title: ÐÐ¾Ð²ÑÑÐµÐ½Ð¸Ðµ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´Ð¸ÑÐµÐ»ÑÐ½Ð¾ÑÑÐ¸ ÑÐµÑ Ð½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¾Ð³Ð¾ Ð¿ÑÐ¾ÑÐµÑÑÐ° Ð»ÑÐ¶ÐµÐ½Ð¸Ñ ÐºÐ¾Ð½Ð´ÐµÐ½ÑÐ°ÑÐ¾ÑÐ¾Ð² Ð·Ð° ÑÑÐµÑ ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ¸ Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ð½Ð¾-Ð°Ð¿Ð¿Ð°ÑÐ°ÑÐ½Ð¾Ð³Ð¾ ÐºÐ¾Ð¼Ð¿Ð»ÐµÐºÑÐ°
title: Ð²ÑÐ¿ÑÑÐºÐ½Ð°Ñ ÐºÐ²Ð°Ð»Ð¸ÑÐ¸ÐºÐ°ÑÐ¸Ð¾Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¼Ð°Ð³Ð¸ÑÑÑÐ°
titleType: Subtitle
title: Increasing the productivity of the technological process of tinning capacitors through the development of a hardware and software complex
Creators: name: ÐÐ¾ÑÐ´ÐµÐµÐ²Ð°, ÐÑÐ¸Ð½Ð°
Publisher: name: Ð¡Ð°Ð½ÐºÑ-ÐÐµÑÐµÑÐ±ÑÑÐ³ÑÐºÐ¸Ð¹ Ð¿Ð¾Ð»Ð¸ÑÐµÑÐ½Ð¸ÑÐµÑÐºÐ¸Ð¹ ÑÐ½Ð¸Ð²ÐµÑÑÐ¸ÑÐµÑ ÐÐµÑÑÐ° ÐÐµÐ»Ð¸ÐºÐ¾Ð³Ð¾
Year: 2024
Subjects: ÐÑÐ¶ÐµÐ½Ð¸Ðµ
ÐÐ¾Ð½Ð´ÐµÐ½ÑÐ°ÑÐ¾ÑÑ
ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð¸ÐºÐ°
ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð½ÑÐµ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÑ
Ð¿Ð°ÑÐ½ÑÐµ ÑÐ¾ÐµÐ´Ð¸Ð½ÐµÐ½Ð¸Ñ
ÑÐ¸Ð¿Ð¾ÑÐ°Ð·Ð¼ÐµÑ
ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ
Ð°Ð²ÑÐ¾Ð¼Ð°ÑÐ¸Ð·Ð°ÑÐ¸Ñ
Ð¾Ð±Ð¾ÑÑÐ´Ð¾Ð²Ð°Ð½Ð¸Ðµ
Ð·Ð°Ñ Ð²Ð°ÑÐ½Ð¾Ðµ ÑÑÑÑÐ¾Ð¹ÑÑÐ²Ð¾
Ð¿Ð»Ð¾ÑÐºÐ¸Ðµ Ð¿ÑÑÐ¶Ð¸Ð½Ñ
Ð¿ÑÐ¾Ð³Ð¸Ð± Ð¿ÑÑÐ¶Ð¸Ð½Ñ
ÑÐµÑ Ð½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¸Ð¹ Ð¿ÑÐ¾ÑÐµÑÑ
Ð¸ÑÐ¿Ð¾Ð»Ð½Ð¸ÑÐµÐ»ÑÐ½ÑÐ¹ Ð¼ÐµÑ Ð°Ð½Ð¸Ð·Ð¼
electronics
electronic components
soldered connections
solder pad dimensions
component
automation
machine
gripping device
flat springs
spring deflection
technological process
the executive mechanism

description: ÐÐ°Ð½Ð½Ð°Ñ ÑÐ°Ð±Ð¾ÑÐ° Ð¿Ð¾ÑÐ²ÑÑÐµÐ½Ð° Ð¸ÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ð¸Ñ Ð¿Ð¾Ð²ÑÑÐµÐ½Ð¸Ñ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´Ð¸ÑÐµÐ»ÑÐ½Ð¾ÑÑÐ¸ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¾Ð³Ð¾ Ð¿ÑÐ¾ÑÐµÑÑÐ° Ð»ÑÐ¶ÐµÐ½Ð¸Ñ. Ð Ð°ÑÑÐ¼Ð¾ÑÑÐµÐ½Ñ Ð¾ÑÐ½Ð¾Ð²Ð½ÑÐµ Ð½Ð°Ð¿ÑÐ°Ð²Ð»ÐµÐ½Ð¸Ñ Ð¸ ÑÑÐµÐ±Ð¾Ð²Ð°Ð½Ð¸Ñ Ð² ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸Ð¸ Ð»ÑÐ¶ÐµÐ½Ð¸Ðµ ÑÐ»ÐµÐºÑÑÐ¾Ð½Ð½ÑÑ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½ÑÐ¾Ð², ÑÐ¿Ð¾ÑÐ¾Ð±Ñ Ð¸ Ð¾Ð±Ð¾ÑÑÐ´Ð¾Ð²Ð°Ð½Ð¸Ðµ Ð´Ð»Ñ Ð»ÑÐ¶ÐµÐ½Ð¸Ñ. ÐÐ¾ÐºÐ°Ð·Ð°Ð½Ð° Ð°ÐºÑÑÐ°Ð»ÑÐ½Ð¾ÑÑÑ Ð¿Ð¾Ð²ÑÑÐµÐ½Ð¸Ñ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´Ð¸ÑÐµÐ»ÑÐ½Ð¾ÑÑÐ¸ Ð·Ð° ÑÑÐµÑ Ð°Ð²ÑÐ¾Ð¼Ð°ÑÐ¸Ð·Ð°ÑÐ¸Ð¸ Ð¿ÑÐ¾ÑÐµÑÑÐ°. ÐÐ¿ÑÐµÐ´ÐµÐ»ÐµÐ½Ñ ÑÑÐµÐ±Ð¾Ð²Ð°Ð½Ð¸Ñ Ð´Ð»Ñ Ð¾Ð±ÐµÑÐ¿ÐµÑÐµÐ½Ð¸Ñ ÐºÐ°ÑÐµÑÑÐ²Ð°. ÐÑÐ¿Ð¾Ð»ÑÐ·Ð¾Ð²Ð°Ð½ Ð»Ð¾Ð³Ð¸ÐºÐ¾-ÑÑÑÑÐºÑÑÑÐ½ÑÐ¹ Ð¿Ð¾Ð´ÑÐ¾Ð´ Ð´Ð»Ñ ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ¸ Ð¿ÑÐ¾ÐµÐºÑÐ°. Ð Ð°Ð·ÑÐ°Ð±Ð¾ÑÐ°Ð½ Ð¿ÑÐ¾ÐµÐºÑ Ð°Ð²ÑÐ¾Ð¼Ð°ÑÐ¸Ð·Ð¸ÑÐ¾Ð²Ð°Ð½Ð½Ð¾Ð³Ð¾ Ð¿ÑÐ¾Ð³ÑÐ°Ð¼Ð¼Ð½Ð¾-Ð°Ð¿Ð¿Ð°ÑÐ°ÑÐ½Ð¾Ð³Ð¾ ÐºÐ¾Ð¼Ð¿Ð»ÐµÐºÑÐ° Ð´Ð»Ñ Ð¿Ð¾Ð²ÑÑÐµÐ½Ð¸Ñ Ð¿ÑÐ¾Ð¸Ð·Ð²Ð¾Ð´Ð¸ÑÐµÐ»ÑÐ½Ð¾ÑÑÐ¸ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¾Ð³Ð¾ Ð¿ÑÐ¾ÑÐµÑÑÐ° Ð»ÑÐ¶ÐµÐ½Ð¸Ñ ÐºÐµÑÐ°Ð¼Ð¸ÑÐµÑÐºÐ¸Ñ ÐºÐ¾Ð½Ð´ÐµÐ½ÑÐ°ÑÐ¾ÑÐ¾Ð² Ð¿Ð¾Ð²ÐµÑÑÐ½Ð¾ÑÑÐ½Ð¾Ð³Ð¾ Ð¼Ð¾Ð½ÑÐ°Ð¶Ð°.Â Ð¡ Ð¾Ð¿Ð¾ÑÐ¾Ð¹ Ð½Ð° Ð°Ð½Ð°Ð»Ð¸Ð· ÑÐµÑÑÐµÐ¶Ð° Ð´ÐµÑÐ°Ð»Ð¸ Â«ÐÐ¾ÑÐ¿ÑÑ Ð·Ð°ÑÐ²Ð°ÑÐ°Â» ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐ°Ð½ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¸Ð¹ Ð¿ÑÐ¾ÑÐµÑÑ Ð¸Ð·Ð³Ð¾ÑÐ¾Ð²Ð»ÐµÐ½Ð¸Ñ Ð´ÐµÑÐ°Ð»Ð¸, ÑÑÐ¾ÑÐ¼Ð¸ÑÐ¾Ð²Ð°Ð½ ÐºÐ¾Ð¼Ð¿Ð»ÐµÐºÑ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¾Ð¹ Ð´Ð¾ÐºÑÐ¼ÐµÐ½ÑÐ°ÑÐ¸Ð¸. ÐÑÐ¾Ð²ÐµÐ´ÐµÐ½Ð° Ð¿Ð¾Ð´Ð³Ð¾ÑÐ¾Ð²ÐºÐ° Ð´Ð°Ð½Ð½ÑÑ Ð´Ð»Ñ ÑÐ°Ð·ÑÐ°Ð±Ð¾ÑÐºÐ¸ Ð·Ð°Ð¶Ð¸Ð¼Ð½Ð¾Ð³Ð¾ Ð¿ÑÐ¸ÑÐ¿Ð¾ÑÐ¾Ð±Ð»ÐµÐ½Ð¸Ñ Ð´Ð»Ñ ÑÐµÑÐ½Ð¾Ð»Ð¾Ð³Ð¸ÑÐµÑÐºÐ¾Ð³Ð¾ Ð¿ÑÐ¾ÑÐµÑÑÐ° Ð»ÑÐ¶ÐµÐ½Ð¸Ðµ ÐºÐ¾Ð½Ð´ÐµÐ½ÑÐ°ÑÐ¾ÑÐ¾Ð², Ð² ÑÐ°ÑÑÐ½Ð¾ÑÑÐ¸: Ð²ÑÐ±Ð¾Ñ Ð·Ð°Ð¶Ð¸Ð¼Ð½Ð¾Ð³Ð¾ ÑÑÑÑÐ¾Ð¹ÑÑÐ²Ð°, Ð¾Ð¿ÑÐµÐ´ÐµÐ»ÐµÐ½Ð° ÑÑÐµÐ¼Ð° Ð±Ð°Ð·Ð¸ÑÐ¾Ð²Ð°Ð½Ð¸Ñ Ð·Ð°Ð³Ð¾ÑÐ¾Ð²ÐºÐ¸, Ð¿ÑÐ¾Ð¸Ð·Ð²ÐµÐ´ÑÐ½ ÑÐ°ÑÑÑÑ ÑÑÐµÐ±ÑÐµÐ¼Ð¾Ð¹ ÑÐ¸Ð»Ñ Ð·Ð°ÑÐ²Ð°ÑÐ°, ÑÐ°ÑÑÐµÑ Ð¿Ð»Ð¾ÑÐºÐ¸Ñ Ð¿ÑÑÐ¶Ð¸Ð½ Ð´Ð»Ñ Ð¾Ð±ÐµÑÐ¿ÐµÑÐµÐ½Ð¸Ñ Ð½Ð°Ð´ÐµÐ¶Ð½Ð¾Ð³Ð¾ Ð·Ð°ÐºÑÐµÐ¿Ð»ÐµÐ½Ð¸Ñ. ÐÑÐ¾Ð¸Ð·Ð²ÐµÐ´ÐµÐ½ Ð²ÑÐ±Ð¾Ñ, Ð¾Ð±Ð¾ÑÐ½Ð¾Ð²Ð°Ð½Ð¸Ðµ Ð¸ ÑÐ°ÑÑÑÑ ÑÐ¸Ð»Ð¾Ð²Ð¾Ð³Ð¾ Ð¿ÑÐ¸Ð²Ð¾Ð´Ð°, Ð¿ÑÐ¸Ð²Ð¾Ð´ÑÑÐµÐ³Ð¾ Ð² Ð´ÐµÐ¹ÑÑÐ²Ð¸Ðµ Ð·Ð°Ð¶Ð¸Ð¼Ð½Ð¾Ðµ Ð¿ÑÐ¸ÑÐ¿Ð¾ÑÐ¾Ð±Ð»ÐµÐ½Ð¸Ðµ.
description: In the project approach to increase the productivity of technological process of tinning. The basic directions and requirements in technology tinning of electronic components, methods and equipment for tinning are considered. The problem of increasing productivity by automating the process is revealed. The logical-structural approach for project development was used. The project of automatic machine for increasing the productivity of the technological process of tinning of ceramic surface mount capacitors is developed. The technological process of manufacturing the part, a set of technological documentation was developed. Preparation of data for the development of clamping fixture for, in particular: the choice of clamping device, determined the scheme of fixing, the calculation of the required gripping force, calculation of flat springs to ensure reliable fixing. Selection, justification and calculation of the power drive driving the clamping device.