Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems
Creators: name: Wang, Yixiao
name: Akin, Meriem
name: Jogschies, Lisa
name: Overmeyer, Ludger
name: Rissing, Lutz
Publisher: name: Bellingham, Wash. : SPIE
Year: 2015
Subjects: subject: bonding
subject: flexible circuits
subject: integration
subject: interconnections
subject: optode
subject: optoelectronic components
subject: transparent polymer substrate
subject: UV-curing adhesives
subject: Adhesives
subject: Bonding
subject: Curing
subject: Environmental testing
subject: Flexible electronics
subject: Glass transition
subject: Integrated circuit interconnects
subject: Integrated circuits
subject: Integrated optoelectronics
subject: Integration
subject: Photonic integration technology
subject: Plastic bottles
subject: Polyethylene terephthalates
subject: Polymers
subject: Polymethyl methacrylates
subject: Thickness measurement
subject: Tin oxides
subject: Flexible circuit
subject: Optoelectronic components
subject: Transparent polymer
subject: UV-curing
subject: Substrates
subject: Konferenzschrift
subject: Dewey Decimal Classification::500 | Naturwissenschaften::530 | Physik

description: In the field of modern information technology, optoelectronics are being widely used, and play an increasingly important role. Meanwhile, the demand for more flexible circuit carriers is rapidly growing, since flexibility facilitates the realization of diverse functions and applications. As a potential candidate, transparent polymer substrates with a thickness of about a hundred micrometers by virtue of their low cost and sufficient flexibility are getting more attention. Thus, accomplishing an integration of optoelectronic components into polymer based flexible circuit systems increasingly is becoming an attractive research topic, which is of great significance for future information transmission and processing. We are committed to developing a new microchip bonding process to realize it. Taking into account the fact that most economical transparent polymer substrates can only be processed with restricted thermal loading, we designed a so-called optode instead of a widely adopted thermode. We employ UV-curing adhesives as bonding materials; accordingly, the optode is equipped with a UV irradiation source. An investigation of commercial optoelectronic components is conducted, in which their dimensions and structures are studied. While selecting appropriate transparent polymer substrates, we take their characteristics such as UV transmission degree, glass transition temperature, etc. as key criterions, and choose polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA) as carrier materials. Besides bonding achieved through the use of adhesives cured by the optode, underfill is accordingly employed to enhance the reliability of the integration. We deposit electrical interconnects onto the polymeric substrate to be able to bring the optoelectronic components into electrical operation. In order to enlarge the optical coupling zone from component to substrate within the proximity of the adhesive or underfill, we employ transparent interconnects made of indium-tin-oxide. We present the results of the performance tests, including the contact resistances, mechanical tests and environmental tests. © 2015 SPIE.