title: ÐÐ¾Ð»ÑÑÐµÐ½Ð¸Ðµ Ð¸ Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ðµ ÐºÐ¾Ð¼Ð¿Ð¾Ð·Ð¸ÑÐ¸Ð¾Ð½Ð½ÑÑ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ð¾Ð² Ð½Ð° Ð¾ÑÐ½Ð¾Ð²Ðµ Ð¼ÐµÐ´Ð¸ Ñ Ð½Ð¸Ð·ÐºÐ¸Ð¼ ÐºÐ¾ÑÑÑÐ¸ÑÐ¸ÐµÐ½ÑÐ¾Ð¼ ÑÐµÑÐ¼Ð¸ÑÐµÑÐºÐ¾Ð³Ð¾ ÑÐ°ÑÑÐ¸ÑÐµÐ½Ð¸Ñ
title: Ð²ÑÐ¿ÑÑÐºÐ½Ð°Ñ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¼Ð°Ð³Ð¸ÑÑÑÐ°
titleType: Subtitle
title: Preparation and research of composite materials based on copper with a low coefficient of thermal expansion
Creators: name: ÐÐ»ÐµÐ±Ð¾Ð²Ð°, ÐÐºÐ°ÑÐµÑÐ¸Ð½Ð°
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2023
Subjects: Ð½Ð¸Ð·ÐºÐ¾Ðµ ÑÐµÑÐ¼Ð¸ÑÐµÑÐºÐ¾Ðµ ÑÐ°ÑÑÐ¸ÑÐµÐ½Ð¸Ðµ
ÐºÐ¾Ð¼Ð¿Ð¾Ð·Ð¸ÑÐ¸Ð¾Ð½Ð½ÑÐµ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ñ
Ð¼ÐµÐ´Ñ
Ð³ÐµÐºÑÐ°Ð±Ð¾ÑÐ¸Ð´ ÑÐ°Ð¼Ð°ÑÐ¸Ñ
ÑÐµÑÐ¼Ð¸ÑÐµÑÐºÐ¸Ð¹ ÐºÐ¾ÑÑÑÐ¸ÑÐ¸ÐµÐ½Ñ Ð»Ð¸Ð½ÐµÐ¹Ð½Ð¾Ð³Ð¾ ÑÐ°ÑÑÐ¸ÑÐµÐ½Ð¸Ñ
ÑÐµÐ¿Ð»Ð¾Ð¿ÑÐ¾Ð²Ð¾Ð´Ð½Ð¾ÑÑÑ
low thermal expansion
composite materials
copper
samarium hexaboride
linear thermal expansion coefficient
thermal conductivity

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description: The literature analysis was conducted, and the relevant research directions were identified. The matrix, filler, and technology for obtaining the composite material were selected. Possible areas of application of the investigated material were considered, and possible methods for controlling its properties were analyzed. Seven test samples of composite material with different compositions, shapes, and filler particle distributions were obtained. Granulometric, microstructural, and X-ray structural analyses of the materials were carried out, and the hardness, density, thermal conductivity, and linear thermal expansion coefficient of the obtained composite materials were measured. The influence of the concentration, shape, and distribution of filler particles on the hardness, density, and linear thermal expansion coefficient of the composite material was investigated.