ð¸ÑÐ¸Ð½Ð³Â» Ð¸ Ð¦ÐµÐ½ÑÑÐ° ÐºÐ¾Ð¼Ð¿ÐµÑÐµÐ½ÑÐ¸Ð¹ ÐÐ¢Ð Ð¡ÐÐ±ÐÐ£ Â«ÐÐ¾Ð²ÑÐµ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²ÐµÐ½Ð½ÑÐµ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸Â» Ð² Ð¿Ð°ÑÑÐ½ÐµÑÑÑÐ²Ðµ Ñ ÐÐ½ÑÑÐ°ÑÑÑÑÐºÑÑÑÐ½ÑÐ¼ ÑÐµÐ½ÑÑÐ¾Ð¼ ÐÐ¢Ð Ð¿Ð¾ Ð½Ð°Ð¿ÑÐ°Ð²Ð»ÐµÐ½Ð¸Ñ Â«Ð¢ÐµÑÐ½ÐµÑÂ» Ð¡ÐÐ±ÐÐ£ Ð¸ ÑÐ²Ð»ÑÐµÑÑÑ Ð¿ÑÐ¾Ð´Ð¾Ð»Ð¶ÐµÐ½Ð¸ÐµÐ¼ Ð¾Ð´Ð½Ð¾Ð¸Ð¼ÐµÐ½Ð½Ð¾Ð³Ð¾ ÐºÑÐ°ÑÐºÐ¾Ð³Ð¾ Ð´Ð¾ÐºÐ»Ð°Ð´Ð° (ÑÐµÐ½ÑÑÐ±ÑÑ 2019 Ð³.) Ð¸ Ð¾Ð±Ð·Ð¾ÑÐ° Â«Ð¦Ð¸ÑÑÐ¾Ð²ÑÐµ Ð´Ð²Ð¾Ð¹Ð½Ð¸ÐºÐ¸: Ð²Ð¾Ð¿ÑÐ¾ÑÑ ÑÐµÑÐ¼Ð¸Ð½Ð¾Ð»Ð¾Ð³Ð¸Ð¸Â» (Ð´ÐµÐºÐ°Ð±ÑÑ 2021 Ð³.). ÐÐ·Ð´Ð°Ð½Ð¸Ðµ ÑÐ¾Ð´ÐµÑÐ¶Ð¸Ñ Ð°Ð½Ð°Ð»Ð¸ÑÐ¸ÑÐµÑÐºÐ¸Ðµ Ð¸ ÑÐºÑÐ¿ÐµÑÑÐ½ÑÐµ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ñ Ð¿Ð¾ Ð¾Ð´Ð½Ð¾Ð¼Ñ Ð¸Ð· Ð¾ÑÐ½Ð¾Ð²Ð½ÑÑ ÑÑÐµÐ½Ð´Ð¾Ð² IV Ð¿ÑÐ¾Ð¼ÑÑÐ»ÐµÐ½Ð½Ð¾Ð¹ ÑÐµÐ²Ð¾Ð»ÑÑÐ¸Ð¸ Ð¸ ÐºÐ»ÑÑÐµÐ²ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð² ÑÐ¸ÑÑÐ¾Ð²Ð¾Ð³Ð¾ Ð¸Ð½Ð¶Ð¸Ð½Ð¸ÑÐ¸Ð½Ð³Ð° (Digital Engineering) â Ð¿Ð¾ ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐµ Ð¸ Ð¿ÑÐ¸Ð¼ÐµÐ½ÐµÐ½Ð¸Ñ ÑÐ¸ÑÑÐ¾Ð²ÑÑ Ð´Ð²Ð¾Ð¹Ð½Ð¸ÐºÐ¾Ð² (Digital Twins) Ð² ÑÐµÐ»ÑÑ ÑÐ¾Ð·Ð´Ð°Ð½Ð¸Ñ Ð² ÐºÑÐ°ÑÑÐ°Ð¹ÑÐ¸Ðµ ÑÑÐ¾ÐºÐ¸ Ð³Ð»Ð¾Ð±Ð°Ð»ÑÐ½Ð¾ ÐºÐ¾Ð½ÐºÑÑÐµÐ½ÑÐ¾ÑÐ¿Ð¾ÑÐ¾Ð±Ð½Ð¾Ð¹, Ð½Ð°ÑÐºÐ¾ÐµÐ¼ÐºÐ¾Ð¹ Ð¸ Ð²ÑÑÐ¾ÐºÐ¾ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐ½Ð¾Ð¹ Ð¿ÑÐ¾Ð´ÑÐºÑÐ¸Ð¸. Ð Ð°ÑÑÐ¼Ð¾ÑÑÐµÐ½Ñ ÐºÐ°Ðº Ð¿ÑÐ¸Ð¼ÐµÑÑ Ð¾Ð¿ÑÐµÐ´ÐµÐ»ÐµÐ½Ð¸Ð¹ Ð¸ ÑÑÐ°ÐºÑÐ¾Ð²Ð¾Ðº ÑÐµÑÐ¼Ð¸Ð½Ð° Â«ÑÐ¸ÑÑÐ¾Ð²Ð¾Ð¹ Ð´Ð²Ð¾Ð¹Ð½Ð¸ÐºÂ» Ð·Ð°ÑÑÐ±ÐµÐ¶Ð½ÑÑ Ð¸ Ð¾ÑÐµÑÐµÑÑÐ²ÐµÐ½Ð½ÑÑ ÑÐ¿ÐµÑÐ¸Ð°Ð»Ð¸ÑÑÐ¾Ð² Ð¸ Ð²ÑÑÐ¾ÐºÐ¾ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐ½ÑÑ ÐºÐ¾Ð¼Ð¿Ð°Ð½Ð¸Ð¹, ÑÐ°Ðº Ð¸ Ð¿Ð¾Ð´ÑÐ¾Ð´ Ðº ÑÐ¾Ð·Ð´Ð°Ð½Ð¸Ñ ÑÐ¸ÑÑÐ¾Ð²ÑÑ Ð´Ð²Ð¾Ð¹Ð½Ð¸ÐºÐ¾Ð² Ð²ÑÑÐ¾ÐºÐ¾ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐ½ÑÑ Ð¸Ð·Ð´ÐµÐ»Ð¸Ð¹ Ð¿ÑÐ¾Ð¼ÑÑÐ»ÐµÐ½Ð½Ð¾ÑÑÐ¸, Ð¾Ð¿Ð¸ÑÐ°ÑÑÐ¸Ð¹ÑÑ Ð½Ð° ÑÐ½Ð¸ÐºÐ°Ð»ÑÐ½ÑÐ¹ Ð¾Ð¿ÑÑ Ð²ÑÐ¿Ð¾Ð»Ð½ÐµÐ½Ð¸Ñ Ð¿ÑÐ¾ÐµÐºÑÐ¾Ð² Ð¸Ð½Ð¶ÐµÐ½ÐµÑÐ°Ð¼Ð¸ Ð¸ ÑÑÐµÐ½ÑÐ¼Ð¸ Ð¡ÐÐ±ÐÐ£. Ð ÐºÐ½Ð¸Ð³Ðµ ÑÐ°ÑÑÐ¼Ð¾ÑÑÐµÐ½ ÑÑÐ½Ð¾Ðº ÑÐ¸ÑÑÐ¾Ð²ÑÑ Ð´Ð²Ð¾Ð¹Ð½Ð¸ÐºÐ¾Ð² â Ð¿ÑÐµÐ´ÑÑÐ°Ð²Ð»ÐµÐ½Ñ Ð¾ÑÐ½Ð¾Ð²Ð½ÑÐµ ÑÑÐµÐ½Ð´Ñ ÐµÐ³Ð¾ ÑÐ°Ð·Ð²Ð¸ÑÐ¸Ñ, Ð´ÑÐ°Ð¹Ð²ÐµÑÑ Ð¸ Ð±Ð°ÑÑÐµÑÑ, Ð° ÑÐ°ÐºÐ¶Ðµ Ð²ÑÐ´ÐµÐ»ÐµÐ½Ñ ÐºÐ»ÑÑÐµÐ²ÑÐµ Ð¸Ð³ÑÐ¾ÐºÐ¸ Ð¸ ÑÑÐ¾ÑÐ¼Ð¸ÑÐ¾Ð²Ð°Ð½Ñ Ð¿ÑÐ¾Ð³Ð½Ð¾Ð·Ñ ÑÐ°Ð·Ð²Ð¸ÑÐ¸Ñ. ÐÑÐ´ÐµÐ»ÑÐ½ÑÐ¹ ÑÐ°Ð·Ð´ÐµÐ» Ð¿Ð¾ÑÐ²ÑÑÐµÐ½ ÑÐ°ÑÑÐ¼Ð¾ÑÑÐµÐ½Ð¸Ñ Ð¿ÑÐ¸Ð¼ÐµÑÐ¾Ð² ÑÐµÐ°Ð»Ð¸Ð·Ð°ÑÐ¸Ð¸ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐ¸ÑÑÐ¾Ð²ÑÑ Ð´Ð²Ð¾Ð¹Ð½Ð¸ÐºÐ¾Ð² Ð½Ð° Ð¿ÑÐ°ÐºÑÐ¸ÐºÐµ Ð½Ðµ ÑÐ¾Ð»ÑÐºÐ¾ Ð² ÑÐ°Ð·Ð»Ð¸ÑÐ½ÑÑ Ð¾ÑÑÐ°ÑÐ»ÑÑ Ð¿ÑÐ¾Ð¼ÑÑÐ»ÐµÐ½Ð½Ð¾ÑÑÐ¸, Ð½Ð¾ Ð¸ Ð² Ð´ÑÑÐ³Ð¸Ñ ÑÐµÐºÑÐ¾ÑÐ°Ñ ÑÐºÐ¾Ð½Ð¾Ð¼Ð¸ÐºÐ¸.
ÐÐ° Ð¾Ð±Ð»Ð¾Ð¶ÐºÐµ â Ð¾Ð±ÑÐ°Ñ ÐºÐ°ÑÑÐ° Ð½Ð°Ð¿ÑÐ°Ð²Ð»ÐµÐ½Ð¸Ð¹ Ð¿ÑÐ±Ð»Ð¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð¾Ð¹ Ð°ÐºÑÐ¸Ð²Ð½Ð¾ÑÑÐ¸ Ð¿Ð¾ ÑÐ¾Ð²Ð¼ÐµÑÑÐ½Ð¾Ð¹ ÑÐ¿Ð¾Ð¼Ð¸Ð½Ð°ÐµÐ¼Ð¾ÑÑÐ¸ ÐºÐ»ÑÑÐµÐ²ÑÑ ÑÐ»Ð¾Ð² Ð¿Ð¾ ÑÐµÐ¼Ð°ÑÐ¸ÐºÐµ Â«ÑÐ¸ÑÑÐ¾Ð²Ð¾Ð¹ Ð´Ð²Ð¾Ð¹Ð½Ð¸ÐºÂ» (Digital Twin) (1993â2022 Ð³Ð³.). ÐÐ½Ð°Ð»Ð¸Ð· Ð¿ÑÐ±Ð»Ð¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð¾Ð¹ Ð°ÐºÑÐ¸Ð²Ð½Ð¾ÑÑÐ¸ Ð¿Ð¾ Ð´Ð°Ð½Ð½ÑÐ¼ ÑÐ¸ÑÑÐµÐ¼Ñ Scopus Ð½Ð° Ð¾ÑÐ½Ð¾Ð²Ðµ 167 ÐºÐ»ÑÑÐµÐ²ÑÑ ÑÐ»Ð¾Ð², ÐºÐ¾ÑÐ¾ÑÑÐµ ÑÐ¾Ð²Ð¼ÐµÑÑÐ½Ð¾ ÑÐ¿Ð¾Ð¼Ð¸Ð½Ð°ÑÑÑÑ Ð² Ð½Ð°ÑÑÐ½ÑÑ Ð¿ÑÐ±Ð»Ð¸ÐºÐ°ÑÐ¸ÑÑ Ð¾Ñ 15 ÑÐ°Ð· Ð¸ Ð±Ð¾Ð»ÐµÐµ. ÐÐ°ÑÑÐ° Ð¿Ð¾ÑÑÑÐ¾ÐµÐ½Ð° Ð² Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ð½Ð¾Ð¼
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description: This monograph has been prepared by the SPbPU School of Advanced Engineering Studies in Digital Engineering and SPbPU Advanced Manufacturing Technologies Center of the National Technology Initiative in partnership with the SPbPU Technet Infrastructure Center of the National Technology Initiative. It extends and further develops the same-titled preliminary research report (September 2019) and the overview paper entitled âDigital Twins: Matters of Terminologyâ (December 2021). The monograph provides analysis and insight on the development and application of digital twins. Being one of the major trends of the unfolding fourth industrial revolution and a key component of digital engineering, the digital twin is a disruptive technology that reimagines how globally competitive and R&amp;Dintensive products are engineered in the shortest time possible. This publication features definitions and interpretations of the digital twin by foreign and Russian experts and high-tech companies. The authors propose an approach to developing digital twins of hightech manufacturing industry products based on SPbPU engineersâ and scientistsâ unique experience of related projects. The authors also identify and analyze key digital twin market trends, drivers, barriers and stakeholders, as well as forecast the digital twin market. A separate section focuses on use cases of digital twin technology in industries not limited to manufacturing, but also encompassing other economic sectors. Image on the front cover: the co-occurrence network of the Digital Twin related terms extracted from the Scopus abstract and citation database (Scopus data include 167 terms that co-occur 15 times or more in the period 1993â2022). The network has been constructed and visualized in the VOSviewer software tool.