title: ÐÐ¾Ð¸ÑÐº ÑÐ°ÑÐ¸Ð¾Ð½Ð°Ð»ÑÐ½ÑÑ ÑÐµÑ Ð½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¸Ñ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² ÑÐ»ÐµÐºÑÑÐ¾ÑÑÐ¾Ð·Ð¸Ð¾Ð½Ð½Ð¾Ð¹ Ð¾Ð±ÑÐ°Ð±Ð¾ÑÐºÐ¸ ÐºÐµÑÐ°Ð¼Ð¸ÐºÐ¸ ÑÐ¸ÑÑÐµÐ¼Ñ SiC-TiB2-TiC, Ð¿Ð¾Ð»ÑÑÐµÐ½Ð½Ð¾Ð¹ Ð¼ÐµÑÐ¾Ð´Ð¾Ð¼ Ð¸ÑÐºÑÐ¾Ð²Ð¾Ð³Ð¾ Ð¿Ð»Ð°Ð·Ð¼ÐµÐ½Ð½Ð¾Ð³Ð¾ ÑÐ¿ÐµÐºÐ°Ð½Ð¸Ñ
title: Optimization of WEDM parameters for ceramics of SiC-TiB2-TiC system obtained by spark plasma sintering
Creators: name: ÐÑÐ¸Ð³Ð¾ÑÑÐµÐ², Ð¡ÐµÑÐ³ÐµÐ¹
name: ÐÐ¾Ð»Ð¾ÑÐ¾Ð²Ð°, ÐÐ°ÑÐ¸Ð½Ð°
name: ÐÐµÐ»ÐµÑÐºÐ¸Ð½, Ð¯ÑÐ¾ÑÐ»Ð°Ð²
name: Ð¡Ð¼Ð¸ÑÐ½Ð¾Ð², ÐÐ½ÑÐ¾Ð½
name: Ð¡Ð¾Ð»Ð¸Ñ ÐÐ¸Ð½Ð°ÑÐ³Ð¾ÑÐµ, ÐÐµÑÑÐ¾Ñ
name: "Ð¡Ð¾Ð²ÑÐµÐ¼ÐµÐ½Ð½Ð¾Ðµ Ð¼Ð°ÑÐ¸Ð½Ð¾ÑÑÑÐ¾ÐµÐ½Ð¸Ðµ: Ð½Ð°ÑÐºÐ° Ð¸ Ð¾Ð±ÑÐ°Ð·Ð¾Ð²Ð°Ð½Ð¸Ðµ", Ð¼ÐµÐ¶Ð´ÑÐ½Ð°ÑÐ¾Ð´Ð½Ð°Ñ Ð½Ð°ÑÑÐ½Ð°Ñ ÐºÐ¾Ð½ÑÐµÑÐµÐ½ÑÐ¸Ñ (13; 2024; Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³)
Publisher: name: ÐÐÐÐÐ¢ÐÐ¥-ÐÐ ÐÐ¡Ð¡
Year: 2024
Subjects: Ð¡Ð¿ÐµÐºÐ°Ð½Ð¸Ðµ (ÑÐµÑ Ð½.)
ÐÐµÑÐ°Ð¼Ð¸ÑÐµÑÐºÐ¸Ðµ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ñ Ð¸ Ð¸Ð·Ð´ÐµÐ»Ð¸Ñ
ÑÐ»ÐµÐºÑÑÐ¾ÑÑÐ¾Ð·Ð¸Ð¾Ð½Ð½Ð°Ñ Ð¾Ð±ÑÐ°Ð±Ð¾ÑÐºÐ°
ÑÐ¾Ð»ÑÐ¸Ð½Ð° Ð±ÐµÐ»Ð¾Ð³Ð¾ ÑÐ»Ð¾Ñ
ÑÐµÑÐ¾Ñ Ð¾Ð²Ð°ÑÐ¾ÑÑÑ Ð¿Ð¾Ð²ÐµÑÑ Ð½Ð¾ÑÑÐ¸
ÑÐµÑÑÐ¹ ÑÐµÐ»ÑÑÐ¸Ð¾Ð½Ð½ÑÐ¹ Ð°Ð½Ð°Ð»Ð¸Ð·
electroerosion treatment
recast layer thickness
surface roughness
Grey relational analysis

description: ÐÑÐ»Ð¾ Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¾ Ð²Ð»Ð¸ÑÐ½Ð¸Ðµ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² ÑÐ»ÐµÐºÑÑÐ¾ÑÑÐ¾Ð·Ð¸Ð¾Ð½Ð½Ð¾Ð¹ Ð¾Ð±ÑÐ°Ð±Ð¾ÑÐºÐ¸ (Ð½Ð°Ð¿ÑÑÐ¶ÐµÐ½Ð¸Ñ Ð² Ð¼ÐµÐ¶ÑÐ»ÐµÐºÑÑÐ¾Ð´Ð½Ð¾Ð¼ Ð·Ð°Ð·Ð¾ÑÐµ, Ð´Ð»Ð¸ÑÐµÐ»ÑÐ½Ð¾ÑÑÐ¸ Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ°, ÑÐ°ÑÑÐ¾ÑÑ Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ¾Ð² Ð¸ ÑÐºÐ¾ÑÐ¾ÑÑÐ¸ Ð¿ÐµÑÐµÐ¼Ð¾ÑÐºÐ¸ Ð¿ÑÐ¾Ð²Ð¾Ð»Ð¾ÐºÐ¸) Ð½Ð° ÑÐ¾Ð»ÑÐ¸Ð½Ñ Ð±ÐµÐ»Ð¾Ð³Ð¾ ÑÐ»Ð¾Ñ Ð¸ ÑÐµÑÐ¾ÑÐ¾Ð²Ð°ÑÐ¾ÑÑÑ Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ¸ ÐºÐµÑÐ°Ð¼Ð¸ÑÐµÑÐºÐ¾Ð³Ð¾ ÐºÐ¾Ð¼Ð¿Ð¾Ð·Ð¸ÑÐ° SiC-TiB2-TiC, Ð¿Ð¾Ð»ÑÑÐµÐ½Ð½Ð¾Ð³Ð¾ Ð¼ÐµÑÐ¾Ð´Ð¾Ð¼ Ð¸ÑÐºÑÐ¾Ð²Ð¾Ð³Ð¾ Ð¿Ð»Ð°Ð·Ð¼ÐµÐ½Ð½Ð¾Ð³Ð¾ ÑÐ¿ÐµÐºÐ°Ð½Ð¸Ñ. ÐÐ»Ñ Ð¾Ð¿ÑÐ¸Ð¼Ð¸Ð·Ð°ÑÐ¸Ð¸ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² ÑÐ»ÐµÐºÑÑÐ¾ÑÑÐ¾Ð·Ð¸Ð¾Ð½Ð½Ð¾Ð¹ Ð¾Ð±ÑÐ°Ð±Ð¾ÑÐºÐ¸ Ð±ÑÐ»Ð° Ð¿Ð¾ÑÑÑÐ¾ÐµÐ½Ð° Ð¾ÑÑÐ¾Ð³Ð¾Ð½Ð°Ð»ÑÐ½Ð°Ñ Ð¼Ð°ÑÑÐ¸ÑÐ° Ð¢Ð°Ð³ÑÑÐ¸ (L9), Ð° ÑÐ°ÐºÐ¶Ðµ Ð¿ÑÐ¾Ð²ÐµÐ´ÐµÐ½ ÑÐµÑÑÐ¹ ÑÐµÐ»ÑÑÐ¸Ð¾Ð½Ð½ÑÐ¹, ÐºÐ¾ÑÐ¾ÑÑÐ¹ Ð´Ð°Ð» Ð²Ð¾Ð·Ð¼Ð¾Ð¶Ð½Ð¾ÑÑÑ Ð²ÑÑÐ²Ð¸ÑÑ Ð¼Ð¸Ð½Ð¸Ð¼Ð°Ð»ÑÐ½ÑÐµ Ð·Ð½Ð°ÑÐµÐ½Ð¸Ñ Ð±ÐµÐ»Ð¾Ð³Ð¾ ÑÐ»Ð¾Ñ Ð¸ ÑÐµÑÐ¾ÑÐ¾Ð²Ð°ÑÐ¾ÑÑÐ¸ Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ¸. ÐÑÐ»Ð¾ Ð·Ð°Ð¼ÐµÑÐµÐ½Ð¾, ÑÑÐ¾ Ð´Ð»Ñ Ð±ÐµÐ»Ð¾Ð³Ð¾ ÑÐ»Ð¾Ñ Ð½Ð°Ð¸Ð±Ð¾Ð»ÐµÐµ Ð·Ð½Ð°ÑÐ¸Ð¼ÑÐ¼ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¸Ð¼ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð¼ ÑÐ²Ð»ÑÐµÑÑÑ Ð²ÑÐµÐ¼Ñ Ð²ÐºÐ»ÑÑÐµÐ½Ð¸Ñ Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ°, Ð·Ð° ÐºÐ¾ÑÐ¾ÑÑÐ¼ ÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð»Ð¾ Ð½Ð°Ð¿ÑÑÐ¶ÐµÐ½Ð¸Ðµ Ð¸ÑÐºÑÐ¾Ð²Ð¾Ð³Ð¾ Ð¿ÑÐ¾Ð¼ÐµÐ¶ÑÑÐºÐ°. Ð¡ Ð´ÑÑÐ³Ð¾Ð¹ ÑÑÐ¾ÑÐ¾Ð½Ñ, ÑÐ°ÑÑÐ¾ÑÐ° Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ¾Ð² Ð¸ ÑÐºÐ¾ÑÐ¾ÑÑÑ Ð¿ÐµÑÐµÐ¼Ð¾ÑÐºÐ¸ Ð¿ÑÐ¾Ð²Ð¾Ð»Ð¾ÐºÐ¸ Ð½Ðµ Ð¸Ð¼ÐµÐ»Ð¸ ÑÑÑÐµÑÑÐ²ÐµÐ½Ð½Ð¾Ð³Ð¾ Ð·Ð½Ð°ÑÐµÐ½Ð¸Ñ. ÐÐ¾Ð»ÐµÐµ ÑÐ¾Ð³Ð¾, ÑÐ°ÑÑÐ¾ÑÐ° Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ¾Ð² Ð±ÑÐ»Ð° Ð½Ð°Ð¸Ð±Ð¾Ð»ÐµÐµ Ð²Ð°Ð¶Ð½ÑÐ¼ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¸Ð¼ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð¼, Ð·Ð° ÐºÐ¾ÑÐ¾ÑÐ¾Ð¹ ÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð»Ð¸ Ð´Ð»Ð¸ÑÐµÐ»ÑÐ½Ð¾ÑÑÑ Ð¸Ð¼Ð¿ÑÐ»ÑÑÐ° Ð¸ Ð½Ð°Ð¿ÑÑÐ¶ÐµÐ½Ð¸Ðµ Ð² Ð¼ÐµÐ¶ÑÐ»ÐµÐºÑÑÐ¾Ð´Ð½Ð¾Ð¼ Ð·Ð°Ð·Ð¾ÑÐµ, Ð² ÑÐ¾ Ð²ÑÐµÐ¼Ñ ÐºÐ°Ðº ÑÐºÐ¾ÑÐ¾ÑÑÑ Ð¿ÐµÑÐµÐ¼Ð¾ÑÐºÐ¸ Ð¿ÑÐ¾Ð²Ð¾Ð»Ð¾ÐºÐ¸ Ð¾ÐºÐ°Ð·ÑÐ²Ð°Ð»Ð° Ð½ÐµÐ·Ð½Ð°ÑÐ¸ÑÐµÐ»ÑÐ½Ð¾Ðµ Ð²Ð»Ð¸ÑÐ½Ð¸Ðµ Ð½Ð° ÑÐµÑÐ¾ÑÐ¾Ð²Ð°ÑÐ¾ÑÑÑ Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ¸. ÐÑÐ»Ð¸ ÑÑÑÐ°Ð½Ð¾Ð²Ð»ÐµÐ½Ñ Ð¾Ð¿ÑÐ¸Ð¼Ð°Ð»ÑÐ½ÑÐµ Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÑ Ð¿ÑÐ¾ÑÐµÑÑÐ°: U= 48 Ð, Ton = 1,0 Ð¼ÐºÑ, f = 10 ÐºÐÑ, q = 8 Ð¼/Ð¼Ð¸Ð½, Ð¿ÑÐ¸ ÐºÐ¾ÑÐ¾ÑÑÑ Ð¿Ð¾Ð»ÑÑÐµÐ½Ñ Ð·Ð½Ð°ÑÐµÐ½Ð¸Ñ Ð±ÐµÐ»Ð¾Ð³Ð¾ ÑÐ»Ð¾Ñ Ð¸ ÑÐµÑÐ¾ÑÐ¾Ð²Ð°ÑÐ¾ÑÑÐ¸ Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ¸ ÑÐ°Ð²Ð½ÑÐµ 3,16 Ð¼ÐºÐ¼ Ð¸ 0,847 Ð¼ÐºÐ¼, ÑÐ¾Ð¾ÑÐ²ÐµÑÑÑÐ²ÐµÐ½Ð½Ð¾. Ð­ÐºÑÐ¿ÐµÑÐ¸Ð¼ÐµÐ½Ñ Ð²ÑÑÐ²Ð¸Ð» ÑÐ½Ð¸Ð¶ÐµÐ½Ð¸Ðµ Ð±ÐµÐ»Ð¾Ð³Ð¾ ÑÐ»Ð¾Ñ Ð¸ ÑÐµÑÐ¾ÑÐ¾Ð²Ð°ÑÐ¾ÑÑÐ¸ Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ¸ Ð½Ð° 43,67% Ð¸ 7,12%, ÑÐ¾Ð¾ÑÐ²ÐµÑÑÑÐ²ÐµÐ½Ð½Ð¾, Ð¿Ð¾ ÑÑÐ°Ð²Ð½ÐµÐ½Ð¸Ñ Ñ Ð¸ÑÑÐ¾Ð´Ð½ÑÐ¼Ð¸ ÑÑÐ»Ð¾Ð²Ð¸ÑÐ¼Ð¸ Ð¾Ð±ÑÐ°Ð±Ð¾ÑÐºÐ¸.
description: The influence of WEDM parameters (Spark gap voltage, Pulse-on time, Spark frequency, and Wire speed) on the recast layer thickness and surface roughness of Spark Plasma Sintered SiC-TiB2-TiC ceramic composite was investigated. For this, an orthogonal L9 Taguchi design was used, and the Grey relational analysis was carried out to multi-response WEDM parameters optimization in order to determine the minimum recast layer thickness and surface roughness. It was noticed that for recast layer thickness the Pulse-on time was observed as the most significant process parameter, followed by Spark gap voltage. On the other hand, Spark frequency and Wire speed had no significance for recast layer thickness. Moreover, Spark frequency was observed as the most significant process parameter, followed by Pulse-on time and Spark gap voltage, while Wire speed had a negligible effect for surface roughness. It was found, that at optimum process parameters (U= 48V; Ton = 1.0 Î¼s; f = 10 kHz; q = 8 m/min) were obtained a recast layer thickness of 3.16 Î¼m and surface roughness of Ra = 0.847 Î¼m. The confirmation test showed a decrease in recast layer thickness and surface roughness by 43.67% and 7.12%, respectively, in comparison to the initial machining condition.