title: ÐÐ°ÑÐµÐ¼Ð°ÑÐ¸ÑÐµÑÐºÐ¾Ðµ Ð¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ðµ Ð¿ÑÐ¾ÑÐµÑÑÐ° Ñ Ð¾Ð»Ð¾Ð´Ð½Ð¾Ð³Ð¾ Ð³Ð°Ð·Ð¾Ð´Ð¸Ð½Ð°Ð¼Ð¸ÑÐµÑÐºÐ¾Ð³Ð¾ Ð½Ð°Ð¿ÑÐ»ÐµÐ½Ð¸Ñ
title: Ð²ÑÐ¿ÑÑÐºÐ½Ð°Ñ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¼Ð°Ð³Ð¸ÑÑÑÐ°
titleType: Subtitle
title: Mathematical modeling of the cold gas dynamic spraying process
Creators: name: ÐÐ¸Ð½Ñ Ð®Ð¹
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2023
Subjects: ÐÐ°ÑÐµÐ¼Ð°ÑÐ¸ÑÐµÑÐºÐ¾Ðµ Ð¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ðµ
ÐÐµÑÐ°Ð»Ð»Ð¸Ð·Ð°ÑÐ¸Ñ
ÐÐµÑÐ¾ÑÐ¼Ð°ÑÐ¸Ñ Ð¿Ð»Ð°ÑÑÐ¸ÑÐµÑÐºÐ°Ñ
Ñ Ð¾Ð»Ð¾Ð´Ð½Ð¾Ðµ Ð³Ð°Ð·Ð¾Ð´Ð¸Ð½Ð°Ð¼Ð¸ÑÐµÑÐºÐ¾Ðµ Ð½Ð°Ð¿ÑÐ»ÐµÐ½Ð¸Ðµ
ÑÑÐ¾Ð»ÐºÐ½Ð¾Ð²ÐµÐ½Ð¸Ðµ
gas-dynamic spraying
collision

description: Ð Ð´Ð°Ð½Ð½Ð¾Ð¹ ÑÐ°Ð±Ð¾ÑÐµ Ð¿ÑÐ¾ÑÐµÑÑ ÑÑÐ¾Ð»ÐºÐ½Ð¾Ð²ÐµÐ½Ð¸Ñ ÑÐ°ÑÑÐ¸Ñ Ñ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¾Ð¹ Ð¿ÑÐ¸ ÑÐ¾Ð»Ð¾Ð´Ð½Ð¾Ð¼ Ð½Ð°Ð¿ÑÐ»ÐµÐ½Ð¸Ð¸ Ð¼Ð°ÑÐµÐ¼Ð°ÑÐ¸ÑÐµÑÐºÐ¸ ÑÐ¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½ Ñ Ð¿Ð¾Ð¼Ð¾ÑÑÑ Ð°Ð½Ð°Ð»Ð¸Ð·Ð° Ð¼ÐµÑÐ¾Ð´Ð¾Ð¼ ÐºÐ¾Ð½ÐµÑÐ½ÑÑ ÑÐ»ÐµÐ¼ÐµÐ½ÑÐ¾Ð² Ñ Ð¸ÑÐ¿Ð¾Ð»ÑÐ·Ð¾Ð²Ð°Ð½Ð¸ÐµÐ¼ Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ð½Ð¾Ð³Ð¾ Ð¾Ð±ÐµÑÐ¿ÐµÑÐµÐ½Ð¸Ñ ANSYS/LS-DYNA. Ð¡Ð½Ð°ÑÐ°Ð»Ð° Ð±ÑÐ» ÑÐ¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½ Ð¿ÑÐ¾ÑÐµÑÑ ÑÑÐ¾Ð»ÐºÐ½Ð¾Ð²ÐµÐ½Ð¸Ñ ÑÐ°ÑÑÐ¸Ñ Ñ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¾Ð¹ Ð¿ÑÐ¸ ÑÐ°Ð·Ð»Ð¸ÑÐ½ÑÑ ÑÐºÐ¾ÑÐ¾ÑÑÑÑ ÑÑÐ¾Ð»ÐºÐ½Ð¾Ð²ÐµÐ½Ð¸Ñ, ÑÐ³Ð»Ð°Ñ Ð½Ð°ÐºÐ»Ð¾Ð½Ð° ÑÑÐ¾Ð»ÐºÐ½Ð¾Ð²ÐµÐ½Ð¸Ñ Ð¸ ÑÐ²Ð¾Ð¹ÑÑÐ²Ð°Ñ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ð°. Ð ÐµÐ·ÑÐ»ÑÑÐ°ÑÑ Ð¼Ð°ÑÐµÐ¼Ð°ÑÐ¸ÑÐµÑÐºÐ¾Ð³Ð¾ Ð¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ Ð¿Ð¾ÐºÐ°Ð·ÑÐ²Ð°ÑÑ, ÑÑÐ¾ ÑÐ²ÐµÐ»Ð¸ÑÐµÐ½Ð¸Ðµ ÑÐºÐ¾ÑÐ¾ÑÑÐ¸ ÑÑÐ¾Ð»ÐºÐ½Ð¾Ð²ÐµÐ½Ð¸Ñ ÑÐ²ÐµÐ»Ð¸ÑÐ¸Ð²Ð°ÐµÑ ÑÑÐµÐ¿ÐµÐ½Ñ Ð´ÐµÑÐ¾ÑÐ¼Ð°ÑÐ¸Ð¸ ÑÐ°ÑÑÐ¸ÑÑ Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸, ÑÑÐ¾ Ð±Ð»Ð°Ð³Ð¾Ð¿ÑÐ¸ÑÑÐ½Ð¾ Ð´Ð»Ñ ÑÑÐµÐ¿Ð»ÐµÐ½Ð¸Ñ ÑÐ°ÑÑÐ¸ÑÑ Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸; ÑÐ¼ÐµÐ½ÑÑÐµÐ½Ð¸Ðµ ÑÐ³Ð»Ð° Ð½Ð°ÐºÐ»Ð¾Ð½Ð° ÑÑÐ¾Ð»ÐºÐ½Ð¾Ð²ÐµÐ½Ð¸Ñ Ð´ÐµÐ»Ð°ÐµÑ ÑÑÐµÐ¿Ð»ÐµÐ½Ð¸Ðµ ÑÐ°ÑÑÐ¸ÑÑ Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸ ÑÐ»Ð°Ð±ÐµÐµ; Ð´ÐµÑÐ¾ÑÐ¼Ð°ÑÐ¸Ñ ÑÐ°ÑÑÐ¸ÑÑ Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸ Ð·Ð°Ð²Ð¸ÑÐ¸Ñ Ð¾Ñ Ð¾ÑÐ½Ð¾ÑÐ¸ÑÐµÐ»ÑÐ½Ð¾Ð¹ ÑÐ²ÐµÑÐ´Ð¾ÑÑÐ¸ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ð¾Ð². ÐÐ°Ð»ÐµÐµ Ð±ÑÐ»Ð¾ Ð¿ÑÐ¾Ð²ÐµÐ´ÐµÐ½Ð¾ Ð¼Ð°ÑÐµÐ¼Ð°ÑÐ¸ÑÐµÑÐºÐ¾Ðµ Ð¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ðµ Ð¿ÑÐ¾ÑÐµÑÑÐ° ÑÑÐ¾Ð»ÐºÐ½Ð¾Ð²ÐµÐ½Ð¸Ñ Ð¼ÐµÐ¶Ð´Ñ ÑÐ°ÑÑÐ¸ÑÐ°Ð¼Ð¸ Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¾Ð¹ Ñ ÑÑÐµÑÐ¾Ð¼ Ð¸Ð·Ð¼ÐµÐ½ÐµÐ½Ð¸Ñ ÑÐµÐ¼Ð¿ÐµÑÐ°ÑÑÑÑ. ÐÐ»Ð¸ÑÐ½Ð¸Ðµ ÑÐµÐ¼Ð¿ÐµÑÐ°ÑÑÑÑ Ð½Ð° Ð¿ÑÐ¾ÑÐµÑÑ Ð¾ÑÐ°Ð¶Ð´ÐµÐ½Ð¸Ñ Ð±ÑÐ»Ð¾ Ð¿ÑÐ¾Ð°Ð½Ð°Ð»Ð¸Ð·Ð¸ÑÐ¾Ð²Ð°Ð½Ð¾ Ð¿ÑÑÐµÐ¼ Ð¸Ð·Ð¼ÐµÐ½ÐµÐ½Ð¸Ñ Ð½Ð°ÑÐ°Ð»ÑÐ½Ð¾Ð¹ ÑÐµÐ¼Ð¿ÐµÑÐ°ÑÑÑÑ Ð¼ÐµÐ¶Ð´Ñ ÑÐ°ÑÑÐ¸ÑÐ°Ð¼Ð¸ Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¾Ð¹. ÐÐ¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ðµ Ð¿Ð¾ÐºÐ°Ð·Ð°Ð»Ð¾, ÑÑÐ¾ Ð¿Ð¾Ð²ÑÑÐµÐ½Ð¸Ðµ Ð½Ð°ÑÐ°Ð»ÑÐ½Ð¾Ð¹ ÑÐµÐ¼Ð¿ÐµÑÐ°ÑÑÑÑ ÑÐ°ÑÑÐ¸Ñ Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸ Ð±Ð¾Ð»ÐµÐµ Ð±Ð»Ð°Ð³Ð¾Ð¿ÑÐ¸ÑÑÐ½Ð¾ Ð´Ð»Ñ ÑÑÐµÐ¿Ð»ÐµÐ½Ð¸Ñ ÑÐ°ÑÑÐ¸Ñ Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸ Ð¸ ÑÐ»ÑÑÑÐ°ÐµÑ ÑÑÑÐµÐºÑ Ð¿Ð¾ÐºÑÑÑÐ¸Ñ, ÑÐµÐ¼ Ð¿Ð¾Ð²ÑÑÐµÐ½Ð¸Ðµ Ð½Ð°ÑÐ°Ð»ÑÐ½Ð¾Ð¹ ÑÐµÐ¼Ð¿ÐµÑÐ°ÑÑÑÑ ÑÐ¾Ð»ÑÐºÐ¾ ÑÐ°ÑÑÐ¸Ñ Ð¸Ð»Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ¸. ÐÐ°ÐºÐ¾Ð½ÐµÑ, Ð±ÑÐ» ÑÐ¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½ Ð¿ÑÐ¾ÑÐµÑÑ Ð¿Ð¾Ð¿Ð°Ð´Ð°Ð½Ð¸Ñ Ð½ÐµÑÐºÐ¾Ð»ÑÐºÐ¸Ñ ÑÐ°ÑÑÐ¸Ñ Ð½Ð° Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÑ. Ð§Ð°ÑÑÐ¸ÑÑ Ð½Ðµ Ð´Ð¾Ð»Ð¶Ð½Ñ ÑÐ°ÑÐ¿Ð¾Ð»Ð°Ð³Ð°ÑÑÑÑ ÑÐ»Ð¸ÑÐºÐ¾Ð¼ Ð±Ð»Ð¸Ð·ÐºÐ¾ Ð´ÑÑÐ³ Ðº Ð´ÑÑÐ³Ñ, Ð¸Ð½Ð°ÑÐµ ÑÐ°ÑÑÐ¸ÑÑ Ð±ÑÐ´ÑÑ Ð»ÐµÐ³ÐºÐ¾ Ð¾ÑÑÐºÐ°ÐºÐ¸Ð²Ð°ÑÑ, ÑÑÐ¾ Ð½Ðµ ÑÐ¿Ð¾ÑÐ¾Ð±ÑÑÐ²ÑÐµÑ Ð¾ÑÐ°Ð¶Ð´ÐµÐ½Ð¸Ñ. ÐÑÐ¸ Ð¼Ð°ÑÐµÐ¼Ð°ÑÐ¸ÑÐµÑÐºÐ¾Ð¼ Ð¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ð¸ ÑÐ´Ð°ÑÐ° Ð½ÐµÑÐºÐ¾Ð»ÑÐºÐ¸Ñ ÑÐ°ÑÑÐ¸Ñ Ð±ÑÐ»Ð¾ Ð¾Ð±Ð½Ð°ÑÑÐ¶ÐµÐ½Ð¾, ÑÑÐ¾ Ð¿Ð¾ÑÐ»ÐµÐ´ÑÑÑÐ¸Ðµ ÑÐ°ÑÑÐ¸ÑÑ Ð´ÐµÐ¹ÑÑÐ²ÑÑÑ ÐºÐ°Ðº ÑÐ°ÑÐ°Ð½ Ð½Ð° ÑÐ°ÑÑÐ¸ÑÑ, ÐºÐ¾ÑÐ¾ÑÑÐµ ÑÐ´Ð°ÑÐ¸Ð»Ð¸ÑÑ Ð¾ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÑ Ð¿ÐµÑÐ²ÑÐ¼Ð¸.
description: In this paper, the particle-substrate collision process in cold spraying is mathematically simulated by finite element analysis using ANSYS/LS-DYNA software. First, the particle-substrate collision process was simulated at different collision velocities, collision inclination angles and material properties. The results of the mathematical simulation show that the increase of the collision speed will increase the degree of particlesubstrate deformation, which is beneficial to the bonding of the particle and the substrate; the decrease of the collision inclination will make the bonding of the particle and the substrate weaker; the deformation of the particle and the substrate depends on the relative hardness between the materials. Next, a mathematical simulation of the collision process between the particles and the substrate was carried out considering the temperature variation. The effect of temperature on the deposition process was analyzed by varying the initial temperature between the particles and the substrate. The simulations revealed that increasing the initial temperature of the particles and the substrate was more beneficial to the bonding of the particles and the substrate and improved the coating effect than increasing the initial temperature of the particles or the substrate alone. Finally, the process of multiple particles hitting the substrate was simulated. The particles should not be spaced too close to each other, otherwise the particles will easily bounce back, which is not conducive to deposition. In the mathematical simulation of multiple particle impact, it was found that the subsequent particles acted as a ramming effect on the particles that impacted the substrate first.