title: ÐÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ðµ ÑÐµÐ¶Ð¸Ð¼Ð¾Ð² Ð½Ð°Ð½ÐµÑÐµÐ½Ð¸Ñ Ð¼ÐµÐ´Ð¸ Ð½Ð° ÑÐ°Ð·Ð»Ð¸ÑÐ½ÑÐµ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ñ Ð³Ð°Ð»ÑÐ²Ð°Ð½Ð¸ÑÐµÑÐºÐ¸Ð¼ Ð¼ÐµÑÐ¾Ð´Ð¾Ð¼
title: Ð²ÑÐ¿ÑÑÐºÐ½Ð°Ñ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð±Ð°ÐºÐ°Ð»Ð°Ð²ÑÐ°
titleType: Subtitle
title: Research of modes of copper deposition on various materials by galvanic method
Creators: name: ÐÐ¾Ð»ÑÐºÐ¾Ð²Ð°, ÐÐ»ÐµÐ½Ð°
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2024
Subjects: Ð³Ð°Ð»ÑÐ²Ð°Ð½Ð¸ÑÐµÑÐºÐ¾Ðµ Ð¼ÐµÐ´Ð½ÐµÐ½Ð¸Ðµ
Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ½ÑÐ¹ ÑÐµÐ¶Ð¸Ð¼
Ð¼ÐµÐ´Ð½Ð¾Ðµ Ð¿Ð¾ÐºÑÑÑÐ¸Ðµ
ÐºÐ°Ð¿ÐµÐ»ÑÐ½ÑÐ¹ Ð¼ÐµÑÐ¾Ð´
Ð°Ð´Ð³ÐµÐ·Ð¸Ñ
galvanic copper plating
pulse mode
copper coating
drip method
adhesion

description: Ð¦ÐµÐ»ÑÑ ÑÐ°Ð±Ð¾ÑÑ ÑÐ²Ð»ÑÐµÑÑÑ: Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ðµ Ð¿ÑÐ¾ÑÐµÑÑÐ¾Ð² Ð½Ð°Ð½ÐµÑÐµÐ½Ð¸Ñ Ð¼ÐµÐ´Ð¸ Ð½Ð° ÑÐ°Ð·Ð»Ð¸ÑÐ½ÑÐµ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ñ Ð³Ð°Ð»ÑÐ²Ð°Ð½Ð¸ÑÐµÑÐºÐ¸Ð¼ Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ½ÑÐ¼ Ð¼ÐµÑÐ¾Ð´Ð¾Ð¼. ÐÐ°Ð´Ð°ÑÐ¸, ÑÐµÑÐ°ÑÑÐ¸ÐµÑÑ Ð² ÑÐ¾Ð´Ðµ Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ñ: 1. ÐÐ½Ð°Ð»Ð¸Ð· Ð»Ð¸ÑÐµÑÐ°ÑÑÑÑ Ð¸ Ð¸Ð½ÑÐµÑÐ½ÐµÑ-ÑÐµÑÑÑÑÐ¾Ð² Ð¿Ð¾ Ð½Ð°Ð½ÐµÑÐµÐ½Ð¸Ñ Ð¼ÐµÐ´Ð¸ Ð³Ð°Ð»ÑÐ²Ð°Ð½Ð¸ÑÐµÑÐºÐ¸Ð¼ Ð¼ÐµÑÐ¾Ð´Ð¾Ð¼. ÐÑÐµÐ¸Ð¼ÑÑÐµÑÑÐ²Ð° Ð³Ð°Ð»ÑÐ²Ð°Ð½Ð¸ÑÐµÑÐºÐ¾Ð³Ð¾ ÑÐ¿Ð¾ÑÐ¾Ð±Ð° Ð½Ð°Ð½ÐµÑÐµÐ½Ð¸Ñ. ÐÐ±Ð»Ð°ÑÑÐ¸ Ð¿ÑÐ¸Ð¼ÐµÐ½ÐµÐ½Ð¸Ñ. 2. ÐÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ðµ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ Ð½Ð°Ð½ÐµÑÐµÐ½Ð¸Ñ Ð¼ÐµÐ´Ð½Ð¾Ð³Ð¾ Ð¿Ð¾ÐºÑÑÑÐ¸Ñ. 3. ÐÐ½Ð°Ð»Ð¸Ð· ÑÐµÐ·ÑÐ»ÑÑÐ°ÑÐ¾Ð² ÑÐºÑÐ¿ÐµÑÐ¸Ð¼ÐµÐ½ÑÐ¾Ð². ÐÐ±Ð¾ÑÐ½Ð¾Ð²Ð°Ð½Ð¸Ðµ ÑÐµÐ¶Ð¸Ð¼Ð¾Ð² Ð½Ð°Ð½ÐµÑÐµÐ½Ð¸Ñ Ð¼ÐµÐ´Ð½Ð¾Ð³Ð¾ Ð¿Ð¾ÐºÑÑÑÐ¸Ñ Ð´Ð»Ñ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²Ð°. ÐÐ° Ð¾ÑÐ½Ð¾Ð²Ð°Ð½Ð¸Ð¸ Ð°Ð½Ð°Ð»Ð¸Ð·Ð° ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¾Ð¹ Ð´Ð¾ÐºÑÐ¼ÐµÐ½ÑÐ°ÑÐ¸Ð¸ Ð±ÑÐ»Ð¸ Ð¿ÑÐµÐ´Ð»Ð¾Ð¶ÐµÐ½Ñ ÑÑÐ¸ ÑÐµÐ¶Ð¸Ð¼Ð° Ð¼ÐµÐ´Ð½ÐµÐ½Ð¸Ñ Ð´Ð»Ñ ÑÐ°Ð·Ð½ÑÑ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ð¾Ð². ÐÑÐ¿Ð¾Ð»Ð½ÐµÐ½Ð½ÑÐµ ÑÐºÑÐ¿ÐµÑÐ¸Ð¼ÐµÐ½ÑÑ Ð±ÑÐ»Ð¸ Ð½Ð°Ð¿ÑÐ°Ð²Ð»ÐµÐ½Ð½Ñ Ð½Ð° Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ðµ ÐºÐ°ÑÐµÑÑÐ²Ð° Ð¼ÐµÐ´Ð½Ð¾Ð³Ð¾ ÑÐ»Ð¾Ñ Ð¿ÑÐ¸ Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ½Ð¾Ð¼ ÑÐµÐ¶Ð¸Ð¼Ðµ Ð´Ð»Ñ Ð´Ð°Ð»ÑÐ½ÐµÐ¹ÑÐµÐ³Ð¾ Ð¸ÑÐ¿Ð¾Ð»ÑÐ·Ð¾Ð²Ð°Ð½Ð¸Ñ Ð¿Ð¾Ð»ÑÑÐµÐ½Ð½ÑÑ ÑÐµÐ·ÑÐ»ÑÑÐ°ÑÐ¾Ð² Ð½Ð° Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²Ðµ. ÐÐ±ÑÐ°Ð·ÑÑ Ð¸Ð· ÑÐ°Ð·Ð½ÑÑ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ð¾Ð² Ð¿Ð¾ÐºÑÑÐ²Ð°Ð»Ð¸ Ð¼ÐµÐ´ÑÑ Ð² Ð³Ð°Ð»ÑÐ²Ð°Ð½Ð¸ÑÐµÑÐºÐ¾Ð¹ Ð²Ð°Ð½Ð½Ðµ. ÐÑÐ»Ð¸ Ð¸ÑÐ¿ÑÑÐ°Ð½Ñ ÑÐ°Ð·Ð½ÑÐµ ÑÐ¾ÐºÐ¾Ð²ÑÐµ ÑÐµÐ¶Ð¸Ð¼Ñ. ÐÐ·Ð¼ÐµÑÐµÐ½Ð¸Ðµ ÑÐ¾Ð»ÑÐ¸Ð½Ñ Ð¿Ð¾ÐºÑÑÑÐ¸Ñ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´Ð¸Ð»Ð¾ÑÑ ÐºÐ°Ð¿ÐµÐ»ÑÐ½ÑÐ¼ Ð¼ÐµÑÐ¾Ð´Ð¾Ð¼. ÐÑÑÐ²Ð»ÐµÐ½ Ð½Ð°Ð¸Ð±Ð¾Ð»ÐµÐµ ÑÑÑÐµÐºÑÐ¸Ð²Ð½ÑÐ¹ ÑÐµÐ¶Ð¸Ð¼ Ð¼ÐµÐ´Ð½ÐµÐ½Ð¸Ñ Ð´Ð»Ñ Ð²ÑÐµÑ Ð¸ÑÐ¿ÑÑÑÐµÐ¼ÑÑ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ð¾Ð².
description: The purpose of the work is: the study of the processes of copper deposition on various materials by galvanic pulse method. Tasks to be solved during the study: 1. Analysis of literature and Internet resources on the application of copper by galvanic method. Advantages of galvanic method of deposition. Areas of application. 2. Study of copper plating technology. 3. Analysis of experimental results. Justification of copper plating modes for production. Based on the analysis of technical documentation three copper plating modes for different materials were proposed. The performed experiments were aimed at studying the quality of copper layer at pulse mode for further use of the obtained results in production. Samples from different materials were plated with copper in a galvanic bath. Different current modes were tested. The plating thickness was measured by drip method. The most efficient copper plating mode was found for all tested materials.