title: ÐÐ½ÐµÐ´ÑÐµÐ½Ð¸Ðµ ÑÐµÑ Ð½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð²
title: Ð²ÑÐ¿ÑÑÐºÐ½Ð°Ñ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð±Ð°ÐºÐ°Ð»Ð°Ð²ÑÐ°
titleType: Subtitle
title: Implementation of selective soldering technology of lead-out components
Creators: name: Ð Ð¾Ð¼Ð°Ð½Ð¾Ð²Ð°, ÐÐ¸ÐºÑÐ¾ÑÐ¸Ñ
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2025
Subjects: ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð°Ñ Ð¿Ð°Ð¹ÐºÐ°
Ð²ÑÐ²Ð¾Ð´Ð½ÑÐµ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÑ
Ð¿ÐµÑÐ°ÑÐ½Ð°Ñ Ð¿Ð»Ð°ÑÐ°
ÑÑÐµÐ´ÑÑÐ²Ð° Ð°Ð²ÑÐ¾Ð¼Ð°ÑÐ¸Ð·Ð°ÑÐ¸Ð¸
selective soldering
lead components
printed board
automation tools

description: ÐÐ°Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¿Ð¾ÑÐ²ÑÑÐµÐ½Ð° ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐµ Ð¿ÑÐ¾ÐµÐºÑÐ° Ð²Ð½ÐµÐ´ÑÐµÐ½Ð¸Ñ ÑÐ¸ÑÑÐµÐ¼Ñ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ° Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð² Ð½Ð° Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ²ÐµÐ½Ð½ÑÑ Ð»Ð¸Ð½Ð¸Ñ. ÐÐ°Ð´Ð°ÑÐ¸, ÐºÐ¾ÑÐ¾ÑÑÐµ ÑÐµÑÐ°Ð»Ð¸ÑÑ Ð² ÑÐ¾Ð´Ðµ Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ñ: â Ð²ÑÐ¿Ð¾Ð»Ð½Ð¸ÑÑ Ð¾Ð±Ð·Ð¾Ñ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð²; â Ð¿ÑÐµÐ´Ð»Ð¾Ð¶Ð¸ÑÑ Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ð½Ð¾Ðµ Ð¾Ð±ÐµÑÐ¿ÐµÑÐµÐ½Ð¸Ðµ Ð´Ð»Ñ Ð°Ð²ÑÐ¾Ð¼Ð°ÑÐ¸Ð·Ð°ÑÐ¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸; â ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐ°ÑÑ Ð¿ÑÐ¾ÐµÐºÑ Ð²Ð½ÐµÐ´ÑÐµÐ½Ð¸Ñ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð² Ð² ÐÐÐ Â«Ð-ÐÐ¾Ð½ÑÑÐ°ÐºÑÂ»; â Ð¿ÑÐ¾Ð²ÐµÑÑÐ¸ Ð°Ð½Ð°Ð»Ð¸Ð· Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² Ð¸ ÑÑÑÐµÐºÑÐ¸Ð²Ð½Ð¾ÑÑÐ¸ Ð²Ð½ÐµÐ´ÑÐµÐ½Ð¸Ñ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð² Ð² ÐÐÐ Â«Ð-ÐÐ¾Ð½ÑÑÐ°ÐºÑÂ». â Ð²Ð½ÐµÐ´ÑÐ¸ÑÑ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ñ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð² Ð² ÐÐÐ Â«Ð-ÐÐ¾Ð½ÑÑÐ°ÐºÑÂ». Ð Ð°Ð±Ð¾ÑÐ° Ð¿ÑÐ¾Ð²ÐµÐ´ÐµÐ½Ð° Ð½Ð° Ð±Ð°Ð·Ðµ ÐÐÐ Â«Ð-ÐÐ¾Ð½ÑÑÐ°ÐºÑÂ», Ð³Ð´Ðµ ÑÐ¾Ð±Ð¸ÑÐ°Ð»Ð°ÑÑ Ð·Ð½Ð°ÑÐ¸ÑÐµÐ»ÑÐ½Ð°Ñ ÑÐ°ÑÑÑ ÑÐ°ÐºÑÐ¸ÑÐµÑÐºÐ¾Ð³Ð¾ Ð¼Ð°ÑÐµÑÐ¸Ð°Ð»Ð°: Ð¾Ð±Ð·Ð¾Ñ ÑÑÐ°Ð¿Ð¾Ð² Ð¼Ð¾Ð½ÑÐ°Ð¶Ð° Ð¿ÐµÑÐ°ÑÐ½Ð¾Ð¹ Ð¿Ð»Ð°ÑÑ Ð¿Ð¾ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸, Ð¾ÑÐ½Ð°ÑÐµÐ½Ð¸Ðµ ÑÐµÑÐ¾Ð² Ð¼Ð¾Ð½ÑÐ°Ð¶Ð° Ð¿ÐµÑÐ°ÑÐ½ÑÑ Ð¿Ð»Ð°Ñ, Ð¿ÑÐ¾ÑÐµÑÑ Ð²ÑÐ²Ð¾Ð´Ð½Ð¾Ð³Ð¾ Ð¼Ð¾Ð½ÑÐ°Ð¶Ð° Ð¿ÐµÑÐ°ÑÐ½ÑÑ Ð¿Ð»Ð°Ñ. Ð ÑÐ¾Ð´Ðµ Ð²ÑÐ¿Ð¾Ð»Ð½ÐµÐ½Ð¸Ñ ÑÐ°Ð±Ð¾ÑÑ Ð¿ÑÐµÐ´Ð»Ð¾Ð¶ÐµÐ½Ð¾ Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ð½Ð¾Ðµ Ð¾Ð±ÐµÑÐ¿ÐµÑÐµÐ½Ð¸Ðµ Ð´Ð»Ñ Ð°Ð²ÑÐ¾Ð¼Ð°ÑÐ¸Ð·Ð°ÑÐ¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸, Ð¸Ð½ÑÐµÐ³ÑÐ¸ÑÐ¾Ð²Ð°Ð½Ñ Ð¿ÑÐ¾ÑÐµÑÑÑ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ñ ÑÐ¸ÑÑÐµÐ¼Ð°Ð¼Ð¸ Ð°Ð²ÑÐ¾Ð¼Ð°ÑÐ¸Ð·Ð°ÑÐ¸Ð¸ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´ÑÑÐ², ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐ°Ð½ Ð¿ÑÐ¾ÐµÐºÑ Ð²Ð½ÐµÐ´ÑÐµÐ½Ð¸Ñ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð² Ð² ÐÐÐ Â«Ð-ÐÐ¾Ð½ÑÑÐ°ÐºÑÂ», Ð¿ÑÐ¾Ð²ÐµÐ´ÑÐ½ Ð°Ð½Ð°Ð»Ð¸Ð· Ð¿Ð°ÑÐ°Ð¼ÐµÑÑÐ¾Ð² Ð¸ ÑÑÑÐµÐºÑÐ¸Ð²Ð½Ð¾ÑÑÐ¸ Ð²Ð½ÐµÐ´ÑÐµÐ½Ð¸Ñ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð² Ð² ÐÐÐ Â«Ð-ÐÐ¾Ð½ÑÑÐ°ÐºÑÂ», Ð²Ð½ÐµÐ´ÑÑÐ½ Ð¿ÑÐ¾ÐµÐºÑ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ ÑÐµÐ»ÐµÐºÑÐ¸Ð²Ð½Ð¾Ð¹ Ð¿Ð°Ð¹ÐºÐ¸ Ð²ÑÐ²Ð¾Ð´Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð² Ð² ÐÐÐ Â«Ð-ÐÐ¾Ð½ÑÑÐ°ÐºÑÂ».
description: This work is devoted to the development of a project for the implementation of a system of selective soldering of lead-out components on a production line. The tasks that were solved during the study: â Ð¾verview of selective soldering technology for through-hole components; â propose software for automating selective soldering; â develop a project for the implementation of selective soldering technology for through-hole components at LLC "A-Contract"; â conduct an analysis of the parameters and efficiency of implementing selective soldering technology for through-hole components at LLC "A-Contract"; â implement selective soldering technology for through-hole components at LLC "A-Contract." The work was carried out at A-Contract LLC, where a significant part of the factual material was collected: an overview of the stages of printed circuit board assembly using selective soldering technology, equipment of printed circuit board assembly shops, the process of leaded mounting of printed circuit boards. In the course of the work, software for the automation of selective soldering was proposed, selective soldering processes were integrated with production automation systems, a project for the implementation of selective soldering technology for leaded components in A-Contract LLC was developed, an analysis of the parameters and efficiency of the implementation of selective soldering technology for leaded components in A-Contract LLC was conducted, and a project for the technology of selective soldering of leaded components was implemented in A-Contract LLC.