title: ÐÐ¾Ð²ÑÑÐµÐ½Ð¸Ðµ ÐºÐ¾Ð½ÐºÑÑÐµÐ½ÑÐ¾ÑÐ¿Ð¾ÑÐ¾Ð±Ð½Ð¾ÑÑÐ¸ Ð¿ÑÐµÐ´Ð¿ÑÐ¸ÑÑÐ¸Ñ ÐºÐ¾Ð½ÑÑÐ°ÐºÑÐ½Ð¾Ð³Ð¾ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²Ð° ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð¸ÐºÐ¸ Ð½Ð° Ð±Ð°Ð·Ðµ Ð²Ð½ÐµÐ´ÑÐµÐ½Ð¸Ñ ÑÐµÑ Ð½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¸Ñ Ð¸Ð½Ð½Ð¾Ð²Ð°ÑÐ¸Ð¹
title: Ð¼Ð°Ð³Ð¸ÑÑÐµÑÑÐºÐ°Ñ Ð´Ð¸ÑÑÐµÑÑÐ°ÑÐ¸Ñ
titleType: Subtitle
Creators: name: Ð¥Ð°Ð»Ð¸Ð»Ð¾Ð², ÐÐ·Ð°Ð¼Ð°Ñ
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2016
Subjects: Ð­Ð»ÐµÐºÑÑÐ¾Ð½Ð½Ð°Ñ Ð¿ÑÐ¾Ð¼ÑÑÐ»ÐµÐ½Ð½Ð¾ÑÑÑ, Ð¿ÑÐµÐ´Ð¿ÑÐ¸ÑÑÐ¸Ñ
ÐÑÐ¾Ð¼ÑÑÐ»ÐµÐ½Ð½ÑÐµ Ð¿ÑÐµÐ´Ð¿ÑÐ¸ÑÑÐ¸Ñ
ÐÐµÑÐ°ÑÐ½ÑÐµ ÑÑ ÐµÐ¼Ñ
ÐÐ°ÑÐµÐ¼Ð°ÑÐ¸ÑÐµÑÐºÐ¾Ðµ Ð¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ðµ
Ð¸Ð½Ð½Ð¾Ð²Ð°ÑÐ¸Ð¸
Ð¸Ð½Ð½Ð¾Ð²Ð°ÑÐ¸Ð¾Ð½Ð½ÑÐ¹ Ð¼ÐµÐ½ÐµÐ´Ð¶Ð¼ÐµÐ½Ñ
innovation
innovation management
mathematical modeling
printed circuits

description: ÐÐ° Ð¾ÑÐ½Ð¾Ð²Ð°Ð½Ð¸Ð¸ Ð°Ð½Ð°Ð»Ð¸Ð·Ð° Ð»Ð¸ÑÐµÑÐ°ÑÑÑÐ½ÑÑ Ð¸ÑÑÐ¾ÑÐ½Ð¸ÐºÐ¾Ð² Ð¸ ÑÐºÑÐ¿ÐµÑÑÐ½ÑÑ Ð¾ÑÐµÐ½Ð¾Ðº Ð±ÑÐ»Ð° ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐ°Ð½Ð° Ð¿Ð¾ÑÐ°Ð³Ð¾Ð²Ð°Ñ Ð¿ÑÐ¾ÑÐµÐ´ÑÑÐ° Ð¿ÐµÑÐµÐ¾ÑÐ½Ð°ÑÐµÐ½Ð¸Ñ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²Ð° Ð´Ð»Ñ Ð¿ÑÐµÐ´Ð¿ÑÐ¸ÑÑÐ¸Ð¹ ÐºÐ¾Ð½ÑÑÐ°ÐºÑÐ½Ð¾Ð³Ð¾ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²Ð° ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð¸ÐºÐ¸. ÐÑÐ¸ ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐµ Ð´Ð°Ð½Ð½Ð¾Ð¹ Ð¿ÑÐ¾ÑÐµÐ´ÑÑÑ Ð±ÑÐ»Ð¸ ÑÑÑÐµÐ½Ñ Ð¾ÑÐ¾Ð±ÐµÐ½Ð½Ð¾ÑÑÐ¸ Ð¿ÑÐµÐ´Ð¿ÑÐ¸ÑÑÐ¸Ð¹ ÐºÐ¾Ð½ÑÑÐ°ÐºÑÐ½Ð¾Ð³Ð¾ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²Ð° ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð¸ÐºÐ¸, ÑÑÐ¾ Ð¸ Ð¾ÑÐ»Ð¸ÑÐ°ÐµÑ ÐµÐµ Ð¾Ñ Ð¸Ð·Ð²ÐµÑÑÐ½ÑÑ Ð½Ð° Ð´Ð°Ð½Ð½ÑÐ¹ Ð¼Ð¾Ð¼ÐµÐ½Ñ. ÐÐ°Ð½Ð½Ð°Ñ Ð¿ÑÐ¾ÑÐµÐ´ÑÑÐ° Ð±ÑÐ»Ð° Ð¿ÑÐ¸Ð¼ÐµÐ½ÐµÐ½Ð° Ð½Ð° Ð¿ÑÐµÐ´Ð¿ÑÐ¸ÑÑÐ¸Ð¸ ÐÐÐ Â«ÐÐÐÐ¢ÐÐ¡ Ð³ÑÑÐ¿Â», Ð² ÑÐµÐ·ÑÐ»ÑÑÐ°ÑÐµ ÑÐµÐ³Ð¾ Ð±ÑÐ» Ð¿ÑÐ¾Ð²ÐµÐ´ÐµÐ½ Ð°Ð½Ð°Ð»Ð¸Ð· ÑÑÐ½ÐºÐ° ÐºÐ¾Ð½ÑÑÐ°ÐºÑÐ½Ð¾Ð³Ð¾ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²Ð° ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð¸ÐºÐ¸ Ð² Ð Ð¾ÑÑÐ¸Ð¸, Ð¾Ð¿ÑÐµÐ´ÐµÐ»ÐµÐ½Ñ Ð¿ÑÐ¸Ð¾ÑÐ¸ÑÐµÑÐ½ÑÐµ Ð½Ð°Ð¿ÑÐ°Ð²Ð»ÐµÐ½Ð¸Ñ ÑÐ°Ð·Ð²Ð¸ÑÐ¸Ñ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²Ð°, ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐ°Ð½Ð° Ð¼Ð¾Ð´ÐµÐ»Ñ Ð¿ÑÐ¾ÑÐµÑÑÐ° Ð¼Ð¾Ð½ÑÐ°Ð¶Ð° Ð¿ÐµÑÐ°ÑÐ½ÑÑ Ð¿Ð»Ð°Ñ, Ð¿ÑÐ¾Ð²ÐµÐ´ÐµÐ½ Ð¿Ð¾Ð¸ÑÐº, Ð°Ð½Ð°Ð»Ð¸Ð· Ð¸ Ð²ÑÐ±Ð¾Ñ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¾Ð¹ Ð¸Ð½Ð½Ð¾Ð²Ð°ÑÐ¸Ð¸ Ð´Ð»Ñ ÑÐ¼ÐµÐ½ÑÑÐµÐ½Ð¸Ñ Ð´Ð»Ð¸ÑÐµÐ»ÑÐ½Ð¾ÑÑÐ¸ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²ÐµÐ½Ð½Ð¾Ð³Ð¾ ÑÐ¸ÐºÐ»Ð°. ÐÐ¾Ð²Ð¸Ð·Ð½Ð° Ð¾ÑÐ½Ð¾Ð²Ð½ÑÑ Ð¿Ð¾Ð»Ð¾Ð¶ÐµÐ½Ð¸Ð¹ Ð´Ð¸ÑÑÐµÑÑÐ°ÑÐ¸Ð¸ Ð¿Ð¾Ð´ÑÐ²ÐµÑÐ¶Ð´ÐµÐ½Ð° Ð°Ð½Ð°Ð»Ð¸Ð·Ð¾Ð¼ Ð½Ð°ÑÑÐ½Ð¾-Ð¼ÐµÑÐ¾Ð´Ð¸ÑÐµÑÐºÐ¾Ð¹ Ð»Ð¸ÑÐµÑÐ°ÑÑÑÑ. ÐÐ¾ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ð°Ð¼ Ð´Ð¸ÑÑÐµÑÑÐ°ÑÐ¸Ð¸ Ð¿Ð¾Ð´Ð°Ð½Ð° Ð·Ð°ÑÐ²ÐºÐ° Ð½Ð° Ð¿ÑÐ±Ð»Ð¸ÐºÐ°ÑÐ¸Ñ Ð² ÑÐ±Ð¾ÑÐ½Ð¸ÐºÐµ ÑÐµÐ·ÑÐ»ÑÑÐ°ÑÐ¾Ð² 69 Ð¼ÐµÐ¶Ð´ÑÐ½Ð°ÑÐ¾Ð´Ð½Ð¾Ð¹ ÑÑÑÐ´ÐµÐ½ÑÐµÑÐºÐ¾Ð¹ Ð½Ð°ÑÑÐ½Ð¾Ð¹ ÐºÐ¾Ð½ÑÐµÑÐµÐ½ÑÐ¸Ð¸ Ð² ÐÐ£ÐÐÐµ.
description: Based on the analysis of various literary sources and expertise has been developed step-by-step procedure for the re-equipment of enterprises of electronics contract manufacturing. In the development of this procedure have been taken into account especially the enterprises of electronics contract manufacturing, which sets it apart from currently known. This procedure has been used at the enterprise LLC "Pantes Group", so hsve been done an analysis of electronics contract manufacturing market in Russia, identified priority areas for the development of production, developed a model process of PCB, searched and selected technological innovations to reduce the duration of the production cycle. The novelty of the main provisions of the thesis confirmed by the analysis of the scientific and methodological literature. On materials of thesis have been applied for publication of the results in a collection of 69 international student conference in GUAP.