title: ÐÐ°ÑÐ¸Ð½Ð½Ð¾Ðµ Ð¾Ð±ÑÑÐµÐ½Ð¸Ðµ Ð´Ð»Ñ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¸Ð·Ð°ÑÐ¸Ð¸ Ð¾Ð´Ð½Ð¾Ð»ÑÑÐµÐ²Ð¾Ð³Ð¾ Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð³Ð¾ ÑÐ¿ÐµÐºÐ°Ð½Ð¸Ñ Ð¼ÐµÐ´Ð½ÑÑ Ð¿ÑÐ¾Ð²Ð¾Ð´ÑÑÐ¸Ñ Ð´Ð¾ÑÐ¾Ð¶ÐµÐº Ð´Ð»Ñ 3D ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð½ÑÑ ÑÑ ÐµÐ¼
title: Ð²ÑÐ¿ÑÑÐºÐ½Ð°Ñ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¼Ð°Ð³Ð¸ÑÑÑÐ°
titleType: Subtitle
title: Machine learning for parametrisation of single beam laser sintering of copper conductive traces for 3D electronic circuits
Creators: name: ÐÐ°ÑÐ¸Ð°Ñ Ð¤Ð¸Ð°Ð»Ð»Ð¾Ñ, ÐÐµÐ½Ð½Ð¸Ñ
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2020
Subjects: ÐÑÐºÑÑÑÑÐ²ÐµÐ½Ð½ÑÐ¹ Ð¸Ð½ÑÐµÐ»Ð»ÐµÐºÑ
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Ð¡Ð¿ÐµÐºÐ°Ð½Ð¸Ðµ (ÑÐµÑ Ð½.)
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Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¸ÑÐµÑÐºÐ°Ñ Ð¾Ð¿ÑÐ¸Ð¼Ð¸Ð·Ð°ÑÐ¸Ñ
conductive trace
parametric optimization

description: ÐÐ°Ð½Ð½Ð¾Ðµ Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ðµ Ð¾Ð¿Ð¸ÑÑÐ²Ð°ÐµÑ Ð¾Ð±Ð½Ð¾Ð²Ð»ÐµÐ½Ð½ÑÐµ Ð¿ÑÐ¾ÑÐµÑÑÑ Ð² ÑÐ¾Ð²ÑÐµÐ¼ÐµÐ½Ð½ÑÑ Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸ÑÑ Ð¿Ð¾ Ð¿Ð¾Ð»ÑÑÐµÐ½Ð¸Ñ ÑÐ»ÐµÐºÑÑÐ¾Ð¿ÑÐ¾Ð²Ð¾Ð´ÑÑÐ¸Ñ Ð¼ÐµÐ´Ð½ÑÑ ÑÐ»ÐµÐ´Ð¾Ð² Ð½Ð° 3D-Ð¿ÐµÑÐ°ÑÐ½ÑÑ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐºÐ°Ñ Ñ Ð¸ÑÐ¿Ð¾Ð»ÑÐ·Ð¾Ð²Ð°Ð½Ð¸ÐµÐ¼ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð³Ð¾ Ð¿ÑÑÐ¼Ð¾Ð³Ð¾ ÑÑÑÑÐºÑÑÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ Ð´Ð»Ñ Ð¿Ð¾ÑÑÑÐ¾ÐµÐ½Ð¸Ñ Ð½Ð¾ÑÐ¸ÑÐµÐ»ÐµÐ¹ ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð½ÑÑ ÑÑÐµÐ¼. Ð¡ÑÑÐ¾Ð¸ÑÐµÐ»ÑÐ½ÑÐµ Ð¿ÑÐ¾ÑÐµÑÑÑ Ð²ÐºÐ»ÑÑÐ°ÑÑ Ð½Ð°Ð½ÐµÑÐµÐ½Ð¸Ðµ Ð¿Ð¾ÐºÑÑÑÐ¸Ñ Ð½Ð° Ð¿Ð¾Ð´ Ð»Ð¾Ð¶ÐºÑ Ð¼ÐµÐ´Ñ ÑÐ¾Ð´ÐµÑÐ¶Ð°ÑÐ¸Ð¼Ð¸ ÑÐµÑÐ½Ð¸Ð»Ð°Ð¼Ð¸ Ñ Ð¿Ð¾ÑÐ»ÐµÐ´ÑÑÑÐ¸Ð¼ Ð»Ð°Ð·ÐµÑÐ½ÑÐ¼ ÑÑÑÑÐºÑÑÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð¸ÐµÐ¼ ÑÐ¾Ð½ÐºÐ¸Ñ Ð¿ÑÑÐ¼ÑÑ Ð»Ð¸Ð½Ð¸Ð¹ Ñ Ð¿Ð¾Ð¼Ð¾ÑÑÑ Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð³Ð¾ Ð¸ÑÑÐ¾ÑÐ½Ð¸ÐºÐ° Nd: YAG. ÐÑÐ½Ð¾Ð²Ð½Ð¾Ðµ Ð²Ð½Ð¸Ð¼Ð°Ð½Ð¸Ðµ Ð² ÑÑÐ¾Ð¼ Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ð¸ ÑÐ´ÐµÐ»ÑÐµÑÑÑ Ð¾Ð¿ÑÐ¸Ð¼Ð¸Ð·Ð°ÑÐ¸Ð¸ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð³Ð¾ ÑÐ¿ÐµÐºÐ°Ð½Ð¸Ñ, Ð½ÐµÐ¾Ð±ÑÐ¾Ð´Ð¸Ð¼ÑÑ Ð´Ð»Ñ Ð½Ð°ÑÑÑÐ¾Ð¹ÐºÐ¸ ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ¸ Ð¿ÑÐ¾Ð²Ð¾Ð´ÑÑÐ¸Ñ ÑÐ»ÐµÐ´Ð¾Ð² Ð´Ð»Ñ Ð¿Ð¾Ð»ÑÑÐµÐ½Ð¸Ñ Ð¿Ð¾ÐºÐ°Ð·Ð°Ð½Ð¸Ð¹ Ð½Ð¸Ð·ÐºÐ¾Ð³Ð¾ ÑÐ¾Ð¿ÑÐ¾ÑÐ¸Ð²Ð»ÐµÐ½Ð¸Ñ Ð¿ÑÐ¸ ÑÐ¾ÑÐ¾ÑÐµÐ¹ ÑÐ»ÐµÐºÑÑÐ¾Ð¿ÑÐ¾Ð²Ð¾Ð´Ð½Ð¾ÑÑÐ¸. ÐÑÐ¿Ð¾Ð»ÑÐ·ÑÑ Ð¾Ð¿ÑÐ¸ÑÐµÑÐºÐ¸Ð¹ Ð¼Ð¸ÐºÑÐ¾ÑÐºÐ¾Ð¿, Ð³ÐµÐ¾Ð¼ÐµÑÑÐ¸ÑÐµÑÐºÐ¸Ðµ ÑÐ²Ð¾Ð¹ÑÑÐ²Ð° ÑÑÑÑÐºÑÑÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð½ÑÑ Ð¼ÐµÐ´Ð½Ð¾-Ð¿ÑÐ¾Ð²Ð¾Ð´ÑÑÐ¸Ñ ÑÐ»ÐµÐ´Ð¾Ð² Ð¼Ð¾Ð³ÑÑ Ð²ÑÑÐ²Ð¸ÑÑ Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ½ÑÐµ Ð´ÐµÑÐµÐºÑÑ Ð² CTs Ñ Ð¿Ð¾ÐºÐ°Ð·Ð°Ð½Ð¸ÑÐ¼Ð¸ ÑÐ¾Ð¿ÑÐ¾ÑÐ¸Ð²Ð»ÐµÐ½Ð¸Ñ uns-ÑÐ°Ð±Ð»Ð¸ÑÑ. ÐÐµÑÑÐ°Ð±Ð¸Ð»ÑÐ½ÑÐµ Ð¿Ð¾ÐºÐ°Ð·Ð°Ð½Ð¸Ñ Ð² ÐºÐ°Ð¶Ð´Ð¾Ð¹ ÑÐ¿ÐµÑÐµÐ½Ð½Ð¾Ð¹ Ð»Ð¸Ð½Ð¸Ð¸ Ð¾Ð±ÑÑÐ»Ð¾Ð²Ð»ÐµÐ½Ñ Ð²ÑÑÐ¾ÐºÐ¸Ð¼ ÑÐ°ÑÐ¿ÑÐ¾ÑÑÑÐ°Ð½ÐµÐ½Ð¸ÐµÐ¼ Ð·Ð¾Ð½Ñ ÑÐµÐ¿Ð»Ð¾Ð²Ð¾Ð³Ð¾ Ð²Ð¾Ð·Ð´ÐµÐ¹ÑÑÐ²Ð¸Ñ (ÐÐ¢Ð) Ð½Ð° ÑÑÑÑÐºÑÑÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð½ÑÐµ Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ¸. Ð¡ Ð¿Ð¾Ð¼Ð¾ÑÑÑ Ð¼Ð°ÑÐµÐ¼Ð°ÑÐ¸ÑÐµÑÐºÐ¾Ð³Ð¾ Ð¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ Ð¿ÑÐ¾ÑÐµÑÑÐ° Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð³Ð¾ ÑÑÑÑÐºÑÑÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ, Ð¼Ð°Ð½Ð¸Ð¿ÑÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ°Ð¼Ð¸ Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð³Ð¾ Ð»ÑÑÐ° Ð¸ ÑÐ°ÑÐ°ÐºÑÐµÑÐ¸ÑÑÐ¸ÐºÐ°Ð¼Ð¸ Ð¸Ð·Ð¾Ð»ÑÑÐ¸Ð¸ Ð¿Ð¾Ð´Ð»Ð¾Ð¶ÐµÐº Ð¸ Ð¿Ð¾Ð³ÑÑÐ¶ÐµÐ½Ð¸Ñ ÑÐµÑÐ½Ð¸Ð» Ð¼Ð¾Ð¶Ð½Ð¾ Ð¼Ð¸Ð½Ð¸Ð¼Ð¸Ð·Ð¸ÑÐ¾Ð²Ð°ÑÑ ÑÐ°ÑÐ¿ÑÐ¾ÑÑÑÐ°Ð½ÐµÐ½Ð¸Ðµ ÐÐ¢Ð Ð² ÑÐµÐ½ÑÑÐµ ÐºÐ°Ð¶Ð´Ð¾Ð¹ Ð»Ð¸Ð½Ð¸Ð¸ Ð¿ÑÑÐµÐ¼ Ð½Ð°ÑÑÑÐ¾Ð¹ÐºÐ¸ ÐºÐ¾Ð½ÑÐ¸Ð³ÑÑÐ°ÑÐ¸Ð¸ Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð³Ð¾ Ð»ÑÑÐ°. ÐÐ°Ð½Ð½ÑÐµ Ð¸Ð·Ð¼ÐµÑÐµÐ½Ð¸Ð¹ ÑÐ¾Ð¿ÑÐ¾ÑÐ¸Ð²Ð»ÐµÐ½Ð¸Ñ Ð² ÑÑÑÑÐºÑÑÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð½ÑÑ Ð»Ð¸Ð½Ð¸ÑÑ Ð¿Ð¾Ð·Ð²Ð¾Ð»ÑÑÑ Ð¾Ð¿ÑÐµÐ´ÐµÐ»Ð¸ÑÑ ÑÐµÐ»ÐµÐ²ÑÑ ÑÑÐ½ÐºÑÐ¸Ñ Ð½Ð° Ð¾ÑÐ½Ð¾Ð²Ðµ Ð¼ÐµÑÐ¾Ð´Ð¾Ð»Ð¾Ð³Ð¸Ð¸ Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ¸ Ð¾ÑÐºÐ»Ð¸ÐºÐ° (RSM) Ñ Ð¼Ð¾Ð´ÐµÐ»ÑÑ Ð²ÑÐ¾ÑÐ¾Ð³Ð¾ Ð¿Ð¾ÑÑÐ´ÐºÐ°. ÐÐ¿ÑÐ¸Ð¼Ð¸Ð·Ð°ÑÐ¸Ñ Ð´Ð»Ñ Ð½Ð°ÑÐ¾Ð¶Ð´ÐµÐ½Ð¸Ñ Ð½Ð¸Ð·ÐºÐ¾Ð³Ð¾ Ð·Ð½Ð°ÑÐµÐ½Ð¸Ñ ÑÐ»ÐµÐºÑÑÐ¸ÑÐµÑÐºÐ¾Ð³Ð¾ ÑÐ¾Ð¿ÑÐ¾ÑÐ¸Ð²Ð»ÐµÐ½Ð¸Ñ Ð¼Ð¾Ð¶Ð½Ð¾ Ð¸ÑÐºÐ°ÑÑ Ñ Ð¿Ð¾Ð¼Ð¾ÑÑÑ ÑÐµÐ°Ð»Ð¸Ð·Ð°ÑÐ¸Ð¸ Ð°Ð»Ð³Ð¾ÑÐ¸ÑÐ¼Ð¾Ð² Ð¿Ð¾Ð¸ÑÐºÐ¾Ð²Ð¾Ð³Ð¾ Ð¼Ð°ÑÐ¸Ð½Ð½Ð¾Ð³Ð¾ Ð¾Ð±ÑÑÐµÐ½Ð¸Ñ (ML), ÑÐ°ÐºÐ¸Ñ ÐºÐ°Ðº Ð³ÐµÐ½ÐµÑÐ¸ÑÐµÑÐºÐ¸Ð¹ Ð°Ð»Ð³Ð¾ÑÐ¸ÑÐ¼ (GE). Ð Ð´Ð°Ð½Ð½Ð¾Ð¹ ÑÐ°Ð±Ð¾ÑÐµ Ð¿ÑÐµÐ´Ð»Ð°Ð³Ð°ÐµÑÑÑ Ð·Ð°Ð²ÐµÑÑÐµÐ½Ð½ÑÐ¹ ÑÐºÑÐ¿ÐµÑÐ¸Ð¼ÐµÐ½ÑÐ°Ð»ÑÐ½ÑÐ¹ ÑÑÐ°Ð¿ ÑÐ±Ð¾ÑÐ° Ð´Ð°Ð½Ð½ÑÑ Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð³Ð¾ ÑÑÑÑÐºÑÑÑÐ¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ Ð¸ ÑÐµÐ¾ÑÐµÑÐ¸ÑÐµÑÐºÐ¸Ð¹ Ð¿Ð¾Ð´ÑÐ¾Ð´ Ðº Ð¼Ð¾Ð´ÐµÐ»Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ ÑÐ°ÐºÐ¾Ð³Ð¾ Ð¿ÑÐ¾ÑÐµÑÑÐ°, Ð¾ÑÐ½Ð¾Ð²Ð°Ð½Ð½ÑÐ¹ Ð½Ð° Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸ÑÑ Ð¿ÑÐ¸Ð¼ÐµÐ½ÐµÐ½Ð¸Ñ Ð»Ð°Ð·ÐµÑÐ½Ð¾Ð¹ Ð¾Ð±ÑÐ°Ð±Ð¾ÑÐºÐ¸ Ñ Ð¿Ð¾Ð¼Ð¾ÑÑÑ Nd: YAG Ð»Ð°Ð·ÐµÑÐ¾Ð².
description: This investigation describes updated processes in current research for the production of electrically conductive copper traces on 3D-printed substrates byusing laser Direct Structuring technology for the construction of electronic circuitcarriers. The building processes include coating a substrate with a copper-containingink, followed by laser structuring of thin straight lines with an Nd : YAG lasersource. The focus of this research is on the optimization of the laser sintering parameters needed to be configured to develop conductive traces in for obtaininglow resistance readings for good electrical conductivity. By using an optical microscope, the geometric properties of the structured copper-conductive traces can reveal surface imperfections in CTs with unstableresistance readings. Unstable readings in each sintered line are caused by a highpropagation of the Heat Affected Zone (HAZ) on the structured surfaces. With the use of mathematical modelling for the laser structuring process, manipulating the laser beamâs parameters and the substratesâ insulating and ink dipping characteristics, it is possible to minimize the propagation of the HAZ in the center of each line by tuning the laser beamâs configuration. Data for resistancemeasurements in structured lines allow to determine an objective function based onthe Response Surface Methodology (RSM) with the Second-Order Model. Optimization for finding alow electrical resistance value can be searchedwith the implementation of search Machine Learning (ML) algorithms such as the Genetic Algorithm (GE). This work proposes a completed experimental phase for laser structuring data gathering and a theoretical approach for modelling such process based on research for laser machining applications with Nd: YAG lasers.